WO2023195728A1 - Dispositif électronique et procédé de réduction de consommation de courant - Google Patents

Dispositif électronique et procédé de réduction de consommation de courant Download PDF

Info

Publication number
WO2023195728A1
WO2023195728A1 PCT/KR2023/004498 KR2023004498W WO2023195728A1 WO 2023195728 A1 WO2023195728 A1 WO 2023195728A1 KR 2023004498 W KR2023004498 W KR 2023004498W WO 2023195728 A1 WO2023195728 A1 WO 2023195728A1
Authority
WO
WIPO (PCT)
Prior art keywords
grip
electronic device
processor
signal
grip signal
Prior art date
Application number
PCT/KR2023/004498
Other languages
English (en)
Korean (ko)
Inventor
조우식
심명섭
Original Assignee
삼성전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020220070860A external-priority patent/KR20230143534A/ko
Application filed by 삼성전자 주식회사 filed Critical 삼성전자 주식회사
Priority to EP23718610.1A priority Critical patent/EP4280711A1/fr
Publication of WO2023195728A1 publication Critical patent/WO2023195728A1/fr

Links

Images

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/26—Power supply means, e.g. regulation thereof
    • G06F1/32—Means for saving power
    • G06F1/3203—Power management, i.e. event-based initiation of a power-saving mode
    • G06F1/3206—Monitoring of events, devices or parameters that trigger a change in power modality
    • G06F1/3228—Monitoring task completion, e.g. by use of idle timers, stop commands or wait commands
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
    • H04B1/3827—Portable transceivers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04W—WIRELESS COMMUNICATION NETWORKS
    • H04W52/00—Power management, e.g. TPC [Transmission Power Control], power saving or power classes
    • H04W52/02—Power saving arrangements
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04W—WIRELESS COMMUNICATION NETWORKS
    • H04W52/00—Power management, e.g. TPC [Transmission Power Control], power saving or power classes
    • H04W52/04—TPC
    • H04W52/30—TPC using constraints in the total amount of available transmission power
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04W—WIRELESS COMMUNICATION NETWORKS
    • H04W76/00—Connection management
    • H04W76/20—Manipulation of established connections
    • H04W76/28—Discontinuous transmission [DTX]; Discontinuous reception [DRX]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D30/00—Reducing energy consumption in communication networks
    • Y02D30/70—Reducing energy consumption in communication networks in wireless communication networks

