WO2023197126A1 - 一种光学反射仪和检测待检测样品表面的方法 - Google Patents

一种光学反射仪和检测待检测样品表面的方法 Download PDF

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Publication number
WO2023197126A1
WO2023197126A1 PCT/CN2022/086197 CN2022086197W WO2023197126A1 WO 2023197126 A1 WO2023197126 A1 WO 2023197126A1 CN 2022086197 W CN2022086197 W CN 2022086197W WO 2023197126 A1 WO2023197126 A1 WO 2023197126A1
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Prior art keywords
light
target surface
split
sensor
initial
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PCT/CN2022/086197
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English (en)
French (fr)
Inventor
高瑞彦
王海峰
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华为技术有限公司
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Priority to PCT/CN2022/086197 priority Critical patent/WO2023197126A1/zh
Publication of WO2023197126A1 publication Critical patent/WO2023197126A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Definitions

  • the present application relates to the field of semiconductor manufacturing technology, and in particular to an optical reflectometer, a detection device, chemical mechanical grinding equipment and a method for detecting the surface of a sample to be detected.
  • laser reflection detection technology can achieve the characteristics of optical non-contact, and has the advantages of speed and accuracy, so it is widely used.
  • the main working principle of laser reflection detection technology is: when light irradiates the surface of a sample, light of the same wavelength on different conductive metal surfaces of the sample has different reflectivities. In addition, light will have diffraction effects in transparent or translucent dielectric layers of different thicknesses, which will lead to changes in light intensity. Therefore, the information on the surface of the sample can be characterized by measuring the intensity of the reflected light and changes in the intensity, thereby determining whether the surface of the sample meets the grinding requirements.
  • multiple light sources are usually equipped in order to achieve multi-angle detection. That is, a light source is placed at different positions so that the light shines on the sample surface from different angles.
  • this method will significantly increase the number of light sources used, and therefore will cause excessive production costs.
  • multiple light sources will also increase the size of the entire instrument, which is not conducive to miniaturization design.
  • This application provides an optical reflectometer that can use a single light source to generate light at different incident angles, a detection device, chemical mechanical grinding equipment, and a method for detecting the surface of a sample to be detected.
  • an optical reflectometer including at least one light source, a beam splitter and a first reflective element.
  • the at least one light source is used to generate an initial light beam.
  • the beam splitter is located in the optical path of the initial beam and is used to split the initial beam into a first split beam propagating along the first direction and a second split beam propagating along the second direction, and the first split beam is irradiated on the target surface.
  • the first reflective member is located in the optical path of the second partial beam and is used to change the propagation direction of the second partial beam so that the second partial beam is illuminated on the target surface; wherein, after the first partial beam is illuminated on the target surface, it is reflected to the third partial beam.
  • the initial light beam generated by the light source can be divided into two split beams propagating in different directions through the light splitter, thereby increasing the number of light beams and splitting them in half through the first sensor.
  • the beam is effectively received, and the second partial beam can be effectively received by the second sensor.
  • a single light source can generate two effective beams through a light splitter, thereby reducing the number of light sources used, which is beneficial to reducing production costs and volume, and facilitates miniaturization design.
  • the detection accuracy can be improved by passing the first split beam and the second split beam.
  • a light beam such as the first split beam
  • the intensity of the reflected light will also be different, resulting in detection errors.
  • the intensity of the reflected light of the two beams can be comprehensively considered, thereby improving the detection accuracy.
  • the first sensor can detect the intensity of the reflected light after receiving the reflected light of the first split beam.
  • the second sensor can detect the intensity of the reflected light after receiving the reflected light of the second split beam.
  • the detection circuit can determine the state of the surface of the sample to be detected based on the intensity of the reflected light detected by the first sensor and the second sensor.
  • the first partial beam may directly illuminate the target surface, or the first partial beam may not illuminate the target surface.
  • the propagation direction of the first partial beam can be changed through the second reflective member so that the first partial beam can illuminate the target surface.
  • the number of light sources may be one or multiple.
  • the wavelengths of the initial light beams generated by the multiple light sources are different. This allows light of different wavelengths to effectively illuminate the surface of the sample to be detected, thereby improving detection accuracy.
  • different materials may have the same reflectivity for light beams of the same wavelength. Therefore, using a single wavelength light beam may not effectively detect the interface between two materials. If two beams of different wavelengths are used, the above-mentioned adverse situations can be effectively avoided, thereby improving detection accuracy.
  • the multiple light sources can be arranged in parallel, that is, the directions of the initial light beams generated by the multiple light sources can be consistent. This allows the beam splitter to be located in the optical path of multiple initial beams, so that all the initial beams can be effectively split by one beam splitter, thereby reducing the number of beam splitters used.
  • multiple light sources can also be arranged at an included angle, that is, the directions of the initial light beams generated by the multiple light sources are at an included angle (or inconsistent). This application places no restrictions on the location and layout of multiple light sources.
  • the beam splitter may include a beam splitter lens.
  • the beam splitting lens may be a semi-transparent and semi-reflective lens. Specifically, after the initial beam generated by the light source is irradiated on the surface of the semi-transparent mirror at an angle of 45°, about 50% of the initial beam will be directly transmitted to form the first split beam. About 50% of the initial beam is reflected to form a second split beam. That is, through the semi-transparent and semi-reflective lens, the initial light beam is divided into a first partial beam and a second partial beam with approximately the same light intensity. Since the light intensities of the first split beam and the second split beam are almost the same, the calculation difficulty will be reduced when performing relevant calculations on the corresponding detection signals in the later stage.
  • the beam splitter may also use a beam splitter or other device with a beam splitting function to process the initial beam to split the initial beam into two split beams.
  • This application places no specific restrictions on the specific type of spectroscopic components.
  • the first reflective member may be a total reflection mirror. When light strikes the surface of a total reflection mirror, almost 100% of the light will be reflected. It can be understood that in other embodiments, the first reflective member may also be a total reflection prism or other device capable of changing the direction of light propagation. This application does not limit the specific type of the first reflective element.
  • the propagation direction of the second partial beam can also be adjusted through a plurality of first reflective elements.
  • the propagation direction of the second partial beam can also be adjusted sequentially through a plurality of first reflective members. This application places no specific restrictions on the number and specific positions of the first reflective elements.
  • the first reflective member may be a total reflection mirror. When light strikes the surface of a total reflection mirror, almost 100% of the light will be reflected. It can be understood that in other embodiments, the second reflective member may also be a total reflection prism or other device capable of changing the direction of light propagation. This application does not limit the specific type of the second reflective element.
  • the propagation direction of the first split beam can also be adjusted through a plurality of second reflective elements.
  • the propagation direction of the first split beam can also be adjusted sequentially through a plurality of second reflective elements. This application places no specific restrictions on the number and specific positions of the second reflective elements.
  • a third reflective member can also be provided.
  • the third reflective member may be disposed in the propagation path of the initial light beam to change the propagation direction of the initial light beam so that the initial light beam can illuminate the beam splitter.
  • the third reflective element can effectively increase the flexibility in the position layout of the light source and light splitting element.
  • the third reflective element can be the same or similar to the first reflective element, which will not be described again here.
  • embodiments of the present application also provide a detection device, including an optical reflectometer, a first sensor and a second sensor.
  • a detection device including an optical reflectometer, a first sensor and a second sensor.
  • the first sensor When the first split beam hits the target surface, reflection occurs.
  • the first sensor After receiving the reflected light of the first split beam, the first sensor generates a corresponding first detection signal according to the intensity of the reflected light of the first split beam.
  • the second split beam hits the target surface, reflection occurs.
  • the second sensor After receiving the reflected light of the second split beam, the second sensor generates a corresponding second detection signal according to the intensity of the reflected light of the second split beam.
  • the detection device may further include a detection circuit electrically connected to the first sensor and the second sensor for receiving the first detection signal and the second detection signal. Through relevant calculations of the detection circuit, it can be judged whether the target surface meets the requirements.
  • the detection device can be used in a variety of equipment to achieve detection purposes.
  • the embodiment of the present application also provides a chemical mechanical grinding equipment.
  • the polishing pad has a transparent window.
  • the sample to be detected can be located on one side of the polishing pad, and the target surface of the sample to be detected is located in the projection area of the transparent window.
  • the detection device can be located on the other side of the polishing pad so that the detection device can pass through the transparent window. window to observe the target surface of the sample to be detected.
  • chemical mechanical grinding equipment can also be used with other types of detection devices to detect the samples to be tested, thereby improving detection accuracy and scope of application.
  • the sample to be detected can be detected by an eddy current sensor.
  • the eddy current sensor and the above-mentioned detection device need to be installed on the same side of the transparent window.
  • the projection of the eddy current sensor can be located between two adjacent light sources without blocking the light.
  • it can also provide sufficient installation locations for eddy current sensors to achieve effective compatibility of installation spaces.
  • embodiments of the present application also provide a method for detecting the surface of a sample to be detected, including: using at least one light source to generate an initial beam, and using a beam splitter to split the initial beam into a first split beam propagating along a first direction and a The second partial beam propagates along the second direction, and the first partial beam irradiates the target surface.
  • the first reflective member is used to illuminate the second partial beam on the target surface; wherein, after the first partial beam is illuminated on the target surface, it is reflected to the first sensor, and after the second partial beam is illuminated on the target surface, it is reflected to the second sensor.
  • the initial light beam generated by the light source can be divided into a first split beam and a second split beam that propagate in different directions, thereby reducing the number of light sources used and conducive to reducing costs.
  • the size and production cost of the corresponding testing equipment can be divided into a first split beam and a second split beam that propagate in different directions, thereby reducing the number of light sources used and conducive to reducing costs.
  • the method for detecting the surface of the sample to be detected may further include: the first sensor receiving the first beam reflected by the target surface and generating a first detection signal.
