WO2023124331A1 - 显示面板及显示装置 - Google Patents

显示面板及显示装置 Download PDF

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Publication number
WO2023124331A1
WO2023124331A1 PCT/CN2022/122514 CN2022122514W WO2023124331A1 WO 2023124331 A1 WO2023124331 A1 WO 2023124331A1 CN 2022122514 W CN2022122514 W CN 2022122514W WO 2023124331 A1 WO2023124331 A1 WO 2023124331A1
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WIPO (PCT)
Prior art keywords
area
power
line
isolation
shielding
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Ceased
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PCT/CN2022/122514
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English (en)
French (fr)
Inventor
金玉
徐磊
顾维杰
周至奕
李磊
陆蕴雷
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Kunshan Govisionox Optoelectronics Co Ltd
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Kunshan Govisionox Optoelectronics Co Ltd
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Application filed by Kunshan Govisionox Optoelectronics Co Ltd filed Critical Kunshan Govisionox Optoelectronics Co Ltd
Publication of WO2023124331A1 publication Critical patent/WO2023124331A1/zh
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Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/60—Arrangements for protection of devices protecting against electrostatic charges or discharges, e.g. Faraday shields

Definitions

  • the present application relates to the display field, in particular to a display panel and a display device.
  • a notch or hole can be made on the display screen, and external light can enter the photosensitive element located below the screen through the notch or hole on the screen.
  • this will cause the layer structure around the hole area or the groove area to be different from the layer structure at other positions, resulting in defects in the display panel.
  • Embodiments of the present application provide a display panel and a display device, aiming at improving the yield of the display panel.
  • the embodiment of the first aspect of the present application provides a display panel.
  • the display panel has a first area and a second area arranged around at least part of the first area.
  • the display panel includes: a substrate, an active layer located on one side of the substrate, and a
  • the source layer includes an isolation portion located in the second area and surrounding at least part of the first area;
  • the first metal layer is located on the side of the active layer away from the substrate, the first metal layer includes a shielding portion, and the orthographic projection of the isolation portion on the substrate It is overlapped with the orthographic projection of the shielding part on the substrate.
  • a plurality of signal lines are further included, at least some of the signal lines are connected to the shielding portion.
  • the shielding portion has a width of 3 ⁇ m to 5 ⁇ m.
  • the width of the isolation portion is 2.5 ⁇ m ⁇ 3 ⁇ m.
  • it further includes: a second metal layer located on the side of the active layer away from the substrate and stacked with the first metal layer, and the plurality of signal lines include a power supply located on the second metal layer wires, at least part of the power wires are connected to the shielding part.
  • the shielding part includes:
  • the first shielding part extends along the extension path of the isolation part and covers at least part of the isolation part;
  • the second shielding part intersects with the isolation part.
  • the power cord includes a surface power supply disposed around the first area, the shielding portion includes a first shielding portion, and the first shielding portion is connected to the surface power supply.
  • the power line includes a first power line and a second power line distributed along the first direction at intervals;
  • the first metal layer also includes a power connection line, which extends along the first direction and is connected to the first power line and the second power line via holes, so that the first power line and the second power line are connected to each other through the power connection line.
  • the shielding part includes a second shielding part, at least part of the power connection wires are connected to the shielding part, and the second shielding part is extended along the second direction.
  • the shielding portion includes a first shielding portion and a second shielding portion, and the first shielding portion is connected to the power connection line through the second shielding portion.
  • the isolation portion includes a first isolation portion and a second isolation portion that are successively distributed and intersected in the extending direction thereof, the first isolation portion is extended and formed along the first direction, and the second isolation portion The portion is extended along the second direction, and the orthographic projection of the first isolation portion on the substrate and the orthographic projection of the second shielding portion on the substrate are at least partially overlapped.
  • the second area further includes a transition area and a main display area, the transition area is located between the main display area and the first area, and the isolation part, the shielding part and the power connection line are located in the transition area.
  • the first power cord is located in the transition area
  • the second power cord includes a second main body and a second connection end for connecting the power connection line
  • the second main body is in the second area
  • the second connection end extends from the second body part toward the first power line
  • the first power line is located on the side of the isolation part facing the first area
  • the second connection end is located on the side of the isolation part away from the first area
  • the power connection line is connected to the second connection end and the first power line
  • the orthographic projection of the power connection line on the substrate and the orthographic projection of the isolation part on the substrate are at least partially overlapped.
  • the first metal layer includes scanning signal lines and data connection lines, the scanning signal lines are located in the main display area, and the data connection lines are located in the transition area.
  • the second metal layer further includes a plurality of data lines, at least two data lines are located on both sides of the first area in the first direction, and the data connection lines and the data connection lines located in the first direction The data lines on both sides in the first direction are connected through the holes, so that the data lines on both sides of the first region in the first direction are connected to each other through the data connection lines.
  • the multiple data connection lines are distributed in the transition area.
  • the data connection line is located on a side of the isolation portion facing the first region.
  • At least part of the first power lines are provided with two second power lines on both sides in the first direction, and the two second power lines are connected to the first power supply through the power connection line. lines connected to each other;
  • the first metal layer further includes bridge lines located in the transition region, at least partially connected between two power connection lines located at both ends of the first power line in the first direction.
  • the shielding part and the bridging wire are connected to the same power connection wire;
  • the power connection line includes a first power connection line and a second power connection line, at least part of the first power connection line is connected to the shielding part, and at least part of the second power connection line is connected to the bridge line.
  • the active layer includes a first semiconductor portion and a second semiconductor portion, the first semiconductor portion and the second semiconductor portion are located on both sides of the first region in the first direction, and a plurality of The first semiconductor portions are arranged at intervals along the second direction, and the plurality of second semiconductor portions are arranged at intervals along the second direction,
  • At least one group of at least two first semiconductor parts, at least two second semiconductor parts, at least one first semiconductor and at least one second semiconductor is connected to each other through the isolation part.
  • the embodiment of the second aspect of the present application provides a display device, which includes the display panel in any one of the above-mentioned embodiments.
  • the display panel includes a first area and a second area.
  • Photosensitive components such as a camera can be arranged in the first area, and a normal display of the display panel can be realized in the second area.
  • the display panel includes an active layer and a first metal layer, the active layer includes an isolation portion, the first metal layer includes a shielding portion, and the orthographic projection of the isolating portion on the substrate overlaps with the orthographic projection of the shielding portion on the substrate, so that The shielding part can shield at least part of the isolation part.
  • the isolation part shielded by the shielding part is not doped, so that the resistance value of this part of the isolation part is relatively large.
  • the electrostatic adsorption on the isolation part can be reduced, and the defect of the display panel caused by excessive static electricity on the isolation part can be improved, and the yield rate of the display panel can be improved.
  • FIG. 1 shows a schematic top view of a display panel according to an embodiment of the present application
  • Fig. 2 is a partial enlarged view in an example of the Q region in Fig. 1;
  • Fig. 3 is a schematic diagram of an enlarged structure of a partial layer structure in Fig. 1;
  • Fig. 4 is the sectional view of B-B place among Fig. 2;
  • Fig. 5 is an enlarged structural schematic diagram of the partial layer structure in Fig. 1 in another embodiment
  • Fig. 6 is an enlarged structural schematic diagram of the partial layer structure in Fig. 1 in another embodiment
  • Fig. 7 is a schematic diagram of an enlarged structure of the partial layer structure in Fig. 1 in another embodiment
  • Fig. 8 is a schematic diagram of an enlarged structure of the partial layer structure in Fig. 1 in another embodiment
  • Fig. 9 is a sectional view of Fig. 2;
  • Fig. 10 is an enlarged structural schematic diagram of the partial layer structure in Fig. 1 in another embodiment
  • FIG. 11 shows a schematic top view of a display device according to an embodiment of the present application.
  • Fig. 12 shows a cross-sectional view along D-D in Fig. 11 .
  • Active layer 210, isolation part; 211, first isolation part; 212, second isolation part; 220, first semiconductor part; 230, second semiconductor part; 240, third semiconductor part;
  • First metal layer 310. Shielding part; 311. First shielding part; 312. Second shielding part; 320. Power connection line; 330. Scanning signal line; 340. Data connection line; 350. Bridge line;
  • Second metal layer 40a, power line; 410, surface power supply; 420, first power line; 430, second power line; 440, data line;
  • AA1 first area
  • TA transition area
  • ZA main display area
  • NA non-display area
  • photosensitive components such as front-facing cameras, infrared light sensors, and proximity light sensors need to be integrated on one side of the display panel.
  • a light-transmitting area may be provided on the above-mentioned electronic device, and the photosensitive component may be arranged on the back of the light-transmitting area.
  • the light-transmitting area can be provided with sub-pixels to realize the full-screen display of the display panel, or the light-transmitting area may not be provided with sub-pixels, that is, the light-transmitting area is a hole-digging area, and at this time, the light-transmitting area is not provided with a driving circuit for driving sub-pixel display. .
  • the driving circuit for driving the display of the sub-pixels in the light-transmitting area may not be arranged in the light-transmitting area to further increase the light transmittance of the light-transmitting area.
  • no driving circuit is provided in the light-transmitting area, the layer structure of the light-transmitting area is quite different from that of other display areas, which may cause problems such as accumulation of static electricity around the light-transmitting area and cause defects in the display panel.
  • the drive circuits include semiconductor parts, and usually the semiconductor parts of the drive circuits in the same column are connected to each other.
  • the display panel includes a light-transmitting region, and no drive circuit is provided in the light-transmitting region, the semiconductor parts located on both sides of the light-transmitting region in the column direction are isolated by the light-transmitting region, resulting in the size of the semiconductor parts located on both sides of the light-transmitting region being different from other parts. Display discrepancies occur due to inconsistencies in position and size.
