WO2023182720A1

WO2023182720A1 - Patch comprising plurality of attachable/detachable and individually controllable ultrasonic sensors

Info

Publication number: WO2023182720A1
Application number: PCT/KR2023/003444
Authority: WO
Inventors: 장진호; 성진호
Original assignee: 재단법인대구경북과학기술원
Priority date: 2022-03-25
Filing date: 2023-03-15
Publication date: 2023-09-28
Also published as: KR20230139035A

Abstract

An ultrasound patch according to one embodiment of the present invention comprises a plurality of ultrasonic sensors comprising: a support composed of a plurality of flexible layers comprising an electrode layer in which ground electrodes and signal electrodes are patterned from an electrically conductive material on at least one surface; connectors electrically connected to the ground electrodes and signal electrodes of the support, and fixed to the support; and sensor part connectors, which can be attached/detached to/from the connectors of the support so as to electrically and physically connect to the support.

Description

Patch with multiple removable, individually controllable ultrasonic sensors

The present disclosure relates to an ultrasonic patch, and more specifically, to a patch having an ultrasonic sensor having a detachable structure and a plurality of ultrasonic sensors.

Patch-type ultrasonic sensors exist that are attached to the patient's body to continuously monitor the internal organs of the patient.

For example, the prior art (Korean Patent Publication No. 10-1365035) is a method of coupling a plurality of ultrasonic sensors to a connection member.

In the prior art, a plurality of ultrasonic sensors are connected by a connecting member, and signals are supplied to or received from the ultrasonic sensor through a plurality of wires between the flexible insulating layers of the connecting member. In the prior art, when a wire is disconnected or some of a plurality of ultrasonic sensors are damaged due to continued use of a flexible connecting member, the external terminal of the ultrasonic sensor and the wire inside the connecting member are cut and then reconnected with a new ultrasonic sensor. This has to be done, and there is a problem in that it requires very complicated work. For example, when replacing a centrally located ultrasonic sensor, it is necessary to cut and reconnect the four connecting members connected to the replaced ultrasonic sensor, which requires precise skill.

In addition, in the prior art, as the number of replacements of the ultrasonic sensor increases, the durability of the connection between the connecting member and the sensor may decrease, and the wire inside the connecting member becomes shorter due to cutting, which limits the number of replacements.

In addition, in the prior art, a plurality of cathode and anode wires connecting ultrasonic sensors are electrically connected together to the cathode terminal and anode terminal located at the outer end of the connection member, so that a plurality of ultrasonic sensors cannot be controlled individually and simultaneously. There is a problem that needs to be addressed.

One embodiment of the present disclosure provides a patch and an ultrasonic sensor in which the ultrasonic sensor can be individually attached and detached from the patch.

One embodiment of the present disclosure provides a patch and an ultrasonic sensor capable of individually controlling ultrasonic sensors.

One embodiment of the present disclosure provides a patch and an ultrasonic sensor that can easily replace the ultrasonic sensor.

One embodiment of the present disclosure provides a patch capable of attaching and detaching an ultrasonic sensor and minimizing electromagnetic interference.

An embodiment of the present disclosure includes an electrode layer in which at least a ground electrode and a signal electrode are patterned with an electrically conductive material on at least one surface, a support composed of a plurality of flexible layers, a ground electrode of the support, and a signal. An ultrasonic patch comprising a plurality of ultrasonic sensors including a connector electrically connected to an electrode, a connector fixed to a support, and a sensor portion connector detachably connected to the connector and electrically connected to the ground electrode and the signal electrode through the connector. to provide.

In the patch and ultrasonic sensor according to an embodiment of the present disclosure, the ultrasonic sensor can be individually attached to and detached from the patch, making repairs such as replacement easy and improving economic efficiency.

The patch and ultrasonic sensor according to an embodiment of the present disclosure can individually control a plurality of ultrasonic sensors, enabling more accurate and efficient monitoring of organs inside a patient.

The patch and ultrasonic sensor according to an embodiment of the present disclosure can minimize electromagnetic interference and reduce noise by using one layer of the plurality of layers of the patch as a ground layer, thereby improving signal sensitivity.

1 is a diagram showing a patch and an ultrasonic sensor according to an embodiment of the present disclosure.

Figure 2 is a diagram showing the configuration of a patch according to an embodiment of the present disclosure.

