WO2023198992A1 - Process for manufacturing interlocked electronic modules by additive manufacturing - Google Patents

Process for manufacturing interlocked electronic modules by additive manufacturing Download PDF

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Publication number
WO2023198992A1
WO2023198992A1 PCT/FR2023/050527 FR2023050527W WO2023198992A1 WO 2023198992 A1 WO2023198992 A1 WO 2023198992A1 FR 2023050527 W FR2023050527 W FR 2023050527W WO 2023198992 A1 WO2023198992 A1 WO 2023198992A1
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WO
WIPO (PCT)
Prior art keywords
card
manufacturing
electronic
cards
electrically conductive
Prior art date
Application number
PCT/FR2023/050527
Other languages
French (fr)
Inventor
Alexandre VERHAEGHE
Sabri Janfaoui
Didier Pohl
Original Assignee
Safran
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Filing date
Publication date
Application filed by Safran filed Critical Safran
Publication of WO2023198992A1 publication Critical patent/WO2023198992A1/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/0257—Nanoparticles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09563—Metal filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/096—Vertically aligned vias, holes or stacked vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10363—Jumpers, i.e. non-printed cross-over connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/061—Lamination of previously made multilayered subassemblies
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions

Definitions

  • the present invention relates to the general field of manufacturing by additive printing of electronic circuits, and more particularly to the additive manufacturing of elementary electronic cards and nested electronic modules.
  • More and more electronic cards are manufactured by additive manufacturing processes, in order to obtain circuits of different shapes, flexible circuits, and/or portable circuits.
  • card thicknesses are limited by these processes to a few millimeters (3 mm).
  • the cards can be stacked on top of each other.
  • Header-type connectors are soldered between the boards to electrically connect the boards together to share a power supply and/or transmit digital or analog signals between them.
  • this type of connector is generally bulky and adds additional mass to electronic cards.
  • these connectors are through components soldered to the card, which are generally placed on the periphery of the cards. This involves routing the tracks accordingly, and this excess routing reduces the integration capacity of the cards, and can also be harmful to the electrical performance of the cards, by creating voltage drops, series resistances, parasitic capacitances, parasitic inductances and/or electromagnetic disturbances.
  • US patent 10,575,408 proposes an alternative to the use of these through connectors, which consists of connecting two electronic cards together by bringing their conductive tracks into contact.
  • the cards each include an imprint which can fit with the imprint of another card placed opposite and thus making it possible to ensure alignment and contact between the conductive tracks of the two cards.
  • the invention relates to a method of manufacturing an electronic circuit comprising:
  • the invention it is possible to circumvent the card thickness limitation by superimposing at least two electronic cards on top of each other and by electrically connecting them via their additively manufactured connectors.
  • the cavity present on the first card allows the electronic component to be buried, to optimize and best integrate the component into the electronic circuit.
  • the additive manufacturing of said electrical conductive connectors of the first and second cards is chosen from inkjet printing, printing by fused wire deposition or printing by laser fusion on a powder bed.
  • said electrical conductive connectors of the first and second cards are manufactured from a conductive ink comprising silver nanoparticles and the electronic component of the first card is soldered to the first card by said conductive ink.
  • the first and second electronic cards comprise non-conductive parts made of a photosensitive resin.
  • said electrical conductive connectors are of conical or trapezoidal shape.
  • said electrical conductive connectors are of the single-signal type. This allows you to place the connectors in an optimized way, that is to say according to the placement between the components present on the cards, without having to gather all the signals in a single connector.
  • said electrical conductive connectors are of the multi-signal type. This makes it possible to transmit at least two signals, for example an antenna signal and a shielded signal, and to limit the number of connectors on the cards.
  • the electrically conductive connector of the first card is of the male type and the electrically conductive connector of the second card is of the female type of complementary shape to the male type connector of the first card.
  • the second card also comprises on a second face at least one electronic component and an electrically conductive connector and the method comprises the additive manufacturing of a third electronic card comprising at least on a first face a electrical conductive connector and a cavity, and the superposition of the third card on the second card so that the first face of the third card is opposite the second face of the second card, that the conductive connector electrical of the third card is in electrical contact with the electrically conductive connector of the second face of the second card and that the electronic component of the second card is placed in the cavity of the third card.
  • the method further comprises putting the superimposed electronic cards under press.
  • Pressing ensures the mechanical connection of the cards together and ensures electrical cohesion.
  • Figure 1 represents, schematically and partially, a method of manufacturing an electronic circuit according to one embodiment of the invention.
  • Figure 2 represents, schematically, electrical conductive connectors of an electronic circuit manufactured according to one embodiment of the invention.
  • Figure 3 represents, schematically and partially, electrical conductive connectors of an electronic circuit manufactured according to another embodiment of the invention.
  • Figure 4 represents, schematically and partially, an electronic circuit produced according to one embodiment of the invention.
  • an electrically conductive connector is referred to as a connector.
  • Figure 1 represents, schematically and partially, a method 100 for manufacturing an electronic circuit according to one embodiment of the invention.
  • the method 100 first comprises the additive manufacturing 110 of electronic cards.
  • the electrical conductive connectors present on a first face of each are also manufactured. map.
  • an electronic component is also placed on the first face of one of the cards which is soldered to the card during additive manufacturing and a cavity is also made on the first face of the other card.
  • Cards and connectors are, for example, manufactured by inkjet printing, fused wire deposition printing or even laser powder bed fusion printing.
  • the conductive parts of the cards, such as the connectors and/or the conductive tracks can be made from a conductive ink, for example an ink based on silver, copper or even platinum, for example an ink comprising metal nanoparticles, for example silver nanoparticles.
