WO2023104437A1 - Ensemble électronique et procédé de production d'un ensemble électronique - Google Patents

Ensemble électronique et procédé de production d'un ensemble électronique Download PDF

Info

Publication number
WO2023104437A1
WO2023104437A1 PCT/EP2022/081784 EP2022081784W WO2023104437A1 WO 2023104437 A1 WO2023104437 A1 WO 2023104437A1 EP 2022081784 W EP2022081784 W EP 2022081784W WO 2023104437 A1 WO2023104437 A1 WO 2023104437A1
Authority
WO
WIPO (PCT)
Prior art keywords
holding body
contact
circuit board
contact holding
printed circuit
Prior art date
Application number
PCT/EP2022/081784
Other languages
German (de)
English (en)
Inventor
Matthias Kraus
Original Assignee
Robert Bosch Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch Gmbh filed Critical Robert Bosch Gmbh
Priority to CN202280081552.2A priority Critical patent/CN118383088A/zh
Publication of WO2023104437A1 publication Critical patent/WO2023104437A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
    • H05K5/0082—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units specially adapted for transmission control units, e.g. gearbox controllers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16H—GEARING
    • F16H61/00—Control functions within control units of change-speed- or reversing-gearings for conveying rotary motion ; Control of exclusively fluid gearing, friction gearing, gearings with endless flexible members or other particular types of gearing
    • F16H61/0003—Arrangement or mounting of elements of the control apparatus, e.g. valve assemblies or snapfittings of valves; Arrangements of the control unit on or in the transmission gearbox
    • F16H61/0006—Electronic control units for transmission control, e.g. connectors, casings or circuit boards

