WO2023140698A1 - Electronic device comprising antenna - Google Patents

Electronic device comprising antenna Download PDF

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Publication number
WO2023140698A1
WO2023140698A1 PCT/KR2023/001045 KR2023001045W WO2023140698A1 WO 2023140698 A1 WO2023140698 A1 WO 2023140698A1 KR 2023001045 W KR2023001045 W KR 2023001045W WO 2023140698 A1 WO2023140698 A1 WO 2023140698A1
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WO
WIPO (PCT)
Prior art keywords
electronic device
holes
disposed
dielectric
substrate
Prior art date
Application number
PCT/KR2023/001045
Other languages
French (fr)
Korean (ko)
Inventor
이국주
김승환
윤신호
임영준
임재호
조영준
천재봉
황순호
Original Assignee
삼성전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020220038824A external-priority patent/KR20230114152A/en
Application filed by 삼성전자 주식회사 filed Critical 삼성전자 주식회사
Publication of WO2023140698A1 publication Critical patent/WO2023140698A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/44—Details of, or arrangements associated with, antennas using equipment having another main function to serve additionally as an antenna, e.g. means for giving an antenna an aesthetic aspect
    • H01Q1/46—Electric supply lines or communication lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/52—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/16—Resonant antennas with feed intermediate between the extremities of the antenna, e.g. centre-fed dipole
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields

Definitions

  • Various embodiments of the present disclosure relate to an electronic device including an antenna.
  • a communication system eg, 5G (5th generation), pre-5G communication system, or new radio (NR) that transmits or receives signals using a frequency of a high-frequency (eg, mmWave) band (eg, 3 GHz to 300 GHz band) is being studied to meet the increasing demand for wireless data traffic.
  • a high-frequency band eg, 3 GHz to 300 GHz band
  • Wireless communication technology can transmit or receive wireless signals using the mmWave band (eg, a frequency band ranging from about 3 GHz to 100 GHz), overcome high free space loss due to frequency characteristics, and increase antenna gain.
  • An efficient mounting structure and a new antenna structure (eg, an antenna module) corresponding to this are being developed.
  • the antenna structure may include an antenna array in which various numbers of antenna elements (eg, conductive patches and/or conductive patterns) are disposed at regular intervals on a substrate.
  • the antenna structure may be arranged such that a beam pattern is formed in one direction inside the electronic device.
  • the antenna structure may be arranged so that a directional beam is formed in an external direction of the electronic device through a non-conductive structure (eg, a non-conductive portion on a side surface of the electronic device, a front portion of the electronic device except for a display, or a rear surface of the electronic device) in an internal space of the electronic device.
  • a non-conductive structure eg, a non-conductive portion on a side surface of the electronic device, a front portion of the electronic device except for a display, or a rear surface of the electronic device
  • the electronic device may include a side member including a conductive member to reinforce rigidity and form a beautiful appearance. At least a portion of the side member may include through-holes (eg, openings) aligned with each of the antenna elements so that the antenna structure radiates a directional beam to the outside through the side member. Accordingly, the antenna structure may include a metal transmissive antenna array that transmits a directional beam from an internal space of the electronic device to the outside through through-holes.
  • the directional beam of the antenna structure must pass through an injection material (eg, dielectric) filled in a plurality of through-holes, radiation loss or radiation distortion may occur, thereby reducing radiation performance of the antenna.
  • the thickness of the injection-molded material may be increased or the separation distance between the antenna structure and the injection-molded material may be spaced at a certain distance.
  • such a structural change may occupy a lot of space in the electronic device and may go against the slimness of the electronic device.
  • Various embodiments of the present disclosure may provide an electronic device including an antenna having a through hole of a side member and a structure capable of helping to improve radiation performance by using a dielectric disposed in the through hole.
  • an electronic device includes a housing including a side member formed through a conductive member and including a plurality of through-holes spaced apart at predetermined intervals, an antenna structure disposed in the housing, a substrate including a plurality of feeding parts arranged to correspond to each of the plurality of through-holes in an internal space of the housing, and an antenna structure including a dielectric having a designated permittivity filled in the plurality of through-holes, and disposed to be electrically connected to the plurality of feeding parts in the internal space, designated through the dielectric It may include a radio communication circuit configured to transmit or receive a radio signal of a frequency band.
  • An electronic device includes an antenna (eg, a dielectric resonator antenna (DRA)) using a dielectric filled in a plurality of through-holes formed in a conductive portion of a housing as a resonator, thereby enabling efficient design of a substrate including only a power supply unit, and improving radiation performance reduction such as loss or distortion due to through-holes formed of a conductive member.
  • an antenna eg, a dielectric resonator antenna (DRA)
  • DRA dielectric resonator antenna
  • FIG. 1 is a block diagram of an electronic device in a network environment according to various embodiments of the present disclosure.
  • FIG. 2 is a block diagram of an electronic device for supporting legacy network communication and 5G network communication according to various embodiments of the present disclosure.
  • 3A is a perspective view of a mobile electronic device according to various embodiments of the present disclosure.
  • 3B is a rear perspective view of a mobile electronic device according to various embodiments of the present disclosure.
  • 3C is an exploded perspective view of a mobile electronic device according to various embodiments of the present disclosure.
  • FIG. 4 is an exploded perspective view of an antenna structure according to various embodiments of the present disclosure.
  • FIG. 5A is diagrams illustrating an area 5a of the substrate of FIG. 4 according to various embodiments of the present disclosure.
  • 5B is a partial cross-sectional view of a substrate taken along line 5b-5b of FIG. 5A according to various embodiments of the present disclosure.
  • FIG. 6 is a graph comparing radiation performance of an antenna structure including the substrate of FIG. 5A according to various embodiments of the present disclosure and a comparative example.
  • FIG. 7A is an exploded perspective view of an electronic device including an antenna structure according to various embodiments of the present disclosure.
  • FIG. 7B is a combined perspective view of FIG. 7A according to various embodiments of the present disclosure.
  • FIG. 8A is a configuration diagram of an electronic device in which an antenna structure according to various embodiments of the present disclosure is disposed.
  • FIG. 8B is a partial cross-sectional view of an electronic device taken along line 8b-8b of FIG. 8A according to various embodiments of the present disclosure.
  • 9A is a graph illustrating radiation performance of the antenna structure of FIG. 4 according to various embodiments of the present disclosure.
  • 9B is a graph comparing radiation performance of the antenna structure of FIG. 4 according to various embodiments of the present disclosure and a comparative example.
  • 10A and 10B are graphs comparing current distributions of the antenna structure of FIG. 4 according to various embodiments of the present disclosure and a comparative example.
  • FIG. 11 is a graph comparing radiation performance of an antenna structure according to various embodiments of the present disclosure and a comparative example.
  • FIG. 12 is a diagram illustrating a change in size of through-holes according to a permittivity of a dielectric according to various embodiments of the present disclosure.
  • 13A to 13C are diagrams illustrating antenna structures according to various embodiments of the present disclosure.
  • an electronic device 101 may communicate with the electronic device 102 through a first network 198 (eg, a short-distance wireless communication network), or may communicate with at least one of the electronic device 104 and the server 108 through a second network 199 (eg, a long-distance wireless communication network).
  • the electronic device 101 may communicate with the electronic device 104 through the server 108 .
  • the electronic device 101 includes a processor 120, a memory 130, an input module 150, a sound output module 155, a display module 160, an audio module 170, a sensor module 176, an interface 177, a connection terminal 178, a haptic module 179, a camera module 180, a power management module 188, a battery 189, a communication module ( 190), a subscriber identification module 196, or an antenna module 197.
  • at least one of these components eg, the connection terminal 178) may be omitted or one or more other components may be added.
  • some of these components eg, sensor module 176, camera module 180, or antenna module 197) may be integrated into one component (eg, display module 160).
  • the processor 120 may, for example, execute software (eg, program 140) to control at least one other component (eg, hardware or software component) of the electronic device 101 connected to the processor 120, and may perform various data processing or calculations. According to one embodiment, as at least part of data processing or operation, processor 120 may store commands or data received from other components (e.g., sensor module 176 or communication module 190) in volatile memory 132, process the commands or data stored in volatile memory 132, and store resultant data in non-volatile memory 134.
  • software eg, program 140
  • processor 120 may store commands or data received from other components (e.g., sensor module 176 or communication module 190) in volatile memory 132, process the commands or data stored in volatile memory 132, and store resultant data in non-volatile memory 134.
  • the processor 120 may include a main processor 121 (eg, a central processing unit or an application processor) or a secondary processor 123 (eg, a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that may operate independently or together with the main processor 121.
  • a main processor 121 eg, a central processing unit or an application processor
  • a secondary processor 123 eg, a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor
  • the secondary processor 123 may be implemented separately from or as part of the main processor 121 .
  • the auxiliary processor 123 functions related to at least one of the components of the electronic device 101 (eg, the display module 160, the sensor module 176, or the communication module 190) along with the main processor 121 while the main processor 121 is in an active (eg, application execution) state or instead of the main processor 121 while the main processor 121 is in an inactive (eg, sleep) state. Alternatively, at least some of the states may be controlled.
  • the auxiliary processor 123 eg, an image signal processor or a communication processor
  • the auxiliary processor 123 may include a hardware structure specialized for processing an artificial intelligence model.
  • AI models can be created through machine learning. Such learning may be performed, for example, in the electronic device 101 itself where the artificial intelligence model is performed, or may be performed through a separate server (eg, the server 108).
  • the learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the above examples.
  • the artificial intelligence model may include a plurality of artificial neural network layers.
  • the artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), deep Q-networks, or a combination of two or more of the above, but is not limited to the above examples.
  • the artificial intelligence model may include, in addition or alternatively, software structures in addition to hardware structures.
  • the memory 130 may store various data used by at least one component (eg, the processor 120 or the sensor module 176) of the electronic device 101 .
  • the data may include, for example, input data or output data for software (eg, program 140) and commands related thereto.
  • the memory 130 may include volatile memory 132 or non-volatile memory 134 .
  • the program 140 may be stored as software in the memory 130 and may include, for example, an operating system 142 , middleware 144 , or an application 146 .
  • the input module 150 may receive a command or data to be used by a component (eg, the processor 120) of the electronic device 101 from the outside of the electronic device 101 (eg, a user).
  • the input module 150 may include, for example, a microphone, a mouse, a keyboard, a key (eg, a button), or a digital pen (eg, a stylus pen).
  • the sound output module 155 may output sound signals to the outside of the electronic device 101 .
  • the sound output module 155 may include, for example, a speaker or a receiver.
  • the speaker can be used for general purposes such as multimedia playback or recording playback.
  • a receiver may be used to receive an incoming call. According to one embodiment, the receiver may be implemented separately from the speaker or as part of it.
  • the display module 160 may visually provide information to the outside of the electronic device 101 (eg, a user).
  • the display module 160 may include, for example, a display, a hologram device, or a projector and a control circuit for controlling the device.
  • the display module 160 may include a touch sensor set to detect a touch or a pressure sensor set to measure the intensity of force generated by the touch.
  • the audio module 170 may convert sound into an electrical signal or vice versa. According to an embodiment, the audio module 170 may obtain sound through the input module 150, output sound through the sound output module 155, or an external electronic device (e.g., electronic device 102) (e.g., speaker or headphone) connected directly or wirelessly to the electronic device 101.
  • an external electronic device e.g., electronic device 102
  • speaker or headphone e.g., speaker or headphone
  • the sensor module 176 may detect an operating state (eg, power or temperature) of the electronic device 101 or an external environmental state (eg, a user state), and generate an electrical signal or data value corresponding to the detected state.
  • the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a bio sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.
  • the interface 177 may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device 101 to an external electronic device (eg, the electronic device 102).
  • the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.
  • HDMI high definition multimedia interface
  • USB universal serial bus
  • SD card interface Secure Digital Card interface
  • audio interface audio interface
  • connection terminal 178 may include a connector through which the electronic device 101 may be physically connected to an external electronic device (eg, the electronic device 102).
  • the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).
  • the haptic module 179 may convert electrical signals into mechanical stimuli (eg, vibration or motion) or electrical stimuli that a user may perceive through tactile or kinesthetic senses.
  • the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.
  • the camera module 180 may capture still images and moving images. According to one embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.
  • the power management module 188 may manage power supplied to the electronic device 101 .
  • the power management module 188 may be implemented as at least part of a power management integrated circuit (PMIC), for example.
  • PMIC power management integrated circuit
  • the battery 189 may supply power to at least one component of the electronic device 101 .
  • the battery 189 may include, for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell.
  • the communication module 190 may support establishment of a direct (e.g., wired) communication channel or wireless communication channel between the electronic device 101 and an external electronic device (e.g., the electronic device 102, the electronic device 104, or the server 108), and communication through the established communication channel.
  • the communication module 190 may include one or more communication processors that operate independently of the processor 120 (eg, an application processor) and support direct (eg, wired) communication or wireless communication.
  • the communication module 190 may include a wireless communication module 192 (eg, a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (eg, a local area network (LAN) communication module or a power line communication module).
  • a wireless communication module 192 eg, a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module
  • GNSS global navigation satellite system
  • wired communication module 194 eg, a local area network (LAN) communication module or a power line communication module.
  • a corresponding communication module among these communication modules may communicate with the external electronic device 104 through a first network 198 (eg, a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or an infrared data association (IrDA)) or a second network 199 (eg, a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a long-distance communication network such as a computer network (eg, a LAN or a WAN)).
  • a first network 198 eg, a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or an infrared data association (IrDA)
  • a second network 199 eg, a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a long-distance communication network such as a computer network (eg, a LAN or a WAN)
  • a computer network eg, a
  • the wireless communication module 192 may identify or authenticate the electronic device 101 within a communication network such as the first network 198 or the second network 199 using subscriber information (eg, International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196.
  • subscriber information eg, International Mobile Subscriber Identifier (IMSI)
  • IMSI International Mobile Subscriber Identifier
  • the wireless communication module 192 may support a 5G network after a 4G network and a next-generation communication technology, for example, NR access technology (new radio access technology).
  • NR access technology can support high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and access to multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)).
  • eMBB enhanced mobile broadband
  • mMTC massive machine type communications
  • URLLC ultra-reliable and low-latency communications
  • the wireless communication module 192 may support various technologies for securing performance in a high frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), antenna array, analog beam-forming, or large scale antenna.
  • the wireless communication module 192 may support various requirements defined for the electronic device 101, an external electronic device (eg, the electronic device 104), or a network system (eg, the second network 199).
  • the wireless communication module 192 may support peak data rate (eg, 20 Gbps or more) for eMBB realization, loss coverage (eg, 164 dB or less) for mMTC realization, or U-plane latency (eg, downlink (DL) and uplink (UL) 0.5 ms or less, or round trip 1 ms or less) for realizing URLLC.
  • peak data rate eg, 20 Gbps or more
  • loss coverage eg, 164 dB or less
  • U-plane latency eg, downlink (DL) and uplink (UL) 0.5 ms or less, or round trip 1 ms or less
  • the antenna module 197 may transmit or receive signals or power to the outside (eg, an external electronic device).
  • the antenna module 197 may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (eg, PCB).
  • the antenna module 197 may include a plurality of antennas (eg, an antenna array). In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 198 or the second network 199 may be selected from the plurality of antennas by, for example, the communication module 190. A signal or power may be transmitted or received between the communication module 190 and an external electronic device through the selected at least one antenna.
  • other components eg, a radio frequency integrated circuit (RFIC) may be additionally formed as a part of the antenna module 197 in addition to the radiator.
  • RFIC radio frequency integrated circuit
  • the antenna module 197 may form a mmWave antenna module.
  • the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to a first surface (eg, bottom surface) of the printed circuit board and capable of supporting a designated high frequency band (eg, mmWave band), and a plurality of antennas (eg, antenna array) disposed on or adjacent to a second surface (eg, top surface or side surface) of the printed circuit board and capable of transmitting or receiving signals in the designated high frequency band.
  • peripheral devices e.g., a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)
  • signals e.g., commands or data
  • commands or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199 .
  • Each of the external electronic devices 102 or 104 may be the same as or different from the electronic device 101 .
  • all or part of operations executed in the electronic device 101 may be executed in one or more external electronic devices among the external electronic devices 102 , 104 , or 108 .
  • the electronic device 101 may request one or more external electronic devices to perform the function or at least part of the service, instead of or in addition to executing the function or service by itself.
  • One or more external electronic devices receiving the request may execute at least a part of the requested function or service or an additional function or service related to the request, and deliver the execution result to the electronic device 101 .
  • the electronic device 101 may provide the result as at least part of a response to the request as it is or additionally processed.
  • cloud computing distributed computing, mobile edge computing (MEC), or client-server computing technology may be used.
  • the electronic device 101 may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing.
  • the external electronic device 104 may include an internet of things (IoT) device.
  • Server 108 may be an intelligent server using machine learning and/or neural networks. According to one embodiment, the external electronic device 104 or server 108 may be included in the second network 199 .
  • the electronic device 101 may be applied to intelligent services (eg, smart home, smart city, smart car, or health care) based on 5G communication technology and IoT-related technology.
  • FIG. 2 is a block diagram 200 of an electronic device 101 for supporting legacy network communication and 5G network communication, according to various embodiments.
  • the electronic device 101 includes a first communication processor 212, a second communication processor 214, a first radio frequency integrated circuit (RFIC) 222, a second RFIC 224, a third RFIC 226, a fourth RFIC 228, a first radio frequency front end (RFFE) 232, a second RFFE 234, and a first antenna module 2 42), a second antenna module 244, and an antenna 248.
  • the electronic device 101 may further include a processor 120 and a memory 130 .
  • the network 199 may include a first network 292 and a second network 294 . According to another embodiment, the electronic device 101 may further include at least one of the components shown in FIG. 1, and the network 199 may further include at least one other network.
  • the first communication processor 212, the second communication processor 214, the first RFIC 222, the second RFIC 224, the fourth RFIC 228, the first RFFE 232, and the second RFFE 234 may form at least a portion of the wireless communication module 192.
  • the fourth RFIC 228 may be omitted or included as part of the third RFIC 226 .
  • the first communication processor 212 may establish a communication channel of a band to be used for wireless communication with the first network 292 and support legacy network communication through the established communication channel.
  • the first network may be a legacy network including a second generation (2G), 3G, 4G, or long term evolution (LTE) network.
  • the second communication processor 214 may establish a communication channel corresponding to a designated band (eg, about 6 GHz to about 60 GHz) among bands to be used for wireless communication with the second network 294, and support 5G network communication through the established communication channel.
  • the second network 294 may be a 5G network defined by 3GPP.
  • the first communication processor 212 or the second communication processor 214 may support establishment of a communication channel corresponding to another designated band (eg, about 6 GHz or less) among bands to be used for wireless communication with the second network 294, and 5G network communication through the established communication channel.
  • the first communication processor 212 and the second communication processor 214 may be implemented on a single chip or in a single package.
  • the first communication processor 212 or the second communication processor 214 may be formed with the processor 120, coprocessor 123, or communication module 190 on a single chip or in a single package.
  • the first RFIC 222 may convert a baseband signal generated by the first communication processor 212 into a radio frequency (RF) signal of about 700 MHz to about 3 GHz used in the first network 292 (e.g., a legacy network).
  • RF radio frequency
  • an RF signal is obtained from a first network 292 (eg, a legacy network) through an antenna (eg, the first antenna module 242), and preprocessed through an RFFE (eg, the first RFFE 232).
  • the first RFIC 222 may convert the preprocessed RF signal into a baseband signal to be processed by the first communication processor 212 .
  • the second RFIC 224 may convert the baseband signal generated by the first communication processor 212 or the second communication processor 214 into an RF signal (hereinafter referred to as a 5G Sub6 RF signal) of a Sub6 band (eg, about 6 GHz or less) used in the second network 294 (eg, a 5G network) during transmission.
  • a 5G Sub6 RF signal is obtained from the second network 294 (eg, 5G network) through an antenna (eg, the second antenna module 244), and the RFFE (eg, the second RFFE 234). It may be pre-processed.
  • the second RFIC 224 may convert the preprocessed 5G Sub6 RF signal into a baseband signal to be processed by a corresponding communication processor among the first communication processor 212 and the second communication processor 214 .
  • the third RFIC 226 converts the baseband signal generated by the second communication processor 214 into a 5G Above6 band (eg, about 6 GHz to about 60 GHz) RF signal (hereinafter, 5G Above6 RF signal) to be used in the second network 294 (eg, a 5G network).
  • 5G Above6 RF signal may be obtained from the second network 294 (eg, 5G network) through an antenna (eg, antenna 248) and pre-processed through a third RFFE 236.
  • the third RFIC 226 may convert the preprocessed 5G Above6 RF signal into a baseband signal to be processed by the second communication processor 214 .
  • the third RFFE 236 may be formed as part of the third RFIC 226 .
  • the electronic device 101 may include a fourth RFIC 228 separately from or at least as part of the third RFIC 226.
  • the fourth RFIC 228 converts the baseband signal generated by the second communication processor 214 into an RF signal (hereinafter referred to as an IF signal) of an intermediate frequency band (e.g., about 9 GHz to about 11 GHz), and then transfers the IF signal to the third RFIC 226.
  • the third RFIC 226 may convert the IF signal into a 5G Above6 RF signal.
  • the 5G Above6 RF signal may be received from the second network 294 (eg, 5G network) via an antenna (eg, antenna 248) and converted to an IF signal by a third RFIC 226.
  • the fourth RFIC 228 may convert the IF signal into a baseband signal so that the second communication processor 214 can process it.
  • the first RFIC 222 and the second RFIC 224 may be implemented as a single chip or at least part of a single package.
  • the first RFFE 232 and the second RFFE 234 may be implemented as a single chip or at least part of a single package.
  • at least one antenna module of the first antenna module 242 or the second antenna module 244 may be omitted or combined with another antenna module to process RF signals of a plurality of corresponding bands.
  • the third RFIC 226 and the antenna 248 may be disposed on the same substrate to form the third antenna module 246 .
  • the wireless communication module 192 or processor 120 may be disposed on a first substrate (eg, main PCB).
  • the third RFIC 226 is disposed on a part (eg, lower surface) of a second substrate (eg, sub PCB) separate from the first substrate, and the antenna 248 is disposed on another part (eg, upper surface) to form the third antenna module 246.
  • the electronic device 101 can improve the quality or speed of communication with the second network 294 (eg, 5G network).
  • the antenna 248 may be formed of an antenna array including a plurality of antenna elements that may be used for beamforming.
  • the third RFIC 226 may include, for example, a plurality of phase shifters 238 corresponding to a plurality of antenna elements as a part of the third RFFE 236.
  • each of the plurality of phase converters 238 may convert the phase of a 5G Above6 RF signal to be transmitted to the outside of the electronic device 101 (eg, a base station of a 5G network) through a corresponding antenna element.
  • each of the plurality of phase converters 238 may convert the phase of the 5G Above6 RF signal received from the outside through the corresponding antenna element into the same or substantially the same phase. This enables transmission or reception through beamforming between the electronic device 101 and the outside.
  • the second network 294 may be operated independently of the first network 292 (eg, legacy network) (eg, Stand-Alone (SA)) or connected (eg, Non-Stand Alone (NSA)).
  • a 5G network may include only an access network (eg, a 5G radio access network (RAN) or a next generation RAN (NG RAN)) and no core network (eg, a next generation core (NGC)).
  • the electronic device 101 may access an external network (eg, the Internet) under the control of a core network (eg, evolved packed core (EPC)) of the legacy network.
  • EPC evolved packed core
  • Protocol information for communication with a legacy network e.g., LTE protocol information
  • protocol information for communication with a 5G network e.g., New Radio (NR) protocol information
  • NR New Radio
  • 3A is a perspective view of the front of an electronic device 300 according to various embodiments of the present disclosure.
  • 3B is a perspective view of the back of the electronic device 300 of FIG. 3A according to various embodiments of the present disclosure.
  • the electronic device 300 of FIGS. 3A and 3B may be at least partially similar to the electronic device 101 of FIG. 1 or may include other embodiments of the electronic device.
  • an electronic device 300 may include a first surface (or front surface) 310A, a second surface (or rear surface) 310B, and a housing 310 including a side surface 310C surrounding a space between the first surface 310A and the second surface 310B.
  • the housing 310 may refer to a structure forming some of the first face 310A, the second face 310B, and the side face 310C of FIG. 1 .
  • the first surface 310A may be formed by a front plate 302 (eg, a glass plate including various coating layers, or a polymer plate) that is at least partially transparent.
  • the second surface 310B may be formed by a substantially opaque back plate 311 .
  • the rear plate 311 may be formed of, for example, coated or colored glass, ceramic, polymer, metal (eg, aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials.
  • the side surface 310C may be formed by a side bezel structure (or "side member") 320 coupled to the front plate 302 and the rear plate 311 and including metal and/or polymer.
  • the back plate 311 and the side bezel structure 320 may be integrally formed and include the same material (eg, a metal material such as aluminum).
  • the front plate 302 may include a first region 310D that is curved and seamlessly extended from the first surface 310A toward the rear plate 311 at both ends of a long edge of the front plate 302.
  • the back plate 311 is curved from the second surface 310B toward the front plate 302 and extends seamlessly. It may include a second region 310E at both ends of the long edge.
  • the front plate 302 or the rear plate 311 may include only one of the first region 310D or the second region 310E.
  • the front plate 302 may not include the first region 310D and the second region 310E, but may include only a flat plane disposed parallel to the second surface 310B.
  • the side bezel structure 320 when viewed from the side of the electronic device 300, may have a first thickness (or width) on a side surface that does not include the first area 310D or second area 310E, and may have a second thickness smaller than the first thickness on a side surface including the first area or the second area.
  • the electronic device 300 may include at least one of a display 301, an input device 303, sound output devices 307 and 314, sensor modules 304 and 319, camera modules 305, 312 and 313, a key input device 317, an indicator (not shown), and connectors 308 and 309.
  • the electronic device 300 may omit at least one of the components (eg, the key input device 317 or the indicator) or may additionally include other components.
  • the display 301 may be exposed through a substantial portion of the front plate 302, for example. In some embodiments, at least a portion of the display 301 may be exposed through the front plate 302 forming the first surface 310A and the first region 310D of the side surface 310C.
  • the display 301 may be combined with or disposed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and/or a digitizer that detects a magnetic field type stylus pen.
  • at least a portion of the sensor modules 304 and 319 and/or at least a portion of the key input device 317 may be disposed in the first area 310D and/or the second area 310E.
  • the input device 303 may include a microphone 303 .
  • the input device 303 may include a plurality of microphones 303 disposed to detect the direction of sound.
  • the sound output devices 307 and 314 may include speakers 307 and 314 .
  • the speakers 307 and 314 may include an external speaker 307 and a receiver 314 for communication.
  • the microphone 303, the speakers 307 and 314, and the connectors 308 and 309 are disposed in the space of the electronic device 300 and may be exposed to the external environment through at least one hole formed in the housing 310.
  • the hole formed in the housing 310 may be commonly used for the microphone 303 and the speakers 307 and 314.
  • the sound output devices 307 and 314 may include a speaker (eg, a piezo speaker) that operates while excluding holes formed in the housing 310 .
  • the sensor modules 304 and 319 may generate electrical signals or data values corresponding to an internal operating state of the electronic device 300 or an external environmental state.
  • the sensor modules 304 and 319 may include, for example, a first sensor module 304 (eg, a proximity sensor) and/or a second sensor module (not shown) (eg, a fingerprint sensor) disposed on the first surface 310A of the housing 310, and/or a third sensor module 319 (eg, an HRM sensor) disposed on the second surface 310B of the housing 310.
  • the fingerprint sensor may be disposed on the first surface 310A of the housing 310 .
  • a fingerprint sensor (eg, an ultrasonic or optical fingerprint sensor) may be disposed under the display 301 of the first surface 310A.
  • the electronic device 300 may further include at least one of a sensor module (not shown), for example, a gesture sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a bio sensor, a temperature sensor, a humidity sensor, or an illuminance sensor 304.
  • a sensor module for example, a gesture sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a bio sensor, a temperature sensor, a humidity sensor, or an illuminance sensor 304.
  • the camera modules 305, 312, and 313 may include a first camera device 305 disposed on the first surface 310A of the electronic device 300, a second camera device 312 disposed on the second surface 310B, and/or a flash 313.
  • the camera modules 305 and 312 may include one or a plurality of lenses, an image sensor, and/or an image signal processor.
  • the flash 313 may include, for example, a light emitting diode or a xenon lamp. In some embodiments, two or more lenses (wide angle and telephoto lenses) and image sensors may be disposed on one side of the electronic device 300 .
  • the key input device 317 may be disposed on the side surface 310C of the housing 310 .
  • the electronic device 300 may not include some or all of the above-mentioned key input devices 317, and the key input devices 317 that are not included may be implemented in other forms such as soft keys on the display 301.
  • the key input device 317 may be implemented using a pressure sensor included in the display 301 .
  • the indicator may be disposed on the first surface 310A of the housing 310, for example.
  • the indicator may provide, for example, state information of the electronic device 300 in the form of light.
  • the light emitting device may provide, for example, a light source interlocked with the operation of the camera module 305 .
  • Indicators may include, for example, LEDs, IR LEDs, and xenon lamps.
