WO2023176823A1 - Printed circuit board design assistance device and design assistance method, and program for causing computer to execute design assistance method - Google Patents

Printed circuit board design assistance device and design assistance method, and program for causing computer to execute design assistance method Download PDF

Info

Publication number
WO2023176823A1
WO2023176823A1 PCT/JP2023/009824 JP2023009824W WO2023176823A1 WO 2023176823 A1 WO2023176823 A1 WO 2023176823A1 JP 2023009824 W JP2023009824 W JP 2023009824W WO 2023176823 A1 WO2023176823 A1 WO 2023176823A1
Authority
WO
WIPO (PCT)
Prior art keywords
design
printed circuit
circuit board
index information
specifications
Prior art date
Application number
PCT/JP2023/009824
Other languages
French (fr)
Japanese (ja)
Inventor
公彦 川本
Original Assignee
三菱電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三菱電機株式会社 filed Critical 三菱電機株式会社
Publication of WO2023176823A1 publication Critical patent/WO2023176823A1/en

Links

Images

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00—Computer-aided design [CAD]
    • G06F30/30—Circuit design
    • G06F30/39—Circuit design at the physical level
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2115/00—Details relating to the type of the circuit
    • G06F2115/12—Printed circuit boards [PCB] or multi-chip modules [MCM]