Definitions

  • the invention relates to an electronic assembly and a method for producing an electronic assembly.
  • Such an electronic assembly can be intended, for example, as a transmission control module for use in a contaminating medium.
  • Electronic assemblies are known in motor vehicle technology, which can be attached to the transmission, for example, or used in the transmission fluid.
  • the electronic assemblies can have electrical components such as plugs, sensors, actuators, an electronic circuit (TCU, Transmission Control Unit) and optionally other components.
  • TCU Transmission Control Unit
  • Some known electronic assemblies use a structure with a printed circuit board exposed to the transmission fluid (so-called module AVT, structure and connection technology).
  • module AVT structure and connection technology
  • rigid printed circuit boards made of fiber-reinforced epoxy resin are preferably used, which have conductor tracks in several levels.
  • the conductor tracks of the conductor track substrate are used to produce the electrical connections between the central electronic circuit and the other components of the transmission control module, ie the plugs, sensors and actuators.
  • Electronic assemblies of this type are also known for transmission control modules.
  • the sensors In transmission control modules, the sensors often have to be mounted on contact-retaining bodies protruding from the printed circuit board in order to ensure, when mounting on the transmission, that the sensors can be positioned close to the transmission components to be detected.
  • this applies in principle to sensor elements such as temperature sensors, pressure sensors and speed sensors
  • the arrangement on a contact holding body protruding from the printed circuit board is particularly advantageous for speed sensors.
  • DE 102018215 149 A1 discloses an electronic assembly that has a printed circuit board on which a contact holding body is arranged, which has an insulating material body with electrical contact elements arranged thereon.
  • An electronic component which is provided as a sensor element and is electrically connected to the contact elements of the contact holding body is arranged on a first section of the contact holding body which faces away from the printed circuit board.
  • an encapsulating compound is applied which is in cohesive contact with the printed circuit board and the contact holding body and sealingly surrounds a second section of the contact holding body facing the printed circuit board.
  • the first section of the contact holding body with the sensor element that faces away from the printed circuit board protrudes from the encapsulating compound.
  • the invention relates comprehensively to an electronic assembly
  • the electronic component be accommodated in a closed interior space between the contact holding body and a covering cap pushed onto the first section of the contact holding body, with the covering cap lying tightly against the contact holding body with a contact area facing the component side and the covering cap with its contact area at least partially is embedded in the encapsulation mass.
  • the electronic assembly preferably has a printed circuit board equipped with electronic components on at least one side or on two opposite sides.
  • the electronic components can be contacted via the conductor tracks of the printed circuit board.
  • the electronic components can in particular form an electronic control circuit for controlling electrohydraulic components of a transmission.
  • Individual electronic components can be designed as sensor elements.
  • the sensor elements can preferably be in the form of speed sensors based on semiconductors. For example, they can be Hall IC components.
  • the electronic assembly may include a circuit board having only one contact holding body on which an electronic component is placed, or a plurality of contact holding bodies each having an electronic component placed thereon. In addition to the electronic components arranged on the contact holding bodies, other electronic components can be assembled directly on the printed circuit board and covered by the encapsulating compound on the printed circuit board.
  • the encapsulating compound can be arranged on one or both sides of the printed circuit board.
  • the encapsulation compound can include a duroplast.
  • the electronic assembly can also have structural components, such as electrical plug-in connections or electrical connection contacts for contacting electrohydraulic actuators.
  • the invention also relates to a method for producing an electronic assembly with the following steps:
  • Arranging at least one contact holding body which has an insulating body with electrical contact elements arranged thereon, on a Equipment side of a printed circuit board and making electrical contacts between the contact elements and the printed circuit board, with before or after the application of the contact holding body an electrical component being arranged on a first section of the contact holding body facing away from the printed circuit board and being electrically connected to the contact elements and a covering cap being placed on a the first section of the contact holding body provided with the electronic component is slid on, so that the electronic component is accommodated in a closed interior space between the contact holding body and the covering cap and the covering cap rests tightly on the contact holding body with a contact area facing the component side, and
  • an encapsulating compound to the component side of the printed circuit board, the encapsulating compound sealingly surrounding a second section of the contact holding body facing the printed circuit board in material contact with the printed circuit board and the contact holding body, the first section of the contact holding body facing away from the printed circuit board protruding from the encapsulating compound and the covering cap is at least partially embedded in the encapsulation compound with a support area facing the component side.
  • the present invention advantageously makes it possible to provide an electronic assembly that is sealed from a contaminating medium in a simple and reliable manner.
  • An electronic component to be protected from a contaminating medium such as a sensor element, is advantageously arranged in a protected manner in the closed interior space between the contact holding body and a covering cap pushed onto the first section of the contact holding body. Due to the fact that a contact area of the covering cap facing the component side is embedded in the encapsulating compound, the electronic assembly has, in addition to the easily controllable sealing contour between the encapsulating compound and the printed circuit board, only a single circumferential sealing point on the surface in the area of the transition between the covering cap and the encapsulating compound .