  • the connector holes 308 and 309 may include a first connector hole 308 capable of accommodating a connector (e.g., a USB connector or an interface connector port module (IF) module) for transmitting and receiving power and/or data to and from an external electronic device, and/or a second connector hole (or earphone jack) 309 capable of accommodating a connector for transmitting and receiving audio signals to and from an external electronic device.
  • a connector e.g., a USB connector or an interface connector port module (IF) module
  • IF interface connector port module
  • Some of the camera modules 305 of the camera modules 305 and 312 , some of the sensor modules 304 of the sensor modules 304 and 319 , or indicators may be disposed to be exposed through the display 101 .
  • the camera module 305, the sensor module 304, or the indicator may be disposed in the internal space of the electronic device 300 to be in contact with the external environment through an opening perforated to the front plate 302 of the display 301.
  • some sensor modules 304 may be arranged to perform their functions without being visually exposed through the front plate 302 in the internal space of the electronic device.
  • the area of the display 301 facing the sensor module may not require a perforated opening.
  • 3C is an exploded perspective view of the electronic device 300 of FIG. 3A according to various embodiments of the present disclosure.
  • the electronic device 300 may include a side member 320 (eg, a side bezel structure), a first support member 3211 (eg, a bracket), a front plate 302, a display 301, a printed circuit board 340, a battery 350, a second support member 360 (eg, a rear case), an antenna 370, and a rear plate 311.
  • the electronic device 300 may omit at least one of the components (eg, the first support member 3111 or the second support member 360) or may additionally include other components. At least one of the components of the electronic device 300 may be the same as or similar to at least one of the components of the electronic device 300 of FIG. 3A or 3B, and overlapping descriptions will be omitted below.
  • the first support member 3211 may be disposed inside the electronic device 300 and connected to the side member 320 or integrally formed with the side member 320 .
  • the first support member 3211 may be formed of, for example, a metal material and/or a non-metal (eg, polymer) material.
  • the display 301 may be coupled to one surface of the first support member 3211 and the printed circuit board 340 may be coupled to the other surface.
  • a processor, memory, and/or interface may be mounted on the printed circuit board 340 .
  • the processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor.
  • Memory may include, for example, volatile memory or non-volatile memory.
  • the interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and/or an audio interface.
  • HDMI high definition multimedia interface
  • USB universal serial bus
  • the interface may electrically or physically connect the electronic device 300 to an external electronic device, and may include a USB connector, an SD card/MMC connector, or an audio connector.
  • the battery 350 is a device for supplying power to at least one component of the electronic device 300, and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery 350 may be disposed on a substantially coplanar surface with the printed circuit board 340 , for example.
  • the battery 350 may be integrally disposed inside the electronic device 300 or may be disposed detachably from the electronic device 300 .
  • the antenna 370 may be disposed between the rear plate 311 and the battery 350 .
  • the antenna 370 may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and/or a magnetic secure transmission (MST) antenna.
  • the antenna 370 may, for example, perform short-range communication with an external device or wirelessly transmit/receive power required for charging.
  • an antenna structure may be formed by a part of the side member 320 and/or the first support member 3211 or a combination thereof.
  • FIG. 4 is an exploded perspective view of an antenna structure according to various embodiments of the present disclosure.
  • an antenna structure 500 (eg, an antenna module) is disposed in an internal space (eg, the internal space 6001 of FIG. 7B ) of an electronic device (eg, the electronic device 600 of FIG. 7A ), and includes a substrate 590 (eg, a printed circuit board) and a housing 610 including a plurality of power feeding units 510 , 520 , 530 , 540 , and 550 .
  • a substrate 590 eg, a printed circuit board
  • housing 610 including a plurality of power feeding units 510 , 520 , 530 , 540 , and 550 .
  • a dielectric material 620c having a specified permittivity may be formed on the conductive member 620a (eg, a metal material) and filled in the plurality of through holes 6231, 6232, 6233, 6234, and 6235 formed to correspond to the plurality of power feeding units 510, 520, 530, 540, and 550.
  • the substrate 590 may include a plurality of power feeding parts 510, 520, 530, 540, and 550 disposed at positions corresponding to the plurality of through holes 6231, 6232, 6233, 6234, and 6235, respectively.
  • the antenna structure 500 may include a dielectric resonator antenna (DRA) using the dielectric 620c as a resonator.
  • DRA dielectric resonator antenna
  • the substrate 590 may include a first surface 5901 facing a designated direction (eg, 1 direction) and a second surface 5902 facing a direction opposite to the first surface 5901 (eg, 2 direction).
  • the substrate 590 may include a plurality of power feeding units 510, 520, 530, and 540 disposed at a position relatively closer to the first surface 5901 than the second surface 5902 in a space between the first surface 5901 and the second surface 5902, or exposed on the first surface 5901 and arranged in an array (eg, a feeding portion array (FA)) manner. , 550).
  • FA feeding portion array
  • the plurality of power feeders 510, 520, 530, 540, and 550 may include a first feeder 510, a second feeder 520, and a third feeder 530, a fourth feeder 540, and a fifth feeder 550 spaced apart from each other at designated intervals.
  • the plurality of power feeders 510, 520, 530, 540, and 550 include first polarized wave feeders 511, 521, 531, 541, and 551 (eg, a vertical polarized wave feeder) and second polarized wave feeders 512, 522, 532, 542, and 552 (eg, a horizontally polarized wave feeder). ) may be included.
  • the antenna structure 500 may operate as a dual polarized antenna array using the dielectric 620c as a resonator.
  • each of the plurality of power feeding units 510, 520, 530, 540, and 550 may include one power feeding unit.
  • the antenna structure 500 may be operated as a single polarized antenna using a dielectric material as a resonator.
  • the housing 610 may include a side member 620 .
  • the side member 620 may include a conductive member 620a and a non-conductive member 620b combined with the conductive member 620a.
  • the non-conductive member 620b may be combined with the conductive member 620a through injection.
  • the non-conductive member 620b may be structurally coupled to the conductive member 620a.
  • the side member 620 may include a plurality of through holes 6231, 6232, 6233, 6234, and 6235 formed in an array manner (eg, a through hole array (TA)) at positions corresponding to each of the plurality of power feeding units 510, 520, 530, 540, and 550 disposed on the substrate 590.
  • TA through hole array
  • the plurality of through-holes 6231, 6232, 6233, 6234, and 6235 include a first through-hole 6231 disposed at a position corresponding to the first feeding part 510, a second through-hole 6232 disposed at a position corresponding to the second feeding part 520, and a third through-hole disposed at a position corresponding to the third feeding part 530. 6233, a fourth through hole 6234 disposed at a position corresponding to the fourth power supply unit 540, and a fifth through hole 6235 disposed at a position corresponding to the fifth power supply unit 550.
  • the plurality of through holes 6231 , 6232 , 6233 , 6234 , and 6235 may be formed in such a way that they penetrate from the inner surface 621 to the outer surface 622 of the side member 620 .
  • the plurality of through holes 6231 , 6232 , 6233 , 6234 , and 6235 may be filled with a dielectric material 620c.
  • the dielectric material 620c may be injected into the plurality of through holes 6231 , 6232 , 6233 , 6234 , and 6235 or filled through structural coupling.
  • the dielectric 620c may be formed of a material having a permittivity of 3 or more.
  • the non-conductive member 620b and the dielectric 620c of the housing 610 may include materials having different dielectric constants.
  • the non-conductive member 620b and the dielectric 620c of the housing 610 may be made of substantially the same material.
  • the non-conductive member 620b of the housing 610 and the dielectric 620c may be integrally formed.
  • the antenna structure 500 is disposed on the second surface 5902 of the substrate 590 and electrically connected to the plurality of power feeding units 510, 520, 530, 540, and 550. It may include a wireless communication circuit 595.
  • the wireless communication circuit 595 is disposed on a printed circuit board (PCB, printed circuit board) (eg, device board 630 of FIG. 8A) at a position spaced apart from the board 590 in an internal space (eg, internal space 6001 of FIG. 8A) of an electronic device (eg, electronic device 600 of FIG. 8A), and an electrical connection member (eg, FRC, flexible RF cable) (eg, electrical connection of FIG. 8A). It may be electrically connected to the substrate 590 through the member 560 .
  • PCB printed circuit board
  • FRC flexible RF cable
  • the wireless communication circuit 595 electrically connected to the plurality of antenna feeders 510, 520, 530, 540, and 550 may include an RFIC (eg, the RFICs 222, 224, 226, and/or 228 of FIG. 2).
  • the plurality of power feeding units 510, 520, 530, 540, and 550 are disposed on one surface of the substrate 590 (eg, the first surface 5901) or embedded close to the one surface, and the RFIC (eg, the RFICs 222, 224, 226, and/or RFICs 222, 224, 226, and/or or 228)) may be placed.
  • the wireless communication circuit 595 electrically connected to the plurality of feeders 510, 520, 530, 540, and 550 transmits a directional beam in a designated frequency band (eg, a frequency band ranging from about 3 GHz to 100 GHz) through a dielectric 620c filled in a plurality of through-holes 6231, 6232, 6233, 6234, and 6235.
  • a designated frequency band eg, a frequency band ranging from about 3 GHz to 100 GHz
  • the wireless communication circuit 595 may be set to transmit or receive a radio signal through the power feeders 511, 521, 531, 541, 551 operating in a first polarized wave (eg, vertical polarization) among the plurality of power feeders 510, 520, 530, 540, and 550.
  • the wireless communication circuit 595 operates with a second polarized wave (eg, horizontal polarization) among the plurality of power feeders 510, 520, 530, 540, and 550. It may be set to transmit or receive a radio signal through the feeders 512, 522, 532, 542, and 552.
  • a second polarized wave eg, horizontal polarization
  • the plurality of power feeding units 510 , 520 , 530 , 540 , and 550 may be arranged in a line on the substrate 590 .
  • the plurality of power feeding units 510, 520, 530, 540, and 550 may be arranged in a matrix form (eg, a 2x2 matrix form).
  • the plurality of power feeding units 510, 520, 530, 540, and 550 may have substantially the same shape.
  • the plurality of through holes 6231 , 6232 , 6233 , 6234 , and 6235 may be formed to have an arrangement structure corresponding to the plurality of power feeding units 510 , 520 , 530 , 540 , and 550 .
  • the antenna structure 500 may include a feeder array FA including five feeders 510, 520, 530, 540, and 550 disposed on the substrate 590, but is not limited thereto.
  • the antenna structure 500 may include one power supply unit or may include two, three, four, or six or more power supply units as a power supply array FA.
  • the antenna module 500 may include a protective member 596 disposed on the second surface 5902 of the substrate 590 and disposed to at least partially enclose the wireless communication circuit 595.
  • the protective member 596 is a protective layer disposed to surround the wireless communication circuit 595 and may include a dielectric that is hardened and/or solidified after being applied.
  • the protection member 596 may include epoxy resin.
  • the protection member 596 may be disposed to cover all or part of the wireless communication circuit 595 on the second surface 5902 of the substrate 590 .
  • the antenna module 500 may include a conductive shielding layer 597 laminated on a surface of the protection member 596 .
  • the conductive shielding layer 597 may block noise generated from the antenna structure 500 (eg, DC-DC noise or an interference frequency component) from being transferred to the surroundings.
  • the conductive shielding layer 597 may include a conductive material (eg, conductive paint) applied on the surface of the protective member 596 by a thin film deposition method such as sputtering.
  • the conductive shielding layer 597 may be electrically connected to a ground layer (eg, the ground layer 592 of FIG. 5B ) of the substrate 590 .
  • the protection member 596 and/or the conductive shielding layer 597 may be replaced with a shield can mounted on the substrate 590 or may be additionally added.
  • FIG. 5A is diagrams illustrating an area 5a of the substrate of FIG. 4 according to various embodiments of the present disclosure.
  • 5B is a partial cross-sectional view of a substrate taken along line 5b-5b of FIG. 5A according to various embodiments of the present disclosure.
  • FIG. 5A and FIG. 5B show an exploded perspective view of the laminated structure of area 5a of the substrate 590 of FIG. 4, and FIG. 5B shows a cross-sectional view of the substrate 590.
  • the remaining regions of the substrate 590 may also have substantially the same stacking structure and arrangement structure.
  • a substrate 590 may include a first surface 5901 facing a first direction (e.g., direction 1), a second surface 5902 facing an opposite direction to the first surface 5901, and conductive layers and insulating layers 591 disposed alternately in a space between the first surface 5901 and the second surface 5902.
  • the substrate 590 may include a ground plane 592 disposed on at least one insulating layer 591 .
  • the substrate 590 may include a plurality of plates 593 formed of a conductive material included in the conductive layers, disposed between the ground layer 592 and the first surface 5901 so as to overlap different insulating layers when the first surface 5901 is viewed from above.
  • the plurality of plates 593 may include a first plate 5931 , a second plate 5932 , and/or a third plate 5933 sequentially stacked from the first surface 5901 .
  • the plates 593 may include loop-shaped openings 5931a, 5932a, and 5933a.
  • the plates 593 and the openings 5931a, 5932a, and 5933a may be arranged to overlap when viewing the first surface 5901 from above.
  • the plates 593 may be electrically connected to the ground layer 592 through a plurality of conductive vias CV disposed in a manner penetrating the plates 593 .
  • the substrate 590 when looking at the first surface 5901 from above, the substrate 590 may include a shielding space S formed through the openings 5931a, 5932a, and 5933a of the plates 593 and the ground layer 592.
  • the substrate 590 may include a first feeding unit 510 disposed within the shielding space (S).
  • the first power supply unit 510 may include a power supply via 5111 penetrating the ground layer 592 and electrically connected to the wireless communication circuit 595 disposed on the second surface 5902 through the wiring structure 5101, and a power supply line 5112 extending or contacting a predetermined length in a direction perpendicular to the power supply via 5111.
  • feed line 5112 may be omitted. Accordingly, the shielding space S can reduce a phenomenon in which radio waves generated through the first power feeding unit 510 travel to the outside along the substrate 590 .
  • the shielded space S may include a substrate integrated waveguide (SIW) structure for transmitting radio waves formed from the first power feeding unit 510 .
  • the power supply line 5112 may be formed on a conductive layer formed by the first plate 5931.
  • the substrate 590 may be disposed in such a way that the first surface 5901 contacts the inner surface 621 of the side member 620 .
  • the first through hole 6231 may be disposed to correspond to the shielding space (S).
  • the shielding space S may overlap the shielding space S.
  • the first through hole 6231 and the shielding space S may have cross sections of substantially the same size or cross sections of different sizes.
  • the cross section of the first through hole 6231 may be larger or smaller than the cross section of the shielding space (S).
  • the first feeding part 510 disposed in the shielding space S may be disposed to overlap with the first through hole 6231 .
  • the substrate 590 may be disposed so that the first surface 5901 has a specified separation distance from the inner surface 621 of the side member 620 .
  • the first through hole 6231 may be filled with a dielectric having a specified permittivity (eg, a dielectric having a permittivity of 3 or more or a dielectric having a permittivity of 20 or more).
  • radio waves radiated through the first feeder 510 are transmitted to the first through hole 6231 without being leaked to the outside by the shielding space S (eg, the waveguide space) of the substrate 590, and may be radiated to the outside to transmit or receive radio signals in a designated frequency band using the dielectric 620c as a resonator.
  • the shielding space S eg, the waveguide space
  • the antenna structure 500 uses the dielectric 620c filled in the through-holes of the side member 620 (eg, the through-holes 6231, 6232, 6233, 6234, and 6235 of FIG. 4 ) as a resonator, a conductive patch is disposed on the substrate 590 and radiation loss is greater than that of a comparative example (eg, a metal transmissive antenna) configured to pass injection-molded materials filled in the through-holes. this can be written.
  • a comparative example eg, a metal transmissive antenna
  • the antenna structure 500 does not have an antenna element (eg, a conductive patch) disposed on the substrate 590 and only a power supply portion is formed without a separate additional process, an efficient substrate design may be possible.
  • the antenna structure 500 uses an E-wall characteristic in which five surfaces except through holes (eg, through holes 6231, 6232, 6233, 6234, and 6235 in FIG. 4) are made of metal surfaces, even if a dielectric 620c (eg, an injection-molded material) having a low dielectric strength of about 3.3 to 7 used as an injection-molded material (eg, a non-conductive member) in an existing electronic device is used, a desired ball is used. A true characteristic can be formed.
  • the metal support structure supporting the dielectric 620c is implemented through through-holes (eg, through-holes 6231, 6232, 6233, 6234, and 6235 of FIG. 4) to be formed in the conductive side member 620, an additional support structure for the dielectric 620c is not required, which can help slim down the electronic device.
  • FIG. 6 is a graph comparing radiation performance of an antenna structure including the substrate of FIG. 5A according to various embodiments of the present disclosure and a comparative example.
  • the radiation characteristics are not expressed (graph 601), but when the dielectric 620c filled in the through hole 6231 formed in the side member 620 is used (graph 602), it can be confirmed that the antenna characteristic (eg, return loss) of -10 dB or less is expressed in the designated frequency band (region 603) (eg, about 28 GHz band).
  • the antenna characteristic eg, return loss
  • region 603 eg, about 28 GHz band
  • 7A is an exploded perspective view of an electronic device including an antenna structure according to various embodiments of the present disclosure.
  • 7B is a combined perspective view of FIG. 7A according to various embodiments of the present disclosure.
  • 8A is a configuration diagram of an electronic device in which an antenna structure according to various embodiments of the present disclosure is disposed.
  • 8B is a partial cross-sectional view of an electronic device taken along line 8b-8b of FIG. 8A according to various embodiments of the present disclosure.
  • the electronic device 600 of FIGS. 7A to 8B is at least partially similar to the electronic device 101 of FIG. 1 , the electronic device 200 of FIG. 2A , and/or the electronic device 300 of FIG. 3C , or may include other embodiments of the electronic device.
  • FIG. 8A is a top plan view of the electronic device 600 viewed from the back with the rear cover (eg, the rear cover 380 of FIG. 8B ) removed.
  • the electronic device 600 eg, the electronic device 101 of FIG. 1 , the electronic device 200 of FIG. 2A , and/or the electronic device 300 of FIG. 3
  • the front cover 320 eg, the front plate 202 of FIG. 2A or the front cover 320 of FIG. 3
  • a housing 61 including a rear cover 380 (eg, the rear plate 211 of FIG. 2A or the rear cover 380 of FIG. 3) (eg, the second cover or the second plate) and a side member 620 (eg, the side bezel structure 320 of FIG. 3A or the side member 320 of FIG.
  • the electronic device 600 may include a display 330 arranged to be visible from the outside through at least a portion of the front cover 320 in the inner space 6001 of the housing 610 .
  • the display 330 may be disposed to be supported through a support member 6211 (eg, the first support member 3211 of FIG. 3C ) extending from the inner space 6001 from the side member 620.
  • the side member 620 may be at least partially formed of a conductive member 620a (eg, a metal material) and a non-conductive member 620b (eg, a polymer material) combined with the conductive member 620a.
  • the side member 620 may be formed by injection molding or structural coupling of the non-conductive member 620b to the conductive member 620a.
  • the side member 620 includes a first side surface 6201 having a first length, a second side surface 6202 extending in a direction perpendicular to the first side surface 6201 and having a second length longer than the first length, and a third side surface 6203 extending in a direction parallel to the first side surface 6201 from the second side surface 6202 and having a first length, and a third side surface 620. 3) may include a fourth side surface 6204 extending in a direction parallel to the second side surface 6202 and having a second length.
  • the electronic device 600 may include the antenna structure 500 .
  • the antenna structure 500 is fixed to at least a portion of the side member 620, and corresponds to a substrate 590 including a plurality of power feeding units FA (eg, the plurality of power feeding units 510, 520, 530, 540, and 550 of FIG. 4) and a plurality of through holes 6231 and 62 formed in the side member 620.
  • a plurality of power feeding units FA eg, the plurality of power feeding units 510, 520, 530, 540, and 550 of FIG.
  • 32, 6233, 6234, 6235 eg, TA
  • TA may include a dielectric 620c having a specified permittivity.
  • the antenna structure 500 has a directional beam in a direction toward which the second side surface 6202 is directed (eg, an x-axis direction) and/or a direction toward which the rear cover 380 is directed (eg, a -z-axis direction). It can be arranged so that a beam is formed.
  • the antenna structure 500 may be fixed to at least a portion (eg, the support member 6211) of the side member 620 through the support bracket 550 (eg, the conductive support bracket).
  • the electronic device 600 may further include a cover member 620d disposed to cover the plurality of through holes 6231 , 6232 , 6233 , 6234 , and 6235 of the side member 620 .
  • the side member 620 may include a recess corresponding to the cover member 620d.
  • the cover member 620d may cover the plurality of through holes 6231, 6232, 6233, 6234, and 6235 and the dielectric material 620c filled in the plurality of through holes 6231, 6232, 6233, 6234, and 6235 from being visible from the outside.
  • the cover member 620d may be applied as a decorative member.
  • the cover member 620d may be formed of a material having substantially the same permittivity as the dielectric 620c. In some embodiments, the cover member 620d may be formed of a dielectric having a permittivity different from that of the dielectric 620c (eg, greater permittivity). In some embodiments, the cover member 620d may be omitted, and the plurality of through holes 6231, 6232, 6233, 6234, and 6235 and the dielectric 620c may be covered so as not to be visible from the outside through a paint applied to the outer surface of the side member 620. According to one embodiment, the antenna structure 500 may operate as a DRA using the dielectric material 620c as a resonator.
  • the substrate 590 may be connected to a device substrate 630 (eg, a main substrate or a printed circuit board (PCB)) disposed in the internal space 6001 of the electronic device 600 and an electrical connection member (eg, FRC, flexible RF cable).
  • a device substrate 630 eg, a main substrate or a printed circuit board (PCB)
  • PCB printed circuit board
  • an electrical connection member eg, FRC, flexible RF cable
  • the device substrate 630 may include at least one wireless communication circuit (eg, the wireless communication module 192 of FIG. 1 ). According to one embodiment, the device substrate 630 may be electrically connected to the substrate 590 of the antenna structure 500 through an electrical connection member 560 (eg, FRC, flexible RF cable). According to one embodiment, the electronic device 600 may include a battery B disposed near the device substrate 630 or disposed at least partially overlapping the device substrate 630 .
  • an electrical connection member 560 eg, FRC, flexible RF cable
  • the antenna structure 500 may be set to form a directional beam in a direction (1 direction) (e.g., an x-axis direction) toward which the second side surface 6202 is directed by using a dielectric material 620c filled in a plurality of through holes 6231, 6232, 6233, 6234, and 6235 formed at corresponding positions of the side member 620 as a resonator.
  • the plurality of through holes 6231 , 6232 , 6233 , 6234 , and 6235 may be formed in such a way that they penetrate from the inner surface 621 to the outer surface 622 of the side member 620 .
  • the plurality of through holes (6231, 6232, 6233, 6234, 6235) when looking at the side member from the outside, the plurality of through holes (6231, 6232, 6233, 6234, 6235) the distance between the respective centers of the plurality of feeding parts (6231, 6232, 6233, 6234, 6235) It may be formed substantially the same as the respective distance.
  • the plurality of through holes 6231 , 6232 , 6233 , 6234 , and 6235 may be formed to have the same cross section from the inner surface 621 to the outer surface 622 of the side member 620 .
  • the plurality of through holes 6231 , 6232 , 6233 , 6234 , and 6235 may be formed to gradually widen as they progress from the inner surface 621 to the outer surface 622 .
  • each of the plurality of through holes 6231 , 6232 , 6233 , 6234 , and 6235 may have different inclinations.
  • each of the plurality of through-holes 6231 , 6232 , 6233 , 6234 , and 6235 may be formed in such a way that the angle with respect to the substrate 590 decreases as it moves left and right with respect to the center of the substrate 590 .
  • 9A is a graph illustrating radiation performance of the antenna structure of FIG. 4 according to various embodiments of the present disclosure.
  • an antenna structure 500 using, as a resonator, a dielectric material 620c filled in a plurality of power feeding units 510, 520, 530, 540, and 550 and a plurality of through-holes 6231, 6232, 6233, 6234, and 6235 formed in a side member 620 to correspond to the power feeding units is a first frequency band 901 area) (eg, about 28 GHz band) and the second frequency band (902 area) (eg, about 39 GHz band).
  • the antenna structure 500 has a TE101 mode (transverse electric 101 mode) resonance confirmed in a band of about 28 GHz, and a transverse electric 111 mode (TE111 mode) resonance has been confirmed in a band of about 39 GHz.
  • 9B is a graph comparing radiation performance of the antenna structure of FIG. 4 according to various embodiments of the present disclosure and a comparative example.
  • an antenna structure 500 (eg, DRA) using a plurality of power feeding units 510, 520, 530, 540, and 550 and a dielectric material 620c filled in a plurality of through holes 6231, 6232, 6233, 6234, and 6235 formed in the side member 620 to correspond to the power feeding units as a resonator is a first antenna structure 500 (eg, DRA).
  • a first antenna structure 500 eg, DRA
  • the frequency band eg, about 28 GHz band
  • antenna structure eg, comparative example
  • antenna elements eg, conductive patches
  • 10A and 10B are graphs comparing current distributions of the antenna structure of FIG. 4 according to various embodiments of the present disclosure and a comparative example.
  • the current distribution (area 1002) formed through the antenna structure 500 of the present disclosure using the dielectric 620c of FIG. 10B as a resonator is improved than the current distribution (area 1001) formed through the antenna structure of the comparative example of FIG. 10A.
  • FIG. 11 is a graph comparing radiation performance of an antenna structure according to various embodiments of the present disclosure and a comparative example.
  • an antenna structure 500 (eg, DRA) using a plurality of power feeding units 510, 520, 530, 540, and 550 and a dielectric material 620c filled in a plurality of through holes 6231, 6232, 6233, 6234, and 6235 formed in a side member 620 to correspond to the power feeding units as a resonator.
  • a gain of about 6 dB is expressed (graph 1102), while antenna elements (eg, conductive patches) are disposed on the substrate.
  • the radiation performance of the antenna structure (eg, comparative example) exhibits a gain of about 4 dB, so that a gain of about 2 dB is substantially improved.
  • FIG. 12 is a diagram illustrating a change in size of through-holes according to a permittivity of a dielectric according to various embodiments of the present disclosure.
  • the electronic device 600 may include a first through hole array (TA1) including first plurality of through holes 6241, 6242, 6243, 6244, and 6245 formed in the side member 620.
  • the first plurality of through-holes 6241 , 6242 , 6243 , 6244 , and 6245 may be filled with a dielectric material 620c - 1 having a first permittivity.
  • the electronic device 600 may include a second through hole array (TA2) including a plurality of second through holes 6251, 6252, 6253, 6254, and 6255 formed in the side member 620.
  • the plurality of second through-holes 6251, 6252, 6253, 6254, and 6255 may be filled with a dielectric material 620c-2 having a second permittivity higher than the first permittivity.
  • the size of the plurality of through holes may be adjusted according to the permittivity of the dielectric under the condition that the antenna structure (eg, the antenna structure 500 of FIG. 4 ) exhibits the same radiation performance.
  • the antenna structure eg, the antenna structure 500 of FIG. 4
  • each of the first plurality of through holes 6241, 6242, 6243, 6244, and 6245 may have a rectangular cross-section having a size of about 4.2 mm ⁇ 4.2 mm.
  • 6252, 6253, 6254, and 6255 may be formed into a rectangular cross section having a relatively small size of 3.4 mm x 3.4 mm.
  • the antenna structure e.g., the antenna structure 500 of FIG. 4
  • 13A to 13C are diagrams illustrating antenna structures according to various embodiments of the present disclosure.
  • an electronic device may include a side member 620 formed of a conductive member 620a and including a plurality of through holes 6261, 6262, 6263, 6264, and 6265.
  • the antenna structure 500-1 includes a plurality of power feeding units 510, 520, 530, 540, 520, 530, and 540 arranged to correspond to the plurality of through holes 6261, 6262, 6263, 6264, and 6265 in an internal space (eg, the internal space 6001 of FIG. 8A) of an electronic device (eg, the electronic device 600 of FIG. 8A).
  • the substrate 590 includes a first surface 5901 and a second surface 5902 facing the opposite direction to the first surface 5901, and each of the plurality of power feeding units 510, 520, 530, 540, and 550 disposed on the substrate 590 has a plurality of through holes 6261, 6262, 6263, 6264, 6265), the first surface 5901 may face (contact with) or be disposed close to the inner surface 621 of the side member 620, respectively.
  • the first feeder 510 among the plurality of feeders 510, 520, 530, 540, and 550 is disposed at a position corresponding to the first through-hole 6261 among the plurality of through-holes 6261, 6262, 6263, 6264, and 6265, and the second feeder 520 has a second through-hole 6 262)
  • the third feeder 530 is disposed at a position corresponding to the third through hole 6263
  • the fourth feeder 540 is disposed at a position corresponding to the fourth through hole 6264
  • the fifth feeder 550 may be disposed at a position corresponding to the fifth through hole 6265.
  • the plurality of through-holes 6261 , 6262 , 6263 , 6264 , and 6265 have a smaller angle with the substrate 590 as the through-holes 6261 , 6262 , 6263 , 6264 , and 6265 move away from the left and right with respect to the center of the array formed by the through-holes 6264 and 6265 (eg, the third through-hole 6263 ). It may be formed to tilt in a losing (radial) manner.
