WO2023093178A1 - Dispositif électronique - Google Patents

Dispositif électronique Download PDF

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Publication number
WO2023093178A1
WO2023093178A1 PCT/CN2022/115813 CN2022115813W WO2023093178A1 WO 2023093178 A1 WO2023093178 A1 WO 2023093178A1 CN 2022115813 W CN2022115813 W CN 2022115813W WO 2023093178 A1 WO2023093178 A1 WO 2023093178A1
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WO
WIPO (PCT)
Prior art keywords
electronic device
main board
prism
lens
opening
Prior art date
Application number
PCT/CN2022/115813
Other languages
English (en)
Chinese (zh)
Inventor
尹帮实
崔佳轩
薛康乐
严斌
Original Assignee
荣耀终端有限公司
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Filing date
Publication date
Application filed by 荣耀终端有限公司 filed Critical 荣耀终端有限公司
Publication of WO2023093178A1 publication Critical patent/WO2023093178A1/fr

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/51—Housings
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof

Definitions

  • the present application relates to the technical field of periscope camera devices, and in particular to an electronic device.
  • the focal length of the camera placed along the thickness direction of the electronic device is small, and the optical zoom capability is limited. At present, the maximum optical zoom can reach 3 times.
  • the camera module is arranged perpendicular to the thickness direction of the electronic device, and the light is refracted through a special optical prism. Imaging is realized on the photosensitive element.
  • the camera module arranged perpendicular to the thickness direction of the electronic device is a periscope camera module.
  • the periscope camera module can achieve a higher optical zoom factor and capture distant objects more clearly.
  • the present application provides an electronic device, the assembly structure of the periscope camera module inside the electronic device is more reasonable, and the volume of the electronic device is reduced by reducing the thickness of the electronic device.
  • the electronic equipment provided by this application includes a back cover, a main board and a camera module.
  • the back cover is an external component of the electronic device, which can cover the battery and other components of the electronic device, and is used to protect the internal components of the electronic device and prevent external dust from entering the electronic device.
  • the motherboard is an important internal part of electronic equipment, on which are installed chips and circuit components that make up electronic equipment, such as BIOS chips, I/O control chips, keyboard and panel control switch interfaces, and power supply plug-ins.
  • the main board is used to connect electrical components of different voltages together to form a communication line, and can also be used to centralize the data processed by internal devices and transmit them to the outside world to realize communication functions.
  • Camera modules are used to capture still images or video.
  • the back cover of the electronic device provided by the present application is opposite to the main board, the main board includes an opening, and the camera module includes an imaging component and a signal transmission component.
  • the imaging component is used to collect ambient light, form an optical signal, and convert the optical signal into an electrical signal and transmit it to the signal transmission component.
  • the signal transmission component is used to receive the electrical signal from the imaging component, amplify it, and transmit the electrical signal to other components.
  • the first part of the imaging assembly is arranged on the main board facing the rear cover, and the second part of the imaging assembly extends toward the opening, so that the rear cover can sink and be closer to the main board.
  • the distance between the cover and the main board reduces the thickness of the electronic device and further reduces the volume of the electronic device.
  • the signal transmission component is arranged on the main board facing the rear cover, and the imaging component and the signal transmission component are connected through a flexible circuit board.
  • the first part of the imaging component is disposed on both sides of the opening opposite to the signal transmission component.
  • the first part of the imaging component includes a prism
  • the second part of the imaging component includes a lens barrel, a photosensitive element, and a module substrate
  • the prism is used to change the optical path of the incident light so that it passes into the lens
  • the lens barrel is used to fix the optical components inside it, such as lenses, filters, etc., and to prevent light loss caused by the expansion of the beam.
  • the photosensitive element may be a charge coupled device (CCD) or a complementary metal-oxide-semiconductor (CMOS) phototransistor.
  • CMOS complementary metal-oxide-semiconductor
  • the photosensitive element is used to convert the optical signal passing through the lens barrel into an electrical signal, and then transmit the electrical signal to a signal processing element such as an ISP to further complete the signal processing of the electrical signal.
  • the electronic device of the present application may include 1 or N camera modules, where N is a positive integer greater than 1.
  • the prism includes a first light-transmitting surface, and the first light-transmitting surface is a surface of the prism facing the signal transmission component, and one end of the lens barrel is sealingly connected to the first light-transmitting surface of the prism , the other end of the lens barrel extends toward the opening.
  • the photosensitive element is arranged at the other end of the lens barrel, and is sealed and connected with the lens barrel.