  • the transition area between Encapsulation compound and the cap engaging in the encapsulation compound can advantageously be well sealed by the manufacturing process in which the encapsulation compound is applied to the printed circuit board.
  • the insulating body can therefore be made of a relatively inexpensive material, for example a thermoplastic, which would be less resistant to aggressive media without protection.
  • the electronic component on the contact holding body is not covered in one piece with the encapsulating compound, since the electronic component could be damaged depending on the process used for this purpose.
  • the electronic component can be mounted on the exposed first section of the contact holding body and then protected with the covering cap.
  • the assembly of the electronic component and the covering cap on the first section of the contact holding body can be carried out before or after the assembly of the contact holding body on the printed circuit board.
  • the contact holding body can easily be mounted on the printed circuit board by means of fasteners protruding from the second section of the contact holding body toward the printed circuit board, in that the fastening means are force-fitted, for example, into bores in the printed circuit board.
  • the fasteners can be designed for example as latching hooks or press pins that when pressed into the holes against the material of the Printed circuit board are clamped so that a force-fitting and / or positive connection is created.
  • the cover cap preferably has a cup-like projection with an interior space and a peripheral shoulder that projects outwards and adjoins the cup-like projection.
  • a side of the peripheral shoulder that faces the printed circuit board advantageously forms the support area.
  • the cover cap can be placed over the first section of the contact holding body in a simple manner until the shoulder with the contact area comes to rest on a corresponding counter-surface of the contact holding body.
  • a circumferential sealing rib can be formed on the support area, which can be pressed against the contact holding body.
  • the interior space under the covering cap is sealed off by the sealing rib for the subsequent step of applying the encapsulation material.
  • a collar that protrudes toward the printed circuit board and engages in the encapsulating compound can be formed on the edge region of the circumferential shoulder. The penetration of aggressive transmission fluid into a gap between the material of the covering cap and the encapsulation material is made more difficult by the collar.
  • the outer wall of the cup-like projection can advantageously be provided with clamping ribs.
  • sealing elements can be arranged on the clamping ribs, which are arranged in a sealing manner between the outer wall of the covering cap and an external housing wall.
  • the covering cap can be mechanically fastened to counter-latching means of the contact holding body by means of latching means protruding from the covering cap.
  • This optional mechanical attachment of the covering cap to the contact holding body serves to captively attach the covering cap to the contact holding body until the encapsulation material is applied.
  • the second section of the contact holding body can also advantageously have a disc-shaped base body and the first section can be designed as a dome-like projection protruding from the base body, the contact elements penetrating the base body and contact sections of the contact elements being exposed on the projection.
  • the disc-shaped body facilitates easy assembly.
  • the cover cap with a circumferential contact area can easily come to rest on one side of the base body in a sealing manner.
  • Ends of the contact elements can be designed in a simple manner as contact pins protruding from the base body, which are pressed into contacting openings in the printed circuit board for electrical contacting.
  • DIM direct injection molding
  • a duroplastic material can advantageously be used as the molding material, which in a known manner binds very well to the epoxy resin material of the printed circuit board, so that a very good seal on the printed circuit board and a very good seal between the encapsulating compound and the covering cap is achieved.
  • the distance between the electronic component arranged on the contact holding body can be adjusted, and thus the height can be mounted in a simple manner.
  • a slide can be used to adjust the height in the molding tool, with the slide causing a force to be applied to the covering cap, with the covering cap being supported on the contact holding body via the contact area and the contact holding body being supported on the molding tool with a holding pin passing through the printed circuit board.
  • the underside of the electronic assembly facing away from the electronic component serves as a reference surface.
  • the spacing of the electronic component can be aligned in a simple manner by the retaining pin relative to the underside of the electronic assembly, which serves as a reference surface. This is advantageous if the underside of the electronic assembly is mounted on a bearing surface in the gearbox.
  • such a slide is used in the molding tool, which represents a counterhold for a retaining pin of the contact holding body that reaches through the printed circuit board, the contact holding body being supported on the bearing area of the covering cap and the covering cap in turn being supported on the molding tool.
  • the circuit board can serve as a reference surface relative to which the pitch of the electronic component is adjusted.
  • FIG. 1 shows a perspective view of an exemplary embodiment of an electronic assembly according to the invention
  • Fig. 2 shows a cross section through the embodiment of Fig. 1,
  • FIG. 5 shows the view of the underside of the contact holding body from FIG. 4,
  • FIG. 6 shows a plan view of an embodiment of the covering cap from FIG. 1
  • FIG. 7 shows a view of the underside of the covering cap from FIG. 6,
  • FIG. 8 shows a first exemplary embodiment of a molding tool for producing the electronic assembly
  • FIG. 9 shows a second exemplary embodiment of a molding tool for producing the electronic assembly.
  • the electronic assembly 1 comprises a circuit board 10, for example a rigid multi-layer circuit board made of epoxy resin material.
  • the circuit board 10 has a first component side 101 .
  • the underside of the circuit board 10 opposite the first component side 101 can represent a second component side of the circuit board.
  • the printed circuit board 10 can be fitted on both assembly sides or only on one side with electronic components of a control circuit (not shown).
