WO2023206515A1 - 微波谐振加热系统及电子雾化装置、待加热物组件 - Google Patents

微波谐振加热系统及电子雾化装置、待加热物组件 Download PDF

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Publication number
WO2023206515A1
WO2023206515A1 PCT/CN2022/090633 CN2022090633W WO2023206515A1 WO 2023206515 A1 WO2023206515 A1 WO 2023206515A1 CN 2022090633 W CN2022090633 W CN 2022090633W WO 2023206515 A1 WO2023206515 A1 WO 2023206515A1
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Prior art keywords
microwave
heated
inlet
conductor
outlet
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PCT/CN2022/090633
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English (en)
French (fr)
Inventor
黄卡玛
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深圳麦时科技有限公司
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Priority to PCT/CN2022/090633 priority Critical patent/WO2023206515A1/zh
Publication of WO2023206515A1 publication Critical patent/WO2023206515A1/zh

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    • A—HUMAN NECESSITIES
    • A24—TOBACCO; CIGARS; CIGARETTES; SIMULATED SMOKING DEVICES; SMOKERS' REQUISITES
    • A24F—SMOKERS' REQUISITES; MATCH BOXES; SIMULATED SMOKING DEVICES
    • A24F40/00—Electrically operated smoking devices; Component parts thereof; Manufacture thereof; Maintenance or testing thereof; Charging means specially adapted therefor
    • A24F40/40—Constructional details, e.g. connection of cartridges and battery parts
    • A24F40/46—Shape or structure of electric heating means
    • A—HUMAN NECESSITIES
    • A24—TOBACCO; CIGARS; CIGARETTES; SIMULATED SMOKING DEVICES; SMOKERS' REQUISITES
    • A24F—SMOKERS' REQUISITES; MATCH BOXES; SIMULATED SMOKING DEVICES
    • A24F40/00—Electrically operated smoking devices; Component parts thereof; Manufacture thereof; Maintenance or testing thereof; Charging means specially adapted therefor
    • A24F40/50—Control or monitoring
    • A24F40/57—Temperature control
    • A—HUMAN NECESSITIES
    • A24—TOBACCO; CIGARS; CIGARETTES; SIMULATED SMOKING DEVICES; SMOKERS' REQUISITES
    • A24F—SMOKERS' REQUISITES; MATCH BOXES; SIMULATED SMOKING DEVICES
    • A24F47/00—Smokers' requisites not otherwise provided for

Definitions

  • the present application relates to the field of electronic atomization technology, and in particular to a microwave resonance heating system, an electronic atomization device, and an object component to be heated.
  • the microwave field generated by the microwave conductor is not uniform along the transmission direction, resulting in poor uniformity of heating.
  • This application provides a microwave resonance heating system, an electronic atomization device, and an object component to be heated to improve the uniformity of microwave heating.
  • the microwave resonance heating system includes: a microwave resonance heating component, including: a shell with a microwave resonance cavity formed inside, and the shell is provided with an outlet located at its open end and an inlet away from the open end and connected to the microwave resonance cavity; a microwave conductor , arranged in the microwave resonant cavity, used for microwave resonance in the microwave resonant cavity for microwave heating; the component to be heated is arranged between the microwave conductor and the cavity wall of the microwave resonant cavity, and the components to be added include along the entrance A plurality of blocks to be heated are arranged in a direction spaced apart from the outlet, and the microwave absorption rates of the plurality of blocks to be heated decrease sequentially from the entrance to the outlet.
  • a microwave resonance heating component including: a shell with a microwave resonance cavity formed inside, and the shell is provided with an outlet located at its open end and an inlet away from the open end and connected to the microwave resonance cavity; a microwave conductor , arranged in the microwave resonant cavity, used for microwave resonance in the microwave re
  • the spacing direction between the inlet and the outlet is the length direction of the microwave conductor.
  • the microwave resonant cavity is arranged in a rectangular body, the microwave conductor is arranged in a plate body, the microwave conductor includes a first conductor part, the object component to be heated is arranged between the first conductor part and the cavity wall, the first conductor part and the cavity wall Parallel setting.
  • the material density of the plurality of blocks to be heated decreases sequentially from the inlet to the outlet, so that the microwave absorption rates of the plurality of blocks to be heated decrease sequentially from the inlet to the outlet.
  • the concentration of the absorbing particles of the plurality of blocks to be heated decreases sequentially from the inlet to the outlet, so that the microwave absorption rates of the plurality of blocks to be heated decrease sequentially from the inlet to the outlet.
  • the microwave resonance heating assembly further includes: a support member, which is fixedly arranged in the microwave resonant cavity.
  • the support member is fixedly connected to the microwave conductor and is used to fixedly connect the microwave conductor to the shell.
  • the microwave conductor further includes: a second conductor part, one end of which is connected to an end of the first conductor part close to the inlet, and the other end of which is connected to a microwave signal for impedance matching of the first conductor part.
  • the microwave resonance heating component further includes: a microwave feed line, at least partially embedded in the inlet, with one end connected to the microwave signal source and the other end connected to one end of the second conductor part.
  • the separation distance between the first conductor part and the other cavity wall is greater than the separation distance between the first conductor part and the cavity wall, wherein the other cavity wall is arranged opposite to the cavity wall.
  • the electronic atomization device includes the above-mentioned microwave resonance heating system.
  • the object component to be heated can be heated using a microwave resonant heating component.
  • the microwave heating component includes a shell and a microwave conductor.
  • a microwave resonant cavity is formed inside the shell.
  • the shell is provided with an outlet located at its open end and is far away from the open end and resonates with the microwave.
  • the entrance of the cavity is connected, the microwave conductor is arranged in the microwave resonant cavity and extends from the entrance to the open end, the object component to be heated is arranged between the microwave conductor and the cavity wall of the microwave resonant cavity, and the microwave signal on the microwave conductor It is fed from the inlet, and the microwave absorption rate of the component to be heated decreases from the inlet to the outlet along the distance between the inlet and the outlet.
  • the object assembly to be heated includes a plurality of blocks to be heated arranged along the spacing direction, and the microwave absorption rates of the plurality of blocks to be heated decrease sequentially from the entrance to the outlet.
  • the material density of the plurality of blocks to be heated decreases sequentially from the inlet to the outlet, so that the microwave absorption rates of the plurality of blocks to be heated decrease sequentially from the inlet to the outlet.
  • the concentration of the absorbing particles of the plurality of blocks to be heated decreases sequentially from the inlet to the outlet, so that the microwave absorption rates of the plurality of blocks to be heated decrease sequentially from the inlet to the outlet.
  • the microwave resonant heating component of the present application includes a shell and a microwave conductor, in which a microwave resonant cavity is formed inside the shell.
  • the shell is also provided with an outlet located at its open end and away from the open end and connected to the microwave resonant cavity.
  • the microwave conductor is arranged in the microwave resonant cavity for microwave resonance in the microwave resonant cavity for microwave heating
  • the object component to be heated in this application is arranged between the microwave conductor and the cavity wall of the microwave resonant cavity , and the object assembly to be heated includes multiple blocks to be heated arranged along the spacing direction between the inlet and the outlet.
  • the microwave absorption rates of the multiple blocks to be heated decrease successively from the entrance to the outlet; because the microwave signal on the microwave conductor along the entrance and exit
  • the spacing direction of the outlet is transmitted from the entrance to the outlet, so that the microwave field generated by the microwave conductor is sequentially enhanced from the entrance to the exit along the spacing direction between the inlet and the outlet. Therefore, this application divides the components to be heated into rows along the spacing direction between the inlet and the outlet.
  • microwave absorption rates of the multiple blocks to be heated decrease sequentially from the entrance to the outlet, which can make the microwave absorption rate of the blocks to be heated where the microwave field is strong is lower, and where the microwave field is weak
  • the microwave absorption rate of the blocks to be heated is high, which can improve the uniformity of microwave energy absorbed by each block to be heated and improve the uniformity of microwave heating.
  • FIG. 1 is a schematic structural diagram of an embodiment of the microwave resonance heating system of the present application.
