WO2023124868A1 - Flow rate control method, electronic device and computer-readable storage medium - Google Patents

Flow rate control method, electronic device and computer-readable storage medium Download PDF

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Publication number
WO2023124868A1
WO2023124868A1 PCT/CN2022/137404 CN2022137404W WO2023124868A1 WO 2023124868 A1 WO2023124868 A1 WO 2023124868A1 CN 2022137404 W CN2022137404 W CN 2022137404W WO 2023124868 A1 WO2023124868 A1 WO 2023124868A1
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Prior art keywords
preset
impedance
flow rate
parameter
temperature
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PCT/CN2022/137404
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French (fr)
Chinese (zh)
Inventor
徐宏
颜莹
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杭州堃博生物科技有限公司
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Publication of WO2023124868A1 publication Critical patent/WO2023124868A1/en

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    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61BDIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B18/00Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61BDIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B18/00Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body
    • A61B18/04Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body by heating
    • A61B18/12Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body by heating by passing a current through the tissue to be heated, e.g. high-frequency current
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61BDIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B18/00Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body
    • A61B2018/00005Cooling or heating of the probe or tissue immediately surrounding the probe
    • A61B2018/00011Cooling or heating of the probe or tissue immediately surrounding the probe with fluids
    • A61B2018/00029Cooling or heating of the probe or tissue immediately surrounding the probe with fluids open
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61BDIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B18/00Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body
    • A61B2018/00636Sensing and controlling the application of energy
    • A61B2018/00773Sensed parameters
    • A61B2018/00791Temperature
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61BDIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B18/00Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body
    • A61B2018/00636Sensing and controlling the application of energy
    • A61B2018/00773Sensed parameters
    • A61B2018/00875Resistance or impedance
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02DCLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D30/00Reducing energy consumption in communication networks
    • Y02D30/70Reducing energy consumption in communication networks in wireless communication networks

Definitions

  • the embodiments of the present application relate to the technical field of data processing, and in particular to a flow rate control method, an electronic device, and a computer-readable storage medium.
  • radiofrequency ablation Under image guidance, the radiofrequency probe enters the operation position of the radiofrequency operation object, and the radiofrequency host sends radiofrequency energy to the operation position to complete the ablation of the operation position.
  • a delivery device such as a syringe pump is generally used to deliver a cooling medium (such as physiological saline) to the operating site.
  • a cooling medium such as physiological saline
  • the flow rate of the cooling medium is generally adjusted according to the impedance change of the operating position.
  • the impedance of the operating position does not change much, but the temperature rises rapidly, so that the flow rate of the cooling medium cannot be controlled in time only based on the impedance change.
  • the flow rate control method, electronic device, and computer-readable storage medium provided in the embodiments of the present application can adjust the flow rate of the cooling medium in time according to the impedance variation parameter and the temperature variation parameter.
  • An embodiment of the present application provides a flow rate control method on the one hand, the method comprising:
  • the flow rate of the cooling medium is adjusted.
  • the embodiment of the present application also provides a flow rate control device, including:
  • Obtaining module for obtaining the impedance data and the temperature data of the operation position of radio frequency operation object in real time
  • a calculation module configured to obtain an impedance change parameter according to the impedance data, and obtain a temperature change parameter according to the temperature data;
  • the control module is configured to adjust the flow rate of the cooling medium according to the change parameter of the impedance and the change parameter of the temperature.
  • an embodiment of the present application provides an electronic device, including: a memory and a processor;
  • the memory stores executable program code
  • the processor coupled to the memory invokes the executable program code stored in the memory to execute the flow rate control method provided in the above embodiment.
  • the embodiments of the present application also provide a non-transitory computer-readable storage medium, on which a computer program is stored.
  • a computer program is stored.
  • the flow rate control method provided in the above-mentioned embodiments is implemented.
  • the impedance data and temperature data of the operating position of the radio frequency operation object are obtained in real time; the impedance change parameters are obtained according to the impedance data, and the temperature change parameters are obtained according to the temperature data;
  • the changing parameters are adjusted together, and the flow rate of the cooling medium can be adjusted in time.
  • Fig. 1 is the application environment diagram of the radiofrequency ablation operation provided by the embodiment of the present application.
  • FIG. 2 is a schematic diagram of the top end of the radiofrequency operation catheter in the radiofrequency ablation device provided by the embodiment of the present application;
  • Fig. 3 is the implementation flow chart of the flow rate control method provided by an embodiment of the present application.
  • Fig. 4 is a schematic structural diagram of a flow rate control device provided by an embodiment of the present application.
  • FIG. 5 is a schematic diagram of a hardware structure of an electronic device provided by an embodiment of the present application.
  • FIG. 1 is a schematic diagram of an application scenario of the radio frequency operation ablation operation provided by the embodiment of the present application.
  • the radio frequency host 10 is connected with the syringe pump 20 , the neutral electrode 30 and the radio frequency operation catheter 40 .
  • the energy transmitting end of the radio frequency operation catheter 40 for generating and outputting radio frequency energy and the extension tube (not marked in the figure) of the syringe pump 20 are inserted into the operation object 50 (such as an abnormal tissue mass) block).
  • the neutral electrode 30 is brought into contact with the surface of the operation object 50 .
  • the radiofrequency current flows through the radiofrequency operation catheter 40, the operation object 50, and the neutral electrode 30, thereby forming a loop.
  • the radio frequency host 10 controls the radio frequency operation catheter 40 to output radio frequency energy to the operation site by way of discharge, so as to perform radio frequency operation on the operation site.
  • the syringe pump 20 perfuses the operation object through the extension tube, and pours cooling medium (such as physiological saline) into the operation site to adjust the impedance and temperature of the operation site.
  • FIG. 3 is a flowchart of an implementation of a flow rate control method provided by an embodiment of the present application.
  • This method can be realized by the radio frequency host 10 in FIG. 1 , or other computer terminals connected thereto.
  • the radio frequency host 10 is used as the execution subject in the following embodiments. As shown in Figure 3, the method specifically includes:
  • Step S301 acquiring impedance data and temperature data of the operating position of the radio frequency operating object 50 in real time.
  • the probes 41 are arranged around the central electrode 42 at the top of the radio frequency operation catheter 40 for outputting radio frequency energy, and are respectively located on different planes, forming a claw structure together, and each probe is provided with physical characteristic data (such as temperature data, impedance data) acquisition device, used to acquire the physical characteristic data of the inserted or touched position.
  • physical characteristic data such as temperature data, impedance data
  • the probe contacts the operation position of the radio frequency operation object 50 along with the central electrode.
  • the radio frequency operation object 50 refers to any object or target that can perform radio frequency operations such as radio frequency ablation.
  • the radio frequency operation is radio frequency ablation
  • the radio frequency operation object can be a biological tissue
  • the operation position can be an abnormality on the biological tissue. organize.
  • Step S302 obtaining impedance variation parameters according to the impedance data, and obtaining temperature variation parameters according to the temperature data.
  • the impedance change parameters include but are not limited to the impedance growth rate within a preset time interval, and the slope of the impedance curve within a preset time interval.
  • the temperature change parameters include but are not limited to the slope of the temperature curve within a preset time interval.
  • Step S303 adjusting the flow rate of the cooling medium according to the change parameter of impedance and the change parameter of temperature.
  • the cooling medium can be adjusted to a preset flow rate value, and the flow rate of the cooling medium can also be increased by a preset speed-up value on the current flow rate value, or by a preset The deceleration value reduces the flow rate of the cooling medium.
  • the impedance data and temperature data of the operating position of the radio frequency operation object are acquired in real time; the impedance change parameter is obtained according to the impedance data, and the temperature change parameter is obtained according to the temperature data; according to the impedance change parameter and the temperature change parameter Jointly adjusted, the flow rate of the cooling medium can be adjusted in time.
  • adjusting the flow rate of the cooling medium according to the change parameter of impedance and the change parameter of temperature includes:
  • the preset impedance parameters include, but are not limited to, a preset impedance surge gradient value and a preset impedance deceleration threshold.
  • the first comparison result includes but is not limited to that the impedance change parameter is greater than, equal to or less than a preset impedance parameter, for example, the impedance growth rate within a preset time interval is greater than, equal to or less than a preset impedance surge gradient value, and the preset time The impedance slope within the interval is greater than, equal to, or less than a preset impedance deceleration threshold.
  • the preset temperature parameters include but not limited to a preset temperature increase threshold and a preset temperature deceleration threshold.
  • the second comparison result includes but is not limited to that the temperature change parameter is greater than, equal to or less than a preset temperature parameter, for example, the slope of the temperature curve within a preset time interval is greater than, equal to or less than a temperature growth rate threshold.
  • the cooling medium can be adjusted to a preset flow velocity value, or the flow velocity of the cooling medium can be increased according to a preset speed-up value, or decreased according to a preset deceleration value The flow rate of the cooling medium.
  • the defined change parameter of impedance, the preset impedance parameter, the change parameter of temperature, and the preset The temperature parameters can be the same or different.
  • adjusting the flow rate of the cooling medium according to the first comparison result and the second comparison result includes:
  • increasing the flow rate of the cooling medium may include two stages of coarse adjustment and fine adjustment.
  • the coarse adjustment can be to directly increase the flow rate of the cooling medium to one of the preset multiple flow rate values, for example, increase according to the above step S501;
  • the fine adjustment can be to increase the cooling rate according to the preset speed increase value.
  • the flow rate of the medium is increased, for example, in the manner of step S502 above.
  • the impedance change parameter is the impedance growth rate within a preset time interval
  • the preset impedance parameter is a preset impedance surge gradient value.
  • the formula for calculating the impedance growth rate within a preset time interval is: Among them, K R is the impedance growth rate within a preset time interval, R 2 is the current impedance value, R 1 is the previous impedance value, and the measurement time interval between the current impedance value and the previous impedance value is the preset time interval.
  • the preset flow rate value may be a fixed value, for example fixed at 1ml/min, 2ml/min or 3ml/min.
  • the flow rate of the cooling medium is directly increased to the preset flow rate. If it is determined that the impedance change parameter is less than or equal to the preset impedance parameter, the temperature change parameter and the preset temperature parameter are compared again to obtain a second comparison result.
  • the temperature change parameter is the slope of the temperature curve within a preset time interval
  • the preset temperature parameter is a preset temperature growth rate threshold. Temperature profile slope over preset time intervals Among them, K T is the slope of the temperature curve within the preset time interval, T 2 is the current temperature value, T 1 is the previous temperature value, and t is the preset time interval.
  • the preset speed increase value may be a fixed value, for example, fixed at 0.1ml/min, 0.2ml/min or 0.3ml/min.
  • the preset time interval is 0.2s
  • the current impedance value is 400 ⁇
  • the last impedance value is 380 ⁇
  • the impedance surge gradient value is 5%
  • the preset flow rate value is 2ml/min.
  • Impedance growth rate over preset time intervals The impedance growth rate K R within the preset time interval is greater than 5% of the impedance surge gradient value, which meets the condition that the first comparison result is that the impedance change parameter is greater than the preset impedance parameter, and the flow rate of the cooling medium is adjusted to 2ml/min.
  • the preset time interval is 0.5s
  • the current impedance value is 400 ⁇
  • the previous impedance value is 390 ⁇
  • the impedance surge gradient value is 5%
  • the preset flow rate value is 2ml/min
  • the current temperature value is 38°C
  • the previous temperature value The temperature is 36°C
  • the preset temperature increase threshold is 2
  • the preset increase rate value is 0.1ml/min. Impedance growth rate over preset time intervals If the impedance growth rate K R within the preset time interval is less than 5% of the impedance surge gradient value, then compare the slope of the temperature curve with the preset temperature growth rate threshold. Calculate the slope of the temperature curve within a preset time interval The slope of the temperature curve within the preset time interval is greater than 2.
  • the above situation meets the condition that the first comparison result is that the change parameter of impedance is less than or equal to the preset impedance parameter, and the second comparison result is that the change parameter of temperature is greater than the preset temperature parameter, so the speed can be increased according to the preset speed increase value.
  • Increase the flow rate of the cooling medium by 0.1 ml/min.
  • comparing the impedance change parameter with the preset impedance parameter to obtain the first comparison result may include the following steps S601-S602:
  • the flow rate index number is a preset value in a preset sequence.
  • the flow rate index number is a preset value in a preset sequence
  • the preset sequence may include a plurality of different preset values, each preset value corresponds to an impedance parameter and a flow rate value, and The flow velocity value corresponding to each preset value increases according to the sequence of the preset values in the preset sequence.
  • the preset serial number may include 10 preset values, which are 1, 2, 3 etc. And according to the order of each preset value in the preset sequence, the preset flow rate value corresponding to each preset value increases, for example, the preset flow rate value corresponding to preset value 1 is 0.5ml/min, and the preset value corresponding to preset value 2 The preset flow rate value is 0.7ml/min etc.
  • the preset value included in the preset serial number can also be in other forms, for example, it can be in the form of characters or character strings, such as A, B, C..., etc., which are not limited in this embodiment .
  • the flow rate index number when the method shown in this embodiment is executed for the first time, the flow rate index number may be the first preset value in the preset sequence, such as 1 in Table 1.
  • the flow rate index number can be modified, for example, the flow rate index number can be adjusted according to step S604.
  • the impedance parameter corresponding to the flow rate index number currently set here is the impedance parameter corresponding to the preset value of the flow rate index number.
  • the corresponding impedance parameter is the impedance parameter corresponding to the preset value 1.
  • the preset flow velocity value corresponding to the currently set flow velocity index number described below is also the preset flow velocity value corresponding to the preset value of the flow velocity index number.
  • the corresponding preset flow rate value is the preset flow rate value corresponding to the preset value 1. I won't repeat it later.
  • the change parameter of impedance may include a length ratio of impedance within a preset time interval.
  • the impedance parameter corresponding to the flow rate index number may be the impedance surge gradient shown in Table 1.
  • the impedance parameter corresponding to the currently set flow rate index number can be used as the preset impedance parameter, so that the impedance change parameter can be compared with the preset impedance parameter to obtain the first comparison result.
  • increasing the flow rate of the cooling medium to a preset flow rate value may include the following step S603:
  • the preset values in the preset sequence can be set as flow rate index numbers with a sequence relationship, for example: 1, 2, 3, 4, 5, 6 . . . .
