WO2023184122A1 - 发光基板、发光模组和显示装置 - Google Patents

发光基板、发光模组和显示装置 Download PDF

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Publication number
WO2023184122A1
WO2023184122A1 PCT/CN2022/083513 CN2022083513W WO2023184122A1 WO 2023184122 A1 WO2023184122 A1 WO 2023184122A1 CN 2022083513 W CN2022083513 W CN 2022083513W WO 2023184122 A1 WO2023184122 A1 WO 2023184122A1
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WIPO (PCT)
Prior art keywords
light
emitting
substrate
emitting element
substructures
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PCT/CN2022/083513
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English (en)
French (fr)
Inventor
秦沛
浩育涛
周昊
李冬磊
陈英
余鸿昊
高杰
李佳昕
牛静然
李金鹏
Original Assignee
京东方科技集团股份有限公司
京东方晶芯科技有限公司
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Application filed by 京东方科技集团股份有限公司, 京东方晶芯科技有限公司 filed Critical 京东方科技集团股份有限公司
Priority to CN202280000569.0A priority Critical patent/CN117136327A/zh
Priority to PCT/CN2022/083513 priority patent/WO2023184122A1/zh
Publication of WO2023184122A1 publication Critical patent/WO2023184122A1/zh

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices

Definitions

  • the present disclosure relates to the field of display technology, and in particular, to a light-emitting substrate, a light-emitting module and a display device.
  • Light-emitting substrates such as Mini LED (English full name: Mini Light-Emitting Diode, Chinese name: Micro Light-Emitting Diode) light-emitting substrate, have self-illumination, fast response, high contrast, high color gamut, wide viewing angle and can be produced on flexible substrates and other characteristics, are widely used.
  • Mini LED English full name: Mini Light-Emitting Diode
  • a light-emitting substrate in one aspect, includes a substrate and a plurality of light-emitting components. A plurality of light emitting components are located on one side of the substrate. At least one light-emitting component includes a light-emitting element and a dimming portion arranged around the light-emitting element.
  • the dimming part includes a plurality of substructures, and the plurality of substructures are spaced apart from each other. Wherein, along any direction away from the light-emitting element, the height of any two sub-structures in the light-modulating part is smaller than the height of the sub-structure relatively close to the light-emitting element.
  • the orthogonal projection area of any two substructures in the dimming part on the substrate of the substructure relatively close to the light-emitting element is smaller than that of the substructure relatively far away from the light-emitting element. The area of the orthographic projection on the substrate.
  • the light-emitting substrate further includes a driving circuit layer and a reflective film.
  • the driver circuit layer is located on one side of the substrate.
  • the driving circuit layer includes metal traces and conductive pads, and the conductive pads are electrically connected to the metal traces.
  • the reflective film is located on the side of the driving circuit layer away from the substrate, and the reflective film exposes the conductive pad.
  • the light-emitting element includes a light-emitting part and a lead.
  • the light-emitting part is located on the side of the reflective film away from the driving circuit layer.
  • the pins are electrically connected to the conductive pads.
  • a plurality of substructures in the light modulating part are located on the surface of the reflective film away from the driving circuit layer.
  • the light-emitting substrate further includes a driving circuit layer and a reflective component.
  • the driver circuit layer is located on one side of the substrate.
  • the driving circuit layer includes metal traces and conductive pads, and the conductive pads are electrically connected to the metal traces.
  • the reflective component is located on the side of the driving circuit layer away from the substrate. The reflective components are surrounded to form a reflective cavity.
  • the reflective member has communication holes.
  • the light-emitting element includes a light-emitting part and a lead. The light-emitting part is located in the reflective cavity. The pins are electrically connected to the conductive pad through the communication holes. Multiple substructures in the dimming part are located in the reflective cavity.
  • the reflective component includes a bottom wall and side walls.
  • the bottom wall has communication holes.
  • a plurality of substructures in the dimming part are located on the bottom wall.
  • One end of the side wall is connected to the bottom wall, and the other end extends along the bottom wall away from the substrate.
  • the side walls and bottom walls form a reflective cavity.
  • the side walls are perpendicular to the bottom wall.
  • the side wall is away from an edge of the bottom wall, and the shape of the orthographic projection on a reference plane parallel to the side wall is a plurality of continuous curves or a plurality of continuous polylines.
  • multiple substructures in the dimming part are located on a straight line.
  • the shape of at least one substructure is one of a cone, a pyramid, a frustum, a prism, and a hemisphere.
  • the height of the plurality of substructures in the light modulating part ranges from 250 ⁇ m to 1000 ⁇ m.
  • the absolute value of the height difference between any two adjacent substructures in the light modulating part ranges from 200 ⁇ m to 300 ⁇ m.
  • the absolute value of the height difference between any two adjacent substructures in the dimming part is equal to the absolute value of the height difference between any other two adjacent substructures.
  • the light-emitting substrate further includes diffusion particles.
  • the diffusive particles are located within at least one substructure.
  • the light emitting substrate has a display area.
  • the brightness of the light-emitting elements close to the edge of the display area is greater than the brightness of the light-emitting elements located in the rest of the display area.
  • the light-emitting module includes the above-mentioned light-emitting substrate and at least one lens. At least one lens is located on a side of the plurality of light-emitting components away from the substrate.
  • At least one lens is configured to have at least one first groove on a surface proximate the substrate. At least part of at least one substructure in the dimming part is embedded in the first groove.
  • At least one first groove is an annular groove.
  • the orthographic projection of the annular groove on the substrate surrounds the orthographic projection of the light-emitting element on the substrate.
  • the number of first grooves is multiple.
  • the multiple substructures embedded in the same first groove have the same height.
  • the orthographic projection areas of multiple substructures embedded in the same first groove on the substrate are the same.
  • the number of first grooves is multiple. Along any direction away from the light-emitting element, the depth of any two first grooves, the first groove relatively close to the light-emitting element, is smaller than the depth of the first groove relatively far away from the light-emitting element. And/or, along any direction away from the light-emitting element, the width of any two first grooves, the first groove relatively close to the light-emitting element, is smaller than the width of the first groove relatively far from the light-emitting element.
  • At least one lens is configured to have a recess on a surface remote from the substrate.
  • the orthographic projection of the light-emitting element on the substrate at least partially overlaps the orthographic projection of the recessed portion on the substrate.
  • At least one lens is configured to further have a second groove on the surface proximate the substrate.
  • the light-emitting element includes a light-emitting part, at least part of the light-emitting part is located in the second groove.
  • the light emitting element is configured to emit white light.
  • the light emitting element is configured to emit monochromatic light.
  • the light-emitting module also includes a color conversion film. The color conversion film is located on a side of at least one lens away from the light-emitting element.
  • the color conversion film is a quantum dot film.
  • the light-emitting element includes a first light-emitting element.
  • the orthographic projection of the first light-emitting element on the substrate is close to the edge of the orthographic projection of the quantum dot film on the substrate.
  • the dimming part includes a first dimming part.
  • the first dimming part surrounds the first light-emitting element.
  • the luminescent module also includes fluorescent particles.
  • the fluorescent particles are located in at least one substructure of the first dimming part. The fluorescent particles are configured to modulate the light irradiated to the fluorescent particles, so that the modulated light and the unmodulated light emitted by the light-emitting element are mixed into white light.
  • the light emitting element is configured to emit blue light
  • the fluorescent particles include yellow fluorescent particles.
  • the light-emitting element is configured to emit blue light
  • the fluorescent particles include red fluorescent particles and green fluorescent particles.
  • the light emitting module further includes a brightness enhancement film.
  • the brightness enhancement film is located on a side of the color conversion film away from the at least one lens.
  • a display device in yet another aspect, includes a backlight module and a liquid crystal display panel.
  • the liquid crystal display panel is located on the light exit side of the backlight module.
  • the backlight module includes the above-mentioned light-emitting substrate.
  • the backlight module includes the above-mentioned light-emitting module.
  • a display device in yet another aspect, includes a display panel.
  • the display panel includes the above-mentioned light-emitting substrate.
  • the display panel includes the above-mentioned light-emitting module.
  • Figure 1A is a structural diagram of a light emitting module according to some embodiments.
  • Figure 1B is a structural diagram of a light-emitting substrate according to some embodiments.
  • Figure 1C is a structural diagram of a light-emitting module according to other embodiments.
  • Figure 2A is a structural diagram of substructures and light emitting elements according to some embodiments.
  • Figure 2B is a structural diagram of substructures and light-emitting elements according to other embodiments.
  • Figure 2C is a structural diagram of a light emitting component according to some embodiments.
  • Figure 2D is a structural diagram of a light-emitting component according to other embodiments.
  • Figure 2E is a structural diagram of a light-emitting substrate according to other embodiments.
  • FIG. 2F is a structural diagram of a light-emitting substrate according to further embodiments.
  • Figure 2G is a structural diagram of a light-emitting module according to some embodiments.
  • Figure 3A is a first structural diagram corresponding to the steps of forming a substructure according to some embodiments.
  • Figure 3B is a second structural diagram corresponding to the steps of forming a substructure according to some embodiments.
  • Figure 3C is a third structural diagram of the steps of forming substructures according to some embodiments.
  • Figure 3D is a structural diagram of a substructure according to some embodiments.
  • Figure 4A is a structural diagram of a driving circuit layer, a reflective film and a light emitting element according to some embodiments
  • Figure 4B is a structural diagram of a driving circuit according to some embodiments.
  • Figure 4C is a structural diagram of a driving circuit layer and a reflective film according to some embodiments.
  • Figure 5A is a structural diagram of a light-emitting module according to some embodiments.
  • Figure 5B is a structural diagram of a reflective component according to some embodiments.
  • Figure 5C is a structural diagram of a light-emitting module according to some embodiments.
  • Figure 5D is a structural diagram of a light-emitting module according to some embodiments.
  • Figure 5E is a structural diagram of a light-emitting substrate according to still other embodiments.
  • Figure 5F is a structural diagram of a substructure according to other embodiments.
  • Figure 5G is a structural diagram of a light-emitting module according to some embodiments.
  • Figure 6A is a structural diagram of a light-emitting module according to some embodiments.
  • Figure 6B is an exploded view of a dimming film according to some embodiments.
  • Figure 6C is a structural diagram of the first light emitting element and the first dimming part according to some embodiments.
  • Figure 6D is a structural diagram of an edge region of a quantum dot film according to some embodiments.
  • Figure 6E is a structural diagram of an edge region of a quantum dot film according to other embodiments.
  • Figure 6F is a structural diagram of an edge region of a quantum dot film according to further embodiments.
  • Figure 6G is a structural diagram of a light-emitting module according to some embodiments.
  • Figure 6H is a structural diagram of a light-emitting module according to some embodiments.
  • Figure 7A is a structural diagram of a display device according to some embodiments.
  • Figure 7B is a structural diagram of a display device according to other embodiments.
  • FIG. 7C is a structural diagram of a display device according to further embodiments.
  • FIG. 7D is a structural diagram of a display device according to further embodiments.
  • first and second are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity of indicated technical features. Therefore, features defined as “first” and “second” may explicitly or implicitly include one or more of these features. In the description of the embodiments of the present disclosure, unless otherwise specified, "plurality" means two or more.
  • At least one of A, B and C has the same meaning as “at least one of A, B or C” and includes the following combinations of A, B and C: A only, B only, C only, A and B The combination of A and C, the combination of B and C, and the combination of A, B and C.
  • a and/or B includes the following three combinations: A only, B only, and a combination of A and B.
  • parallel includes absolutely parallel and approximately parallel, and the acceptable deviation range of approximately parallel may be, for example, a deviation within 5°;
  • perpendicular includes absolutely vertical and approximately vertical, and the acceptable deviation range of approximately vertical may also be, for example, Deviation within 5°.
  • equal includes absolute equality and approximate equality, wherein the difference between the two that may be equal within the acceptable deviation range of approximately equal is less than or equal to 5% of either one, for example.
  • Example embodiments are described herein with reference to cross-sectional illustrations and/or plan views that are idealized illustrations.
  • the thickness of layers and regions are exaggerated for clarity. Accordingly, variations from the shapes in the drawings due, for example, to manufacturing techniques and/or tolerances are contemplated.
  • example embodiments should not be construed as limited to the shapes of regions illustrated herein but are to include deviations in shapes that result from, for example, manufacturing. For example, an etched area shown as a rectangle will typically have curved features. Accordingly, the regions shown in the figures are schematic in nature and their shapes are not intended to illustrate the actual shapes of regions of the device and are not intended to limit the scope of the exemplary embodiments.
  • Figure 1A is a structural diagram of a light emitting module according to some embodiments.
  • Figure 1B is a structural diagram of a light-emitting substrate according to some embodiments.
  • FIG. 1C is a structural diagram of a light-emitting module according to other embodiments.
  • an embodiment of the present disclosure provides a light emitting module 200. It can be understood that the light-emitting module 200 is used to implement functions such as backlight or image display.
  • the light-emitting module 200 includes a light-emitting substrate 100.
  • the light-emitting substrate 100 is illustrated below.
  • the light emitting substrate 100 includes a substrate 110 and a plurality of light emitting components 120 .
  • substrate 110 is a rigid substrate. In other examples, substrate 110 is a flexible substrate.
  • the material of the substrate 110 includes any one of plastic, FR-4 grade material, resin, glass, quartz, polyimide, or polymethylmethacrylate (English full name: Polymethyl Methacrylate, English abbreviation PMMA).
  • a plurality of light-emitting components 120 are located on one side of the substrate 110. It can be understood that the light-emitting components 120 are used to emit light. In some examples, a plurality of light emitting components 120 are located on one side surface of the substrate 110 . In other examples, other film layer structures are disposed between the plurality of light-emitting components 120 and the substrate 110 .
  • the substrate 110 is divided into a plurality of light-emitting areas 102 , and one light-emitting component 120 is located in one light-emitting area 102 .
  • a plurality of light emitting areas 102 are arranged in an array to form a display area 104 . It can be understood that the display area 104 can implement functions such as backlight or image display.
  • the number of light-emitting areas 102 may be 512, 1000, 2000, etc.
  • the embodiment of the present disclosure does not further limit the number of light-emitting areas 102.
  • each lighting assembly 120 includes a lighting element 130 .
  • a plurality of light-emitting components 120 are arranged in an array, and the light-emitting elements 130 in different light-emitting components 120 are arranged at intervals. For example, the distance D between any two adjacent light-emitting elements 130 may be the same or different.
  • the light-emitting substrate 100 has a light-emitting side, and the light emitted by the light-emitting element 130 can be emitted through the light-emitting side of the light-emitting substrate 100 .
  • the user observes the light-emitting substrate 100 in a direction perpendicular to or approximately perpendicular to the substrate 110 , that is, the user observes the light-emitting substrate in a direction perpendicular to or approximately perpendicular to the plane where the light-emitting element 130 is located.
  • the light-emitting substrate 100 arranged in the above manner may be called a direct-type light-emitting substrate.
  • the plurality of light-emitting elements 130 can emit light independently. That is, in some examples, multiple light-emitting elements 130 can emit light simultaneously. In other examples, some of the light-emitting elements 130 of the plurality of light-emitting elements 130 may emit light, and the other part of the light-emitting elements 130 may not emit light. When multiple light-emitting elements 130 emit light at the same time, the brightness of each light-emitting element 130 may be the same or different.
  • multiple light emitting elements 130 are used to emit blue light. In other examples, multiple light-emitting elements 130 are used to emit white light. In some examples, some of the light-emitting elements 130 of the plurality of light-emitting elements 130 are used to emit red light, another part of the light-emitting elements 130 are used to emit green light, and yet another part of the light-emitting elements 130 are used to emit blue light.
  • the light-emitting element 130 is a light-emitting diode (English full name: Light Emitting Diode, English abbreviation: LED).
  • the light emitting element 130 can be a traditional LED, a sub-millimeter light emitting diode (English full name: Mini Light Emitting Diode, English abbreviation: Mini LED) or a micro light emitting diode (English full name: Micro Light Emitting Diode, English abbreviation: Micro LED). any of.
  • LEDs that is, the size of the LEDs is greater than or equal to 500 ⁇ m, and the distance between LEDs is greater than 2mm.
  • Mini LED that is, the size of the LED is greater than or equal to 80 ⁇ m and less than 500 ⁇ m.
  • Micro LED that is, the size of LED is less than 50 ⁇ m.
  • the embodiments of the present disclosure do not further limit the size of the light-emitting element 130 and the distance D between the plurality of light-emitting elements 130 .
  • multiple light-emitting elements 130 are arranged in an array, so that the light-emitting substrate 100 can achieve a smaller range of local dimming (English full name: Local Dimming) and improve the backlight and display performance of the light-emitting substrate 100 .
  • the light emitting module 200 further includes a color conversion film 222 .
  • the color conversion film 222 is located on the side of the light-emitting element 130 away from the substrate 110 and is used for color-converting the light emitted by the light-emitting element 130 to obtain red light, green light and blue light. It can be understood that by mixing red light, green light and blue light of different intensities, the light-emitting substrate 100 can display color image information.
  • the plurality of light-emitting elements 130 are used to emit blue light
  • the color conversion film 222 is a quantum dot (English full name: Quantum Dot, English abbreviation: QD) film 2221 or a phosphor organic film material.
  • the quantum dot film 2221 includes red quantum dots and green quantum dots. As shown in the direction of the arrow in Figure 1A, when the blue light emitted by the light-emitting element 130 irradiates the quantum dot film 2221, the red quantum dots can convert the blue light into red light. , the green quantum dots can convert blue light into green light, thereby realizing the color conversion function for the light emitted by the light-emitting element 130 .
  • the phosphor film includes phosphor particles capable of converting blue light into yellow light, thereby achieving a color conversion function for the light emitted by the light-emitting element 130 .
  • the plurality of light-emitting elements 130 are used to emit white light
  • the color conversion film 222 is a color film.
  • Color filters include red filter film, green filter film and blue filter film. As shown in the direction of the arrow in Figure 1A, when the white light emitted by the light-emitting element 130 is irradiated to the color film, the red light, green light and blue light can emit the color film, while the light of other colors is filtered by the color film and cannot be emitted, thereby realizing the control of the light-emitting element. 130 emits light color conversion function.
  • the light-emitting substrate 100 further includes a reflective film 162 , and the reflective film 162 is located on a side of the substrate 110 close to the light-emitting element 130 . It can be understood that the reflective film 162 is used to reflect light, thereby increasing the intensity of light irradiating outside the light-emitting substrate 100 , increasing the brightness of the light-emitting substrate 100 , and reducing the power consumption of the light-emitting substrate 100 .
  • the distance between the reflective film 162 and the film material can be called the light mixing distance (English full name: Optical Distance, English abbreviation: OD) H. That is to say, the light emitted by two adjacent light-emitting elements 130 can be mixed between the reflective film 162 and the film material (for example, the color conversion film 222).
  • the light mixing distance H ranges from 1 mm to 5 mm.
  • the light mixing distance H can be 1mm, 2mm, 2.2mm, 2.5mm, 2.8mm or 3mm, 5mm, etc.
  • a gap is usually left between two adjacent light-emitting areas 102 .
  • some of the light-emitting elements 130 among the plurality of light-emitting elements 130 are controlled to emit light (for example, the light-emitting element 130 a ), and the other part of the light-emitting elements 130 do not emit light.
  • the light emitted by the light-emitting element 130a can not only illuminate the light-emitting area 102a, but also illuminate the light-emitting area 102b through the gap between the two adjacent light-emitting areas 102, so that light appears in the light-emitting area 102b.
  • Halo that is, light leakage occurs in the light-emitting substrate 100 , which affects the light-emitting performance of the light-emitting substrate 100 .
  • the light-emitting area 102a and the light-emitting area 102b are only used to distinguish two different light-emitting areas 102, and the light-emitting area 102 is not further limited.
  • the light-emitting element 130a and the light-emitting element 130b are only used to distinguish the two light-emitting elements 130 located in the light-emitting area 102a and the light-emitting area 102b respectively, and the light-emitting element 130 is not further limited.
  • the light leakage phenomenon of the light-emitting substrate 100 can be improved by increasing the number of light-emitting areas 102 and arranging the light-emitting elements 130 in the reflective bowl.
  • some embodiments of the present disclosure provide a light-emitting substrate 100 including a substrate 110 and a plurality of light-emitting components 120.
  • a plurality of light-emitting components 120 are located on one side of the substrate 110 .
  • At least one light-emitting component 120 includes a light-emitting element 130 and a dimming portion 140 arranged around the light-emitting element 130 .
  • the dimming part 140 includes a plurality of substructures 142, and the plurality of substructures 142 are spaced apart from each other.
  • each light-emitting component 120 includes a light-emitting element 130 and a dimming portion 140 arranged around the light-emitting element 130 .
  • the substrate 110 has exemplified the substrate 110, the positional relationship between the light-emitting element 130 and the substrate 110, and the types of the light-emitting element 130, and will not be described again here.
  • the light modulation unit 140 will be described below with an example.
  • the light modulating part 140 surrounds the light emitting element 130 .
  • the light modulating part 140 includes a plurality of substructures 142 arranged at intervals, that is, the plurality of substructures 142 in the light modulating part 140 surround the light emitting element 130 .
  • the intervals between the plurality of substructures 142 in the dimming part 140 may be the same or different.
  • the plurality of substructures 142 in the dimming part 140 may surround the light emitting element 130 in the form of a circular ring, an elliptical ring, a rectangular ring, a polygonal ring, or other irregular rings.
  • the plurality of substructures 142 in the dimming part 140 may also be in the form of at least two concentric circular rings, at least two concentric elliptical rings, at least two concentric rectangular rings, at least two concentric polygonal rings, or at least two Surrounding the light-emitting element 130 in a concentric irregular ring shape.
  • Figure 2A is a structural diagram of substructures and light emitting elements according to some embodiments.
  • FIG. 2B is a structural diagram of substructures and light-emitting elements according to other embodiments.
  • multiple substructures 142 in the dimming part 140 surround one light emitting element 130 .
  • the plurality of substructures 142 in the light modulating part 140 are spaced apart from each other and arranged in a circular ring shape or a plurality of concentric circular rings surrounding the light emitting element 130 .
  • the number of sub-structures 142 surrounding different light-emitting elements 130 can be Same or different.
  • the light-emitting element 130c and the light-emitting element 130d are only used to distinguish two different light-emitting elements 130, and the light-emitting element 130 is not further limited.
  • the light-emitting element 130 when multiple substructures 142 in the dimming part 140 surround a light-emitting element 130 , the light-emitting element 130 is located at the center of the ring or concentric rings, which improves the structure of the light-emitting component 120 Regularity.
  • Figure 2C is a structural diagram of a light emitting component according to some embodiments.
  • FIG. 2D is a structural diagram of a light-emitting component according to other embodiments.
  • multiple substructures 142 in the dimming part 140 surround the multiple light emitting elements 130 .
  • the multiple light-emitting elements 130 may be connected sequentially in a clockwise or counterclockwise direction to form a triangle.
  • the plurality of substructures 142 in the dimming unit 140 surround the plurality of light-emitting elements 130
  • the plurality of light-emitting elements 130 may be connected in a clockwise or counterclockwise direction to form a rectangle, square, or diamond shape. Or other irregular shapes.
  • Figure 2E is a structural diagram of a light-emitting substrate according to other embodiments.
  • FIG. 2F is a structural diagram of a light-emitting substrate according to further embodiments.
  • the substructure 142 is shaped like a cone or a pyramid. In other examples, as shown in FIG. 2E , the shape of the substructure 142 is a truncated cone or a pyramid. In some examples, as shown in FIG. 2F , the shape of the substructure 142 is hemispherical or semi-elliptical.
  • the shapes of the plurality of substructures 142 in the light modulating part 140 may be the same or different. Embodiments of the present disclosure do not further limit the shape of the substructure 142.
  • FIG. 2G is a structural diagram of a light-emitting module according to further embodiments.
  • the height of any two substructures 142 in the dimming part 140 is smaller than the height of the substructure 142 relatively close to the light-emitting element 130 .
  • the height of substructure 142 of element 130 is smaller than the height of substructure 142 of element 130.
  • the height of any two sub-structures 142 in the dimming part 140 is smaller than the height of the sub-structure 142 relatively far from the light-emitting element 130 .
  • the height of the sub-structures 142 that is, along any direction away from the light-emitting element 130 , the heights of the plurality of sub-structures 142 may gradually increase.
  • the vertices or top surfaces of the plurality of substructures 142 that are arranged in any direction away from the light-emitting element 130 and away from the substrate 110 are sequentially connected. , you can get concave curves or concave surfaces.
  • the light-emitting element 130 is located at the position with the smallest distance from the substrate 110 in each concave curve or concave curved surface, and the substructure 142 with the largest height in the dimming part 140 is located at the position with the largest distance from the substrate 110 in the concave curve or concave curved surface. , and the distance from the light-emitting element 130 is the largest. That is, the concave curve or concave surface is curved toward the direction closer to the substrate 110 (as shown by the dotted line in FIG. 2G ).
