WO2023206974A1 - Structure de conditionnement et procédé de conditionnement associé, appareil photoélectrique, unité de réception et radar laser - Google Patents

Structure de conditionnement et procédé de conditionnement associé, appareil photoélectrique, unité de réception et radar laser Download PDF

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Publication number
WO2023206974A1
WO2023206974A1 PCT/CN2022/124125 CN2022124125W WO2023206974A1 WO 2023206974 A1 WO2023206974 A1 WO 2023206974A1 CN 2022124125 W CN2022124125 W CN 2022124125W WO 2023206974 A1 WO2023206974 A1 WO 2023206974A1
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WO
WIPO (PCT)
Prior art keywords
packaging
light
optoelectronic device
opening
detector
Prior art date
Application number
PCT/CN2022/124125
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English (en)
Chinese (zh)
Inventor
李超
吴畏
王吉
陶俊
李磊
向少卿
Original Assignee
上海禾赛科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Priority claimed from CN202210447000.0A external-priority patent/CN116990779A/zh
Priority claimed from CN202210446736.6A external-priority patent/CN116995105A/zh
Application filed by 上海禾赛科技有限公司 filed Critical 上海禾赛科技有限公司
Publication of WO2023206974A1 publication Critical patent/WO2023206974A1/fr

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
    • G01S7/48—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00
    • G01S7/481—Constructional features, e.g. arrangements of optical elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes

Definitions

  • Embodiments of the present invention relate to the field of packaging technology, and in particular, to a packaging structure and packaging method thereof, an optoelectronic device, a receiving unit, and a laser radar.
  • the packaging of electronic components such as optoelectronic devices not only plays a role in installing, setting, sealing, protecting chips, and enhancing electrothermal performance, but also connects to the pins of the package shell with wires through the contacts on the optoelectronic devices.
  • these pins are connected to other devices through wires on the printed circuit board, thereby realizing the connection between the optoelectronic device and the external circuit.
  • Optoelectronic devices must be isolated from the outside world to prevent impurities or moisture in the air from corroding the optoelectronic devices and causing a decrease in electrical performance.
  • encapsulated optoelectronic devices are also easier to install and transport.
  • Lidar is a commonly used ranging sensor with the characteristics of long detection range, high resolution, and low environmental interference. It is widely used in fields such as intelligent robots, drones, and unmanned driving.
  • the working principle of lidar is to use the time it takes for laser light to travel back and forth between the radar and the target, or the frequency shift produced by the frequency-modulated continuous light traveling back and forth between the radar and the target to evaluate information such as the distance or speed of the target.
  • stray light in lidar includes external stray light and internal stray light.
  • external stray light is usually formed by the incidence of other laser radar lasers or sunlight, while internal stray light is mainly formed by the outgoing light signal or reflected light signal being scattered by the inner wall of the structural member or reflected or scattered by the surface of the optical element.
  • stray light After stray light enters the detector chip, it will be detected by the detector chip, thereby generating a noise signal, reducing the signal-to-noise ratio of the detector chip, and thus affecting the key performance indicators of the lidar.
  • an external mechanical diaphragm (as shown in Figure 15) is usually installed in the optical path at the front end of the detector chip to block most of the stray light from entering the detector chip.
  • One aspect of the embodiments of the present invention solves the problem of providing a packaging structure, a packaging method thereof, and an optoelectronic device, which are conducive to improving the performance and reliability of the packaging structure while reducing packaging costs.
  • Another aspect of the embodiment of the present invention solves the problem of providing a detector packaging structure, packaging method, receiving unit and laser radar, integrating the aperture into the packaging structure, and the distance between the aperture and the photosensitive surface of the detector and the aperture
  • the window size is significantly reduced, which is beneficial to improving the diaphragm's ability to control stray light.
  • an embodiment of the present invention provides a packaging structure, which includes: a packaging carrier; and a device structure, which is disposed on the top of the packaging carrier.
  • the device structure includes an optoelectronic device, and the optoelectronic device includes a device facing away from the device.
  • the first surface of the packaging carrier the first surface including a working area
  • an packaging layer located on the top of the packaging carrier on the side of the optoelectronic device, the packaging layer covering the side wall of the optoelectronic device, and
  • the top surface of the packaging layer is higher than the first surface
  • the opening penetrates the packaging layer at the top of the working area of the optoelectronic device, the opening has a step, the opening includes a first opening and a second opening, and the third opening
  • the lateral size of an opening is smaller than the lateral size of the second opening, and the top of the first opening is connected with the bottom of the second opening
  • a light-transmitting component is provided in the second opening, and the light-transmitting component is located at On the step, the light-transmitting component, the packaging layer of the first opening sidewall, and the optoelectronic device in the working area form a cavity.
  • an embodiment of the present invention provides a packaging method, which includes: providing a packaging carrier; and arranging a device structure on the packaging carrier.
  • the device structure includes an optoelectronic device, and the optoelectronic device includes a device facing away from the package.
  • the first surface of the carrier board the first surface includes a working area; a step-shaped placeholder is provided on the top of the working area of the optoelectronic device, the placeholder includes a first component and a second component, the The top of the first component is connected to the bottom of the second component, and the lateral size of the first component is smaller than the lateral size of the second component.
  • the first component is used to define the position and shape of the first opening.
  • the second component is used to define the position and shape of the second opening; an encapsulation layer is formed on the top of the packaging carrier on the side of the optoelectronic device and the placeholder, and the encapsulation layer covers the optoelectronic device and the placeholder.
  • the side wall of the component remove the placeholder, and form an opening with a step in the packaging layer, the opening includes a first opening and a second opening, and the top of the first opening is in contact with the second opening The bottom is connected, and the first opening exposes the working area; a light-transmitting component is provided in the second opening, the light-transmitting component is located on the step, and the light-transmitting component is connected to the first
  • the encapsulation layer on the side wall of the opening and the optoelectronic device in the working area form a cavity.
  • embodiments of the present invention provide an optoelectronic device, which includes the packaging structure provided by embodiments of the present invention, wherein the optoelectronic device includes a semiconductor laser or a photodetector.
  • the present invention provides a detector packaging structure, including:
  • the diaphragm window assembly includes: a light-transmitting area and a non-light-transmitting area.
  • the aperture window assembly includes: a window element, the window element is arranged in the light-transmitting window; an aperture layer, the aperture layer is located on one surface of the window element; the aperture window One of the part with the diaphragm layer and the part without the diaphragm layer in the component is the light-transmitting area, and the other is the non-light-transmitting area.
  • the distance between the surface of the diaphragm layer and the photosensitive surface is less than 1 mm.
  • the aperture layer is located on the surface of the window element facing away from the detector.
  • the thickness of the aperture layer ranges from 5 to 200 ⁇ m.
  • the material of the diaphragm layer includes at least one of metal, ceramic, plastic, paint and ink.
  • the transmittance of the diaphragm layer to the working band light is less than 0.5%.
  • the material of the window element includes: at least one of glass, quartz, sapphire, plastic and diamond.
  • the light-transmitting window includes: a first opening and a second opening that communicate with each other, and the second opening is located between the first opening and the detector; the diaphragm window assembly fills the First to speak.
  • one end of the light-transmitting window close to the detector has a step portion protruding from the side wall, and the aperture window assembly is located on the surface of the step portion facing away from the detector.
  • the detector includes one or more photosensitive areas, and the multiple photosensitive areas are distributed in the photosensitive surface; the diaphragm window assembly includes: one or more light-transmitting areas.
  • the plurality of light-transmitting areas correspond to the plurality of photosensitive areas one-to-one.
  • a receiving unit includes: a packaged detector, and the packaged detector is the detector packaging structure of the present invention.
  • it also includes: a receiving optical component, the receiving optical component is suitable for transmitting light; the packaged detector receives the light transmitted by the receiving optical component.
  • At least one of the light-transmitting area and the non-light-transmitting area is set according to the incident angle of the light transmitted by the receiving optical component and the photosensitive area of the detector.
  • a laser radar including: a transmitting unit, the transmitting unit is suitable for generating detection light; the detection light is reflected to form echo light; a receiving unit, the receiving unit is suitable for receiving the echo light, the receiving unit is The receiving unit of the present invention.
  • a method of packaging a detector including: forming an aperture window assembly, the aperture window assembly including: a light-transmitting area and a non-light-transmitting area; assembling a detector on a packaging carrier board; and realizing the connection between the detector and the packaging carrier board. Electrical interconnection; fixedly connecting a protection bracket to the packaging carrier board, the protection bracket forming a cavity on the packaging carrier board to accommodate the detector, the protection bracket having a light-transmitting window, the light-transmitting window Penetrate the protective bracket and correspond to the position of the detector; fix the diaphragm window assembly in the light-transmitting window, and the light-transmitting area and the non-light-transmitting area are parallel to the detector Direction setting of photosensitive surface.
  • the step of forming the aperture window assembly includes: providing a window element; and forming an aperture layer on one surface of the window element.
  • the step of forming an aperture layer on one surface of the window element includes: forming an aperture layer on one surface of the window element by silk printing, spraying or bonding.
  • Embodiments of the present invention provide a packaging method.
  • a step-shaped placeholder is provided on the top of the working area of the optoelectronic device, and the placeholder is removed after the packaging layer is formed, thereby forming an opening with steps in the packaging layer.
  • the opening includes The first opening and the second opening are connected, and the top of the first opening is connected with the bottom of the second opening.
  • the first opening exposes the working area, and then a light-transmitting component is set in the second opening, and the light-transmitting component is located on the step.
  • the packaging layer is used to realize the control of the rest of the optoelectronic device except the working area. Encapsulation reduces the risk of exposure of optoelectronic devices and accordingly improves the reliability of the packaging structure; by placing placeholders on top of the optoelectronic devices, a cavity can be formed above the work area, which is conducive to ensuring the safety of the optoelectronic devices.
  • occupying the spatial position of the opening through placeholders is also beneficial to reducing the The process of forming the opening does not cause damage to the working area; in addition, the packaging cost is reduced by using an encapsulation layer to achieve sealing.