  • the second sensor receives the second beam reflected by the target surface and generates a second detection signal.
  • the detection circuit determines the state of the target surface of the sample to be detected based on the first detection signal and the second detection signal.
  • the beam splitter before using the beam splitter to split the initial beam, it may also include: using a reflective member to change the propagation direction of the initial beam so that the initial beam can effectively illuminate the beam splitter.
  • using a light source to generate an initial light beam may include using multiple light sources to generate multiple initial light beams with different wavelengths, thereby helping to improve detection accuracy.
  • different materials may have the same reflectivity for light beams of the same wavelength. Therefore, using a single wavelength light beam may not effectively detect the interface between two materials. If two beams of different wavelengths are used, the above-mentioned adverse situations can be effectively avoided, thereby improving detection accuracy.
  • Figure 1 is a schematic diagram of an application scenario of an optical reflectometer provided by an embodiment of the present application
  • Figure 2 is a schematic structural diagram of a detection device provided by an embodiment of the present application.
  • Figure 3 is a schematic structural diagram of an optical reflectometer provided by an embodiment of the present application.
  • Figure 4 is a schematic structural diagram of a spectroscopic component provided by an embodiment of the present application.
  • Figure 5 is a schematic structural diagram of another spectroscopic element provided by an embodiment of the present application.
  • Figure 6 is a schematic structural diagram of another optical reflectometer provided by an embodiment of the present application.
  • Figure 7 is a schematic structural diagram of an optical reflectometer provided by an embodiment of the present application.
  • Figure 8 is a schematic structural diagram of a detection device provided by an embodiment of the present application.
  • Figure 9 is a flow chart of a method for detecting the surface of a sample to be detected provided by an embodiment of the present application.
  • Figure 10 is a flow chart of another method for detecting the surface of a sample to be detected provided by an embodiment of the present application.
  • Figure 11 is a flow chart of another method for detecting the surface of a sample to be detected provided by an embodiment of the present application.
  • Figure 12 is a schematic structural diagram of a grinding equipment provided by an embodiment of the present application.
  • Figure 13 is a schematic three-dimensional structural diagram of a grinding equipment provided by an embodiment of the present application.
  • Figure 14 is a schematic cross-sectional structural diagram of a sample to be detected provided by an embodiment of the present application.
  • Figure 15 is a light intensity change data simulation diagram provided by the embodiment of the present application.
  • Figure 16 is another light intensity change data simulation diagram provided by the embodiment of the present application.
  • Figure 17 is a schematic three-dimensional structural diagram of a grinding equipment provided by an embodiment of the present application.
  • Optical reflectometers can be used in equipment that uses light to detect the surface of the sample to be detected.
  • the surface of the sample 01 to be detected (the lower surface in the figure) can be detected by a detection device equipped with an optical reflectometer.
  • the light generated by the light source 02 irradiates the surface of the sample 01 to be detected and then reflects to the light sensor 03 .
  • the light sensor 03 will generate different detection signals.
  • the back-end detection circuit 04 can determine whether the surface of the sample 01 to be detected meets the requirements based on the detection signal of the light sensor 03.
  • the light when the surface materials of sample 01 to be detected are different, the light will have different reflectivities, thus causing the intensity of the reflected light to be different.
  • the light sensor 03 will generate different detection signals for different light intensities. Therefore, the back-end detection circuit 04 can determine whether the surface of the sample 01 to be detected meets the grinding requirements based on the detection signal of the light sensor 03 .
  • light will have diffraction effects in transparent or translucent dielectric layers of different thicknesses, which will lead to regular changes in light intensity. Therefore, the information on the surface of the sample 01 to be detected can be characterized by measuring the intensity of the reflected light or the change pattern of the light intensity, thereby determining whether the surface of the sample 01 to be detected meets the requirements.
  • a single light source can only provide light from a single incident angle, so it is difficult to achieve more accurate detection during detection.
  • multiple (four are shown in the figure) light sources 02 are usually equipped at different positions, and each light source 02 is equipped with a light sensor 03 .
  • this method will significantly increase the number of light sources 02 used, and therefore will cause excessive production costs.
  • multiple light sources 02 will also increase the volume of the entire instrument, which is not conducive to miniaturization design.
  • embodiments of the present application provide an optical reflectometer that can use a single light source to generate light at different incident angles.
  • the optical reflectometer includes a light source 10 , a beam splitter 20 and a first reflective member 30 .
  • the light source 10 is used to generate the initial light beam 100.
  • the beam splitter 20 is located in the optical path of the initial beam 100 and is used to split the initial beam 100 into a first split beam 101 propagating along the first direction and a second split beam 102 propagating along the second direction.
  • the first reflective member 30 is located in the optical path of the second beam 102 and is used to change the propagation direction of the second beam 102 so that the second beam 102 irradiates the target surface (the lower surface of the sample 01 to be detected in the figure) .
  • the initial light beam 100 generated by the light source 10 can be divided into two split beams propagating in different directions through the beam splitter 20, thereby increasing the number of light beams.
  • the beam splitter 20 can make a single light source 10 generate two effective beams, thereby reducing the number of light sources 10 used, which is beneficial to reducing the manufacturing cost and volume of the optical reflectometer, and facilitates miniaturization design.
  • the propagation direction of the second beam 102 can be effectively adjusted, so that the second beam 102 can illuminate the surface of the sample 01 to be detected (ie, the target surface), and the two beams
  • the surface of the sample 01 to be detected can be irradiated at different angles, thereby improving the accuracy of detecting the surface of the sample 01 to be detected.
  • the intensity of the reflected light will also be different, thus causing detection errors.
  • the intensity of the reflected light of the two light beams can be comprehensively considered, which is beneficial to improving the detection accuracy.
  • the propagation direction of the first partial beam 101 is not adjusted. Since the propagation direction of the second partial beam 102 is away from the target surface, the propagation direction of the second partial beam 102 is adjusted through the first reflective member 30 so that the second partial beam 102 can effectively illuminate the target surface.
  • the propagation of the first partial beam 101 can also be changed through a second reflective member (not shown in the figure). direction, so that the first split beam 101 can effectively illuminate the target surface.
  • the second reflective member can also be understood as the first reflective member 30.
  • the first reflective member 30 can be disposed in the optical path of the first partial beam 101 to reduce the propagation of the first partial beam 101. Adjust the direction.
  • the first reflective member 30 may be omitted.
  • the light source 10 may include a laser 11 and a collimator 12 .
  • the laser 11 may be a solid-state laser or a tunable laser.
  • solid-state lasers can produce laser light of specific wavelengths.
  • Tunable lasers can continuously change the wavelength of laser output within a certain range. It can be understood that in specific applications, this application does not limit the specific type of laser 11.
  • the main function of the collimator 12 is to collimate the light generated by the laser 11 to process the light into a substantially parallel beam, thereby reducing energy dissipation and other undesirable phenomena in the subsequent propagation process of the light.
  • the light source 10 can also be other types of devices capable of generating the required light beam. This application does not limit the composition and specific type of the light source 10 .
  • the beam splitter 20 is specifically a beam splitting lens.
  • the beam splitting lens mainly includes optical glass 21 and one or more films 22 coated on the surface of the optical glass 21 .
  • the beam splitting lens is specifically a semi-transparent and semi-reflective lens.
  • the initial beam generated by the light source is irradiated on the surface of the semi-transparent mirror at an angle of 45°
  • about 50% of the initial beam will be directly transmitted to form the first split beam.
  • about 50% of the initial beam is reflected to form a second split beam. That is, through the semi-transparent and semi-reflective lens, the initial light beam is divided into a first partial beam and a second partial beam with approximately the same light intensity. Since the light intensities of the first split beam and the second split beam are almost the same, the calculation difficulty will be reduced when performing relevant calculations on the corresponding detection signals in the later stage.
  • the initial beam 100 can also be irradiated on the surface of the beam splitting lens at other angles (such as any value between 0° and 90°).
  • the light intensities of the first split beam 101 and the second split beam 102 may also be different.
  • the light intensity ratio of the first split beam 101 to the second split beam 102 may be 1:2, 1:3, 2:1 or 2:3, etc.
  • the beam splitter 20 may also be a beam splitter.
  • the beam splitter is generally a cubic structure, mainly composed of a glass prism 23 and a glass prism 24 with a triangular cross-section.
  • the glass prism 23 and the glass prism 24 are bonded together by a dielectric film 25 .
  • the material of the dielectric film 25 may be polyester, epoxy resin, polyurethane, etc.
  • the initial beam can be incident perpendicularly to one side of the beam splitter. After passing through the dielectric film 25, a part of the light beam is directly transmitted along the propagation direction of the initial beam to form a first split beam; the other part of the light beam is revealed at an angle of 90° with the initial beam to form a second split beam.
  • the beam splitter 20 can also use other devices with a beam splitting function to process the initial beam 100 to split the initial beam 100 into two split beams. This application does not place specific restrictions on the specific type of the spectroscopic component 20 .
  • the first reflective member 30 is a total reflection mirror. When light strikes the surface of a total reflection mirror, almost 100% of the light will be reflected.
  • the first reflective member 30 may also be a total reflection prism or other device capable of changing the direction of light propagation. This application does not limit the specific type of the first reflective component 30 .
  • the propagation direction of the second split beam 102 is adjusted through a first reflective member 30 . It can be understood that in other embodiments, the propagation direction of the second partial beam 102 can also be adjusted sequentially through a plurality of first reflective members 30 to change the propagation direction of the second partial beam 102 . This application places no specific restrictions on the number and specific positions of the first reflective parts 30.
