WO2023230867A1 - Appareil de reconnaissance d'empreintes digitales à ultrasons et dispositif électronique - Google Patents

Appareil de reconnaissance d'empreintes digitales à ultrasons et dispositif électronique Download PDF

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Publication number
WO2023230867A1
WO2023230867A1 PCT/CN2022/096320 CN2022096320W WO2023230867A1 WO 2023230867 A1 WO2023230867 A1 WO 2023230867A1 CN 2022096320 W CN2022096320 W CN 2022096320W WO 2023230867 A1 WO2023230867 A1 WO 2023230867A1
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WO
WIPO (PCT)
Prior art keywords
ultrasonic
fingerprint identification
detection chip
identification device
ultrasonic detection
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PCT/CN2022/096320
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English (en)
Chinese (zh)
Inventor
龙卫
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深圳市汇顶科技股份有限公司
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Priority to PCT/CN2022/096320 priority Critical patent/WO2023230867A1/fr
Publication of WO2023230867A1 publication Critical patent/WO2023230867A1/fr

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  • Embodiments of the present application relate to the field of fingerprint identification, and more specifically, to an ultrasonic fingerprint identification device and electronic equipment.
  • Ultrasonic fingerprint recognition can not only identify the surface morphology of fingerprints, but also identify signals from the dermal layer of the finger, thereby achieving natural 3D anti-counterfeiting. Compared with optical fingerprint recognition, ultrasonic fingerprint recognition has a higher impact on the cleanliness of the finger surface. Tolerance. Therefore, ultrasonic fingerprint recognition has gradually become a new generation of fingerprint recognition method. How to improve the packaging structure of the ultrasonic fingerprint recognition device to enhance its performance has become a problem that needs to be solved.
  • Embodiments of the present application provide an ultrasonic fingerprint identification device and electronic equipment, which have good performance.
  • an ultrasonic fingerprint identification device which is disposed under a display screen of an electronic device to realize under-screen ultrasonic fingerprint identification.
  • the ultrasonic fingerprint identification device includes: a reinforcing plate, and one side of the reinforcing plate is in contact with the screen.
  • the display screen is bonded, and an ultrasonic detection chip and a flexible circuit board are bonded to the other side of the reinforcing plate; the ultrasonic detection chip is provided with a piezoelectric sensor on one side away from the reinforcing plate.
  • Material layer and metal wiring layer The piezoelectric material layer is used to transmit ultrasonic signals to the finger above the display screen and receive the ultrasonic detection signal returned by the finger.
  • the ultrasonic detection signal is used for the ultrasonic detection chip. Obtain the fingerprint information of the finger; and, the flexible circuit board, the pads of the flexible circuit board and the pads of the metal wiring layer are electrically connected through welding wires to realize the ultrasonic detection chip and the flexible circuit board. Interconnections between circuit boards.
  • the ultrasonic fingerprint identification device is attached to the lower surface of the display screen in a back-attached manner. Contrary to the front-attached method, the ultrasonic detection chip in the ultrasonic fingerprint identification device is placed close to the display screen and the piezoelectric material layer is further away. Display settings.
  • the ultrasonic fingerprint recognition device includes a reinforcing plate and an ultrasonic detection chip. One side of the reinforcing plate is pasted on the display screen, and the other side is pasted with an ultrasonic detection chip and a flexible circuit board.
  • the reinforcing plate Since the reinforcing plate is bonded to the display screen, it has a certain strength and a large bonding area, thus reducing the warpage caused by the bonding of the ultrasonic fingerprint recognition device to the display screen and making it less likely to appear on the display screen. Appearance imprint. Since the ultrasonic detection signal returned by the finger passes through the piezoelectric material layer and reaches the air interface, it can be fully reflected back. In addition, the encapsulated stacked structure is relatively simple, thus reducing signal loss and improving the fingerprint recognition of the ultrasonic fingerprint recognition device. performance.