Definitions

  • the present disclosure relates to technology for supporting the development of printed circuit boards, and more specifically, to technology for supporting the design of printed circuit boards.
  • determining the design specifications to be achieved is not only influenced by the miniaturization of mounted components and the increase in the number of pins, but also the overall number of mounted components, board size, and many other factors. It is necessary to find out.
  • the factors to be determined it is necessary to determine the combination of multiple factors such as wiring width, clearance between wiring, and number of layers of the printed circuit board. Therefore, there was a problem in that it required a lot of experience and a lot of effort.
  • the design specifications cannot be determined until the component placement design, which is the pre-wiring design stage of the printed wiring board design work, is completed, and the wiring design is performed based on the tentatively determined design specifications. If it was determined to be difficult, it was necessary to start over from the parts layout design. Therefore, there is a need for technology that can quickly determine design specifications for printed circuit boards.
  • One objective according to certain aspects is to provide a technique that can determine design specifications for printed circuit boards that require a large amount of wiring at an early stage of design work.
  • a printed circuit board design support device includes a storage unit that stores design index information for each of a plurality of printed circuit boards designed in the past, an input unit that receives input of design index information for a newly designed printed circuit board, and and a processing section for proposing design specifications for a newly designed printed circuit board based on the design index information inputted above and the input design index information.
  • the processing unit aggregates each of the design index information into one or more design specifications by grouping the design index information, and from the one or more design specifications, designs a design including the design index information of the newly designed printed circuit board. The specifications are determined, and the design specifications of the newly designed printed circuit board are output.
  • design index information for a printed circuit board that requires a lot of wiring is calculated at the time of starting the design of the printed circuit board, and appropriate design specifications for the printed circuit board can be obtained at an early stage.
  • FIG. 1 is a functional block diagram illustrating an outline of functions provided in a printed circuit board design support system 100 according to the first embodiment.
  • FIG. 3 is a diagram conceptually representing one aspect of data storage in a circuit design information database (DB) 130.
  • FIG. It is a diagram conceptually representing one mode of data storage in the design specification performance DB 140.
  • 1 is a block diagram showing the hardware configuration of a computer system 400 that implements a printed circuit board design support system 100.
  • FIG. 2 is a flowchart showing part of the processing executed by the CPU 1 of the computer system 400 functioning as the printed circuit board design support system 100.
  • FIG. FIG. 3 is a diagram illustrating an example of a mode in which design indicators are grouped using a design specification ID (Identification) that identifies a design specification.
  • FIG. 3 is a diagram illustrating an example of grouping design indicators using a graph.
  • FIG. 7 is a diagram illustrating another aspect of grouping design indicators using a graph.
  • FIG. 7 is a diagram illustrating a manner in which the printed circuit board design support system according to the second embodiment groups design indicators.
  • FIG. 7 is a diagram illustrating another manner in which the printed circuit board design support system according to the second embodiment groups design indicators.
  • FIG. 1 is a functional block diagram schematically illustrating the functions of a printed circuit board design support system 100 according to the first embodiment.
  • the printed circuit board design support system 100 includes an input section 110, a processing section 120, a circuit design information DB (Database) 130, a design specification performance DB 140, a storage section 150, and an output section 160. and a communication section 170.
  • the printed circuit board design support system 100 is used for designing printed circuit boards. As will be described later, the printed circuit board design support system 100 can determine design specifications for a printed circuit board and output data representing the design specifications.
  • the design specification is composed of a plurality of design index values (hereinafter referred to as design index information). Design indicators include electrode density, connection density, building coverage ratio, component density, etc. Details of the design index will be described later.
  • the input unit 110 receives operation inputs from a user (for example, a development worker) of the printed circuit board design support system 100.
  • the operations include, for example, an operation of storing information and an operation of instructing execution of processing of each function described later.
  • the input unit 110 is realized by a keyboard (KB), a mouse, a microphone, etc.
  • the input unit 110 may be input from an auxiliary storage device such as a USB (Universal Serial Bus) memory or a DVD (Digital Versatile Disc), or from a receiving interface or network (not shown) such as a parallel bus or serial bus. It may be configured to accept input of information output from other connected devices.
  • USB Universal Serial Bus
  • DVD Digital Versatile Disc
  • the processing unit 120 executes instructions (programs) for realizing the printed circuit board design support system 100.
  • the processing section 120 includes a calculation section 121 and a design information processing section 122.
  • the design information processing section 122 includes a design index calculation module 123 and a design index comparison and analysis module 124.
  • the calculation unit 121 realizes an overall function of software processing. For example, the calculation unit 121 receives information from the storage unit 150 according to a command input to the input unit 110, and passes the information to the design information processing unit 122 and the output unit 160.
  • the design index calculation module 123 uses the information stored in the storage unit 150 to calculate electrode density, connection density, building coverage ratio, component density, and other design factors necessary for determining the design specifications of the printed circuit board. Calculate indicators. Furthermore, the design information processing unit 122 stores these calculated design indices in the design specification performance DB 140 as information constituting one design specification of the printed circuit board (hereinafter also referred to as "design specification information").
  • each design index includes, for example, electrode density, connection density, building coverage ratio, and component density, and may also include other information.
  • Electrode density is a design index that indicates the ratio of the total number of electrodes that a mounted component has to the area of a printed circuit board.
  • the total number of electrodes is, for example, the number of electrically connected connection electrodes, and may be the total number of electrodes that a mounted component has.
  • Connection density is a design index that indicates the ratio of the total number of connections that all signal groups have to the area of the printed circuit board.
  • the building coverage ratio is a design index that indicates the ratio of the total component area occupied by mounted components to the area of the printed circuit board.
  • Component density is a design index that indicates the ratio of the total number of electrodes of the mounted components to the total number of components mounted on the printed circuit board.
  • the area of the printed circuit board may be, for example, the total area represented by the board size, the total area of the front or back surface, or even the area excluding the prohibited area from the total area of the printed circuit board. .
  • the design index comparison analysis module 124 selects at least one of the design indexes calculated by the design index calculation module 123 and the design index information 141 of printed circuit boards that have been designed in the past and are already stored in the design specification performance DB 140. Compare with the above design index information. Furthermore, the design index comparison analysis module 124 determines the design specifications of the printed circuit board to be designed this time by analyzing the results of the comparison.
  • the circuit design information DB 130 includes information required by the printed circuit board design support system 100 according to the present embodiment, in addition to information necessary for design held by a known printed circuit board design device, a so-called CAD (Computer-Aided Design) system. Also includes information.
  • the circuit design information DB 130 includes mounted component information 131, board information 132, and connection information 133. Details of the data structure of the circuit design information DB 130 will be described later (FIG. 2).
  • the design specification performance DB 140 includes design index information 141.
  • the design index information 141 is used by the printed circuit board design support system 100. Details of the design specification performance DB 140 will be described later (FIG. 3).
  • the circuit design information DB 130 and the design specification performance DB 140 are managed in a hard disk, SSD, or other nonvolatile storage device. Note that although the circuit design information DB 130 and the design specification performance DB 140 are provided inside the printed circuit board design support system 100, in other aspects, these databases may be installed in the printed circuit board design support system 100. It may also be provided in an accessible external storage device.
  • the storage unit 150 stores information input to the input unit 110, information required by the processing unit 120 for arithmetic processing, information generated by the processing unit 120, information output from the output unit 160, and a printed circuit board. It holds other information necessary for the design support system 100 to operate.
  • the storage unit 150 includes multiple storage areas for storing instructions or data.
  • the storage unit 150 includes a component information area 151, a board information area 152, and a connection information area 153.
  • the component information area 151 stores information such as the shape of each component mounted on the printed circuit board and the number of connection terminals provided for pattern wiring. Furthermore, the component information area 151 stores the type of mounting when each component is mounted on the printed circuit board, and information representing the unmountable area specific to the component.
  • the board information area 152 contains information on the shape and area of the printed circuit board, the width of the peripheral area of the printed circuit board that is predetermined as a prohibited mounting area, and the prohibited area provided at the end of the printed circuit board or any other location. The area information is retained.
  • connection information area 153 stores electrical connection information between a plurality of terminals of mounted components for each of a plurality of pre-designed electrical connections required between a plurality of mounted components on a printed circuit board. . Furthermore, the connection information area 153 also stores other information such as the number of connection nets, the number of connections, the number of connection electrodes, which is the total of a plurality of electrical connections.
  • the number of connected nets is the total number of signal groups existing in the printed circuit board, with one electrically connected signal group having the same potential.
  • the storage unit 150 is realized by a hard disk device, a removable magnetic storage device, an SSD (Solid State Drive), or other semiconductor storage device.
  • the output unit 160 outputs information to the outside of the printed circuit board design support system 100.
  • the information includes, for example, information input to the input unit 110, information stored in the printed circuit board design support system 100, information generated by the processing unit 120, and the like. This information is confirmed by the development worker.
  • the output unit 160 is realized as a monitor device such as a liquid crystal display, a CRT (Cathode Ray Tube) display, or an organic EL (Electro Luminescence) display.
  • the output unit 160 can be implemented as a printer or plotter that can print information in the form of characters, images, or the like.
  • the communication unit 170 is connected to a network (not shown) and communicates with other information communication terminals.
  • the form of communication may be either wired communication or wireless communication.
  • the communication unit 170 can function as the above-mentioned receiving interface.
  • the printed circuit board design support system 100 can be realized by one computer system. According to other embodiments, the printed circuit board design support system 100 may also be implemented on a cloud server. In this case, the printed circuit board design support system 100 supports printed circuit board design in response to a request from another information communication terminal (for example, a client terminal, a personal computer, a tablet terminal, etc.) received via the communication unit 170. Each piece of information is calculated, and the calculation results are transmitted to the other information communication terminal via the communication unit 170. With such a configuration, the printed circuit board design support system according to this embodiment can also be realized as a cloud service.
  • another information communication terminal for example, a client terminal, a personal computer, a tablet terminal, etc.
  • FIG. 2 is a diagram conceptually showing one aspect of data storage in the circuit design information DB 130.
  • the circuit design information DB 130 includes mounted component information 131, board information 132, and connection information 133.
  • the mounted component information 131 includes information on each component mounted on the printed circuit board. More specifically, the mounted component information 131 includes component ID, dimensional information (width, height, length) of the component, the number of terminals for electrical connection (number of connection terminals), and component type. name, mounting type information, and non-mountable area information.
  • the mounting type information indicates whether the component is mounted on the surface of the printed circuit board (a so-called surface mount component), or the electrode is inserted into a hole formed on the printed circuit board. Indicates whether it is a component (so-called insertion mounting component).
  • the non-mountable area information represents the area of a region that is generated around the component when the component is mounted, and is unique to the component and cannot be mounted.
  • the connection information 133 includes the number of connection nets representing the number of connection groups on the entire board, the number of connection electrodes that is the total of connection destinations of the connection groups, a connection ID, information on N connection destinations, and the number of connections.
  • the connection ID identifies each of the plurality of electrical connection groups.
  • the connection destination information specifies, for each connection ID, a plurality of connection destinations to be mutually connected.
  • the number of connections specifies the number of such interconnections.
  • FIG. 3 is a diagram conceptually representing one aspect of data storage in the design specification performance DB 140.
  • the design specification performance DB 140 stores design index information 141 that constitutes the design specifications of the printed circuit board calculated by the printed circuit board design support system 100.
  • the design index information 141 includes board ID, electrode density, connection density, building coverage ratio, component density, component density, wiring width, wiring clearance, and number of wiring layers.
  • the board ID identifies a printed circuit board having a certain design specification. Therefore, when one board ID is specified, one design specification is specified.
  • FIG. 4 is a block diagram showing the hardware configuration of a computer system 400 that implements the printed circuit board design support system 100.
  • the computer system 400 includes, as main components, a CPU 1 that executes programs, a mouse 2 and a keyboard 3 that receive instructions from a user of the computer system 400, and data generated by executing programs by the CPU 1, or a mouse 2.
  • a RAM 4 that volatilely stores data input via the keyboard 3
  • a hard disk 5 that stores data nonvolatilely
  • an optical disk drive 6, a communication interface (I/F) 7, and a monitor 8. include.
  • Each component is connected to each other by a data bus.
  • the optical disk drive device 6 is loaded with a CD-ROM 9 and other optical disks.
  • Each component constituting the computer system 400 shown in FIG. 4 is common. Therefore, it can be said that one of the essential parts of the technical idea according to the present disclosure is software stored in the RAM 4, hard disk 5, CD-ROM 9, and other recording media, or software that can be downloaded via a network.
  • the recording medium is not limited to CD-ROM, FD (Flexible Disk), hard disk, but also SSD, magnetic tape, cassette tape, optical disk (MO (Magnetic Optical Disc) / MD (Mini Disc) / DVD (Digital Versatile Disc). )), IC (Integrated Circuit) cards (including memory cards), optical cards, mask ROM, EPROM (Electronically Programmable Read-Only Memory), EEPROM (Electronically Erasable Programmable Read-Only Memory), semiconductor memories such as flash ROM, etc. It may also be a medium that permanently carries a program.
  • the program here includes not only programs that can be directly executed by the CPU 1, but also programs in source program format, compressed programs, encrypted programs, and the like.
  • FIG. 5 is a flowchart showing a part of the processing realized by the CPU 1 of the computer system 400 functioning as the printed circuit board design support system 100 executing each instruction included in the program. Note that in other aspects, part or all of the following processing may be realized as a combination of circuit elements configured to execute the processing.
  • step S510 the CPU 1 reads data from the circuit design information DB 130. More specifically, in response to a user input to the input unit 110, the CPU 1 converts design information (mounted component information 131 and board information 132) of a printed circuit board designated as a new design target by the user input into a circuit. Extracted from the design information DB 130.
  • step S515 the CPU 1 stores the read data in the temporary work area. More specifically, the CPU 1 stores mounted component information 131 in the component information area 151 and board information 132 in the board information area 152 among the extracted design information.
  • step S520 the CPU 1 calculates the number of connections, the number of connected nets, and the number of connected electrodes.
  • step S525 the CPU 1 stores the connection information and the calculation results of step S520 (the number of connections, the number of connected nets, and the number of connected electrodes) in the connection information area 153.
  • step S530 the CPU 1, as the design index calculation module 123, calculates necessary design index values (design index information) from the stored information. More specifically, the CPU 1 uses the stored information to calculate design index information of at least one of electrode density, connection density, building coverage ratio, and component density, and stores the calculation results in the design specification performance DB 140. Write.
  • step S535 the CPU 1, as the design index comparison and analysis module 124, extracts the design index information of all previously designed printed circuit boards stored in the design specification record DB 140.
  • step S540 the CPU 1 determines whether all design index information has been read out.
  • the control is switched to step S545. If not (NO in step S540), the CPU 1 returns control to step S535 and continues extracting the design index information.
  • FIG. 6 is a diagram illustrating an example of how design indicators are grouped using a design specification ID that identifies a design specification.
  • FIG. 7 is a diagram illustrating an example of grouping design indicators using a graph.
  • FIG. 8 is a diagram illustrating another example of grouping design indicators using a graph.
  • a design specification ID is provided for each design specification.
  • the CPU 1 compares each design index information associated with each board ID with a preset range, and determines to which range each design index information belongs.
  • the CPU 1 can group boards having the same design index information (eg, number of wiring layers, wiring width, clearance between wiring) characterizing the design specifications as having the same design specification.
  • the CPU 1 can group the design indicators by graphing them in a mapping manner.
  • the CPU 1 uses the design index values shown in FIG. 6 to group the design information by dividing it into regions for each design specification.
  • the CPU 1 arbitrarily or in response to user input sets a design specification ID for identifying the design specification.
  • the CPU 1 classifies (groups) each board ID into one of the design specifications by associating each design specification ID with one or more board IDs determined to belong to the same design specification.
  • the CPU 1 determines which group's value range includes the design index of the board, which is the new design specification. It can be determined whether the
  • step S550 the CPU 1 determines whether all design information has been grouped.
  • the control is switched to step S555. If not (NO in step S550), the CPU 1 returns control to step S545.
  • step S555 the CPU 1 compares the extracted design index information with the design index information of the newly designed printed circuit board.
  • the CPU 1 compares and determines, for each piece of design index information, which design specification ID grouped by the design index information of the designed printed circuit board includes the design index information of the newly designed printed circuit board. .
  • the CPU 1 calculates the maximum number and minimum value of the design index information of each board ID included in each design specification, compares the magnitude relationship, and determines in which range the design index information is included. Determine whether As a mode of comparative judgment according to another aspect, the CPU 1 calculates a value indicating the variation (for example, standard deviation), taking into account the variation in other design index information, and determines which range the value falls within. You may.
  • the design index information may be included in multiple design specification IDs. In this case, the CPU 1 can group the board IDs having the design index information so that they belong to each of the plurality of design specification IDs.
  • step S560 the CPU 1 determines whether the affiliations of all the design index information of the newly designed printed circuit board have been determined. This determination is made, for example, based on whether or not results of comparison determination (step S555) have been obtained for the number of design indicators for a newly designed printed circuit board.
  • step S555 results of comparison determination
  • step S565 the CPU 1 determines the design specifications of the printed circuit board. This determination is a suggestion to the user, and the user can also select design specifications as appropriate. For example, as a result of the comparison in step S555, there may be a case where a plurality of design specifications corresponding to one design index exist. In this case, the CPU 1 analyzes the design specifications to which two or more design indicators belong in order to further improve the accuracy of determining the design specifications. For example, regarding electrode density, if the wiring width and wiring clearance are the same but belong to multiple design specifications that differ in the number of wiring layers, the CPU 1 will also combine the judgment results based on the building coverage ratio, connection density, component density, and other design indicators. analysis.
  • a design specification with a high specification value of design index information means, for example, that in the case of the number of wiring layers, the number of wiring layers is greater than the predetermined standard number of wiring layers, and in the case of wiring width, that the number of wiring layers is greater than the standard number of wiring layers.
  • the width must be the smallest, and in the case of a wiring clearance, the clearance must be the smallest.
  • the CPU 1 prints a new design specification in which part or all of the plurality of design index information has higher specifications than the design index information included in other design specifications, depending on the performance or function required of the printed circuit board. It can be proposed as a board design specification. In another aspect, the CPU 1 may select a design specification including high-spec design index information according to a priority order set in advance for design index information by a user of the printed circuit board design support system 100.
  • the CPU 1 calculates information of a group closer to the center of the area indicated by the design specification to which it belongs shown in FIG. 7 or 8 for each design index, and calculates the design index information closest to the center.
  • the design specification to which the resulting board ID belongs can be determined as the final design specification.
  • the CPU 1 defines an area consisting of two or more design indicators out of a plurality of design indicators, and selects an area where the value between the center value of the area and the design indicator information of a newly designed printed circuit board is the smallest.
  • the specified design specifications may be used as candidates for the design specifications of the newly designed printed circuit board.
  • the area illustrated in FIGS. 7 and 8 is an area defined by two of the plurality of design indicators.
  • the CPU 1 when calculating the design index, for example, if calculation is performed that does not take into account the area of the prohibited area in the area of the printed circuit board, the CPU 1 generates new design index information that takes into account the area of the prohibited area. may be used to perform the above analysis. Further, the CPU 1 may also use, as design index information, an index using the number of connected electrodes with respect to a value calculated using the number of electrodes of all parts for the electrode density.
  • FIGS. 9 and 10 are diagrams each illustrating a manner in which the printed circuit board design support system according to the second embodiment groups design indicators.
  • the printed circuit board design support system supports the printed circuit board design support according to the first embodiment in that when grouping, design indicators with higher reliability are selected to configure design specifications. This is different from the system 100.
  • the hardware configuration of the printed circuit board design support system according to this embodiment is the same as the hardware configuration of the printed circuit board design support system 100 according to the first embodiment. Therefore, the description of the hardware configuration will not be repeated.
  • Printed circuit boards may be designed. For example, a board that can actually be designed with two wiring layers may have four wiring layers, or due to product structure issues, a board that can be designed with a board size of 10 mm x 50 mm may have a board size of 10 mm x 50 mm. There may be cases where a printed circuit board is designed with a board size of ⁇ 50 mm.
  • Classifying the design specifications of a board with such likelihood by comparing them with the design specifications of a newly designed board may easily lower the level of the design specifications of the newly designed board. obtain.
  • the printed circuit board design support system uses lower design indicators arbitrarily set by the user among the design specifications of printed circuit boards that have been designed in the past (for example, FIGS. 7 and 8).
  • the remaining design specifications from which the design specifications that have been omitted are adopted as a group to be compared.
  • a lower-order design index refers to a design index whose value (design index information) is less than a predetermined reference value. Therefore, a printed circuit board with design specifications made up of lower-level design indicators can be a printed circuit board with guaranteed minimum quality.
  • the printed circuit board design support system compares a design specification consisting of design indicators of printed circuit boards belonging to the group with a design specification consisting of design indicators of a newly designed printed circuit board.
  • the CPU 1 of the printed circuit board design support system selects the area surrounded by the broken line among the design specifications 1 and 2 as a design specification having a lower design index. Determine target.
  • the CPU 1 uses the remaining area from which the area has been removed as a comparison target.
  • the CPU 1 determines the rectangular area surrounded by the broken line to be omitted as a design specification having a lower design index. As shown in state (B), the CPU 1 uses the remaining area from which the area has been removed as a comparison target.
  • the printed circuit board design support system forms a group with reduced likelihood by omitting information on previously designed printed circuit boards with lower design indicators, and uses the information for comparison. Only the relevant group. The user can determine design specifications for a new printed circuit board having highly accurate design specifications.
  • the CPU 1 may select an area consisting of design index information having a value exceeding a threshold value specified by the user or a predetermined reference value as the design specification to be compared. In this case, a design specification consisting of design index information with higher specifications is more likely to be selected.
  • the printed circuit board design support system 100 holds design index information of already designed printed circuit boards and design specification information aggregated by the design index information.
  • the CPU 1 of the printed circuit board design support system 100 compares design index information of the newly designed printed circuit board with design specification information of a previously designed printed circuit board. Then, the design specification to which the design index information of the newly designed printed circuit board belongs is determined.
  • the printed circuit board design support system 100 can quickly determine the design specifications of a newly designed printed circuit board, so that the printed circuit board designer can obtain design information at an early stage. As a result, at a later stage, the design can be proceeded without it being determined that wiring is difficult with the temporarily decided design specifications, and it is possible to prevent redoing the layout design.
  • a printed circuit board design support device a storage unit that stores design index information for each of a plurality of printed circuit boards designed in the past; An input section that accepts input of design index information for the newly designed printed circuit board; a processing unit for proposing design specifications for a newly designed printed circuit board based on the stored design index information and the input design index information;
  • the above processing section is By grouping each of the above design index information, it can be aggregated into one or more design specifications, From the one or more design specifications above, determine a design specification that includes design index information of the newly designed printed circuit board, A printed circuit board design support device that outputs design specifications for the newly designed printed circuit board.
  • the above determination is such that the design index information of the newly designed printed circuit board is between the maximum value and the minimum value of the design index information of any one of the plurality of previously designed printed circuit boards.
  • the printed circuit board design support device according to configuration example 1 including selecting the design specifications of the newly designed printed circuit board as the design specifications of any of the above printed circuit boards based on the fact that the design specifications are included in the printed circuit board.
  • the above determination means that when the design index information of the newly designed printed circuit board is aggregated into the design specifications of any of the plurality of previously designed printed circuit boards, the information will be included in the aggregated design specifications.
  • Configuration example 4 The above decision is determining multiple design specifications; Configuration Examples 1 to 3, including setting a design specification that includes the highest performance design index information among the design index information of each of the plurality of design specifications as the design specification of the newly designed printed circuit board.
  • the printed circuit board design support device according to any one of the above.
  • the above decision is determining multiple design specifications; Deriving the center of each of the plurality of design specifications, The design specification including the design index information that minimizes the difference between the center of each of the above and the design index information of the newly designed printed circuit board is set as the design specification of the newly designed printed circuit board.
  • the design support device according to any one of configuration examples 1 to 3, including:
  • a printed circuit board design support method comprising: a step of accessing design index information for each of a plurality of printed circuit boards designed in the past; and a step of consolidating each of the above design index information into one or more design specifications by grouping; a step of receiving input of design index information for the newly designed printed circuit board; determining a design specification including design index information of the newly designed printed circuit board from the one or more design specifications;
  • a printed circuit board design support method comprising the step of outputting the design specifications of the newly designed printed circuit board.
  • the design index information of the newly designed printed circuit board is between the maximum value and the minimum value of the design index information of any one of the plurality of previously designed printed circuit boards.
  • the above determining step is performed when the design index information of the newly designed printed circuit board is aggregated into the design specifications of any of the plurality of previously designed printed circuit boards, the information included in the aggregated design specification.
  • the steps to determine the above are: determining a plurality of design specifications; Configuration Examples 7 to 9, including the step of setting a design specification that includes the highest performance design index information among the design index information of each of the plurality of design specifications as the design specification of the newly designed printed circuit board.
  • the steps to determine the above are: determining a plurality of design specifications; deriving the center of each of the plurality of design specifications; a step of setting a design specification including design index information that minimizes the difference between the centers of each of the above and the design index information of the newly designed printed circuit board as the design specification of the newly designed printed circuit board;
  • the disclosed technology can be used as a device that supports printed circuit board design, as a cloud service that supports printed circuit board design, or as a program that supports printed circuit board design.
  • CPU1 2 Mouse, 3 Keyboard, 4 RAM, 5 Hard disk, 6 Optical disk drive, 7 Communication interface, 8 Monitor, 9 ROM, 100 Printed circuit board design support system, 110 Input section, 120 Processing section, 121 Arithmetic section, 122 Design information processing unit, 123 Design index calculation module, 124 Design index comparison analysis module, 130 Circuit design information database (DB), 131 Mounted parts information, 132 Board information, 133 Connection information, 140 Design specification performance DB, 141 Design index information , 150 storage unit, 151 parts information area, 152 board information area, 153 connection information area, 160 output unit, 170 communication unit, 400 computer system.
  • DB Circuit design information database

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Evolutionary Computation (AREA)
  • Geometry (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

Disclosed is a technology for reducing the amount of reworking the design of a printed circuit board. In this invention, processing to be executed by a CPU of a printed circuit board design assistance system comprises: a step (S510) of extracting, from a database, design information relating to a printed circuit board to be designed newly; a step (S520) of calculating the number of connections, the number of connected lines, and the number of connected electrodes; a step (S530) of calculating design metrics information relating to the printed circuit board; a step (S545) of grouping the sets of design metrics information relating to designed printed circuit boards if all the sets of design metrics information are determined to have been read (YES in step S540); a step (S555) of comparing the design metrics information relating to the printed circuit board to be designed newly and the sets of design metrics information relating to designed printed circuit boards; a step (S565) of determining design specifications if associations of all the sets of design metrics information have been determined (YES in step S560).

