WO2023190061A1 - Resin composition, cured product, laminate, method for producing cured product, method for producing laminate, method for producing semiconductor device, and semiconductor device - Google Patents

Resin composition, cured product, laminate, method for producing cured product, method for producing laminate, method for producing semiconductor device, and semiconductor device Download PDF

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Publication number
WO2023190061A1
WO2023190061A1 PCT/JP2023/011590 JP2023011590W WO2023190061A1 WO 2023190061 A1 WO2023190061 A1 WO 2023190061A1 JP 2023011590 W JP2023011590 W JP 2023011590W WO 2023190061 A1 WO2023190061 A1 WO 2023190061A1
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Prior art keywords
group
formula
resin composition
compounds
carbon atoms
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PCT/JP2023/011590
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French (fr)
Japanese (ja)
Inventor
倫弘 小川
敦靖 野崎
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富士フイルム株式会社
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Publication of WO2023190061A1 publication Critical patent/WO2023190061A1/en

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/088—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyamides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/08—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
    • C08F290/14—Polymers provided for in subclass C08G
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor

Definitions

  • the present invention relates to a resin composition, a cured product, a laminate, a method for producing a cured product, a method for producing a laminate, a method for producing a semiconductor device, and a semiconductor device.
  • resin materials manufactured from resin compositions containing resin are utilized in various fields.
  • polyimide has excellent heat resistance and insulation properties, so it is used in a variety of applications.
  • the above-mentioned uses are not particularly limited, but in the case of semiconductor devices for mounting, for example, they may be used as materials for insulating films and sealing materials, or as protective films. It is also used as a base film and coverlay for flexible substrates.
  • polyimide is used in the form of a resin composition containing a polyimide precursor.
  • a resin composition is applied to a base material by coating, for example, to form a photosensitive film, and then, as necessary, exposure, development, heating, etc. are performed to form a cured product on the base material. be able to.
  • the polyimide precursor is cyclized, for example, by heating, and becomes polyimide in the cured product. Since the resin composition can be applied by known coating methods, there is a high degree of freedom in designing the shape, size, application position, etc. of the resin composition when it is applied. It can be said that it has excellent characteristics. In addition to the high performance of polyimide, there are increasing expectations for the industrial application of the above-mentioned resin composition due to its excellent manufacturing adaptability.
  • Patent Document 1 describes (A) a polyimide precursor containing a specific structural unit, (B) a compound containing at least one selected from the group consisting of a urethane bond and a urea bond, and (C) photopolymerization initiation. and (D) a polymerizable unsaturated monomer having three or more polymerizable functional groups.
  • the resin composition for obtaining a cured product it is required that the cured product obtained from this composition has excellent elongation at break.
  • the present invention relates to a resin composition that yields a cured product with excellent elongation at break, a cured product obtained by curing the resin composition, a laminate containing the cured product, a method for producing the cured product, and a method for producing the laminate.
  • the present invention aims to provide a method for manufacturing a semiconductor device, including a method for manufacturing the laminate, and a semiconductor device including the cured product or the laminate.
  • a 1 and A 2 are each independently an oxygen atom or -NR Z -, R Z is a hydrogen atom or a monovalent organic group, and R 1 and R 2 are each independently, is a hydrogen atom or a monovalent organic group, at least one of R 1 and R 2 is a monovalent organic group having an ethylenically unsaturated bond, and X 1 is a tetravalent organic group having a benzene ring structure.
  • Y 1 is a divalent organic group represented by the following formula (Y-1).
  • R 3 to R 10 are each independently a hydrogen atom or a monovalent group, and at least one of R 3 to R 10 is an alkyl group, a fluorine atom, or a trifluoromethyl group. and * each represent a bonding site with the nitrogen atom in formula (1).
  • the polyimide precursor contains a repeating unit represented by formula (1) in which X 1 in formula (1) has three or more benzene ring structures;
  • the resin composition described in . ⁇ 4> The polyimide precursor has a structure in which the above X 1 in formula (1) is represented by the following formula (a) or the following formula (b) as a repeating unit represented by formula (1).
  • R a3 each independently represents a monovalent group
  • m3 represents an integer of 0 to 3
  • *1 to *4 each represent a bonding site with the carbonyl group in formula (1).
  • R b1 each independently represents a monovalent group
  • n1 represents an integer of 0 to 3
  • R b2 each independently represents a monovalent group
  • n2 represents a monovalent group of 0 to 4.
  • R b3 each independently represents a monovalent group
  • n3 represents an integer from 0 to 4
  • R b4 each independently represents a monovalent group
  • n4 represents an integer from 0 to 3.
  • the polyimide precursor has a structure in which, as a repeating unit represented by formula (1), the above X 1 in formula (1) is represented by any of the following formulas (2a) to (2d).
  • L 1 and L 2 are each independently a divalent group or a single bond that is not conjugated with the benzene ring to which they are bonded, and *1 to *4 are each represented by the formula Represents the bonding site with the carbonyl group in (1).
  • ⁇ 6> The resin composition according to any one of ⁇ 1> to ⁇ 4>, wherein the polyimide precursor has a solubility parameter SPA of 21.5 MPa 1/2 or less.
  • ⁇ 7> The resin composition according to any one of ⁇ 1> to ⁇ 6>, wherein the polyimide precursor has a solubility parameter SPA of 20.7 MPa 1/2 or less.
  • the resin composition according to item 1. ⁇ 9> The resin composition according to any one of ⁇ 1> to ⁇ 8>, which contains a bifunctional radically polymerizable compound as the radically polymerizable compound.
  • ⁇ 10> The resin composition according to any one of ⁇ 1> to ⁇ 9>, further comprising a compound having an azole structure.
  • ⁇ 11> The resin composition according to any one of ⁇ 1> to ⁇ 10>, which is used for forming an interlayer insulating film for a rewiring layer.
  • ⁇ 12> A cured product obtained by curing the resin composition according to any one of ⁇ 1> to ⁇ 11>.
  • ⁇ 13> A laminate including two or more layers made of the cured product according to ⁇ 12>, and a metal layer between any of the layers made of the cured product.
  • ⁇ 14> A method for producing a cured product, comprising a film forming step of applying the resin composition according to any one of ⁇ 1> to ⁇ 11> onto a substrate to form a film.
  • ⁇ 15> The method for producing a cured product according to ⁇ 14>, comprising an exposure step of selectively exposing the film and a development step of developing the film using a developer to form a pattern.
  • ⁇ 17> A method for producing a laminate, including the method for producing a cured product according to any one of ⁇ 14> to ⁇ 16>.
  • ⁇ 18> A method for manufacturing a semiconductor device, including the method for manufacturing a cured product according to any one of ⁇ 14> to ⁇ 16> or the method for manufacturing a laminate according to ⁇ 17>.
  • a semiconductor device comprising the cured product according to ⁇ 12> or the laminate according to ⁇ 13>.
  • a resin composition that yields a cured product with excellent elongation at break, a cured product obtained by curing the resin composition, a laminate containing the cured product, a method for producing the cured product, and the laminate
  • a method for manufacturing a semiconductor device including the method for manufacturing the laminate, and a semiconductor device including the cured product or the laminate are provided.
  • a numerical range expressed using the symbol " ⁇ ” means a range that includes the numerical values written before and after " ⁇ " as the lower limit and upper limit, respectively.
  • the term “step” includes not only independent steps but also steps that cannot be clearly distinguished from other steps as long as the intended effect of the step can be achieved.
  • substitution or unsubstitution includes a group having a substituent (atomic group) as well as a group having no substituent (atomic group).
  • alkyl group includes not only an alkyl group without a substituent (unsubstituted alkyl group) but also an alkyl group having a substituent (substituted alkyl group).
  • exposure includes not only exposure using light but also exposure using particle beams such as electron beams and ion beams, unless otherwise specified. Examples of the light used for exposure include actinic rays or radiation such as the bright line spectrum of a mercury lamp, far ultraviolet rays typified by excimer lasers, extreme ultraviolet rays (EUV light), X-rays, and electron beams.
  • (meth)acrylate means both “acrylate” and “methacrylate”, or either “(meth)acrylate”
  • (meth)acrylic means both “acrylic” and “methacrylic”
  • (meth)acryloyl means either or both of "acryloyl” and “methacryloyl.”
  • Me in the structural formula represents a methyl group
  • Et represents an ethyl group
  • Bu represents a butyl group
  • Ph represents a phenyl group.
  • the total solid content refers to the total mass of all components of the composition excluding the solvent.
  • the solid content concentration is the mass percentage of other components excluding the solvent with respect to the total mass of the composition.
  • weight average molecular weight (Mw) and number average molecular weight (Mn) are values measured using gel permeation chromatography (GPC), and are defined as polystyrene equivalent values.
  • weight average molecular weight (Mw) and number average molecular weight (Mn) are expressed using, for example, HLC-8220GPC (manufactured by Tosoh Corporation) and guard column HZ-L, TSKgel Super HZM-M, TSKgel.
  • THF tetrahydrofuran
  • NMP N-methyl-2-pyrrolidone
  • a detector with a wavelength of 254 nm of UV rays is used for detection in the GPC measurement.
  • each layer constituting a laminate when the positional relationship of each layer constituting a laminate is described as "upper” or “lower", there is another layer above or below the reference layer among the plurality of layers of interest. It would be good if there was. That is, a third layer or element may be further interposed between the reference layer and the other layer, and the reference layer and the other layer do not need to be in contact with each other.
  • the direction in which layers are stacked relative to the base material is referred to as "top”, or if there is a resin composition layer, the direction from the base material to the resin composition layer is referred to as "top”. , the opposite direction is called "down".
  • the composition may contain, as each component contained in the composition, two or more compounds corresponding to that component. Further, unless otherwise specified, the content of each component in the composition means the total content of all compounds corresponding to that component.
  • the temperature is 23° C.
  • the atmospheric pressure is 101,325 Pa (1 atm)
  • the relative humidity is 50% RH. In this specification, combinations of preferred aspects are more preferred aspects.
  • the resin composition of the present invention contains a polyimide precursor containing a repeating unit represented by formula (1) and a radically polymerizable compound, and has a ⁇ SP of -3.5 MPa calculated by the following formula (S). It is more than 1/2 and less than 5.0 MPa 1/2 .
  • a 1 and A 2 are each independently an oxygen atom or -NR Z -, R Z is a hydrogen atom or a monovalent organic group, and R 1 and R 2 are each independently, is a hydrogen atom or a monovalent organic group, at least one of R 1 and R 2 is a monovalent organic group having an ethylenically unsaturated bond, and X 1 is a tetravalent organic group having a benzene ring structure.
  • Y 1 is a divalent organic group represented by the following formula (Y-1).
  • R 3 to R 10 are each independently a hydrogen atom or a monovalent group, and at least one of R 3 to R 10 is an alkyl group, a fluorine atom, or a trifluoromethyl group. and * each represent a bonding site with the nitrogen atom in formula (1).
  • the resin composition of the present invention is preferably used to form a photosensitive film that is subjected to exposure and development, and is preferably used to form a film that is subjected to exposure and development using a developer containing an organic solvent.
  • the resin composition of the present invention can be used, for example, to form an insulating film of a semiconductor device, an interlayer insulating film for a rewiring layer, a stress buffer film, etc., and can be used for forming an interlayer insulating film for a rewiring layer. preferable.
  • the resin composition of the present invention is used for forming an interlayer insulating film for a rewiring layer.
  • the resin composition of the present invention is preferably used for forming a photosensitive film subjected to negative development.
  • negative development refers to development in which non-exposed areas are removed by development during exposure and development
  • positive development refers to development in which exposed areas are removed by development.
  • the above-mentioned exposure method, the above-mentioned developer, and the above-mentioned development method include, for example, the exposure method explained in the exposure step in the explanation of the method for producing a cured product, and the developer and development method explained in the development step. is used.
  • a resin composition containing a polyimide precursor and a radically polymerizable compound has been used, and a cured product obtained from the composition has been used, for example, as an interlayer insulating film.
  • the polyimide precursor in the present invention has a repeating unit represented by formula (1).
  • Polyimide obtained from such a polyimide precursor is rigid and has a high Young's modulus, but the structure containing an ethylenically unsaturated bond in Y 1 and R 1 or R 2 is hydrophobic, making it difficult to use conventional polyimide.
  • a polymerizable compound there was room for improvement in performance such as elongation at break.
  • the cured product obtained from the resin composition of the present invention has a structure in which the repeating unit represented by formula (1) is ring-closed as a resin.
  • Such a structure is rigid and is thought to increase the Young's modulus of the cured product.
  • Young's modulus and elongation at break there is a trade-off relationship between Young's modulus and elongation at break, and cured products with a high Young's modulus tend to have a low elongation at break.
  • ⁇ SP is more than -3.5 MPa 1/2 and less than 5.0 MPa 1/2 , even when the polyimide precursor has a repeating unit represented by formula (1), Elongation at break can be improved.
  • the present invention has the effect of achieving both a high elongation at break and a high Young's modulus. Furthermore, the resin used in the present invention is highly hydrophobic, and the radically polymerizable compound whose SP value is more than -4.0 MPa 1/2 and less than 5.0 MPa 1/2 is also highly hydrophobic. expensive. It is thought that by employing such a configuration, it becomes difficult for water to enter the cured product, and the heat and humidity resistance is also improved.
  • Patent Document 1 describes a polyimide precursor containing a repeating unit represented by formula (1), There is no description of a resin composition containing a radically polymerizable compound and having ⁇ SP within the above range.
  • ⁇ SP is more than -3.5 MPa 1/2 and less than 5.0 MPa 1/2 .
  • the lower limit of ⁇ SP is preferably -3.3 MPa 1/2 or more, more preferably -3.0 MPa 1/2 or more, and even more preferably -2.5 MPa 1/2 or more.
  • the upper limit of ⁇ SP is preferably 4.5 MPa 1/2 or less, more preferably 4.0 MPa 1/2 or less, and even more preferably 3.5 MPa 1/2 or less.
  • the solubility parameter SPA of the specific resin is preferably 21.5 MPa 1/2 or less, more preferably 20.7 MPa 1/2 or less, from the viewpoint of improving heat and humidity resistance.
  • the lower limit of the SPA is not particularly limited, but may be, for example, 15.0 MPa 1/2 or more.
  • the Hansen solubility parameter is used as the solubility parameter (SP value).
  • the d value (dispersion term ⁇ d), p value (polar term ⁇ p), and h value (hydrogen bond term ⁇ h) of the Hansen solubility parameters were determined using the software Hansen Solubility Parameters in Practice (HSPiP) ver. 4.1.07.
  • a resin composition contains a total of n types of compounds as polyimide precursors, the SP values thereof are P 1 , P 2 , ..., P n , and the content mass proportions are m 1 , m 2 , ..., m n , SPA is calculated by the following formula (SP A ).
  • a resin composition contains a total of n types of compounds as radically polymerizable compounds, the SP values thereof are M 1 , M 2 , . . . , M n , and the content mass proportions are m 1 , m 2 , ..., m n , SPB is calculated by the following formula (SP B ).
  • the resin composition of the present invention contains a polyimide precursor (hereinafter also referred to as "specific resin") containing a repeating unit represented by formula (1).
  • a 1 and A 2 are each independently an oxygen atom or -NR Z -, R Z is a hydrogen atom or a monovalent organic group, and R 1 and R 2 are each independently, is a hydrogen atom or a monovalent organic group, at least one of R 1 and R 2 is a monovalent organic group having an ethylenically unsaturated bond, and X 1 is a tetravalent organic group having a benzene ring structure.
  • Y 1 is a divalent organic group represented by the following formula (Y-1).
  • R 3 to R 10 are each independently a hydrogen atom or a monovalent group, and at least one of R 3 to R 10 is an alkyl group, a fluorine atom, or a trifluoromethyl group. and * each represent a bonding site with the nitrogen atom in formula (1).
  • a 1 and A 2 in formula (1) each independently represent an oxygen atom or -NR Z -, and preferably an oxygen atom.
  • R Z represents a hydrogen atom or a monovalent organic group, and preferably a hydrogen atom.
  • examples of R Z include a hydrocarbon group.
  • a 1 is -NR Z -
  • R Z may be combined with R 1 to form a ring structure.
  • the ring structure formed includes hydrocarbon rings, preferably aliphatic hydrocarbon rings, and more preferably saturated aliphatic hydrocarbon rings. Further, the ring structure is preferably a 5-membered ring or a 6-membered ring.
  • a 2 is -NR Z -
  • R Z may be combined with R 2 to form a ring structure.
  • the preferred embodiments of the ring structure formed are the same as the preferred embodiments of the ring structure formed by the combination of R Z and R 1 described above.
  • R 1 and R 2 are each independently a hydrogen atom or a monovalent organic group, and at least one of R 1 and R 2 is a monovalent organic group having an ethylenically unsaturated bond. be.
  • An embodiment in which both R 1 and R 2 are monovalent organic groups having an ethylenically unsaturated bond is also one of the preferred embodiments of the present invention.
  • Examples of the monovalent organic group having an ethylenically unsaturated bond include a vinyl group, an allyl group, an isoallyl group, a 2-methylallyl group, a group having an aromatic ring directly bonded to a vinyl group (for example, a vinyl phenyl group, etc.), ( A group having a meth)acrylamide group, a (meth)acryloyloxy group, or a group having a group represented by the following formula (III) is preferred, and a group having a group represented by the following formula (III) is more preferred. Further, an embodiment in which the monovalent organic group having an ethylenically unsaturated bond is a group represented by the following formula (III) is also one of the preferred embodiments of the present invention.
  • R 200 represents a hydrogen atom, a methyl group, an ethyl group, or a methylol group, and preferably a hydrogen atom or a methyl group.
  • * represents a bonding site with another structure.
  • R 201 represents an alkylene group having 2 to 12 carbon atoms, -CH 2 CH(OH)CH 2 -, a cycloalkylene group or a polyalkyleneoxy group, and an alkylene group is preferable.
  • R 201 examples include alkylene groups such as ethylene group, propylene group, trimethylene group, tetramethylene group, pentamethylene group, hexamethylene group, octamethylene group, and dodecamethylene group, 1,2-butanediyl group, 1, Examples include 3-butanediyl group, -CH 2 CH (OH) CH 2 -, polyalkyleneoxy group, alkylene groups such as ethylene group and propylene group, -CH 2 CH (OH) CH 2 -, cyclohexyl group, polyalkylene group.
  • An oxy group is more preferred, and an alkylene group such as an ethylene group or a propylene group, or a polyalkyleneoxy group is even more preferred.
  • a polyalkyleneoxy group refers to a group in which two or more alkyleneoxy groups are directly bonded.
  • the alkylene groups in the plurality of alkyleneoxy groups contained in the polyalkyleneoxy group may be the same or different.
  • the arrangement of the alkyleneoxy groups in the polyalkyleneoxy group may be a random arrangement or an arrangement having blocks. Alternatively, an arrangement having an alternating pattern or the like may be used.
  • the number of carbon atoms in the alkylene group (including the number of carbon atoms in the substituent when the alkylene group has a substituent) is preferably 2 or more, more preferably 2 to 10, and 2 to 6.
  • the alkylene group may have a substituent.
  • Preferred substituents include alkyl groups, aryl groups, halogen atoms, and the like.
  • the number of alkyleneoxy groups contained in the polyalkyleneoxy group is preferably 2 to 20, more preferably 2 to 10, and even more preferably 2 to 6.
  • polyalkyleneoxy groups include polyethyleneoxy groups, polypropyleneoxy groups, polytrimethyleneoxy groups, polytetramethyleneoxy groups, or multiple ethyleneoxy groups and multiple propyleneoxy groups.
  • a group bonded to an oxy group is preferable, a polyethyleneoxy group or a polypropyleneoxy group is more preferable, and a polyethyleneoxy group is even more preferable.
  • the ethyleneoxy groups and propyleneoxy groups may be arranged randomly, or may be arranged to form blocks. , may be arranged in an alternating pattern. Preferred embodiments of the repeating number of ethyleneoxy groups, etc. in these groups are as described above.
  • the specific resin when R 1 is a hydrogen atom or when R 2 is a hydrogen atom, the specific resin may form a counter salt with a tertiary amine compound having an ethylenically unsaturated bond.
  • a tertiary amine compound having such an ethylenically unsaturated bond is N,N-dimethylaminopropyl methacrylate.
  • one of R 1 and R 2 may be a monovalent organic group having no ethylenically unsaturated bond.
  • a group represented by a combination with -S-, -SO 2 - or -NR N - is preferred, a group represented by a hydrocarbon group or a combination of a hydrocarbon group and -O- is more preferred, and an alkyl group, aromatic hydrocarbon group or polyalkyleneoxy group are more preferred.
  • R N represents a hydrogen atom or a monovalent organic group, preferably a hydrogen atom, a hydrocarbon group, or an aromatic group, more preferably a hydrogen atom or an alkyl group, and even more preferably a hydrogen atom.
  • the alkyl group when simply described as an alkyl group, the alkyl group includes any of a linear alkyl group, a branched alkyl group, and a cyclic alkyl group. The same applies to alkylene groups, aliphatic hydrocarbon groups, etc.
  • X 1 is a tetravalent organic group having a benzene ring structure.
  • the benzene ring structure contained in X 1 may exist as a single ring, or may exist as a multi-ring (e.g., fused ring) with other benzene ring structures or other heterocyclic structures. good.
  • the number of benzene ring structures contained in X 1 is preferably 1 to 6, more preferably 1 to 4.
  • the above X 1 in formula (1) has three or more benzene ring structures.
  • the number of benzene ring structures is preferably 3 to 6, more preferably 3 to 5, and even more preferably 3 or 4.
  • the benzene ring structure may have a known substituent.
  • the substituent include an alkyl group, a halogen atom, an alkyl group in which a hydrogen atom is substituted with a halogen atom, and the like.
  • the benzene ring structure is present on the main chain of the resin.
  • the "main chain” refers to the relatively longest bond chain in the resin molecule
  • the "side chain” refers to other bond chains.
  • the presence of a certain structure on the main chain means that the main chain is connected by a certain structure, and if the certain structure is removed, the main chain will be fragmented.
  • the specific resin contains, as the repeating unit represented by formula (1), a repeating unit in which X 1 in formula (1) has two or more ether bonds.
  • the ether bond is a divalent bond represented by *-O-*, and both * are bonded to a hydrocarbon group.
  • One of the preferred embodiments of the present invention is an embodiment in which both ends of the two or more ether bonds in X 1 are directly bonded to the benzene ring structure.
  • "A and B are directly bonded” means that A and B are bonded without including a linking group between them.
  • the number of ether bonds in Z 1 is preferably 2 to 6, more preferably 2 to 4, even more preferably 2 or 3, and particularly preferably 2.
  • Both ends of each of the above two ether bonds may be a hydrocarbon group, but it is also a preferred embodiment of the present invention that both ends have a benzene ring structure. Moreover, it is preferable that the above-mentioned ether bond exists on the main chain of the resin.
  • the specific resin includes, as a repeating unit represented by formula (1), a repeating unit in which the above X 1 in formula (1) has three or more benzene ring structures and two or more ether bonds. It is also preferable.
  • the specific resin contains, as the repeating unit represented by formula (1), a repeating unit in which the above X 1 in formula (1) has a structure represented by the following formula (a) or the following formula (b). .
  • R a1 each independently represents a monovalent group
  • m1 represents an integer of 0 to 3
  • R a2 each independently represents a monovalent group
  • m2 represents a monovalent group of 0 to 4.
  • R a3 each independently represents a monovalent group
  • m3 represents an integer of 0 to 3
  • *1 to *4 each represent a bonding site with the carbonyl group in formula (1).
  • R b1 each independently represents a monovalent group
  • n1 represents an integer of 0 to 3
  • R b2 each independently represents a monovalent group
  • n2 represents a monovalent group of 0 to 4.
  • R b3 each independently represents a monovalent group
  • n3 represents an integer from 0 to 4
  • R b4 each independently represents a monovalent group
  • n4 represents an integer from 0 to 3.
  • J 1 and J 2 each independently represent a hydrogen atom, an alkyl group or a trifluoromethyl group
  • *1 to *4 each represent a bonding site with a carbonyl group in formula (1).
  • R a1 is preferably a halogen atom, an aliphatic hydrocarbon group, or an aromatic group.
  • the hydrogen atom in the aliphatic hydrocarbon group or aromatic group may be further substituted with a halogen atom or the like.
  • m1 represents an integer of 0 to 3, preferably 0 to 2, and more preferably 0 or 1.
  • an embodiment in which m1 is 0 is also one of the preferred embodiments of the present invention.
  • preferred embodiments of R a2 and R a3 are the same as those of R a1 .
  • m2 is preferably 0 to 2, more preferably 0 or 1.
  • m2 is 0 is also one of the preferred embodiments of the present invention.
  • preferred embodiments of m3 are the same as those of m1.
  • one of *1 or *2 is bonded to the carbonyl group bonded to A1 in formula (1), and the other is bonded to a structure outside the repeating unit represented by formula (1). Bonded to a carbonyl group, one of *3 or *4 bonded to the carbonyl group bonded to A 2 in formula (1), and the other bonded to the carbonyl group bonded to NH described in formula (1) It is preferable to do so.
  • R b1 is preferably a halogen atom, an aliphatic hydrocarbon group, or an aromatic group.
  • the hydrogen atom in the aliphatic hydrocarbon group or aromatic group may be further substituted with a halogen atom or the like.
  • n1 represents an integer of 0 to 3, preferably 0 to 2, and more preferably 0 or 1. Furthermore, an embodiment in which n1 is 0 is also one of the preferred embodiments of the present invention.
  • preferred embodiments of R b2 , R b3 and R b4 are the same as the preferred embodiment of R b1 .
  • n2 is preferably 0 to 2, more preferably 0 or 1.
  • n2 is 0 is also one of the preferred embodiments of the present invention.
  • preferred embodiments of n3 are the same as those of n2.
  • preferred embodiments of n4 are the same as those of n1.
  • J 1 and J 2 each independently represent a hydrogen atom, an alkyl group, or a trifluoromethyl group, and preferably a hydrogen atom, a methyl group, or a trifluoromethyl group.
  • one of *1 or *2 is bonded to the carbonyl group bonded to A1 in formula (1), and the other is bonded to a structure outside the repeating unit represented by formula (1). Bonded to a carbonyl group, one of *3 or *4 bonded to the carbonyl group bonded to A 2 in formula (1), and the other bonded to the carbonyl group bonded to NH described in formula (1) It is preferable to do so.
  • the specific resin includes a repeating unit represented by formula (1) in which the above-mentioned X 1 in formula (1) has a structure represented by any of the following formulas (2a) to (2d).
  • the specific resin has the above-mentioned X 1 in the formula (1) as a repeating unit represented by the formula (1). It is also preferable to include a repeating unit having a structure represented by the following formula and a repeating unit having a structure in which the above-mentioned X 1 in formula (1) is represented by any one of the following formulas (2a) to (2d).
  • L 1 and L 2 are each independently a divalent group or a single bond that is not conjugated with the benzene ring to which they are bonded, and *1 to *4 are each represented by the formula Represents the bonding site with the carbonyl group in (1).
  • L 1 and L 2 are each independently preferably -C(R C ) 2 -, -Si(R S ) 2 -, -O-, or a single bond, and -C More preferably, it is (R C ) 2 -, -Si(R S ) 2 -, or -O-. Also. It is preferable that at least one of L 1 and L 2 is -C(R C ) 2 - or -Si(R S ) 2 -.
  • R C is each independently a hydrogen atom or a hydrocarbon group, preferably an alkyl group, more preferably an alkyl group having 1 to 4 carbon atoms, and even more preferably a methyl group.
  • R S is each independently a hydrocarbon group, preferably an alkyl group, more preferably an alkyl group having 1 to 4 carbon atoms, and even more preferably a methyl group.
  • one of *1 or *2 is bonded to the carbonyl group bonded to A 1 in formula (1), and the other is a group other than the repeating unit represented by formula (1).
  • One of *3 or *4 is bonded to the carbonyl group bonded to A2 in formula (1), and the other is bonded to NH described in formula (1). It is preferable to bond with a carbonyl group.
  • two R S may be combined to form a ring structure.
  • hydrogen atoms in the ring structures described in formulas (2a) to (2d) may be substituted with known substituents.
  • substituents include an alkyl group, a halogen atom, an alkyl group in which a hydrogen atom is substituted with a halogen atom, and the like.
  • Y 1 is a divalent organic group represented by formula (Y-1).
  • at least one of R 3 to R 10 is an alkyl group, a fluorine atom, or a trifluoromethyl group, and from the viewpoint of moist heat resistance, a fluorine atom or a trifluoromethyl group is preferable. preferable.
  • at least two of R 3 to R 10 are preferably an alkyl group, a fluorine atom, or a trifluoromethyl group.
  • the alkyl group is preferably an alkyl group having 1 to 4 carbon atoms, and more preferably a methyl group. It is also preferable that Y 1 is a divalent organic group represented by formula (Y-2).
  • R 5 and R 8 are each independently an alkyl group, a fluorine atom, or a trifluoromethyl group, and * each represents a bonding site with the nitrogen atom in formula (1).
  • R 5 and R 8 are preferably each independently a fluorine atom or a trifluoromethyl group.
  • the alkyl group in R 5 and R 8 is preferably an alkyl group having 1 to 4 carbon atoms, and more preferably a methyl group.
  • the specific resin may further include a repeating unit represented by the following formula (2) as a repeating unit different from the repeating unit represented by the above formula (1). That is, the repeating unit that corresponds to the repeating unit represented by formula (1) does not correspond to the repeating unit represented by formula (2) below.
  • a 1 and A 2 each independently represent an oxygen atom or -NR z -
  • R 111 represents a divalent organic group
  • R 115 represents a tetravalent organic group
  • R 113 and R 114 each independently represent a hydrogen atom or a monovalent organic group
  • R z represents a hydrogen atom or a monovalent organic group.
  • a 1 and A 2 in formula (2) each independently represent an oxygen atom or -NR z -, and preferably an oxygen atom.
  • Rz represents a hydrogen atom or a monovalent organic group, preferably a hydrogen atom.
  • R 111 in formula (2) represents a divalent organic group.
  • divalent organic groups include groups containing straight-chain or branched aliphatic groups, cyclic aliphatic groups, and aromatic groups, including straight-chain or branched aliphatic groups having 2 to 20 carbon atoms, A group consisting of a cyclic aliphatic group having 3 to 20 carbon atoms, an aromatic group having 3 to 20 carbon atoms, or a combination thereof is preferable, and a group containing an aromatic group having 6 to 20 carbon atoms is more preferable.
  • the hydrocarbon group in the chain may be substituted with a group containing a hetero atom, and in the above cyclic aliphatic group and aromatic group, the hydrocarbon group in the chain may be substituted with a hetero atom. may be substituted with a group containing.
  • R 111 in formula (2) include groups represented by -Ar- and -Ar-L-Ar-, with a group represented by -Ar-L-Ar- being preferred.
  • Ar is each independently an aromatic group
  • L is a single bond or an aliphatic hydrocarbon group having 1 to 10 carbon atoms which may be substituted with a fluorine atom, -O-, -CO -, -S-, -SO 2 -, -NHCO-, or a combination of two or more of the above.
  • R 111 is derived from a diamine.
  • diamines used for producing the specific resin include linear or branched aliphatic, cyclic aliphatic, and aromatic diamines.
  • One type of diamine may be used, or two or more types may be used.
  • R 111 is a linear or branched aliphatic group having 2 to 20 carbon atoms, a cyclic aliphatic group having 3 to 20 carbon atoms, an aromatic group having 3 to 20 carbon atoms, or any of these.
  • a diamine containing a combination of groups is preferable, and a diamine containing an aromatic group having 6 to 20 carbon atoms is more preferable.
  • the above-mentioned straight-chain or branched aliphatic group may have a hydrocarbon group in the chain substituted with a group containing a hetero atom.
  • the above-mentioned cyclic aliphatic group and aromatic group may have a ring member hydrocarbon group substituted with a hetero atom-containing group. may be substituted with a group containing.
  • groups containing aromatic groups include the following.
  • diamine specifically, 1,2-diaminoethane, 1,2-diaminopropane, 1,3-diaminopropane, 1,4-diaminobutane or 1,6-diaminohexane; 1,2- or 1,3-diaminocyclopentane, 1,2-, 1,3- or 1,4-diaminocyclohexane, 1,2-, 1,3- or 1,4-bis(aminomethyl)cyclohexane , bis-(4-aminocyclohexyl)methane, bis-(3-aminocyclohexyl)methane, 4,4'-diamino-3,3'-dimethylcyclohexylmethane and isophoronediamine; m- or p-phenylenediamine, diaminotoluene, 4,4'- or 3,3'-diaminobiphenyl, 4,4'-diaminodipheny
  • diamines (DA-1) to (DA-18) described in paragraphs 0030 to 0031 of International Publication No. 2017/038598.
  • diamines having two or more alkylene glycol units in the main chain described in paragraphs 0032 to 0034 of International Publication No. 2017/038598 are also preferably used.
  • R 111 is preferably represented by -Ar-L-Ar- from the viewpoint of flexibility of the resulting organic film.
  • Ar is each independently an aromatic group
  • L is an aliphatic hydrocarbon group having 1 to 10 carbon atoms which may be substituted with a fluorine atom, -O-, -CO-, -S- , -SO 2 -, -NHCO-, or a combination of two or more of the above.
  • Ar is preferably a phenylene group
  • L is preferably an aliphatic hydrocarbon group having 1 or 2 carbon atoms optionally substituted with a fluorine atom, -O-, -CO-, -S- or -SO 2 - .
  • the aliphatic hydrocarbon group here is preferably an alkylene group.
  • R 111 is preferably a divalent organic group represented by the following formula (51) or formula (61).
  • a divalent organic group represented by formula (61) is more preferable.
  • R 50 to R 57 are each independently a hydrogen atom, a fluorine atom, or a monovalent organic group, and at least one of R 50 to R 57 is a fluorine atom, a methyl group, or a trifluoro It is a methyl group, and each * independently represents a bonding site with the nitrogen atom in formula (2).
  • the monovalent organic groups R 50 to R 57 include unsubstituted alkyl groups having 1 to 10 carbon atoms (preferably 1 to 6 carbon atoms), and unsubstituted alkyl groups having 1 to 10 carbon atoms (preferably 1 to 6 carbon atoms). Examples include fluorinated alkyl groups.
  • R 58 and R 59 each independently represent a fluorine atom, a methyl group, or a trifluoromethyl group, and * each independently represents a bonding site with the nitrogen atom in formula (2). represent.
  • Examples of the diamine giving the structure of formula (51) or formula (61) include 2,2'-dimethylbenzidine, 2,2'-bis(trifluoromethyl)-4,4'-diaminobiphenyl, 2,2'- Bis(fluoro)-4,4'-diaminobiphenyl, 4,4'-diaminoctafluorobiphenyl, and the like. These may be used alone or in combination of two or more.
  • R 115 in formula (2) represents a tetravalent organic group.
  • a tetravalent organic group containing an aromatic ring is preferable, and a group represented by the following formula (5) or formula (6) is more preferable.
  • * each independently represents a bonding site with another structure.
  • R 112 is a single bond or a divalent linking group, and is a single bond or an aliphatic hydrocarbon group having 1 to 10 carbon atoms, which may be substituted with a fluorine atom, -O-, A group selected from -CO-, -S-, -SO 2 -, -NHCO-, and combinations thereof is preferable, and the number of carbon atoms optionally substituted with a single bond or a fluorine atom is preferable.
  • it is a group selected from 1 to 3 alkylene groups, -O-, -CO-, -S- and -SO 2 -, including -CH 2 -, -C(CF 3 ) 2 -, - More preferably, it is a divalent group selected from the group consisting of C(CH 3 ) 2 -, -O-, -CO-, -S- and -SO 2 -.
  • R 115 include a tetracarboxylic acid residue remaining after removal of an anhydride group from a tetracarboxylic dianhydride.
  • the specific resin may contain only one type of tetracarboxylic dianhydride residue, or may contain two or more types of tetracarboxylic dianhydride residues as the structure corresponding to R115 .
  • the tetracarboxylic dianhydride is represented by the following formula (O).
  • R 115 represents a tetravalent organic group.
  • the preferred range of R 115 is the same as R 115 in formula (2), and the preferred range is also the same.
  • tetracarboxylic dianhydride examples include pyromellitic dianhydride (PMDA), 3,3',4,4'-biphenyltetracarboxylic dianhydride, 3,3',4,4'- Diphenylsulfidetetracarboxylic dianhydride, 3,3',4,4'-diphenylsulfonetetracarboxylic dianhydride, 3,3',4,4'-benzophenonetetracarboxylic dianhydride, 3,3' , 4,4'-diphenylmethanetetracarboxylic dianhydride, 2,2',3,3'-diphenylmethanetetracarboxylic dianhydride, 2,3,3',4'-biphenyltetracarboxylic dianhydride, 2,3,3',4'-benzophenonetetracarboxylic dianhydride, 4,4'-oxydiphthalic dianhydride, 2,3,
  • preferred examples include tetracarboxylic dianhydrides (DAA-1) to (DAA-5) described in paragraph 0038 of International Publication No. 2017/038598.
  • R 111 and R 115 may have an OH group. More specifically, R 111 includes a residue of a bisaminophenol derivative.
  • R 113 and R 114 in formula (2) each independently represent a hydrogen atom or a monovalent organic group.
  • the monovalent organic group preferably includes a linear or branched alkyl group, a cyclic alkyl group, an aromatic group, or a polyalkyleneoxy group.
  • at least one of R 113 and R 114 contains a polymerizable group, and it is more preferable that both of them contain a polymerizable group.
  • the polymerizable group is a group that can undergo a crosslinking reaction by the action of heat, radicals, etc., and a radically polymerizable group is preferable.
  • the polymerizable group examples include a group having an ethylenically unsaturated bond, an alkoxymethyl group, a hydroxymethyl group, an acyloxymethyl group, an epoxy group, an oxetanyl group, a benzoxazolyl group, a blocked isocyanate group, and an amino group. It will be done.
  • the radically polymerizable group contained in the specific resin is preferably a group having an ethylenically unsaturated bond.
  • Examples of the group having an ethylenically unsaturated bond include a vinyl group, an allyl group, an isoallyl group, a 2-methylallyl group, a group having an aromatic ring directly bonded to a vinyl group (for example, a vinyl phenyl group, etc.), and a (meth)acrylamide group. , (meth)acryloyloxy group, a group represented by the above formula (III), and the like, with the group represented by the above formula (III) being preferred.
  • the specific resin when R 113 is a hydrogen atom, or when R 114 is a hydrogen atom, the specific resin may form a counter salt with a tertiary amine compound having an ethylenically unsaturated bond.
  • a tertiary amine compound having such an ethylenically unsaturated bond is N,N-dimethylaminopropyl methacrylate.
  • the specific resin has a fluorine atom in its structure.
  • the fluorine atom content in the polyimide precursor is preferably 10% by mass or more, and preferably 20% by mass or less.
  • the specific resin may be copolymerized with an aliphatic group having a siloxane structure for the purpose of improving adhesion to the substrate.
  • examples include embodiments in which bis(3-aminopropyl)tetramethyldisiloxane, bis(p-aminophenyl)octamethylpentasiloxane, etc. are used as the diamine.
  • the repeating unit represented by formula (2) is preferably a repeating unit represented by formula (2-A). That is, it is preferable that at least one of the specific resins used in the present invention is a precursor having a repeating unit represented by formula (2-A). When the specific resin contains a repeating unit represented by formula (2-A), it becomes possible to further widen the exposure latitude.
  • a 1 and A 2 represent an oxygen atom
  • R 111 and R 112 each independently represent a divalent organic group
  • R 113 and R 114 each independently, It represents a hydrogen atom or a monovalent organic group
  • at least one of R 113 and R 114 is a group containing a polymerizable group, and preferably both are groups containing a polymerizable group.
  • a 1 , A 2 , R 111 , R 113 and R 114 each independently have the same meaning as A 1 , A 2 , R 111 , R 113 and R 114 in formula (2), and their preferred ranges are also the same.
  • R 112 has the same meaning as R 112 in formula (5), and the preferred ranges are also the same.
  • the specific resin may contain one type of repeating unit represented by formula (2), or may contain two or more types. Furthermore, it may contain structural isomers of the repeating unit represented by formula (2). In addition to the repeating unit of the above formula (2), the specific resin may also contain other types of repeating units.
  • the specific resin may further contain other repeating units different from the repeating units represented by formulas (1) to (2).
  • Examples of other repeating units include a repeating unit represented by the following formula (PAI-2).
  • R 117 represents a trivalent organic group
  • R 111 represents a divalent organic group
  • a 2 represents an oxygen atom or -NH-
  • R 113 represents a hydrogen atom or a monovalent organic group. represents an organic group.
  • R 117 is a linear or branched aliphatic group, a cyclic aliphatic group, an aromatic group, a heteroaromatic group, or a single bond or a linking group that binds these two groups.
  • the above-linked groups include linear aliphatic groups having 2 to 20 carbon atoms, branched aliphatic groups having 3 to 20 carbon atoms, cyclic aliphatic groups having 3 to 20 carbon atoms, and 6 to 20 carbon atoms.
  • An aromatic group having 6 to 20 carbon atoms, or a group having 6 to 20 carbon atoms combined with a single bond or a connecting group is preferable. A group combining two or more of these is more preferable.
  • the group is preferably a group such as -O-, -S-, an alkylene group, a halogenated alkylene group, an arylene group, or a linking group in which two or more of these are bonded together.
  • the alkylene group is preferably an alkylene group having 1 to 20 carbon atoms, more preferably an alkylene group having 1 to 10 carbon atoms, and even more preferably an alkylene group having 1 to 4 carbon atoms.
  • the above halogenated alkylene group is preferably a halogenated alkylene group having 1 to 20 carbon atoms, more preferably a halogenated alkylene group having 1 to 10 carbon atoms, and more preferably a halogenated alkylene group having 1 to 4 carbon atoms.
  • examples of the halogen atom in the halogenated alkylene group include a fluorine atom, a chlorine atom, a bromine atom, an iodine atom, and the like, with a fluorine atom being preferred.
  • the halogenated alkylene group may have a hydrogen atom or all of the hydrogen atoms may be substituted with a halogen atom, but it is preferable that all of the hydrogen atoms are substituted with a halogen atom.
  • examples of preferred halogenated alkylene groups include (ditrifluoromethyl)methylene groups and the like.
  • the arylene group is preferably a phenylene group or a naphthylene group, more preferably a phenylene group, and even more preferably a 1,3-phenylene group or a 1,4-phenylene group.
  • R 117 is preferably derived from a tricarboxylic acid compound in which at least one carboxy group may be halogenated.
  • a tricarboxylic acid compound a compound having three carboxy groups is referred to as a tricarboxylic acid compound. Two of the three carboxy groups of the tricarboxylic acid compound may be converted into acid anhydrides.
  • the optionally halogenated tricarboxylic acid compound used in the production of the polyamideimide precursor include branched aliphatic, cyclic aliphatic, or aromatic tricarboxylic acid compounds. These tricarboxylic acid compounds may be used alone or in combination of two or more.
  • the tricarboxylic acid compound includes a linear aliphatic group having 2 to 20 carbon atoms, a branched aliphatic group having 3 to 20 carbon atoms, a cyclic aliphatic group having 3 to 20 carbon atoms, and a cyclic aliphatic group having 3 to 20 carbon atoms.
  • a tricarboxylic acid compound containing an aromatic group having 6 to 20 carbon atoms or a combination of two or more of these through a single bond or a connecting group is preferred;
  • a tricarboxylic acid compound containing a combination of two or more aromatic groups of 6 to 20 is more preferred.
  • tricarboxylic acid compounds include 1,2,3-propanetricarboxylic acid, 1,3,5-pentanetricarboxylic acid, citric acid, trimellitic acid, 2,3,6-naphthalenetricarboxylic acid, and phthalic acid. (or phthalic anhydride) and benzoic acid have a single bond, -O-, -CH 2 -, -C(CH 3 ) 2 -, -C(CF 3 ) 2 -, -SO 2 - or phenylene group. Examples include linked compounds. These compounds may be compounds in which two carboxyl groups are anhydrides (for example, trimellitic anhydride), or compounds in which at least one carboxyl group is halogenated (for example, trimellitic anhydride). There may be.
  • R 111 , A 2 and R 113 have the same meanings as R 111 , A 2 and R 113 in formula (2) above, respectively, and preferred embodiments are also the same.
  • One embodiment of the specific resin includes an aspect in which the content of repeating units represented by formula (1) is 50 mol% or more of all repeating units.
  • the total content is more preferably 70 mol% or more, still more preferably 90 mol% or more, and particularly preferably more than 90 mol%.
  • the upper limit of the total content is not particularly limited, and all repeating units in the specific resin excluding the terminal may be repeating units represented by formula (1).
  • the specific resin is a repeating unit represented by formula (1), in which X 1 has two or more ether bonds (repeat unit 1), and a repeating unit represented by formula (1), , X 1 contains a repeating unit (repeat unit 2) having a structure represented by any of the following formulas (2a) to (2d), the total molar content of repeating unit 1 and repeating unit 2
  • the content of repeating unit 1 is preferably 5 to 50 mol%, more preferably 10 to 40 mol%.
  • the weight average molecular weight (Mw) of the specific resin is preferably 5,000 to 200,000, more preferably 10,000 to 150,000, even more preferably 30,000 to 120,000, and even more preferably 40,000 to 100,000. is particularly preferred.
  • the number average molecular weight (Mn) of the specific resin is preferably 2,000 to 100,000, more preferably 3,000 to 60,000, even more preferably 10,000 to 50,000, and even more preferably 20,000 to 40,000. is particularly preferred.
  • the molecular weight dispersity of the specific resin is preferably 4.0 or less, more preferably 3.0 or less, and even more preferably 2.5 or less. The lower limit of the above-mentioned dispersity is not particularly limited, and may be 1.0 or more.
  • the molecular weight dispersity is a value calculated by weight average molecular weight/number average molecular weight.
  • the weight average molecular weight, number average molecular weight, and degree of dispersion of at least one type of specific resin are within the above ranges. Further, it is also preferable that the weight average molecular weight, number average molecular weight, and degree of dispersion calculated by considering the plurality of types of specific resins as one resin are each within the above ranges.
  • the specific resin can be synthesized, for example, by the method described in the Examples below, but is not limited thereto. Specifically, for example, a method of reacting a tetracarboxylic dianhydride and a diamine at a low temperature, a method of reacting a tetracarboxylic dianhydride and a diamine at a low temperature to obtain a polyamic acid, and a method of reacting a polyamic acid with a condensing agent or an alkylating agent.
  • a method in which a diester is obtained from a tetracarboxylic dianhydride and an alcohol, and then the remaining dicarboxylic acid is acid-halogenated using a halogenating agent and reacted with a diamine is more preferable.
  • the condensing agent include dicyclohexylcarbodiimide, diisopropylcarbodiimide, 1-ethoxycarbonyl-2-ethoxy-1,2-dihydroquinoline, 1,1-carbonyldioxy-di-1,2,3-benzotriazole, N, Examples include N'-disuccinimidyl carbonate and trifluoroacetic anhydride.
  • alkylating agent examples include N,N-dimethylformamide dimethyl acetal, N,N-dimethylformamide diethyl acetal, N,N-dialkylformamide dialkyl acetal, trimethyl orthoformate, and triethyl orthoformate.
  • halogenating agent examples include thionyl chloride, oxalyl chloride, phosphorus oxychloride, and the like.
  • an organic solvent In the method for producing the specific resin, it is preferable to use an organic solvent during the reaction. The number of organic solvents may be one or two or more.
  • the organic solvent can be determined as appropriate depending on the raw material, and examples include pyridine, diethylene glycol dimethyl ether (diglyme), N-methylpyrrolidone, N-ethylpyrrolidone, ethyl propionate, dimethylacetamide, dimethylformamide, tetrahydrofuran, ⁇ -butyrolactone, etc. is exemplified.
  • a basic compound In the method for producing the specific resin, it is preferable to add a basic compound during the reaction.
  • the number of basic compounds may be one or two or more.
  • the basic compound can be determined as appropriate depending on the raw material, but triethylamine, diisopropylethylamine, pyridine, 1,8-diazabicyclo[5.4.0]undec-7-ene, N,N-dimethyl-4-amino Examples include pyridine.
  • -Terminal sealing agent- In the method for producing the specific resin, in order to further improve the storage stability, it is preferable to seal the carboxylic acid anhydride, acid anhydride derivative, or amino group remaining at the terminal end of the specific resin.
  • examples of the terminal capping agent include monoalcohol, phenol, thiol, thiophenol, monoamine, etc. From the viewpoint of properties, it is more preferable to use monoalcohols, phenols, and monoamines.
  • Preferred monoalcohol compounds include primary alcohols such as methanol, ethanol, propanol, butanol, hexanol, octanol, dodecinol, benzyl alcohol, 2-phenylethanol, 2-methoxyethanol, 2-chloromethanol, furfuryl alcohol, and isopropanol. , 2-butanol, cyclohexyl alcohol, cyclopentanol, secondary alcohols such as 1-methoxy-2-propanol, and tertiary alcohols such as t-butyl alcohol and adamantane alcohol.
  • primary alcohols such as methanol, ethanol, propanol, butanol, hexanol, octanol, dodecinol, benzyl alcohol, 2-phenylethanol, 2-methoxyethanol, 2-chloromethanol, furfuryl alcohol, and isopropanol.
  • 2-butanol cyclohexyl alcohol
  • Preferred phenolic compounds include phenols such as phenol, methoxyphenol, methylphenol, naphthalen-1-ol, naphthalen-2-ol, and hydroxystyrene.
  • Preferred monoamine compounds include aniline, 2-ethynylaniline, 3-ethynylaniline, 4-ethynylaniline, 5-amino-8-hydroxyquinoline, 1-hydroxy-7-aminonaphthalene, 1-hydroxy-6- Aminonaphthalene, 1-hydroxy-5-aminonaphthalene, 1-hydroxy-4-aminonaphthalene, 2-hydroxy-7-aminonaphthalene, 2-hydroxy-6-aminonaphthalene, 2-hydroxy-5-aminonaphthalene, 1- Carboxy-7-aminonaphthalene, 1-carboxy-6-aminonaphthalene, 1-carboxy-5-aminonaphthalene, 2-carboxy-7-aminonaphthalene, 2-carboxy-6-aminona
  • sealing agents for amino groups include carboxylic acid anhydrides, carboxylic acid chlorides, carboxylic acid bromides, sulfonic acid chlorides, sulfonic anhydrides, and sulfonic acid carboxylic acid anhydrides, with carboxylic acid anhydrides and carboxylic acid chlorides being more preferred. preferable.
  • Preferred carboxylic anhydride compounds include acetic anhydride, propionic anhydride, oxalic anhydride, succinic anhydride, maleic anhydride, phthalic anhydride, benzoic anhydride, 5-norbornene-2,3-dicarboxylic anhydride, and the like.
  • Preferred carboxylic acid chloride compounds include acetyl chloride, acrylic acid chloride, propionyl chloride, methacrylic acid chloride, pivaloyl chloride, cyclohexane carbonyl chloride, 2-ethylhexanoyl chloride, cinnamoyl chloride, and 1-adamantane carbonyl chloride. , heptafluorobutyryl chloride, stearic acid chloride, benzoyl chloride, and the like.
  • the method for producing the specific resin may include a step of precipitating a solid. Specifically, after removing the water-absorbed by-products of the dehydration condensation agent coexisting in the reaction solution by filtration as necessary, the obtained product is added to a poor solvent such as water, aliphatic lower alcohol, or a mixture thereof. By introducing a polymer component and precipitating the polymer component, the specific resin can be obtained by precipitating it as a solid and drying it. In order to improve the degree of purification, operations such as redissolution, reprecipitation, and drying of the specific resin may be repeated. Furthermore, the method may include a step of removing ionic impurities using an ion exchange resin.
  • the content of the specific resin in the resin composition of the present invention is preferably 20% by mass or more, more preferably 30% by mass or more, and 40% by mass or more based on the total solid content of the resin composition. It is even more preferable that the amount is 50% by mass or more. Further, the content of the specific resin in the resin composition of the present invention is preferably 99.5% by mass or less, more preferably 99% by mass or less, and 98% by mass or less based on the total solid content of the resin composition. It is more preferably at most 97% by mass, even more preferably at most 95% by mass.
  • the resin composition of the present invention may contain only one type of specific resin, or may contain two or more types of specific resin. When two or more types are included, it is preferable that the total amount falls within the above range.
  • the resin composition of the present invention may contain at least two types of resin. Specifically, the resin composition of the present invention may contain a total of two or more kinds of the specific resin and other resins described below, or may contain two or more kinds of the specific resin, but may contain the specific resin. It is preferable to include two or more types. When the resin composition of the present invention contains two or more specific resins, for example, two or more specific resins having different dianhydride-derived structures (X 1 in the above formula (1)) It is preferable to include.
  • the resin composition of the present invention may contain the above-mentioned specific resin and another resin different from the specific resin (hereinafter also simply referred to as "other resin").
  • Other resins include polyimide precursors that do not fall under the specific resin (for example, polyimide precursors that do not contain the repeating unit represented by formula (1) and contain the repeating unit represented by formula (2)), Polybenzoxazole precursor, polyimide imide precursor, polyimide, polybenzoxazole, polyamideimide, phenolic resin, polyamide, epoxy resin, polysiloxane, resin containing a siloxane structure, (meth)acrylic resin, (meth)acrylamide resin, Examples include urethane resin, butyral resin, styryl resin, polyether resin, and polyester resin.
  • a resin composition with excellent coating properties can be obtained, and a pattern (cured product) with excellent solvent resistance can be obtained.
  • a polymerizable group having a high polymerizable group value with a weight average molecular weight of 20,000 or less for example, the molar amount of polymerizable groups contained in 1 g of resin
  • a (meth)acrylic resin having a concentration of 1 ⁇ 10 -3 mol/g or more
  • it is possible to improve the coating properties of the resin composition, the solvent resistance of the pattern (cured product), etc. can.
  • the content of the other resins is preferably 0.01% by mass or more, and 0.05% by mass or more based on the total solid content of the resin composition. It is more preferably 1% by mass or more, even more preferably 2% by mass or more, even more preferably 5% by mass or more, and even more preferably 10% by mass or more. More preferred.
  • the content of other resins in the resin composition of the present invention is preferably 80% by mass or less, more preferably 75% by mass or less, and 70% by mass based on the total solid content of the resin composition. It is more preferably at most 60% by mass, even more preferably at most 50% by mass.
  • the content of other resins may be low.
  • the content of the other resin is preferably 20% by mass or less, more preferably 15% by mass or less, and 10% by mass or less based on the total solid content of the resin composition. is more preferable, even more preferably 5% by mass or less, even more preferably 1% by mass or less.
  • the lower limit of the content is not particularly limited, and may be 0% by mass or more.
  • the resin composition of the present invention may contain only one type of other resin, or may contain two or more types of other resins. When two or more types are included, it is preferable that the total amount falls within the above range.
  • the resin composition of the present invention contains a radically polymerizable compound.
  • a radically polymerizable compound is a compound having a radically polymerizable group.
  • the radically polymerizable group a group containing an ethylenically unsaturated bond is preferable.
  • the group containing an ethylenically unsaturated bond include a vinyl group, an allyl group, a vinylphenyl group, a (meth)acryloxy group, a maleimide group, and a (meth)acrylamide group.
  • (meth)acryloxy group, (meth)acrylamide group, and vinylphenyl group are preferable, and from the viewpoint of reactivity, (meth)acryloxy group is more preferable.
  • the radically polymerizable compound is preferably a compound having one or more ethylenically unsaturated bonds, more preferably a compound having two or more ethylenically unsaturated bonds.
  • the radically polymerizable compound may have three or more ethylenically unsaturated bonds.
  • the compound having two or more ethylenically unsaturated bonds is preferably a compound having 2 to 15 ethylenically unsaturated bonds, more preferably a compound having 2 to 10 ethylenically unsaturated bonds, and more preferably a compound having 2 to 6 ethylenically unsaturated bonds. More preferred are compounds having the following.
  • the resin composition of the present invention contains a compound having two ethylenically unsaturated bonds and a compound having three or more of the above ethylenically unsaturated bonds. It is also preferable.
  • the molecular weight of the radically polymerizable compound is preferably 2,000 or less, more preferably 1,500 or less, and even more preferably 900 or less.
  • the lower limit of the molecular weight of the radically polymerizable compound is preferably 100 or more.
  • radically polymerizable compounds include unsaturated carboxylic acids (for example, acrylic acid, methacrylic acid, itaconic acid, crotonic acid, isocrotonic acid, maleic acid, etc.), their esters, and amides, and preferably, These are esters of unsaturated carboxylic acids and polyhydric alcohol compounds, and amides of unsaturated carboxylic acids and polyhydric amine compounds.
  • unsaturated carboxylic acids for example, acrylic acid, methacrylic acid, itaconic acid, crotonic acid, isocrotonic acid, maleic acid, etc.
  • addition reaction products of unsaturated carboxylic acid esters or amides having nucleophilic substituents such as hydroxy groups, amino groups, and sulfanyl groups with monofunctional or polyfunctional isocyanates or epoxies, and monofunctional or polyfunctional A dehydration condensation reaction product with a functional carboxylic acid is also preferably used.
  • the radically polymerizable compound is also preferably a compound having a boiling point of 100°C or higher under normal pressure.
  • Examples of the compound having a boiling point of 100° C. or higher under normal pressure include the compounds described in paragraph 0203 of International Publication No. 2021/112189. This content is incorporated herein.
  • Preferred radically polymerizable compounds other than those mentioned above include the radically polymerizable compounds described in paragraphs 0204 to 0208 of International Publication No. 2021/112189. This content is incorporated herein.
  • radically polymerizable compounds include dipentaerythritol triacrylate (commercially available product: KAYARAD D-330 (manufactured by Nippon Kayaku Co., Ltd.)), dipentaerythritol tetraacrylate (commercially available product: KAYARAD D-320 (Nippon Kayaku Co., Ltd.) Co., Ltd.), A-TMMT (Shin Nakamura Chemical Co., Ltd.)), dipentaerythritol penta(meth)acrylate (commercially available products include KAYARAD D-310 (Nippon Kayaku Co., Ltd.)), Pentaerythritol hexa(meth)acrylate (commercially available products are KAYARAD DPHA (manufactured by Nippon Kayaku Co., Ltd.) and A-DPH (manufactured by Shin Nakamura Chemical Industry Co., Ltd.)), and their (meth)acryloyl groups are ethylene glycol
  • radical polymerizable compounds include, for example, SR-494, which is a tetrafunctional acrylate having four ethyleneoxy chains, and SR-209, 231, and 239, which are difunctional methacrylates having four ethyleneoxy chains (Sartomer (manufactured by Nippon Kayaku Co., Ltd.), DPCA-60, a hexafunctional acrylate with six pentyleneoxy chains, TPA-330, a trifunctional acrylate with three isobutyleneoxy chains (manufactured by Nippon Kayaku Co., Ltd.), urethane oligomer UAS-10, UAB-140 (all manufactured by Nippon Paper Industries), NK Ester M-40G, NK Ester 4G, NK Ester M-9300, NK Ester A-9300, UA-7200 (all manufactured by Shin-Nakamura Chemical Industries) ), DPHA-40H (manufactured by Nippon Kayaku Co., Ltd.), UA-306H,
  • radically polymerizable compounds include urethane acrylates such as those described in Japanese Patent Publication No. 48-041708, Japanese Patent Application Laid-open No. 51-037193, Japanese Patent Publication No. 02-032293, and Japanese Patent Publication No. 02-016765. , JP-B No. 58-049860, JP-B No. 56-017654, JP-B No. 62-039417, and JP-B No. 62-039418 are also suitable.
  • radically polymerizable compound use a compound having an amino structure or a sulfide structure in the molecule, which is described in JP-A-63-277653, JP-A-63-260909, and JP-A-01-105238. You can also do it.
  • the radically polymerizable compound may be a radically polymerizable compound having an acid group such as a carboxy group or a phosphoric acid group.
  • the radically polymerizable compound having an acid group is preferably an ester of an aliphatic polyhydroxy compound and an unsaturated carboxylic acid.
  • a radically polymerizable compound having a group is more preferable.
  • the aliphatic polyhydroxy compound is pentaerythritol or dipenta The compound is erythritol.
  • Commercially available products include, for example, polybasic acid-modified acrylic oligomers manufactured by Toagosei Co., Ltd., such as M-510 and M-520.
  • the acid value of the radically polymerizable compound having an acid group is preferably 0.1 to 300 mgKOH/g, more preferably 1 to 100 mgKOH/g.
  • the acid value of the radically polymerizable compound is within the above range, it has excellent handling properties during production and excellent developability. Moreover, it has good polymerizability.
  • the above acid value is measured in accordance with the description of JIS K 0070:1992.
  • a radically polymerizable compound having at least one type of structure selected from the group consisting of a urea bond, a urethane bond, and an amide bond (hereinafter also referred to as "crosslinking agent U") is also preferable.
  • the crosslinking agent U may have only one urea bond, urethane bond, or amide bond, or may have two or more structures of one or more types selected from the group consisting of urea bond, urethane bond, and amide bond. good.
  • the total number of urea bonds, urethane bonds, and amide bonds in crosslinking agent U is 1 or more, preferably 1 to 10, more preferably 1 to 4, and even more preferably 1 or 2. . It is preferable that the crosslinking agent U has at least one type of structure selected from the group consisting of urea bonds and urethane bonds.
  • the radical polymerizable group in the crosslinking agent U is not particularly limited, but examples include a vinyl group, an allyl group, a (meth)acryloyl group, a (meth)acryloxy group, a (meth)acrylamide group, a vinylphenyl group, a maleimide group, and the like.
  • a (meth)acryloxy group, a (meth)acrylamide group, a vinylphenyl group, or a maleimide group is preferred, and a (meth)acryloxy group is more preferred.
  • the crosslinking agent U has two or more radically polymerizable groups, the structures of each radically polymerizable group may be the same or different.
  • the number of radically polymerizable groups in the crosslinking agent U may be only one or two or more, preferably 1 to 10, more preferably 1 to 6, particularly preferably 1 to 4.
  • the radically polymerizable group value (mass of compound per mole of radically polymerizable group) in crosslinking agent U is preferably 150 to 400 g/mol.
  • the lower limit of the radically polymerizable group value is more preferably 200 g/mol or more, still more preferably 210 g/mol or more, and preferably 220 g/mol or more. More preferably, it is 230 g/mol or more, even more preferably 240 g/mol or more, and particularly preferably 250 g/mol or more.
  • the upper limit of the radically polymerizable group value is more preferably 350 g/mol or less, still more preferably 330 g/mol or less, and particularly preferably 300 g/mol or less.
  • the polymerizable group value of crosslinking agent U is preferably 210 to 400 g/mol, more preferably 220 to 400 g/mol.
  • the crosslinking agent U preferably has a structure represented by the following formula (U-1), for example.
  • R U1 is a hydrogen atom or a monovalent organic group
  • A is a single bond, -O- or -NR N -
  • R N is a hydrogen atom or a monovalent organic group.
  • Z U1 is an m-valent organic group
  • Z U2 is a single bond or an n+1-valent organic group
  • X is a radically polymerizable group
  • n is an integer of 1 or more
  • m is an integer of 1 or more. is an integer.
  • A is a single bond, -O- or -NR N -, preferably -O- or -NR N -.
  • R N are as described above.
  • R U1 is preferably a hydrogen atom, an alkyl group, or an aromatic hydrocarbon group, and more preferably a hydrogen atom.
  • R N is preferably a hydrogen atom, an alkyl group, or an aromatic hydrocarbon group, and more preferably a hydrogen atom.
  • the hydrocarbon group is preferably a hydrocarbon group having 20 or less carbon atoms, more preferably a hydrocarbon group having 18 or less carbon atoms, and still more preferably a hydrocarbon group having 16 or less carbon atoms.
  • Examples of the hydrocarbon group include a saturated aliphatic hydrocarbon group, an aromatic hydrocarbon group, and a group represented by a bond thereof.
  • R N represents a hydrogen atom or a monovalent organic group, preferably a hydrogen atom or a hydrocarbon group, more preferably a hydrogen atom or an alkyl group, and even more preferably a hydrogen atom or a methyl group.
  • Examples of the hydrocarbon group include those listed in Z U1 , and preferred embodiments are also the same.
  • X is not particularly limited, but examples include vinyl group, allyl group, (meth)acryloyl group, (meth)acryloxy group, (meth)acrylamide group, vinylphenyl group, maleimide group, etc. )
  • An acrylamide group, a vinylphenyl group, or a maleimide group is preferable, and a (meth)acryloxy group is more preferable.
  • n is preferably an integer of 1 to 10, more preferably an integer of 1 to 4, even more preferably 1 or 2, and particularly preferably 1.
  • m is preferably an integer of 1 to 10, more preferably an integer of 1 to 4, and even more preferably 1 or 2.
  • the crosslinking agent U has at least one of a hydroxy group, an alkyleneoxy group, and a cyano group.
  • the hydroxy group may be an alcoholic hydroxy group or a phenolic hydroxy group, but is preferably an alcoholic hydroxy group.
  • the alkyleneoxy group is preferably an alkyleneoxy group having 2 to 20 carbon atoms, more preferably an alkyleneoxy group having 2 to 10 carbon atoms, and an alkyleneoxy group having 2 to 4 carbon atoms.
  • An oxy group is more preferred, an ethylene group or a propylene group is even more preferred, and an ethylene group is particularly preferred.
  • the alkyleneoxy group may be included in the crosslinking agent U as a polyalkyleneoxy group.
  • the number of repeating alkyleneoxy groups is preferably 2 to 10, more preferably 2 to 6.
  • the crosslinking agent U has two or more structures selected from the group consisting of a hydroxy group, an alkyleneoxy group (a polyalkyleneoxy group when forming a polyalkyleneoxy group), and a cyano group in the molecule. However, it is also preferable to have only one in the molecule.
  • the above-mentioned hydroxy group, alkyleneoxy group, and cyano group may be present in any position of the crosslinking agent U, but from the viewpoint of chemical resistance, the crosslinking agent U should be and at least one radically polymerizable group contained in the crosslinking agent U are a linking group containing a urea bond, a urethane bond, or an amide bond (hereinafter also referred to as "linking group L2-1"). ) is also preferable.
  • the crosslinking agent U contains only one radically polymerizable group
  • the radically polymerizable group contained in the crosslinking agent U and at least one selected from the group consisting of a hydroxy group, an alkyleneoxy group, and a cyano group It is preferable that they be connected by a linking group containing a urea bond, a urethane bond, or an amide bond (hereinafter also referred to as "linking group L2-2").
  • an alkyleneoxy group (However, when constituting a polyalkyleneoxy group, a polyalkyleneoxy group) and has the above linking group L2-1 or the above linking group L2-2, an alkyleneoxy group (However, when constituting a polyalkyleneoxy group, the structure bonded to the side opposite to the connecting group L2-1 or the connecting group L2-2 is not particularly limited, but may be a hydrocarbon group, A group represented by a radically polymerizable group or a combination thereof is preferred.
  • the hydrocarbon group is preferably a hydrocarbon group having 20 or less carbon atoms, more preferably a hydrocarbon group having 18 or less carbon atoms, and still more preferably a hydrocarbon group having 16 or less carbon atoms.
  • hydrocarbon group examples include a saturated aliphatic hydrocarbon group, an aromatic hydrocarbon group, and a group represented by a bond thereof.
  • preferred embodiments of the radically polymerizable group are the same as those of the radically polymerizable group in the above-mentioned crosslinking agent U.
  • the crosslinking agent U has a hydroxyl group.
  • the crosslinking agent U preferably contains an aromatic group from the viewpoint of compatibility with the specific resin. It is preferable that the aromatic group is directly bonded to a urea bond, urethane bond, or amide bond contained in the crosslinking agent U. When the crosslinking agent U contains two or more urea bonds, urethane bonds, or amide bonds, it is preferable that one of the urea bonds, urethane bonds, or amide bonds is directly bonded to the aromatic group.
  • the aromatic group may be an aromatic hydrocarbon group, an aromatic heterocyclic group, or a structure in which these groups form a condensed ring, but it is preferably an aromatic hydrocarbon group.
  • the aromatic hydrocarbon group mentioned above is preferably an aromatic hydrocarbon group having 6 to 30 carbon atoms, more preferably an aromatic hydrocarbon group having 6 to 20 carbon atoms, and has two or more hydrogen atoms removed from the benzene ring structure. More preferred are groups.
  • the aromatic heterocyclic group is preferably a 5-membered or 6-membered aromatic heterocyclic group. Examples of the aromatic heterocycle in such an aromatic heterocyclic group include pyrrole, imidazole, triazole, tetrazole, pyrazole, furan, thiophene, oxazole, isoxazole, thiazole, pyridine, pyrazine, pyrimidine, pyridazine, triazine, etc. .
  • the heteroatom contained in the aromatic heterocyclic group is preferably a nitrogen atom, an oxygen atom or a sulfur atom.
  • the aromatic group is, for example, a linking group that connects two or more radically polymerizable groups and includes a urea bond, a urethane bond, or an amide bond, or a linking group selected from the group consisting of the above-mentioned hydroxy group, alkyleneoxy group, and cyano group. and at least one radically polymerizable group contained in the crosslinking agent U.
  • the number of atoms (linked chain length) between the urea bond, urethane bond, or amide bond and the radically polymerizable group in the crosslinking agent U is not particularly limited, but is preferably 30 or less, and preferably 2 to 20. More preferably, it is 2 to 10.
  • the crosslinking agent U contains a total of two or more urea bonds, urethane bonds, or amide bonds, or contains two or more radically polymerizable groups, or contains two or more urea bonds, urethane bonds, or amide bonds, and is radically polymerizable.
  • the minimum number of atoms (linked chain length) between the urea bond, urethane bond, or amide bond and the radically polymerizable group may be within the above range.
  • “the number of atoms between the urea bond, urethane bond, or amide bond and the polymerizable group (linkage chain length)” refers to the atoms on the path connecting two atoms or atomic groups to be linked. Among chains, it refers to the chain that connects these connected objects in the shortest way (minimum number of atoms). For example, in the structure represented by the following formula, the number of atoms (linked chain length) between the urea bond and the radically polymerizable group (methacryloyloxy group) is two.
  • the crosslinking agent U is a compound having a structure without an axis of symmetry.
  • the crosslinking agent U does not have an axis of symmetry, it means that it does not have an axis that produces molecules identical to the original molecule by rotating the entire compound, and is a left-right asymmetric compound.
  • the structural formula of crosslinking agent U is written on paper, the fact that crosslinking agent U does not have an axis of symmetry means that the structural formula of crosslinking agent U cannot be written in a form that has an axis of symmetry. say. It is thought that since the crosslinking agent U does not have an axis of symmetry, aggregation of the crosslinking agents U is suppressed in the composition film.
  • the molecular weight of the crosslinking agent U is preferably from 100 to 2,000, preferably from 150 to 1,500, and more preferably from 200 to 900.
  • the method for producing crosslinking agent U is not particularly limited, but, for example, it can be obtained by reacting a radically polymerizable compound and a compound having an isocyanate group with a compound having at least one of a hydroxy group or an amino group.
  • crosslinking agent U examples include D-2 to D-15 described in Examples below and the following compounds, but the crosslinking agent U is not limited thereto.
  • the resin composition preferably contains a difunctional radically polymerizable compound, and more preferably contains a difunctional methacrylate or acrylate, from the viewpoint of pattern resolution and film elasticity.
  • the resin composition may contain a compound (polymerizable compound 1) having only one radically polymerizable group among the crosslinking agents U described above, and a bifunctional radically polymerizable compound (polymerizable compound 1) having no urea bond, urethane bond, or amide bond.
  • An embodiment including the chemical compound 2) is also one of the preferred embodiments of the present invention.
  • the content of polymerizable compound 1 with respect to the total mass of polymerizable compound 1 and polymerizable compound 2 is such that the above-mentioned ⁇ SP is within the above-mentioned range.
  • it may be set as appropriate depending on the purpose, for example, it is preferably 0.01 to 80% by mass, more preferably 5 to 70% by mass, and even more preferably 10 to 50% by mass.
  • Specific compounds include triethylene glycol diacrylate, triethylene glycol dimethacrylate, tetraethylene glycol dimethacrylate, tetraethylene glycol diacrylate, PEG (polyethylene glycol) 200 diacrylate, PEG 200 dimethacrylate, PEG 600 diacrylate, and PEG 600 diacrylate.
  • PEG200 diacrylate refers to polyethylene glycol diacrylate in which the formula weight of polyethylene glycol chains is about 200.
  • a monofunctional radically polymerizable compound can be preferably used as the radically polymerizable compound from the viewpoint of suppressing warpage of the pattern (cured product).
  • Examples of monofunctional radically polymerizable compounds include n-butyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, 2-hydroxyethyl (meth)acrylate, butoxyethyl (meth)acrylate, carbitol (meth)acrylate, and cyclohexyl ( (meth) acrylate, benzyl (meth) acrylate, phenoxyethyl (meth) acrylate, N-methylol (meth) acrylamide, glycidyl (meth) acrylate, polyethylene glycol mono (meth) acrylate, polypropylene glycol mono (meth) acrylate, etc.
  • N-vinyl compounds such as N-vinylpyrrolidone and N-vinylcaprolactam
  • allyl glycidyl ether and the like are preferably used.
  • the monofunctional radically polymerizable compound a compound having a boiling point of 100° C. or higher under normal pressure is also preferred in order to suppress volatilization before exposure.
  • allyl compounds such as diallyl phthalate and triallyl trimellitate are exemplified as radically polymerizable compounds having two or more functionalities.
  • the content of the radically polymerizable compound is preferably more than 0% by mass and 60% by mass or less based on the total solid content of the resin composition.
  • the lower limit is more preferably 5% by mass or more.
  • the upper limit is more preferably 50% by mass or less, and even more preferably 30% by mass or less.
  • One type of radically polymerizable compound may be used alone, or a mixture of two or more types may be used. When two or more types are used together, it is preferable that the total amount falls within the above range.
  • the resin composition of the present invention may further contain another crosslinking agent different from the above-mentioned radically polymerizable compound.
  • Other crosslinking agents refer to crosslinking agents other than the above-mentioned radically polymerizable compounds, and the above-mentioned photoacid generators or photobase generators are used to interact with other compounds in the composition or their reaction products.
  • the compound has a plurality of groups in the molecule that promote the reaction of forming a covalent bond between other compounds in the composition or the reaction product thereof.
  • the compound has a plurality of groups in its molecule that are promoted by the action of an acid or a base.
  • the acid or base is preferably an acid or base generated from a photoacid generator or a photobase generator in the exposure step.
  • the other crosslinking agent is preferably a compound having at least one group selected from the group consisting of an acyloxymethyl group, a methylol group, an ethylol group, and an alkoxymethyl group.
  • a compound having a structure in which at least one group selected from the group consisting of groups is directly bonded to a nitrogen atom is more preferable.
  • crosslinking agents include, for example, reacting an amino group-containing compound such as melamine, glycoluril, urea, alkylene urea, benzoguanamine with formaldehyde or formaldehyde and alcohol to convert the hydrogen atom of the amino group into an acyloxymethyl group, methylol group, etc.
  • Examples include compounds having a structure substituted with an ethylol group or an alkoxymethyl group.
  • the method for producing these compounds is not particularly limited, and any compound having the same structure as the compound produced by the above method may be used. An oligomer formed by self-condensation of the methylol groups of these compounds may also be used.
  • a crosslinking agent using melamine is a melamine crosslinking agent
  • a crosslinking agent using glycoluril, urea or alkylene urea is a urea crosslinking agent
  • a crosslinking agent using alkylene urea is an alkylene urea crosslinking agent.
  • a crosslinking agent using benzoguanamine is called a benzoguanamine-based crosslinking agent.
  • the resin composition of the present invention preferably contains at least one compound selected from the group consisting of a urea-based crosslinking agent and a melamine-based crosslinking agent, and includes a glycoluril-based crosslinking agent and a melamine-based crosslinking agent described below. It is more preferable that at least one compound selected from the group consisting of agents is included.
  • the compound containing at least one of an alkoxymethyl group and an acyloxymethyl group has an alkoxymethyl group or an acyloxymethyl group substituted directly on an aromatic group, a nitrogen atom of the urea structure shown below, or on a triazine.
  • Examples of the structure include the following compounds.
  • the alkoxymethyl group or acyloxymethyl group possessed by the above compound preferably has 2 to 5 carbon atoms, preferably 2 or 3 carbon atoms, and more preferably 2 carbon atoms.
  • the total number of alkoxymethyl groups and acyloxymethyl groups possessed by the above compound is preferably 1 to 10, more preferably 2 to 8, particularly preferably 3 to 6.
  • the molecular weight of the above compound is preferably 1,500 or less, more preferably from 180 to 1,200.
  • R 100 represents an alkyl group or an acyl group.
  • R 101 and R 102 each independently represent a monovalent organic group, and may be bonded to each other to form a ring.
  • Examples of compounds in which an alkoxymethyl group or an acyloxymethyl group is directly substituted with an aromatic group include compounds represented by the following general formula.
  • R 4 is each independently, It represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms
  • R 5 represents a group that is eliminated by the action of an acid.
  • R 105 each independently represents an alkyl group or an alkenyl group
  • a, b and c each independently represent 1 to 3
  • d represents 0 to 4
  • e represents 0 to 3
  • f represents 0 to 3.
  • a+d is 5 or less
  • b+e is 4 or less
  • c+f is 4 or less.
  • R 5 in a group that decomposes under the action of an acid to produce an alkali-soluble group a group that leaves under the action of an acid, and a group represented by -C(R 4 ) 2 COOR 5 , for example, -C(R 36 )(R 37 )(R 38 ), -C(R 36 )(R 37 )(OR 39 ), and -C(R 01 )(R 02 )(OR 39 ).
  • R 36 to R 39 each independently represent an alkyl group, a cycloalkyl group, an aryl group, an aralkyl group, or an alkenyl group.
  • R 36 and R 37 may be combined with each other to form a ring.
  • the alkyl group is preferably an alkyl group having 1 to 10 carbon atoms, more preferably an alkyl group having 1 to 5 carbon atoms.
  • the alkyl group may be linear or branched.
  • the above-mentioned cycloalkyl group is preferably a cycloalkyl group having 3 to 12 carbon atoms, more preferably a cycloalkyl group having 3 to 8 carbon atoms.
  • the above cycloalkyl group may have a monocyclic structure or a polycyclic structure such as a condensed ring.
  • the above aryl group is preferably an aromatic hydrocarbon group having 6 to 30 carbon atoms, and more preferably a phenyl group.
  • the aralkyl group is preferably an aralkyl group having 7 to 20 carbon atoms, more preferably an aralkyl group having 7 to 16 carbon atoms.
  • the above aralkyl group is intended to be an aryl group substituted with an alkyl group, and the preferred embodiments of these alkyl groups and aryl groups are the same as the preferred embodiments of the alkyl group and aryl group described above.
  • the above alkenyl group is preferably an alkenyl group having 3 to 20 carbon atoms, more preferably an alkenyl group having 3 to 16 carbon atoms. These groups may further have known substituents.
  • R 01 and R 02 each independently represent a hydrogen atom, an alkyl group, a cycloalkyl group, an aryl group, an aralkyl group, or an alkenyl group.
  • Preferable examples of the group that decomposes under the action of an acid to produce an alkali-soluble group, or the group that leaves the group under the action of an acid include a tertiary alkyl ester group, an acetal group, a cumyl ester group, and an enol ester group. More preferred are tertiary alkyl ester groups and acetal groups.
  • the compound having at least one group selected from the group consisting of an acyloxymethyl group, a methylol group, an ethylol group, and an alkoxymethyl group may include at least one group selected from the group consisting of a urea bond and a urethane bond.
  • Compounds having the following are also preferred.
  • a preferred embodiment of the above compound is the above-mentioned crosslinked compound, except that the polymerizable group is not a radically polymerizable group but is at least one group selected from the group consisting of an acyloxymethyl group, a methylol group, an ethylol group, and an alkoxymethyl group. This is the same as the preferred embodiment of Agent U.
  • the compound having at least one group selected from the group consisting of an acyloxymethyl group, a methylol group, and an ethylol group include the following structures.
  • Examples of the compound having an acyloxymethyl group include the following compounds in which the alkoxymethyl group is changed to an acyloxymethyl group.
  • Compounds having an alkoxymethyl group or acyloxymethyl in the molecule include, but are not limited to, the following compounds.
  • the compound containing at least one of an alkoxymethyl group and an acyloxymethyl group a commercially available compound may be used, or a compound synthesized by a known method may be used. From the viewpoint of heat resistance, compounds in which an alkoxymethyl group or an acyloxymethyl group is directly substituted on an aromatic ring or triazine ring are preferred.
  • melamine-based crosslinking agents include hexamethoxymethylmelamine, hexaethoxymethylmelamine, hexapropoxymethylmelamine, hexabutoxybutylmelamine, and the like.
  • urea-based crosslinking agents include monohydroxymethylated glycoluril, dihydroxymethylated glycoluril, trihydroxymethylated glycoluril, tetrahydroxymethylated glycoluril, monomethoxymethylated glycoluril, and dimethoxymethylated glycoluril.
  • uril trimethoxymethylated glycoluril, tetramethoxymethylated glycoluril, monoethoxymethylated glycoluril, diethoxymethylated glycoluril, triethoxymethylated glycoluril, tetraethoxymethylated glycoluril, monopropoxymethylated glycoluril , dipropoxymethylated glycoluril, tripropoxymethylated glycoluril, tetrapropoxymethylated glycoluril, monobutoxymethylated glycoluril, dibutoxymethylated glycoluril, tributoxymethylated glycoluril, or tetrabutoxymethylated glycoluril
  • Glycoluril crosslinking agents such as uril, Urea-based crosslinking agents such as bismethoxymethylurea, bisethoxymethylurea, bispropoxymethylurea, bisbutoxymethylurea, Monohydroxymethylated ethyleneurea or dihydroxymethylated ethyleneurea, monomethoxymethylated ethyleneurea, dimethoxymethylated
  • benzoguanamine-based crosslinking agents include monohydroxymethylated benzoguanamine, dihydroxymethylated benzoguanamine, trihydroxymethylated benzoguanamine, tetrahydroxymethylated benzoguanamine, monomethoxymethylated benzoguanamine, dimethoxymethylated benzoguanamine, and trimethoxymethylated benzoguanamine.
  • tetramethoxymethylated benzoguanamine monoethoxymethylated benzoguanamine, diethoxymethylated benzoguanamine, triethoxymethylated benzoguanamine, tetraethoxymethylated benzoguanamine, monopropoxymethylated benzoguanamine, dipropoxymethylated benzoguanamine, tripropoxymethylated benzoguanamine, tetra Examples include propoxymethylated benzoguanamine, monobutoxymethylated benzoguanamine, dibutoxymethylated benzoguanamine, tributoxymethylated benzoguanamine, and tetrabutoxymethylated benzoguanamine.
  • a compound having at least one group selected from the group consisting of a methylol group and an alkoxymethyl group at least one group selected from the group consisting of a methylol group and an alkoxymethyl group is added to an aromatic ring (preferably a benzene ring).
  • aromatic ring preferably a benzene ring
  • compounds in which species groups are directly bonded are also preferably used. Specific examples of such compounds include benzenedimethanol, bis(hydroxymethyl)cresol, bis(hydroxymethyl)dimethoxybenzene, bis(hydroxymethyl)diphenyl ether, bis(hydroxymethyl)benzophenone, and hydroxymethylphenyl hydroxymethylbenzoate.
  • suitable commercial products include 46DMOC, 46DMOEP (manufactured by Asahi Yokuzai Kogyo Co., Ltd.), DML-PC, DML-PEP, DML-OC, and DML-OEP.
  • the resin composition of the present invention contains at least one compound selected from the group consisting of an epoxy compound, an oxetane compound, and a benzoxazine compound as another crosslinking agent.
  • Epoxy compounds compounds with epoxy groups
  • the epoxy compound is preferably a compound having two or more epoxy groups in one molecule. Epoxy groups undergo a crosslinking reaction at 200° C. or lower, and no dehydration reaction due to crosslinking occurs, so membrane shrinkage is less likely to occur. Therefore, containing an epoxy compound is effective in curing the resin composition at low temperatures and suppressing warpage.
  • the epoxy compound contains a polyethylene oxide group. This further reduces the elastic modulus and suppresses warpage.
  • the polyethylene oxide group means one in which the number of ethylene oxide repeating units is 2 or more, and the number of repeating units is preferably 2 to 15.
  • epoxy compounds include bisphenol A type epoxy resin; bisphenol F type epoxy resin; propylene glycol diglycidyl ether, neopentyl glycol diglycidyl ether, ethylene glycol diglycidyl ether, butylene glycol diglycidyl ether, and hexamethylene glycol diglycidyl ether.
  • alkylene glycol type epoxy resin or polyhydric alcohol hydrocarbon type epoxy resin such as trimethylolpropane triglycidyl ether
  • polyalkylene glycol type epoxy resin such as polypropylene glycol diglycidyl ether
  • epoxy group such as polymethyl (glycidyloxypropyl) siloxane Examples include, but are not limited to, silicone containing silicone.
  • n is an integer of 1 to 5
  • m is an integer of 1 to 20.
  • n is preferably 1 to 2 and m is preferably 3 to 7 in order to achieve both heat resistance and elongation improvement.
  • Oxetane compounds include compounds having two or more oxetane rings in one molecule, 3-ethyl-3-hydroxymethyloxetane, 1,4-bis ⁇ [(3-ethyl-3-oxetanyl)methoxy]methyl ⁇ benzene, Examples include 3-ethyl-3-(2-ethylhexylmethyl)oxetane and 1,4-benzenedicarboxylic acid-bis[(3-ethyl-3-oxetanyl)methyl]ester.
  • the Aronoxetane series (for example, OXT-121, OXT-221) manufactured by Toagosei Co., Ltd. can be suitably used, and these may be used alone or in combination of two or more. good.
  • a benzoxazine compound (compound having benzoxazolyl group)- A benzoxazine compound is preferable because it does not generate outgassing during curing due to a crosslinking reaction derived from a ring-opening addition reaction, and furthermore, it reduces thermal shrinkage and suppresses the occurrence of warpage.
  • benzoxazine compounds include P-d type benzoxazine, F-a type benzoxazine (trade name, manufactured by Shikoku Kasei Kogyo Co., Ltd.), benzoxazine adduct of polyhydroxystyrene resin, and phenol novolak type dihydrobenzo. Examples include oxazine compounds. These may be used alone or in combination of two or more.
  • the content of other crosslinking agents is preferably 0.1 to 30% by mass, more preferably 0.1 to 20% by mass, and 0.5 to 15% by mass based on the total solid content of the resin composition. It is more preferably 1.0 to 10% by weight, particularly preferably 1.0 to 10% by weight. Only one type of other crosslinking agent may be contained, or two or more types thereof may be contained. When two or more types of other crosslinking agents are contained, it is preferable that the total amount is within the above range.
  • the resin composition of the present invention preferably contains a polymerization initiator.
  • the polymerization initiator may be a thermal polymerization initiator or a photopolymerization initiator, but it is particularly preferable to include a photopolymerization initiator.
  • the photopolymerization initiator is preferably a radical photopolymerization initiator.
  • the radical photopolymerization initiator is not particularly limited and can be appropriately selected from known radical photopolymerization initiators.
  • a photoradical polymerization initiator that is sensitive to light in the ultraviolet to visible range is preferable.
  • it may be an activator that acts with a photoexcited sensitizer to generate active radicals.
  • the photoradical polymerization initiator contains at least one compound having a molar absorption coefficient of at least about 50 L ⁇ mol ⁇ 1 ⁇ cm ⁇ 1 within the wavelength range of about 240 to 800 nm (preferably 330 to 500 nm). It is preferable.
  • the molar extinction coefficient of a compound can be measured using a known method. For example, it is preferable to measure at a concentration of 0.01 g/L using an ethyl acetate solvent with an ultraviolet-visible spectrophotometer (Cary-5 spectrophotometer manufactured by Varian).
  • any known compound can be used.
  • halogenated hydrocarbon derivatives e.g., compounds having a triazine skeleton, compounds having an oxadiazole skeleton, compounds having a trihalomethyl group, etc.
  • acylphosphine compounds such as acylphosphine oxide, hexaarylbiimidazole, oxime derivatives, etc.
  • ketone compound examples include compounds described in paragraph 0087 of JP-A-2015-087611, the contents of which are incorporated herein.
  • Kayacure-DETX-S manufactured by Nippon Kayaku Co., Ltd. is also suitably used.
  • a hydroxyacetophenone compound, an aminoacetophenone compound, and an acylphosphine compound can be suitably used as the photoradical polymerization initiator. More specifically, for example, the aminoacetophenone-based initiator described in JP-A-10-291969 and the acylphosphine oxide-based initiator described in Japanese Patent No. 4225898 can be used, the content of which is herein incorporated by reference. Incorporated. Furthermore, 2,4,6-trimethylbenzoyldiphenylphosphine oxide and the like can also be suitably used as the acylphosphine oxide. Further, as a commercially available acylphosphine oxide initiator, Omnirad TPO H and the like can be mentioned.
  • ⁇ -hydroxyketone initiators examples include Omnirad 184, Omnirad 1173, Omnirad 2959, Omnirad 127 (manufactured by IGM Resins B.V.), IRGACURE 184 (IRGACURE is a registered trademark), DAROCUR 1173, IRGACURE 500, IRGACURE -2959 and IRGACURE 127 (manufactured by BASF) can be used.
  • ⁇ -aminoketone initiators examples include Omnirad 907, Omnirad 369, Omnirad 369E, Omnirad 379EG (manufactured by IGM Resins B.V.), IRGACURE 907, and IRGACURE 3. 69, and IRGACURE 379 (manufactured by BASF) can be used.
  • aminoacetophenone initiator the acylphosphine oxide initiator, and the metallocene compound, for example, the compounds described in paragraphs 0161 to 0163 of International Publication No. 2021/112189 can also be suitably used. This content is incorporated herein.
  • photoradical polymerization initiator include oxime compounds.
  • an oxime compound By using an oxime compound, it becomes possible to improve exposure latitude more effectively.
  • Oxime compounds are particularly preferred because they have a wide exposure latitude (exposure margin) and also act as photocuring accelerators.
  • oxime compounds include compounds described in JP-A-2001-233842, compounds described in JP-A 2000-080068, compounds described in JP-A 2006-342166, J. C. S. Perkin II (1979, pp. 1653-1660); C. S. Perkin II (1979, pp. 156-162), Journal of Photopolymer Science and Technology (1995, pp. 202-232), JP-A-2000 - Compounds described in Publication No. 066385, Compounds described in Japanese Patent Publication No. 2004-534797, compounds described in Japanese Patent Application Publication No. 2017-019766, compounds described in Patent No. 6065596, compounds described in International Publication No. 2015/152153, International Publication No.
  • Preferred oxime compounds include, for example, compounds with the following structures, 3-(benzoyloxy(imino))butan-2-one, 3-(acetoxy(imino))butan-2-one, 3-(propionyloxy( imino))butan-2-one, 2-(acetoxy(imino))pentan-3-one, 2-(acetoxy(imino))-1-phenylpropan-1-one, 2-(benzoyloxy(imino)) -1-phenylpropan-1-one, 3-((4-toluenesulfonyloxy)imino)butan-2-one, 2-(ethoxycarbonyloxy(imino))-1-phenylpropan-1-one, 5- Examples include (4-isopropylphenylthio)-1,2-indanedione and 2-(O-acetyl)oxime.
  • oxime compounds include IRGACURE OXE 01, IRGACURE OXE 02, IRGACURE OXE 03, IRGACURE OXE 04 (manufactured by BASF), Omnirad 1312 (manufactured by IGM Resins B.V.), and Adeka Optomer N- 1919 (manufactured by ADEKA Co., Ltd., photoradical polymerization initiator 2 described in JP-A-2012-014052), TR-PBG-304, TR-PBG-305 (manufactured by Changzhou Strong Electronics New Materials Co., Ltd.), ADEKA Arcles Examples include NCI-730, NCI-831, ADEKA Arkles NCI-930 (manufactured by ADEKA Co., Ltd.), DFI-091 (manufactured by Daito Chemix Co., Ltd.), and SpeedCure PDO (manufactured by SARTOMER ARKEMA). Moreover, oxime compounds having the following structures can also be
  • Examples of the photoradical polymerization initiator include oxime compounds having a fluorene ring described in paragraphs 0169 to 0171 of International Publication No. 2021/112189, and oximes having a skeleton in which at least one benzene ring of a carbazole ring is a naphthalene ring.
  • Compounds, oxime compounds having a fluorine atom can also be used.
  • oxime compounds having a nitro group, oxime compounds having a benzofuran skeleton, and oxime compounds having a substituent having a hydroxy group bonded to a carbazole skeleton described in paragraphs 0208 to 0210 of International Publication No. 2021/020359 can also be used. . Their contents are incorporated herein.
  • oxime compound OX an oxime compound having an aromatic ring group Ar OX1 (hereinafter also referred to as oxime compound OX) in which an electron-withdrawing group is introduced into the aromatic ring.
  • Examples of the electron-withdrawing group possessed by the aromatic ring group Ar OX1 include an acyl group, a nitro group, a trifluoromethyl group, an alkylsulfinyl group, an arylsulfinyl group, an alkylsulfonyl group, an arylsulfonyl group, and a cyano group,
  • An acyl group and a nitro group are preferred, an acyl group is more preferred because a film with excellent light resistance can be easily formed, and a benzoyl group is even more preferred.
  • the benzoyl group may have a substituent.
  • substituents include halogen atoms, cyano groups, nitro groups, hydroxy groups, alkyl groups, alkoxy groups, aryl groups, aryloxy groups, heterocyclic groups, heterocyclic oxy groups, alkenyl groups, alkylsulfanyl groups, arylsulfanyl groups, It is preferably an acyl group or an amino group, and more preferably an alkyl group, an alkoxy group, an aryl group, an aryloxy group, a heterocyclicoxy group, an alkylsulfanyl group, an arylsulfanyl group, or an amino group. More preferably, it is a sulfanyl group or an amino group.
  • the oxime compound OX is preferably at least one selected from a compound represented by formula (OX1) and a compound represented by formula (OX2), and more preferably a compound represented by formula (OX2). preferable.
  • R X3 to R X14 each independently represent a hydrogen atom or a substituent. However, at least one of R X10 to R X14 is an electron-withdrawing group.
  • R X12 is preferably an electron-withdrawing group
  • R X10 , R X11 , R X13 , and R X14 are preferably hydrogen atoms.
  • oxime compound OX examples include compounds described in paragraph numbers 0083 to 0105 of Japanese Patent No. 4,600,600, the contents of which are incorporated herein.
  • Particularly preferable oxime compounds include oxime compounds having a specific substituent group as shown in JP-A No. 2007-269779, and oxime compounds having a thioaryl group as shown in JP-A No. 2009-191061. Incorporated herein.
  • photoradical polymerization initiators include trihalomethyltriazine compounds, benzyl dimethyl ketal compounds, ⁇ -hydroxyketone compounds, ⁇ -aminoketone compounds, acylphosphine compounds, phosphine oxide compounds, metallocene compounds, oxime compounds, and triaryl compounds. selected from the group consisting of imidazole dimers, onium salt compounds, benzothiazole compounds, benzophenone compounds, acetophenone compounds and derivatives thereof, cyclopentadiene-benzene-iron complexes and salts thereof, halomethyloxadiazole compounds, and 3-aryl substituted coumarin compounds.
  • Compounds such as
  • the photoradical polymerization initiator is a trihalomethyltriazine compound, an ⁇ -aminoketone compound, an acylphosphine compound, a phosphine oxide compound, a metallocene compound, an oxime compound, a triarylimidazole dimer, an onium salt compound, a benzophenone compound, an acetophenone compound, At least one compound selected from the group consisting of trihalomethyltriazine compounds, ⁇ -aminoketone compounds, metallocene compounds, oxime compounds, triarylimidazole dimers, and benzophenone compounds is more preferred, and metallocene compounds or oxime compounds are even more preferred.
  • a difunctional, trifunctional or more functional photoradical polymerization initiator may be used as the photoradical polymerization initiator.
  • a radical photopolymerization initiator two or more radicals are generated from one molecule of the radical photopolymerization initiator, so that good sensitivity can be obtained.
  • the crystallinity decreases and the solubility in solvents improves, making it difficult to precipitate over time, thereby improving the stability of the resin composition over time.
  • Specific examples of bifunctional or trifunctional or more functional photoradical polymerization initiators include those listed in Japanese Patent Publication No. 2010-527339, Japanese Patent Publication No. 2011-524436, International Publication No.
  • the resin composition contains a photopolymerization initiator
  • its content is preferably 0.1 to 30% by mass, more preferably 0.1 to 20% by mass, and 0.5% by mass based on the total solid content of the resin composition. It is more preferably from 1.0 to 10% by weight, and even more preferably from 1.0 to 10% by weight.
  • the photopolymerization initiator may contain only one type, or may contain two or more types. When containing two or more types of photopolymerization initiators, it is preferable that the total amount is within the above range. Note that since the photopolymerization initiator may also function as a thermal polymerization initiator, crosslinking by the photopolymerization initiator may be further promoted by heating with an oven, a hot plate, or the like.
  • the resin composition may contain a sensitizer.
  • the sensitizer absorbs specific actinic radiation and becomes electronically excited.
  • the sensitizer in an electronically excited state comes into contact with a thermal radical polymerization initiator, a photoradical polymerization initiator, etc., and effects such as electron transfer, energy transfer, and heat generation occur.
  • the thermal radical polymerization initiator and the photo radical polymerization initiator undergo a chemical change and are decomposed to generate radicals, acids, or bases.
  • Usable sensitizers include benzophenone series, Michler's ketone series, coumarin series, pyrazole azo series, anilinoazo series, triphenylmethane series, anthraquinone series, anthracene series, anthrapyridone series, benzylidene series, oxonol series, and pyrazolotriazole azo series.