  • FIG. 2 is an exploded structural schematic diagram of part of the microwave resonance heating system in the embodiment of Figure 1;
  • FIG. 3 is a schematic cross-sectional structural diagram of an embodiment of the microwave resonance heating system of the present application.
  • Figure 4 is a schematic structural diagram of an embodiment of the electronic atomization device of the present application.
  • Figure 5 is a simulation result diagram of the electric field distribution of the microwave resonance heating system of the coaxial microstrip structure of the present application.
  • Figure 6 is a diagram showing the heat distribution simulation results of the component to be heated in the microwave heating resonance system according to the embodiment of Figure 5 of this application;
  • Figure 7 is a simulation result diagram of the electric field distribution of the microwave resonance heating system of the enlarged spatial coaxial microstrip structure of this application;
  • Figure 8 is a heat distribution simulation result diagram of the component to be heated of the microwave heating device according to the embodiment of Figure 7 of the present application;
  • Figure 9 is a simulation result diagram of the electric field distribution of the microwave resonance heating system of the coaxial microstrip structure of the present application.
  • Figure 10 is a heat distribution simulation result diagram of multiple heating blocks heated by the microwave heating device according to the embodiment of Figure 9 of the present application.
  • connection should be understood in a broad sense.
  • it can be a fixed connection or a detachable connection. Or integrated connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium.
  • connection should be understood in specific situations.
  • the first feature "on” or “below” the second feature may be that the first and second features are in direct contact, or the first and second features are in intermediate contact. Indirect media contact.
  • the terms “above”, “above” and “above” the first feature is above the second feature may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is higher in level than the second feature.
  • "Below”, “below” and “beneath” the first feature to the second feature may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature has a smaller horizontal height than the second feature.
  • references to the terms “one embodiment,” “some embodiments,” “an example,” “specific examples,” or “some examples” or the like means that specific features are described in connection with the embodiment or example. , structures, materials or features are included in at least one embodiment or example of the embodiments of this application. In this specification, the schematic expressions of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the specific features, structures, materials or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, those skilled in the art may combine and combine different embodiments or examples and features of different embodiments or examples described in this specification unless they are inconsistent with each other.
  • Microwaves can penetrate the interior of the object to be heated.
  • the heating process is carried out simultaneously throughout the object to be heated.
  • the temperature rises rapidly.
  • the output power of the microwave can be adjusted at any time.
  • the temperature is uniform and the temperature gradient is small.
  • Part of the microwave energy is absorbed by the object to be heated and converted into the heat required for heating.
  • the high efficiency of microwave energy utilization greatly shortens the heat conduction time in conventional heating.
  • the energy used in microwave heating is electrical energy, which does not pollute the environment.
  • the microwave field generated by the microwave conductor is not uniform along the transmission direction, resulting in poor uniformity of heating.
  • this application proposes a microwave resonance heating system, an electronic atomization device, and an object assembly to be heated.
  • the following is a description of the microwave resonance heating system, electronic atomization device, and components provided by this application in conjunction with the embodiments. The components to be heated are described in detail.
  • the microwave resonance heating system (not labeled) includes: a microwave resonance heating component (not labeled) and an object component to be heated (not labeled).
  • the microwave resonance heating component includes: a shell 11 and a microwave conductor 12; wherein, A microwave resonant cavity is formed inside the casing 11.
  • the casing 11 is provided with an outlet 112 at its open end and an inlet 111 away from the open end and connected to the microwave resonant cavity; a microwave conductor 12 is provided in the microwave resonant cavity for use in microwave operation. Microwave resonance is performed in the resonant cavity for microwave heating; the object component to be heated is arranged between the microwave conductor 12 and the cavity wall of the microwave resonant cavity.
  • the component to be heated includes multiple components arranged along the spacing direction of the inlet 111 and the outlet 112. There are blocks 131 to be heated, and the microwave absorptivity of the blocks 131 to be heated decreases sequentially from the inlet 111 to the outlet 112 .
  • the cavity wall is the inner wall of the housing 11 .
  • the microwave conductor 12 is connected to the microwave signal and resonates in the microwave resonant cavity to emit microwaves into the microwave resonant cavity.
  • the microwave can penetrate the inside of the component to be heated in the microwave resonant cavity and cause molecules inside the component to be heated to Waiting for vibration to realize the heating of the component to be heated, most of the microwave energy is absorbed by the component to be heated and converted into the heat required for temperature rise, thereby achieving heating of the component to be heated.
  • the inlet 111 is used to feed microwave signals into the microwave conductor 12; the outlet 112 is used to output the mist or aerosol generated by heating the component to be heated in the microwave resonant cavity.
  • the size of the outlet 112 should be limited to an integer multiple of a quarter wavelength of the microwave signal.
  • the outlet 112 can be arranged symmetrically with the projection of the object component to be heated on the cavity wall (ie, the side wall) where the outlet 112 is provided, so as to improve the uniformity of the output of mist or aerosol in the microwave cavity and improve the uniformity of atomization. .
  • the spacing direction between the inlet 111 and the outlet 112 is the length direction of the microwave conductor 12 .
  • the component to be heated in this embodiment is disposed between the microwave conductor 12 and the cavity wall of the microwave resonant cavity, and the component to be heated includes components along the spacing direction of the inlet 111 and the outlet 112, that is, the microwave conductor 12
  • Multiple to-be-heated blocks 131 are arranged in the length direction, and the microwave absorption rates of the multiple to-be-heated blocks 131 decrease sequentially from the entrance 111 to the outlet 112; because the microwave signal on the microwave conductor 12 moves from The inlet 111 is transmitted to the outlet 112, so that the microwave field generated by the microwave conductor 12 is sequentially enhanced from the inlet to the outlet along the spacing direction of the inlet 111 and the outlet 112.
  • this embodiment divides the component to be heated into components along the inlet 111 and the outlet 112.
  • Multiple blocks 131 to be heated are arranged at intervals, and the microwave absorptivity of the multiple blocks 131 to be heated decreases sequentially from the entrance 111 to the outlet 112, which can make the microwave absorptivity of the blocks 131 to be heated at a stronger microwave field higher.
  • Low, and the microwave absorption rate of the block to be heated 131 where the microwave field is weak is higher, thereby improving the uniformity of microwave energy absorbed by each block to be heated 131 and improving the uniformity of microwave heating.
  • the shell 11 is a microwave resonant cavity that can limit microwaves of a specific frequency within the microwave resonant cavity. Electric energy and magnetic energy are periodically exchanged to heat the components to be heated in the microwave resonant cavity.
  • the casing 11 should have electromagnetic shielding performance to shield the microwave signal in the microwave resonant cavity; and the casing 11 should have good heat insulation performance to reduce heat dissipation to improve the microwave heating effect and efficiency; and the casing 11
  • the body 11 should have a certain stiffness to protect the components within its microwave resonant cavity.
  • the housing 11 may be a metal housing with a certain rigidity, or a metal layer coated on a housing with a certain height, etc.
  • the microwave signal is fed from one end and then resonates in the resonant cavity.
  • the microwave field distribution in the microwave resonant cavity is uneven.
  • the microwave field in the microwave resonant cavity changes along the radial direction of the resonant cavity.
  • the intensity of the microwave field is greater in the area close to the resonant column, while the intensity of the microwave field in the area far away from the resonant column is small, causing the microwave field to change along the radial direction of the resonant column.
  • the radial distribution is extremely uneven, resulting in significant differences in the degree of heating of the components to be heated arranged in the microwave resonant cavity along the radial direction, and the heating uniformity is extremely poor.
  • the microwave resonant cavity in this embodiment can be arranged in a rectangular shape, and the microwave conductor part can be arranged in a plate body.
  • the microwave conductor 12 includes a first conductor part 121, and the object component to be heated is arranged between the first conductor part 121 and the cavity wall. between.
  • the first conductor part 121 is connected to the microwave signal and resonates in the microwave resonant cavity to emit microwaves into the microwave resonant cavity.
  • the microwave can penetrate the inside of the component to be heated in the microwave resonant cavity and cause the inside of the component to be heated to The molecules vibrate to achieve the heating of the component to be heated. Most of the microwave energy is absorbed by the component to be heated and converted into the heat required for temperature rise, thereby achieving heating of the component to be heated.
