WO2023132171A1

WO2023132171A1 - Method for producing plated component

Info

Publication number: WO2023132171A1
Application number: PCT/JP2022/044808
Authority: WO
Inventors: 勇輝櫻木
Original assignee: ソニーグループ株式会社
Priority date: 2022-01-06
Filing date: 2022-12-06
Publication date: 2023-07-13

Abstract

[Problem] The present invention addresses the problem of providing a method for producing a plated component, the method having fewer restrictions on resin materials to be plated, while being capable of increasing the contrast of plating deposition. [Solution] In a method for producing a plated component according to the present technology, a first substance is embedded in a target region in the surface of a resin base material; after the embedment of the first substance, a plating catalyst solution containing a second substance that adsorbs to the first substance is supplied to the surface, thereby loading the target region with the second substance; after the supply of the plating catalyst solution, a plating solution containing a third substance that deposits using the second substance as a catalyst is supplied to the surface, thereby forming a plating layer, which is formed of the third substance, on the target region.

Description

Method for manufacturing plated parts

This technology relates to a method for manufacturing plated parts in which plating is formed on the surface of a resin base material.

In recent years, three-dimensional circuit-molded parts with electric circuits formed on the surface of injection-molded products are called MIDs (Molded Interconnect Devices), and their range of applications is rapidly expanding. Since MID can form a circuit on the surface of a small and complicated shaped molded body, it is in line with the trend of lightness, thinness, shortness and smallness of electronic parts.

As a method for forming MIDs, the LDS (Laser Direct Structuring) method has been put into practical use. In the LDS method, first, a copper complex is kneaded into a thermoplastic resin and injection-molded, and laser drawing is performed on the surface of a molded body containing the copper complex. The copper complex is metallized by laser irradiation, and the catalytic activity of electroless copper plating is expressed, making it possible to plate the laser-drawn area. The LDS method can form a circuit even on the surface of an injection-molded article having a complicated shape.

In addition, MID formation methods other than the LDS method have also been reported. For example, Patent Documents 1 and 2 disclose methods of forming MIDs using catalyst deactivators. In this method, the catalyst deactivator is applied to the surface of the resin substrate and then partially removed by laser irradiation. Next, when the plating catalyst is supplied, the plating activity of the catalyst is deactivated by the catalyst deactivator, so that the plating activity occurs only in the regions from which the catalyst deactivator has been removed. Thereby, plating can be formed only on the regions from which the catalyst deactivator has been removed.

JP 2020-147789 A JP 2017-226890 A

However, the LDS method requires a resin base material kneaded with a copper complex, which limits the applicable resin materials. In addition, the methods described in Patent Documents 1 and 2 are difficult to apply to some resin materials because the plating depositability depends on the properties of the resin itself. Furthermore, the LDS method and the methods described in Patent Documents 1 and 2 cannot increase the contrast of plating deposition, that is, the difference in plating catalyst activity between the part where plating is to be formed and the part where plating is not to be formed. Thinning is difficult.

In view of the circumstances described above, the purpose of the present technology is to provide a method of manufacturing plated parts that is less restricted to resin materials that can be plated and that is capable of increasing the contrast of plating deposition.

In order to achieve the above object, a method for manufacturing a plated component according to one embodiment of the present technology includes:
embedding a first substance in the target region on the surface of the resin base;
After embedding the first substance, a plating catalyst solution containing a second substance that adsorbs to the first substance is supplied to the surface to cause the target region to support the second substance,
After supplying the plating catalyst solution, a plating solution containing a third substance that precipitates using the second substance as a catalyst is supplied to the surface to form a plating layer made of the third substance on the target region.

the first substance comprises a first element;
In the step of embedding the first substance, a layer containing the first element is formed on the surface, and a portion of the layer on the target region is locally heated to bury the first substance in the target. The region may be implanted and the layer removed.

In the step of embedding the first substance, the layer may be irradiated with a laser to locally heat the portion.

In the step of embedding the first substance, the layer may be irradiated with light to locally heat the portion.

In the step of embedding the first substance, the portion may be locally heated by bringing a heated object into contact with the layer.

The layer may be made of an organic compound containing the first element.

the first substance comprises a first element;
In the step of embedding the first substance, the surface is exposed to an atmosphere containing the first element;
The target area may be locally heated to embed the first material in the target area.

the first substance comprises a first element;
In the step of embedding the first material, the target area may be embedded with the first material by irradiating the target area with a flame containing the first element.

the first substance comprises a first element;
In the step of embedding the first substance, a layer containing the first element may be embedded in the surface, and portions of the layer other than the target region may be removed.

the first substance comprises a first element;
The first element may be Si, Ti, Al or Zr.

the second substance comprises a second element;
the second element is Pd,
the third substance comprises a third element;
The third element may be one or more of Cu, Ni, Co, Au, Ag, Pd, Rh, Pt, In and Sn.

the first element is Si, Ti, Al or Zr;
The organic compound may be a coupling agent containing the first element.

the first element is Si,
the first substance is silane;
The organic compound may be a silane coupling agent.