  • the antenna structure 500-1 has a plurality of through-holes 6261, 6262, 6263, 6264, and 6265 that gradually incline as the plurality of through-holes 6261, 6262, 6263, 6264, and 6265 are left and right from the center.
  • the beam width expansion of the directional beam can be helped.
  • FIGS. 13B and 13C the same reference numerals are assigned to substantially the same elements as those of FIG. 13A , and detailed descriptions thereof may be omitted.
  • the side member 620 may include a plurality of through holes 6271, 6272, 6273, 6274, and 6275 arranged to correspond to the plurality of power feeding units 510, 520, 530, 540, 540, and 550, respectively.
  • the antenna structure 500-2 may include a substrate 590 including a plurality of power feeding units 510, 520, 530, 540, 540, and 550, and a plurality of through holes 6271, 6272, 6273, 6274, and 6275. It may include a dielectric material 620c filled in.
  • the plurality of through-holes 6271, 6272, 6273, 6274, and 6275 gradually increase in width from the inner surface 621 to the outer surface 622 of the side member 620. It may be formed to be tapered.
  • the side member 620 may include a plurality of through holes 6281, 6282, 6283, 6284, and 6285 arranged to correspond to the plurality of power feeding units 510, 520, 530, 540, 540, and 550, respectively.
  • the antenna structure 500-3 may include a substrate 590 including a plurality of power feeding units 510, 520, 530, 540, 540, and 550, and a plurality of through holes 6281, 6282, 6283, 6284, and 6285. It may include a dielectric material 620c filled in.
  • the side member 620 when looking at the outer surface, may include one opening 6286 in which each of the plurality of through holes 6281 , 6282 , 6283 , 6284 , and 6285 is integrated.
  • the dielectric may be configured to extend from the plurality of through holes 6281 , 6282 , 6283 , 6284 , and 6285 and fill up to the opening 6286 .
  • an electronic device (eg, the electronic device 600 of FIG. 8A ) is formed through a conductive member (eg, the conductive member 620a of FIG. 4 ) and includes a plurality of through-holes (eg, the plurality of through-holes 6231 , 6232 , 6233 , 6234 , and 6235 of FIG. 4 ) spaced apart at predetermined intervals (eg, the side member 620 of FIG. 4 ). )), a housing including a housing (eg, the housing 610 of FIG. 4 ), and an antenna structure disposed in the housing (eg, the antenna structure 500 of FIG.
  • a housing including a housing (eg, the housing 610 of FIG. 4 ), and an antenna structure disposed in the housing (eg, the antenna structure 500 of FIG.
  • a substrate including a plurality of feeding parts (eg, the plurality of feeding parts 510 , 520 , 530 , 540 , and 550 of FIG. 4 ) arranged to correspond to each of the plurality of through holes in the inner space of the housing) (eg, the substrate 5 of FIG. 4 ).
  • a dielectric having a designated permittivity filled in the plurality of through-holes eg, the dielectric 620c of FIG. 4
  • an antenna structure including a dielectric (eg, the dielectric 620c of FIG. 4) and a wireless communication circuit (eg, the wireless communication circuit 595 of FIG. 4) disposed to be electrically connected to the plurality of power feeders in the internal space and set to transmit or receive a radio signal of a designated frequency band through the dielectric.
  • the side member may further include a non-conductive member at least partially coupled to the conductive member.
  • the non-conductive member and the dielectric may have different dielectric constants.
  • the non-conductive member may be formed of substantially the same material as the dielectric material.
  • the size of the plurality of through holes may be determined based on the permittivity of the dielectric.
  • the substrate includes a first surface facing the side member and a second surface facing an opposite direction to the first surface, and the substrate may be disposed in such a way that the first surface contacts or approaches an inner surface of the side member.
  • each of the plurality of power feeding units when viewing the side member from the outside, may be disposed at a position overlapping each of the plurality of through holes.
  • the substrate may include a conductive shielding space electrically connected to a ground layer of the substrate and formed to surround each of the plurality of power feeding units.
  • the conductive shielding space may include a plurality of loop-shaped plates arranged in a stacked manner in an insulating layer between the first surface and the second surface, and a plurality of conductive vias penetrating the plurality of plates and electrically connected to the ground layer.
  • the conductive shielding space when viewing the side member from the outside, may be disposed to overlap the plurality of through holes.
  • each of the plurality of power feeders may include a first polarized wave feeder for transmitting or receiving a radio signal and a second polarized wave feeder for transmitting or receiving the radio signal and disposed perpendicular to the first polarized wave.
  • each of the plurality of power feeding units may include a power supply via disposed in a thickness direction of the substrate and a power supply line extending or contacting to have a designated length in a direction perpendicular to the power supply via.
  • the housing may include a front cover and a rear cover facing in an opposite direction to the front cover, and the side member may be disposed between the front cover and the rear cover.
  • the antenna structure may be arranged to form a directional beam in an outward direction toward which the side member faces.
  • a display disposed to be visible from the outside through at least a portion of the front cover may be included in the internal space.
  • a cover member disposed to cover the plurality of through holes may be included on an outer surface of the side member.
  • the dielectric constant of the cover member may be substantially the same as that of the plurality of through holes.
  • the cover member may be formed of a material having a higher dielectric constant than that of the plurality of through holes.
  • the plurality of through-holes may be formed in such a way as to penetrate from the inner surface to the outer surface of the side member, and the dielectric material may be injected into the plurality of through-holes.
  • the designated frequency band may include a frequency band ranging from 3 GHz to 100 GHz.

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Abstract

An electronic device, according to various embodiments, may comprise: a housing formed of a conductive member and including a plurality of through holes spaced apart at predetermined intervals; an antenna structure disposed in the housing, the antenna structure including a substrate including a plurality of feeding parts disposed so as to correspond to each of the plurality of through holes in the inner space of the housing, and a dielectric filled in the through holes and having a designated permittivity; and a wireless communication circuit disposed in the inner space so as to be electrically connected to the plurality of feeding parts and configured to transmit or receive a wireless signal of a designated frequency band through the dielectric.

Description

안테나를 포함하는 전자 장치Electronic device containing an antenna
본 개시(disclosure)의 다양한 실시예들은 안테나를 포함하는 전자 장치에 관한 것이다.Various embodiments of the present disclosure relate to an electronic device including an antenna.
무선 통신 기술의 발전에 따라 전자 장치(예: 통신용 전자 장치)는 일상 생활에 보편적으로 사용되고 있으며, 이로 인한 컨텐츠 사용이 증가되고 있는 추세이다. 이러한 컨텐츠 사용의 급속한 증가에 의해 네트워크 용량은 점차 한계에 도달하고 있으며, 4G(4th generation) 통신 시스템의 상용화 이후, 증가하는 무선 데이터 트래픽 수요를 충족시키기 위하여 고주파(예: mmWave) 대역(예: 3 GHz ~ 300 GHz 대역)의 주파수를 이용하여 신호를 송신 또는 수신하는 통신 시스템(예: 5G(5th generation), pre-5G 통신 시스템, 또는 new radio(NR))이 연구되고 있다.With the development of wireless communication technology, electronic devices (eg, electronic devices for communication) are commonly used in daily life, and accordingly, the use of content is increasing. Due to the rapid increase in the use of these contents, network capacity is gradually reaching its limit, and since the commercialization of the 4G (4th generation) communication system, a communication system (eg, 5G (5th generation), pre-5G communication system, or new radio (NR)) that transmits or receives signals using a frequency of a high-frequency (eg, mmWave) band (eg, 3 GHz to 300 GHz band) is being studied to meet the increasing demand for wireless data traffic.
무선 통신 기술은 mmWave 대역(예: 약 3GHz ~ 100GHz 범위의 주파수 대역)을 이용하여 무선 신호를 송신 또는 수신할 수 있으며, 주파수 특성상 높은 자유 공간 손실을 극복하고, 안테나의 이득을 높이기 위한 효율적인 실장 구조 및 이에 부응하는 새로운 안테나 구조체(예: 안테나 모듈)가 개발되고 있다. 안테나 구조체는 기판(substrate)상에, 다양한 개 수의 안테나 엘리먼트들(예: 도전성 패치들 및/또는 도전성 패턴들)이 일정 간격으로 배치된 안테나 어레이(antenna array)를 포함할 수 있다. 예를 들어, 안테나 구조체는 전자 장치 내부에서 어느 하나의 방향으로 빔 패턴이 형성되도록 배치될 수 있다. 안테나 구조체는 전자 장치의 내부 공간에서, 비도전성 구조물(예: 전자 장치의 측면의 비도전성 부분, 전자 장치의 전면의 디스플레이를 제외한 부분 또는 전자 장치의 후면)을 통해, 전자 장치의 외부 방향으로 방향성 빔이 형성되도록 배치될 수 있다. Wireless communication technology can transmit or receive wireless signals using the mmWave band (eg, a frequency band ranging from about 3 GHz to 100 GHz), overcome high free space loss due to frequency characteristics, and increase antenna gain. An efficient mounting structure and a new antenna structure (eg, an antenna module) corresponding to this are being developed. The antenna structure may include an antenna array in which various numbers of antenna elements (eg, conductive patches and/or conductive patterns) are disposed at regular intervals on a substrate. For example, the antenna structure may be arranged such that a beam pattern is formed in one direction inside the electronic device. The antenna structure may be arranged so that a directional beam is formed in an external direction of the electronic device through a non-conductive structure (eg, a non-conductive portion on a side surface of the electronic device, a front portion of the electronic device except for a display, or a rear surface of the electronic device) in an internal space of the electronic device.
전자 장치는 강성 보강 및 미려한 외관 형성을 위하여 도전성 부재를 포함하는 측면 부재를 포함할 수 있다. 측면 부재의 적어도 일부는 안테나 구조체가 측면 부재를 통해 방향성 빔을 외부로 방사하도록 안테나 엘리먼트들 각각과 정렬되게 형성된 관통홀들(예: 개구 또는 오프닝)을 포함할 수 있다. 따라서, 안테나 구조체는 관통홀들을 통해 전자 장치의 내부 공간에서 외부 방향으로 방향성 빔을 통과시키는 메탈 투과형 안테나 어레이를 포함할 수 있다.The electronic device may include a side member including a conductive member to reinforce rigidity and form a beautiful appearance. At least a portion of the side member may include through-holes (eg, openings) aligned with each of the antenna elements so that the antenna structure radiates a directional beam to the outside through the side member. Accordingly, the antenna structure may include a metal transmissive antenna array that transmits a directional beam from an internal space of the electronic device to the outside through through-holes.
그러나 안테나 구조체의 방향성 빔은 복수의 관통홀들에 채워진 사출물(예: 유전체)를 투과하여야 하므로 방사 손실이 발생되거나 방사 왜곡이 발생됨으로써 안테나의 방사 성능이 감소될 수 있다. 또한, 이를 해결하기 위하여, 사출물의 두께를 늘리거나, 안테나 구조체와 사출물간의 이격 거리가 일정 거리로 이격될 수 있다. 그러나 이러한 구조적 변경은 전자 장치의 공간을 많이 차지할 수 있으며, 전자 장치의 슬림화에 역행할 수 있다.However, since the directional beam of the antenna structure must pass through an injection material (eg, dielectric) filled in a plurality of through-holes, radiation loss or radiation distortion may occur, thereby reducing radiation performance of the antenna. In addition, in order to solve this problem, the thickness of the injection-molded material may be increased or the separation distance between the antenna structure and the injection-molded material may be spaced at a certain distance. However, such a structural change may occupy a lot of space in the electronic device and may go against the slimness of the electronic device.
본 개시의 다양한 실시예들은 측면 부재의 관통홀과, 관통홀에 배치되는 유전체를 이용하여 방사 성능 향상에 도움을 줄 수 있는 구조를 갖는 안테나를 포함하는 전자 장치를 제공할 수 있다.Various embodiments of the present disclosure may provide an electronic device including an antenna having a through hole of a side member and a structure capable of helping to improve radiation performance by using a dielectric disposed in the through hole.
다만, 본 개시에서 해결하고자 하는 과제는 상기 언급된 과제에 한정되는 것이 아니며, 본 개시의 사상 및 영역으로부터 벗어나지 않는 범위에서 다양하게 확장될 수 있을 것이다.However, the problem to be solved in the present disclosure is not limited to the above-mentioned problem, and may be expanded in various ways without departing from the spirit and scope of the present disclosure.
다양한 실시예에 따르면, 전자 장치는 도전성 부재를 통해 형성되고, 지정된 간격으로 이격된 복수의 관통홀들을 포함하는 측면 부재를 포함하는 하우징과, 상기 하우징에 배치된 안테나 구조체로써, 상기 하우징의 내부 공간에서, 상기 복수의 관통홀들 각각과 대응하도록 배치된 복수의 급전부들을 포함하는 기판 및 상기 복수의 관통홀들에 채워지는 지정된 유전율을 갖는 유전체를 포함하는 안테나 구조체 및 상기 내부 공간에서, 상기 복수의 급전부들과 전기적으로 연결되도록 배치되고, 상기 유전체를 통해 지정된 주파수 대역의 무선 신호를 송신 또는 수신하도록 설정된 무선 통신 회로를 포함할 수 있다.According to various embodiments, an electronic device includes a housing including a side member formed through a conductive member and including a plurality of through-holes spaced apart at predetermined intervals, an antenna structure disposed in the housing, a substrate including a plurality of feeding parts arranged to correspond to each of the plurality of through-holes in an internal space of the housing, and an antenna structure including a dielectric having a designated permittivity filled in the plurality of through-holes, and disposed to be electrically connected to the plurality of feeding parts in the internal space, designated through the dielectric It may include a radio communication circuit configured to transmit or receive a radio signal of a frequency band.
본 개시의 예시적인 실시예들에 따른 전자 장치는 하우징의 도전성 부분에 형성된 복수의 관통홀들에 채워지는 유전체를 공진기로 사용하는 안테나(예: DRA, dielectric resonator antenna)를 포함함으로써, 급전부만을 포함하여 기판(substrate)의 효율적 설계가 가능하고, 도전성 부재로 형성된 관통홀에 의한 손실 또는 왜곡과 같은 방사 성능 감소를 개선시킬 수 있다. An electronic device according to exemplary embodiments of the present disclosure includes an antenna (eg, a dielectric resonator antenna (DRA)) using a dielectric filled in a plurality of through-holes formed in a conductive portion of a housing as a resonator, thereby enabling efficient design of a substrate including only a power supply unit, and improving radiation performance reduction such as loss or distortion due to through-holes formed of a conductive member.
이 외에, 본 문서를 통해 직접적 또는 간접적으로 파악되는 다양한 효과들이 제공될 수 있다.In addition to this, various effects identified directly or indirectly through this document may be provided.
도면의 설명과 관련하여, 동일 또는 유사한 구성 요소에 대해서는 동일 또는 유사한 참조 부호가 사용될 수 있다.In connection with the description of the drawings, the same or similar reference numerals may be used for the same or similar elements.
도 1은 본 개시의 다양한 실시예들에 따른 네트워크 환경 내의 전자 장치의 블록도이다.1 is a block diagram of an electronic device in a network environment according to various embodiments of the present disclosure.
도 2는 본 개시의 다양한 실시예들에 따른 레거시 네트워크 통신 및 5G 네트워크 통신을 지원하기 위한 전자 장치의 블록도이다.2 is a block diagram of an electronic device for supporting legacy network communication and 5G network communication according to various embodiments of the present disclosure.
도 3a는 본 개시의 다양한 실시예들에 따른 모바일 전자 장치의 사시도이다.3A is a perspective view of a mobile electronic device according to various embodiments of the present disclosure.
도 3b는 본 개시의 다양한 실시예들에 따른 모바일 전자 장치의 후면 사시도이다.3B is a rear perspective view of a mobile electronic device according to various embodiments of the present disclosure.
도 3c는 본 개시의 다양한 실시예들에 따른 모바일 전자 장치의 전개 사시도이다.3C is an exploded perspective view of a mobile electronic device according to various embodiments of the present disclosure.
도 4는 본 개시의 다양한 실시예에 따른 안테나 구조체의 분리 사시도이다.4 is an exploded perspective view of an antenna structure according to various embodiments of the present disclosure.
도 5a는 본 개시의 다양한 실시예에 따른 도 4의 기판의 5a 영역을 도시한 도면들이다.FIG. 5A is diagrams illustrating an area 5a of the substrate of FIG. 4 according to various embodiments of the present disclosure.
도 5b는 본 개시의 다양한 실시예에 따른 도 5a의 라인 5b-5b를 따라 바라본 기판의 일부 단면도이다.5B is a partial cross-sectional view of a substrate taken along line 5b-5b of FIG. 5A according to various embodiments of the present disclosure.
도 6은 본 개시의 다양한 실시예에 따른 도 5a의 기판을 포함하는 안테나 구조체와 비교예의 방사 성능을 비교한 그래프이다. 6 is a graph comparing radiation performance of an antenna structure including the substrate of FIG. 5A according to various embodiments of the present disclosure and a comparative example.
도 7a는 본 개시의 다양한 실시예에 따른 안테나 구조체를 포함하는 전자 장치의 분리 사시도이다.7A is an exploded perspective view of an electronic device including an antenna structure according to various embodiments of the present disclosure.
도 7b는 본 개시의 다양한 실시예에 따른 도 7a의 결합 사시도이다.7B is a combined perspective view of FIG. 7A according to various embodiments of the present disclosure.
도 8a는 본 개시의 다양한 실시예에 따른 안테나 구조체가 배치된 전자 장치의 구성도이다.8A is a configuration diagram of an electronic device in which an antenna structure according to various embodiments of the present disclosure is disposed.
도 8b는 본 개시의 다양한 실시예에 따른 도 8a의 라인 8b-8b를 따라 바라본 전자 장치의 일부 단면도이다.8B is a partial cross-sectional view of an electronic device taken along line 8b-8b of FIG. 8A according to various embodiments of the present disclosure.
도 9a는 본 개시의 다양한 실시예에 따른 도 4의 안테나 구조체의 방사 성능을 나타낸 그래프이다.9A is a graph illustrating radiation performance of the antenna structure of FIG. 4 according to various embodiments of the present disclosure.
도 9b는 본 개시의 다양한 실시예에 따른 도 4의 안테나 구조체와 비교예의 방사 성능을 비교한 그래프이다.9B is a graph comparing radiation performance of the antenna structure of FIG. 4 according to various embodiments of the present disclosure and a comparative example.
도 10a 및 도 10b는 본 개시의 다양한 실시예에 따른 도 4의 안테나 구조체와 비교예의 전류 분포를 비교한 그래프들이다.10A and 10B are graphs comparing current distributions of the antenna structure of FIG. 4 according to various embodiments of the present disclosure and a comparative example.
도 11은 본 개시의 다양한 실시예에 따른 안테나 구조체와 비교예의 방사 성능을 비교한 그래프이다. 11 is a graph comparing radiation performance of an antenna structure according to various embodiments of the present disclosure and a comparative example.
도 12는 본 개시의 다양한 실시예에 따른 유전체의 유전율에 따른 관통홀들의 크기 변화를 나타낸 도면이다.12 is a diagram illustrating a change in size of through-holes according to a permittivity of a dielectric according to various embodiments of the present disclosure.
도 13a 내지 도 13c는 본 개시의 다양한 실시예에 따른 안테나 구조체들을 도시한 도면들이다.13A to 13C are diagrams illustrating antenna structures according to various embodiments of the present disclosure.
도 1을 참조하면, 네트워크 환경(100)에서 전자 장치(101)는 제 1 네트워크(198)(예: 근거리 무선 통신 네트워크)를 통하여 전자 장치(102)와 통신하거나, 또는 제 2 네트워크(199)(예: 원거리 무선 통신 네트워크)를 통하여 전자 장치(104) 또는 서버(108) 중 적어도 하나와 통신할 수 있다. 일실시예에 따르면, 전자 장치(101)는 서버(108)를 통하여 전자 장치(104)와 통신할 수 있다. 일실시예에 따르면, 전자 장치(101)는 프로세서(120), 메모리(130), 입력 모듈(150), 음향 출력 모듈(155), 디스플레이 모듈(160), 오디오 모듈(170), 센서 모듈(176), 인터페이스(177), 연결 단자(178), 햅틱 모듈(179), 카메라 모듈(180), 전력 관리 모듈(188), 배터리(189), 통신 모듈(190), 가입자 식별 모듈(196), 또는 안테나 모듈(197)을 포함할 수 있다. 어떤 실시예에서는, 전자 장치(101)에는, 이 구성요소들 중 적어도 하나(예: 연결 단자(178))가 생략되거나, 하나 이상의 다른 구성요소가 추가될 수 있다. 어떤 실시예에서는, 이 구성요소들 중 일부들(예: 센서 모듈(176), 카메라 모듈(180), 또는 안테나 모듈(197))은 하나의 구성요소(예: 디스플레이 모듈(160))로 통합될 수 있다.Referring to FIG. 1 , in a network environment 100, an electronic device 101 may communicate with the electronic device 102 through a first network 198 (eg, a short-distance wireless communication network), or may communicate with at least one of the electronic device 104 and the server 108 through a second network 199 (eg, a long-distance wireless communication network). According to one embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108 . According to an embodiment, the electronic device 101 includes a processor 120, a memory 130, an input module 150, a sound output module 155, a display module 160, an audio module 170, a sensor module 176, an interface 177, a connection terminal 178, a haptic module 179, a camera module 180, a power management module 188, a battery 189, a communication module ( 190), a subscriber identification module 196, or an antenna module 197. In some embodiments, in the electronic device 101, at least one of these components (eg, the connection terminal 178) may be omitted or one or more other components may be added. In some embodiments, some of these components (eg, sensor module 176, camera module 180, or antenna module 197) may be integrated into one component (eg, display module 160).
프로세서(120)는, 예를 들면, 소프트웨어(예: 프로그램(140))를 실행하여 프로세서(120)에 연결된 전자 장치(101)의 적어도 하나의 다른 구성요소(예: 하드웨어 또는 소프트웨어 구성요소)를 제어할 수 있고, 다양한 데이터 처리 또는 연산을 수행할 수 있다. 일실시예에 따르면, 데이터 처리 또는 연산의 적어도 일부로서, 프로세서(120)는 다른 구성요소(예: 센서 모듈(176) 또는 통신 모듈(190))로부터 수신된 명령 또는 데이터를 휘발성 메모리(132)에 저장하고, 휘발성 메모리(132)에 저장된 명령 또는 데이터를 처리하고, 결과 데이터를 비휘발성 메모리(134)에 저장할 수 있다. 일실시예에 따르면, 프로세서(120)는 메인 프로세서(121)(예: 중앙 처리 장치 또는 어플리케이션 프로세서) 또는 이와는 독립적으로 또는 함께 운영 가능한 보조 프로세서(123)(예: 그래픽 처리 장치, 신경망 처리 장치(NPU: neural processing unit), 이미지 시그널 프로세서, 센서 허브 프로세서, 또는 커뮤니케이션 프로세서)를 포함할 수 있다. 예를 들어, 전자 장치(101)가 메인 프로세서(121) 및 보조 프로세서(123)를 포함하는 경우, 보조 프로세서(123)는 메인 프로세서(121)보다 저전력을 사용하거나, 지정된 기능에 특화되도록 설정될 수 있다. 보조 프로세서(123)는 메인 프로세서(121)와 별개로, 또는 그 일부로서 구현될 수 있다.The processor 120 may, for example, execute software (eg, program 140) to control at least one other component (eg, hardware or software component) of the electronic device 101 connected to the processor 120, and may perform various data processing or calculations. According to one embodiment, as at least part of data processing or operation, processor 120 may store commands or data received from other components (e.g., sensor module 176 or communication module 190) in volatile memory 132, process the commands or data stored in volatile memory 132, and store resultant data in non-volatile memory 134. According to one embodiment, the processor 120 may include a main processor 121 (eg, a central processing unit or an application processor) or a secondary processor 123 (eg, a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that may operate independently or together with the main processor 121. For example, when the electronic device 101 includes the main processor 121 and the auxiliary processor 123, the auxiliary processor 123 may use less power than the main processor 121 or may be set to be specialized for a designated function. The secondary processor 123 may be implemented separately from or as part of the main processor 121 .
보조 프로세서(123)는, 예를 들면, 메인 프로세서(121)가 인액티브(예: 슬립) 상태에 있는 동안 메인 프로세서(121)를 대신하여, 또는 메인 프로세서(121)가 액티브(예: 어플리케이션 실행) 상태에 있는 동안 메인 프로세서(121)와 함께, 전자 장치(101)의 구성요소들 중 적어도 하나의 구성요소(예: 디스플레이 모듈(160), 센서 모듈(176), 또는 통신 모듈(190))와 관련된 기능 또는 상태들의 적어도 일부를 제어할 수 있다. 일실시예에 따르면, 보조 프로세서(123)(예: 이미지 시그널 프로세서 또는 커뮤니케이션 프로세서)는 기능적으로 관련 있는 다른 구성요소(예: 카메라 모듈(180) 또는 통신 모듈(190))의 일부로서 구현될 수 있다. 일실시예에 따르면, 보조 프로세서(123)(예: 신경망 처리 장치)는 인공지능 모델의 처리에 특화된 하드웨어 구조를 포함할 수 있다. 인공지능 모델은 기계 학습을 통해 생성될 수 있다. 이러한 학습은, 예를 들어, 인공지능 모델이 수행되는 전자 장치(101) 자체에서 수행될 수 있고, 별도의 서버(예: 서버(108))를 통해 수행될 수도 있다. 학습 알고리즘은, 예를 들어, 지도형 학습(supervised learning), 비지도형 학습(unsupervised learning), 준지도형 학습(semi-supervised learning) 또는 강화 학습(reinforcement learning)을 포함할 수 있으나, 전술한 예에 한정되지 않는다. 인공지능 모델은, 복수의 인공 신경망 레이어들을 포함할 수 있다. 인공 신경망은 심층 신경망(DNN: deep neural network), CNN(convolutional neural network), RNN(recurrent neural network), RBM(restricted boltzmann machine), DBN(deep belief network), BRDNN(bidirectional recurrent deep neural network), 심층 Q-네트워크(deep Q-networks) 또는 상기 중 둘 이상의 조합 중 하나일 수 있으나, 전술한 예에 한정되지 않는다. 인공지능 모델은 하드웨어 구조 이외에, 추가적으로 또는 대체적으로, 소프트웨어 구조를 포함할 수 있다. The auxiliary processor 123 functions related to at least one of the components of the electronic device 101 (eg, the display module 160, the sensor module 176, or the communication module 190) along with the main processor 121 while the main processor 121 is in an active (eg, application execution) state or instead of the main processor 121 while the main processor 121 is in an inactive (eg, sleep) state. Alternatively, at least some of the states may be controlled. According to one embodiment, the auxiliary processor 123 (eg, an image signal processor or a communication processor) may be implemented as a part of other functionally related components (eg, the camera module 180 or the communication module 190). According to an embodiment, the auxiliary processor 123 (eg, a neural network processing device) may include a hardware structure specialized for processing an artificial intelligence model. AI models can be created through machine learning. Such learning may be performed, for example, in the electronic device 101 itself where the artificial intelligence model is performed, or may be performed through a separate server (eg, the server 108). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the above examples. The artificial intelligence model may include a plurality of artificial neural network layers. The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), deep Q-networks, or a combination of two or more of the above, but is not limited to the above examples. The artificial intelligence model may include, in addition or alternatively, software structures in addition to hardware structures.
메모리(130)는, 전자 장치(101)의 적어도 하나의 구성요소(예: 프로세서(120) 또는 센서 모듈(176))에 의해 사용되는 다양한 데이터를 저장할 수 있다. 데이터는, 예를 들어, 소프트웨어(예: 프로그램(140)) 및, 이와 관련된 명령에 대한 입력 데이터 또는 출력 데이터를 포함할 수 있다. 메모리(130)는, 휘발성 메모리(132) 또는 비휘발성 메모리(134)를 포함할 수 있다. The memory 130 may store various data used by at least one component (eg, the processor 120 or the sensor module 176) of the electronic device 101 . The data may include, for example, input data or output data for software (eg, program 140) and commands related thereto. The memory 130 may include volatile memory 132 or non-volatile memory 134 .
프로그램(140)은 메모리(130)에 소프트웨어로서 저장될 수 있으며, 예를 들면, 운영 체제(142), 미들 웨어(144) 또는 어플리케이션(146)을 포함할 수 있다. The program 140 may be stored as software in the memory 130 and may include, for example, an operating system 142 , middleware 144 , or an application 146 .
입력 모듈(150)은, 전자 장치(101)의 구성요소(예: 프로세서(120))에 사용될 명령 또는 데이터를 전자 장치(101)의 외부(예: 사용자)로부터 수신할 수 있다. 입력 모듈(150)은, 예를 들면, 마이크, 마우스, 키보드, 키(예: 버튼), 또는 디지털 펜(예: 스타일러스 펜)을 포함할 수 있다. The input module 150 may receive a command or data to be used by a component (eg, the processor 120) of the electronic device 101 from the outside of the electronic device 101 (eg, a user). The input module 150 may include, for example, a microphone, a mouse, a keyboard, a key (eg, a button), or a digital pen (eg, a stylus pen).