  • the first conductor parts 121 used for microwave resonance heating of the component to be heated are all arranged in the form of a plate, and the cavity wall is arranged parallel to the first conductor part 121, so that the cavity wall distributed in the microwave resonance cavity is in line with the first conductor part 121.
  • the microwave field in the space between the conductor parts 121 is relatively uniform.
  • the microwave field emitted by the first conductor part 121 towards the cavity wall of the microwave resonant cavity is uniform.
  • the microwave field is uniform and there is no divergence or aggregation, so that the microwave field is stacked along the first conductor part 121 and the cavity wall of the microwave resonant cavity.
  • the direction distribution is uniform and the distribution is uniform in a plane parallel to the first conductor portion, thereby improving the uniformity of microwave heating of the component to be heated.
  • the microwave resonant cavity may be arranged in a rectangular body.
  • the first conductor part 121 of this embodiment is arranged parallel to the cavity wall of the microwave resonant cavity.
  • the space between the first conductor part 121 and the cavity wall of the microwave resonant cavity can be arranged in a rectangular shape, which not only improves the uniformity of the microwave field distributed throughout the space, but also facilitates the assembly of the object to be heated. set up.
  • the length direction of the first conductor part 121 arranged as a plate is parallel to the length direction of the microwave resonant cavity arranged as a rectangular body, and the width direction of the first conductor part 121 is parallel to the width direction of the microwave resonant cavity.
  • the height direction of the first conductor part 121 is parallel to the height direction of the microwave resonant cavity.
  • the cavity wall in this application refers to the top wall or bottom wall extending along the length direction and width direction of the microwave resonant cavity.
  • the cavity wall in this embodiment is the bottom wall of the microwave resonant cavity, and the object component to be heated is disposed between the first conductor part 121 and the bottom wall of the microwave resonant cavity.
  • the microwave field in this embodiment is evenly distributed along the stacking direction (i.e. longitudinal direction) of the first conductor part 121 and the cavity wall (i.e. bottom wall) of the microwave resonant cavity, so that the component to be heated is heated evenly along the longitudinal direction, and
  • the microwave field is uniform in a plane parallel to the first conductor part 121 , so that the component to be heated is heated uniformly in a plane parallel to the first conductor part 121 .
  • the material density of the multiple blocks to be heated 131 decreases sequentially from the inlet 111 to the outlet 112, so that the microwave absorption rate of the multiple blocks to be heated 131 decreases sequentially from the inlet 111 to the outlet 112. Small.
  • the concentration of the absorbing particles of the plurality of blocks 131 to be heated decreases sequentially from the inlet 111 to the outlet 112, so that the microwave absorptivity of the plurality of blocks 131 to be heated increases from the inlet 111 to the outlet. 112 decreases in turn.
  • multiple blocks to be heated may be provided integrally.
  • the microwave conductor 12 of this embodiment further includes a second conductor part 122.
  • One end of the second conductor part 122 is connected to an end of the first conductor part 121 close to the inlet 111.
  • the other end of the portion 122 is connected to a microwave signal for impedance matching of the first conductor portion 121 .
  • the second conductor part 122 for impedance matching is provided between the inlet 111 and the first conductor part 121, which can reduce the loss and interference of microwave signals and improve the microwave heating efficiency.
  • Impedance matching means that during microwave signal transmission, reflection does not occur at the terminals of the system or at the connections of transmission lines with different characteristic impedances.
  • the second conductor part 122 is provided to prevent microwave reflection from occurring between the microwave signal source and the first conductor part 121 .
  • the impedance matching of the first conductor part 121 can be achieved by adjusting the size of the second conductor part 122 of the microwave conductor 12 .
  • the second conductor part 122 of this embodiment is arranged in a plate body.
  • the length direction of the first conductor part 121 is parallel to the length direction of the second conductor part 122
  • the width direction of the first conductor part 121 is parallel to the width direction of the second conductor part 122
  • the height direction of the first conductor part 121 is parallel to the width direction of the second conductor part 122 .
  • the height directions of the portions 122 are parallel, that is, the second conductor portion 122 and the first conductor portion 121 are arranged in parallel.
  • the width direction, the length direction and the stacking direction of the first conductor part and the cavity wall are perpendicular to each other.
  • the second conductor part 122 in this embodiment is used to achieve impedance matching of the first conductor part 121, and its specific shape and size change as the size of the first conductor part 121 changes to ensure the impedance matching effect.
  • the inlet 111 is provided on another cavity wall of the microwave resonant cavity, that is, the top wall
  • the outlet 112 is provided on another cavity wall of the microwave resonant cavity, that is, the side wall, wherein the other cavity wall is connected to
  • the cavity walls are arranged oppositely and perpendicularly to another cavity wall.
  • the microwave resonant heating system of this embodiment further includes: a microwave feed line 124, which is at least partially embedded in the entrance 111, and one end of the microwave feed line 124 is connected to the microwave signal source, and the other end of the microwave feed line 124 is connected to the microwave signal source.
  • a microwave feed line 124 which is at least partially embedded in the entrance 111, and one end of the microwave feed line 124 is connected to the microwave signal source, and the other end of the microwave feed line 124 is connected to the microwave signal source.
  • One end of the two conductor parts 122 is connected, and the microwave feed line 124 is vertically arranged with the second conductor part 122 .
  • the microwave feed line 124 in this embodiment extends from the inlet 111 to the outside of the casing 11 , and an insulating layer 125 is also laid around the portion of the microwave feed line 124 located outside the casing 11 .
  • the insulating layer 125 may be a polytetrafluoroethylene insulating layer or the like.
  • the insulating layer 125 and the microwave feed line 124 form a signal input terminal of the microwave resonance heating system.
  • the microwave feed line 124 includes a portion located inside the entrance of the housing 11 and a portion located outside the housing 11 .
  • the insulation layer 125 is laid outside the portion of the microwave feed line 124 located outside the housing 11 .
  • first conductor part 121 and the second conductor part 122 of this embodiment can be provided integrally and implemented through a microstrip line.
  • the first conductor part 121 and the second conductor part 122 of this embodiment are both arranged in a plate shape, that is, their height is smaller than their length.
  • the distance between the first conductor part 121 and another cavity wall, that is, the top wall, is greater than the distance between the first conductor part 121 and the cavity wall, that is, the bottom wall, wherein the other cavity wall is
  • the cavity walls are arranged opposite to each other. In this way, the microwave field intensity between the first conductor part 121 and the bottom wall can be increased, thereby improving the microwave heating efficiency.
  • the first conductor part 121 of this embodiment can be directly connected to the top wall of the cavity wall.
  • the housing may also be a low dielectric constant ceramic housing, etc., with a metal layer laid on it.
  • the projection of the first conductor part 121 on the bottom wall completely overlaps the projection of the object component to be heated on the bottom wall, so as to fully utilize the microwave field of the first conductor part 121.
  • the microwave resonance heating system of this embodiment further includes: a support member 14, fixedly arranged in the microwave resonant cavity, the support member 14 is fixedly connected to the microwave conductor 12, and is used to fixedly connect the microwave conductor 12 to the housing 11. .
  • the support member 14 can not only fix the object assembly to be heated, but also provide air channels and increase heat dissipation.
  • the support member 14 is arranged in a plate shape, and the support member 14 is provided with a groove (through hole) for fixing the first conductor part 121 and the second conductor part 122 .
  • the support member 34 is disposed between the microwave conductor 12 and another cavity wall of the microwave resonant cavity, that is, the top wall, and the support member 34 is fixed to the other cavity wall. , used to fixedly connect the microwave conductor 12 and the housing 11; wherein, the other cavity wall is arranged opposite to the cavity wall, that is, the bottom wall.
  • the above-mentioned supporting member may be a dielectric plate with low dielectric constant to reduce the loss of microwaves, such as a ceramic plate, etc.
  • the ceramic plate can also be provided with multiple through holes to increase the contact area between the gas in the microwave resonant cavity and the component to be heated, thereby improving its atomization effect.