  • the aperture window assembly is fixed in the light-transmitting window to protect the detector and internal components; and the aperture window assembly has a light-transmitting area and a non-light-transmitting area, which can Allowing light to pass through to effectively reach the photosensitive surface of the detector, it can also suppress stray light and integrate the function of an aperture. That is, the aperture window component integrates the function of an aperture. Therefore, using the detector
  • the optical path of the device packaging structure can eliminate the need for an external mechanical diaphragm, which can not only improve the blocking ability of stray light, but also reduce the possibility of stray light generation; integrating the diaphragm in the packaging structure can effectively improve the light-transmitting area.
  • the position accuracy improves the effectiveness of blocking stray light, and can also reduce the distance between the aperture and the detector, which is beneficial to the control of the window size.
  • the aperture window assembly includes: a window element and an aperture layer on its surface.
  • the aperture window component has a simple structure and can effectively reduce the difficulty and cost of forming the packaging structure.
  • the distance between the surface of the aperture layer and the photosensitive surface of the detector is small, which can effectively improve the integration of the packaging structure and is conducive to ensuring the window size and stray light blocking effect. Take into consideration.
  • the thickness of the aperture layer is smaller, which on the one hand can avoid affecting the acceptance performance of the detector and ensure the lighting intensity of the detector; on the other hand, it can also effectively ensure the flattening of the surface of the detector packaging structure. Conducive to the realization of automated assembly.
  • the aperture layer is located on the surface of the window element facing away from the detector, which can effectively control the influence of the aperture layer on the detector and ensure the stability of the detector packaging environment; and
  • the aperture layer material has a low volatilization rate, which can effectively prevent the aperture layer material from contaminating other components.
  • one end of the light-transmitting window close to the detector has a step portion protruding from the side wall, and the aperture window assembly is located on the surface of the step portion facing away from the detector. Fixing the light-transmitting window assembly through the step portion can effectively ensure the stability of the light-transmitting window assembly, which is beneficial to the expansion of the process window and the improvement of device stability.
  • At least one of the light-transmitting area and the non-light-transmitting area of the diaphragm window component is set according to the incident angle of the light transmitted by the receiving optical component and the photosensitive area of the detector, so that it can be used in the optical path.
  • the setting of an external mechanical diaphragm is omitted, which is beneficial to improving the stray light blocking effect and improving the signal-to-noise ratio.
  • Figure 1 is a schematic structural diagram of the first embodiment of the packaging structure of the present invention.
  • Figure 2 is a schematic structural diagram of a second embodiment of the packaging structure of the present invention.
  • Figure 3 is a schematic structural diagram of the third embodiment of the packaging structure of the present invention.
  • Figures 4 to 10 are schematic structural diagrams corresponding to each step in the first embodiment of the packaging method of the present invention.
  • Figures 11 to 13 are schematic structural diagrams corresponding to each step in the second embodiment of the packaging method of the present invention.
  • Figure 14 is a schematic structural diagram corresponding to each step in the third embodiment of the packaging method of the present invention.
  • Figure 15 is a schematic diagram of the three-dimensional structure of an external mechanical diaphragm
  • Figure 16 is a schematic top view of another external mechanical diaphragm
  • Figure 17 is a schematic cross-sectional structural diagram of an embodiment of the detector packaging structure of the present invention.
  • Figure 18 is a schematic cross-sectional structural diagram of the embodiment of the detector package structure described in Figure 17 before the aperture window assembly is assembled;
  • Figure 19 is a top structural schematic diagram of the aperture window assembly of the embodiment of the detector package structure described in Figure 17;
  • Figure 20 is a schematic cross-sectional structural diagram of another embodiment of the detector packaging structure of the present invention.
  • Figure 21 is a schematic cross-sectional structural diagram of yet another embodiment of the detector packaging structure of the present invention.
  • Figure 22 is a schematic flow chart of an embodiment of the detector packaging method of the present invention.
  • the first way is to use transparent plastic sealing material for plastic sealing.
  • this method has certain limitations.
  • the photodetector is the core component of the lidar receiving unit and is also a key factor in determining lidar performance.
  • Laser detectors used in lidar have high optical sensitivity requirements.
  • one approach is to create microlenses (for example, microlens arrays) in the photosensitive area of the photodetector surface, thereby concentrating the incident light. Focus the light on the photosensitive area to improve the optical sensitivity of the photodetector and improve detection efficiency.
  • the transparent plastic packaging significantly reduces the light-gathering effect of the microlens, severely limiting the optical sensitivity and detection performance.
  • the second method is airtight packaging, which uses ceramic packaging or metal packaging to form an airtight cavity above the working area of the optoelectronic device, ensuring the normal operation of the optoelectronic device.
  • this solution has a high process cost and is generally used for Price-insensitive scenarios such as military industry and aerospace.
  • the third method is COB packaging, but because there is no encapsulation or airtight cavity, the optoelectronic devices are exposed, increasing the risk of contact with the outside air, and the reliability cannot meet market demand. Therefore, the reliability, process cost and optical sensitivity of the packaging structure formed by the current packaging method cannot be fully compatible.
  • inventions of the present invention provide a packaging method.
  • the method provides a step-shaped placeholder on the top of the working area of the optoelectronic device.
  • the placeholder includes a first component and a second component.
  • the first component The top of the component is connected to the bottom of the second component, and the lateral size of the first component is smaller than the lateral size of the second component.
  • the first component is used to define the position and shape of the first opening, and the second component is used to define the second opening.
  • an encapsulation layer is formed on the top of the packaging carrier on the side of the optoelectronic device and placeholder, the encapsulation layer also covers the sidewalls of the optoelectronic device and placeholder, and the placeholder is removed, forming in the encapsulation layer
  • An opening with steps the opening includes a first opening and a second opening, and the top of the first opening is connected with the bottom of the second opening, and the first opening exposes the working area; a light-transmitting component is provided in the second opening, and the light-transmitting component It is located on the step, and the light-transmitting component, the packaging layer on the side wall of the first opening, and the optoelectronic device in the working area form a cavity.
  • the encapsulation layer is used to encapsulate the rest of the optoelectronic device except the working area, which reduces the risk of exposure of the optoelectronic device and accordingly improves the reliability of the packaging structure; by placing a placeholder on the top of the optoelectronic device This way, a cavity can be formed above the working area, which is beneficial to ensuring the function of the optoelectronic device, thus improving the performance of the packaging structure. Moreover, occupying the spatial position of the opening through a placeholder is also beneficial to reducing the process of forming the opening. Damage to the work area; in addition, the packaging cost is reduced by using an encapsulation layer to achieve sealing.
  • Figure 1 is a schematic structural diagram of the first embodiment of the packaging structure of the present invention.
  • the packaging structure includes: a packaging carrier 205; a device structure (not labeled) disposed on the top of the packaging carrier 205, the device structure includes an optoelectronic device 206, and the optoelectronic device 206 includes a first surface 230 facing away from the packaging carrier 205, The first surface 230 includes a working area; an encapsulation layer 217 located on the top of the packaging carrier 205 on the side of the optoelectronic device 206, the encapsulation layer 217 covers the side walls of the optoelectronic device 206, and the top surface of the encapsulation layer 217 is higher than the first surface 230; the opening (not labeled), through the packaging layer 217 at the top of the working area of the optoelectronic device 206, the opening has a step, the opening includes a first opening and a second opening, the lateral size of the first opening is smaller than the lateral size of the second opening, and the lateral size of the first opening is The top is connected to
  • the encapsulation layer 217 is used to encapsulate the rest of the optoelectronic device 206 except the working area, which reduces the risk of exposure of the optoelectronic device 206 and accordingly improves the reliability of the packaging structure;
  • the opening of the encapsulation layer 217 at the top of the area has a step, and the light-transmitting component 222 is arranged in the second opening.
  • the light-transmitting component 222 is located on the step. Accordingly, the cavity 260 can be formed above the working area, which is beneficial to ensuring the optoelectronic device.
  • the packaging structure for example, when the optoelectronic device 206 has a photosensitive function, it is beneficial to improve the optical sensitivity and detection performance of the optoelectronic device 206), thereby improving the performance of the packaging structure; in addition, by using the packaging layer 217 to achieve sealing, the Packaging costs.
  • the packaging carrier 205 provides a process platform for packaging of the packaging structure.
  • the packaging carrier 205 includes stacked multi-layer metal lines 201 and dielectric layers 200 between adjacent metal lines 201, as well as the surface of the metal lines 201 on the top layer and the metal layer on the bottom layer.
  • Protective layer 202 on the surface of wire 201.
  • the multi-layer metal wire 201 is used to electrically connect with the device structure disposed above it.
  • the material of the multi-layer metal line 201 includes metal materials such as aluminum or copper.
  • the dielectric layer 200 is used to electrically isolate adjacent metal lines 201 .
  • the material of the dielectric layer 200 is an insulating material.
  • the material of the dielectric layer 200 includes one or more of silicon nitride, silicon oxide, and silicon oxynitride.
  • the material of the dielectric layer 200 is silicon oxide.
  • the protective layer 202 protects the multi-layer metal wires 201 and reduces the risk of the multi-layer metal wires 201 being exposed, thereby improving the performance of the packaging structure.
  • the material of the protective layer 202 includes one or more of silicon nitride, silicon oxide, and silicon oxynitride.
  • interconnect openings (not shown) exposing the metal lines 201 are formed in the protective layer 202 on the surface of the topmost metal line 201 . The interconnection opening exposes part of the surface of the topmost metal line 201 to achieve electrical connection between the package carrier 205 and the device structure disposed above it.
  • types of package carriers include, but are not limited to, lead frames, laminate substrates, ceramic substrates, and carrier tapes.
  • the optoelectronic device 206 is used to emit optical signals or receive optical signals.
  • the working area is an area used for sending or receiving optical signals.
  • the optoelectronic device 206 includes a semiconductor laser or a photodetector.
  • the optoelectronic device 206 is a photodetector.
  • the packaging structure further includes: a micro lens 207 located on the first surface 230 of the working area.
  • the microlens 207 functions to converge the incident light signal and concentrate the light signal in the working area, thereby improving the optical sensitivity and detection efficiency of the optoelectronic device 206 .