  • the metal wiring layer is a rewiring layer, and the pads of the flexible circuit board and the pads of the rewiring layer are electrically connected through the bonding wires. New pads are formed on the surface of the fingerprint recognition chip through rewiring to facilitate the electrical connection between the flexible circuit board and the ultrasonic detection chip.
  • the edge of the ultrasonic detection chip is provided with a step recessed toward the display screen, and the rewiring layer is provided within the step to form a step for connecting the flexible Circuit board pads.
  • the depth of the steps may be less than or equal to 100um, for example.
  • the height of the bonding wires between the pads of the flexible circuit board and the pads of the rewiring layer is reduced to avoid the height of the bonding wires exceeding the piezoelectric material layer. Taking up extra space, the overall thickness of the ultrasonic fingerprint recognition device is reduced, and the internal space of the electronic device is saved.
  • the bonding wire is covered with protective glue to ensure safety.
  • the reinforcing plate is made of stainless steel or acrylic to ensure a certain bearing capacity and minimize the impact on signal transmission.
  • the thickness of the piezoelectric material layer is less than or equal to 50um. While meeting the needs of ultrasonic transmission and reception, it reduces the overall thickness of the ultrasonic fingerprint recognition device and saves the internal space of the electronic device.
  • the reinforcing plate and the display screen are bonded through a first adhesive film
  • the thickness of the first adhesive film is less than or equal to 50um
  • the thickness of the first adhesive film is The acoustic resistance coefficient is greater than or equal to 4.
  • the first adhesive film is a chip bonding film or epoxy resin, thereby ensuring good bonding ability without increasing the thickness of the module and reducing the impact on signal transmission.
  • the ultrasonic detection chip and the reinforcing plate are bonded through a second adhesive film, and/or the flexible circuit board and the reinforcing plate are bonded through a third adhesive film. bonding.
  • the flexible circuit board is annular, and the ultrasonic detection chip is pasted on the surface of the reinforcing plate located within the annular opening.
  • the annular flexible circuit board increases the fixed area between it and the reinforcing board, making the flexible circuit board less likely to move to ensure that the welding wires will not be pulled and damaged or cause safety issues.
  • the piezoelectric material layer is provided with a first electrode on its surface close to the ultrasonic detection chip, and a second electrode is provided on its surface far away from the ultrasonic detection chip.
  • the second electrode is made of a plurality of An electrode array composed of three electrodes, the first electrode and the second electrode are electrically connected to the ultrasonic detection chip.
  • the bonding wire is covered with protective glue, and the top surface of the protective glue is lower than the top surface of the second electrode.
  • the piezoelectric material layer is formed of at least one of the following materials: polyvinylidene fluoride, polyvinylidene fluoride-trifluoroethylene copolymer, barium titanate series, lead zirconate titanate Binary system and adding a third ABO3 type compound to the binary system, where A represents a divalent metal ion, B represents a tetravalent metal ion or the sum of several ions is positive tetravalent.
  • an electronic device including: a display screen; and an ultrasonic fingerprint recognition device according to the first aspect or any implementation of the first aspect.
  • Figure 1 is a schematic block diagram of an ultrasonic fingerprint identification device according to an embodiment of the present application.
  • FIG. 2 is a schematic diagram of a possible specific structure of the ultrasonic fingerprint identification device shown in FIG. 1 .
  • FIG. 3 is a schematic diagram of another possible specific structure of the ultrasonic fingerprint identification device shown in FIG. 1 .
  • Figure 4 is a schematic diagram of an electronic device according to an embodiment of the present application.
  • the ultrasonic fingerprint recognition device includes an ultrasonic detection chip, a piezoelectric material layer, and an FPC connected to the ultrasonic detection chip.
  • the ultrasonic detection chip is an Application Specific Integrated Circuit (ASIC) used for ultrasonic fingerprint recognition, such as a CMOS chip.
  • ASIC Application Specific Integrated Circuit
  • the two surfaces of the piezoelectric material layer are respectively provided with first electrodes and second electrodes.