  • the housing may also be a low dielectric constant ceramic housing, etc., with a metal layer laid on it.
  • the size of the object component to be heated in this embodiment along the length direction of the first conductor part 121 is smaller than the length of the first conductor part 121 . Since the microwave signal propagates along the length direction of the first conductor part 121 to the end of the first conductor part 121 close to the outlet 112, the microwave field increases sequentially along the length direction of the first conductor part 121 from the entrance 111 to the outlet 112. In order to further improve the microwave To improve the heating efficiency, the object component to be heated can be correspondingly arranged at a section of the first conductor part 121 close to the outlet 112 .
  • the size of the first conductor part along the width direction is greater than or equal to the size of the component to be heated along the width direction.
  • the component to be heated is only affected by the microwaves emitted from the side of the first conductor part close to the bottom wall, and can Further improve the heating uniformity of the component to be heated.
  • the width of the microwave conductor is smaller than the width of the microwave resonant cavity to provide an airway.
  • the object component to be heated in this embodiment may be tobacco or other materials that can be atomized by heating, such as traditional Chinese medicine.
  • FIG. 4 is a schematic structural diagram of an embodiment of the electronic atomization device of this application.
  • the electronic atomization device in this embodiment includes: a microwave resonance heating system 51, a main body 52, a battery 53, a controller (not labeled in the figure), a microwave generator (not labeled in the figure), etc.
  • the controller and the microwave generator can be arranged on the circuit board 54 .
  • the microwave generator is connected to the controller and the microwave conductor in the microwave resonance heating system 51 respectively, and is used to generate a microwave signal of a characteristic frequency under the control of the controller.
  • the battery 53 is connected to the controller and the microwave generator, and is used to provide electric energy to the controller and the microwave generator.
  • the microwave resonance heating system 51, battery 53, controller, microwave generator and circuit board are arranged in the main body 52; the main body 52 has an opening for inserting the object component 13 to be heated.
  • the microwave generator can be implemented using a magnetron or an oscillation circuit.
  • the microwave heating assembly includes a shell and a microwave conductor.
  • a microwave resonant cavity is formed inside the shell.
  • the shell is provided with an outlet located at its open end.
  • the microwave conductor is arranged in the microwave resonant cavity and extends from the entrance to the open end.
  • the object component to be heated is arranged between the microwave conductor and the cavity wall of the microwave resonant cavity, and the microwave The microwave signal on the conductor is fed from the inlet, and the microwave absorption rate of the component to be heated decreases sequentially from the inlet to the outlet.
  • the object to be heated assembly includes a plurality of blocks to be heated arranged along a spacing direction, and the microwave absorption rates of the plurality of blocks to be heated decrease sequentially from the inlet to the outlet.
  • the microwave field generated by the microwave conductor is sequentially enhanced from the entrance to the exit in the direction of the separation between the entrance and the exit.
  • the component to be heated is divided into a plurality of blocks to be heated arranged along the distance between the inlet and the outlet, and the microwave absorptivity of the plurality of blocks to be heated decreases sequentially from the entrance to the outlet, which can make the area to be heated where the microwave field is stronger
  • the microwave absorption rate of the block is low, while the microwave absorption rate of the block to be heated is higher where the microwave field is weak, thereby improving the uniformity of microwave energy absorbed by each block to be heated and improving the uniformity of microwave heating.
  • the component to be heated may be tobacco or other materials that can be atomized by heating, such as traditional Chinese medicine.
  • the material density of the multiple blocks to be heated decreases in sequence from the inlet to the outlet, so that the microwave absorption rates of the multiple blocks to be heated decrease in sequence from the inlet to the outlet.
  • the material density of the plurality of blocks to be heated decreases sequentially from the inlet to the outlet, so that the microwave absorptivity of the plurality of blocks to be heated decreases sequentially from the inlet to the outlet.
  • the cut tobacco density of the tobacco block near the outlet may be 0.28g/cm 3
  • the cut tobacco density of the tobacco block near the inlet may be 1.11 g/cm 3
  • the plurality of tobacco blocks to be heated The density of cut tobacco decreases sequentially from the entrance to the exit along the distance between the entrance and the exit.
  • the cut tobacco density of the tobacco block is different, and the dielectric constant of the cut tobacco is different, thereby achieving different microwave absorption rates.
  • the absorbing particle concentrations of the plurality of blocks to be heated decrease sequentially from the inlet to the outlet, so that the microwave absorption rates of the plurality of blocks to be heated decrease sequentially from the inlet to the outlet.
  • the concentration of absorbing particles in the plurality of blocks to be heated decreases in sequence from the inlet to the outlet, so that the microwave absorption rates of the plurality of blocks to be heated decrease in sequence from the inlet to the outlet.
  • concentrations of carbon particles can be added to different tobacco blocks to achieve different concentrations of absorbing particles in different tobacco blocks.
  • concentration of carbon particles added to the tobacco block near the outlet is the smallest
  • concentration of carbon particles added to the tobacco block near the entrance is the largest
  • concentration of carbon particles added to the multiple tobacco blocks to be heated is along the inlet and outlet.
  • the spacing direction decreases from the entrance to the exit.
  • the two technical solutions of the material density of the blocks to be heated and the concentration of absorbing particles can be combined to achieve a sequential decrease in the microwave absorption rates of multiple blocks to be heated from the inlet to the outlet.
  • the object assembly to be heated may be an integral body, that is, multiple blocks to be heated are arranged in one piece.
  • Figure 5 is a simulation result diagram of the electric field distribution of the microwave resonant heating system with a coaxial microstrip structure of the present application
  • Figure 6 is the component to be heated of the microwave resonant heating system according to the embodiment of Figure 5 of the present application.
  • the heat distribution simulation result diagram
  • Figure 7 is a simulation result diagram of the electric field distribution of the microwave resonant heating system of the enlarged spatial coaxial microstrip structure of the present application
  • Figure 8 is the microwave resonant heating system to be heated according to the embodiment of Figure 7 of the present application Heat distribution simulation results of object components.
  • the microwave heating device of the present application when used for microwave heating of the component to be heated, the heating energy and temperature of the component to be heated along the distance between the first conductor part and the cavity wall and in the plane parallel to the first conductor part are relatively small. Evenly.
  • Figure 9 is a simulation result diagram of the electric field distribution of the microwave resonant heating system with a coaxial microstrip structure of the present application
  • Figure 10 is a microwave resonant heating system according to the embodiment of Figure 9 of the present application.
  • Heat distribution simulation results of heating multiple heating blocks It can be seen that the object assembly to be heated is divided into multiple blocks to be heated arranged along the spacing direction between the inlet and the outlet of the housing, and the microwave absorption rates of the multiple blocks to be heated decrease sequentially from the entrance to the outlet, which can improve the performance of each block to be heated.
  • the heating block absorbs microwave energy uniformly and improves the uniformity of microwave heating.
  • the microwave resonant heating component of the present application includes a shell and a microwave conductor, in which a microwave resonant cavity is formed inside the shell.
  • the shell is also provided with an outlet located at its open end and away from the open end and connected to the microwave resonant cavity.
  • the microwave conductor is arranged in the microwave resonant cavity for microwave resonance in the microwave resonant cavity for microwave heating
  • the object component to be heated in this application is arranged between the microwave conductor and the cavity wall of the microwave resonant cavity , and the object assembly to be heated includes multiple blocks to be heated arranged along the spacing direction between the inlet and the outlet.
  • the microwave absorption rates of the multiple blocks to be heated decrease successively from the entrance to the outlet; because the microwave signal passes between the entrance and exit of the microwave conductor
  • the spacing direction is transmitted from the inlet to the outlet, so that the microwave field generated by the microwave conductor is sequentially enhanced from the entrance to the outlet along the spacing direction between the inlet and the outlet. Therefore, this application divides the components to be heated into arranged along the spacing direction between the inlet and the outlet.
  • microwave absorption rates of the multiple blocks to be heated decrease sequentially from the entrance to the exit, which can make the microwave absorption rate of the blocks to be heated where the microwave field is strong is lower, and where the microwave field is weak
  • the microwave absorption rate of the block to be heated is high, which can improve the uniformity of microwave energy absorbed by each block to be heated and improve the uniformity of microwave heating.