  • the plurality of substructures 142 in the dimming part 140 can collimate the light, reduce the amount of light diffusing to the surroundings, and thereby reduce the intensity of light irradiating other light-emitting areas 102 .
  • the dimming part 140 can collimate the light emitted by the light-emitting element 130a. function to reduce the intensity of light irradiated to the light-emitting area 102b, thereby reducing the crosstalk generated between the two light-emitting elements 130 (the light-emitting element 130a and the light-emitting element 130b), weakening the light leakage phenomenon that occurs in the light-emitting substrate 100, and improving the efficiency of the light-emitting substrate 100. Luminous properties.
  • the heights of the plurality of substructures 142 gradually increase in an arithmetic sequence.
  • the light modulating part 140 By providing the light modulating part 140 to improve the light leakage phenomenon of the light-emitting substrate 100, there is no need to increase the number of the light-emitting areas 102 and avoid increasing the wiring difficulty of the circuit structure.
  • the light-emitting substrate 100 with a large number or a small number of light-emitting areas 102 can be provided with a light-modulating part 140 to improve the light and dark areas and light leakage, thereby improving the applicability of the light-modulating part 140.
  • the light modulating part 140 is provided to improve the light leakage phenomenon of the light-emitting substrate 100. There is no need to make structures such as reflective cups, which reduces the cost of the light-emitting substrate 100. The process is simple, and the production efficiency of the light-emitting substrate 100 is improved.
  • the heights of the plurality of substructures 142 in the dimming part 140 are gradually increased in any direction away from the light-emitting element 130, so that starting from the geometric center of the light-emitting element 130, By sequentially connecting the vertices or top surfaces of the plurality of substructures 142 that are arranged in any direction away from the light-emitting element 130 away from the substrate 110, a concave curve or a concave curved surface can be obtained.
  • Such arrangement enables the plurality of substructures 142 in the dimming part 140 to collimate the light emitted from the light-emitting element 130 and reduce the diffusion angle of the light to the surroundings, thereby reducing the intensity of light irradiated to other light-emitting areas 102 .
  • the dimming part 140 can collimate the light emitted by the light-emitting element 130 and reduce the intensity of light irradiated to other light-emitting areas 102, thus reducing both sides.
  • the crosstalk generated between the light-emitting elements 130 weakens the light leakage phenomenon in the light-emitting substrate 100 and improves the light-emitting performance of the light-emitting substrate 100.
  • the light modulating part 140 By providing the light modulating part 140 to improve the light leakage phenomenon of the light-emitting substrate 100, there is no need to increase the number of the light-emitting areas 102 and avoid increasing the wiring difficulty of the circuit structure.
  • the light-emitting substrate 100 with a large number or a small number of light-emitting areas 102 can be provided with a light-modulating part 140 to improve the light and dark areas and light leakage, thereby improving the applicability of the light-modulating part 140.
  • Figure 3A is a first structural diagram corresponding to the steps of forming a substructure according to some embodiments.
  • Figure 3B is a second structural diagram corresponding to the steps of forming a substructure according to some embodiments.
  • Figure 3C is a third structural diagram of steps of forming substructures according to some embodiments.
  • Figure 3D is a structural diagram of a substructure according to some embodiments.
  • the light modulation unit 140 includes a plurality of substructures 142 .
  • the following is an example of a method for preparing the substructure 142 with reference to FIGS. 3A to 3D .
  • a first layer pattern 1421 may be formed on one side of the substrate 110 , and it is understood that the first layer pattern 1421 surrounds the light emitting element 130 .
  • a second layer pattern 1422 is formed on a side surface of the first layer pattern 1421 away from the substrate 110 .
  • the orthographic projection of the second layer pattern 1422 on the substrate 110 falls within the range of the orthographic projection of the first layer pattern 1421 on the substrate 110, so that the first layer pattern 1421 can affect the second layer pattern 1422. to the role of support.
  • a third layer pattern 1423 is formed on a side surface of part of the second layer pattern 1422 away from the first layer pattern 1421 .
  • the orthographic projection of the third layer pattern 1423 on the substrate 110 falls within the range of the orthographic projection of the second layer pattern 1422 on the substrate 110, so that the second layer pattern 1422 can affect the third layer pattern 1423. to the role of support.
  • a portion (two or more) of the substructures 124 of the plurality of substructures 142 includes the first layer pattern 1421, and another portion (two or more) of the substructures 142 includes the first layer pattern 1421 and The second layer pattern 1422 and a portion of the substructures 142 (two or more) include a first layer pattern 1421, a second layer pattern 1422 and a third layer pattern 1423.
  • first layer pattern 1421, the second layer pattern 1422 and the third layer pattern 1423 are only used to distinguish the substructure 142 or a part of the substructure 142 formed in different steps.
  • the shape of substructure 142 is further defined.
  • each substructure 142 is formed layer by layer in a graded manner, so that the heights of the multiple substructures 142 can gradually increase in any direction away from the light emitting element 130 .
  • the substructure 142 when the substructure 142 is formed layer by layer in a step-by-step manner, the substructure 142 can be formed in two layers, three layers, or four layers. Embodiments of the present disclosure do not further limit the number of layers forming the substructure 142.
  • a 3D printing process or a 3D spraying process may be used to form the patterned first layer pattern 1421, the second layer pattern 1422, and the third layer pattern 1423.
  • a 3D printing process or a 3D spraying process may also be used to form the patterned substructures 142 one by one.
  • the substructure 142 may be cured by heating or ultraviolet curing.
  • a glue coating process may also be used to form the substructure 142 .
  • the material forming the substructure 142 may be disposed within the glue coating device 106 .
  • the height of the multiple substructures 142 can be increased in any direction away from the light emitting element 130, simplifying the manufacturing steps of the substructures 142 and reducing production costs.
  • the materials forming the substructure 142 include materials with higher thixotropic properties, such as high thixotropic glue. Materials with higher thixotropic properties can be quickly patterned, simplifying the fabrication process of substructure 142 .
  • any two substructures 142 in the dimming part 140 are relatively close to the substructure 142 of the light-emitting element 130 on the substrate 110
  • the area of the orthographic projection on the substrate 110 is smaller than the area of the orthographic projection of the substructure 142 relatively far away from the light-emitting element 130 on the substrate 110 .
  • the orthographic projection area of any two sub-structures 142 in the dimming part 140, the sub-structure 142 relatively close to the light-emitting element 130 on the substrate 110 is smaller than that of the sub-structure 142 relatively far away from the light-emitting element 130.
  • the area of the orthographic projection of the substructure 142 of the element 130 on the substrate 110 that is, the area of the orthographic projection of the plurality of substructures 142 on the substrate 110 in any direction away from the light-emitting element 130 may gradually increase.
  • the area of the orthographic projection of the plurality of substructures 142 on the substrate 110 gradually increases, which improves the collimation of light by the plurality of substructures 142 in the dimming part 140. As a result, the light leakage phenomenon of the light-emitting substrate 100 is further improved.
  • the orthographic area of substructure 142 on substrate 110 is circular. Along any direction away from the light-emitting element 130, the area of the orthographic projection of the plurality of substructures 142 on the substrate 110 gradually increases, that is, along any direction away from the light-emitting element 130, the area of the plurality of substructures 142 on the substrate 110 The diameter of the orthographic projection gradually increases.
  • Figure 4A is a structural diagram of a driving circuit layer, a reflective film and a light emitting element according to some embodiments.
  • Figure 4B is a structural diagram of a driving circuit according to some embodiments.
  • Figure 4C is a structural diagram of a driving circuit layer and a reflective film according to some embodiments.
  • the light emitting substrate 100 further includes a driving circuit layer 150 and a reflective film 162 .
  • the driving circuit layer 150 is located on one side of the substrate 110 .
  • the reflective film 162 is located on the side of the driving circuit layer 150 away from the substrate 110 .
  • the driving circuit layer 150 is located on one side surface of the substrate 110 .
  • other film layer structures such as a first adhesive layer 156 , are disposed between the driving circuit layer 150 and the substrate 110 to improve the connection between the driving circuit layer 150 and the substrate 110 . Connection reliability.
  • driver circuit layer 150 includes metal traces 152 and conductive pads 154 .
  • the conductive pad 154 is electrically connected to the metal trace 152 .
  • the metal trace 152 is located on one side of the substrate 110
  • the conductive pad 154 is located on the side of the metal trace 152 away from the substrate 110 . It can be understood that the number of conductive pads 154 is multiple.
  • other film layer structures such as a second adhesive layer 158 , are disposed between the metal traces 152 and the conductive pads 154 to improve the electrical conductivity between the metal traces 152 and the conductive pads 154 . Connection reliability.
  • the conductive pad 154 is in contact with the surface of the metal trace 152 on the side away from the substrate 110 .
  • the light emitting substrate 100 further includes a driving circuit Q.
  • the driving circuit Q is located between the substrate 110 and the conductive pad 154 and is electrically connected to the conductive pad 154 so that the driving signal can be transmitted to Conductive pad 154.
  • the conductive pad 154 is electrically connected to the light-emitting element 130, and the driving signal can be transmitted to the light-emitting element 130 through the conductive pad 154, so that the light-emitting element 130 can emit light under the driving action of the driving circuit Q.
  • the light-emitting substrate 100 includes a plurality of gate lines G and a plurality of data lines D located on the substrate 110 , and the driving circuit Q is electrically connected to the gate lines G and the data lines D. Under the control of the gate scanning signal from the gate line G, the driving circuit Q receives the data signal from the data line D and outputs the driving signal.
  • the driving circuit Q includes a thin film transistor (English full name: Thin Film Transistor, English abbreviation: TFT) T.
  • the thin film transistor T includes a driving transistor DT.
  • the driving transistor DT is located between the substrate 110 and the conductive pad 154 and is electrically connected to the conductive pad 154 for outputting a driving signal.
  • the light-emitting substrate 100 also includes a driver chip (English full name: Integrated Circuit, English abbreviation: IC).
  • the driving IC is electrically connected to the driving circuit Q and is used to control the driving circuit Q to provide driving signals to the light emitting element 130 .
  • the driving circuit Q includes a thin film transistor T and a capacitor C.
  • the reflective film 162 is located on one side of the driving circuit layer 150. It can be understood that the reflective film 162 plays a role in reflecting light.
  • the material of the reflective film 162 includes photosensitive white ink or thermosetting white ink.
  • the reflective film 162 is located on a side surface of the driving circuit layer 150 away from the substrate 110 .
  • other film layer structures such as an insulating layer or a flat layer, are disposed between the reflective film 162 and the driving circuit layer 150 to electrically isolate or planarize the contact surface.
  • the reflective film 162 exposes the conductive pad 154 .
  • openings 166 can be formed at corresponding positions of the reflective film 162 through a patterning process, so that the reflective film 162 can expose the conductive pad 154.
  • the area of opening 166 is larger than the area of conductive pad 154 such that conductive pad 154 can be fully exposed.
  • the light-emitting element 130 includes a light-emitting part 132 and a pin 134 , and the pin 134 is electrically connected to the conductive pad 154 . It can be understood that the pin 134 is used to receive a driving signal, so that the light-emitting part 132 can emit light under the action of the driving signal.
  • the pin 134 can be electrically connected to the conductive pad 154.
  • the number of pins 134 is multiple.
  • multiple pins 134 may be electrically connected to multiple conductive pads 154 respectively.
  • the electrical connection between the pin 134 and the conductive pad 154 is achieved by soldering.
  • the light emitting part 132 is located on the side of the reflective film 162 away from the driving circuit layer 150 . It can be understood that the reflective film 162 plays a role in reflecting light.
  • the light-emitting part 132 is located on the side of the reflective film 162 away from the driving circuit layer 150 , so that part of the light emitted by the light-emitting part 132 can illuminate the reflective film 162 , and under the reflection of the reflective film 162 , illuminate in a direction away from the substrate 110 . Outside the light-emitting substrate 100 (as shown by light a in FIG. 4A).
  • the intensity of the light irradiated to the outside of the light-emitting substrate 100 can be increased, thereby increasing the intensity of the light-emitting substrate 100 .
  • the plurality of substructures 142 in the light modulating part 140 are located on the surface of the reflective film 162 away from the driving circuit layer 150 . This arrangement enables a portion of the light emitted by the light-emitting element 130 to illuminate the plurality of substructures 142 .
  • multiple substructures 142 in the dimming part 140 can collimate the light and improve the light leakage phenomenon in the light-emitting substrate 100 .
  • the plurality of substructures 142 in the dimming part 140 are attached to a surface of the reflective film 162 away from the driving circuit layer 150 .
  • FIG. 5A is a structural diagram of a light-emitting module according to further embodiments.
  • Figure 5B is a structural diagram of a reflective component according to some embodiments.
  • FIG. 5C is a structural diagram of a light-emitting module according to further embodiments.
  • FIG. 5D is a structural diagram of a light-emitting module according to further embodiments.
  • the light-emitting substrate 100 includes a driving circuit layer 150 and a reflective film 162 , and the reflective film 162 is located on a side of the driving circuit layer 150 away from the substrate 110 .
  • the light-emitting substrate 100 includes a driving circuit layer 150 and a reflective component 170 .
  • the driving circuit layer 150 is located on one side of the substrate 110 .
  • the driving circuit layer 150 includes metal traces 152 and conductive pads 154.
  • the conductive pads 154 are electrically connected to the metal traces 152. It can be understood that the driving circuit layer 150 has been exemplified in the above embodiments of the present disclosure and will not be described again here.
  • the light-emitting element 130 includes a light-emitting part 132 and a pin 134. It can be understood that the embodiments of the present disclosure have exemplified the light-emitting element 130 and will not be described again here.
  • the reflective component 170 will be illustrated below with reference to FIGS. 5A to 5D .
  • the reflective component 170 is located on the side of the driving circuit layer 150 away from the substrate 110 .
  • the reflective component 170 is in contact with the surface of the driving circuit layer 150 on the side away from the substrate 110 .
  • other film layer structures are disposed between the reflective component 170 and the driving circuit layer 150 .
  • the reflective component 170 is surrounded by a reflective cavity 172 .
  • the reflective cavity 172 may be a box-shaped structure with a rectangular, circular, polygonal or other irregular shape bottom surface.
  • the inner wall of the reflective component 170 surrounds the reflective cavity 172. It should be noted that in Figures 5A, 5C and 5D, there is a gap between the range shown by the dotted lines (that is, the reflective cavity 172) and the inner wall of the reflective component 170. This is only for the convenience of displaying the reflective cavity 172 and does not affect the reflective cavity. The positional relationship between 172 and the reflective component 170 is further defined.
  • the reflective member 170 has a communication hole 174 .
  • reflective component 170 may have one or more communication holes 174 .
  • the shape of the communication hole 174 may be square or circular.
  • the shapes of the communication holes 174 opened in different reflective components 170 may be the same or different.
  • the light emitting part 132 is located in the reflective cavity 172 , and the pin 134 is electrically connected to the conductive pad 154 through the communication hole 174 .
  • the shape of the communication hole 174 is adapted to the orthographic shape of the light emitting element 130 on the substrate 110 so that the pin 134 can be electrically connected to the conductive pad 154 through the communication hole 174 .
  • the reflective component 170 can play a role in reflecting light.
  • the light-emitting part 132 is located in the reflective cavity 172, so that part of the light emitted by the light-emitting part 132 can illuminate the inner wall of the reflective cavity 172, and under the reflection of the reflective component 170, emit out of the light-emitting substrate 100 in a direction away from the substrate 110 (as shown in the figure) Shown by ray c in 5C). That is, by providing the reflective member 170 , the intensity of light irradiated outside the light-emitting substrate 100 can be increased, thereby increasing the brightness of the light-emitting substrate 100 , improving the utilization rate of light, and reducing the power consumption of the light-emitting substrate 100 .
  • the inner wall of the reflective cavity 172 is coated with reflective material, so that the reflective component 170 can reflect light.
  • the reflective material can be titanium dioxide or silicon dioxide.
  • a plurality of substructures 142 in the light modulating part 140 are disposed in the reflective cavity 172 .
  • the plurality of substructures 142 in the dimming part 140 are located in the reflective cavity 172.
  • reflective component 170 includes bottom wall 176 and side walls 178.
  • the bottom wall 176 has a communication hole 174 .
  • a plurality of substructures 142 in the dimming part 140 are located on the bottom wall 176 .
  • One end of the side wall 178 is connected to the bottom wall 176 , and the other end extends along the direction away from the substrate 110 along the bottom wall 176 .
  • the side wall 178 and the bottom wall 176 form a reflective cavity 172 .
  • the main body of the bottom wall 176 is a plate-like structure with a flat surface.
  • the communication hole 174 is opened on the bottom wall 176 so that the pin 134 of the light emitting element 130 can be electrically connected to the conductive pad 154 through the communication hole 174 .
  • the side wall 178 surrounds the bottom wall 176 so that the side wall 178 and the bottom wall 176 can surround the reflective cavity 172 .
  • the side wall 178 may be an integrally formed structure with the bottom wall 176 to improve the connection reliability between the side wall 178 and the bottom wall 176 .
  • the reflective component 170 is provided to include a bottom wall 176 and a side wall 178, so that the bottom wall 176 and the side wall 178 can be surrounded to form a reflective cavity 172, so that the light irradiating to the side wall 178 and the bottom wall 176 can be illuminated by reflection. to the outside of the light-emitting substrate 100 to increase the brightness of the light-emitting area 102 and reduce the power consumption of the light-emitting substrate 100 .
  • the plurality of substructures 142 in the dimming part 140 are located on the bottom wall 176 , for example, as shown in the light d1 , the light d2 and the light d3 in FIG. 5C , so that part of the light emitted by the light emitting element 130 can illuminate the plurality of substructures 142 .
  • the plurality of substructures 142 in the light modulating part 140 can collimate the light and improve the light leakage phenomenon in the light-emitting substrate 100 .
  • the plurality of substructures 142 in the dimming part 140 are adhered to the bottom wall of the reflective cavity 172 .
  • the reflective component 170 not only can the brightness of the light-emitting substrate 100 be increased, the light utilization rate improved, and the power consumption of the light-emitting substrate 100 reduced, but the light leakage phenomenon of the light-emitting substrate 100 can also be improved, and the luminescence of the light-emitting substrate 100 can be further improved. performance.
  • one light-emitting assembly 120 (including the light-emitting element 130 and the light modulating part 140 ) is located in the reflective cavity 172 formed by one reflective component 170 , that is, The side wall 178 surrounds a light emitting component 120 .
  • Such arrangement enables the side wall 172 to reflect the light emitted by each light-emitting element 130 and reduce the intensity of light irradiated into other reflective cavities 172 , that is, to reduce the intensity of light irradiated into other light-emitting areas 102 , thereby improving the light leakage phenomenon in the light-emitting substrate 100 and further improving the light-emitting performance of the light-emitting substrate 100 .
  • the number of reflective components 170 is one.
  • Multiple light-emitting components 120 are located in the reflective cavity 172 formed by a reflective component 170, that is, the side walls 178 surround the multiple light-emitting components 120, simplifying the light-emitting substrate. 100 structure, reducing the cost of the light-emitting substrate 100.
  • the light-emitting substrate 100 includes a reflective film 162 and a reflective component 170 at the same time, and the reflective film 162 is located between the driving circuit layer 150 and the reflective component 170 .
  • the reflection effect of light is further improved, and the intensity of light irradiated outside the light-emitting substrate 100 is increased, thereby increasing the brightness of the light-emitting substrate 100 and reducing the luminescence.
  • the power consumption of the substrate 100 is reduced.
  • the reflective film 162 has the opening 166 .
  • the area of the opening 166 on the reflective film 162 is the same or approximately the same as the area of the communication hole 174 on the reflective component 170, so that the opening 166 and the communication hole 174 can expose the conductive pad 154, so that the pins 134 of the light emitting element 130 can be electrically connected to the conductive pad 154.
  • the area of the communication hole 174 may be slightly larger than the area of the opening 166 .
  • the angle between the side wall of the communication hole 174 and the surface of the reflective component 170 close to the substrate 110 is between 30° and 90°, which increases the opening area of the communication hole 174 and improves luminescence. Convenience of connection between pins 134 of component 130 and conductive pad 154.
  • the angle between the side wall of the communication hole 174 and the surface of the reflective component 170 close to the substrate 110 may be 45°, 60°, or 75°.
  • side wall 176 is perpendicular to bottom wall 178.
  • the side wall 178 is away from the edge of the bottom wall 176 , and the shape of the orthographic projection on a reference plane parallel to the side wall 178 is a plurality of continuous curves or a plurality of continuous polylines.
  • a light-emitting component 120 (including the light-emitting element 130 and the light modulating part 140) is located in the reflective cavity 172 formed by the reflective component 170, the side wall 178 surrounds the light-emitting component 120.
  • the side wall 178 is set away from the edge of the bottom wall 176.
  • the shape of the orthographic projection on the reference plane parallel to the side wall 178 is multiple continuous curves or multiple continuous polylines, that is, the side wall 178 is away from the bottom wall 176.
  • the end surface of the side is a curved surface or a polyline surface. In this way, as shown in FIG. 5B , the end of the side wall 178 away from the bottom wall 176 has a gap 168 .
  • part of the light emitted by the light-emitting part 132 can be irradiated to the outside of the light-emitting substrate 100 in a direction away from the substrate 110 under the reflection of the side wall 178 and the bottom wall 176 , while the other part of the light can be irradiated to the outside of the light-emitting substrate 100 through the gap 168 .
  • Other light-emitting areas 102 can be irradiated to the outside of the light-emitting substrate 100 in a direction away from the substrate 110 under the reflection of the side wall 178 and the bottom wall 176 , while the other part of the light can be irradiated to the outside of the light-emitting substrate 100 through the gap 168 .
  • Other light-emitting areas 102 can be irradiated to the outside of the light-emitting substrate 100 through the gap 168 .
  • Such an arrangement on the basis of improving the light leakage phenomenon of the light-emitting substrate 100, can increase the brightness at the adjacent positions of the two light-emitting areas 102, improve the brightness between the two adjacent light-emitting elements 130, and weaken the light leakage phenomenon on the light-emitting substrate 100.
  • the bright and dark areas that can be detected by the naked eye improve the uniformity of the light emitting substrate 100 .
  • the side wall 178 is away from the edge of the bottom wall 176 , and the shape of the orthographic projection on a reference plane parallel to the side wall 178 is a continuous plurality of regular curves or a continuous plurality of regular polylines, such as a wave shape. Either jagged or a mixture of wavy and zigzag.
  • the side wall 178 is away from the edge of the bottom wall 176 , and the shape of the orthographic projection on a reference plane parallel to the side wall 178 is a continuous plurality of irregular curves or a continuous plurality of irregular polylines.
  • the shape of the orthographic projection of the side wall 178 on a reference plane parallel to the side wall 178 is a triangle, a rectangle, a semicircle, a semiellipse, or the like. It can be understood that since the edge of the side wall 178 away from the bottom wall 176 is a plurality of continuous curves or a plurality of continuous polylines, the shape of the orthographic projection of the side wall 178 on the reference plane parallel to the side wall 178 is: Approximate triangle, approximately rectangle, approximately semicircle or approximately semiellipse with curved or polygonal edges.
  • the shape of the orthographic projection on the reference plane parallel to the side wall 178 is a zigzag shape.
  • a zigzag structure can be regarded as a Sawtooth 169. It can be understood that a sawtooth portion 169 includes two inclined sides and a bottom edge (that is, the connection line between the two inclined sides).
  • the shape of the orthographic projection of the sawtooth portion 169 on the reference plane parallel to the side wall 178 is a left-right symmetrical triangle, that is, the angles between the two inclined sides of the sawtooth portion 169 and the bottom side are equal. Or approximately equal.
  • the shape of the orthographic projection of the sawtooth portion 169 on the reference plane parallel to the side wall 178 is a left-right asymmetric triangle, that is, the shape between the two inclined sides of the sawtooth portion 169 and the bottom edge. The angles are not equal.
  • the angle between an inclined side and the bottom side of the sawtooth portion 169 ranges from 30° to 60°, such as 45°, 50° or 55°.
  • the angle between the other inclined side of the sawtooth portion 169 and the bottom side ranges from 80° to 90°, such as 82°, 85° or 87°.
  • the length of the bottom edge of the sawtooth portion 169 ranges from 2 mm to 4 mm
  • the height of the sawtooth portion 169 (that is, the distance between the bottom edge of the sawtooth portion 169 and the apex of the sawtooth portion 169 ) ranges from 2 mm to 4 mm.
  • the range is 1mm ⁇ 2mm.
  • the length of the bottom side of the sawtooth portion 169 may be 2.5 mm, 3 mm or 3.5 mm.
  • the height of the sawtooth portion 169 may be 1.2mm, 1.5mm or 1.8mm.
  • the plurality of substructures 142 in the dimming part 140 are located on a straight line in any direction away from the light emitting element 130 .
