WO2023116041A1 - Laser direct writing-laser scanning induction coordination method for micropore group surface of sheet - Google Patents
Laser direct writing-laser scanning induction coordination method for micropore group surface of sheet Download PDFInfo
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- 230000006698 induction Effects 0.000 title claims abstract description 42
- 238000000034 method Methods 0.000 title claims abstract description 33
- 238000012545 processing Methods 0.000 claims abstract description 136
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- 239000000463 material Substances 0.000 claims description 5
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- 229910000838 Al alloy Inorganic materials 0.000 description 3
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- 238000005530 etching Methods 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
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- 238000003486 chemical etching Methods 0.000 description 1
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- 230000001808 coupling effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 230000008570 general process Effects 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 238000012994 industrial processing Methods 0.000 description 1
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- 239000007788 liquid Substances 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 238000001878 scanning electron micrograph Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
- B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/13—Energy storage using capacitors
Definitions
- the present invention relates to the technical field of special processing, in particular to a laser direct writing-laser scanning induction synergy method on the surface of sheet micropore groups, through which the laser direct writing-laser scanning induction synergy method can realize the surface of sheet micropore groups preparation.
- microporous surface of the sheet refers to the surface of the plate or foil with micron-scale pores.
- a surface can be used as a textured friction pair, and can also be used to regulate the interaction between the surface and the liquid working medium, and can also be used for supercapacitors It has potential application value and has received extensive attention in recent years.
- the micropores on the surface of the sheet are prepared by methods such as microhole drilling, micropore electrical machining, laser drilling and template etching, but these methods have their own shortcomings and are difficult to apply in industry.
- the efficiency of hole drilling and micro-hole electrical machining is low, and the wear of the drill bit and the consumption of tools reduce the controllability of the micro-hole, and the cost of micro-hole processing is greatly increased; while the edge of the micro-hole produced by laser drilling has a lot of spatter , affecting the quality of the micropores; the process of the template etching method is complicated, and the controllability of the micropores is poor due to the chemical etching involved.
- the invention provides a laser direct writing-laser scanning induction synergistic method on the surface of micropore groups in a sheet. Firstly, microstructures are generated through laser direct writing processing, and the shielding effect and wall focusing effect produced by these microstructures on subsequent laser beams are used. Then, the processing of the surface of the micropore group on the surface of the plate or foil in the atmospheric environment is realized by the low-power nanosecond laser scanning induction method.
- the present invention achieves the above-mentioned technical purpose through the following technical means.
- a laser direct writing-laser scanning induction synergistic method on the surface of a sheet micropore group comprising the following steps:
- the above solution also includes selecting a laser processing system with appropriate parameters, and selecting a pulse laser for laser scanning induction.
- the parameters of the pulsed laser require the following: the pulse width is less than 500 nanoseconds, the laser spot diameter D is 20 ⁇ m to 100 ⁇ m, the laser power is greater than 10 watts, and the product of the scanning step or pulse frequency and the minimum scanning speed for laser processing Less than 1/3 of the laser spot radius.
- the laser direct writing processing path is drawn in the software system of the laser processing system, and the appropriate laser direct writing processing parameters are set through the software system of the nanosecond laser processing system.
- the scanning path of laser scanning induced processing is drawn in the software system of the laser processing system, and appropriate laser scanning processing parameters are set through the software system of the nanosecond laser processing system.
- the sheet is placed on the laser processing system platform and the mutual position between the laser beam and the surface to be processed of the sheet is adjusted so that the area of the surface to be processed of the sheet is within 0.5mm above and below the focal plane of the laser beam.
- the method of the present invention is based on the coupling effect of spatter occlusion and wall focusing effect, and realizes the preparation of micropore groups on the surface of the sheet through laser direct writing processing-nanosecond laser scanning induction processing.
- the preparation of the micropore groups on the surface of the sheet material in the present invention is realized in the atmosphere, and is less restricted by the preparation environment.
- the laser direct writing process of the present invention-nanosecond laser scanning-induced coupling can realize the preparation of microhole groups in discrete areas, and can only have microhole groups in discrete areas, and laser polishing can be realized in other areas and the edges of microholes, which improves the Surface Quality.
- the laser scanning induction process in the method of the present invention has a polishing effect on the surface produced by the previous laser direct writing process, which can effectively improve the surface quality.
- Fig. 1 is a schematic flow chart of the laser direct writing-laser scanning induction synergy method involving the surface of the micropore group of the sheet according to an embodiment of the present invention
- Figure 2 is a schematic drawing of the laser direct writing path
- Figure 3 is a schematic drawing of the scanning path induced by laser scanning
- Fig. 4 SEM images of the surface of direct-writing processed samples and direct-writing processing-laser scanning induction co-manufactured samples.
- the laser direct writing-laser scanning induced synergistic preparation method on the surface of the sheet micropore group includes the following steps:
- the sheet 1 is placed on the platform of the laser processing system and the mutual position between the laser beam and the surface to be processed of the sheet is adjusted. Specifically, the sheet is placed on the platform of the laser processing system, and then the area to be processed of the sheet is within the range of the laser processing format by moving the sheet, and the height of the laser head or the height of the laser processing system platform is adjusted to make the sheet.
- the surface area of the material to be processed is within the range of 0.5 mm above and below the focal plane of the laser beam.
- the edge contour 2 of the laser direct writing processing area consistent with the processing area is drawn by the software system, and then filled in the laser direct writing by means of lines.
- the processing area 3 draws parallel lines as the laser direct writing processing path 4, the distance between the parallel lines takes a value in the range of 50 ⁇ m to 2000 ⁇ m, and the drawn lines fill the wire frame.
