WO2023186188A1 - Molybdenum alloy target material, and preparation method and application thereof - Google Patents
Molybdenum alloy target material, and preparation method and application thereof Download PDFInfo
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- WO2023186188A1 WO2023186188A1 PCT/CN2023/095633 CN2023095633W WO2023186188A1 WO 2023186188 A1 WO2023186188 A1 WO 2023186188A1 CN 2023095633 W CN2023095633 W CN 2023095633W WO 2023186188 A1 WO2023186188 A1 WO 2023186188A1
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- molybdenum alloy
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- powder
- molybdenum
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- 229910001182 Mo alloy Inorganic materials 0.000 title claims abstract description 79
- 239000013077 target material Substances 0.000 title claims abstract description 76
- 238000002360 preparation method Methods 0.000 title claims abstract description 30
- 238000005096 rolling process Methods 0.000 claims abstract description 54
- WUAPFZMCVAUBPE-UHFFFAOYSA-N rhenium atom Chemical compound [Re] WUAPFZMCVAUBPE-UHFFFAOYSA-N 0.000 claims abstract description 22
- 239000000463 material Substances 0.000 claims abstract description 18
- 229910052702 rhenium Inorganic materials 0.000 claims abstract description 13
- 238000004544 sputter deposition Methods 0.000 claims abstract description 8
- 229910052751 metal Inorganic materials 0.000 claims abstract description 6
- 239000002184 metal Substances 0.000 claims abstract description 6
- 239000012535 impurity Substances 0.000 claims abstract description 5
- 239000000843 powder Substances 0.000 claims description 49
- 239000002245 particle Substances 0.000 claims description 35
- 239000002994 raw material Substances 0.000 claims description 35
- 238000010438 heat treatment Methods 0.000 claims description 32
- 239000010936 titanium Substances 0.000 claims description 28
- 238000000498 ball milling Methods 0.000 claims description 27
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 27
- 238000000137 annealing Methods 0.000 claims description 25
- 238000005098 hot rolling Methods 0.000 claims description 24
- 238000001513 hot isostatic pressing Methods 0.000 claims description 22
- 238000000034 method Methods 0.000 claims description 21
- 239000010408 film Substances 0.000 claims description 20
- 239000012298 atmosphere Substances 0.000 claims description 18
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 17
- YUSUJSHEOICGOO-UHFFFAOYSA-N molybdenum rhenium Chemical compound [Mo].[Mo].[Re].[Re].[Re] YUSUJSHEOICGOO-UHFFFAOYSA-N 0.000 claims description 17
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 claims description 15
- 239000011812 mixed powder Substances 0.000 claims description 15
- 229910000691 Re alloy Inorganic materials 0.000 claims description 14
- HRLYFPKUYKFYJE-UHFFFAOYSA-N tetraoxorhenate(2-) Chemical compound [O-][Re]([O-])(=O)=O HRLYFPKUYKFYJE-UHFFFAOYSA-N 0.000 claims description 13
- 230000009467 reduction Effects 0.000 claims description 12
- 238000004321 preservation Methods 0.000 claims description 11
- 239000000203 mixture Substances 0.000 claims description 10
- 238000005253 cladding Methods 0.000 claims description 8
- 239000010410 layer Substances 0.000 claims description 8
- 238000009413 insulation Methods 0.000 claims description 7
- 229910052759 nickel Inorganic materials 0.000 claims description 6
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 5
- 239000001257 hydrogen Substances 0.000 claims description 5
- 229910052739 hydrogen Inorganic materials 0.000 claims description 5
- 229910052758 niobium Inorganic materials 0.000 claims description 5
- 229910052719 titanium Inorganic materials 0.000 claims description 5
- 239000012300 argon atmosphere Substances 0.000 claims description 4
- 229910052804 chromium Inorganic materials 0.000 claims description 4
- 238000002156 mixing Methods 0.000 claims description 4
- 239000010409 thin film Substances 0.000 claims description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 3
- 239000011261 inert gas Substances 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 3
- 229910052715 tantalum Inorganic materials 0.000 claims description 3
- 229910052726 zirconium Inorganic materials 0.000 claims description 3
- 238000009966 trimming Methods 0.000 claims description 2
- 238000005303 weighing Methods 0.000 claims description 2
- 239000011247 coating layer Substances 0.000 claims 1
- 238000003754 machining Methods 0.000 claims 1
- 230000005855 radiation Effects 0.000 claims 1
- 238000012545 processing Methods 0.000 abstract description 4
- 238000004663 powder metallurgy Methods 0.000 abstract description 2
- 238000005272 metallurgy Methods 0.000 abstract 1
- 230000000052 comparative effect Effects 0.000 description 15
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 14
- 230000003647 oxidation Effects 0.000 description 11
- 238000007254 oxidation reaction Methods 0.000 description 11
- 229910052750 molybdenum Inorganic materials 0.000 description 9
- 239000007789 gas Substances 0.000 description 8
- 239000011733 molybdenum Substances 0.000 description 8
- 229910052786 argon Inorganic materials 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- 238000005086 pumping Methods 0.000 description 6
- 239000010935 stainless steel Substances 0.000 description 6
- 229910001220 stainless steel Inorganic materials 0.000 description 6
- 239000011651 chromium Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 238000005336 cracking Methods 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 230000006872 improvement Effects 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 230000007704 transition Effects 0.000 description 3
- 239000002253 acid Substances 0.000 description 2
- 229910000905 alloy phase Inorganic materials 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 239000010955 niobium Substances 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical group [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 229910001069 Ti alloy Inorganic materials 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000005242 forging Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- DDTIGTPWGISMKL-UHFFFAOYSA-N molybdenum nickel Chemical compound [Ni].[Mo] DDTIGTPWGISMKL-UHFFFAOYSA-N 0.000 description 1
- ZPZCREMGFMRIRR-UHFFFAOYSA-N molybdenum titanium Chemical compound [Ti].[Mo] ZPZCREMGFMRIRR-UHFFFAOYSA-N 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
- 238000011946 reduction process Methods 0.000 description 1
- 238000007670 refining Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
- C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/12—Both compacting and sintering
- B22F3/14—Both compacting and sintering simultaneously
- B22F3/15—Hot isostatic pressing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/18—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces by using pressure rollers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/24—After-treatment of workpieces or articles
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C27/00—Alloys based on rhenium or a refractory metal not mentioned in groups C22C14/00 or C22C16/00
- C22C27/04—Alloys based on tungsten or molybdenum
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/18—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces by using pressure rollers
- B22F2003/185—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces by using pressure rollers by hot rolling, below sintering temperature
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/24—After-treatment of workpieces or articles
- B22F2003/248—Thermal after-treatment
Definitions
- the invention relates to the technical fields of rare metals and powder metallurgy, and in particular to a molybdenum alloy target material and its preparation method and application.
- Thin film transistors serve as drive elements for display panels and use Al or Cu as the main wiring material.
- Al or Cu is in direct contact with Si, thermal diffusion will be formed due to thermal processing during the preparation process, deteriorating the performance of the thin film transistor.
- Mo and molybdenum alloys such as Mo-Nb and Mo-Ti have good corrosion resistance, heat resistance, and good adhesion to the substrate.
- the laminated wiring film is formed on the substrate, it may be left in the atmosphere for a long time.
- semiconductor films using oxides need to be heated in an aerobic environment to improve performance and stabilize them. Therefore, there is a strong need to enhance oxidation resistance.
- the resin film used in portable, lightweight, and flexible display panels is more moisture-permeable than glass substrates, so the laminated wiring film needs to have higher moisture resistance.
- the moisture resistance and oxidation resistance of materials such as pure Mo and Mo-Ti are not sufficient, and oxidation may occur, causing a significant increase in the resistance value of Al or Cu.
- the patent "CN2012102930608” discloses a molybdenum alloy target for laminated wiring films. In order to improve the moisture resistance and oxidation resistance of pure molybdenum coatings, a certain amount of Ni and Ti are added to the molybdenum, which helps to stabilize electronic components. manufacturing and improving reliability.
- the patent "CN2014100909230” discloses a molybdenum alloy target for electronic components.
- the oxidation resistance is improved by adding Ni
- the moisture resistance can be improved by adding W element.
- the patent "CN2014100568166” discloses a molybdenum alloy target for metal film sputtering.
- the material is made of more than half of the molybdenum element as the matrix, and adding Ni, Ta, Cr, Zr and other elements can improve moisture resistance, oxidation resistance and maintain low resistance value.
- the patent "CN2017114460697” discloses a molybdenum alloy target composition containing Ni, Nb, Ti and other elements, which can better improve the moisture resistance and oxidation resistance of pure molybdenum and maintain a low film resistance.
- the above-mentioned patent jointly improves the moisture resistance and oxidation resistance of the molybdenum target sputtering film by adding a certain amount of Ni, Ti or Nb and other elements to the molybdenum matrix, and maintains a low resistance value.
- the preparation of targets is mainly through hot isostatic pressing (HIP).
- HIP hot isostatic pressing
- the HIP method is seriously limited by the size of the HIP equipment, and it is impossible to mass-produce high-performance molybdenum alloy targets.
- due to the current The alloy is highly brittle and prone to cracking under large deformations, so it is impossible to prepare a series of target products of different lengths through deformation methods such as rolling and forging.
- the purpose of the present invention is to overcome the shortcomings existing in the prior art and provide a molybdenum alloy target material and its preparation method and application.
- the molybdenum alloy target material provided by the invention has a low plastic-brittle transition temperature, strong deformation ability, and more uniform grains. When used as a target material to prepare a film layer, the film layer thickness is more uniform and the sputtering speed is faster.
- the present invention provides a molybdenum alloy target material.
- the target material includes 10% to 30% (for example, 15%, 20%, 25%) of Ni, 5% to 25% (for example, 10%, 15%, 20%) Ti and 0.5% ⁇ 5% (such as 1%, 1.5%, 2%, 2.5%, 3%, 3.5%, 4%, 4.5%) Re, the balance is Mo and unavoidable impurities, and the mass percentage of Mo is ⁇ 50% (such as 55%, 60%, 65%, 70%, 75%, 80%, 85%).
- the target material also includes 0.01%-15% (for example, 0.05%, 0.1%, 0.5%, 1%, 3%, 5% , 8%, 11%, 13%) of M, the M is at least one of Cr, Zr, Ta, Nb, and the M is used to replace part of Ti.
- the target includes 15% to 25% (for example, 18%, 21%, 23%) Ni in mass percentage, 10% to 20% ( For example, 12%, 14%, 16%, 18%) Ti, 1% ⁇ 5% Re (such as 2%, 3%, 4%), 0%-5% M (such as 1%, 2%, 3%, 4%), the balance is Mo and inevitable impurities, and the mass percentage of Mo is ⁇ 50% (such as 55%, 60%, 65%, 70%).
- Ni can improve the oxidation resistance of the film layer formed by the target material of the present invention, and Ti can improve the moisture resistance of the film layer. Adding appropriate amounts of both can not only ensure the oxidation resistance and moisture resistance of the film layer, but also ensure the low performance of the wiring film. Resistance does not affect the etching speed of the etchant.
- a small amount of Re element is added to the molybdenum alloy target material of the present invention.
- the addition of a specific proportion of rhenium element works together with the specific proportion of other elements in the molybdenum alloy to exert the "rhenium effect" in the molybdenum alloy and improve the molybdenum alloy target. Room temperature plasticity of the alloy, lowering the plastic-to-brittle transition temperature, refining the grains, etc.
- the Re element By adding the Re element to the molybdenum alloy target, the deformation performance of the target can be improved, and cracks will not occur during large deformation processing. Since the target structure has fine grains, the target obtained by the optimal molybdenum alloy composition ratio The material has extremely small grain level difference and uniform grains.
- the film thickness prepared by the target material of the invention is more uniform and the sputtering speed is faster.
- the amount of Re element exceeds 5%, on the one hand, the cost increases, and on the other hand, the large addition of Re element will form an alloy phase with other components, causing uneven distribution of tissue components in the target, affecting the subsequent coating effect.
- the amount of Re element is less than 0.5%, it cannot effectively refine the grains and enhance the plasticity of the target.
- the M element in the present invention has moisture resistance and can be used to partially replace Ti, which also has moisture resistance. However, from the perspective of the interaction of various components in the target, it is preferred that the M element can only partially replace Ti. On the other hand, the addition of M element can not only improve the moisture resistance of the molybdenum alloy target, but also further improve the molybdenum alloy target. of antioxidant properties.
- the present invention provides a method for preparing the above-mentioned molybdenum alloy target, which includes the following steps:
- Hot isostatic pressing Put the mixed powder in step (1) into a bag and perform hot isostatic pressing to obtain a hot-pressed green body with a bag;
- Hot rolling hot-rolling the jacketed hot-pressed green body to obtain a rolled piece
- Annealing anneal the rolled piece to obtain the molybdenum alloy target.
- the raw material of the component Mo in the target is molybdenum powder with a purity of ⁇ 3N5, and its Fisher particle size range is preferably 2.5 ⁇ m ⁇ 4 ⁇ m (for example, 2.8 ⁇ m , 3 ⁇ m, 3.5 ⁇ m, 3.8 ⁇ m); preferably, the raw material of the Ni component in the target material is nickel powder with a purity of ⁇ 3N, and its Fisher particle size range is preferably 2 ⁇ m ⁇ 3 ⁇ m (for example, 2.2 ⁇ m, 2.4 ⁇ m, 2.6 ⁇ m , 2.8 ⁇ m); preferably, the raw material of the Ti component in the target material is titanium powder with a purity of ⁇ 3N, and its Fibonacci particle size range is preferably 2 ⁇ m ⁇ 4 ⁇ m (for example, 2.3 ⁇ m, 2.6 ⁇ m, 3 ⁇ m, 3.3 ⁇ m, 3.6 ⁇ m ); Prefer
- molybdenum powder, nickel powder and titanium powder whose purity meets relevant standards are used as raw materials for preparing the target material of the present invention. , which can make the distribution of components in the prepared target material more uniform and the coating effect better.
- the raw material of the target component Re is ammonium rhenate
- the molybdenum-rhenium alloy powder is obtained by mixing ammonium acid acid and then undergoing reduction treatment, and then the molybdenum-rhenium alloy powder is mixed with the remaining molybdenum powder and other raw materials to obtain a mixed powder.