  • the propagation direction of the first partial beam 101 is adjusted through a second reflective member (not shown in the figure). It can be understood that in other embodiments, the propagation direction of the first partial beam 101 can also be adjusted sequentially through a plurality of second reflective elements to change the propagation direction of the first partial beam 101 . This application places no specific restrictions on the number and specific positions of the second reflective elements.
  • a third reflective component 40 is also provided.
  • the third reflective member 40 is disposed in the propagation path of the initial light beam 100 .
  • the third reflective member 40 is located between the light source 10 and the beam splitter 20 and is used to change the propagation direction of the initial beam 100 so that the initial beam 100 can illuminate the beam splitter 20 .
  • the flexibility in the position layout of the light source 10 and the light splitting member 20 can be effectively increased.
  • the third reflective member 40 is a total reflection mirror. When light strikes the surface of a total reflection mirror, almost 100% of the light will be reflected.
  • the third reflective member 40 may also be a total reflection prism or other device that can efficiently change the direction of light propagation. This application does not limit the specific type of the third reflective member 40 .
  • the propagation direction of the initial light beam 100 is adjusted through a third reflective member 40 . It can be understood that in other embodiments, the propagation direction of the initial beam 100 can also be adjusted sequentially through a plurality of third reflective members 40 to change the propagation direction of the initial beam 100 so that the initial beam 100 can better irradiate to the beam splitter 20. It can be understood that this application does not place specific restrictions on the number and specific positions of the third reflective members 40 .
  • two or more light sources 10 can also be provided, and the wavelengths of the initial light beams 100 generated by different light sources 10 can be different, so that light of different wavelengths can effectively illuminate the surface of the sample 01 to be detected. , thereby improving detection accuracy.
  • two light sources 10 are provided, namely light source 10a and light source 10b.
  • the wavelengths of the initial light beams 100 generated by the light source 10a and the light source 10b are different.
  • the light source 10a and the light source 10b are arranged in parallel, that is, the initial light beams 100 generated by the light source 10a and the light source 10b are parallel to each other.
  • the propagation direction of the initial light beam 100 generated by the light source 10a and the light source 10b changes after passing through the third reflective member 40, so that it can be effectively transmitted to the beam splitter 20. After passing through the beam splitter 20, each initial beam 100 is split into two partial beams. Please refer to FIG.
  • the first split beam 101 is directly irradiated to the lower surface of the sample 01 to be detected.
  • the second split beam 102 is reflected by the first reflective member 30 and then illuminates the lower surface of the sample 01 to be detected.
  • the detection accuracy of the surface of the sample 01 to be detected can be effectively improved.
  • different materials may have the same reflectivity for light beams of the same wavelength. Therefore, using one light source 10 may not effectively detect the interface between two materials. If two beams of different wavelengths are used, the above-mentioned adverse situations can be effectively avoided, thereby improving detection accuracy.
  • the third reflective member 40, the light splitting member 20 and the first reflective member 30 can be used to detect the light source 10a and the light source 10b.
  • the light rays are processed simultaneously, which can effectively reduce the number of related components (such as the third reflective component 40, the light splitting component 20 and the first reflective component 30), thereby helping to reduce the manufacturing cost and assembly complexity.
  • three or more light sources 10 may be provided.
  • the plurality of light sources 10 can be arranged in parallel or at an angle. It can be understood that when multiple light sources 10 are arranged at an angle, each light source 10 can be equipped with an independent third reflective member 40 , light splitting member 20 and first reflective member 30 , so that all light beams can be effectively irradiation to the surface of the sample 01 to be detected (i.e., the target surface).
  • the above-mentioned optical reflectometer can be used in a variety of devices that use light to detect the surface of the sample 01 to be detected.
  • the embodiment of the present application also provides a detection device, including an optical reflectometer, a first sensor 51 , a second sensor 52 and a detection circuit 60 .
  • a detection device including an optical reflectometer, a first sensor 51 , a second sensor 52 and a detection circuit 60 .
  • the optical reflectometer includes a light source 10 , a third reflective member 40 , a beam splitter 20 and a first reflective member 30 . After the initial beam 100 generated by the light source 10 is reflected by the third reflective member 40 , the propagation direction of the initial beam 100 is changed, so that the initial beam 100 irradiates the beam splitter 20 .
  • the initial beam 100 is split into a first split beam 101 and a second split beam 102.
  • the first split beam 101 is reflected after being irradiated to the lower surface of the sample 01 to be detected.
  • the first sensor 51 After receiving the reflected light of the first split beam 101, the first sensor 51 generates a corresponding first detection signal according to the light intensity of the first split beam 101.
  • the second partial beam 102 is reflected by the first reflective member 30, the propagation direction of the second partial beam 102 is changed, so that the second partial beam 102 irradiates the sample 01 to be detected.
  • the second sensor 52 After receiving the reflected light of the second split beam 102 , the second sensor 52 generates a corresponding second detection signal according to the light intensity of the second split beam 102 .
  • the number of light sources 10 may also be two or more.
  • the number of corresponding sensors such as the first sensor 51 and the second sensor 52 mentioned above
  • each reflected light ray can be detected. for effective reception.
  • the detection circuit 60 is electrically connected to the first sensor 51 and the second sensor 52, and processes the detection signals of the first sensor 51 and the second sensor 52, so as to determine whether the lower surface of the sample 01 to be detected meets the requirements.
  • the detection circuit 60 may include an amplification circuit, an analog-to-digital conversion circuit, a calculation circuit, etc.
  • the amplifying circuit is used to amplify the detection signals of the first sensor 51 and the second sensor 52 for subsequent related processing.
  • the main function of the analog-to-digital conversion circuit is to convert analog signals into digital signals for subsequent related calculations.
  • the calculation circuit is used to perform calculations and other processing on the converted detection signal to determine whether the surface of the sample 01 to be detected meets the requirements.
  • the first sensor 51 and the second sensor 52 can be a photodiode (Photo Diode, PD), an avalanche photo diode (Avalanche Photo Diode, APD), a charge coupled device image sensor (Charge Coupled Device, CCD) or a complementary metal oxide Semiconductor sensors (Complementary Metal-Oxide-Semiconductor, CMOS), etc.
  • CMOS complementary metal oxide Semiconductor sensors
  • the computing circuit can be a field programmable gate array (Field Programmable Gate Array, FPGA) computing circuit, or a microcontroller unit (Microcontroller Unit, MCU), etc. This application does not limit the specific type of computing circuit.
  • FPGA Field Programmable Gate Array
  • MCU Microcontroller Unit
  • the embodiment of the present application also provides a method for detecting the surface of a sample to be detected, including step S100, step S200 and step S300.
  • step S100 at least one light source is used to generate an initial light beam.
  • Step S200 Use a beam splitter to split the initial beam into a first split beam propagating along the first direction and a second split beam propagating along the second direction, and the first split beam is irradiated on the target surface.
  • Step S300 Use the first reflective member to illuminate the target surface with the second split beam.
  • the first partial beam is irradiated to the target surface, it is reflected to the first sensor; after the second partial beam is irradiated to the target surface, it is reflected to the second sensor.
  • the sample to be detected may be a wafer.
  • a wafer includes multiple dielectric layers and multiple metal layers.
  • chemical mechanical polishing can be used to remove the dielectric layer or metal layer.
  • light such as the first partial beam and the second partial beam
  • the intensity of the reflected light is different. Therefore, after the first sensor receives the reflected light of the first split beam and the second sensor receives the reflected light of the second split beam, the intensity of the reflected light can be detected to determine whether the grinding requirements are met. .
  • the initial beam 100 generated by the light source 10 can be divided into a first split beam 101 and a second split beam 102 that propagate in different directions, thereby reducing the use of the light source 10 quantity, which is beneficial to reducing the volume and production cost of the corresponding detection equipment.
  • the two beams can illuminate the surface (or target surface) of the sample 01 to be detected at different angles, which is beneficial to improving the accuracy of detecting the surface of the sample 01 to be detected.
  • the intensity of the reflected light will also be different, thus causing detection errors.
  • the intensity of the reflected light of the two light beams can be comprehensively considered, which is beneficial to improving the detection accuracy.
  • using a light source to generate an initial light beam may specifically include: using multiple light sources to generate multiple initial light beams with different wavelengths.
  • the detection accuracy of the surface of the sample 01 to be detected can be effectively improved.
  • different materials may have the same reflectivity for light beams of the same wavelength. Therefore, using one light source 10 may not effectively detect the interface between two materials. If two beams of different wavelengths are used, the above-mentioned adverse situations can be effectively avoided, thereby improving detection accuracy.
  • irradiating the first partial beam and the second partial beam on the target surface may specifically include: using a reflective member to reflect the first partial beam and/or the second partial beam to the target surface.
  • the propagation direction of the second partial beam 102 can be changed through the first reflective member 30 so that the second partial beam 102 can illuminate the target surface.
  • the propagation direction of the first partial beam 101 can be changed through the reflective member, so that the first partial beam 101 can illuminate the target surface.
  • the propagation direction of the first partial beam 101 and the second partial beam 102 can be changed through a reflective member, so that the first partial beam 101 and the second partial beam 102 are not directly illuminated. Both the two beams 102 can illuminate the target surface. It can be understood that during specific implementation, the application does not limit the type, quantity and placement location of the reflective elements.
  • the method of detecting the surface of a sample to be detected may further include step S400, step S500 and step S600.
  • the first sensor receives the first split beam reflected on the target surface and generates a first detection signal.
  • Step S500 The second sensor receives the second beam reflected by the target surface and generates a second detection signal.
  • Step S600 The detection circuit determines the state of the target surface of the sample to be detected based on the first detection signal and the second detection signal.
  • the detection circuit can determine the state of the target surface based on the first detection signal and the second detection signal, and further determine whether the grinding requirements are met.
  • step S101 may also be included, using a third reflective member 40 to change the propagation direction of the initial light beam.
