WO2023213333A1

WO2023213333A1 - Audio power amplifier based on magnetic wave conversion-type electron tube

Info

Publication number: WO2023213333A1
Application number: PCT/CN2023/102268
Authority: WO
Inventors: 林昌鹏
Original assignee: 林昌鹏
Priority date: 2022-07-02
Filing date: 2023-06-26
Publication date: 2023-11-09
Also published as: CN115279101A; CN115279101B

Abstract

Disclosed is an audio power amplifier based on a magnetic wave conversion-type electron tube. The audio power amplifier comprises support posts, a bearing plate, a placement frame, an magnetic leakage preventing vibration dampening engagement mechanism, and a heavy ion eliminating-type cooling mechanism; the supporting posts are arranged on a bottom wall of the placement frame, the bearing plate is arranged between the support posts below the placement frame, and the magnetic leakage preventing vibration damping engagement mechanism is arranged on an inner wall of the placement frame. The present invention belongs to the technical field of electron tube audio power amplifiers, and particularly relates to an audio power amplifier based on a magnetic wave conversion-type electron tube; the audio power amplifier based on a magnetic wave conversion-type electron tube provided by the present invention can perform effective regulation of the operating environment of a power amplifier, and can convert harmful magnetic waves into harmless thermal energy.

Description

A tube audio power amplifier based on magnetic wave conversion

Technical field

The invention belongs to the technical field of electronic tube audio power amplifiers, and specifically refers to a magnetic wave conversion type electronic tube audio power amplifier.

Background technique

Vacuum tube audio power amplifier is also called amplifying tube, which refers to a device used to increase sound decibels. For example, the application number is 201610352559. Inside, and arranged along the vertical direction, the bottom end of the electronic tube is slidably located on the guide rail, and sliding the electronic tube enables the electronic tube to be located above the bracket. There is also a vertically arranged inside the bracket. A ball screw, and the bottom end of the electronic tube is connected to the ball screw through a sleeve. A motor is fixed at the bottom of the bracket. A motor synchronization wheel is fixed on the rotor of the motor. The bottom of the ball screw A screw synchronous wheel is fixed at one end, and the motor synchronous wheel and the screw synchronous wheel are connected through a transmission belt. It solves the problem that the internal tubes of ordinary audio power amplifiers are easily damaged due to external placement and reduce the service life of the audio power amplifier.

The above device is mainly used to protect the internal tubes during use, but it ignores the problem that the device body will generate electromagnetic waves in a long-term working environment; therefore, it does not meet the existing needs, so we propose a tube audio power amplifier.

Technical solutions

In response to the above situation, in order to overcome the shortcomings of the existing technology, this solution provides a magnetic wave conversion type tube audio power amplifier. Aiming at the problem of positive ions in the magnetic waves combining with harmful aerosols in the air to form heavy ions, this solution creatively clamps the magnetic The structure is combined with the neutralization and elimination structure. Under the action of negative ions, the magnetic waves generated during the operation of the power amplifier are eliminated through the anti-magnetic leakage type vibration damping clamping mechanism and heavy ion elimination type cooling mechanism, and the power is reduced. The probability of the presence of heavy ions in the environment where the amplifier is used ensures the safety of personnel using the power amplifier;

The present invention provides a magnetic wave conversion-based electronic tube audio power amplifier that can effectively regulate the operating environment of the power amplifier and convert harmful magnetic waves into harmless heat energy.

The technical solutions adopted in this plan are as follows: This plan proposes a magnetic wave conversion-based tube audio power amplifier, including a support column, a load-bearing plate, a placement frame, an anti-magnetic leakage vibration-damping clamping mechanism and a heavy ion elimination cooling mechanism. The support columns are assembled on the bottom wall of the placement frame, the load-bearing plate is provided between the support columns below the placement frame, the anti-magnetic leakage vibration-damping clamping mechanism is provided on the inner wall of the placement frame, and the heavy ion elimination type cooling The mechanism is located on the upper wall of the bearing plate. The anti-magnetic leakage vibration-damping clamping mechanism includes a magnet absorption and vibration reduction mechanism and a two-column positioning mechanism. The magnet absorption and vibration reduction mechanism is located on the inner wall of the placement frame. The two-column positioning mechanism is On the side of the magnet absorbing and vibration reducing mechanism away from the placement frame, the heavy ion elimination cooling mechanism includes a mixing loading mechanism, a cooling fusion mechanism and a heat elimination and diversion mechanism. The mixing loading mechanism is located on the upper wall of the bearing plate, so The cooling and fusion mechanism is located inside the mixing loading mechanism, and the heat elimination and flow guide mechanism is located on the side wall of the magnet absorbing and vibration reducing mechanism.

