WO2023120946A1 - Additive for epoxy adhesive and one-component epoxy adhesive composition comprising same - Google Patents

Abstract

Disclosed are an additive for an epoxy adhesive and a one-component epoxy adhesive composition comprising same. The additive for an epoxy adhesive may be obtained by reacting epoxy, maleinized polybutadiene and polyetheramine. In addition, the additive for the epoxy adhesive may be obtained by reacting epoxy and maleinized ethylene. The one-component epoxy adhesive composition may include, of the additives for an epoxy adhesive, one or more additives for an epoxy adhesive, a urethane polymer, and a catalyst.

Description

Additive for epoxy adhesive and one-component epoxy adhesive composition containing the same

The present invention relates to an epoxy adhesive additive and a one-component epoxy adhesive composition comprising the same.

Epoxy adhesives have excellent properties such as adhesion to various substrates, heat resistance, chemical resistance, electrical properties, and mechanical properties, and are therefore used in a wide range of industrial fields. Epoxy adhesives include one-component epoxy adhesives in which a single composition is cured, and two-component epoxy adhesives in which a base material and a curing agent are first cured by mixing.

One-component epoxy adhesives have the advantage of being more convenient to use than two-component epoxy adhesives. In particular, a one-component epoxy adhesive containing a urethane-based intermediate exhibits excellent performance in bonding metal materials. However, one-component epoxy adhesives containing urethane-based intermediates are inferior in adhesion performance of heterogeneous materials having different polarities, such as between metal and wood or plastic and wood. Therefore, a one-component epoxy adhesive capable of improving adhesion performance between different materials is required, and an epoxy adhesive additive for realizing this is required.

One object of the present invention is to provide an additive for an epoxy adhesive capable of improving adhesion performance between different materials.

Another object of the present invention is to provide a one-component epoxy adhesive comprising the additive for the epoxy adhesive.

In one aspect, the present invention provides an additive for an epoxy adhesive having the following formula (I).

(Ⅰ)

Here, X may be a polyether functional group, Y may be a polybutadiene functional group, and Z is selected from one or more of chain-type, branched-chain hydrocarbons and hydrocarbons containing at least one aromatic ring. It may be a functional group, and n may be an integer from 1 to 100.

The X may be a functional group having the following formula (II).

(II)

Here, r may be an integer from 1 to 100, s may be an integer from 1 to 100, and r may be greater than s.

Z may be selected from one or more of a functional group having the following formula (III) and a functional group having the following formula (IV).

(III)

(IV)

Here, q may be an integer from 1 to 100.

The weight ratio of the functional group having Chemical Formula (III) and the functional group having Chemical Formula (IV) may be 2:8 to 4:6.

The additive for epoxy adhesive may be obtained by reacting a compound having the following formula (V), a compound having the following formula (VI), a compound having the following formula (VII), and a compound having the following formula (VIII).

(V)

(VI)

(VII)

(ⅤⅢ)

Here, q may be an integer from 1 to 100, r may be an integer from 1 to 100, and s may be an integer from 1 to 100.

The weight ratio of the compound having Formula (V) and the compound having Formula (VI) may be 2:8 to 4:6.

With respect to the total weight of the additive for the epoxy adhesive, the total weight of the compound having the formula (V) and the compound having the formula (VI) may be 60 to 80% by weight, and the weight of the compound having the formula (VII) Silver may be 25 to 35% by weight, and the weight of the compound having Chemical Formula (VIII) may be 2 to 5% by weight.

Through the configuration as described above, the one-component epoxy adhesive including the additive for epoxy adhesive according to the embodiment of the present invention can improve the adhesive strength between different materials.

In another aspect, the present invention provides an additive for an epoxy adhesive having the following formula (IX).

(Ⅸ)

Here, Y' may be a polyethylene functional group, Z may be a functional group selected from one or more of chain-type, branched-chain hydrocarbons and hydrocarbons containing one or more aromatic rings, and n' is 1 to 100 may be an integer of

Z may be a functional group selected from one or more of a functional group having the following formula (III) and a functional group having the following formula (IV).

(III)

(IV)

Here, q may be an integer from 1 to 100.

The weight ratio of the functional group having Chemical Formula (III) and the functional group having Chemical Formula (IV) may be 2:8 to 4:6.