  • the initial beam 100 can be changed through the third reflective member 40 .
  • the propagation direction of the light beam is such that the initial light beam can effectively illuminate the beam splitter 20 .
  • the above-mentioned detection device and detection method can be used in a variety of equipment that need to detect the surface of the sample.
  • the embodiment of the present application also provides a chemical mechanical grinding equipment.
  • Chemical mechanical grinding equipment uses a processing technology that combines chemical corrosion and mechanical removal.
  • a complete detection system is needed to monitor and adjust the grinding process.
  • This detection system can include motor torque sensor, closed-loop control, zone pressure adjustment, speed adjustment and grinding fluid flow rate adjustment, etc.
  • This may also include the detection device provided by the embodiment of the present application.
  • the main purpose of the entire detection system is to ensure the within-plane (With-in wafer, WIW) and between different wafers (Wafer to wafer, WTW) in the sample when grinding the sample. Flat consistency, and the ability to grind away to the ideal thickness, etc.
  • the chemical mechanical polishing equipment may include a polishing pad (not shown in the figures) and a detection device.
  • the polishing pad has a transparent viewing window 70 , the sample 01 to be detected can be located above the polishing pad, and the sample 01 to be detected can be observed through the transparent viewing window 70 .
  • the transparent window 70 can be embedded in the polishing pad and maintain good airtightness with the polishing pad, thereby preventing impurities such as polishing fluid or water vapor from causing erosion and other adverse effects on the detection device.
  • the chemical mechanical grinding equipment may also include a delivery mechanism for delivering grinding materials. It may also include a driving component for driving the sample 01 to be detected to perform actions such as rotation or movement. Or, a driving component used to drive the polishing pad to rotate or move, etc. In practical applications, chemical mechanical grinding equipment can use currently more mature product types, which will not be described in detail here.
  • the surface of the sample 01 to be detected (the lower surface in the figure) can be effectively detected, and the entire grinding process can be controlled based on the detection results, thereby Effectively improve grinding effect.
  • the detection device includes two light sources, namely light source 10a and light source 10b.
  • the light source 10a and the light source 10b are arranged side by side, that is, the initial light beam 100a generated by the light source 10a and the initial light beam 100b generated by the light source 10b are parallel to each other.
  • the propagation direction of the initial beam 100a and the initial beam 100b changes after passing through the third reflective member 40, so that they can be effectively transmitted to the beam splitter 20.
  • the initial beam 100a is split into a first split beam 101a and a second split beam 102a; the initial beam 100b is split into a first split beam 101b and a second split beam 102b.
  • the first partial beam 101a and the first partial beam 101b are directly irradiated to the lower surface of the sample 01 to be detected.
  • the second partial beam 102a and the second partial beam 102b are reflected by the first reflective member 30 and then illuminated to the lower surface of the sample 01 to be detected.
  • the wavelengths of the initial light beams 100 generated by the light source 10a and the light source 10b are different, the detection accuracy of the surface of the sample 01 to be detected can be effectively improved.
  • the lower surface of the sample to be detected 01 has a first dielectric layer 011 and a second dielectric layer 012, where the materials of the first dielectric layer 011 and the second dielectric layer 012 are different.
  • the first dielectric layer 011 is polished, the lower surface of the sample 01 to be detected can be effectively detected through the light beams generated by the light source 10a and the light source 10b.
  • the wavelength of the light generated by the light source 10a is 600 nm, and the wavelength of the light generated by the light source 10a is 400 nm.
  • FIG. 15 it is a light intensity change data simulation provided by the embodiment of the present application.
  • the abscissa in the figure represents the grinding thickness (nm), and the ordinate represents the reflectance.
  • L1 is the simulation curve of the first split beam 101a.
  • L2 is the simulation curve of the first split beam 101b.
  • L3 is the simulation curve of the second split beam 102a.
  • the dotted line represents the boundary point between the first dielectric layer 011 and the second dielectric layer 012 .
  • the detection accuracy can be effectively improved under the conditions of multiple different wavelengths of light.
  • it can be more accurately determined whether the grinding requirements are met, thereby improving the efficiency and accuracy of grinding.