As a further preference of this solution, the magnet absorbing and vibration reducing mechanism includes a base, a sleeve cylinder, a sleeve rod, a connecting plate, a spring, a magnet absorbing port and a ferrite absorbing layer. Multiple groups of the bases are installed on the inner wall of the placement rack. The sleeve cylinder is located on the side of the base away from the placement frame, the sleeve rod is sleeved inside the sleeve cylinder, the connecting plate is hingedly provided on the side of the sleeve rod away from the sleeve cylinder, and the spring is provided on the sleeve cylinder and the sleeve cylinder. Between the base and the spring on the outside of the rod, multiple groups of the magnetic suction ports are provided on the side walls of the placement rack, and the ferrite wave-absorbing layer is provided on the inner wall of the magnetic suction ports; the double-column positioning mechanism includes a clamping plate, rubber column and power amplifier, the clamping plate is located on the side of the connecting plate away from the sleeve rod, the clamping plates are arranged oppositely, and the rubber columns are symmetrically arranged in a group of two on the bottom wall and the upper wall of the clamping plate. The power amplifier is located between the clamping plates, and the rubber column fits the power amplifier; the clamping plate is pushed, and the sleeve rod slides along the inner wall of the cylinder through the elastic deformation of the spring to drive the clamping plates to move in opposite directions, and the power amplifier is placed between the clamping plates, stop applying external force to the clamping plates, and the spring returns to drive the clamping plates to clamp the power amplifier. The power amplifier and the rubber column are placed snugly. The electromagnetic waves generated by the power amplifier during use are absorbed by the ferrite. The wave layer absorbs the electromagnetic waves. After the ferrite absorbing layer absorbs the electromagnetic waves, the energy of the electromagnetic field is converted into heat energy and stored inside the ferrite absorbing layer. The vibration generated by the power amplifier during use is carried out through the elastic deformation generated by the force of the spring. buffer.

Preferably, the mixing loading mechanism includes a through port, a cooling box and a heat dissipation port. The through port is located on the upper wall of the bearing plate, the cooling box is located on the inner wall of the through port, and the heat dissipation port is located on the bottom wall of the cooling box; The cooling fusion mechanism includes a partition, a semiconductor refrigeration fin, a cooling fin, a heat transfer fin, a negative ion generator, a cooling port and a cooling fan. The partition is provided on the inner wall of the cooling box, and the semiconductor refrigeration fin is provided through the partition. wall, the cooling fin is located on the cooling end of the semiconductor refrigeration fin, the heat conducting fin is located on the heat dissipation end of the semiconductor refrigeration fin, the negative ion generator is located on the upper wall of the cooling box, and the power end of the negative ion generator runs through the cooling end. On the inner wall of the box, the cooling port is located on the upper wall of the cooling box, and the cooling fan is located inside the cooling fan; the heat elimination and flow guide mechanism includes a heat conduction port, a heat conduction copper column and a cooling copper column, and the heat conduction port is provided in multiple groups. On the upper wall of the placement rack, the heat-conducting copper pillar penetrates the heat-conducting port and is located on the upper wall of the ferrite absorbing layer, and the cooling copper pillar penetrates the cooling box above the partition and is located on the upper wall of the heat-conducting copper pillar; for power amplifiers in use Temperature cooling and heat dissipation, the semiconductor refrigeration fin cools the cooling fin, the semiconductor refrigeration fin heats the heat conducting fin, the heat conducting fin dissipates heat through the heat dissipation port, the cold conducting fin cools the air inside the cooling box above the partition, and the cooling fan The cold air is extracted and sprayed towards the power amplifier to cool down the power amplifier. When the power amplifier is running, it generates electromagnetic waves. The electromagnetic waves will emit positive ions that disrupt the normal physiological functions of the human body, especially when the positive ions combine with harmful aerosols in the air. The negative ions become heavy ions, which are more harmful. At this time, the negative ion generator transports negative ions to the inside of the cooling box through the power end. The negative ions fuse with the cold air and eject out of the cooling box. The negative ions neutralize the positive ions contained in the electromagnetic waves, causing the It loses its function and reduces the damage to personnel caused by the electromagnetic waves generated by the power amplifier. After the electromagnetic waves are eliminated, the internal temperature of the absorbing material gradually increases. In order to avoid the temperature generated by the absorbing material from affecting the use environment of the power amplifier, the iron The oxygen absorbing layer conducts the temperature into the interior of the heat-conducting copper column, and the heat-conducting copper column conducts the temperature into the interior of the cooling copper column. The end of the cooling copper column away from the heat-conducting copper column is located inside the cooling box above the partition, thereby affecting the ferrite The temperature generated by the absorbing layer is cooled down.

