WO2023121162A1 - Organic/inorganic hybrid composition and adhesive film including same - Google Patents
Organic/inorganic hybrid composition and adhesive film including same Download PDFInfo
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- WO2023121162A1 WO2023121162A1 PCT/KR2022/020668 KR2022020668W WO2023121162A1 WO 2023121162 A1 WO2023121162 A1 WO 2023121162A1 KR 2022020668 W KR2022020668 W KR 2022020668W WO 2023121162 A1 WO2023121162 A1 WO 2023121162A1
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- Prior art keywords
- group
- silane
- composition
- organic
- weight
- Prior art date
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- 239000000203 mixture Substances 0.000 title claims abstract description 86
- 239000002313 adhesive film Substances 0.000 title claims abstract description 16
- 239000010954 inorganic particle Substances 0.000 claims abstract description 78
- 239000000178 monomer Substances 0.000 claims abstract description 65
- 239000012756 surface treatment agent Substances 0.000 claims abstract description 48
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims abstract description 31
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical group CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 claims description 45
- 239000006185 dispersion Substances 0.000 claims description 34
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 32
- 229910000077 silane Inorganic materials 0.000 claims description 31
- -1 BaTiO 3 Inorganic materials 0.000 claims description 22
- 239000002904 solvent Substances 0.000 claims description 20
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims description 18
- WEVYAHXRMPXWCK-UHFFFAOYSA-N Acetonitrile Chemical compound CC#N WEVYAHXRMPXWCK-UHFFFAOYSA-N 0.000 claims description 15
- 239000002270 dispersing agent Substances 0.000 claims description 13
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 claims description 12
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical group CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 claims description 10
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 claims description 10
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 10
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 9
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 claims description 9
- VHSHLMUCYSAUQU-UHFFFAOYSA-N 2-hydroxypropyl methacrylate Chemical compound CC(O)COC(=O)C(C)=C VHSHLMUCYSAUQU-UHFFFAOYSA-N 0.000 claims description 7
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 claims description 6
- 229920001577 copolymer Polymers 0.000 claims description 6
- XLPJNCYCZORXHG-UHFFFAOYSA-N 1-morpholin-4-ylprop-2-en-1-one Chemical compound C=CC(=O)N1CCOCC1 XLPJNCYCZORXHG-UHFFFAOYSA-N 0.000 claims description 5
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 claims description 5
- 150000001875 compounds Chemical class 0.000 claims description 5
- PSGCQDPCAWOCSH-UHFFFAOYSA-N (4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl) prop-2-enoate Chemical compound C1CC2(C)C(OC(=O)C=C)CC1C2(C)C PSGCQDPCAWOCSH-UHFFFAOYSA-N 0.000 claims description 4
- 239000004593 Epoxy Substances 0.000 claims description 4
- 229910020231 Pb(Mg1/3Nb2/3)O3-xPbTiO3 Inorganic materials 0.000 claims description 4
- 229910020226 Pb(Mg1/3Nb2/3)O3−xPbTiO3 Inorganic materials 0.000 claims description 4
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 claims description 4
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 4
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 claims description 4
- 125000003837 (C1-C20) alkyl group Chemical group 0.000 claims description 3
- 229910018072 Al 2 O 3 Inorganic materials 0.000 claims description 3
- 229910020203 CeO Inorganic materials 0.000 claims description 3
- 239000005046 Chlorosilane Substances 0.000 claims description 3
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical group OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims description 3
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 3
- 229910002367 SrTiO Inorganic materials 0.000 claims description 3
- 229910010413 TiO 2 Inorganic materials 0.000 claims description 3
- BSYQEPMUPCBSBK-UHFFFAOYSA-N [F].[SiH4] Chemical compound [F].[SiH4] BSYQEPMUPCBSBK-UHFFFAOYSA-N 0.000 claims description 3
- NOKSMMGULAYSTD-UHFFFAOYSA-N [SiH4].N=C=O Chemical compound [SiH4].N=C=O NOKSMMGULAYSTD-UHFFFAOYSA-N 0.000 claims description 3
- 150000001343 alkyl silanes Chemical class 0.000 claims description 3
- KOPOQZFJUQMUML-UHFFFAOYSA-N chlorosilane Chemical class Cl[SiH3] KOPOQZFJUQMUML-UHFFFAOYSA-N 0.000 claims description 3
- 125000000524 functional group Chemical group 0.000 claims description 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 3
- PARWUHTVGZSQPD-UHFFFAOYSA-N phenylsilane Chemical compound [SiH3]C1=CC=CC=C1 PARWUHTVGZSQPD-UHFFFAOYSA-N 0.000 claims description 3
- ABLZXFCXXLZCGV-UHFFFAOYSA-N phosphonic acid group Chemical group P(O)(O)=O ABLZXFCXXLZCGV-UHFFFAOYSA-N 0.000 claims description 3
- RQAGEUFKLGHJPA-UHFFFAOYSA-N prop-2-enoylsilicon Chemical compound [Si]C(=O)C=C RQAGEUFKLGHJPA-UHFFFAOYSA-N 0.000 claims description 3
- 229920006395 saturated elastomer Polymers 0.000 claims description 3
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical compound [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 claims description 3
- TXDNPSYEJHXKMK-UHFFFAOYSA-N sulfanylsilane Chemical compound S[SiH3] TXDNPSYEJHXKMK-UHFFFAOYSA-N 0.000 claims description 3
- 125000000542 sulfonic acid group Chemical group 0.000 claims description 3
- UKRDPEFKFJNXQM-UHFFFAOYSA-N vinylsilane Chemical compound [SiH3]C=C UKRDPEFKFJNXQM-UHFFFAOYSA-N 0.000 claims description 3
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 claims 2
- 230000000052 comparative effect Effects 0.000 description 48
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 34
- HMUNWXXNJPVALC-UHFFFAOYSA-N 1-[4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]piperazin-1-yl]-2-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)ethanone Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)N1CCN(CC1)C(CN1CC2=C(CC1)NN=N2)=O HMUNWXXNJPVALC-UHFFFAOYSA-N 0.000 description 14
- 239000000843 powder Substances 0.000 description 13
- VZSRBBMJRBPUNF-UHFFFAOYSA-N 2-(2,3-dihydro-1H-inden-2-ylamino)-N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]pyrimidine-5-carboxamide Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C(=O)NCCC(N1CC2=C(CC1)NN=N2)=O VZSRBBMJRBPUNF-UHFFFAOYSA-N 0.000 description 7
- 230000003287 optical effect Effects 0.000 description 7
- 229920000642 polymer Polymers 0.000 description 7
- 239000003505 polymerization initiator Substances 0.000 description 7
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 6
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 239000002245 particle Substances 0.000 description 5
- 238000002834 transmittance Methods 0.000 description 5
- LDXJRKWFNNFDSA-UHFFFAOYSA-N 2-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)-1-[4-[2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidin-5-yl]piperazin-1-yl]ethanone Chemical compound C1CN(CC2=NNN=C21)CC(=O)N3CCN(CC3)C4=CN=C(N=C4)NCC5=CC(=CC=C5)OC(F)(F)F LDXJRKWFNNFDSA-UHFFFAOYSA-N 0.000 description 4
- YLZOPXRUQYQQID-UHFFFAOYSA-N 3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)-1-[4-[2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidin-5-yl]piperazin-1-yl]propan-1-one Chemical compound N1N=NC=2CN(CCC=21)CCC(=O)N1CCN(CC1)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F YLZOPXRUQYQQID-UHFFFAOYSA-N 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- 238000002360 preparation method Methods 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- JXUKBNICSRJFAP-UHFFFAOYSA-N triethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1CO1 JXUKBNICSRJFAP-UHFFFAOYSA-N 0.000 description 3
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 2
- DOYKFSOCSXVQAN-UHFFFAOYSA-N 3-[diethoxy(methyl)silyl]propyl 2-methylprop-2-enoate Chemical compound CCO[Si](C)(OCC)CCCOC(=O)C(C)=C DOYKFSOCSXVQAN-UHFFFAOYSA-N 0.000 description 2
- DCQBZYNUSLHVJC-UHFFFAOYSA-N 3-triethoxysilylpropane-1-thiol Chemical compound CCO[Si](OCC)(OCC)CCCS DCQBZYNUSLHVJC-UHFFFAOYSA-N 0.000 description 2
- URDOJQUSEUXVRP-UHFFFAOYSA-N 3-triethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CCO[Si](OCC)(OCC)CCCOC(=O)C(C)=C URDOJQUSEUXVRP-UHFFFAOYSA-N 0.000 description 2
- KBQVDAIIQCXKPI-UHFFFAOYSA-N 3-trimethoxysilylpropyl prop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C=C KBQVDAIIQCXKPI-UHFFFAOYSA-N 0.000 description 2
- DEXFNLNNUZKHNO-UHFFFAOYSA-N 6-[3-[4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]piperidin-1-yl]-3-oxopropyl]-3H-1,3-benzoxazol-2-one Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C1CCN(CC1)C(CCC1=CC2=C(NC(O2)=O)C=C1)=O DEXFNLNNUZKHNO-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 2
- 239000004342 Benzoyl peroxide Substances 0.000 description 2
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 2
- AFCARXCZXQIEQB-UHFFFAOYSA-N N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CCNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 AFCARXCZXQIEQB-UHFFFAOYSA-N 0.000 description 2
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 2
- FHKPLLOSJHHKNU-INIZCTEOSA-N [(3S)-3-[8-(1-ethyl-5-methylpyrazol-4-yl)-9-methylpurin-6-yl]oxypyrrolidin-1-yl]-(oxan-4-yl)methanone Chemical compound C(C)N1N=CC(=C1C)C=1N(C2=NC=NC(=C2N=1)O[C@@H]1CN(CC1)C(=O)C1CCOCC1)C FHKPLLOSJHHKNU-INIZCTEOSA-N 0.000 description 2
- 235000019400 benzoyl peroxide Nutrition 0.000 description 2
- WOXXJEVNDJOOLV-UHFFFAOYSA-N ethenyl-tris(2-methoxyethoxy)silane Chemical compound COCCO[Si](OCCOC)(OCCOC)C=C WOXXJEVNDJOOLV-UHFFFAOYSA-N 0.000 description 2
- 230000014509 gene expression Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- WHRNULOCNSKMGB-UHFFFAOYSA-N tetrahydrofuran thf Chemical compound C1CCOC1.C1CCOC1 WHRNULOCNSKMGB-UHFFFAOYSA-N 0.000 description 2
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 2
- YNVAHBUBGBLIEY-WGDLNXRISA-N (1e,4e)-1,5-bis(2-hydroxyphenyl)penta-1,4-dien-3-one Chemical compound OC1=CC=CC=C1\C=C\C(=O)\C=C\C1=CC=CC=C1O YNVAHBUBGBLIEY-WGDLNXRISA-N 0.000 description 1
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- LIPRQQHINVWJCH-UHFFFAOYSA-N 1-ethoxypropan-2-yl acetate Chemical compound CCOCC(C)OC(C)=O LIPRQQHINVWJCH-UHFFFAOYSA-N 0.000 description 1
- ZMARGGQEAJXRFP-UHFFFAOYSA-N 1-hydroxypropan-2-yl 2-methylprop-2-enoate Chemical compound OCC(C)OC(=O)C(C)=C ZMARGGQEAJXRFP-UHFFFAOYSA-N 0.000 description 1
- DAIOTEJKUWOIGJ-UHFFFAOYSA-N 2,2-dimethoxyethoxy(ethyl)silane Chemical group C(C)[SiH2]OCC(OC)OC DAIOTEJKUWOIGJ-UHFFFAOYSA-N 0.000 description 1
- ITSKDXURRACCOF-UHFFFAOYSA-N 2,2-dimethoxyethoxy(hexyl)silane Chemical group C(CCCCC)[SiH2]OCC(OC)OC ITSKDXURRACCOF-UHFFFAOYSA-N 0.000 description 1
- QLCASOSULRITOF-UHFFFAOYSA-N 2,2-dimethoxyethoxy(propyl)silane Chemical group C(CC)[SiH2]OCC(OC)OC QLCASOSULRITOF-UHFFFAOYSA-N 0.000 description 1
- CCTFAOUOYLVUFG-UHFFFAOYSA-N 2-(1-amino-1-imino-2-methylpropan-2-yl)azo-2-methylpropanimidamide Chemical compound NC(=N)C(C)(C)N=NC(C)(C)C(N)=N CCTFAOUOYLVUFG-UHFFFAOYSA-N 0.000 description 1
- NJRHMGPRPPEGQL-UHFFFAOYSA-N 2-hydroxybutyl prop-2-enoate Chemical compound CCC(O)COC(=O)C=C NJRHMGPRPPEGQL-UHFFFAOYSA-N 0.000 description 1
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 1
- GXDMUOPCQNLBCZ-UHFFFAOYSA-N 3-(3-triethoxysilylpropyl)oxolane-2,5-dione Chemical compound CCO[Si](OCC)(OCC)CCCC1CC(=O)OC1=O GXDMUOPCQNLBCZ-UHFFFAOYSA-N 0.000 description 1
- ZADOWCXTUZWAKL-UHFFFAOYSA-N 3-(3-trimethoxysilylpropyl)oxolane-2,5-dione Chemical compound CO[Si](OC)(OC)CCCC1CC(=O)OC1=O ZADOWCXTUZWAKL-UHFFFAOYSA-N 0.000 description 1
- MBNRBJNIYVXSQV-UHFFFAOYSA-N 3-[diethoxy(methyl)silyl]propane-1-thiol Chemical compound CCO[Si](C)(OCC)CCCS MBNRBJNIYVXSQV-UHFFFAOYSA-N 0.000 description 1
- IKYAJDOSWUATPI-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propane-1-thiol Chemical compound CO[Si](C)(OC)CCCS IKYAJDOSWUATPI-UHFFFAOYSA-N 0.000 description 1
- LZMNXXQIQIHFGC-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propyl 2-methylprop-2-enoate Chemical compound CO[Si](C)(OC)CCCOC(=O)C(C)=C LZMNXXQIQIHFGC-UHFFFAOYSA-N 0.000 description 1
- XDQWJFXZTAWJST-UHFFFAOYSA-N 3-triethoxysilylpropyl prop-2-enoate Chemical compound CCO[Si](OCC)(OCC)CCCOC(=O)C=C XDQWJFXZTAWJST-UHFFFAOYSA-N 0.000 description 1
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 1
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 1
- ZBTZKPSEUNLADJ-UHFFFAOYSA-N C(CCCC)[SiH2]OCC(OC)OC Chemical group C(CCCC)[SiH2]OCC(OC)OC ZBTZKPSEUNLADJ-UHFFFAOYSA-N 0.000 description 1
- CHEYZUXMKGVAHL-UHFFFAOYSA-N CO[Si](CCC1CC2OC2CC1)(OC)OC.C(C)[Si](OC)(OC)OC Chemical compound CO[Si](CCC1CC2OC2CC1)(OC)OC.C(C)[Si](OC)(OC)OC CHEYZUXMKGVAHL-UHFFFAOYSA-N 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- LXEKPEMOWBOYRF-UHFFFAOYSA-N [2-[(1-azaniumyl-1-imino-2-methylpropan-2-yl)diazenyl]-2-methylpropanimidoyl]azanium;dichloride Chemical compound Cl.Cl.NC(=N)C(C)(C)N=NC(C)(C)C(N)=N LXEKPEMOWBOYRF-UHFFFAOYSA-N 0.000 description 1
- NOZAQBYNLKNDRT-UHFFFAOYSA-N [diacetyloxy(ethenyl)silyl] acetate Chemical compound CC(=O)O[Si](OC(C)=O)(OC(C)=O)C=C NOZAQBYNLKNDRT-UHFFFAOYSA-N 0.000 description 1
- 125000003668 acetyloxy group Chemical group [H]C([H])([H])C(=O)O[*] 0.000 description 1
- 125000004018 acid anhydride group Chemical group 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- ZPWWJMULPQKGQK-UHFFFAOYSA-N butyl(2,2-dimethoxyethoxy)silane Chemical group C(CCC)[SiH2]OCC(OC)OC ZPWWJMULPQKGQK-UHFFFAOYSA-N 0.000 description 1
- XGZGKDQVCBHSGI-UHFFFAOYSA-N butyl(triethoxy)silane Chemical group CCCC[Si](OCC)(OCC)OCC XGZGKDQVCBHSGI-UHFFFAOYSA-N 0.000 description 1
- SXPLZNMUBFBFIA-UHFFFAOYSA-N butyl(trimethoxy)silane Chemical compound CCCC[Si](OC)(OC)OC SXPLZNMUBFBFIA-UHFFFAOYSA-N 0.000 description 1
- 125000001309 chloro group Chemical group Cl* 0.000 description 1
- 239000013065 commercial product Substances 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- IPHJYJHJDIGARM-UHFFFAOYSA-M copper phthalocyaninesulfonic acid, dioctadecyldimethylammonium salt Chemical compound [Cu+2].CCCCCCCCCCCCCCCCCC[N+](C)(C)CCCCCCCCCCCCCCCCCC.C=1C(S(=O)(=O)[O-])=CC=C(C(=NC2=NC(C3=CC=CC=C32)=N2)[N-]3)C=1C3=NC([C]1C=CC=CC1=1)=NC=1N=C1[C]3C=CC=CC3=C2[N-]1 IPHJYJHJDIGARM-UHFFFAOYSA-M 0.000 description 1
- KQZMZRYMWKPGPG-UHFFFAOYSA-N decyl(2,2-dimethoxyethoxy)silane Chemical group C(CCCCCCCCC)[SiH2]OCC(OC)OC KQZMZRYMWKPGPG-UHFFFAOYSA-N 0.000 description 1
- BAAAEEDPKUHLID-UHFFFAOYSA-N decyl(triethoxy)silane Chemical group CCCCCCCCCC[Si](OCC)(OCC)OCC BAAAEEDPKUHLID-UHFFFAOYSA-N 0.000 description 1
- KQAHMVLQCSALSX-UHFFFAOYSA-N decyl(trimethoxy)silane Chemical group CCCCCCCCCC[Si](OC)(OC)OC KQAHMVLQCSALSX-UHFFFAOYSA-N 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- OTARVPUIYXHRRB-UHFFFAOYSA-N diethoxy-methyl-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](C)(OCC)CCCOCC1CO1 OTARVPUIYXHRRB-UHFFFAOYSA-N 0.000 description 1
- WHGNXNCOTZPEEK-UHFFFAOYSA-N dimethoxy-methyl-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](C)(OC)CCCOCC1CO1 WHGNXNCOTZPEEK-UHFFFAOYSA-N 0.000 description 1
- YGUFXEJWPRRAEK-UHFFFAOYSA-N dodecyl(triethoxy)silane Chemical group CCCCCCCCCCCC[Si](OCC)(OCC)OCC YGUFXEJWPRRAEK-UHFFFAOYSA-N 0.000 description 1
- SCPWMSBAGXEGPW-UHFFFAOYSA-N dodecyl(trimethoxy)silane Chemical group CCCCCCCCCCCC[Si](OC)(OC)OC SCPWMSBAGXEGPW-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- SBRXLTRZCJVAPH-UHFFFAOYSA-N ethyl(trimethoxy)silane Chemical compound CC[Si](OC)(OC)OC SBRXLTRZCJVAPH-UHFFFAOYSA-N 0.000 description 1
