WO2023183135A1

WO2023183135A1 - Methods and apparatus for manufacturing an electronic apparatus

Info

Publication number: WO2023183135A1
Application number: PCT/US2023/014775
Authority: WO
Inventors: Joon-Soo Kim; Young Suk Lee; Hyung Soo Moon; Toru Nakamura; Cheol Hee Park
Original assignee: Corning Incorporated
Priority date: 2022-03-22
Filing date: 2023-03-08
Publication date: 2023-09-28
Also published as: TW202404914A

Abstract

A method of manufacturing an electronic apparatus includes moving a glass substrate along a travel path at a travel velocity. The method includes rotating a first roller such that a first outer peripheral location of the first roller travels at a roller velocity matching the travel velocity. The first roller is at a first temperature greater than about 25° C. The method includes contacting a film with the first roller to heat the film to the first temperature. The film includes an adhesive layer and an electrically-conductive layer attached to the adhesive layer. A curing temperature of the adhesive layer is greater than the first temperature. The method includes attaching the heated film to a first major surface of the glass substrate to form a glass article. An electronic apparatus is provided.

Description

METHODS AND APPARATUS FOR MANUFACTURING AN ELECTRONIC

APPARATUS

CROSS-REFERENCE TO RELATED APPLICATIONS

[0001] This application claims the benefit of priority under 35 U.S. C. § 119 of U.S. Provisional Application Serial No. 63/322393 filed on March 22, 2022, the content of which is relied upon and incorporated herein by reference in its entirety.

FIELD

[0002] The present disclosure relates generally to methods for manufacturing an electronic apparatus and, more particularly, to methods for manufacturing an electronic apparatus with a glass substrate.

BACKGROUND

[0003] It is known to manufacture an electronic apparatus with a film applied to a substrate. The film can comprise an electrically-conductive layer that can be electrically connected to an electronic device. However, application of the film to the substrate is inefficient and costly. For example, a vacuum-hot press (VHP) machine has been used to apply the film to the substrate, wherein the VHP machine applies a pressure to the substrate. However, VHP machine application of the film poses several drawbacks. In particular, the VHP machine is costly and occupies a relatively large space. Further, there are difficulties in maintaining a uniform pressure on the film with the VHP machine at all locations of the film. Further, due the pressure applied by the VHP the risk of breakage of the substrate is high. In addition, there are limitations on the type of material that can be used for the film. For example, warpage of the substrate and bubbling of the film can result from the application of the film to the substrate.

SUMMARY

[0004] The following presents a simplified summary of the disclosure to provide a basic understanding of some aspects described in the detailed description. [0005] There are set forth methods of manufacturing an electronic apparatus comprising a glass substrate. A film can be applied to a major surface of the glass substrate, wherein the film comprises an adhesive layer and an electrically-conductive layer. The film can contact one or more rollers prior to being applied to the glass substrate. The rollers can be heated, which can allow for gradual heating of the film prior to reaching the glass substrate. By gradually heating the film, bubbling and/or wrinkling of the film after application can be minimized. To reduce warp of the glass substrate, the adhesive layer can be selected with a relatively low curing temperature. The low curing temperature of the adhesive layer can reduce the temperature to which the glass substrate and electrically-conductive layer are exposed, thus limiting a thermal expansion and thermal contraction of the glass substrate and the electrically-conductive layer. To further reduce warp and/or protect the glass substrate, a compensation layer may be applied to a major surface of the glass substrate opposite the film. Likewise, a protective layer can be applied between the adhesive layer and the electrically- conductive layer.

[0006] In aspects, methods of manufacturing an electronic apparatus can comprise moving a glass substrate along a travel path at a travel velocity. Methods can comprise rotating a first roller such that a first outer peripheral location of the first roller travels at a roller velocity matching the travel velocity. The first roller can comprise a first temperature greater than about 25° C. Methods can comprise contacting a film with the first roller to heat the film to the first temperature. The film can comprise an adhesive layer with a curing temperature greater than the first temperature, and an electrically-conductive layer attached to the adhesive layer. Methods can comprise attaching the heated film to a first major surface of the glass substrate to form a glass article.

[0007] In aspects, after contacting the film with the first roller, methods can comprise rotating a second roller such that a second outer peripheral location of the second roller travels at the roller velocity. The second roller can comprise a second temperature substantially equal to the curing temperature. Methods can comprise contacting the film with the second roller to further heat the film to the second temperature. [0008] In aspects, after attaching the heated film to the first major surface, methods can comprise curing the film by exposing the glass article to the curing temperature.

[0009] In aspects, the first roller can be separated a distance from the second roller less than about: k x A

6704.5 ppm x - a x q

, wherein k is a thermal conductivity of the film, A is a cross-sectional area of the film, a is a coefficient of thermal expansion of the film, and q is a heat transfer rate of the film.

[0010] In aspects, methods can comprise applying a compensation layer, with a stress substantially equal to a stress in the film, to a second major surface of the glass substrate.

[0011] In aspects, the compensation layer may comprise one or more of polyimide, FR-4, polyethylene terephthalate, polypropylene, epoxy, acrylate, or methacrylate polymers.

[0012] In aspects, the electrically-conductive layer can comprise a copper foil.

[0013] In aspects, methods of manufacturing an electronic apparatus can comprise moving a glass substrate along a travel path at a travel velocity. Methods can comprise rotating a first roller such that a first outer peripheral location of the first roller travels at a roller velocity matching the travel velocity. The first roller can comprise a first temperature. Methods can comprise contacting a film with the first roller to heat the film to the first temperature. The film can comprise an adhesive layer with a curing temperature greater than the first temperature, and an electrically-conductive layer attached to the adhesive layer. Methods can comprise rotating a second roller such that a second outer peripheral location of the second roller travels at the roller velocity. The second roller can comprise a second temperature greater than the first temperature. Methods can comprise contacting the film with the second roller to further heat the film to the second temperature. Methods can comprise attaching the heated film at the second temperature to a first major surface of the glass substrate.

[0014] In aspects, the first roller can be separated a distance from the second roller less than about: k x A

6704.5 ppm x - a x q , wherein k is a thermal conductivity of the film, A is a cross-sectional area of the film, a is a coefficient of thermal expansion of the film, and q is a heat transfer rate of the film.

[0015] In aspects, the firstroller can be rotated about a first axis and the second roller can be rotated about a second axis, with the first axis and the second axes lying in a plane substantially parallel to the first major surface.

[0016] In aspects, the firstroller can be rotated about a first axis and the second roller can be rotated about a second axis. The first axis and the second axis can lie in a plane that intersects the first major surface.

[0017] In aspects, the first roller and the second roller can be spaced a first distance less than or equal to a thickness of the film from the first major surface.

