WO2023123454A1 - Interference apparatus - Google Patents

Interference apparatus Download PDF

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Publication number
WO2023123454A1
WO2023123454A1 PCT/CN2021/143922 CN2021143922W WO2023123454A1 WO 2023123454 A1 WO2023123454 A1 WO 2023123454A1 CN 2021143922 W CN2021143922 W CN 2021143922W WO 2023123454 A1 WO2023123454 A1 WO 2023123454A1
Authority
WO
WIPO (PCT)
Prior art keywords
interference
interference device
groove
signal
accommodating groove
Prior art date
Application number
PCT/CN2021/143922
Other languages
French (fr)
Chinese (zh)
Inventor
别体军
陈龙
马伟东
Original Assignee
深圳市安卫普科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳市安卫普科技有限公司 filed Critical 深圳市安卫普科技有限公司
Priority to PCT/CN2021/143922 priority Critical patent/WO2023123454A1/en
Priority to CN202180004865.3A priority patent/CN114503464A/en
Publication of WO2023123454A1 publication Critical patent/WO2023123454A1/en

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Classifications

    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04KSECRET COMMUNICATION; JAMMING OF COMMUNICATION
    • H04K3/00Jamming of communication; Counter-measures
    • H04K3/80Jamming or countermeasure characterized by its function
    • H04K3/82Jamming or countermeasure characterized by its function related to preventing surveillance, interception or detection
    • H04K3/825Jamming or countermeasure characterized by its function related to preventing surveillance, interception or detection by jamming
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04BTRANSMISSION
    • H04B11/00Transmission systems employing sonic, ultrasonic or infrasonic waves
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00Casings, cabinets or drawers for electric apparatus
    • H05K5/02Details
    • H05K5/0217Mechanical details of casings

Definitions

  • the application belongs to the technical field of interference of electronic equipment, and in particular relates to an ultrasonic interference device.
  • the purpose of this application is to provide a jamming device that can place electronic equipment and realize anti-tampering and anti-eavesdropping on electronic equipment
  • the implementation mode of this application provides an interference device, including:
  • the casing has a receiving space inside the casing, and a first containing groove is formed on one side of the outside of the casing, and the first containing groove communicates with the containing space, wherein the first containing The slot is used to place electronic equipment;
  • An interference signal generating module is arranged in the accommodation space, and the interference signal generating module is used to send a first signal into the first accommodation slot to interfere with the electronic equipment.
  • the first signal emitted by the interference signal generating module is a first sound wave signal
  • the first signal includes at least two first sound wave signals of different frequencies, and the at least two different frequencies
  • the first sound wave signal can be mixed to generate a second sound wave signal audible to human ears, and the second sound wave signal is used for audio interference to the electronic device.
  • the first signal is an ultrasonic signal.
  • the at least two first sound wave signals with different frequencies are sound wave signals inaudible to human ears, and can generate second sound wave signals audible to human ears after mixing.
  • the housing is provided with recesses on the sidewalls surrounding opposite sides of the first accommodating groove.
  • the recessed portion is located in the middle of each side wall, and the side walls provided with the recessed portion are located on opposite sides of the housing in the width direction.
  • the accommodation space of the housing includes a second accommodating groove, the number of the second accommodating groove is at least one, and the second accommodating groove is arranged at On the side, the first accommodating groove communicates with the second accommodating groove, and the first signal emitted by the interference signal generating module is emitted from the second accommodating groove into the first accommodating groove .
  • the second accommodating groove is higher than the bottom surface of the first accommodating groove in the height direction, and the bottom surface is a side surface of the housing for carrying the electronic device .
  • the interference signal generating module is disposed in the second accommodating slot, and the side of the interfering signal generating module for emitting the first signal faces the first accommodating slot.
  • the accommodating space includes two second accommodating grooves, which are respectively arranged on opposite sides of the first accommodating groove in the length direction, and each of the second accommodating grooves One of the interference signal generation modules is set in each.
  • the housing includes:
  • the upper shell is used to cooperate with the lower shell to form the accommodation space, and the upper shell includes:
  • the substrate includes a first surface and a second surface, wherein the first surface is an outer surface of the substrate, the outer surface faces away from the lower case, and the second surface is an inner surface of the substrate, the inner surface faces the lower case;
  • top plate located on at least one side of the base plate, and higher than the first surface in a direction facing away from the lower shell, the top plate is connected to the side wall;
  • the side of the substrate facing away from the lower case forms the first accommodating groove
  • the first accommodating groove is used to place electronic equipment
  • the side of the top plate facing the lower case forms the first accommodating groove.
  • the second accommodating slot is used to place the interference signal generating module, and the side of the interfering signal generating module used to emit the first signal faces the first accommodating slot.
  • the base plate of the upper case, the side wall of the upper case, and the top plate of the upper case are integrally constructed.
  • the upper shell includes two second accommodation slots, which are respectively located on opposite sides of the first accommodation slot in the length direction.
  • the sidewall of the upper case includes an inner sidewall and an outer sidewall, and the outer sidewall is located at the periphery of the inner sidewall, wherein the first surface of the substrate and the inner sidewall form a The first accommodating groove, the top plate is connected between the inner side wall and the outer side wall, and the top plate, the outer side wall and the inner side wall enclose the second accommodating groove.
  • an opening or a plurality of through holes are provided on the inner side wall provided between the first accommodating groove and the second accommodating groove, so that the first accommodating groove and the second accommodating groove The second accommodating grooves are connected.
  • the inner sidewall extends upward from the base plate in a direction away from the lower case.
  • the outer sidewall includes a first part and a second part connected, wherein the first part is a part higher than the first surface in the direction facing away from the lower shell, so The second portion is a portion higher than the second surface in a direction facing the lower case.
  • the second part is used to cooperate with the lower case to form the receiving space
  • the first part is used to cooperate with the top board and the base board to form the first the accommodating tank and the second accommodating tank.
  • the lower case includes a base body and side walls extending from the periphery of the base body toward the upper case, the side walls of the lower case match the outer side walls of the upper case to form the containment space.
  • the upper shell further includes a groove on the first surface, and a support structure is arranged in the groove, and the support structure is used for supporting the The electronic equipment plays a support or/and anti-skid role.
  • the support structure includes a support pad, and a slot is formed on the support pad, and the slot can pass through the first signal.
  • the number of the grooves is two, which are respectively arranged at both ends of the first surface, and the thickness of the part not provided with the grooves on the central region of the substrate is the same as the thickness of the grooves.
  • the thickness of the region where the groove is arranged on the substrate is the same.
  • the interference device further includes a wireless charging module, and a third accommodating groove is provided on the second surface of the substrate in the middle area where the groove is not provided, for accommodating the wireless charging module. charging module.
  • the lower shell is provided with a plurality of through holes
  • the second surface of the substrate is further formed with a plurality of first positioning posts and a plurality of second positioning posts, and the plurality of second positioning posts
  • the positioning posts are located in the middle area of the second surface, and the plurality of first positioning posts are located in both end areas of the second surface, wherein the heights of the plurality of first positioning posts are smaller than the heights of the plurality of first positioning posts.
  • the height of the two positioning posts, the plurality of first positioning posts have lock holes, the upper shell and the lower shell pass through the through holes on the lower shell through screws and are locked and fixed with the lock holes.
  • the interference device further includes a main board, located between the upper case and the lower case, the main board is used to drive the interference signal generating module to send the first signal, and the edge of the main board
  • the area includes a plurality of through holes, and the plurality of first positioning posts and the plurality of second positioning posts are used to respectively pass through the through holes on the main board and interfere with the lower case.
  • a groove is provided on the side of the lower shell facing away from the upper shell, the through hole on the lower shell penetrates to the groove, and an anti-skid pad is arranged in the groove .
  • a protrusion is formed on the surface of the lower shell facing the upper shell, and when the lower shell and the upper shell are installed together, the plurality of first positioning posts All the plurality of second positioning columns are in conflict with the protrusion, and a limiting groove is formed above the through hole of the lower case, and the opening diameter of the limiting groove is larger than the through hole of the lower case. The diameter of the hole, the limiting groove is used to accommodate the end of the first positioning post.
  • the support pad is a wheat awn structure or a rubber pad, and the gaps on the wheat awn structure or the rubber pad can pass through the first signal.
  • a positioning column is provided in the second accommodation slot for cooperating with the positioning hole on the interference signal generating module, so as to limit and fix the interference signal generating module.
  • a plurality of locking structures are further formed on the second surface of the base plate, located on the periphery of the plurality of second positioning posts, and the locking structures are used to fix the main board.
  • the locking structure is a protruding structure, and a hook is formed at an end far away from the substrate, and the hook is used to buckle and fix the main board on the substrate.
  • the electronic device used to be placed in the first accommodating slot of the upper case is a mobile phone, and the interference device can only interfere with a single mobile phone.
  • an opening is provided on the inner side wall provided between the first accommodating groove and the second accommodating groove, and each of the second accommodating grooves is provided with an interference signal generator module, the interference signal generating module includes at least two interference signal generators and a partition, the interference signal generator is used to send the first signal with a preset frequency, and the at least two interference signal generators are used to send at least two First signals with different frequencies, the partition has a plurality of through holes, the partition is exposed at the opening, the first signal exits to the first signal through the plurality of through holes on the partition in the holding tank.
  • the interference device further includes a main board, the main board is used to drive the interference signal generation module to send out the first signal, the interference signal generation module further includes a positioning frame and a sub-board, and the at least two The interference signal generator is arranged on the sub-board, and the sub-board is electrically connected to the main board, and the positioning frame includes at least two perforations, and each interference signal generator is arranged in the perforation of the positioning frame.
  • the positioning frame is located on a side of the partition facing away from the first accommodating groove.
  • the interference signal generating module further includes gauze, and the gauze is disposed between the partition and the positioning frame.
  • the interference device has a length no greater than 22 cm and a width no greater than 12 cm.
  • the jamming device of the present application is a jamming device with a new structure, which can not only be used to place electronic equipment, but also can realize the function of anti-eavesdropping and anti-tampering for the electronic equipment placed therein.
  • FIG. 1 is a schematic three-dimensional structure diagram of a first embodiment of an interference device provided by the present application.
  • FIG. 2 is an exploded view of the interference device shown in FIG. 1 .
  • FIG. 3 is a schematic diagram of the outer structure of the upper case of the interference device shown in FIG. 2 .
  • FIG. 4 is a schematic diagram of the inner structure of the upper case of the interference device shown in FIG. 2 .
  • FIG. 5 is a schematic diagram of the back structure of the lower case of the interference device shown in FIG. 2 .
  • FIG. 6 is a schematic diagram of a three-dimensional structure of an interference signal generating module of the interference device shown in FIG. 2 .
  • FIG. 7 is an exploded view of the jamming signal generating module of the jamming device shown in FIG. 2 .
  • FIG. 8 is a schematic perspective view of another angle of the interference signal generating module of the interference device shown in FIG. 2 .
  • FIG. 9 is a perspective view of a partial structure of the interference device shown in FIG. 2 .
  • FIG. 10 is a schematic view from another angle of a partial structure of the interference device shown in FIG. 2 .
  • FIG. 11 is a schematic diagram of placing electronic equipment in the first accommodating slot of the interference device shown in FIG. 1 .
  • FIG. 12 is a structural block diagram of an embodiment of the interference device 1 of the present application.
  • FIG. 13 is a structural block diagram of another embodiment of the interference device 1 .
  • Fig. 14 is a schematic perspective view of the second embodiment of the interference device of the present application.
  • Fig. 15 is a schematic diagram of the exploded structure of the jamming device shown in Fig. 14 .
  • Fig. 16 is a schematic perspective view of the upper shell of the interference device.
  • Fig. 16 is a schematic perspective view of the upper shell of the interference device.
  • Fig. 17 is a partial structural diagram of the interference signal generating module.
  • Fig. 18 is a schematic perspective view of the third embodiment of the interference device of the present application.
  • FIG. 19 is a schematic diagram of the exploded structure of the jamming device shown in FIG. 18 .
  • FIG. 20 is a schematic perspective view of the three-dimensional structure of the upper case of the interference device shown in FIG. 18 .
  • FIG. 21 is a schematic structural view of the pressure-assisting plate of the interference device shown in FIG. 18 .
  • Fig. 22 is a schematic structural view of the support pad of the interference device shown in Fig. 18 .
  • Fig. 23 is a schematic perspective view of the fourth embodiment of the interference device of the present application.
  • Fig. 24 is a schematic diagram of the exploded structure of the jamming device shown in Fig. 22 .
  • FIG. 25 is a schematic perspective view of the upper shell of the interference device shown in FIG. 23 .
  • Fig. 26 is an exploded view of a fifth embodiment of the jamming device of the present application.
  • connection should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection. Connection, or integrated connection; it can be mechanical connection, electrical connection or mutual communication; it can be direct connection or indirect connection through an intermediary, and it can be the internal communication of two components or the mutual communication between two components role relationship.
  • connection or integrated connection; it can be mechanical connection, electrical connection or mutual communication; it can be direct connection or indirect connection through an intermediary, and it can be the internal communication of two components or the mutual communication between two components role relationship.
  • vertical “transverse”, “longitudinal”, “front”, “rear”, “left”, “right”, “upper”, “lower”, “horizontal”, etc.
  • the present application mainly provides a jamming device with a new structure.
  • the outer side of the shell of the jamming device with a new structure has a first accommodating groove, and the first accommodating groove is used to place electronic equipment therein.
  • the interior of the casing of the interference device has a storage space, and the storage space is used to accommodate electronic components of the interference device.
  • the accommodating space has a second accommodating groove, and the second accommodating groove is located at a side of the first accommodating groove and communicates with the first accommodating groove.
  • the interference signal generating module of the interference device is placed in the second accommodation slot.
  • the interference signal generating module is used for emitting a first signal toward the first accommodation slot to interfere with the electronic equipment.
  • the electronic device is, for example but not limited to, a mobile phone.
  • the first signal includes at least two first sound wave signals with different frequencies, and the at least two first sound wave signals with different frequencies can generate a second sound wave that can be heard by human ears after being mixed.
  • the sound wave signal therefore, can perform audio interference on the electronic equipment placed in the first accommodating slot.
  • the first sound wave signal is, for example, a sound wave signal that cannot be heard by human ears.
  • the interference device with the above-mentioned new structure can not only meet the needs of customization, but also can interfere with specific electronic equipment, so as to realize the function of anti-tampering and anti-eavesdropping.
  • the present application also provides an interference device with a detection module, the detection module is used to detect whether electronic equipment is placed in the first accommodating slot of the interference device, and when the first accommodating slot is detected
  • the processing module of the interference device correspondingly controls the interference information generation module to send a first signal according to the detection result of the detection module.
  • the interference information generation module starts to emit the first signal only when the detection module detects that an electronic device is placed in the first accommodating slot, therefore, the In addition, the power consumption of the interference device can also prolong the life of the interference information generating module.
  • this application respectively records the implementation of various products.
  • Figure 1 is a schematic diagram of the three-dimensional structure of the first embodiment of the interference device provided by this application.
  • Figure 2 is an exploded view of the interference device shown in Figure 1.
  • Figure 4 is a schematic diagram of the inner structure of the upper shell of the jamming device shown in Figure 2
  • Figure 5 is a schematic diagram of the back structure of the lower shell of the jamming device shown in Figure 2
  • Figure 6 is a schematic diagram of the structure shown in Figure 2.
  • Fig. 7 is an exploded view of the jamming signal generating module of the jamming device shown in Fig. 2
  • Fig. 8 is another perspective view of the jamming signal generating module of the jamming device shown in Fig.
  • FIG. 9 is a schematic diagram of a part of the structure of the interference device shown in Figure 2 from one angle
  • Figure 10 is a schematic diagram of another angle of the partial structure of the interference device shown in Figure 2
  • Figure 11 is a schematic diagram of the first angle of the interference device shown in Figure 1
  • the interference device 1 includes a housing 10 and an interference signal generating module 20 .
  • the housing 10 has a receiving space 11 inside, and the housing 10 has a first receiving groove 12 on its outer side.
  • the first accommodating slot 12 communicates with the accommodating space 11 , wherein the first accommodating slot 12 is used for placing the electronic device A.
  • the interference signal generating module 20 is arranged in the accommodation space 11 .
  • the interference signal generating module 20 is used for sending a first signal into the first accommodating slot 12 to interfere with the electronic device A.
  • the electronic device A is, for example but not limited to, a mobile phone and the like.
  • the first signal includes, for example, at least two first sound wave signals of different frequencies, and the at least two first sound wave signals of different frequencies can be audible to human ears after being mixed. of the second acoustic signal.
  • the second sound wave signal audible to the human ear generated after mixing is used for audio interference to the electronic device A.
  • the first sound wave signal is, for example, a sound wave signal that cannot be heard by human ears.
  • the first sound wave signal is, for example but not limited to, an appropriate sound wave signal such as an ultrasonic wave.
  • the first sound wave signal may also be, for example, a sound wave signal audible by human ears.
  • the first signal generated by the interference signal generating module 20 is not limited to the first sound wave signal, and can also be other suitable signals, such as electromagnetic wave signals, as long as it can interfere with the electronic device A and realize The functions of anti-eavesdropping and anti-tampering should all fall within the scope of protection of this application.
  • the description is mainly made by taking the first signal as the first acoustic wave signal as an example, but it should not be understood as a limitation to the present application.
  • the casing 10 of the interference device 1 of the present application has the first accommodating groove 12, and the first accommodating groove 12 communicates with the accommodating space 11 inside the casing 10, it is located in the accommodating
  • the interference signal generation module 20 in the space 11 is capable of emitting a first signal into the first accommodating slot 12 for audio interference to the electronic device A in the first accommodating slot 12, so that the electronic device A Noise is recorded when equipment A is recording, or the voice signal of the on-site conversation cannot be heard when electronic equipment A is remotely eavesdropped.
  • the interference device 1 will not affect the normal call access of the electronic device A in the first accommodating slot 12 , and the user needs to pick up the electronic device A to make a normal call when connected.
  • the housing 10 is provided with a recessed portion B on the sidewalls 132 surrounding opposite sides of the first accommodating groove 12 .
  • the first accommodating groove 12 communicates with the outside of the casing 10 through the concave portion B.
  • the number of the recessed portion B may also be one, that is, the recessed portion B is provided on one of the side walls 132 .
  • the side wall 132 can block the electronic device A, so that the electronic device A is accommodated in the first accommodating groove 12, and the recessed part B is convenient for the user to observe whether the electronic device A is placed in the first accommodating groove 12 at any time.
  • An anti-eavesdropping and stealing process is performed in the accommodating slot 12 to avoid the problem of omission.
  • it is also convenient for the user to observe the status of the electronic device A at any time.
  • the recessed portion B is located in the middle of each side wall 132 , and the side walls 132 provided with the recessed portion B are located on opposite sides of the housing 10 in the width direction. Further optionally, the height of the side wall 132 gradually decreases from both ends to the middle.
  • the receiving space 11 of the housing 10 includes a second receiving groove 110, the number of the second receiving groove 110 is at least one, and the second receiving groove 110 is arranged in the first receiving groove 12 sideways in the length direction.
  • the first accommodating groove 12 communicates with the second accommodating groove 110 .
  • the first signal sent by the interference signal generating module 20 is emitted from the second accommodating groove 110 into the first accommodating groove 12.
  • the second accommodating groove 110 is higher than the bottom surface F1 of the first accommodating groove 12 in the height direction, and the bottom surface F1 is a side surface of the housing 10 for carrying the electronic equipment a.
  • the interference signal generation module 20 is arranged in the second accommodation slot 110, and the side of the interference signal generation module 20 for emitting the first signal faces the first accommodation slot. 12.
  • the accommodating space 11 includes two second accommodating grooves 110, which are respectively arranged on opposite sides of the first accommodating groove 12 in the length direction, each of the second accommodating grooves One of the interference signal generating modules 20 is set in 110 respectively.
  • the interference signal generator 201 used to emit the first signal in the interference signal generating module 20 may not be arranged in the second accommodation slot 110, for example, but not It is limited to the technical solution described in the fifth embodiment of the present application.
  • all the interference signal generating modules 20 are not placed in the second accommodating slot 110 , and the second accommodating slot 110 is saved, so it is also possible.
  • the direction in which the first signal emerges can be increased, and audio interference can be performed on the electronic device A from multiple angles.
  • the user is not limited to the direction in which the electronic device A is placed, and the user experience is improved.
  • the housing 10 includes an upper shell 13 and a lower shell 14 .
  • the upper shell 13 and the lower shell 14 cooperate to form the receiving space 11 .
  • the first accommodating groove 12 is formed above a side of the upper shell 13 facing away from the lower shell 14 .
  • the upper shell 13 includes a base plate 131 , a side wall 132 , and a top plate 133 .
  • the substrate 131 includes a first surface F1 and a second surface F2.
  • the first surface F1 is an outer surface of the substrate 131 , and the outer surface faces away from the lower shell 14 .
  • the second surface F2 is an inner surface of the substrate 131 , and the inner surface faces the lower case 14 .
  • the side wall 132 is located at the periphery of the base plate 131 and is higher than the first surface F1 in a direction facing away from the lower case 14 .
  • the top plate 133 is located on at least one side of the base plate 131 and is higher than the first surface F1 in a direction facing away from the lower shell 14 , and the top plate 133 is connected to the side wall 132 .
  • the side of the base plate 131 facing away from the lower case 14 forms the first accommodating groove 12 .
  • the second accommodating groove 110 is formed on a side of the top plate 133 facing the lower shell 14 .
  • the base plate 131 , the side wall 132 , and the top plate 133 are integrally structured.
  • the side wall 132 of the upper shell 13 includes an inner side wall 1321 and an outer side wall 1322 , and the outer side wall 1322 is located at a periphery of the inner side wall 1321 .
  • the inner wall 1321 extends upward from the base plate 131 in a direction away from the lower case 14 .
  • the first accommodating groove 12 is surrounded by the first surface F1 of the substrate 131 and the inner wall 1321 .
  • the top plate 133 is connected between the inner wall 1321 and the outer wall 1322 .
  • the top plate 133 , the outer sidewall 1322 and the inner sidewall 1321 enclose the second accommodating groove 110 .
  • the outer side wall 1322 includes a connected first portion B1 and a second portion B2.
  • the first part B1 is a part that is higher than the first surface F1 in the direction facing away from the lower case 14
  • the second part B2 is a part that is higher than the first surface F1 in the direction facing the lower case 14.
  • the second portion B2 is used to cooperate with the lower shell 14 to form the receiving space 11 .
  • the first portion B1 is used to cooperate with the top plate 133 and the base plate 131 to form the first receiving groove 12 and the second receiving groove 110 .
  • the lower case 14 has no side walls.
  • the lower case 14 may also be provided with side walls correspondingly.
  • the outer side wall 1322 does not have the second portion B2
  • the lower shell 14 is correspondingly provided with a side wall 149 extending toward the upper shell 13, so as to Cooperate with the upper shell 13 to form the receiving space 11 .
  • the technical solution described in the third embodiment refer to the technical solution described in the third embodiment.
