Classifications

• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
  • B32B3/02—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
  • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
  • B05D1/00—Processes for applying liquids or other fluent materials
  • B05D1/18—Processes for applying liquids or other fluent materials performed by dipping
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
  • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
  • B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
  • B05D5/12—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain a coating with specific electrical properties
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
  • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
  • B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
  • B05D7/14—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to metal, e.g. car bodies
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B15/00—Layered products comprising a layer of metal
  • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B15/00—Layered products comprising a layer of metal
  • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
  • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
  • B32B15/088—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyamides
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B15/00—Layered products comprising a layer of metal
  • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
  • B32B37/02—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by a sequence of laminating steps, e.g. by adding new layers at consecutive laminating stations
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/02—Details
  • H05K1/03—Use of materials for the substrate
  • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/02—Details
  • H05K1/03—Use of materials for the substrate
  • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
  • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W40/00—Arrangements for thermal protection or thermal control
  • H10W40/10—Arrangements for heating
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B2307/00—Properties of the layers or laminate
  • B32B2307/30—Properties of the layers or laminate having particular thermal properties
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B2311/00—Metals, their alloys or their compounds
  • B32B2311/02—Noble metals
  • B32B2311/04—Gold
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B2311/00—Metals, their alloys or their compounds
  • B32B2311/12—Copper

Definitions

• the present invention relates to a laminate, a heat dissipation substrate, and a method for manufacturing a laminate.
• a laminate including a metal substrate and an insulating layer is known (for example, see Patent Document 1 below).
• the insulating layer covers both side surfaces and the top surface of the metal substrate. Both side surfaces of the metal substrate are perpendicular to the thickness direction.
• the laminate is required to have excellent heat dissipation properties.
• the laminate described in Patent Document 1 has a limit in improving heat dissipation.
• the present invention provides a laminate with excellent heat dissipation, a heat dissipation substrate, and a method for manufacturing the laminate.
• the present invention [1] provides a metal substrate including one surface and the other surface in the thickness direction, and a side surface connecting a peripheral edge of the one surface and a peripheral edge of the other surface, and the one surface of the metal substrate. and an insulating layer disposed on the side surface, the side surface including a laminate including an inclined surface inclined with respect to the thickness direction.
• the side surface of the metal substrate includes an inclined surface. Therefore, the area of the insulating layer disposed on the inclined surface can be increased. As a result, heat dissipation on the side surfaces of the laminate is excellent.
• the inclined surface includes a first inclined surface and a second inclined surface arranged at intervals in a direction perpendicular to the thickness direction in a cross-sectional view along the thickness direction, and the first inclined surface
• the surface and the second inclined surface include the laminate according to [1], in which the interval becomes shorter from the other surface toward the one surface in the cross-sectional view.
• the present invention [3] includes the laminate according to [1] or [2], wherein the material of the metal substrate is at least one selected from the group consisting of copper, aluminum, tungsten, and molybdenum.
• the present invention [4] includes the laminate according to any one of [1] to [3], wherein the material of the metal substrate is copper or a copper alloy.
• the present invention [5] includes the laminate according to any one of [1] to [4], wherein the material of the insulating layer is an inorganic material.
• the insulating layer since the material of the insulating layer is inorganic, the insulating layer can be made thin. Therefore, the insulating layer has excellent heat dissipation properties.
• the present invention [6] includes the laminate according to any one of [1] to [5], wherein the insulating layer has a thickness of 0.01 ⁇ m or more and 3.0 ⁇ m or less.
• the thickness of the insulating layer is 3.0 ⁇ m or less, so it has excellent heat dissipation.
• the present invention [7] includes the laminate according to [5] or [6], wherein the inorganic substance is at least one selected from the group consisting of nitrides and carbides.
• the present invention [8] includes the laminate according to any one of [1] to [4], wherein the material of the insulating layer is an organic material.
• the insulating layer since the material of the insulating layer is an organic substance, the insulating layer can be made thick. In this way, the insulating layer becomes uniform regardless of the unevenness of one side and side surfaces of the metal substrate. Therefore, the laminate has excellent insulation properties.
• the present invention [9] includes the laminate according to any one of [1] to [4] and [8], wherein the insulating layer has a thickness of 1.0 ⁇ m or more and 15 ⁇ m or less.
• the thickness of the insulating layer is 1.0 ⁇ m or more, so it has excellent insulation properties.