Definitions

  • This document relates to electronic devices and, for example, is an invention regarding a method of improving current consumption using electronic devices.
  • Electronic devices may include a plurality of processors that perform various functions.
  • the processor may include an application processor and a communication processor.
  • Electronic devices can perform various functions using the communication connection between the AP and CP.
  • Electronic devices may emit electromagnetic waves in the process of communicating with a base station using CP.
  • the emitted electromagnetic waves can be absorbed by the body of a person or animal, and the thermal effect generated by the electromagnetic waves absorbed by the human body can be quantitatively expressed as a specific absorption rate (SAR).
  • Electronic devices can be controlled by controlling the power (Tx power) of transmitted electromagnetic waves and executing power back-off so that the electromagnetic wave absorption rate is lower than a specified value.
  • a grip signal that recognizes the human body may be configured to always be transmitted to a communication processor through an application processor. Even when the application processor is in sleep mode because the electronic device is not used for a certain period of time, if a grip signal is input, the sleep mode is released and the application processor wakes up to receive the grip signal and deliver the message to the communication processor. I was able to. Therefore, even when an unintentional touch occurred by the user or when power backoff was not required because the SAR value was not a problem, there was a problem in that the application processor's sleep mode was released and current consumption increased.
  • the purpose of various embodiments of this document is to provide a method for improving the current consumption of an electronic device by controlling the application processor not to release the sleep mode in situations where power back-off of the electronic device is not required as described above. .
  • an electronic device includes a grip sensor that detects a grip signal, a communication processor (CP), and an application processor operatively connected to the grip sensor and the communication processor.
  • a grip sensor that detects a grip signal
  • CP communication processor
  • AP application processor operatively connected to the grip sensor and the communication processor.
  • the application processor enters a sleep mode, determines whether the grip sensor will generate the grip signal, and, in response to determining to generate the grip signal, outputs the grip sensor from the grip sensor. It may be set to release the sleep mode based on receiving the generated grip signal, notify the communication processor of receipt of the grip signal from the grip sensor, and control the communication processor to perform power backoff.
  • the application processor may be set to determine not to generate a grip signal when a predetermined condition is satisfied, and to block the communication channel with the grip sensor in response to the decision not to generate a grip signal. .
  • the application processor may be set to check whether power backoff is not applied to the band in use, and determine not to receive the grip signal in response to confirming that the band is a band to which power backoff is not applied.
  • the application processor is set to determine whether the area currently located is a strong electric field area using the communication processor, and to determine not to receive the grip signal in response to confirming that the currently located area is a strong electric field area. You can.
  • the application processor may be configured to determine whether the electronic device is in the C-DRX section and, in response to confirming that the electronic device is in the C-DRX section, determine not to receive a grip signal.
  • the application processor determines whether the band used by the communication processor is a TDD band, and does not receive a grip signal in the downlink section in response to confirming that the band used by the communication processor is a TDD band. It can be set to decide.
  • the application processor may be set to release the sleep mode in response to generating the grip signal when the predetermined condition is not satisfied.
  • the application processor may be set to enter a sleep mode when a predetermined condition is met for a period of time during which no user input is detected.
  • a method of improving current consumption of an electronic device includes an operation of entering a sleep mode, an operation of determining whether a grip sensor will generate a grip signal, and determining whether to generate the grip signal.
  • an operation of releasing a sleep mode based on receiving the generated grip signal from the grip sensor, notifying the communication processor of receipt of a grip signal from the grip sensor, and causing the communication processor to perform a power back-off It may include a control operation to execute.
  • the operation of determining whether to generate a grip signal from the grip sensor includes determining not to generate a grip signal when a predetermined condition is satisfied, and in response to determining not to generate a grip signal, the grip sensor It may include an operation to block the communication channel with the sensor.
  • the operation of determining not to generate a grip signal when the predetermined condition is satisfied includes the operation of checking whether power backoff is not applied to the band in use, and in response to confirming that the band is a band to which power backoff is not applied, The operation may include determining not to receive the grip signal.
  • the operation of determining not to generate a grip signal when the predetermined condition is satisfied includes determining whether the currently located area is a strong electric field area using the communication processor, and confirming that the currently located area is a strong electric field area.
  • the operation may include determining not to generate a grip signal.
  • the operation of determining not to generate a grip signal when the predetermined condition is satisfied includes the operation of checking whether the electronic device is in the C-DRX section, and in response to checking that the electronic device is in the C-DRX section, The operation may include determining not to generate a signal.
  • the operation of determining not to generate a grip signal when the predetermined condition is satisfied includes the operation of checking whether the band used by the communication processor is a TDD band, and the operation of confirming that the band used by the communication processor is a TDD band.
  • an operation of determining not to generate a grip signal in the downlink section may be included.
  • the operation of determining not to generate a grip signal when the predetermined condition is satisfied may include an operation of releasing the sleep mode in response to generating the grip signal when the predetermined condition is not satisfied.
  • the operation of entering the sleep mode may include entering the sleep mode when the time during which no user input is detected satisfies a predetermined condition.
  • the electronic device may improve current consumption of the electronic device by preventing frequent wake-up by a grip signal when power backoff of the communication processor is not required in a sleep mode situation of the application processor.
  • effects that can be obtained or expected due to various exemplary embodiments of the present electronic device will be directly or implicitly disclosed in the detailed description of the various exemplary embodiments of the electronic device.
  • effects expected according to various exemplary embodiments of the electronic device will be disclosed in the detailed description to be described later.
  • FIG. 1 is a block diagram of an electronic device in a network environment, according to various example embodiments.
  • FIG. 2 is a block diagram of a power management module and battery, according to example embodiments.
  • FIG. 3 is a block diagram illustrating communication between an application processor, a communications processor, and a grip sensor, according to various example embodiments.
  • Figure 4 is a block diagram of an electronic device according to various example embodiments.
  • FIG. 5 is a graph showing current consumption of an electronic device according to sleep mode and wake-up of an application processor according to various example embodiments.
  • FIG. 6 is a diagram illustrating power consumption of an electronic device in a C-DRX section according to various example embodiments.
  • FIG. 7 is a diagram illustrating a section operating according to a data communication method in a TDD band according to various exemplary embodiments.
  • Figure 8 is a flowchart of a method for improving current consumption of an electronic device according to various example embodiments.
  • FIG. 1 is a block diagram of an electronic device 101 in a network environment 100, according to various example embodiments.
  • the electronic device 101 communicates with the electronic device 102 through a first network 198 (e.g., a short-range wireless communication network) or a second network 199. It is possible to communicate with at least one of the electronic device 104 or the server 108 through (e.g., a long-distance wireless communication network). According to an example embodiment, electronic device 101 may communicate with electronic device 104 through server 108. According to an exemplary embodiment, the electronic device 101 includes a processor 120, a memory 130, an input module 150, an audio output module 155, a display module 160, an audio module 170, and a sensor module.
  • connection terminal 172 may be omitted or one or more other components may be added to the electronic device 101.
  • some of these components e.g., sensor module 176, camera module 180, or antenna module 197) are integrated into one component (e.g., display module 160). It can be.
  • the processor 120 for example, executes software (e.g., program 140) to operate at least one other component (e.g., hardware or software component) of the electronic device 101 connected to the processor 120. It can be controlled and various data processing or calculations can be performed. According to one embodiment, as at least part of data processing or computation, the processor 120 stores commands or data received from another component (e.g., sensor module 176 or communication module 190) in volatile memory 132. The commands or data stored in the volatile memory 132 can be processed, and the resulting data can be stored in the non-volatile memory 134.
