WO2023229229A1

WO2023229229A1 - Electronic device comprising component bracket having heat radiation pattern formed thereon

Info

Publication number: WO2023229229A1
Application number: PCT/KR2023/005187
Authority: WO
Inventors: 강효성; 성해원
Original assignee: 삼성전자 주식회사
Priority date: 2022-05-23
Filing date: 2023-04-17
Publication date: 2023-11-30

Abstract

An electronic device according to various embodiments of the present disclosure comprises: a housing; a component bracket arranged in the housing, the component bracket having a first recess formed in a first surface facing a first direction, and a second recess that is spaced apart from the first recess and is formed adjacent to an edge of the housing; a heat-generation source which is seated in the second recess and is arranged so that a plurality of surfaces thereof are surrounded by the component bracket; and a circuit board comprising a first portion seated in the first recess, and a second portion which extends from one end of the first portion and is inserted into the second recess so as to be electrically connected to the heat-generation source. The component bracket may comprise a first heat radiation pattern formed on a second surface that is opposite to the first surface, and a second heat radiation pattern formed on a third surface which is perpendicular to the first surface, is adjacent to the heat-generation source, and faces the edge of the housing.

Description

Electronic device including a component bracket with a heat dissipation pattern formed

Various embodiments of the present disclosure relate to a component bracket on which a heat dissipation pattern is formed and an electronic device including the same.

Thanks to the remarkable development of information and communication technology and semiconductor technology, the distribution and use of various electronic devices is rapidly increasing. Electronic devices are being developed so that they can be carried around and used for communication.

Electronic devices refer to devices that perform specific functions according to installed programs, such as home appliances, electronic notebooks, portable multimedia players, mobile communication terminals, tablet PCs, video/audio devices, desktop/laptop computers, or vehicle navigation devices. It can mean a device. For example, these electronic devices can output stored information as sound or video. As the degree of integration of electronic devices increases and high-speed, high-capacity wireless communication becomes more common, various functions can be installed in a single electronic device, such as a mobile communication terminal. For example, in addition to communication functions, entertainment functions such as games, multimedia functions such as music/video playback, communication and security functions such as mobile banking, and functions such as schedule management and electronic wallet are integrated into one electronic device. will be. These electronic devices are being miniaturized so that users can conveniently carry them.

Recently, due to the miniaturization and thinning of portable electronic devices such as smartphones, and the demand for high integration and high performance, such as application of the latest antenna-related technology, a lot of heat can be generated in portable electronic devices and the heat density can increase. Accordingly, various heat diffusion structures are required to efficiently dissipate heat generated from heat sources inside electronic devices.

In general, electronic devices may include electrical components that generate heat, such as millimeter (mmW) antenna structures, speakers, and cameras. The electrical components in electronic devices have weak rigidity, so they may be deformed by impact during the process. For example, the connector for electrically connecting the electrical components may be lifted and/or distorted, and the quality of the electronic device may be deteriorated due to deformation of the exterior. Additionally, as the electrical components generate a lot of heat, performance may deteriorate.

According to various embodiments of the present disclosure, a robust structure can be implemented by placing electrical components and/or circuit boards within a component bracket (eg, case) and integrating the assembly structure. Additionally, efficient heat dissipation performance can be provided by improving the surface pattern and material of the component bracket.

An electronic device according to various embodiments of the present disclosure includes a housing, a component bracket disposed within the housing, a first recess formed on a first surface facing a first direction, and an edge of the housing spaced apart from the first recess. a component bracket including a second recess formed adjacent thereto, a heat source seated in the second recess and disposed so that a plurality of surfaces are surrounded by the component bracket, and a first portion seated in the first recess, and a circuit board including a second part extending from one end of the first part, inserted into the second recess, and electrically connected to the heat source. The component bracket includes a first heat dissipation pattern formed on a second side opposite to the first side, and a second heat dissipation pattern formed on a third side perpendicular to the first side, adjacent to the heat source, and facing an edge of the housing. Can contain patterns.

An electronic device according to various embodiments of the present disclosure includes a housing, a component bracket disposed within the housing, a first recess formed on a first surface facing a first direction, and an edge of the housing spaced apart from the first recess. a component bracket including a second recess formed adjacent thereto, an antenna module seated in the second recess and including an array of a plurality of antenna elements facing in a second direction perpendicular to the first direction, and the first It may include a circuit board including a first part seated in a recess, and a second part extending from the first part and inserted into the second recess and electrically connected to the antenna module. The component bracket has a first heat dissipation pattern formed on a second side opposite to the first side, and a third side perpendicular to the first side, adjacent to the plurality of conductive plates, and facing an edge of the housing. It may include a formed second heat dissipation pattern.

Electronic devices according to various embodiments of the present disclosure may provide an integrated electrical component assembly by arranging electrical components such as electrical components and/or circuit boards within a component bracket (eg, case).

Electronic devices according to various embodiments of the present disclosure implement an integrated electrical component assembly and can provide a sturdy structure that does not cause defects such as deformation or lifting due to external impact.

Electronic devices according to various embodiments of the present disclosure form a pattern for heat dissipation on a component bracket on which a heat source is placed, improve heat dissipation performance by applying a material with high thermal conductivity, and provide a separate additional space for a heat dissipation member. Space efficiency can be secured by eliminating this need.

However, the problem to be solved by the present disclosure is not limited to the above-mentioned problems, and may be expanded in various ways without departing from the spirit and scope of the present disclosure.

1 is a block diagram of an electronic device in a network environment, according to various embodiments.

2 is a front perspective view of an electronic device, according to various embodiments of the present disclosure.

FIG. 3A is a diagram illustrating a housing in which an electrical component assembly is disposed, according to various embodiments of the present disclosure.

FIG. 3B is an enlarged view of a portion of FIG. 3A according to various embodiments of the present disclosure.

Figure 3C is an enlarged perspective view of an electrical component assembly disposed in a housing according to various embodiments of the present disclosure.

4 is an exploded perspective view of an electrical component assembly, according to various embodiments of the present disclosure.

5 is a front view of an electrical component assembly facing the front, according to various embodiments of the present disclosure.

6 is a perspective view showing the front of an electrical component assembly according to various embodiments of the present disclosure.

7 is a perspective view showing the rear of an electrical component assembly according to various embodiments of the present disclosure.

Figure 8 is a perspective view showing the front of an electrical component assembly according to various embodiments of the present disclosure.

9 is a perspective view showing the rear of an electrical component assembly according to various embodiments of the present disclosure.

Figure 10 is a cross-sectional view showing an electrical component assembly disposed in a housing according to various embodiments of the present disclosure.

Figure 11A is a perspective view showing an electrical component assembly according to various embodiments of the present disclosure.

FIG. 11B is a cross-sectional view showing an electrical component assembly disposed in a housing according to various embodiments of the present disclosure.

FIG. 12A is a diagram illustrating a rear surface of a display and a circuit board disposed on the rear surface of the display, according to various embodiments of the present disclosure.

FIG. 12B is a diagram illustrating a rear surface of a display and a component bracket disposed on the rear surface of the display, according to various embodiments of the present disclosure.

1 is a block diagram of an electronic device in a network environment, according to various embodiments of the present disclosure.

