WO2023209167A1

WO2023209167A1 - Light module of a motor vehicle signalling device, and motor vehicle signalling device incorporating same

Info

Publication number: WO2023209167A1
Application number: PCT/EP2023/061276
Authority: WO
Inventors: Alexandre Val; Zdravko Zojceski
Original assignee: Valeo Vision
Priority date: 2022-04-29
Filing date: 2023-04-28
Publication date: 2023-11-02
Also published as: FR3135163A1

Abstract

The invention relates to a light module (1) of a motor vehicle signalling device, comprising an array of light sources (2) mounted on an interconnection substrate (3) that comprises a stack of insulating layers (33) alternating with conducting layers (34) interconnected by means of vias (35). The light module (1) comprises at least one electronic component (4) for controlling and powering the array of light sources (2), the electronic component being buried in an internal layer of the interconnection substrate (3). This substrate (3) comprises a plurality of control vias (35a) electrically connecting the electronic component (4) to the array of light sources (2), the electronic component (4) being arranged to electrically power and selectively control each of the light sources (2) of the array by means of the plurality of control vias (35a).

Description

Title of the invention:

LIGHT MODULE OF A MOTOR VEHICLE SIGNALING DEVICE AND MOTOR VEHICLE SIGNALING DEVICE INCORPORATING SAME

[0001] The invention relates to the field of automotive lighting and light signaling. More specifically, the invention relates to the field of screens integrated into light modules for lighting or light signaling of motor vehicles.

[0002] It is known to integrate screens into lighting devices of motor vehicles, for example in rear lights, in front headlights, in shields or even on the front facade of the vehicle. These screens are for example produced by means of matrices of a large number of selectively controllable light sources, the dimensions of which are sufficiently small to make it possible to display information on these screens, for example in the form of a message or pictogram, with satisfactory resolution. This information thus makes it possible to improve the signaling of the motor vehicle, for example by contextualizing or accompanying a given signaling function with a message.

[0003] These light sources are generally mounted on a substrate, for example of the printed circuit type, on the back of which one or more controllers are mounted, each allowing selective control of a portion of these light sources. This controller is generally an integrated circuit encapsulated in a case, also called a "package", allowing the mechanical and electrical interfacing of the integrated circuit with the substrate, and ensuring thermal dissipation of the heat generated by the integrated circuit. Modern controller boxes are generally equipped with a matrix of connectors, for example ball type (also called BGA from “ball grid array”) or pads (also called LGA from English “land grid array”). ) which is only optimized to dissipate heat from the mounting face side of the package to the substrate.

[0004] These encapsulated controllers thus have various disadvantages.

[0005] From a thermal point of view, heat is generated significantly by the light sources and must therefore be dissipated, in order to avoid degrading their performance. It goes without saying that this heat cannot be dissipated on the side of the light sources, and that it must therefore be transmitted to the rear of the substrate. However, the presence of controllers on this side of the substrate reduces the space available for heat exchange, in particular for the arrangement of heat sinks. Likewise, it is necessary to maintain a significant space at this side of the substrate, both to arrange mechanical assembly solutions from the screen to the light device and to arrange connectivity solutions from the screen to devices. control and/or power units of this screen.

[0006] From a manufacturing point of view, these controllers must be assembled to the substrates by being soldered there, which complicates the production of light devices incorporating the screens, reduces their reliability and increases their cost. Furthermore, it is necessary to provide a connection harness between the screen and its control and/or power unit, which further complicates the assembly and further increases the cost of the lighting device.

[0007] From an electromagnetic compatibility point of view, the housing in which the controller is encapsulated must be shielded, in order to prevent the controller from emitting electromagnetic disturbances likely to impact the operation of another electronic component of the device. lighting, or even of the motor vehicle, and vice versa.

[0008] Finally, from a reliability point of view, the more the distance between the light sources and their controller increases, the more the control signals emitted by the controller to these light sources are likely to be weakened or interfered with during operation. their transmission before reaching the light sources, which can create reliability problems when displaying an image on the screen, with regard to the display instructions given to it.