- Appropriate laser direct writing processing parameters are set through the software system of the nanosecond laser processing system.
- the laser power P is set to be greater than 3 watts
- the scanning path of laser scanning induced processing is drawn in the software system of the nanosecond laser processing system. Specifically, in combination with Figure 3, according to the requirements of the processing area, the edge contour 5 of the laser scanning induced area consistent with the processing area is drawn by the software system, and then the line spacing is drawn in the wire frame by line filling. 1 /2 and greater than 2 ⁇ m are used as the laser scanning induction path 6, and the drawn laser scanning induction path 6 fills the edge contour 5 of the laser scanning induction area.
- the range of laser power P is greater than 0.2 watts and less than 4 watts;
- the laser is turned on and the galvanometer scanning of the laser processing system is turned on, so that the laser spot moves sequentially according to the laser scanning induction path 6 drawn above, thereby inducing the micropore group on the surface of the sheet.
- laser direct writing processing and laser scanning induced processing may use the same processing platform, or different nanosecond laser processing platforms.
- the process of placing and adjusting the position of the sheet on the laser scanning induction processing platform is the same as that of placing and adjusting the position of the sheet on the laser direct writing processing platform.
- For direct writing processing there is no requirement for lasers.
- laser scanning induction pulse lasers need to be selected.
- the parameters of pulse lasers are: pulse width less than 500 nanoseconds, laser spot diameter D of 20 ⁇ m ⁇ 100 ⁇ m, laser power greater than 10 watts, laser
- the product of the processed scanning step or pulse frequency and the minimum scanning speed is less than 1/3 of the laser spot radius.
- the selection requirements of the pulse laser parameters can ensure that the scanning induces the microhole group, and ensures that the microhole group will not collapse due to excessive laser intensity.
- Sheet 1 is selected as a 1060 aluminum alloy plate, the laser processing platform is a 20W nanosecond laser processing platform, the laser wavelength is 1064nm, the laser pulse frequency is 20kHz, and the laser spot diameter is 50 ⁇ m.
- Sheet 1 is a 3mm thick flat 1060 aluminum alloy plate.
- the surface of the 1060 aluminum alloy plate to be processed is within 0.5mm of the laser focal plane.
- Draw a 5mm ⁇ 5mm box in the laser processing system software and then fill the box with parallel lines with a spacing of 200 microns.
- set relevant parameters in the software system of the nanosecond laser processing system adjust the laser power to 18 watts, select the laser direct writing processing point spacing d as 30 ⁇ m, and then determine the scanning speed as 600mm/ s, and then set the number of scans to 2 times.
- the selected point spacing d 1 is 10 ⁇ m
- the scanning speed is determined to be 200 mm/s according to the laser pulse frequency of 20 kHz and the point spacing of 10 ⁇ m, and the number of scanning is set to 1 time.
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Abstract
A laser direct writing-laser scanning induction coordination method for a micropore group surface of a sheet (1), comprising: drawing a laser direct writing processing path (4); setting laser direct writing processing parameters to perform direct writing on the sheet (1); drawing a laser scanning induction path (6); and setting laser scanning induction parameters to perform scanning induction processing on the sheet (1) that has been subjected to direct writing.
Description
本发明涉及特种加工技术领域，尤其涉及到的一种片材微孔群表面的激光直写-激光扫描诱导协同方法，通过激光直写-激光扫描诱导协同方法可实现片材微孔群表面的制备。The present invention relates to the technical field of special processing, in particular to a laser direct writing-laser scanning induction synergy method on the surface of sheet micropore groups, through which the laser direct writing-laser scanning induction synergy method can realize the surface of sheet micropore groups preparation.
片材微孔群表面是指具有微米尺度孔群的板材或箔材表面，这样的表面可用作织构摩擦副，也可用于调控表面与液体工作介质的相互作用，还可以用于超级电容器等领域，具有潜在的应用价值，近年来得到了广泛的关注。The microporous surface of the sheet refers to the surface of the plate or foil with micron-scale pores. Such a surface can be used as a textured friction pair, and can also be used to regulate the interaction between the surface and the liquid working medium, and can also be used for supercapacitors It has potential application value and has received extensive attention in recent years.
一般情况下，片材表面上的微孔是通过微孔钻削、微孔电加工、激光打孔及模板刻蚀等方法制备，但这些方法各有不足，在工业上难以应用，例如，微孔钻削、微孔电加工效率较低，而且钻头的磨损和工具的消耗使得微孔的可控性降低，微孔加工成本大幅提升；而激光打孔产生的微孔边缘有大量溅出物，影响微孔质量；模板刻蚀方法工艺复杂，由于涉及到化学刻蚀，微孔可控性较差。最近，采用水下的激光加工可在表面可以不锈钢表面构造出随机微孔(Applied Surface Science 462(2018)847–855)，但这种工艺只能在水下实现，其应用受到限制，例如，超级电容器中广泛应用的铝材在水下加工容易爆炸。因此，采用一般的工艺加工微孔结构难以满足工业加工需求。而在激光加工中，先加工产生的飞溅物对后加工过程的激光束作用具有一定的遮挡作用，而已加工结构壁面对照射的激光束具有壁聚焦效应。In general, the micropores on the surface of the sheet are prepared by methods such as microhole drilling, micropore electrical machining, laser drilling and template etching, but these methods have their own shortcomings and are difficult to apply in industry. The efficiency of hole drilling and micro-hole electrical machining is low, and the wear of the drill bit and the consumption of tools reduce the controllability of the micro-hole, and the cost of micro-hole processing is greatly increased; while the edge of the micro-hole produced by laser drilling has a lot of spatter , affecting the quality of the micropores; the process of the template etching method is complicated, and the controllability of the micropores is poor due to the chemical etching involved. Recently, underwater laser processing can be used to construct random micropores on the surface of stainless steel (Applied Surface Science 462(2018)847–855), but this process can only be realized underwater, and its application is limited, for example, Aluminum, which is widely used in supercapacitors, is prone to explosion when processed underwater. Therefore, it is difficult to meet the needs of industrial processing by using general processes to process microporous structures. In laser processing, the spatter generated by the first processing has a certain shielding effect on the laser beam in the post-processing process, and the wall of the processed structure has a wall focusing effect on the irradiated laser beam.