  • the conductive ink can be sintered, after having been deposited on the card manufacturing support, using for example an infrared lamp, to sinter the metal nanoparticles forming the conductive tracks and the connectors in order to have a good electrical conductivity.
  • the soldering of the electronic component is carried out with a conductive ink as described previously.
  • the body of the cards in particular the non-conductive parts, is for example made from a dielectric ink in the form of a photosensitive resin which polymerizes under UV rays.
  • the cards are superimposed on each other so that their first faces are facing each other, their connectors are in electrical contact and the component of the first card is placed in the cavity of the other card (step 120).
  • the step 120 of superimposing the cards can also include the nesting of the different connectors together, in particular if the connectors are of the male/female type and/or if they have complementary shapes.
  • the stacked cards can be put under press in order to ensure mechanical and/or electrical cohesion between the cards (step 130).
  • Figure 2 represents, schematically and partially, an electronic circuit 200 formed by two electronic cards 210 and 220 manufactured according to the method of the invention.
  • the electronic card 210 thus includes connectors 211, 212 manufactured in an additive manner and present on one of its faces, called the first face. 215 of the card 210, and the card 220 includes connectors 221, 222 manufactured in an additive manner and present on one of its faces, called the first face 225 of the card 220.
  • the cards 210 and 220 are superimposed on each other, so that the connectors 211, 212 of the card 210 are opposite and in electrical contact with the connectors 221, 222 of the card 220 Furthermore, in order to reduce the size of the circuit 200 formed by the two cards 210 and 220, the connectors 211, 212, 221, 222 of the two cards are of complementary shape so as to be able to fit into each other . More particularly, in this exemplary embodiment, the connector 211 of the card 210 is of trapezoidal shape of the male type and the connector 221 of the card 220 is of the trapezoidal shape of the female type and complementary to the connector 211 so that the connectors 211 and 221 fit together.
  • the connector 212 of the card 210 is of conical shape of the male type and the connector 222 of the card 220 is of the conical shape of the female type and complementary to the connector 212 so that the connectors 212 and 222 fit together.
  • the connectors of cards 210 and 220 are of the single-signal type.
  • Figure 3 represents, schematically and partially, an electronic circuit 300 formed by two electronic cards 310 and 320 manufactured according to the method of the invention.
  • the electronic card 310 thus comprises a connector 311 manufactured in an additive manner and present on one of its faces, called the first face 315 of the card 310
  • the card 320 comprises a connector 321 manufactured in an additive manner and present on one of its faces, called first face 325 of card 320.
  • the cards 310 and 320 are superimposed on each other, so that the connectors 311 and 321 are facing each other and in electrical contact.
  • connectors 311 and 321 are of the multi-signal type. Furthermore, in order to reduce the bulk of the circuit 300 formed by the two cards 310 and 320, the connectors are of complementary shape and fit into each other, more particularly the connector 311 is of the male type and the connector 321 is of the female type with a complementary shape to connector 311.
  • Figure 4 represents, schematically and partially, an electronic circuit produced according to one embodiment of the invention.
  • Circuit 400 includes three electronic cards 410, 420, 430.
  • the first card 410 comprises electronic components 451 and electrically conductive connectors 411 and 412 placed on its first face 4101.
  • the second card 420 comprises on its first face 4201 cavities 442 facing the components 451 of the first card 410 and the connectors electrical conductors 421, 422 facing the connectors 411, 412 of the first card 410.
  • the second card 420 On its second face 4202, the second card 420 comprises electronic components 452 and electrically conductive connectors 423.
  • the third card 430 comprises on its first face 4301 cavities 443 facing the components 4542 of the second card 420 and electrically conductive connectors 433.
  • the components of the first and second cards 410, 420 are buried and the connectors of the three cards 410, 420, 430 are in electrical contact.
  • the electrical circuit 400 is thus compact, and the location of the components 451, 452 and the connectors 411, 412, 421, 422, 423, 433 is optimized on each card 410, 420, 430.
  • the connectors of the three cards 410, 420, 430 can be of the male or female type and/or of the single-signal or multi-signal type.
  • the connectors can have various sizes and shapes in order to optimize the size of the cards and the interconnection between the cards.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Dispersion Chemistry (AREA)
  • Credit Cards Or The Like (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

Disclosed is a process for manufacturing a circuit board (400) comprising: - manufacturing by additive manufacturing a first circuit board (410) comprising, at least on a first side (4101), an electrically conductive connector (411, 412) and an electronic component (451), and manufacturing by additive manufacturing a second circuit board (420) comprising, at least on a first side (4201), an electrically conductive connector (411, 412) and a cavity (442), and - superposing the first and second circuit boards so that the first side (4101) of the first board (410) lies facing the first side (4201) of the second board (420), so that the electrically conductive connector (411, 412) of the first board (410) makes electrical contact with the electrically conductive connector (421, 422) of the second board (420) and so that the electronic component (451) of the first board (410) is placed in the cavity (442) of the second board (420).

Description

Description Description
Titre de l'invention : PROCEDE DE FABRICATION DE MODULES ELECTRONIQUES IMBRIQUES PAR FABRICATION ADDITIVE Title of the invention: METHOD FOR MANUFACTURING INTERBED ELECTRONIC MODULES BY ADDITIVE MANUFACTURING
Domaine Technique Technical area
La présente invention se rapporte au domaine général de la fabrication par impression additive de circuits électroniques, et plus particulièrement à la fabrication additive de cartes électroniques élémentaires et de modules électroniques imbriqués. The present invention relates to the general field of manufacturing by additive printing of electronic circuits, and more particularly to the additive manufacturing of elementary electronic cards and nested electronic modules.