  • an opening K is provided on the inner wall 1321 provided between the first accommodating groove 12 and the second accommodating groove 110, so that the first accommodating groove 12 It communicates with the second accommodating groove 110 .
  • the interference signal generating module 20 is exposed at the opening K, and the interference signal generating module 20 is provided with a partition 202, and the partition 202 includes a plurality of through holes K1 for emitting the first signal. Therefore, the first signal emitted by the interference signal generating module 20 can be emitted from the second accommodating groove 110 into the first accommodating groove 12 .
  • the inner side wall 1321 has a plurality of through holes K1
  • the interference signal generating module 20 is arranged behind the inner side wall 1321, and the interference signal generating module 20
  • the partition plate 202 having a plurality of through holes K1 may not be provided, for example, refer to the technical solution described in the third embodiment.
  • a positioning column 1101 is provided in the second accommodation groove 110 for matching with the positioning hole 208 on the interference signal generating module 20 , and is connected to the positioning hole 208 through the screw 209 .
  • the locking holes in the positioning posts 1101 are matched with each other, so that the interference signal generating module 20 is fixed in the second accommodating groove 110 .
  • the interference signal generating module 20 includes at least two interference signal generators 201 and a partition 202 .
  • the interference signal generator 201 is used to send out the first signal, for example but not limited to, the interference signal generator 201 is used to convert an electrical signal into a first sound wave signal, and the first sound wave signal is Acoustic signal with preset frequency.
  • the preset frequency is, for example but not limited to, any value within the frequency range of 40 to 40.3 KHZ.
  • the separator 202 has a plurality of through holes K1. The separator 202 is exposed at the opening K. The first signal exits into the first accommodating groove 12 through the plurality of through holes K1 on the partition 202 .
  • each interference signal generating module 20 includes four interference signal generators 201 for respectively emitting first acoustic signals with different frequencies.
  • the first acoustic signal is, for example but not limited to, an ultrasonic signal.
  • the interference signal generator 201 is, for example but not limited to, an ultrasonic transducer.
  • the number of the interference signal generators 201 may also be two, three, five, or even more.
  • the first signal generated by the interference signal generator 201 is not limited to the first sound wave signal, and can also be other suitable signals, such as electromagnetic wave signals, as long as it can interfere with the electronic device A to realize
  • the functions of anti-eavesdropping and anti-tampering should all fall within the scope of protection of this application.
  • the description is mainly made by taking the first signal as the first acoustic wave signal as an example, but it should not be understood as a limitation of the present application.
  • the first sound wave signals with frequencies F1, F2, F3, and F4 are sent through four interference signal generators 201, and the first sound wave signals with frequencies F1, F2, F3, and F4 are inaudible to human ears
  • the sound wave signals, these four first sound wave signals will produce a mixing effect at the microphone circuit of electronic device A, and the generated frequencies are
  • , the frequency is
  • the second sound wave signal is the sound wave signal audible to the human ear, and the electronic device A will record the sound wave signal, and the content of the real voice conversation will be shielded, effectively protecting personal privacy.
  • each interference signal generation module 20 includes four interference signal generators 201, respectively, and simultaneously send four first acoustic wave signals with different frequencies to the first container. Placed in the slot 12, after the mixing effect is generated at the microphone circuit of the electronic device A, multiple second sound wave signals with different frequencies that can be heard by the human ear will be generated, so that the audio interference effect on the electronic device A is better.
  • the interference signal generating module 20 further includes a sub-board 205 , a positioning frame 203 , and a gauze 204 .
  • the at least two interference signal generators 201 are disposed on the sub-board 205 and electrically connected to the sub-board 205 .
  • the sub-board 205 is, for example but not limited to, a printed circuit board.
  • the positioning frame 203 includes at least two through holes K2. Each interference signal generator 201 is disposed in the through hole K2 of the positioning frame 203 .
  • the positioning frame 203 is located on a side of the partition 202 facing away from the first accommodating slot 12 .
  • the gauze 204 is disposed between the separator 202 and the positioning frame 203 .
  • the interference signal generating module 20 is an independent module structure, which is easy to install and disassemble.
  • the separator 202 is made of metal, which has a better appearance.
  • the positioning frame 203 and the gauze 204 not only prevent the user from viewing the internal structure of the interference signal generator 201 and the sub-board 205 directly, but also play the role of dustproof and beautiful.
  • one or more of the separator 202, the positioning frame 203, and the gauze 204 can be omitted.
  • the sides of the interference signal generator 201 for emitting the first signal are all set facing the first accommodation groove 12 .
  • the side of the interference signal generator 201 for emitting the first signal may also face the center line L of the first accommodation groove 12 along the length direction.
  • -L' (see FIG. 17 ) is inclined, and the range of the inclination angle thereof is, for example but not limited to, 15 degrees to 30 degrees.
  • the radiation range of the first signal can be increased to prevent dead spots.
  • the superposition of the first signal can also increase the amplitude of the first signal, and the energy of the first signal is more concentrated.
  • the inclination angle is, for example, 15 degrees. That is, the acute angle between the central line L1-L1' of the interference signal generator 201 along the height direction (see FIG.
  • the upper case 13 further includes a groove 135 on the first surface F1.
  • a supporting structure 136 is disposed in the groove 135 .
  • the supporting structure 136 is used to support or/and prevent slippage of the electronic device A placed in the first accommodating slot 12 .
  • the support structure 136 includes support pads 1361 .
  • gaps are formed on the support pad 1361 .
  • the gap can pass the first sound wave signal, so as to implement audio interference to the microphones in all directions of the electronic device A.
  • the support pad 1361 is a wheat awn structure (see FIG. 22 ) or a rubber pad, and the first signal can pass through the gaps on the wheat awn structure or the rubber pad.
  • the wheat awn structures are arranged in an array, for example, so that the passing effect of the first signal will be better, so as to achieve a better interference effect on the electronic device A.
  • the awn structure supports and balances the electronic device A, and is suitable for electronic devices A with different bottom shapes (such as protruding rear lens or not protruding).
  • the wheat awn structure has frictional force and can assist in fixing the recording equipment.
  • the number of the grooves 135 is two, which are respectively arranged at two ends of the first surface F1.
  • the thickness of the part of the central region of the substrate 131 not provided with the groove 135 is the same as the thickness of the region of the substrate 131 provided with the groove 135 .
  • the interference device 1 further includes a wireless charging module 40 for wirelessly charging the electronic device A.
  • a third accommodating groove 134 is provided on the second surface F2 of the substrate 131 in the middle area where the groove 135 is not provided, for accommodating the coil 401 of the wireless charging module 40 therein. Therefore, the interference device 1 has a compact structure and a thinner thickness.
  • a plurality of first positioning posts Z1 and a plurality of second positioning posts Z2 are further formed on the second surface F2 of the substrate 131 .
  • the plurality of second positioning posts Z2 are located in the middle area of the second surface F2.
  • the plurality of first positioning columns Z1 are located at two end regions of the second surface F2. Wherein, the height of the plurality of first positioning columns Z1 is smaller than the height of the plurality of second positioning columns Z2.
  • the plurality of first positioning posts Z1 have locking holes K3.
  • a plurality of through holes 142 are disposed on the lower shell 14 . When the upper shell 13 and the lower shell 14 are installed, the screws 145 are inserted into the through holes 142 on the lower shell 14 and locked and fixed with the locking hole K3.
  • a protrusion 143 is formed on a surface of the lower shell 14 facing the upper shell 13 .
  • the plurality of first positioning columns Z1 and the plurality of second positioning columns Z2 are in conflict with the protrusion 143 , and the A limiting slot 144 is formed above the through hole 142 of the lower shell 14 .
  • the hole diameter of the limiting groove 144 is larger than the hole diameter of the through hole 142 of the lower shell 14 .
  • the limiting groove 144 is used for receiving the end of the first positioning post Z1.
  • a groove (not shown) is provided on the side of the lower shell 14 facing away from the upper shell 13 .
  • the through hole 142 on the lower shell 14 runs through to the groove.
  • An anti-slip pad 146 is provided in the groove to prevent slippage when the interference device 1 is placed flat on a tabletop or the like.
  • the interference device 1 further includes a main board 30, located between the upper case 13 and the lower case 14, the main board 30 is electrically connected to the sub-board 205, and is used to drive the interference signal to generate Module 20 sends out a first signal.
  • the edge area of the main board 30 includes a plurality of through holes 300 .
  • the plurality of first positioning posts Z1 and the plurality of second positioning posts Z2 are respectively used to pass through the through holes 300 on the main board 30 and interfere with the lower case 14 .
  • a plurality of snapping structures 138 are further formed on the second surface F2 of the base plate 131, located on the periphery of the plurality of second positioning columns Z2, and the snapping structures 138 are used for positioning the main board 30. to fix.
  • the locking structure 138 is a protruding structure, and a hook G is formed at an end away from the base plate 131, and the hook G is used to buckle and fix the main board 30 on the base plate. 131 on.
  • the length of the interference device 1 is, for example, not greater than 22 centimeters, and the width is, for example, not greater than 12 centimeters.
  • the interference device 1 can only interfere with a single mobile phone, for example. In other words, the interference device 1 can only interfere with one mobile phone at the same time.
  • the jamming device 1 may also be a device with other suitable dimensions and capable of jamming a plurality of electronic devices.
  • the above-mentioned interference device 1 of the present application is a interference device with a brand-new structure, which can place electronic equipment A on it, and can interfere with electronic equipment A, so as to realize different customization requirements, and can conduct specific electronic equipment A Interference, realize the function of anti-eavesdropping and anti-eavesdropping.
  • the interference device 1 with the above-mentioned brand-new structure of the present application is not limited to the aspects described in the above-mentioned specific embodiments, and may also have other modified forms, as long as those of ordinary skill in the art understand it according to the aspects described in the application.
  • the technical solutions of various implementations that can be easily conceived based on the technical content should fall within the protection scope of the present application.
  • the detecting module 50 is arranged in the receiving space 11 and is used for detecting whether the electronic device A is placed in the first receiving slot 12 .
  • the processing module 302 of the interference device 1 correspondingly controls whether the interference signal generation module 20 starts to work according to the detection result of the detection module 50, that is, whether to start transmitting the first signal into the first accommodating slot 12 .
  • the detection module 50 detects that the electronic device A is placed in the first accommodating slot 12
  • the detection module 50 outputs a corresponding detection signal to the processing module 302, and the interference signal occurs
  • the module 20 starts to emit a first signal into the first accommodating slot 12 under the driving control of the processing module 302 .
  • the interference signal generation module 20 does not work. Therefore, the interference device 1 not only reduces power consumption, but also prolongs its lifespan.
  • an indication module 60 may also be added to the interference device 1, and when the detection module 50 detects that the electronic device A is placed in the first accommodating slot 12, the processing module 302 controls the corresponding The indication module 60 issues a corresponding prompt, so that the user can clearly know that the interference device 1 is in an audio interference state.
  • FIG. 12 is a structural block diagram of an embodiment of the interference device 1 of the present application.
  • the processing module 302 includes a processing unit 3021, and the processing unit 3021 is connected to the detection module 50, and is configured to correspondingly send a second signal to the interference signal generation module 20 when receiving the detection signal, so as to control
  • the interference signal generating module 20 sends out the first signal.
  • the processing unit 3021 sends out four second signals with frequencies F1, F2, F3, and F4 respectively, and the second signals are, for example, square wave signals.
  • the frequencies F1, F2, F3, F4 are different from each other.
  • the processing unit 3021 may also send out two, three, five, or more second signals with different frequencies.
  • the second signal may also be a suitable signal such as a sine wave signal, which is not limited in this application.
  • the processing unit 3021 includes any one or more of a processor or an oscillating circuit, and the processor or the oscillating circuit is configured to generate the four second signals with different frequencies. Regardless of whether it is through software or hardware, or a combination of software and hardware, as long as all technical solutions that can generate multiple second signals with different frequencies should fall within the scope of protection of this application, they are not limited to the ones described here. processor or oscillator circuit.
  • the processing module 302 further includes a driving unit 3022, and the driving unit 3022 is connected between the processing unit 3021 and the interference signal generating module 20, and is used for processing the four second signals with different frequencies.
  • the signal is amplified, and the amplified second signal is output to the interference signal generation module 20, so as to drive the interference signal generation module 20 to output the four first signals with different frequencies to the first accommodation tank 12 middle.
  • the motherboard 30 includes a circuit board 301 , a processing module 302 , a charging interface 303 , a wireless charging drive circuit 304 , a capacitance detection circuit 305 , and a power management module 306 .
  • the charging interface 303 is located on an end of the circuit board 301 facing the upper case 13 .
  • the processing module 302 , the wireless charging drive circuit 304 , the capacitance detection circuit 305 , and the power management module 306 are located on the surface of the circuit board 301 facing away from the upper case 13 .
  • the present application does not limit the positions of the components on the circuit board 301 , for example, the processing module 302 may also be located on the side surface of the circuit board 301 facing the upper case 13 .
  • processing module 302 wireless charging drive circuit 304 , capacitance detection circuit 305 , and power management module 306 are only shown as blocks in FIG. 2 and FIG. 10 , rather than actual product forms.
  • the detection module 50 includes a detection electrode 501 and the capacitance detection circuit 305 .
  • the detection electrode 501 is used to form a detection capacitor with the electronic device A.
  • the detection electrode 501 is disposed on the inner surface of the upper case 13 .
  • the capacitance detection circuit 305 is used to drive the detection electrodes 501 to perform capacitance sensing.
  • the detection module 50 implements capacitive sensing by means of self-capacitance or mutual-capacitance detection.
  • the shell of the electronic device A is metal
  • the metal can interact with the detection electrode 501 to form a detection capacitor; when the shell of the electronic device A is not metal, the conductor in the electronic device A interacts with the detection electrode 501 , forming a sense capacitance.
  • the detection electrodes 501 are, for example, arranged on the inner surface of the upper case 13 in a fixed manner such as sticking.
  • the detection electrode 501 is, for example but not limited to, a suitable conductive material such as copper sheet.
  • the detection electrode 501 is connected to the capacitance detection circuit 305 through wires, for example.
  • the electronic device A can be detected relatively easily and the detection accuracy is high.
  • the detection electrode 501 is manufactured on a flexible circuit board 502, and one end of the flexible circuit board 502 provided with the detection electrode 501 is disposed on the inner surface of the upper case 13, and the flexible circuit board 502 The other end is connected to the capacitance detection circuit 305 on the side of the motherboard 30 facing the lower case 14 .
  • the flexible circuit board 502 is relatively stable during the process of product installation and product use, and is not prone to technical problems such as breakage, so that the quality stability of the interference device 1 can be improved.
  • the wireless charging module 40 includes the coil 401 and the wireless charging driving circuit 304 .
  • the wireless charging drive circuit 304 is electrically connected to the coil 401 , and the two cooperate to realize wireless charging for the electronic device A.
  • the wireless charging module 40 can also be omitted in the interference device 1 .
  • the processing module 302 is electrically connected to the interference signal generating module 20 , the detecting module 50 , the power management module 306 and the indicating module 60 respectively.
  • the power management module 306 is electrically connected to the charging interface 303 , the detection module 50 and the wireless charging module 40 respectively.
  • the power management module 306 receives an external power supply voltage through the charging interface 303, and converts the received external power supply voltage into a first power supply voltage.
  • the power management module 306 provides the first power supply voltage to the processing unit 3021 during operation, and starts to provide the second power supply voltage to the driving unit 3022 when the processing unit 3021 receives the detection signal, So that the drive unit 3022 starts to work.
  • the first power supply voltage is, for example but not limited to, 3.3V
  • the second power supply voltage is, for example but not limited to, 12V.
  • the power management module 306 does not output the second power supply voltage to the driving unit 3022 . Therefore, the purpose of saving power consumption can be achieved.
  • the power management module 306 is also configured to provide a third power supply voltage to the wireless charging drive circuit 304 .
  • the third power supply voltage is, for example but not limited to, 12V.
  • the indication module 60 includes a first indication unit 601 and a second indication unit 602 .
  • the first indicating unit 601 and the second indicating unit 602 are, for example but not limited to, appropriate indicating elements such as LED lamps and display screens.
  • the first indicating unit 601 is a power indicator light
  • the second indicating unit 602 is a working indicator light.
  • the first indicator unit 601 When the power management module 306 is connected to the external power supply voltage, the first indicator unit 601 is turned on with a red light, and when the wireless charging module 40 is working, the first indicator unit 601 is switched by a red light It is a blue light, that is, it switches from the first indication state (such as but not limited to a red light) to the second indication state (such as but not limited to a blue light).
  • the second indication unit 602 After the processing unit 3021 receives the detection signal from the detection module 50, the second indication unit 602 sends out a third indication state, such as but not limited to a green light.
  • a third indication state such as but not limited to a green light.
  • the second indication unit 602 is, for example but not limited to, in a fourth indication state such as an off state or a red light. .
  • the user can clearly understand the interference device 1 various working states.
  • the indicator module 60 is arranged on a sub-board 205 of the signal interference generating module 20, and the indicator module 60 and the interference signal generator 201 are respectively arranged on opposite sides of the sub-board 205.
  • the indicating module 60 is disposed adjacent to the charging interface 303 , and the upper case 13 is respectively provided with openings K10 at positions corresponding to the indicating module 60 and the charging interface 303 .
  • the interference device 1 of the present application further adds a detection module 50, and when the detection module 50 detects that the electronic device A is placed in the first accommodating slot 12, the interference signal generation module of the interference device 1 20, for example, start to send four first sound wave signals of different frequencies into the first accommodating slot 12, so as to perform audio interference on the electronic device A, so as to realize the function of anti-tampering and anti-eavesdropping. In this way, not only power consumption can be saved, but also the purpose of improving product life can be achieved.
  • the detection technical solution of adding the detection module 50 above is not limited to be applied to the interference device 1 of the above-mentioned new structure, and can also be applied to interference devices of other implementations or other structures, for example, the housing of the interference device
  • the space does not include the second accommodating slot for accommodating the interference signal generation module
  • the interference device includes another independent accommodation space for accommodating the interference signal generation module, and the interference device with such a structure can add the detection module 50 Technical solutions. Therefore, as long as it is based on the core technical ideas of the present application, all modified implementations that are easily conceived by those skilled in the art shall fall within the protection scope of the present application.
  • the interference device 1 further includes a rechargeable battery 70 , for example, the rechargeable battery 70 is disposed between the main board 30 and the lower case 14 .
  • the rechargeable battery 70 can store electrical energy, so when there is no external power supply voltage, the rechargeable battery 70 can be used for power supply.
  • FIG. 13 is a structural block diagram of another embodiment of the interference device 1 .
  • the interference device 1 does not include a detection module 50 .
  • the power management module 306 continuously provides the first power supply voltage to the processing unit 3201 and continuously provides the second power supply voltage to the driving unit 3022 , so it is also possible. 13 is the same as or similar to the working relationship of the implementation in FIG. 12 and will not be repeated here.
  • FIG. 14 is a schematic perspective view of the second embodiment of the interference device of the present application.
  • Fig. 15 is a schematic diagram of the exploded structure of the jamming device shown in Fig. 14 .
  • Fig. 16 is a schematic perspective view of the upper shell of the interference device.
  • Fig. 17 is a partial structural diagram of the interference signal generating module.
  • the main structure of the interference device 2 is the same as that of the interference device 1, the same or similar parts of the two will not be repeated here, and the main differences between the two will be described below.
  • the detection module 50 is an infrared detection module.
  • the infrared detection module is arranged in the accommodation space 11, and is used for emitting infrared rays into the first accommodation groove 12, and receiving the infrared rays returned from the first accommodation groove 12, so as to detect the first accommodation groove 12. Whether electronic equipment A is placed in slot 12.
  • the processing module (not marked) is used for correspondingly controlling whether the interference signal generating module 20 sends a first signal to the first accommodating slot 12 according to the detection result output by the infrared detection module.
  • the infrared detection module detects that the electronic device A is placed in the first accommodating slot 12
  • the infrared detection module sends a corresponding detection signal to the processing module, and the processing module corresponds to the detection signal according to the detection signal.
  • the interference signal generating module 20 is controlled to start sending the first signal into the first accommodating slot 12 to interfere with the electronic device A in the first accommodating slot 12 .
  • an infrared transmissive plate 139 is disposed on the housing 10 in a region corresponding to the infrared detection module.
  • the infrared transmissive plate 139 is disposed in the middle area of the upper case 13 .
  • the infrared transmissive plate 139 can transmit infrared rays.
  • the infrared detection module includes, for example, an infrared emitting device (not shown) and an infrared receiving device (not shown).
  • the infrared emitted by the infrared emitting device is emitted into the first accommodating groove 12 through the infrared transmissive plate 139, and the infrared receiving device receives the infrared rays from the first accommodating groove 12 through the infrared transmissive plate 139. return infrared rays, and convert the received infrared rays into corresponding electrical signals, so as to detect whether the electronic device A is placed in the first accommodating slot 12 .
  • the third accommodating slot 134 for accommodating the coil 401 of the wireless charging module 40 in the interference device 2 is provided on the main board 30 .
  • the third accommodating groove 134 is opposite to the infrared transmission plate 139 .
  • the third accommodating groove 134 may also be disposed on one side of the inner surface of the upper shell 13 .
  • the infrared detection module is disposed on a surface of the coil 401 of the wireless charging module 40 facing the infrared transmission plate 139 .
  • the infrared detection module is located at the center of the coil 401 of the wireless charging module 40 .
  • the interference signal generating module 20 does not have a positioning frame 203 and a gauze 204, and the side of the interference signal generator 201 for emitting the first acoustic wave signal faces the center of the first accommodation groove 12 along the length direction.
  • the line LL' is inclined, and the angle of inclination ranges from, for example but not limited to, 15° to 30°.
  • the angle of inclination may be, for example, 15 degrees. That is, the acute angle between the center line L1-L1' of the interference signal generator 201 along the height direction and the center line L-L' of the first accommodation groove 12 along the length direction is 15 degrees.
  • the center line L-L' of the first accommodation groove 12 along the length direction is translated accordingly.
  • the structure of the interference signal generation module 20 of the interference device 2 may be exactly the same as that of the interference signal generation module 20 of the interference device 1 .
  • the interference signal module 20 may also adopt the structure of the interference signal module 20 in the interference device 1, which is also possible.
  • FIG. 18 is a schematic three-dimensional structure diagram of a third embodiment of the interference device of the present application.
  • FIG. 19 is a schematic diagram of the exploded structure of the jamming device shown in FIG. 18 .
  • FIG. 20 is a schematic perspective view of the three-dimensional structure of the upper case of the interference device shown in FIG. 18 .
  • FIG. 21 is a schematic structural view of the pressure-assisting plate of the interference device shown in FIG. 18 .
  • Fig. 22 is a schematic structural view of the support pad of the interference device shown in Fig. 18 .
  • the structure of the interference device 3 is substantially the same as that of the interference device 1 , and the same or similarities between the two will not be repeated here. The main differences between the two are described below.
  • the inner side wall 1321 of the upper shell 13 is not provided with the opening K, but with the plurality of through holes K1.
  • the interference signal generating module 20 is arranged behind the inner wall 1321 .