The additive for the epoxy adhesive may be obtained by reacting a compound having the following formula (V), a compound having the following formula (VI), and the following formula (X).

(V)

(VI)

(X)

Here, q may be an integer from 1 to 100.

The weight ratio of the compound having Formula (V) and the compound having Formula (VI) may be 2:8 to 4:6.

With respect to the total weight of the additive for the epoxy adhesive, the total weight of the compound having the formula (V) and the compound having the formula (VI) is 60 to 80% by weight, and the weight of the compound having the formula (X) is 20 to 40% by weight.

Through the configuration as described above, the one-component epoxy adhesive including the additive for epoxy adhesive according to the embodiment of the present invention can improve the adhesive strength between different materials.

In another aspect, the present invention provides one or more additives for epoxy adhesives among the additives for epoxy adhesives; polymers of at least one of polypropylene glycol (PPG) and polytetramethyleneether glycol (PTMEG); And dicyandiamide (DICY) and imidazole (imidazole) of at least one catalyst; it provides a one-component epoxy adhesive composition comprising a.

The one-component epoxy adhesive composition may have high adhesive shear strength of different materials independently selected from the group including metal, plastic, and wood, compared to the one-component epoxy adhesive composition that does not contain the epoxy adhesive additive. .

When the additive for an epoxy adhesive according to an embodiment of the present invention is included in a one-component epoxy adhesive, adhesive strength between different materials may be improved.

The one-component epoxy adhesive composition according to the embodiment of the present invention may improve adhesive strength between different materials.

1 and 2 are views showing a reaction formula for preparing an additive for an epoxy adhesive according to an embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. Since the present invention can have various changes and various forms, specific embodiments will be illustrated in the drawings and described in detail in the text. However, this is not intended to limit the present invention to a specific form disclosed, and should be understood to include all modifications, equivalents, and substitutes included in the spirit and scope of the present invention. Like reference numerals have been used for like elements throughout the description of each figure. In the accompanying drawings, the dimensions of the structures are shown enlarged than actual for clarity of the present invention.

Terms used in this application are only used to describe specific embodiments, and are not intended to limit the present invention. Singular expressions include plural expressions unless the context clearly dictates otherwise. In this application, terms such as "comprise" or "have" are intended to designate that there is a feature, number, step, operation, component, or combination thereof described in the specification, but one or more other features or numbers However, it should be understood that it does not preclude the presence or addition of steps, operations, components, or combinations thereof.

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which the present invention belongs. Terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with the meaning in the context of the related art, and unless explicitly defined in the present application, they should not be interpreted in an ideal or excessively formal meaning. don't

1 is a diagram showing an example of a reaction formula for preparing a first additive for an epoxy adhesive among additives for an epoxy adhesive according to an embodiment of the present invention.

Referring to FIG. 1 , a first additive for an epoxy adhesive among additives for an epoxy adhesive according to an embodiment of the present invention may have the following Chemical Formula (I).

(Ⅰ)

1 shows an example of a reaction scheme for preparing a first additive for epoxy adhesive among additives for epoxy adhesive according to an embodiment of the present invention, and the additive for epoxy adhesive having Chemical Formula (I) is not limited to the above manufacturing method. .

In one embodiment, X may be a polyether functional group, Y may be a polybutadiene functional group, and Z may be chain-like, branched-chain hydrocarbons and hydrocarbons containing one or more aromatic rings. It may be one or more functional groups selected, and n may be an integer from 1 to 100.

Additives for epoxy adhesives as described above may be optimized for adhesion of heterogeneous materials having different polarities by introducing a long chain having hydrophobicity.

The above additives for epoxy adhesives can be applied to all epoxy adhesive compositions including one-component epoxy adhesive compositions.

In one embodiment, the X may be a functional group having the following formula (II).

(II)

In one embodiment, r may be an integer from 1 to 100, s may be an integer from 1 to 100, and r may be greater than s.

In one embodiment, Z may be selected from one or more of a functional group having the following formula (III) and a functional group having the following formula (IV).

(III)

(IV)

In one embodiment, q may be an integer from 1 to 100.

In one embodiment, the weight ratio of the functional group having Chemical Formula (III) and the functional group having Chemical Formula (IV) may be 2:8 to 4:6.

In one embodiment, the additive for epoxy adhesive reacts a compound having the following formula (V), a compound having the following formula (VI), a compound having the following formula (VII), and a compound having the following formula (VIII) can be obtained.

