WO2023176563A1 - Wiring circuit substrate - Google Patents

Wiring circuit substrate Download PDF

Info

Publication number
WO2023176563A1
WO2023176563A1 PCT/JP2023/008415 JP2023008415W WO2023176563A1 WO 2023176563 A1 WO2023176563 A1 WO 2023176563A1 JP 2023008415 W JP2023008415 W JP 2023008415W WO 2023176563 A1 WO2023176563 A1 WO 2023176563A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
printed circuit
vibrator
support layer
magnet
Prior art date
Application number
PCT/JP2023/008415
Other languages
French (fr)
Japanese (ja)
Inventor
真弥 井上
博司 山崎
Original Assignee
日東電工株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日東電工株式会社 filed Critical 日東電工株式会社
Publication of WO2023176563A1 publication Critical patent/WO2023176563A1/en

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/04—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with electromagnetism
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes

Definitions

  • the present invention relates to a printed circuit board.
  • Patent Document 1 describes an actuator that includes a multilayer substrate, a magnet, and a movable body.
  • the multilayer substrate includes a laminate and a coil formed in the laminate. When a predetermined current is passed through the coil, a magnetic field radiated from the coil causes the magnet and the movable body to be displaced in a direction perpendicular to the stacking direction of the stacked bodies on the multilayer board.
  • An object of the present invention is to provide a printed circuit board that can be used as an actuator and can be made thinner.
  • a printed circuit board includes a metal support layer, an insulating layer disposed on the metal support layer, and a conductor layer disposed on the insulating layer, and includes a part of the metal support layer. constitutes a vibrator.
  • the vibrator since the vibrator is constituted by a part of the metal support layer, the printed circuit board can be used alone as an actuator. Further, the vibrator can be formed in the manufacturing process of the printed circuit board, and there is no need to provide a structure for adding the vibrator to the printed circuit board. This allows the printed circuit board to be made thinner while configuring the printed circuit board as an actuator.
  • the thickness of the vibrator may be smaller than the thickness of a portion of the metal support layer that is different from the vibrator. In this case, the vibrator can be easily configured to vibrate.
  • the vibrator may have a meandering shape or a spiral shape. In this case, the vibrator can be easily configured to vibrate.
  • a part of the conductor layer may constitute a coil.
  • the printed circuit board can be easily used as an actuator by passing a current through a portion of the conductor layer.
  • a magnet may be attached to the vibrator.
  • the vibrator can be easily vibrated by the magnetic force between the conductor layer and the magnet.
  • the vibrator may include a magnet support layer to which a magnet is attached, and a connection piece that connects the magnet support layer and a portion of the metal support layer that is different from the vibrator. In this case, the magnet support layer in the vibrator can be efficiently vibrated.
  • the vibrator may form a coil.
  • the printed circuit board can be easily used as an actuator.
  • a magnet may be attached at a position spaced apart from the vibrator by a predetermined distance. In this case, the vibrator can be easily vibrated by the magnetic force between the vibrator and the magnet.
  • a printed circuit board that can be used as an actuator can be made thinner.
  • FIG. 1 is a schematic cross-sectional view of a touch panel including a printed circuit board according to a first embodiment of the present invention.
  • FIG. 2 is a plan view of the printed circuit board of FIG.
  • FIG. 3 is a cross-sectional view taken along line AA of the printed circuit board of FIG.
  • FIG. 4 is a diagram for explaining the operation of the printed circuit board of FIG. 2.
  • FIG. 5 is a process cross-sectional view for explaining an example of a method for manufacturing a printed circuit board.
  • FIG. 6 is a process cross-sectional view for explaining an example of a method for manufacturing a printed circuit board.
  • FIG. 7 is a process cross-sectional view for explaining an example of a method for manufacturing a printed circuit board.
  • FIG. 1 is a schematic cross-sectional view of a touch panel including a printed circuit board according to a first embodiment of the present invention.
  • FIG. 2 is a plan view of the printed circuit board of FIG.
  • FIG. 3 is a cross-
  • FIG. 8 is a process cross-sectional view for explaining an example of a method for manufacturing a printed circuit board.
  • FIG. 9 is a process cross-sectional view for explaining an example of a method for manufacturing a printed circuit board.
  • FIG. 10 is a process cross-sectional view for explaining an example of a method for manufacturing a printed circuit board.
  • FIG. 11 is a plan view of a printed circuit board according to a first modification.
  • FIG. 12 is a diagram for explaining the operation of the printed circuit board of FIG. 11.
  • FIG. 13 is a plan view of a printed circuit board according to a second modification.
  • FIG. 14 is a diagram for explaining the operation of the printed circuit board of FIG. 13.
  • FIG. 15 is a plan view of a printed circuit board according to the second embodiment of the invention.
  • FIG. 16 is a diagram for explaining the operation of the printed circuit board of FIG. 15.
  • a printed circuit board according to an embodiment of the present invention will be described with reference to the drawings.
  • a printed circuit board is provided in a touch panel as a haptic (tactile technology) element, but the embodiments are not limited thereto.
  • the printed circuit board can be provided as an actuator in various products.
  • FIG. 1 is a schematic cross-sectional view of a touch panel including a printed circuit board according to a first embodiment of the present invention.
  • the touch panel 200 includes a printed circuit board 100, a rear panel 110, adhesive layers 120 and 130, a display 140, a protective layer 150, and a drive circuit 160.
  • the touch panel 200 is, for example, a capacitive touch panel, and is mounted on a television, a mobile phone, a personal digital assistant, or other display device.
  • Adhesive layers 120 and 130 include double-sided tape.
  • Protective layer 150 is, for example, a cover glass and is attached to the surface of display 140. Details of the printed circuit board 100 will be described later.
  • the drive circuit 160 includes, for example, an integrated circuit.
  • the drive circuit 160 may be mounted on the printed circuit board 100.
  • the printed circuit board 100 and the drive circuit 160 are electrically connected by wiring 170.
  • the wiring 170 may be a circuit board such as a flexible printed circuit board.
  • the user of the touch panel 200 touches the protective layer 150 of the touch panel 200 with a finger or a touch pen (finger in the example of FIG. 1).
  • the capacitance between a plurality of electrodes (not shown) provided on the printed circuit board 100 changes.
  • the drive circuit 160 detects a change in the capacitance of the printed circuit board 100, it causes an alternating current to flow through the wiring 170 to a conductor layer 30 of the printed circuit board 100, which will be described later. This causes the printed circuit board 100 to vibrate. As a result, the user can perceive that the touch panel 200 has been touched.
  • FIG. 2 is a plan view of the printed circuit board 100 of FIG. 1.
  • FIG. 3 is a cross-sectional view taken along line AA of the printed circuit board 100 of FIG.
  • the printed circuit board 100 includes a metal support layer 10, a base insulating layer 20, a conductor layer 30, a magnet 40, and a cover insulating layer 50. Note that in FIG. 2, illustration of the cover insulating layer 50 is omitted. Also in FIG. 4 and the like described later, illustration of the cover insulating layer 50 is omitted as appropriate.
  • the metal support layer 10 is made of stainless steel, for example.
  • Metal support layer 10 includes an insulator support layer 11 and a vibrator 12.
  • the insulator support layer 11 has a rectangular frame shape.
  • the length of each side of the insulator support layer 11 in plan view is, for example, 30 mm or more and 50 mm or less.
  • the user can visually recognize the rear panel 110 in FIG. 1 through the area surrounded by the insulator support layer 11 (hereinafter referred to as a hollow area).
  • the width of the insulator support layer 11 is preferably small so as not to obstruct the visibility of the rear panel 110. In this example, the width of the insulator support layer 11 is 18 ⁇ m.
  • the vibrator 12 includes a magnet support layer 12a and a plurality of (four in this example) connecting pieces 12b.
  • the magnet support layer 12a is arranged approximately at the center of the hollow region.
  • Each connection piece 12b has a meandering shape and connects the magnet support layer 12a and the insulator support layer 11.
  • the thickness of the vibrator 12 may be smaller than the thickness of the insulator support layer 11.
  • the thickness of the insulator support layer 11 is 100 ⁇ m or more and 150 ⁇ m or less, and the thickness of the vibrator 12 is 15 ⁇ m or more and 60 ⁇ m or less.
  • the base insulating layer 20 is made of polyimide, for example.
  • the base insulating layer 20 has substantially the same rectangular frame shape as the insulator support layer 11 and is formed on the insulator support layer 11 .
  • the thickness of the base insulating layer 20 is, for example, 5 ⁇ m or more and 10 ⁇ m or less.
  • the conductor layer 30 is made of copper, for example, and constitutes wiring and electrodes. A portion of the wiring in the conductor layer 30 is a coil, which is formed on the base insulating layer 20 so as to surround the hollow region. The illustration of the conductor layer 30 other than the coil portion is omitted.
  • the thickness of the conductor layer 30 is, for example, 5 ⁇ m or more and 30 ⁇ m or less. Both ends of the coil of the conductor layer 30 are drawn out of the base insulating layer 20 and connected to the drive circuit 160 via the wiring 170 in FIG.
  • the magnet 40 is a permanent magnet and is attached to one surface of the magnet support layer 12a of the vibrator 12. In the example of FIG. 3, the north pole of the magnet 40 is attached to the magnet support layer 12a.
  • the magnet 40 may be indirectly attached to the magnet support layer 12a via another member such as an adhesive layer or a resin layer.
  • the cover insulating layer 50 is made of polyimide, for example.
  • the cover insulating layer 50 has substantially the same rectangular frame shape as the base insulating layer 20 and is formed on the base insulating layer 20 so as to cover the conductor layer 30 .
  • the thickness of the cover insulating layer 50 is, for example, 8 ⁇ m or more and 50 ⁇ m or less.
  • FIG. 4 is a diagram for explaining the operation of printed circuit board 100 of FIG. 2. As shown by the arrow in the upper part of FIG. 4, the drive circuit 160 causes an alternating current to flow through the conductor layer 30 of the printed circuit board 100 through the wiring 170, so that the coil of the conductor layer 30 becomes an electromagnet.
  • FIGS. 5 to 10 are process cross-sectional views for explaining an example of a method for manufacturing the printed circuit board 100.
  • 5 to 10 correspond to cross-sectional views taken along the line AA of the printed circuit board 100 in FIG.
  • a rectangular metal plate 10A made of stainless steel is prepared, and masks 101 are formed on the outer periphery of both sides of the metal plate 10A.
  • the material of the metal plate 10A is not limited to stainless steel, but may be other metals such as aluminum.
  • an etching solution the portion of the metal plate 10A exposed from the mask 101 is etched for a relatively short period of time (hereinafter referred to as half etching).
  • a thick part 10a and a thin part 10b having a smaller thickness than the thick part 10a are formed in the metal plate 10A.
  • half etching is performed on both sides of the metal plate 10A at the same time, but the embodiment is not limited to this.
  • Half etching may be sequentially performed on each side of the metal plate 10A.
  • half etching may be performed only on one surface of the metal plate 10A, and no half etching may be performed on the other surface of the metal plate 10A.
  • the mask 101 is removed from the metal plate 10A.
  • a mask (not shown) is formed on the metal plate 10A so that unnecessary parts are exposed, and the parts of the metal plate 10A exposed from the mask are etched (hereinafter referred to as full etching) using an etching solution.
  • full etching the parts of the metal plate 10A exposed from the mask are etched (hereinafter referred to as full etching) using an etching solution.
