WO2023201828A1 - 麦克风 - Google Patents

麦克风 Download PDF

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Publication number
WO2023201828A1
WO2023201828A1 PCT/CN2022/094172 CN2022094172W WO2023201828A1 WO 2023201828 A1 WO2023201828 A1 WO 2023201828A1 CN 2022094172 W CN2022094172 W CN 2022094172W WO 2023201828 A1 WO2023201828 A1 WO 2023201828A1
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WO
WIPO (PCT)
Prior art keywords
low
pass filter
filter circuit
microphone
asic chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2022/094172
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English (en)
French (fr)
Inventor
陈晓翔
章仰明
蔡东记
蒲景鑫
张睿
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AAC Technologies Holdings Shenzhen Co Ltd
Original Assignee
AAC Acoustic Technologies Shenzhen Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by AAC Acoustic Technologies Shenzhen Co Ltd filed Critical AAC Acoustic Technologies Shenzhen Co Ltd
Priority to JP2022578984A priority Critical patent/JP7662674B2/ja
Priority to US17/994,024 priority patent/US12503359B2/en
Publication of WO2023201828A1 publication Critical patent/WO2023201828A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R3/00—Circuits for transducers
    • H04R3/04—Circuits for transducers for correcting frequency response
    • H04R3/06—Circuits for transducers for correcting frequency response of electrostatic transducers

Definitions

  • the utility model relates to the field of electroacoustic conversion, in particular to a microphone.
  • MEMS Microelectro Mechanical Systems
  • MEMS Microelectro Mechanical Systems
  • microphones are microphones manufactured based on MEMS sensor technology. They have improved noise cancellation performance, good radio frequency performance and electromagnetic interference suppression capabilities. They are widely used in smartphones, wire-controlled headphones, tablets and notebooks and other electronic products.
  • the microphone is overloaded in this sound wave band and causes noise.
  • the size of the noise is related to the power of the ultrasonic transceiver itself, the distance from the mobile phone microphone, and the sensitivity of the microphone in this frequency band.
  • the 48KHz sampling of the codec will filter sounds with frequencies of 24KHz and above, the noise has been generated inside the microphone and extends to low frequencies, causing a pop sound that is small in amplitude but distinct in hearing.
  • the purpose of this utility model is to provide a microphone that can filter out ultrasonic band interference by setting up a low-pass filter circuit.
  • the present utility model provides a microphone, which includes a protection structure with a receiving space and an ASIC chip and a MEMS microphone chip accommodated in the receiving space.
  • the microphone also includes a low-pass filter circuit.
  • the pass filter circuit is connected between the ASIC chip and the MEMS microphone chip, or the low-pass filter circuit is integrated in the ASIC chip, and the high-frequency cutoff frequency of the low-pass filter circuit is greater than 20 KHz.
  • the input end of the low-pass filter circuit serves as the input end of the ASIC chip.
  • the low-pass filter circuit includes an RC circuit.
  • the low-pass filter circuit further includes an operational amplifier circuit connected to the RC circuit.
  • the low-pass filter circuit includes a field effect transistor.
  • the low-pass filter circuit includes a bipolar junction transistor.
  • the low-pass filter circuit includes a diode.
  • the protective structure is provided with a sound hole, and the protective structure includes a circuit board and a shell that is covered with the circuit board to form the receiving space.