(V)

(VI)

(VII)

(ⅤⅢ)

In one embodiment, q may be an integer from 1 to 100, r may be an integer from 1 to 100, and s may be an integer from 1 to 100.

In one embodiment, the weight ratio of the compound having Formula (V) and the compound having Formula (VI) may be 2:8 to 4:6.

In one embodiment, with respect to the total weight of the additive for the epoxy adhesive, the total weight of the compound having the formula (V) and the compound having the formula (VI) may be 60 to 80% by weight, the formula (VII) ) may be 25 to 35% by weight, and the weight of the compound having Formula (VIII) may be 2 to 5% by weight.

2 is a view showing an example of a reaction formula for preparing a second additive for an epoxy adhesive among additives for an epoxy adhesive according to an embodiment of the present invention.

Referring to FIG. 2 , the second additive for an epoxy adhesive among additives for an epoxy adhesive according to an embodiment of the present invention may have the following Chemical Formula (IX).

(Ⅸ)

2 shows an example of a reaction scheme for preparing a second additive for epoxy adhesive among additives for epoxy adhesive according to an embodiment of the present invention, and the additive for epoxy adhesive having the formula (IX) is not limited to the above manufacturing method. .

In one embodiment, Y' may be a polyethylene functional group, Z may be a functional group selected from one or more of chain-type, branched-chain hydrocarbons, and hydrocarbons containing one or more aromatic rings, and n' may be an integer from 1 to 100.

Additives for epoxy adhesives as described above may be optimized for adhesion of heterogeneous materials having different polarities by introducing a long chain having hydrophobicity.

The above additives for epoxy adhesives can be applied to all epoxy adhesive compositions including one-component epoxy adhesive compositions.

In one embodiment, Z may be a functional group selected from one or more of a functional group having the following formula (III) and a functional group having the following formula (IV).

(III)

(IV)

In one embodiment, q may be an integer from 1 to 100.

In one embodiment, the weight ratio of the functional group having Chemical Formula (III) and the functional group having Chemical Formula (IV) may be 2:8 to 4:6.

In one embodiment, the additive for the epoxy adhesive may be obtained by reacting a compound having the following Chemical Formula (V), a compound having the following Chemical Formula (VI), and the following Chemical Formula (X).

(V)

(VI)

(X)

In one embodiment, q may be an integer from 1 to 100.

In one embodiment, the weight ratio of the compound having Formula (V) and the compound having Formula (VI) may be 2:8 to 4:6.

In one embodiment, with respect to the total weight of the additive for the epoxy adhesive, the total weight of the compound having the formula (V) and the compound having the formula (VI) is 60 to 80% by weight, the formula (X) The weight of the compound having may be 20 to 40% by weight.

On the other hand, the one-component epoxy adhesive composition according to an embodiment of the present invention includes at least one additive for epoxy adhesive among the additives for epoxy adhesive; one or more of the polymers including polyurethane; and a catalyst.

The type of the polymer is not particularly limited, but non-limiting examples include polypropylene glycol (PPG) and polytetramethyleneether glycol (PTMEG).

The type of the catalyst is not particularly limited, but non-limiting examples include dicyandiamide (DICY) and imidazole.

The one-component epoxy adhesive composition may have high adhesive shear strength of different materials independently selected from the group including metal, plastic, and wood, compared to the one-component epoxy adhesive composition that does not contain the epoxy adhesive additive. .

Hereinafter, embodiments of the present invention will be described in detail. However, the examples described below are merely some embodiments of the present invention, and the scope of the present invention is not limited to the following examples.

[Example 1] Preparation of additives for first epoxy adhesive

Diglycidyl ether derived from 1,6-hexanediol (first epoxy) and diglycidyl ether derived from bisphenol A (second epoxy) were prepared as epoxy. Ricon® l30MA20 was prepared with maleinized polybutadiene. SURFONAMINE® L-100 was prepared as a polyether amine.

As for the epoxy, 30% by weight of the first epoxy and 70% by weight of the second epoxy were mixed. Epoxy, maleinized polybutadiene and polyether amine were mixed in a weight ratio of 70:27:3. The mixed reactants were reacted at 120 °C for 2 hours. Thus, a first additive for epoxy adhesive among additives for epoxy adhesive according to an embodiment of the present invention was prepared.