发明内容Contents of the invention
针对上述情况，为了实现对微孔群的加工，需要解决或者利用遮挡作用和壁聚焦效应对微孔群加工工艺的影响。本发明提供一种片材微孔群表面的激光直写-激光扫描诱导协同方法，先通过激光直写加工产生微结构，利用这些微结构对后续激光束所产生的遮挡作用和壁聚焦效应，再通过低功率纳秒激光扫描诱导方法实现在大气环境下的板材或箔材表面微孔群表面的加工。In view of the above situation, in order to realize the processing of the micro-hole group, it is necessary to solve or utilize the influence of the shielding effect and the wall focusing effect on the processing technology of the micro-hole group. The invention provides a laser direct writing-laser scanning induction synergistic method on the surface of micropore groups in a sheet. Firstly, microstructures are generated through laser direct writing processing, and the shielding effect and wall focusing effect produced by these microstructures on subsequent laser beams are used. Then, the processing of the surface of the micropore group on the surface of the plate or foil in the atmospheric environment is realized by the low-power nanosecond laser scanning induction method.
本发明是通过以下技术手段实现上述技术目的的。The present invention achieves the above-mentioned technical purpose through the following technical means.
一种片材微孔群表面的激光直写-激光扫描诱导协同方法，包括如下步骤：A laser direct writing-laser scanning induction synergistic method on the surface of a sheet micropore group, comprising the following steps:
绘制激光直写加工路径；Draw laser direct writing processing path;
设置激光直写加工参数对片材直写；Set the laser direct writing processing parameters to write directly on the sheet;
绘制激光扫描诱导路径；Draw laser scanning induced path;
设置激光扫描诱导参数对直写后的片材扫描诱导加工。Set the laser scanning induction parameters to scan the induction processing of the sheet after direct writing.
上述方案中，还包括选择合适参数的激光加工系统，针对激光扫描诱导选取脉冲激光器。The above solution also includes selecting a laser processing system with appropriate parameters, and selecting a pulse laser for laser scanning induction.
上述方案中，所述脉冲激光器的参数要求有：脉宽小于500纳秒，激光光斑直径D为20μm～100μm，激光功率大于10瓦，激光加工的扫描步长或脉冲频率与最低扫描速度的乘积小于激光光斑半径的1/3。In the above scheme, the parameters of the pulsed laser require the following: the pulse width is less than 500 nanoseconds, the laser spot diameter D is 20 μm to 100 μm, the laser power is greater than 10 watts, and the product of the scanning step or pulse frequency and the minimum scanning speed for laser processing Less than 1/3 of the laser spot radius.
上述方案中，激光直写加工参数为：激光功率P大于3瓦；直写扫描速度根据公式v＝f×d设置，其中，v为激光直写加工扫描速度，f为激光直写加工的激光脉冲频率，d为直写加工点间距，取值范围为D/2<d<2000μm，D为激光光斑直径；扫描次数设置为大于1次且小于20次。In the above scheme, the laser direct writing processing parameters are: the laser power P is greater than 3 watts; the direct writing scanning speed is set according to the formula v=f×d, wherein, v is the scanning speed of the laser direct writing processing, and f is the laser direct writing processing Pulse frequency, d is the distance between direct writing processing points, the value range is D/2<d<2000μm, D is the laser spot diameter; the number of scans is set to be greater than 1 and less than 20 times.
上述方案中，激光扫描诱导参数为：激光功率P为大于0.2瓦且小于4瓦；扫描诱导加工的扫描速度根据公式v
1＝f
1×d
1设置，其中v
1为扫描诱导加工的扫描速度，f
1为扫描诱导加工的激光脉冲频率，d
1为扫描诱导加工点间距，取值范围为D/20<d
1<D/4，D为激光光斑直径；扫描次数设置为大于1次且小于5次。
In the above scheme, the laser scanning induction parameters are: the laser power P is greater than 0.2 watts and less than 4 watts; the scanning speed of the scanning-induced processing is set according to the formula v 1 =f 1 ×d 1 , where v 1 is the scanning speed of the scanning-induced processing , f 1 is the laser pulse frequency for scanning-induced processing, d 1 is the distance between scanning-induced processing points, the value range is D/20<d 1 <D/4, D is the diameter of the laser spot; the number of scans is set to be greater than 1 and Less than 5 times.
上述方案中，在激光加工系统的软件系统里绘制激光直写加工路径，通过纳秒激光加工系统的软件系统设置适当的激光直写加工参数。In the above solution, the laser direct writing processing path is drawn in the software system of the laser processing system, and the appropriate laser direct writing processing parameters are set through the software system of the nanosecond laser processing system.
上述方案中，在激光加工系统的软件系统里绘制与加工区域一致形状的线框图案，再通过线条填充的方式在线框内绘制平行线条，平行线条间距50μm～2000μm，绘制的线条即充满线框。In the above scheme, draw a wireframe pattern consistent with the shape of the processing area in the software system of the laser processing system, and then draw parallel lines in the wireframe by means of line filling. .
