WO2023130802A1

WO2023130802A1 - Material distribution method for semiconductor test sorting machine, control apparatus, and computer device

Info

Publication number: WO2023130802A1
Application number: PCT/CN2022/126360
Authority: WO
Inventors: 魏冲
Original assignee: 苏州华兴源创科技股份有限公司
Priority date: 2022-01-06
Filing date: 2022-10-20
Publication date: 2023-07-13
Also published as: TW202331278A; CN114392937A

Abstract

A material distribution method for a semiconductor test sorting machine, a control apparatus, and a computer device. The material distribution method comprises: acquiring a batch test result and material distribution tray information of chips in batches (S100); determining grade partition information according to the batch test result and the material distribution tray information (S200); acquiring a test result of a chip to be distributed among the chips in batches (S300); and according to the test result of said chip, the grade partition information and use information of a material distribution tray, moving said chip to a corresponding position in the material distribution tray (S400).

Description

Material sorting method, control device, and computer equipment for semiconductor testing and sorting machine

related application

This application claims the priority of the Chinese patent application filed on January 6, 2022, with the application number CN202210011806.5, and the name is "material distribution method, control device, and computer equipment for semiconductor testing and sorting machine", which is hereby It is incorporated by reference in its entirety.

technical field

The present application relates to the technical field of semiconductor automatic testing, in particular to a method for distributing materials of a semiconductor testing and sorting machine, a control device, and computer equipment.

Background technique

With the continuous improvement of automation in the field of semiconductor packaging and testing, many testing tasks that were originally done by manual or semi-automatic fixtures are gradually being transformed into full-automatic testing machines. Material sorting is an important environment for the automation process of the packaging and testing process, so the sorting machine has become an indispensable standard automation equipment in the fully automatic testing system.

The versatility and sorting efficiency of the sorting machine are important indicators for measuring automation equipment. Due to the diversity of packaging types of semiconductor products, the packaging and testing processes of different types of products and the same type of products from different manufacturers are often different. As a result, manufacturers of sorting machine equipment need to continuously improve the mechanical structure according to user needs to meet different requirements. Packaging product and process requirements.

Contents of the invention

Based on this, a material distributing method, a control device, and a computer equipment of a semiconductor testing and sorting machine are provided.

A method for distributing materials of a semiconductor test sorter, comprising obtaining batch test results of batch chips and information on a distribution tray; determining grade partition information according to the batch test results and the information on the distribution tray; The test result of the chip to be distributed; according to the test result of the chip to be distributed, the grade partition information and the use information of the distribution tray, the chip to be distributed is moved to the corresponding s position.

In one of the embodiments, the batch test result includes the grade number and grade proportion of the batch of chips, and the distribution tray information includes the number of distribution trays and the capacity of the distribution tray, and according to the batch test result Determining the grade partition information with the information of the material distribution tray includes determining that the grade number is corresponding to the material distribution tray according to the grade number, the proportion of the grade, the number of the material distribution tray and the capacity of the material distribution tray. The behavioral basic unit of the grade partition information includes the corresponding relationship between the grade number and the behavioral basic unit in the distribution tray.

In one of the embodiments, the chips to be distributed are moved to the distribution tray according to the test results of the chips to be distributed, the grade partition information and the use information of the distribution tray The corresponding position includes determining the target distribution tray corresponding to the chip to be distributed according to the test result of the chip to be distributed and the grade partition information; according to the use of the target distribution tray and the distribution tray information, calculating the moving coordinates of the chips to be distributed; and moving the chips to be distributed to corresponding positions in the distribution tray according to the moving coordinates.

In one of the embodiments, according to the test results of the chips to be distributed, the grade partition information and the use information of the distribution tray, the chips to be distributed are moved to the corresponding distribution tray. After the position, the method also includes judging whether the behavioral basic unit in the material distribution tray is full; Replace said distribution pan.

A material distribution control device for semiconductor testing, including a test discharge platform for transferring batch chips; a material distribution module for obtaining batch test results and distribution tray information for batch chips, and for Result and the distribution level partition information of the distribution tray information; the blanking control module is connected with the blanking distribution module, and is used to obtain the test results of the chips to be distributed in the batch of chips, and is also used to obtain the test results of the chips to be distributed according to the The level partition information corresponding to the test result of the chip to be distributed and the usage information of the distribution tray output a grabbing instruction; the automatic grabbing module is connected with the blanking control module for Instruction fetching grabs the chips to be distributed from the batch of chips transmitted by the test discharge platform, and moves the chips to be distributed to the corresponding positions in the distribution tray.

In one of the embodiments, the material distribution module includes a data acquisition unit, configured to acquire the batch test results of the batch chips and the information of the distribution tray, and the batch test results include the grade numbers of the batch chips And grade ratio, the information of the distribution tray includes the number of distribution trays and the capacity of the distribution tray; the data processing unit is connected with the data acquisition unit, and is used for according to the grade number, the ratio of the grade, the The quantity of the material distribution tray and the capacity of the distribution tray determine the basic unit of behavior corresponding to the grade number in the distribution tray, and the grade partition information includes the basic behavior of the grade number and the distribution tray. unit correspondence.

In one of the embodiments, the unloading control module includes a distributing tray determination unit, configured to determine the target classification of the chips to be distributed according to the test results of the chips to be distributed and the grade partition information. Material tray; a moving coordinate calculation unit connected to the distribution tray determination unit for calculating the moving coordinates of the chips to be distributed according to the usage information of the target distribution tray and the distribution tray; controlling An instruction output unit, connected to the movement coordinate calculation unit, is used for outputting a grasping instruction according to the movement coordinates.