  • the printed circuit board 10 is only provided with components on the top assembly side 101 in FIGS. 1 and 2 .
  • the different components are detailed in the exploded view of FIG.
  • the electronic assembly 1 has a contact holding body 20, which consists of an insulating body 27 and electrical contact elements 14 injected therein, a covering cap 30, an electronic component 40 designed as a sensor element and an encapsulating compound 12.
  • FIG. 4 Details of the contact holding body 20 are shown in FIG. 4 and FIG. 5, while details of the cover cap 30 are shown in FIG. 6 and FIG.
  • the insulating body 27 of the contact holding body 20 is made of plastic. It can preferably be a thermoplastic material. As can best be seen in FIGS. 4 and 5 , the insulating material body 27 of the contact holding body 20 has a first section 21 and a second section 22 . The second portion 22 of the contact holding body 20 is substantially formed by a disc-shaped base body 28, from which a dome-like projection 29 protrudes, which forms the first section 21.
  • the contact elements 14 can be designed as stamped grid parts made of metal and are embedded in the plastic of the insulating body 27 . As can be seen in FIGS. 4 and 5 , the contact elements 14 can penetrate the base body 28 and contact sections 14b of the contact elements 14 can be exposed on the projection 29 .
  • the electronic component 40 has three bent connection elements 41 which can be electrically connected to the contact sections 14b by welding, for example.
  • the electronic component 40 is held in its position by fixing ribs 29a in the end area of the dome-like projection.
  • the ends of the contact elements 14 are in the form of contact pins 14a protruding from the base body 28, which can be pressed into contacting openings 11 in the printed circuit board 10 for electrical contacting.
  • the insulating body 27 has, for example, four webs 23 protruding from the base body 28 on its side facing away from the first section 21 .
  • two latching lugs are formed as counter-latching means 26 for latching means of the covering cap 30.
  • the insulating body 27 has two latching hooks 24 protruding from the base body 28 and a retaining pin 25 on its side facing away from the first section 21 .
  • FIGS. 6 and 7. An exemplary embodiment of a covering cap 30 that can be placed on the contact holding body 20 can be found in FIGS. 6 and 7.
  • the covering cap can be made of plastic.
  • the covering cap 30 can have a cup-like projection 32 in which an interior space 38 is formed, and a peripheral shoulder 39 adjoining the cup-like projection 32 and protruding outwards.
  • the annular underside of the shoulder 39 that can be seen in FIG. 7 forms a bearing area 31 on which a circumferential sealing rib 37 can be formed.
  • a vertically angled collar 35 can protrude from the support area 31 at the edge area of the peripheral shoulder 39 .
  • Clamping jaws 50 protruding towards the interior 38 can be integrally formed on the inside of the shoulder 39 .
  • the outer wall of the cup-like projection 32 can optionally be provided with clamping ribs 33, for example, on which a sealing element (not shown) can be arranged.
  • the covering cap 30 can be provided with protruding latching means 36 which can engage in the latching lugs of the contact holding body 20 designed as counter-latching means 26 .
  • the latching means 36 are provided in recesses of the collar 35 and can, for example, be in the form of clamps, as shown. The covering cap 30 is pushed with the interior space 38 over the first section 21 of the contact holding body 20 in FIG.
  • the contact holding body 20 can now be applied to the printed circuit board 10 together with the electronic component 40 and the covering cap 30 .
  • the contact pins 14a are pressed into the contacting openings 11, which can be seen in FIG.
  • the latching hooks 24 and the retaining pin 25 can have an elasticity which allows the latching hooks 24 or the retaining pin 25 to be braced against the inner wall of the receiving opening 13 .
  • FIG. 2 shows the result in FIG. 2, with FIG. 2 also showing the encapsulating compound 12 that was subsequently applied.
  • the contact holding body 20 can first be assembled on the printed circuit board 10 and then the electronic component 40 and the covering cap 30 can first be assembled on the first section 21 of the contact holding body 20 .
  • the encapsulating compound 12 is now applied to the printed circuit board 10 .
  • the encapsulating compound 12 is applied to the top and bottom of the printed circuit board 10 .
  • the encapsulation compound 12 can be applied, for example, as shown in FIGS. 8 or 9, with the encapsulation compound being applied in a molding process, in particular a DIM molding process.
  • a molding process in particular a DIM molding process.
  • the printed circuit board 10 with the contact holding body 20 arranged thereon, the electronic component 40 and the covering cap 30 can be held clamped between two tool halves 80, 81 of a molding tool.
  • a slide 82 is arranged in the upper tool half 80 of the molding tool, which causes force to be applied to the covering cap 30, with the covering cap 30 being supported on the contact holding body 20 via the contact area 31.
  • the contact holding body 20 is supported with a holding pin 25 which extends through the printed circuit board 10 on a pedestal 83 of the second tool half 81 of the molding tool.
  • the spacing of the electronic component 40 can be aligned in a simple manner by the retaining pin relative to the underside of the electronic assembly 1 serving as a reference surface.
  • the pressure of the slider 82 in conjunction with the elasticity of the sealing rib 37 of the covering cap 30 during the introduction of the encapsulating compound 12 allows precise adjustment of the distance between the electronic component 40 and the end face of the retaining pin 25 on the underside of the electronic assembly.
  • the encapsulating compound 12 is filled into the molding tool under pressure and then hardens, as a result of which the finished electronic assembly 1 is obtained.
  • a slide 84 is used in the lower tool half 81 of the mold tool, with the slide 84 serving as a counterhold for the holding pin 25 of the contact holding body 20 . Since the contact holding body 20 is supported on the support area 31 of the cover cap 30 and the cover cap 30 in turn is supported on the upper tool half 80, it can be understood in Fig. 9 that by pressing the two tool halves 80 and 81 the distance between the electronic component 40 and Component side 101 of the circuit board 10 can be set defined. The pressing force acting on the retaining pin 25 and displacing the retaining pin 25 in the receiving opening 13 of the printed circuit board can be compensated for by a relative movement of the slide 84 in the second mold half 81 .