Figure 3 is a diagram showing the configuration of a patch according to an embodiment of the present disclosure.

Figure 4 is a diagram showing the configuration of a patch according to an embodiment of the present disclosure.

Figure 5 is a diagram showing a plurality of layers of a patch according to embodiments of the present disclosure.

Figure 6 is a diagram showing an electrode layer of a patch according to embodiments of the present disclosure.

Figure 7 is a diagram showing electrode layers of a patch according to an embodiment of the present disclosure.

Figure 8 is a diagram showing the configuration of an ultrasonic sensor according to embodiments of the present disclosure.

Figure 9 is a diagram showing the configuration of an ultrasonic sensor according to embodiments of the present disclosure.

Figure 10 is a diagram showing the configuration of a patch according to another embodiment of the present disclosure.

11 is a diagram showing the configuration of an ultrasonic sensor according to other embodiments of the present disclosure.

Hereinafter, embodiments disclosed in the present specification will be described in detail with reference to the attached drawings. However, identical or similar components will be assigned the same reference numbers regardless of reference numerals, and duplicate descriptions thereof will be omitted. The suffixes “module” and “part” for components used in the following description are given or used interchangeably only for the ease of preparing the specification, and do not have distinct meanings or roles in themselves. Additionally, in describing the embodiments disclosed in this specification, if it is determined that detailed descriptions of related known technologies may obscure the gist of the embodiments disclosed in this specification, the detailed descriptions will be omitted. In addition, the attached drawings are only for easy understanding of the embodiments disclosed in this specification, and the technical idea disclosed in this specification is not limited by the attached drawings, and all changes included in the spirit and technical scope of the present invention are not limited. , should be understood to include equivalents or substitutes.

Terms containing ordinal numbers, such as first, second, etc., may be used to describe various components, but the components are not limited by the terms. The above terms are used only for the purpose of distinguishing one component from another.

When a component is said to be "connected" or "connected" to another component, it is understood that it may be directly connected to or connected to the other component, but that other components may exist in between. It should be. On the other hand, when it is mentioned that a component is “directly connected” or “directly connected” to another component, it should be understood that there are no other components in between.

An ultrasonic sensor patch including a plurality of ultrasonic sensors according to an embodiment of the present disclosure will be described with reference to FIG. 1 .

The ultrasonic sensor patch 100 according to an embodiment of the present disclosure includes a support 110 on which a plurality of ultrasonic sensors 130 are detachable. The support 110 is composed of a plurality of layers that are flexible and stretchable.

The ultrasonic sensor patch 100 may include a support 110 of different shapes depending on the location at which it is attached to the patient or the shape of the organ for monitoring. For example, the ultrasonic sensor patch 100 for monitoring bladder volume and measuring changes in bladder volume may include a cross-shaped or T-shaped support 110 as shown in FIG. 1 .

The support 110 includes a connector 120 for attaching and detaching a plurality of ultrasonic sensors 130 on the lower side, which is attached to the patient's skin. The connector 120 is a connector capable of receiving a high-frequency signal from the ultrasonic sensor 130 and may be an RF connector 120.

The support 110 receives power from an external device to supply power to the ultrasonic sensor 130, and to apply various post-processing algorithms to the ultrasonic signal received by the ultrasonic sensor 130. It may include a system connector 140 capable of transmission.

The ultrasonic sensor 130 may be cylindrical, and its external shape is not limited. The internal structure of the ultrasonic sensor 130 will be described in detail below with reference to FIGS. 8 and 11.

With reference to FIG. 2 , the configuration of the support 110 of the ultrasonic sensor patch 100 according to an embodiment of the present disclosure will be described. FIG. 2 shows a cross-sectional view of the patch-type ultrasonic sensor of FIG. 1 viewed from a direction perpendicular to the surface of the support 110 along A'-A''.

The support 110 is composed of a plurality of flexible layers. In one embodiment, the support 110 may include

electrode layers

113 and 115 and

cover layers

111 and 117, at least a portion of which is a ground electrode or a signal electrode patterned with an electrically conductive material on one or more surfaces. . In some embodiments, only one of the signal electrode and the ground electrode may be patterned on one electrode layer, and in some other embodiments, both the signal electrode and the ground electrode may be patterned on each electrode layer.