Technique antérieure Prior art
De plus en plus de cartes électroniques sont fabriquées par des procédés de fabrication additive, afin d'obtenir des circuits de différentes formes, des circuits flexibles, et/ou des circuits portables. Cependant, les épaisseurs de cartes sont limitées par ces procédés à quelques millimètres (3 mm). More and more electronic cards are manufactured by additive manufacturing processes, in order to obtain circuits of different shapes, flexible circuits, and/or portable circuits. However, card thicknesses are limited by these processes to a few millimeters (3 mm).
Ainsi, pour contourner cette limitation d'épaisseur et pour réduire l'encombrement des cartes électroniques afin de répondre aux besoins d'électronique intégrée, les cartes peuvent être empilées les unes sur les autres. Des connecteurs de type barrette sont soudés entre les cartes pour connecter électriquement les cartes entre elles afin de partager une alimentation électrique et/ou transmettre des signaux numériques ou analogiques entre elles. Néanmoins, ce type de connecteur est généralement encombrant et ajoute une masse supplémentaire sur les cartes électroniques. Thus, to circumvent this thickness limitation and to reduce the bulk of the electronic cards in order to meet the needs of integrated electronics, the cards can be stacked on top of each other. Header-type connectors are soldered between the boards to electrically connect the boards together to share a power supply and/or transmit digital or analog signals between them. However, this type of connector is generally bulky and adds additional mass to electronic cards.
Par ailleurs, ces connecteurs sont des composants traversant soudés à la carte, qui sont généralement placés en périphérie des cartes. Cela implique de router les pistes en conséquence, et ce surplus de routage diminue la capacité d'intégration des cartes, et peut également être nuisible aux performances électriques des cartes, en créant des chutes de tension, des résistances série, des capacités parasites, des inductances parasites et/ou des perturbations électromagnétiques. Le brevet US 10 575 408 propose une alternative à l'utilisation de ces connecteurs traversant, qui consiste à connecter deux cartes électroniques entre elles en mettant en contact leurs pistes conductrices. Pour cela, les cartes comprennent chacune une empreinte pouvant s'emboiter avec l'empreinte d'une autre carte placée en vis-à-vis et permettant ainsi d'assurer la mise en regard et le contact entre les pistes conductrices des deux cartes. Furthermore, these connectors are through components soldered to the card, which are generally placed on the periphery of the cards. This involves routing the tracks accordingly, and this excess routing reduces the integration capacity of the cards, and can also be harmful to the electrical performance of the cards, by creating voltage drops, series resistances, parasitic capacitances, parasitic inductances and/or electromagnetic disturbances. US patent 10,575,408 proposes an alternative to the use of these through connectors, which consists of connecting two electronic cards together by bringing their conductive tracks into contact. For this, the cards each include an imprint which can fit with the imprint of another card placed opposite and thus making it possible to ensure alignment and contact between the conductive tracks of the two cards.
Néanmoins, la solution proposée dans le brevet US 10 575 408 ne permet pas le maintien mécanique entre les cartes. Ce maintien mécanique est assuré à travers une pièce tierce : une sorte d'anneau ou de bague, ce qui rajoute de l'encombrement et de la masse à l'ensemble. De plus, le contact électrique entre les deux cartes électroniques est situé en extrémité de carte. Cela rajoute des contraintes sur le routage, et éventuellement des éléments parasites sur les signaux électriques. However, the solution proposed in US patent 10,575,408 does not allow mechanical retention between the cards. This mechanical support is ensured through a third part: a sort of ring or ring, which adds bulk and mass to the whole. In addition, the electrical contact between the two electronic cards is located at the end of the card. This adds constraints to the routing, and possibly parasitic elements to the electrical signals.
Il est donc souhaitable de disposer d'un procédé de fabrication d'un circuit électronique permettant d'obtenir un circuit électronique peu encombrant et léger afin d'améliorer la capacité d'intégration du circuit dans des espaces restreints. It is therefore desirable to have a method of manufacturing an electronic circuit making it possible to obtain a compact and lightweight electronic circuit in order to improve the integration capacity of the circuit in restricted spaces.
Exposé de l'invention Presentation of the invention
L'invention concerne un procédé de fabrication d'un circuit électronique comprenant : The invention relates to a method of manufacturing an electronic circuit comprising:
- la fabrication additive d'une première carte électronique comprenant au moins sur une première face un connecteur conducteur électrique et un composant électronique et la fabrication additive d'une deuxième carte électronique comprenant au moins sur une première face un connecteur conducteur électrique et une cavité, et - the additive manufacturing of a first electronic card comprising at least on a first face an electrically conductive connector and an electronic component and the additive manufacturing of a second electronic card comprising at least on a first face an electrically conductive connector and a cavity, And
- la superposition des première et deuxième cartes électroniques de manière à ce que la première face de la première carte soit en vis-à-vis de la première face de la deuxième carte, que le connecteur conducteur électrique de la première carte soit en contact électrique avec le connecteur conducteur électrique de la deuxième carte, et que le composant électronique de la première carte soit placé dans la cavité de la deuxième carte. - the superposition of the first and second electronic cards so that the first face of the first card is opposite the first face of the second card, that the electrical conductive connector of the first card is in electrical contact with conductive connector electrical of the second card, and that the electronic component of the first card is placed in the cavity of the second card.