Description

プリント基板の設計支援装置および設計支援方法、ならびに、当該設計支援方法をコンピュータに実行させるプログラムPrinted circuit board design support device and design support method, and a program that causes a computer to execute the design support method
　本開示は、プリント基板の開発を支援する技術に関し、より特定的には、プリント基板の設計を支援する技術に関する。 The present disclosure relates to technology for supporting the development of printed circuit boards, and more specifically, to technology for supporting the design of printed circuit boards.
　近年、プリント基板の開発環境においては、搭載部品の小型化、多ピン化、高速化により、設計作業の難易度が上昇し、その対策のために早期の設計仕様の見極めが必要となってきている。 In recent years, in the printed circuit board development environment, the difficulty of design work has increased due to the miniaturization, increased number of pins, and increased speed of mounted components, and it has become necessary to ascertain design specifications at an early stage to counter this. There is.
　プリント基板の開発の中でも特に、実現する設計仕様の見極めは、搭載部品の小型化、多ピン化による影響だけでなく、全体の搭載部品数、基板のサイズ、等多くの要素が関連する中で見極める必要がある。また、見極める要素については、配線幅、配線間のクリアランス、プリント基板の層数といった複数の要素の組み合わせを見極める必要がある。そのため、多くの経験と多大な労力を要するという問題があった。 Particularly in the development of printed circuit boards, determining the design specifications to be achieved is not only influenced by the miniaturization of mounted components and the increase in the number of pins, but also the overall number of mounted components, board size, and many other factors. It is necessary to find out. In addition, regarding the factors to be determined, it is necessary to determine the combination of multiple factors such as wiring width, clearance between wiring, and number of layers of the printed circuit board. Therefore, there was a problem in that it required a lot of experience and a lot of effort.
　一般的なプリント基板設計装置においては、予め層構成や配線幅を仮決定し、部品配置設計後に配線すべき量と整合が取れているか配線容量からプリント基板の設計の実現可否を判断する技術が用いられているが、実現できない場合には部品配置設計からやり直しするといった手戻りが発生するという課題がある（特許文献１参照）。 In general printed circuit board design equipment, there is a technology that temporarily determines the layer structure and wiring width in advance, and then determines whether the printed circuit board design is possible based on the wiring capacity and whether it matches the amount of wiring after designing the component layout. However, if it cannot be realized, there is a problem in that rework such as redoing the component layout design occurs (see Patent Document 1).
特開平７－１６０７５１号公報Japanese Unexamined Patent Publication No. 7-160751
　このようなプリント基板設計装置においては、プリント配線板の設計作業の内、配線設計の前段階である部品配置設計が完了するまで設計仕様の見極めができず、仮決めした設計仕様で配線設計が困難だと判断された場合には部品配置設計からやり直す必要があった。したがって、プリント基板の設計仕様を早期に決定できる技術が必要とされている。 In such printed circuit board design equipment, the design specifications cannot be determined until the component placement design, which is the pre-wiring design stage of the printed wiring board design work, is completed, and the wiring design is performed based on the tentatively determined design specifications. If it was determined to be difficult, it was necessary to start over from the parts layout design. Therefore, there is a need for technology that can quickly determine design specifications for printed circuit boards.
　本開示は、上記のような問題点を解決するためになされたものである。ある局面に従う目的の一つは、設計作業の早期の段階において、多くの配線を要するプリント基板の設計仕様を決定できる技術を提供することである。 The present disclosure has been made to solve the above problems. One objective according to certain aspects is to provide a technique that can determine design specifications for printed circuit boards that require a large amount of wiring at an early stage of design work.
　ある実施の形態に従うと、プリント基板の設計支援装置が提供される。この設計支援装置は、過去に設計された複数のプリント基板の各々の設計指標情報を格納する記憶部と、今回新たに設計されるプリント基板の設計指標情報の入力を受け付ける入力部と、上記格納されている設計指標情報と、上記入力された設計指標情報とに基づいて、新たに設計されるプリント基板の設計仕様を提案するための処理部とを備える。上記処理部は、上記各々の設計指標情報をグループ化することにより一以上の設計仕様に集約し、上記一以上の設計仕様から、上記新たに設計されるプリント基板の設計指標情報が含まれる設計仕様を決定し、上記新たに設計されるプリント基板の設計仕様を出力する。 According to an embodiment, a printed circuit board design support device is provided. This design support device includes a storage unit that stores design index information for each of a plurality of printed circuit boards designed in the past, an input unit that receives input of design index information for a newly designed printed circuit board, and and a processing section for proposing design specifications for a newly designed printed circuit board based on the design index information inputted above and the input design index information. The processing unit aggregates each of the design index information into one or more design specifications by grouping the design index information, and from the one or more design specifications, designs a design including the design index information of the newly designed printed circuit board. The specifications are determined, and the design specifications of the newly designed printed circuit board are output.
　ある実施の形態に従うプリント基板設計支援システムによると、多くの配線を要するプリント基板における設計指標情報をプリント基板の設計着手時点で計算し、適切なプリント基板の設計仕様を早期に得ることができる。 According to a printed circuit board design support system according to an embodiment, design index information for a printed circuit board that requires a lot of wiring is calculated at the time of starting the design of the printed circuit board, and appropriate design specifications for the printed circuit board can be obtained at an early stage.
実施の形態１によるプリント基板設計支援システム１００が備える機能の概略を例示する機能ブロック図である。1 is a functional block diagram illustrating an outline of functions provided in a printed circuit board design support system 100 according to the first embodiment. FIG. 回路設計情報データベース（ＤＢ）１３０におけるデータ格納の一態様を概念的に表わす図である。3 is a diagram conceptually representing one aspect of data storage in a circuit design information database (DB) 130. FIG. 設計仕様実績ＤＢ１４０におけるデータ格納の一態様を概念的に表わす図である。It is a diagram conceptually representing one mode of data storage in the design specification performance DB 140. プリント基板設計支援システム１００を実現するコンピュータシステム４００のハードウェア構成を表わすブロック図である。1 is a block diagram showing the hardware configuration of a computer system 400 that implements a printed circuit board design support system 100. FIG. プリント基板設計支援システム１００として機能するコンピュータシステム４００のＣＰＵ１が実行する処理の一部を表わすフローチャートである。2 is a flowchart showing part of the processing executed by the CPU 1 of the computer system 400 functioning as the printed circuit board design support system 100. FIG. 設計仕様を識別する設計仕様ＩＤ（Identification）を用いて設計指標をグループ化する一態様を例示する図である。FIG. 3 is a diagram illustrating an example of a mode in which design indicators are grouped using a design specification ID (Identification) that identifies a design specification. グラフを用いて設計指標をグループ化する一態様を例示する図である。FIG. 3 is a diagram illustrating an example of grouping design indicators using a graph. グラフを用いて設計指標をグループ化する他の態様を例示する図である。FIG. 7 is a diagram illustrating another aspect of grouping design indicators using a graph. 実施の形態２に従うプリント基板設計支援システムが設計指標をグループ化する態様を例示する図である。FIG. 7 is a diagram illustrating a manner in which the printed circuit board design support system according to the second embodiment groups design indicators. 実施の形態２に従うプリント基板設計支援システムが設計指標をグループ化する他の態様を例示する図である。FIG. 7 is a diagram illustrating another manner in which the printed circuit board design support system according to the second embodiment groups design indicators.
　以下に、本開示の実施の形態について、図面を参照して詳細に説明する。なお、以下では、図中の同一又は相当部分には同一符号を付して、その説明は原則的に繰り返さないものとする。 Embodiments of the present disclosure will be described in detail below with reference to the drawings. In addition, below, the same code|symbol is attached|subjected to the same or equivalent part in a figure, and the description shall not be repeated in principle.
　実施の形態１．
　図１を参照して、本開示のある実施の形態に従うプリント基板設計支援システム１００の構成について説明する。図１は、実施の形態１によるプリント基板設計支援システム１００が備える機能の概略を例示する機能ブロック図である。 Embodiment 1.
With reference to FIG. 1, the configuration of a printed circuit board design support system 100 according to an embodiment of the present disclosure will be described. FIG. 1 is a functional block diagram schematically illustrating the functions of a printed circuit board design support system 100 according to the first embodiment.
　図１に示されるように、プリント基板設計支援システム１００は、入力部１１０と、処理部１２０と、回路設計情報ＤＢ（Database）１３０と、設計仕様実績ＤＢ１４０と、記憶部１５０と、出力部１６０と、通信部１７０とを備える。 As shown in FIG. 1, the printed circuit board design support system 100 includes an input section 110, a processing section 120, a circuit design information DB (Database) 130, a design specification performance DB 140, a storage section 150, and an output section 160. and a communication section 170.
　プリント基板設計支援システム１００は、プリント基板の設計に用いられる。後述するように、プリント基板設計支援システム１００は、プリント基板の設計仕様を決定し、当該設計仕様を表わすデータを出力し得る。設計仕様は、複数の設計指標の値（以下、設計指標情報と表わす）から構成される。設計指標は、電極密度、接続密度、建ぺい率、部品密度等を含む。設計指標の詳細は後述する。 The printed circuit board design support system 100 is used for designing printed circuit boards. As will be described later, the printed circuit board design support system 100 can determine design specifications for a printed circuit board and output data representing the design specifications. The design specification is composed of a plurality of design index values (hereinafter referred to as design index information). Design indicators include electrode density, connection density, building coverage ratio, component density, etc. Details of the design index will be described later.
　入力部１１０は、プリント基板設計支援システム１００のユーザー（たとえば開発作業者）による操作の入力を受け付ける。当該操作は、たとえば、情報を格納する操作と、後述する各機能の処理の実行を命令する操作とを含む。入力部１１０は、より具体的には、キーボード（ＫＢ）、マウス、マイクなどによって実現される。他の局面において、入力部１１０は、ＵＳＢ（Universal　Serial　Bus）メモリ、ＤＶＤ（Digital　Versatile　Disc）等の補助記憶装置から、または、パラレルバスや、シリアルバスなどの受信インターフェイスあるいはネットワーク（図示しない）に接続された他の装置から出力される情報の入力を受け付けるように構成され得る。 The input unit 110 receives operation inputs from a user (for example, a development worker) of the printed circuit board design support system 100. The operations include, for example, an operation of storing information and an operation of instructing execution of processing of each function described later. More specifically, the input unit 110 is realized by a keyboard (KB), a mouse, a microphone, etc. In another aspect, the input unit 110 may be input from an auxiliary storage device such as a USB (Universal Serial Bus) memory or a DVD (Digital Versatile Disc), or from a receiving interface or network (not shown) such as a parallel bus or serial bus. It may be configured to accept input of information output from other connected devices.
　処理部１２０は、プリント基板設計支援システム１００を実現するための命令（プログラム）を実行する。処理部１２０は、演算部１２１と、設計情報処理部１２２とを含む。設計情報処理部１２２は、設計指標計算モジュール１２３と、設計指標比較分析モジュール１２４とを含む。 The processing unit 120 executes instructions (programs) for realizing the printed circuit board design support system 100. The processing section 120 includes a calculation section 121 and a design information processing section 122. The design information processing section 122 includes a design index calculation module 123 and a design index comparison and analysis module 124.
　演算部１２１は、ソフトウェア処理の統括的な機能を実現する。例えば、演算部１２１は、入力部１１０に入力された命令に従って、記憶部１５０から情報を受け取り、当該情報を設計情報処理部１２２や出力部１６０に渡す。 The calculation unit 121 realizes an overall function of software processing. For example, the calculation unit 121 receives information from the storage unit 150 according to a command input to the input unit 110, and passes the information to the design information processing unit 122 and the output unit 160.
　設計情報処理部１２２において、設計指標計算モジュール１２３は、記憶部１５０に格納されている情報を用いて、プリント基板の設計仕様の決定に必要な電極密度、接続密度、建ぺい率、部品密度その他の設計指標を算出する。さらに、設計情報処理部１２２は、計算したこれらの設計指標を、プリント基板の一設計仕様を構成する情報（以下「設計仕様情報」ともいう。）として、設計仕様実績ＤＢ１４０に格納する。 In the design information processing unit 122, the design index calculation module 123 uses the information stored in the storage unit 150 to calculate electrode density, connection density, building coverage ratio, component density, and other design factors necessary for determining the design specifications of the printed circuit board. Calculate indicators. Furthermore, the design information processing unit 122 stores these calculated design indices in the design specification performance DB 140 as information constituting one design specification of the printed circuit board (hereinafter also referred to as "design specification information").
　本実施の形態において、各設計指標は、例えば、電極密度、接続密度、建ぺい率、部品密度を含み、さらにその他の情報をも含み得る。 In this embodiment, each design index includes, for example, electrode density, connection density, building coverage ratio, and component density, and may also include other information.
　電極密度は、プリント基板の面積に対する搭載部品が有する電極数の総和の割合を示す設計指標である。電極数の総和は、たとえば、電気的な接続のある接続電極数であり、搭載される部品が有する全ての電極数であってもよい。 Electrode density is a design index that indicates the ratio of the total number of electrodes that a mounted component has to the area of a printed circuit board. The total number of electrodes is, for example, the number of electrically connected connection electrodes, and may be the total number of electrodes that a mounted component has.
　接続密度は、プリント基板の面積に対する全ての信号グループが有する接続の総和の割合を示す設計指標である。 Connection density is a design index that indicates the ratio of the total number of connections that all signal groups have to the area of the printed circuit board.
　建ぺい率は、プリント基板の面積に対する搭載部品の占有する部品面積の総和の割合を示す設計指標である。 The building coverage ratio is a design index that indicates the ratio of the total component area occupied by mounted components to the area of the printed circuit board.
　部品密度は、プリント基板に搭載される部品の総数に対する、搭載される部品が有する電極数の総和の割合を示す設計指標である。 Component density is a design index that indicates the ratio of the total number of electrodes of the mounted components to the total number of components mounted on the printed circuit board.
　なお、上記プリント基板の面積は、例えば、基板サイズが表す総面積であってもよく、表面または裏面の面積の総和でもよく、さらには、プリント基板の総面積から禁止領域を除いた面積でもよい。 Note that the area of the printed circuit board may be, for example, the total area represented by the board size, the total area of the front or back surface, or even the area excluding the prohibited area from the total area of the printed circuit board. .
　設計指標比較分析モジュール１２４は、設計指標計算モジュール１２３によって計算された設計指標と、過去に設計済みであり、設計仕様実績ＤＢ１４０に既に格納されているプリント基板の設計指標情報１４１のうち最低一つ以上の設計指標情報とを比較する。さらに、設計指標比較分析モジュール１２４は、当該比較の結果を分析することにより今回設計するプリント基板の設計仕様を決定する。 The design index comparison analysis module 124 selects at least one of the design indexes calculated by the design index calculation module 123 and the design index information 141 of printed circuit boards that have been designed in the past and are already stored in the design specification performance DB 140. Compare with the above design index information. Furthermore, the design index comparison analysis module 124 determines the design specifications of the printed circuit board to be designed this time by analyzing the results of the comparison.
　回路設計情報ＤＢ１３０は、公知のプリント基板設計装置、いわゆるＣＡＤ（Computer-Aided　Design）システムが保有する設計に必要な情報に加えて、本実施の形態に係るプリント基板設計支援システム１００が必要とする情報も含む。例えば、回路設計情報ＤＢ１３０は、搭載部品情報１３１と、基板情報１３２と、接続情報１３３とを含む。回路設計情報ＤＢ１３０のデータ構造の詳細は、後述する（図２）。 The circuit design information DB 130 includes information required by the printed circuit board design support system 100 according to the present embodiment, in addition to information necessary for design held by a known printed circuit board design device, a so-called CAD (Computer-Aided Design) system. Also includes information. For example, the circuit design information DB 130 includes mounted component information 131, board information 132, and connection information 133. Details of the data structure of the circuit design information DB 130 will be described later (FIG. 2).
　設計仕様実績ＤＢ１４０は、設計指標情報１４１を含む。設計指標情報１４１は、プリント基板設計支援システム１００によって使用される。設計仕様実績ＤＢ１４０の詳細は、後述する（図３）。 The design specification performance DB 140 includes design index information 141. The design index information 141 is used by the printed circuit board design support system 100. Details of the design specification performance DB 140 will be described later (FIG. 3).
　回路設計情報ＤＢ１３０および設計仕様実績ＤＢ１４０は、ハードディスクあるいはＳＳＤその他の不揮発性の記憶装置において管理される。なお、回路設計情報ＤＢ１３０と設計仕様実績ＤＢ１４０とは、プリント基板設計支援システム１００の内部に設けられる構成が例示されているが、他の局面において、これらのデータベースは、プリント基板設計支援システム１００がアクセス可能な外部の記憶装置に設けられてもよい。 The circuit design information DB 130 and the design specification performance DB 140 are managed in a hard disk, SSD, or other nonvolatile storage device. Note that although the circuit design information DB 130 and the design specification performance DB 140 are provided inside the printed circuit board design support system 100, in other aspects, these databases may be installed in the printed circuit board design support system 100. It may also be provided in an accessible external storage device.
　記憶部１５０は、入力部１１０に入力された情報と、処理部１２０が演算処理に必要とする情報と、処理部１２０によって生成された情報と、出力部１６０から出力される情報と、プリント基板設計支援システム１００が作動するために必要な他の情報とを保持する。 The storage unit 150 stores information input to the input unit 110, information required by the processing unit 120 for arithmetic processing, information generated by the processing unit 120, information output from the output unit 160, and a printed circuit board. It holds other information necessary for the design support system 100 to operate.