  • the packaging structure further includes: an adhesive layer (not labeled), which is disposed between the bottom of the device structure and the packaging carrier 205 .
  • the adhesive layer is used to place the device structure on the packaging carrier 205, thereby reducing the risk of the device structure falling off, thereby improving the performance of the packaging structure.
  • the adhesive layer is respectively disposed between the bottom of the optoelectronic device 206 and the packaging carrier 205 , and between the auxiliary processing device 208 and the packaging carrier 205 .
  • the packaging structure further includes: a first lead 209, one end of the first lead 209 is electrically connected to the optoelectronic device 206, and the other end is electrically connected to the packaging carrier 205.
  • the electrical connection between the optoelectronic device 206 and the packaging carrier 205 is achieved.
  • one end of the first lead 209 is electrically connected to the package carrier 205 through an interconnection opening located in the protective layer 202 .
  • the optoelectronic device can also be disposed on the packaging carrier in other ways and electrically connected to the packaging carrier.
  • the encapsulation layer 217 is used to encapsulate the rest of the optoelectronic device 206 except the working area, which reduces the risk of exposure of the optoelectronic device 206 and accordingly improves the reliability of the packaging structure; on the other hand, by using the encapsulation layer 217 to achieve sealing and reduce packaging costs.
  • the material of the encapsulation layer 217 includes epoxy resin and various additives.
  • the additives include one or more of a curing agent, a modifier, a release agent, a dye, and a flame retardant.
  • the orthographic projection range of the encapsulation layer 217 on the optoelectronic device 206 falls between the working areas, that is, the encapsulating layer 217 plays a role in sealing and fixing the parts between the working areas of the optoelectronic device 206, thereby reducing the risk of the optoelectronic device 206.
  • the risk of partial exposure outside the working area and accidental detachment of the device structure further improves the performance of the package structure.
  • the opening in the encapsulation layer 217 is used to realize the transmission of optical signals and provide a spatial location for the arrangement of the light-transmitting component 222 .
  • the lateral size of the first opening is smaller than the lateral size of the second opening, so that the opening has a step, and the second opening provides a spatial location for disposing the light-transmitting component 222 .
  • the bottom surface of the second opening is flat.
  • the bottom surface of the second opening serves as the bearing surface of the light-transmitting component 222.
  • the second opening with a flat bottom surface can increase the size of the light-transmitting component.
  • the firmness between 222 and the second opening reduces the risk of the light-transmitting component 222 slipping or moving, thereby improving the reliability of the packaging structure.
  • the longitudinal cross-sectional shape of the first opening includes a square, inverted trapezoid, or bowl shape.
  • the angle between the bottom of the square, inverted trapezoid, or bowl-shaped first opening and the side wall is greater than or equal to 90°, so that the first opening has a square, inverted trapezoid, or bowl shape.
  • the opening can provide a spatial location for accommodating the microlens 207; in addition, it ensures that the first opening exposes the working area and reduces the probability that the first opening blocks the optoelectronic device 206 when it emits or receives an optical signal, thereby improving the optoelectronic device 206.
  • connection between the side wall of the first opening and the first surface 230 is chamfered, which can reduce the probability of a gap occurring at the connection between the side wall of the first opening and the first surface 230.
  • This reduces the risk of the working area of the optoelectronic device 206 coming into contact with the outside world, and also helps reduce the probability that the packaging material flows into the working area when forming the packaging layer 217, thereby improving the performance of the packaging structure.
  • the first opening accommodates the microlens 207, which reduces the risk of the microlens 207 being exposed. At the same time, it also provides a spatial location for disposing the microlens 207 in the cavity 260.
  • the packaging layer 217 also covers the first lead 209, which reduces the risk of the first lead 209 being exposed and improves the reliability of the packaging structure.
  • the light-transmitting component 222 can transmit the received optical signal and illuminate it on the optoelectronic device 206 , or the light-transmitting component 222 can transmit the optical signal emitted by the optoelectronic device 206 and illuminate it to the external environment.
  • the material of the light-transmitting component 222 is a light-transmitting material.
  • the light-transmitting material includes glass, quartz, sapphire, light-transmitting plastic or artificial diamond.
  • the material of the light-transmitting component 222 is glass.
  • the light-transmitting component 222 in the second opening, the light-transmitting component 222, the packaging layer 217 on the side wall of the first opening, and the optoelectronic device 206 in the working area form a cavity 260, and the microlens 207 Located in the cavity 260, the medium in the cavity 260 is mainly air. Due to the large difference in light refractive index between the air medium and the material of the microlens 207, the cavity 260 above the microlens 207 can improve the light gathering performance of the microlens 207. As a result, the optical sensitivity and light detection performance of the optoelectronic device 206 are greatly improved.
  • the light-transmitting component 222 includes a second surface facing the first surface 230 and a third surface located on the opposite side of the second surface.
  • the third surface is flush with the top surface of the packaging layer 217, making the surface of the packaging structure flat and improving the flatness of the top surface of the packaging structure.
  • the packaging structure further includes: an anti-reflection film (not shown) located on the third surface.
  • the anti-reflection film can reduce the light energy lost due to the light signal reflected by the light-transmitting component 222, thereby increasing the intensity of the light signal transmitted by the light-transmitting component 222.
  • the packaging structure further includes: a filter film (not shown) located on the first surface and/or the second surface. The filter film can block unwanted light wavelengths and improve the signal-to-noise ratio of the packaging structure.
  • an anti-reflection film and a filter film can also exist at the same time. Accordingly, the packaging structure further includes: an anti-reflection film located on the third surface; and a filter film located on the first surface and/or the second surface. surface.
  • the packaging structure further includes: a sealant 228 disposed between the light-transmitting component 222 and the packaging layer 217 around the second opening.
  • the sealant 228 is used to fix the light-transmitting component 222 in the second opening, thereby reducing the stability of the light-transmitting component 222 in the second opening. It should be noted that by disposing the sealant 228 on the side wall of the second opening, the sealing performance of the cavity 260 can be further improved, reducing the probability that the working area of the optoelectronic device 206 comes into contact with the outside world, thereby improving the performance of the packaging structure.
  • the sealant 228 is located between the light-transmitting component 222 and the bottom of the second opening; or, the sealant 228 is located between the light-transmitting component 222 and the side wall of the second opening; Alternatively, the sealant 228 is located between the light-transmitting component 222 and the bottom and side walls of the second opening.
  • the device structure can also be provided on the packaging carrier through metal bonding, and accordingly the bonding layer and leads can be replaced by the bonding structure.
  • the packaging structure also includes: a first bonding structure, located between the optoelectronic device and the packaging carrier board, for realizing the bonding of the optoelectronic device and the packaging carrier board.
  • the first bonding structure is a conductive bonding structure. . Through the first bonding structure, the optoelectronic device is fixed and electrically connected on the packaging carrier board at the same time, thereby simplifying the process steps.
  • the packaging layer also covers the first bonding structure, thereby reducing the risk of the first bonding structure being exposed, thereby improving the performance of the packaging structure.
  • the conductive bonding structure ie, the first bonding structure
  • the first bonding structure includes conductive glue or conductive bumps.
  • Figure 2 is a schematic structural diagram corresponding to the second embodiment of the packaging structure of the present invention.
  • the device structure further includes: an auxiliary processing device 508. Located on the packaging carrier 505 on the side of the optoelectronic device 506, the optoelectronic device 506 is electrically connected to the auxiliary processing device 508.
  • the auxiliary processing device 508 is used to process the electrical signal output by the optoelectronic device 506 .
  • the auxiliary processing device 508 includes one or more of a preamplifier, a variable gain amplifier, or an analog-to-digital converter. It can be understood that in other embodiments, the auxiliary processing device may also be other devices with specific functions.
  • the packaging structure further includes: a second lead 510, one end of the second lead 510 is electrically connected to the optoelectronic device 506, and the other end is electrically connected to the auxiliary processing device 508.
  • the optoelectronic device 506 and the auxiliary processing device 508 are electrically connected, so that the auxiliary processing device 508 processes the electrical signal output by the optoelectronic device 506.
  • the auxiliary processing device 508 is electrically connected to the packaging carrier board 505, thereby applying electrical signals to the auxiliary processing device 508 through the packaging carrier board 505, or realizing electrical connections between the auxiliary processing device 508 and other circuits and devices. .
  • the packaging structure further includes: a third lead 511, one end of the third lead 511 is electrically connected to the auxiliary processing device 508, and the other end is electrically connected to the packaging carrier board 505.
  • the third lead 511 Through the third lead 511, the electrical connection between the auxiliary processing device 508 and the packaging carrier 505 is achieved.
  • one end of the third lead 511 is electrically connected to the package carrier 505 through the interconnection opening located in the protective layer 202 .
  • the packaging layer 517 also covers the first lead (not labeled), the second lead 510 and the third lead 511, which reduces the risk of the first lead, the second lead 510 and the third lead 511 being exposed, and improves the The reliability of the packaging structure.
  • the packaging structure can also use a bonding structure to replace the wires.
  • the packaging structure also includes: a second bonding structure, the second bonding structure is respectively located between the optoelectronic device and the packaging carrier board. between the optoelectronic device and the packaging carrier board, and between the auxiliary processing device and the packaging carrier board, for realizing the bonding of the optoelectronic device and the packaging carrier board, and the bonding of the auxiliary processing device and the packaging carrier board.
  • the optoelectronic device and the auxiliary processing device pass through the second bonding structure , and the circuit inside the package carrier board is electrically connected, wherein the second bonding structure is a conductive bonding structure.
  • the packaging layer also covers the second bonding structure, thereby reducing the risk of the second bonding structure being exposed, thereby improving the performance of the packaging structure.
  • Figure 3 is a schematic structural diagram corresponding to the third embodiment of the packaging structure of the present invention.
  • the device structure further includes: an auxiliary processing device 308.
  • the auxiliary processing device 308 308 is located between the bottom of the optoelectronic device 306 and the packaging carrier 305 , that is, the auxiliary processing device 308 and the optoelectronic device 306 are arranged in a stacked manner.
  • the auxiliary processing device 308 and the optoelectronic device 306 are arranged in a stacked manner, thereby saving the area occupied by the device structure in the horizontal direction.
