WO2023173869A1 - Display device - Google Patents

Display device Download PDF

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Publication number
WO2023173869A1
WO2023173869A1 PCT/CN2022/140805 CN2022140805W WO2023173869A1 WO 2023173869 A1 WO2023173869 A1 WO 2023173869A1 CN 2022140805 W CN2022140805 W CN 2022140805W WO 2023173869 A1 WO2023173869 A1 WO 2023173869A1
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WO
WIPO (PCT)
Prior art keywords
light
circuit board
display device
light source
edge
Prior art date
Application number
PCT/CN2022/140805
Other languages
French (fr)
Chinese (zh)
Inventor
张继兵
孔孟菲
王志平
张玉庆
孙璐
文喜平
王硕
郭媛
刘萍萍
Original Assignee
海信视像科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN202210269950.9A external-priority patent/CN116794879A/en
Priority claimed from CN202220676696.XU external-priority patent/CN217386062U/en
Application filed by 海信视像科技股份有限公司 filed Critical 海信视像科技股份有限公司
Publication of WO2023173869A1 publication Critical patent/WO2023173869A1/en

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    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1335Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336Illuminating devices

Definitions

  • the present application relates to the field of display technology, and in particular, to a display device.
  • mini LED backlight solutions mainly include POB (Package on Board) and COB (Chip on Board). Since COB does not require the SMD (Surface Mounted Devices) packaging step in POB, the cost of a single LED is relatively high. Low and cost advantage, therefore, more and more backlight solutions choose COB solutions.
  • POB Package on Board
  • COB Chip on Board
  • the short side size of mini LED chips must be less than 300 ⁇ m, that is, less than 11.8 mils. Due to the smaller size of mini LED chips, the power of a single chip is lower. Compared with the currently commonly used LED chips with a size of 25mil, the same luminous flux requires more mini LED chips; and because the chips used in COB do not have SMD packages, they emit light by themselves. The angle (referring to the light-emitting angle of the main light-emitting surface) is small. In order to ensure the display effect of the subjective picture, the spacing between adjacent mini LED chips needs to be small. Therefore, in order to support the small spacing arrangement of mini LEDs, lamps need to be used. The form of the board (as shown in Figure 1) increases the usage of PCB, which in turn leads to higher design costs of the backlight module.
  • Some embodiments of the present application provide a display device, including a backlight module and a display panel, and the display panel is located on the light emitting side of the backlight module.
  • the backlight module includes a diffusion plate and a light bar.
  • the light bar is located on one side of the light incident surface of the diffusion plate.
  • the light bar includes a circuit board, multiple light sources and multiple optical lenses.
  • the circuit board is in a strip shape and has a bearing surface located on a side of the circuit board close to the light incident surface of the diffuser plate.
  • a plurality of light-emitting sources are arranged on the carrying surface of the circuit board, and the plurality of light-emitting sources are arranged at intervals along the extension direction of the circuit board; the light-emitting sources include a plurality of micro-light-emitting diode LED chips, and the plurality of micro-LED chips are electrically connected to the circuit board.
  • a plurality of optical lenses are arranged on a side of the circuit board close to the light incident surface of the diffusion plate.
  • An optical lens cover is arranged on a light source. The optical lens is used to scatter light emitted from the light source.
  • the light bar further includes: a plurality of light guide brackets, which are arranged on the bearing surface of the circuit board; the light guide bracket is provided with a first through hole penetrating the light guide bracket, and a light source is located on one of the light guide brackets.
  • the inner wall of the first through hole is a reflective surface, and the reflective surface is used to reflect at least part of the light from the light source to the optical lens.
  • the light bar further includes: a plate-like structure disposed on the bearing surface of the circuit board; the plate-like structure is provided with a plurality of second through holes penetrating the plate-like structure, and a light source is located on a plate-like structure In the second through hole, the inner wall of the second through hole is a reflective surface, and the reflective surface is used to reflect at least part of the light from the light source to the optical lens.
  • the circuit board is provided with multiple grooves, a light source is disposed on the bottom wall of one groove, and the side walls of the groove are reflective surfaces, and the reflective surfaces are used to reflect at least part of the light from the light source to optical lens.
  • the carrying surface of the circuit board is parallel to the diffuser plate.
  • the edge of the reflective surface close to the light incident surface of the diffusion plate is the first edge, and the distance between each point on the first edge and the bearing surface of the circuit board is the same.
  • the edge of the reflective surface away from the light incident surface of the diffusion plate is the second edge; the distance between the two largest points on the first edge is greater than the distance between the two largest points on the second edge.
  • the reflective surface is a curved surface of revolution
  • the rotation axis of the curved surface of revolution is perpendicular to the bearing surface of the circuit board
  • the generatrix of the curved surface of revolution is a straight line or an arc.
  • the diameter of the first edge is R1, and R1 satisfies the following formula: R1 ⁇ 3.466 ⁇ H+R2.
  • R2 is the diameter of the second edge
  • H is the distance between each point on the first edge and the bearing surface of the circuit board.
  • the distance between each point on the first edge of the reflective surface and the bearing surface is greater than the height of the light source.
  • the light source includes at least two micro LED chips, and each of the micro LED chips is independently controlled;
  • the plurality of micro LED chips in the light source are symmetrically arranged.
  • one said light source includes four said micro LED chips.
  • four of the micro LED chips are arranged in two rows and two columns.
  • the light-emitting sources are arranged in an array on the circuit board, and the circuit board and the light-emitting sources constitute a light panel.
  • the backlight module further includes:
  • An optical film is located on the side of the diffusion plate facing away from the light source.
  • Figure 1 is a schematic diagram of a light source of a backlight module in the related art
  • Figure 2 is a schematic structural diagram of a display device provided by an embodiment of the present application.
  • Figure 3 is a schematic structural diagram of a backlight module provided by an embodiment of the present application.
  • Figure 4 is a schematic structural diagram of a light bar provided by an embodiment of the present application.
  • Figure 5 is a schematic structural diagram of a backlight module provided by an embodiment of the present application.
  • FIG. 6 is a schematic diagram of an SMD lamp bead in the related art
  • Figure 7 is a schematic structural diagram of a light source in the related art
  • Figure 8 is an enlarged view of point A in Figure 4.
  • Figure 9 is a schematic structural diagram of another light bar provided by an embodiment of the present application.
  • Figure 10 is an enlarged view of B in Figure 9;
  • Figure 11 is a schematic structural diagram of another light bar provided by an embodiment of the present application.
  • Figure 12 is an enlarged view of C in Figure 11;
  • Figure 13 is a top view of the structure shown in Figure 8 (hidden optical lens);
  • Figure 14 is a top view of the structure shown in Figure 10;
  • Figure 15 is a schematic diagram of the light propagation path of the light bar provided by the embodiment of the present application.
  • Figure 16 is a schematic diagram of the light propagation path of another light bar provided by an embodiment of the present application.
  • Figure 17 is a schematic partial structural diagram of a light bar provided by an embodiment of the present application.
  • Figure 18 is a schematic structural diagram of another display device provided by an embodiment of the present application.
  • Figure 19 is a schematic cross-sectional structural diagram of a backlight module provided by an embodiment of the present application.
  • Figure 20 is a schematic plan view of a light source in the related art
  • Figure 21 is a schematic diagram of partitioning in related technologies
  • Figure 22 is one of the planar structural schematic diagrams of the backlight provided by the embodiment of the present application.
  • Figure 23 is a schematic structural diagram of a light source provided by an embodiment of the present application.
  • Figure 24 is the second schematic plan view of the backlight provided by the embodiment of the present application.
  • FIG. 25 is a third schematic diagram of the planar structure of the backlight provided by the embodiment of the present application.
  • connection should be understood in a broad sense.
  • it can be a fixed connection or a detachable connection.
  • Connected, or connected integrally for those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood on a case-by-case basis.
  • some embodiments of the present application provide a display device 300 , including a backlight module 100 and a display panel 200 .
  • the backlight module 100 is used to provide backlight.
  • the backlight module 100 converts commonly used point or linear light sources into high-brightness and uniform surface light sources through a simple and effective structure. That is, the backlight module 100 can emit light evenly throughout the entire light-emitting surface, and is used to provide light for the display panel 200 Provide sufficient brightness and evenly distributed light so that the display panel 200 can display images normally. Based on this, the display panel 200 is located on the light emitting side of the backlight module 100 for image display.
  • the display panel 200 has a plurality of pixel units arranged in an array.
  • Each pixel unit can independently control the transmittance and color of the light incident on the pixel unit by the backlight module 100, so that the light transmitted by all the pixel units constitutes displayed image.
  • the above-mentioned display device 300 can be a display device such as an LCD screen, an LCD monitor, an LCD TV, etc., or it can be a mobile terminal such as a mobile phone, a tablet computer, or a smart photo album.
  • the display device 300 uses the backlight module 100 to provide backlight, and the display panel 200 modulates the light emitted by the backlight module to achieve image display.
  • the backlight module in the embodiment of the present application adopts a direct-type backlight module, which is used to emit light evenly within the entire light-emitting surface, providing the display panel with sufficient brightness and evenly distributed light, so that the display panel can display images normally.
  • the display panel 200 is located on the light emitting side of the backlight module 100, and the shape and size of the display panel usually match the backlight module.
  • the display panel 200 can be configured as a rectangle, including the sky side, the ground side, the left side and the right side, where the sky side and the ground side are opposite, the left side and the right side are opposite, and the sky side is respectively connected to one end and right side of the left side.
  • the ground side is connected to the other end on the left side and the other end on the right side respectively.
  • the display panel 200 is a transmissive display panel that can modulate the transmittance of light but does not emit light itself.
  • the display panel 200 has a plurality of pixel units arranged in an array. Each pixel unit can independently control the transmittance and color of the light incident on the pixel unit by the backlight module 100, so that the light transmitted by all the pixel units constitutes displayed image.
  • some embodiments of the present application provide the above-mentioned backlight module 100, which includes a diffusion plate 1 and a light bar 2.
  • the light bar 2 is located on one side of the light incident surface of the diffusion plate 1.
  • the above-mentioned diffusion plate 1 is used to refract, reflect and scatter the light emitted from the light bar 2, thereby increasing the light uniformity of the light source; the diffusion plate 1 is also used to form a heat-insulating and heat-resistant barrier between the light bar 2 and the display panel 200. plate.
  • the diffusion plate 1 can be in a translucent (milky white) shape, and can be made by mixing additives with different refractive index into a transparent base material, where the function of the additives is to reflect and refract the light emitted by the light bar.
  • the backlight module 100 may further include an optical film 3 , and the optical film 3 is located between the diffuser plate 1 and the display panel 200 .
  • the optical film 3 may include a first diffusion sheet, a brightness enhancement film and a second diffusion sheet stacked in a direction close to the display panel 200 , where the first diffusion sheet is used to homogenize the light emitted from the diffusion plate 1 , thereby increasing the The bright film is used to increase the brightness of light, and the second diffusion sheet is used to protect the display panel 200 from being scratched by external objects such as the backlight module 100 .
  • the backlight module 100 also includes an optical film 3
  • the diffusion plate 1 is also used to provide mechanical support for the optical film 3 .
  • the above-mentioned light bar 2 includes a circuit board 201, a plurality of light sources 202 and a plurality of optical lenses 203.
  • the circuit board 201 is in a strip shape and has a bearing surface 2011 .
  • the bearing surface 2011 is located on the side of the circuit board 201 close to the light incident surface of the diffuser plate 1 .
  • the circuit board 201 is used to carry and support the light source 202 and the optical lens 203, and to provide driving electrical signals for the light source 202.
  • the circuit board 201 may be a PCB (Printed Circuit Board).
  • the circuit board 201 may include a substrate, a circuit layer and an insulating layer sequentially arranged in a direction close to the diffusion plate 1.
  • the substrate may be an aluminum substrate.
  • the surface facing the diffuser plate 1 is the bearing surface 2011.
  • the circuit layer can be made of metallic copper, and a circuit can be formed through an etching process to drive the light source 202 to emit light.
  • the insulating layer exposes the parts (such as soldering pads) of the circuit layer used for electrical connection with the light source 202 and covers the remaining parts to protect the circuit layer.
  • the insulating layer may be formed by coating a material with reflective properties on the surface of the circuit board 201 , and the insulating layer also has a reflective effect.
  • the insulating layer can be made of white oil or other materials, which can not only protect and insulate the circuit board 201, but also serve as a reflective coating to reflect the light emitted from the light source 202 to the circuit board 201, thereby improving the efficiency of the light source. utilization efficiency.
  • the plurality of light-emitting sources 202 are disposed on the carrying surface 2011 of the circuit board 201 , and the plurality of light-emitting sources 202 are arranged at intervals along the extension direction of the circuit board 201 .
  • the light source 202 includes a plurality of micro light emitting diode LED chips 2021, and the plurality of micro LED chips 2021 are electrically connected to the circuit board 201.
  • the micro LED chip 2021 can be welded on the exposed pad of the circuit board 201 through SMT (Surface Mounted Technology). After welding, the micro LED chip 2021 can be controlled by controlling the driving signal of the circuit board 201. glow.
  • the micro LED chip 2021 can be a mini-LED chip.
  • the size of the micro LED chip can be 0.54mm ⁇ 0.24mm ⁇ 0.15mm
  • the light source 202 is a group composed of multiple mini-LED chips.
  • the sides of the adjacent micro LED chips 2021 can be approximately fit together, and the space between the two micro LED chips 2021 Just leave the necessary installation space (the gap between the pads) to make the light beam emitted by the light source 202 more concentrated.
  • the same number of micro LED chips 2021 can be replaced by strip-shaped circuit boards. circuit board, saving the usage of the circuit board and reducing the cost of the backlight module 100.
  • the number of light bars 2 in the backlight module 100 is multiple, and they are equally spaced in the backlight module 100 to ensure the display effect of the display panel 200 .
  • the backlight module 100 can be partitioned, and one light source 202 is a zone.
  • the multiple micro LED chips 2021 in one light source 202 can all be connected in series, or the multiple micro LED chips 2021 can also be divided into parallel ones. There are several groups, and the micro LED chips in each group are connected in series. In this way, the micro LED chips 2021 in each partition of the backlight module 100 can be independently regionally dimmed, thereby achieving more refined dynamic control and improving the dynamic contrast of the display.
  • the above-mentioned multiple micro LED chips 2021 are mounted together to form a group.
  • the design of the light bar saves the usage of the circuit board 201, but
  • the distance between two adjacent light-emitting sources 202 becomes larger, so that the overlapping area of the light spots incident on the diffusion plate 1 from the two light-emitting sources 202 becomes smaller.
  • the light emitted from the light-emitting sources 202 cannot be obtained when it reaches the diffusion plate 1.
  • the light is fully mixed, thus affecting the display effect of the image on the display panel 200 .
  • a plurality of optical lenses 203 are disposed on the side of the circuit board 201 close to the light incident surface of the diffuser plate 1 .
  • An optical lens 203 is mounted on a light source 202, and the optical lens 203 is used to scatter the light emitted from the light source 201.
  • the divergence angle of the light emitted by the light source 202 can be increased, so that the overlapping area of the light spots incident on the diffuser plate 1 from the two adjacent light sources 202 is increased, so that the light beam emitted by the light source 202 reaches the diffuser plate 1
  • the mixture is fully mixed to ensure the display effect of the picture on the display panel 200.
  • the optical lens 203 may be a refractive optical lens.
  • the refractive optical lens has an accommodation cavity on the side facing the light source 202 .
  • the light source 202 is located in the orthographic projection area of the accommodation cavity on the circuit board 201 .
  • the optical lens 203 may have a centrally symmetrical shape, so that the light rays emitted from the light source 202 in various directions can be homogenized.
  • the optical lens 203 can be bonded to the circuit board 201 through a bracket.
  • the backlight module 100 disposes multiple micro LED chips 2021 on the carrying surface 2011 of the circuit board 201 and is electrically connected to the circuit board 201 to form a group of light sources 202.
  • the light sources 202 are arranged at intervals on the circuit board 201 in sequence. Therefore, while ensuring the luminous flux, compared to arranging multiple micro LED chips 2021 evenly on the entire circuit board 201, the phase difference can be increased.
  • the arrangement spacing between two adjacent light sources 202 allows the circuit board 201 to be in a strip shape to form the light bar 2, and the plurality of light bars 2 are spaced apart and arranged side by side to form the light source of the backlight module 100. In this way, the usage of the circuit board 201 can be reduced, and the cost of the backlight module 100 can be reduced, thereby reducing the cost of the display device 300 .
  • the divergence angle of the light emitted from the light-emitting source 202 can be increased to ensure that the light emitted from two adjacent light-emitting sources 202 reaches the diffusion plate. 1 time mixed light effect, thereby ensuring the visual effect displayed by the display device 300, thereby ensuring the reliability of the display device 300 while reducing costs.
  • the conventional SMD lamp bead 202a has a packaging bracket 2021a. Therefore, the lamp bead 202a only emits light from one side of the light emitting surface 2022a. Therefore, when the optical lens 203 is covered on the lamp bead 202a, the light emitted from the lamp bead 202a All light can enter the optical lens 203 (as shown in Figure 7). Since the micro LED chip 2021 using the COB design scheme is not SMD packaged, the light source 202 has the characteristics of five-sided light emitting. The light emitted from the side wall of the light source 202 cannot effectively enter the light incident surface of the optical lens 203 and will be removed from the circuit.
  • the light will be reflected by other devices around the light source 202 to the display panel 200, thereby generating serious stray light in the display area of the display panel 200, affecting display effect.
  • the light bar 2 also includes a plurality of Light guide bracket 204.
  • the light guide bracket 204 is disposed on the carrying surface 2011 of the circuit board 201.
  • the light guide bracket 204 can be bonded to the bearing surface 2011 of the circuit board 201 through fixing glue; or the light guide bracket 204 can also be fixed to the bearing surface 2011 of the circuit board 201 through SMT welding.
  • the light guide bracket 204 can be directly connected to the substrate of the circuit board 201; or the light guide bracket 204 can also be indirectly connected to the substrate of the circuit board 201, that is, the light guide bracket 204 can be directly connected to the insulating layer.
  • the light guide bracket 204 is provided with a first through hole 2041 penetrating the light guide bracket 204.
  • a light source 202 is located in the first through hole 2041 of the light guide bracket 204; the inner wall of the first through hole 2041 is The reflective surface is used to reflect at least part of the light from the light source 202 to the optical lens 203 .
  • the material of the light guide bracket 204 can be resin, and the reflectivity can be greater than or equal to 95%; or the material of the light guide bracket 204 can also be metal, and the inner wall of the first through hole 2041 is coated with a reflective material (such as white oil), can be applied.
  • the reflective surface of the light guide bracket 204 can directly reflect all the light from the light source 202 into the optical lens 203; or, the reflective surface of the light guide bracket 204 can also indirectly reflect the light from the light source 202 to the optical lens.
  • the reflective surface of the light guide bracket 204 can first reflect the light from the light source 202 back to the light source 202. After multiple reflections between the reflective surface and the light source 202, the light is projected into the optical lens 203, which can be applied.
  • the shape of the light guide bracket 204 can be an annular shape, so as to be conveniently arranged between the optical lens 203 and the light source 202; or the shape of the light guide bracket 204 can also be other shapes, which are also applicable.
  • the light bar 2 also includes a plate-like structure 205 .
  • the plate-like structure 205 is disposed on the carrying surface 2011 of the circuit board 201.
  • the plate-like structure 205 can be an aluminum substrate used for processing PCBs.
  • the aluminum substrate has good flatness and is attached to the bearing surface 2011 of the circuit board 201 through adhesive glue; or the plate-like structure 205 can also be Other materials, such as acrylic boards, which are bonded to the bearing surface 2011 of the circuit board 201 through adhesive glue, can also be used.
  • the plate structure 205 has a plurality of second through holes 2051 penetrating the plate structure 205 , and a light source 202 is located in the second through hole 2051 of the plate structure 205 .
  • the inner wall of the second through hole 2051 is a reflective surface, and the reflective surface is used to reflect at least part of the light from the light source 202 to the optical lens 203 .