  • the ultrasonic detection chip can output an excitation signal and load it to the first electrode and the second electrode. Under the action of the excitation signal, based on the piezoelectric effect, The piezoelectric material layer vibrates, thereby emitting ultrasonic signals to the finger above the display screen.
  • the ultrasonic signals are transmitted to the surface of the finger, are emitted or scattered at the fingerprint valleys and fingerprint ridges, and return ultrasonic detection signals.
  • the ultrasonic detection signal is transmitted to the piezoelectric material layer. Based on the inverse piezoelectric effect, a potential difference is generated between the first electrode and the second electrode, and a corresponding electrical signal is obtained.
  • the ultrasonic detection chip processes the signal to obtain fingerprint information of the finger.
  • the ultrasonic fingerprint recognition device is pasted under the display screen to achieve under-screen ultrasonic fingerprint recognition.
  • the ultrasonic fingerprint recognition device is pasted under the display screen in a front-facing manner.
  • the ultrasonic detection chip and the flexible circuit board are pasted on the upper surface of the substrate.
  • the ultrasonic detection chip and the flexible circuit board are interconnected so that the signal of the ultrasonic detection chip can be Output via flexible circuit board.
  • the upper surface of the ultrasonic detection chip is a piezoelectric material layer, and the piezoelectric material layer is attached to the lower surface of the display screen.
  • the ultrasonic fingerprint recognition device is prone to warping after being attached to the display screen, and it is easy to show appearance marks on the display screen.
  • due to the complex laminate structure it may affect the transmission of ultrasonic signals and affect ultrasonic fingerprint recognition. Device performance.
  • embodiments of the present application provide an ultrasonic fingerprint identification device.
  • the ultrasonic fingerprint identification device is pasted under the display screen in a back-stick manner, which can reduce the warpage caused by the ultrasonic fingerprint identification device and the display screen being bonded, making it difficult to Appearance imprints are presented on the display screen, and the loss of ultrasonic signals is reduced through a well-designed stacked structure to improve the performance of the ultrasonic fingerprint recognition device.
  • FIG. 1 is a schematic block diagram of an ultrasonic fingerprint identification device 200 according to an embodiment of the present application.
  • the display screen 100 includes a light-emitting panel and a cover plate above it.
  • the ultrasonic fingerprint recognition device 200 can be disposed below the display screen 100 of the electronic device, for example, below a light-emitting panel of the display screen 100 such as an Active Matrix Organic Light Emitting Diode (AMOLED) panel, or Under the cover of the display screen 100, in order to realize under-screen ultrasonic fingerprint recognition.
  • AMOLED Active Matrix Organic Light Emitting Diode
  • the ultrasonic fingerprint recognition device 200 includes a reinforcing plate 210 , an ultrasonic detection chip 220 and a flexible printed circuit (FPC) 230 .
  • FPC flexible printed circuit
  • one side of the reinforcing plate 210 is bonded to the display screen 100, and the other side of the reinforcing plate 210 is bonded with the ultrasonic detection chip 220 and the FPC 230.
  • the side of the ultrasonic detection chip 220 away from the reinforcing plate 210 is provided with a piezoelectric material layer 221 and a metal wiring layer 222.
  • the piezoelectric material layer 221 is used to transmit ultrasonic signals to the finger above the display screen 100 and receive the ultrasonic signal returned by the finger.
  • the ultrasonic detection signal is used by the ultrasonic detection chip 220 to obtain the fingerprint information of the finger.
  • the bonding pads of the FPC 230 and the bonding pads of the metal wiring layer 222 are electrically connected through bonding wires to realize interconnection between the ultrasonic detection chip 220 and the FPC 230.
  • the ultrasonic fingerprint identification device 200 is attached to the lower surface of the display screen 100 in a back-attached manner. Contrary to the front-attached method, the ultrasonic detection chip 220 in the ultrasonic fingerprint identification device 200 is placed close to the display screen 10 and The piezoelectric material layer 221 is disposed away from the display screen 100 .