  • an isolation ring is provided on the active layer on the peripheral side of the light transmission area, and the semiconductor parts on both sides of the light transmission area in the column direction are connected through the isolation ring to reduce the two sides of the light transmission area.
  • the size difference between the semiconductor portion on one side and the semiconductor portion at other positions improves the display effect of the display panel.
  • the isolation ring is a semiconductor material layer, and when the semiconductor part at other positions is heavily doped, the isolation ring will also be implanted with plasma so that the isolation ring can conduct electricity.
  • the inventors found that an isolation ring with a certain conductivity can easily attract process static charges, and the isolation ring is usually connected to other semiconductor parts forming a thin film transistor, which causes the charges to move to the semiconductor part through the isolation ring, and then couple to the thin film
  • the gate of the transistor eventually causes the characteristic deviation of the thin film transistor, which causes the failure of the entire row of thin film transistors in the driving circuit, which in turn leads to a defective display panel.
  • An embodiment of the present application provides a display panel, and the display panel may be an organic light emitting diode (Organic Light Emitting Diode, OLED) display panel.
  • OLED Organic Light Emitting Diode
  • FIG. 1 shows a schematic top view of a display panel 100 according to an embodiment of the present application
  • FIG. 2 shows an example partial enlarged view of area Q in FIG. 1 .
  • the display panel 100 has a first area AA1, a second area AA2, and a non-display area NA surrounding the first area AA1 and the second area AA2.
  • the second area AA2 is arranged around at least part of the first area AA1.
  • the light-transmitting area of the first area AA1 The ratio is greater than the light transmittance of the second area AA2.
  • the display panel 100 may not include the non-display area NA.
  • the light transmittance of the first area AA1 is greater than or equal to 15%.
  • the light transmittance of each functional film layer of the display panel 100 in this embodiment is greater than 80%, or even The light transmittance of at least some of the functional film layers is greater than 90%.
  • the light transmittance of the first region AA1 is greater than the light transmittance of the second region AA2, so that the display panel 100 can integrate a photosensitive component on the back of the first region AA1 to realize a photosensitive component such as a camera. under-screen integration.
  • the first area AA1 can display pictures, increase the display area of the display panel 100, and realize a full-screen design of the display device.
  • the first area AA1 is an open area, and no sub-pixel 110 is disposed in the first area AA1 , and the first area AA1 cannot display.
  • the first area AA1 can display pictures
  • the first area AA1 includes the first sub-pixel 110, and the first driving circuit for driving the first sub-pixel 110 to display is located in the second area AA2, so as to further improve the first The transmittance of the area AA1.
  • the sub-pixel 110 is not provided in the first area AA1 , the first area AA1 cannot display, and the first area AA1 is a hole-digging area for illustration.
  • the display panel 100 includes sub-pixels 110 located in the second area AA2 and a driving circuit, and the driving circuit is used to drive the sub-pixels 110 to emit light.
  • the sub-pixel 110 may include a first electrode, a second electrode, and a light emitting structure between the first electrode and the second electrode.
  • the light emitting structure may include layer structures such as a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, and an electron injection layer.
  • the first electrode may be a pixel electrode and is connected to the driving circuit.
  • the second electrode may be a common electrode.
  • FIG. 3 is an enlarged structural schematic diagram of some layer structures in FIG. 1
  • FIG. 4 is a partial cross-sectional view at B-B in FIG. 2 .
  • the display panel 100 provided by the embodiment of the present application includes: a substrate 10 , an active layer 20 and a first metal layer 30 disposed on the substrate 10 .
  • the active layer 20 is located on one side of the substrate 10, the active layer 20 includes an isolation portion 210 located in the second area AA2 and surrounding at least part of the first area AA1; the first metal layer 30 is located on a side of the active layer 20 away from the substrate 10 On the side, the first metal layer 30 includes a shielding portion 310 , and the orthographic projection of the isolation portion 210 on the substrate 10 overlaps with the orthographic projection of the shielding portion 310 on the substrate 10 .
  • the active layer 20 includes a semiconductor material, so that when plasma implantation is performed on the partial region of the active layer 20, the partial region of the active layer 20 can conduct electricity.
  • the display panel 100 includes an active layer 20 and a first metal layer 30, the active layer 20 includes an isolation portion 210, the first metal layer 30 includes a shielding portion 310, and the isolation portion 210
  • the orthographic projection on the substrate 10 overlaps with the orthographic projection of the shielding portion 310 on the substrate 10 , so that the shielding portion 310 can shield at least part of the isolation portion 210 .
  • the isolation portion 210 shielded by the shielding portion 310 is not doped, so that the part of the isolation portion 210 A larger resistance value can reduce the amount of electrostatic adsorption on the isolation portion 210 , thereby improving the defect of the display panel 100 caused by excessive static electricity on the isolation portion 210 , and improving the yield rate of the display panel 100 .
  • the substrate 10 includes a substrate, and the substrate can be selected.
  • the substrate 101 can be made of glass, polyimide (Polyimide, PI) and other light-transmitting materials.
  • the substrate 10 may further include a support layer located on a side of the substrate away from the active layer 20 , and the support layer may include a steel plate layer and/or a foam layer.
  • a layer structure such as a buffer layer may also be provided between the substrate and the active layer 20 .
  • the second semiconductor portions 230 are located on both sides of the first region AA1 in the first direction Y, the plurality of first semiconductor portions 220 are arranged at intervals along the second direction X, and the plurality of second semiconductor portions 230 are arranged at intervals along the second direction X.
  • the first direction Y is a column direction.
  • FIG. 3 only illustrates part of the first semiconductor portion 220 and the second semiconductor portion 230 , and in other embodiments, the first semiconductor portion 220 and the second semiconductor portion 230 may also be arranged in other ways.
  • the active layer 20 further includes a third semiconductor portion 240 located in the second region AA2, the third semiconductor portion 240 is located on at least one side of the first region AA1 in the second direction X, and the second direction X is the row direction . Then the third semiconductor portion 240 can be extended along the first direction Y, and the third semiconductor portion 240 can cover the entire column, and the extension size of the first semiconductor portion and the second semiconductor portion 230 in the first direction Y is smaller than that of the third semiconductor portion. Section 240. Only the position of one of the third semiconductors 240 is shown in FIG. 3 . In other embodiments, there may be multiple third semiconductors 240, and the third semiconductor 240 may also be presented in other shapes, as long as the third semiconductor 240 is located in the first One side of the area AA1 in the second direction X is sufficient.
  • At least two first semiconductor portions 220 are connected to each other through the isolation portion 210, which can increase the extension size of the first semiconductor portion 220, thereby reducing the size between the first semiconductor portion 220 and the third semiconductor portion 240. difference to improve the display effect of the display panel 100 .
  • the plurality of first semiconductor parts 220 are connected to each other through the same isolation part 210 to further improve display differences of the display panel 100 .
  • At least two second semiconductor portions 230 are connected to each other through the isolation portion 210, which can increase the extension size of the second semiconductor portion 230, thereby reducing the size between the second semiconductor portion 230 and the third semiconductor portion 240. difference to improve the display effect of the display panel 100 .
  • the plurality of second semiconductor parts 230 are connected to each other through the same isolation part 210 to further improve display differences of the display panel 100 .
  • At least one first semiconductor portion 220 and at least one second semiconductor portion 230 are connected to each other through the isolation portion 210 to improve display differences.
  • the isolation portion 210 is arranged in a closed ring around the first area AA1, and the first semiconductor portion 220 and the second semiconductor portion 230 located on both sides of the first area AA1 in the first direction Y pass through the isolation portion 210 interconnected.
  • the structure of the active layer 20 can be simplified, and on the other hand, the display difference of the display panel 100 can be improved.
  • the display panel 100 further includes a plurality of signal lines, at least some of which are connected to the shielding portion 310 .
  • the shielding portion 310 is no longer a separate metal component, and the shielding portion 310 can discharge static electricity through the signal line, so as to prevent the accumulation of static electricity on the shielding portion 310 from affecting the yield of the display panel 100 .
  • These signal lines can be located on the first metal layer 30 or other metal layers, as long as these signal lines can transmit signals.
  • multiple shielding parts 310 there may be multiple shielding parts 310, and the multiple shielding parts 310 are arranged at intervals around the first area AA1.
  • signal lines and shielding parts 310 There are many kinds of corresponding relationships between signal lines and shielding parts 310.
  • multiple shielding parts 310 may be provided on the same signal line, and multiple shielding parts 310 may be distributed at intervals along the extending direction of the signal line, or one shielding part 310 may be provided on the same signal line. Section 310.
  • some of the multiple signal lines may be connected with the shielding portion 310 , and the other portion of the signal lines may not be connected with the shielding portion 310 .
  • signal lines There are many types of signal lines, and the signal lines may include data signal lines for transmitting data signals, power signal lines for transmitting power signals, voltage reference lines for transmitting voltage reference signals, scanning signal lines for transmitting scanning signals, and the like.
  • the display panel 100 further includes a second metal layer 40, which is located on the side of the active layer 20 away from the substrate 10 and is stacked with the first metal layer 30.
  • Multiple signal lines The wires include power wires 40 a located on the second metal layer 40 , and at least part of the power wires 40 a are connected to the shielding portion 310 .
  • the power line 40a is used to transmit the power signal, and the power signal has the characteristics of signal stability, so that the signal on the shielding part 310 is stable, and the disturbance caused by the unstable signal of the shielding part 310 can be avoided, further improving The yield rate of the display panel 100 is shown.
  • the second metal layer 40 may be disposed on a side of the first metal layer 30 facing the substrate 10 , or the second metal layer 40 may be disposed on a side of the first metal layer 30 facing away from the substrate 10 .