  • the light emitted from the light source 202 can be incident into the diffusion plate 1 through the optical lens 203, and the light emitted from the side of the light source 202 can be prevented from emitting from the gap between the circuit board 201 and the optical lens 203, and in the display area of the display panel 200. Produces serious stray light, affecting the display effect.
  • the inner wall of the second through hole 2051 may be coated with a reflective material (such as white oil) to form a reflective surface.
  • a reflective material such as white oil
  • the reflective surface of the second through hole 2051 can directly reflect all the light from the light source 202 into the optical lens 203; or, the reflective surface of the second through hole 2051 can also indirectly reflect the light from the light source 202 into the optical lens 203.
  • the reflective surface such as the second through hole 2051 can first reflect the light from the light source 202 back to the light source 202. After multiple reflections between the reflective surface and the light source 202, the light is projected into the optical lens 203. All can be applied.
  • the circuit board 201 is provided with multiple grooves. 2012, a light source 202 is disposed on the bottom wall of a groove 2012. It should be noted that at this time, the bottom wall of the groove 2012 is the bearing surface 2011. The side walls of the groove 2012 are reflective surfaces, and the reflective surfaces are used to reflect at least part of the light from the light source 202 to the optical lens 203 .
  • the light emitted from the light source 202 can be incident into the diffusion plate 1 through the optical lens 203, and the light emitted from the side of the light source 202 can be prevented from emitting from the gap between the circuit board 201 and the optical lens 203, and in the display area of the display panel 200. Produces serious stray light, affecting the display effect.
  • the side walls of the groove 2012 may be coated with a reflective material (such as white oil) to form a reflective surface.
  • the reflective surface of the groove 2012 can directly reflect all the light from the light source 202 into the optical lens 203; or, the reflective surface of the groove 2012 can also indirectly reflect the light from the light source 202 into the optical lens 203.
  • the reflective surface of the groove 2012 can first reflect the light from the light source 202 back to the light source 202. After multiple reflections between the reflective surface and the light source 202, the light is projected into the optical lens 203, which can be applied.
  • the carrying surface 2011 of the circuit board 201 is parallel to the diffusion plate 1 .
  • the edge of the reflective surface close to the light incident surface of the diffuser plate 1 is the first edge, and the distance between each point on the first edge and the carrying surface 2011 of the circuit board 201 is the same.
  • the light from the light source 202 that directly enters the optical lens 203 and the light that is reflected to the optical lens 203 through the reflective surface can be refracted by the optical lens 203 and projected to the diffuser plate 1 in a centrally symmetrical shape, so that all The light emitted from the light source 202 is finally mixed evenly at the diffusion plate 1 to ensure the display effect of the display panel 200.
  • the reflective surface is the inner wall of the first through hole 2041 of the light guide bracket 204
  • the two end surfaces of the light guide bracket 204 along the axis direction of the first through hole 2041 can be two planes parallel to each other, which facilitates design. and processing the light guide bracket 204.
  • the plate-like structure 205 can be a flat plate, which facilitates material selection and processing of the second through hole 2051, and also facilitates the plate-like structure 205 Fitted to the circuit board 201.
  • the reflective surface is the side wall of the groove 2012 on the circuit board 201
  • the bottom wall of the groove 2012 can be parallel to the diffusion plate 1, that is, the depth of the groove 2012 is the same everywhere, which facilitates processing of the groove 2012.
  • the edge of the reflective surface away from the light incident surface of the diffusion plate 1 is the second edge.
  • the second edge may be the edge of the opening of the first through hole 2041 close to the circuit board 201 .
  • the second edge may be the edge of the opening of the second through hole 2051 close to the circuit board 201 .
  • the second edge may be the edge of the opening of the second through hole 2051 close to the circuit board 201 .
  • the second edge when the reflective surface is the side wall of the groove 2012 on the circuit board 201 , the second edge may be the connecting line between the side wall and the bottom wall of the groove 2012 . As another example, the second edge can be in contact with the carrying surface 2011 of the circuit board 201. In this way, the light emitted from the side of the light source 202 can be prevented from leaking from the gap between the second edge and the circuit board 201.
  • Stray light is generated in the display area. On this basis, the distance between the two points with the largest distance on the first edge is greater than the distance between the two points with the largest distance on the second edge.
  • part of the light emitted from the side of the light source 202 to the reflective surface can be reflected into the optical lens 203 through the reflective surface, refracted by the optical lens 203, and then projected onto the diffusion plate 1, thus improving the utilization rate of light.
  • This further improves the brightness of the display panel 200 .
  • it can also prevent this part of light from repeatedly penetrating the micro LED chip and causing excessive loss to the LED chip, thereby extending the luminous life of the light source 202.
  • the distance between each point on the first edge of the reflective surface and the bearing surface 2011 is The distance is greater than the height of the light source 202 .
  • the height of the light guide bracket 204 is greater than the height of the light source 202 .
  • the thickness of the plate-like structure 205 is greater than the height of the light source 202 .
  • the depth of the groove 2012 is greater than the height of the light source 202 . In this way, all the light emitted from the side of the light source 202 will not leak from the gap between the circuit board 201 and the optical lens 203, preventing stray light from being generated in the display area of the display panel 200 and affecting the display effect.
  • the reflective surface is a curved surface of rotation
  • the rotation axis of the curved surface of rotation is perpendicular to the bearing surface 2011 of the circuit board 201
  • the generatrix of the curved surface of rotation is a straight line or an arc.
  • the generating line of the rotating curved surface is a straight line
  • the reflecting surface is a conical surface
  • the arc can be a parabola with the opening facing the diffusion plate 1, or the arc can also be It is a circular arc line convex in the direction away from the rotation axis. This application does not limit the specific parameters of the arc line.
  • the pattern of the reflective surface on each cross section parallel to the diffusion plate 1 is circular, so that the light emitted by the light source 202 and the light reflected by the reflective surface can be projected into the optical lens 203 in a circular shape; because the optical lens 203 can It has a centrally symmetrical shape. Therefore, the received light can be evenly diffused into a larger circular light spot. In this way, all the light emitted from the light source 202 can finally be mixed evenly at the diffusion plate 1 to ensure that the display The display effect of panel 200.
  • Figure 13 Figure 13 is a top view of Figure 8
  • the reflective surface is the inner wall of the first through hole 2041 of the light guide bracket 204
  • the first through hole 2041 is a tapered hole.
  • the second through hole 2051 can be a tapered hole.
  • the groove 2012 may be a tapered groove.
  • the reflective surface as a conical surface as an example
  • the diameter R1 of the first edge is determined, in order to ensure that most of the light can directly enter the optical system after being reflected by the reflective surface
  • the angle ⁇ between the reflective surface of the lens 203 and the carrying surface of the circuit board 201 should be as small as possible, that is, when the diameter R1 of the first edge is determined, the second edge should be as close to the bottom of the light source 202 as possible.
  • the diameter R2 of the second edge is equal to the maximum size of the light source 202 in the direction parallel to the diffusion plate 1.
  • the included angle ⁇ satisfies the following Formula (1), where H is the distance between each point on the first edge and the bearing surface 2011 of the circuit board 201 .
  • the light refracted by the optical lens 203 needs to meet a certain spot size, so that the diffusion plate 1 can diffuse the spot to obtain the light required for display.
  • the light can be projected to the optical system through the design parameters of the reflective surface.
  • the divergence angle of the light rays from the lens 202 is limited to limit the size of the light spot that exits the optical lens 203 , that is, the size of the light spot that is incident on the diffuser plate 1 .
  • the divergence angle of the light projected to the optical lens 203 can be set to be less than or equal to 120 degrees.
  • the critical ray exit angle ⁇ of the light projected to the optical lens 202 should be less than or equal to 60 degrees. At this time, the exit angle ⁇ satisfies the following formula ( 2).
  • the size of the micro-LED chips 2021 that make up the light-emitting source 202 can be 0.54mm ⁇ 0.24mm ⁇ 0.15mm.
  • Each light-emitting source 202 is composed of 8 micro-LED chips 2021.
  • multiple micro LED chips 2021 within the light source 202 are symmetrically arranged.
  • the micro LED chip 2021 can be in a rectangular shape.
  • Multiple micro LED chips 2021 are symmetrically arranged, and the main light emitting surface of the light source 202 formed away from the circuit board 201 is approximately square. In this way, the light pattern of the light emitted by the light emitting source 202 can be achieved. Be as symmetrical as possible about the center to ensure the light mixing effect. At the same time, it is convenient to lay out the pads for welding the micro LED chips 2021 on the circuit board 201, which facilitates batch processing.
  • the smallest partition unit of a backlight is that there is only one light source in an area, that is, each light source is controlled individually. Therefore, the full power working state of the light source in a single partition is the upper line of the brightness of that area, and the partition cannot be further refined.
  • the brightness adjustment range in a single partition is relatively small.
  • the backlight module in the embodiment of the present application adopts a direct-type backlight module to emit light evenly throughout the entire light-emitting surface. , providing the display panel with sufficient brightness and evenly distributed light so that the display panel can display images normally.
  • the display panel 200 is located on the light emitting side of the backlight module 100, and the shape and size of the display panel usually match the backlight module.
  • the display panel 200 can be configured as a rectangle, including the sky side, the ground side, the left side and the right side, where the sky side and the ground side are opposite, the left side and the right side are opposite, and the sky side is respectively connected to one end and right side of the left side.
  • the ground side is connected to the other end on the left side and the other end on the right side respectively.
  • the display panel 200 is a transmissive display panel that can modulate the transmittance of light but does not emit light itself.
  • the display panel 200 has a plurality of pixel units arranged in an array. Each pixel unit can independently control the transmittance and color of the light incident on the pixel unit by the backlight module 100, so that the light transmitted by all the pixel units constitutes displayed image.
  • FIG. 19 is a schematic cross-sectional structural diagram of a backlight module provided by an embodiment of the present application.
  • the backlight module 100 includes: a carrying surface 2021 , a circuit board 201 , a light source 202 , a diffusion plate 1 and an optical film 3 .
  • the bearing surface 2021 is located at the bottom of the backlight module and has a supporting and bearing role.
  • the bearing surface 2021 is usually a square structure. When applied to a special-shaped display device, its shape is adapted to the shape of the display device.
  • the bearing surface 2021 includes the sky side, the ground side, the left side and the right side.
  • the sky side is opposite to the ground side
  • the left side is opposite to the right side
  • the sky side is connected to one end of the left side and one side of the right side respectively
  • the ground side is connected to the other end of the left side and the other end of the right side respectively.
  • the material of the bearing surface 2021 is aluminum, iron, aluminum alloy or iron alloy.
  • the bearing surface 2021 is used to support the circuit board 201 and to support and fix the edge positions of components such as the diffusion plate 1 and the optical film 3.
  • the bearing surface 2021 also plays a role in heat dissipation for the circuit board 201.
  • the backlight module is a direct backlight module
  • the circuit board 201 is located on the carrying surface 2021 .
  • the circuit board 201 may be in a square or rectangular shape as a whole, which is not limited here.
  • the circuit board 201 can be a Printed Circuit Board (PCB for short). When applied to a flexible display device, the circuit board 201 can also be a flexible circuit board.
  • PCB Printed Circuit Board
  • the circuit board 201 is used to provide driving signals to the light source 202 .
  • the light source 202 is located on the circuit board 201 and is electrically connected to the circuit board 201 .
  • the light source 202 can be welded on the circuit board 201 .
  • the diffusion plate 1 is located on the light emitting side of the light source 202 and is separated from the light source 202 by a certain distance. This distance is set to allow sufficient light mixing between the light sources.
  • the function of the diffuser plate 1 is to scatter the incident light to make the light passing through the diffuser plate 1 more uniform.
  • the diffusion plate 1 is provided with a scattering particle material. When light enters the scattering particle material, refraction and reflection will continue to occur, thereby achieving the effect of scattering the light and achieving a uniform light effect.
  • the thickness of the diffusion plate is usually set to 0.5mm-3mm. The thicker the diffusion plate, the greater the haze and the better the uniform effect.
  • the diffusion plate 1 can usually be processed by an extrusion process, and the material used for the diffusion plate 1 is generally selected from at least one of polymethyl methacrylate PMMA, polycarbonate PC, polystyrene-based material PS, and polypropylene PP.
  • the light source 202 may be used to emit blue light.
  • the diffusion plate 1 can be a quantum dot diffusion plate, used to achieve color conversion and diffusion functions.
  • the optical film 3 is located on the side of the diffusion plate 1 away from the light source 202 .
  • the size of the optical film 3 is suitable for the display device, is slightly smaller than the display device, and is usually set in a rectangular or square shape.
  • the optical film 3 includes one or more combinations of a fluorescent film, a quantum film, a prism film, a brightness enhancing film, etc., which can be set according to specific needs and is not limited here.
  • Contrast is an important image quality parameter for measuring display devices. Contrast ratio refers to the ratio of the brightness at the brightest point to the brightness at the darkest point on the display device. The higher the contrast, the clearer the image, the more vivid the colors displayed, and the richer the layering.
  • contrast to improve contrast, on the one hand, we must increase the brightness of the bright state, and on the other hand, we must reduce the brightness of the dark state.
  • the LCD panel has a certain degree of light leakage in the dark state, and changes in brightness in the dark state greatly affect the display contrast.
  • Figure 20 is a schematic plan view of a light source in the related art.
  • n light sources are divided into one partition, and all light sources are partitioned for regional dimming.
  • n can take any positive integer.
  • the smallest partition unit of the multi-partition backlight is a light-emitting source 202 acting alone as a partition Z.
  • the brightness capability of the light-emitting source 202 is certain, that is, within a single partition Z
  • the light source 202 is operating at full power, the upper line of the Z brightness of the zone. So if you want to increase the number of partitions, you can only increase the number of light sources.
  • the distance between adjacent light sources gradually decreases.
  • the spacing between light sources is smaller than the diameter of a single light source, the number of light sources reaches saturation and cannot continue to increase.
  • there is a minimum design value for the spacing between light sources When the minimum value is reached, the partition is saturated and cannot be further improved.
  • Figure 21 is a schematic diagram of partitioning in related technology.
  • the backlight module includes three partitions, they are the first partition Z1, the second partition Z2 and the third partition Z3.
  • the average brightness level (Average Picture Level, APL) of the first partition Z1 is 950, which means that the brightness required for this partition is 950nit.
  • the brightness capability of a single partition of a single light source is limited, and the brightness of the second partition Z2 adjacent to this partition is small, for example, only 150nit, in this case, even using a single light source as the ultimate partition method of one partition cannot To meet the usage requirements, on the one hand, the brightness of the light source in the first partition Z1 cannot reach 950nit, on the other hand, the adjacent second partition Z2 cannot supplement the brightness of the first partition Z1, resulting in the actual display brightness of the first partition Z1 being much lower than 950nit.
  • FIG. 22 is a schematic plan view of a backlight provided by an embodiment of the present application.
  • the backlight module of the embodiment of the present application includes multiple light-emitting sources 202 , where at least one light-emitting source 202 includes at least two micro LED chips 2021 .
  • a light-emitting source includes at least two micro-LED chips
  • the brightness of the single light-emitting source can be improved, which is suitable for use scenarios that require greater brightness in a single partition.
  • each micro LED chip 2021 in a light emitting source 202 can be controlled independently.
  • one partition Z can be further subdivided into multiple sub-partitions, with each micro-LED chip serving as a sub-partition, so that the partitions of the backlight module are no longer limited by the number of light-emitting sources, without increasing the number of light-emitting sources. Next, further increase the number of partitions.
  • only the light source located in the middle area includes at least two micro LED chips to provide fine control over the core part of the picture.
  • each light source in the backlight module includes at least two micro LED chips, so that the entire backlight module area can be more finely controlled.
  • Figure 23 is a schematic structural diagram of a light source provided by an embodiment of the present application.
  • the micro LED chip 2021 uses a light emitting diode (Light Emitting Diode, LED for short) chip.
  • Micro LED chips have the advantages of energy saving, environmental protection, good color rendering and fast response speed. The manufacturing process is mature and the size of micro LED chips can be controlled. They are suitable as the light source for backlight modules based on regional dimming technology.
  • the light source 202 also includes an optical lens 132 located on the light exit side of each micro LED chip 2021.
  • the optical lens 132 can be a refractive optical lens, and its surface shape can further diverge the light emitted from the micro LED chip 2021 through optical design, thereby increasing the light emission angle of the light source, which is beneficial to reducing the light mixing distance of the light source and thinning the backlight module.
  • the thickness of the group is beneficial to reducing the light mixing distance of the light source and thinning the backlight module.
  • the optical lens 132 when the optical lens 132 is designed, it usually adopts a symmetrical structure, and there is a receiving cavity in the center. Multiple chips can be placed in the receiving cavity at the same time, so that the light emitted from each light source is symmetrical. diverge.
  • micro LED chips can also be directly used as light sources without setting up optical lenses.
  • the size of the light source can be reduced and the light mixing distance can be further shortened. It is helpful to divide the light source into smaller partitions to refine regional dimming and improve display contrast.
  • FIG. 24 is the second schematic plan view of the backlight provided by the embodiment of the present application.
  • one light source 202 may include four micro LED chips 2021 .
  • Four micro LED chips 2021 are arranged in two rows and two columns.
  • one partition Z can be further refined into four symmetrically distributed sub-partitions, and each sub-partition can play an auxiliary role in the adjacent sub-partitions.
  • the four micro LED chips included in the light emitting source 202 are respectively the first micro LED chip a, the second micro LED chip b, the third micro LED chip c, and the fourth micro LED chip d.
  • Each of the four micro LED chips can be controlled independently, so that the partition Z including only one light source 202 can be further subdivided into four sub-partitions.
  • the first micro LED chip a corresponds to the first sub-section Za
  • the second micro LED chip b corresponds to the second sub-section Zb
  • the third micro LED chip c corresponds to the third sub-section Zc
  • the fourth micro LED chip d corresponds to the fourth Subpartition Zd.
  • each light source includes four micro LED chips
  • the brightness of the first partition Z1 can be 4 times the original brightness, effectively improving the brightness of the first partition Z1.
  • the maximum brightness of one partition Z1 meets the brightness requirements and improves the contrast.
  • the APL of the third partition Z3 is 350, that is, the brightness required by this partition is about 1/4 of the maximum brightness. Therefore, one of the micro LED chips in the light source can be called to emit light, and the other micro LED chips can be used to emit light.
  • the LED chip does not emit light. In addition to ensuring that the brightness meets the demand, it also ensures that the surrounding area is displayed in black.
  • the backlight module provided by the embodiment of the present application breaks through the partition restriction of one light source as one partition.
  • the light source includes four micro LED chips, and each micro LED chip can be independently controlled, thereby allowing one partition to Then refine it into 4 sub-partitions. According to the image brightness requirements, any chip at any position among the four micro LED chips is regularly driven to meet the brightness and darkness requirements at different locations.
  • the circuit board 201 has a block structure, the light sources 202 are arranged in an array on the circuit board 201, and the circuit board 201 and the light sources 202 constitute a light panel.
  • the spacing between the light sources 202 on the lamp board can be set according to actual needs. If applied to a large-size display device, multiple circuit boards 201 can also be provided in the backlight module, and the circuit boards 201 are spliced together.
  • FIG. 25 is a third schematic diagram of the planar structure of the backlight provided by the embodiment of the present application.
  • the circuit board 201 has a strip structure
  • the light sources 202 are arranged in a row on the circuit board 201
  • the circuit board 201 and the light sources 202 form a light bar.
  • the backlight module includes multiple light bars arranged in parallel. The number of light sources included on the light bar is smaller than the number of light sources included on the light board, so it is helpful to simplify the circuit design. By setting multiple light bars, the demand for regional dimming can also be met.

