WO2023208262A1 - Élément fonctionnel profilé en trois dimensions avec un conducteur électrique plat et son procédé de production - Google Patents

Élément fonctionnel profilé en trois dimensions avec un conducteur électrique plat et son procédé de production Download PDF

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Publication number
WO2023208262A1
WO2023208262A1 PCT/DE2023/000025 DE2023000025W WO2023208262A1 WO 2023208262 A1 WO2023208262 A1 WO 2023208262A1 DE 2023000025 W DE2023000025 W DE 2023000025W WO 2023208262 A1 WO2023208262 A1 WO 2023208262A1
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WIPO (PCT)
Prior art keywords
functional element
layer
partially
functional
conductive layer
Prior art date
Application number
PCT/DE2023/000025
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German (de)
English (en)
Inventor
Rüdiger SPILLNER
Regina HANSLMEIER
Original Assignee
Gentherm Gmbh
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Publication date
Application filed by Gentherm Gmbh filed Critical Gentherm Gmbh
Publication of WO2023208262A1 publication Critical patent/WO2023208262A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H05K1/0281—Reinforcement details thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0014—Shaping of the substrate, e.g. by moulding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C51/00—Shaping by thermoforming, i.e. shaping sheets or sheet like preforms after heating, e.g. shaping sheets in matched moulds or by deep-drawing; Apparatus therefor
    • B29C51/10—Forming by pressure difference, e.g. vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C51/00—Shaping by thermoforming, i.e. shaping sheets or sheet like preforms after heating, e.g. shaping sheets in matched moulds or by deep-drawing; Apparatus therefor
    • B29C51/14—Shaping by thermoforming, i.e. shaping sheets or sheet like preforms after heating, e.g. shaping sheets in matched moulds or by deep-drawing; Apparatus therefor using multilayered preforms or sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/30—Vehicles, e.g. ships or aircraft, or body parts thereof
    • B29L2031/3005—Body finishings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0212—Printed circuits or mounted components having integral heating means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/0278—Rigid circuit boards or rigid supports of circuit boards locally made bendable, e.g. by removal or replacement of material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/0283—Stretchable printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0284—Details of three-dimensional rigid printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05—Flexible printed circuits [FPCs]
    • H05K2201/057—Shape retainable
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09018—Rigid curved substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/091—Locally and permanently deformed areas including dielectric material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10098—Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10219—Thermoelectric component

Definitions

  • Three-dimensionally contoured functional element, electrical component, having at least one such functional element and method for producing a three-dimensionally contoured functional element is provided.
  • the present invention relates to a three-dimensionally contoured functional element and an electrical component that has such a functional element.
  • the present invention also relates to a method for producing a three-dimensionally contoured functional element.
  • Three-dimensional contoured functional elements with a flat electrical conductor are known from the prior art. Such functional elements are usually produced by a shaping process from an arrangement with a flat and partially metallized support.
  • the carrier can be a film, for example.
  • the invention is therefore based on the surprising finding that the proposed functional element can also be used to allow areas of the functional element in which there is an increased mechanical and/or thermal load. This means that components of the functional element can also be placed in areas that are particularly stressed by the contouring. This also makes particularly strongly contoured functional elements possible.
  • the part of a layer in a curved region of the layer is subject to greater mechanical stress (for example in tension) than the part of the layer in a flat region of the layer.
  • components can also be arranged in the more heavily loaded area of the functional element.
  • films can be used as a carrier layer without them folding or tearing (particularly in the area of the conductive layer) or having to be laboriously cut to size first.
  • the carrier layer can advantageously, in particular at least partially, be printed with electrically conductive paste, metallized in another way or provided with an electrically conductive conductive layer in some other way before shaping.
  • electrically conductive structures provided in a different way is also possible particularly easily and reliably with the proposed functional element.
  • electrically conductive structures in particular the conductive layer and the interconnects
  • a surface element with one or more metal layers can also advantageously be provided as the carrier layer.
  • the functional element is particularly suitable if an electrically conductive conductor track is to be provided, a sensor is to be arranged and/or an electrical device is to be provided on a strongly contoured surface.
  • the normal range and the stretch range are preferably defined based on the different states.
  • the states can, for example, be characterized by different courses of the respective component of the functional element or its parts and/or the functional element.
  • the normal region is an area with a flat course of the respective component of the functional element or its parts and/or the functional element as a first state and the stretching region is an area with a course that deviates from a flat course, in particular curved at least in some areas and/or angular, course of the respective component of the functional element or its parts and/or of the functional element as a second state, in particular due to the contouring.
  • the functional element has at least two areas with a different curvature of the respective component of the functional element or its parts and/or the functional element, one area of which is the normal area with a first curvature of the respective component of the functional element or its parts and/or or of the functional element as the first state and a region thereof is the stretching region with a second curvature of the respective component of the functional element or its parts and / or the functional element as the second state, and wherein the stronger curvature occurs in the stretching region, in particular in each case due to the contouring.