  • arranging the plurality of substructures 142 in the light-adjusting part 140 in any direction away from the light-emitting element 130 is located on a straight line, which can improve the structural regularity of the light-adjusting part 140, improve the collimation effect of light, and reduce During zone dimming, the intensity of light irradiated in other light-emitting areas 102 is reduced, thereby improving the light leakage phenomenon of the light-emitting substrate 100 and improving the light-emitting performance of the light-emitting substrate 100.
  • the plurality of substructures 142 in the light modulating part 140 are located on a straight line, which improves the structural regularity of the light modulating part 140, facilitates the production and processing of the light modulating part 140, and improves production efficiency.
  • the shape of at least one substructure 142 is one of a cone, a pyramid, a frustum, a prism, and a hemisphere.
  • the shapes of the plurality of substructures 142 in the light modulating part 140 may be the same or different.
  • the shape of at least one substructure 142 is set to be one of a cone, a pyramid, a truncated cone, a prism, and a hemisphere, which meets different usage requirements and improves the applicability of the dimming part 140 .
  • hemispheres examples include hemispherical spheres, semi-ellipsoids and other approximate structures.
  • the height of the plurality of substructures 142 in the dimming part 140 ranges from 250 ⁇ m to 1000 ⁇ m.
  • the height of the multiple substructures 142 is set to a value range of 250 ⁇ m to 1000 ⁇ m, which avoids the height of the substructure 142 being too high (for example, greater than 1000 ⁇ m), thereby avoiding the substructure 142 taking up too much space, which is beneficial to the thinning of the light-emitting substrate 100 .
  • the height of the substructure 142 is too small (for example, less than 250 ⁇ m), which affects the collimation effect of the substructure 142 on light, and the brightness uniformity of the light-emitting substrate 100 is further improved.
  • the heights of the plurality of substructures 142 may range from 300 ⁇ m to 950 ⁇ m, 350 ⁇ m to 900 ⁇ m, 400 ⁇ m to 800 ⁇ m, or 500 ⁇ m to 700 ⁇ m.
  • the height of the substructure 142 may be 300 ⁇ m, 400 ⁇ m, 500 ⁇ m, 600 ⁇ m, or 750 ⁇ m.
  • the absolute value of the height difference between any two adjacent substructures 142 in the dimming part 140 ranges from 200 ⁇ m to 300 ⁇ m.
  • the height of any two sub-structures 142 in the dimming part 140 is smaller than the height of the sub-structure 142 relatively close to the light-emitting element 130. . That is, along any direction away from the light-emitting element 130, the height of the substructure 142 may gradually increase.
  • the absolute value of the height difference between any two adjacent substructures 142 in the light modulating part 140 is set to be in the range of 200 ⁇ m to 300 ⁇ m, thereby avoiding the possibility of any adjacent substructures 142 in the light modulating part 140
  • the height difference between the two substructures 142 is too large or too small, so that the heights of the multiple substructures 142 can slowly increase in any direction away from the light-emitting element 130, thereby improving the regularity of the dimming part 140 and improving the dimming.
  • the part 140 has a collimating effect on light, improves the light leakage phenomenon of the light-emitting substrate 100, and improves the light-emitting performance of the light-emitting substrate 100.
  • the absolute value of the height difference between any two adjacent substructures 142 in the dimming part 140 may be 220 ⁇ m, 250 ⁇ m, 280 ⁇ m, or 290 ⁇ m, etc.
  • the absolute value of the height difference between any two adjacent substructures 142 in the dimming part 140 is the same as the absolute value of the height difference between any other two adjacent substructures 142.
  • the absolute values are equal.
  • the absolute value of the height difference between any two adjacent substructures 142 in the dimming part 140 is the same as the absolute value of the height difference between any other two adjacent substructures 142.
  • the values are equal, so that along any direction away from the light-emitting element 130, the heights of the plurality of substructures 142 can gradually increase in an arithmetic sequence.
  • Such arrangement further improves the structural regularity of the light modulating part 140, thereby improving the light collimating effect of the light modulating part 140, improving the light leakage phenomenon of the light-emitting substrate 100, and improving the light-emitting performance of the light-emitting substrate 100.
  • the absolute value of the height difference between any two adjacent substructures 142 in the dimming part 140 is the same as the absolute value of the height difference between any other two adjacent substructures 142.
  • the values can be equal or approximately equal.
  • the light emitting module 200 generally includes a multi-layer film material.
  • multi-layer film materials are usually compounded, so that the film materials can be thinned and multi-functional, thereby reducing the light mixing distance H, and facilitating the thinning of the light-emitting substrate 100 .
  • FIG. 5E is a structural diagram of a light-emitting substrate according to further embodiments.
  • Figure 5F is a structural diagram of a substructure according to other embodiments.
  • FIG. 5G is a structural diagram of a light-emitting module according to further embodiments.
  • the light emitted by the light-emitting element 130 irradiates outward in a cone shape or approximately a cone shape, so that the brightness between two adjacent light-emitting elements 130 (that is, each light-emitting area 102 The brightness at the edge) is smaller than the brightness at the center of each light-emitting area 102.
  • the light mixing distance H decreases, the brightness difference between the edge and the center of each light-emitting area 102 increases, resulting in uneven brightness of the light-emitting substrate 100 .
  • the brightness at the adjacent position of the two light-emitting areas 102 is smaller than the brightness at the center position of each light-emitting area 102.
  • the brightness (as shown in the P2 area in FIG. 5E ) causes the light-emitting substrate 100 to have light and dark areas that can be detected by the naked eye, affecting the brightness uniformity of the light-emitting substrate 100 and thereby affecting the performance of the light-emitting module 200 .
  • the distance D between two adjacent light-emitting elements 130 can be reduced, the light-emitting angle ⁇ of the light-emitting element 130 can be increased (for example, the light-emitting angle ⁇ can be increased to more than 175°), and the mixture can be increased.
  • the brightness uniformity of the light-emitting substrate 100 can be improved by adjusting the light distance H and arranging a diffusion plate or a uniform light film.
  • the inventor of the present disclosure has found that reducing the distance D between two adjacent light-emitting elements 130 will increase the number of light-emitting elements 130 while the area of the display area 104 remains unchanged, thereby increasing the luminescence. Cost of substrate 100 .
  • Increasing the light-emitting angle ⁇ of the light-emitting element 130 will increase the complexity and difficulty of manufacturing the light-emitting element 130, increase the cost of the light-emitting element 130, and also increase the cost of the light-emitting substrate 100.
  • Increasing the light mixing distance H of the light-emitting substrate 100 will cause the thickness of the light-emitting substrate 100 to increase.
  • the provision of a diffusion plate or a light-homogenizing film will increase the haze of the light-emitting substrate 100 and reduce the light transmittance, thereby reducing the brightness of the light-emitting area 102 and causing an increase in the power consumption of the light-emitting substrate 100 .
  • providing a diffusion plate or a light uniformizing film will also increase the thickness of the light-emitting substrate 100, which is not conducive to thinning the light-emitting substrate 100.
  • the light-emitting substrate 100 further includes diffusion particles 164. Diffusion particles 164 are located within at least one substructure 142 .
  • the plurality of substructures 142 in the light modulating part 140 surround the light emitting element 130 . Therefore, the diffusion particles 164 are arranged in at least one substructure 142, as shown in the direction of the arrow in FIG. 5G. A part of the light directly emitted by the light-emitting element 130 can illuminate the substructure 142 and be absorbed by the diffusion particles 164 in at least one substructure 142. Dispersion, that is, the light can be diffusely reflected under the action of the diffusion particles 164.
  • the scattered light propagates along multiple different directions, thereby increasing the intensity of the light irradiating to the edge of the light-emitting area 102 to a certain extent on the basis of the collimating effect of the multiple substructures 142 on the light, that is, It increases the brightness at adjacent positions of the two light-emitting areas 102, reduces the brightness difference between the edge and the center of the light-emitting area 102, and improves the brightness uniformity of each light-emitting area 102, thereby improving the brightness uniformity of the light-emitting substrate 100.
  • the light and dark areas appearing on the light-emitting substrate 100 are weakened.
  • diffusion particles 164 are disposed within each substructure 142 . Since the plurality of substructures 142 surround the light-emitting element 130, the light emitted by the light-emitting element 130 in various directions can be dispersed, thereby improving the light dispersion effect and increasing the light intensity at adjacent positions of the multiple light-emitting areas 102 arranged in the array. The brightness further weakens the light and dark areas appearing on the light-emitting substrate 100 .
  • diffusion particles 164 By arranging diffusion particles 164 to disperse the light emitted by the light-emitting element 130, the brightness between two adjacent light-emitting areas 102 is increased, and the light and dark areas appearing on the light-emitting substrate 100 are weakened, so that a smaller light mixing distance H can be set. , and there is no need to install film materials such as diffusion plates or uniform light films, which facilitates the thinning of the light-emitting substrate 100 and improves the applicability of the light-emitting substrate 100.
  • the substructure 142 is located between the reflective film 162 and the color conversion film 222 .
  • the diffusion particles 164 are located in at least one substructure 142, so that the diffusion particles 164 are also located between the reflective film 162 and the color conversion film 222. This eliminates the need to provide additional space to accommodate the diffusion particles 164, which further facilitates the thinning of the light-emitting substrate 100.
  • multiple substructures 142 are provided to disperse the light, thereby increasing the brightness between two adjacent light-emitting areas 102 and weakening the light and dark areas appearing on the light-emitting substrate 100. There is no need to increase the number of light-emitting elements 130 or the size of the light-emitting elements 130.
  • the light-emitting angle ⁇ of the light-emitting element 130 reduces the cost of the light-emitting substrate 100.
  • the diffusion particles 164 make full use of the light irradiated between the two adjacent light-emitting areas 102 to weaken the light and dark areas appearing on the light-emitting substrate 100, and have little impact on the brightness of the light-emitting area 102, reducing the brightness of the light-emitting substrate 100. power consumption.
  • the substructure 142 is made of a transparent material or a translucent material, so that light can illuminate the diffusion particles 164 located in the substructure 142 .
  • the light transmittance of the substructure 142 ranges from 50% to 100%.
  • the light transmittance of the substructure may be 60%, 70%, 80% or 90%. It can be understood that the light transmittance of the substructure 142 is the ratio of the intensity of light passing through the substructure 142 to the intensity of light irradiating to the substructure 142 .
  • the material of the substructure 142 includes resin or glue.
  • the material of the diffusion particles 164 includes silicon dioxide or titanium dioxide.
  • the mass ratio of the diffusion particles 164 in multiple substructures 142 (that is, the ratio of the weight of the diffusion particles 164 provided in a substructure 142 to the weight of the substructure 142) may be the same or different.
  • the mass ratio of diffusing particles 164 is 15%.
  • the light-emitting substrate 100 provided by the embodiment of the present disclosure disposes diffusion particles 164 in at least one substructure 142 so that the diffusion particles 164 can disperse the light and achieve better light mixing at a smaller light mixing distance H.
  • the effect is to improve the brightness uniformity of the light-emitting area 102, so that the light-emitting substrate 100 can have higher color contrast and more prominent color display, which is beneficial to the ultra-thin design, high color rendering performance and energy saving of end products (such as mobile phones or computers, etc.) performance.
  • the height of any two sub-structures 142 in the dimming part 140 is smaller than the height of the sub-structure 142 relatively close to the light-emitting element 130. .
  • the area of the orthographic projection of any two sub-structures 142 in the dimming part 140 that is relatively close to the light-emitting element 130 on the substrate 110 is smaller than that of the sub-structure 142 that is relatively far from the light-emitting element 130. The area of the orthographic projection of the substructure 142 on the substrate 110 .
  • the heights of the plurality of substructures 142 in the dimming part 140 may gradually increase, and the area of the orthographic projection of the plurality of substructures 142 on the substrate 110 may also gradually increase. big.
  • the volumes of the plurality of substructures 142 in the light modulating part 140 can gradually increase in any direction away from the light emitting element 130 . It can be understood that the larger the volume of the substructure 142, the more diffusion particles 164 can be accommodated, and the better the light scattering effect will be.
  • Such an arrangement further improves the scattering effect of light irradiated to the edge of the light-emitting area 102, improves the light mixing effect between two adjacent light-emitting elements 130, and increases the brightness of the adjacent positions of the two light-emitting areas 102.
  • the light and dark stripes appearing on the light-emitting substrate 100 are weakened and the brightness uniformity of the light-emitting substrate 100 is improved.
  • the light-emitting substrate 100 has a display area 104 .
  • the brightness of the light-emitting elements 130e close to the edge of the display area 104 is greater than the brightness of the light-emitting elements 130 located in the rest of the display area 104 .
  • setting the brightness of the light-emitting element 130e close to the edge of the display area 104 to be greater than the brightness of the light-emitting elements 130 located at the rest of the display area 104 can increase the intensity of light irradiating the edge of the display area 104, thereby increasing the size of the display area 104
  • the brightness at the edge improves the brightness uniformity of the display area 104, thereby improving the brightness uniformity of the light-emitting substrate 100.
  • the light-emitting area 102e is only used to describe the light-emitting area 102 near the edge of the display area 104
  • the light-emitting element 130e is only used to describe the light-emitting element 130 near the edge of the display area 104. No further details will be given about the light-emitting area 102 and the light-emitting element 130. limited.
  • the current flowing through the light-emitting element 130e can be increased so that the brightness of the light-emitting element 130e can be increased.
  • the light-emitting module 200 provided by the embodiment of the present disclosure includes a light-emitting substrate 100 .
  • the light emitting module 200 further includes at least one lens 210 .
  • At least one lens 210 is located on a side of the plurality of light-emitting components 120 away from the substrate 110 .
  • the lens 210 is provided on the light emitting component 120 . In some examples, the number of lenses 210 is multiple. A lens 210 is provided on a light-emitting component 120 .
  • the number of lenses 210 is one.
  • One lens 210 covers multiple light-emitting components 120 .
  • At least one lens 210 is disposed on a side of the plurality of light-emitting components 120 away from the substrate 110 so that the light emitted by the light-emitting elements 130 can illuminate the lens 210 and be reflected or refracted under the action of the lens 210 .
  • the propagation direction of the light emitted by the light-emitting element 130 can be changed, the brightness between two adjacent light-emitting elements 130 can be improved, the brightness uniformity of each light-emitting area 102 can be improved, and the appearance of the light-emitting substrate 100 can be weakened. of light and dark areas to improve the brightness uniformity of the light-emitting substrate 100, thereby improving the brightness uniformity of the light-emitting module 200.
  • the light-emitting substrate 100 includes the reflective component 170.
  • the positional relationship between the reflective component 170 and the lens 210 is illustrated below.
  • the number of reflective components 170 is multiple, and the number of lenses 210 is also multiple.
  • a light-emitting component 120 (including a light-emitting element 130 and a light modulating part 140 ) is located in a reflective cavity 172 formed by a reflective component 170
  • a lens 210 is also located in a reflective cavity 172 , that is, the side wall 178 Surrounded by a light emitting component 120 and a lens 210 .
  • Such an arrangement allows the light reflected by the reflective component 170 to illuminate the lens 210 and pass through the lens 210 to the outside of the light-emitting module 200, further reducing the crosstalk between two adjacent light-emitting areas 102 and improving the efficiency of the light-emitting module 200. brightness.
  • the number of reflective components 170 is multiple, and the number of lenses 210 is one.
  • a plurality of light-emitting assemblies 120 are located in a reflective cavity 172 formed by a reflective component 170.
  • the surface of the lens 210 close to the substrate 110 has a plurality of third grooves, and the side walls 178 of each reflective component 170 are embedded in the third grooves, so that the lens 210 can be covered with multiple reflective components 170 and multiple light emitting components.
  • Component 120 is
  • the number of the reflective component 170 is one, and the number of the lens 210 is also one.
  • a plurality of light-emitting assemblies 120 are located in a reflective cavity 172 formed by a reflective component 170.
  • the lens 210 is also located in a reflective cavity 172 formed by a reflective component 170 and is covered by a plurality of light-emitting components 120 .
  • the number of reflective components 170 is one, and the number of lenses 210 is multiple.
  • a plurality of light-emitting assemblies 120 (including light-emitting elements 130 and dimming parts 140) are located in a reflective cavity 172 formed by a reflective component 170.
  • a plurality of lenses 210 are also located in a reflective cavity 172 formed by a reflective component 170 , and one lens 210 is covered with a light-emitting component 120 .
  • a limited hole 146 is opened on the bottom wall 176 of the reflective component 170 .
  • the lens 210 has a limiting post, which can pass through the limiting hole 146 and be connected to the driving circuit layer 150 or the substrate 110 to limit the lens 210 and prevent the lens 210 from being deflected relative to the light-emitting component 120. move to improve the reliability of the light emitting module 200.
  • the number of limiting holes 146 is multiple, and the number of limiting posts is the same as the number of limiting holes 146 .
  • the number of limiting holes 146 may be 2, 3, 4, etc.
  • bottom wall 176 is shaped like a square. The distance between the limiting hole 146 and the bottom wall 176 is one sixth of the side length of the bottom wall 176 .
  • FIG. 6A is a structural diagram of a light-emitting module according to further embodiments.
  • At least one lens 210 is configured to have at least one first groove 212 on a surface proximate the substrate 110 . At least part of at least one substructure 142 in the dimming part 140 is embedded in the first groove 212 .
  • first groove 212 is opened in a direction from the substrate 110 to the lens 210 .
  • the depths L1 of the multiple first grooves 212 may be the same or different.
  • the widths L2 of the plurality of first grooves 212 may be the same or different.
  • the shape of the first groove 212 may be a cuboid, a cylinder, a cone or other irregular shapes.
  • the shapes of the multiple first grooves 212 may be the same or different.
  • At least part of a substructure 142 of the dimming portion 140 is embedded in a first groove 212 .
  • At least part of a portion (two or more) of the plurality of substructures 142 in the dimming part 140 is embedded in a first groove 212 .
  • the depth L1 of the first groove 212 is greater than the height of the substructure 142 embedded in the first groove 212 , so that the substructure 142 can be completely embedded in the first groove 212 Inside.
  • the light-emitting module 200 including the reflective component 170 there may be a gap between the lens 210 and the reflective component 170 so that the substructure 142 can be partially embedded in the first groove 212 .
  • the light-emitting element 130 when part of the light emitted by the light-emitting element 130 irradiates into the first groove 212 , it can be scattered by the substructure 142 .
  • the scattered light propagates in multiple different directions, improving the brightness between two adjacent light-emitting elements 130, improving the brightness uniformity of each light-emitting area 102, weakening the light and dark areas appearing on the light-emitting substrate 100, and improving luminescence.
  • the brightness uniformity of the substrate 100 is improved, thereby improving the brightness uniformity of the light emitting module 200 .
  • it can also collimate the light and improve the light leakage phenomenon of the light-emitting module 200.
  • At least part of at least one substructure 142 is disposed to be embedded in the first groove 212.
  • the first groove 212 can accommodate the substructure 142, thereby eliminating the need to provide additional accommodation space and facilitating the thinning of the light emitting module 200.
  • the first groove 212 can protect at least part of the at least one substructure 142 and improve the reliability of the light emitting module 200 .
  • At least one first groove 212 is an annular groove.
  • the orthographic projection of the annular groove on the substrate 110 surrounds the orthographic projection of the light emitting element 130 on the substrate 110 .
  • the shape of the first groove 212 may be a circular ring, a rectangular ring or other irregular ring shapes.
  • the orthographic projection of the annular groove on the substrate 110 surrounds the orthographic projection of the light-emitting element 130 on the substrate 110, so that the light emitted by the light-emitting element 130 in all directions can illuminate the annular groove and be embedded in the annular groove.
  • the substructures 142 are broken up to further improve the brightness uniformity of the light emitting module 200 .
  • the orthographic projection of the annular groove on the substrate 110 is arranged to surround the orthographic projection of the light-emitting element 130 on the substrate 110 so that at least part of the plurality of substructures 142 surrounding the light-emitting element 130 can be embedded in the annular groove, which is beneficial to the light-emitting module. 200 thinning.
  • the orthographic projection of the light-emitting element 130 on the substrate 110 is located at the center of the orthographic projection of the annular groove on the substrate 110 .
  • the number of first grooves 212 is multiple.
  • the multiple substructures 142 embedded in the same first groove 212 have the same height.
  • the orthographic projection area of the multiple substructures 142 embedded in the same first groove 212 on the substrate 110 is the same.
  • first grooves 212 when the number of first grooves 212 is multiple, a part (two or more) of the plurality of substructures 142 in the dimming part 140 is embedded in one first groove 212, and another part ( Two or more) are embedded in another first groove 212, and another part (two or more) are embedded in yet another first groove 212.
  • two or more substructures 142 are embedded in each first groove 212 to further improve the light dispersion effect, thereby improving the brightness uniformity of the light emitting module 200 .
  • the structural regularity of the light modulating part 140 can be improved, thereby improving the collimation effect of light and improving the light leakage phenomenon of the light-emitting module 200 .
  • the number of first grooves 212 is multiple. Along any direction away from the light-emitting element 130, for any two first grooves 212, the depth L1 of the first groove 212 relatively close to the light-emitting element 130 is smaller than the depth L1 of the first groove 212 relatively far from the light-emitting element 130. And/or, along any direction away from the light-emitting element 130, the width L2 of any two first grooves 212, the first groove 212 relatively close to the light-emitting element 130, is smaller than the width L2 of the first groove 212 relatively far from the light-emitting element 130. The width of L2.
  • the depth L1 of any two first grooves 212, the first groove 212 relatively close to the light-emitting element 130 is smaller than the depth L1 of the first groove 212 relatively far away from the light-emitting element 130.
  • the depth L1 that is, the depth L1 of the plurality of first grooves 212 gradually increases along any direction away from the light-emitting element 130 .
  • the width L2 of the first groove 212 relatively close to the light-emitting element 130 is smaller than the width L2 of the first groove 212 relatively far from the light-emitting element 130. That is, along any direction away from the light-emitting element 130, the width L2 of the plurality of first grooves 212 gradually increases.
  • the height of any two sub-structures 142 in the dimming part 140 is smaller than the height of the sub-structure 142 relatively far from the light-emitting element 130 .
  • the height of substructure 142 along any direction away from the light-emitting element 130, the area of the orthographic projection of any two sub-structures 142 in the dimming part 140 that is relatively close to the light-emitting element 130 on the substrate 110 is smaller than that of the sub-structure 142 that is relatively far from the light-emitting element 130.
  • the area of the orthographic projection of the substructure 142 on the substrate 110 is smaller than that of the sub-structure 142 that is relatively far from the light-emitting element 130 .
  • the heights of the plurality of substructures 142 in the dimming part 140 may gradually increase, and the area of the orthographic projection of the plurality of substructures 142 on the substrate 110 may also gradually increase. big.
  • the depth L1 of the plurality of first grooves 212 gradually increases, and/or the width L2 of the plurality of first grooves 212 gradually increases, so that each first groove 212 can accommodate each substructure 142, preventing the substructure 142 from being embedded in the first groove 212, which is beneficial to the thinning of the light emitting module 200.
  • At least one lens 210 is configured to have a recess 216 on a surface remote from the substrate 110 .
  • the orthographic projection of the light-emitting element 130 on the substrate 110 at least partially overlaps the orthographic projection of the recessed portion 216 on the substrate 110 .
  • the orthographic projection of the light-emitting element 130 on the substrate 110 at least partially overlaps with the orthographic projection of the recess 216 on the substrate 110.
  • the light emitted by the light-emitting element 130 illuminates the recess.
  • part of the light can pass through the wall 2161 of the recessed part 216 and be irradiated outside the lens 210 (as shown by the light e in FIG. 6A), and the other part of the light can be reflected by the wall 2161 of the recessed part 216 and be irradiated to the outside of the lens 210.
  • First groove 212 (shown by rays f and g in Figure 6A).
  • part of the light irradiating to the first groove 212 can pass through the first groove 212 and be scattered by the substructure 142 embedded in the first groove 212 (shown as light g in FIG. 6A).
  • Such an arrangement enables light to illuminate at least one substructure 142 under the reflection of the recessed portion 216, thereby increasing the intensity of light irradiating to at least one substructure 142, improving the light dispersion effect of at least one substructure 142, and further
  • the light and dark areas appearing on the light-emitting module 200 are weakened and the brightness uniformity of the light-emitting module 200 is improved.
  • Another part of the light irradiated to the first groove 212 can be irradiated outside the lens 210 under the reflection of the wall surface of the first groove 212 (shown as light f in Figure 6A), further improving the irradiation to the two light-emitting areas. 102 the light intensity at adjacent positions, thereby improving the brightness uniformity of the light-emitting substrate 100 .
  • depression 216 is conical in shape.
  • the orthographic projection of the light-emitting element 130 on the substrate 110 falls within the range of the orthographic projection of the recessed portion 216 on the substrate 110 .