  • the outer wall 1322 does not include the second portion B2 (see FIG. 3 ).
  • the lower shell 14 includes a base 148 and a sidewall 149 extending from the base 148 toward the upper shell 13 .
  • the sidewall 149 of the lower shell 14 matches the outer wall 1322 of the upper shell 13 to form the receiving space 11 .
  • the detection module 50 is a mechanical detection module.
  • the mechanical detection module includes a mechanical switch 505 disposed on a surface of the main board 30 facing the upper case 13 .
  • the number of said mechanical switch is at least one.
  • the number of the mechanical switches 505 is two.
  • the number of mechanical switches 505 can also be three, four, or even more.
  • an opening K4 penetrating to the accommodating space 11 is formed in the groove 135 of the upper shell 13, and a supporting structure 136 is arranged in the groove 135, and the supporting structure 136 faces the opening.
  • a protrusion T is provided at the position of the hole K4, and the protrusion T is used to press and trigger the mechanical switch 505 when the electronic device A is placed in the first receiving slot 12 .
  • the support structure 136 includes a support pad 1361 and a pressure-assisting plate 1362, and the pressure-assisting plate 1362 is provided with the protrusion T at a position facing the opening K4.
  • the mechanical switch 505 is located in the opening K4 and has a predetermined distance from the protrusion T. As shown in FIG.
  • the pressure-assisting plate 1362 is further formed with four positioning columns Z5 on the side surface facing the lower shell 14, and the groove 135 is formed with positioning columns that match the four positioning columns Z5.
  • a screw 1363 passes through the positioning hole K5 and locks with the lock hole in the positioning post Z5, so that the supporting structure 136 is fixed in the groove 135 .
  • the supporting structure 136 can move up and down relative to the groove 135 .
  • the processing module 302 correspondingly controls whether the interference signal generating module 20 sends the first signal to the first accommodating groove 12 according to whether the mechanical switch 505 is triggered by pressing the protrusion T .
  • the detection module 50 detects that the electronic device A is placed in the first accommodating slot 12, and sends a corresponding detection signal to the The processing module 302, the processing module 302 correspondingly controls the interference signal generating module 20 to start sending the first signal into the first accommodation slot 12 according to the detection signal, so as to control the first accommodation slot 12.
  • Electronic device A in slot 12 interferes.
  • the support pad 1361 is a wheat awn structure, and channels in the awn structure can transmit the first signal.
  • the wheat awn structure is, for example but not limited to, a wheat awn array structure.
  • the pressing trigger of the protrusion T on the mechanical switch 505 is a positive pressure trigger.
  • FIG. 23 is a schematic three-dimensional structure diagram of a fourth embodiment of the interference device of the present application.
  • Fig. 24 is a schematic diagram of the exploded structure of the jamming device shown in Fig. 22 .
  • FIG. 25 is a schematic perspective view of the upper shell of the interference device shown in FIG. 23 .
  • the structure of the interference device 4 is substantially the same as that of the interference device 1 , and the same or similarities between the two will not be repeated here. The main differences between the two are described below.
  • the detection module 50 is a mechanical detection module.
  • the mechanical detection module includes a mechanical switch 505 disposed on a surface of the main board 30 facing the upper case 13 .
  • the number of the mechanical switch 505 is at least one. In this embodiment, the number of the mechanical switches 505 is four. Certainly, the number of the mechanical switches 505 may also be two, three, or even more.
  • the upper shell 13 is respectively provided with openings K8 at the bottoms of both ends of the first accommodating groove 12, and a support structure rotatably connected to the upper shell 13 is formed on one side of the opening K8. 136.
  • the support structure 136 covers the opening K8.
  • the support structure 136 has a protrusion (not shown) formed on the side surface facing the lower case 14, and the protrusion is used for when the electronic device A is placed in the first accommodating groove 12. Pressing triggers the mechanical switch 505 .
  • the supporting structure 136 includes a supporting pad 1361 and a pressure-assisting plate 1362 .
  • the pressure-assisting plate 1362 is located between the opening K8 and the support pad 1361 , and is rotatably connected with the upper shell 13 .
  • the pressure-assisting plate 1362 is disposed at the opening K8 and is rotatably connected to the upper shell 13 in a hinged connection, that is, a rotating shaft connection.
  • the position of the pressure-assisting plate 1362 facing the opening K8 is provided with the protrusion, and the protrusion is used to press and trigger the mechanical switch 505 when the electronic device A is placed in the first accommodating slot 12 .
  • the support pad 1361 is used to support and/or prevent the electronic device A from slipping.
  • the support pad 1361 is a wheat awn structure, and the gaps in the awn structure can transmit the first signal.
  • the wheat awn structure is, for example but not limited to, a wheat awn array structure.
  • the processing module 302 correspondingly controls whether the interference signal generating module 20 sends the first signal to the first accommodating slot 12 according to whether the mechanical switch 505 is pressed and triggered.
  • the detection module 50 detects that the electronic device A is placed in the first accommodating groove 12, and sends a corresponding detection signal to the The processing module 302, the processing module 302 correspondingly controls the interference signal generating module 20 to start sending the first signal into the first accommodation tank 12 according to the detection signal, so as to control the first accommodation tank 12 Electronic device A in 12 interferes.
  • the pressing trigger of the protrusion T on the mechanical switch 505 is a ramp trigger, which is similar to the principle of a guillotine.
  • FIG. 26 is an exploded view of a fifth embodiment of the interference device of the present application.
  • the structure of the interference device 5 is substantially the same as that of the interference device 1 , and the same or similarities between the two will not be repeated here. The main differences between the two are described below.
  • the interference signal generating module 20 includes an interference signal generator 201, a partition 202, and a reflection structure 206, and the partition 202 is exposed at the opening K of the inner sidewall 1321.
  • the reflective structure 206 is disposed in the second accommodating groove 110 and behind the partition 202 .
  • the interference signal generator 201 is disposed on an end surface of the main board 30 facing the second accommodating slot 110 .
  • the interference signal generator 201 sends a first signal into the second accommodating groove 110 , and is emitted into the first accommodating groove 12 after being reflected by the reflection structure 206 .
  • the reflective structure 206 has an inclined portion 2061 , and the inclined portion 2061 enables the first signal incident thereon to be emitted toward the first accommodating groove 12 .
  • setting the reflective structure 206 in the second accommodation groove 110 can make the interference signal generator 201 set on the main board 30, and the height of the reflective structure 206 can be smaller than the Therefore, the height of the second accommodating groove 110 can be reduced correspondingly, so that the overall thickness of the interference device 5 can be reduced.
  • the described features and structures may be combined in any suitable manner in one or more implementations.
  • the various embodiments described above in the present application it is easy to imagine that more embodiments can be obtained by combining the technical solutions of different embodiments.
  • the structure of the housing 10 of the interference device 3 in the third embodiment can also be applied to other implementations.
  • this application provides a new type of interference device 1, 2, 3, 4, 5.
  • the overall structure of the interference device 1, 2, 3, 4, 5 of this application is not available in the prior art;
  • the present application also provides a jamming device with a detection module 50, and the structure of the jamming device with a detection function is not limited to the jamming devices 1, 2, 3, 4, and 5 with new structures described in this application. It can also be an interference device with other suitable structures, as long as it can detect whether the electronic device A is placed on the interference device, and when the electronic device A is detected, the processing module 302 starts to control the interference signal generation module 20 to send the first signal, All practicable embodiments to interfere with electronic equipment shall fall within the scope of protection of this application.
  • the interference devices 1, 2, 3, 4, and 5 can not only implement the function of anti-eavesdropping and anti-tampering to the electronic equipment A by means of sound wave interference, but also can use any other suitable method such as electromagnetic interference.
  • the anti-eavesdropping and anti-tampering function of the electronic device A is realized by means of interference. Therefore, the first signal is not limited to the first acoustic wave signal, but can also be any other suitable signal such as an electromagnetic wave signal. That is, in addition to audio interference, electromagnetic interference and the like can also be used to achieve the effect of anti-eavesdropping and anti-tampering on the electronic device A.

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  • Computer Networks & Wireless Communication (AREA)
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  • Accessory Devices And Overall Control Thereof (AREA)

Abstract

The present application discloses an interference apparatus. The interference apparatus comprises: a housing, wherein an accommodating space is formed in the housing, a first accommodating groove is formed at one side of the exterior of the housing, the first accommodating groove is communicated with the accommodating space, and the first accommodating groove is used for placing an electronic device; and an interference signal generation module, arranged in the accommodating space, wherein the interference signal generation module is configured to send a first signal to the first accommodating groove so as to interfere with the electronic device. By using the interference apparatus having the structure of the present application, the purpose of anti-eavesdropping and anti-recording processing of the electronic device placed in the first accommodating groove can be realized.

Description

一种干扰装置a jamming device 技术领域technical field
本申请属于电子设备的干扰技术领域,具体涉及一种超声波干扰装置。The application belongs to the technical field of interference of electronic equipment, and in particular relates to an ultrasonic interference device.
背景技术Background technique
在一些比较重要的会议或者交谈场合,有人会使用手机录音功能对会议或谈话的内容进行录音,或者手机被远程窃听,而讲话者并不希望自己的讲话被录音被窃听,不想个人隐私、商业秘密遭到泄露。In some important meetings or conversations, someone will use the recording function of the mobile phone to record the content of the meeting or conversation, or the mobile phone will be tapped remotely, and the speaker does not want his speech to be recorded or tapped, and he does not want personal privacy, business Secrets are revealed.
目前,市面上并没有一款能够放置手机并能够对手机实现防窃录防窃听的干扰装置。At present, there is no jamming device on the market that can place a mobile phone and realize anti-eavesdropping and anti-eavesdropping on the mobile phone.
申请内容application content
为了解决上述问题,本申请的目的在于提供一种能够放置电子设备并能够对电子设备实现防窃录防窃听的干扰装置In order to solve the above problems, the purpose of this application is to provide a jamming device that can place electronic equipment and realize anti-tampering and anti-eavesdropping on electronic equipment
本申请实施方式提供一种干扰装置,包括:The implementation mode of this application provides an interference device, including:
壳体,所述壳体内部具有收容空间,所述壳体外部一侧具有第一容置槽,所述第一容置槽与所述收容空间之间相连通,其中,所述第一容置槽用于放置电子设备;The casing has a receiving space inside the casing, and a first containing groove is formed on one side of the outside of the casing, and the first containing groove communicates with the containing space, wherein the first containing The slot is used to place electronic equipment;
干扰信号发生模块,设置在所述收容空间中,所述干扰信号发生模块用于发出第一信号到所述第一容置槽中,以对所述电子设备进行干扰。An interference signal generating module is arranged in the accommodation space, and the interference signal generating module is used to send a first signal into the first accommodation slot to interfere with the electronic equipment.
在某些实施方式中,所述干扰信号发生模块发出的第一信号为第一声波信号,所述第一信号包括至少两个不同频率的第一声波信号,所述至少两个不同频率的第一声波信号经过混频后能够产生被人耳可听见的第二声波信号,所述第二声波信号用于对所述电子设备进行音频干扰。In some embodiments, the first signal emitted by the interference signal generating module is a first sound wave signal, and the first signal includes at least two first sound wave signals of different frequencies, and the at least two different frequencies The first sound wave signal can be mixed to generate a second sound wave signal audible to human ears, and the second sound wave signal is used for audio interference to the electronic device.
在某些实施方式中,所述第一信号为超声波信号。In some embodiments, the first signal is an ultrasonic signal.
在某些实施方式中,所述至少两个频率不同的第一声波信号为人耳不可听见的声波信号,经混频后能够产生被人耳可听见的第二声波信号。In some embodiments, the at least two first sound wave signals with different frequencies are sound wave signals inaudible to human ears, and can generate second sound wave signals audible to human ears after mixing.
在某些实施方式中,所述壳体在围成所述第一容置槽的相对两侧的侧壁上设置有凹陷部。In some embodiments, the housing is provided with recesses on the sidewalls surrounding opposite sides of the first accommodating groove.
在某些实施方式中,所述凹陷部位于每侧侧壁的中部位置,且设置有凹陷部的侧壁位于所述壳体在宽度方向上的相对两侧。In some embodiments, the recessed portion is located in the middle of each side wall, and the side walls provided with the recessed portion are located on opposite sides of the housing in the width direction.
在某些实施方式中,所述壳体的收容空间中包括第二容置槽,所述第二容置槽的数量至少为一个,且设置在所述第一容置槽在长度方向上的旁侧,所述第一容置槽与所述第二容置槽相连通,所述干扰信号发生模块发出的第一信号从所述第二容置槽出射到所述第一容置槽中。In some embodiments, the accommodation space of the housing includes a second accommodating groove, the number of the second accommodating groove is at least one, and the second accommodating groove is arranged at On the side, the first accommodating groove communicates with the second accommodating groove, and the first signal emitted by the interference signal generating module is emitted from the second accommodating groove into the first accommodating groove .
在某些实施方式中,所述第二容置槽在高度方向上高出所述第一容置槽的底面,所述底面为所述壳体的一侧表面,用于承载所述电子设备。In some embodiments, the second accommodating groove is higher than the bottom surface of the first accommodating groove in the height direction, and the bottom surface is a side surface of the housing for carrying the electronic device .
在某些实施方式中,所述干扰信号发生模块设置在所述第二容置槽中,且所述干扰信号发生模块用于出射第一信号的一侧面对所述第一容置槽。In some implementations, the interference signal generating module is disposed in the second accommodating slot, and the side of the interfering signal generating module for emitting the first signal faces the first accommodating slot.
在某些实施方式中,所述收容空间包括两个所述第二容置槽,分别设置在所述第一容置槽在长度方向上的相对两侧,每一所述第二容置槽中分别设置一所述干扰信号发生模块。In some embodiments, the accommodating space includes two second accommodating grooves, which are respectively arranged on opposite sides of the first accommodating groove in the length direction, and each of the second accommodating grooves One of the interference signal generation modules is set in each.
在某些实施方式中,所述壳体包括:In some embodiments, the housing includes:
下壳;和lower shell; and
上壳,用于与所述下壳相配合形成所述收容空间,所述上壳包括:The upper shell is used to cooperate with the lower shell to form the accommodation space, and the upper shell includes:
基板,包括第一表面和第二表面,其中,所述第一表面为所述基板的外表面,所述外表面背对所述下壳,所述第二表面为所述基板的内表面,所述内表面面对所述下壳;The substrate includes a first surface and a second surface, wherein the first surface is an outer surface of the substrate, the outer surface faces away from the lower case, and the second surface is an inner surface of the substrate, the inner surface faces the lower case;
侧壁,位于所述基板的周边、且在背对所述下壳的方向上高出所述第一表面;和a side wall located at the periphery of the base plate and higher than the first surface in a direction facing away from the lower case; and
顶板,位于所述基板的至少一侧,且在背对所述下壳的方向上高出所述第一表面,所述顶板与所述侧壁相连接;a top plate, located on at least one side of the base plate, and higher than the first surface in a direction facing away from the lower shell, the top plate is connected to the side wall;
其中,所述基板背对所述下壳的一侧形成所述第一容置槽,所述第一容置槽用于放置电子设备,所述顶板朝向所述下壳的一侧形成所述第二容置槽。Wherein, the side of the substrate facing away from the lower case forms the first accommodating groove, the first accommodating groove is used to place electronic equipment, and the side of the top plate facing the lower case forms the first accommodating groove. Second holding tank.
在某些实施方式中,所述第二容置槽用于放置所述干扰信号发生模块,所述干扰信号发生模块用于出射所述第一信号的一侧面对所述第一容置槽。In some implementations, the second accommodating slot is used to place the interference signal generating module, and the side of the interfering signal generating module used to emit the first signal faces the first accommodating slot.
在某些实施方式中,所述上壳的基板、上壳的侧壁、和上壳的顶板为一体结构。In some embodiments, the base plate of the upper case, the side wall of the upper case, and the top plate of the upper case are integrally constructed.
在某些实施方式中,所述上壳包括两个所述第二容置槽,分别位于所述第一容置槽在长度方向上的相对两侧。In some embodiments, the upper shell includes two second accommodation slots, which are respectively located on opposite sides of the first accommodation slot in the length direction.
在某些实施方式中,所述上壳的侧壁包括内侧壁与外侧壁,所述外侧壁位于所述内侧壁的外围,其中,所述基板的第一表面与所述内侧壁围成所述第一容置槽,所述顶板连接于所述内侧壁与所述外侧壁之间,所述顶板、所述外侧壁以及所述内侧壁围成所述第二容置槽。In some embodiments, the sidewall of the upper case includes an inner sidewall and an outer sidewall, and the outer sidewall is located at the periphery of the inner sidewall, wherein the first surface of the substrate and the inner sidewall form a The first accommodating groove, the top plate is connected between the inner side wall and the outer side wall, and the top plate, the outer side wall and the inner side wall enclose the second accommodating groove.
在某些实施方式中,所述第一容置槽与所述第二容置槽之间设置的内侧壁上设有开口或设有多个通孔,以使得所述第一容置槽与所述第二容置槽相连通。In some embodiments, an opening or a plurality of through holes are provided on the inner side wall provided between the first accommodating groove and the second accommodating groove, so that the first accommodating groove and the second accommodating groove The second accommodating grooves are connected.
在某些实施方式中,所述内侧壁从所述基板上沿背对所述下壳的方向向上延伸出来。In some embodiments, the inner sidewall extends upward from the base plate in a direction away from the lower case.
在某些实施方式中,所述外侧壁包括相连接的第一部分与第二部分,其中,所述第一部分为在背对所述下壳的方向上高出所述第一表面的部分,所述第二部分为在面对所述下壳的方向高出所述第二表面的部分。In some embodiments, the outer sidewall includes a first part and a second part connected, wherein the first part is a part higher than the first surface in the direction facing away from the lower shell, so The second portion is a portion higher than the second surface in a direction facing the lower case.
在某些实施方式中,所述第二部分用于与所述下壳相配合以形成所述收容空间,所述第一部分用于与所述顶板、所述基板相配合以形成所述第一容置槽和所述第二容置槽。In some embodiments, the second part is used to cooperate with the lower case to form the receiving space, and the first part is used to cooperate with the top board and the base board to form the first the accommodating tank and the second accommodating tank.
在某些实施方式中,所述下壳包括基体以及从基体周围朝所述上壳方向延伸出来的侧壁,所述下壳的侧壁与所述上壳的外侧壁相匹配以形成所述收容空间。In some embodiments, the lower case includes a base body and side walls extending from the periphery of the base body toward the upper case, the side walls of the lower case match the outer side walls of the upper case to form the containment space.
在某些实施方式中,所述上壳在所述第一表面上进一步包括凹槽,所述凹槽内设置支撑结构,所述支撑结构用于对放置于所述第一容置槽中的电子设备 起到支撑或/和防滑作用。In some embodiments, the upper shell further includes a groove on the first surface, and a support structure is arranged in the groove, and the support structure is used for supporting the The electronic equipment plays a support or/and anti-skid role.
在某些实施方式中,所述支撑结构包括支撑垫,所述支撑垫上形成有缝隙,所述缝隙能够通过所述第一信号。In some embodiments, the support structure includes a support pad, and a slot is formed on the support pad, and the slot can pass through the first signal.
在某些实施方式中,所述凹槽的数量为两个,分别设置在所述第一表面上的两端,所述基板的中部区域上未设置有所述凹槽的部分的厚度与所述基板上设置有所述凹槽的区域的厚度相同。In some embodiments, the number of the grooves is two, which are respectively arranged at both ends of the first surface, and the thickness of the part not provided with the grooves on the central region of the substrate is the same as the thickness of the grooves. The thickness of the region where the groove is arranged on the substrate is the same.
在某些实施方式中,所述干扰装置进一步包括无线充电模块,所述基板的第二表面上在未设置所述凹槽的中部区域上设置有第三容置槽,用以收容所述无线充电模块。In some embodiments, the interference device further includes a wireless charging module, and a third accommodating groove is provided on the second surface of the substrate in the middle area where the groove is not provided, for accommodating the wireless charging module. charging module.
在某些实施方式中,所述下壳上设置有多个通孔,所述基板的第二表面上进一步形成有多个第一定位柱和多个第二定位柱,所述多个第二定位柱位于所述第二表面上的中部区域,所述多个第一定位柱位于所述第二表面的两端区域,其中,所述多个第一定位柱的高度小于所述多个第二定位柱的高度,所述多个第一定位柱具有锁孔,所述上壳与所述下壳通过螺丝穿入所述下壳上的通孔并与所述锁孔进行锁紧固定。In some embodiments, the lower shell is provided with a plurality of through holes, and the second surface of the substrate is further formed with a plurality of first positioning posts and a plurality of second positioning posts, and the plurality of second positioning posts The positioning posts are located in the middle area of the second surface, and the plurality of first positioning posts are located in both end areas of the second surface, wherein the heights of the plurality of first positioning posts are smaller than the heights of the plurality of first positioning posts. The height of the two positioning posts, the plurality of first positioning posts have lock holes, the upper shell and the lower shell pass through the through holes on the lower shell through screws and are locked and fixed with the lock holes.
在某些实施方式中,所述干扰装置进一步包括主板,位于所述上壳与所述下壳之间,所述主板用于驱动所述干扰信号发生模块发出第一信号,所述主板的边缘区域上包括多个通孔,所述多个第一定位柱与所述多个第二定位柱用于分别穿过所述主板上的通孔并与所述下壳相抵触。In some embodiments, the interference device further includes a main board, located between the upper case and the lower case, the main board is used to drive the interference signal generating module to send the first signal, and the edge of the main board The area includes a plurality of through holes, and the plurality of first positioning posts and the plurality of second positioning posts are used to respectively pass through the through holes on the main board and interfere with the lower case.
在某些实施方式中,所述下壳上背对所述上壳的一侧设置有凹槽,所述下壳上的通孔贯穿至所述凹槽,所述凹槽中设置有防滑垫。In some embodiments, a groove is provided on the side of the lower shell facing away from the upper shell, the through hole on the lower shell penetrates to the groove, and an anti-skid pad is arranged in the groove .
在某些实施方式中,所述下壳面对所述上壳的一侧表面上形成有凸起,当所述下壳与所述上壳安装在一起时,所述多个第一定位柱与所述多个第二定位柱均与所述凸起相抵触,且在所述下壳的通孔的上方形成有限位槽,所述限位槽的开孔孔径大于所述下壳的通孔的孔径,所述限位槽用于收容所述第一定位柱的端部。In some embodiments, a protrusion is formed on the surface of the lower shell facing the upper shell, and when the lower shell and the upper shell are installed together, the plurality of first positioning posts All the plurality of second positioning columns are in conflict with the protrusion, and a limiting groove is formed above the through hole of the lower case, and the opening diameter of the limiting groove is larger than the through hole of the lower case. The diameter of the hole, the limiting groove is used to accommodate the end of the first positioning post.
在某些实施方式中,所述支撑垫为麦芒结构或橡胶垫,所述麦芒结构上的 缝隙或所述橡胶垫上的缝隙能够通过所述第一信号。In some embodiments, the support pad is a wheat awn structure or a rubber pad, and the gaps on the wheat awn structure or the rubber pad can pass through the first signal.