Specifically, the upper wall of the placement rack is provided with control buttons.

Among them, the control buttons are electrically connected to the semiconductor refrigeration chip and the negative ion generator respectively.

Among them, the control button model is SYC89C52RC-401.

beneficial effects

(1) Compared with the existing technology, this solution uses magnetic clamping. When the power amplifier is clamped for vibration reduction, the electromagnetic waves generated when the power amplifier is running are reduced through the wave-absorbing characteristics of the metal material. It eliminates absorption and converts magnetic wave energy into harmless heat energy for storage. Under the setting of the diversion structure, the temperature in the environment is cooled and controlled, so that the power amplifier can operate better;

(2) Through the setting of the neutralization structure, the unadsorbed magnetic waves in the operating environment of the power amplifier can be effectively neutralized, so that the harmful positive ions contained in the magnetic wave energy lose their effect, thereby avoiding The generation of heavy ions ensures the safety of personnel using the power amplifier.

Description of the drawings

Figure 1 is a schematic diagram of the overall structure of a magnetic wave conversion-based tube audio power amplifier proposed in this solution;

Figure 2 is a three-dimensional view of a magnetic wave conversion tube audio power amplifier proposed in this solution;

Figure 3 is an exploded view of a magnetic wave conversion-based tube audio power amplifier proposed in this solution;

Figure 4 is a top view of a magnetic wave conversion type tube audio power amplifier proposed in this solution;

Figure 5 is a cross-sectional view of part A-A of Figure 4;

Figure 6 is a cross-sectional view of part B-B of Figure 4;

Figure 7 is a partial cross-sectional view of C-C in Figure 4;

Figure 8 is a schematic structural diagram of the magnetic absorption and vibration reduction mechanism of a tube audio power amplifier based on magnetic wave conversion proposed in this plan;

Figure 9 is a schematic structural diagram of a hybrid loading mechanism for a magnetic wave conversion tube audio power amplifier proposed in this solution;

Figure 10 is a schematic structural diagram of a heat elimination and flow diversion mechanism for a tube audio power amplifier based on magnetic wave conversion proposed in this solution;

Figure 11 is an enlarged structural diagram of part A of Figure 1.

Among them, 1. Support column, 2. Bearing plate, 3. Placement frame, 4. Anti-magnetic leakage vibration-damping clamping mechanism, 5. Magnetism-absorbing and vibration-reducing mechanism, 6. Base, 7. Sleeve cylinder, 8. Sleeve rod, 9. Connecting plate, 10. Spring, 11. Magnetic port, 12. Ferrite absorbing layer, 13. Double-column positioning mechanism, 14. Clamping plate, 15. Rubber column, 16. Power amplifier, 17. Heavy Ion elimination cooling mechanism, 18. Mixed loading mechanism, 19. Passage port, 20. Cooling box, 21. Heat dissipation port, 22. Cooling fusion mechanism, 23. Partition, 24. Semiconductor refrigeration fin, 25. Cooling fin, 26. Thermal conductive sheet, 27. Negative ion generator, 28. Cooling port, 29. Cooling fan, 30. Heat elimination and diversion mechanism, 31. Thermal conductive port, 32. Thermal conductive copper pillar, 33. Cooling copper pillar, 34. Control button . The accompanying drawings are used to provide a further understanding of the present scheme, and constitute a part of the description. They are used to explain the present scheme together with the embodiments of the present scheme and do not constitute a limitation of the present scheme.