• the present invention [10] includes the laminate according to [8] or [9], wherein the organic substance is a resin containing an imide group.
• the present invention [11] includes the laminate according to any one of [1] to [10], wherein the length of the one side is shorter than the length of the other side in a cross-sectional view along the thickness direction. .
• the present invention [12] includes the laminate according to any one of [1] to [11], wherein the side surface has a substantially curved shape in a cross-sectional view along the thickness direction.
• the present invention [13] includes the laminate according to [12], wherein the center of the curved arc is located outside the metal substrate.
• the side surface includes a first oblique portion and a second oblique portion in order toward one side in the thickness direction, and the angle ⁇ 1 between the first oblique portion and the thickness direction is , the laminate according to any one of [1] to [13], wherein the angle ⁇ 2 between the second oblique portion and the thickness direction is smaller than the angle ⁇ 2.
• the present invention [15] is characterized in that one end edge of the second oblique portion in the thickness direction is continuous with the one surface, and the other end edge of the first oblique portion in the thickness direction is continuous with the other surface. ].
• the present invention [16] is described in any one of [1] to [15], wherein the metal substrate includes a substrate body and a protective layer disposed on the other surface of the substrate body in the thickness direction. laminate.
• the protective layer is arranged on the other side of the substrate body, corrosion on the other side of the substrate body can be suppressed.
• the present invention [17] includes the laminate according to [16], wherein the protective layer is also disposed on one side and a side surface of the substrate main body in the thickness direction.
• the protective layer is also arranged on one side and the side surface of the substrate body, corrosion of the peripheral edge on the other side of the substrate body in the thickness direction can be effectively suppressed.
• the present invention [18] includes a heat dissipation substrate comprising the laminate according to any one of [1] to [17].
• the present invention [19] provides a step of preparing a metal substrate including one surface and the other surface in the thickness direction, and a side surface connecting a peripheral edge of the one surface and a peripheral edge of the other surface, and an insulating layer. on the one surface and the side surface of the metal substrate using a vacuum film forming method.
• the insulating layer is likely to be formed non-uniformly.
• the side surface includes an inclined surface
• the insulating layer can be uniformly formed on the above-mentioned side surface even if a vacuum deposition method is used.
• the present invention [20] provides a step of preparing a metal substrate including one surface and the other surface in the thickness direction, and a side surface connecting a peripheral edge of the one surface and a peripheral edge of the other surface, and an insulating layer. on the one surface and the side surface of the metal substrate using an electrodeposition method of an electrodeposition coating composition.
• the insulating layer is formed on one side and the side surface of the metal substrate using an electrodeposition method using an electrodeposition coating composition, so that defects in the insulating layer can be suppressed. Therefore, a laminate with excellent insulation properties can be manufactured.
• the laminate and heat dissipation substrate obtained by the laminate manufacturing method of the present invention have excellent heat dissipation properties.
• FIG. 1A shows the first step in the manufacturing method of one embodiment of the laminate of the present invention.
• FIG. 1B is the second step.
• FIG. 1C is the third step.
• FIG. 1D is the fourth step.
• FIG. 1D is a perspective view of a metal substrate in the laminate shown in FIG. 1D.
• FIG. 3A shows the first etching in the second step in the manufacturing method of the first modification.
• FIG. 3B shows the second etching of the second step.
• FIG. 3C is the third step.
• FIG. 3D is the fourth step.
• FIG. 4 shows a third modification of the laminate.
• FIG. 5 shows a fourth modification of the laminate.
• FIG. 6 shows a fifth modification of the laminate.
• FIG. 7 shows a sixth modification of the laminate.
• FIG. 8 shows a seventh modification of the laminate.
• FIG. 5 shows a fourth modification of the laminate.
• FIG. 6 shows a fifth modification of the laminate.
• FIG. 7 shows a sixth modification
• FIG. 10A shows a step of preparing a substrate body in the manufacturing method of the ninth modification.
• FIG. 10B is a step of forming a protective layer.
• FIG. 10C is a step of forming an insulating layer.
• FIG. 11 shows a tenth modification.
• FIG. 12 shows an eleventh modification.
• FIG. 13 shows a twelfth modification.
• FIG. 14 shows a thirteenth modification.
• FIG. 15 shows a fourteenth modification.
• the laminate 1 has a thickness.
• the laminate 1 has a plate shape.
• the laminate 1 has a rectangular plate shape.
• the laminate 1 extends in the plane direction.