上述方案中，在激光加工系统的软件系统里绘制激光扫描诱导加工的扫描路径，通过纳秒激光加工系统的软件系统设置适当的激光扫描加工参数。In the above scheme, the scanning path of laser scanning induced processing is drawn in the software system of the laser processing system, and appropriate laser scanning processing parameters are set through the software system of the nanosecond laser processing system.
上述方案中，在激光加工系统的软件系统里绘制与加工区域一致形状的线框图案，再通过线条填充的方式在线框内绘制线间距小于激光光斑直径的1/2且大于2μm的平行线条，绘制的线条即充满线框。In the above scheme, draw a wireframe pattern consistent with the shape of the processing area in the software system of the laser processing system, and then draw parallel lines with a line spacing less than 1/2 of the diameter of the laser spot and greater than 2 μm in the wireframe by filling the lines. The drawn lines fill the wireframe.
上述方案中，将片材放置于激光加工系统平台并调整好激光束与片材待加工表面之间的相互位置，使片材待加工表面区域处于激光束焦平面上下0.5mm的范围内。In the above solution, the sheet is placed on the laser processing system platform and the mutual position between the laser beam and the surface to be processed of the sheet is adjusted so that the area of the surface to be processed of the sheet is within 0.5mm above and below the focal plane of the laser beam.
本发明具有的有益效果为：The beneficial effects that the present invention has are:
1.本发明方法基于飞溅物遮挡和壁聚焦效应的耦合作用，通过激光直写加工-纳秒激光扫描诱导加工的方式实现了片材表面微孔群的制备。1. The method of the present invention is based on the coupling effect of spatter occlusion and wall focusing effect, and realizes the preparation of micropore groups on the surface of the sheet through laser direct writing processing-nanosecond laser scanning induction processing.
2.本发明中片材表面微孔群的制备在大气氛围下实现，受到制备环境的约束很小。2. The preparation of the micropore groups on the surface of the sheet material in the present invention is realized in the atmosphere, and is less restricted by the preparation environment.
3.本发明方法激光直写加工-纳秒激光扫描诱导的耦合可以实现离散区域的微孔群制备，可以仅在离散区域具有微孔群，其他区域和微孔边缘则实现激光抛光，提升了表面质量。3. The laser direct writing process of the present invention-nanosecond laser scanning-induced coupling can realize the preparation of microhole groups in discrete areas, and can only have microhole groups in discrete areas, and laser polishing can be realized in other areas and the edges of microholes, which improves the Surface Quality.
4.本发明方法中激光扫描诱导过程对前面的激光直写加工产生的表面具有抛光作用，可有效改善表面质量。4. The laser scanning induction process in the method of the present invention has a polishing effect on the surface produced by the previous laser direct writing process, which can effectively improve the surface quality.
图1为本发明实施例涉及到片材微孔群表面的激光直写-激光扫描诱导协同方法流程示意图；Fig. 1 is a schematic flow chart of the laser direct writing-laser scanning induction synergy method involving the surface of the micropore group of the sheet according to an embodiment of the present invention;
图2激光直写路径的绘制示意图；Figure 2 is a schematic drawing of the laser direct writing path;
图3激光扫描诱导的扫描路径的绘制示意图；Figure 3 is a schematic drawing of the scanning path induced by laser scanning;
图4直写加工样品与直写加工-激光扫描诱导协同制造样品表面扫描电镜图。Fig. 4 SEM images of the surface of direct-writing processed samples and direct-writing processing-laser scanning induction co-manufactured samples.
附图标记如下：The reference signs are as follows:
1-片材，2-激光直写加工区域边缘轮廓，3-激光直写加工区域，4-激光直写加工路径，5-激光扫描诱导区域边缘轮廓，6-激光扫描诱导路径，7-激光直写加工样品表面，8-激光直写加工微结构，9-激光直写-激光扫描诱导加工样品表面，10-原激光直写加工微结构位置，11-微孔群。1-sheet, 2-edge profile of laser direct writing processing area, 3-laser direct writing processing area, 4-laser direct writing processing path, 5-edge profile of laser scanning induced area, 6-laser scanning induced path, 7-laser Direct writing processing sample surface, 8-laser direct writing processing microstructure, 9-laser direct writing-laser scanning induction processing sample surface, 10-original laser direct writing processing microstructure position, 11-microhole group.
下面详细描述本发明的实施例，所述实施例的示例在附图中示出，其中自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。下面通过参考附图描述的实施例是示例性的，旨在用于解释本发明，而不能理解为对本发明的限制。Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals designate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary and are intended to explain the present invention and should not be construed as limiting the present invention.
在本发明中，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”、“固定”等术语应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或一体地连接；可以是机械连接，也可以是电连接；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本发明中的具体含义。In the present invention, unless otherwise clearly specified and limited, terms such as "installation", "connection", "connection" and "fixation" should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection , or integrally connected; it may be mechanically connected or electrically connected; it may be directly connected or indirectly connected through an intermediary, and it may be the internal communication of two components. Those of ordinary skill in the art can understand the specific meanings of the above terms in the present invention according to specific situations.