Referring to FIG. 1, in the network environment 100, the electronic device 101 communicates with the electronic device 102 through a first network 198 (e.g., a short-range wireless communication network) or a second network 199. It is possible to communicate with the electronic device 104 or the server 108 through (e.g., a long-distance wireless communication network). According to one embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108. According to one embodiment, the electronic device 101 includes a processor 120, a memory 130, an input module 150, an audio output module 155, a display module 160, an audio module 170, and a sensor module ( 176), interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196 , or may include an antenna module 197. In some embodiments, at least one of these components (eg, the connection terminal 178) may be omitted or one or more other components may be added to the electronic device 101. In some embodiments, some of these components (e.g., sensor module 176, camera module 180, or antenna module 197) are integrated into one component (e.g., display module 160). It can be.

The processor 120, for example, executes software (e.g., program 140) to operate at least one other component (e.g., hardware or software component) of the electronic device 101 connected to the processor 120. It can be controlled and various data processing or calculations can be performed. According to one embodiment, as at least part of data processing or computation, the processor 120 stores instructions or data received from another component (e.g., sensor module 176 or communication module 190) in volatile memory 132. The commands or data stored in the volatile memory 132 can be processed, and the resulting data can be stored in the non-volatile memory 134. According to one embodiment, the processor 120 is a main processor 121 (e.g., a central processing unit or an application processor), or an auxiliary processor 123 that can operate independently or together (e.g., a graphics processing unit, a neural network processing unit). (NPU: neural processing unit), image signal processor, sensor hub processor, or communication processor). For example, when the electronic device 101 includes a main processor 121 and a co-processor 123, the co-processor 123 is set to use less power than the main processor 121 or to be specialized for a designated function. It can be. The auxiliary processor 123 may be implemented separately from the main processor 121 or as part of it.

The auxiliary processor 123 may, for example, act on behalf of the main processor 121 while the main processor 121 is in an inactive (e.g., sleep) state, or while the main processor 121 is in an active (e.g., application execution) state. ), together with the main processor 121, at least one of the components of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190) At least some of the functions or states related to can be controlled. According to one embodiment, coprocessor 123 (e.g., image signal processor or communication processor) may be implemented as part of another functionally related component (e.g., camera module 180 or communication module 190). there is. According to one embodiment, the auxiliary processor 123 (eg, neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. Artificial intelligence models can be created through machine learning. For example, such learning may be performed in the electronic device 101 itself, where artificial intelligence is performed, or may be performed through a separate server (e.g., server 108). Learning algorithms may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but It is not limited. An artificial intelligence model may include multiple artificial neural network layers. Artificial neural networks include deep neural network (DNN), convolutional neural network (CNN), recurrent neural network (RNN), restricted boltzmann machine (RBM), belief deep network (DBN), bidirectional recurrent deep neural network (BRDNN), It may be one of deep Q-networks or a combination of two or more of the above, but is not limited to the examples described above. In addition to hardware structures, artificial intelligence models may additionally or alternatively include software structures.

The memory 130 may store various data used by at least one component (eg, the processor 120 or the sensor module 176) of the electronic device 101. Data may include, for example, input data or output data for software (e.g., program 140) and instructions related thereto. Memory 130 may include volatile memory 132 or non-volatile memory 134.

The program 140 may be stored as software in the memory 130 and may include, for example, an operating system 142, middleware 144, or application 146.

The input module 150 may receive commands or data to be used in a component of the electronic device 101 (e.g., the processor 120) from outside the electronic device 101 (e.g., a user). The input module 150 may include, for example, a microphone, mouse, keyboard, keys (eg, buttons), or digital pen (eg, stylus pen).

The sound output module 155 may output sound signals to the outside of the electronic device 101. The sound output module 155 may include, for example, a speaker or a receiver. Speakers can be used for general purposes such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part of it.

The display module 160 can visually provide information to the outside of the electronic device 101 (eg, a user). The display module 160 may include, for example, a display, a hologram device, or a projector, and a control circuit for controlling the device. According to one embodiment, the display module 160 may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of force generated by the touch.

The audio module 170 can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module 170 acquires sound through the input module 150, the sound output module 155, or an external electronic device (e.g., directly or wirelessly connected to the electronic device 101). Sound may be output through an electronic device 102 (e.g., speaker or headphone).

The sensor module 176 detects the operating state (e.g., power or temperature) of the electronic device 101 or the external environmental state (e.g., user state) and generates an electrical signal or data value corresponding to the detected state. can do. According to one embodiment, the sensor module 176 includes, for example, a gesture sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, It may include a temperature sensor, humidity sensor, or light sensor.

The interface 177 may support one or more designated protocols that can be used to connect the electronic device 101 directly or wirelessly with an external electronic device (eg, the electronic device 102). According to one embodiment, the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

The connection terminal 178 may include a connector through which the electronic device 101 can be physically connected to an external electronic device (eg, the electronic device 102). According to one embodiment, the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).

The haptic module 179 can convert electrical signals into mechanical stimulation (e.g., vibration or movement) or electrical stimulation that the user can perceive through tactile or kinesthetic senses. According to one embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

The camera module 180 can capture still images and moving images. According to one embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.

The power management module 188 can manage power supplied to the electronic device 101. According to one embodiment, the power management module 188 may be implemented as at least a part of, for example, a power management integrated circuit (PMIC).

The battery 189 may supply power to at least one component of the electronic device 101. According to one embodiment, the battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

The communication module 190 provides a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (e.g., the electronic device 102, the electronic device 104, or the server 108). It can support establishment and communication through established communication channels. Communication module 190 operates independently of processor 120 (e.g., an application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module 190 may be a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., : LAN (local area network) communication module, or power line communication module) may be included. Among these communication modules, the corresponding communication module is a first network 198 (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network 199 (e.g., legacy It can communicate with external electronic devices through telecommunication networks such as cellular networks, 5G networks, next-generation communication networks, the Internet, or computer networks (e.g., LAN or WAN). These various types of communication modules may be integrated into one component (e.g., a single chip) or may be implemented as a plurality of separate components (e.g., multiple chips). The wireless communication module 192 uses subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 to communicate within a communication network such as the first network 198 or the second network 199. The electronic device 101 can be confirmed or authenticated.

The wireless communication module 192 may support 5G networks after 4G networks and next-generation communication technologies, for example, NR access technology (new radio access technology). NR access technology provides high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and access to multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low latency). -latency communications)) can be supported. The wireless communication module 192 may support high frequency bands (eg, mmWave bands), for example, to achieve high data rates. The wireless communication module 192 uses various technologies to secure performance in high frequency bands, for example, beamforming, massive array multiple-input and multiple-output (MIMO), and full-dimensional multiplexing. It can support technologies such as input/output (FD-MIMO: full dimensional MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module 192 may support various requirements specified in the electronic device 101, an external electronic device (e.g., electronic device 104), or a network system (e.g., second network 199). According to one embodiment, the wireless communication module 192 supports Peak data rate (e.g., 20 Gbps or more) for realizing eMBB, loss coverage (e.g., 164 dB or less) for realizing mmTC, or U-plane latency (e.g., 164 dB or less) for realizing URLLC. Example: Downlink (DL) and uplink (UL) each of 0.5 ms or less, or round trip 1 ms or less) can be supported.

The antenna module 197 may transmit or receive signals or power to or from the outside (eg, an external electronic device). According to one embodiment, the antenna module may include an antenna including a radiator made of a conductor or a conductive pattern formed on a substrate (eg, PCB). According to one embodiment, the antenna module 197 may include a plurality of antennas (eg, an array antenna). In this case, at least one antenna suitable for the communication method used in the communication network, such as the first network 198 or the second network 199, is connected to the plurality of antennas by, for example, the communication module 190. can be selected Signals or power may be transmitted or received between the communication module 190 and an external electronic device through the at least one selected antenna. According to some embodiments, in addition to the radiator, other components (eg, radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module 197.

