CN116794879A - Display device - Google Patents

Abstract

The application discloses a display device which is used for solving the problem of high design cost of a mini LED backlight module in the related technology. The display device comprises a backlight module and a display panel; the backlight module comprises a diffusion plate and a lamp strip, wherein the lamp strip comprises a circuit board, a plurality of luminous sources and a plurality of optical lenses. The light sources are arranged on the bearing surface of the circuit board; the light source comprises a plurality of miniature Light Emitting Diode (LED) chips electrically connected with the circuit board. The optical lenses are arranged on one side of the circuit board, which is close to the light incident surface of the diffusion plate, and one optical lens is covered on one light emitting source. The display device provided by the application can increase the arrangement interval between two adjacent light-emitting sources, so that the circuit board can be in a strip shape to form the lamp strips, and the light sources of the backlight module are formed by mutually and alternately arranging the lamp strips side by side; the optical lens is covered on the light-emitting source to scatter the emergent rays of the light-emitting source, so that the reliability of the display device is ensured under the condition of reducing the cost.

Description

Display device

Technical Field

The application relates to the technical field of display, in particular to a display device.

Background

With the continuous development and maturation of LED backlight technology, more and more product forms are layered endlessly, wherein mini LED backlight is more attractive. At present, the mini LED backlight technical scheme mainly comprises two types of POB and COB, wherein POB (Package on Board) refers to packaging an LED chip into single SMD (Surface Mounted Devices, surface mounted device) LED lamp beads, and then beating the lamp beads on a substrate; COB (Chip on Board) refers to directly mounting an LED Chip on a substrate and then integrally packaging the LED Chip. Because the COB does not need to be subjected to SMD packaging, the cost of a single LED is low, and the cost advantage is achieved, so that more and more backlight technical schemes adopt the COB scheme.

The short side dimension of the mini LED chip is less than 300 μm, i.e., less than 11.8mil, as industry dictates. Because the mini LED chips are smaller in size, the power of a single chip is lower, and compared with the LED chips with the size of 25mil commonly used in the prior art, more mini LED chips are required for the same luminous flux; because the chip used by the COB is not packaged by the SMD, the light emitting angle (the light emitting angle of the main light emitting surface) of the chip is smaller, and the interval between the adjacent mini LED chips is smaller to ensure the display effect of the subjective picture, so that the small interval arrangement of the mini LEDs is supported, the lamp panel (as shown in fig. 1) is adopted, the usage amount of the PCB is increased, and the design cost of the backlight module is higher.

Disclosure of Invention

The application aims to provide a display device which is used for solving the problems that the existing mini LED backlight module adopts a lamp panel mode and has high design cost.

In order to achieve the above purpose, the present application provides the following technical solutions:

some embodiments of the present application provide a display device including a backlight module and a display panel, where the display panel is located at a light emitting side of the backlight module. The backlight module comprises a diffusion plate and a lamp strip, wherein the lamp strip is positioned on one side of the light incident surface of the diffusion plate. The light bar comprises a circuit board, a plurality of luminous sources and a plurality of optical lenses. The circuit board is in a strip shape and is provided with a bearing surface, and the bearing surface is positioned at one side of the circuit board, which is close to the light incident surface of the diffusion plate. The light emitting sources are arranged on the bearing surface of the circuit board and are sequentially arranged at intervals along the extending direction of the circuit board; the light-emitting source comprises a plurality of micro light-emitting diode (LED) chips, and the micro LED chips are electrically connected with the circuit board. The optical lenses are arranged on one side of the circuit board, which is close to the light incident surface of the diffusion plate, and one optical lens is covered on one light emitting source and used for scattering light rays emitted by the light emitting source.

In some embodiments, the light bar further comprises: the light guide brackets are arranged on the bearing surface of the circuit board; the light guide bracket is provided with a first through hole penetrating through the light guide bracket, and a light-emitting source is positioned in the first through hole of one light guide bracket; the inner side wall of the first through hole is a reflecting surface which is used for reflecting at least part of light rays from the luminous source to the optical lens.

In some embodiments, the light bar further comprises: the plate-shaped structure is arranged on the bearing surface of the circuit board; the plate-shaped structure is provided with a plurality of second through holes penetrating through the plate-shaped structure, one light-emitting source is positioned in the second through hole of the plate-shaped structure, the inner side wall of the second through hole is a reflecting surface, and the reflecting surface is used for reflecting at least part of light rays from the light-emitting source to the optical lens.

In some embodiments, the circuit board is provided with a plurality of grooves, a light source is disposed on a bottom wall of one groove, and a side wall of the groove is a reflecting surface, and the reflecting surface is used for reflecting at least part of light from the light source to the optical lens.