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  • Constitution Of High-Frequency Heating (AREA)

Abstract

一种微波谐振加热系统及电子雾化装置、待加热物组件。微波谐振加热系统包括：微波谐振加热组件。微波谐振加热组件包括：壳体（11），其内部形成有微波谐振腔，壳体（11）上设有位于其开口端的出口（112）及远离开口端且与微波谐振腔连通的入口（111）；微波导体（12），设置在微波谐振腔内，用于在微波谐振腔内进行微波谐振，以进行微波加热；待加热物组件，设置在微波导体（12）与微波谐振腔的腔体壁之间，待加组件包括沿入口（111）和出口（112）的间隔方向排布的多个待加热块（131），多个待加热块（131）的微波吸收率从入口（111）至出口（112）依次减小。

Description

微波谐振加热系统及电子雾化装置、待加热物组件 【技术领域】
本申请涉及电子雾化技术领域，特别是涉及一种微波谐振加热系统及电子雾化装置、待加热物组件。
【背景技术】
目前，国内外市售主流的电子雾化装置一般采用电热式雾化。该方式基于热传导原理，热量传导需要时间，且存在温度梯度导致热量分布不均。鉴于电热式雾化方式存在的诸多缺陷，本领域技术人员提出了微波谐振加热的电子雾化装置。
由于微波信号沿着微波导体传输，微波导体产生的微波场沿传输方向不均匀，导致其加热的均匀性较差。
【发明内容】
本申请提供一种微波谐振加热系统及电子雾化装置、待加热物组件，以提高微波加热的均匀性。
为解决上述技术问题，本申请提出一种微波谐振加热系统。该微波谐振加热系统包括：微波谐振加热组件，包括：壳体，其内部形成有微波谐振腔，壳体上设有位于其开口端的出口及远离开口端且与微波谐振腔连通的入口；微波导体，设置在微波谐振腔内，用于在微波谐振腔内进行微波谐振，以进行微波加热；待加热物组件，设置在微波导体与微波谐振腔的腔体壁之间，待加组件包括沿入口和出口的间隔方向排布的多个待加热块，多个待加热块的微波吸收率从入口至出口依次减小。
其中，入口和出口的间隔方向为微波导体的长度方向。
其中，微波谐振腔呈矩形体设置，微波导体呈板体设置，微波导体包括第一导体部，待加热物组件设置在第一导体部与腔体壁之间，第一导体部与腔体壁平行设置。
其中，多个待加热块的材质密度从入口至出口依次减小，以使多个待加热块的微波吸收率从入口至出口依次减小。
其中，多个待加热块的吸波粒子浓度从入口至出口依次减小，以使多个待加热块的微波吸收率从入口至出口依次减小。
其中，微波谐振加热组件进一步包括：支撑件，固定设置在微波谐振腔内，支撑件与微波导体固定连接，用于将微波导体与壳体固定连接。
其中，微波导体进一步包括：第二导体部，其一端与第一导体部靠近入口的一端连接，其另一端接入微波信号，用于对第一导体部进行阻抗匹配。
其中，微波谐振加热组件进一步包括：微波馈入线，至少部分嵌设在入口内，且其一端与微波信号源连接，其另一端与第二导体部的一端连接。
其中，第一导体部到另一腔体壁之间的间隔距离大于第一导体部与腔体壁之间的间隔距离，其中，另一腔体壁与腔体壁相对设置。
为解决上述技术问题，本申请提出一种电子雾化装置。该电子雾化装置包括上述微波谐振加热系统。
为解决上述技术问题，本申请提出一种待加热物组件。该待加热物组件可利用微波谐振加热组件进行加热，微波加热组件包括壳体及微波导体，壳体内部形成有微波谐振腔，壳体设有位于其开口端的出口及远离开口端且与微波谐振腔连通的入口，微波导体设置在微波谐振腔内且从所述入口处向开口端延伸，待加热物组件设置在微波导体与微波谐振腔的腔体壁之间，且微波导体上的微波信号从入口馈入，且待加热物组件的微波吸收率沿入口与出口的间隔方向从入口到出口的方向上减小。
其中，待加热物组件包括沿间隔方向排布的多个待加热块，多个待加热块的微波吸收率从入口至出口依次减小。
其中，多个待加热块的材质密度从入口至出口依次减小，以使多个待加热块的微波吸收率从入口至出口依次减小。
其中，多个待加热块的吸波粒子浓度从入口至出口依次减小，以使多个待加热块的微波吸收率从入口至出口依次减小。
区别于现有技术：本申请的微波谐振加热组件包括壳体、微波导体，其中，壳体内部形成有微波谐振腔，壳体还设有位于其开口端的出口及远离开口端且与微波谐振腔连通的入口；微波导体设置在微波谐振腔内，用于在微波谐振腔内进行微波谐振，以进行微波加热；本申请的待加热物组件设置在微波导体与微波谐振腔的腔体壁之间，且待加热物组件包括沿入口和出口的间隔方向排布的多个待加热块，多个待加热块的微波吸收率从入口至出口依次减小；因微波 信号在微波导体上沿入口与出口的间隔方向从入口到出口传输，使得微波导体产生的微波场沿入口与出口的间隔方向从入口到出口依次增强，因此，本申请将待加热物组件划分为沿入口与出口的间隔方向排布的多个待加热块，且多个待加热块的微波吸收率从入口至出口依次减小，能够使得微波场较强处的待加热块的微波吸收率较低，而微波场较弱处的待加热块的微波吸收率较高，从而能够提高每个待加热块吸收微波能量的均匀性，提高微波加热的均匀性。
【附图说明】
为了更清楚地说明本申请实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图，其中：
图1是本申请微波谐振加热系统一实施例的结构示意图；
图2是图1实施例微波谐振加热系统部分结构的爆炸结构示意图；
图3是本申请微波谐振加热系统一实施例的截面结构示意图；
图4是本申请电子雾化装置一实施例的结构示意图；
图5是本申请同轴微带结构的微波谐振加热系统的电场分布的一仿真结果图；
图6是本申请图5实施例微波加热谐振系统对待加热物组件的热量分布仿真结果图；
图7是本申请加大上空间同轴微带结构的微波谐振加热系统的电场分布的一仿真结果图；
图8是本申请图7实施例微波加热装置对待加热物组件的热量分布仿真结果图；
图9是本申请同轴微带结构的微波谐振加热系统的电场分布的一仿真结果图；
图10是本申请图9实施例微波加热装置加热多个加热块的热量分布仿真结果图。
【具体实施方式】
下面结合附图和实施例，对本申请作进一步的详细描述。特别指出的是，以下实施例仅用于说明本申请，但不对本申请的范围进行限定。同样的，以下实施例仅为本申请的部分实施例而非全部实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其它实施例，都属于本申请保护的范围。
在本申请实施例的描述中，需要说明的是，除非另有明确的规定和限定，术语“相连”、“连接”应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或一体连接；可以是机械连接，也可以是电连接；可以是直接相连，也可以通过中间媒介间接相连。对于本领域的普通技术人员而言，可以具体情况理解上述术语在本申请实施例中的具体含义。
在本申请实施例中，除非另有明确的规定和限定，第一特征在第二特征“上”或“下”可以是第一和第二特征直接接触，或第一和第二特征通过中间媒介间接接触。而且，第一特征在第二特征“之上”、“上方”和“上面”可是第一特征在第二特征正上方或斜上方，或仅仅表示第一特征水平高度高于第二特征。第一特征在第二特征“之下”、“下方”和“下面”可以是第一特征在第二特征正下方或斜下方，或仅仅表示第一特征水平高度小于第二特征。