  • the microphone of the present invention includes a protective structure with a receiving space and an ASIC chip and a MEMS microphone chip contained in the protective structure.
  • the microphone also includes a low-pass filter circuit.
  • the filter circuit is connected between the ASIC chip and the MEMS microphone chip, or the low-pass filter circuit is integrated in the ASIC chip.
  • the high-frequency cutoff frequency of the low-pass filter circuit is greater than 20KHz, thereby passing the low-pass filter circuit.
  • the function of the pass filter circuit can filter out ultrasonic band interference, reduce noise, and improve audio quality.
  • Figure 1 is a schematic structural diagram of a microphone provided by an embodiment of the present invention.
  • Figure 2 is another structural schematic diagram of a microphone provided by an embodiment of the present utility model
  • Figure 3 is a working frequency waveform diagram of the low-pass filter circuit provided by the embodiment of the present invention.
  • Figure 4 is a waveform diagram showing the sensitivity of the microphone as a function of frequency before and after setting a low-pass filter circuit according to the embodiment of the present invention.
  • the microphone of the present invention includes a protection structure 10 having a receiving space 1A, and an ASIC chip 11 and a MEMS microphone chip 12 accommodated in the receiving space 1A. Furthermore, the protective structure 10 is provided with a sound hole 1B.
  • the protective structure 10 includes a circuit board 101 and a housing 102 that is covered with the circuit board 101 to form the receiving space 1A.
  • the microphone further includes a low-pass filter circuit 13. As shown in FIG. 1, the low-pass filter circuit 13 is connected between the ASIC chip 11 and the MEMS microphone chip 12. Or, as shown in FIG. 2 , the low-pass filter circuit 13 is integrated in the ASIC chip 12 . Further, when the low-pass filter circuit 13 is integrated in the ASIC chip 12 , the low-pass filter circuit 13 is integrated into the ASIC chip 12 . The input terminal of the circuit 13 can be used as the input terminal of the ASIC chip 12 .
  • the high-frequency cutoff frequency of the low-pass filter circuit 13 is greater than 20KHz.
  • the low-pass filter circuit 13 includes an RC circuit.
  • the RC circuit can be a first-order RC filter circuit, that is, a filter circuit composed of a capacitor and a resistor, or the RC circuit can also be a multi-order filter circuit. .
  • the low-pass filter circuit 13 may also include an operational amplifier circuit connected to the RC circuit.
  • the low-pass filter circuit 13 includes a field effect transistor, that is, the low-pass filter circuit 13 uses a field effect transistor to implement the filtering function.
  • the low-pass filter circuit 13 includes a bipolar junction transistor, that is, the low-pass filter circuit 13 uses a bipolar junction transistor to implement the filtering function.
  • the low-pass filter circuit 13 includes a diode, and the low-pass filter circuit 13 uses diodes to implement the filtering function.
  • the low-pass filter circuit 13 is passed through the ASIC chip 11.
  • the function of the filter circuit 13 can filter out ultrasonic band interference, reduce noise, and improve audio quality.
  • picture a in Figure 4 is a waveform diagram of the sensitivity changing with frequency when the microphone is not equipped with a low-pass filter circuit 13
  • picture b is a waveform diagram of the sensitivity changing with frequency after the microphone is equipped with a low-pass filter circuit 13. From From the comparison between pictures a and b, it can be clearly seen that after setting the low-pass filter circuit 13 on the microphone, the ultrasonic frequency band in the sound signal has been greatly eliminated, thereby greatly improving the audio quality.