- the reduction treatment is performed in a hydrogen atmosphere, and the temperature of the reduction treatment is 500°C ⁇ 900°C (for example, 550°C, 600°C, 650°C , 700°C, 750°C, 800°C, 850°C), the time of the reduction treatment is 2h ⁇ 8h (such as 3h, 4h, 5h, 6h, 7h); preferably, in the molybdenum-rhenium alloy powder, molybdenum-rhenium The mass ratio is 95:5 ⁇ 50:50 (such as 18:1, 15:1, 12:1, 9:1, 6:1, 3:1).
- the gas flow rate in the above hydrogen reduction treatment should be determined according to the size of the reduction furnace, and the pressure should be slightly positive pressure.
- Ammonium rhenate is selected as the rhenium source and is first prepared with part of the molybdenum into molybdenum-rhenium powder in order to make the rhenium more evenly distributed in the molybdenum; rhenium powder can also be used directly or the ammonium rhenate is reduced to rhenium powder alone as a source for direct mixing. , but the powder uniformity is not as good as the ammonium rhenate-doped molybdenum powder reduction process.
- the mixing method is ball milling, and the ball-to-material ratio of the ball milling is 1: (0.5-2) (for example, 1 :0.8, 1:1.2, 1:1.4, 1:1.6, 1:1.8), preferably 1:1; preferably, the ball milling time is 10h ⁇ 16h (such as 11h, 12h, 13h, 14h, 15h);
- the ball milling is performed in an inert gas; preferably, the inert gas is argon; preferably, the ball milling speed is 50 ⁇ 300r/min (for example, 100r/min, 150r/min, 200r/min ,250r/min).
- the heat preservation temperature of the hot isostatic pressing is 900°C ⁇ 980°C (for example, 910°C, 920°C, 930°C, 940°C, 950°C, 960°C, 970°C); preferably, the pressure of the hot isostatic pressing is 100MPa ⁇ 170MPa (such as 110MPa, 120MPa, 130MPa, 140MPa, 150MPa, 160MPa); preferably, the heat, etc.
- the holding time of static pressure is 2h ⁇ 5h (such as 2h, 3h, 4h).
- the density of the hot-pressed green body obtained after the hot isostatic pressing process of the present invention can reach 100%.
- step (2) the mixed powder is put into the bag and then vacuumed and sealed; preferably, the vacuum is pumped until the vacuum degree is 10 - 1 Pa.
- step (2) after preparing the hot-pressed green body, it also includes partially trimming the envelope of the hot-pressed green body.
- the jacket is partially trimmed to ensure that the large surface of the hot-pressed green body is flat and free of bulges, which is beneficial to subsequent rolling.
- the thickness of the hot-pressed green body is 40mm ⁇ 60mm (for example, 42.5mm, 45mm, 47.5mm, 50mm, 52.5mm, 55mm, 57.5mm).
- the opening temperature of the hot rolling process is 1000°C ⁇ 1350°C (for example, 1150°C, 1200°C, 1250°C, 1300°C), the final rolling temperature is 900-1100°C (such as 950°C, 1000°C, 1050°C).
- the preferred solution of the present invention is to appropriately lower the rolling temperature of each pass during the rolling process, that is, to control the starting rolling temperature of each pass to be lower than the starting rolling temperature of the adjacent previous pass by more than 0°C and less than or equal to 50°C, which can improve the material quality. Strength and plasticity. If the starting rolling temperature of each pass drops too much based on the starting rolling temperature of the adjacent pass, it will cause the grain resistance to increase, increase the risk of billet cracking, and reduce the yield of hot rolling.
- the rolling deformation amount of a single pass is 15% ⁇ 25% (for example, 17.5%, 20 %, 22.5%), the total deformation amount of the hot rolling process is 40% ⁇ 80% (such as 45%, 50%, 55%, 60%, 65%, 70%, 75%); preferably, the In the hot rolling process, heating and insulation are performed before each pass of rolling.
- the insulation temperature is 1000°C ⁇ 1300°C (such as 1050°C, 1100°C, 1150°C, 1200°C, 1250°C), and the insulation time is 30 minutes to 120 minutes.
- the heating and holding temperature before each rolling pass is reduced by more than 0°C and less than or equal to the heating and holding temperature before rolling in the previous pass.
- 50°C such as 5°C, 10°C, 15°C, 20°C, 25°C, 30°C, 35°C, 40°C, 45°C
- the hot rolling is performed in air or argon atmosphere.
- step (4) before the annealing process of the rolled piece, the steps of removing the cladding and roughing are further included.
- the invention can machine the rolled pieces into different sizes before the annealing process, thereby obtaining target materials of different shapes or large sizes, and can meet the market's different specifications of molybdenum alloy target materials.
- the annealing treatment is performed in an argon atmosphere; preferably, the annealing temperature is 900°C ⁇ 1200°C (for example, 950°C, 1000°C, 1050°C, 1100°C, 1150°C), and the holding time is 60 minutes to 120 minutes (such as 70min, 80min, 90min, 100min, 110min).
- controlling the annealing temperature within this range can eliminate the anisotropy of the target material after extrusion and obtain a molybdenum alloy target material with uniform structure and fine grains. If the annealing temperature is lower than 900°C, the target structure is not completely crystallized, and there is a state of grain deformation in some areas. The annealing temperature is higher than 1200°C, which will cause the grains to grow abnormally and mixed crystals to appear, resulting in uneven tissue distribution and affecting the target. The effect of material sputtering coating.
- the grain size of the molybdenum alloy target material prepared in step (4) is ⁇ 100 ⁇ m; preferably 60 ⁇ m ⁇ 100 ⁇ m (such as 65 ⁇ m, 70 ⁇ m, 75 ⁇ m, 80 ⁇ m, 85 ⁇ m, 90 ⁇ m, 95 ⁇ m).
- the grain size of the molybdenum alloy target material prepared in step (4) is 4 ⁇ 5 levels; preferably, the grain size of the molybdenum alloy target material prepared in step (4) is In the same molybdenum alloy target material, the grain size difference is less than or equal to 1, preferably 0.
- the molybdenum alloy target material is a plate-shaped target material.
- the thickness of the rolled piece is 6mm ⁇ 24mm (for example, 8mm, 10mm, 12.5mm mm, 15mm, 17.5mm, 20mm, 22mm).
- the present invention also provides the application of the above-mentioned molybdenum alloy target, which is attached to the main conductive layer of the laminated wiring film for electronic components by sputtering to form a metal covering layer; preferably, the The electronic components are displays, semiconductor devices or thin film solar cells.
- the present invention has the following positive effects compared with the prior art:
- the present invention can also refine the grains after adding a specific amount of rhenium to the molybdenum alloy. size, reduce the brittleness of the material, increase the plastic toughness, and improve the deformation processing capability, so that the obtained blank can be subjected to the rolling process to obtain targets of different shapes or large sizes.
- the targets are usually prepared as plates.
- the price of rhenium is relatively expensive, and the present invention can achieve improvement by using only a small amount of rhenium.
- the annealing step of the present invention can further uniformly refine the grains.
- the molybdenum alloy target prepared by the present invention has a grain size of ⁇ 100 ⁇ m and a grain size level of 4 to 5.
- the difference in grain size among the same molybdenum alloy target materials is Less than or equal to 1, the highest can reach 0.
- Figure 1 is a metallographic structure diagram of the molybdenum alloy target prepared by the method of Example 1 of the present invention.
- test methods in the following examples are all conventional methods unless otherwise specified, and can be carried out according to the techniques or conditions described in literature in the field or according to the product instructions.
- the materials used in the following examples can be obtained from conventional commercial channels.
- the present invention uses the "rhenium effect" exerted by the Re element in molybdenum to improve the room temperature plasticity of the molybdenum alloy, reduce the plastic-to-brittle transition temperature, and refine the grains.
- Re element By adding Re element to the molybdenum alloy target, the deformation performance of the target is improved, that is, large-sized plate targets can be prepared through deformation methods such as rolling, and targets with uniform fine grains can be obtained through annealing.
- powder particle sizes mentioned in the following examples are Fisher particle size.
- the yield rate referred to in the following examples is the number of qualified rolled pieces obtained after hot rolling treatment/the number of hot-pressed green bodies subjected to hot rolling*100%.
- Embodiment 1 A method for preparing molybdenum alloy target material, including the following steps:
- Step 1 Mix pure Mo powder with a purity of 3N5 and a particle size of 3.2 ⁇ m, Ni powder with a purity of 3N and a particle size of 3.0 ⁇ m, Ti powder with a purity of 3N and a particle size of 2.8 ⁇ m, and rhenium powder with a purity of 4N and a particle size of 3.2 ⁇ m, according to the target materials.
- Step 2 Put the powder obtained in Step 1 into a ball milling tank with a ball-to-material ratio of 1:1, pump the air to negative pressure, fill it with argon to one atmospheric pressure, and conduct ball milling.
- the ball milling time is 12 hours, and the rotation speed is 200 r/min. ;
- Step 3 Put the mixed powder obtained in Step 2 into a bag made of stainless steel, pump air to 10 -1 Pa, keep pumping for 3 hours, and seal;
- Step 4 HIP the package in Step 3 at a temperature of 950°C, a pressure of 120MPa, and a holding time of 3 hours to obtain a hot-pressed green body;
- Step 5 Partially trim the cover of the hot-pressed green body in step 4 to ensure that the hot-pressed green body is flat on the large surface and has no bulges.
- the thickness of the green body is 56mm;
- Step 6 Put the jacketed hot-pressed slab that has been partially trimmed in step 5 into a muffle furnace, and heat it to the opening temperature of 1300°C in an air atmosphere.
- the holding time is 90 minutes, and the deformation amount in a single pass is 15%. ⁇ 25%, before each pass of rolling, it is necessary to return to the furnace for heating and insulation.
- the heating and insulation temperature before each pass of rolling is lowered by 50°C based on the heating and insulation temperature before each pass of rolling.
- Each pass of rolling The preheating and holding time is 90 minutes, the rolling passes are 5 times, the final rolling temperature is 1050°C, and the obtained rolled billet size is 20mm ⁇ 240mm ⁇ 2900mm (thickness ⁇ width ⁇ length);
- Step 7 Remove the cladding from the rolled billet obtained in Step 6, and machine it to obtain a billet with dimensions of 18mm ⁇ 230mm ⁇ 2750mm (thickness ⁇ width ⁇ length);
- Step 8 anneal the green body in Step 7 under an Ar gas atmosphere at an annealing temperature of 1100°C and a holding time of 60 minutes to obtain a uniform fine-grained plate with a grain size of 70 ⁇ m to 100 ⁇ m. See Figure 1.
- the grain size level is level 4.
- the plate-shaped target material obtained in this example has no cracks, and the yield is 100%.
- Embodiment 2 A method for preparing a molybdenum alloy target material, including the following steps:
- Step 1 Mix pure Mo powder with a purity of 3N5 and a particle size of 3.5 ⁇ m, Ni powder with a purity of 3N and a particle size of 2.6 ⁇ m, Ti powder with a purity of 3N and a particle size of 3.0 ⁇ m, and ammonium rhenate with a purity of 4N and a particle size of 3.5 ⁇ m, according to the target materials.
- Step 2 Put the powder obtained in Step 1 into a ball milling tank with a ball-to-material ratio of 1:2. Pump the air to negative pressure, fill it with argon gas to an atmospheric pressure, and conduct ball milling.
- the ball milling time is 10 hours and the rotation speed is 200 r/min. ;
- Step 3 Put the mixed powder obtained in Step 2 into a bag made of stainless steel, pump air to 10 -1 Pa, keep pumping for 4 hours, and seal;
- Step 4 HIP the package in Step 3 at a temperature of 930°C, a pressure of 150MPa, and a holding time of 3 hours to obtain a hot-pressed green body;
- Step 5 Partially trim the cover of the hot-pressed green body in Step 4 to ensure that the large surface of the hot-pressed green body is flat and has no bulges, and the thickness of the green body is 50mm;
- Step 6 Put the jacketed hot-pressed slab that has been partially trimmed in step 5 into a muffle furnace and heat it in an air atmosphere to the opening temperature of 1350°C.
- the holding time is 80 minutes and the deformation amount in a single pass is 15 % ⁇ 25%, the heating and holding temperature before each rolling pass is lowered by 50°C based on the heating and holding temperature before the previous rolling.
- the heating and holding time before each rolling pass is 90 minutes, and the rolling passes are 4 times.
- the final rolling temperature is 1100°C, and the resulting rolled billet size is 24mm ⁇ 240mm ⁇ 2900mm (thickness ⁇ width ⁇ length);
- Step 7 Remove the cladding from the rolled billet obtained in Step 6, and machine it to obtain a billet with dimensions of 22mm ⁇ 230mm ⁇ 2800mm (thickness ⁇ width ⁇ length);
- Step 8 anneal the green body in Step 7 under an Ar gas atmosphere at an annealing temperature of 1050°C and a holding time of 90 minutes to obtain a uniform fine-grained plate with a grain size of 65 ⁇ m to 90 ⁇ m, and a grain size level of 4.
- the plate-shaped target material obtained in this example has no cracks, and the yield is 100%.
- Embodiment 3 A method for preparing a molybdenum alloy target material, including the following steps:
- Step 1 Mix pure Mo powder with a purity of 3N5 and a particle size of 3.2 ⁇ m, Ni powder with a purity of 3N and a particle size of 3.5 ⁇ m, Ti powder with a purity of 3N and a particle size of 3.5 ⁇ m, and ammonium rhenate with a purity of 4N and a particle size of 3.5 ⁇ m, according to the target material.
- First prepare molybdenum-rhenium alloy powder. According to the element ratio of Mo:Re 1:1 in the molybdenum-rhenium alloy powder, first take the raw materials.
- the middle part of Mo powder is mixed with all the ammonium rhenate in the raw material, and reduced at 700°C for 3 hours in a hydrogen atmosphere to obtain molybdenum-rhenium alloy powder.
- the reduced molybdenum-rhenium alloy powder is added to the remaining raw material powder;
- Step 2 Put the powder obtained in Step 1 into a ball milling tank with a ball-to-material ratio of 1:1, pump the air to negative pressure, fill it with argon to one atmospheric pressure, and perform ball milling.
