WO2023216589A1

WO2023216589A1 - Backplane structure and communication device

Info

Publication number: WO2023216589A1
Application number: PCT/CN2022/139314
Authority: WO
Inventors: 陈锋华
Original assignee: 中兴通讯股份有限公司
Priority date: 2022-05-11
Filing date: 2022-12-15
Publication date: 2023-11-16
Also published as: CN117096638A

Abstract

The present disclosure relates to a backplane structure and a communication device. The backplane structure comprises: a first backplane connected to a first single board group, the first backplane extending in the distribution direction of the first single board group; a first connector connected to the first backplane; a second backplane connected to a second single board group, the second backplane extending in the distribution direction of the second single board group; a second connector connected to the second backplane, the second connector being arranged corresponding to the first connector; and a conductive assembly detachably connected between the first backplane and the second backplane, one end of the conductive assembly being electrically connected to the end of the first backplane close to the first connector, and the other end of the conductive assembly being electrically connected to the side of the second backplane away from the second connector; the second backplane being mounted on the first backplane, and the second connector being in butt joint with the first connector.

Description

Backplane structure and communication equipment

Cross-references to related applications

This disclosure claims the priority of Chinese patent application CN202210513498.6 titled "Backplane Structure and Communication Equipment" filed on May 11, 2022, the entire content of which is incorporated into this disclosure by reference.

Technical field

The present disclosure relates to the field of communication technology, and in particular, to a backplane structure and communication equipment.

Background technique

In electronic communication products, the backplane is usually used for the signal connection and electrical connection of the main components such as the service board, switching board and control board of the communication equipment socket. That is, the backplane needs to transmit the signals between the single boards and at the same time The current carried is supplied to each board.

With the rapid development of the communications industry, the forwarding volume of a single machine is increasing day by day. The increase in service slots has led to an increase in the height of the plug-in box and an increase in the size of the backplane. Moreover, with the development of high-speed interconnection, the internal wiring of the backplane can no longer meet the requirements for frequencies greater than 50MHz high-speed signal interconnection needs.

At present, the backplane has been eliminated from participating in the high-speed interconnection between single board signals, and the intersection between single board groups is directly used for signal transmission to improve the signal transmission speed between each single board. In this way, the backplane The board design only needs to accommodate low-speed signal routing. In the related art, in order to realize signal transmission between single board groups and single board groups, large-area holes need to be dug in a large-sized backplane so that connectors on the single board groups can pass through. However, digging out a large area of the backplane will result in low utilization and high loss of the entire backplane.

Contents of the invention

The present disclosure provides a backplane structure and communication equipment.

In a first aspect, embodiments of the present disclosure provide a backplane structure for communication equipment. The communication equipment includes a first single board group and a second single board group arranged to intersect. The backplane structure includes: a first backplane, a connecting In the first single board group, the first backplane extends along the distribution direction of the first single board group; the first connector connects to the first backplane; the second backplane connects to the second single board group, and the second backplane extends along the distribution direction of the first single board group. The distribution direction of the two single board groups extends; the second connector is connected to the second backplane, and the second connector is arranged corresponding to the first connector; the conductive component is detachably connected between the first backplane and the second backplane between; one end of the conductive component is electrically connected to an end of the first backplane close to the first connector, and the other end of the conductive component is electrically connected to a side of the second backplane away from the second connector; the second backplane is assembled on the first On the backplane, the second connector is connected to the first connector.

In a second aspect, an embodiment of the present disclosure also provides a communication device, including the backplane structure as described above.

Description of drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present disclosure or related technologies, the following will briefly introduce the drawings needed to describe the embodiments or related technologies. Obviously, for those of ordinary skill in the art, Other drawings can also be obtained based on these drawings without incurring any creative effort. In addition, in the drawings, the same components are given the same reference numerals, and the drawings are not drawn to actual scale.

Figure 1 is an exploded structural schematic diagram of the backplane structure provided by an embodiment of the present disclosure;

Figure 2 is a partial enlarged view of Figure 1;

Figure 3 is a schematic three-dimensional structural diagram of a conductive component provided by an embodiment of the present disclosure;

Figure 4 is a first perspective partial assembly view of the backplane structure provided by an embodiment of the present disclosure;

Figure 5 is a second perspective partial assembly view of the backplane structure provided by an embodiment of the present disclosure; and

Figure 6 is a third perspective partial assembly view of the backplane structure provided by an embodiment of the present disclosure.