The

cover layers

111 and 117 are layers for protecting the

electrode layers

113 and 115 and the internal structure from the outside, and include a lower cover layer 117 where the ultrasonic sensor is detached and an upper cover layer 111 on the opposite side. may include.

The

cover layers

111 and 117 may be at least partially made of a rubber sheet, a sponge-like rubber sheet such as foamed butylene or foamed silicone, a woven fabric, a fibrous non-woven fabric, etc., and may be made of a waterproof or water-repellent material. It can be.

The electrode layer may be composed of a single layer as shown in FIGS. 5 (a) and 6 or a plurality of layers as shown in FIGS. 5 (b) and 7. 2 to 4 illustrate that the electrode layer is composed of

multiple layers

113 and 115.

The electrode layers 113 and 115 are made of an insulating material, and at least one of the ground electrode and the signal electrode may be formed of an electrically conductive material on at least one or both sides of the electrode layers 113 and 115.

The electrode layers 113 and 115 are films made of an insulating material such as polyimide, and the electrodes may be patterned with an electrically conductive material on at least one surface.

In one embodiment, the signal electrode 114 may be formed on a portion of the upper surface of the first electrode layer 113, and the ground electrode 116a may be formed on a portion of the first electrode layer 113. Only the ground electrode 116b may be formed on a portion of the upper surface of the second electrode layer 115.

The support 110 includes a through hole 70 into which a dual in line plug (DIP) RF connector 120 is inserted and fixed to detachably connect the ultrasonic sensor 130. A portion of the through hole 70 may include through

hole vias

112a and 112b. The through

hole vias

112a and 112b may be formed over a portion 112a or the entire 112b in the depth direction of the through hole 70 formed through the entire support 110.

The insertion-mounted RF connector 120 shown in FIGS. 1 to 4 is in a 2-pin form, but is not limited to this and may have a co-axial form.

The through

hole vias

112a and 112b may be electrically connected to at least one of the

ground electrodes

116a and 116b and the signal electrode 114 formed on the electrode layers 113 and 115. The first through hole via 112a may be used to electrically connect the signal pin 121 and the signal electrode 114 of the RF connector 120, and the second through hole via 112b may be used to electrically connect the signal pin 121 of the RF connector 120. It can be used to electrically connect the ground pin 123 and the ground electrode 116.

In one embodiment, the

ground electrodes

116a and 116b may be formed on the plurality of

layers

113 and 115, and the second through hole via 112b may be formed on the plurality of

layers

113 and 115. , 116b) can be electrically connected. In this specification, a via refers to a form in which the inside is plated so that electrodes in contact can be electrically connected.

Referring to FIG. 3, the support 110 may include an insertion-mounted RF connector 120 inserted into the through hole 70, and the signal pin 121 and ground pin 123 of the RF connector 120 It can be fixed 119 to the support 110 in the form of being inserted into the through

hole vias

112a and 112b. The RF connector 120 is physically fixed to the support 110 using an electrically conductive adhesive material, such as conductive epoxy or lead, and is connected to the signal electrode 114 or ground through through-

hole vias

112a and 112b. An electrical connection can be formed with the electrode 116.

The sensor unit RF connector of the ultrasonic sensor 130 may be detachably connected to the signal pin 121 and the ground pin 123 of the RF connector 120.

In this specification, the insertion type RF connector 120 of the support 110 is described as a male connector, and the sensor unit RF connector of the ultrasonic sensor 130 is described as a female connector. However, in the opposite case, does not rule out

With reference to FIG. 4 , the system connector 140 formed on the support 110 according to an embodiment of the present disclosure will be described.

The system connector 140 is used to transmit a signal for controlling the ultrasonic sensor 130 to the ultrasonic sensor patch 100 or to connect to an external device that receives and processes high-frequency signals received from the ultrasonic sensor 130.

In one embodiment, the system connector 140 may include a plurality of connect pins 141. At least a portion of the connect pin 141 may be electrically connected to the ground electrode 116 or the signal electrode 114.

In one embodiment, some of the plurality of pins of the connect pin 141 may be independently electrically connected to the signal electrode 114 that is individually connected to the ultrasonic sensor 130. Accordingly, the external device can individually control the plurality of ultrasonic sensors 130 and individually receive and process high-frequency signals from the plurality of ultrasonic sensors 130.

A portion of the upper cover layer 111 may be exposed to physically secure the system connector 140 to the support and form an electrical connection with the electrode.

