WO2023200168A1

WO2023200168A1 - Light module including multiple light sources

Info

Publication number: WO2023200168A1
Application number: PCT/KR2023/004510
Authority: WO
Inventors: 김동현; 함헌주; 이용경
Original assignee: 하나옵트로닉스 주식회사
Priority date: 2022-04-12
Filing date: 2023-04-04
Publication date: 2023-10-19
Also published as: KR20230146196A

Abstract

Disclosed is a light module including multiple light sources. An aspect of the present embodiment provides a light module including: a printed circuit board; a driver chip disposed on the printed circuit board; an interposer substrate disposed on the driver chip; a first light source which is disposed on the interposer substrate and emits light vertically upward; a second light source which is disposed on the printed circuit board to be spaced a predetermined distance from the driver chip and emits light vertically upward; and a dispersion part disposed on a light path of light emitted from each of the light sources to disperse the light emitted from each of the light sources.

Description

Optical module containing multiple light sources

The present invention relates to an optical module including a plurality of light sources.

The content described in this part simply provides background information on an embodiment of the present invention and does not constitute prior art.

Research on 3D cameras, motion capture sensors, or laser radar that can obtain distance information to a subject has recently been increasing. In particular, the importance of 3D content is emerging along with the development and increasing demand for 3D display devices that can display images with a sense of depth.

(Depth) information about the distance between the surfaces of the subject and the 3D image acquisition device can be obtained using binocular stereo vision using two cameras or triangulation using structured light and cameras. It can be obtained using . However, in this method, the accuracy of depth information decreases rapidly as the distance to the subject increases, and it is dependent on the surface condition of the subject, so it may be difficult to obtain precise depth information.

Meanwhile, Time-of-Flight (ToF) has recently been introduced in depth image acquisition devices. ToF technology is a method of measuring the light flight time from when illumination light is irradiated to a subject until the light reflected from the subject is received by the light receiver. According to ToF technology, light of a specific wavelength (for example, near-infrared rays of 850 nm) is projected onto the subject using an illumination optical system including a light-emitting diode (LED) or laser diode (LD). ToF technology receives light of the same wavelength reflected from the subject at the light receiver and then goes through a series of processing processes to extract depth information, such as modulating the received light with an optical shutter. Various ToF technologies are being developed according to this series of light processing processes.

A ToF sensor usually senses a subject including a plurality of light sources. The ToF sensor includes a light source that can secure a wide FOI (Field of Illumination) and a light source that outputs light of relatively strong intensity to increase the measurement distance. ToF sensors include multiple light sources to improve sensing rates.

The ToF sensor includes a driver chip to control the operation of a plurality of light sources. At this time, due to electrical effects such as electric fields generated from the driver chip, the driver chip and each light source have been placed spaced apart from each other in a conventional ToF sensor. However, because the driver chip and the light source are arranged spaced apart from each other within the ToF sensor, miniaturization of the conventional ToF sensor was difficult.

One embodiment of the present invention aims to provide an optical module that includes a plurality of light sources and has reduced size while maintaining performance.

According to one aspect of the present invention, a printed circuit board, a driver chip disposed on the printed circuit board, an interposer substrate disposed on the driver chip, and a device disposed on the interposer substrate to radiate light vertically upward. 1 a light source and a second light source disposed on the printed circuit board at a preset distance from the driver chip and irradiating light vertically upward; and a second light source disposed on the optical path irradiated by each light source to emit light irradiated from each light source. An optical module comprising a dispersion unit for dispersion is provided.

According to one aspect of the present invention, the interposer substrate has a preset height.

According to one aspect of the present invention, one of the first light source and the second light source has a relatively wide Field of Illumination (FOI).

According to one aspect of the present invention, the other one of the first and second light sources is characterized in that the measurement distance is improved by outputting light of relatively strong intensity.

According to one aspect of the present invention, the dispersion unit is implemented as a micro lens array (MLA) or diffractive optical elements (DOE).

According to one aspect of the present invention, the first light source and the second light source are disposed away from the driver chip within a preset range in order to minimize the electrical influence of the driver chip.

According to one aspect of the present invention, the first light source is disposed at a predetermined distance or more to prevent interference between lights emitted from the second light source.