  • the lens 210 further includes a filling portion 218 that is filled in the recessed portion 216 so that the surface of the lens 210 on the side away from the substrate 110 is a smooth plane. It can be understood that the filling part 218 is made of transparent material. The light refractive index of the filling portion 218 is different from the light refractive index of the lens 210 .
  • the light refractive index of the filling part 218 is greater than the light refractive index of the lens 210, so that the light rays irradiating the wall surface 2161 of the recessed part 216 (that is, the light rays irradiating the contact surface of the recessed part 216 and the filling part 218), It is easier for the light-transmitting recessed portion 216 and the filled portion 218 to be illuminated outside the lens 210, thereby improving the brightness of the light-emitting area 102.
  • the light refractive index of the filling part 218 is smaller than the light refractive index of the lens 210, so that the light rays irradiating the wall surface 2161 of the recessed part 216 (that is, the light rays irradiating the contact surface of the recessed part 216 and the filling part 218) , total reflection can occur on the wall surface 2161 of the recessed portion 216, thereby increasing the intensity of light irradiating the first groove 212, that is, increasing the intensity of light irradiating the substructure 142, and improving the penetration of light by the diffusion particles 164.
  • the dispersion effect further improves the brightness between two adjacent light-emitting elements 130, thereby improving the brightness uniformity of the light-emitting module 200.
  • At least one lens 210 is configured to further have a second groove 214 on a surface adjacent to the substrate 110 .
  • the light-emitting element 130 includes the light-emitting part 132 . At least part of the light emitting part 132 is located in the second groove 214 .
  • the direction from the substrate 110 to the lens 210 is opened to collect light.
  • At least part of the light-emitting part 132 is located in the second groove 214, so that the light emitted by the light-emitting part 132 can irradiate the inner wall of the second groove 214, be refracted and gathered on the inner wall of the second groove 214, and reduce the irradiation to
  • the light intensity of other light-emitting areas 102 is thereby reduced, thereby reducing crosstalk between two adjacent light-emitting areas 102, increasing the brightness of the light-emitting area 102, and reducing the power consumption of the light-emitting module 200.
  • arranging at least part of the light-emitting part 132 in the second groove 214 eliminates the need for additional space to accommodate the light-emitting part 132, which facilitates the thinning of the light-emitting module 200 and can also protect the light-emitting part 132 and improve the efficiency of the light-emitting module. 200 reliability.
  • the light emitting module 200 further includes a dimming film 219 .
  • the dimming film 219 is located on the side of the lens 210 away from the substrate 110 , and the orthographic projection of the dimming film 219 on the substrate 110 at least partially overlaps with the orthographic projection of the recessed portion 216 on the substrate 110 .
  • the orthographic projection of the dimming film 219 on the substrate 110 covers the orthographic projection of the recessed portion 216 on the substrate 110 .
  • the dimming film 219 is attached to the surface of the lens 210 on the side away from the substrate 110 .
  • the number of lenses 210 is multiple, and the number of dimming films 219 is also multiple.
  • One dimming film 219 is located on a side of one lens 210 away from the substrate 110 .
  • Figure 6B is an exploded view of a light-switching film according to some embodiments.
  • the dimming film 219 includes a first dimming film 2191 , a second dimming film 2192 , a third dimming film 2193 and a fourth dimming film 2194 .
  • the first light-modulating film 2191 is a transparent film, and the first light-modulating film 2191 is attached to a surface of the lens 210 away from the substrate 110 .
  • the second dimming film 2192, the third dimming film 2193 and the fourth dimming film 2194 are stacked on the side of the first dimming film 2191 away from the lens 210 by printing or evaporation.
  • the light transmittances of the second dimming film 2192, the third dimming film 2193, and the fourth dimming film 2194 may be the same or different.
  • the orthographic projection of the second dimming film 2192 on the substrate 110 falls within the range of the orthographic projection of the first dimming film 2191 on the substrate 110 .
  • the orthographic projection of the third light modulating film 2193 on the substrate 110 falls within the range of the orthographic projection of the second light modulating film 2192 on the substrate 110 .
  • the orthographic projection of the fourth light modulating film 2194 on the substrate 110 falls within the range of the orthographic projection of the third light modulating film 2193 on the substrate 110 .
  • the centers of the first dimming film 2191, the second dimming film 2192, the third dimming film 2193 and the fourth dimming film 2194 coincide with each other.
  • the second light-modulating film 2192 and the fourth light-modulating film 2194 have light-transmitting holes 2195 . It can be understood that since the first dimming film 2191, the second dimming film 2192, the third dimming film 2193 and the fourth dimming film 2194 are stacked, the position and size of the light-transmitting hole 2195 can be adjusted so that The light-switching film 219 has different light transmittances at different positions, thereby improving the brightness uniformity of the light-emitting area 102 .
  • the light-transmitting hole 2195 is circular. In other examples, the light-transmitting hole 2195 may also be in the shape of a regular polygon, a regular star-shaped polygon, etc. The embodiment of the present disclosure does not further limit the shape of the light-transmitting hole 2195.
  • the light-transmitting hole 2195 opened on the fourth light-modulating film 2194 is located at the center of the fourth light-modulating film 2194 .
  • the first dimming film 2191 is rectangular
  • the third dimming film 2193 and the fourth dimming film 2194 are both star-shaped and hexagonal and similar to each other, but the third The area of the dimming film 2193 is equal to that of the fourth dimming film 2194.
  • the second light-adjustable film 2192 includes an annular structure 21921 composed of two coaxially arranged outlines of a right star-shaped triadagon, that is, the light-transmitting hole 2195 of the second light-adjustable film 2192 is a regular star-shaped triadagon. And a plurality of discretely arranged circular patterns 21922 and 21923 surrounding the annular structure 21921.
  • the area of the circular pattern 21922 relatively close to the center of the second light-adjusting film 2192 is smaller than that of the circular pattern 21922 relatively far away from the second light-adjusting film 2192.
  • the areas of the plurality of light-transmitting holes 2195 opened on the second light modulating film 2192 increase sequentially.
  • the second dimming film 2192 includes a first sub-film and a second sub-film.
  • the first sub-brane is round or nearly circular, and the second sub-brane is eight-pointed star-shaped.
  • the first sub-film is bonded to the side surface of the first dimming film 2191 away from the lens 210
  • the second sub-film is bonded to the side surface of the first sub-film away from the first dimming film 2191 .
  • the light-transmitting hole 2195 opened on the second light-modulating film 2192 penetrates the first sub-film, or penetrates the first sub-film and the second sub-film.
  • the third light-adjusting film 2193 may also be provided with light-transmitting holes 2195 so that the light-adjusting film 219 can meet different light transmittance requirements.
  • the first dimming film 2191, the second dimming film 2192, the third dimming film 2193, and the fourth dimming film 2194 may also have other regular or irregular shapes.
  • the thickness of the first dimming film 2191 ranges from 2.0 ⁇ m to 10 ⁇ m.
  • the thickness of the first dimming film 2191 may be 3 ⁇ m, 5 ⁇ m, 7 ⁇ m, 8 ⁇ m, or 9 ⁇ m.
  • the material of the first dimming film 2191 includes polyethylene terephthalate (English full name: Polyethylene terephthalate, English abbreviation: PET).
  • the thickness of the second dimming film 2192 ranges from 2.0 ⁇ m to 10 ⁇ m.
  • the thickness of the second light modulating film 2192 may be 3 ⁇ m, 5 ⁇ m, 7 ⁇ m, 8 ⁇ m, or 9 ⁇ m.
  • the thickness of the third dimming film 2193 ranges from 2.0 ⁇ m to 10 ⁇ m.
  • the thickness of the third dimming film 2193 may be 3 ⁇ m, 5 ⁇ m, 7 ⁇ m, 8 ⁇ m, or 9 ⁇ m.
  • the thickness of the fourth dimming film 2194 ranges from 2.0 ⁇ m to 10 ⁇ m.
  • the thickness of the fourth dimming film 2194 may be 3 ⁇ m, 5 ⁇ m, 7 ⁇ m, 8 ⁇ m, or 9 ⁇ m.
  • the thicknesses of the first dimming film 2191, the second dimming film 2192, the third dimming film 2193 and the fourth dimming film 2194 may be the same or different.
  • the material of the second dimming film 2192, the third dimming film 2193 and the fourth dimming film 2194 includes resin, for example, obtained by punching a polyurethane resin sheet (for example, medieval punching process, etc.) ;
  • resin for example, obtained by punching a polyurethane resin sheet (for example, medieval punching process, etc.)
  • other synthetic resins such as nylon can also be used
  • a resin material with a specific pattern can be directly formed on the lens 210 through printing, evaporation, etc.
  • the dimming film 219 may not include the first dimming film 2191 , but only include the second dimming film 2192 , the third dimming film 2193 and the fourth dimming film 2194 .
  • the second dimming film 2192 , the third dimming film 2193 and the fourth dimming film 2194 are stacked on the surface of the lens 210 away from the substrate 110 .
  • light emitting element 130 is configured to emit white light.
  • the light-emitting element 130 includes the light-emitting part 132 .
  • phosphor can be provided on the light-emitting surface of the light-emitting part 132, and the monochromatic light emitted by the light-emitting part 132 is modulated by the phosphor, and the modulated light is mixed with the monochromatic light emitted by the light-emitting part 132, so that the light emits light.
  • Element 130 is capable of emitting white light.
  • yellow phosphor may be provided on the light-emitting surface of the light-emitting part 132 .
  • the yellow phosphor can emit yellow light under illumination, and the yellow light is mixed with the blue light emitted by the light-emitting part 132, so that the light-emitting element 130 can emit white light.
  • red phosphor and green phosphor can also be provided on the light-emitting surface of the light-emitting part 132.
  • the red phosphor can emit red light under illumination
  • the green phosphor can emit green light under illumination.
  • mixing red light and green light can produce yellow light.
  • the yellow light is mixed with the blue light emitted by the light-emitting part 132, so that the light-emitting element 130 can emit white light.
  • the light-emitting element 130 includes a first sub-light-emitting element, a second sub-light-emitting element and a third sub-light-emitting element.
  • the first sub-light-emitting element is configured to emit red light
  • the second sub-light-emitting element is configured to emit green light
  • the third sub-light-emitting element is configured to emit blue light.
  • the number of the first sub-light-emitting element, the second sub-light-emitting element and the third sub-light-emitting element may be the same or different.
  • the light-emitting element 130 is configured to emit white light, and the white light can be filtered to obtain light of different colors, that is, the light-emitting module 200 can emit light of different colors, thereby improving the applicability of the light-emitting module 200 sex.
  • the light-emitting element 130 is configured to emit white light. In other embodiments, the light emitting element 130 is configured to emit monochromatic light. For example, the monochromatic light may be blue light.
  • FIG. 6C is a structural diagram of the first light emitting element and the first dimming part according to some embodiments.
  • the light emitting module 200 further includes a color conversion film 222 .
  • the color conversion film 222 is located on the side of at least one lens 210 away from the light emitting element 130 .
  • the color conversion film 222 is located on the side of at least one lens 210 away from the light-emitting element 130, so that the monochromatic light emitted by the light-emitting element 130 can illuminate the color conversion film 222 and be converted into red light and green light by the color conversion film 222. light and blue light. It can be understood that by mixing red light, green light and blue light of different intensities, colored light can be obtained, so that the light-emitting module 200 can display a colored image.
  • the color conversion film 222 is a quantum dot film 2221.
  • light emitting element 130 includes first light emitting element 136.
  • the orthographic projection of the first light-emitting element 136 on the substrate 110 is close to the edge of the orthographic projection of the quantum dot film 2221 on the substrate 110 .
  • the dimming part 140 includes a first dimming part 144 surrounding the first light-emitting element 136 .
  • the first light-emitting element 136 is only used to describe the orthographic projection on the substrate 110, and the light-emitting element 130 close to the edge of the orthographic projection of the quantum dot film 2221 on the substrate 110 is not correct.
  • the light emitting element 130 is further defined.
  • the first dimming part 144 is only used to describe the dimming part 140 surrounding the first light-emitting element 136, and the dimming part 140 is not further limited.
  • Figure 6D is a structural diagram of an edge region of a quantum dot film according to some embodiments.
  • Figure 6E is a structural diagram of an edge region of a quantum dot film according to other embodiments.
  • FIG. 6F is a structural diagram of an edge region of a quantum dot film according to further embodiments.
  • an orthographic projection of the quantum dot film 2221 on the substrate 110 has an edge region Q1 and a central region Q2, with the edge region Q1 surrounding the central region Q2. There is a dividing line m between the edge area Q1 and the center area Q2, and the orthographic projection of the quantum dot film 2221 on the substrate 110 has an edge n.
  • the orthographic projection of the first light-emitting element 136 on the substrate 110 is close to the edge of the orthographic projection of the quantum dot film 2221 on the substrate 110 , that is, the orthogonal projection of the first light-emitting element 136 on the substrate 110 The projection falls into the edge region Q1 of the orthographic projection of the quantum dot film 2221 on the substrate 110 .
  • the edge of the quantum dot film 2221 is prone to failure due to oxidation and other reasons, resulting in the inability to convert the blue light emitted by the light-emitting element 130 into red light and green light at the edge, so that blue light is prone to appear at the edge of the light-emitting module 200
  • the light leakage phenomenon affects the light-emitting performance of the light-emitting module 200.
  • the light-emitting module 200 also includes fluorescent particles 224.
  • the fluorescent particles 224 are located in at least one substructure 142 of the first dimming part 144 .
  • the fluorescent particles 224 are configured to modulate the light irradiated to the fluorescent particles 224, so that the modulated light and the unmodulated light emitted by the light-emitting element 130 are mixed into white light.
  • the fluorescent particles 224 are configured to modulate the light irradiated to the fluorescent particles 224, that is, the fluorescent particles 224 can emit light when illuminated by light. Due to the orthographic projection of the first light-emitting element 136 on the substrate 110, close to the edge of the orthographic projection of the quantum dot film 2221 on the substrate 110 (that is, the orthographic projection of the first light-emitting element 136 on the substrate 110, falls Entering the edge area Q1) of the orthographic projection of the quantum dot film 2221 on the substrate 110, the fluorescent particles 224 are disposed in at least one substructure 142 of the first dimming part 144, so that the fluorescent particles 224 can affect the light emitting element 130 The emitted monochromatic light is modulated.
  • the modulated light is mixed with the monochromatic light emitted by the light-emitting element 130 to form white light, which improves the blue light leakage phenomenon at the edge of the light-emitting module 200 and improves the light-emitting performance of the light-emitting module 200 .
  • the distance between the dividing line m between the edge area Q1 and the center area Q2 and the edge n of the orthographic projection of the quantum dot film 2221 on the substrate 110 is less than or equal to 2 mm. .
  • the width of the quantum dot film 2221 is L3 and the length is L4.
  • the width L5 of the central area Q2 of the orthographic projection of the quantum dot film 2221 on the substrate 110 is smaller than L3, and the length L6 is smaller than L4.
  • the geometric center of the central area Q2 is almost coaxial with the geometric center of the quantum dot film 2221, so that the distance between the dividing line m and the edge n in the direction perpendicular to the extension of the corresponding edge (shown as L7 in Figure 6D) is basically the same, for example All are about 2mm.
  • fluorescent particles 224 are disposed in each of the plurality of substructures 142 in the first dimming part 144 .
  • the mass ratio of the fluorescent particles 224 in multiple substructures 142 (that is, the ratio of the weight of the fluorescent particles 224 provided in a substructure 142 to the weight of the substructure 142) may be the same or different.
  • the mass ratio of the fluorescent particles 224 is 5%.
  • the light transmittance of the substructure 142 ranges from 50% to 100%.
  • the light transmittance of the substructure 142 ranges from 80% to 100%.
  • Such an arrangement can increase the intensity of light irradiated into the substructure 142, thereby increasing the intensity of light irradiated into the fluorescent particles 224, improving the modulation effect of the fluorescent particles 224 on the light emitted by the light-emitting element 130, and further improving the edge of the light-emitting module 200.
  • the blue light leakage phenomenon that occurs at different locations is improved to improve the luminous performance of the luminescent module 200 .
  • the height of any two sub-structures 142 in the dimming part 140 is smaller than that of the sub-structure 142 that is relatively close to the light-emitting element 130 .
  • the height of substructure 142 along any direction away from the light-emitting element 130, the area of the orthographic projection of any two sub-structures 142 in the dimming part 140 that is relatively close to the light-emitting element 130 on the substrate 110 is smaller than that of the sub-structure 142 that is relatively far from the light-emitting element 130.
  • the area of the orthographic projection of the substructure 142 on the substrate 110 is smaller than that of the sub-structure 142 that is relatively far from the light-emitting element 130 .
  • the heights of the plurality of substructures 142 in the light modulating part 140 may gradually increase, and the orthogonal projection of the plurality of substructures 142 in the light modulating part 140 on the substrate 110 The area can also be gradually increased.
  • the heights of the plurality of substructures 142 in the first dimming part 144 may gradually increase, or may be the same or approximately the same.
  • the area of the orthographic projection of the plurality of substructures 142 in the first dimming part 144 on the substrate 110 may gradually increase, or may be the same or approximately the same.
  • the area of orthographic projection of the plurality of substructures 142 in the first dimming part 144 on the substrate 110 is the same, and the multiple substructures 142 in the first dimming part 144 have the same area.
  • the substructure 142 gradually increases in height.
  • the mass ratio of the fluorescent particles 224 in the plurality of substructures 142 is the same. With this arrangement, there is no need to adjust the mass ratio of the fluorescent particles 224 in different substructures 142, which simplifies the preparation process.
  • the area of the orthographic projection of the plurality of substructures 142 in the first dimming part 144 on the substrate 110 gradually increases, and the first dimming part 144 Multiple substructures 142 in have the same height.
  • the mass ratio of the fluorescent particles 224 in the plurality of substructures 142 is the same. With this arrangement, there is also no need to adjust the mass ratio of the fluorescent particles 224 in different substructures 142, which simplifies the preparation process.
  • the area of orthographic projection of the plurality of substructures 142 in the first dimming part 144 on the substrate 110 is the same.
  • the plurality of substructures 142 gradually increase in height.
  • the mass ratio of the fluorescent particles 224 in each substructure 142 is different.
  • the mass ratio of the fluorescent particles 224 in the plurality of substructures 142 gradually increases in any direction away from the first light-emitting element 136 to further improve the blue light leakage phenomenon that occurs at the edge of the light-emitting module 200 and improve the luminescence. Luminous performance of module 200.
  • the mass ratio of the fluorescent particles 224 ranges from 5% to 12%.
  • the mass ratio of the fluorescent particles 224 may range from 6% to 10%, 7% to 9%, or 7.5% to 8.5%.
  • the mass ratio of the fluorescent particles 224 may be 5.5%, 6.5%, or 7.5%.
  • the orthographic projection of the light-emitting component 120 located in the light-emitting area 102 on the substrate 110 all falls into the quantum dot film 2221 on the substrate 110 Within the edge area Q1 of the orthographic projection.
  • a plurality of light-emitting areas 102 whose orthographic projection on the substrate 110 falls into the edge area Q1 are arranged in a ring shape.
  • the plurality of light-emitting areas 102 whose orthographic projection on the substrate 110 falls within the edge area Q1 may be arranged in the form of a circular ring, an elliptical ring, a rectangular ring, a polygonal ring, or other irregular rings.
  • the plurality of light-emitting areas 102 whose orthographic projection on the substrate 110 falls into the edge area Q1 is arranged in at least two concentric rings.
  • the plurality of light-emitting areas 102 whose orthographic projection on the substrate 110 falls into the edge area Q1 may be in the form of at least two concentric circular rings, at least two concentric elliptical rings, at least two concentric rectangular rings, at least two concentric rectangular rings, or at least two concentric rectangular rings. Arranged in the manner of a polygonal ring or at least two concentric other irregular rings.
  • each first light-emitting element 136 is located on the lining. Only part of the orthographic projection on the base 110 falls within the edge area Q1. In the first dimming part 144 surrounding the first light-emitting element 136, the orthographic projection of a part of the substructures 142 (two or more) on the substrate 110 falls into the edge area Q1 (called the first substructure), and the orthographic projection of another part of the substructures 142 (two or more) on the substrate 110 falls into the central area Q2 (called the second substructure). As shown in FIG. 6F , that is, the orthographic projection of the light-emitting area 102 on the substrate 110 , part of it falls into the edge area Q1 , and the other part falls into the center area Q2 .
  • the fluorescent particles 224 can be disposed in at least one first substructure (that is, the substructure 142 whose orthographic projection on the substrate 110 falls into the edge region Q1), but not in the second substructure.
  • Providing fluorescent particles 224 that is, the substructure 142 whose orthographic projection on the substrate 110 falls into the central area Q2) saves the amount of fluorescent particles 224, simplifies the preparation process, and reduces the cost of the light-emitting module 200.
  • the light emitting element 130 is configured to emit blue light and the fluorescent particles 224 include yellow fluorescent particles.
  • the light emitting element 130 is configured to emit blue light, and the fluorescent particles 224 include red fluorescent particles and green fluorescent particles.
  • the fluorescent particles 224 include yellow fluorescent particles, that is, the fluorescent particles 224 can emit yellow light when illuminated by light.
  • the yellow light emitted by the fluorescent particles 224 is mixed with the blue light emitted by the light emitting element 130 to form white light.
  • the fluorescent particles 224 include red fluorescent particles and green fluorescent particles, that is, the fluorescent particles 224 can emit red light and green light when illuminated by light.
  • the red light and green light can be mixed into yellow light, and the yellow light is mixed with the blue light emitted by the light-emitting element 130 to form white light.
  • FIG. 6G is a structural diagram of a light-emitting module according to some embodiments.
  • FIG. 6H is a structural diagram of a light-emitting module according to further embodiments.
  • the light emitting module 200 further includes a brightness enhancement film 226 .
  • the brightness enhancement film 226 is located on the side of the color conversion film 222 away from the at least one lens 210 .
  • the brightness enhancement film 226 functions to increase the brightness of the display area 104, thereby reducing the power consumption of the light emitting module 200.
  • brightness enhancing film 226 includes prisms. When light irradiates the prism, it can be reflected or refracted under the action of the prism, thereby increasing the brightness of the light-emitting module 200 .
  • the brightness enhancement film 226 includes cast polypropylene film (English full name: Cast Polypropylene, English abbreviation: CPP).
  • the light emitting module 200 further includes a packaging panel 228 .
  • the packaging panel 228 is located on the side of the brightness enhancement film 226 away from the color conversion film 222 . It can be understood that the encapsulation panel 228 functions as protection and encapsulation.
  • the packaging panel 228 is made of transparent material, so that light can be irradiated outside the light-emitting module 200 through the packaging panel 228 .
  • the material of the packaging panel 228 includes glass.
  • the light emitting module 200 further includes a plastic frame 202 , and the plastic frame 202 is used to support the packaging panel 228 .
  • the light emitting module 200 further includes a diffusion film.
  • the diffusion film is located between the brightness enhancement film 226 and the packaging panel 228, which plays a role in uniforming light and further improves the brightness uniformity of the light emitting module 200.
  • the light-emitting module 200 also includes a light-diffusing film 204 .
  • the light-diffusing film 204 is located between the lens 210 and the color conversion film 222 to play a role in light uniformity and further improve the light-emitting module 200 . brightness uniformity.
  • FIG. 7A is a structural diagram of a display device according to some embodiments.
  • FIG. 7B is a structural diagram of a display device according to other embodiments.
  • a display device 300 is provided.
  • the display device 300 includes a backlight module 310 and a liquid crystal display panel 320 .
  • the liquid crystal display panel 320 is located on the light emitting side of the backlight module 310 .
  • the backlight module 310 includes the above-mentioned light-emitting substrate 100 .
  • the backlight module 310 includes the light-emitting module 200 as described above.
  • the display device 300 provided by the embodiment of the present disclosure includes the light-emitting substrate 100 as mentioned above, or includes the light-emitting module 200 as mentioned above, and therefore has all the above-mentioned beneficial effects, which will not be described again here.
  • the display device 300 can display dynamic image information, such as videos or game screens, and can also display static image information, such as images or photos.
  • display device 300 may be a mobile phone, wireless device, personal data assistant (PDA), handheld or portable computer, GPS receiver/navigator, camera, MP4 video player, camcorder, game console, Watches, clocks, calculators, television monitors, flat panel displays, computer monitors, automotive displays (e.g., odometer displays, etc.), navigators, cockpit controls and/or displays, camera view displays (e.g., in the rear of the vehicle) displays for visual cameras), electronic photographs, electronic billboards or signs, projectors, packaging and aesthetic structures (e.g. displays for images of a piece of jewelry), etc.
  • PDA personal data assistant
  • the liquid crystal display panel 320 is located on the light emitting side of the backlight module 310 , that is, the light emitted by the backlight module 310 can illuminate the liquid crystal display panel 320 .
  • the liquid crystal display panel 320 includes an array substrate 326 , a liquid crystal layer 324 and an opposite substrate 322 .