  • auxiliary processing device 308 and the optoelectronic device 306 are stacked, the auxiliary processing device 308 and the optoelectronic device 306 are integrated to achieve stacking, so that the auxiliary processing device 308 and the optoelectronic device can be realized during the device manufacturing process. 306, thereby improving the efficiency of integrating the auxiliary processing device 308 and the optoelectronic device 306 to achieve stacking.
  • auxiliary processing device 308 reference may be made to the relevant description of the second embodiment, which will not be described again here.
  • the packaging structure when the auxiliary processing device 308 and the optoelectronic device 306 are arranged in a stack, the packaging structure also includes: a second bonding structure 360, and the second bonding structure 360 is located between the stacked optoelectronic device 306 and the auxiliary processing device 308. , used to realize the bonding of the optoelectronic device 306 and the auxiliary processing device 308.
  • the conductive bonding structure (ie, the second bonding structure 360 ) simultaneously realizes stack fixation and electrical connection of the optoelectronic device 306 and the auxiliary processing device 308 .
  • the second bonding structure 360 includes conductive glue or conductive bumps.
  • the encapsulation layer 317 also covers the second bonding structure 360 accordingly, reducing the risk of the second bonding structure 360 being exposed, thereby improving the performance of the encapsulation structure.
  • the packaging structure also includes: a third bonding structure 390.
  • the third bonding structure 390 is located between the bottom of the auxiliary processing device 308 and the packaging carrier board, and is used to realize the connection between the auxiliary processing device 308 and the packaging carrier board. Bonding, the third bonding structure 390 is a conductive bonding structure, thereby achieving fixed arrangement and electrical connection between the auxiliary processing device 308 and the packaging carrier board at the same time.
  • the conductive bonding structure ie, the third bonding structure 390
  • the packaging layer 317 also covers the third bonding structure 390, which reduces the risk of the third bonding structure 390 being exposed, thereby improving the performance of the packaging structure.
  • 4 to 10 are structural schematic diagrams corresponding to each step in the first embodiment of the packaging method of the present invention.
  • a package carrier 105 is provided.
  • the packaging carrier 105 provides a process platform for the packaging process of the packaging structure.
  • the packaging carrier 105 includes stacked multi-layer metal lines 101 and dielectric layers 100 located between adjacent metal lines 101 , as well as the surface of the topmost metal line 101 and the bottom surface of the metal line 101 .
  • Protective layer 102 Protective layer 102.
  • An interconnection opening 103 exposing the metal line 101 is formed in the protective layer 102 on the surface of the topmost metal line 101 .
  • the interconnection opening 103 exposes part of the surface of the topmost metal line 101 to achieve electrical connection between the package carrier 105 and subsequent device structures disposed above it.
  • a device structure (not labeled) is provided on the packaging carrier 105, the device structure includes an optoelectronic device 106, and the optoelectronic device 106 includes a first surface 130 facing away from the packaging carrier 105, The first surface 130 includes a work area.
  • the optoelectronic device 106 is used to emit or receive optical signals.
  • the working area is an area used for sending or receiving optical signals.
  • the optoelectronic device 106 includes a semiconductor laser or a photodetector.
  • the optoelectronic device 106 is a photodetector.
  • a microlens 107 located in the working area is formed on the first surface 130 of the optoelectronic device 106 .
  • the microlens 107 functions to converge the incident light signal and concentrate the light signal in the working area, thereby improving the optical sensitivity and detection efficiency of the optoelectronic device 106 .
  • the optoelectronic device 106 is mounted on the packaging carrier 105 through a die bonding process. Specifically, the die-bonding process has the characteristics of simple operation and low process cost.
  • the optoelectronic device 106 is pasted on a designated area of the packaging carrier 105 through an adhesive layer.
  • the optoelectronic device 106 and the packaging carrier 105 are electrically connected.
  • an electrical signal is applied to the optoelectronic device 106 through the packaging carrier 105 , or the optoelectronic device 106 is connected to other devices disposed on the packaging carrier 105 through the packaging carrier 105 electrical connection.
  • the process of electrically connecting the optoelectronic device 106 and the packaging carrier 105 is a wire bonding process.
  • the optoelectronic device 106 is electrically connected to the packaging carrier 105 through the first lead 109 .
  • one end of the first lead 109 is electrically connected to the optoelectronic device 106, and the other end is electrically connected to the packaging carrier 105.
  • one end of the first lead 109 is electrically connected to the package carrier 105 through the interconnection opening 103 located in the protective layer 102 .
  • this embodiment takes the device structure mounted on the packaging carrier as an example.
  • the device structure can also be provided on the packaging carrier board through metal bonding, and accordingly the bonding layer and leads can be replaced by the bonding structure.
  • the steps of arranging the device structure on the packaging carrier board and electrically connecting the optoelectronic device and the packaging carrier board include: arranging the optoelectronic device and the packaging carrier board relative to each other, and realizing through the first bonding structure
  • the first bonding structure is a conductive bonding structure
  • the conductive bonding structure includes conductive glue or conductive bumps.
  • the process of arranging the first bonding structure between the optoelectronic device and the packaging carrier is a flip chip soldering process or a die bonding process.
  • the process used is a die bonding process
  • the process used is a flip-chip soldering process.
  • a stepped placeholder 115 is provided on the top of the working area of the optoelectronic device 106 .
  • the placeholder 115 includes a first component 112 and a second component 113 .
  • the top of the first component 112 is in contact with the second component 113 .
  • the bottoms are connected, and the lateral size of the first component 112 is smaller than the lateral size of the second component 113.
  • the first component 112 is used to define the position and shape of the first opening
  • the second component 113 is used to define the position and shape of the second opening. .
  • the placeholder 115 is removed, thereby forming an opening with steps in the encapsulation layer.
  • the opening includes a first opening and a second opening that are connected, and the first opening exposes the working area, and then the second opening is opened.
  • a light-transmitting component is provided in the step, and the light-transmitting component is located on the step, and the light-transmitting component forms a cavity with the packaging layer of the side wall of the first opening and the optoelectronic device 106 in the working area; therefore, by using a light-transmitting component on the top of the optoelectronic device 106
  • the way in which the placeholder 115 is placed can form a cavity above the work area, which is beneficial to ensuring the function of the optoelectronic device 106, thus improving the performance of the packaging structure.
  • the placeholder 115 occupies the spatial position of the opening. It is helpful to reduce the damage to the work area during the process of forming the opening.
  • the bottom surface of the first component 112 has an inner cavity surrounded by an inner wall, and the inner cavity is used to accommodate the microlens 107. Since the bottom surface of the first component 112 has an inner cavity surrounded by an inner wall, the inner cavity can accommodate the microlens 107 during the process of setting the placeholder 115 on the top of the working area of the optoelectronic device 106 , reducing the probability that the first component 112 causes damage to the microlens 107 .
  • the placeholder 115 is in the shape of a step, and the lateral size of the first component 112 is smaller than the lateral size of the second component 113.
  • the second opening is The bottom surface serves as a bearing surface for the light-transmitting component, which can increase the firmness between the light-transmitting component and the second opening, thereby reducing the risk of the light-transmitting component slipping or moving.
  • an encapsulation layer 117 is formed on the top of the packaging carrier 105 on the sides of the optoelectronic device 106 and the placeholder 115 , and the encapsulation layer 117 also covers the sidewalls of the optoelectronic device 106 and the placeholder 115 .
  • the encapsulation layer 117 is used to encapsulate the rest of the optoelectronic device 106 except the working area, which reduces the risk of exposure of the optoelectronic device 106 and accordingly improves the reliability of the packaging structure; on the other hand, by using the encapsulation layer 117 117 to achieve sealing and reduce packaging costs.
  • the packaging layer 117 also covers the first lead 109, which reduces the risk of the first lead 109 being exposed and improves the reliability of the packaging structure.
  • the packaging layer when the optoelectronic device and the packaging carrier are bonded through the first bonding structure, the packaging layer also covers the first bonding structure, reducing the exposure of the first bonding structure. risk, thereby improving the performance of the packaging structure.
  • the process of forming the packaging layer 117 on the top of the packaging carrier 105 on the sides of the optoelectronic device 106 and the placeholder 115 includes an injection molding process.
  • the injection molding process has the characteristics of high sealing performance and low process cost.
  • the encapsulation layer 117 can cover the side walls of the optoelectronic device 106 and the placeholder 115, thereby reducing the cost of the optoelectronic device. Risk of device 106 being exposed.
  • the injection mold used in the injection molding process is used as the placeholder 115, so that the placeholder 115 is 115 can be reused, thereby reducing packaging costs; moreover, the steps of setting the step-shaped placeholder 115 and forming the packaging layer 117 are completed in the same process, thereby improving packaging efficiency; at the same time, the injection molding process An injection mold is used as the placeholder 115 to improve the compatibility of the formation process of the placeholder 115 and the packaging layer 117, thereby reducing process risks.
  • the material of the encapsulation layer 117 includes epoxy resin and various additives.
  • the additives include one or more of a curing agent, a modifier, a release agent, a dye, and a flame retardant.
  • the opening 120 includes a first opening 118 and a second opening 119 , and the top of the first opening 118 Communicated with the bottom of the second opening 119, the first opening 118 exposes the working area.
  • the lateral size of the first opening 118 is smaller than the lateral size of the second opening 119, so that the opening 120 has a step, and the opening 120 provides a spatial position for subsequent formation of the light-transmitting component.
  • the bottom surface of the second opening 119 is flat. In the subsequent process of arranging the light-transmitting component in the second opening 119, the second opening 119 with the flat bottom surface can increase the distance between the light-transmitting component and the second opening. The robustness reduces the risk of the light-transmitting components slipping or moving, thereby improving the reliability of the packaging structure.
  • the longitudinal cross-sectional shape of the first opening 118 includes a square, inverted trapezoid or bowl shape, and the angle between the bottom and the side wall of the square, inverted trapezoid or bowl-shaped first opening 118 is greater than or equal to 90°. , so that the first opening 118 can provide a spatial position for accommodating the microlens 107; in addition, ensure that the first opening 118 exposes the working area, and lower the first opening 118 to emit light signals to the optoelectronic device 106 Or the probability of causing obstruction when receiving optical signals, thereby improving the performance of the optoelectronic device 106 .