在某些实施方式中,所述第二容置槽中设置定位柱,用于与所述干扰信号发生模块上的定位孔相配合,以对所述干扰信号发生模块进行限位固定。In some implementations, a positioning column is provided in the second accommodation slot for cooperating with the positioning hole on the interference signal generating module, so as to limit and fix the interference signal generating module.
在某些实施方式中,所述基板的第二表面上进一步形成有多个卡位结构,位于所述多个第二定位柱的外围,所述卡位结构用于对所述主板进行固定。In some embodiments, a plurality of locking structures are further formed on the second surface of the base plate, located on the periphery of the plurality of second positioning posts, and the locking structures are used to fix the main board.
在某些实施方式中,所述卡位结构为凸起结构,且远离所述基板的一端形成有卡勾,所述卡勾用于将所述主板卡扣固定在所述基板上。In some embodiments, the locking structure is a protruding structure, and a hook is formed at an end far away from the substrate, and the hook is used to buckle and fix the main board on the substrate.
在某些实施方式中,所述上壳的第一容置槽中用于放置的电子设备为手机,且所述干扰装置仅能够对单一手机进行干扰。In some embodiments, the electronic device used to be placed in the first accommodating slot of the upper case is a mobile phone, and the interference device can only interfere with a single mobile phone.
在某些实施方式中,所述第一容置槽与所述第二容置槽之间设置的内侧壁上设有开口,每一所述第二容置槽中设置有一所述干扰信号发生模块,所述干扰信号发生模块包括至少二干扰信号发生器和隔板,所述干扰信号发生器用于发出具有预设频率的所述第一信号,所述至少二干扰信号发生器用于发出至少二频率不同的第一信号,所述隔板具有多个通孔,所述隔板曝露在所述开口处,所述第一信号通过所述隔板上的多个通孔出射到所述第一容置槽中。In some embodiments, an opening is provided on the inner side wall provided between the first accommodating groove and the second accommodating groove, and each of the second accommodating grooves is provided with an interference signal generator module, the interference signal generating module includes at least two interference signal generators and a partition, the interference signal generator is used to send the first signal with a preset frequency, and the at least two interference signal generators are used to send at least two First signals with different frequencies, the partition has a plurality of through holes, the partition is exposed at the opening, the first signal exits to the first signal through the plurality of through holes on the partition in the holding tank.
在某些实施方式中,所述干扰装置进一步包括主板,所述主板用于驱动所述干扰信号发生模块发出第一信号,所述干扰信号发生模块进一步包括定位架和副板,所述至少二干扰信号发生器设置在所述副板上,所述副板与所述主板电连接,所述定位架上包括至少二穿孔,每一干扰信号发生器设置在所述定位架的穿孔中,所述定位架位于所述隔板背对所述第一容置槽的一侧。In some embodiments, the interference device further includes a main board, the main board is used to drive the interference signal generation module to send out the first signal, the interference signal generation module further includes a positioning frame and a sub-board, and the at least two The interference signal generator is arranged on the sub-board, and the sub-board is electrically connected to the main board, and the positioning frame includes at least two perforations, and each interference signal generator is arranged in the perforation of the positioning frame. The positioning frame is located on a side of the partition facing away from the first accommodating groove.
在某些实施方式中,所述干扰信号发生模块进一步包括纱网,所述纱网设置在所述隔板与所述定位架之间。In some embodiments, the interference signal generating module further includes gauze, and the gauze is disposed between the partition and the positioning frame.
在某些实施方式中,所述干扰装置的长度为不大于22厘米,宽度不大于12厘米。In some embodiments, the interference device has a length no greater than 22 cm and a width no greater than 12 cm.
本申请的干扰装置为一种全新结构的干扰装置,其不仅可以用于放置电子设备,而且还能够对放置于其中的电子设备实现防窃听防窃录的功能。The jamming device of the present application is a jamming device with a new structure, which can not only be used to place electronic equipment, but also can realize the function of anti-eavesdropping and anti-tampering for the electronic equipment placed therein.
附图说明Description of drawings
图1为本申请提供的干扰装置的第一实施方式的立体结构示意图。FIG. 1 is a schematic three-dimensional structure diagram of a first embodiment of an interference device provided by the present application.
图2为图1所示的干扰装置的爆炸图。FIG. 2 is an exploded view of the interference device shown in FIG. 1 .
图3为图2所示干扰装置的上壳的外侧结构示意图。FIG. 3 is a schematic diagram of the outer structure of the upper case of the interference device shown in FIG. 2 .
图4为图2所示干扰装置的上壳的内侧结构示意图。FIG. 4 is a schematic diagram of the inner structure of the upper case of the interference device shown in FIG. 2 .
图5为图2所示干扰装置的下壳的背面结构示意图。FIG. 5 is a schematic diagram of the back structure of the lower case of the interference device shown in FIG. 2 .
图6为图2所示干扰装置的干扰信号发生模块的立体结构示意图。FIG. 6 is a schematic diagram of a three-dimensional structure of an interference signal generating module of the interference device shown in FIG. 2 .
图7为图2所示干扰装置的干扰信号发生模块的爆炸图。FIG. 7 is an exploded view of the jamming signal generating module of the jamming device shown in FIG. 2 .
图8为图2所示干扰装置的干扰信号发生模块的另一角度的立体结构示意图。FIG. 8 is a schematic perspective view of another angle of the interference signal generating module of the interference device shown in FIG. 2 .
图9为图2所示干扰装置的部分结构一角度的示意图。FIG. 9 is a perspective view of a partial structure of the interference device shown in FIG. 2 .
图10为图2所示干扰装置的部分结构另一角度的示意图。FIG. 10 is a schematic view from another angle of a partial structure of the interference device shown in FIG. 2 .
图11为图1所示干扰装置的第一容置槽中放置有电子设备的示意图。FIG. 11 is a schematic diagram of placing electronic equipment in the first accommodating slot of the interference device shown in FIG. 1 .
图12为本申请的干扰装置1一实施方式的结构框图。FIG. 12 is a structural block diagram of an embodiment of the interference device 1 of the present application.
图13为所述干扰装置1的另一实施方式的结构框图。FIG. 13 is a structural block diagram of another embodiment of the interference device 1 .
图14为本申请的干扰装置的第二实施方式的立体结构示意图。Fig. 14 is a schematic perspective view of the second embodiment of the interference device of the present application.
图15为图14所述干扰装置的爆炸结构示意图。图16为所述干扰装置的上壳的立体结构示意图。Fig. 15 is a schematic diagram of the exploded structure of the jamming device shown in Fig. 14 . Fig. 16 is a schematic perspective view of the upper shell of the interference device.
图16为所述干扰装置的上壳的立体结构示意图。Fig. 16 is a schematic perspective view of the upper shell of the interference device.
图17为干扰信号发生模块的部分结构示意图。Fig. 17 is a partial structural diagram of the interference signal generating module.
图18为本申请的干扰装置的第三实施方式的立体结构示意图。Fig. 18 is a schematic perspective view of the third embodiment of the interference device of the present application.
图19为图18所示的干扰装置的爆炸结构示意图。FIG. 19 is a schematic diagram of the exploded structure of the jamming device shown in FIG. 18 .
图20为图18所示的干扰装置的上壳的立体结构示意图。FIG. 20 is a schematic perspective view of the three-dimensional structure of the upper case of the interference device shown in FIG. 18 .
图21为图18所示的干扰装置的助压板的结构示意图。FIG. 21 is a schematic structural view of the pressure-assisting plate of the interference device shown in FIG. 18 .
图22为图18所示的干扰装置的支撑垫的结构示意图。Fig. 22 is a schematic structural view of the support pad of the interference device shown in Fig. 18 .
图23为本申请的干扰装置的第四实施方式的立体结构示意图。Fig. 23 is a schematic perspective view of the fourth embodiment of the interference device of the present application.
图24为图22所示的干扰装置的爆炸结构示意图。Fig. 24 is a schematic diagram of the exploded structure of the jamming device shown in Fig. 22 .
图25为图23所示的干扰装置的上壳的立体结构示意图。FIG. 25 is a schematic perspective view of the upper shell of the interference device shown in FIG. 23 .
图26为本申请的干扰装置的第五实施方式的爆炸图。Fig. 26 is an exploded view of a fifth embodiment of the jamming device of the present application.
具体实施方式Detailed ways
下面详细描述本申请的实施方式,所述实施方式的示例在附图中示出,其中自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。下面通过参考附图描述的实施方式是示例性的,仅用于解释本申请,而不能理解为对本申请的限制。在本申请的描述中,需要理解的是,术语“第一”、“第二”仅用于描述,而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量或排列顺序。由此,限定有“第一”、“第二”的技术特征可以明示或者隐含地包括一个或者更多个所述技术特征。在本申请的描述中,“多个”的含义是两个或两个以上,除非另有明确具体的限定。Embodiments of the present application are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary, are only for explaining the present application, and should not be construed as limiting the present application. In the description of the present application, it should be understood that the terms "first" and "second" are only used for description, and cannot be interpreted as indicating or implying relative importance or implicitly indicating the quantity or arrangement of indicated technical features order. Therefore, the technical features defined as "first" and "second" may explicitly or implicitly include one or more of said technical features. In the description of the present application, "plurality" means two or more, unless otherwise specifically defined.
在本申请的描述中,需要说明的是,除非另有明确的规定或限定,术语“安装”、“相连”、“连接”应做广义理解,例如,可以是固定连接,也可以是可拆卸连接,或一体化连接;可以是机械连接,也可以是电连接或相互通信;可以是直接相连,也可以通过中间媒介间接相连,可以是两个元件内部的连通或两个元件之间的相互作用关系。另外,术语“垂直”、“横向”、“纵向”、“前”、“后”、“左”、“右”、“上”、“下”、“水平”等指示方位或位置关系为基于附图所示的方位或位置关系,仅仅是为了便于描述本申请,而不是意味着所指的装置或元件必须具有特有的方位或位置,因此不能理解为对本申请的限制。对于本领域的普通技术人员而言,可以根据具体情况理解上述术语在本申请中的具体含义。In the description of this application, it should be noted that unless otherwise specified or limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection. Connection, or integrated connection; it can be mechanical connection, electrical connection or mutual communication; it can be direct connection or indirect connection through an intermediary, and it can be the internal communication of two components or the mutual communication between two components role relationship. In addition, the terms "vertical", "transverse", "longitudinal", "front", "rear", "left", "right", "upper", "lower", "horizontal", etc. indicate an orientation or positional relationship based on The orientations or positional relationships shown in the drawings are only for the convenience of describing the present application, and do not mean that the devices or components referred to must have specific orientations or positions, so they should not be construed as limitations on the present application. Those of ordinary skill in the art can understand the specific meanings of the above terms in this application according to specific situations.
下文的公开提供了许多不同的实施方式或示例用来实现本申请的不同结构。为了简化本申请的公开,下文仅对特定例子的部件和设定进行描述。当然,它们仅仅为示例,并且目的不在于限制本申请。此外,本申请可以在不同例子中重复使用参考数字和/或参考字母,这种重复使用是为了简化和清楚地表述本申请,其本身不指示所讨论的各种实施方式和/或设定之间的特定关系。此外,本 申请在下文描述中所提供的各种特定的工艺和材料仅为实现本申请技术方案的示例,但是本领域普通技术人员应该意识到本申请的技术方案也可以通过下文未描述的其他工艺和/或其他材料来实现。The following disclosure provides many different implementations or examples for implementing different structures of the present application. In order to simplify the disclosure of the present application, only components and settings of specific examples are described below. Of course, they are examples only and are not intended to limit the application. In addition, the present application may repeat reference numerals and/or reference letters in different instances. Such repetition is for simplicity and clarity of presentation of the present application and is not in itself indicative of the various embodiments and/or settings discussed. specific relationship between them. In addition, the various specific processes and materials provided in the following description of the present application are only examples for realizing the technical solution of the present application, but those of ordinary skill in the art should realize that the technical solution of the present application can also be realized through other methods not described below. process and/or other materials.
进一步地,所描述的特征、结构可以以任何合适的方式结合在一个或更多实施方式中。在下文的描述中,提供许多具体细节以便能够充分理解本申请的实施方式。然而,本领域技术人员应意识到,即使没有所述特定细节中的一个或更多,或者采用其它的结构、组元等,也可以实践本申请的技术方案。在其它情况下,不详细示出或描述公知结构或者操作以避免模糊本申请之重点。Furthermore, the described features and structures may be combined in any suitable manner in one or more embodiments. In the following description, numerous specific details are provided so that the embodiments of the present application can be fully understood. However, those skilled in the art should appreciate that the technical solutions of the present application can be practiced without one or more of the specific details, or with other structures, components, and the like. In other instances, well-known structures or operations are not shown or described in detail to avoid obscuring the key points of the application.
首先,本申请主要提供一种新式结构的干扰装置,所述新式结构的干扰装置的壳体外部一侧具有第一容置槽,所述第一容置槽用于放置电子设备于其中,所述干扰装置的壳体内部具有收容空间,所述收容空间用于收容所述干扰装置的电子元器件。例如,所述收容空间具有第二容置槽,所述第二容置槽位于所述第一容置槽的旁侧,与所述第一容置槽相连通。所述干扰装置的干扰信号发生模块放置在所述第二容置槽中。所述干扰信号发生模块用于朝所述第一容置槽出射第一信号,以对所述电子设备进行干扰。所述电子设备例如但不限于为手机。First of all, the present application mainly provides a jamming device with a new structure. The outer side of the shell of the jamming device with a new structure has a first accommodating groove, and the first accommodating groove is used to place electronic equipment therein. The interior of the casing of the interference device has a storage space, and the storage space is used to accommodate electronic components of the interference device. For example, the accommodating space has a second accommodating groove, and the second accommodating groove is located at a side of the first accommodating groove and communicates with the first accommodating groove. The interference signal generating module of the interference device is placed in the second accommodation slot. The interference signal generating module is used for emitting a first signal toward the first accommodation slot to interfere with the electronic equipment. The electronic device is, for example but not limited to, a mobile phone.
例如但不局限地,所述第一信号包括至少二频率不同的第一声波信号,所述至少二频率不同的第一声波信号经混频后能够产生可被人耳听到的第二声波信号,从而,能够对放置于所述第一容置槽中的电子设备进行音频干扰。所述第一声波信号例如为不能被人耳可听见的声波信号。For example, but not limited to, the first signal includes at least two first sound wave signals with different frequencies, and the at least two first sound wave signals with different frequencies can generate a second sound wave that can be heard by human ears after being mixed. The sound wave signal, therefore, can perform audio interference on the electronic equipment placed in the first accommodating slot. The first sound wave signal is, for example, a sound wave signal that cannot be heard by human ears.
上述新式结构的干扰装置,不仅能够满足客制化的需求,而且能够对特定的电子设备进行干扰,实现防窃录防窃听的功能。The interference device with the above-mentioned new structure can not only meet the needs of customization, but also can interfere with specific electronic equipment, so as to realize the function of anti-tampering and anti-eavesdropping.
其次,本申请还提供一种具有检测模块的干扰装置,所述检测模块用于检测所述干扰装置的第一容置槽中是否放置有电子设备,而当检测到所述第一容置槽中放置有电子设备时,所述干扰装置的处理模块根据所述检测模块的检测结果对应控制干扰信息发生模块发出第一信号。Secondly, the present application also provides an interference device with a detection module, the detection module is used to detect whether electronic equipment is placed in the first accommodating slot of the interference device, and when the first accommodating slot is detected When an electronic device is placed in the device, the processing module of the interference device correspondingly controls the interference information generation module to send a first signal according to the detection result of the detection module.
由于所述干扰装置具有所述检测模块,所述干扰信息发生模块在所述检测 模块检测到所述第一容置槽中放置有电子设备时才开始发射第一信号,因此,可以降低所述干扰装置的功耗,另外,也可以延长所述干扰信息发生模块的寿命。Since the interference device has the detection module, the interference information generation module starts to emit the first signal only when the detection module detects that an electronic device is placed in the first accommodating slot, therefore, the In addition, the power consumption of the interference device can also prolong the life of the interference information generating module.
对于上述的新式结构的干扰装置和具有检测模块的干扰装置,本申请分别记载了多种产品的实现方式,下面分别对本申请干扰装置的各种具体实现方式进行描述。For the above-mentioned jamming device with a new structure and the jamming device with a detection module, this application respectively records the implementation of various products. The following describes various specific implementations of the jamming device of this application.
请一并参阅图1至图11,图1为本申请提供的干扰装置的第一实施方式的立体结构示意图,图2为图1所示的干扰装置的爆炸图,图3为图2所示干扰装置的上壳的外侧结构示意图,图4为图2所示干扰装置的上壳的内侧结构示意图,图5为图2所示干扰装置的下壳的背面结构示意图,图6为图2所示干扰装置的干扰信号发生模块的立体结构示意图,图7为图2所示干扰装置的干扰信号发生模块的爆炸图,图8为图2所示干扰装置的干扰信号发生模块的另一角度的立体结构示意图,图9为图2所示干扰装置的部分结构一角度的示意图,图10为图2所示干扰装置的部分结构另一角度的示意图,图11为图1所示干扰装置的第一容置槽中放置有电子设备的示意图。所述干扰装置1包括壳体10和干扰信号发生模块20。所述壳体10内部具有收容空间11,所述壳体10外部一侧具有第一容置槽12。所述第一容置槽12与所述收容空间11之间相连通,其中,所述第一容置槽12用于放置电子设备A。所述干扰信号发生模块20设置在所述收容空间11中。所述干扰信号发生模块20用于发出第一信号到所述第一容置槽12中,以对所述电子设备A进行干扰。所述电子设备A例如但不局限为手机等。Please refer to Figures 1 to 11 together. Figure 1 is a schematic diagram of the three-dimensional structure of the first embodiment of the interference device provided by this application. Figure 2 is an exploded view of the interference device shown in Figure 1. Figure 4 is a schematic diagram of the inner structure of the upper shell of the jamming device shown in Figure 2, Figure 5 is a schematic diagram of the back structure of the lower shell of the jamming device shown in Figure 2, and Figure 6 is a schematic diagram of the structure shown in Figure 2. Fig. 7 is an exploded view of the jamming signal generating module of the jamming device shown in Fig. 2, and Fig. 8 is another perspective view of the jamming signal generating module of the jamming device shown in Fig. 2 Figure 9 is a schematic diagram of a part of the structure of the interference device shown in Figure 2 from one angle, Figure 10 is a schematic diagram of another angle of the partial structure of the interference device shown in Figure 2, and Figure 11 is a schematic diagram of the first angle of the interference device shown in Figure 1 A schematic diagram of an electronic device placed in an accommodating slot. The interference device 1 includes a housing 10 and an interference signal generating module 20 . The housing 10 has a receiving space 11 inside, and the housing 10 has a first receiving groove 12 on its outer side. The first accommodating slot 12 communicates with the accommodating space 11 , wherein the first accommodating slot 12 is used for placing the electronic device A. As shown in FIG. The interference signal generating module 20 is arranged in the accommodation space 11 . The interference signal generating module 20 is used for sending a first signal into the first accommodating slot 12 to interfere with the electronic device A. As shown in FIG. The electronic device A is, for example but not limited to, a mobile phone and the like.
在某些实施例中,所述第一信号例如包括至少两个不同频率的第一声波信号,所述至少两个不同频率的第一声波信号经过混频后能够产生被人耳可听见的第二声波信号。经过混频后产生的能被人耳可听见的第二声波信号用于对所述电子设备A进行音频干扰。所述第一声波信号例如为不能被人耳可听见的声波信号。具体地,所述第一声波信号例如但不局限为超声波等合适的声波信号。然,可变更地,所述第一声波信号例如也可为能被人耳可听见的声波信号。In some embodiments, the first signal includes, for example, at least two first sound wave signals of different frequencies, and the at least two first sound wave signals of different frequencies can be audible to human ears after being mixed. of the second acoustic signal. The second sound wave signal audible to the human ear generated after mixing is used for audio interference to the electronic device A. The first sound wave signal is, for example, a sound wave signal that cannot be heard by human ears. Specifically, the first sound wave signal is, for example but not limited to, an appropriate sound wave signal such as an ultrasonic wave. However, alternatively, the first sound wave signal may also be, for example, a sound wave signal audible by human ears.
另外,所述干扰信号发生模块20产生的第一信号也并不局限于第一声波信号,也可为其它合适的信号,例如电磁波信号等,只要能够对所述电子设备A进行干扰,实现防窃听防窃录的功能,均应落在本申请的保护范围。In addition, the first signal generated by the interference signal generating module 20 is not limited to the first sound wave signal, and can also be other suitable signals, such as electromagnetic wave signals, as long as it can interfere with the electronic device A and realize The functions of anti-eavesdropping and anti-tampering should all fall within the scope of protection of this application.
需要说明的是,在本申请中,主要以所述第一信号为第一声波信号为例进行说明,但不应理解为对本申请的局限。It should be noted that, in the present application, the description is mainly made by taking the first signal as the first acoustic wave signal as an example, but it should not be understood as a limitation to the present application.
由于本申请的干扰装置1的壳体10具有所述第一容置槽12,且所述第一容置槽12与所述壳体10内部的收容空间11相连通,因此,位于所述收容空间11中的干扰信号发生模块20能够出射第一信号到所述第一容置槽12中,用以对所述第一容置槽12中的电子设备A进行音频干扰,从而使得所述电子设备A录音时都录到是噪声,或者,电子设备A被远程窃听时也无法听到现场交谈的语音信号。Since the casing 10 of the interference device 1 of the present application has the first accommodating groove 12, and the first accommodating groove 12 communicates with the accommodating space 11 inside the casing 10, it is located in the accommodating The interference signal generation module 20 in the space 11 is capable of emitting a first signal into the first accommodating slot 12 for audio interference to the electronic device A in the first accommodating slot 12, so that the electronic device A Noise is recorded when equipment A is recording, or the voice signal of the on-site conversation cannot be heard when electronic equipment A is remotely eavesdropped.
需要说明的是,所述干扰装置1并不会影响第一容置槽12中的电子设备A的正常电话接入,接通时需要使用者拿起电子设备A方可进行正常通话。It should be noted that the interference device 1 will not affect the normal call access of the electronic device A in the first accommodating slot 12 , and the user needs to pick up the electronic device A to make a normal call when connected.
可选的,所述壳体10在围成所述第一容置槽12的相对两侧的侧壁132上设置有凹陷部B。所述第一容置槽12通过所述凹陷部B与所述壳体10旁侧外界连通。然,在某些其它实施方式中,所述凹陷部B的数量也可为一个,即在其中一个侧壁132上设置凹陷部B。Optionally, the housing 10 is provided with a recessed portion B on the sidewalls 132 surrounding opposite sides of the first accommodating groove 12 . The first accommodating groove 12 communicates with the outside of the casing 10 through the concave portion B. However, in some other embodiments, the number of the recessed portion B may also be one, that is, the recessed portion B is provided on one of the side walls 132 .