  • the second state is manifested compared to the first state in a greater mechanical load on the component of the functional element or its parts and/or of the functional element and/or in a more strongly contoured course of the component of the functional element or its parts and/or of the functional element, especially due to the contouring.
  • the stretching area is also called the stretching area in the present application. This is because in the stretching area, a greater expansion of components of the functional element or their parts and/or the functional element due to the greater mechanical load should advantageously be reduced or completely prevented.
  • the stretching area is advantageously an area in which there is a mechanical load, in particular caused by the contouring of the functional element, but the resulting impairment of the components of the functional element or their parts and/or the functional element provided in the area is not or only reduced occurs.
  • a course can preferably be viewed as flat if a plane can be fitted in the respective area (e.g. in the normal area), so that the main extension of the component of the functional element or its parts and/or the functional element takes place in at least two dimensions parallel to this plane.
  • stretchable areas and those that are flexible but non-stretchable can then be obtained.
  • the stretching area is an area (i) in which a component or parts thereof to be protected (in particular from mechanical stress, such as stretching) is at least partially arranged, (ii) which is non-stretchable but preferably flexible and/ or (iii) which is exposed to a mechanical load caused by the contouring, in particular a tensile load.
  • the normal area is an area (i) which is stretchable and/or flexible and/or (ii) which, in particular in comparison to the stretching area, is exposed to no or less mechanical stress caused by the contouring.
  • the normal area and/or the stretching area is each a volume area.
  • the normal area and the stretching area preferably directly adjoin one another.
  • the normal area and the stretch area are spaced apart from each other.
  • the component (or parts thereof) that has the first state can be, for example, the carrier layer, the conductive layer (and thus the conductor track formed by it) and/or one of the other components described below.
  • the component (or parts thereof) that has the second state can be identical to the component that has the first state, in which case the first and second states exist in two different areas of the component.
  • the component (or parts thereof) that has the second state can also be different from the component that has the first state, and in particular the carrier layer, the conductive layer (and thus the conductor track formed by it) and / or a of the other components described below.
  • the functional element can therefore be referred to as a functional element with a flat electrical conductor, which can be used advantageously in particular in an embodiment as a heating and/or sensor device.
  • the second state of the component or its parts and/or of the functional element compared to the first state is manifested in a local occurrence of at least one or more, preferably all, of these properties:
  • the local interruption or destruction can, for example, be a structuring of a layer region, with layer material being locally removed.
  • the fibers, molecules and crystal structures in question can each be part of the material of the respective component.
  • the first state can be characterized by a first contouring, in particular a flat course, of the component of the functional element or its parts and/or the functional element and/or the second state can be characterized by a second contouring, in particular a contouring that is stronger than the first contouring and /or a course that deviates from a flat course, in particular curved and/or angular, course, the component of the functional element or its parts and/or the functional element.
  • stretching and stretching are preferably used synonymously in this application.
  • the conductor track is determined as a functional component of an electrical current path, (ii) at least part of the conductor track, preferably the entire conductor track, is arranged outside the stretching area and / or at least a part the conductor track, preferably the entire conductor track, is arranged within the stretching area, (iii) at least a part of the electrical current path, preferably the entire electrical current path, is arranged outside the stretching area and / or at least a part of the electrical current path, preferably the entire electrical current path is arranged within the stretching area, (iv) at least part of the conductor track is arranged in the normal area, (v) at least part of the electrical current path, preferably the entire electrical current path, in the normal area is arranged, (vi) the stretching area and the conductor track do not overlap one another, (vii) the functional element has at least one connection area for connecting the functional element to an external structure, at least one adhesive point and/or at least one soldering point and/or
  • the conductor track can provide the electrical current path alone or with other structures that do not necessarily have to be part of the functional element.
  • the conductor track and/or the current path can be protected particularly well against excessive mechanical stress by, as proposed, being provided entirely or partially outside the stretching area and/or entirely or partially within the normal area. This means that excessive (mechanical) stress on these components can be avoided or at least reduced.
  • the functional element is characterized by at least three layers.
  • a corresponding structure of the functional element has proven to be particularly advantageous.
  • a cover layer (in particular as a further component) can also be provided in the conductive layer, which can ensure additional stability of the functional element.
  • the carrier layer is at least partially formed from a polymeric material, preferably with proportions of at least one of the materials PET, PEN and / or PI, and / or the carrier layer is a component of the functional element, and /or
  • the conductive layer is structured, preferably by means of a structuring process that works free of acids, solvents, pastes and/or ink, in particular as a result of a machining process, in order to have conductor tracks and/or the conductive layer is a component of the functional element.