In one of the embodiments, the material distributing control device for semiconductor testing further includes a judging module for judging whether the behavioral basic unit in the distributing tray is full; The connection is used to replace the material distribution tray according to the corresponding disk changing mode of the material distribution tray when the behavioral basic unit in the material distribution tray is full.

A computer device, including a memory and a processor, the memory stores a computer program, and when the processor executes the computer program, the steps of the method for distributing materials of a semiconductor test sorter described in any one of the above embodiments are realized .

A computer-readable storage medium, on which a computer program is stored, and when the computer program is executed by a processor, the steps of the method for distributing materials of a semiconductor testing and sorting machine described in any one of the above-mentioned embodiments are realized.

A computer program product, including a computer program, when the computer program is executed by a processor, the steps of the method for distributing materials of a semiconductor test sorter described in any one of the above embodiments are realized.

The details of one or more embodiments of the disclosure are set forth in the accompanying drawings and the description below. Other features, objects, and advantages of the present disclosure will be apparent from the description, drawings, and claims.

Description of drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application or the conventional technology, the following will briefly introduce the accompanying drawings that need to be used in the description of the embodiments or the traditional technology. Obviously, the accompanying drawings in the following description are only the present invention For the embodiments of the application, those skilled in the art can also obtain other drawings based on the disclosed drawings without creative effort.

FIG. 1 is a schematic flow diagram of a method for distributing materials of a semiconductor testing and sorting machine in one embodiment of the present disclosure;

FIG. 2 is a schematic diagram of the hardware structure of the semiconductor testing and sorting machine in one embodiment of the present disclosure;

Fig. 3 is a schematic diagram of partitioning of the distribution tray in one embodiment of the present disclosure;

FIG. 4 is a schematic flow diagram of a method for moving chips to be distributed in one embodiment of the present disclosure;

5 is a schematic flow diagram of a method for changing a full material distribution tray in one embodiment of the present disclosure;

6 is a schematic structural diagram of a material distribution control device for semiconductor testing in one embodiment of the present disclosure;

7 is a schematic block diagram of a material distribution control system for semiconductor testing in one embodiment of the present disclosure;

FIG. 8 is a schematic diagram of the internal structure of a computer device in one embodiment of the present disclosure.

Detailed ways

The following will clearly and completely describe the technical solutions in the embodiments of the application with reference to the drawings in the embodiments of the application. Apparently, the described embodiments are only some of the embodiments of the application, not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of this application.

It should be noted that when an element is referred to as being “fixed” to another element, it can be directly on the other element or there can also be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present. As used herein, the terms "vertical", "horizontal", "left", "right", "upper", "lower", "front", "rear", "circumferential" and similar expressions are based on the The orientation or positional relationship shown in the figure is only for the convenience of describing the application and simplifying the description, and does not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be interpreted as a reference to this application. Application Restrictions.

Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field to which this application belongs. The terms used herein in the specification of the application are only for the purpose of describing specific embodiments, and are not intended to limit the application. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

At present, the sorting machine can be divided into translation sorting machine, gravity sorting machine and turret sorting machine according to the different transmission methods. In practical applications, the application of translational sorting machines accounts for the largest proportion. Usually, the tray is used as the chip carrier in the unloading section of the translational sorting machine. According to different test results, chips of different grades can be placed in different trays. This sorting process is also called binning (bin means bin, box, and "binning" means "binning" in semiconductor manufacturing. split"). During the binning operation in the routine operation process, chips of different grades are usually placed on different trays according to different detection results.

In order to save space, most of the translational sorting machines are designed as automatic bin + fixed bin feeding method. The chips corresponding to the test grades that account for a large proportion of the chip test results will be put into the trays corresponding to the automatic bins, and the trays corresponding to the automatic bins will be automatically changed by the conveyor belt after they are full; the chip test results account for a small proportion The chips corresponding to the test level will be put into the tray corresponding to the fixed bin, and the tray corresponding to the fixed bin will be manually replaced after it is full. The number of trays of automatic bin and fixed bin in the translational separator can be combined arbitrarily according to the test process. The common combination in actual ease of use is: set 3 automatic bins + 3 fixed bins. However, when the product is changed or the customer requires it, the test results may have different numbers of test results, resulting in a mismatch between the number of trays and the number of test results, and efficient binning cannot be achieved. Just by increasing the number of trays corresponding to different binning methods, it is still impossible to solve the problem of increasing the number of bins caused by product changes or changes in customer needs.

In order to solve the above problems, the present disclosure provides a sorting method based on a translational sorting machine, which can expand the number of bins of the sorting machine without changing the hardware, and has broad application prospects.

FIG. 1 is a schematic flowchart of a method for distributing materials of a semiconductor testing and sorting machine in one embodiment of the present disclosure. In one embodiment, the distributing method of a semiconductor testing and sorting machine may include the following steps S100 to S400.

Step S100: Obtain batch test results of batch chips and distribution tray information.

The hardware equipment used to realize the above-mentioned material distribution method includes a test discharge platform, an automatic grab module and at least one unloading tray. The sorting machine can use the test discharge platform to move the chips that have completed the semiconductor performance test to the sorting and discharging area. The automatic grabbing module can be controlled to grab the chips to be distributed on the test discharge platform, and move the chips to be distributed to the corresponding positions.