  • an insulating layer is disposed between the first metal layer 30 and the second metal layer 40 , and the insulating layer has holes to connect the first power line 420 , the second power line 430 and the power connection line 320 through holes.
  • the second metal layer 40 is located on the side of the first metal layer 30 away from the substrate 10 , so that the distance between the first metal layer 30 and the isolation part 210 is relatively close, and the distance between the shielding part 310 and the isolation part 210 is relatively short. , so that an off-state transistor can be formed between the shielding part 310 and the isolation part 210 .
  • the shielding portion 310 may extend in the same direction as the isolation portion 210, that is, the shielding portion 310 surrounds the first area AA1 and covers the isolation portion 210, which can increase the overlapping area of the shielding portion 310 and the isolation portion 210, and further improve the isolation. resistance of section 210.
  • the shielding portion 310 may intersect the extending direction of the isolation portion 210 , which facilitates the preparation and molding of the shielding portion 310 .
  • the shielding portion 310 includes a first shielding portion 311 extending along the extending path of the isolation portion 210 and covering at least part of the isolation portion 210 .
  • the first shielding portion 311 is disposed around the first area AA1 , which can increase the overlapping area of the shielding portion 310 and the isolation portion 210 , and further increase the resistance of the isolation portion 210 .
  • the first shielding portion 311 is in the shape of a closed ring, and the first shielding portion 311 can disperse process charges, thereby reducing the static electricity of the isolation portion 210 .
  • the shielding portion 310 includes a second shielding portion 312 , and the second shielding portion 312 is intersected with the isolation portion 210 to facilitate the preparation and molding of the second shielding portion 312 .
  • the second shielding portion 312 intersects the isolation portion 210, at least part of the isolation portion 210 is not blocked by the second shielding portion 312, and this portion of the isolation portion 210 will be heavily doped during the manufacturing process to have electrical conductivity, thereby making this part
  • the isolation part 210 and the second shielding part 312 form a thin film transistor, which can form a large resistance in the part shielded by the second shielding part 312 to prevent charge from flowing on the isolation part 210 and suppress the conduction of static electricity.
  • the shielding part 310 may include both the above-mentioned first shielding part 311 and the above-mentioned second shielding part 312 .
  • the surface power supply 410 refers to the power supply line 40a with a larger width, and does not refer to the power supply installed on the entire surface of the second area AA2. Other power lines are connected to the surface power supply 410 . Since the surface power supply 410 is disposed around the first area AA1, when the first shielding portion 311 extends along the extension path of the isolation portion 210 and the first shielding portion 311 is disposed around the first area AA1, the first shielding portion 311 can extend to the surface power supply. 410 , so that the second shielding part 312 can be connected to the surface power supply 410 through a hole, so as to facilitate the mutual connection between the first shielding part 311 and the surface power supply 410 . The connection of the first shielding part 311 to the surface power supply 410 also enables the first shielding part 311 to carry a stable electrical signal, preventing the first shielding part 311 from being suspended and interfering with the signal.
  • an insulating layer is disposed between the first metal layer 30 and the second metal layer 40 , and the first shielding portion 311 is connected to the surface power supply 410 through holes. That is, a via hole is opened on the insulating layer between the first metal layer 30 and the second metal layer 40 , and the first shielding portion 311 and the planar power supply 410 are connected through the via hole on the insulating layer.
  • the power supply line 40a includes a first power supply line 420 and a second power supply line 430 distributed along the first direction Y at intervals
  • the first metal layer 30 includes a power supply connection line 320
  • the power supply The connection line 320 extends along the first direction Y and is connected to the first power line 420 and the second power line 430 through holes, so that the first power line 420 and the second power line 430 are connected to each other through the power connection line 320, at least partially
  • the power connection line 320 is connected to the second shielding portion 312 , and the second shielding portion 312 is formed extending along the second direction X. As shown in FIG.
  • the first power line 420 and the second power line 430 of the second metal layer 40 are switched through the power connection line 320 of the first metal layer 30 .
  • the first power line 420 and the second power line 430 will be exchanged near the isolation part 210, so the distance between part of the power connection line 320 and the isolation part 210 is relatively close, and the first shielding part 311 is connected to the power connection line 320
  • the layer structure of the first metal layer 30 can be simplified.
  • the power connection line 320 and the first shielding portion 311 are formed extending in different directions, so as to prevent the second shielding portion 312 from affecting the connection between the power connection line 320 and the first power line 420 and/or the second power line 430 .
  • the shielding part 310 includes both the first shielding part 311 and the second shielding part 312, the first shielding part 311 can be connected to the power connection line 320 through the second shielding part 312, and then The first shielding portion 311 is connected to the first power line 420 and/or the second power line 430 through the power connection line 320 .
  • the first shielding part 311 can also be connected to both the surface power supply 410 and the second shielding part 312 and connected to the power connection line 320 through the second shielding part 312 .
  • the isolation part 210 includes a first isolation part 211 and a second isolation part 212 that are successively distributed and intersected in the extending direction thereof, and the first isolation part 211 is along the The first direction Y is extended and formed, and the second isolation portion 212 is extended and formed along the second direction X.
  • the intersection of the first isolation portion 211 and the second isolation portion 212 can reduce the distance between the isolation portion 210 and the first area AA1 , so that the shape of the isolation portion 210 is more compatible with the shape of the edge of the first area AA1 .
  • the orthographic projection of the first isolation portion 211 on the substrate 10 and the orthographic projection of the second shielding portion 312 on the substrate 10 are at least partially overlapped.
  • the extension directions of the first isolation part 211 and the second shielding part 312 are different, so that the second shielding part 312 extends toward the first isolation part 211 and the shielding part 310 is divided into the first isolation part 211.
  • the second shielding part 312 does not need to be bent, and can The shape of the second shielding portion 312 is simplified.
  • the orthographic projections of the second isolation portion 212 on the substrate 10 and the orthographic projections of the second shielding portion 312 on the substrate 10 are mutually offset. Further, the orthographic projection of the second isolation portion 212 on the substrate 10 and the orthographic projection of the second shielding portion 312 on the substrate 10 are arranged parallel to each other.
  • the first shielding portion 311 includes both the first isolation portion 311 extending along the first direction Y.
  • An extension section the first shielding portion 311 also includes a second extension section extending along the second direction X, and the orthographic projection of at least part of the first isolation portion 211 on the substrate 10 is located at the orthographic projection of the first extension section on the substrate 10 Inside, the orthographic projection of at least part of the second isolation portion 212 on the substrate 10 is located within the orthographic projection of the second extension section on the substrate 10 .
  • increase the resistance of the isolation portion 210 In order to further increase the overlapping area of the first shielding portion 311 and the isolation portion 210 , increase the resistance of the isolation portion 210 .
  • the shielding portion 310 has a width of 3 ⁇ m ⁇ 5 ⁇ m.
  • the width direction of the shielding portion 310 is the first direction Y
  • the width of the shielding portion 310 is the extension dimension of the shielding portion 310 in the first direction Y.
  • the width direction of the shielding portion 310 is the second direction X.
  • the width direction of the first shielding portion 311 is perpendicular to its extending direction.
  • the width of the isolation portion 210 is 2.5 ⁇ m ⁇ 3 ⁇ m.
  • the width of the first isolation portion 211 is 2.5 ⁇ m ⁇ 3 ⁇ m.
  • the first isolation is extended along the first direction Y, the width direction of the first isolation part 211 is the second direction X, and the extension size of the first isolation part 211 in the second direction X is 2.5 ⁇ m ⁇ 3 ⁇ m.
  • the width of the second isolation portion 212 is 2.5 ⁇ m ⁇ 3 ⁇ m.
  • the second isolation is formed by extending along the second direction X, the width direction of the second isolation portion 212 is the first direction Y, and the extension dimension of the second isolation portion 212 in the first direction Y is 2.5 ⁇ m ⁇ 3 ⁇ m.
  • the second area AA2 further includes a transition area TA and a main display area ZA, and the transition area TA is located between the main display area ZA and the first area AA1 , the isolation part 210 , the shielding part 310 and the power connection line 320 are located in the transition area TA.
  • the main display area ZA is used to realize the display of the display panel 100 , and disposing the isolation part 210 , the shielding part 310 and the power connection line 320 in the transition area TA can improve its influence on the display effect of the main display area ZA.
  • the transition area TA may surround the first area AA1 in an annular shape.
  • the transition area TA can surround the first area AA1 and form a polygonal ring structure, as long as the transition area TA is located between the main display area ZA and the first area AA1 .
  • the shielding portion 310 is provided in the transition area TA to increase the overall resistance of the isolation portion 210 , which can reduce the amount of electrostatic adsorption of the isolation portion 210 and improve the yield of the display panel 100 .
  • the first power line 420 is in the transition area TA
  • the second power line 430 includes a second main body and a second connection end for connecting the power connection line 320 .
  • the two main parts are located in the second area AA2 and on a side of the isolation part 210 away from the first area AA1 , and the second connecting end extends from the second main part toward the first power line 420 .
  • the second body part is connected to the driving circuit in the main display area ZA to provide power to the driving circuit.
  • the second connection end extends toward the first power line 420, and the end of the second connection end may be located on the side of the isolation portion 210 facing the first area AA1, or the end of the second connection end may be located on the side of the isolation portion 210 away from the first area AA1.
  • the power connection line 320 can be connected to the second power line 430 through the second connection end.
  • the first power line 420 is located on the side of the isolation portion 210 facing the first area AA1
  • at least part of the second connection end of the second power line 430 is located on the side of the isolation portion 210 away from the first area AA1
  • the power connection line 320 is connected to the second connection end and the first power line 420
  • at least part of the orthographic projection of the power connection line 320 on the substrate 10 and the orthographic projection of the isolation portion 210 on the substrate 10 are at least partially overlapped.