[0009] There is thus a need for a light module capable of forming a screen of a signaling device of a motor vehicle, equipped with light sources and one or more controllers of these sources, and which resolves the disadvantages of light devices mentioned above.

The present invention is placed in this context, and aims to meet this need.

[0011] For these purposes, the subject of the invention is a light module of a signaling device for a motor vehicle, comprising a first matrix of light sources which can be selectively controlled and mounted on a first interconnection substrate comprising a stack of insulating layers alternating with conductive layers, each conductive layer being interconnected with another conductive layer by means of at least one via passing through an insulating layer, characterized in that it comprises at least one first electronic control component and powering the first matrix of light sources, said first electronic component being buried in the first substrate at an internal layer of this first substrate, and in that the first substrate comprises a first plurality of control vias connecting electrically the first electronic component to the first matrix of light sources, the first electronic component being arranged to electrically power and selectively control each of the light sources of the first matrix through said first plurality of control vias.

[0012] The invention, and in particular the fact that the electronic component(s), capable of controlling and powering the light sources of the first matrix, is buried in the interconnection substrate gives the light module various advantages. On the one hand, the interconnection substrate forms, due to the conductive layers, shielding with regard to the electromagnetic disturbances likely to be emitted or received by said electronic component. On the other hand, no soldering or assembly operation of a controller to the substrate is necessary, so that assembly is facilitated, the reliability of the light module is increased and the cost of the light module is reduced. Moreover, the distance between the light sources and the electronic component controlling these light sources is reduced, so that the integrity of the light source control signals emitted by this electronic component is improved. Finally, the face of the interconnection substrate opposite the reception face of the light sources is released, so that a large space, which can in particular correspond to more than 90% of this reception face, becomes available for example for arrange heat dissipation solutions, mounting elements from the light module to the signaling device, or even control and/or power supply units. In the latter case, in addition to reducing the overall size of the signaling device, it is possible to avoid the use of a connection harness between the light module and the control and/or power supply unit, which makes it possible to further reduce the size and cost of the signaling device.

[0013] In the present invention, the term “via” means a metallized hole, for example having a metal plating on its interior surface or being filled with a metal, such as copper and in particular equipped, at each of these ends, with 'a connection pad with a conductive layer. It could advantageously be a micro-via, that is to say a via whose diameter is substantially less than or equal to 350 microns, or even substantially less than or equal to 150 pm, in particular equal to 90 pm .

[0014] In the present invention, the interconnection substrate may be a printed circuit board, in which two successive conductive layers are separated by an insulating layer. If necessary, each conductive layer can be etched and drilled to define interconnection tracks connected to interconnection tracks of another conductive layer by means of vias. Each conductive layer may be interconnected with the conductive layer immediately above and/or below and/or with one or more conductive layers. The vias can thus be either buried vias, that is to say extending into the substrate without opening at one or other of the lower and upper faces of the substrate, blind vias extending in the substrate by opening at only one of the lower and upper faces of the substrate or through vias, in particular thermal, extending into the substrate by opening at each upper or lower face of the substrate. Likewise, the vias can be arranged within the substrate in a stepped and/or stacked configuration.

[0015] In the invention, the term “electronic component” means one or more integrated circuits, possibly associated with one or more passive components necessary for the operation of this or these integrated circuits. Said passive components may be electronic components, for example multilayer ceramic capacitors, silicon capacitors, resistors or inductors, or may be formed by a specific arrangement of part of one or more conductive layers, like two successive conductive layers which partially overlap to form a capacitor. Where applicable, the or each electronic component may be bare, that is to say not encapsulated in a casing, or alternatively encapsulated in a casing provided with electrical connection elements.

Advantageously, the first electronic component is arranged in a cavity reserved in an internal insulating layer, that is to say distinct from an insulating layer of the substrate exposed to the air, and is electrically connected to the conductive layer immediately superior and/or inferior to this insulating layer. It is thus possible to provide said cavity during the manufacture of the substrate, so that the first electronic component can be buried in the substrate during this manufacture.

Advantageously, the first matrix of light sources comprises at least 50 light sources, or even at least 200 light sources, or even at least 500 light sources.