Abstract

A display device, used for solving the problem of a high design cost of a mini light-emitting diode (LED) backlight module (100). The display device comprises the backlight module (100) and a display panel (200). The backlight module (100) comprises a diffusion plate (1) and light bars (2), and the light bars (2) comprise circuit boards (201), a plurality of light-emitting sources (202), and a plurality of optical lenses (203). The plurality of light-emitting sources (202) are provided on the bearing surfaces of the circuit boards (201). The light-emitting sources (202) comprise a plurality of mini LED chips (2021) electrically connected to the circuit boards (201). The plurality of optical lenses (203) are provided on the sides of the circuit boards (201) close to a light incident surface of the diffusion plate (1), and each optical lens covers each light-emitting source (202). According to the display device provided in the present application, the arrangement distance between two adjacent light-emitting sources (202) can be increased, so that the circuit boards (201) are strip-shaped to form the light bars (2), and light sources of the backlight module (100) are formed by arranging the plurality of light bars (2) side by side at intervals; the optical lenses (203) cover the light-emitting sources (202) so as to scatter light emitted by the light-emitting sources (202), so that the reliability of the display device is ensured when the cost is reduced.

Description

一种显示设备a display device
相关申请的交叉引用Cross-references to related applications
本申请要求在2022年03月18日提交、申请号为202210269950.9;在2022年03月24日提交、申请号为202220676696.X的中国申请的优先权,其全部内容通过引用结合在本申请中。This application claims priority to the Chinese application submitted on March 18, 2022, with application number 202210269950.9; submitted on March 24, 2022, with application number 202220676696.X, the entire contents of which are incorporated into this application by reference.
技术领域Technical field
本申请涉及显示技术领域,尤其涉及一种显示设备。The present application relates to the field of display technology, and in particular, to a display device.
背景技术Background technique
随着LED背光技术的不断发展成熟,越来越多的产品形态层出不穷,其中mini LED背光越来越引人注目。目前,mini LED背光方案主要包括POB(Package on Board)和COB(Chip on Board)两种,由于COB不用进行POB中的SMD(Surface Mounted Devices,表面贴装器件)封装步骤,单颗LED成本较低,具有成本优势,因此,越来越多的背光方案选用COB方案。As LED backlight technology continues to develop and mature, more and more product forms are emerging, among which mini LED backlights are becoming more and more eye-catching. At present, mini LED backlight solutions mainly include POB (Package on Board) and COB (Chip on Board). Since COB does not require the SMD (Surface Mounted Devices) packaging step in POB, the cost of a single LED is relatively high. Low and cost advantage, therefore, more and more backlight solutions choose COB solutions.
按照行业规定,mini LED芯片的短边尺寸要小于300μm,即小于11.8mil(密耳)。由于mini LED芯片尺寸较小,单颗芯片功率较低,相比于目前常用的尺寸为25mil的LED芯片,同样光通量需要更多颗mini LED芯片;又由于COB所用芯片没有SMD封装,其本身发光角度(指主出光面的发光角度)较小,为保证主观画面的显示效果,需相邻的mini LED芯片之间的间距较小,因此,为支持mini LED的小间距排布,需采用灯板的形式(如图1所示),增大了PCB的使用量,进而导致背光模组的设计成本较高。According to industry regulations, the short side size of mini LED chips must be less than 300 μm, that is, less than 11.8 mils. Due to the smaller size of mini LED chips, the power of a single chip is lower. Compared with the currently commonly used LED chips with a size of 25mil, the same luminous flux requires more mini LED chips; and because the chips used in COB do not have SMD packages, they emit light by themselves. The angle (referring to the light-emitting angle of the main light-emitting surface) is small. In order to ensure the display effect of the subjective picture, the spacing between adjacent mini LED chips needs to be small. Therefore, in order to support the small spacing arrangement of mini LEDs, lamps need to be used. The form of the board (as shown in Figure 1) increases the usage of PCB, which in turn leads to higher design costs of the backlight module.
发明内容Contents of the invention
本申请的一些实施例提供了一种显示设备,包括背光模组和显示面板,显示面板位于背光模组的出光侧。背光模组包括扩散板和灯条,灯条位于扩散板的入光面的一侧。其中,灯条包括电路板、多个发光源以及多个光学透镜。电路板呈条形,电路板具有承载面,承载面位于电路板靠近扩散板的入光面的一侧。多个发光源设置于电路板的承载面上,多个发光源沿电路板的延伸方向依次间隔设置;发光源包括多个微型发光二极管LED芯片,多个微型LED芯片与电路板电连接。多个光学透镜设置于电路板靠近扩散板的入光面的一侧,一个光学透镜罩设于一个发光源上,光学透镜用于对发光源出射的光线进行散射。Some embodiments of the present application provide a display device, including a backlight module and a display panel, and the display panel is located on the light emitting side of the backlight module. The backlight module includes a diffusion plate and a light bar. The light bar is located on one side of the light incident surface of the diffusion plate. The light bar includes a circuit board, multiple light sources and multiple optical lenses. The circuit board is in a strip shape and has a bearing surface located on a side of the circuit board close to the light incident surface of the diffuser plate. A plurality of light-emitting sources are arranged on the carrying surface of the circuit board, and the plurality of light-emitting sources are arranged at intervals along the extension direction of the circuit board; the light-emitting sources include a plurality of micro-light-emitting diode LED chips, and the plurality of micro-LED chips are electrically connected to the circuit board. A plurality of optical lenses are arranged on a side of the circuit board close to the light incident surface of the diffusion plate. An optical lens cover is arranged on a light source. The optical lens is used to scatter light emitted from the light source.
在一些实施例中,灯条还包括:多个导光支架,设置于电路板的承载面上;导光支架开设有贯穿导光支架的第一通孔,一个发光源位于一个导光支架的第一通孔内;第一通孔的内侧壁为反射面,反射面用于将来自发光源的 至少部分光线反射至光学透镜。In some embodiments, the light bar further includes: a plurality of light guide brackets, which are arranged on the bearing surface of the circuit board; the light guide bracket is provided with a first through hole penetrating the light guide bracket, and a light source is located on one of the light guide brackets. In the first through hole; the inner wall of the first through hole is a reflective surface, and the reflective surface is used to reflect at least part of the light from the light source to the optical lens.
在一些实施例中,灯条还包括:板状结构,设置于电路板的承载面上;板状结构开设有多个贯穿板状结构的第二通孔,一个发光源位于一个板状结构的第二通孔内,第二通孔的内侧壁为反射面,反射面用于将来自发光源的至少部分光线反射至光学透镜。In some embodiments, the light bar further includes: a plate-like structure disposed on the bearing surface of the circuit board; the plate-like structure is provided with a plurality of second through holes penetrating the plate-like structure, and a light source is located on a plate-like structure In the second through hole, the inner wall of the second through hole is a reflective surface, and the reflective surface is used to reflect at least part of the light from the light source to the optical lens.
在一些实施例中,电路板开设有多个凹槽,一个发光源设置于一个凹槽的底壁上,凹槽的侧壁为反射面,反射面用于将来自发光源的至少部分光线反射至光学透镜。In some embodiments, the circuit board is provided with multiple grooves, a light source is disposed on the bottom wall of one groove, and the side walls of the groove are reflective surfaces, and the reflective surfaces are used to reflect at least part of the light from the light source to optical lens.
在一些实施例中,电路板的承载面平行于扩散板。反射面靠近扩散板的入光面的边缘为第一边缘,第一边缘上各点与电路板的承载面之间的距离相同。In some embodiments, the carrying surface of the circuit board is parallel to the diffuser plate. The edge of the reflective surface close to the light incident surface of the diffusion plate is the first edge, and the distance between each point on the first edge and the bearing surface of the circuit board is the same.
在一些实施例中,反射面远离扩散板的入光面的边缘为第二边缘;第一边缘上距离最大的两点之间的距离,大于第二边缘上距离最大的两点之间的距离。In some embodiments, the edge of the reflective surface away from the light incident surface of the diffusion plate is the second edge; the distance between the two largest points on the first edge is greater than the distance between the two largest points on the second edge. .
在一些实施例中,反射面为旋转曲面,旋转曲面的旋转轴垂直于电路板的承载面,旋转曲面的母线为直线或弧线。In some embodiments, the reflective surface is a curved surface of revolution, the rotation axis of the curved surface of revolution is perpendicular to the bearing surface of the circuit board, and the generatrix of the curved surface of revolution is a straight line or an arc.
在一些实施例中,第一边缘的直径为R1,R1满足如下公式:R1≤3.466×H+R2。其中,R2为第二边缘的直径,H为第一边缘上各点与电路板的承载面之间的距离。In some embodiments, the diameter of the first edge is R1, and R1 satisfies the following formula: R1≤3.466×H+R2. Among them, R2 is the diameter of the second edge, and H is the distance between each point on the first edge and the bearing surface of the circuit board.
在一些实施例中,沿垂直于电路板的承载面的方向,反射面的第一边缘上各点与承载面之间的距离大于发光源的高度。In some embodiments, in a direction perpendicular to the bearing surface of the circuit board, the distance between each point on the first edge of the reflective surface and the bearing surface is greater than the height of the light source.
在一些实施例中,所述发光源包括至少两个微型LED芯片,各所述微型LED芯片独立控制;In some embodiments, the light source includes at least two micro LED chips, and each of the micro LED chips is independently controlled;
所述发光源内的多个所述微型LED芯片对称设置。The plurality of micro LED chips in the light source are symmetrically arranged.
在一些实施例中,一个所述光源包括四个所述微型LED芯片。In some embodiments, one said light source includes four said micro LED chips.
在一些实施例中,四个所述微型LED芯片排列成两行两列。In some embodiments, four of the micro LED chips are arranged in two rows and two columns.
在一些实施例中,所述发光源在所述电路板上呈阵列排布,所述电路板和所述发光源构成灯板。In some embodiments, the light-emitting sources are arranged in an array on the circuit board, and the circuit board and the light-emitting sources constitute a light panel.
在一些实施例中,所述背光模组还包括:In some embodiments, the backlight module further includes:
光学膜片,位于所述扩散板背离所述发光源的一侧。An optical film is located on the side of the diffusion plate facing away from the light source.
附图说明Description of the drawings
图1为相关技术中一种背光模组的光源示意图;Figure 1 is a schematic diagram of a light source of a backlight module in the related art;
图2为本申请实施例提供的一种显示设备的结构示意图;Figure 2 is a schematic structural diagram of a display device provided by an embodiment of the present application;
图3为本申请实施例提供的一种背光模组的结构示意图;Figure 3 is a schematic structural diagram of a backlight module provided by an embodiment of the present application;
图4为本申请实施例提供的一种灯条的结构示意图;Figure 4 is a schematic structural diagram of a light bar provided by an embodiment of the present application;
图5为本申请实施例提供的一种背光模组的结构示意图;Figure 5 is a schematic structural diagram of a backlight module provided by an embodiment of the present application;
图6为相关技术中的SMD灯珠的示意图;Figure 6 is a schematic diagram of an SMD lamp bead in the related art;
图7为相关技术中的发光源的结构示意图;Figure 7 is a schematic structural diagram of a light source in the related art;
图8为图4中A处的放大图;Figure 8 is an enlarged view of point A in Figure 4;
图9为本申请实施例提供的另一种灯条的结构示意图;Figure 9 is a schematic structural diagram of another light bar provided by an embodiment of the present application;
图10为图9中B处的放大图;Figure 10 is an enlarged view of B in Figure 9;
图11为本申请实施例提供的另一种灯条的结构示意图;Figure 11 is a schematic structural diagram of another light bar provided by an embodiment of the present application;
图12为图11中C处的放大图;Figure 12 is an enlarged view of C in Figure 11;
图13为图8所示结构的俯视图(隐藏光学透镜);Figure 13 is a top view of the structure shown in Figure 8 (hidden optical lens);
图14为图10所示结构的俯视图;Figure 14 is a top view of the structure shown in Figure 10;
图15为本申请实施例提供的灯条的光线传播路径示意图;Figure 15 is a schematic diagram of the light propagation path of the light bar provided by the embodiment of the present application;
图16为本申请实施例提供的另一灯条的光线传播路径示意图;Figure 16 is a schematic diagram of the light propagation path of another light bar provided by an embodiment of the present application;
图17本申请实施例提供的一种灯条的局部结构示意图;Figure 17 is a schematic partial structural diagram of a light bar provided by an embodiment of the present application;
图18为本申请实施例提供的另一显示设备的结构示意图;Figure 18 is a schematic structural diagram of another display device provided by an embodiment of the present application;
图19为本申请实施例提供的背光模组的截面结构示意图;Figure 19 is a schematic cross-sectional structural diagram of a backlight module provided by an embodiment of the present application;
图20为相关技术中的光源的平面结构示意图;Figure 20 is a schematic plan view of a light source in the related art;
图21为相关技术中的分区示意图;Figure 21 is a schematic diagram of partitioning in related technologies;
图22为本申请实施例提供的背光源的平面结构示意图之一;Figure 22 is one of the planar structural schematic diagrams of the backlight provided by the embodiment of the present application;
图23为本申请实施例提供的光源的结构示意图;Figure 23 is a schematic structural diagram of a light source provided by an embodiment of the present application;
图24为本申请实施例提供的背光源的平面结构示意图之二;Figure 24 is the second schematic plan view of the backlight provided by the embodiment of the present application;
图25为本申请实施例提供的背光源的平面结构示意图之三。FIG. 25 is a third schematic diagram of the planar structure of the backlight provided by the embodiment of the present application.
附图标记:100-背光模组;1-扩散板;2-灯条;201-电路板;2011-承载面;2012-凹槽;202a-灯珠;2021a-支架;2022a-出光面;202-发光源;2021-微型LED芯片;203-光学透镜;204-导光支架;2041-第一通孔;205-板状结构;2051-第二通孔;3-光学膜片;200-显示面板;300-显示设备。Reference signs: 100-backlight module; 1-diffusion plate; 2-light bar; 201-circuit board; 2011-bearing surface; 2012-groove; 202a-lamp beads; 2021a-bracket; 2022a-light-emitting surface; 202 -Lighting source; 2021-micro LED chip; 203-optical lens; 204-light guide bracket; 2041-first through hole; 205-plate structure; 2051-second through hole; 3-optical film; 200-display Panel; 300 - display device.
具体实施方式Detailed ways
下面将结合本申请实施例中的附图,对本申请实施例进行清楚、完整地描述,显然,所描述的实施例仅仅是本申请一部分实施例,而不是全部的实施例。基于本申请中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例,都属于本申请保护的范围。The embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by those of ordinary skill in the art without creative efforts fall within the scope of protection of this application.
在本申请的描述中,需要理解的是,术语“中心”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”、“内”、“外”等指示的方位或位置关系为基于附图所示的方位或位置关系,仅是为了便于描述本申请和简化描述,而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作,因此不能理解为对本申请的限制。In the description of this application, it should be understood that the terms "center", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", The orientations or positional relationships indicated by "top", "bottom", "inner", "outside", etc. are based on the orientations or positional relationships shown in the drawings. They are only for the convenience of describing the present application and simplifying the description, and are not indicated or implied. The devices or elements referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore should not be construed as limiting the application.
在本申请的描述中,需要说明的是,除非另有明确的规定和限定,术语“安装”、“相连”、“连接”应做广义理解,例如,可以是固定连接,也可以是可拆卸连接,或一体地连接;对于本领域的普通技术人员而言,可以具体情况理解上述术语在本申请中的具体含义。In the description of this application, it should be noted that, unless otherwise clearly stated and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense. For example, it can be a fixed connection or a detachable connection. Connected, or connected integrally; for those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood on a case-by-case basis.
参见图2,本申请的一些实施例提供了一种显示设备300,包括背光模组100以及显示面板200。背光模组100用于提供背光。背光模组100将常用的点 或线型光源,通过简单有效的结构转化成高亮度且均匀的面光源,即背光模组100可以在整个出光面内均匀的发出光线,用于为显示面板200提供亮度充足且分布均匀的光线,以使显示面板200可以正常显示影像。基于此,显示面板200位于背光模组100的出光侧,用于图像显示。显示面板200具有多个呈阵列排布的像素单元,每个像素单元都可以独立的控制背光模组100入射到该像素单元的光线透过率和色彩,以使全部像素单元透过的光线构成显示的图像。上述显示设备300可为液晶显示屏、液晶显示器、液晶电视等显示设备,也可以为手机、平板电脑、智能相册等移动终端。显示设备300中采用背光模组100提供背光,由显示面板200对背光模组出射的光线进行调制,实现图像显示。Referring to FIG. 2 , some embodiments of the present application provide a display device 300 , including a backlight module 100 and a display panel 200 . The backlight module 100 is used to provide backlight. The backlight module 100 converts commonly used point or linear light sources into high-brightness and uniform surface light sources through a simple and effective structure. That is, the backlight module 100 can emit light evenly throughout the entire light-emitting surface, and is used to provide light for the display panel 200 Provide sufficient brightness and evenly distributed light so that the display panel 200 can display images normally. Based on this, the display panel 200 is located on the light emitting side of the backlight module 100 for image display. The display panel 200 has a plurality of pixel units arranged in an array. Each pixel unit can independently control the transmittance and color of the light incident on the pixel unit by the backlight module 100, so that the light transmitted by all the pixel units constitutes displayed image. The above-mentioned display device 300 can be a display device such as an LCD screen, an LCD monitor, an LCD TV, etc., or it can be a mobile terminal such as a mobile phone, a tablet computer, or a smart photo album. The display device 300 uses the backlight module 100 to provide backlight, and the display panel 200 modulates the light emitted by the backlight module to achieve image display.
本申请实施例中的背光模组采用直下式背光模组,用于在整个出光面内均匀的发出光线,为显示面板提供亮度充足且分布均匀的光线,以使显示面板可以正常显示影像。The backlight module in the embodiment of the present application adopts a direct-type backlight module, which is used to emit light evenly within the entire light-emitting surface, providing the display panel with sufficient brightness and evenly distributed light, so that the display panel can display images normally.
显示面板200位于背光模组100的出光侧,显示面板的形状与尺寸通常与背光模组相匹配。通常情况下显示面板200可以设置为矩形,包括天侧、地侧、左侧和右侧,其中天侧和地侧相对,左侧和右侧相对,天侧分别与左侧的一端和右侧的一侧相连,地侧分别与左侧的另一端和右侧的另一端相连。The display panel 200 is located on the light emitting side of the backlight module 100, and the shape and size of the display panel usually match the backlight module. Normally, the display panel 200 can be configured as a rectangle, including the sky side, the ground side, the left side and the right side, where the sky side and the ground side are opposite, the left side and the right side are opposite, and the sky side is respectively connected to one end and right side of the left side. The ground side is connected to the other end on the left side and the other end on the right side respectively.
显示面板200为透射型显示面板,能够对光的透射率进行调制,但本身并不发光。显示面板200具有多个呈阵列排布的像素单元,每个像素单元都可以独立的控制背光模组100入射到该像素单元的光线透过率和色彩,以使全部像素单元透过的光线构成显示的图像。The display panel 200 is a transmissive display panel that can modulate the transmittance of light but does not emit light itself. The display panel 200 has a plurality of pixel units arranged in an array. Each pixel unit can independently control the transmittance and color of the light incident on the pixel unit by the backlight module 100, so that the light transmitted by all the pixel units constitutes displayed image.
基于此,参见图3,本申请的一些实施例提供了一种上述背光模组100,包括扩散板1和灯条2,灯条2位于扩散板1的入光面的一侧。Based on this, referring to Figure 3, some embodiments of the present application provide the above-mentioned backlight module 100, which includes a diffusion plate 1 and a light bar 2. The light bar 2 is located on one side of the light incident surface of the diffusion plate 1.