According to various embodiments, the antenna module 197 may form a mmWave antenna module. According to one embodiment, a mmWave antenna module includes a printed circuit board, an RFIC disposed on or adjacent to a first side (e.g., bottom side) of the printed circuit board and capable of supporting a designated high frequency band (e.g., mmWave band); And a plurality of antennas (e.g., array antennas) disposed on or adjacent to the second side (e.g., top or side) of the printed circuit board and capable of transmitting or receiving signals in the designated high frequency band. can do.

At least some of the components are connected to each other through a communication method between peripheral devices (e.g., bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)) and signal ( (e.g. commands or data) can be exchanged with each other.

According to one embodiment, commands or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199. Each of the external

electronic devices

102 or 104 may be of the same or different type as the electronic device 101. According to one embodiment, all or part of the operations performed in the electronic device 101 may be executed in one or more of the external

electronic devices

102, 104, or 108. For example, when the electronic device 101 needs to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device 101 may perform the function or service instead of executing the function or service on its own. Alternatively, or additionally, one or more external electronic devices may be requested to perform at least part of the function or service. One or more external electronic devices that have received the request may execute at least part of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device 101. The electronic device 101 may process the result as is or additionally and provide it as at least part of a response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology can be used. The electronic device 101 may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device 104 may include an Internet of Things (IoT) device. Server 108 may be an intelligent server using machine learning and/or neural networks. According to one embodiment, the external electronic device 104 or server 108 may be included in the second network 199. The electronic device 101 may be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

Electronic devices according to various embodiments disclosed in this document may be of various types. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to embodiments of this document are not limited to the above-described devices.

The various embodiments of this document and the terms used herein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various changes, equivalents, or replacements of the embodiments. In connection with the description of the drawings, similar reference numbers may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the above items, unless the relevant context clearly indicates otherwise. As used herein, “A or B”, “at least one of A and B”, “at least one of A or B”, “A, B or C”, “at least one of A, B and C”, and “A Each of phrases such as “at least one of , B, or C” may include any one of the items listed together in the corresponding phrase, or any possible combination thereof. Terms such as "first", "second", or "first" or "second" may be used simply to distinguish one element from another, and may be used to distinguish such elements in other respects, such as importance or order) is not limited. One (e.g. first) component is said to be "coupled" or "connected" to another (e.g. second) component, with or without the terms "functionally" or "communicatively". Where mentioned, it means that any of the components can be connected to the other components directly (e.g. wired), wirelessly, or through a third component.

The term “module” used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and is interchangeable with terms such as logic, logic block, component, or circuit, for example. It can be used as A module may be an integrated part or a minimum unit of the parts or a part thereof that performs one or more functions. For example, according to one embodiment, the module may be implemented in the form of an application-specific integrated circuit (ASIC).

Various embodiments of the present document are one or more instructions stored in a storage medium (e.g., built-in memory 136 or external memory 138) that can be read by a machine (e.g., electronic device 101). It may be implemented as software (e.g., program 140) including these. For example, a processor (e.g., processor 120) of a device (e.g., electronic device 101) may call at least one command among one or more commands stored from a storage medium and execute it. This allows the device to be operated to perform at least one function according to the at least one instruction called. The one or more instructions may include code generated by a compiler or code that can be executed by an interpreter. A storage medium that can be read by a device may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g. electromagnetic waves). This term refers to cases where data is stored semi-permanently in the storage medium. There is no distinction between temporary storage cases.

According to one embodiment, methods according to various embodiments disclosed in this document may be provided and included in a computer program product. Computer program products are commodities and can be traded between sellers and buyers. The computer program product may be distributed in the form of a machine-readable storage medium (e.g. compact disc read only memory (CD-ROM)), or through an application store (e.g. Play Store ^TM ) or on two user devices (e.g. It can be distributed (e.g. downloaded or uploaded) directly between smart phones) or online. In the case of online distribution, at least a portion of the computer program product may be at least temporarily stored or temporarily created in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.

According to various embodiments, each component (e.g., module or program) of the above-described components may include a single or plural entity, and some of the plurality of entities may be separately placed in other components. there is. According to various embodiments, one or more of the components or operations described above may be omitted, or one or more other components or operations may be added. Alternatively or additionally, multiple components (eg, modules or programs) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each component of the plurality of components in the same or similar manner as those performed by the corresponding component of the plurality of components prior to the integration. . According to various embodiments, operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, or omitted. Alternatively, one or more other operations may be added.

Referring to FIG. 2 , the electronic device 101 may include a housing 210, a display 220, and a touch pad module 240. According to one embodiment, the electronic device 101 may be various devices such as a laptop computer, a notebook computer, or a mobile terminal. The configuration of the electronic device 101 of FIG. 2 may be completely or partially the same as the configuration of the electronic device 101 of FIG. 1 .

According to various embodiments, the housing 210 may form at least part of the exterior of the electronic device 101 or may support a component (eg, the touch pad module 240) of the electronic device 101. For example, the housing 210 may accommodate at least one of the display 220, the input device 230, or the touch pad module 240.

According to various embodiments, the electronic device 101 may be open or closed. For example, the housing 210 may include a first housing 212 and a second housing 214 rotatably connected to the first housing 212 . According to one embodiment, the electronic device 101 may include a hinge module (not shown) connected to the housing 210. For example, the hinge module (not shown) may be connected to the first housing 212 and the second housing 214. According to one embodiment, the first housing 212 may be configured to rotate at a specified angle (eg, 0 degrees to 360 degrees) with respect to the second housing 214. For example, the first front surface 212a of the first housing 212 may face the second front surface 214a of the second housing 214.

According to various embodiments, the housing 210 may be formed of a metallic material or a non-metallic material having a selected level of rigidity. According to one embodiment, at least a portion of the electronic device 101 made of the metal material may provide a ground plane and may be electrically connected to a ground line formed on a printed circuit board (not shown). For example, the housing 210 may be electrically connected to the printed circuit board through capacitive components.

According to various embodiments, the display 220 may be a flexible display in which at least some areas can be transformed into a flat and/or curved surface. For example, the display 220 may be a foldable or rollable display. The configuration of the display 220 may be completely or partially the same as the configuration of the display module 160 of FIG. 1 . According to one embodiment, at least a portion of the display 220 may be disposed within the second housing 214. For example, at least a portion of the display 220 may be visually exposed to the outside of the electronic device 101 through the second housing 214 .

According to various embodiments, the display 220 may be coupled to or disposed adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of touch, and/or a digitizer configured to detect a magnetic field-type stylus pen. You can.

According to various embodiments, the input device 230 may detect user input (eg, pressure). According to one embodiment, the input device 230 may be disposed on the first housing 212. According to one embodiment, when the electronic device 101 is closed, the input device 230 may face the display 220. The configuration of the input device 230 in FIG. 2 may be completely or partially the same as the configuration of the input module 150 in FIG. 1 . For example, input device 230 may be a keyboard.

