WO2023197352A1 - 显示背板及显示装置 - Google Patents

显示背板及显示装置 Download PDF

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Publication number
WO2023197352A1
WO2023197352A1 PCT/CN2022/088331 CN2022088331W WO2023197352A1 WO 2023197352 A1 WO2023197352 A1 WO 2023197352A1 CN 2022088331 W CN2022088331 W CN 2022088331W WO 2023197352 A1 WO2023197352 A1 WO 2023197352A1
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WO
WIPO (PCT)
Prior art keywords
display backplane
sub
virtual
type
metal layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2022/088331
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English (en)
French (fr)
Inventor
胡泽敏
王超
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wuhan China Star Optoelectronics Technology Co Ltd
Original Assignee
Wuhan China Star Optoelectronics Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by Wuhan China Star Optoelectronics Technology Co Ltd filed Critical Wuhan China Star Optoelectronics Technology Co Ltd
Priority to US17/755,862 priority Critical patent/US20240162243A1/en
Publication of WO2023197352A1 publication Critical patent/WO2023197352A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/441—Interconnections, e.g. scanning lines
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/441—Interconnections, e.g. scanning lines
    • H10D86/443—Interconnections, e.g. scanning lines adapted for preventing breakage, peeling or short circuiting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
    • H10H29/14—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components
    • H10H29/142—Two-dimensional arrangements, e.g. asymmetric LED layout
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals

Definitions

  • the present application relates to the field of display, and in particular, to a display backplane and a display device.
  • the present invention provides a display backplane and a display device, which can alleviate the current technical problem of abnormal short circuits of different types of circuits on the cutting side when cutting a substrate.
  • An embodiment of the present application provides a display backplane, which includes a wiring layer; wherein the wiring layer includes:
  • a plurality of second type traces are arranged along a second direction, the first direction is perpendicular to the second direction, and at least one of the second type traces includes a second trace that is flush with the edge of the display backplane. end face;
  • the first type of wiring is insulated from the second type of wiring, and in the top view direction of the display backplane, the first end surface and the second end surface are arranged in a non-overlapping manner.
  • any one of the first end surfaces is parallel to the second direction, and any one of the second end surfaces is parallel to the first direction.
  • the wiring layer includes a first metal layer, a second metal layer, and an insulating layer between the first metal layer and the second metal layer; the wiring layer parallel to the second direction
  • the first end surface includes a first sub-surface located on the second metal layer, and the second end surface parallel to the first direction includes a second sub-surface located on the first metal layer.
  • the first type of wiring including the first sub-surface includes: a first part close to the corresponding edge side of the display backplane and located on the second metal layer; a second part away from the The corresponding edge side of the display backplane is located on the first metal layer; the second type of wiring including the second sub-surface includes: a third part, close to the corresponding edge of the display backplane.
  • the insulating layer includes a plurality of first via holes and A plurality of second via holes, the first part is connected to the second part through the first via holes, and the third part is connected to the fourth part through the second via holes.
  • the first end surface including the first sub surface further includes a third sub surface located in the first metal layer
  • the second end surface including the second sub surface further includes a third sub surface located within the first metal layer.
  • a fourth sub-surface in the second metal layer wherein, in the top view direction of the display backplane, the first sub-surface overlaps with the corresponding third sub-surface, and the second sub-surface overlaps with the corresponding third sub-surface. The fourth sub-surface is overlapped.
  • the display backplane includes a first edge parallel to the first direction and a second edge parallel to the second direction; wherein, the first type of trace closest to the first edge corresponds to The line includes a first protrusion facing the first edge, and the second type of trace closest to the second edge includes a second protrusion facing the second edge.
  • the side of the first protrusion close to the corresponding first edge is flush with the corresponding first edge, and the second protrusion is close to the side corresponding to the first edge.
  • the side surfaces of the two edges are flush with the corresponding second edges.
  • At least one of the first end surfaces is parallel to the second direction, at least one of the first end surfaces is parallel to the first direction, at least one of the second end surfaces is parallel to the second direction, and at least one of the first end surfaces is parallel to the second direction.
  • the second end surface is parallel to the first direction.
  • the wiring layer includes a first metal layer, a second metal layer, and an insulating layer between the first metal layer and the second metal layer; the wiring layer parallel to the second direction
  • the first end surface includes a first sub-surface located on the second metal layer, and the second end surface parallel to the first direction includes a second sub-surface located on the first metal layer.
  • the display backplane includes a first edge parallel to the first direction and a second edge parallel to the second direction; wherein, the first type of trace closest to the first edge corresponds to The line includes a first protrusion facing the first edge, and the second type of trace closest to the second edge includes a second protrusion facing the second edge.
  • the display backplane includes at least one virtual cutting frame; at least one of the first type of traces includes a first virtual end face, and at least one of the second type of traces includes a second virtual end face; wherein, in the In the top view direction of the display backplane, the first virtual end surface overlaps with the virtual cutting frame, the second virtual end surface overlaps with the virtual cutting frame, and the first virtual end surface and the second virtual end are not Overlap settings.
  • the virtual cutting frame includes a first virtual cutting line parallel to the first direction and a second virtual cutting line parallel to the second direction; at least one of the first type traces includes at least one A first opening, at least one of the second type traces includes at least a second opening; wherein, in the top view direction of the display backplane, the first virtual cutting line passes through the first opening, and at least one The second type of trace passes through the first opening, the second virtual cutting line passes through the second opening, and at least one of the first type of trace passes through the second opening.
  • the virtual cutting frame includes a first virtual cutting line parallel to the first direction and a second virtual cutting line parallel to the second direction; wherein, in the top view direction of the display backplane , the first virtual cutting line is located between two adjacent first-type traces, and the second virtual cutting line is located between two adjacent second-type traces.
  • the wiring layer includes a first metal layer, a second metal layer, and an insulating layer located between the first metal layer and the second metal layer; the first virtual end surface includes an insulating layer located between the first metal layer and the second metal layer.
  • a first virtual sub-surface of the second metal layer, the second virtual end surface includes a second virtual sub-surface located on the first metal layer.
  • the first type of wiring including the first virtual sub-surface includes: a first sub-portion located in the second metal layer, and in the top view direction of the display backplane, the first The sub-portion passes through the virtual cutting frame; the second sub-portion is located in the first metal layer; the second type of wiring including the second virtual sub-surface includes: located in the first metal layer The third sub-part, which passes through the virtual cutting frame in the top view direction of the display backplane; the fourth sub-part located in the second metal layer; wherein the insulation The layer includes a plurality of third via holes and a plurality of fourth via holes, the second sub-section is connected to both ends of the first sub-section through the third via holes, and the fourth sub-section passes through the The fourth via hole is connected to both ends of the third sub-section.
  • the first virtual end surface including the first virtual sub surface further includes a third virtual sub surface located in the first metal layer, and the second virtual end surface including the second virtual sub surface It also includes a fourth virtual sub-surface located in the second metal layer; wherein, in the top view direction of the display backplane, the first virtual sub-surface overlaps with the corresponding third virtual sub-surface, so The second virtual sub-surface is overlapped with the corresponding fourth virtual sub-surface.
  • the cutting line of the virtual cutting frame is disposed between two adjacent sub-pixels of the display backplane.
  • the display backplane includes a display area and a non-display area located at the bottom of the display area, and the display backplane further includes a gate driving component disposed in the display area.
  • the gate driving component includes a plurality of gate driving devices and a gate driving connection line connecting two adjacent gate driving devices; wherein, in the top view direction of the display backplane, the The arrangement direction of the gate drive connection line and the gate drive device is perpendicular to an edge of the display backplane, and the gate drive connection line includes an end surface flush with the corresponding edge.
  • An embodiment of the present application provides a display device, including at least two splicing screens.
  • the splicing screen includes a display backplane; the display backplane includes a wiring layer; wherein the wiring layer includes:
  • a plurality of second type traces are arranged along a second direction, the first direction is perpendicular to the second direction, and at least one of the second type traces includes a second trace that is flush with the edge of the display backplane. end face;
  • the first type of wiring is insulated from the second type of wiring, and in the top view direction of the display backplane, the first end surface and the second end surface are arranged in a non-overlapping manner.
  • the present invention sets the cutting line in an area where two different types of wiring do not overlap to avoid cutting to different types of wiring at the same time, thereby reducing the risk of cutting different types of wiring.
  • the risk of abnormal short circuit increases the product yield of the display backplane and improves the display effect.
  • FIG. 1 is a schematic top view of a first structure of a display backplane provided by an embodiment of the present invention
  • Figure 2 is a first enlarged view of area C in Figure 1;
  • Figure 3 is a cross-sectional view along A1A2 of Figure 2;
  • Figure 4 is a cross-sectional view along B1B2 of Figure 2;
  • Figure 5 is a second enlarged view of area C in Figure 1;
  • Figure 6 is a first cross-sectional view along A1A2 in Figure 5;
  • Figure 7 is the first cross-sectional view along B1B2 in Figure 5;
  • Figure 8 is a second cross-sectional view along A1A2 in Figure 5;
  • Figure 9 is a second cross-sectional view along B1B2 in Figure 5;
  • Figure 10 is a third enlarged view of area C in Figure 1;
  • Figure 11 is a cross-sectional view along A1A2 of Figure 10;
  • Figure 12 is a cross-sectional view along B1B2 of Figure 10;
  • Figure 13 is an enlarged view of area D in Figure 1;
  • Figure 14 is a schematic top view of the second structure of a display backplane provided by an embodiment of the present invention.
  • Figure 15 is a first enlarged view of area E of Figure 14;
  • Figure 16 is a second enlarged view of area E in Figure 14;
  • Figure 17 is a cross-sectional view along A1A2 of Figure 15 or Figure 16;
  • Figure 18 is a cross-sectional view along the second virtual cutting line 420 of Figure 16;
  • Figure 19 is a third enlarged view of area E in Figure 14;
  • Figure 20 is a cross-sectional view along A1A2 of Figure 19;
  • Figure 21 is a cross-sectional view along the second virtual cutting line 420 of Figure 15 or Figure 19;
  • Figure 22 is a fourth enlarged view of area E in Figure 14;
  • Figure 23 is a first cross-sectional view along A1A2 of Figure 22;
  • Figure 24 is a first cross-sectional view along the second virtual cutting line 420 of Figure 22;
  • Figure 25 is a second cross-sectional view along A1A2 of Figure 22;
  • Figure 26 is a second cross-sectional view along the second virtual cutting line 420 of Figure 22;
  • Figure 27 is an enlarged view of area F of Figure 14;
  • Figure 28 is a step flow chart of the manufacturing method of a display backplane provided by an embodiment of the present invention.