Explanation of reference symbols:

100. First backplane; 200. First connector; 300. Second backplane; 400. Second connector;

500. Conductive component; 510. First conductive member; 520. Second conductive member; 530. Third conductive member; 531. Conductive protrusion; 532. First connecting section; 533. Second connecting section; 540. First Connecting claw; 550, second connecting claw;

600. Locking parts; 700. Guide parts; 800. Fitting parts;

X, the distribution direction of the first single board group; Y, the distribution direction of the second single board group.

Detailed ways

In order to make the purpose, technical solutions and advantages of the embodiments of the present disclosure clearer, the technical solutions in the embodiments of the present disclosure will be clearly and completely described below in conjunction with the drawings in the embodiments of the present disclosure. Obviously, the described embodiments These are some embodiments of the present disclosure, but not all embodiments. Based on the embodiments in this disclosure, all other embodiments obtained by those of ordinary skill in the art without any creative efforts fall within the scope of protection of this disclosure.

In electronic communication products, business boards, switching boards, control boards, etc. are the main components of communication equipment sockets. Signals and power supplies need to be interconnected between them to ensure the orderly conduct of business. As an important component of the communication equipment socket, the backplane is usually used to transmit signals between boards and distribute the current output by the power module to each board. With the rapid development of the communications industry, the forwarding volume of a single machine is increasing day by day. The increase in service slots has led to an increase in the height of the plug-in box, and an increase in the size of the backplane. Moreover, with the development of high-level interconnection, the internal routing of the backplane Lines can no longer meet the interconnection needs of high-speed signals. In related technologies, the backplane has been eliminated from participating in the high-speed interconnection of signals on each single board, and single board groups are directly used to intersect with single board groups for signal transmission to increase the signal transmission speed between individual boards. In the related art, in order to realize signal transmission between single board groups and single board groups, large-area holes need to be dug in large-sized backplanes for connectors on the single board groups to pass through. However, cutting out a large area of the backplane will result in low utilization and high loss of the entire backplane; moreover, the remaining part of the backplane is facing the direction of the air duct of the communication equipment, which will produce greater resistance to the gas in the air duct. It hinders the heat dissipation of communication equipment.

Based on this, the present disclosure proposes a backplane structure. The backplane junction includes: a first backplane 100 connected to a first single board group (not shown in the figure), the first backplane 100 extending along the distribution direction of the first single board group; a first connector 200 connected to the first single board group (not shown in the figure). The backplane 100; the second backplane 300 is connected to the second single board group (not shown in the figure), and the second backplane 300 extends along the distribution direction of the second single board group; the second connector 400 is connected to the second backplane group. The board 300 has a second connector 400 corresponding to the first connector 200; a conductive component 500 is detachably connected between the first backplane 100 and the second backplane 300; one end of the conductive component 500 is electrically connected to the first backplane. One end of the board 100 close to the first connector 200 and the other end of the conductive component 500 are electrically connected to a side of the second backplane 300 away from the second connector; the second backplane 300 is assembled on the first backplane 100 and the second The connector 400 is docked with the first connector 200 . The present disclosure splits the traditional low-speed backplane into two parts and assembles the two parts of the backplane again to improve the utilization rate of the backplane board.

Further, the first single board group and the second single board group are arranged to intersect. Compared with the traditional backplane structure, a large-size backplane connection is provided at the connection between the first single board group and the second single board group. This disclosure The first single board group is connected through the first backplane 100, and the second single board group is connected through the second backplane 300, and then the first backplane 100 and the second backplane 300 are electrically connected through a conductive component, and through The first connector 200 provided on the first backplane 100 and the second connector 400 provided on the second backplane 300 realize low-speed signal transmission between the two backplanes. Optionally, by arranging the first back plate 100 and the second back plate 300 perpendicular to each other, the solution in the related art of only arranging one large-sized back plate and digging holes in the large-sized back plate is avoided. The two independent back plates are The vertical arrangement of the backplane reduces the wind resistance in the direction of the air duct of the communication equipment and improves the heat dissipation effect of the communication equipment.

Figure 1 shows an exploded view of the backplane structure provided by an embodiment of the present disclosure; Figure 2 shows a partial enlarged view of Figure 1; Figure 3 shows a schematic three-dimensional structural view of the conductive component 500 provided by an embodiment of the present disclosure; Figure 4 to Figure 6 shows the partial assembly diagram of the backplate structure at different angles.