  • pyridone azo type cyanine type, phenothiazine type, pyrrolopyrazole azomethine type, xanthene type, phthalocyanine type, benzopyran type, indigo type, and other compounds can be used.
  • sensitizer examples include Michler's ketone, 4,4'-bis(diethylamino)benzophenone, 2,5-bis(4'-diethylaminobenzal)cyclopentane, 2,6-bis(4'-diethylaminobenzal) Cyclohexanone, 2,6-bis(4'-diethylaminobenzal)-4-methylcyclohexanone, 4,4'-bis(dimethylamino)chalcone, 4,4'-bis(diethylamino)chalcone, p-dimethylaminocinnamyl Denindanone, p-dimethylaminobenzylideneindanone, 2-(p-dimethylaminophenylbiphenylene)-benzothiazole, 2-(p-dimethylaminophenylvinylene)benzothiazole, 2-(p-dimethylaminophenylvinylene)iso Naphthothiazole, 1,3-
  • the content of the sensitizer is preferably 0.01 to 20% by mass, more preferably 0.1 to 15% by mass, based on the total solid content of the resin composition. More preferably 0.5 to 10% by mass.
  • the sensitizers may be used alone or in combination of two or more.
  • the resin composition of the present invention may contain a chain transfer agent.
  • Chain transfer agents are defined, for example, in the Polymer Dictionary, 3rd edition (edited by the Society of Polymer Science, 2005), pages 683-684.
  • Examples of chain transfer agents include compounds having -S-S-, -SO 2 -S-, -N-O-, SH, PH, SiH, and GeH in the molecule, and RAFT (Reversible Addition Fragmentation chain Transfer).
  • Dithiobenzoate, trithiocarbonate, dithiocarbamate, xanthate compounds and the like having a thiocarbonylthio group used in polymerization are used. These can generate radicals by donating hydrogen to low-activity radicals, or can generate radicals by being oxidized and then deprotonated.
  • thiol compounds can be preferably used.
  • the content of the chain transfer agent is preferably 0.01 to 20 parts by mass, and 0.1 to 10 parts by mass based on 100 parts by mass of the total solid content of the resin composition. More preferably, 0.5 to 5 parts by mass is even more preferred.
  • the number of chain transfer agents may be one, or two or more. When there are two or more types of chain transfer agents, it is preferable that the total is within the above range.
  • the resin composition of the present invention may also contain a base generator.
  • the base generator is a compound that can generate a base by physical or chemical action.
  • Preferred base generators include thermal base generators and photobase generators.
  • the resin composition contains a thermal base generator, the cyclization reaction of the precursor can be promoted by heating, for example, and the cured product has good mechanical properties and chemical resistance. The performance as an interlayer insulating film for wiring layers is improved.
  • the base generator may be an ionic base generator or a nonionic base generator. Examples of the base generated from the base generator include secondary amines and tertiary amines.
  • the base generator is not particularly limited, and any known base generator can be used.
  • Known base generators include, for example, carbamoyloxime compounds, carbamoylhydroxylamine compounds, carbamic acid compounds, formamide compounds, acetamide compounds, carbamate compounds, benzyl carbamate compounds, nitrobenzyl carbamate compounds, sulfonamide compounds, imidazole derivative compounds, and amine imides. compounds, pyridine derivative compounds, ⁇ -aminoacetophenone derivative compounds, quaternary ammonium salt derivative compounds, iminium salts, pyridinium salts, ⁇ -lactone ring derivative compounds, amine imide compounds, phthalimide derivative compounds, acyloxyimino compounds, and the like.
  • Specific examples of the nonionic base generator include compounds represented by formula (B1), formula (B2), or formula (B3).
  • Rb 1 , Rb 2 and Rb 3 each independently represent an organic group having no tertiary amine structure, a halogen atom or a hydrogen atom. However, Rb 1 and Rb 2 do not become hydrogen atoms at the same time. Moreover, none of Rb 1 , Rb 2 and Rb 3 has a carboxy group.
  • the tertiary amine structure refers to a structure in which all three bonds of a trivalent nitrogen atom are covalently bonded to a carbon atom of a hydrocarbon group. Therefore, when the carbon atom bonded to the trivalent nitrogen atom is a carbon atom constituting a carbonyl group, that is, when it forms an amide group with the nitrogen atom, it is not a tertiary amine structure.
  • Rb 1 , Rb 2 and Rb 3 preferably contains a cyclic structure, and more preferably at least two of them contain a cyclic structure.
  • the cyclic structure may be either a single ring or a condensed ring, and preferably a monocycle or a condensed ring in which two monocycles are condensed.
  • the monocyclic ring is preferably a 5-membered ring or a 6-membered ring, more preferably a 6-membered ring.
  • the monocyclic ring is preferably a cyclohexane ring or a benzene ring, and more preferably a cyclohexane ring.
  • Rb 1 and Rb 2 are a hydrogen atom, an alkyl group (preferably 1 to 24 carbon atoms, more preferably 2 to 18 carbon atoms, even more preferably 3 to 12 carbon atoms), an alkenyl group (preferably 2 to 24 carbon atoms). , more preferably 2 to 18, still more preferably 3 to 12), an aryl group (preferably 6 to 22 carbon atoms, more preferably 6 to 18 carbon atoms, even more preferably 6 to 10 carbon atoms), or an arylalkyl group (carbon atoms 7 -25 is preferred, 7-19 is more preferred, and 7-12 is even more preferred). These groups may have a substituent.
  • Rb 1 and Rb 2 may be bonded to each other to form a ring.
  • the ring formed is preferably a 4- to 7-membered nitrogen-containing heterocycle.
  • Rb 1 and Rb 2 are linear, branched, or cyclic alkyl groups (preferably 1 to 24 carbon atoms, more preferably 2 to 18 carbon atoms, still more preferably 3 to 12 carbon atoms) that may have a substituent. is preferable, and is more preferably a cycloalkyl group (having preferably 3 to 24 carbon atoms, more preferably 3 to 18 carbon atoms, and even more preferably 3 to 12 carbon atoms) which may have a substituent, and has a substituent. Further preferred is a cyclohexyl group which may be optionally substituted.
  • Rb 3 is an alkyl group (preferably 1 to 24 carbon atoms, more preferably 2 to 18 carbon atoms, even more preferably 3 to 12 carbon atoms), an aryl group (preferably 6 to 22 carbon atoms, more preferably 6 to 18 carbon atoms, 6 -10 are more preferred), alkenyl groups (preferably 2-24 carbon atoms, more preferably 2-12 carbon atoms, even more preferably 2-6 carbon atoms), arylalkyl groups (preferably 7-23 carbon atoms, more preferably 7-19 carbon atoms), (preferably 7 to 12 carbon atoms), arylalkenyl group (preferably 8 to 24 carbon atoms, more preferably 8 to 20 carbon atoms, even more preferably 8 to 16 carbon atoms), alkoxyl group (preferably 1 to 24 carbon atoms, 2 to 16 carbon atoms) 18 is more preferable, 3 to 12 are even more preferable), an aryloxy group (preferably 6 to 22 carbon atoms, more preferably 6 to 18 carbon atoms, even
  • cycloalkyl groups preferably having 3 to 24 carbon atoms, more preferably 3 to 18 carbon atoms, still more preferably 3 to 12 carbon atoms
  • arylalkenyl groups preferably 3 to 12 carbon atoms
  • arylalkyloxy groups are preferable.
  • Rb 3 may further have a substituent.
  • the compound represented by formula (B1) is preferably a compound represented by formula (B1-1) or (B1-2) below.
  • Rb 11 and Rb 12 and Rb 31 and Rb 32 are the same as Rb 1 and Rb 2 in Formula (B1), respectively.
  • Rb 13 is an alkyl group (preferably 1 to 24 carbon atoms, more preferably 2 to 18 carbon atoms, even more preferably 3 to 12 carbon atoms), an alkenyl group (preferably 2 to 24 carbon atoms, more preferably 2 to 18 carbon atoms, 3 to 12 carbon atoms) is more preferable), an aryl group (preferably has 6 to 22 carbon atoms, more preferably 6 to 18 carbon atoms, even more preferably 6 to 12 carbon atoms), an arylalkyl group (preferably has 7 to 23 carbon atoms, more preferably 7 to 19 carbon atoms), 7 to 12 are more preferred) and may have a substituent.
  • Rb 13 is preferably an arylalkyl group.
  • Rb 33 and Rb 34 each independently represent a hydrogen atom, an alkyl group (preferably 1 to 12 carbon atoms, more preferably 1 to 8 carbon atoms, even more preferably 1 to 3 carbon atoms), or an alkenyl group (preferably 2 to 12 carbon atoms). , more preferably 2 to 8, still more preferably 2 to 3), aryl group (preferably 6 to 22 carbon atoms, more preferably 6 to 18 carbon atoms, even more preferably 6 to 10 carbon atoms), arylalkyl group (carbon atoms 7 to 10), 23 is preferred, 7 to 19 are more preferred, and 7 to 11 are even more preferred), and a hydrogen atom is preferred.
  • Rb 35 is an alkyl group (preferably 1 to 24 carbon atoms, more preferably 1 to 12 carbon atoms, even more preferably 3 to 8 carbon atoms), an alkenyl group (preferably 2 to 12 carbon atoms, more preferably 2 to 10 carbon atoms, 3 to 10 carbon atoms) (more preferably 8), aryl group (preferably 6 to 22 carbon atoms, more preferably 6 to 18 carbon atoms, even more preferably 6 to 12 carbon atoms), arylalkyl group (preferably 7 to 23 carbon atoms, more preferably 7 to 19 carbon atoms) , 7 to 12 are more preferred), and an aryl group is preferred.
  • an alkyl group preferably 1 to 24 carbon atoms, more preferably 1 to 12 carbon atoms, even more preferably 3 to 8 carbon atoms
  • an alkenyl group preferably 2 to 12 carbon atoms, more preferably 2 to 10 carbon atoms, 3 to 10 carbon atoms
  • aryl group preferably 6 to 22 carbon
  • the compound represented by formula (B1-1) is preferably a compound represented by formula (B1-1a).
  • Rb 11 and Rb 12 have the same meanings as Rb 11 and Rb 12 in formula (B1-1).
  • Rb 15 and Rb 16 are hydrogen atoms, alkyl groups (preferably 1 to 12 carbon atoms, more preferably 1 to 6 carbon atoms, even more preferably 1 to 3 carbon atoms), alkenyl groups (preferably 2 to 12 carbon atoms, 2 to 6 carbon atoms) more preferably 2 to 3 carbon atoms), aryl group (preferably 6 to 22 carbon atoms, more preferably 6 to 18 carbon atoms, even more preferably 6 to 10 carbon atoms), arylalkyl group (preferably 7 to 23 carbon atoms, 7 carbon atoms to 19 are more preferable, and 7 to 11 are even more preferable), and a hydrogen atom or a methyl group is preferable.
  • Rb 17 is an alkyl group (preferably 1 to 24 carbon atoms, more preferably 1 to 12 carbon atoms, even more preferably 3 to 8 carbon atoms), an alkenyl group (preferably 2 to 12 carbon atoms, more preferably 2 to 10 carbon atoms, 3 to 8 carbon atoms) is more preferable), an aryl group (preferably has 6 to 22 carbon atoms, more preferably 6 to 18 carbon atoms, even more preferably 6 to 12 carbon atoms), an arylalkyl group (preferably has 7 to 23 carbon atoms, more preferably 7 to 19 carbon atoms), 7 to 12 are more preferred), and aryl groups are particularly preferred.
  • an alkyl group preferably 1 to 24 carbon atoms, more preferably 1 to 12 carbon atoms, even more preferably 3 to 8 carbon atoms
  • an alkenyl group preferably 2 to 12 carbon atoms, more preferably 2 to 10 carbon atoms, 3 to 8 carbon atoms
  • an aryl group preferably has 6 to
  • L is a divalent hydrocarbon group having a saturated hydrocarbon group on the path of a connecting chain connecting adjacent oxygen atoms and carbon atoms, and the number of atoms on the path of the connecting chain is Represents a hydrocarbon group of 3 or more.
  • R N1 and R N2 each independently represent a monovalent organic group.
  • connection chain refers to an atomic chain on a path connecting two atoms or atomic groups to be connected, which connects these objects in the shortest possible length (minimum number of atoms).
  • L is composed of a phenylene ethylene group, has an ethylene group as a saturated hydrocarbon group
  • the connecting chain is composed of four carbon atoms
  • the path of the connecting chain is The number of atoms (that is, the number of atoms constituting the connected chain, hereinafter also referred to as "connected chain length" or "connected chain length”) is 4.
  • the number of carbon atoms in L in formula (B3) is preferably 3 to 24.
  • the upper limit is more preferably 12 or less, even more preferably 10 or less, and particularly preferably 8 or less.
  • the lower limit is more preferably 4 or more.
  • the upper limit of the length of the linking chain of L is preferably 12 or less, more preferably 8 or less, even more preferably 6 or less, and 5 The following is particularly preferable.
  • the chain length of L is preferably 4 or 5, most preferably 4.
  • Specific preferred compounds of the base generator include, for example, the compounds described in paragraph numbers 0102 to 0168 of WO 2020/066416, and the compounds described in paragraph numbers 0143 to 0177 of WO 2018/038002. Can be mentioned.
  • the base generator contains a compound represented by the following formula (N1).
  • R N1 and R N2 each independently represent a monovalent organic group
  • R C1 represents a hydrogen atom or a protecting group
  • L represents a divalent linking group
  • L is a divalent linking group, preferably a divalent organic group.
  • the linking chain length of the linking group is preferably 1 or more, more preferably 2 or more.
  • the upper limit is preferably 12 or less, more preferably 8 or less, and even more preferably 5 or less.
  • the linking chain length is the number of atoms present in the atomic arrangement that provides the shortest path between two carbonyl groups in the formula.
  • R N1 and R N2 each independently represent a monovalent organic group (preferably 1 to 24 carbon atoms, more preferably 2 to 18 carbon atoms, and even more preferably 3 to 12 carbon atoms), and a hydrocarbon group ( It is preferably an aliphatic hydrocarbon group (having preferably 1 to 24 carbon atoms, more preferably 1 to 12 carbon atoms, and even more preferably 1 to 10 carbon atoms), specifically an aliphatic hydrocarbon group (preferably having 1 to 24 carbon atoms, 1 to 12 carbon atoms). is more preferable, and 1 to 10 are still more preferable); Groups are preferred. It is preferable to use aliphatic hydrocarbon groups as R N1 and R N2 because the generated base has high basicity.
  • the aliphatic hydrocarbon group and the aromatic hydrocarbon group may have a substituent
  • the aliphatic hydrocarbon group and the aromatic hydrocarbon group may have substituents in the aliphatic hydrocarbon chain or aromatic ring
  • the substituent may have an oxygen atom.
  • an embodiment in which the aliphatic hydrocarbon group has an oxygen atom in the hydrocarbon chain is exemplified.
  • Examples of the aliphatic hydrocarbon group constituting R N1 and R N2 include a straight or branched chain alkyl group, a cyclic alkyl group, a group containing a combination of a chain alkyl group and a cyclic alkyl group, and a group containing an oxygen atom in the chain.
  • Examples include alkyl groups having .
  • the linear or branched chain alkyl group preferably has 1 to 24 carbon atoms, more preferably 2 to 18 carbon atoms, and even more preferably 3 to 12 carbon atoms.
  • Straight chain or branched chain alkyl groups include, for example, methyl group, ethyl group, propyl group, butyl group, pentyl group, hexyl group, heptyl group, octyl group, nonyl group, decyl group, undecyl group, dodecyl group, isopropyl group. group, isobutyl group, secondary butyl group, tertiary butyl group, isopentyl group, neopentyl group, tertiary pentyl group, isohexyl group, and the like.
  • the cyclic alkyl group preferably has 3 to 12 carbon atoms, more preferably 3 to 6 carbon atoms.
  • cyclic alkyl group examples include a cyclopropyl group, a cyclobutyl group, a cyclopentyl group, a cyclohexyl group, and a cyclooctyl group.
  • the group containing a combination of a chain alkyl group and a cyclic alkyl group preferably has 4 to 24 carbon atoms, more preferably 4 to 18 carbon atoms, and even more preferably 4 to 12 carbon atoms.
  • Examples of the group containing a combination of a chain alkyl group and a cyclic alkyl group include a cyclohexylmethyl group, a cyclohexylethyl group, a cyclohexylpropyl group, a methylcyclohexylmethyl group, and an ethylcyclohexylethyl group.
  • the alkyl group having an oxygen atom in the chain preferably has 2 to 12 carbon atoms, more preferably 2 to 6 carbon atoms, and even more preferably 2 to 4 carbon atoms.
  • the alkyl group having an oxygen atom in the chain may be linear or cyclic, linear or branched.
  • R N1 and R N2 are preferably alkyl groups having 5 to 12 carbon atoms, from the viewpoint of increasing the boiling point of the decomposition product base described below.
  • a group having a cyclic alkyl group or an alkyl group having 1 to 8 carbon atoms is preferable.
  • R N1 and R N2 may be connected to each other to form a cyclic structure.
  • the cyclic structure may have an oxygen atom or the like in the chain.
  • the cyclic structure formed by R N1 and R N2 may be a monocyclic ring or a condensed ring, but a monocyclic ring is preferable.
  • the cyclic structure formed is preferably a 5-membered ring or a 6-membered ring containing a nitrogen atom in formula (N1), such as a pyrrole ring, an imidazole ring, a pyrazole ring, a pyrroline ring, a pyrrolidine ring, an imidazolidine ring, Examples include a pyrazolidine ring, a piperidine ring, a piperazine ring, a morpholine ring, and preferred examples include a pyrroline ring, a pyrrolidine ring, a piperidine ring, a piperazine ring, and a morpholine ring.
  • R C1 represents a hydrogen atom or a protective group, and preferably a hydrogen atom.
  • the protecting group a protecting group that is decomposed by the action of an acid or a base is preferable, and a protecting group that is decomposed by an acid is preferably mentioned.
  • Specific examples of the protecting group include a chain or cyclic alkyl group or a chain or cyclic alkyl group having an oxygen atom in the chain. Examples of the chain or cyclic alkyl group include methyl group, ethyl group, isopropyl group, tert-butyl group, and cyclohexyl group.
  • Examples of the chain alkyl group having an oxygen atom in the chain include an alkyloxyalkyl group, and methyloxymethyl (MOM) group, ethyloxyethyl (EE) group, etc. are preferable.
  • Examples of the cyclic alkyl group having an oxygen atom in the chain include an epoxy group, a glycidyl group, an oxetanyl group, a tetrahydrofuranyl group, and a tetrahydropyranyl (THP) group.
  • the divalent linking group constituting L is not particularly limited, but is preferably a hydrocarbon group, and more preferably an aliphatic hydrocarbon group.
  • the hydrocarbon group may have a substituent and may have atoms other than carbon atoms in the hydrocarbon chain.
  • the divalent linking group is more preferably a divalent hydrocarbon linking group that may have an oxygen atom in its chain, and a divalent aliphatic linking group that may have an oxygen atom in its chain.
  • the divalent hydrocarbon linking group preferably has 1 to 24 carbon atoms, more preferably 2 to 12 carbon atoms, and even more preferably 2 to 6 carbon atoms.
  • the divalent aliphatic hydrocarbon group preferably has 1 to 12 carbon atoms, more preferably 2 to 6 carbon atoms, and even more preferably 2 to 4 carbon atoms.
  • the divalent aromatic hydrocarbon group preferably has 6 to 22 carbon atoms, more preferably 6 to 18 carbon atoms, and even more preferably 6 to 10 carbon atoms.
  • the group containing a combination of a divalent aliphatic hydrocarbon group and a divalent aromatic hydrocarbon group preferably has 7 to 22 carbon atoms, more preferably 7 to 18 carbon atoms, and has 7 to 10 carbon atoms. is even more preferable.
  • the linking group L is a linear or branched chain alkylene group, a cyclic alkylene group, a group containing a combination of a chain alkylene group and a cyclic alkylene group, an alkylene group having an oxygen atom in the chain, or a straight chain alkylene group.
  • a chain or branched chain alkenylene group, a cyclic alkenylene group, an arylene group, and an arylene alkylene group are preferred.
  • the linear or branched chain alkylene group preferably has 1 to 12 carbon atoms, more preferably 2 to 6 carbon atoms, and even more preferably 2 to 4 carbon atoms.
  • the cyclic alkylene group preferably has 3 to 12 carbon atoms, more preferably 3 to 6 carbon atoms.
  • the group containing a combination of a chain alkylene group and a cyclic alkylene group preferably has 4 to 24 carbon atoms, more preferably 4 to 12 carbon atoms, and even more preferably 4 to 6 carbon atoms.
  • the alkylene group having an oxygen atom in the chain may be linear or cyclic, linear or branched.
  • the alkylene group having an oxygen atom in the chain preferably has 1 to 12 carbon atoms, more preferably 1 to 6 carbon atoms, and even more preferably 1 to 3 carbon atoms.
  • the linear or branched chain alkenylene group preferably has 2 to 12 carbon atoms, more preferably 2 to 6 carbon atoms, and even more preferably 2 to 3 carbon atoms.
  • the number of C ⁇ C bonds is preferably 1 to 10, more preferably 1 to 6, and even more preferably 1 to 3.
  • the cyclic alkenylene group preferably has 3 to 12 carbon atoms, more preferably 3 to 6 carbon atoms.
  • the number of C ⁇ C bonds in the cyclic alkenylene group is preferably 1 to 6, more preferably 1 to 4, and even more preferably 1 to 2.
  • the arylene group preferably has 6 to 22 carbon atoms, more preferably 6 to 18 carbon atoms, and even more preferably 6 to 10 carbon atoms.
  • the arylene alkylene group preferably has 7 to 23 carbon atoms, more preferably 7 to 19 carbon atoms, and even more preferably 7 to 11 carbon atoms.
  • linear alkylene groups, cyclic alkylene groups, alkylene groups having an oxygen atom in the chain, linear alkenylene groups, arylene groups, and arylene alkylene groups are preferred, and 1,2-ethylene groups, propanediyl groups (especially 1, 3-propanediyl group), cyclohexanediyl group (especially 1,2-cyclohexanediyl group), vinylene group (especially cisvinylene group), phenylene group (1,2-phenylene group), phenylenemethylene group (especially 1,2-phenylene group) methylene group) and ethyleneoxyethylene group (particularly 1,2-ethyleneoxy-1,2-ethylene group) are more preferred.
  • Examples of the base generator include, but are not limited to, the following compounds.
  • the molecular weight of the nonionic base generator is preferably 800 or less, more preferably 600 or less, and even more preferably 500 or less.
  • the lower limit is preferably 100 or more, more preferably 200 or more, and even more preferably 300 or more.
  • Specific preferred compounds of the ionic base generator include, for example, the compounds described in paragraph numbers 0148 to 0163 of International Publication No. 2018/038002.
  • ammonium salts include, but are not limited to, the following compounds.
  • iminium salts include, but are not limited to, the following compounds.
  • the content of the base generator is preferably 0.1 to 50 parts by weight based on 100 parts by weight of the resin in the resin composition.
  • the lower limit is more preferably 0.3 parts by mass or more, and even more preferably 0.5 parts by mass or more.
  • the upper limit is more preferably 30 parts by mass or less, even more preferably 20 parts by mass or less, even more preferably 10 parts by mass or less, even more preferably 5 parts by mass or less, and particularly preferably 4 parts by mass or less.
  • One type or two or more types of base generators can be used. When two or more types are used, the total amount is preferably within the above range.
  • the resin composition of the present invention preferably contains a solvent. Any known solvent can be used as the solvent.
  • the solvent is preferably an organic solvent. Examples of the organic solvent include compounds such as esters, ethers, ketones, cyclic hydrocarbons, sulfoxides, amides, ureas, and alcohols.
  • esters include ethyl acetate, n-butyl acetate, isobutyl acetate, hexyl acetate, amyl formate, isoamyl acetate, butyl propionate, isopropyl butyrate, ethyl butyrate, butyl butyrate, methyl lactate, ethyl lactate, ⁇ -butyrolactone.
  • alkyloxyacetate e.g., methyl alkyloxyacetate, ethyl alkyloxyacetate, butyl alkyloxyacetate (e.g., methyl methoxyacetate, ethyl methoxyacetate, butyl methoxyacetate, methyl ethoxyacetate, 3-alkyloxypropionate alkyl esters (e.g., methyl 3-alkyloxypropionate, ethyl 3-alkyloxypropionate, etc.), 3-alkyloxypropionate alkyl esters (e.g., methyl 3-methoxypropionate, 3-methoxypropionate), ethyl, methyl 3-ethoxypropionate, ethyl 3-ethoxypropionate, etc.), 2-alkyloxypropionate alkyl esters (e.g., methyl 2-alkyloxypropionate, ethyl), 2-alkyloxypropionate alkyl esters (e.g
  • ethers include ethylene glycol dimethyl ether, diethylene glycol dimethyl ether, diethylene glycol diethyl ether, diethylene glycol ethyl methyl ether, diethylene glycol butyl methyl ether, triethylene glycol dimethyl ether, tetraethylene glycol dimethyl ether, tetrahydrofuran, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, Methyl cellosolve acetate, ethyl cellosolve acetate, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol monobutyl ether, propylene glycol monomethyl ether, propylene glycol dimethyl ether, propylene glycol dimethyl ether, propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, ethylene glycol monobutyl ether, ethylene glycol Suitable examples include monobutyl ether acetate
  • Suitable ketones include, for example, methyl ethyl ketone, cyclohexanone, cyclopentanone, 2-heptanone, 3-heptanone, 3-methylcyclohexanone, levoglucosenone, dihydrolevoglucosenone, and the like.
  • Suitable examples of cyclic hydrocarbons include aromatic hydrocarbons such as toluene, xylene, and anisole, and cyclic terpenes such as limonene.
  • Suitable examples of sulfoxides include dimethyl sulfoxide.
  • Amides include N-methyl-2-pyrrolidone, N-ethyl-2-pyrrolidone, N-cyclohexyl-2-pyrrolidone, N,N-dimethylacetamide, N,N-dimethylformamide, N,N-dimethylisobutyramide, Preferred examples include 3-methoxy-N,N-dimethylpropionamide, 3-butoxy-N,N-dimethylpropionamide, N-formylmorpholine, and N-acetylmorpholine.
  • Suitable ureas include N,N,N',N'-tetramethylurea, 1,3-dimethyl-2-imidazolidinone, and the like.
  • Alcohols include methanol, ethanol, 1-propanol, 2-propanol, 1-butanol, 1-pentanol, 1-hexanol, benzyl alcohol, ethylene glycol monomethyl ether, 1-methoxy-2-propanol, 2-ethoxyethanol, Diethylene glycol monoethyl ether, diethylene glycol monohexyl ether, triethylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol monomethyl ether, polyethylene glycol monomethyl ether, polypropylene glycol, tetraethylene glycol, ethylene glycol monobutyl ether, ethylene glycol monobenzyl ether, Examples include ethylene glycol monophenyl ether, methylphenyl carbinol, n-amyl alcohol, methyl amyl alcohol, and diacetone alcohol.
  • the content of the solvent is preferably such that the total solids concentration of the resin composition of the present invention is 5 to 80% by mass, and preferably 5 to 75% by mass. More preferably, the amount is 10 to 70% by mass, and even more preferably 20 to 70% by mass.
  • the solvent content may be adjusted depending on the desired thickness of the coating and the application method. When two or more types of solvents are contained, it is preferable that the total amount is within the above range.
  • the resin composition of the present invention preferably contains a metal adhesion improver from the viewpoint of improving adhesion to metal materials used for electrodes, wiring, etc.
  • metal adhesion improvers include silane coupling agents having alkoxysilyl groups, aluminum adhesion aids, titanium adhesion aids, compounds having a sulfonamide structure and thiourea structure, phosphoric acid derivative compounds, and ⁇ -keto esters. compounds, amino compounds, etc.
  • silane coupling agent examples include the compounds described in paragraph 0316 of International Publication No. 2021/112189 and the compounds described in paragraphs 0067 to 0078 of JP 2018-173573, the contents of which are not included herein. Incorporated. Furthermore, it is also preferable to use two or more different silane coupling agents as described in paragraphs 0050 to 0058 of JP-A-2011-128358. It is also preferable to use the following compounds as the silane coupling agent. In the following formula, Me represents a methyl group and Et represents an ethyl group. Further, the following R may be a structure derived from a blocking agent in a blocked isocyanate group.
  • the blocking agent may be selected depending on the desorption temperature, and includes alcohol compounds, phenol compounds, pyrazole compounds, triazole compounds, lactam compounds, active methylene compounds, and the like. For example, from the viewpoint of desiring a desorption temperature of 160 to 180°C, caprolactam and the like are preferred. Commercially available products of such compounds include X-12-1293 (manufactured by Shin-Etsu Chemical Co., Ltd.).
  • silane coupling agents examples include vinyltrimethoxysilane, vinyltriethoxysilane, 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, and 3-glycidoxypropylmethyldimethoxysilane.
  • an oligomer type compound having a plurality of alkoxysilyl groups can also be used as the silane coupling agent.
  • examples of such oligomer type compounds include compounds containing a repeating unit represented by the following formula (S-1).
  • R S1 represents a monovalent organic group
  • R S2 represents a hydrogen atom, a hydroxy group, or an alkoxy group
  • n represents an integer of 0 to 2.
  • R S1 preferably has a structure containing a polymerizable group.
  • Examples of the polymerizable group include a group having an ethylenically unsaturated bond, an epoxy group, an oxetanyl group, a benzoxazolyl group, a blocked isocyanate group, and an amino group.
  • Examples of the group having an ethylenically unsaturated bond include a vinyl group, an allyl group, an isoallyl group, a 2-methylallyl group, a group having an aromatic ring directly bonded to a vinyl group (for example, a vinyl phenyl group, etc.), and a (meth)acrylamide group.
  • R S2 is preferably an alkoxy group, more preferably a methoxy group or an ethoxy group.
  • n represents an integer from 0 to 2, preferably 1.
  • n is 1 or 2 in at least one of the plurality of repeating units represented by formula (S-1) contained in the oligomer type compound, and n is 1 or 2 in at least two. More preferably, n is 2, and even more preferably n is 1 in at least two cases.
  • Commercially available products can be used as such oligomer type compounds, and examples of commercially available products include KR-513 (manufactured by Shin-Etsu Chemical Co., Ltd.).
  • Aluminum-based adhesion aid examples include aluminum tris (ethyl acetoacetate), aluminum tris (acetylacetonate), ethylacetoacetate aluminum diisopropylate, and the like.
  • the content of the metal adhesion improver is preferably 0.01 to 30 parts by weight, more preferably 0.1 to 10 parts by weight, and even more preferably 0.5 to 5 parts by weight, based on 100 parts by weight of the specific resin.
  • the content of the metal adhesion improver is preferably 0.01 to 30 parts by weight, more preferably 0.1 to 10 parts by weight, and even more preferably 0.5 to 5 parts by weight, based on 100 parts by weight of the specific resin.
  • the resin composition of the present invention further contains a migration inhibitor.
  • a migration inhibitor for example, when a resin composition is applied to a metal layer (or metal wiring) to form a film, metal ions derived from the metal layer (or metal wiring) may migrate into the film. can be effectively suppressed.
  • Migration inhibitors are not particularly limited, but include heterocycles (pyrrole ring, furan ring, thiophene ring, imidazole ring, oxazole ring, thiazole ring, pyrazole ring, isoxazole ring, isothiazole ring, tetrazole ring, pyridine ring, pyridazine ring, pyrimidine ring, pyrazine ring, piperidine ring, piperazine ring, morpholine ring, 2H-pyran ring, 6H-pyran ring, triazine ring), compounds having thioureas and sulfanyl groups, hindered phenol compounds , salicylic acid derivative compounds, and hydrazide derivative compounds.
  • heterocycles pyrrole ring, furan ring, thiophene ring, imidazole ring, oxazole ring, thiazole ring, pyrazole ring
  • the resin composition further contains a compound having an azole structure.
  • the azole structure refers to a five-membered ring structure containing a nitrogen atom as a ring member, and preferably a five-membered ring structure containing two or more nitrogen atoms as a ring member.
  • examples of the azole structure include an imidazole structure, a triazole structure, and a tetrazole structure. These structures may form a polycyclic ring by condensation with other ring structures, such as benzimidazole and benzotriazole.
  • a compound in which a group represented by the following formula (R-1) or the following formula (R-2) is directly bonded to the azole structure is preferable.
  • R 1 represents a monovalent organic group
  • * represents a bonding site with an azole structure.
  • R 2 represents a hydrogen atom or a monovalent organic group
  • R 3 represents a monovalent organic group
  • * represents a bonding site with an azole structure.
  • a group represented by a bond with at least one group selected from the group consisting of - is preferable.
  • R N is as described above.
  • the hydrocarbon group is preferably an aliphatic hydrocarbon group, an aromatic hydrocarbon group, or a combination thereof.
  • the total number of carbon atoms in R 1 is preferably 1 to 30, preferably 2 to 25, and more preferably 3 to 20.
  • the bonding site in R 1 with the carbonyl group in formula (R-1) is preferably a hydrocarbon group or -NR N -.
  • * represents a bonding site with an azole structure, and is preferably a bonding site with a carbon atom that is a ring member of the azole structure.
  • R 2 is preferably a hydrogen atom.
  • R 2 is a monovalent organic group
  • R N is as described above.
  • the hydrocarbon group is preferably an aliphatic hydrocarbon group, an aromatic hydrocarbon group, or a combination thereof.
  • the total number of carbon atoms is preferably 1 to 30, preferably 2 to 25, and more preferably 3 to 20.
  • R 2 is a monovalent organic group
  • a group represented by a bond with at least one group selected from the group consisting of - is preferable.
  • R N is as described above.
  • the hydrocarbon group is preferably an aliphatic hydrocarbon group, an aromatic hydrocarbon group, or a combination thereof.
  • R 3 when R 3 is a monovalent organic group, the total number of carbon atoms is preferably 1 to 30, preferably 2 to 25, and more preferably 3 to 20.
  • * represents a bonding site with an azole structure, and is preferably a bonding site with a carbon atom that is a ring member of the azole structure.
  • an ion trapping agent that traps anions such as halogen ions can also be used.
  • Other migration inhibitors include, for example, the rust inhibitors described in paragraph 0094 of JP-A No. 2013-015701, and the rust inhibitors described in paragraphs 0073 to 0076 of JP-A-2009-283711.
  • migration inhibitors include the following compounds.
  • the content of the migration inhibitor is preferably 0.01 to 5.0% by mass, and 0.01 to 5.0% by mass based on the total solid content of the resin composition.
  • the amount is more preferably 0.05 to 2.0% by weight, and even more preferably 0.1 to 1.0% by weight.
  • Only one type of migration inhibitor may be used, or two or more types may be used. When there are two or more types of migration inhibitors, it is preferable that the total is within the above range.
  • the resin composition of the present invention contains a polymerization inhibitor.
  • the polymerization inhibitor include phenolic compounds, quinone compounds, amino compounds, N-oxyl free radical compounds, nitro compounds, nitroso compounds, heteroaromatic compounds, and metal compounds.
  • Specific compounds of the polymerization inhibitor include the compound described in paragraph 0310 of International Publication No. 2021/112189, p-hydroquinone, o-hydroquinone, 4-hydroxy-2,2,6,6-tetramethylpiperidine 1- Examples include oxyl free radical and phenoxazine. This content is incorporated herein.
  • the content of the polymerization inhibitor is preferably 0.01 to 20% by mass, and 0.02 to 20% by mass based on the total solid content of the resin composition. It is more preferably 15% by mass, and even more preferably 0.05 to 10% by mass.
  • Only one type of polymerization inhibitor may be used, or two or more types may be used. When there are two or more types of polymerization inhibitors, it is preferable that the total is within the above range.
  • the resin composition of the present invention may optionally contain various additives, such as surfactants, higher fatty acid derivatives, thermal polymerization initiators, inorganic particles, ultraviolet absorbers, It may contain organic titanium compounds, antioxidants, anti-aggregation agents, phenolic compounds, other polymer compounds, plasticizers, and other auxiliary agents (for example, antifoaming agents, flame retardants, etc.).
  • additives such as surfactants, higher fatty acid derivatives, thermal polymerization initiators, inorganic particles, ultraviolet absorbers, It may contain organic titanium compounds, antioxidants, anti-aggregation agents, phenolic compounds, other polymer compounds, plasticizers, and other auxiliary agents (for example, antifoaming agents, flame retardants, etc.).
  • surfactant various surfactants such as fluorine surfactants, silicone surfactants, and hydrocarbon surfactants can be used.
  • the surfactant may be a nonionic surfactant, a cationic surfactant, or an anionic surfactant.
  • the liquid properties (especially fluidity) when a coating liquid composition is prepared are further improved, and the uniformity of coating thickness and liquid saving are improved. It can be further improved. That is, when forming a film using a coating solution containing a surfactant, the interfacial tension between the surface to be coated and the coating solution is reduced, improving the wettability of the surface to be coated, and making it easier to coat the surface. Improves sex. Therefore, a uniform film with small thickness unevenness can be more suitably formed.
  • fluorine-based surfactant examples include compounds described in paragraph 0328 of International Publication No. 2021/112189, the content of which is incorporated herein.
  • a repeating unit derived from a (meth)acrylate compound having a fluorine atom and a (meth) having 2 or more (preferably 5 or more) alkyleneoxy groups (preferably ethyleneoxy group, propyleneoxy group) are used.
  • a fluorine-containing polymer compound containing a repeating unit derived from an acrylate compound can also be preferably used, and examples thereof include the following compounds.
  • the weight average molecular weight of the above compound is preferably 3,000 to 50,000, more preferably 5,000 to 30,000.
  • a fluorine-based surfactant a fluorine-containing polymer having an ethylenically unsaturated bond in its side chain can also be used as the fluorine-based surfactant.
  • Specific examples include compounds described in paragraphs 0050 to 0090 and paragraphs 0289 to 0295 of JP-A-2010-164965, the contents of which are incorporated herein.
  • Commercially available products include, for example, Megafac RS-101, RS-102, and RS-718K manufactured by DIC Corporation.
  • the fluorine content in the fluorine surfactant is preferably 3 to 40% by mass, more preferably 5 to 30% by mass, and particularly preferably 7 to 25% by mass.
  • a fluorine-based surfactant having a fluorine content within this range is effective in terms of uniformity of coating film thickness and liquid saving, and has good solubility in the composition.
  • Silicone surfactants, hydrocarbon surfactants, nonionic surfactants, cationic surfactants, and anionic surfactants are each described in paragraphs 0329 to 0334 of International Publication No. 2021/112189. compounds, the contents of which are incorporated herein.
  • the content of the surfactant is preferably 0.001 to 2.0% by mass, more preferably 0.005 to 1.0% by mass, based on the total solid content of the composition.
  • Higher fatty acid derivative In order to prevent polymerization inhibition caused by oxygen, higher fatty acid derivatives such as behenic acid and behenic acid amide are added to the resin composition of the present invention during the drying process after application. It may be unevenly distributed on the surface.
  • the content of the higher fatty acid derivative is preferably 0.1 to 10% by mass based on the total solid content of the resin composition.
  • thermal polymerization initiator examples include thermal radical polymerization initiators.
  • a thermal radical polymerization initiator is a compound that generates radicals using thermal energy and initiates or accelerates the polymerization reaction of a compound having polymerizability. By adding a thermal radical polymerization initiator, the polymerization reaction between the resin and the polymerizable compound can be advanced, so that the solvent resistance can be further improved. Further, a photopolymerization initiator may also have a function of initiating polymerization by heat, and may be added as a thermal polymerization initiator.
  • thermal radical polymerization initiator examples include compounds described in paragraphs 0074 to 0118 of JP-A No. 2008-063554, the contents of which are incorporated herein.
  • thermal polymerization initiator When a thermal polymerization initiator is included, its content is preferably 0.1 to 30% by mass, more preferably 0.1 to 20% by mass, based on the total solid content of the resin composition. More preferably, the amount is .5 to 15% by mass.
  • the thermal polymerization initiator may contain only one type, or may contain two or more types. When containing two or more types of thermal polymerization initiators, it is preferable that the total amount is within the above range.
  • inorganic particles include calcium carbonate, calcium phosphate, silica, kaolin, talc, titanium dioxide, alumina, barium sulfate, calcium fluoride, lithium fluoride, zeolite, molybdenum sulfide, and glass.
  • the average particle diameter of the inorganic particles is preferably 0.01 to 2.0 ⁇ m, more preferably 0.02 to 1.5 ⁇ m, even more preferably 0.03 to 1.0 ⁇ m, and particularly preferably 0.04 to 0.5 ⁇ m. .
  • the above average particle diameter of the inorganic particles is a primary particle diameter and a volume average particle diameter.
  • the volume average particle diameter can be measured, for example, by a dynamic light scattering method using Nanotrac WAVE II EX-150 (manufactured by Nikkiso Co., Ltd.). If the above measurement is difficult, measurement can also be performed by centrifugal sedimentation light transmission method, X-ray transmission method, or laser diffraction/scattering method.
  • UV absorber examples include salicylate-based, benzophenone-based, benzotriazole-based, substituted acrylonitrile-based, and triazine-based ultraviolet absorbers.
  • Specific examples of ultraviolet absorbers include compounds described in paragraphs 0341 to 0342 of International Publication No. 2021/112189, the contents of which are incorporated herein.
  • One type of ultraviolet absorber may be used alone, or two or more types may be used in combination.
  • the content of the ultraviolet absorber is preferably 0.001% by mass or more and 1% by mass or less, and 0.01% by mass or less, based on the total solid mass of the resin composition. More preferably, the amount is 0.1% by mass or more and 0.1% by mass or less.
  • organic titanium compounds examples include those in which an organic group is bonded to a titanium atom via a covalent bond or an ionic bond. Specific examples of organic titanium compounds are shown in I) to VII) below:
  • I) Titanium chelate compound A titanium chelate compound having two or more alkoxy groups is more preferred because the resin composition has good storage stability and a good curing pattern can be obtained. Specific examples include titanium bis(triethanolamine) diisopropoxide, titanium di(n-butoxide) bis(2,4-pentanedionate), titanium diisopropoxide bis(2,4-pentanedionate).
  • Tetraalkoxytitanium compounds for example, titanium tetra(n-butoxide), titanium tetraethoxide, titanium tetra(2-ethylhexoxide), titanium tetraisobutoxide, titanium tetraisopropoxide, titanium tetramethoxide , titanium tetramethoxypropoxide, titanium tetramethyl phenoxide, titanium tetra(n-nonyloxide), titanium tetra(n-propoxide), titanium tetrastearyloxide, titanium tetrakis[bis ⁇ 2,2-(allyloxymethyl)] butoxide ⁇ ], etc.
  • Titanocene compounds for example, pentamethylcyclopentadienyl titanium trimethoxide, bis( ⁇ 5-2,4-cyclopentadien-1-yl)bis(2,6-difluorophenyl)titanium, bis( ⁇ 5-2, 4-cyclopentadien-1-yl)bis(2,6-difluoro-3-(1H-pyrrol-1-yl)phenyl)titanium and the like.
  • Monoalkoxytitanium compounds For example, titanium tris(dioctyl phosphate) isopropoxide, titanium tris(dodecylbenzenesulfonate) isopropoxide, and the like.
  • Titanium oxide compound For example, titanium oxide bis(pentanedionate), titanium oxide bis(tetramethylheptanedionate), phthalocyanine titanium oxide, etc.
  • the organic titanium compound is at least one compound selected from the group consisting of I) titanium chelate compounds, II) tetraalkoxytitanium compounds, and III) titanocene compounds. It is preferable that there be.
  • titanium diisopropoxide bis(ethylacetoacetate), titanium tetra(n-butoxide), and bis( ⁇ 5-2,4-cyclopentadien-1-yl)bis(2,6-difluoro-3-(1H -pyrrol-1-yl)phenyl)titanium is preferred.
  • an organic titanium compound When an organic titanium compound is included, its content is preferably 0.05 to 10 parts by mass, more preferably 0.1 to 2 parts by mass, based on 100 parts by mass of the specific resin. When the content is 0.05 parts by mass or more, the resulting cured pattern has better heat resistance and chemical resistance, and when the content is 10 parts by mass or less, the storage stability of the composition is better.
  • antioxidants include phenol compounds, phosphite compounds, thioether compounds, and the like. Specific examples of antioxidants include compounds described in paragraphs 0348 to 0357 of International Publication No. 2021/112189, the contents of which are incorporated herein.
  • the content of the antioxidant is preferably 0.1 to 10 parts by mass, more preferably 0.5 to 5 parts by mass, per 100 parts by mass of the specific resin.
  • the addition amount is preferably 0.1 to 10 parts by mass, more preferably 0.5 to 5 parts by mass, per 100 parts by mass of the specific resin.
  • anti-aggregation agents examples include sodium polyacrylate.
  • the anti-aggregation agents may be used alone or in combination of two or more.
  • the content of the anti-aggregation agent is preferably 0.01% by mass or more and 10% by mass or less, and 0.02% by mass or less, based on the total solid mass of the resin composition. More preferably, it is at least 5% by mass and not more than 5% by mass.
  • One type of phenol compound may be used alone, or two or more types may be used in combination.
  • the content of the phenolic compound is preferably 0.01% by mass or more and 30% by mass or less, and 0.02% by mass or less, based on the total solid mass of the resin composition. It is more preferable that the amount is from % by mass to 20% by mass.
  • polymeric compounds include siloxane resins, (meth)acrylic polymers copolymerized with (meth)acrylic acid, novolak resins, resol resins, polyhydroxystyrene resins, and copolymers thereof.
  • Other polymer compounds may be modified products into which crosslinking groups such as methylol groups, alkoxymethyl groups, and epoxy groups are introduced.
  • One type of other polymer compounds may be used alone, or two or more types may be used in combination.
  • the content of the other polymer compounds is preferably 0.01% by mass or more and 30% by mass or less based on the total solid mass of the resin composition. , more preferably 0.02% by mass or more and 20% by mass or less.
  • the viscosity of the resin composition of the present invention can be adjusted by adjusting the solid content concentration of the resin composition.
  • it is preferably 1,000 mm 2 /s to 12,000 mm 2 /s, more preferably 2,000 mm 2 /s to 10,000 mm 2 /s, and 2,500 mm 2 /s to 8,000 mm. 2 /s is more preferable.
  • it becomes easy to obtain a coating film with high uniformity. If it is 1,000 mm 2 /s or more, it is easy to coat with the thickness required for example as an insulating film for rewiring, and if it is 12,000 mm 2 /s or less, the coating surface quality is excellent. A coating film is obtained.
  • the water content of the resin composition of the present invention is preferably less than 2.0% by mass, more preferably less than 1.5% by mass, and even more preferably less than 1.0% by mass. If it is less than 2.0%, the storage stability of the resin composition will improve.
  • Methods for maintaining the moisture content include adjusting the humidity during storage conditions and reducing the porosity of the storage container during storage.
  • the metal content of the resin composition of the present invention is preferably less than 5 mass ppm (parts per million), more preferably less than 1 mass ppm, and even more preferably less than 0.5 mass ppm, from the viewpoint of insulation.
  • metals include sodium, potassium, magnesium, calcium, iron, copper, chromium, and nickel, but metals included as complexes of organic compounds and metals are excluded. When a plurality of metals are included, the total of these metals is preferably within the above range.
  • a method for reducing metal impurities that is unintentionally included in the resin composition of the present invention is to select a raw material with a low metal content as a raw material constituting the resin composition of the present invention.
  • Methods include filtering the raw materials constituting the product, lining the inside of the apparatus with polytetrafluoroethylene, etc., and performing distillation under conditions that suppress contamination as much as possible.
  • the resin composition of the present invention has a halogen atom content of preferably less than 500 mass ppm, more preferably less than 300 mass ppm, and more preferably less than 200 mass ppm from the viewpoint of wiring corrosion. is even more preferable.
  • those present in the form of halogen ions are preferably less than 5 ppm by mass, more preferably less than 1 ppm by mass, and even more preferably less than 0.5 ppm by mass.
  • the halogen atom include a chlorine atom and a bromine atom. It is preferable that the total of chlorine atoms and bromine atoms, or the total of chlorine ions and bromine ions, is each within the above range.
  • Preferred methods for adjusting the content of halogen atoms include ion exchange treatment.
  • the storage container may be a multilayer bottle whose inner wall is made of 6 types of 6 layers of resin, or a container with 7 layers of 6 types of resin. It is also preferred to use structured bottles. Examples of such a container include the container described in JP-A No. 2015-123351.
  • a cured product of the resin composition By curing the resin composition of the present invention, a cured product of the resin composition can be obtained.
  • the cured product of the present invention is a cured product obtained by curing a resin composition.
  • the resin composition is preferably cured by heating, and the heating temperature is more preferably 120°C to 400°C, even more preferably 140°C to 380°C, and particularly preferably 170°C to 350°C.
  • the form of the cured product of the resin composition is not particularly limited, and can be selected depending on the purpose, such as film, rod, sphere, or pellet form. In the present invention, the cured product is preferably in the form of a film.
  • the thickness of the cured product is preferably 0.5 ⁇ m or more and 150 ⁇ m or less.
  • the shrinkage rate when the resin composition of the present invention is cured is preferably 50% or less, more preferably 45% or less, and even more preferably 40% or less.
  • the imidization reaction rate of the cured product of the resin composition of the present invention is preferably 70% or more, more preferably 80% or more, and still more preferably 90% or more. If it is 70% or more, the cured product may have excellent mechanical properties.
  • the elongation at break of the cured product of the resin composition of the present invention is preferably 30% or more, more preferably 40% or more, and even more preferably 50% or more.
  • the glass transition temperature (Tg) of the cured product of the resin composition of the present invention is preferably 180°C or higher, more preferably 210°C or higher, and even more preferably 230°C or higher.
  • the resin composition of the present invention can be prepared by mixing the above components.
  • the mixing method is not particularly limited and can be performed by a conventionally known method. Examples of the mixing method include mixing using a stirring blade, mixing using a ball mill, and mixing using a rotating tank.
  • the temperature during mixing is preferably 10 to 30°C, more preferably 15 to 25°C.
  • the filter pore diameter is, for example, preferably 5 ⁇ m or less, more preferably 1 ⁇ m or less, even more preferably 0.5 ⁇ m or less, and even more preferably 0.1 ⁇ m or less.
  • the material of the filter is preferably polytetrafluoroethylene, polyethylene or nylon. When the material of the filter is polyethylene, it is more preferably HDPE (high density polyethylene).
  • the filter may be washed in advance with an organic solvent. In the filter filtration step, a plurality of types of filters may be connected in series or in parallel. When using multiple types of filters, filters with different pore sizes or materials may be used in combination.
  • connection mode examples include a mode in which an HDPE filter with a pore diameter of 1 ⁇ m is connected in series as the first stage and an HDPE filter with a pore diameter of 0.2 ⁇ m as the second stage. Additionally, various materials may be filtered multiple times. When filtration is performed multiple times, circulation filtration may be used. Alternatively, filtration may be performed under pressure.
  • the pressure to be pressurized is, for example, preferably 0.01 MPa or more and 1.0 MPa or less, more preferably 0.03 MPa or more and 0.9 MPa or less, still more preferably 0.05 MPa or more and 0.7 MPa or less, and 0.01 MPa or more and 0.9 MPa or less, still more preferably 0.05 MPa or more and 0.7 MPa or less, and 0.01 MPa or more and 0.9 MPa or less, and even more preferably 0.05 MPa or more and 0.7 MPa or less. Even more preferably 0.05 MPa or more and 0.5 MPa or less.
  • impurity removal treatment using an adsorbent may be performed.
  • Filter filtration and impurity removal treatment using an adsorbent may be combined.
  • a known adsorbent can be used. Examples include inorganic adsorbents such as silica gel and zeolite, and organic adsorbents such as activated carbon. After filtration using a filter, the resin composition filled in the bottle may be placed under reduced pressure and degassed.
  • the method for producing a cured product of the present invention preferably includes a film forming step of applying the resin composition onto a base material to form a film.
  • the method for producing a cured product includes the above film forming step, an exposure step of selectively exposing the film formed in the film forming step, and developing the film exposed in the exposure step using a developer to form a pattern. It is more preferable to include a developing step.
  • the method for producing a cured product includes the film formation step, the exposure step, the development step, a heating step of heating the pattern obtained in the development step, and a post-development exposure step of exposing the pattern obtained in the development step. It is particularly preferable to include at least one of them.
  • the method for producing a cured product includes the film forming step and the step of heating the film. The details of each step will be explained below.
  • the resin composition of the present invention can be used in a film forming step in which a film is formed by applying it on a substrate.
  • the method for producing a cured product of the present invention preferably includes a film forming step of applying the resin composition onto a base material to form a film.
  • the type of base material can be appropriately determined depending on the purpose and is not particularly limited.
  • the base material include semiconductor manufacturing base materials such as silicon, silicon nitride, polysilicon, silicon oxide, and amorphous silicon, quartz, glass, optical films, ceramic materials, vapor deposited films, magnetic films, reflective films, Ni, Cu,
  • a metal base material such as Cr or Fe (for example, a base material formed from a metal or a base material on which a metal layer is formed by, for example, plating or vapor deposition), paper, SOG (Spin On Examples include glass), TFT (thin film transistor) array substrates, mold substrates, and electrode plates for plasma display panels (PDP).
  • the base material is particularly preferably a semiconductor production base material, and more preferably a silicon base material, a Cu base material, and a mold base material. These base materials may be provided with a layer such as an adhesive layer or an oxidized layer made of hexamethyldisilazane (HMDS) or the like on the surface.
  • the shape of the base material is not particularly limited, and may be circular or rectangular. As for the size of the base material, if it is circular, the diameter is preferably 100 to 450 mm, more preferably 200 to 450 mm. If it is rectangular, the length of the short side is preferably 100 to 1000 mm, more preferably 200 to 700 mm.
  • a plate-shaped, preferably panel-shaped base material (substrate) is used as the base material.
  • the resin layer or metal layer serves as the base material.
  • Coating is preferred as a means for applying the resin composition onto the substrate.
  • the methods to be applied include dip coating method, air knife coating method, curtain coating method, wire bar coating method, gravure coating method, extrusion coating method, spray coating method, spin coating method, slit coating method, Examples include inkjet method. From the viewpoint of uniformity of film thickness, spin coating method, slit coating method, spray coating method, or inkjet method is preferable, and from the viewpoint of uniformity of film thickness and productivity, spin coating method and slit coating method are preferable. A coating method is more preferred. A film with a desired thickness can be obtained by adjusting the solid content concentration and application conditions of the resin composition depending on the means to be applied.
  • the coating method can be appropriately selected depending on the shape of the substrate, and for circular substrates such as wafers, spin coating, spray coating, inkjet methods, etc. are preferable, and for rectangular substrates, slit coating, spray coating, etc. method, inkjet method, etc. are preferred.
  • spin coating it can be applied, for example, at a rotation speed of 500 to 3,500 rpm for about 10 seconds to 3 minutes.
  • the transfer method the production method described in paragraphs 0023, 0036 to 0051 of JP-A No.
  • 2006-023696 and paragraphs 0096 to 0108 of JP-A No. 2006-047592 can be suitably used. Further, a step of removing excess film may be performed at the end of the base material. Examples of such processes include edge bead rinsing (EBR), back rinsing, and the like.
  • EBR edge bead rinsing
  • a pre-wet process may be employed in which various solvents are applied to the base material before the resin composition is applied to the base material to improve the wettability of the base material, and then the resin composition is applied.
  • the film may be subjected to a step of drying the formed film (layer) (drying step) in order to remove the solvent.
  • the method for producing a cured product of the present invention may include a drying step of drying the film formed in the film forming step.
  • the drying step is preferably performed after the film forming step and before the exposure step.
  • the drying temperature of the membrane in the drying step is preferably from 50 to 150°C, more preferably from 70°C to 130°C, even more preferably from 90°C to 110°C.
  • drying may be performed under reduced pressure.
  • the drying time is exemplified by 30 seconds to 20 minutes, preferably 1 minute to 10 minutes, and more preferably 2 minutes to 7 minutes.
  • the film may be subjected to an exposure process that selectively exposes the film.
  • the method for producing a cured product may include an exposure step of selectively exposing the film formed in the film forming step. Selectively exposing means exposing a portion of the film. Furthermore, by selectively exposing the film, an exposed region (exposed portion) and an unexposed region (non-exposed portion) are formed in the film.
  • the exposure amount is not particularly limited as long as it can cure the resin composition of the present invention, but for example, it is preferably 50 to 10,000 mJ/cm 2 and more preferably 200 to 8,000 mJ/cm 2 in terms of exposure energy at a wavelength of 365 nm. preferable.
  • the exposure wavelength can be appropriately determined in the range of 190 to 1,000 nm, preferably 240 to 550 nm.
  • the exposure wavelength is: (1) semiconductor laser (wavelength: 830 nm, 532 nm, 488 nm, 405 nm, 375 nm, 355 nm, etc.), (2) metal halide lamp, (3) high pressure mercury lamp, G-line (wavelength) 436 nm), h line (wavelength 405 nm), i line (wavelength 365 nm), broad (three wavelengths of g, h, i line), (4) excimer laser, KrF excimer laser (wavelength 248 nm), ArF excimer laser (wavelength 193 nm) ), F2 excimer laser (wavelength 157 nm), (5) extreme ultraviolet light; EUV (wavelength 13.6 nm), (6) electron beam, (7) YAG laser second harmonic 532 nm, third harmonic 355 nm, etc.
  • semiconductor laser wavelength: 830 nm, 532 nm, 488 nm, 405 nm, 375 nm,
  • the resin composition of the present invention exposure using a high-pressure mercury lamp is particularly preferred, and from the viewpoint of exposure sensitivity, exposure using i-line is more preferred.
  • the method of exposure is not particularly limited, and may be any method as long as at least a portion of the film made of the resin composition of the present invention is exposed to light, and examples thereof include exposure using a photomask, exposure using a laser direct imaging method, etc. .
  • the film may be subjected to a heating step after exposure (post-exposure heating step). That is, the method for producing a cured product of the present invention may include a post-exposure heating step of heating the film exposed in the exposure step.
  • the post-exposure heating step can be performed after the exposure step and before the development step.
  • the heating temperature in the post-exposure heating step is preferably 50°C to 140°C, more preferably 60°C to 120°C.
  • the heating time in the post-exposure heating step is preferably 30 seconds to 300 minutes, more preferably 1 minute to 10 minutes.
  • the temperature increase rate in the post-exposure heating step is preferably 1 to 12°C/min, more preferably 2 to 10°C/min, and even more preferably 3 to 10°C/min from the temperature at the start of heating to the maximum heating temperature. Further, the temperature increase rate may be changed as appropriate during heating.
  • the heating means in the post-exposure heating step is not particularly limited, and a known hot plate, oven, infrared heater, etc. can be used. It is also preferable that the heating be performed in an atmosphere with a low oxygen concentration, such as by flowing an inert gas such as nitrogen, helium, or argon.
  • the exposed film may be subjected to a development step of developing a pattern using a developer. That is, the method for producing a cured product of the present invention may include a development step of developing the film exposed in the exposure step using a developer to form a pattern. By performing development, one of the exposed and non-exposed areas of the film is removed and a pattern is formed.
  • development in which the non-exposed portions of the film are removed in the developing step is referred to as negative development
  • development in which the exposed portions of the film are removed in the development step is referred to as positive development.
  • Examples of the developer used in the development step include an alkaline aqueous solution or a developer containing an organic solvent.
  • basic compounds that the alkaline aqueous solution may contain include inorganic alkalis, primary amines, secondary amines, tertiary amines, and quaternary ammonium salts.
  • TMAH tetramethylammonium hydroxide
  • potassium hydroxide sodium carbonate, sodium hydroxide, sodium silicate, sodium metasilicate, ammonia, ethylamine, n-propylamine, diethylamine, di-n-butylamine, triethylamine, methyldiethylamine , dimethylethanolamine, triethanolamine, tetraethylammonium hydroxide, tetrapropylammonium hydroxide, tetrabutylammonium hydroxide, tetrapentylammonium hydroxide, tetrahexylammonium hydroxide, tetraoctylammonium hydroxide, ethyltrimethylammonium hydroxide, Butyltrimethylammonium hydroxide, methyltriamylammonium hydroxide, dibutyldipentylammonium hydroxide, dimethylbis(2-hydroxyethyl)ammoni
  • the compound described in paragraph 0387 of International Publication No. 2021/112189 can be used as the organic solvent.
  • alcohols include methanol, ethanol, propanol, isopropanol, butanol, pentanol, octanol, diethylene glycol, propylene glycol, methylisobutylcarbinol, triethylene glycol, etc.
  • Amides include N-methylpyrrolidone, N-ethylpyrrolidone, Dimethylformamide and the like are also suitable.
  • the developer contains an organic solvent
  • one type of organic solvent or a mixture of two or more types can be used.
  • a developer containing at least one member selected from the group consisting of cyclopentanone, ⁇ -butyrolactone, dimethyl sulfoxide, N-methyl-2-pyrrolidone, and cyclohexanone is particularly preferred.
  • a developer containing at least one selected from the group consisting of and dimethyl sulfoxide is more preferred, and a developer containing cyclopentanone is particularly preferred.
  • the content of the organic solvent relative to the total mass of the developer is preferably 50% by mass or more, more preferably 70% by mass or more, and 80% by mass or more. is more preferable, and particularly preferably 90% by mass or more. Moreover, the said content may be 100 mass %.
  • the developer may further contain at least one of a basic compound and a base generator.
  • the developer may further contain at least one of the basic compound and the base generator in the developer permeates into the pattern, performance such as elongation at break of the pattern may be improved.
  • an organic base is preferable from the viewpoint of reliability when remaining in the cured film (adhesion to the substrate when the cured product is further heated).
  • a basic compound having an amino group is preferable, and primary amines, secondary amines, tertiary amines, ammonium salts, tertiary amides, etc.
  • a primary amine, a secondary amine, a tertiary amine or an ammonium salt is preferred, a secondary amine, a tertiary amine or an ammonium salt is more preferred, a secondary amine or a tertiary amine is even more preferred, and a tertiary amine is particularly preferred.
  • the basic compound is preferably one that does not easily remain in the cured film (obtained cured product), and from the viewpoint of promoting cyclization, it can be used by vaporization etc. It is preferable that the amount remaining is not likely to decrease before heating.
  • the boiling point of the basic compound is preferably 30°C to 350°C, more preferably 80°C to 270°C, and even more preferably 100°C to 230°C at normal pressure (101,325 Pa).
  • the boiling point of the basic compound is preferably higher than the boiling point of the organic solvent contained in the developer minus 20°C, and more preferably higher than the boiling point of the organic solvent contained in the developer.
  • the basic compound used preferably has a boiling point of 80°C or higher, more preferably 100°C or higher.
  • the developer may contain only one type of basic compound, or may contain two or more types of basic compounds.
  • basic compounds include ethanolamine, diethanolamine, triethanolamine, ethylamine, diethylamine, triethylamine, hexylamine, dodecylamine, cyclohexylamine, cyclohexylmethylamine, cyclohexyldimethylamine, aniline, N-methylaniline, N, N-dimethylaniline, diphenylamine, pyridine, butylamine, isobutylamine, dibutylamine, tributylamine, dicyclohexylamine, DBU (diazabicycloundecene), DABCO (1,4-diazabicyclo[2.2.2]octane), N , N-diisopropylethylamine, tetramethylammonium hydroxide, tetrabutylammonium hydroxide, ethylenediamine, butanediamine, 1,5-diaminopentane, N-methylhexy
  • the preferred embodiments of the base generator are the same as the preferred embodiments of the base generator contained in the above-mentioned composition.
  • the base generator is preferably a thermal base generator.
  • the content of the basic compound or base generator is preferably 10% by mass or less, and 5% by mass or less based on the total mass of the developer. More preferred.
  • the lower limit of the above content is not particularly limited, but is preferably 0.1% by mass or more, for example. If the basic compound or base generator is solid in the environment in which the developer is used, the content of the basic compound or base generator should be 70 to 100% by mass based on the total solid content of the developer. is also preferable.
  • the developing solution may contain only one type of at least one of a basic compound and a base generator, or may contain two or more types. When at least one of the basic compound and the base generator is two or more types, it is preferable that the total is within the above range.
  • the developer may further contain other components.
  • other components include known surfactants and known antifoaming agents.
  • the method of supplying the developer is not particularly limited as long as the desired pattern can be formed, and methods include immersing the base material on which the film is formed in the developer, and supplying the developer to the film formed on the base material using a nozzle.
  • a method of supplying with a spray nozzle is more preferable.
  • the base material is spun to remove the developer from the base material, and after spin drying, the developer is continuously supplied again using the straight nozzle, the base material is spun, and the developer is applied to the base material.
  • a process of removing from above may be adopted, or this process may be repeated multiple times.
  • Methods for supplying the developer in the development process include a process in which the developer is continuously supplied to the base material, a process in which the developer is kept in a substantially stationary state on the base material, and a process in which the developer is applied to the base material using ultrasonic waves. Examples include a step of vibrating with the like, and a step of combining these.
  • the development time is preferably 10 seconds to 10 minutes, more preferably 20 seconds to 5 minutes.
  • the temperature of the developer during development is not particularly limited, but is preferably 10 to 45°C, more preferably 18 to 30°C.
  • the pattern may be further cleaned (rinsed) with a rinse solution.
  • a method such as supplying a rinsing liquid before the developer in contact with the pattern is completely dried may be adopted.
  • the developing solution is an alkaline aqueous solution
  • water can be used as the rinsing solution, for example.
  • the developer is a developer containing an organic solvent, for example, a solvent different from the solvent contained in the developer (e.g., water, an organic solvent different from the organic solvent contained in the developer) is used as the rinse agent. be able to.
  • Examples of the organic solvent when the rinsing liquid contains an organic solvent include the same organic solvents as those exemplified in the case where the above-mentioned developer contains an organic solvent.
  • the organic solvent contained in the rinsing liquid is preferably an organic solvent different from the organic solvent contained in the developer, and more preferably an organic solvent in which the pattern has a lower solubility than the organic solvent contained in the developer.
  • the rinsing liquid contains an organic solvent
  • the organic solvent is preferably cyclopentanone, ⁇ -butyrolactone, dimethyl sulfoxide, N-methylpyrrolidone, cyclohexanone, PGMEA, or PGME, more preferably cyclopentanone, ⁇ -butyrolactone, dimethyl sulfoxide, PGMEA, or PGME, and cyclohexanone or PGMEA. More preferred.
  • the organic solvent is preferably 50% by mass or more, more preferably 70% by mass or more, and even more preferably 90% by mass or more, based on the total mass of the rinsing liquid. Moreover, the organic solvent may be 100% by mass with respect to the total mass of the rinsing liquid.
  • the rinsing liquid may contain at least one of a basic compound and a base generator.
  • a basic compound and a base generator when the developer contains an organic solvent, one preferred embodiment of the present invention is an embodiment in which the rinsing solution contains an organic solvent and at least one of a basic compound and a base generator.
  • the basic compound and base generator contained in the rinsing solution include the compounds exemplified as the basic compound and base generator that may be included when the above-mentioned developer contains an organic solvent, and preferred embodiments are also included. The same is true.
  • the basic compound and base generator contained in the rinsing liquid may be selected in consideration of their solubility in the solvent in the rinsing liquid.
  • the content of the basic compound or base generator is preferably 10% by mass or less, more preferably 5% by mass or less, based on the total mass of the rinsing liquid. preferable.
  • the lower limit of the above content is not particularly limited, but is preferably 0.1% by mass or more, for example. If the basic compound or base generator is solid in the environment where the rinse solution is used, the content of the basic compound or base generator should be 70 to 100% by mass based on the total solid content of the rinse solution. is also preferable.
  • the rinsing liquid may contain only one type of at least one of the basic compound and the base generator, or may contain two or more types of the basic compound and the base generator. .
  • the total is within the above range.
  • the rinse solution may further contain other components.
  • other components include known surfactants and known antifoaming agents.
  • a method of supplying the rinsing liquid using a spray nozzle is more preferable.
  • a method of supplying the rinsing liquid using a spray nozzle is more preferable.
  • the type of nozzle and examples include straight nozzles, shower nozzles, spray nozzles, and the like.
  • the rinsing step is preferably a step in which the rinsing liquid is supplied to the exposed film through a straight nozzle or continuously, and more preferably a step in which the rinsing liquid is supplied through a spray nozzle.
  • Methods for supplying the rinsing liquid in the rinsing process include a process in which the rinsing liquid is continuously supplied to the substrate, a process in which the rinsing liquid is kept in a substantially stationary state on the substrate, and a process in which the rinsing liquid is applied to the substrate using ultrasonic waves. It is possible to adopt a process of vibrating the wafer, etc., and a process of combining these.
  • the rinsing time is preferably 10 seconds to 10 minutes, more preferably 20 seconds to 5 minutes.
  • the temperature of the rinsing liquid during rinsing is not particularly limited, but is preferably 10 to 45°C, more preferably 18 to 30°C.
  • the developing step may include a step of bringing the processing solution into contact with the pattern after processing using the developer or after cleaning the pattern with a rinse solution.
  • a method may be adopted in which the processing liquid is supplied before the developing liquid or the rinsing liquid in contact with the pattern is completely dried.
  • the treatment liquid examples include a treatment liquid containing at least one of water and an organic solvent, and at least one of a basic compound and a base generator.
  • Preferred embodiments of the organic solvent and at least one of the basic compound and base generator are the same as the preferred embodiments of the organic solvent and at least one of the basic compound and base generator used in the above-mentioned rinsing liquid.
  • the method for supplying the treatment liquid to the pattern can be the same as the method for supplying the rinsing liquid described above, and the preferred embodiments are also the same.
  • the content of the basic compound or base generator in the treatment liquid is preferably 10% by mass or less, more preferably 5% by mass or less, based on the total mass of the treatment liquid.
  • the lower limit of the content is not particularly limited, but is preferably 0.1% by mass or more, for example.
  • the content of the basic compound or base generator is 70 to 100% by mass based on the total solid content of the treatment liquid. It's also good to have one.
  • the processing liquid contains at least one of a basic compound and a base generator
  • the processing liquid may contain only one type of at least one of the basic compound and the base generator, or may contain two or more types of the basic compound and the base generator. .
  • at least one of the basic compound and the base generator is two or more types, it is preferable that the total is within the above range.
  • the pattern obtained by the development step may be subjected to a heating step of heating the pattern obtained by the development.
  • the method for producing a cured product of the present invention may include a heating step of heating the pattern obtained by the developing step.
  • the method for producing a cured product of the present invention may include a heating step of heating a pattern obtained by another method without performing a developing step, or a film obtained by a film forming step.
  • a resin such as a polyimide precursor is cyclized to become a resin such as polyimide.
  • the heating temperature (maximum heating temperature) in the heating step is preferably 50 to 450°C, more preferably 150 to 350°C, even more preferably 150 to 250°C, even more preferably 160 to 250°C, particularly 160 to 230°C. preferable.
  • the heating step is preferably a step of promoting the cyclization reaction of the polyimide precursor within the pattern by heating and the action of a base generated from the base generator.
  • Heating in the heating step is preferably carried out at a temperature increase rate of 1 to 12° C./min from the temperature at the start of heating to the maximum heating temperature.
  • the temperature increase rate is more preferably 2 to 10°C/min, and even more preferably 3 to 10°C/min.
  • the temperature at the start of heating is preferably 20°C to 150°C, more preferably 20°C to 130°C, even more preferably 25°C to 120°C.
  • the temperature at the start of heating refers to the temperature at which the process of heating to the maximum heating temperature is started.
  • the temperature of the film (layer) after drying is, for example, 30°C higher than the boiling point of the solvent contained in the resin composition. It is preferable to raise the temperature from a lower temperature by ⁇ 200°C.
  • the heating time (heating time at the highest heating temperature) is preferably 5 to 360 minutes, more preferably 10 to 300 minutes, and even more preferably 15 to 240 minutes.
  • the heating temperature is preferably 30°C or higher, more preferably 80°C or higher, even more preferably 100°C or higher, and particularly preferably 120°C or higher.
  • the upper limit of the heating temperature is preferably 350°C or lower, more preferably 250°C or lower, and even more preferably 240°C or lower.
  • Heating may be performed in stages. As an example, the temperature is raised from 25°C to 120°C at a rate of 3°C/min, held at 120°C for 60 minutes, and the temperature is raised from 120°C to 180°C at a rate of 2°C/min, and held at 180°C for 120 minutes. , etc. may be performed. It is also preferable to perform the treatment while irradiating ultraviolet rays as described in US Pat. No. 9,159,547. Such pretreatment steps can improve the properties of the film. The pretreatment step is preferably carried out for a short time of about 10 seconds to 2 hours, more preferably 15 seconds to 30 minutes.
  • the pretreatment may be performed in two or more steps, for example, the first pretreatment step may be performed at a temperature of 100 to 150°C, followed by the second pretreatment step at a temperature of 150 to 200°C. good. Furthermore, cooling may be performed after heating, and the cooling rate in this case is preferably 1 to 5° C./min.
  • the heating step is preferably performed in an atmosphere with a low oxygen concentration, such as by flowing an inert gas such as nitrogen, helium, or argon, or under reduced pressure, from the viewpoint of preventing decomposition of the specific resin.
  • the oxygen concentration is preferably 50 ppm (volume ratio) or less, more preferably 20 ppm (volume ratio) or less.
  • the heating means in the heating step is not particularly limited, but includes, for example, a hot plate, an infrared oven, an electric oven, a hot air oven, an infrared oven, and the like.
  • the pattern obtained in the development process (in the case of performing a rinsing process, the pattern after rinsing) is subjected to a post-development exposure process in which the pattern after the development process is exposed to light, instead of or in addition to the above heating process. may be served.
  • the method for producing a cured product of the present invention may include a post-development exposure step of exposing the pattern obtained in the development step.
  • the method for producing a cured product of the present invention may include a heating step and a post-development exposure step, or may include only one of the heating step and the post-development exposure step.
  • the post-development exposure step for example, a reaction in which cyclization of a polyimide precursor etc.
  • the post-development exposure step at least a portion of the pattern obtained in the development step may be exposed, but it is preferable that the entire pattern be exposed.
  • the exposure amount in the post-development exposure step is preferably 50 to 20,000 mJ/cm 2 , more preferably 100 to 15,000 mJ/cm 2 in terms of exposure energy at the wavelength to which the photosensitive compound is sensitive.
  • the post-development exposure step can be performed, for example, using the light source used in the above-mentioned exposure step, and it is preferable to use broadband light.
  • the pattern obtained by the development process may be subjected to a metal layer forming process of forming a metal layer on the pattern. That is, the method for producing a cured product of the present invention includes a metal layer forming step of forming a metal layer on the pattern obtained in the development step (preferably one that has been subjected to at least one of the heating step and the post-development exposure step). It is preferable.
  • metal layer existing metal species can be used without particular limitation, and examples include copper, aluminum, nickel, vanadium, titanium, chromium, cobalt, gold, tungsten, tin, silver, and alloys containing these metals. copper and aluminum are more preferred, and copper is even more preferred.
  • the method for forming the metal layer is not particularly limited, and existing methods can be applied.
  • the methods described in JP 2007-157879, JP 2001-521288, JP 2004-214501, JP 2004-101850, US Patent No. 7888181B2, and US Patent No. 9177926B2 are used. can do.
  • photolithography, PVD (physical vapor deposition), CVD (chemical vapor deposition), lift-off, electrolytic plating, electroless plating, etching, printing, and combinations thereof can be used.
  • a patterning method that combines sputtering, photolithography, and etching, and a patterning method that combines photolithography and electrolytic plating can be mentioned.
  • a preferred embodiment of plating includes electrolytic plating using copper sulfate or copper cyanide plating solution.
  • the thickness of the metal layer is preferably 0.01 to 50 ⁇ m, more preferably 1 to 10 ⁇ m at the thickest part.
  • Fields to which the method for producing a cured product of the present invention or the cured product can be applied include insulating films for electronic devices, interlayer insulating films for rewiring layers, stress buffer films, and the like. Other methods include forming a pattern by etching a sealing film, a substrate material (a base film or coverlay of a flexible printed circuit board, an interlayer insulating film), or an insulating film for mounting purposes as described above.
  • a substrate material a base film or coverlay of a flexible printed circuit board, an interlayer insulating film
  • an insulating film for mounting purposes as described above.
  • the method for producing a cured product of the present invention or the cured product of the present invention can be used for producing plates such as offset plates or screen plates, for etching molded parts, and for use in protective lacquers and dielectric layers in electronics, particularly microelectronics. It can also be used for manufacturing.
  • the laminate of the present invention refers to a structure having a plurality of layers made of the cured product of the present invention.
  • the laminate is a laminate including two or more layers made of cured material, and may be a laminate including three or more layers. At least one of the two or more layers made of the cured product contained in the laminate is a layer made of the cured product of the present invention, and shrinkage of the cured product or deformation of the cured product due to the shrinkage, etc. From the viewpoint of suppression, it is also preferable that all the layers made of the cured product contained in the above-mentioned laminate are layers made of the cured product of the present invention.
  • the method for producing a laminate of the present invention preferably includes the method for producing a cured product of the present invention, and more preferably includes repeating the method for producing a cured product of the present invention multiple times.
  • the laminate of the present invention preferably includes two or more layers made of a cured product and includes a metal layer between any of the layers made of the cured product.
  • the metal layer is preferably formed by the metal layer forming step. That is, the method for producing a laminate of the present invention preferably further includes a metal layer forming step of forming a metal layer on the layer made of the cured product during the method for producing the cured product which is performed multiple times. A preferred embodiment of the metal layer forming step is as described above.
  • the resin composition of the present invention used to form the layer made of the first cured product and the resin composition of the present invention used to form the layer made of the second cured product have the same composition. It may be a product or a composition having a different composition.
  • the metal layer in the laminate of the present invention is preferably used as metal wiring such as a rewiring layer.
  • the method for manufacturing a laminate of the present invention includes a lamination step.
  • the lamination process refers to (a) film formation process (layer formation process), (b) exposure process, (c) development process, (d) heating process and development on the surface of the pattern (resin layer) or metal layer again. This is a series of steps including performing at least one of the post-exposure steps in this order.
  • an embodiment may be adopted in which at least one of the (a) film forming step and (d) heating step and post-development exposure step is repeated.
  • a (e) metal layer forming step may be included.
  • the lamination step may further include the above-mentioned drying step and the like as appropriate.
  • a surface activation treatment step may be performed after the exposure step, the heating step, or the metal layer forming step.
  • Plasma treatment is exemplified as the surface activation treatment. Details of the surface activation treatment will be described later.
  • the above lamination step is preferably performed 2 to 20 times, more preferably 2 to 9 times.
  • the above layers may have the same composition, shape, thickness, etc., or may have different compositions, shapes, thicknesses, etc.
  • a cured product (resin layer) of the resin composition of the present invention is further formed to cover the metal layer.
  • the following steps are repeated in the following order: (a) film formation step, (b) exposure step, (c) development step, (d) at least one of the heating step and post-development exposure step, and (e) metal layer formation step.
  • an embodiment may be mentioned in which (a) a film forming step, (d) at least one of a heating step and a post-development exposure step, and (e) a metal layer forming step are repeated in this order.
  • the method for producing a laminate of the present invention preferably includes a surface activation treatment step of surface activation treatment of at least a portion of the metal layer and the resin composition layer.
  • the surface activation treatment step is usually performed after the metal layer forming step, but after the development step (preferably after at least one of the heating step and the post-development exposure step), the resin composition layer is subjected to the surface activation treatment. After performing this step, the metal layer forming step may be performed.
  • the surface activation treatment may be performed on at least a portion of the metal layer, or may be performed on at least a portion of the resin composition layer after exposure, or the surface activation treatment may be performed on at least a portion of the metal layer and the resin composition layer after exposure.
  • the surface activation treatment is preferably performed on at least a part of the metal layer, and it is preferable that the surface activation treatment is performed on a part or all of the region of the metal layer on which the resin composition layer is to be formed.
  • the surface activation treatment is also performed on part or all of the resin composition layer (resin layer) after exposure.
  • the resin composition layer when the resin composition layer is hardened, such as when performing negative development, it is less likely to be damaged by surface treatment and adhesion is likely to be improved.
  • the surface activation treatment can be performed, for example, by the method described in paragraph 0415 of International Publication No. 2021/112189. This content is incorporated herein.
  • the present invention also discloses a semiconductor device containing the cured product or laminate of the present invention.
  • the present invention also discloses a method for manufacturing a semiconductor device, including a method for manufacturing a cured product or a method for manufacturing a laminate according to the present invention.
  • a semiconductor device using the resin composition of the present invention for forming an interlayer insulating film for a rewiring layer the descriptions in paragraphs 0213 to 0218 of JP 2016-027357A and the description in FIG. 1 can be referred to, Their contents are incorporated herein.
  • the polyimide precursor (A-1) has a structure containing two repeating units represented by the following formula (A-1). The structure of each repeating unit was confirmed from the 1 H-NMR spectrum.
  • the polyimide precursor was then precipitated in 3 liters of water, and the water-polyimide precursor mixture was stirred at a speed of 5,000 rpm (revolutions per minute) for 15 minutes.
  • the polyimide precursor was obtained by filtration, dissolved in 300 mL of tetrahydrofuran, and then re-obtained as a precipitate in 2 liters of water.
  • the obtained polyimide precursor was dried at 45° C. for 3 days under reduced pressure to obtain polyimide precursor A-1b.
  • the weight average molecular weight of this polyimide precursor A-1b was 51,000, and the number average molecular weight was 19,030.
  • the repeating units and composition ratio (mol%) of Resin A-1b are the same as those of Resin A-1.
  • the weight average molecular weight of the obtained polyimide precursor (A-2) was 73,100, and the number average molecular weight was 28,900.
  • the polyimide precursor (A-2) has a structure containing three repeating units represented by the following formula (A-2). The structure of each repeating unit was confirmed from the 1 H-NMR spectrum.
  • Example A-3 Synthesis of polyimide precursor (A-3)
  • a polyimide precursor (A-3) was obtained in the same manner as in Example A-1 except that the raw material compound used was changed.
  • the weight average molecular weight of the obtained polyimide precursor (A-3) was 73,900, and the number average molecular weight was 28,800.
  • the polyimide precursor (A-3) has a structure containing two repeating units represented by the following formula (A-3). The structure of each repeating unit was confirmed from the 1 H-NMR spectrum.
  • Example A-4 Synthesis of polyimide precursor (A-4)
  • a polyimide precursor (A-4) was obtained in the same manner as in Example A-1 except that the raw material compound used was changed.
  • the weight average molecular weight of the obtained polyimide precursor (A-4) was 65,800, and the number average molecular weight was 25,700.
  • the polyimide precursor (A-4) has a structure containing two repeating units represented by the following formula (A-4). The structure of each repeating unit was confirmed from the 1 H-NMR spectrum.
  • Example A-5 Synthesis of polyimide precursor (A-5)
  • a polyimide precursor (A-5) was obtained in the same manner as in Example A-1 except that the raw material compound used was changed.
  • the weight average molecular weight of the obtained polyimide precursor (A-5) was 63,300, and the number average molecular weight was 23,100.
  • the polyimide precursor (A-5) has a structure containing three repeating units represented by the following formula (A-5). The structure of each repeating unit was confirmed from the 1 H-NMR spectrum.
  • a polyimide precursor (A-7) was obtained in the same manner as Example A-1 except that the raw material compound used was changed.
  • the weight average molecular weight of the obtained polyimide precursor (A-7) was 48,700, and the number average molecular weight was 19,900.
  • the polyimide precursor (A-7) has a structure containing three repeating units represented by the following formula (A-7). The structure of each repeating unit was confirmed from the 1 H-NMR spectrum.
  • Example A-8 Synthesis of polyimide precursor (A-8)]
  • a polyimide precursor (A-8) was obtained in the same manner as in Example A-1 except that the raw material compound used was changed.
  • the weight average molecular weight of the obtained polyimide precursor (A-8) was 83,000, and the number average molecular weight was 33,600.
  • the polyimide precursor (A-8) has a structure containing three repeating units represented by the following formula (A-7). The structure of each repeating unit was confirmed from the 1 H-NMR spectrum.
  • CA-1 Synthesis of polyimide precursor (CA-1)] Put 77.5 g of 4,4'-oxydiphthalic dianhydride (ODPA) and 73.5 g of 4,4'-biphthalic dianhydride into a separable flask, and add 134.0 g of 2-hydroxyethyl methacrylate (HEMA) and 400 ml of ⁇ -butyrolactone was added. A reaction mixture was obtained by adding 79.1 g of pyridine while stirring at room temperature. After the exotherm due to the reaction had ended, the mixture was allowed to cool to room temperature and was further left standing for 16 hours.
  • ODPA 4,4'-oxydiphthalic dianhydride
  • HEMA 2-hydroxyethyl methacrylate
  • the resulting reaction solution was added to 3 liters of ethyl alcohol to produce a precipitate consisting of a crude polymer.
  • the produced crude polymer was collected by filtration and dissolved in 1.5 liters of tetrahydrofuran to obtain a crude polymer solution.
  • the obtained crude polymer solution was dropped into 28 liters of water to precipitate the polymer, and the obtained precipitate was collected by filtration and vacuum dried to obtain a powdered polyimide precursor (CA-1). .
  • the weight average molecular weight (Mw) of this polyimide precursor (CA-1) was measured and found to be 22,600.
  • the polyimide precursor (CA-1) has a structure containing two repeating units represented by the following formula (CA-1). The structure of each repeating unit was confirmed from the 1 H-NMR spectrum.
  • CA-1b Synthesis of polyimide precursor (CA-1b)]
  • CA-1b was obtained in the same manner as Example CA-1 except that the raw material compound was changed.
  • the weight average molecular weight of the obtained polyimide precursor CA-1b was 51,500, and the number average molecular weight was 19,000.
  • the polyimide precursor was obtained by filtration, stirred again in 4 liters of water for 30 minutes and filtered again. Next, the obtained polyimide precursor was dried at 45° C. for 2 days under reduced pressure to obtain a polyimide precursor (A-6).
  • the weight average molecular weight of the obtained polyimide precursor (A-6) was 30,200, and the number average molecular weight was 12,400.
  • the polyimide precursor (A-6) has a structure containing one repeating unit represented by the following formula (A-6). The structure of each repeating unit was confirmed from the 1 H-NMR spectrum.
  • composition ratio (mol%) The content (composition ratio (mol%)) of each repeating unit in each polyimide precursor is shown below.
  • D-1 The structure of D-1 is shown in the following formula (D-1).
  • 1 H-NMR BRUKER, AVANCE NEO 400
  • Synthesis Example D-10 Synthesis of radically polymerizable compound (D-10)]
  • Synthesis Example D-1 2-(4-aminophenyl)ethyl alcohol was added to the same molar amount of 1,4-bis(4-aminophenoxy)benzene, and Karenz MOI was added to the same molar amount of Karenz MOI-EG (Showa Denko).
  • D-10 was obtained in the same manner except that the solution was replaced with (manufactured by Co., Ltd.).
  • D-10 to D-15 are shown below as formulas (D-10) to (D-15), respectively.
  • Examples and comparative examples> In each Example, the components listed in the table below were mixed to obtain each resin composition. In addition, in a comparative example, the components listed in the table below were mixed to obtain a comparative composition. Specifically, the content (compounding amount) of each component listed in the table other than the solvent was the amount (parts by mass) listed in the "parts by mass” column in each column of the table. The content (compounding amount) of the solvent is determined so that the solid content concentration of the composition is the value of "solid content concentration" (mass %) in the table, and the ratio of the content of each solvent to the total mass of the solvent (mass %) is determined. The ratio) was set to be the ratio described in the "Ratio" column in the table.
  • the obtained resin composition and comparative composition were pressure-filtered using a polytetrafluoroethylene filter with a pore width of 0.8 ⁇ m. Furthermore, in the table, the description "-" indicates that the composition does not contain the corresponding component. For example, in the column of "polymerizable compound”, the description of "type”"D-1(0.5)/CD-2(0.5)" and “parts by mass”"13.1” is different from D-1 and CD-2. This means that a total of 13.1 parts by mass was used at a mass ratio of 0.5:0.5.
  • ⁇ G-1 to G-4 Compounds with the following structure.
  • Et represents an ethyl group.
  • ⁇ G-6: KR-513 manufactured by Shin-Etsu Chemical Co., Ltd.
  • ⁇ SP of each resin composition or comparative composition used in the Examples or Comparative Examples is shown in the table below. Details of SPA, SPB, and ⁇ SP are as described above. The unit of numerical values in the table below is MPa 1/2 .
  • the SP value of each polymerizable compound is as follows.
  • the unit of numerical values in the table below is MPa 1/2 .
  • each resin composition or comparative composition was applied in a layered manner onto a silicon wafer by spin coating to form a resin composition layer or a comparative composition layer.
  • the silicon wafer to which the obtained resin composition layer or comparative composition layer was applied was dried on a hot plate at 100°C for 5 minutes, and the silicon wafer was coated with the film thickness ( ⁇ m) described in the column of the table.
  • a resin composition layer having a uniform thickness or a comparative composition layer was used.
  • the resin composition layer or comparative composition layer on the silicon wafer was exposed using a stepper (Nikon NSR 2005 i9C) with an exposure energy of 500 mJ/cm 2 .
  • the exposed resin composition layer or comparative composition layer was heated at a rate of 10°C/min in a nitrogen atmosphere using a hot plate, and After reaching the stated temperature, this temperature was maintained for the time stated in "Cure time (min)" in the table to obtain a cured resin layer.
  • the cured resin layer was immersed in a 4.9% by mass hydrofluoric acid solution, and the resin layer was peeled off from the silicon wafer to obtain a resin film 1.
  • the resin film 1 was punched out using a puncher to produce a film having a sample width of 10 mm and a sample length of 50 mm.
  • the elongation at break of the above film was determined using a tensile tester (Tensilon) at a crosshead speed of 300 mm/min, in the longitudinal direction and width direction of the film, under an environment of 25°C and 65% relative humidity (RH). -Elongation at break was measured in accordance with K6251:2017.
  • the Young's modulus of the test piece prepared in the above evaluation of elongation at break was determined using a tensile tester (Tensilon) at a crosshead speed of 5 mm/min, 25°C, and an environment of 65% RH (relative humidity) according to JIS K. 7161 (2014). The measurements were performed five times each, and the arithmetic mean value of Young's modulus (tensile modulus) when the test piece broke in the five measurements was used as an index value. The evaluation results are listed in the "Young's modulus" column of the table. (Evaluation criteria) A: Young's modulus was 4.5 GPa or more. B: Young's modulus was 3.5 GPa or more and less than 4.5 GPa. C: Young's modulus was less than 3.5 GPa.
  • the resin composition or comparative composition prepared in each Example and Comparative Example was applied in a layered manner onto a copper substrate by a spin coating method to form a resin composition layer or a comparative composition layer.
  • the copper substrate on which the obtained resin composition layer or comparative composition layer was formed was dried on a hot plate at 100°C for 5 minutes, and the film thickness ( ⁇ m) described in the column of the table was applied to the copper substrate.
  • a resin composition layer or a comparative composition layer having a uniform thickness was used.
  • the resin composition layer or the comparative composition layer on the copper substrate was exposed to an exposure energy of 500 mJ/cm 2 using a photomask in which a 100 ⁇ m square non-mask portion was formed. A 100 ⁇ m square area was exposed to i-line using a A square resin layer was obtained. Furthermore, the resin was heated in a heating oven at the temperature listed in the "Cure temperature (°C)" column in the table and for the time listed in the "Cure time (min)” column in the table under a nitrogen atmosphere. A layer (pattern) was formed. The resin layer was placed in a tank at a temperature of 121° C./relative humidity of 100% RH for 250 hours.
  • void area ratio (area of voids observed by SEM measurement) / (total area of resin layer) x 100 Based on the value of the void area ratio obtained, evaluation was performed according to the following evaluation criteria. It can be said that the smaller the void area ratio is, the better the PCT (moist heat) resistance of the cured film is, and it can be said that voids are less likely to form between the metal layer and the cured product even after a long period of time. The evaluation results are listed in the "PCT (moist heat resistance)" column of the table. A: The void area ratio was 0.5% or less. B: The void area ratio was more than 0.5% and less than 2%. C: The void area ratio exceeded 2%.
  • Example 101 Using the resin composition prepared in Example 1, elongation at break was conducted under the same conditions as in Example 1, except that the above-mentioned post-exposure heating was performed using an infrared lamp heating device (manufactured by Advance Riko Co., Ltd., RTP-6). , Young's modulus and peeling rate after PCT (PCT (moist heat resistance)) were evaluated. The same results as in Example 1 were obtained in terms of elongation at break, Young's modulus, and PCT (moist heat resistance).
  • Example 102 Same as Example 1 except that the polymerization inhibitor E-1 and silane coupling agent G-1 were excluded and the amount of resin A-1 was changed from 80 parts by mass to 82.2 parts by mass.
  • a resin composition was prepared by the method described in the following. Using the above resin composition, elongation at break, Young's modulus, and PCT (moist heat resistance) were evaluated in the same manner as in Example 1, and results similar to those in Example 1 were obtained in all evaluation items. .
  • Example 103 The method was the same as in Example 1 except that the resin composition prepared in Example 1 was used and the exposure means in the above exposure was changed from a stepper (Nikon NSR 2005 i9C) to a direct exposure device (Adtech DE-6UH III). The elongation at break, Young's modulus, and PCT (moist heat resistance) were evaluated. Results similar to those in Example 1 were obtained in all evaluation items.
  • the comparative composition according to Comparative Example 1 does not contain a polyimide precursor containing a repeating unit represented by formula (1). It can be seen that for such comparative compositions, the obtained cured products are inferior in elongation at break.
  • the comparative composition according to Comparative Example 2 has a ⁇ SP of -3.5 MPa 1/2 or less. It can be seen that for such comparative compositions, the obtained cured products are inferior in elongation at break.
  • the comparative composition according to Comparative Example 3 has a ⁇ SP of 5.0 MPa 1/2 or more. It can be seen that for such comparative compositions, the obtained cured products are inferior in elongation at break.
  • Example 201 The resin composition used in Example 1 was applied in a layered manner by spin coating to the surface of the thin copper layer of the resin base material on which the thin copper layer was formed, and dried at 100°C for 5 minutes to determine the film thickness. After forming a 20 ⁇ m photoresist film, it was exposed using a stepper (NSR1505 i6, manufactured by Nikon Corporation). Exposure was performed at a wavelength of 365 nm through a mask (a binary mask with a 1:1 line-and-space pattern and a line width of 10 ⁇ m). After the above exposure, it was developed with cyclopentanone for 2 minutes and rinsed with PGMEA for 30 seconds to obtain a layer pattern.
  • NSR1505 i6 a binary mask with a 1:1 line-and-space pattern and a line width of 10 ⁇ m
  • the temperature was raised at a rate of 10° C./min in a nitrogen atmosphere, and after reaching 230° C., the temperature was maintained at 230° C. for 180 minutes to form an interlayer insulating film for a rewiring layer.
  • This interlayer insulating film for rewiring layer had excellent insulation properties. Furthermore, when a semiconductor device was manufactured using this interlayer insulating film for a rewiring layer, it was confirmed that it operated without any problems.