According to various embodiments, the touch pad module 240 may be set to detect or receive user input. According to one embodiment, the touch pad module 240 may include a capacitive touch sensor, a touch sensor based on resistive sensing, an optical touch sensor, or a surface acoustic wave touch sensor. For example, the touch pad module 240 detects current, pressure, light, and/or vibration resulting from input applied to the touch pad module 240 by a user, and detects current, pressure, light, and/or vibration from a processor (e.g., processor 120 of FIG. 1). and/or the touch pad module 240 may determine a user input based on changes in sensed current, pressure, light, and/or vibration.

According to various embodiments, the touch pad module 240 may be accommodated in the housing 210. For example, the touch pad module 240 may be connected to the first housing 212 and at least a portion may be exposed to the outside of the first housing 212 . According to one embodiment, the touch pad module 240 may be adjacent to the input device 230. According to one embodiment, when the electronic device 101 is closed, at least a portion of the touch pad module 240 may face the display 220. The configuration of the touch pad module 240 may be completely or partially the same as the configuration of the input module 150 of FIG. 1 .

3A, 3B, and 3C, an electronic device (e.g., electronic device 101 in FIG. 2) includes a housing (e.g., housing 210 in FIG. 2) and electrical components disposed within the housing 210. It may include an assembly 300.

According to various embodiments, the housing 210 may form at least a portion of the exterior of the electronic device 101 or may support the electrical component assembly 300. The housing 210 may include a first housing 212 and a second housing 214 rotatably connected to the first housing 212 . An input device, a main circuit board, and an electrical component assembly 300 electrically connected to the main circuit board are disposed in the first housing 212, and a display may be disposed in the second housing 214. The configuration of the first housing 212 in FIGS. 3A, 3B, and 3C may be completely or partially the same as the configuration of the first housing 212 in FIG. 2.

According to various embodiments, the electrical component assembly 300 may include a heat source, a component bracket 330, and a circuit board 320. The heat source may be various heat sources disposed within the electronic device. For example, it may be one of at least a portion of an antenna module, a speaker, a camera, and a display. The electrical component assembly 300 may be located at an edge area of the first housing 212 . For example, when the heat source of the electrical component assembly 300 is the antenna module 310, for efficient radiation to the outside of the first housing 212, the electrical component assembly 300 is located at the edge area of the first housing 212. It can be located in .

According to one embodiment, a plurality of electrical component assemblies 300 may be arranged. For example, the electrical component assembly 300 may include a first electrical component assembly 301 and a second electrical component assembly 302. As shown, the first electrical component assembly 301 is disposed adjacent to the first side edge E1 of the first housing 212, and the second electrical component assembly 302 is disposed adjacent to the first side edge E1. It may be disposed adjacent to the opposite second side edge E2. The first side edge E1 may be a portion of an area on the right side (+Y axis direction) of the first housing 212, and the second side edge E2 may be on the left side of the first housing 212 (+Y axis direction). It may be part of a group of areas in the -Y-axis direction.

However, the position of the first housing 212 for placing the electrical component assembly 300 is not limited to this, and depending on the arrangement of the heat source of the electrical component assembly 300, the lower edge E3 of the first housing 212 ) (e.g., at the edge facing the -X axis direction) or placed in the center area, the design can be changed in various ways.

Referring to FIG. 4 , the electrical component assembly 300 may include a heat source, a component bracket 330, and a circuit board 320. The heat source may be one of at least a portion of the antenna module 310, a speaker, a camera, and a display.

According to various embodiments, at least a portion of the antenna module 310 may be inserted into a recess (eg, the second recess 332) of the component bracket 330. The antenna module 310 may include a printed circuit board 410, an antenna array 430, a radio frequency integrate circuit (RFIC) 452, and a power manage integrate circuit (PMIC) 454. Optionally, the antenna module 310 may further include a shielding member 490. In other embodiments, at least one of the above-mentioned parts may be omitted, or at least two of the above parts may be formed integrally.

According to one embodiment, the printed circuit board 410 may include a plurality of conductive layers and a plurality of non-conductive layers alternately stacked with the conductive layers. The printed circuit board 410 may provide electrical connections between the printed circuit board 410 and/or various electronic components disposed externally using wires and conductive vias formed in the conductive layer.

According to one embodiment, the antenna array 430 may include a plurality of

antenna elements

432, 434, 436, and/or 438 arranged to form a directional beam. The plurality of antenna elements may be formed on the first surface (eg, the surface facing the +Y axis) of the printed circuit board 410 as shown. According to another embodiment, the antenna array 430 may be formed inside the printed circuit board 410. According to embodiments, the antenna array 430 may include a plurality of antenna arrays (eg, a dipole antenna array and/or a patch antenna array) of the same or different shapes or types.

According to one embodiment, the RFIC 452 may be disposed in another area of the printed circuit board 410 that is spaced apart from the antenna array 430 (eg, a second side opposite the first side). The RFIC may be configured to process signals in a selected frequency band that are transmitted/received through the antenna array 430. According to one embodiment, the RFIC 452 may convert a baseband signal obtained from a communication processor (not shown) into an RF signal in a designated band during transmission. Upon reception, the RFIC 452 may convert the RF signal received through the antenna array 430 into a baseband signal and transmit it to the communication processor.

According to another embodiment, the RFIC 452 may up-convert an IF signal (e.g., about 9 GHz to about 15 GHz) obtained from an intermediate frequency integrate circuit (IFIC) into an RF signal of a selected band during transmission. When receiving, the RFIC 452 may down-convert the RF signal obtained through the antenna array 430, convert it into an IF signal, and transmit it to the IFIC.

According to one embodiment, the PMIC 454 may be disposed in another area of the printed circuit board 410 (e.g., a second side opposite the first side), spaced apart from the antenna array 430. . The PMIC 454 may receive voltage from a main circuit board (not shown) and provide power required for various components (e.g., RFIC 452) on the antenna module.

According to one embodiment, the shielding member 490 is a portion of the printed circuit board 410 (e.g., opposite to the first side) to electromagnetically shield at least one of the RFIC 452 and/or the PMIC 454. It can be placed on the second side). According to one embodiment, the shielding member 490 may include a shield can.

Although not shown, in various embodiments, the antenna module 310 may be electrically connected to another printed circuit board (eg, a main circuit board) through a module interface. The module interface may include, for example, a coaxial cable connector, a board to board connector, an interposer, or a flexible printed circuit board (FPCB). Through the module interface, the RFIC 452 and/or PMIC 454 of the antenna module 310 may be electrically connected to the printed circuit board 410.

According to various embodiments, the component bracket 330 is spaced apart from the first recess 331 formed on the first surface 330a facing the first direction (+Z-axis direction), and the first recess 331, , It may include a second recess 332 formed adjacent to the edge of the housing (e.g., the first housing 212 in FIG. 2). The first recess 331 of the component bracket 330 may provide an area in which the circuit board 320 is seated, and the second recess 332 may provide an area in which the antenna module 310 is seated. The second recess 332 may have the shape of an opening penetrating the component bracket 330, or may have the shape of a groove configured to be at least partially closed to support the bottom of the antenna module 310.

According to one embodiment, the second recess 332 may have a relatively greater depth than the first recess 331 . The circuit board 320 has an overall plate shape, and may be arranged so that its wide surface faces the first direction (+Z-axis direction) (or the second direction (-Z-axis direction)). The antenna module 310 has an overall plate shape, and may be arranged so that its wide surface faces a third direction (+Y-axis direction) perpendicular to the first direction (+Z-axis direction). When the circuit board 320 and the antenna module 310 are each seated within the component bracket 330, the first recess 331 may have a depth corresponding to the thickness of the circuit board 320, The second recess 332 may have a depth corresponding to the wide surface of the antenna module 310.