In some embodiments, the bearing surface of the circuit board is parallel to the diffusion plate. The edge of the reflecting surface, which is close to the light incident surface of the diffusion plate, is a first edge, and the distances between each point on the first edge and the bearing surface of the circuit board are the same.

In some embodiments, an edge of the reflective surface away from the light incident surface of the diffusion plate is a second edge; the distance between the two points with the greatest distance on the first edge is greater than the distance between the two points with the greatest distance on the second edge.

In some embodiments, the reflective surface is a curved surface of revolution, the axis of rotation of the curved surface of revolution is perpendicular to the bearing surface of the circuit board, and the generatrix of the curved surface of revolution is a straight line or an arc line.

In some embodiments, the first edge has a diameter R1, R1 satisfying the following formula: r1 is less than or equal to 3.466 XH+R2. Wherein R2 is the diameter of the second edge, and H is the distance between each point on the first edge and the bearing surface of the circuit board.

In some embodiments, the distance between each point on the first edge of the reflective surface and the bearing surface is greater than the height of the light emitting source in a direction perpendicular to the bearing surface of the circuit board.

In some embodiments, the plurality of micro LED chips within the light emitting source are symmetrically disposed.

The display device provided by the application has the following beneficial effects:

according to the display device provided by the application, the backlight module is provided with the plurality of micro LED chips on the bearing surface of the circuit board and is electrically connected with the circuit board to form the group-type light emitting sources, and the plurality of light emitting sources are sequentially arranged on the circuit board at intervals, so that the arrangement interval between two adjacent light emitting sources can be increased relative to the arrangement interval of the plurality of micro LED chips on the whole plate-type circuit board under the condition of ensuring luminous flux, the circuit board can be made to be in a strip shape to form the light bars, and the light sources of the backlight module are formed by arranging the plurality of light bars side by side at intervals. Therefore, the consumption of the circuit board can be reduced, the cost of the backlight module is reduced, and the cost of the display device is further reduced.

In addition, through covering the optical lens on the light-emitting source and scattering the light emitted by the light-emitting source, the divergence angle of the light emitted by the light-emitting source can be increased, the light mixing effect when the light emitted by two adjacent light-emitting sources reaches the diffusion plate is ensured, and the visual effect displayed by the display device is further ensured, so that the reliability of the display device is ensured under the condition of reducing the cost.

Drawings

In order to more clearly illustrate the embodiments of the application or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic view of a light source of a backlight module according to the prior art;

fig. 2 is a schematic structural diagram of a display device according to some embodiments of the present application;

fig. 3 is a schematic structural diagram of a backlight module according to some embodiments of the application;

FIG. 4 is a schematic diagram of a light bar according to some embodiments of the present application;

fig. 5 is a schematic structural diagram of a backlight module according to other embodiments of the application;

FIG. 6 is a schematic diagram of a prior art SMD lamp bead;

FIG. 7 is a schematic diagram of a prior art light source;

FIG. 8 is an enlarged view of FIG. 4 at A;

FIG. 9 is a schematic diagram of a light bar according to other embodiments of the present application;

fig. 10 is an enlarged view at B in fig. 9;

FIG. 11 is a schematic view of a light bar according to further embodiments of the present application;

FIG. 12 is an enlarged view at C in FIG. 11;

FIG. 13 is a top view of the structure shown in FIG. 8 (with the optical lens hidden);

FIG. 14 is a top view of the structure shown in FIG. 10;

FIG. 15 is a schematic view of a light propagation path of a light bar according to some embodiments of the present application;

FIG. 16 is a schematic view of a light propagation path of a light bar according to other embodiments of the present application;

fig. 17 is a schematic view of a partial structure of a light bar according to still other embodiments of the present application.

Reference numerals: 100-a backlight module; 1-a diffusion plate; 2-a light bar; 201-a circuit board; 2011-bearing surface; 2012-grooves; 202 a-lamp beads; 2021 a-stent; 2022 a-light exit face; 202-a light emitting source; 2021-micro LED chip; 203-an optical lens; 204-a light guide bracket; 2041-first through holes; 205-plate-like structure; 2051-a second via; 3-an optical film; 200-a display panel; 300-display device.

Detailed Description

The following description of the embodiments of the present application will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present application, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.

In the description of the present application, it should be understood that the terms "center," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like indicate orientations or positional relationships based on the orientation or positional relationships shown in the drawings, merely to facilitate describing the present application and simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present application.

The terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present application, unless otherwise indicated, the meaning of "a plurality" is two or more.

In the description of the present application, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; the specific meaning of the above terms in the present application will be understood in specific cases by those of ordinary skill in the art.

In embodiments of the present application, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.