Referring to Figures 1 and 2, the present disclosure provides a backplane structure for communication equipment. The communication equipment includes a first single board group and a second single board group arranged to intersect. The backplane structure includes: a first backplane 100 , the first connector 200, the second backplane 300, the second connector 400 and the conductive component 500.

The first backplane 100 is connected to the first single board group, and the first backplane 100 extends along the distribution direction of the first single board group.

The first connector 200 is connected to the first backplane 100 .

The second backplane 300 is connected to the second single board group, and the second backplane 300 extends along the distribution direction of the second single board group.

The second connector 400 is connected to the second backplane 300 and is arranged corresponding to the first connector 200 .

The conductive component 500 is detachably connected between the first backplane 100 and the second backplane 300; one end of the conductive component 500 is electrically connected to an end of the first backplane 100 close to the first connector 200, and the other end of the conductive component 500 One end is electrically connected to a side of the second backplane 300 facing away from the second connector.

The second backplane 300 is assembled to the first backplane 100 , and the second connector 400 is docked with the first connector 200 .

In this embodiment, by optimizing the setting of the backplane structure, the problem of low utilization rate caused by digging large-area holes in the backplane is avoided, the loss of the backplane is reduced, and the utilization rate of the backplane is improved. It should be explained that the distribution direction of the first single board group is in the X direction of Figure 1, and the distribution direction of the second single board group is in the Y direction of Figure 1.

The backplane structure is configured to include at least a combined component of the first backplane 100 , the second backplane 300 and the conductive component 500 . The first backplane 100 is configured to correspond to the first board group of the communication device to realize low-speed signal transmission and electrical connection between the first backplane 100 and the first board group; the second backplane 300 corresponds to the communication device The second single board group is arranged to realize low-speed signal transmission and electrical connection between the second backplane 300 and the second single board group; the conductive component 500 is arranged between the first backplane 100 and the second backplane 300 time to realize current transmission between the first backplane 100 and the second backplane 300 . It should be explained that the first backplane 100 is also used for docking the power module, main control board and switching board of the system (mainly used for low-speed signal transmission and partial power transmission of the docking switching board); the second backplane 300 is also used for Interfacing with the service board (mainly used for low-speed signal transmission and partial power transmission of the interfacing service board).

At the same time, the first connector 200 is connected to the first backplane 100, and the second connector 400 is connected to the second backplane 300; when the second backplane 300 is assembled and connected to the first backplane 100, the The second connector 400 is docked with the first connector 200, so as to realize low-speed signal interconnection between the first backplane 100 and the second backplane 300, thereby realizing low-speed signal interconnection of the entire system. The entire backplane structure is simple and easy to assemble; while reducing the loss of traditional large-size backplanes, it also improves the utilization rate of the backplane structure. It should be explained that the second connector butting with the first connector means that when the second backplane 300 is assembled on the first backplane 100 , the second connector 400 is fitted into the first connector 200 , or The second connector 400 is connected to the first connector 200 so as to achieve signal communication between the second connector 400 and the first connector 200 .

For example, but not limited to, the first connector 200 is a low-speed straight male connector, and the second connector 400 is a low-speed angled female connector. The conductive component 500 is a conductive copper bar or other conductive metal bar.

In order to further explain the arrangement method of the backplane structure in the present disclosure, the first single board group is distributed at horizontal intervals, and the second single board group is distributed at vertical intervals. Of course, in other embodiments, the first single board group can also be distributed at vertical intervals, and the second single board group can also be distributed at horizontal intervals. The arrangement principle of the backplane structure is the same, and will not be described in detail here. .

The first single board group includes a plurality of first single boards, the boards of the first single boards are arranged vertically, and the plurality of first single boards are spaced apart in the horizontal direction and arranged parallel to each other. The second single board group includes a plurality of second single boards, the boards of the second single boards are arranged horizontally, and the plurality of second single boards are spaced apart in the vertical direction and arranged parallel to each other. Each first single board and the plurality of second single boards are perpendicular to each other, and each second single board and the plurality of first single boards are perpendicular to each other. That is, the first single board group and the second single board group are arranged perpendicularly to each other. At this time, a plurality of vertical air ducts in the vertical direction are formed between the plurality of first single boards, and a plurality of horizontal air ducts in the horizontal direction are formed between the plurality of second single boards. The duct is connected with multiple horizontal air ducts to form an air duct system for communication equipment.