　記憶部１５０は、命令またはデータを格納するための複数の記憶領域を含む。例えば、記憶部１５０は、部品情報領域１５１と、基板情報領域１５２と、接続情報領域１５３とを含む。 The storage unit 150 includes multiple storage areas for storing instructions or data. For example, the storage unit 150 includes a component information area 151, a board information area 152, and a connection information area 153.
　部品情報領域１５１は、プリント基板に搭載される各部品の形状、及び、パターン配線されるために設けられた接続端子の数等の情報を格納している。さらに、部品情報領域１５１は、各部品がプリント基板に搭載される際の実装の種別と、当該部品に固有の実装不可面積を表わす情報とを格納している。 The component information area 151 stores information such as the shape of each component mounted on the printed circuit board and the number of connection terminals provided for pattern wiring. Furthermore, the component information area 151 stores the type of mounting when each component is mounted on the printed circuit board, and information representing the unmountable area specific to the component.
　基板情報領域１５２は、プリント基板の形状、面積、及び、実装禁止領域として予め定められたプリント基板の周辺領域の幅の情報と、当該プリント基板の端部もしくは任意の場所に設けられた禁止領域面積の情報とを保持する。 The board information area 152 contains information on the shape and area of the printed circuit board, the width of the peripheral area of the printed circuit board that is predetermined as a prohibited mounting area, and the prohibited area provided at the end of the printed circuit board or any other location. The area information is retained.
　接続情報領域１５３は、プリント基板内の複数の搭載部品の間で必要とされる、予め設計された複数の電気的接続の各々について、搭載部品の複数の端子間の電気的接続情報を格納する。さらに、接続情報領域１５３は、複数の電気的接続の合計となる接続ネット数、接続数、接続電極数その他の情報も格納する。 The connection information area 153 stores electrical connection information between a plurality of terminals of mounted components for each of a plurality of pre-designed electrical connections required between a plurality of mounted components on a printed circuit board. . Furthermore, the connection information area 153 also stores other information such as the number of connection nets, the number of connections, the number of connection electrodes, which is the total of a plurality of electrical connections.
　なお、接続ネット数は、電気的に接続された同一電位の信号グループを１とし、プリント基板内に存在する信号グループの総和である。接続数は、単一の信号グループに接続される数であり、「接続数＝信号グループ内で接続先数－１」となる。接続電極数は、電気的に接続のある部品の電極数の総和を表わし、「接続電極数＝接続ネット数＋接続数の総和」となる。 Note that the number of connected nets is the total number of signal groups existing in the printed circuit board, with one electrically connected signal group having the same potential. The number of connections is the number connected to a single signal group, and is expressed as "number of connections=number of connection destinations in the signal group-1". The number of connected electrodes represents the total number of electrodes of electrically connected parts, and is expressed as "number of connected electrodes=number of connected nets+total number of connections".
　ある局面に従うと、記憶部１５０は、ハードディスク装置、着脱可能な磁気記憶装置、または、ＳＳＤ（Solid　State　Drive）その他の半導体記憶装置によって実現される。 According to a certain aspect, the storage unit 150 is realized by a hard disk device, a removable magnetic storage device, an SSD (Solid State Drive), or other semiconductor storage device.
　出力部１６０は、プリント基板設計支援システム１００の外部に情報を出力する。当該情報は、例えば、入力部１１０に入力された情報、プリント基板設計支援システム１００に格納されている情報、処理部１２０によって生成された情報等を含む。これらの情報は開発作業者によって確認される。一例として、出力部１６０は、液晶ディスプレイ、ＣＲＴ（Cathode　Ray　Tube）ディスプレイ、あるいは、有機ＥＬ（Electro　Luminescence）ディスプレイ等のモニター装置として実現される。他の局面において、出力部１６０は、文字や画像等の形式で情報を印刷可能なプリンタやプロッタとして実現され得る。 The output unit 160 outputs information to the outside of the printed circuit board design support system 100. The information includes, for example, information input to the input unit 110, information stored in the printed circuit board design support system 100, information generated by the processing unit 120, and the like. This information is confirmed by the development worker. As an example, the output unit 160 is realized as a monitor device such as a liquid crystal display, a CRT (Cathode Ray Tube) display, or an organic EL (Electro Luminescence) display. In other aspects, the output unit 160 can be implemented as a printer or plotter that can print information in the form of characters, images, or the like.
　通信部１７０は、ネットワーク（図示しない）に接続されて他の情報通信端末と通信する。通信の形態は、有線通信および無線通信のいずれであってもよい。ある局面において、通信部１７０は、上述の受信インターフェイスとして機能し得る。 The communication unit 170 is connected to a network (not shown) and communicates with other information communication terminals. The form of communication may be either wired communication or wireless communication. In one aspect, the communication unit 170 can function as the above-mentioned receiving interface.
　本実施の形態に従うプリント基板設計支援システム１００は、一つのコンピューターシステムによって実現され得る。他の実施の形態に従うと、プリント基板設計支援システム１００はクラウドサーバー上でも実現され得る。この場合、プリント基板設計支援システム１００は、通信部１７０を介して受信した他の情報通信端末（たとえば、クライアント端末、パーソナルコンピューター、タブレット端末等）からのリクエストに応答して、プリント基板設計を支援する各情報を算出し、算出結果を当該他の情報通信端末に通信部１７０を介して送信する。このような構成により、本実施の形態に係るプリント基板設計支援システムは、クラウドサービスとしても実現され得る。 The printed circuit board design support system 100 according to this embodiment can be realized by one computer system. According to other embodiments, the printed circuit board design support system 100 may also be implemented on a cloud server. In this case, the printed circuit board design support system 100 supports printed circuit board design in response to a request from another information communication terminal (for example, a client terminal, a personal computer, a tablet terminal, etc.) received via the communication unit 170. Each piece of information is calculated, and the calculation results are transmitted to the other information communication terminal via the communication unit 170. With such a configuration, the printed circuit board design support system according to this embodiment can also be realized as a cloud service.
　＜データ構造＞
　図２および図３を参照して、プリント基板設計支援システム１００のデータ構造について説明する。図２は、回路設計情報ＤＢ１３０におけるデータ格納の一態様を概念的に表わす図である。図２に示されるように、回路設計情報ＤＢ１３０は、搭載部品情報１３１と、基板情報１３２と、接続情報１３３とを含む。 <Data structure>
The data structure of the printed circuit board design support system 100 will be described with reference to FIGS. 2 and 3. FIG. 2 is a diagram conceptually showing one aspect of data storage in the circuit design information DB 130. As shown in FIG. 2, the circuit design information DB 130 includes mounted component information 131, board information 132, and connection information 133.
　搭載部品情報１３１は、プリント基板に搭載されるそれぞれの部品の情報を含む。より具体的には、搭載部品情報１３１は、部品ＩＤと、当該部品の寸法情報（幅、高さ、長さ）と、電気的接続のための端子の数（接続端子数）と、部品型名と、実装種別情報と、実装不可面積情報とを含む。実装種別情報は、当該部品がプリント基板に実装される際に基板表面に装着される部品（いわゆる表面実装部品）であるか、あるいは、プリント基板に形成された穴の中に電極が挿入される部品（いわゆる挿入実装部品）であるかを示す。実装不可面積情報は、当該部品を実装することにより当該部品の周辺に生じる当該部品に固有に実装不可とされる領域の面積を表わす。 The mounted component information 131 includes information on each component mounted on the printed circuit board. More specifically, the mounted component information 131 includes component ID, dimensional information (width, height, length) of the component, the number of terminals for electrical connection (number of connection terminals), and component type. name, mounting type information, and non-mountable area information. The mounting type information indicates whether the component is mounted on the surface of the printed circuit board (a so-called surface mount component), or the electrode is inserted into a hole formed on the printed circuit board. Indicates whether it is a component (so-called insertion mounting component). The non-mountable area information represents the area of a region that is generated around the component when the component is mounted, and is unique to the component and cannot be mounted.
　基板情報１３２は、当該基板の寸法情報（幅、長さ）および面積と、基板周辺禁止領域幅と、禁止領域面積とを含む。基板周辺禁止領域幅は、一般的に部品の搭載またはパターン配線が不可となる基板周辺部の領域の幅を表わす。禁止領域面積は、当該プリント基板を使用する製品の制約等から発生するその他の禁止領域面積の情報を含む。 The board information 132 includes dimensional information (width, length) and area of the board, the width of the prohibited area around the board, and the area of the prohibited area. The prohibited area width around the substrate generally represents the width of the area around the substrate where mounting of components or pattern wiring is prohibited. The prohibited area area includes information on other prohibited area areas that occur due to restrictions on products that use the printed circuit board.
　接続情報１３３は、基板全体の接続グループ数を表す接続ネット数と、接続グループの接続先の総和である接続電極数と、接続ＩＤと、Ｎ個の接続先情報と、接続数とを含む。接続ＩＤは、複数の電気接続グループの各々を識別する。接続先情報は、各接続ＩＤに対して、相互接続の対象となる複数の接続先を特定する。接続数は、当該相互接続の数を特定する。 The connection information 133 includes the number of connection nets representing the number of connection groups on the entire board, the number of connection electrodes that is the total of connection destinations of the connection groups, a connection ID, information on N connection destinations, and the number of connections. The connection ID identifies each of the plurality of electrical connection groups. The connection destination information specifies, for each connection ID, a plurality of connection destinations to be mutually connected. The number of connections specifies the number of such interconnections.
　図３は、設計仕様実績ＤＢ１４０におけるデータ格納の一態様を概念的に表わす図である。設計仕様実績ＤＢ１４０は、プリント基板設計支援システム１００によって計算されたプリント基板の設計仕様を構成する設計指標情報１４１を格納している。 FIG. 3 is a diagram conceptually representing one aspect of data storage in the design specification performance DB 140. The design specification performance DB 140 stores design index information 141 that constitutes the design specifications of the printed circuit board calculated by the printed circuit board design support system 100.
　設計指標情報１４１は、基板ＩＤと、電極密度と、接続密度と、建ぺい率と、部品密度と、部品密度と、配線幅と、配線クリアランスと、配線層数とを含む。基板ＩＤは、ある設計仕様を有するプリント基板を特定する。したがって、一つの基板ＩＤが特定されると、一つの設計仕様が特定される。 The design index information 141 includes board ID, electrode density, connection density, building coverage ratio, component density, component density, wiring width, wiring clearance, and number of wiring layers. The board ID identifies a printed circuit board having a certain design specification. Therefore, when one board ID is specified, one design specification is specified.
　＜ハードウェア構成＞
　ここで、図４を参照して、プリント基板設計支援システム１００の具体的な構成について説明する。図４は、プリント基板設計支援システム１００を実現するコンピュータシステム４００のハードウェア構成を表わすブロック図である。 <Hardware configuration>
Here, with reference to FIG. 4, a specific configuration of the printed circuit board design support system 100 will be described. FIG. 4 is a block diagram showing the hardware configuration of a computer system 400 that implements the printed circuit board design support system 100.
　コンピュータシステム４００は、主たる構成要素として、プログラムを実行するＣＰＵ１と、コンピュータシステム４００の使用者による指示の入力を受けるマウス２およびキーボード３と、ＣＰＵ１によるプログラムの実行により生成されたデータ、又はマウス２若しくはキーボード３を介して入力されたデータを揮発的に格納するＲＡＭ４と、データを不揮発的に格納するハードディスク５と、光ディスク駆動装置６と、通信インターフェイス（Ｉ／Ｆ）７と、モニター８とを含む。各構成要素は、相互にデータバスによって接続されている。光ディスク駆動装置６には、ＣＤ－ＲＯＭ９その他の光ディスクが装着される。 The computer system 400 includes, as main components, a CPU 1 that executes programs, a mouse 2 and a keyboard 3 that receive instructions from a user of the computer system 400, and data generated by executing programs by the CPU 1, or a mouse 2. Alternatively, a RAM 4 that volatilely stores data input via the keyboard 3, a hard disk 5 that stores data nonvolatilely, an optical disk drive 6, a communication interface (I/F) 7, and a monitor 8. include. Each component is connected to each other by a data bus. The optical disk drive device 6 is loaded with a CD-ROM 9 and other optical disks.
　コンピュータシステム４００における処理は、各ハードウェアおよびＣＰＵ１により実行されるソフトウェアによって実現される。このようなソフトウェアは、ハードディスク５に予め記憶されている場合がある。また、ソフトウェアは、ＣＤ－ＲＯＭ９その他の記録媒体に格納されて、コンピュータープログラムとして流通している場合もある。あるいは、ソフトウェアは、いわゆるインターネットに接続されている情報提供事業者によってダウンロード可能なアプリケーションプログラムとして提供される場合もある。このようなソフトウェアは、光ディスク駆動装置６その他の読取装置によりその記録媒体から読み取られて、あるいは、通信インターフェイス７を介してダウンロードされた後、ハードディスク５に一旦格納される。そのソフトウェアは、ＣＰＵ１によってハードディスク５から読み出され、ＲＡＭ４に実行可能なプログラムの形式で格納される。ＣＰＵ１は、そのプログラムを実行する。 Processing in the computer system 400 is realized by each piece of hardware and software executed by the CPU 1. Such software may be stored in the hard disk 5 in advance. Further, the software may be stored on a CD-ROM 9 or other recording medium and distributed as a computer program. Alternatively, the software may be provided as a downloadable application program by an information provider connected to the Internet. Such software is read from the recording medium by the optical disk drive device 6 or other reading device, or is downloaded via the communication interface 7, and then temporarily stored in the hard disk 5. The software is read from the hard disk 5 by the CPU 1 and stored in the RAM 4 in the form of an executable program. CPU1 executes the program.
　図４に示されるコンピュータシステム４００を構成する各構成要素は、一般的なものである。したがって、本開示に係る技術思想の本質的な部分の一つは、ＲＡＭ４、ハードディスク５、ＣＤ－ＲＯＭ９その他の記録媒体に格納されたソフトウェア、あるいはネットワークを介してダウンロード可能なソフトウェアであるともいえる。記録媒体は、一時的でない（＝永続的な、不揮発性の）コンピューター読取可能なデータ記録媒体を含み得る。なお、コンピュータシステム４００の各ハードウェアの動作は周知であるので、詳細な説明は繰り返さない。 Each component constituting the computer system 400 shown in FIG. 4 is common. Therefore, it can be said that one of the essential parts of the technical idea according to the present disclosure is software stored in the RAM 4, hard disk 5, CD-ROM 9, and other recording media, or software that can be downloaded via a network. The recording medium may include a non-transitory (=permanent, non-volatile) computer-readable data storage medium. Note that since the operation of each piece of hardware in the computer system 400 is well known, detailed explanation will not be repeated.
　なお、記録媒体としては、ＣＤ－ＲＯＭ、ＦＤ（Flexible　Disk）、ハードディスクに限られず、ＳＳＤ、磁気テープ、カセットテープ、光ディスク（ＭＯ（Magnetic　Optical　Disc）／ＭＤ（Mini　Disc）／ＤＶＤ（Digital　Versatile　Disc））、ＩＣ（Integrated　Circuit）カード（メモリーカードを含む）、光カード、マスクＲＯＭ、ＥＰＲＯＭ（Electronically　Programmable　Read-Only　Memory）、ＥＥＰＲＯＭ（Electronically　Erasable　Programmable　Read-Only　Memory）、フラッシュＲＯＭなどの半導体メモリー等の固定的にプログラムを担持する媒体でもよい。 The recording medium is not limited to CD-ROM, FD (Flexible Disk), hard disk, but also SSD, magnetic tape, cassette tape, optical disk (MO (Magnetic Optical Disc) / MD (Mini Disc) / DVD (Digital Versatile Disc). )), IC (Integrated Circuit) cards (including memory cards), optical cards, mask ROM, EPROM (Electronically Programmable Read-Only Memory), EEPROM (Electronically Erasable Programmable Read-Only Memory), semiconductor memories such as flash ROM, etc. It may also be a medium that permanently carries a program.
　ここでいうプログラムとは、ＣＰＵ１により直接実行可能なプログラムだけでなく、ソースプログラム形式のプログラム、圧縮処理されたプログラム、暗号化されたプログラム等を含む。 The program here includes not only programs that can be directly executed by the CPU 1, but also programs in source program format, compressed programs, encrypted programs, and the like.
　＜制御構造＞
　図５を参照して、本実施の形態に従うプリント基板設計支援システム１００の制御構造について説明する。図５は、プリント基板設計支援システム１００として機能するコンピュータシステム４００のＣＰＵ１がプログラムに含まれる各命令を実行することにより実現される処理の一部を表わすフローチャートである。なお、他の局面において、以下の処理の一部または全部は、当該処理を実行するように構成された回路素子の組み合せとしても実現され得る。 <Control structure>
The control structure of printed circuit board design support system 100 according to this embodiment will be described with reference to FIG. 5. FIG. 5 is a flowchart showing a part of the processing realized by the CPU 1 of the computer system 400 functioning as the printed circuit board design support system 100 executing each instruction included in the program. Note that in other aspects, part or all of the following processing may be realized as a combination of circuit elements configured to execute the processing.
　ステップＳ５１０にて、ＣＰＵ１は、回路設計情報ＤＢ１３０からデータを読み出す。より具体的には、ＣＰＵ１は、入力部１１０に対するユーザー入力に応答して、当該ユーザー入力によって新たな設計対象として指定されたプリント基板の設計情報（搭載部品情報１３１および基板情報１３２）を、回路設計情報ＤＢ１３０から抽出する。 In step S510, the CPU 1 reads data from the circuit design information DB 130. More specifically, in response to a user input to the input unit 110, the CPU 1 converts design information (mounted component information 131 and board information 132) of a printed circuit board designated as a new design target by the user input into a circuit. Extracted from the design information DB 130.
　ステップＳ５１５にて、ＣＰＵ１は、読み出したデータを一時作業領域に格納する。より具体的には、ＣＰＵ１は、抽出された設計情報のうち、搭載部品情報１３１を部品情報領域１５１に格納し、基板情報１３２を基板情報領域１５２に格納する。 In step S515, the CPU 1 stores the read data in the temporary work area. More specifically, the CPU 1 stores mounted component information 131 in the component information area 151 and board information 132 in the board information area 152 among the extracted design information.
　ステップＳ５２０にて、ＣＰＵ１は、接続数、接続ネット数および接続電極数を計算する。 In step S520, the CPU 1 calculates the number of connections, the number of connected nets, and the number of connected electrodes.
　ステップＳ５２５にて、ＣＰＵ１は、接続情報およびステップＳ５２０の計算結果（接続数、接続ネット数および接続電極数）を接続情報領域１５３に格納する。 In step S525, the CPU 1 stores the connection information and the calculation results of step S520 (the number of connections, the number of connected nets, and the number of connected electrodes) in the connection information area 153.
