WO2023153810A1

WO2023153810A1 - Fingerprint credit card

Info

Publication number: WO2023153810A1
Application number: PCT/KR2023/001866
Authority: WO
Inventors: 이창일; 윤성중
Original assignee: 코나아이 주식회사
Priority date: 2022-02-08
Filing date: 2023-02-08
Publication date: 2023-08-17
Also published as: KR20230119920A

Abstract

A fingerprint credit card according to an embodiment of the present invention comprises: a front printed sheet; a rear printed sheet; a chip pad provided between the front printed sheet and the rear printed sheet and having an IC chip mounted thereon; and an inlay sheet having a fingerprint recognition sensor mounted thereon, wherein a pad mounting portion on which the chip pad is mounted and a sensor mounting portion on which the fingerprint recognition sensor is mounted may be provided symmetrically on the inlay sheet with respect to a virtual vertical central axis of the inlay sheet.

Description

fingerprint credit card

The present invention relates to a fingerprint credit card, and more particularly, since a pad mounting portion on which a chip pad on which an IC chip is mounted is mounted and a sensor mounting portion on which a fingerprint recognition sensor is mounted have a symmetrical structure on an inlay sheet, mounting portions on a printing sheet or the like When forming a hole for a fingerprint credit card, the manufacturing time can be shortened and productivity can be improved because the position of equipment such as a milling machine can be left as it is or adjusted to a minimum, and the process can be executed while rotating the printing sheet. It is about.

In general, credit cards can be used instead of cash, and recently developed as smart cards with built-in IC chips capable of recording large amounts of information, and are actively used not only for payment but also for various membership cards.

Most of these credit cards have conventionally been plastic cards, but recently, multi-purpose fingerprint credit cards have been developed and commercialized. To elaborate, the European Union (EU) has officially announced that it will commercialize multi-purpose fingerprint credit cards, and recently, domestic companies have also announced that they will expand their business areas to the new fingerprint credit card platform market.

Such a fingerprint credit card is a card in which an integrated circuit chip capable of storing and authenticating user fingerprint information is embedded. Payment can be made by inserting or touching the card into the terminal while placing the finger on the fingerprint sensor.

In a general configuration of such a fingerprint credit card, it may include an inlay, a front printed sheet disposed on the front surface thereof, a rear printed sheet disposed on the rear surface thereof, and overlays respectively provided on outer surfaces of the front printed sheet and the rear printed sheet. can

Here, a fingerprint sensor for fingerprint recognition may be mounted on the inlay, and a COB pad having an integrated circuit chip embedded therein may be mounted.

However, since conventional fingerprint credit cards usually have an asymmetric structure when the location where the fingerprint recognition sensor is mounted and the location where the integrated circuit chip is mounted are based on the center of the card, when milling the front chip mounting hole, for example, Since the COB hole must first be milled using a milling machine and then the position of the equipment must be readjusted to process the hole of the fingerprint sensor, the manufacturing process is somewhat complicated, and thus the manufacturing time is also limited.

Accordingly, there is a demand for a fingerprint credit card with a new configuration capable of improving productivity by reducing manufacturing time by simplifying the processing of the hole of the fingerprint recognition sensor and the COB hole in the fingerprint credit card.

As related prior art, Korean Patent Registration No. 10-1730138 (title of invention: smart card integrally equipped with a fingerprint recognition chip and a thermoelectric element) and the like.

In the embodiment of the present invention, since the pad mounting part on which the chip pad on which the IC chip is mounted and the sensor mounting part on which the fingerprint recognition sensor is mounted have a symmetrical structure on the inlay sheet, when forming holes for mounting parts such as a printing sheet, a milling machine and Since the position of the same equipment can be left as it is or adjusted to the minimum position, and the corresponding process can be executed while rotating the printing sheet, etc., the manufacturing time can be shortened, thereby providing a fingerprint credit card that can improve productivity.

The problem to be solved by the present invention is not limited to the above-mentioned problem (s), and another problem (s) not mentioned will be clearly understood by those skilled in the art from the following description.