After the semiconductor performance test for the batch of chips is completed, the batch test results of the batch of chips can be obtained. For example, different chips can be divided into different grades according to their performance. The batch test results may include test result information such as the number of grades appearing in the chips of this batch, grade numbers, and approximate proportions of chips of different grades.

At the same time, the information of the distribution tray set in the semiconductor test sorter is obtained. Due to different semiconductor production test plans, different distribution trays may be set for the sorting machine. The distribution tray information can include the number of distribution trays set in the semiconductor test sorter, the capacity information that can accommodate chips in each distribution tray, which distribution trays are the corresponding distribution trays for automatic bins, and which distribution trays are Information such as the distribution tray corresponding to the fixed bin.

Step S200: Determine grade partition information according to batch test results and distribution tray information.

Comprehensively considering the test results obtained in the semiconductor performance test of the batch of chips and the situation of the distribution tray set in the semiconductor test sorter, the corresponding binning method can be customized for this batch of chips. The level partition information can be used to represent the allocation of the distribution tray area where the chips with different test results are placed in the bins. For example, when it is determined that the batch of chips includes 3 different grades of chips according to the batch test results, and there are exactly 3 distributing trays in the semiconductor test sorter, then one distributing tray can be allocated for each grade.

Step S300: Obtain the test results of the chips to be sorted in the batch of chips.

The automatic grabbing module picks up a chip to be divided from the batch of chips that have been tested on the test discharge platform, and can obtain the test result corresponding to the chip to be divided from the testing machine.

Step S400: Move the chips to be distributed to corresponding positions in the distribution tray according to the test results of the chips to be distributed, the grade partition information and the use information of the distribution tray.

Since the allocation of the distribution trays corresponding to the test results can be determined according to the grade partition information, the distribution trays corresponding to the chips to be distributed can be determined according to the test results corresponding to the chips to be distributed and the grade partition information. At the same time, due to the limited capacity for accommodating chips in the material distribution tray, it is possible to judge the unoccupied position in the material distribution tray by obtaining the use information of the material distribution tray before moving, and determine that the chip to be distributed is in the distribution area. The corresponding position in the tray, so that the automatic grabbing module can move the chips to be distributed to the corresponding position in the distribution tray under control.

The material distribution method of the above-mentioned semiconductor test sorter divides the material distribution tray according to the batch test results of batch chips and the situation of the material distribution tray, and divides the material distribution tray into material distribution areas for accommodating different grades. According to the grade partition situation and the test results of the chips to be distributed in the batch of chips, the chips to be distributed are moved to the corresponding positions in the distribution tray. Using the method for sorting materials for semiconductor test sorters provided in this disclosure can expand the sorting machine’s sorting categories without changing the hardware, and can greatly improve the sorting machine’s performance while ensuring the original functions. The flexibility of material classification reduces the cost of equipment hardware. At the same time, the distribution tray can be utilized to the maximum without increasing the difficulty of operation of the equipment.

Actual production experience proves that the above method can greatly improve the flexibility of the sorting machine's feeding and binning method, and can expand the number of bins of the sorting machine at will without changing the hardware. Apply the above material distribution method to the semiconductor test sorter. After packaging tests of different process standards for different manufacturers and different types of products, the sorter equipment can adaptively allocate the material distribution tray according to the test results to meet The material distribution requirements of different packaging products and processes have broad application prospects.

In one embodiment, in semiconductor testing, the chips under test are usually divided into chips of different grades according to their different performances. Numbering the test results of the chips under test can facilitate the identification of which grades of chips are included in the batch of chips. At the same time, after the batch of chips is tested, the proportion of each grade in the total can be obtained. Therefore, the batch test result may include the grade numbers and grade ratios included in this batch of chips. Similarly, the number of distributing trays set in the sorting machine may be different, and the number of chips that can be accommodated in distributing trays of different sizes is also different. Therefore, the information of the distribution trays can be obtained, and distribution can be performed based on the quantity and capacity of the distribution trays, and the information of the distribution trays can include the number of distribution trays and the capacity of the distribution trays.

When determining the grade partition information based on the batch test results and the distribution tray information, the basic unit of behavior corresponding to the grade number in the distribution tray can be determined according to the grade number, grade proportion, number of trays, and tray capacity. Comprehensively consider the grade number, grade ratio, number of trays, and capacity of the trays to determine which tray is used to accommodate chips corresponding to which type or grades. When a tray is used to accommodate multiple When there are chips corresponding to different grade numbers, which areas are used to accommodate the chips corresponding to which grade numbers. In some embodiments of the present disclosure, an area in the sorting tray for accommodating chips corresponding to a grade number is defined as a behavioral basic unit. The grade partition information can be used to represent the allocation of the distribution tray area corresponding to the chips with different test results placed in the bin, and the grade partition information can include the correspondence between the grade number and the behavioral basic unit in the distribution tray.

Obtaining the grade ratio corresponding to each grade number in the batch chip can maximize the efficiency of the use of the tray, and divide the behavioral basic unit corresponding to each grade number in the distribution tray according to the grade ratio corresponding to each grade number. Since the semiconductor production process determines that the proportion of each grade in the batch of chips is relatively fixed, the proportion of each grade number corresponding to the batch of chips can be roughly estimated during the test process. When it is impossible to roughly estimate the grade proportion corresponding to each grade number in the batch of chips during the test process, the grade proportion corresponding to each grade number can also be directly divided according to the number of grades existing in the batch of chips.