Embodiments of the invention

The technical solutions in the embodiments of the present solution will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present solution. Obviously, the described embodiments are only some of the embodiments of the present solution, not all of them; based on The embodiments in this solution, and all other embodiments obtained by those of ordinary skill in the art without creative efforts, fall within the scope of protection of this solution.

In the description of this scheme, it needs to be understood that the terms "upper", "lower", "front", "back", "left", "right", "top", "bottom", "inner", " The orientation or positional relationship indicated by "outside" is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present solution and simplifying the description. It does not indicate or imply that the device or element referred to must have a specific orientation or a specific location. azimuth structure and operation, so it cannot be understood as a limitation of this program.

As shown in Figure 1, Figure 2 and Figure 9, this solution proposes a magnetic wave conversion-based tube audio power amplifier, including a support column 1, a load-bearing plate 2, a placement frame 3, an anti-magnetic leakage vibration-damping clamping mechanism 4 and Heavy ion elimination type cooling mechanism 17, the support columns 1 are arranged in multiple groups on the bottom wall of the placement frame 3, the load-bearing plate 2 is provided between the support columns 1 below the placement frame 3, the anti-magnetic leakage vibration-damping clamp The mechanism 4 is located on the inner wall of the placement frame 3 , and the heavy ion elimination cooling mechanism 17 is located on the upper wall of the bearing plate 2 . The anti-magnetic leakage vibration damping clamping mechanism 4 includes a magnet absorption and vibration reduction mechanism 5 and a double-column positioning mechanism 13 , the magnet absorption and vibration reduction mechanism 5 is located on the inner wall of the placement frame 3, the double-column positioning mechanism 13 is located on the side of the magnet absorption and vibration reduction mechanism 5 away from the placement frame 3, the heavy ion elimination cooling mechanism 17 includes Mixing loading mechanism 18, cooling and fusion mechanism 22 and heat elimination and flow guide mechanism 30. The mixing loading mechanism 18 is located on the upper wall of the bearing plate 2. The cooling and fusion mechanism 22 is provided inside the mixing loading mechanism 18. The heat elimination and flow guide mechanism 30 The flow mechanism 30 is provided on the side wall of the magnet absorbing and vibration reducing mechanism 5 .

As shown in Figures 1-4, 7, 8 and 11, the magnet absorption and vibration reduction mechanism 5 includes a base 6, a sleeve cylinder 7, a sleeve rod 8, a connecting plate 9, a spring 10, a magnet attraction port 11 and The ferrite absorbing layer 12, the base 6 are arranged on the inner wall of the placement frame 3, the sleeve cylinder 7 is provided on the side of the base 6 away from the placement frame 3, and the sleeve rod 8 is sleeved inside the sleeve cylinder 7 , the connecting plate 9 is hingedly provided on the side of the sleeve rod 8 away from the sleeve cylinder 7, the spring 10 is provided between the base 6 and the spring 10 on the outside of the sleeve cylinder 7 and the sleeve rod 8, and the magnetic suction port 11 has multiple It is arranged on the side wall of the placement frame 3, and the ferrite absorbing layer 12 is arranged on the inner wall of the magnetic opening 11; the double-column positioning mechanism 13 includes a clamping plate 14, a rubber column 15 and a power amplifier 16. The holding plate 14 is provided on the side of the connecting plate 9 away from the sleeve rod 8. The holding plates 14 are arranged oppositely. The rubber posts 15 are symmetrically provided in a group of two on the bottom wall and the upper wall of the holding plate 14. The power amplifier 16 is arranged between the clamping plates 14, and the rubber column 15 is fit with the power amplifier 16; the clamping plate 14 is pushed, and the sleeve rod 8 slides along the inner wall of the sleeve cylinder 7 and drives the clamping plate 14 to phase through the elastic deformation of the spring 10. Back movement, place the power amplifier 16 between the clamping plates 14, stop applying external force to the clamping plate 14, the spring 10 resets and drives the clamping plate 14 to clamp the power amplifier 16, and the power amplifier 16 fits the rubber column 15 When placed, the electromagnetic waves generated by the power amplifier 16 during use are absorbed by the ferrite absorbing layer 12. After the ferrite absorbing layer 12 absorbs the electromagnetic waves, the energy of the electromagnetic field is converted into heat energy and stored inside the ferrite absorbing layer 12. , the vibration generated by the power amplifier 16 during use is buffered by the elastic deformation generated by the force of the spring 10 .