结合附图1所示，片材微孔群表面的激光直写-激光扫描诱导协同制备方法包括如下步骤：As shown in Figure 1, the laser direct writing-laser scanning induced synergistic preparation method on the surface of the sheet micropore group includes the following steps:
将片材1放置于激光加工系统平台并调整好激光束与片材待加工表面之间的相互位置；Place the sheet 1 on the platform of the laser processing system and adjust the mutual position between the laser beam and the surface of the sheet to be processed;
在纳秒激光加工系统的软件系统里绘制激光直写加工路径；Draw the laser direct writing processing path in the software system of the nanosecond laser processing system;
通过纳秒激光加工系统的软件系统设置适当的激光直写加工参数；Set the appropriate laser direct writing processing parameters through the software system of the nanosecond laser processing system;
开启激光从而实现片材表面的激光直写加工；Turn on the laser to realize laser direct writing processing on the surface of the sheet;
在纳秒激光加工系统的软件系统里绘制激光扫描诱导加工的扫描路径；Draw the scanning path of laser scanning induced processing in the software system of the nanosecond laser processing system;
通过纳秒激光加工系统的软件系统设置适当的激光扫描诱导加工参数；Set appropriate laser scanning-induced processing parameters through the software system of the nanosecond laser processing system;
开启激光从而实现表面的激光扫描诱导加工。Turn on the laser to achieve laser scanning induced processing of the surface.
将片材1放置于激光加工系统平台并调整好激光束与片材的待加工表面之间的相互位置。具体的，将片材放置于激光加工系统平台，而后通过移动片材的方式使片材待加工区域 处于激光加工幅面范围内，并通过调整激光头的高度或激光加工系统平台的高度，使片材待加工表面区域处于激光束焦平面上下0.5mm的范围内。The sheet 1 is placed on the platform of the laser processing system and the mutual position between the laser beam and the surface to be processed of the sheet is adjusted. Specifically, the sheet is placed on the platform of the laser processing system, and then the area to be processed of the sheet is within the range of the laser processing format by moving the sheet, and the height of the laser head or the height of the laser processing system platform is adjusted to make the sheet The surface area of the material to be processed is within the range of 0.5 mm above and below the focal plane of the laser beam.
在纳秒激光加工系统的软件系统里绘制激光直写加工路径。具体的，结合附图2，在片材1对应区域，根据加工区域的要求，通过软件系统绘制与加工区域一致形状的激光直写加工区域边缘轮廓2，再通过线条填充的方式在激光直写加工区域3绘制平行线条作为激光直写加工路径4，平行线条间距在50μm到2000μm的范围内取值，绘制的线条即充满线框。Draw the laser direct writing processing path in the software system of the nanosecond laser processing system. Specifically, in combination with Figure 2, in the corresponding area of the sheet 1, according to the requirements of the processing area, the edge contour 2 of the laser direct writing processing area consistent with the processing area is drawn by the software system, and then filled in the laser direct writing by means of lines. The processing area 3 draws parallel lines as the laser direct writing processing path 4, the distance between the parallel lines takes a value in the range of 50 μm to 2000 μm, and the drawn lines fill the wire frame.
通过纳秒激光加工系统的软件系统设置适当的激光直写加工参数。具体的，将激光功率P设置为大于3瓦；激光直写加工的扫描速度根据公式v＝f×d设置，其中v为激光直写加工扫描速度，f为直写加工的激光脉冲频率，d为直写加工点间距，取值范围为D/2<d<2000μm，D为激光光斑直径；扫描次数设置为大于1次且小于20次。Appropriate laser direct writing processing parameters are set through the software system of the nanosecond laser processing system. Specifically, the laser power P is set to be greater than 3 watts; the scanning speed of laser direct writing processing is set according to the formula v=f×d, where v is the scanning speed of laser direct writing processing, f is the laser pulse frequency of direct writing processing, and d is the direct writing processing point spacing, the value range is D/2<d<2000μm, D is the laser spot diameter; the number of scans is set to be greater than 1 and less than 20.
开启激光从而实现片材表面的激光直写加工。具体的，开启激光且开启激光加工系统的振镜扫描，使激光光斑按前述绘制的激光直写加工路径4顺序运动，从而通过直写加工出片材表面的微结构，这些结构主要以沟槽或微孔形式出现。Turn on the laser to realize laser direct writing processing on the surface of the sheet. Specifically, turn on the laser and turn on the galvanometer scanning of the laser processing system, so that the laser spot moves in sequence according to the laser direct writing processing path 4 drawn above, so that the microstructure on the surface of the sheet is processed by direct writing, and these structures are mainly formed by grooves. or appear in the form of micropores.
在纳秒激光加工系统的软件系统里绘制激光扫描诱导加工的扫描路径。具体的，结合附图3，根据加工区域的要求，通过软件系统绘制与加工区域一致形状的激光扫描诱导区域边缘轮廓5，再通过线条填充的方式在线框内绘制线间距小于激光光斑直径的1/2且大于2μm的平行线条作为激光扫描诱导路径6，绘制的激光扫描诱导路径6充满激光扫描诱导区域边缘轮廓5。The scanning path of laser scanning induced processing is drawn in the software system of the nanosecond laser processing system. Specifically, in combination with Figure 3, according to the requirements of the processing area, the edge contour 5 of the laser scanning induced area consistent with the processing area is drawn by the software system, and then the line spacing is drawn in the wire frame by line filling. 1 /2 and greater than 2 μm are used as the laser scanning induction path 6, and the drawn laser scanning induction path 6 fills the edge contour 5 of the laser scanning induction area.