A fingerprint credit card according to an embodiment of the present invention is provided between a front-printed sheet, a back-printed sheet, and the front-printed sheet and the back-printed sheet, and a chip pad equipped with an IC chip and an inlay equipped with a fingerprint recognition sensor. It may include a sheet, and on the inlay sheet, a pad mounting portion on which the chip pad is mounted and a sensor mounting portion on which the fingerprint recognition sensor is mounted may be provided symmetrically with respect to a virtual vertical central axis of the inlay sheet.

According to one side, the pad mounting portion and the sensor mounting portion on the inlay sheet may be provided symmetrically with respect to the virtual vertical central axis of the inlay sheet, but may be provided to be staggeredly symmetrical with respect to the virtual horizontal central axis.

According to one side, the sensor mounting unit and the pad mounting unit are connected by a plurality of connection coils, and the plurality of connection coils may be disposed on the inlay sheet in a non-overlapping manner.

According to one side, the plurality of connection coils may be VCC, RST, CLK, I/O, and GND coils.

According to one side, the plurality of connection coils may be spaced apart from each other by 0.5 mm or more in an ACF (Anisotropic Conductive Film) area where the chip pad and the sensor mounting part are mounted.

According to one side, the plurality of connection coils may be spaced apart from each other by 0.3 mm to 0.5 mm on the inlay sheet outside the ACF area.

According to one side, an operation check LED (LED) connected to the sensor mounting portion and a connection coil to check the operation of the fingerprint recognition sensor may be provided on the inlay sheet.

According to one side, the central point of the sensor mounting portion and the lower position of the operation confirmation LED may be at the same vertical position from the lower end of the inlay sheet.

According to one side, the fingerprint recognition sensor and the operation confirmation LED are connected by a connection coil, and when the fingerprint recognition sensor recognizes the stored fingerprint, the operation confirmation LED may be operated.

According to one side, the fingerprint credit card of this embodiment further includes a front overlay sheet attached to the front surface of the front print sheet and a rear overlay sheet provided on the rear surface of the back print sheet, wherein the front print sheet and the front overlay sheet A sensor through-hole through which the fingerprint recognition sensor passes and a pad through-hole through which the chip pad passes may be provided symmetrically with respect to a virtual vertical central axis in the sheet.

According to an embodiment of the present invention, since the pad mounting portion on which the chip pad on which the IC chip is mounted and the sensor mounting portion on which the fingerprint recognition sensor is mounted have a symmetrical structure on the inlay sheet, when forming holes for mounting portions on the printing sheet or the like, milling is performed. Since the position of equipment such as a machine can be left as it is or adjusted to a minimum, and the corresponding process can be executed while rotating the printing sheet, etc., manufacturing time can be shortened and productivity can be improved.

1 is an exploded perspective view of a fingerprint credit card according to an embodiment of the present invention.

Figure 2 is a schematic view of the inlay sheet shown in Figure 1;

FIG. 3 is a diagram showing intervals of a plurality of connection coils shown in FIG. 2 .

FIG. 4 is a diagram illustrating a disposition structure of a chip pad, a fingerprint recognition sensor, and an operation confirmation LED on the inlay sheet shown in FIG. 2 .

Advantages and/or features of the present invention, and methods of achieving them, will become apparent with reference to the following detailed description of the embodiments taken in conjunction with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below and will be implemented in various forms different from each other, only these embodiments make the disclosure of the present invention complete, and common knowledge in the art to which the present invention pertains. It is provided to completely inform the person who has the scope of the invention, and the present invention is only defined by the scope of the claims. Like reference numbers designate like elements throughout the specification.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is an exploded perspective view of a fingerprint credit card according to an embodiment of the present invention, FIG. 2 is a schematic diagram of an inlay sheet shown in FIG. 1, and FIG. 3 shows intervals between a plurality of connecting coils shown in FIG. FIG. 4 is a view showing a disposition structure of a chip pad, a fingerprint recognition sensor, and an operation confirmation LED on the inlay sheet shown in FIG. 2 .

As shown in these drawings, the fingerprint credit card 100 according to an embodiment of the present invention includes a front overlay sheet 110, a front printed sheet 120, an inlay sheet 130, and a rear side from the front. A print sheet 125 and a back overlay sheet 115 may be included.