According to one aspect of the present invention, a printed circuit board, a driver chip disposed on the printed circuit board, an interposer substrate disposed on the driver chip, and a device disposed on the interposer substrate to radiate light vertically upward. 1 a light source and a second light source disposed on the printed circuit board at a preset distance from the driver chip and irradiating light vertically upward; and a second light source disposed on the optical path emitted by each light source to emit light emitted from each light source. Characterized by comprising a dispersion unit for dispersing and an optical element disposed between the second light source and the dispersion unit on the light path emitted by the second light source, and allowing the light irradiated from the second light source to completely enter the dispersion unit. Provides an optical module that

According to one aspect of the present invention, the optical element is a collimator or a lens having a preset refractive index.

According to one aspect of the present invention, the optical element is characterized by being implemented as a micro lens array (MLA) or diffractive optical elements (DOE).

According to one aspect of the present invention, the optical element is characterized by being implemented as a double-sided micro lens array (Double Sided MLA) or a double-sided diffractive optical element (Double Sided DOE).

According to one aspect of the present invention, the optical element is characterized by being implemented in a plurality of configurations.

According to one aspect of the present invention, a printed circuit board, a driver chip disposed on the printed circuit board, an interposer substrate disposed on the driver chip, and a device disposed on the interposer substrate to radiate light vertically upward. 1 a light source and a second light source disposed on the printed circuit board at a preset distance from the driver chip and irradiating light vertically upward; and a second light source disposed on the optical path emitted by each light source to emit light emitted from each light source. It includes a dispersing part for dispersing, a first electrode disposed on the first light source, and a second electrode disposed in or on the interposer substrate, wherein the first electrode and the second electrode are configured to print An optical module is provided that is electrically connected to a circuit board.

According to one aspect of the present invention, a printed circuit board, a driver chip disposed on the printed circuit board, an interposer substrate disposed on the driver chip, and a device disposed on the interposer substrate to radiate light vertically upward. 1 a light source and a second light source disposed on the printed circuit board at a preset distance from the driver chip and irradiating light vertically upward; and a second light source disposed on the optical path emitted by each light source to emit light emitted from each light source. It includes a dispersing part for dispersing, a first electrode disposed on the first light source, a second electrode disposed on the interposer substrate, and a third electrode disposed in the interposer substrate, wherein the first electrode is the first electrode. An optical module is provided that is electrically connected to the printed circuit board through two electrodes, and the third electrode is electrically connected to the printed circuit board.

According to one aspect of the present invention, a printed circuit board, a driver chip disposed on the printed circuit board, an interposer substrate disposed on the driver chip, and a device disposed on the interposer substrate to radiate light vertically upward. 1 a light source and a second light source disposed on the printed circuit board at a preset distance from the driver chip and irradiating light vertically upward; and a second light source disposed on the optical path emitted by each light source to emit light emitted from each light source. It includes a dispersing part for dispersing, a first electrode disposed on the first light source, a second electrode disposed in or on the interposer substrate, and an additional interposer substrate disposed on the printed circuit board; , the additional interposer substrate is electrically connected to the printed circuit board at one end, and is electrically connected to the first electrode and the second electrode at the other end.

According to one aspect of the present invention, a printed circuit board, a driver chip disposed on the printed circuit board, an interposer substrate disposed on the driver chip, and a device disposed on the interposer substrate to radiate light vertically upward. 1 a light source and a second light source disposed on the printed circuit board at a preset distance from the driver chip and irradiating light vertically upward; and a second light source disposed on the optical path emitted by each light source to emit light emitted from each light source. It includes a dispersing part for dispersing, a first electrode disposed on the first light source, and a second electrode disposed in or on the interposer substrate, wherein the first electrode and the second electrode are connected to the interposer substrate. An optical module is provided that is electrically connected to the printed circuit board through a through silicon via (TSV) formed in the poser substrate and the driver chip.

As described above, according to one aspect of the present invention, there is an advantage in that it can be miniaturized compared to a conventional optical module while maintaining performance by including a plurality of light sources.

1 is a diagram illustrating an optical module according to an embodiment of the present invention.

Figure 2 is an internal structural diagram of an optical module according to an embodiment of the present invention.

Figure 3 is an internal plan view of an optical module according to an embodiment of the present invention.

4 to 8 are diagrams showing implementation examples of optical devices according to an embodiment of the present invention.