通过纳秒激光加工系统的软件系统设置适当的激光扫描诱导加工参数。具体的，激光功率P取值范围为大于0.2瓦且小于4瓦；扫描诱导加工的扫描速度根据公式v
1＝f
1×d
1设置，其中v
1为扫描诱导加工的扫描速度，f
1为扫描诱导加工的激光脉冲频率，d
1为扫描诱导加工点间距，取值范围为D/20<d
1<D/4，D为激光光斑直径；扫描次数设置为大于1次且小于5次。
Set appropriate laser scanning-induced processing parameters through the software system of the nanosecond laser processing system. Specifically, the range of laser power P is greater than 0.2 watts and less than 4 watts; the scanning speed of scanning-induced processing is set according to the formula v 1 =f 1 ×d 1 , where v 1 is the scanning speed of scanning-induced processing, and f 1 is The laser pulse frequency for scanning-induced processing, d 1 is the distance between scanning-induced processing points, the value range is D/20<d 1 <D/4, and D is the diameter of the laser spot; the number of scans is set to be greater than 1 and less than 5 times.
开启激光从而实现表面的激光扫描诱导加工。具体的，开启激光且开启激光加工系统的振镜扫描，使激光光斑按前述绘制的激光扫描诱导路径6顺序运动，从而诱导出片材表面的微孔群。Turn on the laser to achieve laser scanning induced processing of the surface. Specifically, the laser is turned on and the galvanometer scanning of the laser processing system is turned on, so that the laser spot moves sequentially according to the laser scanning induction path 6 drawn above, thereby inducing the micropore group on the surface of the sheet.
本发明中激光直写加工和激光扫描诱导加工可以采用同一加工平台，也可采用不同的纳秒激光加工平台。采用不同激光加工平台时片材在激光扫描诱导加工平台上的放置和位置调整过程与片材在激光直写加工平台上放置和位置调整过程相同。针对直写加工，对激光器没有要求，针对激光扫描诱导，需要选择脉冲激光器，脉冲激光器的参数要求有：脉宽小于500纳秒，激光光斑直径D为20μm～100μm，激光功率大于10瓦，激光加工的扫描步长或脉冲 频率与最低扫描速度的乘积小于激光光斑半径的1/3。脉冲激光器参数的选择要求可以保证扫描诱导出微孔群，并确保微孔群不会因为激光强度过大造成的塌陷。In the present invention, laser direct writing processing and laser scanning induced processing may use the same processing platform, or different nanosecond laser processing platforms. When different laser processing platforms are used, the process of placing and adjusting the position of the sheet on the laser scanning induction processing platform is the same as that of placing and adjusting the position of the sheet on the laser direct writing processing platform. For direct writing processing, there is no requirement for lasers. For laser scanning induction, pulse lasers need to be selected. The parameters of pulse lasers are: pulse width less than 500 nanoseconds, laser spot diameter D of 20 μm ~ 100 μm, laser power greater than 10 watts, laser The product of the processed scanning step or pulse frequency and the minimum scanning speed is less than 1/3 of the laser spot radius. The selection requirements of the pulse laser parameters can ensure that the scanning induces the microhole group, and ensures that the microhole group will not collapse due to excessive laser intensity.
实施例Example
选择片材1为1060铝合金板，激光加工平台为20瓦的纳秒激光加工平台，激光波长为1064nm，激光脉冲频率为20kHz，激光光斑直径为50μm。 Sheet 1 is selected as a 1060 aluminum alloy plate, the laser processing platform is a 20W nanosecond laser processing platform, the laser wavelength is 1064nm, the laser pulse frequency is 20kHz, and the laser spot diameter is 50μm.
片材1为3mm厚平板1060铝合金板，通过放置片材并调节激光头，使1060铝合金板待加工表面处于激光焦平面上下0.5mm范围内。在激光加工系统软件内绘制5mm×5mm的方框，再在方框内填充间距为200微米的平行线条。之后在纳秒激光加工系统的软件系统设置相关参数，将激光功率调节为18瓦，选定激光直写加工点间距d为30μm，再根据激光脉冲频率20kHz和点间距30μm确定扫描速度为600mm/s，再设置扫描次数为2次。点击激光扫描加工开启键开始片材表面的激光直写加工，所加工激光直写加工样品表面7上的激光直写加工微结构(线条)8扫描电镜图片参见附图4左侧扫描电镜图。经过激光直写加工获得激光直写加工微结构8后，再在系统里绘制5mm×5mm的方框作为激光扫描诱导区域轮廓线框，在线框图案内填充间距为10μm的平行线条作为激光扫描路径。将激光功率设置为2瓦；根据点间距选择依据选定点间距d
1为10μm，再根据激光脉冲频率20kHz和点间距10微米确定扫描速度为200mm/s，设置扫描次数为1次。点击激光扫描加工开启键开始片材表面的激光扫描诱导加工，所加工出激光直写-激光扫描诱导加工样品表面9上的微孔群11的扫描电镜图片参见附图4右侧扫描电镜图所示，可以看出在原激光直写加工微结构位置10区域及附近产生了大量微孔，而其他区域表现较为光滑，从而可以印证激光直写加工-纳秒激光扫描诱导的耦合可以实现微孔群制备，对微孔边缘则实现了激光抛光，提升了表面质量。
Sheet 1 is a 3mm thick flat 1060 aluminum alloy plate. By placing the sheet and adjusting the laser head, the surface of the 1060 aluminum alloy plate to be processed is within 0.5mm of the laser focal plane. Draw a 5mm×5mm box in the laser processing system software, and then fill the box with parallel lines with a spacing of 200 microns. Then set relevant parameters in the software system of the nanosecond laser processing system, adjust the laser power to 18 watts, select the laser direct writing processing point spacing d as 30 μm, and then determine the scanning speed as 600mm/ s, and then set the number of scans to 2 times. Click the laser scanning processing start button to start the laser direct writing processing on the surface of the sheet, and the laser direct writing processing microstructure (line) 8 scanning electron microscope picture on the processed laser direct writing processing sample surface 7 is shown in the scanning electron microscope picture on the left side of the accompanying drawing 4. After laser direct writing processing to obtain the laser direct writing processing microstructure 8, draw a 5 mm × 5 mm square frame in the system as the outline frame of the laser scanning induction area, and fill the wire frame pattern with parallel lines with a spacing of 10 μm as the laser scanning path. Set the laser power to 2 watts; according to the point spacing selection, the selected point spacing d 1 is 10 μm, and then the scanning speed is determined to be 200 mm/s according to the laser pulse frequency of 20 kHz and the point spacing of 10 μm, and the number of scanning is set to 1 time. Click the laser scanning processing start button to start the laser scanning induction processing on the surface of the sheet, and the processed laser direct writing-laser scanning induction processing micropore group 11 on the surface 9 of the scanning electron microscope picture is shown in the scanning electron microscope picture on the right side of the accompanying drawing 4 It can be seen that a large number of micropores are generated in and around the area of position 10 of the original laser direct writing microstructure, while other regions are relatively smooth, which can confirm that laser direct writing processing-nanosecond laser scanning-induced coupling can realize the formation of micropore groups. The edge of the microhole is laser polished to improve the surface quality.