  • the polishing requirements are met can also be determined by the diffraction effect of light in the first dielectric layer 011 .
  • FIG. 16 another simulation diagram of light intensity change data provided by an embodiment of the present application.
  • the abscissa represents the polishing thickness (nm), and the ordinate represents the reflectance.
  • L4 is the simulation curve of the first split beam 101a.
  • L5 is the simulation curve of the second split beam 102a.
  • the dotted line represents the boundary point between the first dielectric layer 011 and the second dielectric layer 012 .
  • the grinding standard is met near area C.
  • L4 is used as the basis for detection
  • the grinding standard can only be met near area D, so there will be errors.
  • the surface of the dielectric layer 011 or the second dielectric layer 012 has a pattern (or is patterned)
  • the intensity of the diffracted light may be insufficient or not within the detection range. Therefore, it may causing detection failure.
  • chemical mechanical grinding equipment can also be used with other types of detection devices to detect the sample 01 to be tested, thereby improving the detection accuracy and applicable scope.
  • the sample 01 to be detected can be detected by the eddy current sensor 80 .
  • the eddy current sensor 80 can realize non-contact detection of the sample 01 to be detected, and has the characteristics of high linearity and high resolution. By measuring the relative displacement change between the surface of the sample 01 to be detected (the surface below) and the probe, effective detection can be achieved.
  • the eddy current sensor 80 needs to be installed on the lower side of the transparent window 70, therefore, sufficient installation location is required.
  • the projection of the eddy current sensor 80 can be located between two adjacent light sources 10 (such as the light source 10a and the light source 10b) without blocking the light.
  • the number of light sources 10 is three or more, multiple light sources 10 can be arranged in parallel. A certain distance can be maintained between any two adjacent light sources 10 , thereby providing sufficient installation location for the eddy current sensor 80 .

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Abstract

一种光学反射仪、检测装置、化学机械研磨设备和检测待检测样品表面的方法。光学反射仪包括：至少一个光源(10)、分光件(20)和第一反光件(30)；光源(10)用于产生初始光束(100)；分光件(20)位于初始光束(100)的光路中，用于将初始光束(100)分割为第一分束(101)和第二分束(102)；第一分束(101)照射在目标面，第一反光件(30)用于改变第二分束(102)的传播方向，以使第二分束(102)照射在目标面。通过分光件(20)，能够将光源(10)产生的初始光束(100)分割为两个沿不同方向进行传播的分束，从而能够减少光源(10)的使用数量，有利于降低光学反射仪的制作成本和体积，便于实现小型化设计。

Description

一种光学反射仪和检测待检测样品表面的方法 技术领域
本申请涉及半导体制造技术领域，尤其涉及一种光学反射仪、检测装置、化学机械研磨设备和检测待检测样品表面的方法。
背景技术
在化学机械研磨设备(Chemical Mechanical Planarization，CMP)中，需要一套完备的手段去检测和监控研磨过程，从而可以根据检测结果对样品的研磨过程进行调整。在常用的检测手段中，激光反射检测技术能够实现光学无接触的特点，并且具有快速、准确的优点，因此，被广泛应用。激光反射检测技术的主要工作原理是：当光线照射在样品表面后，在样品的不同导电金属面上同样波长的光线具有不同的反射率。另外，光线在不同厚度的透明或者半透明介质层中会发生衍射效应，从而会导致光强有所变化。因此，通过对反射光线的光强和光强的变化便可以表征样品表面的信息，从而判断出样品表面是否达到研磨要求。
在目前应用激光反射检测技术的仪器中，为了实现多角度检测，通常会配备多个光源。即在不同位置分别放置一个光源，以使光线从不同角度照射在样品表面。但是，这种方式会明显增加光源的使用数量，因此，会造成制作成本过大的情况。另外，多个光源也会增加整个仪器的体积，从而不利于小型化设计。
发明内容
本申请提供了一种能够利用单一光源产生不同入射角度光线的光学反射仪、检测装置、化学机械研磨设备和检测待检测样品表面的方法。
一方面，本申请实施例提供了一种光学反射仪，包括至少一个光源、分光件和第一反射件。所述至少一个光源用于产生初始光束。分光件位于初始光束的光路中，用于将初始光束分割为沿第一方向传播的第一分束和沿第二方向传播的第二分束，且第一分束照射在目标面。第一反光件位于第二分束的光路中，用于改变第二分束的传播方向，以使第二分束照射在目标面；其中，第一分束照射至目标面后，反射至第一传感器；第二分束照射至目标面后，反射至第二传感器。在本申请实施例提供的光学反射仪中，通过分光件，能够将光源产生的初始光束分割为两个沿不同方向进行传播的分束，从而能够增加光束的数量，并且通过第一传感器对分束进行有效接收，通过第二传感器能够对第二分束进行有效接收。或者，也可以理解为，通过分光件能够使得单一光源产生两个有效光束，从而能够减少光源的使用数量，有利于降低制作成本和体积，便于实现小型化设计。当光学反射仪应用到化学机械研磨设备中，对待检测样品的表面进行检测时，采用通过第一分束和第二分束能够提升检测精度。例如，当采用一个光束(如第一分束)照射在待检测样品的表面，光束的角度与待检测样品的表面产生变化后，反射光的光强也会有所不同，从而会产生检测误差。当通过第一分束和第二分束照在射待检测样品的表面时，可以综合考虑两个光束的反 射光的光强，从而有利于提升检测精度。第一传感器接收第一分束的反射光后便可检测到反射光的光强。第二传感器接收第二分束的反射光后便可检测到反射光的光强。检测电路可以根据第一传感器和第二传感器所检测到的反射光的光强来判断待检测样品表面的状态。
在具体实施时，第一分束有可能会直接照射在目标面，或者，第一分束也有可能不会照射在目标面。当第一分束不能直接照射在目标面时，可以通过第二反光件对第一分束的传播方向进行改变，以使第一分束能够照射在目标面。
在具体实施时，光源的设置数量可以是一个也可以是多个。当光源的设置数量为多个时，多个光源所产生的初始光束的波长不相同。以使不同波长的光线能够有效的照射至待检测样品的表面，从而提升检测精度。例如，不同的材料对于同一波长的光束的反射率可能相同，因此，若采用单一波长的光束可能会无法有效的检测出两个材料的交界面。若采用两种不同波长的光束后，可以有效避免上述不良情况的发生，从而可以提高检测精度。
当光源的设置数量为多个时，多个光源可以并列设置，即多个光源所产生的初始光束的方向可以一致。以使分光件能够位于多个初始光束的光路中，从而，通过一个分光件便可对所有的初始光束进行有效分割，以便于降低分光件的使用数量。或者，多个光源也可以呈夹角设置，即多个光源所产生的初始光束的方向呈夹角(或不一致)。本申请对多个光源的位置布局不作限制。
在具体应用时，分光件可以包括分束镜片。其中，分束镜片具体可以是半透半反镜片。具体来说，光源所产生的初始光束以45°夹角照射在半透半反镜片的表面后，约50％的初始光束会直接透出，形成第一分束。约50％的初始光束被反射后形成第二分束。即通过半透半反镜片，初始光束被分割为光强大致相同的第一分束和第二分束。由于第一分束和第二分束的光强大致相同，因此，在后期对相应的检测信号进行相关计算时会减小计算难度。可以理解的是，在另外的实施方式中，分光件也可以采用分束器或者其他具有分束功能的器件对初始光束进行处理，以将初始光束分割为两个分束。本申请对分光件的具体类型不作具体限制。
对于第一反光件，在具体实施时，第一反光件可以是全反射镜。当光线照射在全反射镜的表面后，几乎100％的光线会被反射。可以理解的是，在其他的实施方式中，第一反光件也可以是全反射棱镜或其他能够改变光线传播方向的器件。本申请对第一反光件的具体类型不作限制。
可以理解的是，在具体应用时，也可以通过多个第一反光件对第二分束的传播方向进行调整。或者，也可以通过多个第一反光件对第二分束的传播方向进行依次调整。本申请对第一反光件的设置数量和具体位置不作具体限制。
对于第二反光件，在具体实施时，第一反光件可以是全反射镜。当光线照射在全反射镜的表面后，几乎100％的光线会被反射。可以理解的是，在其他的实施方式中，第二反光件也可以是全反射棱镜或其他能够改变光线传播方向的器件。本申请对第二反光件的具体类型不作限制。
可以理解的是，在具体应用时，也可以通过多个第二反光件对第一分束的传播方向进行调整。或者，也可以通过多个第二反光件对第一分束传播方向进行依次调整。本申请对第二反光件的设置数量和具体位置不作具体限制。
在实际应用时，光源或分光件的设置位置可能会存在一定的局限性，导致光源产生的 初始光束不能直接照射至分光件，因此，还可以设有第三反光件。例如，第三反光件可以设置在初始光束的传播路径中，用于改变初始光束的传播方向，以使初始光束能够照射至分光件。通过第三反光件，可以有效增加光源和分光件在位置布局上的灵活性。