As shown in Figures 1-3, 5, 6, 9 and 10, the mixed loading mechanism 18 includes a through port 19, a cooling box 20 and a heat dissipation port 21. The through port 19 is provided on the bearing plate 2 On the upper wall, the cooling box 20 is provided on the inner wall of the passage 19, and the heat dissipation port 21 is provided on the bottom wall of the cooling box 20; the cooling fusion mechanism 22 includes a partition 23, a semiconductor refrigeration fin 24, a cooling fin 25, and a heat conduction fin. The plate 26, the negative ion generator 27, the cooling port 28 and the cooling fan 29. The partition 23 is provided on the inner wall of the cooling box 20, the semiconductor refrigeration chip 24 is provided on the upper wall of the partition 23, and the cooling fin 25 is provided on the inner wall of the cooling box 20. On the cooling end of the semiconductor refrigeration piece 24, the thermal conductive sheet 26 is provided on the heat dissipation end of the semiconductor refrigeration piece 24, the negative ion generator 27 is provided on the upper wall of the cooling box 20, and the power end of the negative ion generator 27 is installed through the cooling box 20 On the inner wall, the cooling port 28 is located on the upper wall of the cooling box 20, and the cooling fan 29 is located inside the cooling fan 29; the heat elimination and flow guide mechanism 30 includes a heat conduction port 31, a heat conduction copper column 32 and a cooling copper column 33. The heat conduction ports 31 are arranged in multiple groups on the upper wall of the placement frame 3 . The heat conduction copper pillars 32 penetrate the heat conduction ports 31 and are located on the upper wall of the ferrite absorbing layer 12 . The cooling copper pillars 33 penetrate the cooling area above the partition 23 . The box 20 is arranged on the upper wall of the heat-conducting copper pillar 32; to cool down the power amplifier 16 when in use, the semiconductor refrigeration sheet 24 cools the heat-conducting sheet 25, the semiconductor refrigeration sheet 24 heats the heat-conducting sheet 26, and the heat-conducting sheet 26 dissipates heat through The cooling fin 25 cools the air inside the cooling box 20 above the partition 23, and the cooling fan 29 extracts the cold air and sprays it to the power amplifier 16, thereby cooling the power amplifier 16. When the power amplifier 16 is running Generating electromagnetic waves, the electromagnetic waves will emit positive ions that disrupt the normal physiological functions of the human body, especially when the positive ions combine with harmful aerosols in the air to form heavy ions, which are more harmful. At this time, the negative ion generator 27 passes through the power end Negative ions are transported to the inside of the cooling box 20, and the negative ions are fused with the cold air and then ejected out of the cooling box 20. The negative ions neutralize the positive ions contained in the electromagnetic waves, making them useless and reducing the damage to personnel caused by the electromagnetic waves generated by the power amplifier 16. After the absorbing material eliminates electromagnetic waves, its internal temperature gradually increases. In order to prevent the temperature generated by the absorbing material from affecting the use environment of the power amplifier 16, the ferrite absorbing layer 12 conducts the temperature into the interior of the heat-conducting copper pillar 32 The heat-conducting copper pillar 32 conducts the temperature into the cooling copper pillar 33. One end of the cooling copper pillar 33 away from the heat-conducting copper pillar 32 is located inside the cooling box 20 above the partition 23, thereby reducing the temperature generated by the ferrite absorbing layer 12. Cool down.

As shown in Figure 1, the upper wall of the placement rack 3 is provided with a control button 34.

Among them, the control button 34 is electrically connected to the semiconductor refrigeration piece 24 and the negative ion generator 27 respectively.

Among them, the model of control button 34 is SYC89C52RC‑401.

When used specifically, in the first embodiment, the clamping plate 14 is pushed manually, and the sleeve rod 8 is pushed to slide along the inner wall of the sleeve cylinder 7. The elastic deformation of the spring 10 drives the clamping plate 14 to move in opposite directions, and the power amplifier 16 is placed on the clamping plate. 14, stop exerting external force on the clamping plate 14, and the elastic reset of the spring 10 drives the clamping plate 14 to clamp the power amplifier 16. The power amplifier 16 and the rubber column 15 are placed snugly. The electromagnetic waves generated by the power amplifier 16 during use It is absorbed by the ferrite absorbing layer 12. After the ferrite absorbing layer 12 absorbs the electromagnetic waves, the energy of the electromagnetic field is converted into heat energy and stored inside the ferrite absorbing layer 12. The vibration generated by the power amplifier 16 during use passes through The elastic deformation generated by the force of the spring 10 is buffered to reduce damage to the internal components of the power amplifier 16 during operation.