  • the module substrate is attached to one side surface of the photosensitive element, and one side surface of the photosensitive element is On the surface away from the lens barrel, the photosensitive element is connected to the signal transmission component through the flexible circuit board.
  • the lens barrel includes a first structure part and a second structure part, both of which are hollow structures with the same inner diameter, and one end of the first structure part is connected to the second structure part.
  • the first light-transmitting surface is sealed and connected, and the other end of the first structure part is sealed and connected with the second structure part.
  • the direction of the cover extends, and the included angle of the second structure part relative to the main board is greater than 0° and less than 90°.
  • connection between the prism and the first structural part is located at the edge of the opening, and the first structural part is arranged obliquely relative to the main board, and moves away from the rear cover from the opening. Extending, the included angle of the first structure part relative to the main board is greater than 0° and less than 90°.
  • the first structure part is parallel to the main board, and the first structure part is arranged between the prism and the edge of the opening, so One end of the first structural part away from the prism is coplanar with the edge of the opening; one end of the second structural part is sealed and connected to one end of the first structural part, and the other end is away from the back cover to the opening. direction extension.
  • the prism further includes a second light-transmitting surface, and the second light-transmitting surface is a surface of the prism on a side away from the main board.
  • the back cover also includes a lens hole, a lens protection sheet is arranged in the lens hole, the lens protection sheet is opposite to and parallel to the second light-transmitting surface, and the lens protection sheet is used to prevent external dust from entering the Inside the electronics.
  • the electronic device further includes a decoration and a connecting platform
  • the decoration is a hollow ring structure
  • the outer diameter of the decoration is the same as the inner diameter of the lens hole
  • the decoration is embedded in the In the lens hole
  • the lens protection sheet is fixed in the decorative part
  • the connecting platform is a hollow ring structure, and it is attached to the inner side of the rear cover, and the inner ring of the connecting platform is connected to the decoration The outer ring connection of the piece,
  • the inner wall of the decoration part is provided with a first groove
  • the lens protection sheet is located in the decoration part
  • the edge of the lens protection sheet is embedded in the first groove
  • a storage table is also included, the storage table is a hollow ring structure, and the outer ring of the storage table is connected to the inner ring of the decorative part, and the lens protection sheet is bonded to the storage table away from the surface of the motherboard.
  • the distance from the surface of the storage table far away from the main board to the surface of the decoration member away from the main board is greater than or equal to the thickness of the lens protection sheet.
  • the second structural part further includes a first surface, the first surface is a bottom plane of the second structural part away from the lens protection sheet, the first surface is opposite to the main board parallel.
  • the decorative part further includes a second surface, and the second surface is a surface of the decorative part facing the second structural part and having the same curvature as the second structural part.
  • the second structural part further includes a second groove, the second groove is located at the contact between the second structural part and the decorative part, so that the decorative part is partially embedded in the in the second groove.
  • the imaging assembly further includes a support frame, the support frame is located on the main board and is used for carrying the prism.
  • the electronic device further includes a sealing ring, the sealing ring surrounds the edge of the second light-transmitting surface, and is glued between the prism and the lens protection sheet, and the sealing ring is used for It is used to protect the prism and prevent external water vapor, dust and other substances from adhering to the surface of the prism.
  • the storage table extends toward the center of the decorative part until it reaches the surface of the sealing ring on a side away from the lens protection sheet, and the surface of the sealing ring on a side away from the lens protection sheet bonding.
  • the electronic device further includes a fixing frame, the fixing frame is fixedly connected to the main board and wraps around the support frame, so as to limit the movement of the support frame.
  • the fixing frame includes a first connecting body and at least one second connecting body, the first connecting body and at least one second connecting body are integrally structured, and the first connecting body covers the Around the supporting frame, at least one of the second connecting bodies is fixed on the main board through positioning bolts.
  • a supporting sheet is also included, which is used to support the camera module to balance the gravity of the camera module.
  • the support sheet includes a first support portion, a second support portion and a third support portion.
  • the second support part and the third support part are arranged opposite to the two sides of the first support part, and are fixedly connected with the first support part.
  • An embedding groove is provided on the surface of the main board away from the rear cover, and two embedding grooves are oppositely arranged on both sides of the opening, and the second supporting part and the third supporting part are partially embedded In the embedding groove, there is a space between the first support part and the main board.
  • the present application provides an electronic device, including a back cover, a main board and a camera module, the back cover and the main board are arranged oppositely, the main board includes an opening, and the camera module includes an imaging component and a signal transmission component.