在具体应用时，第三反光件可以选用与第一反光件相同或相类似的器件，在此不作赘述。
另一方面，本申请实施例还提供了一种检测装置，包括光学反射仪、第一传感器和第二传感器。当第一分束照射至目标面后产生反射。第一传感器接收第一分束的反射光后，根据第一分束的反射光的光强产生相应的第一检测信号。当第二分束照射至目标面后产生反射。第二传感器接收第二分束的反射光后，根据第二分束的反射光的光强产生相应的第二检测信号。
在具体实施时，检测装置还可以包括检测电路，检测电路与第一传感器和第二传感器电连接，用于接收第一检测信号和第二检测信号。通过检测电路的相关计算，便可判断出目标面是否满足要求。
在具体应用时，检测装置可以应用在多种设备中，用于实现检测目的。
例如，本申请实施例还提供了一种化学机械研磨设备。包括研磨垫和检测装置。研磨垫具有透明视窗，待检测样品可以位于研磨垫的一侧，且待检测样品的目标面位于透明视窗的投影区域内，检测装置可以位于研磨垫的另一侧，以使检测装置能够通过透明视窗来观测到待检测样品的目标面。
实际应用时，化学机械研磨设备中还可以配合其他类型的检测装置对待检测样品进行检测，从而提升检测精度和适用范围。
例如，可以通过涡流传感器对待检测样品进行检测。其中，在实际应用时，涡流传感器和上述的检测装置需要安装在透明视窗的同一侧。在本申请实施例提供的实施例中，当光学反射仪中包括多个并列设置的光源时，涡流传感器的投影可以位于相邻的两个光源之间，且不会对光线构成阻挡。另外还可以为涡流传感器提供足够的安装位置，能实现安装空间的有效兼容。
另一方面，本申请实施例还提供了一种检测待检测样品表面的方法，包括：使用至少一个光源产生初始光束，使用分光件将初始光束分割为沿第一方向传播的第一分束和沿第二方向传播的第二分束，且第一分束照射在目标面。使用第一反光件使第二分束照射在目标面；其中，第一分束照射至目标面后，反射至第一传感器，第二分束照射至目标面后，反射至第二传感器。通过本申请实施例提供的检测待检测样品表面的方法，可以将光源产生的初始光束分割为沿不同方向传播的第一分束和第二分束，从而能够减少光源的使用数量，有利于降低相应的检测设备的体积和制作成本。
在一种可能的实现方式中，检测待检测样品表面的方法还可以包括：第一传感器接收第一分束在目标面反射后的光束，并产生第一检测信号。第二传感器接收第二分束在目标面反射后的光束，并产生第二检测信号。检测电路根据第一检测信号和第二检测信号判断待检测样品的目标面的状态。
在一种可能的实现方式中，在使用分光件对初始光束进行分割之前还可以包括：使用反光件改变初始光束的传播方向，以使初始光束能够有效的照射在分光件。
在一种可能的实现方式中，使用光源产生初始光束可以包括：使用多个光源来产生多个波长不同的初始光束，从而有利于提升检测精度。例如，不同的材料对于同一波长的光 束的反射率可能相同，因此，若采用单一波长的光束可能会无法有效的检测出两个材料的交界面。若采用两种不同波长的光束后，可以有效避免上述不良情况的发生，从而可以提高检测精度。
附图说明
图1为本申请实施例提供的一种光学反射仪的应用场景示意图；
图2为本申请实施例提供的一种检测装置的结构简图；
图3为本申请实施例提供的一种光学反射仪的结构示意图；
图4为本申请实施例提供的一种分光件的结构示意图；
图5为本申请实施例提供的另一种分光件的结构示意图；
图6为本申请实施例提供的另一种光学反射仪的结构示意图；
图7为本申请实施例提供的一种光学反射仪的结构简图；
图8为本申请实施例提供的一种检测装置的结构示意图；
图9为本申请实施例提供的一种检测待检测样品表面的方法的流程图；
图10为本申请实施例提供的另一种检测待检测样品表面的方法的流程图；
图11为本申请实施例提供的另一种检测待检测样品表面的方法的流程图；
图12为本申请实施例提供的一种研磨设备的结构简图；
图13为本申请实施例提供的一种研磨设备的立体结构示意图；
图14为本申请实施例提供的一种待检测样品的截面结构示意图；
图15为本申请实施例提供的一种光强变化数据仿真图；
图16为本申请实施例提供的另一种光强变化数据仿真图；
图17为本申请实施例提供的一种研磨设备的立体结构示意图。
具体实施方式
为了使本申请的目的、技术方案和优点更加清楚，下面将结合附图对本申请作进一步地详细描述。
为了方便理解本申请实施例提供的光学反射仪，下面首先介绍一下其应用场景。
光学反射仪可以应用在利用光线对待检测样品表面进行检测的设备中。例如，如图1所示，可以通过具备光学反射仪的检测装置对待检测样品01的表面(如图中的下表面)进行检测。具体来说，光源02产生的光线照射在待检测样品01的表面后反射至光传感器03。当反射光线的光强有所变化时，光传感器03会产生不同的检测信号。后端的检测电路04依据光传感器03的检测信号便可判断出待检测样品01的表面是否符合要求。例如，当待检测样品01表面的材质有所不同时，光线会具有不同的反射率，因此，导致反射光线的光强有所不同。光传感器03针对不同的光强会产生不同的检测信号。因此，后端的检测电路04可以根据光传感器03的检测信号来判断待检测样品01表面是否达到研磨要求。另外，光线在不同厚度的透明或者半透明介质层中会发生衍射效应，从而会导致光强有规律性变化。因此，通过对反射光线的光强或光强的变化规律便可以表征待检测样品01表面的信息，从而判断出待检测样品01的表面是否符合要求。
在实际应用中，单一光源只能提供单一入射角度的光线，因此，在进行检测时很难实 现较为精准的检测。如图2所示，目前，为了提供实现多角度的检测，通常会在不同位置配备多个(图中示出有4个)光源02，且对应每个光源02分别配备有一个光传感器03。但是这种方式会明显增加光源02的使用数量，因此，会造成制作成本过大的情况。另外，多个光源02也会增加整个仪器的体积，从而不利于小型化设计。
为此，本申请实施例提供了一种能够利用单一光源产生不同入射角度光线的光学反射仪。
为了使本申请的目的、技术方案和优点更加清楚，下面将结合附图和具体实施例对本申请作进一步地详细描述。
以下实施例中所使用的术语只是为了描述特定实施例的目的，而并非旨在作为对本申请的限制。如在本申请的说明书和所附权利要求书中所使用的那样，单数表达形式“一个”、“一种”和“该”旨在也包括例如“一个或多个”这种表达形式，除非其上下文中明确地有相反指示。还应当理解，在本申请以下各实施例中，“至少一个”是指一个、两个或两个以上。
在本说明书中描述的参考“一个实施例”等意味着在本申请的一个或多个实施例中包括结合该实施例描述的特定特征、结构或特点。由此，在本说明书中的不同之处出现的语句“在一个实施例中”、“在一些实施方式中”、“在另外的实施方式中”等不是必然都参考相同的实施例，而是意味着“一个或多个但不是所有的实施例”，除非是以其他方式另外特别强调。术语“包括”、“具有”及它们的变形都意味着“包括但不限于”，除非是以其他方式另外特别强调。
如图3所示，在本申请提供的一个实施例中，光学反射仪包括光源10、分光件20和第一反光件30。光源10用于产生初始光束100。分光件20位于初始光束100的光路中，用于将初始光束100分割为沿第一方向传播的第一分束101和沿第二方向传播的第二分束102。第一反光件30位于第二分束102的光路中，用于改变第二分束102的传播方向，以使第二分束102照射在目标面(如图中待检测样品01的下表面)。在本申请实施例提供的光学反射仪中，通过分光件20，能够将光源10产生的初始光束100分割为两个沿不同方向进行传播的分束，从而能够增加光束的数量。或者，也可以理解为，通过分光件20能够使得单一光源10产生两个有效光束，从而能够减少光源10的使用数量，有利于降低光学反射仪的制作成本和体积，便于实现小型化设计。另外，通过第一反光件30，能够对第二分束102的传播方向进行有效调整，以使第二分束102能够照射至待检测样品01的表面(即目标面)，并且，两个光束能够以不同角度照射在待检测样品01的表面，从而有利于提升对待检测样品01的表面进行检测时的精度。例如，当采用一个光束照射在待检测样品01的表面，当光束的角度与待检测样品01的表面产生变化后，反射光的光强也会有所不同，从而会产生检测误差。当采用两个不同角度的光束照在射待检测样品01的表面时，可以综合考虑两个光束的反射光的光强，从而有利于提升检测精度。
可以理解的是，在本申请提供的实施例中，由于第一分束101可有效的照射在目标面，因此，未对第一分束101的传播方向进行调整。由于第二分束102的传播方向背离目标面，因此，通过第一反光件30对第二分束102的传播方向进行了调整，以使第二分束102能够有效的照射至目标面。
可以理解的是，在另外的一些实施方式中，当第一分束101不能有效照射至目标面时，也可以通过第二反光件(图中未示出)来改变第一分束101的传播方向，以使第一分束101能够有效的照射至目标面。或者，在一些情况下，第二反光件也可以理解为第一反光件30. 例如，可以将第一反光件30设置在第一分束101的光路中，以将第一分束101的传播方向进行调整。或者，当第二分束102在不依靠第一反光件30的作用下，仍能够有效的照射至目标面时，也可以省略设置第一反光件30。
如图3所示，在具体实施时，光源10可以包括激光器11和准直器12。在具体应用时，激光器11可以是固态激光器，也可以是可调谐激光器。其中，固态激光器可以产生特定波长的激光。可调谐激光器在一定范围内可以连续改变激光输出的波长。可以理解的是，在具体应用时，本申请对激光器11的具体类型不作限制。
准直器12的主要作用是，将激光器11产生的光线进行准直，以将光线处理为大致平行的光束，从而减少光线在后续的传播过程中产生能量耗散等不良现象。
可以理解的是，在其他的实施方式中，光源10也可以是其他类型的能够产生所需光束的器件，本申请对光源10的组成结构和具体类型不作限制。
对于分光件20，在本申请提供的实施例中，分光件20具体为分束镜片。
如图4所示，分束镜片主要是用于将入射光分成具有一定光强比例的透射光和反射光。在结构上，分束镜片主要包括光学玻璃21和镀在光学玻璃21表面的一层或多层薄膜22。当入射光在特定入射角度下照射在分束镜片表面后，一部分光线会直接透出，另一部分光线会被反射，从而形成两束光强呈特定比例的透射光和反射光。例如，在本申请提供实施例中，分束镜片具体为半透半反镜片。具体来说，光源所产生的初始光束以45°夹角照射在半透半反镜片的表面后，约50％的初始光束会直接透出，形成第一分束。约50％的初始光束被反射后形成第二分束。即通过半透半反镜片，初始光束被分割为光强大致相同的第一分束和第二分束。由于第一分束和第二分束的光强大致相同，因此，在后期对相应的检测信号进行相关计算时会减小计算难度。
可以理解的是，在具体应用时，初始光束100也可以呈其他的夹角(如0°至90°之间的任意值)照射在分束镜片的表面。另外，第一分束101和第二分束102的光强也可以不相同。例如，第一分束101与第二分束102的光强比例可以是1:2，1:3，2:1或2:3等。
或者，如图5所示，在另外的实施方式中，分光件20也可以是分束器。具体来说，分束器一般是立方体结构，主要由截面为三角形的玻璃棱镜23和玻璃棱镜24组成。在玻璃棱镜23和玻璃棱镜24之间通过介质膜25粘合在一起。其中，介质膜25的材质可以是聚酯、环氧树脂或聚氨酯等。在使用时，初始光束可以垂直于分束器的一侧面射入。经过介质膜25后，一部分光线沿初始光束的传播方向直接透出，形成第一分束；另一部分光线与初始光束呈90°夹角透出，形成第二分束。
可以理解的是，在实际应用时，分光件20也可以采用其他具有分束功能的器件对初始光束100进行处理，以将初始光束100分割为两个分束。本申请对分光件20的具体类型不作具体限制。
请参阅图3。对于第一反光件30，在本申请提供的实施例中，第一反光件30为全反射镜。当光线照射在全反射镜的表面后，几乎100％的光线会被反射。
可以理解的是，在其他的实施方式中，第一反光件30也可以是全反射棱镜或其他能够改变光线传播方向的器件。本申请对第一反光件30的具体类型不作限制。