Abstract

Provided are: a resin composition including a polyimide precursor containing a repeating unit represented by formula (1) and a radical polymerizable compound, wherein ΔSP calculated by the following formula (S) is more than -3.5 MPa1/2 and less than 5.0 MPa1/2; a cured product; a laminate; a method for producing a cured product; a method for producing a laminate; a method for producing a semiconductor device; and a semiconductor device. Formula (S): ΔSP = (solubility parameter SPB of the radically polymerizable compound) - (solubility parameter SPA of the polyimide precursor).

Description

樹脂組成物、硬化物、積層体、硬化物の製造方法、積層体の製造方法、半導体デバイスの製造方法、及び、半導体デバイスResin composition, cured product, laminate, method for producing cured product, method for producing laminate, method for producing semiconductor device, and semiconductor device
　本発明は、樹脂組成物、硬化物、積層体、硬化物の製造方法、積層体の製造方法、半導体デバイスの製造方法、及び、半導体デバイスに関する。 The present invention relates to a resin composition, a cured product, a laminate, a method for producing a cured product, a method for producing a laminate, a method for producing a semiconductor device, and a semiconductor device.
　現代では様々な分野において、樹脂を含む樹脂組成物から製造された樹脂材料を活用することが行われている。
　例えば、ポリイミドは、耐熱性及び絶縁性等に優れるため、様々な用途に適用されている。上記用途としては、特に限定されないが、実装用の半導体デバイスを例に挙げると、絶縁膜や封止材の材料、又は、保護膜としての利用が挙げられる。また、フレキシブル基板のベースフィルムやカバーレイなどとしても用いられている。 BACKGROUND ART Nowadays, resin materials manufactured from resin compositions containing resin are utilized in various fields.
For example, polyimide has excellent heat resistance and insulation properties, so it is used in a variety of applications. The above-mentioned uses are not particularly limited, but in the case of semiconductor devices for mounting, for example, they may be used as materials for insulating films and sealing materials, or as protective films. It is also used as a base film and coverlay for flexible substrates.
　例えば上述した用途において、ポリイミドは、ポリイミド前駆体を含む樹脂組成物の形態で用いられる。
　このような樹脂組成物を、例えば塗布等により基材に適用して感光膜を形成し、その後、必要に応じて露光、現像、加熱等を行うことにより、硬化物を基材上に形成することができる。
　ポリイミド前駆体は、例えば加熱により環化され、硬化物中でポリイミドとなる。
　樹脂組成物は、公知の塗布方法等により適用可能であるため、例えば、適用される樹脂組成物の適用時の形状、大きさ、適用位置等の設計の自由度が高いなど、製造上の適応性に優れるといえる。ポリイミドが有する高い性能に加え、このような製造上の適応性に優れる観点から、上述の樹脂組成物の産業上の応用展開がますます期待されている。 For example, in the above-mentioned applications, polyimide is used in the form of a resin composition containing a polyimide precursor.
Such a resin composition is applied to a base material by coating, for example, to form a photosensitive film, and then, as necessary, exposure, development, heating, etc. are performed to form a cured product on the base material. be able to.
The polyimide precursor is cyclized, for example, by heating, and becomes polyimide in the cured product.
Since the resin composition can be applied by known coating methods, there is a high degree of freedom in designing the shape, size, application position, etc. of the resin composition when it is applied. It can be said that it has excellent characteristics. In addition to the high performance of polyimide, there are increasing expectations for the industrial application of the above-mentioned resin composition due to its excellent manufacturing adaptability.
　例えば、特許文献１には、（Ａ）特定の構造単位を含むポリイミド前駆体、（Ｂ）ウレタン結合、及びウレア結合から成る群から選択される少なくとも１種を含む化合物、（Ｃ）光重合開始剤、並びに（Ｄ）３つ以上の重合性官能基を有する重合性不飽和モノマーを含む、ネガ型感光性樹脂組成物が記載されている。 For example, Patent Document 1 describes (A) a polyimide precursor containing a specific structural unit, (B) a compound containing at least one selected from the group consisting of a urethane bond and a urea bond, and (C) photopolymerization initiation. and (D) a polymerizable unsaturated monomer having three or more polymerizable functional groups.
特開２０２１－１２０６９７号公報JP 2021-120697 Publication
　硬化物を得るための樹脂組成物については、この組成物から得られる硬化物が破断伸びに優れていることが求められている。 Regarding the resin composition for obtaining a cured product, it is required that the cured product obtained from this composition has excellent elongation at break.
　本発明は、破断伸びに優れた硬化物が得られる樹脂組成物、上記樹脂組成物を硬化してなる硬化物、上記硬化物を含む積層体、上記硬化物の製造方法、上記積層体の製造方法、上記積層体の製造方法を含む半導体デバイスの製造方法、及び、上記硬化物又は上記積層体を含む半導体デバイスを提供することを目的とする。 The present invention relates to a resin composition that yields a cured product with excellent elongation at break, a cured product obtained by curing the resin composition, a laminate containing the cured product, a method for producing the cured product, and a method for producing the laminate. The present invention aims to provide a method for manufacturing a semiconductor device, including a method for manufacturing the laminate, and a semiconductor device including the cured product or the laminate.
　本発明の代表的な実施態様の例を以下に示す。
＜１＞　式（１）で表される繰返し単位を含むポリイミド前駆体と、
　ラジカル重合性化合物と、を含有し、
　下記式（Ｓ）により算出されるΔＳＰが－３．５ＭＰａ１／２を超え５．０ＭＰａ１／２未満である
　樹脂組成物。

　式（１）中、Ａ１及びＡ２はそれぞれ独立に、酸素原子又は－ＮＲＺ－であり、ＲＺは水素原子又は１価の有機基であり、Ｒ１及びＲ２はそれぞれ独立に、水素原子又は１価の有機基であり、Ｒ１及びＲ２の少なくとも１つはエチレン性不飽和結合を有する１価の有機基であり、Ｘ１はベンゼン環構造を有する４価の有機基であり、Ｙ１は下記式（Ｙ－１）で表される２価の有機基である。

　式（Ｙ－１）中、Ｒ３～Ｒ１０はそれぞれ独立に、水素原子又は１価の基であり、Ｒ３～Ｒ１０のうち少なくとも１つはアルキル基、フッ素原子又はトリフルオロメチル基であり、＊はそれぞれ、式（１）中の窒素原子との結合部位を表す。
＜２＞　上記ポリイミド前駆体が、式（１）で表される繰返し単位として、式（１）における上記Ｘ１がエーテル結合を２個以上有する繰返し単位を含む、＜１＞に記載の樹脂組成物。
＜３＞　上記ポリイミド前駆体が、式（１）で表される繰返し単位として、式（１）における上記Ｘ１がベンゼン環構造を３個以上有する繰返し単位を含む、＜１＞又は＜２＞に記載の樹脂組成物。
＜４＞　上記ポリイミド前駆体が、式（１）で表される繰返し単位として、式（１）における上記Ｘ１が下記式（ａ）又は下記式（ｂ）で表される構造である繰返し単位を含む、＜１＞～＜３＞のいずれか１つに記載の樹脂組成物。
　式（ａ）中、Ｒａ１はそれぞれ独立に、１価の基を表し、ｍ１は０～３の整数を表し、Ｒａ２はそれぞれ独立に、１価の基を表し、ｍ２は０～４の整数を表し、Ｒａ３はそれぞれ独立に、１価の基を表し、ｍ３は０～３の整数を表し、＊１～＊４はそれぞれ式（１）中のカルボニル基との結合部位を表す。
　式（ｂ）中、Ｒｂ１はそれぞれ独立に、１価の基を表し、ｎ１は０～３の整数を表し、Ｒｂ２はそれぞれ独立に、１価の基を表し、ｎ２は０～４の整数を表し、Ｒｂ３はそれぞれ独立に、１価の基を表し、ｎ３は０～４の整数を表し、Ｒｂ４はそれぞれ独立に、１価の基を表し、ｎ４は０～３の整数を表し、Ｊ１及びＪ２はそれぞれ独立に、水素原子、アルキル基又はトリフルオロメチル基を表し、＊１～＊４はそれぞれ式（１）中のカルボニル基との結合部位を表す。
＜５＞　上記ポリイミド前駆体が、式（１）で表される繰返し単位として、式（１）における上記Ｘ１が下記式（２ａ）～式（２ｄ）のいずれかで表される構造である繰返し単位を含む、＜１＞～＜４＞のいずれか１つに記載の樹脂組成物。

　式（２ａ）～式（２ｄ）中、Ｌ１及びＬ２はそれぞれ独立に、それぞれが結合するベンゼン環と共役しない２価の基、又は、単結合であり、＊１～＊４はそれぞれ式（１）中のカルボニル基との結合部位を表す。
＜６＞　上記ポリイミド前駆体の溶解度パラメータＳＰＡが２１．５ＭＰａ１／２以下である、＜１＞～＜４＞のいずれか１つに記載の樹脂組成物。
＜７＞　上記ポリイミド前駆体の溶解度パラメータＳＰＡが２０．７ＭＰａ１／２以下である、＜１＞～＜６＞のいずれか１つに記載の樹脂組成物。
＜８＞　上記ラジカル重合性化合物として、ウレア結合、ウレタン結合、及び、アミド結合よりなる群から得られた少なくとも１種の構造を有する重合性化合物を含む、＜１＞～＜７＞のいずれか１つに記載の樹脂組成物。
＜９＞　上記ラジカル重合性化合物として、２官能ラジカル重合性化合物を含む、＜１＞～＜８＞のいずれか１つに記載の樹脂組成物。
＜１０＞　アゾール構造を有する化合物を更に含む、＜１＞～＜９＞のいずれか１つに記載の樹脂組成物。
＜１１＞　再配線層用層間絶縁膜の形成に用いられる、＜１＞～＜１０＞のいずれか１つに記載の樹脂組成物。
＜１２＞　＜１＞～＜１１＞のいずれか１つに記載の樹脂組成物を硬化してなる硬化物。
＜１３＞　＜１２＞に記載の硬化物からなる層を２層以上含み、上記硬化物からなる層同士のいずれかの間に金属層を含む積層体。
＜１４＞　＜１＞～＜１１＞のいずれか１つに記載の樹脂組成物を基材上に適用して膜を形成する膜形成工程を含む、硬化物の製造方法。
＜１５＞　上記膜を選択的に露光する露光工程及び上記膜を現像液を用いて現像してパターンを形成する現像工程を含む、＜１４＞に記載の硬化物の製造方法。
＜１６＞　上記膜を５０～４５０℃で加熱する加熱工程を含む、＜１４＞又は＜１５＞に記載の硬化物の製造方法。
＜１７＞　＜１４＞～＜１６＞のいずれか１つに記載の硬化物の製造方法を含む、積層体の製造方法。
＜１８＞　＜１４＞～＜１６＞のいずれか１つに記載の硬化物の製造方法、又は、＜１７＞に記載の積層体の製造方法を含む、半導体デバイスの製造方法。
＜１９＞　＜１２＞に記載の硬化物又は＜１３＞に記載の積層体を含む、半導体デバイス。 Examples of representative embodiments of the invention are shown below.
<1> A polyimide precursor containing a repeating unit represented by formula (1),
containing a radically polymerizable compound,
A resin composition whose ΔSP calculated by the following formula (S) is more than -3.5 MPa 1/2 and less than 5.0 MPa 1/2 .

In formula (1), A 1 and A 2 are each independently an oxygen atom or -NR Z -, R Z is a hydrogen atom or a monovalent organic group, and R 1 and R 2 are each independently, is a hydrogen atom or a monovalent organic group, at least one of R 1 and R 2 is a monovalent organic group having an ethylenically unsaturated bond, and X 1 is a tetravalent organic group having a benzene ring structure. Y 1 is a divalent organic group represented by the following formula (Y-1).

In formula (Y-1), R 3 to R 10 are each independently a hydrogen atom or a monovalent group, and at least one of R 3 to R 10 is an alkyl group, a fluorine atom, or a trifluoromethyl group. and * each represent a bonding site with the nitrogen atom in formula (1).
<2> The resin composition according to <1>, wherein the polyimide precursor contains, as a repeating unit represented by formula (1), a repeating unit in which X 1 in formula (1) has two or more ether bonds. thing.
<3><1> or <2>, wherein the polyimide precursor contains a repeating unit represented by formula (1) in which X 1 in formula (1) has three or more benzene ring structures; The resin composition described in .
<4> The polyimide precursor has a structure in which the above X 1 in formula (1) is represented by the following formula (a) or the following formula (b) as a repeating unit represented by formula (1). The resin composition according to any one of <1> to <3>, comprising:
In formula (a), R a1 each independently represents a monovalent group, m1 represents an integer of 0 to 3, R a2 each independently represents a monovalent group, and m2 represents a monovalent group of 0 to 4. represents an integer, R a3 each independently represents a monovalent group, m3 represents an integer of 0 to 3, and *1 to *4 each represent a bonding site with the carbonyl group in formula (1).
In formula (b), R b1 each independently represents a monovalent group, n1 represents an integer of 0 to 3, R b2 each independently represents a monovalent group, and n2 represents a monovalent group of 0 to 4. represents an integer, R b3 each independently represents a monovalent group, n3 represents an integer from 0 to 4, R b4 each independently represents a monovalent group, and n4 represents an integer from 0 to 3. where J 1 and J 2 each independently represent a hydrogen atom, an alkyl group or a trifluoromethyl group, and *1 to *4 each represent a bonding site with a carbonyl group in formula (1).
<5> The polyimide precursor has a structure in which, as a repeating unit represented by formula (1), the above X 1 in formula (1) is represented by any of the following formulas (2a) to (2d). The resin composition according to any one of <1> to <4>, which contains a repeating unit.

In formulas (2a) to (2d), L 1 and L 2 are each independently a divalent group or a single bond that is not conjugated with the benzene ring to which they are bonded, and *1 to *4 are each represented by the formula Represents the bonding site with the carbonyl group in (1).
<6> The resin composition according to any one of <1> to <4>, wherein the polyimide precursor has a solubility parameter SPA of 21.5 MPa 1/2 or less.
<7> The resin composition according to any one of <1> to <6>, wherein the polyimide precursor has a solubility parameter SPA of 20.7 MPa 1/2 or less.
<8> Any one of <1> to <7>, wherein the radically polymerizable compound includes a polymerizable compound having at least one type of structure obtained from the group consisting of a urea bond, a urethane bond, and an amide bond. 1. The resin composition according to item 1.
<9> The resin composition according to any one of <1> to <8>, which contains a bifunctional radically polymerizable compound as the radically polymerizable compound.
<10> The resin composition according to any one of <1> to <9>, further comprising a compound having an azole structure.
<11> The resin composition according to any one of <1> to <10>, which is used for forming an interlayer insulating film for a rewiring layer.
<12> A cured product obtained by curing the resin composition according to any one of <1> to <11>.
<13> A laminate including two or more layers made of the cured product according to <12>, and a metal layer between any of the layers made of the cured product.
<14> A method for producing a cured product, comprising a film forming step of applying the resin composition according to any one of <1> to <11> onto a substrate to form a film.
<15> The method for producing a cured product according to <14>, comprising an exposure step of selectively exposing the film and a development step of developing the film using a developer to form a pattern.
<16> The method for producing a cured product according to <14> or <15>, which includes a heating step of heating the film at 50 to 450°C.
<17> A method for producing a laminate, including the method for producing a cured product according to any one of <14> to <16>.
<18> A method for manufacturing a semiconductor device, including the method for manufacturing a cured product according to any one of <14> to <16> or the method for manufacturing a laminate according to <17>.
<19> A semiconductor device comprising the cured product according to <12> or the laminate according to <13>.
　本発明によれば、破断伸びに優れた硬化物が得られる樹脂組成物、上記樹脂組成物を硬化してなる硬化物、上記硬化物を含む積層体、上記硬化物の製造方法、上記積層体の製造方法、上記積層体の製造方法を含む半導体デバイスの製造方法、及び、上記硬化物又は上記積層体を含む半導体デバイスが提供される。 According to the present invention, a resin composition that yields a cured product with excellent elongation at break, a cured product obtained by curing the resin composition, a laminate containing the cured product, a method for producing the cured product, and the laminate A method for manufacturing a semiconductor device including the method for manufacturing the laminate, and a semiconductor device including the cured product or the laminate are provided.
　以下、本発明の主要な実施形態について説明する。しかしながら、本発明は、明示した実施形態に限られるものではない。
　本明細書において「～」という記号を用いて表される数値範囲は、「～」の前後に記載される数値をそれぞれ下限値及び上限値として含む範囲を意味する。
　本明細書において「工程」との語は、独立した工程だけではなく、その工程の所期の作用が達成できる限りにおいて、他の工程と明確に区別できない工程も含む意味である。
　本明細書における基（原子団）の表記において、置換及び無置換を記していない表記は、置換基を有しない基（原子団）と共に置換基を有する基（原子団）をも包含する。例えば、「アルキル基」とは、置換基を有しないアルキル基（無置換アルキル基）のみならず、置換基を有するアルキル基（置換アルキル基）をも包含する。
　本明細書において「露光」とは、特に断らない限り、光を用いた露光のみならず、電子線、イオンビーム等の粒子線を用いた露光も含む。また、露光に用いられる光としては、水銀灯の輝線スペクトル、エキシマレーザーに代表される遠紫外線、極紫外線（ＥＵＶ光）、Ｘ線、電子線等の活性光線又は放射線が挙げられる。
　本明細書において、「（メタ）アクリレート」は、「アクリレート」及び「メタクリレート」の両方、又は、いずれかを意味し、「（メタ）アクリル」は、「アクリル」及び「メタクリル」の両方、又は、いずれかを意味し、「（メタ）アクリロイル」は、「アクリロイル」及び「メタクリロイル」の両方、又は、いずれかを意味する。
　本明細書において、構造式中のＭｅはメチル基を表し、Ｅｔはエチル基を表し、Ｂｕはブチル基を表し、Ｐｈはフェニル基を表す。
　本明細書において、全固形分とは、組成物の全成分から溶剤を除いた成分の総質量をいう。また本明細書において、固形分濃度とは、組成物の総質量に対する、溶剤を除く他の成分の質量百分率である。
　本明細書において、重量平均分子量（Ｍｗ）及び数平均分子量（Ｍｎ）は、特に述べない限り、ゲル浸透クロマトグラフィ（ＧＰＣ）法を用いて測定した値であり、ポリスチレン換算値として定義される。本明細書において、重量平均分子量（Ｍｗ）及び数平均分子量（Ｍｎ）は、例えば、ＨＬＣ－８２２０ＧＰＣ（東ソー（株）製）を用い、カラムとしてガードカラムＨＺ－Ｌ、ＴＳＫｇｅｌ　Ｓｕｐｅｒ　ＨＺＭ－Ｍ、ＴＳＫｇｅｌ　Ｓｕｐｅｒ　ＨＺ４０００、ＴＳＫｇｅｌ　Ｓｕｐｅｒ　ＨＺ３０００、及び、ＴＳＫｇｅｌ　Ｓｕｐｅｒ　ＨＺ２０００（以上、東ソー（株）製）を直列に連結して用いることによって求めることができる。それらの分子量は特に述べない限り、溶離液としてＴＨＦ（テトラヒドロフラン）を用いて測定したものとする。ただし、溶解性が低い場合など、溶離液としてＴＨＦが適していない場合にはＮＭＰ（Ｎ－メチル－２－ピロリドン）を用いることもできる。また、ＧＰＣ測定における検出は特に述べない限り、ＵＶ線（紫外線）の波長２５４ｎｍ検出器を使用したものとする。
　本明細書において、積層体を構成する各層の位置関係について、「上」又は「下」と記載したときには、注目している複数の層のうち基準となる層の上側又は下側に他の層があればよい。すなわち、基準となる層と上記他の層の間に、更に第３の層や要素が介在していてもよく、基準となる層と上記他の層は接している必要はない。特に断らない限り、基材に対し層が積み重なっていく方向を「上」と称し、又は、樹脂組成物層がある場合には、基材から樹脂組成物層へ向かう方向を「上」と称し、その反対方向を「下」と称する。なお、このような上下方向の設定は、本明細書中における便宜のためであり、実際の態様においては、本明細書における「上」方向は、鉛直上向きと異なることもありうる。
　本明細書において、特段の記載がない限り、組成物は、組成物に含まれる各成分として、その成分に該当する２種以上の化合物を含んでもよい。また、特段の記載がない限り、組成物における各成分の含有量とは、その成分に該当する全ての化合物の合計含有量を意味する。
　本明細書において、特に述べない限り、温度は２３℃、気圧は１０１，３２５Ｐａ（１気圧）、相対湿度は５０％ＲＨである。
　本明細書において、好ましい態様の組み合わせは、より好ましい態様である。 Main embodiments of the present invention will be described below. However, the invention is not limited to the illustrated embodiments.
In this specification, a numerical range expressed using the symbol "~" means a range that includes the numerical values written before and after "~" as the lower limit and upper limit, respectively.
As used herein, the term "step" includes not only independent steps but also steps that cannot be clearly distinguished from other steps as long as the intended effect of the step can be achieved.
In the description of a group (atomic group) in this specification, the description that does not indicate substitution or unsubstitution includes a group having a substituent (atomic group) as well as a group having no substituent (atomic group). For example, "alkyl group" includes not only an alkyl group without a substituent (unsubstituted alkyl group) but also an alkyl group having a substituent (substituted alkyl group).
In this specification, "exposure" includes not only exposure using light but also exposure using particle beams such as electron beams and ion beams, unless otherwise specified. Examples of the light used for exposure include actinic rays or radiation such as the bright line spectrum of a mercury lamp, far ultraviolet rays typified by excimer lasers, extreme ultraviolet rays (EUV light), X-rays, and electron beams.
As used herein, "(meth)acrylate" means both "acrylate" and "methacrylate", or either "(meth)acrylate", and "(meth)acrylic" means both "acrylic" and "methacrylic", or , and "(meth)acryloyl" means either or both of "acryloyl" and "methacryloyl."
In this specification, Me in the structural formula represents a methyl group, Et represents an ethyl group, Bu represents a butyl group, and Ph represents a phenyl group.
In this specification, the total solid content refers to the total mass of all components of the composition excluding the solvent. Further, in this specification, the solid content concentration is the mass percentage of other components excluding the solvent with respect to the total mass of the composition.
In this specification, unless otherwise stated, weight average molecular weight (Mw) and number average molecular weight (Mn) are values measured using gel permeation chromatography (GPC), and are defined as polystyrene equivalent values. In this specification, weight average molecular weight (Mw) and number average molecular weight (Mn) are expressed using, for example, HLC-8220GPC (manufactured by Tosoh Corporation) and guard column HZ-L, TSKgel Super HZM-M, TSKgel. It can be determined by using Super HZ4000, TSKgel Super HZ3000, and TSKgel Super HZ2000 (all manufactured by Tosoh Corporation) connected in series. Unless otherwise stated, those molecular weights are measured using THF (tetrahydrofuran) as an eluent. However, if THF is not suitable as an eluent, such as when the solubility is low, NMP (N-methyl-2-pyrrolidone) can also be used. Furthermore, unless otherwise specified, a detector with a wavelength of 254 nm of UV rays (ultraviolet rays) is used for detection in the GPC measurement.
In this specification, when the positional relationship of each layer constituting a laminate is described as "upper" or "lower", there is another layer above or below the reference layer among the plurality of layers of interest. It would be good if there was. That is, a third layer or element may be further interposed between the reference layer and the other layer, and the reference layer and the other layer do not need to be in contact with each other. Unless otherwise specified, the direction in which layers are stacked relative to the base material is referred to as "top", or if there is a resin composition layer, the direction from the base material to the resin composition layer is referred to as "top". , the opposite direction is called "down". Note that such a setting in the vertical direction is for convenience in this specification, and in an actual embodiment, the "up" direction in this specification may be different from vertically upward.
In this specification, unless otherwise specified, the composition may contain, as each component contained in the composition, two or more compounds corresponding to that component. Further, unless otherwise specified, the content of each component in the composition means the total content of all compounds corresponding to that component.
In this specification, unless otherwise stated, the temperature is 23° C., the atmospheric pressure is 101,325 Pa (1 atm), and the relative humidity is 50% RH.
In this specification, combinations of preferred aspects are more preferred aspects.
（樹脂組成物）
　本発明の樹脂組成物は、式（１）で表される繰返し単位を含むポリイミド前駆体と、ラジカル重合性化合物と、を含有し、下記式（Ｓ）により算出されるΔＳＰが－３．５ＭＰａ１／２を超え５．０ＭＰａ１／２未満である。

　式（１）中、Ａ１及びＡ２はそれぞれ独立に、酸素原子又は－ＮＲＺ－であり、ＲＺは水素原子又は１価の有機基であり、Ｒ１及びＲ２はそれぞれ独立に、水素原子又は１価の有機基であり、Ｒ１及びＲ２の少なくとも１つはエチレン性不飽和結合を有する１価の有機基であり、Ｘ１はベンゼン環構造を有する４価の有機基であり、Ｙ１は下記式（Ｙ－１）で表される２価の有機基である。

　式（Ｙ－１）中、Ｒ３～Ｒ１０はそれぞれ独立に、水素原子又は１価の基であり、Ｒ３～Ｒ１０のうち少なくとも１つはアルキル基、フッ素原子又はトリフルオロメチル基であり、＊はそれぞれ、式（１）中の窒素原子との結合部位を表す。
(Resin composition)
The resin composition of the present invention contains a polyimide precursor containing a repeating unit represented by formula (1) and a radically polymerizable compound, and has a ΔSP of -3.5 MPa calculated by the following formula (S). It is more than 1/2 and less than 5.0 MPa 1/2 .

In formula (1), A 1 and A 2 are each independently an oxygen atom or -NR Z -, R Z is a hydrogen atom or a monovalent organic group, and R 1 and R 2 are each independently, is a hydrogen atom or a monovalent organic group, at least one of R 1 and R 2 is a monovalent organic group having an ethylenically unsaturated bond, and X 1 is a tetravalent organic group having a benzene ring structure. Y 1 is a divalent organic group represented by the following formula (Y-1).

In formula (Y-1), R 3 to R 10 are each independently a hydrogen atom or a monovalent group, and at least one of R 3 to R 10 is an alkyl group, a fluorine atom, or a trifluoromethyl group. and * each represent a bonding site with the nitrogen atom in formula (1).
　本発明の樹脂組成物は、露光及び現像に供される感光膜の形成に用いられることが好ましく、露光及び有機溶剤を含む現像液を用いた現像に供される膜の形成に用いられることが好ましい。
　本発明の樹脂組成物は、例えば、半導体デバイスの絶縁膜、再配線層用層間絶縁膜、ストレスバッファ膜等の形成に用いることができ、再配線層用層間絶縁膜の形成に用いられることが好ましい。
　特に、本発明の樹脂組成物が、再配線層用層間絶縁膜の形成に用いられることも、本発明の好ましい態様の１つである。
　また、本発明の樹脂組成物は、ネガ型現像に供される感光膜の形成に用いられることが好ましい。
　本発明において、ネガ型現像とは、露光及び現像において、現像により非露光部が除去される現像をいい、ポジ型現像とは、現像により露光部が除去される現像をいう。
　上記露光の方法、上記現像液、及び、上記現像の方法としては、例えば、後述する硬化物の製造方法の説明における露光工程において説明された露光方法、現像工程において説明された現像液及び現像方法が使用される。 The resin composition of the present invention is preferably used to form a photosensitive film that is subjected to exposure and development, and is preferably used to form a film that is subjected to exposure and development using a developer containing an organic solvent. preferable.
The resin composition of the present invention can be used, for example, to form an insulating film of a semiconductor device, an interlayer insulating film for a rewiring layer, a stress buffer film, etc., and can be used for forming an interlayer insulating film for a rewiring layer. preferable.
In particular, it is one of the preferred embodiments of the present invention that the resin composition of the present invention is used for forming an interlayer insulating film for a rewiring layer.
Further, the resin composition of the present invention is preferably used for forming a photosensitive film subjected to negative development.
In the present invention, negative development refers to development in which non-exposed areas are removed by development during exposure and development, and positive development refers to development in which exposed areas are removed by development.
The above-mentioned exposure method, the above-mentioned developer, and the above-mentioned development method include, for example, the exposure method explained in the exposure step in the explanation of the method for producing a cured product, and the developer and development method explained in the development step. is used.
　本発明の樹脂組成物によれば、破断伸びに優れた硬化膜が得られる。
　上記効果が得られるメカニズムは不明であるが、下記のように推測される。 According to the resin composition of the present invention, a cured film with excellent elongation at break can be obtained.
Although the mechanism by which the above effects are obtained is unknown, it is assumed as follows.
　従来から、ポリイミド前駆体及びラジカル重合性化合物を含む樹脂組成物を用い、組成物から得られた硬化物を例えば層間絶縁膜等の用途に用いることが行われてきた。
　本発明におけるポリイミド前駆体は、式（１）で表される繰返し単位を有する。
　このようなポリイミド前駆体から得られるポリイミドは剛直であり、ヤング率が高いものであるが、Ｙ１及びＲ１又はＲ２におけるエチレン性不飽和結合を含む構造等が疎水的であり、従来の重合性化合物と併用した場合には、破断伸び等の性能に改善の余地が有った。
　本発明者らの検討により、上記式（Ｓ）で表される溶解度パラメータ（ＳＰ値）の差（ΔＳＰ）が－３．５ＭＰａ１／２を超え５．０ＭＰａ１／２未満である場合に、得られる硬化物の破断伸びが向上することが分かった。
　上記効果が得られるメカニズムは不明であるが、以下のように推定している。
　本発明においては、ΔＳＰが－３．５ＭＰａ１／２を超え５．０ＭＰａ１／２未満であることにより、ポリイミド前駆体とラジカル重合性化合物とが十分に混ざり合った状態で硬化して硬化物が得られる。このような均質性の高い硬化物は伸びなどの変形時にクラックが入りにくくなり、破断伸びが向上すると考えられる。 BACKGROUND ART Conventionally, a resin composition containing a polyimide precursor and a radically polymerizable compound has been used, and a cured product obtained from the composition has been used, for example, as an interlayer insulating film.
The polyimide precursor in the present invention has a repeating unit represented by formula (1).
Polyimide obtained from such a polyimide precursor is rigid and has a high Young's modulus, but the structure containing an ethylenically unsaturated bond in Y 1 and R 1 or R 2 is hydrophobic, making it difficult to use conventional polyimide. When used in combination with a polymerizable compound, there was room for improvement in performance such as elongation at break.
According to the studies of the present inventors, when the difference (ΔSP) in the solubility parameter (SP value) expressed by the above formula (S) is more than -3.5 MPa 1/2 and less than 5.0 MPa 1/2 , It was found that the elongation at break of the resulting cured product was improved.
Although the mechanism by which the above effect is obtained is unknown, it is estimated as follows.
In the present invention, by setting ΔSP to more than -3.5 MPa 1/2 and less than 5.0 MPa 1/2 , the polyimide precursor and the radically polymerizable compound are cured in a sufficiently mixed state to form a cured product. is obtained. It is thought that such a highly homogeneous cured product is less prone to cracking during deformation such as elongation, resulting in improved elongation at break.
　また、本発明の樹脂組成物から得られる硬化物は、樹脂として式（１）で表される繰返し単位が閉環した構造を有する。このような構造は剛直であり、硬化物のヤング率を増大させると考えられる。
　ここで、一般的にヤング率と破断伸びはトレードオフの関係にあり、ヤング率の高い硬化物は破断伸びが低い傾向にある。しかし本発明では、ΔＳＰが－３．５ＭＰａ１／２を超え５．０ＭＰａ１／２未満であることにより、ポリイミド前駆体が式（１）で表される繰返し単位を有する場合であっても、破断伸びを向上することができる。すなわち、本発明は破断伸びの高さとヤング率の高さとを両立することができるという効果をも奏するものである。
　更に、本発明において用いられる樹脂は疎水性が高く、また、これとのＳＰ値の差が－４．０ＭＰａ１／２を超え５．０ＭＰａ１／２未満であるラジカル重合性化合物も疎水性が高い。
　このような構成を採用することにより、硬化物には水が浸入しにくくなり、耐湿熱性も向上すると考えられる。 Moreover, the cured product obtained from the resin composition of the present invention has a structure in which the repeating unit represented by formula (1) is ring-closed as a resin. Such a structure is rigid and is thought to increase the Young's modulus of the cured product.
Generally, there is a trade-off relationship between Young's modulus and elongation at break, and cured products with a high Young's modulus tend to have a low elongation at break. However, in the present invention, since ΔSP is more than -3.5 MPa 1/2 and less than 5.0 MPa 1/2 , even when the polyimide precursor has a repeating unit represented by formula (1), Elongation at break can be improved. That is, the present invention has the effect of achieving both a high elongation at break and a high Young's modulus.
Furthermore, the resin used in the present invention is highly hydrophobic, and the radically polymerizable compound whose SP value is more than -4.0 MPa 1/2 and less than 5.0 MPa 1/2 is also highly hydrophobic. expensive.
It is thought that by employing such a configuration, it becomes difficult for water to enter the cured product, and the heat and humidity resistance is also improved.
　ここで、特許文献１には、式（１）で表される繰返し単位を含むポリイミド前駆体と、
　ラジカル重合性化合物と、を含有し、ΔＳＰが上記範囲内となる樹脂組成物については記載されていない。 Here, Patent Document 1 describes a polyimide precursor containing a repeating unit represented by formula (1),
There is no description of a resin composition containing a radically polymerizable compound and having ΔSP within the above range.
　以下、本発明の樹脂組成物に含まれる成分について詳細に説明する。 Hereinafter, the components contained in the resin composition of the present invention will be explained in detail.
＜ΔＳＰ＞
　本発明の樹脂組成物において、ΔＳＰは－３．５ＭＰａ１／２を超え５．０ＭＰａ１／２未満である。
　上記ΔＳＰの下限は－３．３ＭＰａ１／２以上であることが好ましく、－３．０ＭＰａ１／２以上であることがより好ましく、－２．５ＭＰａ１／２以上であることが更に好ましい。
　上記ΔＳＰの上限は４．５ＭＰａ１／２以下であることが好ましく、４．０ＭＰａ１／２以下であることがより好ましく、３．５ＭＰａ１／２以下であることが更に好ましい。 <ΔSP>
In the resin composition of the present invention, ΔSP is more than -3.5 MPa 1/2 and less than 5.0 MPa 1/2 .
The lower limit of ΔSP is preferably -3.3 MPa 1/2 or more, more preferably -3.0 MPa 1/2 or more, and even more preferably -2.5 MPa 1/2 or more.
The upper limit of ΔSP is preferably 4.5 MPa 1/2 or less, more preferably 4.0 MPa 1/2 or less, and even more preferably 3.5 MPa 1/2 or less.
　本発明において、特定樹脂の溶解度パラメータＳＰＡは、耐湿熱性の向上の観点からは、２１．５ＭＰａ１／２以下であることが好ましく、２０．７ＭＰａ１／２以下であることがより好ましい。上記ＳＰＡの下限は特に限定されないが、例えば１５．０ＭＰａ１／２以上とすることができる。
　本発明において、溶解度パラメータ（ＳＰ値)は、ハンセン溶解度パラメータを用いるものとする。
　ハンセン溶解度パラメータのｄ値（分散項δｄ）、ｐ値（極性項δｐ）およびｈ値（水素結合項δｈ）は、ソフトウェアＨａｎｓｅｎ　Ｓｏｌｕｂｉｌｉｔｙ　Ｐａｒａｍｅｔｅｒｓ　ｉｎ　Ｐｒａｃｔｉｃｅ（ＨＳＰｉＰ）ｖｅｒ．４．１．０７によって計算された値である。また、ソフトウェア側の都合で計算できない場合は「Ｈａｎｓｅｎ　Ｓｏｌｕｂｉｌｉｔｙ　Ｐａｒａｍｅｔｅｒｓ　５０ｔｈ　ａｎｎｉｖｅｒｓａｒｙ　ｃｏｎｆｅｒｅｎｃｅ、ｐｒｅｐｒｉｎｔ　ＰＰ．１－１３、（２０１７）、Ｈｉｒｏｓｈｉ　Ｙａｍａｍｏｔｏ、Ｓｔｅｖｅｎ　Ａｂｂｏｔｔ、Ｃｈａｒｌｅｓ　Ｍ．　Ｈａｎｓｅｎ」のデータをもとに算出できる。
　また、本発明における樹脂組成物が、ポリイミド前駆体に該当する化合物を複数種含む場合、ＳＰＡはそれぞれのポリイミド前駆体に該当する化合物の質量比に応じて算出される。
　例えば、樹脂組成物がポリイミド前駆体として計ｎ種の化合物を含み、そのＳＰ値がそれぞれＰ１、Ｐ２、・・・、Ｐｎであり、その含有質量割合がそれぞれｍ１、ｍ２、・・・、ｍｎである場合、ＳＰＡは下記式（ＳＰＡ）により算出される。
　例えば、樹脂組成物がラジカル重合性化合物として計ｎ種の化合物を含み、そのＳＰ値がそれぞれＭ１、Ｍ２、・・・、Ｍｎであり、その含有質量割合がそれぞれｍ１、ｍ２、・・・、ｍｎである場合、ＳＰＢは下記式（ＳＰＢ）により算出される。
Figure JPOXMLDOC01-appb-M000014
　例えば、樹脂組成物がラジカル重合性化合物として、ＳＰ値が２４．５ＭＰａ１／２である化合物１と、ＳＰ値が１７．６ＭＰａ１／２である化合物２とを、化合物１：化合物２＝０．３：０．７の質量割合で含む場合、ＳＰＢは２４．５×０．３＋１７．６×０．７＝１９．７ＭＰａ１／２となる。 In the present invention, the solubility parameter SPA of the specific resin is preferably 21.5 MPa 1/2 or less, more preferably 20.7 MPa 1/2 or less, from the viewpoint of improving heat and humidity resistance. The lower limit of the SPA is not particularly limited, but may be, for example, 15.0 MPa 1/2 or more.
In the present invention, the Hansen solubility parameter is used as the solubility parameter (SP value).
The d value (dispersion term δd), p value (polar term δp), and h value (hydrogen bond term δh) of the Hansen solubility parameters were determined using the software Hansen Solubility Parameters in Practice (HSPiP) ver. 4.1.07. If calculation is not possible due to software reasons, please refer to “Hansen Solubility Parameters 50th anniversary conference, preprint PP.1-13, (2017), Hiroshi Yamamoto, Steven Abbot. It can be calculated based on the data of "Charles M. Hansen".
Moreover, when the resin composition in the present invention contains multiple types of compounds corresponding to polyimide precursors, SPA is calculated according to the mass ratio of the compounds corresponding to each polyimide precursor.
For example, a resin composition contains a total of n types of compounds as polyimide precursors, the SP values thereof are P 1 , P 2 , ..., P n , and the content mass proportions are m 1 , m 2 , ..., m n , SPA is calculated by the following formula (SP A ).
For example, a resin composition contains a total of n types of compounds as radically polymerizable compounds, the SP values thereof are M 1 , M 2 , . . . , M n , and the content mass proportions are m 1 , m 2 , ..., m n , SPB is calculated by the following formula (SP B ).
Figure JPOXMLDOC01-appb-M000014
For example, when the resin composition is a radically polymerizable compound, Compound 1 having an SP value of 24.5 MPa 1/2 and Compound 2 having an SP value of 17.6 MPa 1/2 , Compound 1: Compound 2 = 0 When it is included at a mass ratio of .3:0.7, SPB is 24.5 x 0.3 + 17.6 x 0.7 = 19.7 MPa 1/2 .
＜ポリイミド前駆体＞
　本発明の樹脂組成物は、式（１）で表される繰返し単位を含むポリイミド前駆体（以下、「特定樹脂」ともいう。）を含む。

　式（１）中、Ａ１及びＡ２はそれぞれ独立に、酸素原子又は－ＮＲＺ－であり、ＲＺは水素原子又は１価の有機基であり、Ｒ１及びＲ２はそれぞれ独立に、水素原子又は１価の有機基であり、Ｒ１及びＲ２の少なくとも１つはエチレン性不飽和結合を有する１価の有機基であり、Ｘ１はベンゼン環構造を有する４価の有機基であり、Ｙ１は下記式（Ｙ－１）で表される２価の有機基である。

　式（Ｙ－１）中、Ｒ３～Ｒ１０はそれぞれ独立に、水素原子又は１価の基であり、Ｒ３～Ｒ１０のうち少なくとも１つはアルキル基、フッ素原子又はトリフルオロメチル基であり、＊はそれぞれ、式（１）中の窒素原子との結合部位を表す。 <Polyimide precursor>
The resin composition of the present invention contains a polyimide precursor (hereinafter also referred to as "specific resin") containing a repeating unit represented by formula (1).

In formula (1), A 1 and A 2 are each independently an oxygen atom or -NR Z -, R Z is a hydrogen atom or a monovalent organic group, and R 1 and R 2 are each independently, is a hydrogen atom or a monovalent organic group, at least one of R 1 and R 2 is a monovalent organic group having an ethylenically unsaturated bond, and X 1 is a tetravalent organic group having a benzene ring structure. Y 1 is a divalent organic group represented by the following formula (Y-1).

In formula (Y-1), R 3 to R 10 are each independently a hydrogen atom or a monovalent group, and at least one of R 3 to R 10 is an alkyl group, a fluorine atom, or a trifluoromethyl group. and * each represent a bonding site with the nitrogen atom in formula (1).
〔Ａ１及びＡ２〕
　式（１）におけるＡ１及びＡ２は、それぞれ独立に、酸素原子又は－ＮＲＺ－を表し、酸素原子が好ましい。
　ＲＺは水素原子又は１価の有機基を表し、水素原子が好ましい。
　ＲＺが１価の有機基である場合のＲＺとしては、炭化水素基等が挙げられる。
　Ａ１が－ＮＲＺ－である場合、ＲＺはＲ１と結合して環構造を形成してもよい。形成される環構造としては、炭化水素環が挙げられ、脂肪族炭化水素環が好ましく、飽和脂肪族炭化水素環がより好ましい。また、上記環構造は５員環又は６員環が好ましい。
　Ａ２が－ＮＲＺ－である場合、ＲＺはＲ２と結合して環構造を形成してもよい。形成される環構造の好ましい態様は、上述のＲＺとＲ１との結合により形成される環構造の好ましい態様と同様である。 [A 1 and A 2 ]
A 1 and A 2 in formula (1) each independently represent an oxygen atom or -NR Z -, and preferably an oxygen atom.
R Z represents a hydrogen atom or a monovalent organic group, and preferably a hydrogen atom.
When R Z is a monovalent organic group, examples of R Z include a hydrocarbon group.
When A 1 is -NR Z -, R Z may be combined with R 1 to form a ring structure. The ring structure formed includes hydrocarbon rings, preferably aliphatic hydrocarbon rings, and more preferably saturated aliphatic hydrocarbon rings. Further, the ring structure is preferably a 5-membered ring or a 6-membered ring.
When A 2 is -NR Z -, R Z may be combined with R 2 to form a ring structure. The preferred embodiments of the ring structure formed are the same as the preferred embodiments of the ring structure formed by the combination of R Z and R 1 described above.
〔Ｒ１及びＲ２〕
　式（１）中、Ｒ１及びＲ２はそれぞれ独立に、水素原子又は１価の有機基であり、Ｒ１及びＲ２の少なくとも１つはエチレン性不飽和結合を有する１価の有機基である。
　Ｒ１及びＲ２の両方がエチレン性不飽和結合を有する１価の有機基である態様も、本発明の好ましい態様の一つである。
　エチレン性不飽和結合を有する１価の有機基としては、ビニル基、アリル基、イソアリル基、２－メチルアリル基、ビニル基と直接結合した芳香環を有する基（例えば、ビニルフェニル基など）、（メタ）アクリルアミド基、（メタ）アクリロイルオキシ基を有する基、又は、下記式（ＩＩＩ）で表される基を有する基が好ましく、下記式（ＩＩＩ）で表される基を有する基がより好ましい。また、エチレン性不飽和結合を有する１価の有機基が下記式（ＩＩＩ）で表される基である態様も、本発明の好ましい態様の一つである。 [R 1 and R 2 ]
In formula (1), R 1 and R 2 are each independently a hydrogen atom or a monovalent organic group, and at least one of R 1 and R 2 is a monovalent organic group having an ethylenically unsaturated bond. be.
An embodiment in which both R 1 and R 2 are monovalent organic groups having an ethylenically unsaturated bond is also one of the preferred embodiments of the present invention.
Examples of the monovalent organic group having an ethylenically unsaturated bond include a vinyl group, an allyl group, an isoallyl group, a 2-methylallyl group, a group having an aromatic ring directly bonded to a vinyl group (for example, a vinyl phenyl group, etc.), ( A group having a meth)acrylamide group, a (meth)acryloyloxy group, or a group having a group represented by the following formula (III) is preferred, and a group having a group represented by the following formula (III) is more preferred. Further, an embodiment in which the monovalent organic group having an ethylenically unsaturated bond is a group represented by the following formula (III) is also one of the preferred embodiments of the present invention.
Figure JPOXMLDOC01-appb-C000017
Figure JPOXMLDOC01-appb-C000017
　式（ＩＩＩ）において、Ｒ２００は、水素原子、メチル基、エチル基又はメチロール基を表し、水素原子又はメチル基が好ましい。
　式（ＩＩＩ）において、＊は他の構造との結合部位を表す。
　式（ＩＩＩ）において、Ｒ２０１は、炭素数２～１２のアルキレン基、－ＣＨ２ＣＨ（ＯＨ）ＣＨ２－、シクロアルキレン基又はポリアルキレンオキシ基を表し、アルキレン基が好ましい。
　好適なＲ２０１の例は、エチレン基、プロピレン基、トリメチレン基、テトラメチレン基、ペンタメチレン基、ヘキサメチレン基、オクタメチレン基、ドデカメチレン基等のアルキレン基、１，２－ブタンジイル基、１，３－ブタンジイル基、－ＣＨ２ＣＨ（ＯＨ）ＣＨ２－、ポリアルキレンオキシ基が挙げられ、エチレン基、プロピレン基等のアルキレン基、－ＣＨ２ＣＨ（ＯＨ）ＣＨ２－、シクロヘキシル基、ポリアルキレンオキシ基がより好ましく、エチレン基、プロピレン基等のアルキレン基、又はポリアルキレンオキシ基が更に好ましい。
　本発明において、ポリアルキレンオキシ基とは、アルキレンオキシ基が２以上直接結合した基をいう。ポリアルキレンオキシ基に含まれる複数のアルキレンオキシ基におけるアルキレン基は、それぞれ同一であっても異なっていてもよい。
　ポリアルキレンオキシ基が、アルキレン基が異なる複数種のアルキレンオキシ基を含む場合、ポリアルキレンオキシ基におけるアルキレンオキシ基の配列は、ランダムな配列であってもよいし、ブロックを有する配列であってもよいし、交互等のパターンを有する配列であってもよい。
　上記アルキレン基の炭素数（アルキレン基が置換基を有する場合、置換基の炭素数を含む）は、２以上であることが好ましく、２～１０であることがより好ましく、２～６であることがより好ましく、２～５であることが更に好ましく、２～４であることが一層好ましく、２又は３であることがより更に好ましく、２であることが特に好ましい。
　また、上記アルキレン基は、置換基を有していてもよい。好ましい置換基としては、アルキル基、アリール基、ハロゲン原子等が挙げられる。
　また、ポリアルキレンオキシ基に含まれるアルキレンオキシ基の数（ポリアルキレンオキシ基の繰返し数）は、２～２０が好ましく、２～１０がより好ましく、２～６が更に好ましい。
　ポリアルキレンオキシ基としては、溶剤溶解性及び耐溶剤性の観点からは、ポリエチレンオキシ基、ポリプロピレンオキシ基、ポリトリメチレンオキシ基、ポリテトラメチレンオキシ基、又は、複数のエチレンオキシ基と複数のプロピレンオキシ基とが結合した基が好ましく、ポリエチレンオキシ基又はポリプロピレンオキシ基がより好ましく、ポリエチレンオキシ基が更に好ましい。上記複数のエチレンオキシ基と複数のプロピレンオキシ基とが結合した基において、エチレンオキシ基とプロピレンオキシ基とはランダムに配列していてもよいし、ブロックを形成して配列していてもよいし、交互等のパターン状に配列していてもよい。これらの基におけるエチレンオキシ基等の繰返し数の好ましい態様は上述の通りである。 In formula (III), R 200 represents a hydrogen atom, a methyl group, an ethyl group, or a methylol group, and preferably a hydrogen atom or a methyl group.
In formula (III), * represents a bonding site with another structure.
In formula (III), R 201 represents an alkylene group having 2 to 12 carbon atoms, -CH 2 CH(OH)CH 2 -, a cycloalkylene group or a polyalkyleneoxy group, and an alkylene group is preferable.
Suitable examples of R 201 include alkylene groups such as ethylene group, propylene group, trimethylene group, tetramethylene group, pentamethylene group, hexamethylene group, octamethylene group, and dodecamethylene group, 1,2-butanediyl group, 1, Examples include 3-butanediyl group, -CH 2 CH (OH) CH 2 -, polyalkyleneoxy group, alkylene groups such as ethylene group and propylene group, -CH 2 CH (OH) CH 2 -, cyclohexyl group, polyalkylene group. An oxy group is more preferred, and an alkylene group such as an ethylene group or a propylene group, or a polyalkyleneoxy group is even more preferred.
In the present invention, a polyalkyleneoxy group refers to a group in which two or more alkyleneoxy groups are directly bonded. The alkylene groups in the plurality of alkyleneoxy groups contained in the polyalkyleneoxy group may be the same or different.
When the polyalkyleneoxy group contains multiple types of alkyleneoxy groups with different alkylene groups, the arrangement of the alkyleneoxy groups in the polyalkyleneoxy group may be a random arrangement or an arrangement having blocks. Alternatively, an arrangement having an alternating pattern or the like may be used.
The number of carbon atoms in the alkylene group (including the number of carbon atoms in the substituent when the alkylene group has a substituent) is preferably 2 or more, more preferably 2 to 10, and 2 to 6. is more preferable, 2 to 5 is even more preferable, 2 to 4 is even more preferable, 2 or 3 is even more preferable, and 2 is particularly preferable.
Further, the alkylene group may have a substituent. Preferred substituents include alkyl groups, aryl groups, halogen atoms, and the like.
Further, the number of alkyleneoxy groups contained in the polyalkyleneoxy group (the number of repeating polyalkyleneoxy groups) is preferably 2 to 20, more preferably 2 to 10, and even more preferably 2 to 6.
From the viewpoint of solvent solubility and solvent resistance, polyalkyleneoxy groups include polyethyleneoxy groups, polypropyleneoxy groups, polytrimethyleneoxy groups, polytetramethyleneoxy groups, or multiple ethyleneoxy groups and multiple propyleneoxy groups. A group bonded to an oxy group is preferable, a polyethyleneoxy group or a polypropyleneoxy group is more preferable, and a polyethyleneoxy group is even more preferable. In the above-mentioned group in which a plurality of ethyleneoxy groups and a plurality of propyleneoxy groups are bonded, the ethyleneoxy groups and propyleneoxy groups may be arranged randomly, or may be arranged to form blocks. , may be arranged in an alternating pattern. Preferred embodiments of the repeating number of ethyleneoxy groups, etc. in these groups are as described above.
　式（１）において、Ｒ１が水素原子である場合、又は、Ｒ２が水素原子である場合、特定樹脂はエチレン性不飽和結合を有する３級アミン化合物と対塩を形成していてもよい。このようなエチレン性不飽和結合を有する３級アミン化合物の例としては、Ｎ，Ｎ－ジメチルアミノプロピルメタクリレートが挙げられる。 In formula (1), when R 1 is a hydrogen atom or when R 2 is a hydrogen atom, the specific resin may form a counter salt with a tertiary amine compound having an ethylenically unsaturated bond. . An example of a tertiary amine compound having such an ethylenically unsaturated bond is N,N-dimethylaminopropyl methacrylate.
　式（１）において、Ｒ１及びＲ２の一方がエチレン性不飽和結合を有しない１価の有機基であってもよい。
　エチレン性不飽和結合を有しない１価の有機基としては、炭化水素基、ヘテロ環基、又は、炭化水素基及びヘテロ環基の少なくとも一方と、－Ｏ－、－Ｃ（＝Ｏ）－、－Ｓ－、－ＳＯ２－若しくは－ＮＲＮ－との組み合わせにより表される基が好ましく、炭化水素基、又は、炭化水素基と－Ｏ－との組み合わせにより表される基がより好ましく、アルキル基、芳香族炭化水素基又はポリアルキレンオキシ基がより好ましい。上記ＲＮは水素原子又は１価の有機基を表し、水素原子、炭化水素基又は芳香族基が好ましく、水素原子又はアルキル基がより好ましく、水素原子が更に好ましい。
　本明細書において、単にアルキル基と記載した場合、アルキル基には、直鎖アルキル基、分岐アルキル基、環状アルキル基のいずれもが含まれるものとする。アルキレン基、脂肪族炭化水素基等においても同様である。 In formula (1), one of R 1 and R 2 may be a monovalent organic group having no ethylenically unsaturated bond.
The monovalent organic group having no ethylenically unsaturated bond includes a hydrocarbon group, a heterocyclic group, or at least one of a hydrocarbon group and a heterocyclic group, -O-, -C(=O)-, A group represented by a combination with -S-, -SO 2 - or -NR N - is preferred, a group represented by a hydrocarbon group or a combination of a hydrocarbon group and -O- is more preferred, and an alkyl group, aromatic hydrocarbon group or polyalkyleneoxy group are more preferred. The above R N represents a hydrogen atom or a monovalent organic group, preferably a hydrogen atom, a hydrocarbon group, or an aromatic group, more preferably a hydrogen atom or an alkyl group, and even more preferably a hydrogen atom.
In this specification, when simply described as an alkyl group, the alkyl group includes any of a linear alkyl group, a branched alkyl group, and a cyclic alkyl group. The same applies to alkylene groups, aliphatic hydrocarbon groups, etc.
〔Ｘ１〕
　式（１）中、Ｘ１はベンゼン環構造を有する４価の有機基である。
　Ｘ１に含まれるベンゼン環構造は、単環で存在してもよいし、例えば他のベンゼン環構造又は他のヘテロ環構造と複環（例えば、縮合環）を形成して存在していてもよい。
　また、Ｘ１に含まれるベンゼン環構造の数は、１～６であることが好ましく、１～４であることがより好ましい。
　特定樹脂は、式（１）で表される繰返し単位として、式（１）における上記Ｘ１がベンゼン環構造を３個以上有することも好ましい。上記態様において、ベンゼン環構造の数は、３～６であることが好ましく、３～５であることがより好ましく、３又は４であることが更に好ましい。
　また、ベンゼン環構造は公知の置換基を有してもよい。置換基としては、例えば、アルキル基、ハロゲン原子、ハロゲン原子により水素原子が置換されたアルキル基等が挙げられる。
　また、上記ベンゼン環構造は、樹脂の主鎖上に存在することが好ましい。
　本発明において、「主鎖」とは、樹脂分子中で相対的に最も長い結合鎖を表し、「側鎖」とはそれ以外の結合鎖をいう。また、本発明において、ある構造が主鎖上に存在するとは、ある構造により主鎖が連結されており、有る構造を除くと主鎖が分断されてしまうことをいう。 [X 1 ]
In formula (1), X 1 is a tetravalent organic group having a benzene ring structure.
The benzene ring structure contained in X 1 may exist as a single ring, or may exist as a multi-ring (e.g., fused ring) with other benzene ring structures or other heterocyclic structures. good.
Further, the number of benzene ring structures contained in X 1 is preferably 1 to 6, more preferably 1 to 4.
In the specific resin, it is also preferable that, as a repeating unit represented by formula (1), the above X 1 in formula (1) has three or more benzene ring structures. In the above embodiment, the number of benzene ring structures is preferably 3 to 6, more preferably 3 to 5, and even more preferably 3 or 4.
Further, the benzene ring structure may have a known substituent. Examples of the substituent include an alkyl group, a halogen atom, an alkyl group in which a hydrogen atom is substituted with a halogen atom, and the like.
Moreover, it is preferable that the benzene ring structure is present on the main chain of the resin.
In the present invention, the "main chain" refers to the relatively longest bond chain in the resin molecule, and the "side chain" refers to other bond chains. Furthermore, in the present invention, the presence of a certain structure on the main chain means that the main chain is connected by a certain structure, and if the certain structure is removed, the main chain will be fragmented.
　特定樹脂は、式（１）で表される繰返し単位として、式（１）における上記Ｘ１がエーテル結合を２個以上有する繰返し単位を含むことも好ましい。
　ここで、エーテル結合とは、＊－Ｏ－＊で表される２価の結合であり、２つの＊はいずれも炭化水素基と結合する。
　Ｘ１における２個以上のエーテル結合は、それぞれ、その両端がベンゼン環構造と直接結合する態様も、本発明の好ましい態様の一つである。
　本発明において、ＡとＢとが直接結合するとは、ＡとＢとが、ＡとＢとの間に連結基を含まずに結合することをいう。
　Ｚ１におけるエーテル結合の数は、２～６であることが好ましく、２～４であることがより好ましく、２又は３であることが更に好ましく、２であることが特に好ましい。
　上記２つのエーテル結合のそれぞれの両端は、炭化水素基であればよいが、いずれもベンゼン環構造であることも、本発明の好ましい態様の一つである。
　また、上記エーテル結合は、樹脂の主鎖上に存在することが好ましい。 It is also preferable that the specific resin contains, as the repeating unit represented by formula (1), a repeating unit in which X 1 in formula (1) has two or more ether bonds.
Here, the ether bond is a divalent bond represented by *-O-*, and both * are bonded to a hydrocarbon group.
One of the preferred embodiments of the present invention is an embodiment in which both ends of the two or more ether bonds in X 1 are directly bonded to the benzene ring structure.
In the present invention, "A and B are directly bonded" means that A and B are bonded without including a linking group between them.
The number of ether bonds in Z 1 is preferably 2 to 6, more preferably 2 to 4, even more preferably 2 or 3, and particularly preferably 2.
Both ends of each of the above two ether bonds may be a hydrocarbon group, but it is also a preferred embodiment of the present invention that both ends have a benzene ring structure.
Moreover, it is preferable that the above-mentioned ether bond exists on the main chain of the resin.
　中でも、特定樹脂は、式（１）で表される繰返し単位として、式（１）における上記Ｘ１がベンゼン環構造を３個以上有し、かつ、エーテル結合を２個以上有する繰返し単位を含むことも好ましい。 Among these, the specific resin includes, as a repeating unit represented by formula (1), a repeating unit in which the above X 1 in formula (1) has three or more benzene ring structures and two or more ether bonds. It is also preferable.
　特定樹脂は、式（１）で表される繰返し単位として、式（１）における上記Ｘ１が下記式（ａ）又は下記式（ｂ）で表される構造である繰返し単位を含むことが好ましい。
　式（ａ）中、Ｒａ１はそれぞれ独立に、１価の基を表し、ｍ１は０～３の整数を表し、Ｒａ２はそれぞれ独立に、１価の基を表し、ｍ２は０～４の整数を表し、Ｒａ３はそれぞれ独立に、１価の基を表し、ｍ３は０～３の整数を表し、＊１～＊４はそれぞれ式（１）中のカルボニル基との結合部位を表す。
　式（ｂ）中、Ｒｂ１はそれぞれ独立に、１価の基を表し、ｎ１は０～３の整数を表し、Ｒｂ２はそれぞれ独立に、１価の基を表し、ｎ２は０～４の整数を表し、Ｒｂ３はそれぞれ独立に、１価の基を表し、ｎ３は０～４の整数を表し、Ｒｂ４はそれぞれ独立に、１価の基を表し、ｎ４は０～３の整数を表し、Ｊ１及びＪ２はそれぞれ独立に、水素原子、アルキル基又はトリフルオロメチル基を表し、＊１～＊４はそれぞれ式（１）中のカルボニル基との結合部位を表す。 It is preferable that the specific resin contains, as the repeating unit represented by formula (1), a repeating unit in which the above X 1 in formula (1) has a structure represented by the following formula (a) or the following formula (b). .
In formula (a), R a1 each independently represents a monovalent group, m1 represents an integer of 0 to 3, R a2 each independently represents a monovalent group, and m2 represents a monovalent group of 0 to 4. represents an integer, R a3 each independently represents a monovalent group, m3 represents an integer of 0 to 3, and *1 to *4 each represent a bonding site with the carbonyl group in formula (1).
In formula (b), R b1 each independently represents a monovalent group, n1 represents an integer of 0 to 3, R b2 each independently represents a monovalent group, and n2 represents a monovalent group of 0 to 4. represents an integer, R b3 each independently represents a monovalent group, n3 represents an integer from 0 to 4, R b4 each independently represents a monovalent group, and n4 represents an integer from 0 to 3. where J 1 and J 2 each independently represent a hydrogen atom, an alkyl group or a trifluoromethyl group, and *1 to *4 each represent a bonding site with a carbonyl group in formula (1).
　式（ａ）中、Ｒａ１はハロゲン原子、脂肪族炭化水素基、又は、芳香族基であることが好ましい。上記脂肪族炭化水素基、又は、芳香族基における水素原子は、更にハロゲン原子等により置換されていてもよい。
　式（ａ）中、ｍ１は０～３の整数を表し、０～２であることが好ましく、０又は１であることがより好ましい。また、ｍ１が０である態様も、本発明の好ましい態様の一つである。
　式（ａ）中、Ｒａ２及びＲａ３の好ましい態様は、Ｒａ１の好ましい態様と同様である。
　式（ａ）中、ｍ２は０～２であることが好ましく、０又は１であることがより好ましい。また、ｍ２が０である態様も、本発明の好ましい態様の一つである。
　式（ａ）中、ｍ３の好ましい態様は、ｍ１の好ましい態様と同様である。
　式（ａ）中、＊１又は＊２の一方が、式（１）中のＡ１と結合するカルボニル基と結合し、他方が式（１）で表される繰返し単位外の構造と結合するカルボニル基と結合し、＊３又は＊４の一方が、式（１）中のＡ２と結合するカルボニル基と結合し、他方が式（１）に記載されたＮＨと結合するカルボニル基と結合することが好ましい。 In formula (a), R a1 is preferably a halogen atom, an aliphatic hydrocarbon group, or an aromatic group. The hydrogen atom in the aliphatic hydrocarbon group or aromatic group may be further substituted with a halogen atom or the like.
In formula (a), m1 represents an integer of 0 to 3, preferably 0 to 2, and more preferably 0 or 1. Furthermore, an embodiment in which m1 is 0 is also one of the preferred embodiments of the present invention.
In formula (a), preferred embodiments of R a2 and R a3 are the same as those of R a1 .
In formula (a), m2 is preferably 0 to 2, more preferably 0 or 1. Furthermore, an embodiment in which m2 is 0 is also one of the preferred embodiments of the present invention.
In formula (a), preferred embodiments of m3 are the same as those of m1.
In formula (a), one of *1 or *2 is bonded to the carbonyl group bonded to A1 in formula (1), and the other is bonded to a structure outside the repeating unit represented by formula (1). Bonded to a carbonyl group, one of *3 or *4 bonded to the carbonyl group bonded to A 2 in formula (1), and the other bonded to the carbonyl group bonded to NH described in formula (1) It is preferable to do so.
　式（ｂ）中、Ｒｂ１はハロゲン原子、脂肪族炭化水素基、又は、芳香族基であることが好ましい。上記脂肪族炭化水素基、又は、芳香族基における水素原子は、更にハロゲン原子等により置換されていてもよい。
　式（ｂ）中、ｎ１は０～３の整数を表し、０～２であることが好ましく、０又は１であることがより好ましい。また、ｎ１が０である態様も、本発明の好ましい態様の一つである。
　式（ｂ）中、Ｒｂ２、Ｒｂ３及びＲｂ４の好ましい態様は、Ｒｂ１の好ましい態様と同様である。
　式（ｂ）中、ｎ２は０～２であることが好ましく、０又は１であることがより好ましい。また、ｎ２が０である態様も、本発明の好ましい態様の一つである。
　式（ｂ）中、ｎ３の好ましい態様は、ｎ２の好ましい態様と同様である。
　式（ｂ）中、ｎ４の好ましい態様は、ｎ１の好ましい態様と同様である。
　式（ｂ）中、Ｊ１及びＪ２はそれぞれ独立に、水素原子、アルキル基又はトリフルオロメチル基を表し、水素原子、メチル基又はトリフルオロメチル基が好ましい。
　式（ｂ）中、＊１又は＊２の一方が、式（１）中のＡ１と結合するカルボニル基と結合し、他方が式（１）で表される繰返し単位外の構造と結合するカルボニル基と結合し、＊３又は＊４の一方が、式（１）中のＡ２と結合するカルボニル基と結合し、他方が式（１）に記載されたＮＨと結合するカルボニル基と結合することが好ましい。 In formula (b), R b1 is preferably a halogen atom, an aliphatic hydrocarbon group, or an aromatic group. The hydrogen atom in the aliphatic hydrocarbon group or aromatic group may be further substituted with a halogen atom or the like.
In formula (b), n1 represents an integer of 0 to 3, preferably 0 to 2, and more preferably 0 or 1. Furthermore, an embodiment in which n1 is 0 is also one of the preferred embodiments of the present invention.
In formula (b), preferred embodiments of R b2 , R b3 and R b4 are the same as the preferred embodiment of R b1 .
In formula (b), n2 is preferably 0 to 2, more preferably 0 or 1. Furthermore, an embodiment in which n2 is 0 is also one of the preferred embodiments of the present invention.
In formula (b), preferred embodiments of n3 are the same as those of n2.
In formula (b), preferred embodiments of n4 are the same as those of n1.
In formula (b), J 1 and J 2 each independently represent a hydrogen atom, an alkyl group, or a trifluoromethyl group, and preferably a hydrogen atom, a methyl group, or a trifluoromethyl group.
In formula (b), one of *1 or *2 is bonded to the carbonyl group bonded to A1 in formula (1), and the other is bonded to a structure outside the repeating unit represented by formula (1). Bonded to a carbonyl group, one of *3 or *4 bonded to the carbonyl group bonded to A 2 in formula (1), and the other bonded to the carbonyl group bonded to NH described in formula (1) It is preferable to do so.
　特定樹脂は、式（１）で表される繰返し単位として、式（１）における上記Ｘ１が下記式（２ａ）～式（２ｄ）のいずれかで表される構造である繰返し単位を含む態様も好ましい。
　ここで、破断伸び及びヤング率の観点からは、特定樹脂は、式（１）で表される繰返し単位として、式（１）における上記Ｘ１が上述の式（ａ）又は式（ｂ）で表される構造である繰返し単位と、式（１）における上記Ｘ１が下記式（２ａ）～式（２ｄ）のいずれかで表される構造である繰返し単位とを含むことも好ましい。
　式（２ａ）～式（２ｄ）中、Ｌ１及びＬ２はそれぞれ独立に、それぞれが結合するベンゼン環と共役しない２価の基、又は、単結合であり、＊１～＊４はそれぞれ式（１）中のカルボニル基との結合部位を表す。 An embodiment in which the specific resin includes a repeating unit represented by formula (1) in which the above-mentioned X 1 in formula (1) has a structure represented by any of the following formulas (2a) to (2d). is also preferable.
Here, from the viewpoint of elongation at break and Young's modulus, the specific resin has the above-mentioned X 1 in the formula (1) as a repeating unit represented by the formula (1). It is also preferable to include a repeating unit having a structure represented by the following formula and a repeating unit having a structure in which the above-mentioned X 1 in formula (1) is represented by any one of the following formulas (2a) to (2d).
In formulas (2a) to (2d), L 1 and L 2 are each independently a divalent group or a single bond that is not conjugated with the benzene ring to which they are bonded, and *1 to *4 are each represented by the formula Represents the bonding site with the carbonyl group in (1).
　式（２ｃ）中、Ｌ１及びＬ２はそれぞれ独立に、－Ｃ（ＲＣ）２－、－Ｓｉ（ＲＳ）２－、－Ｏ－、又は、単結合であることが好ましく、－Ｃ（ＲＣ）２－、－Ｓｉ（ＲＳ）２－、又は、－Ｏ－であることがより好ましい。また。Ｌ１及びＬ２の少なくとも一方が、－Ｃ（ＲＣ）２－又は－Ｓｉ（ＲＳ）２－であることが好ましい。
　ＲＣはそれぞれ独立に、水素原子、又は炭化水素基であり、アルキル基であることが好ましく、炭素数１～４のアルキル基であることがより好ましく、メチル基であることが更に好ましい。また、２つのＲＣが結合して環構造を形成してもよい。
　ＲＳはそれぞれ独立に炭化水素基であり、アルキル基であることが好ましく、炭素数１～４のアルキル基であることがより好ましく、メチル基であることが更に好ましい。
　式（２ａ）～式（２ｄ）中、＊１又は＊２の一方が、式（１）中のＡ１と結合するカルボニル基と結合し、他方が式（１）で表される繰返し単位外の構造と結合するカルボニル基と結合し、＊３又は＊４の一方が、式（１）中のＡ２と結合するカルボニル基と結合し、他方が式（１）に記載されたＮＨと結合するカルボニル基と結合することが好ましい。また、２つのＲＳが結合して環構造を形成してもよい。
　また、式（２ａ）～式（２ｄ）中に記載された環構造における水素原子は公知の置換基により置換されてもよい。置換基としては、例えば、アルキル基、ハロゲン原子、ハロゲン原子により水素原子が置換されたアルキル基等が挙げられる。 In formula (2c), L 1 and L 2 are each independently preferably -C(R C ) 2 -, -Si(R S ) 2 -, -O-, or a single bond, and -C More preferably, it is (R C ) 2 -, -Si(R S ) 2 -, or -O-. Also. It is preferable that at least one of L 1 and L 2 is -C(R C ) 2 - or -Si(R S ) 2 -.
R C is each independently a hydrogen atom or a hydrocarbon group, preferably an alkyl group, more preferably an alkyl group having 1 to 4 carbon atoms, and even more preferably a methyl group. Furthermore, two R C 's may be combined to form a ring structure.
R S is each independently a hydrocarbon group, preferably an alkyl group, more preferably an alkyl group having 1 to 4 carbon atoms, and even more preferably a methyl group.
In formulas (2a) to (2d), one of *1 or *2 is bonded to the carbonyl group bonded to A 1 in formula (1), and the other is a group other than the repeating unit represented by formula (1). One of *3 or *4 is bonded to the carbonyl group bonded to A2 in formula (1), and the other is bonded to NH described in formula (1). It is preferable to bond with a carbonyl group. Furthermore, two R S may be combined to form a ring structure.
Furthermore, hydrogen atoms in the ring structures described in formulas (2a) to (2d) may be substituted with known substituents. Examples of the substituent include an alkyl group, a halogen atom, an alkyl group in which a hydrogen atom is substituted with a halogen atom, and the like.
〔Ｙ１〕
　Ｙ１は式（Ｙ－１）で表される２価の有機基である。
　式（Ｙ－１）中、Ｒ３～Ｒ１０のうち少なくとも１つはアルキル基、フッ素原子又はトリフルオロメチル基であり、耐湿熱性の観点からは、フッ素原子又はトリフルオロメチル基であることが好ましい。
　式（Ｙ－１）中、Ｒ３～Ｒ１０のうち少なくとも２つがアルキル基、フッ素原子又はトリフルオロメチル基であることが好ましい。
　上記アルキル基としては、炭素数１～４のアルキル基が好ましく、メチル基がより好ましい。
　Ｙ１は式（Ｙ－２）で表される２価の有機基であることも好ましい。

　式（Ｙ－２）中、Ｒ５及びＲ８はそれぞれ独立に、アルキル基、フッ素原子又はトリフルオロメチル基であり、＊はそれぞれ、式（１）中の窒素原子との結合部位を表す。
　式（Ｙ－２）中、耐湿熱性の観点からは、Ｒ５及びＲ８はそれぞれ独立に、フッ素原子又はトリフルオロメチル基であることが好ましい。
　Ｒ５及びＲ８におけるアルキル基としては、炭素数１～４のアルキル基が好ましく、メチル基がより好ましい。 [Y 1 ]
Y 1 is a divalent organic group represented by formula (Y-1).
In formula (Y-1), at least one of R 3 to R 10 is an alkyl group, a fluorine atom, or a trifluoromethyl group, and from the viewpoint of moist heat resistance, a fluorine atom or a trifluoromethyl group is preferable. preferable.
In formula (Y-1), at least two of R 3 to R 10 are preferably an alkyl group, a fluorine atom, or a trifluoromethyl group.
The alkyl group is preferably an alkyl group having 1 to 4 carbon atoms, and more preferably a methyl group.
It is also preferable that Y 1 is a divalent organic group represented by formula (Y-2).