　ステップＳ５３０にて、ＣＰＵ１は、設計指標計算モジュール１２３として、格納された情報から必要な設計指標の値（設計指標情報）を計算する。より具体的には、ＣＰＵ１は、格納された情報を用いて、電極密度、接続密度、建ぺい率および部品密度のうちの少なくとも一つ以上の設計指標情報を計算し、算出結果を設計仕様実績ＤＢ１４０に書き込む。 In step S530, the CPU 1, as the design index calculation module 123, calculates necessary design index values (design index information) from the stored information. More specifically, the CPU 1 uses the stored information to calculate design index information of at least one of electrode density, connection density, building coverage ratio, and component density, and stores the calculation results in the design specification performance DB 140. Write.
　ステップＳ５３５にて、ＣＰＵ１は、設計指標比較分析モジュール１２４として、設計仕様実績ＤＢ１４０に格納された、過去に設計済みの全てのプリント基板の各々の設計指標情報を抽出する。 In step S535, the CPU 1, as the design index comparison and analysis module 124, extracts the design index information of all previously designed printed circuit boards stored in the design specification record DB 140.
　ステップＳ５４０にて、ＣＰＵ１は、全ての設計指標情報を読み出したか否かを判断する。ＣＰＵ１は全ての設計指標情報を読み出したと判断すると（ステップＳ５４０にてＹＥＳ）、制御をステップＳ５４５に切り換える。そうでない場合には（ステップＳ５４０にてＮＯ）、ＣＰＵ１は、制御をステップＳ５３５に戻し、設計指標情報の抽出を継続する。 In step S540, the CPU 1 determines whether all design index information has been read out. When the CPU 1 determines that all the design index information has been read (YES in step S540), the control is switched to step S545. If not (NO in step S540), the CPU 1 returns control to step S535 and continues extracting the design index information.
　ステップＳ５４５にて、ＣＰＵ１は、抽出した全ての設計指標情報を設計仕様別にグループ化する。具体的には、ＣＰＵ１は、設計指標情報の値に基づいて当該設計指標情報を含む一つ以上の基板ＩＤをグループ（＝設計仕様）に集約することで、当該基板ＩＤで識別されるプリント基板をいずれかのグループに分類する。 In step S545, the CPU 1 groups all the extracted design index information by design specification. Specifically, the CPU 1 aggregates one or more board IDs including the design index information into a group (=design specification) based on the value of the design index information, thereby creating a printed circuit board identified by the board ID. Classify into one of the groups.
　　＜グループ化＞
　そこで、図６～図８を参照して、本実施の形態に係るグループ化について説明する。図６は、設計仕様を識別する設計仕様ＩＤを用いて設計指標をグループ化する一態様を例示する図である。図７は、グラフを用いて設計指標をグループ化する一態様を例示する図である。図８は、グラフを用いて設計指標をグループ化する他の態様を例示する図である。 <Grouping>
Therefore, grouping according to this embodiment will be explained with reference to FIGS. 6 to 8. FIG. 6 is a diagram illustrating an example of how design indicators are grouped using a design specification ID that identifies a design specification. FIG. 7 is a diagram illustrating an example of grouping design indicators using a graph. FIG. 8 is a diagram illustrating another example of grouping design indicators using a graph.
　図６に示されるように、設計仕様ＩＤが、それぞれの設計仕様毎に設けられている。ある局面において、例えば、ＣＰＵ１は、各基板ＩＤにそれぞれ対応付けられた各設計指標情報と予め設定された範囲とを比較し、各設計指標情報が当該いずれの範囲に属するかを判断する。たとえば、ＣＰＵ１は、設計仕様を特徴付ける設計指標情報（たとえば、配線層数、配線幅、配線間クリアランス）が同一である基板を同一の設計仕様としてグループ化し得る。 As shown in FIG. 6, a design specification ID is provided for each design specification. In one aspect, for example, the CPU 1 compares each design index information associated with each board ID with a preset range, and determines to which range each design index information belongs. For example, the CPU 1 can group boards having the same design index information (eg, number of wiring layers, wiring width, clearance between wiring) characterizing the design specifications as having the same design specification.
　図６の例示では、基板ＩＤが１および２で特定される各プリント基板は、配線層数、配線幅、および配線間クリアランスが同一であるとして、同じ設計仕様（例えば、設計仕様ＩＤ＝１）にグループ化されている。また、基板ＩＤ＝３および４で特定されるプリント基板は、設計仕様ＩＤ＝１で特定される設計仕様に含まれるプリント基板とは異なる設計仕様であるとして、当該異なる設計仕様に集約（グループ化）されている。このようにして、ＣＰＵ１は、設計仕様ＩＤで特定される設計仕様に含まれる設計済みのプリント基板の指標情報を管理できる。 In the example shown in FIG. 6, each printed circuit board identified by board IDs 1 and 2 has the same number of wiring layers, wiring width, and inter-wiring clearance, and has the same design specification (for example, design specification ID = 1). are grouped into. Additionally, the printed circuit boards identified by board IDs = 3 and 4 are classified (grouped) into different design specifications, as they have different design specifications from the printed circuit boards included in the design specifications identified by design specification ID = 1. ) has been done. In this way, the CPU 1 can manage the index information of the designed printed circuit board included in the design specification specified by the design specification ID.
　他方、図７あるいは図８に示されるように、ＣＰＵ１は、設計指標をマッピングする態様でグラフ化することにより当該設計指標をグループ化し得る。ＣＰＵ１は、図６に示される設計指標の値を利用し、設計仕様毎に領域化することで、設計情報をグループ化する。 On the other hand, as shown in FIG. 7 or 8, the CPU 1 can group the design indicators by graphing them in a mapping manner. The CPU 1 uses the design index values shown in FIG. 6 to group the design information by dividing it into regions for each design specification.
　例えば、ＣＰＵ１は、同一の値または範囲（例えば、配線幅＝0.15mm、0.16mm等）に属する設計指標情報が対応付けられた一つ以上の基板ＩＤで特定される各プリント基板が同一の設計仕様に属すると判定する。ＣＰＵ１は、任意に、あるいは、ユーザーの入力に応じて、設計仕様を識別する設計仕様ＩＤを設定する。ＣＰＵ１は、各設計仕様ＩＤに、当該同一の設計仕様に属すると判定した一つ以上の基板ＩＤを関連付けることにより、各基板ＩＤをいずれかの設計仕様に分類（グループ化）する。 For example, the CPU 1 determines that each printed circuit board specified by one or more board IDs associated with design index information belonging to the same value or range (for example, wiring width = 0.15 mm, 0.16 mm, etc.) has the same design. Determine that it belongs to the specification. The CPU 1 arbitrarily or in response to user input sets a design specification ID for identifying the design specification. The CPU 1 classifies (groups) each board ID into one of the design specifications by associating each design specification ID with one or more board IDs determined to belong to the same design specification.
　図６に例示されるグループ化の手法および図７または図８に例示されるグループ化の手法によって、ＣＰＵ１は、新たな設計仕様とされる当該基板の設計指標がどのグループの値の範囲に含まれるかを判定し得る。 By the grouping method illustrated in FIG. 6 and the grouping method illustrated in FIG. 7 or 8, the CPU 1 determines which group's value range includes the design index of the board, which is the new design specification. It can be determined whether the
　図５を再び参照して、ステップＳ５５０にて、ＣＰＵ１は、全ての設計情報をグループ化したか否かを判断する。ＣＰＵ１は全ての設計情報をグループ化したと判断すると（ステップＳ５５０にてＹＥＳ）、制御をステップＳ５５５に切り換える。そうでない場合には（ステップＳ５５０にてＮＯ）、ＣＰＵ１は、制御をステップＳ５４５に戻す。 Referring again to FIG. 5, in step S550, the CPU 1 determines whether all design information has been grouped. When the CPU 1 determines that all the design information has been grouped (YES in step S550), the control is switched to step S555. If not (NO in step S550), the CPU 1 returns control to step S545.
　ステップＳ５５５にて、ＣＰＵ１は、抽出された設計指標情報と今回新たに設計されるプリント基板の設計指標情報とを比較する。ＣＰＵ１は、各設計指標情報の各々について、設計済みプリント基板の設計指標情報によりグループ化されたいずれの設計仕様ＩＤに、今回新たに設計するプリント基板の設計指標情報が含まれるか比較判定を行う。ＣＰＵ１は、比較判定の一例として、各設計仕様に含まれる各基板ＩＤの設計指標情報の最大数と最小値とを算出し、大小関係を比較し、当該設計指標情報がいずれの範囲に含まれるかを判定する。他の局面に従う比較判定の態様として、ＣＰＵ１は、他の設計指標情報のばらつきを考慮して、ばらつきを示す値（たとえば標準偏差）を算出し、当該値がいずれの範囲に含まれるかを判定してもよい。また、当該設計指標情報が複数の設計仕様ＩＤに含まれる場合もあり得る。この場合は、ＣＰＵ１は、当該設計指標情報を有する基板ＩＤを当該複数の設計仕様ＩＤの各々に属するようにグループ化し得る。 In step S555, the CPU 1 compares the extracted design index information with the design index information of the newly designed printed circuit board. The CPU 1 compares and determines, for each piece of design index information, which design specification ID grouped by the design index information of the designed printed circuit board includes the design index information of the newly designed printed circuit board. . As an example of comparative determination, the CPU 1 calculates the maximum number and minimum value of the design index information of each board ID included in each design specification, compares the magnitude relationship, and determines in which range the design index information is included. Determine whether As a mode of comparative judgment according to another aspect, the CPU 1 calculates a value indicating the variation (for example, standard deviation), taking into account the variation in other design index information, and determines which range the value falls within. You may. Furthermore, the design index information may be included in multiple design specification IDs. In this case, the CPU 1 can group the board IDs having the design index information so that they belong to each of the plurality of design specification IDs.
　ステップＳ５６０にて、ＣＰＵ１は、新たに設計するプリント基板の全ての設計指標情報の所属が決定したか否かを判断する。この判定は、たとえば、新たに設計するプリント基板の設計指標の数だけ比較判定（ステップＳ５５５）の結果が得られたか否かに基づいて行なわれる。ＣＰＵ１は、全ての設計指標の所属範囲が決定したと判断すると（ステップＳ５６０にてＹＥＳ）、制御をステップＳ５６５に切り換える。そうでない場合には（ステップＳ５６０にてＮＯ）、ＣＰＵ１は、制御をステップＳ５５５に戻す。 In step S560, the CPU 1 determines whether the affiliations of all the design index information of the newly designed printed circuit board have been determined. This determination is made, for example, based on whether or not results of comparison determination (step S555) have been obtained for the number of design indicators for a newly designed printed circuit board. When the CPU 1 determines that the ranges to which all design indicators belong have been determined (YES in step S560), the CPU 1 switches control to step S565. If not (NO in step S560), the CPU 1 returns control to step S555.
　ステップＳ５６５にて、ＣＰＵ１は、当該プリント基板の設計仕様を決定する。この決定は、ユーザーに対する提案であって、ユーザーは適宜設計仕様を選定することもできる。例えば、ステップＳ５５５における比較の結果、一つの設計指標に対応する複数の設計仕様が存在する場合があり得る。この場合、ＣＰＵ１は、設計仕様の決定精度を一層高めるために、二つ以上の設計指標が属する設計仕様を分析する。例えば、電極密度については、同一の配線幅、同一の配線クリアランスで配線層数が異なる複数の設計仕様に属した場合、ＣＰＵ１は、建ぺい率、接続密度、部品密度その他の設計指標による判定結果も合わせた分析を行う。 In step S565, the CPU 1 determines the design specifications of the printed circuit board. This determination is a suggestion to the user, and the user can also select design specifications as appropriate. For example, as a result of the comparison in step S555, there may be a case where a plurality of design specifications corresponding to one design index exist. In this case, the CPU 1 analyzes the design specifications to which two or more design indicators belong in order to further improve the accuracy of determining the design specifications. For example, regarding electrode density, if the wiring width and wiring clearance are the same but belong to multiple design specifications that differ in the number of wiring layers, the CPU 1 will also combine the judgment results based on the building coverage ratio, connection density, component density, and other design indicators. analysis.
　そこで、当該分析の方法について説明する。分析の方法の一例として、所属先として分類された一つ以上の設計仕様のうち設計指標情報の値が高スペックである設計仕様を採用する方法がある。設計指標情報の値が高スペックである設計仕様とは、一例として、配線層数の場合は当該配線層数が予め定められた標準の配線層数よりも多いこと、配線幅の場合は当該配線幅が最も微細であること、配線クリアランスの場合は当該クリアランスが最も矮小であること、である。 Therefore, the method of this analysis will be explained. As an example of the analysis method, there is a method of employing a design specification whose design index information has a high specification value among one or more design specifications classified as belonging. A design specification with a high specification value of design index information means, for example, that in the case of the number of wiring layers, the number of wiring layers is greater than the predetermined standard number of wiring layers, and in the case of wiring width, that the number of wiring layers is greater than the standard number of wiring layers. The width must be the smallest, and in the case of a wiring clearance, the clearance must be the smallest.
　ＣＰＵ１は、プリント基板に要求される性能または機能に応じて、複数の設計指標情報の一部または全てが他の設計仕様に含まれる設計指標情報よりも高スペックである設計仕様を、新たなプリント基板の設計仕様として提案し得る。他の局面において、プリント基板設計支援システム１００のユーザーが設計指標情報について予め設定された優先順位に従って、ＣＰＵ１は高スペックな設計指標情報を含む設計仕様を選定してもよい。 The CPU 1 prints a new design specification in which part or all of the plurality of design index information has higher specifications than the design index information included in other design specifications, depending on the performance or function required of the printed circuit board. It can be proposed as a board design specification. In another aspect, the CPU 1 may select a design specification including high-spec design index information according to a priority order set in advance for design index information by a user of the printed circuit board design support system 100.
　他の一例としては、ＣＰＵ１は、図７または図８に示される所属する設計仕様の示した領域の中心部により近いグループの情報をそれぞれの設計指標において計算し、最も中心に近い設計指標情報をもたらした基板ＩＤが属する設計仕様を最終的な設計仕様として決定し得る。例えば、ＣＰＵ１は複数の設計指標のうちの２以上の設計指標からなる領域を規定し、当該領域の中心値と、新たに設計されるプリント基板の設計指標情報との値が最も小さくなる領域を規定する設計仕様を、当該新たに設計されるプリント基板の設計仕様の候補としてもよい。図７および図８に例示される領域は、複数の設計指標のうちの二つの設計指標により規定される領域である。３つの設計指標が選択されている場合には、ＣＰＵ１は、当該領域として３次元空間の領域を導出し、当該３次元空間の中心と、新たに設計されるプリント基板の設計指標情報とを比較する。 As another example, the CPU 1 calculates information of a group closer to the center of the area indicated by the design specification to which it belongs shown in FIG. 7 or 8 for each design index, and calculates the design index information closest to the center. The design specification to which the resulting board ID belongs can be determined as the final design specification. For example, the CPU 1 defines an area consisting of two or more design indicators out of a plurality of design indicators, and selects an area where the value between the center value of the area and the design indicator information of a newly designed printed circuit board is the smallest. The specified design specifications may be used as candidates for the design specifications of the newly designed printed circuit board. The area illustrated in FIGS. 7 and 8 is an area defined by two of the plurality of design indicators. When three design indexes are selected, the CPU 1 derives a region of the three-dimensional space as the relevant region, and compares the center of the three-dimensional space with the design index information of the newly designed printed circuit board. do.
　さらに他の局面において、設計指標の計算時に、例えばプリント基板の面積に禁止領域面積を考慮していない計算が行なわれた場合には、ＣＰＵ１は、当該禁止領域面積を考慮した新たな設計指標情報を用いて、上記の分析を行なってもよい。また、ＣＰＵ１は、電極密度においても全部品の電極数で計算した数値に対して接続電極数を用いた指標を設計指標情報として用いてもよい。 In yet another aspect, when calculating the design index, for example, if calculation is performed that does not take into account the area of the prohibited area in the area of the printed circuit board, the CPU 1 generates new design index information that takes into account the area of the prohibited area. may be used to perform the above analysis. Further, the CPU 1 may also use, as design index information, an index using the number of connected electrodes with respect to a value calculated using the number of electrodes of all parts for the electrode density.
　実施の形態２．
　図９および図１０を参照して、実施の形態２について説明する。図９および図１０はそれぞれ、実施の形態２に従うプリント基板設計支援システムが設計指標をグループ化する態様を例示する図である。 Embodiment 2.
Embodiment 2 will be described with reference to FIGS. 9 and 10. FIGS. 9 and 10 are diagrams each illustrating a manner in which the printed circuit board design support system according to the second embodiment groups design indicators.
　実施の形態１では、設計指標比較分析モジュール１２４での比較方法として、グループ化による単純な一つ以上の各設計指標情報とのグループ帰属比較に関する手法が説明された。これに対して、本実施の形態に従うプリント基板設計支援システムは、グループ化に当たって、より信頼度の高い設計指標を選択して設計仕様を構成するという点で、実施の形態１に従うプリント基板設計支援システム１００と異なる。 In the first embodiment, as a comparison method in the design index comparison analysis module 124, a method related to group belonging comparison with one or more pieces of design index information by simple grouping was explained. In contrast, the printed circuit board design support system according to the present embodiment supports the printed circuit board design support according to the first embodiment in that when grouping, design indicators with higher reliability are selected to configure design specifications. This is different from the system 100.
　なお、本実施の形態に従うプリント基板設計支援システムのハードウェア構成は、実施の形態１に従うプリント基板設計支援システム１００のハードウェア構成と同じである。したがって、ハードウェア構成の説明は繰り返さない。 Note that the hardware configuration of the printed circuit board design support system according to this embodiment is the same as the hardware configuration of the printed circuit board design support system 100 according to the first embodiment. Therefore, the description of the hardware configuration will not be repeated.
　ある局面に従うと、プリント基板の設計においては、同一製品内で複数のプリント基板との組み合わせ等で他のプリント基板の仕様と合わせた設計仕様が採用され、尤度の大きい（仕様としては冗長な）プリント基板が設計される場合がある。例えば、実際には２層の配線層で設計できる基板に対して４層の配線層が採用される場合や、製品構造上の問題で、10mm×50mmの基板サイズで設計できる基板に対して20mm×50mmの基板サイズでプリント基板を設計する場合等があり得る。 According to a certain aspect, in the design of printed circuit boards, design specifications that are combined with the specifications of other printed circuit boards, such as in combination with multiple printed circuit boards in the same product, are adopted, and design specifications that have a high likelihood (redundant as specifications) are adopted. ) Printed circuit boards may be designed. For example, a board that can actually be designed with two wiring layers may have four wiring layers, or due to product structure issues, a board that can be designed with a board size of 10 mm x 50 mm may have a board size of 10 mm x 50 mm. There may be cases where a printed circuit board is designed with a board size of ×50 mm.