음향 출력 모듈(155)은 음향 신호를 전자 장치(101)의 외부로 출력할 수 있다. 음향 출력 모듈(155)은, 예를 들면, 스피커 또는 리시버를 포함할 수 있다. 스피커는 멀티미디어 재생 또는 녹음 재생과 같이 일반적인 용도로 사용될 수 있다. 리시버는 착신 전화를 수신하기 위해 사용될 수 있다. 일실시예에 따르면, 리시버는 스피커와 별개로, 또는 그 일부로서 구현될 수 있다.The sound output module 155 may output sound signals to the outside of the electronic device 101 . The sound output module 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as multimedia playback or recording playback. A receiver may be used to receive an incoming call. According to one embodiment, the receiver may be implemented separately from the speaker or as part of it.
디스플레이 모듈(160)은 전자 장치(101)의 외부(예: 사용자)로 정보를 시각적으로 제공할 수 있다. 디스플레이 모듈(160)은, 예를 들면, 디스플레이, 홀로그램 장치, 또는 프로젝터 및 해당 장치를 제어하기 위한 제어 회로를 포함할 수 있다. 일실시예에 따르면, 디스플레이 모듈(160)은 터치를 감지하도록 설정된 터치 센서, 또는 상기 터치에 의해 발생되는 힘의 세기를 측정하도록 설정된 압력 센서를 포함할 수 있다. The display module 160 may visually provide information to the outside of the electronic device 101 (eg, a user). The display module 160 may include, for example, a display, a hologram device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module 160 may include a touch sensor set to detect a touch or a pressure sensor set to measure the intensity of force generated by the touch.
오디오 모듈(170)은 소리를 전기 신호로 변환시키거나, 반대로 전기 신호를 소리로 변환시킬 수 있다. 일실시예에 따르면, 오디오 모듈(170)은, 입력 모듈(150)을 통해 소리를 획득하거나, 음향 출력 모듈(155), 또는 전자 장치(101)와 직접 또는 무선으로 연결된 외부 전자 장치(예: 전자 장치(102))(예: 스피커 또는 헤드폰)를 통해 소리를 출력할 수 있다.The audio module 170 may convert sound into an electrical signal or vice versa. According to an embodiment, the audio module 170 may obtain sound through the input module 150, output sound through the sound output module 155, or an external electronic device (e.g., electronic device 102) (e.g., speaker or headphone) connected directly or wirelessly to the electronic device 101.
센서 모듈(176)은 전자 장치(101)의 작동 상태(예: 전력 또는 온도), 또는 외부의 환경 상태(예: 사용자 상태)를 감지하고, 감지된 상태에 대응하는 전기 신호 또는 데이터 값을 생성할 수 있다. 일실시예에 따르면, 센서 모듈(176)은, 예를 들면, 제스처 센서, 자이로 센서, 기압 센서, 마그네틱 센서, 가속도 센서, 그립 센서, 근접 센서, 컬러 센서, IR(infrared) 센서, 생체 센서, 온도 센서, 습도 센서, 또는 조도 센서를 포함할 수 있다. The sensor module 176 may detect an operating state (eg, power or temperature) of the electronic device 101 or an external environmental state (eg, a user state), and generate an electrical signal or data value corresponding to the detected state. According to one embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a bio sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.
인터페이스(177)는 전자 장치(101)가 외부 전자 장치(예: 전자 장치(102))와 직접 또는 무선으로 연결되기 위해 사용될 수 있는 하나 이상의 지정된 프로토콜들을 지원할 수 있다. 일실시예에 따르면, 인터페이스(177)는, 예를 들면, HDMI(high definition multimedia interface), USB(universal serial bus) 인터페이스, SD카드 인터페이스, 또는 오디오 인터페이스를 포함할 수 있다.The interface 177 may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device 101 to an external electronic device (eg, the electronic device 102). According to one embodiment, the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.
연결 단자(178)는, 그를 통해서 전자 장치(101)가 외부 전자 장치(예: 전자 장치(102))와 물리적으로 연결될 수 있는 커넥터를 포함할 수 있다. 일실시예에 따르면, 연결 단자(178)는, 예를 들면, HDMI 커넥터, USB 커넥터, SD 카드 커넥터, 또는 오디오 커넥터(예: 헤드폰 커넥터)를 포함할 수 있다.The connection terminal 178 may include a connector through which the electronic device 101 may be physically connected to an external electronic device (eg, the electronic device 102). According to one embodiment, the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).
햅틱 모듈(179)은 전기적 신호를 사용자가 촉각 또는 운동 감각을 통해서 인지할 수 있는 기계적인 자극(예: 진동 또는 움직임) 또는 전기적인 자극으로 변환할 수 있다. 일실시예에 따르면, 햅틱 모듈(179)은, 예를 들면, 모터, 압전 소자, 또는 전기 자극 장치를 포함할 수 있다.The haptic module 179 may convert electrical signals into mechanical stimuli (eg, vibration or motion) or electrical stimuli that a user may perceive through tactile or kinesthetic senses. According to one embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.
카메라 모듈(180)은 정지 영상 및 동영상을 촬영할 수 있다. 일실시예에 따르면, 카메라 모듈(180)은 하나 이상의 렌즈들, 이미지 센서들, 이미지 시그널 프로세서들, 또는 플래시들을 포함할 수 있다.The camera module 180 may capture still images and moving images. According to one embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.
전력 관리 모듈(188)은 전자 장치(101)에 공급되는 전력을 관리할 수 있다. 일실시예에 따르면, 전력 관리 모듈(188)은, 예를 들면, PMIC(power management integrated circuit)의 적어도 일부로서 구현될 수 있다.The power management module 188 may manage power supplied to the electronic device 101 . According to one embodiment, the power management module 188 may be implemented as at least part of a power management integrated circuit (PMIC), for example.
배터리(189)는 전자 장치(101)의 적어도 하나의 구성요소에 전력을 공급할 수 있다. 일실시예에 따르면, 배터리(189)는, 예를 들면, 재충전 불가능한 1차 전지, 재충전 가능한 2차 전지 또는 연료 전지를 포함할 수 있다.The battery 189 may supply power to at least one component of the electronic device 101 . According to one embodiment, the battery 189 may include, for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell.
통신 모듈(190)은 전자 장치(101)와 외부 전자 장치(예: 전자 장치(102), 전자 장치(104), 또는 서버(108)) 간의 직접(예: 유선) 통신 채널 또는 무선 통신 채널의 수립, 및 수립된 통신 채널을 통한 통신 수행을 지원할 수 있다. 통신 모듈(190)은 프로세서(120)(예: 어플리케이션 프로세서)와 독립적으로 운영되고, 직접(예: 유선) 통신 또는 무선 통신을 지원하는 하나 이상의 커뮤니케이션 프로세서를 포함할 수 있다. 일실시예에 따르면, 통신 모듈(190)은 무선 통신 모듈(192)(예: 셀룰러 통신 모듈, 근거리 무선 통신 모듈, 또는 GNSS(global navigation satellite system) 통신 모듈) 또는 유선 통신 모듈(194)(예: LAN(local area network) 통신 모듈, 또는 전력선 통신 모듈)을 포함할 수 있다. 이들 통신 모듈 중 해당하는 통신 모듈은 제 1 네트워크(198)(예: 블루투스, WiFi(wireless fidelity) direct 또는 IrDA(infrared data association)와 같은 근거리 통신 네트워크) 또는 제 2 네트워크(199)(예: 레거시 셀룰러 네트워크, 5G 네트워크, 차세대 통신 네트워크, 인터넷, 또는 컴퓨터 네트워크(예: LAN 또는 WAN)와 같은 원거리 통신 네트워크)를 통하여 외부의 전자 장치(104)와 통신할 수 있다. 이런 여러 종류의 통신 모듈들은 하나의 구성요소(예: 단일 칩)로 통합되거나, 또는 서로 별도의 복수의 구성요소들(예: 복수 칩들)로 구현될 수 있다. 무선 통신 모듈(192)은 가입자 식별 모듈(196)에 저장된 가입자 정보(예: 국제 모바일 가입자 식별자(IMSI))를 이용하여 제 1 네트워크(198) 또는 제 2 네트워크(199)와 같은 통신 네트워크 내에서 전자 장치(101)를 확인 또는 인증할 수 있다. The communication module 190 may support establishment of a direct (e.g., wired) communication channel or wireless communication channel between the electronic device 101 and an external electronic device (e.g., the electronic device 102, the electronic device 104, or the server 108), and communication through the established communication channel. The communication module 190 may include one or more communication processors that operate independently of the processor 120 (eg, an application processor) and support direct (eg, wired) communication or wireless communication. According to one embodiment, the communication module 190 may include a wireless communication module 192 (eg, a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (eg, a local area network (LAN) communication module or a power line communication module). A corresponding communication module among these communication modules may communicate with the external electronic device 104 through a first network 198 (eg, a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or an infrared data association (IrDA)) or a second network 199 (eg, a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a long-distance communication network such as a computer network (eg, a LAN or a WAN)). These various types of communication modules may be integrated as one component (eg, a single chip) or implemented as a plurality of separate components (eg, multiple chips). The wireless communication module 192 may identify or authenticate the electronic device 101 within a communication network such as the first network 198 or the second network 199 using subscriber information (eg, International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196.
무선 통신 모듈(192)은 4G 네트워크 이후의 5G 네트워크 및 차세대 통신 기술, 예를 들어, NR 접속 기술(new radio access technology)을 지원할 수 있다. NR 접속 기술은 고용량 데이터의 고속 전송(eMBB(enhanced mobile broadband)), 단말 전력 최소화와 다수 단말의 접속(mMTC(massive machine type communications)), 또는 고신뢰도와 저지연(URLLC(ultra-reliable and low-latency communications))을 지원할 수 있다. 무선 통신 모듈(192)은, 예를 들어, 높은 데이터 전송률 달성을 위해, 고주파 대역(예: mmWave 대역)을 지원할 수 있다. 무선 통신 모듈(192)은 고주파 대역에서의 성능 확보를 위한 다양한 기술들, 예를 들어, 빔포밍(beamforming), 거대 배열 다중 입출력(massive MIMO(multiple-input and multiple-output)), 전차원 다중입출력(FD-MIMO: full dimensional MIMO), 안테나 어레이(antenna array), 아날로그 빔형성(analog beam-forming), 또는 대규모 안테나(large scale antenna)와 같은 기술들을 지원할 수 있다. 무선 통신 모듈(192)은 전자 장치(101), 외부 전자 장치(예: 전자 장치(104)) 또는 네트워크 시스템(예: 제 2 네트워크(199))에 규정되는 다양한 요구사항을 지원할 수 있다. 일실시예에 따르면, 무선 통신 모듈(192)은 eMBB 실현을 위한 Peak data rate(예: 20Gbps 이상), mMTC 실현을 위한 손실 Coverage(예: 164dB 이하), 또는 URLLC 실현을 위한 U-plane latency(예: 다운링크(DL) 및 업링크(UL) 각각 0.5ms 이하, 또는 라운드 트립 1ms 이하)를 지원할 수 있다.The wireless communication module 192 may support a 5G network after a 4G network and a next-generation communication technology, for example, NR access technology (new radio access technology). NR access technology can support high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and access to multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module 192 may support a high frequency band (eg, mmWave band) to achieve a high data rate, for example. The wireless communication module 192 may support various technologies for securing performance in a high frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), antenna array, analog beam-forming, or large scale antenna. The wireless communication module 192 may support various requirements defined for the electronic device 101, an external electronic device (eg, the electronic device 104), or a network system (eg, the second network 199). According to an embodiment, the wireless communication module 192 may support peak data rate (eg, 20 Gbps or more) for eMBB realization, loss coverage (eg, 164 dB or less) for mMTC realization, or U-plane latency (eg, downlink (DL) and uplink (UL) 0.5 ms or less, or round trip 1 ms or less) for realizing URLLC.
안테나 모듈(197)은 신호 또는 전력을 외부(예: 외부의 전자 장치)로 송신하거나 외부로부터 수신할 수 있다. 일실시예에 따르면, 안테나 모듈(197)은 서브스트레이트(예: PCB) 위에 형성된 도전체 또는 도전성 패턴으로 이루어진 방사체를 포함하는 안테나를 포함할 수 있다. 일실시예에 따르면, 안테나 모듈(197)은 복수의 안테나들(예: 안테나 어레이)을 포함할 수 있다. 이런 경우, 제 1 네트워크(198) 또는 제 2 네트워크(199)와 같은 통신 네트워크에서 사용되는 통신 방식에 적합한 적어도 하나의 안테나가, 예를 들면, 통신 모듈(190)에 의하여 상기 복수의 안테나들로부터 선택될 수 있다. 신호 또는 전력은 상기 선택된 적어도 하나의 안테나를 통하여 통신 모듈(190)과 외부의 전자 장치 간에 송신되거나 수신될 수 있다. 어떤 실시예에 따르면, 방사체 이외에 다른 부품(예: RFIC(radio frequency integrated circuit))이 추가로 안테나 모듈(197)의 일부로 형성될 수 있다. The antenna module 197 may transmit or receive signals or power to the outside (eg, an external electronic device). According to one embodiment, the antenna module 197 may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (eg, PCB). According to one embodiment, the antenna module 197 may include a plurality of antennas (eg, an antenna array). In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 198 or the second network 199 may be selected from the plurality of antennas by, for example, the communication module 190. A signal or power may be transmitted or received between the communication module 190 and an external electronic device through the selected at least one antenna. According to some embodiments, other components (eg, a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module 197 in addition to the radiator.
다양한 실시예에 따르면, 안테나 모듈(197)은 mmWave 안테나 모듈을 형성할 수 있다. 일실시예에 따르면, mmWave 안테나 모듈은 인쇄 회로 기판, 상기 인쇄 회로 기판의 제 1 면(예: 아래 면)에 또는 그에 인접하여 배치되고 지정된 고주파 대역(예: mmWave 대역)을 지원할 수 있는 RFIC, 및 상기 인쇄 회로 기판의 제 2 면(예: 윗 면 또는 측 면)에 또는 그에 인접하여 배치되고 상기 지정된 고주파 대역의 신호를 송신 또는 수신할 수 있는 복수의 안테나들(예: 안테나 어레이)을 포함할 수 있다.According to various embodiments, the antenna module 197 may form a mmWave antenna module. According to an embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to a first surface (eg, bottom surface) of the printed circuit board and capable of supporting a designated high frequency band (eg, mmWave band), and a plurality of antennas (eg, antenna array) disposed on or adjacent to a second surface (eg, top surface or side surface) of the printed circuit board and capable of transmitting or receiving signals in the designated high frequency band.
상기 구성요소들 중 적어도 일부는 주변 기기들간 통신 방식(예: 버스, GPIO(general purpose input and output), SPI(serial peripheral interface), 또는 MIPI(mobile industry processor interface))을 통해 서로 연결되고 신호(예: 명령 또는 데이터)를 상호간에 교환할 수 있다.At least some of the components are connected to each other through a communication method between peripheral devices (e.g., a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)) and signals (e.g., commands or data) can be exchanged with each other.
일실시예에 따르면, 명령 또는 데이터는 제 2 네트워크(199)에 연결된 서버(108)를 통해서 전자 장치(101)와 외부의 전자 장치(104)간에 송신 또는 수신될 수 있다. 외부의 전자 장치(102, 또는 104) 각각은 전자 장치(101)와 동일한 또는 다른 종류의 장치일 수 있다. 일실시예에 따르면, 전자 장치(101)에서 실행되는 동작들의 전부 또는 일부는 외부의 전자 장치들(102, 104, 또는 108) 중 하나 이상의 외부의 전자 장치들에서 실행될 수 있다. 예를 들면, 전자 장치(101)가 어떤 기능이나 서비스를 자동으로, 또는 사용자 또는 다른 장치로부터의 요청에 반응하여 수행해야 할 경우에, 전자 장치(101)는 기능 또는 서비스를 자체적으로 실행시키는 대신에 또는 추가적으로, 하나 이상의 외부의 전자 장치들에게 그 기능 또는 그 서비스의 적어도 일부를 수행하라고 요청할 수 있다. 상기 요청을 수신한 하나 이상의 외부의 전자 장치들은 요청된 기능 또는 서비스의 적어도 일부, 또는 상기 요청과 관련된 추가 기능 또는 서비스를 실행하고, 그 실행의 결과를 전자 장치(101)로 전달할 수 있다. 전자 장치(101)는 상기 결과를, 그대로 또는 추가적으로 처리하여, 상기 요청에 대한 응답의 적어도 일부로서 제공할 수 있다. 이를 위하여, 예를 들면, 클라우드 컴퓨팅, 분산 컴퓨팅, 모바일 에지 컴퓨팅(MEC: mobile edge computing), 또는 클라이언트-서버 컴퓨팅 기술이 이용될 수 있다. 전자 장치(101)는, 예를 들어, 분산 컴퓨팅 또는 모바일 에지 컴퓨팅을 이용하여 초저지연 서비스를 제공할 수 있다. 다른 실시예에 있어서, 외부의 전자 장치(104)는 IoT(internet of things) 기기를 포함할 수 있다. 서버(108)는 기계 학습 및/또는 신경망을 이용한 지능형 서버일 수 있다. 일실시예에 따르면, 외부의 전자 장치(104) 또는 서버(108)는 제 2 네트워크(199) 내에 포함될 수 있다. 전자 장치(101)는 5G 통신 기술 및 IoT 관련 기술을 기반으로 지능형 서비스(예: 스마트 홈, 스마트 시티, 스마트 카, 또는 헬스 케어)에 적용될 수 있다. According to an embodiment, commands or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199 . Each of the external electronic devices 102 or 104 may be the same as or different from the electronic device 101 . According to an embodiment, all or part of operations executed in the electronic device 101 may be executed in one or more external electronic devices among the external electronic devices 102 , 104 , or 108 . For example, when the electronic device 101 needs to automatically perform a certain function or service or in response to a request from a user or another device, the electronic device 101 may request one or more external electronic devices to perform the function or at least part of the service, instead of or in addition to executing the function or service by itself. One or more external electronic devices receiving the request may execute at least a part of the requested function or service or an additional function or service related to the request, and deliver the execution result to the electronic device 101 . The electronic device 101 may provide the result as at least part of a response to the request as it is or additionally processed. To this end, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device 101 may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device 104 may include an internet of things (IoT) device. Server 108 may be an intelligent server using machine learning and/or neural networks. According to one embodiment, the external electronic device 104 or server 108 may be included in the second network 199 . The electronic device 101 may be applied to intelligent services (eg, smart home, smart city, smart car, or health care) based on 5G communication technology and IoT-related technology.
도 2는 다양한 실시예들에 따른, 레거시 네트워크 통신 및 5G 네트워크 통신을 지원하기 위한 전자 장치(101)의 블록도(200)이다. 2 is a block diagram 200 of an electronic device 101 for supporting legacy network communication and 5G network communication, according to various embodiments.
도 2를 참조하면, 전자 장치(101)는 제 1 커뮤니케이션 프로세서(212), 제 2 커뮤니케이션 프로세서(214), 제 1 radio frequency integrated circuit(RFIC)(222), 제 2 RFIC(224), 제 3 RFIC(226), 제 4 RFIC(228), 제 1 radio frequency front end(RFFE)(232), 제 2 RFFE(234), 제 1 안테나 모듈(242), 제 2 안테나 모듈(244), 및 안테나(248)을 포함할 수 있다. 전자 장치(101)는 프로세서(120) 및 메모리(130)를 더 포함할 수 있다. 네트워크(199)는 제 1 네트워크(292)와 제2 네트워크(294)를 포함할 수 있다. 다른 실시예에 따르면, 전자 장치(101)는 도1에 기재된 부품들 중 적어도 하나의 부품을 더 포함할 수 있고, 네트워크(199)는 적어도 하나의 다른 네트워크를 더 포함할 수 있다. 일실시예에 따르면, 제 1 커뮤니케이션 프로세서(212), 제 2 커뮤니케이션 프로세서(214), 제 1 RFIC(222), 제 2 RFIC(224), 제 4 RFIC(228), 제 1 RFFE(232), 및 제 2 RFFE(234)는 무선 통신 모듈(192)의 적어도 일부를 형성할 수 있다. 다른 실시예에 따르면, 제 4 RFIC(228)는 생략되거나, 제 3 RFIC(226)의 일부로서 포함될 수 있다. Referring to FIG. 2 , the electronic device 101 includes a first communication processor 212, a second communication processor 214, a first radio frequency integrated circuit (RFIC) 222, a second RFIC 224, a third RFIC 226, a fourth RFIC 228, a first radio frequency front end (RFFE) 232, a second RFFE 234, and a first antenna module 2 42), a second antenna module 244, and an antenna 248. The electronic device 101 may further include a processor 120 and a memory 130 . The network 199 may include a first network 292 and a second network 294 . According to another embodiment, the electronic device 101 may further include at least one of the components shown in FIG. 1, and the network 199 may further include at least one other network. According to one embodiment, the first communication processor 212, the second communication processor 214, the first RFIC 222, the second RFIC 224, the fourth RFIC 228, the first RFFE 232, and the second RFFE 234 may form at least a portion of the wireless communication module 192. According to another embodiment, the fourth RFIC 228 may be omitted or included as part of the third RFIC 226 .
제 1 커뮤니케이션 프로세서(212)는 제 1 네트워크(292)와의 무선 통신에 사용될 대역의 통신 채널의 수립, 및 수립된 통신 채널을 통한 레거시 네트워크 통신을 지원할 수 있다. 다양한 실시예들에 따르면, 제 1 네트워크는 2세대(2G), 3G, 4G, 또는 long term evolution(LTE) 네트워크를 포함하는 레거시 네트워크일 수 있다. 제 2 커뮤니케이션 프로세서(214)는 제 2 네트워크(294)와의 무선 통신에 사용될 대역 중 지정된 대역(예: 약 6GHz ~ 약 60GHz)에 대응하는 통신 채널의 수립, 및 수립된 통신 채널을 통한 5G 네크워크 통신을 지원할 수 있다. 다양한 실시예들에 따르면, 제 2 네트워크(294)는 3GPP에서 정의하는 5G 네트워크일 수 있다. 추가적으로, 일실시예에 따르면, 제 1 커뮤니케이션 프로세서(212) 또는 제 2 커뮤니케이션 프로세서(214)는 제 2 네트워크(294)와의 무선 통신에 사용될 대역 중 다른 지정된 대역(예: 약 6GHz 이하)에 대응하는 통신 채널의 수립, 및 수립된 통신 채널을 통한 5G 네크워크 통신을 지원할 수 있다. 일실시예에 따르면, 제 1 커뮤니케이션 프로세서(212)와 제 2 커뮤니케이션 프로세서(214)는 단일(single) 칩 또는 단일 패키지 내에 구현될 수 있다. 다양한 실시예들에 따르면, 제 1 커뮤니케이션 프로세서(212) 또는 제 2 커뮤니케이션 프로세서(214)는 프로세서(120), 보조 프로세서(123), 또는 통신 모듈(190)과 단일 칩 또는 단일 패키지 내에 형성될 수 있다.The first communication processor 212 may establish a communication channel of a band to be used for wireless communication with the first network 292 and support legacy network communication through the established communication channel. According to various embodiments, the first network may be a legacy network including a second generation (2G), 3G, 4G, or long term evolution (LTE) network. The second communication processor 214 may establish a communication channel corresponding to a designated band (eg, about 6 GHz to about 60 GHz) among bands to be used for wireless communication with the second network 294, and support 5G network communication through the established communication channel. According to various embodiments, the second network 294 may be a 5G network defined by 3GPP. Additionally, according to one embodiment, the first communication processor 212 or the second communication processor 214 may support establishment of a communication channel corresponding to another designated band (eg, about 6 GHz or less) among bands to be used for wireless communication with the second network 294, and 5G network communication through the established communication channel. According to one embodiment, the first communication processor 212 and the second communication processor 214 may be implemented on a single chip or in a single package. According to various embodiments, the first communication processor 212 or the second communication processor 214 may be formed with the processor 120, coprocessor 123, or communication module 190 on a single chip or in a single package.
제 1 RFIC(222)는, 송신 시에, 제 1 커뮤니케이션 프로세서(212)에 의해 생성된 기저대역(baseband) 신호를 제 1 네트워크(292)(예: 레거시 네트워크)에 사용되는 약 700MHz 내지 약 3GHz의 라디오 주파수(RF) 신호로 변환할 수 있다. 수신 시에는, RF 신호가 안테나(예: 제 1 안테나 모듈(242))를 통해 제 1 네트워크(292)(예: 레거시 네트워크)로부터 획득되고, RFFE(예: 제 1 RFFE(232))를 통해 전처리(preprocess)될 수 있다. 제 1 RFIC(222)는 전처리된 RF 신호를 제 1 커뮤니케이션 프로세서(212)에 의해 처리될 수 있도록 기저대역 신호로 변환할 수 있다.When transmitting, the first RFIC 222 may convert a baseband signal generated by the first communication processor 212 into a radio frequency (RF) signal of about 700 MHz to about 3 GHz used in the first network 292 (e.g., a legacy network). During reception, an RF signal is obtained from a first network 292 (eg, a legacy network) through an antenna (eg, the first antenna module 242), and preprocessed through an RFFE (eg, the first RFFE 232). The first RFIC 222 may convert the preprocessed RF signal into a baseband signal to be processed by the first communication processor 212 .
제 2 RFIC(224)는, 송신 시에, 제 1 커뮤니케이션 프로세서(212) 또는 제 2 커뮤니케이션 프로세서(214)에 의해 생성된 기저대역 신호를 제 2 네트워크(294)(예: 5G 네트워크)에 사용되는 Sub6 대역(예: 약 6GHz 이하)의 RF 신호(이하, 5G Sub6 RF 신호)로 변환할 수 있다. 수신 시에는, 5G Sub6 RF 신호가 안테나(예: 제 2 안테나 모듈(244))를 통해 제 2 네트워크(294)(예: 5G 네트워크)로부터 획득되고, RFFE(예: 제 2 RFFE(234))를 통해 전처리될 수 있다. 제 2 RFIC(224)는 전처리된 5G Sub6 RF 신호를 제 1 커뮤니케이션 프로세서(212) 또는 제 2 커뮤니케이션 프로세서(214) 중 대응하는 커뮤니케이션 프로세서에 의해 처리될 수 있도록 기저대역 신호로 변환할 수 있다. The second RFIC 224 may convert the baseband signal generated by the first communication processor 212 or the second communication processor 214 into an RF signal (hereinafter referred to as a 5G Sub6 RF signal) of a Sub6 band (eg, about 6 GHz or less) used in the second network 294 (eg, a 5G network) during transmission. During reception, the 5G Sub6 RF signal is obtained from the second network 294 (eg, 5G network) through an antenna (eg, the second antenna module 244), and the RFFE (eg, the second RFFE 234). It may be pre-processed. The second RFIC 224 may convert the preprocessed 5G Sub6 RF signal into a baseband signal to be processed by a corresponding communication processor among the first communication processor 212 and the second communication processor 214 .
제 3 RFIC(226)는 제 2 커뮤니케이션 프로세서(214)에 의해 생성된 기저대역 신호를 제 2 네트워크(294)(예: 5G 네트워크)에서 사용될 5G Above6 대역(예: 약 6GHz ~ 약 60GHz)의 RF 신호(이하, 5G Above6 RF 신호)로 변환할 수 있다. 수신 시에는, 5G Above6 RF 신호가 안테나(예: 안테나(248))를 통해 제 2 네트워크(294)(예: 5G 네트워크)로부터 획득되고 제 3 RFFE(236)를 통해 전처리될 수 있다. 제 3 RFIC(226)는 전처리된 5G Above6 RF 신호를 제 2 커뮤니케이션 프로세서(214)에 의해 처리될 수 있도록 기저대역 신호로 변환할 수 있다. 일실시예에 따르면, 제 3 RFFE(236)는 제 3 RFIC(226)의 일부로서 형성될 수 있다.The third RFIC 226 converts the baseband signal generated by the second communication processor 214 into a 5G Above6 band (eg, about 6 GHz to about 60 GHz) RF signal (hereinafter, 5G Above6 RF signal) to be used in the second network 294 (eg, a 5G network). Upon reception, the 5G Above6 RF signal may be obtained from the second network 294 (eg, 5G network) through an antenna (eg, antenna 248) and pre-processed through a third RFFE 236. The third RFIC 226 may convert the preprocessed 5G Above6 RF signal into a baseband signal to be processed by the second communication processor 214 . According to one embodiment, the third RFFE 236 may be formed as part of the third RFIC 226 .