[Example 2] Preparation of additives for second epoxy adhesive

Diglycidyl ether derived from 1,6-hexanediol (first epoxy) and diglycidyl ether derived from bisphenol A (second epoxy) were prepared as epoxy. Kumgang MPE-50 was prepared with maleinized ethylene. Methyl ethyl ketone (MEK) was prepared as a solvent.

As for the epoxy, 30% by weight of the first epoxy and 70% by weight of the second epoxy were mixed. Epoxy and maleinized ethylene were mixed in a 70:30 weight ratio. The solvent was mixed so as to be 40% of the total weight. The mixed reactants were reacted at 120 °C for 2 hours, and then the solvent was removed in vacuum. Thus, among the additives for epoxy adhesives according to the embodiment of the present invention, the second additive for epoxy adhesives was prepared.

[Example 3-1] Preparation of one-component epoxy adhesive composition

Kukdo Chemical YD 128 was prepared as an epoxy for a one-component epoxy adhesive composition. As an additive for an epoxy adhesive, a first additive for an epoxy adhesive according to Example 1 was prepared. Huntsman DY-965 was prepared as a polymer. Epoxy, the additive for the first epoxy adhesive, and the polymer were prepared in a weight ratio of 60:30:10.

Silica and silane were prepared as separate additives. Evonik dicyandiamide (DICY) was prepared as a catalyst. 5 phr of silica, 1 phr of silane, and 2.5 phr of catalyst were added. The reactants were mixed to prepare a one-component epoxy adhesive composition according to an embodiment of the present invention.

[Example 3-2] Preparation of one-component epoxy adhesive composition

Kukdo Chemical YD 128 was prepared as an epoxy for a one-component epoxy adhesive composition. As an additive for epoxy adhesive, a second additive for epoxy adhesive according to Example 2 was prepared. Huntsman DY-965 was prepared as a polymer. Epoxy, the additive for the second epoxy adhesive, and the polymer were prepared in a weight ratio of 60:30:10.

Silica and silane were prepared as separate additives. Evonik dicyandiamide (DICY) was prepared as a catalyst. 5 phr of silica, 1 phr of silane, and 2.5 phr of catalyst were added. The reactants were mixed to prepare a one-component epoxy adhesive composition according to an embodiment of the present invention.

[Example 3-3] Preparation of one-component epoxy adhesive composition

Kukdo Chemical YD 128 was prepared as an epoxy for a one-component epoxy adhesive composition. As additives for epoxy adhesives, the first and second additives for epoxy adhesives according to Examples 1 and 2 were both prepared. Huntsman DY-965 was prepared as a polymer. Epoxy, the additive for the first epoxy adhesive, the additive for the second epoxy adhesive, and the polymer were prepared in a weight ratio of 30:30:30:10.

Silica and silane were prepared as separate additives. Evonik dicyandiamide (DICY) was prepared as a catalyst. 5 phr of silica, 1 phr of silane, and 2.5 phr of catalyst were added. The reactants were mixed to prepare a one-component epoxy adhesive composition according to an embodiment of the present invention.

[Example 3-4] Preparation of one-component epoxy adhesive composition

A one-component epoxy adhesive composition was prepared in the same manner as in Example 3-3, but the epoxy, the first epoxy adhesive additive, the second epoxy adhesive additive, and the polymer were prepared in a weight ratio of 20:40:30:10.

[Example 3-5] Preparation of one-component epoxy adhesive composition

A one-component epoxy adhesive composition was prepared in the same manner as in Example 3-3, but the epoxy, the first epoxy adhesive additive, the second epoxy adhesive additive, and the polymer were prepared in a weight ratio of 20:30:40:10.

[Example 3-6] Preparation of one-component epoxy adhesive composition

A one-component epoxy adhesive composition was prepared in the same manner as in Example 3-3, but the epoxy, the first epoxy adhesive additive, the second epoxy adhesive additive, and the polymer were prepared in a weight ratio of 10:40:40:10.

[Comparative Example 1] Preparation of additive-free one-component epoxy adhesive composition

Kukdo Chemical YD 128 was prepared as an epoxy for a one-component epoxy adhesive composition. Huntsman DY-965 was prepared as a polymer. Epoxy and polymer were prepared in a weight ratio of 90:10.