  • 29A to 29E are schematic flow diagrams of a method for manufacturing a display backplane according to an embodiment of the present invention.
  • Figure 30 is a schematic structural diagram of a display device provided by an embodiment of the present invention.
  • the present application provides a display backplane and a display device.
  • a display backplane and a display device.
  • the present application will be further described in detail below with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described here are only used to explain the present application and are not used to limit the present application.
  • Embodiments of the present application provide a display backplane and a display device. Each is explained in detail below. It should be noted that the order of description of the following embodiments does not limit the preferred order of the embodiments.
  • an embodiment of the present invention provides a display backplane 100.
  • the display backplane 100 includes a wiring layer; wherein the wiring layer includes:
  • a plurality of second type traces 300 are arranged along a second direction, the first direction is perpendicular to the second direction, and at least one of the second type traces 300 includes an edge 103 of the display backplane 100 .
  • the second end face 310 is aligned;
  • the first end surface 210 and the second end surface 310 are arranged non-overlappingly.
  • the present invention sets the cutting line in an area where two different types of wiring do not overlap to avoid cutting to different types of wiring at the same time, thereby reducing the risk of cutting different types of wiring.
  • the risk of abnormal short circuit increases the product yield of the display backplane and improves the display effect.
  • the display backplane 100 includes a wiring layer.
  • the wiring layer includes a plurality of first-type wiring lines 200 arranged along a first direction.
  • a plurality of second type traces 300 are arranged in a second direction.
  • At least one of the first type traces 200 includes a first end surface 210 flush with the edge 103 of the display backplane 100 .
  • the first direction is aligned with the edge 103 of the display backplane 100 .
  • the second direction is vertical, and at least one of the second type traces 300 includes a second end surface 310 flush with the edge 103 of the display backplane 100.
  • the One end surface 210 and the second end surface 310 are arranged non-overlappingly.
  • the cutting line When cutting the substrate 700, in the cutting direction perpendicular to the substrate 700, the cutting line only passes through one type of trace at the same time. In the top view direction, different types of traces that overlap with the cutting line do not have overlapping areas, so when cutting the substrate After 700, there is no overlapping area for different types of traces on the edge 103 of the display backplane 100, which avoids cutting to different types of traces at the same time, thereby reducing the risk of abnormal short circuits of different types of lines caused by cutting, and improving the performance of the display backplane. A product yield of 100% improves the display effect.
  • the wiring layer includes a first metal layer 2001, a second metal layer 3001 and is located between the first metal layer 2001 and the second metal layer 3001.
  • the insulating layer 110 and the first metal layer 2001 are located between the first metal layer 2001 and the second metal layer 3001.
  • any one of the first end surfaces 210 is parallel to the second direction, and any one of the second end surfaces 310 is parallel to the first direction.
  • the cutting frame 800 includes a first cutting line 810 parallel to the first direction and a second cutting line 820 parallel to the second direction.
  • the first cutting line 810 is drawn in the top view direction of the display back panel 100 .
  • the first cutting line 810 will only cut the second type trace. 300
  • the second cutting line 820 will only cut to the first type of trace 200, thereby avoiding cutting to different types of traces at the same time, thereby reducing the risk of abnormal short circuiting of different types of lines due to cutting, and improving the quality of the display backplane 100
  • the product yield rate is improved and the display effect is improved.
  • At least one of the first end surfaces 210 is parallel to the second direction, at least one of the first end surfaces 210 is parallel to the first direction, and at least one of the first end surfaces 210 is parallel to the first direction.
  • the second end surface 310 is parallel to the second direction, and at least one second end surface 310 is parallel to the first direction.
  • the first type of trace 200 can include at least one first opening
  • at least one of the second type of trace 300 can include At least one second opening 301.
  • at least one of the first type of traces 200 passes through the second opening 301
  • at least one of the second type of traces 300 passes through all the second openings 301.
  • the first opening, the first cutting line 810 passes through the first opening, and the second cutting line 820 passes through the second opening 301; or two adjacent first type traces 200 or adjacent
  • the gap 302 between the two second type traces 300 is patterned so that part of the gap edge is exactly located on the cutting line, so that in the top view direction of the display backplane 100, the duty ratio of the metal line is increased, and the metal line is It has a reflective effect, which can improve the reflection of display light, thereby increasing the display light rate.
  • the first end surface 210 parallel to the second direction includes a first sub-surface 211 located on the second metal layer 3001, and is parallel to the first direction.
  • the parallel second end surface 310 includes a second sub-surface located on the first metal layer 2001 .
  • the first type of traces 200 originally in the first metal layer 2001 can be changed to the edge 103 of the display backplane 100, that is, at the cutting line, by changing the first type of traces 200 perpendicular to the corresponding cutting line to the desired position.
  • the second metal layer 3001 is cut, so that at the corresponding cutting line, only one of the first metal layer 2001 and the second metal layer 3001 is cut (replace the first type of wiring 200 At that time, only the second metal layer 3001 is cut, which further reduces the risk of short circuiting different types of signal lines when cutting different layers; the method and principle of changing the second type of wiring 300 are the same, thereby reducing the risk of cutting different types of signal lines.
  • the risk of abnormal short-circuiting of lines increases the product yield of the display backplane 100 and improves the display effect.
  • the first type of trace 200 including the first sub-surface 211 includes: a first part 220 , close to the corresponding edge 103 side of the display backplane 100 , and is located on the second metal layer 3001; the second part 230 is away from the corresponding edge 103 side of the display backplane 100, and is located on the first metal layer 2001; the second part 230 including the second sub-surface
  • the second type of trace 300 includes: a third part, close to the corresponding edge 103 of the display backplane 100 and located on the first metal layer 2001; and a fourth part, far away from the corresponding edge of the display backplane 100.
  • the insulating layer 110 includes a plurality of first via holes 111 and a plurality of second via holes, and the first portion 220 passes through the first via holes 111 Connected to the second part 230, the third part is connected to the fourth part through the second via hole.
  • the first type of wiring 200 uses the first via hole 111 to jump to the second metal layer 3001, and the second type of wiring 300 uses the second via to jump to the first metal layer 3001.
  • Metal layer 2001 at the corresponding cutting line, only one of the first metal layer 2001 and the second metal layer 3001 is cut, further reducing the risk of short circuiting different types of signal lines in different layers.
  • the second type wiring 300 has the same wiring method and principle, thereby reducing the risk of abnormal short circuiting of different types of lines caused by cutting, increasing the product yield of the display backplane 100, and improving the display effect.
  • the first end surface 210 including the first sub-surface 211 also includes a third sub-surface 212 located in the first metal layer 2001
  • the second end surface 310 including the second sub-surface also includes a fourth sub-surface located in the second metal layer 3001; wherein, in the top view direction of the display backplane 100, the first sub-surface The surface 211 overlaps with the corresponding third sub-surface 212, and the second sub-surface overlaps with the corresponding fourth sub-surface.
  • the overlapping area corresponds to two traces of the same type of signal. Even when cutting, the upper and lower traces are short-circuited, for example, the first sub-section of the first type of trace 200
  • the lines corresponding to surface 211 and the third sub-surface 212 are short-circuited on the side.
  • the two lines are the same type of wiring. There is no need to worry about signal abnormalities caused by short-circuiting, and parallel connection can be achieved to reduce the wiring resistance. It is not necessary to interrupt the first type of trace 200 or the second type of trace 300 in each pixel, thereby having less impact on the original pixel design. At the same time, there is no need to interrupt the metal layer multiple times and damage the metal trace to the original pixel design.
  • the line impedance has almost no impact, thereby reducing the risk of abnormal short circuiting of different types of lines due to cutting, increasing the product yield of the display backplane 100, and improving the display effect.
  • the first type of trace 200 including the first sub-surface 211 also includes a fifth trace connected to the second portion 230 and in the same layer.
  • Part 240, the second type of wiring 300 including the second sub-surface also includes a sixth part connected to the fourth part and on the same layer.
  • the fifth part 240 corresponds to the third sub-surface 212
  • the sixth part corresponds to the fourth sub-surface.
  • the first part 220 and the fifth part 240 of the first type of trace 200 are short-circuited on the side.
  • the two lines are essentially the same trace of the same type of trace. There is no need to worry about signal abnormalities caused by the short circuit. , and can achieve parallel connection to reduce wiring resistance, thereby reducing the risk of abnormal short circuits of different types of lines caused by cutting, improving the product yield of the display backplane 100 and improving the display effect.
  • the display backplane 100 includes a first edge 101 parallel to the first direction and a second edge 102 parallel to the second direction; wherein, the last edge 102 is parallel to the first direction.
  • the first type of trace 200 close to the first edge 101 includes a first protrusion facing the first edge 101
  • the second type of trace 300 closest to the second edge 102 A second protrusion 340 is included toward the second edge 102 .
  • the first protrusion and the second protrusion 340 can increase the duty ratio of the metal lines.
  • the metal lines have a reflective effect and can improve the reflection of display light. Thereby improving the display light rate.
  • the first protrusion is close to the side corresponding to the first edge 101 and the side corresponding to the first edge 101 .
  • One edge 101 is flush
  • the side of the second protrusion 340 close to the corresponding second edge 102 is flush with the corresponding second edge 102 .
  • the first protrusion and the second protrusion 340 are used to fill the gaps of the metal lines to the maximum extent and improve the reflection of display light, thereby improving the display light rate.
  • the display backplane 100 includes at least one virtual cutting frame 400; at least one of the first type of traces 200 includes a first Virtual end surface 2100, at least one of the second type traces 300 includes a second virtual end surface 3100; wherein, in the top view direction of the display backplane 100, the first virtual end surface 2100 overlaps the virtual cutting frame 400 , the second virtual end face 3100 overlaps with the virtual cutting frame 400, and the first virtual end face 2100 and the second virtual end face 3100 are arranged non-overlappingly.
  • multiple cutting frames 800 can be designed.
  • the first virtual end face 2100 corresponds to the first end face 210.
  • the second virtual end face 3100 corresponds to the second end face 310.
  • the cutting line In the cutting direction perpendicular to the substrate 700, the cutting line only passes through one type of wiring at the same time. In the top view direction, different types of wiring coincide with the cutting line.
  • the traces do not overlap each other, so that after cutting the substrate 700, different types of traces do not overlap each other on the edge 103 of the display backplane 100, avoiding cutting to different types of traces at the same time, thereby reducing the risk of different types of traces caused by cutting.
