WO2023207857A1

WO2023207857A1 - Display module and electronic device

Info

Publication number: WO2023207857A1
Application number: PCT/CN2023/090120
Authority: WO
Inventors: 张立; 劳浔; 龙浩晖; 石江波; 王佳仁; 韩海素
Original assignee: 华为技术有限公司
Priority date: 2022-04-28
Filing date: 2023-04-23
Publication date: 2023-11-02
Also published as: CN117031806A

Abstract

A display module and an electronic device. The display module comprises a display panel (10), a cover plate (20), and a high-resistance film (30); the cover plate (20) is provided on the light-emitting surface side of the display panel (10); the high-resistance film (30) is arranged between the display panel (10) and the cover plate (20); when the surface resistivity of the high-resistance film (30) is greater than the surface resistivity of any structure provided on the light-emitting surface side of the display panel (10), and the volume resistivity of the high-resistance film (30) is greater than the volume resistivity of any structure provided on the light-emitting surface side of the display panel (10).

Description

Display modules and electronic equipment

This application claims priority to the Chinese patent application filed with the China Patent Office on April 28, 2022, with application number 202210471248.0 and the application name "Display Module and Electronic Equipment", the entire content of which is incorporated into this application by reference.

Technical field

The present application relates to the field of display technology, and in particular, to a display module and electronic equipment.

Background technique

As a structure that directly interacts with devices, the display module in electronic equipment will rub against the human body, clothing, etc. during daily work, thereby accumulating charges on the surface of the display module. When the charge on the surface of the display module accumulates to a certain extent, the voltage on its surface can reach negative hundreds of volts or even negative kilovolts. When the surface of the display module has such a high friction voltage, the friction voltage will be conducted to the inside of the display panel, causing a high negative voltage to be formed inside the display panel.

A higher negative voltage in the display panel will affect the normal operation of its internal components, thereby affecting the normal display of the display module. For example, a higher negative voltage will cause the threshold of the transistor in the display panel to drift. Then, when the display module displays images, problems such as black spots, flickering screens, and green screens will occur.

Contents of the invention

This application provides a display module and electronic equipment.

In the first aspect, this application provides a display module, including:

display panel;

a cover plate, which is arranged on one side of the light-emitting surface of the display panel;

A high-resistance film, the high-resistance film is provided between the display panel and the cover plate;

Wherein, the surface resistivity of the high-resistance film is greater than the surface resistivity of any structure provided on one side of the light-emitting surface of the display panel, and the volume resistivity of the high-resistance film is greater than that provided on the light-emitting surface of the display panel. Volume resistivity of any structure on one side.

In an implementation manner of the first aspect, the display module further includes a polarizer and optical glue disposed between the display panel and the cover;

Wherein, the surface resistivity of the high-resistance film is greater than the surface resistivity of any one of the cover plate, the polarizer and the optical glue, and the volume resistivity of the high-resistance film is greater than the cover plate , the volume resistivity of any one of the polarizer and the optical glue.

In an implementation manner of the first aspect, the high-resistance film is provided between the polarizer and the cover plate.

In an implementation manner of the first aspect, the high-resistance film is respectively connected to the cover plate and the polarizer through optical glue. fixed.

In an implementation manner of the first aspect, the high-resistance film is provided between the polarizer and the display panel.

In an implementation manner of the first aspect, the high-resistance film is prepared on the display panel by thin film technology.

In an implementation manner of the first aspect, the ratio between the surface resistivity of the high-resistance film and the surface resistivity of any structure provided on the light-emitting surface side of the display panel is greater than 100, and the high-resistance film has a surface resistivity of more than 100. The ratio between the volume resistivity of the resistive film and the volume resistivity of any structure disposed on the light-emitting surface side of the display panel is greater than 100.

In an implementation manner of the first aspect, the surface resistivity of the high-resistance film is greater than 1×10 ¹⁴ Ω, and the volume resistivity of the high-resistance film is greater than 1×10 ¹³ Ω·cm.

In an implementation manner of the first aspect, the thickness of the high-resistance film is d, d≤100 μm.

In an implementation of the first aspect, 10 μm ≤ d ≤ 20 μm.

In an implementation manner of the first aspect, the high resistance film is at least one of a PET film and a PI film.

In a second aspect, the present application provides an electronic device, including the display module provided in the first aspect.