In formula (Y-2), R 5 and R 8 are each independently an alkyl group, a fluorine atom, or a trifluoromethyl group, and * each represents a bonding site with the nitrogen atom in formula (1).
In formula (Y-2), from the viewpoint of heat-and-moisture resistance, R 5 and R 8 are preferably each independently a fluorine atom or a trifluoromethyl group.
The alkyl group in R 5 and R 8 is preferably an alkyl group having 1 to 4 carbon atoms, and more preferably a methyl group.
　特定樹脂は、上記式（１）で表される繰返し単位とは異なる繰返し単位として、下記式（２）で表される繰返し単位を更に含んでもよい。すなわち、式（１）で表される繰返し単位に該当する繰返し単位は、下記式（２）で表される繰返し単位には該当しないものとする。
Figure JPOXMLDOC01-appb-C000021
　式（２）中、Ａ１及びＡ２は、それぞれ独立に、酸素原子又は－ＮＲｚ－を表し、Ｒ１１１は、２価の有機基を表し、Ｒ１１５は、４価の有機基を表し、Ｒ１１３及びＲ１１４は、それぞれ独立に、水素原子又は１価の有機基を表し、Ｒｚは水素原子又は１価の有機基を表す。 The specific resin may further include a repeating unit represented by the following formula (2) as a repeating unit different from the repeating unit represented by the above formula (1). That is, the repeating unit that corresponds to the repeating unit represented by formula (1) does not correspond to the repeating unit represented by formula (2) below.
Figure JPOXMLDOC01-appb-C000021
In formula (2), A 1 and A 2 each independently represent an oxygen atom or -NR z -, R 111 represents a divalent organic group, and R 115 represents a tetravalent organic group. , R 113 and R 114 each independently represent a hydrogen atom or a monovalent organic group, and R z represents a hydrogen atom or a monovalent organic group.
　式（２）におけるＡ１及びＡ２は、それぞれ独立に、酸素原子又は－ＮＲｚ－を表し、酸素原子が好ましい。
　Ｒｚは水素原子又は１価の有機基を表し、水素原子が好ましい。
　式（２）におけるＲ１１１は、２価の有機基を表す。２価の有機基としては、直鎖又は分岐の脂肪族基、環状の脂肪族基及び芳香族基を含む基が例示され、炭素数２～２０の直鎖又は分岐の脂肪族基、炭素数３～２０の環状の脂肪族基、炭素数３～２０の芳香族基、又は、これらの組み合わせからなる基が好ましく、炭素数６～２０の芳香族基を含む基がより好ましい。上記直鎖又は分岐の脂肪族基は鎖中の炭化水素基がヘテロ原子を含む基で置換されていてもよく、上記環状の脂肪族基および芳香族基は環員の炭化水素基がヘテロ原子を含む基で置換されていてもよい。式（２）におけるＲ１１１の例としては、－Ａｒ－および－Ａｒ－Ｌ－Ａｒ－で表される基が挙げられ、－Ａｒ－Ｌ－Ａｒ－で表される基が好ましい。但し、Ａｒは、それぞれ独立に、芳香族基であり、Ｌは、単結合、又は、フッ素原子で置換されていてもよい炭素数１～１０の脂肪族炭化水素基、－Ｏ－、－ＣＯ－、－Ｓ－、－ＳＯ２－若しくは－ＮＨＣＯ－、あるいは、上記の２つ以上の組み合わせからなる基である。これらの好ましい範囲は、上述のとおりである。 A 1 and A 2 in formula (2) each independently represent an oxygen atom or -NR z -, and preferably an oxygen atom.
Rz represents a hydrogen atom or a monovalent organic group, preferably a hydrogen atom.
R 111 in formula (2) represents a divalent organic group. Examples of divalent organic groups include groups containing straight-chain or branched aliphatic groups, cyclic aliphatic groups, and aromatic groups, including straight-chain or branched aliphatic groups having 2 to 20 carbon atoms, A group consisting of a cyclic aliphatic group having 3 to 20 carbon atoms, an aromatic group having 3 to 20 carbon atoms, or a combination thereof is preferable, and a group containing an aromatic group having 6 to 20 carbon atoms is more preferable. In the above straight chain or branched aliphatic group, the hydrocarbon group in the chain may be substituted with a group containing a hetero atom, and in the above cyclic aliphatic group and aromatic group, the hydrocarbon group in the chain may be substituted with a hetero atom. may be substituted with a group containing. Examples of R 111 in formula (2) include groups represented by -Ar- and -Ar-L-Ar-, with a group represented by -Ar-L-Ar- being preferred. However, Ar is each independently an aromatic group, and L is a single bond or an aliphatic hydrocarbon group having 1 to 10 carbon atoms which may be substituted with a fluorine atom, -O-, -CO -, -S-, -SO 2 -, -NHCO-, or a combination of two or more of the above. These preferred ranges are as described above.
　Ｒ１１１は、ジアミンから誘導されることが好ましい。特定樹脂の製造に用いられるジアミンとしては、直鎖又は分岐の脂肪族、環状の脂肪族又は芳香族ジアミンなどが挙げられる。ジアミンは、１種のみ用いてもよいし、２種以上用いてもよい。
　具体的には、Ｒ１１１は、炭素数２～２０の直鎖又は分岐の脂肪族基、炭素数３～２０の環状の脂肪族基、炭素数３～２０の芳香族基、又は、これらの組み合わせからなる基を含むジアミンであることが好ましく、炭素数６～２０の芳香族基を含むジアミンであることがより好ましい。上記直鎖又は分岐の脂肪族基は鎖中の炭化水素基がヘテロ原子を含む基で置換されていてもよく上記環状の脂肪族基および芳香族基は環員の炭化水素基がヘテロ原子を含む基で置換されていてもよい。芳香族基を含む基の例としては、下記が挙げられる。 Preferably R 111 is derived from a diamine. Examples of diamines used for producing the specific resin include linear or branched aliphatic, cyclic aliphatic, and aromatic diamines. One type of diamine may be used, or two or more types may be used.
Specifically, R 111 is a linear or branched aliphatic group having 2 to 20 carbon atoms, a cyclic aliphatic group having 3 to 20 carbon atoms, an aromatic group having 3 to 20 carbon atoms, or any of these. A diamine containing a combination of groups is preferable, and a diamine containing an aromatic group having 6 to 20 carbon atoms is more preferable. The above-mentioned straight-chain or branched aliphatic group may have a hydrocarbon group in the chain substituted with a group containing a hetero atom.The above-mentioned cyclic aliphatic group and aromatic group may have a ring member hydrocarbon group substituted with a hetero atom-containing group. may be substituted with a group containing. Examples of groups containing aromatic groups include the following.
Figure JPOXMLDOC01-appb-C000022
　式中、Ａは単結合又は２価の連結基を表し、単結合、又は、フッ素原子で置換されていてもよい炭素数１～１０の脂肪族炭化水素基、－Ｏ－、－Ｃ（＝Ｏ）－、－Ｓ－、－ＳＯ２－、－ＮＨＣＯ－、又は、これらの組み合わせから選択される基であることが好ましく、単結合、又は、フッ素原子で置換されていてもよい炭素数１～３のアルキレン基、－Ｏ－、－Ｃ（＝Ｏ）－、－Ｓ－、若しくは、－ＳＯ２－から選択される基であることがより好ましく、－ＣＨ２－、－Ｏ－、－Ｓ－、－ＳＯ２－、－Ｃ（ＣＦ３）２－、又は、－Ｃ（ＣＨ３）２－であることが更に好ましい。
　式中、＊は他の構造との結合部位を表す。
Figure JPOXMLDOC01-appb-C000022
In the formula, A represents a single bond or a divalent linking group, and is a single bond or an aliphatic hydrocarbon group having 1 to 10 carbon atoms, which may be substituted with a fluorine atom, -O-, -C(= A group selected from O)-, -S-, -SO 2 -, -NHCO-, or a combination thereof is preferable, and has a carbon number of 1 and may be substituted with a single bond or a fluorine atom. -3 alkylene groups, -O-, -C(=O)-, -S-, or -SO 2 - is more preferable, and -CH 2 -, -O-, - More preferably, it is S-, -SO 2 -, -C(CF 3 ) 2 -, or -C(CH 3 ) 2 -.
In the formula, * represents a bonding site with another structure.
　ジアミンとしては、具体的には、１，２－ジアミノエタン、１，２－ジアミノプロパン、１，３－ジアミノプロパン、１，４－ジアミノブタン又は１，６－ジアミノヘキサン；
１，２－又は１，３－ジアミノシクロペンタン、１，２－、１，３－又は１，４－ジアミノシクロヘキサン、１，２－、１，３－又は１，４－ビス（アミノメチル）シクロヘキサン、ビス－（４－アミノシクロヘキシル）メタン、ビス－（３－アミノシクロヘキシル）メタン、４，４’－ジアミノ－３，３’－ジメチルシクロヘキシルメタン及びイソホロンジアミン；
ｍ－又はｐ－フェニレンジアミン、ジアミノトルエン、４，４’－又は３，３’－ジアミノビフェニル、４，４’－ジアミノジフェニルエーテル、３，３－ジアミノジフェニルエーテル、４，４’－又は３，３’－ジアミノジフェニルメタン、４，４’－又は３，３’－ジアミノジフェニルスルホン、４，４’－又は３，３’－ジアミノジフェニルスルフィド、４，４’－又は３，３’－ジアミノベンゾフェノン、３，３’－ジメチル－４，４’－ジアミノビフェニル、２，２’－ジメチル－４，４’－ジアミノビフェニル、３，３’－ジメトキシ－４，４’－ジアミノビフェニル、２，２－ビス（４－アミノフェニル）プロパン、２，２－ビス（４－アミノフェニル）ヘキサフルオロプロパン、２，２－ビス（３－ヒドロキシ－４－アミノフェニル）プロパン、２，２－ビス（３－ヒドロキシ－４－アミノフェニル）ヘキサフルオロプロパン、２，２－ビス（３－アミノ－４－ヒドロキシフェニル）プロパン、２，２－ビス（３－アミノ－４－ヒドロキシフェニル）ヘキサフルオロプロパン、ビス（３－アミノ－４－ヒドロキシフェニル）スルホン、ビス（４－アミノ－３－ヒドロキシフェニル）スルホン、４，４’－ジアミノパラテルフェニル、４，４’－ビス（４－アミノフェノキシ）ビフェニル、ビス［４－（４－アミノフェノキシ）フェニル］スルホン、ビス［４－（３－アミノフェノキシ）フェニル］スルホン、ビス［４－（２－アミノフェノキシ）フェニル］スルホン、１，４－ビス（４－アミノフェノキシ）ベンゼン、９，１０－ビス（４－アミノフェニル）アントラセン、３，３’－ジメチル－４，４’－ジアミノジフェニルスルホン、１，３－ビス（４－アミノフェノキシ）ベンゼン、１，３－ビス（３－アミノフェノキシ）ベンゼン、１，３－ビス（４－アミノフェニル）ベンゼン、３，３’－ジエチル－４，４’－ジアミノジフェニルメタン、３，３’－ジメチル－４，４’－ジアミノジフェニルメタン、４，４’－ジアミノオクタフルオロビフェニル、２，２－ビス［４－（４－アミノフェノキシ）フェニル］プロパン、２，２－ビス［４－（４－アミノフェノキシ）フェニル］ヘキサフルオロプロパン、９，９－ビス（４－アミノフェニル）－１０－ヒドロアントラセン、３，３’，４，４’－テトラアミノビフェニル、３，３’，４，４’－テトラアミノジフェニルエーテル、１，４－ジアミノアントラキノン、１，５－ジアミノアントラキノン、３，３－ジヒドロキシ－４，４’－ジアミノビフェニル、９，９’－ビス（４－アミノフェニル）フルオレン、４，４’－ジメチル－３，３’－ジアミノジフェニルスルホン、３，３’，５，５’－テトラメチル－４，４’－ジアミノジフェニルメタン、２，４－又は２，５－ジアミノクメン、２，５－ジメチル－ｐ－フェニレンジアミン、アセトグアナミン、２，３，５，６－テトラメチル－ｐ－フェニレンジアミン、２，４，６－トリメチル－ｍ－フェニレンジアミン、ビス（３－アミノプロピル）テトラメチルジシロキサン、ビス（ｐ－アミノフェニル）オクタメチルペンタシロキサン、２，７－ジアミノフルオレン、２，５－ジアミノピリジン、１，２－ビス（４－アミノフェニル）エタン、ジアミノベンズアニリド、ジアミノ安息香酸のエステル、１，５－ジアミノナフタレン、ジアミノベンゾトリフルオライド、１，３－ビス（４－アミノフェニル）ヘキサフルオロプロパン、１，４－ビス（４－アミノフェニル）オクタフルオロブタン、１，５－ビス（４－アミノフェニル）デカフルオロペンタン、１，７－ビス（４－アミノフェニル）テトラデカフルオロヘプタン、２，２－ビス［４－（３－アミノフェノキシ）フェニル］ヘキサフルオロプロパン、２，２－ビス［４－（２－アミノフェノキシ）フェニル］ヘキサフルオロプロパン、２，２－ビス［４－（４－アミノフェノキシ）－３，５－ジメチルフェニル］ヘキサフルオロプロパン、２，２－ビス［４－（４－アミノフェノキシ）－３，５－ビス（トリフルオロメチル）フェニル］ヘキサフルオロプロパン、ｐ－ビス（４－アミノ－２－トリフルオロメチルフェノキシ）ベンゼン、４，４’－ビス（４－アミノ－２－トリフルオロメチルフェノキシ）ビフェニル、４，４’－ビス（４－アミノ－３－トリフルオロメチルフェノキシ）ビフェニル、４，４’－ビス（４－アミノ－２－トリフルオロメチルフェノキシ）ジフェニルスルホン、４，４’－ビス（３－アミノ－５－トリフルオロメチルフェノキシ）ジフェニルスルホン、２，２－ビス［４－（４－アミノ－３－トリフルオロメチルフェノキシ）フェニル］ヘキサフルオロプロパン、３，３’，５，５’－テトラメチル－４，４’－ジアミノビフェニル、４，４’－ジアミノ－２，２’－ビス（トリフルオロメチル）ビフェニル、２，２’，５，５’，６，６’－ヘキサフルオロトリジン及び４，４’－ジアミノクアテルフェニルから選ばれる少なくとも１種のジアミンが挙げられる。 As the diamine, specifically, 1,2-diaminoethane, 1,2-diaminopropane, 1,3-diaminopropane, 1,4-diaminobutane or 1,6-diaminohexane;
1,2- or 1,3-diaminocyclopentane, 1,2-, 1,3- or 1,4-diaminocyclohexane, 1,2-, 1,3- or 1,4-bis(aminomethyl)cyclohexane , bis-(4-aminocyclohexyl)methane, bis-(3-aminocyclohexyl)methane, 4,4'-diamino-3,3'-dimethylcyclohexylmethane and isophoronediamine;
m- or p-phenylenediamine, diaminotoluene, 4,4'- or 3,3'-diaminobiphenyl, 4,4'-diaminodiphenyl ether, 3,3-diaminodiphenyl ether, 4,4'- or 3,3' -diaminodiphenylmethane, 4,4'- or 3,3'-diaminodiphenylsulfone, 4,4'- or 3,3'-diaminodiphenylsulfide, 4,4'- or 3,3'-diaminobenzophenone, 3, 3'-dimethyl-4,4'-diaminobiphenyl, 2,2'-dimethyl-4,4'-diaminobiphenyl, 3,3'-dimethoxy-4,4'-diaminobiphenyl, 2,2-bis(4 -aminophenyl)propane, 2,2-bis(4-aminophenyl)hexafluoropropane, 2,2-bis(3-hydroxy-4-aminophenyl)propane, 2,2-bis(3-hydroxy-4- aminophenyl) hexafluoropropane, 2,2-bis(3-amino-4-hydroxyphenyl)propane, 2,2-bis(3-amino-4-hydroxyphenyl)hexafluoropropane, bis(3-amino-4 -hydroxyphenyl) sulfone, bis(4-amino-3-hydroxyphenyl) sulfone, 4,4'-diaminoparaterphenyl, 4,4'-bis(4-aminophenoxy)biphenyl, bis[4-(4- aminophenoxy)phenyl]sulfone, bis[4-(3-aminophenoxy)phenyl]sulfone, bis[4-(2-aminophenoxy)phenyl]sulfone, 1,4-bis(4-aminophenoxy)benzene, 9, 10-bis(4-aminophenyl)anthracene, 3,3'-dimethyl-4,4'-diaminodiphenylsulfone, 1,3-bis(4-aminophenoxy)benzene, 1,3-bis(3-aminophenoxy) ) Benzene, 1,3-bis(4-aminophenyl)benzene, 3,3'-diethyl-4,4'-diaminodiphenylmethane, 3,3'-dimethyl-4,4'-diaminodiphenylmethane, 4,4' -diaminooctafluorobiphenyl, 2,2-bis[4-(4-aminophenoxy)phenyl]propane, 2,2-bis[4-(4-aminophenoxy)phenyl]hexafluoropropane, 9,9-bis( 4-aminophenyl)-10-hydroanthracene, 3,3',4,4'-tetraaminobiphenyl, 3,3',4,4'-tetraamino diphenyl ether, 1,4-diaminoanthraquinone, 1,5- Diaminoanthraquinone, 3,3-dihydroxy-4,4'-diaminobiphenyl, 9,9'-bis(4-aminophenyl)fluorene, 4,4'-dimethyl-3,3'-diaminodiphenylsulfone, 3,3 ',5,5'-tetramethyl-4,4'-diaminodiphenylmethane, 2,4- or 2,5-diaminocumene, 2,5-dimethyl-p-phenylenediamine, acetoguanamine, 2,3,5, 6-tetramethyl-p-phenylenediamine, 2,4,6-trimethyl-m-phenylenediamine, bis(3-aminopropyl)tetramethyldisiloxane, bis(p-aminophenyl)octamethylpentasiloxane, 2,7 -Diaminofluorene, 2,5-diaminopyridine, 1,2-bis(4-aminophenyl)ethane, diaminobenzanilide, ester of diaminobenzoic acid, 1,5-diaminonaphthalene, diaminobenzotrifluoride, 1,3- Bis(4-aminophenyl)hexafluoropropane, 1,4-bis(4-aminophenyl)octafluorobutane, 1,5-bis(4-aminophenyl)decafluoropentane, 1,7-bis(4-amino phenyl)tetradecafluoroheptane, 2,2-bis[4-(3-aminophenoxy)phenyl]hexafluoropropane, 2,2-bis[4-(2-aminophenoxy)phenyl]hexafluoropropane, 2,2 -bis[4-(4-aminophenoxy)-3,5-dimethylphenyl]hexafluoropropane, 2,2-bis[4-(4-aminophenoxy)-3,5-bis(trifluoromethyl)phenyl] Hexafluoropropane, p-bis(4-amino-2-trifluoromethylphenoxy)benzene, 4,4'-bis(4-amino-2-trifluoromethylphenoxy)biphenyl, 4,4'-bis(4- Amino-3-trifluoromethylphenoxy)biphenyl, 4,4'-bis(4-amino-2-trifluoromethylphenoxy)diphenylsulfone, 4,4'-bis(3-amino-5-trifluoromethylphenoxy) diphenylsulfone, 2,2-bis[4-(4-amino-3-trifluoromethylphenoxy)phenyl]hexafluoropropane, 3,3',5,5'-tetramethyl-4,4'-diaminobiphenyl, selected from 4,4'-diamino-2,2'-bis(trifluoromethyl)biphenyl, 2,2',5,5',6,6'-hexafluorotridine and 4,4'-diaminoquaterphenyl At least one type of diamine is mentioned.
　また、国際公開第２０１７／０３８５９８号の段落００３０～００３１に記載のジアミン（ＤＡ－１）～（ＤＡ－１８）も好ましい。 Also preferred are the diamines (DA-1) to (DA-18) described in paragraphs 0030 to 0031 of International Publication No. 2017/038598.
　また、国際公開第２０１７／０３８５９８号の段落００３２～００３４に記載の２つ以上のアルキレングリコール単位を主鎖にもつジアミンも好ましく用いられる。 In addition, diamines having two or more alkylene glycol units in the main chain described in paragraphs 0032 to 0034 of International Publication No. 2017/038598 are also preferably used.
　Ｒ１１１は、得られる有機膜の柔軟性の観点から、－Ａｒ－Ｌ－Ａｒ－で表されることが好ましい。但し、Ａｒは、それぞれ独立に、芳香族基であり、Ｌは、フッ素原子で置換されていてもよい炭素数１～１０の脂肪族炭化水素基、－Ｏ－、－ＣＯ－、－Ｓ－、－ＳＯ２－又は－ＮＨＣＯ－、あるいは、上記の２つ以上の組み合わせからなる基である。Ａｒは、フェニレン基が好ましく、Ｌは、フッ素原子で置換されていてもよい炭素数１又は２の脂肪族炭化水素基、－Ｏ－、－ＣＯ－、－Ｓ－又は－ＳＯ２－が好ましい。ここでの脂肪族炭化水素基は、アルキレン基が好ましい。 R 111 is preferably represented by -Ar-L-Ar- from the viewpoint of flexibility of the resulting organic film. However, Ar is each independently an aromatic group, and L is an aliphatic hydrocarbon group having 1 to 10 carbon atoms which may be substituted with a fluorine atom, -O-, -CO-, -S- , -SO 2 -, -NHCO-, or a combination of two or more of the above. Ar is preferably a phenylene group, and L is preferably an aliphatic hydrocarbon group having 1 or 2 carbon atoms optionally substituted with a fluorine atom, -O-, -CO-, -S- or -SO 2 - . The aliphatic hydrocarbon group here is preferably an alkylene group.
　また、Ｒ１１１は、ｉ線透過率の観点から、下記式（５１）又は式（６１）で表される２価の有機基であることが好ましい。特に、ｉ線透過率、入手のし易さの観点から、式（６１）で表される２価の有機基であることがより好ましい。
　式（５１）

　式（５１）中、Ｒ５０～Ｒ５７は、それぞれ独立に、水素原子、フッ素原子又は１価の有機基であり、Ｒ５０～Ｒ５７の少なくとも１つは、フッ素原子、メチル基又はトリフルオロメチル基であり、＊はそれぞれ独立に、式（２）中の窒素原子との結合部位を表す。
　Ｒ５０～Ｒ５７の１価の有機基としては、炭素数１～１０（好ましくは炭素数１～６）の無置換のアルキル基、炭素数１～１０（好ましくは炭素数１～６）のフッ化アルキル基等が挙げられる。

　式（６１）中、Ｒ５８及びＲ５９は、それぞれ独立に、フッ素原子、メチル基、又はトリフルオロメチル基であり、＊はそれぞれ独立に、式（２）中の窒素原子との結合部位を表す。
　式（５１）又は式（６１）の構造を与えるジアミンとしては、２，２’－ジメチルベンジジン、２，２’－ビス（トリフルオロメチル）－４，４’－ジアミノビフェニル、２，２’－ビス（フルオロ）－４，４’－ジアミノビフェニル、４，４’－ジアミノオクタフルオロビフェニル等が挙げられる。これらは１種又は２種以上を組み合わせて用いてもよい。 Further, from the viewpoint of i-ray transmittance, R 111 is preferably a divalent organic group represented by the following formula (51) or formula (61). In particular, from the viewpoint of i-ray transmittance and availability, a divalent organic group represented by formula (61) is more preferable.
Formula (51)

In formula (51), R 50 to R 57 are each independently a hydrogen atom, a fluorine atom, or a monovalent organic group, and at least one of R 50 to R 57 is a fluorine atom, a methyl group, or a trifluoro It is a methyl group, and each * independently represents a bonding site with the nitrogen atom in formula (2).
The monovalent organic groups R 50 to R 57 include unsubstituted alkyl groups having 1 to 10 carbon atoms (preferably 1 to 6 carbon atoms), and unsubstituted alkyl groups having 1 to 10 carbon atoms (preferably 1 to 6 carbon atoms). Examples include fluorinated alkyl groups.

In formula (61), R 58 and R 59 each independently represent a fluorine atom, a methyl group, or a trifluoromethyl group, and * each independently represents a bonding site with the nitrogen atom in formula (2). represent.
Examples of the diamine giving the structure of formula (51) or formula (61) include 2,2'-dimethylbenzidine, 2,2'-bis(trifluoromethyl)-4,4'-diaminobiphenyl, 2,2'- Bis(fluoro)-4,4'-diaminobiphenyl, 4,4'-diaminoctafluorobiphenyl, and the like. These may be used alone or in combination of two or more.
　式（２）におけるＲ１１５は、４価の有機基を表す。４価の有機基としては、芳香環を含む４価の有機基が好ましく、下記式（５）又は式（６）で表される基がより好ましい。
式（５）又は式（６）中、＊はそれぞれ独立に、他の構造との結合部位を表す。

　式（５）中、Ｒ１１２は単結合又は２価の連結基であり、単結合、又は、フッ素原子で置換されていてもよい炭素数１～１０の脂肪族炭化水素基、－Ｏ－、－ＣＯ－、－Ｓ－、－ＳＯ２－、及び－ＮＨＣＯ－、ならびに、これらの組み合わせから選択される基であることが好ましく、単結合、または、フッ素原子で置換されていてもよい炭素数１～３のアルキレン基、－Ｏ－、－ＣＯ－、－Ｓ－及び－ＳＯ２－から選択される基であることがより好ましく、－ＣＨ２－、－Ｃ（ＣＦ３）２－、－Ｃ（ＣＨ３）２－、－Ｏ－、－ＣＯ－、－Ｓ－及び－ＳＯ２－からなる群より選択される２価の基であることが更に好ましい。 R 115 in formula (2) represents a tetravalent organic group. As the tetravalent organic group, a tetravalent organic group containing an aromatic ring is preferable, and a group represented by the following formula (5) or formula (6) is more preferable.
In formula (5) or formula (6), * each independently represents a bonding site with another structure.

In formula (5), R 112 is a single bond or a divalent linking group, and is a single bond or an aliphatic hydrocarbon group having 1 to 10 carbon atoms, which may be substituted with a fluorine atom, -O-, A group selected from -CO-, -S-, -SO 2 -, -NHCO-, and combinations thereof is preferable, and the number of carbon atoms optionally substituted with a single bond or a fluorine atom is preferable. More preferably, it is a group selected from 1 to 3 alkylene groups, -O-, -CO-, -S- and -SO 2 -, including -CH 2 -, -C(CF 3 ) 2 -, - More preferably, it is a divalent group selected from the group consisting of C(CH 3 ) 2 -, -O-, -CO-, -S- and -SO 2 -.
　Ｒ１１５は、具体的には、テトラカルボン酸二無水物から無水物基の除去後に残存するテトラカルボン酸残基などが挙げられる。特定樹脂は、Ｒ１１５に該当する構造として、テトラカルボン酸二無水物残基を、１種のみ含んでもよいし、２種以上含んでもよい。
　テトラカルボン酸二無水物は、下記式（Ｏ）で表されることが好ましい。
Figure JPOXMLDOC01-appb-C000026
　式（Ｏ）中、Ｒ１１５は、４価の有機基を表す。Ｒ１１５の好ましい範囲は式（２）におけるＲ１１５と同義であり、好ましい範囲も同様である。 Specific examples of R 115 include a tetracarboxylic acid residue remaining after removal of an anhydride group from a tetracarboxylic dianhydride. The specific resin may contain only one type of tetracarboxylic dianhydride residue, or may contain two or more types of tetracarboxylic dianhydride residues as the structure corresponding to R115 .
It is preferable that the tetracarboxylic dianhydride is represented by the following formula (O).
Figure JPOXMLDOC01-appb-C000026
In formula (O), R 115 represents a tetravalent organic group. The preferred range of R 115 is the same as R 115 in formula (2), and the preferred range is also the same.
　テトラカルボン酸二無水物の具体例としては、ピロメリット酸二無水物（ＰＭＤＡ）、３，３’，４，４’－ビフェニルテトラカルボン酸二無水物、３，３’，４，４’－ジフェニルスルフィドテトラカルボン酸二無水物、３，３’，４，４’－ジフェニルスルホンテトラカルボン酸二無水物、３，３’，４，４’－ベンゾフェノンテトラカルボン酸二無水物、３，３’，４，４’－ジフェニルメタンテトラカルボン酸二無水物、２，２’，３，３’－ジフェニルメタンテトラカルボン酸二無水物、２，３，３’，４’－ビフェニルテトラカルボン酸二無水物、２，３，３’，４’－ベンゾフェノンテトラカルボン酸二無水物、４，４’－オキシジフタル酸二無水物、２，３，６，７－ナフタレンテトラカルボン酸二無水物、１，４，５，７－ナフタレンテトラカルボン酸二無水物、２，２－ビス（３，４－ジカルボキシフェニル）プロパン二無水物、２，２－ビス（２，３－ジカルボキシフェニル）プロパン二無水物、２，２－ビス（３，４－ジカルボキシフェニル）ヘキサフルオロプロパン二無水物、１，３－ジフェニルヘキサフルオロプロパン－３，３，４，４－テトラカルボン酸二無水物、１，４，５，６－ナフタレンテトラカルボン酸二無水物、２，２’，３，３’－ジフェニルテトラカルボン酸二無水物、３，４，９，１０－ペリレンテトラカルボン酸二無水物、１，２，４，５－ナフタレンテトラカルボン酸二無水物、１，４，５，８－ナフタレンテトラカルボン酸二無水物、１，８，９，１０－フェナントレンテトラカルボン酸二無水物、１，１－ビス（２，３－ジカルボキシフェニル）エタン二無水物、１，１－ビス（３，４－ジカルボキシフェニル）エタン二無水物、１，２，３，４－ベンゼンテトラカルボン酸二無水物、ならびに、これらの炭素数１～６のアルキル及び炭素数１～６のアルコキシ誘導体が挙げられる。 Specific examples of tetracarboxylic dianhydride include pyromellitic dianhydride (PMDA), 3,3',4,4'-biphenyltetracarboxylic dianhydride, 3,3',4,4'- Diphenylsulfidetetracarboxylic dianhydride, 3,3',4,4'-diphenylsulfonetetracarboxylic dianhydride, 3,3',4,4'-benzophenonetetracarboxylic dianhydride, 3,3' , 4,4'-diphenylmethanetetracarboxylic dianhydride, 2,2',3,3'-diphenylmethanetetracarboxylic dianhydride, 2,3,3',4'-biphenyltetracarboxylic dianhydride, 2,3,3',4'-benzophenonetetracarboxylic dianhydride, 4,4'-oxydiphthalic dianhydride, 2,3,6,7-naphthalenetetracarboxylic dianhydride, 1,4,5 , 7-naphthalenetetracarboxylic dianhydride, 2,2-bis(3,4-dicarboxyphenyl)propane dianhydride, 2,2-bis(2,3-dicarboxyphenyl)propane dianhydride, 2 , 2-bis(3,4-dicarboxyphenyl)hexafluoropropane dianhydride, 1,3-diphenylhexafluoropropane-3,3,4,4-tetracarboxylic dianhydride, 1,4,5, 6-naphthalenetetracarboxylic dianhydride, 2,2',3,3'-diphenyltetracarboxylic dianhydride, 3,4,9,10-perylenetetracarboxylic dianhydride, 1,2,4, 5-naphthalenetetracarboxylic dianhydride, 1,4,5,8-naphthalenetetracarboxylic dianhydride, 1,8,9,10-phenanthrenetetracarboxylic dianhydride, 1,1-bis(2, 3-dicarboxyphenyl)ethane dianhydride, 1,1-bis(3,4-dicarboxyphenyl)ethane dianhydride, 1,2,3,4-benzenetetracarboxylic dianhydride, and these Examples include alkyl derivatives having 1 to 6 carbon atoms and alkoxy derivatives having 1 to 6 carbon atoms.
また、国際公開第２０１７／０３８５９８号の段落００３８に記載のテトラカルボン酸二無水物（ＤＡＡ－１）～（ＤＡＡ－５）も好ましい例として挙げられる。 Further, preferred examples include tetracarboxylic dianhydrides (DAA-1) to (DAA-5) described in paragraph 0038 of International Publication No. 2017/038598.
　式（２）において、Ｒ１１１とＲ１１５の少なくとも一方がＯＨ基を有することも可能である。より具体的には、Ｒ１１１として、ビスアミノフェノール誘導体の残基が挙げられる。 In formula (2), at least one of R 111 and R 115 may have an OH group. More specifically, R 111 includes a residue of a bisaminophenol derivative.
　式（２）におけるＲ１１３及びＲ１１４は、それぞれ独立に、水素原子又は１価の有機基を表す。１価の有機基としては、直鎖又は分岐のアルキル基、環状アルキル基、芳香族基、又はポリアルキレンオキシ基を含むことが好ましい。また、Ｒ１１３及びＲ１１４の少なくとも一方が重合性基を含むことが好ましく、両方が重合性基を含むことがより好ましい。Ｒ１１３及びＲ１１４の少なくとも一方が２以上の重合性基を含むことも好ましい。重合性基としては、熱、ラジカル等の作用により、架橋反応することが可能な基であって、ラジカル重合性基が好ましい。重合性基の具体例としては、エチレン性不飽和結合を有する基、アルコキシメチル基、ヒドロキシメチル基、アシルオキシメチル基、エポキシ基、オキセタニル基、ベンゾオキサゾリル基、ブロックイソシアネート基、アミノ基が挙げられる。特定樹脂が有するラジカル重合性基としては、エチレン性不飽和結合を有する基が好ましい。
　エチレン性不飽和結合を有する基としては、ビニル基、アリル基、イソアリル基、２－メチルアリル基、ビニル基と直接結合した芳香環を有する基（例えば、ビニルフェニル基など）、（メタ）アクリルアミド基、（メタ）アクリロイルオキシ基、上述の式（ＩＩＩ）で表される基などが挙げられ、上述の式（ＩＩＩ）で表される基が好ましい。 R 113 and R 114 in formula (2) each independently represent a hydrogen atom or a monovalent organic group. The monovalent organic group preferably includes a linear or branched alkyl group, a cyclic alkyl group, an aromatic group, or a polyalkyleneoxy group. Moreover, it is preferable that at least one of R 113 and R 114 contains a polymerizable group, and it is more preferable that both of them contain a polymerizable group. It is also preferable that at least one of R 113 and R 114 contains two or more polymerizable groups. The polymerizable group is a group that can undergo a crosslinking reaction by the action of heat, radicals, etc., and a radically polymerizable group is preferable. Specific examples of the polymerizable group include a group having an ethylenically unsaturated bond, an alkoxymethyl group, a hydroxymethyl group, an acyloxymethyl group, an epoxy group, an oxetanyl group, a benzoxazolyl group, a blocked isocyanate group, and an amino group. It will be done. The radically polymerizable group contained in the specific resin is preferably a group having an ethylenically unsaturated bond.
Examples of the group having an ethylenically unsaturated bond include a vinyl group, an allyl group, an isoallyl group, a 2-methylallyl group, a group having an aromatic ring directly bonded to a vinyl group (for example, a vinyl phenyl group, etc.), and a (meth)acrylamide group. , (meth)acryloyloxy group, a group represented by the above formula (III), and the like, with the group represented by the above formula (III) being preferred.
　式（２）において、Ｒ１１３が水素原子である場合、又は、Ｒ１１４が水素原子である場合、特定樹脂はエチレン性不飽和結合を有する３級アミン化合物と対塩を形成していてもよい。このようなエチレン性不飽和結合を有する３級アミン化合物の例としては、Ｎ，Ｎ－ジメチルアミノプロピルメタクリレートが挙げられる。 In formula (2), when R 113 is a hydrogen atom, or when R 114 is a hydrogen atom, the specific resin may form a counter salt with a tertiary amine compound having an ethylenically unsaturated bond. . An example of a tertiary amine compound having such an ethylenically unsaturated bond is N,N-dimethylaminopropyl methacrylate.
　特定樹脂は、構造中にフッ素原子を有することも好ましい。ポリイミド前駆体中のフッ素原子含有量は、１０質量％以上が好ましく、また、２０質量％以下が好ましい。 It is also preferable that the specific resin has a fluorine atom in its structure. The fluorine atom content in the polyimide precursor is preferably 10% by mass or more, and preferably 20% by mass or less.
　また、基板との密着性を向上させる目的で、特定樹脂は、シロキサン構造を有する脂肪族基と共重合していてもよい。具体的には、ジアミンとして、ビス（３－アミノプロピル）テトラメチルジシロキサン、ビス（ｐ－アミノフェニル）オクタメチルペンタシロキサンなどを用いる態様が挙げられる。 Additionally, the specific resin may be copolymerized with an aliphatic group having a siloxane structure for the purpose of improving adhesion to the substrate. Specifically, examples include embodiments in which bis(3-aminopropyl)tetramethyldisiloxane, bis(p-aminophenyl)octamethylpentasiloxane, etc. are used as the diamine.
　式（２）で表される繰返し単位は、式（２－Ａ）で表される繰返し単位であることが好ましい。すなわち、本発明で用いる特定樹脂の少なくとも１種が、式（２－Ａ）で表される繰返し単位を有する前駆体であることが好ましい。特定樹脂が式（２－Ａ）で表される繰返し単位を含むことにより、露光ラチチュードの幅をより広げることが可能になる。
式（２－Ａ）
Figure JPOXMLDOC01-appb-C000027
　式（２－Ａ）中、Ａ１及びＡ２は、酸素原子を表し、Ｒ１１１及びＲ１１２は、それぞれ独立に、２価の有機基を表し、Ｒ１１３及びＲ１１４は、それぞれ独立に、水素原子又は１価の有機基を表し、Ｒ１１３及びＲ１１４の少なくとも一方は、重合性基を含む基であり、両方が重合性基を含む基であることが好ましい。 The repeating unit represented by formula (2) is preferably a repeating unit represented by formula (2-A). That is, it is preferable that at least one of the specific resins used in the present invention is a precursor having a repeating unit represented by formula (2-A). When the specific resin contains a repeating unit represented by formula (2-A), it becomes possible to further widen the exposure latitude.
Formula (2-A)
Figure JPOXMLDOC01-appb-C000027
In formula (2-A), A 1 and A 2 represent an oxygen atom, R 111 and R 112 each independently represent a divalent organic group, and R 113 and R 114 each independently, It represents a hydrogen atom or a monovalent organic group, and at least one of R 113 and R 114 is a group containing a polymerizable group, and preferably both are groups containing a polymerizable group.
　Ａ１、Ａ２、Ｒ１１１、Ｒ１１３及びＲ１１４は、それぞれ独立に、式（２）におけるＡ１、Ａ２、Ｒ１１１、Ｒ１１３及びＲ１１４と同義であり、好ましい範囲も同様である。Ｒ１１２は、式（５）におけるＲ１１２と同義であり、好ましい範囲も同様である。 A 1 , A 2 , R 111 , R 113 and R 114 each independently have the same meaning as A 1 , A 2 , R 111 , R 113 and R 114 in formula (2), and their preferred ranges are also the same. . R 112 has the same meaning as R 112 in formula (5), and the preferred ranges are also the same.
　特定樹脂は、式（２）で表される繰返し単位を１種含んでいてもよいが、２種以上で含んでいてもよい。また、式（２）で表される繰返し単位の構造異性体を含んでいてもよい。特定樹脂は、上記式（２）の繰返し単位のほかに、他の種類の繰返し単位をも含んでいてもよい。 The specific resin may contain one type of repeating unit represented by formula (2), or may contain two or more types. Furthermore, it may contain structural isomers of the repeating unit represented by formula (2). In addition to the repeating unit of the above formula (2), the specific resin may also contain other types of repeating units.
　特定樹脂は、式（１）～（２）で表される繰返し単位とは異なる他の繰返し単位を更に含んでもよい。
　他の繰返し単位としては、例えば下記式（ＰＡＩ－２）で表される繰返し単位が挙げられる。

　式（ＰＡＩ－２）中、Ｒ１１７は３価の有機基を表し、Ｒ１１１は２価の有機基を表し、Ａ２は酸素原子又は－ＮＨ－を表し、Ｒ１１３は水素原子又は１価の有機基を表す。 The specific resin may further contain other repeating units different from the repeating units represented by formulas (1) to (2).
Examples of other repeating units include a repeating unit represented by the following formula (PAI-2).

In formula (PAI-2), R 117 represents a trivalent organic group, R 111 represents a divalent organic group, A 2 represents an oxygen atom or -NH-, and R 113 represents a hydrogen atom or a monovalent organic group. represents an organic group.
　式（ＰＡＩ－２）中、Ｒ１１７は、直鎖状又は分岐鎖状の脂肪族基、環状の脂肪族基、及び芳香族基、複素芳香族基、又は単結合若しくは連結基によりこれらを２以上連結した基が例示され、炭素数２～２０の直鎖の脂肪族基、炭素数３～２０の分岐の脂肪族基、炭素数３～２０の環状の脂肪族基、炭素数６～２０の芳香族基、又は、単結合若しくは連結基によりこれらを２以上組み合わせた基が好ましく、炭素数６～２０の芳香族基、又は、単結合若しくは連結基により炭素数６～２０の芳香族基を２以上組み合わせた基がより好ましい。
　上記連結基としては、－Ｏ－、－Ｓ－、－Ｃ（＝Ｏ）－、－Ｓ（＝Ｏ）２－、アルキレン基、ハロゲン化アルキレン基、アリーレン基、又はこれらを２以上結合した連結基が好ましく、－Ｏ－、－Ｓ－、アルキレン基、ハロゲン化アルキレン基、アリーレン基、又はこれらを２以上結合した連結基がより好ましい。
　上記アルキレン基としては、炭素数１～２０のアルキレン基が好ましく、炭素数１～１０のアルキレン基がより好ましく、炭素数１～４のアルキレン基が更に好ましい。
　上記ハロゲン化アルキレン基としては、炭素数１～２０のハロゲン化アルキレン基が好ましく、炭素数１～１０のハロゲン化アルキレン基がより好ましく、炭素数１～４のハロゲン化アルキレン基がより好ましい。また、上記ハロゲン化アルキレン基におけるハロゲン原子としては、フッ素原子、塩素原子、臭素原子、ヨウ素原子等が挙げられ、フッ素原子が好ましい。上記ハロゲン化アルキレン基は、水素原子を有していても、水素原子の全てがハロゲン原子で置換されていてもよいが、水素原子の全てがハロゲン原子で置換されていることが好ましい。好ましいハロゲン化アルキレン基の例としては、（ジトリフルオロメチル）メチレン基等が挙げられる。
　上記アリーレン基としては、フェニレン基又はナフチレン基が好ましく、フェニレン基がより好ましく、１，３－フェニレン基又は１，４－フェニレン基が更に好ましい。 In formula (PAI-2), R 117 is a linear or branched aliphatic group, a cyclic aliphatic group, an aromatic group, a heteroaromatic group, or a single bond or a linking group that binds these two groups. Examples of the above-linked groups include linear aliphatic groups having 2 to 20 carbon atoms, branched aliphatic groups having 3 to 20 carbon atoms, cyclic aliphatic groups having 3 to 20 carbon atoms, and 6 to 20 carbon atoms. An aromatic group having 6 to 20 carbon atoms, or a group having 6 to 20 carbon atoms combined with a single bond or a connecting group is preferable. A group combining two or more of these is more preferable.
The above-mentioned linking group includes -O-, -S-, -C(=O)-, -S(=O) 2 -, an alkylene group, a halogenated alkylene group, an arylene group, or a linkage of two or more of these. The group is preferably a group such as -O-, -S-, an alkylene group, a halogenated alkylene group, an arylene group, or a linking group in which two or more of these are bonded together.
The alkylene group is preferably an alkylene group having 1 to 20 carbon atoms, more preferably an alkylene group having 1 to 10 carbon atoms, and even more preferably an alkylene group having 1 to 4 carbon atoms.
The above halogenated alkylene group is preferably a halogenated alkylene group having 1 to 20 carbon atoms, more preferably a halogenated alkylene group having 1 to 10 carbon atoms, and more preferably a halogenated alkylene group having 1 to 4 carbon atoms. Furthermore, examples of the halogen atom in the halogenated alkylene group include a fluorine atom, a chlorine atom, a bromine atom, an iodine atom, and the like, with a fluorine atom being preferred. The halogenated alkylene group may have a hydrogen atom or all of the hydrogen atoms may be substituted with a halogen atom, but it is preferable that all of the hydrogen atoms are substituted with a halogen atom. Examples of preferred halogenated alkylene groups include (ditrifluoromethyl)methylene groups and the like.
The arylene group is preferably a phenylene group or a naphthylene group, more preferably a phenylene group, and even more preferably a 1,3-phenylene group or a 1,4-phenylene group.
　また、Ｒ１１７は少なくとも１つのカルボキシ基がハロゲン化されていてもよいトリカルボン酸化合物から誘導されることが好ましい。上記ハロゲン化としては、塩素化が好ましい。
　本発明において、カルボキシ基を３つ有する化合物をトリカルボン酸化合物という。
　上記トリカルボン酸化合物の３つのカルボキシ基のうち２つのカルボキシ基は酸無水物化されていてもよい。
　ポリアミドイミド前駆体の製造に用いられるハロゲン化されていてもよいトリカルボン酸化合物としては、分岐鎖状の脂肪族、環状の脂肪族又は芳香族のトリカルボン酸化合物などが挙げられる。
　これらのトリカルボン酸化合物は、１種のみ用いてもよいし、２種以上用いてもよい。 Further, R 117 is preferably derived from a tricarboxylic acid compound in which at least one carboxy group may be halogenated. As the halogenation, chlorination is preferable.
In the present invention, a compound having three carboxy groups is referred to as a tricarboxylic acid compound.
Two of the three carboxy groups of the tricarboxylic acid compound may be converted into acid anhydrides.
Examples of the optionally halogenated tricarboxylic acid compound used in the production of the polyamideimide precursor include branched aliphatic, cyclic aliphatic, or aromatic tricarboxylic acid compounds.
These tricarboxylic acid compounds may be used alone or in combination of two or more.
　具体的には、トリカルボン酸化合物としては、炭素数２～２０の直鎖の脂肪族基、炭素数３～２０の分岐の脂肪族基、炭素数３～２０の環状の脂肪族基、炭素数６～２０の芳香族基、又は、単結合若しくは連結基によりこれらを２以上組み合わせた基を含むトリカルボン酸化合物が好ましく、炭素数６～２０の芳香族基、又は、単結合若しくは連結基により炭素数６～２０の芳香族基を２以上組み合わせた基を含むトリカルボン酸化合物がより好ましい。 Specifically, the tricarboxylic acid compound includes a linear aliphatic group having 2 to 20 carbon atoms, a branched aliphatic group having 3 to 20 carbon atoms, a cyclic aliphatic group having 3 to 20 carbon atoms, and a cyclic aliphatic group having 3 to 20 carbon atoms. A tricarboxylic acid compound containing an aromatic group having 6 to 20 carbon atoms or a combination of two or more of these through a single bond or a connecting group is preferred; A tricarboxylic acid compound containing a combination of two or more aromatic groups of 6 to 20 is more preferred.
　また、トリカルボン酸化合物の具体例としては、１，２，３－プロパントリカルボン酸、１，３，５－ペンタントリカルボン酸、クエン酸、トリメリット酸、２，３，６－ナフタレントリカルボン酸、フタル酸（又は、無水フタル酸）と安息香酸とが単結合、－Ｏ－、－ＣＨ２－、－Ｃ（ＣＨ３）２－、－Ｃ（ＣＦ３）２－、－ＳＯ２－又はフェニレン基で連結された化合物等が挙げられる。
　これらの化合物は、２つのカルボキシ基が無水物化した化合物（例えば、トリメリット酸無水物）であってもよいし、少なくとも１つのカルボキシ基がハロゲン化した化合物（例えば、無水トリメリット酸クロリド）であってもよい。 Specific examples of tricarboxylic acid compounds include 1,2,3-propanetricarboxylic acid, 1,3,5-pentanetricarboxylic acid, citric acid, trimellitic acid, 2,3,6-naphthalenetricarboxylic acid, and phthalic acid. (or phthalic anhydride) and benzoic acid have a single bond, -O-, -CH 2 -, -C(CH 3 ) 2 -, -C(CF 3 ) 2 -, -SO 2 - or phenylene group. Examples include linked compounds.
These compounds may be compounds in which two carboxyl groups are anhydrides (for example, trimellitic anhydride), or compounds in which at least one carboxyl group is halogenated (for example, trimellitic anhydride). There may be.
　式（ＰＡＩ－２）中、Ｒ１１１、Ａ２、Ｒ１１３はそれぞれ、上述の式（２）におけるＲ１１１、Ａ２、Ｒ１１３と同義であり、好ましい態様も同様である。 In formula (PAI-2), R 111 , A 2 and R 113 have the same meanings as R 111 , A 2 and R 113 in formula (2) above, respectively, and preferred embodiments are also the same.
　特定樹脂の一実施形態として、式（１）で表される繰返し単位の含有量が、全繰返し単位の５０モル％以上である態様が挙げられる。上記合計含有量は、７０モル％以上であることがより好ましく、９０モル％以上であることが更に好ましく、９０モル％超であることが特に好ましい。上記合計含有量の上限は、特に限定されず、末端を除く特定樹脂における全ての繰返し単位が、式（１）で表される繰返し単位であってもよい。
　特定樹脂が、式（１）で表される繰返し単位であって、Ｘ１がエーテル結合を２個以上有する繰返し単位（繰返し単位１）及び、式（１）で表される繰返し単位であって、Ｘ１が下記式（２ａ）～式（２ｄ）のいずれかで表される構造である繰返し単位（繰返し単位２）を含む場合、繰返し単位１、及び、繰返し単位２の合計含有モル量に対して、繰返し単位１の含有量は、５～５０モル％であることが好ましく、１０～４０モル％であることがより好ましい。 One embodiment of the specific resin includes an aspect in which the content of repeating units represented by formula (1) is 50 mol% or more of all repeating units. The total content is more preferably 70 mol% or more, still more preferably 90 mol% or more, and particularly preferably more than 90 mol%. The upper limit of the total content is not particularly limited, and all repeating units in the specific resin excluding the terminal may be repeating units represented by formula (1).
The specific resin is a repeating unit represented by formula (1), in which X 1 has two or more ether bonds (repeat unit 1), and a repeating unit represented by formula (1), , X 1 contains a repeating unit (repeat unit 2) having a structure represented by any of the following formulas (2a) to (2d), the total molar content of repeating unit 1 and repeating unit 2 On the other hand, the content of repeating unit 1 is preferably 5 to 50 mol%, more preferably 10 to 40 mol%.
　特定樹脂の重量平均分子量（Ｍｗ）は、５，０００～２００，０００が好ましく、１０，０００～１５０，０００がより好ましく、３０，０００～１２０，０００が更に好ましく、４０，０００～１００，０００が特に好ましい。特定樹脂の数平均分子量（Ｍｎ）は、２，０００～１００，０００が好ましく、３，０００～６０，０００がより好ましく、１０，０００～５０，０００が更に好ましく、２０，０００～４０，０００が特に好ましい。
　上記特定樹脂の分子量の分散度は、４．０以下が好ましく、３．０以下がより好ましく、２．５以下であることが更に好ましい。上記分散度の下限は特に限定されず、１．０以上であればよい。
　本明細書において、分子量の分散度とは、重量平均分子量／数平均分子量により算出される値である。
　樹脂組成物が複数種の特定樹脂を含む場合、少なくとも１種の特定樹脂の重量平均分子量、数平均分子量、及び、分散度が上記範囲であることが好ましい。また、上記複数種の特定樹脂を１つの樹脂として算出した重量平均分子量、数平均分子量、及び、分散度が、それぞれ、上記範囲内であることも好ましい。 The weight average molecular weight (Mw) of the specific resin is preferably 5,000 to 200,000, more preferably 10,000 to 150,000, even more preferably 30,000 to 120,000, and even more preferably 40,000 to 100,000. is particularly preferred. The number average molecular weight (Mn) of the specific resin is preferably 2,000 to 100,000, more preferably 3,000 to 60,000, even more preferably 10,000 to 50,000, and even more preferably 20,000 to 40,000. is particularly preferred.
The molecular weight dispersity of the specific resin is preferably 4.0 or less, more preferably 3.0 or less, and even more preferably 2.5 or less. The lower limit of the above-mentioned dispersity is not particularly limited, and may be 1.0 or more.
In this specification, the molecular weight dispersity is a value calculated by weight average molecular weight/number average molecular weight.
When the resin composition contains multiple types of specific resins, it is preferable that the weight average molecular weight, number average molecular weight, and degree of dispersion of at least one type of specific resin are within the above ranges. Further, it is also preferable that the weight average molecular weight, number average molecular weight, and degree of dispersion calculated by considering the plurality of types of specific resins as one resin are each within the above ranges.
〔特定樹脂の製造方法〕
　特定樹脂は、例えば、後述する実施例に記載の方法により合成することができるが、これに限定されるものではない。
　具体的には、例えば、低温中でテトラカルボン酸二無水物とジアミンを反応させる方法、低温中でテトラカルボン酸二無水物とジアミンを反応させてポリアミック酸を得、縮合剤又はアルキル化剤を用いてエステル化する方法、テトラカルボン酸二無水物とアルコールとによりジエステルを得て、その後ジアミンと縮合剤の存在下で反応させる方法、テトラカルボン酸二無水物とアルコールとによりジエステルを得、その後残りのジカルボン酸をハロゲン化剤を用いて酸ハロゲン化し、ジアミンと反応させる方法、などの方法を利用して得ることができる。上記製造方法のうち、テトラカルボン酸二無水物とアルコールとによりジエステルを得、その後残りのジカルボン酸をハロゲン化剤を用いて酸ハロゲン化し、ジアミンと反応させる方法がより好ましい。
　上記縮合剤としては、例えばジシクロヘキシルカルボジイミド、ジイソプロピルカルボジイミド、１－エトキシカルボニル－２－エトキシ－１，２－ジヒドロキノリン、１，１－カルボニルジオキシ－ジ－１，２，３－ベンゾトリアゾール、Ｎ，Ｎ’－ジスクシンイミジルカーボネート、無水トリフルオロ酢酸等が挙げられる。
　上記アルキル化剤としては、Ｎ，Ｎ－ジメチルホルムアミドジメチルアセタール、Ｎ，Ｎ－ジメチルホルムアミドジエチルアセタール、Ｎ，Ｎ－ジアルキルホルムアミドジアルキルアセタール、オルトギ酸トリメチル、オルトギ酸トリエチル等が挙げられる。
　上記ハロゲン化剤としては、塩化チオニル、塩化オキサリル、オキシ塩化リン等が挙げられる。
　特定樹脂の製造方法では、反応に際し、有機溶剤を用いることが好ましい。有機溶剤は１種でもよいし、２種以上でもよい。
　有機溶剤としては、原料に応じて適宜定めることができるが、ピリジン、ジエチレングリコールジメチルエーテル（ジグリム）、Ｎ－メチルピロリドン、Ｎ－エチルピロリドン、プロピオン酸エチル、ジメチルアセトアミド、ジメチルホルムアミド、テトラヒドロフラン、γ－ブチロラクトン等が例示される。
　特定樹脂の製造方法では、反応に際し、塩基性化合物を添加することが好ましい。塩基性化合物は１種でもよいし、２種以上でもよい。
　塩基性化合物は、原料に応じて適宜定めることができるが、トリエチルアミン、ジイソプロピルエチルアミン、ピリジン、１，８－ジアザビシクロ［５．４．０］ウンデカ－７－エン、Ｎ，Ｎ－ジメチル－４－アミノピリジン等が例示される。 [Production method of specific resin]
The specific resin can be synthesized, for example, by the method described in the Examples below, but is not limited thereto.
Specifically, for example, a method of reacting a tetracarboxylic dianhydride and a diamine at a low temperature, a method of reacting a tetracarboxylic dianhydride and a diamine at a low temperature to obtain a polyamic acid, and a method of reacting a polyamic acid with a condensing agent or an alkylating agent. A method of obtaining a diester using tetracarboxylic dianhydride and an alcohol, and then reacting it with a diamine in the presence of a condensing agent, a method of obtaining a diester using a tetracarboxylic dianhydride and an alcohol, and then It can be obtained by using a method such as acid halogenating the remaining dicarboxylic acid using a halogenating agent and reacting it with a diamine. Among the above production methods, a method in which a diester is obtained from a tetracarboxylic dianhydride and an alcohol, and then the remaining dicarboxylic acid is acid-halogenated using a halogenating agent and reacted with a diamine is more preferable.
Examples of the condensing agent include dicyclohexylcarbodiimide, diisopropylcarbodiimide, 1-ethoxycarbonyl-2-ethoxy-1,2-dihydroquinoline, 1,1-carbonyldioxy-di-1,2,3-benzotriazole, N, Examples include N'-disuccinimidyl carbonate and trifluoroacetic anhydride.
Examples of the alkylating agent include N,N-dimethylformamide dimethyl acetal, N,N-dimethylformamide diethyl acetal, N,N-dialkylformamide dialkyl acetal, trimethyl orthoformate, and triethyl orthoformate.
Examples of the halogenating agent include thionyl chloride, oxalyl chloride, phosphorus oxychloride, and the like.
In the method for producing the specific resin, it is preferable to use an organic solvent during the reaction. The number of organic solvents may be one or two or more.
The organic solvent can be determined as appropriate depending on the raw material, and examples include pyridine, diethylene glycol dimethyl ether (diglyme), N-methylpyrrolidone, N-ethylpyrrolidone, ethyl propionate, dimethylacetamide, dimethylformamide, tetrahydrofuran, γ-butyrolactone, etc. is exemplified.
In the method for producing the specific resin, it is preferable to add a basic compound during the reaction. The number of basic compounds may be one or two or more.
The basic compound can be determined as appropriate depending on the raw material, but triethylamine, diisopropylethylamine, pyridine, 1,8-diazabicyclo[5.4.0]undec-7-ene, N,N-dimethyl-4-amino Examples include pyridine.
－末端封止剤－
　特定樹脂の製造方法に際し、保存安定性をより向上させるため、特定樹脂の樹脂末端に残存するカルボン酸無水物、酸無水物誘導体、或いは、アミノ基を封止することが好ましい。樹脂末端に残存するカルボン酸無水物、及び酸無水物誘導体を封止する際、末端封止剤としては、モノアルコール、フェノール、チオール、チオフェノール、モノアミン等が挙げられ、反応性、膜の安定性から、モノアルコール、フェノール類やモノアミンを用いることがより好ましい。モノアルコールの好ましい化合物としては、メタノール、エタノール、プロパノール、ブタノール、ヘキサノール、オクタノール、ドデシノール、ベンジルアルコール、２－フェニルエタノール、２－メトキシエタノール、２－クロロメタノール、フルフリルアルコール等の１級アルコール、イソプロパノール、２－ブタノール、シクロヘキシルアルコール、シクロペンタノール、１－メトキシ－２－プロパノール等の２級アルコール、ｔ－ブチルアルコール、アダマンタンアルコール等の３級アルコールが挙げられる。フェノール類の好ましい化合物としては、フェノール、メトキシフェノール、メチルフェノール、ナフタレン－１－オール、ナフタレン－２－オール、ヒドロキシスチレン等のフェノール類などが挙げられる。また、モノアミンの好ましい化合物としては、アニリン、２－エチニルアニリン、３－エチニルアニリン、４－エチニルアニリン、５－アミノ－８－ヒドロキシキノリン、１－ヒドロキシ－７－アミノナフタレン、１－ヒドロキシ－６－アミノナフタレン、１－ヒドロキシ－５－アミノナフタレン、１－ヒドロキシ－４－アミノナフタレン、２－ヒドロキシ－７－アミノナフタレン、２－ヒドロキシ－６－アミノナフタレン、２－ヒドロキシ－５－アミノナフタレン、１－カルボキシ－７－アミノナフタレン、１－カルボキシ－６－アミノナフタレン、１－カルボキシ－５－アミノナフタレン、２－カルボキシ－７－アミノナフタレン、２－カルボキシ－６－アミノナフタレン、２－カルボキシ－５－アミノナフタレン、２－アミノ安息香酸、３－アミノ安息香酸、４－アミノ安息香酸、４－アミノサリチル酸、５－アミノサリチル酸、６－アミノサリチル酸、２－アミノベンゼンスルホン酸、３－アミノベンゼンスルホン酸、４－アミノベンゼンスルホン酸、３－アミノ－４，６－ジヒドロキシピリミジン、２－アミノフェノール、３－アミノフェノール、４－アミノフェノール、２－アミノチオフェノール、３－アミノチオフェノール、４－アミノチオフェノールなどが挙げられる。これらを２種以上用いてもよく、複数の末端封止剤を反応させることにより、複数の異なる末端基を導入してもよい。
　また、樹脂末端のアミノ基を封止する際、アミノ基と反応可能な官能基を有する化合物で封止することが可能である。アミノ基に対する好ましい封止剤は、カルボン酸無水物、カルボン酸クロリド、カルボン酸ブロミド、スルホン酸クロリド、無水スルホン酸、スルホン酸カルボン酸無水物などが好ましく、カルボン酸無水物、カルボン酸クロリドがより好ましい。カルボン酸無水物の好ましい化合物としては、無水酢酸、無水プロピオン酸、無水シュウ酸、無水コハク酸、無水マレイン酸、無水フタル酸、無水安息香酸、５－ノルボルネン－２，３－ジカルボン酸無水物などが挙げられる。また、カルボン酸クロリドの好ましい化合物としては、塩化アセチル、アクリル酸クロリド、プロピオニルクロリド、メタクリル酸クロリド、ピバロイルクロリド、シクロヘキサンカルボニルクロリド、２－エチルヘキサノイルクロリド、シンナモイルクロリド、１－アダマンタンカルボニルクロリド、ヘプタフルオロブチリルクロリド、ステアリン酸クロリド、ベンゾイルクロリド、などが挙げられる。 -Terminal sealing agent-
In the method for producing the specific resin, in order to further improve the storage stability, it is preferable to seal the carboxylic acid anhydride, acid anhydride derivative, or amino group remaining at the terminal end of the specific resin. When sealing carboxylic acid anhydride and acid anhydride derivatives remaining at the end of the resin, examples of the terminal capping agent include monoalcohol, phenol, thiol, thiophenol, monoamine, etc. From the viewpoint of properties, it is more preferable to use monoalcohols, phenols, and monoamines. Preferred monoalcohol compounds include primary alcohols such as methanol, ethanol, propanol, butanol, hexanol, octanol, dodecinol, benzyl alcohol, 2-phenylethanol, 2-methoxyethanol, 2-chloromethanol, furfuryl alcohol, and isopropanol. , 2-butanol, cyclohexyl alcohol, cyclopentanol, secondary alcohols such as 1-methoxy-2-propanol, and tertiary alcohols such as t-butyl alcohol and adamantane alcohol. Preferred phenolic compounds include phenols such as phenol, methoxyphenol, methylphenol, naphthalen-1-ol, naphthalen-2-ol, and hydroxystyrene. Preferred monoamine compounds include aniline, 2-ethynylaniline, 3-ethynylaniline, 4-ethynylaniline, 5-amino-8-hydroxyquinoline, 1-hydroxy-7-aminonaphthalene, 1-hydroxy-6- Aminonaphthalene, 1-hydroxy-5-aminonaphthalene, 1-hydroxy-4-aminonaphthalene, 2-hydroxy-7-aminonaphthalene, 2-hydroxy-6-aminonaphthalene, 2-hydroxy-5-aminonaphthalene, 1- Carboxy-7-aminonaphthalene, 1-carboxy-6-aminonaphthalene, 1-carboxy-5-aminonaphthalene, 2-carboxy-7-aminonaphthalene, 2-carboxy-6-aminonaphthalene, 2-carboxy-5-amino Naphthalene, 2-aminobenzoic acid, 3-aminobenzoic acid, 4-aminobenzoic acid, 4-aminosalicylic acid, 5-aminosalicylic acid, 6-aminosalicylic acid, 2-aminobenzenesulfonic acid, 3-aminobenzenesulfonic acid, 4 -Aminobenzenesulfonic acid, 3-amino-4,6-dihydroxypyrimidine, 2-aminophenol, 3-aminophenol, 4-aminophenol, 2-aminothiophenol, 3-aminothiophenol, 4-aminothiophenol, etc. can be mentioned. Two or more types of these may be used, and a plurality of different terminal groups may be introduced by reacting a plurality of terminal capping agents.
Furthermore, when sealing the amino group at the end of the resin, it is possible to seal with a compound having a functional group that can react with the amino group. Preferred sealing agents for amino groups include carboxylic acid anhydrides, carboxylic acid chlorides, carboxylic acid bromides, sulfonic acid chlorides, sulfonic anhydrides, and sulfonic acid carboxylic acid anhydrides, with carboxylic acid anhydrides and carboxylic acid chlorides being more preferred. preferable. Preferred carboxylic anhydride compounds include acetic anhydride, propionic anhydride, oxalic anhydride, succinic anhydride, maleic anhydride, phthalic anhydride, benzoic anhydride, 5-norbornene-2,3-dicarboxylic anhydride, and the like. can be mentioned. Preferred carboxylic acid chloride compounds include acetyl chloride, acrylic acid chloride, propionyl chloride, methacrylic acid chloride, pivaloyl chloride, cyclohexane carbonyl chloride, 2-ethylhexanoyl chloride, cinnamoyl chloride, and 1-adamantane carbonyl chloride. , heptafluorobutyryl chloride, stearic acid chloride, benzoyl chloride, and the like.
－固体析出－
　特定樹脂の製造方法に際し、固体を析出する工程を含んでいてもよい。具体的には、反応液中に共存している脱水縮合剤の吸水副生物を必要に応じて濾別した後、水、脂肪族低級アルコール、又はその混合液等の貧溶媒に、得られた重合体成分を投入し、重合体成分を析出させることで、固体として析出させ、乾燥させることで特定樹脂を得ることができる。精製度を向上させるために、特定樹脂を再溶解、再沈析出、乾燥等の操作を繰返してもよい。さらに、イオン交換樹脂を用いてイオン性不純物を除去する工程を含んでいてもよい。 -Solid precipitation-
The method for producing the specific resin may include a step of precipitating a solid. Specifically, after removing the water-absorbed by-products of the dehydration condensation agent coexisting in the reaction solution by filtration as necessary, the obtained product is added to a poor solvent such as water, aliphatic lower alcohol, or a mixture thereof. By introducing a polymer component and precipitating the polymer component, the specific resin can be obtained by precipitating it as a solid and drying it. In order to improve the degree of purification, operations such as redissolution, reprecipitation, and drying of the specific resin may be repeated. Furthermore, the method may include a step of removing ionic impurities using an ion exchange resin.
〔含有量〕
　本発明の樹脂組成物における特定樹脂の含有量は、樹脂組成物の全固形分に対し２０質量％以上であることが好ましく、３０質量％以上であることがより好ましく、４０質量％以上であることが更に好ましく、５０質量％以上であることが一層好ましい。また、本発明の樹脂組成物における特定樹脂の含有量は、樹脂組成物の全固形分に対し、９９．５質量％以下であることが好ましく、９９質量％以下であることがより好ましく、９８質量％以下であることが更に好ましく、９７質量％以下であることが一層好ましく、９５質量％以下であることがより一層好ましい。
　本発明の樹脂組成物は、特定樹脂を１種のみ含んでいてもよいし、２種以上含んでいてもよい。２種以上含む場合、合計量が上記範囲となることが好ましい。 〔Content〕
The content of the specific resin in the resin composition of the present invention is preferably 20% by mass or more, more preferably 30% by mass or more, and 40% by mass or more based on the total solid content of the resin composition. It is even more preferable that the amount is 50% by mass or more. Further, the content of the specific resin in the resin composition of the present invention is preferably 99.5% by mass or less, more preferably 99% by mass or less, and 98% by mass or less based on the total solid content of the resin composition. It is more preferably at most 97% by mass, even more preferably at most 95% by mass.
The resin composition of the present invention may contain only one type of specific resin, or may contain two or more types of specific resin. When two or more types are included, it is preferable that the total amount falls within the above range.
　本発明の樹脂組成物は、少なくとも２種の樹脂を含んでもよい。
　具体的には、本発明の樹脂組成物は、特定樹脂と、後述する他の樹脂とを合計で２種以上含んでもよいし、特定樹脂を２種以上含んでいてもよいが、特定樹脂を２種以上含むことが好ましい。
　本発明の樹脂組成物が特定樹脂を２種以上含む場合、例えば、特定樹脂であって、二無水物由来の構造（上述の式（１）でいうＸ１）が異なる２種以上の特定樹脂を含むことが好ましい。 The resin composition of the present invention may contain at least two types of resin.
Specifically, the resin composition of the present invention may contain a total of two or more kinds of the specific resin and other resins described below, or may contain two or more kinds of the specific resin, but may contain the specific resin. It is preferable to include two or more types.
When the resin composition of the present invention contains two or more specific resins, for example, two or more specific resins having different dianhydride-derived structures (X 1 in the above formula (1)) It is preferable to include.
＜他の樹脂＞
　本発明の樹脂組成物は、上述した特定樹脂と、特定樹脂とは異なる他の樹脂（以下、単に「他の樹脂」ともいう）とを含んでもよい。
　他の樹脂としては、特定樹脂に該当しないポリイミド前駆体（例えば、式（１）で表される繰返し単位を含まず、かつ、式（２）で表される繰返し単位を含むポリイミド前駆体）、ポリベンゾオキサゾール前駆体、ポリアイミドイミド前駆体、ポリイミド、ポリベンゾオキサゾール、ポリアミドイミド、フェノール樹脂、ポリアミド、エポキシ樹脂、ポリシロキサン、シロキサン構造を含む樹脂、（メタ）アクリル樹脂、（メタ）アクリルアミド樹脂、ウレタン樹脂、ブチラール樹脂、スチリル樹脂、ポリエーテル樹脂、ポリエステル樹脂等が挙げられる。
　例えば、（メタ）アクリル樹脂を更に加えることにより、塗布性に優れた樹脂組成物が得られ、また、耐溶剤性に優れたパターン（硬化物）が得られる。
　例えば、後述する重合性化合物に代えて、又は、後述する重合性化合物に加えて、重量平均分子量が２０，０００以下の重合性基価の高い（例えば、樹脂１ｇにおける重合性基の含有モル量が１×１０－３モル／ｇ以上である）（メタ）アクリル樹脂を樹脂組成物に添加することにより、樹脂組成物の塗布性、パターン（硬化物）の耐溶剤性等を向上させることができる。 <Other resins>
The resin composition of the present invention may contain the above-mentioned specific resin and another resin different from the specific resin (hereinafter also simply referred to as "other resin").
Other resins include polyimide precursors that do not fall under the specific resin (for example, polyimide precursors that do not contain the repeating unit represented by formula (1) and contain the repeating unit represented by formula (2)), Polybenzoxazole precursor, polyimide imide precursor, polyimide, polybenzoxazole, polyamideimide, phenolic resin, polyamide, epoxy resin, polysiloxane, resin containing a siloxane structure, (meth)acrylic resin, (meth)acrylamide resin, Examples include urethane resin, butyral resin, styryl resin, polyether resin, and polyester resin.
For example, by further adding a (meth)acrylic resin, a resin composition with excellent coating properties can be obtained, and a pattern (cured product) with excellent solvent resistance can be obtained.
For example, instead of or in addition to the polymerizable compound described below, a polymerizable group having a high polymerizable group value with a weight average molecular weight of 20,000 or less (for example, the molar amount of polymerizable groups contained in 1 g of resin) may be used. By adding a (meth)acrylic resin (having a concentration of 1×10 -3 mol/g or more) to a resin composition, it is possible to improve the coating properties of the resin composition, the solvent resistance of the pattern (cured product), etc. can.
　本発明の樹脂組成物が他の樹脂を含む場合、他の樹脂の含有量は、樹脂組成物の全固形分に対し、０．０１質量％以上であることが好ましく、０．０５質量％以上であることがより好ましく、１質量％以上であることが更に好ましく、２質量％以上であることが一層好ましく、５質量％以上であることがより一層好ましく、１０質量％以上であることが更に一層好ましい。
　本発明の樹脂組成物における、他の樹脂の含有量は、樹脂組成物の全固形分に対し、８０質量％以下であることが好ましく、７５質量％以下であることがより好ましく、７０質量％以下であることが更に好ましく、６０質量％以下であることが一層好ましく、５０質量％以下であることがより一層好ましい。
　本発明の樹脂組成物の好ましい一態様として、他の樹脂の含有量が低含有量である態様とすることもできる。上記態様において、他の樹脂の含有量は、樹脂組成物の全固形分に対し、２０質量％以下であることが好ましく、１５質量％以下であることがより好ましく、１０質量％以下であることが更に好ましく、５質量％以下であることが一層好ましく、１質量％以下であることがより一層好ましい。上記含有量の下限は特に限定されず、０質量％以上であればよい。
　本発明の樹脂組成物は、他の樹脂を１種のみ含んでいてもよいし、２種以上含んでいてもよい。２種以上含む場合、合計量が上記範囲となることが好ましい。 When the resin composition of the present invention contains other resins, the content of the other resins is preferably 0.01% by mass or more, and 0.05% by mass or more based on the total solid content of the resin composition. It is more preferably 1% by mass or more, even more preferably 2% by mass or more, even more preferably 5% by mass or more, and even more preferably 10% by mass or more. More preferred.
The content of other resins in the resin composition of the present invention is preferably 80% by mass or less, more preferably 75% by mass or less, and 70% by mass based on the total solid content of the resin composition. It is more preferably at most 60% by mass, even more preferably at most 50% by mass.
As a preferable embodiment of the resin composition of the present invention, the content of other resins may be low. In the above embodiment, the content of the other resin is preferably 20% by mass or less, more preferably 15% by mass or less, and 10% by mass or less based on the total solid content of the resin composition. is more preferable, even more preferably 5% by mass or less, even more preferably 1% by mass or less. The lower limit of the content is not particularly limited, and may be 0% by mass or more.
The resin composition of the present invention may contain only one type of other resin, or may contain two or more types of other resins. When two or more types are included, it is preferable that the total amount falls within the above range.
＜ラジカル重合性化合物＞
　本発明の樹脂組成物は、ラジカル重合性化合物を含む。
　上述の特定樹脂又は他の樹脂に該当する化合物は、ラジカル重合性化合物には該当しないものとする。
　ラジカル重合性化合物は、ラジカル重合性基を有する化合物である。ラジカル重合性基としては、エチレン性不飽和結合を含む基が好ましい。上記エチレン性不飽和結合を含む基としては、ビニル基、アリル基、ビニルフェニル基、（メタ）アクリロキシ基、マレイミド基、（メタ）アクリルアミド基などが挙げられる。
　これらの中でも、（メタ）アクリロキシ基、（メタ）アクリルアミド基、ビニルフェニル基が好ましく、反応性の観点からは、（メタ）アクリロキシ基がより好ましい。 <Radical polymerizable compound>
The resin composition of the present invention contains a radically polymerizable compound.
Compounds that fall under the above-mentioned specific resins or other resins do not fall under the category of radically polymerizable compounds.
A radically polymerizable compound is a compound having a radically polymerizable group. As the radically polymerizable group, a group containing an ethylenically unsaturated bond is preferable. Examples of the group containing an ethylenically unsaturated bond include a vinyl group, an allyl group, a vinylphenyl group, a (meth)acryloxy group, a maleimide group, and a (meth)acrylamide group.
Among these, (meth)acryloxy group, (meth)acrylamide group, and vinylphenyl group are preferable, and from the viewpoint of reactivity, (meth)acryloxy group is more preferable.
　ラジカル重合性化合物は、エチレン性不飽和結合を１個以上有する化合物であることが好ましいが、２個以上有する化合物であることがより好ましい。ラジカル重合性化合物は、エチレン性不飽和結合を３個以上有していてもよい。
　上記エチレン性不飽和結合を２個以上有する化合物としては、エチレン性不飽和結合を２～１５個有する化合物が好ましく、エチレン性不飽和結合を２～１０個有する化合物がより好ましく、２～６個有する化合物が更に好ましい。
　得られるパターン（硬化物）の膜強度の観点からは、本発明の樹脂組成物は、エチレン性不飽和結合を２個有する化合物と、上記エチレン性不飽和結合を３個以上有する化合物とを含むことも好ましい。 The radically polymerizable compound is preferably a compound having one or more ethylenically unsaturated bonds, more preferably a compound having two or more ethylenically unsaturated bonds. The radically polymerizable compound may have three or more ethylenically unsaturated bonds.
The compound having two or more ethylenically unsaturated bonds is preferably a compound having 2 to 15 ethylenically unsaturated bonds, more preferably a compound having 2 to 10 ethylenically unsaturated bonds, and more preferably a compound having 2 to 6 ethylenically unsaturated bonds. More preferred are compounds having the following.
From the viewpoint of film strength of the obtained pattern (cured product), the resin composition of the present invention contains a compound having two ethylenically unsaturated bonds and a compound having three or more of the above ethylenically unsaturated bonds. It is also preferable.
　ラジカル重合性化合物の分子量は、２，０００以下が好ましく、１，５００以下がより好ましく、９００以下が更に好ましい。ラジカル重合性化合物の分子量の下限は、１００以上が好ましい。 The molecular weight of the radically polymerizable compound is preferably 2,000 or less, more preferably 1,500 or less, and even more preferably 900 or less. The lower limit of the molecular weight of the radically polymerizable compound is preferably 100 or more.
　ラジカル重合性化合物の具体例としては、不飽和カルボン酸（例えば、アクリル酸、メタクリル酸、イタコン酸、クロトン酸、イソクロトン酸、マレイン酸など）やそのエステル類、アミド類が挙げられ、好ましくは、不飽和カルボン酸と多価アルコール化合物とのエステル、及び不飽和カルボン酸と多価アミン化合物とのアミド類である。また、ヒドロキシ基やアミノ基、スルファニル基等の求核性置換基を有する不飽和カルボン酸エステル又はアミド類と、単官能若しくは多官能イソシアネート類又はエポキシ類との付加反応物や、単官能若しくは多官能のカルボン酸との脱水縮合反応物等も好適に使用される。また、イソシアネート基やエポキシ基等の親電子性置換基を有する不飽和カルボン酸エステル又はアミド類と、単官能若しくは多官能のアルコール類、アミン類、チオール類との付加反応物、更に、ハロゲノ基やトシルオキシ基等の脱離性置換基を有する不飽和カルボン酸エステル又はアミド類と、単官能若しくは多官能のアルコール類、アミン類、チオール類との置換反応物も好適である。また、別の例として、上記の不飽和カルボン酸の代わりに、不飽和ホスホン酸、スチレン等のビニルベンゼン誘導体、ビニルエーテル、アリルエーテル等に置き換えた化合物群を使用することも可能である。具体例としては、特開２０１６－０２７３５７号公報の段落０１１３～０１２２の記載を参酌でき、これらの内容は本明細書に組み込まれる。 Specific examples of radically polymerizable compounds include unsaturated carboxylic acids (for example, acrylic acid, methacrylic acid, itaconic acid, crotonic acid, isocrotonic acid, maleic acid, etc.), their esters, and amides, and preferably, These are esters of unsaturated carboxylic acids and polyhydric alcohol compounds, and amides of unsaturated carboxylic acids and polyhydric amine compounds. In addition, addition reaction products of unsaturated carboxylic acid esters or amides having nucleophilic substituents such as hydroxy groups, amino groups, and sulfanyl groups with monofunctional or polyfunctional isocyanates or epoxies, and monofunctional or polyfunctional A dehydration condensation reaction product with a functional carboxylic acid is also preferably used. In addition, addition reaction products of unsaturated carboxylic acid esters or amides having electrophilic substituents such as isocyanate groups and epoxy groups with monofunctional or polyfunctional alcohols, amines, and thiols, and furthermore, halogen groups Substitution reaction products of unsaturated carboxylic acid esters or amides having a leaving substituent such as or tosyloxy group and monofunctional or polyfunctional alcohols, amines, and thiols are also suitable. Further, as another example, it is also possible to use a group of compounds in which the unsaturated carboxylic acid mentioned above is replaced with an unsaturated phosphonic acid, a vinylbenzene derivative such as styrene, vinyl ether, allyl ether, or the like. As a specific example, the descriptions in paragraphs 0113 to 0122 of JP-A No. 2016-027357 can be referred to, and the contents thereof are incorporated into the present specification.
　ラジカル重合性化合物は、常圧下で１００℃以上の沸点を持つ化合物も好ましい。常圧下で１００℃以上の沸点を持つ化合物としては、国際公開第２０２１／１１２１８９号公報の段落０２０３に記載の化合物等が挙げられる。この内容は本明細書に組み込まれる。 The radically polymerizable compound is also preferably a compound having a boiling point of 100°C or higher under normal pressure. Examples of the compound having a boiling point of 100° C. or higher under normal pressure include the compounds described in paragraph 0203 of International Publication No. 2021/112189. This content is incorporated herein.
　上述以外の好ましいラジカル重合性化合物としては、国際公開第２０２１／１１２１８９号公報の段落０２０４～０２０８に記載のラジカル重合性化合物等が挙げられる。この内容は本明細書に組み込まれる。 Preferred radically polymerizable compounds other than those mentioned above include the radically polymerizable compounds described in paragraphs 0204 to 0208 of International Publication No. 2021/112189. This content is incorporated herein.
　ラジカル重合性化合物としては、ジペンタエリスリトールトリアクリレート（市販品としては　ＫＡＹＡＲＡＤ　Ｄ－３３０（日本化薬（株）製））、ジペンタエリスリトールテトラアクリレート（市販品としては　ＫＡＹＡＲＡＤ　Ｄ－３２０（日本化薬（株）製）、Ａ－ＴＭＭＴ（新中村化学工業（株）製））、ジペンタエリスリトールペンタ（メタ）アクリレート（市販品としては　ＫＡＹＡＲＡＤ　Ｄ－３１０（日本化薬（株）製））、ジペンタエリスリトールヘキサ（メタ）アクリレート（市販品としては　ＫＡＹＡＲＡＤ　ＤＰＨＡ（日本化薬（株）製）、Ａ－ＤＰＨ（新中村化学工業社製））、及びこれらの（メタ）アクリロイル基がエチレングリコール残基又はプロピレングリコール残基を介して結合している構造が好ましい。これらのオリゴマータイプも使用できる。 Examples of radically polymerizable compounds include dipentaerythritol triacrylate (commercially available product: KAYARAD D-330 (manufactured by Nippon Kayaku Co., Ltd.)), dipentaerythritol tetraacrylate (commercially available product: KAYARAD D-320 (Nippon Kayaku Co., Ltd.) Co., Ltd.), A-TMMT (Shin Nakamura Chemical Co., Ltd.)), dipentaerythritol penta(meth)acrylate (commercially available products include KAYARAD D-310 (Nippon Kayaku Co., Ltd.)), Pentaerythritol hexa(meth)acrylate (commercially available products are KAYARAD DPHA (manufactured by Nippon Kayaku Co., Ltd.) and A-DPH (manufactured by Shin Nakamura Chemical Industry Co., Ltd.)), and their (meth)acryloyl groups are ethylene glycol residues. Or, a structure in which they are bonded via a propylene glycol residue is preferred. These oligomeric types can also be used.
　ラジカル重合性化合物の市販品としては、例えばエチレンオキシ鎖を４個有する４官能アクリレートであるＳＲ－４９４、エチレンオキシ鎖を４個有する２官能メタクリレートであるＳＲ－２０９、２３１、２３９（以上、サートマー社製）、ペンチレンオキシ鎖を６個有する６官能アクリレートであるＤＰＣＡ－６０、イソブチレンオキシ鎖を３個有する３官能アクリレートであるＴＰＡ－３３０（以上、日本化薬（株）製）、ウレタンオリゴマーであるＵＡＳ－１０、ＵＡＢ－１４０（以上、日本製紙社製）、ＮＫエステルＭ－４０Ｇ、ＮＫエステル４Ｇ、ＮＫエステルＭ－９３００、ＮＫエステルＡ－９３００、ＵＡ－７２００（以上、新中村化学工業社製）、ＤＰＨＡ－４０Ｈ（日本化薬（株）製）、ＵＡ－３０６Ｈ、ＵＡ－３０６Ｔ、ＵＡ－３０６Ｉ、ＡＨ－６００、Ｔ－６００、ＡＩ－６００（以上、共栄社化学社製）、ブレンマーＰＭＥ４００（日油（株）製）などが挙げられる。 Commercially available radical polymerizable compounds include, for example, SR-494, which is a tetrafunctional acrylate having four ethyleneoxy chains, and SR-209, 231, and 239, which are difunctional methacrylates having four ethyleneoxy chains (Sartomer (manufactured by Nippon Kayaku Co., Ltd.), DPCA-60, a hexafunctional acrylate with six pentyleneoxy chains, TPA-330, a trifunctional acrylate with three isobutyleneoxy chains (manufactured by Nippon Kayaku Co., Ltd.), urethane oligomer UAS-10, UAB-140 (all manufactured by Nippon Paper Industries), NK Ester M-40G, NK Ester 4G, NK Ester M-9300, NK Ester A-9300, UA-7200 (all manufactured by Shin-Nakamura Chemical Industries) ), DPHA-40H (manufactured by Nippon Kayaku Co., Ltd.), UA-306H, UA-306T, UA-306I, AH-600, T-600, AI-600 (manufactured by Kyoeisha Chemical Co., Ltd.), Blenmar Examples include PME400 (manufactured by NOF Corporation).
　ラジカル重合性化合物としては、特公昭４８－０４１７０８号公報、特開昭５１－０３７１９３号公報、特公平０２－０３２２９３号公報、特公平０２－０１６７６５号公報に記載されているようなウレタンアクリレート類や、特公昭５８－０４９８６０号公報、特公昭５６－０１７６５４号公報、特公昭６２－０３９４１７号公報、特公昭６２－０３９４１８号公報に記載のエチレンオキサイド系骨格を有するウレタン化合物類も好適である。ラジカル重合性化合物として、特開昭６３－２７７６５３号公報、特開昭６３－２６０９０９号公報、特開平０１－１０５２３８号公報に記載される、分子内にアミノ構造やスルフィド構造を有する化合物を用いることもできる。 Examples of radically polymerizable compounds include urethane acrylates such as those described in Japanese Patent Publication No. 48-041708, Japanese Patent Application Laid-open No. 51-037193, Japanese Patent Publication No. 02-032293, and Japanese Patent Publication No. 02-016765. , JP-B No. 58-049860, JP-B No. 56-017654, JP-B No. 62-039417, and JP-B No. 62-039418 are also suitable. As the radically polymerizable compound, use a compound having an amino structure or a sulfide structure in the molecule, which is described in JP-A-63-277653, JP-A-63-260909, and JP-A-01-105238. You can also do it.
　ラジカル重合性化合物は、カルボキシ基、リン酸基等の酸基を有するラジカル重合性化合物であってもよい。酸基を有するラジカル重合性化合物は、脂肪族ポリヒドロキシ化合物と不飽和カルボン酸とのエステルが好ましく、脂肪族ポリヒドロキシ化合物の未反応のヒドロキシ基に非芳香族カルボン酸無水物を反応させて酸基を持たせたラジカル重合性化合物がより好ましい。特に好ましくは、脂肪族ポリヒドロキシ化合物の未反応のヒドロキシ基に非芳香族カルボン酸無水物を反応させて酸基を持たせたラジカル重合性化合物において、脂肪族ポリヒドロキシ化合物がペンタエリスリトール又はジペンタエリスリトールである化合物である。市販品としては、例えば、東亞合成（株）製の多塩基酸変性アクリルオリゴマーとして、Ｍ－５１０、Ｍ－５２０などが挙げられる。 The radically polymerizable compound may be a radically polymerizable compound having an acid group such as a carboxy group or a phosphoric acid group. The radically polymerizable compound having an acid group is preferably an ester of an aliphatic polyhydroxy compound and an unsaturated carboxylic acid. A radically polymerizable compound having a group is more preferable. Particularly preferably, in a radical polymerizable compound in which an unreacted hydroxy group of an aliphatic polyhydroxy compound is reacted with a non-aromatic carboxylic acid anhydride to have an acid group, the aliphatic polyhydroxy compound is pentaerythritol or dipenta The compound is erythritol. Commercially available products include, for example, polybasic acid-modified acrylic oligomers manufactured by Toagosei Co., Ltd., such as M-510 and M-520.
　酸基を有するラジカル重合性化合物の酸価は、０．１～３００ｍｇＫＯＨ／ｇが好ましく、１～１００ｍｇＫＯＨ／ｇがより好ましい。ラジカル重合性化合物の酸価が上記範囲であれば、製造上の取扱性に優れ、現像性に優れる。また、重合性が良好である。上記酸価は、ＪＩＳ　Ｋ　００７０：１９９２の記載に準拠して測定される。 The acid value of the radically polymerizable compound having an acid group is preferably 0.1 to 300 mgKOH/g, more preferably 1 to 100 mgKOH/g. When the acid value of the radically polymerizable compound is within the above range, it has excellent handling properties during production and excellent developability. Moreover, it has good polymerizability. The above acid value is measured in accordance with the description of JIS K 0070:1992.
　ラジカル重合性化合物としては、ウレア結合、ウレタン結合及びアミド結合からなる群より選ばれた少なくとも１種の構造を有するラジカル重合性化合物（以下、「架橋剤Ｕ」ともいう。）も好ましい。
　本発明において、ウレア結合とは、＊－ＮＲＮ－Ｃ（＝Ｏ）－ＮＲＮ－＊で表される結合であり、ＲＮはそれぞれ独立に、水素原子又は１価の有機基を表し、＊はそれぞれ、炭素原子との結合部位を表し、炭化水素基との結合部位であることが好ましい。
　本発明において、ウレタン結合とは＊－Ｏ－Ｃ（＝Ｏ）－ＮＲＮ－＊で表される結合であり、ＲＮは水素原子又は１価の有機基を表し、＊はそれぞれ、炭素原子との結合部位を表し、炭化水素基との結合部位であることが好ましい。
　本発明において、アミド結合とは＊－Ｃ（＝Ｏ）－ＮＲＮ－＊で表される結合であり、ＲＮは水素原子又は１価の有機基を表し、＊はそれぞれ、炭素原子との結合部位を表し、炭化水素基との結合部位であることが好ましい。
　また、樹脂組成物が架橋剤Ｕを含むことにより、耐薬品性、解像性等が向上する場合が有る。
　上記効果が得られるメカニズムは不明だが、例えば、加熱等による硬化時に架橋剤Ｕの一部が熱分解することにより、アミンなどが発生し、上記アミン等がポリイミド前駆体の環化を促進すると考えられる。
　架橋剤Ｕはウレア結合、ウレタン結合又はアミド結合を１つのみ有してもよいし、ウレア結合、ウレタン結合及びアミド結合からなる群より選ばれた１種以上の構造を２以上有してもよい。
　架橋剤Ｕにおけるウレア結合、ウレタン結合及びアミド結合の合計数は、１以上であり、１～１０であることが好ましく、１～４であることがより好ましく、１又は２であることが更に好ましい。
　架橋剤Ｕは、ウレア結合及びウレタン結合からなる群より選ばれた少なくとも１種の構造を有することが好ましい。 As the radically polymerizable compound, a radically polymerizable compound having at least one type of structure selected from the group consisting of a urea bond, a urethane bond, and an amide bond (hereinafter also referred to as "crosslinking agent U") is also preferable.
In the present invention, a urea bond is a bond represented by *-NR N -C(=O)-NR N -*, where each R N independently represents a hydrogen atom or a monovalent organic group, Each * represents a bonding site with a carbon atom, and is preferably a bonding site with a hydrocarbon group.
In the present invention, a urethane bond is a bond represented by *-OC(=O)-NR N -*, where R N represents a hydrogen atom or a monovalent organic group, and * each represents a carbon atom. represents a bonding site with a hydrocarbon group, and preferably a bonding site with a hydrocarbon group.
In the present invention, an amide bond is a bond represented by *-C(=O)-NR N -*, where R N represents a hydrogen atom or a monovalent organic group, and each * represents a bond with a carbon atom. It represents a bonding site, and is preferably a bonding site with a hydrocarbon group.
Further, when the resin composition contains the crosslinking agent U, chemical resistance, resolution, etc. may be improved.
The mechanism by which the above effect is obtained is unknown, but it is thought that, for example, amines are generated by thermal decomposition of a part of the crosslinking agent U during curing by heating, etc., and the above amines promote the cyclization of the polyimide precursor. It will be done.
The crosslinking agent U may have only one urea bond, urethane bond, or amide bond, or may have two or more structures of one or more types selected from the group consisting of urea bond, urethane bond, and amide bond. good.
The total number of urea bonds, urethane bonds, and amide bonds in crosslinking agent U is 1 or more, preferably 1 to 10, more preferably 1 to 4, and even more preferably 1 or 2. .
It is preferable that the crosslinking agent U has at least one type of structure selected from the group consisting of urea bonds and urethane bonds.
　架橋剤Ｕにおけるラジカル重合性基は、特に限定されないが、ビニル基、アリル基、（メタ）アクリロイル基、（メタ）アクリロキシ基、（メタ）アクリルアミド基、ビニルフェニル基、マレイミド基等が挙げられ、（メタ）アクリロキシ基、（メタ）アクリルアミド基、ビニルフェニル基、又は、マレイミド基が好ましく、（メタ）アクリロキシ基がより好ましい。
　架橋剤Ｕがラジカル重合性基を２以上有する場合、それぞれのラジカル重合性基の構造は同一であってもよいし、異なっていてもよい。
　架橋剤Ｕにおけるラジカル重合性基の数は、１つのみであってもよいし、２以上であってもよく、１～１０が好ましく、１～６が更に好ましく、１～４が特に好ましい。
　架橋剤Ｕにおけるラジカル重合性基価（ラジカル重合性基１モル当たりの化合物の質量）は、１５０～４００ｇ／ｍｏｌであることが好ましい。
　上記ラジカル重合性基価の下限は、硬化物の耐薬品性の観点より、２００ｇ／ｍｏｌ以上であることがより好ましく、２１０ｇ／ｍｏｌ以上であることが更に好ましく、２２０ｇ／ｍｏｌ以上であることが一層好ましく、２３０ｇ／ｍｏｌ以上であることがより一層好ましく、２４０ｇ／ｍｏｌ以上であることがより更に好ましく、２５０ｇ／ｍｏｌ以上であることが特に好ましい。
　上記ラジカル重合性基価の上限は、現像性の観点より、３５０ｇ／ｍｏｌ以下であることがより好ましく、３３０ｇ／ｍｏｌ以下であることが更に好ましく、３００ｇ／ｍｏｌ以下であることが特に好ましい。
　中でも、架橋剤Ｕの重合性基価は、２１０～４００ｇ／ｍｏｌであることが好ましく、２２０～４００ｇ／ｍｏｌであることがより好ましい。 The radical polymerizable group in the crosslinking agent U is not particularly limited, but examples include a vinyl group, an allyl group, a (meth)acryloyl group, a (meth)acryloxy group, a (meth)acrylamide group, a vinylphenyl group, a maleimide group, and the like. A (meth)acryloxy group, a (meth)acrylamide group, a vinylphenyl group, or a maleimide group is preferred, and a (meth)acryloxy group is more preferred.
When the crosslinking agent U has two or more radically polymerizable groups, the structures of each radically polymerizable group may be the same or different.
The number of radically polymerizable groups in the crosslinking agent U may be only one or two or more, preferably 1 to 10, more preferably 1 to 6, particularly preferably 1 to 4.
The radically polymerizable group value (mass of compound per mole of radically polymerizable group) in crosslinking agent U is preferably 150 to 400 g/mol.
From the viewpoint of chemical resistance of the cured product, the lower limit of the radically polymerizable group value is more preferably 200 g/mol or more, still more preferably 210 g/mol or more, and preferably 220 g/mol or more. More preferably, it is 230 g/mol or more, even more preferably 240 g/mol or more, and particularly preferably 250 g/mol or more.
From the viewpoint of developability, the upper limit of the radically polymerizable group value is more preferably 350 g/mol or less, still more preferably 330 g/mol or less, and particularly preferably 300 g/mol or less.
Among these, the polymerizable group value of crosslinking agent U is preferably 210 to 400 g/mol, more preferably 220 to 400 g/mol.
　架橋剤Ｕは、例えば下記式（Ｕ－１）で表される構造であることが好ましい。
Figure JPOXMLDOC01-appb-C000029
　式（Ｕ－１）中、ＲＵ１は水素原子又は１価の有機基であり、Ａは単結合、－Ｏ－又は－ＮＲＮ－であり、ＲＮは水素原子又は１価の有機基であり、ＺＵ１はｍ価の有機基であり、ＺＵ２は単結合又はｎ＋１価の有機基であり、Ｘはラジカル重合性基であり、ｎは１以上の整数であり、ｍは１以上の整数である。 The crosslinking agent U preferably has a structure represented by the following formula (U-1), for example.
Figure JPOXMLDOC01-appb-C000029
In formula (U-1), R U1 is a hydrogen atom or a monovalent organic group, A is a single bond, -O- or -NR N -, and R N is a hydrogen atom or a monovalent organic group. , Z U1 is an m-valent organic group, Z U2 is a single bond or an n+1-valent organic group, X is a radically polymerizable group, n is an integer of 1 or more, and m is an integer of 1 or more. is an integer.
　Ａは単結合、－Ｏ－又は－ＮＲＮ－であり、－Ｏ－又は－ＮＲＮ－であることが好ましい。ＲＮの好ましい態様は上述の通りである。
　ＲＵ１は水素原子、アルキル基又は芳香族炭化水素基が好ましく、水素原子がより好ましい。
　ＲＮは水素原子、アルキル基又は芳香族炭化水素基が好ましく、水素原子がより好ましい。
　ＺＵ１は炭化水素基、－Ｏ－、－Ｃ（＝Ｏ）－、－Ｓ－、－Ｓ（＝Ｏ）２－、－ＮＲＮ－、若しくは、これらが２以上結合した基が好ましく、炭化水素基、又は、炭化水素基と、－Ｏ－、－Ｃ（＝Ｏ）－、－Ｓ－、－Ｓ（＝Ｏ）２－、及び、－ＮＲＮ－からなる群より選ばれた少なくとも１種の基とが結合した基がより好ましい。
　また、ＺＵ１におけるＡとの結合部位は炭化水素基であることが好ましい。
　上記炭化水素基としては、炭素数２０以下の炭化水素基が好ましく、１８以下の炭化水素基がより好ましく、１６以下の炭化水素基が更に好ましい。上記炭化水素基としては、飽和脂肪族炭化水素基、芳香族炭化水素基、又は、これらの結合により表される基などが挙げられる。ＲＮは水素原子又は１価の有機基を表し、水素原子又は炭化水素基であることが好ましく、水素原子又はアルキル基であることがより好ましく、水素原子又はメチル基であることが更に好ましい。
　ＺＵ２は炭化水素基、－Ｏ－、－Ｃ（＝Ｏ）－、－Ｓ－、－Ｓ（＝Ｏ）２－、－ＮＲＮ－、若しくは、これらが２以上結合した基が好ましく、炭化水素基、又は、炭化水素基と、－Ｏ－、－Ｃ（＝Ｏ）－、－Ｓ－、－Ｓ（＝Ｏ）２－、及び、－ＮＲＮ－からなる群より選ばれた少なくとも１種の基とが結合した基がより好ましい。
　上記炭化水素基としては、ＺＵ１において挙げられたものと同様のものが挙げられ、好ましい態様も同様である。
　Ｘは特に限定されないが、ビニル基、アリル基、（メタ）アクリロイル基、（メタ）アクリロキシ基、（メタ）アクリルアミド基、ビニルフェニル基、マレイミド基等が挙げられ、（メタ）アクリロキシ基、（メタ）アクリルアミド基、ビニルフェニル基、又は、マレイミド基が好ましく、（メタ）アクリロキシ基がより好ましい。
　ｎは１～１０の整数であることが好ましく、１～４の整数であることがより好ましく、１又は２であることが更に好ましく、１であることが特に好ましい。
　ｍは１～１０の整数であることが好ましく、１～４の整数であることがより好ましく、１又は２であることが更に好ましい。 A is a single bond, -O- or -NR N -, preferably -O- or -NR N -. Preferred embodiments of R N are as described above.
R U1 is preferably a hydrogen atom, an alkyl group, or an aromatic hydrocarbon group, and more preferably a hydrogen atom.
R N is preferably a hydrogen atom, an alkyl group, or an aromatic hydrocarbon group, and more preferably a hydrogen atom.
Z U1 is preferably a hydrocarbon group, -O-, -C(=O)-, -S-, -S(=O) 2 -, -NR N -, or a group in which two or more of these are bonded; a hydrogen group or a hydrocarbon group, and at least one selected from the group consisting of -O-, -C(=O)-, -S-, -S(=O) 2 -, and -NR N - A group to which a species group is bonded is more preferable.
Moreover, it is preferable that the bonding site with A in Z U1 is a hydrocarbon group.
The hydrocarbon group is preferably a hydrocarbon group having 20 or less carbon atoms, more preferably a hydrocarbon group having 18 or less carbon atoms, and still more preferably a hydrocarbon group having 16 or less carbon atoms. Examples of the hydrocarbon group include a saturated aliphatic hydrocarbon group, an aromatic hydrocarbon group, and a group represented by a bond thereof. R N represents a hydrogen atom or a monovalent organic group, preferably a hydrogen atom or a hydrocarbon group, more preferably a hydrogen atom or an alkyl group, and even more preferably a hydrogen atom or a methyl group.
Z U2 is preferably a hydrocarbon group, -O-, -C(=O)-, -S-, -S(=O) 2 -, -NR N -, or a group in which two or more of these are bonded; a hydrogen group or a hydrocarbon group, and at least one selected from the group consisting of -O-, -C(=O)-, -S-, -S(=O) 2 -, and -NR N - A group to which a species group is bonded is more preferable.
Examples of the hydrocarbon group include those listed in Z U1 , and preferred embodiments are also the same.
X is not particularly limited, but examples include vinyl group, allyl group, (meth)acryloyl group, (meth)acryloxy group, (meth)acrylamide group, vinylphenyl group, maleimide group, etc. ) An acrylamide group, a vinylphenyl group, or a maleimide group is preferable, and a (meth)acryloxy group is more preferable.
n is preferably an integer of 1 to 10, more preferably an integer of 1 to 4, even more preferably 1 or 2, and particularly preferably 1.
m is preferably an integer of 1 to 10, more preferably an integer of 1 to 4, and even more preferably 1 or 2.
　架橋剤Ｕは、ヒドロキシ基、アルキレンオキシ基、シアノ基の少なくとも１つを有することも好ましい。
　得られる硬化膜の耐薬品性の観点から、ヒドロキシ基は、アルコール性ヒドロキシ基であってもフェノール性ヒドロキシ基であってもよいが、アルコール性ヒドロキシ基であることが好ましい。
　得られる硬化膜の耐薬品性の観点から、アルキレンオキシ基としては、炭素数２～２０のアルキレンオキシ基が好ましく、炭素数２～１０のアルキレンオキシ基がより好ましく、炭素数２～４のアルキレンオキシ基が更に好ましく、エチレン基又はプロピレン基が更により好ましく、エチレン基が特に好ましい。
　アルキレンオキシ基は、ポリアルキレンオキシ基として架橋剤Ｕに含まれてもよい。この場合のアルキレンオキシ基の繰返し数は、２～１０であることが好ましく、２～６であることがより好ましい。
　架橋剤Ｕは、ヒドロキシ基、アルキレンオキシ基（ただし、ポリアルキレンオキシ基を構成する場合は、ポリアルキレンオキシ基）、及びシアノ基からなる群より選ばれた構造を、分子内に２以上有してもよいが、分子内に１つのみ有する態様も好ましい。
　上記ヒドロキシ基、アルキレンオキシ基及びシアノ基は架橋剤Ｕのいずれの位置に存在してもよいが、耐薬品性の観点からは、架橋剤Ｕは、上記ヒドロキシ基、アルキレンオキシ基、シアノ基からなる群より選ばれた少なくとも１つと、架橋剤Ｕに含まれる少なくとも１つのラジカル重合性基とが、ウレア結合、ウレタン結合又はアミド結合を含む連結基（以下、「連結基Ｌ２－１」ともいう。）により連結されていることも好ましい。
　特に、架橋剤Ｕがラジカル重合性基を１つのみ含む場合、架橋剤Ｕに含まれるラジカル重合性基と、ヒドロキシ基、アルキレンオキシ基及びシアノ基からなる群より選ばれた少なくとも１つとが、ウレア結合、ウレタン結合又はアミド結合を含む連結基（以下、「連結基Ｌ２－２」ともいう。）により連結されていることが好ましい。
　架橋剤Ｕがアルキレンオキシ基（ただし、ポリアルキレンオキシ基を構成する場合は、ポリアルキレンオキシ基）を含み、かつ、上記連結基Ｌ２－１又は上記連結基Ｌ２－２を有する場合、アルキレンオキシ基（ただし、ポリアルキレンオキシ基を構成する場合は、ポリアルキレンオキシ基）の連結基Ｌ２－１又は連結基Ｌ２－２とは反対の側に結合する構造は、特に限定されないが、炭化水素基、ラジカル重合性基又はこれらの組み合わせにより表される基が好ましい。上記炭化水素基としては、炭素数２０以下の炭化水素基が好ましく、１８以下の炭化水素基がより好ましく、１６以下の炭化水素基が更に好ましい。上記炭化水素基としては、飽和脂肪族炭化水素基、芳香族炭化水素基、又は、これらの結合により表される基などが挙げられる。また、ラジカル重合性基の好ましい態様は上述の架橋剤Ｕにおけるラジカル重合性基の好ましい態様と同様である。
　これらの中でも、基材との密着性、耐薬品性、及び、Ｃｕボイド抑制の観点からは、架橋剤Ｕはヒドロキシ基を有することが好ましい。 It is also preferable that the crosslinking agent U has at least one of a hydroxy group, an alkyleneoxy group, and a cyano group.
From the viewpoint of chemical resistance of the resulting cured film, the hydroxy group may be an alcoholic hydroxy group or a phenolic hydroxy group, but is preferably an alcoholic hydroxy group.
From the viewpoint of chemical resistance of the resulting cured film, the alkyleneoxy group is preferably an alkyleneoxy group having 2 to 20 carbon atoms, more preferably an alkyleneoxy group having 2 to 10 carbon atoms, and an alkyleneoxy group having 2 to 4 carbon atoms. An oxy group is more preferred, an ethylene group or a propylene group is even more preferred, and an ethylene group is particularly preferred.
The alkyleneoxy group may be included in the crosslinking agent U as a polyalkyleneoxy group. In this case, the number of repeating alkyleneoxy groups is preferably 2 to 10, more preferably 2 to 6.
The crosslinking agent U has two or more structures selected from the group consisting of a hydroxy group, an alkyleneoxy group (a polyalkyleneoxy group when forming a polyalkyleneoxy group), and a cyano group in the molecule. However, it is also preferable to have only one in the molecule.
The above-mentioned hydroxy group, alkyleneoxy group, and cyano group may be present in any position of the crosslinking agent U, but from the viewpoint of chemical resistance, the crosslinking agent U should be and at least one radically polymerizable group contained in the crosslinking agent U are a linking group containing a urea bond, a urethane bond, or an amide bond (hereinafter also referred to as "linking group L2-1"). ) is also preferable.
In particular, when the crosslinking agent U contains only one radically polymerizable group, the radically polymerizable group contained in the crosslinking agent U and at least one selected from the group consisting of a hydroxy group, an alkyleneoxy group, and a cyano group, It is preferable that they be connected by a linking group containing a urea bond, a urethane bond, or an amide bond (hereinafter also referred to as "linking group L2-2").
When the crosslinking agent U contains an alkyleneoxy group (however, when constituting a polyalkyleneoxy group, a polyalkyleneoxy group) and has the above linking group L2-1 or the above linking group L2-2, an alkyleneoxy group (However, when constituting a polyalkyleneoxy group, the structure bonded to the side opposite to the connecting group L2-1 or the connecting group L2-2 is not particularly limited, but may be a hydrocarbon group, A group represented by a radically polymerizable group or a combination thereof is preferred. The hydrocarbon group is preferably a hydrocarbon group having 20 or less carbon atoms, more preferably a hydrocarbon group having 18 or less carbon atoms, and still more preferably a hydrocarbon group having 16 or less carbon atoms. Examples of the hydrocarbon group include a saturated aliphatic hydrocarbon group, an aromatic hydrocarbon group, and a group represented by a bond thereof. Further, preferred embodiments of the radically polymerizable group are the same as those of the radically polymerizable group in the above-mentioned crosslinking agent U.
Among these, from the viewpoint of adhesion to the base material, chemical resistance, and suppression of Cu voids, it is preferable that the crosslinking agent U has a hydroxyl group.
　架橋剤Ｕは、特定樹脂との相溶性等の観点より、芳香族基を含むことが好ましい。
　上記芳香族基は、架橋剤Ｕに含まれるウレア結合、ウレタン結合又はアミド結合と直接結合することが好ましい。架橋剤Ｕがウレア結合、ウレタン結合又はアミド結合を２以上含む場合、ウレア結合、ウレタン結合又はアミド結合のうち１つと、芳香族基とが直接結合することが好ましい。
　芳香族基は、芳香族炭化水素基であっても、芳香族ヘテロ環基であってもよく、これらが縮合環を形成した構造でもよいが、芳香族炭化水素基であることが好ましい。
　上記芳香族炭化水素基としては、炭素数６～３０の芳香族炭化水素基が好ましく、炭素数６～２０の芳香族炭化水素基がより好ましく、ベンゼン環構造から２以上の水素原子を除いた基が更に好ましい。
　上記芳香族ヘテロ環基としては、５員環又は６員環の芳香族ヘテロ環基が好ましい。このような芳香族ヘテロ環基における芳香族ヘテロ環としては、ピロール、イミダゾール、トリアゾール、テトラゾール、ピラゾール、フラン、チオフェン、オキサゾール、イソオキサゾール、チアゾール、ピリジン、ピラジン、ピリミジン、ピリダジン、トリアジン等が挙げられる。これらの環は、例えば、インドール、ベンゾイミダゾールのように更に他の環と縮合していてもよい。
　上記芳香族ヘテロ環基に含まれるヘテロ原子としては、窒素原子、酸素原子又は硫黄原子が好ましい。
　上記芳香族基は、例えば、２以上のラジカル重合性基を連結し、ウレア結合、ウレタン結合又はアミド結合を含む連結基、又は、上述のヒドロキシ基、アルキレンオキシ基及びシアノ基からなる群より選ばれた少なくとも１つと、架橋剤Ｕに含まれる少なくとも１つのラジカル重合性基とを連結する連結基に含まれることが好ましい。 The crosslinking agent U preferably contains an aromatic group from the viewpoint of compatibility with the specific resin.
It is preferable that the aromatic group is directly bonded to a urea bond, urethane bond, or amide bond contained in the crosslinking agent U. When the crosslinking agent U contains two or more urea bonds, urethane bonds, or amide bonds, it is preferable that one of the urea bonds, urethane bonds, or amide bonds is directly bonded to the aromatic group.
The aromatic group may be an aromatic hydrocarbon group, an aromatic heterocyclic group, or a structure in which these groups form a condensed ring, but it is preferably an aromatic hydrocarbon group.
The aromatic hydrocarbon group mentioned above is preferably an aromatic hydrocarbon group having 6 to 30 carbon atoms, more preferably an aromatic hydrocarbon group having 6 to 20 carbon atoms, and has two or more hydrogen atoms removed from the benzene ring structure. More preferred are groups.
The aromatic heterocyclic group is preferably a 5-membered or 6-membered aromatic heterocyclic group. Examples of the aromatic heterocycle in such an aromatic heterocyclic group include pyrrole, imidazole, triazole, tetrazole, pyrazole, furan, thiophene, oxazole, isoxazole, thiazole, pyridine, pyrazine, pyrimidine, pyridazine, triazine, etc. . These rings may be further fused with other rings such as indole and benzimidazole.
The heteroatom contained in the aromatic heterocyclic group is preferably a nitrogen atom, an oxygen atom or a sulfur atom.
The aromatic group is, for example, a linking group that connects two or more radically polymerizable groups and includes a urea bond, a urethane bond, or an amide bond, or a linking group selected from the group consisting of the above-mentioned hydroxy group, alkyleneoxy group, and cyano group. and at least one radically polymerizable group contained in the crosslinking agent U.
　架橋剤Ｕにおけるウレア結合、ウレタン結合又はアミド結合とラジカル重合性基との間の原子数（連結鎖長）は、特に限定されないが、３０以下であることが好ましく、２～２０であることがより好ましく、２～１０であることが更に好ましい。
　架橋剤Ｕがウレア結合、ウレタン結合又はアミド結合を合計で２以上含む場合、ラジカル重合性基を２以上含む場合、又は、ウレア結合、ウレタン結合若しくはアミド結合を２以上含み、かつ、ラジカル重合性基を２以上含む場合、ウレア結合、ウレタン結合又はアミド結合とラジカル重合性基の間の原子数（連結鎖長）のうち、最小のものが上記範囲内であればよい。
　本明細書において、「ウレア結合、ウレタン結合又はアミド結合と重合性基との間の原子数（連結鎖長）」とは、連結対象の２つの原子または原子群の間を結ぶ経路上の原子鎖のうち、これらの連結対象を最短（最小原子数）で結ぶものをいう。例えば、下記式で表される構造において、ウレア結合とラジカル重合性基（メタクリロイルオキシ基）との間の原子数（連結鎖長）は２である。
Figure JPOXMLDOC01-appb-C000030
 The number of atoms (linked chain length) between the urea bond, urethane bond, or amide bond and the radically polymerizable group in the crosslinking agent U is not particularly limited, but is preferably 30 or less, and preferably 2 to 20. More preferably, it is 2 to 10.
When the crosslinking agent U contains a total of two or more urea bonds, urethane bonds, or amide bonds, or contains two or more radically polymerizable groups, or contains two or more urea bonds, urethane bonds, or amide bonds, and is radically polymerizable. When two or more groups are included, the minimum number of atoms (linked chain length) between the urea bond, urethane bond, or amide bond and the radically polymerizable group may be within the above range.
In this specification, "the number of atoms between the urea bond, urethane bond, or amide bond and the polymerizable group (linkage chain length)" refers to the atoms on the path connecting two atoms or atomic groups to be linked. Among chains, it refers to the chain that connects these connected objects in the shortest way (minimum number of atoms). For example, in the structure represented by the following formula, the number of atoms (linked chain length) between the urea bond and the radically polymerizable group (methacryloyloxy group) is two.
Figure JPOXMLDOC01-appb-C000030
〔対称軸〕
　架橋剤Ｕは対称軸を有しない構造の化合物であることも好ましい。
　架橋剤Ｕが対称軸を有しないとは、化合物全体を回転させることにより元の分子と同一の分子を生じる軸を有さず、左右非対称の化合物である事をいう。また、架橋剤Ｕの構造式を紙面上に表記した場合において、架橋剤Ｕが対称軸を有しないとは、架橋剤Ｕの構造式を、対称軸を有する形に表記することができないことをいう。
　架橋剤Ｕが対称軸を有しないことにより、組成物膜中では架橋剤Ｕ同士の凝集が抑制されると考えられる。 [Axis of symmetry]
It is also preferable that the crosslinking agent U is a compound having a structure without an axis of symmetry.
When the crosslinking agent U does not have an axis of symmetry, it means that it does not have an axis that produces molecules identical to the original molecule by rotating the entire compound, and is a left-right asymmetric compound. Furthermore, when the structural formula of crosslinking agent U is written on paper, the fact that crosslinking agent U does not have an axis of symmetry means that the structural formula of crosslinking agent U cannot be written in a form that has an axis of symmetry. say.
It is thought that since the crosslinking agent U does not have an axis of symmetry, aggregation of the crosslinking agents U is suppressed in the composition film.
〔分子量〕
　架橋剤Ｕの分子量は、１００～２，０００であることが好ましく、１５０～１５００であることが好ましく、２００～９００であることがより好ましい。 [Molecular weight]
The molecular weight of the crosslinking agent U is preferably from 100 to 2,000, preferably from 150 to 1,500, and more preferably from 200 to 900.
　架橋剤Ｕの製造方法は特に限定されないが、例えば、ラジカル重合性化合物とイソシアネート基とを有する化合物と、ヒドロキシ基又はアミノ基の少なくとも一方を有する化合物とを反応させることにより得ることができる。 The method for producing crosslinking agent U is not particularly limited, but, for example, it can be obtained by reacting a radically polymerizable compound and a compound having an isocyanate group with a compound having at least one of a hydroxy group or an amino group.
　架橋剤Ｕの具体例としては、後述する実施例に記載のＤ－２～Ｄ－１５及び以下の化合物が挙げられるが、架橋剤Ｕはこれに限定されるものではない。

 
Specific examples of the crosslinking agent U include D-2 to D-15 described in Examples below and the following compounds, but the crosslinking agent U is not limited thereto.