  • the thick portion 10a becomes the insulator support layer 11
  • the vibrator 12 consisting of the magnet support layer 12a and the connecting piece 12b is It is formed in the thin portion 10b.
  • the metal support layer 10 is formed.
  • the metal support layer 10 is formed by performing half etching on the metal plate 10A and then performing full etching, but the embodiment is not limited to this.
  • the metal support layer 10 may be formed by performing half etching after the entire etching is performed on the metal plate 10A. After the complete etching is complete, the mask is removed from the metal support layer 10.
  • a base insulating layer 20 is formed on the upper surface of the insulator support layer 11.
  • the base insulating layer 20 may be formed by applying a photosensitive resin precursor to the metal support layer 10 and partially exposing the photosensitive resin precursor to ultraviolet light.
  • the material of the base insulating layer 20 is polyimide, but it may be other resin such as epoxy.
  • a conductor layer 30 is formed on the base insulating layer 20, and a cover insulating layer 50 is formed on the base insulating layer 20 so as to cover the conductor layer 30.
  • the conductor layer 30 may be formed using an additive method, a semi-additive method, or another method such as a subtractive method.
  • the procedure for forming the cover insulating layer 50 is the same as the step for forming the base insulating layer 20.
  • a magnet 40 is attached to the upper surface of the magnet support layer 12a of the vibrator 12. Thereby, the printed circuit board 100 is completed.
  • the vibrator 12 is constituted by a part of the metal support layer 10. Therefore, the printed circuit board 100 can be used alone as an actuator. Specifically, a part of the conductor layer 30 constitutes a coil, and a magnet 40 is attached to the magnet support layer 12a of the vibrator 12. In this case, by passing a current through a portion of the conductor layer 30, magnetic force is generated between the conductor layer 30 and the magnet 40. Thereby, the magnet support layer 12a can be easily and efficiently vibrated. Therefore, the printed circuit board 100 can be easily used as an actuator.
  • the vibrator 12 can be formed during the manufacturing process of the printed circuit board 100, and the user does not need to assemble each component of the printed circuit board 100. Therefore, the actuator can be constructed with high dimensional accuracy. Further, there is no need to provide a structure for adding the vibrator 12 to the printed circuit board 100. As a result, the printed circuit board 100 can be made thinner while configuring the printed circuit board 100 as an actuator.
  • the thickness of the vibrator 12 in the metal support layer 10 is smaller than the thickness of the insulator support layer 11. Further, the vibrator 12 has a meandering shape. Thereby, the vibrator 12 can be easily configured to vibrate. Alternatively, the vibrator 12 may have a spiral shape. In this case, the vibrator 12 functions as a spiral spring or a bamboo spring. Therefore, the vibrator 12 can be easily configured to vibrate.
  • the vibrator 12 includes four connecting pieces 12b having a meandering shape, but the embodiment is not limited to this.
  • the vibrator 12 may include less than four connecting pieces 12b. Further, if the vibrator 12 is capable of sufficiently vibrating, the connecting piece 12b does not need to have a meandering shape.
  • different points from the printed circuit board 100 of FIG. 2 will be explained regarding the printed circuit board 100 according to the modified example.
  • FIG. 11 is a plan view of a printed circuit board 100 according to a first modification.
  • the vibrator 12 includes a magnet support layer 12a and one connection piece 12b.
  • the magnet support layer 12a has a disk shape
  • the connecting piece 12b has a belt shape.
  • FIG. 12 is a diagram for explaining the operation of the printed circuit board 100 of FIG. 11.
  • an alternating current is passed through the conductor layer 30.
  • the state shown in the middle row of FIG. 12 in which the magnet 40 receives an upward magnetic force
  • the state shown in the lower row of FIG. 12, in which the magnet 40 receives a downward magnetic force alternately occur.
  • the vibrator 12 vibrates in the vertical direction with respect to the insulator support layer 11.
  • FIG. 13 is a plan view of a printed circuit board 100 according to a second modification.
  • the vibrator 12 includes a magnet support layer 12a and two connecting pieces 12b.
  • the magnet support layer 12a has a rectangular plate shape
  • each connecting piece 12b has a band shape.
  • the two connecting pieces 12b connect the magnet support layer 12a and the insulator support layer 11 while facing each other with the magnet support layer 12a in between.
  • FIG. 14 is a diagram for explaining the operation of the printed circuit board 100 of FIG. 13.
  • an alternating current is passed through the conductor layer 30.
  • the vibrator 12 vibrates in the vertical direction with respect to the insulator support layer 11.
  • the magnet 40 may be attached to an area of the magnet support layer 12a that does not overlap with the area sandwiched between the two connecting pieces 12b. In this case, when a current flows through the conductor layer 30, the magnet support layer 12a vibrates in a half-rotation shape about the two connecting pieces 12b as rotational axes. This allows the vibrator 12 to vibrate more greatly.
  • a coil is formed in a part of the conductor layer 30, but the embodiment is not limited to this.
  • a coil may be formed in a part of the metal support layer 10.
  • FIG. 15 is a plan view of a printed circuit board 100 according to the second embodiment of the present invention.
  • the printed circuit board 100 includes a metal support layer 10, a base insulating layer 20, a conductor layer 30, magnets 40A to 40D, and a cover insulating layer 50.
  • illustration of the cover insulating layer 50 is omitted.
  • a part of the metal support layer 10 is a coil having a substantially rectangular frame shape.
  • the illustration of the metal support layer 10 other than the coil portion is omitted.
  • the length of each side of the coil in the metal support layer 10 in plan view is, for example, 30 mm or more and 50 mm or less.
  • metal support layer 10 includes insulator support layers 13, 14, 15 and vibrators 16, 17.
  • Each of the insulator support layers 13 to 15 has a band shape extending in one direction.
  • the insulator support layers 14 and 15 are arranged in a line and face the insulator support layer 13.
  • Each vibrator 16, 17 has a meandering shape.
  • the vibrator 16 connects one end of the insulator support layer 13 and the outer end of the insulator support layer 14 .
  • the vibrator 17 connects the other end of the insulator support layer 13 and the outer end of the insulator support layer 15 .
  • the thickness of each vibrator 16, 17 may be smaller than the thickness of each insulator support layer 13-15. Furthermore, if each of the vibrators 16 and 17 can sufficiently vibrate, each of the vibrators 16 and 17 does not need to have a meandering shape.
  • the base insulating layer 20 is made of a transparent resin such as polyester, acrylic, polypropylene, polystyrene, cellulose, or cycloolefin polymer.
  • the base insulating layer 20 has openings 21 and 22 corresponding to the vibrators 16 and 17 of the metal support layer 10, respectively, and is formed on the insulator support layer 11 of the metal support layer 10. Vibrators 16 and 17 are exposed within openings 21 and 22, respectively.
  • the base insulating layer 20 may be formed of an opaque resin such as polyimide.
  • an opening 23 for viewing the rear panel 110 of FIG. 1 is formed in the central region of the base insulating layer 20.
  • the opening 23 may be formed in the base insulating layer 20 in order to improve the visibility of the rear panel 110.
  • the printed circuit board 100 is not required to have translucency, the opening 23 may not be formed in the base insulating layer 20 regardless of the material of the base insulating layer 20.
  • the conductor layer 30 includes two electrodes 31 and 32 that are electrically isolated from each other, and is formed on the base insulating layer 20. Illustration of the conductor layer 30 other than the electrodes 31 and 32 is omitted. Electrode 31 penetrates base insulating layer 20 and is connected to the inner end of insulator support layer 14 . Electrode 32 penetrates base insulating layer 20 and is connected to the inner end of insulator support layer 15 . Further, the electrodes 31 and 32 are connected to the drive circuit 160 via the wiring 170 in FIG.
  • a plurality of magnets 40A to 40D are attached at positions spaced apart from the vibrators 16 and 17 by a predetermined distance.
  • the magnet 40 may be attached to any part other than the vibrators 16 and 17. Also, some of the magnets 40 may be attached to the inside of the coil, and other magnets 40 may be attached to the outside of the coil.
  • magnets 40A to 40D are mounted on the base insulating layer 20.
  • Magnet 40A and magnet 40B are located near vibrator 16 and face each other with vibrator 16 in between.
  • Magnet 40C and magnet 40D are located near vibrator 17 and face each other with vibrator 17 in between.
  • the polarity directions of all magnets 40A to 40D are the same.
  • the S pole of each magnet 40A to 40D faces to the left in the paper, and the N pole faces to the right in the paper.
  • FIG. 16 is a diagram for explaining the operation of the printed circuit board 100 of FIG. 15. As shown by the arrow in the upper part of FIG. 16, the drive circuit 160 in FIG. The coil of the support layer 10 becomes an electromagnet.
  • a magnetic force is generated between the vibrator 16 and the magnets 40A, 40B, and a magnetic force is generated between the vibrator 17 and the magnets 40C, 40D.
  • the vibrator 16 receives an upward magnetic force and the vibrator 17 receives a downward magnetic force.
  • the method for manufacturing the insulator support layers 13 to 15 in this embodiment is the same as the method for manufacturing the insulator support layer 11 in the first embodiment. Furthermore, the method for manufacturing the vibrators 16 and 17 in this embodiment is the same as the method for manufacturing the vibrator 12 in the first embodiment. Therefore, the method for manufacturing the printed circuit board 100 according to the present embodiment is the same as the first one, except that a step of electrically connecting the conductor layer 30 and the metal support layer 10 through the base insulating layer 20 is added. This method is similar to the method for manufacturing printed circuit board 100 according to the embodiment.
  • the metal support layer 10 forms a coil, and the vibrators 16 and 17 become part of the coil.
  • Magnets 40A and 40B are attached to positions spaced apart from the vibrator 16 by a predetermined distance.
  • Magnets 40C and 40D are attached to positions spaced apart from the vibrator 17 by a predetermined distance.
  • the insulator support layers 14 and 15 of the metal support layer 10 are connected to the wiring 170 via the electrodes 31 and 32 of the conductor layer 30, but the embodiment is limited to this. Not done.
  • the insulator support layers 14 and 15 of the metal support layer 10 may be directly connected to the wiring 170 without using the electrodes 31 and 32 of the conductor layer 30.
  • the thickness of the vibrators 12, 16, 17 is smaller than the thickness of the insulator support layers 11, 13 to 15, but the embodiments are limited to this. Not done. When the vibrators 12, 16, 17 can vibrate sufficiently, the thickness of the vibrators 12, 16, 17 may be equal to the thickness of the insulator support layers 11, 13-15. Therefore, in the manufacturing process of printed circuit board 100, the half etching shown in FIGS. 5 and 6 does not need to be performed.
  • the conductor layer 30 or the metal support layer 10 is formed as a one-turn coil, but the embodiments are not limited to this.
  • the conductor layer 30 or the metal support layer 10 may be formed as a coil with multiple turns. In this case, the coils may be concentrically routed on the same plane, or may be stacked in the thickness direction of printed circuit board 100.
  • the printed circuit board 100 includes the magnet 40, but the embodiment is not limited to this.
  • the printed circuit board 100 only needs to have a magnet attachment part to which the magnet 40 can be attached, and does not need to include the magnet 40. In this case, by attaching the magnet 40 to the magnet attachment part, the printed circuit board 100 can be used as an actuator.
  • the magnet support layer 12a of the vibrator 12 is the magnet attachment part.
  • a portion of the base insulating layer 20 close to the vibrators 16 and 17 is a magnet attachment portion.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Apparatuses For Generation Of Mechanical Vibrations (AREA)
  • Reciprocating, Oscillating Or Vibrating Motors (AREA)