In order to ensure stable connection between the system connector 140 and an external device, a less flexible reinforcement plate 150 is formed on the outside of the lower cover layer 117 below the support 110 where the system connector 140 is located. You can.

In FIG. 4, the system connector 140 is shown formed above the support 110, but in other examples, it may be formed outside the lower cover layer 117 below the support 110.

The configuration of a plurality of layers according to an embodiment of the present disclosure will be described with reference to FIGS. 5 to 7 .

The ultrasonic sensor patch 100 includes a plurality of layers, and some of the plurality of layers may include electrode layers 191, 193, and 195 in which a signal electrode or a ground electrode is patterned with an electrically conductive material on at least one surface. there is.

In one embodiment, the electrode layer may be composed of a single electrode layer 191 as shown in FIG. 5 (a), or may be composed of

multiple electrode layers

193 and 195 as shown in FIG. 5 (b).

When the electrode layer is composed of a single layer of electrode layer 191, both a signal electrode and a ground electrode are formed on one side of the electrode layer 191, or a signal electrode is formed on one side and a ground electrode is formed on the other side. can be formed.

FIG. 6 is an enlarged view of a portion (AA) of the electrode layer in FIG. 5 (a). Figure 6 (a) shows an example in which the signal electrode 114c and the ground electrode 116c are each formed in a linear pattern on one side of the electrode layer 191a, and Figure 6 (b) shows the signal electrode 114d. An example is shown in which the electrode layer 191b is formed in a linear pattern on one surface, and the ground electrode 116d is formed in a regional pattern on the remaining area.

Referring to FIG. 6 (a), in one embodiment, a pad, which is an electrically conductive plate formed around the through hole 70c, is connected to a signal electrode 114c formed on one surface of the electrode layer 191a and Each may be connected to the ground electrode 116c. The signal electrode 114c and the ground electrode 116c may be connected to electrodes connected to each signal pin and ground pin of the system connector 140.

Referring to FIG. 6 (b), in one embodiment, the signal electrode 114c formed on one side of the electrode layer 191b is connected to one pad of the through hole 70d, and the other pad of the through hole 70d is connected to the signal electrode 114c formed on one surface of the electrode layer 191b. The pad may be connected to a ground electrode 116d formed in a wide area. The signal electrode 114d and the ground electrode 116d may be connected to each signal pin and ground pin of the system connector 140.

FIG. 7 is an enlarged view of parts (BB, CC) of the electrode layer in FIG. 5 (b). Figure 7 (a) shows the signal electrode 114e and the ground electrodes 116e' and 116e'' each formed in a linear pattern on one side of the first electrode layer 193, and Figure 7 (b) shows the ground electrode. (116f) shows an embodiment in which the electrode layer 195 is formed on most of the entire surface of the second electrode layer 195.

Referring to FIG. 7 (a), in one embodiment, the pad formed around the through hole 70e includes the signal electrode 114e and the ground electrode 116e'' formed in a pattern on one surface of the first electrode layer 193. ) can be connected to each. The signal electrode 114e and the ground electrode 116e'' may be electrically connected to each signal pin and ground pin of the system connector 140, and the ground electrodes 116e' and 116e'' may be connected to another second electrode layer ( 195) and the ground electrode 116f may be electrically connected to each other through a via. Although not shown in FIG. 7, when the signal electrode 114 is formed in multiple layers, the signal electrode 114, like the ground electrode 116, is connected to at least one of the first electrode layer 193 and the second electrode layer 195. Signal electrodes 114 formed in at least a portion of the surface and formed in a plurality of layers may be electrically connected to each other through vias.

As shown in FIG. 7 (b), if most of the area on one side of the second electrode layer 195 is composed of a ground electrode, electromagnetic interference (EMI) can be minimized, and this reduces noise and improves signal quality. Improved sensitivity can be expected.

The configuration of the ultrasonic sensor 130 according to an embodiment of the present disclosure will be described with reference to FIGS. 8 and 9 .

The ultrasonic sensor 130 generates ultrasonic waves according to a housing (160a, 160b, 160c), a sensor unit RF connector (150a, 150b, 150c) detachably coupled to the insertion-mounted RF connector 120, and an electrical control signal. Alternatively, it may include

piezoelectric elements

170a, 170b, and 170c that receive ultrasonic waves and convert them into electrical signals.