According to one embodiment, the component bracket 330 may include a plurality of heat dissipation patterns. The first heat dissipation pattern 335 has a first surface 330a facing the first direction (+Z-axis direction) of the component bracket 330 and a second surface 330b facing a second direction (-Z-axis direction) opposite to the first surface 330a facing the first direction (+Z-axis direction) of the component bracket 330. ) can be formed. The second heat dissipation pattern 336 may be formed on the first surface 330a facing the first direction (+Z-axis direction) and the third surface 330c facing the third direction (+Y-axis direction) perpendicular to the first surface 330a. .

According to one embodiment, the component bracket 330 may include a plurality of coupling holes 339. The coupling holes 339 are designed to penetrate from the first side 330a to the second side 330b of the component bracket 330, and connect the component bracket 330 to the electronic device 101 through a fastening member such as a screw. Can be combined with the housing.

According to various embodiments, the circuit board 320 includes a first portion 321 seated in the first recess 331, extending from one end of the first portion 321, and at least a portion of the second recess 332. ) may include a second part 322 that is inserted into the antenna module 310 and electrically connected to the antenna module 310. The circuit board 320 extends from the other end of the first part 321 and may include a third part 323 for connecting to the main circuit board (not shown) of the electronic device 101. The third parts 323 extending from the first part 321 may be arranged perpendicular to each other. The second part 322 includes a partially bendable area, and a first connection member 322a is disposed at the end, so that it can be electrically connected to the module interface of the printed circuit board 410 of the antenna module 310. . The first connection member 322a may include a coaxial cable connector, a board to board connector, an interposer, or a flexible printed circuit board (FPCB) corresponding to the module interface. The third part 323 includes a partially bendable area, and a second connection member 323a is disposed at an end so that it can be electrically connected to the module interface of the main circuit board of the electronic device 101. The second connection member 323a may include a coaxial cable connector, a board to board connector, an interposer, or a flexible printed circuit board (FPCB) corresponding to the module interface.

Referring to FIGS. 5, 6, and 7, the electrical component assembly 300 may include an antenna module 310, a component bracket 330, and a circuit board 320. The configuration of the antenna module 310, the component bracket 330, and the circuit board 320 is partially or entirely the same as the configuration of the antenna module 310, the component bracket 330, and the circuit board 320 in FIG. may be the same.

According to various embodiments, the electrical component assembly 300 may implement an integrated structure by seating the antenna module 310 and the circuit board 320 within the component bracket 330 and combining them. Accordingly, it is implemented to be robust by preventing deformation or distortion that occurs during the assembly structure, and degradation of antenna performance can be improved.

According to various embodiments, the circuit board 320 may be seated in the first recess 331 of the component bracket 330. The first recess 331 is formed to surround the side of the first part 321 of the plate-shaped circuit board 320, and is designed to have a depth substantially greater than the thickness of the first part 321 to form a circuit. The substrate 320 can be stably protected. One area 331a from the first recess 331 toward the second recess 332 may be opened to guide the first portion 321 of the circuit board 320 toward the antenna module 310. . Additionally, in the first recess 331, the other area 331b facing the inside of the electronic device (e.g., the electronic device 101 of FIG. 2) is the second portion 322 of the circuit board 320 that is used in the electronic device. It may be opened to be guided toward the main circuit board (not shown) within (101).

According to various embodiments, the antenna module 310 may be seated within the second recess 332 of the component bracket 330. In the antenna module 310 mounted on the component bracket 330, the plurality of

antenna elements

432, 434, 436, and/or 438 are arranged in a third direction (+) perpendicular to the first direction (+Z-axis direction). It can be arranged to face the Y-axis direction. The third surface 330c of the component bracket 330 may be partially open so that the

antenna elements

432, 434, 436, and/or 438 can radiate a directional beam outward. For example, the

antenna elements

432, 434, 436, and/or 438 are configured so that the component bracket 330 is not disposed in an overlapping area in each of the

antenna elements

432, 434, 436, and/or 438. Each may be formed so that the component brackets 330 do not overlap on a radial area in a range of approximately 45 degrees left and right and/or up and down relative to the third direction (+Y-axis direction). Accordingly, as shown in FIG. 6, when looking at the third side 330c of the component bracket 330, the

antenna elements

432, 434, 436, and/or 438 of the antenna module 310 are The component bracket 330 may be exposed to the outside.

According to various embodiments, the component bracket 330 may be made of a material with high thermal conductivity to efficiently dissipate heat generated from the antenna module 310. For example, the component bracket 330 may be manufactured from a material containing at least one of magnesium, copper, aluminum, and carbon fiber reinforced material. For example, magnesium can provide a thermal conductivity of approximately 159 to 1028 W/mk, copper can provide a thermal conductivity of approximately 390 W/mk, aluminum can provide a thermal conductivity of approximately 237 W/mk, and carbon fiber reinforced material can provide a thermal conductivity of approximately 300 to 500 W/mk. An alloy of the above materials can provide a lightweight structure with superior thermal conductivity compared to materials generally used in electronic devices (e.g., polycarbonate).

According to various embodiments, the component bracket 330 may include various types of heat dissipation patterns to efficiently dissipate heat generated from the antenna module 310. The component bracket 330 may form a first heat dissipation pattern 335 and a second heat dissipation pattern 336 depending on its position. The heat dissipation patterns formed on the component bracket 330 can increase the area through which heat can be dissipated by approximately two times or more compared to the case where there are no heat dissipation patterns.

According to one embodiment, the first heat dissipation pattern 335 may be implemented by forming a plurality of protruding portions on the second surface 330b of the component bracket 330. As shown, the first heat dissipation pattern 335 may have square pillar-shaped protruding portions regularly arranged to be spaced apart from each other in the second direction (-Z axis direction). However, the shape of the first heat dissipation pattern 335 is not limited to this, and may be designed into various shapes that can efficiently dissipate heat.

According to one embodiment, the second heat dissipation pattern 336 may be implemented by forming a plurality of protruding portions on the third surface 330c of the component bracket 330. As shown, the second heat dissipation pattern 336 may have square pillar-shaped protruding portions regularly arranged to be spaced apart from each other in the third direction (+Y-axis direction). However, the shape of the second heat dissipation pattern 336 is not limited to this, and may be designed into various shapes that can efficiently dissipate heat.

According to one embodiment, at least a portion of the second heat dissipation pattern 336 may be formed of a material other than metal so as not to affect the performance of the antenna module 310. For example, at least a portion of the second heat dissipation pattern 336 may be formed of a material such as injection molding. The component bracket 330 may be made of different materials, including a portion made of a non-metallic material (e.g., at least a portion of the second heat dissipation pattern 336) and another portion made of a metallic material for heat dissipation.

According to one embodiment, the heat dissipation patterns of the component bracket 330 include, in addition to the first heat dissipation pattern 335 formed on the second surface 330b and the second heat dissipation pattern formed on the third surface 330c, the antenna module 310 ) and may be formed in an empty area of the adjacent component bracket 330. For example, the third heat dissipation pattern 337 is formed on the fourth surface (opposite the third surface 330c) of the second recess 332 where the antenna module 310 is disposed, so that the antenna module ( Heat generated in the RFIC (e.g., RFIC 452 in FIG. 4) of 310) can be directly dissipated to the outside.

