WO2023138600A1 - 一种带有温度补偿功能的功率检测电路及其射频前端模块 - Google Patents
一种带有温度补偿功能的功率检测电路及其射频前端模块 Download PDFInfo
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- WO2023138600A1 WO2023138600A1 PCT/CN2023/072797 CN2023072797W WO2023138600A1 WO 2023138600 A1 WO2023138600 A1 WO 2023138600A1 CN 2023072797 W CN2023072797 W CN 2023072797W WO 2023138600 A1 WO2023138600 A1 WO 2023138600A1
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- power detection
- resistor
- detection circuit
- hbt transistor
- capacitor
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- 238000001514 detection method Methods 0.000 title claims abstract description 135
- 230000010354 integration Effects 0.000 claims abstract description 31
- 239000003990 capacitor Substances 0.000 claims description 50
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- 230000006870 function Effects 0.000 description 15
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- 238000010586 diagram Methods 0.000 description 8
- 238000004891 communication Methods 0.000 description 7
- 230000003321 amplification Effects 0.000 description 6
- 238000003199 nucleic acid amplification method Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 238000013461 design Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
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Classifications
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05F—SYSTEMS FOR REGULATING ELECTRIC OR MAGNETIC VARIABLES
- G05F1/00—Automatic systems in which deviations of an electric quantity from one or more predetermined values are detected at the output of the system and fed back to a device within the system to restore the detected quantity to its predetermined value or values, i.e. retroactive systems
- G05F1/10—Regulating voltage or current
- G05F1/46—Regulating voltage or current wherein the variable actually regulated by the final control device is dc
- G05F1/56—Regulating voltage or current wherein the variable actually regulated by the final control device is dc using semiconductor devices in series with the load as final control devices
- G05F1/565—Regulating voltage or current wherein the variable actually regulated by the final control device is dc using semiconductor devices in series with the load as final control devices sensing a condition of the system or its load in addition to means responsive to deviations in the output of the system, e.g. current, voltage, power factor
- G05F1/567—Regulating voltage or current wherein the variable actually regulated by the final control device is dc using semiconductor devices in series with the load as final control devices sensing a condition of the system or its load in addition to means responsive to deviations in the output of the system, e.g. current, voltage, power factor for temperature compensation
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R21/00—Arrangements for measuring electric power or power factor
- G01R21/14—Compensating for temperature change
Definitions
- the invention relates to a power detection circuit with a temperature compensation function, and also relates to a radio frequency front-end module including the power detection circuit and corresponding electronic equipment, belonging to the technical field of radio frequency integrated circuits.
- the RF front-end (Radio Frequency Front-End, abbreviated as RF FE) module is the core component of electronic devices such as smart phones, and is mainly used to realize the transmission and reception of radio frequency signals at different frequencies.
- Typical RF front-end modules include RF switches, low noise amplifiers, filters, duplexers, power amplifiers and other components.
- an example of an existing radio frequency front-end module includes a power amplifier composed of three-stage power amplification units (PA1 ⁇ PA3), a power supply circuit and a power detection circuit.
- the power supply is responsible for providing the power amplifier with the power required for its work.
- the power amplifier is responsible for the amplification and processing of radio frequency signals.
- the function of the power detection circuit is to convert the power of the RF front-end into a corresponding voltage value, which is fed back to the processor of the electronic device to calibrate the output power.
- the radio frequency front-end module used in electronic equipment generally requires a working environment temperature range of -25°C to 85°C, or -40°C to 110°C.
- HBT heterojunction bipolar transistor, heterojunction bipolar transistor
- a voltage with a temperature coefficient is required to adjust the corresponding relationship curve between the input power and the output voltage of the power detection circuit at different temperatures, so that the output power at different temperatures is stable.
- the existing RF front-end modules often use multiple voltages, and different circuit modules have different temperature coefficient requirements for the voltages, so multiple voltages with different temperature coefficients are required to supply power to different circuit modules. This increases the complexity of the circuit design and greatly increases the production cost of the radio frequency front-end module.
- the technical problem to be solved by the present invention is to provide a power detection circuit with temperature compensation function.
- Another technical problem to be solved by the present invention is to provide a radio frequency front-end module and electronic equipment including the above-mentioned power detection circuit.
- a power detection circuit with a temperature compensation function including at least one level of power detection unit and an integration unit, the input end of the integration unit is connected to the output end of the power detection unit;
- the resistance connected to the bias voltage in the power detection unit is a thermistor, and/or the resistance connected to the reference ground potential in the integration unit is a thermistor.