[0018] In aspects, the first roller can be spaced a first distance from the first major surface and the second roller can be spaced a second distance from the first major surface, with the second distance less than the first distance.

[0019] In aspects, an electronic apparatus can comprise a glass substrate comprising a first major surface and a second major surface opposite the first major surface. The electronic apparatus can comprise an adhesive layer, curable at a temperature less than about 25° C, attached to the first major surface. The electronic apparatus can comprise an electrically-conductive layer attached to the adhesive layer such that the adhesive layer is positioned between the glass substrate and the electrically-conductive layer. The glass substrate, the adhesive layer, and the electrically-conductive layer can comprise a warpage of less than about 1 mm for a sample size of 230 x 230 mm².

[0020] In aspects, a protective layer can be attached to the adhesive layer and positioned between the adhesive layer and the electrically-conductive layer. The protective layer can comprise one or more of polyimide, FR-4, polyethylene terephthalate, polypropylene, epoxy, acrylate, or methacrylate polymers.

[0021] In aspects, the adhesive layer can comprise one of a pressure sensitive adhesive or a B-stage epoxy.

[0022] In aspects, the electrically-conductive layer can comprise a copper foil.

[0023] In aspects, a compensation layer can be attached to the second major surface. The compensation layer can comprise a stress substantially equal to a combined stress of the adhesive layer and the electrically-conductive layer. [0024] In aspects, the compensation layer can comprise one or more of polyimide, FR-4, polyethylene terephthalate, polypropylene, epoxy, acrylate, or methacrylate polymers.

[0025] Additional features and advantages of the aspects disclosed herein will be set forth in the detailed description that follows, and in part will be clear to those skilled in the art from that description or recognized by practicing the aspects described herein, including the detailed description which follows, the claims, as well as the appended drawings. It is to be understood that both the foregoing general description and the following detailed description present aspects intended to provide an overview or framework for understanding the nature and character of the aspects disclosed herein. The accompanying drawings are included to provide further understanding and are incorporated into and constitute a part of this specification. The drawings illustrate various aspects of the disclosure, and together with the description explain the principles and operations thereof.

BRIEF DESCRIPTION OF THE DRAWINGS

[0026] These and other features, aspects and advantages are better understood when the following detailed description is read with reference to the accompanying drawings, in which:

[0027] FIG. 1 schematically illustrates a perspective view of example aspects of an electronic apparatus comprising a glass substrate in accordance with aspects of the disclosure;

[0028] FIG. 2 illustrates a side view of a film being applied to the glass substrate by one or more rollers in accordance with aspects of the disclosure;

[0029] FIG. 3 illustrates a side view of a film being applied to the glass substrate by one or more rollers in accordance with aspects of the disclosure;

[0030] FIG. 4 illustrates a side view of a film being applied to a first major surface of the glass substrate and a second film being applied to a second major surface of the glass substrate in accordance with aspects of the disclosure;

[0031] FIG. 5 illustrates a side view of the film applied to the first major surface and a compensation layer applied to the second major surface of the glass substrate in accordance with aspects of the disclosure; and [0032] FIG. 6 illustrates a side view of the film applied to the first major surface in which the film comprises an adhesive layer, a protective layer, and an electrically- conductive layer in accordance with aspects of the disclosure.

DETAILED DESCRIPTION

[0033] Aspects will now be described more fully hereinafter with reference to the accompanying drawings in which example aspects are shown. Whenever possible, the same reference numerals are used throughout the drawings to refer to the same or like parts. However, this disclosure may be embodied in many different forms and should not be construed as limited to the aspects set forth herein.

[0034] As used herein, the term “about” means that amounts, sizes, formulations, parameters, and other quantities and characteristics are not, and need not be, exact, but may be approximate and/or larger or smaller, as desired, reflecting tolerances, conversion factors, rounding off, measurement error and the like, and other factors known to those of skill in the art.

[0035] Ranges can be expressed herein as from “about” one value, and/or to “about” another value. When such a range is expressed, aspects include from the one value to the other value. Similarly, when values are expressed as approximations by use of the antecedent “about,” it will be understood that the value forms another aspect. It will be further understood that the endpoints of each of the ranges are significant both in relation to the other endpoint, and independently of the other endpoint.

[0036] Directional terms as used herein - for example up, down, right, left, front, back, top, bottom, upper, lower, etc. - are made only with reference to the figures as drawn and are not intended to imply absolute orientation.

[0037] Unless otherwise expressly stated, it is in no way intended that any methods set forth herein be construed as requiring that its steps be performed in a specific order, nor that with any apparatus, specific orientations be required. Accordingly, where a method claim does not actually recite an order to be followed by its steps, or that any apparatus claim does not actually recite an order or orientation to individual components, or it is not otherwise specifically stated in the claims or description that the steps are to be limited to a specific order, or that a specific order or orientation to components of an apparatus is not recited, it is in no way intended that an order or orientation be inferred in any respect. This holds for any possible non-express basis for interpretation, including: matters of logic relative to arrangement of steps, operational flow, order of components, or orientation of components; plain meaning derived from grammatical organization or punctuation, and; the number or type of aspects described in the specification.

[0038] As used herein, the singular forms "a," "an" and "the" include plural references unless the context clearly dictates otherwise. Thus, for example, reference to “a” component includes aspects having two or more such components, unless the context clearly indicates otherwise.

[0039] The word “exemplary,” “example,” or various forms thereof are used herein to mean serving as an example, instance, or illustration. Any aspect or design described herein as “exemplary” or as an “example” should not be construed as preferred or advantageous over other aspects or designs. Furthermore, examples are provided solely for purposes of clarity and understanding and are not meant to limit or restrict the disclosed subject matter or relevant portions of this disclosure in any manner. It can be appreciated that a myriad of additional or alternate examples of varying scope could have been presented but have been omitted for purposes of brevity.

[0040] As used herein, the terms “comprising” and “including”, and variations thereof, shall be construed as synonymous and open-ended, unless otherwise indicated. A list of elements following the transitional phrases comprising or including is a nonexclusive list, such that elements in addition to those specifically recited in the list may also be present.

[0041] The terms “substantial,” “substantially,” and variations thereof as used herein are intended to represent that a described feature is equal or approximately equal to a value or description. For example, a “substantially planar” surface is intended to denote a surface that is planar or approximately planar. Moreover, “substantially” is intended to denote that two values are equal or approximately equal. The term “substantially” may denote values within about 10% of each other, for example, within about 5% of each other, or within about 2% of each other.