In this embodiment, in order to better illustrate the steps of determining the grade partition information according to the batch test results and the distribution tray information, the test results include a total of 3 grades, and the grade numbers are recorded as: grade 1, grade 2, grade 3, The grade proportions of the three grade numbers are roughly: 60%, 30%, and 10%, and the semiconductor test sorter includes two trays AB as an example to illustrate the above-mentioned splitting process, but it cannot be understood from this To limit the scope of invention patents.

Please refer to FIG. 2 . FIG. 2 is a schematic diagram of the hardware structure of the semiconductor testing and sorting machine in one embodiment of the present disclosure. The test discharge platform and the two trays AB and AB are placed on the same height plane, wherein the test discharge platform is an area for storing batches of chips. An automatic grabbing module that can move freely on a plane based on the X-axis and Y-axis is installed above the test discharge platform and the two trays. The suction head of the automatic grabbing module can be used to grab chips. The automatic grabbing module can drive the chip to move freely above the test discharge platform and the two trays.

Obtain the batch test results and distribution tray information of batch chips. The batch test results include the grade number and grade ratio of batch chips, that is, the grade numbers of batch chips include grade 1, grade 2, and grade 3, and the grade ratio corresponding to grade 1 60%, level 2 corresponds to 30%, and level 3 corresponds to 10%. The distribution tray information includes the number of distribution trays and the capacity of the distribution trays, that is, the number of distribution trays is 2, and the capacity of the distribution trays is: each distribution tray includes 16 rows, and one row includes 8 chip storage positions.

In the case that one behavioral basic unit is used to accommodate chips corresponding to one level number, it can be determined that three behavioral basic units are included in two trays according to the level number of the batch of chips. Considering the proportion of grades corresponding to each grade number, it is known that grade 1 has the largest proportion, so material A can be assigned to the behavioral basic unit corresponding to grade 1; the behavioral basic unit corresponding to grade 2 and the behavioral basic unit corresponding to grade 3 Then share material B. Assign grade numbers to trays as basic units, so that the number of rows of trays corresponding to each grade corresponds to its proportion. Considering that the proportion of grades corresponding to grade 2 and the ratio of grades corresponding to grade 3 is 3:1, and considering the capacity of the distribution tray, the chip storage positions of 12 rows in material B can be allocated to the behavior corresponding to grade 2 As for the basic unit, allocate the chip storage positions of the 4 rows in material B to the behavioral basic units corresponding to level 3. The grade partition information may be shown in FIG. 3 , and FIG. 3 is a schematic diagram of the partition situation of the material distribution tray in one embodiment of the present disclosure.

The method of sorting materials for the above-mentioned semiconductor test sorter obtains the batch test results obtained from the test of batch chips, and according to the grade number in the batch test results and the approximate proportion corresponding to each grade number, the split material in the comprehensive sorter Tray information, assign grade numbers to distribution trays as basic units. In application, according to the test results of each test and the situation of the distribution tray, the accommodating areas of the chips corresponding to different test results in the distribution tray can be flexibly allocated. The actual production experience proves that the above-mentioned sorting and blanking method can greatly improve the flexibility of the sorting machine's binning and binning, so as to realize the expansion of the number of arbitrary bins of the sorting machine without changing the hardware.

Fig. 4 is a schematic flow chart of the method for moving the chips to be distributed in one embodiment of the present disclosure. In one embodiment, according to the test results of the chips to be distributed, the grade partition information and the usage information of the distribution tray, the Moving the distributing chip to the corresponding position in the distributing tray may include the following steps S410 to S430.

Step S410: Determine the target distributing tray corresponding to the chips to be divided according to the test results and grade partition information of the chips to be divided.

The automatic grabbing module is controlled to pick up the chips to be divided from the batch of chips that have been tested on the test discharge platform, and at the same time, the test results of the chips to be divided are obtained from the testing machine. Wherein, the test result of the chip to be divided may be the grade number of the chip to be divided. Since the grade partition information can be used to indicate the allocation of the distribution trays corresponding to the test results, the target distribution tray corresponding to the chips to be distributed can be determined according to the test results corresponding to the chips to be distributed and the grade partition information. For example, when the test result of the chip to be sorted is grade 1, it can be determined that the target distributing tray corresponding to grade 1 is material A according to the grade partition information. When distributing, the chip to be divided can be moved to the behavioral basic unit corresponding to level 1 in material A.

Step S420: Calculate the moving coordinates of the chips to be divided according to the target distributing tray and the usage information of the distributing tray.

At the same time, due to the limited capacity for accommodating chips in the distribution tray, it is possible to determine which unoccupied positions exist in the distribution tray by obtaining the usage information of the distribution tray before moving, and then determine the chips to be distributed. Corresponding target position in the distribution tray. Calculate the moving coordinates of the chips to be distributed according to the target distribution tray and the usage information of the distribution tray.

In some embodiments of the present disclosure, the usage information of the distribution tray may include information on the presence or absence of materials corresponding to each chip storage position in the distribution tray, origin coordinate information, row and column spacing information, and the like. According to the use information of the distributing tray, it can be determined where there are vacant positions in the behavioral basic unit corresponding to the chip to be distributing, and one of the vacant positions is selected as the target position. The moving coordinates can be calculated according to the coordinates of the origin, the distance between rows and columns, and the coordinates of the target position, which will move the chips to be divided to the target position.

Step S430: Move the chips to be sorted to the corresponding positions in the sorting tray according to the moving coordinates.