- the ball milling time is 16 hours, and the rotation speed is 200 r/min. ;
- Step 3 Put the mixed powder obtained in Step 2 into a bag made of stainless steel, pump air to 10 -1 Pa, keep pumping for 5 hours, and seal;
- Step 4 HIP the package in Step 3 at a temperature of 920°C, a pressure of 170MPa, and a pressure holding time of 4 hours;
- Step 5 Partially trim the cover of the hot-pressed plate body in step 4 to ensure that the hot-pressed plate body is flat on the large surface and has no bulges, and the thickness of the slab is 40mm;
- Step 6 Put the jacketed hot-pressed plate body that has been partially trimmed in step 5 into a muffle furnace, and heat it in the air atmosphere to the opening temperature of 1300°C.
- the holding time is 70 minutes, and the deformation amount in a single pass is 15% ⁇ 25%.
- the heating and holding temperature before each rolling pass is lowered by 50°C based on the heating and holding temperature before the previous rolling.
- the heating and holding time before each rolling pass is 90 minutes.
- the temperature is 1100°C, and the obtained rolled billet size is 18mm ⁇ 240mm ⁇ 1450mm (thickness ⁇ width ⁇ length);
- Step 7 Remove the cladding from the rolled billet obtained in Step 6, and machine it to obtain a billet with dimensions of 16mm ⁇ 230mm ⁇ 1400mm (thickness ⁇ width ⁇ length);
- Step 8 anneal the green body in Step 7 under an Ar gas atmosphere at an annealing temperature of 1150°C and a holding time of 45 minutes to obtain a uniform fine-grained plate with a grain size of 70 ⁇ m to 95 ⁇ m, and a grain size level of 4.
- the plate-shaped target material obtained in this example has no cracks, and the yield is 100%.
- Embodiment 4 A method for preparing a molybdenum alloy target material, including the following steps:
- Step 1 Mix pure Mo powder with a purity of 3N5 and a particle size of 3.8 ⁇ m, Ni powder with a purity of 3N and a particle size of 3.5 ⁇ m, Ti powder with a purity of 3N and a particle size of 3.2 ⁇ m, and rhenium powder with a purity of 4N and a particle size of 2.8 ⁇ m, according to the target materials.
- Step 2 Put the powder obtained in step 1 into a ball milling tank with a ball-to-material ratio of 2:1, pump the air to negative pressure, fill it with argon to one atmospheric pressure, and conduct ball milling.
- the ball milling time is 14 hours and the rotation speed is 200 r/min. ;
- Step 3 Put the mixed powder obtained in Step 2 into a bag made of stainless steel, pump air to 10 -1 Pa, keep pumping for 5 hours, and seal;
- Step 4 HIP the package in Step 3 at a temperature of 920°C, a pressure of 170MPa, and a holding time of 4 hours to obtain a hot pressed plate body;
- Step 5 Partially trim the covering of the hot-pressed plate body in step 4 to ensure that the hot-pressed plate body is flat on the large surface and has no bulges.
- the thickness of the hot-pressed plate body is 54mm;
- Step 6 Put the hot pressed plate body that has been partially trimmed in step 5 into a muffle furnace, and heat it to the opening temperature of 1350°C in an air atmosphere.
- the holding time is 60 minutes, and the deformation amount in a single pass is 15% ⁇ 25%.
- the heating and holding temperature before each rolling pass is lowered by 50°C based on the heating and holding temperature before the previous rolling.
- the heating and holding time before each rolling pass is 90 minutes.
- Step 7 Remove the cladding from the rolled billet obtained in Step 6, and machine it to obtain a billet with dimensions of 22mm ⁇ 230mm ⁇ 2750mm (thickness ⁇ width ⁇ length);
- Step 8 anneal the green body in Step 7 under an Ar gas atmosphere at an annealing temperature of 1100°C and a holding time of 60 minutes to obtain a uniform fine-grained plate with a grain size of 65 ⁇ m to 95 ⁇ m, and a grain size level of 4.
- the plate-shaped target material obtained in this example has no cracks, and the yield is 100%.
- Step 2 Put the powder obtained in Step 1 into a ball milling tank with a ball-to-material ratio of 1:1, pump the air to negative pressure, fill it with argon to one atmospheric pressure, and conduct ball milling.
- the ball milling time is 12 hours, and the rotation speed is 200 r/min. ;
- Step 3 Put the mixed powder obtained in Step 2 into a bag made of stainless steel, pump air to 10 -1 Pa, keep pumping for 3 hours, and seal;
- Step 4 HIP the package in Step 3 at a temperature of 950°C, a pressure of 120MPa, and a holding time of 3 hours to obtain a hot-pressed green body;
- Step 5 Partially trim the cover of the hot-pressed green body in step 4 to ensure that the hot-pressed green body is flat on the large surface and has no bulges.
- the thickness of the green body is 56mm;
- Step 6 Put the jacketed hot-pressed slab that has been partially trimmed in step 5 into a muffle furnace, and heat it to the opening temperature of 1300°C in an air atmosphere. Heating and holding for 90 minutes, the deformation amount in a single pass is 15%. ⁇ 25%, the heating and holding temperature of each pass is lowered by 50°C based on the heating and holding temperature of the previous pass, the heating and holding time of each pass is 90 minutes, the rolling passes are 5 times, and the final rolling temperature is 1050°C.
- the obtained The rolled billet size is 24mm ⁇ 240mm ⁇ 2900mm (thickness ⁇ width ⁇ length);
- Step 7 Remove the cladding from the rolled billet obtained in Step 6, and machine it to obtain a billet with dimensions of 22mm ⁇ 230mm ⁇ 2750mm (thickness ⁇ width ⁇ length);
- Step 8 Perform annealing treatment on the green body in Step 7 under an Ar gas atmosphere at an annealing temperature of 1100°C and a holding time of 60 minutes to obtain a uniform fine-grained plate with a grain size of 60 ⁇ m-90 ⁇ m and a grain size level of 4 to 5. .
- the plate-shaped target material obtained in this example has no cracks, and the yield is 100%.
- Step 1 Mix pure Mo powder with a purity of 3N5 and a particle size of 3.2 ⁇ m, Ni powder with a purity of 3N and a particle size of 3.0 ⁇ m, Ti powder with a purity of 3N and a particle size of 2.8 ⁇ m, and rhenium powder with a purity of 4N and a particle size of 3.2 ⁇ m, according to the target materials.
- Step 2 Put the powder obtained in Step 1 into a ball milling tank with a ball-to-material ratio of 1:1, pump the air to negative pressure, fill it with argon to one atmospheric pressure, and conduct ball milling.
- the ball milling time is 12 hours, and the rotation speed is 200 r/min. ;
- Step 3 Put the mixed powder obtained in Step 2 into a bag made of stainless steel, pump air to 10 -1 Pa, keep pumping for 3 hours, and seal;
- Step 4 HIP the package in Step 3 at a temperature of 950°C, a pressure of 120MPa, and a holding time of 3 hours to obtain a hot-pressed green body;
- Step 5 Partially trim the cover of the hot-pressed green body in step 4 to ensure that the hot-pressed green body is flat on the large surface and has no bulges.
- the thickness of the green body is 56mm;
- Step 6 Put the jacketed hot-pressed slab that has been partially trimmed in step 5 into a muffle furnace and heat it to the opening temperature of 1300°C in an air atmosphere. Heating and holding for 90 minutes before each pass of rolling. The deformation amount of each pass is 15% ⁇ 25%. The heating and holding temperature of each pass is lowered by 50°C based on the previous heating and holding temperature. The rolling passes are 5 times. The final rolling temperature is 1050°C. The resulting rolled billet size is 24mm ⁇ 240mm ⁇ 2900mm (thickness ⁇ width ⁇ length);
- Step 7 Remove the cladding from the rolled billet obtained in Step 6, and machine it to obtain a billet with dimensions of 22mm ⁇ 230mm ⁇ 2750mm (thickness ⁇ width ⁇ length);
- Step 8 Perform annealing treatment on the green body in Step 7 under an Ar gas atmosphere.
- the annealing temperature is 1100°C and the holding time is 60 minutes.
- a uniform fine-grained plate with a grain size of 90 ⁇ m to 120 ⁇ m is obtained.
- the grain size in the same plate is level 3. , some grain sizes are larger than 100 ⁇ m.
- the plate-shaped target obtained in this comparative example developed cracks, and the yield was 75%.
- Example 2 The same as Example 1, the only difference is that the annealing temperature of this comparative example is 1250°C.
- the grain size of the plate-shaped target obtained in this comparative example is 70 ⁇ m ⁇ 110 ⁇ m, and some grain sizes are larger than 100 ⁇ m.
- the plate-shaped target obtained in this comparative example has cracks, and the yield is 90%.
- the annealing temperature in this comparative example is too high, causing some grains to grow abnormally.
- the resulting plate-shaped target has larger grain sizes, mixed crystals, and larger grains in some parts.
- Example 2 The same as Example 1, the only difference is that the deformation amount in the rolling process of this comparative example is 30%.
- Example 2 The same as Example 1, the only difference is that in the rolling process of this comparative example, the heating and holding temperature of each pass is lowered by 80°C based on the previous heating and holding temperature.
- the grain size of the plate-shaped target obtained in this comparative example is 80 ⁇ m ⁇ 150 ⁇ m, with most grain sizes exceeding 100 ⁇ m, and the grain uniformity is poor.
- the plate-shaped target obtained in this example has cracks, and the yield is 50%.
- the heating and holding temperature of each pass during hot rolling dropped too much based on the previous heating and holding temperature, which resulted in an increase in grain resistance, increased the risk of billet cracking, and reduced the yield of hot rolling.
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Abstract
The invention relates to the technical field of rare metal and powder metallurgy, in particular to a molybdenum alloy target material, and a preparation method and application thereof. The target material comprises the following components in percentage by mass: 10-30% of Ni, 5-25% of Ti, 0.5-5% of Re, and the remaining being Mo and inevitable impurities, the mass percentage of Mo ≥ 50%. In the present invention, by adding a specific amount of rhenium to the molybdenum alloy, the grain size can be refined, so that the grains are more uniform, the brittleness of the material is reduced, the plasticity and toughness are improved, the deformation processing capacity is improved, the obtained blank material can be subjected to a rolling process to obtain target materials of different shapes or large sizes, and when same is used as a target material to prepare a film layer, the thickness of the film layer is more uniform and the sputtering speed is higher.
Description
本发明涉及稀有金属和粉末冶金技术领域,具体涉及一种钼合金靶材及其制备方法和应用。The invention relates to the technical fields of rare metals and powder metallurgy, and in particular to a molybdenum alloy target material and its preparation method and application.
液晶显示器、显示面板等平面显示装置的技术升级换代需求,需要配线膜的低电阻化。同时,平板显示器的大画面、高精细度、高速响应化,以及柔性面板的大型化,也要求较低的膜电阻水平。The technological upgrading of flat display devices such as liquid crystal displays and display panels requires lower resistance of wiring films. At the same time, the large screen, high definition, and high-speed response of flat panel displays, as well as the enlargement of flexible panels, also require lower film resistance levels.
薄膜晶体管(TFT)作为显示面板的驱动元件,使用Al或Cu作为主配线材料。但是如果Al或Cu与Si直接接触,会在制备过程中由于热加工形成热扩散,使得薄膜晶体管性能恶化。Mo及Mo-Nb、Mo-Ti等钼合金具有较好的耐腐蚀性、耐热性,与基板的密合性较好。但是在制备过程中,基板上形成层叠配线膜后,有时会长时间放置于大气中。在显示面板安装信号电缆时,有时需在大气中加热,而且在使用氧化物的半导体薄膜中,为实现提高性能和稳定化,需要在有氧环境下加热处理,因此增强耐氧化性的需求很强烈。另外,便携性的轻型、柔性显示面板使用的树脂膜与玻璃基板相比,具有透湿性,需要层叠配线膜具有较高的耐湿性。但是纯Mo、Mo-Ti等材料的耐湿性和耐氧化性并不充分,有时会产生氧化,造成Al或Cu的电阻值显著增加的问题。Thin film transistors (TFTs) serve as drive elements for display panels and use Al or Cu as the main wiring material. However, if Al or Cu is in direct contact with Si, thermal diffusion will be formed due to thermal processing during the preparation process, deteriorating the performance of the thin film transistor. Mo and molybdenum alloys such as Mo-Nb and Mo-Ti have good corrosion resistance, heat resistance, and good adhesion to the substrate. However, during the preparation process, after the laminated wiring film is formed on the substrate, it may be left in the atmosphere for a long time. When installing signal cables on display panels, they sometimes need to be heated in the atmosphere. In addition, semiconductor films using oxides need to be heated in an aerobic environment to improve performance and stabilize them. Therefore, there is a strong need to enhance oxidation resistance. strong. In addition, the resin film used in portable, lightweight, and flexible display panels is more moisture-permeable than glass substrates, so the laminated wiring film needs to have higher moisture resistance. However, the moisture resistance and oxidation resistance of materials such as pure Mo and Mo-Ti are not sufficient, and oxidation may occur, causing a significant increase in the resistance value of Al or Cu.
专利《CN2012102930608》,公开了一种层叠布线膜用钼合金靶材,为了改善纯钼镀膜的耐湿性和耐氧化性,在钼中添加了一定数量的Ni和Ti,有助于电子部件的稳定制造并提高可靠性。The patent "CN2012102930608" discloses a molybdenum alloy target for laminated wiring films. In order to improve the moisture resistance and oxidation resistance of pure molybdenum coatings, a certain amount of Ni and Ti are added to the molybdenum, which helps to stabilize electronic components. manufacturing and improving reliability.
专利《CN2014100909230》公开了一种电子部件用钼合金靶材,通过添加Ni提高耐氧化性,添加W元素可以提高耐湿性;专利《CN2014100568166》公开了一种金属薄膜溅射钼合金靶材,靶材由一半以上的钼元素为基体,添加Ni和Ta、Cr、Zr等元素,可以改善耐湿性、抗氧化性和维持低电阻值。The patent "CN2014100909230" discloses a molybdenum alloy target for electronic components. The oxidation resistance is improved by adding Ni, and the moisture resistance can be improved by adding W element. The patent "CN2014100568166" discloses a molybdenum alloy target for metal film sputtering. The material is made of more than half of the molybdenum element as the matrix, and adding Ni, Ta, Cr, Zr and other elements can improve moisture resistance, oxidation resistance and maintain low resistance value.
专利《CN2017114460697》,公开了一种含有Ni,Nb,Ti等元素的钼合金靶材成分,可以较好的改善纯钼的耐湿性和耐氧化性,并保持较低的膜电阻。The patent "CN2017114460697" discloses a molybdenum alloy target composition containing Ni, Nb, Ti and other elements, which can better improve the moisture resistance and oxidation resistance of pure molybdenum and maintain a low film resistance.