In embodiments of the application, words such as "exemplary" or "such as" are used to mean serving as an example, instance, or illustration. Any embodiment or design described herein as "exemplary" or "e.g." in an embodiment of the present application is not to be taken as preferred or advantageous over other embodiments or designs. Rather, the use of words such as "exemplary" or "such as" is intended to present related concepts in a concrete fashion.

Referring to fig. 2, some embodiments of the present application provide a display device 300 including a backlight module 100 and a display panel 200. The backlight module 100 is used for providing backlight. The backlight module 100 converts a conventional point or line light source into a high-brightness and uniform surface light source through a simple and effective structure, i.e. the backlight module 100 can uniformly emit light in the whole light-emitting surface, and is used for providing the display panel 200 with light with sufficient brightness and uniform distribution, so that the display panel 200 can normally display images. Based on this, the display panel 200 is located on the light emitting side of the backlight module 100 for displaying images. The display panel 200 has a plurality of pixel units arranged in an array, and each pixel unit can independently control the transmittance and color of the light incident on the pixel unit by the backlight module 100, so that the light transmitted by all the pixel units forms a displayed image. The display device 300 may be a display device such as a liquid crystal display, a liquid crystal television, or a mobile terminal such as a mobile phone, a tablet computer, an intelligent photo album. The display device 300 adopts the backlight module 100 to provide backlight, and the display panel 200 modulates the light emitted by the backlight module to realize image display.

Based on this, referring to fig. 3, some embodiments of the present application provide a backlight module 100, which includes a diffusion plate 1 and a light bar 2, wherein the light bar 2 is located at one side of the light incident surface of the diffusion plate 1.

The diffusion plate 1 is used for refracting, reflecting and scattering light rays emitted by the lamp strips 2, so that the light uniformity of the light source is increased; the diffusion plate 1 also serves to form a heat-resistant plate for heat insulation between the light bars 2 and the display panel 200. The diffusion plate 1 may be, for example, translucent (milky) in shape and may be made of a transparent substrate mixed with additives having different refractive indices, wherein the additives function to reflect and refract the light emitted by the lamp strip.

In order to improve brightness and uniformity of light emitted from the light emitting surface of the diffusion plate 1, the backlight module 100 may further include an optical film 3, the optical film 3 being positioned between the diffusion plate 1 and the display panel 200. The optical film 3 may include a first diffusion sheet, a brightness enhancement film and a second diffusion sheet, which are stacked along a direction close to the display panel 200, wherein the first diffusion sheet is used for homogenizing the light emitted from the diffusion plate 1, the brightness enhancement film is used for enhancing the brightness of the light, and the second diffusion sheet is used for protecting the display panel 200 from being scratched by an external object such as the backlight module 100. It should be noted that, in the case that the backlight module 100 further includes the optical film 3, the diffusion plate 1 is further used to provide mechanical support for the optical film 3.

In order to enable the backlight module 100 to provide backlight for the display panel 200, as shown in fig. 4, the light bar 2 includes a circuit board 201, a plurality of light emitting sources 202 and a plurality of optical lenses 203. The circuit board 201 is in a strip shape, the circuit board 201 has a bearing surface 2011, and the bearing surface 2011 is located at one side of the circuit board 201 close to the light incident surface of the diffusion plate 1. The circuit board 201 is used to carry and support the light emitting source 202 and the optical lens 203, and to supply driving electric signals to the light emitting source 202. For example, the circuit board 201 may be a PCB (Printed CircuitBoard ), for example, the circuit board 201 may include a substrate, a circuit layer and an insulating layer sequentially disposed along a direction close to the diffusion plate 1, the substrate may be an aluminum substrate, and a surface of the substrate facing the diffusion plate 1 is a bearing surface 2011. The circuit layer may be made of copper metal, and a circuit is formed through an etching process, so as to drive the light emitting source 202 to emit light. The insulating layer exposes portions (e.g., pads) of the wiring layer for electrical connection with the light emitting source 202 and covers the remaining portions for protecting the wiring layer. Based on this, further exemplary, the insulating layer may be formed by coating a material having a reflective property on the surface of the circuit board 201, the insulating layer having a reflective function at the same time. Also, for example, the insulating layer may be made of white oil, which not only can protect and insulate the circuit board 201, but also can be used as a reflective coating to reflect the light emitted from the light-emitting source 202 to the circuit board 201, thereby improving the utilization efficiency of the light source.