　樹脂組成物は、パターンの解像性と膜の伸縮性の観点から、２官能ラジカル重合性化合物を含むことが好ましく、２官能のメタアクリレート又はアクリレートを含むことがより好ましい。
　また、樹脂組成物が上述の架橋剤Ｕのうちラジカル重合性基を１つのみ有する化合物（重合性化合物１）と、ウレア結合、ウレタン結合及びアミド結合を有しない２官能ラジカル重合性化合物（重合性化合物２）とを含む態様も、本発明の好ましい態様の一つである。
　樹脂組成物が重合性化合物１と重合性化合物２とを含む場合、重合性化合物１と重合性化合物２の全質量に対する重合性化合物１の含有量は、上述のΔＳＰを上述の範囲内とする目的で適宜設定すればよいが、例えば、０．０１～８０質量％が好ましく、５～７０質量％がより好ましく、１０～５０質量％がより好ましい。
　具体的な化合物としては、トリエチレングリコールジアクリレート、トリエチレングリコールジメタクリレート、テトラエチレングリコールジメタクリレート、テトラエチレングリコールジアクリレート、ＰＥＧ（ポリエチレングリコール）２００ジアクリレート、ＰＥＧ２００ジメタクリレート、ＰＥＧ６００ジアクリレート、ＰＥＧ６００ジメタクリレート、ポリテトラエチレングリコールジアクリレート、ポリテトラエチレングリコールジメタクリレート、ネオペンチルグリコールジアクリレート、ネオペンチルグリコールジメタクリレート、３－メチル-１，５-ペンタンジオールジアクリレート、１，６－ヘキサンジオールジアクリレート、１，６ヘキサンジオールジメタクリレート、ジメチロール－トリシクロデカンジアクリレート、ジメチロール－トリシクロデカンジメタクリレート、ビスフェノールＡのＥＯ（エチレンオキシド）付加物ジアクリレート、ビスフェノールＡのＥＯ付加物ジメタクリレート、ビスフェノールＡのＰＯ（プロピレンオキシド）付加物ジアクリレート、ビスフェノールＡのＰＯ付加物ジメタクリレート、２－ヒドロキシー３－アクリロイロキシプロピルメタクリレート、イソシアヌル酸ＥＯ変性ジアクリレート、イソシアヌル酸変性ジメタクリレート、その他ウレタン結合を有する２官能アクリレート、ウレタン結合を有する２官能メタクリレートを使用することができる。これらは必要に応じ、２種以上を混合し使用することができる。
　なお、例えばＰＥＧ２００ジアクリレートとは、ポリエチレングリコールジアクリレートであって、ポリエチレングリコール鎖の式量が２００程度のものをいう。
　本発明の樹脂組成物は、パターン（硬化物）の反り抑制の観点から、ラジカル重合性化合物として、単官能ラジカル重合性化合物を好ましく用いることができる。単官能ラジカル重合性化合物としては、ｎ－ブチル（メタ）アクリレート、２－エチルヘキシル（メタ）アクリレート、２－ヒドロキシエチル（メタ）アクリレート、ブトキシエチル（メタ）アクリレート、カルビトール（メタ）アクリレート、シクロヘキシル（メタ）アクリレート、ベンジル（メタ）アクリレート、フェノキシエチル（メタ）アクリレート、Ｎ－メチロール（メタ）アクリルアミド、グリシジル（メタ）アクリレート、ポリエチレングリコールモノ（メタ）アクリレート、ポリプロピレングリコールモノ（メタ）アクリレート等の（メタ）アクリル酸誘導体、Ｎ－ビニルピロリドン、Ｎ－ビニルカプロラクタム等のＮ－ビニル化合物類、アリルグリシジルエーテル等が好ましく用いられる。単官能ラジカル重合性化合物としては、露光前の揮発を抑制するため、常圧下で１００℃以上の沸点を持つ化合物も好ましい。
　その他、２官能以上のラジカル重合性化合物としては、ジアリルフタレート、トリアリルトリメリテート等のアリル化合物類が挙げられる。 The resin composition preferably contains a difunctional radically polymerizable compound, and more preferably contains a difunctional methacrylate or acrylate, from the viewpoint of pattern resolution and film elasticity.
In addition, the resin composition may contain a compound (polymerizable compound 1) having only one radically polymerizable group among the crosslinking agents U described above, and a bifunctional radically polymerizable compound (polymerizable compound 1) having no urea bond, urethane bond, or amide bond. An embodiment including the chemical compound 2) is also one of the preferred embodiments of the present invention.
When the resin composition contains polymerizable compound 1 and polymerizable compound 2, the content of polymerizable compound 1 with respect to the total mass of polymerizable compound 1 and polymerizable compound 2 is such that the above-mentioned ΔSP is within the above-mentioned range. Although it may be set as appropriate depending on the purpose, for example, it is preferably 0.01 to 80% by mass, more preferably 5 to 70% by mass, and even more preferably 10 to 50% by mass.
Specific compounds include triethylene glycol diacrylate, triethylene glycol dimethacrylate, tetraethylene glycol dimethacrylate, tetraethylene glycol diacrylate, PEG (polyethylene glycol) 200 diacrylate, PEG 200 dimethacrylate, PEG 600 diacrylate, and PEG 600 diacrylate. Methacrylate, polytetraethylene glycol diacrylate, polytetraethylene glycol dimethacrylate, neopentyl glycol diacrylate, neopentyl glycol dimethacrylate, 3-methyl-1,5-pentanediol diacrylate, 1,6-hexanediol diacrylate, 1,6 hexanediol dimethacrylate, dimethylol-tricyclodecane diacrylate, dimethylol-tricyclodecane dimethacrylate, bisphenol A EO (ethylene oxide) adduct diacrylate, bisphenol A EO adduct dimethacrylate, bisphenol A PO ( propylene oxide) adduct diacrylate, bisphenol A PO adduct dimethacrylate, 2-hydroxy-3-acryloyloxypropyl methacrylate, isocyanuric acid EO-modified diacrylate, isocyanuric acid-modified dimethacrylate, other bifunctional acrylates having urethane bonds, Difunctional methacrylates with urethane bonds can be used. These can be used as a mixture of two or more types, if necessary.
Note that, for example, PEG200 diacrylate refers to polyethylene glycol diacrylate in which the formula weight of polyethylene glycol chains is about 200.
In the resin composition of the present invention, a monofunctional radically polymerizable compound can be preferably used as the radically polymerizable compound from the viewpoint of suppressing warpage of the pattern (cured product). Examples of monofunctional radically polymerizable compounds include n-butyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, 2-hydroxyethyl (meth)acrylate, butoxyethyl (meth)acrylate, carbitol (meth)acrylate, and cyclohexyl ( (meth) acrylate, benzyl (meth) acrylate, phenoxyethyl (meth) acrylate, N-methylol (meth) acrylamide, glycidyl (meth) acrylate, polyethylene glycol mono (meth) acrylate, polypropylene glycol mono (meth) acrylate, etc. ) Acrylic acid derivatives, N-vinyl compounds such as N-vinylpyrrolidone and N-vinylcaprolactam, allyl glycidyl ether, and the like are preferably used. As the monofunctional radically polymerizable compound, a compound having a boiling point of 100° C. or higher under normal pressure is also preferred in order to suppress volatilization before exposure.
In addition, allyl compounds such as diallyl phthalate and triallyl trimellitate are exemplified as radically polymerizable compounds having two or more functionalities.
　ラジカル重合性化合物を含有する場合、ラジカル重合性化合物の含有量は、樹脂組成物の全固形分に対して、０質量％超６０質量％以下であることが好ましい。下限は５質量％以上がより好ましい。上限は、５０質量％以下であることがより好ましく、３０質量％以下であることが更に好ましい。 When containing a radically polymerizable compound, the content of the radically polymerizable compound is preferably more than 0% by mass and 60% by mass or less based on the total solid content of the resin composition. The lower limit is more preferably 5% by mass or more. The upper limit is more preferably 50% by mass or less, and even more preferably 30% by mass or less.
　ラジカル重合性化合物は１種を単独で用いてもよいが、２種以上を混合して用いてもよい。２種以上を併用する場合にはその合計量が上記の範囲となることが好ましい。 One type of radically polymerizable compound may be used alone, or a mixture of two or more types may be used. When two or more types are used together, it is preferable that the total amount falls within the above range.
〔他の架橋剤〕
　本発明の樹脂組成物は、上述したラジカル重合性化合物とは異なる、他の架橋剤を更に含んでもよい。
　他の架橋剤とは、上述したラジカル重合性化合物以外の架橋剤をいい、上述の光酸発生剤、又は、光塩基発生剤の感光により、組成物中の他の化合物又はその反応生成物との間で共有結合を形成する反応が促進される基を分子内に複数個有する化合物であることが好ましく、組成物中の他の化合物又はその反応生成物との間で共有結合を形成する反応が酸又は塩基の作用によって促進される基を分子内に複数個有する化合物が好ましい。
　上記酸又は塩基は、露光工程において、光酸発生剤又は光塩基発生剤から発生する酸又は塩基であることが好ましい。
　他の架橋剤としては、アシルオキシメチル基、メチロール基、エチロール基及びアルコキシメチル基からなる群より選ばれた少なくとも１種の基を有する化合物が好ましく、アシルオキシメチル基、メチロール基、エチロール基及びアルコキシメチル基からなる群より選ばれた少なくとも１種の基が窒素原子に直接結合した構造を有する化合物がより好ましい。
　他の架橋剤としては、例えば、メラミン、グリコールウリル、尿素、アルキレン尿素、ベンゾグアナミンなどのアミノ基含有化合物にホルムアルデヒド又はホルムアルデヒドとアルコールを反応させ、上記アミノ基の水素原子をアシルオキシメチル基、メチロール基、エチロール基又はアルコキシメチル基で置換した構造を有する化合物が挙げられる。これらの化合物の製造方法は特に限定されず、上記方法により製造された化合物と同様の構造を有する化合物であればよい。これらの化合物のメチロール基同士が自己縮合してなるオリゴマーであってもよい。
　上記のアミノ基含有化合物として、メラミンを用いた架橋剤をメラミン系架橋剤、グリコールウリル、尿素又はアルキレン尿素を用いた架橋剤を尿素系架橋剤、アルキレン尿素を用いた架橋剤をアルキレン尿素系架橋剤、ベンゾグアナミンを用いた架橋剤をベンゾグアナミン系架橋剤という。
　これらの中でも、本発明の樹脂組成物は、尿素系架橋剤及びメラミン系架橋剤からなる群より選ばれた少なくとも１種の化合物を含むことが好ましく、後述するグリコールウリル系架橋剤及びメラミン系架橋剤からなる群より選ばれた少なくとも１種の化合物を含むことがより好ましい。 [Other crosslinking agents]
The resin composition of the present invention may further contain another crosslinking agent different from the above-mentioned radically polymerizable compound.
Other crosslinking agents refer to crosslinking agents other than the above-mentioned radically polymerizable compounds, and the above-mentioned photoacid generators or photobase generators are used to interact with other compounds in the composition or their reaction products. It is preferable that the compound has a plurality of groups in the molecule that promote the reaction of forming a covalent bond between other compounds in the composition or the reaction product thereof. Preferably, the compound has a plurality of groups in its molecule that are promoted by the action of an acid or a base.
The acid or base is preferably an acid or base generated from a photoacid generator or a photobase generator in the exposure step.
The other crosslinking agent is preferably a compound having at least one group selected from the group consisting of an acyloxymethyl group, a methylol group, an ethylol group, and an alkoxymethyl group. A compound having a structure in which at least one group selected from the group consisting of groups is directly bonded to a nitrogen atom is more preferable.
Other crosslinking agents include, for example, reacting an amino group-containing compound such as melamine, glycoluril, urea, alkylene urea, benzoguanamine with formaldehyde or formaldehyde and alcohol to convert the hydrogen atom of the amino group into an acyloxymethyl group, methylol group, etc. Examples include compounds having a structure substituted with an ethylol group or an alkoxymethyl group. The method for producing these compounds is not particularly limited, and any compound having the same structure as the compound produced by the above method may be used. An oligomer formed by self-condensation of the methylol groups of these compounds may also be used.
As the above amino group-containing compound, a crosslinking agent using melamine is a melamine crosslinking agent, a crosslinking agent using glycoluril, urea or alkylene urea is a urea crosslinking agent, and a crosslinking agent using alkylene urea is an alkylene urea crosslinking agent. A crosslinking agent using benzoguanamine is called a benzoguanamine-based crosslinking agent.
Among these, the resin composition of the present invention preferably contains at least one compound selected from the group consisting of a urea-based crosslinking agent and a melamine-based crosslinking agent, and includes a glycoluril-based crosslinking agent and a melamine-based crosslinking agent described below. It is more preferable that at least one compound selected from the group consisting of agents is included.
　本発明におけるアルコキシメチル基及びアシルオキシメチル基の少なくとも１つを含有する化合物としては、アルコキシメチル基又はアシルオキシメチル基が、直接芳香族基や下記ウレア構造の窒素原子上に、又は、トリアジン上に置換した化合物を構造例として挙げることができる。
　上記化合物が有するアルコキシメチル基又はアシルオキシメチル基は、炭素数２～５が好ましく、炭素数２又は３が好ましく、炭素数２がより好ましい。
　上記化合物が有するアルコキシメチル基及びアシルオキシメチル基の総数は１～１０が好ましく、２～８がより好ましく、３～６が特に好ましい。
　上記化合物の分子量は１５００以下が好ましく、１８０～１２００よりが好ましい。 In the present invention, the compound containing at least one of an alkoxymethyl group and an acyloxymethyl group has an alkoxymethyl group or an acyloxymethyl group substituted directly on an aromatic group, a nitrogen atom of the urea structure shown below, or on a triazine. Examples of the structure include the following compounds.
The alkoxymethyl group or acyloxymethyl group possessed by the above compound preferably has 2 to 5 carbon atoms, preferably 2 or 3 carbon atoms, and more preferably 2 carbon atoms.
The total number of alkoxymethyl groups and acyloxymethyl groups possessed by the above compound is preferably 1 to 10, more preferably 2 to 8, particularly preferably 3 to 6.
The molecular weight of the above compound is preferably 1,500 or less, more preferably from 180 to 1,200.
　Ｒ１００は、アルキル基又はアシル基を表す。
　Ｒ１０１及びＲ１０２は、それぞれ独立に、１価の有機基を表し、互いに結合して環を形成してもよい。 R 100 represents an alkyl group or an acyl group.
R 101 and R 102 each independently represent a monovalent organic group, and may be bonded to each other to form a ring.
　アルコキシメチル基又はアシルオキシメチル基が直接芳香族基に置換した化合物としては、例えば下記一般式の様な化合物を挙げることができる。 Examples of compounds in which an alkoxymethyl group or an acyloxymethyl group is directly substituted with an aromatic group include compounds represented by the following general formula.
　式中、Ｘは単結合又は２価の有機基を示し、個々のＲ１０４はそれぞれ独立にアルキル基又はアシル基を示し、Ｒ１０３は、水素原子、アルキル基、アルケニル基、アリール基、アラルキル基、又は、酸の作用により分解し、アルカリ可溶性基を生じる基（例えば、酸の作用により脱離する基、－Ｃ（Ｒ４）２ＣＯＯＲ５で表される基（Ｒ４はそれぞれ独立に、水素原子又は炭素数１～４のアルキル基を表し、Ｒ５は酸の作用により脱離する基を表す。））を示す。
　Ｒ１０５は各々独立にアルキル基又はアルケニル基を示し、ａ、ｂ及びｃは各々独立に１～３であり、ｄは０～４であり、ｅは０～３であり、ｆは０～３であり、ａ＋ｄは５以下であり、ｂ＋ｅは４以下であり、ｃ＋ｆは４以下である。
　酸の作用により分解し、アルカリ可溶性基を生じる基、酸の作用により脱離する基、－Ｃ（Ｒ４）２ＣＯＯＲ５で表される基におけるＲ５については、例えば、－Ｃ（Ｒ３６）（Ｒ３７）（Ｒ３８）、－Ｃ（Ｒ３６）（Ｒ３７）（ＯＲ３９）、－Ｃ（Ｒ０１）（Ｒ０２）（ＯＲ３９）等を挙げることができる。
　式中、Ｒ３６～Ｒ３９は、各々独立に、アルキル基、シクロアルキル基、アリール基、アラルキル基又はアルケニル基を表す。Ｒ３６とＲ３７とは、互いに結合して環を形成してもよい。
　上記アルキル基としては、炭素数１～１０のアルキル基が好ましく、炭素数１～５のアルキル基がより好ましい。
　上記アルキル基は、直鎖状、分岐鎖状のいずれであってもよい。
　上記シクロアルキル基としては、炭素数３～１２のシクロアルキル基が好ましく、炭素数３～８のシクロアルキル基がより好ましい。
　上記シクロアルキル基は単環構造であってもよいし、縮合環等の多環構造であってもよい。
　上記アリール基は炭素数６～３０の芳香族炭化水素基であることが好ましく、フェニル基であることがより好ましい。
　上記アラルキル基としては、炭素数７～２０のアラルキル基が好ましく、炭素数７～１６のアラルキル基がより好ましい。
　上記アラルキル基はアルキル基により置換されたアリール基を意図しており、これらのアルキル基及びアリール基の好ましい態様は、上述のアルキル基及びアリール基の好ましい態様と同様である。
　上記アルケニル基は炭素数３～２０のアルケニル基が好ましく、炭素数３～１６のアルケニル基がより好ましい。
　これらの基は、公知の置換基を更に有していてもよい。 In the formula , , or a group that decomposes under the action of an acid to produce an alkali-soluble group (e.g., a group that leaves under the action of an acid, a group represented by -C(R 4 ) 2 COOR 5 (R 4 is each independently, It represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, and R 5 represents a group that is eliminated by the action of an acid.
R 105 each independently represents an alkyl group or an alkenyl group, a, b and c each independently represent 1 to 3, d represents 0 to 4, e represents 0 to 3, and f represents 0 to 3. , a+d is 5 or less, b+e is 4 or less, and c+f is 4 or less.
For R 5 in a group that decomposes under the action of an acid to produce an alkali-soluble group, a group that leaves under the action of an acid, and a group represented by -C(R 4 ) 2 COOR 5 , for example, -C(R 36 )(R 37 )(R 38 ), -C(R 36 )(R 37 )(OR 39 ), and -C(R 01 )(R 02 )(OR 39 ).
In the formula, R 36 to R 39 each independently represent an alkyl group, a cycloalkyl group, an aryl group, an aralkyl group, or an alkenyl group. R 36 and R 37 may be combined with each other to form a ring.
The alkyl group is preferably an alkyl group having 1 to 10 carbon atoms, more preferably an alkyl group having 1 to 5 carbon atoms.
The alkyl group may be linear or branched.
The above-mentioned cycloalkyl group is preferably a cycloalkyl group having 3 to 12 carbon atoms, more preferably a cycloalkyl group having 3 to 8 carbon atoms.
The above cycloalkyl group may have a monocyclic structure or a polycyclic structure such as a condensed ring.
The above aryl group is preferably an aromatic hydrocarbon group having 6 to 30 carbon atoms, and more preferably a phenyl group.
The aralkyl group is preferably an aralkyl group having 7 to 20 carbon atoms, more preferably an aralkyl group having 7 to 16 carbon atoms.
The above aralkyl group is intended to be an aryl group substituted with an alkyl group, and the preferred embodiments of these alkyl groups and aryl groups are the same as the preferred embodiments of the alkyl group and aryl group described above.
The above alkenyl group is preferably an alkenyl group having 3 to 20 carbon atoms, more preferably an alkenyl group having 3 to 16 carbon atoms.
These groups may further have known substituents.
　Ｒ０１及びＲ０２は、各々独立に、水素原子、アルキル基、シクロアルキル基、アリール基、アラルキル基又はアルケニル基を表す。 R 01 and R 02 each independently represent a hydrogen atom, an alkyl group, a cycloalkyl group, an aryl group, an aralkyl group, or an alkenyl group.
　酸の作用により分解し、アルカリ可溶性基を生じる基、または酸の作用により脱離する基としては好ましくは、第３級アルキルエステル基、アセタール基、クミルエステル基、エノールエステル基等である。更に好ましくは、第３級アルキルエステル基、アセタール基である。 Preferable examples of the group that decomposes under the action of an acid to produce an alkali-soluble group, or the group that leaves the group under the action of an acid include a tertiary alkyl ester group, an acetal group, a cumyl ester group, and an enol ester group. More preferred are tertiary alkyl ester groups and acetal groups.
　また、アシルオキシメチル基、メチロール基、エチロール基及びアルコキシメチル基からなる群より選ばれた少なくとも１種の基を有する化合物としては、ウレア結合及びウレタン結合からなる群より選ばれた少なくとも一方の基を有する化合物も好ましい。上記化合物の好ましい態様は、重合性基がラジカル重合性基ではなくアシルオキシメチル基、メチロール基、エチロール基及びアルコキシメチル基からなる群より選ばれた少なくとも１種の基である以外は、上述の架橋剤Ｕの好ましい態様と同様である。 Furthermore, the compound having at least one group selected from the group consisting of an acyloxymethyl group, a methylol group, an ethylol group, and an alkoxymethyl group may include at least one group selected from the group consisting of a urea bond and a urethane bond. Compounds having the following are also preferred. A preferred embodiment of the above compound is the above-mentioned crosslinked compound, except that the polymerizable group is not a radically polymerizable group but is at least one group selected from the group consisting of an acyloxymethyl group, a methylol group, an ethylol group, and an alkoxymethyl group. This is the same as the preferred embodiment of Agent U.
　アシルオキシメチル基、メチロール基及びエチロール基からなる群より選ばれた少なくとも１種の基を有する化合物としては具体的に以下の構造を挙げることができる。アシルオキシメチル基を有する化合物は下記化合物のアルコキシメチル基をアシルオキシメチル基に変更した化合物を挙げることができる。アルコキシメチル基又はアシルオキシメチルを分子内に有する化合物としては以下の様な化合物を挙げることができるが、これらに限定されるものではない。 Specific examples of the compound having at least one group selected from the group consisting of an acyloxymethyl group, a methylol group, and an ethylol group include the following structures. Examples of the compound having an acyloxymethyl group include the following compounds in which the alkoxymethyl group is changed to an acyloxymethyl group. Compounds having an alkoxymethyl group or acyloxymethyl in the molecule include, but are not limited to, the following compounds.
　アルコキシメチル基及びアシルオキシメチル基の少なくとも１つを含有する化合物は、市販のものを用いても、公知の方法により合成したものを用いてもよい。
　耐熱性の観点で、アルコキシメチル基又はアシルオキシメチル基が、直接芳香環やトリアジン環上に置換した化合物が好ましい。 As the compound containing at least one of an alkoxymethyl group and an acyloxymethyl group, a commercially available compound may be used, or a compound synthesized by a known method may be used.
From the viewpoint of heat resistance, compounds in which an alkoxymethyl group or an acyloxymethyl group is directly substituted on an aromatic ring or triazine ring are preferred.
　メラミン系架橋剤の具体例としては、ヘキサメトキシメチルメラミン、ヘキサエトキシメチルメラミン、ヘキサプロポキシメチルメラミン、ヘキサブトキシブチルメラミンなどが挙げられる。 Specific examples of melamine-based crosslinking agents include hexamethoxymethylmelamine, hexaethoxymethylmelamine, hexapropoxymethylmelamine, hexabutoxybutylmelamine, and the like.
　尿素系架橋剤の具体例としては、例えば、モノヒドロキシメチル化グリコールウリル、ジヒドロキシメチル化グリコールウリル、トリヒドロキシメチル化グリコールウリル、テトラヒドロキシメチル化グリコールウリル、モノメトキシメチル化グリコールウリル、ジメトキシメチル化グリコールウリル、トリメトキシメチル化グリコールウリル、テトラメトキシメチル化グリコールウリル、モノエトキシメチル化グリコールウリル、ジエトキシメチル化グリコールウリル、トリエトキシメチル化グリコールウリル、テトラエトキシメチル化グリコールウリル、モノプロポキシメチル化グリコールウリル、ジプロポキシメチル化グリコールウリル、トリプロポキシメチル化グリコールウリル、テトラプロポキシメチル化グリコールウリル、モノブトキシメチル化グリコールウリル、ジブトキシメチル化グリコールウリル、トリブトキシメチル化グリコールウリル、又は、テトラブトキシメチル化グリコールウリルなどのグリコールウリル系架橋剤、
　ビスメトキシメチル尿素、ビスエトキシメチル尿素、ビスプロポキシメチル尿素、ビスブトキシメチル尿素等の尿素系架橋剤、
　モノヒドロキシメチル化エチレン尿素又はジヒドロキシメチル化エチレン尿素、モノメトキシメチル化エチレン尿素、ジメトキシメチル化エチレン尿素、モノエトキシメチル化エチレン尿素、ジエトキシメチル化エチレン尿素、モノプロポキシメチル化エチレン尿素、ジプロポキシメチル化エチレン尿素、モノブトキシメチル化エチレン尿素、又は、ジブトキシメチル化エチレン尿素などのエチレン尿素系架橋剤、
　モノヒドロキシメチル化プロピレン尿素、ジヒドロキシメチル化プロピレン尿素、モノメトキシメチル化プロピレン尿素、ジメトキシメチル化プロピレン尿素、モノエトキシメチル化プロピレン尿素、ジエトキシメチル化プロピレン尿素、モノプロポキシメチル化プロピレン尿素、ジプロポキシメチル化プロピレン尿素、モノブトキシメチル化プロピレン尿素、又は、ジブトキシメチル化プロピレン尿素などのプロピレン尿素系架橋剤、
　１，３－ジ（メトキシメチル）４，５－ジヒドロキシ－２－イミダゾリジノン、１，３－ジ（メトキシメチル）－４，５－ジメトキシ－２－イミダゾリジノンなどが挙げられる。 Specific examples of urea-based crosslinking agents include monohydroxymethylated glycoluril, dihydroxymethylated glycoluril, trihydroxymethylated glycoluril, tetrahydroxymethylated glycoluril, monomethoxymethylated glycoluril, and dimethoxymethylated glycoluril. uril, trimethoxymethylated glycoluril, tetramethoxymethylated glycoluril, monoethoxymethylated glycoluril, diethoxymethylated glycoluril, triethoxymethylated glycoluril, tetraethoxymethylated glycoluril, monopropoxymethylated glycoluril , dipropoxymethylated glycoluril, tripropoxymethylated glycoluril, tetrapropoxymethylated glycoluril, monobutoxymethylated glycoluril, dibutoxymethylated glycoluril, tributoxymethylated glycoluril, or tetrabutoxymethylated glycoluril Glycoluril crosslinking agents such as uril,
Urea-based crosslinking agents such as bismethoxymethylurea, bisethoxymethylurea, bispropoxymethylurea, bisbutoxymethylurea,
Monohydroxymethylated ethyleneurea or dihydroxymethylated ethyleneurea, monomethoxymethylated ethyleneurea, dimethoxymethylated ethyleneurea, monoethoxymethylated ethyleneurea, diethoxymethylated ethyleneurea, monopropoxymethylated ethyleneurea, dipropoxymethyl ethylene urea-based crosslinking agents such as ethylene urea, monobutoxymethyl ethylene urea, or dibutoxy methyl ethylene urea,
Monohydroxymethylated propylene urea, dihydroxymethylated propylene urea, monomethoxymethylated propylene urea, dimethoxymethylated propylene urea, monoethoxymethylated propylene urea, diethoxymethylated propylene urea, monopropoxymethylated propylene urea, dipropoxymethyl Propylene urea-based crosslinking agents such as propylene urea, monobutoxymethylated propylene urea, or dibutoxymethylated propylene urea,
Examples include 1,3-di(methoxymethyl)4,5-dihydroxy-2-imidazolidinone and 1,3-di(methoxymethyl)-4,5-dimethoxy-2-imidazolidinone.
　ベンゾグアナミン系架橋剤の具体例としては、例えばモノヒドロキシメチル化ベンゾグアナミン、ジヒドロキシメチル化ベンゾグアナミン、トリヒドロキシメチル化ベンゾグアナミン、テトラヒドロキシメチル化ベンゾグアナミン、モノメトキシメチル化ベンゾグアナミン、ジメトキシメチル化ベンゾグアナミン、トリメトキシメチル化ベンゾグアナミン、テトラメトキシメチル化ベンゾグアナミン、モノエトキシメチル化ベンゾグアナミン、ジエトキシメチル化ベンゾグアナミン、トリエトキシメチル化ベンゾグアナミン、テトラエトキシメチル化ベンゾグアナミン、モノプロポキシメチル化ベンゾグアナミン、ジプロポキシメチル化ベンゾグアナミン、トリプロポキシメチル化ベンゾグアナミン、テトラプロポキシメチル化ベンゾグアナミン、モノブトキシメチル化ベンゾグアナミン、ジブトキシメチル化ベンゾグアナミン、トリブトキシメチル化ベンゾグアナミン、テトラブトキシメチル化ベンゾグアナミンなどが挙げられる。 Specific examples of benzoguanamine-based crosslinking agents include monohydroxymethylated benzoguanamine, dihydroxymethylated benzoguanamine, trihydroxymethylated benzoguanamine, tetrahydroxymethylated benzoguanamine, monomethoxymethylated benzoguanamine, dimethoxymethylated benzoguanamine, and trimethoxymethylated benzoguanamine. , tetramethoxymethylated benzoguanamine, monoethoxymethylated benzoguanamine, diethoxymethylated benzoguanamine, triethoxymethylated benzoguanamine, tetraethoxymethylated benzoguanamine, monopropoxymethylated benzoguanamine, dipropoxymethylated benzoguanamine, tripropoxymethylated benzoguanamine, tetra Examples include propoxymethylated benzoguanamine, monobutoxymethylated benzoguanamine, dibutoxymethylated benzoguanamine, tributoxymethylated benzoguanamine, and tetrabutoxymethylated benzoguanamine.
　その他、メチロール基及びアルコキシメチル基からなる群より選ばれた少なくとも１種の基を有する化合物としては、芳香環（好ましくはベンゼン環）にメチロール基及びアルコキシメチル基からなる群より選ばれた少なくとも１種の基が直接結合した化合物も好適に用いられる。
　このような化合物の具体例としては、ベンゼンジメタノール、ビス（ヒドロキシメチル）クレゾール、ビス（ヒドロキシメチル）ジメトキシベンゼン、ビス（ヒドロキシメチル）ジフェニルエーテル、ビス（ヒドロキシメチル）ベンゾフェノン、ヒドロキシメチル安息香酸ヒドロキシメチルフェニル、ビス（ヒドロキシメチル）ビフェニル、ジメチルビス（ヒドロキシメチル）ビフェニル、ビス（メトキシメチル）ベンゼン、ビス（メトキシメチル）クレゾール、ビス（メトキシメチル）ジメトキシベンゼン、ビス（メトキシメチル）ジフェニルエーテル、ビス（メトキシメチル）ベンゾフェノン、メトキシメチル安息香酸メトキシメチルフェニル、ビス（メトキシメチル）ビフェニル、ジメチルビス（メトキシメチル）ビフェニル、４，４’，４’’－エチリデントリス［２，６－ビス（メトキシメチル）フェノール］、５，５’－［２，２，２－トリフルオロ－１－（トリフルオロメチル）エチリデン］ビス［２－ヒドロキシ－１，３－ベンゼンジメタノール］、３，３’，５，５’－テトラキス（メトキシメチル）－１，１’－ビフェニル－４，４’－ジオール等が挙げられる。 In addition, as a compound having at least one group selected from the group consisting of a methylol group and an alkoxymethyl group, at least one group selected from the group consisting of a methylol group and an alkoxymethyl group is added to an aromatic ring (preferably a benzene ring). Compounds in which species groups are directly bonded are also preferably used.
Specific examples of such compounds include benzenedimethanol, bis(hydroxymethyl)cresol, bis(hydroxymethyl)dimethoxybenzene, bis(hydroxymethyl)diphenyl ether, bis(hydroxymethyl)benzophenone, and hydroxymethylphenyl hydroxymethylbenzoate. , bis(hydroxymethyl)biphenyl, dimethylbis(hydroxymethyl)biphenyl, bis(methoxymethyl)benzene, bis(methoxymethyl)cresol, bis(methoxymethyl)dimethoxybenzene, bis(methoxymethyl)diphenyl ether, bis(methoxymethyl) Benzophenone, methoxymethylphenyl methoxymethylbenzoate, bis(methoxymethyl)biphenyl, dimethylbis(methoxymethyl)biphenyl, 4,4',4''-ethylidentris [2,6-bis(methoxymethyl)phenol], 5 , 5'-[2,2,2-trifluoro-1-(trifluoromethyl)ethylidene]bis[2-hydroxy-1,3-benzenedimethanol], 3,3',5,5'-tetrakis( (methoxymethyl)-1,1'-biphenyl-4,4'-diol and the like.
　他の架橋剤としては市販品を用いてもよく、好適な市販品としては、４６ＤＭＯＣ、４６ＤＭＯＥＰ（以上、旭有機材工業社製）、ＤＭＬ－ＰＣ、ＤＭＬ－ＰＥＰ、ＤＭＬ－ＯＣ、ＤＭＬ－ＯＥＰ、ＤＭＬ－３４Ｘ、ＤＭＬ－ＰＴＢＰ、ＤＭＬ－ＰＣＨＰ、ＤＭＬ－ＯＣＨＰ、ＤＭＬ－ＰＦＰ、ＤＭＬ－ＰＳＢＰ、ＤＭＬ－ＰＯＰ、ＤＭＬ－ＭＢＯＣ、ＤＭＬ－ＭＢＰＣ、ＤＭＬ－ＭＴｒｉｓＰＣ、ＤＭＬ－ＢｉｓＯＣ－Ｚ、ＤＭＬ－ＢｉｓＯＣＨＰ－Ｚ、ＤＭＬ－ＢＰＣ、ＤＭＬＢｉｓＯＣ－Ｐ、ＤＭＯＭ－ＰＣ、ＤＭＯＭ－ＰＴＢＰ、ＤＭＯＭ－ＭＢＰＣ、ＴｒｉＭＬ－Ｐ、ＴｒｉＭＬ－３５ＸＬ、ＴＭＬ－ＨＱ、ＴＭＬ－ＢＰ、ＴＭＬ－ｐｐ－ＢＰＦ、ＴＭＬ－ＢＰＥ、ＴＭＬ－ＢＰＡ、ＴＭＬ－ＢＰＡＦ、ＴＭＬ－ＢＰＡＰ、ＴＭＯＭ－ＢＰ、ＴＭＯＭ－ＢＰＥ、ＴＭＯＭ－ＢＰＡ、ＴＭＯＭ－ＢＰＡＦ、ＴＭＯＭ－ＢＰＡＰ、ＨＭＬ－ＴＰＰＨＢＡ、ＨＭＬ－ＴＰＨＡＰ、ＨＭＯＭ－ＴＰＰＨＢＡ、ＨＭＯＭ－ＴＰＨＡＰ（以上、本州化学工業社製）、ニカラック（登録商標、以下同様）ＭＸ－２９０、ニカラックＭＸ－２８０、ニカラックＭＸ－２７０、ニカラックＭＸ－２７９、ニカラックＭＷ－１００ＬＭ、ニカラックＭＸ－７５０ＬＭ（以上、三和ケミカル社製）などが挙げられる。 Commercial products may be used as other crosslinking agents, and suitable commercial products include 46DMOC, 46DMOEP (manufactured by Asahi Yokuzai Kogyo Co., Ltd.), DML-PC, DML-PEP, DML-OC, and DML-OEP. , DML-34X, DML-PTBP, DML-PCHP, DML-OCHP, DML-PFP, DML-PSBP, DML-POP, DML-MBOC, DML-MBPC, DML-MTrisPC, DML-BisOC-Z, DML-BisOCHP -Z, DML-BPC, DMLBisOC-P, DMOM-PC, DMOM-PTBP, DMOM-MBPC, TriML-P, TriML-35XL, TML-HQ, TML-BP, TML-pp-BPF, TML-BPE, TML -BPA, TML-BPAF, TML-BPAP, TMOM-BP, TMOM-BPE, TMOM-BPA, TMOM-BPAF, TMOM-BPAP, HML-TPPHBA, HML-TPHAP, HMOM-TPPHBA, HMOM-TPHAP (the above, Honshu (manufactured by Kagaku Kogyo Co., Ltd.), Nikalak (registered trademark, hereinafter the same) MX-290, Nikalak MX-280, Nikalak MX-270, Nikalak MX-279, Nikalak MW-100LM, Nikalak MX-750LM (all manufactured by Sanwa Chemical Co., Ltd.) ), etc.
　本発明の樹脂組成物は、他の架橋剤として、エポキシ化合物、オキセタン化合物、及び、ベンゾオキサジン化合物からなる群より選ばれた少なくとも１種の化合物を含むことも好ましい。 It is also preferable that the resin composition of the present invention contains at least one compound selected from the group consisting of an epoxy compound, an oxetane compound, and a benzoxazine compound as another crosslinking agent.
－エポキシ化合物（エポキシ基を有する化合物）－
　エポキシ化合物としては、一分子中にエポキシ基を２以上有する化合物であることが好ましい。エポキシ基は、２００℃以下で架橋反応し、かつ、架橋に由来する脱水反応が起こらないため膜収縮が起きにくい。このため、エポキシ化合物を含有することは、樹脂組成物の低温硬化及び反りの抑制に効果的である。 -Epoxy compounds (compounds with epoxy groups)-
The epoxy compound is preferably a compound having two or more epoxy groups in one molecule. Epoxy groups undergo a crosslinking reaction at 200° C. or lower, and no dehydration reaction due to crosslinking occurs, so membrane shrinkage is less likely to occur. Therefore, containing an epoxy compound is effective in curing the resin composition at low temperatures and suppressing warpage.
　エポキシ化合物は、ポリエチレンオキサイド基を含有することが好ましい。これにより、より弾性率が低下し、反りを抑制することができる。ポリエチレンオキサイド基は、エチレンオキサイドの繰返し単位数が２以上のものを意味し、繰返し単位数が２～１５であることが好ましい。 It is preferable that the epoxy compound contains a polyethylene oxide group. This further reduces the elastic modulus and suppresses warpage. The polyethylene oxide group means one in which the number of ethylene oxide repeating units is 2 or more, and the number of repeating units is preferably 2 to 15.
　エポキシ化合物の例としては、ビスフェノールＡ型エポキシ樹脂；ビスフェノールＦ型エポキシ樹脂；プロピレングリコールジグリシジルエーテル、ネオペンチルグリコールジグリシジルエーテル、エチレングリコールジグリシジルエーテル、ブチレングリコールジグリシジルエーテル、ヘキサメチレングリコールジグリシジルエーテル、トリメチロールプロパントリグリシジルエーテル等のアルキレングリコール型エポキシ樹脂又は多価アルコール炭化水素型エポキシ樹脂；ポリプロピレングリコールジグリシジルエーテル等のポリアルキレングリコール型エポキシ樹脂；ポリメチル（グリシジロキシプロピル）シロキサン等のエポキシ基含有シリコーンなどを挙げることができるが、これらに限定されない。具体的には、エピクロン（登録商標、以下同様）８５０－Ｓ、エピクロンＨＰ－４０３２、エピクロンＨＰ－７２００、エピクロンＨＰ－８２０、エピクロンＨＰ－４７００、エピクロンＨＰ－４７７０、エピクロンＥＸＡ－８３０ＬＶＰ、エピクロンＥＸＡ－８１８３、エピクロンＥＸＡ－８１６９、エピクロンＮ－６６０、エピクロンＮ－６６５－ＥＸＰ－Ｓ、エピクロンＮ－７４０（以上商品名、ＤＩＣ（株）製）、リカレジン（登録商標、以下同様）ＢＥＯ－２０Ｅ、リカレジンＢＥＯ－６０Ｅ、リカレジンＨＢＥ－１００、リカレジンＤＭＥ－１００、リカレジンＬ－２００（以上商品名、新日本理化（株）製）、ＥＰ－４００３Ｓ、ＥＰ－４０００Ｓ、ＥＰ－４０８８Ｓ、ＥＰ－３９５０Ｓ（以上商品名、（株）ＡＤＥＫＡ製）、セロキサイド（登録商標、以下同様）２０２１Ｐ、セロキサイド２０８１、セロキサイド２０００、ＥＨＰＥ３１５０、エポリード（登録商標、以下同様）ＧＴ４０１、エポリードＰＢ４７００、エポリードＰＢ３６００（以上商品名、（株）ダイセル製）、ＮＣ－３０００、ＮＣ－３０００－Ｌ、ＮＣ－３０００－Ｈ、ＮＣ－３０００－ＦＨ－７５Ｍ、ＮＣ－３１００、ＣＥＲ－３０００－Ｌ、ＮＣ－２０００－Ｌ、ＸＤ－１０００、ＮＣ－７０００Ｌ、ＮＣ－７３００Ｌ、ＥＰＰＮ－５０１Ｈ、ＥＰＰＮ－５０１ＨＹ、ＥＰＰＮ－５０２Ｈ、ＥＯＣＮ－１０２０、ＥＯＣＮ－１０２Ｓ、ＥＯＣＮ－１０３Ｓ、ＥＯＣＮ－１０４Ｓ、ＣＥＲ－１０２０、ＥＰＰＮ－２０１、ＢＲＥＮ－Ｓ、ＢＲＥＮ－１０Ｓ（以上商品名、日本化薬（株）製）などが挙げられる。また以下の化合物も好適に用いられる。  Examples of epoxy compounds include bisphenol A type epoxy resin; bisphenol F type epoxy resin; propylene glycol diglycidyl ether, neopentyl glycol diglycidyl ether, ethylene glycol diglycidyl ether, butylene glycol diglycidyl ether, and hexamethylene glycol diglycidyl ether. , alkylene glycol type epoxy resin or polyhydric alcohol hydrocarbon type epoxy resin such as trimethylolpropane triglycidyl ether; polyalkylene glycol type epoxy resin such as polypropylene glycol diglycidyl ether; epoxy group such as polymethyl (glycidyloxypropyl) siloxane Examples include, but are not limited to, silicone containing silicone. Specifically, Epicron (registered trademark, hereinafter the same) 850-S, Epiclon HP-4032, Epiclon HP-7200, Epiclon HP-820, Epiclon HP-4700, Epiclon HP-4770, Epiclon EXA-830LVP, Epiclon EXA- 8183, Epiclon EXA-8169, Epiclon N-660, Epiclon N-665-EXP-S, Epiclon N-740 (trade name, manufactured by DIC Corporation), Recaresin (registered trademark, same hereinafter) BEO-20E, Recaresin BEO-60E, RIKARESIN HBE-100, RIKARESIN DME-100, RIKARESIN L-200 (the above product names, manufactured by Shin Nippon Rika Co., Ltd.), EP-4003S, EP-4000S, EP-4088S, EP-3950S (the above products) ADEKA Co., Ltd.), Celoxide (registered trademark, hereinafter the same) 2021P, Celoxide 2081, Celoxide 2000, EHPE3150, Epolead (registered trademark, the same hereinafter) GT401, Epolead PB4700, Epolead PB3600 (the above product names, Co., Ltd.) Daicel), NC-3000, NC-3000-L, NC-3000-H, NC-3000-FH-75M, NC-3100, CER-3000-L, NC-2000-L, XD-1000, NC- 7000L, NC-7300L, EPPN-501H, EPPN-501HY, EPPN-502H, EOCN-1020, EOCN-102S, EOCN-103S, EOCN-104S, CER-1020, EPPN-201, BREN-S, BREN-10S ( The product names listed above include those manufactured by Nippon Kayaku Co., Ltd.). Moreover, the following compounds are also suitably used.​
　式中ｎは１～５の整数、ｍは１～２０の整数である。  In the formula, n is an integer of 1 to 5, and m is an integer of 1 to 20.​
　上記構造の中でも、耐熱性と伸度向上を両立する点から、ｎは１～２、ｍは３～７であることが好ましい。 Among the above structures, n is preferably 1 to 2 and m is preferably 3 to 7 in order to achieve both heat resistance and elongation improvement.
－オキセタン化合物（オキセタニル基を有する化合物）－
　オキセタン化合物としては、一分子中にオキセタン環を２つ以上有する化合物、３－エチル－３－ヒドロキシメチルオキセタン、１，４－ビス｛［（３－エチル－３－オキセタニル）メトキシ］メチル｝ベンゼン、３－エチル－３－（２－エチルヘキシルメチル）オキセタン、１，４－ベンゼンジカルボン酸－ビス［（３－エチル－３－オキセタニル）メチル］エステル等を挙げることができる。具体的な例としては、東亞合成（株）製のアロンオキセタンシリーズ（例えば、ＯＸＴ－１２１、ＯＸＴ－２２１）が好適に使用することができ、これらは単独で、又は２種以上混合してもよい。 -Oxetane compound (compound having an oxetanyl group)-
Oxetane compounds include compounds having two or more oxetane rings in one molecule, 3-ethyl-3-hydroxymethyloxetane, 1,4-bis{[(3-ethyl-3-oxetanyl)methoxy]methyl}benzene, Examples include 3-ethyl-3-(2-ethylhexylmethyl)oxetane and 1,4-benzenedicarboxylic acid-bis[(3-ethyl-3-oxetanyl)methyl]ester. As a specific example, the Aronoxetane series (for example, OXT-121, OXT-221) manufactured by Toagosei Co., Ltd. can be suitably used, and these may be used alone or in combination of two or more. good.
－ベンゾオキサジン化合物（ベンゾオキサゾリル基を有する化合物）－
　ベンゾオキサジン化合物は、開環付加反応に由来する架橋反応のため、硬化時に脱ガスが発生せず、更に熱収縮を小さくして反りの発生が抑えられることから好ましい。 -Benzoxazine compound (compound having benzoxazolyl group)-
A benzoxazine compound is preferable because it does not generate outgassing during curing due to a crosslinking reaction derived from a ring-opening addition reaction, and furthermore, it reduces thermal shrinkage and suppresses the occurrence of warpage.
　ベンゾオキサジン化合物の好ましい例としては、Ｐ－ｄ型ベンゾオキサジン、Ｆ－ａ型ベンゾオキサジン（以上、商品名、四国化成工業社製）、ポリヒドロキシスチレン樹脂のベンゾオキサジン付加物、フェノールノボラック型ジヒドロベンゾオキサジン化合物が挙げられる。これらは単独で用いるか、又は２種以上混合してもよい。 Preferred examples of benzoxazine compounds include P-d type benzoxazine, F-a type benzoxazine (trade name, manufactured by Shikoku Kasei Kogyo Co., Ltd.), benzoxazine adduct of polyhydroxystyrene resin, and phenol novolak type dihydrobenzo. Examples include oxazine compounds. These may be used alone or in combination of two or more.
　他の架橋剤の含有量は、樹脂組成物の全固形分に対し０．１～３０質量％であることが好ましく、０．１～２０質量％であることがより好ましく、０．５～１５質量％であることが更に好ましく、１．０～１０質量％であることが特に好ましい。他の架橋剤は１種のみ含有していてもよいし、２種以上含有していてもよい。他の架橋剤を２種以上含有する場合は、その合計が上記範囲であることが好ましい。 The content of other crosslinking agents is preferably 0.1 to 30% by mass, more preferably 0.1 to 20% by mass, and 0.5 to 15% by mass based on the total solid content of the resin composition. It is more preferably 1.0 to 10% by weight, particularly preferably 1.0 to 10% by weight. Only one type of other crosslinking agent may be contained, or two or more types thereof may be contained. When two or more types of other crosslinking agents are contained, it is preferable that the total amount is within the above range.
〔重合開始剤〕
　本発明の樹脂組成物は、重合開始剤を含むことが好ましい。重合開始剤は熱重合開始剤であっても光重合開始剤であってもよいが、特に光重合開始剤を含むことが好ましい。
　光重合開始剤は、光ラジカル重合開始剤であることが好ましい。光ラジカル重合開始剤としては、特に制限はなく、公知の光ラジカル重合開始剤の中から適宜選択することができる。例えば、紫外線領域から可視領域の光線に対して感光性を有する光ラジカル重合開始剤が好ましい。また、光励起された増感剤と作用し、活性ラジカルを生成する活性剤であってもよい。 [Polymerization initiator]
The resin composition of the present invention preferably contains a polymerization initiator. The polymerization initiator may be a thermal polymerization initiator or a photopolymerization initiator, but it is particularly preferable to include a photopolymerization initiator.
The photopolymerization initiator is preferably a radical photopolymerization initiator. The radical photopolymerization initiator is not particularly limited and can be appropriately selected from known radical photopolymerization initiators. For example, a photoradical polymerization initiator that is sensitive to light in the ultraviolet to visible range is preferable. Alternatively, it may be an activator that acts with a photoexcited sensitizer to generate active radicals.
　光ラジカル重合開始剤は、波長約２４０～８００ｎｍ（好ましくは３３０～５００ｎｍ）の範囲内で少なくとも約５０Ｌ・ｍｏｌ－１・ｃｍ－１のモル吸光係数を有する化合物を、少なくとも１種含有していることが好ましい。化合物のモル吸光係数は、公知の方法を用いて測定することができる。例えば、紫外可視分光光度計（Ｖａｒｉａｎ社製Ｃａｒｙ－５　ｓｐｅｃｔｒｏｐｈｏｔｏｍｅｔｅｒ）にて、酢酸エチル溶剤を用い、０．０１ｇ／Ｌの濃度で測定することが好ましい。 The photoradical polymerization initiator contains at least one compound having a molar absorption coefficient of at least about 50 L·mol −1 ·cm −1 within the wavelength range of about 240 to 800 nm (preferably 330 to 500 nm). It is preferable. The molar extinction coefficient of a compound can be measured using a known method. For example, it is preferable to measure at a concentration of 0.01 g/L using an ethyl acetate solvent with an ultraviolet-visible spectrophotometer (Cary-5 spectrophotometer manufactured by Varian).
　光ラジカル重合開始剤としては、公知の化合物を任意に使用できる。例えば、ハロゲン化炭化水素誘導体（例えば、トリアジン骨格を有する化合物、オキサジアゾール骨格を有する化合物、トリハロメチル基を有する化合物など）、アシルホスフィンオキサイド等のアシルホスフィン化合物、ヘキサアリールビイミダゾール、オキシム誘導体等のオキシム化合物、有機過酸化物、チオ化合物、ケトン化合物、芳香族オニウム塩、ケトオキシムエーテル、アミノアセトフェノンなどのα－アミノケトン化合物、ヒドロキシアセトフェノンなどのα－ヒドロキシケトン化合物、アゾ系化合物、アジド化合物、メタロセン化合物、有機ホウ素化合物、鉄アレーン錯体などが挙げられる。これらの詳細については、特開２０１６－０２７３５７号公報の段落０１６５～０１８２、国際公開第２０１５／１９９２１９号の段落０１３８～０１５１の記載を参酌でき、この内容は本明細書に組み込まれる。また、特開２０１４－１３０１７３号公報の段落００６５～０１１１、特許第６３０１４８９号公報に記載された化合物、ＭＡＴＥＲＩＡＬ　ＳＴＡＧＥ　３７～６０ｐ，ｖｏｌ．１９，Ｎｏ．３，２０１９に記載されたパーオキサイド系光重合開始剤、国際公開第２０１８／２２１１７７号に記載の光重合開始剤、国際公開第２０１８／１１０１７９号に記載の光重合開始剤、特開２０１９－０４３８６４号公報に記載の光重合開始剤、特開２０１９－０４４０３０号公報に記載の光重合開始剤、特開２０１９－１６７３１３号公報に記載の過酸化物系開始剤が挙げられ、これらの内容は本明細書に組み込まれる。 As the photoradical polymerization initiator, any known compound can be used. For example, halogenated hydrocarbon derivatives (e.g., compounds having a triazine skeleton, compounds having an oxadiazole skeleton, compounds having a trihalomethyl group, etc.), acylphosphine compounds such as acylphosphine oxide, hexaarylbiimidazole, oxime derivatives, etc. oxime compounds, organic peroxides, thio compounds, ketone compounds, aromatic onium salts, ketooxime ethers, α-aminoketone compounds such as aminoacetophenone, α-hydroxyketone compounds such as hydroxyacetophenone, azo compounds, azide compounds, Examples include metallocene compounds, organic boron compounds, iron arene complexes, and the like. For these details, the descriptions in paragraphs 0165 to 0182 of Japanese Patent Application Publication No. 2016-027357 and paragraphs 0138 to 0151 of International Publication No. 2015/199219 can be referred to, and the contents thereof are incorporated herein. In addition, compounds described in paragraphs 0065 to 0111 of JP 2014-130173, Japanese Patent No. 6301489, MATERIAL STAGE 37 to 60p, vol. 19, No. 3,2019, the photopolymerization initiator described in International Publication No. 2018/221177, the photopolymerization initiator described in International Publication No. 2018/110179, JP 2019-043864 The photopolymerization initiators described in JP-A No. 2019-044030, the peroxide-based initiators described in JP-A No. 2019-167313, and the contents of these are Incorporated into the specification.
　ケトン化合物としては、例えば、特開２０１５－０８７６１１号公報の段落００８７に記載の化合物が例示され、この内容は本明細書に組み込まれる。市販品では、カヤキュア－ＤＥＴＸ－Ｓ（日本化薬（株）製）も好適に用いられる。 Examples of the ketone compound include compounds described in paragraph 0087 of JP-A-2015-087611, the contents of which are incorporated herein. As a commercially available product, Kayacure-DETX-S (manufactured by Nippon Kayaku Co., Ltd.) is also suitably used.
　本発明の一実施態様において、光ラジカル重合開始剤としては、ヒドロキシアセトフェノン化合物、アミノアセトフェノン化合物、及び、アシルホスフィン化合物を好適に用いることができる。より具体的には、例えば、特開平１０－２９１９６９号公報に記載のアミノアセトフェノン系開始剤、特許第４２２５８９８号に記載のアシルホスフィンオキシド系開始剤を用いることができ、この内容は本明細書に組み込まれる。また、アシルホスフィンオキシドとして、２，４，６－トリメチルベンゾイルジフェニルホスフィンオキシドなども好適に用いることができる。また、アシルホスフィンオキシド系開始剤の市販品として、Ｏｍｎｉｒａｄ　ＴＰＯ　Ｈ等が挙げられる。 In one embodiment of the present invention, a hydroxyacetophenone compound, an aminoacetophenone compound, and an acylphosphine compound can be suitably used as the photoradical polymerization initiator. More specifically, for example, the aminoacetophenone-based initiator described in JP-A-10-291969 and the acylphosphine oxide-based initiator described in Japanese Patent No. 4225898 can be used, the content of which is herein incorporated by reference. Incorporated. Furthermore, 2,4,6-trimethylbenzoyldiphenylphosphine oxide and the like can also be suitably used as the acylphosphine oxide. Further, as a commercially available acylphosphine oxide initiator, Omnirad TPO H and the like can be mentioned.
　α－ヒドロキシケトン系開始剤としては、Ｏｍｎｉｒａｄ　１８４、Ｏｍｎｉｒａｄ　１１７３、Ｏｍｎｉｒａｄ　２９５９、Ｏｍｎｉｒａｄ　１２７（以上、ＩＧＭ　Ｒｅｓｉｎｓ　Ｂ．Ｖ．社製）、ＩＲＧＡＣＵＲＥ　１８４（ＩＲＧＡＣＵＲＥは登録商標）、ＤＡＲＯＣＵＲ　１１７３、ＩＲＧＡＣＵＲＥ　５００、ＩＲＧＡＣＵＲＥ－２９５９、ＩＲＧＡＣＵＲＥ　１２７（以上、ＢＡＳＦ社製）を用いることができる。 Examples of α-hydroxyketone initiators include Omnirad 184, Omnirad 1173, Omnirad 2959, Omnirad 127 (manufactured by IGM Resins B.V.), IRGACURE 184 (IRGACURE is a registered trademark), DAROCUR 1173, IRGACURE 500, IRGACURE -2959 and IRGACURE 127 (manufactured by BASF) can be used.
　α－アミノケトン系開始剤としては、Ｏｍｎｉｒａｄ　９０７、Ｏｍｎｉｒａｄ　３６９、Ｏｍｎｉｒａｄ　３６９Ｅ、Ｏｍｎｉｒａｄ　３７９ＥＧ（以上、ＩＧＭ　Ｒｅｓｉｎｓ　Ｂ．Ｖ．社製）、ＩＲＧＡＣＵＲＥ　９０７、ＩＲＧＡＣＵＲＥ　３６９、及び、ＩＲＧＡＣＵＲＥ　３７９（以上、ＢＡＳＦ社製）を用いることができる。 Examples of α-aminoketone initiators include Omnirad 907, Omnirad 369, Omnirad 369E, Omnirad 379EG (manufactured by IGM Resins B.V.), IRGACURE 907, and IRGACURE 3. 69, and IRGACURE 379 (manufactured by BASF) can be used.
　アミノアセトフェノン系開始剤、アシルホスフィンオキシド系開始剤、メタロセン化合物としては、例えば、国際公開第２０２１／１１２１８９号の段落０１６１～０１６３に記載の化合物も好適に使用することができる。この内容は本明細書に組み込まれる。 As the aminoacetophenone initiator, the acylphosphine oxide initiator, and the metallocene compound, for example, the compounds described in paragraphs 0161 to 0163 of International Publication No. 2021/112189 can also be suitably used. This content is incorporated herein.
　光ラジカル重合開始剤として、より好ましくはオキシム化合物が挙げられる。オキシム化合物を用いることにより、露光ラチチュードをより効果的に向上させることが可能になる。オキシム化合物は、露光ラチチュード（露光マージン）が広く、かつ、光硬化促進剤としても働くため、特に好ましい。 More preferred examples of the photoradical polymerization initiator include oxime compounds. By using an oxime compound, it becomes possible to improve exposure latitude more effectively. Oxime compounds are particularly preferred because they have a wide exposure latitude (exposure margin) and also act as photocuring accelerators.
　オキシム化合物の具体例としては、特開２００１－２３３８４２号公報に記載の化合物、特開２０００－０８００６８号公報に記載の化合物、特開２００６－３４２１６６号公報に記載の化合物、Ｊ．Ｃ．Ｓ．Ｐｅｒｋｉｎ　ＩＩ（１９７９年、ｐｐ．１６５３－１６６０）に記載の化合物、Ｊ．Ｃ．Ｓ．Ｐｅｒｋｉｎ　ＩＩ（１９７９年、ｐｐ．１５６－１６２）に記載の化合物、Ｊｏｕｒｎａｌ　ｏｆ　Ｐｈｏｔｏｐｏｌｙｍｅｒ　Ｓｃｉｅｎｃｅ　ａｎｄ　Ｔｅｃｈｎｏｌｏｇｙ（１９９５年、ｐｐ．２０２－２３２）に記載の化合物、特開２０００－０６６３８５号公報に記載の化合物、特表２００４－５３４７９７号公報に記載の化合物、特開２０１７－０１９７６６号公報に記載の化合物、特許第６０６５５９６号公報に記載の化合物、国際公開第２０１５／１５２１５３号に記載の化合物、国際公開第２０１７／０５１６８０号に記載の化合物、特開２０１７－１９８８６５号公報に記載の化合物、国際公開第２０１７／１６４１２７号の段落番号００２５～００３８に記載の化合物、国際公開第２０１３／１６７５１５号に記載の化合物などが挙げられ、この内容は本明細書に組み込まれる。 Specific examples of oxime compounds include compounds described in JP-A-2001-233842, compounds described in JP-A 2000-080068, compounds described in JP-A 2006-342166, J. C. S. Perkin II (1979, pp. 1653-1660); C. S. Perkin II (1979, pp. 156-162), Journal of Photopolymer Science and Technology (1995, pp. 202-232), JP-A-2000 - Compounds described in Publication No. 066385, Compounds described in Japanese Patent Publication No. 2004-534797, compounds described in Japanese Patent Application Publication No. 2017-019766, compounds described in Patent No. 6065596, compounds described in International Publication No. 2015/152153, International Publication No. 2017 /051680, compounds described in JP 2017-198865, compounds described in paragraph numbers 0025 to 0038 of International Publication No. 2017/164127, compounds described in International Publication No. 2013/167515, etc. , the contents of which are incorporated herein.
　好ましいオキシム化合物としては、例えば、下記の構造の化合物や、３－（ベンゾイルオキシ（イミノ））ブタン－２－オン、３－（アセトキシ（イミノ））ブタン－２－オン、３－（プロピオニルオキシ（イミノ））ブタン－２－オン、２－（アセトキシ（イミノ））ペンタン－３－オン、２－（アセトキシ（イミノ））－１－フェニルプロパン－１－オン、２－（ベンゾイルオキシ（イミノ））－１－フェニルプロパン－１－オン、３－（（４－トルエンスルホニルオキシ）イミノ）ブタン－２－オン、２－（エトキシカルボニルオキシ（イミノ））－１－フェニルプロパン－１－オン、５－（４－イソプロピルフェニルチオ）－１，２－インダンジオン，２－（Ｏ－アセチル）オキシムなどが挙げられる。樹脂組成物においては、特に光ラジカル重合開始剤としてオキシム化合物を用いることが好ましい。光ラジカル重合開始剤としてのオキシム化合物は、分子内に＞Ｃ＝Ｎ－Ｏ－Ｃ（＝Ｏ）－の連結基を有する。 Preferred oxime compounds include, for example, compounds with the following structures, 3-(benzoyloxy(imino))butan-2-one, 3-(acetoxy(imino))butan-2-one, 3-(propionyloxy( imino))butan-2-one, 2-(acetoxy(imino))pentan-3-one, 2-(acetoxy(imino))-1-phenylpropan-1-one, 2-(benzoyloxy(imino)) -1-phenylpropan-1-one, 3-((4-toluenesulfonyloxy)imino)butan-2-one, 2-(ethoxycarbonyloxy(imino))-1-phenylpropan-1-one, 5- Examples include (4-isopropylphenylthio)-1,2-indanedione and 2-(O-acetyl)oxime. In the resin composition, it is particularly preferable to use an oxime compound as a photoradical polymerization initiator. The oxime compound used as a photoradical polymerization initiator has a >C=N-O-C(=O)- linking group in the molecule.
　オキシム化合物の市販品としては、ＩＲＧＡＣＵＲＥ　ＯＸＥ　０１、ＩＲＧＡＣＵＲＥ　ＯＸＥ　０２、ＩＲＧＡＣＵＲＥ　ＯＸＥ　０３、ＩＲＧＡＣＵＲＥ　ＯＸＥ　０４（以上、ＢＡＳＦ社製）、Ｏｍｎｉｒａｄ　１３１２（ＩＧＭ　Ｒｅｓｉｎｓ　Ｂ．Ｖ．社製）、アデカオプトマーＮ－１９１９（（株）ＡＤＥＫＡ製、特開２０１２－０１４０５２号公報に記載の光ラジカル重合開始剤２）、ＴＲ－ＰＢＧ－３０４、ＴＲ－ＰＢＧ－３０５（常州強力電子新材料有限公司製）、アデカアークルズＮＣＩ－７３０、ＮＣＩ－８３１及びアデカアークルズＮＣＩ－９３０（（株）ＡＤＥＫＡ製）、ＤＦＩ－０９１（ダイトーケミックス（株）製）、ＳｐｅｅｄＣｕｒｅ　ＰＤＯ（ＳＡＲＴＯＭＥＲ　ＡＲＫＥＭＡ製）が挙げられる。また、下記の構造のオキシム化合物を用いることもできる。
Commercially available oxime compounds include IRGACURE OXE 01, IRGACURE OXE 02, IRGACURE OXE 03, IRGACURE OXE 04 (manufactured by BASF), Omnirad 1312 (manufactured by IGM Resins B.V.), and Adeka Optomer N- 1919 (manufactured by ADEKA Co., Ltd., photoradical polymerization initiator 2 described in JP-A-2012-014052), TR-PBG-304, TR-PBG-305 (manufactured by Changzhou Strong Electronics New Materials Co., Ltd.), ADEKA Arcles Examples include NCI-730, NCI-831, ADEKA Arkles NCI-930 (manufactured by ADEKA Co., Ltd.), DFI-091 (manufactured by Daito Chemix Co., Ltd.), and SpeedCure PDO (manufactured by SARTOMER ARKEMA). Moreover, oxime compounds having the following structures can also be used.
　光ラジカル重合開始剤としては、例えば、国際公開第２０２１／１１２１８９号の段落０１６９～０１７１に記載のフルオレン環を有するオキシム化合物、カルバゾール環の少なくとも１つのベンゼン環がナフタレン環となった骨格を有するオキシム化合物、フッ素原子を有するオキシム化合物を用いることもできる。
　また、国際公開第２０２１／０２０３５９号の段落０２０８～０２１０に記載のニトロ基を有するオキシム化合物、ベンゾフラン骨格を有するオキシム化合物、カルバゾール骨格にヒドロキシ基を有する置換基が結合したオキシム化合物を用いることもできる。これらの内容は本明細書に組み込まれる。 Examples of the photoradical polymerization initiator include oxime compounds having a fluorene ring described in paragraphs 0169 to 0171 of International Publication No. 2021/112189, and oximes having a skeleton in which at least one benzene ring of a carbazole ring is a naphthalene ring. Compounds, oxime compounds having a fluorine atom can also be used.
In addition, oxime compounds having a nitro group, oxime compounds having a benzofuran skeleton, and oxime compounds having a substituent having a hydroxy group bonded to a carbazole skeleton described in paragraphs 0208 to 0210 of International Publication No. 2021/020359 can also be used. . Their contents are incorporated herein.
　光重合開始剤としては、芳香族環に電子求引性基が導入された芳香族環基ＡｒＯＸ１を有するオキシム化合物（以下、オキシム化合物ＯＸともいう）を用いることもできる。上記芳香族環基ＡｒＯＸ１が有する電子求引性基としては、アシル基、ニトロ基、トリフルオロメチル基、アルキルスルフィニル基、アリールスルフィニル基、アルキルスルホニル基、アリールスルホニル基、シアノ基が挙げられ、アシル基およびニトロ基が好ましく、耐光性に優れた膜を形成しやすいという理由からアシル基であることがより好ましく、ベンゾイル基であることが更に好ましい。ベンゾイル基は、置換基を有していてもよい。置換基としては、ハロゲン原子、シアノ基、ニトロ基、ヒドロキシ基、アルキル基、アルコキシ基、アリール基、アリールオキシ基、複素環基、複素環オキシ基、アルケニル基、アルキルスルファニル基、アリールスルファニル基、アシル基またはアミノ基であることが好ましく、アルキル基、アルコキシ基、アリール基、アリールオキシ基、複素環オキシ基、アルキルスルファニル基、アリールスルファニル基またはアミノ基であることがより好ましく、アルコキシ基、アルキルスルファニル基またはアミノ基であることが更に好ましい。 As the photopolymerization initiator, it is also possible to use an oxime compound having an aromatic ring group Ar OX1 (hereinafter also referred to as oxime compound OX) in which an electron-withdrawing group is introduced into the aromatic ring. Examples of the electron-withdrawing group possessed by the aromatic ring group Ar OX1 include an acyl group, a nitro group, a trifluoromethyl group, an alkylsulfinyl group, an arylsulfinyl group, an alkylsulfonyl group, an arylsulfonyl group, and a cyano group, An acyl group and a nitro group are preferred, an acyl group is more preferred because a film with excellent light resistance can be easily formed, and a benzoyl group is even more preferred. The benzoyl group may have a substituent. Examples of substituents include halogen atoms, cyano groups, nitro groups, hydroxy groups, alkyl groups, alkoxy groups, aryl groups, aryloxy groups, heterocyclic groups, heterocyclic oxy groups, alkenyl groups, alkylsulfanyl groups, arylsulfanyl groups, It is preferably an acyl group or an amino group, and more preferably an alkyl group, an alkoxy group, an aryl group, an aryloxy group, a heterocyclicoxy group, an alkylsulfanyl group, an arylsulfanyl group, or an amino group. More preferably, it is a sulfanyl group or an amino group.
　オキシム化合物ＯＸは、式（ＯＸ１）で表される化合物および式（ＯＸ２）で表される化合物から選ばれる少なくとも１種であることが好ましく、式（ＯＸ２）で表される化合物であることがより好ましい。

　式中、ＲＸ１は、アルキル基、アルケニル基、アルコキシ基、アリール基、アリールオキシ基、複素環基、複素環オキシ基、アルキルスルファニル基、アリールスルファニル基、アルキルスルフィニル基、アリールスルフィニル基、アルキルスルホニル基、アリールスルホニル基、アシル基、アシルオキシ基、アミノ基、ホスフィノイル基、カルバモイル基またはスルファモイル基を表し、
　ＲＸ２は、アルキル基、アルケニル基、アルコキシ基、アリール基、アリールオキシ基、複素環基、複素環オキシ基、アルキルスルファニル基、アリールスルファニル基、アルキルスルフィニル基、アリールスルフィニル基、アルキルスルホニル基、アリールスルホニル基、アシルオキシ基またはアミノ基を表し、
　ＲＸ３～ＲＸ１４は、それぞれ独立して水素原子または置換基を表す。
　ただし、ＲＸ１０～ＲＸ１４のうち少なくとも一つは、電子求引性基である。 The oxime compound OX is preferably at least one selected from a compound represented by formula (OX1) and a compound represented by formula (OX2), and more preferably a compound represented by formula (OX2). preferable.