At this time, for example but not limited to, the first back plate 100 and the second back plate 300 are located at the intersection of the vertical air duct and the lateral air duct. The first backplane 100 is arranged laterally on the top of the plurality of first single boards and remains connected to each first single board; the second backplane 300 is vertically arranged on the front side of the plurality of second single boards and connected with each first single board. Each second single board remains connected; then, conduction between the first backplane 100 and the second backplane 300 is achieved through a conductive component 500, and through the first connector provided on the first backplane 100 200 and the second connector 400 provided on the second backplane 300 realize the signal interconnection between the first backplane 100 and the second backplane 300. In this way, the first single board group and the second backplane group are realized. Low-speed signal interconnection and electrical connection between single board groups. In this way, since the first backplane 100 is disposed on the top of the communication device and the second backplane 300 is disposed on the side of the communication device, the obstruction of the backplane structure at the intersection of the vertical air duct and the lateral air duct is reduced, thereby improving communication The cooling effect of the device.

Optionally, the first single board group and the second single board group form a mutually perpendicular structure, and the backplane structure is provided at a connection between the first single board group and the second single board group. The first backplane 100 extends horizontally, the second backplane 300 extends longitudinally, the second connector 400 connects the side of the second backplane 300 toward the first connector 200 , and the second connector 400 is located on the side of the second backplane 300 edge. In this way, the entire backplane structure is more compact, requiring fewer consumables and lower costs.

Referring to FIGS. 2 and 3 , in some possible implementations, the conductive component 500 includes a connected first conductive member 510 and a second conductive member 520 . The first conductive member 510 extends in the same direction as the first backplane 100 , and the second conductive member 520 extends in the same direction as the first backplane 100 . The conductive member 520 extends in the same direction as the second backplane 300 . The first conductive member 510 is used to electrically connect to the first backplane 100 , and the second conductive member 520 is used to electrically connect to the second backplane 300 .

In this embodiment, the structure of the conductive component 500 is optimized. The conductive component 500 is configured to include at least a combined component composed of a first conductive member 510 and a second conductive member 520 . One end of the first conductive member 510 is connected to one end of the second conductive member 520 to form an L-shaped structure.

For example, but not limited to, the length of the first conductive member 510 is longer than the length of the second conductive member 520 . The first conductive member 510 extends horizontally and is electrically connected to the first backplane 100; the second conductive member 520 extends in the vertical direction and is electrically connected to the second backplane 300. In this way, the first backplane 100 and the second backplane 300 are electrically connected through the first conductive member 510 and the second conductive member 520 arranged in an L-shaped structure, thereby satisfying the signal transmission between the two backplanes. need.

Optionally, the feature of the second backplane 300 extending along the distribution direction of the second single board group is utilized, so that the second backplane 300 itself with a depth in this direction can meet the current conduction requirements. In this way, the second backplane 300 can be The end of the two conductive members 520 away from the first conductive member 510 is connected to the side of the second back plate 300 close to the first back plate 100 , thereby realizing the transmission of current between the first back plate 100 and the second back plate 300 . Moreover, in the related art, the second conductive member 520 is at least the entire length of the second back plate 300. In contrast, in this embodiment, the length dimension of the second conductive member 520 is only a part of the length of the second back plate 300. , which only needs to satisfy the connection between the first conductive member 510 and the second backplane 300 , greatly shortening the length of the second conductive member 520 along the distribution direction of the second single board group, and reducing the cost of the conductive component 500 Raw material costs. It should be explained that the current flow path at this time is: first entering the first conductive member 510 from the first backplane 100, then entering the second conductive member 520 through the first conductive member 510, and finally entering the third conductive member 520 through the second conductive member 520. The second backplane 300 can realize electrical conduction between the two backplanes.

For example, but not limited to, the first conductive member 510 is a copper conductive sheet, and the second conductive member 520 is a copper conductive sheet. To facilitate processing, the first conductive member 510 and the second conductive member 520 are integrally formed.