Based on this, the plurality of light emitting sources 202 are disposed on the carrying surface 2011 of the circuit board 201, and the plurality of light emitting sources 202 are sequentially disposed at intervals along the extending direction of the circuit board 201. The light emitting source 202 includes a plurality of micro light emitting diode LED chips 2021, and the plurality of micro LED chips 2021 are electrically connected to the circuit board 201. For example, the micro LED chip 2021 may be soldered on a bare pad of the circuit board 201 by SMT (Surface Mounted Technology, surface mount technology), and the micro LED chip 2021 may be controlled to emit light by a driving signal of the control circuit board 201 after soldering. Also by way of example, micro LED chip 2021 may be a mini-LED chip, e.g., the size of the micro LED chip may be 0.54mm by 0.24mm by 0.15mm, and light source 202 may be a group of a plurality of mini-LED chips. On the basis, when the micro LED chips 2021 are welded on the circuit board 201, the adjacent sides of the micro LED chips 2021 can be approximately bonded together, and only a necessary installation space (a gap between bonding pads) is needed between the two micro LED chips 2021, so that the light beams emitted by the light emitting sources 202 are more concentrated, therefore, the same number of micro LED chips 2021 can use strip-shaped circuit boards to replace plate-shaped circuit boards, the usage amount of the circuit boards is saved, and the cost of the backlight module 100 is reduced. As shown in fig. 5, the number of the light bars 2 in the backlight module 100 is plural, and the light bars are distributed in the backlight module 100 at equal intervals, so as to ensure the display effect of the display panel 200. Also, as an example, the backlight module 100 may be divided into a plurality of groups, wherein one light emitting source 202 is a region, and the plurality of micro LED chips 2021 in one light emitting source 202 may be all connected in series, or the plurality of micro LED chips 2021 may be divided into a plurality of groups connected in parallel, and the micro LED chips 2021 in each group are connected in series. Thus, the micro LED chips 2021 in each partition of the backlight module 100 can be subjected to independent area dimming, so that more refined dynamic control is realized, and the dynamic contrast of display is improved.

In the case that the micro LED chips 2021 are mounted together to form a group, the number of the micro LED chips 2021 is the same, the light bar design saves the usage of the circuit board 201 compared with the design of the light board, but the distance between two adjacent light emitting sources 202 is increased, so that the overlapping area of the light spots incident on the diffusion plate 1 by the two light emitting sources 202 is reduced, and the light emitted by the light emitting sources 202 cannot be fully mixed when reaching the diffusion plate 1, so that the display effect of the picture on the display panel 200 is affected. Based on this, the plurality of optical lenses 203 are disposed on the side of the circuit board 201 close to the light incident surface of the diffusion plate 1. An optical lens 203 is disposed on the light source 202, and the optical lens 203 is used for scattering the light emitted from the light source 201. In this way, the divergence angle of the light emitted from the light emitting sources 202 can be increased, so that the overlapping area of the light spots incident on the diffusion plate 1 by two adjacent light emitting sources 202 is increased, and the light beams emitted from the light emitting sources 202 are fully mixed when reaching the diffusion plate 1, so as to ensure the display effect of the picture on the display panel 200. Illustratively, the optical lens 203 may be a refractive lens having a receiving cavity on a side of the refractive lens facing the light emitting source 202, the light emitting source 202 being located within a forward projection area of the receiving cavity on the circuit board 201. Also, for example, the optical lens 203 may have a central symmetrical shape, so that light rays emitted from the light source 202 in all directions can be homogenized. Also exemplary, the optical lens 203 may be adhered to the circuit board 201 by a bracket.

In summary, in the backlight module 100 provided by the present application, the plurality of micro LED chips 2021 are disposed on the carrying surface 2011 of the circuit board 201 and electrically connected to the circuit board 201 to form the group-type light emitting sources 202, and the plurality of light emitting sources 202 are sequentially disposed on the circuit board 201 at intervals, so that the arrangement interval between two adjacent light emitting sources 202 can be increased relative to the arrangement interval of the plurality of micro LED chips 2021 on the whole board-type circuit board 201 under the condition of ensuring the luminous flux, so that the circuit board 201 can be formed into the light bars 2 in a strip shape, and the light sources of the backlight module 100 are formed by arranging the plurality of light bars 2 side by side at intervals. Thus, the usage of the circuit board 201 can be reduced, the cost of the backlight module 100 can be reduced, and the cost of the display device 300 can be further reduced.

In addition, by covering the optical lens 203 on the light emitting source 202 to scatter the light emitted from the light emitting source 202, the divergence angle of the light emitted from the light emitting source 202 can be increased, the light mixing effect when the light emitted from two adjacent light emitting sources 202 reaches the diffusion plate 1 is ensured, and the visual effect displayed by the display device 300 is further ensured, so that the reliability of the display device 300 is ensured under the condition of reducing the cost.

The beneficial technical effects of the display device 300 provided by the present application are the same as those of the backlight module 100 provided by the embodiment of the present application, and are not described herein.