Silica and silane were prepared as separate additives. Evonik dicyandiamide (DICY) was prepared as a catalyst. 5 phr of silica, 1 phr of silane, and 2.5 phr of catalyst were added. The reactants were mixed to prepare a one-component epoxy adhesive composition according to a comparative example of the present invention.

The composition of the one-component epoxy adhesive composition prepared according to Examples 3-1 to 3-6 and Comparative Example 1 is summarized in Table 1 below.

	Implementation 3-1	Implementation 3-2	Implementation 3-3	Implementation 3-4	Implementation 3-5	Implementation 3-6	Compare 1
epoxy	60	60	30	20	20	10	90
1st additive	30	-	30	40	30	40	-
2nd additive	-	30	30	30	40	40	-
polymer	10	10	10	10	10	10	10
silica	5 phr	5 phr	5 phr	5 phr	5 phr	5 phr	5 phr
Silane	1 phr	1 phr	1 phr	1 phr	1 phr	1 phr	1 phr
catalyst	2.5 phr	2.5 phr	2.5 phr	2.5 phr	2.5 phr	2.5 phr	2.5 phr

[Experimental Example 1] Measurement of heterogeneous adhesive shear strength

Test pieces of SUS and HDPE were prepared for the measurement of heterogeneous adhesive shear strength. Each specimen was prepared with a size of 100 mm × 25 mm. Both test pieces were arranged to overlap each other by 12.7 mm in the longitudinal direction, and the epoxy adhesive composition according to Examples 3-1 to 3-6 and Comparative Example 1 was applied to the overlapping portion to a thickness of 0.2 mm. Both test pieces were cured at 200 to 220 degrees for 30 minutes by applying a pressure of 25 kgf/cm ² using a pressure jig.

After mounting the test piece prepared as described above in the UTM, shear strength was tested at a speed of 10 mm per minute according to ASTM D 1002 standard. The experimental results are shown in Table 2 below.

	Implementation 3-1	Implementation 3-2	Implementation 3-3	Implementation 3-4	Implementation 3-5	Implementation 3-6	Compare 1
epoxy	60	60	30	20	20	10	90
1st additive	30	-	30	40	30	40	-
2nd additive	-	30	30	30	40	40	-
polymer	10	10	10	10	10	10	10
silica	5 phr	5 phr	5 phr	5 phr	5 phr	5 phr	5 phr
Silane	1 phr	1 phr	1 phr	1 phr	1 phr	1 phr	1 phr
catalyst	2.5 phr	2.5 phr	2.5 phr	2.5 phr	2.5 phr	2.5 phr	2.5 phr
shear strength (MPa)	5.3	6.4	7.5	7.4	8.2	7.7	2.3

Referring to Comparative Example 1 and Examples 3-1 and 3-2 of Table 2, among the first epoxy adhesive additive according to Example 1 of the present invention or the second epoxy adhesive additive according to Example 2 of the present invention It can be seen that the one-component epoxy adhesive composition to which one is added has two or more times the bonding strength of different materials. Referring to Examples 3-1 to 3-5 in Table 2, the first The one-component epoxy adhesive composition to which both the additive for epoxy adhesive and the additive for second epoxy adhesive according to Example 2 of the present invention are added is the first additive for epoxy adhesive according to Example 1 of the present invention or the embodiment of the present invention. It can be seen that the adhesive strength of the second epoxy adhesive according to 2 is somewhat stronger than that of the one-component epoxy adhesive composition to which one of the additives for epoxy adhesive is added.

On the other hand, referring to Examples 3-6 of Table 2, the first epoxy adhesive additive according to Example 1 of the present invention and the second epoxy adhesive additive according to Example 2 of the present invention have a content of a certain level or more In this case, it can be confirmed that the adhesive strength of the different materials is slightly reduced again. This is because the additive for epoxy adhesive according to the embodiment of the present invention contributes to the adhesion of materials having hydrophobicity, but the adhesive strength to materials having polarity decreases when the content increases above a certain level.

Although the above has been described with reference to preferred embodiments of the present invention, those skilled in the art can variously modify and change the present invention without departing from the spirit and scope of the present invention described in the claims below. You will understand that you can.