在本说明书的描述中，参考术语“一个实施例”、“一些实施例”、“示例”、“具体示例”、或“一些示例”等的描述意指结合该实施例或示例描述的具体特征、结构、材料或者特点包含于本发明的至少一个实施例或示例中。在本说明书中，对上述术语的示意性表述不一定指的是相同的实施例或示例。而且，描述的具体特征、结构、材料或者特点可以在任何的一个或多个实施例或示例中以合适的方式结合。In the description of this specification, descriptions referring to the terms "one embodiment", "some embodiments", "example", "specific examples", or "some examples" mean that specific features described in connection with the embodiment or example , structure, material or characteristic is included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
尽管上面已经示出和描述了本发明的实施例，可以理解的是，上述实施例是示例性的，不能理解为对本发明的限制，本领域的普通技术人员在不脱离本发明的原理和宗旨的情况下在本发明的范围内可以对上述实施例进行变化、修改、替换和变型。Although the embodiments of the present invention have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be construed as limitations to the present invention. Variations, modifications, substitutions, and modifications to the above-described embodiments are possible within the scope of the present invention.
Claims (10)
- 一种片材微孔群表面的激光直写-激光扫描诱导协同方法，其特征在于，包括如下步骤：A laser direct writing-laser scanning induction synergistic method on the surface of a sheet micropore group, characterized in that it comprises the following steps:绘制激光直写加工路径；Draw laser direct writing processing path;设置激光直写加工参数对片材直写；Set the laser direct writing processing parameters to write directly on the sheet;绘制激光扫描诱导路径；Draw laser scanning induced path;设置激光扫描诱导参数对直写后的片材扫描诱导加工。Set the laser scanning induction parameters to scan the induction processing of the sheet after direct writing.
- 根据权利要求1所述的片材微孔群表面的激光直写-激光扫描诱导协同方法，其特征在于，还包括选择合适参数的激光加工系统，针对激光扫描诱导选取脉冲激光器。The laser direct writing-laser scanning induction synergistic method on the surface of sheet micropore groups according to claim 1 is characterized in that it also includes selecting a laser processing system with appropriate parameters, and selecting a pulse laser for laser scanning induction.
- 根据权利要求2所述的片材微孔群表面的激光直写-激光扫描诱导协同方法，其特征在于，所述脉冲激光器的参数要求有：脉宽小于500纳秒，激光光斑直径D为20μm～100μm，激光功率大于10瓦，激光加工的扫描步长或脉冲频率与最低扫描速度的乘积小于激光光斑半径的1/3。The laser direct writing-laser scanning induction synergistic method on the surface of sheet micropore groups according to claim 2, wherein the parameters of the pulsed laser are required to have: a pulse width less than 500 nanoseconds, and a laser spot diameter D of 20 μm ~100μm, the laser power is greater than 10 watts, and the product of the scanning step or pulse frequency and the minimum scanning speed for laser processing is less than 1/3 of the laser spot radius.
- 根据权利要求1所述的片材微孔群表面的激光直写-激光扫描诱导协同方法，其特征在于，激光直写加工参数为：激光功率P大于3瓦；直写扫描速度根据公式v＝f×d设置，其中，v为激光直写加工扫描速度，f为激光直写加工的激光脉冲频率，d为直写加工点间距，取值范围为D/2<d<2000μm，D为激光光斑直径；扫描次数设置为大于1次且小于20次。The laser direct writing-laser scanning induction synergistic method on the surface of sheet material micropore group according to claim 1, is characterized in that, laser direct writing processing parameter is: laser power P is greater than 3 watts; Direct writing scanning speed according to formula v= f×d setting, where v is the scanning speed of laser direct writing processing, f is the laser pulse frequency of laser direct writing processing, d is the distance between direct writing processing points, and the value range is D/2<d<2000μm, D is the laser Spot diameter; the number of scans is set to be greater than 1 and less than 20.