[0018] In one embodiment of the invention, each of the light sources comprises at least one light-emitting semiconductor chip whose dimensions are between 150 pm and 400 pm. Such a chip is notably called miniled. If necessary, the light sources can be arranged on a first face of the substrate so as to be spaced from each other by a distance of less than 1 millimeter. Alternatively, each of the light sources comprises at least one light-emitting semiconductor chip whose dimensions are between 5 pm and 150 pm. Such a chip is notably called a microled. If necessary, the light sources can be arranged on a first face of the substrate so as to be spaced from each other by a distance of between 200 and 400 pm, or even less than or equal to 300 pm. Here we mean “distance between two light sources” the distance separating the center of one of these light sources from the center of the other of these light sources.

[0019] In one embodiment of the invention, the first matrix of light sources is mounted on a first face of the first interconnection substrate. Where applicable, the light module comprises a control unit capable of generating a control instruction of the first electronic component for the selective control of each of the light sources of the first matrix and/or a power supply control unit capable of generating a power supply of the first electronic component for powering the light sources of the first matrix, said control unit and/or said power supply control unit being mounted on a second face of the first interconnection substrate opposite the first face. We thus take advantage of the space freed up at the second face of the first substrate to arrange such a control unit or such a piloting unit there.

By “control unit” is meant a unit capable of receiving, from a connector of the light module, an instruction for displaying an image by the first matrix of sources light sources, the instruction being able in particular to contain said image, and arranged to generate an instruction for controlling each of the light sources from said instruction. By “power supply control unit” is meant a unit capable of receiving, from a connector of the light module, an external electrical power supply and arranged to convert this external electrical power supply into an electrical power supply adapted for powering the first matrix of light sources and the first electronic component.

[0021] Preferably, said control unit and/or said power supply control unit may be connected to the first electronic component by at least one via the substrate connected, directly or indirectly, to at least one conductive layer, called distribution layer , of the substrate. If necessary, said distribution layer may be connected to one or more connection pins of the first electronic component. If desired, said control unit and said conversion unit can be mounted on the same electronic circuit card attached to the second face of the first substrate.

[0022] Advantageously, the first matrix of light sources forms a passive matrix and the first electronic component is arranged to control said passive matrix through said first plurality of control vias as a function of the control instruction received from the unit control. For example, each control via will be able to control a row or a column of the first matrix of light sources.

[0023] In an alternative or cumulative embodiment, the first matrix of light sources is mounted on a first face of the first interconnection substrate, and the light module comprises a heat sink of the light module, said heat sink being mounted on a second face of the first interconnection substrate opposite the first face. We thus take advantage of the space freed at the level of the second face of the first substrate to arrange a dissipator there making it possible to dissipate the heat emitted by the light sources and by the first electronic component. It will also be noted that it is possible to distribute this heat over the entire surface of this second face, in order to optimize dissipation. The heatsink may be fitted with dissipation fins and/or be made of a material with high thermal conductivity.

[0024] According to an exemplary embodiment of the invention, the light module comprises a second matrix of light sources which can be selectively controlled and mounted on the first interconnection substrate, and at least one second electronic component for controlling and powering the second matrix of light sources, said second electronic component being buried in the first substrate at an internal layer of this first substrate. Where appropriate, the first substrate comprises a second plurality of control vias electrically connecting the second electronic component to the second matrix of light sources, the second electronic component being arranged to electrically power and selectively control each of the light sources of the second matrix at through said second plurality of control vias. In This example, we thus plan to be able to produce a screen with several matrices of light sources mounted on the same substrate, each matrix being controlled and powered independently by an electronic component buried in this substrate.

[0025] According to another embodiment of the invention, the light module comprises a second matrix of light sources which can be selectively controlled and mounted on a second interconnection substrate, and at least one second electronic component for controlling and powering the the second matrix of light sources, said second electronic component being buried in the second substrate at an internal layer of this second substrate, the first substrate being arranged adjacent to the second substrate. In this example, the screen is thus segmented into a plurality of juxtaposed sub-modules, and each formed by a matrix of light sources mounted on a substrate in which the electronic component controlling and powering this matrix of light sources is buried. Preferably, the second substrate has characteristics substantially identical to the first substrate. This type of architecture makes it possible to increase the manufacturing yield of the screen, to be able to standardize the sub-modules while offering great freedom as to the shape and dimensions of the screen, and to facilitate its repairability.