  • Each flow rate index number is correspondingly set with an impedance surge gradient value and a preset flow rate value, as shown in Table 1.
  • Impedance surge gradient value Preset flow rate value 1 5% 0.5ml/min 2 5% 0.7ml/min 3 10% 0.9ml/min 4 10% 1.1ml/min 5 10% 1.2ml/min 6 5% 1.4ml/min 7 5% 1.6ml/min 8 5% 1.8ml/min 9 5% 1.9ml/min 10 5% 2.0ml/min
  • the preset time interval is still 0.2s, the current impedance value is 400 ⁇ , and the last impedance value is 380 ⁇ . Then it can be determined that the impedance surge gradient value corresponding to the flow rate index number "2" is 5%. Based on this, the impedance growth rate within the preset time interval can be Compared with the impedance surge gradient value of 5%, the first comparison result is that the impedance growth rate within the preset time interval is greater than the impedance surge gradient value.
  • the preset flow rate value corresponding to the currently set flow rate index number "2" can be obtained to be 0.7ml/min, and the flow rate value of the cooling medium can be adjusted to 0.7ml/min.
  • the impedance data and temperature data of the operating position of the radio frequency operation object are acquired in real time; the impedance change parameter is obtained according to the impedance data, and the temperature change parameter is obtained according to the temperature data; according to the impedance change parameter and the temperature change parameter Jointly adjusted, the flow rate of the cooling medium can be adjusted in time. After the flow rate is adjusted in time, it can reduce the occurrence of excessive carbonization, tissue adhesion, and impedance surge at the operating position due to excessive temperature, reduce the frequency of radiofrequency ablation products actively stopping ablation due to the above situations, and also reduce the difficulty of using radiofrequency ablation products .
  • the first comparison result is that the change parameter of impedance is less than or equal to the preset impedance parameter
  • the second comparison result is that the change parameter of temperature is less than or equal to the preset temperature parameter
  • the preset speed-up value may be fixed, or may also be obtained according to the above-mentioned method for obtaining the preset speed-up value, which will not be repeated here.
  • the radio frequency host 10 if the impedance growth rate exceeds the maximum impedance surge gradient value, or the temperature slope exceeds the maximum temperature growth rate threshold, the radio frequency host 10 is controlled to stop working.
  • the flow rate value can be gradually adjusted according to the increase of the index number, so as to avoid the rapid increase of the flow rate value and cause the temperature to drop too fast, which will affect the ablation effect.
  • adjusting the flow rate of the cooling medium according to the first comparison result and the second comparison result includes:
  • the change parameter of impedance can be compared with the preset impedance parameter first, if the change parameter of impedance is less than the preset impedance parameter, the flow rate of the cooling connection is reduced according to the preset speed, if not less than, Then compare the temperature change parameter with the preset temperature parameter.
  • the first comparison result is that the change parameter of impedance is greater than or equal to the preset impedance parameter
  • the second comparison result is that the change parameter of temperature is greater than or equal to the preset temperature parameter
  • the impedance change parameter includes the slope of the impedance curve within a preset time interval, and the preset impedance parameter includes a preset impedance deceleration threshold; the temperature change parameter includes the slope of the temperature curve within a preset time interval, and the preset impedance parameter includes a preset time interval.
  • the set temperature parameters include a preset temperature deceleration threshold.
  • the slope of the impedance curve within the preset time interval may be the ratio of the impedance variation within the preset time interval to the preset time interval, for example, Among them, K R is the slope of the impedance curve in the preset time interval, R 2 is the current impedance value, R 1 is the last impedance value, t is the preset time interval, and the measurement time interval between the current impedance value and the last impedance value is Preset time interval t.
  • the slope of the temperature curve in the preset time interval is consistent with the slope of the temperature curve in judging whether to increase the flow rate, which will not be repeated here.
  • the preset impedance deceleration threshold may be a fixed value, such as 0.05 ⁇ /min, 0.1 ⁇ /min or 0.2 ⁇ /min, etc.
  • the preset temperature deceleration threshold can also be fixed, for example, it can be 0.5°C/min, 1°C/min, and so on.
  • the impedance change parameter is compared with a preset impedance parameter to obtain a first comparison result, including:
  • steps S601-S604 For the specific method of the above steps, reference may be made to steps S601-S604, which will not be repeated here.
  • the flow rate index number here may be the same as the flow rate index number in steps S601-S604.
  • the flow rate index number can be set to the next preset value in the preset sequence, so that the determined preset flow rate is the flow rate corresponding to the next preset value ( That is, the preset flow rate increases); after the flow rate is increased according to the fine adjustment method, the flow rate index number remains unchanged.
  • the impedance data and temperature data of the operating position of the radio frequency operation object are acquired in real time; the impedance change parameter is obtained according to the impedance data, and the temperature change parameter is obtained according to the temperature data; according to the impedance change parameter and the temperature change parameter Jointly adjusted, the flow rate of the cooling medium can be adjusted in time.
  • FIG. 4 it is a schematic structural diagram of a flow rate control device provided by an embodiment of the present application. For ease of description, only the parts related to the embodiment of the present application are shown.
  • the device may be a computer terminal, or a software module configured on the computer terminal.
  • the device includes: an acquisition module 101 , a calculation module 102 and a control module 103 .
  • the acquiring module 101 is configured to acquire impedance data and temperature data of an operating position of a radio frequency operating object in real time.
  • the calculation module 102 is configured to obtain an impedance change parameter according to the impedance data, and obtain a temperature change parameter according to the temperature data.
  • the control module 103 is configured to adjust the flow rate of the cooling medium according to the change parameter of the impedance and the change parameter of the temperature.
  • control module 103 is also used to compare the impedance change parameter with a preset impedance parameter to obtain a first comparison result; compare the temperature change parameter with a preset temperature parameter to obtain a second Comparing the result: adjusting the flow rate of the cooling medium according to the first comparison result and the second comparison result.
  • the impedance data and temperature data of the operating position of the radio frequency operation object are acquired in real time; the impedance change parameter is obtained according to the impedance data, and the temperature change parameter is obtained according to the temperature data; according to the impedance change parameter and the temperature change parameter Jointly adjusted, the flow rate of the cooling medium can be adjusted in time.
  • control module 103 is further configured to increase the flow rate of the cooling medium to a preset value if the first comparison result is that the change parameter of the impedance is greater than the preset impedance parameter.
  • Flow rate value if the first comparison result is that the change parameter of the impedance is less than or equal to the preset impedance parameter, and the second comparison result is that the temperature change parameter is greater than the preset temperature parameter , to increase the flow rate of the cooling medium according to a preset increase rate value.
  • control module 103 is also used to obtain the currently set flow rate index number, the flow rate index number is a preset value in the preset sequence; each preset value in the preset sequence corresponds to an impedance parameter and a flow rate value, And the flow velocity value corresponding to each preset value increases according to the order of the preset value in the preset sequence; acquire the impedance parameter corresponding to the currently set flow velocity index number, and compare the change parameter of the impedance with the acquired The obtained impedance parameters are compared to obtain a first comparison result.
  • the control module 103 is further configured to acquire a flow velocity value corresponding to the currently set flow velocity index number, and increase the flow velocity of the cooling medium to the acquired flow velocity value.
  • control module 103 is further configured to set the flow rate index number as the next preset value in the preset sequence.
  • the impedance change parameter includes the impedance growth rate within a preset time interval, and the preset impedance parameter includes a preset impedance surge gradient value; the temperature change parameter includes the impedance growth rate within a preset time interval.
  • the slope of the temperature curve, the preset temperature parameter includes a preset temperature growth rate threshold.
  • the impedance data and temperature data of the operating position of the radio frequency operation object are acquired in real time; the impedance change parameter is obtained according to the impedance data, and the temperature change parameter is obtained according to the temperature data; and the impedance change parameter and the temperature change parameter are jointly adjusted,
  • the flow rate of the cooling medium can be adjusted in time. After the flow rate is adjusted in time, it can reduce the occurrence of excessive carbonization, tissue adhesion, and impedance surge at the operating position due to excessive temperature, reduce the frequency of radiofrequency ablation products actively stopping ablation due to the above situations, and also reduce the difficulty of using radiofrequency ablation products .
  • control module 103 is further configured to: if the first comparison result is that the change parameter of the impedance is less than the preset impedance parameter, or if the second comparison result is the change parameter of the temperature If the change parameter is smaller than the preset temperature parameter, the flow rate of the cooling medium is reduced according to a preset deceleration value.
  • control module 103 is also configured to obtain the currently set flow rate index number, which is a preset value in a preset sequence; obtain the impedance parameter corresponding to the currently set flow rate index number , and compare the change parameter of the impedance with the obtained impedance parameter to obtain a first comparison result.
  • control module 103 is also used to obtain the currently set flow rate index number; obtain the temperature parameter corresponding to the currently set flow rate index number, and compare the temperature change parameter with the obtained The above temperature parameters are compared to obtain a second comparison result.
  • control module 103 is further configured to acquire a deceleration value corresponding to the currently set flow rate index number, and reduce the flow rate of the cooling medium according to the deceleration value.
  • control module 103 is also used to obtain the currently set flow rate index number, and obtain the flow rate value corresponding to the currently set flow rate index number, if the reduced flow rate of the cooling medium is smaller than the obtained flow rate value, Then set the flow rate index number as the last preset value in the preset sequence.
  • the change parameter of impedance includes the slope of the impedance curve within a preset time interval, and the preset impedance parameter includes a preset impedance deceleration threshold; the change parameter of temperature includes the temperature within a preset time interval Curve slope, the preset temperature parameters include a preset temperature deceleration threshold.
  • the impedance data and temperature data of the operating position of the radio frequency operation object are acquired in real time; the impedance change parameter is obtained according to the impedance data, and the temperature change parameter is obtained according to the temperature data; and the impedance change parameter and the temperature change parameter are jointly adjusted,
  • the flow rate of the cooling medium can be adjusted in time.
  • FIG. 5 is a schematic diagram of a hardware structure of an electronic device provided by an embodiment of the present application.
  • an electronic device may be any of various types of computer system devices that are non-removable or removable or portable and that perform wireless or wired communications.
  • the electronic device can be a desktop computer, a server, a mobile phone or a smart phone (for example, based on iPhone TM, a phone based on Android TM), a portable game device (such as Nintendo DS TM, PlayStation Portable TM, Gameboy Advance TM, iPhone TM), laptop computers, PDAs, portable Internet devices, portable medical devices, smart cameras, music players and data storage devices, other handheld devices and such as watches, earphones, pendants, earphones, etc.
  • electronic devices can also be other Wearable devices (eg, such as electronic glasses, electronic clothes, electronic bracelets, electronic necklaces, and other head-mounted devices (HMDs)).
  • HMDs head-mounted devices
  • electronic device 100 may include control circuitry, which may include storage and processing circuitry 300 .
  • the storage and processing circuitry 300 may include memory, such as hard disk drive memory, non-volatile memory (such as flash memory or other electronically programmable limited-erasable memory for forming solid-state drives, etc.), volatile memory (such as static or dynamic Random access memory, etc.), etc., are not limited in this embodiment of the present application.
  • Processing circuitry in storage and processing circuitry 300 may be used to control the operation of electronic device 100 .
  • the processing circuit may be implemented based on one or more microprocessors, microcontrollers, digital signal processors, baseband processors, power management units, audio codec chips, application specific integrated circuits, display driver integrated circuits, and the like.
  • the storage and processing circuit 300 can be used to run software in the electronic device 100, such as Internet browsing applications, Voice over Internet Protocol (Voice over Internet Protocol, VOIP) phone calling applications, email applications, media playback applications, operating system functions wait.
  • These software can be used to perform control operations such as camera based image acquisition, ambient light measurement based on ambient light sensor, proximity sensor based measurement based on proximity sensor, information based on status indicators such as status indicators such as LEDs Display functions, touch sensor based touch event detection, functions associated with displaying information on multiple (e.g. layered) displays, operations associated with performing wireless communication functions, operations associated with collecting and generating audio signals , control operations associated with collecting and processing button press event data, and other functions in the electronic device 100 are not limited by this embodiment of the present application.
  • the memory stores executable program codes
  • the processor coupled to the memory invokes the executable program codes stored in the memory to execute the flow rate control methods described in the foregoing embodiments.
  • the executable program code includes various modules in the flow rate control device described in the above embodiment shown in FIG. 4 , for example: acquisition module 101 , calculation module 102 , control module 103 and so on.
  • acquisition module 101 acquisition module 101 , calculation module 102 , control module 103 and so on.
  • the electronic device 100 may also include an input/output circuit 420 .
  • the input/output circuit 420 can be used to enable the electronic device 100 to realize data input and output, that is, allow the electronic device 100 to receive data from external devices and also allow the electronic device 100 to output data from the electronic device 100 to external devices.
  • the input/output circuit 420 may further include the sensor 320 .
  • the sensor 320 can include an ambient light sensor, a proximity sensor based on light and capacitance, a touch sensor (for example, based on an optical touch sensor and/or a capacitive touch sensor, wherein the touch sensor can be a part of the touch screen or can be used as a The touch sensor structure is used independently), the acceleration sensor, and other sensors, etc.
  • Input/output circuitry 420 may also include one or more displays, such as display 140 .
  • the display 140 may include one or a combination of liquid crystal displays, organic light emitting diode displays, electronic ink displays, plasma displays, and displays using other display technologies.
  • Display 140 may include a touch sensor array (ie, display 140 may be a touchscreen display).
  • the touch sensor may be a capacitive touch sensor formed from an array of transparent touch sensor electrodes such as indium tin oxide (ITO) electrodes, or may be a touch sensor formed using other touch technologies such as acoustic touch, pressure sensitive touch, resistive touch Touch, optical touch, etc. are not limited in this embodiment of the application.
  • ITO indium tin oxide
  • the electronic device 100 may also include an audio component 360 .
  • the audio component 360 may be used to provide audio input and output functions for the electronic device 100 .
  • the audio components 360 in the electronic device 100 may include speakers, microphones, buzzers, tone generators, and other components for generating and detecting sounds.
  • the communication circuit 380 can be used to provide the electronic device 100 with the ability to communicate with external devices.
  • Communications circuitry 380 may include analog and digital input/output interface circuitry, and wireless communications circuitry based on radio frequency energy and/or optical signals.