[0042] Modifications may be made to the instant disclosure without departing from the scope or spirit of the claimed subject matter. Unless specified otherwise, “first,” “second,” or the like are not intended to imply a temporal aspect, a spatial aspect, an ordering, etc. Rather, such terms are merely used as identifiers, names, etc. for features, elements, items, etc. For example, a first end and a second end generally correspond to end A and end B or two different ends.

[0043] The present disclosure relates to an electronic apparatus 101 and methods for manufacturing an electronic apparatus 101. FIG. 1 illustrates a perspective view of the electronic apparatus 101 comprising a glass substrate 103. For purposes of this application, “glass substrate” may be considered a glass material in a solid state. The glass substrate 103 may comprise a glass ribbon of an indeterminate length or one or more separated glass articles (e.g., separated glass sheets) that comprise four discrete edges. In aspects, the glass substrate 103 can comprise for example, one or more of soda-lime glass, borosilicate glass, alumino-borosilicate glass, alkali-containing glass, alkali-free glass, aluminosilicate, borosilicate, boroaluminosilicate, silicate, glassceramic, or other materials comprising glass. In aspects, the glass substrate 103 can comprise one or more of lithium fluoride (LiF), magnesium fluoride (MgF ), calcium fluoride (CaF ), barium fluoride (BaF ), sapphire (AI2O3), zinc selenide (ZnSe), germanium (Ge) or other materials. In aspects, the glass substrate 103 can be employed in a variety of display and non-display applications comprising, but not limited to, liquid crystal displays (LCDs), electrophoretic displays (EPD), organic light emitting diode displays (OLEDs), plasma display panels (PDPs), microLED displays, miniLED displays, organic light emitting diode lighting, light emitting diode lighting, augmented reality (AR), virtual reality (VR), touch sensors, photovoltaics, foldable phones, or other applications.

[0044] The electronic apparatus 101 comprises a film 105 that can be attached to a major surface of the glass substrate 103. In aspects, the film 105 can comprise a width 107 that may substantially match a width of the glass substrate 103. The glass substrate 103 can move in a travel direction 109 such that the film 105 can be attached to the glass substrate 103 as the glass substrate 103 and the film 105 move together in the travel direction 109. While FIG. 1 illustrates the film 105 being applied to one major surface of the glass substrate 103, in aspects, a second film can be applied to an opposing major surface of the glass substrate 103 (e.g., as illustrated in FIG. 4).

[0045] FIG. 2 illustrates a side view of the electronic apparatus 101. In aspects, methods can comprise moving the glass substrate 103 along a travel path 201 at a travel velocity. The glass substrate 103 comprises a first major surface 203 and a second major surface 205 opposite the first major surface 203, the first and second major surfaces 203, 205 defining a thickness 207 (e.g., average thickness) of the glass substrate 103 therebetween. In aspects, the thickness 207 of the glass substrate 103 can be less than or equal to about 2 millimeters (mm), less than or equal to about 1 millimeter, less than or equal to about 0.5 millimeters, for example, less than or equal to about 300 micrometers (pm), less than or equal to about 200 micrometers, or less than or equal to about 100 micrometers, although other thicknesses may be provided in further aspects. For example, the thickness 207 of the glass substrate 103 can be within a range from about 20 micrometers to about 200 micrometers, within a range from about 50 micrometers to about 750 micrometers, within a range from about 100 micrometers to about 700 micrometers, within a range from about 200 micrometers to about 600 micrometers, within a range from about 300 micrometers to about 500 micrometers, within a range from about 50 micrometers to about 500 micrometers, within a range from about 50 micrometers to about 700 micrometers, within a range from about 50 micrometers to about 600 micrometers, within a range from about 50 micrometers to about 500 micrometers, within a range from about 50 micrometers to about 400 micrometers, within a range from about 50 micrometers to about 300 micrometers, within a range from about 50 micrometers to about 200 micrometers, within a range from about 50 micrometers to about 100 micrometers, within a range from about 25 micrometers to about 125 micrometers, comprising all ranges and subranges of thicknesses therebetween.

[0046] In aspects, a supply apparatus 211 can supply the film 105 to one or more of the major surfaces 203, 205 of the glass substrate 103. For example, the supply apparatus 211 can comprise one or more rollers, for example, a firstroller 215, a second roller 217, etc. In aspects, the supply apparatus 211 can comprise additional rollers positioned upstream from the first roller 215 (relative to a travel direction 225 of the film 105), downstream from the second roller 217, and/or between the first roller 215 and the second roller 217. For example, the film 105 can travel in the travel direction 225 such that the film 105 may first contact the first roller 215 followed by contacting the second roller 217 and the glass substrate 103. The film 105 may comprise an adhesive layer 221 and an electrically-conductive layer 223 attached to the adhesive layer 221. In aspects, the film 105 can comprise a flexible resin coated copper (e.g., “FRCC”), with the electrically-conductive layer 223 comprising a copper foil. The adhesive layer 221 can comprise several types of adhesives that can adhere to the major surfaces 203, 205 of the glass substrate 103, for example a resin, an epoxy-based polymer, a B-stage polymer, etc.

[0047] The first roller 215 can extend along and rotate about a first axis 227. In aspects, methods can comprise rotating the first roller 215 (e.g., about the first axis 227) such that a first outer peripheral location 229 of the first roller 215 travels at a roller velocity matching the travel velocity of the glass substrate 103. The film 105 can contact the first roller 215 such that rotation of the first roller 215 causes the film 105 to move at the roller velocity (e.g., and the travel velocity). In this way, a relative velocity between the film 105 and the first outer peripheral location 229 may be substantially equal to zero. The first roller 215, for example, the first outer peripheral location 229, comprises a first temperature, for example, a temperature greater than about 25° C. The first roller 215 can be heated in several ways, for example, with an electrical resistance heater positioned within the first roller 215, by supplying a heated liquid or gas to a chamber within the first roller 215, etc. In aspects, methods can comprise contacting the film 105 with the first roller 215 to heat the film 105 to the first temperature. For example, the film 105 may spend a period of time in contact with the first roller 215 as the first roller 215 rotates. During this period of time, heat from the first roller 215 may be conducted to the film 105, causing the film 105 to heat to the first temperature. In aspects, the film 105 can comprise a first film location 233 located adjacent to and immediately downstream from the first roller 215, with the first film location 233 at the first temperature. In aspects, a curing temperature of the adhesive layer 221 may be greater than the first temperature. The curing temperature is the temperature to which the adhesive layer 221 is exposed to such that the adhesive layer 221 will cure (e.g., harden and solidify) and adhere to the glass substrate 103.