  • the risk of abnormal short-circuiting of lines increases the product yield of the display backplane 100 and improves the display effect.
  • the cutting line of the virtual cutting frame 400 can pass through the pixels of the display backplane 100, that is, when cutting, some pixels are damaged, so as to achieve Precisely cut to size.
  • the cutting line of the virtual cutting frame 400 is disposed between two adjacent sub-pixels of the display backplane 100 .
  • the virtual cutting frame 400 includes a first virtual cutting line 410 parallel to the first direction, and a first virtual cutting line 410 parallel to the second direction.
  • the second opening 301 at least one of the first type traces 200 passes through the second opening 301.
  • the Category II traces 300 have no overlapping coverage areas, which avoids cutting to different types of traces at the same time, thus reducing the risk of abnormal short-circuiting of different types of lines due to cutting, increasing the product yield of the display backplane 100 and improving the display effect.
  • the first opening and the second opening 301 are continuously arranged.
  • the virtual cutting frame 400 is located at the continuously arranged first opening and the second opening 301 . within the second opening 301.
  • the virtual cutting frame 400 includes a first virtual cutting line 410 parallel to the first direction, and a second virtual cutting line 410 parallel to the second direction.
  • Virtual cutting line 420 ; wherein, in the top view direction of the display backplane 100, the first virtual cutting line 410 is located between two adjacent first type traces 200, and the second virtual cutting line 420 is located between two adjacent second type traces 300 .
  • the first virtual end face 2100 includes a first virtual sub-face 2110 located on the second metal layer 3001
  • the second virtual end face 3100 includes a second virtual sub-face 2110 located on the first metal layer 2001 . Sub-face.
  • the first type of traces 200 originally in the first metal layer 2001 can be changed to the first type of traces 200 perpendicular to the corresponding virtual cutting line at the edge 103 of the display backplane 100, that is, at the virtual cutting line. to the second metal layer 3001, so that at the corresponding virtual cutting line, only one of the first metal layer 2001 and the second metal layer 3001 is cut (for the first type of wiring 200
  • the second type of wiring 300 uses the same method and principle for changing wires, thereby reducing the risk of cutting.
  • the risk of causing abnormal short circuits of different types of lines increases the product yield of the display backplane 100 and improves the display effect.
  • the first virtual cutting line 410 passes through two adjacent first-type traces 200 and two adjacent first-type traces 200 at least one of the second type traces 300 passes through the gap between two adjacent first type traces 200
  • the second virtual cutting line 420 passes through the two adjacent ones of the first type traces 200
  • the second type of trace 300 and the gap 302 between two adjacent second type traces 300, at least one of the first type of trace 200 passes through the two adjacent second type traces 300.
  • the first type of trace 200 including the first virtual sub-surface 2110 includes: a first sub-portion 2200 located in the second metal layer 3001, In the top view direction of the display backplane 100, the first sub-section 2200 passes through the virtual cutting frame 400; the second sub-section 2300 located in the first metal layer 2001; includes the second virtual cutting frame 400; The second type of wiring 300 on the sub-surface includes: a third sub-section located in the first metal layer 2001.
  • the third sub-section passes through the Virtual cutting frame 400; the fourth sub-section located in the second metal layer 3001; wherein the insulating layer 110 includes a plurality of third via holes 113 and a plurality of fourth via holes, the second sub-section 2300
  • the third via hole 113 is connected to both ends of the first sub-section 2200
  • the fourth sub-section is connected to both ends of the third sub-section through the fourth via hole.
  • the first type of trace 200 uses the third via hole 113 to jump to the second metal layer 3001, and the second type of trace 300 uses the fourth via to jump to the first metal layer 3001.
  • Metal layer 2001 at the corresponding virtual cutting line, only one of the first metal layer 2001 and the second metal layer 3001 is cut, which further reduces the risk of short circuits of different types of signal lines in different layers. Risk;
  • the second type of wiring 300 has the same wiring method and principle, thereby reducing the risk of abnormal short-circuiting of different types of lines caused by cutting, increasing the product yield of the display backplane 100, and improving the display effect.
  • the first virtual end surface 2100 including the first virtual sub-surface 2110 also includes a third virtual sub-surface located in the first metal layer 2001.
  • Surface 2120, the second virtual end surface 3100 including the second virtual sub-surface also includes a fourth virtual sub-surface located in the second metal layer 3001; wherein, in the top view direction of the display back panel 100 , the first virtual sub-surface 2110 is overlapped with the corresponding third virtual sub-surface 2120, and the second virtual sub-surface is overlapped with the corresponding fourth virtual sub-surface.
  • the overlapping area corresponds to two traces of the same type of signal. Even when cutting, the upper and lower traces are short-circuited, for example, the first sub-section of the first type of trace 200
  • the lines corresponding to surface 211 and the third sub-surface 212 are short-circuited on the side.
  • the two lines are the same type of wiring. There is no need to worry about signal abnormalities caused by short-circuiting, and parallel connection can be achieved to reduce the wiring resistance. It is not necessary to interrupt the first type of trace 200 or the second type of trace 300 in each pixel, thereby having less impact on the original pixel design. At the same time, there is no need to interrupt the metal layer multiple times and damage the metal trace to the original pixel design.
  • the line impedance has almost no impact, thereby reducing the risk of abnormal short circuiting of different types of lines due to cutting, increasing the product yield of the display backplane 100, and improving the display effect.
  • the first type of trace 200 including the first virtual sub-surface 2110 also includes a trace connected to the second sub-portion 2300 and on the same layer.
  • the fifth sub-section 2400, including the second type of wiring 300 of the second virtual sub-surface 3110, also includes a sixth sub-section connected to the fourth sub-section and on the same layer.
  • the fifth sub-part 2400 corresponds to the third virtual sub-surface 2120
  • the sixth sub-part corresponds to the fourth virtual sub-surface.
  • the first sub-section 2200 and the fifth sub-section 2400 of the first type of trace 200 are short-circuited on the side.
  • the two lines are the same trace of the same type of trace, and there is no need to worry about short-circuit.
  • the display backplane 100 includes a display area G and a non-display area located at the bottom of the display area G.
  • the display backplane 100 further includes a display area disposed on the display area G.
  • the cutting lines on the upper left and right edges 103 can be cut directly without considering the impact on the gate driving component 500 .
  • the gate driving component 500 includes a plurality of gate driving devices 510 and a gate driving connection line 520 connecting two adjacent gate driving devices 510; Wherein, in the top view direction of the display backplane 100, the arrangement direction of the gate drive connection lines 520 and the gate drive devices 510 is perpendicular to an edge 103 of the display backplane 100.
  • the connecting line 520 includes an end surface flush with the corresponding edge 103 .
  • Cutting the cutting line to the gate driving connection line 520 can reduce damage to the gate driving device 510, avoid driving failure, and facilitate the layout of other devices.
  • the virtual cutting frame 400 passes through the gate driving connection line 520 .
  • the arrangement direction of the gate drive connection line 520 and the gate drive device 510 is the first direction, and the second virtual cutting line 420 passes through the gate drive connection line 520, which can reduce the impact on the gate drive connection line 520.
  • the gate driving device 510 is destroyed to avoid driving failure and facilitate the layout of other devices.
  • the display backplane 100 includes a substrate 120, an active layer located on the substrate 120, a first insulating layer located on the active layer, and a first insulating layer located on the first insulating layer. a gate electrode layer, a second insulating layer located on the gate electrode layer, and a source and drain layer located on the second insulating layer.
  • the source and drain layers may serve as the wiring layers, that is, the source and drain layers include the first metal layer 2001, the insulating layer 110, and the second metal layer 3001. .
  • the display backplane 100 can be used as a driving array device of the direct display display device 10 or as a driving array device of a backlight unit, which is not specifically limited here.
  • the display backplane 100 when the display backplane 100 is a direct display type, the display backplane 100 further includes a light-emitting device, and the light-emitting device may include an OLED (Organic Light-Emitting Diode (organic light-emitting diode) materials can also include Micro LED or Mini LED, which are not specifically limited here.
  • the present invention sets the cutting line in an area where two different types of wiring do not overlap to avoid cutting to different types of wiring at the same time, thereby reducing the risk of cutting different types of wiring.
  • the risk of abnormal short circuit increases the product yield of the display backplane and improves the display effect.
  • an embodiment of the present invention also provides a method for manufacturing a display backplane 100, which includes:
  • a cutting frame 800 including a first cutting line 810 parallel to the first direction and a second cutting line 820 parallel to the second direction.
  • At least one of the first type of traces 200 passes through the second slit 610
  • at least one of the second type of traces 300 passes through the first slit
  • the first cutting line 810 passes through the first slit 610 .
  • slit, the second cutting line 820 passes through the second slit 610;
  • S800 Use the cutting frame 800 to cut the substrate 700 to form the display backplane 100.
  • the present invention sets the cutting line in an area where two different types of wiring do not overlap to avoid cutting to different types of wiring at the same time, thereby reducing the risk of cutting different types of wiring.
  • the risk of abnormal short circuit increases the product yield of the display backplane and improves the display effect.
  • the manufacturing method of the display backplane 100 includes:
  • the material of the substrate 120 may be a hard material, such as glass, or a flexible material, such as polyimide, which is not specifically limited here.
  • the first metal material layer may be a layer of metal or a multi-layer laminated metal, which is not specifically limited here.
  • step S400 includes:
  • S410a Form an insulating layer 110 including a plurality of first via holes 111 and a plurality of second via holes on the side of the first metal layer 2001 away from the substrate 120.
  • step S400 includes:
  • S410b Form a plurality of first via holes 111, a plurality of second via holes, a plurality of third via holes 113, and a plurality of fourth via holes on the side of the first metal layer 2001 away from the substrate 120. insulating layer 110.
  • the second metal material layer 600 can be a layer of metal or a multi-layer stacked metal, which is not specifically limited here.
  • the first slit and the second slit 610 may be respectively the first opening and the second opening 301 of the display backplane 100 , or may be respectively the two adjacent openings.
  • the first type of trace 200 may include at least one first opening
  • at least one of the second type of trace 300 may include at least one second opening 301.
  • the metal line has a reflective effect, which can improve the reflection of display light, thereby increasing the display light rate. .
  • a cutting frame 800 including a first cutting line 810 parallel to the first direction and a second cutting line 820 parallel to the second direction.
  • At least one of the first type of traces 200 passes through the second slit 610
  • at least one of the second type of traces 300 passes through the first slit
  • the first cutting line 810 passes through the first slit 610 .
  • slit, the second cutting line 820 passes through the second slit 610, please refer to FIGS. 29C to 29E.