The moving coordinates are sent to the automatic grasping module, and the automatic grasping module can move the chips to be distributed to the target position in the corresponding distribution tray according to the moving coordinates. After placing the chip to be distributed into the target position in the corresponding distribution tray, the single chip binning of the chip to be distributed can be completed.

The method for distributing materials of the above-mentioned semiconductor test sorting machine determines the target position of the chips to be distributed according to the grade partition situation, the test results of the chips to be distributed in the batch of chips, and the use of the distribution tray, and divides the chips to be distributed. Moving to the corresponding position in the distribution tray can maximize the use of the storage position of the distribution tray in the semiconductor test sorter, and at the same time expand the flexibility of the sorting machine's cutting and classification without increasing the difficulty of equipment operation performance, reducing equipment hardware costs.

5 is a schematic flow diagram of a method for changing a full material distribution tray in one embodiment of the present disclosure. In one embodiment, according to the test results of the chips to be distributed, the grade partition information and the distribution tray Using the information, after moving the chips to be sorted to the corresponding positions in the sorting tray, the method may further include steps S500 to S600 as follows.

Step S500: Judging whether the behavioral basic units in the material distribution tray are full.

Step S600: When the behavioral basic unit in the material distribution tray is full, replace the material distribution tray according to the plate replacement method corresponding to the material distribution tray.

One row of basic units in the distribution tray is used to accommodate chips corresponding to a single type and grade number. When any basic unit of behavior is full, if the disk is not changed in time, and the chip captured in the next grab is the chip corresponding to the basic unit of the full behavior, the chip captured next time will have nowhere to go. Accommodate, thus affecting the binning process. Therefore, after the binning operation of a single chip is completed, it is judged whether the behavioral basic unit in the distribution tray is full of materials, and the distribution tray where the behavioral basic unit is full is replaced in time. Since the behavioral basic units in each distribution tray are divided according to the grade proportion corresponding to each grade number, when a behavioral basic unit is full, other behavioral basic units on the distribution tray will not be filled. There will be a great waste of resources, and the capacity of the chip holding capacity of the distribution tray can be utilized to the greatest extent.

In one of the embodiments, the distributing tray used in the semiconductor test sorting machine may include a first distributing tray and a second distributing tray, which may be an automatic bin and a fixed bin respectively. The disc change mode corresponding to the first distribution tray is different from the disc change mode corresponding to the second distribution tray. Therefore, when there is a behavioral basic unit full of materials, it is possible to judge the category corresponding to the distribution tray where the full behavior basic unit is located, and to change the tray according to the method of changing the tray corresponding to the category of the distribution tray. For example, the distribution tray used in the semiconductor test sorting machine may include a distribution tray corresponding to the automatic bin and a distribution tray corresponding to the fixed bin. Therefore, when the distribution tray of the basic unit with full material behavior is the distribution tray corresponding to the automatic bin, the conveyor belt can be used to realize the automatic change of the tray; when the full material distribution tray is the distribution tray corresponding to the fixed bin, it can be Send out a prompt message to remind the operator to manually change the disk.

In one of the embodiments, the above-mentioned distributing method may also include that when the behavioral basic units in all the distribution trays are not yet full, repeating the above steps S100 to S400 until the behavioral basic units in any one of the distribution trays full.

In one of the embodiments, the method for distributing materials of the above-mentioned semiconductor test sorting machine may further include storing all the data obtained in the above-mentioned embodiments. For example, data such as batch test results of batch chips, distribution tray information, test results of chips to be distributed in batch chips, grade partition information, usage information of distribution trays, etc. can be stored according to the stored data during later maintenance. Realize operations such as traceability and error correction or positioning and tracking of the target chip.

It should be understood that although the various steps in the flow charts in the accompanying drawings of the specification are shown sequentially according to the arrows, these steps are not necessarily executed sequentially in the order indicated by the arrows. Unless otherwise specified herein, there is no strict order restriction on the execution of these steps, and these steps can be executed in other orders. Moreover, at least some of the steps in the flowcharts of the accompanying drawings may include multiple steps or stages, and these steps or stages are not necessarily performed at the same time, but may be performed at different times. These steps or stages The order of execution is not necessarily performed sequentially, but may be performed alternately or alternately with other steps or at least a part of steps or stages in other steps.

Based on the description of the material distribution method embodiment of the semiconductor test sorter above, the present disclosure also provides a material distribution control device for semiconductor testing. The material distribution control device for semiconductor testing may include systems (including distributed systems), software (applications), modules, components, servers, clients, etc. that use the methods described in the embodiments of this specification combined with necessary implementation hardware. device. Based on the same innovative idea, the material distribution control device for semiconductor testing in one or more embodiments provided by the embodiments of the present disclosure is described in the following embodiments. Since the solution to the problem of the material distribution control device for semiconductor testing is similar to the method, the implementation of the material distribution control device for semiconductor testing in the embodiment of this specification can refer to the implementation of the aforementioned method, and the repetition will not be repeated. As used below, the term "unit" or "module" may be a combination of software and/or hardware that realizes a predetermined function. Although the material distribution control device for semiconductor testing described in the following embodiments is preferably implemented by software, implementation by hardware, or a combination of software and hardware is also possible and conceivable.

FIG. 6 is a schematic structural diagram of a material distribution control device for semiconductor testing in one embodiment of the present disclosure. In one embodiment, a material distribution control device for semiconductor testing may include a test discharge platform 100 , a material distribution module 200 , a material control module 300 and an automatic grasping module 400 .

The test discharging platform 100 can be used for transferring batches of chips.