- CZWLNMOIEMTDJY-UHFFFAOYSA-N hexyl(trimethoxy)silane Chemical compound CCCCCC[Si](OC)(OC)OC CZWLNMOIEMTDJY-UHFFFAOYSA-N 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 125000005395 methacrylic acid group Chemical group 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- PHQOGHDTIVQXHL-UHFFFAOYSA-N n'-(3-trimethoxysilylpropyl)ethane-1,2-diamine Chemical compound CO[Si](OC)(OC)CCCNCCN PHQOGHDTIVQXHL-UHFFFAOYSA-N 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- MSRJTTSHWYDFIU-UHFFFAOYSA-N octyltriethoxysilane Chemical group CCCCCCCC[Si](OCC)(OCC)OCC MSRJTTSHWYDFIU-UHFFFAOYSA-N 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 125000001820 oxy group Chemical group [*:1]O[*:2] 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 239000002952 polymeric resin Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229920005604 random copolymer Polymers 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 125000003396 thiol group Chemical group [H]S* 0.000 description 1
- GQIUQDDJKHLHTB-UHFFFAOYSA-N trichloro(ethenyl)silane Chemical compound Cl[Si](Cl)(Cl)C=C GQIUQDDJKHLHTB-UHFFFAOYSA-N 0.000 description 1
- DENFJSAFJTVPJR-UHFFFAOYSA-N triethoxy(ethyl)silane Chemical group CCO[Si](CC)(OCC)OCC DENFJSAFJTVPJR-UHFFFAOYSA-N 0.000 description 1
- SAWDTKLQESXBDN-UHFFFAOYSA-N triethoxy(heptyl)silane Chemical group CCCCCCC[Si](OCC)(OCC)OCC SAWDTKLQESXBDN-UHFFFAOYSA-N 0.000 description 1
- WUMSTCDLAYQDNO-UHFFFAOYSA-N triethoxy(hexyl)silane Chemical group CCCCCC[Si](OCC)(OCC)OCC WUMSTCDLAYQDNO-UHFFFAOYSA-N 0.000 description 1
- FZXOVEZAKDRQJC-UHFFFAOYSA-N triethoxy(nonyl)silane Chemical group CCCCCCCCC[Si](OCC)(OCC)OCC FZXOVEZAKDRQJC-UHFFFAOYSA-N 0.000 description 1
- FHVAUDREWWXPRW-UHFFFAOYSA-N triethoxy(pentyl)silane Chemical group CCCCC[Si](OCC)(OCC)OCC FHVAUDREWWXPRW-UHFFFAOYSA-N 0.000 description 1
- BBWMWJONYVGXGQ-UHFFFAOYSA-N triethoxy(undecyl)silane Chemical group CCCCCCCCCCC[Si](OCC)(OCC)OCC BBWMWJONYVGXGQ-UHFFFAOYSA-N 0.000 description 1
- JEPXSTGVAHHRBD-UHFFFAOYSA-N trimethoxy(nonyl)silane Chemical group CCCCCCCCC[Si](OC)(OC)OC JEPXSTGVAHHRBD-UHFFFAOYSA-N 0.000 description 1
- NMEPHPOFYLLFTK-UHFFFAOYSA-N trimethoxy(octyl)silane Chemical group CCCCCCCC[Si](OC)(OC)OC NMEPHPOFYLLFTK-UHFFFAOYSA-N 0.000 description 1
- HILHCDFHSDUYNX-UHFFFAOYSA-N trimethoxy(pentyl)silane Chemical compound CCCCC[Si](OC)(OC)OC HILHCDFHSDUYNX-UHFFFAOYSA-N 0.000 description 1
- HQYALQRYBUJWDH-UHFFFAOYSA-N trimethoxy(propyl)silane Chemical compound CCC[Si](OC)(OC)OC HQYALQRYBUJWDH-UHFFFAOYSA-N 0.000 description 1
- LIJFLHYUSJKHKV-UHFFFAOYSA-N trimethoxy(undecyl)silane Chemical group CCCCCCCCCCC[Si](OC)(OC)OC LIJFLHYUSJKHKV-UHFFFAOYSA-N 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 239000005050 vinyl trichlorosilane Substances 0.000 description 1
- 239000004034 viscosity adjusting agent Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/12—Esters of monohydric alcohols or phenols
- C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
- C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
- C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/006—Additives being defined by their surface area
Definitions
- the present invention relates to an organic-inorganic hybrid composition and an adhesive film containing the same.
- OCA film is a transparent adhesive film used for bonding optical members.
- OCA optically clear adhesive
- a display device having a touch panel typically includes a display panel such as a liquid crystal panel, a touch panel body having a transparent conductive film made of indium tin oxide (ITO) on a surface layer, and an optical member such as a cover panel that protects the transparent conductive film.
- ITO indium tin oxide
- an optical member such as a cover panel that protects the transparent conductive film.
- optically transparent adhesives include those made of organic materials such as silicone-based resins, polyurethane-based resins, and olefin-based resins. Differences can cause problems affecting optical properties.
- the present invention is to provide a surface treatment agent for organic-inorganic hybrid composition.
- an organic-inorganic hybrid composition According to one embodiment of the present invention, it is intended to provide an organic-inorganic hybrid composition.
- An organic-inorganic hybrid composition according to an embodiment of the present invention includes inorganic particles surface-modified by a surface treatment agent and an acrylic monomer, and the surface-modified inorganic particles and acrylic monomer have a weight ratio of 1:1 to 2:1. may have
- the inorganic particles are ZrO 2 , SiO 2 , Al 2 O 3 , CeO 2 , ZnO, V 2 O 5 TiO 2 , BaTiO 3 , SrTiO 3 , BaTiO 3 , PbTiO 3 , PbZrO 3 , Pb ( Zr,Ti)O 3 (PZT), Pb 1-x La x Zr 1-y Ti y O 3 (PLZT), (1-x)Pb(Mg 1/3 Nb 2/3 )O 3 -xPbTiO 3 ( PMN-PT), HfO 2 and may include at least one selected from the group consisting of BN.
- the diameter of the inorganic particles may be 10 nm to 200 nm, and the specific surface area of the inorganic particles may be 1 m 2 /g to 250 m 2 /g.
- the surface-modified inorganic particles may be 40% to 50% by weight of the composition.
- the acrylic monomer is butyl acrylate, 2-ethylhexyl acrylate, isobornyl acrylate and 4-acryloyl morpholine (4-ethylhexyl acrylate).
- acryloyl morpholine may include at least one selected from the group consisting of.
- the acrylic monomer may be 50% to 60% by weight of the composition.
- the surface treatment agent may be a copolymer of a silane-based monomer and a methacrylate-based monomer.
- the silane-based monomer is silane, C 1 -C 20 Alkyl silane, alkoxy silane, isocyanate silane, amino silane, epoxy silane, acryl silane, mercapto silane, fluorine silane, methacryloxy group silane, It includes at least one selected from the group consisting of vinyl silane, phenyl silane, chloro silane, and silazane, and the methacrylate-based monomer is 2-hydroxyethyl methacrylate (2-HEMA), At least one selected from the group consisting of 2-hydroxypropyl methacrylate (2-HPMA) and 2-hydroxy-1-methylethyl methacrylate may include
- the surface treatment agent may include a compound represented by any one of Formulas 1 to 3 below.
- R 1 to R 3 are, respectively, H, a saturated or unsaturated straight-chain or branched-chain C 1 -C 20 alkyl group, a hydroxyl group, a silane group, and at least one of an alkoxysilane group, wherein R 4 is , H or containing a hydroxyl group.
- the surface treatment agent may be included in an amount of 10 parts by weight to 30 parts by weight based on 100 parts by weight of the inorganic particles.
- the composition may further include a dispersant including at least one functional group selected from the group consisting of a carboxyl group, a phosphoric acid group, a phosphonic acid group, a sulfonic acid group, and a phenolic hydroxyl group.
- a dispersant including at least one functional group selected from the group consisting of a carboxyl group, a phosphoric acid group, a phosphonic acid group, a sulfonic acid group, and a phenolic hydroxyl group.
- the dispersant may be included in 1 part by weight to 10 parts by weight based on 100 parts by weight of the composition.
- the composition further comprises a dispersing solvent
- the dispersing solvent is methyl ethyl ketone (MEK), ethanol, methanol, acetonitrile (acetonitrile), toluene (Toluene), tetrahydrofuran (tetrahydrofuran) , THF), propylene glycol monoethyl ether acetate (PGMEA), and may include at least one selected from the group consisting of ethyl acetate.
- the weight ratio of the surface-modified inorganic particles and the dispersion solvent may be 1:1 to 1:2.
- the dispersion solvent may be 30% to 60% by weight of the composition.
- the composition may have a refractive index of 1.50 to 1.80, a viscosity of 180 cPs to 250 cPs, and a haze of 15% or less.
- An adhesive film according to another embodiment of the present invention is an adhesive film prepared using a composition, wherein the composition includes inorganic particles and acrylic monomers surface-modified by a surface treatment agent, and the surface-modified inorganic particles and acrylic monomers are , 1: 1 to 2: may have a weight ratio of 1.
- the present invention may provide a surface treatment agent for an organic-inorganic hybrid composition.
- an organic-inorganic hybrid composition may be provided.
- first, second, A, B, (a), (b) may be used. These terms are only used to distinguish the component from other components, and the nature, sequence, or order of the corresponding component is not limited by the term.
- the organic-inorganic hybrid composition according to an embodiment of the present invention may include inorganic particles surface-modified by a surface treatment agent and an acrylic monomer.
- an adhesive film may be formed by curing the organic-inorganic hybrid composition, and according to the present invention, the organic-inorganic hybrid composition may provide an optically transparent or substantially optically transparent inorganic particle dispersion composition. .
- the surface of the inorganic particles may be modified using a surface treatment agent to improve the dispersibility of the inorganic particles, and as they are evenly dispersed in the composition, an optically transparent inorganic particle dispersion composition may be provided.
- the surface-modified inorganic particles and the acrylic monomer may have a weight ratio of 1:1 to 2:1. According to one embodiment, it may be preferable that the weight of the acrylic monomer is equal to or greater than the weight of the surface-modified inorganic particles.
- the inorganic particle may be a metal oxide.
- the inorganic particles are metal oxides and may be included in a transparent polymer resin to increase refractive index.
- the inorganic particles are ZrO 2 , SiO 2 , Al 2 O 3 , CeO 2 , ZnO, V 2 O 5 TiO 2 , BaTiO 3 , SrTiO 3 , BaTiO 3 , PbTiO 3 , PbZrO 3 , Pb(Zr ,Ti)O 3 (PZT), Pb 1-x La x Zr 1-y Ti y O 3 (PLZT), (1-x)Pb(Mg 1/3 Nb 2/3 )O 3 -xPbTiO 3 (PMN -PT), HfO 2 It may include at least one selected from the group consisting of and BN.
- the inorganic particles may preferably include zirconia (ZrO 2 ).
- Zirconia may be suitable for the composition according to an embodiment of the present invention because it is transparent, has a high Abbe number, and has excellent mechanical strength and thermal stability.
- the inorganic particles may correspond to nano-inorganic particles.
- the diameter of the inorganic particles may be 10 nm to 200 nm.
- the diameter of the inorganic particles may mean an average of the diameters of the inorganic particles.
- the diameter of the inorganic particle may mean the diameter of the inorganic particle whose surface is not modified with a surface treatment agent.
- the diameter of the inorganic particles is 10 nm or more, 20 nm or more, 30 nm or more, 40 nm or more, 50 nm or more, 60 nm or more, 70 nm or more, 80 nm or more, 90 nm or more, 100 nm or more.
- the diameter of the inorganic particles when the diameter of the inorganic particles is less than 10 nm, dispersion may be difficult due to the increase in the surface energy of the inorganic particles, and when the diameter is greater than 200 nm, a scattering effect is developed, resulting in deterioration in the visibility of the adhesive film. Thickness may increase.
- the specific surface area of the inorganic particles may be 1 m 2 /g to 250 m 2 /g.
- the specific surface area of the inorganic particles may mean the average of the specific surface areas of the inorganic particles.
- the specific surface area of the inorganic particles may be a measurement of the specific surface area of inorganic particles that are not surface-modified with a surface treatment agent.
- the specific surface area of the inorganic particles is 1 m 2 /g or more, 10 m 2 /g or more, 30 m 2 /g or more, 50 m 2 /g or more, 70 m 2 /g or more, or 90 m 2 /g or more.
- transmittance when the specific surface area of the inorganic particles is out of the above range, transmittance may be lowered or quality may be deteriorated due to scattering, and agglomerates may be formed.
- the surface-modified inorganic particles may be 40% to 50% by weight of the composition. According to one embodiment, the amount of the surface-modified inorganic particles may be 40% to 45% by weight, or 45% to 50% by weight.
- the relative ratio of the inorganic particles in the composition is lowered, thereby reducing the refractive index and luminance of the composition. Cloudiness may occur during manufacturing.
- the acrylic monomer is butyl acrylate, 2-ethylhexyl acrylate, isobonyl acrylate and 4-acryloyl morpholine (4-ethylhexyl acrylate).
- acryloyl morpholine may include at least one selected from the group consisting of.
- An adhesive film may be prepared by curing the composition according to an embodiment of the present invention, and a flexible and optically excellent adhesive film may be prepared by applying an acrylic monomer.
- the acrylic monomer may be 50% to 60% by weight of the composition. According to one embodiment, the acrylic monomer may be 50% to 55% by weight, or 55% to 60% by weight.
- the ratio of inorganic particles increases and the viscosity may increase. , cloudiness may occur.
- the surface treatment agent may be a copolymer of a silane-based monomer and a methacrylate-based monomer.
- the surface treatment agent may be a random copolymer of a silane-based monomer and a methacrylate-based monomer.
- the silane-based monomer is silane, C 1 -C 20 Alkyl silane, alkoxy silane, isocyanate silane, amino silane, epoxy silane, acryl silane, mercapto silane, fluorine silane, methacryloxy group silane, It may include at least one selected from the group consisting of vinyl silane, phenyl silane, chloro silane, and silazane.
- the silane-based monomer is, specifically, vinyltrimethoxysilane, vinyltriethoxysilane, vinyltris (2-methoxyethoxy) silane (vinyltris (2-methoxyethoxy)) silane) containing at least one vinyl group-containing silane-based monomer selected from the group consisting of 3-methacryloxypropyltrimethoxysilane (MPTMS), 3-methacryloxypropyltriethoxysilane (3 -Methacryloxypropyltriethoxysilane (MPTES), 3-methacryloxypropylmethyldimethoxysilane, and 3-methacryloxypropylmethyldiethoxysilane (methacryloxypropylmethyldiethoxysilane).
- MPTMS 3-methacryloxypropyltrimethoxysilane
- MPTES 3-methacryloxypropyltriethoxysilane
- 3-methacryloxypropylmethyldimethoxysilane 3-methacryloxypropyl
- Silane-based monomers containing an oxy group silane-based monomers containing an acetoxy group including vinyltriacetoxysilane, 3-acryloxypropyltrimethoxysilane (APTMS), 3-acryloxypropyltriene Toxysilane (3-acryloxypropyltriethoxysilane) or an acryloxy group-containing silane-based monomer including the two, 3-glycidoxypropyltrimethoxysilane (GPTMS), 3-glycidoxypropyltriethoxysilane ( 3-glycidoxypropyltriethoxysilane (GPTES), 3-glycidoxypropylmethyldimethoxysilane, 3-glycidoxypropylmethyldiethoxysilane, 2-(3,4-epoxycyclohexyl)
- the methacrylate-based monomer is 2-hydroxyethyl methacrylate (2-HEMA), 2-hydroxypropyl methacrylate (2-hydroxypropyl methacrylate, 2-HPMA) , 2-hydroxy-1-methylethyl methacrylate (2-hydroxy-1-methylethyl methacrylate) may include at least one selected from the group consisting of.