  • FIG. 29E is a top perspective view of area H in FIG. 29D.
  • the cutting line When cutting the substrate 700, in the cutting direction perpendicular to the substrate 700, the cutting line only passes through one type of wiring at the same time. In the top view direction, it coincides with the cutting line. There is no overlapping area for different types of traces. Therefore, after cutting the substrate 700, there is no overlapping area for different types of traces on the edge 103 of the display backplane 100. This avoids cutting different types of traces at the same time, thereby reducing cutting costs. The risk of causing abnormal short circuits of different types of lines increases the product yield of the display backplane 100 and improves the display effect.
  • the cutting line of the cutting frame 800 is disposed between two adjacent sub-pixels of the display backplane 100 .
  • the cutting frame 800 includes a first cutting line 810 parallel to the first direction and a second cutting line 820 parallel to the second direction; at least one of the first type of traces 200 includes at least one first opening, and at least one of the second type traces 300 includes at least one second opening 301; wherein, in the top view direction of the display backplane 100, the first cutting line 810 passes through all The first opening, at least one of the second type of traces 300 passes through the first opening, the second cutting line 820 passes through the second opening 301, and at least one of the first type of traces 200 passes through through the second opening 301.
  • the first opening and the second opening 301 are continuously arranged.
  • the corresponding cutting frame 800 is located at the continuously arranged first opening and the second opening 301 . within the second opening 301.
  • the cutting frame 800 includes a first cutting line 810 parallel to the first direction and a second cutting line 820 parallel to the second direction; wherein, on the display backplane 100 In the top view direction, the first cutting line 810 is located between two adjacent first-type traces 200 , and the second cutting line 820 is located between two adjacent second-type traces 300 .
  • the first end surface 210 includes a first sub-surface 211 located on the second metal layer 3001
  • the second end surface 310 includes a second sub-surface located on the first metal layer 2001 .
  • the first type of wiring 200 including the first sub-surface 211 includes: a first sub-portion 2200 located in the second metal layer 3001. When viewed from above the display backplane 100 direction, the first sub-portion 2200 passes through the cutting frame 800; the second sub-portion 2300 located in the first metal layer 2001; and the second type of trace 300 including the second sub-surface It includes: a third sub-section located in the first metal layer 2001, which passes through the cutting frame 800 in the top view direction of the display backplane 100; and is located in the second metal layer.
  • the first end surface 210 including the first sub-surface 211 also includes a third sub-surface 212 located in the first metal layer 2001, and the third sub-surface including the second sub-surface
  • the two end surfaces 310 also include a fourth sub-surface located in the second metal layer 3001; wherein, in the top view direction of the display backplane 100, the first sub-surface 211 and the corresponding third sub-surface 212 Overlapping arrangement, the second sub-surface is overlapped with the corresponding fourth sub-surface.
  • the display backplane 100 includes a display area G and a non-display area located at the periphery of the display area G.
  • the display backplane 100 further includes a gate driving component disposed in the display area G. 500.
  • the gate driving component 500 includes a plurality of gate driving devices 510 and a gate driving connection line 520 connecting two adjacent gate driving devices 510; wherein, on the display backplane In the top view direction of 100, the arrangement direction of the gate driving connection lines 520 and the gate driving devices 510 is perpendicular to an edge 103 of the display backplane 100, and the gate driving connection lines 520 include corresponding to the Edge 103 flush end face.
  • S800 Use the cutting frame 800 to cut the substrate 700 to form the display backplane 100.
  • the present invention sets the cutting line in an area where two different types of wiring do not overlap to avoid cutting to different types of wiring at the same time, thereby reducing the risk of cutting different types of wiring.
  • the risk of abnormal short circuit increases the product yield of the display backplane and improves the display effect.
  • an embodiment of the present invention also provides a display device 10 that includes at least two splicing screens 20 , and the splicing screens 20 include any one of the above display backplanes 100 .
  • the display device 10 further includes a device main body, which may include a middle frame, frame glue, etc.
  • the display device 10 may be a display terminal such as a mobile phone, tablet, or television, which is not limited here.
  • the display backplane 100 can be used as a driving array device of the direct display display device 10 or as a driving array device of a backlight unit, which is not specifically limited here.