  • connection between the side wall of the first opening 118 and the first surface 130 is chamfered, which can reduce the probability of a gap occurring at the connection between the side wall of the first opening 118 and the first surface 130 , and accordingly reduces the
  • the risk that the working area of the optoelectronic device 106 is in contact with the outside world is also beneficial to reducing the probability that the packaging material flows into the working area when forming the packaging layer 117, thereby improving the performance of the packaging structure.
  • the first opening 118 accommodates the microlens 107, thereby reducing the risk of the microlens 107 being exposed. At the same time, it is convenient to subsequently dispose the microlens 107 in the cavity.
  • a light-transmitting component 122 is provided in the second opening 119.
  • the light-transmitting component 122 is located on the step.
  • the light-transmitting component 122 includes a second surface facing the first surface 130 and a third surface located on the opposite side of the second surface.
  • the third surface is flush with the top surface of the encapsulation layer 117 , and the light-transmitting component 122 , the encapsulation layer 117 on the side walls of the first opening 118 , and the optoelectronic device 106 in the working area form a cavity 160 .
  • the light-transmitting component 122 can transmit the received optical signal and illuminate it on the optoelectronic device 106, or the light-transmitting component 122 can transmit the optical signal emitted by the optoelectronic device 106 and illuminate it to the external environment.
  • the material of the light-transmitting component 122 is a light-transmitting material.
  • the light-transmitting material includes glass, quartz, sapphire, light-transmitting plastic or artificial diamond.
  • the material of the light-transmitting component 122 is glass.
  • the light-transmitting component 122 in the second opening 119, the light-transmitting component 122, the packaging layer 117 on the side wall of the first opening 118, and the optoelectronic device 106 in the working area form a cavity 160.
  • the lens 107 is located in the cavity 160.
  • the medium in the cavity 160 is mainly air. Due to the large difference in light refractive index between the air medium and the material of the microlens 107, the cavity 160 above the microlens 107 can improve the light gathering performance of the microlens. , thereby improving the optical sensitivity and light detection performance of the optoelectronic device 106.
  • the step of arranging the light-transmitting component 122 in the second opening 119 includes: arranging the light-transmitting component 122 in the second opening 119 through a sealant 128 .
  • the sealant 128 is used to dispose the light-transmitting component 122 in the second opening 119 , thereby reducing the risk of the light-transmitting component 122 slipping or moving in the second opening 119 . It should be noted that by forming the sealant 128 on the side wall of the second opening 119, the sealing performance of the cavity 160 can be further improved, reducing the probability that the working area of the optoelectronic device 106 comes into contact with the outside world, thereby improving the performance of the packaging structure.
  • the sealant 128 is located between the light-transmitting component 122 and the bottom and side wall of the second opening 119; or, the sealant 128 is located between the light-transmitting component 122 and the bottom of the second opening 119; or , the sealant 128 is located between the light-transmitting component 122 and the side wall of the second opening 119 .
  • the sealant 128 is located between the bottom and the side wall of the second opening 119 .
  • the sealant 128 is disposed on the bottom and side walls of the second opening 119 through a glue coating process.
  • the light-transmitting component 122 includes a second surface facing the first surface 130 and a third surface located on the opposite side of the second surface.
  • the third surface is flush with the top surface of the packaging layer 117, making the surface of the packaging structure flat and improving the flatness of the top surface of the packaging structure.
  • the method before disposing the light-transmitting component 122 in the second opening 119, the method further includes: forming an anti-reflection film on the third surface.
  • the anti-reflection coating can reduce the light energy lost due to the light signal reflected by the light-transmitting component 122, thereby increasing the intensity of the light signal transmitted by the light-transmitting component 122.
  • the process of forming the antireflection film on the third surface includes one or more of magnetron sputtering coated glass, chemical vapor deposition, or sol-gel method.
  • the method before arranging the light-transmitting component in the second opening, the method further includes: forming a light filter film on the second surface and/or the third surface.
  • the filter film can block unnecessary light wavelengths and improve the signal-to-noise ratio of the packaging structure.
  • the process of forming the filter film on the second surface includes one or more of magnetron sputtering coated glass, chemical vapor deposition, or sol-gel method.
  • the anti-reflection film and the filter film can also exist at the same time.
  • the anti-reflection film is formed on the third surface, and the filter film is formed on the second surface and/or the third surface.
  • the packaging method further includes: arranging the work area on the first surface of the optoelectronic device through the opening. of microlenses.
  • the openings are formed first, and then the microlenses are set to avoid the impact of the encapsulation layer process on the microlenses.
  • the microlens is disposed on the first surface by bonding.
  • the first opening accommodates the microlens.
  • 11 to 13 are structural schematic diagrams corresponding to each step in the second embodiment of the packaging method of the present invention.
  • the device structure also includes an auxiliary processing device 608.
  • the auxiliary processing device 608 Located on the packaging carrier 605 on the side of the optoelectronic device 606.
  • the auxiliary processing device 608 processes the electrical signal output by the optoelectronic device 606 .
  • the auxiliary processing device 608 includes one or more of a preamplifier, a variable gain amplifier, or an analog-to-digital converter. It can be understood that in other embodiments, the auxiliary processing device may also be other devices with specific functions.
  • the step of arranging the device structure on the packaging carrier 605 includes: respectively arranging the optoelectronic device 606 and the auxiliary processing device 608 on the packaging carrier 605.
  • the auxiliary processing device 608 is located on the side of the optoelectronic device 606.
  • the processing device 608 and the optoelectronic device 606 constitute the device structure.
  • the optoelectronic device 606 and the auxiliary processing device 608 are respectively disposed on the packaging carrier 605 through a die bonding process.
  • the optoelectronic device 606 and the auxiliary processing device 608 are electrically connected.
  • the optoelectronic device 606 is electrically connected to the auxiliary processing device 608, allowing the auxiliary processing device 608 to process the electrical signal output by the optoelectronic device 606.
  • the process of electrically connecting the optoelectronic device 606 and the auxiliary processing device 608 is a wire bonding process.
  • the step of electrically connecting the optoelectronic device 606 and the auxiliary processing device 608 includes: electrically connecting the optoelectronic device 606 and the auxiliary processing device 608 through the second lead 610 .
  • one end of the second lead 610 is electrically connected to the optoelectronic device 606, and the other end is electrically connected to the auxiliary processing device 608.
  • the auxiliary processing device 608 and the packaging carrier 605 are electrically connected.
  • auxiliary processing device 608 By electrically connecting the auxiliary processing device 608 and the packaging carrier board 605, so as to apply electrical signals to the auxiliary processing device 608 through the packaging carrier board 605, or to implement the auxiliary processing device 608 and the configuration through the packaging carrier board 605. electrical connections to other devices on the package carrier 605 .
  • the process of electrically connecting the optoelectronic device 606 and the packaging carrier 605 is a wire bonding process.
  • the step of electrically connecting the auxiliary processing device 608 and the packaging carrier 605 includes: electrically connecting the auxiliary processing device 608 and the packaging carrier 605 through a third lead 611 .
  • One end of the third lead 611 is electrically connected to the auxiliary processing device 608, and the other end is electrically connected to the packaging carrier board 605.
  • one end of the third lead 611 is electrically connected to the package carrier 605 through an interconnection opening located in the protective layer.
  • the steps of arranging the device structure on the packaging carrier and electrically connecting the auxiliary processing device and the packaging carrier include: realizing the bonding of the auxiliary processing device and the packaging carrier through a third bonding structure, so The third bonding structure is a conductive bonding structure.
  • the steps of fixing the device structure on the packaging carrier board and electrically connecting the optoelectronic device and the auxiliary processing device include: respectively realizing the connection between the optoelectronic device and the packaging carrier board through the second bonding structure. and between the auxiliary processing device and the packaging carrier board.
  • the optoelectronic device and the auxiliary processing device are electrically connected through the second bonding structure and the circuit inside the packaging carrier board, thereby realizing the optoelectronic device through the second bonding structure. and the electrical connection between the packaging carrier board, the optoelectronic device and the auxiliary processing device, and the electrical connection between the auxiliary processing device and the packaging carrier board.
  • the packaging layer 617 also covers the second lead 610, which reduces the risk of the second lead 610 being exposed and improves the reliability of the packaging structure.
  • the packaging layer 617 also covers the third lead 611, thereby reducing the risk of the third lead 611 being exposed, thereby improving the reliability of the packaging structure.
  • the packaging layer when the bonding between the optoelectronic device and the packaging carrier and between the auxiliary processing device and the packaging carrier are respectively achieved through the second bonding structure, the packaging layer also covers the third The second bonding structure reduces the risk of exposure of the second bonding structure, thereby improving the performance of the packaging structure.
  • the packaging layer when the auxiliary processing device is bonded to the packaging carrier through the third bonding structure, the packaging layer also covers the third bonding structure, thereby reducing the risk of the third bonding structure being exposed. , thereby improving the performance of the packaging structure.
  • Figure 14 is a schematic structural diagram corresponding to each step in the third embodiment of the packaging method of the present invention.
  • the similarities between the embodiment of the present invention and the first embodiment will not be repeated here.
  • the difference between the embodiment of the present invention and the first embodiment is that in the step of arranging the device structure on the packaging carrier board 405, the device structure is also An auxiliary processing device 408 is included, and the auxiliary processing device 408 is located between the bottom of the optoelectronic device 406 and the packaging carrier 405, that is, the auxiliary processing device 408 and the optoelectronic device 406 are arranged in a stack.
  • the auxiliary processing device 408 and the optoelectronic device 406 are stacked, the auxiliary processing device 408 and the optoelectronic device 406 are integrally formed to achieve stacking. Specifically, the auxiliary processing device 408 and the optoelectronic device 406 are stacked during the device manufacturing process.
  • the auxiliary processing device 408 and the optoelectronic device 406 are arranged in a stacked manner, thereby saving the area occupied by the device structure in the horizontal direction.