The resin base material may be made of a hydrophobic resin.

The resin base material may be made of PC (polycarbonate), ABS (Acrylonitrile Butadiene Styrene copolymer) or PEEK (Poly Ether Ether Ketone).

6 is a flow chart showing a method for manufacturing a plated component according to an embodiment of the present technology; FIG. 4 is a schematic diagram of a resin base material on which plating is formed in the method for manufacturing the plated component. FIG. 3 is a schematic diagram showing a pattern of target regions on the surface of a resin base material. It is a schematic diagram of a resin base material and a first element-containing layer. FIG. 2 is a schematic diagram of a resin base material with embedded portions and a first element-containing layer; It is a schematic diagram of the resin base material which formed the embedded part. FIG. 3 is a schematic diagram showing a pattern of embedded portions on the surface of a resin base material; FIG. 2 is a schematic diagram of the resin base material on which a catalyst-carrying portion is formed; It is a schematic diagram of the said resin base material which formed the plating layer. FIG. 3 is a schematic diagram showing the pattern of the plating layer on the surface of the resin substrate. It is a schematic diagram of a resin base material and a first element-containing layer. It is a schematic diagram which shows laser irradiation with respect to a 1st element containing layer. FIG. 4 is a schematic diagram showing embedded portions in a target region; FIG. 4 is a schematic diagram showing a catalyst-carrying portion in a target region; It is a schematic diagram which shows the plating layer in object Ryoirei. 1 is a schematic diagram showing a conventional LDS (Laser Direct Structuring) method; FIG. It is a schematic diagram which shows the said LDS method. It is a graph which shows the metal-plating catalyst activity of a laser irradiation part and an unprocessed part in the said LDS method. It is a schematic diagram which shows the catalyst deactivation method (good affinity of a resin base material) which is a prior art. It is a graph which shows the metal-plating catalyst activity of the laser irradiation part and an unprocessed part in the said catalyst deactivation method. It is a schematic diagram which shows the catalyst deactivation method (poor compatibility of a resin base material) which is a prior art. It is a graph which shows the metal-plating catalyst activity of the laser irradiation part and an unprocessed part in the said catalyst deactivation method. 2 is a graph showing plating catalyst activity in a target region and a region other than the target region in a method for manufacturing a plated component according to an embodiment of the present technology; It is a flow chart which shows a manufacturing method of a plating part concerning a modification of this art. It is a flow chart which shows a manufacturing method of a plating part concerning a modification of this art. It is a flow chart which shows a manufacturing method of a plating part concerning a modification of this art. 4 is a chemical formula of a silane coupling agent, which is an example of an organic compound that constitutes the first element-containing layer.

A method for manufacturing a plated part according to an embodiment of this technology will be explained.

[Manufacturing method of plated parts]
FIG. 1 is a flow chart showing the method for manufacturing a plated component according to this embodiment, and FIGS. 2 to 10 are schematic diagrams showing the method for manufacturing a plated component according to this embodiment. As shown in FIG. 1, in the method of manufacturing a plated component according to the present embodiment, a first material embedding step St101, a plating catalyst supply step St102, and a plating solution supply step St103 are sequentially performed.

FIG. 2 is a schematic diagram of a resin base material 151 on which plating is formed by the method of manufacturing a plated component according to this embodiment. The resin base material 151 is a base material made of synthetic resin. The resin base material 151 is preferably made of a hydrophobic resin, specifically PC (polycarbonate), ABS (Acrylonitrile Butadiene Styrene copolymer) or PEEK (Poly Ether Ether Ketone). Moreover, it is preferable that the resin base material 151 does not contain an inorganic filler such as a glass filler or a mineral filler. The shape of the resin base material 151 is arbitrary and not particularly limited.

In the method of manufacturing a plated component according to this embodiment, plating is formed on a specific region of the surface of the resin base material 151 . Hereinafter, this specific area will be referred to as a "target area". FIG. 3 is a schematic diagram showing the surface of the resin base material 151, and FIG. 2 is a cross-sectional view taken along the line AA of FIG. As shown in FIGS. 2 and 3, a part of the surface of the resin base material 151 is defined as a target area S. As shown in FIG. Note that the planar shape (hereinafter referred to as pattern) of the target region S shown in FIG. 3 is an example, and the pattern of the target region S is arbitrary.

The first substance embedding step St101 is a step of embedding the first substance in the target region S. The first substance is a substance to which the second substance, which will be described later, is adsorbed, and can be a single substance composed of the first element or a compound of the first element. The first element is Si, Ti, Al or Zr, and the first substance can be Si, Si compounds, Ti, Ti compounds, Al, Al compounds, Zr and Zr compounds.