  • the display backplane 100 serves as a driving array device for a direct-display display device 10.
  • the display device 10 further includes a light-emitting device.
  • the light-emitting device may include an OLED (Organic Light-Emitting Device).
  • Diode (organic light-emitting diode) materials can also include Micro LED or Mini LED, which are not specifically limited here.
  • the display backplane 100 serves as a driving array device for a backlight unit
  • the display device 10 further includes a backlight unit, a liquid crystal layer, a color filter layer, and upper and lower polarizing layers.
  • Embodiments of the present invention disclose a display backplane and a display device; the display backplane includes a wiring layer, and the wiring layer includes a plurality of first type wiring lines arranged along a first direction, and a plurality of first type wiring lines arranged along a second direction.
  • second type traces at least one first type trace includes a first end surface flush with the edge of the display backplane, at least one second type trace includes a second end surface flush with the edge of the display backplane, in In the top view direction of the display backplane, the first end face and the second end face are arranged non-overlappingly; by optimizing the arrangement and patterning of the traces, the present invention sets the cutting line in an area where the two different types of traces do not overlap. , avoid cutting to different types of traces at the same time, thereby reducing the risk of abnormal short circuits of different types of lines caused by cutting, increasing the product yield of the display backplane, and improving the display effect.

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Abstract

一种显示背板（100）及显示装置（10），显示背板（100）包括走线层，走线层包括沿第一方向（Y）排列的多条第一类走线（200）、及沿第二方向（X）排列的多条第二类走线（300），至少一第一类走线（200）包括与显示背板（100）的边缘（103）平齐的第一端面（210），至少一第二类走线（300）包括与显示背板（100）的边缘（103）平齐的第二端面（310），在显示背板（100）的俯视方向上，第一端面（210）第二端面（310）非重叠设置。

Description

显示背板及显示装置 技术领域
本申请涉及显示领域，尤其涉及一种显示背板及显示装置。
 背景技术
近些年，大尺寸的显示装置越来越受到消费者喜爱，而大尺寸的显示装置通过整面制作较为困难，需要通过多个拼接屏拼接得到，拼接屏可以由稍大尺寸的基板切割成较小尺寸的显示背板，目前，在切割基板时，当切割至相邻较近的金属线层时，容易在切割侧面产生线路连接，若相接线路是不同类型信号时，则会产生异常短接现象，导致显示异常。
因此，亟需一种显示背板及显示装置以解决上述技术问题。
 技术问题
本发明提供一种显示背板及显示装置，可以缓解目前在切割基板时，切割侧面产生不同类型线路异常短接的技术问题。
 技术解决方案
为解决上述问题，本申请提供的技术方案如下：
本申请实施例提供了一种显示背板，所述显示背板包括走线层；其中，所述走线层包括：
沿第一方向排列的多条第一类走线，至少一所述第一类走线包括与所述显示背板的边缘平齐的第一端面；
沿第二方向排列的多条第二类走线，所述第一方向与所述第二方向垂直，至少一所述第二类走线包括与所述显示背板的边缘平齐的第二端面；
其中，所述第一类走线与所述第二类走线绝缘设置，在所述显示背板的俯视方向上，所述第一端面与所述第二端面非重叠设置。
优选的，任一所述第一端面与所述第二方向平行，任一所述第二端面与所述第一方向平行。
优选的，所述走线层包括第一金属层、第二金属层、及位于所述第一金属层与所述第二金属层之间的绝缘层；与所述第二方向平行的所述第一端面包括位于所述第二金属层的第一子面，与所述第一方向平行的所述第二端面包括位于所述第一金属层的第二子面。
优选的，包括所述第一子面的所述第一类走线包括：第一部分，靠近所述显示背板的对应边缘一侧，且位于所述第二金属层；第二部分，远离所述显示背板的对应边缘一侧，且位于所述第一金属层；包括所述第二子面的所述第二类走线包括：第三部分，靠近所述显示背板的对应边缘一侧，且位于所述第一金属层；第四部分，远离所述显示背板的对应边缘一侧，且位于所述第二金属层；其中，所述绝缘层包括多个第一过孔和多个第二过孔，所述第一部分通过所述第一过孔与所述第二部分连接，所述第三部分通过所述第二过孔与所述第四部分连接。
优选的，包括所述第一子面的所述第一端面还包括位于所述第一金属层内的第三子面，包括所述第二子面的所述第二端面还包括位于所述第二金属层内的第四子面；其中，在所述显示背板的俯视方向上，所述第一子面与对应所述第三子面重叠设置，所述第二子面与对应所述第四子面重叠设置。
优选的，所述显示背板包括与所述第一方向平行的第一边缘及与所述第二方向平行的第二边缘；其中，最靠近对应所述第一边缘的所述第一类走线包括朝向对应所述第一边缘的第一凸起，最靠近对应所述第二边缘的所述第二类走线包括朝向对应所述第二边缘的第二凸起。
优选的，在所述显示背板的俯视方向上，所述第一凸起靠近对应所述第一边缘的侧面与对应所述第一边缘平齐，所述第二凸起靠近对应所述第二边缘的侧面与对应所述第二边缘平齐。
优选的，至少一所述第一端面与所述第二方向平行，至少一所述第一端面与所述第一方向平行，至少一所述第二端面与所述第二方向平行，至少一所述第二端面与所述第一方向平行。
优选的，所述走线层包括第一金属层、第二金属层、及位于所述第一金属层与所述第二金属层之间的绝缘层；与所述第二方向平行的所述第一端面包括位于所述第二金属层的第一子面，与所述第一方向平行的所述第二端面包括位于所述第一金属层的第二子面。
优选的，所述显示背板包括与所述第一方向平行的第一边缘及与所述第二方向平行的第二边缘；其中，最靠近对应所述第一边缘的所述第一类走线包括朝向对应所述第一边缘的第一凸起，最靠近对应所述第二边缘的所述第二类走线包括朝向对应所述第二边缘的第二凸起。
优选的，所述显示背板包括至少一虚拟切割框；至少一所述第一类走线包括第一虚拟端面，至少一所述第二类走线包括第二虚拟端面；其中，在所述显示背板的俯视方向上，所述第一虚拟端面与所述虚拟切割框重叠，所述第二虚拟端面与所述虚拟切割框重叠，所述第一虚拟端面与所述第二虚拟端非重叠设置。
优选的，所述虚拟切割框包括与所述第一方向平行的第一虚拟切割线、及与所述第二方向平行的第二虚拟切割线；至少一所述第一类走线包括至少一第一开口，至少一所述第二类走线包括至少一第二开口；其中，在所述显示背板的俯视方向上，所述第一虚拟切割线穿过所述第一开口，至少一所述第二类走线穿过所述第一开口，所述第二虚拟切割线穿过所述第二开口，至少一所述第一类走线穿过所述第二开口。
优选的，所述虚拟切割框包括与所述第一方向平行的第一虚拟切割线、及与所述第二方向平行的第二虚拟切割线；其中，在所述显示背板的俯视方向上，所述第一虚拟切割线位于相邻两个所述第一类走线之间，所述第二虚拟切割线位于相邻两个所述第二类走线之间。
优选的，所述走线层包括第一金属层、第二金属层、及位于所述第一金属层与所述第二金属层之间的绝缘层；所述第一虚拟端面包括位于所述第二金属层的第一虚拟子面，所述第二虚拟端面包括位于所述第一金属层的第二虚拟子面。
优选的，包括所述第一虚拟子面的所述第一类走线包括：位于所述第二金属层内的第一子部，在所述显示背板的俯视方向上，所述第一子部穿过所述虚拟切割框；位于所述第一金属层内的第二子部；包括所述第二虚拟子面的所述第二类走线包括：位于所述第一金属层内的第三子部，在所述显示背板的俯视方向上，所述第三子部穿过所述虚拟切割框；位于所述第二金属层内的第四子部；其中，所述绝缘层包括多个第三过孔和多个第四过孔，所述第二子部通过所述第三过孔与所述第一子部的两端连接，所述第四子部通过所述第四过孔与所述第三子部的两端连接。
优选的，包括所述第一虚拟子面的所述第一虚拟端面还包括位于所述第一金属层内的第三虚拟子面，包括所述第二虚拟子面的所述第二虚拟端面还包括位于所述第二金属层内的第四虚拟子面；其中，在所述显示背板的俯视方向上，所述第一虚拟子面与对应所述第三虚拟子面重叠设置，所述第二虚拟子面与对应所述第四虚拟子面重叠设置。
优选的，在所述显示背板的俯视方向上，所述虚拟切割框的切割线设置于所述显示背板的相邻两个子像素之间。
优选的，所述显示背板包括显示区及位于所述显示区底部的非显示区，所述显示背板还包括设置于所述显示区内的栅极驱动部件。
优选的，所述栅极驱动部件包括多个栅极驱动器件和连接相邻两个所述栅极驱动器件的栅极驱动连接线；其中，在所述显示背板的俯视方向上，所述栅极驱动连接线和所述栅极驱动器件的排布方向与显示背板的一边缘垂直，所述栅极驱动连接线包括与对应所述边缘平齐的端面。
本申请实施例提供了一种显示装置，包括至少两个拼接屏，所述拼接屏包括显示背板；所述显示背板包括走线层；其中，所述走线层包括：
沿第一方向排列的多条第一类走线，至少一所述第一类走线包括与所述显示背板的边缘平齐的第一端面；
沿第二方向排列的多条第二类走线，所述第一方向与所述第二方向垂直，至少一所述第二类走线包括与所述显示背板的边缘平齐的第二端面；
其中，所述第一类走线与所述第二类走线绝缘设置，在所述显示背板的俯视方向上，所述第一端面与所述第二端面非重叠设置。
 有益效果
本发明通过对走线进行优化排布以及图案化处理，将切割线设置在两种不同类型走线没有重叠覆盖的区域，避免同时切割至不同类型的走线，从而减小切割导致不同类型线路异常短接的风险，提高了显示背板的产品良率，改善了显示效果。
 附图说明
图1是本发明实施例提供的显示背板的第一种结构的俯视示意图；
图2是图1的区域C的第一种放大图；
图3是图2沿A1A2的截面图；
图4是图2沿B1B2的截面图；
图5是图1的区域C的第二种放大图；
图6是图5沿A1A2的第一种截面图；
图7是图5沿B1B2的第一种截面图；
图8是图5沿A1A2的第二种截面图；
图9是图5沿B1B2的第二种截面图；