- the bias voltage is a voltage with a temperature coefficient.
- the integration unit includes a seventh HBT transistor, a tenth capacitor, and a tenth resistor, an eleventh resistor, a twelfth resistor, and a thirteenth resistor; wherein, the output end of the power detection unit is connected to the base of the seventh HBT transistor, the collector of the seventh HBT transistor is connected to the bias voltage, and the emitter of the seventh HBT transistor is connected to the reference ground potential through the eleventh resistor on the one hand, and connected to the output end of the integration unit through the twelfth resistor on the other hand; both ends of the tenth resistor are respectively connected to the base and collector of the seventh HBT transistor; The reference ground potential is connected, and the other end is connected to the output terminal; one end of the tenth capacitor is connected to the emitter of the seventh HBT transistor, and the other end is connected to the reference ground potential.
- the tenth resistor in the integration unit and the bias voltage have positive temperature coefficient or negative temperature coefficient at the same time.
- V7e (Vreg-Vbe7)-I*R10
- V7e is the emitter voltage of the seventh HBT transistor
- Vreg is the bias voltage
- Vbe7 is the voltage between the base and the emitter of the seventh HBT transistor
- R10 is the resistance value of the tenth resistor
- I is the output current of the power detection unit.
- the power detection unit includes a first HBT transistor and a second HBT transistor, a first capacitor, a second capacitor, and a third capacitor, and a first resistor, a second resistor, and a seventh resistor; the signal input end of the power detection circuit is connected to the first capacitor, and the other end of the first capacitor is connected to the first resistor and the collector of the first HBT transistor.
- the other end of the resistor is connected to the base of the first HBT transistor, and the emitter of the first HBT transistor is connected to the reference ground potential; the collector of the first HBT transistor is connected to the bias voltage through the seventh resistor on the one hand, and on the other hand is connected to the base of the second HBT transistor through the second resistor; the emitter of the second HBT transistor is connected to the reference ground potential, and the collector of the second HBT transistor is connected to the input terminal of the integrated unit; Emitter connection for the second HBT transistor.
- the bias voltage when the seventh resistor connected to the bias voltage in the power detection unit has a positive temperature coefficient, the bias voltage has a negative temperature coefficient; or, when the seventh resistor connected to the bias voltage in the power detection unit has a negative temperature coefficient, the bias voltage has a positive temperature coefficient.
- the collector of the second HBT transistor in each stage of power detection unit is used as the output terminal of the power detection unit of the stage, and is commonly connected to the input terminal of the integration unit.
- a radio frequency front-end module which includes the above-mentioned power detection circuit.
- an electronic device including the above-mentioned power detection circuit.
- the power detection circuit with temperature compensation function provided by the present invention adopts a single output voltage power supply circuit to provide the two-stage or multi-stage power amplification unit and the one-stage or multi-stage power detection unit with the required bias power supply technical solution, which solves the technical problem that the temperature coefficient requirements of the bias voltage Vreg of different circuit modules are different, and multiple bias voltages Vreg with different temperature coefficients are required to supply power. Therefore, the power detection circuit and its radio frequency front-end module provided by the present invention have beneficial effects such as simple structural design, reduced production cost, and reliable performance.
- FIG. 1 is an example diagram of a typical radio frequency front-end module in the prior art
- Fig. 2 is the circuit principle diagram of the radio frequency front-end module provided by the embodiment of the present invention.
- Fig. 3 is in the radio frequency front-end module shown in Fig. 2, the circuit schematic diagram of an embodiment of the power detection circuit;
- Figure 4(a) is another implementation of the power detection circuit in the RF front-end module shown in Figure 2
- Fig. 4 (b) is in the radio frequency front-end module shown in Fig. 2, the circuit schematic diagram of another embodiment of the power detection circuit;
- FIG. 5 is a graph showing the relationship between input power and output voltage of a power detection circuit without temperature compensation in an embodiment of the present invention, wherein the abscissa is the input power of the power detection circuit, and the ordinate is the output voltage of the power detection circuit;
- FIG. 6 is a graph showing the relationship between input power and output voltage of a power detection circuit with a temperature compensation function in an embodiment of the present invention, wherein the abscissa is the input power of the power detection circuit, and the ordinate is the output voltage of the power detection circuit;
- Fig. 7 is an example diagram of an electronic device adopting the power detection circuit provided by the present invention.