- the surface treatment agent may include a compound represented by any one of Formulas 1 to 3 below.
- the R 1 to R 3 are, respectively, H, a saturated or unsaturated straight or branched chain C 1 -C 20 alkyl group, a hydroxyl group, a silane group and an alkoxysilane group including at least one of, wherein the R 4 may contain H or a hydroxyl group.
- R 1 to R 3 are, respectively, a C 2 -C 12 alkyltrimethoxysilane group, a C 2 -C 12 alkyltriethoxysilane group and a C 2 -C 12 It may include at least one selected from the group consisting of an alkyldimethoxyethoxysilane group.
- R1 to R3 are ethyltrimethoxysilane, propyltrimethoxysilane, butyltrimethoxysilane, pentyltrimethoxysilane, hexyltrimethoxysilane, heptyltrimethoxy, respectively.
- Silane group octyltrimethoxysilane group, nonyltrimethoxysilane group, decyltrimethoxysilane group, undecyltrimethoxysilane group, dodecyltrimethoxysilane group, ethyltriethoxysilane group, propyl trie Toxysilane group, butyltriethoxysilane group, pentyltriethoxysilane group, hexyltriethoxysilane group, heptyltriethoxysilane group, octyltriethoxysilane group, nonyltriethoxysilane group, decyltriethoxy Silane group, undecyltriethoxysilane group, dodecyltriethoxysilane group, ethyldimethoxyethoxysilane group, propyldimethoxyethoxysilane group, butyldimethoxy
- R 4 may be one in which an H atom or a hydroxyl group is formed at the opposite end of the portion connected to the methacrylic group.
- R 4 may include at least one selected from the group consisting of H, a 2-hydroxyethyl group, a 3-hydroxypropyl group, and a 2-hydroxybutyl group.
- the surface treatment agent may be a copolymer of two different methacrylate-based monomers, a copolymer of an acrylate-based monomer and a methacrylate-based monomer, or a copolymer of an epoxy-based monomer and a methacrylate-based monomer.
- the surface treatment agent for a composition including a compound represented by any one of Formulas 1 to 3 may have characteristics of the surface treatment agent determined according to the ratio of m and n.
- m and n may have an integer ratio between 1:2 and 2:1.
- m and n may have an integer ratio such as 1:1, 3:2, 2:3, 4:3, 5:3, 3:4, 5:4, or 7:4.
- the surface treatment agent may be included in an amount of 10 parts by weight to 30 parts by weight based on 100 parts by weight of the inorganic particles. According to one embodiment, when the amount of the surface treatment agent is less than 10 parts by weight based on 100 parts by weight of the inorganic particles, dispersibility may be lowered, and when it is greater than 30 parts by weight, curing may not be smooth during film manufacture.
- the surface treatment agent may further include at least one polymerization initiator selected from the group consisting of benzoyl peroxide (BPO), azobisisobutyronitrile (AIBN), and AIBA (2,2'-azobis (2-methylpropionamidine)).
- the polymerization initiator may include a peroxide-based compound, an azo compound, or both.
- the polymerization initiator may be 0.1% to 1% by weight of the surface treatment agent. According to one embodiment, when the polymerization initiator is less than 0.1% by weight, copolymerization may proceed partially, and when the content of the polymerization initiator exceeds 1% by weight, the excess polymerization initiator in the surface treatment agent is distributed and functions as an impurity can do.
- the light transmittance of the surface treatment agent may be 40% or more.
- the light transmittance of the surface treatment agent may be 40% or more, 42% or more, 45% or more, or 50% or more.
- the haze of the surface treatment agent may be 80% or less.
- the haze of the surface treatment agent may be 80% or less, 70% or less, 60% or less, or 50% or less.
- the composition may further include a dispersant including at least one functional group selected from the group consisting of a carboxyl group, a phosphoric acid group, a phosphonic acid group, a sulfonic acid group, and a phenolic hydroxyl group.
- the dispersant may preferably include a carboxyl group.
- the dispersant may be available from a commercial product.
- the dispersant is a dispersant under the trade names DISPERBYK, DISPERBYK-101, DISPERBYK-102, DISPERBYK-103, DISPERBYK-106, DISPERBYK-107, DISPERBYK-108, DISPERBYK-109, DISPERBYK-110.
- DISPERBYK-111 DISPERBYK-112, DISPERBYK-115, DISPERBYK-116, DISPERBYK-118, DISPERBYK-130, DISPERBYK-140, DISPERBYK-142, DISPERBYK-145, DISPERBYK-160, DISPERBYK-161, DISPERBYK-162, DISPERBYK -163, DISPERBYK-164, DISPERBYK-165, DISPERBYK-166, DISPERBYK-167, DISPERBYK-168, DISPERBYK-169, DISPERBYK-170, DISPERBYK-171, DISPERBYK-174, DISPERBYK-176, DISPERBYK-180, DISPERBYK-181 , DISPERBYK-182, DISPERBYK-183, DISPERBYK-184, DISPERBYK-
- the dispersant in addition to the above trademark, Antiterra-U, P104, Disperbyk 110, Disperbyk 130, Disperbyk 160, Disperbyk 170 Family, EFKA 776, EFKA 4050, EFKA 4063, EFKA 4051, Solsperse 24000, It may include at least one selected from the group consisting of Solsperse 36600, Solsperse 32600, Solsperse 22000 and Solsperse 5000.
- the dispersant may be included in an amount of 1 part by weight to 10 parts by weight based on 100 parts by weight of the composition. According to one embodiment, the dispersant may be included in 1 part by weight to 5 parts by weight, or 3 parts by weight to 7 parts by weight based on 100 parts by weight of the composition.
- the composition further comprises a dispersing solvent
- the dispersing solvent is methyl ethyl ketone (MEK), ethanol, methanol, acetonitrile (acetonitrile), toluene (Toluene), tetrahydrofuran (tetrahydrofuran) , THF), propylene glycol monomethyl ether acetate (PGMEA), and at least one selected from the group consisting of ethyl acetate.
- the weight of the dispersion solvent may be equal to or greater than the weight of the surface-modified inorganic particles. According to one embodiment, the weight ratio of the surface-modified inorganic particles and the dispersion solvent may be 1:1 to 1:2.
- the dispersion solvent may be 30% to 60% by weight of the composition. According to one embodiment, the dispersion solvent is 30% by weight or more, 40% by weight or more, or 50% by weight or more, 60% by weight or less, 50% by weight or less, 40% by weight or less, or selected from the above-mentioned values. It can be included in the range between the two values.
- the refractive index of the composition may be 1.50 to 1.80.
- the composition is a high refractive index dispersion composition, wherein the refractive index is 1.50 or more, 1.55 or more, 1.60 or more, 1.65 or more, 1.70 or more, or 1.75 or more, or 1.80 or less, 1.75 or less, 1.70 or less, 1.65 or less, 1.60 or less. or less, 1.55 or less, or may be included in a range between two values selected from the above-mentioned numerical values.
- the composition may have a viscosity of 180 cPs to 20,000 cPs (at 25° C.).
- the viscosity of the composition can be adjusted through a viscosity modifier such as MEK, toluene, or ethyl acetate.
- the viscosity of the composition is preferably , 180 cPs to 10,000 cPs (based on 25 ° C.), and more preferably, 180 cPs to 1,000 cPs (based on 25 ° C.).
- the haze of the composition may be 15% or less.
- the haze of the composition may be 15% or less, preferably, 14% or less, and more preferably, 6% or less.
- An adhesive film according to an embodiment of the present invention may be manufactured using a composition according to an embodiment.
- An adhesive film according to an embodiment of the present invention is a composition according to an embodiment, and includes inorganic particles surface-modified by a surface treatment agent, and an acrylic monomer, wherein the inorganic particles and the acrylic monomer have a ratio of 1:1 to 2. : It may be prepared using a composition having a weight ratio of 1.
- the adhesive film may be, for example, an OCA film or a pressure sensitive adhesive (PSA) film, and may provide a flexible and optically transparent adhesive film.
- PSA pressure sensitive adhesive
- 3-methacryloxypropyltrimethoxysilane (MPTMS) and 2-hydroxyethyl methacrylate (2-HEMA) were mixed at a weight ratio of 1:1 in methyl ethyl ketone (MEK) solvent.
- AIBN methyl ethyl ketone
- the solvent was mixed in the same amount as the total weight of the monomers. After growing at 60° C. for 3 hours under a nitrogen atmosphere, the mixture was stirred at room temperature for 12 hours to polymerize the monomers to obtain a polymer.
- Example 1-1 except for using 2-hydroxyethyl acrylate (2-HEA) instead of 2-HEMA, the rest of the polymer was obtained in the same manner.
- 2-HEA 2-hydroxyethyl acrylate
- Example 1-1 except for using 2-hydroxybutyl acrylate (2-HBA) instead of 2-HEMA, the rest of the polymer was obtained in the same manner.
- 2-HBA 2-hydroxybutyl acrylate
- Example 2-1 an inorganic particle dispersion was prepared in the same manner as in Example 2-1, except that 30 parts by weight of the surface treatment agent was added based on 100 parts by weight of the zirconia powder.
- Example 2-1 an inorganic particle dispersion was prepared in the same manner as in Example 2-1, except for adding 40 parts by weight of the surface treatment agent based on 100 parts by weight of the zirconia powder.
- Example 2-1 an inorganic particle dispersion was prepared in the same manner as in Example 2-1, except for adding the polymer according to Comparative Example 1-1 as a surface treatment agent.
- Comparative Example 2-1 an inorganic particle dispersion was prepared in the same manner as in Comparative Example 2-1, except that 30 parts by weight of the surface treatment agent was added based on 100 parts by weight of the zirconia powder.
- Comparative Example 2-1 an inorganic particle dispersion was prepared in the same manner as in Comparative Example 2-1, except that 40 parts by weight of the surface treatment agent was added based on 100 parts by weight of the zirconia powder.
- An inorganic particle dispersion was prepared in the same manner as in Example 2-1, except for adding the polymer according to Comparative Example 1-2 as a surface treatment agent.
- Comparative Examples 2-4 an inorganic particle dispersion was prepared in the same manner as in Comparative Examples 2-4, except that 30 parts by weight of the surface treatment agent was added based on 100 parts by weight of the zirconia powder.
- Comparative Examples 2-4 an inorganic particle dispersion was prepared in the same manner as in Comparative Examples 2-4, except that 40 parts by weight of the surface treatment agent was added based on 100 parts by weight of the zirconia powder.
- Comparative Examples 2-7 an inorganic particle dispersion was prepared in the same manner as in Comparative Examples 2-7, except that 15 parts by weight of the surface treatment agent was added based on 100 parts by weight of the zirconia powder.
- inorganic particle dispersions were prepared in the same manner as in Comparative Examples 2-7, except that 20 parts by weight of the surface treatment agent was added based on 100 parts by weight of the zirconia powder.
- Example 2-1 40.77 48.25 97
- Example 2-2 40.43 48.70 98 Example 2-3 58.41 23.45 97
- Comparative Example 2-1 Solid (unrecoverable) Comparative Example 2-2 24.55 82.41 92 Comparative Example 2-3 23.42 85.74 96
- Comparative Example 2-4 Solid (unrecoverable) Comparative Example 2-5 Solid (unrecoverable) Comparative Example 2-6 22.51 84.51 96
- Comparative Example 2-7 Solid (unrecoverable) Comparative Example 2-8 17.38 92.79 97 Comparative Example 2-9 15.95 92.80 97
- methyl ethyl ketone (MEK) as a dispersion solvent
- zirconia powder having an average particle diameter of 10 nm 40% by weight of zirconia powder having an average particle diameter of 10 nm
- 10% by weight of the polymer according to Example 1-1 was stirred for 30 minutes.
- zirconia beads (average particle diameter: 0.05 mm) was added based on 100 parts by weight of the mixture so that the zirconia particles could be evenly dispersed, and then dispersed in a paint shaker for 3 hours to recover the dispersion did Based on 50 parts by weight of the prepared dispersion, 45 parts by weight of butyl acrylate as an acrylic monomer and 5 parts by weight of a dispersing agent were added, and the dispersion solvent was removed under reduced pressure to prepare a composition.
- a composition was prepared in the same manner as in Example 3-1, except for adding 2-ethylhexyl acrylate as an acrylic monomer.
- Example 3-1 the composition was prepared in the same manner as in Example 3-1, except that isobornyl acrylate was added as an acrylic monomer.
- Example 3-1 the composition was prepared in the same manner as in Example 3-1, except for adding 4-acryloyl morpholine as an acrylic monomer.
- Example 3-1 the composition was prepared in the same manner as in Example 3-1, except for adding methacryloxypropyltrimethoxysilane as a surface treatment agent.
- Comparative Example 3-1 except for adding 2-ethylhexyl acrylate as an acrylic monomer, the rest of the composition was prepared in the same manner.
- a composition was prepared in the same manner as in Comparative Example 3-1, except for adding isobornyl acrylate as an acrylic monomer.
- a composition was prepared in the same manner as in Comparative Example 3-1, except for adding 4-acryloyl morpholine as an acrylic monomer.
- Example 3-1 1.57 230 12.2
- Example 3-2 1.57 180 11.8
- Example 3-3 1.55 250 13.5
- Example 3-4 1.56 195 12.5
- Comparative Example 3-1 1.57 450 15.8 Comparative Example 3-2 1.57 480 16.2 Comparative Example 3-3 1.54 380 19.4 Comparative Example 3-4 1.55 320 16.5
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Abstract
The present invention relates to an organic/inorganic hybrid composition and an adhesive film including same. A composition according to an embodiment of the present invention includes inorganic particles surface-modified with a surface treatment agent, and an acrylic monomer wherein the surface-modified inorganic particles and the acrylic monomer may have a weight ratio of 1:1 to 2:1.
Description
본 발명은 유무기 하이브리드 조성물 및 이를 포함하는 점착 필름에 관한 것이다.The present invention relates to an organic-inorganic hybrid composition and an adhesive film containing the same.
광학 투명 점착(OCA, optically clear adhesive) 필름은, 광학부재의 접합에 이용되는 투명한 점착 필름이다. 최근 스마트폰, 태블릿 PC, 휴대형 게임기, 자동차 내비게이션 장치 등의 분야에서 터치 패널의 수요가 급속하게 증가하고 있고, 터치 패널을 다른 광학부재에 접합시키기 위해 사용되는 OCA 필름의 수요도 급속히 증가하고 있다.An optically clear adhesive (OCA) film is a transparent adhesive film used for bonding optical members. Recently, the demand for touch panels is rapidly increasing in fields such as smart phones, tablet PCs, portable game consoles, and car navigation devices, and the demand for OCA films used to bond touch panels to other optical members is also rapidly increasing.
터치 패널을 구비하는 표시장치는, 통상적으로 액정 패널과 같은 표시 패널, 산화 인듐 주석(ITO) 등으로 이루어진 투명 도전막이 표층에 구비되는 터치 패널 본체, 및 투명 도전막을 보호하는 커버패널 등의 광학부재가 적층된 구조를 가지고 있는데, 광학부재 사이의 접합에 광학 투명 점착제가 필름 형태로 사용될 수 있다. OCA 필름의 수요가 증가함에 따라, 이에 사용되는 점착 재료에 대한 관심은 더욱 높아지고 있다.A display device having a touch panel typically includes a display panel such as a liquid crystal panel, a touch panel body having a transparent conductive film made of indium tin oxide (ITO) on a surface layer, and an optical member such as a cover panel that protects the transparent conductive film. has a laminated structure, and an optically transparent adhesive may be used in the form of a film for bonding between optical members. As the demand for OCA films increases, interest in adhesive materials used therein is increasing.
기존의 광학 투명 점착제로는, 실리콘계 수지, 폴리우레탄계 수지, 올레핀계 수지와 같은 유기물을 소재로 하는 것들이 있는데, 이러한 유기물 기반의 광학 투명 점착제를 디스플레이 광학 소재에 사용하는 경우, 적층된 층 사이의 굴절률 차이로 인해 광학적 특성에 영향을 미치는 문제점이 발생할 수 있다.Existing optically transparent adhesives include those made of organic materials such as silicone-based resins, polyurethane-based resins, and olefin-based resins. Differences can cause problems affecting optical properties.
이러한 현상을 보완하기 위해, 유기물 기반의 광학 투명 점착제에 무기 입자를 혼합하여 굴절률을 상승시키는 기술이 개발되고 있으나, 유기물과 무기 입자의 혼합 시 상용성(compatibility)이 문제될 수 있다.In order to compensate for this phenomenon, a technique for increasing the refractive index by mixing inorganic particles with an organic-based optically transparent adhesive has been developed, but compatibility may be a problem when organic substances and inorganic particles are mixed.