图10是图1的区域C的第三种放大图；
图11是图10沿A1A2的截面图；
图12是图10沿B1B2的截面图；
图13是图1的区域D的放大图；
图14是本发明实施例提供的显示背板的第二种结构的俯视示意图；
图15是图14的区域E的第一种放大图；
图16是图14的区域E的第二种放大图；
图17是图15或图16沿A1A2的截面图；
图18是图16沿第二虚拟切割线420的截面图；
图19是图14的区域E的第三种放大图；
图20是图19沿A1A2的截面图；
图21是图15或图19沿第二虚拟切割线420的截面图；
图22是图14的区域E的第四种放大图；
图23是图22沿A1A2的第一种截面图；
图24是图22沿第二虚拟切割线420的第一种截面图；
图25是图22沿A1A2的第二种截面图；
图26是图22沿第二虚拟切割线420的第二种截面图；
图27是图14的区域F的放大图；
图28是本发明实施例提供的显示背板的制作方法的步骤流程图；
图29A至图29E是本发明实施例提供的显示背板的制作方法的流程示意图;
图30是本发明实施例提供的显示装置的结构示意图。
 本发明的实施方式
本申请提供一种显示背板及显示装置，为使本申请的目的、技术方案及效果更加清楚、明确，以下参照附图并举实施例对本申请进一步详细说明。应当理解，此处所描述的具体实施例仅用以解释本申请，并不用于限定本申请。
本申请实施例提供一种显示背板及显示装置。以下分别进行详细说明。需说明的是，以下实施例的描述顺序不作为对实施例优选顺序的限定。
请参阅图1至图27，本发明实施例提供了一种显示背板100，所述显示背板100包括走线层；其中，所述走线层包括：
沿第一方向排列的多条第一类走线200，至少一所述第一类走线200包括与所述显示背板100的边缘103平齐的第一端面210；
沿第二方向排列的多条第二类走线300，所述第一方向与所述第二方向垂直，至少一所述第二类走线300包括与所述显示背板100的边缘103平齐的第二端面310；
其中，在所述显示背板100的俯视方向上，所述第一端面210与所述第二端面310非重叠设置。
本发明通过对走线进行优化排布以及图案化处理，将切割线设置在两种不同类型走线没有重叠覆盖的区域，避免同时切割至不同类型的走线，从而减小切割导致不同类型线路异常短接的风险，提高了显示背板的产品良率，改善了显示效果。
现结合具体实施例对本发明的技术方案进行描述。
本实施例中，请参阅图1、图3、图12，所述显示背板100包括走线层，所述走线层包括沿第一方向排列的多条第一类走线200、及沿第二方向排列的多条第二类走线300，至少一所述第一类走线200包括与所述显示背板100的边缘103平齐的第一端面210，所述第一方向与所述第二方向垂直，至少一所述第二类走线300包括与所述显示背板100的边缘103平齐的第二端面310，在所述显示背板100的俯视方向上，所述第一端面210与所述第二端面310非重叠设置。
在切割基板700时，在垂直于基板700的切割方向上，切割线只同时经过一类走线，在俯视方向上，与切割线重合的不同类走线没有互相重叠的区域，从而在切割基板700后，在显示背板100的边缘103不同类走线没有互相重叠的区域，避免同时切割至不同类型的走线，从而减小切割导致不同类型线路异常短接的风险，提高了显示背板100的产品良率，改善了显示效果。
在本文中，以第一方向为Y轴方向，第二方向为X轴方向为例，可以理解，为避免重复作图，以第二类走线300、及相关的第二边缘102、第二虚拟切割线420、第二切割线820为例进行说明。
在一些实施例中，请参阅图2至图4，所述走线层包括第一金属层2001、第二金属层3001和位于所述第一金属层2001和所述第二金属层3001之间的绝缘层110，第一金属层2001。
在一些实施例中，请参阅图2至图4，任一所述第一端面210与所述第二方向平行，任一所述第二端面310与所述第一方向平行。
切割框800包括与第一方向平行的第一切割线810和与所述第二方向平行的第二切割线820，在切割时，在显示背板100的俯视方向上，将第一切割线810放置于相邻两条第一类走线200之间，将第二切割线820放置于相邻两条第二类走线300之间，第一切割线810只会切割到第二类走线300，第二切割线820只会切割到第一类走线200，从而避免同时切割至不同类型的走线，从而减小切割导致不同类型线路异常短接的风险，提高了显示背板100的产品良率，改善了显示效果。
在一些实施例中，请参阅图10至图12，至少一所述第一端面210与所述第二方向平行，至少一所述第一端面210与所述第一方向平行，至少一所述第二端面310与所述第二方向平行，至少一所述第二端面310与所述第一方向平行。
在排布线路时，请参阅图15、图16（以虚拟切割线为例），可以将所述第一类走线200包括至少一第一开口，至少一所述第二类走线300包括至少一第二开口301，所述显示背板100的俯视方向上，至少一所述第一类走线200穿过所述第二开口301，至少一所述第二类走线300穿过所述第一开口，所述第一切割线810穿过所述第一开口，所述第二切割线820穿过所述第二开口301；或者将相邻两第一类走线200或相邻两第二类走线300之间的间隙302进行图案化，使一部分间隙边缘正好位于切割线上，使在所述显示背板100的俯视方向上，增大金属线的占空比例，金属线有反光作用，可以提高显示光线的反射，从而提高显示出光率。
在一些实施例中，请参阅图7、图9，与所述第二方向平行的所述第一端面210包括位于所述第二金属层3001的第一子面211，与所述第一方向平行的所述第二端面310包括位于所述第一金属层2001的第二子面。
原本在第一金属层2001内的所述第一类走线200，可以在显示背板100的边缘103，即切割线处，将与对应切割线垂直的第一类走线200换线至所述第二金属层3001，这样在对应切割线处，对于所述第一金属层2001和所述第二金属层3001，只切割至二者中一层（对于第一类走线200进行换线时即只切割第二金属层3001），进一步减小了切割异层不同类型信号线短路的风险；所述第二类走线300进行换线的方式和原理相同，从而减小切割导致不同类型线路异常短接的风险，提高了显示背板100的产品良率，改善了显示效果。
在一些实施例中，请参阅图5至图9，包括所述第一子面211的所述第一类走线200包括：第一部分220，靠近所述显示背板100的对应边缘103一侧，且位于所述第二金属层3001；第二部分230，远离所述显示背板100的对应边缘103一侧，且位于所述第一金属层2001；包括所述第二子面的所述第二类走线300包括：第三部分，靠近所述显示背板100的对应边缘103一侧，且位于所述第一金属层2001；第四部分，远离所述显示背板100的对应边缘103一侧，且位于所述第二金属层3001；其中，所述绝缘层110包括多个第一过孔111和多个第二过孔，所述第一部分220通过所述第一过孔111与所述第二部分230连接，所述第三部分通过所述第二过孔与所述第四部分连接。
所述第一类走线200利用所述第一过孔111进行跳线至所述第二金属层3001，所述第二类走线300利用所述第二过孔跳线至所述第一金属层2001，在对应切割线处，对于所述第一金属层2001和所述第二金属层3001，只切割至二者中一层，进一步减小了切割异层不同类型信号线短路的风险；所述第二类走线300进行换线的方式和原理相同，从而减小切割导致不同类型线路异常短接的风险，提高了显示背板100的产品良率，改善了显示效果。
在一些实施例中，请参阅图5、图8、图9，包括所述第一子面211的所述第一端面210还包括位于所述第一金属层2001内的第三子面212，包括所述第二子面的所述第二端面310还包括位于所述第二金属层3001内的第四子面；其中，在所述显示背板100的俯视方向上，所述第一子面211与对应所述第三子面212重叠设置，所述第二子面与对应所述第四子面重叠设置。
在异层的切割面处，上下重叠的区域，对应两相同类型信号的走线，即使在切割时，使上下两走线短接，例如所述第一类走线200的所述第一子面211与第三子面212对应的线路在侧面短接，两线路本就是同一类走线的同一条走线，既不需要担心短接导致信号异常，又可以实现并联减小走线电阻，不必在每个像素内都打断第一类走线200或第二类走线300，从而对原像素设计方案影响较小，同时对原像素设计，无需多次打断金属层，对金属走线阻抗几乎没有影响，从而减小切割导致不同类型线路异常短接的风险，提高了显示背板100的产品良率，改善了显示效果。
在一些实施例中，请参阅图5、图8、图9，包括所述第一子面211的所述第一类走线200还包括与所述第二部分230连接且同层的第五部分240，包括所述第二子面的所述第二类走线300还包括与所述第四部分连接且同层的第六部分。
所述第五部分240对应所述第三子面212，所述第六部分对应所述第四子面。在切割时，例如所述第一类走线200的第一部分220和第五部分240在侧面短接，两线路本就是同一类走线的同一条走线，既不需要担心短接导致信号异常，又可以实现并联减小走线电阻，从而减小切割导致不同类型线路异常短接的风险，提高了显示背板100的产品良率，改善了显示效果。
在一些实施例中，请参阅图1、图10，所述显示背板100包括与所述第一方向平行的第一边缘101及与所述第二方向平行的第二边缘102；其中，最靠近对应所述第一边缘101的所述第一类走线200包括朝向对应所述第一边缘101的第一凸起，最靠近对应所述第二边缘102的所述第二类走线300包括朝向对应所述第二边缘102的第二凸起340。
使在所述显示背板100的俯视方向上，所述第一凸起和所述第二凸起340可以增大金属线的占空比例，金属线有反光作用，可以提高显示光线的反射，从而提高显示出光率。
在一些实施例中，请参阅图1、图10至图12，在所述显示背板100的俯视方向上，所述第一凸起靠近对应所述第一边缘101的侧面与对应所述第一边缘101平齐，所述第二凸起340靠近对应所述第二边缘102的侧面与对应所述第二边缘102平齐。
利用所述第一凸起和所述第二凸起340，最大化填补金属线的空隙，提高显示光线的反射，从而提高显示出光率。
在一些实施例中，请参阅图14、图18、图21、图24、图26，所述显示背板100包括至少一虚拟切割框400；至少一所述第一类走线200包括第一虚拟端面2100，至少一所述第二类走线300包括第二虚拟端面3100；其中，在所述显示背板100的俯视方向上，所述第一虚拟端面2100与所述虚拟切割框400重叠，所述第二虚拟端面3100与所述虚拟切割框400重叠，所述第一虚拟端面2100与所述第二虚拟端面3100非重叠设置。
在设计所述显示背板100的走线时，可以设计多个切割框800，在切割基板700时，可以切割出不同的尺寸，所述第一虚拟端面2100相当于对应所述第一端面210，所述第二虚拟端面3100相当于对应所述第二端面310，在垂直于基板700的切割方向上，切割线只同时经过一类走线，在俯视方向上，与切割线重合的不同类走线没有互相重叠的区域，从而在切割基板700后，在显示背板100的边缘103不同类走线没有互相重叠的区域，避免同时切割至不同类型的走线，从而减小切割导致不同类型线路异常短接的风险，提高了显示背板100的产品良率，改善了显示效果。
在一些实施例中，在所述显示背板100的俯视方向上，所述虚拟切割框400的切割线可以穿过所述显示背板100的像素，即当切割时，损坏部分像素，以达到精确切割尺寸。
在一些实施例中，在所述显示背板100的俯视方向上，所述虚拟切割框400的切割线设置于所述显示背板100的相邻两个子像素之间。减小对像素的破坏，不必在每个像素内都打断第一类走线200或第二类走线300，从而对原像素设计方案影响较小，同时对原像素设计，无需多次打断金属层，对金属走线阻抗几乎没有影响。
在一些实施例中，请参阅图14、图15、图17、图21，所述虚拟切割框400包括与所述第一方向平行的第一虚拟切割线410、及与所述第二方向平行的第二虚拟切割线420；至少一所述第一类走线200包括至少一第一开口，至少一所述第二类走线300包括至少一第二开口301；其中，在所述显示背板100的俯视方向上，所述第一虚拟切割线410穿过所述第一开口，至少一所述第二类走线300穿过所述第一开口，所述第二虚拟切割线420穿过所述第二开口301，至少一所述第一类走线200穿过所述第二开口301。
通过对所述第一类走线200和所述第二类走线300进行图案化挖孔，在切割线处，在所述显示背板100的俯视方向上，第一类走线200和第二类走线300没有重叠覆盖区域，避免同时切割至不同类型的走线，从而减小切割导致不同类型线路异常短接的风险，提高了显示背板100的产品良率，改善了显示效果。