  • the array substrate 326 is located on the light exit side of the backlight module 310
  • the liquid crystal layer 324 is located on the side of the array substrate 326 away from the backlight module 310 .
  • the opposite substrate 322 is located on the side of the liquid crystal layer 324 away from the array substrate 326 .
  • the light is emitted through the light exit side of the light-emitting module 200 and illuminates the liquid crystal layer 324 .
  • the intensity of light passing through the liquid crystal layer 324 can be adjusted, thereby adjusting the intensity of light emitted from the liquid crystal display panel 320, so that the display device 300 can achieve color images. display function.
  • FIG. 7C is a structural diagram of a display device according to further embodiments.
  • FIG. 7D is a structural diagram of a display device according to further embodiments.
  • the display device 400 includes a display panel 410 .
  • the display panel 410 includes the light-emitting substrate 100 as described above.
  • the display panel 410 includes the light emitting module 200 as described above.
  • the display device 400 provided by the embodiment of the present disclosure includes the light-emitting substrate 100 as described above or the light-emitting module 200 as described above, and therefore has all the above-mentioned beneficial effects, which will not be described again here.
  • the display device 400 can display dynamic image information, such as videos or game screens, and can also display static image information, such as images or photos.
  • display device 400 may be a mobile phone, wireless device, personal data assistant (PDA), handheld or portable computer, GPS receiver/navigator, camera, MP4 video player, camcorder, game console, Watches, clocks, calculators, television monitors, flat panel displays, computer monitors, automotive displays (e.g., odometer displays, etc.), navigators, cockpit controls and/or displays, camera view displays (e.g., in the rear of the vehicle) displays for visual cameras), electronic photographs, electronic billboards or signs, projectors, packaging and aesthetic structures (e.g. displays for images of a piece of jewelry), etc.
  • PDA personal data assistant
  • the display panel 410 further includes a protective cover 420 .
  • the protective cover 420 is located on the side of the light-emitting element 130 away from the substrate 110 . It can be understood that the protective cover 410 serves to protect the light-emitting substrate 100 (or the light-emitting module 200).
  • the substrate 110 can be configured as a flexible substrate, so that the light-emitting substrate 100 or the light-emitting module 200 can be bent, so that the display device 400 can achieve curved display.
  • the edge of the display device 400 is curved to improve the display. Display effect of device 400.

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Abstract

一种发光基板（100），包括衬底（110）和多个发光组件（120）。多个发光组件（120）位于衬底（110）的一侧。至少一个发光组件（120）包括发光元件（130）以及环绕发光元件设置的调光部（140）。调光部（140）包括多个子结构（142），多个子结构（142）相互间隔。其中，沿远离发光元件（130）的任一方向，调光部（140）中的任意两个子结构（142），相对靠近发光元件（130）的子结构（142）的高度，小于相对远离发光元件（130）的子结构（142）的高度。

Description

发光基板、发光模组和显示装置 技术领域
本公开涉及显示技术领域，尤其涉及一种发光基板、发光模组和显示装置。
背景技术
发光基板，例如Mini LED(英文全称：Mini Light-Emitting Diode，中文名称：微型发光二极管)发光基板，具有自发光、快速响应、高对比度、高色域、宽视角和可制作在柔性衬底上等特点，受到广泛应用。
发明内容
一方面，提供了一种发光基板。发光基板包括衬底和多个发光组件。多个发光组件位于衬底的一侧。至少一个发光组件包括发光元件以及环绕发光元件设置的调光部。调光部包括多个子结构，多个子结构相互间隔。其中，沿远离发光元件的任一方向，调光部中的任意两个子结构，相对靠近发光元件的子结构的高度，小于相对远离发光元件的子结构的高度。
在一些实施例中，沿远离发光元件的任一方向，调光部中的任意两个子结构，相对靠近发光元件的子结构在衬底上的正投影的面积，小于相对远离发光元件的子结构在衬底上的正投影的面积。
在一些实施例中，发光基板还包括驱动电路层和反射膜。驱动电路层位于衬底的一侧。驱动电路层包括金属走线和导电衬垫，导电衬垫与金属走线电连接。反射膜位于驱动电路层远离衬底的一侧，反射膜裸露出导电衬垫。发光元件包括发光部和引脚。发光部位于反射膜远离驱动电路层的一侧。引脚与导电衬垫电连接。调光部中的多个子结构位于反射膜远离驱动电路层的一侧表面。
在一些实施例中，发光基板还包括驱动电路层和反射部件。驱动电路层位于衬底的一侧。驱动电路层包括金属走线和导电衬垫，导电衬垫与金属走线电连接。反射部件位于驱动电路层远离衬底的一侧。反射部件围设形成反射腔。反射部件具有连通孔。发光元件包括发光部和引脚。发光部位于反射腔。引脚通过连通孔与导电衬垫电连接。调光部中的多个子结构位于反射腔。
在一些实施例中，反射部件包括底壁和侧壁。底壁具有连通孔。调光部中的多个子结构位于底壁上。侧壁的一端与底壁相连接，另一端沿底壁远离衬底的方向延伸。侧壁与底壁围设形成反射腔。
在一些实施例中，侧壁与底壁相垂直。
在一些实施例中，侧壁远离底壁的边缘，在平行于侧壁的参考面上的正投影的形状为连续的多个曲线或连续的多个折线。
在一些实施例中，沿远离发光元件的任一方向，调光部中的多个子结构位于一条直线上。
在一些实施例中，至少一个子结构的形状为圆锥体、棱锥体、圆台体、棱台体和半球体中的一个。
在一些实施例中，调光部中的多个子结构的高度的取值范围为250μm～1000μm。
在一些实施例中，沿远离发光元件的任一方向，调光部中任意相邻的两个子结构的高度差的绝对值的取值范围为200μm～300μm。
在一些实施例中，沿远离发光元件的任一方向，调光部中任意相邻的两个子结构的高度差的绝对值，与另外任意相邻的两个子结构的高度差的绝对值相等。
在一些实施例中，发光基板还包括扩散粒子。扩散粒子位于至少一个子结构内。
在一些实施例中，发光基板具有显示区。靠近显示区边缘的发光元件的亮度，大于位于显示区其余位置的发光元件的亮度。
另一方面，提供了一种发光模组。发光模组包括如上述的发光基板和至少一个透镜。至少一个透镜位于多个发光组件远离衬底的一侧。
在一些实施例中，至少一个透镜被配置为：在靠近衬底的表面上具有至少一个第一凹槽。调光部中的至少一个子结构的至少部分嵌入于第一凹槽内。
在一些实施例中，至少一个第一凹槽为环形槽。环形槽在衬底上的正投影围绕发光元件在衬底上的正投影。
在一些实施例中，第一凹槽的数量为多个。嵌入于同一个第一凹槽内的多个子结构的高度相同。和/或，嵌入于同一个第一凹槽内的多个子结构在衬底上的正投影的面积相同。
在一些实施例中，第一凹槽的数量为多个。沿远离发光元件的任一方向，任意两个第一凹槽，相对靠近发光元件的第一凹槽的深度，小于相对远离发光元件的第一凹槽的深度。和/或，沿远离发光元件的任一方向，任意两个第一凹槽，相对靠近发光元件的第一凹槽的宽度，小于相对远离发光元件的第一凹槽的宽度。
在一些实施例中，至少一个透镜被配置为：在远离衬底的表面上具有凹陷部。发光元件在衬底上的正投影，与凹陷部在衬底上的正投影的至少部分 交叠。
在一些实施例中，至少一个透镜被配置为：在靠近衬底的表面上还具有第二凹槽。发光元件包括发光部，发光部的至少部分位于第二凹槽内。
在一些实施例中，发光元件被配置为发白光。
在一些实施例中，发光元件被配置为发单色光。发光模组还包括色转换膜。色转换膜位于至少一个透镜远离发光元件的一侧。
在一些实施例中，色转换膜为量子点膜。发光元件包括第一发光元件。第一发光元件在衬底上的正投影，靠近量子点膜在衬底上的正投影的边缘。调光部包括第一调光部。第一调光部环绕第一发光元件。发光模组还包括荧光粒子。荧光粒子位于第一调光部中的至少一个子结构内。荧光粒子被配置为对照射至荧光粒子的光线进行调制，使调制后的光线与发光元件发射出的未被调制过的光线混合为白光。
在一些实施例中，发光元件被配置为发射蓝光，荧光粒子包括黄色荧光粒子。或，发光元件被配置为发射蓝光，荧光粒子包括红色荧光粒子和绿色荧光粒子。
在一些实施例中，发光模组还包括增亮膜。增亮膜位于色转换膜远离至少一个透镜的一侧。
又一方面，提供了一种显示装置。显示装置包括背光模组和液晶显示面板。液晶显示面板位于背光模组的出光侧。其中，背光模组包括如上述的发光基板。或，背光模组包括如上述的发光模组。
又一方面，提供了一种显示装置。显示装置包括显示面板。其中，显示面板包括如上述的发光基板。或，显示面板包括如上述的发光模组。
附图说明
为了更清楚地说明本公开中的技术方案，下面将对本公开一些实施例中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本公开的一些实施例的附图，对于本领域普通技术人员来讲，还可以根据这些附图获得其他的附图。此外，以下描述中的附图可以视作示意图，并非对本公开实施例所涉及的产品的实际尺寸、方法的实际流程、信号的实际时序等的限制。
图1A为根据一些实施例的发光模组的结构图；
图1B为根据一些实施例的发光基板的结构图；
图1C为根据另一些实施例的发光模组的结构图；
图2A为根据一些实施例的子结构和发光元件的结构图；
图2B为根据另一些实施例的子结构和发光元件的结构图；
图2C为根据一些实施例的发光组件的结构图；
图2D为根据另一些实施例的发光组件的结构图；
图2E为根据另一些实施例的发光基板的结构图；
图2F为根据又一些实施例的发光基板的结构图；
图2G为根据又一些实施例的发光模组的结构图；
图3A为根据一些实施例的形成子结构的步骤对应的第一个结构图；
图3B为根据一些实施例的形成子结构的步骤对应的第二个结构图；
图3C为根据一些实施例的形成子结构的步骤的第三个结构图；
图3D为根据一些实施例的子结构的结构图；
图4A为根据一些实施例的驱动电路层、反射膜和发光元件的结构图；
图4B为根据一些实施例的驱动电路的结构图；
图4C为根据一些实施例的驱动电路层和反射膜的结构图；
图5A为根据又一些实施例的发光模组的结构图；
图5B为根据一些实施例的反射部件的结构图；
图5C为根据又一些实施例的发光模组的结构图；
图5D为根据又一些实施例的发光模组的结构图；
图5E为根据又一些实施例的发光基板的结构图；
图5F为根据另一些实施例的子结构的结构图；
图5G为根据又一些实施例的发光模组的结构图；
图6A为根据又一些实施例的发光模组的结构图；
图6B为根据一些实施例的调光膜的爆炸图；
图6C为根据一些实施例的第一发光元件和第一调光部的结构图；
图6D为根据一些实施例的量子点膜的边缘区的结构图；
图6E为根据另一些实施例的量子点膜的边缘区的结构图；
图6F为根据又一些实施例的量子点膜的边缘区的结构图；
图6G为根据又一些实施例的发光模组的结构图；
图6H为根据又一些实施例的发光模组的结构图；
图7A为根据一些实施例的显示装置的结构图；
图7B为根据另一些实施例的显示装置的结构图；
图7C为根据又一些实施例的显示装置的结构图；
图7D为根据又一些实施例的显示装置的结构图。
具体实施方式
下面将结合附图，对本公开一些实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本公开一部分实施例，而不是全部的实施例。基于本公开所提供的实施例，本领域普通技术人员所获得的所有其他实施例，都属于本公开保护的范围。
除非上下文另有要求，否则，在整个说明书和权利要求书中，术语“包括(comprise)”及其其他形式例如第三人称单数形式“包括(comprises)”和现在分词形式“包括(comprising)”被解释为开放、包含的意思，即为“包含，但不限于”。在说明书的描述中，术语“一个实施例(one embodiment)”、“一些实施例(some embodiments)”、“示例性实施例(exemplary embodiments)”、“示例(example)”、“特定示例(specific example)”或“一些示例(some examples)”等旨在表明与该实施例或示例相关的特定特征、结构、材料或特性包括在本公开的至少一个实施例或示例中。上述术语的示意性表示不一定是指同一实施例或示例。此外，所述的特定特征、结构、材料或特点可以以任何适当方式包括在任何一个或多个实施例或示例中。
以下，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个该特征。在本公开实施例的描述中，除非另有说明，“多个”的含义是两个或两个以上。
“A、B和C中的至少一个”与“A、B或C中的至少一个”具有相同含义，均包括以下A、B和C的组合：仅A，仅B，仅C，A和B的组合，A和C的组合，B和C的组合，及A、B和C的组合。
“A和/或B”，包括以下三种组合：仅A，仅B，及A和B的组合。
如本文所使用的那样，“平行”、“垂直”、“相等”包括所阐述的情况以及与所阐述的情况相近似的情况，该相近似的情况的范围处于可接受偏差范围内，其中所述可接受偏差范围如由本领域普通技术人员考虑到正在讨论的测量以及与特定量的测量相关的误差(即，测量系统的局限性)所确定。例如，“平行”包括绝对平行和近似平行，其中近似平行的可接受偏差范围例如可以是5°以内偏差；“垂直”包括绝对垂直和近似垂直，其中近似垂直的可接受偏差范围例如也可以是5°以内偏差。“相等”包括绝对相等和近似相等，其中近似相等的可接受偏差范围内例如可以是相等的两者之间的差值小于或等于其中任一者的5％。
应当理解的是，当层或元件被称为在另一层或基板上时，可以是该层或元件直接在另一层或基板上，或者也可以是该层或元件与另一层或基板之间 存在中间层。
本文参照作为理想化示例性附图的剖视图和/或平面图描述了示例性实施方式。在附图中，为了清楚，放大了层和区域的厚度。因此，可设想到由于例如制造技术和/或公差引起的相对于附图的形状的变动。因此，示例性实施方式不应解释为局限于本文示出的区域的形状，而是包括因例如制造而引起的形状偏差。例如，示为矩形的蚀刻区域通常将具有弯曲的特征。因此，附图中所示的区域本质上是示意性的，且它们的形状并非旨在示出设备的区域的实际形状，并且并非旨在限制示例性实施方式的范围。
图1A为根据一些实施例的发光模组的结构图。图1B为根据一些实施例的发光基板的结构图。图1C为根据另一些实施例的发光模组的结构图。
如图1A所示，本公开的实施例提供了一种发光模组200。可以理解地，发光模组200用于实现背光或者图像显示等功能。发光模组200包括发光基板100，下面对发光基板100进行举例说明。
在一些示例中，如图1B所示，发光基板100包括衬底110和多个发光组件120。
在一些示例中，衬底110为硬性衬底。在另一些示例中，衬底110为柔性衬底。示例的，衬底110的材料包括塑料、FR-4等级材料、树脂、玻璃、石英、聚酰亚胺或者聚甲基丙烯酸甲酯(英文全称：Polymethyl Methacrylate，英文简称PMMA)中的任一个。
多个发光组件120位于衬底110的一侧，可以理解地，发光组件120用于发光。在一些示例中，多个发光组件120位于衬底110的一侧表面。在另一些示例中，多个发光组件120和衬底110之间还设置有其他膜层结构。
在一些示例中，如图1B所示，衬底110被划分为多个发光区102，一个发光组件120位于一个发光区102内。多个发光区102阵列排布，以形成显示区104。可以理解地，显示区104能够实现背光或者图像显示等功能。
在一些示例中，发光区102的数量可以为512个、1000个或者2000个等。本公开的实施例对发光区102的数量不做进一步限定。
在一些实现方式中，如图1A所示，各个发光组件120包括发光元件130。多个发光组件120阵列排布，不同发光组件120中的发光元件130间隔设置。示例的，任意相邻的两个发光元件130之间的距离D可以相同，也可以不同。
可以理解地，发光基板100具有出光侧，发光元件130发射的光线能够经由发光基板100的出光侧射出。
在一些示例中，如图1A所示，用户沿垂直于或者近似垂直于衬底110的方向观察发光基板100，也即是用户沿垂直于或者近似垂直于发光元件130所在平面的方向观察发光基板100。示例的，可以将采用上述方式设置的发光基板100称为直下式发光基板。
可以理解地，多个发光元件130能够独立发光。也即是，在一些示例中，多个发光元件130能够同时发光。在另一些示例中，也可以多个发光元件130中的一部分发光元件130发光，另一部分发光元件130不发光。当多个发光元件130同时发光时，各个发光元件130的亮度可以相同，也可以不同。
在一些示例中，多个发光元件130用于发蓝光。在另一些示例中，多个发光元件130用于发白光。在又一些示例中，多个发光元件130中的一部分发光元件130用于发红光、另一部分发光元件130用于发绿光、又一部分发光元件130用于发蓝光。
在一些示例中，发光元件130为发光二极管(英文全称：Light Emitting Diode，英文简称：LED)。示例的，发光元件130可以为传统LED、次毫米发光二极管(英文全称：Mini Light Emitting Diode，英文简称：Mini LED)或者微型发光二极管(英文全称：Micro Light Emitting Diode，英文简称：Micro LED)中的任一个。
示例的，传统LED，也即是LED的尺寸大于或等于500μm，且LED之间的距离大于2mm。Mini LED，也即是LED的尺寸大于或等于80μm，且小于500μm。Micro LED，也即是LED的尺寸小于50μm。
需要说明的是，本公开的实施例对发光元件130的尺寸以及多个发光元件130之间的距离D不做进一步限定。
可以理解地，设置多个发光元件130阵列排布，使得发光基板100能够实现更小范围的区域调光(英文全称：Local Dimming)，提高发光基板100的背光以及显示性能。
在一些示例中，如图1A所示，发光模组200还包括色转换膜222。色转换膜222位于发光元件130远离衬底110的一侧，用于对发光元件130发出的光线进行色转换，以得到红光、绿光和蓝光。可以理解地，将不同强度的红光、绿光和蓝光相混合，即可使得发光基板100显示彩色图像信息。
在一些示例中，多个发光元件130用于发蓝光，色转换膜222为量子点(英文全称：Quantum Dot，英文简称：QD)膜2221或者荧光粉有机膜材。
示例的，量子点膜2221中包括红色量子点和绿色量子点，如图1A中箭头方向所示，发光元件130发射的蓝光照射至量子点膜2221时，红色量 子点能够将蓝光转化为红光，绿色量子点能够将蓝光转化为绿光，从而实现对于发光元件130发出光线的色转换功能。类似地，荧光粉膜中包括能够使蓝光转换为黄光的荧光粉颗粒，从而实现对于发光元件130发出光线的色转换功能。
在另一些示例中，多个发光元件130用于发白光，色转换膜222为彩膜。彩膜包括红色滤光膜、绿色滤光膜和蓝色滤光膜。如图1A中箭头方向所示，发光元件130发射的白光照射至彩膜时，红光、绿光和蓝光能够射出彩膜，其他颜色的光被彩膜过滤而无法射出，从而实现对于发光元件130发出光线的色转换功能。
在一些示例中，如图1A所示，发光基板100还包括反射膜162，反射膜162位于衬底110靠近发光元件130的一侧。可以理解地，反射膜162用于反射光线，从而增大照射至发光基板100之外的光线强度，增大发光基板100的亮度，降低发光基板100的功耗。
示例的，如图1A所示，可以将反射膜162与膜材(例如色转换膜222)之间的距离称为混光距离(英文全称：Optical Distance，英文简称：OD)H。也即是，相邻的两个发光元件130发射的光线，能够在反射膜162与膜材(例如色转换膜222)之间进行混合。
示例的，混光距离H的取值范围为1mm～5mm。例如，混光距离H可以为1mm、2mm、2.2mm、2.5mm、2.8mm或者3mm、5mm等。
可以理解地，为了预留膜材热胀冷缩的空间，相邻的两个发光区102之间通常留有缝隙。如图1C中箭头方向所示，在对发光基板100进行区域调光时，也即是控制多个发光元件130中的一部分发光元件130发光(例如发光元件130a)，另一部分发光元件130不发光(例如发光元件130b)时，发光元件130a发射的光线不仅能够照射至发光区102a，还能够经由相邻的两个发光区102之间的缝隙，照射至发光区102b，使得发光区102b出现光晕，也即是使得发光基板100出现漏光现象，影响了发光基板100的发光性能。
可以理解地，本公开的实施例中，发光区102a和发光区102b仅用于区分两个不同的发光区102，不对发光区102做进一步限定。发光元件130a和发光元件130b仅用于区分分别位于发光区102a和发光区102b内的两个发光元件130，不对发光元件130做进一步限定。
在一些实施例中，可以通过增加发光区102的数量和将发光元件130设置于反射碗杯内等方式，来改善发光基板100的漏光现象。
但是，本公开的发明人研究发现，增加发光区102的数量，会增大电路 结构(例如与发光元件130电连接的驱动电路等)的走线难度，从而增大发光基板100的成本。设置反射碗杯等结构，复杂度较高，同样会导致发光基板100的成本增大。
为了改善发光基板100上出现的漏光现象，如图1B所示，本公开的一些实施例提供的发光基板100包括衬底110和多个发光组件120。多个发光组件120位于衬底110的一侧。至少一个发光组件120包括发光元件130以及环绕发光元件130设置的调光部140。调光部140包括多个子结构142，多个子结构142相互间隔。
在一些示例中，如图1B所示，各个发光组件120均包括发光元件130和环绕发光元件130设置的调光部140。
可以理解地，本公开的上述实施例已经对衬底110、发光元件130与衬底110之间的位置关系、以及发光元件130的种类等进行了举例说明，在此不再赘述。下面对调光部140进行举例说明。