Referring to FIG. 8 , the electrical component assembly 300 may include an antenna module 310, a component bracket 330, and a circuit board 320. The configuration of the antenna module 310, the component bracket 330, and the circuit board 320 is partially similar to the configuration of the antenna module 310, the component bracket 330, and the circuit board 320 in FIGS. 4 to 7. Or they may all be the same.

According to various embodiments, the component bracket 330 includes a first recess 331 and a second recess 332, and a portion of the circuit board 320 is seated in the first recess 331, The antenna module 310 may be seated in the second recess 332. The electrical component assembly 300 may implement an integrated structure by seating the antenna module 310 and the circuit board 320 within the component bracket 330 and combining them. Accordingly, it is implemented to be robust by preventing deformation or distortion that occurs during the assembly structure, and degradation of antenna performance can be improved.

According to various embodiments, the component bracket 330 may include various types of heat dissipation patterns to efficiently dissipate heat generated from the antenna module 310. For example, the component bracket includes a first heat dissipation pattern 335 formed on the second surface 330b opposite to the first surface 330a, and a third surface 330c formed perpendicular to the first surface 330a. It may include two heat dissipation patterns 336 and a fourth heat dissipation pattern 338 formed on the first surface 330a. According to one embodiment, the fourth heat dissipation pattern 338 may be formed to surround at least a portion of the first recess 331. According to another embodiment, when looking toward the first surface 330a of the component bracket 330, at least a portion of the fourth heat dissipation pattern 338 is formed in the first recess 331 and the second recess 332. can be formed in between. For example, at least a portion of the fourth heat dissipation pattern 338 may be formed between the circuit board 320 and the antenna module 310.

According to one embodiment, the first heat dissipation pattern 335 and/or the second heat dissipation pattern 336 may be formed as an arrangement of a plurality of protruding portions. According to one embodiment, the fourth heat dissipation pattern 338 may be formed as an arrangement of a plurality of protruding portions different from the first heat dissipation pattern 335 and/or the second heat dissipation pattern 336. For example, the fourth heat dissipation pattern 338 provides the shape of triangular pillar-shaped protruding parts, and each triangular pillar-shaped protruding part moves in the first direction (+Z axis direction) and/or the third direction ( It extends in a fourth direction (+X-axis direction) perpendicular to the +Y-axis direction, and each protruding portion may be arranged in parallel with each other. Each triangular pillar-shaped protruding portion has the same thickness while being spaced apart from each other, and may be arranged regularly. However, the shape of the fourth heat dissipation pattern 338 is not limited to this, and may be designed into various shapes that can efficiently dissipate heat.

Referring to FIG. 9 , the electrical component assembly 300 may include an antenna module 310, a component bracket 330, and a circuit board 320. The configuration of the antenna module 310, the component bracket 330, and the circuit board 320 is partially similar to the configuration of the antenna module 310, the component bracket 330, and the circuit board 320 in FIGS. 4 to 7. Or they may all be the same.

According to various embodiments, the component bracket 330 may include various types of heat dissipation patterns to efficiently dissipate heat generated from the antenna module 310. For example, the component bracket 330 includes a first heat dissipation pattern 335 formed on a second surface 330b opposite to the first surface 330a, and a third surface 330c perpendicular to the first surface 330a. ) may include a second heat dissipation pattern 336 formed on the surface.

According to various embodiments, the first heat dissipation pattern 335 may be implemented by arranging a plurality of holes on the second surface 330b of the component bracket 330. As shown, the first heat dissipation pattern 335 may be formed by a combination of a plurality of holes penetrating from the second surface 330b to the first surface 330a of the component bracket 330. According to one embodiment, each hole has the same diameter while being spaced apart from each other, and may be arranged regularly. As another example, each hole may be manufactured in a shape in which the first diameter C1 formed on the first surface 330a (or the second surface 330b) and the inner second diameter C2 of the hole are different. For example, the first diameter (C1) may be formed to be relatively larger than the second diameter (C2), and the surface from the second diameter (C2) to the first diameter (C1) is an inclined surface (L) extending outward. ), which can effectively provide heat dissipation.

However, the shape of the first heat dissipation pattern 335 is not limited to this, and can be designed in various ways, such as various hole shapes of square or larger that can efficiently dissipate heat.

Referring to FIG. 10 , the electrical component assembly 300 may include an antenna module 310, a component bracket 330, and a circuit board 320. The configuration of the antenna module 310, the component bracket 330, and the circuit board 320 is partially similar to the configuration of the antenna module 310, the component bracket 330, and the circuit board 320 in FIGS. 4 to 9. Or they may all be the same.

According to various embodiments, the component bracket 330 may include various types of heat dissipation patterns to efficiently dissipate heat generated from the antenna module 310. For example, the component bracket 330 has a first heat dissipation pattern 335 formed on the second surface 330b opposite to the first surface 330a, and a third surface 330c perpendicular to the first surface 330a. It may include a second heat dissipation pattern 336 formed in .

According to various embodiments, the electrical component assembly 300 is disposed in the second recess 332 and may further include a first heat dissipation member 610 for dissipating heat generated from the antenna module 310. . The first heat dissipation member 610 is disposed adjacent to (or in contact with) the rear side (e.g., the side facing the -Y axis) of the antenna module 310, and is used as an electrical component for antenna radiation (e.g., the RFIC 452 in FIG. 4, and PMIC 454) can be efficiently dissipated.

According to various embodiments, the first heat dissipation member 610 may include a shape such as a scrubbing pad. The first heat dissipation member 610 may be implemented with a material with high thermal conductivity. For example, the first heat dissipation member 610 may be made of a material containing at least one of magnesium, copper, aluminum, and carbon fiber reinforced material. According to one embodiment, the first heat dissipation member 610 is the same as the material of the bracket 330, but may be manufactured in different shapes. According to another embodiment, the first heat dissipation member 610 may be manufactured from a different material than the bracket 330.

According to various embodiments, the first heat dissipation member 610 has a first part 611 facing the antenna module 310, extends from the first part 611, and is seated on one surface of the first housing 212. It may include a second part 612. The first part 611 is located between the antenna module 310 and the component bracket 330, and can directly transfer heat generated by the antenna module 310 to the first heat dissipation pattern 335 of the component bracket 330. there is. The second part 612 is formed in a direction perpendicular to the first part 611 and can support a surface of the antenna module 310 facing the second direction (-Z axis direction). At least a portion of the second portion 612 is located between the antenna module 310 and the second housing 214, and directly directs heat generated from the antenna module 310 to the second heat dissipation pattern 336 of the component bracket 330. ) can be transmitted. However, the shape of the first heat dissipation member 610 is not limited to this, and may be designed into various shapes that can efficiently dissipate heat.

Referring to FIGS. 11A and 11B , the electrical component assembly 300 may include an antenna module 310, a component bracket 330, and a circuit board (eg, the circuit board 320 of FIG. 4). The configuration of the antenna module 310, the component bracket 330, and the circuit board 320 is partially similar to the configuration of the antenna module 310, the component bracket 330, and the circuit board 320 of FIGS. 4 to 10. Or they may all be the same.

According to various embodiments, the electrical component assembly 300 is disposed on the first heat dissipation pattern 335 and the second heat dissipation pattern 336, and has a second heat dissipation pattern for dissipating heat generated from the antenna module 310. It may further include a member 620. The second heat dissipation member 620 includes a 2-1 heat dissipation member 621 disposed on the first heat dissipation pattern 335, and a 2-2 heat dissipation member 622 disposed on the second heat dissipation pattern 336. may include.