Grâce à l'invention, il est possible de contourner la limitation d'épaisseur de carte en superposant au moins deux cartes électroniques l'une sur l'autre et en les connectant électriquement par leurs connecteurs fabriqués de manière additive.Thanks to the invention, it is possible to circumvent the card thickness limitation by superimposing at least two electronic cards on top of each other and by electrically connecting them via their additively manufactured connectors.
De plus, pour connecter les cartes superposées entre elles, les connecteurs classiques de type barrette, broches, ou câbles électriques sont remplacés par des connecteurs fabriqués de manière additive qui forment des points de connexion localisés au plus proche du besoin pour optimiser l'interconnexion entre les cartes. Ces nouveaux connecteurs permettent de diminuer l'encombrement et la masse du circuit électronique formé par la superposition des deux cartes, et de limiter le nombre de pistes conductrices sur les cartes dédiées au routage de signaux. In addition, to connect the superimposed cards together, the classic connectors of the strip type, pins, or electrical cables are replaced by connectors manufactured in an additive manner which form connection points located as close as possible to the need to optimize the interconnection between the cards. These new connectors make it possible to reduce the size and mass of the electronic circuit formed by the superposition of the two cards, and to limit the number of conductive tracks on the cards dedicated to signal routing.
La cavité présente sur la première carte permet d'enfouir le composant électronique, pour optimiser et intégrer au mieux le composant sur le circuit électronique. The cavity present on the first card allows the electronic component to be buried, to optimize and best integrate the component into the electronic circuit.
Selon une caractéristique particulière de l'invention, la fabrication additive desdits connecteurs conducteurs électriques des première et deuxième cartes est choisie parmi une impression par jet d'encre, une impression par dépôt de fil fondu ou une impression par fusion laser sur lit de poudre. According to a particular characteristic of the invention, the additive manufacturing of said electrical conductive connectors of the first and second cards is chosen from inkjet printing, printing by fused wire deposition or printing by laser fusion on a powder bed.
Selon une autre caractéristique particulière de l'invention, lesdits connecteurs conducteurs électriques des première et deuxième cartes sont fabriqués à partir d'une encre conductrice comprenant des nanoparticules d'argent et le composant électronique de la première carte est soudé à la première carte par ladite encre conductrice. According to another particular characteristic of the invention, said electrical conductive connectors of the first and second cards are manufactured from a conductive ink comprising silver nanoparticles and the electronic component of the first card is soldered to the first card by said conductive ink.
Selon une autre caractéristique particulière de l'invention, les première et deuxième cartes électroniques comprennent des parties non-conductrices réalisées en une résine photosensible. According to another particular characteristic of the invention, the first and second electronic cards comprise non-conductive parts made of a photosensitive resin.
Selon une autre caractéristique particulière de l'invention, lesdits connecteurs conducteurs électriques sont de forme conique ou trapézoïdale. According to another particular characteristic of the invention, said electrical conductive connectors are of conical or trapezoidal shape.
Selon une autre caractéristique particulière de l'invention, lesdits connecteurs conducteurs électriques sont de type mono-signal. Cela permet de placer les connecteurs de manière optimisée, c'est-à-dire en fonction du placement entre les composants présents sur les cartes, sans avoir à rassembler tous les signaux dans un seul connecteur. According to another particular characteristic of the invention, said electrical conductive connectors are of the single-signal type. This allows you to place the connectors in an optimized way, that is to say according to the placement between the components present on the cards, without having to gather all the signals in a single connector.
Selon une autre caractéristique particulière de l'invention, lesdits connecteurs conducteurs électriques sont de type multi-signaux. Cela permet de transmettre au moins deux signaux, par exemple un signal d'antenne et un signal blindé et de limiter le nombre de connecteurs sur les cartes. According to another particular characteristic of the invention, said electrical conductive connectors are of the multi-signal type. This makes it possible to transmit at least two signals, for example an antenna signal and a shielded signal, and to limit the number of connectors on the cards.
Selon une autre caractéristique particulière de l'invention, le connecteur conducteur électrique de la première carte est de type mâle et le connecteur conducteur électrique de la deuxième carte est de type femelle de forme complémentaire du connecteur de type mâle de la première carte. According to another particular characteristic of the invention, the electrically conductive connector of the first card is of the male type and the electrically conductive connector of the second card is of the female type of complementary shape to the male type connector of the first card.
Cela permet de garantir un bon contact électrique entre les conducteurs des première et deuxième cartes. This ensures good electrical contact between the conductors of the first and second cards.
Selon une autre caractéristique particulière de l'invention, la deuxième carte comprend également sur une deuxième face au moins un composant électronique et un connecteur conducteur électrique et le procédé comprend la fabrication additive d'une troisième carte électronique comprenant au moins sur une première face un connecteur conducteur électrique et une cavité, et la superposition de la troisième carte sur la deuxième carte de manière à ce que la première face de la troisième carte soit en vis-à-vis de la deuxième face de la deuxième carte, que le connecteur conducteur électrique de la troisième carte soit en contact électrique avec le connecteur conducteur électrique de la deuxième face de la deuxième carte et que le composant électronique de la deuxième carte soit placé dans la cavité de la troisième carte. According to another particular characteristic of the invention, the second card also comprises on a second face at least one electronic component and an electrically conductive connector and the method comprises the additive manufacturing of a third electronic card comprising at least on a first face a electrical conductive connector and a cavity, and the superposition of the third card on the second card so that the first face of the third card is opposite the second face of the second card, that the conductive connector electrical of the third card is in electrical contact with the electrically conductive connector of the second face of the second card and that the electronic component of the second card is placed in the cavity of the third card.