　このような尤度のある基板の設計仕様を、新たに設計される基板の設計仕様と比較して分類することは、当該新たに設計される基板の設計仕様のレベルが、安易に下がる原因となり得る。 Classifying the design specifications of a board with such likelihood by comparing them with the design specifications of a newly designed board may easily lower the level of the design specifications of the newly designed board. obtain.
　そこで、本実施の形態に従うプリント基板設計支援システムは、過去に設計した実績のあるプリント基板の設計仕様（たとえば、図７，図８）の内、ユーザーによって任意に設定された下位の設計指標を有する設計仕様が割愛された残りの設計仕様を比較対象のグループとして採用する。本実施の形態において、下位の設計指標とは、当該設計指標の値（設計指標情報）が予め定められた基準値を下回る値を有する設計指標をいう。したがって、下位の設計指標からなる設計仕様のプリント基板は、最低限の品質が保証されたプリント基板となり得る。 Therefore, the printed circuit board design support system according to the present embodiment uses lower design indicators arbitrarily set by the user among the design specifications of printed circuit boards that have been designed in the past (for example, FIGS. 7 and 8). The remaining design specifications from which the design specifications that have been omitted are adopted as a group to be compared. In this embodiment, a lower-order design index refers to a design index whose value (design index information) is less than a predetermined reference value. Therefore, a printed circuit board with design specifications made up of lower-level design indicators can be a printed circuit board with guaranteed minimum quality.
　本実施の形態に従うプリント基板設計支援システムは、当該グループに属するプリント基板の設計指標からなる設計仕様と、新たに設計されるプリント基板の設計指標からなる設計仕様とを比較する。 The printed circuit board design support system according to the present embodiment compares a design specification consisting of design indicators of printed circuit boards belonging to the group with a design specification consisting of design indicators of a newly designed printed circuit board.
　たとえば、図９の状態（Ａ）に示されるように、プリント基板設計支援システムのＣＰＵ１は、設計仕様１，２のうち、破線で囲われた領域を下位の設計指標を有する設計仕様として割愛の対象と判定する。状態（Ｂ）に示されるように、ＣＰＵ１は、当該領域が除去された残りの領域を比較対象とする。 For example, as shown in state (A) of FIG. 9, the CPU 1 of the printed circuit board design support system selects the area surrounded by the broken line among the design specifications 1 and 2 as a design specification having a lower design index. Determine target. As shown in state (B), the CPU 1 uses the remaining area from which the area has been removed as a comparison target.
　同様に、図１０の状態（Ａ）に示されるように、ＣＰＵ１は、破線で囲われた矩形領域を下位の設計指標を有する設計仕様として割愛の対象と判定する。状態（Ｂ）に示されるように、ＣＰＵ１は、当該領域が除去された残りの領域を比較対象とする。 Similarly, as shown in state (A) of FIG. 10, the CPU 1 determines the rectangular area surrounded by the broken line to be omitted as a design specification having a lower design index. As shown in state (B), the CPU 1 uses the remaining area from which the area has been removed as a comparison target.
　このように、本実施の形態に従うプリント基板設計支援システムは、下位の設計指標を有する過去に設計されたプリント基板の情報を割愛することで、尤度が減少したグループを構成し、比較対象を当該グループのみとする。ユーザーは、高精度な設計仕様を有する新たなプリント基板の設計仕様を決定することができる。 In this way, the printed circuit board design support system according to the present embodiment forms a group with reduced likelihood by omitting information on previously designed printed circuit boards with lower design indicators, and uses the information for comparison. Only the relevant group. The user can determine design specifications for a new printed circuit board having highly accurate design specifications.
　なお、他の局面において、ＣＰＵ１は、ユーザーによって指定された閾値あるいは予め定められた基準値を上回る値を有する設計指標情報からなる領域を、比較対象の設計仕様として選択してもよい。この場合は、より高スペックな設計指標情報からなる設計仕様が選択されやすくなる。 Note that in other aspects, the CPU 1 may select an area consisting of design index information having a value exceeding a threshold value specified by the user or a predetermined reference value as the design specification to be compared. In this case, a design specification consisting of design index information with higher specifications is more likely to be selected.
　＜まとめ＞
　以上のようにして、本実施の形態に従うプリント基板設計支援システム１００は、既に設計されたプリント基板の設計指標情報と、当該設計指標情報により集約された設計仕様情報とを保持している。プリント基板が新たに設計される場合には、プリント基板設計支援システム１００のＣＰＵ１は、当該新たに設計されるプリント基板の設計指標情報と、過去に設計されたプリント基板の設計仕様情報とを比較し、新たに設計されるプリント基板の設計指標情報が属する設計仕様を決定する。このような構成により、プリント基板設計支援システム１００は、新たに設計されるプリント基板の設計仕様を早期に決定できるので、プリント基板の設計者は早期に設計情報を入手できることになる。これにより、その後の段階で、仮決めされた設計仕様では配線が困難であると判断されることなく設計を進めることができるので配置設計のやり直しが防止され得る。 <Summary>
As described above, the printed circuit board design support system 100 according to the present embodiment holds design index information of already designed printed circuit boards and design specification information aggregated by the design index information. When a printed circuit board is newly designed, the CPU 1 of the printed circuit board design support system 100 compares design index information of the newly designed printed circuit board with design specification information of a previously designed printed circuit board. Then, the design specification to which the design index information of the newly designed printed circuit board belongs is determined. With such a configuration, the printed circuit board design support system 100 can quickly determine the design specifications of a newly designed printed circuit board, so that the printed circuit board designer can obtain design information at an early stage. As a result, at a later stage, the design can be proceeded without it being determined that wiring is difficult with the temporarily decided design specifications, and it is possible to prevent redoing the layout design.
　＜付記＞
　本明細書および図面で開示された技術的特徴の一部は、以下のように要約され得る。 <Additional notes>
Some of the technical features disclosed in this specification and drawings may be summarized as follows.
　［構成例１］
プリント基板の設計支援装置であって、
過去に設計された複数のプリント基板の各々の設計指標情報を格納する記憶部と、
今回新たに設計されるプリント基板の設計指標情報の入力を受け付ける入力部と、
上記格納されている設計指標情報と、上記入力された設計指標情報とに基づいて、新たに設計されるプリント基板の設計仕様を提案するための処理部とを備え、
上記処理部は、
上記各々の設計指標情報をグループ化することにより一以上の設計仕様に集約し、
上記一以上の設計仕様から、上記新たに設計されるプリント基板の設計指標情報が含まれる設計仕様を決定し、
上記新たに設計されるプリント基板の設計仕様を出力する、プリント基板の設計支援装置。 [Configuration example 1]
A printed circuit board design support device,
a storage unit that stores design index information for each of a plurality of printed circuit boards designed in the past;
An input section that accepts input of design index information for the newly designed printed circuit board;
a processing unit for proposing design specifications for a newly designed printed circuit board based on the stored design index information and the input design index information;
The above processing section is
By grouping each of the above design index information, it can be aggregated into one or more design specifications,
From the one or more design specifications above, determine a design specification that includes design index information of the newly designed printed circuit board,
A printed circuit board design support device that outputs design specifications for the newly designed printed circuit board.
　［構成例２］
上記決定することは、上記新たに設計されるプリント基板の設計指標情報が、上記過去に設計された複数のプリント基板のいずれかのプリント基板の当該設計指標情報の最大値と最小値との間に含まれることに基づいて、上記新たに設計されるプリント基板の設計仕様を上記いずれかのプリント基板の設計仕様として選定することを含む、構成例１に記載のプリント基板の設計支援装置。 [Configuration example 2]
The above determination is such that the design index information of the newly designed printed circuit board is between the maximum value and the minimum value of the design index information of any one of the plurality of previously designed printed circuit boards. The printed circuit board design support device according to configuration example 1, including selecting the design specifications of the newly designed printed circuit board as the design specifications of any of the above printed circuit boards based on the fact that the design specifications are included in the printed circuit board.
　［構成例３］
　上記決定することは、上記新たに設計されるプリント基板の設計指標情報を、上記過去に設計された複数のプリント基板のいずれかの設計仕様に集約した場合に、集約後の設計仕様に含まれる設計指標情報のばらつきが最も小さくなる設計仕様を、上記新たに設計されるプリント基板の設計指標情報が集約される設計仕様として選定することを含む、構成例１に記載のプリント基板の設計支援装置。 [Configuration example 3]
The above determination means that when the design index information of the newly designed printed circuit board is aggregated into the design specifications of any of the plurality of previously designed printed circuit boards, the information will be included in the aggregated design specifications. The printed circuit board design support device according to configuration example 1, which includes selecting a design specification with the smallest variation in design index information as a design specification in which design index information of the newly designed printed circuit board is aggregated. .
　［構成例４］
上記決定することは、
複数の設計仕様を決定することと、
上記複数の設計仕様の各々の設計指標情報のうち最も高性能な設計指標情報が含まれる設計仕様を、上記新たに設計されるプリント基板の設計仕様とすることとを含む、構成例１～３のいずれかに記載のプリント基板の設計支援装置。 [Configuration example 4]
The above decision is
determining multiple design specifications;
Configuration Examples 1 to 3, including setting a design specification that includes the highest performance design index information among the design index information of each of the plurality of design specifications as the design specification of the newly designed printed circuit board. The printed circuit board design support device according to any one of the above.
　［構成例５］
上記決定することは、
複数の設計仕様を決定することと、
上記複数の設計仕様の各々の中心を導出することと、
上記各々の中心と、上記新たに設計されるプリント基板の設計指標情報との差が最も小さくなる設計指標情報を含む設計仕様を、上記新たに設計されるプリント基板の設計仕様とすることとを含む、構成例１～３のいずれかに記載の設計支援装置。 [Configuration example 5]
The above decision is
determining multiple design specifications;
Deriving the center of each of the plurality of design specifications,
The design specification including the design index information that minimizes the difference between the center of each of the above and the design index information of the newly designed printed circuit board is set as the design specification of the newly designed printed circuit board. The design support device according to any one of configuration examples 1 to 3, including:
　［構成例６］
上記集約することは、上記各々の設計指標情報のうち設定された閾値を上回る設計指標情報をグループ化することを含む、構成例１～５のいずれかに記載のプリント基板の設計支援装置。 [Configuration example 6]
The printed circuit board design support apparatus according to any one of configuration examples 1 to 5, wherein the aggregation includes grouping design index information exceeding a set threshold among the respective design index information.
　［構成例７］
プリント基板の設計支援方法であって、
過去に設計された複数のプリント基板の各々の設計指標情報にアクセスするステップと、上記各々の設計指標情報をグループ化することにより一以上の設計仕様に集約するステップと、
今回新たに設計されるプリント基板の設計指標情報の入力を受け付けるステップと、
上記一以上の設計仕様から、上記新たに設計されるプリント基板の設計指標情報が含まれる設計仕様を決定するステップと、
上記新たに設計されるプリント基板の設計仕様を出力するステップとを含む、プリント基板の設計支援方法。 [Configuration example 7]
A printed circuit board design support method, the method comprising:
a step of accessing design index information for each of a plurality of printed circuit boards designed in the past; and a step of consolidating each of the above design index information into one or more design specifications by grouping;
a step of receiving input of design index information for the newly designed printed circuit board;
determining a design specification including design index information of the newly designed printed circuit board from the one or more design specifications;
A printed circuit board design support method comprising the step of outputting the design specifications of the newly designed printed circuit board.
　［構成例８］
上記決定するステップは、上記新たに設計されるプリント基板の設計指標情報が、上記過去に設計された複数のプリント基板のいずれかのプリント基板の当該設計指標情報の最大値と最小値との間に含まれることに基づいて、上記新たに設計されるプリント基板の設計仕様を上記いずれかのプリント基板の設計仕様として選定するステップを含む、構成例７に記載のプリント基板の設計支援方法。 [Configuration example 8]
In the step of determining, the design index information of the newly designed printed circuit board is between the maximum value and the minimum value of the design index information of any one of the plurality of previously designed printed circuit boards. The printed circuit board design support method according to configuration example 7, including the step of selecting the design specifications of the newly designed printed circuit board as the design specifications of any of the above printed circuit boards, based on the fact that the design specifications of the newly designed printed circuit board are included in the design specifications of the printed circuit board.
　［構成例９］
上記決定するステップは、上記新たに設計されるプリント基板の設計指標情報を、上記過去に設計された複数のプリント基板のいずれかの設計仕様に集約した場合に、集約後の設計仕様に含まれる設計指標情報のばらつきが最も小さくなる設計仕様を、上記新たに設計されるプリント基板の設計指標情報が集約される設計仕様として選定するステップを含む、構成例７に記載のプリント基板の設計支援方法。 [Configuration example 9]
The above determining step is performed when the design index information of the newly designed printed circuit board is aggregated into the design specifications of any of the plurality of previously designed printed circuit boards, the information included in the aggregated design specification. The printed circuit board design support method according to configuration example 7, including the step of selecting a design specification with the smallest variation in design index information as a design specification in which design index information of the newly designed printed circuit board is aggregated. .
　［構成例１０］
上記決定するステップは、
複数の設計仕様を決定するステップと、
上記複数の設計仕様の各々の設計指標情報のうち最も高性能な設計指標情報が含まれる設計仕様を、上記新たに設計されるプリント基板の設計仕様とするステップとを含む、構成例７～９のいずれかに記載の設計支援方法。 [Configuration example 10]
The steps to determine the above are:
determining a plurality of design specifications;
Configuration Examples 7 to 9, including the step of setting a design specification that includes the highest performance design index information among the design index information of each of the plurality of design specifications as the design specification of the newly designed printed circuit board. The design support method described in any of the above.
　［構成例１１］
上記決定するステップは、
複数の設計仕様を決定するステップと、
上記複数の設計仕様の各々の中心を導出するステップと、
上記各々の中心と、上記新たに設計されるプリント基板の設計指標情報との差が最も小さくなる設計指標情報を含む設計仕様を、上記新たに設計されるプリント基板の設計仕様とするステップとを含む、構成例７～９のいずれかに記載の設計支援方法。 [Configuration example 11]
The steps to determine the above are:
determining a plurality of design specifications;
deriving the center of each of the plurality of design specifications;
a step of setting a design specification including design index information that minimizes the difference between the centers of each of the above and the design index information of the newly designed printed circuit board as the design specification of the newly designed printed circuit board; The design support method according to any one of configuration examples 7 to 9, including:
　［構成例１２］
上記記集約するステップは、上記各々の設計指標情報のうち設定された閾値を上回る設計指標情報をグループ化するステップを含む、構成例７～１１のいずれかに記載のプリント基板の設計支援装置。 [Configuration example 12]
The printed circuit board design support apparatus according to any one of configuration examples 7 to 11, wherein the step of aggregating includes a step of grouping design index information exceeding a set threshold among the respective design index information.
　［構成例１３］
構成例７～１２のいずれかに記載の設計支援方法をコンピュータに実行させる、プログラム。 [Configuration example 13]
A program that causes a computer to execute the design support method described in any of Configuration Examples 7 to 12.
　今回開示された実施の形態はすべての点で例示であって制限的なものではないと考えられるべきである。本発明の範囲は上記した説明ではなくて請求の範囲によって示され、請求の範囲と均等の意味および範囲内でのすべての変更が含まれることが意図される。 The embodiments disclosed this time should be considered to be illustrative in all respects and not restrictive. The scope of the present invention is indicated by the claims rather than the above description, and it is intended that equivalent meanings and all changes within the scope of the claims are included.
　開示された技術は、プリント基板の設計を支援する装置として、プリント基板の設計を支援するクラウドサービスとして、あるいは、プリント基板の設計を支援するプログラムとして利用可能である。 The disclosed technology can be used as a device that supports printed circuit board design, as a cloud service that supports printed circuit board design, or as a program that supports printed circuit board design.
　ＣＰＵ１、２　マウス、３　キーボード、４　ＲＡＭ、５　ハードディスク、６　光ディスク駆動装置、７　通信インターフェイス、８　モニター、９　ＲＯＭ、１００　プリント基板設計支援システム、１１０　入力部、１２０　処理部、１２１　演算部、１２２
　設計情報処理部、１２３　設計指標計算モジュール、１２４　設計指標比較分析モジュール、１３０　回路設計情報データベース（ＤＢ）、１３１　搭載部品情報、１３２　基板情報、１３３　接続情報、１４０　設計仕様実績ＤＢ、１４１　設計指標情報、１５０
　記憶部、１５１　部品情報領域、１５２　基板情報領域、１５３　接続情報領域、１６０　出力部、１７０　通信部、４００　コンピュータシステム。 CPU1, 2 Mouse, 3 Keyboard, 4 RAM, 5 Hard disk, 6 Optical disk drive, 7 Communication interface, 8 Monitor, 9 ROM, 100 Printed circuit board design support system, 110 Input section, 120 Processing section, 121 Arithmetic section, 122
Design information processing unit, 123 Design index calculation module, 124 Design index comparison analysis module, 130 Circuit design information database (DB), 131 Mounted parts information, 132 Board information, 133 Connection information, 140 Design specification performance DB, 141 Design index information , 150
storage unit, 151 parts information area, 152 board information area, 153 connection information area, 160 output unit, 170 communication unit, 400 computer system.