In addition, through-

holes

111h, 112h, 121h, and 122h are provided in the front overlay sheet 110 and the front printed sheet 120, and the inlay sheet 130 is provided with

mounting portions

131 and 135, which are mounting areas, so that the inlay sheet 130 is provided with The chip pad 150 on which the IC chip is mounted may be mounted on the pad mounting portion 135 of 130, and the fingerprint recognition sensor 150 may be mounted on the sensor mounting portion 131.

The front overlay sheet 110 of this embodiment covers the front printed sheet 120 and may be made of a transparent material, for example plastic, so that the logo or characteristics of the card printed on the front printed sheet 120 It can be seen through the front overlay sheet 110 .

Sensor through-

holes

111h and 121h for penetrating the fingerprint recognition sensor 150 and pad through-holes 112h through which the chip pad 150 passes through the front overlay sheet 110 and the front printed sheet 120, respectively. 122h) may be provided. The sensor through-

holes

111h and 121h of the fingerprint recognition sensor 150 and the pad through-

holes

112h and 122h of the chip pad 150 have a symmetrical structure, thereby forming through-

holes

111h and 112h. , 121h, 122h) The formation process can be performed simply, which will be described later.

On the other hand, the inlay sheet 130 of this embodiment is substantially a part to which the main components of the fingerprint credit card 100 are mounted, and as shown in FIG. 1, a sensor mounting portion to which a fingerprint recognition sensor 150 is mounted on one side 131 may be provided, and a pad mounting portion 135 to which the chip pad 150 is mounted symmetrically may be provided.

Also, an operation confirmation LED 180 for confirming an operation of the fingerprint recognition sensor 150 may be mounted in an area adjacent to the fingerprint recognition sensor 150 in the inlay sheet 130 .

In other words, a circuit pattern is formed on the inlay sheet 130 by a connection circuit or the like at the portion where the sensor mounting portion 131, the pad mounting portion 135, and the operation confirmation LED 180 are mounted, and the circuit pattern is formed. Each of the fingerprint recognition sensor 150, the chip pad 150 and the operation confirmation LED 180 may be mounted on the part.

However, as described above, in the prior art, for example, the process was somewhat complicated by forming the mounting portion of the chip pad, repositioning the equipment, and then forming the mounting portion of the fingerprint recognition sensor, and thus reducing productivity. there was.

However, in the case of the fingerprint credit card 100 of this embodiment, as shown in FIGS. 1 to 4, the pad mounting portion 135 and the sensor mounting portion 131 on the inlay sheet 130 not only have a symmetrical structure but also operate. The part where the confirmation LED 180 is mounted also has a structure corresponding to the position of the sensor mounting part 131, thereby simplifying the process and thus improving productivity.

Referring to FIGS. 2 and 3 , the front surface of the inlay sheet 130 of the present embodiment may have a pad mounting portion 135 and a sensor mounting portion 131 symmetrically provided with respect to a virtual vertical central axis S1. .

More specifically, on the inlay sheet 130, the pad mounting portion 135 and the sensor mounting portion 131 are provided symmetrically with respect to a virtual vertical central axis S1 and also based on a virtual horizontal central axis S2. may be provided to be staggered symmetrical.

In other words, starting from the upper left corner and the lower right corner in FIG. 4 , the position of the center point of the pad mounting part 135 and the position of the center point of the sensor mounting part 131 may be located at the same place. Referring to the upper drawing of FIG. 4 , the center point of the pad mounting portion 135 has a vertical length of w1 and a horizontal length of w2 from the top left vertex of the inlay sheet 130. The center may also have a vertical length w1 and a horizontal length w2 from the right lower vertex of the inlay sheet 130 .

Therefore, the pad mounting part 135 and the sensor mounting part 131 on the inlay sheet 130 have a mutually symmetrical structure, so that when the center point of the pad mounting part 135 is rotated 180 degrees, the center point of the sensor mounting part 131 is at the same position. It can be placed, and therefore, the process performed on each mounting part (131, 135) can be performed easily.

Through this, it is possible to form an antenna structure or a circuit pattern structure corresponding to the design position.