上述专利通过在钼基体中添加一定量的Ni、Ti或Nb等元素,共同提高钼靶材溅射膜的耐湿性、耐氧化性,并保持较低的电阻值。但是靶材的制备主要通过热等静压(HIP),随着靶材长度的增大,HIP方式严重受制于HIP设备的尺寸,无法批量化生产高性能的钼合金靶材,又由于目前钼合金脆性大,大变形量时容易开裂,因此无法通过轧制、锻造等变形方式来制备不同长度的靶材系列产品。The above-mentioned patent jointly improves the moisture resistance and oxidation resistance of the molybdenum target sputtering film by adding a certain amount of Ni, Ti or Nb and other elements to the molybdenum matrix, and maintains a low resistance value. However, the preparation of targets is mainly through hot isostatic pressing (HIP). As the length of the target increases, the HIP method is seriously limited by the size of the HIP equipment, and it is impossible to mass-produce high-performance molybdenum alloy targets. Moreover, due to the current The alloy is highly brittle and prone to cracking under large deformations, so it is impossible to prepare a series of target products of different lengths through deformation methods such as rolling and forging.
本发明的目的就是克服现有技术中存在的缺点,提供一种钼合金靶材及其制备方法和应用。本发明提供的钼合金靶材塑脆转变温度低、变形能力强,晶粒更为均匀,作为靶材制备膜层时膜层厚度更均匀,溅射速度更快。The purpose of the present invention is to overcome the shortcomings existing in the prior art and provide a molybdenum alloy target material and its preparation method and application. The molybdenum alloy target material provided by the invention has a low plastic-brittle transition temperature, strong deformation ability, and more uniform grains. When used as a target material to prepare a film layer, the film layer thickness is more uniform and the sputtering speed is faster.
为实现上述目的,本发明采用的技术方案的是:In order to achieve the above objects, the technical solutions adopted by the present invention are:
第一方面,本发明提供一种钼合金靶材,以质量百分数计,所述靶材包括10%~30%(例如15%、20%、25%)的Ni,5%~25%(例如10%、15%、20%)的Ti和0.5%~5%(例如1%、1.5%、2%、2.5%、3%、3.5%、4%、4.5%)的Re,余量为Mo和不可避免的杂质,且Mo的质量百分比≥50%(例如55%、60%、65%、70%、75%、80%、85%)。In a first aspect, the present invention provides a molybdenum alloy target material. In terms of mass percentage, the target material includes 10% to 30% (for example, 15%, 20%, 25%) of Ni, 5% to 25% (for example, 10%, 15%, 20%) Ti and 0.5%~5% (such as 1%, 1.5%, 2%, 2.5%, 3%, 3.5%, 4%, 4.5%) Re, the balance is Mo and unavoidable impurities, and the mass percentage of Mo is ≥50% (such as 55%, 60%, 65%, 70%, 75%, 80%, 85%).
在上述钼合金靶材中,作为一种优选实施方式,以质量百分数计,所述靶材还包括0.01%-15%(例如0.05%、0.1%、0.5%、1%、3%、5%、8%、11%、13%)的M,所述M为Cr、Zr、Ta、Nb中的至少一种,所述M用于替代部分Ti。In the above-mentioned molybdenum alloy target material, as a preferred embodiment, in terms of mass percentage, the target material also includes 0.01%-15% (for example, 0.05%, 0.1%, 0.5%, 1%, 3%, 5% , 8%, 11%, 13%) of M, the M is at least one of Cr, Zr, Ta, Nb, and the M is used to replace part of Ti.
在上述钼合金靶材中,作为一种优选实施方式,以质量百分数计,所述靶材包括15%~25%(例如18%、21%、23%)的Ni,10%~20%(例如12%、14%、16%、18%)的Ti、1%~5%的Re(例如2%、3%、4%),0%-5%的M(例如1%、2%、3%、4%),余量为Mo和不可避免的杂质,且Mo的质量百分比≥50%(例如55%、60%、65%、70%)。In the above molybdenum alloy target, as a preferred embodiment, the target includes 15% to 25% (for example, 18%, 21%, 23%) Ni in mass percentage, 10% to 20% ( For example, 12%, 14%, 16%, 18%) Ti, 1%~5% Re (such as 2%, 3%, 4%), 0%-5% M (such as 1%, 2%, 3%, 4%), the balance is Mo and inevitable impurities, and the mass percentage of Mo is ≥50% (such as 55%, 60%, 65%, 70%).
Ni可以提高由本发明靶材形成的膜层的耐氧化性,Ti可以提高膜层的耐湿性,二者适量添加不仅可以保证膜层的耐氧化性和耐湿性,还能保证配线膜的低电阻,不影响刻蚀剂的刻蚀速度。Ni can improve the oxidation resistance of the film layer formed by the target material of the present invention, and Ti can improve the moisture resistance of the film layer. Adding appropriate amounts of both can not only ensure the oxidation resistance and moisture resistance of the film layer, but also ensure the low performance of the wiring film. Resistance does not affect the etching speed of the etchant.
本发明钼合金靶材中添加了少量的Re元素,特定比例的铼元素的添加,与钼合金中特定比例的其他元素共同作用,使其在此钼合金中发挥了“铼效应”,改善钼合金的室温塑性,降低塑脆转变温度,细化晶粒等。通过在该钼合金靶材中添加Re元素,可提高靶材的变形性能,在大变形量加工时也不会产生裂纹,由于靶材组织晶粒细小,优选的钼合金组分配比得到的靶材晶粒级差特别小,晶粒均匀,本发明靶材制备的膜层厚度更均匀,溅射速度更快。当Re元素用量超过5%时,一方面是成本增加,另一方面是Re元素的大量添加会与其他成分形成合金相,使靶材中组织成分分布不均匀,影响后续镀膜效果。当Re元素用量小于0.5%时,则不能起到有效的细化晶粒以及增强靶材塑性的效果。A small amount of Re element is added to the molybdenum alloy target material of the present invention. The addition of a specific proportion of rhenium element works together with the specific proportion of other elements in the molybdenum alloy to exert the "rhenium effect" in the molybdenum alloy and improve the molybdenum alloy target. Room temperature plasticity of the alloy, lowering the plastic-to-brittle transition temperature, refining the grains, etc. By adding the Re element to the molybdenum alloy target, the deformation performance of the target can be improved, and cracks will not occur during large deformation processing. Since the target structure has fine grains, the target obtained by the optimal molybdenum alloy composition ratio The material has extremely small grain level difference and uniform grains. The film thickness prepared by the target material of the invention is more uniform and the sputtering speed is faster. When the amount of Re element exceeds 5%, on the one hand, the cost increases, and on the other hand, the large addition of Re element will form an alloy phase with other components, causing uneven distribution of tissue components in the target, affecting the subsequent coating effect. When the amount of Re element is less than 0.5%, it cannot effectively refine the grains and enhance the plasticity of the target.
本发明中M元素具有耐湿性,可用于部分替换同样具有耐湿性的Ti。但从靶材中各种成分相互作用的角度出发,优选M元素仅仅可以部分替代Ti,另一方面,M元素的添加在提高钼合金靶材耐湿性的同时,还能够进一步改善钼合金靶材的抗氧化性。The M element in the present invention has moisture resistance and can be used to partially replace Ti, which also has moisture resistance. However, from the perspective of the interaction of various components in the target, it is preferred that the M element can only partially replace Ti. On the other hand, the addition of M element can not only improve the moisture resistance of the molybdenum alloy target, but also further improve the molybdenum alloy target. of antioxidant properties.
第二方面,本发明提供上述钼合金靶材的制备方法,包括如下步骤:In a second aspect, the present invention provides a method for preparing the above-mentioned molybdenum alloy target, which includes the following steps:
(1)配制原料:按照上述靶材成分质量比例称取原料进行混合,得到混合粉末;(1) Preparation of raw materials: Weigh the raw materials according to the mass ratio of the above target components and mix them to obtain mixed powder;
(2)热等静压:将步骤(1)中的混合粉末装入包套,进行热等静压,得到带包套的热压坯体;(2) Hot isostatic pressing: Put the mixed powder in step (1) into a bag and perform hot isostatic pressing to obtain a hot-pressed green body with a bag;
(3)热轧:对带包套的热压坯体进行热轧处理得到轧件;(3) Hot rolling: hot-rolling the jacketed hot-pressed green body to obtain a rolled piece;
(4)退火:对轧件进行退火处理,得到所述钼合金靶材。(4) Annealing: anneal the rolled piece to obtain the molybdenum alloy target.
在上述钼合金靶材的制备方法中,作为一种优选实施方式,所述靶材中成分Mo的原料为纯度≥3N5的钼粉,其费氏粒度范围优选为2.5μm~4μm(例如2.8μm、3μm、3.5μm、3.8μm);优选地,所述靶材中成分Ni的原料为纯度≥3N的镍粉,其费氏粒度范围优选为2μm~3μm(例如2.2μm、2.4μm、2.6μm、2.8μm);优选地,所述靶材中成分Ti的原料为纯度≥3N的钛粉,其费氏粒度范围优选为2μm~4μm(例如2.3μm、2.6μm、3μm、3.3μm、3.6μm);优选地,所述靶材成分Re的原料为铼粉或铼酸铵,所述铼粉的纯度≥4N、费氏粒度优选为2μm~4μm(例如2.3μm、2.6μm、3μm、3.3μm、3.6μm),所述铼酸铵的纯度≥4N、粒度优选为150目~350目(例如180目、220目、260目、300目、325目)。In the preparation method of the above molybdenum alloy target, as a preferred embodiment, the raw material of the component Mo in the target is molybdenum powder with a purity of ≥3N5, and its Fisher particle size range is preferably 2.5 μm ~ 4 μm (for example, 2.8 μm , 3 μm, 3.5 μm, 3.8 μm); preferably, the raw material of the Ni component in the target material is nickel powder with a purity of ≥3N, and its Fisher particle size range is preferably 2 μm ~ 3 μm (for example, 2.2 μm, 2.4 μm, 2.6 μm , 2.8 μm); preferably, the raw material of the Ti component in the target material is titanium powder with a purity of ≥3N, and its Fibonacci particle size range is preferably 2 μm ~ 4 μm (for example, 2.3 μm, 2.6 μm, 3 μm, 3.3 μm, 3.6 μm ); Preferably, the raw material of the target component Re is rhenium powder or ammonium rhenate, the purity of the rhenium powder is ≥ 4N, and the Fisher particle size is preferably 2 μm ~ 4 μm (for example, 2.3 μm, 2.6 μm, 3 μm, 3.3 μm , 3.6 μm), the purity of the ammonium rhenate is ≥ 4N, and the particle size is preferably 150 mesh to 350 mesh (such as 180 mesh, 220 mesh, 260 mesh, 300 mesh, 325 mesh).
相比于使用钼钛合金粉末、钼镍合金粉末等合金粉末作为原料,本发明的优选方案中,使用了纯度满足相关标准的钼粉、镍粉和钛粉作为制备本发明的靶材的原料,能够使得所制备的靶材中的成分分布更均匀、镀膜效果更好。Compared with using alloy powders such as molybdenum-titanium alloy powder and molybdenum-nickel alloy powder as raw materials, in the preferred embodiment of the present invention, molybdenum powder, nickel powder and titanium powder whose purity meets relevant standards are used as raw materials for preparing the target material of the present invention. , which can make the distribution of components in the prepared target material more uniform and the coating effect better.
在上述钼合金靶材的制备方法中,作为一种优选实施方式,当靶材成分Re的原料为铼酸铵时,步骤(1)中称取原料后,先取原料钼粉中的一部分和铼酸铵混合,然后经过还原处理得到钼铼合金粉末,再将钼铼合金粉末与剩余钼粉及其他原料进行混合得到混合粉末。In the above preparation method of the molybdenum alloy target, as a preferred embodiment, when the raw material of the target component Re is ammonium rhenate, after weighing the raw materials in step (1), first take a part of the raw molybdenum powder and rhenium The molybdenum-rhenium alloy powder is obtained by mixing ammonium acid acid and then undergoing reduction treatment, and then the molybdenum-rhenium alloy powder is mixed with the remaining molybdenum powder and other raw materials to obtain a mixed powder.
在上述钼合金靶材的制备方法中,作为一种优选实施方式,所述还原处理在氢气气氛中进行,所述还原处理的温度为500℃~900℃(例如550℃、600℃、650℃、700℃、750℃、800℃、850℃),所述还原处理的时间为2h~8h(例如3h、4h、5h、6h、7h);优选地,所述钼铼合金粉末中,钼铼质量比例为95:5~50:50(例如18:1、15:1、12:1、9:1、6:1、3:1)。In the above preparation method of molybdenum alloy target, as a preferred embodiment, the reduction treatment is performed in a hydrogen atmosphere, and the temperature of the reduction treatment is 500°C~900°C (for example, 550°C, 600°C, 650°C , 700℃, 750℃, 800℃, 850℃), the time of the reduction treatment is 2h~8h (such as 3h, 4h, 5h, 6h, 7h); preferably, in the molybdenum-rhenium alloy powder, molybdenum-rhenium The mass ratio is 95:5~50:50 (such as 18:1, 15:1, 12:1, 9:1, 6:1, 3:1).
上述氢气还原处理中气体流量要根据还原炉膛大小而定,压力为微正压即可。选用铼酸铵作为铼源先与部分钼制备为钼铼粉末,是为了使铼在钼中分布的更加均匀;也可以直接使用铼粉或单独将铼酸铵还原为铼粉作为来源直接混料,但粉末均匀性不如采用铼酸铵掺钼粉还原工艺。The gas flow rate in the above hydrogen reduction treatment should be determined according to the size of the reduction furnace, and the pressure should be slightly positive pressure. Ammonium rhenate is selected as the rhenium source and is first prepared with part of the molybdenum into molybdenum-rhenium powder in order to make the rhenium more evenly distributed in the molybdenum; rhenium powder can also be used directly or the ammonium rhenate is reduced to rhenium powder alone as a source for direct mixing. , but the powder uniformity is not as good as the ammonium rhenate-doped molybdenum powder reduction process.