Specifically, the first material embedding step St101 includes a first element-containing layer forming step St111, a local heating step St112, and a first element-containing layer removing step St113, as shown in FIG. The first element-containing layer forming step is a step of forming a “first element-containing layer” on the surface of the resin base material 151 . FIG. 4 is a schematic diagram of a resin base material 151 on which a first element-containing layer 152 is formed. As shown in the figure, the first element-containing layer 152 is uniformly formed on the surface of the resin base material 151 .

The first element-containing layer 152 is a layer containing the above-described first element. Specifically, the first element-containing layer 152 can be made of an organic compound containing the first element, and can be made of an organic Si compound, an organic Ti compound, an organic Al compound, or an organic Zr compound. can. More specifically, the first element-containing layer 152 can be a silane coupling agent, an organic Ti coupling agent, an organic Al coupling agent, or an organic Zr coupling agent. The thickness of the first element-containing layer 152 is preferably about μm. In the first element-containing layer forming step St111, the first element-containing layer 152 can be formed on the surface of the resin base material 151 by atmospheric vapor deposition or dipping.

The local heating step St112 is a step of locally heating a portion of the first element-containing layer 152 above the target region S. In the local heating step St112, the laser can be scanned along the pattern of the target region S to locally heat the above portion by laser irradiation. Further, in the local heating step St112, the region other than the target region S may be shielded from light by a mask, and the entire surface of the resin base material 151 may be irradiated with light to locally heat the above portion. Furthermore, in the local heating step St112, a heated object having a convex portion having the same shape as the target region S may be pressed against the first element-containing layer 152 to locally heat the above portion. Of these, laser irradiation is preferable because of the ease of operation and the excellent selectivity of the heated portion, and the ease with which the shape of the heated portion can be changed and the size of the heated portion can be reduced.

Due to this heating, both the portion near the surface of the resin base material 151 and the first element-containing layer 152 in the target region S are decomposed and changed in quality, and the first substance is embedded in the resin base material 151 . FIG. 5 is a schematic diagram showing an embedded portion 153, which is a portion of the resin base material 151 in which the first substance is embedded. As shown in the figure, the first element-containing layer 152 in the target region S is decomposed by heating.

The first element-containing layer removing step St113 is a step of removing the first element-containing layer 152 . In the first element containing layer removing step St113, a cleaning liquid is supplied to the surface of the resin base material 151 to remove the first element containing layer 152. FIG. FIG. 6 is a schematic diagram showing the resin base material 151 from which the first element-containing layer 152 has been removed. As shown in the figure, in the first element-containing layer removing step St113, the embedded portion 153 remains and the first element-containing layer 152 is removed. The cleaning liquid is a liquid that decomposes the first element-containing layer 152 and does not affect the resin substrate 151, and can be, for example, an acid, a base, or both. Further, in the first element-containing layer removing step St113, the first element-containing layer 152 may be removed by a method other than supplying the cleaning liquid.

In the first material embedding step St101, the first material is embedded in the resin base material 151 to form the embedded portion 153 as described above. FIG. 7 is a schematic diagram showing the pattern of the embedded portion 153 on the surface of the resin base material 151, and FIG. 6 is a cross-sectional view taken along line BB in FIG. As shown in FIG. 7, in the first substance embedding step St101, the target region S (see FIG. 3) is implanted with the first substance to form the embedded portion 153. As shown in FIG. The embedded portion 153 has the same pattern as the target area S (see FIG. 3).

The plating catalyst supply step St102 (see FIG. 1) is a step of supplying a plating catalyst solution containing a second substance to the surface of the resin base material 151 in which the embedded portion 153 is formed. The second substance is a substance that adsorbs to the first substance and has catalytic activity for electroless plating. The second substance contains a second element, for example ions and metals consisting of the second element. The second element is Pd, for example.

FIG. 8 is a schematic diagram showing the resin base material 151 supplied with the plating catalyst liquid. When the plating catalyst solution is supplied, the second substance is adsorbed on the first substance of the embedded portion 153, and as shown in FIG. It is formed. For example, when a plating catalyst solution containing Pd ions is supplied to the surface of the resin base material 151, the Pd ions are adsorbed to the first substance to form metal Pd particles, and the target area S carries the metal Pd particles.

The plating solution supply step St103 (see FIG. 1) is a step of supplying an electroless plating solution containing a third substance to the surface of the resin base material 151 on which the catalyst carrying portion 154 is formed. The third substance is a substance that precipitates using the second substance as a catalyst. The third substance contains ions and metals composed of a third element which is a metallic element, and the third element is any one or more of Cu, Ni, Co, Au, Ag, Pd, Rh, Pt, In and Sn. be. In addition, the third substance may further include any one or more of P, B, S, V, Cr, Mn, Fe, Zn, Mo, Cd, W, Re and Tl co-precipitating with the third element.

Specifically, the electroless plating solution is preferably an electroless copper plating solution, an electroless nickel plating solution, an electroless nickel phosphorous plating solution, or an electroless copper-nickel plating solution because the solution has high catalytic activity and is stable. However, it is also possible to use other plating solutions.