- 根据权利要求1所述的片材微孔群表面的激光直写-激光扫描诱导协同方法，其特征在于，激光扫描诱导参数为：激光功率P为大于0.2瓦且小于4瓦；扫描诱导加工的扫描速度根据公式v 1＝f 1×d 1设置，其中v 1为扫描诱导加工的扫描速度，f 1为扫描诱导加工的激光脉冲频率，d 1为扫描诱导加工点间距，取值范围为D/20<d 1<D/4，D为激光光斑直径；扫描次数设置为大于1次且小于5次。 The laser direct writing-laser scanning induction synergistic method on the surface of the sheet micropore group according to claim 1 is characterized in that the laser scanning induction parameter is: the laser power P is greater than 0.2 watts and less than 4 watts; The scanning speed is set according to the formula v 1 =f 1 ×d 1 , where v 1 is the scanning speed of scanning-induced processing, f 1 is the laser pulse frequency of scanning-induced processing, and d 1 is the distance between scanning-induced processing points, and the value range is D /20<d 1 <D/4, D is the diameter of the laser spot; the number of scans is set to be greater than 1 and less than 5.
- 根据权利要求1所述的片材微孔群表面的激光直写-激光扫描诱导协同方法，其特征在于，在激光加工系统的软件系统里绘制激光直写加工路径，通过纳秒激光加工系统的软件系统设置适当的激光直写加工参数。The laser direct writing-laser scanning induction synergistic method on the surface of the sheet micropore group according to claim 1 is characterized in that, in the software system of the laser processing system, the laser direct writing processing path is drawn, through the nanosecond laser processing system The software system sets the appropriate laser direct writing processing parameters.
- 根据权利要求6所述的片材微孔群表面的激光直写-激光扫描诱导协同方法，其特征在于，在激光加工系统的软件系统里绘制与加工区域一致形状的线框图案，再通过线条填充的方式在线框内绘制平行线条，平行线条间距50μm～2000μm，绘制的线条即充满线框。The laser direct writing-laser scanning induced synergy method on the surface of sheet micropore groups according to claim 6, characterized in that, in the software system of the laser processing system, a wireframe pattern consistent with the shape of the processing area is drawn, and then through the lines The way of filling is to draw parallel lines in the wire frame, the distance between the parallel lines is 50 μm to 2000 μm, and the drawn lines fill the wire frame.
- 根据权利要求1所述的片材微孔群表面的激光直写-激光扫描诱导协同方法，其特征在于，在激光加工系统的软件系统里绘制激光扫描诱导加工的扫描路径，通过纳秒激光加工系统的软件系统设置适当的激光扫描加工参数。The laser direct writing-laser scanning induction synergistic method on the surface of the micropore group of the sheet according to claim 1 is characterized in that, in the software system of the laser processing system, the scanning path of the laser scanning induction processing is drawn, and the nanosecond laser processing is performed. The software system of the system sets the appropriate laser scanning processing parameters.
- 根据权利要求1所述的片材微孔群表面的激光直写-激光扫描诱导协同方法，其特征在 于，在激光加工系统的软件系统里绘制与加工区域一致形状的线框图案，再通过线条填充的方式在线框内绘制线间距小于激光光斑直径的1/2且大于2μm的平行线条，绘制的线条即充满线框。The laser direct writing-laser scanning induction synergy method on the surface of the micropore group of the sheet according to claim 1 is characterized in that, in the software system of the laser processing system, a wireframe pattern consistent with the shape of the processing area is drawn, and then through the lines The filling method draws parallel lines with a line spacing less than 1/2 of the laser spot diameter and greater than 2 μm in the wire frame, and the drawn lines fill the wire frame.
- 根据权利要求1所述的片材微孔群表面的激光直写-激光扫描诱导协同方法，其特征在于，将片材放置于激光加工系统平台并调整好激光束与片材待加工表面之间的相互位置，使片材待加工表面区域处于激光束焦平面上下0.5mm的范围内。The laser direct writing-laser scanning induction synergy method on the surface of the micropore group of the sheet according to claim 1, wherein the sheet is placed on the laser processing system platform and the distance between the laser beam and the surface to be processed of the sheet is adjusted The mutual position of the sheet should be within the range of 0.5 mm above and below the focal plane of the laser beam.
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| US20060219676A1 (en) * | 2005-03-25 | 2006-10-05 | National Research Council Of Canada | Fabrication of long range periodic nanostructures in transparent or semitransparent dielectrics |
| CN108620728A (en) * | 2018-05-09 | 2018-10-09 | 广州大学 | Semiconductor silicon surface large area regular distribution nano-pore array structure preparation method |
| CN110640305A (en) * | 2019-09-18 | 2020-01-03 | 清华大学 | Super-hydrophobic surface preparation system based on femtosecond laser space-time shaping |
| CN111331261A (en) * | 2020-03-26 | 2020-06-26 | 英诺激光科技股份有限公司 | Laser polishing process method and device for cutting cross section of superhard material |
| CN114535812A (en) * | 2021-12-22 | 2022-05-27 | 江苏大学 | Laser direct writing-laser scanning induction cooperative method for sheet micropore group surface |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060219676A1 (en) * | 2005-03-25 | 2006-10-05 | National Research Council Of Canada | Fabrication of long range periodic nanostructures in transparent or semitransparent dielectrics |
| CN108620728A (en) * | 2018-05-09 | 2018-10-09 | 广州大学 | Semiconductor silicon surface large area regular distribution nano-pore array structure preparation method |
| CN110640305A (en) * | 2019-09-18 | 2020-01-03 | 清华大学 | Super-hydrophobic surface preparation system based on femtosecond laser space-time shaping |
| CN111331261A (en) * | 2020-03-26 | 2020-06-26 | 英诺激光科技股份有限公司 | Laser polishing process method and device for cutting cross section of superhard material |
| CN114535812A (en) * | 2021-12-22 | 2022-05-27 | 江苏大学 | Laser direct writing-laser scanning induction cooperative method for sheet micropore group surface |
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