Cela permet d'empiler plusieurs cartes électroniques entre elles pour former un seul circuit électronique pouvant avoir une épaisseur supérieure à 3 mm. De plus, comme pour la superposition de deux cartes, les câbles de connexion sont réduits, voire supprimés et remplacés par les connecteurs conducteurs électriques, ce qui permet de réduire la masse du circuit et d'optimiser le placement des connecteurs et des composants sur chaque carte. Selon une autre caractéristique particulière de l'invention, le procédé comprend en outre la mise sous presse des cartes électroniques superposées. This makes it possible to stack several electronic cards together to form a single electronic circuit that can have a thickness greater than 3 mm. In addition, as for the superposition of two cards, the connection cables are reduced or even eliminated and replaced by electrically conductive connectors, which makes it possible to reduce the mass of the circuit and optimize the placement of connectors and components on each map. According to another particular characteristic of the invention, the method further comprises putting the superimposed electronic cards under press.
La mise sous presse permet d'assurer la liaison mécanique des cartes entre elles et d'assurer la cohésion électrique. Pressing ensures the mechanical connection of the cards together and ensures electrical cohesion.
Brève description des dessins Brief description of the drawings
D'autres caractéristiques et avantages de la présente invention ressortiront de la description faite ci-dessous, en référence aux dessins annexés qui en illustrent des exemples de réalisation dépourvus de tout caractère limitatif. Other characteristics and advantages of the present invention will emerge from the description given below, with reference to the appended drawings which illustrate examples of embodiment devoid of any limiting character.
[Fig. 1] La figure 1 représente, de manière schématique et partielle, un procédé de fabrication d'un circuit électronique selon un mode de réalisation de l'invention.[Fig. 1] Figure 1 represents, schematically and partially, a method of manufacturing an electronic circuit according to one embodiment of the invention.
[Fig. 2] La figure 2 représente, de manière schématique, des connecteurs conducteurs électriques d'un circuit électronique fabriqué selon un mode de réalisation de l'invention. [Fig. 2] Figure 2 represents, schematically, electrical conductive connectors of an electronic circuit manufactured according to one embodiment of the invention.
[Fig. 3] La figure 3 représente, de manière schématique et partielle, des connecteurs conducteurs électriques d'un circuit électronique fabriqué selon un autre mode de réalisation de l'invention. [Fig. 3] Figure 3 represents, schematically and partially, electrical conductive connectors of an electronic circuit manufactured according to another embodiment of the invention.
[Fig. 4] La figure 4 représente, de manière schématique et partielle, un circuit électronique réalisé selon un mode de réalisation de l'invention. [Fig. 4] Figure 4 represents, schematically and partially, an electronic circuit produced according to one embodiment of the invention.
Description des modes de réalisation Description of embodiments
Dans toute la description, pour des raisons de clarté, un connecteur conducteur électrique est appelé un connecteur. Throughout the description, for clarity, an electrically conductive connector is referred to as a connector.
La figure 1 représente, de manière schématique et partielle, un procédé 100 de fabrication d'un circuit électronique selon un mode de réalisation de l'invention.Figure 1 represents, schematically and partially, a method 100 for manufacturing an electronic circuit according to one embodiment of the invention.
Le procédé 100 comprend d'abord la fabrication additive 110 de cartes électroniques. Lors de la fabrication additive des cartes, on fabrique également les connecteurs conducteurs électriques présents sur une première face de chaque carte. Lors de la fabrication, on place également un composant électronique sur la première face d'une des cartes qui est soudé à la carte lors de la fabrication additive et on réalise également une cavité sur la première face de l'autre carte. The method 100 first comprises the additive manufacturing 110 of electronic cards. During the additive manufacturing of the cards, the electrical conductive connectors present on a first face of each are also manufactured. map. During manufacturing, an electronic component is also placed on the first face of one of the cards which is soldered to the card during additive manufacturing and a cavity is also made on the first face of the other card.
Les cartes et les connecteurs sont par exemple fabriqués par une impression par jet d'encre, une impression par dépôt de fil fondu ou encore une impression par fusion laser sur lit de poudre. Les parties conductrices des cartes, comme les connecteurs et/ou les pistes conductrices, peuvent être réalisées à partir d'une encre conductrice, par exemple une encre à base d'argent, de cuivre ou encore de platine, par exemple une encre comprenant des nanoparticules métalliques, par exemple des nanoparticules d'argent. L'encre conductrice peut être frittée, après avoir été déposée sur le support de fabrication des cartes, à l'aide par exemple d'une lampe infrarouge, pour fritter les nanoparticules métalliques formant les pistes conductrices et les connecteurs afin d'avoir une bonne conductivité électrique. La soudure du composant électronique est réalisée avec une encre conductrice telle que décrite précédemment. Cards and connectors are, for example, manufactured by inkjet printing, fused wire deposition printing or even laser powder bed fusion printing. The conductive parts of the cards, such as the connectors and/or the conductive tracks, can be made from a conductive ink, for example an ink based on silver, copper or even platinum, for example an ink comprising metal nanoparticles, for example silver nanoparticles. The conductive ink can be sintered, after having been deposited on the card manufacturing support, using for example an infrared lamp, to sinter the metal nanoparticles forming the conductive tracks and the connectors in order to have a good electrical conductivity. The soldering of the electronic component is carried out with a conductive ink as described previously.
Le corps des cartes, notamment les parties non-conductrices, est par exemple fabriqué à partir d'une encre diélectrique sous forme de résine photosensible qui polymérise aux rayons UV. The body of the cards, in particular the non-conductive parts, is for example made from a dielectric ink in the form of a photosensitive resin which polymerizes under UV rays.