FIG. 9 is a cross-sectional view showing the resin base material 151 supplied with the plating solution. Since the third substance is deposited using the second substance as a catalyst, a plated layer 155 made of the third substance is formed on the catalyst carrying portion 154 as shown in FIG. FIG. 10 is a schematic diagram showing the pattern of the plating layer 155 on the surface of the resin base material 151, and FIG. 9 is a sectional view taken along line CC of FIG. As shown in FIG. 10, plating layer 155 has the same pattern as embedded portion 153 (see FIG. 7), ie, the same pattern as target area S (see FIG. 3). The method of manufacturing a plated component according to the present embodiment can manufacture a plated component in which the plating layer 155 is formed on the target region S of the resin base material 151 as described above.

[Details of resin substrate surface]
The details of the surface of the resin base material 151 in the method for manufacturing the plated component will be described. 11 to 15 are schematic diagrams showing the surface of the resin base material 151. FIG. FIG. 11 is a schematic diagram showing the surface of the resin base material 151 on which the first element-containing layer 152 is formed by the first element-containing layer forming step St111, and is an enlarged view of FIG.

A portion of the first element-containing layer 152 above the target region S (see FIG. 3) is locally heated by the local heating step St112. FIG. 12 is a schematic diagram showing local heating by laser irradiation. As shown in the figure, in the local heating step St112, the first element-containing layer 152 on the target region S is irradiated with the laser L to heat the first element-containing layer 152 locally. In addition, in the local heating step St112, local heating may be performed by a method other than laser irradiation.

FIG. 13 is a schematic diagram showing the resin base material 151 and the first element-containing layer 152 after local heating, and is an enlarged view of FIG. As shown in FIG. 13 , the local heating decomposes and alters both the portion near the surface of the resin base material 151 and the first element-containing layer 152 , and the particulate first substance 171 is generated in the resin base material 151 . Embedded. Thereby, the buried portion 153 is formed in the target region S. FIG.

Subsequently, the first element-containing layer 152 is removed by the first element-containing layer removing step St113, and the plating catalyst liquid is supplied to the surface of the resin base material 151 by the plating catalyst supplying step St102. FIG. 14 is a schematic diagram showing the resin base material 151 after the plating catalyst solution is supplied, and is an enlarged view of FIG. When the plating catalyst solution is supplied, the second substance 172 contained in the plating catalyst solution is adsorbed to the first substance 171 and supported on the resin substrate 151 in the target region S as shown in FIG. Since the first substance 171 is not embedded in regions other than the target region S, the second substance 172 is carried on the resin base material 151 only in the target region S. Thereby, the catalyst carrying portion 154 is formed in the target region S. As shown in FIG.

Subsequently, the electroless plating solution is supplied to the surface of the resin base material 151 from the plating solution supply step St103. FIG. 15 is a schematic diagram showing the resin base material 151 after the electroless plating catalyst solution has been supplied, and is an enlarged view of FIG. When the electroless plating solution is supplied, the third substance contained in the electroless plating solution is deposited using the second substance 172 as a catalyst, forming a plating layer 155 as shown in FIG.

[Effects of manufacturing method of plated parts]
Effects of the method for manufacturing a plated component according to the present embodiment will be described. In the method of manufacturing a plated component according to the present embodiment, the first substance is embedded in the target region S of the resin base material 151 as described above, and the plating layer 155 is formed using the second substance that is adsorbed to the first substance as a plating catalyst. . As a result, the target region S can be locally imparted with plating deposition properties. Since the contrast of plating deposition (difference in plating catalyst activity) is obtained by the distribution of the second substance, the resin material constituting the resin base material 151 is less limited, and the manufacturing method according to the present embodiment can be applied to a wide range of resin materials. Applicable.

Furthermore, in the method for manufacturing a plated component according to the present embodiment, electroless plating is performed using a second substance such as Pd ions as an electroless plating catalyst. indicates Therefore, in both the sensitizer-activating method and the catalyst-accelerator method, which are existing electroless plating catalyst imparting methods, the Pd ions are reduced while being adsorbed on the resin substrate. However, metal ions such as Pd ions are difficult to adsorb to the surface of the resin base material. difficult to absorb.

However, in the method for manufacturing a plated component according to the present embodiment, by embedding the first substance to which the second substance is likely to be adsorbed in the target region S of the resin base material 151, the second substance is adsorbed to the target region S. becomes easier. As a result, the second substance can be carried in the target region S and the second substance can be prevented from being carried in regions other than the target region S, and the contrast between the target region S and the other regions can be increased. It is possible to If the contrast of plating deposition is small, the plating protrudes from the target area S, making it difficult to thin the wiring. It is possible.

[Comparison with conventional technology]
The effect of the method for manufacturing a plated component according to the present embodiment will be described in comparison with the method for manufacturing a plated component according to the prior art.