所述侧壁132能够对所述电子设备A进行阻挡,使得电子设备A收容于所述第一容置槽12中,所述凹陷部B方便使用者能够随时观察电子设备A是否被放入第一容置槽12内进行防窃听窃录处理,避免遗漏的问题,另外,也可以方便使用者能够随时观察电子设备A的状态。The side wall 132 can block the electronic device A, so that the electronic device A is accommodated in the first accommodating groove 12, and the recessed part B is convenient for the user to observe whether the electronic device A is placed in the first accommodating groove 12 at any time. An anti-eavesdropping and stealing process is performed in the accommodating slot 12 to avoid the problem of omission. In addition, it is also convenient for the user to observe the status of the electronic device A at any time.
可选的,所述凹陷部B位于每侧侧壁132的中部位置,且设置有凹陷部B的侧壁132位于所述壳体10在宽度方向上的相对两侧。进一步可选的,所述侧壁132的高度从两端向中部逐渐递减。Optionally, the recessed portion B is located in the middle of each side wall 132 , and the side walls 132 provided with the recessed portion B are located on opposite sides of the housing 10 in the width direction. Further optionally, the height of the side wall 132 gradually decreases from both ends to the middle.
在某些实施方式中,所述壳体10的收容空间11中包括第二容置槽110,所述第二容置槽110的数量至少为一个,且设置在所述第一容置槽12在长度方向上的旁侧。所述第一容置槽12与所述第二容置槽110相连通。所述干扰信号 发生模块20发出的第一信号从所述第二容置槽110出射到所述第一容置槽12中。In some embodiments, the receiving space 11 of the housing 10 includes a second receiving groove 110, the number of the second receiving groove 110 is at least one, and the second receiving groove 110 is arranged in the first receiving groove 12 sideways in the length direction. The first accommodating groove 12 communicates with the second accommodating groove 110 . The first signal sent by the interference signal generating module 20 is emitted from the second accommodating groove 110 into the first accommodating groove 12.
较佳地,所述第二容置槽110在高度方向上高出所述第一容置槽12的底面F1,所述底面F1为所述壳体10的一侧表面,用于承载所述电子设备A。Preferably, the second accommodating groove 110 is higher than the bottom surface F1 of the first accommodating groove 12 in the height direction, and the bottom surface F1 is a side surface of the housing 10 for carrying the electronic equipment a.
在本实施方式中,所述干扰信号发生模块20设置在所述第二容置槽110中,且所述干扰信号发生模块20用于出射第一信号的一侧面对所述第一容置槽12。In this embodiment, the interference signal generation module 20 is arranged in the second accommodation slot 110, and the side of the interference signal generation module 20 for emitting the first signal faces the first accommodation slot. 12.
可选的,所述收容空间11包括两个所述第二容置槽110,分别设置在所述第一容置槽12在长度方向上的相对两侧,每一所述第二容置槽110中分别设置一所述干扰信号发生模块20。然,可变更地,在某些实施方式中,所述干扰信号发生模块20中用于出射第一信号的干扰信号发生器201也可不设置在所述第二容置槽110中,例如但不限于,如本申请的第五实施例所记载的技术方案。又如,所述干扰信号发生模块20全部不放在所述第二容置槽110中,所述第二容置槽110是被节省的,如此,也是可以的。Optionally, the accommodating space 11 includes two second accommodating grooves 110, which are respectively arranged on opposite sides of the first accommodating groove 12 in the length direction, each of the second accommodating grooves One of the interference signal generating modules 20 is set in 110 respectively. However, alternatively, in some implementations, the interference signal generator 201 used to emit the first signal in the interference signal generating module 20 may not be arranged in the second accommodation slot 110, for example, but not It is limited to the technical solution described in the fifth embodiment of the present application. As another example, all the interference signal generating modules 20 are not placed in the second accommodating slot 110 , and the second accommodating slot 110 is saved, so it is also possible.
由于在所述第一容置槽12的相对两侧分别设置所述第一容置槽110,从而可以增加第一信号出射的方向,能够多角度对电子设备A进行音频干扰,另外,也可使得使用者不局限于放置电子设备A的方向,提高使用者的使用感受。Since the first accommodating grooves 110 are respectively arranged on the opposite sides of the first accommodating groove 12, the direction in which the first signal emerges can be increased, and audio interference can be performed on the electronic device A from multiple angles. In addition, it is also possible to The user is not limited to the direction in which the electronic device A is placed, and the user experience is improved.
具体地,在本实施方式中,所述壳体10包括上壳13和下壳14。所述上壳13和所述下壳14相配合形成所述收容空间11。所述上壳13背对所述下壳14的一侧上方形成所述第一容置槽12。Specifically, in this embodiment, the housing 10 includes an upper shell 13 and a lower shell 14 . The upper shell 13 and the lower shell 14 cooperate to form the receiving space 11 . The first accommodating groove 12 is formed above a side of the upper shell 13 facing away from the lower shell 14 .
可选的,所述上壳13包括基板131、侧壁132、和顶板133。所述基板131包括第一表面F1和第二表面F2。其中,所述第一表面F1为所述基板131的外表面,所述外表面背对所述下壳14。所述第二表面F2为所述基板131的内表面,所述内表面面对所述下壳14。所述侧壁132位于所述基板131的周边、且在背对所述下壳14的方向上高出所述第一表面F1。所述顶板133位于所述基板131的至少一侧,且在背对所述下壳14的方向上高出所述第一表面F1,所述顶板133与所述侧壁132相连接。其中,所述基板131背对所述下壳14的一侧形成所述第一容置槽12。所述顶板133朝向所述下壳14的一侧形成所述第 二容置槽110。Optionally, the upper shell 13 includes a base plate 131 , a side wall 132 , and a top plate 133 . The substrate 131 includes a first surface F1 and a second surface F2. Wherein, the first surface F1 is an outer surface of the substrate 131 , and the outer surface faces away from the lower shell 14 . The second surface F2 is an inner surface of the substrate 131 , and the inner surface faces the lower case 14 . The side wall 132 is located at the periphery of the base plate 131 and is higher than the first surface F1 in a direction facing away from the lower case 14 . The top plate 133 is located on at least one side of the base plate 131 and is higher than the first surface F1 in a direction facing away from the lower shell 14 , and the top plate 133 is connected to the side wall 132 . Wherein, the side of the base plate 131 facing away from the lower case 14 forms the first accommodating groove 12 . The second accommodating groove 110 is formed on a side of the top plate 133 facing the lower shell 14 .
在本实施方式中,所述基板131、侧壁132、和顶板133为一体结构。In this embodiment, the base plate 131 , the side wall 132 , and the top plate 133 are integrally structured.
可选的,所述上壳13的侧壁132包括内侧壁1321与外侧壁1322,所述外侧壁1322位于所述内侧壁1321的外围。所述内侧壁1321从所述基板131上沿背对所述下壳14的方向向上延伸出来。其中,所述基板131的第一表面F1与所述内侧壁1321围成所述第一容置槽12。所述顶板133连接于所述内侧壁1321与所述外侧壁1322之间。所述顶板133、所述外侧壁1322以及所述内侧壁1321围成所述第二容置槽110。Optionally, the side wall 132 of the upper shell 13 includes an inner side wall 1321 and an outer side wall 1322 , and the outer side wall 1322 is located at a periphery of the inner side wall 1321 . The inner wall 1321 extends upward from the base plate 131 in a direction away from the lower case 14 . Wherein, the first accommodating groove 12 is surrounded by the first surface F1 of the substrate 131 and the inner wall 1321 . The top plate 133 is connected between the inner wall 1321 and the outer wall 1322 . The top plate 133 , the outer sidewall 1322 and the inner sidewall 1321 enclose the second accommodating groove 110 .
可选的,所述外侧壁1322包括相连接的第一部分B1与第二部分B2。其中,所述第一部分B1为在背对所述下壳14的方向上高出所述第一表面F1的部分,所述第二部分B2为在面对所述下壳14的方向高出所述第二表面F2的部分。所述第二部分B2用于与所述下壳14相配合以形成所述收容空间11。所述第一部分B1用于与所述顶板133、所述基板131相配合以形成所述第一容置槽12和所述第二容置槽110。在此实施方式中,进一步可选的,所述下壳14对应没有侧壁。当然,所述下壳14也可对应设置有侧壁。Optionally, the outer side wall 1322 includes a connected first portion B1 and a second portion B2. Wherein, the first part B1 is a part that is higher than the first surface F1 in the direction facing away from the lower case 14, and the second part B2 is a part that is higher than the first surface F1 in the direction facing the lower case 14. Part of the second surface F2. The second portion B2 is used to cooperate with the lower shell 14 to form the receiving space 11 . The first portion B1 is used to cooperate with the top plate 133 and the base plate 131 to form the first receiving groove 12 and the second receiving groove 110 . In this embodiment, further optionally, the lower case 14 has no side walls. Of course, the lower case 14 may also be provided with side walls correspondingly.
然,可变更地,在某些实施例中,所述外侧壁1322不具有所述第二部分B2,所述下壳14对应设置有朝所述上壳13方向延伸出来的侧壁149,以与所述上壳13相配合形成所述收容空间11。例如,参见第三实施例所记载的技术方案。However, alternatively, in some embodiments, the outer side wall 1322 does not have the second portion B2, and the lower shell 14 is correspondingly provided with a side wall 149 extending toward the upper shell 13, so as to Cooperate with the upper shell 13 to form the receiving space 11 . For example, refer to the technical solution described in the third embodiment.
可选的,在本实施例中,所述第一容置槽12与所述第二容置槽110之间设置的内侧壁1321上设有开口K,以使得所述第一容置槽12与所述第二容置槽110相连通。所述干扰信号发生模块20曝露在所述开口K处,所述干扰信号发生模块20上设置有隔板202,所述隔板202包括用于出射第一信号的多个通孔K1。从而,所述干扰信号发生模块20出射的第一信号能够从所述第二容置槽110出射到所述第一容置槽12中。Optionally, in this embodiment, an opening K is provided on the inner wall 1321 provided between the first accommodating groove 12 and the second accommodating groove 110, so that the first accommodating groove 12 It communicates with the second accommodating groove 110 . The interference signal generating module 20 is exposed at the opening K, and the interference signal generating module 20 is provided with a partition 202, and the partition 202 includes a plurality of through holes K1 for emitting the first signal. Therefore, the first signal emitted by the interference signal generating module 20 can be emitted from the second accommodating groove 110 into the first accommodating groove 12 .
然,可变更地,在其它实施例中,所述内侧壁1321上具有多个通孔K1,所述干扰信号发生模块20设置在所述内侧壁1321的后方,所述干扰信号发生 模块20上可不设置具有多个通孔K1的隔板202,例如,参见第三实施例所记载的技术方案。However, alternatively, in other embodiments, the inner side wall 1321 has a plurality of through holes K1, the interference signal generating module 20 is arranged behind the inner side wall 1321, and the interference signal generating module 20 The partition plate 202 having a plurality of through holes K1 may not be provided, for example, refer to the technical solution described in the third embodiment.
可选的,所述第二容置槽110中设置定位柱1101,用于与所述干扰信号发生模块20上的定位孔208相配合,并通过螺丝209穿过所述定位孔208之后与所述定位柱1101中的锁孔相配合,从而实现使得所述干扰信号发生模块20固定在所述第二容置槽110中。Optionally, a positioning column 1101 is provided in the second accommodation groove 110 for matching with the positioning hole 208 on the interference signal generating module 20 , and is connected to the positioning hole 208 through the screw 209 . The locking holes in the positioning posts 1101 are matched with each other, so that the interference signal generating module 20 is fixed in the second accommodating groove 110 .
可选的,所述干扰信号发生模块20包括至少二干扰信号发生器201和隔板202。所述干扰信号发生器201用于发出所述第一信号,例如但不局限地,所述干扰信号发生器201用于将电信号转换为第一声波信号,所述第一声波信号为具有预设频率的声波信号。所述预设频率例如但不限于为40到40.3KHZ频率范围内的任意一数值。所述隔板202具有多个通孔K1。所述隔板202曝露在所述开口K处。所述第一信号通过所述隔板202上的多个通孔K1出射到所述第一容置槽12中。Optionally, the interference signal generating module 20 includes at least two interference signal generators 201 and a partition 202 . The interference signal generator 201 is used to send out the first signal, for example but not limited to, the interference signal generator 201 is used to convert an electrical signal into a first sound wave signal, and the first sound wave signal is Acoustic signal with preset frequency. The preset frequency is, for example but not limited to, any value within the frequency range of 40 to 40.3 KHZ. The separator 202 has a plurality of through holes K1. The separator 202 is exposed at the opening K. The first signal exits into the first accommodating groove 12 through the plurality of through holes K1 on the partition 202 .
在本实施例中,每一干扰信号发生模块20均包括四个所述干扰信号发生器201,用于分别发出频率不同的第一声波信号。所述第一声波信号例如但不限于为超声波信号。所述干扰信号发生器201例如但不局限为超声波换能器。然,可变更地,在其它实施例中,所述干扰信号发生器201的数量也可为两个、三个、五个、甚至更多个。另外,所述干扰信号发生器201产生的第一信号也并不局限于第一声波信号,也可为其它合适的信号,例如电磁波信号等,只要能够对所述电子设备A进行干扰,实现防窃听防窃录的功能,均应落在本申请的保护范围。在本申请中,主要以所述第一信号为第一声波信号为例进行说明,但不应理解为对本申请的局限。In this embodiment, each interference signal generating module 20 includes four interference signal generators 201 for respectively emitting first acoustic signals with different frequencies. The first acoustic signal is, for example but not limited to, an ultrasonic signal. The interference signal generator 201 is, for example but not limited to, an ultrasonic transducer. However, alternatively, in other embodiments, the number of the interference signal generators 201 may also be two, three, five, or even more. In addition, the first signal generated by the interference signal generator 201 is not limited to the first sound wave signal, and can also be other suitable signals, such as electromagnetic wave signals, as long as it can interfere with the electronic device A to realize The functions of anti-eavesdropping and anti-tampering should all fall within the scope of protection of this application. In the present application, the description is mainly made by taking the first signal as the first acoustic wave signal as an example, but it should not be understood as a limitation of the present application.
基于声波混频技术,通过四个干扰信号发生器201发送频率为F1、F2、F3、F4的第一声波信号,频率为F1、F2、F3、F4的第一声波信号为人耳不可听见的声波信号,这四个第一声波信号在电子设备A的麦克风电路处会产生混频效应,生成频率为|F1-F2|、|F1-F3|、|F1-F4|、|F2-F3|、|F2-F4|、|F3-F4|的第二声波信号,频率为|F1-F2|、|F1-F3|、|F1-F4|、|F2-F3|、|F2-F4|、|F3-F4|的第二声波信 号为人耳可听见的声波信号,电子设备A会将此声波信号录制下来,而真正语音交谈的内容会被屏蔽,有效地保护个人隐私。Based on the sound wave mixing technology, the first sound wave signals with frequencies F1, F2, F3, and F4 are sent through four interference signal generators 201, and the first sound wave signals with frequencies F1, F2, F3, and F4 are inaudible to human ears The sound wave signals, these four first sound wave signals will produce a mixing effect at the microphone circuit of electronic device A, and the generated frequencies are |F1-F2|, |F1-F3|, |F1-F4|, |F2- The second acoustic signal of F3|, |F2-F4|, |F3-F4|, the frequency is |F1-F2|, |F1-F3|, |F1-F4|, |F2-F3|, |F2-F4 |, |F3-F4| The second sound wave signal is the sound wave signal audible to the human ear, and the electronic device A will record the sound wave signal, and the content of the real voice conversation will be shielded, effectively protecting personal privacy.
在本申请中,采用两个干扰信号发生模块20、每个干扰信号发生模块20分别包括四个干扰信号发生器201,分别同时发出四个频率不同的第一声波信号到所述第一容置槽12中,在电子设备A的麦克风电路处产生混频效应后会生成能够被人耳可听见的多个频率不同的第二声波信号,如此对电子设备A的音频干扰效果较好。In this application, two interference signal generation modules 20 are used, and each interference signal generation module 20 includes four interference signal generators 201, respectively, and simultaneously send four first acoustic wave signals with different frequencies to the first container. Placed in the slot 12, after the mixing effect is generated at the microphone circuit of the electronic device A, multiple second sound wave signals with different frequencies that can be heard by the human ear will be generated, so that the audio interference effect on the electronic device A is better.
具体一并参阅图6至图8,可选的,所述干扰信号发生模块20进一步包括副板205、定位架203、和纱网204。所述至少二干扰信号发生器201设置在所述副板205上,与所述副板205电连接。所述副板205例如但不局限为印刷电路板。所述定位架203上包括至少二穿孔K2。每一干扰信号发生器201设置在所述定位架203的穿孔K2中。所述定位架203位于所述隔板202背对所述第一容置槽12的一侧。所述纱网204设置在所述隔板202与所述定位架203之间。Specifically refer to FIGS. 6 to 8 . Optionally, the interference signal generating module 20 further includes a sub-board 205 , a positioning frame 203 , and a gauze 204 . The at least two interference signal generators 201 are disposed on the sub-board 205 and electrically connected to the sub-board 205 . The sub-board 205 is, for example but not limited to, a printed circuit board. The positioning frame 203 includes at least two through holes K2. Each interference signal generator 201 is disposed in the through hole K2 of the positioning frame 203 . The positioning frame 203 is located on a side of the partition 202 facing away from the first accommodating slot 12 . The gauze 204 is disposed between the separator 202 and the positioning frame 203 .
所述干扰信号发生模块20为一独立的模块结构,安装与拆卸方便。所述隔板202采用金属材质,外观效果较好。所述定位架203和所述纱网204不仅可以让使用者不能直接观看到所述干扰信号发生器201以及副板205等内部结构,而且还可以起到防尘、美观等作用。The interference signal generating module 20 is an independent module structure, which is easy to install and disassemble. The separator 202 is made of metal, which has a better appearance. The positioning frame 203 and the gauze 204 not only prevent the user from viewing the internal structure of the interference signal generator 201 and the sub-board 205 directly, but also play the role of dustproof and beautiful.
在某些实施方式中,所述隔板202、定位架203、纱网204中的一者或几者是可以被省略的。In some embodiments, one or more of the separator 202, the positioning frame 203, and the gauze 204 can be omitted.
进一步可选的,在本实施例中,所述干扰信号发生器201用于出射所述第一信号的一侧均正对所述第一容置槽12设置。Further optionally, in this embodiment, the sides of the interference signal generator 201 for emitting the first signal are all set facing the first accommodation groove 12 .
然,可变更地,在某些其它实施例中,所述干扰信号发生器201用于出射所述第一信号的一侧也可朝所述第一容置槽12沿长度方向的中心线L-L’(参见图17)倾斜,其倾斜角度的范围例如但不局限为15度到30度。如此能够增加第一信号的辐射范围,防止死角,另外,第一信号叠加,也可以增大第一信号的幅度,第一信号的能量更集中。可选的,所述倾斜角度例如为15度。即,所述干扰信号发生器201沿高度方向的中心线L1-L1’(参见图17)与所述第一容置槽 12沿长度方向的中心线L-L’之间锐角夹角为15度。例如,参见图17所示的技术方案。需要说明的是,为了更好地示出倾斜角度,所述第一容置槽12沿长度方向的中心线L-L’为进行了相应的平移。However, alternatively, in some other embodiments, the side of the interference signal generator 201 for emitting the first signal may also face the center line L of the first accommodation groove 12 along the length direction. -L' (see FIG. 17 ) is inclined, and the range of the inclination angle thereof is, for example but not limited to, 15 degrees to 30 degrees. In this way, the radiation range of the first signal can be increased to prevent dead spots. In addition, the superposition of the first signal can also increase the amplitude of the first signal, and the energy of the first signal is more concentrated. Optionally, the inclination angle is, for example, 15 degrees. That is, the acute angle between the central line L1-L1' of the interference signal generator 201 along the height direction (see FIG. 17 ) and the center line LL' of the first accommodation groove 12 along the length direction is 15°. Spend. For example, refer to the technical solution shown in FIG. 17 . It should be noted that, in order to better illustrate the inclination angle, the center line L-L' of the first accommodation groove 12 along the length direction is translated accordingly.
可选的,所述上壳13在所述第一表面F1上进一步包括凹槽135。所述凹槽135内设置支撑结构136。所述支撑结构136用于对放置于所述第一容置槽12中的电子设备A起到支撑或/和防滑作用。Optionally, the upper case 13 further includes a groove 135 on the first surface F1. A supporting structure 136 is disposed in the groove 135 . The supporting structure 136 is used to support or/and prevent slippage of the electronic device A placed in the first accommodating slot 12 .
所述支撑结构136包括支撑垫1361。可选的,所述支撑垫1361上形成有缝隙。所述缝隙例如能够通过所述第一声波信号,从而实现对电子设备A各个方向的麦克风进行音频干扰。所述支撑垫1361为麦芒结构(参见图22)或橡胶垫,所述麦芒结构上的缝隙或所述橡胶垫上的缝隙能够通过所述第一信号。所述麦芒结构例如呈阵列排布,所述第一信号的通过效果会较好,从而达到对电子设备A的更好干扰效果。所述麦芒结构对所述电子设备A起支撑平衡的作用,适合具有不同底部形态(如后置镜头凸出或不凸出)的电子设备A。所述麦芒结构具有摩擦力,对录音设备具有辅助固定的作用。The support structure 136 includes support pads 1361 . Optionally, gaps are formed on the support pad 1361 . For example, the gap can pass the first sound wave signal, so as to implement audio interference to the microphones in all directions of the electronic device A. The support pad 1361 is a wheat awn structure (see FIG. 22 ) or a rubber pad, and the first signal can pass through the gaps on the wheat awn structure or the rubber pad. The wheat awn structures are arranged in an array, for example, so that the passing effect of the first signal will be better, so as to achieve a better interference effect on the electronic device A. The awn structure supports and balances the electronic device A, and is suitable for electronic devices A with different bottom shapes (such as protruding rear lens or not protruding). The wheat awn structure has frictional force and can assist in fixing the recording equipment.
进一步可选的,所述凹槽135的数量为两个,分别设置在所述第一表面F1上的两端。Further optionally, the number of the grooves 135 is two, which are respectively arranged at two ends of the first surface F1.
例如但不局限地,所述基板131的中部区域上未设置有所述凹槽135的部分的厚度与所述基板131上设置有所述凹槽135的区域的厚度相同。For example but not limited to, the thickness of the part of the central region of the substrate 131 not provided with the groove 135 is the same as the thickness of the region of the substrate 131 provided with the groove 135 .
可选的,所述干扰装置1进一步包括无线充电模块40,用于对电子设备A进行无线充电。Optionally, the interference device 1 further includes a wireless charging module 40 for wirelessly charging the electronic device A.
可选的,所述基板131的第二表面F2上在未设置所述凹槽135的中部区域上设置有第三容置槽134,用以收容所述无线充电模块40的线圈401于其中。从而使得所述干扰装置1的结构紧凑,厚度更薄。Optionally, a third accommodating groove 134 is provided on the second surface F2 of the substrate 131 in the middle area where the groove 135 is not provided, for accommodating the coil 401 of the wireless charging module 40 therein. Therefore, the interference device 1 has a compact structure and a thinner thickness.