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)

Abstract

本实用新型提供了一种麦克风，包括具有收容空间的保护结构以及收容于所述收容空间内的ASIC芯片和MEMS麦克风芯片，所述麦克风还包括低通滤波电路，所述低通滤波电路连接在所述ASIC芯片和所述MEMS麦克风芯片之间，或者所述低通滤波电路集成在所述ASIC芯片内，所述低通滤波电路的高频截止频率大于20KHz，由此通过设置低通滤波电路从而可以滤除超声频段干扰，减少杂音，提高音频质量。

Description

麦克风 技术领域
本实用新型涉及电声转换领域，尤其涉及一种麦克风。
 背景技术
MEMS（微型机电系统，Microelectro Mechanical Systems）麦克风是基于MEMS传感器技术制造的麦克风，具有改进的噪声消除性能、良好的射频性能及电磁干扰抑制能力，被广泛应用于智能手机、线控耳机、平板以及笔记本等各类电子产品中。
 技术问题
目前，由于大功率超声波收发器的广泛应用，导致麦克风在该声波频段出现过载引起杂音，杂音的大小与超声波收发器本身的功率大小、距离手机麦克风的距离、麦克风在该频段的灵敏度有关系。相关技术中虽然编码译码器的48KHz采样会过滤24KHz及以上的频率的声音，但是该杂音已经在麦克风内部产生并延伸到低频，从而引起幅值虽小但是听感明显的pop音。
 技术解决方案
本实用新型的目的在于提供一种麦克风，通过设置低通滤波电路从而可以滤除超声频段干扰。
为了达到上述目的，本实用新型提供了一种麦克风，包括具有收容空间的保护结构以及收容于所述收容空间内的ASIC芯片和MEMS麦克风芯片，所述麦克风还包括低通滤波电路，所述低通滤波电路连接在所述ASIC芯片和所述MEMS麦克风芯片之间，或者所述低通滤波电路集成在所述ASIC芯片内，所述低通滤波电路的高频截止频率大于20KHz。
更进一步地，当所述低通滤波电路集成在所述ASIC芯片时，所述低通滤波电路的输入端作为所述ASIC芯片的输入端。
更进一步地，所述低通滤波电路包括RC电路。
更进一步地，所述低通滤波电路还包括与所述RC电路连接的运算放大电路。
更进一步地，所述低通滤波电路包括场效应管。
更进一步地，所述低通滤波电路包括双极结型晶体管。
更进一步地，所述低通滤波电路包括二极管。
更进一步地，所述保护结构上贯穿设有声孔，所述保护结构包括线路板以及与所述线路板盖接形成所述收容空间的外壳。
 有益效果
与相关技术相比，本实用新型的麦克风，包括具有收容空间的保护结构以及收容于所述保护结构内的ASIC芯片和MEMS麦克风芯片，其中所述麦克风还包括低通滤波电路，所述低通滤波电路连接在所述ASIC芯片和所述MEMS麦克风芯片之间，或者所述低通滤波电路集成在所述ASIC芯片内，所述低通滤波电路的高频截止频率大于20KHz，由此通过低通滤波电路的作用可以滤除超声频段干扰，减少杂音，提高音频质量。
 附图说明
为了更清楚地说明本实用新型实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本实用新型的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其它的附图，其中：
图1为本实用新型实施例提供的麦克风的一结构示意图；
图2为本实用新型实施例提供的麦克风的另一结构示意图；
图3为本实用新型实施例提供的低通滤波电路的工作频率波形图；
图4为本实用新型实施例提供的麦克风在设置低通滤波电路之前和之后灵敏度随频率变化的波形图。
 本发明的最佳实施方式
下面将结合本实用新型实施例中的附图，对本实用新型实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅是本实用新型的一部分实施例，而不是全部的实施例。基于本实用新型中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其它实施例，都属于本实用新型保护的范围。
请参阅图1，本实用新型的麦克风包括具有收容空间1A的保护结构10以及收容于所述收容空间1A内的ASIC芯片11和MEMS麦克风芯片12。进一步地，所述保护结构10上贯穿设有声孔1B，所述保护结构10包括线路板101以及与所述线路板101盖接形成所述收容空间1A的外壳102。
其中，所述麦克风还包括低通滤波电路13，如图1所示，所述低通滤波电路13连接在所述ASIC芯片11和所述MEMS麦克风芯片12之间。或者，如图2所示，所述低通滤波电路13集成在所述ASIC芯片12内，进一步地，当所述低通滤波电路13集成在所述ASIC芯片12内时，所述低通滤波电路13的输入端可以作为所述ASIC芯片12的输入端。
其中，如图3所示，低通滤波电路13的高频截止频率大于20KHz。
在一些实施例中，所述低通滤波电路13包括RC电路，例如RC电路可以为一阶RC滤波电路，即采用一个电容器和一个电阻构成的滤波电路，或者RC电路也可以是多阶滤波电路。
进一步地，所述低通滤波电路13还可以包括与所述RC电路连接的运算放大电路。
在另一些实施例中，所述低通滤波电路13包括场效应管，即所述低通滤波电路13采用场效应管来实现滤波功能。
又或者，在另一些实施例中，所述低通滤波电路13包括双极结型晶体管，即所述低通滤波电路13采用双极结型晶体管来实现滤波功能。
又或者，在另一些实施例中，所述低通滤波电路13包括二极管，所述低通滤波电路13采用二极管来实现滤波功能。
本实用新型的实施例中，通过在所述ASIC芯片11和所述MEMS麦克风芯片12之间设置低通滤波电路13或者在所述ASIC芯片11内集成低通滤波电路13，由此通过低通滤波电路13的作用可以滤除超声频段干扰，减少杂音，提高音频质量。如图4所示，图4中的a图为麦克风未设置低通滤波电路13时灵敏度随频率变化的波形图，b图为麦克风设置低通滤波电路13后灵敏度随频率变化的波形图，从a图和b图的对比可以明显看出，麦克风在设置低通滤波电路13后声音信号中的超声频段已经大大被消除，从而极大提高音频质量。
以上所述的仅是本实用新型的实施方式，在此应当指出，对于本领域的普通技术人员来说，在不脱离本实用新型创造构思的前提下，还可以做出改进，但这些均属于本实用新型的保护范围。