　Figures 16 and 17 are schematic diagrams showing the conventional LDS (Laser Direct Structuring) method. As shown in FIG. 16, copper complex 312 is kneaded into resin base material 311 . When the resin base material 311 is irradiated with a laser to form the laser-irradiated portion P, the copper complex positioned near the surface of the laser-irradiated portion P is metallized to form metallic copper 313 . When an electroless plating solution is supplied to the resin base material 311, a plating layer 314 is formed using metallic copper 313 as a catalyst, as shown in FIG.

FIG. 18 is a graph showing the plating catalytic activity of the untreated portion not irradiated with laser and the laser irradiated portion on the surface of the resin base material 311 . As described above, high plating catalytic activity is caused by the metallic copper 313 in the laser-irradiated portion, but some plating catalytic activity is caused by the copper complex 312 even in the untreated portion. Therefore, the difference D1 in plating catalyst activity between the untreated portion and the laser-irradiated portion is small, and an unnecessary precipitate 315 may be formed in portions other than the laser-irradiated portion P as shown in FIG.

As described above, in the LDS method, the contrast of plating deposition is small, and the plating line is formed thicker than the line drawn by irradiation, or unnecessary plating deposition may occur. is considered difficult.

FIG. 19 is a schematic diagram showing a conventional catalyst deactivation method. As shown in FIG. 19, a catalyst deactivator 322 is carried on the surface of the resin base material 321 . When the resin base material 321 is irradiated with a laser to form the laser-irradiated portion P, the catalyst deactivator 322 is removed by the laser. When the plating catalyst is supplied to the resin base material 321, the plating catalyst 323 is supported on the resin base material 321 at the laser irradiation portion P as shown in FIG. A plating catalyst 324 deactivated by a catalyst deactivator is supported on the portion other than the laser-irradiated portion P. When an electroless plating solution is supplied to the resin base material 321, a plating layer is formed using the plating catalyst 323 as a catalyst.

FIG. 20 is a graph showing the plating catalytic activity of the untreated portion not irradiated with laser and the laser irradiated portion on the surface of the resin base material 321 . In the laser-irradiated portion, the plating catalyst 323 causes high plating catalytic activity as described above, and in the untreated portion, the deactivated plating catalyst 324 causes low plating catalytic activity. Therefore, the difference D2 in plating catalyst activity between the untreated portion and the laser-irradiated portion increases. On the other hand, this is the case where the resin material forming the resin base material 321 is a hydrophilic resin such as nylon, which has good compatibility with the catalyst deactivator 322 and the plating catalyst 323 .

FIG. 21 is a schematic diagram showing a catalyst deactivation method when the resin material constituting the resin base material 321 and the catalyst deactivator 322 and the plating catalyst 323 are not compatible with each other. As shown in FIG. 21, a small amount of catalyst deactivator 322 is supported on the surface of resin base material 321 . When the plating catalyst is supplied to the resin base material 321, a small amount of the plating catalyst 323 is supported on the resin base material 321 at the laser irradiation portion P as shown in FIG. Also, the catalyst deactivator 322 is insufficient in portions other than the laser irradiation portion P, and the plating catalyst 323 that is not deactivated is supported. When an electroless plating solution is supplied to the resin base material 321, a plating layer is formed using the plating catalyst 323 as a catalyst.

FIG. 22 is a graph showing the plating catalytic activity of the untreated portion and the laser-irradiated portion in this case. Since the plating catalyst 323 is insufficient in the laser-irradiated portion, the plating catalyst activity is small, and in the untreated portion, the plating catalyst 323 that is not deactivated causes some plating catalyst activity. Therefore, the difference D3 in plating catalyst activity between the untreated portion and the laser-irradiated portion becomes small. Therefore, even in the catalyst deactivation method, the contrast of the plating deposition becomes small with a resin having poor compatibility between the material of the resin base material, the catalyst deactivator, and the plating catalyst. This poorly compatible resin is a hydrophobic resin, common resins such as PC, ABS and PEEK. Therefore, the catalyst deactivation method limits applicable resin materials.

On the other hand, FIG. 23 is a graph showing the plating catalytic activity of the target region S and regions other than the target region S in the method of manufacturing a plated component according to the present embodiment. In the method of manufacturing a plated component according to the present embodiment, by embedding the first substance in the target region S, only the target region S can carry the second substance, which is a plating catalyst. Therefore, if the material of the resin base material 151 does not easily support the plating catalyst, the difference D4 in the plating catalyst activity increases, and the contrast of the plating deposition can be increased.

Furthermore, in the method for producing a plated part according to the present embodiment, unlike the LSD method, it is not necessary to knead a copper complex into the resin base material, and compatibility with a catalyst deactivator is also a problem as in the catalyst deactivation method. Therefore, it can be applied to a wide range of resin materials. In the catalyst deactivation method, a resin material that easily supports a plating catalyst can increase the contrast of plating precipitation (see FIG. 20), but in the method according to the present embodiment, on the contrary, a resin material that does not easily support a plating catalyst. can increase the contrast of plating deposition. Therefore, in this respect as well, the present invention can be applied to a wide range of resin materials.