在本实施例中,所述基板131的第二表面F2上进一步形成有多个第一定位柱Z1和多个第二定位柱Z2。所述多个第二定位柱Z2位于所述第二表面F2上的中部区域。所述多个第一定位柱Z1位于所述第二表面F2的两端区域。其中,所述多个第一定位柱Z1的高度小于所述多个第二定位柱Z2的高度。所述多个 第一定位柱Z1具有锁孔K3。所述下壳14上设置有多个通孔142。当所述上壳13与所述下壳14进行安装时,通过螺丝145穿入所述下壳14上的通孔142并与所述锁孔K3进行锁紧固定。In this embodiment, a plurality of first positioning posts Z1 and a plurality of second positioning posts Z2 are further formed on the second surface F2 of the substrate 131 . The plurality of second positioning posts Z2 are located in the middle area of the second surface F2. The plurality of first positioning columns Z1 are located at two end regions of the second surface F2. Wherein, the height of the plurality of first positioning columns Z1 is smaller than the height of the plurality of second positioning columns Z2. The plurality of first positioning posts Z1 have locking holes K3. A plurality of through holes 142 are disposed on the lower shell 14 . When the upper shell 13 and the lower shell 14 are installed, the screws 145 are inserted into the through holes 142 on the lower shell 14 and locked and fixed with the locking hole K3.
可选的,所述下壳14面对所述上壳13的一侧表面上形成有凸起143。当所述下壳14与所述上壳13安装在一起时,所述多个第一定位柱Z1与所述多个第二定位柱Z2均与所述凸起143相抵触,且在所述下壳14的通孔142的上方形成有限位槽144。所述限位槽144的开孔孔径大于所述下壳14的通孔142的孔径。所述限位槽144用于收容所述第一定位柱Z1的端部。Optionally, a protrusion 143 is formed on a surface of the lower shell 14 facing the upper shell 13 . When the lower shell 14 and the upper shell 13 are installed together, the plurality of first positioning columns Z1 and the plurality of second positioning columns Z2 are in conflict with the protrusion 143 , and the A limiting slot 144 is formed above the through hole 142 of the lower shell 14 . The hole diameter of the limiting groove 144 is larger than the hole diameter of the through hole 142 of the lower shell 14 . The limiting groove 144 is used for receiving the end of the first positioning post Z1.
进一步可选的,所述下壳14上背对所述上壳13的一侧设置有凹槽(图未示)。所述下壳14上的通孔142贯穿至所述凹槽。所述凹槽中设置有防滑垫146,用以当所述干扰装置1平放到桌面等物体上时起到防滑作用。Further optionally, a groove (not shown) is provided on the side of the lower shell 14 facing away from the upper shell 13 . The through hole 142 on the lower shell 14 runs through to the groove. An anti-slip pad 146 is provided in the groove to prevent slippage when the interference device 1 is placed flat on a tabletop or the like.
在本实施例中,所述干扰装置1进一步包括主板30,位于所述上壳13与所述下壳14之间,所述主板30与副板205电连接,用于驱动所述干扰信号发生模块20发出第一信号。所述主板30的边缘区域上包括多个通孔300。所述多个第一定位柱Z1与所述多个第二定位柱Z2用于分别穿过所述主板30上的通孔300并与所述下壳14相抵触。In this embodiment, the interference device 1 further includes a main board 30, located between the upper case 13 and the lower case 14, the main board 30 is electrically connected to the sub-board 205, and is used to drive the interference signal to generate Module 20 sends out a first signal. The edge area of the main board 30 includes a plurality of through holes 300 . The plurality of first positioning posts Z1 and the plurality of second positioning posts Z2 are respectively used to pass through the through holes 300 on the main board 30 and interfere with the lower case 14 .
可选的,所述基板131的第二表面F2上进一步形成有多个卡位结构138,位于所述多个第二定位柱Z2的外围,所述卡位结构138用于对所述主板30进行固定。Optionally, a plurality of snapping structures 138 are further formed on the second surface F2 of the base plate 131, located on the periphery of the plurality of second positioning columns Z2, and the snapping structures 138 are used for positioning the main board 30. to fix.
例如但不局限地,所述卡位结构138为凸起结构,且远离所述基板131的一端形成有卡勾G,所述卡勾G用于将所述主板30卡扣固定在所述基板131上。For example, but not limited to, the locking structure 138 is a protruding structure, and a hook G is formed at an end away from the base plate 131, and the hook G is used to buckle and fix the main board 30 on the base plate. 131 on.
在本实施例中,所述干扰装置1的长度例如为不大于22厘米,宽度例如不大于12厘米。所述干扰装置1例如仅能够对单一手机进行干扰。换句话说,所述干扰装置1同时只能对一部手机进行干扰。然,可变更地,在其它实施方式中,所述干扰装置1也可为其它合适尺寸以及能够对多个电子设备进行干扰的装置。In this embodiment, the length of the interference device 1 is, for example, not greater than 22 centimeters, and the width is, for example, not greater than 12 centimeters. The interference device 1 can only interfere with a single mobile phone, for example. In other words, the interference device 1 can only interfere with one mobile phone at the same time. However, alternatively, in other implementation manners, the jamming device 1 may also be a device with other suitable dimensions and capable of jamming a plurality of electronic devices.
本申请的上述干扰装置1为全新结构的干扰装置,其能够放置电子设备A于其上,并能够对电子设备A进行干扰,实现不同的客制化需求,且能够对特定的电子设备A进行干扰,实现防窃录防窃听的功能。The above-mentioned interference device 1 of the present application is a interference device with a brand-new structure, which can place electronic equipment A on it, and can interfere with electronic equipment A, so as to realize different customization requirements, and can conduct specific electronic equipment A Interference, realize the function of anti-eavesdropping and anti-eavesdropping.
需要说明的是,本申请的上述全新结构的干扰装置1并不限于上述具体实施方式记载的样态,也可具有其它变更样式,只要对于本领域的一般技术人员而言,其根据本申请记载的技术内容而能够容易想到的各种实施方式的技术方案均应落在本申请的保护范围。It should be noted that the interference device 1 with the above-mentioned brand-new structure of the present application is not limited to the aspects described in the above-mentioned specific embodiments, and may also have other modified forms, as long as those of ordinary skill in the art understand it according to the aspects described in the application. The technical solutions of various implementations that can be easily conceived based on the technical content should fall within the protection scope of the present application.
发明人通过大量的分析与研究发现,所述干扰装置1的干扰信号发生器201若长期处于工作状态,一方面会造成功耗损失,另一方面也会造成干扰信号发生器201的寿命缩短等技术问题。更进一步地,使用者也不清楚电子设备A被放置到第一容置槽12中之后,是否在执行干扰功能。基于此,发明人创造性地提出进一步的解决方案,在所述干扰装置1中新增检测模块50。所述检测模块50设置在所述收容空间11中,用于检测所述第一容置槽12中是否放置有电子设备A。所述干扰装置1的处理模块302根据所述检测模块50的检测结果来对应控制所述干扰信号发生模块20是否开始工作,即,是否开始发射第一信号到所述第一容置槽12中。The inventor found through a lot of analysis and research that if the interference signal generator 201 of the interference device 1 is in the working state for a long time, it will cause power consumption loss on the one hand, and shorten the life of the interference signal generator 201 on the other hand. technical problem. Furthermore, the user does not know whether the electronic device A is performing the interference function after being placed in the first receiving slot 12 . Based on this, the inventor creatively proposes a further solution, adding a detection module 50 to the interference device 1 . The detecting module 50 is arranged in the receiving space 11 and is used for detecting whether the electronic device A is placed in the first receiving slot 12 . The processing module 302 of the interference device 1 correspondingly controls whether the interference signal generation module 20 starts to work according to the detection result of the detection module 50, that is, whether to start transmitting the first signal into the first accommodating slot 12 .
具体地,当所述检测模块50检测到所述第一容置槽12中放置有电子设备A时,所述检测模块50输出相应的检测信号给到所述处理模块302,所述干扰信号发生模块20则在所述处理模块302的驱动控制下开始发射第一信号到所述第一容置槽12中。可选的,当所述检测模块50未检测到所述第一容置槽12中放置有电子设备A时,所述干扰信号发生模块20则不工作。从而,所述干扰装置1不仅功耗降低,而且寿命能够延长。另外,也可在所述干扰装置1中新增指示模块60,当所述检测模块50检测到所述第一容置槽12中放置有电子设备A时,所述处理模块302对应控制所述指示模块60发出相应提示,使得使用者能够明确知道所述干扰装置1处于音频干扰状态。Specifically, when the detection module 50 detects that the electronic device A is placed in the first accommodating slot 12, the detection module 50 outputs a corresponding detection signal to the processing module 302, and the interference signal occurs The module 20 starts to emit a first signal into the first accommodating slot 12 under the driving control of the processing module 302 . Optionally, when the detection module 50 does not detect that the electronic device A is placed in the first accommodating slot 12, the interference signal generation module 20 does not work. Therefore, the interference device 1 not only reduces power consumption, but also prolongs its lifespan. In addition, an indication module 60 may also be added to the interference device 1, and when the detection module 50 detects that the electronic device A is placed in the first accommodating slot 12, the processing module 302 controls the corresponding The indication module 60 issues a corresponding prompt, so that the user can clearly know that the interference device 1 is in an audio interference state.
请进一步结合参阅图12,图12为本申请的干扰装置1一实施方式的结构框图。所述处理模块302包括处理单元3021,所述处理单元3021与所述检测 模块50连接,用于在接收到所述检测信号时对应发出第二信号给到所述干扰信号发生模块20,以控制所述干扰信号发生模块20发出所述第一信号。在本实施例中,所述处理单元3021发出四个频率分别为F1、F2、F3、F4的第二信号,所述第二信号例如为方波信号。所述频率F1、F2、F3、F4彼此不同。然,可变更地,在其它实施例中,所述处理单元3021也可发出两个、三个、五个、或更多个频率不同的第二信号。可变更地,所述第二信号也可为正弦波信号等合适信号,本申请对此并不做限定。Please further refer to FIG. 12 . FIG. 12 is a structural block diagram of an embodiment of the interference device 1 of the present application. The processing module 302 includes a processing unit 3021, and the processing unit 3021 is connected to the detection module 50, and is configured to correspondingly send a second signal to the interference signal generation module 20 when receiving the detection signal, so as to control The interference signal generating module 20 sends out the first signal. In this embodiment, the processing unit 3021 sends out four second signals with frequencies F1, F2, F3, and F4 respectively, and the second signals are, for example, square wave signals. The frequencies F1, F2, F3, F4 are different from each other. However, alternatively, in other embodiments, the processing unit 3021 may also send out two, three, five, or more second signals with different frequencies. Alternatively, the second signal may also be a suitable signal such as a sine wave signal, which is not limited in this application.
可选的,所述处理单元3021包括处理器或振荡电路中的任意一种或几种,所述处理器或所述振荡电路用于产生所述四个频率不同的第二信号。不管是通过软件还是硬件、又或者软硬件相结合的方式,只要能够产生多个频率不同的第二信号的所有技术方案均应落在本申请的保护范围,而并不局限于此处所记载的处理器或振荡电路。Optionally, the processing unit 3021 includes any one or more of a processor or an oscillating circuit, and the processor or the oscillating circuit is configured to generate the four second signals with different frequencies. Regardless of whether it is through software or hardware, or a combination of software and hardware, as long as all technical solutions that can generate multiple second signals with different frequencies should fall within the scope of protection of this application, they are not limited to the ones described here. processor or oscillator circuit.
可选的,所述处理模块302进一步包括驱动单元3022,所述驱动单元3022连接在所述处理单元3021与所述干扰信号发生模块20之间,用于对所述四个频率不同的第二信号进行放大,并输出放大后的第二信号给所述干扰信号发生模块20,以驱动所述干扰信号发生模块20输出所述四个频率不同的第一信号到所述第一容置槽12中。Optionally, the processing module 302 further includes a driving unit 3022, and the driving unit 3022 is connected between the processing unit 3021 and the interference signal generating module 20, and is used for processing the four second signals with different frequencies. The signal is amplified, and the amplified second signal is output to the interference signal generation module 20, so as to drive the interference signal generation module 20 to output the four first signals with different frequencies to the first accommodation tank 12 middle.
所述主板30包括电路板301、处理模块302、充电接口303、无线充电驱动电路304、电容检测电路305、和电源管理模块306。所述充电接口303位于所述电路板301面对所述上壳13的一端上。所述处理模块302、无线充电驱动电路304、电容检测电路305、和电源管理模块306位于所述电路板301背对所述上壳13的一侧表面上。然,本申请并不对所述电路板301上的元件的位置进行限定,例如,所述处理模块302也可位于所述电路板301面对所述上壳13的一侧表面上。The motherboard 30 includes a circuit board 301 , a processing module 302 , a charging interface 303 , a wireless charging drive circuit 304 , a capacitance detection circuit 305 , and a power management module 306 . The charging interface 303 is located on an end of the circuit board 301 facing the upper case 13 . The processing module 302 , the wireless charging drive circuit 304 , the capacitance detection circuit 305 , and the power management module 306 are located on the surface of the circuit board 301 facing away from the upper case 13 . However, the present application does not limit the positions of the components on the circuit board 301 , for example, the processing module 302 may also be located on the side surface of the circuit board 301 facing the upper case 13 .
需要进一步说明的是,所述处理模块302、无线充电驱动电路304、电容检测电路305、和电源管理模块306等在图2与图10中仅采用方框示意,而并不是实际的产品形态。It should be further explained that the processing module 302 , wireless charging drive circuit 304 , capacitance detection circuit 305 , and power management module 306 are only shown as blocks in FIG. 2 and FIG. 10 , rather than actual product forms.
所述检测模块50包括检测电极501和所述电容检测电路305。所述检测电极501用于与所述电子设备A之间形成检测电容。可选的,所述检测电极501设置在所述上壳13的内表面上。所述电容检测电路305用于驱动所述检测电极501执行电容感测。例如但不局限地,所述检测模块50通过自电容或互电容的检测方式来实现电容感测。所述电子设备A的外壳是金属时,金属可以与所述检测电极501相作用以形成检测电容,当电子设备A的外壳不是金属时,电子设备A内的导体与所述检测电极501相作用,形成检测电容。The detection module 50 includes a detection electrode 501 and the capacitance detection circuit 305 . The detection electrode 501 is used to form a detection capacitor with the electronic device A. Optionally, the detection electrode 501 is disposed on the inner surface of the upper case 13 . The capacitance detection circuit 305 is used to drive the detection electrodes 501 to perform capacitance sensing. For example but without limitation, the detection module 50 implements capacitive sensing by means of self-capacitance or mutual-capacitance detection. When the shell of the electronic device A is metal, the metal can interact with the detection electrode 501 to form a detection capacitor; when the shell of the electronic device A is not metal, the conductor in the electronic device A interacts with the detection electrode 501 , forming a sense capacitance.
所述检测电极501例如但布局于采用贴附等固定的方式设置在所述上壳13的内表面上。所述检测电极501例如但不局限于为铜片等合适的导电材料。所述检测电极501例如通过导线连接到所述电容检测电路305。The detection electrodes 501 are, for example, arranged on the inner surface of the upper case 13 in a fixed manner such as sticking. The detection electrode 501 is, for example but not limited to, a suitable conductive material such as copper sheet. The detection electrode 501 is connected to the capacitance detection circuit 305 through wires, for example.
通过采用上述电容式的检测方式,能够比较容易检测到所述电子设备A且检测精度较高,另外,也不需要对所述壳体10的材质进行特别的选择,只要所述壳体10的材质是绝缘的即可。By adopting the above-mentioned capacitive detection method, the electronic device A can be detected relatively easily and the detection accuracy is high. In addition, there is no need to specially select the material of the housing 10, as long as the material of the housing 10 The material is insulating.
然,发明人通过大量的实验与研究分析发现,所述导线在产品安装以及产品使用等时容易发生断裂,造成影响产品的品质稳定性等技术问题,进而发明人创造性提出新的技术方案。采用将所述检测电极501制作在软性电路板502上,所述软性电路板502设置有检测电极501的一端设置在所述上壳13的内表面上,所述软性电路板502的另一端连接到所述主板30面对所述下壳14一侧的电容检测电路305上。所述软性电路板502在产品安装以及产品使用等过程中比较稳定,不易发生断裂等技术问题,从而能够使得所述干扰装置1的品质稳定性得到提升。However, the inventor found through a large number of experiments and research analysis that the wires are prone to breakage during product installation and product use, causing technical problems such as affecting the quality stability of the product, and then the inventor creatively proposed a new technical solution. The detection electrode 501 is manufactured on a flexible circuit board 502, and one end of the flexible circuit board 502 provided with the detection electrode 501 is disposed on the inner surface of the upper case 13, and the flexible circuit board 502 The other end is connected to the capacitance detection circuit 305 on the side of the motherboard 30 facing the lower case 14 . The flexible circuit board 502 is relatively stable during the process of product installation and product use, and is not prone to technical problems such as breakage, so that the quality stability of the interference device 1 can be improved.
所述无线充电模块40包括所述线圈401和所述无线充电驱动电路304。所述无线充电驱动电路304与线圈401电连接,二者相配合以实现对电子设备A实现无线充电。所述无线充电模块40在所述干扰装置1中也可以被省略。The wireless charging module 40 includes the coil 401 and the wireless charging driving circuit 304 . The wireless charging drive circuit 304 is electrically connected to the coil 401 , and the two cooperate to realize wireless charging for the electronic device A. The wireless charging module 40 can also be omitted in the interference device 1 .
所述处理模块302与所述干扰信号发生模块20、检测模块50、电源管理模块306、指示模块60分别电连接。所述电源管理模块306与所述充电接口303、所述检测模块50、所述无线充电模块40分别电连接。所述电源管理模块306 通过所述充电接口303接收来自外部的电源电压,并转换接收到的外部的电源电压为第一电源电压。所述电源管理模块306在工作时提供所述第一电源电压给所述处理单元3021,并在所述处理单元3021接收到所述检测信号时开始提供第二电源电压给所述驱动单元3022,以使得所述驱动单元3022开始工作。所述第一电源电压例如但不局限为3.3V,所述第二电源电压例如但不局限为12V。The processing module 302 is electrically connected to the interference signal generating module 20 , the detecting module 50 , the power management module 306 and the indicating module 60 respectively. The power management module 306 is electrically connected to the charging interface 303 , the detection module 50 and the wireless charging module 40 respectively. The power management module 306 receives an external power supply voltage through the charging interface 303, and converts the received external power supply voltage into a first power supply voltage. The power management module 306 provides the first power supply voltage to the processing unit 3021 during operation, and starts to provide the second power supply voltage to the driving unit 3022 when the processing unit 3021 receives the detection signal, So that the drive unit 3022 starts to work. The first power supply voltage is, for example but not limited to, 3.3V, and the second power supply voltage is, for example but not limited to, 12V.
当所述检测模块50未检测到所述第一容置槽12中有放置电子设备A时,所述电源管理模块306则不输出所述第二电源电压给所述驱动单元3022。从而可以实现节省功耗的目的。When the detection module 50 does not detect that the electronic device A is placed in the first accommodating slot 12 , the power management module 306 does not output the second power supply voltage to the driving unit 3022 . Therefore, the purpose of saving power consumption can be achieved.
所述电源管理模块306还用于提供第三电源电压给所述无线充电驱动电路304。所述第三电源电压例如但不局限于12V。The power management module 306 is also configured to provide a third power supply voltage to the wireless charging drive circuit 304 . The third power supply voltage is, for example but not limited to, 12V.
可选的,所述指示模块60包括第一指示单元601和第二指示单元602。所述第一指示单元601和第二指示单元602例如但不局限为LED灯、显示屏等合适的指示元件。在本实施例中,所述第一指示单元601为电源指示灯,所述第二指示单元602为工作指示灯。当所述电源管理模块306接通外部的电源电压时,所述第一指示单元601为红灯亮起,而当所述无线充电模块40工作时,所述第一指示单元601由红灯切换为蓝灯,即由第一指示状态(例如但不局限于为红灯)切换为第二指示状态(例如但不局限于为蓝灯)。Optionally, the indication module 60 includes a first indication unit 601 and a second indication unit 602 . The first indicating unit 601 and the second indicating unit 602 are, for example but not limited to, appropriate indicating elements such as LED lamps and display screens. In this embodiment, the first indicating unit 601 is a power indicator light, and the second indicating unit 602 is a working indicator light. When the power management module 306 is connected to the external power supply voltage, the first indicator unit 601 is turned on with a red light, and when the wireless charging module 40 is working, the first indicator unit 601 is switched by a red light It is a blue light, that is, it switches from the first indication state (such as but not limited to a red light) to the second indication state (such as but not limited to a blue light).
所述第二指示单元602在所述处理单元3021接收到所述检测模块50的检测信号后而发出第三指示状态,例如但不局限于为绿灯。而当所述检测模块50未检测到所述第一容置槽12中放置有电子设备A时,所述第二指示单元602例如但不局限为处于熄灭状态或者红灯等的第四指示状态。After the processing unit 3021 receives the detection signal from the detection module 50, the second indication unit 602 sends out a third indication state, such as but not limited to a green light. When the detection module 50 does not detect that the electronic device A is placed in the first accommodating slot 12, the second indication unit 602 is, for example but not limited to, in a fourth indication state such as an off state or a red light. .
通过设置所述指示模块60,并通过所述处理模块302根据所述检测模块50的检测结果来对应控制所述指示模块60发出相应的指示状态,从而使得使用者能明确清楚所述干扰装置1的各种工作状态。By setting the indication module 60 and correspondingly controlling the indication module 60 to issue a corresponding indication status according to the detection result of the detection module 50 through the processing module 302, the user can clearly understand the interference device 1 various working states.
可选的,所述指示模块60设置在一所述信号干扰发生模块20的副板205上,所述指示模块60与干扰信号发生器201分别设置在所述副板205的相对两 侧。所述指示模块60邻近所述充电接口303设置,所述上壳13在对应所述指示模块60和所述充电接口303的位置上分别设置有开孔K10。Optionally, the indicator module 60 is arranged on a sub-board 205 of the signal interference generating module 20, and the indicator module 60 and the interference signal generator 201 are respectively arranged on opposite sides of the sub-board 205. The indicating module 60 is disposed adjacent to the charging interface 303 , and the upper case 13 is respectively provided with openings K10 at positions corresponding to the indicating module 60 and the charging interface 303 .
由于本申请的干扰装置1进一步新增了检测模块50,并在所述检测模块50检测到所述第一容置槽12中放置有电子设备A时,所述干扰装置1的干扰信号发生模块20例如开始发出四个不同频率的第一声波信号到第一容置槽12中,以对所述电子设备A进行音频干扰,实现防窃录防窃听的功能。如此,不仅能节省功耗,还可以达到提升产品寿命等目的。Since the interference device 1 of the present application further adds a detection module 50, and when the detection module 50 detects that the electronic device A is placed in the first accommodating slot 12, the interference signal generation module of the interference device 1 20, for example, start to send four first sound wave signals of different frequencies into the first accommodating slot 12, so as to perform audio interference on the electronic device A, so as to realize the function of anti-tampering and anti-eavesdropping. In this way, not only power consumption can be saved, but also the purpose of improving product life can be achieved.