In the formula, R group, arylsulfonyl group, acyl group, acyloxy group, amino group, phosphinoyl group, carbamoyl group or sulfamoyl group,
R Represents a sulfonyl group, acyloxy group or amino group,
R X3 to R X14 each independently represent a hydrogen atom or a substituent.
However, at least one of R X10 to R X14 is an electron-withdrawing group.
　上記式において、ＲＸ１２が電子求引性基であり、ＲＸ１０、ＲＸ１１、ＲＸ１３、ＲＸ１４は水素原子であることが好ましい。 In the above formula, R X12 is preferably an electron-withdrawing group, and R X10 , R X11 , R X13 , and R X14 are preferably hydrogen atoms.
　オキシム化合物ＯＸの具体例としては、特許第４６００６００号公報の段落番号００８３～０１０５に記載の化合物が挙げられ、この内容は本明細書に組み込まれる。 Specific examples of the oxime compound OX include compounds described in paragraph numbers 0083 to 0105 of Japanese Patent No. 4,600,600, the contents of which are incorporated herein.
　特に好ましいオキシム化合物としては、特開２００７－２６９７７９号公報に示される特定置換基を有するオキシム化合物や、特開２００９－１９１０６１号公報に示されるチオアリール基を有するオキシム化合物などが挙げられ、この内容は本明細書に組み込まれる。 Particularly preferable oxime compounds include oxime compounds having a specific substituent group as shown in JP-A No. 2007-269779, and oxime compounds having a thioaryl group as shown in JP-A No. 2009-191061. Incorporated herein.
　光ラジカル重合開始剤は、露光感度の観点から、トリハロメチルトリアジン化合物、ベンジルジメチルケタール化合物、α－ヒドロキシケトン化合物、α－アミノケトン化合物、アシルホスフィン化合物、ホスフィンオキサイド化合物、メタロセン化合物、オキシム化合物、トリアリールイミダゾールダイマー、オニウム塩化合物、ベンゾチアゾール化合物、ベンゾフェノン化合物、アセトフェノン化合物及びその誘導体、シクロペンタジエン－ベンゼン－鉄錯体及びその塩、ハロメチルオキサジアゾール化合物、３－アリール置換クマリン化合物からなる群より選択される化合物が好ましい。 From the viewpoint of exposure sensitivity, photoradical polymerization initiators include trihalomethyltriazine compounds, benzyl dimethyl ketal compounds, α-hydroxyketone compounds, α-aminoketone compounds, acylphosphine compounds, phosphine oxide compounds, metallocene compounds, oxime compounds, and triaryl compounds. selected from the group consisting of imidazole dimers, onium salt compounds, benzothiazole compounds, benzophenone compounds, acetophenone compounds and derivatives thereof, cyclopentadiene-benzene-iron complexes and salts thereof, halomethyloxadiazole compounds, and 3-aryl substituted coumarin compounds. Compounds such as
　また、光ラジカル重合開始剤は、トリハロメチルトリアジン化合物、α－アミノケトン化合物、アシルホスフィン化合物、ホスフィンオキサイド化合物、メタロセン化合物、オキシム化合物、トリアリールイミダゾールダイマー、オニウム塩化合物、ベンゾフェノン化合物、アセトフェノン化合物であり、トリハロメチルトリアジン化合物、α－アミノケトン化合物、メタロセン化合物、オキシム化合物、トリアリールイミダゾールダイマー、ベンゾフェノン化合物からなる群より選ばれる少なくとも１種の化合物がより好ましく、メタロセン化合物又はオキシム化合物が更に好ましい。 Further, the photoradical polymerization initiator is a trihalomethyltriazine compound, an α-aminoketone compound, an acylphosphine compound, a phosphine oxide compound, a metallocene compound, an oxime compound, a triarylimidazole dimer, an onium salt compound, a benzophenone compound, an acetophenone compound, At least one compound selected from the group consisting of trihalomethyltriazine compounds, α-aminoketone compounds, metallocene compounds, oxime compounds, triarylimidazole dimers, and benzophenone compounds is more preferred, and metallocene compounds or oxime compounds are even more preferred.
　光ラジカル重合開始剤としては、国際公開第２０２１／０２０３５９号に記載の段落０１７５～０１７９に記載の化合物、国際公開第２０１５／１２５４６９号の段落００４８～００５５に記載の化合物を用いることもでき、この内容は本明細書に組み込まれる。 As the photoradical polymerization initiator, compounds described in paragraphs 0175 to 0179 of WO 2021/020359 and compounds described in paragraphs 0048 to 0055 of WO 2015/125469 can also be used; The contents are incorporated herein.
　光ラジカル重合開始剤としては、２官能あるいは３官能以上の光ラジカル重合開始剤を用いてもよい。そのような光ラジカル重合開始剤を用いることにより、光ラジカル重合開始剤の１分子から２つ以上のラジカルが発生するため、良好な感度が得られる。また、非対称構造の化合物を用いた場合においては、結晶性が低下して溶剤などへの溶解性が向上して、経時で析出しにくくなり、樹脂組成物の経時安定性を向上させることができる。２官能あるいは３官能以上の光ラジカル重合開始剤の具体例としては、特表２０１０－５２７３３９号公報、特表２０１１－５２４４３６号公報、国際公開第２０１５／００４５６５号、特表２０１６－５３２６７５号公報の段落番号０４０７～０４１２、国際公開第２０１７／０３３６８０号の段落番号００３９～００５５に記載されているオキシム化合物の２量体、特表２０１３－５２２４４５号公報に記載されている化合物（Ｅ）および化合物（Ｇ）、国際公開第２０１６／０３４９６３号に記載されているＣｍｐｄ１～７、特表２０１７－５２３４６５号公報の段落番号０００７に記載されているオキシムエステル類光開始剤、特開２０１７－１６７３９９号公報の段落番号００２０～００３３に記載されている光開始剤、特開２０１７－１５１３４２号公報の段落番号００１７～００２６に記載されている光重合開始剤（Ａ）、特許第６４６９６６９号公報に記載されているオキシムエステル光開始剤などが挙げられ、この内容は本明細書に組み込まれる。 As the photoradical polymerization initiator, a difunctional, trifunctional or more functional photoradical polymerization initiator may be used. By using such a radical photopolymerization initiator, two or more radicals are generated from one molecule of the radical photopolymerization initiator, so that good sensitivity can be obtained. In addition, when a compound with an asymmetric structure is used, the crystallinity decreases and the solubility in solvents improves, making it difficult to precipitate over time, thereby improving the stability of the resin composition over time. . Specific examples of bifunctional or trifunctional or more functional photoradical polymerization initiators include those listed in Japanese Patent Publication No. 2010-527339, Japanese Patent Publication No. 2011-524436, International Publication No. 2015/004565, and Japanese Patent Application Publication No. 2016-532675. Dimers of oxime compounds described in paragraph numbers 0407 to 0412, paragraph numbers 0039 to 0055 of International Publication No. 2017/033680, compound (E) and compound ( G), Cmpd1 to 7 described in International Publication No. 2016/034963, oxime ester photoinitiators described in paragraph number 0007 of Japanese Patent Publication No. 2017-523465, Photoinitiators described in paragraph numbers 0020 to 0033, photoinitiators (A) described in paragraph numbers 0017 to 0026 of JP2017-151342A, and photoinitiators (A) described in Japanese Patent No. 6469669. Oxime ester photoinitiators and the like, the contents of which are incorporated herein.
　樹脂組成物が光重合開始剤を含む場合、その含有量は、樹脂組成物の全固形分に対し０．１～３０質量％が好ましく、０．１～２０質量％がより好ましく、０．５～１５質量％が更に好ましく、１．０～１０質量％が更により好ましい。光重合開始剤は１種のみ含有していてもよいし、２種以上含有していてもよい。光重合開始剤を２種以上含有する場合は、合計量が上記範囲であることが好ましい。
　なお、光重合開始剤は熱重合開始剤としても機能する場合があるため、オーブンやホットプレート等の加熱によって光重合開始剤による架橋を更に進行させられる場合がある。 When the resin composition contains a photopolymerization initiator, its content is preferably 0.1 to 30% by mass, more preferably 0.1 to 20% by mass, and 0.5% by mass based on the total solid content of the resin composition. It is more preferably from 1.0 to 10% by weight, and even more preferably from 1.0 to 10% by weight. The photopolymerization initiator may contain only one type, or may contain two or more types. When containing two or more types of photopolymerization initiators, it is preferable that the total amount is within the above range.
Note that since the photopolymerization initiator may also function as a thermal polymerization initiator, crosslinking by the photopolymerization initiator may be further promoted by heating with an oven, a hot plate, or the like.
〔増感剤〕
　樹脂組成物は、増感剤を含んでいてもよい。増感剤は、特定の活性放射線を吸収して電子励起状態となる。電子励起状態となった増感剤は、熱ラジカル重合開始剤、光ラジカル重合開始剤などと接触して、電子移動、エネルギー移動、発熱などの作用が生じる。これにより、熱ラジカル重合開始剤、光ラジカル重合開始剤は化学変化を起こして分解し、ラジカル、酸又は塩基を生成する。
　使用可能な増感剤として、ベンゾフェノン系、ミヒラーズケトン系、クマリン系、ピラゾールアゾ系、アニリノアゾ系、トリフェニルメタン系、アントラキノン系、アントラセン系、アントラピリドン系、ベンジリデン系、オキソノール系、ピラゾロトリアゾールアゾ系、ピリドンアゾ系、シアニン系、フェノチアジン系、ピロロピラゾールアゾメチン系、キサンテン系、フタロシアニン系、ベンゾピラン系、インジゴ系等の化合物を使用することができる。
　増感剤としては、例えば、ミヒラーズケトン、４，４’－ビス（ジエチルアミノ）ベンゾフェノン、２，５－ビス（４’－ジエチルアミノベンザル）シクロペンタン、２，６－ビス（４’－ジエチルアミノベンザル）シクロヘキサノン、２，６－ビス（４’－ジエチルアミノベンザル）－４－メチルシクロヘキサノン、４，４’－ビス（ジメチルアミノ）カルコン、４，４’－ビス（ジエチルアミノ）カルコン、ｐ－ジメチルアミノシンナミリデンインダノン、ｐ－ジメチルアミノベンジリデンインダノン、２－（ｐ－ジメチルアミノフェニルビフェニレン）－ベンゾチアゾール、２－（ｐ－ジメチルアミノフェニルビニレン）ベンゾチアゾール、２－（ｐ－ジメチルアミノフェニルビニレン）イソナフトチアゾール、１，３－ビス（４’－ジメチルアミノベンザル）アセトン、１，３－ビス（４’－ジエチルアミノベンザル）アセトン、３，３’－カルボニル－ビス（７－ジエチルアミノクマリン）、３－アセチル－７－ジメチルアミノクマリン、３－エトキシカルボニル－７－ジメチルアミノクマリン、３－ベンジロキシカルボニル－７－ジメチルアミノクマリン、３－メトキシカルボニル－７－ジエチルアミノクマリン、３－エトキシカルボニル－７－ジエチルアミノクマリン（７－（ジエチルアミノ）クマリン－３－カルボン酸エチル）、Ｎ－フェニル－Ｎ’－エチルエタノールアミン、Ｎ－フェニルジエタノールアミン、Ｎ－ｐ－トリルジエタノールアミン、Ｎ－フェニルエタノールアミン、４－モルホリノベンゾフェノン、ジメチルアミノ安息香酸イソアミル、ジエチルアミノ安息香酸イソアミル、２－メルカプトベンズイミダゾール、１－フェニル－５－メルカプトテトラゾール、２－メルカプトベンゾチアゾール、２－（ｐ－ジメチルアミノスチリル）ベンズオキサゾール、２－（ｐ－ジメチルアミノスチリル）ベンゾチアゾール、２－（ｐ－ジメチルアミノスチリル）ナフト（１，２－ｄ）チアゾール、２－（ｐ－ジメチルアミノベンゾイル）スチレン、ジフェニルアセトアミド、ベンズアニリド、Ｎ－メチルアセトアニリド、３‘，４’－ジメチルアセトアニリド等が挙げられる。
　また、他の増感色素を用いてもよい。
　増感色素の詳細については、特開２０１６－０２７３５７号公報の段落０１６１～０１６３の記載を参酌でき、この内容は本明細書に組み込まれる。 [Sensitizer]
The resin composition may contain a sensitizer. The sensitizer absorbs specific actinic radiation and becomes electronically excited. The sensitizer in an electronically excited state comes into contact with a thermal radical polymerization initiator, a photoradical polymerization initiator, etc., and effects such as electron transfer, energy transfer, and heat generation occur. As a result, the thermal radical polymerization initiator and the photo radical polymerization initiator undergo a chemical change and are decomposed to generate radicals, acids, or bases.
Usable sensitizers include benzophenone series, Michler's ketone series, coumarin series, pyrazole azo series, anilinoazo series, triphenylmethane series, anthraquinone series, anthracene series, anthrapyridone series, benzylidene series, oxonol series, and pyrazolotriazole azo series. , pyridone azo type, cyanine type, phenothiazine type, pyrrolopyrazole azomethine type, xanthene type, phthalocyanine type, benzopyran type, indigo type, and other compounds can be used.
Examples of the sensitizer include Michler's ketone, 4,4'-bis(diethylamino)benzophenone, 2,5-bis(4'-diethylaminobenzal)cyclopentane, 2,6-bis(4'-diethylaminobenzal) Cyclohexanone, 2,6-bis(4'-diethylaminobenzal)-4-methylcyclohexanone, 4,4'-bis(dimethylamino)chalcone, 4,4'-bis(diethylamino)chalcone, p-dimethylaminocinnamyl Denindanone, p-dimethylaminobenzylideneindanone, 2-(p-dimethylaminophenylbiphenylene)-benzothiazole, 2-(p-dimethylaminophenylvinylene)benzothiazole, 2-(p-dimethylaminophenylvinylene)iso Naphthothiazole, 1,3-bis(4'-dimethylaminobenzal)acetone, 1,3-bis(4'-diethylaminobenzal)acetone, 3,3'-carbonyl-bis(7-diethylaminocoumarin), 3 -Acetyl-7-dimethylaminocoumarin, 3-ethoxycarbonyl-7-dimethylaminocoumarin, 3-benzyloxycarbonyl-7-dimethylaminocoumarin, 3-methoxycarbonyl-7-diethylaminocoumarin, 3-ethoxycarbonyl-7-diethylaminocoumarin Coumarin (ethyl 7-(diethylamino)coumarin-3-carboxylate), N-phenyl-N'-ethylethanolamine, N-phenyldiethanolamine, N-p-tolyldiethanolamine, N-phenylethanolamine, 4-morpholinobenzophenone, Isoamyl dimethylaminobenzoate, isoamyl diethylaminobenzoate, 2-mercaptobenzimidazole, 1-phenyl-5-mercaptotetrazole, 2-mercaptobenzothiazole, 2-(p-dimethylaminostyryl)benzoxazole, 2-(p-dimethyl) aminostyryl)benzothiazole, 2-(p-dimethylaminostyryl)naphtho(1,2-d)thiazole, 2-(p-dimethylaminobenzoyl)styrene, diphenylacetamide, benzanilide, N-methylacetanilide, 3',4 '-dimethylacetanilide and the like.
Also, other sensitizing dyes may be used.
For details of the sensitizing dye, the descriptions in paragraphs 0161 to 0163 of JP 2016-027357A can be referred to, and the contents thereof are incorporated herein.
　樹脂組成物が増感剤を含む場合、増感剤の含有量は、樹脂組成物の全固形分に対し、０．０１～２０質量％が好ましく、０．１～１５質量％がより好ましく、０．５～１０質量％が更に好ましい。増感剤は、１種単独で用いてもよいし、２種以上を併用してもよい。 When the resin composition contains a sensitizer, the content of the sensitizer is preferably 0.01 to 20% by mass, more preferably 0.1 to 15% by mass, based on the total solid content of the resin composition. More preferably 0.5 to 10% by mass. The sensitizers may be used alone or in combination of two or more.
〔連鎖移動剤〕
　本発明の樹脂組成物は、連鎖移動剤を含有してもよい。連鎖移動剤は、例えば高分子辞典第三版（高分子学会編、２００５年）６８３－６８４頁に定義されている。連鎖移動剤としては、例えば、分子内に－Ｓ－Ｓ－、－ＳＯ２－Ｓ－、－Ｎ－Ｏ－、ＳＨ、ＰＨ、ＳｉＨ、及びＧｅＨを有する化合物群、ＲＡＦＴ（Reversible Addition Fragmentation chain Transfer）重合に用いられるチオカルボニルチオ基を有するジチオベンゾアート、トリチオカルボナート、ジチオカルバマート、キサンタート化合物等が用いられる。これらは、低活性のラジカルに水素を供与して、ラジカルを生成するか、若しくは、酸化された後、脱プロトンすることによりラジカルを生成しうる。特に、チオール化合物を好ましく用いることができる。 [Chain transfer agent]
The resin composition of the present invention may contain a chain transfer agent. Chain transfer agents are defined, for example, in the Polymer Dictionary, 3rd edition (edited by the Society of Polymer Science, 2005), pages 683-684. Examples of chain transfer agents include compounds having -S-S-, -SO 2 -S-, -N-O-, SH, PH, SiH, and GeH in the molecule, and RAFT (Reversible Addition Fragmentation chain Transfer). ) Dithiobenzoate, trithiocarbonate, dithiocarbamate, xanthate compounds and the like having a thiocarbonylthio group used in polymerization are used. These can generate radicals by donating hydrogen to low-activity radicals, or can generate radicals by being oxidized and then deprotonated. In particular, thiol compounds can be preferably used.
　また、連鎖移動剤は、国際公開第２０１５／１９９２１９号の段落０１５２～０１５３に記載の化合物を用いることもでき、この内容は本明細書に組み込まれる。 Further, as the chain transfer agent, compounds described in paragraphs 0152 to 0153 of International Publication No. 2015/199219 can also be used, the contents of which are incorporated herein.
　樹脂組成物が連鎖移動剤を有する場合、連鎖移動剤の含有量は、樹脂組成物の全固形分１００質量部に対し、０．０１～２０質量部が好ましく、０．１～１０質量部がより好ましく、０．５～５質量部が更に好ましい。連鎖移動剤は１種のみでもよいし、２種以上であってもよい。連鎖移動剤が２種以上の場合は、その合計が上記範囲であることが好ましい。 When the resin composition has a chain transfer agent, the content of the chain transfer agent is preferably 0.01 to 20 parts by mass, and 0.1 to 10 parts by mass based on 100 parts by mass of the total solid content of the resin composition. More preferably, 0.5 to 5 parts by mass is even more preferred. The number of chain transfer agents may be one, or two or more. When there are two or more types of chain transfer agents, it is preferable that the total is within the above range.
＜塩基発生剤＞
　本発明の樹脂組成物は、塩基発生剤を含んでもよい。ここで、塩基発生剤とは、物理的または化学的な作用によって塩基を発生することができる化合物である。好ましい塩基発生剤としては、熱塩基発生剤および光塩基発生剤が挙げられる。
　樹脂組成物が熱塩基発生剤を含有することによって、例えば加熱により前駆体の環化反応を促進でき、硬化物の機械特性や耐薬品性が良好なものとなり、例えば半導体パッケージ中に含まれる再配線層用層間絶縁膜としての性能が良好となる。
　塩基発生剤としては、イオン型塩基発生剤でもよく、非イオン型塩基発生剤でもよい。塩基発生剤から発生する塩基としては、例えば、２級アミン、３級アミンが挙げられる。
　塩基発生剤は特に限定されず、公知の塩基発生剤を用いることができる。公知の塩基発生剤としては、例えば、カルバモイルオキシム化合物、カルバモイルヒドロキシルアミン化合物、カルバミン酸化合物、ホルムアミド化合物、アセトアミド化合物、カルバメート化合物、ベンジルカルバメート化合物、ニトロベンジルカルバメート化合物、スルホンアミド化合物、イミダゾール誘導体化合物、アミンイミド化合物、ピリジン誘導体化合物、α－アミノアセトフェノン誘導体化合物、４級アンモニウム塩誘導体化合物、イミニウム塩、ピリジニウム塩、α－ラクトン環誘導体化合物、アミンイミド化合物、フタルイミド誘導体化合物、アシルオキシイミノ化合物等が挙げられる。
　非イオン型塩基発生剤の具体的な化合物としては、式（Ｂ１）、式（Ｂ２）、又は式（Ｂ３）で表される化合物が挙げられる。
Figure JPOXMLDOC01-appb-C000043
 <Base generator>
The resin composition of the present invention may also contain a base generator. Here, the base generator is a compound that can generate a base by physical or chemical action. Preferred base generators include thermal base generators and photobase generators.
When the resin composition contains a thermal base generator, the cyclization reaction of the precursor can be promoted by heating, for example, and the cured product has good mechanical properties and chemical resistance. The performance as an interlayer insulating film for wiring layers is improved.
The base generator may be an ionic base generator or a nonionic base generator. Examples of the base generated from the base generator include secondary amines and tertiary amines.
The base generator is not particularly limited, and any known base generator can be used. Known base generators include, for example, carbamoyloxime compounds, carbamoylhydroxylamine compounds, carbamic acid compounds, formamide compounds, acetamide compounds, carbamate compounds, benzyl carbamate compounds, nitrobenzyl carbamate compounds, sulfonamide compounds, imidazole derivative compounds, and amine imides. compounds, pyridine derivative compounds, α-aminoacetophenone derivative compounds, quaternary ammonium salt derivative compounds, iminium salts, pyridinium salts, α-lactone ring derivative compounds, amine imide compounds, phthalimide derivative compounds, acyloxyimino compounds, and the like.
Specific examples of the nonionic base generator include compounds represented by formula (B1), formula (B2), or formula (B3).
Figure JPOXMLDOC01-appb-C000043
　式（Ｂ１）及び式（Ｂ２）中、Ｒｂ１、Ｒｂ２及びＲｂ３はそれぞれ独立に、第三級アミン構造を有しない有機基、ハロゲン原子又は水素原子を表す。ただし、Ｒｂ１及びＲｂ２が同時に水素原子となることはない。また、Ｒｂ１、Ｒｂ２及びＲｂ３はいずれもカルボキシ基を有することはない。なお、本明細書において第三級アミン構造とは、３価の窒素原子の３つの結合手がいずれも炭化水素基の炭素原子と共有結合している構造を指す。したがって、３価の窒素原子と結合した炭素原子が、カルボニル基を構成する炭素原子である場合、すなわち窒素原子とともにアミド基を形成する場合、第三級アミン構造ではない。 In formulas (B1) and (B2), Rb 1 , Rb 2 and Rb 3 each independently represent an organic group having no tertiary amine structure, a halogen atom or a hydrogen atom. However, Rb 1 and Rb 2 do not become hydrogen atoms at the same time. Moreover, none of Rb 1 , Rb 2 and Rb 3 has a carboxy group. In addition, in this specification, the tertiary amine structure refers to a structure in which all three bonds of a trivalent nitrogen atom are covalently bonded to a carbon atom of a hydrocarbon group. Therefore, when the carbon atom bonded to the trivalent nitrogen atom is a carbon atom constituting a carbonyl group, that is, when it forms an amide group with the nitrogen atom, it is not a tertiary amine structure.
　式（Ｂ１）及び式（Ｂ２）中、Ｒｂ１、Ｒｂ２及びＲｂ３は、これらのうち少なくとも１つが環状構造を含むことが好ましく、少なくとも２つが環状構造を含むことがより好ましい。環状構造としては、単環及び縮合環のいずれであってもよく、単環又は単環が２つ縮合した縮合環が好ましい。単環は、５員環又は６員環が好ましく、６員環がより好ましい。単環は、シクロヘキサン環及びベンゼン環が好ましく、シクロヘキサン環がより好ましい。 In formulas (B1) and (B2), at least one of Rb 1 , Rb 2 and Rb 3 preferably contains a cyclic structure, and more preferably at least two of them contain a cyclic structure. The cyclic structure may be either a single ring or a condensed ring, and preferably a monocycle or a condensed ring in which two monocycles are condensed. The monocyclic ring is preferably a 5-membered ring or a 6-membered ring, more preferably a 6-membered ring. The monocyclic ring is preferably a cyclohexane ring or a benzene ring, and more preferably a cyclohexane ring.
　より具体的にＲｂ１及びＲｂ２は、水素原子、アルキル基（炭素数１～２４が好ましく、２～１８がより好ましく、３～１２が更に好ましい）、アルケニル基（炭素数２～２４が好ましく、２～１８がより好ましく、３～１２が更に好ましい）、アリール基（炭素数６～２２が好ましく、６～１８がより好ましく、６～１０が更に好ましい）、又はアリールアルキル基（炭素数７～２５が好ましく、７～１９がより好ましく、７～１２が更に好ましい）であることが好ましい。これらの基は、置換基を有していてもよい。Ｒｂ１とＲｂ２とは互いに結合して環を形成していてもよい。形成される環としては、４～７員の含窒素複素環が好ましい。Ｒｂ１及びＲｂ２は、置換基を有してもよい直鎖、分岐、又は環状のアルキル基（炭素数１～２４が好ましく、２～１８がより好ましく、３～１２が更に好ましい）であることが好ましく、置換基を有してもよいシクロアルキル基（炭素数３～２４が好ましく、３～１８がより好ましく、３～１２が更に好ましい）であることがより好ましく、置換基を有してもよいシクロヘキシル基が更に好ましい。 More specifically, Rb 1 and Rb 2 are a hydrogen atom, an alkyl group (preferably 1 to 24 carbon atoms, more preferably 2 to 18 carbon atoms, even more preferably 3 to 12 carbon atoms), an alkenyl group (preferably 2 to 24 carbon atoms). , more preferably 2 to 18, still more preferably 3 to 12), an aryl group (preferably 6 to 22 carbon atoms, more preferably 6 to 18 carbon atoms, even more preferably 6 to 10 carbon atoms), or an arylalkyl group (carbon atoms 7 -25 is preferred, 7-19 is more preferred, and 7-12 is even more preferred). These groups may have a substituent. Rb 1 and Rb 2 may be bonded to each other to form a ring. The ring formed is preferably a 4- to 7-membered nitrogen-containing heterocycle. Rb 1 and Rb 2 are linear, branched, or cyclic alkyl groups (preferably 1 to 24 carbon atoms, more preferably 2 to 18 carbon atoms, still more preferably 3 to 12 carbon atoms) that may have a substituent. is preferable, and is more preferably a cycloalkyl group (having preferably 3 to 24 carbon atoms, more preferably 3 to 18 carbon atoms, and even more preferably 3 to 12 carbon atoms) which may have a substituent, and has a substituent. Further preferred is a cyclohexyl group which may be optionally substituted.
　Ｒｂ３としては、アルキル基（炭素数１～２４が好ましく、２～１８がより好ましく、３～１２が更に好ましい）、アリール基（炭素数６～２２が好ましく、６～１８がより好ましく、６～１０が更に好ましい）、アルケニル基（炭素数２～２４が好ましく、２～１２がより好ましく、２～６が更に好ましい）、アリールアルキル基（炭素数７～２３が好ましく、７～１９がより好ましく、７～１２が更に好ましい）、アリールアルケニル基（炭素数８～２４が好ましく、８～２０がより好ましく、８～１６が更に好ましい）、アルコキシル基（炭素数１～２４が好ましく、２～１８がより好ましく、３～１２が更に好ましい）、アリールオキシ基（炭素数６～２２が好ましく、６～１８がより好ましく、６～１２が更に好ましい）、又はアリールアルキルオキシ基（炭素数７～２３が好ましく、７～１９がより好ましく、７～１２が更に好ましい）が挙げられる。中でも、シクロアルキル基（炭素数３～２４が好ましく、３～１８がより好ましく、３～１２が更に好ましい）、アリールアルケニル基、アリールアルキルオキシ基が好ましい。Ｒｂ３は更に置換基を有していてもよい。 Rb 3 is an alkyl group (preferably 1 to 24 carbon atoms, more preferably 2 to 18 carbon atoms, even more preferably 3 to 12 carbon atoms), an aryl group (preferably 6 to 22 carbon atoms, more preferably 6 to 18 carbon atoms, 6 -10 are more preferred), alkenyl groups (preferably 2-24 carbon atoms, more preferably 2-12 carbon atoms, even more preferably 2-6 carbon atoms), arylalkyl groups (preferably 7-23 carbon atoms, more preferably 7-19 carbon atoms), (preferably 7 to 12 carbon atoms), arylalkenyl group (preferably 8 to 24 carbon atoms, more preferably 8 to 20 carbon atoms, even more preferably 8 to 16 carbon atoms), alkoxyl group (preferably 1 to 24 carbon atoms, 2 to 16 carbon atoms) 18 is more preferable, 3 to 12 are even more preferable), an aryloxy group (preferably 6 to 22 carbon atoms, more preferably 6 to 18 carbon atoms, even more preferably 6 to 12 carbon atoms), or an arylalkyloxy group (carbon atoms 7 to 23 is preferred, 7 to 19 are more preferred, and 7 to 12 are still more preferred). Among these, cycloalkyl groups (preferably having 3 to 24 carbon atoms, more preferably 3 to 18 carbon atoms, still more preferably 3 to 12 carbon atoms), arylalkenyl groups, and arylalkyloxy groups are preferable. Rb 3 may further have a substituent.
　式（Ｂ１）で表される化合物は、下記式（Ｂ１－１）又は下記式（Ｂ１－２）で表される化合物であることが好ましい。
Figure JPOXMLDOC01-appb-C000044
 The compound represented by formula (B1) is preferably a compound represented by formula (B1-1) or (B1-2) below.
Figure JPOXMLDOC01-appb-C000044
　式中、Ｒｂ１１及びＲｂ１２、並びに、Ｒｂ３１及びＲｂ３２は、それぞれ、式（Ｂ１）におけるＲｂ１及びＲｂ２と同じである。
　Ｒｂ１３はアルキル基（炭素数１～２４が好ましく、２～１８がより好ましく、３～１２が更に好ましい）、アルケニル基（炭素数２～２４が好ましく、２～１８がより好ましく、３～１２が更に好ましい）、アリール基（炭素数６～２２が好ましく、６～１８がより好ましく、６～１２が更に好ましい）、アリールアルキル基（炭素数７～２３が好ましく、７～１９がより好ましく、７～１２が更に好ましい）であり、置換基を有していてもよい。中でも、Ｒｂ１３はアリールアルキル基が好ましい。 In the formula, Rb 11 and Rb 12 and Rb 31 and Rb 32 are the same as Rb 1 and Rb 2 in Formula (B1), respectively.
Rb 13 is an alkyl group (preferably 1 to 24 carbon atoms, more preferably 2 to 18 carbon atoms, even more preferably 3 to 12 carbon atoms), an alkenyl group (preferably 2 to 24 carbon atoms, more preferably 2 to 18 carbon atoms, 3 to 12 carbon atoms) is more preferable), an aryl group (preferably has 6 to 22 carbon atoms, more preferably 6 to 18 carbon atoms, even more preferably 6 to 12 carbon atoms), an arylalkyl group (preferably has 7 to 23 carbon atoms, more preferably 7 to 19 carbon atoms), 7 to 12 are more preferred) and may have a substituent. Among these, Rb 13 is preferably an arylalkyl group.
　Ｒｂ３３及びＲｂ３４は、それぞれ独立に、水素原子、アルキル基（炭素数１～１２が好ましく、１～８がより好ましく、１～３が更に好ましい）、アルケニル基（炭素数２～１２が好ましく、２～８がより好ましく、２～３が更に好ましい）、アリール基（炭素数６～２２が好ましく、６～１８がより好ましく、６～１０が更に好ましい）、アリールアルキル基（炭素数７～２３が好ましく、７～１９がより好ましく、７～１１が更に好ましい）であり、水素原子が好ましい。 Rb 33 and Rb 34 each independently represent a hydrogen atom, an alkyl group (preferably 1 to 12 carbon atoms, more preferably 1 to 8 carbon atoms, even more preferably 1 to 3 carbon atoms), or an alkenyl group (preferably 2 to 12 carbon atoms). , more preferably 2 to 8, still more preferably 2 to 3), aryl group (preferably 6 to 22 carbon atoms, more preferably 6 to 18 carbon atoms, even more preferably 6 to 10 carbon atoms), arylalkyl group (carbon atoms 7 to 10), 23 is preferred, 7 to 19 are more preferred, and 7 to 11 are even more preferred), and a hydrogen atom is preferred.
　Ｒｂ３５は、アルキル基（炭素数１～２４が好ましく、１～１２がより好ましく、３～８が更に好ましい）、アルケニル基（炭素数２～１２が好ましく、２～１０がより好ましく、３～８が更に好ましい）、アリール基（炭素数６～２２が好ましく、６～１８がより好ましく、６～１２が更に好ましい）、アリールアルキル基（炭素数７～２３が好ましく、７～１９がより好ましく、７～１２が更に好ましい）であり、アリール基が好ましい。 Rb 35 is an alkyl group (preferably 1 to 24 carbon atoms, more preferably 1 to 12 carbon atoms, even more preferably 3 to 8 carbon atoms), an alkenyl group (preferably 2 to 12 carbon atoms, more preferably 2 to 10 carbon atoms, 3 to 10 carbon atoms) (more preferably 8), aryl group (preferably 6 to 22 carbon atoms, more preferably 6 to 18 carbon atoms, even more preferably 6 to 12 carbon atoms), arylalkyl group (preferably 7 to 23 carbon atoms, more preferably 7 to 19 carbon atoms) , 7 to 12 are more preferred), and an aryl group is preferred.
　式（Ｂ１－１）で表される化合物は、式（Ｂ１－１ａ）で表される化合物であることが好ましい。
Figure JPOXMLDOC01-appb-C000045
 The compound represented by formula (B1-1) is preferably a compound represented by formula (B1-1a).
Figure JPOXMLDOC01-appb-C000045
　Ｒｂ１１及びＲｂ１２は式（Ｂ１－１）におけるＲｂ１１及びＲｂ１２と同義である。
　Ｒｂ１５及びＲｂ１６は水素原子、アルキル基（炭素数１～１２が好ましく、１～６がより好ましく、１～３が更に好ましい）、アルケニル基（炭素数２～１２が好ましく、２～６がより好ましく、２～３が更に好ましい）、アリール基（炭素数６～２２が好ましく、６～１８がより好ましく、６～１０が更に好ましい）、アリールアルキル基（炭素数７～２３が好ましく、７～１９がより好ましく、７～１１が更に好ましい）であり、水素原子又はメチル基が好ましい。
　Ｒｂ１７はアルキル基（炭素数１～２４が好ましく、１～１２がより好ましく、３～８が更に好ましい）、アルケニル基（炭素数２～１２が好ましく、２～１０がより好ましく、３～８が更に好ましい）、アリール基（炭素数６～２２が好ましく、６～１８がより好ましく、６～１２が更に好ましい）、アリールアルキル基（炭素数７～２３が好ましく、７～１９がより好ましく、７～１２が更に好ましい）であり、中でもアリール基が好ましい。 Rb 11 and Rb 12 have the same meanings as Rb 11 and Rb 12 in formula (B1-1).
Rb 15 and Rb 16 are hydrogen atoms, alkyl groups (preferably 1 to 12 carbon atoms, more preferably 1 to 6 carbon atoms, even more preferably 1 to 3 carbon atoms), alkenyl groups (preferably 2 to 12 carbon atoms, 2 to 6 carbon atoms) more preferably 2 to 3 carbon atoms), aryl group (preferably 6 to 22 carbon atoms, more preferably 6 to 18 carbon atoms, even more preferably 6 to 10 carbon atoms), arylalkyl group (preferably 7 to 23 carbon atoms, 7 carbon atoms to 19 are more preferable, and 7 to 11 are even more preferable), and a hydrogen atom or a methyl group is preferable.
Rb 17 is an alkyl group (preferably 1 to 24 carbon atoms, more preferably 1 to 12 carbon atoms, even more preferably 3 to 8 carbon atoms), an alkenyl group (preferably 2 to 12 carbon atoms, more preferably 2 to 10 carbon atoms, 3 to 8 carbon atoms) is more preferable), an aryl group (preferably has 6 to 22 carbon atoms, more preferably 6 to 18 carbon atoms, even more preferably 6 to 12 carbon atoms), an arylalkyl group (preferably has 7 to 23 carbon atoms, more preferably 7 to 19 carbon atoms), 7 to 12 are more preferred), and aryl groups are particularly preferred.
　式（Ｂ３）において、Ｌは、隣接する酸素原子と炭素原子を連結する連結鎖の経路上に飽和炭化水素基を有する２価の炭化水素基であって、連結鎖の経路上の原子数が３以上である炭化水素基を表す。また、ＲＮ１およびＲＮ２は、それぞれ独立に１価の有機基を表す。   In formula (B3), L is a divalent hydrocarbon group having a saturated hydrocarbon group on the path of a connecting chain connecting adjacent oxygen atoms and carbon atoms, and the number of atoms on the path of the connecting chain is Represents a hydrocarbon group of 3 or more. Moreover, R N1 and R N2 each independently represent a monovalent organic group.
　本明細書において、「連結鎖」とは、連結対象の２つの原子または原子群の間を結ぶ経路上の原子鎖のうち、これらの連結対象を最短（最小原子数）で結ぶものをいう。例えば、下記式で表される化合物において、Ｌは、フェニレンエチレン基から構成され、飽和炭化水素基としてエチレン基を有し、連結鎖は４つの炭素原子から構成されており、連結鎖の経路上の原子数（つまり、連結鎖を構成する原子の数であり、以下、「連結鎖長」あるいは「連結鎖の長さ」ともいう。）は４である。
Figure JPOXMLDOC01-appb-C000047
 As used herein, the term "connection chain" refers to an atomic chain on a path connecting two atoms or atomic groups to be connected, which connects these objects in the shortest possible length (minimum number of atoms). For example, in the compound represented by the following formula, L is composed of a phenylene ethylene group, has an ethylene group as a saturated hydrocarbon group, the connecting chain is composed of four carbon atoms, and the path of the connecting chain is The number of atoms (that is, the number of atoms constituting the connected chain, hereinafter also referred to as "connected chain length" or "connected chain length") is 4.
Figure JPOXMLDOC01-appb-C000047
　式（Ｂ３）におけるＬ中の炭素数（連結鎖中の炭素原子以外の炭素原子も含む）は、３～２４であることが好ましい。上限は、１２以下であることがより好ましく、１０以下であることがさらに好ましく、８以下であることが特に好ましい。下限は、４以上であることがより好ましい。上記分子内環化反応を速やかに進行させる観点から、Ｌの連結鎖長の上限は、１２以下であることが好ましく、８以下であることがより好ましく、６以下であることがさらに好ましく、５以下であることが特に好ましい。特に、Ｌの連結鎖長は、４または５であることが好ましく、４であることが最も好ましい。塩基発生剤の具体的な好ましい化合物としては、例えば、国際公開第２０２０／０６６４１６号の段落番号０１０２～０１６８に記載の化合物、国際公開第２０１８／０３８００２号の段落番号０１４３～０１７７に記載の化合物も挙げられる。 The number of carbon atoms in L in formula (B3) (including carbon atoms other than carbon atoms in the connecting chain) is preferably 3 to 24. The upper limit is more preferably 12 or less, even more preferably 10 or less, and particularly preferably 8 or less. The lower limit is more preferably 4 or more. From the viewpoint of rapidly advancing the intramolecular cyclization reaction, the upper limit of the length of the linking chain of L is preferably 12 or less, more preferably 8 or less, even more preferably 6 or less, and 5 The following is particularly preferable. In particular, the chain length of L is preferably 4 or 5, most preferably 4. Specific preferred compounds of the base generator include, for example, the compounds described in paragraph numbers 0102 to 0168 of WO 2020/066416, and the compounds described in paragraph numbers 0143 to 0177 of WO 2018/038002. Can be mentioned.
　また、塩基発生剤は下記式（Ｎ１）で表される化合物を含むことも好ましい。
Moreover, it is also preferable that the base generator contains a compound represented by the following formula (N1).
　式（Ｎ１）中、ＲＮ１およびＲＮ２はそれぞれ独立に１価の有機基を表し、ＲＣ１は水素原子または保護基を表し、Ｌは２価の連結基を表す。 In formula (N1), R N1 and R N2 each independently represent a monovalent organic group, R C1 represents a hydrogen atom or a protecting group, and L represents a divalent linking group.
　Ｌは２価の連結基であり、２価の有機基であることが好ましい。連結基の連結鎖長は１以上であることが好ましく、２以上であることがより好ましい。上限としては、１２以下であることが好ましく、８以下であることがより好ましく、５以下であることがさらに好ましい。連結鎖長とは、式中の２つのカルボニル基の間において最短の道程となる原子配列に存在する原子の数である。 L is a divalent linking group, preferably a divalent organic group. The linking chain length of the linking group is preferably 1 or more, more preferably 2 or more. The upper limit is preferably 12 or less, more preferably 8 or less, and even more preferably 5 or less. The linking chain length is the number of atoms present in the atomic arrangement that provides the shortest path between two carbonyl groups in the formula.
　式（Ｎ１）中、ＲＮ１およびＲＮ２はそれぞれ独立に１価の有機基（炭素数１～２４が好ましく、２～１８がより好ましく、３～１２がさらに好ましい）を表し、炭化水素基（炭素数１～２４が好ましく、１～１２がより好ましく、１～１０がさらに好ましい）であることが好ましく、具体的には、脂肪族炭化水素基（炭素数１～２４が好ましく、１～１２がより好ましく、１～１０がさらに好ましい）または芳香族炭化水素基（炭素数６～２２が好ましく、６～１８がより好ましく、６～１０がさらに好ましい）を挙げることができ、脂肪族炭化水素基が好ましい。ＲＮ１およびＲＮ２として、脂肪族炭化水素基を用いると、発生する塩基の塩基性が高く好ましい。なお、脂肪族炭化水素基および芳香族炭化水素基は、置換基を有していてもよく、また、脂肪族炭化水素基および芳香族炭化水素基が脂肪族炭化水素鎖中や芳香環中、置換基中に酸素原子を有していてもよい。特に、脂肪族炭化水素基が炭化水素鎖中に酸素原子を有している態様が例示される。 In formula (N1), R N1 and R N2 each independently represent a monovalent organic group (preferably 1 to 24 carbon atoms, more preferably 2 to 18 carbon atoms, and even more preferably 3 to 12 carbon atoms), and a hydrocarbon group ( It is preferably an aliphatic hydrocarbon group (having preferably 1 to 24 carbon atoms, more preferably 1 to 12 carbon atoms, and even more preferably 1 to 10 carbon atoms), specifically an aliphatic hydrocarbon group (preferably having 1 to 24 carbon atoms, 1 to 12 carbon atoms). is more preferable, and 1 to 10 are still more preferable); Groups are preferred. It is preferable to use aliphatic hydrocarbon groups as R N1 and R N2 because the generated base has high basicity. Note that the aliphatic hydrocarbon group and the aromatic hydrocarbon group may have a substituent, and the aliphatic hydrocarbon group and the aromatic hydrocarbon group may have substituents in the aliphatic hydrocarbon chain or aromatic ring, The substituent may have an oxygen atom. In particular, an embodiment in which the aliphatic hydrocarbon group has an oxygen atom in the hydrocarbon chain is exemplified.
　ＲＮ１およびＲＮ２を構成する脂肪族炭化水素基としては、直鎖または分岐の鎖状アルキル基、環状アルキル基、鎖状アルキル基と環状アルキル基との組み合わせを含む基、酸素原子を鎖中に有するアルキル基が挙げられる。直鎖または分岐の鎖状アルキル基は、炭素数１～２４が好ましく、２～１８がより好ましく、３～１２がさらに好ましい。直鎖または分岐の鎖状アルキル基は、例えば、メチル基、エチル基、プロピル基、ブチル基、ペンチル基、ヘキシル基、ヘプチル基、オクチル基、ノニル基、デシル基、ウンデシル基、ドデシル基、イソプロピル基、イソブチル基、セカンダリーブチル基、ターシャリーブチル基、イソペンチル基、ネオペンチル基、ターシャリーペンチル基、イソヘキシル基等が挙げられる。
　環状アルキル基は、炭素数３～１２が好ましく、３～６がより好ましい。環状アルキル基は、例えば、シクロプロピル基、シクロブチル基、シクロペンチル基、シクロヘキシル基、シクロオクチル基等が挙げられる。
　鎖状アルキル基と環状アルキル基との組み合わせを含む基は、炭素数４～２４が好ましく、４～１８がより好ましく、４～１２がさらに好ましい。鎖状アルキル基と環状アルキル基との組み合わせを含む基は、例えば、シクロヘキシルメチル基、シクロヘキシルエチル基、シクロヘキシルプロピル基、メチルシクロヘキシルメチル基、エチルシクロヘキシルエチル基等が挙げられる。
　酸素原子を鎖中に有するアルキル基は、炭素数２～１２が好ましく、２～６がより好ましく、２～４がさらに好ましい。酸素原子を鎖中に有するアルキル基は、鎖状でも環状でもよく、直鎖でも分岐でもよい。
　なかでも、後述する分解生成塩基の沸点を高める観点で、ＲＮ１およびＲＮ２は炭素数５～１２のアルキル基が好ましい。ただし、金属（例えば銅）の層と積層する際の密着性を重視する処方においては、環状のアルキル基を有する基や炭素数１～８のアルキル基であることが好ましい。 Examples of the aliphatic hydrocarbon group constituting R N1 and R N2 include a straight or branched chain alkyl group, a cyclic alkyl group, a group containing a combination of a chain alkyl group and a cyclic alkyl group, and a group containing an oxygen atom in the chain. Examples include alkyl groups having . The linear or branched chain alkyl group preferably has 1 to 24 carbon atoms, more preferably 2 to 18 carbon atoms, and even more preferably 3 to 12 carbon atoms. Straight chain or branched chain alkyl groups include, for example, methyl group, ethyl group, propyl group, butyl group, pentyl group, hexyl group, heptyl group, octyl group, nonyl group, decyl group, undecyl group, dodecyl group, isopropyl group. group, isobutyl group, secondary butyl group, tertiary butyl group, isopentyl group, neopentyl group, tertiary pentyl group, isohexyl group, and the like.
The cyclic alkyl group preferably has 3 to 12 carbon atoms, more preferably 3 to 6 carbon atoms. Examples of the cyclic alkyl group include a cyclopropyl group, a cyclobutyl group, a cyclopentyl group, a cyclohexyl group, and a cyclooctyl group.
The group containing a combination of a chain alkyl group and a cyclic alkyl group preferably has 4 to 24 carbon atoms, more preferably 4 to 18 carbon atoms, and even more preferably 4 to 12 carbon atoms. Examples of the group containing a combination of a chain alkyl group and a cyclic alkyl group include a cyclohexylmethyl group, a cyclohexylethyl group, a cyclohexylpropyl group, a methylcyclohexylmethyl group, and an ethylcyclohexylethyl group.
The alkyl group having an oxygen atom in the chain preferably has 2 to 12 carbon atoms, more preferably 2 to 6 carbon atoms, and even more preferably 2 to 4 carbon atoms. The alkyl group having an oxygen atom in the chain may be linear or cyclic, linear or branched.
Among these, R N1 and R N2 are preferably alkyl groups having 5 to 12 carbon atoms, from the viewpoint of increasing the boiling point of the decomposition product base described below. However, in formulations where adhesion is important when laminated with a metal (eg, copper) layer, a group having a cyclic alkyl group or an alkyl group having 1 to 8 carbon atoms is preferable.
　ＲＮ１およびＲＮ２は互いに連結して環状構造を形成していてもよい。環状構造は、鎖中に酸素原子等を有していてもよい。また、ＲＮ１およびＲＮ２が形成する環状構造は、単環であっても、縮合環であってもよいが、単環が好ましい。形成される環状構造としては、式（Ｎ１）中の窒素原子を含有する５員環または６員環が好ましく、例えば、ピロール環、イミダゾール環、ピラゾール環、ピロリン環、ピロリジン環、イミダゾリジン環、ピラゾリジン環、ピぺリジン環、ピペラジン環、モルホリン環などが挙げられ、ピロリン環、ピロリジン環、ピペリジン環、ピペラジン環、モルホリン環が好ましく挙げられる。 R N1 and R N2 may be connected to each other to form a cyclic structure. The cyclic structure may have an oxygen atom or the like in the chain. Further, the cyclic structure formed by R N1 and R N2 may be a monocyclic ring or a condensed ring, but a monocyclic ring is preferable. The cyclic structure formed is preferably a 5-membered ring or a 6-membered ring containing a nitrogen atom in formula (N1), such as a pyrrole ring, an imidazole ring, a pyrazole ring, a pyrroline ring, a pyrrolidine ring, an imidazolidine ring, Examples include a pyrazolidine ring, a piperidine ring, a piperazine ring, a morpholine ring, and preferred examples include a pyrroline ring, a pyrrolidine ring, a piperidine ring, a piperazine ring, and a morpholine ring.
　ＲＣ１は水素原子または保護基を表し、水素原子が好ましい。
　保護基としては、酸または塩基の作用により分解する保護基が好ましく、酸で分解する保護基が好ましく挙げられる。
　保護基の具体例としては、鎖状もしくは環状のアルキル基または鎖中に酸素原子を有する鎖状もしくは環状のアルキル基が挙げられる。鎖状もしくは環状のアルキル基としては、メチル基、エチル基、イソプロピル基、ｔｅｒｔ－ブチル基、シクロヘキシル基等が挙げられる。鎖中に酸素原子を有する鎖状のアルキル基としては、アルキルオキシアルキル基が挙げられ、メチルオキシメチル（ＭＯＭ）基、エチルオキシエチル（ＥＥ）基等が好ましい。鎖中に酸素原子を有する環状のアルキル基としては、エポキシ基、グリシジル基、オキセタニル基、テトラヒドロフラニル基、テトラヒドロピラニル（ＴＨＰ）基等が挙げられる。 R C1 represents a hydrogen atom or a protective group, and preferably a hydrogen atom.
As the protecting group, a protecting group that is decomposed by the action of an acid or a base is preferable, and a protecting group that is decomposed by an acid is preferably mentioned.
Specific examples of the protecting group include a chain or cyclic alkyl group or a chain or cyclic alkyl group having an oxygen atom in the chain. Examples of the chain or cyclic alkyl group include methyl group, ethyl group, isopropyl group, tert-butyl group, and cyclohexyl group. Examples of the chain alkyl group having an oxygen atom in the chain include an alkyloxyalkyl group, and methyloxymethyl (MOM) group, ethyloxyethyl (EE) group, etc. are preferable. Examples of the cyclic alkyl group having an oxygen atom in the chain include an epoxy group, a glycidyl group, an oxetanyl group, a tetrahydrofuranyl group, and a tetrahydropyranyl (THP) group.
　式（Ｎ１）中、Ｌを構成する２価の連結基は、特に限定されないが、炭化水素基が好ましく、脂肪族炭化水素基がより好ましい。炭化水素基は、置換基を有していてもよく、炭化水素鎖の中に炭素原子以外の原子を有していてもよい。２価の連結基は、鎖中に酸素原子を有していてもよい２価の炭化水素連結基であることがより好ましく、鎖中に酸素原子を有していてもよい２価の脂肪族炭化水素基、２価の芳香族炭化水素基、または鎖中に酸素原子を有していてもよい２価の脂肪族炭化水素基と２価の芳香族炭化水素基との組み合わせを含む基が更に好ましく、鎖中に酸素原子を有していてもよい２価の脂肪族炭化水素基が更により好ましい。これらの基は、酸素原子を有していなくてもよい。
　２価の炭化水素連結基は、炭素数１～２４が好ましく、２～１２がより好ましく、２～６がさらに好ましい。２価の脂肪族炭化水素基は、炭素数１～１２が好ましく、２～６がより好ましく、２～４がさらに好ましい。２価の芳香族炭化水素基は、炭素数６～２２が好ましく、６～１８がより好ましく、６～１０がさらに好ましい。２価の脂肪族炭化水素基と２価の芳香族炭化水素基との組み合わせを含む基（例えば、アリーレンアルキル基）は、炭素数７～２２が好ましく、７～１８がより好ましく、７～１０がさらに好ましい。 In formula (N1), the divalent linking group constituting L is not particularly limited, but is preferably a hydrocarbon group, and more preferably an aliphatic hydrocarbon group. The hydrocarbon group may have a substituent and may have atoms other than carbon atoms in the hydrocarbon chain. The divalent linking group is more preferably a divalent hydrocarbon linking group that may have an oxygen atom in its chain, and a divalent aliphatic linking group that may have an oxygen atom in its chain. A group containing a hydrocarbon group, a divalent aromatic hydrocarbon group, or a combination of a divalent aliphatic hydrocarbon group which may have an oxygen atom in the chain and a divalent aromatic hydrocarbon group More preferred is a divalent aliphatic hydrocarbon group which may have an oxygen atom in the chain. These groups do not need to have an oxygen atom.
The divalent hydrocarbon linking group preferably has 1 to 24 carbon atoms, more preferably 2 to 12 carbon atoms, and even more preferably 2 to 6 carbon atoms. The divalent aliphatic hydrocarbon group preferably has 1 to 12 carbon atoms, more preferably 2 to 6 carbon atoms, and even more preferably 2 to 4 carbon atoms. The divalent aromatic hydrocarbon group preferably has 6 to 22 carbon atoms, more preferably 6 to 18 carbon atoms, and even more preferably 6 to 10 carbon atoms. The group containing a combination of a divalent aliphatic hydrocarbon group and a divalent aromatic hydrocarbon group (for example, an arylene alkyl group) preferably has 7 to 22 carbon atoms, more preferably 7 to 18 carbon atoms, and has 7 to 10 carbon atoms. is even more preferable.
　連結基Ｌは、具体的には、直鎖または分岐の鎖状アルキレン基、環状アルキレン基、鎖状アルキレン基と環状アルキレン基との組み合わせを含む基、酸素原子を鎖中に有するアルキレン基、直鎖または分岐の鎖状のアルケニレン基、環状のアルケニレン基、アリーレン基、アリーレンアルキレン基が好ましい。
　直鎖または分岐の鎖状アルキレン基は、炭素数１～１２が好ましく、２～６がより好ましく、２～４がさらに好ましい。
　環状アルキレン基は、炭素数３～１２が好ましく、３～６がより好ましい。
　鎖状アルキレン基と環状アルキレン基との組み合わせを含む基は、炭素数４～２４が好ましく、４～１２がより好ましく、４～６がさらに好ましい。
　酸素原子を鎖中に有するアルキレン基は、鎖状でも環状でもよく、直鎖でも分岐でもよい。酸素原子を鎖中に有するアルキレン基は、炭素数１～１２が好ましく、１～６がより好ましく、１～３がさらに好ましい。 Specifically, the linking group L is a linear or branched chain alkylene group, a cyclic alkylene group, a group containing a combination of a chain alkylene group and a cyclic alkylene group, an alkylene group having an oxygen atom in the chain, or a straight chain alkylene group. A chain or branched chain alkenylene group, a cyclic alkenylene group, an arylene group, and an arylene alkylene group are preferred.
The linear or branched chain alkylene group preferably has 1 to 12 carbon atoms, more preferably 2 to 6 carbon atoms, and even more preferably 2 to 4 carbon atoms.
The cyclic alkylene group preferably has 3 to 12 carbon atoms, more preferably 3 to 6 carbon atoms.
The group containing a combination of a chain alkylene group and a cyclic alkylene group preferably has 4 to 24 carbon atoms, more preferably 4 to 12 carbon atoms, and even more preferably 4 to 6 carbon atoms.
The alkylene group having an oxygen atom in the chain may be linear or cyclic, linear or branched. The alkylene group having an oxygen atom in the chain preferably has 1 to 12 carbon atoms, more preferably 1 to 6 carbon atoms, and even more preferably 1 to 3 carbon atoms.
　直鎖または分岐の鎖状のアルケニレン基は、炭素数２～１２が好ましく、２～６がより好ましく、２～３がさらに好ましい。直鎖または分岐の鎖状のアルケニレン基は、Ｃ＝Ｃ結合の数は１～１０が好ましく、１～６がより好ましく、１～３がさらに好ましい。
　環状のアルケニレン基は、炭素数３～１２が好ましく、３～６がより好ましい。環状のアルケニレン基は、Ｃ＝Ｃ結合の数は１～６が好ましく、１～４がより好ましく、１～２がさらに好ましい。
　アリーレン基は、炭素数６～２２が好ましく、６～１８がより好ましく、６～１０がさらに好ましい。
　アリーレンアルキレン基は、炭素数７～２３が好ましく、７～１９がより好ましく、７～１１がさらに好ましい。
　中でも、鎖状アルキレン基、環状アルキレン基、酸素原子を鎖中に有するアルキレン基、鎖状のアルケニレン基、アリーレン基、アリーレンアルキレン基が好ましく、１，２－エチレン基、プロパンジイル基（特に１，３－プロパンジイル基）、シクロヘキサンジイル基（特に１，２－シクロヘキサンジイル基）、ビニレン基（特にシスビニレン基）、フェニレン基（１，２-フェニレン基）、フェニレンメチレン基（特に１，２－フェニレンメチレン基）、エチレンオキシエチレン基（特に１，２－エチレンオキシ－１，２－エチレン基）がより好ましい。 The linear or branched chain alkenylene group preferably has 2 to 12 carbon atoms, more preferably 2 to 6 carbon atoms, and even more preferably 2 to 3 carbon atoms. In the linear or branched alkenylene group, the number of C═C bonds is preferably 1 to 10, more preferably 1 to 6, and even more preferably 1 to 3.
The cyclic alkenylene group preferably has 3 to 12 carbon atoms, more preferably 3 to 6 carbon atoms. The number of C═C bonds in the cyclic alkenylene group is preferably 1 to 6, more preferably 1 to 4, and even more preferably 1 to 2.
The arylene group preferably has 6 to 22 carbon atoms, more preferably 6 to 18 carbon atoms, and even more preferably 6 to 10 carbon atoms.
The arylene alkylene group preferably has 7 to 23 carbon atoms, more preferably 7 to 19 carbon atoms, and even more preferably 7 to 11 carbon atoms.
Among these, linear alkylene groups, cyclic alkylene groups, alkylene groups having an oxygen atom in the chain, linear alkenylene groups, arylene groups, and arylene alkylene groups are preferred, and 1,2-ethylene groups, propanediyl groups (especially 1, 3-propanediyl group), cyclohexanediyl group (especially 1,2-cyclohexanediyl group), vinylene group (especially cisvinylene group), phenylene group (1,2-phenylene group), phenylenemethylene group (especially 1,2-phenylene group) methylene group) and ethyleneoxyethylene group (particularly 1,2-ethyleneoxy-1,2-ethylene group) are more preferred.
　塩基発生剤としては、下記の化合物が挙げられるが、これらに限定されない。 Examples of the base generator include, but are not limited to, the following compounds.
　非イオン型塩基発生剤の分子量は、８００以下が好ましく、６００以下がより好ましく、５００以下が更に好ましい。下限は、１００以上が好ましく、２００以上がより好ましく、３００以上が更に好ましい。 The molecular weight of the nonionic base generator is preferably 800 or less, more preferably 600 or less, and even more preferably 500 or less. The lower limit is preferably 100 or more, more preferably 200 or more, and even more preferably 300 or more.
　イオン型塩基発生剤の具体的な好ましい化合物としては、例えば、国際公開第２０１８／０３８００２号の段落番号０１４８～０１６３に記載の化合物が挙げられる。 Specific preferred compounds of the ionic base generator include, for example, the compounds described in paragraph numbers 0148 to 0163 of International Publication No. 2018/038002.
　アンモニウム塩の具体例としては、下記の化合物が挙げられるが、これらに限定されない。
Specific examples of ammonium salts include, but are not limited to, the following compounds.
　イミニウム塩の具体例としては、下記の化合物が挙げられるが、これらに限定されない。
Specific examples of iminium salts include, but are not limited to, the following compounds.
　樹脂組成物が塩基発生剤を含む場合、塩基発生剤の含有量は、樹脂組成物中の樹脂１００質量部に対し、０．１～５０質量部が好ましい。下限は、０．３質量部以上がより好ましく、０．５質量部以上が更に好ましい。上限は、３０質量部以下がより好ましく、２０質量部以下が更に好ましく、１０質量部以下が一層好ましく、５質量部以下がより一層好ましく、４質量部以下が特に好ましい。
　塩基発生剤は、１種又は２種以上を用いることができる。２種以上を用いる場合は、合計量が上記範囲であることが好ましい。 When the resin composition contains a base generator, the content of the base generator is preferably 0.1 to 50 parts by weight based on 100 parts by weight of the resin in the resin composition. The lower limit is more preferably 0.3 parts by mass or more, and even more preferably 0.5 parts by mass or more. The upper limit is more preferably 30 parts by mass or less, even more preferably 20 parts by mass or less, even more preferably 10 parts by mass or less, even more preferably 5 parts by mass or less, and particularly preferably 4 parts by mass or less.
One type or two or more types of base generators can be used. When two or more types are used, the total amount is preferably within the above range.
＜溶剤＞
　本発明の樹脂組成物は、溶剤を含むことが好ましい。
　溶剤は、公知の溶剤を任意に使用できる。溶剤は有機溶剤が好ましい。有機溶剤としては、エステル類、エーテル類、ケトン類、環状炭化水素類、スルホキシド類、アミド類、ウレア類、アルコール類などの化合物が挙げられる。 <Solvent>
The resin composition of the present invention preferably contains a solvent.
Any known solvent can be used as the solvent. The solvent is preferably an organic solvent. Examples of the organic solvent include compounds such as esters, ethers, ketones, cyclic hydrocarbons, sulfoxides, amides, ureas, and alcohols.
　エステル類として、例えば、酢酸エチル、酢酸－ｎ－ブチル、酢酸イソブチル、酢酸へキシル、ギ酸アミル、酢酸イソアミル、プロピオン酸ブチル、酪酸イソプロピル、酪酸エチル、酪酸ブチル、乳酸メチル、乳酸エチル、γ－ブチロラクトン、ε－カプロラクトン、δ－バレロラクトン、アルキルオキシ酢酸アルキル（例えば、アルキルオキシ酢酸メチル、アルキルオキシ酢酸エチル、アルキルオキシ酢酸ブチル（例えば、メトキシ酢酸メチル、メトキシ酢酸エチル、メトキシ酢酸ブチル、エトキシ酢酸メチル、エトキシ酢酸エチル等））、３－アルキルオキシプロピオン酸アルキルエステル類（例えば、３－アルキルオキシプロピオン酸メチル、３－アルキルオキシプロピオン酸エチル等（例えば、３－メトキシプロピオン酸メチル、３－メトキシプロピオン酸エチル、３－エトキシプロピオン酸メチル、３－エトキシプロピオン酸エチル等））、２－アルキルオキシプロピオン酸アルキルエステル類（例えば、２－アルキルオキシプロピオン酸メチル、２－アルキルオキシプロピオン酸エチル、２－アルキルオキシプロピオン酸プロピル等（例えば、２－メトキシプロピオン酸メチル、２－メトキシプロピオン酸エチル、２－メトキシプロピオン酸プロピル、２－エトキシプロピオン酸メチル、２－エトキシプロピオン酸エチル））、２－アルキルオキシ－２－メチルプロピオン酸メチル及び２－アルキルオキシ－２－メチルプロピオン酸エチル（例えば、２－メトキシ－２－メチルプロピオン酸メチル、２－エトキシ－２－メチルプロピオン酸エチル等）、ピルビン酸メチル、ピルビン酸エチル、ピルビン酸プロピル、アセト酢酸メチル、アセト酢酸エチル、２－オキソブタン酸メチル、２－オキソブタン酸エチル、ヘキサン酸エチル、ヘプタン酸エチル、マロン酸ジメチル、マロン酸ジエチル等が好適なものとして挙げられる。 Examples of esters include ethyl acetate, n-butyl acetate, isobutyl acetate, hexyl acetate, amyl formate, isoamyl acetate, butyl propionate, isopropyl butyrate, ethyl butyrate, butyl butyrate, methyl lactate, ethyl lactate, γ-butyrolactone. , ε-caprolactone, δ-valerolactone, alkyloxyacetate (e.g., methyl alkyloxyacetate, ethyl alkyloxyacetate, butyl alkyloxyacetate (e.g., methyl methoxyacetate, ethyl methoxyacetate, butyl methoxyacetate, methyl ethoxyacetate, 3-alkyloxypropionate alkyl esters (e.g., methyl 3-alkyloxypropionate, ethyl 3-alkyloxypropionate, etc.), 3-alkyloxypropionate alkyl esters (e.g., methyl 3-methoxypropionate, 3-methoxypropionate), ethyl, methyl 3-ethoxypropionate, ethyl 3-ethoxypropionate, etc.), 2-alkyloxypropionate alkyl esters (e.g., methyl 2-alkyloxypropionate, ethyl 2-alkyloxypropionate, 2-alkyl 2-alkyloxy- Methyl 2-methylpropionate and ethyl 2-alkyloxy-2-methylpropionate (for example, methyl 2-methoxy-2-methylpropionate, ethyl 2-ethoxy-2-methylpropionate, etc.), methyl pyruvate, pyruvin Preferred examples include ethyl acid, propyl pyruvate, methyl acetoacetate, ethyl acetoacetate, methyl 2-oxobutanoate, ethyl 2-oxobutanoate, ethyl hexanoate, ethyl heptanoate, dimethyl malonate, diethyl malonate, and the like. .
　エーテル類として、例えば、エチレングリコールジメチルエーテル、ジエチレングリコールジメチルエーテル、ジエチレングリコールジエチルエーテル、ジエチレングリコールエチルメチルエーテル、ジエチレングリコールブチルメチルエーテル、トリエチレングリコールジメチルエーテル、テトラエチレングリコールジメチルエーテル、テトラヒドロフラン、エチレングリコールモノメチルエーテル、エチレングリコールモノエチルエーテル、メチルセロソルブアセテート、エチルセロソルブアセテート、ジエチレングリコールモノメチルエーテル、ジエチレングリコールモノエチルエーテル、ジエチレングリコールモノブチルエーテル、プロピレングリコールモノメチルエーテル、プロピレングリコールジメチルエーテル、プロピレングリコールモノメチルエーテルアセテート、プロピレングリコールモノエチルエーテルアセテート、エチレングリコールモノブチルエーテル、エチレングリコールモノブチルエーテルアセテート、ジエチレングリコールエチルメチルエーテル、プロピレングリコールモノプロピルエーテルアセテート、ジプロピレングリコールジメチルエーテル等が好適なものとして挙げられる。 Examples of ethers include ethylene glycol dimethyl ether, diethylene glycol dimethyl ether, diethylene glycol diethyl ether, diethylene glycol ethyl methyl ether, diethylene glycol butyl methyl ether, triethylene glycol dimethyl ether, tetraethylene glycol dimethyl ether, tetrahydrofuran, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, Methyl cellosolve acetate, ethyl cellosolve acetate, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol monobutyl ether, propylene glycol monomethyl ether, propylene glycol dimethyl ether, propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, ethylene glycol monobutyl ether, ethylene glycol Suitable examples include monobutyl ether acetate, diethylene glycol ethyl methyl ether, propylene glycol monopropyl ether acetate, and dipropylene glycol dimethyl ether.
　ケトン類として、例えば、メチルエチルケトン、シクロヘキサノン、シクロペンタノン、２－ヘプタノン、３－ヘプタノン、３－メチルシクロヘキサノン、レボグルコセノン、ジヒドロレボグルコセノン等が好適なものとして挙げられる。 Suitable ketones include, for example, methyl ethyl ketone, cyclohexanone, cyclopentanone, 2-heptanone, 3-heptanone, 3-methylcyclohexanone, levoglucosenone, dihydrolevoglucosenone, and the like.
　環状炭化水素類として、例えば、トルエン、キシレン、アニソール等の芳香族炭化水素類、リモネン等の環式テルペン類が好適なものとして挙げられる。 Suitable examples of cyclic hydrocarbons include aromatic hydrocarbons such as toluene, xylene, and anisole, and cyclic terpenes such as limonene.
　スルホキシド類として、例えば、ジメチルスルホキシドが好適なものとして挙げられる。 Suitable examples of sulfoxides include dimethyl sulfoxide.
　アミド類として、Ｎ－メチル－２－ピロリドン、Ｎ－エチル－２－ピロリドン、Ｎ－シクロヘキシル－２－ピロリドン、Ｎ，Ｎ－ジメチルアセトアミド、Ｎ，Ｎ－ジメチルホルムアミド、Ｎ，Ｎ－ジメチルイソブチルアミド、３－メトキシ－Ｎ，Ｎ－ジメチルプロピオンアミド、３－ブトキシ－Ｎ，Ｎ－ジメチルプロピオンアミド、Ｎ－ホルミルモルホリン、Ｎ－アセチルモルホリン等が好適なものとして挙げられる。 Amides include N-methyl-2-pyrrolidone, N-ethyl-2-pyrrolidone, N-cyclohexyl-2-pyrrolidone, N,N-dimethylacetamide, N,N-dimethylformamide, N,N-dimethylisobutyramide, Preferred examples include 3-methoxy-N,N-dimethylpropionamide, 3-butoxy-N,N-dimethylpropionamide, N-formylmorpholine, and N-acetylmorpholine.
　ウレア類として、Ｎ，Ｎ，Ｎ’，Ｎ’－テトラメチルウレア、１，３－ジメチル－２－イミダゾリジノン等が好適なものとして挙げられる。 Suitable ureas include N,N,N',N'-tetramethylurea, 1,3-dimethyl-2-imidazolidinone, and the like.
アルコール類として、メタノール、エタノール、１-プロパノール、２-プロパノール、１－ブタノール、１－ペンタノール、１－ヘキサノール、ベンジルアルコール、エチレングリコールモノメチルエーテル、１－メトキシ－２－プロパノール、２－エトキシエタノール、ジエチレングリコールモノエチルエーテル、ジエチレングリコールモノヘキシルエーテル、トリエチレングリコールモノメチルエーテル、プロピレングリコールモノエチルエーテル、プロピレングリコールモノメチルエーテル、ポリエチレングリコールモノメチルエーテル、ポリプロピレングリコール、テトラエチレングリコール、エチレングリコールモノブチルエーテル、エチレングリコールモノベンジルエーテル、エチレングリコールモノフェニルエーテル、メチルフェニルカルビノール、ｎ－アミルアルコール、メチルアミルアルコール、および、ダイアセトンアルコール等が挙げられる。 Alcohols include methanol, ethanol, 1-propanol, 2-propanol, 1-butanol, 1-pentanol, 1-hexanol, benzyl alcohol, ethylene glycol monomethyl ether, 1-methoxy-2-propanol, 2-ethoxyethanol, Diethylene glycol monoethyl ether, diethylene glycol monohexyl ether, triethylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol monomethyl ether, polyethylene glycol monomethyl ether, polypropylene glycol, tetraethylene glycol, ethylene glycol monobutyl ether, ethylene glycol monobenzyl ether, Examples include ethylene glycol monophenyl ether, methylphenyl carbinol, n-amyl alcohol, methyl amyl alcohol, and diacetone alcohol.
　溶剤は、塗布面性状の改良などの観点から、２種以上を混合する形態も好ましい。 From the viewpoint of improving the properties of the coated surface, it is also preferable to use a mixture of two or more solvents.
　本発明では、３－エトキシプロピオン酸メチル、３－エトキシプロピオン酸エチル、エチルセロソルブアセテート、乳酸エチル、ジエチレングリコールジメチルエーテル、酢酸ブチル、３－メトキシプロピオン酸メチル、２－ヘプタノン、シクロヘキサノン、シクロペンタノン、γ－ブチロラクトン、ジメチルスルホキシド、エチルカルビトールアセテート、ブチルカルビトールアセテート、Ｎ－メチル－２－ピロリドン、プロピレングリコールメチルエーテル、及びプロピレングリコールメチルエーテルアセテート、レボグルコセノン、ジヒドロレボグルコセノンから選択される１種の溶剤、又は、２種以上で構成される混合溶剤が好ましい。ジメチルスルホキシドとγ－ブチロラクトンとの併用、又は、Ｎ－メチル－２－ピロリドンと乳酸エチルとの併用が特に好ましい。 In the present invention, methyl 3-ethoxypropionate, ethyl 3-ethoxypropionate, ethyl cellosolve acetate, ethyl lactate, diethylene glycol dimethyl ether, butyl acetate, methyl 3-methoxypropionate, 2-heptanone, cyclohexanone, cyclopentanone, γ- One solvent selected from butyrolactone, dimethyl sulfoxide, ethyl carbitol acetate, butyl carbitol acetate, N-methyl-2-pyrrolidone, propylene glycol methyl ether, and propylene glycol methyl ether acetate, levoglucosenone, dihydrolevoglucosenone, Alternatively, a mixed solvent composed of two or more types is preferable. Particularly preferred is the combination of dimethyl sulfoxide and γ-butyrolactone, or the combination of N-methyl-2-pyrrolidone and ethyl lactate.
　溶剤の含有量は、塗布性の観点から、本発明の樹脂組成物の全固形分濃度が５～８０質量％になる量とすることが好ましく、５～７５質量％となる量にすることがより好ましく、１０～７０質量％となる量にすることが更に好ましく、２０～７０質量％となるようにすることが一層好ましい。溶剤含有量は、塗膜の所望の厚さと塗布方法に応じて調節すればよい。溶剤を２種以上含有する場合は、その合計が上記範囲であることが好ましい。 From the viewpoint of coating properties, the content of the solvent is preferably such that the total solids concentration of the resin composition of the present invention is 5 to 80% by mass, and preferably 5 to 75% by mass. More preferably, the amount is 10 to 70% by mass, and even more preferably 20 to 70% by mass. The solvent content may be adjusted depending on the desired thickness of the coating and the application method. When two or more types of solvents are contained, it is preferable that the total amount is within the above range.
＜金属接着性改良剤＞
　本発明の樹脂組成物は、電極や配線などに用いられる金属材料との接着性を向上させる観点から、金属接着性改良剤を含むことが好ましい。金属接着性改良剤としては、アルコキシシリル基を有するシランカップリング剤、アルミニウム系接着助剤、チタン系接着助剤、スルホンアミド構造を有する化合物及びチオウレア構造を有する化合物、リン酸誘導体化合物、βケトエステル化合物、アミノ化合物等が挙げられる。 <Metal adhesion improver>
The resin composition of the present invention preferably contains a metal adhesion improver from the viewpoint of improving adhesion to metal materials used for electrodes, wiring, etc. Examples of metal adhesion improvers include silane coupling agents having alkoxysilyl groups, aluminum adhesion aids, titanium adhesion aids, compounds having a sulfonamide structure and thiourea structure, phosphoric acid derivative compounds, and β-keto esters. compounds, amino compounds, etc.
〔シランカップリング剤〕
　シランカップリング剤としては、例えば、国際公開第２０２１／１１２１８９号の段落０３１６に記載の化合物、特開２０１８－１７３５７３の段落００６７～００７８に記載の化合物が挙げられ、これらの内容は本明細書に組み込まれる。また、特開２０１１－１２８３５８号公報の段落００５０～００５８に記載のように異なる２種以上のシランカップリング剤を用いることも好ましい。シランカップリング剤は、下記化合物を用いることも好ましい。以下の式中、Ｍｅはメチル基を、Ｅｔはエチル基を表す。また、下記Ｒはブロックイソシアネート基におけるブロック化剤由来の構造が挙げられる。ブロック化剤としては、脱離温度に応じて選択すればよいが、アルコール化合物、フェノール化合物、ピラゾール化合物、トリアゾール化合物、ラクタム化合物、活性メチレン化合物等が挙げられる。例えば、脱離温度を１６０～１８０℃としたい観点からは、カプロラクタムなどが好ましい。このような化合物の市販品としては、Ｘ－１２－１２９３（信越化学工業株式会社製）などが挙げられる。 〔Silane coupling agent〕
Examples of the silane coupling agent include the compounds described in paragraph 0316 of International Publication No. 2021/112189 and the compounds described in paragraphs 0067 to 0078 of JP 2018-173573, the contents of which are not included herein. Incorporated. Furthermore, it is also preferable to use two or more different silane coupling agents as described in paragraphs 0050 to 0058 of JP-A-2011-128358. It is also preferable to use the following compounds as the silane coupling agent. In the following formula, Me represents a methyl group and Et represents an ethyl group. Further, the following R may be a structure derived from a blocking agent in a blocked isocyanate group. The blocking agent may be selected depending on the desorption temperature, and includes alcohol compounds, phenol compounds, pyrazole compounds, triazole compounds, lactam compounds, active methylene compounds, and the like. For example, from the viewpoint of desiring a desorption temperature of 160 to 180°C, caprolactam and the like are preferred. Commercially available products of such compounds include X-12-1293 (manufactured by Shin-Etsu Chemical Co., Ltd.).
　他のシランカップリング剤としては、例えば、ビニルトリメトキシシラン、ビニルトリエトキシシラン、２－（３，４－エポキシシクロヘキシル）エチルトリメトキシシラン、３－グリシドキシプロピルメチルジメトキシシラン、３－グリシドキシプロピルトリメトキシシラン、３－グリシドキシプロピルメチルジエトキシシラン、３－グリシドキシプロピルトリエトキシシラン、ｐ－スチリルトリメトキシシラン、３－メタクリロキシプロピルメチルジメトキシシラン、３－メタクリロキシプロピルトリメトキシシラン、３－メタクリロキシプロピルメチルジエトキシシラン、３－メタクリロキシプロピルトリエトキシシラン、３－アクリロキシプロピルトリメトキシシラン、Ｎ－２－（アミノエチル）－３－アミノプロピルメチルジメトキシシラン、Ｎ－２－（アミノエチル）－３－アミノプロピルトリメトキシシラン、３－アミノプロピルトリメトキシシラン、３－アミノプロピルトリエトキシシラン、３－トリエトキシシリル－Ｎ－（１，３－ジメチル－ブチリデン）プロピルアミン、Ｎ－フェニル－３－アミノプロピルトリメトキシシラン、トリス－（トリメトキシシリルプロピル）イソシアヌレート、３－ウレイドプロピルトリアルコキシシラン、３－メルカプトプロピルメチルジメトキシシラン、３－メルカプトプロピルトリメトキシシラン、３－イソシアネートプロピルトリエトキシシラン、３－トリメトキシシリルプロピルコハク酸無水物が挙げられる。これらは１種単独または２種以上を組み合わせて使用することができる。
　また、シランカップリング剤として、アルコキシシリル基を複数個有するオリゴマータイプの化合物を用いることもできる。
　このようなオリゴマータイプの化合物としては、下記式（Ｓ－１）で表される繰返し単位を含む化合物などが挙げられる。

　式（Ｓ－１）中、ＲＳ１は１価の有機基を表し、ＲＳ２は水素原子、ヒドロキシ基又はアルコキシ基を表し、ｎは０～２の整数を表す。
　ＲＳ１は重合性基を含む構造であることが好ましい。重合性基としては、エチレン性不飽和結合を有する基、エポキシ基、オキセタニル基、ベンゾオキサゾリル基、ブロックイソシアネート基、アミノ基等が挙げられる。エチレン性不飽和結合を有する基としては、ビニル基、アリル基、イソアリル基、２－メチルアリル基、ビニル基と直接結合した芳香環を有する基（例えば、ビニルフェニル基など）、（メタ）アクリルアミド基、（メタ）アクリロイルオキシ基などが挙げられ、ビニルフェニル基、（メタ）アクリルアミド基又は（メタ）アクリロイルオキシ基が好ましく、ビニルフェニル基又は（メタ）アクリロイルオキシ基がより好ましく、（メタ）アクリロイルオキシ基が更に好ましい。
　ＲＳ２はアルコキシ基であることが好ましく、メトキシ基又はエトキシ基であることがより好ましい。
　ｎは０～２の整数を表し、１であることが好ましい。
　ここで、オリゴマータイプの化合物に含まれる複数の式（Ｓ－１）で表される繰返し単位の構造は、それぞれ同一であってもよい。
　ここで、オリゴマータイプの化合物に含まれる複数の式（Ｓ－１）で表される繰返し単位のうち、少なくとも１つにおいてｎが１又は２であることが好ましく、少なくとも２つにおいてｎが１又は２であることがより好ましく、少なくとも２つにおいてｎが１であることが更に好ましい。
　このようなオリゴマータイプの化合物としては市販品を用いることができ、市販品としては例えば、ＫＲ－５１３（信越化学工業株式会社製）が挙げられる。 Examples of other silane coupling agents include vinyltrimethoxysilane, vinyltriethoxysilane, 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, and 3-glycidoxypropylmethyldimethoxysilane. Xypropyltrimethoxysilane, 3-glycidoxypropylmethyldiethoxysilane, 3-glycidoxypropyltriethoxysilane, p-styryltrimethoxysilane, 3-methacryloxypropylmethyldimethoxysilane, 3-methacryloxypropyltrimethoxysilane Silane, 3-methacryloxypropylmethyldiethoxysilane, 3-methacryloxypropyltriethoxysilane, 3-acryloxypropyltrimethoxysilane, N-2-(aminoethyl)-3-aminopropylmethyldimethoxysilane, N-2 -(aminoethyl)-3-aminopropyltrimethoxysilane, 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-triethoxysilyl-N-(1,3-dimethyl-butylidene)propylamine, N-phenyl-3-aminopropyltrimethoxysilane, tris-(trimethoxysilylpropyl)isocyanurate, 3-ureidopropyltrialkoxysilane, 3-mercaptopropylmethyldimethoxysilane, 3-mercaptopropyltrimethoxysilane, 3-isocyanate Examples include propyltriethoxysilane and 3-trimethoxysilylpropylsuccinic anhydride. These can be used alone or in combination of two or more.
Moreover, an oligomer type compound having a plurality of alkoxysilyl groups can also be used as the silane coupling agent.
Examples of such oligomer type compounds include compounds containing a repeating unit represented by the following formula (S-1).

In formula (S-1), R S1 represents a monovalent organic group, R S2 represents a hydrogen atom, a hydroxy group, or an alkoxy group, and n represents an integer of 0 to 2.
R S1 preferably has a structure containing a polymerizable group. Examples of the polymerizable group include a group having an ethylenically unsaturated bond, an epoxy group, an oxetanyl group, a benzoxazolyl group, a blocked isocyanate group, and an amino group. Examples of the group having an ethylenically unsaturated bond include a vinyl group, an allyl group, an isoallyl group, a 2-methylallyl group, a group having an aromatic ring directly bonded to a vinyl group (for example, a vinyl phenyl group, etc.), and a (meth)acrylamide group. , (meth)acryloyloxy group, etc., preferably vinylphenyl group, (meth)acrylamide group or (meth)acryloyloxy group, more preferably vinylphenyl group or (meth)acryloyloxy group, (meth)acryloyloxy group, etc. More preferred are groups.
R S2 is preferably an alkoxy group, more preferably a methoxy group or an ethoxy group.
n represents an integer from 0 to 2, preferably 1.
Here, the structures of the plurality of repeating units represented by formula (S-1) contained in the oligomer type compound may be the same.
Here, it is preferable that n is 1 or 2 in at least one of the plurality of repeating units represented by formula (S-1) contained in the oligomer type compound, and n is 1 or 2 in at least two. More preferably, n is 2, and even more preferably n is 1 in at least two cases.
Commercially available products can be used as such oligomer type compounds, and examples of commercially available products include KR-513 (manufactured by Shin-Etsu Chemical Co., Ltd.).
〔アルミニウム系接着助剤〕
　アルミニウム系接着助剤としては、例えば、アルミニウムトリス（エチルアセトアセテート）、アルミニウムトリス（アセチルアセトネート）、エチルアセトアセテートアルミニウムジイソプロピレート等を挙げることができる。 [Aluminum-based adhesion aid]
Examples of the aluminum adhesive aid include aluminum tris (ethyl acetoacetate), aluminum tris (acetylacetonate), ethylacetoacetate aluminum diisopropylate, and the like.
　その他の金属接着性改良剤としては、特開２０１４－１８６１８６号公報の段落００４６～００４９に記載の化合物、特開２０１３－０７２９３５号公報の段落００３２～００４３に記載のスルフィド系化合物を用いることもでき、これらの内容は本明細書に組み込まれる。 As other metal adhesion improvers, compounds described in paragraphs 0046 to 0049 of JP2014-186186A and sulfide compounds described in paragraphs 0032 to 0043 of JP2013-072935A can also be used. , the contents of which are incorporated herein.
　金属接着性改良剤の含有量は特定樹脂１００質量部に対して、０．０１～３０質量部が好ましく、０．１～１０質量部がより好ましく、０．５～５質量部が更に好ましい。上記下限値以上とすることでパターンと金属層との接着性が良好となり、上記上限値以下とすることでパターンの耐熱性、機械特性が良好となる。金属接着性改良剤は１種のみでもよいし、２種以上であってもよい。２種以上用いる場合は、その合計が上記範囲であることが好ましい。 The content of the metal adhesion improver is preferably 0.01 to 30 parts by weight, more preferably 0.1 to 10 parts by weight, and even more preferably 0.5 to 5 parts by weight, based on 100 parts by weight of the specific resin. By setting it above the above-mentioned lower limit, the adhesion between the pattern and the metal layer becomes good, and by setting it below the above-mentioned upper limit, the heat resistance and mechanical properties of the pattern become good. There may be only one type of metal adhesion improver, or two or more types may be used. When two or more types are used, it is preferable that the total is within the above range.
＜マイグレーション抑制剤＞
　本発明の樹脂組成物は、マイグレーション抑制剤を更に含むことが好ましい。マイグレーション抑制剤を含むことにより、例えば、樹脂組成物を金属層（又は金属配線）に適用して膜を形成した際に、金属層（又は金属配線）由来の金属イオンが膜内へ移動することを効果的に抑制することができる。 <Migration inhibitor>
It is preferable that the resin composition of the present invention further contains a migration inhibitor. By including a migration inhibitor, for example, when a resin composition is applied to a metal layer (or metal wiring) to form a film, metal ions derived from the metal layer (or metal wiring) may migrate into the film. can be effectively suppressed.
　マイグレーション抑制剤としては、特に制限はないが、複素環（ピロール環、フラン環、チオフェン環、イミダゾール環、オキサゾール環、チアゾール環、ピラゾール環、イソオキサゾール環、イソチアゾール環、テトラゾール環、ピリジン環、ピリダジン環、ピリミジン環、ピラジン環、ピペリジン環、ピペラジン環、モルホリン環、２Ｈ－ピラン環及び６Ｈ－ピラン環、トリアジン環）を有する化合物、チオ尿素類及びスルファニル基を有する化合物、ヒンダードフェノール系化合物、サリチル酸誘導体系化合物、ヒドラジド誘導体系化合物が挙げられる。特に、１，２，４－トリアゾール、ベンゾトリアゾール、３－アミノ－１，２，４－トリアゾール、３，５－ジアミノ－１，２，４－トリアゾール等のトリアゾール系化合物、１Ｈ－テトラゾール、５－フェニルテトラゾール、５－アミノ―１Ｈ－テトラゾール等のテトラゾール系化合物が好ましく使用できる。
　また、耐湿熱性の観点からは、樹脂組成物はアゾール構造を有する化合物を更に含むことが好ましい。アゾール構造とは、環員として窒素原子を含む５員環構造をいい、環員として２以上の窒素原子を含む５員環構造であることが好ましい。具体的には、アゾール構造は、イミダゾール構造、トリアゾール構造、テトラゾール構造等が挙げられる。これらの構造は、ベンゾイミダゾール、ベンゾトリアゾールなどのように、他の環構造と縮合等により多環を形成していてもよい。
　また、アゾール構造を有する化合物としては、アゾール構造に下記式（Ｒ－１）又は下記式（Ｒ－２）で表される基が直接結合した化合物が好ましい。

　式（Ｒ－１）中、Ｒ１は１価の有機基を表し、＊はアゾール構造との結合部位を表す。
　式（Ｒ－２）中、Ｒ２は水素原子又は１価の有機基を表し、Ｒ３は１価の有機基を表し、＊はアゾール構造との結合部位を表す。
　式（Ｒ－１）中、Ｒ１は炭化水素基、又は、炭化水素基と、－Ｏ－、－Ｃ（＝Ｏ）－、－Ｓ－、－Ｓ（＝Ｏ）２－及び－ＮＲＮ－からなる群より選ばれた少なくとも１種の基との結合により表される基であることが好ましい。ＲＮは上述の通りである。
　上記炭化水素基としては、脂肪族炭化水素基、芳香族炭化水素基又はこれらの組み合わせにより表される基が好ましい。
　また、Ｒ１の総炭素数は１～３０が好ましく、２～２５が好ましく、３～２０がより好ましい。
　Ｒ１における、式（Ｒ－１）中のカルボニル基との結合部位は、炭化水素基又は－ＮＲＮ－が好ましい。
　式（Ｒ－１）中、＊はアゾール構造との結合部位を表し、アゾール構造の環員である炭素原子との結合部位であることが好ましい。
　式（Ｒ－２）中、Ｒ２は水素原子であることが好ましい。
　Ｒ２が１価の有機基である場合、Ｒ２は、炭化水素基、又は、炭化水素基と、－Ｏ－、－Ｃ（＝Ｏ）－、－Ｓ－、－Ｓ（＝Ｏ）２－及び－ＮＲＮ－からなる群より選ばれた少なくとも１種の基との結合により表される基であることが好ましい。ＲＮは上述の通りである。
　上記炭化水素基としては、脂肪族炭化水素基、芳香族炭化水素基又はこれらの組み合わせにより表される基が好ましい。
　また、Ｒ２が１価の有機基である場合の総炭素数は１～３０が好ましく、２～２５が好ましく、３～２０がより好ましい。
　Ｒ２が１価の有機基である場合、Ｒ２における式（Ｒ－２）中の窒素原子との結合部位は、炭化水素基又は－Ｃ（＝Ｏ）－が好ましい。
　式（Ｒ－２）中、Ｒ３は炭化水素基、又は、炭化水素基と、－Ｏ－、－Ｃ（＝Ｏ）－、－Ｓ－、－Ｓ（＝Ｏ）２－及び－ＮＲＮ－からなる群より選ばれた少なくとも１種の基との結合により表される基であることが好ましい。ＲＮは上述の通りである。
　上記炭化水素基としては、脂肪族炭化水素基、芳香族炭化水素基又はこれらの組み合わせにより表される基が好ましい。
　また、Ｒ３が１価の有機基である場合の総炭素数は１～３０が好ましく、２～２５が好ましく、３～２０がより好ましい。
　Ｒ３における、式（Ｒ－２）中の窒素原子との結合部位は、炭化水素基又は－Ｃ（＝Ｏ）－が好ましい。
　式（Ｒ－１）中、＊はアゾール構造との結合部位を表し、アゾール構造の環員である炭素原子との結合部位であることが好ましい。 Migration inhibitors are not particularly limited, but include heterocycles (pyrrole ring, furan ring, thiophene ring, imidazole ring, oxazole ring, thiazole ring, pyrazole ring, isoxazole ring, isothiazole ring, tetrazole ring, pyridine ring, pyridazine ring, pyrimidine ring, pyrazine ring, piperidine ring, piperazine ring, morpholine ring, 2H-pyran ring, 6H-pyran ring, triazine ring), compounds having thioureas and sulfanyl groups, hindered phenol compounds , salicylic acid derivative compounds, and hydrazide derivative compounds. In particular, triazole compounds such as 1,2,4-triazole, benzotriazole, 3-amino-1,2,4-triazole, 3,5-diamino-1,2,4-triazole, 1H-tetrazole, 5- Tetrazole compounds such as phenyltetrazole and 5-amino-1H-tetrazole can be preferably used.
Moreover, from the viewpoint of heat and humidity resistance, it is preferable that the resin composition further contains a compound having an azole structure. The azole structure refers to a five-membered ring structure containing a nitrogen atom as a ring member, and preferably a five-membered ring structure containing two or more nitrogen atoms as a ring member. Specifically, examples of the azole structure include an imidazole structure, a triazole structure, and a tetrazole structure. These structures may form a polycyclic ring by condensation with other ring structures, such as benzimidazole and benzotriazole.
Further, as the compound having an azole structure, a compound in which a group represented by the following formula (R-1) or the following formula (R-2) is directly bonded to the azole structure is preferable.