[Variation]
In the above description, the first material embedding step St101 includes the first element-containing layer forming step St111, the local heating step St112, and the first element-containing layer removing step St113 (see FIG. 1), but is not limited to this. . 24 to 26 are flowcharts showing a method of manufacturing a plated component including another first material embedding step St101.

As shown in FIG. 24, the first material embedding step St101 may include an atmospheric local heating step St121. The atmospheric local heating step St121 is a step of exposing the surface of the resin base material 151 to an atmosphere containing the first substance to locally heat the target region S (see FIG. 3). Local heating can be performed by irradiating the target region S with a laser and scanning the laser along the shape of the target region S. FIG. Alternatively, the target region S may be locally heated by shielding the region other than the target region S from light with a mask and irradiating the entire surface of the resin base material 151 with light. By exposing the surface of the resin base material 151 to an atmosphere containing the first substance and locally heating it, the target region S is filled with the first substance to form a buried portion 153 (see FIG. 6). This method eliminates the step of forming and removing the first element-containing layer.

Also, as shown in FIG. 25, the first material embedding step St101 may include a flame irradiation step St131. The flame irradiation step St131 is a step of irradiating the target region S (see FIG. 3) with a flame containing the first substance. By irradiating the flame containing the first substance, the target region S is embedded with the first substance to form the embedded portion 153 (see FIG. 6). This method also eliminates the step of forming and removing the first element-containing layer.

Furthermore, as shown in FIG. 26, the first substance embedding step St101 may include a first element containing layer embedding step St141 and a first element containing layer removing step St142. The first element containing layer embedding step St<b>141 is a step of embedding the first element containing layer 152 (see FIG. 4 ) in the entire surface of the resin base material 151 . The first element-containing layer 152 can be embedded in the surface of the resin base material 151 by coating and heating. The first element-containing layer removing step St142 is a step of removing the first element-containing layer 152 other than the target region S. FIG. The first element-containing layer removing step St142 can be performed by irradiating the first element-containing layer 152 other than the target region S with light or mechanical processing. The first element-containing layer embedding step St141 and the first element-containing layer removing step St142 embed the first substance in the target region S to form the embedded portion 153 (see FIG. 6).

The first substance embedding process St101 can be various processes capable of forming the embedding portion 153 in the target region S of the resin base material 151 in addition to the processes shown here.

[Specific example of manufacturing method of plated parts]
A specific example of the method for manufacturing a plated component according to this embodiment will be described below. In this specific example, the first element-containing layer 152 (see FIG. 4) made of a silane coupling agent is formed, and silane (SiH ₄ ) as the first substance is embedded in the resin base material 151 . The second material is Pd and the third material is Cu and Ni.

FIG. 27 is the chemical formula of the silane coupling agent that constitutes the first element-containing layer 152. FIG. In the figure, "X" is an organic functional group such as a vinyl group, an epoxy group and an amino group, and "OR" is an alkoxy group such as a methoxy group and an ethoxy group. [Table 1] and [Table 2] below are tables showing each step carried out in this specific example. Each step St1 to St19 shown in this specific example corresponds to each step (see FIG. 1) described above as shown in these tables.

First, the resin base material 151 (see FIG. 2) is subjected to alkali treatment (St1) and water washing (St2). Asahi Cleaner C4000 (manufactured by Uemura Kogyo Co., Ltd.) is used for alkali treatment. Subsequently, the first element-containing layer forming step (St111) is performed. Specifically, a dipping method is used to apply a Si-containing layer made of a silane coupling agent to the surface of the resin base material 151 (St3). The Si-containing layer corresponds to the first element-containing layer 152 (see FIG. 4). In this step, the resin base material 151 is immersed in a mixed solution of IPA (Isopropanol) (95%) and KBE-903 (manufactured by Shin-Etsu Silicone Co., Ltd.) (5%), which is an aminosilane coupling agent. Subsequently, the resin base material 151 is taken out and dried (St4). By drying at 80° C. for 5 minutes, the Si-containing layer is adsorbed to the surface of the resin base material 151 to form a Si-containing layer having a maximum thickness of 10 μm.

Then, the local heating step (St112) is performed. Specifically, the target region S (see FIG. 3) on the surface of the resin base material 151 is irradiated with a laser (St5). The vicinity of the surface of the resin base material 151 and the Si-containing layer are decomposed and altered by laser irradiation, and silane is embedded in the resin base material 151 . The laser is a UV laser (MD-U1000C manufactured by Keyence) with an output of 15-25% and a frequency of 46-65 kHz.