Claims (13)

  1. 　プリント基板の設計支援装置であって、
    　過去に設計された複数のプリント基板の各々の設計指標情報を格納する記憶部と、
    　今回新たに設計されるプリント基板の設計指標情報の入力を受け付ける入力部と、
    　前記格納されている設計指標情報と、前記入力された設計指標情報とに基づいて、新たに設計されるプリント基板の設計仕様を提案するための処理部とを備え、
    　前記処理部は、
    　前記各々の設計指標情報をグループ化することにより一以上の設計仕様に集約し、
    　前記一以上の設計仕様から、前記新たに設計されるプリント基板の設計指標情報が含まれる設計仕様を決定し、
    　前記新たに設計されるプリント基板の設計仕様を出力する、プリント基板の設計支援装置。     A printed circuit board design support device,
    a storage unit that stores design index information for each of a plurality of printed circuit boards designed in the past;
    An input section that accepts input of design index information for the newly designed printed circuit board;
    a processing unit for proposing design specifications for a newly designed printed circuit board based on the stored design index information and the input design index information;
    The processing unit includes:
    By grouping each of the above design index information, it is aggregated into one or more design specifications,
    determining a design specification including design index information of the newly designed printed circuit board from the one or more design specifications;
    A printed circuit board design support device that outputs design specifications of the newly designed printed circuit board.
  2. 　前記決定することは、前記新たに設計されるプリント基板の設計指標情報が、前記過去に設計された複数のプリント基板のいずれかのプリント基板の当該設計指標情報の最大値と最小値との間に含まれることに基づいて、前記新たに設計されるプリント基板の設計仕様を前記いずれかのプリント基板の設計仕様として選定することを含む、請求項１に記載のプリント基板の設計支援装置。 The determining is that the design index information of the newly designed printed circuit board is between the maximum value and the minimum value of the design index information of any of the plurality of previously designed printed circuit boards. 2. The printed circuit board design support apparatus according to claim 1, further comprising selecting the design specifications of the newly designed printed circuit board as the design specifications of one of the printed circuit boards based on the fact that the design specifications of the newly designed printed circuit board are included in the design specifications of the printed circuit board.
  3. 　前記決定することは、前記新たに設計されるプリント基板の設計指標情報を、前記過去に設計された複数のプリント基板のいずれかの設計仕様に集約した場合に、集約後の設計仕様に含まれる設計指標情報のばらつきが最も小さくなる設計仕様を、前記新たに設計されるプリント基板の設計指標情報が集約される設計仕様として選定することを含む、請求項１に記載のプリント基板の設計支援装置。 The determining includes, when the design index information of the newly designed printed circuit board is aggregated into the design specifications of any of the plurality of previously designed printed circuit boards, included in the aggregated design specification. 2. The printed circuit board design support apparatus according to claim 1, further comprising selecting a design specification with the smallest variation in design index information as a design specification in which design index information of the newly designed printed circuit board is aggregated. .
  4. 　前記決定することは、
    　複数の設計仕様を決定することと、
    　前記複数の設計仕様の各々の設計指標情報のうち最も高性能な設計指標情報が含まれる設計仕様を、前記新たに設計されるプリント基板の設計仕様とすることとを含む、請求項１～３のいずれかに記載のプリント基板の設計支援装置。     Said determining:
    determining multiple design specifications;
    Claims 1 to 3 further comprising: setting a design specification that includes the highest performance design index information among the design index information of each of the plurality of design specifications as the design specification of the newly designed printed circuit board. The printed circuit board design support device according to any one of the above.
  5. 　前記決定することは、
    　複数の設計仕様を決定することと、
    　前記複数の設計仕様の各々の中心を導出することと、
    　前記各々の中心と、前記新たに設計されるプリント基板の設計指標情報との差が最も小さくなる設計指標情報を含む設計仕様を、前記新たに設計されるプリント基板の設計仕様とすることとを含む、請求項１～３のいずれかに記載のプリント基板の設計支援装置。     Said determining:
    determining multiple design specifications;
    deriving a center of each of the plurality of design specifications;
    A design specification including design index information that minimizes the difference between each of the centers and design index information of the newly designed printed circuit board is set as the design specification of the newly designed printed circuit board. A printed circuit board design support device according to any one of claims 1 to 3, comprising:
  6. 　前記集約することは、前記各々の設計指標情報のうち設定された閾値を上回る設計指標情報をグループ化することを含む、請求項１～５のいずれかに記載のプリント基板の設計支援装置。 6. The printed circuit board design support apparatus according to claim 1, wherein said aggregating includes grouping design index information exceeding a set threshold among said respective design index information.
  7. 　プリント基板の設計支援方法であって、
    　過去に設計された複数のプリント基板の各々の設計指標情報にアクセスするステップと、
    　前記各々の設計指標情報をグループ化することにより一以上の設計仕様に集約するステップと、
    　今回新たに設計されるプリント基板の設計指標情報の入力を受け付けるステップと、
    　前記一以上の設計仕様から、前記新たに設計されるプリント基板の設計指標情報が含まれる設計仕様を決定するステップと、
    　前記新たに設計されるプリント基板の設計仕様を出力するステップとを含む、プリント基板の設計支援方法。     A printed circuit board design support method, the method comprising:
    accessing design index information for each of a plurality of printed circuit boards designed in the past;
    a step of consolidating each of the design index information into one or more design specifications by grouping;
    a step of receiving input of design index information for the newly designed printed circuit board;
    determining a design specification including design index information of the newly designed printed circuit board from the one or more design specifications;
    A printed circuit board design support method, including the step of outputting design specifications of the newly designed printed circuit board.
  8. 　前記決定するステップは、前記新たに設計されるプリント基板の設計指標情報が、前記過去に設計された複数のプリント基板のいずれかのプリント基板の当該設計指標情報の最大値と最小値との間に含まれることに基づいて、前記新たに設計されるプリント基板の設計仕様を前記いずれかのプリント基板の設計仕様として選定するステップを含む、請求項７に記載のプリント基板の設計支援方法。 In the step of determining, the design index information of the newly designed printed circuit board is between the maximum value and the minimum value of the design index information of any of the plurality of previously designed printed circuit boards. 8. The printed circuit board design support method according to claim 7, further comprising the step of selecting the design specifications of the newly designed printed circuit board as the design specifications of any of the printed circuit boards based on the fact that the design specifications of the newly designed printed circuit board are included in the design specifications of the printed circuit board.
  9. 　前記決定するステップは、前記新たに設計されるプリント基板の設計指標情報を、前記過去に設計された複数のプリント基板のいずれかの設計仕様に集約した場合に、集約後の設計仕様に含まれる設計指標情報のばらつきが最も小さくなる設計仕様を、前記新たに設計されるプリント基板の設計指標情報が集約される設計仕様として選定するステップを含む、請求項７に記載のプリント基板の設計支援方法。 The determining step includes, when the design index information of the newly designed printed circuit board is aggregated into the design specifications of any of the plurality of previously designed printed circuit boards, the information is included in the aggregated design specification. 8. The printed circuit board design support method according to claim 7, comprising the step of selecting a design specification with the smallest variation in design index information as the design specification in which the design index information of the newly designed printed circuit board is aggregated. .
  10. 　前記決定するステップは、
    　複数の設計仕様を決定するステップと、
    　前記複数の設計仕様の各々の設計指標情報のうち最も高性能な設計指標情報が含まれる設計仕様を、前記新たに設計されるプリント基板の設計仕様とするステップとを含む、請求項７～９のいずれかに記載の設計支援方法。     The step of determining includes:
    determining a plurality of design specifications;
    Claims 7 to 9 further comprising the step of setting a design specification including the highest performance design index information among the design index information of each of the plurality of design specifications as the design specification of the newly designed printed circuit board. The design support method described in any of the above.
  11. 　前記決定するステップは、
    　複数の設計仕様を決定するステップと、
    　前記複数の設計仕様の各々の中心を導出するステップと、
    　前記各々の中心と、前記新たに設計されるプリント基板の設計指標情報との差が最も小さくなる設計指標情報を含む設計仕様を、前記新たに設計されるプリント基板の設計仕様とするステップとを含む、請求項７～９のいずれかに記載の設計支援方法。     The step of determining includes:
    determining a plurality of design specifications;
    deriving a center of each of the plurality of design specifications;
    a step of setting a design specification including design index information that minimizes the difference between each center and design index information of the newly designed printed circuit board as the design specification of the newly designed printed circuit board; The design support method according to any one of claims 7 to 9, comprising:
  12. 　前記集約するステップは、前記各々の設計指標情報のうち設定された閾値を上回る設計指標情報をグループ化するステップを含む、請求項７～１１のいずれかに記載の設計支援方法。 The design support method according to any one of claims 7 to 11, wherein the step of aggregating includes the step of grouping design index information exceeding a set threshold among the respective design index information.
  13. 　請求項７～１２のいずれかに記載の設計支援方法をコンピュータに実行させる、プログラム。 A program that causes a computer to execute the design support method according to any one of claims 7 to 12.
PCT/JP2023/009824 2022-03-16 2023-03-14 Printed circuit board design assistance device and design assistance method, and program for causing computer to execute design assistance method WO2023176823A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022041004 2022-03-16
JP2022-041004 2022-03-16