  • the first part of the imaging component is arranged on the main board facing the back cover, the second part of the imaging component extends toward the opening, the signal transmission component is set on the main board facing the back cover, and the imaging component and the signal transmission component are connected through a flexible circuit board.
  • the imaging component can partially extend into the opening, so that the internal assembly structure of the electronic device is more reasonable, and the volume of the electronic device is reduced by reducing the thickness of the electronic device.
  • FIG. 1 is a schematic structural view of a current electronic device
  • Fig. 2 is a schematic diagram of an assembly structure of a periscope camera module inside an electronic device
  • Fig. 3 is a partial structural schematic diagram of a periscope camera module
  • FIG. 4 is a schematic diagram of an assembly structure of a camera module provided in some embodiments of the present application inside an electronic device;
  • FIG. 5 is a schematic structural diagram of a motherboard provided in some embodiments of the present application.
  • Fig. 6 is a schematic diagram of an assembly structure of a camera module provided in some embodiments of the present application inside an electronic device;
  • Fig. 7 is a schematic diagram of an assembly structure of a camera module provided in some embodiments of the present application inside an electronic device;
  • Fig. 8 is a schematic structural diagram of a second structural part provided in some embodiments of the present application.
  • FIG. 9 is a schematic diagram of an assembly structure of a camera module provided in some embodiments of the present application inside an electronic device;
  • Fig. 10 is a schematic diagram of the second surface structure of the decorative part provided by some embodiments of the present application.
  • Fig. 11 is a schematic diagram of an assembly structure of a camera module provided in some embodiments of the present application inside an electronic device;
  • Fig. 12 is a schematic structural diagram of a second structural part provided in some embodiments of the present application.
  • Fig. 13 is a schematic three-dimensional cross-sectional view of a decorative part provided by some embodiments of the present application.
  • Fig. 14 is a schematic diagram of the internal assembly structure of the electronic device provided by some embodiments of the present application.
  • Fig. 15 is a schematic diagram of the internal assembly structure of the electronic device provided by some embodiments of the present application.
  • Fig. 16 is a schematic diagram of the internal assembly structure of the electronic device provided by some embodiments of the present application.
  • Fig. 17 is a schematic diagram of a three-dimensional assembly structure inside an electronic device provided by some embodiments of the present application.
  • Fig. 18 is a schematic diagram of the internal assembly structure of the electronic device provided by some embodiments of the present application.
  • Fig. 19 is a schematic diagram of a three-dimensional assembly structure inside an electronic device provided by some embodiments of the present application.
  • FIG. 20 is a schematic diagram of a three-dimensional assembly structure inside an electronic device provided by some embodiments of the present application.
  • Fig. 21 is a schematic diagram of a three-dimensional assembly structure inside an electronic device provided by some embodiments of the present application.
  • Fig. 22 is a schematic diagram of an internal assembly structure of an electronic device provided by some embodiments of the present application.
  • Figure 23 is a schematic diagram of the exploded structure between the support sheet and the main board provided by some embodiments of the present application.
  • Figure 24 is a schematic diagram of the exploded structure between the support sheet and the main board provided in some embodiments of the present application.
  • Fig. 25 is a schematic structural diagram of a support sheet provided by some embodiments of the present application.
  • Fig. 26 is a schematic structural diagram of a support sheet provided by some embodiments of the present application.
  • 1-back cover 2-main board; 3-periscope camera module; 4-lens hole; 5-camera module; 6-decorative parts; 7-sealing ring; 8-fixing frame; ;11-support sheet; 21-opening; 22 embedded groove; 31-lens protection sheet; 32-prism; 33-lens barrel; 34-photosensitive element; 35-connector; 36-lens assembly; 37-module substrate; 38-Flexible circuit board; 51-Imaging component; 52-Signal transmission component; 53-Support frame; 61-Connection platform; Body; 111-first supporting part; 112-second supporting part; 113-third supporting part; 114-window; 311-first side; 312-second side; 323-reflecting surface; 331-first structure part; 332-second structure part; 333-first surface; 334-second groove; 511-first part; 512-second part.
  • FIG. 1 is a schematic structural diagram of a current electronic device
  • FIG. 2 is a schematic diagram of an internal assembly structure of the electronic device.
  • the electronic device may include a rear cover 1, a main board 2, and a periscope camera module 3.
  • the periscope camera module 3 is an image input device and is the most important device for image capture. important electronic devices.
  • the periscope camera module 3 may include a lens protection sheet 31 , a prism 32 , a lens barrel 33 , a photosensitive element 34 , a connector 35 , a lens assembly 36 and a module substrate 37 .