Subsequently, the first element-containing layer removing step (St113) is performed. Specifically, the surface of the resin base material 151 is washed with a washing liquid that dissolves the Si-containing layer (St6 to St9). When the Si-containing layer is composed of a silane coupling agent, hydrolysis reversibly restores the state before condensation, so pickling and base washing are performed. Pickling can be performed by ultrasonic cleaning with HCl (0.03 M) at room temperature for 3 minutes. Base washing can be carried out by ultrasonic cleaning at 50° C. for 3 minutes using Asahi Cleaner C4000 (manufactured by Uemura Kogyo Co., Ltd., 10% solution). Also, either pickling or basic washing may be carried out. A cleaning liquid that does not attack the resin base material 151 is used. As described above, the first material embedding step (St111 to St113) is performed to form the embedded portion 153 (see FIG. 6) in the target region S. FIG.

Subsequently, the plating catalyst solution supply step (St102) is carried out. Specifically, various processing liquids are supplied to the surface of the resin base material 151 (St10 to St17). Asahi Cleaner C4000 (manufactured by Uemura & Co., Ltd.) is used for alkali treatment (St10). In the conditioner supplying process (St12), PB-102 (manufactured by JCU, 100 ml/L) and EC-B (manufactured by JCU, 2 ml/L) are supplied to the surface of the resin substrate 151, and the catalyst (Pd ions) is embedded in the portion 153. of silane.

In the activator supply process (St14), AISL-ACT (manufactured by JCU, 100 ml/L) and HCl (35%, 2 ml/L) are supplied to the surface of the resin base material 151, and catalyst (Pd ion ) is adsorbed. In the accelerator supply treatment (St16), PC-66H (manufactured by JCU, 10 ml/L) and PC-BA (5 g/L) are supplied to the surface of the resin substrate 151 to activate the catalyst (metallic Pd). In the plating catalyst liquid supply step (St102), the catalyst supporting portion 154 (see FIG. 8) in which the metal Pd is supported on the surface of the resin base material 151 is thus formed.

Subsequently, the plating solution supply step (St103) is performed. Specifically, AISL-570 (manufactured by JCU), PC-BA (manufactured by JCU, 13 g / L), AISL-570B (manufactured by JCU, 70 ml / L), AISL-570C (manufactured by JCU, 24 ml/L) and AISL-570MU (manufactured by JCU, 50 ml/L). The pH is adjusted to 9.0±0.2. As a result, Cu and Ni are deposited using the metal Pd of the catalyst carrying portion 154 as a catalyst, and a plating layer 155 (see FIG. 9) is formed on the target region S. Finally, water washing (St19) is carried out to produce a plated part.

[About this disclosure]
The effects described in this disclosure are merely exemplary and not limiting, and other effects may also occur. The description of a plurality of effects above does not mean that those effects are necessarily exhibited at the same time. It means that at least one of the effects described above can be obtained depending on the conditions and the like, and effects not described in the present disclosure may be exhibited. It is also possible to arbitrarily combine at least two of the features described in this disclosure.

This technology can also be configured as follows.

(1)
embedding a first substance in the target region on the surface of the resin base;
After embedding the first substance, a plating catalyst solution containing a second substance that adsorbs to the first substance is supplied to the surface to cause the target region to support the second substance,
After the plating catalyst solution is supplied, a plating solution containing a third substance that precipitates using the second substance as a catalyst is supplied to the surface to form a plating layer made of the third substance on the target region. How the parts are made.
(2)
A method for manufacturing a plated component according to (1) above,
the first substance comprises a first element;
In the step of embedding the first substance, a layer containing the first element is formed on the surface, and a portion of the layer on the target region is locally heated to bury the first substance in the target. A method of manufacturing a plated part by embedding the region and removing the layer.
(3)
A method for manufacturing a plated component according to (2) above,
The method of manufacturing a plated component, wherein the step of embedding the first substance includes irradiating the layer with a laser to locally heat the portion.
(4)
A method for manufacturing a plated component according to (2) above,
The method of manufacturing a plated component, wherein in the step of embedding the first substance, the layer is irradiated with light to locally heat the portion.
(5)
A method for manufacturing a plated component according to (2) above,
The method of manufacturing a plated component, wherein in the step of embedding the first substance, the portion is locally heated by bringing a heated object into contact with the layer.
(6)
A method for manufacturing a plated component according to any one of (2) to (5) above,
The method of manufacturing a plated component, wherein the layer is made of an organic compound containing the first element.
(7)
A method for manufacturing a plated component according to (1) above,
the first substance comprises a first element;
In the step of embedding the first substance, the surface is exposed to an atmosphere containing the first element;
A method of manufacturing a plated component, comprising: locally heating the target area to embed the first material in the target area.
(8)
A method for manufacturing a plated component according to (1) above,
A method for manufacturing a plated part according to claim 1,
the first substance comprises a first element;
The method of manufacturing a plated component, wherein the step of embedding the first substance includes irradiating the target region with a flame containing the first element to embed the first substance in the target region.
(9)
A method for manufacturing a plated component according to (1) above,
the first substance comprises a first element;
In the step of embedding the first substance, the layer containing the first element is embedded in the surface, and a portion of the layer other than the target region is removed.
(10)
A method for manufacturing a plated component according to any one of (1) to (9) above,
the first substance comprises a first element;
The first element is Si, Ti, Al or Zr.
A method for manufacturing plated parts.
(11)
The method for manufacturing a plated component according to (10) above,
the second substance comprises a second element;
the second element is Pd,
the third substance comprises a third element;
The third element is any one or more of Cu, Ni, Co, Au, Ag, Pd, Rh, Pt, In and Sn. A method for manufacturing a plated component.
(12)
A method for manufacturing a plated component according to (6) above,
the first element is Si, Ti, Al or Zr;
The method for manufacturing a plated part, wherein the organic compound is a coupling agent containing the first element.
(13)
The method for manufacturing a plated component according to (12) above,
the first element is Si,
the first substance is silane;
The method for producing a plated part, wherein the organic compound is a silane coupling agent.
(14)
A method for manufacturing a plated component according to any one of (1) to (13) above,
A method for manufacturing a plated part, wherein the resin base material is made of a hydrophobic resin.
(15)
A method for manufacturing a plated component according to (14) above,
A method for manufacturing a plated part, wherein the resin base material is made of PC (polycarbonate), ABS (Acrylonitrile Butadiene Styrene copolymer) or PEEK (Poly Ether Ether Ketone).