9 to 14 are diagrams illustrating an example of electrical connection between a driver chip, an interposer substrate, and a first light source according to an embodiment of the present invention.

15 and 16 are diagrams showing an example of an electrical connection between a printed circuit board and a second light source according to an embodiment of the present invention.

Since the present invention can make various changes and have various embodiments, specific embodiments will be illustrated in the drawings and described in detail. However, this is not intended to limit the present invention to specific embodiments, and should be understood to include all changes, equivalents, and substitutes included in the spirit and technical scope of the present invention. While describing each drawing, similar reference numerals are used for similar components.

Terms such as first, second, A, and B may be used to describe various components, but the components should not be limited by the terms. The above terms are used only for the purpose of distinguishing one component from another. For example, a first component may be named a second component, and similarly, the second component may also be named a first component without departing from the scope of the present invention. The term and/or includes any of a plurality of related stated items or a combination of a plurality of related stated items.

When a component is said to be "connected" or "connected" to another component, it is understood that it may be directly connected to or connected to the other component, but that other components may exist in between. It should be. On the other hand, when it is mentioned that a component is “directly connected” or “directly connected” to another component, it should be understood that there are no other components in between.

The terms used in this application are only used to describe specific embodiments and are not intended to limit the invention. Singular expressions include plural expressions unless the context clearly dictates otherwise. In this application, terms such as "include" or "have" should be understood as not precluding the existence or addition possibility of features, numbers, steps, operations, components, parts, or combinations thereof described in the specification. .

Unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as generally understood by a person of ordinary skill in the technical field to which the present invention pertains.

Terms defined in commonly used dictionaries should be interpreted as having a meaning consistent with the meaning in the context of the related technology, and unless explicitly defined in the present application, should not be interpreted in an ideal or excessively formal sense. No.

Additionally, each configuration, process, process, or method included in each embodiment of the present invention may be shared within the scope of not being technically contradictory to each other.

FIG. 1 is a diagram showing an optical module according to an embodiment of the present invention, and FIG. 2 is a diagram showing the internal structure of the optical module according to an embodiment of the present invention.

The optical module 100 is included in a ToF camera or sensor that recognizes a subject located in front of the optical module 100 or projects an image of the subject. The optical module 100 radiates light to the front so that it or another receiving module can receive reflected light reflected from a subject, etc. The optical module 100 includes a plurality of light sources so that it can irradiate light over a long distance and at the same time over a wide range. At this time, a plurality of light sources and drivers for controlling the light sources may occupy a large space, which acts as a limitation in miniaturizing the optical module 100. Accordingly, components within the optical module 100 are arranged as shown in FIG. 2.

Referring to FIG. 2, the optical module 100 according to an embodiment of the present invention includes a first light source 210, a second light source 215, an interposer substrate 220, a driver chip 230, and a dispersion unit ( 240, 245), an optical element 250, and a printed circuit board 260.

The first light source 210 and the second light source 215 are disposed on the interposer board 220 and the printed circuit board 260, respectively, and radiate light vertically upward.

The first light source 210 and the second light source 215 radiate light vertically upward. For example, the first light source 210 and the second light source 215 may be implemented as VCSELs to irradiate light vertically upward. However, so that the optical module 100 can irradiate light in a wide range (FOI: Field of Illumination), either the first light source 210 or the second light source 215 emits light in a wider range than the irradiation intensity of light. investigate. The other module irradiates light with a relatively strong intensity so that the optical module can irradiate light over a long distance within a certain range. In FIG. 1, the first light source 210 is shown as a light source that irradiates light in a wide range, and the second light source 215 is shown as a light source that irradiates light with a strong intensity. However, this is only an example and is not necessarily limited thereto.

The first light source 210 and the second light source 215 are arranged to be spaced apart from the driver chip 230 by a predetermined distance or more. Since the driver chip 230 is a device that operates at high current and high frequency, other devices may be affected by the electrical characteristics of the driver chip 230 if they are not separated by a certain distance or more. In the case of a light source, the waveform of the irradiated light varies depending on the electrical characteristics of the driver chip 230, which may affect the measurement of the irradiated distance. Accordingly, the first light source 210 is located on the driver chip 230, and the interposer substrate 220 is located between them. The first light source 210 is positioned apart from the driver chip 230 by the height T _I of the interposer substrate. Additionally, the second light source 215 is positioned at a certain distance (L _DV ) away from the driver chip 230 on the printed circuit board 260.