[0026] It could in particular be envisaged that the light module comprises more than two sub-modules and in particular at least 10 sub-modules juxtaposed with each other to form a screen.

Advantageously, an edge of the first substrate adjoins, whether contiguous or not, an edge of the second substrate, so that the first matrix of light sources abuts the second matrix of light sources. Preferably, the distance separating a first light source of the first matrix located at said edge of the first substrate and a second light source of the second matrix located at said edge of the second substrate and closest to the first light source is substantially less than or equal to the distance between two light sources of the first and/or second matrix. It is thus possible to hide the spaces between the sub-modules of the screen.

[0028] Advantageously, the first, respectively the second, matrix of light sources is mounted on a first face of the first, respectively of the second, interconnection substrate and the first and second interconnection substrates are mounted on the same support, in particular the same printed circuit board, via a second face opposite their first face. This support can thus serve on the one hand as a control unit support and/or power supply control for the different sub-modules and on the other hand as a mechanical fixing member of the screen formed by the sub-modules. to the signaling device.

[0029] Advantageously, said second face of each of the substrates supports an electrical connector mechanically coupled to said support and capable of transmitting an instruction of control and/or a power supply to the electronic component buried in said substrate. In other words, each substrate is mechanically supported by said electrical connector. For example, the electrical connector supported by each substrate can be connected, by a via, to the distribution layer connected to the electronic component buried in said substrate.

[0030] According to an exemplary embodiment, the module may include a control unit capable of generating a control instruction for each electronic component for the selective control of each of the light sources of each matrix and/or a power supply control unit capable of generating a power supply for each electronic component for powering the light sources of each matrix, the control unit and/or the power supply control unit being mounted on the support. Where applicable, the light module may include an inlet connector for a display instruction and/or an external power supply, said inlet connector being mounted on the support.

[0031] For example, the control instruction generated by the control unit from the display instruction and/or the electrical power converted from the external electrical power supply may pass through the support, in particular via electrical tracks formed on this support, up to the submodules, to which they are distributed for example via the connectors.

[0032] According to another example, the electronic component of each substrate is connected to at least one electronic component of another substrate so that all of the electronic components form a network, the electronic component of at least one substrate, in particular of each substrate, being capable of transmitting a control instruction to an electronic component of another substrate of said network to which this electronic component is connected. We could for example provide that this control instruction is dedicated to this other electronic component and contains an address associated with this other electronic component, or alternatively that this control instruction is contained in a global instruction by being associated with an address of this other electronic component. The electronic components can be interconnected to form a network according to a linear topology, also called in English “daisychain”, or a network according to a mesh topology, or according to any other topology. In this example, it is for example possible to transmit a power supply to each sub-module via the support while the control instructions are distributed by another means, for example by wires, cables or connection harnesses interconnecting the sub-modules or by wireless communication.

Advantageously, each substrate includes a wireless data receiver. If necessary, said receiver can be buried in an internal layer of said substrate or alternatively be mounted on the first face of said substrate. If applicable, said con- control may include a wireless data transmitter capable of transmitting said instructions for controlling the electronic components to the receivers of the substrates in which these components are buried, the receiver of each substrate being connected, for example via the distribution layer, to the electronic component buried in this substrate to transmit said control instruction received from the transmitter of the control unit to said electronic component.

[0034] In an exemplary embodiment of the invention, each substrate, and in particular the first face of each substrate, has a square or rectangular shape. Where applicable, each matrix of light sources may include 64, 144, 256, 576 or 1024 light sources, arranged in 8 lines by 8 columns, or in 12 lines by 12 columns, or in 16 lines by 16 columns, or in 24 lines by 24 columns, or 32 lines by 32 columns. The distance between two light sources may be identical for all light source matrices, or in a distinct variant from one light source matrix to another.