Claims (8)

  1. 一种麦克风，包括具有收容空间的保护结构以及收容于所述收容空间内的ASIC芯片和MEMS麦克风芯片，其特征在于，所述麦克风还包括低通滤波电路，所述低通滤波电路连接在所述ASIC芯片和所述MEMS麦克风芯片之间，或者所述低通滤波电路集成在所述ASIC芯片内，所述低通滤波电路的高频截止频率大于20KHz。
  2. 根据权利要求1所述的麦克风，其特征在于，当所述低通滤波电路集成在所述ASIC芯片时，所述低通滤波电路的输入端作为所述ASIC芯片的输入端。
  3. 根据权利要求1所述的麦克风，其特征在于，所述低通滤波电路包括RC电路。
  4. 根据权利要求3所述的麦克风，其特征在于，所述低通滤波电路还包括与所述RC电路连接的运算放大电路。
  5. 根据权利要求1所述的麦克风，其特征在于，所述低通滤波电路包括场效应管。
  6. 根据权利要求1所述的麦克风，其特征在于，所述低通滤波电路包括双极结型晶体管。
  7. 根据权利要求1所述的麦克风，其特征在于，所述低通滤波电路包括二极管。
  8. 根据权利要求1所述的麦克风，其特征在于，所述保护结构上贯穿设有声孔，所述保护结构包括线路板以及与所述线路板盖接形成所述收容空间的外壳。
PCT/CN2022/094172 2022-04-20 2022-05-20 麦克风 Ceased WO2023201828A1 (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2022578984A JP7662674B2 (ja) 2022-04-20 2022-05-20 マイクロフォン
US17/994,024 US12503359B2 (en) 2022-04-20 2022-11-25 Microphone

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Application Number Priority Date Filing Date Title
CN202220932908.6U CN217335885U (zh) 2022-04-20 2022-04-20 麦克风
CN202220932908.6 2022-04-20

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN203368756U (zh) * 2013-07-27 2013-12-25 歌尔声学股份有限公司 微型麦克风
CN106658303A (zh) * 2016-12-01 2017-05-10 北京卓锐微技术有限公司 麦克风系统和放大电路
CN112573475A (zh) * 2019-09-30 2021-03-30 意法半导体股份有限公司 防水按钮设备、包括按钮设备的输入设备以及电子装置
CN215647354U (zh) * 2021-06-09 2022-01-25 西安艾科特声学科技有限公司 一种用于有源噪声控制系统的mems误差传声器
US11290810B1 (en) * 2021-01-26 2022-03-29 Invensense, Inc. Microphone MEMS diaphragm and self-test thereof

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN203368756U (zh) * 2013-07-27 2013-12-25 歌尔声学股份有限公司 微型麦克风
CN106658303A (zh) * 2016-12-01 2017-05-10 北京卓锐微技术有限公司 麦克风系统和放大电路
CN112573475A (zh) * 2019-09-30 2021-03-30 意法半导体股份有限公司 防水按钮设备、包括按钮设备的输入设备以及电子装置
US11290810B1 (en) * 2021-01-26 2022-03-29 Invensense, Inc. Microphone MEMS diaphragm and self-test thereof
CN215647354U (zh) * 2021-06-09 2022-01-25 西安艾科特声学科技有限公司 一种用于有源噪声控制系统的mems误差传声器

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