- the radio frequency front-end module provided by the embodiment of the present invention includes a power amplifier 1 , a power supply circuit 2 and a power detection circuit (abbreviated as VDET) 3 .
- VDET power detection circuit
- the output terminal of the power amplifier 1 is connected to the input terminal of the power detection circuit 3
- the output terminal of the power supply circuit 2 is respectively connected to the bias power terminals of the power amplifier 1 and the power detection circuit 3 .
- the power supply circuit 2 provides the bias voltage and current required for the power amplifier 1 and the power detection circuit 3 to work.
- the power detection circuit 3 detects the output power of the power amplifier 1 and converts it into an output voltage (Vdet_out) proportional to the power.
- the power amplifier 1 is preferably realized by using components of the III-V compound process.
- the power amplifier 1 includes three stages of power amplifying units, namely, a first stage power amplifying unit PA1, a second stage power amplifying unit PA2, and a third stage power amplifying unit PA3.
- the input terminal (PAIN) of the first-stage power amplifying unit PA1 is connected to an external radio frequency signal
- the output end of the first-stage power amplifying unit PA1 is connected to the input end of the second-stage power amplifying unit PA2
- the output end of the second-stage power amplifying unit PA2 is connected to the input end of the third-stage power amplifying unit PA3
- the output end of the third-stage power amplifying unit PA3 is connected to the input end of the power detection circuit 3.
- the power supply circuit 2 is preferably realized by using CMOS or SOI process components. Among them, the power supply circuit 2 outputs the bias voltage Vreg1, which provides working bias for the three-stage power amplification unit and the power detection circuit 3 in the power amplifier 1 respectively. Voltage.
- the power detection circuit 3 provided by the present invention is a power detection circuit with a temperature compensation function, including a three-stage power detection unit and an integration unit Sum.
- the three-level power detection unit is the first-level power detection unit Class 1, the second-level power detection unit Class 2, and the third-level power detection unit Class 3.
- the power detection units at all levels are respectively composed of two HBT transistors, three capacitors and three resistors.
- the integrated unit Sum consists of an HBT transistor, a capacitor and four resistors.
- the resistors connected to the bias voltage Vreg in the power detection units at all levels and the integrated units are thermistors, and/or the resistors connected to the reference ground potential (ie, the ground terminal, the same below) in the integrated units are also thermistors.
- the first-level power detection unit Class 1 includes a first HBT transistor 1 and a second HBT transistor 2, a first capacitor C1, a second capacitor C2, and a third capacitor C3, and a first resistor R1, a second resistor R2, and a seventh resistor R7, wherein the seventh resistor R7 is a thermistor.
- the signal input terminal RFIN of the power detection circuit is connected to the first capacitor C1, the other end of the first capacitor C1 is connected to the first resistor R1 and the collector of the first HBT transistor 1, the other end of the first resistor R1 is connected to the base of the first HBT transistor 1, and the emitter of the first HBT transistor 1 is connected to the reference ground potential.
- the collector of the first HBT transistor 1 is connected to the bias voltage Vreg via the seventh resistor R7 on the one hand, and connected to the base of the second HBT transistor 2 via the second resistor R2 on the other hand.
- the emitter of the second HBT transistor 2 is connected to the reference ground potential.
- the collector of the second HBT transistor 2 serves as the output terminal of the power detection unit of this stage, after being connected with the output terminals of the second stage power detection unit and the third stage power detection unit, they are jointly connected to the input terminal of the integration unit.
- One end of the second capacitor C2 is connected to the first resistor R1, the other end of the second capacitor C2 is connected to the emitter of the first HBT transistor 1, one end of the third capacitor C3 is connected to the second resistor R2, and the other end of the third capacitor C3 is connected to the emitter of the second HBT transistor 2.
- the second-stage power detection unit Class 2 includes a third HBT transistor 3 and a fourth HBT transistor 4, a fourth capacitor C4, a fifth capacitor C5, and a sixth capacitor C6, and a third resistor R3, a fourth resistor R4, and an eighth resistor R8, wherein the eighth resistor R8 is a thermistor.