Compared with display modules in the prior art, the display module provided by this application is equivalent to having a larger surface resistivity and volume resistivity on the side of the display panel facing the cover than the original film layer structure. high resistance film. Then, when a higher voltage accumulates on one side of the cover plate above the display panel due to friction and other reasons, when the current generated by the higher voltage flows through the high-resistance film, there will be a large voltage drop on the high-resistance film. This prevents the higher voltage from causing a large voltage drop inside the display panel. The friction voltage inside the display panel in the display module provided by this application is small, which reduces the impact on the performance of the internal components of the display panel. At the same time, these small friction voltages are easily dissipated.

Description of the drawings

Figure 1 is a schematic diagram of a display module provided by an embodiment of the present application;

Figure 2 is a schematic diagram of a display module provided by an embodiment of the present application;

Figure 3 is a partially enlarged schematic diagram of a display module provided by an embodiment of the present application;

Figure 4 is a partially enlarged schematic diagram of a display module provided by an embodiment of the present application;

Figure 5 is a partially enlarged schematic diagram of a display module provided by an embodiment of the present application;

Figure 6 is a partially enlarged schematic diagram of a display module provided by an embodiment of the present application;

Figure 7 is a partially enlarged schematic diagram of a display module provided by an embodiment of the present application;

Figure 8 is a partially enlarged schematic diagram of a display module provided by an embodiment of the present application;

Figure 9 is a partially enlarged schematic diagram of a display module provided by an embodiment of the present application;

Figure 10 is a schematic diagram of an electronic device provided by an embodiment of the present application.

Detailed ways

The terms used in the embodiments of the present application are only used to explain specific embodiments of the present application and are not intended to limit the present application.

FIG. 1 is a schematic diagram of a display module provided by an embodiment of the present application, and FIG. 2 is a schematic diagram of a display module provided by an embodiment of the present application.

As shown in FIG. 1 , the display module provided by the present application can be a curved display module, that is, the display panel 10 included in it is a display panel with a curved structure, or it can be a flexible display panel. Specifically, the display provided by this application The module can be applied to electronic devices containing a double-curved screen or to electronic devices containing a quadrature-curved screen.

As shown in FIG. 2 , the display module provided by the present application can also be a flat display module, that is, the display panel 10 it includes is a display panel with a flat structure, and specifically can be a rigid display panel.

FIG. 3 is a partially enlarged schematic diagram of a display module provided by an embodiment of the present application.

As shown in Figure 3, the display module provided by the embodiment of the present application includes a display panel 10, a cover plate 20, and a high-resistance film 30. The cover plate 20 and the high-resistance film 30 are both disposed on the light-emitting surface side of the display panel 10. And the high-resistance film 30 is provided between the display panel 10 and the cover plate 20 .

The cover 20 may be a glass cover, and is used to protect the display panel 10 . In addition, when the display module is applied to a curved display module, the cover plate 20 can have a curved structure and the display panel 10 can be a flexible display panel, and the cover plate 20 can restrict the display panel 10 to a curved structure. Since the high-resistance film 30 is disposed between the display panel 10 and the cover plate 20 , the cover plate 20 can also protect the display panel 10 .

The display panel 10 may be a liquid crystal display panel, an organic light-emitting display panel or a micro-diode display panel. When the display panel 10 is a flexible display panel, the display panel 10 may specifically be an organic light-emitting display panel.

In addition, in addition to the cover plate 20 and the high-resistance film 30 , the light-emitting surface side of the display panel 10 may also include other film layer structures. In the application, the surface resistivity of the high-resistance film 30 is greater than the surface resistivity of any structure disposed on the light-emitting surface side of the display panel 10 , and the volume resistivity of the high-resistance film 30 is greater than that of any structure disposed on the light-emitting surface side of the display panel 10 Volume resistivity of any structure on.

For example, when only the cover 20 and the high-resistance film 30 are provided on the light-emitting surface side of the display panel 10 , the surface resistivity of the high-resistance film 30 is greater than the surface resistivity of the cover 20 and the volume resistance of the high-resistance film 30 The resistivity is greater than the volume resistivity of the cover plate 20 . For example, when the cover plate 20, the high-resistance film 30 and other film layer structures are provided on the light-emitting surface side of the display panel 10, the surface resistivity of the high-resistance film 30 is not only greater than the surface resistivity of the cover plate 20 but also greater than the surface resistivity of the cover plate 20. The volume resistivity of the high-resistance film 30 is greater than the volume resistivity of the cover plate 20 and is greater than the surface resistivity of the other film structures.