전자 장치(101)는, 일실시예에 따르면, 제 3 RFIC(226)와 별개로 또는 적어도 그 일부로서, 제 4 RFIC(228)를 포함할 수 있다. 이런 경우, 제 4 RFIC(228)는 제 2 커뮤니케이션 프로세서(214)에 의해 생성된 기저대역 신호를 중간(intermediate) 주파수 대역(예: 약 9GHz ~ 약 11GHz)의 RF 신호(이하, IF 신호)로 변환한 뒤, 상기 IF 신호를 제 3 RFIC(226)로 전달할 수 있다. 제 3 RFIC(226)는 IF 신호를 5G Above6 RF 신호로 변환할 수 있다. 수신 시에, 5G Above6 RF 신호가 안테나(예: 안테나(248))를 통해 제 2 네트워크(294)(예: 5G 네트워크)로부터 수신되고 제 3 RFIC(226)에 의해 IF 신호로 변환될 수 있다. 제 4 RFIC(228)는 IF 신호를 제 2 커뮤니케이션 프로세서(214)가 처리할 수 있도록 기저대역 신호로 변환할 수 있다.The electronic device 101, according to one embodiment, may include a fourth RFIC 228 separately from or at least as part of the third RFIC 226. In this case, the fourth RFIC 228 converts the baseband signal generated by the second communication processor 214 into an RF signal (hereinafter referred to as an IF signal) of an intermediate frequency band (e.g., about 9 GHz to about 11 GHz), and then transfers the IF signal to the third RFIC 226. The third RFIC 226 may convert the IF signal into a 5G Above6 RF signal. Upon reception, the 5G Above6 RF signal may be received from the second network 294 (eg, 5G network) via an antenna (eg, antenna 248) and converted to an IF signal by a third RFIC 226. The fourth RFIC 228 may convert the IF signal into a baseband signal so that the second communication processor 214 can process it.
일시예에 따르면, 제 1 RFIC(222)와 제 2 RFIC(224)는 단일 칩 또는 단일 패키지의 적어도 일부로 구현될 수 있다. 일실시예에 따르면, 제 1 RFFE(232)와 제 2 RFFE(234)는 단일 칩 또는 단일 패키지의 적어도 일부로 구현될 수 있다. 일시예에 따르면, 제 1 안테나 모듈(242) 또는 제 2 안테나 모듈(244)중 적어도 하나의 안테나 모듈은 생략되거나 다른 안테나 모듈과 결합되어 대응하는 복수의 대역들의 RF 신호들을 처리할 수 있다.According to an example, the first RFIC 222 and the second RFIC 224 may be implemented as a single chip or at least part of a single package. According to one embodiment, the first RFFE 232 and the second RFFE 234 may be implemented as a single chip or at least part of a single package. According to one embodiment, at least one antenna module of the first antenna module 242 or the second antenna module 244 may be omitted or combined with another antenna module to process RF signals of a plurality of corresponding bands.
일실시예에 따르면, 제 3 RFIC(226)와 안테나(248)는 동일한 서브스트레이트에 배치되어 제 3 안테나 모듈(246)을 형성할 수 있다. 예를 들어, 무선 통신 모듈(192) 또는 프로세서(120)가 제 1 서브스트레이트(예: main PCB)에 배치될 수 있다. 이런 경우, 제 1 서브스트레이트와 별도의 제 2 서브스트레이트(예: sub PCB)의 일부 영역(예: 하면)에 제 3 RFIC(226)가, 다른 일부 영역(예: 상면)에 안테나(248)가 배치되어, 제 3 안테나 모듈(246)이 형성될 수 있다. 제 3 RFIC(226)와 안테나(248)를 동일한 서브스트레이트에 배치함으로써 그 사이의 전송 선로의 길이를 줄이는 것이 가능하다. 이는, 예를 들면, 5G 네트워크 통신에 사용되는 고주파 대역(예: 약 6GHz ~ 약 60GHz)의 신호가 전송 선로에 의해 손실(예: 감쇄)되는 것을 줄일 수 있다. 이로 인해, 전자 장치(101)는 제 2 네트워크(294)(예: 5G 네트워크)와의 통신의 품질 또는 속도를 향상시킬 수 있다.According to one embodiment, the third RFIC 226 and the antenna 248 may be disposed on the same substrate to form the third antenna module 246 . For example, the wireless communication module 192 or processor 120 may be disposed on a first substrate (eg, main PCB). In this case, the third RFIC 226 is disposed on a part (eg, lower surface) of a second substrate (eg, sub PCB) separate from the first substrate, and the antenna 248 is disposed on another part (eg, upper surface) to form the third antenna module 246. By arranging the third RFIC 226 and the antenna 248 on the same substrate, it is possible to reduce the length of the transmission line therebetween. This, for example, can reduce loss (eg, attenuation) of a signal of a high frequency band (eg, about 6 GHz to about 60 GHz) used in 5G network communication by a transmission line. As a result, the electronic device 101 can improve the quality or speed of communication with the second network 294 (eg, 5G network).
일시예에 따르면, 안테나(248)는 빔포밍에 사용될 수 있는 복수개의 안테나 엘레멘트들을 포함하는 안테나 어레이로 형성될 수 있다. 이런 경우, 제 3 RFIC(226)는, 예를 들면, 제 3 RFFE(236)의 일부로서, 복수개의 안테나 엘레멘트들에 대응하는 복수개의 위상 변환기(phase shifter)(238)들을 포함할 수 있다. 송신 시에, 복수개의 위상 변환기(238)들 각각은 대응하는 안테나 엘레멘트를 통해 전자 장치(101)의 외부(예: 5G 네트워크의 베이스 스테이션)로 송신될 5G Above6 RF 신호의 위상을 변환할 수 있다. 수신 시에, 복수개의 위상 변환기(238)들 각각은 대응하는 안테나 엘레멘트를 통해 상기 외부로부터 수신된 5G Above6 RF 신호의 위상을 동일한 또는 실질적으로 동일한 위상으로 변환할 수 있다. 이것은 전자 장치(101)와 상기 외부 간의 빔포밍을 통한 송신 또는 수신을 가능하게 한다.According to one embodiment, the antenna 248 may be formed of an antenna array including a plurality of antenna elements that may be used for beamforming. In this case, the third RFIC 226 may include, for example, a plurality of phase shifters 238 corresponding to a plurality of antenna elements as a part of the third RFFE 236. During transmission, each of the plurality of phase converters 238 may convert the phase of a 5G Above6 RF signal to be transmitted to the outside of the electronic device 101 (eg, a base station of a 5G network) through a corresponding antenna element. During reception, each of the plurality of phase converters 238 may convert the phase of the 5G Above6 RF signal received from the outside through the corresponding antenna element into the same or substantially the same phase. This enables transmission or reception through beamforming between the electronic device 101 and the outside.
제 2 네트워크(294)(예: 5G 네트워크)는 제 1 네트워크(292)(예: 레거시 네트워크)와 독립적으로 운영되거나(예: Stand-Alone (SA)), 연결되어 운영될 수 있다(예: Non-Stand Alone (NSA)). 예를 들면, 5G 네트워크에는 액세스 네트워크(예: 5G radio access network(RAN) 또는 next generation RAN(NG RAN))만 있고, 코어 네트워크(예: next generation core(NGC))는 없을 수 있다. 이런 경우, 전자 장치(101)는 5G 네트워크의 액세스 네트워크에 액세스한 후, 레거시 네트워크의 코어 네트워크(예: evolved packed core(EPC))의 제어 하에 외부 네트워크(예: 인터넷)에 액세스할 수 있다. 레거시 네트워크와 통신을 위한 프로토콜 정보(예: LTE 프로토콜 정보) 또는 5G 네트워크와 통신을 위한 프로토콜 정보(예: New Radio(NR) 프로토콜 정보)는 메모리(230)에 저장되어, 다른 부품(예: 프로세서(120), 제 1 커뮤니케이션 프로세서(212), 또는 제 2 커뮤니케이션 프로세서(214))에 의해 액세스될 수 있다.The second network 294 (eg, 5G network) may be operated independently of the first network 292 (eg, legacy network) (eg, Stand-Alone (SA)) or connected (eg, Non-Stand Alone (NSA)). For example, a 5G network may include only an access network (eg, a 5G radio access network (RAN) or a next generation RAN (NG RAN)) and no core network (eg, a next generation core (NGC)). In this case, after accessing the access network of the 5G network, the electronic device 101 may access an external network (eg, the Internet) under the control of a core network (eg, evolved packed core (EPC)) of the legacy network. Protocol information for communication with a legacy network (e.g., LTE protocol information) or protocol information for communication with a 5G network (e.g., New Radio (NR) protocol information) is stored in the memory 230 and may be accessed by other components (e.g., the processor 120, the first communication processor 212, or the second communication processor 214).
도 3a는 본 발명의 다양한 실시예들에 따른 전자 장치(300)의 전면의 사시도이다. 도 3b는 본 발명의 다양한 실시예들에 따른 도 3a의 전자 장치(300)의 후면의 사시도이다.3A is a perspective view of the front of an electronic device 300 according to various embodiments of the present disclosure. 3B is a perspective view of the back of the electronic device 300 of FIG. 3A according to various embodiments of the present disclosure.
도 3a 및 도 3b의 전자 장치(300)는 도 1의 전자 장치(101)와 적어도 일부 유사하거나, 전자 장치의 다른 실시예들을 포함할 수 있다.The electronic device 300 of FIGS. 3A and 3B may be at least partially similar to the electronic device 101 of FIG. 1 or may include other embodiments of the electronic device.
도 3a 및 도 3b를 참조하면, 일 실시예에 따른 전자 장치(300)는, 제 1 면(또는 전면)(310A), 제 2 면(또는 후면)(310B), 및 제 1 면(310A) 및 제 2 면(310B) 사이의 공간을 둘러싸는 측면(310C)을 포함하는 하우징(310)을 포함할 수 있다. 다른 실시예(미도시)에서는, 하우징(310)은, 도 1의 제 1 면(310A), 제 2 면(310B) 및 측면(310C)들 중 일부를 형성하는 구조를 지칭할 수도 있다. 일 실시예에 따르면, 제 1 면(310A)은 적어도 일부분이 실질적으로 투명한 전면 플레이트(302)(예: 다양한 코팅 레이어들을 포함하는 글라스 플레이트, 또는 폴리머 플레이트)에 의하여 형성될 수 있다. 제 2 면(310B)은 실질적으로 불투명한 후면 플레이트(311)에 의하여 형성될 수 있다. 상기 후면 플레이트(311)는, 예를 들어, 코팅 또는 착색된 유리, 세라믹, 폴리머, 금속(예: 알루미늄, 스테인레스 스틸(STS), 또는 마그네슘), 또는 상기 물질들 중 적어도 둘의 조합에 의하여 형성될 수 있다. 상기 측면(310C)은, 전면 플레이트(302) 및 후면 플레이트(311)와 결합하며, 금속 및/또는 폴리머를 포함하는 측면 베젤 구조 (또는 "측면 부재")(320)에 의하여 형성될 수 있다. 어떤 실시예에서는, 후면 플레이트(311) 및 측면 베젤 구조(320)는 일체로 형성되고 동일한 물질(예: 알루미늄과 같은 금속 물질)을 포함할 수 있다.Referring to FIGS. 3A and 3B , an electronic device 300 according to an embodiment may include a first surface (or front surface) 310A, a second surface (or rear surface) 310B, and a housing 310 including a side surface 310C surrounding a space between the first surface 310A and the second surface 310B. In another embodiment (not shown), the housing 310 may refer to a structure forming some of the first face 310A, the second face 310B, and the side face 310C of FIG. 1 . According to one embodiment, the first surface 310A may be formed by a front plate 302 (eg, a glass plate including various coating layers, or a polymer plate) that is at least partially transparent. The second surface 310B may be formed by a substantially opaque back plate 311 . The rear plate 311 may be formed of, for example, coated or colored glass, ceramic, polymer, metal (eg, aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials. The side surface 310C may be formed by a side bezel structure (or "side member") 320 coupled to the front plate 302 and the rear plate 311 and including metal and/or polymer. In some embodiments, the back plate 311 and the side bezel structure 320 may be integrally formed and include the same material (eg, a metal material such as aluminum).
도시된 실시예에서는, 상기 전면 플레이트(302)는, 상기 제 1 면(310A)으로부터 상기 후면 플레이트(311) 쪽으로 휘어져 심리스하게(seamless) 연장된 제 1 영역(310D)을, 상기 전면 플레이트(302)의 긴 엣지(long edge) 양단에 포함할 수 있다. 도시된 실시예(도 3b 참조)에서, 상기 후면 플레이트(311)는, 상기 제 2 면(310B)으로부터 상기 전면 플레이트(302) 쪽으로 휘어져 심리스(seamless)하게 연장된 제 2 영역(310E)을 긴 엣지 양단에 포함할 수 있다. 어떤 실시예에서는, 상기 전면 플레이트(302) 또는 후면 플레이트(311)가 상기 제 1 영역(310D) 또는 제 2 영역(310E) 중 하나 만을 포함할 수 있다. 어떤 실시예에서는 전면 플레이트(302)는 제 1 영역(310D) 및 제 2 영역(310E)을 포함하지 않고, 제 2 면(310B)과 평행하게 배치되는 편평한 평면만을 포함할 수도 있다. 상기 실시예들에서, 상기 전자 장치(300)의 측면에서 볼 때, 측면 베젤 구조(320)는, 상기와 같은 제 1 영역(310D) 또는 제 2 영역(310E)이 포함되지 않는 측면 쪽에서는 제 1 두께 (또는 폭)을 가지고, 상기 제 1 영역 또는 제 2 영역을 포함한 측면 쪽에서는 상기 제 1 두께보다 얇은 제 2 두께를 가질 수 있다.In the illustrated embodiment, the front plate 302 may include a first region 310D that is curved and seamlessly extended from the first surface 310A toward the rear plate 311 at both ends of a long edge of the front plate 302. In the illustrated embodiment (see FIG. 3B), the back plate 311 is curved from the second surface 310B toward the front plate 302 and extends seamlessly. It may include a second region 310E at both ends of the long edge. In some embodiments, the front plate 302 or the rear plate 311 may include only one of the first region 310D or the second region 310E. In some embodiments, the front plate 302 may not include the first region 310D and the second region 310E, but may include only a flat plane disposed parallel to the second surface 310B. In the above embodiments, when viewed from the side of the electronic device 300, the side bezel structure 320 may have a first thickness (or width) on a side surface that does not include the first area 310D or second area 310E, and may have a second thickness smaller than the first thickness on a side surface including the first area or the second area.
일 실시예에 따르면, 전자 장치(300)는, 디스플레이(301), 입력 장치(303), 음향 출력 장치(307, 314), 센서 모듈(304, 319), 카메라 모듈(305, 312, 313), 키 입력 장치(317), 인디케이터(미도시 됨), 및 커넥터(308, 309) 중 적어도 하나 이상을 포함할 수 있다. 어떤 실시예에서는, 상기 전자 장치(300)는, 구성요소들 중 적어도 하나(예: 키 입력 장치(317), 또는 인디케이터)를 생략하거나 다른 구성요소를 추가적으로 포함할 수 있다.According to an embodiment, the electronic device 300 may include at least one of a display 301, an input device 303, sound output devices 307 and 314, sensor modules 304 and 319, camera modules 305, 312 and 313, a key input device 317, an indicator (not shown), and connectors 308 and 309. In some embodiments, the electronic device 300 may omit at least one of the components (eg, the key input device 317 or the indicator) or may additionally include other components.
디스플레이(301)는, 예를 들어, 전면 플레이트(302)의 상당 부분을 통하여 노출될 수 있다. 어떤 실시예에서는, 상기 제 1 면(310A), 및 상기 측면(310C)의 제 1 영역(310D)을 형성하는 전면 플레이트(302)를 통하여 상기 디스플레이(301)의 적어도 일부가 노출될 수 있다. 디스플레이(301)는, 터치 감지 회로, 터치의 세기(압력)를 측정할 수 있는 압력 센서, 및/또는 자기장 방식의 스타일러스 펜을 검출하는 디지타이저와 결합되거나 인접하여 배치될 수 있다. 어떤 실시예에서는, 상기 센서 모듈(304, 319)의 적어도 일부, 및/또는 키 입력 장치(317)의 적어도 일부가, 상기 제 1 영역(310D), 및/또는 상기 제 2 영역(310E)에 배치될 수 있다. The display 301 may be exposed through a substantial portion of the front plate 302, for example. In some embodiments, at least a portion of the display 301 may be exposed through the front plate 302 forming the first surface 310A and the first region 310D of the side surface 310C. The display 301 may be combined with or disposed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and/or a digitizer that detects a magnetic field type stylus pen. In some embodiments, at least a portion of the sensor modules 304 and 319 and/or at least a portion of the key input device 317 may be disposed in the first area 310D and/or the second area 310E.
입력 장치(303)는, 마이크(303)를 포함할 수 있다. 어떤 실시예에서는, 입력 장치(303)는 소리의 방향을 감지할 수 있도록 배치되는 복수개의 마이크(303)를 포함할 수 있다. 음향 출력 장치(307, 314)는 스피커들(307, 314)을 포함할 수 있다. 스피커들(307, 314)은, 외부 스피커(307) 및 통화용 리시버(314)를 포함할 수 있다. 어떤 실시예에서는 마이크(303), 스피커들(307, 314) 및 커넥터들(308, 309)은 전자 장치(300)의 상기 공간에 배치되고, 하우징(310)에 형성된 적어도 하나의 홀을 통하여 외부 환경에 노출될 수 있다. 어떤 실시예에서는 하우징(310)에 형성된 홀은 마이크(303) 및 스피커들(307, 314)을 위하여 공용으로 사용될 수 있다. 어떤 실시예에서는 음향 출력 장치(307, 314)는 하우징(310)에 형성된 홀이 배제된 채, 동작되는 스피커(예: 피에조 스피커)를 포함할 수 있다.The input device 303 may include a microphone 303 . In some embodiments, the input device 303 may include a plurality of microphones 303 disposed to detect the direction of sound. The sound output devices 307 and 314 may include speakers 307 and 314 . The speakers 307 and 314 may include an external speaker 307 and a receiver 314 for communication. In some embodiments, the microphone 303, the speakers 307 and 314, and the connectors 308 and 309 are disposed in the space of the electronic device 300 and may be exposed to the external environment through at least one hole formed in the housing 310. In some embodiments, the hole formed in the housing 310 may be commonly used for the microphone 303 and the speakers 307 and 314. In some embodiments, the sound output devices 307 and 314 may include a speaker (eg, a piezo speaker) that operates while excluding holes formed in the housing 310 .
센서 모듈(304, 319)은, 전자 장치(300)의 내부의 작동 상태, 또는 외부의 환경 상태에 대응하는 전기 신호 또는 데이터 값을 생성할 수 있다. 센서 모듈(304, 319)은, 예를 들어, 하우징(310)의 제 1 면(310A)에 배치된 제 1 센서 모듈(304)(예: 근접 센서) 및/또는 제 2 센서 모듈(미도시)(예: 지문 센서), 및/또는 상기 하우징(310)의 제 2 면(310B)에 배치된 제 3 센서 모듈(319)(예: HRM 센서)을 포함할 수 있다. 상기 지문 센서는 하우징(310)의 제 1 면(310A)에 배치될 수 있다. 지문 센서(예: 초음파 방식 또는 광학식 지문 센서)는 제 1 면(310A) 중 디스플레이(301) 아래에 배치될 수 있다. 전자 장치(300)는, 도시되지 않은 센서 모듈, 예를 들어, 제스처 센서, 자이로 센서, 기압 센서, 마그네틱 센서, 가속도 센서, 그립 센서, 컬러 센서, IR(infrared) 센서, 생체 센서, 온도 센서, 습도 센서, 또는 조도 센서(304) 중 적어도 하나를 더 포함할 수 있다.The sensor modules 304 and 319 may generate electrical signals or data values corresponding to an internal operating state of the electronic device 300 or an external environmental state. The sensor modules 304 and 319 may include, for example, a first sensor module 304 (eg, a proximity sensor) and/or a second sensor module (not shown) (eg, a fingerprint sensor) disposed on the first surface 310A of the housing 310, and/or a third sensor module 319 (eg, an HRM sensor) disposed on the second surface 310B of the housing 310. The fingerprint sensor may be disposed on the first surface 310A of the housing 310 . A fingerprint sensor (eg, an ultrasonic or optical fingerprint sensor) may be disposed under the display 301 of the first surface 310A. The electronic device 300 may further include at least one of a sensor module (not shown), for example, a gesture sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a bio sensor, a temperature sensor, a humidity sensor, or an illuminance sensor 304.
카메라 모듈(305, 312, 313)은, 전자 장치(300)의 제 1 면(310A)에 배치된 제 1 카메라 장치(305), 및 제 2 면(310B)에 배치된 제 2 카메라 장치(312), 및/또는 플래시(313)를 포함할 수 있다. 상기 카메라 모듈들(305, 312)은, 하나 또는 복수의 렌즈들, 이미지 센서, 및/또는 이미지 시그널 프로세서를 포함할 수 있다. 플래시(313)는, 예를 들어, 발광 다이오드 또는 제논 램프(xenon lamp)를 포함할 수 있다. 어떤 실시예에서는, 2개 이상의 렌즈들 (광각 및 망원 렌즈) 및 이미지 센서들이 상기 전자 장치(300)의 한 면에 배치될 수 있다.The camera modules 305, 312, and 313 may include a first camera device 305 disposed on the first surface 310A of the electronic device 300, a second camera device 312 disposed on the second surface 310B, and/or a flash 313. The camera modules 305 and 312 may include one or a plurality of lenses, an image sensor, and/or an image signal processor. The flash 313 may include, for example, a light emitting diode or a xenon lamp. In some embodiments, two or more lenses (wide angle and telephoto lenses) and image sensors may be disposed on one side of the electronic device 300 .
키 입력 장치(317)는, 하우징(310)의 측면(310C)에 배치될 수 있다. 다른 실시예에서는, 전자 장치(300)는 상기 언급된 키 입력 장치(317)들 중 일부 또는 전부를 포함하지 않을 수 있고 포함되지 않은 키 입력 장치(317)는 디스플레이(301) 상에 소프트 키 등 다른 형태로 구현될 수 있다. 다른 실시예로, 키 입력 장치(317)는 디스플레이(301)에 포함된 압력 센서를 이용하여 구현될 수 있다.The key input device 317 may be disposed on the side surface 310C of the housing 310 . In another embodiment, the electronic device 300 may not include some or all of the above-mentioned key input devices 317, and the key input devices 317 that are not included may be implemented in other forms such as soft keys on the display 301. Alternatively, the key input device 317 may be implemented using a pressure sensor included in the display 301 .
인디케이터는, 예를 들어, 하우징(310)의 제 1 면(310A)에 배치될 수 있다. 인디케이터는, 예를 들어, 전자 장치(300)의 상태 정보를 광 형태로 제공할 수 있다. 다른 실시예에서는, 발광 소자는, 예를 들어, 카메라 모듈(305)의 동작과 연동되는 광원을 제공할 수 있다. 인디케이터는, 예를 들어, LED, IR LED 및 제논 램프를 포함할 수 있다. The indicator may be disposed on the first surface 310A of the housing 310, for example. The indicator may provide, for example, state information of the electronic device 300 in the form of light. In another embodiment, the light emitting device may provide, for example, a light source interlocked with the operation of the camera module 305 . Indicators may include, for example, LEDs, IR LEDs, and xenon lamps.
커넥터 홀(308, 309)은, 외부 전자 장치와 전력 및/또는 데이터를 송수신하기 위한 커넥터(예를 들어, USB 커넥터 또는 IF 모듈(interface connector port 모듈)를 수용할 수 있는 제 1 커넥터 홀(308), 및/또는 외부 전자 장치와 오디오 신호를 송수신하기 위한 커넥터를 수용할 수 있는 제 2 커넥터 홀(또는 이어폰 잭)(309)을 포함할 수 있다.The connector holes 308 and 309 may include a first connector hole 308 capable of accommodating a connector (e.g., a USB connector or an interface connector port module (IF) module) for transmitting and receiving power and/or data to and from an external electronic device, and/or a second connector hole (or earphone jack) 309 capable of accommodating a connector for transmitting and receiving audio signals to and from an external electronic device.
카메라 모듈들(305, 312) 중 일부 카메라 모듈(305), 센서 모듈(304, 319)들 중 일부 센서 모듈(304) 또는 인디케이터는 디스플레이(101)를 통해 노출되도록 배치될 수 있다. 예컨대, 카메라 모듈(305), 센서 모듈(304) 또는 인디케이터는 전자 장치(300)의 내부 공간에서, 디스플레이(301)의, 전면 플레이트(302)까지 천공된 오프닝을 통해 외부 환경과 접할 수 있도록 배치될 수 있다. 다른 실시예로, 일부 센서 모듈(304)은 전자 장치의 내부 공간에서 전면 플레이트(302)를 통해 시각적으로 노출되지 않고 그 기능을 수행하도록 배치될 수도 있다. 예컨대, 이러한 경우, 디스플레이(301)의, 센서 모듈과 대면하는 영역은 천공된 오프닝이 불필요할 수도 있다.Some of the camera modules 305 of the camera modules 305 and 312 , some of the sensor modules 304 of the sensor modules 304 and 319 , or indicators may be disposed to be exposed through the display 101 . For example, the camera module 305, the sensor module 304, or the indicator may be disposed in the internal space of the electronic device 300 to be in contact with the external environment through an opening perforated to the front plate 302 of the display 301. In another embodiment, some sensor modules 304 may be arranged to perform their functions without being visually exposed through the front plate 302 in the internal space of the electronic device. For example, in this case, the area of the display 301 facing the sensor module may not require a perforated opening.
도 3c는 본 발명의 다양한 실시예들에 따른 도 3a의 전자 장치(300)의 전개 사시도이다. 3C is an exploded perspective view of the electronic device 300 of FIG. 3A according to various embodiments of the present disclosure.
도 3c를 참조하면, 전자 장치(300)는, 측면 부재(320)(예: 측면 베젤 구조), 제 1 지지 부재(3211)(예: 브라켓), 전면 플레이트(302), 디스플레이(301), 인쇄 회로 기판(340), 배터리(350), 제 2 지지 부재(360)(예: 리어 케이스), 안테나(370), 및 후면 플레이트(311)를 포함할 수 있다. 어떤 실시예에서는, 전자 장치(300)는, 구성요소들 중 적어도 하나(예: 제 1 지지 부재(3111), 또는 제 2 지지 부재(360))를 생략하거나 다른 구성 요소를 추가적으로 포함할 수 있다. 전자 장치(300)의 구성 요소들 중 적어도 하나는, 도 3a 또는 도 3b의 전자 장치(300)의 구성 요소들 중 적어도 하나와 동일, 또는 유사할 수 있으며, 중복되는 설명은 이하 생략한다.Referring to FIG. 3C , the electronic device 300 may include a side member 320 (eg, a side bezel structure), a first support member 3211 (eg, a bracket), a front plate 302, a display 301, a printed circuit board 340, a battery 350, a second support member 360 (eg, a rear case), an antenna 370, and a rear plate 311. In some embodiments, the electronic device 300 may omit at least one of the components (eg, the first support member 3111 or the second support member 360) or may additionally include other components. At least one of the components of the electronic device 300 may be the same as or similar to at least one of the components of the electronic device 300 of FIG. 3A or 3B, and overlapping descriptions will be omitted below.
제 1 지지 부재(3211)는, 전자 장치(300)의 내부에 배치되어 측면 부재(320)와 연결될 수 있거나, 측면 부재(320)와 일체로 형성될 수 있다. 제 1 지지 부재(3211)는, 예를 들어, 금속 재질 및/또는 비금속 (예: 폴리머) 재질로 형성될 수 있다. 제 1 지지 부재(3211)는, 일면에 디스플레이(301)가 결합되고 타면에 인쇄 회로 기판(340)이 결합될 수 있다. 인쇄 회로 기판(340)에는, 프로세서, 메모리, 및/또는 인터페이스가 장착될 수 있다. 프로세서는, 예를 들어, 중앙처리장치, 어플리케이션 프로세서, 그래픽 처리 장치, 이미지 시그널 프로세서, 센서 허브 프로세서, 또는 커뮤니케이션 프로세서 중 하나 또는 그 이상을 포함할 수 있다.The first support member 3211 may be disposed inside the electronic device 300 and connected to the side member 320 or integrally formed with the side member 320 . The first support member 3211 may be formed of, for example, a metal material and/or a non-metal (eg, polymer) material. The display 301 may be coupled to one surface of the first support member 3211 and the printed circuit board 340 may be coupled to the other surface. A processor, memory, and/or interface may be mounted on the printed circuit board 340 . The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor.
메모리는, 예를 들어, 휘발성 메모리 또는 또는 비휘발성 메모리를 포함할 수 있다. Memory may include, for example, volatile memory or non-volatile memory.
인터페이스는, 예를 들어, HDMI(high definition multimedia interface), USB(universal serial bus) 인터페이스, SD카드 인터페이스, 및/또는 오디오 인터페이스를 포함할 수 있다. 인터페이스는, 예를 들어, 전자 장치(300)를 외부 전자 장치와 전기적 또는 물리적으로 연결시킬 수 있으며, USB 커넥터, SD 카드/MMC 커넥터, 또는 오디오 커넥터를 포함할 수 있다.The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and/or an audio interface. The interface may electrically or physically connect the electronic device 300 to an external electronic device, and may include a USB connector, an SD card/MMC connector, or an audio connector.