As shown in fig. 6, the conventional SMD lamp bead 202a has the package support 2021a, so that the lamp bead 202a only emits light from one side of the light-emitting surface 2022a, and therefore, when the optical lens 203 is covered on the lamp bead 202a, all the light emitted from the lamp bead 202a can enter the optical lens 203 (as shown in fig. 7). Since the micro LED chip 2021 adopting the COB design scheme does not perform SMD package, the light-emitting source 202 has the characteristic of five-sided light emission, and the light emitted from the side wall of the light-emitting source 202 cannot effectively enter the light-incident surface of the optical lens 203, and will be emitted from the gap between the circuit board 201 and the optical lens 203 (as shown in fig. 8), and the light will be reflected to the display panel 200 by other devices around the light-emitting source 202, so that serious stray light is generated in the display area of the display panel 200, and the display effect is affected.

Based on this, in order to avoid that stray light affects the display effect of the display device 300, as a possible implementation, referring to fig. 8 (fig. 8 is an enlarged view at a in fig. 4), in some embodiments, the light bar 2 further includes a plurality of light guide brackets 204. The light guide bracket 204 is disposed on the bearing surface 2011 of the circuit board 201. The light guide bracket 204 may be adhered to the bearing surface 2011 of the circuit board 201 by a fixing adhesive; alternatively, the light guide bracket 204 may be fixed on the bearing surface 2011 of the circuit board 201 by SMT soldering. Also exemplary, the light guide bracket 204 may be directly connected to the substrate of the circuit board 201; alternatively, the light guide bracket 204 may be indirectly connected to the substrate of the circuit board 201, i.e., the light guide bracket 204 may be directly connected to the insulating layer. On this basis, the light guide bracket 204 is provided with a first through hole 2041 penetrating through the light guide bracket 204, and one light emitting source 202 is positioned in the first through hole 2041 of one light guide bracket 204; the inner sidewall of the first through hole 2041 is a reflective surface for reflecting at least part of the light from the light source 202 to the optical lens 203. In this way, the light emitted from the light source 202 is incident into the diffusion plate 1 through the optical lens 203, so that the light emitted from the side surface of the light source 202 is prevented from being emitted from the gap between the circuit board 201 and the optical lens 203, and serious stray light is generated in the display area of the display panel 200, thereby affecting the display effect. Illustratively, the light guide bracket 204 may be made of resin, and the reflectivity may be greater than or equal to 95%; alternatively, the light guide support 204 may be made of metal, and the inner side wall of the first through hole 2041 may be coated with a reflective material (such as white oil). Also by way of example, the reflective surface of the light guide bracket 204 may directly reflect all light from the light source 202 into the optical lens 203; alternatively, the reflecting surface of the light guiding support 204 may indirectly reflect the light from the light source 202 into the optical lens 203, for example, the reflecting surface of the light guiding support 204 may reflect the light from the light source 202 back to the light source 202, and the light may be projected into the optical lens 203 after multiple reflections between the reflecting surface and the light source 202. Also exemplary, the light guide bracket 204 may be annular in shape so as to be disposed between the optical lens 203 and the light emitting source 202; alternatively, the shape of the light guide 204 may be other shapes, and the same applies.

In order to avoid that stray light affects the display effect of the display device 300, as another possible implementation, see fig. 10 (fig. 10 is an enlarged view at B in fig. 9), the light bar 2 in some embodiments further comprises a plate-like structure 205. The plate-like structure 205 is disposed on the carrying surface 2011 of the circuit board 201. For example, the plate-like structure 205 may be an aluminum substrate for processing a PCB, which has good flatness and is attached to the bearing surface 2011 of the circuit board 201 by an adhesive; alternatively, the plate-like structure 205 may be made of other materials, such as an acrylic plate, and may be adhered to the bearing surface 2011 of the circuit board 201 by adhesive. On this basis, the plate-like structure 205 is provided with a plurality of second through holes 2051 penetrating the plate-like structure 205, and one light emitting source 202 is located in the second through hole 2051 of one plate-like structure 205. The inner sidewall of the second through hole 2051 is a reflective surface for reflecting at least part of the light from the light source 202 to the optical lens 203. In this way, the light emitted from the light source 202 is incident into the diffusion plate 1 through the optical lens 203, so that the light emitted from the side surface of the light source 202 is prevented from being emitted from the gap between the circuit board 201 and the optical lens 203, and serious stray light is generated in the display area of the display panel 200, thereby affecting the display effect. Illustratively, the inner sidewall of the second through hole 2051 may be formed with a reflective surface by coating a reflective material (e.g., white oil). Also by way of example, the reflective surface of the second through hole 2051 may reflect all light from the source 202 directly into the optical lens 203; alternatively, the reflecting surface of the second through hole 2051 may indirectly reflect the light from the light source 202 into the optical lens 203, for example, the reflecting surface of the second through hole 2051 may reflect the light from the light source 202 back to the light source 202, and the light may be projected into the optical lens 203 after multiple reflections between the reflecting surface and the light source 202.