• the surface direction is perpendicular to the thickness direction.
• the laminate 1 includes a metal substrate 2 and an insulating layer 3.
• the metal substrate 2 has a plate shape.
• the metal substrate 2 has a rectangular plate shape.
• the metal substrate 2 includes one surface 21 and the other surface 22 in the thickness direction, and a side surface 23 that connects the peripheral edge of the one surface 21 and the peripheral edge of the other surface 22.
• Each of the one side 21 and the other side 22 has a flat shape. One surface 21 and the other surface 22 are parallel. Each of the one side 21 and the other side 22 is perpendicular to the thickness direction.
• the length of one side 21 is shorter than the length of the other side 22 in a cross-sectional view along the thickness direction.
• the side surface 23 includes an inclined surface 23S that is inclined with respect to the thickness direction.
• the inclined surface 23S is also inclined with respect to the one side 21 and the other side 22.
• the side surface 23 consists of an inclined surface 23S.
• the sloped surface 23S includes a first sloped surface 23SA and a second sloped surface 23SB arranged at intervals in a direction perpendicular to the thickness direction (ie, in the surface direction). The distance between each of the first inclined surface 23SA and the second inclined surface 23SB becomes shorter from the other surface 22 toward the one surface 21 in a cross-sectional view.
• the side surface 23 has a substantially curved shape in a cross-sectional view along the thickness direction.
• each of the first inclined surface 23SA and the second inclined surface 23SB has a substantially curved shape in a cross-sectional view along the thickness direction.
• the center of the curved arc is located on the outside of the metal substrate 2.
• the radius of curvature of the curve is, for example, 200 ⁇ m or more, preferably 300 ⁇ m or more, and, for example, 800 ⁇ m or less, preferably 700 ⁇ m or less.
• the angle formed between the starting end rising from the other surface 22 and the thickness direction is an acute angle, for example, 5 degrees or more, preferably 15 degrees or more, and, for example, 75 degrees or less, preferably is 65 degrees or less.
• the angle formed between the terminal end reaching the one surface 21 and the thickness direction is an acute angle, for example, 5 degrees or more, preferably 10 degrees or more, and, for example, 80 degrees or less, preferably, The temperature is 70 degrees or less.
• the material of the metal substrate 2 is not limited.
• the material of the metal substrate 2 is, for example, at least one selected from the group consisting of copper, aluminum, tungsten, and molybdenum.
• the material of the metal substrate 2 may contain an alloy. Examples of the alloy include copper alloy, aluminum alloy, tungsten alloy, and molybdenum alloy.
• the material for the metal substrate 2 is preferably copper or a copper alloy. If the material of the metal substrate 2 is at least one selected from the group consisting of copper, aluminum, tungsten, and molybdenum (especially copper or a copper alloy), the metal substrate 2 has good thermal conductivity, and the laminate 1 Excellent heat dissipation.
• the thickness of the metal substrate 2 is, for example, 30 ⁇ m or more, preferably 50 ⁇ m or more, and is, for example, 1000 ⁇ m or less, preferably 500 ⁇ m or less.
• Insulating layer 3 is arranged on one side 21 and side 23 of metal substrate 2 .
• the insulating layer 3 continuously covers the one side 21 and the side 23.
• the insulating layer 3 follows the shape of the one side 21 and the side 23. That is, the insulating layer 3 disposed on one side 21 has a flat shape.
• the insulating layer 3 disposed on the side surface 23 has a substantially curved shape.
• the material of the insulating layer is not limited.
• Examples of the material for the insulating layer 3 include inorganic materials and organic materials. These can be used alone or in combination.
• inorganic substances include nitrides, carbides, and oxides. These can be used alone or in combination.
• nitrides examples include aluminum nitride and silicon nitride.
• Examples of carbides include silicon carbide.
• oxides examples include silicon oxide, aluminum oxide, zinc oxide, and magnesium oxide.
• the inorganic substance is preferably an oxide from the viewpoint of improving insulation. Further, as the inorganic substance, preferably nitrides and carbides are mentioned from the viewpoint of improving heat dissipation.
• Examples of organic substances include resins containing imide groups.
• the organic substances can be used singly or in combination.
• resins containing imide groups include polyimide resins, polyamideimide resins, and polyetherimide resins.
• Preferable examples of the polyamide-imide resin include aromatic polyamide-imide resins. Resins containing imide groups are described, for example, in JP-A-2022-018534 and JP-A-2003-268235.