上述扩散板1用于将灯条2出射的光线进行折射、反射与散射,从而增加光源的光线均匀度;扩散板1还用于在灯条2和显示面板200之间形成隔热的耐热板。示例性的,扩散板1可以呈半透明(乳白色)状,可以由在透明的基材里混入折射率不同的添加剂制成,其中,添加剂的作用是反射和折射灯条发出的光线。The above-mentioned diffusion plate 1 is used to refract, reflect and scatter the light emitted from the light bar 2, thereby increasing the light uniformity of the light source; the diffusion plate 1 is also used to form a heat-insulating and heat-resistant barrier between the light bar 2 and the display panel 200. plate. For example, the diffusion plate 1 can be in a translucent (milky white) shape, and can be made by mixing additives with different refractive index into a transparent base material, where the function of the additives is to reflect and refract the light emitted by the light bar.
为了提高从扩散板1的出光面出射的光线的亮度和均匀性,背光模组100还可以包括光学膜片3,光学膜片3位于扩散板1和显示面板200之间。光学膜片3可以包括沿靠近显示面板200方向层叠设置的第一扩散片、增亮膜和第二扩散片,其中,第一扩散片用于对扩散板1出射的光线进行均匀化处理,增亮膜用于提高光线的亮度,第二扩散片用于保护显示面板200不被背光模组100等外界物体划伤。需要说明的是,在背光模组100还包括光学膜片3的情况下,扩散板1还用于对光学膜片3提供机械支撑。In order to improve the brightness and uniformity of the light emitted from the light exit surface of the diffuser plate 1 , the backlight module 100 may further include an optical film 3 , and the optical film 3 is located between the diffuser plate 1 and the display panel 200 . The optical film 3 may include a first diffusion sheet, a brightness enhancement film and a second diffusion sheet stacked in a direction close to the display panel 200 , where the first diffusion sheet is used to homogenize the light emitted from the diffusion plate 1 , thereby increasing the The bright film is used to increase the brightness of light, and the second diffusion sheet is used to protect the display panel 200 from being scratched by external objects such as the backlight module 100 . It should be noted that when the backlight module 100 also includes an optical film 3 , the diffusion plate 1 is also used to provide mechanical support for the optical film 3 .
为了使背光模组100能够为显示面板200提供背光,如图4所示,上述灯条2包括电路板201、多个发光源202以及多个光学透镜203。电路板201呈条形,电路板201具有承载面2011,承载面2011位于电路板201靠近扩散板1的入光面的一侧。电路板201用于承载和支撑发光源202和光学透镜203,并且为发光源202提供驱动电信号。示例性的,电路板201可以为PCB(Printed CircuitBoard,印刷电路板),如电路板201可以包括沿靠近扩散板1的方向依次设置的基板、 线路层和绝缘层,基板可以采用铝基板,基板朝向扩散板1的表面为承载面2011。线路层可以采用金属铜,通过刻蚀工艺形成电路,用于驱动发光源202发光。绝缘层将线路层中用于与发光源202电连接的部位(如焊盘)裸露在外而将其余部分覆盖,用于保护线路层。基于此,又示例性的,绝缘层可以通过将具有反射性质的材料涂覆在电路板201的表面而形成,该绝缘层同时具有反射作用。又示例性的,绝缘层可以采用白油等材料,既可以对电路板201起到保护绝缘的作用,又可以作为反射涂层对发光源202向电路板201出射的光线进行反射,从而提高光源的利用效率。In order to enable the backlight module 100 to provide backlight for the display panel 200, as shown in FIG. 4, the above-mentioned light bar 2 includes a circuit board 201, a plurality of light sources 202 and a plurality of optical lenses 203. The circuit board 201 is in a strip shape and has a bearing surface 2011 . The bearing surface 2011 is located on the side of the circuit board 201 close to the light incident surface of the diffuser plate 1 . The circuit board 201 is used to carry and support the light source 202 and the optical lens 203, and to provide driving electrical signals for the light source 202. For example, the circuit board 201 may be a PCB (Printed Circuit Board). For example, the circuit board 201 may include a substrate, a circuit layer and an insulating layer sequentially arranged in a direction close to the diffusion plate 1. The substrate may be an aluminum substrate. The surface facing the diffuser plate 1 is the bearing surface 2011. The circuit layer can be made of metallic copper, and a circuit can be formed through an etching process to drive the light source 202 to emit light. The insulating layer exposes the parts (such as soldering pads) of the circuit layer used for electrical connection with the light source 202 and covers the remaining parts to protect the circuit layer. Based on this, as another example, the insulating layer may be formed by coating a material with reflective properties on the surface of the circuit board 201 , and the insulating layer also has a reflective effect. As another example, the insulating layer can be made of white oil or other materials, which can not only protect and insulate the circuit board 201, but also serve as a reflective coating to reflect the light emitted from the light source 202 to the circuit board 201, thereby improving the efficiency of the light source. utilization efficiency.
基于此,多个发光源202设置于电路板201的承载面2011上,多个发光源202沿电路板201的延伸方向依次间隔设置。发光源202包括多个微型发光二极管LED芯片2021,多个微型LED芯片2021与电路板201电连接。示例性的,微型LED芯片2021可以通过SMT(Surface Mounted Technology,表面贴装技术)焊接在电路板201裸露的焊盘上,在焊接后通过控制电路板201的驱动信号可以控制微型LED芯片2021进行发光。又示例性的,微型LED芯片2021可以为mini-LED芯片,例如,微型LED芯片的尺寸可以为0.54mm×0.24mm×0.15mm,发光源202为由多个mini-LED芯片组成的群组。在此基础上,又示例性的,将微型LED芯片2021焊接于电路板201上时,可以使相邻的微型LED芯片2021的侧边近似于贴合在一起,两个微型LED芯片2021之间只需留出必要的安装空间(焊盘之间的间隙)即可,以使得发光源202出射的光束更加集中,如此,相同数量的微型LED芯片2021,可使用条状的电路板代替板状电路板,节省电路板的使用量,降低背光模组100的成本。又示例性的,如图5所示,背光模组100中灯条2的数量为多个,等间距地分布于背光模组100内,保证显示面板200的显示效果。又示例性的,背光模组100可以进行分区,一个发光源202为一个区,一个发光源202内的多个微型LED芯片2021可以全部串联,或者,多个微型LED芯片2021也可以分成并联的若干组,每组内的微型LED芯片2021串联。如此,可对背光模组100各分区内的微型LED芯片2021进行独立的区域调光,由此实现更为精细化的动态控制,提升显示的动态对比度。Based on this, the plurality of light-emitting sources 202 are disposed on the carrying surface 2011 of the circuit board 201 , and the plurality of light-emitting sources 202 are arranged at intervals along the extension direction of the circuit board 201 . The light source 202 includes a plurality of micro light emitting diode LED chips 2021, and the plurality of micro LED chips 2021 are electrically connected to the circuit board 201. For example, the micro LED chip 2021 can be welded on the exposed pad of the circuit board 201 through SMT (Surface Mounted Technology). After welding, the micro LED chip 2021 can be controlled by controlling the driving signal of the circuit board 201. glow. As another example, the micro LED chip 2021 can be a mini-LED chip. For example, the size of the micro LED chip can be 0.54mm×0.24mm×0.15mm, and the light source 202 is a group composed of multiple mini-LED chips. On this basis, as an example, when the micro LED chips 2021 are welded to the circuit board 201, the sides of the adjacent micro LED chips 2021 can be approximately fit together, and the space between the two micro LED chips 2021 Just leave the necessary installation space (the gap between the pads) to make the light beam emitted by the light source 202 more concentrated. In this way, the same number of micro LED chips 2021 can be replaced by strip-shaped circuit boards. circuit board, saving the usage of the circuit board and reducing the cost of the backlight module 100. As another example, as shown in FIG. 5 , the number of light bars 2 in the backlight module 100 is multiple, and they are equally spaced in the backlight module 100 to ensure the display effect of the display panel 200 . As another example, the backlight module 100 can be partitioned, and one light source 202 is a zone. The multiple micro LED chips 2021 in one light source 202 can all be connected in series, or the multiple micro LED chips 2021 can also be divided into parallel ones. There are several groups, and the micro LED chips in each group are connected in series. In this way, the micro LED chips 2021 in each partition of the backlight module 100 can be independently regionally dimmed, thereby achieving more refined dynamic control and improving the dynamic contrast of the display.
上述将多个微型LED芯片2021贴装在一起形成群组,在微型LED芯片2021的数量相同的情况下,相对比采用灯板的设计,灯条的设计节省了电路板201的使用量,但是相临的两个发光源202之间的间距变大,使得两个发光源202入射至扩散板1上的光斑的重叠面积变小,导致发光源202出射的光线达到扩散板1时并不能得到充分混光,因而会影响显示面板200上画面的显示效果。基于此,多个光学透镜203设置于电路板201靠近扩散板1的入光面的一侧。一个光学透镜203罩设于一个发光源202上,光学透镜203用于对发光源201出射的光线进行散射。如此,可增大发光源202出射的光线的发散角度,使相邻的两个发光源202入射至扩散板1上的光斑的重叠面积变大,进而使发光源202出射的光束到达扩散板1时混合充分,保证显示面板200上画面的显示效果。示例性的,光学透镜203可以为折射型光学透镜,折射型光学透镜面向发光源202的一侧具有容纳腔,发光源202位于容纳腔在电路板201上的正投影区域内。又示例性的,光学透镜203可以为中心对称的形状,如此,可以将发光源202 出射的各个方向的光线进行匀化。又示例性的,光学透镜203可以通过支架粘接于电路板201上。The above-mentioned multiple micro LED chips 2021 are mounted together to form a group. When the number of micro LED chips 2021 is the same, compared with the design of the light board, the design of the light bar saves the usage of the circuit board 201, but The distance between two adjacent light-emitting sources 202 becomes larger, so that the overlapping area of the light spots incident on the diffusion plate 1 from the two light-emitting sources 202 becomes smaller. As a result, the light emitted from the light-emitting sources 202 cannot be obtained when it reaches the diffusion plate 1. The light is fully mixed, thus affecting the display effect of the image on the display panel 200 . Based on this, a plurality of optical lenses 203 are disposed on the side of the circuit board 201 close to the light incident surface of the diffuser plate 1 . An optical lens 203 is mounted on a light source 202, and the optical lens 203 is used to scatter the light emitted from the light source 201. In this way, the divergence angle of the light emitted by the light source 202 can be increased, so that the overlapping area of the light spots incident on the diffuser plate 1 from the two adjacent light sources 202 is increased, so that the light beam emitted by the light source 202 reaches the diffuser plate 1 The mixture is fully mixed to ensure the display effect of the picture on the display panel 200. For example, the optical lens 203 may be a refractive optical lens. The refractive optical lens has an accommodation cavity on the side facing the light source 202 . The light source 202 is located in the orthographic projection area of the accommodation cavity on the circuit board 201 . As another example, the optical lens 203 may have a centrally symmetrical shape, so that the light rays emitted from the light source 202 in various directions can be homogenized. As another example, the optical lens 203 can be bonded to the circuit board 201 through a bracket.
综上所述,本申请提供的背光模组100,通过将多个微型LED芯片2021设置于电路板201的承载面2011上并与电路板201电连接,形成群组式的发光源202,多个发光源202依次间隔设置于电路板201上,因此,在保证光通量的情况下,相对于将多颗微型LED芯片2021间距均匀地排布于整张板式的电路板201上,可以增大相邻的两个发光源202之间的排布间距,因而可以使电路板201呈条状形成灯条2,通过多个灯条2相互间隔地并排排布形成背光模组100的光源。如此,可以减少电路板201的使用量,降低背光模组100的成本,进而降低显示设备300的成本。To sum up, the backlight module 100 provided by this application disposes multiple micro LED chips 2021 on the carrying surface 2011 of the circuit board 201 and is electrically connected to the circuit board 201 to form a group of light sources 202. The light sources 202 are arranged at intervals on the circuit board 201 in sequence. Therefore, while ensuring the luminous flux, compared to arranging multiple micro LED chips 2021 evenly on the entire circuit board 201, the phase difference can be increased. The arrangement spacing between two adjacent light sources 202 allows the circuit board 201 to be in a strip shape to form the light bar 2, and the plurality of light bars 2 are spaced apart and arranged side by side to form the light source of the backlight module 100. In this way, the usage of the circuit board 201 can be reduced, and the cost of the backlight module 100 can be reduced, thereby reducing the cost of the display device 300 .
此外,通过在发光源202上罩设光学透镜203以对发光源202出射光线进行散射,可以增大发光源202出射光线的发散角,保证相邻的两个发光源202出射的光线到达扩散板1时的混光效果,进而保证显示设备300显示的视觉效果,从而在降低成本的情况下,保证显示设备300的可靠性。In addition, by covering the light-emitting source 202 with an optical lens 203 to scatter the light emitted from the light-emitting source 202, the divergence angle of the light emitted from the light-emitting source 202 can be increased to ensure that the light emitted from two adjacent light-emitting sources 202 reaches the diffusion plate. 1 time mixed light effect, thereby ensuring the visual effect displayed by the display device 300, thereby ensuring the reliability of the display device 300 while reducing costs.
如图6所示,常规的SMD灯珠202a具有封装支架2021a,因此,灯珠202a只从出光面2022a单面出光,因此,光学透镜203罩设于灯珠202a上时,灯珠202a出射的光线能够全部进入光学透镜203中(如图7所示)。由于采用COB设计方案的微型LED芯片2021没有进行SMD封装,因此,发光源202具有五面发光的特点,发光源202侧壁出射的光线无法有效地进入光学透镜203的入光面,将从电路板201和光学透镜203之间的缝隙射出(如图8所示),光线会被发光源202周边的其他器件反射至显示面板200,进而在显示面板200的显示区域产生严重的杂散光,影响显示效果。As shown in Figure 6, the conventional SMD lamp bead 202a has a packaging bracket 2021a. Therefore, the lamp bead 202a only emits light from one side of the light emitting surface 2022a. Therefore, when the optical lens 203 is covered on the lamp bead 202a, the light emitted from the lamp bead 202a All light can enter the optical lens 203 (as shown in Figure 7). Since the micro LED chip 2021 using the COB design scheme is not SMD packaged, the light source 202 has the characteristics of five-sided light emitting. The light emitted from the side wall of the light source 202 cannot effectively enter the light incident surface of the optical lens 203 and will be removed from the circuit. Emitted from the gap between the plate 201 and the optical lens 203 (as shown in Figure 8), the light will be reflected by other devices around the light source 202 to the display panel 200, thereby generating serious stray light in the display area of the display panel 200, affecting display effect.
基于此,为了避免杂散光影响显示设备300的显示效果,作为一种实施方式,参见图8(图8为图4中A处放大图),在一些实施例中,灯条2还包括多个导光支架204。导光支架204设置于电路板201的承载面2011上。示例性的,导光支架204可以通过固定胶粘接于电路板201的承载面2011上;或者,导光支架204也可以通过SMT焊接的方式固定于电路板201的承载面2011上。又示例性的,导光支架204可以直接连接于电路板201的基板上;或者,导光支架204也可以间接连接于电路板201的基板上,即导光支架204可以直接连接于绝缘层上。在此基础上,导光支架204开设有贯穿导光支架204的第一通孔2041,一个发光源202位于一个导光支架204的第一通孔2041内;第一通孔2041的内侧壁为反射面,反射面用于将来自发光源202的至少部分光线反射至光学透镜203。如此,可以使发光源202出射的光线经过光学透镜203入射至扩散板1内,防止发光源202侧面出射的光线从电路板201和光学透镜203之间的缝隙射出,在显示面板200的显示区域产生严重的杂散光,影响显示效果。示例性的,导光支架204的材质可以为树脂,反射率可以大于或等于95%;或者,导光支架204的材质也可以为金属,第一通孔2041的内侧壁涂覆反射材料(如白油),均可以应用。又示例性的,导光支架204的反射面可以直接将来自发光源202的光线全部反射至光学透镜203内;或者,导光支架204的反射面也可以间接将来自发光源202的光线反射至光学透镜203内,如导光支架204的反射面可以 先将来自发光源202的光线反射回发光源202,经过反射面和发光源202之间的多次反射,光线投射至光学透镜203内,均可以应用。又示例性的,导光支架204的形状可以为环形,便于设置于光学透镜203和发光源202之间;或者,导光支架204的形状也可以为其他形状,同样可以应用。Based on this, in order to prevent stray light from affecting the display effect of the display device 300, as an implementation manner, see FIG. 8 (FIG. 8 is an enlarged view of A in FIG. 4). In some embodiments, the light bar 2 also includes a plurality of Light guide bracket 204. The light guide bracket 204 is disposed on the carrying surface 2011 of the circuit board 201. For example, the light guide bracket 204 can be bonded to the bearing surface 2011 of the circuit board 201 through fixing glue; or the light guide bracket 204 can also be fixed to the bearing surface 2011 of the circuit board 201 through SMT welding. As another example, the light guide bracket 204 can be directly connected to the substrate of the circuit board 201; or the light guide bracket 204 can also be indirectly connected to the substrate of the circuit board 201, that is, the light guide bracket 204 can be directly connected to the insulating layer. . On this basis, the light guide bracket 204 is provided with a first through hole 2041 penetrating the light guide bracket 204. A light source 202 is located in the first through hole 2041 of the light guide bracket 204; the inner wall of the first through hole 2041 is The reflective surface is used to reflect at least part of the light from the light source 202 to the optical lens 203 . In this way, the light emitted from the light source 202 can be incident into the diffusion plate 1 through the optical lens 203, and the light emitted from the side of the light source 202 can be prevented from emitting from the gap between the circuit board 201 and the optical lens 203, and in the display area of the display panel 200. Produces serious stray light, affecting the display effect. For example, the material of the light guide bracket 204 can be resin, and the reflectivity can be greater than or equal to 95%; or the material of the light guide bracket 204 can also be metal, and the inner wall of the first through hole 2041 is coated with a reflective material (such as white oil), can be applied. As another example, the reflective surface of the light guide bracket 204 can directly reflect all the light from the light source 202 into the optical lens 203; or, the reflective surface of the light guide bracket 204 can also indirectly reflect the light from the light source 202 to the optical lens. In 203, for example, the reflective surface of the light guide bracket 204 can first reflect the light from the light source 202 back to the light source 202. After multiple reflections between the reflective surface and the light source 202, the light is projected into the optical lens 203, which can be applied. . As another example, the shape of the light guide bracket 204 can be an annular shape, so as to be conveniently arranged between the optical lens 203 and the light source 202; or the shape of the light guide bracket 204 can also be other shapes, which are also applicable.
为了避免杂散光影响显示设备300的显示效果,作为另一种实施方式,参见图10(图10为图9中B处放大图),在一些实施例中,灯条2还包括板状结构205。板状结构205设置于电路板201的承载面2011上。示例性的,板状结构205可以为用于加工PCB的铝基板,铝基板的平整性好,通过粘接胶贴合于电路板201的承载面2011上;或者,板状结构205也可以为其他材质,如亚克力板,通过粘接胶贴合于电路板201的承载面2011上,同样可以应用。在此基础上,板状结构205开设有多个贯穿板状结构205的第二通孔2051,一个发光源202位于一个板状结构205的第二通孔2051内。第二通孔2051的内侧壁为反射面,反射面用于将来自发光源202的至少部分光线反射至光学透镜203。如此,可以使发光源202出射的光线经过光学透镜203入射至扩散板1内,防止发光源202侧面出射的光线从电路板201和光学透镜203之间的缝隙射出,在显示面板200的显示区域产生严重的杂散光,影响显示效果。示例性的,第二通孔2051的内侧壁可以通过涂覆反射材料(如白油)形成反射面。又示例性的,第二通孔2051的反射面可以直接将来自发光源202的光线全部反射至光学透镜203内;或者,第二通孔2051的反射面也可以间接将来自发光源202的光线反射至光学透镜203内,如第二通孔2051的反射面可以先将来自发光源202的光线反射回发光源202,经过反射面和发光源202之间的多次反射,光线投射至光学透镜203内,均可以应用。In order to prevent stray light from affecting the display effect of the display device 300, as another implementation manner, referring to Figure 10 (Figure 10 is an enlarged view of B in Figure 9), in some embodiments, the light bar 2 also includes a plate-like structure 205 . The plate-like structure 205 is disposed on the carrying surface 2011 of the circuit board 201. For example, the plate-like structure 205 can be an aluminum substrate used for processing PCBs. The aluminum substrate has good flatness and is attached to the bearing surface 2011 of the circuit board 201 through adhesive glue; or the plate-like structure 205 can also be Other materials, such as acrylic boards, which are bonded to the bearing surface 2011 of the circuit board 201 through adhesive glue, can also be used. On this basis, the plate structure 205 has a plurality of second through holes 2051 penetrating the plate structure 205 , and a light source 202 is located in the second through hole 2051 of the plate structure 205 . The inner wall of the second through hole 2051 is a reflective surface, and the reflective surface is used to reflect at least part of the light from the light source 202 to the optical lens 203 . In this way, the light emitted from the light source 202 can be incident into the diffusion plate 1 through the optical lens 203, and the light emitted from the side of the light source 202 can be prevented from emitting from the gap between the circuit board 201 and the optical lens 203, and in the display area of the display panel 200. Produces serious stray light, affecting the display effect. For example, the inner wall of the second through hole 2051 may be coated with a reflective material (such as white oil) to form a reflective surface. As another example, the reflective surface of the second through hole 2051 can directly reflect all the light from the light source 202 into the optical lens 203; or, the reflective surface of the second through hole 2051 can also indirectly reflect the light from the light source 202 into the optical lens 203. In the optical lens 203, the reflective surface such as the second through hole 2051 can first reflect the light from the light source 202 back to the light source 202. After multiple reflections between the reflective surface and the light source 202, the light is projected into the optical lens 203. All can be applied.