在上述钼合金靶材的制备方法中,作为一种优选实施方式,步骤(1)中,所述混合的方式为球磨,所述球磨的球料比为1:(0.5-2)(例如1:0.8、1:1.2、1:1.4、1:1.6、1:1.8),优选为1:1;优选地,所述球磨时间为10h~16h(例如11h、12h、13h、14h、15h);优选地,所述球磨在惰性气体中进行;优选地,所述惰性气体为氩气;优选地,所述球磨的转速为50~300r/min(例如100r/min、150r/min、200r/min、250r/min)。In the above preparation method of molybdenum alloy targets, as a preferred embodiment, in step (1), the mixing method is ball milling, and the ball-to-material ratio of the ball milling is 1: (0.5-2) (for example, 1 :0.8, 1:1.2, 1:1.4, 1:1.6, 1:1.8), preferably 1:1; preferably, the ball milling time is 10h~16h (such as 11h, 12h, 13h, 14h, 15h); Preferably, the ball milling is performed in an inert gas; preferably, the inert gas is argon; preferably, the ball milling speed is 50~300r/min (for example, 100r/min, 150r/min, 200r/min ,250r/min).
在上述钼合金靶材的制备方法中,作为一种优选实施方式,步骤(2)中,所述热等静压的保温温度为900℃~980℃(例如910℃、920℃、930℃、940℃、950℃、960℃、970℃);优选地,所述热等静压的压力为100MPa~170MPa(例如110MPa、120MPa、130MPa、140MPa、150MPa、160MPa);优选地,所述热等静压的保压时间为2h~5h(例如2h、3h、4h)。In the above preparation method of molybdenum alloy target material, as a preferred embodiment, in step (2), the heat preservation temperature of the hot isostatic pressing is 900°C~980°C (for example, 910°C, 920°C, 930°C, 940°C, 950°C, 960°C, 970°C); preferably, the pressure of the hot isostatic pressing is 100MPa~170MPa (such as 110MPa, 120MPa, 130MPa, 140MPa, 150MPa, 160MPa); preferably, the heat, etc. The holding time of static pressure is 2h~5h (such as 2h, 3h, 4h).
本发明热等静压工序后得到的热压坯体的致密度可以达到100%。The density of the hot-pressed green body obtained after the hot isostatic pressing process of the present invention can reach 100%.
在上述钼合金靶材的制备方法中,作为一种优选实施方式,步骤(2)中,将混合粉末装入包套后进行真空抽气密封;优选地,真空抽气至真空度为10
-1Pa。
In the above preparation method of molybdenum alloy target material, as a preferred embodiment, in step (2), the mixed powder is put into the bag and then vacuumed and sealed; preferably, the vacuum is pumped until the vacuum degree is 10 - 1 Pa.
在上述钼合金靶材的制备方法中,作为一种优选实施方式,步骤(2)中,制得热压坯体后,还包括对热压坯体的包套进行局部修整。In the above method for preparing a molybdenum alloy target, as a preferred embodiment, in step (2), after preparing the hot-pressed green body, it also includes partially trimming the envelope of the hot-pressed green body.
本发明中,在经过热等静压工序制得热压坯体后,对其包套进行局部修整,保证热压坯体大面平整,无凸起,利于后续的轧制。In the present invention, after the hot-pressed green body is obtained through the hot isostatic pressing process, the jacket is partially trimmed to ensure that the large surface of the hot-pressed green body is flat and free of bulges, which is beneficial to subsequent rolling.
在上述钼合金靶材的制备方法中,作为一种优选实施方式,步骤(2)中,所述热压坯体的坯体厚度为40mm~60mm(例如42.5mm、45mm、47.5mm、50mm、52.5mm、55mm、57.5mm)。In the above preparation method of molybdenum alloy target material, as a preferred embodiment, in step (2), the thickness of the hot-pressed green body is 40mm~60mm (for example, 42.5mm, 45mm, 47.5mm, 50mm, 52.5mm, 55mm, 57.5mm).
在上述钼合金靶材的制备方法中,作为一种优选实施方式,步骤(3)中,所述热轧工序的开坯温度为1000℃~1350℃(例如1150℃、1200℃、1250℃、1300℃),终轧温度为900-1100℃(例如950℃、1000℃、1050℃)。In the above preparation method of molybdenum alloy target material, as a preferred embodiment, in step (3), the opening temperature of the hot rolling process is 1000°C~1350°C (for example, 1150°C, 1200°C, 1250°C, 1300℃), the final rolling temperature is 900-1100℃ (such as 950℃, 1000℃, 1050℃).
本发明优选方案通过在轧制过程适当降温每道次的轧制温度即控制每道次开始轧制温度比相邻上一道次开始轧制温度降低大于0℃小于等于50℃,这样可以提高材料强度和可塑性。若每道次开始轧制温度在相邻上一道次开始轧制温度基础上降温幅度太大,则会导致晶粒抗力增大,增加了轧坯开裂风险,降低热轧的成品率。The preferred solution of the present invention is to appropriately lower the rolling temperature of each pass during the rolling process, that is, to control the starting rolling temperature of each pass to be lower than the starting rolling temperature of the adjacent previous pass by more than 0°C and less than or equal to 50°C, which can improve the material quality. Strength and plasticity. If the starting rolling temperature of each pass drops too much based on the starting rolling temperature of the adjacent pass, it will cause the grain resistance to increase, increase the risk of billet cracking, and reduce the yield of hot rolling.
在上述钼合金靶材的制备方法中,作为一种优选实施方式,步骤(3)中,所述热轧工序中,单道次轧制变形量为15%~25%(例如17.5%、20%、22.5%),所述热轧工序的总变形量为40%~80%(例如45%、50%、55%、60%、65%、70%、75%);优选地,所述热轧工序中,每道次轧制前进行加热保温,保温温度为1000℃~1300℃(例如1050℃、1100℃、1150℃、1200℃、1250℃),保温的时间为30分钟~120分钟(例如40min、50min、60min、70min、80min、90min、100min、110min);优选地,每道次轧制前加热保温温度在前一道次轧制前加热保温温度的基础上降低大于0℃小于等于50℃(例如5℃、10℃、15℃、20℃、25℃、30℃、35℃、40℃、45℃);优选地,所述热轧在空气或氩气气氛中进行。In the above preparation method of molybdenum alloy target material, as a preferred embodiment, in step (3), in the hot rolling process, the rolling deformation amount of a single pass is 15%~25% (for example, 17.5%, 20 %, 22.5%), the total deformation amount of the hot rolling process is 40%~80% (such as 45%, 50%, 55%, 60%, 65%, 70%, 75%); preferably, the In the hot rolling process, heating and insulation are performed before each pass of rolling. The insulation temperature is 1000℃~1300℃ (such as 1050℃, 1100℃, 1150℃, 1200℃, 1250℃), and the insulation time is 30 minutes to 120 minutes. (For example, 40min, 50min, 60min, 70min, 80min, 90min, 100min, 110min); Preferably, the heating and holding temperature before each rolling pass is reduced by more than 0°C and less than or equal to the heating and holding temperature before rolling in the previous pass. 50°C (such as 5°C, 10°C, 15°C, 20°C, 25°C, 30°C, 35°C, 40°C, 45°C); preferably, the hot rolling is performed in air or argon atmosphere.
在上述钼合金靶材的制备方法中,作为一种优选实施方式,步骤(4)中,轧件在进行退火工序前,还包括去除包套和粗加工工序。In the above preparation method of molybdenum alloy target material, as a preferred embodiment, in step (4), before the annealing process of the rolled piece, the steps of removing the cladding and roughing are further included.
本发明可以在退火工序前将轧件机加工为不同尺寸,从而得到不同形状或大尺寸的靶材,能够满足市场对于钼合金靶材的不同规格需求。The invention can machine the rolled pieces into different sizes before the annealing process, thereby obtaining target materials of different shapes or large sizes, and can meet the market's different specifications of molybdenum alloy target materials.
在上述钼合金靶材的制备方法中,作为一种优选实施方式,步骤(4)中,所述退火处理在氩气气氛中进行;优选地,所述退火的温度为900℃~1200℃(例如950℃、1000℃、1050℃、1100℃、1150℃)、保温时间60分钟~120分钟(例如70min、80min、90min、100min、110min)。In the above preparation method of molybdenum alloy target material, as a preferred embodiment, in step (4), the annealing treatment is performed in an argon atmosphere; preferably, the annealing temperature is 900°C~1200°C ( For example, 950℃, 1000℃, 1050℃, 1100℃, 1150℃), and the holding time is 60 minutes to 120 minutes (such as 70min, 80min, 90min, 100min, 110min).
本发明中,将退火温度控制在此范围,可以消除挤压后靶材的各向异性,获得组织均匀,晶粒细小的钼合金靶材。退火温度低于900℃,靶材组织未得到完全结晶,存在部分区域晶粒变形状态,退火温度高于1200℃会导致晶粒异常长大,出现混晶,导致组织分布不匀均,影响靶材溅射镀膜的效果。In the present invention, controlling the annealing temperature within this range can eliminate the anisotropy of the target material after extrusion and obtain a molybdenum alloy target material with uniform structure and fine grains. If the annealing temperature is lower than 900°C, the target structure is not completely crystallized, and there is a state of grain deformation in some areas. The annealing temperature is higher than 1200°C, which will cause the grains to grow abnormally and mixed crystals to appear, resulting in uneven tissue distribution and affecting the target. The effect of material sputtering coating.
在上述钼合金靶材的制备方法中,作为一种优选实施方式,步骤(4)中制备得到的钼合金靶材的晶粒尺寸≤100μm;优选为60μm~100μm(例如65μm、70μm、75μm、80μm、85μm、90μm、95μm)。In the above preparation method of molybdenum alloy target material, as a preferred embodiment, the grain size of the molybdenum alloy target material prepared in step (4) is ≤100 μm; preferably 60 μm ~ 100 μm (such as 65 μm, 70 μm, 75 μm, 80μm, 85μm, 90μm, 95μm).
在上述钼合金靶材的制备方法中,作为一种优选实施方式,步骤(4)中制备得到的钼合金靶材的晶粒度为4~5级;优选地,步骤(4)中制备得到的同一钼合金靶材中,晶粒度级差小于等于1,优选为0。In the above preparation method of molybdenum alloy target material, as a preferred embodiment, the grain size of the molybdenum alloy target material prepared in step (4) is 4~5 levels; preferably, the grain size of the molybdenum alloy target material prepared in step (4) is In the same molybdenum alloy target material, the grain size difference is less than or equal to 1, preferably 0.
在上述钼合金靶材的制备方法中,作为一种优选实施方式,所述钼合金靶材为板型靶材,优选地,所述轧件的厚度为6mm~24mm(例如8mm、10mm、12.5mm、15mm、17.5mm、20mm、22mm)。In the above preparation method of molybdenum alloy target material, as a preferred embodiment, the molybdenum alloy target material is a plate-shaped target material. Preferably, the thickness of the rolled piece is 6mm~24mm (for example, 8mm, 10mm, 12.5mm mm, 15mm, 17.5mm, 20mm, 22mm).
第三方面,本发明还提供了上述钼合金靶材的应用,所述钼合金靶材通过溅射方式附着在电子部件用层叠配线膜的主导电层上形成金属覆盖层;优选地,所述电子部件为显示器、半导体器件或薄膜太阳能电池。In a third aspect, the present invention also provides the application of the above-mentioned molybdenum alloy target, which is attached to the main conductive layer of the laminated wiring film for electronic components by sputtering to form a metal covering layer; preferably, the The electronic components are displays, semiconductor devices or thin film solar cells.
由于采取上述技术方案,本发明与现有技术相比具有如下
积极效果:
Due to the adoption of the above technical solutions, the present invention has the following positive effects compared with the prior art:
(1)本发明靶材中添加铼元素不仅没有影响靶材成膜后的耐热性、耐氧化性和耐湿性,本发明在钼合金中加特定量的铼后,还可以细化晶粒尺寸,降低材料脆性,增加塑韧性,提高变形加工能力,使得到的坯料可以进行轧制工序从而得到不同形状或大尺寸的靶材,靶材通常制备为板材。铼的价格比较贵,本发明仅使用了少量的铼就可以起到改善作用。(1) The addition of rhenium element to the target material of the present invention not only does not affect the heat resistance, oxidation resistance and moisture resistance of the target material after film formation, the present invention can also refine the grains after adding a specific amount of rhenium to the molybdenum alloy. size, reduce the brittleness of the material, increase the plastic toughness, and improve the deformation processing capability, so that the obtained blank can be subjected to the rolling process to obtain targets of different shapes or large sizes. The targets are usually prepared as plates. The price of rhenium is relatively expensive, and the present invention can achieve improvement by using only a small amount of rhenium.
(2)本发明的退火步骤可以进一步均匀细晶,本发明制备得到的钼合金靶材,晶粒尺寸≤100μm,晶粒度级别为4~5级,同一钼合金靶材中晶粒度级差小于等于1,最高能达到0。(2) The annealing step of the present invention can further uniformly refine the grains. The molybdenum alloy target prepared by the present invention has a grain size of ≤100 μm and a grain size level of 4 to 5. The difference in grain size among the same molybdenum alloy target materials is Less than or equal to 1, the highest can reach 0.
图1为本发明实施例1方法制备的钼合金靶材的金相组织图。Figure 1 is a metallographic structure diagram of the molybdenum alloy target prepared by the method of Example 1 of the present invention.
下面结合具体实施方式对本发明进行进一步的详细描述,给出的实施例仅为了阐明本发明,而不是为了限制本发明的范围。以下提供的实施例可作为本技术领域普通技术人员进行进一步改进或应用的基础,并不以任何方式构成对本发明的具体限制。The present invention will be described in further detail below in conjunction with specific embodiments. The examples given are only for illustrating the present invention and are not intended to limit the scope of the present invention. The examples provided below can serve as a basis for further improvements or applications by those of ordinary skill in the art, and do not constitute specific limitations to the present invention in any way.
下述实施例中的试验方法中,如无特殊说明,均为常规方法,可按照本领域内的文献所描述的技术或条件或者按照产品说明书进行。下述实施例中所用的材料,均可从常规商业途径得到。The test methods in the following examples are all conventional methods unless otherwise specified, and can be carried out according to the techniques or conditions described in literature in the field or according to the product instructions. The materials used in the following examples can be obtained from conventional commercial channels.
本发明通过Re元素在钼中发挥的“铼效应”,改善钼合金的室温塑性,降低塑脆转变温度,细化晶粒等。通过在钼合金靶材中添加Re元素,提高靶材的变形性能,即可以通过轧制等变形方式,来制备大尺寸的板状靶材,通过退火处理,得到具有均匀细晶的靶材。The present invention uses the "rhenium effect" exerted by the Re element in molybdenum to improve the room temperature plasticity of the molybdenum alloy, reduce the plastic-to-brittle transition temperature, and refine the grains. By adding Re element to the molybdenum alloy target, the deformation performance of the target is improved, that is, large-sized plate targets can be prepared through deformation methods such as rolling, and targets with uniform fine grains can be obtained through annealing.