The sensor

unit RF connectors

150a, 150b, and 150c are electrically connected to the signal electrode 114 and the ground electrode 116 through the signal pin 121 and ground pin 123 of the RF connector 120, respectively, and are connected to the housing ( It may include signal pins (151a, 151b, 151c) and ground pins (152a, 152b, 152c) located inside 160a, 160b, and 160c.

Signal wires (153a, 153b, 153c) and ground wires (154a, 154b, 154c) may be connected to the signal pins (151a, 151b, 151c) and ground pins (152a, 152b, 152c), respectively, and the signal wires (153a, 153b, 153c may be electrically connected to the rear side of the piezoelectric element (170a, 170b, 170c) close to the sensor RF connector (150a, 150b, 150c).

The ground wire 154a is electrically connected to the front of the piezoelectric element, or the ground wire 154b is electrically connected to the front of the piezoelectric element 170b and electrically connected to the electrically conductive housing 160b, or the ground wire is electrically connected to the front of the piezoelectric element 170b. (154c) may be electrically connected to the matching layer 173c, which is electrically connected to the front surface of the piezoelectric element 170c.

In one embodiment, when the

ground wires

154b and 154c are electrically connected to the housing 160b or the matching layer 173c, the matching layers 173b and 173c used have electrical conductivity on the surface or in their entirety. When the ground wire 154c is connected to the matching layer 173c, the matching layer 173c can be made larger than the piezoelectric element 170c and attached to the piezoelectric element 170c. In this case, the ease of manufacturing the ultrasonic sensor 130 may be increased. Although not shown in FIG. 8, the

signal wires

151a, 151b, and 151c may also be connected to the

sound absorption layers

171a, 171b, and 171c in the same manner if the surfaces of the

sound absorption layers

171a, 171b, and 171c have electrical conductivity.

Accordingly, one side of each of the

piezoelectric elements

170a, 170b, and 170c may be electrically connected to the signal electrode 114 or the ground electrode 116 through the sensor

unit RF connectors

150a, 150b, and 150c.

In one embodiment, the ultrasonic sensor 130 may include a sound-absorbing layer (171a, 171b, 171c) and a matching layer (173a, 173b, 173c) located on the front or rear side of the piezoelectric element (170a, 170b, 170c), respectively. there is.

9 shows that the front portion of the ultrasonic sensor 130 according to an embodiment of the present disclosure may include a structure for focusing an ultrasonic beam, or the shape of the piezoelectric element may be modified.

For example, in order to focus the beam, the aperture surface of the ultrasonic sensor is molded as shown in FIG. 9 (a) (i.e., the front components such as the sound-absorbing layer 171d, the piezoelectric element 170d, and the matching layer 173d) You can use a pressed focusing method to focus the beam (by shaping), or you can use a lens focusing method using

acoustic lenses

181 and 183, as shown in Figures 9 (b) and (c). . The acoustic lens may have a convex shape 181 or a concave shape 183 depending on the lens properties.

Another embodiment of an ultrasonic sensor patch according to an embodiment of the present disclosure will be described with reference to FIGS. 10 and 11 . Figure 10 shows a cross-sectional view of the ultrasonic sensor patch from the side. Detailed descriptions of parts that overlap with those previously described will be omitted.

The ultrasonic sensor patch includes a support 210 composed of a plurality of layers and an ultrasonic sensor.

The support 210 is composed of a plurality of flexible layers. In one embodiment, the support 210 includes electrode layers 213 and 215 and cover

layers

211 and 217, in which at least a portion of one surface of the electrode layers 213 and 215 is a ground electrode or a signal electrode and is formed of a conductive material. may include. In FIG. 10 , the electrode layers 213 and 215 are shown and described as a plurality of layers in one embodiment, but as previously described with reference to FIGS. 5 to 7 , the electrode layers may be composed of a single layer.

A portion of the lower cover layer 217 of the support 210 is opened and the surface mount type RF connector 220a is disposed to be connected to the signal electrode 214 and the ground electrode 216 and has electrical conductivity. An adhesive material 221 (conductive epoxy, lead, etc.) can be used to physically fix the support 210 and form an electrical connection with the electrode. As shown in FIGS. 10 and 11, the surface mount type RF connector may be a coaxial type, and the shape of the connector is not limited. In addition, in FIGS. 10 and 11, the RF connector 220a of the support 210 is described as a female connector, and the sensor unit RF connector of the ultrasonic sensor is described as a male connector, but the opposite case is excluded. I never do that.