In order to avoid stray light affecting the display effect of the display device 300, as a further possible implementation, referring to fig. 12 (fig. 12 is an enlarged view at C in fig. 11), in some embodiments, the circuit board 201 is provided with a plurality of grooves 2012, and one light emitting source 202 is disposed on a bottom wall of one groove 2012. In this case, the bottom wall of the recess 2012 is a bearing surface 2011. The side walls of the recess 2012 are reflective surfaces for reflecting at least part of the light from the light source 202 to the optical lens 203. In this way, the light emitted from the light source 202 is incident into the diffusion plate 1 through the optical lens 203, so that the light emitted from the side surface of the light source 202 is prevented from being emitted from the gap between the circuit board 201 and the optical lens 203, and serious stray light is generated in the display area of the display panel 200, thereby affecting the display effect. Illustratively, the sidewalls of the recess 2012 may be formed by coating with a reflective material (e.g., white oil) to form a reflective surface. Also by way of example, the reflective surface of the recess 2012 may reflect all light from the source 202 directly into the optical lens 203; alternatively, the reflecting surface of the groove 2012 may indirectly reflect the light from the light source 202 into the optical lens 203, for example, the reflecting surface of the groove 2012 may reflect the light from the light source 202 back to the light source 202, and the light may be projected into the optical lens 203 after multiple reflections between the reflecting surface and the light source 202.

To ensure light mixing effect and facilitate processing to form a reflective surface, in some embodiments, the bearing surface 2011 of the circuit board 201 is parallel to the diffusion plate 1. The edge of the reflecting surface, which is close to the light incident surface of the diffusion plate 1, is a first edge, and the distances between each point on the first edge and the bearing surface 2011 of the circuit board 201 are the same. In this way, the light beam directly incident into the optical lens 203 by the light source 202 and the light beam reflected to the optical lens 203 by the reflecting surface can be reflected by the optical lens 203 and then projected to the diffusion plate 1 to form a central symmetrical light spot, so that the light beams emitted by all the light source 202 are uniformly mixed at the diffusion plate 1 finally, and the display effect of the display panel 200 is ensured. For example, when the reflecting surface is the inner side wall of the first through hole 2041 of the light guiding support 204, two end surfaces of the light guiding support 204 along the axial direction of the first through hole 2041 may be two planes parallel to each other, so as to facilitate design and processing of the light guiding support 204. Also, for example, when the reflecting surface is a side wall of the second through hole 2051 on the plate structure 205, the plate structure 205 may be a flat plate, so as to facilitate material selection and processing of the second through hole 2051, and facilitate bonding of the plate structure 205 to the circuit board 201. Also for example, when the reflective surface is a side wall of the recess 2012 on the circuit board 201, the bottom wall of the recess 2012 may be parallel to the diffusion plate 1, i.e., the recess 2012 has the same depth throughout, so as to process the recess 2012.

In order to increase the light utilization and extend the service life of the micro LED, in some embodiments, the edge of the reflective surface away from the light incident surface of the diffusion plate 1 is a second edge. For example, as shown in fig. 8, when the reflecting surface is the inner sidewall of the first through hole 2041 of the light guiding bracket 204, the second edge may be the edge of the opening of the first through hole 2041 close to the circuit board 201. Also by way of example, as shown in fig. 10, when the reflective surface is a sidewall of the second through hole 2051 on the plate structure 205, the second edge may be the edge of the second through hole 2051 that is proximate to the opening of the circuit board 201. Also for example, as shown in fig. 12, when the reflective surface is a side wall of the recess 2012 on the circuit board 201, the second edge may be a line connecting the side wall and the bottom wall of the recess 2012. Also, for example, the second edge may be attached to the carrying surface 2011 of the circuit board 201, so that light emitted from the side surface of the light emitting source 202 may be prevented from leaking out from a gap between the second edge and the circuit board 201, and stray light may be generated in the display area of the display panel 200. On this basis, the distance between the two points with the greatest distance on the first edge is greater than the distance between the two points with the greatest distance on the second edge. In this way, part of the light emitted from the side surface of the light source 202 to the reflecting surface can be reflected to the optical lens 203 through the reflecting surface, refracted by the optical lens 203 and projected onto the diffusion plate 1, so that the light utilization rate is improved, and the brightness of the display panel 200 is further improved. In addition, the light can be prevented from repeatedly penetrating the micro LED chip, and excessive loss is caused to the LED chip, thereby prolonging the light emitting life of the light emitting source 202.