배터리(350)는 전자 장치(300)의 적어도 하나의 구성 요소에 전력을 공급하기 위한 장치로서, 예를 들면, 재충전 불가능한 1차 전지, 또는 재충전 가능한 2차 전지, 또는 연료 전지를 포함할 수 있다. 배터리(350)의 적어도 일부는, 예를 들어, 인쇄 회로 기판(340)과 실질적으로 동일 평면 상에 배치될 수 있다. 배터리(350)는 전자 장치(300) 내부에 일체로 배치될 수 있고, 전자 장치(300)와 탈부착 가능하게 배치될 수도 있다.The battery 350 is a device for supplying power to at least one component of the electronic device 300, and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery 350 may be disposed on a substantially coplanar surface with the printed circuit board 340 , for example. The battery 350 may be integrally disposed inside the electronic device 300 or may be disposed detachably from the electronic device 300 .
안테나(370)는, 후면 플레이트(311)와 배터리(350) 사이에 배치될 수 있다. 안테나(370)는, 예를 들어, NFC(near field communication) 안테나, 무선 충전 안테나, 및/또는 MST(magnetic secure transmission) 안테나를 포함할 수 있다. 안테나(370)는, 예를 들어, 외부 장치와 근거리 통신을 하거나, 충전에 필요한 전력을 무선으로 송수신 할 수 있다. 다른 실시예에서는, 상기 측면 부재(320) 및/또는 상기 제 1 지지 부재(3211)의 일부 또는 그 조합에 의하여 안테나 구조가 형성될 수 있다.The antenna 370 may be disposed between the rear plate 311 and the battery 350 . The antenna 370 may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and/or a magnetic secure transmission (MST) antenna. The antenna 370 may, for example, perform short-range communication with an external device or wirelessly transmit/receive power required for charging. In another embodiment, an antenna structure may be formed by a part of the side member 320 and/or the first support member 3211 or a combination thereof.
도 4는 본 개시의 다양한 실시예에 따른 안테나 구조체의 분리 사시도이다.4 is an exploded perspective view of an antenna structure according to various embodiments of the present disclosure.
도 4를 참고하면, 안테나 구조체(500)(예: 안테나 모듈)는 전자 장치(예: 도 7a의 전자 장치(600))의 내부 공간(예: 도 7b의 내부 공간(6001))에 배치되고, 복수의 급전부들(510, 520, 530, 540, 550)을 포함하는 기판(substrate)(590)(예: 인쇄 회로 기판) 및 하우징(610)의 도전성 부재(620a)(예: 금속 소재)에 형성되고, 복수의 급전부들(510, 520, 530, 540, 550)과 대응하도록 형성된 복수의 관통홀들(6231, 6232, 6233, 6234, 6235)에 채워진 지정된 유전율을 갖는 유전체(620c)를 포함할 수 있다. 한 실시예에 따르면, 기판(590)은 복수의 관통홀들(6231, 6232, 6233, 6234, 6235) 각각과 대응하는 위치에 배치된 복수의 급전부들(510, 520, 530, 540, 550)을 포함할 수 있다. 한 실시예에 따르면, 안테나 구조체(500)는 유전체(620c)를 공진기(resonator)로 이용하는 DRA(dielectric resonator antenna)를 포함할 수 있다.Referring to FIG. 4 , an antenna structure 500 (eg, an antenna module) is disposed in an internal space (eg, the internal space 6001 of FIG. 7B ) of an electronic device (eg, the electronic device 600 of FIG. 7A ), and includes a substrate 590 (eg, a printed circuit board) and a housing 610 including a plurality of power feeding units 510 , 520 , 530 , 540 , and 550 . A dielectric material 620c having a specified permittivity may be formed on the conductive member 620a (eg, a metal material) and filled in the plurality of through holes 6231, 6232, 6233, 6234, and 6235 formed to correspond to the plurality of power feeding units 510, 520, 530, 540, and 550. According to one embodiment, the substrate 590 may include a plurality of power feeding parts 510, 520, 530, 540, and 550 disposed at positions corresponding to the plurality of through holes 6231, 6232, 6233, 6234, and 6235, respectively. According to one embodiment, the antenna structure 500 may include a dielectric resonator antenna (DRA) using the dielectric 620c as a resonator.
다양한 실시예에 따르면, 기판(590)은 지정된 방향(예: ① 방향)을 향하는 제1면(5901) 및 제1면(5901)과 반대 방향(예: ② 방향)을 향하는 제2면(5902)을 포함할 수 있다. 한 실시예에 따르면, 기판(590)은 제1면(5901)과 제2면(5902) 사이의 공간에서, 제2면(5902)보다 제1면(5901)과 상대적으로 가까운 위치에 배치되거나, 제1면(5901)에 노출되고 어레이(예: 급전부 어레이(FA, feeding portion array)) 방식으로 배치된 복수의 급전부들(510, 520, 530, 540, 550)을 포함할 수 있다. 한 실시예에 따르면, 복수의 급전부들(510, 520, 530, 540, 550)은 지정된 간격으로 이격 배치된 제1급전부(510), 제2급전부(520), 제3급전부(530), 제4급전부(540) 및 제5급전부(550)를 포함할 수 있다. 한 실시예에 따르면, 복수의 급전부들(510, 520, 530, 540, 550)은 제1편파 급전부(511, 521, 531, 541, 551)(예: 수직 편파 급전부) 및 제2편파 급전부(512, 522, 532, 542, 552)(예: 수평 편파 급전부)를 포함할 수 있다. 이러한 경우, 안테나 구조체(500)는 유전체(620c)를 공진기로 사용하는 이중 편파 안테나 어레이로 동작될 수 있다. 어떤 실시예에서, 복수의 급전부들(510, 520, 530, 540, 550) 각각은 하나의 급전부들을 포함할 수도 있다. 이러한 경우, 안테나 구조체(500)는 유전체를 공진기로 사용하는 단일 편파 안테나로 동작될 수 있다.According to various embodiments, the substrate 590 may include a first surface 5901 facing a designated direction (eg, ① direction) and a second surface 5902 facing a direction opposite to the first surface 5901 (eg, ② direction). According to an embodiment, the substrate 590 may include a plurality of power feeding units 510, 520, 530, and 540 disposed at a position relatively closer to the first surface 5901 than the second surface 5902 in a space between the first surface 5901 and the second surface 5902, or exposed on the first surface 5901 and arranged in an array (eg, a feeding portion array (FA)) manner. , 550). According to one embodiment, the plurality of power feeders 510, 520, 530, 540, and 550 may include a first feeder 510, a second feeder 520, and a third feeder 530, a fourth feeder 540, and a fifth feeder 550 spaced apart from each other at designated intervals. According to one embodiment, the plurality of power feeders 510, 520, 530, 540, and 550 include first polarized wave feeders 511, 521, 531, 541, and 551 (eg, a vertical polarized wave feeder) and second polarized wave feeders 512, 522, 532, 542, and 552 (eg, a horizontally polarized wave feeder). ) may be included. In this case, the antenna structure 500 may operate as a dual polarized antenna array using the dielectric 620c as a resonator. In some embodiments, each of the plurality of power feeding units 510, 520, 530, 540, and 550 may include one power feeding unit. In this case, the antenna structure 500 may be operated as a single polarized antenna using a dielectric material as a resonator.
다양한 실시예에 따르면, 하우징(610)은 측면 부재(620)를 포함할 수 있다. 한 실시예에 따르면, 측면 부재(620)는 도전성 부재(620a) 및 도전성 부재(620a)와 결합된 비도전성 부재(620b)를 포함할 수 있다. 한 실시예에 따르면, 비도전성 부재(620b)는 사출을 통해 도전성 부재(620a)와 결합될 수 있다. 어떤 실시예에서, 비도전성 부재(620b)는 도전성 부재(620a)와 구조적으로 결합될 수도 있다. 한 실시예에 따르면, 측면 부재(620)는 기판(590)에 배치된 복수의 급전부들(510, 520, 530, 540, 550) 각각과 대응하는 위치에서, 어레이 방식(예: 관통홀 어레이(TA, through hole array))으로 형성된 복수의 관통홀들(6231, 6232, 6233, 6234, 6235)을 포함할 수 있다. 한 실시예에 따르면, 복수의 관통홀들(6231, 6232, 6233, 6234, 6235)은 제1급전부(510)와 대응하는 위치에 배치된 제1관통홀(6231), 제2급전부(520)와 대응하는 위치에 배치된 제2관통홀(6232), 제3급전부(530)와 대응하는 위치에 배치된 제3관통홀(6233), 제4급전부(540)와 대응하는 위치에 배치된 제4관통홀(6234) 및 제5급전부(550)와 대응하는 위치에 배치된 제5관통홀(6235)을 포함할 수 있다. 한 실시예에 따르면, 복수의 관통홀들(6231, 6232, 6233, 6234, 6235)은 측면 부재(620)의 내면(621)으로부터 외면(622)까지 관통되는 방식으로 형성될 수 있다. 한 실시예에 따르면, 복수의 관통홀들(6231, 6232, 6233, 6234, 6235)은 유전체(620c)로 채워질 수 있다. 한 실시예에 따르면, 유전체(620c)는 복수의 관통홀들(6231, 6232, 6233, 6234, 6235)에 사출되는 방식 또는 구조적 결합을 통해 채워질 수 있다. 한 실시예에 따르면, 유전체(620c)는 3이상의 유전율을 갖는 소재로 형성될 수 있다. 한 실시예에 따르면, 하우징(610)의 비도전성 부재(620b)와 유전체(620c)는 서로 다른 유전율을 갖는 소재를 포함할 수도 있다. 어떤 실시예에서, 하우징(610)의 비도전성 부재(620b)와 유전체(620c)는 실질적으로 동일한 소재일 수도 있다. 어떤 실시예에서, 하우징(610)의 비도전성 부재(620b)와 유전체(620c)는 일체로 형성될 수도 있다.According to various embodiments, the housing 610 may include a side member 620 . According to one embodiment, the side member 620 may include a conductive member 620a and a non-conductive member 620b combined with the conductive member 620a. According to one embodiment, the non-conductive member 620b may be combined with the conductive member 620a through injection. In some embodiments, the non-conductive member 620b may be structurally coupled to the conductive member 620a. According to one embodiment, the side member 620 may include a plurality of through holes 6231, 6232, 6233, 6234, and 6235 formed in an array manner (eg, a through hole array (TA)) at positions corresponding to each of the plurality of power feeding units 510, 520, 530, 540, and 550 disposed on the substrate 590. According to one embodiment, the plurality of through- holes 6231, 6232, 6233, 6234, and 6235 include a first through-hole 6231 disposed at a position corresponding to the first feeding part 510, a second through-hole 6232 disposed at a position corresponding to the second feeding part 520, and a third through-hole disposed at a position corresponding to the third feeding part 530. 6233, a fourth through hole 6234 disposed at a position corresponding to the fourth power supply unit 540, and a fifth through hole 6235 disposed at a position corresponding to the fifth power supply unit 550. According to one embodiment, the plurality of through holes 6231 , 6232 , 6233 , 6234 , and 6235 may be formed in such a way that they penetrate from the inner surface 621 to the outer surface 622 of the side member 620 . According to one embodiment, the plurality of through holes 6231 , 6232 , 6233 , 6234 , and 6235 may be filled with a dielectric material 620c. According to one embodiment, the dielectric material 620c may be injected into the plurality of through holes 6231 , 6232 , 6233 , 6234 , and 6235 or filled through structural coupling. According to one embodiment, the dielectric 620c may be formed of a material having a permittivity of 3 or more. According to one embodiment, the non-conductive member 620b and the dielectric 620c of the housing 610 may include materials having different dielectric constants. In some embodiments, the non-conductive member 620b and the dielectric 620c of the housing 610 may be made of substantially the same material. In some embodiments, the non-conductive member 620b of the housing 610 and the dielectric 620c may be integrally formed.
다양한 실시예에 따르면, 안테나 구조체(500)는 기판(590)의 제2면(5902)에 배치되고, 복수의 급전부들(510, 520, 530, 540, 550)과 전기적으로 연결된 무선 통신 회로(595)를 포함할 수 있다. 어떤 실시예에서, 무선 통신 회로(595)는 전자 장치(예: 도 8a의 전자 장치(600))의 내부 공간(예: 도 8a의 내부 공간(6001))에서, 기판(590)과 이격된 위치에서 인쇄 회로 기판(PCB, printed circuit board)(예: 도 8a의 장치 기판(630))에 배치되고, 전기적 연결 부재(예: FRC, flexible RF cable)(예: 도 8a의 전기적 연결 부재(560))를 통해 기판(590)과 전기적으로 연결될 수도 있다.According to various embodiments, the antenna structure 500 is disposed on the second surface 5902 of the substrate 590 and electrically connected to the plurality of power feeding units 510, 520, 530, 540, and 550. It may include a wireless communication circuit 595. In some embodiments, the wireless communication circuit 595 is disposed on a printed circuit board (PCB, printed circuit board) (eg, device board 630 of FIG. 8A) at a position spaced apart from the board 590 in an internal space (eg, internal space 6001 of FIG. 8A) of an electronic device (eg, electronic device 600 of FIG. 8A), and an electrical connection member (eg, FRC, flexible RF cable) (eg, electrical connection of FIG. 8A). It may be electrically connected to the substrate 590 through the member 560 .
다양한 실시예에 따르면, 복수의 안테나 급전부들(510, 520, 530, 540, 550)과 전기적으로 연결된 무선 통신 회로(595)는 RFIC(예: 도 2의 RFIC(222, 224, 226, 및/또는 228))를 포함할 수 있다. 예를 들어, 복수의 급전부들(510, 520, 530, 540, 550)은 기판(590)의 일 면(예: 제1면(5901))에 배치되거나, 일면과 가까운 위치에 내장되고, 기판(590)의 다른 면(예: 제2면(5902))에는 RFIC(예: 도 2의 RFIC(222, 224, 226, 및/또는 228))가 배치될 수 있다. 한 실시예에 따르면, 복수의 급전부들(510, 520, 530, 540, 550)과 전기적으로 연결된 무선 통신 회로(595)는 복수의 관통홀들(6231, 6232, 6233, 6234, 6235)에 채워진 유전체(620c)를 통해 지정된 주파수 대역(예: 약 3GHz ~ 100GHz 범위의 주파수 대역)에서 방향성 빔을 형성하도록 설정될 수 있다. 예컨대, 무선 통신 회로(595)는 복수의 급전부들(510, 520, 530, 540, 550) 중 제1편파(예: 수직 편파)로 동작하는 급전부들(511, 521, 531, 541, 551)을 통해 무선 신호를 송신 또는 수신하도록 설정될 수 있다. 한 실시예에 따르면, 무선 통신 회로(595)는 복수의 급전부들(510, 520, 530, 540, 550) 중 제2편파(예: 수평 편파)로 동작하는 급전부들(512, 522, 532, 542, 552)을 통해 무선 신호를 송신 또는 수신하도록 설정될 수 있다.According to various embodiments, the wireless communication circuit 595 electrically connected to the plurality of antenna feeders 510, 520, 530, 540, and 550 may include an RFIC (eg, the RFICs 222, 224, 226, and/or 228 of FIG. 2). For example, the plurality of power feeding units 510, 520, 530, 540, and 550 are disposed on one surface of the substrate 590 (eg, the first surface 5901) or embedded close to the one surface, and the RFIC (eg, the RFICs 222, 224, 226, and/or RFICs 222, 224, 226, and/or or 228)) may be placed. According to one embodiment, the wireless communication circuit 595 electrically connected to the plurality of feeders 510, 520, 530, 540, and 550 transmits a directional beam in a designated frequency band (eg, a frequency band ranging from about 3 GHz to 100 GHz) through a dielectric 620c filled in a plurality of through- holes 6231, 6232, 6233, 6234, and 6235. can be set to form For example, the wireless communication circuit 595 may be set to transmit or receive a radio signal through the power feeders 511, 521, 531, 541, 551 operating in a first polarized wave (eg, vertical polarization) among the plurality of power feeders 510, 520, 530, 540, and 550. According to one embodiment, the wireless communication circuit 595 operates with a second polarized wave (eg, horizontal polarization) among the plurality of power feeders 510, 520, 530, 540, and 550. It may be set to transmit or receive a radio signal through the feeders 512, 522, 532, 542, and 552.
다양한 실시예에 따르면, 복수의 급전부들(510, 520, 530, 540, 550)은 기판(590)에서 일렬로 배치될 수 있다. 어떤 실시예에서, 복수의 급전부들(510, 520, 530, 540, 550)은 행렬 형태(예: 2x2의 행렬 형태)를 갖도록 배치될 수도 있다. 한 실시예에 따르면, 복수의 급전부들(510, 520, 530, 540, 550)은 실질적으로 동일한 형상을 가질 수 있다. 한 실시예에 따르면, 복수의 관통홀들(6231, 6232, 6233, 6234, 6235)은 복수의 급전부들(510, 520, 530, 540, 550)과 대응하는 배치 구조를 갖도록 형성될 될 수 있다. 한 실시예에 따르면, 안테나 구조체(500) 기판(590)에 배치된 5개의 급전부들(510, 520, 530, 540, 550)을 포함하는 급전부 어레이(FA)를 포함할 수 있으나, 이에 국한되지 않는다. 예컨대, 안테나 구조체(500)는, 하나의 급전부를 포함하거나, 급전부 어레이(FA)로써, 2개, 3개, 4개 또는 6개 이상의 급전부들을 포함할 수도 있다. According to various embodiments, the plurality of power feeding units 510 , 520 , 530 , 540 , and 550 may be arranged in a line on the substrate 590 . In some embodiments, the plurality of power feeding units 510, 520, 530, 540, and 550 may be arranged in a matrix form (eg, a 2x2 matrix form). According to one embodiment, the plurality of power feeding units 510, 520, 530, 540, and 550 may have substantially the same shape. According to one embodiment, the plurality of through holes 6231 , 6232 , 6233 , 6234 , and 6235 may be formed to have an arrangement structure corresponding to the plurality of power feeding units 510 , 520 , 530 , 540 , and 550 . According to one embodiment, the antenna structure 500 may include a feeder array FA including five feeders 510, 520, 530, 540, and 550 disposed on the substrate 590, but is not limited thereto. For example, the antenna structure 500 may include one power supply unit or may include two, three, four, or six or more power supply units as a power supply array FA.
다양한 실시예에 따르면, 안테나 모듈(500)은 기판(590)의 제2면(5902)에 배치되고, 무선 통신 회로(595)를 적어도 부분적으로 감싸도록 배치되는 보호 부재(596)를 포함할 수 있다. 한 실시예에 따르면, 보호 부재(596)는 무선 통신 회로(595)를 감싸도록 배치된 보호층으로써, 도포된 후 경화 및/또는 고화되는 유전체를 포함할 수 있다. 한 실시예에 따르면, 보호 부재(596)는 에폭시 레진을 포함할 수 있다. 한 실시예에 따르면, 보호 부재(596)는 기판(590)의 제2면(5902)에서 무선 통신 회로(595)의 전부 또는 일부를 감싸도록 배치될 수 있다. 한 실시예에 따르면, 안테나 모듈(500)은 보호 부재(596)의 면에 적층되는 도전성 차폐층(597)을 포함할 수 있다. 한 실시예에 따르면, 도전성 차폐층(597)은 안테나 구조체(500)에서 발생되는 노이즈(예: DC-DC 노이즈 또는 interference 주파수 성분)가 주변으로 전달되는 것을 차폐할 수 있다. 한 실시예에 따르면, 도전성 차폐층(597)은 보호 부재(596)의 면에 스퍼터링(sputtering)과 같은 박막 증착 방식으로 도포되는 도전성 물질(예: 도전성 도료)을 포함할 수 있다. 한 실시예에 따르면, 도전성 차폐층(597)은 기판(590)의 그라운드 층(예: 도 5b의 그라운드 층(592))과 전기적으로 연결될 수 있다. 다른 실시예로, 보호 부재(596) 및/또는 도전성 차폐층(597)은 기판(590)에 실장되는 쉴드 캔(shield can)으로 대체되거나 더 추가될 수도 있다.According to various embodiments, the antenna module 500 may include a protective member 596 disposed on the second surface 5902 of the substrate 590 and disposed to at least partially enclose the wireless communication circuit 595. According to one embodiment, the protective member 596 is a protective layer disposed to surround the wireless communication circuit 595 and may include a dielectric that is hardened and/or solidified after being applied. According to one embodiment, the protection member 596 may include epoxy resin. According to one embodiment, the protection member 596 may be disposed to cover all or part of the wireless communication circuit 595 on the second surface 5902 of the substrate 590 . According to one embodiment, the antenna module 500 may include a conductive shielding layer 597 laminated on a surface of the protection member 596 . According to one embodiment, the conductive shielding layer 597 may block noise generated from the antenna structure 500 (eg, DC-DC noise or an interference frequency component) from being transferred to the surroundings. According to one embodiment, the conductive shielding layer 597 may include a conductive material (eg, conductive paint) applied on the surface of the protective member 596 by a thin film deposition method such as sputtering. According to an embodiment, the conductive shielding layer 597 may be electrically connected to a ground layer (eg, the ground layer 592 of FIG. 5B ) of the substrate 590 . In another embodiment, the protection member 596 and/or the conductive shielding layer 597 may be replaced with a shield can mounted on the substrate 590 or may be additionally added.
도 5a는 본 개시의 다양한 실시예에 따른 도 4의 기판의 5a 영역을 도시한 도면들이다. 도 5b는 본 개시의 다양한 실시예에 따른 도 5a의 라인 5b-5b를 따라 바라본 기판의 일부 단면도이다.FIG. 5A is diagrams illustrating an area 5a of the substrate of FIG. 4 according to various embodiments of the present disclosure. 5B is a partial cross-sectional view of a substrate taken along line 5b-5b of FIG. 5A according to various embodiments of the present disclosure.
도 5a의 (a) 및 (b)는 도 4의 기판(590)의 5a 영역의 적층 구조에 대한 분리 사시도를 도시하고 있고, 도 5b는 기판(590)의 단면도를 도시하고 있다. 미도시된 기판(590)의 나머지 영역 역시 실질적으로 동일한 적층 구조 및 배치 구조를 가질 수 있다.(a) and (b) of FIG. 5A show an exploded perspective view of the laminated structure of area 5a of the substrate 590 of FIG. 4, and FIG. 5B shows a cross-sectional view of the substrate 590. Referring to FIG. The remaining regions of the substrate 590 (not shown) may also have substantially the same stacking structure and arrangement structure.
도 5a 및 도 5b를 참고하면, 기판(590)은 제1방향(예: ① 방향)을 향하는 제1면(5901) 및 제1면(5901)과 반대 방향을 향하는 제2면(5902) 및 제1면(5901)과 제2면(5902) 사이의 공간에 배치되고 교번적으로 배치된 도전층들과 절연층들(591)을 포함할 수 있다. 한 실시예에 따르면, 기판(590)은 적어도 하나의 절연층(591)에 배치된 그라운드 층(ground plane)(592)을 포함할 수 있다. 한 실시예에 따르면, 기판(590)은 그라운드 층(592)과 제1면(5901) 사이에서, 제1면(5901)을 위에서 바라볼 때, 서로 다른 절연층에 중첩되도록 배치되고, 도전층들에 포함되는 도전성 소재로 형성된 복수의 플레이트들(593)을 포함할 수 있다. 한 실시예에 따르면, 복수의 플레이트들(593)은 제1면(5901)으로부터 순차적으로 적층된 제1플레이트(5931), 제2플레이트(5932) 및/또는 제3플레이트(5933)를 포함할 수 있다. 한 실시예에 따르면, 플레이트들(593)은 루프 형상의 오프닝들(5931a, 5932a, 5933a)을 포함할 수 있다. 한 실시예에 따르면, 플레이트들(593) 및 오프닝들(5931a, 5932a, 5933a)은, 제1면(5901)을 위에서 바라볼 때 중첩되도록 배치될 수 있다. 한 실시예에 따르면, 플레이트들(593)은, 플레이트들(593)을 관통하는 방식으로 배치된 복수의 도전성 비아들(CV)을 통해 그라운드 층(592)에 전기적으로 연결될 수 있다. 한 실시예에 따르면, 제1면(5901)을 위에서 바라볼 때, 기판(590)은 플레이트들(593)의 오프닝들(5931a, 5932a, 5933a) 및 그라운드층(592)을 통해 형성된 차폐 공간(S)을 포함할 수 있다.5A and 5B , a substrate 590 may include a first surface 5901 facing a first direction (e.g., direction ①), a second surface 5902 facing an opposite direction to the first surface 5901, and conductive layers and insulating layers 591 disposed alternately in a space between the first surface 5901 and the second surface 5902. According to one embodiment, the substrate 590 may include a ground plane 592 disposed on at least one insulating layer 591 . According to an embodiment, the substrate 590 may include a plurality of plates 593 formed of a conductive material included in the conductive layers, disposed between the ground layer 592 and the first surface 5901 so as to overlap different insulating layers when the first surface 5901 is viewed from above. According to one embodiment, the plurality of plates 593 may include a first plate 5931 , a second plate 5932 , and/or a third plate 5933 sequentially stacked from the first surface 5901 . According to one embodiment, the plates 593 may include loop-shaped openings 5931a, 5932a, and 5933a. According to one embodiment, the plates 593 and the openings 5931a, 5932a, and 5933a may be arranged to overlap when viewing the first surface 5901 from above. According to one embodiment, the plates 593 may be electrically connected to the ground layer 592 through a plurality of conductive vias CV disposed in a manner penetrating the plates 593 . According to one embodiment, when looking at the first surface 5901 from above, the substrate 590 may include a shielding space S formed through the openings 5931a, 5932a, and 5933a of the plates 593 and the ground layer 592.
다양한 실시예에 따르면, 기판(590)은 차폐 공간(S)내에 배치된 제1급전부(510)를 포함할 수 있다. 한 실시예에 따르면, 제1급전부(510)는 그라운드 층(592)을 관통하고, 배선 구조(5101)를 통해 제2면(5902)에 배치된 무선 통신 회로(595)와 전기적으로 연결된 급전 비아(5111) 및 급전 비아(5111)와 수직한 방향으로, 지정된 길이로 연장되거나 접촉된 급전 라인(5112)을 포함할 수 있다. 어떤 실시예에서, 급전 라인(5112)은 생략될 수도 있다. 따라서, 차폐 공간(S)은 제1급전부(510)를 통해 형성된 전파가 기판(590)을 타고 외부로 나가는 현상을 감소시킬 수 있다. 예컨대, 차폐 공간(S)은 제1급전부(510)로부터 형성된 전파를 전달하기 위한 SIW(substrate integrated waveguide) 구조를 포함할 수 있다. 일 실시예에 따르면, 급전 라인(5112)은 제1플레이트(5931)가 형성하는 도전층에 형성될 수 있다.According to various embodiments, the substrate 590 may include a first feeding unit 510 disposed within the shielding space (S). According to one embodiment, the first power supply unit 510 may include a power supply via 5111 penetrating the ground layer 592 and electrically connected to the wireless communication circuit 595 disposed on the second surface 5902 through the wiring structure 5101, and a power supply line 5112 extending or contacting a predetermined length in a direction perpendicular to the power supply via 5111. In some embodiments, feed line 5112 may be omitted. Accordingly, the shielding space S can reduce a phenomenon in which radio waves generated through the first power feeding unit 510 travel to the outside along the substrate 590 . For example, the shielded space S may include a substrate integrated waveguide (SIW) structure for transmitting radio waves formed from the first power feeding unit 510 . According to an embodiment, the power supply line 5112 may be formed on a conductive layer formed by the first plate 5931.
다양한 실시예에 따르면, 기판(590)은 제1면(5901)이 측면 부재(620)의 내면(621)에 접촉되는 방식으로 배치될 수 있다. 이러한 경우, 측면 부재(620)를 외부에서 바라볼 때, 제1관통홀(6231)은 차폐 공간(S)과 대응하도록 배치될 수 있다. 예컨대, 측면 부재(620)를 외부에서 바라볼 때, 제1관통홀(6231)의 적어도 일부는 차폐 공간(S)과 중첩될 수 있다. 어떤 실시예에서, 제1관통홀(6231)과 차폐 공간(S)은 실질적으로 동일한 크기의 횡단면을 갖거나 서로 다른 크기의 횡단면을 갖도록 형성될 수 있다. 예컨대, 제1관통홀(6231)의 횡단면은 차폐 공간(S)의 횡단면보다 크거나 작을 수 있다. 한 실시예에 따르면, 측면 부재(620)를 외부에서 바라볼 때 차폐 공간(S)내에 배치된 제1급전부(510)는 제1관통홀(6231)과 중첩되도록 배치될 수 있다. 어떤 실시예에서, 기판(590)은 제1면(5901)이 측면 부재(620)의 내면(621)과 지정된 이격 거리를 갖도록 배치될 수도 있다. 한 실시예에 따르면, 제1관통홀(6231)은 지정된 유전율을 갖는 유전체(예: 유전율 3 이상의 유전체 또는 유전율 20 이상의 고유전체)로 채워질 수 있다. 한 실시예에 따르면, 제1급전부(510)를 통해 방사된 전파는 기판(590)의 차폐 공간(S)(예: 도파 공간)에 의해 외부로 누설되지 않고 제1관통홀(6231)로 전달되고, 유전체(620c)를 공진기로 사용하여 지정된 주파수 대역에서 무선 신호를 송신 또는 수신하도록 외부로 방사될 수 있다.According to various embodiments, the substrate 590 may be disposed in such a way that the first surface 5901 contacts the inner surface 621 of the side member 620 . In this case, when looking at the side member 620 from the outside, the first through hole 6231 may be disposed to correspond to the shielding space (S). For example, when viewing the side member 620 from the outside, at least a portion of the first through hole 6231 may overlap the shielding space S. In some embodiments, the first through hole 6231 and the shielding space S may have cross sections of substantially the same size or cross sections of different sizes. For example, the cross section of the first through hole 6231 may be larger or smaller than the cross section of the shielding space (S). According to one embodiment, when looking at the side member 620 from the outside, the first feeding part 510 disposed in the shielding space S may be disposed to overlap with the first through hole 6231 . In some embodiments, the substrate 590 may be disposed so that the first surface 5901 has a specified separation distance from the inner surface 621 of the side member 620 . According to one embodiment, the first through hole 6231 may be filled with a dielectric having a specified permittivity (eg, a dielectric having a permittivity of 3 or more or a dielectric having a permittivity of 20 or more). According to one embodiment, radio waves radiated through the first feeder 510 are transmitted to the first through hole 6231 without being leaked to the outside by the shielding space S (eg, the waveguide space) of the substrate 590, and may be radiated to the outside to transmit or receive radio signals in a designated frequency band using the dielectric 620c as a resonator.