Compared with display modules in the prior art, the display module provided by this application is equivalent to adding a layer on the side of the display panel 10 facing the cover 20 that has a greater surface resistivity and volume relative to the original film layer structure. High resistivity film 30. Then, when a higher voltage accumulates on one side of the cover 20 above the display panel 10 due to friction or other reasons, when the current generated by the higher voltage flows through the high-resistance film 30, there will be a large gap on the high-resistance film 30. voltage drop, thus preventing the higher voltage from causing a large voltage drop inside the display panel 10 . The friction voltage inside the display panel 10 in the display module provided by the present application is small, which reduces the impact on the performance of the internal components of the display panel 10. At the same time, these small friction voltages are easily dissipated.

In one embodiment of the present application, please continue to refer to FIG. 3 . The display module also includes a polarizer 40 and an optical glue 50 disposed on one side of the light-emitting surface of the display panel 10 . The polarizer 40 and the optical glue 50 can be disposed on the display panel 10 . between panel 10 and cover 20.

Among them, the polarizer 40 is disposed on the light-emitting surface side of the display panel 10, which can reduce the external light incident into the display panel 10, thereby reducing the reflection of the external light by the display panel 10 and improving the luminous brightness of the display panel.

Optically clear adhesive (OCA) 50 is colorless and transparent, with a light transmittance of more than 95%. It has the characteristics of good joint strength, easy curing and small curing shrinkage, and can be used to bond the connected film structure during the assembly process of the display module. For example, the optical glue 50 can bond the polarizer 40 and the high-resistance film 30 together.

In this embodiment, the surface resistivity of the high-resistance film 30 is greater than the surface resistivity of any one of the cover plate 20 , the polarizer 40 , and the optical glue 50 , and the volume resistivity of the high-resistance film 30 is greater than the cover plate 20 , the polarizer 50 , and the cover plate 20 . The volume resistivity of any one of the sheet 40 and the optical glue 50. That is to say, this embodiment provides a display module. Among the cover 20 , high-resistance film 30 , polarizer 40 and optical glue 50 provided on the light-emitting surface side of the display panel 10 , the surface of the high-resistance film 30 The resistivity and volume resistivity are the largest.

In one embodiment of the present application, the ratio between the surface resistivity of the high-resistance film 30 and the surface resistivity of any structure disposed on the light-emitting surface side of the display panel 10 is greater than 100, and the volume resistance of the high-resistance film 30 The ratio between the resistivity and the volume resistivity of any structure disposed on the light-emitting surface side of the display panel 10 is greater than 100.

For example, when the polarizer 40 and the optical glue 50 are also disposed on the light-emitting surface side of the display panel 10, the surface resistivity of the high-resistance film 30 is higher than the surface resistivity of the cover plate 20, the surface resistivity of the polarizer 40, and the optical glue. The surface resistivity of the glue 50 is two orders of magnitude higher, and the volume resistivity of the high-resistance film 30 is two orders of magnitude higher than the volume resistivity of the cover plate 20, the volume resistivity of the polarizer 40, and the volume resistivity of the optical glue 50. .

The inventor found that when the surface resistivity and volume resistivity of the high-resistance film 30 are two orders of magnitude higher than the surface resistivity and volume resistivity of any other structure disposed on the light-emitting surface side of the display panel, the cover plate 20 can be realized. Most of the upper friction voltage falls on the high-resistance film 30 during the downward conduction process, eventually reducing the voltage accumulated inside the display panel 10 by more than 50%. Therefore, the impact of the friction voltage on the devices in the display panel 10 can be effectively reduced, for example, the impact of the friction voltage on the transistors in the display panel 10 can be effectively reduced, thereby ensuring the display effect of the display panel 10 .

In one implementation of this embodiment, the surface resistivity of the high-resistance film 30 is greater than 1×10 ¹⁴ Ω. When "Ω" is used as the measurement unit of surface resistivity, the surface resistivity of the cover plate 20 , polarizer 40 and optical glue 50 in the display module is usually less than or equal to 12, then the surface resistivity of the high-resistance film 30 is When the order of magnitude is 14, it can be ensured that the surface resistivity of the high-resistance film 30 is two orders of magnitude higher than the surface resistivity of the cover plate 20 , the surface resistivity of the polarizer 40 , and the surface resistivity of the optical glue 50 .