  • the functional element in particular as a component of the functional element,
  • an electrically conductive first conductive layer preferably with proportions of at least one of the materials aluminum, copper-plated Al, copper and / or nickel and / or at least one alloy of these metals,
  • an electrically conductive second conductive layer made of a material different from the first conductive layer, preferably with proportions of at least one of the materials aluminum, copper-plated Al, copper and / or nickel and / or at least one alloy of these metals, preferably the first and second conductive layers (aa) parallel to each other, in particular in a common plane and/or in different planes, (bb) spaced apart from one another, (cc) successively along a stacking direction and/or a normal vector of the first and/or second conductive layer and/or (dd) electrically are arranged isolated from each other,
  • an electrically conductive middle layer which is preferably formed at least from the first and/or the second conductive layer and/or, in particular sandwich-like and/or is arranged electrically insulated from the first and/or second conductive layer, between the first and second conductive layers, the middle layer preferably being identical to the conductive layer,
  • a cover layer preferably at least partially made of a polymer material, in particular a lacquer,
  • an adhesive layer for connecting at least two other layers preferably at least partially formed from an adhesive material, in particular from an epoxy resin,
  • an adhesive layer for connecting the functional element to another structure wherein preferably the adhesive layer is at least partially formed from an adhesive material, in particular from an epoxy resin, and / or
  • an adhesive layer for connecting at least two layers of the functional element wherein preferably the adhesive layer is at least partially formed from an adhesive material, in particular from an epoxy resin.
  • Each of the layers mentioned is therefore advantageously a component of the functional element, which can be arranged within the normal range and/or stretching range according to the statements made above.
  • middle layer electronic components can be contacted or can be contacted.
  • electronic components that are contacted on the electrical middle layer (or the conductive layer) can be covered by the cover layer or covered by a further protective layer (for example “conformal coating”), the cover layer then having recesses.
  • Parts of the electrical middle layer, in particular the structured electrical middle layer, are advantageously suitable for data transmission via RFID.
  • a component of the functional element can, for example, also be formed by an SMD component bonded to the first and/or second conductive layer, the middle layer and/or the cover layer.
  • the functional element is characterized by a reinforcing device, which is preferably arranged at least partially within the stretching area.
  • components can be provided even in the stretching area that is subject to more mechanical stress and can be protected from excessive stress.
  • stretching of a component or its parts within the stretching area can be avoided or at least reduced.
  • the functional element therefore advantageously has such a reinforcement device.
  • the amplification device Alternatively or additionally it can also be provided that the amplification device
  • (i) is arranged between the middle layer and the cover layer, on the cover layer, in the plane of the middle layer and/or protected from stretching in the normal region, in particular at least partially overlapping and/or surrounding it,
  • (ii) is designed in the form of a reinforcing layer
  • (iii) consists at least partially of a fiber fabric, in particular of a glass fiber fabric, and/or of glass fiber fleece,
  • (v) is at least partially formed by a surface element
  • (viii) is formed by glass fibers glued onto at least one of the layers of the functional element and/or between at least two of the layers of the functional element,
  • (x) has long, aligned glass fibers
  • (xi) has a property different from a second dimension with respect to at least one physical parameter in a first dimension, wherein preferably the parameter is a material-specific parameter, such as a tensile strength, a modulus of elasticity and/or a fiber orientation and/or a Degree of fiber alignment, and/or a shape-specific parameter, such as shape elasticity,
  • a material-specific parameter such as a tensile strength, a modulus of elasticity and/or a fiber orientation and/or a Degree of fiber alignment
  • shape-specific parameter such as shape elasticity
  • (xii) in a specific direction which preferably corresponds to the orientation in which, in particular, at least a majority of and / or the important sections of the conductor tracks of the electrical conductive layer and / or electrical functional components of the functional element are arranged, an increased mechanical resistance, in particular at least by a higher tensile strength, a lower modulus of elasticity and / or a greater spring force, in particular in comparison to a direction that is perpendicular to the specific direction,
  • (xiii) has a fiber orientation in a main direction of a structure of the electrically conductive middle layer
  • (xiv) at least one contour or structure, in particular to increase robustness, such as in relation to mechanical resilience in tension, to increase a thermal mass, for example to reduce measurement fluctuations, and / or to adjust, in particular increase, a local cooling rate has or represents, preferably (a) the contour or structure does not influence the electrical resistance, in particular of the conductive layer, and / or (b) the contour or structure (aa) at least in sections of the base surface or edge contour of a device to be protected Current path corresponds to protect it from mechanical stress, in particular from stretching, and / or (bb) has a large number of parallel sections and / or branches which do not contact a conductor of a different polarity, in particular of the functional element and / or the conductive layer, and / or which are electrically networked with each other, and/or
  • (xv) is at least partially arranged in the stretching area and preferably has the second state there, is at least partially arranged in the normal area and preferably has the first state there and / or at least partially overlaps the stretching area.
  • Glass fibers have therefore proven to be particularly advantageous for forming the reinforcing device. Glass fibers that are smaller than 3 mm (in particular measured along their main extension direction) are advantageously referred to as short and / or glass fibers that are larger than 3 mm (in particular measured along their main extension direction) are advantageously referred to as long.
  • the reinforcing device has the said different properties with respect to at least one physical parameter, (mechanical) loads on the functional element can be addressed by a suitable orientation of the reinforcing device.
  • the dimension with the higher tensile strength can then be placed along the direction in which there is a high load (for example a mechanical load) on a component of the functional element by appropriately orienting the reinforcing device.