  • the ultrasonic fingerprint identification device 200 includes a reinforcing plate 210 and an ultrasonic detection chip 220. One side of the reinforcing plate 210 is adhered to the display screen 100, and the other side is adhered to the ultrasonic detection chip 220 and FPC 230.
  • the reinforcing plate 210 Since the reinforcing plate 210 is bonded to the display screen 100, it has a certain strength and has a large bonding area. Therefore, the warpage generated after the ultrasonic fingerprint recognition device 200 and the display screen 100 are bonded is reduced, making it less likely to Appearance imprints appear on the display screen 100 . Since the ultrasonic detection signal returned by the finger passes through the piezoelectric material layer 221 and reaches the air interface, it can be fully reflected back. In addition, the encapsulated stacked structure is relatively simple, so the signal loss is reduced and the performance of the ultrasonic fingerprint identification device 200 is improved. Fingerprint recognition performance.
  • the ultrasonic fingerprint identification device according to the embodiment of the present application will be described in detail with reference to FIGS. 2 and 3 .
  • the upper part in FIGS. 2 and 3 is the lower part of the display screen 110 .
  • the ultrasonic fingerprint recognition device 200 is disposed below the display screen 110, that is, above FIG. 2 and FIG. 3, to realize under-screen ultrasonic fingerprint recognition.
  • the ultrasonic fingerprint recognition device 200 includes a reinforcing plate 210, an ultrasonic detection chip 220 and an FPC 230.
  • the reinforcing plate 210 is pasted on the lower surface of the display screen 110 .
  • the surface of the reinforcing plate 210 away from the display screen 100 is the ultrasonic detection chip 220 and the FPC 230.
  • the side of the ultrasonic detection chip 220 away from the reinforcing plate 210 is the piezoelectric material layer 221 and the metal wiring layer 222.
  • the metal wiring layer 222 is used to electrically connect with the FPC 230 to achieve signal transmission.
  • the material of the reinforcing plate 210 is, for example, stainless steel, acrylic, glass, plastic, or ceramic, which can be selected based on needs to ensure a certain carrying capacity and minimize the impact on signal transmission.
  • the reinforcing plate 210 is directly attached to the display screen 100 and is not prone to warping to avoid appearance marks on the display screen 100 .
  • the warpage is usually less than 30um.
  • the piezoelectric material layer 221 may be formed of, for example, polyvinylidene fluoride (PVDF) or polyvinylidene fluoride-trifluoroethylene copolymer (PVDF-TrFE); or, it may also be formed of lead zirconate titanate (PZT) or its relatives.
  • PVDF polyvinylidene fluoride
  • PVDF-TrFE polyvinylidene fluoride-trifluoroethylene copolymer
  • PZT lead zirconate titanate
  • Materials such as barium titanate series, lead zirconate titanate binary system are formed by adding a third ABO3 type compound to the binary system, where A represents a divalent metal ion, B represents a tetravalent metal ion or the sum of several ions is Positive price.
  • a first electrode 2211 is provided on the surface of the piezoelectric material layer 221 close to the ultrasonic detection chip 220
  • a second electrode 2212 is provided on the surface far away from the ultrasonic detection chip 220 .
  • the first electrode 2211 and the second electrode 2212 are electrically connected to the ultrasonic detection chip 220 .
  • the first electrode 2211 is, for example, a planar electrode formed on the surface of the piezoelectric material layer 221 by sputtering or the like
  • the second electrode 2212 is, for example, an electrode array composed of a plurality of electrodes.
  • the material of the first electrode 2211 may be, for example, Al
  • the material of the second electrode 2212 may be, for example, Ag.
  • the ultrasonic detection signal returned by the finger will generate an electrical signal between the first electrode 2211 and each electrode in the electrode array.
  • the electrical signal corresponding to each electrode can be used as the pixel value of a pixel in the fingerprint pattern of the finger.
  • the ultrasonic detection chip 220 includes a sensor circuit module.