在本说明书的描述中，参考术语“一个实施例”、“一些实施例”、“示例”、“具体示例”、或“一些示例”等的描述意指结合该实施例或示例描述的具体特征、结构、材料或者特点包含于本申请实施例的至少一个实施例或示例中。在本说明书中，对上述术语的示意性表述不必须针对的是相同的实施例或示例。而且，描述的具体特征、结构、材料或者特点可以在任一个或多个实施例或示例中以合适的方式结合。此外，在不相互矛盾的情况下，本领域的技术人员可以将本说明书中描述的不同实施例或示例以及不同实施例或示例的特征进行结合和组合。
本领域技术人员提出了微波谐振加热的电子雾化装置。微波能穿透待加热物的内部，其加热过程在整个待加热物内同时进行，升温迅速，微波的输出功率随时可调，温度均匀，温度梯度小，不需要高温介质来传热，绝大部分微波能量被待加热物吸收并转化为升温所需要的热量，微波能量利用高效率的特性，大大缩短了常规加热中热传导的时间。微波加热所用能源为电能，对环境没有污染。
但由于微波信号沿着微波导体传输，微波导体产生的微波场沿传输方向不均匀，导致其加热的均匀性较差。
为解决上述问题，提高微波加热的均匀性，本申请提出一种微波谐振加热系统及电子雾化装置、待加热物组件，下面结合实施例对本申请提供的微波谐振加热系统及电子雾化装置、待加热物组件进行详细描述。
本申请首先提出一种微波谐振加热系统，如图1及图2所示，图1是本申请微波谐振加热系统一实施例的结构示意图；图2是图1实施例微波谐振加热系统部分结构的爆炸结构示意图。本实施例微波谐振加热系统(图未标)包括：微波谐振加热组件(图未标)及待加热物组件(图未标)，微波谐振加热组件包括：壳体11、微波导体12；其中，壳体11内部形成有微波谐振腔，壳体11上设有位于其开口端的出口112及远离开口端且与微波谐振腔连通的入口111；微波导体12设置在微波谐振腔内，用于在微波谐振腔内进行微波谐振，以进行微波加热；待加热物组件设置在微波导体12与微波谐振腔的腔体壁之间，待加热物组件包括沿入口111和出口112的间隔方向排布的多个待加热块131，多个待加热块131的微波吸收率从入口111至出口112依次减小。
其中，腔体壁即为壳体11的内壁。
微波导体12接入微波信号，并在微波谐振腔内进行谐振，以向微波谐振腔体内发射微波，微波能穿透微波谐振腔内的待加热物组件的内部，引起待加热物组件内部的分子等振动，以实现待加热物组件升温，绝大部分微波能量被待加热物组件吸收并转化为升温所需要的热量，从而实现待加热物组件的加热。
其中，入口111用于为微波导体12馈入微波信号；出口112用于将微波谐振腔内待加热物组件加热产生的雾气或者气溶胶等输出。
其中，为了避免微波信号从出口112漏出，出口112的尺寸应该限定在微波信号的四分之一波长的整数倍。出口112可以以待加热物组件在设置出口112的腔体壁(即侧壁)上的投影为中心对称设置，以提高微波腔体内雾气或者气溶胶等输出的均匀性，提高雾化的均匀性。
其中，入口111和出口112的间隔方向为微波导体12的长度方向。
区别于现有技术，本实施例的待加热物组件设置在微波导体12与微波谐振腔的腔体壁之间，且待加热物组件包括沿入口111和出口112的间隔方向，即微波导体12的长度方向排布的多个待加热块131，多个待加热块131的微波吸收率从入口111至出口112依次减小；因微波信号在微波导体12上沿着微波导体12的长度方向从入口111到出口112传输，使得微波导体12产生的微波场沿入口111和出口112的间隔方向从入口到出口依次增强，因此，本实施例将待加热 物组件划分为沿入口111和出口112的间隔方向排布的多个待加热块131，且多个待加热块131的微波吸收率从入口111至出口112依次减小，能够使得微波场较强处的待加热块131的微波吸收率较低，而微波场较弱处的待加热块131的微波吸收率较高，从而能够提高每个待加热块131吸收微波能量的均匀性，提高微波加热的均匀性。
壳体11是一个微波谐振腔体，能够将特定频率的微波限定在微波谐振腔体内，电能和磁能周期性的进行能量交换，以对微波谐振腔体内的待加热物组件加热。
其中，壳体11应具有电磁屏蔽性能，以将微波信号屏蔽在微波谐振腔内；且壳体11应具有较好的隔热性能，减少热量散出，以提高微波加热效果及效率；且壳体11应具有一定的刚度，以保护其微波谐振腔内的组件。
例如，壳体11可以是具有一定刚度的金属壳体，或者在具有一定高度的外壳上涂覆一金属层，等等。
圆柱状的微波谐振腔体，微波信号从一端馈入，然后在谐振腔体内进行谐振，微波谐振腔内的微波场分布不均匀。特别是，微波谐振腔内的微波场沿着谐振腔的径向方向变化，靠近谐振柱区域的微波场强度较大，而远离谐振柱区域的微波场强度较小，导致微波场沿谐振柱的径向分布极不均匀，从而导致设置在微波谐振腔内的待加热物组件沿该径向的加热程度存在明显差异，加热均匀性极差。
为此，本实施例的微波谐振腔可以呈矩形体设置，微波导体部可以呈板体设置，微波导体12包括第一导体部121，待加热物组件设置在第一导体部121与腔体壁之间。
第一导体部121接入微波信号，并在微波谐振腔内进行谐振，以向微波谐振腔体内发射微波，微波能穿透微波谐振腔内的待加热物组件的内部，引起待加热物组件内部的分子等振动，以实现待加热物组件升温，绝大部分微波能量被待加热物组件吸收并转化为升温所需要的热量，从而实现待加热物组件的加热。
本实施例用于对待加热物组件进行微波谐振加热的第一导体部121均呈板体设置，腔体壁与第一导体部121平行设置，使得分布在微波谐振腔的腔体壁与第一导体部121之间的空间内的微波场较均匀。
特别是，因第一导体部121呈板体体设置，且腔体壁与第一导体部121平 行设置，第一导体部121朝微波谐振腔的腔体壁发出的微波场是均匀的，在微波谐振腔的腔体壁与第一导体部121之间的空间内，微波场是均匀的，不存在发散或者聚集，使得微波场沿第一导体部121与微波谐振腔的腔体壁的层叠方向分布均匀及平行于第一导体部的平面内分布均匀，进而能够提高对待加热物组件的微波加热的均匀性。
可选地，微波谐振腔可以呈矩形体设置。
本实施例的第一导体部121与微波谐振腔的腔体壁平行设置。通过这种结构，能够使得第一导体部121与微波谐振腔的腔体壁之间的空间呈矩形体设置，不仅能够提高整个空间分布的微波场的均匀性，而且能够便于待加热物组件的设置。
例如，本实施例中，呈板体设置的第一导体部121的长度方向与呈矩形体设置的微波谐振腔的长度方向平行，第一导体部121的宽度方向与微波谐振腔的宽度方向平行，第一导体部121的高度方向与微波谐振腔的高度方向平行。通过这种结构，能够在保证待加热物组件的体积及加热效果的同时，缩小微波谐振腔的体积，从而缩小微波谐振加热系统的体积。
本申请的腔体壁是指沿微波谐振腔的长度方向及宽度方向延伸的顶壁或者底壁。具体地，本实施例的腔体壁是微波谐振腔的底壁，待加热物组件设置在第一导体部121与微波谐振腔的底壁之间。
由上述分析可知，本实施例微波场沿第一导体部121与微波谐振腔的腔体壁(即底壁)的层叠方向(即纵向)分布均匀，使得待加热物组件沿纵向受热均匀，且微波场在于第一导体部121平行的平面内是均匀的，使得待加热物组件在与第一导体部121平行的平面内受热均匀。
可选地，在一具体实施例中，多个待加热块131的材质密度从入口111至出口112依次减小，以使多个待加热块131的微波吸收率从入口111至出口112依次减小。
可选地，在另一具体实施例中，多个待加热块131的吸波粒子浓度从入口111至出口112依次减小，以使多个待加热块131的微波吸收率从入口111至出口112依次减小。
在其它实施例中，多个待加热块可以一体设置。
继续参阅图1及图2，可选地，本实施例的微波导体12进一步包括第二导体部122，第二导体部122的一端与第一导体部121靠近入口111的一端连接， 第二导体部122的另一端接入微波信号，用于对第一导体部121进行阻抗匹配。
本实施例在入口111与第一导体部121之间设置用于阻抗匹配的第二导体部122，能够减少微波信号的损耗及干扰，提高微波加热效率。