In formula (R-1), R 1 represents a monovalent organic group, and * represents a bonding site with an azole structure.
In formula (R-2), R 2 represents a hydrogen atom or a monovalent organic group, R 3 represents a monovalent organic group, and * represents a bonding site with an azole structure.
In formula (R-1), R 1 is a hydrocarbon group, or a hydrocarbon group and -O-, -C(=O)-, -S-, -S(=O) 2 - and -NR N A group represented by a bond with at least one group selected from the group consisting of - is preferable. R N is as described above.
The hydrocarbon group is preferably an aliphatic hydrocarbon group, an aromatic hydrocarbon group, or a combination thereof.
Further, the total number of carbon atoms in R 1 is preferably 1 to 30, preferably 2 to 25, and more preferably 3 to 20.
The bonding site in R 1 with the carbonyl group in formula (R-1) is preferably a hydrocarbon group or -NR N -.
In formula (R-1), * represents a bonding site with an azole structure, and is preferably a bonding site with a carbon atom that is a ring member of the azole structure.
In formula (R-2), R 2 is preferably a hydrogen atom.
When R 2 is a monovalent organic group, R 2 is a hydrocarbon group, or a hydrocarbon group and -O-, -C(=O)-, -S-, -S(=O) 2 A group represented by a bond with at least one group selected from the group consisting of - and -NR N - is preferable. R N is as described above.
The hydrocarbon group is preferably an aliphatic hydrocarbon group, an aromatic hydrocarbon group, or a combination thereof.
Further, when R 2 is a monovalent organic group, the total number of carbon atoms is preferably 1 to 30, preferably 2 to 25, and more preferably 3 to 20.
When R 2 is a monovalent organic group, the bonding site in R 2 with the nitrogen atom in formula (R-2) is preferably a hydrocarbon group or -C(=O)-.
In formula (R-2), R 3 is a hydrocarbon group, or a hydrocarbon group and -O-, -C(=O)-, -S-, -S(=O) 2 - and -NR N A group represented by a bond with at least one group selected from the group consisting of - is preferable. R N is as described above.
The hydrocarbon group is preferably an aliphatic hydrocarbon group, an aromatic hydrocarbon group, or a combination thereof.
Further, when R 3 is a monovalent organic group, the total number of carbon atoms is preferably 1 to 30, preferably 2 to 25, and more preferably 3 to 20.
The bonding site in R 3 with the nitrogen atom in formula (R-2) is preferably a hydrocarbon group or -C(=O)-.
In formula (R-1), * represents a bonding site with an azole structure, and is preferably a bonding site with a carbon atom that is a ring member of the azole structure.
　アゾール構造を有する化合物の好ましい具体例を以下に示すが、本発明はこれらに限定されるものではない。
Preferred specific examples of compounds having an azole structure are shown below, but the present invention is not limited thereto.
　マイグレーション抑制剤としては、ハロゲンイオンなどの陰イオンを捕捉するイオントラップ剤を使用することもできる。 As the migration inhibitor, an ion trapping agent that traps anions such as halogen ions can also be used.
　その他のマイグレーション抑制剤としては、例えば、その他のマイグレーション抑制剤としては、特開２０１３－０１５７０１号公報の段落００９４に記載の防錆剤、特開２００９－２８３７１１号公報の段落００７３～００７６に記載の化合物、特開２０１１－０５９６５６号公報の段落００５２に記載の化合物、特開２０１２－１９４５２０号公報の段落０１１４、０１１６及び０１１８に記載の化合物、国際公開第２０１５／１９９２１９号の段落０１６６に記載の化合物などを使用することができ、この内容は本明細書に組み込まれる。 Other migration inhibitors include, for example, the rust inhibitors described in paragraph 0094 of JP-A No. 2013-015701, and the rust inhibitors described in paragraphs 0073 to 0076 of JP-A-2009-283711. Compounds, compounds described in paragraph 0052 of JP 2011-059656, compounds described in paragraphs 0114, 0116, and 0118 of JP 2012-194520, compounds described in paragraph 0166 of WO 2015/199219 etc., the contents of which are incorporated herein.
　マイグレーション抑制剤の具体例としては、下記化合物を挙げることができる。 Specific examples of migration inhibitors include the following compounds.
　本発明の樹脂組成物がマイグレーション抑制剤を有する場合、マイグレーション抑制剤の含有量は、樹脂組成物の全固形分に対して、０．０１～５．０質量％であることが好ましく、０．０５～２．０質量％であることがより好ましく、０．１～１．０質量％であることが更に好ましい。 When the resin composition of the present invention has a migration inhibitor, the content of the migration inhibitor is preferably 0.01 to 5.0% by mass, and 0.01 to 5.0% by mass based on the total solid content of the resin composition. The amount is more preferably 0.05 to 2.0% by weight, and even more preferably 0.1 to 1.0% by weight.
　マイグレーション抑制剤は１種のみでもよいし、２種以上であってもよい。マイグレーション抑制剤が２種以上の場合は、その合計が上記範囲であることが好ましい。 Only one type of migration inhibitor may be used, or two or more types may be used. When there are two or more types of migration inhibitors, it is preferable that the total is within the above range.
＜重合禁止剤＞
　本発明の樹脂組成物は、重合禁止剤を含むことが好ましい。重合禁止剤としてはフェノール系化合物、キノン系化合物、アミノ系化合物、Ｎ－オキシルフリーラジカル化合物系化合物、ニトロ系化合物、ニトロソ系化合物、ヘテロ芳香環系化合物、金属化合物などが挙げられる。 <Polymerization inhibitor>
It is preferable that the resin composition of the present invention contains a polymerization inhibitor. Examples of the polymerization inhibitor include phenolic compounds, quinone compounds, amino compounds, N-oxyl free radical compounds, nitro compounds, nitroso compounds, heteroaromatic compounds, and metal compounds.
　重合禁止剤の具体的な化合物としては、国際公開第２０２１／１１２１８９の段落０３１０に記載の化合物、ｐ－ヒドロキノン、ｏ－ヒドロキノン、４－ヒドロキシ－２，２，６，６－テトラメチルピペリジン１－オキシルフリーラジカル、フェノキサジン等が挙げられる。この内容は本明細書に組み込まれる。 Specific compounds of the polymerization inhibitor include the compound described in paragraph 0310 of International Publication No. 2021/112189, p-hydroquinone, o-hydroquinone, 4-hydroxy-2,2,6,6-tetramethylpiperidine 1- Examples include oxyl free radical and phenoxazine. This content is incorporated herein.
　本発明の樹脂組成物が重合禁止剤を有する場合、重合禁止剤の含有量は、樹脂組成物の全固形分に対して、０．０１～２０質量％であることが好ましく、０．０２～１５質量％であることがより好ましく、０．０５～１０質量％であることが更に好ましい。 When the resin composition of the present invention has a polymerization inhibitor, the content of the polymerization inhibitor is preferably 0.01 to 20% by mass, and 0.02 to 20% by mass based on the total solid content of the resin composition. It is more preferably 15% by mass, and even more preferably 0.05 to 10% by mass.
　重合禁止剤は１種のみでもよいし、２種以上であってもよい。重合禁止剤が２種以上の場合は、その合計が上記範囲であることが好ましい。 Only one type of polymerization inhibitor may be used, or two or more types may be used. When there are two or more types of polymerization inhibitors, it is preferable that the total is within the above range.
＜その他の添加剤＞
　本発明の樹脂組成物は、本発明の効果が得られる範囲で、必要に応じて、各種の添加物、例えば、界面活性剤、高級脂肪酸誘導体、熱重合開始剤、無機粒子、紫外線吸収剤、有機チタン化合物、酸化防止剤、凝集防止剤、フェノール系化合物、他の高分子化合物、可塑剤及びその他の助剤類（例えば、消泡剤、難燃剤など）等を含んでいてもよい。これらの成分を適宜含有させることにより、膜物性などの性質を調整することができる。これらの成分は、例えば、特開２０１２－００３２２５号公報の段落番号０１８３以降（対応する米国特許出願公開第２０１３／００３４８１２号明細書の段落番号０２３７）の記載、特開２００８－２５００７４号公報の段落番号０１０１～０１０４、０１０７～０１０９等の記載を参酌でき、これらの内容は本明細書に組み込まれる。これらの添加剤を配合する場合、その合計含有量は本発明の樹脂組成物の固形分の３質量％以下とすることが好ましい。 <Other additives>
The resin composition of the present invention may optionally contain various additives, such as surfactants, higher fatty acid derivatives, thermal polymerization initiators, inorganic particles, ultraviolet absorbers, It may contain organic titanium compounds, antioxidants, anti-aggregation agents, phenolic compounds, other polymer compounds, plasticizers, and other auxiliary agents (for example, antifoaming agents, flame retardants, etc.). By appropriately containing these components, properties such as film physical properties can be adjusted. These components are described, for example, in JP-A No. 2012-003225, paragraph number 0183 and subsequent paragraphs (corresponding US Patent Application Publication No. 2013/0034812, paragraph number 0237), and in JP-A-2008-250074, paragraph number 0237 and thereafter. The descriptions of numbers 0101 to 0104, 0107 to 0109, etc. can be referred to, and the contents thereof are incorporated into the present specification. When blending these additives, their total content is preferably 3% by mass or less based on the solid content of the resin composition of the present invention.
〔界面活性剤〕
　界面活性剤としては、フッ素系界面活性剤、シリコーン系界面活性剤、炭化水素系界面活性剤などの各種界面活性剤を使用できる。界面活性剤はノニオン型界面活性剤であってもよく、カチオン型界面活性剤であってもよく、アニオン型界面活性剤であってもよい。 [Surfactant]
As the surfactant, various surfactants such as fluorine surfactants, silicone surfactants, and hydrocarbon surfactants can be used. The surfactant may be a nonionic surfactant, a cationic surfactant, or an anionic surfactant.
　本発明の感光性樹脂組成物に界面活性剤を含有させることで、塗布液組成物を調製したときの液特性（特に、流動性）がより向上し、塗布厚の均一性や省液性をより改善することができる。即ち、界面活性剤を含有する塗布液を用いて膜形成する場合、被塗布面と塗布液との界面張力が低下して、被塗布面への濡れ性が改善され、被塗布面への塗布性が向上する。このため、厚みムラが小さい均一な膜の形成をより好適に行うことができる。 By incorporating a surfactant into the photosensitive resin composition of the present invention, the liquid properties (especially fluidity) when a coating liquid composition is prepared are further improved, and the uniformity of coating thickness and liquid saving are improved. It can be further improved. That is, when forming a film using a coating solution containing a surfactant, the interfacial tension between the surface to be coated and the coating solution is reduced, improving the wettability of the surface to be coated, and making it easier to coat the surface. Improves sex. Therefore, a uniform film with small thickness unevenness can be more suitably formed.
　フッ素系界面活性剤としては、国際公開第２０２１／１１２１８９号の段落０３２８に記載の化合物が挙げられ、この内容は本明細書に組み込まれる。
　フッ素系界面活性剤としては、フッ素原子を有する（メタ）アクリレート化合物に由来する繰り返し単位と、アルキレンオキシ基（好ましくはエチレンオキシ基、プロピレンオキシ基）を２以上（好ましくは５以上）有する（メタ）アクリレート化合物に由来する繰り返し単位と、を含む含フッ素高分子化合物も好ましく用いることができ、例えば、下記化合物が挙げられる。
Examples of the fluorine-based surfactant include compounds described in paragraph 0328 of International Publication No. 2021/112189, the content of which is incorporated herein.
As the fluorine-based surfactant, a repeating unit derived from a (meth)acrylate compound having a fluorine atom and a (meth) having 2 or more (preferably 5 or more) alkyleneoxy groups (preferably ethyleneoxy group, propyleneoxy group) are used. ) A fluorine-containing polymer compound containing a repeating unit derived from an acrylate compound can also be preferably used, and examples thereof include the following compounds.
　上記化合物の重量平均分子量は、３，０００～５０，０００であることが好ましく、５，０００～３０，０００であることがより好ましい。
　フッ素系界面活性剤は、エチレン性不飽和結合を側鎖に有する含フッ素重合体をフッ素系界面活性剤として用いることもできる。具体例としては、特開２０１０－１６４９６５号公報の段落００５０～００９０および段落０２８９～０２９５に記載された化合物が挙げられ、この内容は本明細書に組み込まれる。また、市販品としては、例えばＤＩＣ（株）製のメガファックＲＳ－１０１、ＲＳ－１０２、ＲＳ－７１８Ｋ等が挙げられる。 The weight average molecular weight of the above compound is preferably 3,000 to 50,000, more preferably 5,000 to 30,000.
As the fluorine-based surfactant, a fluorine-containing polymer having an ethylenically unsaturated bond in its side chain can also be used as the fluorine-based surfactant. Specific examples include compounds described in paragraphs 0050 to 0090 and paragraphs 0289 to 0295 of JP-A-2010-164965, the contents of which are incorporated herein. Commercially available products include, for example, Megafac RS-101, RS-102, and RS-718K manufactured by DIC Corporation.
　フッ素系界面活性剤中のフッ素含有率は、３～４０質量％が好ましく、５～３０質量％がより好ましく、７～２５質量％が特に好ましい。フッ素含有率がこの範囲内であるフッ素系界面活性剤は、塗布膜の厚さの均一性や省液性の点で効果的であり、組成物中における溶解性も良好である。 The fluorine content in the fluorine surfactant is preferably 3 to 40% by mass, more preferably 5 to 30% by mass, and particularly preferably 7 to 25% by mass. A fluorine-based surfactant having a fluorine content within this range is effective in terms of uniformity of coating film thickness and liquid saving, and has good solubility in the composition.
　シリコーン系界面活性剤、炭化水素系界面活性剤、ノニオン型界面活性剤、カチオン型界面活性剤、アニオン型界面活性剤としては、それぞれ、国際公開第２０２１／１１２１８９号の段落０３２９～０３３４に記載の化合物が挙げられ、この内容は本明細書に組み込まれる。 Silicone surfactants, hydrocarbon surfactants, nonionic surfactants, cationic surfactants, and anionic surfactants are each described in paragraphs 0329 to 0334 of International Publication No. 2021/112189. compounds, the contents of which are incorporated herein.
　界面活性剤は、１種のみを用いてもよいし、２種類以上を組み合わせてもよい。
界面活性剤の含有量は、組成物の全固形分に対して、０．００１～２．０質量％が好ましく、０．００５～１．０質量％がより好ましい。 Only one type of surfactant may be used, or two or more types may be used in combination.
The content of the surfactant is preferably 0.001 to 2.0% by mass, more preferably 0.005 to 1.0% by mass, based on the total solid content of the composition.
〔高級脂肪酸誘導体〕
　本発明の樹脂組成物は、酸素に起因する重合阻害を防止するために、ベヘン酸やベヘン酸アミドのような高級脂肪酸誘導体を添加して、塗布後の乾燥の過程で本発明の樹脂組成物の表面に偏在させてもよい。 [Higher fatty acid derivative]
In order to prevent polymerization inhibition caused by oxygen, higher fatty acid derivatives such as behenic acid and behenic acid amide are added to the resin composition of the present invention during the drying process after application. It may be unevenly distributed on the surface.
　また、高級脂肪酸誘導体は、国際公開第２０１５／１９９２１９号の段落０１５５に記載の化合物を用いることもでき、この内容は本明細書に組み込まれる。 Further, as the higher fatty acid derivative, a compound described in paragraph 0155 of International Publication No. 2015/199219 can also be used, the content of which is incorporated herein.
　樹脂組成物が高級脂肪酸誘導体を有する場合、高級脂肪酸誘導体の含有量は、樹脂組成物の全固形分に対して、０．１～１０質量％であることが好ましい。高級脂肪酸誘導体は１種のみでもよいし、２種以上であってもよい。高級脂肪酸誘導体が２種以上の場合は、その合計が上記範囲であることが好ましい。 When the resin composition has a higher fatty acid derivative, the content of the higher fatty acid derivative is preferably 0.1 to 10% by mass based on the total solid content of the resin composition. There may be only one type of higher fatty acid derivative, or two or more types may be used. When there are two or more types of higher fatty acid derivatives, it is preferable that the total is within the above range.
〔熱重合開始剤〕
　熱重合開始剤としては、例えば、熱ラジカル重合開始剤が挙げられる。熱ラジカル重合開始剤は、熱のエネルギーによってラジカルを発生し、重合性を有する化合物の重合反応を開始又は促進させる化合物である。熱ラジカル重合開始剤を添加することによって樹脂及び重合性化合物の重合反応を進行させることもできるので、より耐溶剤性を向上できる。また、光重合開始剤も熱により重合を開始する機能を有する場合があり、熱重合開始剤として添加することができる場合がある。 [Thermal polymerization initiator]
Examples of the thermal polymerization initiator include thermal radical polymerization initiators. A thermal radical polymerization initiator is a compound that generates radicals using thermal energy and initiates or accelerates the polymerization reaction of a compound having polymerizability. By adding a thermal radical polymerization initiator, the polymerization reaction between the resin and the polymerizable compound can be advanced, so that the solvent resistance can be further improved. Further, a photopolymerization initiator may also have a function of initiating polymerization by heat, and may be added as a thermal polymerization initiator.
　熱ラジカル重合開始剤として、具体的には、特開２００８－０６３５５４号公報の段落００７４～０１１８に記載されている化合物が挙げられ、この内容は本明細書に組み込まれる。 Specific examples of the thermal radical polymerization initiator include compounds described in paragraphs 0074 to 0118 of JP-A No. 2008-063554, the contents of which are incorporated herein.
　熱重合開始剤を含む場合、その含有量は、樹脂組成物の全固形分に対し０．１～３０質量％であることが好ましく、０．１～２０質量％であることがより好ましく、０．５～１５質量％であることが更に好ましい。熱重合開始剤は１種のみ含有していてもよいし、２種以上含有していてもよい。熱重合開始剤を２種以上含有する場合は、合計量が上記範囲であることが好ましい。 When a thermal polymerization initiator is included, its content is preferably 0.1 to 30% by mass, more preferably 0.1 to 20% by mass, based on the total solid content of the resin composition. More preferably, the amount is .5 to 15% by mass. The thermal polymerization initiator may contain only one type, or may contain two or more types. When containing two or more types of thermal polymerization initiators, it is preferable that the total amount is within the above range.
〔無機粒子〕
　無機粒子として、具体的には、炭酸カルシウム、リン酸カルシウム、シリカ、カオリン、タルク、二酸化チタン、アルミナ、硫酸バリウム、フッ化カルシウム、フッ化リチウム、ゼオライト、硫化モリブデン、ガラス等が挙げられる。 [Inorganic particles]
Specific examples of the inorganic particles include calcium carbonate, calcium phosphate, silica, kaolin, talc, titanium dioxide, alumina, barium sulfate, calcium fluoride, lithium fluoride, zeolite, molybdenum sulfide, and glass.
　無機粒子の平均粒子径は、０．０１～２．０μｍが好ましく、０．０２～１．５μｍがより好ましく、０．０３～１．０μｍがさらに好ましく、０．０４～０．５μｍが特に好ましい。
　無機粒子の上記平均粒子径は、一次粒子径であり、また体積平均粒子径である。体積平均粒子径は、例えば、Ｎａｎｏｔｒａｃ ＷＡＶＥ　II ＥＸ－１５０（日機装社製）による動的光散乱法で測定できる。
　上記測定が困難である場合は、遠心沈降光透過法、Ｘ線透過法、レーザー回折・散乱法で測定することもできる。 The average particle diameter of the inorganic particles is preferably 0.01 to 2.0 μm, more preferably 0.02 to 1.5 μm, even more preferably 0.03 to 1.0 μm, and particularly preferably 0.04 to 0.5 μm. .
The above average particle diameter of the inorganic particles is a primary particle diameter and a volume average particle diameter. The volume average particle diameter can be measured, for example, by a dynamic light scattering method using Nanotrac WAVE II EX-150 (manufactured by Nikkiso Co., Ltd.).
If the above measurement is difficult, measurement can also be performed by centrifugal sedimentation light transmission method, X-ray transmission method, or laser diffraction/scattering method.
〔紫外線吸収剤〕
　紫外線吸収剤としては、サリシレート系、ベンゾフェノン系、ベンゾトリアゾール系、置換アクリロニトリル系、トリアジン系などの紫外線吸収剤が挙げられる。
　紫外線吸収剤の具体例としては、国際公開第２０２１／１１２１８９号の段落０３４１～０３４２に記載の化合物が挙げられ、この内容は本明細書に組み込まれる。 [Ultraviolet absorber]
Examples of the ultraviolet absorber include salicylate-based, benzophenone-based, benzotriazole-based, substituted acrylonitrile-based, and triazine-based ultraviolet absorbers.
Specific examples of ultraviolet absorbers include compounds described in paragraphs 0341 to 0342 of International Publication No. 2021/112189, the contents of which are incorporated herein.
　紫外線吸収剤は一種を単独で用いてもよく、二種以上を組み合わせて用いてもよい。
　樹脂組成物が紫外線吸収剤を含む場合、紫外線吸収剤の含有量は、樹脂組成物の全固形分質量に対して、０．００１質量％以上１質量％以下であることが好ましく、０．０１質量％以上０．１質量％以下であることがより好ましい。 One type of ultraviolet absorber may be used alone, or two or more types may be used in combination.
When the resin composition contains an ultraviolet absorber, the content of the ultraviolet absorber is preferably 0.001% by mass or more and 1% by mass or less, and 0.01% by mass or less, based on the total solid mass of the resin composition. More preferably, the amount is 0.1% by mass or more and 0.1% by mass or less.
〔有機チタン化合物〕 
　樹脂組成物が有機チタン化合物を含有することにより、低温で硬化した場合であっても耐薬品性に優れる樹脂層を形成できる。 [Organotitanium compound]
When the resin composition contains an organic titanium compound, a resin layer having excellent chemical resistance can be formed even when cured at a low temperature.
　使用可能な有機チタン化合物としては、チタン原子に有機基が共有結合又はイオン結合を介して結合しているものが挙げられる。
　有機チタン化合物の具体例を、以下のＩ）～ＶＩＩ）に示す：
　Ｉ）チタンキレート化合物：樹脂組成物の保存安定性がよく、良好な硬化パターンが得られることから、アルコキシ基を２個以上有するチタンキレート化合物がより好ましい。具体的な例は、チタニウムビス（トリエタノールアミン）ジイソプロポキサイド、チタニウムジ（ｎ－ブトキサイド）ビス（２，４－ペンタンジオネート）、チタニウムジイソプロポキサイドビス（２，４－ペンタンジオネート）、チタニウムジイソプロポキサイドビス（テトラメチルヘプタンジオネート）、チタニウムジイソプロポキサイドビス（エチルアセトアセテート）等である。
　ＩＩ）テトラアルコキシチタン化合物：例えば、チタニウムテトラ（ｎ－ブトキサイド）、チタニウムテトラエトキサイド、チタニウムテトラ（２－エチルヘキソキサイド）、チタニウムテトライソブトキサイド、チタニウムテトライソプロポキサイド、チタニウムテトラメトキサイド、チタニウムテトラメトキシプロポキサイド、チタニウムテトラメチルフェノキサイド、チタニウムテトラ（ｎ－ノニロキサイド）、チタニウムテトラ（ｎ－プロポキサイド）、チタニウムテトラステアリロキサイド、チタニウムテトラキス［ビス｛２，２－（アリロキシメチル）ブトキサイド｝］等である。
　ＩＩＩ）チタノセン化合物：例えば、ペンタメチルシクロペンタジエニルチタニウムトリメトキサイド、ビス（η５－２，４－シクロペンタジエン－１－イル）ビス（２，６－ジフルオロフェニル）チタニウム、ビス（η５－２，４－シクロペンタジエン－１－イル）ビス（２，６－ジフルオロ－３－（１Ｈ－ピロール－１－イル）フェニル）チタニウム等である。
　ＩＶ）モノアルコキシチタン化合物：例えば、チタニウムトリス（ジオクチルホスフェート）イソプロポキサイド、チタニウムトリス（ドデシルベンゼンスルホネート）イソプロポキサイド等である。
　Ｖ）チタニウムオキサイド化合物：例えば、チタニウムオキサイドビス（ペンタンジオネート）、チタニウムオキサイドビス（テトラメチルヘプタンジオネート）、フタロシアニンチタニウムオキサイド等である。
　ＶＩ）チタニウムテトラアセチルアセトネート化合物：例えば、チタニウムテトラアセチルアセトネート等である。
ＶＩＩ）チタネートカップリング剤：例えば、イソプロピルトリドデシルベンゼンスルホニルチタネート等である。 Examples of organic titanium compounds that can be used include those in which an organic group is bonded to a titanium atom via a covalent bond or an ionic bond.
Specific examples of organic titanium compounds are shown in I) to VII) below:
I) Titanium chelate compound: A titanium chelate compound having two or more alkoxy groups is more preferred because the resin composition has good storage stability and a good curing pattern can be obtained. Specific examples include titanium bis(triethanolamine) diisopropoxide, titanium di(n-butoxide) bis(2,4-pentanedionate), titanium diisopropoxide bis(2,4-pentanedionate). ), titanium diisopropoxide bis(tetramethylheptanedionate), titanium diisopropoxide bis(ethyl acetoacetate), etc.
II) Tetraalkoxytitanium compounds: for example, titanium tetra(n-butoxide), titanium tetraethoxide, titanium tetra(2-ethylhexoxide), titanium tetraisobutoxide, titanium tetraisopropoxide, titanium tetramethoxide , titanium tetramethoxypropoxide, titanium tetramethyl phenoxide, titanium tetra(n-nonyloxide), titanium tetra(n-propoxide), titanium tetrastearyloxide, titanium tetrakis[bis{2,2-(allyloxymethyl)] butoxide}], etc.
III) Titanocene compounds: for example, pentamethylcyclopentadienyl titanium trimethoxide, bis(η5-2,4-cyclopentadien-1-yl)bis(2,6-difluorophenyl)titanium, bis(η5-2, 4-cyclopentadien-1-yl)bis(2,6-difluoro-3-(1H-pyrrol-1-yl)phenyl)titanium and the like.
IV) Monoalkoxytitanium compounds: For example, titanium tris(dioctyl phosphate) isopropoxide, titanium tris(dodecylbenzenesulfonate) isopropoxide, and the like.
V) Titanium oxide compound: For example, titanium oxide bis(pentanedionate), titanium oxide bis(tetramethylheptanedionate), phthalocyanine titanium oxide, etc.
VI) Titanium tetraacetylacetonate compound: For example, titanium tetraacetylacetonate.
VII) Titanate coupling agent: for example, isopropyl tridodecyl benzenesulfonyl titanate.
　なかでも、有機チタン化合物としては、より良好な耐薬品性の観点から、上記Ｉ）チタンキレート化合物、ＩＩ）テトラアルコキシチタン化合物、及びＩＩＩ）チタノセン化合物からなる群より選ばれる少なくとも１種の化合物であることが好ましい。特に、チタニウムジイソプロポキサイドビス（エチルアセトアセテート）、チタニウムテトラ（ｎ－ブトキサイド）、及びビス（η５－２，４－シクロペンタジエン－１－イル）ビス（２，６－ジフルオロ－３－（１Ｈ－ピロール－１－イル）フェニル）チタニウムが好ましい。 Among them, from the viewpoint of better chemical resistance, the organic titanium compound is at least one compound selected from the group consisting of I) titanium chelate compounds, II) tetraalkoxytitanium compounds, and III) titanocene compounds. It is preferable that there be. In particular, titanium diisopropoxide bis(ethylacetoacetate), titanium tetra(n-butoxide), and bis(η5-2,4-cyclopentadien-1-yl)bis(2,6-difluoro-3-(1H -pyrrol-1-yl)phenyl)titanium is preferred.
　有機チタン化合物を含む場合、その含有量は、特定樹脂１００質量部に対し、０．０５～１０質量部であることが好ましく、０．１～２質量部であることがより好ましい。含有量が０．０５質量部以上である場合、得られる硬化パターンの耐熱性及び耐薬品性がより良好となり、１０質量部以下である場合、組成物の保存安定性により優れる。 When an organic titanium compound is included, its content is preferably 0.05 to 10 parts by mass, more preferably 0.1 to 2 parts by mass, based on 100 parts by mass of the specific resin. When the content is 0.05 parts by mass or more, the resulting cured pattern has better heat resistance and chemical resistance, and when the content is 10 parts by mass or less, the storage stability of the composition is better.
〔酸化防止剤〕
　添加剤として酸化防止剤を含有することで、硬化後の膜の伸度特性や、金属材料との密着性を向上させることができる。酸化防止剤としては、フェノール化合物、亜リン酸エステル化合物、チオエーテル化合物などが挙げられる。酸化防止剤の具体例としては、国際公開第２０２１／１１２１８９号の段落０３４８～０３５７に記載の化合物が挙げられ、この内容は本明細書に組み込まれる。 〔Antioxidant〕
By containing an antioxidant as an additive, the elongation characteristics of the cured film and the adhesion to the metal material can be improved. Examples of antioxidants include phenol compounds, phosphite compounds, thioether compounds, and the like. Specific examples of antioxidants include compounds described in paragraphs 0348 to 0357 of International Publication No. 2021/112189, the contents of which are incorporated herein.
　酸化防止剤の含有量は、特定樹脂１００質量部に対し、０．１～１０質量部が好ましく、０．５～５質量部がより好ましい。添加量を０．１質量部以上とすることにより、高温高湿環境下においても伸度特性や金属材料に対する密着性向上の効果が得られやすく、また１０質量部以下とすることにより、例えば感光剤との相互作用により、樹脂組成物の感度が向上する。酸化防止剤は１種のみを用いてもよく、２種以上を用いてもよい。２種以上を用いる場合は、それらの合計量が上記範囲となることが好ましい。 The content of the antioxidant is preferably 0.1 to 10 parts by mass, more preferably 0.5 to 5 parts by mass, per 100 parts by mass of the specific resin. By setting the addition amount to 0.1 parts by mass or more, it is easy to obtain the effect of improving elongation properties and adhesion to metal materials even in high temperature and high humidity environments, and by setting the addition amount to 10 parts by mass or less, for example, photosensitive The interaction with the agent improves the sensitivity of the resin composition. Only one type of antioxidant may be used, or two or more types may be used. When two or more types are used, it is preferable that their total amount falls within the above range.
〔凝集防止剤〕
　凝集防止剤としては、ポリアクリル酸ナトリウム等が挙げられる。 [Agglomeration inhibitor]
Examples of anti-aggregation agents include sodium polyacrylate.
　凝集防止剤は一種を単独で用いてもよく、二種以上を組み合わせて用いてもよい。
　樹脂組成物が凝集防止剤を含む場合、凝集防止剤の含有量は、樹脂組成物の全固形分質量に対して、０．０１質量％以上１０質量％以下であることが好ましく、０．０２質量％以上５質量％以下であることがより好ましい。 The anti-aggregation agents may be used alone or in combination of two or more.
When the resin composition contains an anti-aggregation agent, the content of the anti-aggregation agent is preferably 0.01% by mass or more and 10% by mass or less, and 0.02% by mass or less, based on the total solid mass of the resin composition. More preferably, it is at least 5% by mass and not more than 5% by mass.
〔フェノール系化合物〕
　フェノール系化合物としては、Ｂｉｓ－Ｚ、ＢｉｓＰ－ＥＺ、ＴｅｋＰ－４ＨＢＰＡ、ＴｒｉｓＰ－ＨＡＰ、ＴｒｉｓＰ－ＰＡ、ＢｉｓＯＣＨＰ－Ｚ、ＢｉｓＰ－ＭＺ、ＢｉｓＰ－ＰＺ、ＢｉｓＰ－ＩＰＺ、ＢｉｓＯＣＰ－ＩＰＺ、ＢｉｓＰ－ＣＰ、ＢｉｓＲＳ－２Ｐ、ＢｉｓＲＳ－３Ｐ、ＢｉｓＰ－ＯＣＨＰ、メチレントリス－ＦＲ－ＣＲ、ＢｉｓＲＳ－２６Ｘ（以上、商品名、本州化学工業（株）製）、ＢＩＰ－ＰＣ、ＢＩＲ－ＰＣ、ＢＩＲ－ＰＴＢＰ、ＢＩＲ－ＢＩＰＣ－Ｆ（以上、商品名、旭有機材（株）製）等が挙げられる。 [Phenol compounds]
As phenolic compounds, Bis-Z, BisP-EZ, TekP-4HBPA, TrisP-HAP, TrisP-PA, BisOCHP-Z, BisP-MZ, BisP-PZ, BisP-IPZ, BisOCP-IPZ, BisP-CP, BisRS-2P, BisRS-3P, BisP-OCHP, Methylene Tris-FR-CR, BisRS-26X (all product names, manufactured by Honshu Chemical Industry Co., Ltd.), BIP-PC, BIR-PC, BIR-PTBP, BIR -BIPC-F (trade name, manufactured by Asahi Yukizai Co., Ltd.) and the like.
　フェノール系化合物は一種を単独で用いてもよく、二種以上を組み合わせて用いてもよい。
　樹脂組成物がフェノール系化合物を含む場合、フェノール系化合物の含有量は、樹脂組成物の全固形分質量に対して、０．０１質量％以上３０質量％以下であることが好ましく、０．０２質量％以上２０質量％以下であることがより好ましい。 One type of phenol compound may be used alone, or two or more types may be used in combination.
When the resin composition contains a phenolic compound, the content of the phenolic compound is preferably 0.01% by mass or more and 30% by mass or less, and 0.02% by mass or less, based on the total solid mass of the resin composition. It is more preferable that the amount is from % by mass to 20% by mass.
〔他の高分子化合物〕
　他の高分子化合物としては、シロキサン樹脂、（メタ）アクリル酸を共重合した（メタ）アクリルポリマー、ノボラック樹脂、レゾール樹脂、ポリヒドロキシスチレン樹脂およびそれらの共重合体などが挙げられる。他の高分子化合物はメチロール基、アルコキシメチル基、エポキシ基などの架橋基が導入された変性体であってもよい。 [Other polymer compounds]
Other polymeric compounds include siloxane resins, (meth)acrylic polymers copolymerized with (meth)acrylic acid, novolak resins, resol resins, polyhydroxystyrene resins, and copolymers thereof. Other polymer compounds may be modified products into which crosslinking groups such as methylol groups, alkoxymethyl groups, and epoxy groups are introduced.
　他の高分子化合物は一種を単独で用いてもよく、二種以上を組み合わせて用いてもよい。
　樹脂組成物が他の高分子化合物を含む場合、他の高分子化合物の含有量は、樹脂組成物の全固形分質量に対して、０．０１質量％以上３０質量％以下であることが好ましく、０．０２質量％以上２０質量％以下であることがより好ましい。 One type of other polymer compounds may be used alone, or two or more types may be used in combination.
When the resin composition contains other polymer compounds, the content of the other polymer compounds is preferably 0.01% by mass or more and 30% by mass or less based on the total solid mass of the resin composition. , more preferably 0.02% by mass or more and 20% by mass or less.
＜樹脂組成物の特性＞
　本発明の樹脂組成物の粘度は、樹脂組成物の固形分濃度により調整できる。塗布膜厚の観点から、１，０００ｍｍ２／ｓ～１２，０００ｍｍ２／ｓが好ましく、２，０００ｍｍ２／ｓ～１０，０００ｍｍ２／ｓがより好ましく、２，５００ｍｍ２／ｓ～８，０００ｍｍ２／ｓが更に好ましい。上記範囲であれば、均一性の高い塗布膜を得ることが容易になる。１,０００ｍｍ２／s以上であれば、例えば再配線用絶縁膜として必要とされる膜厚で塗布することが容易であり、１２,０００ｍｍ２／s以下であれば、塗布面状に優れた塗膜が得られる。 <Characteristics of resin composition>
The viscosity of the resin composition of the present invention can be adjusted by adjusting the solid content concentration of the resin composition. From the viewpoint of coating film thickness, it is preferably 1,000 mm 2 /s to 12,000 mm 2 /s, more preferably 2,000 mm 2 /s to 10,000 mm 2 /s, and 2,500 mm 2 /s to 8,000 mm. 2 /s is more preferable. Within the above range, it becomes easy to obtain a coating film with high uniformity. If it is 1,000 mm 2 /s or more, it is easy to coat with the thickness required for example as an insulating film for rewiring, and if it is 12,000 mm 2 /s or less, the coating surface quality is excellent. A coating film is obtained.
＜樹脂組成物の含有物質についての制限＞
　本発明の樹脂組成物の含水率は、２．０質量％未満であることが好ましく、１．５質量％未満であることがより好ましく、１．０質量％未満であることが更に好ましい。２．０％未満であれば、樹脂組成物の保存安定性が向上する。
　水分の含有量を維持する方法としては、保管条件における湿度の調整、保管時の収容容器の空隙率低減などが挙げられる。  <Restrictions on substances contained in the resin composition>
The water content of the resin composition of the present invention is preferably less than 2.0% by mass, more preferably less than 1.5% by mass, and even more preferably less than 1.0% by mass. If it is less than 2.0%, the storage stability of the resin composition will improve.
Methods for maintaining the moisture content include adjusting the humidity during storage conditions and reducing the porosity of the storage container during storage.
　本発明の樹脂組成物の金属含有量は、絶縁性の観点から、５質量ｐｐｍ（ｐａｒｔｓ　ｐｅｒ　ｍｉｌｌｉｏｎ）未満が好ましく、１質量ｐｐｍ未満がより好ましく、０．５質量ｐｐｍ未満が更に好ましい。金属としては、ナトリウム、カリウム、マグネシウム、カルシウム、鉄、銅、クロム、ニッケルなどが挙げられるが、有機化合物と金属との錯体として含まれる金属は除く。金属を複数含む場合は、これらの金属の合計が上記範囲であることが好ましい。 The metal content of the resin composition of the present invention is preferably less than 5 mass ppm (parts per million), more preferably less than 1 mass ppm, and even more preferably less than 0.5 mass ppm, from the viewpoint of insulation. Examples of metals include sodium, potassium, magnesium, calcium, iron, copper, chromium, and nickel, but metals included as complexes of organic compounds and metals are excluded. When a plurality of metals are included, the total of these metals is preferably within the above range.
　また、本発明の樹脂組成物に意図せずに含まれる金属不純物を低減する方法としては、本発明の樹脂組成物を構成する原料として金属含有量が少ない原料を選択する、本発明の樹脂組成物を構成する原料に対してフィルターろ過を行う、装置内をポリテトラフルオロエチレン等でライニングしてコンタミネーションを可能な限り抑制した条件下で蒸留を行う等の方法を挙げることができる。 Further, as a method for reducing metal impurities unintentionally contained in the resin composition of the present invention, a method for reducing metal impurities that is unintentionally included in the resin composition of the present invention is to select a raw material with a low metal content as a raw material constituting the resin composition of the present invention. Methods include filtering the raw materials constituting the product, lining the inside of the apparatus with polytetrafluoroethylene, etc., and performing distillation under conditions that suppress contamination as much as possible.
　本発明の樹脂組成物は、半導体材料としての用途を考慮すると、ハロゲン原子の含有量が、配線腐食性の観点から、５００質量ｐｐｍ未満が好ましく、３００質量ｐｐｍ未満がより好ましく、２００質量ｐｐｍ未満が更に好ましい。中でも、ハロゲンイオンの状態で存在するものは、５質量ｐｐｍ未満が好ましく、１質量ｐｐｍ未満がより好ましく、０．５質量ｐｐｍ未満が更に好ましい。ハロゲン原子としては、塩素原子及び臭素原子が挙げられる。塩素原子及び臭素原子、又は塩素イオン及び臭素イオンの合計がそれぞれ上記範囲であることが好ましい。
　ハロゲン原子の含有量を調節する方法としては、イオン交換処理などが好ましく挙げられる。 Considering the use as a semiconductor material, the resin composition of the present invention has a halogen atom content of preferably less than 500 mass ppm, more preferably less than 300 mass ppm, and more preferably less than 200 mass ppm from the viewpoint of wiring corrosion. is even more preferable. Among these, those present in the form of halogen ions are preferably less than 5 ppm by mass, more preferably less than 1 ppm by mass, and even more preferably less than 0.5 ppm by mass. Examples of the halogen atom include a chlorine atom and a bromine atom. It is preferable that the total of chlorine atoms and bromine atoms, or the total of chlorine ions and bromine ions, is each within the above range.
Preferred methods for adjusting the content of halogen atoms include ion exchange treatment.
　本発明の樹脂組成物の収容容器としては従来公知の収容容器を用いることができる。収容容器としては、原材料や本発明の樹脂組成物中への不純物混入を抑制することを目的に、容器内壁を６種６層の樹脂で構成された多層ボトルや、６種の樹脂を７層構造にしたボトルを使用することも好ましい。このような容器としては例えば特開２０１５－１２３３５１号公報に記載の容器が挙げられる。 As a container for storing the resin composition of the present invention, a conventionally known container can be used. For the purpose of suppressing the contamination of impurities into raw materials and the resin composition of the present invention, the storage container may be a multilayer bottle whose inner wall is made of 6 types of 6 layers of resin, or a container with 7 layers of 6 types of resin. It is also preferred to use structured bottles. Examples of such a container include the container described in JP-A No. 2015-123351.
＜樹脂組成物の硬化物＞
　本発明の樹脂組成物を硬化することにより、樹脂組成物の硬化物を得ることができる。
　本発明の硬化物は、樹脂組成物を硬化してなる硬化物である。
　樹脂組成物の硬化は加熱によるものであることが好ましく、加熱温度が１２０℃～４００℃がより好ましく、１４０℃～３８０℃が更に好ましく、１７０℃～３５０℃が特に好ましい。樹脂組成物の硬化物の形態は、特に限定されず、フィルム状、棒状、球状、ペレット状など、用途に合わせて選択することができる。本発明において、硬化物は、フィルム状であることが好ましい。樹脂組成物のパターン加工によって、壁面への保護膜の形成、導通のためのビアホール形成、インピーダンスや静電容量あるいは内部応力の調整、放熱機能付与など、用途にあわせて、硬化物の形状を選択することもできる。硬化物（硬化物からなる膜）の膜厚は、０．５μｍ以上１５０μｍ以下であることが好ましい。
　本発明の樹脂組成物を硬化した際の収縮率は、５０％以下が好ましく、４５％以下がより好ましく、４０％以下が更に好ましい。ここで、収縮率は、樹脂組成物の硬化前後の体積変化の百分率を指し、下記の式より算出することができる。
　収縮率［％］＝１００－（硬化後の体積÷硬化前の体積）×１００ <Cured product of resin composition>
By curing the resin composition of the present invention, a cured product of the resin composition can be obtained.
The cured product of the present invention is a cured product obtained by curing a resin composition.
The resin composition is preferably cured by heating, and the heating temperature is more preferably 120°C to 400°C, even more preferably 140°C to 380°C, and particularly preferably 170°C to 350°C. The form of the cured product of the resin composition is not particularly limited, and can be selected depending on the purpose, such as film, rod, sphere, or pellet form. In the present invention, the cured product is preferably in the form of a film. By patterning the resin composition, we can select the shape of the cured product according to the application, such as forming a protective film on the wall surface, forming via holes for conduction, adjusting impedance, capacitance or internal stress, and imparting heat dissipation function. You can also. The thickness of the cured product (film made of the cured product) is preferably 0.5 μm or more and 150 μm or less.
The shrinkage rate when the resin composition of the present invention is cured is preferably 50% or less, more preferably 45% or less, and even more preferably 40% or less. Here, the shrinkage rate refers to the percentage change in volume of the resin composition before and after curing, and can be calculated from the following formula.
Shrinkage rate [%] = 100 - (Volume after curing ÷ Volume before curing) x 100
＜樹脂組成物の硬化物の特性＞ 
　本発明の樹脂組成物の硬化物のイミド化反応率は、７０％以上が好ましく、８０％以上がより好ましく、９０％以上が更に好ましい。７０％以上であれば、機械特性に優れた硬化物となる場合がある。
　本発明の樹脂組成物の硬化物の破断伸びは、３０％以上が好ましく、４０％以上がより好ましく、５０％以上が更に好ましい。
　本発明の樹脂組成物の硬化物のガラス転移温度（Ｔｇ）は、１８０℃以上であることが好ましく、２１０℃以上であることがより好ましく、２３０℃以上であることがさらに好ましい。 <Characteristics of cured product of resin composition>
The imidization reaction rate of the cured product of the resin composition of the present invention is preferably 70% or more, more preferably 80% or more, and still more preferably 90% or more. If it is 70% or more, the cured product may have excellent mechanical properties.
The elongation at break of the cured product of the resin composition of the present invention is preferably 30% or more, more preferably 40% or more, and even more preferably 50% or more.
The glass transition temperature (Tg) of the cured product of the resin composition of the present invention is preferably 180°C or higher, more preferably 210°C or higher, and even more preferably 230°C or higher.
＜樹脂組成物の調製＞
　本発明の樹脂組成物は、上記各成分を混合して調製することができる。混合方法は特に限定はなく、従来公知の方法で行うことができる。
　混合方法としては、撹拌羽による混合、ボールミルによる混合、タンクを回転させる混合などが挙げられる。
　混合中の温度は１０～３０℃が好ましく、１５～２５℃がより好ましい。 <Preparation of resin composition>
The resin composition of the present invention can be prepared by mixing the above components. The mixing method is not particularly limited and can be performed by a conventionally known method.
Examples of the mixing method include mixing using a stirring blade, mixing using a ball mill, and mixing using a rotating tank.
The temperature during mixing is preferably 10 to 30°C, more preferably 15 to 25°C.
　本発明の樹脂組成物中のゴミや微粒子等の異物を除去する目的で、フィルターを用いたろ過を行うことが好ましい。フィルター孔径は、例えば５μｍ以下が好ましく、１μｍ以下がより好ましく、０．５μｍ以下が更に好ましく、０．１μｍ以下が更により好ましい。フィルターの材質は、ポリテトラフルオロエチレン、ポリエチレン又はナイロンが好ましい。フィルターの材質がポリエチレンである場合はＨＤＰＥ（高密度ポリエチレン）であることがより好ましい。フィルターは、有機溶剤であらかじめ洗浄したものを用いてもよい。フィルターろ過工程では、複数種のフィルターを直列又は並列に接続して用いてもよい。複数種のフィルターを使用する場合は、孔径又は材質が異なるフィルターを組み合わせて使用してもよい。接続態様としては、例えば、１段目として孔径１μｍのＨＤＰＥフィルターを、２段目として孔径０．２μｍのＨＤＰＥフィルターを、直列に接続した態様が挙げられる。また、各種材料を複数回ろ過してもよい。複数回ろ過する場合は、循環ろ過であってもよい。また、加圧してろ過を行ってもよい。加圧してろ過を行う場合、加圧する圧力は例えば０．０１ＭＰａ以上１．０ＭＰａ以下が好ましく、０．０３ＭＰａ以上０．９ＭＰａ以下がより好ましく、０．０５ＭＰａ以上０．７ＭＰａ以下が更に好ましく、０．０５ＭＰａ以上０．５ＭＰａ以下が更により好ましい。
　フィルターを用いたろ過の他、吸着材を用いた不純物の除去処理を行ってもよい。フィルターろ過と吸着材を用いた不純物除去処理とを組み合わせてもよい。吸着材としては、公知の吸着材を用いることができる。例えば、シリカゲル、ゼオライトなどの無機系吸着材、活性炭などの有機系吸着材が挙げられる。
　フィルターを用いたろ過後、ボトルに充填した樹脂組成物を減圧下に置き、脱気する工程を施しても良い。 In order to remove foreign substances such as dust and fine particles from the resin composition of the present invention, it is preferable to perform filtration using a filter. The filter pore diameter is, for example, preferably 5 μm or less, more preferably 1 μm or less, even more preferably 0.5 μm or less, and even more preferably 0.1 μm or less. The material of the filter is preferably polytetrafluoroethylene, polyethylene or nylon. When the material of the filter is polyethylene, it is more preferably HDPE (high density polyethylene). The filter may be washed in advance with an organic solvent. In the filter filtration step, a plurality of types of filters may be connected in series or in parallel. When using multiple types of filters, filters with different pore sizes or materials may be used in combination. Examples of the connection mode include a mode in which an HDPE filter with a pore diameter of 1 μm is connected in series as the first stage and an HDPE filter with a pore diameter of 0.2 μm as the second stage. Additionally, various materials may be filtered multiple times. When filtration is performed multiple times, circulation filtration may be used. Alternatively, filtration may be performed under pressure. When performing filtration under pressure, the pressure to be pressurized is, for example, preferably 0.01 MPa or more and 1.0 MPa or less, more preferably 0.03 MPa or more and 0.9 MPa or less, still more preferably 0.05 MPa or more and 0.7 MPa or less, and 0.01 MPa or more and 0.9 MPa or less, still more preferably 0.05 MPa or more and 0.7 MPa or less, and 0.01 MPa or more and 0.9 MPa or less, and even more preferably 0.05 MPa or more and 0.7 MPa or less. Even more preferably 0.05 MPa or more and 0.5 MPa or less.
In addition to filtration using a filter, impurity removal treatment using an adsorbent may be performed. Filter filtration and impurity removal treatment using an adsorbent may be combined. As the adsorbent, a known adsorbent can be used. Examples include inorganic adsorbents such as silica gel and zeolite, and organic adsorbents such as activated carbon.
After filtration using a filter, the resin composition filled in the bottle may be placed under reduced pressure and degassed.
（硬化物の製造方法）
　本発明の硬化物の製造方法は、樹脂組成物を基材上に適用して膜を形成する膜形成工程を含むことが好ましい。
　硬化物の製造方法は、上記膜形成工程、膜形成工程により形成された膜を選択的に露光する露光工程、及び、露光工程により露光された膜を現像液を用いて現像してパターンを形成する現像工程を含むことがより好ましい。
　硬化物の製造方法は、上記膜形成工程、上記露光工程、上記現像工程、並びに、現像工程により得られたパターンを加熱する加熱工程及び現像工程により得られたパターンを露光する現像後露光工程の少なくとも一方を含むことが特に好ましい。
　また、硬化物の製造方法は、上記膜形成工程、及び、上記膜を加熱する工程を含むことも好ましい。
　以下、各工程の詳細について説明する。 (Method for producing cured product)
The method for producing a cured product of the present invention preferably includes a film forming step of applying the resin composition onto a base material to form a film.
The method for producing a cured product includes the above film forming step, an exposure step of selectively exposing the film formed in the film forming step, and developing the film exposed in the exposure step using a developer to form a pattern. It is more preferable to include a developing step.
The method for producing a cured product includes the film formation step, the exposure step, the development step, a heating step of heating the pattern obtained in the development step, and a post-development exposure step of exposing the pattern obtained in the development step. It is particularly preferable to include at least one of them.
Moreover, it is also preferable that the method for producing a cured product includes the film forming step and the step of heating the film.
The details of each step will be explained below.
＜膜形成工程＞
　本発明の樹脂組成物は、基材上に適用して膜を形成する膜形成工程に用いることができる。
　本発明の硬化物の製造方法は、樹脂組成物を基材上に適用して膜を形成する膜形成工程を含むことが好ましい。 <Film formation process>
The resin composition of the present invention can be used in a film forming step in which a film is formed by applying it on a substrate.
The method for producing a cured product of the present invention preferably includes a film forming step of applying the resin composition onto a base material to form a film.
〔基材〕
　基材の種類は、用途に応じて適宜定めることができ、特に限定されない。基材としては、例えば、シリコン、窒化シリコン、ポリシリコン、酸化シリコン、アモルファスシリコンなどの半導体作製基材、石英、ガラス、光学フィルム、セラミック材料、蒸着膜、磁性膜、反射膜、Ｎｉ、Ｃｕ、Ｃｒ、Ｆｅなどの金属基材（例えば、金属から形成された基材、及び、金属層が例えばめっきや蒸着等により形成された基材のいずれであってもよい）、紙、ＳＯＧ（Ｓｐｉｎ　Ｏｎ　Ｇｌａｓｓ）、ＴＦＴ（薄膜トランジスタ）アレイ基材、モールド基材、プラズマディスプレイパネル（ＰＤＰ）の電極板などが挙げられる。基材は、特に、半導体作製基材が好ましく、シリコン基材、Ｃｕ基材およびモールド基材がより好ましい。
　これらの基材にはヘキサメチルジシラザン（ＨＭＤＳ）等による密着層や酸化層などの層が表面に設けられていてもよい。
　基材の形状は特に限定されず、円形状であってもよく、矩形状であってもよい。
　基材のサイズは、円形状であれば、例えば直径が１００～４５０ｍｍが好ましく、２００～４５０ｍｍがより好ましい。矩形状であれば、例えば短辺の長さが１００～１０００ｍｍが好ましく、２００～７００ｍｍがより好ましい。
基材としては、例えば板状、好ましくはパネル状の基材（基板）が用いられる。 〔Base material〕
The type of base material can be appropriately determined depending on the purpose and is not particularly limited. Examples of the base material include semiconductor manufacturing base materials such as silicon, silicon nitride, polysilicon, silicon oxide, and amorphous silicon, quartz, glass, optical films, ceramic materials, vapor deposited films, magnetic films, reflective films, Ni, Cu, A metal base material such as Cr or Fe (for example, a base material formed from a metal or a base material on which a metal layer is formed by, for example, plating or vapor deposition), paper, SOG (Spin On Examples include glass), TFT (thin film transistor) array substrates, mold substrates, and electrode plates for plasma display panels (PDP). The base material is particularly preferably a semiconductor production base material, and more preferably a silicon base material, a Cu base material, and a mold base material.
These base materials may be provided with a layer such as an adhesive layer or an oxidized layer made of hexamethyldisilazane (HMDS) or the like on the surface.
The shape of the base material is not particularly limited, and may be circular or rectangular.
As for the size of the base material, if it is circular, the diameter is preferably 100 to 450 mm, more preferably 200 to 450 mm. If it is rectangular, the length of the short side is preferably 100 to 1000 mm, more preferably 200 to 700 mm.
As the base material, for example, a plate-shaped, preferably panel-shaped base material (substrate) is used.
　樹脂層（例えば、硬化物からなる層）の表面や金属層の表面に樹脂組成物を適用して膜を形成する場合は、樹脂層や金属層が基材となる。 When forming a film by applying a resin composition to the surface of a resin layer (for example, a layer made of a cured product) or the surface of a metal layer, the resin layer or metal layer serves as the base material.
　樹脂組成物を基材上に適用する手段としては、塗布が好ましい。
　適用する手段としては、具体的には、ディップコート法、エアーナイフコート法、カーテンコート法、ワイヤーバーコート法、グラビアコート法、エクストルージョンコート法、スプレーコート法、スピンコート法、スリットコート法、インクジェット法などが挙げられる。膜の厚さの均一性の観点から、スピンコート法、スリットコート法、スプレーコート法、又は、インクジェット法が好ましく、膜の厚さの均一性の観点および生産性の観点からスピンコート法およびスリットコート法がより好ましい。適用する手段に応じて樹脂組成物の固形分濃度や塗布条件を調整することで、所望の厚さの膜を得ることができる。また、基材の形状によっても塗布方法を適宜選択でき、ウエハ等の円形基材であればスピンコート法、スプレーコート法、インクジェット法等が好ましく、矩形基材であればスリットコート法、スプレーコート法、インクジェット法等が好ましい。スピンコート法の場合は、例えば、５００～３，５００ｒｐｍの回転数で、１０秒～３分程度適用することができる。
　また、あらかじめ仮支持体上に上記付与方法によって付与して形成した塗膜を、基材上に転写する方法を適用することもできる。
　転写方法に関しては特開２００６－０２３６９６号公報の段落００２３、００３６～００５１や、特開２００６－０４７５９２号公報の段落００９６～０１０８に記載の作製方法を好適に用いることができる。
　また、基材の端部において余分な膜の除去を行なう工程を行なってもよい。このような工程の例には、エッジビードリンス（ＥＢＲ）、バックリンスなどが挙げられる。
　樹脂組成物を基材に塗布する前に基材を種々の溶剤を塗布し、基材の濡れ性を向上させた後に樹脂組成物を塗布するプリウェット工程を採用しても良い。 Coating is preferred as a means for applying the resin composition onto the substrate.
Specifically, the methods to be applied include dip coating method, air knife coating method, curtain coating method, wire bar coating method, gravure coating method, extrusion coating method, spray coating method, spin coating method, slit coating method, Examples include inkjet method. From the viewpoint of uniformity of film thickness, spin coating method, slit coating method, spray coating method, or inkjet method is preferable, and from the viewpoint of uniformity of film thickness and productivity, spin coating method and slit coating method are preferable. A coating method is more preferred. A film with a desired thickness can be obtained by adjusting the solid content concentration and application conditions of the resin composition depending on the means to be applied. In addition, the coating method can be appropriately selected depending on the shape of the substrate, and for circular substrates such as wafers, spin coating, spray coating, inkjet methods, etc. are preferable, and for rectangular substrates, slit coating, spray coating, etc. method, inkjet method, etc. are preferred. In the case of spin coating, it can be applied, for example, at a rotation speed of 500 to 3,500 rpm for about 10 seconds to 3 minutes.
It is also possible to apply a method in which a coating film, which has been previously formed on a temporary support by the above-mentioned application method, is transferred onto a base material.
Regarding the transfer method, the production method described in paragraphs 0023, 0036 to 0051 of JP-A No. 2006-023696 and paragraphs 0096 to 0108 of JP-A No. 2006-047592 can be suitably used.
Further, a step of removing excess film may be performed at the end of the base material. Examples of such processes include edge bead rinsing (EBR), back rinsing, and the like.
A pre-wet process may be employed in which various solvents are applied to the base material before the resin composition is applied to the base material to improve the wettability of the base material, and then the resin composition is applied.
＜乾燥工程＞
　上記膜は、膜形成工程（層形成工程）の後に、溶剤を除去するため、形成された膜（層）を乾燥する工程(乾燥工程)に供されてもよい。
　すなわち、本発明の硬化物の製造方法は、膜形成工程により形成された膜を乾燥する乾燥工程を含んでもよい。
　上記乾燥工程は膜形成工程の後、露光工程の前に行われることが好ましい。
　乾燥工程における膜の乾燥温度は５０～１５０℃が好ましく、７０℃～１３０℃がより好ましく、９０℃～１１０℃が更に好ましい。また、減圧により乾燥を行っても良い。乾燥時間としては、３０秒～２０分が例示され、１分～１０分が好ましく、２分～７分がより好ましい。 <Drying process>
After the film forming step (layer forming step), the film may be subjected to a step of drying the formed film (layer) (drying step) in order to remove the solvent.
That is, the method for producing a cured product of the present invention may include a drying step of drying the film formed in the film forming step.
The drying step is preferably performed after the film forming step and before the exposure step.
The drying temperature of the membrane in the drying step is preferably from 50 to 150°C, more preferably from 70°C to 130°C, even more preferably from 90°C to 110°C. Alternatively, drying may be performed under reduced pressure. The drying time is exemplified by 30 seconds to 20 minutes, preferably 1 minute to 10 minutes, and more preferably 2 minutes to 7 minutes.
＜露光工程＞
　上記膜は、膜を選択的に露光する露光工程に供されてもよい。
　硬化物の製造方法は、膜形成工程により形成された膜を選択的に露光する露光工程を含んでもよい。
　選択的に露光するとは、膜の一部を露光することを意味している。また、選択的に露光することにより、膜には露光された領域（露光部）と露光されていない領域（非露光部）が形成される。
　露光量は、本発明の樹脂組成物を硬化できる限り特に限定されないが、例えば、波長３６５ｎｍでの露光エネルギー換算で５０～１０，０００ｍＪ／ｃｍ２が好ましく、２００～８，０００ｍＪ／ｃｍ２がより好ましい。 <Exposure process>
The film may be subjected to an exposure process that selectively exposes the film.
The method for producing a cured product may include an exposure step of selectively exposing the film formed in the film forming step.
Selectively exposing means exposing a portion of the film. Furthermore, by selectively exposing the film, an exposed region (exposed portion) and an unexposed region (non-exposed portion) are formed in the film.
The exposure amount is not particularly limited as long as it can cure the resin composition of the present invention, but for example, it is preferably 50 to 10,000 mJ/cm 2 and more preferably 200 to 8,000 mJ/cm 2 in terms of exposure energy at a wavelength of 365 nm. preferable.
　露光波長は、１９０～１，０００ｎｍの範囲で適宜定めることができ、２４０～５５０ｎｍが好ましい。 The exposure wavelength can be appropriately determined in the range of 190 to 1,000 nm, preferably 240 to 550 nm.
　露光波長は、光源との関係でいうと、（１）半導体レーザー（波長　８３０ｎｍ、５３２ｎｍ、４８８ｎｍ、４０５ｎｍ、３７５ｎｍ、３５５ｎｍ　ｅｔｃ．）、（２）メタルハライドランプ、（３）高圧水銀灯、ｇ線（波長　４３６ｎｍ）、ｈ線（波長　４０５ｎｍ）、ｉ線（波長　３６５ｎｍ）、ブロード（ｇ，ｈ，ｉ線の３波長）、（４）エキシマレーザー、ＫｒＦエキシマレーザー（波長　２４８ｎｍ）、ＡｒＦエキシマレーザー（波長　１９３ｎｍ）、Ｆ２エキシマレーザー（波長　１５７ｎｍ）、（５）極紫外線；ＥＵＶ（波長　１３．６ｎｍ）、（６）電子線、（７）ＹＡＧレーザーの第二高調波５３２ｎｍ、第三高調波３５５ｎｍ等が挙げられる。本発明の樹脂組成物については、特に高圧水銀灯による露光が好ましく、露光感度の観点で、ｉ線による露光がより好ましい。
　露光の方式は特に限定されず、本発明の樹脂組成物からなる膜の少なくとも一部が露光される方式であればよいが、フォトマスクを使用した露光、レーザーダイレクトイメージング法による露光等が挙げられる。 In relation to the light source, the exposure wavelength is: (1) semiconductor laser (wavelength: 830 nm, 532 nm, 488 nm, 405 nm, 375 nm, 355 nm, etc.), (2) metal halide lamp, (3) high pressure mercury lamp, G-line (wavelength) 436 nm), h line (wavelength 405 nm), i line (wavelength 365 nm), broad (three wavelengths of g, h, i line), (4) excimer laser, KrF excimer laser (wavelength 248 nm), ArF excimer laser (wavelength 193 nm) ), F2 excimer laser (wavelength 157 nm), (5) extreme ultraviolet light; EUV (wavelength 13.6 nm), (6) electron beam, (7) YAG laser second harmonic 532 nm, third harmonic 355 nm, etc. Can be mentioned. For the resin composition of the present invention, exposure using a high-pressure mercury lamp is particularly preferred, and from the viewpoint of exposure sensitivity, exposure using i-line is more preferred.
The method of exposure is not particularly limited, and may be any method as long as at least a portion of the film made of the resin composition of the present invention is exposed to light, and examples thereof include exposure using a photomask, exposure using a laser direct imaging method, etc. .
＜露光後加熱工程＞
　上記膜は、露光後に加熱する工程（露光後加熱工程）に供されてもよい。
　すなわち、本発明の硬化物の製造方法は、露光工程により露光された膜を加熱する露光後加熱工程を含んでもよい。
　露光後加熱工程は、露光工程後、現像工程前に行うことができる。
　露光後加熱工程における加熱温度は、５０℃～１４０℃が好ましく、６０℃～１２０℃がより好ましい。
　露光後加熱工程における加熱時間は、３０秒間～３００分間が好ましく、１分間～１０分間がより好ましい。
　露光後加熱工程における昇温速度は、加熱開始時の温度から最高加熱温度まで１～１２℃／分が好ましく、２～１０℃／分がより好ましく、３～１０℃／分が更に好ましい。
　また、昇温速度は加熱途中で適宜変更してもよい。
　露光後加熱工程における加熱手段としては、特に限定されず、公知のホットプレート、オーブン、赤外線ヒーター等を用いることができる。
　また、加熱に際し、窒素、ヘリウム、アルゴンなどの不活性ガスを流す等により、低酸素濃度の雰囲気下で行うことも好ましい。 <Post-exposure heating process>
The film may be subjected to a heating step after exposure (post-exposure heating step).
That is, the method for producing a cured product of the present invention may include a post-exposure heating step of heating the film exposed in the exposure step.
The post-exposure heating step can be performed after the exposure step and before the development step.
The heating temperature in the post-exposure heating step is preferably 50°C to 140°C, more preferably 60°C to 120°C.
The heating time in the post-exposure heating step is preferably 30 seconds to 300 minutes, more preferably 1 minute to 10 minutes.
The temperature increase rate in the post-exposure heating step is preferably 1 to 12°C/min, more preferably 2 to 10°C/min, and even more preferably 3 to 10°C/min from the temperature at the start of heating to the maximum heating temperature.
Further, the temperature increase rate may be changed as appropriate during heating.
The heating means in the post-exposure heating step is not particularly limited, and a known hot plate, oven, infrared heater, etc. can be used.
It is also preferable that the heating be performed in an atmosphere with a low oxygen concentration, such as by flowing an inert gas such as nitrogen, helium, or argon.
＜現像工程＞
　露光後の上記膜は、現像液を用いて現像してパターンを形成する現像工程に供されてもよい。
　すなわち、本発明の硬化物の製造方法は、露光工程により露光された膜を現像液を用いて現像してパターンを形成する現像工程を含んでもよい。
　現像を行うことにより、膜の露光部及び非露光部のうち一方が除去され、パターンが形成される。
　ここで、膜の非露光部が現像工程により除去される現像をネガ型現像といい、膜の露光部が現像工程により除去される現像をポジ型現像という。 <Developing process>
The exposed film may be subjected to a development step of developing a pattern using a developer.
That is, the method for producing a cured product of the present invention may include a development step of developing the film exposed in the exposure step using a developer to form a pattern.
By performing development, one of the exposed and non-exposed areas of the film is removed and a pattern is formed.
Here, development in which the non-exposed portions of the film are removed in the developing step is referred to as negative development, and development in which the exposed portions of the film are removed in the development step is referred to as positive development.
〔現像液〕
　現像工程において用いられる現像液としては、アルカリ水溶液、又は、有機溶剤を含む現像液が挙げられる。 [Developer]
Examples of the developer used in the development step include an alkaline aqueous solution or a developer containing an organic solvent.
　現像液がアルカリ水溶液である場合、アルカリ水溶液が含みうる塩基性化合物としては、無機アルカリ類、第一級アミン類、第二級アミン類、第三級アミン類、第四級アンモニウム塩が挙げられ、ＴＭＡＨ（テトラメチルアンモニウムヒドロキシド）、水酸化カリウム、炭酸ナトリウム、水酸化ナトリウム、ケイ酸ナトリウム、メタケイ酸ナトリウム、アンモニア、エチルアミン、ｎ－プロピルアミン、ジエチルアミン、ジ－ｎ－ブチルアミン、トリエチルアミン、メチルジエチルアミン、ジメチルエタノールアミン、トリエタノールアミン、テトラエチルアンモニウムヒドロキシド、テトラプロピルアンモニウムヒドロキシド、テトラブチルアンモニウムヒドロキシド、テトラペンチルアンモニウムヒドロキシド、テトラヘキシルアンモニウムヒドロキシド、テトラオクチルアンモニウムヒドロキシド、エチルトリメチルアンモニウムヒドロキシド、ブチルトリメチルアンモニウムヒドロキシド、メチルトリアミルアンモニウムヒドロキシド、ジブチルジペンチルアンモニウムヒドロキシド、ジメチルビス（２－ヒドロキシエチル）アンモニウムヒドロキシド、トリメチルフェニルアンモニウムヒドロキシド、トリメチルベンジルアンモニウムヒドロキシド、トリエチルベンジルアンモニウムヒドロキシド、ピロール、ピペリジンが好ましく、より好ましくはＴＭＡＨである。現像液における塩基性化合物の含有量は、現像液全質量中０．０１～１０質量％が好ましく、０．１～５質量％がより好ましく、０．３～３質量％が更に好ましい。 When the developer is an alkaline aqueous solution, basic compounds that the alkaline aqueous solution may contain include inorganic alkalis, primary amines, secondary amines, tertiary amines, and quaternary ammonium salts. , TMAH (tetramethylammonium hydroxide), potassium hydroxide, sodium carbonate, sodium hydroxide, sodium silicate, sodium metasilicate, ammonia, ethylamine, n-propylamine, diethylamine, di-n-butylamine, triethylamine, methyldiethylamine , dimethylethanolamine, triethanolamine, tetraethylammonium hydroxide, tetrapropylammonium hydroxide, tetrabutylammonium hydroxide, tetrapentylammonium hydroxide, tetrahexylammonium hydroxide, tetraoctylammonium hydroxide, ethyltrimethylammonium hydroxide, Butyltrimethylammonium hydroxide, methyltriamylammonium hydroxide, dibutyldipentylammonium hydroxide, dimethylbis(2-hydroxyethyl)ammonium hydroxide, trimethylphenylammonium hydroxide, trimethylbenzylammonium hydroxide, triethylbenzylammonium hydroxide, pyrrole , piperidine is preferred, and TMAH is more preferred. The content of the basic compound in the developer is preferably 0.01 to 10% by weight, more preferably 0.1 to 5% by weight, and even more preferably 0.3 to 3% by weight based on the total weight of the developer.
　現像液が有機溶剤を含む場合、有機溶剤としては、国際公開第２０２１／１１２１８９号の段落０３８７に記載の化合物を用いることができる。この内容は本明細書に組み込まれる。また、アルコール類として、メタノール、エタノール、プロパノール、イソプロパノール、ブタノール、ペンタノール、オクタノール、ジエチレングリコール、プロピレングリコール、メチルイソブチルカルビノール、トリエチレングリコール等、アミド類として、Ｎ－メチルピロリドン、Ｎ－エチルピロリドン、ジメチルホルムアミド等も好適に挙げられる。 When the developer contains an organic solvent, the compound described in paragraph 0387 of International Publication No. 2021/112189 can be used as the organic solvent. This content is incorporated herein. In addition, alcohols include methanol, ethanol, propanol, isopropanol, butanol, pentanol, octanol, diethylene glycol, propylene glycol, methylisobutylcarbinol, triethylene glycol, etc.Amides include N-methylpyrrolidone, N-ethylpyrrolidone, Dimethylformamide and the like are also suitable.
　現像液が有機溶剤を含む場合、有機溶剤は１種又は、２種以上を混合して使用することができる。本発明では特にシクロペンタノン、γ－ブチロラクトン、ジメチルスルホキシド、Ｎ－メチル－２－ピロリドン、及び、シクロヘキサノンよりなる群から選ばれた少なくとも１種を含む現像液が好ましく、シクロペンタノン、γ－ブチロラクトン及びジメチルスルホキシドよりなる群から選ばれた少なくとも１種を含む現像液がより好ましく、シクロペンタノンを含む現像液が特に好ましい。 When the developer contains an organic solvent, one type of organic solvent or a mixture of two or more types can be used. In the present invention, a developer containing at least one member selected from the group consisting of cyclopentanone, γ-butyrolactone, dimethyl sulfoxide, N-methyl-2-pyrrolidone, and cyclohexanone is particularly preferred. A developer containing at least one selected from the group consisting of and dimethyl sulfoxide is more preferred, and a developer containing cyclopentanone is particularly preferred.
　現像液が有機溶剤を含む場合、現像液の全質量に対する有機溶剤の含有量は、５０質量％以上であることが好ましく、７０質量％以上であることがより好ましく、８０質量％以上であることが更に好ましく、９０質量％以上であることが特に好ましい。また、上記含有量は、１００質量％であってもよい。 When the developer contains an organic solvent, the content of the organic solvent relative to the total mass of the developer is preferably 50% by mass or more, more preferably 70% by mass or more, and 80% by mass or more. is more preferable, and particularly preferably 90% by mass or more. Moreover, the said content may be 100 mass %.
　現像液が有機溶剤を含む場合、現像液は塩基性化合物及び塩基発生剤の少なくとも一方を更に含んでもよい。現像液中の塩基性化合物及び塩基発生剤の少なくとも一方がパターンに浸透することにより、パターンの破断伸び等の性能が向上する場合がある。 When the developer contains an organic solvent, the developer may further contain at least one of a basic compound and a base generator. When at least one of the basic compound and the base generator in the developer permeates into the pattern, performance such as elongation at break of the pattern may be improved.
　塩基性化合物としては、硬化後の膜に残存した場合の信頼性（硬化物を更に加熱した場合の基材との密着性）の観点からは、有機塩基が好ましい。
　塩基性化合物としては、アミノ基を有する塩基性化合物が好ましく、１級アミン、２級アミン、３級アミン、アンモニウム塩、３級アミドなどが好ましいが、イミド化反応を促進する為には、１級アミン、２級アミン、３級アミン又はアンモニウム塩が好ましく、２級アミン、３級アミン又はアンモニウム塩がより好ましく、２級アミン又は３級アミンが更に好ましく、３級アミンが特に好ましい。
　塩基性化合物としては、硬化物の機械特性（破断伸び）の観点からは、硬化膜（得られる硬化物）中に残存しにくいものが好ましく、環化の促進の観点からは、気化等により、加熱前に残存量が減少しにくいものであることが好ましい。
　したがって、塩基性化合物の沸点は、常圧（１０１，３２５Ｐａ）で３０℃～３５０℃が好ましく、８０℃～２７０℃がより好ましく、１００℃～２３０℃が更に好ましい。
　塩基性化合物の沸点は、現像液に含まれる有機溶剤の沸点から２０℃を減算した温度よりも高いことが好ましく、現像液に含まれる有機溶剤の沸点よりも高いことがより好ましい。
　例えば、有機溶剤の沸点が１００℃である場合、使用される塩基性化合物は、沸点が８０℃以上が好ましく、沸点が１００℃以上がより好ましい。
　現像液は塩基性化合物を１種のみ含有してもよいし、２種以上を含有してもよい。 As the basic compound, an organic base is preferable from the viewpoint of reliability when remaining in the cured film (adhesion to the substrate when the cured product is further heated).
As the basic compound, a basic compound having an amino group is preferable, and primary amines, secondary amines, tertiary amines, ammonium salts, tertiary amides, etc. are preferable, but in order to promote the imidization reaction, A primary amine, a secondary amine, a tertiary amine or an ammonium salt is preferred, a secondary amine, a tertiary amine or an ammonium salt is more preferred, a secondary amine or a tertiary amine is even more preferred, and a tertiary amine is particularly preferred.
From the viewpoint of the mechanical properties (elongation at break) of the cured product, the basic compound is preferably one that does not easily remain in the cured film (obtained cured product), and from the viewpoint of promoting cyclization, it can be used by vaporization etc. It is preferable that the amount remaining is not likely to decrease before heating.
Therefore, the boiling point of the basic compound is preferably 30°C to 350°C, more preferably 80°C to 270°C, and even more preferably 100°C to 230°C at normal pressure (101,325 Pa).
The boiling point of the basic compound is preferably higher than the boiling point of the organic solvent contained in the developer minus 20°C, and more preferably higher than the boiling point of the organic solvent contained in the developer.
For example, when the organic solvent has a boiling point of 100°C, the basic compound used preferably has a boiling point of 80°C or higher, more preferably 100°C or higher.
The developer may contain only one type of basic compound, or may contain two or more types of basic compounds.
　塩基性化合物の具体例としては、エタノールアミン、ジエタノールアミン、トリエタノールアミン、エチルアミン、ジエチルアミン、トリエチルアミン、ヘキシルアミン、ドデシルアミン、シクロヘキシルアミン、シクロヘキシルメチルアミン、シクロヘキシルジメチルアミン、アニリン、Ｎ－メチルアニリン、Ｎ，Ｎ－ジメチルアニリン、ジフェニルアミン、ピリジン、ブチルアミン、イソブチルアミン、ジブチルアミン、トリブチルアミン、ジシクロヘキシルアミン、ＤＢＵ（ジアザビシクロウンデセン）、ＤＡＢＣＯ（１，４－ジアザビシクロ［２．２．２］オクタン）、Ｎ，Ｎ－ジイソプロピルエチルアミン、テトラメチルアンモニウムヒドロキシド、テトラブチルアンモニウムヒドロキシド、エチレンジアミン、ブタンジアミン、１，５－ジアミノペンタン、Ｎ－メチルヘキシルアミン、Ｎ－メチルジシクロヘキシルアミン、トリオクチルアミン、Ｎ－エチルエチレンジアミン、Ｎ，Ｎ―ジエチルエチレンジアミン、Ｎ，Ｎ，Ｎ’，Ｎ’－テトラブチルー１，６－ヘキサンジアミン、スペルミジン、ジアミノシクロヘキサン、ビス（２－メトキシエチル）アミン、ピペリジン、メチルピペリジン、ジメチルピペリジン、ピペラジン、トロパン、Ｎ－フェニルベンジルアミン、１，２－ジアニリノエタン、２－アミノエタノール、トルイジン、アミノフェノール、ヘキシルアニリン、フェニレンジアミン、フェニルエチルアミン、ジベンジルアミン、ピロール、Ｎ－メチルピロール、Ｎ，Ｎ，Ｎ，Ｎテトラメチルエチレンジアミン、Ｎ，Ｎ，Ｎ，Ｎ－テトラメチルー１，３－プロパンジアミン等が挙げられる。 Specific examples of basic compounds include ethanolamine, diethanolamine, triethanolamine, ethylamine, diethylamine, triethylamine, hexylamine, dodecylamine, cyclohexylamine, cyclohexylmethylamine, cyclohexyldimethylamine, aniline, N-methylaniline, N, N-dimethylaniline, diphenylamine, pyridine, butylamine, isobutylamine, dibutylamine, tributylamine, dicyclohexylamine, DBU (diazabicycloundecene), DABCO (1,4-diazabicyclo[2.2.2]octane), N , N-diisopropylethylamine, tetramethylammonium hydroxide, tetrabutylammonium hydroxide, ethylenediamine, butanediamine, 1,5-diaminopentane, N-methylhexylamine, N-methyldicyclohexylamine, trioctylamine, N-ethylethylenediamine , N,N-diethylethylenediamine, N,N,N',N'-tetrabutyl-1,6-hexanediamine, spermidine, diaminocyclohexane, bis(2-methoxyethyl)amine, piperidine, methylpiperidine, dimethylpiperidine, piperazine, Tropane, N-phenylbenzylamine, 1,2-dianilinoethane, 2-aminoethanol, toluidine, aminophenol, hexylaniline, phenylenediamine, phenylethylamine, dibenzylamine, pyrrole, N-methylpyrrole, N,N,N, Examples include N-tetramethylethylenediamine, N,N,N,N-tetramethyl-1,3-propanediamine, and the like.
　塩基発生剤の好ましい態様は、上述の組成物に含まれる塩基発生剤の好ましい態様と同様である。特に、塩基発生剤は熱塩基発生剤であることが好ましい。 The preferred embodiments of the base generator are the same as the preferred embodiments of the base generator contained in the above-mentioned composition. In particular, the base generator is preferably a thermal base generator.
　現像液が塩基性化合物及び塩基発生剤の少なくとも一方を含む場合、塩基性化合物又は塩基発生剤の含有量は、現像液の全質量に対して、１０質量％以下が好ましく、５質量％以下がより好ましい。上記含有量の下限は特に限定されないが、例えば０．１質量％以上が好ましい。
　塩基性化合物又は塩基発生剤が現像液が用いられる環境で固体である場合、塩基性化合物又は塩基発生剤の含有量は、現像液の全固形分に対して、７０～１００質量％であることも好ましい。
　現像液は塩基性化合物及び塩基発生剤の少なくとも一方を１種のみ含有してもよいし、２種以上を含有してもよい。塩基性化合物及び塩基発生剤の少なくとも一方が２種以上である場合は、その合計が上記範囲であることが好ましい。 When the developer contains at least one of a basic compound and a base generator, the content of the basic compound or base generator is preferably 10% by mass or less, and 5% by mass or less based on the total mass of the developer. More preferred. The lower limit of the above content is not particularly limited, but is preferably 0.1% by mass or more, for example.
If the basic compound or base generator is solid in the environment in which the developer is used, the content of the basic compound or base generator should be 70 to 100% by mass based on the total solid content of the developer. is also preferable.
The developing solution may contain only one type of at least one of a basic compound and a base generator, or may contain two or more types. When at least one of the basic compound and the base generator is two or more types, it is preferable that the total is within the above range.
　現像液は、他の成分を更に含んでもよい。
　他の成分としては、例えば、公知の界面活性剤や公知の消泡剤等が挙げられる。 The developer may further contain other components.
Examples of other components include known surfactants and known antifoaming agents.
〔現像液の供給方法〕
　現像液の供給方法は、所望のパターンを形成できれば特に制限は無く、膜が形成された基材を現像液に浸漬する方法、基材上に形成された膜にノズルを用いて現像液を供給するパドル現像、または、現像液を連続供給する方法がある。ノズルの種類は特に制限は無く、ストレートノズル、シャワーノズル、スプレーノズル等が挙げられる。
　現像液の浸透性、非画像部の除去性、製造上の効率の観点から、現像液をストレートノズルで供給する方法、又はスプレーノズルにて連続供給する方法が好ましく、画像部への現像液の浸透性の観点からは、スプレーノズルで供給する方法がより好ましい。
　また、現像液をストレートノズルにて連続供給後、基材をスピンし現像液を基材上から除去し、スピン乾燥後に再度ストレートノズルにて連続供給後、基材をスピンし現像液を基材上から除去する工程を採用してもよく、この工程を複数回繰り返しても良い。
　現像工程における現像液の供給方法としては、現像液が連続的に基材に供給され続ける工程、基材上で現像液が略静止状態で保たれる工程、基材上で現像液を超音波等で振動させる工程及びそれらを組み合わせた工程などが挙げられる。 [Developer supply method]
The method of supplying the developer is not particularly limited as long as the desired pattern can be formed, and methods include immersing the base material on which the film is formed in the developer, and supplying the developer to the film formed on the base material using a nozzle. There is a method of paddle development, or a method of continuously supplying a developer. There are no particular restrictions on the type of nozzle, and examples include straight nozzles, shower nozzles, spray nozzles, and the like.
From the viewpoint of permeability of the developer, removability of non-image areas, and production efficiency, it is preferable to supply the developer using a straight nozzle or continuously using a spray nozzle. From the viewpoint of permeability, a method of supplying with a spray nozzle is more preferable.
In addition, after continuously supplying the developer using a straight nozzle, the base material is spun to remove the developer from the base material, and after spin drying, the developer is continuously supplied again using the straight nozzle, the base material is spun, and the developer is applied to the base material. A process of removing from above may be adopted, or this process may be repeated multiple times.
Methods for supplying the developer in the development process include a process in which the developer is continuously supplied to the base material, a process in which the developer is kept in a substantially stationary state on the base material, and a process in which the developer is applied to the base material using ultrasonic waves. Examples include a step of vibrating with the like, and a step of combining these.
　現像時間としては、１０秒～１０分間が好ましく、２０秒～５分間がより好ましい。現像時の現像液の温度は、特に定めるものではないが、１０～４５℃が好ましく、１８℃～３０℃がより好ましい。 The development time is preferably 10 seconds to 10 minutes, more preferably 20 seconds to 5 minutes. The temperature of the developer during development is not particularly limited, but is preferably 10 to 45°C, more preferably 18 to 30°C.
　現像工程において、現像液を用いた処理の後、更に、リンス液によるパターンの洗浄（リンス）を行ってもよい。また、パターン上に接する現像液が乾燥しきらないうちにリンス液を供給するなどの方法を採用しても良い。 In the development step, after the treatment using the developer, the pattern may be further cleaned (rinsed) with a rinse solution. Alternatively, a method such as supplying a rinsing liquid before the developer in contact with the pattern is completely dried may be adopted.
〔リンス液〕
　現像液がアルカリ水溶液である場合、リンス液としては、例えば水を用いることができる。現像液が有機溶剤を含む現像液である場合、リンス液としては、例えば、現像液に含まれる溶剤とは異なる溶剤（例えば、水、現像液に含まれる有機溶剤とは異なる有機溶剤）を用いることができる。 [Rinse liquid]
When the developing solution is an alkaline aqueous solution, water can be used as the rinsing solution, for example. When the developer is a developer containing an organic solvent, for example, a solvent different from the solvent contained in the developer (e.g., water, an organic solvent different from the organic solvent contained in the developer) is used as the rinse agent. be able to.
　リンス液が有機溶剤を含む場合の有機溶剤としては、上述の現像液が有機溶剤を含む場合において例示した有機溶剤と同様の有機溶剤が挙げられる。
　リンス液に含まれる有機溶剤は、現像液に含まれる有機溶剤とは異なる有機溶剤であることが好ましく、現像液に含まれる有機溶剤よりも、パターンの溶解度が小さい有機溶剤がより好ましい。 Examples of the organic solvent when the rinsing liquid contains an organic solvent include the same organic solvents as those exemplified in the case where the above-mentioned developer contains an organic solvent.
The organic solvent contained in the rinsing liquid is preferably an organic solvent different from the organic solvent contained in the developer, and more preferably an organic solvent in which the pattern has a lower solubility than the organic solvent contained in the developer.
　リンス液が有機溶剤を含む場合、有機溶剤は１種又は、２種以上を混合して使用することができる。有機溶剤は、シクロペンタノン、γ－ブチロラクトン、ジメチルスルホキシド、Ｎ－メチルピロリドン、シクロヘキサノン、ＰＧＭＥＡ、ＰＧＭＥが好ましく、シクロペンタノン、γ－ブチロラクトン、ジメチルスルホキシド、ＰＧＭＥＡ、ＰＧＭＥがより好ましく、シクロヘキサノン、ＰＧＭＥＡがさらに好ましい。 When the rinsing liquid contains an organic solvent, one type of organic solvent or a mixture of two or more types can be used. The organic solvent is preferably cyclopentanone, γ-butyrolactone, dimethyl sulfoxide, N-methylpyrrolidone, cyclohexanone, PGMEA, or PGME, more preferably cyclopentanone, γ-butyrolactone, dimethyl sulfoxide, PGMEA, or PGME, and cyclohexanone or PGMEA. More preferred.
　リンス液が有機溶剤を含む場合、リンス液の全質量に対し、有機溶剤は５０質量％以上が好ましく、７０質量％以上がより好ましく、９０質量％以上が更に好ましい。また、リンス液の全質量に対し、有機溶剤は１００質量％であってもよい。 When the rinsing liquid contains an organic solvent, the organic solvent is preferably 50% by mass or more, more preferably 70% by mass or more, and even more preferably 90% by mass or more, based on the total mass of the rinsing liquid. Moreover, the organic solvent may be 100% by mass with respect to the total mass of the rinsing liquid.
　リンス液は塩基性化合物及び塩基発生剤の少なくとも一方を含んでもよい。
　特に限定されないが、現像液が有機溶剤を含む場合、リンス液が有機溶剤と塩基性化合物及び塩基発生剤の少なくとも一方とを含む態様も、本発明の好ましい態様の一つである。
　リンス液に含まれる塩基性化合物及び塩基発生剤としては、上述の現像液が有機溶剤を含む場合に含まれてもよい塩基性化合物及び塩基発生剤として例示された化合物が挙げられ、好ましい態様も同様である。
　リンス液に含まれる塩基性化合物及び塩基発生剤は、リンス液における溶剤への溶解度等を考慮して選択すればよい。 The rinsing liquid may contain at least one of a basic compound and a base generator.
Although not particularly limited, when the developer contains an organic solvent, one preferred embodiment of the present invention is an embodiment in which the rinsing solution contains an organic solvent and at least one of a basic compound and a base generator.
Examples of the basic compound and base generator contained in the rinsing solution include the compounds exemplified as the basic compound and base generator that may be included when the above-mentioned developer contains an organic solvent, and preferred embodiments are also included. The same is true.
The basic compound and base generator contained in the rinsing liquid may be selected in consideration of their solubility in the solvent in the rinsing liquid.
　リンス液が塩基性化合物及び塩基発生剤の少なくとも一方を含む場合、塩基性化合物又は塩基発生剤の含有量はリンス液の全質量に対して、１０質量％以下が好ましく、５質量％以下がより好ましい。上記含有量の下限は特に限定されないが、例えば０．１質量％以上が好ましい。
　塩基性化合物又は塩基発生剤がリンス液が用いられる環境で固体である場合、塩基性化合物又は塩基発生剤の含有量は、リンス液の全固形分に対して、７０～１００質量％であることも好ましい。
　リンス液が塩基性化合物及び塩基発生剤の少なくとも一方を含む場合、リンス液は塩基性化合物及び塩基発生剤の少なくとも一方を１種のみ含有してもよいし、２種以上を含有してもよい。塩基性化合物及び塩基発生剤の少なくとも一方が２種以上である場合は、その合計が上記範囲であることが好ましい。 When the rinsing liquid contains at least one of a basic compound and a base generator, the content of the basic compound or base generator is preferably 10% by mass or less, more preferably 5% by mass or less, based on the total mass of the rinsing liquid. preferable. The lower limit of the above content is not particularly limited, but is preferably 0.1% by mass or more, for example.
If the basic compound or base generator is solid in the environment where the rinse solution is used, the content of the basic compound or base generator should be 70 to 100% by mass based on the total solid content of the rinse solution. is also preferable.
When the rinsing liquid contains at least one of a basic compound and a base generator, the rinsing liquid may contain only one type of at least one of the basic compound and the base generator, or may contain two or more types of the basic compound and the base generator. . When at least one of the basic compound and the base generator is two or more types, it is preferable that the total is within the above range.
　リンス液は、他の成分を更に含んでもよい。
　他の成分としては、例えば、公知の界面活性剤や公知の消泡剤等が挙げられる。 The rinse solution may further contain other components.
Examples of other components include known surfactants and known antifoaming agents.
〔リンス液の供給方法〕
　リンス液の供給方法は、所望のパターンを形成できれば特に制限は無く、基材をリンス液に浸漬する方法、基材に液盛りによりリンス液を供給する方法、基材にリンス液をシャワーで供給する方法、基材上にストレートノズル等の手段によりリンス液を連続供給する方法がある。
　リンス液の浸透性、非画像部の除去性、製造上の効率の観点から、リンス液をシャワーノズル、ストレートノズル、スプレーノズルなどで供給する方法があり、スプレーノズルにて連続供給する方法が好ましく、画像部へのリンス液の浸透性の観点からは、スプレーノズルで供給する方法がより好ましい。ノズルの種類は特に制限は無く、ストレートノズル、シャワーノズル、スプレーノズル等が挙げられる。
　すなわち、リンス工程は、リンス液を上記露光後の膜に対してストレートノズルにより供給、又は、連続供給する工程であることが好ましく、リンス液をスプレーノズルにより供給する工程であることがより好ましい。
　リンス工程におけるリンス液の供給方法としては、リンス液が連続的に基材に供給され続ける工程、基材上でリンス液が略静止状態で保たれる工程、基材上でリンス液を超音波等で振動させる工程及びそれらを組み合わせた工程などが採用可能である。 [How to supply rinsing liquid]
There are no particular restrictions on the method of supplying the rinsing liquid as long as the desired pattern can be formed, such as immersing the substrate in the rinsing liquid, supplying the rinsing liquid to the substrate by piling up the liquid, or supplying the rinsing liquid to the substrate by showering. There is a method of continuously supplying the rinsing liquid onto the substrate using a means such as a straight nozzle.
From the viewpoint of permeability of the rinsing liquid, removability of non-image areas, and production efficiency, there are methods of supplying the rinsing liquid using a shower nozzle, straight nozzle, spray nozzle, etc., and a continuous supply method using a spray nozzle is preferable. From the viewpoint of permeability of the rinsing liquid into the image area, a method of supplying the rinsing liquid using a spray nozzle is more preferable. There are no particular restrictions on the type of nozzle, and examples include straight nozzles, shower nozzles, spray nozzles, and the like.
That is, the rinsing step is preferably a step in which the rinsing liquid is supplied to the exposed film through a straight nozzle or continuously, and more preferably a step in which the rinsing liquid is supplied through a spray nozzle.
Methods for supplying the rinsing liquid in the rinsing process include a process in which the rinsing liquid is continuously supplied to the substrate, a process in which the rinsing liquid is kept in a substantially stationary state on the substrate, and a process in which the rinsing liquid is applied to the substrate using ultrasonic waves. It is possible to adopt a process of vibrating the wafer, etc., and a process of combining these.
　リンス時間としては、１０秒～１０分間が好ましく、２０秒～５分間がより好ましい。リンス時のリンス液の温度は、特に定めるものではないが、１０～４５℃が好ましく、１８℃～３０℃がより好ましい。 The rinsing time is preferably 10 seconds to 10 minutes, more preferably 20 seconds to 5 minutes. The temperature of the rinsing liquid during rinsing is not particularly limited, but is preferably 10 to 45°C, more preferably 18 to 30°C.
　現像工程において、現像液を用いた処理の後、又は、リンス液によるパターンの洗浄の後に、処理液とパターンとを接触させる工程を含んでもよい。また、パターン上に接する現像液又はリンス液が乾燥しきらないうちに処理液を供給するなどの方法を採用しても良い。 The developing step may include a step of bringing the processing solution into contact with the pattern after processing using the developer or after cleaning the pattern with a rinse solution. Alternatively, a method may be adopted in which the processing liquid is supplied before the developing liquid or the rinsing liquid in contact with the pattern is completely dried.
　上記処理液としては、水及び有機溶剤の少なくとも一方と、塩基性化合物及び塩基発生剤の少なくとも一方とを含む処理液が挙げられる。
　上記有機溶剤、及び、塩基性化合物及び塩基発生剤の少なくとも一方の好ましい態様は、上述のリンス液において用いられる有機溶剤、及び、塩基性化合物及び塩基発生剤の少なくとも一方の好ましい態様と同様である。
　処理液のパターンへの供給方法は、上述のリンス液の供給方法と同様の方法を用いることができ、好ましい態様も同様である。 Examples of the treatment liquid include a treatment liquid containing at least one of water and an organic solvent, and at least one of a basic compound and a base generator.
Preferred embodiments of the organic solvent and at least one of the basic compound and base generator are the same as the preferred embodiments of the organic solvent and at least one of the basic compound and base generator used in the above-mentioned rinsing liquid. .
The method for supplying the treatment liquid to the pattern can be the same as the method for supplying the rinsing liquid described above, and the preferred embodiments are also the same.
　処理液における塩基性化合物又は塩基発生剤の含有量は、処理液の全質量に対して、１０質量％以下が好ましく、５質量％以下がより好ましい。上記含有量の下限は特に限定されないが、例えば０．１質量％以上であることが好ましい。
　また、塩基性化合物又は塩基発生剤が処理液が用いられる環境で固体である場合、塩基性化合物又は塩基発生剤の含有量は、処理液の全固形分に対して、７０～１００質量％であることも好ましい。
　処理液が塩基性化合物及び塩基発生剤の少なくとも一方を含む場合、処理液は塩基性化合物及び塩基発生剤の少なくとも一方を１種のみ含有してもよいし、２種以上を含有してもよい。塩基性化合物及び塩基発生剤の少なくとも一方が２種以上である場合は、その合計が上記範囲であることが好ましい。 The content of the basic compound or base generator in the treatment liquid is preferably 10% by mass or less, more preferably 5% by mass or less, based on the total mass of the treatment liquid. The lower limit of the content is not particularly limited, but is preferably 0.1% by mass or more, for example.
In addition, if the basic compound or base generator is solid in the environment where the treatment liquid is used, the content of the basic compound or base generator is 70 to 100% by mass based on the total solid content of the treatment liquid. It's also good to have one.
When the processing liquid contains at least one of a basic compound and a base generator, the processing liquid may contain only one type of at least one of the basic compound and the base generator, or may contain two or more types of the basic compound and the base generator. . When at least one of the basic compound and the base generator is two or more types, it is preferable that the total is within the above range.
＜加熱工程＞
　現像工程により得られたパターン（リンス工程を行う場合は、リンス後のパターン）は、上記現像により得られたパターンを加熱する加熱工程に供されてもよい。
　すなわち、本発明の硬化物の製造方法は、現像工程により得られたパターンを加熱する加熱工程を含んでもよい。
　また、本発明の硬化物の製造方法は、現像工程を行わずに他の方法で得られたパターン、又は、膜形成工程により得られた膜を加熱する加熱工程を含んでもよい。
　加熱工程において、ポリイミド前駆体等の樹脂は環化してポリイミド等の樹脂となる。
　また、特定樹脂、又は特定樹脂以外の架橋剤における未反応の架橋性基の架橋なども進行する。
　加熱工程における加熱温度（最高加熱温度）としては、５０～４５０℃が好ましく、１５０～３５０℃がより好ましく、１５０～２５０℃が更に好ましく、１６０～２５０℃が一層好ましく、１６０～２３０℃が特に好ましい。 <Heating process>
The pattern obtained by the development step (in the case of performing the rinsing step, the pattern after rinsing) may be subjected to a heating step of heating the pattern obtained by the development.
That is, the method for producing a cured product of the present invention may include a heating step of heating the pattern obtained by the developing step.
Furthermore, the method for producing a cured product of the present invention may include a heating step of heating a pattern obtained by another method without performing a developing step, or a film obtained by a film forming step.
In the heating step, a resin such as a polyimide precursor is cyclized to become a resin such as polyimide.
Further, crosslinking of unreacted crosslinkable groups in the specific resin or a crosslinking agent other than the specific resin also progresses.
The heating temperature (maximum heating temperature) in the heating step is preferably 50 to 450°C, more preferably 150 to 350°C, even more preferably 150 to 250°C, even more preferably 160 to 250°C, particularly 160 to 230°C. preferable.
　加熱工程は、加熱により、上記塩基発生剤から発生した塩基等の作用により、上記パターン内で上記ポリイミド前駆体の環化反応を促進する工程であることが好ましい。 The heating step is preferably a step of promoting the cyclization reaction of the polyimide precursor within the pattern by heating and the action of a base generated from the base generator.
　加熱工程における加熱は、加熱開始時の温度から最高加熱温度まで１～１２℃／分の昇温速度で行うことが好ましい。上記昇温速度は２～１０℃／分がより好ましく、３～１０℃／分が更に好ましい。昇温速度を１℃／分以上とすることにより、生産性を確保しつつ、酸又は溶剤の過剰な揮発を防止することができ、昇温速度を１２℃／分以下とすることにより、硬化物の残存応力を緩和することができる。
　加えて、急速加熱可能なオーブンの場合、加熱開始時の温度から最高加熱温度まで１～８℃／秒の昇温速度で行うことが好ましく、２～７℃／秒がより好ましく、３～６℃／秒が更に好ましい。 Heating in the heating step is preferably carried out at a temperature increase rate of 1 to 12° C./min from the temperature at the start of heating to the maximum heating temperature. The temperature increase rate is more preferably 2 to 10°C/min, and even more preferably 3 to 10°C/min. By setting the heating rate to 1°C/min or more, it is possible to prevent excessive volatilization of acid or solvent while ensuring productivity, and by setting the heating rate to 12°C/min or less, curing can be achieved. Residual stress in objects can be alleviated.
In addition, in the case of an oven capable of rapid heating, it is preferable to raise the temperature from the temperature at the start of heating to the maximum heating temperature at a heating rate of 1 to 8°C/second, more preferably 2 to 7°C/second, and 3 to 6°C. C/sec is more preferred.
　加熱開始時の温度は、２０℃～１５０℃が好ましく、２０℃～１３０℃がより好ましく、２５℃～１２０℃が更に好ましい。加熱開始時の温度は、最高加熱温度まで加熱する工程を開始する際の温度のことをいう。例えば、本発明の樹脂組成物を基材の上に適用した後、乾燥させる場合、この乾燥後の膜（層）の温度であり、例えば、樹脂組成物に含まれる溶剤の沸点よりも、３０～２００℃低い温度から昇温させることが好ましい。 The temperature at the start of heating is preferably 20°C to 150°C, more preferably 20°C to 130°C, even more preferably 25°C to 120°C. The temperature at the start of heating refers to the temperature at which the process of heating to the maximum heating temperature is started. For example, when the resin composition of the present invention is applied onto a substrate and then dried, the temperature of the film (layer) after drying is, for example, 30°C higher than the boiling point of the solvent contained in the resin composition. It is preferable to raise the temperature from a lower temperature by ~200°C.
　加熱時間（最高加熱温度での加熱時間）は、５～３６０分が好ましく、１０～３００分がより好ましく、１５～２４０分が更に好ましい。 The heating time (heating time at the highest heating temperature) is preferably 5 to 360 minutes, more preferably 10 to 300 minutes, and even more preferably 15 to 240 minutes.
　特に多層の積層体を形成する場合、層間の密着性の観点から、加熱温度は３０℃以上であることが好ましく、８０℃以上がより好ましく、１００℃以上が更に好ましく、１２０℃以上が特に好ましい。
　上記加熱温度の上限は、３５０℃以下が好ましく、２５０℃以下がより好ましく、２４０℃以下が更に好ましい。 In particular, when forming a multilayer laminate, from the viewpoint of interlayer adhesion, the heating temperature is preferably 30°C or higher, more preferably 80°C or higher, even more preferably 100°C or higher, and particularly preferably 120°C or higher. .
The upper limit of the heating temperature is preferably 350°C or lower, more preferably 250°C or lower, and even more preferably 240°C or lower.
　加熱は段階的に行ってもよい。例として、２５℃から１２０℃まで３℃／分で昇温し、１２０℃にて６０分保持し、１２０℃から１８０℃まで２℃／分で昇温し、１８０℃にて１２０分保持する、といった工程を行ってもよい。また、米国特許第９１５９５４７号明細書に記載のように紫外線を照射しながら処理することも好ましい。このような前処理工程により膜の特性を向上させることが可能である。前処理工程は１０秒間～２時間程度の短い時間で行うとよく、１５秒～３０分間がより好ましい。前処理は２段階以上のステップとしてもよく、例えば１００～１５０℃の範囲で１段階目の前処理工程を行い、その後に１５０～２００℃の範囲で２段階目の前処理工程を行ってもよい。
　更に、加熱後冷却してもよく、この場合の冷却速度としては、１～５℃／分であることが好ましい。 Heating may be performed in stages. As an example, the temperature is raised from 25°C to 120°C at a rate of 3°C/min, held at 120°C for 60 minutes, and the temperature is raised from 120°C to 180°C at a rate of 2°C/min, and held at 180°C for 120 minutes. , etc. may be performed. It is also preferable to perform the treatment while irradiating ultraviolet rays as described in US Pat. No. 9,159,547. Such pretreatment steps can improve the properties of the film. The pretreatment step is preferably carried out for a short time of about 10 seconds to 2 hours, more preferably 15 seconds to 30 minutes. The pretreatment may be performed in two or more steps, for example, the first pretreatment step may be performed at a temperature of 100 to 150°C, followed by the second pretreatment step at a temperature of 150 to 200°C. good.
Furthermore, cooling may be performed after heating, and the cooling rate in this case is preferably 1 to 5° C./min.
　加熱工程は、窒素、ヘリウム、アルゴンなどの不活性ガスを流す、減圧下で行う等により、低酸素濃度の雰囲気で行うことが特定樹脂の分解を防ぐ観点で好ましい。酸素濃度は、５０ｐｐｍ（体積比）以下が好ましく、２０ｐｐｍ（体積比）以下がより好ましい。
　加熱工程における加熱手段としては、特に限定されないが、例えばホットプレート、赤外炉、電熱式オーブン、熱風式オーブン、赤外線オーブンなどが挙げられる。 The heating step is preferably performed in an atmosphere with a low oxygen concentration, such as by flowing an inert gas such as nitrogen, helium, or argon, or under reduced pressure, from the viewpoint of preventing decomposition of the specific resin. The oxygen concentration is preferably 50 ppm (volume ratio) or less, more preferably 20 ppm (volume ratio) or less.
The heating means in the heating step is not particularly limited, but includes, for example, a hot plate, an infrared oven, an electric oven, a hot air oven, an infrared oven, and the like.
＜現像後露光工程＞
　現像工程により得られたパターン（リンス工程を行う場合は、リンス後のパターン）は、上記加熱工程に代えて、又は、上記加熱工程に加えて、現像工程後のパターンを露光する現像後露光工程に供されてもよい。
　すなわち、本発明の硬化物の製造方法は、現像工程により得られたパターンを露光する現像後露光工程を含んでもよい。本発明の硬化物の製造方法は、加熱工程及び現像後露光工程を含んでもよいし、加熱工程及び現像後露光工程の一方のみを含んでもよい。
　現像後露光工程においては、例えば、光塩基発生剤の感光によってポリイミド前駆体等の環化が進行する反応や、光酸発生剤の感光によって酸分解性基の脱離が進行する反応などを促進することができる。
　現像後露光工程においては、現像工程において得られたパターンの少なくとも一部が露光されればよいが、上記パターンの全部が露光されることが好ましい。
　現像後露光工程における露光量は、感光性化合物が感度を有する波長における露光エネルギー換算で、５０～２０，０００ｍＪ／ｃｍ２が好ましく、１００～１５，０００ｍＪ／ｃｍ２がより好ましい。
　現像後露光工程は、例えば、上述の露光工程における光源を用いて行うことができ、ブロードバンド光を用いることが好ましい。 <Post-development exposure process>
The pattern obtained in the development process (in the case of performing a rinsing process, the pattern after rinsing) is subjected to a post-development exposure process in which the pattern after the development process is exposed to light, instead of or in addition to the above heating process. may be served.
That is, the method for producing a cured product of the present invention may include a post-development exposure step of exposing the pattern obtained in the development step. The method for producing a cured product of the present invention may include a heating step and a post-development exposure step, or may include only one of the heating step and the post-development exposure step.
In the post-development exposure step, for example, a reaction in which cyclization of a polyimide precursor etc. progresses due to the exposure of a photobase generator, a reaction in which the elimination of acid-decomposable groups progresses due to exposure to a photoacid generator, etc. are promoted. can do.
In the post-development exposure step, at least a portion of the pattern obtained in the development step may be exposed, but it is preferable that the entire pattern be exposed.
The exposure amount in the post-development exposure step is preferably 50 to 20,000 mJ/cm 2 , more preferably 100 to 15,000 mJ/cm 2 in terms of exposure energy at the wavelength to which the photosensitive compound is sensitive.
The post-development exposure step can be performed, for example, using the light source used in the above-mentioned exposure step, and it is preferable to use broadband light.
＜金属層形成工程＞
　現像工程により得られたパターン（加熱工程及び現像後露光工程の少なくとも一方に供されたものが好ましい）は、パターン上に金属層を形成する金属層形成工程に供されてもよい。
　すなわち、本発明の硬化物の製造方法は、現像工程により得られたパターン（加熱工程及び現像後露光工程少なくとも一方に供されたものが好ましい）上に金属層を形成する金属層形成工程を含むことが好ましい。 <Metal layer formation process>
The pattern obtained by the development process (preferably one that has been subjected to at least one of a heating process and a post-development exposure process) may be subjected to a metal layer forming process of forming a metal layer on the pattern.
That is, the method for producing a cured product of the present invention includes a metal layer forming step of forming a metal layer on the pattern obtained in the development step (preferably one that has been subjected to at least one of the heating step and the post-development exposure step). It is preferable.
　金属層としては、特に限定なく、既存の金属種を使用することができ、銅、アルミニウム、ニッケル、バナジウム、チタン、クロム、コバルト、金、タングステン、錫、銀及びこれらの金属を含む合金が例示され、銅及びアルミニウムがより好ましく、銅が更に好ましい。 As the metal layer, existing metal species can be used without particular limitation, and examples include copper, aluminum, nickel, vanadium, titanium, chromium, cobalt, gold, tungsten, tin, silver, and alloys containing these metals. copper and aluminum are more preferred, and copper is even more preferred.
　金属層の形成方法は、特に限定なく、既存の方法を適用することができる。例えば、特開２００７－１５７８７９号公報、特表２００１－５２１２８８号公報、特開２００４－２１４５０１号公報、特開２００４－１０１８５０号公報、米国特許第７８８８１８１Ｂ２、米国特許第９１７７９２６Ｂ２に記載された方法を使用することができる。例えば、フォトリソグラフィ、ＰＶＤ（物理蒸着法）、ＣＶＤ（化学気相成長法）、リフトオフ、電解めっき、無電解めっき、エッチング、印刷、及びこれらを組み合わせた方法などが考えられる。より具体的には、スパッタリング、フォトリソグラフィ及びエッチングを組み合わせたパターニング方法、フォトリソグラフィと電解めっきを組み合わせたパターニング方法が挙げられる。めっきの好ましい態様としては、硫酸銅やシアン化銅めっき液を用いた電解めっきが挙げられる。 The method for forming the metal layer is not particularly limited, and existing methods can be applied. For example, the methods described in JP 2007-157879, JP 2001-521288, JP 2004-214501, JP 2004-101850, US Patent No. 7888181B2, and US Patent No. 9177926B2 are used. can do. For example, photolithography, PVD (physical vapor deposition), CVD (chemical vapor deposition), lift-off, electrolytic plating, electroless plating, etching, printing, and combinations thereof can be used. More specifically, a patterning method that combines sputtering, photolithography, and etching, and a patterning method that combines photolithography and electrolytic plating can be mentioned. A preferred embodiment of plating includes electrolytic plating using copper sulfate or copper cyanide plating solution.
　金属層の厚さとしては、最も厚肉の部分で、０．０１～５０μｍが好ましく、１～１０μｍがより好ましい。 The thickness of the metal layer is preferably 0.01 to 50 μm, more preferably 1 to 10 μm at the thickest part.
＜用途＞
　本発明の硬化物の製造方法、又は、硬化物の適用可能な分野としては、電子デバイスの絶縁膜、再配線層用層間絶縁膜、ストレスバッファ膜などが挙げられる。そのほか、封止フィルム、基板材料（フレキシブルプリント基板のベースフィルムやカバーレイ、層間絶縁膜）、又は上記のような実装用途の絶縁膜をエッチングでパターン形成することなどが挙げられる。これらの用途については、例えば、サイエンス＆テクノロジー（株）「ポリイミドの高機能化と応用技術」２００８年４月、柿本雅明／監修、ＣＭＣテクニカルライブラリー「ポリイミド材料の基礎と開発」２０１１年１１月発行、日本ポリイミド・芳香族系高分子研究会／編「最新ポリイミド　基礎と応用」エヌ・ティー・エス，２０１０年８月等を参照することができる。 <Application>
Fields to which the method for producing a cured product of the present invention or the cured product can be applied include insulating films for electronic devices, interlayer insulating films for rewiring layers, stress buffer films, and the like. Other methods include forming a pattern by etching a sealing film, a substrate material (a base film or coverlay of a flexible printed circuit board, an interlayer insulating film), or an insulating film for mounting purposes as described above. For information on these uses, see, for example, Science & Technology Co., Ltd., "Advanced Functionality and Applied Technology of Polyimide," April 2008, Masaaki Kakimoto/Supervised, CMC Technical Library, "Basics and Development of Polyimide Materials," November 2011. You can refer to "Latest Polyimide Fundamentals and Applications" published by Japan Polyimide and Aromatic Polymer Research Group/editor, NTS, August 2010, etc.
　本発明の硬化物の製造方法、又は、本発明の硬化物は、オフセット版面又はスクリーン版面などの版面の製造、成形部品のエッチングへの使用、エレクトロニクス、特に、マイクロエレクトロニクスにおける保護ラッカー及び誘電層の製造などにも用いることもできる。 The method for producing a cured product of the present invention or the cured product of the present invention can be used for producing plates such as offset plates or screen plates, for etching molded parts, and for use in protective lacquers and dielectric layers in electronics, particularly microelectronics. It can also be used for manufacturing.
（積層体、及び、積層体の製造方法）
　本発明の積層体とは、本発明の硬化物からなる層を複数層有する構造体をいう。
　積層体は、硬化物からなる層を２層以上含む積層体であり、３層以上積層した積層体としてもよい。
　上記積層体に含まれる２層以上の上記硬化物からなる層のうち、少なくとも１つが本発明の硬化物からなる層であり、硬化物の収縮、又は、上記収縮に伴う硬化物の変形等を抑制する観点からは、上記積層体に含まれる全ての硬化物からなる層が本発明の硬化物からなる層であることも好ましい。 (Laminated body and method for manufacturing the laminate)
The laminate of the present invention refers to a structure having a plurality of layers made of the cured product of the present invention.
The laminate is a laminate including two or more layers made of cured material, and may be a laminate including three or more layers.
At least one of the two or more layers made of the cured product contained in the laminate is a layer made of the cured product of the present invention, and shrinkage of the cured product or deformation of the cured product due to the shrinkage, etc. From the viewpoint of suppression, it is also preferable that all the layers made of the cured product contained in the above-mentioned laminate are layers made of the cured product of the present invention.
　すなわち、本発明の積層体の製造方法は、本発明の硬化物の製造方法を含むことが好ましく、本発明の硬化物の製造方法を複数回繰り返すことを含むことがより好ましい。 That is, the method for producing a laminate of the present invention preferably includes the method for producing a cured product of the present invention, and more preferably includes repeating the method for producing a cured product of the present invention multiple times.
　本発明の積層体は、硬化物からなる層を２層以上含み、上記硬化物からなる層同士のいずれかの間に金属層を含む態様が好ましい。上記金属層は、上記金属層形成工程により形成されることが好ましい。
　すなわち、本発明の積層体の製造方法は、複数回行われる硬化物の製造方法の間に、硬化物からなる層上に金属層を形成する金属層形成工程を更に含むことが好ましい。金属層形成工程の好ましい態様は上述の通りである。
　上記積層体としては、例えば、第一の硬化物からなる層、金属層、第二の硬化物からなる層の３つの層がこの順に積層された層構造を少なくとも含む積層体が好ましいものとして挙げられる。
　上記第一の硬化物からなる層及び上記第二の硬化物からなる層は、いずれも本発明の硬化物からなる層であることが好ましい。上記第一の硬化物からなる層の形成に用いられる本発明の樹脂組成物と、上記第二の硬化物からなる層の形成に用いられる本発明の樹脂組成物とは、組成が同一の組成物であってもよいし、組成が異なる組成物であってもよい。本発明の積層体における金属層は、再配線層などの金属配線として好ましく用いられる。 The laminate of the present invention preferably includes two or more layers made of a cured product and includes a metal layer between any of the layers made of the cured product. The metal layer is preferably formed by the metal layer forming step.
That is, the method for producing a laminate of the present invention preferably further includes a metal layer forming step of forming a metal layer on the layer made of the cured product during the method for producing the cured product which is performed multiple times. A preferred embodiment of the metal layer forming step is as described above.
As the above-mentioned laminate, for example, a laminate including at least a layered structure in which three layers, ie, a layer consisting of a first cured product, a metal layer, and a layer consisting of a second cured product are laminated in this order, is preferred. It will be done.
It is preferable that the layer made of the first cured product and the layer made of the second cured product are both layers made of the cured product of the present invention. The resin composition of the present invention used to form the layer made of the first cured product and the resin composition of the present invention used to form the layer made of the second cured product have the same composition. It may be a product or a composition having a different composition. The metal layer in the laminate of the present invention is preferably used as metal wiring such as a rewiring layer.
＜積層工程＞
　本発明の積層体の製造方法は、積層工程を含むことが好ましい。
　積層工程とは、パターン（樹脂層）又は金属層の表面に、再度、（ａ）膜形成工程（層形成工程）、（ｂ）露光工程、（ｃ）現像工程、（ｄ）加熱工程及び現像後露光工程の少なくとも一方を、この順に行うことを含む一連の工程である。ただし、（ａ）膜形成工程および（ｄ）加熱工程及び現像後露光工程の少なくとも一方を繰り返す態様であってもよい。また、（ｄ）加熱工程及び現像後露光工程の少なくとも一方の後には（ｅ）金属層形成工程を含んでもよい。積層工程には、更に、上記乾燥工程等を適宜含んでいてもよいことは言うまでもない。 <Lamination process>
It is preferable that the method for manufacturing a laminate of the present invention includes a lamination step.
The lamination process refers to (a) film formation process (layer formation process), (b) exposure process, (c) development process, (d) heating process and development on the surface of the pattern (resin layer) or metal layer again. This is a series of steps including performing at least one of the post-exposure steps in this order. However, an embodiment may be adopted in which at least one of the (a) film forming step and (d) heating step and post-development exposure step is repeated. Further, after at least one of the (d) heating step and the post-development exposure step, a (e) metal layer forming step may be included. It goes without saying that the lamination step may further include the above-mentioned drying step and the like as appropriate.
　積層工程後、更に積層工程を行う場合には、上記露光工程後、上記加熱工程の後、又は、上記金属層形成工程後に、更に、表面活性化処理工程を行ってもよい。表面活性化処理としては、プラズマ処理が例示される。表面活性化処理の詳細については後述する。 If a lamination step is further performed after the lamination step, a surface activation treatment step may be performed after the exposure step, the heating step, or the metal layer forming step. Plasma treatment is exemplified as the surface activation treatment. Details of the surface activation treatment will be described later.
　上記積層工程は、２～２０回行うことが好ましく、２～９回行うことがより好ましい。
　例えば、樹脂層／金属層／樹脂層／金属層／樹脂層／金属層のように、樹脂層を２層以上２０層以下とする構成が好ましく、２層以上９層以下とする構成が更に好ましい。
　上記各層はそれぞれ、組成、形状、膜厚等が同一であってもよいし、異なっていてもよい。 The above lamination step is preferably performed 2 to 20 times, more preferably 2 to 9 times.
For example, a configuration in which the number of resin layers is 2 or more and 20 or less, such as resin layer/metal layer/resin layer/metal layer/resin layer/metal layer, is preferable, and a configuration in which the number of resin layers is 2 or more and 9 or less is more preferable. .
The above layers may have the same composition, shape, thickness, etc., or may have different compositions, shapes, thicknesses, etc.
　本発明では特に、金属層を設けた後、更に、上記金属層を覆うように、上記本発明の樹脂組成物の硬化物（樹脂層）を形成する態様が好ましい。具体的には、（ａ）膜形成工程、（ｂ）露光工程、（ｃ）現像工程、（ｄ）加熱工程及び現像後露光工程の少なくとも一方、（ｅ）金属層形成工程、の順序で繰り返す態様、又は、（ａ）膜形成工程、（ｄ）加熱工程及び現像後露光工程の少なくとも一方、（ｅ）金属層形成工程の順序で繰り返す態様が挙げられる。本発明の樹脂組成物層（樹脂層）を積層する積層工程と、金属層形成工程を交互に行うことにより、本発明の樹脂組成物層（樹脂層）と金属層を交互に積層することができる。 In the present invention, it is particularly preferable that after providing the metal layer, a cured product (resin layer) of the resin composition of the present invention is further formed to cover the metal layer. Specifically, the following steps are repeated in the following order: (a) film formation step, (b) exposure step, (c) development step, (d) at least one of the heating step and post-development exposure step, and (e) metal layer formation step. Alternatively, an embodiment may be mentioned in which (a) a film forming step, (d) at least one of a heating step and a post-development exposure step, and (e) a metal layer forming step are repeated in this order. By alternately performing the lamination step of laminating the resin composition layer (resin layer) of the present invention and the metal layer forming step, the resin composition layer (resin layer) of the present invention and the metal layer can be alternately laminated. can.
（表面活性化処理工程）
　本発明の積層体の製造方法は、上記金属層および樹脂組成物層の少なくとも一部を表面活性化処理する、表面活性化処理工程を含むことが好ましい。
　表面活性化処理工程は、通常、金属層形成工程の後に行うが、上記現像工程の後（好ましくは、加熱工程及び現像後露光工程の少なくとも一方の後）、樹脂組成物層に表面活性化処理工程を行ってから、金属層形成工程を行ってもよい。
　表面活性化処理は、金属層の少なくとも一部のみに行ってもよいし、露光後の樹脂組成物層の少なくとも一部のみに行ってもよいし、金属層および露光後の樹脂組成物層の両方について、それぞれ、少なくとも一部に行ってもよい。表面活性化処理は、金属層の少なくとも一部について行うことが好ましく、金属層のうち、表面に樹脂組成物層を形成する領域の一部または全部に表面活性化処理を行うことが好ましい。このように、金属層の表面に表面活性化処理を行うことにより、その表面に設けられる樹脂組成物層（膜）との密着性を向上させることができる。
　表面活性化処理は、露光後の樹脂組成物層（樹脂層）の一部または全部についても行うことが好ましい。このように、樹脂組成物層の表面に表面活性化処理を行うことにより、表面活性化処理した表面に設けられる金属層や樹脂層との密着性を向上させることができる。特にネガ型現像を行う場合など、樹脂組成物層が硬化されている場合には、表面処理によるダメージを受けにくく、密着性が向上しやすい。
　表面活性化処理は、例えば、国際公開第第２０２１／１１２１８９号の段落０４１５に記載の方法により実施することができる。この内容は本明細書に組み込まれる。 (Surface activation treatment process)
The method for producing a laminate of the present invention preferably includes a surface activation treatment step of surface activation treatment of at least a portion of the metal layer and the resin composition layer.
The surface activation treatment step is usually performed after the metal layer forming step, but after the development step (preferably after at least one of the heating step and the post-development exposure step), the resin composition layer is subjected to the surface activation treatment. After performing this step, the metal layer forming step may be performed.
The surface activation treatment may be performed on at least a portion of the metal layer, or may be performed on at least a portion of the resin composition layer after exposure, or the surface activation treatment may be performed on at least a portion of the metal layer and the resin composition layer after exposure. Both may be performed at least in part, respectively. The surface activation treatment is preferably performed on at least a part of the metal layer, and it is preferable that the surface activation treatment is performed on a part or all of the region of the metal layer on which the resin composition layer is to be formed. By performing surface activation treatment on the surface of the metal layer in this way, it is possible to improve the adhesion with the resin composition layer (film) provided on the surface.
It is preferable that the surface activation treatment is also performed on part or all of the resin composition layer (resin layer) after exposure. By performing surface activation treatment on the surface of the resin composition layer in this way, it is possible to improve the adhesion with the metal layer or resin layer provided on the surface that has been surface activated. In particular, when the resin composition layer is hardened, such as when performing negative development, it is less likely to be damaged by surface treatment and adhesion is likely to be improved.
The surface activation treatment can be performed, for example, by the method described in paragraph 0415 of International Publication No. 2021/112189. This content is incorporated herein.
（半導体デバイス及びその製造方法）
　本発明は、本発明の硬化物、又は、積層体を含む半導体デバイスも開示する。
　また、本発明は、本発明の硬化物の製造方法、又は、積層体の製造方法を含む半導体デバイスの製造方法も開示する。
　本発明の樹脂組成物を再配線層用層間絶縁膜の形成に用いた半導体デバイスの具体例としては、特開２０１６－０２７３５７号公報の段落０２１３～０２１８の記載及び図１の記載を参酌でき、これらの内容は本明細書に組み込まれる。 (Semiconductor device and its manufacturing method)
The present invention also discloses a semiconductor device containing the cured product or laminate of the present invention.
The present invention also discloses a method for manufacturing a semiconductor device, including a method for manufacturing a cured product or a method for manufacturing a laminate according to the present invention.
As a specific example of a semiconductor device using the resin composition of the present invention for forming an interlayer insulating film for a rewiring layer, the descriptions in paragraphs 0213 to 0218 of JP 2016-027357A and the description in FIG. 1 can be referred to, Their contents are incorporated herein.
　以下に実施例を挙げて本発明を更に具体的に説明する。以下の実施例に示す材料、使用量、割合、処理内容、処理手順等は、本発明の趣旨を逸脱しない限り、適宜、変更することができる。従って、本発明の範囲は以下に示す具体例に限定されるものではない。「部」、「％」は特に述べない限り、質量基準である。 The present invention will be explained in more detail with reference to Examples below. The materials, usage amounts, ratios, processing details, processing procedures, etc. shown in the following examples can be changed as appropriate without departing from the spirit of the present invention. Therefore, the scope of the present invention is not limited to the specific examples shown below. "Parts" and "%" are based on mass unless otherwise stated.
＜ポリマー合成＞
〔合成例Ａ－１：ポリイミド前駆体（Ａ－１）の合成〕
　１０．４ｇ（４７．６ミリモル）のピロメリット酸無水物と、１０．６ｇ（２０．４ミリモル）の４，４’－（４，４’－イソプロピリデンジフェノキシ）ビス（フタル酸無水物）と、１７．８ｇ（１３７ミリモル）の２－ヒドロキシエチルメタクリレートと、０．０５ｇのハイドロキノンと、２２．８ｇ（２８９ミリモル）のピリジンと、７５ｇのダイグライムとを混合し、６０℃の温度で５時間撹拌して、ピロメリット酸無水物及び４，４’－（４，４’－イソプロピリデンジフェノキシ）ビス（フタル酸無水物）、と２－ヒドロキシエチルメタクリレートのジエステルを製造した。次いで、混合物を－２０℃まで冷却した後、塩化チオニル　１７．７０ｇ（１４１ミリモル）を９０分かけて滴下し、２時間撹拌し、ピリジニウムヒドロクロリドの白色沈澱が得られた。
　次いで、４，４’－ジアミノ－２，２’－ビス（トリフルオロメチル）ビフェニル　２１．１ｇ（６６．０ミリモル）をＮＭＰ（Ｎ－メチルー２－ピロリドン）　１００ｍＬ中に溶解させたものを、２時間かけて滴下した。次いで、エタノール　１０．０ｇ（２１７ミリモル）を加え、混合物を２時間撹拌した。次いで、４リットルの水の中でポリイミド前駆体を沈殿させ、水－ポリイミド前駆体混合物を５００ｒｐｍの速度で１５分間撹拌した。ポリイミド前駆体を濾過して取得し、４リットルの水の中で再度３０分間撹拌し再び濾過した。次いで、得られたポリイミド前駆体を減圧下、４５℃で２日間乾燥しポリイミド前駆体（Ａ－１）を得た。得られたポリイミド前駆体（Ａ－１）の重量平均分子量（Ｍｗ）は６０，５００、数平均分子量（Ｍｎ）は２４，４００であった。ポリイミド前駆体（Ａ－１）は、下記式（Ａ－１）で表される２つの繰返し単位を含む構造である。各繰返し単位の構造は１Ｈ－ＮＭＲスペクトルから確認した。
  <Polymer synthesis>
[Synthesis Example A-1: Synthesis of polyimide precursor (A-1)]
10.4 g (47.6 mmol) of pyromellitic anhydride and 10.6 g (20.4 mmol) of 4,4'-(4,4'-isopropylidene diphenoxy)bis(phthalic anhydride) , 17.8 g (137 mmol) of 2-hydroxyethyl methacrylate, 0.05 g of hydroquinone, 22.8 g (289 mmol) of pyridine, and 75 g of diglyme were mixed and heated at a temperature of 60° C. for 5 hours. By stirring, a diester of pyromellitic anhydride, 4,4'-(4,4'-isopropylidenediphenoxy)bis(phthalic anhydride), and 2-hydroxyethyl methacrylate was produced. Then, after cooling the mixture to -20°C, 17.70 g (141 mmol) of thionyl chloride was added dropwise over 90 minutes and stirred for 2 hours to obtain a white precipitate of pyridinium hydrochloride.
Next, 21.1 g (66.0 mmol) of 4,4'-diamino-2,2'-bis(trifluoromethyl)biphenyl was dissolved in 100 mL of NMP (N-methyl-2-pyrrolidone). It dripped over time. Then 10.0 g (217 mmol) of ethanol was added and the mixture was stirred for 2 hours. The polyimide precursor was then precipitated in 4 liters of water and the water-polyimide precursor mixture was stirred at a speed of 500 rpm for 15 minutes. The polyimide precursor was obtained by filtration, stirred again in 4 liters of water for 30 minutes and filtered again. Next, the obtained polyimide precursor was dried at 45° C. for 2 days under reduced pressure to obtain a polyimide precursor (A-1). The weight average molecular weight (Mw) of the obtained polyimide precursor (A-1) was 60,500, and the number average molecular weight (Mn) was 24,400. The polyimide precursor (A-1) has a structure containing two repeating units represented by the following formula (A-1). The structure of each repeating unit was confirmed from the 1 H-NMR spectrum.
〔合成例Ａ－１ｂ：ポリイミド前駆体（Ａ－１ｂ）の合成〕
　９．８５ｇ（４５．１５ミリモル）のピロメリット酸無水物と、１０．０７ｇ（１９．３５ミリモル）の４，４’－（４，４’－イソプロピリデンジフェノキシ）ビス（フタル酸無水物）と、１６．８ｇ（１２９ミリモル）の２－ヒドロキシエチルメタクリレートと、０．０５ｇのハイドロキノンと、２０．４ｇのピリジン（２５８ミリモル）と、２００ｇのγ－ブチロラクトンとを混合し、室温で１０時間撹拌した。さらに０．８４ｇ（６．４５ミリモル）の２－ヒドロキシエチルメタクリレートを添加し、２時間撹拌して、４，４’－オキシジフタル酸と２－ヒドロキシエチルメタクリレートのジエステルを製造した。
　次に、氷冷下、ジシクロヘキシルカルボジイミド（ＤＣＣ）２６．６ｇを２５ｇのγ―ブチロラクトンに溶解した溶液を撹拌しながら滴下した。続いて４，４’－ジアミノ－２，２’－ビス（トリフルオロメチル）ビフェニル２０．１ｇをγ－ブチロラクトン４５ｍｌに懸濁したものとＤＣＣ　３．８ｇを１０ｇのγ－ブチロラクトンに溶解させた溶液を撹拌しながら６０分かけて同時に加えた。更に室温で２時間撹拌した後、エチルアルコール３０ｍｌを加えて１時間撹拌し、次に、γ－ブチロラクトン１００ｍｌを加えた。反応混合物に生じた沈殿物をろ過により取り除き、反応液を得た。次いで、３リットルの水の中でポリイミド前駆体を沈殿させ、水－ポリイミド前駆体混合物を５，０００ｒｐｍ（ｒｅｖｏｌｕｔｉｏｎｓ　ｐｅｒ　ｍｉｎｕｔｅ）の速度で１５分間撹拌した。ポリイミド前駆体をろ過して取得し、３００ｍＬのテトラヒドロフランに溶解後、２リットルの水の中で再度ポリイミド前駆体を沈殿物として得た。得られたポリイミド前駆体を減圧下で、４５℃で３日間乾燥し、ポリイミド前駆体Ａ－１ｂを得た。このポリイミド前駆体Ａ－１ｂの重量平均分子量は、５１，０００、数平均分子量は１９，０３０であった。
　樹脂Ａ－１ｂの繰り返し単位、組成比（ｍｏｌ％）は樹脂Ａ－１と同じである。 [Synthesis Example A-1b: Synthesis of polyimide precursor (A-1b)]
9.85 g (45.15 mmol) of pyromellitic anhydride and 10.07 g (19.35 mmol) of 4,4'-(4,4'-isopropylidene diphenoxy)bis(phthalic anhydride) , 16.8 g (129 mmol) of 2-hydroxyethyl methacrylate, 0.05 g of hydroquinone, 20.4 g of pyridine (258 mmol), and 200 g of γ-butyrolactone were mixed and stirred at room temperature for 10 hours. did. Furthermore, 0.84 g (6.45 mmol) of 2-hydroxyethyl methacrylate was added and stirred for 2 hours to produce a diester of 4,4'-oxydiphthalic acid and 2-hydroxyethyl methacrylate.
Next, under ice cooling, a solution of 26.6 g of dicyclohexylcarbodiimide (DCC) dissolved in 25 g of γ-butyrolactone was added dropwise with stirring. Next, a solution of 20.1 g of 4,4'-diamino-2,2'-bis(trifluoromethyl)biphenyl suspended in 45 ml of γ-butyrolactone and 3.8 g of DCC dissolved in 10 g of γ-butyrolactone was prepared. were added simultaneously over 60 minutes with stirring. After further stirring at room temperature for 2 hours, 30 ml of ethyl alcohol was added and stirred for 1 hour, and then 100 ml of γ-butyrolactone was added. A precipitate formed in the reaction mixture was removed by filtration to obtain a reaction solution. The polyimide precursor was then precipitated in 3 liters of water, and the water-polyimide precursor mixture was stirred at a speed of 5,000 rpm (revolutions per minute) for 15 minutes. The polyimide precursor was obtained by filtration, dissolved in 300 mL of tetrahydrofuran, and then re-obtained as a precipitate in 2 liters of water. The obtained polyimide precursor was dried at 45° C. for 3 days under reduced pressure to obtain polyimide precursor A-1b. The weight average molecular weight of this polyimide precursor A-1b was 51,000, and the number average molecular weight was 19,030.
The repeating units and composition ratio (mol%) of Resin A-1b are the same as those of Resin A-1.
〔合成例Ａ－２：ポリイミド前駆体（Ａ－２）の合成〕
　７．３５ｇ（３３．７ミリモル）のピロメリット酸無水物と、５．３０ｇ（２７．６ミリモル）のトリメリット酸無水物と、３．５４ｇ（６．８１ミリモル）の４，４’－（４，４’－イソプロピリデンジフェノキシ）ビス（フタル酸無水物）と、１７．８ｇ（１３７ミリモル）の２－ヒドロキシエチルメタクリレートと、０．０５ｇのハイドロキノンと、２２．８ｇ（２８９ミリモル）のピリジンと、７５ｇのダイグライムとを混合し、６０℃の温度で５時間撹拌して、ピロメリット酸無水物及び４，４’－（４，４’－イソプロピリデンジフェノキシ）ビス（フタル酸無水物）、と２－ヒドロキシエチルメタクリレートのジエステルを製造した。次いで、混合物を－２０℃まで冷却した後、塩化チオニル　１７．７０ｇ（１４１ミリモル）を９０分かけて滴下し、２時間撹拌し、ピリジニウムヒドロクロリドの白色沈澱が得られた。
　次いで、４，４’－ジアミノ－２，２’－ビス（トリフルオロメチル）ビフェニル２１．１ｇ（６６．０ミリモル）をＮＭＰ　１００ｍＬ中に溶解させたものを、２時間かけて滴下した。次いで、エタノール　１０．０ｇ（２１７ミリモル）を加え、混合物を２時間撹拌した。次いで、４リットルの水の中でポリイミド前駆体を沈殿させ、水－ポリイミド前駆体混合物を５００ｒｐｍの速度で１５分間撹拌した。ポリイミド前駆体を濾過して取得し、４リットルの水の中で再度３０分間撹拌し再び濾過した。次いで、得られたポリイミド前駆体を減圧下、４５℃で２日間乾燥しポリイミド前駆体（Ａ－２）を得た。得られたポリイミド前駆体（Ａ－２）の重量平均分子量は７３，１００、数平均分子量は２８，９００であった。ポリイミド前駆体（Ａ－２）は、下記式（Ａ－２）で表される３つの繰返し単位を含む構造である。各繰返し単位の構造は１Ｈ－ＮＭＲスペクトルから確認した。
[Synthesis Example A-2: Synthesis of polyimide precursor (A-2)]
7.35 g (33.7 mmol) of pyromellitic anhydride, 5.30 g (27.6 mmol) of trimellitic anhydride, and 3.54 g (6.81 mmol) of 4,4'-( 4,4'-isopropylidene diphenoxy)bis(phthalic anhydride), 17.8 g (137 mmol) of 2-hydroxyethyl methacrylate, 0.05 g of hydroquinone, and 22.8 g (289 mmol) of pyridine. and 75 g of diglyme and stirred at a temperature of 60°C for 5 hours to obtain pyromellitic anhydride and 4,4'-(4,4'-isopropylidene diphenoxy)bis(phthalic anhydride). , and a diester of 2-hydroxyethyl methacrylate were prepared. Then, after cooling the mixture to -20°C, 17.70 g (141 mmol) of thionyl chloride was added dropwise over 90 minutes and stirred for 2 hours to obtain a white precipitate of pyridinium hydrochloride.
Next, 21.1 g (66.0 mmol) of 4,4'-diamino-2,2'-bis(trifluoromethyl)biphenyl dissolved in 100 mL of NMP was added dropwise over 2 hours. Then 10.0 g (217 mmol) of ethanol was added and the mixture was stirred for 2 hours. The polyimide precursor was then precipitated in 4 liters of water and the water-polyimide precursor mixture was stirred at a speed of 500 rpm for 15 minutes. The polyimide precursor was obtained by filtration, stirred again in 4 liters of water for 30 minutes and filtered again. Next, the obtained polyimide precursor was dried at 45° C. for 2 days under reduced pressure to obtain a polyimide precursor (A-2). The weight average molecular weight of the obtained polyimide precursor (A-2) was 73,100, and the number average molecular weight was 28,900. The polyimide precursor (A-2) has a structure containing three repeating units represented by the following formula (A-2). The structure of each repeating unit was confirmed from the 1 H-NMR spectrum.
〔合成例Ａ－３：ポリイミド前駆体（Ａ－３）の合成〕
　使用する原料化合物を変更した以外は、合例例Ａ－１と同様の方法にてポリイミド前駆体（Ａ－３）を得た。得られたポリイミド前駆体（Ａ－３）の重量平均分子量は７３，９００、数平均分子量は２８，８００であった。ポリイミド前駆体（Ａ－３）は、下記式（Ａ－３）で表される２つの繰返し単位を含む構造である。各繰返し単位の構造は１Ｈ－ＮＭＲスペクトルから確認した。
[Synthesis Example A-3: Synthesis of polyimide precursor (A-3)]
A polyimide precursor (A-3) was obtained in the same manner as in Example A-1 except that the raw material compound used was changed. The weight average molecular weight of the obtained polyimide precursor (A-3) was 73,900, and the number average molecular weight was 28,800. The polyimide precursor (A-3) has a structure containing two repeating units represented by the following formula (A-3). The structure of each repeating unit was confirmed from the 1 H-NMR spectrum.
〔合成例Ａ－４：ポリイミド前駆体（Ａ－４）の合成〕
　使用する原料化合物を変更した以外は、合例例Ａ－１と同様の方法にてポリイミド前駆体（Ａ－４）を得た。得られたポリイミド前駆体（Ａ－４）の重量平均分子量は６５，８００、数平均分子量は２５，７００であった。ポリイミド前駆体（Ａ－４）は、下記式（Ａ－４）で表される２つの繰返し単位を含む構造である。各繰返し単位の構造は１Ｈ－ＮＭＲスペクトルから確認した。
[Synthesis Example A-4: Synthesis of polyimide precursor (A-4)]
A polyimide precursor (A-4) was obtained in the same manner as in Example A-1 except that the raw material compound used was changed. The weight average molecular weight of the obtained polyimide precursor (A-4) was 65,800, and the number average molecular weight was 25,700. The polyimide precursor (A-4) has a structure containing two repeating units represented by the following formula (A-4). The structure of each repeating unit was confirmed from the 1 H-NMR spectrum.
〔合成例Ａ－５：ポリイミド前駆体（Ａ－５）の合成〕
　使用する原料化合物を変更した以外は、合例例Ａ－１と同様の方法にてポリイミド前駆体（Ａ－５）を得た。得られたポリイミド前駆体（Ａ－５）の重量平均分子量は６３，３００、数平均分子量は２３，１００であった。ポリイミド前駆体（Ａ－５）は、下記式（Ａ－５）で表される３つの繰返し単位を含む構造である。各繰返し単位の構造は１Ｈ－ＮＭＲスペクトルから確認した。
[Synthesis Example A-5: Synthesis of polyimide precursor (A-5)]
A polyimide precursor (A-5) was obtained in the same manner as in Example A-1 except that the raw material compound used was changed. The weight average molecular weight of the obtained polyimide precursor (A-5) was 63,300, and the number average molecular weight was 23,100. The polyimide precursor (A-5) has a structure containing three repeating units represented by the following formula (A-5). The structure of each repeating unit was confirmed from the 1 H-NMR spectrum.
〔合成例Ａ－７：ポリイミド前駆体（Ａ－７）の合成〕
　使用する原料化合物を変更した以外は、合例例Ａ－１と同様の方法にてポリイミド前駆体（Ａ－７）を得た。得られたポリイミド前駆体（Ａ－７）の重量平均分子量は４８，７００、数平均分子量は１９，９００であった。ポリイミド前駆体（Ａ－７）は、下記式（Ａ－７）で表される３つの繰返し単位を含む構造である。各繰返し単位の構造は１Ｈ－ＮＭＲスペクトルから確認した。
[Synthesis Example A-7: Synthesis of polyimide precursor (A-7)]
A polyimide precursor (A-7) was obtained in the same manner as Example A-1 except that the raw material compound used was changed. The weight average molecular weight of the obtained polyimide precursor (A-7) was 48,700, and the number average molecular weight was 19,900. The polyimide precursor (A-7) has a structure containing three repeating units represented by the following formula (A-7). The structure of each repeating unit was confirmed from the 1 H-NMR spectrum.
〔合成例Ａ－８：ポリイミド前駆体（Ａ－８）の合成〕
　使用する原料化合物を変更した以外は、合例例Ａ－１と同様の方法にてポリイミド前駆体（Ａ－８）を得た。得られたポリイミド前駆体（Ａ－８）の重量平均分子量は８３，０００、数平均分子量は３３，６００であった。ポリイミド前駆体（Ａ－８）は、下記式（Ａ－７）で表される３つの繰返し単位を含む構造である。各繰返し単位の構造は１Ｈ－ＮＭＲスペクトルから確認した。
[Synthesis Example A-8: Synthesis of polyimide precursor (A-8)]
A polyimide precursor (A-8) was obtained in the same manner as in Example A-1 except that the raw material compound used was changed. The weight average molecular weight of the obtained polyimide precursor (A-8) was 83,000, and the number average molecular weight was 33,600. The polyimide precursor (A-8) has a structure containing three repeating units represented by the following formula (A-7). The structure of each repeating unit was confirmed from the 1 H-NMR spectrum.
〔比較合成例ＣＡ－１：ポリイミド前駆体（ＣＡ－１）の合成〕
　４，４’－オキシジフタル酸二無水物（ＯＤＰＡ）７７．５ｇと、４，４’－ビフタル酸二無水物７３．５ｇをセパラブルフラスコに入れ、２－ヒドロキシエチルメタクリレート（ＨＥＭＡ）１３４．０ｇ及びγ－ブチロラクトン４００ｍｌを加えた。室温下で撹拌しながら、ピリジン７９．１ｇを加えることにより、反応混合物を得た。反応による発熱の終了後、室温まで放冷し、更に１６時間静置した。
　次に、氷冷下において、反応混合物に、ジシクロヘキシルカルボジイミド（ＤＣＣ）２０６．３ｇをγ－ブチロラクトン１８０ｍｌに溶解した溶液を、撹拌しながら４０分かけて加えた。続いて、４，４’－ジアミノジフェニルエーテル９３．０ｇをγ－ブチロラクトン３５０ｍｌに懸濁した懸濁液を、撹拌しながら６０分かけて加えた。更に室温で２時間撹拌した後、エチルアルコール３０ｍｌを加えて１時間撹拌した。その後、γ－ブチロラクトン４００ｍｌを加えた。反応混合物に生じた沈殿物を、ろ過により取得し、反応液を得た。
　得られた反応液を３リットルのエチルアルコールに加えて、粗ポリマーからなる沈殿物を生成した。生成した粗ポリマーを濾取し、テトラヒドロフラン１．５リットルに溶解して粗ポリマー溶液を得た。得られた粗ポリマー溶液を２８リットルの水に滴下してポリマーを沈殿させ、得られた沈殿物を濾取した後に真空乾燥することにより、粉末状のポリイミド前駆体（ＣＡ－１）を得た。このポリイミド前駆体（ＣＡ－１）の重量平均分子量（Ｍｗ）を測定したところ、２２，６００であった。ポリイミド前駆体（ＣＡ－１）は、下記式（ＣＡ－１）で表される２つの繰返し単位を含む構造である。各繰返し単位の構造は１Ｈ－ＮＭＲスペクトルから確認した。
[Comparative synthesis example CA-1: Synthesis of polyimide precursor (CA-1)]
Put 77.5 g of 4,4'-oxydiphthalic dianhydride (ODPA) and 73.5 g of 4,4'-biphthalic dianhydride into a separable flask, and add 134.0 g of 2-hydroxyethyl methacrylate (HEMA) and 400 ml of γ-butyrolactone was added. A reaction mixture was obtained by adding 79.1 g of pyridine while stirring at room temperature. After the exotherm due to the reaction had ended, the mixture was allowed to cool to room temperature and was further left standing for 16 hours.
Next, under ice cooling, a solution of 206.3 g of dicyclohexylcarbodiimide (DCC) dissolved in 180 ml of γ-butyrolactone was added to the reaction mixture over 40 minutes with stirring. Subsequently, a suspension of 93.0 g of 4,4'-diaminodiphenyl ether in 350 ml of γ-butyrolactone was added over 60 minutes with stirring. After further stirring at room temperature for 2 hours, 30 ml of ethyl alcohol was added and stirred for 1 hour. Then, 400 ml of γ-butyrolactone was added. The precipitate produced in the reaction mixture was collected by filtration to obtain a reaction solution.
The resulting reaction solution was added to 3 liters of ethyl alcohol to produce a precipitate consisting of a crude polymer. The produced crude polymer was collected by filtration and dissolved in 1.5 liters of tetrahydrofuran to obtain a crude polymer solution. The obtained crude polymer solution was dropped into 28 liters of water to precipitate the polymer, and the obtained precipitate was collected by filtration and vacuum dried to obtain a powdered polyimide precursor (CA-1). . The weight average molecular weight (Mw) of this polyimide precursor (CA-1) was measured and found to be 22,600. The polyimide precursor (CA-1) has a structure containing two repeating units represented by the following formula (CA-1). The structure of each repeating unit was confirmed from the 1 H-NMR spectrum.
〔比較合成例ＣＡ－１ｂ：ポリイミド前駆体（ＣＡ－１ｂ）の合成〕
　原料化合物を変更した以外は、合例例ＣＡ－１と同様の方法にてＣＡ－１ｂを得た。得られたポリイミド前駆体ＣＡ－１ｂの重量平均分子量は５１，５００、数平均分子量は１９，０００であった。
[Comparative synthesis example CA-1b: Synthesis of polyimide precursor (CA-1b)]
CA-1b was obtained in the same manner as Example CA-1 except that the raw material compound was changed. The weight average molecular weight of the obtained polyimide precursor CA-1b was 51,500, and the number average molecular weight was 19,000.
〔合成例Ａ－６：ポリイミド前駆体（Ａ－６）の合成〕
　１５．１５ｇ（６８．１ミリモル）のピロメリット酸無水物と、１７．８ｇ（１３７ミリモル）の２－ヒドロキシエチルメタクリレートと、０．０５ｇのハイドロキノンと、２２．８ｇ（２８９ミリモル）のピリジンと、７５ｇのダイグライムとを混合し、６０℃の温度で５時間撹拌して、ピロメリット酸無水物と、２－ヒドロキシエチルメタクリレートのジエステルを製造した。次いで、混合物を－２０℃まで冷却した後、塩化チオニル　１７．７０ｇ（１４１ミリモル）を９０分かけて滴下し、２時間攪拌し、ピリジニウムヒドロクロリドの白色沈澱が得られた。
　次いで、４，４’－ジアミノ－２，２’－ビス（トリフルオロメチル）ビフェニル２１．１ｇ（６６．０ミリモル）をＮＭＰ　１００ｍＬ中に溶解させたものを、２時間かけて滴下した。次いで、エタノール　１０．０ｇ（２１７ミリモル）を加え、混合物を２時間撹拌した。次いで、４リットルの水の中でポリイミド前駆体を沈殿させ、水－ポリイミド前駆体混合物を５００ｒｐｍの速度で１５分間撹拌した。ポリイミド前駆体を濾過して取得し、４リットルの水の中で再度３０分間撹拌し再び濾過した。次いで、得られたポリイミド前駆体を減圧下、４５℃で２日間乾燥しポリイミド前駆体（Ａ－６）を得た。得られたポリイミド前駆体（Ａ－６）の重量平均分子量は３０，２００、数平均分子量は１２，４００であった。ポリイミド前駆体（Ａ－６）は、下記式（Ａ－６）で表される１つの繰返し単位を含む構造である。各繰返し単位の構造は１Ｈ－ＮＭＲスペクトルから確認した。
[Synthesis Example A-6: Synthesis of polyimide precursor (A-6)]
15.15 g (68.1 mmol) of pyromellitic anhydride, 17.8 g (137 mmol) of 2-hydroxyethyl methacrylate, 0.05 g of hydroquinone, and 22.8 g (289 mmol) of pyridine. The mixture was mixed with 75 g of diglyme and stirred at a temperature of 60° C. for 5 hours to produce a diester of pyromellitic anhydride and 2-hydroxyethyl methacrylate. Then, after cooling the mixture to -20°C, 17.70 g (141 mmol) of thionyl chloride was added dropwise over 90 minutes and stirred for 2 hours to obtain a white precipitate of pyridinium hydrochloride.
Next, 21.1 g (66.0 mmol) of 4,4'-diamino-2,2'-bis(trifluoromethyl)biphenyl dissolved in 100 mL of NMP was added dropwise over 2 hours. Then 10.0 g (217 mmol) of ethanol was added and the mixture was stirred for 2 hours. The polyimide precursor was then precipitated in 4 liters of water and the water-polyimide precursor mixture was stirred at a speed of 500 rpm for 15 minutes. The polyimide precursor was obtained by filtration, stirred again in 4 liters of water for 30 minutes and filtered again. Next, the obtained polyimide precursor was dried at 45° C. for 2 days under reduced pressure to obtain a polyimide precursor (A-6). The weight average molecular weight of the obtained polyimide precursor (A-6) was 30,200, and the number average molecular weight was 12,400. The polyimide precursor (A-6) has a structure containing one repeating unit represented by the following formula (A-6). The structure of each repeating unit was confirmed from the 1 H-NMR spectrum.
　各ポリイミド前駆体における各繰返し単位の含有率（組成比（ｍｏｌ％））を以下に示す。ここで、組成比（ｍｏｌ％）について、例えば「Ａ／Ｂ＝７０／３０」の記載は、「Ａ」が記載された繰返し単位７０ｍｏｌ％と、「Ｂ」が記載された繰返し単位３０ｍｏｌ％とを含むことを意味している。 The content (composition ratio (mol%)) of each repeating unit in each polyimide precursor is shown below. Here, regarding the composition ratio (mol%), for example, the description "A/B = 70/30" means that 70 mol% of the repeating unit with "A" written on it and 30 mol% of the repeating unit with "B" written on it. It is meant to include.
＜ラジカル重合性化合物の合成＞
〔合成例Ｄ－１：ラジカル重合性化合物（Ｄ－１）の合成〕
　撹拌機、コンデンサーを取りつけたフラスコ内で、２－（４－アミノフェニル）エチルアルコール（東京化成工業（株）製）２７．４４ｇ（２００ミリモル）、ｐ－メトキシフェノール（東京化成工業（株）製）０．０３ｇをテトラヒドロフラン２５０ｍＬに溶解し、０℃に冷却した。次いで、カレンズＭＯＩ（昭和電工（株）製）２９．４８ｇ（１９０ミリモル）を１時間かけて滴下し、０℃～１０℃で１時間撹拌した後、２５℃に昇温し、２時間撹拌した。続いて、これを酢酸エチル８００ｍＬ／ヘキサン２００ｍＬの溶液に晶析し、ろ過した。続いてろ物を酢酸エチル５００ｍＬで１時間撹拌し、ろ過した。これを４５℃で２４時間乾燥し、Ｄ－１を４５ｇ得た。Ｄ－１である事は１Ｈ－ＮＭＲスペクトルから確認した。Ｄ－１の構造を、下記式（Ｄ－１）に示す。