Referring to FIGS. 3 and 4 , in some possible implementations, the second backplane 300 is provided with an electrical incoming position, and the conductive component 500 further includes a third conductive member 530 , and the third conductive member 530 is electrically connected to the second conductive member 520 Towards one side of the second back plate 300, and the third conductive member 530 extends in a direction close to the second back plate 300. The third conductive member 530 is provided with conductive protrusions 531, and the conductive protrusions 531 face the second back plate 300. bulge.

The second back plate 300 is assembled to the first back plate 100, and the conductive protrusions 531 contact the electrical incoming position.

In this embodiment, the structure of the conductive component 500 is further optimized. On the basis of the first conductive member 510 and the second conductive member 520, a third conductive member 530 is added. The third conductive member 530 is used to conduct the second conductive member 520 and a designated position of the second backplane 300. In order to facilitate the replacement and maintenance of the third conductive member 530, the third conductive member 530 is detachably connected to the second conductive member 520.

For example, but not limited to, the third conductive member 530 has a sheet-like structure, and there are two third conductive members 530 , and the two third conductive members 530 are arranged in the extending direction of the second conductive member 520 .

The third conductive member 530 includes a connected first connection section 532, a conductive protrusion 531 and a second connection section 533. The first connection section 532 is detachably connected to the side of the second conductive member 520, and the conductive protrusion 531 faces toward The second connecting section 533 protrudes in a direction close to the second back plate 300 , and the end of the second connecting section 533 away from the conductive protrusion 531 is tilted away from the second back plate 300 , and only the conductive protrusion 531 contacts the second back plate 300 friction, and the first connecting section 532 and the second connecting section 533 are at a certain distance from the second back plate 300, so as to reduce the friction between the third conductive member 530 and the second back plate 300 when the second back plate 300 is assembled on the first back plate 100. The friction force of the back plate 300; at the same time, through the structural arrangement of the third conductive member 530, the electrical conduction area between the third conductive member 530 and the second back plate 300 (that is, the conductive protrusion 531 and the electrical incoming position are reduced). contact area), reducing the investment of high-cost materials (materials required for the conductive bumps 531) and reducing the production cost.

For example, but not limited to, the conductive protrusion 531 is made of soft material, and the first connecting section 532 and the second connecting section 533 are made of rigid material. In this way, the connection tightness and rigidity of the third conductive member 530 and the second conductive member 520 are improved through the first connection section 532; at the same time, the conductive protrusion 531 has a certain degree of flexibility, which is beneficial to reducing the impact of the third conductive member 530 on the second conductive member 530. The second connecting section 533 expands in a trumpet shape to facilitate the insertion of the second backing plate 300 into the third conductive member 530 toward the side of the first backing plate 100 .

It should be explained that the end of the second connecting section 533 away from the conductive protrusion 531 refers to the suspended end of the second connecting section 533 , and the suspended end is tilted in a direction away from the second back plate 300 to connect the second connecting section 533 to the second back plate 300 . A certain gap is reserved between the connecting section 533 and the second back plate 300. When the second back plate 300 is assembled to the first back plate 100, the suspended end of the second connecting section 533 is prevented from scratching/scratching the second back plate. The surface of the board 300.

Referring to FIGS. 4 to 6 , in some possible implementations, the conductive component 500 further includes a plurality of first connection claws 540 , and the plurality of first connection claws 540 are distributed on the first conductive member 510 along the extension direction of the first conductive member 510 . 510. The first connecting claw 540 is used to electrically connect the first conductive member 510 and the first backplane 100.

In this embodiment, the structure of the conductive component 500 is further optimized. A plurality of first connecting claws 540 are provided between the first conductive member 510 and the first back plate 100 . For example, but not limited to, the first connecting claw 540 has a sheet-like structure, one end of the first connecting claw 540 is connected to the top of the side wall of the first conductive member 510 , and the other end of the first connecting claw 540 faces away from the top of the first conductive member 510 direction extends.

In some embodiments, to facilitate processing, the first connecting claw 540 and the first conductive member 510 are integrally formed. The first connecting claw 540 is connected and fastened with the first back plate 100 through screws/bolts.

Referring to FIGS. 3 to 6 , in some possible implementations, the conductive component 500 further includes a second connecting claw 550 , and the second connecting claw 550 is used to electrically connect the second conductive member 520 and the third conductive member 530 .

In this embodiment, the structure of the conductive component 500 is further optimized. A second connecting claw 550 is provided between the second conductive member 520 and the third conductive member 530 . For example, but not limited to, the second connecting claw 550 has a sheet-like structure, one end of the second connecting claw 550 is connected to the second conductive member 520 , and the other end is connected to the third conductive member 530 .