为了避免杂散光影响显示设备300的显示效果,作为又一种实施方式,参见图12(图12为图11中C处放大图),在一些实施例中,电路板201开设有多个凹槽2012,一个发光源202设置于一个凹槽2012的底壁上。需要说明的是,此时,凹槽2012的底壁为承载面2011。凹槽2012的侧壁为反射面,反射面用于将来自发光源202的至少部分光线反射至光学透镜203。如此,可以使发光源202出射的光线经过光学透镜203入射至扩散板1内,防止发光源202侧面出射的光线从电路板201和光学透镜203之间的缝隙射出,在显示面板200的显示区域产生严重的杂散光,影响显示效果。示例性的,凹槽2012的侧壁可以通过涂覆反射材料(如白油)形成反射面。又示例性的,凹槽2012的反射面可以直接将来自发光源202的光线全部反射至光学透镜203内;或者,凹槽2012的反射面也可以间接将来自发光源202的光线反射至光学透镜203内,如凹槽2012的反射面可以先将来自发光源202的光线反射回发光源202,经过反射面和发光源202之间的多次反射,光线投射至光学透镜203内,均可以应用。In order to prevent stray light from affecting the display effect of the display device 300, as another implementation manner, see FIG. 12 (FIG. 12 is an enlarged view of C in FIG. 11). In some embodiments, the circuit board 201 is provided with multiple grooves. 2012, a light source 202 is disposed on the bottom wall of a groove 2012. It should be noted that at this time, the bottom wall of the groove 2012 is the bearing surface 2011. The side walls of the groove 2012 are reflective surfaces, and the reflective surfaces are used to reflect at least part of the light from the light source 202 to the optical lens 203 . In this way, the light emitted from the light source 202 can be incident into the diffusion plate 1 through the optical lens 203, and the light emitted from the side of the light source 202 can be prevented from emitting from the gap between the circuit board 201 and the optical lens 203, and in the display area of the display panel 200. Produces serious stray light, affecting the display effect. For example, the side walls of the groove 2012 may be coated with a reflective material (such as white oil) to form a reflective surface. As another example, the reflective surface of the groove 2012 can directly reflect all the light from the light source 202 into the optical lens 203; or, the reflective surface of the groove 2012 can also indirectly reflect the light from the light source 202 into the optical lens 203. For example, the reflective surface of the groove 2012 can first reflect the light from the light source 202 back to the light source 202. After multiple reflections between the reflective surface and the light source 202, the light is projected into the optical lens 203, which can be applied.
为了保证混光效果及便于加工形成反射面,在一些实施例中,电路板201的承载面2011平行于扩散板1。反射面靠近扩散板1的入光面的边缘为第一边缘,第一边缘上各点与电路板201的承载面2011之间的距离相同。如此,可使得发光源202直接入射至光学透镜203中的光线以及经过反射面反射至光学透镜203的光线,经光学透镜203折射后投射至扩散板1的光斑可以呈中心对称的 形状,使得所有的发光源202出射的光线最终在扩散板1处混光均匀,保证显示面板200的显示效果。示例性的,当反射面为导光支架204的第一通孔2041内侧壁时,导光支架204沿第一通孔2041的轴线方向的两个端面可以为相互平行的两个平面,便于设计及加工导光支架204。又示例性的,当反射面为板状结构205上的第二通孔2051的侧壁时,板状结构205可以为平板,便于选材及加工第二通孔2051,同时便于将板状结构205贴合于电路板201上。又示例性的,当反射面为电路板201上的凹槽2012的侧壁时,凹槽2012的底壁可以平行于扩散板1,即凹槽2012各处深度相同,便于加工凹槽2012。In order to ensure the light mixing effect and facilitate processing to form a reflective surface, in some embodiments, the carrying surface 2011 of the circuit board 201 is parallel to the diffusion plate 1 . The edge of the reflective surface close to the light incident surface of the diffuser plate 1 is the first edge, and the distance between each point on the first edge and the carrying surface 2011 of the circuit board 201 is the same. In this way, the light from the light source 202 that directly enters the optical lens 203 and the light that is reflected to the optical lens 203 through the reflective surface can be refracted by the optical lens 203 and projected to the diffuser plate 1 in a centrally symmetrical shape, so that all The light emitted from the light source 202 is finally mixed evenly at the diffusion plate 1 to ensure the display effect of the display panel 200. For example, when the reflective surface is the inner wall of the first through hole 2041 of the light guide bracket 204, the two end surfaces of the light guide bracket 204 along the axis direction of the first through hole 2041 can be two planes parallel to each other, which facilitates design. and processing the light guide bracket 204. As another example, when the reflective surface is the side wall of the second through hole 2051 on the plate-like structure 205, the plate-like structure 205 can be a flat plate, which facilitates material selection and processing of the second through hole 2051, and also facilitates the plate-like structure 205 Fitted to the circuit board 201. As another example, when the reflective surface is the side wall of the groove 2012 on the circuit board 201, the bottom wall of the groove 2012 can be parallel to the diffusion plate 1, that is, the depth of the groove 2012 is the same everywhere, which facilitates processing of the groove 2012.
为了增加对光线的利用率,以及延长微型LED的使用寿命,在一些实施例中,反射面远离扩散板1的入光面的边缘为第二边缘。示例性的,如图8所示,当反射面为导光支架204的第一通孔2041内侧壁时,第二边缘可以为第一通孔2041靠近电路板201的开口边缘。又示例性的,如图10所示,当反射面为板状结构205上的第二通孔2051的侧壁时,第二边缘可以为第二通孔2051靠近电路板201的开口边缘。又示例性的,如图12所示,当反射面为电路板201上的凹槽2012的侧壁时,第二边缘可以为凹槽2012的侧壁与底壁的相接线。又示例性的,第二边缘可以与电路板201的承载面2011相贴合,如此,可以防止发光源202侧面出射的光线从第二边缘与电路板201之间的缝隙漏出,在显示面板200的显示区域产生杂散光。在此基础上,第一边缘上距离最大的两点之间的距离,大于第二边缘上距离最大的两点之间的距离。如此,可使得从发光源202侧面出射至反射面的部分光线,可以通过反射面反射至光学透镜203中,经光学透镜203折射后,投射至扩散板1上,从而提高了光线的利用率,进而提高了显示面板200的亮度。此外,还可以防止这部分光线反复穿透微型LED芯片,对LED芯片造成过度损耗,因而延长了发光源202的发光寿命。In order to increase the utilization of light and extend the service life of the micro LED, in some embodiments, the edge of the reflective surface away from the light incident surface of the diffusion plate 1 is the second edge. For example, as shown in FIG. 8 , when the reflective surface is the inner wall of the first through hole 2041 of the light guide bracket 204 , the second edge may be the edge of the opening of the first through hole 2041 close to the circuit board 201 . For another example, as shown in FIG. 10 , when the reflective surface is the side wall of the second through hole 2051 on the plate-like structure 205 , the second edge may be the edge of the opening of the second through hole 2051 close to the circuit board 201 . For another example, as shown in FIG. 12 , when the reflective surface is the side wall of the groove 2012 on the circuit board 201 , the second edge may be the connecting line between the side wall and the bottom wall of the groove 2012 . As another example, the second edge can be in contact with the carrying surface 2011 of the circuit board 201. In this way, the light emitted from the side of the light source 202 can be prevented from leaking from the gap between the second edge and the circuit board 201. In the display panel 200 Stray light is generated in the display area. On this basis, the distance between the two points with the largest distance on the first edge is greater than the distance between the two points with the largest distance on the second edge. In this way, part of the light emitted from the side of the light source 202 to the reflective surface can be reflected into the optical lens 203 through the reflective surface, refracted by the optical lens 203, and then projected onto the diffusion plate 1, thus improving the utilization rate of light. This further improves the brightness of the display panel 200 . In addition, it can also prevent this part of light from repeatedly penetrating the micro LED chip and causing excessive loss to the LED chip, thereby extending the luminous life of the light source 202.
为了防止杂散光影响显示设备300的显示效果,具体地,在一些实施例中,沿垂直于电路板201的承载面2011的方向,反射面的第一边缘上各点与承载面2011之间的距离大于发光源202的高度。示例性的,如图8所示,当反射面为导光支架204的第一通孔2041内侧壁时,导光支架204的高度大于发光源202的高度。又示例性的,如图10所示,当反射面为板状结构205上的第二通孔2051的侧壁时,板状结构205的厚度大于发光源202的高度。又示例性的,如图12所示,当反射面为电路板201上的凹槽2012的侧壁时,凹槽2012的深度大于发光源202的高度。如此,发光源202侧面出射的全部光线不会从电路板201与光学透镜203之间的缝隙中漏出,防止在显示面板200的显示区域产生杂散光而影响显示效果。In order to prevent stray light from affecting the display effect of the display device 300, specifically, in some embodiments, along the direction perpendicular to the bearing surface 2011 of the circuit board 201, the distance between each point on the first edge of the reflective surface and the bearing surface 2011 is The distance is greater than the height of the light source 202 . For example, as shown in FIG. 8 , when the reflective surface is the inner wall of the first through hole 2041 of the light guide bracket 204 , the height of the light guide bracket 204 is greater than the height of the light source 202 . For another example, as shown in FIG. 10 , when the reflective surface is the side wall of the second through hole 2051 on the plate-like structure 205 , the thickness of the plate-like structure 205 is greater than the height of the light source 202 . For another example, as shown in FIG. 12 , when the reflective surface is the side wall of the groove 2012 on the circuit board 201 , the depth of the groove 2012 is greater than the height of the light source 202 . In this way, all the light emitted from the side of the light source 202 will not leak from the gap between the circuit board 201 and the optical lens 203, preventing stray light from being generated in the display area of the display panel 200 and affecting the display effect.
为了保证混光效果,具体地,在一些实施例中,反射面为旋转曲面,旋转曲面的旋转轴垂直于电路板201的承载面2011,旋转曲面的母线为直线或弧线。当旋转曲面的母线为直线时,反射面为圆锥面;当旋转曲面的母线为弧线(如图17所示)时,弧线可以为开口朝向扩散板1的抛物线,或者,弧线也可以为向远离旋转轴方向凸起的圆弧线,本申请对弧线的具体参数不作限定。即反射面在平行于扩散板1的各个截面上的图形呈圆形,可以使得由发光源202出射的光线以及反射面反射的光线可以呈圆形投射至光学透镜203中;由 于光学透镜203可以为中心对称的形状,因此,可以将接收到的光线均匀地扩散为面积较大的圆形光斑,如此,可以使得所有的发光源202出射的光线最终在扩散板1处混光均匀,保证显示面板200的显示效果。示例性的,如图13(图13为图8的俯视图)所示,当反射面为导光支架204的第一通孔2041内侧壁时,第一通孔2041为锥形孔。又示例性的,如图14(图14为图10的俯视图)所示,当反射面为板状结构205上的第二通孔2051的侧壁时,第二通孔2051可以为锥形孔。又示例性的,当反射面为电路板201上的凹槽2012的侧壁时,凹槽2012可以为锥形槽。In order to ensure the light mixing effect, specifically, in some embodiments, the reflective surface is a curved surface of rotation, the rotation axis of the curved surface of rotation is perpendicular to the bearing surface 2011 of the circuit board 201, and the generatrix of the curved surface of rotation is a straight line or an arc. When the generating line of the rotating curved surface is a straight line, the reflecting surface is a conical surface; when the generating line of the rotating curved surface is an arc (as shown in Figure 17), the arc can be a parabola with the opening facing the diffusion plate 1, or the arc can also be It is a circular arc line convex in the direction away from the rotation axis. This application does not limit the specific parameters of the arc line. That is, the pattern of the reflective surface on each cross section parallel to the diffusion plate 1 is circular, so that the light emitted by the light source 202 and the light reflected by the reflective surface can be projected into the optical lens 203 in a circular shape; because the optical lens 203 can It has a centrally symmetrical shape. Therefore, the received light can be evenly diffused into a larger circular light spot. In this way, all the light emitted from the light source 202 can finally be mixed evenly at the diffusion plate 1 to ensure that the display The display effect of panel 200. For example, as shown in Figure 13 (Figure 13 is a top view of Figure 8), when the reflective surface is the inner wall of the first through hole 2041 of the light guide bracket 204, the first through hole 2041 is a tapered hole. For another example, as shown in Figure 14 (Figure 14 is a top view of Figure 10), when the reflective surface is the side wall of the second through hole 2051 on the plate-like structure 205, the second through hole 2051 can be a tapered hole. . As another example, when the reflective surface is the side wall of the groove 2012 on the circuit board 201, the groove 2012 may be a tapered groove.
在此基础上,如图15所示,在一些实施例中,以反射面为圆锥面为例,当第一边缘的直径R1确定时,为保证大部分光线经反射面反射后可以直接进入光学透镜203,反射面与电路板201的承载面之间的夹角θ应尽可能小,也即第一边缘的直径R1确定的情况下,第二边缘应尽量靠近发光源202的底部。当反射面的第二边缘与发光源202的底部相接时,第二边缘的直径R2与发光源202在平行于扩散板1的方向上的最大尺寸相等,此时,夹角θ满足下述公式(1),其中H为第一边缘上各点与电路板201的承载面2011之间的距离。On this basis, as shown in Figure 15, in some embodiments, taking the reflective surface as a conical surface as an example, when the diameter R1 of the first edge is determined, in order to ensure that most of the light can directly enter the optical system after being reflected by the reflective surface The angle θ between the reflective surface of the lens 203 and the carrying surface of the circuit board 201 should be as small as possible, that is, when the diameter R1 of the first edge is determined, the second edge should be as close to the bottom of the light source 202 as possible. When the second edge of the reflective surface is connected to the bottom of the light source 202, the diameter R2 of the second edge is equal to the maximum size of the light source 202 in the direction parallel to the diffusion plate 1. At this time, the included angle θ satisfies the following Formula (1), where H is the distance between each point on the first edge and the bearing surface 2011 of the circuit board 201 .
Figure PCTCN2022140805-appb-000001
Figure PCTCN2022140805-appb-000001
通常,经过光学透镜203折射之后的光线需要满足一定的光斑大小,从而扩散板1可以对光斑进行扩散,得到显示所需的光线,在实际应用中,可以通过反射面的设计参数对投射至光学透镜202的光线的发散角度进行限制,以对射出光学透镜203的光斑大小,也即入射至扩散板1的光斑大小进行限制。实际应用中,可以设定投射至光学透镜203的光线的发散角度小于或等于120度,具体地,如图16所示,当反射面的第二边缘与发光源202的底部相接时,由于投射至光学透镜202的光线的发散角度小于或等于120度,因此,投射至光学透镜202的光线的临界光线的出射角度φ应小于或等于60度,此时,出射角度φ满足下述公式(2)。Usually, the light refracted by the optical lens 203 needs to meet a certain spot size, so that the diffusion plate 1 can diffuse the spot to obtain the light required for display. In practical applications, the light can be projected to the optical system through the design parameters of the reflective surface. The divergence angle of the light rays from the lens 202 is limited to limit the size of the light spot that exits the optical lens 203 , that is, the size of the light spot that is incident on the diffuser plate 1 . In practical applications, the divergence angle of the light projected to the optical lens 203 can be set to be less than or equal to 120 degrees. Specifically, as shown in Figure 16, when the second edge of the reflective surface is connected to the bottom of the light source 202, due to The divergence angle of the light projected to the optical lens 202 is less than or equal to 120 degrees. Therefore, the critical ray exit angle φ of the light projected to the optical lens 202 should be less than or equal to 60 degrees. At this time, the exit angle φ satisfies the following formula ( 2).
φ=90°-θ      (2)φ=90°-θ (2)
对公式(1)和公式(2)求解可以得到公式(3)。Solving formula (1) and formula (2) can obtain formula (3).
R1≤3.466×H+R2   (3)R1≤3.466×H+R2 (3)
示例性的,如图13所示,组成发光源202的微型LED芯片2021的尺寸可以为0.54mm×0.24mm×0.15mm,每个发光源202由8颗微型LED芯片2021组成,发光源2021的尺寸为1.08×0.96×0.15mm,则反射面的参数可以设置为:第二边缘直径R2=0.75mm,第一边缘上各点与电路板201的承载面2011之间的距离为0.39mm,第一边缘直径R1=2.1mm。需要说明的是,当反射面的旋转母线为弧线时,此公式同样适用。For example, as shown in Figure 13, the size of the micro-LED chips 2021 that make up the light-emitting source 202 can be 0.54mm×0.24mm×0.15mm. Each light-emitting source 202 is composed of 8 micro-LED chips 2021. The size of the light-emitting source 2021 The size is 1.08×0.96×0.15mm, then the parameters of the reflective surface can be set as follows: the second edge diameter R2=0.75mm, the distance between each point on the first edge and the bearing surface 2011 of the circuit board 201 is 0.39mm, An edge diameter R1=2.1mm. It should be noted that this formula is also applicable when the rotation generator of the reflecting surface is an arc.
参见图13,在一些实施例中,发光源202内的多个微型LED芯片2021对称设置。示例性的,微型LED芯片2021可以呈矩形,多个微型LED芯片2021对称设置,且组成的发光源202远离电路板201的主出光面近似于正方形,如此,可使得发光源202出光的光型尽可能地中心对称,保证混光效果。 同时,便于在电路板201上布局用于焊接微型LED芯片2021的焊盘,便于批量加工。Referring to Figure 13, in some embodiments, multiple micro LED chips 2021 within the light source 202 are symmetrically arranged. For example, the micro LED chip 2021 can be in a rectangular shape. Multiple micro LED chips 2021 are symmetrically arranged, and the main light emitting surface of the light source 202 formed away from the circuit board 201 is approximately square. In this way, the light pattern of the light emitted by the light emitting source 202 can be achieved. Be as symmetrical as possible about the center to ensure the light mixing effect. At the same time, it is convenient to lay out the pads for welding the micro LED chips 2021 on the circuit board 201, which facilitates batch processing.
实际应用中为提升液晶显示设备的对比度,基于局域调光技术的多分区背光技术应运而生。该技术通过将整个背光源划分为若干个可独立驱动的区域,根据图像显示亮度自动调整该区域的背光亮度,实现显示画面对比度提升,进而提升画质。In practical applications, in order to improve the contrast of LCD devices, multi-zone backlight technology based on local dimming technology has emerged. This technology divides the entire backlight source into several areas that can be driven independently, and automatically adjusts the backlight brightness of the area according to the image display brightness to improve the contrast of the display screen and thereby improve the image quality.
目前背光源的最小的分区单元为一个区域只有一个光源,即每个光源均单独控制。因此单分区内的光源的满功率工作状态即为该区亮度的上线,无法再对分区进一步细化,单分区内的亮度调节区间相对较小。为解决上述问题,本申请实施例对背光模组进行改进,具体如图18所示,本申请实施例中的背光模组采用直下式背光模组,用于在整个出光面内均匀的发出光线,为显示面板提供亮度充足且分布均匀的光线,以使显示面板可以正常显示影像。At present, the smallest partition unit of a backlight is that there is only one light source in an area, that is, each light source is controlled individually. Therefore, the full power working state of the light source in a single partition is the upper line of the brightness of that area, and the partition cannot be further refined. The brightness adjustment range in a single partition is relatively small. In order to solve the above problems, the embodiment of the present application improves the backlight module, as shown in Figure 18. The backlight module in the embodiment of the present application adopts a direct-type backlight module to emit light evenly throughout the entire light-emitting surface. , providing the display panel with sufficient brightness and evenly distributed light so that the display panel can display images normally.
显示面板200位于背光模组100的出光侧,显示面板的形状与尺寸通常与背光模组相匹配。通常情况下显示面板200可以设置为矩形,包括天侧、地侧、左侧和右侧,其中天侧和地侧相对,左侧和右侧相对,天侧分别与左侧的一端和右侧的一侧相连,地侧分别与左侧的另一端和右侧的另一端相连。The display panel 200 is located on the light emitting side of the backlight module 100, and the shape and size of the display panel usually match the backlight module. Normally, the display panel 200 can be configured as a rectangle, including the sky side, the ground side, the left side and the right side, where the sky side and the ground side are opposite, the left side and the right side are opposite, and the sky side is respectively connected to one end and right side of the left side. The ground side is connected to the other end on the left side and the other end on the right side respectively.