본 개시의 예시적인 실시예에 따른 안테나 구조체(500)는 측면 부재(620)의 관통홀들(예: 도 4의 관통홀들(6231, 6232, 6233, 6234, 6235))에 채워진 유전체(620c)를 공진기로 사용하기 때문에 기판(590)에 도전성 패치가 배치되고, 관통홀에 채워진 사출물을 통과하도록 구성된 비교예(예: 메탈 투과형 안테나)보다 방사 손실이 적을 수 있다. 또한, 안테나 구조체(500)는 기판(590)에 안테나 엘리먼트(예: 도전성 패치)가 배치되지 않고, 별도의 추가 공정 없이 간단히 급전부만 형성되기 때문에 효율적인 기판 설계가 가능할 수 있다. 또한, 안테나 구조체(500)는 관통홀들(예: 도 4의 관통홀들(6231, 6232, 6233, 6234, 6235))을 제외한 나머지 5개 면이 금속면으로 구성된 E-wall 특성을 사용하기 때문에 기존의 전자 장치에서 사출물(예: 비도전성 부재)로 사용되는 약 3.3 ~ 7 정도의 낮은 유전체(620c)(예: 사출물)을 사용해도 원하는 공진 특성이 형성될 수 있다. 또한, 유전체(620c)를 지지하는 금속 지지 구조가 도전성 측면 부재(620)에 형성될 관통홀들(예: 도 4의 관통홀들(6231, 6232, 6233, 6234, 6235))을 통해 구현되기 때문에 유전체(620c)를 위한 추가 지지 구조가 요구되지 않음으로써, 전자 장치의 슬림화에 도움을 줄 수 있다.Since the antenna structure 500 according to an exemplary embodiment of the present disclosure uses the dielectric 620c filled in the through-holes of the side member 620 (eg, the through- holes 6231, 6232, 6233, 6234, and 6235 of FIG. 4 ) as a resonator, a conductive patch is disposed on the substrate 590 and radiation loss is greater than that of a comparative example (eg, a metal transmissive antenna) configured to pass injection-molded materials filled in the through-holes. this can be written In addition, since the antenna structure 500 does not have an antenna element (eg, a conductive patch) disposed on the substrate 590 and only a power supply portion is formed without a separate additional process, an efficient substrate design may be possible. In addition, since the antenna structure 500 uses an E-wall characteristic in which five surfaces except through holes (eg, through holes 6231, 6232, 6233, 6234, and 6235 in FIG. 4) are made of metal surfaces, even if a dielectric 620c (eg, an injection-molded material) having a low dielectric strength of about 3.3 to 7 used as an injection-molded material (eg, a non-conductive member) in an existing electronic device is used, a desired ball is used. A true characteristic can be formed. In addition, since the metal support structure supporting the dielectric 620c is implemented through through-holes (eg, through- holes 6231, 6232, 6233, 6234, and 6235 of FIG. 4) to be formed in the conductive side member 620, an additional support structure for the dielectric 620c is not required, which can help slim down the electronic device.
도 6은 본 개시의 다양한 실시예에 따른 도 5a의 기판을 포함하는 안테나 구조체와 비교예의 방사 성능을 비교한 그래프이다. 6 is a graph comparing radiation performance of an antenna structure including the substrate of FIG. 5A according to various embodiments of the present disclosure and a comparative example.
도 6을 참고하면, 유전체 없이, 급전부(510)만이 배치된 안테나 구조체의 비교예는 방사 특성이 발현되지 않았으나(601 그래프), 측면 부재(620)에 형성된 관통홀(6231)에 채워진 유전체(620c)를 이용할 경우(602 그래프), 지정된 주파수 대역(603 영역)(예: 약 28GHz 대역)에서 -10dB 이하의 안테나 특성(예: 반사 손실)이 발현됨을 확인할 수 있다. 이는 급전부(510)와 대응하도록 배치된 유전체(620c)가 공진기로 사용될 경우 지정된 주파수 대역에서 원활히 안테나로 동작되는 것을 의미할 수 있다.Referring to FIG. 6, in the comparative example of the antenna structure in which only the power supply unit 510 is disposed without the dielectric, the radiation characteristics are not expressed (graph 601), but when the dielectric 620c filled in the through hole 6231 formed in the side member 620 is used (graph 602), it can be confirmed that the antenna characteristic (eg, return loss) of -10 dB or less is expressed in the designated frequency band (region 603) (eg, about 28 GHz band). This may mean that when the dielectric 620c arranged to correspond to the feeder 510 is used as a resonator, it can be smoothly operated as an antenna in a designated frequency band.
도 7a는 본 개시의 다양한 실시예에 따른 안테나 구조체를 포함하는 전자 장치의 분리 사시도이다. 도 7b는 본 개시의 다양한 실시예에 따른 도 7a의 결합 사시도이다. 도 8a는 본 개시의 다양한 실시예에 따른 안테나 구조체가 배치된 전자 장치의 구성도이다. 도 8b는 본 개시의 다양한 실시예에 따른 도 8a의 라인 8b-8b를 따라 바라본 전자 장치의 일부 단면도이다.7A is an exploded perspective view of an electronic device including an antenna structure according to various embodiments of the present disclosure. 7B is a combined perspective view of FIG. 7A according to various embodiments of the present disclosure. 8A is a configuration diagram of an electronic device in which an antenna structure according to various embodiments of the present disclosure is disposed. 8B is a partial cross-sectional view of an electronic device taken along line 8b-8b of FIG. 8A according to various embodiments of the present disclosure.
도 7a 내지 도 8b의 전자 장치(600)는 도 1의 전자 장치(101), 도 2a의 전자 장치(200) 및/또는 도 3c의 전자 장치(300)와 적어도 일부 유사하거나, 전자 장치의 다른 실시예들을 포함할 수 있다. 도 8a는 후면 커버(예: 도 8b의 후면 커버(380))가 제거된 상태에서, 전자 장치(600)의 후면을 바라본 평면도이다.The electronic device 600 of FIGS. 7A to 8B is at least partially similar to the electronic device 101 of FIG. 1 , the electronic device 200 of FIG. 2A , and/or the electronic device 300 of FIG. 3C , or may include other embodiments of the electronic device. FIG. 8A is a top plan view of the electronic device 600 viewed from the back with the rear cover (eg, the rear cover 380 of FIG. 8B ) removed.
도 7a 내지 도 8b를 참고하면, 전자 장치(600)(예: 도 1의 전자 장치(101), 도 2a의 전자 장치(200) 및/또는 도 3의 전자 장치(300))는, 전면 커버(320)(예: 도 2a의 전면 플레이트(202) 또는 도 3의 전면 커버(320))(예: 제1커버 또는 제1플레이트), 전면 커버(320)와 반대 방향으로 향하는 후면 커버(380)(예: 도 2a의 후면 플레이트(211) 또는 도 3의 후면 커버(380))(예: 제2커버 또는 제2플레이트) 및 전면 커버(320)와 후면 커버(330) 사이의 내부 공간(6001)을 둘러싸는 측면 부재(620)(예: 도 3a의 측면 베젤 구조(320) 또는 도 3c의 측면 부재(320))를 포함하는 하우징(610)(예: 도 3a의 하우징(310))(예: 하우징 구조)을 포함할 수 있다. 한 실시예에 따르면, 전자 장치(600)는 하우징(610)의 내부 공간(6001)에서, 전면 커버(320)의 적어도 일부를 통해 외부로부터 보일 수 있게 배치된 디스플레이(330)를 포함할 수 있다. 한 실시예에 따르면, 디스플레이(330)는 측면 부재(620)로부터 내부 공간(6001)로부터 연장된 지지 부재(6211)(예: 도 3c의 제1지지 부재(3211))를 통해 지지받도록 배치될 수 있다. 한 실시예에 따르면, 측면 부재(620)는 적어도 부분적으로 도전성 부재(620a)(예: 금속 소재) 및 도전성 부재(620a)와 결합된 비도전성 부재(620b)(예: 폴리머 소재)로 형성될 수 있다. 한 실시예에 따르면, 측면 부재(620)는 도전성 부재(620a)에 비도전성 부재(620b)가 사출되거나, 구조적으로 결합되는 방식으로 형성될 수 있다.Referring to FIGS. 7A to 8B , the electronic device 600 (eg, the electronic device 101 of FIG. 1 , the electronic device 200 of FIG. 2A , and/or the electronic device 300 of FIG. 3 ), the front cover 320 (eg, the front plate 202 of FIG. 2A or the front cover 320 of FIG. 3 ) (eg, the first cover or the first plate), and the opposite direction of the front cover 320 A housing 61 including a rear cover 380 (eg, the rear plate 211 of FIG. 2A or the rear cover 380 of FIG. 3) (eg, the second cover or the second plate) and a side member 620 (eg, the side bezel structure 320 of FIG. 3A or the side member 320 of FIG. 3C) surrounding the inner space 6001 between the front cover 320 and the rear cover 330. 0) (eg housing 310 of FIG. 3A) (eg housing structure). According to one embodiment, the electronic device 600 may include a display 330 arranged to be visible from the outside through at least a portion of the front cover 320 in the inner space 6001 of the housing 610 . According to one embodiment, the display 330 may be disposed to be supported through a support member 6211 (eg, the first support member 3211 of FIG. 3C ) extending from the inner space 6001 from the side member 620. According to an embodiment, the side member 620 may be at least partially formed of a conductive member 620a (eg, a metal material) and a non-conductive member 620b (eg, a polymer material) combined with the conductive member 620a. According to one embodiment, the side member 620 may be formed by injection molding or structural coupling of the non-conductive member 620b to the conductive member 620a.
다양한 실시예에 따르면, 측면 부재(620)는 제1길이를 갖는 제1측면(6201), 제1측면(6201)으로부터 수직한 방향으로 연장되고, 제1길이보다 긴 제2길이를 갖는 제2측면(6202), 제2측면(6202)으로부터 제1측면(6201)과 평행한 방향으로 연장되고, 제1길이를 갖는 제3측면(6203) 및 제3측면(6203)으로부터 제2측면(6202)과 평행한 방향으로 연장되고, 제2길이를 갖는 제4측면(6204)을 포함할 수 있다. According to various embodiments, the side member 620 includes a first side surface 6201 having a first length, a second side surface 6202 extending in a direction perpendicular to the first side surface 6201 and having a second length longer than the first length, and a third side surface 6203 extending in a direction parallel to the first side surface 6201 from the second side surface 6202 and having a first length, and a third side surface 620. 3) may include a fourth side surface 6204 extending in a direction parallel to the second side surface 6202 and having a second length.
다양한 실시예에 따르면, 전자 장치(600)는 안테나 구조체(500)를 포함할 수 있다. 한 실시예에 따르면, 안테나 구조체(500)는 측면 부재(620)의 적어도 일부에 고정되고, 복수의 급전부들(FA)(예: 도 4의 복수의 급전부들(510, 520, 530, 540, 550))을 포함하는 기판(590) 및 복수의 급전부들(FA)과 대응하고, 측면 부재(620)에 형성된 복수의 관통홀들(6231, 6232, 6233, 6234, 6235)(예: TA)에 채워진 지정된 유전율을 갖는 유전체(620c)를 포함할 수 있다. 한 실시예에 따르면, 안테나 구조체(500)는 제2측면(6202)이 향하는 방향(예: x 축 방향) 및/또는 후면 커버(380)가 향하는 방향(예: -z 축 방향)으로 방향성 빔이 형성되도록 배치될 수 있다. 한 실시예에 따르면, 안테나 구조체(500)는 지지 브라켓(550)(예: 도전성 지지 브라켓)을 통해, 측면 부재(620)의 적어도 일부(예: 지지 부재(6211))에 고정될 수 있다. 한 실시예에 따르면, 전자 장치(600)는 측면 부재(620)의 복수의 관통홀들(6231, 6232, 6233, 6234, 6235)을 커버하도록 배치된 커버 부재(620d)를 더 포함할 수 있다. 예를 들어, 측면 부재(620)는 커버 부재(620d)에 대응하는 리세스를 포함할 수 있다. 예컨대, 커버 부재(620d)가 리세스에 장착되면, 커버 부재(620d)의 외면과 측면 부재(620)의 외면은 일치할 수 있다. 한 실시예에 따르면, 커버 부재(620d)는 복수의 관통홀들(6231, 6232, 6233, 6234, 6235) 및 복수의 관통홀들(6231, 6232, 6233, 6234, 6235)에 채워진 유전체(620c)가 외부로부터 보이지 않도록 커버할 수 있다. 예컨대, 커버 부재(620d)는 장식 부재로 적용될 수 있다. 한 실시예에 따르면, 커버 부재(620d)는 유전체(620c)와 실질적으로 동일한 유전율을 갖는 소재로 형성될 수 있다. 어떤 실시예에서, 커버 부재(620d)는 유전체(620c)와 다른 유전율(예: 더 큰 유전율)을 갖는 유전체로 형성될 수도 있다. 어떤 실시예에서, 커버 부재(620d)는 생략되고, 복수의 관통홀들(6231, 6232, 6233, 6234, 6235) 및 유전체(620c)는 측면 부재(620)의 외면에 적용된 도료를 통해 외부에서 보이지 않도록 가려질 수도 있다. 한 실시예에 따르면, 안테나 구조체(500)는 유전체(620c)를 공진기로 활용하는 DRA로 동작할 수 있다. 한 실시예에 따르면, 기판(590)은 전자 장치(600)의 내부 공간(6001)에 배치된 장치 기판(630)(예: 메인 기판 또는 PCB(printed circuit board))과 전기적 연결 부재(예: FRC, flexible RF cable)를 통해 연결될 수 있다. According to various embodiments, the electronic device 600 may include the antenna structure 500 . According to one embodiment, the antenna structure 500 is fixed to at least a portion of the side member 620, and corresponds to a substrate 590 including a plurality of power feeding units FA (eg, the plurality of power feeding units 510, 520, 530, 540, and 550 of FIG. 4) and a plurality of through holes 6231 and 62 formed in the side member 620. 32, 6233, 6234, 6235) (eg, TA) may include a dielectric 620c having a specified permittivity. According to one embodiment, the antenna structure 500 has a directional beam in a direction toward which the second side surface 6202 is directed (eg, an x-axis direction) and/or a direction toward which the rear cover 380 is directed (eg, a -z-axis direction). It can be arranged so that a beam is formed. According to one embodiment, the antenna structure 500 may be fixed to at least a portion (eg, the support member 6211) of the side member 620 through the support bracket 550 (eg, the conductive support bracket). According to an embodiment, the electronic device 600 may further include a cover member 620d disposed to cover the plurality of through holes 6231 , 6232 , 6233 , 6234 , and 6235 of the side member 620 . For example, the side member 620 may include a recess corresponding to the cover member 620d. For example, when the cover member 620d is mounted in the recess, the outer surface of the cover member 620d and the outer surface of the side member 620 may coincide. According to one embodiment, the cover member 620d may cover the plurality of through holes 6231, 6232, 6233, 6234, and 6235 and the dielectric material 620c filled in the plurality of through holes 6231, 6232, 6233, 6234, and 6235 from being visible from the outside. For example, the cover member 620d may be applied as a decorative member. According to one embodiment, the cover member 620d may be formed of a material having substantially the same permittivity as the dielectric 620c. In some embodiments, the cover member 620d may be formed of a dielectric having a permittivity different from that of the dielectric 620c (eg, greater permittivity). In some embodiments, the cover member 620d may be omitted, and the plurality of through holes 6231, 6232, 6233, 6234, and 6235 and the dielectric 620c may be covered so as not to be visible from the outside through a paint applied to the outer surface of the side member 620. According to one embodiment, the antenna structure 500 may operate as a DRA using the dielectric material 620c as a resonator. According to one embodiment, the substrate 590 may be connected to a device substrate 630 (eg, a main substrate or a printed circuit board (PCB)) disposed in the internal space 6001 of the electronic device 600 and an electrical connection member (eg, FRC, flexible RF cable).
다양한 실시예에 따르면, 장치 기판(630)은 적어도 하나의 무선 통신 회로(예: 도 1의 무선 통신 모듈(192))포함할 수도 있다. 한 실시예에 따르면, 장치 기판(630)은 전기적 연결 부재(560)(예: FRC, flexible RF cable)를 통해 안테나 구조체(500)의 기판(590)과 전기적으로 연결될 수 있다. 한 실시예에 따르면, 전자 장치(600)는 장치 기판(630) 근처에 배치되거나, 장치 기판(630)과 적어도 부분적으로 중첩 배치된 배터리(B)를 포함할 수 있다.According to various embodiments, the device substrate 630 may include at least one wireless communication circuit (eg, the wireless communication module 192 of FIG. 1 ). According to one embodiment, the device substrate 630 may be electrically connected to the substrate 590 of the antenna structure 500 through an electrical connection member 560 (eg, FRC, flexible RF cable). According to one embodiment, the electronic device 600 may include a battery B disposed near the device substrate 630 or disposed at least partially overlapping the device substrate 630 .
다양한 실시예에 따르면, 안테나 구조체(500)는 측면 부재(620)의 대응 위치에 형성된 복수의 관통홀들(6231, 6232, 6233, 6234, 6235)에 채워진 유전체(620c)를 공진기로 사용하여, 제2측면(6202)이 향하는 방향(① 방향)(예: x 축 방향)으로 방향성 빔이 형성되도록 설정될 수 있다. 한 실시예에 따르면, 복수의 관통홀들(6231, 6232, 6233, 6234, 6235)은 측면 부재(620)의 내면(621)으로부터 외면(622)까지 관통되는 방식으로 형성될 수 있다. 한 실시예에 따르면, 측면 부재를 외부에서 바라볼 때, 복수의 관통홀들(6231, 6232, 6233, 6234, 6235) 각각의 중심간의 간격은 복수의 급전부들(6231, 6232, 6233, 6234, 6235) 각각의 간격과 실질적으로 동일하게 형성될 수 있다. 한 실시예에 따르면, 복수의 관통홀들(6231, 6232, 6233, 6234, 6235)은 측면 부재(620)의 내면(621)으로부터 외면(622)까지 동일한 횡단면을 갖도록 형성될 수 있다. 어떤 실시예에서, 복수의 관통홀들(6231, 6232, 6233, 6234, 6235)은 내면(621)으로부터 외면(622)으로 진행될수록 점진적으로 넓어지도록 형성될 수도 있다. 어떤 실시예에서, 복수의 관통홀들(6231, 6232, 6233, 6234, 6235) 각각은 서로 다른 기울기를 갖도록 형성될 수도 있다. 예컨대, 복수의 관통홀들(6231, 6232, 6233, 6234, 6235) 각각은 기판(590)의 중앙을 기준으로 좌우로 향할수록 기판(590)과의 각도가 작아지는 방식으로 형성될 수도 있다.According to various embodiments, the antenna structure 500 may be set to form a directional beam in a direction (① direction) (e.g., an x-axis direction) toward which the second side surface 6202 is directed by using a dielectric material 620c filled in a plurality of through holes 6231, 6232, 6233, 6234, and 6235 formed at corresponding positions of the side member 620 as a resonator. According to one embodiment, the plurality of through holes 6231 , 6232 , 6233 , 6234 , and 6235 may be formed in such a way that they penetrate from the inner surface 621 to the outer surface 622 of the side member 620 . According to one embodiment, when looking at the side member from the outside, the plurality of through holes (6231, 6232, 6233, 6234, 6235) the distance between the respective centers of the plurality of feeding parts (6231, 6232, 6233, 6234, 6235) It may be formed substantially the same as the respective distance. According to one embodiment, the plurality of through holes 6231 , 6232 , 6233 , 6234 , and 6235 may be formed to have the same cross section from the inner surface 621 to the outer surface 622 of the side member 620 . In some embodiments, the plurality of through holes 6231 , 6232 , 6233 , 6234 , and 6235 may be formed to gradually widen as they progress from the inner surface 621 to the outer surface 622 . In some embodiments, each of the plurality of through holes 6231 , 6232 , 6233 , 6234 , and 6235 may have different inclinations. For example, each of the plurality of through- holes 6231 , 6232 , 6233 , 6234 , and 6235 may be formed in such a way that the angle with respect to the substrate 590 decreases as it moves left and right with respect to the center of the substrate 590 .
도 9a는 본 개시의 다양한 실시예에 따른 도 4의 안테나 구조체의 방사 성능을 나타낸 그래프이다.9A is a graph illustrating radiation performance of the antenna structure of FIG. 4 according to various embodiments of the present disclosure.
도 9a를 참고하면, 복수의 급전부들(510, 520, 530, 540, 550) 및 급전부들과 대응하도록 측면 부재(620)에 형성된 복수의 관통홀들(6231, 6232, 6233, 6234, 6235)에 채워진 유전체(620c)를 공진기로 사용하는 안테나 구조체(500)는 제1주파수 대역(901 영역)(예: 약 28GHz 대역) 및 제2주파수 대역(902 영역)(예: 약 39GHz 대역)에서 원활히 동작함을 알 수 있다. 예컨대, 안테나 구조체(500)는 약 28GHz 대역에서 TE101 모드(transverse electric 101 mode) 공진이 확인되었으며, 약 39GHz 대역에서 TE111 모드(transverse electric 111 mode) 공진이 확인되었다.Referring to FIG. 9A , an antenna structure 500 using, as a resonator, a dielectric material 620c filled in a plurality of power feeding units 510, 520, 530, 540, and 550 and a plurality of through- holes 6231, 6232, 6233, 6234, and 6235 formed in a side member 620 to correspond to the power feeding units is a first frequency band 901 area) (eg, about 28 GHz band) and the second frequency band (902 area) (eg, about 39 GHz band). For example, the antenna structure 500 has a TE101 mode (transverse electric 101 mode) resonance confirmed in a band of about 28 GHz, and a transverse electric 111 mode (TE111 mode) resonance has been confirmed in a band of about 39 GHz.
도 9b는 본 개시의 다양한 실시예에 따른 도 4의 안테나 구조체와 비교예의 방사 성능을 비교한 그래프이다.9B is a graph comparing radiation performance of the antenna structure of FIG. 4 according to various embodiments of the present disclosure and a comparative example.
도 9b를 참고하면, 복수의 급전부들(510, 520, 530, 540, 550) 및 급전부들과 대응하도록 측면 부재(620)에 형성된 복수의 관통홀들(6231, 6232, 6233, 6234, 6235)에 채워진 유전체(620c)를 공진기로 사용하는 안테나 구조체(500)(예: DRA)는 제1주파수 대역(예: 약 28GHz 대역)(903 영역)에서, 기판에 안테나 엘리먼트들(예: 도전성 패치들)이 배치된 안테나 구조체(예: 비교예) 보다 약 1~2dB의 이득이 향상되는 것을 확인할 수 있으며, 제2주파수 대역(예: 약 39GHz대역)(904 영역)에서는, 본 개시의 안테나 구조체(500)만이 안테나 특성이 발현됨을 확인할 수 있다.Referring to FIG. 9B , an antenna structure 500 (eg, DRA) using a plurality of power feeding units 510, 520, 530, 540, and 550 and a dielectric material 620c filled in a plurality of through holes 6231, 6232, 6233, 6234, and 6235 formed in the side member 620 to correspond to the power feeding units as a resonator is a first antenna structure 500 (eg, DRA). In the frequency band (eg, about 28 GHz band) (region 903), it can be confirmed that the gain of about 1 to 2 dB is improved compared to the antenna structure (eg, comparative example) in which antenna elements (eg, conductive patches) are disposed on the substrate. In the second frequency band (eg, about 39 GHz band) (region 904), it can be seen that only the antenna structure 500 of the present disclosure exhibits antenna characteristics.
도 10a 및 도 10b는 본 개시의 다양한 실시예에 따른 도 4의 안테나 구조체와 비교예의 전류 분포를 비교한 그래프들이다.10A and 10B are graphs comparing current distributions of the antenna structure of FIG. 4 according to various embodiments of the present disclosure and a comparative example.
도시된 바와 같이, 도 10b의 유전체(620c)를 공진기로 활용한 본 개시의 안테나 구조체(500)를 통해 형성된 전류 분포(1002 영역)가 도 10a의 비교예의 안테나 구조체를 통해 형성된 전류 분포(1001 영역)보다 향상되었음을 알 수 있다. As shown, the current distribution (area 1002) formed through the antenna structure 500 of the present disclosure using the dielectric 620c of FIG. 10B as a resonator is improved than the current distribution (area 1001) formed through the antenna structure of the comparative example of FIG. 10A.
도 11은 본 개시의 다양한 실시예에 따른 안테나 구조체와 비교예의 방사 성능을 비교한 그래프이다. 11 is a graph comparing radiation performance of an antenna structure according to various embodiments of the present disclosure and a comparative example.
도 11를 참고하면, 복수의 급전부들(510, 520, 530, 540, 550) 및 급전부들과 대응하도록 측면 부재(620)에 형성된 복수의 관통홀들(6231, 6232, 6233, 6234, 6235)에 채워진 유전체(620c)를 공진기로 사용하는 안테나 구조체(500)(예: DRA)의 방사 성능은 CDF(cumulative distribution function, 누적 분포 함수) 50% 구간(1103 영역)에서, 약 6dB의 이득이 발현되는 반면(1102 그래프), 기판에 안테나 엘리먼트들(예: 도전성 패치들)이 배치된 안테나 구조체(예: 비교예)의 방사 성능은 약 4dB의 이득이 발현됨으로써, 실질적으로 약 2dB의 이득이 향상됨을 알 수 있다.Referring to FIG. 11 , radiation performance of an antenna structure 500 (eg, DRA) using a plurality of power feeding units 510, 520, 530, 540, and 550 and a dielectric material 620c filled in a plurality of through holes 6231, 6232, 6233, 6234, and 6235 formed in a side member 620 to correspond to the power feeding units as a resonator. In the 50% section (area 1103) of the cumulative distribution function (CDF), a gain of about 6 dB is expressed (graph 1102), while antenna elements (eg, conductive patches) are disposed on the substrate. The radiation performance of the antenna structure (eg, comparative example) exhibits a gain of about 4 dB, so that a gain of about 2 dB is substantially improved.
도 12는 본 개시의 다양한 실시예에 따른 유전체의 유전율에 따른 관통홀들의 크기 변화를 나타낸 도면이다.12 is a diagram illustrating a change in size of through-holes according to a permittivity of a dielectric according to various embodiments of the present disclosure.
도 12의 (a)에서, 전자 장치(600)는 측면 부재(620)에 형성된 제1복수의 관통홀들(6241, 6242, 6243, 6244, 6245)을 포함하는 제1관통홀 어레이(TA1)(a first through hole array)를 포함할 수 있다. 한 실시예에 따르면, 제1복수의 관통홀들(6241, 6242, 6243, 6244, 6245)은 제1유전율을 갖는 유전체(620c-1)로 채워질 수 있다. 한 실시예에 따르면, 도 12의 (b)에서, 전자 장치(600)는 측면 부재(620)에 형성된 제2복수의 관통홀들(6251, 6252, 6253, 6254, 6255)을 포함하는 제2관통홀 어레이(TA2)(a second through hole array)를 포함할 수 있다. 한 실시예에 따르면, 제2복수의 관통홀들(6251, 6252, 6253, 6254, 6255)은 제1유전율 보다 높은 제2유전율을 갖는 유전체(620c-2)로 채워질 수 있다. In (a) of FIG. 12 , the electronic device 600 may include a first through hole array (TA1) including first plurality of through holes 6241, 6242, 6243, 6244, and 6245 formed in the side member 620. According to one embodiment, the first plurality of through- holes 6241 , 6242 , 6243 , 6244 , and 6245 may be filled with a dielectric material 620c - 1 having a first permittivity. According to one embodiment, in (b) of FIG. 12 , the electronic device 600 may include a second through hole array (TA2) including a plurality of second through holes 6251, 6252, 6253, 6254, and 6255 formed in the side member 620. According to one embodiment, the plurality of second through- holes 6251, 6252, 6253, 6254, and 6255 may be filled with a dielectric material 620c-2 having a second permittivity higher than the first permittivity.