전술한 배경기술은 발명자가 본원의 개시 내용을 도출하는 과정에서 보유하거나 습득한 것으로서, 반드시 본 출원 전에 일반 공중에 공개된 공지기술이라고 할 수는 없다.The above background art is possessed or acquired by the inventor in the process of deriving the disclosure of the present application, and cannot necessarily be said to be known art disclosed to the general public prior to the present application.
상술한 문제를 해결하기 위해, 본 발명은 유무기 하이브리드 조성물용 표면처리제를 제공하고자 한다.In order to solve the above problems, the present invention is to provide a surface treatment agent for organic-inorganic hybrid composition.
본 발명의 일 실시예에 따르면, 유무기 하이브리드 조성물을 제공하고자 한다.According to one embodiment of the present invention, it is intended to provide an organic-inorganic hybrid composition.
그러나, 본 발명이 해결하고자 하는 과제는 이상에서 언급한 과제로 제한되지 않으며, 언급되지 않은 또 다른 과제들은 아래의 기재로부터 해당 기술분야의 통상의 지식을 가진 자에게 명확하게 이해될 수 있을 것이다.However, the problem to be solved by the present invention is not limited to the problems mentioned above, and other problems not mentioned will be clearly understood by those skilled in the art from the description below.
본 발명의 일 실시예에 따른 유무기 하이브리드 조성물은, 표면처리제에 의해 표면개질된 무기 입자 및 아크릴계 모노머를 포함하고, 표면개질된 무기 입자 및 아크릴계 모노머는, 1 : 1 내지 2 : 1의 중량비를 가지는 것일 수 있다.An organic-inorganic hybrid composition according to an embodiment of the present invention includes inorganic particles surface-modified by a surface treatment agent and an acrylic monomer, and the surface-modified inorganic particles and acrylic monomer have a weight ratio of 1:1 to 2:1. may have
일 실시예에 따르면, 무기 입자는, ZrO2, SiO2, Al2O3, CeO2, ZnO, V2O5TiO2, BaTiO3, SrTiO3, BaTiO3, PbTiO3, PbZrO3, Pb(Zr,Ti)O3 (PZT), Pb1-xLaxZr1-yTiyO3 (PLZT), (1-x)Pb(Mg1/3Nb2/3)O3-xPbTiO3 (PMN-PT), HfO2 및 BN으로 이루어진 군에서 선택되는 적어도 하나를 포함하는 것일 수 있다.According to one embodiment, the inorganic particles are ZrO 2 , SiO 2 , Al 2 O 3 , CeO 2 , ZnO, V 2 O 5 TiO 2 , BaTiO 3 , SrTiO 3 , BaTiO 3 , PbTiO 3 , PbZrO 3 , Pb ( Zr,Ti)O 3 (PZT), Pb 1-x La x Zr 1-y Ti y O 3 (PLZT), (1-x)Pb(Mg 1/3 Nb 2/3 )O 3 -xPbTiO 3 ( PMN-PT), HfO 2 and may include at least one selected from the group consisting of BN.
일 실시예에 따르면, 무기 입자의 직경은, 10 ㎚ 내지 200 ㎚인 것이고, 무기 입자의 비표면적은, 1 m2/g 내지 250 m2/g인 것일 수 있다.According to one embodiment, the diameter of the inorganic particles may be 10 nm to 200 nm, and the specific surface area of the inorganic particles may be 1 m 2 /g to 250 m 2 /g.
일 실시예에 따르면, 표면개질된 무기 입자는, 조성물 중 40 중량% 내지 50 중량%인 것일 수 있다.According to one embodiment, the surface-modified inorganic particles may be 40% to 50% by weight of the composition.
일 실시예에 따르면, 아크릴계 모노머는, 부틸 아크릴레이트(butyl acrylate), 2-에틸헥실 아크릴레이트(2-ethylhexyl acrylate), 이소보닐 아크릴레이트(isobornyl acrylate) 및 4-아크릴로일 모폴린(4-acryloyl morpholine)으로 이루어진 군에서 선택되는 적어도 하나를 포함하는 것일 수 있다.According to one embodiment, the acrylic monomer is butyl acrylate, 2-ethylhexyl acrylate, isobornyl acrylate and 4-acryloyl morpholine (4-ethylhexyl acrylate). acryloyl morpholine) may include at least one selected from the group consisting of.
일 실시예에 따르면, 아크릴계 모노머는, 조성물 중 50 중량% 내지 60 중량%인 것일 수 있다.According to one embodiment, the acrylic monomer may be 50% to 60% by weight of the composition.
일 실시예에 따르면, 표면처리제는, 실란계 모노머 및 메타크릴레이트계 모노머의 공중합체인 것일 수 있다.According to one embodiment, the surface treatment agent may be a copolymer of a silane-based monomer and a methacrylate-based monomer.
일 실시예에 따르면, 실란계 모노머는, 실란, C1-C20인 알킬 실란, 알콕시 실란, 이소시아네이트 실란, 아미노 실란, 에폭시 실란, 아크릴 실란, 머캅토 실란, 불소 실란, 메타크릴옥시기 실란, 비닐 실란, 페닐 실란, 클로로 실란 및 실라잔으로 이루어진 군에서 선택되는 적어도 하나를 포함하는 것이고, 메타크릴레이트계 모노머는, 2-하이드록시에틸 메타크릴레이트(2-hydroxyethyl methacrylate, 2-HEMA), 2-하이드록시프로필 메타크릴레이트(2-hydroxypropyl methacrylate, 2-HPMA), 2-하이드록시-1-메틸에틸 메타크릴레이트(2-hydroxy-1-methylethyl methacrylate)로 이루어진 군에서 선택되는 적어도 하나를 포함하는 것일 수 있다.According to one embodiment, the silane-based monomer is silane, C 1 -C 20 Alkyl silane, alkoxy silane, isocyanate silane, amino silane, epoxy silane, acryl silane, mercapto silane, fluorine silane, methacryloxy group silane, It includes at least one selected from the group consisting of vinyl silane, phenyl silane, chloro silane, and silazane, and the methacrylate-based monomer is 2-hydroxyethyl methacrylate (2-HEMA), At least one selected from the group consisting of 2-hydroxypropyl methacrylate (2-HPMA) and 2-hydroxy-1-methylethyl methacrylate may include
일 실시예에 따르면, 표면처리제는, 하기 화학식 1 내지 화학식 3 중 어느 하나로 표시되는 화합물을 포함하는 것일 수 있다.According to one embodiment, the surface treatment agent may include a compound represented by any one of Formulas 1 to 3 below.
[화학식 1][Formula 1]
[화학식 2][Formula 2]
[화학식 3][Formula 3]
(상기 R1 내지 R3은, 각각, H, 포화 또는 불포화된 직쇄 또는 분지쇄의 C1-C20의 알킬기, 수산화기, 실란기 및 알콕시실란기 중 적어도 하나를 포함하는 것이고, 상기 R4는, H 또는 수산화기를 포함하는 것이다.)(The R 1 to R 3 are, respectively, H, a saturated or unsaturated straight-chain or branched-chain C 1 -C 20 alkyl group, a hydroxyl group, a silane group, and at least one of an alkoxysilane group, wherein R 4 is , H or containing a hydroxyl group.)
일 실시예에 따르면, 표면처리제는, 무기 입자 100 중량부에 대하여 10 중량부 내지 30 중량부로 포함되는 것일 수 있다.According to one embodiment, the surface treatment agent may be included in an amount of 10 parts by weight to 30 parts by weight based on 100 parts by weight of the inorganic particles.
일 실시예에 따르면, 조성물은, 카르복실기, 인산기, 포스폰산기, 술폰산기 및 페놀성 수산기로 이루어진 군에서 선택되는 적어도 하나의 작용기를 포함하는 분산제를 더 포함하는 것일 수 있다.According to one embodiment, the composition may further include a dispersant including at least one functional group selected from the group consisting of a carboxyl group, a phosphoric acid group, a phosphonic acid group, a sulfonic acid group, and a phenolic hydroxyl group.
일 실시예에 따르면, 분산제는, 조성물 100 중량부에 대해서 1 중량부 내지 10 중량부로 포함되는 것일 수 있다.According to one embodiment, the dispersant may be included in 1 part by weight to 10 parts by weight based on 100 parts by weight of the composition.
일 실시예에 따르면, 조성물은 분산용매를 더 포함하고, 분산용매는, 메틸에틸케톤(methyl ethyl ketone; MEK), 에탄올, 메탄올, 아세토니트릴(acetonitrile), 톨루엔(Toluene), 테트라하이드로퓨란(tetrahydrofuran, THF), 프로필렌글리콜모노에틸에테르아세테이트(propylene glycol monomethyl ether acetate, PGMEA) 및 에틸 아세테이트(ethyl acetate)로 이루어진 군에서 선택되는 적어도 하나를 포함하는 것일 수 있다.According to one embodiment, the composition further comprises a dispersing solvent, the dispersing solvent is methyl ethyl ketone (MEK), ethanol, methanol, acetonitrile (acetonitrile), toluene (Toluene), tetrahydrofuran (tetrahydrofuran) , THF), propylene glycol monoethyl ether acetate (PGMEA), and may include at least one selected from the group consisting of ethyl acetate.
일 실시예에 따르면, 표면개질된 무기 입자 및 분산용매의 중량비는, 1 : 1 내지 1 : 2인 것일 수 있다.According to one embodiment, the weight ratio of the surface-modified inorganic particles and the dispersion solvent may be 1:1 to 1:2.
일 실시예에 따르면, 분산용매는, 조성물 중 30 중량% 내지 60 중량%인 것일 수 있다.According to one embodiment, the dispersion solvent may be 30% to 60% by weight of the composition.
일 실시예에 따르면, 조성물은, 굴절률이 1.50 내지 1.80인 것이고, 점도가 180 cPs 내지 250 cPs인 것이고, 헤이즈(haze)가 15% 이하인 것일 수 있다.According to one embodiment, the composition may have a refractive index of 1.50 to 1.80, a viscosity of 180 cPs to 250 cPs, and a haze of 15% or less.
본 발명의 다른 실시예에 따른 점착 필름은, 조성물을 이용하여 제조된 점착 필름으로서, 조성물은, 표면처리제에 의해 표면개질된 무기 입자 및 아크릴계 모노머를 포함하고, 표면개질된 무기 입자 및 아크릴계 모노머는, 1 : 1 내지 2 : 1의 중량비를 가지는 것일 수 있다.An adhesive film according to another embodiment of the present invention is an adhesive film prepared using a composition, wherein the composition includes inorganic particles and acrylic monomers surface-modified by a surface treatment agent, and the surface-modified inorganic particles and acrylic monomers are , 1: 1 to 2: may have a weight ratio of 1.
본 발명은 유무기 하이브리드 조성물용 표면처리제를 제공할 수 있다.The present invention may provide a surface treatment agent for an organic-inorganic hybrid composition.
본 발명의 일 실시예에 따르면, 유무기 하이브리드 조성물을 제공할 수 있다.According to one embodiment of the present invention, an organic-inorganic hybrid composition may be provided.
이하를 참조하여 실시예들을 상세하게 설명한다. 그러나, 실시예들에는 다양한 변경이 가해질 수 있어서 특허출원의 권리 범위가 이러한 실시예들에 의해 제한되거나 한정되는 것은 아니다. 실시예들에 대한 모든 변경, 균등물 내지 대체물이 권리 범위에 포함되는 것으로 이해되어야 한다.The embodiments are described in detail with reference to the following. However, since various changes can be made to the embodiments, the scope of the patent application is not limited or limited by these embodiments. It should be understood that all changes, equivalents or substitutes to the embodiments are included within the scope of rights.
실시예에서 사용한 용어는 단지 설명을 목적으로 사용된 것으로, 한정하려는 의도로 해석되어서는 안 된다. 단수의 표현은 문맥상 명백하게 다르게 뜻하지 않는 한, 복수의 표현을 포함한다. 본 명세서에서, "포함하다" 또는 "가지다" 등의 용어는 명세서 상에 기재된 특징, 숫자, 단계, 동작, 구성요소, 부품 또는 이들을 조합한 것이 존재함을 지정하려는 것이지, 하나 또는 그 이상의 다른 특징들이나 숫자, 단계, 동작, 구성요소, 부품 또는 이들을 조합한 것들의 존재 또는 부가 가능성을 미리 배제하지 않는 것으로 이해되어야 한다.Terms used in the examples are used only for the purpose of explanation and should not be construed as limiting. Singular expressions include plural expressions unless the context clearly dictates otherwise. In this specification, terms such as "include" or "have" are intended to designate that there is a feature, number, step, operation, component, part, or combination thereof described in the specification, but one or more other features It should be understood that the presence or addition of numbers, steps, operations, components, parts, or combinations thereof is not precluded.
다르게 정의되지 않는 한, 기술적이거나 과학적인 용어를 포함해서 여기서 사용되는 모든 용어들은 실시예가 속하는 기술 분야에서 통상의 지식을 가진 자에 의해 일반적으로 이해되는 것과 동일한 의미를 가지고 있다. 일반적으로 사용되는 사전에 정의되어 있는 것과 같은 용어들은 관련 기술의 문맥 상 가지는 의미와 일치하는 의미를 가지는 것으로 해석되어야 하며, 본 출원에서 명백하게 정의하지 않는 한, 이상적이거나 과도하게 형식적인 의미로 해석되지 않는다.Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by a person of ordinary skill in the art to which the embodiment belongs. Terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with the meaning in the context of the related art, and unless explicitly defined in the present application, they should not be interpreted in an ideal or excessively formal meaning. don't
또한, 실시예의 구성요소를 설명하는 데 있어서, 제1, 제2, A, B, (a), (b) 등의 용어를 사용할 수 있다. 이러한 용어는 그 구성요소를 다른 구성요소와 구별하기 위한 것일 뿐, 그 용어에 의해 해당 구성요소의 본질이나 차례 또는 순서 등이 한정되지 않는다. 어떤 구성요소가 다른 구성요소에 "연결", "결합" 또는 "접속"된다고 기재된 경우, 그 구성요소는 그 다른 구성요소에 직접적으로 연결되거나 접속될 수 있지만, 각 구성요소 사이에 또 다른 구성요소가 "연결", "결합" 또는 "접속"될 수도 있다고 이해되어야 할 것이다.In addition, in describing the components of the embodiment, terms such as first, second, A, B, (a), (b) may be used. These terms are only used to distinguish the component from other components, and the nature, sequence, or order of the corresponding component is not limited by the term. When an element is described as being “connected”, “coupled” or “connected” to another element, the element may be directly connected or connected to the other element, but there may be another element between the elements. It should be understood that may be "connected", "coupled" or "connected".
어느 하나의 실시예에 포함된 구성요소와, 공통적인 기능을 포함하는 구성요소는, 다른 실시 예에서 동일한 명칭을 사용하여 설명하기로 한다. 반대되는 기재가 없는 이상, 어느 하나의 실시 예에 기재한 설명은 다른 실시 예에도 적용될 수 있으며, 중복되는 범위에서 구체적인 설명은 생략하기로 한다.Components included in one embodiment and components including common functions will be described using the same names in other embodiments. Unless stated to the contrary, descriptions described in one embodiment may be applied to other embodiments, and detailed descriptions will be omitted to the extent of overlap.
본 발명의 일 실시예에 따른 유무기 하이브리드 조성물은, 표면처리제에 의해 표면개질된 무기 입자, 및 아크릴계 모노머를 포함할 수 있다. 일 실시예에 따르면, 유무기 하이브리드 조성물을 경화하여 점착 필름을 형성할 수 있으며, 본 발명에 따르면 유무기 하이브리드 조성물은, 광학적으로 투명하거나, 실질적으로 광학적으로 투명한 무기 입자 분산 조성물을 제공할 수 있다.The organic-inorganic hybrid composition according to an embodiment of the present invention may include inorganic particles surface-modified by a surface treatment agent and an acrylic monomer. According to one embodiment, an adhesive film may be formed by curing the organic-inorganic hybrid composition, and according to the present invention, the organic-inorganic hybrid composition may provide an optically transparent or substantially optically transparent inorganic particle dispersion composition. .
일 실시예에 따르면, 무기 입자의 분산성을 향상시키기 위해 표면처리제를 이용하여 무기 입자의 표면을 개질할 수 있고, 조성물 내에서 고루 분산됨에 따라 광학적으로 투명한 무기 입자 분산 조성물을 제공할 수 있다.According to one embodiment, the surface of the inorganic particles may be modified using a surface treatment agent to improve the dispersibility of the inorganic particles, and as they are evenly dispersed in the composition, an optically transparent inorganic particle dispersion composition may be provided.
일 실시예에 따르면, 표면개질된 무기 입자 및 아크릴계 모노머는, 1 : 1 내지 2 : 1의 중량비를 가질 수 있다. 일 실시예에 따르면, 아크릴계 모노머의 중량이 표면개질된 무기 입자의 중량에 비해 같거나 큰 것이 바람직할 수 있다.According to one embodiment, the surface-modified inorganic particles and the acrylic monomer may have a weight ratio of 1:1 to 2:1. According to one embodiment, it may be preferable that the weight of the acrylic monomer is equal to or greater than the weight of the surface-modified inorganic particles.
일 실시예에 따르면, 무기 입자는 금속 산화물인 것일 수 있다. 일 실시예에 따르면, 무기 입자는 금속 산화물로서, 투명한 고분자 수지 내에 포함되어 굴절률을 증가시킬 수 있다.According to one embodiment, the inorganic particle may be a metal oxide. According to one embodiment, the inorganic particles are metal oxides and may be included in a transparent polymer resin to increase refractive index.