  • the surface of the sensor circuit module is a piezoelectric material layer 221 and a metal wiring layer 222.
  • the sensor circuit module is electrically connected to the first electrode 2211, the second electrode 2212 and the metal wiring layer 222.
  • the metal wiring layer The layer 222 leads out the electrical signal generated by the ultrasonic detection chip 220 through the FPC 230.
  • the ultrasonic detection chip 220 and the FPC 230 are pasted on the surface of the reinforcing plate 210, the metal wiring layer 222 is located on the surface of the ultrasonic detection chip 220 away from the reinforcing plate 210, and the FPC 230 It is electrically connected to the metal wiring layer 222 on the surface of the ultrasonic detection chip 220 through bonding wires 223 .
  • the metal wiring layer 222 is a (Redistribution Layer, RDL) layer 222, and the pads of the FPC 230 and the pads of the RDL layer 222 are electrically connected through bonding wires 223.
  • RDL Resource Layer
  • the position, number or width of the circuit contacts (I/O pads) of the ultrasonic detection chip 220 can be changed, so that the ultrasonic detection chip 220 can be adapted to different packaging methods.
  • the RDL layer 222 By properly designing the RDL layer 222, a higher number of nodes and a thinner packaging structure can be achieved.
  • the bonding pad of the FPC 230 and the bonding pad of the RDL layer 222 are electrically connected through the bonding wire 223, the difficulty of the process operation is reduced, and the interconnection between the FPC 230 and the ultrasonic detection chip 220 is facilitated.
  • the edge of the ultrasonic detection chip 220 is provided with a step 225 that is recessed toward the display screen 100 , and the RDL layer 222 is provided within the step 225 to form an FPC for connecting to the step 225 .
  • 230 pad The FPC 230 is electrically connected to the RDL layer 222 on the surface of the ultrasonic detection chip 220 through a bonding wire 223.
  • the step 225 may be formed by trenching, laser or etching, for example.
  • the height of the bonding line 223 between the bonding pad of the FPC 230 and the bonding pad of the RDL layer 222 is reduced to avoid the bonding line 223.
  • the height exceeds the piezoelectric material layer 221 and occupies additional space, thereby reducing the overall thickness of the ultrasonic fingerprint recognition device 200 and saving the internal space of the electronic device.
  • the depth of the depression of the step 223 may be less than or equal to 100um, for example.
  • the welding wire 223 is covered with protective glue 224 to prevent short circuit and the like.
  • the top surface of the protective glue 224 is lower than the top surface of the second electrode 2212 to reduce the thickness of the ultrasonic fingerprint recognition device 200 .
  • the pads of the FPC 230 and the pads of the metal wiring layer 222 can be electrically connected through the WB process using gold wires, and glue (Glue) is used to protect the gold wires.
  • glue Glue
  • the thickness of the piezoelectric material layer 221 is, for example, less than or equal to 50 ⁇ m, which not only meets the requirements for ultrasonic transmission and reception, but also reduces the overall thickness of the ultrasonic fingerprint recognition device 200 and saves the internal space of the electronic device.
  • the reinforcing plate 210 and the display screen 100 are bonded through a first adhesive film 301 .
  • the first adhesive film 301 is a die attach film DAF or a ring. Oxygen resin.
  • the thickness of the first adhesive film 301 is less than or equal to 50um, and/or the acoustic resistance coefficient of the first adhesive film 301 is greater than or equal to 4, thereby ensuring good bonding ability without increasing the thickness of the ultrasonic fingerprint recognition device 200, and at the same time Reduce the impact on signal transmission.
  • the ultrasonic detection chip 220 and the reinforcing plate 210 are connected through a second adhesive film 302, and have good electrical conductivity between them. , to ensure a better electrostatic discharge circuit and obtain better electrostatic test results.
  • the second glue film 302 may be the same as the first glue film 301.
  • the second glue film 302 is DAF or epoxy resin.