[0048] The second roller 217 is spaced apart and downstream from the first roller 215 relative to the travel direction 225 of the film 105. The second roller 217 may be substantially identical in structure to the first roller 215. The second roller 217 can extend along and rotate about a second axis 237. In aspects, methods can comprise, after contacting the film 105 with the first roller 215, rotating the second roller 217 (e.g., about the second axis 237) such that a second outer peripheral location 239 of the second roller 217 travels at a roller velocity matching the travel velocity of the glass substrate 103. The film 105 can contact the second roller 217 such that rotation of the second roller 217 can cause the film 105 to move at the roller velocity (e.g., and the travel velocity). In this way, a relative velocity between the film 105 and the second outer peripheral location 239 may be substantially equal to zero. The second roller 217 comprises a second temperature that may be greater than the first temperature. The second roller 217 can be heated to the second temperature in several ways, for example, with an electrical resistance heater positioned within the second roller 217, by supplying a heated liquid or gas to a chamber within the second roller 217, etc. In aspects, methods can comprise contacting the film 105 with the second roller 217 to further heat the film 105 from the first temperature to the second temperature. For example, the film 105 may spend a period of time in contact with the second roller 217 as the second roller 217 rotates. During this period of time, heat from the second roller 217 may be conducted to the film 105, which can cause the film 105 to heat to the second temperature. The second temperature may be substantially equal to a curing temperature of the adhesive layer 221. In aspects, the film 105 can comprise a second film location 241 located adjacent to and immediately downstream from the second roller 217, with the second film location 241 comprising the second temperature.

[0049] The first roller 215 and the second roller 217 can be rotated such that a travel velocity of the film 105 may be within a range from about 0.01 meters/minute to about 2 meters/minute. For example, in aspects, the rollers 215, 217 can be rotated such that the travel velocity of the film 105 may be within a range from about 0.01 meters/minute to about 0.05 meters/minute, or about 0.03 meters/minute. In aspects, the rollers 215, 217 can be rotated such that the travel velocity of the film 105 may be within a range from about 0.1 meters/minute to about 0.5 meters/minute, or about 0.3 meters/minute. In aspects, the rollers 215, 217 can be rotated such that the travel velocity of the film 105 may be within a range from about 0.5 meters/minute to about 1.5 meters/minute, or about 1 meter/minute. The velocity of the film 105 may substantially match the velocity of the glass substrate 103 such that the relative velocity between the film 105 and the glass substrate 103 is about zero.

[0050] The first roller 215 is separated a distance 245 from the second roller 217, with the distance 245 based on a size and a material of the film 105. The distance 245 may be measured between a center of the first roller 215 (e.g., at the first axis 227) and a center of the second roller 217 (e.g., at the second axis 237) along the travel direction 225 of the film 105. In aspects, the first roller 215 can be separated the distance 245 from the second roller 217 less than equation (1) below: (1) Distance < 6704.5

[0051] That is, the first roller 215 can be separated the distance 245 less than

about 6704.5 parts per million x from the second roller 217. From the equation,

the term k represents a thermal conductivity of the film 105, with the units in Watts/meter*Kelvin. From the equation, the term A represents a cross-sectional area of the film 105, with the width 107 multiplied by a thickness 249 of the film 105, with the units in meters². From the equation, the term a is a coefficient of thermal expansion of the film, with the units in parts-per-million (ppm)/ degrees Celsius. From the equation, the term q is a heat transfer rate of the film 105, with the units in Watts. The variables (e.g., k, A, a, and q) are representative of the film 105, for example, a combination of the adhesive layer 221 and the electrically-conductive layer 223, and not the adhesive layer 221 alone or the electrically-conductive layer 223 alone.

[0052] The equation for determining the distance 245 is derived as follows. With respect to equation (2) below, AT represents a temperature difference between two rollers (e.g., a temperature difference between the first roller 215 and the second roller 217). The term a is the coefficient of thermal expansion of the film 105.

(2) AT x a < 6704.5 ppm

[0053] As illustrated in equation (3) below, the term q is heat transfer rate of the film 105, k is the thermal conductivity of the film 105, and A is the cross-sectional area of the film 105.

[0054] Equation (3) can further be reduced to equation (4), in which L represents the distance between two rollers (e.g., the distance 245 between the first roller 215 and the second roller 217). The heat transfer rate, q, was achieved with data by experimentally measuring the temperature changes:

[0055] Next, equation (4) can be rearranged and expressed in terms of AT, as shown in equation (5):

[0056] From equation (5), AT can be substituted into equation (2) to produce equation (1) above. Accordingly, for different film materials and sizes, a minimum distance separating the heated rollers 215, 217 can be determined. In aspects, a minimum distance 245 between rollers 215, 217 may be equal to a sum of the radii of the rollers, for example, the sum of the radius of the first roller 215 and the radius of the second roller 217. In aspects, the distance 245 between the rollers 215, 217 was calculated to be within a range from about 175 millimeters (mm) to about 225 mm, or from about 200 mm to about 215 mm, or about 210 mm.

[0057] As illustrated in FIGS. 1-2, the first roller 215 and the second roller 217 can be located at differing distances from the glass substrate 103. For example, the first roller 215 is rotated about the first axis 227 and the second roller 217 is rotated about the second axis 237, wherein the first axis 227 and the second axis 237 can lie in a plane 253 that intersects the first major surface 203. In aspects, the first roller 215 can be spaced a first distance 257 from the first major surface 203 and the second roller 217 can be spaced a second distance 259 from the first major surface 203, with the second distance 259 less than the first distance 257. The second distance 259 may be less than or equal to the thickness 249 of the film 105, such that the film 105 can pass between the second roller 217 and the first major surface 203, with the second roller 217 applying a force to the film 105 to cause the film 105 to attach to the first major surface 203. In aspects, the second roller 217 can apply a force to the film 105 within a range from about 0.3 MPa to about 0.7 MPa, or about 0.5 MPa. Accordingly, methods can comprise attaching the heated film 105 to the first major surface 203 of the glass substrate 103 to form a glass article 261, wherein the glass article 261 comprises the film 105 attached to the glass substrate 103.

[0058] Due to the differing distances 257, 259 of the rollers 215, 217 from the glass substrate 103, the film 105 can comprise a plurality of segments that extend along a non-parallel and non-linear travel path. For example, the film 105 can comprise a first segment 265 located upstream from the first roller 215, a second segment 267 located downstream from the first roller 215 and upstream from the second roller 217 (e.g., spanning between the first roller 215 and the second roller 217), and a third segment 269 located downstream from the second roller 217. The film 105 is not limited to the three illustrated segments and, instead, can comprise additional or fewer segments based on the number of rollers and the position of the rollers. In aspects, the first segment 265 can travel in a first film travel direction 271 toward the first roller 215, the second segment 267 can travel in a second film travel direction 273 from the first roller 215 toward the second roller 217, and the third segment 269 can travel in a third film travel direction 275 from the second roller 217. In aspects, the first film travel direction 271 may be non-parallel to the second film travel direction 273, such that a travel path of the first segment 265 can form an angle relative to a travel path of the second segment 267 within a range from about 10 degrees to about 170 degrees, or within a range from about 30 degrees to about 60 degrees. In aspects, the second film travel direction 273 may be non-parallel to the third film travel direction 275, such that a travel path of the second segment 267 can form an angle relative to a travel path of the third segment 269 within a range from about 10 degrees to about 170 degrees, or within a range from about 120 degrees to about 150 degrees. In aspects, the first segment 265 and the third segment 269 can extend parallel to one another while traveling in opposite directions (e.g., along the first film travel direction 271 and the third film travel direction 275, respectively). The third film travel direction 275 may be substantially identical to the travel direction 109 of the glass substrate 103 due to the third segment 269 being attached to the glass substrate 103.