如图1B所示，调光部140环绕发光元件130。调光部140包括多个间隔设置的子结构142，也即是调光部140中的多个子结构142环绕发光元件130。在一些示例中，调光部140中的多个子结构142之间的间隔可以相同，也可以不同。
在一些示例中，调光部140中的多个子结构142可以呈圆环、椭圆环、矩形环、多边形环或者其他不规则环的方式，环绕发光元件130。
在另一些示例中，调光部140中的多个子结构142还可以呈至少两个同心圆环、至少两个同心椭圆环、至少两个同心矩形环、至少两个同心多边形环或者至少两个同心不规则环状的方式，环绕发光元件130。
图2A为根据一些实施例的子结构和发光元件的结构图。图2B为根据另一些实施例的子结构和发光元件的结构图。
在一些示例中，如图2A和图2B所示，调光部140中的多个子结构142环绕一个发光元件130。示例的，调光部140中的多个子结构142相互间隔，并以圆环状或者多个同心圆环状排布，环绕发光元件130。
示例的，当调光部140中的多个子结构142环绕一个发光元件130时，环绕不同发光元件130(图2A中的发光元件130c和图2B中的发光元件130d)的子结构142的数量可以相同，也可以不同。
可以理解地，发光元件130c和发光元件130d仅用于区分两个不同的发光元件130，不对发光元件130做进一步限定。
在一些示例中，如图2A所示，当调光部140中的多个子结构142环绕一 个发光元件130时，发光元件130位于圆环或者同心圆环的中心位置，提高了发光组件120的结构规整性。
图2C为根据一些实施例的发光组件的结构图。图2D为根据另一些实施例的发光组件的结构图。
在一些示例中，如图2C和图2D所示，调光部140中的多个子结构142环绕多个发光元件130。
示例的，如图2C所示，当调光部140中的多个子结构142环绕多个发光元件130时，多个发光元件130沿顺时针方向或者逆时针方向顺次连线可以构成三角形。如图2D所示，当调光部140中的多个子结构142环绕多个发光元件130时，多个发光元件130沿顺时针方向或者逆时针方向顺次连线也可以构成矩形、方形、菱形或者其他不规则形状排布。
图2E为根据另一些实施例的发光基板的结构图。图2F为根据又一些实施例的发光基板的结构图。
在一些示例中，如图1B所示，子结构142的形状为圆锥状或者棱锥状。在另一些示例中，如图2E所示，子结构142的形状为圆台状或者棱台状。在又一些示例中，如图2F所示，子结构142的形状为半球状或者半椭球状等。
可以理解地，调光部140中的多个子结构142的形状可以相同，也可以不同。本公开的实施例对子结构142的形状不做进一步限定。
图2G为根据又一些实施例的发光模组的结构图。
在一些实施例中，如图2G所示，沿远离发光元件130的任一方向，调光部140中的任意两个子结构142，相对靠近发光元件130的子结构142的高度，小于相对远离发光元件130的子结构142的高度。
可以理解地，如图2G所示，沿远离发光元件130的任一方向，调光部140中的任意两个子结构142，相对靠近发光元件130的子结构142的高度，小于相对远离发光元件130的子结构142的高度，也即是，沿远离发光元件130的任一方向，多个子结构142的高度可以逐渐增大。
示例的，如图2G所示，以发光元件130的几何中心为起点，将沿远离发光元件130的任一方向依次排布的多个子结构142的远离衬底110的顶点或顶面顺次连接，可以得到凹曲线或凹曲面。
可以理解地，发光元件130位于各凹曲线或凹曲面中与衬底110距离最小的位置，调光部140中高度最大的子结构142位于凹曲线或凹曲面中与衬底110距离最大的位置，且与发光元件130的距离最大。也即是，该凹曲线或凹曲面朝向靠近衬底110方向弯曲(如图2G中虚线所示)。
如此设置，使得调光部140中的多个子结构142能够对光线起到准直的作用，减小光线向四周的扩散量，从而减小照射至其他发光区102的光线强度。
这样一来，在对发光基板100进行区域调光时，如图2G所示，若发光元件130a发光，发光元件130b不发光，调光部140能够对发光元件130a发射的光线起到准直的作用，减小照射至发光区102b的光线强度，从而减小两个发光元件130(发光元件130a和发光元件130b)之间产生的串扰，弱化发光基板100出现的漏光现象，提高发光基板100的发光性能。
在一些示例中，沿远离发光元件130的任一方向，多个子结构142的高度呈等差数列逐渐增大。
通过设置调光部140来改善发光基板100的漏光现象，无需增加发光区102的数量，避免增加电路结构的走线难度。并且，发光区102数量较多或者数量较少的发光基板100，均可以采用设置调光部140的方式来改善明暗区域和漏光现象，提高了调光部140的适用性。
此外，设置调光部140来改善发光基板100的漏光现象，无需制作反射碗杯等结构，降低发光基板100的成本，并且工艺简单，提高发光基板100的生产效率。
由上述可知，本公开的实施例中，设置沿远离发光元件130的任一方向，调光部140中的多个子结构142的高度逐渐增大，从而，以发光元件130的几何中心为起点，将沿远离发光元件130的任一方向依次排布的多个子结构142的远离衬底110的顶点或顶面顺次连接，可以得到凹曲线或凹曲面。
如此设置，使得调光部140中的多个子结构142能够对由发光元件130出射光线起到准直的作用，减小光线向四周的扩散角度，从而减小照射至其他发光区102的光线强度。
这样一来，在对发光基板100进行区域调光时，调光部140能够对发光元件130发射的光线起到准直的作用，减小照射至其他发光区102的光线强度，从而减小两个发光元件130之间产生的串扰，弱化发光基板100出现的漏光现象，提高发光基板100的发光性能。
通过设置调光部140来改善发光基板100的漏光现象，无需增加发光区102的数量，避免增加电路结构的走线难度。并且，发光区102数量较多或者数量较少的发光基板100，均可以采用设置调光部140的方式来改善明暗区域和漏光现象，提高了调光部140的适用性。
图3A为根据一些实施例的形成子结构的步骤对应的第一个结构图。 图3B为根据一些实施例的形成子结构的步骤对应的第二个结构图。图3C为根据一些实施例的形成子结构的步骤的第三个结构图。图3D为根据一些实施例的子结构的结构图。
由上述可知，调光部140包括多个子结构142。下面参照图3A至图3D，对子结构142的制备方法进行举例说明。
在一些示例中，如图3A所示，可以在衬底110的一侧形第一层图案1421，可以理解地，第一层图案1421环绕发光元件130。
如图3B所示，在第一层图案1421远离衬底110的一侧表面，形成第二层图案1422。示例的，第二层图案1422在衬底110上的正投影，落入第一层图案1421在衬底110上的正投影的范围内，使得第一层图案1421能够对第二层图案1422起到支撑的作用。
如图3C所示，在部分第二层图案1422远离第一层图案1421的一侧表面，形成第三层图案1423。
示例的，第三层图案1423在衬底110上的正投影，落入第二层图案1422在衬底110上的正投影的范围内，使得第二层图案1422能够对第三层图案1423起到支撑的作用。
在一些示例中，多个子结构142中的一部分子结构124(两个或者更多个)包括第一层图案1421，另一部分子结构142(两个或者更多个)包括第一层图案1421和第二层图案1422，又一部分子结构142(两个或者更多个)包括第一层图案1421、第二层图案1422和第三层图案1423。
需要说明的是，本公开的实施例中，第一层图案1421、第二层图案1422和第三层图案1423仅用于区分在不同步骤中形成的子结构142或子结构142的一部分，不对子结构142的形状做进一步限定。
可以理解地，采用分次的方式逐层形成各个子结构142，使得沿远离发光元件130的任一方向，多个子结构142的高度能够逐渐增大。
可以理解地，采用分次的方式逐层形成子结构142时，可以分两层、三层或者四层等形成子结构142。本公开的实施例不对形成子结构142的层数做进一步限定。
在一些示例中，可以采用3D打印工艺或者3D喷涂工艺形成图案化的第一层图案1421、第二层图案1422和第三层图案1423。
在另一些示例中，也可以采用3D打印工艺或者3D喷涂工艺，逐个形成图案化的子结构142。
在一些示例中，可以采用加热固化或者紫外线固化等方式，对子结构142 进行固化处理。
在另一些示例中，如图3D所示，也可以采用涂胶工艺形成子结构142。
示例的，可以将形成子结构142的材料设置于涂胶装置106内。通过控制涂胶装置106的出胶速度和移动速度，使得沿远离发光元件130的任一方向，多个子结构142的高度能够增大，简化子结构142的制作步骤，降低生产成本。
示例的，形成子结构142的材料包括具有较高的触变性能的材料，例如高触变胶水等。具有较高的触变性能的材料可迅速图案化，简化子结构142的制备工艺。
在一些实施例中，如图2A和图2B所示，沿远离发光元件130的任一方向，调光部140中的任意两个子结构142，相对靠近发光元件130的子结构142在衬底110上的正投影的面积，小于相对远离发光元件130的子结构142在衬底110上的正投影的面积。
可以理解地，沿远离发光元件130的任一方向，调光部140中的任意两个子结构142，相对靠近发光元件130的子结构142在衬底110上的正投影的面积，小于相对远离发光元件130的子结构142在衬底110上的正投影的面积，也即是，沿远离发光元件130的任一方向，多个子结构142在衬底110上的正投影的面积可以逐渐增大。
可以理解地，设置沿远离发光元件130的任一方向，多个子结构142在衬底110上的正投影的面积逐渐增大，提高了调光部140中的多个子结构142对于光线的准直效果，进一步改善发光基板100的漏光现象。
在一些示例中，子结构142在衬底110上正投影的面积为圆形。沿远离发光元件130的任一方向，多个子结构142在衬底110上的正投影的面积逐渐增大，也即是沿远离发光元件130的任一方向，多个子结构142在衬底110上正投影的直径逐渐增大。
图4A为根据一些实施例的驱动电路层、反射膜和发光元件的结构图。图4B为根据一些实施例的驱动电路的结构图。图4C为根据一些实施例的驱动电路层和反射膜的结构图。
在一些实施例中，如图4A所示，发光基板100还包括驱动电路层150和反射膜162。驱动电路层150位于衬底110的一侧。反射膜162位于驱动电路层150远离衬底110的一侧。
在一些示例中，驱动电路层150位于衬底110的一侧表面。在另一些示例中，如图4A所示，驱动电路层150与衬底110之间还设置有其他膜层结构， 例如第一粘接层156，提高驱动电路层150与衬底110之间的连接可靠性。
在一些示例中，如图4A所示，驱动电路层150包括金属走线152和导电衬垫154。导电衬垫154与金属走线152电连接。示例的，金属走线152位于衬底110的一侧，导电衬垫154位于金属走线152远离衬底110的一侧。可以理解地，导电衬垫154的数量为多个。
在一些示例中，如图4A所示，金属走线152与导电衬垫154之间设置有其他膜层结构，例如第二粘接层158，提高金属走线152与导电衬垫154之间电连接的可靠性。在另一些示例中，导电衬垫154与金属走线152远离衬底110一侧的表面相贴合。
在一些示例中，如图4B所示，发光基板100还包括驱动电路Q，驱动电路Q位于衬底110和导电衬垫154之间，且与导电衬垫154电连接，使得驱动信号能够传输至导电衬垫154。导电衬垫154与发光元件130电连接，驱动信号能够通过导电衬垫154传输至发光元件130，使得发光元件130能够在驱动电路Q的驱动作用下发光。
示例的，如图4B所示，发光基板100包括位于衬底110上的多条栅线G和多条数据线D，驱动电路Q与栅线G和数据线D电连接。在来自栅线G的栅扫描信号的控制下，驱动电路Q接收来自数据线D的数据信号，并输出驱动信号。
在一些示例中，驱动电路Q包括薄膜晶体管(英文全称：Thin Film Transistor，英文简称：TFT)T。如图4C所示，薄膜晶体管T中包括驱动晶体管DT。驱动晶体管DT位于衬底110与导电衬垫154之间，且与导电衬垫154电连接，用于输出驱动信号。
在一些示例中，发光基板100还包括驱动芯片(英文全称：Integrated Circuit，英文简称：IC)。驱动IC与驱动电路Q电连接，用于控制驱动电路Q向发光元件130提供驱动信号。
在一些示例中，如图4B所示，驱动电路Q包括薄膜晶体管T电容器C。
反射膜162位于驱动电路层150的一侧，可以理解地，反射膜162起到反射光线的作用。示例的，反射膜162的材料包括感光型白色油墨或者热固型白色油墨。
在一些示例中，反射膜162位于驱动电路层150远离衬底110的一侧表面。在另一些示例中，反射膜162和驱动电路层150之间还设置有其他膜层结构，例如绝缘层或平坦层等，起到电隔离或者平坦化接触表面的作用。
反射膜162裸露出导电衬垫154。示例的，如图4C所示，可以通过图案 化工艺在反射膜162的对应位置形成开口166，使得反射膜162能够暴露出导电衬垫154。在一些示例中，开口166的面积大于导电衬垫154的面积，使得导电衬垫154能够完全被暴露出来。
如图4A所示，发光元件130包括发光部132和引脚134，引脚134与导电衬垫154电连接。可以理解地，引脚134用于接收驱动信号，使得发光部132能够在驱动信号的作用下发光。
可以理解地，由于反射膜162能够暴露出导电衬垫154，使得引脚134能够与导电衬垫154电连接。
在一些示例中，引脚134的数量为多个。示例的，多个引脚134可以分别与多分导电衬垫154电连接。在一些示例中，引脚134与导电衬垫154之间通过焊接的方式实现电连接。
如图4A所示，发光部132位于反射膜162远离驱动电路层150的一侧。可以理解地，反射膜162起到反射光线的作用。发光部132位于反射膜162远离驱动电路层150的一侧，使得发光部132发射的一部分光线能够照射至反射膜162，并在反射膜162的反射作用下，沿远离衬底110的方向照射至发光基板100之外(如图4A中光线a所示)。
也即是，通过设置反射膜162，并且将发光部132设置于反射膜162远离驱动电路层150的一侧，能够增大照射至发光基板100之外的光线强度，从而增大发光基板100的亮度，提高光线的利用率，降低发光基板100功耗。
如图4A所示，调光部140中的多个子结构142位于反射膜162远离驱动电路层150的一侧表面。如此设置，使得发光元件130发射的一部分光线能够照射至多个子结构142。
示例的，如图4A中光线b1、光线b2和光线b3所示，调光部140中的多个子结构142能够对光线起到准直的作用，改善发光基板100出现的漏光现象。
在一些示例中，调光部140中的多个子结构142与反射膜162远离驱动电路层150的一侧表面相贴合。
图5A为根据又一些实施例的发光模组的结构图。图5B为根据一些实施例的反射部件的结构图。图5C为根据又一些实施例的发光模组的结构图。图5D为根据又一些实施例的发光模组的结构图。
由上述可知，在一些实施例中，发光基板100包括驱动电路层150和反射膜162，反射膜162位于驱动电路层150远离衬底110的一侧。而在另一些实施例中，如图5A所示，发光基板100包括驱动电路层150和反射部件170。
驱动电路层150位于衬底110的一侧。驱动电路层150包括金属走线152和导电衬垫154，导电衬垫154与金属走线152电连接。可以理解地，本公开的上述实施例已经对驱动电路层150进行了举例说明，在此不再赘述。
发光元件130包括发光部132和引脚134。可以理解地，本公开的实施例已经对发光元件130进行了举例说明，在此不再赘述。下面参照图5A至图5D，对反射部件170进行举例说明。
如图5A所示，反射部件170位于驱动电路层150远离衬底110的一侧。在一些示例中，反射部件170与驱动电路层150远离衬底110一侧的表面相贴合。在另一些示例中，反射部件170与驱动电路层150之间还设置有其他膜层结构。
如图5A所示，反射部件170围设形成反射腔172，示例的，反射腔172可以为底面为长方形或圆形或多边形或其他不规则形状的盒状结构。
可以理解地，反射部件170的内壁(远离衬底110一侧的表面)围设形成反射腔172。需要说明的是，图5A、5C和5D中，虚线所示出的范围(也即是反射腔172)与反射部件170的内壁之间存在间隔，仅仅是为了便于展示反射腔172，不对反射腔172与反射部件170之间的位置关系做进一步限定。
如图5B所示，反射部件170具有连通孔174。在一些示例中，反射部件170可以具有一个或者多个连通孔174。示例的，连通孔174的形状可以为方形或者圆形等。不同的反射部件170上开设的连通孔174的形状可以相同，也可以不同。
如图5C所示，发光部132位于反射腔172，引脚134通过连通孔174与导电衬垫154电连接。
在一些示例中，连通孔174的形状与发光元件130在衬底110上正投影的形状相适配，使得引脚134能够通过连通孔174与导电衬垫154电连接。
可以理解地，反射部件170能够起到反射光线的作用。发光部132位于反射腔172内，使得发光部132发射的一部分光线能够照射至反射腔172的内壁，并在反射部件170的反射作用下，沿远离衬底110的方向射出发光基板100(如图5C中光线c所示)。也即是，通过设置反射部件170，能够增大照射至发光基板100之外的光线强度，从而增大发光基板100的亮度，提高光线的利用率，降低发光基板100的功耗。
在一些示例中，反射腔172的内壁上涂覆有反光材料，使得反射部件170能够起到反射光线的作用。示例的，反光材料可以为二氧化钛或者二氧化硅。
如图5C所示，调光部140中的多个子结构142设置于反射腔172。示例 的，调光部140中的多个子结构142位于反射腔172中。
在一些实施例中，如图5B所示，反射部件170包括底壁176和侧壁178。底壁176具有连通孔174。调光部140中的多个子结构142位于底壁176上。侧壁178的一端与底壁176相连接，另一端沿底壁176远离衬底110的方向延伸。侧壁178与底壁176围设形成反射腔172。
可以理解地，底壁176主体为具有平坦表面的板状结构。连通孔174开设在底壁176上，使得发光元件130的引脚134能够通过连通孔174与导电衬垫154电连接。示例的，侧壁178环绕底壁176，使得侧壁178能够与底壁176围设形成反射腔172。
在一些示例中，侧壁178可以与底壁176为一体成型结构，提高侧壁178与底壁176之间的连接可靠性。
设置反射部件170包括底壁176和侧壁178，使得底壁176和侧壁178能顾围设形成反射腔172，从而照射至侧壁178和底壁176的光线，均能够在反射作用下照射至发光基板100之外，增大发光区102的亮度，降低发光基板100的功耗。
调光部140中的多个子结构142位于底壁176上，示例的，如图5C中光线d1、光线d2和光线d3所示，使得发光元件130发射的一部分光线能够照射至多个子结构142。调光部140中的多个子结构142能够对光线起到准直的作用，改善发光基板100出现的漏光现象。
在一些示例中，调光部140中的多个子结构142与反射腔172的底壁相贴合。
可以理解地，通过设置反射部件170，不仅能够增大发光基板100的亮度，提高光线利用率，降低发光基板100的功耗，还能够改善发光基板100的漏光现象，进一步提高发光基板100的发光性能。
在一些示例中，如图5A所示，反射部件170的数量为多个，一个发光组件120(包括发光元件130和调光部140)位于一个反射部件170形成的反射腔172内，也即是侧壁178围设于一个发光组件120。
如此设置，使得侧壁172能够对各个发光元件130发射的光线起到反射的作用，减小照射至其他反射腔172内的光线强度，也即是减小照射至其他发光区102内的光线强度，从而能够改善发光基板100出现的漏光现象，进一步提高发光基板100的发光性能。
在另一些示例中，反射部件170的数量为一个。多个发光组件120(包括发光元件130和调光部140)位于一个反射部件170形成的反射腔172内，也 即是也即是侧壁178围设于多个发光组件120，简化了发光基板100的结构，降低发光基板100成本。
在又一些实施例中，如图5D所示，发光基板100同时包括反射膜162和反射部件170，反射膜162位于驱动电路层150和反射部件170之间。
通过在驱动电路层150和反射部件170之间设置反射膜162，进一步提高了对于光线的反射效果，增大照射至发光基板100之外的光线强度，从而增大发光基板100的亮度，降低发光基板100的功耗。
由上述可知，反射膜162具有开口166。在一些示例中，当发光模组200包括反射膜162和反射部件170时，反射膜162上开口166的面积，与反射部件170上连通孔174的面积相同或者近似相同，使得开口166和连通孔174能够暴露出导电衬垫154，从而使得发光元件130的引脚134能够与导电衬垫154电连接。
在另一些示例中，连通孔174的面积也可以略大于开口166的面积。
在另一些示例中，连通孔174的侧壁与反射部件170靠近衬底110一侧的表面之间具有的夹角在30°～90°之间，增大连通孔174的开口面积，提高发光元件130的引脚134与导电衬垫154之间的连接便捷性。
示例的，连通孔174的侧壁与反射部件170靠近衬底110一侧的表面之间具有的夹角的取值可以为45°、60°或者75°等。
在一些实施例中，如图5B所示，侧壁176与底壁178相垂直。
设置侧壁176与底壁178相垂直，进一步提高了对于发光部132发出光线的反射效果，减小照射至其他反射腔172内的光线强度，也即是减小照射至其他发光区102内的光线强度，从而能够改善发光基板100出现的漏光现象，进一步提高发光基板100的发光性能。
在一些实施例中，如图5B所示，侧壁178远离底壁176的边缘，在平行于侧壁178的参考面上的正投影的形状为连续的多个曲线或连续的多个折线。
可以理解地，当一个发光组件120(包括发光元件130和调光部140)位于一个反射部件170形成的反射腔172内时，侧壁178围设于一个发光组件120。
设置侧壁178远离底壁176的边缘，在平行于侧壁178的参考面上的正投影的形状为连续的多个曲线或连续的多个折线，也即是侧壁178远离底壁176一侧的端面为曲面或者折线面。这样一来，如图5B所示，使得侧壁178远离底壁176的一端具有缺口168。
可以理解地，发光部132发射的一部分光线能够在侧壁178和底壁176 的反射作用下，沿远离衬底110的方向照射至发光基板100之外，而另一部分光线能够通过缺口168照射至其他的发光区102。
如此设置，在改善发光基板100漏光现象的基础上，能够增大两个发光区102相邻位置处的亮度，提高相邻的两个发光元件130之间的亮度，弱化发光基板100上出现的能够被肉眼察觉到的明暗区域，提高发光基板100的发光均匀性。
在一些示例中，侧壁178远离底壁176的边缘，在平行于侧壁178的参考面上的正投影的形状为连续的多个规则的曲线或者连续的多个规则的折线，例如波浪状或者锯齿状，或者为波浪状和锯齿状的混合形状。
在另一些示例中，侧壁178远离底壁176的边缘，在平行于侧壁178的参考面上的正投影的形状为连续的多个不规则的曲线或连续的多个不规则的折线。
在一些示例中，侧壁178在平行于侧壁178的参考面上的正投影的形状为三角形、矩形、半圆形或者半椭圆形等。可以理解地，由于侧壁178远离底壁176一侧的边缘为连续的多个曲线或连续的多个折线，使得侧壁178在平行于侧壁178的参考面上的正投影的形状为为边缘呈曲线或者折线的近似三角形、近似矩形、近似半圆形或者近似半椭圆形等。
以侧壁178远离底壁176的边缘，在平行于侧壁178的参考面上的正投影的形状为锯齿状为例，示例的，如图5B所示，可以将一个锯齿状结构视为一个锯齿部169。可以理解地，一个锯齿部169包括两条倾斜边和一条底边(也即是两条倾斜边之间的连线)。
在一些示例中，锯齿部169在平行于侧壁178的参考面上的正投影的形状为左右对称的三角形，也即是，锯齿部169的两条倾斜边与底边之间的夹角相等或者近似相等。
在另一些示例中，锯齿部169在平行于侧壁178的参考面上的正投影的形状为左右不对称的三角形，也即是，锯齿部169的两条倾斜边与底边之间的夹角不相等。
示例的，锯齿部169的一条倾斜边与底边之间夹角的取值范围为30°～60°，例如45°、50°或者55°等。锯齿部169的另一条倾斜边与底边之间夹角的取值范围为80°～90°，例如82°、85°或者87°等。
在一些示例中，锯齿部169的底边长度的取值范围为2mm～4mm，锯齿部169的高度(也即是锯齿部169的底边与锯齿部169的顶点之间的距离)的取值范围为1mm～2mm。
示例的，锯齿部169的底边长度可以为2.5mm、3mm或者3.5mm。锯齿部169的高度可以为1.2mm、1.5mm或者1.8mm。
在一些实施例中，如图2A和图2B所示，沿远离发光元件130的任一方向，调光部140中的多个子结构142位于一条直线上。
可以理解地，设置沿远离发光元件130的任一方向，调光部140中的多个子结构142位于一条直线上，能够提高调光部140的结构规整性，提高对于光线的准直效果，减小在分区调光时，照射在其他发光区102的光线强度，改善发光基板100出现的漏光现象，提高发光基板100的发光性能。
并且，调光部140中的多个子结构142位于一条直线上，提高调光部140的结构规整性，还能够便于调光部140的生产加工，提高生产效率。
在一些实施例中，至少一个子结构142的形状为圆锥体、棱锥体、圆台体、棱台体和半球体中的一个。
可以理解地，调光部140中的多个子结构142的形状可以相同，也可以不同。设置至少一个子结构142的形状为圆锥体、棱锥体、圆台体、棱台体和半球体中的一个，满足了不同的使用需求，提高了调光部140的适用性。
示例的，半球体包括半圆球体、半椭球体和其他近似结构。
在一些实施例中，调光部140中的多个子结构142的高度的取值范围为250μm～1000μm。