Publications (1)

Publication Number Publication Date
WO2023176823A1 true WO2023176823A1 (en) 2023-09-21

Family

ID=88023857

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2023/009824 WO2023176823A1 (en) 2022-03-16 2023-03-14 Printed circuit board design assistance device and design assistance method, and program for causing computer to execute design assistance method

Country Status (1)

Country Link
WO (1) WO2023176823A1 (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002056045A (en) * 2000-05-31 2002-02-20 Hitachi Commun Syst Inc Method and device for supporting printed wiring board design
JP2018032210A (en) * 2016-08-24 2018-03-01 富士通株式会社 Design prediction apparatus, design prediction program and design prediction method
JP2020184159A (en) * 2019-05-07 2020-11-12 株式会社日立製作所 Design support system, design support method, and design support program

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002056045A (en) * 2000-05-31 2002-02-20 Hitachi Commun Syst Inc Method and device for supporting printed wiring board design
JP2018032210A (en) * 2016-08-24 2018-03-01 富士通株式会社 Design prediction apparatus, design prediction program and design prediction method
JP2020184159A (en) * 2019-05-07 2020-11-12 株式会社日立製作所 Design support system, design support method, and design support program

Similar Documents

Publication Publication Date Title
US7831929B2 (en) Method, system, and program product for controlling a display on a data editing screen
JP6599057B1 (en) Design support device, design support method, and machine learning device
CN113327136A (en) Attribution analysis method and device, electronic equipment and storage medium
US7960836B2 (en) Redundant micro-loop structure for use in an integrated circuit physical design process and method of forming the same
US8255424B2 (en) System and method for structuring data in a storage device
KR100994693B1 (en) Analysis supproting apparatus, analysis supporting method, and computer readable recording medium which records analysis supporting program
CN108140059B (en) Visualization of analytical process parameters for layout-based inspection
WO2023176823A1 (en) Printed circuit board design assistance device and design assistance method, and program for causing computer to execute design assistance method
KR100999016B1 (en) Jitter amount estimating method, method for calculating correlation between amount of simultaneously operating signal noise and jitter amount, and recording medium
WO2010039454A1 (en) Automatic alignment of macro cells of a circuit layout
JP6668494B2 (en) Data analysis device and data analysis method
US7418675B2 (en) System and method for reducing the power consumption of clock systems
CN115599618A (en) Register dynamic relocation verification method and device, storage medium and processor
JP6805632B2 (en) Design prediction device, design prediction program and design prediction method
US20020143517A1 (en) Logical simulation system, logical simulation method and computer-readable recorded medium
CN106560819A (en) Control Block Size Reduction Through Ip Migration In Integrated Circuit Device
JP4283647B2 (en) Layout check system
JP2009176053A (en) Analysis support device, analysis support method and analysis support program
CN112181796A (en) Information acquisition method, device, server and storage medium
WO2017163342A1 (en) Computer system and data classification method
JP2009176051A (en) Analysis support device, analysis support method, and analysis support program
JP6569498B2 (en) Voltage drop simulation program, information processing apparatus, and voltage drop simulation method
US20230100758A1 (en) Unique identifier creation and management for elaborated platform
CN1430168A (en) Object matching management system for realizing immediately reflecting change of object information
KR102466551B1 (en) Data writing method, device, and electronic equipment

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 23770778

Country of ref document: EP

Kind code of ref document: A1