[0035] According to another embodiment of the invention, each substrate, and in particular the first face of each substrate, has a triangular or hexagonal shape. Alternatively, the shape of each substrate could be a diamond. More generally, it can be provided that each substrate can have a shape devoid of right angles. This type of configuration makes it possible to increase the density of light sources on the first face of the substrate, and therefore to reduce the distance between the light sources, compared to a square or rectangular configuration.

If necessary, each matrix of light sources may be organized in checkerboard rows and columns or alternatively in staggered rows and columns. Preferably, the rows and columns can be arranged parallel to the edges of the substrate. This characteristic makes it possible in particular to avoid aliasing effects, or in English "aliasing", at the edges of the substrate which would make visible the joining of the sub-modules of the screen. Alternatively, we could provide for the light sources of each matrix to be organized according to a mesh with a square pattern or a triangular pattern.

[0037] We could plan to combine the different embodiments cited above without departing from the scope of the present invention, in particular by providing a plurality of submodules each equipped with several matrices of light sources each controlled by a buried electronic component in the submodule substrate.

[0038] The invention also relates to a signaling device for a motor vehicle, characterized in that it comprises a light module according to the invention, said light module forming a screen of the device.

The present invention is now described using examples that are purely illustrative and in no way limiting the scope of the invention, and from the appended drawings, drawings in which the different figures represent: [0040] [Fig. 1] represents, schematically and partially, a sectional view of a light module according to an exemplary embodiment of the invention;

[0041] [Fig. 2] represents, schematically and partially, a side view of a light module according to another embodiment of the invention; And

[0042] [Fig. 3] represents, schematically and partially, a front view of the module of [Fig. 2],

[0043] In the description which follows, identical elements, by structure or by function, appearing in different figures retain, unless otherwise specified, the same references.

[0044] We described in [Fig. 1] a sectional view of a light module 1 according to one embodiment of the invention. In the example described, this light module 1 is intended to be integrated into a rear light of a motor vehicle, the light module 1 forming a screen. We could plan to integrate the light module 1 into another element of the motor vehicle, such as a headlight or a front light or a shield or an element of the front facade of the vehicle, without departing from the scope of the present invention.

The light module 1 comprises a matrix of light sources 2 mounted on a substrate 3.

[0046] In the example described, each of the light sources 2 comprises at least one light-emitting semiconductor chip, called a microled, whose dimensions are between 5 pm and 150 pm. The light module 1 comprises 64 light sources 2, arranged in a matrix manner, in 8 columns and 8 rows, the light sources 2 being spaced from each other by a distance less than or equal to 300 pm. It should be noted that we could consider other dimensions of the light sources, other distances between the light sources, other numbers of light sources or even other distributions of the light sources, without departing from the scope of the present invention.

Substrate 3 is a printed circuit board, or PCB, having a first face 31 and a second face 32 opposite the first face. The light sources 2 are mounted on the first face 31 of the substrate, which faces the outside of the signaling device in which the light module 1 is integrated.

It should be noted that, in the example described, the substrate 3 is a so-called multilayer PCB, comprising a stack of insulating layers 33 alternating with conductive layers 34, between the first and second faces 31 and 32.

[0049] Each conductive layer 34 is interconnected with another conductive layer 34 by means of at least one via 35 passing through an insulating layer 33. Each conductive layer 34 is etched and drilled to define connected interconnection tracks to interconnection tracks of another conductive layer 34 by means of vias 35. It will be noted that the first face 31 and the second face 32 are formed by faces of insulating layers 33 oriented towards the outside of the substrate 3 and perforated to be able to access the first, respectively the last conductive layer 34 and thus be able to mount electronic components on the surface of the substrate 3. [0050] The light sources 2 are thus mounted on the surface of the substrate 3, at the level of the openings, or openings, provided in the first face 32, and connected electrically, by welding or by bridging (also called in English "wire bonding") , to the first conductive layer 34 in order to be interconnected to the substrate 3.

The light module 1 comprises an electronic component 4 for controlling and powering the matrix of light sources 2. This electronic component 4 is buried in the substrate 3 at the level of an internal insulating layer 33 of this substrate 3.