  • the back cover 1 includes at least one lens hole 4, and the lens protection sheet 31 can be embedded in the lens hole 4.
  • the lens protection sheet 31 is made of light-transmitting material, and is used to transmit ambient light and prevent external dust from entering the interior of the electronic device.
  • the lens protection sheet 31 includes a first side 311 and a second side 312, wherein the first side 311 is the side of the lens protection sheet 31 facing the outside of the electronic device, and the second side 312 is the side of the lens protection sheet 31 facing the inside of the electronic device On the side, the light L1 enters the lens protection sheet 31 from the first side 311 and exits the lens protection sheet 31 from the second side 312 , and enters the interior of the electronic device.
  • the lens barrel 33 is arranged parallel to the mainboard 2 between the mainboard 2 and the lens protection sheet 31. More specifically, the side of the lens barrel 33 close to the lens hole 4 is provided with a broken wall structure so that the light L1 can enter the inside of the lens barrel.
  • the prism 32 It is fixed at one end of the lens barrel 33 and is located at the bottom of the broken wall structure of the lens barrel 33.
  • the light L1 can enter the prism 32 from the broken wall structure of the lens barrel 33, the photosensitive element 34 is fixed at the other end of the lens barrel 33, and the lens assembly 36 is set In the lens barrel 33, and between the prism 32 and the photosensitive element 34, the photosensitive element 34 is attached to the module substrate 37, and the module substrate 37 is connected to the connector 35 provided on the main board 2 through a flexible circuit board. .
  • Fig. 3 is a partial structural schematic diagram of a periscope camera module, referring to Fig. 2 and Fig. 3, the prism 32 in the electronic device may be a triangular prism, including a first light-transmitting surface 321, a second light-transmitting surface 322 and a reflection Surface 323, the first light-transmitting surface 321 is the side surface of the prism 32 facing the photosensitive element 34, the second light-transmitting surface 322 is the side surface of the prism 32 facing the lens protection sheet 31, the second light-transmission surface 322 and the lens protection sheet 31 parallel settings. More specifically, photosensitive pixel blocks for receiving light signals are disposed on the photosensitive element 34 , and the first light-transmitting surface 321 is disposed opposite to the side of the photosensitive element 34 on which the photosensitive pixel blocks are disposed.
  • the light L1 After passing through the second side surface 312, the light L1 reaches the second light-transmitting surface 322 through the opening on the lens barrel 33, enters from the second light-transmitting surface 322, and reflects after reaching the reflecting surface 323, and the direction of the light path changes.
  • the first light-transmitting surface 321 passes through and reaches the photosensitive element 34 through the lens assembly 36.
  • the conversion of optical signals to electrical signals can be realized through the photosensitive element 34, and the photosensitive element 34 can transmit the converted electrical signal to the module substrate 37.
  • the module substrate 37 transmits the electrical signal to the connector 35 through the flexible circuit board 38 , and then the electrical signal is transmitted to the main board through the connector 35 , and the main board can process the received electrical signal to generate an electronic image.
  • an embodiment of the present application provides a An electronic device, including but not limited to mobile phones, tablet computers, aerial vehicles, smart wearable devices, etc., the electronic device reduces the thickness of the electronic device by improving the assembly structure of its internal camera module, thereby reducing the The volume of electronic equipment makes electronic equipment more miniaturized and compact.
  • FIG. 4 is a schematic diagram of an assembly structure of a camera module provided in an electronic device according to some embodiments of the present application.
  • the electronic device includes a rear cover 1 , a camera module 5 , a lens protection sheet 31 and a main board 2 , and the camera module 5 includes an imaging component 51 and a signal transmission component 52 .
  • the back cover 1 is an external component of the electronic device, used to protect the internal components of the electronic device, and the back cover 1 can cover components such as batteries of the electronic device.
  • the back cover 1 can be made of plastic material, and the plastic has good ductility, which is conducive to the shaping and production of the back cover 1 , and further facilitates the mass production of the back cover 1 .
  • the specific material of the back cover 1 can also be set according to different situations.
  • the back cover 1 can also be made of metal materials such as aluminum and iron, and the hardness of metal materials such as aluminum and iron is better. , which is beneficial to the protection of the internal components of the electronic device, and the specific material of the back cover 1 is not limited here.
  • FIG. 5 is a schematic structural diagram of the main board provided by some embodiments of the present application.