In some embodiments, the second connecting claw 550 and the second conductive member 520 are integrally formed, thereby reducing assembly procedures and improving assembly efficiency of the backplane structure. The second connecting claw 550 is connected and fastened with the third conductive member 530 through screws/bolts.

Referring to FIGS. 2 to 6 , in some possible implementations, the backplate structure further includes a plurality of locking parts 600 , and the locking parts 600 are used to lock the first connecting claw 540 and the first backplate 100 .

In this embodiment, the connection method between the first connecting claw 540 and the first back plate 100 is set. The first connecting claw 540 is detachably connected to the first back plate 100 . When the backplane structure needs to be used, the first connecting claw 540 and the first backplane 100 can be locked by the locking member 600; when the conductive component 500 needs to be replaced, contact the locking member 600 to pair the first connection The claw 540 and the first back plate 100 can be fastened.

For example, but not limited to, the locking member 600 is a screw/bolt.

In some examples, two first conductive members 510 are provided, and the two first conductive members 510 are arranged one above the other. There are two second conductive members 520 , and the two second conductive members 520 are overlapped on the left and right; a first conductive member 510 and a second conductive member 520 respectively form an L-shaped structure. At this time, the first connecting claws 540 are arranged at intervals on the side wall of the upper first conductive member 510, and the second connecting claws 550 are respectively provided at one end of the two second conductive members 520 away from the first conductive member. . There are two third conductive members 530 , and the two third conductive members 530 are respectively connected to the two second connecting claws 550 and the two second conductive members 520 .

In some possible implementations, the backplane structure further includes a plurality of locking members 600. The second backplane 300 is assembled to the first backplane 100. The locking members 600 are used to lock the third conductive member 530 and the second backplane. Plate 300.

In this embodiment, the connection method between the third conductive member 530 and the second backplane 300 is set. In order to improve the connection tightness between the second backplane 300 and the third conductive member 530, a plurality of locking members 600 are provided. The locking member 600 is used after the second back plate 300 is assembled on the first back plate 100. At this time, the relative position of the second back plate 300 and the first back plate 100 is fixed, in order to further strengthen the second back plate 300 and the first back plate 100. The stability of the relative position of the first back plate 100 is achieved by fixing the relative position of the second back plate 300 through the locking member 600 . In this way, even if the backplane structure vibrates, jitters, moves externally, etc. during use, the relative positions of the second backplane 300 and the first backplane 100 remain consistent, which is beneficial to improving the signal transmission stability of the backplane.

For example, but not limited to, the locking member 600 is a screw/bolt.

Referring to Figures 2 and 5, in some possible implementations, the backplane structure also includes a guide part 700 and a matching part 800. The guide part 700 is provided on the first backplane 100 close to the first connector 200, and the fitting part 800 is close to the first connector 200. The two connectors 400 are provided on the second backplane 300 , and the matching part 800 is set on the guide part 700 .

In this embodiment, the structure of the backplane structure is further optimized. In order to improve the docking accuracy of the second connector 400 and the first connector 200, a guide part 700 and a matching part 800 are provided.

Optionally, there are two guide members 700 and two matching members 800 . Two guide parts 700 are respectively provided on the upper and lower sides of the first connector 200, and two matching parts 800 are respectively provided on the upper and lower sides of the second connector 400. One guide part 700 is provided corresponding to one matching part 800. In this way, it can Through the guiding function of the guide part 700 and the matching part 800, the second connector 400 and the first connector 200 are accurately connected, which improves the accuracy of the connection between the second connector 400 and the first connector 200, and improves the backplane Structural assembly efficiency.

For example, but not limited to, the guide member 700 is a guide pin, and the matching member 800 is a guide pin sleeve. The guide pin sleeve is provided with a guide hole for the guide pin to pass through.

In some possible implementations, the side of the guide 700 away from the first backplane 100 protrudes from the side of the first connector 200 away from the first backplane 100 .