Abstract

This wiring circuit substrate comprises a metal support layer, a base insulation layer, and a conductor layer. The metal support layer is formed of a metal material. The base insulation layer is disposed on the metal support layer. The conductor layer is disposed on the base insulation layer. An oscillator is constituted by a section of the metal support layer.

Description

配線回路基板wiring circuit board
　本発明は、配線回路基板に関する。 The present invention relates to a printed circuit board.
　回路基板を用いてアクチュエータが構成されることがある。例えば、特許文献１には、多層基板、磁石および可動体を備えるアクチュエータが記載されている。多層基板は、積層体と、積層体に形成されるコイルとを含む。コイルに所定の電流が流されると、コイルから放射される磁界により、磁石および可動体が多層基板における積層体の積層方向とは直交する方向に変位する。 An actuator may be constructed using a circuit board. For example, Patent Document 1 describes an actuator that includes a multilayer substrate, a magnet, and a movable body. The multilayer substrate includes a laminate and a coil formed in the laminate. When a predetermined current is passed through the coil, a magnetic field radiated from the coil causes the magnet and the movable body to be displaced in a direction perpendicular to the stacking direction of the stacked bodies on the multilayer board.
特許第６９１３１５５号Patent No. 6913155
　アクチュエータを薄型化することにより、アクチュエータを種々の製品に応用することが可能である。しかしながら、特許文献１のアクチュエータを薄型化することは困難である。 By making the actuator thinner, it is possible to apply the actuator to various products. However, it is difficult to make the actuator of Patent Document 1 thinner.
　本発明の目的は、アクチュエータとして使用可能でかつ薄型化可能な配線回路基板を提供することである。 An object of the present invention is to provide a printed circuit board that can be used as an actuator and can be made thinner.
　（１）本発明の一局面に従う配線回路基板は、金属支持層と、金属支持層上に配置される絶縁層と、絶縁層上に配置される導体層とを備え、金属支持層の一部は振動子を構成する。 (1) A printed circuit board according to one aspect of the present invention includes a metal support layer, an insulating layer disposed on the metal support layer, and a conductor layer disposed on the insulating layer, and includes a part of the metal support layer. constitutes a vibrator.
　この場合、金属支持層の一部により振動子が構成されるので、配線回路基板を単体でアクチュエータとして使用することができる。また、振動子は、配線回路基板の製造工程で形成可能であり、振動子を追加するための構成を配線回路基板に設ける必要がない。これにより、配線回路基板をアクチュエータとして構成しつつ、配線回路基板を薄型化することができる。 In this case, since the vibrator is constituted by a part of the metal support layer, the printed circuit board can be used alone as an actuator. Further, the vibrator can be formed in the manufacturing process of the printed circuit board, and there is no need to provide a structure for adding the vibrator to the printed circuit board. This allows the printed circuit board to be made thinner while configuring the printed circuit board as an actuator.
　（２）振動子の厚みは、金属支持層における振動子とは異なる部分の厚みよりも小さくてもよい。この場合、振動子を容易に振動可能に構成することができる。 (2) The thickness of the vibrator may be smaller than the thickness of a portion of the metal support layer that is different from the vibrator. In this case, the vibrator can be easily configured to vibrate.
　（３）振動子は蛇行形状または渦巻形状を有してもよい。この場合、振動子を容易に振動可能に構成することができる。 (3) The vibrator may have a meandering shape or a spiral shape. In this case, the vibrator can be easily configured to vibrate.
　（４）導体層の一部はコイルを構成してもよい。この場合、導体層の一部に電流を流すことにより、配線回路基板を容易にアクチュエータとして使用することができる。 (4) A part of the conductor layer may constitute a coil. In this case, the printed circuit board can be easily used as an actuator by passing a current through a portion of the conductor layer.
　（５）振動子に磁石が取り付けられてもよい。この場合、導体層と磁石との間の磁力により振動子を容易に振動させることができる。 (5) A magnet may be attached to the vibrator. In this case, the vibrator can be easily vibrated by the magnetic force between the conductor layer and the magnet.
　（６）振動子は、磁石が取り付けられる磁石支持層と、磁石支持層と金属支持層における振動子とは異なる部分とを連結する連結片とを含んでもよい。この場合、振動子における磁石支持層を効率的に振動させることができる。 (6) The vibrator may include a magnet support layer to which a magnet is attached, and a connection piece that connects the magnet support layer and a portion of the metal support layer that is different from the vibrator. In this case, the magnet support layer in the vibrator can be efficiently vibrated.
　（７）振動子はコイルを形成してもよい。この場合、振動子に電流を流すことにより、配線回路基板を容易にアクチュエータとして使用することができる。 (7) The vibrator may form a coil. In this case, by passing a current through the vibrator, the printed circuit board can be easily used as an actuator.
　（８）振動子から所定距離だけ離間した位置に磁石が取り付けられてもよい。この場合、振動子と磁石との間の磁力により振動子を容易に振動させることができる。 (8) A magnet may be attached at a position spaced apart from the vibrator by a predetermined distance. In this case, the vibrator can be easily vibrated by the magnetic force between the vibrator and the magnet.
　本発明によれば、アクチュエータとして使用可能な配線回路基板を薄型化することができる。 According to the present invention, a printed circuit board that can be used as an actuator can be made thinner.
図１は本発明の第１の実施の形態に係る配線回路基板を含むタッチパネルの模式的断面図である。FIG. 1 is a schematic cross-sectional view of a touch panel including a printed circuit board according to a first embodiment of the present invention. 図２は図１の配線回路基板の平面図である。FIG. 2 is a plan view of the printed circuit board of FIG. 図３は図２の配線回路基板のＡ－Ａ線断面図である。FIG. 3 is a cross-sectional view taken along line AA of the printed circuit board of FIG. 図４は図２の配線回路基板の動作を説明するための図である。FIG. 4 is a diagram for explaining the operation of the printed circuit board of FIG. 2. 図５は配線回路基板の製造方法の一例を説明するための工程断面図である。FIG. 5 is a process cross-sectional view for explaining an example of a method for manufacturing a printed circuit board. 図６は配線回路基板の製造方法の一例を説明するための工程断面図である。FIG. 6 is a process cross-sectional view for explaining an example of a method for manufacturing a printed circuit board. 図７は配線回路基板の製造方法の一例を説明するための工程断面図である。FIG. 7 is a process cross-sectional view for explaining an example of a method for manufacturing a printed circuit board. 図８は配線回路基板の製造方法の一例を説明するための工程断面図である。FIG. 8 is a process cross-sectional view for explaining an example of a method for manufacturing a printed circuit board. 図９は配線回路基板の製造方法の一例を説明するための工程断面図である。FIG. 9 is a process cross-sectional view for explaining an example of a method for manufacturing a printed circuit board. 図１０は配線回路基板の製造方法の一例を説明するための工程断面図である。FIG. 10 is a process cross-sectional view for explaining an example of a method for manufacturing a printed circuit board. 図１１は第１の変形例に係る配線回路基板の平面図である。FIG. 11 is a plan view of a printed circuit board according to a first modification. 図１２は図１１の配線回路基板の動作を説明するための図である。FIG. 12 is a diagram for explaining the operation of the printed circuit board of FIG. 11. 図１３は第２の変形例に係る配線回路基板の平面図である。FIG. 13 is a plan view of a printed circuit board according to a second modification. 図１４は図１３の配線回路基板の動作を説明するための図である。FIG. 14 is a diagram for explaining the operation of the printed circuit board of FIG. 13. 図１５は本発明の第２の実施の形態に係る配線回路基板の平面図である。FIG. 15 is a plan view of a printed circuit board according to the second embodiment of the invention. 図１６は図１５の配線回路基板の動作を説明するための図である。FIG. 16 is a diagram for explaining the operation of the printed circuit board of FIG. 15.
　以下、本発明の実施の形態に係る配線回路基板について図面を参照しながら説明する。以下の本発明の実施の形態においては、配線回路基板は、ハプティクス（触覚技術）素子としてタッチパネルに設けられるが、実施の形態はこれに限定されない。配線回路基板は、種々の製品にアクチュエータとして設けることが可能である。 Hereinafter, a printed circuit board according to an embodiment of the present invention will be described with reference to the drawings. In the following embodiments of the present invention, a printed circuit board is provided in a touch panel as a haptic (tactile technology) element, but the embodiments are not limited thereto. The printed circuit board can be provided as an actuator in various products.
　＜１＞第１の実施の形態
　（１）タッチパネル
　図１は、本発明の第１の実施の形態に係る配線回路基板を含むタッチパネルの模式的断面図である。図１に示すように、タッチパネル２００は、配線回路基板１００、リアパネル１１０、接着層１２０，１３０、ディスプレイ１４０、保護層１５０および駆動回路１６０を含む。なお、タッチパネル２００は、例えば静電容量方式のタッチパネルであり、テレビ、携帯電話機、携帯情報端末またはその他の表示装置に搭載される。 <1> First Embodiment (1) Touch Panel FIG. 1 is a schematic cross-sectional view of a touch panel including a printed circuit board according to a first embodiment of the present invention. As shown in FIG. 1, the touch panel 200 includes a printed circuit board 100, a rear panel 110, adhesive layers 120 and 130, a display 140, a protective layer 150, and a drive circuit 160. Note that the touch panel 200 is, for example, a capacitive touch panel, and is mounted on a television, a mobile phone, a personal digital assistant, or other display device.
　配線回路基板１００の一方の面の周縁部は、接着層１２０を介してリアパネル１１０に接着される。配線回路基板１００の他方の面の周縁部は、接着層１３０を介してディスプレイ１４０に接着される。接着層１２０，１３０は、両面テープを含む。保護層１５０は、例えばカバーガラスであり、ディスプレイ１４０の表面に取り付けられる。配線回路基板１００の詳細については後述する。 The peripheral edge of one side of the printed circuit board 100 is adhered to the rear panel 110 via the adhesive layer 120. The peripheral edge of the other side of the printed circuit board 100 is adhered to the display 140 via the adhesive layer 130. Adhesive layers 120 and 130 include double-sided tape. Protective layer 150 is, for example, a cover glass and is attached to the surface of display 140. Details of the printed circuit board 100 will be described later.
　駆動回路１６０は、例えば集積回路を含む。駆動回路１６０は、配線回路基板１００上に実装されてもよい。配線回路基板１００と駆動回路１６０とは、配線１７０により電気的に接続される。配線１７０は、フレキシブル配線回路基板等の回路基板であってもよい。 The drive circuit 160 includes, for example, an integrated circuit. The drive circuit 160 may be mounted on the printed circuit board 100. The printed circuit board 100 and the drive circuit 160 are electrically connected by wiring 170. The wiring 170 may be a circuit board such as a flexible printed circuit board.
　タッチパネル２００の使用者は、指またはタッチペン（図１の例では指）でタッチパネル２００の保護層１５０を接触する。この場合、配線回路基板１００に設けられた図示しない複数の電極間の静電容量が変化する。駆動回路１６０は、配線回路基板１００の静電容量の変化を検出した場合、配線１７０を通して配線回路基板１００の後述する導体層３０に交流電流を流す。これにより、配線回路基板１００が振動する。その結果、使用者は、タッチパネル２００を接触したことを知覚することができる。 The user of the touch panel 200 touches the protective layer 150 of the touch panel 200 with a finger or a touch pen (finger in the example of FIG. 1). In this case, the capacitance between a plurality of electrodes (not shown) provided on the printed circuit board 100 changes. When the drive circuit 160 detects a change in the capacitance of the printed circuit board 100, it causes an alternating current to flow through the wiring 170 to a conductor layer 30 of the printed circuit board 100, which will be described later. This causes the printed circuit board 100 to vibrate. As a result, the user can perceive that the touch panel 200 has been touched.