The first light source 210 and the second light source 215 are arranged to be spaced apart from each other by a predetermined distance or more. Each

light source

210, 215 emits light with a constant divergence angle. At this time, if the two

light sources

210 and 215 are not positioned at a certain interval, interference may occur between the lights output from the light sources, or the light may not be accurately irradiated to the dispersion unit located above the light sources. Accordingly, the optical module 100 cannot accurately irradiate the desired type of light to the subject. The first light source 210 and the second light source 215 must also be placed at a certain distance apart.

However, if each light source, especially the second light source 215, is too far away from the driver chip 230, it is difficult for the second light source 215 to operate smoothly due to electrical delay. Accordingly, the distance between the second light source 215 and the driver chip 230 must satisfy the following.

(T _I +T _D )*tan(θ/2) < L _DV < 2*(T _I +T _D )

Here, θ/2 is the divergence angle of the light emitted by the (first) light source, and the distance between the second light source 215 and the driver chip 230 is narrower than (T _I +T _D )*tan(θ/2). In this case, each light emitted from the second light source 215 and the first light source 210 is contained within each other's light divergence angle, or the light emitted from the second light source 215 is emitted from the driver chip 230 or the interposer substrate ( 220) and interference occurs. In addition, since each light source (especially the relatively distant second light source) should not be placed too far away from the driver chip, the distance between the second light source 215 and the driver chip 230 is the distance between the first light source 210 and the driver chip. It must be within twice the distance between chips 230. Therefore, the distance between the second light source 215 and the driver chip 230 must satisfy the above-mentioned formula.

The interposer substrate 220 is disposed between the first light source 210 and the driver chip 230 to maintain a gap between the first light source 210 and the driver chip 230. As mentioned above, the light source should not be located too close to the driver chip. However, if the first light source 210 is also placed separately from the driver chip 230 and the printed circuit board 260, miniaturization of the optical module 100 becomes difficult. Accordingly, the interposer substrate 220 having a preset height is disposed on the driver chip 230, and the first light source 210 is disposed on the interposer substrate 220, thereby miniaturizing the optical module 100 and At the same time, the distance between the first light source 210 and the driver chip 230 can be maintained at a preset height.

Additionally, by disposing the interposer substrate 220, the distance between the second light source and the driver chip 230 may be relatively reduced. As mentioned above, light sources must be placed at least a certain distance apart. At this time, as the first light source 210 is disposed on the driver chip 230 and the interposer substrate 220, the distance between the second light source and the driver chip 230 is determined by the distance between all elements disposed on the printed circuit board 260. The interval can be reduced by (D ₁ -D ₂ )*tan(θ/2). Here, D ₁ refers to the distance between the second light source 215 and the dispersion unit 245, and D ₂ refers to the distance between the first light source 210 and the dispersion unit 240. By using the interposer substrate 220, the gap can be reduced by the above-mentioned formula, so that the optical module 100 can be made smaller than the conventional one.

The driver chip 230 is disposed on the printed circuit board 260 and controls the operation of each

light source

210 and 215. The driver chip 230 is electrically connected to the interposer substrate 220, the first light source 210, and the second light source 215 in various ways to control the operation of each

light source

210 and 215. The electrical connection method will be described later with reference to FIGS. 9 to 14.

The dispersing

units

240 and 245 change the form of light emitted from the light source. For example, the dispersion unit 240 may be implemented as an element that changes the shape of incident light, such as a micro lens array (MLA) or diffractive optical elements (DOE). The

dispersion units

240 and 245 are disposed in front of the light path emitted from the light source and change the shape or path of the light emitted from the light source.

There is no particular limitation on the area of the dispersion part disposed on the path of the light source that needs to irradiate light with high intensity. Since light must be irradiated with strong intensity within a certain area, optical elements are usually placed on the optical path (between the light source and the dispersion unit) to adjust the shape of the light. However, since the dispersion unit disposed on the path of the light source that needs to irradiate light in a wide range must fully receive and adjust the light emitted from the light source, the driving area (Active) for changing the optical path of the dispersion unit 240 There are restrictions on area. If the diameter in one direction within the driving area of the dispersion unit 240 is L _F , L _F must satisfy the following.