  • software e.g., program 140
  • the processor 120 stores commands or data received from another component (e.g., sensor module 176 or communication module 190) in volatile memory 132.
  • the commands or data stored in the volatile memory 132 can be processed, and the resulting data can be stored in the non-volatile memory 134.
  • the processor 120 may include a main processor 121 (e.g., a central processing unit or an application processor) or an auxiliary processor 123 (e.g., a graphics processing unit, a neural network processing unit) that can operate independently or together with the main processor 121.
  • auxiliary processor 123 e.g., a graphics processing unit, a neural network processing unit
  • the main processor 121 e.g., a central processing unit or an application processor
  • auxiliary processor 123 e.g., a graphics processing unit, a neural network processing unit
  • the main processor 121 e.g., a central processing unit or an application processor
  • auxiliary processor 123 e.g., a graphics processing unit, a neural network processing unit
  • image signal processor e.g., image signal processor, sensor hub processor, or communication processor.
  • the secondary processor 123 may be set to use lower power than the main processor 121 or be specialized for a designated function. You can.
  • the auxiliary processor 123 may be implemented separately from
  • the auxiliary processor 123 may, for example, act on behalf of the main processor 121 while the main processor 121 is in an inactive (e.g., sleep) state, or while the main processor 121 is in an active (e.g., application execution) state. ), together with the main processor 121, at least one of the components of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190) At least some of the functions or states related to can be controlled.
  • coprocessor 123 e.g., image signal processor or communication processor
  • may be implemented as part of another functionally related component e.g., camera module 180 or communication module 190. You can.
  • the auxiliary processor 123 may include a hardware structure specialized for processing artificial intelligence models.
  • Artificial intelligence models can be created through machine learning. For example, such learning may be performed in the electronic device 101 itself on which the artificial intelligence model is performed, or may be performed through a separate server (e.g., server 108).
  • Learning algorithms may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but It is not limited.
  • An artificial intelligence model may include multiple artificial neural network layers.
  • Artificial neural networks include deep neural network (DNN), convolutional neural network (CNN), recurrent neural network (RNN), restricted boltzmann machine (RBM), belief deep network (DBN), bidirectional recurrent deep neural network (BRDNN), It may be one of deep Q-networks or a combination of two or more of the above, but is not limited to the examples described above.
  • artificial intelligence models may additionally or alternatively include software structures.
  • the memory 130 may store various data used by at least one component (eg, the processor 120 or the sensor module 176) of the electronic device 101. Data may include, for example, input data or output data for software (e.g., program 140) and instructions related thereto.
  • Memory 130 may include volatile memory 132 or non-volatile memory 134.
  • the program 140 may be stored as software in the memory 130 and may include, for example, an operating system 142, middleware 144, or application 146.
  • the input module 150 may receive commands or data to be used in a component of the electronic device 101 (e.g., the processor 120) from outside the electronic device 101 (e.g., a user).
  • the input module 150 may include, for example, a microphone, mouse, keyboard, keys (eg, buttons), or digital pen (eg, stylus pen).
  • the sound output module 155 may output sound signals to the outside of the electronic device 101.
  • the sound output module 155 may include, for example, a speaker or a receiver. Speakers can be used for general purposes such as multimedia playback or recording playback.
  • the receiver can be used to receive incoming calls. According to example embodiments, the receiver may be implemented separately from the speaker or as part of it.
  • the display module 160 can visually provide information to the outside of the electronic device 101 (eg, a user).
  • the display module 160 may include, for example, a display, a hologram device, or a projector, and a control circuit for controlling the device.
  • the display module 160 may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of force generated by the touch.
  • the audio module 170 can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to an exemplary embodiment, the audio module 170 acquires sound through the input module 150, the sound output module 155, or an external electronic device (e.g., connected directly or wirelessly to the electronic device 101). : Sound can be output through an electronic device 102 (e.g., speaker or headphone).
  • an electronic device 102 e.g., speaker or headphone
  • the sensor module 176 detects the operating state (e.g., power or temperature) of the electronic device 101 or the external environmental state (e.g., user state) and generates an electrical signal or data value corresponding to the detected state. can do.
  • the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, and a biometric sensor.
  • the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, and a biometric sensor.
  • IR infrared
  • biometric sensor may include a temperature sensor, a humidity sensor, or an illumination sensor.
  • the interface 177 may support one or more designated protocols that can be used to connect the electronic device 101 directly or wirelessly with an external electronic device (eg, the electronic device 102).
  • the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.
  • HDMI high definition multimedia interface
  • USB universal serial bus
  • SD card interface Secure Digital Card interface
  • audio interface audio interface
  • connection terminal 178 may include a connector through which the electronic device 101 can be physically connected to an external electronic device (eg, the electronic device 102).
  • the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).
  • the haptic module 179 can convert electrical signals into mechanical stimulation (e.g., vibration or movement) or electrical stimulation that the user can perceive through tactile or kinesthetic senses.
  • the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.
  • the camera module 180 can capture still images and moving images.
  • camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.
  • the power management module 188 can manage power supplied to the electronic device 101.
  • the power management module 188 may be implemented as at least part of a power management integrated circuit (PMIC), for example.
  • PMIC power management integrated circuit
  • the battery 189 may supply power to at least one component of the electronic device 101.
  • the battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.
  • Communication module 190 is configured to provide a direct (e.g., wired) communication channel or wireless communication channel between electronic device 101 and an external electronic device (e.g., electronic device 102, electronic device 104, or server 108). It can support establishment and communication through established communication channels. Communication module 190 operates independently of processor 120 (e.g., an application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication.
  • processor 120 e.g., an application processor
  • the communication module 190 may be a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 ( Example: local area network (LAN) communication module, or power line communication module).
  • a wireless communication module 192 e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module
  • GNSS global navigation satellite system
  • wired communication module 194 Example: local area network (LAN) communication module, or power line communication module.
  • the corresponding communication module is a first network 198 (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network 199 (e.g., legacy It may communicate with an external electronic device 104 through a telecommunication network such as a cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., LAN or WAN).
  • a telecommunication network such as a cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., LAN or WAN).
  • a telecommunication network such as a cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., LAN or WAN).
  • a telecommunication network such as a cellular network, a 5G network, a next-generation communication network
  • the wireless communication module 192 uses subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 within a communication network such as the first network 198 or the second network 199.
  • subscriber information e.g., International Mobile Subscriber Identifier (IMSI)
  • IMSI International Mobile Subscriber Identifier
  • the wireless communication module 192 may support 5G networks after 4G networks and next-generation communication technologies, for example, NR access technology (new radio access technology).
  • NR access technology provides high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and access to multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low latency). -latency communications)) can be supported.
  • the wireless communication module 192 may support high frequency bands (eg, mmWave bands), for example, to achieve high data rates.
  • the wireless communication module 192 uses various technologies to secure performance in high frequency bands, for example, beamforming, massive array multiple-input and multiple-output (MIMO), and full-dimensional multiplexing. It can support technologies such as input/output (FD-MIMO: full dimensional MIMO), array antenna, analog beam-forming, or large scale antenna.
  • the wireless communication module 192 may support various requirements specified in the electronic device 101, an external electronic device (e.g., electronic device 104), or a network system (e.g., second network 199).
  • the wireless communication module 192 supports peak data rate (e.g., 20 Gbps or more) for realizing eMBB, loss coverage (e.g., 164 dB or less) for realizing mmTC, or U-plane latency for realizing URLLC.