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Casings For Electric Apparatus (AREA)

Abstract

L'invention concerne un ensemble électronique (1), qui comprend : - une carte de circuit imprimé (10) ayant au moins un côté de composant (101) ; - au moins un corps de maintien de contact (20), qui est disposé sur le côté composant (101) et a un corps de matériau isolant (27) avec des éléments de contact électrique (14) disposés sur celui-ci ; - un composant électronique (40), qui est disposé sur une première partie (21) du corps de maintien de contact (20) à distance de la carte de circuit imprimé (10) et qui est électriquement connecté aux éléments de contact (14) ; et - une masse d'encapsulation (12), qui est appliquée au moins sur le côté composant (101) et qui, en contact intégral avec la carte de circuit imprimé (10) et le corps de maintien de contact (20), entoure de manière étanche une seconde partie (22) du corps de maintien de contact (20) la plus proche de la carte de circuit imprimé (10) ; la première partie (21) du corps de maintien de contact (20) à distance de la carte de circuit imprimé (10) faisant saillie, avec le composant électronique (40), à partir de la masse d'encapsulation (12). Selon l'invention, le composant électronique (40) est logé dans un espace intérieur fermé (15) entre le corps de maintien de contact (20) et un capuchon de recouvrement (30) glissé sur la première partie (21) du corps de maintien de contact (20) ; une région d'assise (31) du capuchon de recouvrement (30) faisant face au côté composant (101) est étroitement logée sur le corps de maintien de contact (20), et la région d'assise (31) est au moins partiellement incorporée dans la masse d'encapsulation (12).
PCT/EP2022/081784 2021-12-10 2022-11-14 Ensemble électronique et procédé de production d'un ensemble électronique WO2023104437A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202280081552.2A CN118383088A (zh) 2021-12-10 2022-11-14 电子组件和用于制造电子组件的方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102021214109.9A DE102021214109A1 (de) 2021-12-10 2021-12-10 Elektronische Baugruppe und Verfahren zur Herstellung einer elektronischen Baugruppe
DE102021214109.9 2021-12-10

Publications (1)

Publication Number Publication Date
WO2023104437A1 true WO2023104437A1 (fr) 2023-06-15

Family

ID=84387710

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2022/081784 WO2023104437A1 (fr) 2021-12-10 2022-11-14 Ensemble électronique et procédé de production d'un ensemble électronique

Country Status (3)

Country Link
CN (1) CN118383088A (fr)
DE (1) DE102021214109A1 (fr)
WO (1) WO2023104437A1 (fr)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102016224669A1 (de) * 2016-12-12 2018-06-14 Conti Temic Microelectronic Gmbh Verfahren und Vorrichtung zum Abdecken eines Elektronikmoduls
DE102016226156A1 (de) * 2016-12-23 2018-06-28 Conti Temic Microelectronic Gmbh Sensoranordnung und Steuergerät mit Sensoranordnung
DE102017202962A1 (de) * 2017-02-23 2018-08-23 Robert Bosch Gmbh Elektronikmodul sowie Verfahren zum Herstellen eines Elektronikmoduls
DE102017204438A1 (de) * 2017-03-16 2018-09-20 Robert Bosch Gmbh Verfahren zum Herstellen eines elektronischen Steuermoduls und elektronisches Steuermodul
DE102017209023A1 (de) * 2017-05-30 2018-12-06 Robert Bosch Gmbh Elektronisches Bauelement mit geschütztem Kontakt
DE112017005450T5 (de) * 2016-10-28 2019-08-08 Denso Corporation Sensor für physikalische Größe der Luft
DE102018215149A1 (de) 2018-09-06 2020-03-12 Robert Bosch Gmbh Elektronisches Steuermodul und Verfahren zum Herstellen eines elektronischen Steuermoduls