[0059] The arrangement of the rollers 215, 217 of the supply apparatus 211 provides several benefits. For example, as explained relative to equation (1), the distance 245 separating the rollers 215, 217 can be determined based on the material of the film 105. If the distance 245 becomes relatively large and/or if the supply apparatus 211 comprises one or more additional rollers in addition to the rollers 215, 217, the supply apparatus 211 may consume a greater than desirable amount of space, particularly if the rollers 215, 217 are arranged parallel to the first major surface 203 (e.g., wherein the plane 253 is parallel to the first major surface 203). In aspects, existing environments may not have a length-wise space adjacent to the first major surface 203 to accommodate the supply apparatus 211. To accommodate the distance 245 between the rollers 215, 217 and allow for gradual heating of the film 105, the rollers 215, 217 may be arranged along the plane 253 that intersects the first major surface 203 such that the film 105 can be arranged to comprise the plurality of nonlinear segments 265, 267, 269. In this way, the supply apparatus 211 can be arranged to provide the distance 245 while occupying a relatively small surface area adjacent to the first major surface 203. [0060] After attaching the heated film 105 to the first major surface 203, methods can comprise curing the film 105 by exposing (e.g., illustrated with arrowhead 266 in FIG. 2) the glass article 261 to a curing temperature for a period of time sufficient to cure the film 105 (e.g., adhesive layer 221). The glass article 261 (e.g., the glass substrate 103 and the film 105) can be exposed to the curing temperature in several ways, such as by being locally heated, by being placed within a heated chamber of an oven, etc. By exposing the glass article 261 to the curing temperature, the film 105 can continue to cure such that the film 105 will remain attached to the first major surface 203. The period of time may vary depending on the composition of the film 105, though, in aspects, the period of time may be within a range from about 30 minutes to about 90 minutes at a temperature of about 180° C.

[0061] FIG. 3 illustrates a side view of additional aspects of a supply apparatus 301 that can supply the film 105 to the glass substrate 103. In aspects, the supply apparatus 301 can differ from the supply apparatus 211 of FIG. 2, for example, due to a positioning of the rollers 215, 217 relative to the glass substrate 103. For example, with regard to the supply apparatus 211 of FIG. 2, the first roller 215 and the second roller 217 can be spaced different distances 257, 259 from the glass substrate 103. As illustrated in FIG. 3, the supply apparatus 301 can comprise the first roller 215 and the second roller 217, with the first roller 215 and the second roller 217 located substantially equidistant from the glass substrate 103. For example, the first roller 215 can be rotated about the first axis 227 and the second roller 217 can be rotated about the second axis 237. The first axis 227 and the second axis 237 can lie in a plane 303 substantially parallel to the first major surface 203. In aspects, the first roller 215 and the second roller 217 may be spaced a first distance 305 from the first major surface 203, with the first distance 305 less than or equal to the thickness 249 of the film 105.

[0062] In aspects, the film 105 can comprise a first segment 311 located upstream from the first roller 215, a second segment 313 located downstream from the first roller 215 and upstream from the second roller 217 (e.g., spanning between the first roller 215 and the second roller 217), and a third segment 269 located downstream from the second roller 217. In contrast to the supply apparatus 211 of FIG. 2, the first segment 311, the second segment 313, and the third segment 315 can lie within a plane substantially parallel to the first major surface 203, such that the first segment 311, the second segment 313, and the third segment 315 can move in the travel direction 225 that matches the travel direction 109 of the glass substrate 103. The distance 245 between the rollers 215, 217 of the supply apparatus 301 can be determined in substantially the same manner as the distance 245 between the rollers 215, 217 of the supply apparatus 211 of FIG. 2, for example, by using equation (1). As such, the first

roller 215 can be separated the distance 245 less than about 6704.5 ppm X from

the second roller 217.

[0063] The first roller 215 can be rotated such that the first outer peripheral location 229 of the first roller 215 can travel at the roller velocity matching the travel velocity of the glass substrate 103. The first roller 215 can be at the first temperature (e.g., which can be greater than about 25° C) such that contact between the film 105 with the first roller 215 can heat the film 105 to the first temperature. After contacting the film 105 with the first roller 215, the second roller 217 is rotated such that the second outer peripheral location 239 of the second roller 217 travels at the roller velocity. The second roller 217 can be at a second temperature greater than the first temperature, wherein the second temperature may be substantially equal to the curing temperature of the film 105. The second roller 217 can contact the film 105 to further heat the film 105 from the first temperature to the second temperature. In aspects, as the film 105 travels in the travel direction 225 toward the first roller 215, the film 105 may be at room temperature or at a temperature below the first temperature of the first roller 215, with the film 105 not attached to the first major surface 203. Upon contacting the first roller 215, the film 105 is heated to the first temperature, whichmay be below the curing temperature of the film 105. The film 105 may then move toward the second roller 217, whereupon the film 105 contacts the second roller 217 and is heated to the second temperature, which may be substantially equal to the curing temperature of the film 105. As a result, the adhesive layer 221 can cure and solidify, thus forming an attachment between the adhesive layer 221 and the first major surface 203. In aspects, after attaching the heated film 105 to the first major surface 203, methods can comprise further curing the film 105 by exposing (e.g., illustrated with arrowhead 266 in FIG. 2) the glass article 261 to the curing temperature for a period of time.

[0064] FIG. 4 illustrates a side view of the glass substrate 103 with the film 105 being applied to the first major surface 203 and a second film 401 being applied to the second major surface 205. In aspects and as illustrated in FIGS. 2-3, the film 105 can be applied to the first maj or surface 203 while the second maj or surface 205 may remain exposed such that no film is attached to the second major surface 205. The film 105 can be applied to the first major surface 203 by one of the supply apparatuses 211, 301. In aspects, the glass substrate 103 is not limited to receiving the film 105 on the first major surface 203. Rather, in aspects, both the first major surface 203 and the second major surface 205 can receive a film. While FIG. 4 illustrates the film 105 being applied by the supply apparatus 301 of FIG. 3, in aspects, the film 105 could instead be applied by the supply apparatus 211 of FIG. 2. The second film 401 can be substantially identical to the film 105. For example, the second film 401 can comprise an adhesive layer 403 (e.g., substantially identical to the adhesive layer 221) and an electrically-conductive layer 405 (e.g., substantially identical to the electrically- conductive layer 223).