  • peak data rate e.g., 20 Gbps or more
  • loss coverage e.g., 164 dB or less
  • U-plane latency for realizing URLLC.
  • DL and uplink (UL) each of 0.5 ms or less, or round trip 1 ms or less
  • the antenna module 197 may transmit or receive signals or power to or from the outside (eg, an external electronic device).
  • the antenna module 197 may include an antenna including a radiator made of a conductor or a conductive pattern formed on a substrate (eg, PCB).
  • the antenna module 197 may include a plurality of antennas (eg, an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 198 or the second network 199 is connected to the plurality of antennas by, for example, the communication module 190. can be selected Signals or power may be transmitted or received between the communication module 190 and an external electronic device through the at least one selected antenna.
  • other components eg, radio frequency integrated circuit (RFIC) may be additionally formed as part of the antenna module 197.
  • RFIC radio frequency integrated circuit
  • antenna module 197 may form a mmWave antenna module.
  • a mmWave antenna module includes a printed circuit board, an RFIC disposed on or adjacent to a first side (e.g., bottom side) of the printed circuit board and capable of supporting a designated high frequency band (e.g., mmWave band). , and a plurality of antennas (e.g., array antennas) disposed on or adjacent to the second side (e.g., top or side) of the printed circuit board and capable of transmitting or receiving signals in the designated high frequency band. It can be included.
  • peripheral devices e.g., bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)
  • signal e.g. commands or data
  • commands or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199.
  • Each of the external electronic devices 102 or 104 may be of the same or different type as the electronic device 101.
  • all or part of the operations performed in the electronic device 101 may be executed in one or more of the external electronic devices 102, 104, or 108.
  • the electronic device 101 may perform the function or service instead of executing the function or service on its own.
  • one or more external electronic devices may be requested to perform at least part of the function or service.
  • One or more external electronic devices that have received the request may execute at least part of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device 101.
  • the electronic device 101 may process the result as is or additionally and provide it as at least part of a response to the request.
  • cloud computing distributed computing, mobile edge computing (MEC), or client-server computing technology can be used.
  • the electronic device 101 may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing.
  • the external electronic device 104 may include an Internet of Things (IoT) device.
  • Server 108 may be an intelligent server using machine learning and/or neural networks.
  • the external electronic device 104 or server 108 may be included in the second network 199.
  • the electronic device 101 may be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.
  • Electronic devices may be of various types. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to exemplary embodiments of the present disclosure are not limited to the above-described devices.
  • a or B “at least one of A and B”, “at least one of A or B”, “A, B or C”, “at least one of A, B and C”, and “A
  • Each of phrases such as “at least one of , B, or C” may include any one of the items listed together in the corresponding phrase, or any possible combination thereof.
  • Terms such as “first”, “second”, or “first” or “second” may be used simply to distinguish one component from another, and to refer to that component in other respects (e.g., importance or order) is not limited.
  • One (e.g., first) component is said to be “coupled” or “connected” to another (e.g., second) component, with or without the terms “functionally” or “communicatively.”
  • second component e.g., any of the components can be connected to the other components directly (e.g. wired), wirelessly, or through a third component.
  • module used in various example embodiments of the present disclosure may include a unit implemented in hardware, software, or firmware, and may be interchanged with terms such as logic, logic block, component, or circuit, for example. Can be used interchangeably.
  • a module may be an integrated part or a minimum unit of the parts or a part thereof that performs one or more functions.
  • the module may be implemented in the form of an application-specific integrated circuit (ASIC).
  • ASIC application-specific integrated circuit
  • a storage medium e.g., internal memory 136 or external memory 138
  • a machine e.g., electronic device 101
  • a processor e.g., processor 120
  • the one or more instructions may include code generated by a compiler or code that can be executed by an interpreter.
  • a storage medium that can be read by a device may be provided in the form of a non-transitory storage medium.
  • 'non-transitory' only means that the storage medium is a tangible device and does not contain signals (e.g. electromagnetic waves), and this term refers to cases where data is semi-permanently stored in the storage medium. There is no distinction between temporary storage cases.
  • a method according to various exemplary embodiments of the present disclosure may be included and provided in a computer program product.
  • Computer program products are commodities and can be traded between sellers and buyers.
  • the computer program product may be distributed in the form of a machine-readable storage medium (e.g. compact disc read only memory (CD-ROM)) or via an application store (e.g. Play Store TM ) or on two user devices (e.g. It can be distributed (e.g. downloaded or uploaded) directly between smart phones) or online.
  • a portion of the computer program product may be at least temporarily stored or temporarily created in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.
  • each component e.g., a module or program of the above-described components may include a single or a plurality of entities, and some of the plurality of entities are separately arranged in other components. It could be.
  • one or more of the components or operations described above may be omitted, or one or more other components or operations may be added.
  • multiple components eg, modules or programs
  • the integrated component may perform one or more functions of each component of the plurality of components that are performed by the corresponding component of the plurality of components prior to the integration. It can be performed the same or similarly.
  • operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order. , may be omitted, or one or more other operations may be added.
  • FIG. 2 is a block diagram of the power management module 188 and battery 189, according to various example embodiments.
  • power management module 188 may include a charging circuit 210, a power regulator 220, or a fuel gauge 230.
  • the charging circuit 210 may charge the battery 189 using power supplied from an external power source for the electronic device 101.
  • the charging circuit 210 is configured to determine the type of external power source (e.g., power adapter, USB, or wireless charging), the size of power that can be supplied from the external power source (e.g., about 20 watts or more), or a battery (e.g., A charging method (eg, normal charging or fast charging) may be selected based on at least some of the attributes of 189), and the battery 189 may be charged using the selected charging method.
  • the external power source may be, for example, wired through the connection terminal 178 or wirelessly connected through the antenna module 197.
  • the power regulator 220 may generate a plurality of powers having different voltages or different current levels by adjusting the voltage level or current level of power supplied from an external power source or the battery 189.
  • the power regulator 220 may adjust the power of the external power source or battery 189 to a voltage or current level suitable for each component included in the electronic device 101.
  • the power regulator 220 may be implemented in the form of a low drop out (LDO) regulator or a switching regulator.
  • LDO low drop out
  • the fuel gauge 230 may measure usage status information (e.g., battery capacity, number of charge/discharge cycles, voltage, or temperature) of the battery 189.
  • usage status information e.g., battery capacity, number of charge/discharge cycles, voltage, or temperature
  • the power management module 188 may, for example, use the charging circuit 210, the voltage regulator 220, or the fuel gauge 230 to control the battery 189 based at least in part on the measured usage information.
  • Determine state of charge information related to charging e.g., life, overvoltage, undervoltage, overcurrent, overcharge, over discharge, overheating, short circuit, or swelling
  • state of charge information e.g., life, overvoltage, undervoltage, overcurrent, overcharge, over discharge, overheating, short circuit, or swelling
  • charging of the battery 189 may be adjusted (eg, charging current or voltage reduced, or charging stopped).
  • at least some of the functions of the power management module 188 may be performed by an external control device (eg, processor 120).
  • the battery 189 may include a battery protection circuit (protection circuit module (PCM)) 240, according to an example embodiment.
  • the battery protection circuit 240 may perform various functions (eg, a pre-blocking function) to prevent performance degradation or burnout of the battery 189.
  • the battery protection circuit 240 is, additionally or in alternative to, a battery management system (BMS) for performing cell balancing, battery capacity measurement, charge/discharge count measurement, temperature measurement, or voltage measurement. ))).
  • BMS battery management system
  • At least a portion of the usage state information or the charging state information of the battery 189 may be generated from a corresponding sensor among the fuel gauge 230, power management module 188, or sensor module 276 (e.g., It can be measured using a temperature sensor).
  • the corresponding sensor e.g., temperature sensor
  • the corresponding sensor of the sensor module 176 is included as part of the battery protection circuit 240, or is a separate device from the battery 189. It can be placed nearby.