  • auxiliary processing device 408 reference may be made to the relevant description of the second embodiment, which will not be described again here.
  • the step of arranging a device structure on the packaging carrier 405 includes: providing an auxiliary processing device 408 and an optoelectronic device 406 stacked on the auxiliary processing device 408.
  • the auxiliary processing device 408 and the optoelectronic device 406 constitute the device structure.
  • the optoelectronic device 406 The first surface 470 faces away from the auxiliary processing device 408; the auxiliary processing device 408 is fixed on the packaging carrier 405.
  • the auxiliary processing device 408 and the optoelectronic device 406 are integrated to achieve stacking, thereby improving the efficiency of integrating the processing device 408 and the optoelectronic device 406 to achieve stacking.
  • the step of arranging the device structure on the packaging carrier may also include: fixing the auxiliary processing device on the packaging carrier; after fixing the auxiliary processing device on the packaging carrier, placing the auxiliary processing device on the packaging carrier.
  • the optoelectronic device is fixed, and the auxiliary processing device and the optoelectronic device constitute a device structure.
  • the step of electrically connecting the optoelectronic device 406 and the auxiliary processing device 408 includes: realizing the bonding of the optoelectronic device 406 and the auxiliary processing device 408 through a second bonding structure 460,
  • the second bonding structure 460 is a conductive bonding structure.
  • the conductive bonding structure (ie, the second bonding structure 460) simultaneously realizes stack fixation and electrical connection of the optoelectronic device 406 and the auxiliary processing device 408.
  • the second bonding structure 460 includes conductive glue or conductive bumps.
  • the process of forming the second bonding structure 460 includes a flip chip soldering process or a die bonding process.
  • the encapsulation layer also covers the second bonding structure 460, which reduces the risk of the second bonding structure 460 being exposed, thereby improving the performance of the encapsulation structure.
  • the steps of arranging a device structure on the packaging carrier board 405 and electrically connecting the auxiliary processing device 408 and the packaging carrier board 405 include: realizing the auxiliary processing device 408 and the package through a third bonding structure 490
  • the third bonding structure 490 of the carrier plate 405 is a conductive bonding structure.
  • the conductive bonding structure (i.e., the third bonding structure 490) includes conductive glue or conductive bumps.
  • the process of forming the third bonding structure 490 includes a flip chip soldering process or a die bonding process.
  • the encapsulation layer also covers the third bonding structure 490, which reduces the risk of the third bonding structure 490 being exposed, thereby improving the performance of the encapsulation structure.
  • an embodiment of the present invention also provides an optoelectronic device, which includes the packaging structure described in the previous embodiment, wherein the optoelectronic device is a semiconductor laser or a photodetector.
  • the encapsulation layer is used to encapsulate the rest of the optoelectronic device except the working area, which reduces the risk of exposure of the optoelectronic device and accordingly improves the reliability of the optoelectronic device; by setting the top of the working area that runs through the optoelectronic device
  • the opening of the packaging layer has a step, and a light-transmitting component is arranged in the second opening. The light-transmitting component is located on the step.
  • a cavity can be formed above the working area, and there is It is beneficial to ensure the function of the optoelectronic device (for example, when the optoelectronic device has a photosensitive function, it is beneficial to improve the optical sensitivity and detection performance of the optoelectronic device), thereby improving the performance of the optoelectronic device; in addition, by using an encapsulation layer to achieve sealing, it reduces the Packaging costs for optoelectronic devices.
  • the external mechanical aperture is usually a separately installed sheet with a hole, which requires mechanical mounting for assembly. However, the mounting positioning accuracy is poor and it is difficult to effectively block stray light.
  • the external mechanical aperture is mounted above the detector. , the distance between the external mechanical aperture and the photosensitive area of the detector is relatively large. In order to ensure sufficient signal light incidence and effective lighting, the window size of the external mechanical aperture is relatively large, which affects the stray light of the external mechanical aperture.
  • the present invention provides a detector packaging structure, including:
  • the diaphragm window assembly includes: a light-transmitting area and a non-light-transmitting area.
  • the technical solution of the present invention is that the aperture window assembly is fixed in the light-transmitting window to protect the detector and internal components; and the aperture window assembly has a light-transmitting area and a non-light-transmitting area, which can realize light transmission.
  • the function of the aperture is that the aperture window assembly integrates the function of the aperture. Therefore, using the optical path of the detector packaging structure can eliminate the need for an external mechanical aperture, which can not only improve the blocking ability of stray light, but also reduce the The possibility of generating stray light; integrating the aperture in the packaging structure can effectively improve the position accuracy of the light-transmitting area, improve the effectiveness of blocking stray light, and also reduce the distance between the aperture and the detector, which is beneficial Control of window opening size.
  • FIG. 17 is a schematic cross-sectional structural diagram of an embodiment of the detector packaging structure
  • FIG. 18 is a schematic cross-sectional structural diagram of the embodiment of the detector packaging structure shown in FIG. 17 before the aperture window assembly is assembled.
  • the detector packaging structure includes: a packaging carrier board 110; a detector 920, which is fixed on one surface of the packaging carrier board 110; a protection bracket 930, which is mounted on the packaging carrier board 110.
  • a cavity 131 is formed on one surface of 110 to accommodate the detector 920; a light-transmitting window 140, which penetrates the protective bracket 930 and corresponds to the position of the detector 920; an aperture window assembly 150.
  • the aperture window assembly 150 is fixed in the light-transmitting window 140 in a direction parallel to the photosensitive surface 121 of the detector 920.
  • the aperture window assembly 150 includes: a light-transmitting area 150a and a non-light-transmitting area. Zone 150b.
  • the aperture window assembly 150 is fixed in the light-transmitting window 140 to protect the detector 920 and internal components; and the aperture window assembly 150 has a light-transmitting area 150a and a non-light-transmitting area 150b, which can realize The function of the aperture, that is, the aperture window assembly 150 integrates the function of the aperture. Therefore, using the optical path of the detector packaging structure can eliminate the need for an external mechanical aperture, which not only improves the blocking ability of stray light, but also improves the blocking ability of stray light. It can reduce the possibility of stray light; integrating the aperture in the packaging structure can effectively improve the position accuracy of the light-transmitting area 150a, improve the effectiveness of blocking stray light, and also reduce the distance between the aperture and the detector. , which is conducive to the control of window size.
  • the packaging carrier 110 is suitable for fixing the detector and connecting the detector to an external circuit.
  • the package carrier 110 may include at least one of a lead frame, a laminated substrate, a ceramic substrate, and a carrier tape.
  • the detector 920 is suitable for receiving light and performing photoelectric conversion.
  • the detector 920 is fixed on the surface of the packaging carrier 110 and is electrically interconnected with the packaging carrier.
  • the photosensitive surface 121 of the detector 920 is a surface facing away from the packaging carrier 110 .
  • the electrical interconnection between the detector 920 and the packaging carrier 110 may include at least one of wire bonding, flip chip bonding and wafer level bonding.
  • the detector 920 may be a detector die.
  • the electrical interconnection between the detector 920 and the packaging carrier 110 is achieved by wire bonding, that is, the detector 920 is fixed to the packaging carrier 110 After that, the metal wire 102 is used to realize electrical interconnection between the two.
  • the detector 920 is mounted on the surface of the packaging carrier 110 through a die bonding process.
  • the protection bracket 930 serves as a structural component to protect the detector 920 and other internal components.
  • the material of the protective bracket 930 may be at least one of metal, plastic, resin, and ceramic. In other embodiments of the present invention, the protective bracket may also be an injection molded body. In other embodiments of the present invention, the material of the protective bracket can also be other materials that can play a protective function.
  • the protective bracket 930 is fixedly connected to the packaging carrier board 110 by adhesive. In other embodiments of the present invention, when the protective bracket is a metal bracket, the protective bracket can also be fixed on the packaging carrier board 110 by welding.
  • the light-transmitting window 140 serves as a light passage so that light can pass through the protective bracket 930 and be received by the detector 920 .
  • the orthographic projection of the light-transmitting window on the detector includes the photosensitive area of the detector, and the relative position accuracy of the light-transmitting window and the detector is less than or equal to 50 ⁇ m.
  • the light-transmitting window 140 includes: a first opening 141 and a second opening 142 that penetrate each other, and the second opening 142 is located between the first opening 141 and the Between the detectors 920, the second opening 142 and the first opening 141 are arranged in the direction facing away from the detector 920; the light transmits through the first opening 141 and the second opening 142 in sequence and enters the chamber. 131 is received by the detector 920.
  • one end of the light-transmitting window 140 close to the detector 920 has a step portion 143 protruding from the side wall.
  • One side wall of the step portion 143 is connected to the protection bracket 930 , and the other side wall surrounds the second opening 142 , so the side wall of the second opening 142 and the side wall of the first opening 141 A step shape is formed between them.
  • the protection bracket 930 includes: a first structural part 132 with a gap between the first structural part 132 and the packaging carrier 110 to form the chamber 131; along a direction pointing toward the detector 920 direction, the light-transmitting window 140 penetrates the first structural part 132; the second structural part 133, the second structural part 133 connects the first structural part 132 and the packaging carrier 110.
  • the first structural part 132 and the second structural part 133 are arranged in an L shape, thereby forming a cavity on the packaging carrier 110 to accommodate The detector 920.
  • the aperture window assembly 150 includes a window element 151 and an aperture layer 152.
  • the window filler element is arranged at the step portion 143 in the light-transmitting window.
  • the aperture layer is located at the window element facing away from the detection. on the surface of the device.
  • the aperture window assembly 150 is used to protect the detector and internal components, and is also used to transmit light and eliminate stray light, thus functioning as an aperture.
  • the aperture window assembly 150 is mounted on the protective bracket 930 through sealant.
  • the aperture window assembly 150 and the protective bracket 930 form a sealed chamber to isolate the detector from the outside world and prevent impurities or moisture in the air from corroding the detector and causing a decrease in electrical performance.
  • the diaphragm window assembly 150 includes: a light-transmitting area 150a and a non-light-transmitting area 150b.
  • the light-transmitting area 150a and the non-light-transmitting area 150b are parallel to the photosensitive surface of the detector 920. 121 direction distribution.