  • the (mechanical) resilience of the respective component can also be improved.
  • the respective component such as the conductive layer and/or electrical functional component
  • the functional element is formed by a heating device, in particular an ohmic resistance heater, a cell connector for connecting individual electrical cells in a vehicle battery and/or a sensor element and/or a combination product of these products.
  • a heating device in particular an ohmic resistance heater, a cell connector for connecting individual electrical cells in a vehicle battery and/or a sensor element and/or a combination product of these products.
  • the functional element is intended for use in a vehicle interior.
  • the functional element can be provided as a control element for the vehicle interior.
  • the functional element can be particularly advantageously provided as part of the dashboard, in particular the center console, in the vehicle interior.
  • the functional element is characterized by at least one layer, which layer is the electrically conductive middle layer and/or the conductive layer, which layer at least partially has a first electrical functional structure which has at least two electrical contact zones and which is preferably assigned to a heating, sensor or display device, and which layer at least partially has a second electrical functional structure which has at least one electrical contact zone and which is preferably assigned to a grounding, sensor or shielding device.
  • Said layer is advantageously identical to the middle layer and/or conductive layer already mentioned several times above.
  • said layer can also be a layer different from the middle layer and/or conductive layer already mentioned several times above.
  • the first electrical functional structure is formed by the first conductive layer and/or the second electrical functional structure is formed by the second conductive layer.
  • At least one display device having at least one LED (light-emitting diode),
  • At least one resistor that serves as a sensor e.g. an NTC as an SMD component
  • At least one sensor that is applied to the functional element, in particular in the form of a resistance layer and/or by gluing, soldering or welding, and/or
  • a part of a sensor, an antenna, in particular in an RF radio measurement, a capacitor, in particular in a capacitive measurement, and/or a variable resistor is passed through the conductive layer and/or middle layer, at least in sections. in particular a measuring resistor is formed.
  • antennas can also be formed on contoured surfaces. At least part of the antenna can be formed by the conductive layer. Alternatively or additionally, it can also be provided that the functional element is produced or can be produced at least partially by a method comprising a shaping process, such as deep drawing and/or vacuum deep drawing.
  • a shaping process such as deep drawing and/or vacuum deep drawing.
  • the proposed functional element can advantageously be manufactured at least partially using a 3D shaping process, such as deep drawing or vacuum deep drawing.
  • the proposed functional element is particularly suitable for production by deep drawing. Because during deep drawing there are areas that are stretched during the shaping process. Conductor structures can run in and/or through the deformed areas and cannot survive stretching without damage. Thanks to the proposed functional element, the stretching area can be in this area with, for example, the reinforcement device described. This means that reinforcement would be advantageously added there. Ideally, in this area (despite the designation as a stretching area), no further stretching, in particular of the conductive layer, occurs due to the advantageous design. Nevertheless, this area is still in the deformed area. In reality, however, stretching can occur at least locally, which is then advantageously harmless to the intended use of the functional element.
  • a three-dimensionally contoured functional element having at least one electrically insulating carrier element and at least one electrically conductive conductor track carried at least in sections by the carrier element and formed at least from sections of a conductive element, the functional element having at least one Adaptation means for adapting a mechanical resilience and / or thermal property of one or more components or their parts and / or the functional element provided within at least a specific area of the functional element is proposed.
  • the carrier element is designed in a layered manner and/or has one or more of the features of the carrier layer, as described in relation to the functional element according to the first aspect of the invention.
  • the conductive element is designed in the form of a layer and/or has one or more of the features of the conductive layer, as described in relation to the functional element according to the first aspect of the invention.
  • the adaptation means has one or more of the features of the reinforcing element, as described in relation to the functional element according to the first aspect of the invention.
  • the object is achieved by the invention according to a third aspect in that an electrical component, having at least one functional element according to the first and/or second aspect of the invention, is proposed.
  • At least one display device having at least one LED (light-emitting diode),
  • At least one resistor that serves as a sensor e.g. an NTC as an SMD component
  • a sensor e.g. an NTC as an SMD component
  • a method for producing a three-dimensionally contoured functional element in particular a functional element according to the first and / or second aspect of the invention, the method comprising an arrangement having at least one electrically insulating support element , such as an electrically insulating carrier layer, and at least one conductive element, such as a conductive layer, which is carried at least in sections by the carrier element, and is at least partially formed by means of a shaping process, wherein at least one mechanical resilience, mechanical load and / or thermal property of one or more within at least a specific area of the arrangement and / or the functional element obtained by forming components or their parts is adapted at least temporarily, preferably at least during the forming and / or permanently, by providing an adjustment means.
  • the invention is therefore based on the surprising finding that by providing appropriate adjustment means, individual areas in the functional element can be specifically exposed to a higher mechanical load. By selecting the areas so that they coincide with areas in which sensitive components of the functional element are located, shaping processes can also be carried out that result in stronger contouring.
  • the carrier element can be printed with electrically conductive paste, metallized in some other way or provided with an electrically conductive conductive layer in some other way.