显示面板200为透射型显示面板,能够对光的透射率进行调制,但本身并不发光。显示面板200具有多个呈阵列排布的像素单元,每个像素单元都可以独立的控制背光模组100入射到该像素单元的光线透过率和色彩,以使全部像素单元透过的光线构成显示的图像。The display panel 200 is a transmissive display panel that can modulate the transmittance of light but does not emit light itself. The display panel 200 has a plurality of pixel units arranged in an array. Each pixel unit can independently control the transmittance and color of the light incident on the pixel unit by the backlight module 100, so that the light transmitted by all the pixel units constitutes displayed image.
图19为本申请实施例提供的背光模组的截面结构示意图。如图19所示,背光模组100包括:承载面2021、电路板201、发光源202、扩散板1和光学膜片3。Figure 19 is a schematic cross-sectional structural diagram of a backlight module provided by an embodiment of the present application. As shown in FIG. 19 , the backlight module 100 includes: a carrying surface 2021 , a circuit board 201 , a light source 202 , a diffusion plate 1 and an optical film 3 .
承载面2021位于背光模组的底部,具有支撑和承载作用。承载面2021通常情况下为一方形结构,当应用于异形显示设备时,其形状适应于显示设备的形状。承载面2021包括天侧、地侧、左侧和右侧。其中天侧和地侧相对,左侧和右侧相对,天侧分别与左侧的一端和右侧的一侧相连,地侧分别与左侧的另一端和右侧的另一端相连。The bearing surface 2021 is located at the bottom of the backlight module and has a supporting and bearing role. The bearing surface 2021 is usually a square structure. When applied to a special-shaped display device, its shape is adapted to the shape of the display device. The bearing surface 2021 includes the sky side, the ground side, the left side and the right side. The sky side is opposite to the ground side, the left side is opposite to the right side, the sky side is connected to one end of the left side and one side of the right side respectively, and the ground side is connected to the other end of the left side and the other end of the right side respectively.
承载面2021的材质采用铝、铁、铝合金或铁合金等。承载面2021用于支撑电路板201,以及支撑固定扩散板1和光学膜片3等部件的边缘位置,承载面2021还对电路板201起到散热的作用。The material of the bearing surface 2021 is aluminum, iron, aluminum alloy or iron alloy. The bearing surface 2021 is used to support the circuit board 201 and to support and fix the edge positions of components such as the diffusion plate 1 and the optical film 3. The bearing surface 2021 also plays a role in heat dissipation for the circuit board 201.
在本申请实施例中,背光模组为直下式背光模组,电路板201位于承载面2021之上。通常情况下,电路板201整体可呈方形或矩形,在此不做限定。In the embodiment of the present application, the backlight module is a direct backlight module, and the circuit board 201 is located on the carrying surface 2021 . Normally, the circuit board 201 may be in a square or rectangular shape as a whole, which is not limited here.
电路板201可以采用印刷电路板(Printed Circuit Board,简称PCB),在应用于柔性显示设备时,电路板201也可以采用柔性电路板。The circuit board 201 can be a Printed Circuit Board (PCB for short). When applied to a flexible display device, the circuit board 201 can also be a flexible circuit board.
电路板201用于向发光源202提供驱动信号。发光源202位于电路板201上,与电路板201电连接。在具体实施时,发光源202可以焊接在电路板201上。The circuit board 201 is used to provide driving signals to the light source 202 . The light source 202 is located on the circuit board 201 and is electrically connected to the circuit board 201 . In specific implementation, the light source 202 can be welded on the circuit board 201 .
扩散板1位于发光源202的出光侧,且与发光源202之间相距一定的距离。该距离的设置是为了使光源之间可以充分混光。扩散板1的作用是对入 射光线进行散射,使经过扩散板1的光线更加均匀。The diffusion plate 1 is located on the light emitting side of the light source 202 and is separated from the light source 202 by a certain distance. This distance is set to allow sufficient light mixing between the light sources. The function of the diffuser plate 1 is to scatter the incident light to make the light passing through the diffuser plate 1 more uniform.
扩散板1中设置有散射粒子材料,光线入射到散射粒子材料会不断发生折射与反射,从而达到将光线打散的效果,实现匀光的作用。扩散板的厚度通常设置为0.5mm-3mm,扩散板的厚度越大,雾度越大,均匀效果更佳。The diffusion plate 1 is provided with a scattering particle material. When light enters the scattering particle material, refraction and reflection will continue to occur, thereby achieving the effect of scattering the light and achieving a uniform light effect. The thickness of the diffusion plate is usually set to 0.5mm-3mm. The thicker the diffusion plate, the greater the haze and the better the uniform effect.
扩散板1通常可以采用挤出工艺加工,扩散板1所用材质一般选自聚甲基丙烯酸甲酯PMMA、聚碳酸酯PC、聚苯乙烯系材料PS、聚丙烯PP中的至少一种。The diffusion plate 1 can usually be processed by an extrusion process, and the material used for the diffusion plate 1 is generally selected from at least one of polymethyl methacrylate PMMA, polycarbonate PC, polystyrene-based material PS, and polypropylene PP.
在一些实施例中,发光源202可以用于出射蓝色光。此时,扩散板1可以是量子点扩散板,用于实现色彩转换以及扩散功能。In some embodiments, the light source 202 may be used to emit blue light. At this time, the diffusion plate 1 can be a quantum dot diffusion plate, used to achieve color conversion and diffusion functions.
光学膜片3位于扩散板1背离发光源202的一侧。光学膜片3的尺寸大小与显示设备相适应,略小于显示设备,通常设置为矩形或方形。The optical film 3 is located on the side of the diffusion plate 1 away from the light source 202 . The size of the optical film 3 is suitable for the display device, is slightly smaller than the display device, and is usually set in a rectangular or square shape.
在具体实施时,光学膜片3包括荧光膜、量子膜、棱镜片和增亮膜等的一种或几种组合,根据具体的需要进行设置,在此不做限定。In specific implementation, the optical film 3 includes one or more combinations of a fluorescent film, a quantum film, a prism film, a brightness enhancing film, etc., which can be set according to specific needs and is not limited here.
对比度是衡量显示设备的重要画质参数。对比度是指显示设备上某一点最亮时的亮度与最暗时的亮度的比值。对比度越高,图像越清晰,显示表现出的色彩越鲜艳,层次感越丰富。Contrast is an important image quality parameter for measuring display devices. Contrast ratio refers to the ratio of the brightness at the brightest point to the brightness at the darkest point on the display device. The higher the contrast, the clearer the image, the more vivid the colors displayed, and the richer the layering.
从对比度的定义可知,提升对比度一方面要提升亮态亮度,另一方面要降低暗态亮度。液晶显示面板在暗态时存在一定程度漏光,暗态亮度变化极大影响显示对比度。It can be seen from the definition of contrast that to improve contrast, on the one hand, we must increase the brightness of the bright state, and on the other hand, we must reduce the brightness of the dark state. The LCD panel has a certain degree of light leakage in the dark state, and changes in brightness in the dark state greatly affect the display contrast.
为提升液晶显示设备的对比度,基于局域调光技术的多分区背光技术应运而生。将整个背光源划分为若干个可独立驱动的区域,根据图像显示亮度自动调整该区域的背光亮度,实现显示画面对比度提升,进而提升画质。In order to improve the contrast of LCD devices, multi-zone backlight technology based on local dimming technology came into being. Divide the entire backlight source into several areas that can be driven independently, and automatically adjust the backlight brightness of this area according to the image display brightness to improve the contrast of the display screen and thereby improve the image quality.
图20为相关技术的光源的平面结构示意图。Figure 20 is a schematic plan view of a light source in the related art.
依照目前的区域调光技术,区域调光通常以光源的数量进行划分,例如n个发光源为1个分区,对所有的发光源进行分区进行区域调光。其中,n可以取任何正整数。如图20所示,多分区背光最小的分区单元为1个发光源202单独作为1个分区Z,而在驱动电流确定的前提下,发光源202的亮度能力是一定的,即单个分区Z内的发光源202为满功率工作状态时为该分区Z亮度的上线。那么若想要提升分区数,只能增加光源的数量。随着光源数量的增加,相邻的光源之间的间距逐渐减小。当光源之间的间距小于单个光源的直径时,光源数量达到饱和,无法继续增加。而在实际应用中,光源之间的间距存在最小设计值,达到最小值分区饱和,无法继续提升。According to the current regional dimming technology, regional dimming is usually divided by the number of light sources. For example, n light sources are divided into one partition, and all light sources are partitioned for regional dimming. Among them, n can take any positive integer. As shown in Figure 20, the smallest partition unit of the multi-partition backlight is a light-emitting source 202 acting alone as a partition Z. Under the premise of determining the driving current, the brightness capability of the light-emitting source 202 is certain, that is, within a single partition Z When the light source 202 is operating at full power, the upper line of the Z brightness of the zone. So if you want to increase the number of partitions, you can only increase the number of light sources. As the number of light sources increases, the distance between adjacent light sources gradually decreases. When the spacing between light sources is smaller than the diameter of a single light source, the number of light sources reaches saturation and cannot continue to increase. In actual applications, there is a minimum design value for the spacing between light sources. When the minimum value is reached, the partition is saturated and cannot be further improved.
图21为相关技术的分区示意图。Figure 21 is a schematic diagram of partitioning in related technology.
如图21所示,如果背光模组包括三个分区,分别为第一分区Z1、第二分区Z2和第三分区Z3。其中,第一分区Z1的平均亮度水平(Average Picture Level,简称APL)为950,即代表此分区需要的亮度为950nit。由于单个光源单分区的亮度能力有限,且此分区相邻的第二分区Z2的亮度较小,例如仅为150nit,那么对于这种情况,即使采用单个光源作为1个分区的极限分区方式也无法满足使用需求,一方面第一分区Z1内光源的亮度无法达到950nit,另一方面相邻的第二分区Z2无法为第一分区Z1补充亮度,导致实际显示时第一分区 Z1的亮度远低于950nit。As shown in Figure 21, if the backlight module includes three partitions, they are the first partition Z1, the second partition Z2 and the third partition Z3. Among them, the average brightness level (Average Picture Level, APL) of the first partition Z1 is 950, which means that the brightness required for this partition is 950nit. Since the brightness capability of a single partition of a single light source is limited, and the brightness of the second partition Z2 adjacent to this partition is small, for example, only 150nit, in this case, even using a single light source as the ultimate partition method of one partition cannot To meet the usage requirements, on the one hand, the brightness of the light source in the first partition Z1 cannot reach 950nit, on the other hand, the adjacent second partition Z2 cannot supplement the brightness of the first partition Z1, resulting in the actual display brightness of the first partition Z1 being much lower than 950nit.
有鉴于此,本申请实施例提供一种显示设备,图22为本申请实施例提供的背光源的平面结构示意图之一。In view of this, an embodiment of the present application provides a display device. FIG. 22 is a schematic plan view of a backlight provided by an embodiment of the present application.
如图22所示,本申请实施例的背光模组包括多个发光源202,其中至少一个发光源202包括至少两个微型LED芯片2021。As shown in FIG. 22 , the backlight module of the embodiment of the present application includes multiple light-emitting sources 202 , where at least one light-emitting source 202 includes at least two micro LED chips 2021 .
当一个发光源包括至少两个微型LED芯片时,那么在以单个发光源作为1个分区的情况下,单个发光源的亮度得以提升,适用于单分区需要较大亮度的使用场景。When a light-emitting source includes at least two micro-LED chips, when a single light-emitting source is used as a partition, the brightness of the single light-emitting source can be improved, which is suitable for use scenarios that require greater brightness in a single partition.
进一步地,在本申请实施例中,一个发光源202中的每个微型LED芯片2021可以独立控制。由此,可以使一个分区Z内再细化为多个子分区,每个微型LED芯片作为1个子分区,使得背光模组的分区不再以发光源的数量为限制,在不增加发光源的前提下进一步提升分区数量。Further, in this embodiment of the present application, each micro LED chip 2021 in a light emitting source 202 can be controlled independently. As a result, one partition Z can be further subdivided into multiple sub-partitions, with each micro-LED chip serving as a sub-partition, so that the partitions of the backlight module are no longer limited by the number of light-emitting sources, without increasing the number of light-emitting sources. Next, further increase the number of partitions.
在一些实施例中,只有位于中间区域的光源包括至少两个微型LED芯片,以对画面的核心部分进行精细控制。In some embodiments, only the light source located in the middle area includes at least two micro LED chips to provide fine control over the core part of the picture.
在一些实施例中,背光模组中的每个发光源均包括至少两个微型LED芯片,以使整个背光模组区域均可以进行更加精细的控制。In some embodiments, each light source in the backlight module includes at least two micro LED chips, so that the entire backlight module area can be more finely controlled.
图23为本申请实施例提供的光源的结构示意图。Figure 23 is a schematic structural diagram of a light source provided by an embodiment of the present application.
如图22和图23所示,在具体实施时,微型LED芯片2021采用发光二极管(Light Emitting Diode,简称LED)芯片。微型LED芯片具有节能、环保、显色性好与响应速度快等优势,且制作工艺成熟,可以控制微型LED芯片的尺寸,适合作为基于区域调光技术的背光模组的光源。As shown in Figures 22 and 23, in specific implementation, the micro LED chip 2021 uses a light emitting diode (Light Emitting Diode, LED for short) chip. Micro LED chips have the advantages of energy saving, environmental protection, good color rendering and fast response speed. The manufacturing process is mature and the size of micro LED chips can be controlled. They are suitable as the light source for backlight modules based on regional dimming technology.
发光源202还包括位于各微型LED芯片2021出光侧的光学透镜132。光学透镜132可以采用折射光学透镜,其面型通过光学设计可以将微型LED芯片2021的出射光进一步发散,从而增大光源的出光角度,有利于减小光源的混光距离,以减薄背光模组的厚度。The light source 202 also includes an optical lens 132 located on the light exit side of each micro LED chip 2021. The optical lens 132 can be a refractive optical lens, and its surface shape can further diverge the light emitted from the micro LED chip 2021 through optical design, thereby increasing the light emission angle of the light source, which is beneficial to reducing the light mixing distance of the light source and thinning the backlight module. The thickness of the group.
如图23所示,光学透镜132在进行设计时,通常采用对称结构,且在中心位置存在一个容纳腔,可以将多个芯片同时设置在容纳腔内,从而将各光源出射的光线进行对称性发散。As shown in Figure 23, when the optical lens 132 is designed, it usually adopts a symmetrical structure, and there is a receiving cavity in the center. Multiple chips can be placed in the receiving cavity at the same time, so that the light emitted from each light source is symmetrical. diverge.
除此之外,也可以直接采用多个微型LED芯片作为光源,而不设置光学透镜,此时可以减小光源的尺寸,进一步缩短混光距离。有利于将光源划分为更小的分区,以细化区域调光,提升显示对比度。In addition, multiple micro LED chips can also be directly used as light sources without setting up optical lenses. In this case, the size of the light source can be reduced and the light mixing distance can be further shortened. It is helpful to divide the light source into smaller partitions to refine regional dimming and improve display contrast.
图24为本申请实施例提供的背光源的平面结构示意图之二。FIG. 24 is the second schematic plan view of the backlight provided by the embodiment of the present application.
在一些实施例中,如图24所示,一个发光源202可以包括四个微型LED芯片2021。四个微型LED芯片2021排列成两行两列。由此可以使一个分区Z内再细化为4个对称分布的子分区,每个子分区均可以对相邻的子分区起到辅助作用。In some embodiments, as shown in FIG. 24 , one light source 202 may include four micro LED chips 2021 . Four micro LED chips 2021 are arranged in two rows and two columns. As a result, one partition Z can be further refined into four symmetrically distributed sub-partitions, and each sub-partition can play an auxiliary role in the adjacent sub-partitions.
具体地,发光源202中包括的四个微型LED芯片分别为第一微型LED芯片a、第二微型LED芯片b、第三微型LED芯片c和第四微型LED芯片d。四个微型LED芯片均可以独立控制,从而仅包括1个发光源202的分区Z可以再细化成四个子分区。其中,第一微型LED芯片a对应第一子分区Za,第 二微型LED芯片b对应第二子分区Zb,第三微型LED芯片c对应第三子分区Zc,第四微型LED芯片d对应第四子分区Zd。Specifically, the four micro LED chips included in the light emitting source 202 are respectively the first micro LED chip a, the second micro LED chip b, the third micro LED chip c, and the fourth micro LED chip d. Each of the four micro LED chips can be controlled independently, so that the partition Z including only one light source 202 can be further subdivided into four sub-partitions. Among them, the first micro LED chip a corresponds to the first sub-section Za, the second micro LED chip b corresponds to the second sub-section Zb, the third micro LED chip c corresponds to the third sub-section Zc, and the fourth micro LED chip d corresponds to the fourth Subpartition Zd.
那么同样针对图21所示的情形,在采用本申请实施例提供的光源时,每个光源包括四个微型LED芯片,对于第一分区Z1的亮度可以为原始亮度的4倍,有效提高了第一分区Z1的最大亮度,满足亮度需求,提升对比度。而对于第三分区Z3来说,如果第三分区Z3的APL为350,即此分区需要的亮度约为最大亮度的1/4,因此可调用光源中的其中一个微型LED芯片进行发光,其它微型LED芯片不发光,在保证亮度达到需求以外,同时保证了周边区域黑色显示。Then for the same situation shown in Figure 21, when using the light source provided by the embodiment of the present application, each light source includes four micro LED chips, the brightness of the first partition Z1 can be 4 times the original brightness, effectively improving the brightness of the first partition Z1. The maximum brightness of one partition Z1 meets the brightness requirements and improves the contrast. For the third partition Z3, if the APL of the third partition Z3 is 350, that is, the brightness required by this partition is about 1/4 of the maximum brightness. Therefore, one of the micro LED chips in the light source can be called to emit light, and the other micro LED chips can be used to emit light. The LED chip does not emit light. In addition to ensuring that the brightness meets the demand, it also ensures that the surrounding area is displayed in black.
本申请实施例提供的背光模组中,突破了1个光源作为1个分区的分区限制,光源中包括四个微型LED芯片,且每个微型LED芯片可以独立控制,由此使得1个分区可以再细化为4个子分区。根据图像亮度需求,有规律的驱动4个微型LED芯片中任意位置的芯片,满足不同位置亮暗需求。The backlight module provided by the embodiment of the present application breaks through the partition restriction of one light source as one partition. The light source includes four micro LED chips, and each micro LED chip can be independently controlled, thereby allowing one partition to Then refine it into 4 sub-partitions. According to the image brightness requirements, any chip at any position among the four micro LED chips is regularly driven to meet the brightness and darkness requirements at different locations.
在本申请一些实施例中,如图24所示,电路板201为块状结构,发光源202在电路板201上呈阵列排布,电路板201和发光源202构成灯板。灯板上的发光源202的间距可以根据实际需要进行设置。如果应用于大尺寸显示设备,背光模组中也可以设置多个电路板201,采用电路板201拼接设置。In some embodiments of the present application, as shown in Figure 24, the circuit board 201 has a block structure, the light sources 202 are arranged in an array on the circuit board 201, and the circuit board 201 and the light sources 202 constitute a light panel. The spacing between the light sources 202 on the lamp board can be set according to actual needs. If applied to a large-size display device, multiple circuit boards 201 can also be provided in the backlight module, and the circuit boards 201 are spliced together.
图25为本申请实施例提供的背光源的平面结构示意图之三。FIG. 25 is a third schematic diagram of the planar structure of the backlight provided by the embodiment of the present application.
在本申请一些实施例中,如图25所示,电路板201为条状结构,发光源202在电路板201排列成一排,电路板201和发光源202构成灯条。背光模组包括多个平行排列的灯条。灯条上包括光源数量相比于灯板上包括的光源数量更少,因此有利于简化电路设计,通过设置多个灯条也可以满足区域调光的需求。In some embodiments of the present application, as shown in Figure 25, the circuit board 201 has a strip structure, the light sources 202 are arranged in a row on the circuit board 201, and the circuit board 201 and the light sources 202 form a light bar. The backlight module includes multiple light bars arranged in parallel. The number of light sources included on the light bar is smaller than the number of light sources included on the light board, so it is helpful to simplify the circuit design. By setting multiple light bars, the demand for regional dimming can also be met.
为了方便解释,已经结合具体的实施方式进行了上述说明。但是,上述示例性的讨论不是意图穷尽或者将实施方式限定到上述公开的具体形式。根据上述的教导,可以得到多种修改和变形。上述实施方式的选择和描述是为了更好的解释原理以及实际的应用,从而使得本领域技术人员更好的使用所述实施方式以及适于具体使用考虑的各种不同的变形的实施方式。For convenience of explanation, the above description has been made in conjunction with specific implementation modes. However, the above illustrative discussion is not intended to be exhaustive or to limit the embodiments to the specific forms disclosed. Various modifications and variations are possible in light of the above teachings. The above embodiments are selected and described to better explain the principles and practical applications, so that those skilled in the art can better use the embodiments and various modified embodiments suitable for specific use considerations.