일 실시예에 따르면, 무기 입자는 ZrO2, SiO2, Al2O3, CeO2, ZnO, V2O5TiO2, BaTiO3, SrTiO3, BaTiO3, PbTiO3, PbZrO3, Pb(Zr,Ti)O3 (PZT), Pb1-xLaxZr1-yTiyO3 (PLZT), (1-x)Pb(Mg1/3Nb2/3)O3-xPbTiO3 (PMN-PT), HfO2 및 BN으로 이루어진 군에서 선택되는 적어도 하나를 포함하는 것일 수 있다.According to one embodiment, the inorganic particles are ZrO 2 , SiO 2 , Al 2 O 3 , CeO 2 , ZnO, V 2 O 5 TiO 2 , BaTiO 3 , SrTiO 3 , BaTiO 3 , PbTiO 3 , PbZrO 3 , Pb(Zr ,Ti)O 3 (PZT), Pb 1-x La x Zr 1-y Ti y O 3 (PLZT), (1-x)Pb(Mg 1/3 Nb 2/3 )O 3 -xPbTiO 3 (PMN -PT), HfO 2 It may include at least one selected from the group consisting of and BN.
일 실시예에 따르면, 무기 입자는, 바람직하게는 지르코니아(ZrO2)를 포함할 수 있다. 지르코니아는 투명하고, 아베 수(Abbe number)가 높으며, 기계적 강도와 열적 안정성이 우수하여 본 발명의 일 실시예에 따른 조성물에 적합한 것일 수 있다.According to one embodiment, the inorganic particles may preferably include zirconia (ZrO 2 ). Zirconia may be suitable for the composition according to an embodiment of the present invention because it is transparent, has a high Abbe number, and has excellent mechanical strength and thermal stability.
일 실시예에 따르면, 무기 입자는, 나노 무기 입자에 해당하는 것일 수 있다. 일 실시예에 따르면, 무기 입자의 직경은, 10 ㎚ 내지 200 ㎚일 수 있다. 이 때, 무기 입자의 직경은, 무기 입자의 직경의 평균을 의미하는 것일 수 있다. 또한, 무기 입자의 직경은, 표면처리제로 표면개질되지 않은 무기 입자의 직경을 의미하는 것일 수 있다.According to one embodiment, the inorganic particles may correspond to nano-inorganic particles. According to one embodiment, the diameter of the inorganic particles may be 10 nm to 200 nm. In this case, the diameter of the inorganic particles may mean an average of the diameters of the inorganic particles. Also, the diameter of the inorganic particle may mean the diameter of the inorganic particle whose surface is not modified with a surface treatment agent.
일 실시예에 따르면, 무기 입자의 직경은, 10 ㎚ 이상, 20 ㎚ 이상, 30 ㎚ 이상, 40 ㎚ 이상, 50 ㎚ 이상, 60 ㎚ 이상, 70 ㎚ 이상, 80 ㎚ 이상, 90 ㎚ 이상, 100 ㎚ 이상, 110 ㎚ 이상, 120 ㎚ 이상, 130 ㎚ 이상, 140 ㎚ 이상, 150 ㎚ 이상, 160 ㎚ 이상, 170 ㎚ 이상, 180 ㎚ 이상, 또는 190 ㎚ 이상이거나, 200 ㎚ 이하, 190 ㎚ 이하, 180 ㎚ 이하, 170 ㎚ 이하, 160 ㎚ 이하, 150 ㎚ 이하, 140 ㎚ 이하, 130 ㎚ 이하, 120 ㎚ 이하, 110 ㎚ 이하, 100 ㎚ 이하, 90 ㎚ 이하, 80 ㎚ 이하, 70 ㎚ 이하, 또는 60 ㎚ 이하이거나, 상기 언급된 수치들 중 선택되는 두 값 사이의 범위에 포함될 수 있다.According to one embodiment, the diameter of the inorganic particles is 10 nm or more, 20 nm or more, 30 nm or more, 40 nm or more, 50 nm or more, 60 nm or more, 70 nm or more, 80 nm or more, 90 nm or more, 100 nm or more. 110 nm or more, 120 nm or more, 130 nm or more, 140 nm or more, 150 nm or more, 160 nm or more, 170 nm or more, 180 nm or more, or 190 nm or more, or 200 nm or less, 190 nm or less, 180 nm or less, 170 nm or less, 160 nm or less, 150 nm or less, 140 nm or less, 130 nm or less, 120 nm or less, 110 nm or less, 100 nm or less, 90 nm or less, 80 nm or less, 70 nm or less, or 60 nm or less. , or may be included in a range between two values selected from the above-mentioned numerical values.
일 실시예에 따르면, 무기 입자의 직경이 10 ㎚ 미만인 경우 무기 입자의 표면에너지 증대로 인하여 분산이 어려울 수 있고, 200 ㎚ 초과인 경우 산란 효과가 발현되어 점착 필름의 시인성이 저하되고, 점착 필름의 두께가 증가할 수 있다.According to one embodiment, when the diameter of the inorganic particles is less than 10 nm, dispersion may be difficult due to the increase in the surface energy of the inorganic particles, and when the diameter is greater than 200 nm, a scattering effect is developed, resulting in deterioration in the visibility of the adhesive film. Thickness may increase.
일 실시예에 따르면, 무기 입자의 비표면적은, 1 m2/g 내지 250 m2/g일 수 있다. 이 때, 무기 입자의 비표면적은, 무기 입자의 비표면적의 평균을 의미하는 것일 수 있다. 또한, 무기 입자의 비표면적은, 표면처리제로 표면개질되지 않은 무기 입자의 비표면적을 측정하는 것일 수 있다.According to one embodiment, the specific surface area of the inorganic particles may be 1 m 2 /g to 250 m 2 /g. At this time, the specific surface area of the inorganic particles may mean the average of the specific surface areas of the inorganic particles. In addition, the specific surface area of the inorganic particles may be a measurement of the specific surface area of inorganic particles that are not surface-modified with a surface treatment agent.
일 실시예에 따르면, 무기 입자의 비표면적은, 1 m2/g 이상, 10 m2/g 이상, 30 m2/g 이상, 50 m2/g 이상, 70 m2/g 이상, 90 m2/g 이상, 110 m2/g 이상, 130 m2/g 이상, 150 m2/g 이상, 170 m2/g 이상, 190 m2/g 이상, 210 m2/g 이상, 또는 230 m2/g 이상이거나, 250 m2/g 이하, 230 m2/g 이하, 210 m2/g 이하, 190 m2/g 이하, 170 m2/g 이하, 150 m2/g 이하, 130 m2/g 이하, 110 m2/g 이하, 90 m2/g 이하, 또는 70 m2/g 이하이거나, 상기 언급된 수치들 중 선택되는 두 값 사이의 범위에 포함될 수 있다.According to one embodiment, the specific surface area of the inorganic particles is 1 m 2 /g or more, 10 m 2 /g or more, 30 m 2 /g or more, 50 m 2 /g or more, 70 m 2 /g or more, or 90 m 2 /g or more. 2 /g or more, 110 m 2 /g or more, 130 m 2 /g or more, 150 m 2 /g or more, 170 m 2 /g or more, 190 m 2 /g or more, 210 m 2 / g or more, or 230 m 2 /g or more, 250 m 2 /g or less, 230 m 2 /g or less, 210 m 2 /g or less, 190 m 2 /g or less, 170 m 2 /g or less, 150 m 2 /g or less, 130 m 2 /g or less, 110 m 2 /g or less, 90 m 2 /g or less, or 70 m 2 /g or less, or may be included in a range between two values selected from the above-mentioned values.
일 실시예에 따르면, 무기 입자의 비표면적이 상기 수치 범위를 벗어나는 경우, 투과율이 저하되거나 산란에 따른 품질 저하가 발생할 수 있고, 응집이 형성될 수 있다.According to one embodiment, when the specific surface area of the inorganic particles is out of the above range, transmittance may be lowered or quality may be deteriorated due to scattering, and agglomerates may be formed.
일 실시예에 따르면, 표면개질된 무기 입자는, 조성물 중 40 중량% 내지 50 중량%일 수 있다. 일 실시예에 따르면, 표면개질된 무기 입자는, 40 중량% 내지 45 중량%, 또는 45 중량% 내지 50 중량%일 수 있다.According to one embodiment, the surface-modified inorganic particles may be 40% to 50% by weight of the composition. According to one embodiment, the amount of the surface-modified inorganic particles may be 40% to 45% by weight, or 45% to 50% by weight.
일 실시예에 따르면, 조성물 중 표면개질된 무기 입자가 40 중량% 미만인 경우 조성물 내에서 무기 입자의 상대적 비율이 낮아져 조성물의 굴절률 및 휘도가 감소할 수 있고, 50 중량% 초과인 경우 추후 점착 필름의 제조 시 백탁 현상이 나타날 수 있다.According to one embodiment, when the surface-modified inorganic particles in the composition is less than 40% by weight, the relative ratio of the inorganic particles in the composition is lowered, thereby reducing the refractive index and luminance of the composition. Cloudiness may occur during manufacturing.
일 실시예에 따르면, 아크릴계 모노머는, 부틸 아크릴레이트(butyl acrylate), 2-에틸헥실 아크릴레이트(2-ethylhexyl acrylate), 이소보닐 아크릴레이트(isobonyl acrylate) 및 4-아크릴로일 모폴린(4-acryloyl morpholine)으로 이루어진 군에서 선택되는 적어도 하나를 포함하는 것일 수 있다.According to one embodiment, the acrylic monomer is butyl acrylate, 2-ethylhexyl acrylate, isobonyl acrylate and 4-acryloyl morpholine (4-ethylhexyl acrylate). acryloyl morpholine) may include at least one selected from the group consisting of.
본 발명의 일 실시예에 따른 조성물을 경화시켜 점착 필름을 제조할 수 있는데, 아크릴계 모노머를 적용함으로써 유연하면서도 광학적으로 우수한 점착 필름을 제조할 수 있다.An adhesive film may be prepared by curing the composition according to an embodiment of the present invention, and a flexible and optically excellent adhesive film may be prepared by applying an acrylic monomer.
일 실시예에 따르면, 아크릴계 모노머는, 조성물 중 50 중량% 내지 60 중량%일 수 있다. 일 실시예에 따르면, 아크릴계 모노머는, 50 중량% 내지 55 중량%, 또는 55 중량% 내지 60 중량%일 수 있다.According to one embodiment, the acrylic monomer may be 50% to 60% by weight of the composition. According to one embodiment, the acrylic monomer may be 50% to 55% by weight, or 55% to 60% by weight.
일 실시예에 따르면, 아크릴계 모노머가 조성물 중 50 중량% 미만인 경우 무기 입자의 비율이 높아져 점도가 상승할 수 있고, 60 중량% 초과인 경우 무기 입자의 비율이 낮아져 점착 필름의 굴절률 및 휘도가 저하되고, 백탁 현상이 발생할 수 있다.According to one embodiment, when the acrylic monomer is less than 50% by weight of the composition, the ratio of inorganic particles increases and the viscosity may increase. , cloudiness may occur.
일 실시예에 따르면, 표면처리제는, 실란계 모노머 및 메타크릴레이트계 모노머의 공중합체일 수 있다. 구체적으로, 표면처리제는, 실란계 모노머 및 메타크릴레이트계 모노머의 랜덤 코폴리머인 것일 수 있다.According to one embodiment, the surface treatment agent may be a copolymer of a silane-based monomer and a methacrylate-based monomer. Specifically, the surface treatment agent may be a random copolymer of a silane-based monomer and a methacrylate-based monomer.
일 실시예에 따르면, 실란계 모노머는, 실란, C1-C20인 알킬 실란, 알콕시 실란, 이소시아네이트 실란, 아미노 실란, 에폭시 실란, 아크릴 실란, 머캅토 실란, 불소 실란, 메타크릴옥시기 실란, 비닐 실란, 페닐 실란, 클로로 실란 및 실라잔으로 이루어진 군에서 선택되는 적어도 하나를 포함할 수 있다.According to one embodiment, the silane-based monomer is silane, C 1 -C 20 Alkyl silane, alkoxy silane, isocyanate silane, amino silane, epoxy silane, acryl silane, mercapto silane, fluorine silane, methacryloxy group silane, It may include at least one selected from the group consisting of vinyl silane, phenyl silane, chloro silane, and silazane.
일 실시예에 따르면, 실란계 모노머는, 구체적으로, 비닐트리메톡시실란(vinyltrimethoxysilane), 비닐트리에톡시실란(vinyltriethoxysilane), 비닐트리스(2-메톡시에톡시)실란(vinyltris(2-methoxyethoxy)silane)으로 이루어진 군에서 선택되는 적어도 하나를 포함하는 비닐기 함유 실란계 모노머, 3-메타크릴옥시프로필트리메톡시실란(3-methacryloxypropyltrimethoxysilane, MPTMS), 3-메타크릴옥시프로필트리에톡시실란(3-methacryloxypropyltriethoxysilane, MPTES), 3-메타크릴옥시프로필메틸디메톡시실란(3-methacryloxypropylmethyldimethoxysilane) 및 3-메타크릴옥시프로필메틸디에톡시실란(3-methacryloxypropylmethyldiethoxysilane)으로 이루어진 군에서 선택되는 적어도 하나를 포함하는 메타크릴옥시기 함유 실란계 모노머, 비닐트리아세톡시실란(vinyltriacetoxysilane)을 포함하는 아세톡시기 함유 실란계 모노머, 3-아크릴옥시프로필트리메톡시실란(3-acryloxypropyltrimethoxysilane, APTMS), 3-아크릴옥시프로필트리에톡시실란(3-acryloxypropyltriethoxysilane) 또는 이 둘을 포함하는 아크릴옥시기 함유 실란계 모노머, 3-글리시독시프로필트리메톡시실란(3-glycidoxypropyltrimethoxysilane, GPTMS),3-글리시독시프로필트리에톡시실란(3-glycidoxypropyltriethoxysilane, GPTES), 3-글리시독시프로필메틸디메톡시실란(3-glycidoxypropylmethyldimethoxysilane), 3-글리시독시프로필메틸디에톡시실란(3-glycidoxypropylmethyldiethoxysilane), 2-(3,4-에폭시시클로헥실)에틸트리메톡시실란(2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane)으로 이루어진 군에서 선택되는 적어도 하나를 포함하는 에폭시기 함유 실란계 모노머, 비닐트리클로로실란(vinyltrichlorosilane)을 포함하는 클로로기 함유 실란계 모노머, 3-머캅토프로필트리메톡시실란(3-mercaptopropyltrimethoxysilane), 3-머캅토프로필트리에톡시실란(3-mercaptopropyltriethoxysilane), 3-머캅토프로필메틸디메톡시실란(3-mercaptopropylmethyldimethoxysilane) 및 3-머캅토프로필메틸디에톡시실란(3-mercaptopropylmethyldiethoxysilane)으로 이루어진 군에서 선택되는 적어도 하나를 포함하는 머캅토기 함유 실란계 모노머, 3-트리메톡시실릴프로필 숙신산 무수물(3-trimethoxysilylpropyl succinic anhydride), 3-트리에톡시실릴프로필 숙신산 무수물(3-triethoxysilylpropyl succinic anhydride)을 포함하는 산무수물기 함유 실란계 모노머, 3-아미노프로필트리메톡시실란(3-aminopropyltrimethoxysilane), 3-아미노프로필트리에톡시실란(3-aminopropyltriethoxysilane) 및 N-2-(아미노에틸)-3-아미노프로필트리메톡시실란(N-2-(aminoethyl)-3-aminopropyltrimethoxysilane)으로 이루어진 군에서 선택되는 적어도 하나를 포함하는 아미노기 함유 실란계 모노머, 및 3-이소시아네이트프로필트리메톡시실란(3-isocyanatopropyltrimethoxysilane), 3-이소시아네이트프로필트리에톡시실란(3-isocyanatopropyltriethoxysilane) 또는 이 둘을 포함하는 이소시아네이트기 함유 실란계 모노머로 이루어진 군으로부터 선택되는 적어도 어느 하나를 포함하는 것일 수 있다. 일 실시예에 따르면, 실란계 모노머는, 실란 커플링제인 것일 수 있다.According to one embodiment, the silane-based monomer is, specifically, vinyltrimethoxysilane, vinyltriethoxysilane, vinyltris (2-methoxyethoxy) silane (vinyltris (2-methoxyethoxy)) silane) containing at least one vinyl group-containing silane-based monomer selected from the group consisting of 3-methacryloxypropyltrimethoxysilane (MPTMS), 3-methacryloxypropyltriethoxysilane (3 -Methacryloxypropyltriethoxysilane (MPTES), 3-methacryloxypropylmethyldimethoxysilane, and 3-methacryloxypropylmethyldiethoxysilane (methacryloxypropylmethyldiethoxysilane). Silane-based monomers containing an oxy group, silane-based monomers containing an acetoxy group including vinyltriacetoxysilane, 3-acryloxypropyltrimethoxysilane (APTMS), 3-acryloxypropyltriene Toxysilane (3-acryloxypropyltriethoxysilane) or an acryloxy group-containing silane-based monomer including the two, 3-glycidoxypropyltrimethoxysilane (GPTMS), 3-glycidoxypropyltriethoxysilane ( 3-glycidoxypropyltriethoxysilane (GPTES), 3-glycidoxypropylmethyldimethoxysilane, 3-glycidoxypropylmethyldiethoxysilane, 2-(3,4-epoxycyclohexyl) A silane-based monomer containing an epoxy group containing at least one selected from the group consisting of ethyltrimethoxysilane (2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane), a silane-based monomer containing a chloro group including vinyltrichlorosilane , 3-mercaptopropyltrimethoxysilane, 3-mercaptopropyltriethoxysilane, 3-mercaptopropylmethyldimethoxysilane, and 3-mercaptopropyltriethoxysilane. A mercapto group-containing silane-based monomer containing at least one selected from the group consisting of 3-mercaptopropylmethyldiethoxysilane, 3-trimethoxysilylpropyl succinic anhydride, and 3-triethoxy A silane-based monomer containing an acid anhydride group including 3-triethoxysilylpropyl succinic anhydride, 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, and An amino group-containing silane-based monomer containing at least one selected from the group consisting of N-2-(aminoethyl)-3-aminopropyltrimethoxysilane, and 3- Isocyanate propyltrimethoxysilane (3-isocyanatopropyltrimethoxysilane), 3-isocyanate propyltriethoxysilane (3-isocyanatopropyltriethoxysilane), or isocyanate group-containing silane-based monomers including the two containing at least one selected from the group consisting of can According to one embodiment, the silane-based monomer may be a silane coupling agent.