  • the thickness of the second adhesive film 302 is less than or equal to 50um, and/or the acoustic resistance coefficient of the second adhesive film 302 is greater than or equal to 4, thereby ensuring good bonding ability without increasing the thickness of the ultrasonic fingerprint recognition device 200, and at the same time Reduce the impact on signal transmission.
  • the first adhesive film 301 and the second adhesive film 302 should also match the silicon-based material as much as possible, have good consistency and uniformity, and be free of impurities such as bubbles. This ensures the consistency of signal transmission, reduces the impact on signal transmission, and improves the performance of fingerprint recognition.
  • the FPC 230 and the reinforcing plate 210 can be bonded through a third adhesive film (Adhesive) to increase the bonding force between the FPC 230 and the reinforcing plate 210, making the FPC 230 less likely to move, and ensuring that the welding wire 223 does not As a result, it may be pulled and damaged or cause safety problems.
  • the third adhesive film between the FPC 230 and the reinforcing plate 210 is not shown in Figures 2 and 3.
  • the FPC 230 can be annular, and the ultrasonic detection chip 220 is pasted on the surface of the reinforcing plate 210 located within the annular opening.
  • the annular opening is used to accommodate the ultrasonic detection chip 220, so that the FPC 230 surrounds the ultrasonic detection chip 220.
  • the annular FPC 230 is pasted on the reinforcement plate 210, and the ultrasonic detection chip 220 is pasted on the surface of the reinforcement plate 210 located within the annular opening.
  • the use of the annular FPC 230 increases the fixed area between the FPC 230 and the reinforcing plate 210, making the FPC 230 less likely to move to ensure that the bonding wire 223 will not be pulled and damaged or cause safety problems.
  • the ultrasonic fingerprint identification device 200 in the embodiment of the present application is attached to the lower surface of the display screen 100 in a back-to-back manner.
  • the ultrasonic fingerprint identification device 200 includes a reinforcing plate 210 and an ultrasonic detection chip 220.
  • the reinforcing One side of the board 210 is attached to the display screen 100, and the other side is the ultrasonic detection chip 220 and the FPC 230. Since the reinforcing plate 210 is bonded to the display screen 100, it has a certain strength and has a large bonding area. Therefore, the warpage generated after the ultrasonic fingerprint recognition device 200 and the display screen 100 are bonded is reduced, making it less likely to Appearance imprints appear on the display screen 100 .
  • the ultrasonic detection signal returned by the finger passes through the piezoelectric material layer 221 and reaches the air interface, it can be fully reflected back.
  • the encapsulated stacked structure is relatively simple, so the signal loss is reduced and the performance of the ultrasonic fingerprint identification device 200 is improved. Fingerprint recognition performance.
  • This packaging method not only reduces the complexity of the packaging structure, but also avoids the appearance marks left on the surface of the display screen 100 after the ultrasonic fingerprint recognition device 200 is attached to the display screen 100. It has less impact on the appearance of the electronic device and reduces the cost. Signal loss is eliminated, and the fingerprint recognition performance of the ultrasonic fingerprint recognition device 200 is improved.
  • the above-mentioned ultrasonic fingerprint recognition device 200 is also suitable for being attached directly below the display screen 100 , that is, the display screen 100 in FIG. 2 and FIG. 3 is moved to the side of the piezoelectric material layer 221 so that the piezoelectric material layer 221 Fitted with the display screen 100 .
  • the bonding wire 223 or its protective glue 224 it is necessary to ensure that the maximum height of the bonding wire 223 is smaller than the piezoelectric material layer 221, so that there is enough space between the bonding wire 223 position and the display screen 100.
  • the gap for example, can be provided with a step 223 as shown in FIG. 3 to reduce the height of the bonding wire 223.
  • the electronic device 300 includes a display screen 100; and the above-mentioned ultrasonic fingerprint recognition device 200.
  • the ultrasonic fingerprint identification device 200 is bonded below the display screen 100 through the first adhesive film 301.