  • the proposed method allows the metallized areas to be particularly protected. This makes it possible to prevent folding or tearing of a film that is advantageously used as a carrier element (particularly in the area of the guide element), or at least to reduce the risk of this happening. There is also no need for time-consuming cutting of the films.
  • films can also be used as a carrier even for more strongly contoured surfaces.
  • a film with a metallized surface can be structured to form heating and/or sensor paths as well as contacting areas along with areas in which the metallized surface is removed.
  • the process is particularly suitable for the use of arrangements with one or more metal layers (for example a composite film, such as PEN, with a copper-coated aluminum layer) and for producing corresponding functional elements. Even such surface elements that are traditionally difficult to handle can be processed with the proposed method and used for the production of three-dimensionally contoured functional elements.
  • metal layers for example a composite film, such as PEN, with a copper-coated aluminum layer
  • the method thus makes it possible to produce a three-dimensional functional element that has non-stretchable but optionally flexible conductor areas and can therefore also be used for more curved surfaces.
  • Non-stretchable areas can prevent the arrangement, in particular the conductive layer, from breaking or tearing.
  • the corresponding non-stretchable (optionally but flexible) regions can then be provided in a stretching region with a second state in the functional element according to the first aspect of the invention.
  • the shaping advantageously takes place using a three-dimensional shaping process.
  • the shaping involves deep drawing and/or vacuum deep drawing.
  • the arrangement can be part of a higher-level element, in particular connected to it, for example in a materially bonded manner. This allows the arrangement to be reshaped together with the parent element.
  • the carrier element can therefore advantageously be a film.
  • the guide element can be formed by partially metallizing the film.
  • the specific area is a volume area in one embodiment.
  • the specific area corresponds to the stretching area existing after shaping, as described in detail in connection with the functional element according to the first aspect of the invention.
  • the arrangement can also have one of the components described above in connection with the functional element according to the first aspect of the invention, in particular a cover layer, an adhesive layer and/or a middle layer.
  • the component is the carrier element, the guide element and/or one of the other components.
  • the arrangement has at least one electrically conductive conductor track, which is formed at least from sections of the conductive element.
  • the adjustment of the mechanical resilience has or represents the setting of a higher tensile strength, a lower modulus of elasticity and/or a larger spring force.
  • the mechanical load capacity can advantageously be adjusted at least in certain areas (for example in the area of the stretching area existing after shaping) within the functional element.
  • a structure is provided as an adaptation means for at least partially mechanical stabilization of the components or their parts arranged within the specific area, in particular at least partially by providing an additional stabilization layer in the arrangement at least in areas, which stabilization layer is preferably a different material than the material of the other layers, in particular with a higher modulus of elasticity than the material of the other layers, or consists of it.
  • the structure, in particular the stabilization layer is advantageously arranged directly adjacent to the respective component within the arrangement.
  • the stabilization layer can advantageously completely cover the guide element.
  • a structure and/or a process is provided as an adaptation means for at least regional and/or at least temporary thermal stabilization of the components or their parts arranged within the specific region, in particular at least partially by (i) the arrangement heated and/or cooled at least in some areas and/or (ii) a heat sink structure is provided within the arrangement and preferably the arrangement together with the heat sink structure before and/or after the forming to facilitate the forming at least in some areas, in particular in the area of the heat sink structure , is heated.
  • a conductive element in particular a conductive layer, which is widened and/or raised at least in some areas can advantageously be provided as a heat sink structure.
  • a corresponding heat sink structure can be provided as a heat sink structure, especially laterally and/or above along a conductor track to be protected.
  • the structure in particular the heat sink structure, remains in the functional element obtained.
  • the structure can advantageously provide mechanical stability in the specific area and thus bring a double benefit.
  • the adaptation means is at least partially formed in one piece with the component in a specific area.
  • the shaping process has or represents deep drawing and/or vacuum deep drawing.
  • Example 1 Three-dimensionally contoured functional element with at least one electrically insulating carrier layer and at least one electrically conductive conductor track,
  • the functional element has at least one normal region in which at least one of the components (functional element, carrier layer, conductive layer) has a first state, and that the functional element has at least one stretch region has, in which at least one of the components (functional element, carrier layer, conductive layer) has a second state that is different from the first.
  • Example 2 Functional element according to Example 1, characterized in that the second state of the component compared to the first state is manifested in a local occurrence of at least these properties: a stretching/stretching, a smaller layer thickness (as a result of the stretching), an interruption or local destruction, a different or larger alignment of fibers, molecules, or crystal structures.
  • Example 3 Functional element according to one of the preceding examples, characterized by at least one of the following features:
  • the conductor track is intended as a functional component of an electrical current path.
  • At least part of the conductor track is arranged outside the stretching area, preferably the entire electrical current path.
  • At least part of the conductor track is arranged in a normal area, preferably the entire electrical current path.
  • the stretch area and the conductor track do not overlap each other.
  • Example 4 Functional element according to one of the preceding examples, characterized by at least three layers.