일 실시예에 따르면, 메타크릴레이트계 모노머는, 2-하이드록시에틸 메타크릴레이트(2-hydroxyethyl methacrylate, 2-HEMA), 2-하이드록시프로필 메타크릴레이트(2-hydroxypropyl methacrylate, 2-HPMA), 2-하이드록시-1-메틸에틸 메타크릴레이트(2-hydroxy-1-methylethyl methacrylate)로 이루어진 군에서 선택되는 적어도 하나를 포함할 수 있다.According to one embodiment, the methacrylate-based monomer is 2-hydroxyethyl methacrylate (2-HEMA), 2-hydroxypropyl methacrylate (2-hydroxypropyl methacrylate, 2-HPMA) , 2-hydroxy-1-methylethyl methacrylate (2-hydroxy-1-methylethyl methacrylate) may include at least one selected from the group consisting of.
일 실시예에 따르면, 표면처리제는, 하기 화학식 1 내지 화학식 3 중 어느 하나로 표시되는 화합물을 포함하는 것일 수 있다.According to one embodiment, the surface treatment agent may include a compound represented by any one of Formulas 1 to 3 below.
[화학식 1][Formula 1]
[화학식 2][Formula 2]
[화학식 3][Formula 3]
이 때, 상기 R1 내지 R3은, 각각, H, 포화 또는 불포화된 직쇄 또는 분지쇄의 C1-C20의 알킬기, 수산화기, 실란기 및 알콕시실란기 중 적어도 하나를 포함하는 것이고, 상기 R4는, H 또는 수산화기를 포함하는 것일 수 있다.At this time, the R 1 to R 3 are, respectively, H, a saturated or unsaturated straight or branched chain C 1 -C 20 alkyl group, a hydroxyl group, a silane group and an alkoxysilane group including at least one of, wherein the R 4 may contain H or a hydroxyl group.
일 실시예에 따르면, 예를 들어, R1 내지 R3은, 각각, C2-C12의 알킬트리메톡시실란기, C2-C12의 알킬트리에톡시실란기 및 C2-C12의 알킬디메톡시에톡시실란기로 이루어진 군에서 선택되는 적어도 하나를 포함할 수 있다. 예를 들어, R1 내지 R3은, 각각, 에틸트리메톡시실란기, 프로필트리메톡시실란기, 부틸트리메톡시실란기, 펜틸트리메톡시실란기, 헥실트리메톡시실란기, 헵틸트리메톡시실란기, 옥틸트리메톡시실란기, 노닐트리메톡시실란기, 데실트리메톡시실란기, 운데실트리메톡시실란기, 도데실트리메톡시실란기, 에틸트리에톡시실란기, 프로필트리에톡시실란기, 부틸트리에톡시실란기, 펜틸트리에톡시실란기, 헥실트리에톡시실란기, 헵틸트리에톡시실란기, 옥틸트리에톡시실란기, 노닐트리에톡시실란기, 데실트리에톡시실란기, 운데실트리에톡시실란기, 도데실트리에톡시실란기, 에틸디메톡시에톡시실란기, 프로필디메톡시에톡시실란기, 부틸디메톡시에톡시실란기, 펜틸디메톡시에톡시실란기, 헥실디메톡시에톡시실란기, 헵틸디메톡시에톡시실란기, 옥틸디메톡시에톡시실란기, 노닐디메톡시에톡시실란기, 데실디메톡시에톡시실란기, 운데실디메톡시에톡시실란기 및 도데실디메톡시에톡시실란기로 이루어진 군에서 선택되는 적어도 하나를 포함할 수 있다.According to one embodiment, for example, R 1 to R 3 are, respectively, a C 2 -C 12 alkyltrimethoxysilane group, a C 2 -C 12 alkyltriethoxysilane group and a C 2 -C 12 It may include at least one selected from the group consisting of an alkyldimethoxyethoxysilane group. For example, R1 to R3 are ethyltrimethoxysilane, propyltrimethoxysilane, butyltrimethoxysilane, pentyltrimethoxysilane, hexyltrimethoxysilane, heptyltrimethoxy, respectively. Silane group, octyltrimethoxysilane group, nonyltrimethoxysilane group, decyltrimethoxysilane group, undecyltrimethoxysilane group, dodecyltrimethoxysilane group, ethyltriethoxysilane group, propyl trie Toxysilane group, butyltriethoxysilane group, pentyltriethoxysilane group, hexyltriethoxysilane group, heptyltriethoxysilane group, octyltriethoxysilane group, nonyltriethoxysilane group, decyltriethoxy Silane group, undecyltriethoxysilane group, dodecyltriethoxysilane group, ethyldimethoxyethoxysilane group, propyldimethoxyethoxysilane group, butyldimethoxyethoxysilane group, pentyldimethoxyethoxysilane group , Hexyldimethoxyethoxysilane group, heptyldimethoxyethoxysilane group, octyldimethoxyethoxysilane group, nonyldimethoxyethoxysilane group, decyldimethoxyethoxysilane group, undecyldimethoxyethoxysilane group, and It may include at least one selected from the group consisting of a dodecyldimethoxyethoxysilane group.
일 실시예에 따르면, R4는, 메타크릴기와 연결되는 부분의 반대쪽 말단에 H 원자 또는 수산화기가 형성되는 것일 수 있다. 일 실시예에 따르면, 예를 들어, R4는, H, 2-하이드록시에틸기, 3-하이드록시프로필기 및 2-하이드록시부틸기로 이루어진 군에서 선택되는 적어도 하나를 포함할 수 있다.According to one embodiment, R 4 may be one in which an H atom or a hydroxyl group is formed at the opposite end of the portion connected to the methacrylic group. According to one embodiment, for example, R 4 may include at least one selected from the group consisting of H, a 2-hydroxyethyl group, a 3-hydroxypropyl group, and a 2-hydroxybutyl group.
일 실시예에 따르면, 표면처리제는, 상이한 두 메타크릴레이트계 모노머의 공중합체이거나, 아크릴레이트계 모노머와 메타크릴레이트계 모노머의 공중합체이거나, 에폭시계 모노머 및 메타크릴레이트계 모노머의 공중합체일 수 있다.According to one embodiment, the surface treatment agent may be a copolymer of two different methacrylate-based monomers, a copolymer of an acrylate-based monomer and a methacrylate-based monomer, or a copolymer of an epoxy-based monomer and a methacrylate-based monomer. can
일 실시예에 따르면, 상기 화학식 1 내지 화학식 3 중 어느 하나로 표시되는 화합물을 포함하는 조성물용 표면처리제는, m과 n의 비율에 따라 표면처리제의 특성이 결정될 수 있다. 일 실시예에 따르면, m과 n은 1 : 2 내지 2 : 1 사이의 정수비를 가지는 것일 수 있다. 예를 들어, m과 n은 1 : 1, 3 : 2, 2 : 3, 4 : 3, 5 : 3, 3 : 4, 5 : 4, 또는 7 : 4와 같은 정수비를 가지는 것일 수 있다.According to one embodiment, the surface treatment agent for a composition including a compound represented by any one of Formulas 1 to 3 may have characteristics of the surface treatment agent determined according to the ratio of m and n. According to one embodiment, m and n may have an integer ratio between 1:2 and 2:1. For example, m and n may have an integer ratio such as 1:1, 3:2, 2:3, 4:3, 5:3, 3:4, 5:4, or 7:4.
일 실시예에 따르면, 표면처리제는, 무기 입자 100 중량부에 대하여 10 중량부 내지 30 중량부로 포함될 수 있다. 일 실시예에 따르면, 표면처리제가 무기 입자 100 중량부에 대하여 10 중량부 미만인 경우 분산성이 저하될 수 있고, 30 중량부 초과인 경우 필름 제조 시 경화가 원활하지 않을 수 있다.According to one embodiment, the surface treatment agent may be included in an amount of 10 parts by weight to 30 parts by weight based on 100 parts by weight of the inorganic particles. According to one embodiment, when the amount of the surface treatment agent is less than 10 parts by weight based on 100 parts by weight of the inorganic particles, dispersibility may be lowered, and when it is greater than 30 parts by weight, curing may not be smooth during film manufacture.
일 실시예에 따르면, 표면처리제는, BPO(benzoyl peroxide), AIBN(azobisisobutyronitrile) 및 AIBA(2,2'-azobis(2-methylpropionamidine)로 이루어진 군에서 선택되는 적어도 하나의 중합개시제를 더 포함할 수 있다. 일 실시예에 따르면, 중합개시제는 퍼록사이드계 화합물, 아조 화합물 또는 둘 다를 포함할 수 있다.According to one embodiment, the surface treatment agent may further include at least one polymerization initiator selected from the group consisting of benzoyl peroxide (BPO), azobisisobutyronitrile (AIBN), and AIBA (2,2'-azobis (2-methylpropionamidine)). According to one embodiment, the polymerization initiator may include a peroxide-based compound, an azo compound, or both.
일 실시예에 따르면, 중합개시제는, 표면처리제 중 0.1 중량% 내지 1 중량%일 수 있다. 일 실시예에 따르면, 중합개시제가 0.1 중량% 미만인 경우 공중합이 일부만 진행될 수 있고, 중합개시제의 함량이 1 중량%를 초과하는 경우 표면처리제 내 여분(excess)의 중합개시제가 분포하게 되어 불순물로서 기능할 수 있다.According to one embodiment, the polymerization initiator may be 0.1% to 1% by weight of the surface treatment agent. According to one embodiment, when the polymerization initiator is less than 0.1% by weight, copolymerization may proceed partially, and when the content of the polymerization initiator exceeds 1% by weight, the excess polymerization initiator in the surface treatment agent is distributed and functions as an impurity can do.
일 실시예에 따르면, 표면처리제의 광투과율은, 40% 이상일 수 있다.According to one embodiment, the light transmittance of the surface treatment agent may be 40% or more.
일 실시예에 따르면, 표면처리제의 광투과율은, 40% 이상이거나, 42% 이상이거나, 45% 이상이거나, 50% 이상일 수 있다.According to one embodiment, the light transmittance of the surface treatment agent may be 40% or more, 42% or more, 45% or more, or 50% or more.
일 실시예에 따르면, 표면처리제의 헤이즈(haze)는, 80% 이하일 수 있다.According to one embodiment, the haze of the surface treatment agent may be 80% or less.
일 실시예에 따르면, 표면처리제의 헤이즈는, 80% 이하이거나, 70% 이하이거나, 60% 이하이거나, 50% 이하일 수 있다.According to one embodiment, the haze of the surface treatment agent may be 80% or less, 70% or less, 60% or less, or 50% or less.
일 실시예에 따르면, 조성물은, 카르복실기, 인산기, 포스폰산기, 술폰산기 및 페놀성 수산기로 이루어진 군에서 선택되는 적어도 하나의 작용기를 포함하는 분산제를 더 포함할 수 있다. 일 실시예에 따르면, 분산제는, 바람직하게는, 카르복실기를 포함할 수 있다.According to one embodiment, the composition may further include a dispersant including at least one functional group selected from the group consisting of a carboxyl group, a phosphoric acid group, a phosphonic acid group, a sulfonic acid group, and a phenolic hydroxyl group. According to one embodiment, the dispersant may preferably include a carboxyl group.
일 실시예에 따르면, 분산제는, 시판 제품으로부터 입수 가능한 것일 수 있다. 일 실시예에 따르면, 분산제는, 다음과 같은 상표명 하의 분산제로서, DISPERBYK, DISPERBYK-101, DISPERBYK-102, DISPERBYK-103, DISPERBYK-106, DISPERBYK-107, DISPERBYK-108, DISPERBYK-109, DISPERBYK-110, DISPERBYK-111, DISPERBYK-112, DISPERBYK-115, DISPERBYK-116, DISPERBYK-118, DISPERBYK-130, DISPERBYK-140, DISPERBYK-142, DISPERBYK-145, DISPERBYK-160, DISPERBYK-161, DISPERBYK-162, DISPERBYK-163, DISPERBYK-164, DISPERBYK-165, DISPERBYK-166, DISPERBYK-167, DISPERBYK-168, DISPERBYK-169, DISPERBYK-170, DISPERBYK-171, DISPERBYK-174, DISPERBYK-176, DISPERBYK-180, DISPERBYK-181, DISPERBYK-182, DISPERBYK-183, DISPERBYK-184, DISPERBYK-185, DISPERBYK-187, DISPERBYK-190, DISPERBYK-191, DISPERBYK-192, DISPERBYK-193, DISPERBYK-194, DISPERBYK-2000, DISPERBYK-2001, DISPERBYK-2008, DISPERBYK-2009, DISPERBYK-2010, DISPERBYK-2020, DISPERBYK-2025, DISPERBYK-2050, DISPERBYK-2070, DISPERBYK-2090, DISPERBYK-2091, DISPERBYK-2095, DISPERBYK-2096, DISPERBYK-2150, DISPERBYK-2151, DISPERBYK-2152, DISPERBYK-2155, DISPERBYK-2163 및 DISPERBYK-2164로 이루어진 군에서 선택되는 적어도 하나를 포함할 수 있다. 또한, 일 실시예에 따르면, 분산제는, 상기 상표면 이외에도, Antiterra-U, P104, Disperbyk 110, Disperbyk 130, Disperbyk 160, Disperbyk 170 Family, EFKA 776, EFKA 4050, EFKA 4063, EFKA 4051, Solsperse 24000, Solsperse 36600, Solsperse 32600, Solsperse 22000 및 Solsperse 5000로 이루어진 군에서 선택되는 적어도 하나를 포함할 수 있다.According to one embodiment, the dispersant may be available from a commercial product. According to one embodiment, the dispersant is a dispersant under the trade names DISPERBYK, DISPERBYK-101, DISPERBYK-102, DISPERBYK-103, DISPERBYK-106, DISPERBYK-107, DISPERBYK-108, DISPERBYK-109, DISPERBYK-110. , DISPERBYK-111, DISPERBYK-112, DISPERBYK-115, DISPERBYK-116, DISPERBYK-118, DISPERBYK-130, DISPERBYK-140, DISPERBYK-142, DISPERBYK-145, DISPERBYK-160, DISPERBYK-161, DISPERBYK-162, DISPERBYK -163, DISPERBYK-164, DISPERBYK-165, DISPERBYK-166, DISPERBYK-167, DISPERBYK-168, DISPERBYK-169, DISPERBYK-170, DISPERBYK-171, DISPERBYK-174, DISPERBYK-176, DISPERBYK-180, DISPERBYK-181 , DISPERBYK-182, DISPERBYK-183, DISPERBYK-184, DISPERBYK-185, DISPERBYK-187, DISPERBYK-190, DISPERBYK-191, DISPERBYK-192, DISPERBYK-193, DISPERBYK-194, DISPERBYK-2000, DISPERBYK-2001, DISPERBYK -2008, DISPERBYK-2009, DISPERBYK-2010, DISPERBYK-2020, DISPERBYK-2025, DISPERBYK-2050, DISPERBYK-2070, DISPERBYK-2090, DISPERBYK-2091, DISPERBYK-2095, DISPERBYK-2096, DISPERBYK-2150, DISPERBYK-2 151 , DISPERBYK-2152, DISPERBYK-2155, DISPERBYK-2163 and DISPERBYK-2164. In addition, according to one embodiment, the dispersant, in addition to the above trademark, Antiterra-U, P104, Disperbyk 110, Disperbyk 130, Disperbyk 160, Disperbyk 170 Family, EFKA 776, EFKA 4050, EFKA 4063, EFKA 4051, Solsperse 24000, It may include at least one selected from the group consisting of Solsperse 36600, Solsperse 32600, Solsperse 22000 and Solsperse 5000.