In one implementation of this embodiment, the volume resistivity of the high-resistance film 30 is greater than 1×10 ¹³ Ω·cm. When "Ω·cm" is used as the measurement unit of volume resistivity, the volume resistivity of the cover plate 20 , polarizer 40 and optical glue 50 in the display module is usually less than or equal to 11, then the surface resistance of the high-resistance film 30 When the order of magnitude of the resistance is 13, it can be ensured that the volume resistivity of the high-resistance film 30 is two orders of magnitude higher than the volume resistivity of the cover plate 20 , the volume resistivity of the polarizer 40 , and the volume resistivity of the optical glue 50 .

In one embodiment of the present application, the thickness of the high-resistance film 30 is d, and d≤100 μm. For example, d=50μm. Setting the thickness of the high-resistance film 30 to less than or equal to 100 μm can reduce the impact of the addition of the high-resistance film 30 on the thickness of the display module and ensure a good user experience; at the same time, it can ensure that the high-resistance film 30 has excellent light transmittance. Ensure the display brightness of the display module.

Optionally, 10μm≤d≤20μm.

In one embodiment of the present application, the high-resistance film 30 may be at least one of a PET (polyethylene terephthalate, PET) film and a PI (polyimide, PI) film. For example, a PET film is included between the display panel 10 and the cover plate 20 , or a PI film is included between the display panel 10 and the cover plate 20 , or the display panel 10 and the cover plate 20 are made of a PET film. This includes PET film and PI film.

Since PET film and PI film themselves have large surface resistivity and volume resistivity, and both can have high light transmittance, applying PET film and PI film to display modules is easy to implement and basically does not affect the display module. The brightness of the group's light is affected.

Table 1 shows the potential in a display module without a high-resistance film 30, the potential in a display module using a PET film as the high-resistance film 30, and the potential in a display module using a PI film as the high-resistance film 30. The results of the test. In Table 1, display module 1 does not have a display module with a high-resistance film 30 between the display panel 10 and the cover 20; the difference between display module 2 and display module 1 is that between the display panel 10 and the cover 20 A display module with a PET film with a thickness of 50 μm is set between the display panel 10 and the cover plate 20; the difference between the display module 3 and the display module 1 is that a display module with a PI film with a thickness of 50 μm is set between the display panel 10 and the cover plate 20. Group. Position 1 in the display panel is the edge position in the display panel, and position 2 in the display panel is the position 100 μm away from the edge in the display panel. According to Table 1, it can be seen that using a PET film or a PI film as the high-resistance film 30 between the display panel 10 and the cover 20 can significantly improve the impact of tribostatic electricity on the devices in the display panel 10 .

Specifically, as shown in Table 1, the potential at the edge of the display panel of the display module without the high resistance film 30 is -66.74V, and the potential at the edge of the display panel of the display module with the PET film as the high resistance film 30 is -66.74V. The electric potential is

-10.73V, the potential at the edge of the display panel of the display module using the PI film as the high-resistance film 30 is -35.56V; the potential at the position 100 μm away from the edge of the display panel of the display module without the high-resistance film 30 is -10.73V. -64.28V, the potential at a position 100 μm from the edge of the display panel of the display module using the PET film as the high-resistance film 30 is -9.15V, and the potential at a position 100 μm from the edge of the display panel of the display module using the PI film as the high-resistance film 30 The potential at the location is -23.84V. It can be concluded that the potential in the display panel of the display module using the PET film as the high-resistance film 30 is reduced by about 85% relative to the potential in the display panel of the display module without the high-resistance film 30. The PI film is used as the display panel. The potential in the display panel of the display module with the high-resistance film 30 is reduced by about 55% relative to the potential in the display panel of the display module without the high-resistance film 30 .

Table 1

In one embodiment of the present application, as shown in FIG. 3 , the high-resistance film 30 is disposed between the polarizer 40 and the cover plate 20 .

In one implementation of this embodiment, as shown in FIG. 3 , the high-resistance film 30 is fixed to the cover plate 20 and the polarizer 40 respectively through optical glue 50 .

In this embodiment, the high-resistance film 30 may be a PET film and/or a PI film, and the PET film and/or PI film in this embodiment may be disposed between the display panel 10 and the cover 20 through a lamination process. .