Claims (15)

1. Having the following formula (I),

   Additives for Epoxy Adhesives:

   

   (Ⅰ)

   here,

   X is a polyether functional group,

   Y is a polybutadiene functional group,

   Z is a functional group selected from one or more of chain-like, branched-chain hydrocarbons and hydrocarbons containing one or more aromatic rings;

   n is an integer from 1 to 100;
2. According to claim 1,

   Wherein X is a functional group having the following formula (II),

   Additives for Epoxy Adhesives:

   

   (II)

   here,

   r is an integer from 1 to 100;

   s is an integer from 1 to 100,

   r is greater than s.
3. According to claim 1,

   Wherein Z is a functional group selected from at least one of a functional group having the following formula (III) and a functional group having the following formula (IV),

   Additives for Epoxy Adhesives:

   

   (III)

   

   (IV)

   here,

   q is an integer from 1 to 100;
4. According to claim 3,

   Characterized in that the weight ratio of the functional group having the formula (III) and the functional group having the formula (IV) is 2:8 to 4:6,

   Additives for epoxy adhesives.
5. According to claim 1,

   The additive for the epoxy adhesive,

   Characterized in that it is obtained by reacting a compound having the following formula (V), a compound having the following formula (VI), a compound having the following formula (VII), and a compound having the following formula (VIII),

   Additives for Epoxy Adhesives:

   

   (V)

   

   (VI)

   

   (VII)

   

   (ⅤⅢ)

   here,

   q is an integer from 1 to 100;

   r is an integer from 1 to 100;

   s is an integer from 1 to 100.
6. According to claim 5,

   Characterized in that the weight ratio of the compound having the formula (V) and the compound having the formula (VI) is 2:8 to 4:6,

   Additives for epoxy adhesives.
7. According to claim 6,

   With respect to the total weight of the additive for the epoxy adhesive,

   The total weight of the compound having formula (V) and the compound having formula (VI) is 60 to 80% by weight,

   The weight of the compound having formula (VII) is 25 to 35% by weight,

   Characterized in that the weight of the compound having the formula (VIII) is 2 to 5% by weight,

   Additives for epoxy adhesives.
8. Having the following formula (IX),

   Additives for Epoxy Adhesives:

   

   (Ⅸ)

   here,

   Y' is a polyethylene functional group,

   Z is a functional group selected from one or more of chain-like, branched-chain hydrocarbons and hydrocarbons containing one or more aromatic rings;

   n' is an integer from 1 to 100;
9. According to claim 8,

   Wherein Z is a functional group selected from at least one of a functional group having the following formula (III) and a functional group having the following formula (IV),

   Additives for Epoxy Adhesives:

   

   (III)

   

   (IV)

   here,

   q is an integer from 1 to 100;
10. According to claim 9,

    Characterized in that the weight ratio of the functional group having the formula (III) and the functional group having the formula (IV) is 2:8 to 4:6,

    Additives for epoxy adhesives.
11. According to claim 8,

    The additive for the epoxy adhesive,

    Characterized in that it is obtained by reacting a compound having the following formula (V), a compound having the following formula (VI) and the following formula (X),

    Additives for Epoxy Adhesives:

    

    (V)

    

    (VI)

    

    (X)

    here,

    q is an integer from 1 to 100;
12. According to claim 11,

    Characterized in that the weight ratio of the compound having the formula (V) and the compound having the formula (VI) is 2:8 to 4:6,

    Additives for epoxy adhesives.
13. According to claim 12,

    With respect to the total weight of the additive for the epoxy adhesive,

    The total weight of the compound having formula (V) and the compound having formula (VI) is 60 to 80% by weight,

    Characterized in that the weight of the compound having formula (X) is 20 to 40% by weight,

    Additives for epoxy adhesives.
14. an additive for an epoxy adhesive of at least one of the additive for an epoxy adhesive according to claim 1 and the additive for an epoxy adhesive according to claim 8;

    polymers of at least one of polypropylene glycol (PPG) and polytetramethyleneether glycol (PTMEG); and

    At least one catalyst of dicyandiamide (DICY) and imidazole;

    A one component epoxy adhesive composition.
15. According to claim 14,

    The one-component epoxy adhesive composition has a high adhesive shear strength of different materials independently selected from the group including metal, plastic, and wood, compared to the one-component epoxy adhesive composition that does not contain the additive for epoxy adhesive. to do,

    A one component epoxy adhesive composition.

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