上述增加所述检测模块50的检测技术方案并不局限于应用于上述新式结构的干扰装置1中,还可应用到其它实施方式或其它结构的干扰装置中,例如,干扰装置的壳体的收容空间并不包括用于收容干扰信号发生模块的第二容置槽,干扰装置包括另一个独立的收容空间用于收容干扰信号发生模块,如此结构的干扰装置都可新增此检测模块50的检测技术方案。因此,只要基于本申请的核心技术思想,对于本领域的一般技术人员容易想到的所有变更实施方式均应落入本申请的保护范围。The detection technical solution of adding the detection module 50 above is not limited to be applied to the interference device 1 of the above-mentioned new structure, and can also be applied to interference devices of other implementations or other structures, for example, the housing of the interference device The space does not include the second accommodating slot for accommodating the interference signal generation module, and the interference device includes another independent accommodation space for accommodating the interference signal generation module, and the interference device with such a structure can add the detection module 50 Technical solutions. Therefore, as long as it is based on the core technical ideas of the present application, all modified implementations that are easily conceived by those skilled in the art shall fall within the protection scope of the present application.
请继续参阅图12,可选的,所述干扰装置1进一步包括充电电池70,所述充电电池70例如设置在所述主板30与所述下壳14之间。所述充电电池70能够存储电能,从而,当没有外接外部的电源电压时,可以采用充电电池70进行供电。Please continue to refer to FIG. 12 , optionally, the interference device 1 further includes a rechargeable battery 70 , for example, the rechargeable battery 70 is disposed between the main board 30 and the lower case 14 . The rechargeable battery 70 can store electrical energy, so when there is no external power supply voltage, the rechargeable battery 70 can be used for power supply.
请参阅图13,图13为所述干扰装置1的另一实施方式的结构框图。与图12的实施方式的主要区别在于:在此实施方式中,所述干扰装置1并不包括检测模块50。相应地,所述干扰装置1在工作时,所述电源管理模块306持续提供第一电源电压给处理单元3201,持续提供第二电源电压给驱动单元3022,如此,也是可以的。图13与图12的实施方式相同或相似部分的工作关系部分在此不再赘述。Please refer to FIG. 13 , which is a structural block diagram of another embodiment of the interference device 1 . The main difference from the embodiment in FIG. 12 is that in this embodiment, the interference device 1 does not include a detection module 50 . Correspondingly, when the interference device 1 is working, the power management module 306 continuously provides the first power supply voltage to the processing unit 3201 and continuously provides the second power supply voltage to the driving unit 3022 , so it is also possible. 13 is the same as or similar to the working relationship of the implementation in FIG. 12 and will not be repeated here.
请参阅图14至图17,图14为本申请的干扰装置的第二实施方式的立体结构示意图。图15为图14所述干扰装置的爆炸结构示意图。图16为所述干扰装置的上壳的立体结构示意图。图17为干扰信号发生模块的部分结构示意图。所 述干扰装置2与所述干扰装置1的主要结构相同,二者相同或相似部分在此不再赘述,下面主要描述二者主要的区别之处。Please refer to FIG. 14 to FIG. 17 . FIG. 14 is a schematic perspective view of the second embodiment of the interference device of the present application. Fig. 15 is a schematic diagram of the exploded structure of the jamming device shown in Fig. 14 . Fig. 16 is a schematic perspective view of the upper shell of the interference device. Fig. 17 is a partial structural diagram of the interference signal generating module. The main structure of the interference device 2 is the same as that of the interference device 1, the same or similar parts of the two will not be repeated here, and the main differences between the two will be described below.
第一,检测模块50为红外检测模块。所述红外检测模块设置在收容空间11中,用于出射红外线到所述第一容置槽12中,并接收由所述第一容置槽12中返回的红外线,以检测所述第一容置槽12中是否放置有电子设备A。处理模块(未标示)用于根据所述红外检测模块输出的检测结果对应控制干扰信号发生模块20是否发出第一信号到所述第一容置槽12中。First, the detection module 50 is an infrared detection module. The infrared detection module is arranged in the accommodation space 11, and is used for emitting infrared rays into the first accommodation groove 12, and receiving the infrared rays returned from the first accommodation groove 12, so as to detect the first accommodation groove 12. Whether electronic equipment A is placed in slot 12. The processing module (not marked) is used for correspondingly controlling whether the interference signal generating module 20 sends a first signal to the first accommodating slot 12 according to the detection result output by the infrared detection module.
当所述红外检测模块检测到所述第一容置槽12中放置有电子设备A时,所述红外检测模块发出相应的检测信号到所述处理模块,所述处理模块根据所述检测信号对应控制所述干扰信号发生模块20开始发出所述第一信号到所述第一容置槽12中,以对所述第一容置槽12中的电子设备A进行干扰。When the infrared detection module detects that the electronic device A is placed in the first accommodating slot 12, the infrared detection module sends a corresponding detection signal to the processing module, and the processing module corresponds to the detection signal according to the detection signal. The interference signal generating module 20 is controlled to start sending the first signal into the first accommodating slot 12 to interfere with the electronic device A in the first accommodating slot 12 .
可选的,所述壳体10上在对应所述红外检测模块的区域设置有红外透射板139。例如但不局限地,所述上壳13的中部区域设置有所述红外透射板139。所述红外透射板139能够透射红外线。可选的,所述红外检测模块例如包括红外发射装置(未标示)和红外接收装置(未标示)。所述红外发射装置发射的红外线通过所述红外透射板139出射到所述第一容置槽12中,所述红外接收装置透过所述红外透射板139接收从所述第一容置槽12中返回的红外线,并转换接收到的红外线为相应的电信号,以检测所述第一容置槽12中是否放置有电子设备A。Optionally, an infrared transmissive plate 139 is disposed on the housing 10 in a region corresponding to the infrared detection module. For example but not limited to, the infrared transmissive plate 139 is disposed in the middle area of the upper case 13 . The infrared transmissive plate 139 can transmit infrared rays. Optionally, the infrared detection module includes, for example, an infrared emitting device (not shown) and an infrared receiving device (not shown). The infrared emitted by the infrared emitting device is emitted into the first accommodating groove 12 through the infrared transmissive plate 139, and the infrared receiving device receives the infrared rays from the first accommodating groove 12 through the infrared transmissive plate 139. return infrared rays, and convert the received infrared rays into corresponding electrical signals, so as to detect whether the electronic device A is placed in the first accommodating slot 12 .
第二,所述干扰装置2中用于收容无线充电模块40的线圈401的第三容置槽134设置在所述主板30上。可选的,所述第三容置槽134与所述红外透射板139正对。然,可变更地,所述第三容置槽134也可设置在所述上壳13的内表面一侧。Second, the third accommodating slot 134 for accommodating the coil 401 of the wireless charging module 40 in the interference device 2 is provided on the main board 30 . Optionally, the third accommodating groove 134 is opposite to the infrared transmission plate 139 . However, alternatively, the third accommodating groove 134 may also be disposed on one side of the inner surface of the upper shell 13 .
可选的,所述红外检测模块设置在所述无线充电模块40的线圈401面对所述红外透射板139的一侧表面上。例如,所述红外检测模块位于所述无线充电模块40的线圈401的中央位置。Optionally, the infrared detection module is disposed on a surface of the coil 401 of the wireless charging module 40 facing the infrared transmission plate 139 . For example, the infrared detection module is located at the center of the coil 401 of the wireless charging module 40 .
第三,干扰信号发生模块20并不具有定位架203和纱网204,且所述干扰信号发生器201用于出射第一声波信号的一侧朝第一容置槽12沿长度方向的中 心线L-L’倾斜,倾斜角度范围例如但不局限于15度至30度。所述倾斜角度例如可选为15度。即,所述干扰信号发生器201沿高度方向的中心线L1-L1’与所述第一容置槽12沿长度方向的中心线L-L’之间锐角夹角为15度。需要说明的是,为了更好地示出倾斜角度,所述第一容置槽12沿长度方向的中心线L-L’为进行了相应的平移。然而,干扰装置2的干扰信号发生模块20的结构可与干扰装置1的干扰信号发生模块20的结构也可完全相同。Third, the interference signal generating module 20 does not have a positioning frame 203 and a gauze 204, and the side of the interference signal generator 201 for emitting the first acoustic wave signal faces the center of the first accommodation groove 12 along the length direction. The line LL' is inclined, and the angle of inclination ranges from, for example but not limited to, 15° to 30°. The angle of inclination may be, for example, 15 degrees. That is, the acute angle between the center line L1-L1' of the interference signal generator 201 along the height direction and the center line L-L' of the first accommodation groove 12 along the length direction is 15 degrees. It should be noted that, in order to better illustrate the inclination angle, the center line L-L' of the first accommodation groove 12 along the length direction is translated accordingly. However, the structure of the interference signal generation module 20 of the interference device 2 may be exactly the same as that of the interference signal generation module 20 of the interference device 1 .
然,可变更地,所述干扰信号模块20也可采用干扰装置1中的干扰信号模块20的结构,也都是可以的。However, alternatively, the interference signal module 20 may also adopt the structure of the interference signal module 20 in the interference device 1, which is also possible.
请参阅图18至图22,图18为本申请的干扰装置的第三实施方式的立体结构示意图。图19为图18所示的干扰装置的爆炸结构示意图。图20为图18所示的干扰装置的上壳的立体结构示意图。图21为图18所示的干扰装置的助压板的结构示意图。图22为图18所示的干扰装置的支撑垫的结构示意图。所述干扰装置3与干扰装置1的结构大致相同,二者相同或相似之处在此不再赘述。下面主要描述二者的主要区别之处。Please refer to FIG. 18 to FIG. 22 . FIG. 18 is a schematic three-dimensional structure diagram of a third embodiment of the interference device of the present application. FIG. 19 is a schematic diagram of the exploded structure of the jamming device shown in FIG. 18 . FIG. 20 is a schematic perspective view of the three-dimensional structure of the upper case of the interference device shown in FIG. 18 . FIG. 21 is a schematic structural view of the pressure-assisting plate of the interference device shown in FIG. 18 . Fig. 22 is a schematic structural view of the support pad of the interference device shown in Fig. 18 . The structure of the interference device 3 is substantially the same as that of the interference device 1 , and the same or similarities between the two will not be repeated here. The main differences between the two are described below.
第一,在结构上,所述上壳13的内侧壁1321上并非设置所述开口K,而是设置所述多个通孔K1。干扰信号发生模块20设置在所述内侧壁1321后方。另外,所述外侧壁1322并不包括第二部分B2(见图3)。所述下壳14包括基体148以及从基体148周围朝所述上壳13方向延伸出来的侧壁149。所述下壳14的侧壁149与所述上壳13的外侧壁1322相匹配以形成所述收容空间11。First, structurally, the inner side wall 1321 of the upper shell 13 is not provided with the opening K, but with the plurality of through holes K1. The interference signal generating module 20 is arranged behind the inner wall 1321 . In addition, the outer wall 1322 does not include the second portion B2 (see FIG. 3 ). The lower shell 14 includes a base 148 and a sidewall 149 extending from the base 148 toward the upper shell 13 . The sidewall 149 of the lower shell 14 matches the outer wall 1322 of the upper shell 13 to form the receiving space 11 .
第二,检测模块50为机械式检测模块。所述机械式检测模块包括机械开关505,设置在所述主板30面对所述上壳13的一侧表面上。所述机械开关的数量至少为一个。在本实施例中,所述机械开关505的数量为两个。当然,所述机械开关505的数量也可为三个、四个、甚至更多个。Second, the detection module 50 is a mechanical detection module. The mechanical detection module includes a mechanical switch 505 disposed on a surface of the main board 30 facing the upper case 13 . The number of said mechanical switch is at least one. In this embodiment, the number of the mechanical switches 505 is two. Of course, the number of mechanical switches 505 can also be three, four, or even more.
第三,所述上壳13的凹槽135中形成有贯通至所述收容空间11的开孔K4,所述凹槽135中设置有支撑结构136,所述支撑结构136在面对所述开孔K4的位置设置有凸起T,所述凸起T用于当所述第一容置槽12中放置有电子设备A时来按压触发所述机械开关505。可选的,所述支撑结构136包括支撑垫1361 和助压板1362,所述助压板1362面对所述开孔K4的位置设置有所述凸起T。进一步可选的,所述机械开关505位于所述开孔K4中,并与所述凸起T具有预设间隔。Thirdly, an opening K4 penetrating to the accommodating space 11 is formed in the groove 135 of the upper shell 13, and a supporting structure 136 is arranged in the groove 135, and the supporting structure 136 faces the opening. A protrusion T is provided at the position of the hole K4, and the protrusion T is used to press and trigger the mechanical switch 505 when the electronic device A is placed in the first receiving slot 12 . Optionally, the support structure 136 includes a support pad 1361 and a pressure-assisting plate 1362, and the pressure-assisting plate 1362 is provided with the protrusion T at a position facing the opening K4. Further optionally, the mechanical switch 505 is located in the opening K4 and has a predetermined distance from the protrusion T. As shown in FIG.
第四,所述助压板1362在面对所述下壳14的一侧表面上进一步形成有四个定位柱Z5,所述凹槽135中形成有与所述四个定位柱Z5相配合的定位孔K5,通过螺丝1363穿过所述定位孔K5并与所述定位柱Z5中的锁孔进行锁定,从而将所述支撑结构136固定在所述凹槽135中。可选的,所述支撑结构136相对所述凹槽135可上下移动。Fourth, the pressure-assisting plate 1362 is further formed with four positioning columns Z5 on the side surface facing the lower shell 14, and the groove 135 is formed with positioning columns that match the four positioning columns Z5. Through the hole K5, a screw 1363 passes through the positioning hole K5 and locks with the lock hole in the positioning post Z5, so that the supporting structure 136 is fixed in the groove 135 . Optionally, the supporting structure 136 can move up and down relative to the groove 135 .
工作时,所述处理模块302根据所述机械开关505是否被所述凸起T按压触发来对应控制所述干扰信号发生模块20是否发出所述第一信号到所述第一容置槽12中。当所述机械开关505被所述助压板1362的凸起T按压触发,则所述检测模块50检测到所述第一容置槽12中放置有电子设备A,并发出相应的检测信号到所述处理模块302,所述处理模块302根据所述检测信号对应控制所述干扰信号发生模块20开始发出所述第一信号到所述第一容置槽12中,以对所述第一容置槽12中的电子设备A进行干扰。During operation, the processing module 302 correspondingly controls whether the interference signal generating module 20 sends the first signal to the first accommodating groove 12 according to whether the mechanical switch 505 is triggered by pressing the protrusion T . When the mechanical switch 505 is triggered by the protrusion T of the pressure-assisting plate 1362, the detection module 50 detects that the electronic device A is placed in the first accommodating slot 12, and sends a corresponding detection signal to the The processing module 302, the processing module 302 correspondingly controls the interference signal generating module 20 to start sending the first signal into the first accommodation slot 12 according to the detection signal, so as to control the first accommodation slot 12. Electronic device A in slot 12 interferes.
较佳地,所述支撑垫1361为麦芒结构,所述麦芒结构中的通道能够传输第一信号。所述麦芒结构例如但不局限为麦芒阵列结构。Preferably, the support pad 1361 is a wheat awn structure, and channels in the awn structure can transmit the first signal. The wheat awn structure is, for example but not limited to, a wheat awn array structure.
在此实施方式中,当所述电子设备A放置在所述第一容置槽12中时,所述凸起T对所述机械开关505的按压触发为正压触发。In this embodiment, when the electronic device A is placed in the first accommodating slot 12 , the pressing trigger of the protrusion T on the mechanical switch 505 is a positive pressure trigger.
请参阅图23至图25,图23为本申请的干扰装置的第四实施方式的立体结构示意图。图24为图22所示的干扰装置的爆炸结构示意图。图25为图23所示的干扰装置的上壳的立体结构示意图。所述干扰装置4与干扰装置1的结构大致相同,二者相同或相似之处在此不再赘述。下面主要描述二者的主要区别之处。Please refer to FIG. 23 to FIG. 25 . FIG. 23 is a schematic three-dimensional structure diagram of a fourth embodiment of the interference device of the present application. Fig. 24 is a schematic diagram of the exploded structure of the jamming device shown in Fig. 22 . FIG. 25 is a schematic perspective view of the upper shell of the interference device shown in FIG. 23 . The structure of the interference device 4 is substantially the same as that of the interference device 1 , and the same or similarities between the two will not be repeated here. The main differences between the two are described below.
第一,检测模块50为机械式检测模块。所述机械式检测模块包括机械开关505,设置在所述主板30面对所述上壳13的一侧表面上。所述机械开关505的数量至少为一个。在本实施例中,所述机械开关505的数量为四个。当然, 所述机械开关505的数量也可为两个、三个、甚至更多个。First, the detection module 50 is a mechanical detection module. The mechanical detection module includes a mechanical switch 505 disposed on a surface of the main board 30 facing the upper case 13 . The number of the mechanical switch 505 is at least one. In this embodiment, the number of the mechanical switches 505 is four. Certainly, the number of the mechanical switches 505 may also be two, three, or even more.
第二,所述上壳13在所述第一容置槽12的两端底部分别设置有开口K8,且在所述开口K8处一侧形成有转动连接于所述上壳13上的支撑结构136,所述支撑结构136覆盖所述开口K8。所述支撑结构136在面对所述下壳14的一侧表面上形成有凸起(图未示),所述凸起用于当所述第一容置槽12中放置有电子设备A时来按压触发所述机械开关505。Second, the upper shell 13 is respectively provided with openings K8 at the bottoms of both ends of the first accommodating groove 12, and a support structure rotatably connected to the upper shell 13 is formed on one side of the opening K8. 136. The support structure 136 covers the opening K8. The support structure 136 has a protrusion (not shown) formed on the side surface facing the lower case 14, and the protrusion is used for when the electronic device A is placed in the first accommodating groove 12. Pressing triggers the mechanical switch 505 .
可选的,所述支撑结构136包括支撑垫1361和助压板1362。所述助压板1362位于所述开口K8与所述支撑垫1361之间,并与所述上壳13转动连接。较佳地,所述助压板1362设置在所述开口K8处且与所述上壳13转动连接的方式为铰接,即转轴连接。所述助压板1362面对所述开口K8的位置设置有所述凸起,所述凸起用于当所述第一容置槽12中放置有电子设备A时来按压触发所述机械开关505。可选的,所述支撑垫1361用于对电子设备A起到支撑和/或防滑作用。较佳地,所述支撑垫1361为麦芒结构,所述麦芒结构中的缝隙能够传输第一信号。所述麦芒结构例如但不局限为麦芒阵列结构。Optionally, the supporting structure 136 includes a supporting pad 1361 and a pressure-assisting plate 1362 . The pressure-assisting plate 1362 is located between the opening K8 and the support pad 1361 , and is rotatably connected with the upper shell 13 . Preferably, the pressure-assisting plate 1362 is disposed at the opening K8 and is rotatably connected to the upper shell 13 in a hinged connection, that is, a rotating shaft connection. The position of the pressure-assisting plate 1362 facing the opening K8 is provided with the protrusion, and the protrusion is used to press and trigger the mechanical switch 505 when the electronic device A is placed in the first accommodating slot 12 . Optionally, the support pad 1361 is used to support and/or prevent the electronic device A from slipping. Preferably, the support pad 1361 is a wheat awn structure, and the gaps in the awn structure can transmit the first signal. The wheat awn structure is, for example but not limited to, a wheat awn array structure.
工作时,所述处理模块302根据所述机械开关505是否被按压触发来对应控制所述干扰信号发生模块20是否发出所述第一信号到所述第一容置槽12中。当所述机械开关505被所述助压板1362的凸起按压触发,则所述检测模块50检测到所述第一容置槽12中放置有电子设备A,并发出相应的检测信号到所述处理模块302,所述处理模块302根据所述检测信号对应控制所述干扰信号发生模块20开始发出所述第一信号到所述第一容置槽12中,以对所述第一容置槽12中的电子设备A进行干扰。During operation, the processing module 302 correspondingly controls whether the interference signal generating module 20 sends the first signal to the first accommodating slot 12 according to whether the mechanical switch 505 is pressed and triggered. When the mechanical switch 505 is triggered by the protrusion of the pressure-assisting plate 1362, the detection module 50 detects that the electronic device A is placed in the first accommodating groove 12, and sends a corresponding detection signal to the The processing module 302, the processing module 302 correspondingly controls the interference signal generating module 20 to start sending the first signal into the first accommodation tank 12 according to the detection signal, so as to control the first accommodation tank 12 Electronic device A in 12 interferes.
在此实施方式中,当所述电子设备A放置在所述第一容置槽12中时,所述凸起T对所述机械开关505的按压触发为斜压触发,类似于铡刀的原理。In this embodiment, when the electronic device A is placed in the first accommodating slot 12 , the pressing trigger of the protrusion T on the mechanical switch 505 is a ramp trigger, which is similar to the principle of a guillotine.
请参阅图26,图26为本申请的干扰装置的第五实施方式的爆炸图。所述干扰装置5与干扰装置1的结构大致相同,二者相同或相似之处在此不再赘述。下面主要描述二者的主要区别之处。Please refer to FIG. 26 . FIG. 26 is an exploded view of a fifth embodiment of the interference device of the present application. The structure of the interference device 5 is substantially the same as that of the interference device 1 , and the same or similarities between the two will not be repeated here. The main differences between the two are described below.
第一,所述干扰信号发生模块20包括干扰信号发生器201、隔板202、以 及反射结构206,所述隔板202曝露在所述内侧壁1321的开口K处。所述反射结构206设置在所述第二容置槽110中,并位于所述隔板202的后方。First, the interference signal generating module 20 includes an interference signal generator 201, a partition 202, and a reflection structure 206, and the partition 202 is exposed at the opening K of the inner sidewall 1321. The reflective structure 206 is disposed in the second accommodating groove 110 and behind the partition 202 .
第二,所述干扰信号发生器201设置在所述主板30面对所述第二容置槽110的一端表面上。所述干扰信号发生器201发出第一信号到所述第二容置槽110中,经所述反射结构206的反射之后出射到所述第一容置槽12中。Second, the interference signal generator 201 is disposed on an end surface of the main board 30 facing the second accommodating slot 110 . The interference signal generator 201 sends a first signal into the second accommodating groove 110 , and is emitted into the first accommodating groove 12 after being reflected by the reflection structure 206 .
可选的,所述反射结构206具有倾斜部分2061,所述倾斜部分2061使得入射至其上的第一信号能够朝第一容置槽12出射出去。Optionally, the reflective structure 206 has an inclined portion 2061 , and the inclined portion 2061 enables the first signal incident thereon to be emitted toward the first accommodating groove 12 .
在本实施例中,在所述第二容置槽110中设置所述反射结构206,可以使得所述干扰信号发生器201设置在所述主板30上,所述反射结构206的高度可以小于所述干扰信号产生模块20的高度,因此,所述第二容置槽110的高度相应可以降低,从而,所述干扰装置5的整体厚度能够变薄。In this embodiment, setting the reflective structure 206 in the second accommodation groove 110 can make the interference signal generator 201 set on the main board 30, and the height of the reflective structure 206 can be smaller than the Therefore, the height of the second accommodating groove 110 can be reduced correspondingly, so that the overall thickness of the interference device 5 can be reduced.