  • part of the power connection wires 320 connects the second connection end of the first power wire 420 and the second power wire 430 across the isolation portion 210, that is, at least part of the power connection wires 320 are on the positive side of the substrate 10.
  • the orthographic projection of the projection and the isolating portion 210 on the substrate 10 is at least partially overlapped, so that the power connection line 320 can cover a part of the isolating portion 210 and further increase the resistance of the isolating portion 210 .
  • the first power line 420 is located on the side of the isolation portion 210 facing the first area AA1
  • the second connection end extends from the second body portion to the side of the isolation portion 210 facing the first area AA1
  • the power connection line 320 connects the first power line 420 and the second connection end on the side of the isolation portion 210 facing the first area AA1 .
  • the second connection end extends to the side of the isolation portion 210 facing the first area AA1 and is connected to the power connection line 320 via a hole, which can increase the distance between the power connection line 320 and the second main body. The spacing between them is to prevent the power connection wire 320 from affecting the interconnection between the second main body and the driving circuit.
  • the first metal layer 30 further includes scanning signal lines 330 and data connection lines 340, the data connection lines 340 are located in the transition area TA, and the scanning signal lines 330 are located in the main display District ZA.
  • the metal material distribution area of the first metal layer 30 in the transition area TA can be increased by arranging the data connection lines 340 in the transition area TA.
  • the static electricity of the scanning signal line 330 can further improve the display defect caused by the defective scanning signal line 330 .
  • the second metal layer 40 further includes a plurality of data lines 440, at least two data lines 440 are located on both sides of the first area AA1 in the first direction Y, and the data connection lines 340 and the The data lines 440 on both sides in the first direction Y are connected through holes, so that the data lines 440 located on both sides of the first area AA1 in the first direction Y are connected to each other through the data connection line 340 .
  • the data lines 440 located on both sides of the first area AA1 in the first direction Y are exchanged through the data connection lines 340 located in the transition area TA. That is, the data lines 440 are all located in the transition area TA, which can increase the metal material distribution area of the first metal layer 30 in the transition area TA, and improve the static electricity on the scanning signal lines 330 in the first metal layer 30 .
  • the two data lines 440 connected to each other through the data connection line 340 are used to connect multiple driving circuits in the same column, so as to realize the column driving of the display panel 100 .
  • a plurality of data lines 440 may be disposed on both sides of the first area AA1 in the first direction Y, and the data lines 440 in the same column are connected to each other through a data connection line 340 .
  • the data lines 440 located on both sides of the first area AA1 in the first direction are exchanged through the data connection lines 340 located in the first metal layer 30, that is, along the second
  • the multiple data connection lines 340 arranged side by side in the direction X are all located on the first metal layer 30 , compared to the multiple data connection lines 340 arranged side by side along the second direction X located alternately on the first metal layer 30 and the second metal layer 40
  • the metal material distribution area of the first metal layer 30 can be further increased, and the ability of the data connection line 340 to disperse the static electricity on the scanning signal line 330 can be improved.
  • At least part of the data connection lines 340 are bent around the first area AA1 to reduce the distance between the data connection lines 340 and the first area AA1, reduce the distribution area of the transition area TA, and reduce the area ratio of the non-display area .
  • the data connection line 340 is located on the side of the isolation part 210 facing the first area AA1, on the one hand, the distribution area of the data connection line 340 in the main display area ZA is reduced, and on the other hand, the data connection line 340 is prevented from affecting the main display area. Wiring within the ZA.
  • the orthographic projections of at least part of the data connection lines 340 and the respective first power lines 420 on the substrate 10 are at least partially overlapped, so as to reduce the total distribution area of the metal material in the transition area TA and reduce the size of the transition area TA , reducing the area ratio of the non-display area in the display panel 100 .
  • the first power line 420 is provided with two second power lines 430 on both sides in the first direction Y, and the two second power lines 430 pass through the power supply
  • the connection line 320 communicates with the first power line 420;
  • the first metal layer 30 also includes a bridge line 350 located in the transition area TA, and at least part of the two power connection lines 320 located at both ends of the first power line 420 in the first direction Y Bridge wires 350 are connected therebetween.
  • two second power lines 430 are correspondingly arranged on both sides of at least part of the first power line 420 , and the first power line 420 is connected to the two second power lines 430 through the two power connection lines 320 . interconnected.
  • a bridging wire 350 is connected between the two power connecting wires 320 at two ends of the first power wire 420 , that is, the bridging wire 350 is connected in parallel with the first power wire 420 through the two power connecting wires 320 .
  • At least part of the bridging line 350 is extended along the first direction Y, so as to simplify the wiring shape of the bridging line 350 .
  • the shielding portion 310 and the bridge wire 350 can be connected to the same power connection wire 320, or the shielding portion 310 and the bridge wire 350 can be connected to different power wires 320.
  • the power connection line 320 includes a first power connection line and a second power connection line, at least part of the first power connection line is connected to the shielding portion 310 , and at least part of the second power connection line is connected to the bridging line 350 .
  • part of the power connection lines 320 of the plurality of power connection lines 320 may be connected with the shielding portion 310 and/or the bridge line 350 , and the other part of the power connection lines 320 is neither connected with the shielding portion 310 nor the bridge line 350 .
  • a part of the power connection lines 320 that are closer to the isolation part 210 along the second direction X is connected to the shielding part 310, and the other part is farther from the isolation part 210 along the second direction X.
  • Bridge line 350 is connected to 320 .
  • the shielding portion 310 is connected to a part of the power connecting lines 320 that are closer to the first isolation portion 211 along the second direction X among the plurality of power connecting lines 320 .
  • the embodiment of the present application further provides a display device, and the display device may include the display panel 100 in any of the foregoing implementation manners.
  • the display device includes the display panel 100 of the above-mentioned embodiments.
  • FIG. 11 shows a schematic top view of a display device according to an embodiment of the present application
  • FIG. 12 shows a cross-sectional view along the direction D-D in FIG. 11
  • the display panel 100 may be the display panel 100 of one of the above-mentioned embodiments
  • the display panel 100 has a first area and a second area, the light transmittance of the first area is greater than the light transmittance of the second area .
  • the display panel 100 includes a first surface S1 and a second surface S2 opposite to each other, wherein the first surface S1 is a display surface.
  • the display device further includes a photosensitive component 200 located on the second surface S2 side of the display panel 100 , and the photosensitive component 200 corresponds to the position of the first area.
  • the photosensitive component 200 may be an image acquisition device for acquiring external image information.
  • the photosensitive component 200 is a complementary metal oxide semiconductor (Complementary Metal Oxide Semiconductor, CMOS) image acquisition device, and in some other embodiments, the photosensitive component 200 can also be a charge-coupled device (Charge-coupled Device, CCD) Image acquisition devices and other forms of image acquisition devices.
  • CMOS Complementary Metal Oxide Semiconductor
  • CCD Charge-coupled Device
  • the photosensitive component 200 may not be limited to an image acquisition device, for example, in some embodiments, the photosensitive component 200 may also be an infrared sensor, a proximity sensor, an infrared lens, a flood sensing element, an ambient light sensor, and a dot matrix projection light sensors such as
  • the display device can also integrate other components on the second surface S2 of the display panel 100 , such as an earpiece, a speaker, and the like.