일 실시예에 따르면, 분산제는, 조성물 100 중량부에 대해서 1 중량부 내지 10 중량부로 포함될 수 있다. 일 실시예에 따르면, 분산제는, 조성물 100 중량부에 대해서 1 중량부 내지 5 중량부, 또는 3 중량부 내지 7 중량부로 포함될 수 있다.According to one embodiment, the dispersant may be included in an amount of 1 part by weight to 10 parts by weight based on 100 parts by weight of the composition. According to one embodiment, the dispersant may be included in 1 part by weight to 5 parts by weight, or 3 parts by weight to 7 parts by weight based on 100 parts by weight of the composition.
일 실시예에 따르면, 조성물은 분산용매를 더 포함하고, 분산용매는, 메틸에틸케톤(methyl ethyl ketone; MEK), 에탄올, 메탄올, 아세토니트릴(acetonitrile), 톨루엔(Toluene), 테트라하이드로퓨란(tetrahydrofuran, THF), 프로필렌글리콜모노메틸에테르아세테이트(propylene glycol monomethyl ether acetate, PGMEA) 및 에틸 아세테이트(ethyl acetate)로 이루어진 군에서 선택되는 적어도 하나를 포함할 수 있다.According to one embodiment, the composition further comprises a dispersing solvent, the dispersing solvent is methyl ethyl ketone (MEK), ethanol, methanol, acetonitrile (acetonitrile), toluene (Toluene), tetrahydrofuran (tetrahydrofuran) , THF), propylene glycol monomethyl ether acetate (PGMEA), and at least one selected from the group consisting of ethyl acetate.
일 실시예에 따르면, 분산용매의 중량은 표면개질된 무기 입자의 중량과 같거나 그보다 큰 것일 수 있다. 일 실시예에 따르면, 표면개질된 무기 입자와 분산용매의 중량비는, 1 : 1 내지 1 : 2인 것일 수 있다.According to one embodiment, the weight of the dispersion solvent may be equal to or greater than the weight of the surface-modified inorganic particles. According to one embodiment, the weight ratio of the surface-modified inorganic particles and the dispersion solvent may be 1:1 to 1:2.
일 실시예에 따르면, 분산용매는, 조성물 중 30 중량% 내지 60 중량%일 수 있다. 일 실시예에 따르면, 분산용매는, 30 중량% 이상, 40 중량% 이상, 또는 50 중량% 이상이거나, 60 중량% 이하, 50 중량% 이하, 40 중량% 이하이거나, 상기 언급된 수치들 중 선택되는 두 값 사이의 범위에 포함될 수 있다.According to one embodiment, the dispersion solvent may be 30% to 60% by weight of the composition. According to one embodiment, the dispersion solvent is 30% by weight or more, 40% by weight or more, or 50% by weight or more, 60% by weight or less, 50% by weight or less, 40% by weight or less, or selected from the above-mentioned values. It can be included in the range between the two values.
일 실시예에 따르면, 조성물의 굴절률은 1.50 내지 1.80일 수 있다.According to one embodiment, the refractive index of the composition may be 1.50 to 1.80.
일 실시예에 따르면, 조성물은 고굴절률의 분산 조성물로서, 굴절률이 1.50 이상, 1.55 이상, 1.60 이상, 1.65 이상, 1.70 이상, 또는 1.75 이상이거나, 1.80 이하, 1.75 이하, 1.70 이하, 1.65 이하, 1.60 이하, 1.55 이하이거나, 상기 언급된 수치들 중 선택되는 두 값 사이의 범위에 포함될 수 있다.According to one embodiment, the composition is a high refractive index dispersion composition, wherein the refractive index is 1.50 or more, 1.55 or more, 1.60 or more, 1.65 or more, 1.70 or more, or 1.75 or more, or 1.80 or less, 1.75 or less, 1.70 or less, 1.65 or less, 1.60 or less. or less, 1.55 or less, or may be included in a range between two values selected from the above-mentioned numerical values.
일 실시예에 따르면, 조성물의 점도는, 180 cPs 내지 20,000 cPs (25℃ 기준)일 수 있다. 일 실시예에 따르면, 조성물의 점도는, MEK, 톨루엔(toluene), 에틸 아세테이트(ethyl acetate)와 같은 점도 조절제를 통해 점도를 조절할 수 있고, 일 실시예에 따르면, 조성물의 점도는, 바람직하게는, 180 cPs 내지 10,000 cPs (25℃ 기준) 일 수 있고, 더 바람직하게는, 180 cPs 내지 1,000 cPs (25℃ 기준) 일 수 있다.According to one embodiment, the composition may have a viscosity of 180 cPs to 20,000 cPs (at 25° C.). According to one embodiment, the viscosity of the composition can be adjusted through a viscosity modifier such as MEK, toluene, or ethyl acetate. According to one embodiment, the viscosity of the composition is preferably , 180 cPs to 10,000 cPs (based on 25 ° C.), and more preferably, 180 cPs to 1,000 cPs (based on 25 ° C.).
일 실시예에 따르면, 조성물의 헤이즈(haze)는, 15% 이하일 수 있다.According to one embodiment, the haze of the composition may be 15% or less.
일 실시예에 따르면, 조성물의 헤이즈는, 15% 이하일 수 있고, 바람직하게는, 14% 이하일 수 있고, 더 바람직하게는, 6% 이하일 수 있다.According to one embodiment, the haze of the composition may be 15% or less, preferably, 14% or less, and more preferably, 6% or less.
본 발명의 일 실시예에 따른 점착 필름은, 일 실시예에 따른 조성물을 이용하여 제조하는 것일 수 있다. 본 발명의 일 실시예에 따른 점착 필름은, 일 실시예에 따른 조성물로서, 표면처리제에 의해 표면개질된 무기 입자, 및 아크릴계 모노머를 포함하고, 무기 입자 및 상기 아크릴계 모노머는, 1 : 1 내지 2 : 1의 중량비를 가지는 조성물을 이용하여 제조되는 것일 수 있다.An adhesive film according to an embodiment of the present invention may be manufactured using a composition according to an embodiment. An adhesive film according to an embodiment of the present invention is a composition according to an embodiment, and includes inorganic particles surface-modified by a surface treatment agent, and an acrylic monomer, wherein the inorganic particles and the acrylic monomer have a ratio of 1:1 to 2. : It may be prepared using a composition having a weight ratio of 1.
일 실시예에 따르면, 점착 필름은, 예를 들어 OCA 필름 또는 PSA(pressure sensitive adhesive) 필름과 같은 점착 필름일 수 있고, 유연성을 가지면서 광학적으로 투명한 점착 필름을 제공할 수 있다.According to an embodiment, the adhesive film may be, for example, an OCA film or a pressure sensitive adhesive (PSA) film, and may provide a flexible and optically transparent adhesive film.
이하, 실시예 및 비교예에 의하여 본 발명을 더욱 상세히 설명하고자 한다.Hereinafter, the present invention will be described in more detail by examples and comparative examples.
단, 하기 실시예는 본 발명을 예시하기 위한 것일 뿐, 본 발명의 내용이 하기 실시예에 한정되는 것은 아니다.However, the following examples are only for illustrating the present invention, and the content of the present invention is not limited to the following examples.
1. 표면처리제의 제조1. Preparation of surface treatment agent
실시예 1-1Example 1-1
모노머로서 3-메타크릴옥시프로필트리메톡시실란(MPTMS)과 2-하이드록시에틸 메타크릴레이트(2-HEMA)를 1 : 1의 중량비가 되도록 메틸에틸케톤(MEK) 용매 하에서 혼합하였다. 중합개시제로서 AIBN을 0.01 g 첨가하였다. 이 때, 용매는 상기 모노머의 총 중량과 동일하게 혼합하였다. 질소 분위기 하에서 60 ℃로 3시간 동안 성장시킨 뒤, 상온에서 12시간 동안 혼합물을 교반하여 모노머들을 중합시켜 중합체를 수득하였다.As monomers, 3-methacryloxypropyltrimethoxysilane (MPTMS) and 2-hydroxyethyl methacrylate (2-HEMA) were mixed at a weight ratio of 1:1 in methyl ethyl ketone (MEK) solvent. 0.01 g of AIBN was added as a polymerization initiator. At this time, the solvent was mixed in the same amount as the total weight of the monomers. After growing at 60° C. for 3 hours under a nitrogen atmosphere, the mixture was stirred at room temperature for 12 hours to polymerize the monomers to obtain a polymer.
비교예 1-1Comparative Example 1-1
상기 실시예 1-1에서, 2-HEMA 대신 2-하이드록시에틸 아크릴레이트(2-HEA)를 이용하는 것을 제외하고 나머지는 동일하게 중합체를 수득하였다.In Example 1-1, except for using 2-hydroxyethyl acrylate (2-HEA) instead of 2-HEMA, the rest of the polymer was obtained in the same manner.
비교예 1-2Comparative Example 1-2
상기 실시예 1-1에서, 2-HEMA 대신2-하이드록시부틸 아크릴레이트(2-HBA)를 이용하는 것을 제외하고 나머지는 동일하게 중합체를 수득하였다.In Example 1-1, except for using 2-hydroxybutyl acrylate (2-HBA) instead of 2-HEMA, the rest of the polymer was obtained in the same manner.
2. 표면처리된 무기 입자 분산액의 제조2. Preparation of Surface-Treated Inorganic Particle Dispersion
실시예 2-1Example 2-1
평균 입자 직경이 10 ㎚인 지르코니아 분말 40 g, 및 분산용매로서 메틸에틸케톤(MEK)을 60 g 및 표면처리제로서 실시예 1-1에 따른 중합체를 지르코니아 분말 100 중량부에 대하여 20 중량부로 첨가하여 3시간 동안 분산시켜 무기 입자 분산액을 제조하였다.40 g of zirconia powder having an average particle diameter of 10 nm, 60 g of methyl ethyl ketone (MEK) as a dispersion solvent, and 20 parts by weight of the polymer according to Example 1-1 as a surface treatment agent based on 100 parts by weight of zirconia powder were added. It was dispersed for 3 hours to prepare an inorganic particle dispersion.
실시예 2-2Example 2-2
상기 실시예 2-1에서, 표면처리제의 첨가량을 지르코니아 분말 100 중량부에 대하여 30 중량부를 첨가하는 것을 제외하고 나머지는 동일하게 무기 입자 분산액을 제조하였다.In Example 2-1, an inorganic particle dispersion was prepared in the same manner as in Example 2-1, except that 30 parts by weight of the surface treatment agent was added based on 100 parts by weight of the zirconia powder.
실시예 2-3Example 2-3
상기 실시예 2-1에서, 표면처리제의 첨가량을 지르코니아 분말 100 중량부에 대하여 40 중량부를 첨가하는 것을 제외하고 나머지는 동일하게 무기 입자 분산액을 제조하였다.In Example 2-1, an inorganic particle dispersion was prepared in the same manner as in Example 2-1, except for adding 40 parts by weight of the surface treatment agent based on 100 parts by weight of the zirconia powder.
비교예 2-1Comparative Example 2-1
상기 실시예 2-1에서, 표면처리제로서 비교예 1-1에 따른 중합체를 첨가하는 것을 제외하고 나머지는 동일하게 무기 입자 분산액을 제조하였다.In Example 2-1, an inorganic particle dispersion was prepared in the same manner as in Example 2-1, except for adding the polymer according to Comparative Example 1-1 as a surface treatment agent.
비교예 2-2Comparative Example 2-2
상기 비교예 2-1에서, 표면처리제의 첨가량을 지르코니아 분말 100 중량부에 대하여 30 중량부를 첨가하는 것을 제외하고 나머지는 동일하게 무기 입자 분산액을 제조하였다.In Comparative Example 2-1, an inorganic particle dispersion was prepared in the same manner as in Comparative Example 2-1, except that 30 parts by weight of the surface treatment agent was added based on 100 parts by weight of the zirconia powder.
비교예 2-3Comparative Example 2-3
상기 비교예 2-1에서, 표면처리제의 첨가량을 지르코니아 분말 100 중량부에 대하여 40 중량부를 첨가하는 것을 제외하고 나머지는 동일하게 무기 입자 분산액을 제조하였다.In Comparative Example 2-1, an inorganic particle dispersion was prepared in the same manner as in Comparative Example 2-1, except that 40 parts by weight of the surface treatment agent was added based on 100 parts by weight of the zirconia powder.
비교예 2-4Comparative Example 2-4
상기 실시예 2-1에서, 표면처리제로서 비교예 1-2에 따른 중합체를 첨가하는 것을 제외하고 나머지는 동일하게 무기 입자 분산액을 제조하였다.An inorganic particle dispersion was prepared in the same manner as in Example 2-1, except for adding the polymer according to Comparative Example 1-2 as a surface treatment agent.
비교예 2-5Comparative Example 2-5
상기 비교예 2-4에서, 표면처리제의 첨가량을 지르코니아 분말 100 중량부에 대하여 30 중량부를 첨가하는 것을 제외하고 나머지는 동일하게 무기 입자 분산액을 제조하였다.In Comparative Examples 2-4, an inorganic particle dispersion was prepared in the same manner as in Comparative Examples 2-4, except that 30 parts by weight of the surface treatment agent was added based on 100 parts by weight of the zirconia powder.
비교예 2-6Comparative Example 2-6
상기 비교예 2-4에서, 표면처리제의 첨가량을 지르코니아 분말 100 중량부에 대하여 40 중량부를 첨가하는 것을 제외하고 나머지는 동일하게 무기 입자 분산액을 제조하였다.In Comparative Examples 2-4, an inorganic particle dispersion was prepared in the same manner as in Comparative Examples 2-4, except that 40 parts by weight of the surface treatment agent was added based on 100 parts by weight of the zirconia powder.
비교예 2-7Comparative Example 2-7
평균 입자 직경이 10 ㎚인 지르코니아 분말 40 g, 및 분산용매로서 메틸에틸케톤(MEK)을 60 g 및 표면처리제로서 메타크릴옥시프로필트리메톡시실란을 지르코니아 분말 100 중량부에 대하여 10 중량부로 첨가하여 3시간 동안 분산시켜 무기 입자 분산액을 제조하였다.40 g of zirconia powder having an average particle diameter of 10 nm, 60 g of methyl ethyl ketone (MEK) as a dispersion solvent, and 10 parts by weight of methacryloxypropyltrimethoxysilane as a surface treatment agent based on 100 parts by weight of zirconia powder were added. It was dispersed for 3 hours to prepare an inorganic particle dispersion.
비교예 2-8Comparative Example 2-8
상기 비교예 2-7에서, 표면처리제의 첨가량을 지르코니아 분말 100 중량부에 대하여 15 중량부를 첨가하는 것을 제외하고 나머지는 동일하게 무기 입자 분산액을 제조하였다.In Comparative Examples 2-7, an inorganic particle dispersion was prepared in the same manner as in Comparative Examples 2-7, except that 15 parts by weight of the surface treatment agent was added based on 100 parts by weight of the zirconia powder.
비교예 2-9Comparative Example 2-9
상기 비교예 2-7에서, 표면처리제의 첨가량을 지르코니아 분말 100 중량부에 대하여 20 중량부를 첨가하는 것을 제외하고 나머지는 동일하게 무기 입자 분산액을 제조하였다.In Comparative Examples 2-7, inorganic particle dispersions were prepared in the same manner as in Comparative Examples 2-7, except that 20 parts by weight of the surface treatment agent was added based on 100 parts by weight of the zirconia powder.
실험예 1 : 무기 입자 분산액의 광학적 특징Experimental Example 1: Optical Characteristics of Inorganic Particle Dispersion
상기 실시예 2-1 내지 2-3 및 비교예 2-1 내지 2-9에 따른 무기 입자 분산액의 광학적 특징을 확인하기 위해, 총 광투과율 및 헤이즈를 측정하여 하기 표 1에 나타내었다.In order to confirm the optical characteristics of the inorganic particle dispersions according to Examples 2-1 to 2-3 and Comparative Examples 2-1 to 2-9, total light transmittance and haze were measured and are shown in Table 1 below.
| 구분division | 광투과율 (%)Light transmittance (%) | 헤이즈(haze) (%)Haze (%) | 수율 (%)transference number (%) |
| 실시예 2-1Example 2-1 | 40.7740.77 | 48.2548.25 | 9797 |
| 실시예 2-2Example 2-2 | 40.4340.43 | 48.7048.70 | 9898 |
| 실시예 2-3Example 2-3 | 58.4158.41 | 23.4523.45 | 9797 |
| 비교예 2-1Comparative Example 2-1 | 고상 (회수 불가)Solid (unrecoverable) | ||
| 비교예 2-2Comparative Example 2-2 | 24.5524.55 | 82.4182.41 | 9292 |
| 비교예 2-3Comparative Example 2-3 | 23.4223.42 | 85.7485.74 | 9696 |
| 비교예 2-4Comparative Example 2-4 | 고상 (회수 불가)Solid (unrecoverable) | ||
| 비교예 2-5Comparative Example 2-5 | 고상 (회수 불가)Solid (unrecoverable) | ||
| 비교예 2-6Comparative Example 2-6 | 22.5122.51 | 84.5184.51 | 9696 |
| 비교예 2-7Comparative Example 2-7 | 고상 (회수 불가)Solid (unrecoverable) | ||
| 비교예 2-8Comparative Example 2-8 | 17.3817.38 | 92.7992.79 | 9797 |
| 비교예 2-9Comparative Example 2-9 | 15.9515.95 | 92.8092.80 | 9797 |
3. 유무기 하이브리드 조성물의 제조실시예 3-13. Preparation of organic-inorganic hybrid composition Example 3-1
전체 조성물을 기준으로 분산용매로서 메틸에틸케톤(MEK)을 50 중량%, 평균 입자 직경이 10 ㎚인 지르코니아 분말을 40 중량%, 표면처리제로서 실시예 1-1에 따른 중합체를 10 중량%가 되도록 혼합한 뒤, 30분 동안 교반하였다. 이후, 지르코니아 입자가 골고루 분산될 수 있도록 상기 혼합물 100 중량부를 기준으로 지르코니아 비드(평균 입자 직경: 0.05 ㎜)를 200 중량부 투입한 뒤, 페인트 쉐이커(paint shaker)로 3시간 동안 분산하여 분산액을 회수하였다. 제조된 분산액 50 중량부를 기준으로 아크릴계 모노머로서 부틸 아크릴레이트(butylacrylate)를 45 중량부, 분산제 5 중량부를 첨가한 뒤, 감압하여 분산용매를 제거하여 조성물을 제조하였다.Based on the total composition, 50% by weight of methyl ethyl ketone (MEK) as a dispersion solvent, 40% by weight of zirconia powder having an average particle diameter of 10 nm, and 10% by weight of the polymer according to Example 1-1 as a surface treatment agent After mixing, it was stirred for 30 minutes. Thereafter, 200 parts by weight of zirconia beads (average particle diameter: 0.05 mm) was added based on 100 parts by weight of the mixture so that the zirconia particles could be evenly dispersed, and then dispersed in a paint shaker for 3 hours to recover the dispersion did Based on 50 parts by weight of the prepared dispersion, 45 parts by weight of butyl acrylate as an acrylic monomer and 5 parts by weight of a dispersing agent were added, and the dispersion solvent was removed under reduced pressure to prepare a composition.