2D ₂ *tan(θ/2)+L ₂ < L _F <3D ₁ *tan(θ/2)+L ₂

Here, L ₂ means the diameter in one direction (in the same direction as L _F ) within the active area of the first light source 210. Since the dispersion unit 240 must cover the entire area of the light emitted from the first light source 210, the diameter of the driving area of the first light source and the length over which the light is dispersed (2D ₂ *tan(θ/2)) It must have a length greater than the sum. However, if it is too large, it may affect not only the first light source 210 but also the light emitted from the second light source 215, so the diameter of the driving area of the first light source and the light emitted from the second light source 215 It must have a length smaller than the sum of these distributed lengths (3D ₁ *tan(θ/2)). By having this length, the dispersion unit 240 changes the shape of all light emitted from the first light source 210, and at the same time does not have an excessively large area and does not affect the shape of light emitted from the second light source 215. It may not be possible.

The optical element 250 is disposed between the second light source 215 and the dispersion unit 245 on the light path emitted from the second light source 215, so that the light emitted from the second light source 215 is transmitted to the dispersion unit ( 245) to allow complete entry. The optical element 250 is mainly disposed on the optical path of a light source that irradiates light with a relatively strong intensity, thereby preventing excessive dispersion of light. By arranging the optical element 250 in this way, it is possible to prevent excessive dispersion from being completely incident on the dispersion portion, and also prevent the intensity of light from being weakened due to excessive dispersion. The optical element 250 may be implemented as various elements.

As mentioned with reference to FIG. 2, the

light sources

210 and 215 are maintained at a certain distance or more, and the

light sources

210 and 215 and the driver chip 230 are maintained at a certain distance or more, while the optical module 100 ) can be confirmed to be miniaturized.

As shown in FIG. 2, the optical element 250 is implemented as a collimator or a lens with a constant refractive index, and can form parallel light or adjust the degree of dispersion.

As shown in FIG. 4, the optical element 410 is the same element as the dispersion unit 245, such as a micro lens array (MLA: Micro Lens Array) or a diffractive optical element (DOE: Diffractive Optical Elements) that changes the form of incident light. Implemented as a changeable element, the form of irradiated light can be adjusted to an appropriate form for incident on the dispersion unit 245.

The optical element 510 is not necessarily disposed alone, but as shown in FIG. 5, a plurality of

optical elements

510a, 510b, and 510c are disposed so that the degree of dispersion can be adjusted.

The optical element is not necessarily independently disposed between the light source 215 and the dispersion unit 245, and may be implemented as one element with the dispersion unit 245, as shown in FIG. 6. The optical element 610 may be implemented as a single element including a structure that changes the shape of light on both sides, such as a double-sided micro lens array (Double Sided MLA) or a double-sided diffractive optical element (Double Sided DOE).

As shown in FIG. 7, an optical element including a structure that changes the form of light on both sides, and an additional collimator or lens 250 may be disposed between the light source 215 and the dispersion unit 245. there is.

Meanwhile, as shown in FIG. 8, the light source 215 may be of a type that irradiates light backwards, and the optical element 810 changes the form of light incident in a direction opposite to the direction of light irradiation. By placing the optical element 810 directly on the light source 215, the number of elements used to change the form of light emitted from the light source can be reduced.

Referring to FIG. 9,

electrodes

920 and 924 are formed on the first light source 210 and the interposer substrate 220, respectively. Each

electrode

920 and 924 is directly electrically connected to the

electrodes

922 and 926 within the printed circuit board 260 through a wire, etc. Meanwhile, the driver chip 230 is electrically connected to the printed circuit board 260 by flip-chip bonding 910 with the printed circuit board 260. According to this structure, the first light source 210, the interposer substrate 220, and the driver chip 230 may be electrically connected.

Referring to FIG. 10, an electrode 1010 is formed on the first light source 210, and an electrode 1014 is formed within the interposer substrate 220. The electrode 1014 is directly electrically connected to the electrode 926 in the printed circuit board 260 through a wire, etc. However, since the electrode 1010 formed on the first light source 210 is quite far from the electrode 922 in the printed circuit board 260, an additional electrode 1012 will be placed on the interposer board 220. You can. The electrode 1010 may be connected to the electrode 922 in the printed circuit board 260 via an additional electrode 1012 and a wire. Meanwhile, the driver chip 230 is electrically connected to the printed circuit board 260 by flip-chip bonding 910 with the printed circuit board 260.