• the thickness of the insulating layer 3 may be set depending on the material of the insulating layer 3, for example.
• the thickness of the insulating layer 3 is, for example, 0.01 ⁇ m or more, preferably 0.05 ⁇ m or more. If the thickness of the insulating layer 3 is at least the above-mentioned lower limit, the laminate 1 will have excellent insulation properties.
• the thickness of the insulating layer 3 is, for example, 3.0 ⁇ m or less, preferably 1.0 ⁇ m or less. If the thickness of the insulating layer 3 is below the above-mentioned upper limit, the laminate 1 will have excellent heat dissipation.
• the ratio of the thickness of the insulating layer 3 to the thickness of the metal substrate 2 is, for example, 0.00001 or more, preferably 0.0006 or more; .1 or less, preferably 0.06 or less.
• the thickness of the insulating layer 3 is, for example, 1.0 ⁇ m or more, preferably more than 3.0 ⁇ m, more preferably 4.0 ⁇ m or more, still more preferably 5.0 ⁇ m or more. It is 0 ⁇ m or more. If the thickness of the insulating layer 3 exceeds the above-mentioned lower limit, the laminate 1 will have excellent insulation properties.
• the thickness of the insulating layer 3 is, for example, 15 ⁇ m or less, preferably 10 ⁇ m or less. If the thickness of the insulating layer 3 is below the above-mentioned upper limit, the laminate 1 will have excellent heat dissipation.
• the ratio of the thickness of the insulating layer 3 to the thickness of the metal substrate 2 is, for example, 0.001 or more, preferably 0.006 or more; .5 or less, preferably 0.2 or less.
• This manufacturing method includes a first step to a fourth step. Note that this one embodiment is a method for manufacturing the laminate 1 in which the material of the insulating layer 3 is an inorganic material.
• a two-layer base material 5 and an etching resist 6 are prepared.
• the two-layer base material 5 has a plate shape extending in the plane direction.
• the two-layer base material 5 includes a base material 51 and a metal layer 52 in this order toward one side in the thickness direction.
• the base material 51 extends in the plane direction. Examples of the material for the base material 51 include resin.
• the metal layer 52 is a member for forming the metal substrate 2.
• the metal layer 52 is arranged on the entire one surface of the base material 51 in the thickness direction.
• the metal layer 52 includes one side 21, the other side 22, and a side surface 23, but the side surface 23 does not need to include the inclined surface 23S.
• the etching resist 6 is placed on one side 21 of the metal layer 52.
• Etching resist 6 has a pattern corresponding to the shape of metal substrate 2.
• the etching resist 6 is formed from, for example, a dry film resist.
• the metal layer 52 is etched.
• wet etching is used for the etching.
• wet etching is performed so that over-etching occurs.
• a method is used in which the immersion time of the two-layer base material 5 and the etching resist 6 in the etching solution is made relatively long.
• the etching solution infiltrates inward from the peripheral edge of the etching resist 6.
• the metal substrate 2 having the side surface 23 described above is formed.
• the etching resist 6 is removed after etching.
• the insulating layer 3 is formed on one side 21 and side surface 23 of the metal substrate 2.
• the insulating layer 3 is formed by a vacuum film forming method.
• the vacuum film forming method include a vapor deposition method, a sputtering method, and an ion plating method.
• the base material 51 is removed. Specifically, the base material 51 is peeled off from the metal substrate 2.
• the first step, second step, fourth step, and third step in the one embodiment described above are performed.
• the insulating layer 3 is formed on one side 21 and the side surface 23 of the metal substrate 2 in the thickness direction using an electrodeposition method using an electrodeposition paint composition. Note that this third step is performed after the fourth step.
• the side surface 23 includes an inclined surface 23S.
• the electrodeposition coating composition examples include the above-mentioned organic materials.
• the electrodeposition coating composition contains, for example, a polyamide-imide resin (preferably an aromatic polyamide-imide resin), a bisallyl compound (cross-linking agent), and a hydrophilic cationic polymer in appropriate proportions.
• the electrodeposition coating composition preferably further contains water.
• the electrodeposition coating composition is preferably prepared as an aqueous electrodeposition coating composition. Electrodeposition coating compositions are described, for example, in JP-A No. 2022-018534 and JP-A No. 2003-268235.