St101... Loading step St102... Catalyst supply step St103... Liquid supply step St111... Element-containing layer forming step St112... Local heating step St113... Element-containing layer removing step 151... Resin substrate 152... First element-containing layer 153... Buried portion 154 Catalyst-carrying portion 155 Plating layer 171 First substance 172 Second substance

Claims

embedding a first substance in the target region on the surface of the resin base;
After embedding the first substance, a plating catalyst solution containing a second substance that adsorbs to the first substance is supplied to the surface to support the second substance on the target region;
After the plating catalyst solution is supplied, a plating solution containing a third substance that precipitates using the second substance as a catalyst is supplied to the surface to form a plating layer made of the third substance on the target region. How the parts are made.
A method for manufacturing a plated part according to claim 1,
the first substance comprises a first element;
In the step of embedding the first substance, a layer containing the first element is formed on the surface, and a portion of the layer on the target region is locally heated to remove the first substance from the target. A method of manufacturing a plated component, comprising embedding a region and removing said layer.
A method for manufacturing a plated component according to claim 2,
The method of manufacturing a plated component, wherein the step of embedding the first substance includes irradiating the layer with a laser to locally heat the portion.
A method for manufacturing a plated component according to claim 2,
The method of manufacturing a plated component, wherein in the step of embedding the first substance, the layer is irradiated with light to locally heat the portion.
A method for manufacturing a plated component according to claim 2,
The method of manufacturing a plated component, wherein the step of embedding the first substance includes bringing a heated object into contact with the layer to locally heat the portion.
A method for manufacturing a plated component according to claim 2,
The method of manufacturing a plated component, wherein the layer is made of an organic compound containing the first element.
A method for manufacturing a plated part according to claim 1,
the first substance comprises a first element;
In the step of embedding the first substance, the surface is exposed to an atmosphere containing the first element;
A method of manufacturing a plated component, comprising: locally heating the target region to embed the first substance in the target region.
A method for manufacturing a plated part according to claim 1,
the first substance comprises a first element;
The method of manufacturing a plated component, wherein the step of embedding the first substance includes irradiating the target region with a flame containing the first element to embed the first substance in the target region.
A method for manufacturing a plated part according to claim 1,
the first substance comprises a first element;
In the step of embedding the first substance, the layer containing the first element is embedded in the surface, and a portion of the layer other than the target region is removed.
A method for manufacturing a plated part according to claim 1,
the first substance comprises a first element;
The first element is Si, Ti, Al or Zr.
A method for manufacturing plated parts.
A method for manufacturing a plated component according to claim 10,
the second substance comprises a second element;
the second element is Pd,
the third substance comprises a third element;
The third element is any one or more of Cu, Ni, Co, Au, Ag, Pd, Rh, Pt, In and Sn. A method for manufacturing a plated component.
A method for manufacturing a plated component according to claim 6,
the first element is Si, Ti, Al or Zr;
The method for manufacturing a plated component, wherein the organic compound is a coupling agent containing the first element.
A method for manufacturing a plated component according to claim 12,
the first element is Si,
the first substance is silane;
The method for manufacturing a plated part, wherein the organic compound is a silane coupling agent.
A method for manufacturing a plated part according to claim 1,
The method for manufacturing a plated component, wherein the resin base material is made of a hydrophobic resin.
A method for manufacturing a plated component according to claim 14,
The method for manufacturing a plated part, wherein the resin base material is made of PC (polycarbonate), ABS (Acrylonitrile Butadiene Styrene copolymer) or PEEK (Poly Ether Ether Ketone).