阻抗匹配是指微波信号传输过程中，在系统的终端或不同特性阻抗传输线的连接处不产生反射。本实施例设置第二导体部122，用于在微波信号源与第一导体部121之间不产生微波反射。
本实施例可以通过调整微波导体12的第二导体部122的尺寸来实现对第一导体部121的阻抗匹配。
可选地，本实施例的第二导体部122呈板体设置。第一导体部121的长度方向与第二导体部122的长度方向平行，第一导体部121的宽度方向与第二导体部122的宽度方向平行，第一导体部121的高度方向与第二导体部122的高度方向平行，即第二导体部122与第一导体部121平行设置。
宽度方向、长度方向及第一导体部与腔体壁层叠方向相互垂直。
具体地，本实施例的第二导体部122用于实现第一导体部121的阻抗匹配，其具体形状及尺寸随着第一导体部121的尺寸变化而变化，以保证阻抗匹配效果。
可选地，入口111设置在微波谐振腔的另一腔体壁，即顶壁上，出口112设置在微波谐振腔的又一腔体壁，即侧壁上，其中，另一腔体壁与腔体壁相对设置，且与又一腔体壁垂直设置。
本实施例的微波谐振加热系统进一步包括：微波馈入线124，至少部分嵌设在入口111内，且微波馈入线124的一端与微波信号源连接，微波馈入线124的另一端与第二导体部122的一端连接，且微波馈入线124与第二导体部122垂直设置。
本实施例的微波馈入线124从入口111延伸至壳体11外，位于壳体11外的部分微波馈入线124外围还敷设有绝缘层125。该绝缘层125可以是聚四氟乙烯绝缘层等。绝缘层125与微波馈入线124组成微波谐振加热系统的信号输入端子。
其中，微波馈入线124包括设置在壳体11入口内部分及设置在壳体11外的部分，绝缘层125敷设在微波馈入线124设置在壳体11外的部分外。
可选地，本实施例的第一导体部121、第二导体部122可以一体设置，通过一条微带线实现。
本实施例的第一导体部121、第二导体部122均呈板状设置，即其高度小于其长度及长度。
可选地，第一导体部121到另一腔体壁，即顶壁之间的距离大于第一导体部121与腔体壁，即底壁之间的距离，其中，另一腔体壁与腔体壁相对设置。通过这种方式，能够增加第一导体部121与底壁之间的微波场强度，进而能够提高微波加热效率。
其中，本实施例的第一导体部121可以直接与腔体壁的顶壁直接连接。
在其它实施例中，壳体还可以是低介电常数的陶瓷壳体等，其上敷设有一层金属层。
本实施例的第一导体部121在底壁上的投影与待加热物组件在底壁上的投影完全重叠，以充分利用第一导体部121的微波场。
可选地，本实施例的微波谐振加热系统进一步包括：支撑件14，，固定设置在微波谐振腔内，支撑件14与微波导体12固定连接，用于将微波导体12与壳体11固定连接。
支撑件14不仅可以固定待加热物组件，而且能够提供气道，且增加散热。
具体地，支撑件14呈板状设置，支撑件14设置有凹槽(通孔)，用于固定设置第一导体部121、第二导体部122。
在另一实施例中，如图3所示，支撑件34设置在微波导体12与微波谐振腔的另一腔体壁，即顶壁之间，且支撑件34与另一腔体壁固定设置，用于将微波导体12与壳体11固定连接；其中，另一腔体壁与腔体壁，即底壁相对设置。
其中，上述支撑件可以是低介电常数的介质板，以减少对微波的损耗，如陶瓷板等。
陶瓷板还可以设置多个通孔，以增加微波谐振腔体内气体与待加热物组件的接触面积，从而提高其雾化效果。
在其它实施例中，壳体还可以是低介电常数的陶瓷壳体等，其上敷设有一层金属层。
本实施例的其它结构及工作原理可以参阅上述实施例，这里不赘述。
本实施例的待加热物组件沿第一导体部121的长度方向的尺寸小于第一导体部121的长度。因微波信号沿第一导体部121的长度方向传播至第一导体部121靠近出口112的端部，微波场沿第一导体部121的长度方向从入口111至出口112依次增加，为了进一步提高微波加热效率，可以将待加热物组件对应设 置在第一导体部121靠近出口112的一段。
本申请实施例中，第一导体部沿宽度方向的尺寸大于或者等于待加热物组件沿宽度方向的尺寸，待加热物组件仅受到从第一导体部靠近底壁的一侧发出的微波，能够进一步提高待加热物组件的加热均匀性。
本申请实施例中，微波导体的宽度小于微波谐振腔的宽度，以提供气道。
其中，本实施例的待加热物组件可以是烟草或其他可通过加热方式实现雾化的其他材料，例如中药等。
本申请进一步提出一种电子雾化装置，如图4所示，图4是本申请电子雾化装置一实施例的结构示意图。本实施例电子雾化装置包括：微波谐振加热系统51、主体52、电池53、控制器(图未标)、微波发生器(图未标)等。
关于微波谐振加热系统51的结构及工作原理可以参阅上述实施例，这里不赘述。
其中，控制器及微波发生器可以设置在电路板54上。微波发生器分别与控制器及微波谐振加热系统51中的微波导体连接，用于在控制器的控制下产生特性频率的微波信号。
电池53与控制器及微波发生器连接，用于为控制器及微波发生器提供电能。微波谐振加热系统51、电池53、控制器、微波发生器及电路板设置在主体52内；主体52开设有一开口，用于穿插待加热物组件13。
其中，微波发生器可以采用磁控管或者振荡电路等实现。
本申请进一步提出一种待加热物组件，可利用上述微波谐振加热组件进行加热，微波加热组件包括壳体及微波导体，壳体内部形成有微波谐振腔，壳体设有位于其开口端的出口及远离开口端且与微波谐振腔连通的入口，微波导体设置在微波谐振腔内且从入口处向开口端延伸，待加热物组件设置在微波导体与微波谐振腔的腔体壁之间，且微波导体上的微波信号从入口馈入，且待加热物组件的微波吸收率入口到出口的方向上依次减小。
可选地，待加热物组件包括沿间隔方向排布的多个待加热块，多个待加热块的微波吸收率从入口至出口依次减小。
因微波信号在微波导体上沿壳体的入口与出口的间隔方向从入口到出口传输，使得微波导体产生的微波场沿入口与出口的间隔方向从入口到出口依次增强，因此，本实施例将待加热物组件划分为沿入口与出口的间隔方向排布的多个待加热块，且多个待加热块的微波吸收率从入口至出口依次减小，能够使得 微波场较强处的待加热块的微波吸收率较低，而微波场较弱处的待加热块的微波吸收率较高，从而能够提高每个待加热块吸收微波能量的均匀性，提高微波加热的均匀性。
待加热物组件可以是烟草或其他可通过加热方式实现雾化的其他材料，例如中药等。
可选地，多个待加热块的材质密度从入口至出口依次减小，以使多个待加热块的微波吸收率从入口至出口依次减小。
多个待加热块的材质密度从入口至出口依次减小，以使多个待加热块的微波吸收率从入口至出口依次减小。
例如，多个待加热的烟草块中靠近出口的烟草块的烟丝密度可以是0.28g/cm 3，靠近入口的烟草块的烟丝密度可以是1.11g/cm 3，且多个待加热的烟草块的烟丝密度沿入口与出口的间隔方向从入口至出口依次减小。烟草块的烟丝密度不同，其烟丝介电常数不同，从而实现不同的微波吸收率。
可选地，多个待加热块的吸波粒子浓度从入口至出口依次减小，以使多个待加热块的微波吸收率从入口至出口依次减小。
多个待加热块的吸波粒子浓度从入口至出口依次减小，以使多个待加热块的微波吸收率从入口至出口依次减小。
例如，可以在不同烟草块中加不同浓度的炭粒子，实现不同烟草块的不同吸波粒子浓度。多个待加热的烟草块中靠近出口的烟草块加入的炭粒子浓度最小，靠近入口的烟草块加入的炭粒子浓度最大，且多个待加热的烟草块的加入的炭粒子浓度沿入口与出口的间隔方向从入口至出口依次减小。
当然，在其它实施例中，可以结合上述待加热块的材质密度及吸波粒子浓度这两种技术方案来实现多个待加热块的微波吸收率从入口至出口依次减小。
在其它实施例中，待加热物组件可以是一整体，即多个待加热块一体设置。