[0052] More precisely, a cavity 33a was reserved in the internal insulating layer 33 during the manufacture of this layer 33 and the electronic component 4 was placed in this cavity, then electrically connected to the conductive layer 34 immediately below this insulating layer, in order to continue the manufacture of the substrate 3. It may be envisaged that the electronic component 4 is electrically connected to the conductive layer 34 immediately above, without departing from the scope of the present invention.

The electronic component 4 comprises an integrated circuit associated with passive components. It should be noted that the integrated circuit can be bare, as opposed to an integrated circuit encapsulated in a case, or “packaged”. It could be envisaged that the integrated circuit be encapsulated in a casing without departing from the scope of the present invention.

[0054] A plurality of control vias 35a electrically connects the electronic component 4 to the matrix of light sources 2. The matrix of light sources 2 forms a passive matrix where each row and each column of light sources 2 can be controlled by the component electronic 4 by means of a control via addressing this line or this column, in particular to control the electrical power supplied to the light sources of this line or this column. The electronic component 4 can thus electrically power and selectively control each of the light sources 2 through said plurality of control vias 35a, for example by successively scanning the lines then the columns of the matrix to control the electrical power supplied to each of the light sources 2.

[0055] The light module 1 comprises a connector (not shown) for receiving a display instruction from said plurality of light sources 2. It may be an instruction issued by a computer of the motor vehicle or of the monitoring device. signage for displaying a logo, message, pattern or pictogram. For example, it could be an instruction to display a pictogram intended to inform an external observer of the opening of a door of the motor vehicle, a pictogram intended to inform a following motorist the motor vehicle of the presence of ice on the road or even information relating to automobile traffic or even a pictogram intended to inform a pedestrian of the possibility or not of crossing the road. Said display instruction may include a representation of said pictogram.

The light module 1 also includes a connector (not shown) for receiving an external electrical power supply, for example from an electric battery of the vehicle automobile.

The light module 1 comprises a power control and control unit 5 connected to the connectors to receive the display instruction and the external power supply. The unit 5 is supported by a printed circuit board mounted on the second face 32 of the substrate 1 to the right of a hole, or opening, provided in the second face 32, in which is arranged a connector 51 connected to the unit 5 and electrically connected to the last conductive layer 34 in order to interconnect the unit 5 to the substrate 3.

The unit 5 is capable of generating, on the one hand, a control instruction for the electronic component 4, from the display instruction that it receives, for the selective control of each of the light sources 2 in order to that the matrix displays the pictogram of the display instruction. On the other hand, the unit 5 is capable of converting the external power supply into a power supply suitable for powering the matrix of light sources 2 and the electronic component 4. The control instruction and the power supply converted are thus distributed to the electronic component 4, via the connector 51 then vias 35 and conductive layers 34, called distribution layers.

The controller 4 is thus arranged to control each of the sources 2 of the passive matrix as a function of the control instruction received from the unit 5 and to power these sources 2 using the electrical power converted by unit 5.

[0060] Furthermore, the light module 1 comprises a heat sink 6 mounted on the second face 32 of the substrate 3. In the example described, this sink 6 is a part made of thermally conductive material, in particular aluminum, and provided with dissipation fins. Face 32 can be covered, partially, with a layer of gold or nickel, so that the heatsink 6 can be soldered to the substrate 3.

[0061] It will thus be noted that the second face 32 of the substrate 3 thus offers a space allowing the unit 5 and the dissipator 6 to be arranged there, so as to improve the thermal performance of the light module 1, to avoid the use of connection beams to a control or power supply unit distant from the substrate 3 and to reduce the distance between the unit 5, the electronic component 4 and the matrix of light sources 2. It will be noted that the second face 32 of the substrate offers also solutions for the arrangement of fixing members of the light module 1 to the rear light, or any other element, into which it must be integrated. Furthermore, the fact that the electronic component 4 is buried makes it possible to simplify the design of the light module 1 and to take advantage of the conductive layers 34 to provide shielding for the electronic component 4.

[0062] We have shown in [Fig. 2] a sectional view of a light module 10 according to another embodiment of the invention.