In the second embodiment, the temperature generated by the power amplifier 16 is cooled and dissipated. The control button 34 controls the startup of the semiconductor refrigeration piece 24. The cooling end of the semiconductor refrigeration piece 24 cools the cooling fin 25, and the heat dissipation end of the semiconductor refrigeration piece 24 conducts heat. The heat conductor 26 performs heating, the heat conductor 26 dissipates heat through the heat dissipation port 21, the cold conductor 25 cools the air inside the cooling box 20 above the partition 23, the control button 34 controls the cooling fan 29 to start, and the cooling fan 29 draws out the cold air and sprays it. To the power amplifier 16, the power amplifier 16 is cooled and dissipated. When the power amplifier 16 is running, it will generate electromagnetic waves. The electromagnetic waves emit positive ions that disrupt the normal physiological functions of the human body, especially when the positive ions combine with harmful aerosols in the air. The negative ions become heavy ions, which are more harmful. At this time, the control button 34 controls the negative ion generator 27 to start. The negative ion generator 27 transports negative ions to the inside of the cooling box 20 through the power end. The negative ions fuse with the cold air and then eject out of the cooling box 20. The negative ions neutralize the positive ions contained in the electromagnetic waves, causing them to lose their effect and reducing the damage to personnel caused by the electromagnetic waves generated by the power amplifier 16. After the electromagnetic waves are eliminated, the internal temperature of the absorbing material gradually increases. In order to avoid The generated temperature affects the use environment of the power amplifier 16. The ferrite absorbing layer 12 conducts the temperature into the interior of the heat-conducting copper pillar 32. The heat-conducting copper pillar 32 conducts the temperature into the inside of the cooling copper pillar 33. The cooling copper pillar 33 moves away. One end of the thermally conductive copper pillar 32 is placed inside the cooling box 20 above the partition 23 to cool down the temperature generated by the ferrite absorbing layer 12; repeat the above operation the next time it is used.

It should be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply that these entities or operations are mutually exclusive. any such actual relationship or sequence exists between them. Furthermore, the terms "comprises," "comprises," or any other variation thereof are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that includes a list of elements includes not only those elements, but also those not expressly listed other elements, or elements inherent to the process, method, article or equipment.

Although the embodiments of the present solution have been shown and described, those of ordinary skill in the art will understand that various changes, modifications, and substitutions can be made to these embodiments without departing from the principles and spirit of the present solution. and variations, the scope of the present solution is defined by the appended claims and their equivalents.

The present solution and its implementation modes have been described above. This description is not limiting. What is shown in the drawings is only one of the implementation modes of the present solution, and the actual structure is not limited thereto. In short, if a person of ordinary skill in the art is inspired by the invention and without departing from the creative purpose of the invention, can design similar structural methods and embodiments to the technical solution without creativity, they shall all fall within the protection scope of the invention.