In other words, since the pad mounting part 135 and the sensor mounting part 131 can have the same position due to the rotation of the inlay sheet 130, the mounting part can be processed directly without adjusting the position of the equipment, which takes time according to the position adjustment of the equipment. which can reduce the need.

That is, the same equipment can be used for forming the pad mounting portion 135 and the sensor mounting portion 131, and some process conditions or tooling can be changed.

However, the width or width of the pad mounting portion 135 or the sensor mounting portion 131 may be different, so position adjustment of the equipment may be required, but even in this case, the position adjustment value is small, so it can be quickly adjusted, and this position adjustment can also be set in advance. It can be performed accurately and accurately by automatic control.

On the other hand, as shown in Figures 2 to 4, the fingerprint credit card 100 of this embodiment is provided on the inlay sheet 130 and is connected to the sensor mounting portion 131 and the connection coil 170 to the fingerprint recognition sensor ( An operation check LED (LED) 180 for checking the operation of 150 may be further included.

Referring to FIG. 4 , the central point of the sensor mount 131 and the lower end of the operation confirmation LED 180 may be located at the same vertical length w1 from the lower end of the inlay sheet 130 . Therefore, since the process for the sensor mounting unit 131 can be performed using any device and then the process for the operation confirmation LED 180 can be executed immediately after adjusting the horizontal position of the device, the time required to adjust the position of the device can be reduced. can be shortened

As such, the pad mounting portion 135 on which the chip pad 150 on which the IC chip is mounted and the sensor mounting portion 131 on which the fingerprint recognition sensor 150 is mounted are provided in a symmetrical structure, and the operation confirmation LED 180 The inlay sheet 130 also has a position corresponding to the position of the sensor mount 131, so that the manufacturing process and the like can be simplified, and thus productivity can be improved.

As described above, through-

holes

111h, 112h, 121h, and 122h are provided in the front overlay sheet 110 and the front printing sheet 120 to correspond to the symmetric structure of the mounting

portions

131 and 135 of the inlay sheet 130. .

In other words, since the through

holes

111h, 112h, 121h, and 122h have a symmetrical structure, as shown in FIGS. 1 and 4, the front overlay sheet 110 and the front printed sheet 120 also correct the position of the milling machine. Without it, the through hole formation can be performed easily by simply rotating the

sheets

110 and 120 .

Meanwhile, referring to FIGS. 2 and 3 , the sensor mounting portion 131 on which the fingerprint recognition sensor 150 is mounted and the pad mounting portion 135 on which the chip pad 150 is mounted are provided with a plurality of connection coils on the inlay sheet 130. (160: 160a, 160b, 160c, 160d, 160e), the plurality of connection coils 160 may be arranged at mutually set intervals so as not to overlap.

Here, the plurality of connection coils 160 may be VCC, RST, CLK, I/O, and GND coils, but are not limited thereto.

The plurality of connection coils 160 may be spaced apart from each other by 0.5 mm or more in the ACF (Anisotropic Conductive Film)

regions

131a and 135a where the pad mounting portion 135 and the sensor mounting portion 131 are formed. In other words, in the

ACF regions

131a and 135a, it is necessary to meet the insulation resistance requirements. In the present embodiment, the requirements can be met by providing a mutual distance of 0.5 mm between the connecting coils 160.

Referring to FIG. 3 , the distance d1 between the connection coils 160 in the sensor mounting part 131 may be, for example, 1.25 mm, and the distance d4 between the connection coils 160 in the pad mounting part 135 is eg. For example, it may be 0.7 or 0.8 mm. As such, the distance between the connection coils 160 in the

ACF regions

131a and 135a is set to be 0.5 mm or more, and thus problems caused by overlapping or close arrangement between the connection coils 160 can be prevented.

In addition, the plurality of connection coils 160 may be spaced apart from each other by 0.3 to 0.5 mm on the inlay sheet 130 other than the

ACF regions

131a and 135a. Referring to FIG. 3 , a plurality of connecting coils 160 are arranged in a straight line in parallel at the center of the inlay sheet 130, where a distance d2 between the connecting coils 160 may be, for example, 0.4 mm. . In addition, two rows of RF coils 165 are disposed along the periphery of the inlay sheet 130, and the distance d3 between the RF coils may also be 0.4 mm.