　（２）配線回路基板の構成
　図２は、図１の配線回路基板１００の平面図である。図３は、図２の配線回路基板１００のＡ－Ａ線断面図である。図２および図３に示すように、配線回路基板１００は、金属支持層１０、ベース絶縁層２０、導体層３０、磁石４０およびカバー絶縁層５０を含む。なお、図２においては、カバー絶縁層５０の図示が省略されている。後述する図４等においても、カバー絶縁層５０の図示は適宜省略される。 (2) Structure of the printed circuit board FIG. 2 is a plan view of the printed circuit board 100 of FIG. 1. FIG. 3 is a cross-sectional view taken along line AA of the printed circuit board 100 of FIG. As shown in FIGS. 2 and 3, the printed circuit board 100 includes a metal support layer 10, a base insulating layer 20, a conductor layer 30, a magnet 40, and a cover insulating layer 50. Note that in FIG. 2, illustration of the cover insulating layer 50 is omitted. Also in FIG. 4 and the like described later, illustration of the cover insulating layer 50 is omitted as appropriate.
　金属支持層１０は、例えばステンレス鋼からなる。金属支持層１０は、絶縁体支持層１１および振動子１２を含む。絶縁体支持層１１は、矩形枠状を有する。平面視における絶縁体支持層１１の各辺の長さは、例えば３０ｍｍ以上５０ｍｍ以下である。使用者は、絶縁体支持層１１により取り囲まれる領域（以下、中空領域と呼ぶ。）を通して図１のリアパネル１１０を視認することができる。リアパネル１１０の視認を妨げないように、絶縁体支持層１１の幅は小さいことが好ましい。本例では、絶縁体支持層１１の幅は１８μｍである。 The metal support layer 10 is made of stainless steel, for example. Metal support layer 10 includes an insulator support layer 11 and a vibrator 12. The insulator support layer 11 has a rectangular frame shape. The length of each side of the insulator support layer 11 in plan view is, for example, 30 mm or more and 50 mm or less. The user can visually recognize the rear panel 110 in FIG. 1 through the area surrounded by the insulator support layer 11 (hereinafter referred to as a hollow area). The width of the insulator support layer 11 is preferably small so as not to obstruct the visibility of the rear panel 110. In this example, the width of the insulator support layer 11 is 18 μm.
　振動子１２は、磁石支持層１２ａおよび複数（本例では４個）の連結片１２ｂを含む。磁石支持層１２ａは、中空領域の略中央部に配置される。磁石支持層１２ａは円板形状を有するが、実施の形態はこれに限定されない。各連結片１２ｂは、蛇行形状を有し、磁石支持層１２ａと絶縁体支持層１１とを連結する。振動子１２の厚みは、絶縁体支持層１１の厚みよりも小さくてもよい。例えば、絶縁体支持層１１の厚みは１００μｍ以上１５０μｍ以下であり、振動子１２の厚みは１５μｍ以上６０μｍ以下である。 The vibrator 12 includes a magnet support layer 12a and a plurality of (four in this example) connecting pieces 12b. The magnet support layer 12a is arranged approximately at the center of the hollow region. Although the magnet support layer 12a has a disk shape, the embodiment is not limited thereto. Each connection piece 12b has a meandering shape and connects the magnet support layer 12a and the insulator support layer 11. The thickness of the vibrator 12 may be smaller than the thickness of the insulator support layer 11. For example, the thickness of the insulator support layer 11 is 100 μm or more and 150 μm or less, and the thickness of the vibrator 12 is 15 μm or more and 60 μm or less.
　ベース絶縁層２０は、例えばポリイミドからなる。ベース絶縁層２０は、絶縁体支持層１１と略同一の矩形枠状を有し、絶縁体支持層１１上に形成される。ベース絶縁層２０の厚みは、例えば５μｍ以上１０μｍ以下である。導体層３０は、例えば銅からなり、配線および電極を構成する。導体層３０における配線の一部はコイルであり、中空領域を取り囲むようにベース絶縁層２０上に形成される。コイル部分以外の導体層３０の図示は省略されている。導体層３０の厚みは、例えば５μｍ以上３０μｍ以下である。導体層３０のコイルの両端部は、ベース絶縁層２０の外方に引き出され、図１の配線１７０を介して駆動回路１６０に接続される。 The base insulating layer 20 is made of polyimide, for example. The base insulating layer 20 has substantially the same rectangular frame shape as the insulator support layer 11 and is formed on the insulator support layer 11 . The thickness of the base insulating layer 20 is, for example, 5 μm or more and 10 μm or less. The conductor layer 30 is made of copper, for example, and constitutes wiring and electrodes. A portion of the wiring in the conductor layer 30 is a coil, which is formed on the base insulating layer 20 so as to surround the hollow region. The illustration of the conductor layer 30 other than the coil portion is omitted. The thickness of the conductor layer 30 is, for example, 5 μm or more and 30 μm or less. Both ends of the coil of the conductor layer 30 are drawn out of the base insulating layer 20 and connected to the drive circuit 160 via the wiring 170 in FIG.
　磁石４０は、永久磁石であり、振動子１２の磁石支持層１２ａの一方の面に取り付けられる。図３の例では、磁石４０のＮ極が磁石支持層１２ａに取り付けられる。磁石４０は、接着層または樹脂層等の他の部材を介して間接的に磁石支持層１２ａに取り付けられてもよい。カバー絶縁層５０は、例えばポリイミドからなる。カバー絶縁層５０は、ベース絶縁層２０と略同一の矩形枠状を有し、導体層３０を覆うようにベース絶縁層２０上に形成される。カバー絶縁層５０の厚みは、例えば８μｍ以上５０μｍ以下である。 The magnet 40 is a permanent magnet and is attached to one surface of the magnet support layer 12a of the vibrator 12. In the example of FIG. 3, the north pole of the magnet 40 is attached to the magnet support layer 12a. The magnet 40 may be indirectly attached to the magnet support layer 12a via another member such as an adhesive layer or a resin layer. The cover insulating layer 50 is made of polyimide, for example. The cover insulating layer 50 has substantially the same rectangular frame shape as the base insulating layer 20 and is formed on the base insulating layer 20 so as to cover the conductor layer 30 . The thickness of the cover insulating layer 50 is, for example, 8 μm or more and 50 μm or less.
　（３）配線回路基板の動作
　図４は、図２の配線回路基板１００の動作を説明するための図である。図４上段に矢印で示すように、駆動回路１６０が配線１７０を通して配線回路基板１００の導体層３０に交流電流を流すことにより、導体層３０のコイルが電磁石化する。 (3) Operation of printed circuit board FIG. 4 is a diagram for explaining the operation of printed circuit board 100 of FIG. 2. As shown by the arrow in the upper part of FIG. 4, the drive circuit 160 causes an alternating current to flow through the conductor layer 30 of the printed circuit board 100 through the wiring 170, so that the coil of the conductor layer 30 becomes an electromagnet.
　この場合、導体層３０と磁石４０との間に磁力が発生し、導体層３０に流れる電流の方向が切り替わるごとに、磁石４０が上方に磁力を受ける図４中段の状態と、磁石４０が下方に磁力を受ける図４下段の状態とが交互に発生する。これにより、振動子１２が絶縁体支持層１１に対して上下方向に振動する。 In this case, a magnetic force is generated between the conductor layer 30 and the magnet 40, and each time the direction of the current flowing through the conductor layer 30 is switched, the magnet 40 receives the magnetic force upward, and the state shown in the middle of FIG. The state shown in the bottom row of FIG. 4, in which the magnetic force is applied to the magnetic field, occurs alternately. As a result, the vibrator 12 vibrates in the vertical direction with respect to the insulator support layer 11.
　（４）配線回路基板の製造方法
　図５～図１０は、配線回路基板１００の製造方法の一例を説明するための工程断面図である。図５～図１０は、図２の配線回路基板１００のＡ－Ａ線断面図に対応する。まず、図５に示すように、ステンレス鋼からなる矩形状の金属板１０Ａを準備し、金属板１０Ａの両面の外周縁上にマスク１０１を形成する。金属板１０Ａの材料は、ステンレス鋼に限らず、アルミニウム等の他の金属であってもよい。次に、エッチング液を用いてマスク１０１から露出する金属板１０Ａの部分に比較的短い時間だけエッチング（以下、ハーフエッチングと呼ぶ。）を行う。 (4) Method for manufacturing a printed circuit board FIGS. 5 to 10 are process cross-sectional views for explaining an example of a method for manufacturing the printed circuit board 100. 5 to 10 correspond to cross-sectional views taken along the line AA of the printed circuit board 100 in FIG. First, as shown in FIG. 5, a rectangular metal plate 10A made of stainless steel is prepared, and masks 101 are formed on the outer periphery of both sides of the metal plate 10A. The material of the metal plate 10A is not limited to stainless steel, but may be other metals such as aluminum. Next, using an etching solution, the portion of the metal plate 10A exposed from the mask 101 is etched for a relatively short period of time (hereinafter referred to as half etching).
　ハーフエッチングにより、図６に示すように、金属板１０Ａに厚肉部１０ａと、厚肉部１０ａよりも小さい厚みを有する薄肉部１０ｂとが形成される。本例では、金属板１０Ａの両面に同時にハーフエッチングが行われるが、実施の形態はこれに限定されない。金属板１０Ａの片面ずつに順次ハーフエッチングが行われてもよい。あるいは、金属板１０Ａの一方の面のみにハーフエッチングが行われ、金属板１０Ａの他方の面にハーフエッチングが行われなくてもよい。ハーフエッチングの終了後、金属板１０Ａからマスク１０１が除去される。 By half etching, as shown in FIG. 6, a thick part 10a and a thin part 10b having a smaller thickness than the thick part 10a are formed in the metal plate 10A. In this example, half etching is performed on both sides of the metal plate 10A at the same time, but the embodiment is not limited to this. Half etching may be sequentially performed on each side of the metal plate 10A. Alternatively, half etching may be performed only on one surface of the metal plate 10A, and no half etching may be performed on the other surface of the metal plate 10A. After the half etching is completed, the mask 101 is removed from the metal plate 10A.
　続いて、不要部分が露出するように金属板１０Ａに図示しないマスクを形成し、エッチング液を用いてマスクから露出する金属板１０Ａの部分にエッチング（以下、全エッチングと呼ぶ。）を行う。この場合、図７に示すように、金属板１０Ａの不要部分が除去されることにより、厚肉部１０ａが絶縁体支持層１１となり、磁石支持層１２ａと連結片１２ｂとからなる振動子１２が薄肉部１０ｂに形成される。これにより、金属支持層１０が形成される。 Next, a mask (not shown) is formed on the metal plate 10A so that unnecessary parts are exposed, and the parts of the metal plate 10A exposed from the mask are etched (hereinafter referred to as full etching) using an etching solution. In this case, as shown in FIG. 7, by removing unnecessary parts of the metal plate 10A, the thick portion 10a becomes the insulator support layer 11, and the vibrator 12 consisting of the magnet support layer 12a and the connecting piece 12b is It is formed in the thin portion 10b. Thereby, the metal support layer 10 is formed.
　本例では、金属板１０Ａにハーフエッチングが行われた後、全エッチングが行われることにより金属支持層１０が形成されるが、実施の形態はこれに限定されない。金属板１０Ａに全エッチングが行われた後、ハーフエッチングが行われることにより金属支持層１０が形成されてもよい。全エッチングの終了後、金属支持層１０からマスクが除去される。 In this example, the metal support layer 10 is formed by performing half etching on the metal plate 10A and then performing full etching, but the embodiment is not limited to this. The metal support layer 10 may be formed by performing half etching after the entire etching is performed on the metal plate 10A. After the complete etching is complete, the mask is removed from the metal support layer 10.
　その後、図８に示すように、絶縁体支持層１１の上面にベース絶縁層２０を形成する。ベース絶縁層２０は、金属支持層１０に感光性樹脂前駆体を塗布し、紫外線を用いて感光性樹脂前駆体を部分的に露光することにより形成されてもよい。本例では、ベース絶縁層２０の材料は、ポリイミドであるが、エポキシ等の他の樹脂であってもよい。 Thereafter, as shown in FIG. 8, a base insulating layer 20 is formed on the upper surface of the insulator support layer 11. The base insulating layer 20 may be formed by applying a photosensitive resin precursor to the metal support layer 10 and partially exposing the photosensitive resin precursor to ultraviolet light. In this example, the material of the base insulating layer 20 is polyimide, but it may be other resin such as epoxy.