실시예 3-2Example 3-2
상기 실시예 3-1에서, 아크릴계 모노머로서 2-에틸헥실 아크릴레이트(2-ethylhexyl acrylate)를 첨가하는 것을 제외하고 나머지는 동일하게 조성물을 제조하였다.A composition was prepared in the same manner as in Example 3-1, except for adding 2-ethylhexyl acrylate as an acrylic monomer.
실시예 3-3Example 3-3
상기 실시예 3-1에서, 아크릴계 모노머로서 이소보닐 아크릴레이트(isobornyl acrylate)를 첨가하는 것을 제외하고 나머지는 동일하게 조성물을 제조하였다.In Example 3-1, the composition was prepared in the same manner as in Example 3-1, except that isobornyl acrylate was added as an acrylic monomer.
실시예 3-4Example 3-4
상기 실시예 3-1에서, 아크릴계 모노머로서 4-아크릴로일 모폴린(4-acryloyl morpholine)을 첨가하는 것을 제외하고 나머지는 동일하게 조성물을 제조하였다.In Example 3-1, the composition was prepared in the same manner as in Example 3-1, except for adding 4-acryloyl morpholine as an acrylic monomer.
비교예 3-1Comparative Example 3-1
상기 실시예 3-1에서, 표면처리제로서 메타크릴옥시프로필트리메톡시실란을 첨가하는 것을 제외하고 나머지는 동일하게 조성물을 제조하였다.In Example 3-1, the composition was prepared in the same manner as in Example 3-1, except for adding methacryloxypropyltrimethoxysilane as a surface treatment agent.
비교예 3-2Comparative Example 3-2
상기 비교예 3-1에서, 아크릴계 모노머로서 2-에틸헥실 아크릴레이트(2-ethylhexyl acrylate)를 첨가하는 것을 제외하고 나머지는 동일하게 조성물을 제조하였다.In Comparative Example 3-1, except for adding 2-ethylhexyl acrylate as an acrylic monomer, the rest of the composition was prepared in the same manner.
비교예 3-3Comparative Example 3-3
상기 비교예 3-1에서, 아크릴계 모노머로서 이소보닐 아크릴레이트(isobornyl acrylate)를 첨가하는 것을 제외하고 나머지는 동일하게 조성물을 제조하였다.A composition was prepared in the same manner as in Comparative Example 3-1, except for adding isobornyl acrylate as an acrylic monomer.
비교예 3-4Comparative Example 3-4
상기 비교예 3-1에서, 아크릴계 모노머로서 4-아크릴로일 모폴린(4-acryloyl morpholine)을 첨가하는 것을 제외하고 나머지는 동일하게 조성물을 제조하였다.A composition was prepared in the same manner as in Comparative Example 3-1, except for adding 4-acryloyl morpholine as an acrylic monomer.
실험예 2 : 유무기 하이브리드 조성물의 물성Experimental Example 2: Physical properties of organic-inorganic hybrid composition
상기 실시예 3-1 내지 3-4 및 비교예 3-1 내지 3-4에 따른 조성물의 물성을 확인하기 위해, 굴절률, 점도 및 헤이즈를 측정하여 하기 표 2에 나타내었다.In order to confirm the physical properties of the compositions according to Examples 3-1 to 3-4 and Comparative Examples 3-1 to 3-4, refractive index, viscosity and haze were measured and shown in Table 2 below.
| 구분division | 굴절률refractive index | 점도 (cPs)Viscosity (cPs) | 헤이즈 (%)Haze (%) |
| 실시예 3-1Example 3-1 | 1.571.57 | 230230 | 12.212.2 |
| 실시예 3-2Example 3-2 | 1.571.57 | 180180 | 11.811.8 |
| 실시예 3-3Example 3-3 | 1.551.55 | 250250 | 13.513.5 |
| 실시예 3-4Example 3-4 | 1.561.56 | 195195 | 12.512.5 |
| 비교예 3-1Comparative Example 3-1 | 1.571.57 | 450450 | 15.815.8 |
| 비교예 3-2Comparative Example 3-2 | 1.571.57 | 480480 | 16.216.2 |
| 비교예 3-3Comparative Example 3-3 | 1.541.54 | 380380 | 19.419.4 |
| 비교예 3-4Comparative Example 3-4 | 1.551.55 | 320320 | 16.516.5 |
이상과 같이 실시예들이 설명되었으나, 해당 기술분야에서 통상의 지식을 가진 자라면 상기를 기초로 다양한 기술적 수정 및 변형을 적용할 수 있다. 예를 들어, 설명된 기술들이 설명된 방법과 다른 순서로 수행되거나, 및/또는 설명된 시스템, 구조, 장치, 회로 등의 구성요소들이 설명된 방법과 다른 형태로 결합 또는 조합되거나, 다른 구성요소 또는 균등물에 의하여 대치되거나 치환되더라도 적절한 결과가 달성될 수 있다.그러므로, 다른 구현들, 다른 실시예들 및 특허청구범위와 균등한 것들도 후술하는 청구범위의 범위에 속한다.Although the embodiments have been described as above, those skilled in the art may apply various technical modifications and variations based on the above. For example, the described techniques may be performed in an order different from the method described, and/or components of the described system, structure, device, circuit, etc. may be combined or combined in a different form than the method described, or other components may be used. Even if they are replaced or substituted by equivalents, appropriate results can be achieved. Therefore, other implementations, other embodiments, and equivalents to the claims fall within the scope of the claims described below.
Claims (17)
- 표면처리제에 의해 표면개질된 무기 입자; 및inorganic particles surface-modified by a surface treatment agent; and아크릴계 모노머;를 포함하고,Including; acrylic monomer;상기 표면개질된 무기 입자 및 상기 아크릴계 모노머는, 1 : 1 내지 2 : 1의 중량비를 가지는 것인,The surface-modified inorganic particles and the acrylic monomer have a weight ratio of 1: 1 to 2: 1,유무기 하이브리드 조성물.Organic-inorganic hybrid composition.
- 제1항에 있어서,According to claim 1,상기 무기 입자는,The inorganic particles,ZrO2, SiO2, Al2O3, CeO2, ZnO, V2O5TiO2, BaTiO3, SrTiO3, BaTiO3, PbTiO3, PbZrO3, Pb(Zr,Ti)O3 (PZT), Pb1-xLaxZr1-yTiyO3 (PLZT), (1-x)Pb(Mg1/3Nb2/3)O3-xPbTiO3 (PMN-PT), HfO2 및 BN으로 이루어진 군에서 선택되는 적어도 하나를 포함하는 것인,ZrO 2 , SiO 2 , Al 2 O 3 , CeO 2 , ZnO, V 2 O 5 TiO 2 , BaTiO 3 , SrTiO 3 , BaTiO 3 , PbTiO 3 , PbZrO 3 , Pb(Zr,Ti)O 3 (PZT), With Pb 1-x La x Zr 1-y Ti y O 3 (PLZT), (1-x)Pb(Mg 1/3 Nb 2/3 )O 3 -xPbTiO 3 (PMN-PT), HfO 2 and BN To include at least one selected from the group consisting of,유무기 하이브리드 조성물.Organic-inorganic hybrid composition.
- 제1항에 있어서,According to claim 1,상기 무기 입자의 직경은, 10 ㎚ 내지 200 ㎚인 것이고,The diameter of the inorganic particles is 10 nm to 200 nm,상기 무기 입자의 비표면적은, 1 m2/g 내지 250 m2/g인 것인,The specific surface area of the inorganic particles is 1 m 2 /g to 250 m 2 /g,유무기 하이브리드 조성물.Organic-inorganic hybrid composition.
- 제1항에 있어서,According to claim 1,상기 표면개질된 무기 입자는, 상기 조성물 중 40 중량% 내지 50 중량%인 것인,The surface-modified inorganic particles are 40% to 50% by weight of the composition,유무기 하이브리드 조성물.Organic-inorganic hybrid composition.
- 제1항에 있어서,According to claim 1,상기 아크릴계 모노머는, 부틸 아크릴레이트(butyl acrylate), 2-에틸헥실 아크릴레이트(2-ethylhexyl acrylate), 이소보닐 아크릴레이트(isobornyl acrylate) 및 4-아크릴로일 모폴린(4-acryloyl morpholine)으로 이루어진 군에서 선택되는 적어도 하나를 포함하는 것인,The acrylic monomer is composed of butyl acrylate, 2-ethylhexyl acrylate, isobornyl acrylate and 4-acryloyl morpholine. Which includes at least one selected from the group,유무기 하이브리드 조성물.Organic-inorganic hybrid composition.
- 제1항에 있어서,According to claim 1,상기 아크릴계 모노머는, 상기 조성물 중 50 중량% 내지 60 중량%인 것인,The acrylic monomer is 50% to 60% by weight of the composition,유무기 하이브리드 조성물.Organic-inorganic hybrid composition.
- 제1항에 있어서,According to claim 1,상기 표면처리제는,The surface treatment agent,실란계 모노머 및 메타크릴레이트계 모노머의 공중합체인 것인,Which is a copolymer of a silane-based monomer and a methacrylate-based monomer,유무기 하이브리드 조성물.Organic-inorganic hybrid composition.
- 제7항에 있어서,According to claim 7,상기 실란계 모노머는, 실란, C1-C20인 알킬 실란, 알콕시 실란, 이소시아네이트 실란, 아미노 실란, 에폭시 실란, 아크릴 실란, 머캅토 실란, 불소 실란, 메타크릴옥시기 실란, 비닐 실란, 페닐 실란, 클로로 실란 및 실라잔으로 이루어진 군에서 선택되는 적어도 하나를 포함하는 것이고,The silane-based monomer is silane, C 1 -C 20 alkyl silane, alkoxy silane, isocyanate silane, amino silane, epoxy silane, acryl silane, mercapto silane, fluorine silane, methacryloxy group silane, vinyl silane, phenyl silane , It includes at least one selected from the group consisting of chloro silanes and silazanes,상기 메타크릴레이트계 모노머는, 2-하이드록시에틸 메타크릴레이트(2-hydroxyethyl methacrylate, 2-HEMA), 2-하이드록시프로필 메타크릴레이트(2-hydroxypropyl methacrylate, 2-HPMA), 2-하이드록시-1-메틸에틸 메타크릴레이트(2-hydroxy-1-methylethyl methacrylate)로 이루어진 군에서 선택되는 적어도 하나를 포함하는 것인,The methacrylate-based monomer is 2-hydroxyethyl methacrylate (2-HEMA), 2-hydroxypropyl methacrylate (2-HPMA), 2-hydroxy -Including at least one selected from the group consisting of 1-methylethyl methacrylate (2-hydroxy-1-methylethyl methacrylate),유무기 하이브리드 조성물.Organic-inorganic hybrid composition.
- 제1항에 있어서,According to claim 1,상기 표면처리제는, 하기 화학식 1 내지 화학식 3 중 어느 하나로 표시되는 화합물을 포함하는 것인,The surface treatment agent includes a compound represented by any one of the following formulas 1 to 3,유무기 하이브리드 조성물:Organic-inorganic hybrid composition:[화학식 1][Formula 1]
[화학식 2][Formula 2]
[화학식 3][Formula 3]
(상기 R1 내지 R3은, 각각, H, 포화 또는 불포화된 직쇄 또는 분지쇄의 C1-C20의 알킬기, 수산화기, 실란기 및 알콕시실란기 중 적어도 하나를 포함하는 것이고,(The R 1 to R 3 are, respectively, H, a saturated or unsaturated straight-chain or branched-chain C 1 -C 20 alkyl group, a hydroxyl group, a silane group and an alkoxysilane group including at least one,상기 R4는, H 또는 수산화기를 포함하는 것이다).The R 4 includes H or a hydroxyl group). - 제1항에 있어서,According to claim 1,상기 표면처리제는, 상기 무기 입자 100 중량부에 대하여 10 중량부 내지 30 중량부로 포함되는 것인,The surface treatment agent is included in 10 parts by weight to 30 parts by weight based on 100 parts by weight of the inorganic particles,유무기 하이브리드 조성물.Organic-inorganic hybrid composition.
- 제1항에 있어서,According to claim 1,카르복실기, 인산기, 포스폰산기, 술폰산기 및 페놀성 수산기로 이루어진 군에서 선택되는 적어도 하나의 작용기를 포함하는 분산제를 더 포함하는 것인,Further comprising a dispersing agent comprising at least one functional group selected from the group consisting of a carboxyl group, a phosphoric acid group, a phosphonic acid group, a sulfonic acid group, and a phenolic hydroxyl group,유무기 하이브리드 조성물.Organic-inorganic hybrid composition.
- 제11항에 있어서,According to claim 11,상기 분산제는, 상기 조성물 100 중량부에 대해서 1 중량부 내지 10 중량부로 포함되는 것인,The dispersant is included in 1 part by weight to 10 parts by weight based on 100 parts by weight of the composition,유무기 하이브리드 조성물.Organic-inorganic hybrid composition.
- 제1항에 있어서,According to claim 1,분산용매;를 더 포함하고,Dispersing solvent; further comprising,상기 분산용매는, 메틸에틸케톤(methyl ethyl ketone; MEK), 에탄올, 메탄올, 아세토니트릴(acetonitrile), 톨루엔(Toluene), 테트라하이드로퓨란(tetrahydrofuran, THF), 프로필렌글리콜모노메틸에테르아세테이트(propylene glycol monomethyl ether acetate, PGMEA) 및 에틸 아세테이트(ethyl acetate)로 이루어진 군에서 선택되는 적어도 하나를 포함하는 것인,The dispersion solvent is methyl ethyl ketone (MEK), ethanol, methanol, acetonitrile, toluene, tetrahydrofuran (THF), propylene glycol monomethyl ether acetate (propylene glycol monomethyl ether acetate, PGMEA) and at least one selected from the group consisting of ethyl acetate,유무기 하이브리드 조성물.Organic-inorganic hybrid composition.
- 제13항에 있어서,According to claim 13,상기 표면개질된 무기 입자 및 상기 분산용매의 중량비는, 1 : 1 내지 1 : 2인 것인,The weight ratio of the surface-modified inorganic particles and the dispersion solvent is 1: 1 to 1: 2,유무기 하이브리드 조성물.Organic-inorganic hybrid composition.
- 제13항에 있어서,According to claim 13,상기 분산용매는, 상기 조성물 중 30 중량% 내지 60 중량%인 것인,The dispersion solvent is 30% to 60% by weight of the composition,유무기 하이브리드 조성물.Organic-inorganic hybrid composition.
- 제1항에 있어서,According to claim 1,상기 조성물은,The composition is굴절률이 1.50 내지 1.80인 것이고,The refractive index is 1.50 to 1.80,점도가 180 cPs 내지 20,000 cPs (25℃ 기준)인 것이고,It has a viscosity of 180 cPs to 20,000 cPs (at 25 ° C),헤이즈(haze)가 15% 이하인 것인,The haze is less than 15%,유무기 하이브리드 조성물.Organic-inorganic hybrid composition.
- 조성물을 이용하여 제조된 점착 필름으로서,As an adhesive film prepared using the composition,상기 조성물은,The composition is표면처리제에 의해 표면개질된 무기 입자; 및inorganic particles surface-modified by a surface treatment agent; and아크릴계 모노머;를 포함하고,Including; acrylic monomer;상기 표면개질된 무기 입자 및 상기 아크릴계 모노머는, 1 : 1 내지 2 : 1의 중량비를 가지는 것인,The surface-modified inorganic particles and the acrylic monomer have a weight ratio of 1: 1 to 2: 1,점착 필름.adhesive film.
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| CN117402286A (en) * | 2023-12-14 | 2024-01-16 | 优美特（北京）环境材料科技股份公司 | Modified acrylic resin, preparation method thereof, powder coating and application |
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