  • the reinforcing plate 210 of the ultrasonic fingerprint identification device 200 and the display screen 100 are bonded through the first adhesive film 301. Therefore, the ultrasonic fingerprint recognition device 200 is disposed below the display screen 100 to realize under-screen ultrasonic fingerprint recognition.
  • the electronic device in the embodiment of the present application may be a portable or mobile computing device such as a terminal device, a mobile phone, a tablet computer, a notebook computer, a desktop computer, a gaming device, a vehicle-mounted electronic device or a wearable smart device, and Electronic databases, cars, bank automated teller machines (Automated Teller Machine, ATM) and other electronic equipment.
  • the wearable smart devices include devices that are full-featured, large in size, and can realize complete or partial functions without relying on smartphones, such as smart watches or smart glasses, as well as devices that only focus on a certain type of application function and require integration with other devices such as smartphones.
  • Equipment used in conjunction with it such as various smart bracelets, smart jewelry and other equipment for physical sign monitoring.
  • the systems, devices and methods disclosed in the embodiments of this application can be implemented in other ways. For example, some features of the method embodiments described above may be omitted or not performed.
  • the device embodiments described above are only illustrative, and the division of units is only a logical function division. In actual implementation, there may be other divisions, and multiple units or components may be combined or integrated into another system.
  • the coupling between units or the coupling between components may be direct coupling or indirect coupling, and the above-mentioned coupling includes electrical, mechanical or other forms of connection.

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Abstract

La présente invention concerne un appareil de reconnaissance d'empreintes digitales à ultrasons et un dispositif électronique, qui ont de bonnes performances. L'appareil de reconnaissance d'empreintes digitales ultrasonore est disposé au-dessous d'un écran d'affichage de façon à obtenir une reconnaissance d'empreintes digitales ultrasonore sous-écran, et comprend : une plaque de renforcement, une surface de la plaque de renforcement étant liée à l'écran d'affichage, et l'autre surface de la plaque de renforcement étant liée à une puce de détection ultrasonore et à un FPC ; le côté de la puce de détection ultrasonore à l'opposé de la plaque de renforcement est pourvu d'une couche de matériau piézoélectrique et d'une couche de câblage métallique ; la couche de matériau piézoélectrique est utilisée pour transmettre un signal ultrasonore à un doigt situé au-dessus de l'écran d'affichage et pour recevoir un signal de détection ultrasonore renvoyé par le doigt, et le signal de détection ultrasonore est utilisé pour permettre à la puce de détection ultrasonore d'obtenir des informations d'empreinte digitale du doigt ; un plot de liaison du FPC est électriquement connecté à un plot de liaison de la couche de câblage métallique par l'intermédiaire d'un fil de liaison, ce qui permet d'obtenir une interconnexion entre la puce de détection ultrasonore et le FPC.
PCT/CN2022/096320 2022-05-31 2022-05-31 Appareil de reconnaissance d'empreintes digitales à ultrasons et dispositif électronique WO2023230867A1 (fr)

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PCT/CN2022/096320 WO2023230867A1 (fr) 2022-05-31 2022-05-31 Appareil de reconnaissance d'empreintes digitales à ultrasons et dispositif électronique

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN206992151U (zh) * 2017-07-13 2018-02-09 杭州士兰微电子股份有限公司 超声波传感器组件
CN211698983U (zh) * 2020-03-06 2020-10-16 南昌欧菲生物识别技术有限公司 可穿戴设备
CN113177492A (zh) * 2021-05-08 2021-07-27 江西欧迈斯微电子有限公司 超声波指纹识别组件和智能终端

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN206992151U (zh) * 2017-07-13 2018-02-09 杭州士兰微电子股份有限公司 超声波传感器组件
CN211698983U (zh) * 2020-03-06 2020-10-16 南昌欧菲生物识别技术有限公司 可穿戴设备
CN113177492A (zh) * 2021-05-08 2021-07-27 江西欧迈斯微电子有限公司 超声波指纹识别组件和智能终端

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