Puis, les cartes sont superposées les unes sur les autres de manière à ce que leurs premières faces soient en vis-à-vis, leurs connecteurs en contact électrique et le composant de la première carte soit placé dans la cavité de l'autre carte (étape 120). L'étape de superposition 120 des cartes peut également inclure l'emboîtement des différents connecteurs entre eux, notamment si les connecteurs sont de type mâle/femelle et/ou s'ils ont des formes complémentaires. Then, the cards are superimposed on each other so that their first faces are facing each other, their connectors are in electrical contact and the component of the first card is placed in the cavity of the other card ( step 120). The step 120 of superimposing the cards can also include the nesting of the different connectors together, in particular if the connectors are of the male/female type and/or if they have complementary shapes.
Enfin, on peut mettre sous presse les cartes empilées afin d'assurer une cohésion mécanique et/ou électrique entre les cartes (étape 130). Finally, the stacked cards can be put under press in order to ensure mechanical and/or electrical cohesion between the cards (step 130).
La figure 2 représente, de manière schématique et partielle, un circuit électronique 200 formé par deux cartes électroniques 210 et 220 fabriquées selon le procédé de l'invention. La carte électronique 210 comprend ainsi des connecteurs 211, 212 fabriqués de manière additive et présents sur une de ses faces, dite première face 215 de la carte 210, et la carte 220 comprend des connecteurs 221, 222 fabriqués de manière additive et présents sur une de ses faces, dite première face 225 de la carte 220. Figure 2 represents, schematically and partially, an electronic circuit 200 formed by two electronic cards 210 and 220 manufactured according to the method of the invention. The electronic card 210 thus includes connectors 211, 212 manufactured in an additive manner and present on one of its faces, called the first face. 215 of the card 210, and the card 220 includes connectors 221, 222 manufactured in an additive manner and present on one of its faces, called the first face 225 of the card 220.
Les cartes 210 et 220 sont superposées l'une sur l'autre, de manière à ce que les connecteurs 211, 212 de la carte 210 soient en vis-à-vis et en contact électrique avec les connecteurs 221, 222 de la carte 220. De plus, afin de diminuer l'encombrement du circuit 200 formé par les deux cartes 210 et 220, les connecteurs 211, 212, 221, 222 des deux cartes sont de forme complémentaire de manière à pouvoir s'emboîter les uns dans les autres. Plus particulièrement, dans cet exemple de réalisation, le connecteur 211 de la carte 210 est de forme trapézoïdale de type mâle et le connecteur 221 de la carte 220 est de forme trapézoïdale de type femelle et complémentaire du connecteur 211 de manière à ce que les connecteurs 211 et 221 s'emboîtent ensemble. Le connecteur 212 de la carte 210 est de forme conique de type mâle et le connecteur 222 de la carte 220 est de forme conique de type femelle et complémentaire du connecteur 212 de manière à ce que les connecteurs 212 et 222 s'emboîtent ensemble. Dans cet exemple de réalisation, les connecteurs des cartes 210 et 220 sont de type mono-signal. The cards 210 and 220 are superimposed on each other, so that the connectors 211, 212 of the card 210 are opposite and in electrical contact with the connectors 221, 222 of the card 220 Furthermore, in order to reduce the size of the circuit 200 formed by the two cards 210 and 220, the connectors 211, 212, 221, 222 of the two cards are of complementary shape so as to be able to fit into each other . More particularly, in this exemplary embodiment, the connector 211 of the card 210 is of trapezoidal shape of the male type and the connector 221 of the card 220 is of the trapezoidal shape of the female type and complementary to the connector 211 so that the connectors 211 and 221 fit together. The connector 212 of the card 210 is of conical shape of the male type and the connector 222 of the card 220 is of the conical shape of the female type and complementary to the connector 212 so that the connectors 212 and 222 fit together. In this exemplary embodiment, the connectors of cards 210 and 220 are of the single-signal type.
La figure 3 représente, de manière schématique et partielle, un circuit électronique 300 formé par deux cartes électroniques 310 et 320 fabriquées selon le procédé de l'invention. La carte électronique 310 comprend ainsi un connecteur 311 fabriqué de manière additive et présent sur une de ses faces, dite première face 315 de la carte 310, et la carte 320 comprend un connecteur 321 fabriqué de manière additive et présent sur une de ses faces, dite première face 325 de la carte 320. Figure 3 represents, schematically and partially, an electronic circuit 300 formed by two electronic cards 310 and 320 manufactured according to the method of the invention. The electronic card 310 thus comprises a connector 311 manufactured in an additive manner and present on one of its faces, called the first face 315 of the card 310, and the card 320 comprises a connector 321 manufactured in an additive manner and present on one of its faces, called first face 325 of card 320.
Les cartes 310 et 320 sont superposées l'une sur l'autre, de manière à ce que les connecteurs 311 et 321 soient en vis-à-vis et en contact électrique. The cards 310 and 320 are superimposed on each other, so that the connectors 311 and 321 are facing each other and in electrical contact.
Dans cet exemple de réalisation, les connecteurs 311 et 321 sont de type multi- signaux. De plus, afin de réduire l'encombrement du circuit 300 formé par les deux cartes 310 et 320, les connecteurs sont de forme complémentaire et s'emboîtent l'un dans l'autre, plus particulièrement le connecteur 311 est de type mâle et le connecteur 321 est de type femelle de forme complémentaire du connecteur 311. La figure 4 représente, de manière schématique et partielle, un circuit électronique réalisé selon un mode de réalisation de l'invention. In this exemplary embodiment, connectors 311 and 321 are of the multi-signal type. Furthermore, in order to reduce the bulk of the circuit 300 formed by the two cards 310 and 320, the connectors are of complementary shape and fit into each other, more particularly the connector 311 is of the male type and the connector 321 is of the female type with a complementary shape to connector 311. Figure 4 represents, schematically and partially, an electronic circuit produced according to one embodiment of the invention.