According to various embodiments, the second heat dissipation member 620 includes cool-gel and is applied to the first heat dissipation pattern 335 and the second heat dissipation pattern 336, thereby forming the antenna module 310. ) can be quickly dissipated.

According to one embodiment, the 2-1 heat dissipation member 621 is applied to at least a portion of the space between the protruding portions of the first heat dissipation pattern 335 to improve heat dissipation of heat transferred to each protruding portion. there is. When looking toward the second surface 330b of the component bracket 330, the 2-1 heat dissipation member 621 fills the gap formed between the protruding portions of the first heat dissipation pattern 335. , the second surface 330b of the component bracket 330 on which the 2-1 heat dissipation member 621 is disposed may form an overall flat surface. As another example, the 2-1 heat dissipation member 621 is evenly distributed on the upper surfaces of the protruding portions of the first heat dissipation pattern 335, thereby expanding heat dissipation performance. According to one embodiment, the second surface 330b of the component bracket 330 on which the 2-1 heat dissipation member 621 is disposed radiates heat to the outside of the component bracket 330 or is adjacent to the component bracket 330. Heat can be transferred to (or in contact with) the disposed housing bracket 450 made of metal.

According to one embodiment, the 2-2 heat dissipation member 622 is applied to at least a portion of the space between the protruding portions of the second heat dissipation pattern 336 to improve heat dissipation of heat transferred to each protruding portion. there is. When looking toward the third side 330c of the component bracket 330, the 2-2 heat dissipation member 622 fills the gap formed between the protruding portions of the second heat dissipation pattern 336. , At least a portion of the third surface 330c of the component bracket 330 on which the 2-2 heat dissipation member 622 is disposed may form a flat surface. As another example, the 2-2 heat dissipation member 622 is evenly distributed on the upper surfaces of the protruding portions of the second heat dissipation pattern 336, thereby expanding heat dissipation performance. According to one embodiment, the third surface 330c of the component bracket 330 on which the 2-2 heat dissipation member 622 is disposed may radiate heat to the outside of the component bracket 330.

Referring to FIGS. 12A and 12B , the electrical component assembly 500 may include a heat source 510, a component bracket 530, and a display circuit board 520. The configuration of the component bracket 530 and the display circuit board 520 may be partially or entirely the same as the configuration of the component bracket 330 and the circuit board 320 of FIGS. 4 to 10 .

According to various embodiments, the electrical component assembly 500 may be disposed on the rear of the display 220. The electrical component assembly 500 may implement an integrated structure by seating and combining the heat source 510 (eg, an electrical component) and the display circuit board 520 within the component bracket 530 . Accordingly, it is implemented to be robust by preventing deformation or distortion that occurs during the assembly structure, and performance degradation of electrical components can be improved.

According to various embodiments, a portion of the display circuit board 520 may be seated in the first area S1 of the component bracket 530. The first area S1 is formed to surround at least a portion of the plate-shaped display circuit board 520 to stably protect the display circuit board 520. The first area S1 may include a recess shape. According to one embodiment, the display circuit board 520 includes a first part seated in the first area S1, extending from the first part, inserted into the second area S2, and electrically connected to the heat source 510. It may include a second part, and a third part that extends from the first part to a part different from the second part and is electrically connected to the main circuit board in the electronic device.

According to various embodiments, the heat source 510 may be seated in the second area S2 of the component bracket 530. There may be a plurality of heat sources 510 seated within the component bracket 330, and as they are mounted on the display circuit board 520, the second area S2 is formed to surround at least a portion of the heat sources 510. It may include a groove shape dug inward from the area S1.

According to various embodiments, the component bracket 530 may be made of a material with high thermal conductivity to efficiently dissipate heat generated from the heat source 510. For example, the component bracket 530 may be manufactured from a material containing at least one of magnesium, copper, aluminum, and carbon fiber reinforced material.

According to various embodiments, the component bracket 530 may include various types of heat dissipation patterns to efficiently dissipate heat generated from the heat source 510. The component bracket 530 may form at least one

heat dissipation pattern

531 or 532 depending on its position. At least one

heat dissipation pattern

531 or 532 formed on the component bracket 530 can increase the area through which heat can be dissipated by approximately two times or more compared to the case where there is no

heat dissipation pattern

531 or 532.

According to one embodiment, the at least one

heat dissipation pattern

531 and 532 may be implemented by forming a plurality of protruding portions toward the back of the component bracket 530 (eg, the back of the display 220). As shown, the at least one

heat dissipation pattern

531 and 532 may be regularly arranged with square pillar-shaped protruding portions spaced apart from each other. However, the shape of at least one heat dissipation pattern is not limited to this, and may be designed into various shapes that can efficiently dissipate heat.

An electronic device (e.g., 101 in FIGS. 1 and 2) according to various embodiments of the present disclosure includes a housing (e.g., 210 in FIG. 2) and a component bracket (e.g., 330 in FIG. 4) disposed within the housing, A first recess (e.g., 331 in FIG. 4) formed on the first side facing the first direction, and a second recess (e.g., 332 in FIG. 4) spaced apart from the first recess and formed adjacent to an edge of the housing. A component bracket including a heat source seated in the second recess and disposed so that a plurality of surfaces are surrounded by the component bracket, and a first portion seated in the first recess (e.g., 321 in FIG. 4) , and a circuit board (e.g., 320 in FIG. 4) including a second part (e.g., 322 in FIG. 4) extending from one end of the first part and inserted into the second recess and electrically connected to the heat source. It can be included. The component bracket includes a first heat dissipation pattern (e.g., 335 in FIG. 4) formed on a second side opposite to the first side, and a pattern perpendicular to the first side, adjacent to the heat source, and facing an edge of the housing. It may include a second heat dissipation pattern (eg, 336 in FIG. 4) formed on the third surface.

According to various embodiments, the component bracket may be made of a material including at least one of magnesium, copper, aluminum, and carbon fiber reinforced material.

According to various embodiments, the first heat dissipation pattern may include a plurality of protruding portions formed on the second surface, and the second heat dissipation pattern may include a plurality of protruding portions formed on the third surface.

According to various embodiments, the component bracket may further include a third heat dissipation pattern (eg, 337 in FIG. 7 ) formed on a fourth side opposite to the third side.

According to various embodiments, the bracket further includes a fourth heat dissipation pattern (e.g., 338 in FIG. 8) formed on the first surface and formed to surround at least a portion of the first recess, and the fourth The heat dissipation pattern may be formed in a different structure from the first heat dissipation pattern.

According to various embodiments, the fourth heat dissipation pattern includes a plurality of protruding portions formed on the first surface, and each of the plurality of protruding portions extends along the longitudinal direction of the heat source in the shape of a triangular pillar, and each of the plurality of protruding portions extends along the longitudinal direction of the heat source, They can be arranged side by side.

According to various embodiments, the heat source includes an antenna module (e.g., 310 in FIG. 4), and the antenna module is a printed circuit board (e.g., 410 in FIG. 4) and is disposed on one side of the printed circuit board, An antenna array including an array of a plurality of antenna elements facing a second direction perpendicular to the first direction (e.g., 432, 434, 436, and 438 in FIG. 4), and an RFIC (RFIC) disposed on the other side of the printed circuit board. Example: 452 in FIG. 4) may be included.