다양한 실시예에 따르면, 안테나 구조체(예: 도 4의 안테나 구조체(500))가 동일한 방사 성능이 발현되는 조건 하에, 유전체의 유전율에 따라 복수의 관통홀들의 크기가 조절될 수 있다. 예컨대, 제1유전율이 3.3인 유전체(620c-1)가 적용될 경우, 제1복수의 관통홀들(6241, 6242, 6243, 6244, 6245) 각각은 약 4.2mm×4.2mm의 크기를 갖는 사각형 단면을 가질 수 있으나, 제2유전율이 7인 유전체(620c-2)가 적용될 경우, 제2복수의 관통홀들(6251, 6252, 6253, 6254, 6255)은 3.4mm×3.4mm의 상대적으로 작은 크기를 갖는 사각형 단면으로 형성될 수 있다. 이는 안테나 구조체(예: 도 4의 안테나 구조체(500))가 실질적으로 동일한 방사 성능이 구현되더라도, 고유전율을 갖는 유전체를 적용하고, 복수의 관통홀들의 크기를 줄임으로써 전자 장치(600)의 강성 보강에 도움을 줄 수 있음을 의미할 수 있다.According to various embodiments, the size of the plurality of through holes may be adjusted according to the permittivity of the dielectric under the condition that the antenna structure (eg, the antenna structure 500 of FIG. 4 ) exhibits the same radiation performance. For example, when the dielectric 620c-1 having a first permittivity of 3.3 is applied, each of the first plurality of through holes 6241, 6242, 6243, 6244, and 6245 may have a rectangular cross-section having a size of about 4.2 mm × 4.2 mm. 6252, 6253, 6254, and 6255) may be formed into a rectangular cross section having a relatively small size of 3.4 mm x 3.4 mm. This may mean that even if the antenna structure (e.g., the antenna structure 500 of FIG. 4) has substantially the same radiation performance, it is possible to help reinforce the rigidity of the electronic device 600 by applying a dielectric having a high permittivity and reducing the size of a plurality of through holes.
도 13a 내지 도 13c는 본 개시의 다양한 실시예에 따른 안테나 구조체들을 도시한 도면들이다.13A to 13C are diagrams illustrating antenna structures according to various embodiments of the present disclosure.
도 13a를 참고하면, 전자 장치(예: 도 8a의 전자 장치(600))는 도전성 부재(620a)로 형성되고, 복수의 관통홀들(6261, 6262, 6263, 6264, 6265)를 포함하는 측면 부재(620)를 포함할 수 있다. 한 실시예에 따르면, 안테나 구조체(500-1)는 전자 장치(예: 도 8a의 전자 장치(600))의 내부 공간(예: 도 8a의 내부 공간(6001))에서 복수의 관통홀들(6261, 6262, 6263, 6264, 6265)과 대응되도록 배치된 복수의 급전부들(510, 520, 530, 540, 550)을 포함하는 기판(590) 및 복수의 관통홀들(6261, 6262, 6263, 6264, 6265)에 채워지는 지정된 유전율을 갖는 유전체(620c)를 포함할 수 있다. 한 실시예에 따르면, 기판(590)은 제1면(5901), 제1면(5901)과 반대 방향을 향하는 제2면(5902)을 포함하고, 기판(590)에 배치된 복수의 급전부들(510, 520, 530, 540, 550) 각각이 복수의 관통홀들(6261, 6262, 6263, 6264, 6265) 각각에 대응하도록 제1면(5901)이 측면 부재(620)의 내면(621)과 대면(접촉)하거나 근접한 위치에 배치될 수 있다. Referring to FIG. 13A , an electronic device (eg, the electronic device 600 of FIG. 8A ) may include a side member 620 formed of a conductive member 620a and including a plurality of through holes 6261, 6262, 6263, 6264, and 6265. According to an embodiment, the antenna structure 500-1 includes a plurality of power feeding units 510, 520, 530, 540, 520, 530, and 540 arranged to correspond to the plurality of through holes 6261, 6262, 6263, 6264, and 6265 in an internal space (eg, the internal space 6001 of FIG. 8A) of an electronic device (eg, the electronic device 600 of FIG. 8A). 550) and a plurality of through- holes 6261, 6262, 6263, 6264, and 6265 filled with a dielectric 620c having a specified permittivity. According to one embodiment, the substrate 590 includes a first surface 5901 and a second surface 5902 facing the opposite direction to the first surface 5901, and each of the plurality of power feeding units 510, 520, 530, 540, and 550 disposed on the substrate 590 has a plurality of through holes 6261, 6262, 6263, 6264, 6265), the first surface 5901 may face (contact with) or be disposed close to the inner surface 621 of the side member 620, respectively.
다양한 실시예에 따르면, 복수의 급전부들(510, 520, 530, 540, 550) 중 제1급전부(510)는 복수의 관통홀들(6261, 6262, 6263, 6264, 6265) 중 제1관통홀(6261)과 대응되는 위치에 배치되고, 제2급전부(520)는 제2관통홀(6262)과 대응되는 위치에 배치되고, 제3급전부(530)는 제3관통홀(6263)과 대응되는 위치에 배치되고, 제4급전부(540)는 제4관통홀(6264)과 대응되는 위치에 배치되고, 제5급전부(550)는 제5관통홀(6265)과 대응하는 위치에 배치될 수 있다. According to various embodiments, the first feeder 510 among the plurality of feeders 510, 520, 530, 540, and 550 is disposed at a position corresponding to the first through-hole 6261 among the plurality of through- holes 6261, 6262, 6263, 6264, and 6265, and the second feeder 520 has a second through-hole 6 262), the third feeder 530 is disposed at a position corresponding to the third through hole 6263, the fourth feeder 540 is disposed at a position corresponding to the fourth through hole 6264, and the fifth feeder 550 may be disposed at a position corresponding to the fifth through hole 6265.
다양한 실시예에 따르면, 복수의 관통홀들(6261, 6262, 6263, 6264, 6265)은 복수의 관통홀들(6261, 6262, 6263, 6264, 6265)이 형성하는 어레이의 중심과 대응하는 관통홀(예: 제3관통홀(6263))을 기준으로 좌우로 멀어질수록 기판(590)과의 각도가 작아지는 방식으로(방사형 방식으로) 기울어지도록 형성될 수 있다. 이러한 경우, 안테나 구조체(500-1)는 복수의 관통홀들(6261, 6262, 6263, 6264, 6265)이 중심에서 좌우로 멀어질수록 점진적으로 기울어지는 복수의 관통홀들(6261, 6262, 6263, 6264, 6265)의 형상에 따라 방향성 빔의 빔 폭 확장에 도움을 받을 수 있다. According to various embodiments, the plurality of through- holes 6261 , 6262 , 6263 , 6264 , and 6265 have a smaller angle with the substrate 590 as the through- holes 6261 , 6262 , 6263 , 6264 , and 6265 move away from the left and right with respect to the center of the array formed by the through-holes 6264 and 6265 (eg, the third through-hole 6263 ). It may be formed to tilt in a losing (radial) manner. In this case, the antenna structure 500-1 has a plurality of through- holes 6261, 6262, 6263, 6264, and 6265 that gradually incline as the plurality of through- holes 6261, 6262, 6263, 6264, and 6265 are left and right from the center. Depending on the shape of the through- holes 6261, 6262, 6263, 6264, and 6265, the beam width expansion of the directional beam can be helped.
도 13b 및 도 13c를 설명함에 있어서, 도 13a와 실질적으로 동일한 구성 요소들에 대해서는 동일한 부호를 부여하였으며, 그 상세한 설명은 생략될 수 있다.In the description of FIGS. 13B and 13C , the same reference numerals are assigned to substantially the same elements as those of FIG. 13A , and detailed descriptions thereof may be omitted.
도 13b를 참고하면, 측면 부재(620)는 복수의 급전부들(510, 520, 530, 540, 540, 550) 각각과 대응하도록 배치된 복수의 관통홀들(6271, 6272, 6273, 6274, 6275)을 포함할 수 있다. 한 실시예에 따르면, 안테나 구조체(500-2)는 복수의 급전부들(510, 520, 530, 540, 540, 550)을 포함하는 기판(590) 및 복수의 관통홀들(6271, 6272, 6273, 6274, 6275)에 채워진 유전체(620c)를 포함할 수 있다. 한 실시예에 따르면, 복수의 관통홀들(6271, 6272, 6273, 6274, 6275)은 측면 부재(620)의 내면(621)으로부터 외면(622)으로 진행할수록 점진적으로 폭이 넓어지도록 테이퍼지게(tappered) 형성될 수 있다.Referring to FIG. 13B , the side member 620 may include a plurality of through holes 6271, 6272, 6273, 6274, and 6275 arranged to correspond to the plurality of power feeding units 510, 520, 530, 540, 540, and 550, respectively. According to one embodiment, the antenna structure 500-2 may include a substrate 590 including a plurality of power feeding units 510, 520, 530, 540, 540, and 550, and a plurality of through holes 6271, 6272, 6273, 6274, and 6275. It may include a dielectric material 620c filled in. According to one embodiment, the plurality of through- holes 6271, 6272, 6273, 6274, and 6275 gradually increase in width from the inner surface 621 to the outer surface 622 of the side member 620. It may be formed to be tapered.
도 13c를 참고하면, 측면 부재(620)는 복수의 급전부들(510, 520, 530, 540, 540, 550) 각각과 대응하도록 배치된 복수의 관통홀들(6281, 6282, 6283, 6284, 6285)을 포함할 수 있다. 한 실시예에 따르면, 안테나 구조체(500-3)는 복수의 급전부들(510, 520, 530, 540, 540, 550)을 포함하는 기판(590) 및 복수의 관통홀들(6281, 6282, 6283, 6284, 6285)에 채워진 유전체(620c)를 포함할 수 있다. 한 실시예에 따르면, 측면 부재(620)는, 외면을 바라볼 때, 복수의 관통홀들(6281, 6282, 6283, 6284, 6285) 각각이 통합된 하나의 개구부(6286)를 포함할 수 있다. 한 실시예에 따르면, 유전체는 복수의 관통홀들(6281, 6282, 6283, 6284, 6285)로부터 연장되고, 개구부(6286)까지 채워지도록 구성될 수 있다.Referring to FIG. 13C , the side member 620 may include a plurality of through holes 6281, 6282, 6283, 6284, and 6285 arranged to correspond to the plurality of power feeding units 510, 520, 530, 540, 540, and 550, respectively. According to one embodiment, the antenna structure 500-3 may include a substrate 590 including a plurality of power feeding units 510, 520, 530, 540, 540, and 550, and a plurality of through holes 6281, 6282, 6283, 6284, and 6285. It may include a dielectric material 620c filled in. According to one embodiment, when looking at the outer surface, the side member 620 may include one opening 6286 in which each of the plurality of through holes 6281 , 6282 , 6283 , 6284 , and 6285 is integrated. According to one embodiment, the dielectric may be configured to extend from the plurality of through holes 6281 , 6282 , 6283 , 6284 , and 6285 and fill up to the opening 6286 .
다양한 실시예에 따르면, 전자 장치(예: 도 8a의 전자 장치(600))는 도전성 부재(예: 도 4의 도전성 부재(620a))를 통해 형성되고, 지정된 간격으로 이격된 복수의 관통홀들(예: 도 4의 복수의 관통홀들(6231, 6232, 6233, 6234, 6235))을 포함하는 측면 부재(예: 도 4의 측면 부재(620))를 포함하는 하우징(예: 도 4의 하우징(610))과, 상기 하우징에 배치된 안테나 구조체(예: 도 4의 안테나 구조체(500)로써, 상기 하우징의 내부 공간에서, 상기 복수의 관통홀들 각각과 대응하도록 배치된 복수의 급전부들(예: 도 4의 복수의 급전부들(510, 520, 530, 540, 550))을 포함하는 기판(예: 도 4의 기판(590)) 및 상기 복수의 관통홀들에 채워지는 지정된 유전율을 갖는 유전체(예: 도 4의 유전체(620c))를 포함하는 안테나 구조체 및 상기 내부 공간에서, 상기 복수의 급전부들과 전기적으로 연결되도록 배치되고, 상기 유전체를 통해 지정된 주파수 대역의 무선 신호를 송신 또는 수신하도록 설정된 무선 통신 회로(예: 도 4의 무선 통신 회로(595))를 포함할 수 있다.According to various embodiments, an electronic device (eg, the electronic device 600 of FIG. 8A ) is formed through a conductive member (eg, the conductive member 620a of FIG. 4 ) and includes a plurality of through-holes (eg, the plurality of through- holes 6231 , 6232 , 6233 , 6234 , and 6235 of FIG. 4 ) spaced apart at predetermined intervals (eg, the side member 620 of FIG. 4 ). )), a housing including a housing (eg, the housing 610 of FIG. 4 ), and an antenna structure disposed in the housing (eg, the antenna structure 500 of FIG. 4 , and a substrate including a plurality of feeding parts (eg, the plurality of feeding parts 510 , 520 , 530 , 540 , and 550 of FIG. 4 ) arranged to correspond to each of the plurality of through holes in the inner space of the housing) (eg, the substrate 5 of FIG. 4 ). 90)) and a dielectric having a designated permittivity filled in the plurality of through-holes (eg, the dielectric 620c of FIG. 4) and an antenna structure including a dielectric (eg, the dielectric 620c of FIG. 4) and a wireless communication circuit (eg, the wireless communication circuit 595 of FIG. 4) disposed to be electrically connected to the plurality of power feeders in the internal space and set to transmit or receive a radio signal of a designated frequency band through the dielectric.
다양한 실시예에 따르면, 상기 측면 부재는 상기 도전성 부재와 적어도 부분적으로 결합된 비도전성 부재를 더 포함할 수 있다.According to various embodiments, the side member may further include a non-conductive member at least partially coupled to the conductive member.
다양한 실시예에 따르면, 상기 비도전성 부재와 상기 유전체는 서로 다른 유전율을 가질 수 있다.According to various embodiments, the non-conductive member and the dielectric may have different dielectric constants.
다양한 실시예에 따르면, 상기 비도전성 부재는 상기 유전체와 실질적으로 동일한 소재로 형성될 수 있다.According to various embodiments, the non-conductive member may be formed of substantially the same material as the dielectric material.
다양한 실시예에 따르면, 상기 복수의 관통홀들의 크기는 상기 유전체의 유전율을 통해 결정될 수 있다.According to various embodiments, the size of the plurality of through holes may be determined based on the permittivity of the dielectric.
다양한 실시예에 따르면, 상기 기판은 상기 측면 부재를 향하는 제1면 및 상기 제1면과 반대 방향을 향하는 제2면을 포함하고, 상기 기판은 상기 제1면이 상기 측면 부재의 내면과 접촉하거나 근접하는 방식으로 배치될 수 있다.According to various embodiments, the substrate includes a first surface facing the side member and a second surface facing an opposite direction to the first surface, and the substrate may be disposed in such a way that the first surface contacts or approaches an inner surface of the side member.
다양한 실시예에 따르면, 상기 측면 부재를 외부에서 바라볼 때, 상기 복수의 급전부들 각각은, 상기 복수의 관통홀들 각각과 중첩되는 위치에 배치될 수 있다.According to various embodiments, when viewing the side member from the outside, each of the plurality of power feeding units may be disposed at a position overlapping each of the plurality of through holes.
다양한 실시예에 따르면, 상기 기판에서, 상기 기판의 그라운드층과 전기적으로 연결되고, 상기 복수의 급전부들 각각을 둘러싸도록 형성된 도전성 차폐 공간을 포함할 수 있다.According to various embodiments, the substrate may include a conductive shielding space electrically connected to a ground layer of the substrate and formed to surround each of the plurality of power feeding units.
다양한 실시예에 따르면, 상기 도전성 차폐 공간은, 상기 제1면과 상기 제2면 사이의 절연층에서 적층되는 방식으로 배치된 루프 형태의 복수의 플레이트들 및 상기 복수의 플레이트들을 관통하고, 상기 그라운드층에 전기적으로 연결된 복수의 도전성 비아들을 포함할 수 있다.According to various embodiments, the conductive shielding space may include a plurality of loop-shaped plates arranged in a stacked manner in an insulating layer between the first surface and the second surface, and a plurality of conductive vias penetrating the plurality of plates and electrically connected to the ground layer.
다양한 실시예에 따르면, 상기 측면 부재를 외부에서 바라볼 때, 상기 도전성 차폐 공간은 상기 복수의 관통홀들과 중첩되도록 배치될 수 있다.According to various embodiments, when viewing the side member from the outside, the conductive shielding space may be disposed to overlap the plurality of through holes.
다양한 실시예에 따르면, 상기 복수의 급전부들 각각은, 무선 신호를 송신 또는 수신하기 위한 제1편파 급전부 및 상기 무선 신호를 송신 또는 수신하고, 상기 제1편파와 수직하게 배치된 제2편파 급전부를 포함할 수 있다.According to various embodiments, each of the plurality of power feeders may include a first polarized wave feeder for transmitting or receiving a radio signal and a second polarized wave feeder for transmitting or receiving the radio signal and disposed perpendicular to the first polarized wave.
다양한 실시예에 따르면, 상기 복수의 급전부들 각각은 상기 기판의 두께 방향으로 배치된 급전 비아 및 상기 급전 비아와 수직한 방향으로 지정된 길이를 갖도록 연장 또는 접촉된 급전 라인을 포함할 수 있다.According to various embodiments, each of the plurality of power feeding units may include a power supply via disposed in a thickness direction of the substrate and a power supply line extending or contacting to have a designated length in a direction perpendicular to the power supply via.
다양한 실시예에 따르면, 상기 하우징은 전면 커버 및 전면 커버와 반대 방향으로 향하는 후면 커버를 포함하고, 상기 측면 부재는 상기 전면 커버와 상기 후면 커버 사이에 배치될 수 있다.According to various embodiments, the housing may include a front cover and a rear cover facing in an opposite direction to the front cover, and the side member may be disposed between the front cover and the rear cover.
다양한 실시예에 따르면, 상기 안테나 구조체는 상기 측면 부재가 향하는 외측 방향으로 방향성 빔을 형성하도록 배치될 수 있다.According to various embodiments, the antenna structure may be arranged to form a directional beam in an outward direction toward which the side member faces.
다양한 실시예에 따르면, 상기 내부 공간에서, 상기 전면 커버의 적어도 일부를 통해 외부로부터 보일 수 있게 배치된 디스플레이를 포함할 수 있다.According to various embodiments, a display disposed to be visible from the outside through at least a portion of the front cover may be included in the internal space.
다양한 실시예에 따르면, 상기 측면 부재의 외면에서, 상기 복수의 관통홀들을 커버하도록 배치된 커버 부재를 포함할 수 있다.According to various embodiments, a cover member disposed to cover the plurality of through holes may be included on an outer surface of the side member.
다양한 실시예에 따르면, 상기 커버 부재의 유전율은 상기 복수의 관통홀의 유전율과 실질적으로 동일할 수 있다.According to various embodiments, the dielectric constant of the cover member may be substantially the same as that of the plurality of through holes.
다양한 실시예에 따르면, 상기 커버 부재의 유전율은 상기 복수의 관통홀의 유전율보다 큰 유전율을 갖는 소재로 형성될 수 있다.According to various embodiments, the cover member may be formed of a material having a higher dielectric constant than that of the plurality of through holes.
다양한 실시예에 따르면, 상기 복수의 관통홀들은 상기 측면 부재의 내면으로부터 외면까지 관통되는 방식으로 형성되고, 상기 유전체는 사출되는 방식으로 상기 복수의 관통홀들에 채워질 수 있다.According to various embodiments, the plurality of through-holes may be formed in such a way as to penetrate from the inner surface to the outer surface of the side member, and the dielectric material may be injected into the plurality of through-holes.
다양한 실시예에 따르면, 상기 지정된 주파수 대역은 3GHz ~ 100GHz 범위의 주파수 대역을 포함할 수 있다.According to various embodiments, the designated frequency band may include a frequency band ranging from 3 GHz to 100 GHz.
그리고 본 명세서와 도면에 개시된 본 개시의 실시예들은 본 개시의 실시예에 따른 기술 내용을 쉽게 설명하고 본 개시의 실시예의 이해를 돕기 위해 특정 예를 제시한 것일 뿐이며, 본 개시의 실시예의 범위를 한정하고자 하는 것은 아니다. 따라서 본 개시의 다양한 실시예의 범위는 여기에 개시된 실시예들 이외에도 본 개시의 다양한 실시예의 기술적 사상을 바탕으로 도출되는 모든 변경 또는 변형된 형태가 본 개시의 다양한 실시예의 범위에 포함되는 것으로 해석되어야 한다.And the embodiments of the present disclosure disclosed in the present specification and drawings are only presented as specific examples to easily explain the technical content according to the embodiments of the present disclosure and help understanding of the embodiments of the present disclosure, It is not intended to limit the scope of the embodiments of the present disclosure. Therefore, the scope of various embodiments of the present disclosure should be construed as including all changes or modified forms derived based on the technical spirit of various embodiments of the present disclosure in addition to the embodiments disclosed herein are included in the scope of various embodiments of the present disclosure.

Claims (15)

  1. 전자 장치에 있어서,In electronic devices,
    도전성 부재를 통해 형성되고, 지정된 간격으로 이격된 복수의 관통홀들을 포함하는 측면 부재를 포함하는 하우징;a housing including a side member formed through the conductive member and including a plurality of through-holes spaced at predetermined intervals;
    상기 하우징에 배치된 안테나 구조체로써,As an antenna structure disposed in the housing,
    상기 하우징의 내부 공간에서, 상기 복수의 관통홀들 각각과 대응하도록 배치된 복수의 급전부들을 포함하는 기판; 및a substrate including a plurality of power feeding parts arranged to correspond to each of the plurality of through holes in the inner space of the housing; and
    상기 복수의 관통홀들에 채워지고, 지정된 유전율을 갖는 유전체를 포함하는 안테나 구조체; 및an antenna structure filled in the plurality of through holes and including a dielectric material having a designated permittivity; and
    상기 내부 공간에서, 상기 복수의 급전부들과 전기적으로 연결되도록 배치되고, 상기 유전체를 통해 지정된 주파수 대역의 무선 신호를 송신 또는 수신하도록 설정된 무선 통신 회로를 포함하는 전자 장치.An electronic device comprising a wireless communication circuit disposed in the inner space to be electrically connected to the plurality of power feeders and configured to transmit or receive a wireless signal of a designated frequency band through the dielectric.
  2. 제1항에 있어서,According to claim 1,
    상기 측면 부재는 상기 도전성 부재와 적어도 부분적으로 결합된 비도전성 부재를 더 포함하는 전자 장치.The electronic device of claim 1 , wherein the side member further includes a non-conductive member at least partially coupled to the conductive member.
  3. 제2항에 있어서,According to claim 2,
    상기 비도전성 부재와 상기 유전체는 서로 다른 유전율을 갖는 전자 장치.The electronic device of claim 1 , wherein the non-conductive member and the dielectric have different dielectric constants.
  4. 제2항에 있어서,According to claim 2,
    상기 비도전성 부재는 상기 유전체와 실질적으로 동일한 소재로 형성된 전자 장치.The non-conductive member is formed of substantially the same material as the dielectric.
  5. 제1항에 있어서,According to claim 1,
    상기 복수의 관통홀들의 크기는 상기 유전체의 유전율을 통해 결정된 전자 장치.The size of the plurality of through holes is determined through the permittivity of the dielectric.
  6. 제1항에 있어서,According to claim 1,
    상기 기판은 상기 측면 부재를 향하는 제1면 및 상기 제1면과 반대 방향을 향하는 제2면을 포함하고, The substrate includes a first surface facing the side member and a second surface facing the opposite direction to the first surface,
    상기 기판은 상기 제1면이 상기 측면 부재의 내면과 접촉하거나 근접하는 방식으로 배치된 전자 장치.The electronic device of claim 1 , wherein the substrate is arranged such that the first surface contacts or approaches an inner surface of the side member.
  7. 제1항에 있어서,According to claim 1,
    상기 측면 부재를 외부에서 바라볼 때, 상기 복수의 급전부들 각각은, 상기 복수의 관통홀들 각각과 중첩되는 위치에 배치된 전자 장치.When viewing the side member from the outside, each of the plurality of power feeding units is disposed at a position overlapping each of the plurality of through holes.
  8. 제6항에 있어서,According to claim 6,
    상기 기판에서, 상기 기판의 그라운드층과 전기적으로 연결되고, 상기 복수의 급전부들 각각을 둘러싸도록 형성된 도전성 차폐 공간을 포함하는 전자 장치.and a conductive shielding space in the substrate, electrically connected to a ground layer of the substrate, and formed to surround each of the plurality of power feeding units.
  9. 제8항에 있어서,According to claim 8,
    상기 도전성 차폐 공간은,The conductive shielding space,
    상기 제1면과 상기 제2면 사이의 서로 다른 절연층에 적층되는 방식으로 배치된 루프 형태의 복수의 플레이트들; 및a plurality of loop-shaped plates arranged in a stacked manner on different insulating layers between the first surface and the second surface; and
    상기 복수의 플레이트들을 관통하고, 상기 그라운드층에 전기적으로 연결된 복수의 도전성 비아들을 포함하는 전자 장치.and a plurality of conductive vias penetrating the plurality of plates and electrically connected to the ground layer.
  10. 제8항에 있어서,According to claim 8,
    상기 측면 부재를 외부에서 바라볼 때, 상기 도전성 차폐 공간은 상기 복수의 관통홀들과 중첩하도록 위치된 전자 장치.When viewing the side member from the outside, the conductive shielding space is positioned to overlap the plurality of through holes.
  11. 제1항에 있어서,According to claim 1,
    상기 복수의 급전부들 각각은, 상기 무선 신호를 송신 또는 수신하기 위한 제1편파 급전부 및 상기 무선 신호를 송신 또는 수신하고, 상기 제1편파와 수직하게 배치된 제2편파 급전부를 포함하는 전자 장치.Each of the plurality of power feeders includes a first polarized wave feeder for transmitting or receiving the radio signal and a second polarized wave feeder for transmitting or receiving the radio signal and disposed perpendicular to the first polarized wave.
  12. 제1항에 있어서,According to claim 1,
    상기 복수의 급전부들 각각은 상기 기판의 두께 방향으로 배치된 급전 비아 및 상기 급전 비아와 수직한 방향으로 지정된 길이를 갖도록 연장 또는 접촉된 급전 라인을 포함하는 전자 장치.The electronic device of claim 1 , wherein each of the plurality of power feeding units includes a power supply via disposed in a thickness direction of the substrate and a power supply line extending or contacting to have a designated length in a direction perpendicular to the power supply via.
  13. 제1항에 있어서,According to claim 1,
    상기 하우징은 전면 커버 및 전면 커버와 반대 방향으로 향하는 후면 커버를 포함하고,The housing includes a front cover and a rear cover facing in an opposite direction to the front cover,
    상기 측면 부재는 상기 전면 커버와 상기 후면 커버 사이에 배치된 전자 장치.The side member is disposed between the front cover and the rear cover.
  14. 제13항에 있어서,According to claim 13,
    상기 내부 공간에서, 상기 전면 커버의 적어도 일부를 통해 외부로부터 보일 수 있게 배치된 디스플레이를 포함하는 전자 장치.An electronic device comprising a display disposed in the inner space so as to be visible from the outside through at least a portion of the front cover.
  15. 제1항에 있어서,According to claim 1,
    상기 측면 부재의 외면에서, 상기 복수의 관통홀들을 커버하도록 배치된 커버 부재를 포함하고, On an outer surface of the side member, a cover member disposed to cover the plurality of through holes,
    상기 커버 부재의 유전율은 상기 복수의 관통홀의 유전율과 실질적으로 동일하거나, 상기 관통홀의 유전율보다 더 큰 유전율을 갖는 소재로 형성된 전자 장치.The electronic device of claim 1 , wherein the cover member is made of a material having a dielectric constant that is substantially equal to or greater than that of the plurality of through holes.
PCT/KR2023/001045 2022-01-24 2023-01-20 Electronic device comprising antenna WO2023140698A1 (en)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20100042617A (en) * 2010-03-19 2010-04-26 (주)파트론 Microstrip patch antenna
KR20100049643A (en) * 2007-08-07 2010-05-12 애플 인크. Antennas for handheld electronic devices
KR20100137946A (en) * 2009-06-24 2010-12-31 주식회사 모비텍 Vertical contact type connector
US20180269376A1 (en) * 2014-12-10 2018-09-20 Thales Perforated piezoelectric hydrophone, array comprising a plurality of hydrophones and method for making said hydrophone
WO2018217420A1 (en) * 2017-05-23 2018-11-29 Apple Inc. Antennas in patterned conductive layers

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20100049643A (en) * 2007-08-07 2010-05-12 애플 인크. Antennas for handheld electronic devices
KR20100137946A (en) * 2009-06-24 2010-12-31 주식회사 모비텍 Vertical contact type connector
KR20100042617A (en) * 2010-03-19 2010-04-26 (주)파트론 Microstrip patch antenna
US20180269376A1 (en) * 2014-12-10 2018-09-20 Thales Perforated piezoelectric hydrophone, array comprising a plurality of hydrophones and method for making said hydrophone
WO2018217420A1 (en) * 2017-05-23 2018-11-29 Apple Inc. Antennas in patterned conductive layers

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