Referring to FIG. 11, as in FIG. 10, an electrode 1010 is placed on the first light source 210, an additional electrode 1012 is placed on the interposer substrate 220, and an electrode 1014 is placed within the interposer substrate 220. ) may be formed, however, the

electrodes

1012 and 1014 are not directly connected to the electrodes and wires in the printed circuit board 220, but an additional interposer substrate ( 1110) is deployed.

Electrodes

1120 and 1125 for direct connection with electrodes in the printed circuit board 220 are disposed within the additional interposer board 1110. The

electrodes

1120 and 1125 in the additional interposer board 1110 are directly connected to the electrodes in the printed circuit board 220 at one end, and are electrically connected to the additional electrode 1012 and the electrode 1014 and wires at the other end. It is connected to As the additional interposer substrate 1110 including electrodes is disposed therein, the electrical connection length between electrodes can be significantly reduced. In FIG. 11, an additional electrode 1012 is shown disposed on the interposer substrate 220, but it is not necessarily limited to this and can be electrically connected directly from the electrode 1010 to the electrode 1120 without the additional electrode 1012. You can. Meanwhile, the driver chip 230 is electrically connected to the printed circuit board 260 by flip-chip bonding 910 with the printed circuit board 260.

Referring to FIG. 12, as shown in FIG. 11, it includes

electrodes

1010 and 1014, an additional electrode 1012, and an additional interposer substrate 1110, but each electrode is not electrically connected with a wire or the like. , a connection interposer substrate 1210 connecting the additional electrode 1012 and the

electrodes

1014, 1120, and 1125 is disposed. The interposer substrate 1210 replaces connecting means such as wires by electrically connecting the additional electrode 1012 and the

electrodes

1014, 1120, and 1125. Meanwhile, the driver chip 230 is electrically connected to the printed circuit board 260 by flip-chip bonding 910 with the printed circuit board 260.

Referring to FIG. 13, an electrode 1010 is formed on the first light source 210, and an additional electrode 1012 is formed on the interposer substrate 220. Meanwhile, through silicon vias (TSVs) 1310, 1315, 1320, and 1325 may be formed in the interposer substrate 220 and the driver chip 230. Each electrode is not connected to the outside through a separate connection means, but is directly connected to the printed circuit board 260 through the silicon through

electrodes

1310, 1315, 1320, and 1325 in the interposer board 220 and the driver chip 230. can be electrically connected to. Meanwhile, the driver chip 230 is electrically connected to the printed circuit board 260 by flip-chip bonding 910 with the printed circuit board 260.

Referring to FIG. 14, an electrode 1010 may be formed on the first light source 210, an additional electrode 1012 may be formed on the interposer substrate 220, and an electrode 1410 may be formed on the driver chip 230. . As shown in FIG. 13, through-

silicon electrodes

1310 and 1315 are formed within the interposer substrate 220, but through-silicon electrodes are not formed within the driver chip 230. However, the interposer substrate 220, particularly the through-

silicon electrodes

1310 and 1315, and the driver chip 230 are electrically connected through flip chip bonding 1410. Accordingly, each

electrode

1010 and 1012 is electrically connected to the driver chip 230, and the electrode 1410 on the driver chip 230 is connected to the electrode 926 in the printed circuit board 260 and a connecting means such as a wire. It is connected to

As shown in FIG. 15, the printed circuit board 260 and the second light source 215 include

electrodes

1510 and 1520, respectively, and each electrode may be electrically connected by a connecting means such as a wire.

Additionally, as shown in FIG. 16, the printed circuit board 260 and the second light source 215 may be electrically connected by flip chip bonding 1610.

As such, the first light source 210, the second light source 215, the interposer substrate 220, and the driver chip 230 may be connected in various embodiments. However, it is not necessarily limited to this, and each component may be electrically connected by various methods in addition to the methods described above.