  • Wireless communication circuitry in communication circuitry 380 may include radio frequency transceiver circuitry, power amplifier circuitry, low noise amplifiers, switches, filters, and antennas.
  • the wireless communication circuit in the communication circuit 380 may include a circuit for supporting Near Field Communication (NFC) by transmitting and receiving near-field coupled electromagnetic signals.
  • NFC Near Field Communication
  • communication circuitry 380 may include a near field communication antenna and a near field communication transceiver.
  • Communications circuitry 380 may also include cellular telephone transceiver circuitry and antennas, wireless local area network transceiver circuitry and antennas, and the like.
  • the electronic device 100 may further include a battery, a power management circuit and other input/output units 400 .
  • the input/output unit 400 may include buttons, joystick, click wheel, scroll wheel, touch pad, keypad, keyboard, camera, light emitting diodes and other status indicators, and the like.
  • a user can input commands through the I/O circuit 420 to control the operation of the electronic device 100 , and can use the output data of the I/O circuit 420 to receive status information and other outputs from the electronic device 100 .
  • the embodiment of the present application also provides a non-transitory computer-readable storage medium, which can be configured in the server in each of the above-mentioned embodiments, and the non-transitory computer-readable storage medium
  • a computer program is stored on the medium, and when the program is executed by the processor, the flow rate control methods described in the foregoing embodiments are implemented.
  • modules/units and algorithm steps of the examples described in conjunction with the embodiments disclosed herein can be implemented by electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are executed by hardware or software depends on the specific application and design constraints of the technical solution. Skilled artisans may use different methods to implement the described functions for each specific application, but such implementation should not be regarded as exceeding the scope of the present invention.
  • the disclosed device/terminal and method may be implemented in other ways.
  • the device/terminal embodiments described above are only illustrative.
  • the division of modules or units is only a logical function division. There may be other division methods in actual implementation.
  • multiple units or components can be Incorporation may either be integrated into another system, or some features may be omitted, or not implemented.
  • the mutual coupling or direct coupling or communication connection shown or discussed may be through some interfaces, and the indirect coupling or communication connection of devices or units may be in electrical, mechanical or other forms.
  • a unit described as a separate component may or may not be physically separated, and a component displayed as a unit may or may not be a physical unit, that is, it may be located in one place, or may be distributed to multiple network units. Part or all of the units can be selected according to actual needs to achieve the purpose of the solution of this embodiment.
  • each functional unit in each embodiment of the present invention may be integrated into one processing unit, each unit may exist separately physically, or two or more units may be integrated into one unit.
  • the above-mentioned integrated units can be implemented in the form of hardware or in the form of software functional units.
  • the integrated unit is realized in the form of a software function unit and sold or used as an independent product, it can be stored in a computer-readable storage medium.
  • the present invention implements all or part of the processes in the methods of the above embodiments, and may also be completed by instructing related hardware through computer programs.
  • the computer program can be stored in a computer-readable storage medium, and when the computer program is executed by a processor, the steps of the above-mentioned various method embodiments can be realized.
  • the computer program includes computer program code, and the computer program code can be in the form of source code, object code, executable file or some intermediate form, etc.
  • the computer readable medium may include: any entity or device capable of carrying computer program code, recording medium, U disk, removable hard disk, magnetic disk, optical disk, computer memory, read-only memory (ROM, Read-Only Memory), random access Memory (RAM, Random Access Memory), electrical carrier signal, telecommunication signal and software distribution medium, etc.
  • ROM Read-Only Memory
  • RAM random access Memory
  • electrical carrier signal telecommunication signal and software distribution medium, etc.
  • computer readable media may be appropriately increased or decreased according to the requirements of legislation and patent practice in the jurisdiction.
  • computer readable media does not include It is an electrical carrier signal and a telecommunication signal.

Abstract

A flow rate control method, an electronic device and a computer-readable storage medium. The method comprises: acquiring impedance data and temperature data of an operation position of a radio-frequency operation object in real time; obtaining an impedance change parameter according to the impedance data, and obtaining a temperature change parameter according to the temperature data; and adjusting the flow rate of a cooling medium according to the impedance change parameter and the temperature change parameter. Adjustment is performed according to both an impedance change parameter and a temperature change parameter, so as to adjust the flow rate of a cooling medium in a timely manner.

Description

流速控制方法、电子装置及计算机可读存储介质Flow rate control method, electronic device and computer readable storage medium 技术领域technical field
本申请实施例涉及数据处理技术领域,尤其涉及一种流速控制方法、电子装置及计算机可读存储介质。The embodiments of the present application relate to the technical field of data processing, and in particular to a flow rate control method, an electronic device, and a computer-readable storage medium.
背景技术Background technique
射频消融是在图像引导下,射频探头进入射频操作对象的操作位置,射频主机发送射频能量施加在该操作位置上,对该操作位置完成消融。射频消融过程中,一般会使用注射泵等输送装置向操作位置输送冷却介质(如生理盐水),通过控制冷却介质的流速,可以调节操作位置的温度。In radiofrequency ablation, under image guidance, the radiofrequency probe enters the operation position of the radiofrequency operation object, and the radiofrequency host sends radiofrequency energy to the operation position to complete the ablation of the operation position. In the process of radiofrequency ablation, a delivery device such as a syringe pump is generally used to deliver a cooling medium (such as physiological saline) to the operating site. By controlling the flow rate of the cooling medium, the temperature of the operating site can be adjusted.
相关技术中,一般根据操作位置的阻抗变化来调节冷却介质的流速。但在消融初期,操作位置的阻抗变化不大,温度却会快速上升,使得仅根据阻抗变化并不能及时控制冷却介质的流速。In the related art, the flow rate of the cooling medium is generally adjusted according to the impedance change of the operating position. However, in the initial stage of ablation, the impedance of the operating position does not change much, but the temperature rises rapidly, so that the flow rate of the cooling medium cannot be controlled in time only based on the impedance change.
发明内容Contents of the invention
本申请实施例提供的流速控制方法、电子装置及计算机可读存储介质,根据阻抗的变化参数及温度的变化参数共同调整,可及时调整冷却介质的流速。The flow rate control method, electronic device, and computer-readable storage medium provided in the embodiments of the present application can adjust the flow rate of the cooling medium in time according to the impedance variation parameter and the temperature variation parameter.
本申请实施例一方面提供了一种流速控制方法,所述方法包括:An embodiment of the present application provides a flow rate control method on the one hand, the method comprising:
实时获取射频操作对象的操作位置的阻抗数据以及温度数据;Obtain the impedance data and temperature data of the operating position of the radio frequency operating object in real time;
根据所述阻抗数据得到阻抗的变化参数,根据所述温度数据得到温度的变化参数;Obtaining a change parameter of impedance according to the impedance data, and obtaining a change parameter of temperature according to the temperature data;
根据所述阻抗的变化参数以及所述温度的变化参数,调整冷却介质的流速。According to the change parameter of the impedance and the change parameter of the temperature, the flow rate of the cooling medium is adjusted.
本申请实施例一方面还提供了一种流速控制装置,包括:On the one hand, the embodiment of the present application also provides a flow rate control device, including:
获取模块,用于实时获取射频操作对象的操作位置的阻抗数据以及温度 数据;Obtaining module, for obtaining the impedance data and the temperature data of the operation position of radio frequency operation object in real time;
计算模块,用于根据所述阻抗数据得到阻抗的变化参数,根据所述温度数据得到温度的变化参数;A calculation module, configured to obtain an impedance change parameter according to the impedance data, and obtain a temperature change parameter according to the temperature data;
控制模块,用于根据所述阻抗的变化参数以及所述温度的变化参数,调整冷却介质的流速。The control module is configured to adjust the flow rate of the cooling medium according to the change parameter of the impedance and the change parameter of the temperature.
本申请实施例一方面还提供了一种电子装置,包括:存储器和处理器;On the one hand, an embodiment of the present application provides an electronic device, including: a memory and a processor;
所述存储器存储有可执行程序代码;The memory stores executable program code;
与所述存储器耦合的所述处理器,调用所述存储器中存储的所述可执行程序代码,执行如上述实施例提供的流速控制方法。The processor coupled to the memory invokes the executable program code stored in the memory to execute the flow rate control method provided in the above embodiment.
本申请实施例一方面还提供一种非暂时性计算机可读存储介质,其上存储有计算机程序,所述计算机程序在被处理器运行时,实现如上述实施例提供的流速控制方法。On the one hand, the embodiments of the present application also provide a non-transitory computer-readable storage medium, on which a computer program is stored. When the computer program is run by a processor, the flow rate control method provided in the above-mentioned embodiments is implemented.
本申请提供的各实施例,通过实时获取射频操作对象的操作位置的阻抗数据以及温度数据;根据阻抗数据得到阻抗的变化参数,根据温度数据得到温度的变化参数;根据阻抗的变化参数及温度的变化参数共同调整,可及时调整冷却介质的流速。In each embodiment provided by this application, the impedance data and temperature data of the operating position of the radio frequency operation object are obtained in real time; the impedance change parameters are obtained according to the impedance data, and the temperature change parameters are obtained according to the temperature data; The changing parameters are adjusted together, and the flow rate of the cooling medium can be adjusted in time.
附图说明Description of drawings
为了更清楚地说明本申请实施例或现有技术中的技术方案,下面将对实施例或现有技术描述中所需要使用的附图作一简单地介绍,显而易见地,下面描述中的附图是本申请的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动性的前提下,还可以根据这些附图获得其他的附图。In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description These are some embodiments of the present application. Those skilled in the art can also obtain other drawings based on these drawings without any creative effort.
图1为本申请实施例提供的射频消融操作的应用环境图;Fig. 1 is the application environment diagram of the radiofrequency ablation operation provided by the embodiment of the present application;
图2为本申请实施例提供的射频消融设备中射频操作导管顶端的示意图;2 is a schematic diagram of the top end of the radiofrequency operation catheter in the radiofrequency ablation device provided by the embodiment of the present application;
图3为本申请一实施例提供的流速控制方法的实现流程图;Fig. 3 is the implementation flow chart of the flow rate control method provided by an embodiment of the present application;
图4为本申请一实施例提供的流速控制装置的结构示意图;Fig. 4 is a schematic structural diagram of a flow rate control device provided by an embodiment of the present application;
图5为本申请一实施例提供的电子装置的硬件结构示意图。FIG. 5 is a schematic diagram of a hardware structure of an electronic device provided by an embodiment of the present application.
具体实施方式Detailed ways
为使本申请实施例的目的、技术方案和优点更加清楚,下面将结合本申请实施例中的附图,对本申请实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例是本申请一部分实施例,而不是全部的实施例。基于本申请中的实施例,本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例,都属于本申请保护的范围。In order to make the purposes, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments It is a part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of this application.
参见图1,图1是本申请实施例提供的射频操消融操作的应用场景示意图。射频主机10连接注射泵20、中性电极30以及射频操作导管40。Referring to FIG. 1 , FIG. 1 is a schematic diagram of an application scenario of the radio frequency operation ablation operation provided by the embodiment of the present application. The radio frequency host 10 is connected with the syringe pump 20 , the neutral electrode 30 and the radio frequency operation catheter 40 .
具体的,在执行操作任务前,首先,将用于产生和输出射频能量的射频操作导管40的能量发射端和注射泵20的延长管(图中未标示)插入操作对象50(如一异常组织团块)中。然后,将中性电极30与操作对象50的表面接触。射频电流流过射频操作导管40、操作对象50和中性电极30,从而形成回路。Specifically, before performing the operation task, at first, the energy transmitting end of the radio frequency operation catheter 40 for generating and outputting radio frequency energy and the extension tube (not marked in the figure) of the syringe pump 20 are inserted into the operation object 50 (such as an abnormal tissue mass) block). Then, the neutral electrode 30 is brought into contact with the surface of the operation object 50 . The radiofrequency current flows through the radiofrequency operation catheter 40, the operation object 50, and the neutral electrode 30, thereby forming a loop.
当操作任务被触发时,射频主机10控制射频操作导管40通过放电的方式,向操作部位输出射频能量,以对该操作部位执行射频操作。同时,注射泵20通过延长管对操作对象执行灌注操作,向该操作部位灌注冷却介质(如生理盐水),以调整操作部位的阻抗和温度。When the operation task is triggered, the radio frequency host 10 controls the radio frequency operation catheter 40 to output radio frequency energy to the operation site by way of discharge, so as to perform radio frequency operation on the operation site. At the same time, the syringe pump 20 perfuses the operation object through the extension tube, and pours cooling medium (such as physiological saline) into the operation site to adjust the impedance and temperature of the operation site.
参见图3,图3是本申请一实施例提供的流速控制方法的实现流程图。该方法可通过图1中的射频主机10,或者,与其连接的其他计算机终端实现,为便于说明,以下实施例中均以射频主机10为执行主体。如图3所示,该方法具体包括:Referring to FIG. 3 , FIG. 3 is a flowchart of an implementation of a flow rate control method provided by an embodiment of the present application. This method can be realized by the radio frequency host 10 in FIG. 1 , or other computer terminals connected thereto. For the convenience of description, the radio frequency host 10 is used as the execution subject in the following embodiments. As shown in Figure 3, the method specifically includes:
步骤S301、实时获取射频操作对象50的操作位置的阻抗数据及温度数据。Step S301 , acquiring impedance data and temperature data of the operating position of the radio frequency operating object 50 in real time.
如图2所示,探针41围绕射频操作导管40顶端用于输出射频能量的中心电极42设置,并分别位于不同的平面,共同构成爪型结构,每一个探针上均设置有物理特征数据(如温度数据、阻抗数据)采集装置,用于获取扎入或触碰的位置的物理特征数据。As shown in Figure 2, the probes 41 are arranged around the central electrode 42 at the top of the radio frequency operation catheter 40 for outputting radio frequency energy, and are respectively located on different planes, forming a claw structure together, and each probe is provided with physical characteristic data (such as temperature data, impedance data) acquisition device, used to acquire the physical characteristic data of the inserted or touched position.
具体地,在射频主机10控制射频操作导管40进行射频操作时,探针随着中心电极接触到射频操作对象50的操作位置。Specifically, when the radio frequency host 10 controls the radio frequency operation catheter 40 to perform radio frequency operation, the probe contacts the operation position of the radio frequency operation object 50 along with the central electrode.