在一些实施例中，所述第一开口和所述第二开口301连续设置，在所述显示背板100的俯视方向上，对应所述虚拟切割框400位于连续设置的所述第一开口和所述第二开口301之内。
在一些实施例中，请参阅图14、图16、图22，所述虚拟切割框400包括与所述第一方向平行的第一虚拟切割线410、及与所述第二方向平行的第二虚拟切割线420；其中，在所述显示背板100的俯视方向上，所述第一虚拟切割线410位于相邻两个所述第一类走线200之间，所述第二虚拟切割线420位于相邻两个所述第二类走线300之间。
在一些实施例中，所述第一虚拟端面2100包括位于所述第二金属层3001的第一虚拟子面2110，所述第二虚拟端面3100包括位于所述第一金属层2001的第二虚拟子面。
原本在第一金属层2001内的所述第一类走线200，可以在显示背板100的边缘103，即虚拟切割线处，将与对应虚拟切割线垂直的第一类走线200换线至所述第二金属层3001，这样在对应虚拟切割线处，对于所述第一金属层2001和所述第二金属层3001，只切割至二者中一层（对于第一类走线200进行换线时即只切割第二金属层3001），进一步减小了切割异层不同类型信号线短路的风险；所述第二类走线300进行换线的方式和原理相同，从而减小切割导致不同类型线路异常短接的风险，提高了显示背板100的产品良率，改善了显示效果。
在一些实施例中，请参阅图19至图21，所述第一虚拟切割线410穿过相邻两条所述第一类走线200、及相邻两个所述第一类走线200之间的间隙，至少一所述第二类走线300穿过相邻两个所述第一类走线200之间的间隙，所述第二虚拟切割线420穿过相邻两条所述第二类走线300、及相邻两个所述第二类走线300之间的间隙302，至少一所述第一类走线200穿过相邻两个所述第二类走线300之间的间隙302。
在一些实施例中，请参阅图22至图24，包括所述第一虚拟子面2110的所述第一类走线200包括：位于所述第二金属层3001内的第一子部2200，在所述显示背板100的俯视方向上，所述第一子部2200穿过所述虚拟切割框400；位于所述第一金属层2001内的第二子部2300；包括所述第二虚拟子面的所述第二类走线300包括：位于所述第一金属层2001内的第三子部，在所述显示背板100的俯视方向上，所述第三子部穿过所述虚拟切割框400；位于所述第二金属层3001内的第四子部；其中，所述绝缘层110包括多个第三过孔113和多个第四过孔，所述第二子部2300通过所述第三过孔113与所述第一子部2200的两端连接，所述第四子部通过所述第四过孔与所述第三子部的两端连接。
所述第一类走线200利用所述第三过孔113进行跳线至所述第二金属层3001，所述第二类走线300利用所述第四过孔跳线至所述第一金属层2001，在对应虚拟切割线处，对于所述第一金属层2001和所述第二金属层3001，只切割至二者中一层，进一步减小了切割异层不同类型信号线短路的风险；所述第二类走线300进行换线的方式和原理相同，从而减小切割导致不同类型线路异常短接的风险，提高了显示背板100的产品良率，改善了显示效果。
在一些实施例中，请参阅图22、图25、图26，包括所述第一虚拟子面2110的所述第一虚拟端面2100还包括位于所述第一金属层2001内的第三虚拟子面2120，包括所述第二虚拟子面的所述第二虚拟端面3100还包括位于所述第二金属层3001内的第四虚拟子面；其中，在所述显示背板100的俯视方向上，所述第一虚拟子面2110与对应所述第三虚拟子面2120重叠设置，所述第二虚拟子面与对应所述第四虚拟子面重叠设置。
在异层的切割面处，上下重叠的区域，对应两相同类型信号的走线，即使在切割时，使上下两走线短接，例如所述第一类走线200的所述第一子面211与第三子面212对应的线路在侧面短接，两线路本就是同一类走线的同一条走线，既不需要担心短接导致信号异常，又可以实现并联减小走线电阻，不必在每个像素内都打断第一类走线200或第二类走线300，从而对原像素设计方案影响较小，同时对原像素设计，无需多次打断金属层，对金属走线阻抗几乎没有影响，从而减小切割导致不同类型线路异常短接的风险，提高了显示背板100的产品良率，改善了显示效果。
在一些实施例中，请参阅图22、图25、图26，包括所述第一虚拟子面2110的所述第一类走线200还包括与所述第二子部2300连接且同层的第五子部2400，包括所述第虚拟二子面3110的所述第二类走线300还包括与所述第四子部连接且同层的第六子部。
所述第五子部2400对应所述第三虚拟子面2120，所述第六子部对应所述第四虚拟子面。在切割时，例如所述第一类走线200的第一子部2200和第五子部2400在侧面短接，两线路本就是同一类走线的同一条走线，既不需要担心短接导致信号异常，又可以实现并联减小走线电阻，从而减小切割导致不同类型线路异常短接的风险，提高了显示背板100的产品良率，改善了显示效果。
在一些实施例中，请参阅图1、图13，所述显示背板100包括显示区G及位于所述显示区G底部的非显示区，所述显示背板100还包括设置于所述显示区G内的栅极驱动部件500。
在任意尺寸切割时，上左右边缘103的切割线可以直接切割而无需考虑对所述栅极驱动部件500的影响。
在一些实施例中，请参阅图1、图13，所述栅极驱动部件500包括多个栅极驱动器件510和连接相邻两个所述栅极驱动器件510的栅极驱动连接线520；其中，在所述显示背板100的俯视方向上，所述栅极驱动连接线520和所述栅极驱动器件510的排布方向与显示背板100的一边缘103垂直，所述栅极驱动连接线520包括与对应所述边缘103平齐的端面。
切割线切至栅极驱动连接线520，可以减少对所述栅极驱动器件510的破坏，以避免驱动失效，方便进行其他器件的布局。
在一些实施例中，请参阅图14、图27，在所述显示背板100的俯视方向上，所述虚拟切割框400穿过所述栅极驱动连接线520。例如所述栅极驱动连接线520和所述栅极驱动器件510的排布方向为所述第一方向，所述第二虚拟切割线420穿过所述栅极驱动连接线520，可以减少对所述栅极驱动器件510的破坏，以避免驱动失效，方便进行其他器件的布局。
在一些实施例中，所述显示背板100包括衬底120、位于所述衬底120上的有源层、位于所述有源层上的第一绝缘层、位于所述第一绝缘层上的栅极层、位于所述栅极层上的第二绝缘层、位于所述第二绝缘层上的源漏极层。
在一些实施例中，所述源漏极层可以作为所述走线层，即所述源漏极层包括所述第一金属层2001、所述绝缘层110、及所述第二金属层3001。
在一些实施例中，所述显示背板100可以作为直显的显示装置10的驱动阵列器件，也可以作为背光单元的驱动阵列器件，在此不做具体限定。
在一些实施例中，所述显示背板100为直显类时，所述显示背板100还包括发光器件，所述发光器件可以包括OLED（Organic Light-Emitting Diode，有机发光二极管）材料，也可以包括Micro LED或Mini LED，在此不做具体限定。
本发明通过对走线进行优化排布以及图案化处理，将切割线设置在两种不同类型走线没有重叠覆盖的区域，避免同时切割至不同类型的走线，从而减小切割导致不同类型线路异常短接的风险，提高了显示背板的产品良率，改善了显示效果。
请参阅图28，本发明实施例还提供了一种显示背板100的制作方法，包括：
S100、提供一衬底120；
S200、在所述衬底120一侧形成第一金属材料层；
S300、对所述第一金属材料进行图案化，形成沿第一方向排列的多条第一类走线200及多个第一缝隙，以形成第一金属层2001；
S400、在所述第一金属层2001远离所述衬底120一侧形成绝缘层110；
S500、在所述绝缘层110远离所述衬底120一侧形成第二金属材料层600；
S600、对所述第二金属材料进行图案化，形成沿第二方向排列的多条第二类走线300及多个第二缝隙610，以形成第二金属层3001，以及形成基板700；
S700、提供一包括与所述第一方向平行的第一切割线810、及与所述第二方向平行的第二切割线820的切割框800，在所述显示背板100的俯视方向上，至少一所述第一类走线200穿过所述第二缝隙610，至少一所述第二类走线300穿过所述第一缝隙，所述第一切割线810穿过所述第一缝隙，所述第二切割线820穿过所述第二缝隙610；
S800、利用所述切割框800，对所述基板700进行切割，以形成显示背板100。
本发明通过对走线进行优化排布以及图案化处理，将切割线设置在两种不同类型走线没有重叠覆盖的区域，避免同时切割至不同类型的走线，从而减小切割导致不同类型线路异常短接的风险，提高了显示背板的产品良率，改善了显示效果。
现结合具体实施例对本发明的技术方案进行描述。
本实施例中，显示背板100的制作方法，包括：
S100、提供一衬底120，请参阅图29A。
在一些实施例中，所述衬底120的材料可以为硬质材料，例如玻璃，也可以为柔性材料，例如聚酰亚胺，在此不做具体限定。
S200、在所述衬底120一侧形成第一金属材料层。
在一些实施例中，所述第一金属材料层可以为一层金属，也可以为多层叠层金属，在此不做具体限定。
S300、对所述第一金属材料进行图案化，形成沿第一方向排列的多条第一类走线200及多个第一缝隙，以形成第一金属层2001，请参阅图29A。
S400、在所述第一金属层2001远离所述衬底120一侧形成绝缘层110，请参阅图29B。
在一些实施例中，步骤S400包括：
S410a、在所述第一金属层2001远离所述衬底120一侧形成包括多个第一过孔111和多个第二过孔的绝缘层110。
在一些实施例中，步骤S400包括：
S410b、在所述第一金属层2001远离所述衬底120一侧形成包括多个第一过孔111、多个第二过孔、多个第三过孔113、及多个第四过孔的绝缘层110。
S500、在所述绝缘层110远离所述衬底120一侧形成第二金属材料层600，请参阅图29B。
在一些实施例中，所述第二金属材料层600可以为一层金属，也可以为多层叠层金属，在此不做具体限定。
S600、对所述第二金属材料进行图案化，形成沿第二方向排列的多条第二类走线300及多个第二缝隙610，以形成第二金属层3001，以及形成基板700，请参阅图29C、图29D。
在一些实施例中，所述第一缝隙和所述第二缝隙610可以分别为所述显示背板100的所述第一开口和所述第二开口301，也可以分别为所述相邻两条所述第一类走线200之间的间隙、相邻两条所述第二类走线300之间的间隙302。
在排布线路时，可以将所述第一类走线200包括至少一第一开口，至少一所述第二类走线300包括至少一第二开口301，所述显示背板100的俯视方向上，至少一所述第一类走线200穿过所述第二开口301，至少一所述第二类走线300穿过所述第一开口，所述第一切割线810穿过所述第一开口，所述第二切割线820穿过所述第二开口301；或者将相邻两第一类走线200或相邻两第二类走线300之间的间隙302进行图案化，使一部分间隙边缘正好位于切割线上，使在所述显示背板100的俯视方向上，增大金属线的占空比例，金属线有反光作用，可以提高显示光线的反射，从而提高显示出光率。
S700、提供一包括与所述第一方向平行的第一切割线810、及与所述第二方向平行的第二切割线820的切割框800，在所述显示背板100的俯视方向上，至少一所述第一类走线200穿过所述第二缝隙610，至少一所述第二类走线300穿过所述第一缝隙，所述第一切割线810穿过所述第一缝隙，所述第二切割线820穿过所述第二缝隙610，请参阅图29C至图29E。
其中，图29E是图29D的区域H的俯视透视图，在切割基板700时，在垂直于基板700的切割方向上，切割线只同时经过一类走线，在俯视方向上，与切割线重合的不同类走线没有互相重叠的区域，从而在切割基板700后，在显示背板100的边缘103不同类走线没有互相重叠的区域，避免同时切割至不同类型的走线，从而减小切割导致不同类型线路异常短接的风险，提高了显示背板100的产品良率，改善了显示效果。
在一些实施例中，在所述显示背板100的俯视方向上，所述切割框800的切割线设置于所述显示背板100的相邻两个子像素之间。减小对像素的破坏，不必在每个像素内都打断第一类走线200或第二类走线300，从而对原像素设计方案影响较小，同时对原像素设计，无需多次打断金属层，对金属走线阻抗几乎没有影响。