Claims (14)

  1. 一种显示设备,包括背光模组和显示面板,所述显示面板位于所述背光模组的出光侧;所述背光模组包括扩散板和灯条,所述灯条位于所述扩散板的入光面的一侧;其中,所述灯条包括:A display device includes a backlight module and a display panel. The display panel is located on the light exit side of the backlight module. The backlight module includes a diffusion plate and a light bar. The light bar is located at the entrance of the diffusion plate. One side of the glossy surface; wherein, the light bar includes:
    电路板,呈条形,所述电路板具有承载面,所述承载面位于所述电路板靠近所述扩散板的入光面的一侧;The circuit board is in a strip shape, the circuit board has a bearing surface, and the bearing surface is located on the side of the circuit board close to the light incident surface of the diffuser plate;
    多个发光源,设置于所述电路板的承载面上,多个所述发光源沿所述电路板的延伸方向依次间隔设置;所述发光源包括多个微型发光二极管LED芯片,多个微型LED芯片与所述电路板电连接;以及A plurality of light-emitting sources are arranged on the carrying surface of the circuit board, and the plurality of light-emitting sources are arranged at intervals along the extension direction of the circuit board; the light-emitting sources include a plurality of micro light-emitting diode LED chips, and a plurality of micro light-emitting diode chips. The LED chip is electrically connected to the circuit board; and
    多个光学透镜,设置于所述电路板靠近所述扩散板的入光面的一侧,一个所述光学透镜罩设于一个所述发光源上,所述光学透镜用于对所述发光源出射的光线进行散射。A plurality of optical lenses are disposed on the side of the circuit board close to the light incident surface of the diffusion plate. One optical lens cover is disposed on one of the light-emitting sources. The optical lenses are used to illuminate the light-emitting source. The emitted light is scattered.
  2. 根据权利要求1所述的显示设备,所述灯条还包括:The display device according to claim 1, the light bar further comprising:
    多个导光支架,设置于所述电路板的承载面上;所述导光支架开设有贯穿所述导光支架的第一通孔,一个所述发光源位于一个所述导光支架的所述第一通孔内;所述第一通孔的内侧壁为反射面,所述反射面用于将来自所述发光源的至少部分光线反射至所述光学透镜。A plurality of light guide brackets are arranged on the bearing surface of the circuit board; the light guide bracket is provided with a first through hole penetrating the light guide bracket, and one of the light source is located on each of the light guide brackets. In the first through hole; the inner wall of the first through hole is a reflective surface, and the reflective surface is used to reflect at least part of the light from the light source to the optical lens.
  3. 根据权利要求1所述的显示设备,所述灯条还包括:The display device according to claim 1, the light bar further comprising:
    板状结构,设置于所述电路板的所述承载面上;所述板状结构开设有多个贯穿所述板状结构的第二通孔,一个所述发光源位于一个所述板状结构的所述第二通孔内,所述第二通孔的内侧壁为反射面,所述反射面用于将来自所述发光源的至少部分光线反射至所述光学透镜。A plate-like structure is provided on the carrying surface of the circuit board; the plate-like structure is provided with a plurality of second through holes penetrating the plate-like structure, and one of the light-emitting sources is located on one of the plate-like structures. In the second through hole, the inner wall of the second through hole is a reflective surface, and the reflective surface is used to reflect at least part of the light from the light source to the optical lens.
  4. 根据权利要求1所述的显示设备,所述电路板开设有多个凹槽,一个所述发光源设置于一个所述凹槽的底壁上,所述凹槽的侧壁为反射面,所述反射面用于将来自所述发光源的至少部分光线反射至所述光学透镜。The display device according to claim 1, the circuit board is provided with a plurality of grooves, one of the light sources is disposed on the bottom wall of one of the grooves, and the side walls of the groove are reflective surfaces, so The reflective surface is used to reflect at least part of the light from the light source to the optical lens.
  5. 根据权利要求2所述的显示设备,A display device according to claim 2,
    所述电路板的所述承载面平行于所述扩散板;The carrying surface of the circuit board is parallel to the diffusion plate;
    所述反射面靠近所述扩散板的入光面的边缘为第一边缘,所述第一边缘上各点与所述电路板的所述承载面之间的距离相同。The edge of the reflective surface close to the light incident surface of the diffusion plate is a first edge, and the distance between each point on the first edge and the carrying surface of the circuit board is the same.
  6. 根据权利要求5所述的显示设备,A display device according to claim 5,
    所述反射面远离所述扩散板的入光面的边缘为第二边缘;所述第一边缘上距离最大的两点之间的距离,大于所述第二边缘上距离最大的两点之间的距离。The edge of the reflective surface away from the light incident surface of the diffusion plate is the second edge; the distance between the two largest points on the first edge is greater than the distance between the two largest points on the second edge. distance.
  7. 根据权利要求6所述的显示设备,所述反射面为旋转曲面,所述旋转曲面的旋转轴垂直于所述电路板的所述承载面,所述旋转曲面的母线为直线或弧线。The display device according to claim 6, wherein the reflective surface is a curved surface of rotation, the rotation axis of the curved surface of rotation is perpendicular to the bearing surface of the circuit board, and the generatrix of the curved surface of rotation is a straight line or an arc.
  8. 根据权利要求7所述的显示设备,A display device according to claim 7,
    所述第一边缘的直径为R1,R1满足如下公式:The diameter of the first edge is R1, and R1 satisfies the following formula:
    R1≤3.466×H+R2;R1≤3.466×H+R2;
    其中,R2为所述第二边缘的直径,H为所述第一边缘上各点与所述电路板的所述承载面之间的距离。Wherein, R2 is the diameter of the second edge, and H is the distance between each point on the first edge and the bearing surface of the circuit board.
  9. 根据权利要求5所述的显示设备,A display device according to claim 5,
    沿垂直于所述电路板的所述承载面的方向,所述反射面的所述第一边缘上各点与所述承载面之间的距离大于所述发光源的高度。Along the direction perpendicular to the carrying surface of the circuit board, the distance between each point on the first edge of the reflective surface and the carrying surface is greater than the height of the light source.
  10. 根据权利要求1~9中任一项所述的显示设备,所述发光源包括至少两个微型LED芯片,各所述微型LED芯片独立控制;The display device according to any one of claims 1 to 9, wherein the light source includes at least two micro LED chips, and each of the micro LED chips is independently controlled;
    所述发光源内的多个所述微型LED芯片对称设置。The plurality of micro LED chips in the light source are symmetrically arranged.
  11. 根据权利要求10所述的显示设备,一个所述光源包括四个所述微型LED芯片。According to the display device of claim 10, one said light source includes four said micro LED chips.
  12. 根据权利要求11所述的显示设备,四个所述微型LED芯片排列成两行两列。According to the display device of claim 11, four of the micro LED chips are arranged in two rows and two columns.
  13. 根据权利要求10所述的显示设备,所述光源在所述电路板上呈阵列排布,所述电路板和所述光源构成灯板。The display device according to claim 10, wherein the light sources are arranged in an array on the circuit board, and the circuit board and the light sources constitute a light panel.
  14. 根据权利要求10所述的显示设备,所述背光模组还包括:The display device according to claim 10, the backlight module further includes:
    光学膜片,位于所述扩散板背离所述发光源的一侧。An optical film is located on the side of the diffusion plate facing away from the light source.
PCT/CN2022/140805 2022-03-18 2022-12-21 Display device WO2023173869A1 (en)