另外，在本申请提供的实施例中，通过一个第一个反光件30对第二分束102的传播方向进行调整。可以理解的是，在其他的实施方式中，也可以通过多个第一反光件30对第二分束102的传播方向进行依次调整，以改变第二分束102的传播方向。本申请对第一 反光件30的设置数量和具体位置不作具体限制。
相应的，当第一分束101不能直接照射在目标面时，通过一个第二个反光件(图中未示出)对第一分束101的传播方向进行调整。可以理解的是，在其他的实施方式中，也可以通过多个第二反光件对第一分束101的传播方向进行依次调整，以改变第一分束101的传播方向。本申请对第二反光件的设置数量和具体位置不作具体限制。
在实际应用时，光源10或分光件20的设置位置可能会存在一定的局限性，导致光源10产生的初始光束100不能直接照射至分光件20，因此，在本申请提供的一个实施例中，还设有第三反光件40。
如图6所示，第三反光件40设置在初始光束100的传播路径中。或者，也可以理解为，第三反光件40位于光源10和分光件20之间，用于改变初始光束100的传播方向，以使初始光束100能够照射至分光件20。通过第三反光件40，可以有效增加光源10和分光件20在位置布局上的灵活性。
在本申请提供的实施例中，第三反光件40为全反射镜。当光线照射在全反射镜的表面后，几乎100％的光线会被反射。
可以理解的是，在其他的实施方式中，第三反光件40也可以是全反射棱镜或其他能够高效率的改变光线传播方向的器件。本申请对第三反光件40的具体类型不作限制。
另外，在本申请提供的实施例中，通过一个第三反光件40对初始光束100的传播方向进行调整。可以理解的是，在其他的实施方式中，也可以通过多个第三反光件40对初始光束100的传播方向进行依次调整，以改变初始光束100的传播方向，使初始光束100能够更好的照射至分光件20。可以理解的是，本申请对第三反光件40的设置数量和具体位置不作具体限制。
另外，在实际应用中，光源10也可以设置两个或两个以上，不同光源10所产生的初始光束100的波长可以不同，以使不同波长的光线能够有效的照射至待检测样品01的表面，从而提升检测精度。
如图7所示，在本申请提供的一个实施例中，设有两个光源10，分别为光源10a和光源10b。其中，光源10a和光源10b所产生的初始光束100的波长不相同。另外，光源10a和光源10b并列设置，即光源10a和光源10b产生的初始光束100相互平行。光源10a和光源10b产生的初始光束100经第三反光件40后传播方向产生变化，从而能够有效的传输至分光件20。经分光件20后，每个初始光束100均被分割为两个分束。请结合参阅图6，其中，第一分束101直接照射至待检测样品01的下表面。第二分束102经第一反光件30反射后照射至待检测样品01的下表面。当采用两个波长不同的光源后，可以有效提升对待检测样品01表面的检测精度。例如，不同的材料对于同一波长的光束的反射率可能相同，因此，若采用一个光源10可能会无法有效的检测出两个材料的交界面。若采用两种不同波长的光束后，可以有效避免上述不良情况的发生，从而可以提高检测精度。
另外，在本申请提供的实施例中，将光源10a和光源10b进行并列设置以后，可以通过一个第三反光件40、分光件20和第一反光件30便可对光源10a和光源10b所产生的光线进行同时处理，从而能够有效减少相关部件(如第三反光件40、分光件20和第一反光件30)的配置数量，从而有利于降低制作成本和装配时的复杂度。
当然，在其他的实施方式中，光源10也可以设置三个或者更多个。多个光源10可以并列设置也可以呈夹角设置。可以理解的是，当多个光源10呈夹角设置时，对于每个光 源10可以分别配备独立的第三反光件40、分光件20和第一反光件30，以使所有的光束均能够有效的照射至待检测样品01的表面(即目标面)。
在实际应用时，上述的光学反射仪可以应用在多种利用光线对待检测样品01表面进行检测的装置中。
例如，如图8所示，本申请实施例还提供了一种检测装置，包括光学反射仪、第一传感器51、第二传感器52和检测电路60。需要说明的是，为了便于理解检测装置的检测原理，下面以配备有一个光源10的光学反射仪为例进行具体说明。具体来说，光学反射仪中包括一个光源10、第三反光件40、分光件20和第一反光件30。光源10产生的初始光束100经第三反光件40反射后，改变了初始光束100的传播方向，以使初始光束100照射至分光件20。初始光束100经分光件20进行处理后，被分割为第一分束101和第二分束102。其中，第一分束101照射至待检测样品01的下表面后产生反射。第一传感器51接收第一分束101的反射光后，根据第一分束101的光强产生相应的第一检测信号。第二分束102经第一反光件30反射后，改变了第二分束102的传播方向，使第二分束102照射至待检测样品01。当第二分束102照射至待检测样品01的下表面后产生反射。第二传感器52接收第二分束102的反射光后，根据第二分束102的光强产生相应的第二检测信号。
可以理解的是，在实际应用中，光源10的设置数量也可以是两个或者更多个。另外，需要说明的是，当光源10的设置数量增加后，相应的传感器(如上述的第一传感器51和第二传感器52)的设置数量也需要对应增加，从而可以对每个反射后的光线进行有效接收。
检测电路60与第一传感器51和第二传感器52电连接，并对第一传感器51和第二传感器52的检测信号进行处理，从而可以判断出待检测样品01的下表面是否符合要求。在具体实施时，检测电路60中可以包括放大电路、模数转换电路和计算电路等。其中，放大电路用于放大第一传感器51和第二传感器52的检测信号，以供后续的相关处理。模数转换电路的主要功能是将模拟信号转化为数字信号，以供后续的相关计算。计算电路用于对转化后的检测信号进行计算等处理，以判断出待检测样品01的表面是否符合要求。其中，第一传感器51和第二传感器52可以是光电二极管(Photo Diode，PD)、雪崩光电二极管(Avalanche Photo Diode，APD)、电荷耦合器件图像传感器(Charge Coupled Device，CCD)或互补金属氧化物半导体传感器(Complementary Metal-Oxide-Semiconductor，CMOS)等。本申请对第一传感器51和第二传感器52的具体类型不作限制。
计算电路可以应用现场可编程逻辑门阵列(Field Programmable Gate Array，FPGA)的计算电路，也可以是微控制单元(Microcontroller Unit，MCU)等。本申请对计算电路的具体类型不作限制。
如图9所示，本申请实施例还提供了一种检测待检测样品表面的方法，包括步骤S100、步骤S200和步骤S300。
具体来说，步骤S100，使用至少一个光源产生初始光束。
步骤S200、使用分光件将初始光束分割为沿第一方向传播的第一分束和沿第二方向传播的第二分束，且第一分束照射在目标面。
步骤S300、使用第一反光件使第二分束照射在目标面。
其中，第一分束照射至目标面后，反射至第一传感器，第二分束照射至目标面后，反射至第二传感器。
在具体实施时，待检测样品可以是晶圆。例如，在晶圆中包括多层介质层和多层金属层，在将晶圆制备成特定的产品时，可以采用化学机械研磨的方法将其中的介质层或金属层去除。当光线(如第一分束和第二分束)照射至不同材料的表面后反射光的光强有所不同。因此，通过第一传感器对第一分束的反射光进行接收、通过第二传感器对第二分束的反射光进行接收后，可以检测到反射光的光强，以此来判断是否达到研磨要求。
请结合参阅图8和图9。通过本申请实施例提供的检测待检测样品表面的方法，可以将光源10产生的初始光束100分割为沿不同方向传播的第一分束101和第二分束102，从而能够减少光源10的使用数量，有利于降低相应的检测设备的体积和制作成本。另外，两个光束能够以不同角度照射在待检测样品01的表面(或目标面)，从而有利于提升对待检测样品01的表面进行检测时的精度。例如，当采用一个光束照射在待检测样品01的表面，当光束的角度与待检测样品01的表面产生变化后，反射光的光强也会有所不同，从而会产生检测误差。当采用两个不同角度的光束照在射待检测样品01的表面时，可以综合考虑两个光束的反射光的光强，从而有利于提升检测精度。
在步骤S100中，使用光源产生初始光束具体可以包括：使用多个光源，产生多个波长不同的初始光束。
当采用两个波长不同的光源后，可以有效提升对待检测样品01表面的检测精度。例如，不同的材料对于同一波长的光束的反射率可能相同，因此，若采用一个光源10可能会无法有效的检测出两个材料的交界面。若采用两种不同波长的光束后，可以有效避免上述不良情况的发生，从而可以提高检测精度。
在步骤S300中，使第一分束和第二分束照射在目标面具体可以包括：使用反光件将第一分束和/或第二分束反射至目标面。
请结合参阅图8和图9。具体来说，当第二分束102不能直接照射至目标面时，可以通过第一反光件30改变第二分束102的传播方向，以使第二分束102能够照射在目标面。另外，可以理解的是，当第一分束101不能直接照射至目标面时，可以通过反光件改变第一分束101的传播方向，以使第一分束101能够照射在目标面。当第一分束101和第二分束102均不能直接照射至目标面时，可以通过反光件改变第一分束101和第二分束102的传播方向，以使第一分束101和第二分束102均能够照射在目标面。可以理解的是，在具体实施时，反光件的类型、使用数量和设置位置本申请不作限制。
如图10所示，在一种可能的实现方式中，检测待检测样品表面的方法还可以包括步骤S400、步骤S500和步骤S600。
具体来说，步骤S400、第一传感器接收第一分束在目标面反射后的光束，并产生第一检测信号。
步骤S500、第二传感器接收第二分束在目标面反射后的光束，并产生第二检测信号。
步骤S600、检测电路根据第一检测信号和第二检测信号判断待检测样品的目标面的状态。
在具体实施时，检测电路可以根据第一检测信号和第二检测信号来判断目标面的状态，进而判断是否达到研磨要求。
如图11和图8所示，在一种可能的实现方式中，在步骤S200之前，还可以包括步骤S101、使用第三反光件40改变初始光束的传播方向。
在实际应用时，光源10或分光件20的设置位置可能会存在一定的局限性，导致光源 10产生的初始光束100不能直接照射至分光件20，因此，可以通过第三反光件40来改变初始光束的传播方向，以使初始光束能够有效的照射至分光件20。
可以理解的是，在具体实施时，上述的检测待检测样品表面的方法也可以不依照上述的步骤或顺序进行实施。本申请对步骤的顺序不作限制。
在实际应用时，上述的检测装置和检测方法可以应用在多种需要对样品的表面进行检测的设备中。
本申请实施例还提供了一种化学机械研磨设备。化学机械研磨设备的利用化学腐蚀作用和机械去除作用相结合的加工技术，在研磨过程中需要一套完备的检测系统去监控和调整研磨过程。这套检测系统中可以包括电机扭矩传感器、闭环控制、分区压力调节、转速调节和研磨液流速调节等。这其中也可以包含本申请实施例所提供的检测装置。总的来说，整个检测系统的主要是为了在对样品进行研磨时，保证样品中的单个晶圆面内(With-in wafer，WIW)和不同晶圆之间(Wafer to wafer，WTW)的平坦一致性，并能够研磨掉理想的厚度等。
具体来说，如图12和图13所示，化学机械研磨设备可以包括研磨垫(图中未示出)和检测装置。研磨垫具有透明视窗70，待检测样品01可以位于研磨垫的上方，且通过透明视窗70能够观测到待检测样品01。
在具体实施时，透明视窗70可以镶嵌在研磨垫中，并与研磨垫之间保持良好的密闭性，从而防止研磨液或水汽等杂质对检测装置造成侵蚀等不良影响。
可以理解的是，在实际应用时，化学机械研磨设备中还可以包括用于投放研磨材料的投放机构。还可以包括用于驱动待检测样品01进行旋转或移动等动作的驱动部件。或者，用于驱动研磨垫进行旋转或移动的驱动部件等。在实际应用中，化学机械研磨设备可以采用目前较为成熟的产品类型，在此不作赘述。
在化学机械研磨设备中，通过配备本申请实施例提供的检测装置，可以对待检测样品01的表面(如图中的下表面)进行有效检测，并且，可以根据检测结果来控制整个研磨过程，从而有效提升研磨效果。
下面，对检测装置的检测过程进行具体说明。