如无特殊说明,以下实施例中所指粉末粒度均为费氏粒度。Unless otherwise specified, the powder particle sizes mentioned in the following examples are Fisher particle size.
本申请实施例中晶粒度级别测试依据标准为《GB/T6394 金属平均晶粒度测定方法》。The standard for testing the grain size level in the examples of this application is "GB/T6394 Method for determination of average grain size of metals".
以下实施例所指成品率为热轧处理后得到的合格轧件数量/进行热轧的热压坯体的数量*100%。The yield rate referred to in the following examples is the number of qualified rolled pieces obtained after hot rolling treatment/the number of hot-pressed green bodies subjected to hot rolling*100%.
实施例1一种钼合金靶材的制备方法,包含如下步骤:
Embodiment 1 A method for preparing molybdenum alloy target material, including the following steps:
步骤1,将纯度3N5的纯Mo粉,粒度3.2μm,纯度3N的Ni粉,粒度3.0μm,纯度3N的Ti粉,粒度2.8μm,纯度4N的铼粉,粒度3.2μm,按照靶材中各元素质量比Mo:Ni:Ti:Re=61:20:18:1,配置140Kg原料;Step 1: Mix pure Mo powder with a purity of 3N5 and a particle size of 3.2 μm, Ni powder with a purity of 3N and a particle size of 3.0 μm, Ti powder with a purity of 3N and a particle size of 2.8 μm, and rhenium powder with a purity of 4N and a particle size of 3.2 μm, according to the target materials. Element mass ratio Mo: Ni: Ti: Re=61:20:18:1, configured with 140Kg raw materials;
步骤2,将步骤1的得到的粉末,放入球磨罐中,球料比1:1,抽气至负压,充入氩气至一个大气压,进行球磨,球磨时间12h,转速为200r/min;Step 2: Put the powder obtained in Step 1 into a ball milling tank with a ball-to-material ratio of 1:1, pump the air to negative pressure, fill it with argon to one atmospheric pressure, and conduct ball milling. The ball milling time is 12 hours, and the rotation speed is 200 r/min. ;
步骤3,将步骤2得到的混合后的粉末放入不锈钢制作的包套中,抽气至10
-1Pa,保持抽气3h,密封;
Step 3: Put the mixed powder obtained in Step 2 into a bag made of stainless steel, pump air to 10 -1 Pa, keep pumping for 3 hours, and seal;
步骤4,将步骤3的包套进行HIP,温度为950℃,压力120MPa,保压时间3h,制得热压坯体;Step 4: HIP the package in Step 3 at a temperature of 950°C, a pressure of 120MPa, and a holding time of 3 hours to obtain a hot-pressed green body;
步骤5,对步骤4热压坯体的包套进行局部修整,保证热压坯体大面平整,无凸起,坯体厚度56mm;Step 5: Partially trim the cover of the hot-pressed green body in step 4 to ensure that the hot-pressed green body is flat on the large surface and has no bulges. The thickness of the green body is 56mm;
步骤6,将经过步骤5局部修整的带包套的热压板坯,放入马弗炉中,在空气气氛中加热至开坯温度1300℃,保温时间90分钟,单道次变形量15%~25%,每道次轧制之前均需重新回到炉中加热保温,每道次轧制前加热保温温度在前一道次轧制前加热保温温度基础上降温50℃,每道次轧制前加热保温时间均为90分钟,轧制道次5次,终轧温度为1050℃,得到的轧坯尺寸为20mm×240mm×2900mm(厚度×宽度×长度);Step 6: Put the jacketed hot-pressed slab that has been partially trimmed in step 5 into a muffle furnace, and heat it to the opening temperature of 1300°C in an air atmosphere. The holding time is 90 minutes, and the deformation amount in a single pass is 15%. ~25%, before each pass of rolling, it is necessary to return to the furnace for heating and insulation. The heating and insulation temperature before each pass of rolling is lowered by 50°C based on the heating and insulation temperature before each pass of rolling. Each pass of rolling The preheating and holding time is 90 minutes, the rolling passes are 5 times, the final rolling temperature is 1050°C, and the obtained rolled billet size is 20mm×240mm×2900mm (thickness×width×length);
步骤7,将步骤6所得轧坯去除包套,机加工得到尺寸为18mm×230mm×2750mm(厚度×宽度×长度)的坯体;Step 7: Remove the cladding from the rolled billet obtained in Step 6, and machine it to obtain a billet with dimensions of 18mm×230mm×2750mm (thickness×width×length);
步骤8,将步骤7的坯体进行Ar气气氛下的退火处理,退火温度1100℃,保温时间60分钟,得到晶粒尺寸70μm~100μm的均匀细晶板材,参见图1,晶粒度级别为4级。Step 8: anneal the green body in Step 7 under an Ar gas atmosphere at an annealing temperature of 1100°C and a holding time of 60 minutes to obtain a uniform fine-grained plate with a grain size of 70 μm to 100 μm. See Figure 1. The grain size level is level 4.
本实施例得到的板状靶材无裂纹,成品率100%。The plate-shaped target material obtained in this example has no cracks, and the yield is 100%.
实施例2一种钼合金靶材的制备方法,包含如下步骤:
Embodiment 2 A method for preparing a molybdenum alloy target material, including the following steps:
步骤1,将纯度3N5的纯Mo粉,粒度3.5μm,纯度3N的Ni粉,粒度2.6μm,纯度3N的Ti粉,粒度3.0μm,纯度4N的铼酸铵,粒度3.5μm,按照靶材各元素质量比Mo:Ni:Ti:Re=61:20:18:1,配置140Kg原料,首先制备钼铼合金粉末,按照钼铼合金粉末中Mo:Re=7:3的元素质量比例,先取原料中部分Mo粉与原料中全部铼酸铵混合,在氢气气氛中于600℃还原4h得到钼铼合金粉末,将还原后的钼铼合金粉末添加入剩余原料粉末中;Step 1: Mix pure Mo powder with a purity of 3N5 and a particle size of 3.5 μm, Ni powder with a purity of 3N and a particle size of 2.6 μm, Ti powder with a purity of 3N and a particle size of 3.0 μm, and ammonium rhenate with a purity of 4N and a particle size of 3.5 μm, according to the target materials. The element mass ratio Mo:Ni:Ti:Re=61:20:18:1, configure 140Kg of raw materials, first prepare molybdenum-rhenium alloy powder, according to the element mass ratio of Mo:Re=7:3 in the molybdenum-rhenium alloy powder, first take the raw materials The middle part of Mo powder is mixed with all the ammonium rhenate in the raw material, and reduced at 600°C for 4 hours in a hydrogen atmosphere to obtain molybdenum-rhenium alloy powder. The reduced molybdenum-rhenium alloy powder is added to the remaining raw material powder;
步骤2,将步骤1的得到的粉末,放入球磨罐中,球料比1:2,抽气至负压,充入氩气至一个大气压,进行球磨,球磨时间10h,转速为200r/min;Step 2: Put the powder obtained in Step 1 into a ball milling tank with a ball-to-material ratio of 1:2. Pump the air to negative pressure, fill it with argon gas to an atmospheric pressure, and conduct ball milling. The ball milling time is 10 hours and the rotation speed is 200 r/min. ;
步骤3,将步骤2得到的混合后的粉末放入不锈钢制作的包套中,抽气至10
-1Pa,保持抽气4h,密封;
Step 3: Put the mixed powder obtained in Step 2 into a bag made of stainless steel, pump air to 10 -1 Pa, keep pumping for 4 hours, and seal;
步骤4,将步骤3的包套进行HIP,温度为930℃,压力150MPa,保压时间3h,制得热压坯体;Step 4: HIP the package in Step 3 at a temperature of 930°C, a pressure of 150MPa, and a holding time of 3 hours to obtain a hot-pressed green body;
步骤5,对步骤4热压坯体的包套进行局部修整,保证热压坯体大面平整,无凸起,坯体厚度50mm;Step 5: Partially trim the cover of the hot-pressed green body in Step 4 to ensure that the large surface of the hot-pressed green body is flat and has no bulges, and the thickness of the green body is 50mm;
步骤6,将经过步骤5局部修整的带包套热压板坯,放入马弗炉中,在空气气氛中加热,加热至开坯温度1350℃,保温时间80分钟,单道次变形量15%~25%,每道次轧制前加热保温温度在前一次轧制前加热保温温度基础上降温50℃,每道次轧制前加热保温时间均为90分钟,轧制道次4次,终轧温度为1100℃,得到的轧坯尺寸为24mm×240mm×2900mm(厚度×宽度×长度);Step 6: Put the jacketed hot-pressed slab that has been partially trimmed in step 5 into a muffle furnace and heat it in an air atmosphere to the opening temperature of 1350°C. The holding time is 80 minutes and the deformation amount in a single pass is 15 %~25%, the heating and holding temperature before each rolling pass is lowered by 50°C based on the heating and holding temperature before the previous rolling. The heating and holding time before each rolling pass is 90 minutes, and the rolling passes are 4 times. The final rolling temperature is 1100°C, and the resulting rolled billet size is 24mm×240mm×2900mm (thickness×width×length);
步骤7,将步骤6所得轧坯去除包套,机加工得到尺寸为22mm×230mm×2800mm(厚度×宽度×长度)的坯体;Step 7: Remove the cladding from the rolled billet obtained in Step 6, and machine it to obtain a billet with dimensions of 22mm×230mm×2800mm (thickness×width×length);
步骤8,将步骤7的坯体进行Ar气气氛下的退火处理,退火温度1050℃,保温时间90分钟,得到晶粒尺寸65μm~90μm的均匀细晶板材,晶粒度级别为4级。Step 8: anneal the green body in Step 7 under an Ar gas atmosphere at an annealing temperature of 1050°C and a holding time of 90 minutes to obtain a uniform fine-grained plate with a grain size of 65 μm to 90 μm, and a grain size level of 4.
本实施例得到的板状靶材无裂纹,成品率100%。The plate-shaped target material obtained in this example has no cracks, and the yield is 100%.
实施例3一种钼合金靶材的制备方法,包含如下步骤:
Embodiment 3 A method for preparing a molybdenum alloy target material, including the following steps:
步骤1,将纯度3N5的纯Mo粉,粒度3.2μm,纯度3N的Ni粉,粒度3.5μm,纯度3N的Ti粉,粒度3.5μm,纯度4N的铼酸铵,粒度3.5μm,按照靶材中各元素质量比Mo:Ni:Ti:Re=60:20:18:2,配置70Kg原料,首先制备钼铼合金粉末,按照钼铼合金粉末中Mo:Re=1:1的元素比例,先取原料中部分Mo粉与原料中全部铼酸铵混合,在氢气气氛中于700℃还原3h得到钼铼合金粉末,将还原后的钼铼合金粉末添加入剩余原料粉末中;Step 1: Mix pure Mo powder with a purity of 3N5 and a particle size of 3.2 μm, Ni powder with a purity of 3N and a particle size of 3.5 μm, Ti powder with a purity of 3N and a particle size of 3.5 μm, and ammonium rhenate with a purity of 4N and a particle size of 3.5 μm, according to the target material. The mass ratio of each element is Mo:Ni:Ti:Re=60:20:18:2. Configure 70Kg of raw materials. First prepare molybdenum-rhenium alloy powder. According to the element ratio of Mo:Re=1:1 in the molybdenum-rhenium alloy powder, first take the raw materials. The middle part of Mo powder is mixed with all the ammonium rhenate in the raw material, and reduced at 700°C for 3 hours in a hydrogen atmosphere to obtain molybdenum-rhenium alloy powder. The reduced molybdenum-rhenium alloy powder is added to the remaining raw material powder;
步骤2,将步骤1的得到的粉末,放入球磨罐中,球料比1:1,抽气至负压,充入氩气至一个大气压,进行球磨,球磨时间16h,转速为200r/min;Step 2: Put the powder obtained in Step 1 into a ball milling tank with a ball-to-material ratio of 1:1, pump the air to negative pressure, fill it with argon to one atmospheric pressure, and perform ball milling. The ball milling time is 16 hours, and the rotation speed is 200 r/min. ;
步骤3,将步骤2得到的混合后的粉末放入不锈钢制作的包套中,抽气至10
-1Pa,保持抽气5h,密封;
Step 3: Put the mixed powder obtained in Step 2 into a bag made of stainless steel, pump air to 10 -1 Pa, keep pumping for 5 hours, and seal;
步骤4,将步骤3的包套进行HIP,温度为920℃,压力170MPa,保压时间4h;Step 4: HIP the package in Step 3 at a temperature of 920°C, a pressure of 170MPa, and a pressure holding time of 4 hours;
步骤5,对步骤4热压板坯体的包套进行局部修整,保证热压板坯体大面平整,无凸起,板坯厚度40mm;Step 5: Partially trim the cover of the hot-pressed plate body in step 4 to ensure that the hot-pressed plate body is flat on the large surface and has no bulges, and the thickness of the slab is 40mm;
步骤6,将经过步骤5局部修整的带包套的热压板坯体,放入马弗炉中,空气气氛加热至开坯温度1300℃,保温时间70分钟,单道次变形量15%~25%,每道次轧制前加热保温温度在前一次轧制前加热保温温度基础上降温50℃,每道次轧制前加热保温时间均为90分钟,轧制道次4次,终轧温度为1100℃,得到的轧坯尺寸为18mm×240mm×1450mm(厚度×宽度×长度);Step 6: Put the jacketed hot-pressed plate body that has been partially trimmed in step 5 into a muffle furnace, and heat it in the air atmosphere to the opening temperature of 1300°C. The holding time is 70 minutes, and the deformation amount in a single pass is 15%~ 25%. The heating and holding temperature before each rolling pass is lowered by 50°C based on the heating and holding temperature before the previous rolling. The heating and holding time before each rolling pass is 90 minutes. There are 4 rolling passes and final rolling. The temperature is 1100°C, and the obtained rolled billet size is 18mm×240mm×1450mm (thickness×width×length);
步骤7,将步骤6所得轧坯去除包套,机加工得到尺寸为16mm×230mm×1400mm(厚度×宽度×长度)的坯体;Step 7: Remove the cladding from the rolled billet obtained in Step 6, and machine it to obtain a billet with dimensions of 16mm×230mm×1400mm (thickness×width×length);
步骤8,将步骤7的坯体进行Ar气气氛下的退火处理,退火温度1150℃,保温时间45分钟,得到晶粒尺寸70μm~95μm的均匀细晶板材,晶粒度级别为4级。Step 8: anneal the green body in Step 7 under an Ar gas atmosphere at an annealing temperature of 1150°C and a holding time of 45 minutes to obtain a uniform fine-grained plate with a grain size of 70 μm to 95 μm, and a grain size level of 4.