The support 210 may include a via 212 that electrically connects the

ground electrodes

216a and 216b formed in a plurality of layers. The support 210 may include a plurality of

electrode layers

213 and 215. In one embodiment, one surface of one of the electrode layers 213 and 215 is a ground electrode 216a. can only be formed. In one embodiment, the electrode may be formed on the lower surface of the plurality of

electrode layers

213 and 215 in the direction in which the ultrasonic sensor is detached, but being formed on the upper surface is not excluded.

The configuration of an ultrasonic sensor according to another embodiment of the present disclosure will be described with reference to FIG. 11 .

The ultrasonic sensor generates ultrasonic waves or transmits ultrasonic waves according to a housing (260a, 260b, 260c), a plug-type sensor unit RF connector (220b1, 220b2, 220b3) that is detachably coupled to the coaxial RF connector (220a), and an electrical control signal. It may include

piezoelectric elements

270a, 270b, and 270c that receive and convert the signal into an electrical signal.

The sensor unit RF connectors 220b1, 220b2, and 220b3 have central terminals 223b1, 223b2, and 223b3 that are electrically connected to the signal electrode 214 and the ground electrode 216, respectively, through the coaxial RF connector 220a of the support 210. ) and outer terminal terminals 225b1, 225b2, and 225b3.

Signal wires (227a, 227b, 227c) and ground wires (229a, 229b, 229c) may be connected to the center terminals (223b1, 223b2, 223b3) and the outer terminals (225b1, 225b2, 225b3), respectively, and signal wires (227a, 227b and 227c may be electrically connected to the back of the

piezoelectric elements

270a, 270b and 270c close to the sensor RF connectors 220b1, 220b2 and 220b3.

In one embodiment, the ultrasonic sensor contacts the matching layers (273a, 273b, 273c) and the sound-absorbing layers (271a, 271b, 271c) with the piezoelectric elements (270a, 270b, 270c) inside the housing (260a, 260b, 260c). can be formed.

The ground wire 229a connected to the outer peripheral terminals 225b1, 225b2, and 225b3 is electrically connected to the front of the piezoelectric element 270a, or the ground wire 229b is electrically connected to the front of the piezoelectric element 270b and is electrically conductive. The ground wire 229c may be electrically connected to the housing 260b, or the ground wire 229c may be electrically connected to the matching layer 273c, which is electrically connected to the front of the piezoelectric element 270c. The matching layers 273b and 273c may be made of an electrically conductive material or their surfaces may be plated with an electrically conductive material.

The size of the matching layer, the composition of the electrical material, the inclusion of a structure for focusing the ultrasonic beam, the shape of the piezoelectric element, etc. may be the same as those previously described with reference to FIGS. 8 and 9.

In the specification (particularly in the claims) of the present disclosure, the use of the term “above” and similar referential terms may refer to both the singular and the plural. In addition, when a range is described in the present disclosure, the invention includes the application of individual values within the range (unless there is a statement to the contrary), and each individual value constituting the range is described in the detailed description of the invention. It's the same.

The use of any examples or illustrative terms (e.g., etc.) in the present disclosure is merely to describe the present disclosure in detail, and unless limited by the claims, the scope of the present disclosure is limited by the examples or illustrative terms. It doesn't work. In addition, those skilled in the art will recognize that various modifications, combinations and changes may be made according to design conditions and factors within the scope of the appended claims or their equivalents.

Therefore, the spirit of the present disclosure should not be limited to the above-described embodiments, and the scope of the patent claims described below as well as all scopes equivalent to or equivalently changed from the claims are within the scope of the spirit of the present disclosure. It will be said to belong to

Claims

A support body composed of a plurality of flexible layers, at least a portion of which includes an electrode layer in which a ground electrode and a signal electrode are patterned with an electrically conductive material on at least one surface;

a connector electrically connected to the ground electrode and the signal electrode of the support and fixed to the support; and

Comprising a plurality of ultrasonic sensors including a sensor unit connector detachably connected to the connector and electrically connected to the ground electrode and the signal electrode through the connector,

Ultrasound patch.
According to claim 1,

The support includes a through hole via electrically connected to at least one of the ground electrode and the signal electrode.