１Ｈ－ＮＭＲ（BRUKER、AVANCE NEO ４００）：δ(ppm,DMSO-ｄ６)8.5-8.4(s,1H), 7.3-7.2(d,2H), 7.1-7.0(d,2H), 6.25-6.15(t,1H), 6.1-6.0(s,1H), 5.75-5.65(t,1H), 4.6-4.5(t,1H), 4.15-4.05(t,2H), 3.6-3.5(m,2H), 3.45-3.35(q,2H), 2.65-2.55(t,2H), 1.95-1.85(s,3H) <Synthesis of radically polymerizable compounds>
[Synthesis Example D-1: Synthesis of radically polymerizable compound (D-1)]
In a flask equipped with a stirrer and a condenser, add 27.44 g (200 mmol) of 2-(4-aminophenyl)ethyl alcohol (manufactured by Tokyo Chemical Industry Co., Ltd.) and p-methoxyphenol (manufactured by Tokyo Chemical Industry Co., Ltd.). )0.03g was dissolved in 250mL of tetrahydrofuran and cooled to 0°C. Next, 29.48 g (190 mmol) of Karenz MOI (manufactured by Showa Denko K.K.) was added dropwise over 1 hour, and after stirring at 0°C to 10°C for 1 hour, the temperature was raised to 25°C and stirred for 2 hours. . Subsequently, this was crystallized in a solution of 800 mL of ethyl acetate/200 mL of hexane, and filtered. Subsequently, the filtered material was stirred with 500 mL of ethyl acetate for 1 hour and filtered. This was dried at 45° C. for 24 hours to obtain 45 g of D-1. It was confirmed that it was D-1 from the 1 H-NMR spectrum. The structure of D-1 is shown in the following formula (D-1).

1 H-NMR (BRUKER, AVANCE NEO 400): δ(ppm,DMSO-d6)8.5-8.4(s,1H), 7.3-7.2(d,2H), 7.1-7.0(d,2H), 6.25-6.15 (t,1H), 6.1-6.0(s,1H), 5.75-5.65(t,1H), 4.6-4.5(t,1H), 4.15-4.05(t,2H), 3.6-3.5(m,2H) , 3.45-3.35(q,2H), 2.65-2.55(t,2H), 1.95-1.85(s,3H)
〔合成例Ｄ－２～Ｄ－９：ラジカル重合性化合物（Ｄ－２～Ｄ－９）の合成〕
　合成例Ｄ－１において２－（４－アミノフェニル）エチルアルコールを同モル量の種々のアミンに代えた以外は同様の方法にてＤ－２～Ｄ－９を得た。Ｄ－２～Ｄ－９の構造を、下記式（Ｄ－２）～（Ｄ－９）に示す。
[Synthesis Examples D-2 to D-9: Synthesis of radically polymerizable compounds (D-2 to D-9)]
D-2 to D-9 were obtained in the same manner as Synthesis Example D-1 except that 2-(4-aminophenyl)ethyl alcohol was replaced with the same molar amount of various amines. The structures of D-2 to D-9 are shown in the following formulas (D-2) to (D-9).
〔合成例Ｄ－１０：ラジカル重合性化合物（Ｄ－１０）の合成〕
　合成例Ｄ－１において２－（４－アミノフェニル）エチルアルコールを同モル量の１，４－ビス（４－アミノフェノキシ）ベンゼンに、カレンズＭＯＩを同モル量のカレンズＭＯＩ－ＥＧ（昭和電工（株）製）に代えた以外は同様の方法にてＤ－１０を得た。 [Synthesis Example D-10: Synthesis of radically polymerizable compound (D-10)]
In Synthesis Example D-1, 2-(4-aminophenyl)ethyl alcohol was added to the same molar amount of 1,4-bis(4-aminophenoxy)benzene, and Karenz MOI was added to the same molar amount of Karenz MOI-EG (Showa Denko). D-10 was obtained in the same manner except that the solution was replaced with (manufactured by Co., Ltd.).
〔合成例Ｄ－１１、Ｄ－１２：ラジカル重合性化合物（Ｄ－１１、Ｄ－１２）の合成〕
　合成例Ｄ－１において２－（４－アミノフェニル）エチルアルコールを同モル量のフェノール又は同モル量の２－エチル－１－ヘキサノールにそれぞれ変え、反応温度を２５℃から４５℃に代えた以外は同様の方法にてＤ－１１、及び、Ｄ－１２を得た。 [Synthesis Examples D-11, D-12: Synthesis of radically polymerizable compounds (D-11, D-12)]
Except that in Synthesis Example D-1, 2-(4-aminophenyl)ethyl alcohol was changed to the same molar amount of phenol or the same molar amount of 2-ethyl-1-hexanol, and the reaction temperature was changed from 25 ° C. to 45 ° C. D-11 and D-12 were obtained in the same manner.
〔合成例Ｄ－１３：ラジカル重合性化合物（Ｄ－１３）の合成〕
　撹拌機、コンデンサーを取りつけたフラスコ内で、２－（４－アミノフェニル）エチルアルコール（東京化成工業（株）製）２７．４４ｇ（２００ミリモル）、２－メタクリロイロキシエチルコハク酸（２００ミリモル）、ｐ－メトキシフェノール（東京化成工業（株）製）０．０３ｇ、４－ジメチルアミノピリジン０．５ｇをテトラヒドロフラン２５０ｍＬに溶解し、０℃に冷却した。次いで、塩酸１－エチル－３－（３－ジメチルアミノプロピル）カルボジイミド３８．１ｇ（２００ｍｍｏｌ）を分割添加し、７５℃で４時間反応を続けた。反応終了後、酢酸エチル２００ｍＬ、水２００ｍＬを加え、分液操作を行い、有機層を抽出した。同様の操作を３回繰り返した。硫酸ナトリウムで乾燥を行った後、ロータリーエバポレーターを用いて濃縮した。濃縮後、再結晶操作により白色粉体としてＤ－１３　４７．２ｇ（収率６７．５％）を得た。 [Synthesis Example D-13: Synthesis of radically polymerizable compound (D-13)]
In a flask equipped with a stirrer and a condenser, add 27.44 g (200 mmol) of 2-(4-aminophenyl)ethyl alcohol (manufactured by Tokyo Chemical Industry Co., Ltd.) and 2-methacryloyloxyethylsuccinic acid (200 mmol). , 0.03 g of p-methoxyphenol (manufactured by Tokyo Chemical Industry Co., Ltd.), and 0.5 g of 4-dimethylaminopyridine were dissolved in 250 mL of tetrahydrofuran and cooled to 0°C. Next, 38.1 g (200 mmol) of 1-ethyl-3-(3-dimethylaminopropyl)carbodiimide hydrochloride was added in portions, and the reaction was continued at 75° C. for 4 hours. After the reaction was completed, 200 mL of ethyl acetate and 200 mL of water were added, a liquid separation operation was performed, and the organic layer was extracted. The same operation was repeated three times. After drying with sodium sulfate, it was concentrated using a rotary evaporator. After concentration, 47.2 g (yield 67.5%) of D-13 was obtained as a white powder by recrystallization.
〔合成例Ｄ－１４：ラジカル重合性化合物（Ｄ－１４）の合成〕
　合成例Ｄ－１３において２－メタクリロイロキシエチルコハク酸を同モル量のメタクリル酸に代えた以外は同様の方法にてＤ－１４を得た。 [Synthesis Example D-14: Synthesis of radically polymerizable compound (D-14)]
D-14 was obtained in the same manner as in Synthesis Example D-13 except that 2-methacryloyloxyethylsuccinic acid was replaced with the same molar amount of methacrylic acid.
〔合成例Ｄ－１５：ラジカル重合性化合物（Ｄ－１５）の合成〕
　合成例Ｄ－１において２－（４－アミノフェニル）エチルアルコールを同モル量の４，４’－ジアミノジフェニルエーテルに代えた以外は同様の方法にてＤ－１５を得た [Synthesis Example D-15: Synthesis of radically polymerizable compound (D-15)]
D-15 was obtained in the same manner as Synthesis Example D-1 except that 2-(4-aminophenyl)ethyl alcohol was replaced with the same molar amount of 4,4'-diaminodiphenyl ether.
　以下に、Ｄ－１０～Ｄ－１５の構造を、式（Ｄ－１０）～式（Ｄ－１５）にそれぞれ示す。
The structures of D-10 to D-15 are shown below as formulas (D-10) to (D-15), respectively.
〔合成例Ｄ－１６：ラジカル重合性化合物（Ｄ－１６）の合成〕
　合成例Ｄ－１において２－（４－アミノフェニル）エチルアルコールを同モル量の1,2,3,4-テトラヒドロイソキノリンに代えた以外は同様の方法にてＤ－１６を得た。Ｄ－１６の構造を、下記式（Ｄ－１６）に示す。
[Synthesis Example D-16: Synthesis of radically polymerizable compound (D-16)]
D-16 was obtained in the same manner as in Synthesis Example D-1 except that 2-(4-aminophenyl)ethyl alcohol was replaced with the same molar amount of 1,2,3,4-tetrahydroisoquinoline. The structure of D-16 is shown in the following formula (D-16).
〔合成例Ｄ－１７：ラジカル重合性化合物（Ｄ－１７）の合成〕
　合成例Ｄ－１において２－（４－アミノフェニル）エチルアルコールを同モル量の２－ヘキシル-1-デカノールに代えた以外は同様の方法にてＤ－１７を得た。Ｄ－１７の構造を、下記式（Ｄ－１７）に示す。
[Synthesis Example D-17: Synthesis of radically polymerizable compound (D-17)]
D-17 was obtained in the same manner as Synthesis Example D-1 except that 2-(4-aminophenyl)ethyl alcohol was replaced with the same molar amount of 2-hexyl-1-decanol. The structure of D-17 is shown in the following formula (D-17).
＜実施例及び比較例＞
　各実施例において、それぞれ、下記表に記載の成分を混合し、各樹脂組成物を得た。また、比較例において、下記表に記載の成分を混合し、比較用組成物を得た。
　具体的には、溶剤以外の表に記載の各成分の含有量（配合量）は、表の各欄の「質量部」の欄に記載の量（質量部）とした。
　溶剤の含有量（配合量）は、組成物の固形分濃度が表中の「固形分濃度」の値（質量％）となるようにし、溶剤の全質量に対する各溶剤の含有量の比率（質量比）は、表中の「比率」の欄に記載の比率となるようにした。
　得られた樹脂組成物及び比較用組成物を、細孔の幅が０．８μｍのポリテトラフルオロエチレン製フィルターを用いて加圧ろ過した。
　また、表中、「－」の記載は該当する成分を組成物が含有していないことを示している。
　「重合性化合物」の欄における、例えば「種類」「D-1(0.5)/CD-2(0.5)」、「質量部」「１３．１」の記載は、Ｄ－１とＣＤ－２とを、０．５：０．５の質量比で、合計１３．１質量部で使用したことを意味している。 <Examples and comparative examples>
In each Example, the components listed in the table below were mixed to obtain each resin composition. In addition, in a comparative example, the components listed in the table below were mixed to obtain a comparative composition.
Specifically, the content (compounding amount) of each component listed in the table other than the solvent was the amount (parts by mass) listed in the "parts by mass" column in each column of the table.
The content (compounding amount) of the solvent is determined so that the solid content concentration of the composition is the value of "solid content concentration" (mass %) in the table, and the ratio of the content of each solvent to the total mass of the solvent (mass %) is determined. The ratio) was set to be the ratio described in the "Ratio" column in the table.
The obtained resin composition and comparative composition were pressure-filtered using a polytetrafluoroethylene filter with a pore width of 0.8 μm.
Furthermore, in the table, the description "-" indicates that the composition does not contain the corresponding component.
For example, in the column of "polymerizable compound", the description of "type""D-1(0.5)/CD-2(0.5)" and "parts by mass""13.1" is different from D-1 and CD-2. This means that a total of 13.1 parts by mass was used at a mass ratio of 0.5:0.5.
　表に記載した各成分の詳細は下記の通りである。 The details of each component listed in the table are as follows.
〔ポリイミド前駆体〕
・Ａ－１～Ａ－７、Ａ－１ｂ：：上記合成例により得られたポリイミド前駆体（Ａ－１）～（Ａ－７）、（Ａ－１ｂ）
・ＣＡ－１～ＣＡ－１ｂ：上記合成例により得られたポリイミド前駆体（ＣＡ－１）～（ＣＡ－１ｂ） [Polyimide precursor]
・A-1 to A-7, A-1b:: Polyimide precursors (A-1) to (A-7), (A-1b) obtained by the above synthesis example
・CA-1 to CA-1b: Polyimide precursors (CA-1) to (CA-1b) obtained by the above synthesis example
〔重合性化合物（ラジカル重合性化合物）〕
・Ｄ－１～Ｄ－１５：上記合成例により得られた化合物
・ＣＤ－１：ＡＤＰＨ：ジペンタエリスリトールヘキサアクリレート（新中村化学工業（株）製））
・ＣＤ－２：ＳＲ－２０９（サートマー社製、下記構造の化合物）
[Polymerizable compound (radical polymerizable compound)]
・D-1 to D-15: Compounds obtained by the above synthesis examples ・CD-1: ADPH: Dipentaerythritol hexaacrylate (manufactured by Shin Nakamura Chemical Co., Ltd.)
・CD-2: SR-209 (manufactured by Sartomer, compound with the following structure)
〔重合開始剤〕
・Ｃ－１：ＩＲＧＡＣＵＲＥ　ＯＸＥ　０１（ＢＡＳＦ社製）
・Ｃ－２：ＩＲＧＡＣＵＲＥ　ＯＸＥ　０２（ＢＡＳＦ社製）
・Ｃ－３：ＩＲＧＡＣＵＲＥ　３６９（ＢＡＳＦ社製）
・Ｃ－４：下記構造の化合物
Ｃ－５：　Ｏｍｎｉｒａｄ　１３１２（ＩＧＭ社製）
Ｃ－６：　Ｏｍｎｉｒａｄ　ＴＰＯ　Ｈ（ＩＧＭ社製）
[Polymerization initiator]
・C-1: IRGACURE OXE 01 (manufactured by BASF)
・C-2: IRGACURE OXE 02 (manufactured by BASF)
・C-3: IRGACURE 369 (manufactured by BASF)
・C-4: Compound C-5 with the following structure: Omnirad 1312 (manufactured by IGM)
C-6: Omnirad TPO H (manufactured by IGM)
〔熱塩基発生剤〕
・Ｂ－１～Ｂ－５：下記式（Ｂ－１）～式（Ｂ－５）で表される化合物
[Thermal base generator]
・B-1 to B-5: Compounds represented by the following formulas (B-1) to (B-5)
〔重合禁止剤〕
・Ｅ－１：２－ニトロソ－１－ナフトール（東京化成工業（株）製）
・Ｅ－２：パラベンゾキノン（東京化成工業（株）製）
・Ｅ－３：パラメトキシフェノール（東京化成工業（株）製）
・Ｅ－４：下記構造の化合物
[Polymerization inhibitor]
・E-1: 2-nitroso-1-naphthol (manufactured by Tokyo Kasei Kogyo Co., Ltd.)
・E-2: Parabenzoquinone (manufactured by Tokyo Chemical Industry Co., Ltd.)
・E-3: Paramethoxyphenol (manufactured by Tokyo Chemical Industry Co., Ltd.)
・E-4: Compound with the following structure
〔シランカップリング剤（金属接着性改良剤）〕
・Ｇ－１～Ｇ－４：下記構造の化合物。以下の構造式中、Ｅｔはエチル基を表す。
・Ｇ－５：Ｘ－１２－１２９３（信越化学工業株式会社製）
・Ｇ－６：ＫＲ－５１３（信越化学工業株式会社製）
[Silane coupling agent (metal adhesion improver)]
・G-1 to G-4: Compounds with the following structure. In the following structural formula, Et represents an ethyl group.
・G-5:X-12-1293 (manufactured by Shin-Etsu Chemical Co., Ltd.)
・G-6: KR-513 (manufactured by Shin-Etsu Chemical Co., Ltd.)
〔マイグレーション抑制剤〕
・Ｆ－１～Ｆ－６：下記構造の化合物。
[Migration inhibitor]
・F-1 to F-6: Compounds with the following structure.
〔添加剤〕
・Ｈ－１：下記式（Ｈ－１）で表される化合物
・Ｈ－２：Ｎ－フェニルジエタノールアミン－２－ピロリドン
・Ｈ－３：下記式（Ｈ－３）で表される化合物
・Ｈ－４：下記式（Ｈ－４）で表される化合物
〔Additive〕
・H-1: Compound represented by the following formula (H-1) ・H-2: N-phenyldiethanolamine-2-pyrrolidone ・H-3: Compound represented by the following formula (H-3) ・H- 4: Compound represented by the following formula (H-4)
〔溶剤〕
・ＧＢＬ：γ－ブチロラクトン
・ＤＭＳＯ：ジメチルスルホキシド
・ＮＭＰ：Ｎ－メチル－２－ピロリドン
・ＥＬ：乳酸エチル 〔solvent〕
・GBL: γ-butyrolactone ・DMSO: Dimethyl sulfoxide ・NMP: N-methyl-2-pyrrolidone ・EL: Ethyl lactate
　また、実施例又は比較例において使用した各樹脂組成物又は比較用組成物のΔＳＰを下記表に示す。ＳＰＡ、ＳＰＢ、及び、ΔＳＰの詳細は上述の通りである。下記表中の数値の単位はＭＰａ１／２である。
  Further, the ΔSP of each resin composition or comparative composition used in the Examples or Comparative Examples is shown in the table below. Details of SPA, SPB, and ΔSP are as described above. The unit of numerical values in the table below is MPa 1/2 .
　また、各重合性化合物のＳＰ値は以下の通りである。下記表中の数値の単位はＭＰａ１／２である。 Moreover, the SP value of each polymerizable compound is as follows. The unit of numerical values in the table below is MPa 1/2 .
＜評価＞
〔破断伸び率〕
　各実施例及び比較例において、それぞれ、各樹脂組成物又は比較用組成物を、シリコンウェハ上にスピンコート法により層状に適用して、樹脂組成物層又は比較用組成物層を形成した。得られた樹脂組成物層又は比較用組成物層を適用したシリコンウェハをホットプレート上で、１００℃で５分間乾燥し、シリコンウェハ上に表の「膜厚（μｍ）」の欄に記載の厚さの均一な樹脂組成物層又は比較用組成物層とした。シリコンウェハ上の樹脂組成物層又は比較用組成物層を、ステッパー（Ｎｉｋｏｎ　ＮＳＲ　２００５　ｉ９Ｃ）を用いて、５００ｍＪ/ｃｍ２の露光エネルギーで露光した。上記露光した樹脂組成物層又は比較用組成物層を、ホットプレートを用いて窒素雰囲気下で、１０℃／分の昇温速度で昇温し、表の「キュア温度（℃）」の欄に記載の温度に達した後、この温度を表の「キュア時間（ｍｉｎ）」に記載の時間において維持し、硬化後の樹脂層を得た。上記硬化後の樹脂層を４．９質量％フッ化水素酸溶液に浸漬し、シリコンウェハから樹脂層を剥離し、樹脂膜１を得た。
　樹脂膜１を打ち抜き器により打ち抜いて、試料幅１０ｍｍ、試料長５０ｍｍのフィルムを作製した。上記フィルムの破断伸び率を引張り試験機（テンシロン）を用いてクロスヘッドスピード３００ｍｍ／分としてフィルムの長手方向、及び、幅方向について、２５℃、６５％相対湿度（ＲＨ）の環境下にてＪＩＳ－Ｋ６２５１：２０１７に準拠して破断伸び率を測定した。破断伸び率は、Ｅｂ（％）＝（Ｌｂ－Ｌ０）／Ｌ０×１００（Ｅｂ：切断時伸び、Ｌ０：試験前の試験片の長さ、Ｌｂ：試験片が切断した時の試験片の長さ）で算出した。評価は長手方向の破断伸び率を１０回測定し、計１０個の破断伸び率（Ｅｂ）の算術平均値を指標値として行った。評価は下記評価基準に従い行った。上記Ｅｂの数値が大きいほど、破断伸びに優れるといえる。評価結果は表の「破断伸び」の欄に記載した。
－評価基準－
Ａ：上記指標値が６０％を超えた。
Ｂ：上記指標値が４０％を超えて６０％以下であった。
Ｃ：上記指標値が４０％以下であった。 <Evaluation>
[Elongation at break]
In each Example and Comparative Example, each resin composition or comparative composition was applied in a layered manner onto a silicon wafer by spin coating to form a resin composition layer or a comparative composition layer. The silicon wafer to which the obtained resin composition layer or comparative composition layer was applied was dried on a hot plate at 100°C for 5 minutes, and the silicon wafer was coated with the film thickness (μm) described in the column of the table. A resin composition layer having a uniform thickness or a comparative composition layer was used. The resin composition layer or comparative composition layer on the silicon wafer was exposed using a stepper (Nikon NSR 2005 i9C) with an exposure energy of 500 mJ/cm 2 . The exposed resin composition layer or comparative composition layer was heated at a rate of 10°C/min in a nitrogen atmosphere using a hot plate, and After reaching the stated temperature, this temperature was maintained for the time stated in "Cure time (min)" in the table to obtain a cured resin layer. The cured resin layer was immersed in a 4.9% by mass hydrofluoric acid solution, and the resin layer was peeled off from the silicon wafer to obtain a resin film 1.
The resin film 1 was punched out using a puncher to produce a film having a sample width of 10 mm and a sample length of 50 mm. The elongation at break of the above film was determined using a tensile tester (Tensilon) at a crosshead speed of 300 mm/min, in the longitudinal direction and width direction of the film, under an environment of 25°C and 65% relative humidity (RH). -Elongation at break was measured in accordance with K6251:2017. The elongation rate at break is E b (%) = (L b - L 0 )/L 0 × 100 (E b : elongation at cutting, L 0 : length of the test piece before the test, L b : length of the test piece before it is cut) It was calculated based on the length of the test piece when The evaluation was performed by measuring the elongation at break in the longitudinal direction 10 times, and using the arithmetic mean value of the total 10 elongation at break (E b ) as an index value. Evaluation was performed according to the following evaluation criteria. It can be said that the larger the value of E b is, the better the elongation at break is. The evaluation results are listed in the "Elongation at break" column of the table.
-Evaluation criteria-
A: The above index value exceeded 60%.
B: The above index value was more than 40% and less than 60%.
C: The above index value was 40% or less.
〔ヤング率の評価〕
　上記破断伸び評価にて作製した試験片のヤング率を、引張り試験機（テンシロン）を用いて、クロスヘッドスピード５ｍｍ／分、２５℃、６５％ＲＨ（相対湿度）の環境下にて、ＪＩＳ　Ｋ　７１６１（２０１４）に準拠して測定した。測定は各５回ずつ実施し、５回の測定における試験片が破断した時のヤング率（引張弾性率）の算術平均値を指標値として用いた。評価結果は表の「ヤング率」の欄に記載した。
(評価基準)
　Ａ：ヤング率が４．５ＧＰａ以上であった。
　Ｂ：ヤング率が３．５ＧＰａ以上、４．５ＧＰａ未満であった。
　Ｃ：ヤング率が３．５ＧＰａ未満であった。 [Evaluation of Young's modulus]
The Young's modulus of the test piece prepared in the above evaluation of elongation at break was determined using a tensile tester (Tensilon) at a crosshead speed of 5 mm/min, 25°C, and an environment of 65% RH (relative humidity) according to JIS K. 7161 (2014). The measurements were performed five times each, and the arithmetic mean value of Young's modulus (tensile modulus) when the test piece broke in the five measurements was used as an index value. The evaluation results are listed in the "Young's modulus" column of the table.
(Evaluation criteria)
A: Young's modulus was 4.5 GPa or more.
B: Young's modulus was 3.5 GPa or more and less than 4.5 GPa.
C: Young's modulus was less than 3.5 GPa.
〔PCT（Pressure　Cooker Test）後の剥がれ率の評価〕
　各実施例及び比較例において調製した樹脂組成物又は比較用組成物を、それぞれ、銅基板上にスピンコート法により層状に適用して、樹脂組成物層又は比較用組成物層を形成した。得られた樹脂組成物層又は比較用組成物層を形成した銅基板をホットプレート上で、１００℃で５分間乾燥し、銅基板上に表の「膜厚（μｍ）」の欄に記載の厚さであり、かつ、厚さの均一な樹脂組成物層又は比較用組成物層とした。銅基板上の樹脂組成物層又は比較用組成物層を、ステッパー（Ｎｉｋｏｎ　ＮＳＲ　２００５　ｉ９Ｃ）を用いて、５００ｍＪ／ｃｍ２の露光エネルギーで１００μｍ四方の正方形状の非マスク部が形成されたフォトマスクを使用してｉ線により露光し、その後表の「現像液」の欄に記載の現像液で６０秒間現像して、プロピレングリコールモノメチルエーテルアセテート（ＰＧＭＥＡ）を用いてリンスすることにより、１００μｍ四方の正方形状の樹脂層を得た。さらに、窒素雰囲気下で表の「キュア温度（℃）」の欄に記載の温度で、表の「キュア時間（ｍｉｎ）」の欄に記載の時間において、加熱式オーブンを用いて加熱して樹脂層（パターン）を形成した。
　上記樹脂層について、温度１２１℃／相対湿度１００％ＲＨの槽内で２５０時間経過させた。断面ＳＥＭ（走査型顕微鏡）測定を実施し、銅基板と樹脂層の間の空隙面積率を評価した。空隙面積率は、下記の式により算出した
　空隙面積率（％）＝（ＳＥＭ測定により観察された空隙部の面積）／（樹脂層の全面積）×１００
　得られた空隙面積率の値から、下記評価基準に従って評価を行った。空隙面積率が小さければ小さいほど硬化膜のＰＣＴ（湿熱）耐性が優れているといえ、長期間の経過後であっても金属層と硬化物との間に空隙が生じにくいといえる。評価結果は表の「ＰＣＴ（耐湿熱性）」の欄に記載した。
Ａ：空隙面積率が０．５％以下であった。
Ｂ：空隙面積率が０．５％を超えて２％以下であった。
Ｃ：空隙面積率が２％を超えた。 [Evaluation of peeling rate after PCT (Pressure Cooker Test)]
The resin composition or comparative composition prepared in each Example and Comparative Example was applied in a layered manner onto a copper substrate by a spin coating method to form a resin composition layer or a comparative composition layer. The copper substrate on which the obtained resin composition layer or comparative composition layer was formed was dried on a hot plate at 100°C for 5 minutes, and the film thickness (μm) described in the column of the table was applied to the copper substrate. A resin composition layer or a comparative composition layer having a uniform thickness was used. Using a stepper (Nikon NSR 2005 i9C), the resin composition layer or the comparative composition layer on the copper substrate was exposed to an exposure energy of 500 mJ/cm 2 using a photomask in which a 100 μm square non-mask portion was formed. A 100 μm square area was exposed to i-line using a A square resin layer was obtained. Furthermore, the resin was heated in a heating oven at the temperature listed in the "Cure temperature (°C)" column in the table and for the time listed in the "Cure time (min)" column in the table under a nitrogen atmosphere. A layer (pattern) was formed.
The resin layer was placed in a tank at a temperature of 121° C./relative humidity of 100% RH for 250 hours. Cross-sectional SEM (scanning microscope) measurement was performed to evaluate the void area ratio between the copper substrate and the resin layer. The void area ratio was calculated using the following formula: Void area ratio (%) = (area of voids observed by SEM measurement) / (total area of resin layer) x 100
Based on the value of the void area ratio obtained, evaluation was performed according to the following evaluation criteria. It can be said that the smaller the void area ratio is, the better the PCT (moist heat) resistance of the cured film is, and it can be said that voids are less likely to form between the metal layer and the cured product even after a long period of time. The evaluation results are listed in the "PCT (moist heat resistance)" column of the table.
A: The void area ratio was 0.5% or less.
B: The void area ratio was more than 0.5% and less than 2%.
C: The void area ratio exceeded 2%.
＜実施例１０１＞
　実施例１において調製した樹脂組成物を用い、上述の露光後の加熱を赤外線ランプ加熱装置（アドバンス理工社製、ＲＴＰ－６）を用いて行った以外は実施例１と同様の条件で破断伸び、ヤング率及びＰＣＴ後の剥がれ率（ＰＣＴ（耐湿熱性））の評価を行った。
　破断伸び、ヤング率、ＰＣＴ（耐湿熱性）のいずれにおいても実施例１と同様の結果が得られた。 <Example 101>
Using the resin composition prepared in Example 1, elongation at break was conducted under the same conditions as in Example 1, except that the above-mentioned post-exposure heating was performed using an infrared lamp heating device (manufactured by Advance Riko Co., Ltd., RTP-6). , Young's modulus and peeling rate after PCT (PCT (moist heat resistance)) were evaluated.
The same results as in Example 1 were obtained in terms of elongation at break, Young's modulus, and PCT (moist heat resistance).
＜実施例１０２＞
　実施例１において、重合禁止剤Ｅ－１及びシランカップリング剤Ｇ－１を除き、樹脂Ａ－１の配合量を８０質量部から８２．２質量部に変更した以外は、実施例１と同様の方法により樹脂組成物を調製した。
　上記樹脂組成物を用いて、実施例１と同様の方法により破断伸び、ヤング率、PCT（耐湿熱性）評価を行ったところ、いずれの評価項目においても実施例１と同様の結果が得られた。 <Example 102>
Same as Example 1 except that the polymerization inhibitor E-1 and silane coupling agent G-1 were excluded and the amount of resin A-1 was changed from 80 parts by mass to 82.2 parts by mass. A resin composition was prepared by the method described in the following.
Using the above resin composition, elongation at break, Young's modulus, and PCT (moist heat resistance) were evaluated in the same manner as in Example 1, and results similar to those in Example 1 were obtained in all evaluation items. .
＜実施例１０３＞
　実施例1において調製した樹脂組成物を用い、上述の露光における露光手段を、ステッパー（Ｎｉｋｏｎ　ＮＳＲ　２００５　ｉ９Ｃ）からダイレクト露光装置（アドテック　ＤＥ－６ＵＨ　ＩＩＩ）に変更した以外は実施例１と同様の方法で破断伸び、ヤング率、PCT（耐湿熱性）評価を実施した。いずれの評価項目においても実施例1と同様の結果が得られた。 <Example 103>
The method was the same as in Example 1 except that the resin composition prepared in Example 1 was used and the exposure means in the above exposure was changed from a stepper (Nikon NSR 2005 i9C) to a direct exposure device (Adtech DE-6UH III). The elongation at break, Young's modulus, and PCT (moist heat resistance) were evaluated. Results similar to those in Example 1 were obtained in all evaluation items.
　以上の結果から、本発明の樹脂組成物から形成される硬化物は、破断伸びに優れることが分かる。
　比較例１に係る比較用組成物は、式（１）で表される繰返し単位を含むポリイミド前駆体を含有しない。このような比較用組成物については、得られる硬化物が破断伸びに劣ることが分かる。
　比較例２に係る比較性組成物はΔＳＰが－３．５ＭＰａ１／２以下である。このような比較用組成物については、得られる硬化物が破断伸びに劣ることが分かる。
　比較例３に係る比較性組成物はΔＳＰが５．０ＭＰａ１／２以上である。このような比較用組成物については、得られる硬化物が破断伸びに劣ることが分かる。 From the above results, it can be seen that the cured product formed from the resin composition of the present invention has excellent elongation at break.
The comparative composition according to Comparative Example 1 does not contain a polyimide precursor containing a repeating unit represented by formula (1). It can be seen that for such comparative compositions, the obtained cured products are inferior in elongation at break.
The comparative composition according to Comparative Example 2 has a ΔSP of -3.5 MPa 1/2 or less. It can be seen that for such comparative compositions, the obtained cured products are inferior in elongation at break.
The comparative composition according to Comparative Example 3 has a ΔSP of 5.0 MPa 1/2 or more. It can be seen that for such comparative compositions, the obtained cured products are inferior in elongation at break.
＜実施例２０１＞
　実施例１において使用した樹脂組成物を、表面に銅薄層が形成された樹脂基材の銅薄層の表面にスピンコート法により層状に適用して、１００℃で５分間乾燥し、膜厚２０μｍの感光膜を形成した後、ステッパー（（株）ニコン製、ＮＳＲ１５０５　ｉ６）を用いて露光した。露光はマスク（パターンが１：１ラインアンドスペースであり、線幅が１０μｍであるバイナリマスク）を介して、波長３６５ｎｍで行った。上記露光後、シクロペンタノンで２分間現像し、ＰＧＭＥＡで３０秒間リンスし、層のパターンを得た。
　次いで、窒素雰囲気下で、１０℃／分の昇温速度で昇温し、２３０℃に達した後、２３０℃で１８０分間維持して、再配線層用層間絶縁膜を形成した。この再配線層用層間絶縁膜は、絶縁性に優れていた。
　また、この再配線層用層間絶縁膜を使用して半導体デバイスを製造したところ、問題なく動作することを確認した。 <Example 201>
The resin composition used in Example 1 was applied in a layered manner by spin coating to the surface of the thin copper layer of the resin base material on which the thin copper layer was formed, and dried at 100°C for 5 minutes to determine the film thickness. After forming a 20 μm photoresist film, it was exposed using a stepper (NSR1505 i6, manufactured by Nikon Corporation). Exposure was performed at a wavelength of 365 nm through a mask (a binary mask with a 1:1 line-and-space pattern and a line width of 10 μm). After the above exposure, it was developed with cyclopentanone for 2 minutes and rinsed with PGMEA for 30 seconds to obtain a layer pattern.
Next, the temperature was raised at a rate of 10° C./min in a nitrogen atmosphere, and after reaching 230° C., the temperature was maintained at 230° C. for 180 minutes to form an interlayer insulating film for a rewiring layer. This interlayer insulating film for rewiring layer had excellent insulation properties.
Furthermore, when a semiconductor device was manufactured using this interlayer insulating film for a rewiring layer, it was confirmed that it operated without any problems.

Claims (19)

  1. 　式（１）で表される繰返し単位を含むポリイミド前駆体と、
    　ラジカル重合性化合物と、を含有し、
    　下記式（Ｓ）により算出されるΔＳＰが－３．５ＭＰａ１／２を超え５．０ＭＰａ１／２未満である
    　樹脂組成物。

    　式（１）中、Ａ１及びＡ２はそれぞれ独立に、酸素原子又は－ＮＲＺ－であり、ＲＺは水素原子又は１価の有機基であり、Ｒ１及びＲ２はそれぞれ独立に、水素原子又は１価の有機基であり、Ｒ１及びＲ２の少なくとも１つはエチレン性不飽和結合を有する１価の有機基であり、Ｘ１はベンゼン環構造を有する４価の有機基であり、Ｙ１は下記式（Ｙ－１）で表される２価の有機基である。

    　式（Ｙ－１）中、Ｒ３～Ｒ１０はそれぞれ独立に、水素原子又は１価の基であり、Ｒ３～Ｒ１０のうち少なくとも１つはアルキル基、フッ素原子又はトリフルオロメチル基であり、＊はそれぞれ、式（１）中の窒素原子との結合部位を表す。
    A polyimide precursor containing a repeating unit represented by formula (1),
    containing a radically polymerizable compound,
    A resin composition whose ΔSP calculated by the following formula (S) is more than -3.5 MPa 1/2 and less than 5.0 MPa 1/2 .

    In formula (1), A 1 and A 2 are each independently an oxygen atom or -NR Z -, R Z is a hydrogen atom or a monovalent organic group, and R 1 and R 2 are each independently, is a hydrogen atom or a monovalent organic group, at least one of R 1 and R 2 is a monovalent organic group having an ethylenically unsaturated bond, and X 1 is a tetravalent organic group having a benzene ring structure. Y 1 is a divalent organic group represented by the following formula (Y-1).

    In formula (Y-1), R 3 to R 10 are each independently a hydrogen atom or a monovalent group, and at least one of R 3 to R 10 is an alkyl group, a fluorine atom, or a trifluoromethyl group. and * each represent a bonding site with the nitrogen atom in formula (1).
  2. 　前記ポリイミド前駆体が、式（１）で表される繰返し単位として、式（１）における前記Ｘ１がエーテル結合を２個以上有する繰返し単位を含む、請求項１に記載の樹脂組成物。 The resin composition according to claim 1, wherein the polyimide precursor includes, as the repeating unit represented by formula (1), a repeating unit in which X 1 in formula (1) has two or more ether bonds.
  3. 　前記ポリイミド前駆体が、式（１）で表される繰返し単位として、式（１）における前記Ｘ１がベンゼン環構造を３個以上有する繰返し単位を含む、請求項１又は２に記載の樹脂組成物。 The resin composition according to claim 1 or 2, wherein the polyimide precursor contains, as a repeating unit represented by formula (1), a repeating unit in which X 1 in formula (1) has three or more benzene ring structures. thing.
  4. 　前記ポリイミド前駆体が、式（１）で表される繰返し単位として、式（１）における前記Ｘ１が下記式（ａ）又は下記式（ｂ）で表される構造である繰返し単位を含む、請求項１～３のいずれか１項に記載の樹脂組成物。
    　式（ａ）中、Ｒａ１はそれぞれ独立に、１価の基を表し、ｍ１は０～３の整数を表し、Ｒａ２はそれぞれ独立に、１価の基を表し、ｍ２は０～４の整数を表し、Ｒａ３はそれぞれ独立に、１価の基を表し、ｍ３は０～３の整数を表し、＊１～＊４はそれぞれ式（１）中のカルボニル基との結合部位を表す。
    　式（ｂ）中、Ｒｂ１はそれぞれ独立に、１価の基を表し、ｎ１は０～３の整数を表し、Ｒｂ２はそれぞれ独立に、１価の基を表し、ｎ２は０～４の整数を表し、Ｒｂ３はそれぞれ独立に、１価の基を表し、ｎ３は０～４の整数を表し、Ｒｂ４はそれぞれ独立に、１価の基を表し、ｎ４は０～３の整数を表し、Ｊ１及びＪ２はそれぞれ独立に、水素原子、アルキル基又はトリフルオロメチル基を表し、＊１～＊４はそれぞれ式（１）中のカルボニル基との結合部位を表す。     The polyimide precursor contains, as a repeating unit represented by formula (1), a repeating unit in which X 1 in formula (1) has a structure represented by the following formula (a) or the following formula (b), The resin composition according to any one of claims 1 to 3.
    In formula (a), R a1 each independently represents a monovalent group, m1 represents an integer of 0 to 3, R a2 each independently represents a monovalent group, and m2 represents a monovalent group of 0 to 4. represents an integer, R a3 each independently represents a monovalent group, m3 represents an integer of 0 to 3, and *1 to *4 each represent a bonding site with the carbonyl group in formula (1).
    In formula (b), R b1 each independently represents a monovalent group, n1 represents an integer of 0 to 3, R b2 each independently represents a monovalent group, and n2 represents a monovalent group of 0 to 4. represents an integer, R b3 each independently represents a monovalent group, n3 represents an integer from 0 to 4, R b4 each independently represents a monovalent group, and n4 represents an integer from 0 to 3. where J 1 and J 2 each independently represent a hydrogen atom, an alkyl group or a trifluoromethyl group, and *1 to *4 each represent a bonding site with a carbonyl group in formula (1).
  5. 　前記ポリイミド前駆体が、式（１）で表される繰返し単位として、式（１）における前記Ｘ１が下記式（２ａ）～式（２ｄ）のいずれかで表される構造である繰返し単位を含む、請求項１～４のいずれか１項に記載の樹脂組成物。

    　式（２ａ）～式（２ｄ）中、Ｌ１及びＬ２はそれぞれ独立に、それぞれが結合するベンゼン環と共役しない２価の基、又は、単結合であり、＊１～＊４はそれぞれ式（１）中のカルボニル基との結合部位を表す。     The polyimide precursor has, as a repeating unit represented by formula (1), a repeating unit in which X 1 in formula (1) has a structure represented by any of the following formulas (2a) to (2d). The resin composition according to any one of claims 1 to 4, comprising:

    In formulas (2a) to (2d), L 1 and L 2 are each independently a divalent group or a single bond that is not conjugated with the benzene ring to which they are bonded, and *1 to *4 are each represented by the formula Represents the bonding site with the carbonyl group in (1).
  6. 　前記ポリイミド前駆体の溶解度パラメータＳＰＡが２１．５ＭＰａ１／２以下である、請求項１～４のいずれか１項に記載の樹脂組成物。 The resin composition according to any one of claims 1 to 4, wherein the polyimide precursor has a solubility parameter SPA of 21.5 MPa 1/2 or less.
  7. 　前記ポリイミド前駆体の溶解度パラメータＳＰＡが２０．７ＭＰａ１／２以下である、請求項１～６のいずれか１項に記載の樹脂組成物。 The resin composition according to any one of claims 1 to 6, wherein the polyimide precursor has a solubility parameter SPA of 20.7 MPa 1/2 or less.
  8. 　前記ラジカル重合性化合物として、ウレア結合、ウレタン結合、及び、アミド結合よりなる群から得られた少なくとも１種の構造を有する重合性化合物を含む、請求項１～７のいずれか１項に記載の樹脂組成物。 The radically polymerizable compound according to any one of claims 1 to 7, comprising a polymerizable compound having at least one type of structure obtained from the group consisting of a urea bond, a urethane bond, and an amide bond. Resin composition.
  9. 　前記ラジカル重合性化合物として、２官能ラジカル重合性化合物を含む、請求項１～８のいずれか１項に記載の樹脂組成物。 The resin composition according to any one of claims 1 to 8, comprising a bifunctional radically polymerizable compound as the radically polymerizable compound.
  10. 　アゾール構造を有する化合物を更に含む、請求項１～９のいずれか１項に記載の樹脂組成物。 The resin composition according to any one of claims 1 to 9, further comprising a compound having an azole structure.
  11. 　再配線層用層間絶縁膜の形成に用いられる、請求項１～１０のいずれか１項に記載の樹脂組成物。 The resin composition according to any one of claims 1 to 10, which is used for forming an interlayer insulating film for a rewiring layer.
  12. 　請求項１～１１のいずれか１項に記載の樹脂組成物を硬化してなる硬化物。 A cured product obtained by curing the resin composition according to any one of claims 1 to 11.
  13. 　請求項１２に記載の硬化物からなる層を２層以上含み、前記硬化物からなる層同士のいずれかの間に金属層を含む積層体。 A laminate comprising two or more layers made of the cured product according to claim 12, and a metal layer between any of the layers made of the cured product.
  14. 　請求項１～１１のいずれか１項に記載の樹脂組成物を基材上に適用して膜を形成する膜形成工程を含む、硬化物の製造方法。 A method for producing a cured product, comprising a film forming step of applying the resin composition according to any one of claims 1 to 11 onto a substrate to form a film.
  15. 　前記膜を選択的に露光する露光工程及び前記膜を現像液を用いて現像してパターンを形成する現像工程を含む、請求項１４に記載の硬化物の製造方法。 The method for producing a cured product according to claim 14, comprising an exposure step of selectively exposing the film and a developing step of developing the film using a developer to form a pattern.
  16. 　前記膜を５０～４５０℃で加熱する加熱工程を含む、請求項１４又は１５に記載の硬化物の製造方法。 The method for producing a cured product according to claim 14 or 15, comprising a heating step of heating the film at 50 to 450°C.
  17. 　請求項１４～１６のいずれか１項に記載の硬化物の製造方法を含む、積層体の製造方法。 A method for producing a laminate, comprising the method for producing a cured product according to any one of claims 14 to 16.
  18. 　請求項１４～１６のいずれか１項に記載の硬化物の製造方法、又は、請求項１７に記載の積層体の製造方法を含む、半導体デバイスの製造方法。 A method for manufacturing a semiconductor device, comprising the method for manufacturing a cured product according to any one of claims 14 to 16, or the method for manufacturing a laminate according to claim 17.
  19. 　請求項１２に記載の硬化物又は請求項１３に記載の積層体を含む、半導体デバイス。 A semiconductor device comprising the cured product according to claim 12 or the laminate according to claim 13.
PCT/JP2023/011590 2022-03-29 2023-03-23 Resin composition, cured product, laminate, method for producing cured product, method for producing laminate, method for producing semiconductor device, and semiconductor device WO2023190061A1 (en)

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