该射频操作对象50是指任何可以进行射频消融等射频操作的对象、目标,例如,当射频操作为射频消融时,该射频操作对象可以是生物体组织,操作位置可以是生物体组织上的异常组织。The radio frequency operation object 50 refers to any object or target that can perform radio frequency operations such as radio frequency ablation. For example, when the radio frequency operation is radio frequency ablation, the radio frequency operation object can be a biological tissue, and the operation position can be an abnormality on the biological tissue. organize.
步骤S302、根据阻抗数据得到阻抗的变化参数,根据温度数据得到温度的变化参数。Step S302 , obtaining impedance variation parameters according to the impedance data, and obtaining temperature variation parameters according to the temperature data.
在本申请实施例中,阻抗的变化参数包括但不限于预设时间间隔内的阻抗增长率、预设时间间隔内的阻抗曲线斜率。温度的变化参数包括但不限于预设时间间隔内的温度曲线斜率。In the embodiment of the present application, the impedance change parameters include but are not limited to the impedance growth rate within a preset time interval, and the slope of the impedance curve within a preset time interval. The temperature change parameters include but are not limited to the slope of the temperature curve within a preset time interval.
步骤S303、根据阻抗的变化参数以及温度的变化参数,调整冷却介质的流速。Step S303, adjusting the flow rate of the cooling medium according to the change parameter of impedance and the change parameter of temperature.
在本实施例中,根据阻抗的变化参数以及温度的变化参数,可将冷却介质调整为预设流速值,也在当前流速值上按预设增速值增加冷却介质的流速,或按预设减速值减小冷却介质的流速。In this embodiment, according to the change parameter of impedance and the change parameter of temperature, the cooling medium can be adjusted to a preset flow rate value, and the flow rate of the cooling medium can also be increased by a preset speed-up value on the current flow rate value, or by a preset The deceleration value reduces the flow rate of the cooling medium.
本申请的实施例,通过实时获取射频操作对象的操作位置的阻抗数据以及温度数据;根据阻抗数据得到阻抗的变化参数,根据温度数据得到温度的变化参数;根据阻抗的变化参数及温度的变化参数共同调整,可及时调整冷却介质的流速。In the embodiment of the present application, the impedance data and temperature data of the operating position of the radio frequency operation object are acquired in real time; the impedance change parameter is obtained according to the impedance data, and the temperature change parameter is obtained according to the temperature data; according to the impedance change parameter and the temperature change parameter Jointly adjusted, the flow rate of the cooling medium can be adjusted in time.
在本申请一实施例中,根据阻抗的变化参数以及温度的变化参数,调整冷却介质的流速,包括:In an embodiment of the present application, adjusting the flow rate of the cooling medium according to the change parameter of impedance and the change parameter of temperature includes:
S401、将阻抗的变化参数与预设的阻抗参数进行比较,获得第一比较结果。S401. Comparing an impedance change parameter with a preset impedance parameter to obtain a first comparison result.
在本实施例中,预设的阻抗参数包括但不限于预设的阻抗激增梯度值、预设的阻抗减速阈值。第一比较结果包括但不限于阻抗的变化参数大于、等于或小于预设的阻抗参数,例如,预设时间间隔内的阻抗增长率大于、等于或小于预设的阻抗激增梯度值,预设时间间隔内的阻抗斜率大于、等于或小于预设的阻抗减速阈值。In this embodiment, the preset impedance parameters include, but are not limited to, a preset impedance surge gradient value and a preset impedance deceleration threshold. The first comparison result includes but is not limited to that the impedance change parameter is greater than, equal to or less than a preset impedance parameter, for example, the impedance growth rate within a preset time interval is greater than, equal to or less than a preset impedance surge gradient value, and the preset time The impedance slope within the interval is greater than, equal to, or less than a preset impedance deceleration threshold.
S402、将温度的变化参数与预设的温度参数进行比较,获得第二比较结果。S402. Comparing the temperature change parameter with a preset temperature parameter to obtain a second comparison result.
在本实施例中,预设的温度参数包括但不限于预设的温度增速阈值、预设的温度减速阈值。第二比较结果包括但不限于温度的变化参数大于、等于或小于预设的温度参数,例如,预设时间间隔内的温度曲线斜率大于、等于或小于温度增速阈值。In this embodiment, the preset temperature parameters include but not limited to a preset temperature increase threshold and a preset temperature deceleration threshold. The second comparison result includes but is not limited to that the temperature change parameter is greater than, equal to or less than a preset temperature parameter, for example, the slope of the temperature curve within a preset time interval is greater than, equal to or less than a temperature growth rate threshold.
S403、根据第一比较结果以及第二比较结果调整冷却介质的流速。S403. Adjust the flow rate of the cooling medium according to the first comparison result and the second comparison result.
在本实施例中,根据第一比较结果以及第二比较结果,可以将冷却介质调整为预设流速值,也可以按预设增速值增加冷却介质的流速,或按预设减速值减小冷却介质的流速。In this embodiment, according to the first comparison result and the second comparison result, the cooling medium can be adjusted to a preset flow velocity value, or the flow velocity of the cooling medium can be increased according to a preset speed-up value, or decreased according to a preset deceleration value The flow rate of the cooling medium.
在一个实施例中,针对确定是否增加冷却介质的流速和确定是否减小冷却介质的流速这两种情况,所定义的阻抗的变化参数、预设的阻抗参数、温度的变化参数、以及预设的温度参数可以是相同的,也可以是不同的。In one embodiment, for determining whether to increase the flow rate of the cooling medium and determining whether to decrease the flow rate of the cooling medium, the defined change parameter of impedance, the preset impedance parameter, the change parameter of temperature, and the preset The temperature parameters can be the same or different.
在本申请一实施例中,根据第一比较结果以及第二比较结果,调整冷却介质的流速,包括:In an embodiment of the present application, adjusting the flow rate of the cooling medium according to the first comparison result and the second comparison result includes:
S501、若第一比较结果为阻抗的变化参数大于预设的阻抗参数,将冷却介质的流速增大为预设流速值。S501. If the first comparison result is that the impedance change parameter is greater than a preset impedance parameter, increase the flow rate of the cooling medium to a preset flow rate value.
S502、若第一比较结果为阻抗的变化参数小于或等于预设的阻抗参数,且第二比较结果为温度的变化参数大于预设的温度参数,按照预设增速值增大冷却介质的流速。S502. If the first comparison result is that the impedance change parameter is less than or equal to the preset impedance parameter, and the second comparison result is that the temperature change parameter is greater than the preset temperature parameter, increase the flow rate of the cooling medium according to the preset speed increase value .
在一个实施例中,增大冷却介质的流速可以包括粗调和细调两个阶段。其中,粗调可以为直接将冷却介质的流速增大为预设的多个流速值中的一个,例如按照上述步骤S501的方式进行增大;细调可以为按照预设增速值增大冷却介质的流速,例如按照上述步骤S502的方式进行增大。In one embodiment, increasing the flow rate of the cooling medium may include two stages of coarse adjustment and fine adjustment. Among them, the coarse adjustment can be to directly increase the flow rate of the cooling medium to one of the preset multiple flow rate values, for example, increase according to the above step S501; the fine adjustment can be to increase the cooling rate according to the preset speed increase value. The flow rate of the medium is increased, for example, in the manner of step S502 above.
在本实施例中,阻抗的变化参数为预设时间间隔内的阻抗增长率,预设的阻抗参数为预设的阻抗激增梯度值。预设时间间隔内的阻抗增长率的计算公式为:
Figure PCTCN2022137404-appb-000001
其中,K R是预设时间间隔内的阻抗增长率,R 2是当前阻抗值,R 1是上一个阻抗值,当前阻抗值与上一个阻抗值的测量时间间 隔为预设时间间隔。
In this embodiment, the impedance change parameter is the impedance growth rate within a preset time interval, and the preset impedance parameter is a preset impedance surge gradient value. The formula for calculating the impedance growth rate within a preset time interval is:
Figure PCTCN2022137404-appb-000001
Among them, K R is the impedance growth rate within a preset time interval, R 2 is the current impedance value, R 1 is the previous impedance value, and the measurement time interval between the current impedance value and the previous impedance value is the preset time interval.
可选地,预设流速值可以是固定值,例如固定为1ml/min、2ml/min或3ml/min等。或者,在另一个实施例中,预设流速值可以有多个,在不同的情况下可以选择不同的预设流速值,具体在下文结合步骤S601-S603以及表1进行说明,这里暂不赘述。Optionally, the preset flow rate value may be a fixed value, for example fixed at 1ml/min, 2ml/min or 3ml/min. Or, in another embodiment, there can be multiple preset flow velocity values, and different preset flow velocity values can be selected under different circumstances, which will be described in detail below in conjunction with steps S601-S603 and Table 1, and will not be repeated here .
在本实施例中,若确定阻抗的变化参数大于预设的阻抗参数,则直接将冷却介质的流速增大为预设的流速。若确定阻抗的变化参数小于或等于预设的阻抗参数,则再次比较温度的变化参数与预设的温度参数,得到第二比较结果。In this embodiment, if it is determined that the impedance change parameter is greater than the preset impedance parameter, the flow rate of the cooling medium is directly increased to the preset flow rate. If it is determined that the impedance change parameter is less than or equal to the preset impedance parameter, the temperature change parameter and the preset temperature parameter are compared again to obtain a second comparison result.
在本实施例中,温度的变化参数为预设时间间隔内的温度曲线斜率,预设的温度参数为预设的温度增速阈值。预设时间间隔内的温度曲线斜率
Figure PCTCN2022137404-appb-000002
其中,K T是预设时间间隔内的温度曲线斜率,T 2是当前温度值,T 1是上一个温度值,t是预设时间间隔。可选地,预设增速值可以是固定值,例如固定为0.1ml/min、0.2ml/min或0.3ml/min等。
In this embodiment, the temperature change parameter is the slope of the temperature curve within a preset time interval, and the preset temperature parameter is a preset temperature growth rate threshold. Temperature profile slope over preset time intervals
Figure PCTCN2022137404-appb-000002
Among them, K T is the slope of the temperature curve within the preset time interval, T 2 is the current temperature value, T 1 is the previous temperature value, and t is the preset time interval. Optionally, the preset speed increase value may be a fixed value, for example, fixed at 0.1ml/min, 0.2ml/min or 0.3ml/min.
示例性地,当预设时间间隔为0.2s,当前阻抗值为400Ω,上一个阻抗值为380Ω,阻抗激增梯度值为5%,预设流速值为2ml/min。预设时间间隔内的阻抗增长率
Figure PCTCN2022137404-appb-000003
预设时间间隔内的阻抗增长率K R大于阻抗激增梯度值5%,符合第一比较结果为阻抗的变化参数大于预设的阻抗参数的条件,将冷却介质的流速调整为2ml/min。
Exemplarily, when the preset time interval is 0.2s, the current impedance value is 400Ω, the last impedance value is 380Ω, the impedance surge gradient value is 5%, and the preset flow rate value is 2ml/min. Impedance growth rate over preset time intervals
Figure PCTCN2022137404-appb-000003
The impedance growth rate K R within the preset time interval is greater than 5% of the impedance surge gradient value, which meets the condition that the first comparison result is that the impedance change parameter is greater than the preset impedance parameter, and the flow rate of the cooling medium is adjusted to 2ml/min.
当预设时间间隔为0.5s,当前阻抗值为400Ω,上一个阻抗值为390Ω,阻抗激增梯度值为5%,预设流速值为2ml/min,当前温度值为38℃,上一个温度值为36℃,预设的温度增速阈值为2,预设增速值为0.1ml/min。预设时间间隔内的阻抗增长率
Figure PCTCN2022137404-appb-000004
预设时间间隔内的阻抗增长率K R小于阻抗激增梯度值5%,则再比较温度曲线斜率与预设的温度增速阈值。计算得到预设时间间隔内的温度曲线斜率
Figure PCTCN2022137404-appb-000005
预设时间间隔内的温度曲线斜率大于2。可见,上述情况符合第一比较结果为阻抗的变化参数小于或等于预设的阻抗参数,且第二比较结果为温度的变化参数大于预设的温度参数的条件,因此可以按照预设增速值0.1ml/min增大冷却介质的流速。
When the preset time interval is 0.5s, the current impedance value is 400Ω, the previous impedance value is 390Ω, the impedance surge gradient value is 5%, the preset flow rate value is 2ml/min, the current temperature value is 38°C, and the previous temperature value The temperature is 36°C, the preset temperature increase threshold is 2, and the preset increase rate value is 0.1ml/min. Impedance growth rate over preset time intervals
Figure PCTCN2022137404-appb-000004
If the impedance growth rate K R within the preset time interval is less than 5% of the impedance surge gradient value, then compare the slope of the temperature curve with the preset temperature growth rate threshold. Calculate the slope of the temperature curve within a preset time interval
Figure PCTCN2022137404-appb-000005
The slope of the temperature curve within the preset time interval is greater than 2. It can be seen that the above situation meets the condition that the first comparison result is that the change parameter of impedance is less than or equal to the preset impedance parameter, and the second comparison result is that the change parameter of temperature is greater than the preset temperature parameter, so the speed can be increased according to the preset speed increase value. Increase the flow rate of the cooling medium by 0.1 ml/min.
在本实施例中,将阻抗的变化参数与预设的阻抗参数进行比较,获得第一比较结果,可以包括如下步骤S601-S602:In this embodiment, comparing the impedance change parameter with the preset impedance parameter to obtain the first comparison result may include the following steps S601-S602:
S601、获取当前设置的流速索引号。S601. Obtain the currently set flow rate index number.
在一个实施例中,流速索引号为预设序列中的一个预设值。In one embodiment, the flow rate index number is a preset value in a preset sequence.
可选地,流速索引号为预设序列中的一个预设值,该所述预设序列中可以包括多个不同的预设值,各预设值分别对应一个阻抗参数以及一个流速值,且各预设值对应的流速值按照预设值在预设序列中的排序增大。Optionally, the flow rate index number is a preset value in a preset sequence, and the preset sequence may include a plurality of different preset values, each preset value corresponds to an impedance parameter and a flow rate value, and The flow velocity value corresponding to each preset value increases according to the sequence of the preset values in the preset sequence.