- the signal input terminal RFIN of the power detection circuit is connected to the fourth capacitor C4 of the second-stage power detection unit through the first capacitor C1 of the first-stage power detection unit, and the other end of the fourth capacitor C4 is connected to the third resistor R3 and the collector of the third HBT transistor 3
- the other end of the third resistor R3 is connected to the base of the third HBT transistor 3
- the emitter of the third HBT transistor 3 is connected to the reference ground potential
- the collector of the third HBT transistor 3 is connected to the bias voltage Vreg through the eighth resistor R8 on the one hand
- the base of the fourth HBT transistor 4 through the fourth resistor R4 on the other hand
- the emitter of the fourth HBT transistor 4 is connected to the reference ground potential
- the collector of the fourth HBT transistor 4 is connected to the output terminals of the first-level power detection unit and the third-level power detection unit, and then connected to the input of the integration unit end.
- One end of the fifth capacitor C5 is connected to the third resistor R3 , and the other end of the fifth capacitor C5 is connected to the emitter of the third HBT transistor 3 .
- One end of the sixth capacitor C6 is connected to the fourth resistor R4 , and the other end of the sixth capacitor C6 is connected to the emitter of the fourth HBT transistor 4 .
- the third-stage power detection unit Class 3 includes a fifth HBT transistor 5 and a sixth HBT transistor 6, a seventh capacitor C7, an eighth capacitor C8, and a ninth capacitor C9, and a fifth resistor R5, a sixth resistor R6, and a ninth resistor R9, wherein the ninth resistor R9 is a thermistor.
- the signal input terminal RFIN of the power detection circuit is connected to the seventh capacitor C7 of the third-stage power detection unit through the first capacitor C1 of the first-stage power detection unit and the fourth capacitor C4 of the second-stage power detection unit.
- the other end of the seventh capacitor C7 is connected to the fifth resistor R5 and the collector of the fifth HBT transistor 5.
- the other end of the fifth resistor R5 is connected to the base of the fifth HBT transistor 5.
- the emitter of the fifth HBT transistor 5 is connected to the reference ground potential.
- the collector of the fifth HBT transistor 5 is connected to the bias voltage Vreg through the ninth resistor R9.
- the sixth resistor R6 is connected to the base of the sixth HBT transistor 6, the emitter of the sixth HBT transistor 6 is connected to the reference ground potential, and the collector of the sixth HBT transistor 6 is connected to the output terminals of the first-stage power detection unit and the second-stage power detection unit, and then jointly connected to the input terminal of the integration unit.
- One end of the eighth capacitor C8 is connected to the fifth resistor R5, the other end of the eighth capacitor C8 is connected to the emitter of the fifth HBT transistor 5, one end of the ninth capacitor C9 is connected to the sixth resistor R6, and the other end of the ninth capacitor C9 is connected to the emitter of the sixth HBT transistor 6.
- the integration unit Sum includes a seventh HBT transistor 7, a tenth capacitor C10, and a tenth resistor R10, an eleventh resistor R11, a twelfth resistor R12, and a thirteenth resistor R13, wherein one or more of the tenth resistor R10, the eleventh resistor R11, and the thirteenth resistor R13 is a thermistor.
- the output end of the third-stage power detection unit is connected to the base of the seventh HBT transistor 7 in the integration unit Sum, the collector of the seventh HBT transistor 7 is connected to the bias voltage Vreg, and the emitter of the seventh HBT transistor 7 passes through
- the eleventh resistor R11 is connected to the reference ground, and on the other hand is connected to the output terminal Vout of the integration unit Sum through the twelfth resistor R12 .
- Both ends of the tenth resistor R10 are respectively connected to the base and collector of the seventh HBT transistor 7 , one end of the thirteenth resistor R13 is connected to the reference ground potential, and the other end of the thirteenth resistor R13 is connected to the output terminal Vout.
- One end of the tenth capacitor C10 is connected to the emitter of the seventh HBT transistor 7 , and the other end of the tenth capacitor C10 is connected to the reference ground potential.
- V7e (Vreg-Vbe7)-(I2+I4+I6)*R10 (1)
- V7e is the emitter voltage of the seventh HBT transistor 7;
- Vreg is the bias voltage;
- Vbe7 is the voltage between the base and the emitter of the seventh HBT transistor 7;
- Vbe1 is the voltage between the base and the emitter of the first HBT transistor 1;
- Vbe3 is the voltage between the base and the emitter of the third HBT transistor 3;
- Vbe5 is the voltage between the base and the emitter of the fifth HBT transistor 5;
- Unit Class 2 the output current of the third-level power detection unit Class 3.
- the temperature decreases and the bias voltage Vreg increases.