Le circuit 400 comprend trois cartes électroniques 410, 420, 430. Circuit 400 includes three electronic cards 410, 420, 430.
La première carte 410 comprend des composants électroniques 451 et des connecteurs conducteurs électriques 411 et 412 placés sur sa première face 4101. La deuxième carte 420 comprend sur sa première face 4201 des cavités 442 en regard des composants 451 de la première carte 410 et des connecteurs conducteurs électriques 421, 422 en regard des connecteurs 411, 412 de la première carte 410. The first card 410 comprises electronic components 451 and electrically conductive connectors 411 and 412 placed on its first face 4101. The second card 420 comprises on its first face 4201 cavities 442 facing the components 451 of the first card 410 and the connectors electrical conductors 421, 422 facing the connectors 411, 412 of the first card 410.
Sur sa deuxième face 4202, la deuxième carte 420 comprend des composants électroniques 452 et des connecteurs conducteurs électriques 423. La troisième carte 430 comprend sur sa première face 4301 des cavités 443 en regard des composants 4542 de la deuxième carte 420 et des connecteurs conducteurs électriques 433. On its second face 4202, the second card 420 comprises electronic components 452 and electrically conductive connectors 423. The third card 430 comprises on its first face 4301 cavities 443 facing the components 4542 of the second card 420 and electrically conductive connectors 433.
Ainsi, en superposant ces trois cartes 410, 420, 430, les composants des première et deuxième cartes 410, 420 sont enfouis et les connecteurs des trois cartes 410, 420, 430 sont en contact électrique. Le circuit électrique 400 est ainsi compact, et l'emplacement des composants 451, 452 et des connecteurs 411, 412, 421, 422, 423, 433 est optimisé sur chaque carte 410, 420, 430. Thus, by superimposing these three cards 410, 420, 430, the components of the first and second cards 410, 420 are buried and the connectors of the three cards 410, 420, 430 are in electrical contact. The electrical circuit 400 is thus compact, and the location of the components 451, 452 and the connectors 411, 412, 421, 422, 423, 433 is optimized on each card 410, 420, 430.
Comme indiqué pour les figures précédentes, les connecteurs des trois cartes 410, 420, 430 peuvent être de type mâle ou femelle et/ou de type mono-signal ou multi- signaux. As indicated for the previous figures, the connectors of the three cards 410, 420, 430 can be of the male or female type and/or of the single-signal or multi-signal type.
De plus, les connecteurs peuvent avoir des tailles et des formes diverses afin d'optimiser l'encombrement des cartes et l'interconnexion entre les cartes. In addition, the connectors can have various sizes and shapes in order to optimize the size of the cards and the interconnection between the cards.

Claims

Revendications Claims
[Revendication 1] Procédé (100) de fabrication d'un circuit électronique (200, 300) comprenant : [Claim 1] Method (100) for manufacturing an electronic circuit (200, 300) comprising:
- la fabrication additive (110) d'une première carte électronique (210, 310) comprenant au moins sur une première face un connecteur conducteur électrique et un composant électronique et la fabrication additive (110) d'une deuxième carte électronique (220, 320) comprenant au moins sur une première face un connecteur conducteur électrique et une cavité, et - the additive manufacturing (110) of a first electronic card (210, 310) comprising at least on a first face an electrically conductive connector and an electronic component and the additive manufacturing (110) of a second electronic card (220, 320 ) comprising at least on a first face an electrically conductive connector and a cavity, and
- la superposition (120) des première et deuxième cartes électroniques de manière à ce que la première face (215, 315) de la première carte (210, 310) soit en vis-à-vis de la première face (225, 325) de la deuxième carte (220, 320), que le connecteur conducteur électrique (211, 212, 311) de la première carte soit en contact électrique avec le connecteur conducteur électrique (221, 222, 321) de la deuxième carte et que le composant électronique de la première carte soit placé dans la cavité de la deuxième carte. - the superposition (120) of the first and second electronic cards so that the first face (215, 315) of the first card (210, 310) faces the first face (225, 325) of the second card (220, 320), that the electrically conductive connector (211, 212, 311) of the first card is in electrical contact with the electrically conductive connector (221, 222, 321) of the second card and that the component electronic of the first card is placed in the cavity of the second card.
[Revendication 2] Procédé de fabrication d'un circuit électronique selon la revendication 1, dans lequel la fabrication additive desdits connecteurs conducteurs électriques des première et deuxième cartes est choisie parmi une impression par jet d'encre, une impression par dépôt de fil fondu ou une impression par fusion laser sur lit de poudre. [Claim 2] Method of manufacturing an electronic circuit according to claim 1, in which the additive manufacturing of said electrically conductive connectors of the first and second cards is chosen from inkjet printing, fused wire deposition printing or printing by laser fusion on a powder bed.
[Revendication 3] Procédé de fabrication d'un circuit électronique selon l'une quelconque des revendications 1 ou 2, dans lequel lesdits connecteurs conducteurs électriques des première et deuxième cartes sont fabriqués à partir d'une encre conductrice comprenant des nanoparticules d'argent et le composant électronique de la première carte est soudé à la première carte par ladite encre conductrice. [Claim 3] Method of manufacturing an electronic circuit according to any one of claims 1 or 2, in which said electrically conductive connectors of the first and second cards are manufactured from a conductive ink comprising silver nanoparticles and the electronic component of the first card is soldered to the first card by said conductive ink.