The above description is merely an illustrative explanation of the technical idea of the present embodiment, and those skilled in the art will be able to make various modifications and variations without departing from the essential characteristics of the present embodiment. Accordingly, the present embodiments are not intended to limit the technical idea of the present embodiment, but rather to explain it, and the scope of the technical idea of the present embodiment is not limited by these examples. The scope of protection of this embodiment should be interpreted in accordance with the claims below, and all technical ideas within the equivalent scope should be interpreted as being included in the scope of rights of this embodiment.

CROSS-REFERENCE TO RELATED APPLICATION

This patent application claims priority pursuant to Article 119(a) of the U.S. Patent Act (35 U.S.C. § 119(a)) to Patent Application No. 10-2022-0044866 filed in Korea on April 12, 2022. All contents are hereby incorporated by reference into this patent application. In addition, if this patent application claims priority for a country other than the United States for the same reasons as above, the entire contents thereof will be incorporated into this patent application by reference.

Claims

printed circuit board;

a driver chip disposed on the printed circuit board;

an interposer substrate disposed on the driver chip;

a first light source disposed on the interposer substrate and irradiating light vertically upward;

a second light source disposed on the printed circuit board at a preset distance from the driver chip and emitting light vertically upward; and

A dispersion unit disposed on the optical path emitted by each light source to disperse the light emitted from each light source.

An optical module comprising:
According to paragraph 1,

The interposer substrate is,

An optical module characterized by having a preset height.
According to paragraph 1,

Any one of the first light source and the second light source,

An optical module characterized by having a relatively wide FOI (Field of Illumination).
According to paragraph 3,

The other one of the first and second light sources is,

An optical module that improves the measurement distance by outputting light of relatively strong intensity.
According to paragraph 1,

The dispersion unit,

An optical module characterized by being implemented as a micro lens array (MLA: Micro Lens Array) or diffractive optical elements (DOE: Diffractive Optical Elements).
According to paragraph 1,

The first light source and the second light source,

An optical module disposed away from the driver chip within a preset range in order to minimize the electrical influence of the driver chip.
According to paragraph 1,

The first light source is,

An optical module, characterized in that it is placed at a distance of more than a preset distance to prevent interference between lights emitted from the second light source.
printed circuit board;

a driver chip disposed on the printed circuit board;

an interposer substrate disposed on the driver chip;

a first light source disposed on the interposer substrate and irradiating light vertically upward;

a second light source disposed on the printed circuit board at a preset distance from the driver chip and emitting light vertically upward;

a dispersion unit disposed on the optical path emitted by each light source and dispersing the light emitted from each light source; and

An optical element disposed between the second light source and the dispersion unit on the optical path emitted by the second light source, and allowing the light emitted from the second light source to completely enter the dispersion unit.

An optical module comprising:
According to clause 8,

The optical element is,

An optical module characterized in that it is a collimator or a lens with a preset refractive index.
According to clause 8,

The optical element is,

An optical module characterized by being implemented as a micro lens array (MLA: Micro Lens Array) or diffractive optical elements (DOE: Diffractive Optical Elements).
According to clause 8,

The optical element is,

An optical module characterized by being implemented as a double-sided micro lens array (Double Sided MLA) or a double-sided diffractive optical element (Double Sided DOE).
According to clause 8,

The optical element is,

An optical module characterized by being implemented in a plurality of configurations.
printed circuit board;

a driver chip disposed on the printed circuit board;

an interposer substrate disposed on the driver chip;

a first light source disposed on the interposer substrate and irradiating light vertically upward;

a second light source disposed on the printed circuit board at a preset distance from the driver chip and emitting light vertically upward;

a dispersion unit disposed on the optical path emitted by each light source and dispersing the light emitted from each light source;

a first electrode disposed on the first light source; and

It includes a second electrode disposed in or on the interposer substrate,

The first electrode and the second electrode are electrically connected to the printed circuit board.
According to clause 13,

Further comprising a third electrode disposed within the interposer substrate,

The first electrode is electrically connected to the printed circuit board via the second electrode, and the third electrode is electrically connected to the printed circuit board.
According to clause 13,

It further includes an additional interposer board disposed on the printed circuit board,

The additional interposer substrate is electrically connected to the printed circuit board at one end, and is electrically connected to the first electrode and the second electrode at the other end.
According to clause 13,

The first electrode and the second electrode are,

An optical module, characterized in that it is electrically connected to the printed circuit board through a through silicon via (TSV) formed in the interposer substrate and the driver chip.