In this embodiment, in order to further improve the guiding effect of the guide member 700 and the matching member 800 on the two connectors, the guide member 700 is disposed protruding from the first connector 200 . It should be understood that the protrusion here means that the side of the guide 700 away from the first backplane 100 is higher than the side of the first connector 200 away from the first backplane 100 , that is, when vertical to the first backplane, In the direction of the board 100 , the length of the guide 700 is greater than the length of the first connector 200 . The fitting part 800 cooperates with the guide part 700. The side of the fitting part 800 away from the second back plate 300 also protrudes from the side of the second connector 400 away from the second back plate 300. In this way, the fitting part 800 is assembled on the second back plate 300. When connecting to the first backplane 100, the guide part 700 and the matching part 800 will cooperate first, and then under the guidance of the guide part 700 and the matching part 800, the second connector 400 will be docked with the first connector 200, which greatly improves the second connector 400. The docking accuracy of the connector 400 and the first connector 200.

In some possible implementations, the width size of the second backplane 300 is selected to only meet the optimum width size of the low-speed signal traces. At this time, the material cost of the second backplane 300 can be further reduced, and the wind resistance generated by the second backplane 300 can be minimized and the heat dissipation effect of the communication equipment can be improved.

Referring to FIG. 1 and FIG. 4 to FIG. 6 , in some possible implementations, the second back plate 300 and the first back plate 100 are arranged perpendicularly to each other.

In this embodiment, the second backplane 300 and the first backplane 100 are arranged vertically to each other, which can reduce the wind resistance of the backplane structure to the communication equipment and improve the heat dissipation efficiency. The width side of the second back plate 300 is perpendicular to the first back plate 100, and the length side of the second back plate 300 is perpendicular to the first back plate 100. In this way, the width direction of the second back plate 300 is in the same direction as the vertical air duct. Extending in the direction greatly reduces the contact area between the wind and the second back panel 300 when it flows from the vertical air duct to the horizontal air duct, reduces the wind resistance, improves the flow efficiency of the wind, and reduces the amount of heat taken away by the wind in the communication equipment. The time spent inside improves the heat dissipation efficiency.

It should be understood that being arranged perpendicular to each other means that a plurality of first single boards are spaced apart in the horizontal direction to form a longitudinal air duct between two adjacent first single boards, and a plurality of second single boards are arranged in a vertical direction. They are spaced apart to form transverse air ducts between two adjacent second single boards. The first back plate 100 is laterally connected to multiple first single boards, and the board surface of the first back plate 100 is connected to the transverse air ducts. Parallel, the second back plate 300 is longitudinally connected to a plurality of second single boards, and the plate surface of the second back plate 300 is perpendicular to the longitudinal air duct, and the extended surface of the plate surface of the first back plate 100 perpendicularly intersects with the second back plate 300; or, the first back panel 100 is laterally connected to a plurality of first single boards, and the panel surface of the first back panel 100 is perpendicular to the transverse air duct, and the second back panel 300 is longitudinally connected to a plurality of second boards. The single board and the plate surface of the second back plate 300 are parallel to the longitudinal air duct, and the extended surface of the plate surface of the second back plate 300 perpendicularly intersects with the plate surface of the first back plate 100 .

In a second aspect, embodiments of the present disclosure also provide a communication device provided with any of the above backplane structures.

In this embodiment, the structure of the backplane structure refers to the above-mentioned embodiment. Since this communication device adopts all the technical solutions of all the above-mentioned embodiments, it has at least all the beneficial effects brought by the technical solutions of the above-mentioned embodiments, which are not mentioned here. Let’s go over them one by one.

According to the backplane structure and communication equipment provided by embodiments of the present disclosure, the backplane structure includes: a first backplane connected to a first single board group of the communication equipment, and the first backplane extends along the distribution direction of the first single board group; The first connector is connected to the first backplane; the second backplane is connected to the second single board group of the communication equipment, and the second backplane extends along the distribution direction of the second single board group; the second connector is connected to the second backplane group. board, the second connector is arranged corresponding to the first connector; the conductive component is detachably connected between the first backplane and the second backplane; one end of the conductive component is electrically connected to the first backplane close to the first connector One end and the other end of the conductive component are electrically connected to a side of the second backplane away from the second connector; the second backplane is assembled on the first backplane, and the second connector is docked with the first connector. The technical solution of the present disclosure avoids the problem of low utilization rate caused by large-area drilling of large-sized backplanes by optimizing the arrangement of the backplane structure, reduces the loss of the backplane, and improves the utilization rate of the backplane. A first backplane, a second backplane and a conductive component are provided. The first backplane is provided corresponding to the first single board group of the communication device to realize low-speed signal transmission and partial transmission between the first backplane and the first single board group. For power flow, the second backplane is arranged corresponding to the second single board group of the communication device to realize low-speed signal transmission and partial power flow between the second backplane and the second single board group; the conductive component is arranged on the first backplane and the second backplane to realize current transmission between the first backplane and the second backplane. At the same time, a first connector is connected to the first backplane, and a second connector is connected to the second backplane. When the second backplane is assembled on the first backplane, the second connector docks with the first connector. , In this way, low-speed signal interconnection of the first backplane and the second backplane is achieved, thereby realizing low-speed signal interconnection of the entire system. The entire backplane structure is simple and easy to assemble; while reducing the loss of traditional large-size backplanes, it also improves the utilization rate of the backplane structure.