Taking a display module using PET film as the high-resistance film 30 as an example, the preparation process of the display module is explained:

S1: Preparing the motherboard of the display panel 10, including depositing a transistor array on the base substrate, preparing light-emitting devices and various insulating layers and other PI;

S2: cutting the motherboard to form the display panel 10;

S3: Laminate the polarizer 40 on the light-emitting surface side of the display panel 10;

S4: Paste the PET film on the side of the polarizer 40 away from the display panel 10. Specifically, the polarizer 40 and the PET film can be pasted together through the optical glue 51;

S5: The cover plate 20 is bonded to the side of the PET film away from the polarizer 40. Specifically, the PET film and the cover plate 20 can be bonded through the optical glue 52. The cover 20 may be a curved cover.

Since the finished PET film or PI film is easy to obtain and customize, and the cost is low, the increased cost of the display module provided in this embodiment is very small.

FIG. 4 is a partially enlarged schematic diagram of a display module provided by an embodiment of the present application.

Please refer to FIG. 4 . When the display module provided by the embodiment of the present application is a curved display module, the substrate in the display panel 10 is usually a flexible substrate, and the display module may also include a support layer 60 . The support layer 60 is located on the backlight side of the display panel 10 and is used to provide support for the display panel 10 . During the preparation process of the display module, the support layer 60 can be bonded to the side of the motherboard corresponding to the backlight surface of the display panel.

In addition, please continue to refer to Figure 4. The display module can also include a shielding layer 70 and a buffer layer 80. The shielding layer 70 can shield the signal from the back of the display module from interfering with the devices and signal lines in the display panel 10. The buffer layer The layer 80 can protect the devices and signal lines in the display panel 10 from external impact force. Specifically, the shielding layer 70 can be made of stainless steel (steel usestainless, SUS), and the buffer layer 80 can be made of thermoplastic polyurethanes (TPU).

The shielding layer 70 and the buffer layer 80 can both be disposed on the side of the support layer 60 away from the display panel 10 , and the buffer layer 80 can be disposed on the side of the shielding layer 70 close to the display panel 10 . During the preparation process of the display module, after the high-resistance film 30 and the cover plate 20 are bonded, the buffer layer 80 can be bonded to the support layer 60 , and the shielding layer 70 and the buffer layer 80 can be bonded.

FIG. 5 is a partially enlarged schematic diagram of a display module provided by an embodiment of the present application. FIG. 6 is a partially enlarged schematic diagram of a display module provided by an embodiment of the present application.

In one embodiment of the present application, as shown in FIGS. 5 and 6 , the high-resistance film is disposed between the polarizer 40 and the display panel 10 .

In one implementation of this embodiment, as shown in FIG. 5 , the high-resistance film 30 is fixed to the display panel 10 and the polarizer 40 respectively through optical glue 50 .

In this implementation, the high-resistance film 30 may be a PET film and/or a PI film, and the PET film and/or PI film in this implementation may be disposed between the display panel 10 and the cover 20 through a lamination process. .

S2: cutting the motherboard to form the display panel 10;

S3: Paste the PET film on the light-emitting surface side of the display panel 10. Specifically, the PET film can be glued through the optical glue 51. The film is bonded to the display panel 10;

S4: Laminate the polarizer 40 on the side of the PET film away from the display panel 10;

S5: The cover plate 20 is bonded to the side of the polarizer 40 away from the PET film. Specifically, the polarizer 40 and the cover plate 20 can be bonded through the optical glue 52 . The cover 20 may be a curved cover.

Since the finished PET film or PI film is easy to obtain and customize, and the cost is low, the added cost of the display module provided by this implementation is very small.

In another implementation of this embodiment, as shown in FIG. 6 , the high-resistance film 30 is prepared on the display panel 10 using thin film technology.

In this implementation, the high resistance film 30 may be a PI film.

Taking a display module in which the PI film is used as the high-resistance film 30 as an example, the preparation process of the display module is explained:

S2: Prepare a PI film on the side of the motherboard corresponding to the light-emitting surface of the display panel, including coating liquid PI on the motherboard and then solidifying the liquid PI to form a PI film;

S3: Cut the motherboard to form the display panel 10, and a PI film is provided on one side of the light-emitting surface of the display panel 10;

S4: Laminate the polarizer 40 on the side of the PI film away from the display panel 10;

S5: The cover plate 20 is bonded to the side of the polarizer 40 away from the high-resistance film 30 . Specifically, the polarizer 40 and the cover plate 20 can be bonded through the optical glue 52 . The cover 20 may be a curved cover.