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CN202210269950.9 2022-03-18
CN202210269950.9A CN116794879A (en) 2022-03-18 2022-03-18 Display device
CN202220676696.XU CN217386062U (en) 2022-03-24 2022-03-24 Display device
CN202220676696.X 2022-03-24

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CN109118953A (en) * 2018-07-25 2019-01-01 青岛海信电器股份有限公司 A kind of down straight aphototropism mode set
KR20200001867A (en) * 2018-06-28 2020-01-07 주식회사 엘엠에스 Optical film for mini led or micro led backlight unit
KR20200109740A (en) * 2019-03-14 2020-09-23 주식회사 엘엠에스 Backlight unit using mini led or micro led as light source
CN211627972U (en) * 2020-04-07 2020-10-02 广州视源电子科技股份有限公司 Backlight source assembly, backlight module and liquid crystal display module
CN112882282A (en) * 2019-11-29 2021-06-01 海信视像科技股份有限公司 Display device
CN114063343A (en) * 2020-07-31 2022-02-18 海信视像科技股份有限公司 Display device

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Publication number Priority date Publication date Assignee Title
KR20200001867A (en) * 2018-06-28 2020-01-07 주식회사 엘엠에스 Optical film for mini led or micro led backlight unit
CN109118953A (en) * 2018-07-25 2019-01-01 青岛海信电器股份有限公司 A kind of down straight aphototropism mode set
KR20200109740A (en) * 2019-03-14 2020-09-23 주식회사 엘엠에스 Backlight unit using mini led or micro led as light source
CN112882282A (en) * 2019-11-29 2021-06-01 海信视像科技股份有限公司 Display device
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CN114063343A (en) * 2020-07-31 2022-02-18 海信视像科技股份有限公司 Display device

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