  • Example 5 Functional element according to one of the preceding examples which has at least one of the following components: a carrier layer formed at least partially from a polymeric material, preferably with proportions of at least one of the following materials:
  • an electrically conductive first conductive layer preferably with proportions of at least one of the following materials: aluminum, copper-plated Al, copper, nickel, alloys of these metals, an electrically conductive second conductive layer made of a material different from a first conductive layer, preferably with Contain at least one of the following materials: aluminum, copper-plated Al, copper, nickel, alloys of these metals, an electrically conductive middle layer, which is formed at least from the first or the second conductive layer, a conductive layer which is structured to have conductor tracks, preferably by means of a structuring process that works free of acids, solvents, pastes or ink, preferably as a result of a machining process, a cover layer, preferably at least partially made of polymer material, in particular a varnish, an adhesive layer for connecting at least two other layers, preferably at least partially formed from an adhesive material, in particular from an epoxy resin.
  • Example 6 Functional element according to one of the preceding examples, characterized by a reinforcing device, preferably with one of the following features:
  • This parameter has a property of a second dimension with respect to at least one physical parameter in a first dimension.
  • This parameter can in particular be:
  • It has a fiber orientation in a main direction of a structure of an electrically conductive middle layer.
  • It has a contour or structure, o which corresponds at least in sections to the base surface or edge contour of a current path to be protected in order to protect it from stretching, o which has a large number of parallel sections and / or branches which do not contact any conductor of a different polarity , or which are electrically networked with each other depending on the need for increased robustness, e.g. against mechanical stress in tension, an increased thermal mass, e.g. to reduce measurement fluctuations, an increased cooling rate without affecting the electrical resistance.
  • Example 7 Functional element according to one of the preceding examples, characterized in that the functional element is formed by one of the following products:
  • a heating device in particular ohmic resistance heating
  • Example 8 Functional element according to one of the preceding examples, characterized in that the functional element is intended for use in a vehicle interior.
  • Example 9 Functional element according to one of the preceding examples, characterized by at least one layer,
  • Example 10 Functional element according to one of the preceding examples, characterized by at least one of the following features:
  • At least one display device has at least one LED (light-emitting diode).
  • At least one sensor is used to detect approach or contact (preferably by humans) or a temperature.
  • At least one resistor serves as a sensor (e.g. an NTC as an SMD component).
  • At least one sensor is attached to the functional element
  • the conductive layer or middle layer itself forms at least in sections at least a part
  • variable resistance especially measuring resistance.
  • Option 1 Mechanical stabilization: An additional layer of mechanical stabilization is applied to sheets and sections that are not to be stretched before the forming process (i.e. deep drawing).
  • the layer may consist of a different material, preferably having a higher modulus of elasticity (lower extensibility) than the structured base film, e.g. B. Strips of glass fibers.
  • Option 2 Thermal stabilization: Before deep drawing, the film is usually heated to facilitate or accelerate the forming process. By adding an element or part that acts as a heat sink, or by selectively heating or cooling certain areas of the structured film, the rate of deformation under pressure (i.e. vacuum forming) can be changed to such an extent that stretchable and quasi-instretchable sections are created.
  • the rate of deformation under pressure i.e. vacuum forming
  • Options 1) and 2) can also be achieved by designing the metallized layer and its structuring such that there is sufficient material strength or thermal mass to keep certain sections below the elongation limit of the metallized part. If this cannot be achieved by the trace material itself, additional metallized layer material can be designed to remain adjacent to the traces that are not intended to be stretched in the process.
  • FIG. 1 shows a schematic cross-sectional view of a functional element according to the first aspect of the invention on a three-dimensionally highly contoured surface
  • FIG. 2 shows a schematic cross-sectional representation of the functional element from FIG. 1;
  • FIG. 3a shows a schematic exploded view of a first arrangement from which the functional element of FIG. 2 can be obtained by shaping
  • Fig. 3b is a schematic cross-sectional representation of the first arrangement from Fig. 3a;
  • Fig. 3c shows a schematic top view of parts of the first arrangement from Fig. 3a;
  • FIG. 4 shows a schematic cross-sectional representation of a second arrangement from which a functional element according to the first aspect of the invention in a further embodiment can be obtained by shaping;
  • FIG. 5a shows a schematic exploded view of a third arrangement from which a functional element according to the first aspect of the invention can be obtained in a further embodiment by shaping;
  • Fig. 5b is a schematic cross-sectional representation of the third arrangement from Fig. 5a;
  • Fig. 5c shows a schematic top view of parts of the third arrangement from Fig. 5a.
  • Fig. 6 is a flowchart of a method according to the fourth aspect of the invention.
  • FIG. 1 shows a schematic cross-sectional view of a functional element 1 according to the first aspect of the invention, which is arranged on a highly contoured surface 3 of an object 5.
  • the object 5 extends perpendicular to the drawing plane of FIG. 1 along the Y direction and can, for example, be part of the interior of a motor vehicle.