  • FIG. 3 is a block diagram illustrating communication between an application processor, a communications processor, and a grip sensor, according to various example embodiments.
  • the electronic device 300 may include an application processor 330, a communication processor 340, a grip sensor 320, and a PAMiD module 350.
  • the application processor 330 may run an application and perform graphics processing of the electronic device 300.
  • the application processor 330 may be implemented in a SoC (system on chip) method that can perform various functions such as a graphics processing unit (GPU), communication chip, sensor, display, and multimedia.
  • the communication processor 340 may perform data communication between the electronic device 300 and an external device, and may be implemented integrated with the application processor 330.
  • the grip sensor 320 can detect physical contact between the user's human body and the electronic device 300.
  • the grip sensor 320 includes a metal pad and can detect contact between the human body and the metal pad, or can detect physical contact using a change in capacitance.
  • the grip sensor 320 may generate a grip signal when the amount of capacitance change in the metal sensor 310 satisfies a predetermined condition.
  • the grip sensor 320 may generate a grip signal when the amount of change in capacitance in the metal sensor 310 is greater than a threshold.
  • the grip sensor 320 may transmit the generated grip signal to the application processor 330 through the Grip interrupt channel. After booting, the electronic device 300 may continuously perform the function of monitoring the change in capacitance of the metal sensor 310.
  • the grip sensor 320 may be connected to the AP using a Grip interrupt, which is a communication channel with the application processor 330.
  • the grip sensor 320 may acquire a grip signal by detecting contact between the electronic device 300 and the human body, and transmit the acquired grip signal to the application processor 330 through the Grip interrupt channel.
  • the Grip interrupt channel may not be connected depending on conditions.
  • the application processor 330 may not receive a grip signal from the Grip interrupt channel in a section where power backoff is not required.
  • the PAMiD module 350 is a component of the electronic device 300 that includes an RF filter and may include a duplexer, a switch, and a power amplifier.
  • the application processor 330 may be connected to the grip sensor 320 through a Grip I2C channel. According to an exemplary embodiment, the application processor 330 may control the grip sensor 320 through the Grip I2C channel. For example, the application processor 330 may configure the grip sensor 320 not to transmit a grip signal and/or configure the grip sensor 320 to transmit a grip signal through the Grip I2C channel.
  • the application processor 330 may enter a sleep mode when a predetermined condition is satisfied.
  • Sleep mode may refer to a mode in which the application processor 330 is deactivated to reduce power consumption.
  • the application processor 330 may check whether a user input is detected, and enter a sleep mode if no user input is detected for a certain period of time.
  • the application processor 330 may release the sleep mode state.
  • wake-up may be used in the same sense as releasing sleep mode.
  • the application processor 330 may wake up and receive a grip signal from the grip sensor 320.
  • the application processor 330 may transmit a grip signal to the communication processor 340.
  • the application processor 330 may transmit the grip signal to the communication processor 340 using the QLINK channel.
  • the QLINK channel may refer to a channel used for communication between the application processor 330 and the communication processor 340.
  • the application processor 330 may determine whether to execute power backoff of the communication processor 340 using the received grip signal.
  • the communication processor 340 may control transmission power based on whether power backoff is performed.
  • the electronic device may determine whether to perform power backoff. If it is decided not to perform power backoff, the electronic device may block the grip signal input from the grip sensor to the application processor and maintain a sleep mode. If it is later decided to perform a power backoff, the electronic device can wake up the application processor and transmit a grip signal from the grip sensor to the application processor.
  • Figure 4 is a block diagram of an electronic device according to various example embodiments.
  • the electronic device 400 may include a display 420, a grip sensor 430, an application processor 412, a communication processor 414, a memory 440, and a communication circuit 450. , in various example embodiments, some of the depicted configurations may be omitted or replaced.
  • the electronic device 400 may further include at least some of the configuration and/or functions of the electronic device 101 of FIG. 1 . At least some of the components of the electronic device 400 shown (or not shown) may be operatively, functionally, and/or electrically connected to each other.
  • the display 420 may display various images under the control of the processor 410.
  • the display 420 may be a liquid crystal display (LCD), a light-emitting diode (LED) display, a micro LED display, a quantum dot (QD) display, or an organic light emitting diode (organic light). -emitting diode (OLED)) display, but is not limited to this.
  • the display 420 may be formed as a touch screen that detects touch and/or proximity touch (or hovering) input using a user's body part (eg, finger) or input device (eg, stylus pen).
  • the display 420 may include at least some of the configuration and/or functions of the display module 160 of FIG. 1 .
  • the display 420 may include a metal sensor, and the metal sensor may measure capacitance that changes in response to a user input to the display 420.
  • the display 420 is flexible and may be implemented as a foldable display or a rollable display.
  • the grip sensor 430 may detect physical contact between the user's human body and the electronic device 400.
  • the grip sensor 430 may detect a motion in which the user holds the electronic device 400 with his or her hand.
  • the grip sensor 430 may monitor the amount of change in the capacitance of the metal sensor included in the display 420 and check whether the amount of change in the capacitance of the metal sensor is outside a predetermined range. When the amount of change in capacitance of the metal sensor is outside the specified range, the grip sensor 430 may generate a grip signal and transmit the generated grip signal to the application processor 412 using the Grip interrupt channel.
  • memory 440 includes volatile memory (e.g., volatile memory 132 of FIG. 1) and non-volatile memory (e.g., non-volatile memory 134 of FIG. 1) to store various data. They can be stored temporarily or permanently.
  • the memory 440 includes at least a portion of the configuration and/or functions of the memory 130 of FIG. 1 and may store the program 140 of FIG. 1 .
  • the memory 440 may store various instructions that can be performed by the processor 410. These instructions may include control instructions such as arithmetic and logical operations, data movement, input/output, etc. that can be recognized by the processor 410.
  • the communication circuit 450 may communicate with the electronic device 400 and/or an external device to receive and/or transmit various information.
  • the communication processor 514 is connected to the communication circuit 450 and can process various information received by the communication circuit 450. Additionally, the communication processor 514 may control the communication circuit 450 to transmit various information to the electronic device 400 and an external electronic device.
  • the application processor 412 operates operatively with each component of the electronic device 400 (e.g., display 420, grip sensor 430, memory 440), It may be functionally and/or electrically connected to perform operations or data processing related to control and/or communication of each component.
  • the application processor 412 may include at least some of the components and/or functions of the processor 120 of FIG. 1 .
  • 'processor' refers to the application processor 412 and may be used separately from the communication processor 414.
  • the application processor 412 may determine whether to enter a sleep mode. For example, the application processor 412 may determine to enter a sleep mode when there is no external input for a certain period of time. For example, if there is no user's touch input to the display 420 for a certain period of time, the application processor 412 may enter a sleep mode. The application processor 412 may enter sleep mode to reduce unnecessary power consumption.
  • the application processor 412 may receive a grip signal from the grip sensor 430 .
  • the grip sensor 430 may monitor the change in capacitance of the metal sensor and transmit a grip signal to the application processor 412 when the change in capacitance satisfies a predetermined condition.
  • the grip sensor 430 may transmit a grip signal to the application processor 412 when the change in capacitance of the metal sensor exceeds a threshold.
  • the application processor 412 may transmit the grip signal to the communication processor 414.
  • the application processor 412 may release the sleep mode (wake up) and transmit the grip signal to the communication processor 414.
  • communications processor 414 may determine whether to perform power backoff upon receiving a grip signal. For example, the communication processor 414 may calculate a specific absorption rate (SAR) according to the grip signal.
  • SAR specific absorption rate
  • Electromagnetic wave absorption rate is a quantitative expression of the amount of electromagnetic waves absorbed by the body of a person or animal, and a different value can be set as the upper limit for each country. For example, Korea may have 1.6W/kg, and the international recommended standard may be 2W/kg.
  • the electromagnetic wave absorption rate may be proportional to the transmission power, and if the electromagnetic wave absorption rate is higher than a predetermined value, the communication processor 414 may lower the transmission power by executing power backoff.
  • the maximum power that can be transmitted from the electronic device 400 is 23 dB, but if the maximum power is used, the electromagnetic wave absorption rate may exceed the threshold. Therefore, if the communication processor 414 performs power backoff and transmits at a power of 19 dB, the electromagnetic wave absorption rate can be controlled so that it does not exceed the threshold.