本实施例得到的板状靶材无裂纹,成品率100%。The plate-shaped target material obtained in this example has no cracks, and the yield is 100%.
实施例4一种钼合金靶材的制备方法,包含如下步骤:
Embodiment 4 A method for preparing a molybdenum alloy target material, including the following steps:
步骤1,将纯度3N5的纯Mo粉,粒度3.8μm,纯度3N的Ni粉,粒度3.5μm,纯度3N的Ti粉,粒度3.2μm,纯度4N的铼粉,粒度2.8μm,按照靶材中各元素质量比为Mo:Ni:Ti:Re=58:20:18:4,配置140Kg原料;Step 1: Mix pure Mo powder with a purity of 3N5 and a particle size of 3.8 μm, Ni powder with a purity of 3N and a particle size of 3.5 μm, Ti powder with a purity of 3N and a particle size of 3.2 μm, and rhenium powder with a purity of 4N and a particle size of 2.8 μm, according to the target materials. The element mass ratio is Mo:Ni:Ti:Re=58:20:18:4, and 140Kg of raw materials are configured;
步骤2,将步骤1的得到的粉末,放入球磨罐中,球料比2:1,抽气至负压,充入氩气至一个大气压,进行球磨,球磨时间14h,转速为200r/min;Step 2: Put the powder obtained in step 1 into a ball milling tank with a ball-to-material ratio of 2:1, pump the air to negative pressure, fill it with argon to one atmospheric pressure, and conduct ball milling. The ball milling time is 14 hours and the rotation speed is 200 r/min. ;
步骤3,将步骤2得到的混合后的粉末放入不锈钢制作的包套中,抽气至10
-1Pa,保持抽气5h,密封;
Step 3: Put the mixed powder obtained in Step 2 into a bag made of stainless steel, pump air to 10 -1 Pa, keep pumping for 5 hours, and seal;
步骤4,将步骤3的包套进行HIP,温度为920℃,压力170MPa,保压时间4h,制得热压板坯体;Step 4: HIP the package in Step 3 at a temperature of 920°C, a pressure of 170MPa, and a holding time of 4 hours to obtain a hot pressed plate body;
步骤5,对步骤4热压板坯体的包套进行局部修整,保证热压板坯体大面平整,无凸起,板坯体厚度54mm;Step 5: Partially trim the covering of the hot-pressed plate body in step 4 to ensure that the hot-pressed plate body is flat on the large surface and has no bulges. The thickness of the hot-pressed plate body is 54mm;
步骤6,将经过步骤5局部修整的热压板坯体,放入马弗炉中,在空气气氛中加热至开坯温度1350℃,保温时间60分钟,单道次变形量15%~25%,每道次轧制前加热保温温度在前一次轧制前加热保温温度基础上降温50℃,每道次轧制前加热保温时间均为90分钟,轧制道次5次,终轧温度为1100℃,得到的轧坯尺寸为24mm×240mm×2900mm(厚度×宽度×长度);Step 6: Put the hot pressed plate body that has been partially trimmed in step 5 into a muffle furnace, and heat it to the opening temperature of 1350°C in an air atmosphere. The holding time is 60 minutes, and the deformation amount in a single pass is 15%~25%. , the heating and holding temperature before each rolling pass is lowered by 50°C based on the heating and holding temperature before the previous rolling. The heating and holding time before each rolling pass is 90 minutes. There are 5 rolling passes, and the final rolling temperature is 1100℃, the obtained rolled billet size is 24mm×240mm×2900mm (thickness×width×length);
步骤7,将步骤6所得轧坯去除包套,机加工得到尺寸为22mm×230mm×2750mm(厚度×宽度×长度)的坯体;Step 7: Remove the cladding from the rolled billet obtained in Step 6, and machine it to obtain a billet with dimensions of 22mm×230mm×2750mm (thickness×width×length);
步骤8,将步骤7的坯体进行Ar气气氛下的退火处理,退火温度1100℃,保温时间60分钟,得到晶粒尺寸65μm~95μm的均匀细晶板材,晶粒度级别为4级。Step 8: anneal the green body in Step 7 under an Ar gas atmosphere at an annealing temperature of 1100°C and a holding time of 60 minutes to obtain a uniform fine-grained plate with a grain size of 65 μm to 95 μm, and a grain size level of 4.
本实施例得到的板状靶材无裂纹,成品率100%。The plate-shaped target material obtained in this example has no cracks, and the yield is 100%.
实施例5Example 5
步骤1,将纯度3N5的纯Mo粉,粒度3.2μm,纯度3N的Ni粉,粒度3.0μm,纯度3N的Ti粉,粒度2.8μm,纯度4N的铼粉,粒度3.2μm,Cr的原料为铬粉,按照靶材中各元素质量比Mo:Ni:Ti:Re:Cr=61:20:16:1:2,配置140Kg原料;Step 1: Pure Mo powder with a purity of 3N5, a particle size of 3.2 μm, Ni powder with a purity of 3.0 μm, Ti powder with a purity of 3N, a particle size of 2.8 μm, Rhenium powder with a purity of 4N, a particle size of 3.2 μm, and the raw material of Cr is chromium. Powder, according to the mass ratio of each element in the target material Mo:Ni:Ti:Re:Cr=61:20:16:1:2, configure 140Kg of raw materials;
步骤2,将步骤1的得到的粉末,放入球磨罐中,球料比1:1,抽气至负压,充入氩气至一个大气压,进行球磨,球磨时间12h,转速为200r/min;Step 2: Put the powder obtained in Step 1 into a ball milling tank with a ball-to-material ratio of 1:1, pump the air to negative pressure, fill it with argon to one atmospheric pressure, and conduct ball milling. The ball milling time is 12 hours, and the rotation speed is 200 r/min. ;
步骤3,将步骤2得到的混合后的粉末放入不锈钢制作的包套中,抽气至10
-1Pa,保持抽气3h,密封;
Step 3: Put the mixed powder obtained in Step 2 into a bag made of stainless steel, pump air to 10 -1 Pa, keep pumping for 3 hours, and seal;
步骤4,将步骤3的包套进行HIP,温度为950℃,压力120MPa,保压时间3h,制得热压坯体;Step 4: HIP the package in Step 3 at a temperature of 950°C, a pressure of 120MPa, and a holding time of 3 hours to obtain a hot-pressed green body;
步骤5,对步骤4热压坯体的包套进行局部修整,保证热压坯体大面平整,无凸起,坯体厚度56mm;Step 5: Partially trim the cover of the hot-pressed green body in step 4 to ensure that the hot-pressed green body is flat on the large surface and has no bulges. The thickness of the green body is 56mm;
步骤6,将经过步骤5局部修整的带包套的热压板坯,放入马弗炉中,在空气气氛中加热至开坯温度1300℃,加热保温90分钟,单道次变形量15%~25%,每道次加热保温温度在前一道次加热保温温度基础上降温50℃,每道次加热保温时间均为90分钟,轧制道次5次,终轧温度为1050℃,得到的轧坯尺寸为24mm×240mm×2900mm(厚度×宽度×长度);Step 6: Put the jacketed hot-pressed slab that has been partially trimmed in step 5 into a muffle furnace, and heat it to the opening temperature of 1300°C in an air atmosphere. Heating and holding for 90 minutes, the deformation amount in a single pass is 15%. ~25%, the heating and holding temperature of each pass is lowered by 50°C based on the heating and holding temperature of the previous pass, the heating and holding time of each pass is 90 minutes, the rolling passes are 5 times, and the final rolling temperature is 1050°C. The obtained The rolled billet size is 24mm×240mm×2900mm (thickness×width×length);
步骤7,将步骤6所得轧坯去除包套,机加工得到尺寸为22mm×230mm×2750mm(厚度×宽度×长度)的坯体;Step 7: Remove the cladding from the rolled billet obtained in Step 6, and machine it to obtain a billet with dimensions of 22mm×230mm×2750mm (thickness×width×length);
步骤8,将步骤7的坯体进行Ar气气氛下的退火处理,退火温度1100℃,保温时间60分钟,得到晶粒尺寸60μm-90μm的均匀细晶板材,晶粒度级别为4~5级。Step 8: Perform annealing treatment on the green body in Step 7 under an Ar gas atmosphere at an annealing temperature of 1100°C and a holding time of 60 minutes to obtain a uniform fine-grained plate with a grain size of 60 μm-90 μm and a grain size level of 4 to 5. .
本实施例得到的板状靶材无裂纹,成品率100%。The plate-shaped target material obtained in this example has no cracks, and the yield is 100%.
对比例1Comparative example 1
步骤1,将纯度3N5的纯Mo粉,粒度3.2μm,纯度3N的Ni粉,粒度3.0μm,纯度3N的Ti粉,粒度2.8μm,纯度4N的铼粉,粒度3.2μm,按照靶材中各元素质量比Mo:Ni:Ti:Re=56:20:18:6,配置140Kg原料;Step 1: Mix pure Mo powder with a purity of 3N5 and a particle size of 3.2 μm, Ni powder with a purity of 3N and a particle size of 3.0 μm, Ti powder with a purity of 3N and a particle size of 2.8 μm, and rhenium powder with a purity of 4N and a particle size of 3.2 μm, according to the target materials. Element mass ratio Mo: Ni: Ti: Re=56:20:18:6, configured with 140Kg raw materials;
步骤2,将步骤1的得到的粉末,放入球磨罐中,球料比1:1,抽气至负压,充入氩气至一个大气压,进行球磨,球磨时间12h,转速为200r/min;Step 2: Put the powder obtained in Step 1 into a ball milling tank with a ball-to-material ratio of 1:1, pump the air to negative pressure, fill it with argon to one atmospheric pressure, and conduct ball milling. The ball milling time is 12 hours, and the rotation speed is 200 r/min. ;
步骤3,将步骤2得到的混合后的粉末放入不锈钢制作的包套中,抽气至10
-1Pa,保持抽气3h,密封;
Step 3: Put the mixed powder obtained in Step 2 into a bag made of stainless steel, pump air to 10 -1 Pa, keep pumping for 3 hours, and seal;
步骤4,将步骤3的包套进行HIP,温度为950℃,压力120MPa,保压时间3h,制得热压坯体;Step 4: HIP the package in Step 3 at a temperature of 950°C, a pressure of 120MPa, and a holding time of 3 hours to obtain a hot-pressed green body;
步骤5,对步骤4热压坯体的包套进行局部修整,保证热压坯体大面平整,无凸起,坯体厚度56mm;Step 5: Partially trim the cover of the hot-pressed green body in step 4 to ensure that the hot-pressed green body is flat on the large surface and has no bulges. The thickness of the green body is 56mm;
步骤6,将经过步骤5局部修整的带包套的热压板坯,放入马弗炉中,在空气气氛中加热至开坯温度1300℃,每道次轧制前加热保温90分钟,单道次变形量15%~25%,每道次加热保温温度在前一次加热保温温度基础上降温50℃,轧制道次5次,终轧温度为1050℃,得到的轧坯尺寸为24mm×240mm×2900mm(厚度×宽度×长度);Step 6: Put the jacketed hot-pressed slab that has been partially trimmed in step 5 into a muffle furnace and heat it to the opening temperature of 1300°C in an air atmosphere. Heating and holding for 90 minutes before each pass of rolling. The deformation amount of each pass is 15%~25%. The heating and holding temperature of each pass is lowered by 50°C based on the previous heating and holding temperature. The rolling passes are 5 times. The final rolling temperature is 1050°C. The resulting rolled billet size is 24mm× 240mm×2900mm (thickness×width×length);
步骤7,将步骤6所得轧坯去除包套,机加工得到尺寸为22mm×230mm×2750mm(厚度×宽度×长度)的坯体;Step 7: Remove the cladding from the rolled billet obtained in Step 6, and machine it to obtain a billet with dimensions of 22mm×230mm×2750mm (thickness×width×length);
步骤8,将步骤7的坯体进行Ar气气氛下的退火处理,退火温度1100℃,保温时间60分钟,得到晶粒尺寸90μm~120μm的均匀细晶板材,同一板材中晶粒度为3级,部分晶粒尺寸大于100μm。Step 8: Perform annealing treatment on the green body in Step 7 under an Ar gas atmosphere. The annealing temperature is 1100°C and the holding time is 60 minutes. A uniform fine-grained plate with a grain size of 90 μm to 120 μm is obtained. The grain size in the same plate is level 3. , some grain sizes are larger than 100μm.
本对比例得到的板状靶材产生裂纹,成品率75%。The plate-shaped target obtained in this comparative example developed cracks, and the yield was 75%.
对比例1制备的钼合金靶材,成本提高,而且铼含量过高,反而增加了变形的困难性,变形过程中坯料表面出现裂纹。同时,Re含量较多时,Re可与其它组元形成合金相,影响后续镀膜效果。The cost of the molybdenum alloy target prepared in Comparative Example 1 is increased, and the rhenium content is too high, which increases the difficulty of deformation, and cracks appear on the surface of the blank during the deformation process. At the same time, when the Re content is high, Re can form an alloy phase with other components, affecting the subsequent coating effect.
对比例2Comparative example 2
与实施例1相同,区别仅在于本对比例的退火温度为1250℃。The same as Example 1, the only difference is that the annealing temperature of this comparative example is 1250°C.
本对比例得到的板状靶材晶粒度为70μm~110μm,部分晶粒尺寸大于100μm。The grain size of the plate-shaped target obtained in this comparative example is 70 μm ~ 110 μm, and some grain sizes are larger than 100 μm.
本对比例得到的板状靶材产生裂纹,成品率90%。The plate-shaped target obtained in this comparative example has cracks, and the yield is 90%.
本对比例的退火温度过高,导致部分晶粒异常长大,得到的板状靶材晶粒度尺寸较大,出现混晶,局部有较大晶粒。The annealing temperature in this comparative example is too high, causing some grains to grow abnormally. The resulting plate-shaped target has larger grain sizes, mixed crystals, and larger grains in some parts.