[0065] The second film 401 can be applied by a supply apparatus 407 comprising a first roller 409 (e.g., substantially identical to the first roller 215) and a second roller 411 (e.g., substantially identical to the second roller 411). As illustrated in FIG. 4, in aspects, the supply apparatus 407 can be substantially identical to the supply apparatus 301 of FIG. 3, wherein the first roller 409 and the second roller 411 can be arranged along a plane substantially parallel to the second major surface 205. However, in aspects, the supply apparatus 407 can be arranged similar to the supply apparatus 211 of FIG. 2, wherein the first roller 409 and the second roller 411 can be arranged along a plane that intersects the second major surface 205. Accordingly, the supply apparatus 407 for attaching the second film 401 to the second major surface 205 can comprise the arrangement of either of the supply apparatuses 211, 301. In aspects, a benefit of the second film 401 is that since the material properties and dimensions of the second film 401 substantially match the material properties and dimensions of the film 105, a stress of the second film 401 can be substantially equal to the film 105. As such, warpage of the glass substrate 103, which can be induced by a stress of the film 105, 401, may be substantially equal to zero due to the stress on opposing sides of the glass substrate 103 being substantially equal.

[0066] By gradually heating the film 105, 401 with the rollers 215, 217, 409, 411, several benefits can be achieved. For example, when a film is not heated prior to being applied to a glass substrate, the film may experience bubbling or wrinkling due to a sudden temperature increase of the film from room temperature to a curing temperature. In particular, the bubbling and/or wrinkling can be due to the sudden dimensional change of the film 105, 401 related to the coefficient of thermal expansion and thermal conductivity. Bubbling can occur when pockets of air are located between the film 105, 401 and the first major surface 203, such that the film 105, 401 may not lie flat on the glass substrate 103. Wrinkling can occur when folds or ridges are present in the film 105, 401 and, again, cause the film 105, 401 to not lie flat on the glass substrate 103.

[0067] In contrast, the film 105, 401 in the present application may be gradually heated with the plurality of rollers 215, 217, 409, 411 over a distance, such that the film 105, 401 can reach the curing temperature at a slower rate. As such, the film 105, 401 may undergo a dimensional change at a slower rate due to the gradual heating. As a result, the film 105, 401 does not experience bubbling and/or wrinkling upon being attached to the glass substrate 103. In aspects, the glass substrate 103 can be pre-heated prior to reaching the supply apparatuses 211, 301, 407. For example, the glass substrate 103 can be heated by a heater, a fan blowing heated air, an oven, etc. In aspects, the glass substrate 103 can be pre-heated to a temperature substantially equal to a curing temperature of the film 105, 401. In this way, a temperature difference between the glass substrate 103 and the film 105, 401 may be minimized by the length of time the film 105, 401 contacts the glass substrate 103, thus further reducing the likelihood of bubbling, wrinkling, etc. Further, by providing localized heating of the film 105, 401 from the rollers 215, 217, 409, 411, the film 105, 401 and the glass substrate 103 may be exposed to more controlled and lower overall temperatures, which can reduce dimensional changes associated with heat.

[0068] Another advantage of the supply apparatuses 211, 301, 407 is that the width 107 of the film 105, 401 and the glass substrate 103, can be increased as compared to previous attempts. For example, since the second roller 217 does not contact the entire glass substrate 103, but, rather, extends across a width of the glass substrate 103, the width 107 of the rollers 215, 217, 409, 411 can be adjusted based on the width of the film 105, 401 and the glass substrate 103. The contact area between the rollers 217, 411 and the glass substrate 103 is smaller than in the past (e.g., in which an applicator contacted all of the major surface of the glass substrate 103), such that application of the film 105, 401 can be accomplished faster. Further, since the contact area is reduced, the glass substrate 103 can be subjected to a lower total stress, thus reducing the likelihood of damage to the glass substrate 103. [0069] Yet another advantage of gradually heating the film 105, 401 relates to a reduced stress experienced by the glass substrate 103. For example, the localized heating of the film 105, 401 (e.g., by the rollers 215, 217, 409, 411) can limit the temperature to which the glass substrate 103 may be exposed. As a result, a residual stress in the glass substrate 103 can be reduced. For example, experimental data has determined that for a film 105 comprising copper as the electrically-conductive layer 223 with a thickness of about 18 pm, the adhesive layer 221 comprising a thickness of about 25 pm, and the glass substrate 103 comprising a thickness of about 400 pm and a size of about 150 x 150 mm² (e.g., length x width), the glass substrate 103 may comprise a residual stress of about 40 MPa as compared to a residual stress of about 75 MPa for previous attempts of attaching a film to a glass substrate. The reduced stress of the glass substrate 103 is advantageous, in part, due to improved reliability and a reduced risk of breakage during cutting of the glass substrate 103.

[0070] FIG. 5 illustrates a side view of the electronic apparatus 101 following the application and curing of the film 105 to the first major surface 203. In aspects, the adhesive layer 221 is attached to the first major surface 203 and, based on the adhesive material selected, may be curable at a temperature less than about 25°C (e.g., about room temperature). As such, a difference between the curing temperature of the adhesive layer 221 and a final, post-curing temperature of the adhesive layer 221 may be minimized such that, in aspects, the adhesive layer 221 can cure at room temperature. In aspects, the adhesive layer 221 can comprise one or more of a pressure sensitive adhesive, such as an optically clear adhesive, a B-stage epoxy, a silicone adhesive, or room temperature curable epoxy, etc. A B-stage epoxy comprises a resin and a curing agent, and a reaction between the resin and the curing agent is not complete when the B-stage epoxy is applied to the glass substrate 103 (e.g., the B-stage epoxy is initially in a partially cured state). The B-stage epoxy can later be heated to complete the reaction, thus fully curing the B-stage epoxy, and attaching the adhesive layer 221 to the glass substrate 103. In aspects, the B-stage epoxy can comprise a coefficient of thermal expansion within a range from about 85 ppm/°C to about 90 ppm/°C, and a Young’s Modulus within a range from about 2.5 GPa to about 3 GPa. A pressure sensitive adhesive comprises a non-reactive adhesive that forms a bond when a pressure is applied, thus facilitating attachment, and curing at a temperature less than about 25° C. In aspects, the pressure sensitive adhesive can comprise a coefficient of thermal expansion of about 150 ppm/°C, and a Young’s Modulus of about 0.0001 GPa.