　次に、図９に示すように、ベース絶縁層２０上に導体層３０を形成し、導体層３０を覆うようにベース絶縁層２０上にカバー絶縁層５０を形成する。導体層３０は、アディティブ法を用いて形成してもよく、セミアディティブ法を用いて形成してもよく、サブトラクティブ法等の他の方法を用いて形成してもよい。カバー絶縁層５０の形成手順は、ベース絶縁層２０の形成工程と同じ手順である。最後に、図１０に示すように、振動子１２の磁石支持層１２ａの上面に磁石４０を取り付ける。これにより、配線回路基板１００が完成する。 Next, as shown in FIG. 9, a conductor layer 30 is formed on the base insulating layer 20, and a cover insulating layer 50 is formed on the base insulating layer 20 so as to cover the conductor layer 30. The conductor layer 30 may be formed using an additive method, a semi-additive method, or another method such as a subtractive method. The procedure for forming the cover insulating layer 50 is the same as the step for forming the base insulating layer 20. Finally, as shown in FIG. 10, a magnet 40 is attached to the upper surface of the magnet support layer 12a of the vibrator 12. Thereby, the printed circuit board 100 is completed.
　（５）効果
　本実施に係る配線回路基板１００においては、金属支持層１０の一部により振動子１２が構成される。そのため、配線回路基板１００を単体でアクチュエータとして使用することができる。具体的には、導体層３０の一部がコイルを構成し、振動子１２の磁石支持層１２ａに磁石４０が取り付けられる。この場合、導体層３０の一部に電流を流すことにより、導体層３０と磁石４０との間の磁力が発生する。これにより、磁石支持層１２ａを容易にかつ効率的に振動させることができる。したがって、配線回路基板１００を容易にアクチュエータとして使用することができる。 (5) Effect In the printed circuit board 100 according to the present embodiment, the vibrator 12 is constituted by a part of the metal support layer 10. Therefore, the printed circuit board 100 can be used alone as an actuator. Specifically, a part of the conductor layer 30 constitutes a coil, and a magnet 40 is attached to the magnet support layer 12a of the vibrator 12. In this case, by passing a current through a portion of the conductor layer 30, magnetic force is generated between the conductor layer 30 and the magnet 40. Thereby, the magnet support layer 12a can be easily and efficiently vibrated. Therefore, the printed circuit board 100 can be easily used as an actuator.
　振動子１２は、配線回路基板１００の製造工程で形成可能であり、使用者は配線回路基板１００の各部品を組み立てる必要がない。そのため、高い寸法精度でアクチュエータを構成することができる。また、振動子１２を追加するための構成を配線回路基板１００に設ける必要がない。その結果、配線回路基板１００をアクチュエータとして構成しつつ、配線回路基板１００を薄型化することができる。 The vibrator 12 can be formed during the manufacturing process of the printed circuit board 100, and the user does not need to assemble each component of the printed circuit board 100. Therefore, the actuator can be constructed with high dimensional accuracy. Further, there is no need to provide a structure for adding the vibrator 12 to the printed circuit board 100. As a result, the printed circuit board 100 can be made thinner while configuring the printed circuit board 100 as an actuator.
　金属支持層１０における振動子１２の厚みは、絶縁体支持層１１の厚みよりも小さい。また、振動子１２は蛇行形状を有する。これにより、振動子１２を容易に振動可能に構成することができる。あるいは、振動子１２は渦巻形状を有してもよい。この場合、振動子１２は、渦巻バネまたは竹の子バネとして機能する。そのため、振動子１２を容易に振動可能に構成することができる。 The thickness of the vibrator 12 in the metal support layer 10 is smaller than the thickness of the insulator support layer 11. Further, the vibrator 12 has a meandering shape. Thereby, the vibrator 12 can be easily configured to vibrate. Alternatively, the vibrator 12 may have a spiral shape. In this case, the vibrator 12 functions as a spiral spring or a bamboo spring. Therefore, the vibrator 12 can be easily configured to vibrate.
　（６）変形例
　本実施の形態において、振動子１２は蛇行形状を有する４個の連結片１２ｂを含むが、実施の形態はこれに限定されない。振動子１２は４個未満の連結片１２ｂを含んでもよい。また、振動子１２が十分に振動可能である場合には、連結片１２ｂは蛇行形状を有さなくてもよい。以下、変形例に係る配線回路基板１００について、図２の配線回路基板１００と異なる点を説明する。 (6) Modification In this embodiment, the vibrator 12 includes four connecting pieces 12b having a meandering shape, but the embodiment is not limited to this. The vibrator 12 may include less than four connecting pieces 12b. Further, if the vibrator 12 is capable of sufficiently vibrating, the connecting piece 12b does not need to have a meandering shape. Hereinafter, different points from the printed circuit board 100 of FIG. 2 will be explained regarding the printed circuit board 100 according to the modified example.
　図１１は、第１の変形例に係る配線回路基板１００の平面図である。図１１に示すように、振動子１２は、磁石支持層１２ａと、１個の連結片１２ｂとを含む。本例では、磁石支持層１２ａは円板形状を有し、連結片１２ｂは帯状を有する。 FIG. 11 is a plan view of a printed circuit board 100 according to a first modification. As shown in FIG. 11, the vibrator 12 includes a magnet support layer 12a and one connection piece 12b. In this example, the magnet support layer 12a has a disk shape, and the connecting piece 12b has a belt shape.
　図１２は、図１１の配線回路基板１００の動作を説明するための図である。図１２上段に矢印で示すように、導体層３０に交流電流が流される。導体層３０に流れる電流の方向が切り替わるごとに、磁石４０が上方に磁力を受ける図１２中段の状態と、磁石４０が下方に磁力を受ける図１２下段の状態とが交互に発生する。これにより、振動子１２が絶縁体支持層１１に対して上下方向に振動する。 FIG. 12 is a diagram for explaining the operation of the printed circuit board 100 of FIG. 11. As shown by the arrow in the upper part of FIG. 12, an alternating current is passed through the conductor layer 30. Each time the direction of the current flowing through the conductor layer 30 is switched, the state shown in the middle row of FIG. 12, in which the magnet 40 receives an upward magnetic force, and the state shown in the lower row of FIG. 12, in which the magnet 40 receives a downward magnetic force, alternately occur. As a result, the vibrator 12 vibrates in the vertical direction with respect to the insulator support layer 11.
　図１３は、第２の変形例に係る配線回路基板１００の平面図である。図１３に示すように、振動子１２は、磁石支持層１２ａと、２個の連結片１２ｂを含む。本例では、磁石支持層１２ａは矩形板形状を有し、各連結片１２ｂは帯状を有する。２個の連結片１２ｂは、磁石支持層１２ａを挟んで対向する状態で、磁石支持層１２ａと絶縁体支持層１１とを連結する。 FIG. 13 is a plan view of a printed circuit board 100 according to a second modification. As shown in FIG. 13, the vibrator 12 includes a magnet support layer 12a and two connecting pieces 12b. In this example, the magnet support layer 12a has a rectangular plate shape, and each connecting piece 12b has a band shape. The two connecting pieces 12b connect the magnet support layer 12a and the insulator support layer 11 while facing each other with the magnet support layer 12a in between.
　図１４は、図１３の配線回路基板１００の動作を説明するための図である。図１４上段に矢印で示すように、導体層３０に交流電流が流される。導体層３０に流れる電流の方向が切り替わるごとに、磁石４０が上方に磁力を受ける図１４中段の状態と、磁石４０が下方に磁力を受ける図１４下段の状態とが交互に発生する。これにより、振動子１２が絶縁体支持層１１に対して上下方向に振動する。 FIG. 14 is a diagram for explaining the operation of the printed circuit board 100 of FIG. 13. As shown by the arrow in the upper part of FIG. 14, an alternating current is passed through the conductor layer 30. Each time the direction of the current flowing through the conductor layer 30 is switched, the state shown in the middle part of FIG. 14, in which the magnet 40 receives an upward magnetic force, and the state shown in the lower part of FIG. 14, in which the magnet 40 receives a downward magnetic force, alternately occur. As a result, the vibrator 12 vibrates in the vertical direction with respect to the insulator support layer 11.
　第２の変形例において、磁石４０は、磁石支持層１２ａにおいて、２個の連結片１２ｂにより挟まれる領域とは重ならない領域に取り付けられてもよい。この場合、導体層３０に電流が流れたとき、２個の連結片１２ｂを回転軸として半回転状に磁石支持層１２ａが振動する。これにより、振動子１２をより大きく振動させることができる。 In the second modification, the magnet 40 may be attached to an area of the magnet support layer 12a that does not overlap with the area sandwiched between the two connecting pieces 12b. In this case, when a current flows through the conductor layer 30, the magnet support layer 12a vibrates in a half-rotation shape about the two connecting pieces 12b as rotational axes. This allows the vibrator 12 to vibrate more greatly.
　＜２＞第２の実施の形態
　第１の実施の形態において、導体層３０の一部にコイルが形成されるが、実施の形態はこれに限定されない。金属支持層１０の一部にコイルが形成されてもよい。以下、第２の実施の形態に係る配線回路基板１００について、第１の実施の形態に係る配線回路基板１００と異なる点を説明する。 <2> Second Embodiment In the first embodiment, a coil is formed in a part of the conductor layer 30, but the embodiment is not limited to this. A coil may be formed in a part of the metal support layer 10. Hereinafter, the differences between the printed circuit board 100 according to the second embodiment and the printed circuit board 100 according to the first embodiment will be explained.
　（１）配線回路基板の構成
　図１５は、本発明の第２の実施の形態に係る配線回路基板１００の平面図である。図５に示すように、第１の実施の形態と同様に、配線回路基板１００は、金属支持層１０、ベース絶縁層２０、導体層３０、磁石４０Ａ～４０Ｄおよびカバー絶縁層５０を含む。図１５においては、カバー絶縁層５０の図示が省略されている。 (1) Configuration of printed circuit board FIG. 15 is a plan view of a printed circuit board 100 according to the second embodiment of the present invention. As shown in FIG. 5, similarly to the first embodiment, the printed circuit board 100 includes a metal support layer 10, a base insulating layer 20, a conductor layer 30, magnets 40A to 40D, and a cover insulating layer 50. In FIG. 15, illustration of the cover insulating layer 50 is omitted.
　金属支持層１０の一部は、略矩形枠状を有するコイルである。コイル部分以外の金属支持層１０の図示は省略されている。平面視における金属支持層１０におけるコイルの各辺の長さは、例えば３０ｍｍ以上５０ｍｍ以下である。本例では、金属支持層１０は、絶縁体支持層１３，１４，１５および振動子１６，１７を含む。各絶縁体支持層１３～１５は一方向に延びる帯状を有する。絶縁体支持層１４，１５は、一列に並ぶように配置された状態で絶縁体支持層１３と対向する。 A part of the metal support layer 10 is a coil having a substantially rectangular frame shape. The illustration of the metal support layer 10 other than the coil portion is omitted. The length of each side of the coil in the metal support layer 10 in plan view is, for example, 30 mm or more and 50 mm or less. In this example, metal support layer 10 includes insulator support layers 13, 14, 15 and vibrators 16, 17. Each of the insulator support layers 13 to 15 has a band shape extending in one direction. The insulator support layers 14 and 15 are arranged in a line and face the insulator support layer 13.
　各振動子１６，１７は蛇行形状を有する。振動子１６は、絶縁体支持層１３の一端部と絶縁体支持層１４の外端部とを連結する。振動子１７は、絶縁体支持層１３の他端部と絶縁体支持層１５の外端部とを連結する。各振動子１６，１７の厚みは、各絶縁体支持層１３～１５の厚みよりも小さくてもよい。また、各振動子１６，１７が十分に振動可能である場合には、各振動子１６，１７は蛇行形状を有さなくてもよい。 Each vibrator 16, 17 has a meandering shape. The vibrator 16 connects one end of the insulator support layer 13 and the outer end of the insulator support layer 14 . The vibrator 17 connects the other end of the insulator support layer 13 and the outer end of the insulator support layer 15 . The thickness of each vibrator 16, 17 may be smaller than the thickness of each insulator support layer 13-15. Furthermore, if each of the vibrators 16 and 17 can sufficiently vibrate, each of the vibrators 16 and 17 does not need to have a meandering shape.