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE112017005450T5 (de) * 2016-10-28 2019-08-08 Denso Corporation Sensor für physikalische Größe der Luft
DE102016224669A1 (de) * 2016-12-12 2018-06-14 Conti Temic Microelectronic Gmbh Verfahren und Vorrichtung zum Abdecken eines Elektronikmoduls
DE102016226156A1 (de) * 2016-12-23 2018-06-28 Conti Temic Microelectronic Gmbh Sensoranordnung und Steuergerät mit Sensoranordnung
DE102017202962A1 (de) * 2017-02-23 2018-08-23 Robert Bosch Gmbh Elektronikmodul sowie Verfahren zum Herstellen eines Elektronikmoduls
DE102017204438A1 (de) * 2017-03-16 2018-09-20 Robert Bosch Gmbh Verfahren zum Herstellen eines elektronischen Steuermoduls und elektronisches Steuermodul
DE102017209023A1 (de) * 2017-05-30 2018-12-06 Robert Bosch Gmbh Elektronisches Bauelement mit geschütztem Kontakt
DE102018215149A1 (de) 2018-09-06 2020-03-12 Robert Bosch Gmbh Elektronisches Steuermodul und Verfahren zum Herstellen eines elektronischen Steuermoduls

Also Published As

Publication number Publication date
CN118383088A (zh) 2024-07-23
DE102021214109A1 (de) 2023-06-15

Similar Documents

Publication Publication Date Title
EP1269580B1 (fr) Module electronique
EP1352185B1 (fr) Commande hydraulique de boite de vitesses de vehicule automobile, comprenant une plaque de distribution hydraulique en matiere plastique et des conducteurs integres dans cette plaque
DE69513575T2 (de) Magnetventilbefestigung für Blockierschutzbremssysteme
WO2009007286A2 (fr) Unité de raccordement pour une cellule de mesure de pression
WO2011110232A1 (fr) Elément de base pour un boîtier en plusieurs pièces et procédé de montage d'un boîtier
EP1456060B1 (fr) Appareil de commande electrique et son procede de production
WO2006000535A1 (fr) Partie de boitier pour unite d'entrainement et procede et outil pour produire une telle partie de boitier
EP3622589B1 (fr) Module électronique et procédé de fabrication
EP1170110A1 (fr) Procédé pour fabriquer une structure conductrice surmoulée en matière plastique d'une unité de circuit électrique ainsi qu'une unité de circuit électrique comprenant une structure conductrice surmoulée en matière plastique
EP3479663B1 (fr) Unité appareil de commande, en particulier pour un véhicule automobile
DE102007016474A1 (de) Anschlusseinheit für eine Druckmesszelle
EP3643147B1 (fr) Module électronique
WO2023104437A1 (fr) Ensemble électronique et procédé de production d'un ensemble électronique
DE102019201404A1 (de) Elektronikmodul
DE29501849U1 (de) Anordnung aus einem Gehäuse, einer Schaltungsträgerplatte und Zuleitungen
EP3471518B1 (fr) Procédé de fabrication de détecteurs optoélectroniques, en particulier de capteurs miniatures
EP3520585B1 (fr) Procédé de fabrication d'un composant électronique et composant électronique, en particulier pour un module de commande de boîte de vitesses
WO2018220036A1 (fr) Composant électronique et procédé permettant de fabriquer un composant électronique
DE102012105352A1 (de) Positionierelement
WO2013010836A2 (fr) Module connecteur, notamment pour commandes de lève-vitre, et procédé de fabrication de celui-ci
DE102017209179A1 (de) Elektronikanordnung
EP3250010A1 (fr) Module de commande électronique et procédé de fabrication d'un module de commande électronique
EP3411903B1 (fr) Module moulé, procédé de fabrication d'un module moulé et moule pour le surmoulage d'un module moulé
WO2023186201A1 (fr) Ensemble de composant électrique de véhicule à moteur
DE102022212420A1 (de) Elektronikmodul

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 22817677

Country of ref document: EP

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 2022817677

Country of ref document: EP

ENP Entry into the national phase

Ref document number: 2022817677

Country of ref document: EP

Effective date: 20240710