在一些实施例中，所述切割框800包括与所述第一方向平行的第一切割线810、及与所述第二方向平行的第二切割线820；至少一所述第一类走线200包括至少一第一开口，至少一所述第二类走线300包括至少一第二开口301；其中，在所述显示背板100的俯视方向上，所述第一切割线810穿过所述第一开口，至少一所述第二类走线300穿过所述第一开口，所述第二切割线820穿过所述第二开口301，至少一所述第一类走线200穿过所述第二开口301。
在一些实施例中，所述第一开口和所述第二开口301连续设置，在所述显示背板100的俯视方向上，对应所述切割框800位于连续设置的所述第一开口和所述第二开口301之内。
在一些实施例中，所述切割框800包括与所述第一方向平行的第一切割线810、及与所述第二方向平行的第二切割线820；其中，在所述显示背板100的俯视方向上，所述第一切割线810位于相邻两个所述第一类走线200之间，所述第二切割线820位于相邻两个所述第二类走线300之间。
在一些实施例中，所述第一端面210包括位于所述第二金属层3001的第一子面211，所述第二端面310包括位于所述第一金属层2001的第二子面。
在一些实施例中，包括所述第一子面211的所述第一类走线200包括：位于所述第二金属层3001内的第一子部2200，在所述显示背板100的俯视方向上，所述第一子部2200穿过所述切割框800；位于所述第一金属层2001内的第二子部2300；包括所述第二子面的所述第二类走线300包括：位于所述第一金属层2001内的第三子部，在所述显示背板100的俯视方向上，所述第三子部穿过所述切割框800；位于所述第二金属层3001内的第四子部；其中，所述绝缘层110包括多个第三过孔113和多个第四过孔，所述第二子部2300通过所述第三过孔113与所述第一子部2200的两端连接，所述第四子部通过所述第四过孔与所述第三子部的两端连接。
在一些实施例中，包括所述第一子面211的所述第一端面210还包括位于所述第一金属层2001内的第三子面212，包括所述第二子面的所述第二端面310还包括位于所述第二金属层3001内的第四子面；其中，在所述显示背板100的俯视方向上，所述第一子面211与对应所述第三子面212重叠设置，所述第二子面与对应所述第四子面重叠设置。
在一些实施例中，所述显示背板100包括显示区G及位于所述显示区G外围的非显示区，所述显示背板100还包括设置于所述显示区G内的栅极驱动部件500。
在一些实施例中，所述栅极驱动部件500包括多个栅极驱动器件510和连接相邻两个所述栅极驱动器件510的栅极驱动连接线520；其中，在所述显示背板100的俯视方向上，所述栅极驱动连接线520和所述栅极驱动器件510的排布方向与显示背板100的一边缘103垂直，所述栅极驱动连接线520包括与对应所述边缘103平齐的端面。
S800、利用所述切割框800，对所述基板700进行切割，以形成显示背板100。
本发明通过对走线进行优化排布以及图案化处理，将切割线设置在两种不同类型走线没有重叠覆盖的区域，避免同时切割至不同类型的走线，从而减小切割导致不同类型线路异常短接的风险，提高了显示背板的产品良率，改善了显示效果。
请参阅图30，本发明实施例还提供了一种显示装置10，包括至少两个拼接屏20，所述拼接屏20包括如任一上述的显示背板100。
所述显示背板100的具体结构请参阅任一上述显示背板100的实施例及附图，在此不再赘述。
本实施例中，所述显示装置10还包括装置主体，所述装置主体可以包括中框、框胶等，所述显示装置10可以为手机、平板、电视等显示终端，在此不做限定。
在一些实施例中，所述显示背板100可以作为直显的显示装置10的驱动阵列器件，也可以作为背光单元的驱动阵列器件，在此不做具体限定。
在一些实施例中，所述显示背板100作为直显的显示装置10的驱动阵列器件，所述显示装置10还包括发光器件，所述发光器件可以包括OLED（Organic Light-Emitting Diode，有机发光二极管）材料，也可以包括Micro LED或Mini LED，在此不做具体限定。
在一些实施例中，所述显示背板100作为背光单元的驱动阵列器件，所述显示装置10还包括背光单元、液晶层、彩膜层及上下偏光层。
本发明实施例公开了一种显示背板及显示装置；该显示背板包括走线层，走线层包括沿第一方向排列的多条第一类走线、及沿第二方向排列的多条第二类走线，至少一第一类走线包括与显示背板的边缘平齐的第一端面，至少一第二类走线包括与显示背板的边缘平齐的第二端面，在显示背板的俯视方向上，第一端面与第二端面非重叠设置；本发明通过对走线进行优化排布以及图案化处理，将切割线设置在两种不同类型走线没有重叠覆盖的区域，避免同时切割至不同类型的走线，从而减小切割导致不同类型线路异常短接的风险，提高了显示背板的产品良率，改善了显示效果。
可以理解的是，对本领域普通技术人员来说，可以根据本申请的技术方案及其发明构思加以等同替换或改变，而所有这些改变或替换都应属于本申请所附的权利要求的保护范围。

Claims (20)

  1. 一种显示背板，其中，所述显示背板包括走线层；其中，所述走线层包括：
    沿第一方向排列的多条第一类走线，至少一所述第一类走线包括与所述显示背板的边缘平齐的第一端面；
    沿第二方向排列的多条第二类走线，所述第一方向与所述第二方向垂直，至少一所述第二类走线包括与所述显示背板的边缘平齐的第二端面；
    其中，所述第一类走线与所述第二类走线绝缘设置，在所述显示背板的俯视方向上，所述第一端面与所述第二端面非重叠设置。
  2. 根据权利要求1所述的显示背板，其中，任一所述第一端面与所述第二方向平行，任一所述第二端面与所述第一方向平行。
  3. 根据权利要求2所述的显示背板，其中，所述走线层包括第一金属层、第二金属层、及位于所述第一金属层与所述第二金属层之间的绝缘层；
    与所述第二方向平行的所述第一端面包括位于所述第二金属层的第一子面，与所述第一方向平行的所述第二端面包括位于所述第一金属层的第二子面。
  4. 根据权利要求3所述的显示背板，其中，包括所述第一子面的所述第一类走线包括：
    第一部分，靠近所述显示背板的对应边缘一侧，且位于所述第二金属层；
    第二部分，远离所述显示背板的对应边缘一侧，且位于所述第一金属层；
    包括所述第二子面的所述第二类走线包括：
    第三部分，靠近所述显示背板的对应边缘一侧，且位于所述第一金属层；
    第四部分，远离所述显示背板的对应边缘一侧，且位于所述第二金属层；
    其中，所述绝缘层包括多个第一过孔和多个第二过孔，所述第一部分通过所述第一过孔与所述第二部分连接，所述第三部分通过所述第二过孔与所述第四部分连接。
  5. 根据权利要求3所述的显示背板，其中，包括所述第一子面的所述第一端面还包括位于所述第一金属层内的第三子面，包括所述第二子面的所述第二端面还包括位于所述第二金属层内的第四子面；
    其中，在所述显示背板的俯视方向上，所述第一子面与对应所述第三子面重叠设置，所述第二子面与对应所述第四子面重叠设置。
  6. 根据权利要求2所述的显示背板，其中，所述显示背板包括与所述第一方向平行的第一边缘及与所述第二方向平行的第二边缘；
    其中，最靠近对应所述第一边缘的所述第一类走线包括朝向对应所述第一边缘的第一凸起，最靠近对应所述第二边缘的所述第二类走线包括朝向对应所述第二边缘的第二凸起。
  7. 根据权利要求6所述的显示背板，其中，在所述显示背板的俯视方向上，所述第一凸起靠近对应所述第一边缘的侧面与对应所述第一边缘平齐，所述第二凸起靠近对应所述第二边缘的侧面与对应所述第二边缘平齐。
  8. 根据权利要求1所述的显示背板，其中，至少一所述第一端面与所述第二方向平行，至少一所述第一端面与所述第一方向平行，至少一所述第二端面与所述第二方向平行，至少一所述第二端面与所述第一方向平行。
  9. 根据权利要求8所述的显示背板，其中，所述走线层包括第一金属层、第二金属层、及位于所述第一金属层与所述第二金属层之间的绝缘层；
    与所述第二方向平行的所述第一端面包括位于所述第二金属层的第一子面，与所述第一方向平行的所述第二端面包括位于所述第一金属层的第二子面。
  10. 根据权利要求8所述的显示背板，其中，所述显示背板包括与所述第一方向平行的第一边缘及与所述第二方向平行的第二边缘；
    其中，最靠近对应所述第一边缘的所述第一类走线包括朝向对应所述第一边缘的第一凸起，最靠近对应所述第二边缘的所述第二类走线包括朝向对应所述第二边缘的第二凸起。
  11. 根据权利要求1所述的显示背板，其中，所述显示背板包括至少一虚拟切割框；
    至少一所述第一类走线包括第一虚拟端面，至少一所述第二类走线包括第二虚拟端面；
    其中，在所述显示背板的俯视方向上，所述第一虚拟端面与所述虚拟切割框重叠，所述第二虚拟端面与所述虚拟切割框重叠，所述第一虚拟端面与所述第二虚拟端非重叠设置。
  12. 根据权利要求11所述的显示背板，其中，所述虚拟切割框包括与所述第一方向平行的第一虚拟切割线、及与所述第二方向平行的第二虚拟切割线；
    至少一所述第一类走线包括至少一第一开口，至少一所述第二类走线包括至少一第二开口；
    其中，在所述显示背板的俯视方向上，所述第一虚拟切割线穿过所述第一开口，至少一所述第二类走线穿过所述第一开口，所述第二虚拟切割线穿过所述第二开口，至少一所述第一类走线穿过所述第二开口。
  13. 根据权利要求11所述的显示背板，其中，所述虚拟切割框包括与所述第一方向平行的第一虚拟切割线、及与所述第二方向平行的第二虚拟切割线；
    其中，在所述显示背板的俯视方向上，所述第一虚拟切割线位于相邻两个所述第一类走线之间，所述第二虚拟切割线位于相邻两个所述第二类走线之间。
  14. 根据权利要求11所述的显示背板，其中，所述走线层包括第一金属层、第二金属层、及位于所述第一金属层与所述第二金属层之间的绝缘层；
    所述第一虚拟端面包括位于所述第二金属层的第一虚拟子面，所述第二虚拟端面包括位于所述第一金属层的第二虚拟子面。
  15. 根据权利要求14所述的显示背板，其中，包括所述第一虚拟子面的所述第一类走线包括：
    位于所述第二金属层内的第一子部，在所述显示背板的俯视方向上，所述第一子部穿过所述虚拟切割框；
    位于所述第一金属层内的第二子部；
    包括所述第二虚拟子面的所述第二类走线包括：
    位于所述第一金属层内的第三子部，在所述显示背板的俯视方向上，所述第三子部穿过所述虚拟切割框；
    位于所述第二金属层内的第四子部；
    其中，所述绝缘层包括多个第三过孔和多个第四过孔，所述第二子部通过所述第三过孔与所述第一子部的两端连接，所述第四子部通过所述第四过孔与所述第三子部的两端连接。
  16. 根据权利要求14所述的显示背板，其中，包括所述第一虚拟子面的所述第一虚拟端面还包括位于所述第一金属层内的第三虚拟子面，包括所述第二虚拟子面的所述第二虚拟端面还包括位于所述第二金属层内的第四虚拟子面；
    其中，在所述显示背板的俯视方向上，所述第一虚拟子面与对应所述第三虚拟子面重叠设置，所述第二虚拟子面与对应所述第四虚拟子面重叠设置。
  17. 根据权利要求11所述的显示背板，其中，在所述显示背板的俯视方向上，所述虚拟切割框的切割线设置于所述显示背板的相邻两个子像素之间。
  18. 根据权利要求1所述的显示背板，其中，所述显示背板包括显示区及位于所述显示区底部的非显示区，所述显示背板还包括设置于所述显示区内的栅极驱动部件。
  19. 根据权利要求18所述的显示背板，其中，所述栅极驱动部件包括多个栅极驱动器件和连接相邻两个所述栅极驱动器件的栅极驱动连接线；
    其中，在所述显示背板的俯视方向上，所述栅极驱动连接线和所述栅极驱动器件的排布方向与显示背板的一边缘垂直，所述栅极驱动连接线包括与对应所述边缘平齐的端面。
  20. 一种显示装置，其中，包括至少两个拼接屏，所述拼接屏包括显示背板；所述显示背板包括走线层；其中，所述走线层包括：
    沿第一方向排列的多条第一类走线，至少一所述第一类走线包括与所述显示背板的边缘平齐的第一端面；
    沿第二方向排列的多条第二类走线，所述第一方向与所述第二方向垂直，至少一所述第二类走线包括与所述显示背板的边缘平齐的第二端面；
    其中，所述第一类走线与所述第二类走线绝缘设置，在所述显示背板的俯视方向上，所述第一端面与所述第二端面非重叠设置。
PCT/CN2022/088331 2022-04-11 2022-04-22 显示背板及显示装置 Ceased WO2023197352A1 (zh)

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