• the metal substrate 2 having the shape described above is used as an electrode, the metal substrate 2 described above is immersed in an electrodeposition coating composition, and electricity is applied to the metal substrate 2 (implementation of electrodeposition coating). . If the organic substance is a resin containing an imide group, the metal substrate 2 acts as a cathode.
• the solid content of the electrodeposition coating composition is deposited on one side 21 and side 23 of the metal substrate 2. Thereafter, the solid content of the electrodeposition coating composition is cured by heating. Thereby, the insulating layer 3 is formed.
• the laminate 1 is provided on a heat dissipation substrate 10. That is, the heat dissipation board 10 has the above-described laminate 1.
• the heat dissipation board 10 may further include an electronic element (not shown) disposed on one side of the laminate 1 in the thickness direction.
• the side surface 23 of the metal substrate 2 includes an inclined surface 23S. Therefore, the area of the insulating layer 3 disposed on the inclined surface 23S can be increased. As a result, heat dissipation on the side surfaces of the laminate 1 is excellent.
• the insulating layer 3 is thin. Specifically, the thickness of the insulating layer 3 is preferably 0.01 ⁇ m or more and 3.0 ⁇ m or less. Therefore, the insulating layer 3 has excellent heat dissipation properties. However, in this laminate 1, since the insulating layer 3 is thin, the insulating layer 3 is easily affected by the unevenness of the one side 21 and the side 23 of the metal substrate 2, and therefore the surface of the insulating layer 3 is uneven. It may become.
• the insulating layer 3 is thick. Specifically, the thickness of the insulating layer 3 is preferably more than 3.0 ⁇ m and less than 15 ⁇ m. In this way, the insulating layer 3 becomes uniform regardless of the unevenness of the one side 21 and the side surface 23 of the metal substrate 2. Therefore, the laminate 1 has excellent insulation properties.
• the insulating layer 3 is formed non-uniformly.
• the insulating layer 3 can be uniformly formed on the above-mentioned side surface 23 even if a vacuum deposition method is used.
• the insulating layer 3 is formed on the one side 21 and the side 23 of the metal substrate 2 using an electrodeposition method using an electrodeposition coating composition, so that defects in the insulating layer 3 can be suppressed. . Therefore, the laminate 1 having excellent insulation properties can be manufactured.
• the side surface 23 of the metal substrate 2 has a first diagonal portion 25 and a second diagonal portion 26 in the thickness direction. Contains sequentially toward one side.
• the other end edge of the first oblique portion 25 in the thickness direction is continuous with the other surface 22 .
• One end edge of the second oblique portion 26 in the thickness direction is continuous with the one surface 21 .
• the angle ⁇ 1 between the first oblique portion 25 and the thickness direction is smaller than the angle ⁇ 2 between the second oblique portion 26 and the thickness direction.
• the angle ⁇ 1 is an acute angle, for example, 5 degrees or more, preferably 15 degrees or more, and, for example, 80 degrees or less, preferably 70 degrees or less.
• the angle ⁇ 2 is an acute angle, for example, 10 degrees or more, preferably 25 degrees or more, and, for example, 85 degrees or less, preferably 75 degrees or less.
• the ratio of angle ⁇ 1 to angle ⁇ 2 is, for example, 0.05 or more, preferably 0.15 or more, and is, for example, 0.95 or less, preferably 0.85 or less.
• the metal layer 52 is etched using a different type of etching solution.
• the metal layer 52 is etched using a ferric chloride aqueous solution as the first etching solution (first etching).
• first etching a ferric chloride aqueous solution
• sharpened portions 27 are formed at one end edge and the other end edge in the thickness direction of the side surface 23, respectively.
• the sharp portion 27 at one end in the thickness direction is removed using a second etching solution using a mixed solution of sulfuric acid and hydrogen peroxide.
• a first oblique portion 25 and a second oblique portion 26 are formed on the side surface 23 of the metal substrate 2.
• one side surface 23 has an inclined surface 23S, and the other side surface 23 does not have an inclined surface 23S, and the thickness direction It may also have a straight surface (not shown) to follow.
• the metal substrate 2 of the third modification has a substantially trapezoidal cross-sectional shape.
• the inclined surface 23S has a constant angle of inclination.
• the tilt angle corresponds to angle ⁇ 1 shown in FIG. 3D.
• the side surface 23 of the metal substrate 2 of the fourth modification includes a concave surface 23C.
• the concave surface 23C includes a first concave surface 231C and a second concave surface 232C that are spaced apart from each other in the surface direction.