设置多个子结构142的高度的取值范围为250μm～1000μm，避免了子结构142的高度过高(例如大于1000μm)，从而避免了子结构142的占用空间过大，利于发光基板100的减薄。并且，还避免了子结构142的高度过小(例如小于250μm)，影响子结构142对于光线的准直效果，进一步提高了发光基板100的亮度均匀性。
在一些示例中，多个子结构142的高度的取值范围可以为300μm～950μm、350μm～900μm、400μm～800μm或者500μm～700μm等。示例的，子结构142的高度可以为300μm、400μm、500μm、600μm或者750μm等。
在一些实施例中，沿远离发光元件130的任一方向，调光部140中任意相邻的两个子结构142的高度差的绝对值的取值范围为200μm～300μm。
由上述可知，沿远离发光元件130的任一方向，调光部140中的任意两个子结构142，相对靠近发光元件130的子结构142的高度，小于相对远离发光元件130的子结构142的高度。也即是，沿远离发光元件130的任一方向，子结构142的高度可以逐渐增大。
故而，设置沿远离发光元件130的任一方向，调光部140中任意相邻的 两个子结构142的高度差的绝对值取值范围为200μm～300μm，避免了调光部140中任意相邻的两个子结构142之间的高度差过大或者过小，使得沿远离发光元件130的任一方向，多个子结构142的高度能够缓慢递增，从而提高调光部140的规整性，提高调光部140对于光线的准直效果，改善发光基板100出现的漏光现象，提高发光基板100的发光性能。
在一些示例中，设置沿远离发光元件130的任一方向，调光部140中任意相邻的两个子结构142的高度差的绝对值取值可以为220μm、250μm、280μm或者290μm等。
在一些实施例中，沿远离发光元件130的任一方向，调光部140中任意相邻的两个子结构142的高度差的绝对值，与另外任意相邻的两个子结构142的高度差的绝对值相等。
可以理解地，设置沿远离发光元件130的任一方向，调光部140中任意相邻的两个子结构142的高度差的绝对值，与另外任意相邻的两个子结构142的高度差的绝对值相等，使得沿远离发光元件130的任一方向，多个子结构142的高度能够呈等差数列逐渐增大。
如此设置，进一步提高了调光部140的结构规整性，从而提高调光部140对于光线的准直效果，改善发光基板100出现的漏光现象，提高发光基板100的发光性能。
可以理解地，设置沿远离发光元件130的任一方向，调光部140中任意相邻的两个子结构142的高度差的绝对值，与另外任意相邻的两个子结构142的高度差的绝对值可以相等或者近似相等。
在一些示例中，发光模组200通常包括多层膜材。在一些实现方式中，通常将多层膜材复合，使得膜材能够薄型化和多功能化，来减小混光距离H，利于发光基板100的减薄。
图5E为根据又一些实施例的发光基板的结构图。图5F为根据另一些实施例的子结构的结构图。图5G为根据又一些实施例的发光模组的结构图。
示例的，如图1A中箭头方向所示，发光元件130发出的光线呈圆锥状或者近似圆锥状向外照射，使得相邻的两个发光元件130之间的亮度(也即是各个发光区102边缘处的亮度)，小于各个发光区102中心处的亮度。当混光距离H减小时，使得各个发光区102边缘处与中心处的亮度差异增大，从而导致发光基板100的亮度不均匀。
示例的，如图5E所示，当多个发光区102阵列排布时，两个发光区102邻接位置处的亮度(如图5E中P1区域所示)，小于各个发光区102中心位 置处的亮度(如图5E中P2区域所示)，导致发光基板100出现能够被肉眼察觉到的明暗区域，影响发光基板100的亮度均匀性，从而影响了发光模组200的性能。
在一些实施例中，可以通过减小相邻的两个发光元件130之间的距离D、增大发光元件130的发光角度α(例如将发光角度α增大至175°以上)、增大混光距离H以及设置扩散板或者匀光膜等方式，来提高发光基板100的亮度均匀性。
但是，本公开的发明人研究发现，减小相邻的两个发光元件130之间的距离D，在显示区104面积不变的情况下，会增大发光元件130的数量，从而增大发光基板100的成本。增大发光元件130的发光角度α，会增大发光元件130制备复杂度和难度，发光元件130的成本增加，同样增大了发光基板100的成本。
增大发光基板100的混光距离H，会导致发光基板100的厚度增加。而设置扩散板或者均光膜等，会增大发光基板100的雾度，降低透光率，从而减小发光区102的亮度，导致发光基板100的功耗增大。并且，设置扩散板或者匀光膜等，也会导致发光基板100的厚度增大，不利于发光基板100的减薄。
为了提高发光基板100的亮度均匀性，在一些实施例中，如图5F所示，发光基板100还包括扩散粒子164。扩散粒子164位于至少一个子结构142内。
由上述可知，调光部140中的多个子结构142环绕发光元件130。故而，设置扩散粒子164位于至少一个子结构142内，如图5G中箭头方向所示，由发光元件130直接发出的一部分光线能够照射至子结构142，被至少一个子结构142内的扩散粒子164打散，也即是光线能够在扩散粒子164的作用下发生漫反射。
被打散后的光线沿多个不同的方向传播，从而在多个子结构142对光线起到准直作用的基础上，一定程度地增大了照射至发光区102边缘处的光线强度，也即是增大了两个发光区102相邻位置处的亮度，减小发光区102边缘处与中心处的亮度差，提高各个发光区102的亮度均匀性，从而提高发光基板100的亮度均匀性，弱化发光基板100上出现的明暗区域。
在一些示例中，各个子结构142内均设置有扩散粒子164。由于多个子结构142环绕发光元件130，从而能够对发光元件130向各个方向发射的光线进行打散，提高对于光线的打散效果，增大阵列排布的多个发光区102相邻位置处的亮度，进一步弱化发光基板100上出现的明暗区域。
通过设置扩散粒子164将发光元件130发射的光线打散，来提高相邻的两个发光区102之间的亮度，弱化发光基板100上出现的明暗区域，从而能够设置更小的混光距离H，并且无需设置扩散板或者匀光膜等膜材，利于发光基板100的减薄，提高发光基板100的适用性。
可以理解地，如图5G所示，子结构142位于反射膜162和色转换膜222之间。扩散粒子164位于至少一个子结构142内，使得扩散粒子164同样位于反射膜162和色转换膜222之间，从而无需设置额外的空间容纳扩散粒子164，进一步利于发光基板100的减薄。
并且，设置多个子结构142将光线打散，来提高相邻的两个发光区102之间的亮度，弱化发光基板100上出现的明暗区域，无需增大发光元件130的数量，也无需增大发光元件130的发光角度α，降低了发光基板100的成本。
此外，扩散粒子164充分利用了照射至相邻的两个发光区102之间的光线，来弱化发光基板100上出现的明暗区域，对于发光区102的亮度影响较小，降低了发光基板100的功耗。
示例的，子结构142为透明材质或者半透明材质，使得光线能够照射至位于子结构142内的扩散粒子164。
在一些示例中，子结构142的透光率的取值范围为50％～100％。示例的，子结构的透光率的取值可以为60％、70％、80％或者90％等。可以理解地，子结构142的透光率，为穿过子结构142的光线强度，与照射至子结构142的光线强度的比值。
示例的，子结构142的材料包括树脂或者胶水。扩散粒子164的材料包括二氧化硅或者二氧化钛。
示例的，多个子结构142中的扩散粒子164的质量比(也即是一个子结构142内设置的扩散粒子164的重量，与该子结构142的重量之比)可以相同，也可以不同。
在一些示例中，扩散粒子164的质量之比的取值为15％。
本公开的实施例提供的发光基板100，通过在至少一个子结构142内设置扩散粒子164，使得扩散粒子164能够将光线打散，在更小的混光距离H下实现了更好的混光效果，提高发光区102的亮度均匀性，使得发光基板100能够具有更高的色彩对比度和更突出的色彩显示，利于终端产品(例如手机或者电脑等)的超薄设计、高显色性能和节能性能。
由上述可知，沿远离发光元件130的任一方向，调光部140中的任意两 个子结构142，相对靠近发光元件130的子结构142的高度，小于相对远离发光元件130的子结构142的高度。并且，沿远离发光元件130的任一方向，调光部140中的任意两个子结构142，相对靠近发光元件130的子结构142在衬底110上的正投影的面积，小于相对远离发光元件130的子结构142在衬底110上的正投影的面积。
也即是，沿远离发光元件130的任一方向，调光部140中的多个子结构142的高度可以逐渐增大，并且多个子结构142在衬底110上的正投影的面积也可以逐渐增大。这样一来，使得沿远离发光元件130的任一方向，调光部140中的多个子结构142的体积能够逐渐增大。可以理解地，子结构142的体积越大，能够容纳的扩散粒子164就越多，对于光线的打散效果也就越好。
如此设置，进一步提高了对照射至发光区102边缘处光线的打散效果，提高相邻的两个发光元件130之间的混光效果，增大两个发光区102相邻位置处的亮度，弱化发光基板100上出现的明暗条纹，提高发光基板100的亮度均匀性。
由上述可知，如图1A所示，发光基板100具有显示区104。在一些实施例中，如图2G所示，靠近显示区104边缘的发光元件130e的亮度，大于位于显示区104其余位置的发光元件130的亮度。
可以理解地，如图2G所示，发光元件130e发射的光线照射至发光区102e时，不容易与其他发光元件130发射的光线相混合，使得显示区104边缘处的亮度(也即是发光区102e)小于其余位置处的亮度。
故而，设置靠近显示区104边缘处的发光元件130e的亮度，大于位于显示区104其余位置的发光元件130的亮度，能够增大照射至显示区104边缘处的光线强度，从而增大显示区104边缘处的亮度(也即是增大发光区102e的亮度)，提高显示区104的亮度均匀性，从而提高发光基板100的亮度均匀性。
可以理解地，发光区102e仅用于描述靠近显示区104边缘处的发光区102，发光元件130e仅用于描述靠近显示区104边缘处的发光元件130，不对发光区102和发光元件130做进一步限定。
在一些示例中，可以增大流经发光元件130e的电流，使得发光元件130e的亮度能够增大。
由上述可知，本公开的实施例提供的发光模组200包括发光基板100。在一些实施例中，如图5A所示，发光模组200还包括至少一个透镜210。至少一个透镜210位于多个发光组件120远离衬底110的一侧。
在一些示例中，如图5A所示，透镜210罩设于发光组件120。在一些实示例中，透镜210的数量为多个。一个透镜210罩设于一个发光组件120。
在另一些示例中，透镜210的数量为一个。一个透镜210罩设于多个发光组件120。
可以理解地，设置至少一个透镜210位于多个发光组件120远离衬底110的一侧，使得发光元件130发射的光线能够照射至透镜210，并在透镜210的作用下发生反射或者折射。
也即是，通过设置透镜210，能够改变发光元件130发射光线的传播方向，提高相邻的两个发光元件130之间的亮度，提高各个发光区102的亮度均匀性，弱化发光基板100上出现的明暗区域，提高发光基板100的亮度均匀性，从而提高发光模组200的亮度均匀性。
由上述可知，发光基板100包括反射部件170，下面对反射部件170与透镜210之间的位置关系进行举例说明。
在一些示例中，反射部件170的数量为多个，透镜210的数量同样为多个。如图5A所示，一个发光组件120(包括发光元件130和调光部140)位于一个反射部件170形成的反射腔172内，一个透镜210也位于一个反射腔172内，也即是侧壁178围设于一个发光组件120和一个透镜210。
如此设置，使得反射部件170反射的光线能够照射至透镜210，并穿过透镜210照射至发光模组200之外，进一步减小相邻两个发光区102之间的串扰，提高发光模组200的亮度。
在另一些示例中，反射部件170的数量为多个，透镜210的数量为一个。多个发光组件120(包括发光元件130和调光部140)位于一个反射部件170形成的反射腔172内。透镜210靠近衬底110一侧的表面具有多个第三凹槽，各个反射部件170的侧壁178嵌入于第三凹槽内，使得透镜210能够罩设于多个反射部件170和多个发光组件120。
在又一些示例中，反射部件170的数量为一个，透镜210的数量同样为一个。多个发光组件120(包括发光元件130和调光部140)位于一个反射部件170形成的反射腔172内。透镜210同样位于一个反射部件170形成的反射腔172内，且罩设于多个发光组件120。
在又一些示例中，反射部件170的数量为一个，透镜210的数量为多个。多个发光组件120(包括发光元件130和调光部140)位于一个反射部件170形成的反射腔172内。多个透镜210同样位于一个反射部件170形成的反射腔172内，且一个透镜210罩设于一个发光组件120。
在一些示例中，如5B所示，反射部件170的底壁176上开设有限位孔146。透镜210具有限位柱，限位柱能够穿过限位孔146，与驱动电路层150或者衬底110相连接，起到对于透镜210限位的作用，避免透镜210相对于发光组件120发生偏移，提高发光模组200的可靠性。
在一些示例中，限位孔146的数量为多个，限位柱的数量与限位孔146的数量相同。示例的，限位孔146的数量可以为2个、3个或者4个等。在一些示例中，底壁176的形状为方形。限位孔146与底壁176之间的距离，为底壁176边长的六分之一。
图6A为根据又一些实施例的发光模组的结构图。
在一些实施例中，至少一个透镜210被配置为：在靠近衬底110的表面上具有至少一个第一凹槽212。调光部140中的至少一个子结构142的至少部分嵌入于第一凹槽212。
可以理解地，第一凹槽212沿衬底110至透镜210的方向开设。当第一凹槽212的数量为多个时，多个第一凹槽212的深度L1可以相同，也可以不同。多个第一凹槽212的宽度L2可以相同，也可以不同。
示例的，第一凹槽212的形状可以为长方体、圆柱体、圆锥体或者其他不规则形状。当第一凹槽212的数量为多个时，多个第一凹槽212的形状可以相同，也可以不同。
在一些示例中，调光部140中的一个子结构142的至少部分嵌入于一个第一凹槽212内。
在另一些示例中，调光部140中的多个子结构142中的一部分子结构142(两个或者更多个)的至少部分嵌入于一个第一凹槽212内。
在一些示例中，如图6A所示，第一凹槽212的深度L1，大于嵌入于该第一凹槽212内的子结构142的高度，使得子结构142能够完全嵌入于第一凹槽212内。
在另一些示例中，以发光模组200包括反射部件170为例，透镜210与反射部件170之间可以具有间隙，使得子结构142能够部分嵌入于第一凹槽212内。
如图6A中光线g所示，当发光元件130发射的一部分光线照射至第一凹槽212内时，能够被子结构142打散。被打散后的光线沿多个不同的方向传播，提高相邻的两个发光元件130之间的亮度，提高各个发光区102的亮度均匀性，弱化发光基板100上出现的明暗区域，提高发光基板100的亮度均匀性，从而提高发光模组200的亮度均匀性。并且，还能够对光线起到准直 的作用，改善发光模组200的漏光现象。
此外，设置至少一个子结构142的至少部分嵌入于第一凹槽212，一方面，使得第一凹槽212能够容纳子结构142，从而无需额外设置容纳空间，利于发光模组200的减薄。另一方面，使得第一凹槽212能够对至少一个子结构142的至少部分起到保护的作用，提高发光模组200的可靠性。
在一些实施例中，如图2A和图2B所示，至少一个第一凹槽212为环形槽。环形槽在衬底110上的正投影围绕发光元件130在衬底110上的正投影。
示例的，第一凹槽212的形状可以为圆环、矩形环或者其他不规则环形。环形槽在衬底110上的正投影围绕发光元件130在衬底110上的正投影，使得发光元件130向各个方向发射的光线，均能够照射至环形槽内，并被嵌入于环形槽内的子结构142打散，进一步提高发光模组200的亮度均匀性。
此外，由上述可知，调光部140中的多个子结构142环绕发光元件130。故而，设置环形槽在衬底110上的正投影围绕发光元件130在衬底110上的正投影，使得环绕发光元件130的多个子结构142的至少部分能够嵌入于环形槽内，利于发光模组200的减薄。
示例的，如图2A和图2B所示，发光元件130在衬底110上的正投影，位于环形槽在衬底110上的正投影的中心位置。
在一些实施例中，第一凹槽212的数量为多个。嵌入于同一个第一凹槽212内的多个子结构142的高度相同。和/或，嵌入于同一个第一凹槽212的多个子结构142在衬底110上的正投影的面积相同。
可以理解地，当第一凹槽212的数量为多个时，调光部140中的多个子结构142，一部分(两个或更多个)嵌入于一个第一凹槽212内，另一部分(两个或更多个)嵌入于另一个第一凹槽212内，又一部分(两个或更多个)嵌入于又一个第一凹槽212内。
在一些示例中，各个第一凹槽212内均嵌入有两个或更多个子结构142，进一步提高对于光线的打散效果，从而提高发光模组200的亮度均匀性。
此外，通过设置嵌入于同一个第一凹槽212内的多个子结构142的高度相同，和/或，嵌入于同一个第一凹槽212的多个子结构142在衬底110上的正投影的面积相同，能够提高调光部140的结构规整性，从而提高对于光线的准直效果，改善发光模组200的漏光现象。
在一些实施例中，如图6A所示，第一凹槽212的数量为多个。沿远离发光元件130的任一方向，任意两个第一凹槽212，相对靠近发光元件130的第一凹槽212的深度L1，小于相对远离发光元件130的第一凹槽212的深度L1。 和/或，沿远离发光元件130的任一方向，任意两个第一凹槽212，相对靠近发光元件130的第一凹槽212的宽度L2，小于相对远离发光元件130的第一凹槽212的宽度L2。
可以理解地，沿远离发光元件130的任一方向，任意两个第一凹槽212，相对靠近发光元件130的第一凹槽212的深度L1，小于相对远离发光元件130的第一凹槽212的深度L1，也即是，沿远离发光元件130的任一方向，多个第一凹槽212的深度L1逐渐增大。
沿远离发光元件130的任一方向，任意两个第一凹槽212，相对靠近发光元件130的第一凹槽212的宽度L2，小于相对远离发光元件130的第一凹槽212的宽度L2，也即是，沿远离发光元件130的任一方向，多个第一凹槽212的宽度L2逐渐增大。
由上述可知，在一些示例中，沿远离发光元件130的任一方向，调光部140中的任意两个子结构142，相对靠近发光元件130的子结构142的高度，小于相对远离发光元件130的子结构142的高度。并且，沿远离发光元件130的任一方向，调光部140中的任意两个子结构142，相对靠近发光元件130的子结构142在衬底110上的正投影的面积，小于相对远离发光元件130的子结构142在衬底110上的正投影的面积。
也即是，沿远离发光元件130的任一方向，调光部140中的多个子结构142的高度可以逐渐增大，并且多个子结构142在衬底110上的正投影的面积也可以逐渐增大。
故而，设置沿远离发光元件130的任一方向，多个第一凹槽212的深度L1逐渐增大，和/或多个第一凹槽212的宽度L2逐渐增大，使得各个第一凹槽212能够容纳下各个子结构142，避免子结构142无法嵌入于第一凹槽212内，利于发光模组200的减薄。
在一些实施例中，如图6A所示，至少一个透镜210被配置为：在远离衬底110的表面上具有凹陷部216。发光元件130在衬底110上的正投影，与凹陷部216在衬底110上的正投影的至少部分交叠。
可以理解地，发光元件130在衬底110上的正投影，与凹陷部216在衬底110上的正投影的至少部分交叠，如图6A所示，发光元件130发射的光线在照射至凹陷部216时，一部分能够穿过凹陷部216的壁面2161，照射至透镜210之外(如图6A中光线e所示)，另一部分光线能够在凹陷部216的壁面2161的反射作用下，照射至第一凹槽212(如图6A中光线f和光线g所示)。
可以理解地，照射至第一凹槽212的一部分光线能够穿过第一凹槽212， 并被嵌入于第一凹槽212内的子结构142打散(如图6A中光线g所示)。
如此设置，使得光线能够在凹陷部216的反射作用下照射至至少一个子结构142，增大了照射至至少一个子结构142的光线强度，提高至少一个子结构142对于光线的打散效果，进一步弱化发光模组200上出现的明暗区域，提高发光模组200的亮度均匀性。
照射至第一凹槽212的另一部分光线能够在第一凹槽212的壁面的反射作用下，照射至透镜210之外(如图6A中光线f所示)，进一步提高照射至两个发光区102相邻位置处的光线强度，从而提高发光基板100的亮度均匀性。
在一些示例中，凹陷部216的形状为圆锥状。发光元件130在衬底110上的正投影，落入凹陷部216在衬底110上的正投影的范围内。
在一些实施例中，透镜210还包括填充部218，填充部218填充于凹陷部216内，使得透镜210远离衬底110一侧的表面为光滑平面。可以理解地，填充部218为透明材质。填充部218的光折射率与透镜210的光折射率不同。
在一些示例中，填充部218的光折射率大于透镜210的光折射率，使得照射至凹陷部216的壁面2161的光线(也即是照射至凹陷部216和填充部218接触面的光线)，更易于透光凹陷部216和填充部218照射至透镜210之外，提高发光区102的亮度。
在另一些示例中，填充部218的光折射率小于透镜210的光折射率，使得照射至凹陷部216的壁面2161的光线(也即是照射至凹陷部216和填充部218接触面的光线)，能够在凹陷部216的壁面2161发生全反射，从而增大照射至第一凹槽212的光线强度，也即是增大了照射至子结构142的光线强度，提高扩散粒子164对于光线的打散效果，进一步提高相邻两个发光元件130之间的亮度，从而提高发光模组200的亮度均匀性。
在一些实施例中，如图6A所示，至少一个透镜210被配置为：在靠近衬底110的表面上还具有第二凹槽214。由上述可知，发光元件130包括发光部132。发光部132的至少部分位于第二凹槽214内。
可以理解地，衬底110至透镜210的方向开设，起到聚拢光线的作用。发光部132的至少部分位于第二凹槽214内，使得发光部132发射的光线能够照射至第二凹槽214的内壁，在第二凹槽214的内壁上发生折射并聚拢，减小照射至其他发光区102的光线强度，从而减小相邻的两个发光区102之间的串扰，并且还能够增大发光区102的亮度，降低发光模组200功耗。
此外，设置发光部132的至少部分位于第二凹槽214内，无需额外空间 容纳发光部132，利于发光模组200的减薄，还能够对发光部132起到保护的作用，提高发光模组200的可靠性。
在一些示例中，如图6A所示，发光模组200还包括调光膜219。调光膜219位于透镜210远离衬底110的一侧，且调光膜219在衬底110上的正投影，与凹陷部216在衬底110上的正投影至少部分交叠。
在一些示例中，调光膜219在衬底110上的正投影，覆盖凹陷部216在衬底110上的正投影。
在一些示例中，调光膜219与透镜210远离衬底110一侧的表面相贴合。
在一些示例中，透镜210的数量为多个，调光膜219的数量同样为多个，一个调光膜219位于一个透镜210远离衬底110的一侧。
可以理解地，调光膜219的不同位置具有不同的透光率，从而能够起到调节光线强度的作用，提高凹陷部216的亮度均匀性，从而能够进一步提高各个发光区102的亮度均匀性，也即是提高发光模组200的亮度均匀性。
图6B为根据一些实施例的调光膜的爆炸图。
在一些示例中，如图6B所示，调光膜219包括第一调光膜2191、第二调光膜2192、第三调光膜2193和第四调光膜2194。
示例的，第一调光膜2191为透明膜，且第一调光膜2191与透镜210远离衬底110的一侧表面相贴合。
示例的，第二调光膜2192、第三调光膜2193和第四调光膜2194通过印刷或者蒸镀等方式，层叠设置在第一调光膜2191远离透镜210的一侧。
示例的，第二调光膜2192、第三调光膜2193和第四调光膜2194的透光率可以相同，也可以不同。
第二调光膜2192在衬底110上的正投影，落入第一调光膜2191在衬底110上的正投影的范围内。第三调光膜2193在衬底110上的正投影，落入第二调光膜2192在衬底110上的正投影的范围内。第四调光膜2194在衬底110上的正投影，落入第三调光膜2193在衬底110上的正投影的范围内。
示例的，第一调光膜2191、第二调光膜2192、第三调光膜2193和第四调光膜2194的中心相互重合。
示例的，如图6B所示，第二调光膜2192和第四调光膜2194上具有透光孔2195。可以理解地，由于第一调光膜2191、第二调光膜2192、第三调光膜2193和第四调光膜2194层叠设置，可以通过调节透光孔2195的位置和大小，即可使得调光膜219在不同的位置具有不同的透光率，起到提高发光区102的亮度均匀性的作用。
在一些示例中，透光孔2195为圆形。在另一些示例中，透光孔2195也可以为正多边形、正星形多角形等形状，本公开的实施例对透光孔2195的形状不做进一步限定。
在一些示例中，如图6B所示，开设于第四调光膜2194上的透光孔2195位于第四调光膜2194的中心位置。
在一些示例中，如图6B所示，第一调光膜2191为矩形，第三调光膜2193和第四调光膜2194均为正星形十六角形且互为相似形，但第三调光膜2193的面积待与第四调光膜2194。第二调光膜2192包括由两个同轴设置的轮廓为正星形三十二角形构成的环形结构21921，即第二调光膜2192的透光孔2195为正星形三十二角形，以及环绕该环形结构21921的多个分立设置的圆形图案21922和21923。且沿远离第二调光膜2192的几何中心的任一方向，任意相邻的两个圆形图案，相对靠近第二调光膜2192的中心位置的圆形图案21922的面积，小于相对远离第二调光膜2192的中心位置的圆形图案21923的面积。
也即是，沿远离第二调光膜2192的中心位置的任一方向，开设于第二调光膜2192上的多个透光孔2195的面积依次增大。