[Revendication 4] Procédé de fabrication d'un circuit électronique selon l'une quelconque des revendications 1 à 3, dans lequel les première et deuxième cartes électroniques comprennent des parties non-conductrices réalisées en une résine photosensible. [Claim 4] Method of manufacturing an electronic circuit according to any one of claims 1 to 3, in which the first and second electronic cards comprise non-conductive parts made of a photosensitive resin.
[Revendication 5] Procédé de fabrication d'un circuit électronique (200) selon l'une quelconque des revendications 1 à 4, dans lequel lesdits connecteurs conducteurs électriques sont de forme conique (212, 222) ou trapézoïdale (211, 221). [Claim 5] Method of manufacturing an electronic circuit (200) according to any one of claims 1 to 4, in which said electrical conductive connectors are of conical (212, 222) or trapezoidal (211, 221) shape.
[Revendication 6] Procédé de fabrication d'un circuit électronique (200) selon l'une quelconque des revendications 1 à 5, dans lequel lesdits connecteurs conducteurs électriques (211, 212, 221, 222) sont de type mono-signal. [Claim 6] Method of manufacturing an electronic circuit (200) according to any one of claims 1 to 5, in which said electrical conductive connectors (211, 212, 221, 222) are of the single-signal type.
[Revendication 7] Procédé de fabrication d'un circuit électronique (300) selon l'une quelconque des revendications 1 à 5, dans lequel lesdits connecteurs conducteurs électriques (311, 321) sont de type multi-signaux. [Claim 7] Method of manufacturing an electronic circuit (300) according to any one of claims 1 to 5, in which said electrical conductive connectors (311, 321) are of the multi-signal type.
[Revendication 8] Procédé de fabrication d'un circuit électronique (200, 300) selon l'une quelconque des revendications 1 à 7, dans lequel le connecteur conducteur électrique (211, 212, 311) de la première carte (210, 310) est de type mâle et le connecteur conducteur électrique (221, 222, 321) de la deuxième carte (220, 320) est de type femelle de forme complémentaire du connecteur de type mâle de la première carte. [Claim 8] Method of manufacturing an electronic circuit (200, 300) according to any one of claims 1 to 7, in which the electrically conductive connector (211, 212, 311) of the first card (210, 310) is of the male type and the electrical conductive connector (221, 222, 321) of the second card (220, 320) is of the female type of complementary shape to the male type connector of the first card.
[Revendication 9] Procédé de fabrication d'un circuit électronique selon l'une quelconque des revendications 1 à 8, dans lequel la deuxième carte (420) comprend également sur une deuxième face (4202) au moins un composant électronique (452) et un connecteur conducteur électrique (423) et le procédé comprend la fabrication additive d'une troisième carte électronique (430) comprenant au moins sur une première face (4301) un connecteur conducteur électrique (433) et une cavité (443) et la superposition de la troisième carte (430) sur la deuxième carte (420) de manière à ce que la première face (4301) de la troisième carte (430) soit en vis-à-vis de la deuxième face (4202) de la deuxième carte (420), que le connecteur conducteur électrique (433) de la troisième carte (430) soit en contact électrique avec le connecteur conducteur électrique (423) de la deuxième face (4202) de la deuxième carte (420) et que le composant électronique (452) de la deuxième carte (420) soit placé dans la cavité (443) de la troisième carte (430). [Revendication 10] Procédé de fabrication d'un circuit électronique selon l'une quelconque des revendications 1 à 9, comprenant en outre la mise sous presse des cartes électroniques superposées (130). [Claim 9] Method of manufacturing an electronic circuit according to any one of claims 1 to 8, in which the second card (420) also comprises on a second face (4202) at least one electronic component (452) and a electrically conductive connector (423) and the method comprises the additive manufacturing of a third electronic card (430) comprising at least on a first face (4301) an electrically conductive connector (433) and a cavity (443) and the superposition of the third card (430) on the second card (420) so that the first face (4301) of the third card (430) faces the second face (4202) of the second card (420) ), that the electrically conductive connector (433) of the third card (430) is in electrical contact with the electrically conductive connector (423) of the second face (4202) of the second card (420) and that the electronic component (452 ) of the second card (420) is placed in the cavity (443) of the third card (430). [Claim 10] Method of manufacturing an electronic circuit according to any one of claims 1 to 9, further comprising putting the superimposed electronic cards (130) under press.
PCT/FR2023/050527 2022-04-13 2023-04-12 Process for manufacturing interlocked electronic modules by additive manufacturing WO2023198992A1 (en)

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JP2006114621A (en) * 2004-10-13 2006-04-27 Dt Circuit Technology Co Ltd Wiring plate with built-in component and manufacturing method thereof
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US10575408B2 (en) 2017-03-10 2020-02-25 University Of Masschusetts Electrical connectors, circuit boards, and fabrication techniques

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3465435A (en) * 1967-05-08 1969-09-09 Ibm Method of forming an interconnecting multilayer circuitry
JP2006114621A (en) * 2004-10-13 2006-04-27 Dt Circuit Technology Co Ltd Wiring plate with built-in component and manufacturing method thereof
US20160229119A1 (en) * 2015-02-10 2016-08-11 Optomec, Inc. Fabrication of Three Dimensional Structures By In-Flight Curing of Aerosols
US10575408B2 (en) 2017-03-10 2020-02-25 University Of Masschusetts Electrical connectors, circuit boards, and fabrication techniques

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