  • the non-light-transmitting area 150b surrounds the light-transmitting area 150a.
  • the light-transmitting area 150a refers to an area through which light can pass and is received by the detector, and the non-light-transmitting area 150b refers to an area through which light cannot pass to suppress stray light.
  • the number of the light-transmitting areas 150a is related to the photosensitive area of the detector 920.
  • the detector includes one or more photosensitive areas, and the multiple photosensitive areas are distributed in the photosensitive surface;
  • the aperture window assembly includes: one or more light-transmitting areas.
  • the plurality of light-transmitting areas correspond to the plurality of photosensitive areas one-to-one.
  • the shape of the light-transmitting area 150a matches the shape of the photosensitive area of the detector 920. In other embodiments of the present invention, the shape of the light-transmitting area 150a is at least one of a circle, an ellipse, a square, and a rectangle.
  • the light-transmitting window 140 includes the first opening 141 and the second opening 142 , and the aperture window assembly 150 fills the first opening 141 .
  • the light-transmitting window 140 has the step portion 143 at one end close to the detector 920 ; the diaphragm window assembly 150 is located on the surface of the step portion 143 facing away from the detector 920 .
  • the aperture window assembly 150 includes: a window element 151, which is disposed in the light-transmitting window 140; an aperture layer 152, the aperture Layer 152 is located on one surface of said window element 151 .
  • the window component 151 is suitable for being mounted in the light-transmitting window 140 to protect the detector 920 and internal components.
  • the window element 151 is made of light-transmitting material.
  • the material of the window element 150 may be at least one of glass, quartz, sapphire, plastic and diamond (including artificial diamond).
  • the surface of the window element 150 facing or facing away from the detector 920 has at least one of an anti-reflection film and a filter film to achieve anti-reflection and filtering of light of different wavelengths.
  • the window element 151 matches the shape of the photosensitive surface 121 of the detector 920 and the shape of the light-transmitting window 140 .
  • the window element 150 is fixedly connected to the protective bracket 930 by adhesive or other means.
  • the window element 151 is disposed in the light-transmitting window 140 and is located on the surface of the step portion 143 facing away from the detector 920 .
  • the window element 151 is fixed on the surface of the step portion 143 through sealant.
  • the step portion 143 supports the window element 151, which can ensure the stability of the window element 151 and is conducive to the expansion of the process window. It is beneficial to improve the stability of the device.
  • the diaphragm layer 152 is adapted to form a light-transmitting area 150a and a non-light-transmitting area 150b in the light-transmitting window assembly 150. Specifically, one of the portion with the aperture layer 152 and the portion without the aperture layer 152 in the aperture window assembly 150 is the light-transmitting area 150a, and the other is the non-light-transmitting area 150b.
  • the light-transmitting area 150a and the non-light-transmitting area 150b are formed by the diaphragm layer 152, and the light-transmitting window component 150 can realize the function of the diaphragm, that is, the The aperture window assembly 150 integrates the function of an aperture. Therefore, using the optical path of the detector packaging structure can eliminate the need for an external mechanical aperture, which not only improves the blocking ability of stray light, but also reduces the possibility of generating stray light; Integrating the diaphragm in the packaging structure can effectively improve the position accuracy of the light-transmitting area 150a and improve the effectiveness of blocking stray light. It can also reduce the distance between the diaphragm and the detector 920, which is beneficial to the adjustment of the window size. control.
  • the distance between the surface of the diaphragm layer 152 and the photosensitive surface 121 is less than 1 mm.
  • the aperture layer 152 is located on the surface of the window element 151 facing away from the detector 920 . Disposing the diaphragm layer 152 on the surface of the window element 151 facing away from the detector 920 can prevent the diaphragm layer 152 from adversely affecting the chamber where the detector 920 is located and thus affecting the performance of the detector 920 . performance, and can effectively reduce the manufacturing difficulty of the diaphragm layer 152 .
  • the thickness of the aperture layer 152 ranges from 5 to 200 ⁇ m.
  • the control of the thickness of the aperture layer 152 can effectively control the height difference between the surface of the aperture layer 152 and other surfaces of the detector packaging structure, thereby effectively reducing the impact of the aperture layer 152 on the detector 920
  • the impact of performance is conducive to ensuring the receiving performance of the detector 920 and is conducive to the realization of automated assembly.
  • the material of the aperture layer 152 includes at least one of metal, ceramic, plastic, paint, and ink.
  • the diaphragm layer 152 is provided on the window element 151 by engraving, bonding, coating, plating, silk screen printing, spraying, etc.
  • the material of the diaphragm layer 152 is set to a low-volatility material. Controlling the volatilization rate of the material of the aperture layer 152 can effectively reduce the impact of the arrangement of the aperture layer 152 on the detector and other components of equipment using the detector packaging structure. Especially when the detector packaging structure is used in equipment with a relatively high operating temperature (for example, in some embodiments, the temperature of the lidar ranges from -40°C to 85°C), the optical The material of the barrier layer 152 is set to a low-volatility material, which can effectively avoid high-temperature volatilization from contaminating other components.
  • the light transmittance of the diaphragm layer 152 is less than 0.5%. Therefore, in some embodiments of the present invention, part of the aperture window assembly 150 with the aperture layer 152 is a non-light-transmitting area 150b, and part of the aperture window assembly 150 without the aperture layer 152 is a light-transmitting area 150a. . Specifically, in some embodiments of the present invention, the detector 150 is a detector that receives infrared band light, so the transmittance of the aperture layer 152 for infrared band light is less than 0.5%.
  • the material of the window element can also be an opaque material; and the combination of the aperture layer and the window element can transmit light; that is, in the aperture window assembly, Part of the aperture window assembly without the aperture layer is a non-light-transmitting area, and part of the aperture window assembly with the aperture layer is a light-transmitting area.
  • the aperture layer 152 is a light-shielding ink layer that is screen-printed or sprayed on the surface of the window element 151 .
  • the light-shielding ink layer 152 can absorb light to avoid light transmission.
  • the first structural part and the second structural part of the protection bracket 930 are arranged in an L shape to form a cavity on the packaging carrier 110 .
  • the detector 920 is accommodated; the protective bracket 930 and the packaging carrier board 110 are fixedly connected by welding.
  • the protective bracket 930 may also be an injection molded body.
  • the protective bracket 230 is an injection molded body formed after being molded with a special-shaped mold.
  • the injection molded body forms a light-transmitting window with a step portion on the lighting surface 221 of the detector 220; the injection molded body covers the detector 220, the packaging carrier 210 and the bonding wires to realize components. Encapsulation.
  • the injection molded body serves as a protective bracket to protect the detector 220 and the bonding wires.
  • the material of the injection molded body is at least one of epoxy resin and various additives (such as curing agent, modifier, release agent, dye, flame retardant, etc.).
  • the coating method of the injection molded body may be to fill the injection molding material in a molten state, and then cool and solidify the injection molding material to form the injection molded body.
  • the detector 920 only has one photosensitive area.
  • the detector 320 has multiple photosensitive areas; the detector packaging structure also includes: a microlens array 322, the microlens array 322 is located on the detector 320 On the detection surface 321, the light is focused on the photosensitive area of the detector 320 to improve the optical sensitivity.
  • the microlens array 322 can be directly formed on the detection surface 321 of the detector 320 , that is, the microlens array 322 and the detector 320 are integrally manufactured.
  • the aperture window assembly 350 includes one or more light-transmitting areas.
  • the diaphragm window assembly 350 includes one light-transmitting area.
  • the plurality of light-transmitting areas correspond to the plurality of photosensitive areas one-to-one.
  • the aperture window assembly with multiple light-transmitting areas enables each detector to have an independent aperture, which can effectively avoid position deviation and help improve the stray light blocking performance.
  • the present invention also provides a receiving unit.
  • the receiving unit includes a packaged detector, and the packaged detector is the detector packaging structure of the present invention.
  • the packaged detector is the detector packaging structure of the present invention. Therefore, the specific technical solution of the packaged detector refers to the foregoing embodiment of the detector packaging structure. The present invention will not be described in detail here.
  • the aperture window component integrates the function of an aperture, so the receiving unit can eliminate the need for an external mechanical aperture, which not only improves the blocking ability of stray light, but also reduces the possibility of generating stray light.
  • the receiving unit receives less stray light and has a higher signal-to-noise ratio.
  • the receiving unit further includes: a receiving optical component, the receiving optical component is suitable for transmitting light; and the packaged detector receives the light transmitted by the receiving optical component.
  • the light transmitted by the receiving optical component is directly received by the packaged detector.
  • the setting of a mechanical diaphragm can be omitted in the receiving optical component, which can effectively simplify the structure of the receiving optical component and reduce the formation of stray light. .
  • At least one of the light-transmitting area and the non-light-transmitting area is set according to the incident angle of the light transmitted by the receiving optical component and the photosensitive area of the detector.
  • the light-transmitting area and the non-light-transmitting area are set based on the incident angle of the light transmitted by the receiving optical component, so that the aperture window component functions as an aperture, and the setting of an external mechanical aperture can be avoided. , which can effectively avoid various problems caused by external mechanical apertures and help improve the signal-to-noise ratio.
  • the shape and size of the light-transmitting area, the shape and size of the non-light-transmitting area, and the thickness and strength of the window element are not specifically limited.
  • the invention also provides a laser radar, including:
  • a transmitting unit is suitable for generating detection light; the detection light is reflected to form echo light; a receiving unit, the receiving unit is suitable for receiving the echo light, and the receiving unit is the receiving unit of the present invention.
  • the receiving unit of the present invention uses the diaphragm window component in the detector packaging structure as the diaphragm to block stray light. Therefore, there is no mechanical diaphragm in the laser radar, which can effectively avoid various problems caused by the mechanical diaphragm. Can effectively improve the signal-to-noise ratio.
  • the present invention also provides a packaging method for a detector.
  • FIG. 22 a schematic flow chart of an embodiment of the detector packaging method of the present invention is shown.
  • FIG. 17 a schematic structural diagram of an embodiment of the packaging method of the detector of the present invention is shown.