- the resistor R10 adopts a thermistor with a negative temperature coefficient
- the resistance value of the resistor R10 will increase; at the same time, if the resistor R7, resistor R8, and resistor R9 use a thermistor with a positive temperature coefficient, the resistance values of the resistor R7, resistor R8, and resistor R9 will all decrease, so that I2, I4, and I6 will increase.
- formula 1 formula 2, formula 3 and formula 4 since I2, I4, and I6 all increase, V7e will decrease, and the output voltage Vout will also decrease accordingly, realizing the temperature compensation function.
- the temperature decreases and the bias voltage Vreg decreases.
- the resistor R10 uses a thermistor with a positive temperature coefficient
- the resistance value of the resistor R10 will decrease; at the same time, if the resistor R7, resistor R8, and resistor R9 use a thermistor with a negative temperature coefficient, the resistance values of the resistor R7, resistor R8, and resistor R9 will all increase, so that I2, I4, and I6 will decrease.
- formula 1 formula 2, formula 3 and formula 4 since I2, I4, and I6 are all reduced, V7e will increase, and the output voltage Vout will also increase accordingly, realizing the temperature compensation function.
- the power amplifier selected in the above embodiments is a three-stage power amplifying unit, and the corresponding power detection circuit is a three-stage power detection unit.
- the power detection circuit one or more of the resistors R7, R8, R9, R10, R11 and R13 are thermistors.
- the power amplifier may include two or more stages of power amplification units; the corresponding power detection circuit may include one or more stages of power detection units, and the contents of the above-mentioned formula 1, formula 2, formula 3 and formula 4 are adjusted accordingly.
- FIG 4 (a) it is a schematic diagram of a power detection circuit comprising two-stage power detection units, wherein the collector of the second HBT transistor in the first-stage power detection unit is used as the output end of the current-stage power detection unit, and is connected in parallel with the collector of the second HBT transistor in the second-stage power detection unit to be connected to the input end of the integration unit.
- Figure 4(b) it is a schematic diagram of a power detection circuit including four-level power detection units, wherein the collectors of the second HBT transistors in the first-level, second-level, third-level and fourth-level power detection units are respectively used as the output terminals of the power detection units of this level, and are connected in parallel to the input terminals of the integration unit.
- all or part of the resistors connected to the bias voltage Vreg in the power detection units and the integration units of the integration units and the reference ground potential in the integration units may be thermistors.
- the inventor conducted an experimental test on it.
- the bias voltage Vreg of the power amplifier has a negative temperature coefficient.
- the measured relationship between input power and output voltage is shown in Figure 5.
- the abscissa is the input power of the power detection circuit
- the ordinate is the output voltage of the power detection circuit. It can be seen from FIG. 5 that for the same input power, the voltage curves output by the power detection circuit do not overlap under different temperature conditions, resulting in different output voltages at different temperatures.
- the bias voltage Vreg of the power amplifier has a negative temperature coefficient.
- the measured relationship between input power and output voltage is shown in Figure 6.
- the abscissa is the input power of the power detection circuit
- the ordinate is the output voltage of the power detection circuit.
- the power detection circuit provided by the present invention can be applied in various radio frequency front-end modules.
- the radio frequency front-end modules can also include radio frequency front-end receiving links, radio frequency front-end transmitting links and other existing conventional devices, which will not be described here.
- the power detection circuit provided by the present invention can also be used in electronic equipment as an important part of communication components.
- the electronic devices mentioned here refer to computer devices that can be used in a mobile environment and support various communication standards such as GSM, EDGE, TD_SCDMA, TDD_LTE, FDD_LTE, 5G, including mobile phones, notebook computers, tablet computers, vehicle-mounted computers, etc.
- the technical solution provided by the present invention is also applicable to other occasions where communication components are applied, such as communication base stations.
- the electronic device includes at least a processor and a memory, and may further include a communication component, a sensor component, a power supply component, a multimedia component, and an input/output interface according to actual needs.
- a communication component a sensor component
- a power supply component a multimedia component
- an input/output interface a multimedia component
- memory, communication components, sensor components, power supply components, multimedia components and input/output interfaces are all connected with the processor.
- the memory can be static random access memory (SRAM), electrically erasable programmable read-only memory (EEPROM), erasable programmable read-only memory (EPROM), programmable read-only memory (PROM), read-only memory (ROM), magnetic memory, flash memory, etc.
- the processor can be central processing unit (CPU), graphics processing unit (GPU), field programmable logic gate array (FPGA), application-specific integrated circuit (ASIC), digital signal processing (DSP) chip, etc.