　ベース絶縁層２０は、例えばポリエステル、アクリル、ポリプロピレン、ポリスチレン、セルロースまたはシクロオレフィンポリマ等の透明樹脂からなる。ベース絶縁層２０は、金属支持層１０の振動子１６，１７にそれぞれ対応する開口部２１，２２を有し、金属支持層１０の絶縁体支持層１１上に形成される。振動子１６，１７は、開口部２１，２２内でそれぞれ露出する。 The base insulating layer 20 is made of a transparent resin such as polyester, acrylic, polypropylene, polystyrene, cellulose, or cycloolefin polymer. The base insulating layer 20 has openings 21 and 22 corresponding to the vibrators 16 and 17 of the metal support layer 10, respectively, and is formed on the insulator support layer 11 of the metal support layer 10. Vibrators 16 and 17 are exposed within openings 21 and 22, respectively.
　ベース絶縁層２０は、ポリイミド等の不透明樹脂により形成されてもよい。この場合、図１５に一点鎖線で示すように、ベース絶縁層２０の中央領域に図１のリアパネル１１０を視認するための開口部２３が形成される。ベース絶縁層２０が透明樹脂により形成される場合でも、リアパネル１１０の視認性を向上させるために、ベース絶縁層２０に開口部２３が形成されてもよい。一方で、配線回路基板１００に透光性が要求されない場合には、ベース絶縁層２０の材料に関わらず、ベース絶縁層２０に開口部２３が形成されなくてもよい。 The base insulating layer 20 may be formed of an opaque resin such as polyimide. In this case, as shown by the dashed line in FIG. 15, an opening 23 for viewing the rear panel 110 of FIG. 1 is formed in the central region of the base insulating layer 20. Even when the base insulating layer 20 is formed of transparent resin, the opening 23 may be formed in the base insulating layer 20 in order to improve the visibility of the rear panel 110. On the other hand, if the printed circuit board 100 is not required to have translucency, the opening 23 may not be formed in the base insulating layer 20 regardless of the material of the base insulating layer 20.
　導体層３０は、互いに電気的に分離された２つの電極３１，３２を含み、ベース絶縁層２０上に形成される。電極３１，３２以外の導体層３０の図示は省略されている。電極３１は、ベース絶縁層２０を貫通して絶縁体支持層１４の内端部に接続される。電極３２は、ベース絶縁層２０を貫通して絶縁体支持層１５の内端部に接続される。また、電極３１，３２は、図１の配線１７０を介して駆動回路１６０に接続される。 The conductor layer 30 includes two electrodes 31 and 32 that are electrically isolated from each other, and is formed on the base insulating layer 20. Illustration of the conductor layer 30 other than the electrodes 31 and 32 is omitted. Electrode 31 penetrates base insulating layer 20 and is connected to the inner end of insulator support layer 14 . Electrode 32 penetrates base insulating layer 20 and is connected to the inner end of insulator support layer 15 . Further, the electrodes 31 and 32 are connected to the drive circuit 160 via the wiring 170 in FIG.
　磁石４０Ａ～４０Ｄは、振動子１６，１７から所定距離だけ離間した位置に複数取り付けられる。磁石４０は、振動子１６，１７以外の任意の部分に取り付けられてもよい。また、一部の磁石４０はコイルの内側に取り付けられ、他の磁石４０はコイルの外側に取り付けられてもよい。 A plurality of magnets 40A to 40D are attached at positions spaced apart from the vibrators 16 and 17 by a predetermined distance. The magnet 40 may be attached to any part other than the vibrators 16 and 17. Also, some of the magnets 40 may be attached to the inside of the coil, and other magnets 40 may be attached to the outside of the coil.
　本例では、４個の磁石４０Ａ～４０Ｄがベース絶縁層２０上に取り付けられる。磁石４０Ａと磁石４０Ｂとは、振動子１６の近傍に位置し、振動子１６を挟んで対向する。磁石４０Ｃと磁石４０Ｄとは、振動子１７の近傍に位置し、振動子１７を挟んで対向する。全ての磁石４０Ａ～４０Ｄの極性の向きは同一である。図１５の例では、各磁石４０Ａ～４０ＤのＳ極が紙面左方を向き、Ｎ極が紙面右方を向いている。 In this example, four magnets 40A to 40D are mounted on the base insulating layer 20. Magnet 40A and magnet 40B are located near vibrator 16 and face each other with vibrator 16 in between. Magnet 40C and magnet 40D are located near vibrator 17 and face each other with vibrator 17 in between. The polarity directions of all magnets 40A to 40D are the same. In the example of FIG. 15, the S pole of each magnet 40A to 40D faces to the left in the paper, and the N pole faces to the right in the paper.
　（２）配線回路基板の構成
　図１６は、図１５の配線回路基板１００の動作を説明するための図である。図１６上段に矢印で示すように、図１の駆動回路１６０が配線１７０および図１５の導体層３０の電極３１，３２を通して配線回路基板１００の配線回路基板１００に交流電流を流すことにより、金属支持層１０のコイルが電磁石化する。 (2) Structure of the printed circuit board FIG. 16 is a diagram for explaining the operation of the printed circuit board 100 of FIG. 15. As shown by the arrow in the upper part of FIG. 16, the drive circuit 160 in FIG. The coil of the support layer 10 becomes an electromagnet.
　この場合、振動子１６と磁石４０Ａ，４０Ｂとの間に磁力が発生するとともに、振動子１７と磁石４０Ｃ，４０Ｄとの間に磁力が発生する。金属支持層１０に流れる電流の方向が切り替わるごとに、振動子１６が上方に磁力を受け、振動子１７が下方に磁力を受ける図１６中段の状態と、振動子１６が下方に磁力を受け、振動子１７が上方に磁力を受ける図１６下段の状態とが交互に発生する。これにより、振動子１６，１７が絶縁体支持層１３～１５に対して上下方向に振動する。 In this case, a magnetic force is generated between the vibrator 16 and the magnets 40A, 40B, and a magnetic force is generated between the vibrator 17 and the magnets 40C, 40D. Each time the direction of the current flowing through the metal support layer 10 is switched, the vibrator 16 receives an upward magnetic force and the vibrator 17 receives a downward magnetic force. The state shown in the lower part of FIG. 16, in which the vibrator 17 receives an upward magnetic force, occurs alternately. As a result, the vibrators 16 and 17 vibrate in the vertical direction with respect to the insulator support layers 13 to 15.
　（３）配線回路基板の製造方法
　本実施の形態における絶縁体支持層１３～１５の製造方法は、第１の実施の形態における絶縁体支持層１１の製造方法と同様である。また、本実施の形態における振動子１６，１７の製造方法は、第１の実施の形態における振動子１２の製造方法と同様である。したがって、本実施の形態に係る配線回路基板１００の製造方法は、ベース絶縁層２０を通して導体層３０と金属支持層１０とを電気的に接続する工程が追加される点を除いて、第１の実施の形態に係る配線回路基板１００の製造方法と同様である。 (3) Method for manufacturing wired circuit board The method for manufacturing the insulator support layers 13 to 15 in this embodiment is the same as the method for manufacturing the insulator support layer 11 in the first embodiment. Furthermore, the method for manufacturing the vibrators 16 and 17 in this embodiment is the same as the method for manufacturing the vibrator 12 in the first embodiment. Therefore, the method for manufacturing the printed circuit board 100 according to the present embodiment is the same as the first one, except that a step of electrically connecting the conductor layer 30 and the metal support layer 10 through the base insulating layer 20 is added. This method is similar to the method for manufacturing printed circuit board 100 according to the embodiment.
　（４）効果
　本実施の形態に係る配線回路基板１００においては、金属支持層１０がコイルを形成し、振動子１６，１７はコイルの一部となる。振動子１６から所定距離だけ離間した位置に磁石４０Ａ，４０Ｂが取り付けられる。振動子１７から所定距離だけ離間した位置に磁石４０Ｃ，４０Ｄが取り付けられる。 (4) Effects In the printed circuit board 100 according to the present embodiment, the metal support layer 10 forms a coil, and the vibrators 16 and 17 become part of the coil. Magnets 40A and 40B are attached to positions spaced apart from the vibrator 16 by a predetermined distance. Magnets 40C and 40D are attached to positions spaced apart from the vibrator 17 by a predetermined distance.
　この場合、金属支持層１０に電流を流すことにより、振動子１６と磁石４０Ａ，４０Ｂとの間に磁力が発生し、振動子１７と磁石４０Ｃ，４０Ｄとの間に磁力が発生する。これにより、振動子１６，１７を容易に振動させることができる。その結果、配線回路基板１００を容易にアクチュエータとして使用することができる。 In this case, by passing a current through the metal support layer 10, a magnetic force is generated between the vibrator 16 and the magnets 40A, 40B, and a magnetic force is generated between the vibrator 17 and the magnets 40C, 40D. Thereby, the vibrators 16 and 17 can be easily vibrated. As a result, printed circuit board 100 can be easily used as an actuator.
　（５）変形例
　本実施の形態において、金属支持層１０の絶縁体支持層１４，１５は導体層３０の電極３１，３２を介して配線１７０に接続されるが、実施の形態はこれに限定されない。金属支持層１０の絶縁体支持層１４，１５は、導体層３０の電極３１，３２を介さずに配線１７０に直接接続されてもよい。 (5) Modification In this embodiment, the insulator support layers 14 and 15 of the metal support layer 10 are connected to the wiring 170 via the electrodes 31 and 32 of the conductor layer 30, but the embodiment is limited to this. Not done. The insulator support layers 14 and 15 of the metal support layer 10 may be directly connected to the wiring 170 without using the electrodes 31 and 32 of the conductor layer 30.
　＜３＞他の実施の形態
　（１）上記実施の形態において、振動子１２，１６，１７の厚みは絶縁体支持層１１，１３～１５の厚みよりも小さいが、実施の形態はこれに限定されない。振動子１２，１６，１７が十分に振動可能である場合には、振動子１２，１６，１７の厚みは絶縁体支持層１１，１３～１５の厚みと等しくてもよい。したがって、配線回路基板１００の製造工程において、図５および図６のハーフエッチングが行われなくてもよい。 <3> Other embodiments (1) In the above embodiments, the thickness of the vibrators 12, 16, 17 is smaller than the thickness of the insulator support layers 11, 13 to 15, but the embodiments are limited to this. Not done. When the vibrators 12, 16, 17 can vibrate sufficiently, the thickness of the vibrators 12, 16, 17 may be equal to the thickness of the insulator support layers 11, 13-15. Therefore, in the manufacturing process of printed circuit board 100, the half etching shown in FIGS. 5 and 6 does not need to be performed.
　（２）上記実施の形態において、導体層３０または金属支持層１０は１回巻のコイルとして形成されるが、実施の形態はこれに限定されない。導体層３０または金属支持層１０は、複数回巻のコイルとして形成されてもよい。この場合において、コイルは、同一平面上で同心状に引き回されてもよいし、配線回路基板１００の厚み方向に積層されてもよい。 (2) In the above embodiments, the conductor layer 30 or the metal support layer 10 is formed as a one-turn coil, but the embodiments are not limited to this. The conductor layer 30 or the metal support layer 10 may be formed as a coil with multiple turns. In this case, the coils may be concentrically routed on the same plane, or may be stacked in the thickness direction of printed circuit board 100.
　（３）上記実施の形態において、配線回路基板１００は磁石４０を含むが、実施の形態はこれに限定されない。配線回路基板１００は、磁石４０を取り付け可能な磁石取付部を有すればよく、磁石４０を含まなくてもよい。この場合、磁石取付部に磁石４０が取り付けられることにより、配線回路基板１００をアクチュエータとして使用することができる。なお、第１の実施の形態では、振動子１２の磁石支持層１２ａが磁石取付部である。第２の実施の形態では、振動子１６，１７に近接するベース絶縁層２０の部分が磁石取付部である。 (3) In the above embodiment, the printed circuit board 100 includes the magnet 40, but the embodiment is not limited to this. The printed circuit board 100 only needs to have a magnet attachment part to which the magnet 40 can be attached, and does not need to include the magnet 40. In this case, by attaching the magnet 40 to the magnet attachment part, the printed circuit board 100 can be used as an actuator. Note that in the first embodiment, the magnet support layer 12a of the vibrator 12 is the magnet attachment part. In the second embodiment, a portion of the base insulating layer 20 close to the vibrators 16 and 17 is a magnet attachment portion.