According to various embodiments, a third recess may be formed in at least a portion of the third surface of the component bracket corresponding to the plurality of antenna elements so that the plurality of antenna elements radiate a directional beam toward the outside. You can.

According to various embodiments, when viewed toward the third side of the component bracket, the plurality of antenna elements of the antenna module may be arranged to be exposed to the outside of the component bracket.

According to various embodiments, the circuit board extends from the other end of the first part and further includes a third part (e.g., 323 in FIG. 4) for electrical connection with the main circuit board of the electronic device, The second portion and the third portion may extend in different directions.

According to various embodiments, the first heat dissipation pattern includes an array of a plurality of holes, and each of the plurality of holes forms a corresponding aperture while being spaced apart from each other, and may be arranged at designated intervals.

According to various embodiments, the electronic device includes a first part (e.g., 611 in FIG. 10) facing the antenna module, and a second part (e.g., 611 in FIG. 10) extending from the first part and seated on one surface of the housing. It may further include a first heat dissipation member (eg, 610 in FIG. 10) including 612 in FIG. 10. The first heat dissipation member may have a shape like a scrubbing pad.

According to various embodiments, the first portion of the first heat dissipation member is located between the antenna module and the component bracket, and directly transfers heat generated by the antenna module to the first heat dissipation pattern of the component bracket. A route can be provided. The second part of the first heat dissipation member is formed in a direction perpendicular to the first part, is located between the antenna module and the housing, and directs heat generated from the antenna module directly to the second part of the component bracket. A path for transferring heat to a heat dissipation pattern can be provided.

According to various embodiments, the electronic device further includes a second heat dissipation member (e.g., 620 in FIG. 11A) applied to at least a portion of the first heat dissipation pattern, and the second heat dissipation member is a portion of the first heat dissipation pattern. It may be applied to at least a portion of the space between the protruding parts to dissipate heat transferred to each protruding part.

According to various embodiments, the circuit board may include a display circuit board (e.g., 520 in FIG. 12A), and the heat source may include an electrical component (e.g., 510 in FIG. 12A) mounted on the display circuit board. there is.

An electronic device (e.g., 101 in FIGS. 1 and 2) according to various embodiments of the present disclosure includes a housing (e.g., 210 in FIG. 2), a component bracket disposed within the housing, and a first surface facing a first direction. A component bracket (e.g., 335 in FIG. 4) including a first recess (e.g., 331 in FIG. 4) formed in and a second recess (e.g., 335 in FIG. 4) spaced apart from the first recess and formed adjacent to an edge of the housing. 330 in FIG. 4), an antenna module (e.g., 310 in FIG. 4) seated in the second recess and including an array of a plurality of antenna elements facing a second direction perpendicular to the first direction, and the first 1 A first part seated in the recess (e.g., 321 in FIG. 4), and a second part (e.g., 321 in FIG. 4) extending from the first part and inserted into the second recess and electrically connected to the antenna module. It may include a circuit board including 322) (e.g., 320 in FIG. 4). The component bracket includes a first heat dissipation pattern (e.g., 335 in FIG. 4) formed on a second side opposite to the first side, and perpendicular to the first side and adjacent to the plurality of conductive plates and of the housing. It may include a second heat dissipation pattern (eg, 336 in FIG. 4 ) formed on the third side facing the edge.

According to various embodiments, the housing may include a first housing (e.g., 212 in FIG. 2) and a second housing (e.g., 214 in FIG. 2) rotatably connected to the first housing. The circuit board extends from the other end of the first part and may further include a third part for electrical connection with the main circuit board within the first housing.

The electronic device including the component bracket on which the heat dissipation pattern of the various embodiments of the present disclosure described above is formed is not limited to the above-described embodiments and drawings, and various substitutions, modifications, and changes are possible within the technical scope of the present disclosure. will be clear to those skilled in the art to which the present invention pertains.

Claims

In electronic devices,

housing;

a component bracket disposed within the housing, the component bracket including a first recess formed on a first surface facing a first direction, and a second recess spaced apart from the first recess and formed adjacent to an edge of the housing;

a heat source seated in the second recess and arranged so that a plurality of surfaces are surrounded by the component bracket; and

Comprising a circuit board including a first part seated in the first recess, and a second part extending from one end of the first part and inserted into the second recess and electrically connected to the heat source,

The component bracket includes a first heat dissipation pattern formed on a second side opposite to the first side, and a second heat dissipation pattern formed on a third side perpendicular to the first side, adjacent to the heat source, and facing an edge of the housing. An electronic device containing a pattern.
According to claim 1,

The component bracket is an electronic device made of a material containing at least one of magnesium, copper, aluminum, and carbon fiber reinforced material.
According to claim 1,

The first heat dissipation pattern includes a plurality of protruding portions formed on the second surface,

The second heat dissipation pattern includes a plurality of protruding portions formed on the third surface.
According to claim 1,

The component bracket further includes a third heat dissipation pattern formed on a fourth side opposite to the third side.
According to claim 1,

The bracket further includes a fourth heat dissipation pattern formed on the first surface and formed to surround at least a portion of the first recess,

The fourth heat dissipation pattern is formed in a structure different from the first heat dissipation pattern.
According to clause 5,

The fourth heat dissipation pattern includes a plurality of protruding portions formed on the first surface,

An electronic device wherein each of the plurality of protruding parts extends along the longitudinal direction of the heat source in the shape of a triangular pillar and is arranged in parallel with each other.
According to claim 1,

The heat source includes an antenna module, and the antenna module includes,

printed circuit board;

an antenna array disposed on one surface of the printed circuit board and including an array of a plurality of antenna elements facing a second direction perpendicular to the first direction; and

An electronic device including an RFIC disposed on the other side of the printed circuit board.
According to clause 7,

An electronic device wherein a third recess is formed in at least a portion of the third surface of the component bracket corresponding to the plurality of antenna elements so that the plurality of antenna elements radiate a directional beam toward the outside.
According to clause 7,

When looking toward the third side of the component bracket, the plurality of antenna elements of the antenna module are arranged to be exposed to the outside of the component bracket.
According to claim 1,

The circuit board extends from the other end of the first part and further includes a third part for electrical connection with the main circuit board of the electronic device,

The second part and the third part extend in different directions.
According to claim 1,

The first heat dissipation pattern includes an arrangement of a plurality of holes,

Each of the plurality of holes is spaced apart from each other and forms a corresponding aperture, and is arranged at designated intervals.
According to clause 7,

It further includes a first heat dissipation member including a first part facing the antenna module and a second part extending from the first part and seated on one surface of the housing,

The first heat dissipation member is an electronic device having a shape like a scrubbing pad.
According to claim 12,

The first portion of the first heat dissipation member is located between the antenna module and the component bracket, and provides a path for transferring heat generated by the antenna module directly to the first heat dissipation pattern of the component bracket,

The second part of the first heat dissipation member is formed in a direction perpendicular to the first part, is located between the antenna module and the housing, and directs heat generated from the antenna module directly to the second part of the component bracket. An electronic device that provides a path for heat transfer in a heat dissipation pattern.
According to claim 1,

Further comprising a second heat dissipation member applied to at least a portion of the first heat dissipation pattern,

The second heat dissipation member is applied to at least a portion of the space between the protruding portions of the first heat dissipation pattern to dissipate heat transferred to each protruding portion.
According to claim 1,

The circuit board includes a display circuit board,

An electronic device wherein the heat source includes an electrical component mounted on the display circuit board.