[0071] The electrically-conductive layer 223 is attached to the adhesive layer 221 such that the adhesive layer 221 is positioned between the glass substrate 103 and the electrically-conductive layer 223. In aspects, the electrically-conductive layer 223 can comprise a copper foil, which can comprise a coefficient of thermal expansion of about 17 ppm/°C, and a Young’s Modulus of about 128 GPa. In aspects, warpage of the electronic apparatus 101 can be based, in part, on a stress on the electrically- conductive layer 223 on equation (6) below:

[0072] Equation (6) represents the stress on the electrically-conductive layer 223 from the adhesive layer 221 and the glass substrate 103. From the equation, the term K is a constant. The term a is the coefficient of thermal expansion for the electrically-conductive layer 223 and the term a₂ is the coefficient of thermal expansion for the glass substrate 103. The term T_t is the curing temperature of the adhesive layer 221 and the term T₂ is the final temperature of the adhesive layer 221. The term E is Young’s modulus of the adhesive layer 221 and the term E₂ is Young’s modulus of the glass substrate 103. The term L is the length of the glass substrate 103 and the term t is the thickness of the adhesive layer 221. Since the coefficient of thermal expansion and Young’s modulus are material properties of the glass substrate 103 and the electrically-conductive layer 223, controlling the temperature difference (e.g., T1-T2) by reducing the curing temperature of the adhesive layer 221 can more easily reduce a stress and subsequent warpage of the electrically-conductive layer 223.

[0073] In aspects, the adhesive layer 221 may initially be in a liquid or a semiliquid state. The electrically-conductive layer 223, the adhesive layer 221, and the glass substrate 103 can be heated from an initial temperature to a curing temperature of the adhesive layer 221. In aspects, heating to the curing temperature can cause thermal expansion of the electrically-conductive layer 223 and the glass substrate 103. Upon reaching the curing temperature and being maintained at the curing temperature for a period of time, the adhesive layer 221 will cure and transition from a liquid or semiliquid state to a solid state. Following the curing of the adhesive layer 221, the electrically-conductive layer 223, the adhesive layer 221, and the glass substrate 103 can be cooled to a temperature less than the curing temperature, for example, room temperature. As the electrically-conductive layer 223 and the glass substrate 103 are cooled, the electrically-conductive layer 223 and the glass substrate 103 may contract. As the temperature difference (e.g., T1-T2) between the curing temperature and the final temperature becomes larger, the likelihood of warpage increases. However, when the adhesive layer 221 cures at room temperature or lower, such that the temperature difference (e.g., T1-T2) is relatively small, then the amount of warpage is reduced and/or minimized. Indeed, with a lower curing temperature, the adhesive layer 221 can cure at a lower temperature such that the electrically-conductive layer 223 and the glass substrate 103 may undergo less thermal expansion and contraction. For example, in aspects, the glass substrate 103, the adhesive layer 221, and the electrically-conductive layer 223 can comprise a warpage of less than about 1 mm for a sample size of 230 x 230 mm². The warpage can be measured as follows. The glass substrate 103, the adhesive layer 221, and the electrically-conductive layer 223 can be placed on a flat surface, such that the edges (e.g., for edges, for example) of the glass substrate 103 do not contact the flat surface. Next, the distance separating each edge from the flat surface is measured. For example, a first distance may separate a first edge from the flat surface, a second distance may separate a second edge from the flat surface, a third distance may separate a third edge from the flat surface, and a fourth distance may separate a fourth edge from the flat surface. Once the distances are measured, the distances can be averaged. For example, if the glass substrate 103 comprises four edges, then the distance can be averaged (e.g., by adding the first distance, the second distance, the third distance, and the fourth distance to obtain the total, and then dividing the total by four). This average can represent the warpage.

[0074] In addition to low warpage, another benefit of the electronic apparatus 101 is that the adhesive layer 221 can exhibit thermal stability when reheated at a time after curing. For example, following the curing of the adhesive layer 221 and cooling of the electronic apparatus 101 to room temperature, a period of time (e.g., minutes, hours, days, etc.) may pass before the electrically-conductive layer 223 is heated. Heating of the electrically-conductive layer 223 can allow for electronic devices to be soldered to the electrically-conductive layer 223. In aspects, during the soldering process, the electrically-conductive layer 223 and, thus, the adhesive layer 221, may be exposed to temperatures within a range from about 250° C to 300° C for a time within a range from about 1 second to about 30 seconds, or about 10 seconds. Despite being exposed to the elevated temperature during the soldering process, testing has determined that the adhesive layer 221 exhibited strong thermal stability by not blistering (e.g., forming bubbles), delaminating (e.g., detaching from the first major surface 203), or undergoing other temperature -related defects.

[0075] In aspects, the second major surface 205 may be uncovered (e.g., illustrated in FIGS. 2-3), covered by the second film 401 (e.g., illustrated in FIG. 4), or covered with a compensation layer 501. For example, the electronic apparatus 101 can comprise the compensation layer 501 with the compensation layer 501 attached to the second major surface 205. The compensation layer 501 can further limit warpage due to the compensation layer 501 comprising a stress substantially equal to a combined stress of the adhesive layer 221 and the electrically-conductive layer 223. For example, a combined stress of the adhesive layer 221 and the electrically-conductive layer 223 can be determined, for example, based on experimental testing, modeling, etc. The combined stress of the adhesive layer 221 and the electrically-conductive layer 223 may be based, in part, on the material characteristics of the adhesive layer 221 and the electrically-conductive layer 223, for example, the thickness, curing temperature, coefficient of thermal expansion, Young’s modulus, etc. In aspects, a stress of the compensation layer 501 can be determined such that after the compensation layer 501 is applied to the second major surface 205, the stress of the compensation layer 501 may substantially match the combined stress of the adhesive layer 221 and the electrically-conductive layer 223. In aspects, the compensation layer 501 can comprise one or more of polyimide, FR-4, polyethylene terephthalate, polypropylene, epoxy, acrylate, or methacrylate polymers. The compensation layer 501 can be applied in several ways, for example, by one or more rollers, a vacuum-hot press machine, etc. Due to the substantial matching of the stresses of the compensation layer 501 to the adhesive layer 221 and the electrically-conductive layer 223, warpage of the glass substrate 103 may be limited or minimized. Accordingly, methods of manufacturing the electronic apparatus 101 can comprise applying the compensation layer 501 to the second major surface 205 of the glass substrate 103 such that a stress in the compensation layer 501 is substantially equal to a stress in the film 105.