如下表1所示,预设序列号可以包括10个预设值,分别为1、2、3.....10。且按照各预设值在预设序列中的排序,各预设值对应的预设流速值增大,例如预设值1对应的预设流速值为0.5ml/min,预设值2对应的预设流速值为0.7ml/min等。As shown in Table 1 below, the preset serial number may include 10 preset values, which are 1, 2, 3.....10. And according to the order of each preset value in the preset sequence, the preset flow rate value corresponding to each preset value increases, for example, the preset flow rate value corresponding to preset value 1 is 0.5ml/min, and the preset value corresponding to preset value 2 The preset flow rate value is 0.7ml/min etc.
当然,这里只是示例性说明,预设序列号包括的预设值也可以是其他形式的,例如可以为字符或字符串形式,例如A、B、C...等,本实施例不进行限定。Of course, this is just an example, and the preset value included in the preset serial number can also be in other forms, for example, it can be in the form of characters or character strings, such as A, B, C..., etc., which are not limited in this embodiment .
在一个实施例中,在首次执行本实施例所示方法时,流速索引号可以为预设序列中的首个预设值,例如表1中的1。在后续执行过程中,该流速索引号可以修改设置,例如可以按照步骤S604来调整流速索引号。In one embodiment, when the method shown in this embodiment is executed for the first time, the flow rate index number may be the first preset value in the preset sequence, such as 1 in Table 1. In the subsequent execution process, the flow rate index number can be modified, for example, the flow rate index number can be adjusted according to step S604.
S602、获取与当前设置的流速索引号对应的阻抗参数,并将阻抗的变化参数与获取到的阻抗参数进行比较,获得第一比较结果。S602. Obtain an impedance parameter corresponding to the currently set flow rate index number, and compare an impedance change parameter with the obtained impedance parameter to obtain a first comparison result.
需要说明的是,这里当前设置的流速索引号对应的阻抗参数,即为该流速索引号所取值的预设值对应的阻抗参数。例如,流速索引号为预设序列中的预设值1,则对应的阻抗参数为预设值1对应的阻抗参数。同样的,下文所述的当前设置的流速索引号对应的预设流速值,也为该流速索引号所取值的预设值对应的预设流速值。例如,流速索引号为预设序列中的预设值1,则对应的预设流速值为预设值1对应的预设流速值。之后不再赘述。It should be noted that the impedance parameter corresponding to the flow rate index number currently set here is the impedance parameter corresponding to the preset value of the flow rate index number. For example, if the flow rate index number is the preset value 1 in the preset sequence, the corresponding impedance parameter is the impedance parameter corresponding to the preset value 1. Similarly, the preset flow velocity value corresponding to the currently set flow velocity index number described below is also the preset flow velocity value corresponding to the preset value of the flow velocity index number. For example, if the flow rate index number is the preset value 1 in the preset sequence, the corresponding preset flow rate value is the preset flow rate value corresponding to the preset value 1. I won't repeat it later.
在一个实施例中,阻抗的变化参数可以包括预设时间间隔内的阻抗的长率。对应的,流速索引号对应的阻抗参数可以为表1所示的阻抗激增梯度。In an embodiment, the change parameter of impedance may include a length ratio of impedance within a preset time interval. Correspondingly, the impedance parameter corresponding to the flow rate index number may be the impedance surge gradient shown in Table 1.
需要说明的是,这里可以将当前设置的流速索引号对应的阻抗参数,作 为预设的阻抗参数,从而可以将阻抗的变化参数与该预设的阻抗参数进行比较,得到第一比较结果。It should be noted that here, the impedance parameter corresponding to the currently set flow rate index number can be used as the preset impedance parameter, so that the impedance change parameter can be compared with the preset impedance parameter to obtain the first comparison result.
在本实施例中,将冷却介质的流速增大为预设流速值,可以包括如下步骤S603:In this embodiment, increasing the flow rate of the cooling medium to a preset flow rate value may include the following step S603:
S603、获取与当前设置的流速索引号对应的流速值,并将冷却介质的流速增大为该获取到的流速值。S603. Obtain a flow velocity value corresponding to the currently set flow velocity index number, and increase the flow velocity of the cooling medium to the acquired flow velocity value.
在本实施例中,预设序列中的预设值可以设置为具有顺序关系的流速索引号,例如:1、2、3、4、5、6......。每个流速索引号对应设置有阻抗激增梯度值以及预设流速值,如表1所示。In this embodiment, the preset values in the preset sequence can be set as flow rate index numbers with a sequence relationship, for example: 1, 2, 3, 4, 5, 6 . . . . Each flow rate index number is correspondingly set with an impedance surge gradient value and a preset flow rate value, as shown in Table 1.
表1Table 1
流速索引号Velocity Index Number 阻抗激增梯度值Impedance surge gradient value 预设流速值Preset flow rate value
11 5%5% 0.5ml/min0.5ml/min
22 5%5% 0.7ml/min0.7ml/min
33 10%10% 0.9ml/min0.9ml/min
44 10%10% 1.1ml/min1.1ml/min
55 10%10% 1.2ml/min1.2ml/min
66 5%5% 1.4ml/min1.4ml/min
77 5%5% 1.6ml/min1.6ml/min
88 5%5% 1.8ml/min1.8ml/min
99 5%5% 1.9ml/min1.9ml/min
1010 5%5% 2.0ml/min2.0ml/min
如表1所示,在本实施例中,仍以预设时间间隔为0.2s,当前阻抗值为400Ω,上一个阻抗值为380Ω以例,若获取当前设置的流速索引号为“2”,则可以确定与流速索引号“2”对应的阻抗激增梯度值为5%。基于此,可以将预设时间间隔内的阻抗增长率
Figure PCTCN2022137404-appb-000006
与阻抗激增梯度值5%进行比较,得到第一比较结果为预设时间间隔内的阻抗增长率大于阻抗激增梯度值。由此,可以获取与当前设置的流速索引号“2”对应的预设流速值为0.7ml/min,并将冷却介质的流速值调整到0.7ml/min。
As shown in Table 1, in this embodiment, the preset time interval is still 0.2s, the current impedance value is 400Ω, and the last impedance value is 380Ω. Then it can be determined that the impedance surge gradient value corresponding to the flow rate index number "2" is 5%. Based on this, the impedance growth rate within the preset time interval can be
Figure PCTCN2022137404-appb-000006
Compared with the impedance surge gradient value of 5%, the first comparison result is that the impedance growth rate within the preset time interval is greater than the impedance surge gradient value. Thus, the preset flow rate value corresponding to the currently set flow rate index number "2" can be obtained to be 0.7ml/min, and the flow rate value of the cooling medium can be adjusted to 0.7ml/min.
在一个实施例中,将冷却介质的流速调整为该获取到的流速值后,还包括:In one embodiment, after adjusting the flow rate of the cooling medium to the obtained flow rate value, it further includes:
S604、将流速索引号设置为预设序列中的下一个预设值。S604. Set the flow rate index number as the next preset value in the preset sequence.
以上述获取当前设置的流速索引号为“2”为例,在冷却介质的流速调整为该获取到的预设流速值后,将流速索引号设置为预设序列中的下一个预设值“3”。Take the above-mentioned acquisition of the currently set flow rate index number as "2" as an example, after the flow rate of the cooling medium is adjusted to the obtained preset flow rate value, set the flow rate index number as the next preset value in the preset sequence" 3".
本申请的实施例,通过实时获取射频操作对象的操作位置的阻抗数据以及温度数据;根据阻抗数据得到阻抗的变化参数,根据温度数据得到温度的变化参数;根据阻抗的变化参数及温度的变化参数共同调整,可及时调整冷却介质的流速。及时调整流速后,可减少操作位置因温度过高出现碳化过快、组织黏连以及阻抗激增等情况,降低了射频消融产品因上述情况主动停止消融的频率,也降低了射频消融产品的使用难度。In the embodiment of the present application, the impedance data and temperature data of the operating position of the radio frequency operation object are acquired in real time; the impedance change parameter is obtained according to the impedance data, and the temperature change parameter is obtained according to the temperature data; according to the impedance change parameter and the temperature change parameter Jointly adjusted, the flow rate of the cooling medium can be adjusted in time. After the flow rate is adjusted in time, it can reduce the occurrence of excessive carbonization, tissue adhesion, and impedance surge at the operating position due to excessive temperature, reduce the frequency of radiofrequency ablation products actively stopping ablation due to the above situations, and also reduce the difficulty of using radiofrequency ablation products .
在本申请一实施例中,若第一比较结果为阻抗的变化参数小于或者等于预设的阻抗参数,且第二比较结果为温度的变化参数小于或者等于预设的温度参数,则继续监测阻抗的变化参数以及温度的变化参数。In one embodiment of the present application, if the first comparison result is that the change parameter of impedance is less than or equal to the preset impedance parameter, and the second comparison result is that the change parameter of temperature is less than or equal to the preset temperature parameter, continue to monitor the impedance Variation parameters and temperature variation parameters.
在本申请实施例中,预设增速值可以是固定的,或者也可以是按照上述获取预设增速值的方法来获取,在此不在累述。In the embodiment of the present application, the preset speed-up value may be fixed, or may also be obtained according to the above-mentioned method for obtaining the preset speed-up value, which will not be repeated here.
在本申请实施例中,若阻抗增长率超过最大的阻抗激增梯度值,或者温度斜率超过最大的温度增速阈值,则控制射频主机10停止工作。In the embodiment of the present application, if the impedance growth rate exceeds the maximum impedance surge gradient value, or the temperature slope exceeds the maximum temperature growth rate threshold, the radio frequency host 10 is controlled to stop working.
本申请的实施例,一方面,分成粗调和细调两个阶段,既可以避免调整流速过慢而导致温度过高,又可以精细化调整,避免温度突变。另一方面,在粗调时可以按照索引号的增长,逐步调整流速值,避免流速值激增而导致温度降低过快,影响消融效果。In the embodiment of the present application, on the one hand, it is divided into two stages of coarse adjustment and fine adjustment, which can not only avoid adjusting the flow rate too slowly to cause the temperature to be too high, but also finely adjust to avoid sudden temperature changes. On the other hand, during rough adjustment, the flow rate value can be gradually adjusted according to the increase of the index number, so as to avoid the rapid increase of the flow rate value and cause the temperature to drop too fast, which will affect the ablation effect.
在本申请一实施例中,根据第一比较结果以及第二比较结果,调整冷却介质的流速,包括:In an embodiment of the present application, adjusting the flow rate of the cooling medium according to the first comparison result and the second comparison result includes:
S701、若第一比较结果为阻抗的变化参数小于预设的阻抗参数,或者第二比较结果为温度的变化参数小于预设的温度参数,则按照预设减速值减小冷却介质的流速。S701. If the first comparison result is that the impedance change parameter is smaller than the preset impedance parameter, or the second comparison result is that the temperature change parameter is smaller than the preset temperature parameter, reduce the flow rate of the cooling medium according to the preset deceleration value.
在本实施例中,可以先比较阻抗的变化参数与预设的阻抗参数,若阻抗的变化参数小于预设的阻抗参数,则按照预设减速至减小冷却接至的流速,若不小于,则再比较温度的变化参数与预设的温度参数。或者,也可以先比较温度的变化参数与预设的温度参数,若温度的变化参数小于预设的温度参数,则按照预设减速至减小冷却接至的流速,若不小于,则再比较阻抗的变化参数与预设的阻抗参数。In this embodiment, the change parameter of impedance can be compared with the preset impedance parameter first, if the change parameter of impedance is less than the preset impedance parameter, the flow rate of the cooling connection is reduced according to the preset speed, if not less than, Then compare the temperature change parameter with the preset temperature parameter. Alternatively, it is also possible to compare the temperature change parameter with the preset temperature parameter first, and if the temperature change parameter is less than the preset temperature parameter, then slow down to reduce the flow rate connected to the cooling according to the preset, if not less than, then compare Impedance change parameters and preset impedance parameters.
若第一比较结果为阻抗的变化参数大于或者等于预设的阻抗参数、且第二比较结果为温度的变化参数大于或者等于预设的温度参数,则继续监测阻抗的变化参数以及温度的变化参数。If the first comparison result is that the change parameter of impedance is greater than or equal to the preset impedance parameter, and the second comparison result is that the change parameter of temperature is greater than or equal to the preset temperature parameter, then continue to monitor the change parameter of impedance and the change parameter of temperature .
在本实施例中,阻抗的变化参数包括预设时间间隔内的阻抗曲线斜率,预设的阻抗参数包括预设的阻抗减速阈值;温度的变化参数包括预设时间间隔内的温度曲线斜率,预设的温度参数包括预设的温度减速阈值。In this embodiment, the impedance change parameter includes the slope of the impedance curve within a preset time interval, and the preset impedance parameter includes a preset impedance deceleration threshold; the temperature change parameter includes the slope of the temperature curve within a preset time interval, and the preset impedance parameter includes a preset time interval. The set temperature parameters include a preset temperature deceleration threshold.
在一个实施例中,预设时间间隔内的阻抗曲线斜率可以为预设时间间隔内的阻抗变化量与预设时间间隔的比值,例如为
Figure PCTCN2022137404-appb-000007
其中,K R是预设时间间隔内的阻抗曲线斜率,R 2是当前阻抗值,R 1是上一个阻抗值,t是预设时间间隔,当前阻抗值与上一个阻抗值的测量时间间隔为预设时间间隔t。
In one embodiment, the slope of the impedance curve within the preset time interval may be the ratio of the impedance variation within the preset time interval to the preset time interval, for example,
Figure PCTCN2022137404-appb-000007
Among them, K R is the slope of the impedance curve in the preset time interval, R 2 is the current impedance value, R 1 is the last impedance value, t is the preset time interval, and the measurement time interval between the current impedance value and the last impedance value is Preset time interval t.
在一个实施例中,预设时间间隔内的温度曲线斜率与判断是否增加流速中的温度曲线斜率一致,这里不再赘述。In one embodiment, the slope of the temperature curve in the preset time interval is consistent with the slope of the temperature curve in judging whether to increase the flow rate, which will not be repeated here.
在一个实施例中,预设的阻抗减速阈值可以是固定值,例如可以是0.05Ω/min、0.1Ω/min或0.2Ω/min,等。预设的温度减速阈值也可以是固定的,例如可以是0.5℃/min、1℃/min等。In an embodiment, the preset impedance deceleration threshold may be a fixed value, such as 0.05Ω/min, 0.1Ω/min or 0.2Ω/min, etc. The preset temperature deceleration threshold can also be fixed, for example, it can be 0.5°C/min, 1°C/min, and so on.