请结合参阅图12和图13。检测装置中包括两个光源，分别为光源10a和光源10b，光源10a和光源10b并列设置，即光源10a产生的初始光束100a和光源10b产生的初始光束100b相互平行。初始光束100a和初始光束100b经第三反光件40后传播方向产生变化，从而能够有效的传输至分光件20。经分光件20后，初始光束100a被分割为第一分束101a和第二分束102a；初始光束100b被分割为第一分束101b和第二分束102b。其中，第一分束101a和第一分束101b直接照射至待检测样品01的下表面。第二分束102a和第二分束102b经第一反光件30反射后照射至待检测样品01的下表面。当光源10a和光源10b所产生的初始光束100的波长不同时，可以有效提升对待检测样品01表面的检测精度。
具体来说，如图14所示，待检测样品01的下表面具有第一介质层011和第二介质层012，其中，第一介质层011和第二介质层012的材料有所不同。在进行研磨时，若以第一介质层011被研磨完为标准要求，则可以通过光源10a和光源10b所产生的光束对待检测样品01的下表面进行有效检测。
假设光源10a所产生的光线的波长为600nm，光源10a所产生的光线的波长为400nm。
如图15所示，为本申请实施例提供的一种光强变化数据仿真。图中横坐标表示研磨 厚度(nm)，纵坐标表示反射率。L1为第一分束101a的仿真曲线。L2为第一分束101b的仿真曲线。L3为第二分束102a的仿真曲线。虚线表示第一介质层011和第二介质层012的分界点。
由图中可以看出，当仅以L3为检测依据时，则在区域A附近L3的仿真曲线应该产生明显变化。但是，由于第二分束102b在第一介质层011和第二介质层012中的反射率几乎相同，因此，不能检测出第一介质层011和第二介质层012之间的分界点，从而会导致检测失效。
第一分束101a和第一分束101b在第一介质层011和第二介质层012中的反射率存在明显差异，因此，若以L1或L2为检测依据可以有效的检测出第一介质层011和第二介质层012的临界点，从而可以判断出是否达到研磨要求。
另外，请继续参阅图15。总体来看，虽然L1和L2的变化趋势基本相同，但是在区域B附近还是存在细微的差异。例如，L1的曲线变化是先上仰，之后区域平稳。L2的曲线变化是直接趋于平稳。因此，通过对L1和L2的综合参考，可以更加精准的判断出是否达到研磨要求。
总的来说，通过在多个不同波长光线的条件下，可以有效提升检测精度。另外，通过增加不同角度的入射光线，可以更加精确的判断出是否达到研磨要求，从而能够提升研磨时的效率和精准度。
另外，当第一介质层011为透明或半透明的材质时，也可以通过光线在第一介质层011中的衍射效应来判断是否达到研磨要求。
如图16所示，为本申请实施例提供的另一个光强变化数据仿真图。图中横坐标表示研磨厚度(nm)，纵坐标表示反射率。L4为第一分束101a的仿真曲线。L5为第二分束102a的仿真曲线。虚线表示第一介质层011和第二介质层012的分界点。
由于光线在第一介质011中的衍射效应，其光强变化遵循正弦变化，直到研磨至第二介质层012时，这种规律才会消失，因此，可以以此来判断是否达到研磨要求。
具体来说，如图16所示，如果单以L5为检测依据时，则在区域C附近则满足研磨标准。但是，如果单以L4为检测依据时，则在区域D附近才能满足研磨标准，因此，会存在误差。另外，在一些情况下，若介质层011或第二介质层012的表面存在图案(或被图形化)时，还有可能出现衍射光线的光强不足或不在检测范围内的情况，因此，会导致检测失效。
总的来说，通过在多个不同波长光线的条件下，可以更加精确的判断出是否达到研磨要求，从而能够提升研磨时的效率和精准度。
另外，在实际应用时，化学机械研磨设备中还可以配合其他类型的检测装置对待检测样品01进行检测，从而提升检测精度和适用范围。
例如，如图17所示。可以通过涡流传感器80对待检测样品01进行检测。其中，涡流传感器80能够对待检测样品01实现非接触性检测，且具有高线性度和高分辨力等特点。通过测量待检测样品01表面(如下表面)与探头之间的相对位移变化，便可实现有效检测。
在实际应用时，涡流传感器80需要安装在透明视窗70的下侧，因此，需要足够的安装位置。
在本申请实施例提供的实施例中，由于光源10a和光源10b之间可以存在一定距离， 因此，可以为涡流传感器80提供足够的安装位置，能实现安装空间的有效兼容。概括来说，涡流传感器80的投影可以位于相邻的两个光源10(如光源10a和光源10b)之间，且不会对光线构成阻挡。当光源10的设置数量为三个或者三个以上时，多个光源10可以并列设置。在任意两个相邻的光源10之间可以保持一定的间隔，从而可以为涡流传感器80提供足够的安装位置。
以上，仅为本申请的具体实施方式，但本申请的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本申请揭露的技术范围内，可轻易想到变化或替换，都应涵盖在本申请的保护范围之内。因此，本申请的保护范围应以权利要求的保护范围为准。

Claims (19)

  1. 一种光学反射仪，其特征在于，包括：
    至少一个光源，用于产生初始光束；
    分光件，位于所述初始光束的光路中，用于将所述初始光束分割为沿第一方向传播的第一分束和沿第二方向传播的第二分束，且所述第一分束照射在目标面；
    第一反光件，位于所述第二分束的光路中，用于改变所述第二分束的传播方向，以使所述第二分束照射在所述目标面；其中，所述第一分束照射至所述目标面后，反射至第一传感器；所述第二分束照射至所述目标面后，反射至第二传感器。
  2. 根据权利要求1所述的光学反射仪，其特征在于，所述光学反射仪还包括第二反光件，所述第二反光件设置在所述第一分束的光路中，用于改变所述第一分束的传播方向，以使所述第一分束照射在所述目标面。
  3. 根据权利要求1或2所述的光学反射仪，其特征在于，所述至少一个光源为多个光源，且所述多个光源所产生的所述初始光束的波长不相同。
  4. 根据权利要求3所述的光学反射仪，其特征在于，所述多个光源并列设置，以使所述多个光源产生的初始光束的传播方向一致。
  5. 根据权利要求1至4中任一所述的光学反射仪，其特征在于，所述分光件包括分束镜片。
  6. 根据权利要求5所述的光学反射仪，其特征在于，所述分束镜片为半透半反镜片。
  7. 根据权利要求1至6中任一所述的光学反射仪，其特征在于，所述第一反光件包括全反射镜片。
  8. 根据权利要求1至7中任一所述的光学反射仪，其特征在于，所述第二反光件包括全反射镜片。
  9. 根据权利要求1至8中任一所述的光学反射仪，其特征在于，还包括第三反光件，所述第三反光件位于所述至少一个光源和所述分光件之间；
    其中，所述第三反光件用于改变所述初始光束的传播方向。
  10. 根据权利要求9所述的光学反射仪，其特征在于，所述第三反光件包括全反射镜片。
  11. 一种检测装置，其特征在于，包括如权利要求1至10中任一所述的光学反射仪，还包括所述第一传感器和所述第二传感器；
    所述第一传感器用于接收所述第一分束在所述目标面反射后的光束，并产生第一检测信号，所述第二传感器用于接收所述第二分束在所述目标面反射后的光束，并产生第二检测信号。
  12. 根据权利要求11所述的检测装置，其特征在于，还包括检测电路，所述检测电路与所述第一传感器和所述第二传感器电连接，用于接收所述第一检测信号和所述第二检测信号，并根据所述第一检测信号和所述第二检测信号判断所述目标面的状态。
  13. 一种化学机械研磨设备，其特征在于，包括研磨垫，所述研磨垫具有透明视窗；
    所述化学机械研磨设备还包括如权利要求11或12所述的检测装置，所述检测装置位于所述研磨垫的一侧，且所述目标面位于所述透明视窗的投影区域内。
  14. 根据权利要求13所述的化学机械研磨设备，其特征在于，还包括涡流传感器，所述涡流传感器和所述检测装置设置在所述透明视窗的同一侧。
  15. 根据权利要求14所述的化学机械研磨设备，其特征在于，当所述光源设有多个时，所述涡流传感器的投影位于任两个相邻的光源之间。
  16. 一种检测待检测样品表面的方法，其特征在于，包括：
    使用至少一个光源产生初始光束；
    使用分光件将所述初始光束分割为沿第一方向传播的第一分束和沿第二方向传播的第二分束，且所述第一分束照射在所述目标面；
    使用第一反光件使所述第二分束照射在所述目标面；
    其中，所述第一分束照射至所述目标面后，反射至第一传感器；所述第二分束照射至所述目标面后，反射至第二传感器。
  17. 根据权利要求16所述的检测待检测样品表面的方法，其特征在于，还包括：
    所述第一传感器接收所述第一分束在所述目标面反射后的光束，并产生第一检测信号；
    所述第二传感器接收所述第二分束在所述目标面发射后的光束，并产生第二检测信号；
    检测电路根据所述第一检测信号和所述第二检测信号判断所述待检测样品的所述目标面的状态。
  18. 根据权利要求16或17所述的检测待检测样品表面的方法，其特征在于，在使用所述分光件之前，还包括：
    使用第三反光件改变所述初始光束的传播方向。
  19. 根据权利要求16至18中任一所述的检测待检测样品表面的方法，其特征在于，使用光源产生初始光束包括：
    使用多个光源，产生多个波长不同的初始光束。
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US5433651A (en) * 1993-12-22 1995-07-18 International Business Machines Corporation In-situ endpoint detection and process monitoring method and apparatus for chemical-mechanical polishing
US20020013007A1 (en) * 2000-06-16 2002-01-31 Nec Corporation Semiconductor wafer polishing end point detection method and apparatus
US20030003605A1 (en) * 2001-06-29 2003-01-02 Kla-Tencor In-situ end point detection for semiconductor wafer polishing
CN1423800A (zh) * 2000-01-21 2003-06-11 福来克斯产品公司 利用光学干涉图样的自动检验系统和方法

Patent Citations (4)

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Publication number Priority date Publication date Assignee Title
US5433651A (en) * 1993-12-22 1995-07-18 International Business Machines Corporation In-situ endpoint detection and process monitoring method and apparatus for chemical-mechanical polishing
CN1423800A (zh) * 2000-01-21 2003-06-11 福来克斯产品公司 利用光学干涉图样的自动检验系统和方法
US20020013007A1 (en) * 2000-06-16 2002-01-31 Nec Corporation Semiconductor wafer polishing end point detection method and apparatus
US20030003605A1 (en) * 2001-06-29 2003-01-02 Kla-Tencor In-situ end point detection for semiconductor wafer polishing

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