  • the application processor 412 may not receive a grip signal from the grip sensor 430 when a predetermined condition is satisfied.
  • the application processor 412 may block the Grip interrupt channel, which is an interrupt signal line of the grip sensor 430, when a predetermined condition is satisfied.
  • the application processor 412 may set the grip sensor 430 through the Grip I2C channel so that the grip sensor 430 does not transmit a grip signal through the Grip interrupt channel.
  • the application processor 412 may ignore the grip signal received through the Grip interrupt channel.
  • the application processor 412 may deactivate the grip sensor 430 when a predetermined condition is satisfied.
  • the application processor 412 may block the communication channel with the grip sensor 430 when using a band to which power backoff is not applied.
  • the application processor 412 may use a plurality of bands with different frequencies in a communication connection with the base station. For example, in 2G communications (Global System for Mobile Communications, GSM), power backoff can be applied to only two bands out of a total of four bands, and in 3G communications (Wideband Code Division Multiple Access, WCDMA), only two bands out of a total of five bands can be applied.
  • GSM Global System for Mobile Communications
  • WCDMA Wideband Code Division Multiple Access
  • Power backoff can be applied to only 3 bands, in 4G communication (Long Term Evolution, LTE), power backoff can be applied to only 8 bands out of a total of 26 bands, and in 5G communication (SUB6), out of a total of 18 bands. Power backoff can be applied to only 7 bands.
  • the application processor 412 may check whether the band currently used for communication is a band to which power backoff is applied, and if it is a band to which power backoff is not applied, it may block the communication channel with the grip sensor 430.
  • the application processor 412 may block the communication channel with the grip sensor 430 based on the electric field conditions of the area where the electronic device 400 is currently located. In the case of a strong electric field area with good electric field conditions, communication connection can be smoothly established even without the electronic device 400 using large transmission power. In such a strong electric field area, the application processor 412 can use low enough transmission power to avoid the need for power backoff. The application processor 412 may lower the transmission power and not perform power backoff based on the current location being identified as a strong electric field area. The application processor 412 may check whether the area where the electronic device 400 is currently located is a strong electric field area, and if it is confirmed to be a strong electric field area, it may block the communication connection with the grip sensor 430.
  • the communication channel with the grip sensor 430 may not be blocked in order to determine whether to execute power backoff to reduce transmission power.
  • the application processor 412 may block the communication channel with the grip sensor 430 when the electronic device 400 is in the C-DRX section. If the electronic device 400 satisfies a set condition, the application processor 412 can enter the C-DRX section and block the RF of the terminal. For example, if data traffic is not detected in the electronic device 400 for a certain period of time, the application processor 412 may enter the C-DRX section. In the C-DRX section, the application processor 412 may only perform network searching intermittently and may not establish a data connection between the network and the terminal. Since there is no power used by the electronic device 400, transmission power is not a problem, and therefore the power backoff function may not be performed. The application processor 412 can improve current consumption by blocking the communication channel with the grip sensor 430.
  • the application processor 412 may block the communication channel with the grip sensor 430 in the downlink section in the time division duplex (TDD) band.
  • the TDD band may refer to a frequency usage method that divides time and alternately uses uplink and downlink.
  • the TDD band can be time-divided and use frequencies as uplink, downlink, and special subframes.
  • the application processor 412 may perform data communication for a set time (eg, 10 ms) in one frame.
  • One frame may consist of a plurality of subframes, and each subframe may include at least one uplink, downlink, and special subframe.
  • the uplink is a section for transmitting power
  • the downlink is a section for receiving power
  • the special subframe may be a section for controlling sync.
  • the uplink power is transmitted, so the electromagnetic wave absorption rate must be considered.
  • the application processor 412 may not need to perform power backoff in the downlink and special subframe sections except for the uplink that transmits power.
  • the application processor 412 may block the communication channel with the grip sensor 430 in the downlink and special subframe sections.
  • the application processor 412 may block the communication channel with the grip sensor 430 when at least one of the conditions described above is satisfied. According to another embodiment, the application processor 412 may resume communication with the grip sensor 430 when all of the above-described conditions are not satisfied. When the application processor 412 receives a grip signal from the grip sensor 430, it can wake up and transmit the grip signal to the communication processor 414.
  • FIG. 5 is a graph showing current consumption of an electronic device according to sleep mode and wake-up of an application processor according to various example embodiments.
  • the electronic device may perform different functions depending on the sleep mode 503 and wake-up 501, 505 of the processor (e.g., the application processor 412 in FIG. 4), and the electronic device may perform different functions. Depending on the function performed, there may be differences in power consumption.
  • the application processor 412 can execute only minimal functions in sleep mode. For example, you can reduce power consumption and battery consumption by reducing the display brightness and resolution and CPU speed.
  • the application processor 412 sets a condition that does not require wakeup in order to reduce the current consumed during wakeup, and when the condition that does not require wakeup is satisfied, the application processor 412 detects a grip sensor (e.g., FIG. 4 In order to not receive a grip signal from the grip sensor 430, the communication channel with the grip sensor 430 may be blocked.
  • a grip sensor e.g., FIG. 4 In order to not receive a grip signal from the grip sensor 430, the communication channel with the grip sensor 430 may be blocked.
  • FIG. 6 is a diagram illustrating power consumption of an electronic device in a C-DRX section according to various example embodiments.
  • the electronic device may block the communication channel with the grip sensor (e.g., the grip sensor 430 in FIG. 4) in a section in which power is not transmitted in the C-DRX (Connected-DRX) section 610. You can.
  • the electronic device may not transmit power except during network searching in the C-DRX section 610. If the electronic device does not transmit power, the electromagnetic wave absorption rate is not a problem, so power backoff may not be performed. If the electronic device does not transmit power in the C-DRX section 610, it may block the communication channel with the grip sensor 430.
  • the electronic device may enter the C-DRX section 610 when the DRX (Discontinuous reception) deactivation time elapses after terminating the reception of downlink information.
  • the electronic device switches from receiving data continuously to receiving data discontinuously, and power consumption during the disconnected section can be reduced.
  • FIG. 7 is a diagram illustrating a section operating according to a data communication method in a TDD band according to various exemplary embodiments.
  • the electronic device when performing data communication in the TDD band, may block the communication channel with the grip sensor (e.g., the grip sensor 430 in FIG. 4) in the downlink frequency channel.
  • the TDD band may refer to a frequency usage method that divides time and alternately uses uplink and downlink.
  • the TDD band can be time-divided and use frequencies as uplink, downlink, and special subframes.
  • a processor eg, the application processor 412 of FIG. 4
  • One frame may consist of a plurality of subframes, and each subframe may include at least one uplink, downlink, and special subframe.
  • the uplink is a section for transmitting power
  • the downlink is a section for receiving power
  • the special subframe may be a section for controlling sync. Since power is transmitted in the uplink, the electromagnetic wave absorption rate must be considered. However, in the downlink and special subframe, power is received or only a small amount of power is transmitted, so there is no need to consider the electromagnetic wave absorption rate. Therefore, when using the TDD band, the application processor 412 may not need to perform power backoff in the downlink and special subframe sections except for the uplink that transmits power. When using the TDD band, the application processor 412 may block the communication channel with the grip sensor 430 in the downlink and special subframe sections.
  • an electronic device can use seven types of TDD band communication methods 700.
  • the electronic device uses frequency channels in the order of downlink, special subframe, uplink, uplink, uplink, downlink, special subframe, uplink, uplink, and uplink. You can. Since the electronic device transmits power in the uplink, it may not transmit power in subframes 1, 2, 6, and 7.
  • the electronic device may block the communication channel between the application processor 412 and the grip sensor 430 and not perform power backoff in subframes 1, 2, 6, and 7.
  • An electronic device includes a grip sensor that detects a grip signal, a communication processor (CP), and an application processor (AP) operatively connected to the grip sensor and the communication processor,