关于待加热物组件的的其它技术方案可以参阅上述实施例。
如图5至图8所示，图5是本申请同轴微带结构的微波谐振加热系统的电场分布的一仿真结果图；图6是本申请图5实施例微波谐振加热系统对待加热物组件的热量分布仿真结果图；图7是本申请加大上空间同轴微带结构的微波谐振加热系统的电场分布的一仿真结果图；图8是本申请图7实施例微波谐振加热系统对待加热物组件的热量分布仿真结果图。可知，采用本申请的微波加热装置对待加热物组件进行微波加热时，对待加热物组件沿第一导体部与腔体 壁的间隔方向及平行于第一导体部的平面内的加热能量及温度较均匀。
进一地，如图9及图10所示，图9是本申请同轴微带结构的微波谐振加热系统的电场分布的一仿真结果图；图10是本申请图9实施例微波谐振加热系统加热多个加热块的热量分布仿真结果图。可知，待加热物组件划分为沿壳体的入口与出口的间隔方向排布的多个待加热块，且多个待加热块的微波吸收率从入口至出口依次减小，能够提高每个待加热块吸收微波能量的均匀性，提高微波加热的均匀性。
区别于现有技术：本申请的微波谐振加热组件包括壳体、微波导体，其中，壳体内部形成有微波谐振腔，壳体还设有位于其开口端的出口及远离开口端且与微波谐振腔连通的入口；微波导体设置在微波谐振腔内，用于在微波谐振腔内进行微波谐振，以进行微波加热；本申请的待加热物组件设置在微波导体与微波谐振腔的腔体壁之间，且待加热物组件包括沿入口和出口的间隔方向排布的多个待加热块，多个待加热块的微波吸收率从入口至出口依次减小；因微波信号在微波导体上入口与出口的间隔方向从入口到出口传输，使得微波导体产生的微波场沿入口与出口的间隔方向从入口到出口依次增强，因此，本申请将待加热物组件划分为沿入口与出口的间隔方向排布的多个待加热块，且多个待加热块的微波吸收率从入口至出口依次减小，能够使得微波场较强处的待加热块的微波吸收率较低，而微波场较弱处的待加热块的微波吸收率较高，从而能够提高每个待加热块吸收微波能量的均匀性，提高微波加热的均匀性。
以上所述仅为本申请的实施方式，并非因此限制本申请的专利范围，凡是利用本申请说明书及附图内容所作的等效结构或等效流程变换，或直接或间接运用在其他相关的技术领域，均同理包括在本申请的专利保护范围内。

Claims (14)

  1. 一种微波谐振加热系统，其特征在于，包括：
    微波谐振加热组件，包括：
    壳体，其内部形成有微波谐振腔，所述壳体上设有位于其开口端的出口及远离所述开口端且与所述微波谐振腔连通的入口；
    微波导体，设置在所述微波谐振腔内，用于在所述微波谐振腔内进行微波谐振，以进行微波加热；
    待加热物组件，设置在所述微波导体与所述微波谐振腔的腔体壁之间，所述待加组件包括沿所述入口和所述出口的间隔方向排布的多个待加热块，所述多个待加热块的微波吸收率从所述入口至所述出口依次减小。
  2. 根据权利要求1所述的微波谐振加热系统，其特征在于，所述入口和所述出口的间隔方向为所述微波导体的长度方向。
  3. 根据权利要求1所述的微波谐振加热系统，其特征在于，所述微波导体呈板体设置，所述微波导体包括第一导体部，所述待加热物组件设置在所述第一导体部与所述腔体壁之间，所述第一导体部与所述腔体壁平行设置。
  4. 根据权利要求1所述的微波谐振加热系统，其特征在于，所述多个待加热块的材质密度从所述入口至所述出口依次减小，以使所述多个待加热块的微波吸收率从所述入口至所述出口依次减小。
  5. 根据权利要求1所述的微波谐振加热系统，其特征在于，所述多个待加热块的吸波粒子浓度从所述入口至所述出口依次减小，以使所述多个待加热块的微波吸收率从所述入口至所述出口依次减小。
  6. 根据权利要求1至5任一项所述的微波谐振加热系统，其特征在于，所述微波加热组件进一步包括：
    支撑件，固定设置在所述微波谐振腔内，所述支撑件与所述微波导体固定连接，用于将所述微波导体与所述壳体固定连接。
  7. 根据权利要求3至5任一项所述的微波谐振加热系统，其特征在于，所述微波导体进一步包括：
    第二导体部，其一端与所述第一导体部靠近所述入口的一端连接，其另一端接入微波信号，用于对所述第一导体部进行阻抗匹配。
  8. 根据权利要求7所述的微波谐振加热系统，其特征在于，所述微波加热组件进一步包括：
    微波馈入线，至少部分嵌设在所述入口内，且其一端与微波信号源连接，其另一端与所述第二导体部的一端连接。
  9. 根据权利要求3至5任一项所述的微波谐振加热系统，其特征在于，所述第一导体部到另一腔体壁之间的间隔距离大于所述第一导体部与所述腔体壁之间的间隔距离，其中，所述另一腔体壁与所述腔体壁相对设置。
  10. 一种电子雾化装置，其特征在于，包括权利要求1至9任一项所述的微波谐振加热系统。
  11. 一种待加热物组件，其特征在于，可利用微波谐振加热组件进行加热，所述微波加热组件包括壳体及微波导体，所述壳体内部形成有微波谐振腔，所述壳体设有位于其开口端的出口及远离所述开口端且与所述微波谐振腔连通的入口，所述微波导体设置在所述微波谐振腔内且从所述入口处向所述开口端延伸，所述待加热物组件设置在所述微波导体与所述微波谐振腔的腔体壁之间，且所述微波导体上的微波信号从所述入口馈入，且所述待加热物组件的微波吸收率沿所述入口到所述出口的方向上减小。
  12. 根据权利要求11所述的待加热物组件，其特征在于，所述待加热物组件包括沿所述间隔方向排布的多个待加热块，所述多个待加热块的微波吸收率从所述入口至所述出口依次减小。
  13. 根据权利要求12所述的待加热物组件，其特征在于，所述多个待加热块的材质密度从所述入口至所述出口依次减小，以使所述多个待加热块的微波吸收率从所述入口至所述出口依次减小。
  14. 根据权利要求12所述的待加热物组件，其特征在于，所述多个待加热块的吸波粒子浓度从所述入口至所述出口依次减小，以使所述多个待加热块的微波吸收率从所述入口至所述出口依次减小。
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CN1731023A (zh) * 2004-08-06 2006-02-08 上海松下微波炉有限公司 微波炉
CN201373470Y (zh) * 2008-09-16 2009-12-30 刘秋雷 一种微波炉加热盘
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CN215381427U (zh) * 2021-02-09 2022-01-04 深圳麦克韦尔科技有限公司 气溶胶产生系统及其气溶胶生成制品
CN113925221A (zh) * 2021-11-18 2022-01-14 深圳麦时科技有限公司 气溶胶产生组件、气溶胶发生装置、系统和控制方法
CN114401565A (zh) * 2021-12-22 2022-04-26 深圳麦时科技有限公司 气溶胶产生装置及其微波加热装置

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CN1731023A (zh) * 2004-08-06 2006-02-08 上海松下微波炉有限公司 微波炉
CN201373470Y (zh) * 2008-09-16 2009-12-30 刘秋雷 一种微波炉加热盘
CN109567275A (zh) * 2018-11-30 2019-04-05 安徽中烟工业有限责任公司 一种利用感应加热方式实现烟草物料均匀加热的工作系统
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