在一些示例中，如图6B所示，第二调光膜2192包括第一子膜和第二子膜。第一子膜呈圆形或者近似圆形，第二子膜呈八角星形。第一子膜与第一调光膜2191远离透镜210的一侧表面相贴合，第二子膜与第一子膜远离第一调光膜2191的一侧表面相贴合。开设于第二调光膜2192上的透光孔2195贯穿第一子膜，或贯穿第一子膜和第二子膜。
在一些示例中，第三调光膜2193上也可以设置有透光孔2195，使得调光膜219能够满足不同的透光率需求。
在另一些示例中，第一调光膜2191、第二调光膜2192、第三调光膜2193和第四调光膜2194也可以为其他的规则或者不规则的形状。
在一些示例中，第一调光膜2191的厚度的取值范围为为2.0μm～10μm，示例的，第一调光膜2191的厚度可以为3μm、5μm、7μm、8μm或者9μm等。
在一些示例中，第一调光膜2191的材料包括聚对苯二甲酸乙二醇酯(英文全称：Polyethylene terephthalate，英文简称：PET)。
在一些示例中，第二调光膜2192的厚度的取值范围为为2.0μm～10μm。示例的，第二调光膜2192的厚度可以为3μm、5μm、7μm、8μm或者9μm等。
在一些示例中，第三调光膜2193的厚度的取值范围为为2.0μm～10μm。示例的，第三调光膜2193的厚度可以为3μm、5μm、7μm、8μm或者9μm等。
在一些示例中，第四调光膜2194的厚度的取值范围为为2.0μm～10μm。 示例的，第四调光膜2194的厚度可以为3μm、5μm、7μm、8μm或者9μm等。
可以理解地，第一调光膜2191、第二调光膜2192、第三调光膜2193和第四调光膜2194的厚度可以相同，也可以不同。
示例的，第二调光膜2192、第三调光膜2193和第四调光膜2194的材料包括树脂，例如为对聚氨酯系树脂薄片进行冲裁(例如维多利亚式冲裁加工等)而得到的；例如还可以采用尼龙等其他合成树脂；以及可以通过印刷、蒸镀等将具有特定图案的树脂材料直接形成在透镜210上。
在另一些示例中，调光膜219也可以不包括第一调光膜2191，而仅仅包括第二调光膜2192、第三调光膜2193和第四调光膜2194。第二调光膜2192、第三调光膜2193和第四调光膜2194层叠设置于透镜210远离衬底110一侧的表面。
在一些实施例中，发光元件130被配置为发白光。
由上述可知，发光元件130包括发光部132。在一些示例中，可以在发光部132的出光面设置荧光粉，通过荧光粉对发光部132发出的单色光进行调制，调制后的光线与发光部132发出的单色光相混合，使得发光元件130能够发白光。
示例的，当发光部132发蓝光时，可以在发光部132的出光面设置黄色荧光粉。黄色荧光粉在光照下能够发黄光，黄光与发光部132发出的蓝光混合，使得发光元件130能够发白光。
示例的，当发光部132发蓝光时，还可以在发光部132的出光面设置红色荧光粉和绿色荧光粉，红色荧光粉在光照下能够发红光，绿色荧光粉在光照下能够发绿光，红光与绿光混合能够得到黄光。黄光与发光部132发出的蓝光混合，使得发光元件130能够发白光。
在另一些示例中，发光元件130包括第一子发光元件、第二子发光元件和第三子发光元件。第一子发光元件被配置为发红光，第二子发光元件被配置为发绿光，第三子发光元件被配置为发蓝光。将红光、绿光和蓝光混合，即可使得发光元件130发出白光。
示例的，第一子发光元件、第二子发光元件和第三子发光元件的数量可以相同，也可以不同。
可以理解地，发光元件130被配置为发白光，对白光进行过滤等处理，即可得到不同颜色的光，也即是使得发光模组200能够发出不同颜色的光，提高发光模组200的适用性。
由上述可知，在一些实施例中，发光元件130被配置为发白光。在另一 些实施例中，发光元件130被配置为发单色光。示例的，单色光可以为蓝光。
图6C为根据一些实施例的第一发光元件和第一调光部的结构图。
由上述可知，如图6C所示，发光模组200还包括色转换膜222。色转换膜222位于至少一个透镜210远离发光元件130的一侧。
可以理解地，色转换膜222位于至少一个透镜210远离发光元件130的一侧，使得发光元件130发出的单色光能够照射至色转换膜222，并且被色转换膜222转换为红光、绿光和蓝光。可以理解地，将不同强度的红光、绿光和蓝光混合，能够得到彩色光线，从而使得发光模组200能够显示彩色图像。
由上述可知，色转换膜222为量子点膜2221。在一些实施例中，如图5G所示，发光元件130包括第一发光元件136。第一发光元件136在衬底110上的正投影，靠近量子点膜2221在衬底110上的正投影的边缘。调光部140包括第一调光部144，第一调光部144环绕第一发光元件136。
可以理解地，本公开的实施例中，第一发光元件136仅用于描述在衬底110上的正投影，靠近量子点膜2221在衬底110上的正投影的边缘的发光元件130，不对发光元件130做进一步限定。第一调光部144仅用于描述环绕第一发光元件136的调光部140，不对调光部140做进一步限定。
图6D为根据一些实施例的量子点膜的边缘区的结构图。图6E为根据另一些实施例的量子点膜的边缘区的结构图。图6F为根据又一些实施例的量子点膜的边缘区的结构图。
在一些示例中，如图6D所示，量子点膜2221在衬底110上的正投影，具有边缘区域Q1和中心区域Q2，边缘区域Q1环绕中心区域Q2。边缘区域Q1与中心区域Q2之间具有分界线m，量子点膜2221在衬底110上的正投影具有边缘n。
可以理解地，第一发光元件136在衬底110上的正投影，靠近量子点膜2221在衬底110上的正投影的边缘，也即是，第一发光元件136在衬底110上的正投影，落入量子点膜2221在衬底110上的正投影的边缘区域Q1。
可以理解地，量子点膜2221的边缘处因氧化等原因，容易失效，导致边缘处无法将发光元件130发出的蓝光转化为红光和绿光，从而使得发光模组200的边缘处容易出现蓝光漏光现象，影响发光模组200的发光性能。
为了改善发光模组200的边缘处出现的蓝光漏光现象，如图6C所示，发光模组200还包括荧光粒子224。荧光粒子224位于第一调光部144中的至少一个子结构142内。荧光粒子224被配置为对照射至荧光粒子224的光线进行调制，使调制后的光线与发光元件130发射出的未被调制过的光线混合为 白光。
可以理解地，荧光粒子224被配置为对照射至荧光粒子224的光线进行调制，也即是荧光粒子224能够在光线的照射下发光。由于第一发光元件136在衬底110上的正投影，靠近量子点膜2221在衬底110上的正投影的边缘(也即是，第一发光元件136在衬底110上的正投影，落入量子点膜2221在衬底110上的正投影的边缘区域Q1)，故而将荧光粒子224设置于第一调光部144中的至少一个子结构142内，使得荧光粒子224能够对发光元件130发出的单色光进行调制。调制后的光线与发光元件130发出的单色光相混合，形成白光，改善发光模组200的边缘处出现的蓝光漏光现象，提高发光模组200的发光性能。
在一些示例中，边缘区域Q1与中心区域Q2的分界线m，与量子点膜2221在衬底110上的正投影的边缘为n之间的距离(图6D中L7所示)小于或等于2mm。
示例的，如图6D所示，以量子点膜2221的宽度为L3，长度为L4。量子点膜2221在衬底110上的正投影的中心区Q2的宽度L5小于L3，长度L6小于L4。并且，中心区域Q2的几何中心，与量子点膜2221的几何中心几乎同轴，使得分界线m与边缘n在垂直于对应边缘延伸方向上的距离(图6D中L7所示)基本相同，例如均为2mm左右。
在一些示例中，第一调光部144中的多个子结构142内均设置有荧光粒子224。
示例的，多个子结构142中荧光粒子224的质量比(也即是一个子结构142内设置的荧光粒子224的重量，与该子结构142的重量之比)可以相同，也可以不同。
在一些示例中，荧光粒子224的质量之比的取值为5％。
由上述可知，在一些示例中，子结构142的透光率的取值范围为50％～100％。
在一些示例中，当子结构142内设置有荧光粒子224时，子结构142的透光率的取值范围为80％～100％。如此设置，能够增大照射至子结构142内的光线强度，从而增大照射至荧光粒子224的光线强度，提高荧光粒子224对于发光元件130发出光线的调制效果，进一步改善发光模组200的边缘处出现的蓝光漏光现象，提高发光模组200的发光性能。
由上述可知，在一些示例中，沿远离发光元件130的任一方向，调光部140中的任意两个子结构142，相对靠近发光元件130的子结构142的高度， 小于相对远离发光元件130的子结构142的高度。并且，沿远离发光元件130的任一方向，调光部140中的任意两个子结构142，相对靠近发光元件130的子结构142在衬底110上的正投影的面积，小于相对远离发光元件130的子结构142在衬底110上的正投影的面积。
也即是，沿远离发光元件130的任一方向，调光部140中的多个子结构142的高度可以逐渐增大，调光部140中的多个子结构142在衬底110上的正投影的面积也可以逐渐增大。
在一些示例中，沿远离发光元件130的任一方向，第一调光部144中的多个子结构142的高度可以逐渐增大，也可以相同或者近似相同。
在一些示例中，沿远离发光元件130的任一方向，第一调光部144中的多个子结构142在衬底110上的正投影的面积可以逐渐增大，也可以相同或者近似相同。
在一些示例中，沿远离第一发光元件136的任一方向，第一调光部144中的多个子结构142在衬底110上的正投影的面积相同，第一调光部144中的多个子结构142的高度逐渐增大。并且，多个子结构142中的荧光粒子224的质量比相同。如此设置，无需对不同的子结构142中荧光粒子224的质量比进行调节，简化了制备工艺。
在另一些示例中，沿远离第一发光元件136的任一方向，第一调光部144中的多个子结构142在衬底110上的正投影的面积逐渐增大，第一调光部144中的多个子结构142的高度相同。并且，多个子结构142中的荧光粒子224的质量比相同。如此设置，同样无需对不同的子结构142中荧光粒子224的质量比进行调节，简化了制备工艺。
在又一些示例中，沿远离第一发光元件136的任一方向，第一调光部144中的多个子结构142在衬底110上的正投影的面积相同，第一调光部144中的多个子结构142的高度逐渐增大。并且，各个子结构142中，荧光粒子224的质量比不同。
示例的，可以设置沿远离第一发光元件136的任一方向，多个子结构142中的荧光粒子224的质量比逐渐增大，进一步改善发光模组200的边缘处出现的蓝光漏光现象，提高发光模组200的发光性能。
在一些示例中，荧光粒子224的质量比的取值范围为5％～12％。示例的，荧光粒子224的质量比的取值范围可以为6％～10％、7％～9％或者7.5％～8.5％等。示例的，荧光粒子224的质量比可以为5.5％、6.5％或者7.5％等。
在一些示例中，如图6D和图6E所示，若多个发光元件之间以小于边缘 区域Q1的尺寸的间隔分布，则至少存在一个发光区102，其在衬底110上的正投影，完全落入量子点膜2221在衬底110上的正投影的边缘区域Q1内。也即是，位于发光区102内的发光组件120(包括第一发光元件136和第一调光部144)在衬底110上的正投影，均落入到量子点膜2221在衬底110上的正投影的边缘区域Q1内。
示例的，如图6D所示，在衬底110上的正投影落入边缘区域Q1内的多个发光区102呈环状的方式排布。示例的，在衬底110上的正投影落入边缘区域Q1内的多个发光区102可以呈圆环、椭圆环、矩形环、多边形环或者其他不规则环的方式排布。
示例的，如图6E所示，在衬底110上的正投影落入边缘区域Q1内的多个发光区102呈至少两个同心环状的方式排布。示例的，在衬底110上的正投影落入边缘区域Q1内的多个发光区102可以呈至少两个同心圆环、至少两个同心椭圆环、至少两个同心矩形环、至少两个同心多边形环或者至少两个同心其他不规则环的方式排布。
在另一些示例中，若多个发光元件之间以20-50mm的间距分布，即多个第一发光元件136之间也以20mm-50mm的间距分布，则每个第一发光元件136在衬底110上的正投影仅有一部分落入边缘区Q1内。而围设于第一发光元件136的第一调光部144中，一部分子结构142(两个或者更多个)在衬底110上的正投影，落入边缘区域Q1内(称为第一子结构)，另一部分子结构142(两个或者更多个)在衬底110上的正投影，落入中心区域Q2内(称为第二子结构)。如图6F所示，也即是发光区102在衬底110上的正投影，一部分落入边缘区域Q1内，另一部分落入中心区域Q2内。
这样一来，可以将荧光粒子224设置于至少一个第一子结构内(也即是在衬底110上的正投影落入边缘区域Q1内的子结构142)，而在第二子结构内不设置荧光粒子224(也即是在衬底110上的正投影落入中心区域Q2内的子结构142)，节约荧光粒子224的用量，简化制备工艺，降低发光模组200的成本。
在一些实施例中，发光元件130被配置为发射蓝光，荧光粒子224包括黄色荧光粒子。或，发光元件130被配置为发射蓝光，荧光粒子224包括红色荧光粒子和绿色荧光粒子。
可以理解地，蓝光与黄光能够混合为白光，红光和绿光能够混合为黄光。故而，在一些示例中，设置荧光粒子224包括黄色荧光粒子，也即是荧光粒子224能够在光线的照射下发出黄光。荧光粒子224发出的黄光与发光元件 130发出的蓝光相混合，以形成白光。
在另一些示例中，设置荧光粒子224包括红色荧光粒子和绿色荧光粒子，也即是荧光粒子224能够在光线的照射下发出红光和绿光。红光和绿光能够混合为黄光，黄光与发光元件130发出的蓝光相混合，以形成白光。
图6G为根据又一些实施例的发光模组的结构图。图6H为根据又一些实施例的发光模组的结构图。
在一些实施例中，如图6G所示，发光模组200还包括增亮膜226。增亮膜226位于色转换膜222远离至少一个透镜210的一侧。
可以理解地，增亮膜226起到增大显示区104亮度的作用，从而降低发光模组200的功耗。在一些示例中，增亮膜226包括棱镜。光线照射至棱镜时，能够在棱镜的作用下发生反射或者折射，从而增大发光模组200的亮度。
在另一些示例中，增亮膜226包括流延聚丙烯薄膜(英文全称：Cast Polypropylene，英文简称：CPP)。
在一些示例中，如图6G所示，发光模组200还包括封装面板228。封装面板228位于增亮膜226远离色转换膜222的一侧。可以理解地，封装面板228起到保护和封装的作用。
可以理解地，封装面板228为透明材质，使得光线能够经由封装面板228照射至发光模组200之外。示例的，封装面板228的材料包括玻璃。
在一些示例中，如图6H所示，发光模组200还包括胶框202，胶框202用于支撑封装面板228。
在一些示例中，发光模组200还包括扩散膜。扩散膜位于增亮膜226和封装面板228之间，起到匀光的作用，进一步提高发光模组200的亮度均匀性。
在一些示例中，如图6H所示，发光模组200还包括匀光膜204，匀光膜204位于透镜210和色转换膜222之间，起到匀光的作用，进一步提高发光模组200的亮度均匀性。
图7A为根据一些实施例的显示装置的结构图。图7B为根据另一些实施例的显示装置的结构图。
另一方面，如图7A和图7B所示，提供了一种显示装置300。显示装置300包括背光模组310和液晶显示面板320。液晶显示面板320位于背光模组310的出光侧。其中，如图7A所示，背光模组310包括如上述的发光基板100。或，如图7B所示，背光模组310包括如上述的发光模组200。
本公开的实施例提供的显示装置300包括如上述的发光基板100，或者包 括如上述的发光模组200，因此具备上述的全部有益效果，在此不再赘述。
可以理解地，显示装置300可以显示动态图像信息，例如视频或者游戏画面，也可以显示静态图像信息，例如图像或者照片。
在一些实施例中，显示装置300可以为移动电话、无线装置、个人数据助理(PDA)、手持式或便携式计算机、GPS接收器/导航器、相机、MP4视频播放器、摄像机、游戏控制台、手表、时钟、计算器、电视监视器、平板显示器、计算机监视器、汽车显示器(例如，里程表显示器等)、导航仪、座舱控制器和/或显示器、相机视图的显示器(例如，车辆中后视相机的显示器)、电子相片、电子广告牌或指示牌、投影仪、包装和美学结构(例如，对于一件珠宝的图像的显示器)等。
示例的，液晶显示面板320位于背光模组310的出光侧，也即是背光模组310发出的光线能够照射至液晶显示面板320。下面对液晶显示面板320进行举例说明。
示例的，如图7A和图7B所示，液晶显示面板320包括阵列基板326、液晶层324和对置基板322。阵列基板326位于背光模组310的出光侧，液晶层324位于阵列基板326远离背光模组310的一侧。对置基板322位于液晶层324远离阵列基板326的一侧。
可以理解地，如图7B所示，以背光模组310包括如上述的发光模组200为例，光线经由发光模组200的出光侧射出，并照射至液晶层324。通过调节液晶层324中液晶分子的排布方式，能够对透过液晶层324的光线强度起到调节作用，从而对射出液晶显示面板320的光线强度起到调节作用，使得显示装置300实现彩色图像的显示功能。
图7C为根据又一些实施例的显示装置的结构图。图7D为根据又一些实施例的显示装置的结构图。
又一方面，如图7C和图7D所示，本公开的实施例提供了一种显示装置400。显示装置400包括显示面板410。显示面板410包括如上述的发光基板100。或，显示面板410包括如上述的的发光模组200。
本公开的实施例提供的显示装置400包括如上述的发光基板100或者，包括如上述的发光模组200，因此具有上述的全部有益效果，在此不再赘述。
可以理解地，显示装置400可以显示动态图像信息，例如视频或者游戏画面，也可以显示静态图像信息，例如图像或者照片。
在一些实施例中，显示装置400可以为移动电话、无线装置、个人数据助理(PDA)、手持式或便携式计算机、GPS接收器/导航器、相机、MP4视频 播放器、摄像机、游戏控制台、手表、时钟、计算器、电视监视器、平板显示器、计算机监视器、汽车显示器(例如，里程表显示器等)、导航仪、座舱控制器和/或显示器、相机视图的显示器(例如，车辆中后视相机的显示器)、电子相片、电子广告牌或指示牌、投影仪、包装和美学结构(例如，对于一件珠宝的图像的显示器)等。
在一些示例中，如图7C和图7D所示，显示面板410还包括保护盖板420。保护盖板420位于发光元件130远离衬底110的一侧。可以理解地，保护盖板410起到保护发光基板100(或发光模组200)的作用。
在一些实施例中，可以设置衬底110为柔性衬底，使得发光基板100或者发光模组200能够弯曲，从而使得显示装置400能够实现曲面显示，例如显示装置400的边缘呈弯曲状，提高显示装置400的显示效果。
以上所述，仅为本公开的具体实施方式，但本公开的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本公开揭露的技术范围内，想到变化或替换，都应涵盖在本公开的保护范围之内。因此，本公开的保护范围应以所述权利要求的保护范围为准。

Claims (28)

  1. 一种发光基板，包括：
    衬底；
    多个发光组件，位于所述衬底的一侧；至少一个发光组件包括发光元件以及环绕所述发光元件设置的调光部；所述调光部包括多个子结构，所述多个子结构相互间隔；
    其中，沿远离所述发光元件的任一方向，所述调光部中的任意两个子结构，相对靠近所述发光元件的子结构的高度，小于相对远离所述发光元件的子结构的高度。
  2. 根据权利要求1所述的发光基板，其中，沿远离所述发光元件的任一方向，所述调光部中的任意两个子结构，相对靠近所述发光元件的子结构在所述衬底上的正投影的面积，小于相对远离所述发光元件的子结构在所述衬底上的正投影的面积。
  3. 根据权利要求1或2所述的发光基板，还包括：
    驱动电路层，位于所述衬底的一侧；所述驱动电路层包括金属走线和导电衬垫，所述导电衬垫与所述金属走线电连接；
    反射膜，位于所述驱动电路层远离所述衬底的一侧；且所述反射膜裸露出所述导电衬垫；
    所述发光元件包括发光部和引脚，所述发光部位于所述反射膜远离所述驱动电路层的一侧，所述引脚与所述导电衬垫电连接；所述调光部中的多个子结构位于所述反射膜远离所述驱动电路层的一侧表面。
  4. 根据权利要求1或2所述的发光基板，还包括：
    驱动电路层，位于所述衬底的一侧；所述驱动电路层包括金属走线和导电衬垫，所述导电衬垫与所述金属走线电连接；
    反射部件，位于所述驱动电路层远离所述衬底的一侧；所述反射部件围设形成反射腔，所述反射部件具有连通孔；
    所述发光元件包括发光部和引脚，所述发光部位于所述反射腔，所述引脚通过所述连通孔与所述导电衬垫电连接；所述调光部中的多个子结构位于所述反射腔。
  5. 根据权利要求4所述的发光基板，其中，所述反射部件包括：
    底壁，具有所述连通孔；所述调光部中的多个子结构位于所述底壁上；
    侧壁，所述侧壁的一端与所述底壁相连接，另一端沿所述底壁远离所述衬底的方向延伸；所述侧壁与所述底壁围设形成所述反射腔。
  6. 根据权利要求5所述的发光基板，其中，所述侧壁与所述底壁相垂直。
  7. 根据权利要求5或6所述的发光基板，其中，所述侧壁远离所述底壁的边缘，在平行于所述侧壁的参考面上的正投影的形状为连续的多个曲线或连续的多个折线。
  8. 根据权利要求1～7中任一项所述的发光基板，其中，沿远离所述发光元件的任一方向，所述调光部中的多个子结构位于一条直线上。
  9. 根据权利要求1～7中任一项所述的发光基板，其中，至少一个所述子结构的形状为圆锥体、棱锥体、圆台体、棱台体和半球体中的一个。
  10. 根据权利要求1～7中任一项所述的发光基板，其中，所述调光部中的多个子结构的高度的取值范围为250μm～1000μm。
  11. 根据权利要求1～7中任一项所述的发光基板，其中，沿远离所述发光元件的任一方向，所述调光部中任意相邻的两个子结构的高度差的绝对值的取值范围为200μm～300μm。
  12. 根据权利要求11所述的发光基板，其中，沿远离所述发光元件的任一方向，所述调光部中任意相邻的两个子结构的高度差的绝对值，与另外任意相邻的两个子结构的高度差的绝对值相等。
  13. 根据权利要求1～7中任一项所述的发光基板，还包括：
    扩散粒子，位于至少一个所述子结构内。
  14. 根据权利要求1～7中任一项所述的发光基板，其中，所述发光基板具有显示区；靠近所述显示区边缘的所述发光元件的亮度，大于位于所述显示区其余位置的所述发光元件的亮度。
  15. 一种发光模组，包括：
    如权利要求1～14中任一项所述的发光基板；
    至少一个透镜，位于所述多个发光组件远离所述衬底的一侧。
  16. 根据权利要求15所述的发光模组，其中，所述至少一个透镜被配置为：在靠近所述衬底的表面上具有至少一个第一凹槽；
    所述调光部中的至少一个子结构的至少部分嵌入于所述第一凹槽内。
  17. 根据权利要求16所述的发光模组，其中，至少一个所述第一凹槽为环形槽；所述环形槽在所述衬底上的正投影围绕所述发光元件在所述衬底上的正投影。
  18. 根据权利要求16或17所述的发光模组，其中，所述第一凹槽的数量为多个，嵌入于同一个所述第一凹槽内的多个子结构的高度相同；和/或，
    嵌入于同一个所述第一凹槽内的多个子结构在所述衬底上的正投影的面 积相同。
  19. 根据权利要求16或17述的发光模组，其中，所述第一凹槽的数量为多个；
    沿远离所述发光元件的任一方向，任意两个所述第一凹槽，相对靠近所述发光元件的所述第一凹槽的深度，小于相对远离所述发光元件的所述第一凹槽的深度；和/或，
    沿远离所述发光元件的任一方向，任意两个所述第一凹槽，相对靠近所述发光元件的所述第一凹槽的宽度，小于相对远离所述发光元件的所述第一凹槽的宽度。
  20. 根据权利要求15～19中任一项所述的发光模组，其中，所述至少一个透镜被配置为：在远离所述衬底的表面上具有凹陷部；所述发光元件在所述衬底上的正投影，与所述凹陷部在所述衬底上的正投影的至少部分交叠。
  21. 根据权利要求15～19中任一项所述的发光模组，其中，所述至少一个透镜被配置为：在靠近所述衬底的表面上还具有第二凹槽；所述发光元件包括发光部，所述发光部的至少部分位于所述第二凹槽内。
  22. 根据权利要求15～19中任一项所述的发光模组，其中，所述发光元件被配置为发白光。
  23. 根据权利要求15～19中任一项所述的发光模组，其中，所述发光元件被配置为发单色光；所述发光模组还包括：
    色转换膜，位于所述至少一个透镜远离所述发光元件的一侧。
  24. 根据权利要求23所述的发光模组，其中，所述色转换膜为量子点膜；
    所述发光元件包括第一发光元件，所述第一发光元件在所述衬底上的正投影，靠近所述量子点膜在所述衬底上的正投影的边缘；所述调光部包括第一调光部，所述第一调光部环绕所述第一发光元件；
    所述发光模组还包括荧光粒子，所述荧光粒子位于所述第一调光部中的至少一个子结构内；所述荧光粒子被配置为对照射至荧光粒子的光线进行调制，使调制后的光线与所述发光元件发射出的未被调制过的光线混合为白光。
  25. 根据权利要求24所述的发光模组，其中，所述发光元件被配置为发射蓝光，所述荧光粒子包括黄色荧光粒子；或，
    所述发光元件被配置为发射蓝光，所述荧光粒子包括红色荧光粒子和绿色荧光粒子。
  26. 根据权利要求23～25中任一项所述的发光模组，还包括：
    增亮膜，位于所述色转换膜远离所述至少一个透镜的一侧。
  27. 一种显示装置，包括：
    背光模组；和，
    液晶显示面板，位于所述背光模组的出光侧；
    其中，所述背光模组包括如权利要求1～14中任一项所述的发光基板；或，所述背光模组包括如权利要求15～26中任一项所述的发光模组。
  28. 一种显示装置，包括显示面板；
    其中，所述显示面板包括如权利要求1～14中任一项所述的发光基板；或，所述显示面板包括如权利要求15～26中任一项所述的发光模组。
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