In order to prevent stray light from affecting the display effect of the display device 300, in particular, in some embodiments, a distance between each point on the first edge of the reflective surface and the bearing surface 2011 is greater than the height of the light emitting source 202 along a direction perpendicular to the bearing surface 2011 of the circuit board 201. For example, as shown in fig. 8, when the reflecting surface is the inner sidewall of the first through hole 2041 of the light guiding bracket 204, the height of the light guiding bracket 204 is greater than the height of the light emitting source 202. Also exemplary, as shown in fig. 10, when the reflective surface is a sidewall of the second through hole 2051 on the plate structure 205, the thickness of the plate structure 205 is greater than the height of the light emitting source 202. Also exemplary, as shown in fig. 12, when the reflective surface is a sidewall of the recess 2012 on the circuit board 201, the depth of the recess 2012 is greater than the height of the light source 202. Thus, all light emitted from the side surface of the light source 202 does not leak out from the gap between the circuit board 201 and the optical lens 203, and stray light is prevented from being generated in the display region of the display panel 200, thereby preventing the display effect from being affected.

To ensure the light mixing effect, in particular, in some embodiments, the reflecting surface is a rotating curved surface, the rotation axis of the rotating curved surface is perpendicular to the bearing surface 2011 of the circuit board 201, and the generatrix of the rotating curved surface is a straight line or an arc line. When the generatrix of the rotating curved surface is a straight line, the reflecting surface is a conical surface; when the generatrix of the rotating curved surface is an arc line (as shown in fig. 17), the arc line may be a parabola with an opening facing the diffusion plate 1, or the arc line may be an arc line protruding away from the rotation axis, and specific parameters of the arc line are not limited in the present application. That is, the graph of the reflecting surface on each section parallel to the diffusion plate 1 is circular, so that the light emitted by the light emitting source 202 and the light reflected by the reflecting surface can be circularly projected into the optical lens 203; because the optical lens 203 may be in a shape of central symmetry, the received light can be uniformly diffused into a circular light spot with a larger area, so that the light emitted by all the light emitting sources 202 is finally uniformly mixed at the diffusion plate 1, and the display effect of the display panel 200 is ensured. As shown in fig. 13 (fig. 13 is a top view of fig. 8), when the reflecting surface is an inner sidewall of the first through hole 2041 of the light guiding bracket 204, the first through hole 2041 is a tapered hole. Also by way of example, as shown in fig. 14 (fig. 14 is a top view of fig. 10), when the reflective surface is a sidewall of the second through hole 2051 on the plate structure 205, the second through hole 2051 may be a tapered hole. Also by way of example, when the reflective surface is a sidewall of the recess 2012 on the circuit board 201, the recess 2012 may be a tapered recess.

On this basis, as shown in fig. 15, in some embodiments, taking a reflecting surface as an example, when the diameter R1 of the first edge is determined, in order to ensure that most of the light rays can directly enter the optical lens 203 after being reflected by the reflecting surface, the included angle θ between the reflecting surface and the carrying surface of the circuit board 201 should be as small as possible, that is, in the case that the diameter R1 of the first edge is determined, the second edge should be as close to the bottom of the light emitting source 202 as possible. When the second edge of the reflecting surface is connected to the bottom of the light emitting source 202, the diameter R2 of the second edge is equal to the maximum dimension of the light emitting source 202 in the direction parallel to the diffusion plate 1, and at this time, the included angle θ satisfies the following formula (1), where H is the distance between each point on the first edge and the bearing surface 2011 of the circuit board 201.

In general, the light refracted by the optical lens 203 needs to satisfy a certain spot size, so that the diffusion plate 1 can diffuse the light spot to obtain the light required for display, and in practical application, the divergence angle of the light projected to the optical lens 202 can be limited by the design parameters of the reflecting surface, so as to limit the spot size of the light exiting the optical lens 203, that is, the spot size of the light incident to the diffusion plate 1. In practical applications, the divergence angle of the light beam projected onto the optical lens 203 may be set to be less than or equal to 120 degrees, specifically, as shown in fig. 16, when the second edge of the reflecting surface is in contact with the bottom of the light-emitting source 202, since the divergence angle of the light beam projected onto the optical lens 202 is less than or equal to 120 degrees, the emission angle Φ of the critical light beam of the light beam projected onto the optical lens 202 should be less than or equal to 60 degrees, and at this time, the emission angle Φ satisfies the following formula (2).

φ＝90°-θ (2)

Solving equation (1) and equation (2) can result in equation (3).