  • the functional element 1 is arranged on an area of the surface 3 which extends along a direction R over an edge 7 of the object 5.
  • an electrically conductive current path or a sensor can be provided on the surface 3.
  • the functional element 1 Due to the course of the surface 3, the functional element 1 must also follow the locally acute course of the surface 3 in the area of the edge 7 and must be strongly contoured accordingly. As a result of this contouring, the functional element 1 is subjected to greater mechanical stress, especially in a central area 9, due to the tensile load. In order to address this circumstance, a functional element according to the first aspect of the invention is selected for the functional element 1.
  • Fig. 2 shows a schematic cross-sectional representation of the functional element 1 from Fig. 1 with more details.
  • the coordinate systems shown in the figures are all chosen in the same way and serve for faster orientation.
  • the functional element 1 has a carrier layer 11 made of an electrically insulating material and an electrically conductive conductor track 13.
  • the carrier layer 11 is, for example, a film with parts of PET.
  • the conductor track 13 is carried by the carrier layer 11 and is formed from sections of a conductive layer 15. In other words, the conductor track 13 in the present case results from a corresponding structuring of the conductive layer 15.
  • the functional element 1 also has a reinforcing device 17, which is designed in the form of a reinforcing layer made of a glass fiber fabric and covers the conductive layer 15 in the central region 9 and, where no conductive layer 15 is formed, the carrier layer 11.
  • the functional element 1 has a cover layer 19 made of a polymer material. The cover layer 19 is applied, for example as a varnish, to the reinforcing device 17 and to the areas of the carrier layer 11 and conductive layer 15 that are not covered by the reinforcing device 17.
  • the tensile strength in the central region 9 of the functional element 1 is particularly high along the direction R, in particular higher than along the direction Y, which runs perpendicular thereto.
  • the conductive layer 15 of the functional element 1 Due to the high mechanical load in area 9, the conductive layer 15 of the functional element 1 is there in a strongly contoured (particularly angular) stretched manner. Area 21 of the functional element 1 is more heavily loaded than in an end area 23 of the conductive layer 15, which is located in a flat normal area 25 of the functional element. Despite these different states of the functional element in the stretching and normal areas 21 and 25, which states are particularly evident in the different course (edged or flat) of the conductive layer 15 due to the contouring, there is no major expansion or even a crack in the conductive layer 15 in the more heavily stressed central area 9 or stretching area 21. This is achieved by the stabilizing effect of the reinforcing device 17.
  • the stretching area 21 therefore completely or partially coincides with the area 9 with high mechanical tensile stress. Due to the high tensile strength of the reinforcing device 17, it is therefore ensured that the conductive layer 15 of the functional element 1 in the central region 9 is not stretched or at least does not tear.
  • the functional element 1 can be produced by means of a shaping process, in particular by means of deep drawing.
  • the individual layers 11, 15, 17, 19 of the functional element 1 are initially provided as flat layers within an arrangement.
  • the arrangement is then reshaped according to the course of the surface 3 and the functional element 1 is thereby obtained.
  • Fig. 3a shows a schematic exploded view of a first arrangement 27, from which the functional element 1 described with reference to Fig. 2 can be obtained by shaping (forming). Layers that are the same in the functional element 1 and in the first arrangement 27 are also provided with the same reference numbers.
  • 3b shows a schematic cross-sectional representation of the first arrangement 27, the sectional plane being a central plane of the first arrangement 27 which is perpendicular to the Y direction.
  • 3c shows a schematic top view of the first arrangement 27, with the cover layer 19 hidden and only the contour of the reinforcing device 17 shown in dashed lines. Furthermore, in Figs. 3b and 3c the position of the later edge 7 of the object 5 and thus a location of high mechanical stress is shown by a dashed line L.
  • the conductive layer 15 forms an electrically conductive current path (in the form of the conductor track 13).
  • the functional element 1 can be produced using a method according to the fourth aspect of the invention.
  • the first arrangement 27 is provided and formed using a shaping process (such as deep drawing).
  • the reinforcing device 17 represents an adjustment means with which the mechanical resilience, in particular the Conducting layer 15, especially in the mechanically heavily stressed area around the line L (which area advantageously corresponds to a later stretching area of the functional element produced) can be adjusted during the shaping process and after the shaping process.
  • FIG. 4 shows a schematic cross-sectional representation of a second arrangement 29, from which a functional element according to the first aspect of the invention in a further embodiment can be obtained by shaping (forming).
  • a functional element according to the first aspect of the invention in a further embodiment can be obtained by shaping (forming).
  • features of the second arrangement 29 that are the same as those of the first arrangement 27 are provided with the same reference numerals.
  • the second arrangement 29 from Fig. 4 differs from that in relation to Figs. 3a-3c discussed first arrangement 27 in that the reinforcing device 17 is formed by a sectional increase in the layer thickness of the conductive layer 15 (this can in any case be recognized in principle by comparing the corresponding sectional views of FIGS. 3a and 4 even in the schematic representations).
  • the functional element produced from the second arrangement 29 by forming differs from the functional element 1 discussed with reference to FIG. 2, which was obtained by forming from the first arrangement 27.