  • the application processor enters a sleep mode, determines whether the grip sensor will generate the grip signal, and, in response to determining to generate the grip signal, receives the generated grip signal from the grip sensor. Based on this, it can be set to release the sleep mode, notify the communication processor of receipt of the grip signal from the grip sensor, and control the communication processor to perform power backoff.
  • the application processor determines not to generate a grip signal if a predetermined condition is satisfied, and, in response to the decision not to generate a grip signal, communicates with the grip sensor. It can be set to block channels.
  • the application processor determines whether power backoff is not applied to the band in use, and, in response to confirming that the band is a band to which power backoff is not applied, does not receive a grip signal. It can be set to decide.
  • the application processor determines whether the area currently located is a strong electric field area using the communication processor, and generates a grip signal in response to confirming that the currently located area is a strong electric field area. It can be set to decide not to receive it.
  • the application processor determines whether the electronic device is in a C-DRX section, and, in response to determining that the electronic device is in the C-DRX section, does not receive a grip signal. It can be set to decide.
  • the application processor determines whether the band used by the communication processor is a TDD band, and configures the downlink section in response to confirming that the band used by the communication processor is a TDD band. may be set to determine not to receive the grip signal.
  • the application processor may be set to release the sleep mode in response to generating the grip signal when the predetermined condition is not satisfied.
  • the application processor may be set to enter a sleep mode when a predetermined condition is satisfied for a period of time during which no user input is detected.
  • Figure 8 is a flowchart of a method for improving current consumption of an electronic device according to various example embodiments.
  • the method shown in FIG. 8 can be performed by the electronic device described with reference to FIGS. 1 to 7 (e.g., the electronic device 101 in FIG. 1 and the electronic device 400 in FIG. 4), and hereinafter described above. We will omit the description of the technical features. And each step in Figure 8 is not necessarily an essential step, and some steps may be omitted.
  • the electronic device may enter a sleep mode.
  • the electronic device may determine that the application processor (e.g., the application processor 412 of FIG. 4) will enter a sleep mode when there is no external input for a predetermined period of time. For example, if there is no user's touch input to the display for a certain period of time, the application processor 412 may enter a sleep mode. The application processor 412 may enter sleep mode to reduce unnecessary power consumption.
  • the electronic device may receive a grip signal using the grip sensor 430.
  • the grip sensor 430 monitors the amount of change in the capacitance of the metal sensor to determine the amount of change in the capacitance. If the amount of change satisfies a predetermined condition, the grip signal can be transmitted to the application processor 412. For example, if the amount of change in the capacitance of the metal sensor exceeds the threshold, the grip sensor 430 transmits the grip signal to the application processor 412. ).
  • the application processor 412 may transmit the grip signal to a communication processor (e.g., the communication processor 414 in FIG. 4).
  • sleep mode When a grip signal is received, the electronic device may release the sleep mode (wake up) and transmit the grip signal to the communication processor 414.
  • communications processor 414 may determine whether to perform power backoff upon receiving a grip signal. For example, the communication processor 414 may calculate a specific absorption rate (SAR) according to the grip signal.
  • SAR specific absorption rate
  • Electromagnetic wave absorption rate is a quantitative expression of the amount of electromagnetic waves absorbed by the body of a person or animal, and a different value can be set as the upper limit for each country.
  • the electronic device may determine whether to block the communication channel between the application processor 412 and the grip sensor 430. If it is determined to block the communication channel between the application processor 412 and the grip sensor 430, the electronic device may not perform power backoff.
  • the electronic device may block the communication channel with the grip sensor 430 when using a band to which power backoff is not applied.
  • An electronic device may use multiple bands with different frequencies in a communication connection with a base station. For example, in 2G communications (Global System for Mobile Communications, GSM), power backoff can be applied to only two bands out of a total of four bands, and in 3G communications (Wideband Code Division Multiple Access, WCDMA), only two bands out of a total of five bands can be applied. Power backoff can be applied to only 3 bands, in 4G communication (Long Term Evolution, LTE), power backoff can be applied to only 8 bands out of a total of 26 bands, and in 5G communication (SUB6), out of a total of 18 bands. Power backoff can be applied to only 7 bands.
  • the electronic device may check whether the band currently used for communication is a band to which power backoff is applied, and block the communication channel with the grip sensor 430 if it is a band to which power backoff is not applied.
  • the electronic device may block the communication channel with the grip sensor 430 based on the electric field conditions of the area where the electronic device is currently located.
  • strong electric field areas with good electric field conditions communication connections can be made smoothly even without using large transmission power in electronic devices.
  • electronic devices can use low enough transmission power to avoid the need for power backoff.
  • the electronic device may lower the transmission power and not perform power backoff based on the current location being identified as a strong electric field area.
  • the electronic device may check whether the area where the electronic device is currently located is a strong electric field area, and if it is confirmed to be a strong electric field area, it may block the communication connection with the grip sensor 430.
  • the communication channel with the grip sensor 430 may not be blocked in order to determine whether to execute power backoff to reduce transmission power.
  • the electronic device may block the communication channel with the grip sensor 430 when the electronic device is in the C-DRX section. If the electronic device satisfies certain conditions, it can enter the C-DRX section and block the terminal's RF. For example, if data traffic is not detected in the electronic device for a certain period of time, the electronic device may enter the C-DRX section. In the C-DRX section, electronic devices may only perform network searching intermittently and may not establish data connections between networks and terminals. Since no power is used by the electronic device, transmission power is not a problem and therefore the power backoff function may not be performed. The electronic device can improve current consumption by blocking the communication channel with the grip sensor 430.
  • the electronic device may block the communication channel with the grip sensor 430 in the downlink section in the time division duplex (TDD) band.
  • the TDD band may refer to a frequency usage method that divides time and alternately uses uplink and downlink.
  • the TDD band can be time-divided and use frequencies as uplink, downlink, and special subframes.
  • an electronic device may perform data communication for a set time (eg, 10 ms) in one frame.
  • One frame may consist of a plurality of subframes, and each subframe may include at least one uplink, downlink, and special subframe.
  • the uplink is a section for transmitting power
  • the downlink is a section for receiving power
  • the special subframe may be a section for controlling sync.
  • the uplink power is transmitted, so the electromagnetic wave absorption rate must be considered.
  • the downlink and special subframe power is received or only a small amount of power is transmitted, so there is no need to consider the electromagnetic wave absorption rate. Therefore, when using the TDD band, the electronic device may not need to perform power backoff in the downlink and special subframe sections except for the uplink that transmits power.
  • the electronic device may block the communication channel with the grip sensor 430 in the downlink and special subframe sections.
  • the electronic device in operation 812, if it is determined not to block the communication channel between the application processor 412 and the grip sensor 430, the electronic device connects the grip sensor 430 to the application processor 412. A signal may be transmitted, and a grip signal may be transmitted from the application processor 412 to a communication processor (eg, the communication processor 414 of FIG. 4). In operation 814, the electronic device may perform power backoff using the communication processor 414.
  • a communication processor eg, the communication processor 414 of FIG. 4
  • the electronic device may block the communication channel with the grip sensor 430 when at least one of the conditions described above is satisfied. According to another embodiment, if all of the above-described conditions are not satisfied, the electronic device may resume communication with the grip sensor 430. When the electronic device receives a grip signal from the grip sensor 430, it can wake up and transmit the grip signal to the communication processor 414.
  • the application processor 412 may determine whether to block the communication channel before entering the sleep mode. For example, the application processor 412 may set the grip sensor 430 not to transmit a grip signal through the grip I2C channel and then enter sleep mode. If all of the above-described conditions are not satisfied after entering the sleep mode, the communication processor 414 may request the application processor 412 to resume communication with the grip sensor 430. For example, the application processor 412 may receive a communication resumption request from the communication processor 414 and set the grip sensor 430 to transmit a grip signal through the grip I2C channel.