Claims (8)

  1. 金属支持層と、
    　前記金属支持層上に配置される絶縁層と、
    　前記絶縁層上に配置される導体層とを備え、
    　前記金属支持層の一部は振動子を構成する、配線回路基板。     a metal support layer;
    an insulating layer disposed on the metal support layer;
    a conductor layer disposed on the insulating layer,
    A printed circuit board, in which a part of the metal support layer constitutes a vibrator.
  2. 前記振動子の厚みは、前記金属支持層における前記振動子とは異なる部分の厚みよりも小さい、請求項１記載の配線回路基板。 The printed circuit board according to claim 1, wherein the thickness of the vibrator is smaller than the thickness of a portion of the metal support layer that is different from the vibrator.
  3. 前記振動子は蛇行形状または螺旋形状を有する、請求項１または２記載の配線回路基板。 3. The printed circuit board according to claim 1, wherein the vibrator has a meandering shape or a spiral shape.
  4. 前記導体層の一部はコイルを構成する、請求項１～３のいずれか一項に記載の配線回路基板。 The printed circuit board according to claim 1, wherein a portion of the conductor layer constitutes a coil.
  5. 前記振動子に磁石が取り付けられる、請求項４記載の配線回路基板。 The printed circuit board according to claim 4, wherein a magnet is attached to the vibrator.
  6. 前記振動子は、
    　前記磁石が取り付けられる磁石支持層と、
    　前記磁石支持層と前記金属支持層における前記振動子とは異なる部分とを連結する連結片とを含む、請求項５記載の配線回路基板。     The vibrator is
    a magnet support layer to which the magnet is attached;
    The printed circuit board according to claim 5, further comprising a connecting piece that connects the magnet support layer and a portion of the metal support layer that is different from the vibrator.
  7. 前記振動子はコイルを形成する、請求項１～３のいずれか一項に記載の配線回路基板。 The printed circuit board according to claim 1, wherein the vibrator forms a coil.
  8. 前記振動子から所定距離だけ離間した位置に磁石が取り付けられる、請求項７記載の配線回路基板。 The printed circuit board according to claim 7, wherein a magnet is attached at a position spaced apart from the vibrator by a predetermined distance.
PCT/JP2023/008415 2022-03-18 2023-03-06 Wiring circuit substrate WO2023176563A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022-044550 2022-03-18
JP2022044550A JP2023138058A (en) 2022-03-18 2022-03-18 Wiring circuit substrate