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  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

本申请公开了一种显示面板及显示装置，显示面板具有第一区及环绕至少部分第一区设置的第二区，显示面板包括：基板，有源层，位于基板的一侧，有源层包括位于第二区并环绕至少部分第一区设置的隔离部；第一金属层，位于有源层背离基板的一侧，第一金属层包括遮挡部，隔离部在基板上的正投影与遮挡部在基板上的正投影交叠设置。本申请能够减小隔离部上的静电吸附，进而改善由于隔离部上静电量过多导致的显示面板不良，能够提高显示面板的良率。

Description

显示面板及显示装置
本申请要求于2021年12月27日提交中国专利局、申请号为202111612192.8、申请名称为“显示面板及显示装置”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及显示领域，具体涉及一种显示面板及显示装置。
背景技术
传统的电子设备如手机、平板电脑等，由于需要集成诸如前置摄像头、听筒以及红外感应元件等。现有技术中，可通过在显示屏上开槽(Notch)或开孔，外界光线可通过屏幕上的开槽或开孔进入位于屏幕下方的感光元件。但是这会导致空孔区或者槽区周侧的层结构与其他位置层结构不同而使得显示面板出现不良。
发明内容
本申请实施例提供一种显示面板及显示装置，旨在提高显示面板的良率。
本申请第一方面的实施例提供一种显示面板，显示面板具有第一区及环绕至少部分第一区设置的第二区，显示面板包括：基板，有源层，位于基板的一侧，有源层包括位于第二区并环绕至少部分第一区设置的隔离部；第一金属层，位于有源层背离基板的一侧，第一金属层包括遮挡部，隔离部在基板上的正投影与遮挡部在基板上的正投影交叠设置。
根据本申请第一方面的实施方式，还包括多条信号线，至少部分信号线连接于遮挡部。
根据本申请第一方面前述任一实施方式，遮挡部的宽度为3μm～5μm。
根据本申请第一方面前述任一实施方式，隔离部的宽度为2.5μm～3μm。
根据本申请第一方面前述任一实施方式，还包括：第二金属层，位于有源层背离基板的一侧并与第一金属层层叠设置，多条信号线包括位于第二金属层的电源线，至少部分电源线连接于遮挡部。
根据本申请第一方面前述任一实施方式，遮挡部包括：
第一遮挡部，沿隔离部的延伸路径延伸设置并覆盖至少部分隔离部；和/或
第二遮挡部，与隔离部交叉设置。
根据本申请第一方面前述任一实施方式，电源线包括环绕第一区设置的面电源，遮挡部包括第一遮挡部，第一遮挡部连接于面电源。
根据本申请第一方面前述任一实施方式，电源线包括沿第一方向间隔分布的第一电源线和第二电源线；
第一金属层还包括电源连接线，电源连接线沿第一方向延伸并与第一电源线和第二电源线过孔连接，以使第一电源线和第二电源线通过电源连接线相互导通，遮挡部包括第二遮挡部，至少部分电源连接线连接于遮挡部，且第二遮挡部沿第二方向延伸成型。
根据本申请第一方面前述任一实施方式，遮挡部包括第一遮挡部和第二遮挡部，第一遮挡部通过第二遮挡部连接于电源连接线。
根据本申请第一方面前述任一实施方式，隔离部包括在其延伸方向上相继分布并相交设置的第一隔离部和第二隔离部，第一隔离部沿第一方向延伸成型，第二隔离部沿第二方向延伸成型，第一隔离部在基板上的正投影和第二遮挡部在基板上的正投影至少部分交叠设置。
根据本申请第一方面前述任一实施方式，第二区还包括过渡区和主显示区，过渡区位于主显示区和第一区之间，隔离部、遮挡部和电源连接线位于过渡区。
根据本申请第一方面前述任一实施方式，第一电源线位于过渡区，第二电源线包括第二主体部和用于连接电源连接线的第二连接端，第二主体部在第二区并位于隔离部背离第一区的一侧，第二连接端由第二主体部朝向第一电源线延伸。
根据本申请第一方面前述任一实施方式，第一电源线位于隔离部朝向第一区的一侧，第二连接端位于隔离部背离第一区的一侧，电源连接线连接第二连接端和第一电源线，且电源连接线在基板上的正投影和隔离部在基板上的正投影至少部分交叠设置。
根据本申请第一方面前述任一实施方式，第一金属层包括扫描信号线和数据连接线，扫描信号线位 于主显示区，数据连接线位于过渡区。
根据本申请第一方面前述任一实施方式，第二金属层还包括多条数据线，至少两条数据线位于第一区在第一方向上的两侧，数据连接线与位于其在第一方向上两侧的数据线过孔连接，以使位于第一区在第一方向上两侧的数据线通过数据连接线相互连通。
根据本申请第一方面前述任一实施方式，多条数据连接线在过渡区间隔分布。
根据本申请第一方面前述任一实施方式，数据连接线位于隔离部朝向第一区的一侧。
根据本申请第一方面前述任一实施方式，至少部分第一电源线在第一方向上的两侧设置有两个第二电源线，两个第二电源线均通过电源连接线与第一电源线相互连通；
第一金属层还包括位于过渡区的桥接线，至少部分位于第一电源线在第一方向上两端的两个电源连接线之间连接有桥接线。
根据本申请第一方面前述任一实施方式，遮挡部和桥接线连接于同一电源连接线；或者
电源连接线包括第一电源连接线和第二电源连接线，至少部分第一电源连接线连接于遮挡部，至少部分第二电源连接线连接于桥接线。
根据本申请第一方面前述任一实施方式，有源层包括第一半导体部和第二半导体部，第一半导体部和第二半导体部位于第一区在第一方向上的两侧，多个第一半导体部沿第二方向间隔设置，多个第二半导体部沿第二方向间隔设置，
其中，至少两个第一半导体部、至少两个第二半导体部、至少一个第一半导体和至少一个第二半导体中的至少一组通过隔离部相互连接。
本申请第二方面的实施例提供一种显示装置，其包括上述任一实施方式的显示面板。
在本申请实施例提供的显示面板中，显示面板包括第一区和第二区，可以在第一区设置摄像头等感光组件，在第二区实现显示面板的正常显示。显示面板包括有源层和第一金属层，有源层包括隔离部，第一金属层包括遮挡部，且隔离部在基板上的正投影与遮挡部在基板上的正投影交叠设置，使得遮挡部能够遮挡至少部分隔离部。在显示面板的制备过程中，由于遮挡部的存在，因此在对有源层进行等掺杂时，被遮挡部遮挡的隔离部上没有被掺杂，使得该部分隔离部的电阻值较大，能够减小隔离部上的静电吸附，进而改善由于隔离部上静电量过多导致的显示面板不良，能够提高显示面板的良率。
附图说明
通过阅读以下参照附图对非限制性实施例所作的详细描述，本申请的其它特征、目的和优点将会变得更明显，其中，相同或相似的附图标记表示相同或相似的特征，附图并未按照实际的比例绘制。
图1示出根据本申请一种实施例的显示面板的俯视示意图；
图2是图1中Q区域在一种示例中的局部放大图；
图3是图1中部分层结构的放大结构示意图；
图4是图2中B-B处的剖视图；
图5是另一种实施例中图1中部分层结构的放大结构示意图；
图6是又一种实施例中图1中部分层结构的放大结构示意图；
图7是还一种实施例中图1中部分层结构的放大结构示意图；
图8是再一种实施例中图1中部分层结构的放大结构示意图；
图9是图2的剖视图；
图10是还一种实施例中图1中部分层结构的放大结构示意图；
图11示出根据本申请一种实施例的显示装置的俯视示意图；
图12示出图11中D-D向的剖面图。
附图标记说明：
100、显示面板；110、子像素；
10、基板；
20、有源层；210、隔离部；211、第一隔离部；212、第二隔离部；220、第一半导体部；230、第二半导体部；240、第三半导体部；
30、第一金属层；310、遮挡部；311、第一遮挡部；312、第二遮挡部；320、电源连接线；330、扫描信号线；340、数据连接线；350、桥接线；
40、第二金属层；40a、电源线；410、面电源；420、第一电源线；430、第二电源线；440、数据线；
AA1、第一区；AA2、第二区；TA、过渡区；ZA、主显示区；NA、非显示区；
Y、第一方向；X、第二方向。
具体实施方式
下面将详细描述本申请的各个方面的特征和示例性实施例，为了使本申请的目的、技术方案及优点更加清楚明白，以下结合附图及具体实施例，对本申请进行进一步详细描述。应理解，此处所描述的具体实施例仅被配置为解释本申请，并不被配置为限定本申请。对于本领域技术人员来说，本申请可以在不需要这些具体细节中的一些细节的情况下实施。下面对实施例的描述仅仅是为了通过示出本申请的示例来提供对本申请更好的理解。
需要说明的是，在本文中，诸如第一和第二等之类的关系术语仅仅用来将一个实体或者操作与另一个实体或操作区分开来，而不一定要求或者暗示这些实体或操作之间存在任何这种实际的关系或者顺序。而且，术语“包括”、“包含”或者其任何其他变体意在涵盖非排他性的包含，从而使得包括一系列要素的过程、方法、物品或者设备不仅包括那些要素，而且还包括没有明确列出的其他要素，或者是还包括为这种过程、方法、物品或者设备所固有的要素。在没有更多限制的情况下，由语句“包括……”限定的要素，并不排除在包括所述要素的过程、方法、物品或者设备中还存在另外的相同要素。
应当理解，在描述部件的结构时，当将一层、一个区域称为位于另一层、另一个区域“上面”或“上方”时，可以指直接位于另一层、另一个区域上面，或者在其与另一层、另一个区域之间还包含其它的层或区域。并且，如果将部件翻转，该一层、一个区域将位于另一层、另一个区域“下面”或“下方”。
在诸如手机和平板电脑等电子设备上，需要在设置显示面板的一侧集成诸如前置摄像头、红外光传感器、接近光传感器等感光组件。在一些实施例中，可以在上述电子设备上设置透光区，将感光组件设置在透光区背面。
透光区可以设置子像素实现显示面板的全屏显示，或者透光区可以不设置子像素，即透光区为挖孔区，此时透光区也不设置用于驱动子像素显示的驱动电路。当透光区设置子像素时，用于驱动透光区子像素显示的驱动电路可以不设置于透光区来进一步提高透光区的透光率。当透光区不设置驱动电路时，透光区的层机构与其他显示区的层结构存在较大差异，可能会导致静电在透光区周侧积累等问题而使得显示面板出现不良。