在另一个实施例中,预设的阻抗减速阈值也可以有多个,在不同的情况下可以选择不同的阻抗减速阈值,例如下文步骤S702-步骤S706:In another embodiment, there can also be multiple preset impedance deceleration thresholds, and different impedance deceleration thresholds can be selected in different situations, for example, steps S702-step S706 below:
在一个实施例中,将阻抗的变化参数与预设的阻抗参数进行比较,获得第一比较结果,包括:In one embodiment, the impedance change parameter is compared with a preset impedance parameter to obtain a first comparison result, including:
S702、获取当前设置的流速索引号。S702. Obtain the currently set flow rate index number.
S703、获取与当前设置的流速索引号对应的阻抗参数,并将阻抗的变化 参数与获取到的阻抗参数进行比较,获得第一比较结果。S703. Acquire the impedance parameter corresponding to the currently set flow rate index number, and compare the impedance change parameter with the acquired impedance parameter to obtain a first comparison result.
将温度的变化参数与预设的温度参数进行比较,获得第二比较结果,包括:Comparing the temperature change parameter with the preset temperature parameter to obtain a second comparison result, including:
S704、获取当前设置的流速索引号。S704. Obtain the currently set flow rate index number.
S705、获取与当前设置的流速索引号对应的温度参数,并将温度的变化参数与获取到的温度参数进行比较,获得第二比较结果。S705. Obtain a temperature parameter corresponding to the currently set flow rate index number, and compare the temperature change parameter with the obtained temperature parameter to obtain a second comparison result.
按照预设减速值减小冷却介质的流速,包括:Reduce the flow rate of the cooling medium according to preset deceleration values, including:
S706、获取与当前设置的流速索引号对应的预设减速值,按照预设减速值减小冷却介质的流速。S706. Obtain a preset deceleration value corresponding to the currently set flow velocity index number, and reduce the flow velocity of the cooling medium according to the preset deceleration value.
上述步骤的具体方法可以参照步骤S601-S604,这里不再赘述。For the specific method of the above steps, reference may be made to steps S601-S604, which will not be repeated here.
在一个实施例中,按照预设减速值减小冷却介质的流速之后,包括:In one embodiment, after reducing the flow rate of the cooling medium according to the preset deceleration value, it includes:
S707、获取当前设置的流速索引号,并获取与当前设置的索引号对应的流速值;若减少后的冷却介质的流速小于该获取到的流速值,则将流速索引号设置为预设序列中的上一个预设值。S707. Obtain the currently set flow velocity index number, and obtain the flow velocity value corresponding to the currently set index number; if the reduced flow velocity of the cooling medium is less than the obtained flow velocity value, set the flow velocity index number to the preset sequence previous preset value.
在一个实施例中,这里的流速索引号可以是与步骤S601-S604中的流速索引号相同的。In an embodiment, the flow rate index number here may be the same as the flow rate index number in steps S601-S604.
本申请实施例中,在按照粗调方式增加流速后,可以将流速索引号设为预设序列中的下一个预设值,从而确定出的预设流速为下一个预设值对应的流速(即预设流速增大);在按照细调方式增加流速后,流速索引号不变。在按照上述方法减小流速后,若流速减小过多,即减少后的流速小于当前索引号对应的流速值,则后续在增加流速时,不能按照各个索引号对应的流速值逐步增加,导致流速值突增,因此,若流速减小过多(即减少后的流速小于当前索引号对应的流速值),则可以将索引号设置为预设序列中的上一个预设值,以保证在后续增加流速时,按照各个预设值对应的流速逐步增加,不会出现流速值突增。In the embodiment of the present application, after increasing the flow rate according to the coarse adjustment method, the flow rate index number can be set to the next preset value in the preset sequence, so that the determined preset flow rate is the flow rate corresponding to the next preset value ( That is, the preset flow rate increases); after the flow rate is increased according to the fine adjustment method, the flow rate index number remains unchanged. After reducing the flow rate according to the above method, if the flow rate decreases too much, that is, the reduced flow rate is lower than the flow rate value corresponding to the current index number, then when increasing the flow rate later, it cannot be gradually increased according to the flow rate value corresponding to each index number, resulting in The flow rate value increases suddenly, so if the flow rate decreases too much (that is, the reduced flow rate is less than the flow rate value corresponding to the current index number), you can set the index number to the previous preset value in the preset sequence to ensure that When the flow rate is increased subsequently, the flow rate corresponding to each preset value is gradually increased, and there will be no sudden increase in the flow rate value.
本申请的实施例,通过实时获取射频操作对象的操作位置的阻抗数据以及温度数据;根据阻抗数据得到阻抗的变化参数,根据温度数据得到温度的变化参数;根据阻抗的变化参数及温度的变化参数共同调整,可及时调整冷 却介质的流速。In the embodiment of the present application, the impedance data and temperature data of the operating position of the radio frequency operation object are acquired in real time; the impedance change parameter is obtained according to the impedance data, and the temperature change parameter is obtained according to the temperature data; according to the impedance change parameter and the temperature change parameter Jointly adjusted, the flow rate of the cooling medium can be adjusted in time.
参见图4,是本申请一实施例提供的流速控制装置的结构示意图。为了便于说明,仅示出了与本申请实施例相关的部分。该装置可以是计算机终端,或者,配置于该计算机终端的软件模块。如图5所示,该装置包括:获取模块101、计算模块102以及控制模块103。Referring to FIG. 4 , it is a schematic structural diagram of a flow rate control device provided by an embodiment of the present application. For ease of description, only the parts related to the embodiment of the present application are shown. The device may be a computer terminal, or a software module configured on the computer terminal. As shown in FIG. 5 , the device includes: an acquisition module 101 , a calculation module 102 and a control module 103 .
获取模块101,用于实时获取射频操作对象的操作位置的阻抗数据以及温度数据。The acquiring module 101 is configured to acquire impedance data and temperature data of an operating position of a radio frequency operating object in real time.
计算模块102,用于根据所述阻抗数据得到阻抗的变化参数,根据所述温度数据得到温度的变化参数。The calculation module 102 is configured to obtain an impedance change parameter according to the impedance data, and obtain a temperature change parameter according to the temperature data.
控制模块103,用于根据所述阻抗的变化参数以及所述温度的变化参数,调整冷却介质的流速。The control module 103 is configured to adjust the flow rate of the cooling medium according to the change parameter of the impedance and the change parameter of the temperature.
进一步地,控制模块103还用于将所述阻抗的变化参数与预设的阻抗参数进行比较,获得第一比较结果;将所述温度的变化参数与预设的温度参数进行比较,获得第二比较结果;根据第一比较结果以及第二比较结果调整冷却介质的流速。Further, the control module 103 is also used to compare the impedance change parameter with a preset impedance parameter to obtain a first comparison result; compare the temperature change parameter with a preset temperature parameter to obtain a second Comparing the result: adjusting the flow rate of the cooling medium according to the first comparison result and the second comparison result.
本申请的实施例,通过实时获取射频操作对象的操作位置的阻抗数据以及温度数据;根据阻抗数据得到阻抗的变化参数,根据温度数据得到温度的变化参数;根据阻抗的变化参数及温度的变化参数共同调整,可及时调整冷却介质的流速。In the embodiment of the present application, the impedance data and temperature data of the operating position of the radio frequency operation object are acquired in real time; the impedance change parameter is obtained according to the impedance data, and the temperature change parameter is obtained according to the temperature data; according to the impedance change parameter and the temperature change parameter Jointly adjusted, the flow rate of the cooling medium can be adjusted in time.
在本申请一实施例中,控制模块103,还用于若所述第一比较结果为所述阻抗的变化参数大于预设的所述阻抗参数,将所述冷却介质的流速增大为预设流速值;若所述第一比较结果为所述阻抗的变化参数小于或等于预设的所述阻抗参数,且所述第二比较结果为所述温度的变化参数大于预设的所述温度参数,按照预设增速值增大所述冷却介质的流速。In an embodiment of the present application, the control module 103 is further configured to increase the flow rate of the cooling medium to a preset value if the first comparison result is that the change parameter of the impedance is greater than the preset impedance parameter. Flow rate value; if the first comparison result is that the change parameter of the impedance is less than or equal to the preset impedance parameter, and the second comparison result is that the temperature change parameter is greater than the preset temperature parameter , to increase the flow rate of the cooling medium according to a preset increase rate value.
进一步地,控制模块103,还用于获取当前设置的流速索引号,流速索引号为预设序列中的一个预设值;预设序列中各预设值分别对应一个阻抗参数以及一个流速值,且各预设值对应的流速值按照预设值在预设序列中的排序增大;获取与所述当前设置的流速索引号对应的所述阻抗参数,并将所述 阻抗的变化参数与获取到的所述阻抗参数进行比较,获得第一比较结果。Further, the control module 103 is also used to obtain the currently set flow rate index number, the flow rate index number is a preset value in the preset sequence; each preset value in the preset sequence corresponds to an impedance parameter and a flow rate value, And the flow velocity value corresponding to each preset value increases according to the order of the preset value in the preset sequence; acquire the impedance parameter corresponding to the currently set flow velocity index number, and compare the change parameter of the impedance with the acquired The obtained impedance parameters are compared to obtain a first comparison result.
控制模块103,还用于获取与所述当前设置的流速索引号对应的流速值,并将所述冷却介质的流速增大为该获取到的流速值。The control module 103 is further configured to acquire a flow velocity value corresponding to the currently set flow velocity index number, and increase the flow velocity of the cooling medium to the acquired flow velocity value.
进一步地,控制模块103,还用于将流速索引号设置为所述预设序列中的下一个预设值。Further, the control module 103 is further configured to set the flow rate index number as the next preset value in the preset sequence.
在本实施例中,阻抗的变化参数包括预设时间间隔内的阻抗增长率,所述预设的阻抗参数包括预设的阻抗激增梯度值;所述温度的变化参数包括预设时间间隔内的温度曲线斜率,所述预设的温度参数包括预设的温度增速阈值。In this embodiment, the impedance change parameter includes the impedance growth rate within a preset time interval, and the preset impedance parameter includes a preset impedance surge gradient value; the temperature change parameter includes the impedance growth rate within a preset time interval. The slope of the temperature curve, the preset temperature parameter includes a preset temperature growth rate threshold.
本实施例通过实时获取射频操作对象的操作位置的阻抗数据以及温度数据;根据阻抗数据得到阻抗的变化参数,根据温度数据得到温度的变化参数;根据阻抗的变化参数及温度的变化参数共同调整,可及时调整冷却介质的流速。及时调整流速后,可减少操作位置因温度过高出现碳化过快、组织黏连以及阻抗激增等情况,降低了射频消融产品因上述情况主动停止消融的频率,也降低了射频消融产品的使用难度。In this embodiment, the impedance data and temperature data of the operating position of the radio frequency operation object are acquired in real time; the impedance change parameter is obtained according to the impedance data, and the temperature change parameter is obtained according to the temperature data; and the impedance change parameter and the temperature change parameter are jointly adjusted, The flow rate of the cooling medium can be adjusted in time. After the flow rate is adjusted in time, it can reduce the occurrence of excessive carbonization, tissue adhesion, and impedance surge at the operating position due to excessive temperature, reduce the frequency of radiofrequency ablation products actively stopping ablation due to the above situations, and also reduce the difficulty of using radiofrequency ablation products .
在本申请一实施例中,控制模块103,还用于若所述第一比较结果为所述阻抗的变化参数小于预设的所述阻抗参数,或者所述第二比较结果为所述温度的变化参数小于预设的所述温度参数,则按照预设减速值减小所述冷却介质的流速。In an embodiment of the present application, the control module 103 is further configured to: if the first comparison result is that the change parameter of the impedance is less than the preset impedance parameter, or if the second comparison result is the change parameter of the temperature If the change parameter is smaller than the preset temperature parameter, the flow rate of the cooling medium is reduced according to a preset deceleration value.
进一步地,控制模块103,还用于获取当前设置的流速索引号,所述流速索引号为预设序列中的一个预设值;获取与所述当前设置的流速索引号对应的所述阻抗参数,并将所述阻抗的变化参数与获取到的所述阻抗参数进行比较,获得第一比较结果。Further, the control module 103 is also configured to obtain the currently set flow rate index number, which is a preset value in a preset sequence; obtain the impedance parameter corresponding to the currently set flow rate index number , and compare the change parameter of the impedance with the obtained impedance parameter to obtain a first comparison result.
进一步地,控制模块103,还用于获取所述当前设置的流速索引号;获取与所述当前设置的流速索引号对应的所述温度参数,并将所述温度的变化参数与获取到的所述温度参数进行比较,获得第二比较结果。Further, the control module 103 is also used to obtain the currently set flow rate index number; obtain the temperature parameter corresponding to the currently set flow rate index number, and compare the temperature change parameter with the obtained The above temperature parameters are compared to obtain a second comparison result.
进一步地,控制模块103,还用于获取与所述当前设置的流速索引号对应的减速值,按照该减速值减小所述冷却介质的流速。Further, the control module 103 is further configured to acquire a deceleration value corresponding to the currently set flow rate index number, and reduce the flow rate of the cooling medium according to the deceleration value.
进一步地,控制模块103,还用于获取当前设置的流速索引号,并获取与所述当前设置的流速索引号对应的流速值,若减少后的冷却介质的流速小于该获取到的流速值,则将所述流速索引号设置为所述预设序列中的上一个预设值。Further, the control module 103 is also used to obtain the currently set flow rate index number, and obtain the flow rate value corresponding to the currently set flow rate index number, if the reduced flow rate of the cooling medium is smaller than the obtained flow rate value, Then set the flow rate index number as the last preset value in the preset sequence.
在本实施例中,阻抗的变化参数包括预设时间间隔内的阻抗曲线斜率,所述预设的阻抗参数包括预设的阻抗减速阈值;所述温度的变化参数包括预设时间间隔内的温度曲线斜率,所述预设的温度参数包括预设的温度减速阈值。In this embodiment, the change parameter of impedance includes the slope of the impedance curve within a preset time interval, and the preset impedance parameter includes a preset impedance deceleration threshold; the change parameter of temperature includes the temperature within a preset time interval Curve slope, the preset temperature parameters include a preset temperature deceleration threshold.