  • the layer thickness is increased in an area around the line L.
  • the layer thickness is therefore increased in the area that is subject to particular mechanical stress during and/or after forming (which area advantageously corresponds to a later stretching area of the functional element produced).
  • the partially increased layer thickness of the conductive layer 15 represents a structure with which the thermal mass within the second arrangement 29 and the functional element produced therefrom can be increased partially. If the second arrangement 29 is heated to facilitate the shaping process before and/or during the forming process, the increased thermal mass and thus the increased amount of heat are ensured In this area, a higher mechanical tensile load is possible in the stretching area of the later functional element (i.e. the area with a stronger contour). In addition, the reinforcing device 17 itself also acts as an additional mechanical stabilization of the conductor track 13 in the stretching area.
  • FIG. 5a shows a schematic exploded view of a third arrangement 31, from which a functional element according to the first aspect of the invention can be obtained in a further embodiment by shaping (forming).
  • features of the third arrangement 31 that are the same as those of the first and second arrangements 27 and 29 are provided with the same reference numerals.
  • 5b shows a schematic cross-sectional representation of the third arrangement 31, the sectional plane being a central plane of the third arrangement 31 which is perpendicular to the Y direction.
  • 5c shows a schematic top view of the third arrangement 31, the cover layer 19 being hidden and only the contour of the reinforcing device 17 being shown in dashed lines. Furthermore, in Figs. 5b and 5c the position of the later edge 7 of the object 5 and thus a location of high mechanical stress is again shown by a dashed line L.
  • the third arrangement 31 shown in FIGS. 5a-5c differs from that in relation to FIGS. 3a-3c discussed first arrangement 27 by a differently structured conductive layer 15.
  • the first electrical functional structure 33 is assigned to a heating device, for example, while the second electrical functional structure 37 is assigned to a grounding device.
  • the first and second electrical functional structures 33 and 37 are arranged in a common plane.
  • FIG. 6 shows a flowchart 100 of a method according to the fourth aspect of the invention.
  • an arrangement equipped with adaptation means is provided. This may be one of the assemblies 27, 29 and 31 as described above in relation to Figs. 3a-3c, 4 and 5a-5c have been described.
  • the arrangement provided is at least partially reshaped by means of a shaping process and a functional element, in particular according to the first aspect of the invention, such as the functional element 1, is obtained.
  • the shaping process advantageously includes deep drawing or vacuum deep drawing.

Abstract

L'invention concerne un élément fonctionnel (1) profilé en trois dimensions comprenant au moins une couche porteuse électriquement isolante (11), au moins un trajet de conducteur électriquement conducteur (13) formé au moins de sections d'une couche conductrice (15) et avec au moins des sections supportées par la couche porteuse (11), de préférence un dispositif de renforcement (17), agencé de préférence au moins partiellement au sein d'une région étirable (21), l'élément fonctionnel (1) ayant au moins une région normale (25) dans laquelle au moins l'un des composants de l'élément fonctionnel ou les parties de celui-ci et/ou l'élément fonctionnel (1) ont un premier état et au moins la région étirable (21) dans laquelle au moins l'un des composants de l'élément fonctionnel ou les parties de celui-ci et/ou l'élément fonctionnel (1) ont un second état qui est différent du premier état ; et un composant électrique ayant un élément fonctionnel (1) de ce type. L'invention concerne également un procédé de production d'un élément fonctionnel (1) profilé en trois dimensions.
PCT/DE2023/000025 2022-04-26 2023-04-26 Élément fonctionnel profilé en trois dimensions avec un conducteur électrique plat et son procédé de production WO2023208262A1 (fr)

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DE102022001465 2022-04-26

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2120837A (en) * 1982-03-31 1983-12-07 Nippon Mektron Kk Flexible circuit board
DE102011014902B3 (de) * 2011-03-23 2012-02-02 Leonhard Kurz Stiftung & Co. Kg Verfahren zur Herstellung eines Antennen-Bauelements
EP3784007A1 (fr) * 2019-08-19 2021-02-24 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk Onderzoek TNO Composant électronique sur substrat souple
US20210368627A1 (en) * 2018-02-19 2021-11-25 Nederlandse Organisatie Voor Toegepast-Natuurwetenschappelijk Onderzoek Tno Thermoforming an electronic device with surface curvature

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2120837A (en) * 1982-03-31 1983-12-07 Nippon Mektron Kk Flexible circuit board
DE102011014902B3 (de) * 2011-03-23 2012-02-02 Leonhard Kurz Stiftung & Co. Kg Verfahren zur Herstellung eines Antennen-Bauelements
US20210368627A1 (en) * 2018-02-19 2021-11-25 Nederlandse Organisatie Voor Toegepast-Natuurwetenschappelijk Onderzoek Tno Thermoforming an electronic device with surface curvature
EP3784007A1 (fr) * 2019-08-19 2021-02-24 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk Onderzoek TNO Composant électronique sur substrat souple

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