R1≤3.466×H+R2 (3)

For example, as shown in fig. 13, the micro LED chips 2021 constituting the light emitting sources 202 may have a size of 0.54mm×0.24mm×0.15mm, each light emitting source 202 is composed of 8 micro LED chips 2021, and the light emitting sources 2021 have a size of 1.08×0.96×0.15mm, and then the parameters of the reflecting surface may be set to: the second edge diameter r2=0.75 mm, the distance between each point on the first edge and the bearing surface 2011 of the circuit board 201 is 0.39mm, and the first edge diameter r1=2.1 mm. It should be noted that this formula applies equally when the rotation generatrix of the reflecting surface is an arc.

Referring to fig. 13, in some embodiments, a plurality of micro LED chips 2021 within the light source 202 are symmetrically disposed. For example, the micro LED chip 2021 may be rectangular, the plurality of micro LED chips 2021 are symmetrically disposed, and the light emitting source 202 formed far away from the main light emitting surface of the circuit board 201 is approximately square, so that the light pattern of the light emitted by the light emitting source 202 is as centrally symmetrical as possible, and the light mixing effect is ensured. Meanwhile, the bonding pads for welding the micro LED chip 2021 are conveniently arranged on the circuit board 201, and batch processing is convenient.

The foregoing is merely illustrative embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily think about variations or substitutions within the technical scope of the present application, and the application should be covered. Therefore, the protection scope of the application is subject to the protection scope of the claims.

Claims (10)

1. The display device is characterized by comprising a backlight module and a display panel, wherein the display panel is positioned on the light emitting side of the backlight module; the backlight module comprises a diffusion plate and a lamp strip, wherein the lamp strip is positioned at one side of the light incident surface of the diffusion plate; wherein, the lamp strip includes:

the circuit board is strip-shaped and is provided with a bearing surface, and the bearing surface is positioned at one side of the circuit board, which is close to the light incident surface of the diffusion plate;

the light emitting sources are arranged on the bearing surface of the circuit board and are sequentially arranged at intervals along the extending direction of the circuit board; the light-emitting source comprises a plurality of micro light-emitting diode (LED) chips, and the micro LED chips are electrically connected with the circuit board; and

the optical lenses are arranged on one side of the circuit board, which is close to the light incident surface of the diffusion plate, one optical lens is covered on one light emitting source, and the optical lenses are used for scattering light rays emitted by the light emitting source.

2. The display device of claim 1, wherein the light bar further comprises:

the light guide brackets are arranged on the bearing surface of the circuit board; the light guide bracket is provided with a first through hole penetrating through the light guide bracket, and one light emitting source is positioned in the first through hole of one light guide bracket; the inner side wall of the first through hole is a reflecting surface, and the reflecting surface is used for reflecting at least part of light rays from the light emitting source to the optical lens.

3. The display device of claim 1, wherein the light bar further comprises:

the plate-shaped structure is arranged on the bearing surface of the circuit board; the plate-shaped structure is provided with a plurality of second through holes penetrating through the plate-shaped structure, one light-emitting source is positioned in the second through hole of one plate-shaped structure, the inner side wall of the second through hole is a reflecting surface, and the reflecting surface is used for reflecting at least part of light rays from the light-emitting source to the optical lens.

4. The display device of claim 1, wherein the circuit board is provided with a plurality of grooves, one of the light sources is disposed on a bottom wall of one of the grooves, and a side wall of the groove is a reflecting surface for reflecting at least part of light from the light source to the optical lens.

5. The display device according to any one of claims 2 to 4, wherein,

the bearing surface of the circuit board is parallel to the diffusion plate;

the edge of the reflecting surface, which is close to the light incident surface of the diffusion plate, is a first edge, and the distances between each point on the first edge and the bearing surface of the circuit board are the same.

6. The display device of claim 5, wherein the display device comprises a display device,

the edge of the reflecting surface, which is far away from the light incident surface of the diffusion plate, is a second edge; the distance between the two points with the largest distance on the first edge is larger than the distance between the two points with the largest distance on the second edge.

7. The display device of claim 6, wherein the reflective surface is a curved surface of revolution, a rotational axis of the curved surface of revolution is perpendicular to the bearing surface of the circuit board, and a generatrix of the curved surface of revolution is a straight line or an arc line.

8. The display device of claim 7, wherein the display device comprises a display device,

the diameter of the first edge is R1, and R1 satisfies the following formula:

R1≤3.466×H+R2；

wherein R2 is the diameter of the second edge, and H is the distance between each point on the first edge and the bearing surface of the circuit board.

9. The display device of claim 5, wherein the display device comprises a display device,

and the distance between each point on the first edge of the reflecting surface and the bearing surface is larger than the height of the light-emitting source along the direction perpendicular to the bearing surface of the circuit board.

10. The display device according to any one of claims 1 to 4, wherein,

the micro LED chips in the light-emitting source are symmetrically arranged.