It should be noted that in this article, relational terms such as “first” and “second” are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply these There is no such actual relationship or sequence between entities or operations. Furthermore, the terms "comprises," "comprises," or any other variations thereof are intended to cover a non-exclusive inclusion such that a process, method, article, or apparatus that includes a list of elements includes not only those elements, but also those not expressly listed other elements, or elements inherent to the process, method, article or equipment. Without further limitation, an element defined by the statement "comprises a..." does not exclude the presence of additional identical elements in a process, method, article, or apparatus that includes the stated element.

The above descriptions are only specific embodiments of the present disclosure, enabling those skilled in the art to understand or implement the present disclosure. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be practiced in other embodiments without departing from the spirit or scope of the disclosure. Therefore, the present disclosure is not to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

A backplane structure is used for communication equipment. The communication equipment includes a first single board group and a second single board group arranged to intersect, wherein the backplane structure includes:

A first backplane is connected to the first single board group, and the first backplane extends along the distribution direction of the first single board group;

A first connector connected to the first backplane;

A second backplane is connected to the second single board group, and the second backplane extends along the distribution direction of the second single board group;

A second connector is connected to the second backplane, and the second connector is arranged corresponding to the first connector; and

A conductive component is detachably connected between the first backplane and the second backplane; one end of the conductive component is electrically connected to an end of the first backplane close to the first connector, so The other end of the conductive component is electrically connected to a side of the second backplane away from the second connector,

Wherein, the second backplane is assembled to the first backplane, and the second connector is docked with the first connector.
The backplane structure according to claim 1, wherein the conductive component includes a connected first conductive member and a second conductive member, the first conductive member extends in the same direction as the first backplane, and the third conductive member extends in the same direction as the first backplane. Two conductive members extend in the same direction as the second backplane, the first conductive member is electrically connected to the first backplane, and the second conductive member is electrically connected to the second backplane.
The backplane structure of claim 2, wherein the second backplane is provided with an electrical incoming position, and the conductive component further includes a third conductive member, and the third conductive member is electrically connected to the second conductive member. The element faces one side of the second back plate, and the third conductive element extends in a direction close to the second back plate. The third conductive element is provided with conductive protrusions, and the conductive protrusions face toward The second back plate protrudes;

The second backplane is assembled to the first backplane, and the conductive protrusions contact the power input position.
The backplane structure according to claim 3, wherein the conductive component further includes a plurality of first connection claws, the plurality of first connection claws are distributed on the first conductive member along an extension direction of the first conductive member. A conductive member, the plurality of first connecting claws are electrically connected to the first conductive member and the first backplane.
The backplane structure according to claim 4, wherein the conductive component further includes a second connection claw, the second connection claw is electrically connected to the second conductive member and the third conductive member.
The backplate structure according to claim 5, wherein the backplate structure further includes a plurality of locking parts, the plurality of locking parts lock the first connecting claw and the first backplate; and /or,

The backplane structure also includes a plurality of locking members, the second backplane is assembled to the first backplane, and the plurality of locking members lock the third conductive member and the second backplane. .
The backplane structure according to claim 1, wherein the backplane structure further includes a guide member and a fitting member, the guide member is provided on the first backplane, and the fitting member is provided on the second backplane. plate, and the matching piece is sleeved on the guide piece.
The backplane structure of claim 7, wherein a side of the guide member away from the first backplane protrudes from a side of the first connector away from the first backplane.
The backplane structure according to claim 1, wherein the second backplane and the first backplane are arranged perpendicularly to each other.
A communication device including the backplane structure according to any one of claims 1 to 9.