上述各模块实现各自功能的具体过程可参考上述流速控制方法所示实施例中的相关内容,此处不再赘述。For the specific process of realizing the respective functions of the above-mentioned modules, reference may be made to the relevant content in the embodiment shown in the above-mentioned flow rate control method, which will not be repeated here.
本实施例通过实时获取射频操作对象的操作位置的阻抗数据以及温度数据;根据阻抗数据得到阻抗的变化参数,根据温度数据得到温度的变化参数;根据阻抗的变化参数及温度的变化参数共同调整,可及时调整冷却介质的流速。In this embodiment, the impedance data and temperature data of the operating position of the radio frequency operation object are acquired in real time; the impedance change parameter is obtained according to the impedance data, and the temperature change parameter is obtained according to the temperature data; and the impedance change parameter and the temperature change parameter are jointly adjusted, The flow rate of the cooling medium can be adjusted in time.
参见图5,图5是本申请一实施例提供的电子装置的硬件结构示意图。Referring to FIG. 5 , FIG. 5 is a schematic diagram of a hardware structure of an electronic device provided by an embodiment of the present application.
示例性的,电子装置可以为非可移动的或可移动或便携式并执行无线或有线通信的各种类型的计算机系统设备中的任何一种。具体的,该电子装置可以为台式电脑、服务器、移动电话或智能电话(例如,基于iPhone TM,基于Android TM的电话),便携式游戏设备(例如Nintendo DS TM,PlayStation Portable TM,Gameboy Advance TM,iPhone TM)、膝上型电脑、PDA、便携式互联网设备、便携式医疗设备、智能相机、音乐播放器以及数据存储设备,其他手持设备以及诸如手表、耳机、吊坠、耳机等,电子装置还可以为其他的可穿戴设备(例如,诸如电子眼镜、电子衣服、电子手镯、电子项链以及其他头戴式设备(HMD))。Exemplarily, an electronic device may be any of various types of computer system devices that are non-removable or removable or portable and that perform wireless or wired communications. Specifically, the electronic device can be a desktop computer, a server, a mobile phone or a smart phone (for example, based on iPhone TM, a phone based on Android TM), a portable game device (such as Nintendo DS TM, PlayStation Portable TM, Gameboy Advance TM, iPhone TM), laptop computers, PDAs, portable Internet devices, portable medical devices, smart cameras, music players and data storage devices, other handheld devices and such as watches, earphones, pendants, earphones, etc., electronic devices can also be other Wearable devices (eg, such as electronic glasses, electronic clothes, electronic bracelets, electronic necklaces, and other head-mounted devices (HMDs)).
如图5所示,电子装置100可以包括控制电路,该控制电路可以包括存储和处理电路300。该存储和处理电路300可以包括存储器,例如硬盘驱动存储器,非易失性存储器(例如闪存或用于形成固态驱动器的其它电子可编程限制删除的存储器等),易失性存储器(例如静态或动态随机存取存储器 等)等,本申请实施例不作限制。存储和处理电路300中的处理电路可以用于控制电子装置100的运转。该处理电路可以基于一个或多个微处理器,微控制器,数字信号处理器,基带处理器,功率管理单元,音频编解码器芯片,专用集成电路,显示驱动器集成电路等来实现。As shown in FIG. 5 , electronic device 100 may include control circuitry, which may include storage and processing circuitry 300 . The storage and processing circuitry 300 may include memory, such as hard disk drive memory, non-volatile memory (such as flash memory or other electronically programmable limited-erasable memory for forming solid-state drives, etc.), volatile memory (such as static or dynamic Random access memory, etc.), etc., are not limited in this embodiment of the present application. Processing circuitry in storage and processing circuitry 300 may be used to control the operation of electronic device 100 . The processing circuit may be implemented based on one or more microprocessors, microcontrollers, digital signal processors, baseband processors, power management units, audio codec chips, application specific integrated circuits, display driver integrated circuits, and the like.
存储和处理电路300可用于运行电子装置100中的软件,例如互联网浏览应用程序,互联网协议语音(Voice over Internet Protocol,VOIP)电话呼叫应用程序,电子邮件应用程序,媒体播放应用程序,操作系统功能等。这些软件可以用于执行一些控制操作,例如,基于照相机的图像采集,基于环境光传感器的环境光测量,基于接近传感器的接近传感器测量,基于诸如发光二极管的状态指示灯等状态指示器实现的信息显示功能,基于触摸传感器的触摸事件检测,与在多个(例如分层的)显示器上显示信息相关联的功能,与执行无线通信功能相关联的操作,与收集和产生音频信号相关联的操作,与收集和处理按钮按压事件数据相关联的控制操作,以及电子装置100中的其它功能等,本申请实施例不作限制。The storage and processing circuit 300 can be used to run software in the electronic device 100, such as Internet browsing applications, Voice over Internet Protocol (Voice over Internet Protocol, VOIP) phone calling applications, email applications, media playback applications, operating system functions wait. These software can be used to perform control operations such as camera based image acquisition, ambient light measurement based on ambient light sensor, proximity sensor based measurement based on proximity sensor, information based on status indicators such as status indicators such as LEDs Display functions, touch sensor based touch event detection, functions associated with displaying information on multiple (e.g. layered) displays, operations associated with performing wireless communication functions, operations associated with collecting and generating audio signals , control operations associated with collecting and processing button press event data, and other functions in the electronic device 100 are not limited by this embodiment of the present application.
进一步的,该存储器存储有可执行程序代码,与该存储器耦合的处理器,调用该存储器中存储的该可执行程序代码,执行如前述各实施例中描述的流速控制方法。Further, the memory stores executable program codes, and the processor coupled to the memory invokes the executable program codes stored in the memory to execute the flow rate control methods described in the foregoing embodiments.
其中,该可执行程序代码包括如上述图4所示实施例中描述的流速控制装置中的各个模块,例如:获取模块101、计算模块102、控制模块103等。上述模块实现各自功能的具体过程可参考图4的相关描述,此处不再赘述。Wherein, the executable program code includes various modules in the flow rate control device described in the above embodiment shown in FIG. 4 , for example: acquisition module 101 , calculation module 102 , control module 103 and so on. For the specific process of the above-mentioned modules realizing their respective functions, reference may be made to the relevant description in FIG. 4 , which will not be repeated here.
电子装置100还可以包括输入/输出电路420。输入/输出电路420可用于使电子装置100实现数据的输入和输出,即允许电子装置100从外部设备接收数据和也允许电子装置100将数据从电子装置100输出至外部设备。输入/输出电路420可以进一步包括传感器320。传感器320可以包括环境光传感器,基于光和电容的接近传感器,触摸传感器(例如,基于光触摸传感器和/或电容式触摸传感器,其中,触摸传感器可以是触控显示屏的一部分,也可以作为一个触摸传感器结构独立使用),加速度传感器,和其它传感器等。The electronic device 100 may also include an input/output circuit 420 . The input/output circuit 420 can be used to enable the electronic device 100 to realize data input and output, that is, allow the electronic device 100 to receive data from external devices and also allow the electronic device 100 to output data from the electronic device 100 to external devices. The input/output circuit 420 may further include the sensor 320 . The sensor 320 can include an ambient light sensor, a proximity sensor based on light and capacitance, a touch sensor (for example, based on an optical touch sensor and/or a capacitive touch sensor, wherein the touch sensor can be a part of the touch screen or can be used as a The touch sensor structure is used independently), the acceleration sensor, and other sensors, etc.
输入/输出电路420还可以包括一个或多个显示器,例如显示器140。显 示器140可以包括液晶显示器,有机发光二极管显示器,电子墨水显示器,等离子显示器,使用其它显示技术的显示器中一种或者几种的组合。显示器140可以包括触摸传感器阵列(即,显示器140可以是触控显示屏)。触摸传感器可以是由透明的触摸传感器电极(例如氧化铟锡(ITO)电极)阵列形成的电容式触摸传感器,或者可以是使用其它触摸技术形成的触摸传感器,例如音波触控,压敏触摸,电阻触摸,光学触摸等,本申请实施例不作限制。Input/output circuitry 420 may also include one or more displays, such as display 140 . The display 140 may include one or a combination of liquid crystal displays, organic light emitting diode displays, electronic ink displays, plasma displays, and displays using other display technologies. Display 140 may include a touch sensor array (ie, display 140 may be a touchscreen display). The touch sensor may be a capacitive touch sensor formed from an array of transparent touch sensor electrodes such as indium tin oxide (ITO) electrodes, or may be a touch sensor formed using other touch technologies such as acoustic touch, pressure sensitive touch, resistive touch Touch, optical touch, etc. are not limited in this embodiment of the application.
电子装置100还可以包括音频组件360。音频组件360可以用于为电子装置100提供音频输入和输出功能。电子装置100中的音频组件360可以包括扬声器,麦克风,蜂鸣器,音调发生器以及其它用于产生和检测声音的组件。The electronic device 100 may also include an audio component 360 . The audio component 360 may be used to provide audio input and output functions for the electronic device 100 . The audio components 360 in the electronic device 100 may include speakers, microphones, buzzers, tone generators, and other components for generating and detecting sounds.
通信电路380可以用于为电子装置100提供与外部设备通信的能力。通信电路380可以包括模拟和数字输入/输出接口电路,和基于射频能量和/或光信号的无线通信电路。通信电路380中的无线通信电路可以包括射频收发器电路、功率放大器电路、低噪声放大器、开关、滤波器和天线。举例来说,通信电路380中的无线通信电路可以包括用于通过发射和接收近场耦合电磁信号来支持近场通信(Near Field Communication,NFC)的电路。例如,通信电路380可以包括近场通信天线和近场通信收发器。通信电路380还可以包括蜂窝电话收发器和天线,无线局域网收发器电路和天线等。The communication circuit 380 can be used to provide the electronic device 100 with the ability to communicate with external devices. Communications circuitry 380 may include analog and digital input/output interface circuitry, and wireless communications circuitry based on radio frequency energy and/or optical signals. Wireless communication circuitry in communication circuitry 380 may include radio frequency transceiver circuitry, power amplifier circuitry, low noise amplifiers, switches, filters, and antennas. For example, the wireless communication circuit in the communication circuit 380 may include a circuit for supporting Near Field Communication (NFC) by transmitting and receiving near-field coupled electromagnetic signals. For example, communication circuitry 380 may include a near field communication antenna and a near field communication transceiver. Communications circuitry 380 may also include cellular telephone transceiver circuitry and antennas, wireless local area network transceiver circuitry and antennas, and the like.
电子装置100还可以进一步包括电池,电力管理电路和其它输入/输出单元400。输入/输出单元400可以包括按钮,操纵杆,点击轮,滚动轮,触摸板,小键盘,键盘,照相机,发光二极管和其它状态指示器等。The electronic device 100 may further include a battery, a power management circuit and other input/output units 400 . The input/output unit 400 may include buttons, joystick, click wheel, scroll wheel, touch pad, keypad, keyboard, camera, light emitting diodes and other status indicators, and the like.
用户可以通过输入/输出电路420输入命令来控制电子装置100的操作,并且可以使用输入/输出电路420的输出数据以实现接收来自电子装置100的状态信息和其它输出。A user can input commands through the I/O circuit 420 to control the operation of the electronic device 100 , and can use the output data of the I/O circuit 420 to receive status information and other outputs from the electronic device 100 .
进一步的,本申请实施例还提供了一种非暂时性计算机可读存储介质,该非暂时性计算机可读存储介质可以配置于上述各实施例中的服务器中,该非暂时性计算机可读存储介质上存储有计算机程序,该程序被处理器执行时实现前述各实施例中描述的流速控制方法。Further, the embodiment of the present application also provides a non-transitory computer-readable storage medium, which can be configured in the server in each of the above-mentioned embodiments, and the non-transitory computer-readable storage medium A computer program is stored on the medium, and when the program is executed by the processor, the flow rate control methods described in the foregoing embodiments are implemented.
在上述实施例中,对各个实施例的描述都各有侧重,某个实施例中没有详述或记载的部分,可以参见其它实施例的相关描述。In the above-mentioned embodiments, the descriptions of each embodiment have their own emphases, and for parts that are not detailed or recorded in a certain embodiment, refer to the relevant descriptions of other embodiments.
本领域技术人员可以意识到,结合本文中所公开的实施例描述的各示例的模块/单元及算法步骤,能够以电子硬件、或者计算机软件和电子硬件的结合来实现。这些功能究竟以硬件还是软件方式来执行,取决于技术方案的特定应用和设计约束条件。专业技术人员可以对每个特定的应用来使用不同方法来实现所描述的功能,但是这种实现不应认为超出本发明的范围。Those skilled in the art can appreciate that the modules/units and algorithm steps of the examples described in conjunction with the embodiments disclosed herein can be implemented by electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are executed by hardware or software depends on the specific application and design constraints of the technical solution. Skilled artisans may use different methods to implement the described functions for each specific application, but such implementation should not be regarded as exceeding the scope of the present invention.
在本发明所提供的实施例中,应该理解到,所揭露的装置/终端和方法,可以通过其它的方式实现。例如,以上所描述的装置/终端实施例仅仅是示意性的,例如,模块或单元的划分,仅仅为一种逻辑功能划分,实际实现时可以有另外的划分方式,例如多个单元或组件可以结合或者可以集成到另一个系统,或一些特征可以忽略,或不执行。另一点,所显示或讨论的相互之间的耦合或直接耦合或通讯连接可以是通过一些接口,装置或单元的间接耦合或通讯连接,可以是电性,机械或其它的形式。In the embodiments provided in the present invention, it should be understood that the disclosed device/terminal and method may be implemented in other ways. For example, the device/terminal embodiments described above are only illustrative. For example, the division of modules or units is only a logical function division. There may be other division methods in actual implementation. For example, multiple units or components can be Incorporation may either be integrated into another system, or some features may be omitted, or not implemented. In another point, the mutual coupling or direct coupling or communication connection shown or discussed may be through some interfaces, and the indirect coupling or communication connection of devices or units may be in electrical, mechanical or other forms.