[0063] In this example, the light module 10 comprises a plurality of sub-modules 11 each comprising a matrix of light sources 2 which can be selectively controlled and mounted on an interconnection substrate 3, an electronic component 4 for control and power supply. mentation of the light source matrix 2 being buried in the substrate 3. The structure of each substrate 3 is similar to that of the module 1 shown in [Fig. 1] and will therefore not be developed again.

The submodules 11 are arranged adjacent to each other to together form a screen of a rear light, or another element, of a motor vehicle. Although only three submodules 11 have been represented in [Fig. 2], we could provide a significantly greater number of submodules without departing from the scope of the present invention.

In the example described, the substrates 3 of the submodules 11 are mounted on a common support 7, in this case the same printed circuit board. More precisely, the second face 32 of each of the substrates 3 supports an electrical connector 8 mechanically coupled to the card 7.

[0066] Card 8 also supports a power supply control and piloting unit 5, similar to that of module 1 of [Fig. 1], with the difference that this unit is capable of issuing control instructions and distributing electrical power to the different submodules 11, via the electrical connectors 8 which transmit the converted control instructions and electrical power that they receive electronic components

4 buried in the substrates 3 of these submodules 11.

[0067] It could for example be envisaged that the control unit subdivides the pictogram of the display instruction into sub-images each intended to be displayed by the matrix of light sources 2 of one of the sub-modules 11 so as to that the display of all the sub-images forms this pictogram, then generates, for each of the sub-modules 11, an instruction for controlling the electronic component 4 of this sub-module 11 for the display of this sub-image .

[0068] In examples not shown, it could be envisaged that only the electrical power converted by the unit 5 passes through the card 7 to the connectors 8, the control instructions generated by the unit 5 being distributed to the sub- modules 11 by another means of connection, such as a wired connection connecting unit 5 to each of the sub-modules 11 to form a star network or by a wired connection connecting unit 5 to a sub-module 11, each sub-module 11 then being connected to another sub-module 11 to form a linear network, or by a wireless connection according to which the unit

5 and submodules 11 include wireless data transmitters and receivers. [0069] [Fig. 3] shows a front view of an example of arrangement of submodules 11.

Each substrate 3 has a triangular shape. Other shapes could be provided, in particular diamond or hexagonal, without departing from the scope of the present invention.

[0071] We note that the matrices of light sources 2 are organized, for each sub-module 11, in rows and columns arranged parallel to the edges of the substrate 3. The distances between the light sources 2 of the same sub-module 11 are identical from one sub-module to another. An edge 3a of the substrate 3 of each sub-module 11 adjoins, without being contiguous, an edge 3a of a substrate 3 of an adjacent sub-module 11. We thus see that the matrices of light sources 2 of two adjacent sub-modules 11 are substantially abutting each other, the distance separating the light sources 2 of these neighboring sub-modules 11 and located at the edges 3a being substantially less than or equal to the distance between two light sources 2 of the same submodule 11.

[0073] Each submodule 11 thus forms a standard submodule, the submodules being able to be organized to form a free-form screen, due to the triangular shape, the resolution of which is satisfactory, with regard to the distribution and of the density of the light sources 2 on the triangular substrates and the abutment of the matrices, and which is easily repairable, taking into account the segmentation of the screen into sub-modules 11.

[0074] The preceding description clearly explains how the invention makes it possible to achieve the objectives it has set for itself, by proposing to bury the controller of the light sources of a screen of a lighting device of a vehicle automobile in the substrate supporting these light sources, so as to release the rear face of this substrate.

[0075] In any event, the invention cannot be limited to the embodiments specifically described in this document, and extends in particular to all equivalent means and to any technically effective combination of these means. In particular, we could provide a substrate with another organization of the internal layers and/or vias, which is rigid or flexible, straight or curved. It is also possible to provide other types of light sources than that described, and in particular light sources of larger dimensions, for example between 150 pm and 400 pm, such as microleds. We could consider other types of electronic components than that described. We could also consider other types of heat dissipation members than that described, and in particular a dissipation member integrating a ventilation member.