对比例3Comparative example 3
与实施例1相同,区别仅在于本对比例的轧制工艺中道次变形量为30%。The same as Example 1, the only difference is that the deformation amount in the rolling process of this comparative example is 30%.
在本对比例的轧制过程中,第一道次出现边裂,第二道次开裂,无法制备为板材。During the rolling process of this comparative example, edge cracks occurred in the first pass and cracked in the second pass, making it impossible to prepare a plate.
对比例4Comparative example 4
与实施例1相同,区别仅在于本对比例的轧制工艺中,每道次加热保温温度在前一次加热保温温度基础上降温80℃。The same as Example 1, the only difference is that in the rolling process of this comparative example, the heating and holding temperature of each pass is lowered by 80°C based on the previous heating and holding temperature.
本对比例得到的板状靶材晶粒度为80μm~150μm,大部分晶粒尺寸超过100μm,晶粒均匀性差。The grain size of the plate-shaped target obtained in this comparative example is 80 μm ~ 150 μm, with most grain sizes exceeding 100 μm, and the grain uniformity is poor.
本实施例得到的板状靶材产生裂纹,成品率50%。本对比例中,热轧时每道次加热保温温度在前一次加热保温温度基础上降温幅度太大,导致晶粒抗力增大,增加了轧坯开裂风险,降低热轧的成品率。The plate-shaped target obtained in this example has cracks, and the yield is 50%. In this comparative example, the heating and holding temperature of each pass during hot rolling dropped too much based on the previous heating and holding temperature, which resulted in an increase in grain resistance, increased the risk of billet cracking, and reduced the yield of hot rolling.
以上对本发明进行了详述。对于本领域技术人员来说,在不脱离本发明的宗旨和范围,以及无需进行不必要的实验情况下,可在等同参数、比例和条件下,在较宽范围内实施本发明。虽然本发明给出了特殊的实施例,应该理解为,可以对本发明作进一步的改进。总之,按本发明的原理,本申请欲包括任何变更、用途或对本发明的改进,包括脱离了本申请中已公开范围,而用本领域已知的常规技术进行的改变。按以下附带的权利要求的范围,可以进行一些基本特征的应用。The present invention has been described in detail above. For those skilled in the art, the present invention can be implemented in a wider range under equivalent parameters, proportions and conditions without departing from the spirit and scope of the present invention and without performing unnecessary experiments. Although specific embodiments of the present invention have been shown, it should be understood that further modifications can be made to the invention. In short, based on the principles of the present invention, this application is intended to include any changes, uses, or improvements to the present invention, including changes that depart from the scope disclosed in this application and are made using conventional techniques known in the art. Some essential features may be applied within the scope of the appended claims below.
Claims (10)
- 一种钼合金靶材,其特征在于,以质量百分数计,所述靶材包括10%~30%的Ni,5%~25%的Ti和0.5%~5%的Re,余量为Mo和不可避免的杂质,且Mo的质量百分比≥50%;A molybdenum alloy target material, characterized in that, in terms of mass percentage, the target material includes 10% to 30% Ni, 5% to 25% Ti and 0.5% to 5% Re, with the balance being Mo and Unavoidable impurities, and the mass percentage of Mo is ≥50%;所述钼合金靶材的制备方法,包括如下步骤:The preparation method of the molybdenum alloy target material includes the following steps:(1)配制原料:按照所述靶材成分质量比例称取原料进行混合,得到混合粉末;(1) Preparing raw materials: Weigh the raw materials according to the mass ratio of the target components and mix them to obtain mixed powder;(2)热等静压:将步骤(1)中的混合粉末装入包套,进行热等静压,得到带包套的热压坯体;(2) Hot isostatic pressing: Put the mixed powder in step (1) into a bag and perform hot isostatic pressing to obtain a hot-pressed green body with a bag;(3)热轧:对带包套的热压坯体进行热轧处理得到轧件;(3) Hot rolling: hot-rolling the jacketed hot-pressed green body to obtain a rolled piece;(4)退火:对轧件进行退火处理,得到所述钼合金靶材;(4) Annealing: anneal the rolled piece to obtain the molybdenum alloy target;步骤(3)中,所述热轧处理中,单道次轧制变形量为15~25%,所述热轧处理的总变形量为40%~80%;所述热轧处理中,每道次轧制前进行加热保温,保温温度为1000℃~1300℃,保温的时间为30分钟~120分钟;每道次轧制前加热保温温度在前一道次轧制前加热保温温度的基础上降低大于0℃小于等于50℃。In step (3), in the hot rolling process, the rolling deformation amount of a single pass is 15~25%, and the total deformation amount of the hot rolling process is 40%~80%; in the hot rolling process, the deformation amount of each pass is 15~25%. Heating and heat preservation is carried out before rolling in a pass. The heat preservation temperature is 1000℃~1300℃ and the heat preservation time is 30 minutes~120 minutes. The heating and heat preservation temperature before each rolling pass is based on the heating and heat preservation temperature before the previous rolling pass. The reduction is greater than 0℃ and less than or equal to 50℃.
- 如权利要求1所述的钼合金靶材,其特征在于,以质量百分数计,所述靶材还包括0.01%-15%的M,所述M为Cr、Zr、Ta、Nb中的至少一种,所述M用于替代部分Ti。The molybdenum alloy target material according to claim 1, characterized in that, in terms of mass percentage, the target material further includes 0.01%-15% M, and the M is at least one of Cr, Zr, Ta, and Nb. species, the M is used to replace part of Ti.
- 如权利要求2所述的钼合金靶材,其特征在于,以质量百分数计,所述靶材包括15%~25%的Ni,10%~20%的Ti,1%~5%的Re,0.01%-5%的M,余量为Mo和不可避免的杂质,且Mo的质量百分比≥50%;The molybdenum alloy target material according to claim 2, characterized in that, in terms of mass percentage, the target material includes 15%~25% Ni, 10%~20% Ti, 1%~5% Re, 0.01%-5% M, the balance is Mo and inevitable impurities, and the mass percentage of Mo is ≥50%;和/或,步骤(4)中制备得到的钼合金靶材的晶粒尺寸≤100μm;And/or, the grain size of the molybdenum alloy target prepared in step (4) is ≤100 μm;和/或,步骤(4)中制备得到的钼合金靶材的晶粒度为4~5级;And/or, the molybdenum alloy target prepared in step (4) has a grain size of level 4 to 5;和/或,步骤(4)中制备得到的同一钼合金靶材中,晶粒度级差小于等于1。And/or, in the same molybdenum alloy target prepared in step (4), the grain size difference is less than or equal to 1.
- 如权利要求1-3任一项所述钼合金靶材的制备方法,其特征在于,包括如下步骤:The preparation method of molybdenum alloy target material according to any one of claims 1 to 3, characterized in that it includes the following steps:(1)配制原料:按照权利要求1-3任一项所述靶材成分质量比例称取原料进行混合,得到混合粉末;(1) Preparation of raw materials: Weigh the raw materials according to the mass ratio of the target components described in any one of claims 1-3 and mix them to obtain mixed powder;(2)热等静压:将步骤(1)中的混合粉末装入包套,进行热等静压,得到带包套的热压坯体;(2) Hot isostatic pressing: Put the mixed powder in step (1) into a bag and perform hot isostatic pressing to obtain a hot-pressed green body with a bag;(3)热轧:对带包套的热压坯体进行热轧处理得到轧件;(3) Hot rolling: hot-rolling the jacketed hot-pressed green body to obtain a rolled piece;(4)退火:对轧件进行退火处理,得到所述钼合金靶材;(4) Annealing: anneal the rolled piece to obtain the molybdenum alloy target;步骤(3)中,所述热轧处理中,单道次轧制变形量为15~25%,所述热轧处理的总变形量为40%~80%;所述热轧处理中,每道次轧制前进行加热保温,保温温度为1000℃~1300℃,保温的时间为30分钟~120分钟;每道次轧制前加热保温温度在前一道次轧制前加热保温温度的基础上降低大于0℃小于等于50℃。In step (3), in the hot rolling process, the rolling deformation amount of a single pass is 15~25%, and the total deformation amount of the hot rolling process is 40%~80%; in the hot rolling process, the deformation amount of each pass is 15~25%. Heating and heat preservation is carried out before rolling in a pass. The heat preservation temperature is 1000℃~1300℃ and the heat preservation time is 30 minutes~120 minutes. The heating and heat preservation temperature before each rolling pass is based on the heating and heat preservation temperature before the previous rolling pass. The reduction is greater than 0℃ and less than or equal to 50℃.
- 如权利要求4所述的钼合金靶材的制备方法,其特征在于,所述靶材中成分Mo的原料为纯度≥3N5的钼粉,其费氏粒度范围为2.5μm~4μm;The preparation method of molybdenum alloy target material according to claim 4, characterized in that the raw material of the component Mo in the target material is molybdenum powder with a purity of ≥3N5, and its Fisher particle size range is 2.5 μm ~ 4 μm;所述靶材中成分Ni的原料为纯度≥3N的镍粉,其费氏粒度范围为2μm~3μm;The raw material of the Ni component in the target material is nickel powder with a purity of ≥3N, and its Fibonacci particle size range is 2 μm ~ 3 μm;所述靶材中成分Ti的原料为纯度≥3N的钛粉,其费氏粒度范围为2μm~4μm;The raw material of the Ti component in the target material is titanium powder with a purity of ≥3N, and its Fibonacci particle size range is 2 μm ~ 4 μm;所述靶材成分Re的原料为铼粉或铼酸铵,所述铼粉的纯度≥4N、费氏粒度为2μm~4μm,所述铼酸铵的纯度≥4N、粒度为150目~350目。The raw material of the target component Re is rhenium powder or ammonium rhenate. The purity of the rhenium powder is ≥ 4N and the Fisher particle size is 2 μm ~ 4 μm. The purity of the ammonium rhenate is ≥ 4N and the particle size is 150 mesh to 350 mesh. .
- 如权利要求4所述的钼合金靶材的制备方法,其特征在于,当靶材成分Re的原料为铼酸铵时,步骤(1)中称取原料后,先取原料钼粉中的一部分和铼酸铵混合,然后经过还原处理得到钼铼合金粉末,再将钼铼合金粉末与剩余钼粉及其他原料进行混合得到混合粉末;The method for preparing a molybdenum alloy target as claimed in claim 4, characterized in that when the raw material of the target component Re is ammonium rhenate, after weighing the raw materials in step (1), first take a part of the raw molybdenum powder and Ammonium rhenate is mixed, and then subjected to reduction treatment to obtain molybdenum-rhenium alloy powder, and then the molybdenum-rhenium alloy powder is mixed with remaining molybdenum powder and other raw materials to obtain mixed powder;所述还原处理在氢气气氛中进行,所述还原处理的温度为500℃~900℃,所述还原处理的时间为2h~8h;The reduction treatment is performed in a hydrogen atmosphere, the temperature of the reduction treatment is 500°C~900°C, and the time of the reduction treatment is 2h~8h;所述钼铼合金粉末中,钼铼质量比例为95:5~50:50;In the molybdenum-rhenium alloy powder, the mass ratio of molybdenum-rhenium is 95:5~50:50;步骤(1)中,所述混合的方式为球磨,所述球磨的球料比为1:(0.5-2);所述球磨时间为10h~16h;所述球磨在惰性气体中进行,所述球磨的转速为50~300r/min。In step (1), the mixing method is ball milling, the ball-to-material ratio of the ball milling is 1: (0.5-2); the ball milling time is 10h~16h; the ball milling is performed in an inert gas, and the The speed of the ball mill is 50~300r/min.
- 如权利要求4所述的钼合金靶材的制备方法,其特征在于,步骤(2)中,所述热等静压的保温温度为900℃~980℃;所述热等静压的压力为100MPa~170MPa;所述热等静压的保压时间为2h~5h;步骤(2)中,制得热压坯体后,还包括对热压坯体的包套进行局部修整;步骤(2)中,所述热压坯体的坯体厚度为40mm~60mm。The preparation method of molybdenum alloy target material according to claim 4, characterized in that, in step (2), the insulation temperature of the hot isostatic pressing is 900°C~980°C; the pressure of the hot isostatic pressing is 100MPa~170MPa; the holding time of the hot isostatic pressing is 2h~5h; in step (2), after the hot-pressed green body is obtained, it also includes partial trimming of the envelope of the hot-pressed green body; step (2) ), the thickness of the hot-pressed green body is 40mm~60mm.
- 如权利要求4所述的钼合金靶材的制备方法,其特征在于,步骤(3)中,所述热轧处理的开坯温度为1000℃~1350℃,终轧温度为900℃-1100℃;所述热轧在空气或氩气气氛中进行;所述钼合金靶材为板型靶材,所述轧件的厚度为6mm~24mm。The preparation method of molybdenum alloy target material according to claim 4, characterized in that, in step (3), the opening temperature of the hot rolling treatment is 1000°C~1350°C, and the final rolling temperature is 900°C-1100°C. ; The hot rolling is performed in air or argon atmosphere; the molybdenum alloy target is a plate-shaped target, and the thickness of the rolled piece is 6mm~24mm.
- 如权利要求4所述的钼合金靶材的制备方法,其特征在于,步骤(4)中,轧件在进行退火处理前,还包括去除包套和粗加工工序;步骤(4)中,所述退火处理在氩气气氛中进行;所述退火的温度为900℃~1200℃、保温时间60分钟~120分钟。The preparation method of molybdenum alloy target material according to claim 4, characterized in that, in step (4), before the annealing treatment of the rolled piece, it also includes the steps of removing the cladding and rough machining; in step (4), the The annealing treatment is performed in an argon atmosphere; the annealing temperature ranges from 900°C to 1200°C, and the holding time ranges from 60 minutes to 120 minutes.
- 如权利要求1-3任一项所述钼合金靶材或者权利要求4-9任一项所述制备方法所制备的钼合金靶材的应用,其特征在于,所述钼合金靶材通过溅射方式附着在电子部件用层叠配线膜的主导电层上形成金属覆盖层;所述电子部件为显示器、半导体器件或薄膜太阳能电池。The application of the molybdenum alloy target material according to any one of claims 1 to 3 or the molybdenum alloy target material prepared by the preparation method according to any one of claims 4 to 9, characterized in that the molybdenum alloy target material is produced by sputtering The metal coating layer is formed by attaching to the main conductive layer of the laminated wiring film for electronic components by radiation; the electronic components are displays, semiconductor devices or thin film solar cells.
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