The blanking distribution module 200 can be used to obtain the batch test results and distribution tray information of batch chips, and can also be used to assign grade partition information according to the batch test results and the distribution tray information.

The blanking control module 300, connected with the blanking distribution module 200, can be used to obtain the test results of the chips to be distributed in the batch of chips, and is also used to obtain the grade partition information and the distribution tray corresponding to the test results of the chips to be distributed The usage information of the output fetch command.

Both the blanking distribution module 200 and the blanking control module 300 can be connected with the testing machine to obtain test results in the testing machine.

The automatic grabbing module 400 is connected with the blanking control module 300, can be connected with the blanking control module 300, can grab the chips to be divided from the batch chips transmitted by the test discharge platform according to the grabbing instruction, and Move the chips to be distributed to the corresponding positions in the distribution tray.

In one of the embodiments, the blanking distribution module 200 may include a data acquisition unit and a data processing unit.

The data acquisition unit can be used to obtain the batch test results and distribution tray information of batch chips. The batch test results include the grade number and grade ratio of batch chips, and the distribution tray information includes the number of distribution trays and the capacity of the distribution tray.

The data processing unit is connected with the data acquisition unit and can be used to determine the basic unit of behavior corresponding to the grade number in the distribution tray according to the grade number, grade proportion, number of trays and tray capacity. The grade partition information includes grade The corresponding relationship between the number and the basic unit of behavior in the distribution tray.

In one of the embodiments, the unloading control module may include a distribution tray determination unit, a moving coordinate calculation unit, and a control instruction output unit.

The distribution tray determination unit can be used to determine the target distribution tray corresponding to the chips to be distributed according to the test results and grade partition information of the chips to be distributed.

The moving coordinate calculation unit is connected with the distributing tray determining unit, and can be used to calculate the moving coordinates of the chips to be dispensed according to the target distributing tray and usage information of the distributing tray.

The control instruction output unit is connected with the movement coordinate calculation unit and can be used to output the grasping instruction according to the movement coordinates.

In one of the embodiments, the distribution control device for semiconductor testing may further include a judging module and a distribution tray replacement module.

The judging module can be used to judge whether the behavioral basic unit in the distribution tray is full.

The distribution tray replacement module is connected with the judging module, and can be used to replace the distribution tray according to the corresponding tray replacement mode when the behavioral basic unit in the distribution tray is full.

In one of the embodiments, both the material distribution module 200 and the material control module 300 may be functional units in a server, and the server is used to implement material distribution control for semiconductor testing. The server is connected to the testing machine, obtains the number of grades of chip test results in the testing machine and the approximate proportion of each grade, and determines the grade partition information according to the batch test results and the information of the distribution tray, and assigns grades to the distribution tray as a basic unit of behavior number, so that the number of rows of distribution trays corresponding to each grade corresponds to its proportion. The server can also control the automatic grabbing module 400 to pick up the chips to be distributed from the test discharging platform 100 . The server may also obtain the test results corresponding to the chips captured by the automatic capture module 400 from the testing machine, such as grade numbers.

The server can also calculate the discharging position of the chips according to the usage information of the feeding tray, the grade partition information and the captured test results corresponding to the chips to be distributed. Under the control of the server, the automatic grabbing module 400 puts the chip into the corresponding feeding position in the distribution tray according to the discharging position of the chip calculated by the server, so as to complete the processing of the single chip of the chip to be distributed. Work in bins. Repeat the above steps until the behavioral basic unit corresponding to a certain grade number in the distribution tray is full. If the full material distribution tray is the distribution tray corresponding to the automatic bin, then the conveyor belt will automatically change the tray; if the full material distribution tray is the distribution tray corresponding to the fixed bin, a prompt message will be sent to remind the operator to proceed. Manual disk change. The above steps are repeated until the distributing operation for this batch of chips is completed.

In one of the embodiments, the server can also be used to store all the data acquired in the above embodiments. For example, data such as batch test results of batch chips, distribution tray information, test results of chips to be distributed in batch chips, grade partition information, usage information of distribution trays, etc. are stored in the database of the server. According to the stored data, operations such as traceability and error correction or positioning and tracking of the target chip are realized.

Each module in the above-mentioned material distribution control device for semiconductor testing can be fully or partially realized by software, hardware and combinations thereof. The above-mentioned modules can be embedded in or independent of the processor in the computer device in the form of hardware, and can also be stored in the memory of the computer device in the form of software, so that the processor can invoke and execute the corresponding operations of the above-mentioned modules.

Regarding the material distribution control device for semiconductor testing in the above embodiment, the specific manner in which each module executes operations has been described in detail in the embodiment related to the method, and will not be described in detail here.

It can be understood that, in this specification, the various embodiments of the above-mentioned method, the material distribution control device for semiconductor testing, etc. are described in a progressive manner, and the same/similar parts between the various embodiments can be referred to each other. Each embodiment The emphasis is on the differences from other embodiments. For relevant information, please refer to the descriptions of other method embodiments.

FIG. 7 is a schematic block diagram of a material distribution control system for semiconductor testing in one embodiment of the present disclosure. Referring to FIG. 7 , the semiconductor test dispensing control system S00 includes a processing component S20, which further includes one or more processors, and a memory resource represented by a memory S22 for storing instructions that can be executed by the processing component S20, such as application. The application program stored in the memory S22 may include one or more modules each corresponding to a set of instructions. In addition, the processing component S20 is configured to execute instructions to perform the above method.