驱动电路包括半导体部，通常同一列的驱动电路的半导体部相互连接。当显示面板包括透光区，且透光区不设置驱动电路时，位于透光区在列方向上两侧的半导体部被透光区隔离，导致位于透光区两侧的半导体部尺寸与其他位置尺寸不一致而出现显示差异。
在一些实施例中，为了改善显示效果，在透光区的周侧的有源层上设置隔离环，通过隔离环连接透光区列方向上两侧的半导体部，以减小透光区两侧的半导体部与其他位置半导体部的尺寸差异，改善显示面板的显示效果。
隔离环为半导体材料层，当对其他位置的半导体部进行重掺杂时，隔离环也会被等离子注入导致隔离环能够导电。发明人发现，具有一定导电能力的隔离环很容易吸引制程静电荷，而隔离环通常与其他形成薄膜晶体管的半导体部相互连接，这就导致电荷会通过隔离环移动至半导体部，进而耦合至薄膜晶体管的栅极，最终引起薄膜晶体管的特性偏移，造成驱动电路中整行的薄膜晶体管失效，进而导致显示面板不良。
为解决上述问题，本申请实施例提供了一种显示面板及显示装置，以下将结合附图对显示面板及显示装置的各实施例进行说明。
本申请实施例提供一种显示面板，该显示面板可以是有机发光二极管(Organic Light Emitting Diode，OLED)显示面板。
图1示出根据本申请一种实施例的显示面板100的俯视示意图，图2示出一种示例的图1中Q区域的局部放大图。
显示面板100具有第一区AA1、第二区AA2以及围绕第一区AA1、第二区AA2的非显示区NA，第二区AA2环绕至少部分第一区AA1设置，第一区AA1的透光率大于第二区AA2的透光率。在其他实施例中，显示面板100也可以不包括非显示区NA。
本文中，优选第一区AA1的透光率大于等于15％。为确保第一区AA1的透光率大于15％，甚至大于40％，甚至具有更高的透光率，本实施例中显示面板100的各个功能膜层的透光率均大于80％，甚至至少部分功能膜层的透光率均大于90％。
根据本申请实施例的显示面板100，第一区AA1的透光率大于第二区AA2的透光率，使得显示面板100在第一区AA1的背面可以集成感光组件，实现例如摄像头的感光组件的屏下集成。
第一区AA1的设置方式有多种，可选的，第一区AA1能够显示画面，提高显示面板100的显示面积，实现显示装置的全面屏设计。或者第一区AA1为开孔区，第一区AA1内未设置子像素110，第一区AA1不能够显示。当第一区AA1能够显示画面时，可选的，第一区AA1包括第一子像素110，用于驱动第一 子像素110显示的第一驱动电路位于第二区AA2，以进一步提高第一区AA1的透光率。
本申请实施例以第一区AA1内未设置子像素110，第一区AA1不能够进行显示，第一区AA1为挖孔区进行举例说明。可选的，显示面板100包括位于第二区AA2的子像素110和驱动电路，驱动电路用于驱动子像素110发光。
子像素110可以包括第一电极、第二电极和位于第一电极和第二电极之间的发光结构。发光结构可以包括空穴注入层、空穴传输层、发光层、电子传输层和电子注入层等层结构。第一电极可以为像素电极并与驱动电路相互连接。第二电极可以为公共电极。
请参阅图2至图4，图3是图1中一些层结构的放大结构示意图，图4是图2中B-B处的的局部剖视图。
如图2和图4所示，本申请实施例提供的显示面板100包括：基板10和设置于基板10的有源层20及第一金属层30。有源层20位于基板10的一侧，有源层20包括位于第二区AA2并环绕至少部分第一区AA1设置的隔离部210；第一金属层30位于有源层20背离基板10的一侧，第一金属层30包括遮挡部310，隔离部210在基板10上的正投影与遮挡部310在基板10上的正投影交叠设置。
可选的，有源层20包括半导体材料，使得对有源层20的部分区域进行等离子注入时，有源层20的部分区域能够导电。
在本申请实施例提供的显示面板100中，显示面板100包括有源层20和第一金属层30，有源层20包括隔离部210，第一金属层30包括遮挡部310，且隔离部210在基板10上的正投影与遮挡部310在基板10上的正投影交叠设置，使得遮挡部310能够遮挡至少部分隔离部210。在显示面板100的制备过程中，由于遮挡部310的存在，因此在对有源层20进行掺杂时，被遮挡部310遮挡的隔离部210上没有被掺杂，使得该部分隔离部210的电阻值较大，能够减小隔离部210上的静电吸附量，进而改善由于隔离部210上静电量过多导致的显示面板100不良，能够提高显示面板100的良率。
基板10的设置方式有多种，可选的，基板10包括衬底，衬底可以选用衬底101可以采用玻璃、聚酰亚胺(Polyimide，PI)等透光材料制成。基板10还可以包括位于衬底背离有源层20一侧的支撑层，支撑层可以包括钢板层和/或泡棉层。衬底和有源层20之间还可以设置缓冲层等层结构。
有源层20的设置方式有多种，在一些可选的实施例中，请继续参阅图3，有源层20包括第一半导体部220和第二半导体部230，第一半导体部220和第二半导体部230位于第一区AA1在第一方向Y上的两侧，多个第一半导体部220沿第二方向X间隔设置，多个第二半导体部230沿第二方向X间隔设置。第一方向Y为列方向。图3中仅示意出了部分第一半导体部220和第二半导体部230，在另一些实施例中，第一半导体部220和第二半导体部230还可以按照其它方式进行排布。
可选的，有源层20还包括位于第二区AA2的第三半导体部240，第三半导体部240位于第一区AA1在第二方向X上的至少一侧，第二方向X为行方向。那么第三半导体部240能够沿第一方向Y延伸设置，且第三半导体部240能够布满整列，而第一导体部和第二半导体部230在第一方向Y上的延伸尺寸小于第三半导体部240。图3中仅示意出了其中一个第三半导体240的位置，在其他实施例中第三半导体240还可以为多个，第三半导体240还可以以其他形状呈现，只要第三半导体240位于第一区AA1在第二方向X上的一侧即可。
在一些实施例中，至少两个第一半导体部220通过隔离部210相互连接，能够增长第一半导体部220的延伸尺寸，进而减小第一半导体部220和第三半导体部240之间的尺寸差异，改善显示面板100的显示效果。可选的，多个第一半导体部220通过同一隔离部210相互连接，以进一步改善显示面板100的显示差异。
在一些实施例中，至少两个第二半导体部230通过隔离部210相互连接，能够增长第二半导体部230的延伸尺寸，进而减小第二半导体部230和第三半导体部240之间的尺寸差异，改善显示面板100的显示效果。可选的，多个第二半导体部230通过同一隔离部210相互连接，以进一步改善显示面板100的显示差异。
在又一些实施例中，至少一个第一半导体部220和至少一个第二半导体部230通过隔离部210相互连接，改善显示差异。
在一些实施例中，隔离部210环绕第一区AA1呈封闭环状设置，位于第一区AA1在第一方向Y上两侧的第一半导体部220和第二半导体部230均通过隔离部210相互连接。一方面能够简化有源层20的结构，另一方面能够改善显示面板100的显示差异。
在一些可选的实施例中，显示面板100还包括多条信号线，至少部分信号线连接于遮挡部310。使得遮挡部310不再是单独设置的金属部件，遮挡部310能够通过信号线释放静电，避免遮挡部310上累积静电而影响显示面板100的良率。这些信号线可以位于第一金属层30或者其他金属层，只要这些信号线能够传输信号即可。
可选的，遮挡部310的数量可以为多个，多个遮挡部310环绕第一区AA1间隔设置。信号线和遮挡部310的对应关系有多种，例如同一信号线上可以设置有多个遮挡部310，多个遮挡部310沿信号线的延伸方向间隔分布，或者同一信号线上设置有一个遮挡部310。在又一些实施例中,还可以是多个信号线中的部分信号线上连接有遮挡部310，另一部分信号线上未连接遮挡部310。
信号线的种类有多种，信号线可以包括传输数据信号的数据信号线、传输电源信号的电源信号线、传输电压参考信号的电压参考线、传输扫描信号的扫描信号线等。
在一些可选的实施例中，请继续参阅图4，显示面板100还包括第二金属层40，位于有源层20背离基板10的一侧并与第一金属层30层叠设置，多条信号线包括位于第二金属层40的电源线40a，至少部分电源线40a连接于遮挡部310。
在这些可选的实施例中，电源线40a用于传输电源信号，电源信号具有信号稳定的特性，使得遮挡部310上的信号稳定，能够避免遮挡部310信号不稳定带来的扰动，进一步提高显示面板100的良率。
可选的，第二金属层40可以设置于第一金属层30朝向基板10的一侧，或者第二金属层40可以设置于第一金属层30背离基板10的一侧。可选的，第一金属层30和第二金属层40之间设置有绝缘层，绝缘层开孔以使第一电源线420、第二电源线430与电源连接线320过孔连接。
在本实施例中，第二金属层40位于第一金属层30背离基板10的一侧，使得第一金属层30与隔离部210的距离较近，遮挡部310与隔离部210的距离较近，使得遮挡部310和隔离部210之间能够形成关态晶体管。
可选的，遮挡部310可以与隔离部210的延伸方向一致，即遮挡部310环绕第一区AA1并覆盖隔离部210设置，能够增加遮挡部310和隔离部210的交叠面积，进一步提高隔离部210的电阻。或者，遮挡部310可以与隔离部210的延伸方向相交，便于遮挡部310的制备成型。
在一些实施例中，请参阅图5，遮挡部310包括第一遮挡部311，第一遮挡部311沿隔离部210的延伸路径延伸设置并覆盖至少部分隔离部210。例如，第一遮挡部311环绕第一区AA1设置，能够增加遮挡部310和隔离部210的交叠面积，进一步提高隔离部210的电阻。
可选的，第一遮挡部311呈封闭环状，第一遮挡部311能够分散制程电荷，进而降低隔离部210的静电量。
在另一些实施例中，请参阅图2和图3，遮挡部310包括第二遮挡部312，第二遮挡部312与隔离部210交叉设置，便于第二遮挡部312的制备成型。由于第二遮挡部312与隔离部210交叉设置，至少部分隔离部210没有被第二遮挡部312遮挡，这部分隔离部210在制备过程中会被重掺杂而具有导电性能，进而使得该部分隔离部210与第二遮挡部312形成薄膜晶体管，能够在被第二遮挡部312遮挡的部分形成大电阻，避免电荷在隔离部210上流动，抑制静电的传导。