在本申请上述的各实施例中,所描述的特征、结构可以以任何合适的方式结合在一个或更多实施方式中。对于本领域技术人员,其根据本申请上述记载的各实施例,可以容易想到将不同实施例的技术方案相结合而能够获得更多的实施例。例如,第三实施例的干扰装置3的壳体10结构也可应用到其它实施方式中。In the foregoing embodiments of the present application, the described features and structures may be combined in any suitable manner in one or more implementations. For those skilled in the art, based on the various embodiments described above in the present application, it is easy to imagine that more embodiments can be obtained by combining the technical solutions of different embodiments. For example, the structure of the housing 10 of the interference device 3 in the third embodiment can also be applied to other implementations.
需要再次说明的是,本申请的重点在于:It needs to be explained again that the focus of this application lies in:
第一,本申请提供一种新式结构的干扰装置1、2、3、4、5,本申请的干扰装置1、2、3、4、5的整体结构是现有技术中没有的;First, this application provides a new type of interference device 1, 2, 3, 4, 5. The overall structure of the interference device 1, 2, 3, 4, 5 of this application is not available in the prior art;
第二,本申请还提供一种具有检测模块50的干扰装置,而具有检测功能的干扰装置的结构并不限于我们本申请所记载的新式结构的干扰装置1、2、3、4、5,也可为其它合适结构的干扰装置,只要能够实现检测干扰装置上是否放置有电子设备A,并在检测到有放置电子设备A时,处理模块302开始控制干扰信号发生模块20发出第一信号,以对电子设备进行干扰的所有可实现的实施例均应落入本申请的保护范围。Second, the present application also provides a jamming device with a detection module 50, and the structure of the jamming device with a detection function is not limited to the jamming devices 1, 2, 3, 4, and 5 with new structures described in this application. It can also be an interference device with other suitable structures, as long as it can detect whether the electronic device A is placed on the interference device, and when the electronic device A is detected, the processing module 302 starts to control the interference signal generation module 20 to send the first signal, All practicable embodiments to interfere with electronic equipment shall fall within the scope of protection of this application.
在上述各实施例中,所述干扰装置1、2、3、4、5除了均可以采用声波干扰的方式对电子设备A实现防窃听防窃录的功能,还可以采用电磁干扰等其它 任何合适的干扰方式来对电子设备A实现防窃听防窃录的功能。因此,所述第一信号并不局限为第一声波信号,也可为电磁波信号等其它任何合适的信号。即,除了采用音频干扰的方式,也可通过采用电磁干扰等的方式,达到对电子设备A实现防窃听防窃录的效果。In each of the above-mentioned embodiments, the interference devices 1, 2, 3, 4, and 5 can not only implement the function of anti-eavesdropping and anti-tampering to the electronic equipment A by means of sound wave interference, but also can use any other suitable method such as electromagnetic interference. The anti-eavesdropping and anti-tampering function of the electronic device A is realized by means of interference. Therefore, the first signal is not limited to the first acoustic wave signal, but can also be any other suitable signal such as an electromagnetic wave signal. That is, in addition to audio interference, electromagnetic interference and the like can also be used to achieve the effect of anti-eavesdropping and anti-tampering on the electronic device A.
以上所述,仅为本申请较佳的具体实施方式,但本申请的保护范围并不局限于此,任何熟悉本技术领域的技术人员在本申请揭露的技术范围内,可轻易想到的变化或替换,都应涵盖在本申请的保护范围之内。因此,本申请的保护范围应该以权利要求的保护范围为准。The above is only a preferred embodiment of the present application, but the scope of protection of the present application is not limited thereto. Any person familiar with the technical field can easily conceive of changes or changes within the technical scope disclosed in this application Replacement should be covered within the protection scope of this application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims (37)

  1. 一种干扰装置,其特征在于,包括:An interference device, characterized in that it comprises:
    壳体,所述壳体内部具有收容空间,所述壳体外部一侧具有第一容置槽,所述第一容置槽与所述收容空间之间相连通,其中,所述第一容置槽用于放置电子设备;The casing has a receiving space inside the casing, and a first containing groove is formed on one side of the outside of the casing, and the first containing groove communicates with the containing space, wherein the first containing The slot is used to place electronic equipment;
    干扰信号发生模块,设置在所述收容空间中,所述干扰信号发生模块用于发出第一信号到所述第一容置槽中,以对所述电子设备进行干扰。An interference signal generating module is arranged in the accommodation space, and the interference signal generating module is used to send a first signal into the first accommodation slot to interfere with the electronic equipment.
  2. 如权利要求1所述的干扰装置,其特征在于,所述干扰信号发生模块发出的第一信号为第一声波信号,所述第一信号包括至少两个不同频率的第一声波信号,所述至少两个不同频率的第一声波信号经过混频后能够产生被人耳可听见的第二声波信号,所述第二声波信号用于对所述电子设备进行音频干扰。The interference device according to claim 1, wherein the first signal sent by the interference signal generating module is a first sound wave signal, and the first signal includes at least two first sound wave signals of different frequencies, The at least two first sound wave signals with different frequencies can be mixed to generate a second sound wave signal audible to human ears, and the second sound wave signal is used for audio interference to the electronic device.
  3. 如权利要求2所述的干扰装置,其特征在于,所述第一信号为超声波信号。The interference device according to claim 2, wherein the first signal is an ultrasonic signal.
  4. 如权利要求2所述的干扰装置,其特征在于,所述至少两个频率不同的第一声波信号为人耳不可听见的声波信号,经混频后能够产生被人耳可听见的第二声波信号。The interference device according to claim 2, wherein the at least two first sound wave signals with different frequencies are sound wave signals inaudible to human ears, and can generate second sound waves audible to human ears after mixing Signal.
  5. 如权利要求1所述的干扰装置,其特征在于,所述壳体在围成所述第一容置槽的相对两侧的侧壁上设置有凹陷部。The interference device according to claim 1, characterized in that, the housing is provided with recesses on the sidewalls surrounding opposite sides of the first accommodating groove.
  6. 如权利要求5所述的干扰装置,其特征在于,所述凹陷部位于每侧侧壁的中部位置,且设置有凹陷部的侧壁位于所述壳体在宽度方向上的相对两侧。The interference device according to claim 5, wherein the recessed portion is located at the middle of each side wall, and the side walls provided with the recessed portion are located at opposite sides of the housing in the width direction.
  7. 如权利要求1至6中任意一项所述的干扰装置,其特征在于,所述壳体的收容空间中包括第二容置槽,所述第二容置槽的数量至少为一个,且设置在所述第一容置槽在长度方向上的旁侧,所述第一容置槽与所述第二容置槽相连通,所述干扰信号发生模块发出的第一信号从所述第二容置槽出射到所述第一容置槽中。The interference device according to any one of claims 1 to 6, wherein the accommodation space of the housing includes a second accommodating groove, the number of the second accommodating groove is at least one, and On the side of the first accommodation groove in the length direction, the first accommodation groove communicates with the second accommodation groove, and the first signal sent by the interference signal generating module is transmitted from the second The accommodating groove projects into the first accommodating groove.
  8. 如权利要求7所述的干扰装置,其特征在于,所述第二容置槽在高度方 向上高出所述第一容置槽的底面,所述底面为所述壳体的一侧表面,用于承载所述电子设备。The interference device according to claim 7, wherein the second accommodating groove is higher than the bottom surface of the first accommodating groove in the height direction, and the bottom surface is a side surface of the housing, Used to carry the electronic equipment.
  9. 如权利要求8所述的干扰装置,其特征在于,所述干扰信号发生模块设置在所述第二容置槽中,且所述干扰信号发生模块用于出射第一信号的一侧面对所述第一容置槽。The interference device according to claim 8, wherein the interference signal generating module is arranged in the second accommodating groove, and the side of the interference signal generating module for emitting the first signal faces the The first storage tank.
  10. 如权利要求9所述的干扰装置,其特征在于,所述收容空间包括两个所述第二容置槽,分别设置在所述第一容置槽在长度方向上的相对两侧,每一所述第二容置槽中分别设置一所述干扰信号发生模块。The interference device according to claim 9, wherein the accommodation space includes two second accommodation grooves, which are respectively arranged on opposite sides of the first accommodation groove in the length direction, each One of the interference signal generating modules is respectively arranged in the second accommodating groove.
  11. 如权利要求7所述的干扰装置,其特征在于,所述壳体包括:The interference device according to claim 7, wherein the housing comprises:
    下壳;和lower shell; and
    上壳,用于与所述下壳相配合形成所述收容空间,所述上壳包括:The upper shell is used to cooperate with the lower shell to form the accommodation space, and the upper shell includes:
    基板,包括第一表面和第二表面,其中,所述第一表面为所述基板的外表面,所述外表面背对所述下壳,所述第二表面为所述基板的内表面,所述内表面面对所述下壳;The substrate includes a first surface and a second surface, wherein the first surface is an outer surface of the substrate, the outer surface faces away from the lower case, and the second surface is an inner surface of the substrate, the inner surface faces the lower shell;
    侧壁,位于所述基板的周边、且在背对所述下壳的方向上高出所述第一表面;和a side wall located at the periphery of the base plate and higher than the first surface in a direction facing away from the lower case; and
    顶板,位于所述基板的至少一侧,且在背对所述下壳的方向上高出所述第一表面,所述顶板与所述侧壁相连接;a top plate, located on at least one side of the base plate, and higher than the first surface in a direction facing away from the lower shell, the top plate is connected to the side wall;
    其中,所述基板背对所述下壳的一侧形成所述第一容置槽,所述第一容置槽用于放置电子设备,所述顶板朝向所述下壳的一侧形成所述第二容置槽。Wherein, the side of the substrate facing away from the lower case forms the first accommodating groove, the first accommodating groove is used to place electronic equipment, and the side of the top plate facing the lower case forms the first accommodating groove. Second holding tank.
  12. 如权利要求11所述的干扰装置,其特征在于,所述第二容置槽用于放置所述干扰信号发生模块,所述干扰信号发生模块用于出射所述第一信号的一侧面对所述第一容置槽。The interference device according to claim 11, wherein the second accommodating slot is used to place the interference signal generating module, and the side of the interference signal generating module used to emit the first signal faces the Describe the first storage tank.
  13. 如权利要求11所述的干扰装置,其特征在于,所述上壳的基板、上壳的侧壁、和上壳的顶板为一体结构。The interference device according to claim 11, wherein the base plate of the upper case, the side wall of the upper case, and the top plate of the upper case are integrally constructed.
  14. 如权利要求11所述的干扰装置,其特征在于,所述上壳包括两个所述第二容置槽,分别位于所述第一容置槽在长度方向上的相对两侧。The interference device according to claim 11, wherein the upper shell comprises two second accommodation slots, which are respectively located on opposite sides of the first accommodation slot in the length direction.
  15. 如权利要求11所述的干扰装置,其特征在于,所述上壳的侧壁包括内侧壁与外侧壁,所述外侧壁位于所述内侧壁的外围,其中,所述基板的第一表面与所述内侧壁围成所述第一容置槽,所述顶板连接于所述内侧壁与所述外侧壁之间,所述顶板、所述外侧壁以及所述内侧壁围成所述第二容置槽。The interference device according to claim 11, wherein the side wall of the upper case comprises an inner side wall and an outer side wall, the outer side wall is located at the periphery of the inner side wall, wherein the first surface of the substrate and the outer side wall The inner wall encloses the first accommodating groove, the top plate is connected between the inner wall and the outer wall, and the top plate, the outer wall, and the inner wall enclose the second accommodating groove. holding tank.
  16. 如权利要求15所述的干扰装置,其特征在于,所述第一容置槽与所述第二容置槽之间设置的内侧壁上设有开口或设有多个通孔,以使得所述第一容置槽与所述第二容置槽相连通。The interference device according to claim 15, characterized in that, an opening or a plurality of through holes are provided on the inner side wall provided between the first accommodating groove and the second accommodating groove, so that the The first accommodating tank communicates with the second accommodating tank.
  17. 如权利要求15所述的干扰装置,其特征在于,所述内侧壁从所述基板上沿背对所述下壳的方向向上延伸出来。The interference device according to claim 15, wherein the inner wall extends upward from the base plate in a direction facing away from the lower case.
  18. 如权利要求17所述的干扰装置,其特征在于,所述外侧壁包括相连接的第一部分与第二部分,其中,所述第一部分为在背对所述下壳的方向上高出所述第一表面的部分,所述第二部分为在面对所述下壳的方向高出所述第二表面的部分。The interference device according to claim 17, wherein the outer wall comprises a first part and a second part connected, wherein the first part is higher than the The part of the first surface, the second part is a part higher than the second surface in the direction facing the lower case.
  19. 如权利要求18所述的干扰装置,其特征在于,所述第二部分用于与所述下壳相配合以形成所述收容空间,所述第一部分用于与所述顶板、所述基板相配合以形成所述第一容置槽和所述第二容置槽。The interference device according to claim 18, wherein the second part is used to cooperate with the lower shell to form the receiving space, and the first part is used to cooperate with the top board and the base board. cooperate to form the first accommodating groove and the second accommodating groove.
  20. 如权利要求17所述的干扰装置,其特征在于,所述下壳包括基体以及从基体周围朝所述上壳方向延伸出来的侧壁,所述下壳的侧壁与所述上壳的外侧壁相匹配以形成所述收容空间。The interference device according to claim 17, wherein the lower case comprises a base body and a side wall extending from the periphery of the base body toward the upper case, and the side wall of the lower case is in contact with the outer side of the upper case The walls match to form the receiving space.
  21. 如权利要求11所述的干扰装置,其特征在于,所述上壳在所述第一表面上进一步包括凹槽,所述凹槽内设置支撑结构,所述支撑结构用于对放置于所述第一容置槽中的电子设备起到支撑或/和防滑作用。The interference device according to claim 11, wherein the upper case further comprises a groove on the first surface, and a supporting structure is arranged in the groove, and the supporting structure is used for placing on the The electronic equipment in the first accommodating groove plays a role of support or/and anti-slip.
  22. 如权利要求21所述的干扰装置,其特征在于,所述支撑结构包括支撑垫,所述支撑垫上形成有缝隙,所述缝隙能够通过所述第一信号。The interference device according to claim 21, wherein the support structure comprises a support pad, and a slot is formed on the support pad, and the slot can pass the first signal.
  23. 如权利要求21所述的干扰装置,其特征在于,所述凹槽的数量为两个,分别设置在所述第一表面上的两端,所述基板的中部区域上未设置有所述凹槽的部分的厚度与所述基板上设置有所述凹槽的区域的厚度相同。The interference device according to claim 21, characterized in that, the number of the grooves is two, which are respectively arranged at the two ends of the first surface, and the central region of the substrate is not provided with the grooves. The thickness of the portion of the groove is the same as the thickness of the region on the substrate where the groove is provided.
  24. 如权利要求23所述的干扰装置,其特征在于,所述干扰装置进一步包括无线充电模块,所述基板的第二表面上在未设置所述凹槽的中部区域上设置有第三容置槽,用以收容所述无线充电模块。The interference device according to claim 23, characterized in that the interference device further comprises a wireless charging module, and a third accommodating groove is provided on the second surface of the substrate in the middle area where the groove is not provided , for accommodating the wireless charging module.
  25. 如权利要求11所述的干扰装置,其特征在于,所述下壳上设置有多个通孔,所述基板的第二表面上进一步形成有多个第一定位柱和多个第二定位柱,所述多个第二定位柱位于所述第二表面上的中部区域,所述多个第一定位柱位于所述第二表面的两端区域,其中,所述多个第一定位柱的高度小于所述多个第二定位柱的高度,所述多个第一定位柱具有锁孔,通过螺丝穿入所述下壳上的通孔并与所述锁孔进行锁紧固定而将所述上壳与所述下壳安装在一起。The interference device according to claim 11, wherein the lower shell is provided with a plurality of through holes, and the second surface of the substrate is further formed with a plurality of first positioning posts and a plurality of second positioning posts , the plurality of second positioning posts are located in the middle area of the second surface, and the plurality of first positioning posts are located in the two end areas of the second surface, wherein the plurality of first positioning posts The height is smaller than the height of the plurality of second positioning posts, and the plurality of first positioning posts have locking holes, through which screws are inserted into the through holes on the lower case and locked and fixed with the locking holes to secure the plurality of positioning posts. The upper shell and the lower shell are installed together.
  26. 如权利要求25所述的干扰装置,其特征在于,所述干扰装置进一步包括主板,位于所述上壳与所述下壳之间,所述主板用于驱动所述干扰信号发生模块发出第一信号,所述主板的边缘区域上包括多个通孔,所述多个第一定位柱与所述多个第二定位柱用于分别穿过所述主板上的通孔并与所述下壳相抵触。The interference device according to claim 25, wherein the interference device further comprises a main board, located between the upper case and the lower case, the main board is used to drive the interference signal generating module to send out the first signal, the edge area of the main board includes a plurality of through holes, the plurality of first positioning posts and the plurality of second positioning posts are used to pass through the through holes on the main board and connect with the lower case contradict.
  27. 如权利要求25所述的干扰装置,其特征在于,所述下壳上背对所述上壳的一侧设置有凹槽,所述下壳上的通孔贯穿至所述凹槽,所述凹槽中设置有防滑垫。The interference device according to claim 25, wherein a groove is provided on the side of the lower shell facing away from the upper shell, and the through hole on the lower shell penetrates into the groove, and the An anti-skid pad is arranged in the groove.
  28. 如权利要求25所述的干扰装置,其特征在于,所述下壳面对所述上壳的一侧表面上形成有凸起,当所述下壳与所述上壳安装在一起时,所述多个第一定位柱与所述多个第二定位柱均与所述凸起相抵触,且在所述下壳的通孔的上方形成有限位槽,所述限位槽的开孔孔径大于所述下壳的通孔的孔径,所述限位槽用于收容所述第一定位柱的端部。The interference device according to claim 25, wherein a protrusion is formed on the surface of the lower shell facing the upper shell, when the lower shell and the upper shell are installed together, the The plurality of first positioning posts and the plurality of second positioning posts are all in conflict with the protrusion, and a limiting groove is formed above the through hole of the lower case, and the opening diameter of the limiting groove is The hole diameter is larger than the through hole of the lower shell, and the limiting slot is used for receiving the end of the first positioning post.
  29. 如权利要求22所述的干扰装置,其特征在于,所述支撑垫为麦芒结构或橡胶垫,所述麦芒结构上的缝隙或所述橡胶垫上的缝隙能够通过所述第一信号。The interference device according to claim 22, wherein the support pad is a wheat awn structure or a rubber pad, and the first signal can pass through a gap on the wheat awn structure or a gap on the rubber pad.
  30. 如权利要求11所述的干扰装置,其特征在于,所述第二容置槽中设置定位柱,用于与所述干扰信号发生模块上的定位孔相配合,以对所述干扰信号发生模块进行限位固定。The interference device according to claim 11, characterized in that, a positioning column is arranged in the second accommodating groove for matching with a positioning hole on the interference signal generating module to align the interference signal generating module Carry out limit fixation.
  31. 如权利要求26所述的干扰装置,其特征在于,所述基板的第二表面上进一步形成有多个卡位结构,位于所述多个第二定位柱的外围,所述卡位结构用于对所述主板进行固定。The interference device according to claim 26, wherein a plurality of locking structures are further formed on the second surface of the substrate, located on the periphery of the plurality of second positioning posts, and the locking structures are used for Fix the main board.
  32. 如权利要求31所述的干扰装置,其特征在于,所述卡位结构为凸起结构,且远离所述基板的一端形成有卡勾,所述卡勾用于将所述主板卡扣固定在所述基板上。The interference device according to claim 31, wherein the locking structure is a protruding structure, and a hook is formed at an end away from the base plate, and the hook is used to buckle and fix the main board on the on the substrate.
  33. 如权利要求1所述的干扰装置,其特征在于,所述上壳的第一容置槽中用于放置的电子设备为手机,且所述干扰装置仅能够对单一手机进行干扰。The interference device according to claim 1, wherein the electronic device for placing in the first accommodating slot of the upper case is a mobile phone, and the interference device can only interfere with a single mobile phone.
  34. 如权利要求16所述的干扰装置,其特征在于,所述第一容置槽与所述第二容置槽之间设置的内侧壁上设有开口,每一所述第二容置槽中设置有一所述干扰信号发生模块,所述干扰信号发生模块包括至少二干扰信号发生器和隔板,所述干扰信号发生器用于发出具有预设频率的所述第一信号,所述至少二干扰信号发生器用于发出至少二频率不同的第一信号,所述隔板具有多个通孔,所述隔板曝露在所述开口处,所述第一信号通过所述隔板上的多个通孔出射到所述第一容置槽中。The interference device according to claim 16, wherein an opening is provided on the inner side wall provided between the first accommodating groove and the second accommodating groove, and in each of the second accommodating grooves There is one interference signal generation module, the interference signal generation module includes at least two interference signal generators and partitions, the interference signal generator is used to send out the first signal with a preset frequency, the at least two interference signal generators The signal generator is used to send out at least two first signals with different frequencies, the partition has a plurality of through holes, the partition is exposed at the opening, and the first signal passes through the plurality of through holes on the partition. The holes project into the first receiving groove.
  35. 如权利要求34所述的干扰装置,其特征在于,所述干扰装置进一步包括主板,所述主板用于驱动所述干扰信号发生模块发出第一信号,所述干扰信号发生模块进一步包括定位架和副板,所述至少二干扰信号发生器设置在所述副板上,所述副板与所述主板电连接,所述定位架上包括至少二穿孔,每一干扰信号发生器设置在所述定位架的穿孔中,所述定位架位于所述隔板背对所述第一容置槽的一侧。The interference device according to claim 34, wherein the interference device further comprises a main board, the main board is used to drive the interference signal generation module to send out the first signal, and the interference signal generation module further includes a positioning frame and The sub-board, the at least two interference signal generators are arranged on the sub-board, the sub-board is electrically connected to the main board, the positioning frame includes at least two perforations, and each interference signal generator is arranged on the In the through hole of the positioning frame, the positioning frame is located on the side of the partition facing away from the first accommodating groove.
  36. 如权利要求35所述的干扰装置,其特征在于,所述干扰信号发生模块进一步包括纱网,所述纱网设置在所述隔板与所述定位架之间。The interference device according to claim 35, wherein the interference signal generating module further comprises gauze, and the gauze is arranged between the partition and the positioning frame.
  37. 如权利要求1所述的干扰装置,其特征在于,所述干扰装置的长度为不大于22厘米,宽度不大于12厘米。The interference device according to claim 1, wherein the length of the interference device is not greater than 22 centimeters, and the width is not greater than 12 centimeters.
PCT/CN2021/143922 2021-12-31 2021-12-31 Interference apparatus WO2023123454A1 (en)

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WO2023123454A1 (en) * 2021-12-31 2023-07-06 深圳市安卫普科技有限公司 Interference apparatus

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