The material distribution control system S00 for semiconductor testing may also include: the power supply assembly S24 is configured to perform power management of the material distribution control system S00 for semiconductor testing, and the wired or wireless network interface S26 is configured to connect the material distribution control system S00 for semiconductor testing to the network, and input output (I/O) interface S28. The dispensing control system S00 for semiconductor testing can operate based on the operating system stored in the memory S22, such as Windows Server, Mac OS X, Unix, Linux, FreeBSD or similar.

In an exemplary embodiment, there is also provided a computer-readable storage medium including instructions, such as a memory S22 including instructions, which can be executed by a processor of the semiconductor testing material distribution control system S00 to complete the above method. The storage medium may be a computer readable storage medium such as ROM, random access memory (RAM), CD-ROM, magnetic tape, floppy disk, and optical data storage device, for example.

In an exemplary embodiment, a computer program product is also provided, the computer program product includes instructions, and the above instructions can be executed by a processor of the semiconductor testing material distribution control system S00 to complete the above method.

In one embodiment, a computer device is provided. The computer device may be a server, and its internal structure diagram may be shown in FIG. 8 . FIG. 8 is a schematic diagram of the internal structure of the computer device in one embodiment of the present disclosure. The computer device includes a processor, a memory, a network interface and a display screen connected by a system bus. Wherein, the processor of the computer device is used to provide calculation and control capabilities. The memory of the computer device includes a non-volatile storage medium and an internal memory. The non-volatile storage medium stores an operating system, computer programs and databases. The internal memory provides an environment for the operation of the operating system and computer programs in the non-volatile storage medium. The database of the computer equipment is used to store all the data acquired in the above embodiments. The network interface of the computer device is used to communicate with an external terminal via a network connection. When the computer program is executed by the processor, a method for distributing materials of a semiconductor test sorter is realized.

The display screen of the computer device may be a liquid crystal display screen or an electronic ink display screen, and the input device of the computer device may be a touch layer covered on the display screen, or a button, a trackball or a touch pad provided on the casing of the computer device , and can also be an external keyboard, touchpad, or mouse.

Those skilled in the art can understand that the structure shown in FIG. 8 is only a block diagram of a partial structure related to the solution of this application, and does not constitute a limitation on the computer equipment to which the solution of this application is applied. The specific computer equipment can be More or fewer components than shown in the figures may be included, or some components may be combined, or have a different arrangement of components.

Those of ordinary skill in the art can understand that all or part of the processes in the methods of the above embodiments can be implemented through computer programs to instruct related hardware, and the computer programs can be stored in a non-volatile computer-readable memory In the medium, when the computer program is executed, it may include the processes of the embodiments of the above-mentioned methods. Wherein, any reference to storage, database or other media used in the various embodiments provided in the present application may include at least one of non-volatile and volatile storage. Non-volatile memory can include read-only memory (Read-Only Memory, ROM), magnetic tape, floppy disk, flash memory, optical memory, high-density embedded non-volatile memory, resistive variable memory (ReRAM), magnetic variable memory (Magnetoresistive Random Access Memory, MRAM), Ferroelectric Random Access Memory (FRAM), Phase Change Memory (Phase Change Memory, PCM), graphene memory, etc. The volatile memory may include random access memory (Random Access Memory, RAM) or external cache memory, etc. By way of illustration and not limitation, RAM can take many forms, such as Static Random Access Memory (SRAM) or Dynamic Random Access Memory (DRAM). The databases involved in the various embodiments provided in this application may include at least one of a relational database and a non-relational database. The non-relational database may include a blockchain-based distributed database, etc., but is not limited thereto. The processors involved in the various embodiments provided by this application can be general-purpose processors, central processing units, graphics processors, digital signal processors, programmable logic devices, data processing logic devices based on quantum computing, etc., and are not limited to this.

Each embodiment in this specification is described in a progressive manner, the same and similar parts of each embodiment can be referred to each other, and each embodiment focuses on the differences from other embodiments. In particular, for the hardware+program type embodiments, since they are basically similar to the method embodiments, the description is relatively simple, and for related parts, please refer to the part of the description of the method embodiments.

It should be noted that the above-mentioned device, electronic device, server, etc. may also include other implementation manners according to the description of the method embodiment, and for specific implementation manners, refer to the description of the related method embodiment. At the same time, new embodiments formed by combinations of features of various methods, devices, devices, and server embodiments still fall within the scope of implementation covered by the present disclosure, and details will not be repeated here.

In the description of this specification, descriptions referring to the terms "some embodiments", "other embodiments", "ideal embodiments" and the like mean that specific features, structures, materials, or characteristics described in connection with the embodiments or examples are included in this specification. In at least one embodiment or example of the application. In this specification, schematic descriptions of the above terms do not necessarily refer to the same embodiment or example.

The technical features of the above-mentioned embodiments can be combined arbitrarily. To make the description concise, all possible combinations of the technical features in the above-mentioned embodiments are not described. However, as long as there is no contradiction in the combination of these technical features, should be considered as within the scope of this specification.

The above-mentioned embodiments only express several implementation modes of the present application, and the description thereof is relatively specific and detailed, but should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make several modifications and improvements without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the scope of protection of the patent application should be based on the appended claims.