在还一些实施例中，遮挡部310可以既包括上述的第一遮挡部311，也包括上述的第二遮挡部312。
第二金属层40的电源线40a的设置方式有多种，在一些可选的实施例中，请参阅图6，电源线40a包括环绕第一区AA1设置的面电源410，第一遮挡部311连接于面电源410。
在本申请中，面电源410是指宽度较大的电源线40a，并不是指在第二区AA2整面设置的电源，面电源410环绕第一区AA1设置，便于位于第一区AA1附件的其他电源线连接于面电源410。由于面电源410环绕第一区AA1设置，那么当第一遮挡部311沿隔离部210的延伸路径延伸且第一遮挡部311环绕第一区AA1设置时，第一遮挡部311能够延伸至面电源410，进而使得第二遮挡部312能够过孔连接于面电源410，便于第一遮挡部311和面电源410的相互连接。第一遮挡部311连接于面电源410还使得第一遮挡部311带有稳定的电信号，避免第一遮挡部311呈悬浮态而干扰信号。
可选的，第一金属层30和第二金属层40之间设置有绝缘层，第一遮挡部311和面电源410过孔连接。即第一金属层30和第二金属层40之间的绝缘层上开设有过孔，第一遮挡部311和面电源410通过绝缘层上的过孔连接。
在一些可选的实施例中，请参阅图7，电源线40a包括沿第一方向Y间隔分布的第一电源线420和第二电源线430，第一金属层30包括电源连接线320，电源连接线320沿第一方向Y延伸并与第一电源线420和第二电源线430过孔连接，以使第一电源线420和第二电源线430通过电源连接线320相互导通，至少部分电源连接线320连接于第二遮挡部312，第二遮挡部312沿第二方向X延伸成型。
在这些可选的实施例中，第二金属层40的第一电源线420和第二电源线430通过第一金属层30的电源连接线320实现换线。通常，第一电源线420和第二电源线430会在隔离部210附近进行换线，因此部分电源连接线320与隔离部210的距离较近，将第一遮挡部311连接于电源连接线320能够简化第一金属层30的层结构。电源连接线320和第一遮挡部311沿不同的方向延伸成型，避免第二遮挡部312影响电源连接线320与第一电源线420和/或第二电源线430的连接。
可选的，请参阅图8，当遮挡部310既包括第一遮挡部311，又包括第二遮挡部312时，第一遮挡部 311可以通过第二遮挡部312连接于电源连接线320，进而使得第一遮挡部311通过电源连接线320连接于第一电源线420和/或第二电源线430。
第一遮挡部311还可以既连接面电源410，又连接第二遮挡部312并通过第二遮挡部312连接于电源连接线320。
在一些可选的实施例中，请参阅图7和图8，隔离部210包括在其延伸方向上相继分布并相交设置的第一隔离部211和第二隔离部212，第一隔离部211沿第一方向Y延伸成型，第二隔离部212沿第二方向X延伸成型。第一隔离部211和第二隔离部212相交设置，能够减小隔离部210和第一区AA1之间的间距，使得隔离部210的形状与第一区AA1边缘的形状更加适配。
可选的，第一隔离部211在基板10上的正投影和第二遮挡部312在基板10上的正投影至少部分交叠设置。第一隔离部211和第二遮挡部312的延伸方向不同，便于第二遮挡部312朝向第一隔离部211延伸并遮挡部310分第一隔离部211，第二遮挡部312无需弯折，能够简化第二遮挡部312的形状。可选的，第二隔离部212在基板10上的正投影和第二遮挡部312在基板10上的正投影相互错位设置。进一步的，第二隔离部212在基板10上的正投影和第二遮挡部312在基板10上的正投影相互平行设置。
在另一些实施例中，请参阅图5和图9，当隔离部210包括上述的第一隔离部211和第二隔离部212时，第一遮挡部311既包括沿第一方向Y延伸的第一延伸段，第一遮挡部311也包括沿第二方向X延伸的第二延伸段，且至少部分第一隔离部211在基板10上的正投影位于第一延伸段在基板10上的正投影之内，至少部分第二隔离部212在基板10上的正投影位于第二延伸段在基板10上的正投影之内。以进一步提高第一遮挡部311和隔离部210的交叠面积，增大隔离部210的电阻。
可选的，遮挡部310的宽度为3μm～5μm。例如当遮挡部310沿第二方向X延伸成型时，遮挡部310的宽度方向为第一方向Y，遮挡部310的宽度为遮挡部310在第一方向Y上的延伸尺寸。当遮挡部310沿第一方向Y延伸时，遮挡部310的宽度方向为第二方向X。当遮挡部310包括第一遮挡部311，第一遮挡部311的宽度方向垂直于其延伸方向。
可选的，隔离部210的宽度为2.5μm～3μm。例如，第一隔离部211的宽度为2.5μm～3μm。第一隔离沿第一方向Y延伸成型，第一隔离部211的宽度方向为第二方向X，第一隔离部211在第二方向X上的延伸尺寸为2.5μm～3μm。第二隔离部212的宽度为2.5μm～3μm。第二隔离沿第二方向X延伸成型，第二隔离部212的宽度方向为第一方向Y，第二隔离部212在第一方向Y上的延伸尺寸为2.5μm～3μm。
在一些可选的实施例中，请参阅图1、图7至图9，第二区AA2还包括过渡区TA和主显示区ZA，过渡区TA位于主显示区ZA和第一区AA1之间，隔离部210、遮挡部310和电源连接线320位于过渡区TA。主显示区ZA用于实现显示面板100的显示，将隔离部210、遮挡部310和电源连接线320设置于过渡区TA能够改善其对主显示区ZA显示效果的影响。
可选的，当第一区AA1为圆形时，过渡区TA可以环绕第一区AA1呈圆环状。当第一区AA1呈多边形时，过渡区TA可以环绕第一区AA1呈多边形环状结构，只要过渡区TA位于主显示区ZA和第一区AA1之间即可。
由于主显示区ZA要实现显示面板100的显示，因此子像素110和驱动电路位于主显示区ZA。即主显示区ZA会布置驱动电路，过渡区TA无需布置驱动电路，会导致过渡区TA内金属布线的密度较低，无法释放制程静电。本申请在过渡区TA内设置遮挡部310，提高隔离部210的整体电阻，能够降低隔离部210的静电吸附量，提高显示面板100的良率。
当显示面板100包括过渡区TA和主显示区ZA时，第一电源线420在过渡区TA，第二电源线430包括第二主体部和用于连接电源连接线320的第二连接端，第二主体部在第二区AA2并位于隔离部210背离第一区AA1的一侧，第二连接端由第二主体部朝向第一电源线420延伸。
在这些可选的实施例中，第二主体部在主显示区ZA连接驱动电路以向驱动电路提供电能。第二连接端朝向第一电源线420延伸，第二连接端的端部可以位于隔离部210朝向第一区AA1的一侧，或者第二连接端的端部可以位于隔离部210背离第一区AA1的一侧，只要电源连接线320能够通过第二连接端连接于第二电源线430即可。
可选的，第一电源线420位于隔离部210朝向第一区AA1的一侧，至少部分第二电源线430的第二连接端位于隔离部210背离第一区AA1的一侧，电源连接线320连接第二连接端和第一电源线420，且至少部分电源连接线320在基板10上的正投影和隔离部210在基板10上的正投影至少部分交叠设置。
在这些可选的实施例中，部分电源连接线320跨过隔离部210连接第一电源线420和第二电源线430的第二连接端，即至少部分电源连接线320在基板10上的正投影和隔离部210在基板10上的正投影至少部分交叠设置，使得电源连接线320能够遮挡隔离部210的一部分，进一步提高隔离部210的电阻。
在其他实施例中，第一电源线420位于隔离部210朝向第一区AA1的一侧，第二连接端由第二主体部延伸至隔离部210朝向第一区AA1的一侧，电源连接线320在隔离部210朝向第一区AA1的一侧连接 第一电源线420和第二连接端。
在这些可选的实施例中，第二连接端延伸至隔离部210朝向第一区AA1的一侧并与电源连接线320过孔连接，能够增加电源连接线320和第二主体部之间的间距，避免电源连接线320影响第二主体部与驱动电路的相互连接。
申请人发现，由于第一区AA1存在大面积留白，即第一区AA1内无金属层分散静电，因而更容易发生薄膜晶体管失效，扫描线无法有效放电，可能引起扫描线不良导致的显示不良。
在一些可选的实施例中，请参阅图7至图10，第一金属层30还包括扫描信号线330和数据连接线340，数据连接线340位于过渡区TA，扫描信号线330位于主显示区ZA。在这些可选的实施例中，通过在过渡区TA布置数据连接线340可以增加第一金属层30在过渡区TA的金属材料分布面积，这些数据连接线340能够辅助释放第一金属层30内扫描信号线330的静电，进而改善由于扫描信号线330不良导致的显示不良。
在一些可选的实施例中，第二金属层40还包括多条数据线440，至少两条数据线440位于第一区AA1在第一方向Y上的两侧，数据连接线340与位于其在第一方向Y上两侧的数据线440过孔连接，以使位于第一区AA1在第一方向Y上两侧的数据线440通过数据连接线340相互连通。
在这些可选的实施例中，位于第一区AA1在第一方向Y上两侧的数据线440通过位于过渡区TA的数据连接线340进行换线。即数据线440的换线均位于过渡区TA，能够提高第一金属层30在过渡区TA内的金属材料分布面积，改善第一金属层30内扫描信号线330上的静电。可选的，通过数据连接线340相互连接的两条数据线440用于连接位于同一列的多个驱动电路，以实现显示面板100的列驱动。
第一区AA1在第一方向Y上两侧可能设置有多个数据线440，位于同一列的数据线440通过一数据连接线340相互连通。这就使得过渡区TA设置有多条数据连接线340，多条数据连接线340在过渡区TA内间隔设置，以保证各数据连接线340相互绝缘。