Claims

[Claim 1] Light module (1, 10) of a signaling device for a motor vehicle, comprising a first matrix of light sources (2) which can be selectively controlled and mounted on a first interconnection substrate (3) comprising a stack of insulating layers (33) alternating with conductive layers (34), each conductive layer being interconnected with another conductive layer by means of at least one via (35) passing through an insulating layer, characterized in that it comprises at least a first electronic component (4) for controlling and powering the first matrix of light sources, said first electronic component being buried in the first substrate at the level of an internal layer of this first substrate, and in this that the first substrate comprises a first plurality of control vias (35a) electrically connecting the first electronic component to the first matrix of light sources, the first electronic component being arranged to electrically power and selectively control each of the light sources of the first matrix at through said first plurality of control vias.

[Claim 2] Light module (1, 10) according to one of the preceding claims, characterized in that the first matrix of light sources (2) is mounted on a first face (31) of the first interconnection substrate (3) , in that it comprises a control unit (5) capable of generating a control instruction of the first electronic component (4) for the selective control of each of the light sources of the first matrix and/or a control unit of power supply (5) capable of generating a power supply of the first electronic component for powering the light sources of the first matrix, said control unit and/or said power supply control unit being mounted on a second face (32) of the first interconnection substrate opposite the first face.

[Claim 3] Light module (1, 10) according to the preceding claim, in which the first matrix of light sources (2) forms a passive matrix and in which the first electronic component (4) is arranged to control said passive matrix through of said first plurality of control vias (35a) according to the control instruction received from the control unit (5).

[Claim 4] Light module (1, 10) according to one of the preceding claims, characterized in that the first matrix of light sources (2) is mounted on a first face (31) of the first interconnection substrate (3) , in that it comprises a heat sink (6) of the light module, said heat sink being mounted on a second face (32) of the first interconnection substrate opposite the first face.

[Claim 5] Light module (1, 10) according to one of the preceding claims, characterized in that it comprises a second matrix of light sources (2) which can be selectively controlled and mounted on the first interconnection substrate

(3), in that it comprises at least a second electronic component (4) for controlling and powering the second matrix of light sources, said second electronic component being buried in the first substrate at an internal layer (33) of this first substrate, and in that the first substrate comprises a second plurality of control vias (35a) electrically connecting the second electronic component to the second matrix of light sources, the second electronic component being arranged to electrically power and selectively control each of the light sources of the second matrix through said second plurality of control vias.

[Claim 6] Light module (1, 10) according to one of claims 1 to 4, characterized in that it comprises a second matrix of light sources (2) which can be selectively controlled and mounted on a second interconnection substrate (3). ), characterized in that it comprises at least one second electronic component

(4) for controlling and powering the second matrix of light sources, said second electronic component being buried in the second substrate at an internal layer (33) of this second substrate, and in that the first substrate is arranged adjacent to the second substrate.

[Claim 7] Light module (1, 10) according to the preceding claim, characterized in that the first, respectively the second, matrix of light sources (2) is mounted on a first face (31) of the first, respectively of the second, interconnection substrate (3) and in that the first and second interconnection substrates are mounted on the same support (7), via a second face (32) opposite their first face.

[Claim 8] Light module (1, 10) according to the preceding claim, characterized in that said second face (32) of each of the substrates (3) supports an electrical connector (8) mechanically coupled to said support (7) and capable of transmit a control instruction and/or a power supply to the electronic component (4) buried in said substrate.

[Claim 9] Light module (1, 10) according to one of claims 6 to 8, characterized in that the electronic component (4) of each substrate (3) is connected to at least one electronic component of another substrate so that all of the electronic components form a network, the electronic component of each substrate being capable of transmitting a control instruction to an electronic component of another substrate of said network to which this electronic component is connected. [Claim 10] Light module (1,

10) according to one of claims 6 to 9, characterized in that each substrate (3) comprises a wireless data receiver.

[Claim 11] Light module (1, 10) according to one of claims 6 to 10, in which each substrate (3) has a triangular or hexagonal shape.

[Claim 12] Signaling device for a motor vehicle, characterized in that it comprises a light module (1, 10) according to one of the preceding claims, said light module forming a screen of the device.