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Telephone Function (AREA)

Abstract

Un dispositif électronique selon divers modes de réalisation donnés à titre d'exemple comprend : un capteur de préhension pour détecter un signal de préhension ; un processeur de communication (CP) ; et un processeur d'application (AP) connecté fonctionnellement au capteur de préhension et au processeur de communication, le processeur d'application pouvant être configuré pour : entrer dans un mode veille ; déterminer si le capteur de préhension génère le signal de préhension ; sortir, en réponse à la détermination de la génération du signal de préhension, le mode veille sur la base de la réception du signal de préhension généré à partir du capteur de préhension ; notifier au processeur de communication la réception du signal de préhension à partir du capteur de préhension ; et commander le processeur de communication afin qu'il exécute une réduction de puissance.
PCT/KR2023/004498 2022-04-05 2023-04-04 Dispositif électronique et procédé de réduction de consommation de courant WO2023195728A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP23718610.1A EP4280711A1 (fr) 2022-04-05 2023-04-04 Dispositif électronique et procédé de réduction de consommation de courant

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR20220042131 2022-04-05
KR10-2022-0042131 2022-04-05
KR10-2022-0070860 2022-06-10
KR1020220070860A KR20230143534A (ko) 2022-04-05 2022-06-10 전자 장치 및 소모 전류 개선 방법

Publications (1)

Publication Number Publication Date
WO2023195728A1 true WO2023195728A1 (fr) 2023-10-12

Family

ID=88243256

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2023/004498 WO2023195728A1 (fr) 2022-04-05 2023-04-04 Dispositif électronique et procédé de réduction de consommation de courant

Country Status (1)

Country Link
WO (1) WO2023195728A1 (fr)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180025710A (ko) * 2016-09-01 2018-03-09 삼성전자주식회사 전자 장치 및 이를 이용한 그립 상태를 인식하는 방법
KR20200048228A (ko) * 2018-10-29 2020-05-08 삼성전자주식회사 제어 정보 에 기반하여 송신 전력을 제어하기 위한 전자 장치 및 방법
US20200218310A1 (en) * 2019-01-07 2020-07-09 Samsung Electronics Co., Ltd. Method for controlling power back off using grip sensor and electronic device for supporting the same
KR102139110B1 (ko) * 2013-06-20 2020-07-30 삼성전자주식회사 전자 디바이스 및 전자 디바이스에서 그립 센싱을 이용한 제어 방법
KR20220023160A (ko) * 2020-08-20 2022-03-02 삼성전자주식회사 안테나를 포함하는 전자 장치 및 상기 전자 장치의 전력 백 오프 제어 방법

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102139110B1 (ko) * 2013-06-20 2020-07-30 삼성전자주식회사 전자 디바이스 및 전자 디바이스에서 그립 센싱을 이용한 제어 방법
KR20180025710A (ko) * 2016-09-01 2018-03-09 삼성전자주식회사 전자 장치 및 이를 이용한 그립 상태를 인식하는 방법
KR20200048228A (ko) * 2018-10-29 2020-05-08 삼성전자주식회사 제어 정보 에 기반하여 송신 전력을 제어하기 위한 전자 장치 및 방법
US20200218310A1 (en) * 2019-01-07 2020-07-09 Samsung Electronics Co., Ltd. Method for controlling power back off using grip sensor and electronic device for supporting the same
KR20220023160A (ko) * 2020-08-20 2022-03-02 삼성전자주식회사 안테나를 포함하는 전자 장치 및 상기 전자 장치의 전력 백 오프 제어 방법

Similar Documents

Publication Publication Date Title
WO2022019503A1 (fr) Dispositif électronique comprenant une batterie
WO2021054647A1 (fr) Procédé d'alimentation et dispositif électronique associé
WO2022181965A1 (fr) Procédé permettant de fournir une fonction de recyclage valorisant et dispositif électronique le prenant en charge
WO2023195728A1 (fr) Dispositif électronique et procédé de réduction de consommation de courant
WO2022149798A1 (fr) Dispositif électronique et procédé de commande de dispositif électronique
WO2023085682A1 (fr) Dispositif électronique pour l'obtention d'informations associées à une batterie et son procédé de fonctionnement
WO2022186467A1 (fr) Dispositif électronique et son procédé de commande
WO2024090837A1 (fr) Procédé et dispositif électronique de charge d'une batterie
WO2023059095A1 (fr) Dispositif électronique et procédé d'amélioration des performances de chauffage d'un dispositif électronique
WO2022186497A1 (fr) Procédé et dispositif électronique de régulation de puissance rayonnée
WO2024090833A1 (fr) Dispositif électronique et procédé de commande d'un courant de charge pour une pluralité de batteries
WO2023229240A1 (fr) Dispositif électronique comprenant une antenne et procédé associé
WO2024117576A1 (fr) Procédé de détection d'objet étranger et dispositif électronique associé
KR20230143534A (ko) 전자 장치 및 소모 전류 개선 방법
WO2024076053A1 (fr) Procédé de commande de dispositif électronique sur la base d'une température, et dispositif électronique associé
WO2022169215A1 (fr) Procédé d'alimentation électrique et dispositif électronique pour prendre en charge celui-ci
WO2023249221A1 (fr) Dispositif électronique et procédé de commande de courants de charge pour de multiples batteries sur la base d'une résistance de détection
WO2023106584A1 (fr) Dispositif électronique pour charge sans fil dans un type à résonance magnétique
WO2022235035A1 (fr) Dispositif électronique, dispositif habitronique, et système comprenant un dispositif électronique et un dispositif habitronique
WO2022191659A1 (fr) Dispositif électronique comportant un bloc-batterie et procédé de fonctionnement de dispositif électronique
WO2022146120A1 (fr) Procédé de charge sans fil et dispositif électronique le prenant en charge
WO2024106949A1 (fr) Dispositif électronique et procédé de commande de puissance basé sur une pluralité de batteries dans un dispositif électronique
WO2022250273A1 (fr) Dispositif électronique permettant de réduire la consommation d'énergie due à une mesure et son procédé de fonctionnement
WO2024043476A1 (fr) Dispositif électronique pour ajuster, sur la base de la fréquence, l'intensité d'un signal de données à transmettre par l'intermédiaire d'un motif conducteur et procédé associé
WO2023243810A1 (fr) Dispositif électronique pour ajuster un paramètre pour un capteur de préhension de conduite et procédé associé

Legal Events

Date Code Title Description
ENP Entry into the national phase

Ref document number: 2023718610

Country of ref document: EP

Effective date: 20230428