[0076] FIG. 6 illustrates a side view of the electronic apparatus 101 wherein the film 105 comprises a protective layer 601 attached to the adhesive layer 221. For example, the protective layer 601 can be attached to the adhesive layer 221 and positioned between the adhesive layer 221 and the electrically-conductive layer 223. As such, in aspects, the electrically-conductive layer 223 may not be in contact with the adhesive layer 221 but, rather, may be attached to and in contact with the protective layer 601. In aspects, the protective layer 601 can comprise one or more of polyimide, FR-4, polyethylene terephthalate, polypropylene, epoxy, acrylate, or methacrylate polymers. While illustrated as a single layer, the protective layer 601 is not so limited, and, in aspects, the protective layer 601 can comprise a plurality of layers of different materials. In aspects, when the electronic apparatus 101 comprises both the compensation layer 501 and the protective layer 601, the stress in the compensation layer 501 may be substantially equal to the combined stress of the adhesive layer 221, the protective layer 601, and the electrically-conductive layer 223 to limit and/or minimize warpage.

[0077] The protective layer 601 can provide several benefits to the electronic apparatus 101. For example, the protective layer 601 can provide an added layer of shielding and protection to the adhesive layer 221 and the glass substrate 103. In addition, the protective layer 601 can reduce warpage of the electronic apparatus 101. For example, the protective layer 601 can comprise a stiffness such that the protective layer 601 can act as a stiffener against thermal shrinkage of the adjacent adhesive layer 221 and electrically-conductive layer 223. In aspects, the electrically-conductive layer 223 can be patterned and one or more electronic devices can be positioned on the first major surface 203 and/or the second major surface 205 (e.g., when the second major surface 205 comprises the electrically-conductive layer 405). The one or more electronic devices can be electrically-connected to one of the electrically-conductive layers 223, 405. In aspects, the one or more electronic devices can comprise, for example, micro light-emitting diodes (microLEDs), organic light-emitting diodes (OLEDs), or othertypes of light-emitting diodes, thin film transistors, micro-driver ICs, resistors, capacitors, conductive lines, etc.

[0078] It should be understood that while various aspects have been described in detail relative to certain illustrative and specific examples thereof, the present disclosure should not be considered limited to such, as numerous modifications and combinations of the disclosed features are possible without departing from the scope of the following claims.

Claims

What is claimed is:

1. A method of manufacturing an electronic apparatus comprising: moving a glass substrate along a travel path at a travel velocity; rotating a first roller such that a first outer peripheral location of the first roller travels at a roller velocity matching the travel velocity, the first roller comprising a first temperature greater than about 25° C; contacting a film with the first roller to heat the film to the first temperature, the film comprising an adhesive layer with a curing temperature greater than the first temperature and an electrically-conductive layer attached to the adhesive layer; and attaching the heated film to a first major surface of the glass substrate to form a glass article.

2. The method of claim 1 , further comprising, after contacting the film with the first roller: rotating a second roller such that a second outer peripheral location of the second roller travels at the roller velocity, the second roller comprising a second temperature substantially equal to the curing temperature; and contacting the film with the second roller to further heat the film to the second temperature.

3. The method of any one of claims 1-2, further comprising, after attaching the heated film to the first major surface, curing the film by exposing the glass article to the curing temperature.

4. The method of any one of claims 1 -3, wherein the first roller is separated from the second roller a distance less than about: k x A

6704.5 ppm x - a x q

5. The method of any one of claims 1-4, further comprising applying a compensation layer, with a stress substantially equal to a stress in the film, to a second major surface of the glass substrate.

6. The method of claim 5, wherein the compensation layer comprises one or more of polyimide, FR-4, polyethylene terephthalate, polypropylene, epoxy, acrylate, or methacrylate polymers.

7. The method of any one of claims 1 -6, wherein the electrically-conductive layer comprises a copper foil.

8. A method of manufacturing an electronic apparatus comprising: moving a glass substrate along a travel path at a travel velocity; rotating a first roller such that a first outer peripheral location of the first roller travels at a roller velocity matching the travel velocity, the first roller comprising a first temperature; contacting a film with the first roller to heat the film to the first temperature, the film comprising an adhesive layer with a curing temperature greater than the first temperature and an electrically-conductive layer attached to the adhesive layer; rotating a second roller such that a second outer peripheral location of the second roller travels at the roller velocity, the second roller comprising a second temperature greater than the first temperature; contacting the film with the second roller to further heat the film to the second temperature; and attaching the heated film at the second temperature to a first major surface of the glass substrate.

9. The method of claim 8, wherein the first roller is separated from the second roller a distance less than about: k x A

6704.5 ppm x - a x q

10. The method of any one of claims 8-9, wherein the first roller is rotated about a first axis and the second roller is rotated about a second axis, the first axis and the second axes lying in a plane substantially parallel to the first major surface.

11. The method of any one of claims 8-9, wherein the first roller is rotated about a first axis and the second roller is rotated about a second axis, the first axis and the second axis lying in a plane that intersects the first major surface.

12. The method of any one of claims 8-11, wherein the first roller and the second roller are spaced a first distance less than or equal to a thickness of the film from the first major surface.

13. The method of any one of claims 8-11, wherein the first roller is spaced a first distance from the first major surface and the second roller is spaced a second distance from the first major surface, the second distance less than the first distance.

14. An electronic apparatus comprising: a glass substrate comprising a first major surface and a second major surface opposite the first major surface; an adhesive layer curable at a temperature less than about 25° C attached to the first major surface; and an electrically-conductive layer attached to the adhesive layer such that the adhesive layer is positioned between the glass substrate and the electrically- conductive layer, the glass substrate, the adhesive layer, and the electrically- conductive layer comprising a warpage of less than about 1 mm for a sample size of 230 x 230 mm².

15. The electronic apparatus of claim 14, further comprising a protective layer attached to the adhesive layer and positioned between the adhesive layer and the electrically-conductive layer, the protective layer comprising one or more of polyimide, FR-4, polyethylene terephthalate, polypropylene, epoxy, acrylate, or methacrylate polymers.

16. The electronic apparatus of any one of claims 14-15, wherein the adhesive layer comprises one of a pressure sensitive adhesive or a B-stage epoxy.

17. The electronic apparatus of any one of claims 14-16, wherein the electrically- conductive layer comprises a copper foil.

18. The electronic apparatus of any one of claims 14-17, further comprising a compensation layer attached to the second major surface, the compensation layer comprising a stress substantially equal to a combined stress of the adhesive layer and the electrically-conductive layer.

19. The electronic apparatus of claim 18, wherein the compensation layer comprises one or more of polyimide, FR-4, polyethylene terephthalate, polypropylene, epoxy, acrylate, or methacrylate polymers.