  • the packaging method of the detector includes:
  • step S110 is performed to form the aperture window assembly 150, which includes: a light-transmitting area 150a and a non-light-transmitting area 150b.
  • the steps of forming the aperture window assembly 150 include: providing a window element 151; and forming an aperture layer 152 on one surface of the window element 151.
  • the step of forming the aperture layer 152 on one surface of the window element 151 includes: forming the aperture layer 152 on one surface of the window element 151 by silk printing or spraying.
  • the positional accuracy of the diaphragm layer 152 formed in this way is higher than that of mechanical mounting in the prior art, which can effectively ensure the blocking accuracy and blocking ability of the diaphragm window assembly 150 against stray light, which is beneficial to suppressing stray light and improving the performance of the diaphragm layer 152.
  • Signal-to-noise ratio improves detector detection performance.
  • the aperture layer 152 formed on one surface of the window element 151 by silk printing or spraying is an ink layer.
  • the step of forming the aperture layer 152 on one surface of the window element 151 also includes: mixing various ink components according to a specific ratio, the components include but are not limited to ink base agent, diluent and curing agent. , so that the ink's transmittance to infrared wavelength light is below 0.5%.
  • the step of forming the aperture layer 152 on one surface of the window element 151 also includes: using a steel mesh to print a specific shape of ink on the surface of the window element through silk screen printing, and then curing the ink in an oven.
  • the baking temperature is generally between Between 80°C ⁇ 300°C.
  • a window material sheet is provided; in the step of forming an aperture layer on one surface of the window element, the aperture layer is formed on the window material sheet; and the aperture layer is formed on one surface of the window element. After the aperture layer, the window material sheet with the aperture layer formed on the surface is cut to obtain a plurality of the aperture window assemblies.
  • the method of packaging the detector further includes: then performing step S920 to assemble the detector 920 on the packaging carrier 110.
  • the detector 920 may be mounted on the packaging carrier board 110 through a die bonding process.
  • the process of assembling the detector 920 on the packaging carrier 110 further includes realizing electrical interconnection between the detector 920 and the packaging carrier 110 .
  • the electrical interconnection of the detector 920 can be achieved through wire bonding, flip chip bonding, wafer level bonding, etc.
  • the packaging method further includes: performing step S930 to fixedly connect the protection bracket 930 with the packaging carrier board 110.
  • the protection bracket 930 forms a cavity on the packaging carrier board 110 to
  • the protective bracket 930 has a light-transmitting window 140 (as shown in FIG. 18 ).
  • the light-transmitting window 140 penetrates the protective bracket 930 and corresponds to the position of the detector 920 .
  • the protective bracket 930 can be fixed by gluing or welding.
  • the packaging method also includes: performing step S140, fixing the diaphragm window assembly 150 in the light-transmitting window 140, and the light-transmitting area 150a and the non-light-transmitting area 150b are parallel to the detection
  • the direction of the photosensitive surface 121 of the device 920 is set.
  • fixing the aperture window assembly 150 in the light-transmitting window 140 may also be performed before step 930. Specific steps include: applying glue on the step portion, mounting the aperture window assembly on the protective bracket, and baking and solidifying to obtain a protective bracket for the aperture window assembly.
  • the protective bracket 230 may also be an injection molded body. Therefore, after the detector 220 is assembled on the packaging carrier 210, the packaging method also includes: using a special-shaped mold for plastic packaging, so that a light-transmitting window with steps (not shown in the figure) is formed above the detector 220, and at the same time, the detector is realized 220 encapsulation, thereby forming the protective bracket 230.
  • the injection molding material can be filled in a molten state, and the injection molding material is cooled and solidified to form an injection molded body as the protective bracket 230 to protect the detector 230 and the bonding wires.
  • the aperture window assembly is fixed in the light-transmitting window to protect the detector and internal components; and the aperture window assembly has a light-transmitting area and a non-light-transmitting area.
  • the aperture window assembly integrates the function of an aperture. Therefore, using the optical path of the detector packaging structure can eliminate the need for an external mechanical aperture, which can not only improve the blocking ability of stray light, It can also reduce the possibility of stray light; integrating the aperture in the packaging structure can effectively improve the position accuracy of the light-transmitting area, improve the effectiveness of blocking stray light, and also reduce the distance between the aperture and the detector. The distance is conducive to the control of window size.
  • the aperture window assembly includes a window element and an aperture layer on its surface.
  • the aperture window component has a simple structure, is similar to the existing packaging structure, can be obtained by simply modifying the existing structure, and can effectively reduce the difficulty and cost of forming the packaging structure.
  • the distance between the surface of the aperture layer and the photosensitive surface of the detector is small, which can effectively improve the integration of the packaging structure, and is conducive to achieving both the window size and the stray light blocking effect.
  • the thickness of the aperture layer is small, which on the one hand can avoid affecting the acceptance performance of the detector and ensure the lighting intensity of the detector; on the other hand, it can also effectively ensure the flattening of the surface of the detector packaging structure, which is conducive to the realization of automated assembly. .
  • the surface of the aperture layer located on the window element facing away from the detector can effectively control the influence of the aperture layer on the detector and ensure the stability of the detector packaging environment; and the aperture layer The evaporation rate of the material is small, which can effectively prevent the aperture layer material from contaminating other components.
  • one end of the light-transmitting window close to the detector has a step portion protruding from the side wall, and the diaphragm window assembly is located on the surface of the step portion facing away from the detector. Fixing the light-transmitting window assembly through the step portion can effectively ensure the stability of the light-transmitting window assembly, which is beneficial to the expansion of the process window and the improvement of device stability.
  • At least one of the light-transmitting area and the non-light-transmitting area of the diaphragm window component is set according to the incident angle of the light transmitted by the receiving optical component and the photosensitive area of the detector, thereby eliminating the need for external machinery in the optical path.
  • the setting of the aperture is conducive to improving the stray light blocking effect and improving the signal-to-noise ratio.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Remote Sensing (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Packages (AREA)

Abstract

Structure de conditionnement et procédé de conditionnement associé, appareil photoélectrique, unité de réception et radar laser. Le procédé d'emballage comprend : la fourniture d'une plaque de chargement de conditionnement ; l'agencement d'une structure de dispositif sur la plaque de chargement de conditionnement, la structure de dispositif comprenant un dispositif photoélectrique, le dispositif photoélectrique comprenant une première surface tournée à l'opposé de la plaque de chargement de conditionnement, et la première surface comprenant une zone de travail ; l'agencement d'un espace réservé en forme de marche au sommet de la zone de travail du dispositif photoélectrique, l'espace réservé comprenant une première partie et une seconde partie, et les dimensions transversales de la première partie étant plus petites que les dimensions transversales de la seconde partie ; la formation, au niveau du dispositif photoélectrique et au niveau d'une partie latérale de l'espace réservé, d'une couche de conditionnement située au sommet de la plaque de chargement de conditionnement, la couche de conditionnement recouvrant le dispositif photoélectrique et la paroi latérale de l'espace réservé ; le retrait de l'espace réservé, la formation dans la couche de conditionnement d'une ouverture ayant une marche, l'ouverture comprenant une première ouverture et une seconde ouverture, et la première ouverture exposant la zone de travail ; la fourniture d'une partie de transmission de lumière dans la seconde ouverture, la partie de transmission de lumière étant située sur la marche ; et une cavité étant encerclée par la partie de transmission de lumière, la couche de conditionnement sur la paroi latérale de la première ouverture et le dispositif photoélectrique de la zone de travail. Les performances de la structure de conditionnement sont améliorées.
PCT/CN2022/124125 2022-04-26 2022-10-09 Structure de conditionnement et procédé de conditionnement associé, appareil photoélectrique, unité de réception et radar laser WO2023206974A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
CN202210446736.6 2022-04-26
CN202210447000.0A CN116990779A (zh) 2022-04-26 2022-04-26 探测器封装结构、封装方法、接收单元以及激光雷达
CN202210447000.0 2022-04-26
CN202210446736.6A CN116995105A (zh) 2022-04-26 2022-04-26 封装结构及其封装方法、光电装置

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Publication number Priority date Publication date Assignee Title
US20040212055A1 (en) * 2001-05-18 2004-10-28 Juan Exposito Shielded housing for optical semiconductor component
CN103323000A (zh) * 2013-05-22 2013-09-25 上海新跃仪表厂 数字式太阳敏感器光线引入器及其框架结构件和安装方法
CN205883378U (zh) * 2016-03-28 2017-01-11 宁波舜宇光电信息有限公司 摄像模组的感光组件
CN109246348A (zh) * 2018-11-05 2019-01-18 中芯集成电路（宁波）有限公司 镜头模组及其封装方法、电子设备
CN210072645U (zh) * 2019-07-29 2020-02-14 上海菲戈恩微电子科技有限公司 用于OLED屏幕指纹识别的Microlens光路结构及电子设备
CN114883275A (zh) * 2022-06-08 2022-08-09 华天科技（昆山）电子有限公司 一种多种类芯片集成封装结构及其制造方法
CN217470072U (zh) * 2021-12-15 2022-09-20 荣耀终端有限公司 滤光组件、摄像模组及电子装置

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040212055A1 (en) * 2001-05-18 2004-10-28 Juan Exposito Shielded housing for optical semiconductor component
CN103323000A (zh) * 2013-05-22 2013-09-25 上海新跃仪表厂 数字式太阳敏感器光线引入器及其框架结构件和安装方法
CN205883378U (zh) * 2016-03-28 2017-01-11 宁波舜宇光电信息有限公司 摄像模组的感光组件
CN109246348A (zh) * 2018-11-05 2019-01-18 中芯集成电路（宁波）有限公司 镜头模组及其封装方法、电子设备
CN210072645U (zh) * 2019-07-29 2020-02-14 上海菲戈恩微电子科技有限公司 用于OLED屏幕指纹识别的Microlens光路结构及电子设备
CN217470072U (zh) * 2021-12-15 2022-09-20 荣耀终端有限公司 滤光组件、摄像模组及电子装置
CN114883275A (zh) * 2022-06-08 2022-08-09 华天科技（昆山）电子有限公司 一种多种类芯片集成封装结构及其制造方法

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