Since this section is not the

ACF area

131a, 135a, even if d2 and d3 have smaller values than the aforementioned d1 and d4, problems caused by overlapping or close arrangement between the connecting

coils

160 and 165 can be prevented. can

In other words, the thickness of the connection coil 160 mounted on the inlay sheet 130 may be, for example, 0.11 mm 0.014 mm, but is not limited thereto.

As such, according to one embodiment of the present invention, the pad mounting portion 135 on which the chip pad 150 on which the IC chip is mounted is mounted and the sensor mounting portion 131 on which the fingerprint recognition sensor 150 is mounted are the inlay sheet 130 ) Since it has a symmetrical structure on the printing sheet 120, etc., when forming through

holes

111h, 112h, 121h, 122h for the mounting

parts

131 and 135, the position of equipment such as a milling machine is left as it is or adjusted to a minimum. Since the process can be executed while rotating the printing sheet 120 and the like, the manufacturing time can be shortened and productivity can be improved.

Although specific embodiments according to the present invention have been described so far, various modifications are possible without departing from the scope of the present invention. Therefore, the scope of the present invention should not be limited to the described embodiments and should not be defined, but should be defined by not only the scope of the claims to be described later, but also those equivalent to the scope of these claims.

As described above, the present invention has been described by the limited embodiments and drawings, but the present invention is not limited to the above embodiments, and those skilled in the art in the field to which the present invention belongs can make various modifications and transformation is possible Therefore, the spirit of the present invention should be grasped only by the claims described below, and all equivalent or equivalent modifications thereof will be said to belong to the scope of the spirit of the present invention.

Claims

front printed sheet;

back printed sheet; and

an inlay sheet provided between the front printed sheet and the back printed sheet and equipped with a chip pad having an IC chip and a fingerprint recognition sensor;

Including,

The fingerprint credit card of claim 1 , wherein the pad mounting portion on the inlay sheet to which the chip pad is mounted and the sensor mounting portion to which the fingerprint recognition sensor is mounted are provided symmetrically with respect to a virtual vertical central axis of the inlay sheet.
According to claim 1,

On the inlay sheet, the pad mounting portion and the sensor mounting portion are provided symmetrically with respect to the virtual vertical central axis of the inlay sheet, but are provided so as to be staggeredly symmetrical with respect to the virtual horizontal central axis. Fingerprint credit card.
According to claim 2,

The fingerprint credit card, characterized in that the sensor mounting portion and the pad mounting portion are connected by a plurality of connecting coils, and the plurality of connecting coils are disposed on the inlay sheet in a non-overlapping manner.
According to claim 3,

The plurality of connection coils are VCC, RST, CLK, I / O, and GND coils, characterized in that the fingerprint credit card.
According to claim 4,

The plurality of connection coils are spaced apart from each other by 0.5 mm or more in an ACF (Anisotropic Conductive Film) area where the chip pad and the sensor mounting part are mounted.
According to claim 5,

The plurality of connection coils are spaced apart from each other by 0.3 to 0.5 mm on the inlay sheet outside the ACF area.
According to claim 2,

Fingerprint credit card, characterized in that characterized in that provided on the inlay sheet is provided with an operation confirmation LED (LED) connected to the sensor mounting portion and a connection coil to confirm the operation of the fingerprint recognition sensor.
According to claim 7,

Fingerprint credit card, characterized in that the central point of the sensor mounting portion and the lower position of the operation confirmation LED are at the same vertical position from the lower end of the inlay sheet.
According to claim 7,

The fingerprint recognition sensor and the operation confirmation LED are connected by a connection coil, and the operation confirmation LED operates when the fingerprint recognition sensor recognizes the stored fingerprint.
According to claim 1,

a front overlay sheet attached to the front surface of the front printing sheet; and

Further comprising a rear overlay sheet provided on the rear surface of the rear printing sheet,

The front printed sheet and the front overlay sheet are provided with a sensor through-hole through which the fingerprint recognition sensor passes and a pad through-hole through which the chip pad passes through, symmetrically with respect to a virtual vertical central axis.