Claims

A method for distributing materials of a semiconductor test sorter, comprising:

Obtain the batch test results and distribution tray information of batch chips;

determining grade partition information according to the batch test result and the distribution tray information;

Obtain the test results of the chips to be distributed in the batch of chips;

According to the test result of the chips to be sorted, the level partition information and the usage information of the sorting tray, the chips to be sorted are moved to corresponding positions in the sorting tray.
The method for distributing materials of a semiconductor test sorting machine according to claim 1, wherein the batch test results include the grade numbers and grade ratios of the batch chips, and the distribution tray information includes the number of distribution trays and the number of distribution trays. Tray capacity.
The method for distributing materials of a semiconductor test sorter according to claim 2, wherein said determining grade partition information according to said batch test results and said distributing tray information comprises:

According to the grade number, the proportion of the grade, the number of the distribution tray and the capacity of the distribution tray, determine the basic unit of behavior corresponding to the grade number in the distribution tray, and the grade partition information includes The corresponding relationship between the grade numbers and the behavioral basic units in the distribution tray.
According to claim 1, 2 or 3, the method for distributing materials of the semiconductor test sorting machine, wherein, according to the test results of the chips to be divided, the grade partition information and the use information of the distributing tray , moving the chips to be distributed to the corresponding positions in the distribution tray includes:

According to the test result of the chip to be distributed and the grade partition information, determine the target distribution tray corresponding to the chip to be distributed;

calculating the moving coordinates of the chips to be distributed according to the target distribution tray and the usage information of the distribution tray;

The chips to be sorted are moved to corresponding positions in the sorting tray according to the moving coordinates.
The material distributing method of the semiconductor test sorting machine according to claim 3, wherein, according to the test results of the chips to be divided, the grade partition information and the use information of the material distributing tray, the After the distributing chip moves to the corresponding position in the distributing tray, the method also includes:

Judging whether the behavioral basic unit in the distribution tray is full;

When the behavioral basic unit in the material distribution tray is full, the material distribution tray is replaced according to the disk changing manner corresponding to the material distribution tray.
A material distribution control device for semiconductor testing, comprising:

Test discharge platform for transferring batches of chips;

The blanking distribution module is used to obtain batch test results and distribution tray information of batch chips, and is also used to assign grade partition information according to the batch test results and the distribution tray information;

The blanking control module is connected with the blanking distribution module, and is used to obtain the test results of the chips to be divided in the batch of chips, and is also used to classify the grades corresponding to the test results of the chips to be divided information and the use information of the distribution tray, and output a grabbing instruction;

An automatic grabbing module, connected to the blanking control module, for grabbing the chips to be divided from the batch of chips transmitted by the test discharge platform according to the grabbing instruction, and placing the chips to be divided The chips move to the corresponding positions in the distribution tray.
The material distribution control device for semiconductor testing according to claim 6, wherein the material distribution module comprises:

A data acquisition unit, configured to acquire batch test results of the batch of chips and the information of the distribution tray, the batch test results include the grade number and grade ratio of the batch of chips, and the information of the distribution tray includes the distribution tray information The number of trays and the capacity of the distribution tray;

A data processing unit, connected with the data acquisition unit, is used to determine the number of the grade number in the distribution tray according to the grade number, the proportion of the grade, the number of the trays and the capacity of the distribution tray. The corresponding behavioral basic unit in the tray, the grade partition information includes the correspondence between the grade number and the behavioral basic unit in the distribution tray.
The material distribution control device for semiconductor testing according to claim 6, wherein the material discharge control module comprises:

A distributing tray determination unit, configured to determine the target distributing tray corresponding to the chips to be divided according to the test results of the chips to be divided and the grade partition information;

A moving coordinate calculation unit, connected to the distributing tray determining unit, for calculating the moving coordinates of the chips to be divided according to the target distributing tray and the usage information of the distributing tray;

A control instruction output unit is connected with the movement coordinate calculation unit, and is used for outputting a grasping instruction according to the movement coordinates.
The distribution control device for semiconductor testing according to claim 6, wherein the automatic grabbing module comprises:

Tips for grabbing chips.
The distribution control device for semiconductor testing according to claim 7, wherein the distribution control device for semiconductor testing further comprises:

A judging module, used to judge whether the behavioral basic unit in the distribution tray is full;

The material distribution tray replacement module is connected with the judging module, and is used to replace the material distribution tray according to the disk replacement mode corresponding to the material distribution tray when the behavioral basic unit in the material distribution tray is full.
The material distribution control device for semiconductor testing according to claim 10, wherein the material distribution tray includes a first material distribution tray and a second material distribution tray, and the plate changing mode corresponding to the first material distribution tray is the same as that of the first material distribution tray. The way to change the tray corresponding to the second distribution tray is different.
A material distribution control system for semiconductor testing, comprising: a processing component, which includes one or more processors, and a memory resource represented by a memory, used to store instructions that can be executed by the processing component; an application program stored in the memory One or more modules each corresponding to a set of instructions may be included; the processing component is configured to execute the instructions to perform the steps of the method for distributing materials of the semiconductor test sorting machine described in any one of claims 1-5 .
The material distribution control system for semiconductor testing according to claim 12, wherein the material distribution control system for semiconductor testing further comprises:

a power supply assembly configured to perform power management of a dispensing control system for semiconductor testing;

a wired or wireless network interface configured to connect the semiconductor test dispensing control system to the network;

Input and output (I/O) interface.
A computer device, comprising a memory and a processor, the memory stores a computer program, wherein the processor implements the semiconductor test sorting described in any one of claims 1-5 when executing the computer program The steps of the material distribution method of the machine.
A computer-readable storage medium, on which a computer program is stored, characterized in that, when the computer program is executed by a processor, the method for distributing materials of the semiconductor test sorting machine described in any one of claims 1-5 is realized A step of.