此外，在本申请实施例提供的显示面板100中，位于第一区AA1在第一方向两侧的数据线440均通过位于第一金属层30的数据连接线340进行换线，即沿第二方向X并排设置的多个数据连接线340均位于第一金属层30，相较于沿第二方向X并排设置的多个数据连接线340交替位于第一金属层30和第二金属层40来说，能够进一步增加第一金属层30的金属材料分布面积，提高数据连接线340分散扫描信号线330上的静电能力。
可选的，至少部分数据连接线340环绕第一区AA1弯折设置，以降低数据连接线340与第一区AA1的间距，减小过渡区TA的分布面积，降低非显示区的面积占比。
可选的，数据连接线340位于隔离部210朝向第一区AA1的一侧，一方面减小数据连接线340在主显示区ZA的分布面积，另一方面避免数据连接线340影响主显示区ZA内的布线。
可选的，至少部分数据连接线340和各第一电源线420在基板10上的正投影至少部分交叠设置，以减小过渡区TA的金属材料分布总面积，减小过渡区TA的尺寸，降低显示面板100中非显示区的面积占比。
在一些可选的实施例中，请参阅图10，至少部分第一电源线420在第一方向Y上的两侧设置有两个第二电源线430，两个第二电源线430均通过电源连接线320与第一电源线420相互连通；第一金属层30还包括位于过渡区TA的桥接线350，至少部分位于第一电源线420在第一方向Y上两端的两个电源连接线320之间连接有桥接线350。
在这些可选的实施例中，至少部分第一电源线420的两侧对应设置有两条第二电源线430，第一电源线420通过两个电源连接线320与两条第二电源线430相互连通。位于第一电源线420两端的两个电源连接线320之间连接有桥接线350，即桥接线350通过两个电源连接线320与第一电源线420并联连接。通过增设桥接线350，能够进一步提高第一金属层30内过渡区TA的信号线密度，提高第一金属层30内过渡区TA的金属材料分布面积和静电释放能力，更好的改善显示面板100的良率。
可选的，桥接线350的至少部分沿第一方向Y延伸成型，以简化桥接线350的布线形状。
当第一金属层30既包括遮挡部310又包括桥接线350时，遮挡部310和桥接线350可以连接于同一电源连接线320，或者遮挡部310和桥接线350可以连接于不同的电源连接线320。例如，电源连接线320包括第一电源连接线和第二电源连接线，至少部分第一电源连接线连接于遮挡部310，至少部分第二电源连接线连接于桥接线350。
可选的，可以是多个电源连接线320的一部分电源连接线320上连接有遮挡部310和/或桥接线350，另一部分电源连接线320上既没有连接遮挡部310也没有连接桥接线350。可以是多个电源连接线320中与隔离部210沿第二方向X较近的一部分电源连接线320上连接有遮挡部310，另一部分与隔离部210沿第二方向X较远的电源连接线320上连接有桥接线350。还可以是多个电源连接线320中与第一隔离部211沿第二方向X较近的一部分电源连接线320上连接有遮挡部310。
本申请实施例还提供一种显示装置，该显示装置可以包括上述任一实施方式的显示面板100。以下将以一种实施例的显示装置为例进行说明，该实施例中，显示装置包括上述实施例的显示面板100。
图11示出根据本申请一种实施例的显示装置的俯视示意图，图12示出图11中D-D向的剖面图。本实施例的显示装置中，显示面板100可以是上述其中一个实施例的显示面板100，显示面板100具有第一区以及第二区，第一区的透光率大于第二区的透光率。
显示面板100包括相对的第一表面S1和第二表面S2，其中第一表面S1为显示面。显示装置还包括感光组件200，该感光组件200位于显示面板100的第二表面S2侧，感光组件200与第一区位置对应。
感光组件200可以是图像采集装置，用于采集外部图像信息。本实施例中，感光组件200为互补金属氧化物半导体(Complementary Metal Oxide Semiconductor，CMOS)图像采集装置，在其它一些实施例中，感光组件200也可以是电荷耦合器件(Charge-coupled Device，CCD)图像采集装置等其它形式的图像采集装置。可以理解的是，感光组件200可以不限于是图像采集装置，例如在一些实施例中，感光组件200也可以是红外传感器、接近传感器、红外镜头、泛光感应元件、环境光传感器以及点阵投影器等光传感器。此外，显示装置在显示面板100的第二表面S2还可以集成其它部件，例如是听筒、扬声器等。
依照本申请如上文的实施例，这些实施例并没有详尽叙述所有的细节，也不限制该发明仅为的具体实施例。显然，根据以上描述，可作很多的修改和变化。本说明书选取并具体描述这些实施例，是为了更好地解释本申请的原理和实际应用，从而使所属技术领域技术人员能很好地利用本申请以及在本申请基础上的修改使用。本申请仅受权利要求书及其全部范围和等效物的限制。

Claims (10)

  1. 一种显示面板，所述显示面板具有第一区及环绕至少部分第一区设置的第二区，所述显示面板包括：
    基板，
    有源层，位于所述基板的一侧，所述有源层包括位于所述第二区并环绕至少部分所述第一区设置的隔离部；
    第一金属层，位于所述有源层背离所述基板的一侧，所述第一金属层包括遮挡部，所述隔离部在所述基板上的正投影与所述遮挡部在所述基板上的正投影交叠设置。
  2. 根据权利要求1所述的显示面板，其中，还包括多条信号线，至少部分所述信号线连接于所述遮挡部；
    优选的，所述遮挡部的宽度为3μm～5μm；
    优选的，所述隔离部的宽度为2.5μm～3μm。
  3. 根据权利要求2所述的显示面板，其中，还包括：第二金属层，位于所述有源层背离所述基板的一侧并与所述第一金属层层叠设置，多条所述信号线包括位于第二金属层的电源线，至少部分所述电源线连接于所述遮挡部；
    优选的，所述第二金属层位于所述第一金属层背离所述有源层的一侧。
  4. 根据权利要求3所述的显示面板，其中，所述遮挡部包括：
    第一遮挡部，沿所述隔离部的延伸路径延伸设置并覆盖至少部分所述隔离部；和/或
    第二遮挡部，与所述隔离部交叉设置；
    优选的，所述电源线包括环绕所述第一区设置的面电源，所述遮挡部包括第一遮挡部，所述第一遮挡部过孔连接于所述面电源。
  5. 根据权利要求4所述的显示面板，其中，
    所述电源线包括沿第一方向间隔分布的第一电源线和第二电源线；
    所述第一金属层还包括电源连接线，所述电源连接线沿所述第一方向延伸并与所述第一电源线和所述第二电源线过孔连接，以使所述第一电源线和所述第二电源线通过所述电源连接线相互导通，所述遮挡部包括第二遮挡部，至少部分所述电源连接线连接于所述遮挡部，且所述第二遮挡部沿第二方向延伸成型；
    优选的，所述遮挡部包括第一遮挡部和第二遮挡部，所述第一遮挡部通过所述第二遮挡部连接于电源连接线；
    优选的，所述隔离部包括在其延伸方向上相继分布并相交设置的第一隔离部和第二隔离部，所述第一隔离部沿所述第一方向延伸成型，所述第二隔离部沿所述第二方向延伸成型，所述第一隔离部在所述基板上的正投影和所述第二遮挡部在所述基板上的正投影至少部分交叠设置。
  6. 根据权利要求5所述的显示面板，其中，所述第二区还包括过渡区和主显示区，所述过渡区位于所述主显示区和所述第一区之间，所述隔离部、所述遮挡部和所述电源连接线位于过渡区；
    优选的，所述第一电源线位于所述过渡区，所述第二电源线包括第二主体部和用于连接所述电源连接线的第二连接端，所述第二主体部在所述第二区并位于所述隔离部背离第一区的一侧，所述第二连接端由所述第二主体部朝向所述第一电源线延伸；
    优选的，所述第一电源线位于隔离部朝向第一区的一侧，至少部分所述第二电源线的所述第二连接端位于所述隔离部背离所述第一区的一侧，所述电源连接线连接所述第二连接端和所述第一电源线，且至少部分所述电源连接线在所述基板上的正投影和所述隔离部在所述基板上的正投影至少部分交叠设置。
  7. 根据权利要求6所述的显示面板，其中，
    所述第一金属层包括扫描信号线和数据连接线，所述扫描信号线位于所述主显示区，所述数据连接线位于所述过渡区；
    优选的，所述第二金属层还包括多条数据线，至少两条所述数据线位于所述第一区在所述第一方向上的两侧，所述数据连接线与位于其在所述第一方向上两侧的数据线过孔连接，以使位于所述第一区在所述第一方向上两侧的数据线通过所述数据连接线相互连通；
    优选的，多条所述数据连接线在所述过渡区间隔分布；
    优选的，所述数据连接线位于所述隔离部朝向所述第一区的一侧。
  8. 根据权利要求6所述的显示面板，其中，
    至少部分第一电源线在所述第一方向上的两侧设置有两个所述第二电源线，两个所述第二电源线均 通过所述电源连接线与所述第一电源线相互连通；
    所述第一金属层还包括位于所述过渡区的桥接线，至少部分位于所述第一电源线在所述第一方向上两端的两个所述电源连接线之间连接有所述桥接线；
    优选的，所述遮挡部和所述桥接线连接于同一所述电源连接线；或者
    所述电源连接线包括第一电源连接线和第二电源连接线，至少部分所述第一电源连接线连接于所述遮挡部，至少部分所述第二电源连接线连接于所述桥接线。
  9. 根据权利要求1所述的显示面板，其中，所述有源层包括第一半导体部和第二半导体部，所述第一半导体部和所述第二半导体部位于所述第一区在第一方向上的两侧，多个所述第一半导体部沿第二方向间隔设置，多个所述第二半导体部沿第二方向间隔设置，
    其中，至少两个所述第一半导体部、至少两个所述第二半导体部、至少一个所述第一半导体和至少一个所述第二半导体中的至少一组通过所述隔离部相互连接。
  10. 一种显示装置，，包括根据权利要求1至9任一项所述的显示面板。
PCT/CN2022/122514 2021-12-27 2022-09-29 显示面板及显示装置 Ceased WO2023124331A1 (zh)

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