Publications (1)

Publication Number Publication Date
WO2023176563A1 true WO2023176563A1 (en) 2023-09-21

Family

ID=88023063

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2023/008415 WO2023176563A1 (en) 2022-03-18 2023-03-06 Wiring circuit substrate

Country Status (2)

Country Link
JP (1) JP2023138058A (en)
WO (1) WO2023176563A1 (en)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004252337A (en) * 2003-02-21 2004-09-09 Denso Corp Optical scanner and method of manufacturing the same
JP2010288435A (en) * 2009-05-11 2010-12-24 Mitsumi Electric Co Ltd Actuator and optical scanning device using the same
US20120197442A1 (en) * 2011-01-26 2012-08-02 University Of Florida Research Foundation Inc. Method and apparatus for improving shock resistance of mems structures
JP2012176450A (en) * 2011-02-25 2012-09-13 Nippon Signal Co Ltd:The Planar actuator and method of manufacturing the same
JP2013156487A (en) * 2012-01-31 2013-08-15 Seiko Epson Corp Mirror device, method for manufacturing mirror device, optical scanner and image forming apparatus
JP2014063152A (en) * 2012-08-27 2014-04-10 Canon Electronics Inc Rocking element, actuator device, optical scanner, metallic thin film body, and method for producing optical scanner

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004252337A (en) * 2003-02-21 2004-09-09 Denso Corp Optical scanner and method of manufacturing the same
JP2010288435A (en) * 2009-05-11 2010-12-24 Mitsumi Electric Co Ltd Actuator and optical scanning device using the same
US20120197442A1 (en) * 2011-01-26 2012-08-02 University Of Florida Research Foundation Inc. Method and apparatus for improving shock resistance of mems structures
JP2012176450A (en) * 2011-02-25 2012-09-13 Nippon Signal Co Ltd:The Planar actuator and method of manufacturing the same
JP2013156487A (en) * 2012-01-31 2013-08-15 Seiko Epson Corp Mirror device, method for manufacturing mirror device, optical scanner and image forming apparatus
JP2014063152A (en) * 2012-08-27 2014-04-10 Canon Electronics Inc Rocking element, actuator device, optical scanner, metallic thin film body, and method for producing optical scanner

Also Published As

Publication number Publication date
JP2023138058A (en) 2023-09-29

Similar Documents

Publication Publication Date Title
JP5570640B2 (en) Piezoelectric element and electronic device
RU2451324C2 (en) Haptic response apparatus for electronic device
US10496173B2 (en) Manipulation feeling imparting input device
US20070046642A1 (en) Touch panel having a speaker function
US10126819B2 (en) Vibration generating device and manipulation feeling imparting input device using the vibration generating device
JP2010157037A (en) Panel member having oscillating element
JP2005275632A (en) Input panel and input device
US9313578B2 (en) Sensor device integrated with ultrasonic transducer and microphone and manufacturing method thereof
US9558875B1 (en) Electronic device with signal line routing to minimize vibrations
WO2019001068A1 (en) Flexible touch-control screen and method for manufacturing same
WO2014046160A1 (en) Touch panel, and touch panel production method
KR20150103612A (en) Digitizer
CN102637086A (en) Touch panel
JP2004334740A (en) Coordinate input device
WO2023176563A1 (en) Wiring circuit substrate
US10468956B2 (en) Electrical component with moving mass and flexible cables
TW201535195A (en) Three-dimensional shape touch panel, method of driving touch panel, and method of calibrating touch panel
JP2016164694A (en) Touch sensor and manufacturing method therefor
KR20140133413A (en) Touch Sensor and Electronic Device having the same
KR20110127930A (en) Transparent electromagnet film and thin film speaker device by using the same film
KR20090011668A (en) Pointing device and electronic device having the same
JP2009118075A (en) Planar speaker
JP2009117889A (en) Planar speaker
KR20110117737A (en) Film speaker device by using transparent electro-magnet
JP2017076187A (en) Method for producing metal pattern substrate, metal pattern substrate, and display device with touch position detection function

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 23770519

Country of ref document: EP

Kind code of ref document: A1