Claims

An electronic tube audio power amplifier based on magnetic wave conversion, including a support column (1), a load-bearing plate (2), and a placement frame (3). It is characterized by: it also includes an anti-magnetic leakage vibration-reducing clamping mechanism (4) and heavy ions. Eliminating cooling mechanism (17), the support columns (1) are arranged in multiple groups on the bottom wall of the placement frame (3), and the load-bearing plate (2) is provided between the support columns (1) below the placement frame (3) , the anti-magnetic leakage type vibration damping clamping mechanism (4) is located on the inner wall of the placement frame (3), the heavy ion elimination type cooling mechanism (17) is located on the upper wall of the bearing plate (2), the anti-magnetic leakage type damping clamping mechanism (4) is located on the inner wall of the placement frame (3), The vibration clamping mechanism (4) includes a magnet absorption and vibration reduction mechanism (5) and a double-column positioning mechanism (13). The magnet absorption and vibration reduction mechanism (5) is located on the inner wall of the placement frame (3). The two-column positioning mechanism (13) is located on the side of the magnet absorbing and vibration reducing mechanism (5) away from the placement frame (3).
A tube audio power amplifier based on magnetic wave conversion according to claim 1, characterized in that: the heavy ion elimination cooling mechanism (17) includes a mixing loading mechanism (18), a cooling fusion mechanism (22) and a heat elimination mechanism. Flow guide mechanism (30), the mixing loading mechanism (18) is located on the upper wall of the bearing plate (2), the cooling and fusion mechanism (22) is provided inside the mixing loading mechanism (18), the heat elimination and flow guiding mechanism (30) is located on the side wall of the magnet absorbing and vibration reducing mechanism (5).
A tube audio power amplifier based on magnetic wave conversion according to claim 2, characterized in that: the magnet absorption and vibration reduction mechanism (5) includes a base (6), a sleeve cylinder (7), a sleeve rod (8), The connecting plate (9), the spring (10), the magnet absorbing port (11) and the ferrite absorbing layer (12), the base (6) is arranged in multiple groups on the inner wall of the placement frame (3), and the sleeve cylinder ( 7) It is located on the side of the base (6) away from the placement frame (3), and the sleeve rod (8) is sleeved inside the sleeve cylinder (7).
A tube audio power amplifier based on magnetic wave conversion according to claim 3, characterized in that: the connecting plate (9) is hingedly provided on the side of the sleeve rod (8) away from the sleeve cylinder (7), and the spring (10) is provided between the base (6) and the spring (10) outside the sleeve cylinder (7) and the sleeve rod (8). Multiple groups of the magnetic suction ports (11) are provided on the side wall of the placement frame (3). The said magnet is located on the inner wall of the magnetic suction port (11).
A tube audio power amplifier based on magnetic wave conversion according to claim 4, characterized in that: the double-column positioning mechanism (13) includes a clamping plate (14), a rubber column (15) and a power amplifier (16) , the clamping plate (14) is located on the side of the connecting plate (9) away from the sleeve rod (8), the clamping plates (14) are arranged oppositely, and the rubber columns (15) are arranged in a symmetrical group of two. It is provided on the bottom wall and the upper wall of the clamping plate (14), the power amplifier (16) is arranged between the clamping plates (14), and the rubber column (15) is fit with the power amplifier (16).
An electronic tube audio power amplifier based on magnetic wave conversion according to claim 5, characterized in that: the hybrid loading mechanism (18) includes a through port (19), a cooling box (20) and a heat dissipation port (21), so The passage (19) is provided on the upper wall of the bearing plate (2), the cooling box (20) is provided on the inner wall of the passage (19), and the heat dissipation port (21) is provided on the bottom wall of the cooling box (20).
. An electronic tube audio power amplifier based on magnetic wave conversion according to claim 6, characterized in that: the cooling fusion mechanism (22) includes a partition (23), a semiconductor cooling fin (24), and a cooling fin (25). ), thermal conductive sheet (26), negative ion generator (27), cooling port (28) and cooling fan (29), the partition (23) is located on the inner wall of the cooling box (20), the semiconductor refrigeration sheet (24 ) is provided through the upper wall of the partition (23), and the cooling fin (25) is provided at the cooling end of the semiconductor refrigeration fin (24).
A tube audio power amplifier based on magnetic wave conversion according to claim 7, characterized in that: the thermal conductive sheet (26) is located at the heat dissipation end of the semiconductor refrigeration sheet (24), and the negative ion generator (27) is located at The upper wall of the cooling box (20), the power end of the negative ion generator (27) penetrates the inner wall of the cooling box (20), the cooling port (28) is located on the upper wall of the cooling box (20), and the cooling fan (27) 29) is located in the cooling fan (29).
An electronic tube audio power amplifier based on magnetic wave conversion according to claim 8, characterized in that: the heat elimination and flow guide mechanism (30) includes a heat conduction port (31), a heat conduction copper column (32) and a cooling copper column ( 33), the heat conduction ports (31) are arranged in multiple groups on the upper wall of the placement frame (3).
A tube audio power amplifier based on magnetic wave conversion according to claim 9, characterized in that: the heat-conducting copper pillar (32) penetrates the heat-conducting port (31) and is provided on the upper wall of the ferrite absorbing layer (12), The cooling copper pillar (33) penetrates the cooling box (20) above the partition (23) and is located on the upper wall of the thermally conductive copper pillar (32).