作为分离部件说明的单元可以是或者也可以不是物理上分开的,作为单元显示的部件可以是或者也可以不是物理单元,即可以位于一个地方,或者也可以分布到多个网络单元上。可以根据实际的需要选择其中的部分或者全部单元来实现本实施例方案的目的。A unit described as a separate component may or may not be physically separated, and a component displayed as a unit may or may not be a physical unit, that is, it may be located in one place, or may be distributed to multiple network units. Part or all of the units can be selected according to actual needs to achieve the purpose of the solution of this embodiment.
另外,在本发明各个实施例中的各功能单元可以集成在一个处理单元中,也可以是各个单元单独物理存在,也可以两个或两个以上单元集成在一个单元中。上述集成的单元既可以采用硬件的形式实现,也可以采用软件功能单元的形式实现。In addition, each functional unit in each embodiment of the present invention may be integrated into one processing unit, each unit may exist separately physically, or two or more units may be integrated into one unit. The above-mentioned integrated units can be implemented in the form of hardware or in the form of software functional units.
集成的单元如果以软件功能单元的形式实现并作为独立的产品销售或使用时,可以存储在一个计算机可读取存储介质中。基于这样的理解,本发明实现上述实施例方法中的全部或部分流程,也可以通过计算机程序来指令相关的硬件来完成。该计算机程序可存储于一计算机可读存储介质中,该计算机程序在被处理器执行时,可实现上述各个方法实施例的步骤。其中,计算机程序包括计算机程序代码,计算机程序代码可以为源代码形式、对象代码 形式、可执行文件或某些中间形式等。计算机可读介质可以包括:能够携带计算机程序代码的任何实体或装置、记录介质、U盘、移动硬盘、磁碟、光盘、计算机存储器、只读存储器(ROM,Read-Only Memory)、随机存取存储器(RAM,Random Access Memory)、电载波信号、电信信号以及软件分发介质等。需要说明的是,计算机可读介质包含的内容可以根据司法管辖区内立法和专利实践的要求进行适当的增减,例如在某些司法管辖区,根据立法和专利实践,计算机可读介质不包括是电载波信号和电信信号。If the integrated unit is realized in the form of a software function unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on such an understanding, the present invention implements all or part of the processes in the methods of the above embodiments, and may also be completed by instructing related hardware through computer programs. The computer program can be stored in a computer-readable storage medium, and when the computer program is executed by a processor, the steps of the above-mentioned various method embodiments can be realized. Among them, the computer program includes computer program code, and the computer program code can be in the form of source code, object code, executable file or some intermediate form, etc. The computer readable medium may include: any entity or device capable of carrying computer program code, recording medium, U disk, removable hard disk, magnetic disk, optical disk, computer memory, read-only memory (ROM, Read-Only Memory), random access Memory (RAM, Random Access Memory), electrical carrier signal, telecommunication signal and software distribution medium, etc. It should be noted that the content contained on computer readable media may be appropriately increased or decreased according to the requirements of legislation and patent practice in the jurisdiction. For example, in some jurisdictions, according to legislation and patent practice, computer readable media does not include It is an electrical carrier signal and a telecommunication signal.
以上实施例仅用以说明本发明的技术方案,而非对其限制;尽管参照前述实施例对本发明进行了详细的说明,本领域的技术人员应当理解:其依然可以对前述各实施例所记载的技术方案进行修改,或者对其中部分技术特征进行等同替换;而这些修改或者替换,并不使相应技术方案的本质脱离本发明各实施例技术方案的精神和范围,均应包含在本发明的保护范围之内。The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that: it can still be described in the foregoing embodiments Modifications to the technical solutions, or equivalent replacement of some of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present invention, and should be included in the scope of the technical solutions of the present invention. within the scope of protection.

Claims (13)

  1. 一种流速控制方法,其特征在于,所述方法包括:A flow rate control method, characterized in that the method comprises:
    实时获取射频操作对象的操作位置的阻抗数据以及温度数据;Obtain the impedance data and temperature data of the operating position of the radio frequency operating object in real time;
    根据所述阻抗数据得到阻抗的变化参数,根据所述温度数据得到温度的变化参数;Obtaining a change parameter of impedance according to the impedance data, and obtaining a change parameter of temperature according to the temperature data;
    根据所述阻抗的变化参数以及所述温度的变化参数,调整冷却介质的流速。According to the change parameter of the impedance and the change parameter of the temperature, the flow rate of the cooling medium is adjusted.
  2. 如权利要求1所述的方法,其特征在于,所述根据所述阻抗的变化参数以及所述温度的变化参数,调整冷却介质的流速,包括:The method according to claim 1, wherein the adjusting the flow rate of the cooling medium according to the change parameter of the impedance and the change parameter of the temperature comprises:
    将所述阻抗的变化参数与预设的阻抗参数进行比较,获得第一比较结果;Comparing the change parameter of the impedance with a preset impedance parameter to obtain a first comparison result;
    将所述温度的变化参数与预设的温度参数进行比较,获得第二比较结果;Comparing the change parameter of the temperature with a preset temperature parameter to obtain a second comparison result;
    根据所述第一比较结果以及所述第二比较结果调整所述冷却介质的流速。The flow rate of the cooling medium is adjusted according to the first comparison result and the second comparison result.
  3. 如权利要求2所述的方法,其特征在于,所述根据所述第一比较结果以及所述第二比较结果,调整所述冷却介质的流速,包括:The method according to claim 2, wherein the adjusting the flow rate of the cooling medium according to the first comparison result and the second comparison result comprises:
    若所述第一比较结果为所述阻抗的变化参数大于预设的所述阻抗参数,将所述冷却介质的流速增大为预设流速值;If the first comparison result is that the change parameter of the impedance is greater than the preset impedance parameter, increasing the flow rate of the cooling medium to a preset flow rate value;
    若所述第一比较结果为所述阻抗的变化参数小于或等于预设的所述阻抗参数,且所述第二比较结果为所述温度的变化参数大于预设的所述温度参数,按照预设增速值增大所述冷却介质的流速。If the first comparison result is that the change parameter of the impedance is less than or equal to the preset impedance parameter, and the second comparison result is that the temperature change parameter is greater than the preset temperature parameter, according to the preset The speed increase value is set to increase the flow velocity of the cooling medium.
  4. 如权利要求3所述的方法,其特征在于,所述将所述阻抗的变化参数与预设的所述阻抗参数进行比较,获得第一比较结果,包括:The method according to claim 3, wherein the comparing the change parameter of the impedance with the preset impedance parameter to obtain a first comparison result comprises:
    获取当前设置的流速索引号;Get the current set flow rate index number;
    获取与所述当前设置的流速索引号对应的所述阻抗参数,并将所述阻抗的变化参数与获取到的所述阻抗参数进行比较,获得第一比较结果;Acquire the impedance parameter corresponding to the currently set flow rate index number, and compare the impedance change parameter with the acquired impedance parameter to obtain a first comparison result;
    所述将所述冷却介质的流速增大为预设流速值,包括:The increasing the flow rate of the cooling medium to a preset flow rate value includes:
    获取与所述当前设置的流速索引号对应的流速值,并将所述冷却介质的流速增大为该获取到的流速值。Obtain a flow velocity value corresponding to the currently set flow velocity index number, and increase the flow velocity of the cooling medium to the acquired flow velocity value.
  5. 如权利要求4所述的方法,其特征在于,所述流速索引号为预设序列中的一个预设值;所述预设序列中各所述预设值分别对应一个阻抗参数以及一个流速值,且各所述预设值对应的流速值按照所述预设值在所述预设序列中的排序增大;The method according to claim 4, wherein the flow velocity index number is a preset value in a preset sequence; each preset value in the preset sequence corresponds to an impedance parameter and a flow velocity value respectively , and the flow rate value corresponding to each of the preset values increases according to the order of the preset values in the preset sequence;
    所述将所述冷却介质的流速增大为该获取到的流速值后,还包括:After said increasing the flow velocity of the cooling medium to the obtained flow velocity value, it also includes:
    将所述流速索引号设置为所述预设序列中的下一个所述预设值。The flow rate index number is set to the next said preset value in said preset sequence.
  6. 如权利要求2至5任意一项所述的方法,其特征在于,所述阻抗的变化参数包括预设时间间隔内的阻抗增长率,预设的所述阻抗参数包括预设的阻抗激增梯度值;所述温度的变化参数包括预设时间间隔内的温度曲线斜率,预设的所述温度参数包括预设的温度增速阈值。The method according to any one of claims 2 to 5, wherein the impedance change parameter includes an impedance growth rate within a preset time interval, and the preset impedance parameter includes a preset impedance surge gradient value The temperature change parameter includes the slope of the temperature curve within a preset time interval, and the preset temperature parameter includes a preset temperature growth rate threshold.
  7. 如权利要求2所述的方法,其特征在于,所述根据所述第一比较结果以及所述第二比较结果,调整所述冷却介质的流速包括:The method according to claim 2, wherein the adjusting the flow rate of the cooling medium according to the first comparison result and the second comparison result comprises:
    若所述第一比较结果为所述阻抗的变化参数小于预设的所述阻抗参数,或者所述第二比较结果为所述温度的变化参数小于预设的所述温度参数,则按照预设减速值减小所述冷却介质的流速。If the first comparison result is that the change parameter of the impedance is less than the preset impedance parameter, or the second comparison result is that the temperature change parameter is less than the preset temperature parameter, then according to the preset The deceleration value reduces the flow rate of the cooling medium.
  8. 如权利要求7所述的方法,其特征在于,所述将所述阻抗的变化参数与预设的阻抗参数进行比较,获得第一比较结果,包括:The method according to claim 7, wherein said comparing said impedance change parameter with a preset impedance parameter to obtain a first comparison result comprises:
    获取当前设置的流速索引号;Get the current set flow rate index number;
    获取与所述当前设置的流速索引号对应的所述阻抗参数,并将所述阻抗的变化参数与获取到的所述阻抗参数进行比较,获得第一比较结果;Acquire the impedance parameter corresponding to the currently set flow rate index number, and compare the impedance change parameter with the acquired impedance parameter to obtain a first comparison result;
    所述将所述温度的变化参数与预设的温度参数进行比较,获得第二比较结果,包括:The step of comparing the change parameter of the temperature with the preset temperature parameter to obtain a second comparison result includes:
    获取所述当前设置的流速索引号;Obtain the flow rate index number currently set;
    获取与所述当前设置的流速索引号对应的温度参数,并将所述温度的变化参数与获取到的所述温度参数进行比较,获得第二比较结果;Obtaining a temperature parameter corresponding to the currently set flow rate index number, and comparing the temperature change parameter with the obtained temperature parameter to obtain a second comparison result;
    所述按照预设减速值减小冷却介质的流速,包括:The reducing the flow rate of the cooling medium according to the preset deceleration value includes:
    获取与所述当前设置的流速索引号对应的减速值,按照该减速值减小所述冷却介质的流速。A deceleration value corresponding to the currently set flow velocity index number is obtained, and the flow velocity of the cooling medium is reduced according to the deceleration value.
  9. 如权利要求7或8所述的方法,其特征在于,所述方法还包括:The method according to claim 7 or 8, wherein the method further comprises:
    获取当前设置的流速索引号,所述流速索引号为预设序列中的一个预设值,所述流速索引号为所述预设序列中的一个预设值;所述预设序列中各所述预设值分别对应一个阻抗参数以及一个流速值,且各所述预设值对应的流速值按照所述预设值在所述预设序列中的排序增大;Obtain the currently set flow rate index number, the flow rate index number is a preset value in the preset sequence, and the flow rate index number is a preset value in the preset sequence; The preset values respectively correspond to an impedance parameter and a flow velocity value, and the flow velocity values corresponding to each of the preset values increase according to the order of the preset values in the preset sequence;
    获取与所述当前设置的流速索引号对应的流速值;Obtain the flow velocity value corresponding to the currently set flow velocity index number;
    若减少后的冷却介质的流速小于该获取到的流速值,则将所述流速索引号设置为所述预设序列中的上一个所述预设值。If the reduced flow rate of the cooling medium is smaller than the obtained flow rate value, the flow rate index number is set as the last preset value in the preset sequence.
  10. 如权利要求7至9任意一项所述的方法,其特征在于,所述阻抗的变化参数包括预设时间间隔内的阻抗曲线斜率,预设的所述阻抗参数包括预设的阻抗减速阈值;所述温度的变化参数包括预设时间间隔内的温度曲线斜率,预设的所述温度参数包括预设的温度减速阈值。The method according to any one of claims 7 to 9, wherein the impedance change parameter includes the slope of the impedance curve within a preset time interval, and the preset impedance parameter includes a preset impedance deceleration threshold; The temperature change parameter includes a temperature curve slope within a preset time interval, and the preset temperature parameter includes a preset temperature deceleration threshold.
  11. 一种流速控制装置,其特征在于,包括:A flow rate control device, characterized in that it comprises:
    获取模块,用于实时获取射频操作对象的操作位置的阻抗数据以及温度数据;An acquisition module, configured to acquire impedance data and temperature data of the operating position of the radio frequency operating object in real time;
    计算模块,用于根据所述阻抗数据得到阻抗的变化参数,根据所述温度数据得到温度的变化参数;A calculation module, configured to obtain an impedance change parameter according to the impedance data, and obtain a temperature change parameter according to the temperature data;
    控制模块,用于根据所述阻抗的变化参数以及所述温度的变化参数,调整冷却介质的流速。The control module is configured to adjust the flow rate of the cooling medium according to the change parameter of the impedance and the change parameter of the temperature.
  12. 一种电子装置,其特征在于,包括:An electronic device, characterized in that it comprises:
    存储器和处理器;memory and processor;
    所述存储器存储有可执行程序代码;The memory stores executable program code;
    与所述存储器耦合的所述处理器,调用所述存储器中存储的所述可执行程序代码,执行如权利要求1至10中的任一项所述的流速控制方法中的各步骤。The processor coupled to the memory invokes the executable program code stored in the memory to execute the steps in the flow rate control method according to any one of claims 1 to 10.
  13. 一种非暂时性计算机可读存储介质,其上存储有计算机程序,其特征在于,所述计算机程序被处理器执行时,实现如权利要求1至10中的任一项所述的流速控制方法。A non-transitory computer-readable storage medium on which a computer program is stored, wherein when the computer program is executed by a processor, the flow rate control method according to any one of claims 1 to 10 is realized .
PCT/CN2022/137404 2021-12-29 2022-12-08 Flow rate control method, electronic device and computer-readable storage medium WO2023124868A1 (en)

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