- CPU central processing unit
- GPU graphics processing unit
- FPGA field programmable logic gate array
- ASIC application-specific integrated circuit
- DSP digital signal processing
- the power detection circuit with a temperature compensation function uses a power supply circuit with a single output voltage to provide the two-stage or multi-stage power amplification unit and the one-stage or multi-stage power detection unit.
- the technical solution provides the bias power required for the work, which solves the technical problem that the temperature coefficient requirements of the bias voltage Vreg of different circuit modules are different, and multiple bias voltages Vreg with different temperature coefficients are required to supply power. Therefore, the power detection circuit and its radio frequency front-end module provided by the present invention have beneficial effects such as simple structural design, reduced production cost, and reliable performance.
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Abstract
Description
Claims (10)
- 一种带有温度补偿功能的功率检测电路,其特征在于包括至少一级功率检测单元和整合单元,所述整合单元的输入端连接所述功率检测单元的输出端;所述功率检测单元中与偏置电压连接的电阻为热敏电阻,和/或所述整合单元中与参考地电位连接的电阻为热敏电阻。
- 如权利要求1所述的功率检测电路,其特征在于:所述偏置电压为具有温度系数的电压。
- 如权利要求1或2所述的功率检测电路,其特征在于:所述整合单元包括第七HBT晶体管、第十电容,以及第十电阻、第十一电阻、第十二电阻和第十三电阻;其中,所述功率检测单元的输出端与第七HBT晶体管的基极连接,第七HBT晶体管的集电极与所述偏置电压连接,第七HBT晶体管的发射极一方面通过第十一电阻与参考地电位连接,另一方面通过第十二电阻与整合单元的输出端连接;第十电阻的两端分别与第七HBT晶体管的基极和集电极连接;第十三电阻的一端与参考地电位连接,另一端与输出端连接;第十电容的一端与第七HBT晶体管的发射极连接,另一端与参考地电位连接。
- 如权利要求3所述的功率检测电路,其特征在于:所述整合单元中的第十电阻与所述偏置电压同时为正温度系数或负温度系数。
- 如权利要求4所述的功率检测电路,其特征在于在所述整合单元中,满足如下公式:V7e=(Vreg-Vbe7)-I*R10其中,V7e为第七HBT晶体管的发射极电压,Vreg为偏置电压,Vbe7为第七HBT晶体管的基极与发射极之间的电压,R10为第十电阻的阻值,I为功率检测单元的输出电流。
- 如权利要求1所述的功率检测电路,其特征在于:所述功率检测单元中,包括第一HBT晶体管和第二HBT晶体管,第一电容、第二电容和第三电容,以及第一电阻、第二电阻和第七电阻;所述功率检测电路的信号输入端与第一电容连接,第一电容的另一端 与第一电阻及第一HBT晶体管的集电极连接,第一电阻的另一端与第一HBT晶体管的基极相连,第一HBT晶体管的发射极与参考地电位连接;第一HBT晶体管的集电极一方面通过第七电阻与偏置电压连接,另一方面通过第二电阻与第二HBT晶体管的基极连接;第二HBT晶体管的发射极与参考地电位连接,第二HBT晶体管的集电极连接所述整合单元的输入端;第二电容的一端与第一电阻连接,另一端与第一HBT晶体管的发射极连接;第三电容的一端与第二电阻连接,另一端与第二HBT晶体管的发射极连接。
- 如权利要求6所述的功率检测电路,其特征在于:所述功率检测单元中与偏置电压连接的第七电阻为正温度系数时,所述偏置电压为负温度系数;或者,所述功率检测单元中与偏置电压连接的第七电阻为负温度系数时,所述偏置电压为正温度系数。
- 如权利要求6所述的功率检测电路,其特征在于:所述功率检测单元为至少两级时,每一级功率检测单元中的第二HBT晶体管的集电极作为该级功率检测单元的输出端,共同连接至所述整合单元的输入端。
- 一种射频前端模块,其特征在于所述射频前端模块中包括有权利要求1~8中任意一项所述的功率检测电路。
- 一种电子设备,其特征在于包括权利要求1~8中任意一项所述的功率检测电路。
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US18/415,658 US20240230734A1 (en) | 2022-01-19 | 2024-01-18 | Power detection circuit having temperature compensation function, and radio-frequency front-end module comprising power detection circuit |
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