• the first concave surface 231C includes a first oblique portion 231SA and a third oblique portion 231SC.
• the first oblique portion 231SA is the other side portion of the first concave surface 231C in the thickness direction.
• the first oblique portion 231SA extends from the peripheral edge of the other surface 22 of the metal substrate 2 toward one side in the thickness direction.
• the first oblique portion 231SA goes inward in the plane direction as it goes toward one side in the thickness direction.
• the first oblique portion 231SA has a substantially curved shape in a cross-sectional view along the thickness direction.
• the third oblique portion 231SC is a portion on one side of the first concave surface 231C in the thickness direction.
• the third oblique portion 231SC extends from one end edge of the first oblique portion 231SA in the thickness direction toward one side in the thickness direction.
• the third oblique portion 231SC moves toward the outside in the plane direction as it goes toward one side in the thickness direction.
• the third oblique portion 231SC has a substantially curved shape in a cross-sectional view along the thickness direction.
• the middle portion of the first concave surface 231C in the thickness direction faces inward in the surface direction.
• the intermediate portion of the first concave surface 231C includes a connecting portion between the first oblique portion 231SA and the third oblique portion 231SC.
• the second concave surface 232C includes a second oblique portion 231SB and a fourth oblique portion 232SC.
• the second oblique portion 231SB is the other side portion of the second concave surface 232C in the thickness direction.
• the second oblique portion 231SB is spaced apart from the first oblique portion 231SA in cross-sectional view.
• the second oblique portion 231SB extends from the peripheral edge of the other surface 22 of the metal substrate 2 toward one side in the thickness direction.
• the second oblique portion 231SB goes inward in the plane direction as it goes toward one side in the thickness direction.
• the second oblique portion 231SB has a substantially curved shape in a cross-sectional view along the thickness direction.
• the fourth oblique portion 232SC is a portion on one side of the second concave surface 232C in the thickness direction.
• the fourth oblique portion 232SC extends from one end edge of the second oblique portion 231SB in the thickness direction toward one side in the thickness direction.
• the fourth oblique portion 232SC goes toward the outside in the plane direction as it goes toward one side in the thickness direction.
• the fourth oblique portion 232SC has a substantially curved shape in a cross-sectional view along the thickness direction. As a result, in the second concave surface 232C, the middle portion of the second concave surface 232C in the thickness direction faces inward in the surface direction.
• the intermediate portion of the second concave surface 232C includes a connection portion between the second oblique portion 231SB and the fourth oblique portion 232SC.
• the insulating layer 3 is formed on one side 21 and side 23 of the metal substrate 2 shown in FIG. 3A.
• the second step specifically, the second etching
• the first step first etching
• the third step third step
• the fourth step fourth step
• the metal substrate 2 includes a substrate body 7 and a protective layer 8.
• the metal substrate 2 includes a substrate body 7 and a protective layer 8 in this order toward the other side in the thickness direction.
• the metal substrate 2 includes only the substrate body 7 and the protective layer 8.
• the substrate body 7 has the same shape as the metal substrate 2 of one embodiment.
• the substrate body 7 includes one surface 21 and the other surface 72 in the thickness direction, and a side surface 23 connecting the peripheral edge of the one surface 21 and the peripheral edge of the other surface 72.
• the other surface 72 of the substrate body 7 is arranged on the other side of the one surface 71.
• the other surface 72 is parallel to the one surface 21 .
• the other surface 72 is perpendicular to the thickness direction.
• the material and thickness of the substrate body 7 are the same as those of the metal substrate 2 in one embodiment.
• the protective layer 8 is arranged on the other surface 72 of the substrate body 7.
• Protective layer 8 contacts the other surface 72 .
• protective layer 8 contacts the entire other surface 72 .
• the other surface of the protective layer 8 in the thickness direction forms the other surface 22 of the metal substrate 2 in the thickness direction.
• the material for the protective layer 8 examples include gold, silver, aluminum, tin, chromium, nickel, and stainless steel. These can be used alone or in combination. Preferably, the material for the protective layer 8 is gold.
• the thickness of the protective layer 8 is, for example, 0.1 ⁇ m or more, preferably 0.3 ⁇ m or more, and is, for example, 10 ⁇ m or less, preferably 5 ⁇ m or less.
• the laminate 1 of one embodiment is plated.
• the protective layer 8 is formed on the other surface 72 of the substrate body 7. Therefore, the protective layer 8 is called a protective plating layer.