Ultrasound patch.
According to clause 2,

The supports each have flexibility and include an upper cover layer, at least one electrode layer, and a lower cover layer from the opposite side of the position where the ultrasonic sensor is attached and detached,

The electrode layer is made of an insulating material, and at least one of the ground electrode and the signal electrode is formed of an electrically conductive material in at least a portion of at least one surface,

Ultrasound patch.
According to clause 3,

The electrode layer includes a first electrode layer and a second electrode layer,

The ground electrode and the signal electrode are formed on at least a portion of each of the first electrode layer and the second electrode layer,

At least one of the through hole vias electrically connects the ground electrodes formed on the first electrode layer and the second electrode layer to each other, or electrically connects the signal electrodes formed on the first electrode layer and the second electrode layer to each other. connecting to,

Ultrasound patch.
According to clause 3,

The electrode layer includes a first electrode layer and a second electrode layer,

The ground electrode is formed on at least a portion of each of the first electrode layer and the second electrode layer,

At least one of the through hole vias is electrically connected to the ground electrode formed on the first electrode layer and the second electrode layer,

Ultrasound patch.
According to clause 3,

The electrode layer includes a first electrode layer and a second electrode layer,

The ground electrode is formed on at least a portion of each of the first electrode layer and the second electrode layer,

The signal electrode is formed on at least a portion of the first electrode layer and is not formed on the second electrode layer,

Ultrasound patch.
According to clause 3,

The electrode layer consists of one layer,

The signal electrode and the ground electrode are each formed on at least a portion of the electrode layer,

Ultrasound patch.
According to clause 2,

The connector is an insertion-mounted connector, and the protruding pin of the insertion-mounted connector is fixed to the support in the form of being inserted into the through hole via.

Ultrasound patch.
According to clause 8,

The ultrasonic sensor is,

housing;

The sensor unit connector detachably coupled to the insertion-mount type connector; and

A piezoelectric element located inside the housing and electrically connected on one side to the signal electrode or the ground electrode through the sensor connector,

Ultrasound patch.
According to clause 9,

The sensor unit connector includes a signal pin and a ground pin located inside the housing while being electrically connected to the signal electrode and the ground electrode, respectively,

The signal pin and the ground pin are electrically connected to the piezoelectric element through a signal wire and a ground wire, respectively,

Ultrasound patch.
According to clause 9,

The signal wire is directly connected to the signal pin and the back of the piezoelectric element,

The ground wire is directly connected to the ground pin, directly connected to the front of the piezoelectric element, electrically indirectly connected to the front of the piezoelectric element through the inner surface of the housing, or a mating wire located in the front direction of the piezoelectric element. Electrically indirectly connected to the front of the piezoelectric element through a layer,

Ultrasound patch.
According to claim 1,

The connector is,

A surface-mount type connector electrically connected to the ground electrode and the signal electrode,

Ultrasound patch.
According to claim 12,

The ground electrode and the signal electrode are formed on the lower surface of the electrode layer in the direction in which the surface-mounted connector is connected,

Ultrasound patch.
According to claim 12,

The supports each have flexibility and include an upper cover layer, at least one electrode layer, and a lower cover layer from the opposite side of the position where the ultrasonic sensor is attached and detached,

The electrode layer includes a first electrode layer and a second electrode layer,

The support includes a via that electrically connects the ground electrode and the signal electrode formed on at least a portion of each of the first electrode layer and the second electrode layer,

Ultrasound patch.
According to claim 14,

The ultrasonic sensor is,

housing;

a sensor connector detachably coupled to the surface-mounted connector; and

Located inside the housing, one side of the signal electrode and the piezoelectric element are electrically connected through a signal terminal of the sensor portion connector, and the ground electrode and the other side of the piezoelectric element are electrically connected through a ground terminal of the sensor portion connector. Including the piezoelectric element electrically connected,

Ultrasound patch.
According to claim 1,

Further comprising a system connector fixed above the support, electrically connected to the ground electrode and the signal electrode, and receiving a control signal of the ultrasonic sensor,

Ultrasound patch.
According to claim 16,

The permanent system connector includes a plurality of system connector pins, and the plurality of ultrasonic sensors electrically connected to the connector pins through a ground electrode and a signal electrode of the support are individually connected based on a control signal from an external control device connected to the system connector. or collectively controlled,

Ultrasound patch.