In this implementation, since the PI film is prepared at the motherboard stage, there is no need to prepare each display panel 10 , so the display module preparation efficiency is high.

FIG. 7 is a partially enlarged schematic diagram of a display module provided by an embodiment of the present application. FIG. 8 is a partially enlarged schematic diagram of a display module provided by an embodiment of the present application.

It should be noted that, as shown in FIG. 7 and FIG. 8 , the display module provided in this embodiment may also include a support layer 60 , a shielding layer 70 and a buffer layer 80 , and the support layer 60 , the shielding layer 70 and the buffer layer The preparation process of 80 is basically the same as that of the previous embodiment and will not be described again.

FIG. 9 is a partially enlarged schematic diagram of a display module provided by an embodiment of the present application.

In one embodiment of the present application, as shown in FIG. 9 , two high-resistance films 30 may be included between the display panel 10 and the cover 20 , namely a high-resistance film 31 and a high-resistance film 32 .

The high-resistance film 31 may be located between the polarizer 40 and the display panel 10 , and the high-resistance film 32 may be located between the polarizer 40 and the cover plate 20 .

In one implementation, the high-resistance film 31 can be prepared on the display panel 10 through thin film technology, and specifically can be a PI film; the high-resistance film 32 can be bonded to the polarizer through optical glue 51 and bonded to the cover through optical glue 52 Board 20 fit.

This application also provides an electronic device, including the display module provided in any of the above embodiments. In addition, the electronic device provided by this application may also include other components such as batteries, circuit boards, and casings. The specific structure of the display module has been described in detail in the above embodiments and will not be described again here.

As shown in Figure 10, the electronic device provided by this application can be a mobile phone. The electronic equipment provided by this application is in addition to In addition to the mobile phone shown in Figure 10, it can also be any electronic device with a display function such as a tablet computer, a notebook computer, an electronic paper book, a television, a smart watch, etc.

In the electronic device provided by this application, since the display module includes a high-resistance film with greater surface resistivity and volume resistivity located on the light-emitting side of the display panel, the display panel is affected by external frictional charges and The influence of voltage is significantly reduced. Therefore, the electronic device provided by the present application has stable and excellent display effects.

The above are only specific embodiments of the present application. Any person familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, and they should be covered by the protection scope of the present application. The protection scope of this application shall be subject to the protection scope of the claims.

Claims

A display module is characterized by including:

display panel;

a cover plate, which is arranged on one side of the light-emitting surface of the display panel;

A high-resistance film, the high-resistance film is provided between the display panel and the cover plate;

Wherein, the surface resistivity of the high-resistance film is greater than the surface resistivity of any structure provided on one side of the light-emitting surface of the display panel, and the volume resistivity of the high-resistance film is greater than that provided on the light-emitting surface of the display panel. Volume resistivity of any structure on one side.
The display module according to claim 1, wherein the display module further includes a polarizer and optical glue disposed between the display panel and the cover;

Wherein, the surface resistivity of the high-resistance film is greater than the surface resistivity of any one of the cover plate, the polarizer and the optical glue, and the volume resistivity of the high-resistance film is greater than the cover plate , the volume resistivity of any one of the polarizer and the optical glue.
The display module according to claim 2, wherein the high-resistance film is disposed between the polarizer and the cover plate.
The display module according to claim 3, wherein the high-resistance film is fixed to the cover plate and the polarizer respectively through optical glue.
The display module according to claim 2, wherein the high-resistance film is disposed between the polarizer and the display panel.
The display module according to claim 5, wherein the high-resistance film is prepared on the display panel by thin film technology.
The display module according to claim 1, wherein the ratio between the surface resistivity of the high-resistance film and the surface resistivity of any structure disposed on the light-emitting surface side of the display panel is greater than 100, And the ratio between the volume resistivity of the high-resistance film and the volume resistivity of any structure provided on the light-emitting surface side of the display panel is greater than 100.
The display module according to claim 1, wherein the surface resistivity of the high-resistance film is greater than 1×10 14 Ω, and the volume resistivity of the high-resistance film is greater than 1×10 13 Ω·cm.
The display module according to claim 1, wherein the thickness of the high-resistance film is d, d≤100 μm.
The display module according to claim 9, wherein 10 μm≤d≤20 μm.
The display module according to claim 1, wherein the high resistance film is at least one of a PET film and a PI film.
An electronic device, characterized by including the display module according to any one of claims 1-11.