• the protective layer 8 is not formed on the one side 21 and the side surface 23 of the substrate body 7. Insulating layer 3 acts as a plating resist.
• the metal substrate 2 in the laminate 1 of the first modification has the above-described substrate main body 7,
• the protective layer 8 described above is provided.
• the metal substrate 2 in the laminate 1 of the second modification has the above-described substrate main body 7,
• the protective layer 8 described above is provided.
• the metal substrate 2 in the laminate 1 of the third modification has the above-described substrate main body 7,
• the protective layer 8 described above is provided.
• the protective layer 8 in the laminate 1 of the ninth modification also covers one side 71 and side 73 of the substrate body 7 (see FIG. 6) in the fifth modification. Placed. That is, the protective layer 8 is disposed on the entire surface of the substrate body 7.
• One side 71 and side 73 of the substrate body 7 of the ninth modification have the same shape as each of the one side 21 and side 23 of the fifth modification (see FIG. 6).
• the protective layer 8 disposed on one side 71 and the side surface 73 of the substrate body 7 is sandwiched between the substrate body 7 and the insulating layer 3.
• the thickness of the protective layer 8 disposed on one side 71 of the substrate body 7, the thickness of the protective layer 8 disposed on the side surface 73 of the substrate body 7, and the thickness of the protective layer 8 disposed on the other side 72 of the substrate body 7 are determined.
• the thickness of the protective layer 8 is, for example, the same.
• the substrate body 7 is produced in a second step, and then, as shown in FIG. 10B, plating is performed. As a result, the protective layer 8 is formed on one side 71, the other side 72, and the side surface 73 of the substrate body 7. Thereafter, as shown in FIG. 10C, an insulating layer 3 is formed on one side 21 and side surface 23 of the metal substrate 2.
• the protective layer 8 is also disposed on the side surface 73 of the substrate body 7, so the peripheral edge on the other surface 72 of the substrate body 7 is exposed. can be suppressed. Therefore, corrosion of the peripheral edge of the other surface 72 of the substrate body 7 can be effectively suppressed.
• the protective layer 8 in the laminate 1 of the seventh modification is attached to one side 71 of the substrate body 7. and the side surface 73 as well.
• the protective layer 8 in the laminate 1 of the eighth modified example is attached to one side 71 of the substrate body 7. and the side surface 73 as well.
• the laminate 1 of the 9th modification is arranged on the other surface 72 of the substrate body 7.
• the protective layer 8 is thicker than the protective layer 8 disposed on one side 71 of the substrate body 7 and the protective layer 8 disposed on the side surface 73 of the substrate body 7 .
• the thickness of the protective layer 8 disposed on the other surface 72 of the substrate body 7 is, for example, 0.1 ⁇ m or more, preferably 0.3 ⁇ m or more, and is, for example, 10 ⁇ m or less, preferably 5 ⁇ m or less.
• the metal substrate 2 further includes a second protective layer 9. That is, the metal substrate 2 includes the substrate body 7 , the protective layer 8 , and the second protective layer 9 .
• the second protective layer 9 is disposed on the other surface 82 of the protective layer 8, which is disposed on the other surface of the substrate body 7 in the thickness direction.
• the second protective layer 9 contacts the other surface 82 of the protective layer 8 described above.
• the second protective layer 9 forms the other surface 22 of the metal substrate 2 in the thickness direction.
• the material for the second protective layer 9 is selected from those exemplified as the material for the protective layer 8. Specifically, if the protective layer 8 is gold, silver, aluminum, tin, chromium, nickel, and stainless steel are used. selected from.
• the thickness of the second protective layer 9 is the same as the thickness of the protective layer 8 described above.
• the laminate is provided on a heat dissipation board.

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• Engineering & Computer Science (AREA)
• Life Sciences & Earth Sciences (AREA)
• Wood Science & Technology (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Laminated Bodies (AREA)
• Insulated Metal Substrates For Printed Circuits (AREA)
• Structure Of Printed Boards (AREA)
• Chemical & Material Sciences (AREA)
• Materials Engineering (AREA)

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• 2023
  • 2023-03-29 JP JP2024512661A patent/JPWO2023190662A1/ja active Pending
  • 2023-03-29 KR KR1020247031189A patent/KR20240173362A/ko active Pending
  • 2023-03-29 WO PCT/JP2023/012760 patent/WO2023190662A1/ja not_active Ceased
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