  • the main board 2 includes an opening 21, which is a hollow structure located in the middle of the main board 2. It should be noted that the size of the opening 21 and the position on the main board can be set according to actual needs, and the specific size of the opening and the specific position on the main board are not limited here.
  • the edge of the lens hole 4 is provided with a decoration 6, the decoration 6 is a hollow ring structure, and the outer diameter of the decoration 6 is the same as the inner diameter of the lens hole 4, so that The decorative part 6 and the lens hole 4 can be sealed and connected to prevent external dust from entering the interior of the electronic device.
  • the outer wall of the decorative part 6 is provided with a connecting platform 61, the outer ring of the connecting platform 61 is sealed and connected with the inner ring of the decorative part 6, and the connecting platform 61 is attached to the inner side of the rear cover 1, and is used to fix the decorative part 6 on the lens hole 4 More specifically, the connecting platform 61 can be attached to the inner side of the rear cover 1 by means of bonding, welding, clamping, etc., so that the decorative part 6 is fixed in the lens hole 4 .
  • the inner wall of the decoration 6 is provided with a first groove
  • the lens protection sheet 31 is located in the decoration 6
  • the edge of the lens protection sheet 31 is embedded in the first groove.
  • a storage platform 62 is provided on the inner wall of the decorative part 6 , and the storage platform 62 is a hollow ring structure, and the outer ring of the storage platform 62 is in sealing connection with the inner ring of the decorative part 6 .
  • the storage table 62 is used to fix the lens protection sheet 31, and the lens protection sheet 31 is bonded to the surface of the storage table 62 away from the main board 2, and the distance from the surface of the storage table far away from the main board to the surface of the decorative part away from the main board is greater than or equal to the lens protection sheet thickness of.
  • the imaging component 51 , the signal transmission component 52 and the main board 2 are all located inside the electronic device.
  • the first part 511 of the imaging component 51 is disposed on the main board 2 facing the back cover 1 and opposite to the lens protection sheet 31
  • the second part 512 extends toward the opening 21 .
  • the signal transmission component 52 is arranged on the main board 2, and is located between the rear cover 1 and the main board 2, and is connected to the imaging component 51 through the flexible circuit board 38.
  • the specific position of the signal transmission component 52 is not specifically limited.
  • the signal transmission component 52 can be opposite to the first part 511 of the imaging component 51 set on both sides of the opening.
  • the first part 511 of the imaging component 51 includes the prism 32
  • the second part 512 of the imaging component 51 includes the lens barrel 33 , the lens component 36 , the photosensitive element 34 and the module substrate 37 .
  • FIG. 6 is a schematic diagram of an assembly structure of a camera module provided in some embodiments of the present application inside an electronic device.
  • the prism 32 is arranged on the main board 2 opposite to the lens protection sheet 31.
  • the prism 32 includes a first The transparent surface 321 , the second transparent surface 322 and the reflective surface 323 .
  • the first light-transmitting surface 321 is a side surface where the prism 32 is connected with the second part of the imaging assembly 51, one end of the lens barrel is sealed and connected with the first light-transmitting surface of the prism, and the other end of the lens barrel 33 faces the prism with the photosensitive element 34 32 one side sealing connection.
  • the first light-transmitting surface 321 can be sealed and connected to one end of the lens barrel 33 by means of bonding, welding, clipping, or the like.
  • the prism 32 is a triangular prism, but in other implementation manners, the prism 32 may also be a polygonal prism 32, and the specific type of the prism 32 is not limited here.
  • the prism 32 may be made of quartz glass, which has high hardness and high transparency, which is beneficial to improve the wear resistance and optical performance of the prism 32 .
  • the prism 32 can also be made of optical glass, alkali metal halide (such as sodium bromide) crystal and other materials.
  • alkali metal halide such as sodium bromide
  • the specific material of the prism 32 can be set according to different situations, and the material of the prism 32 is not limited here.
  • the lens barrel 33 includes a first structure part 331 and a second structure part 332. Both the first structure part 331 and the second structure part 332 are hollow structures with the same inner diameter. One end of the first structure part 331 is sealed with the first light-transmitting surface 321. connected, and the other end is sealingly connected with one end of the second structure part 332 . The other end of the second structure portion 332 extends toward the signal transmission component 52 .
  • the prism 32 is spaced from the edge of the opening 21, the first structural part 331 is parallel to the main board 2, and the first structural part 331 is arranged between the prism 32 and the edge of the opening 21. Meanwhile, the end of the first structure portion 331 away from the prism 32 is in the same plane as the edge of the opening 21 .
  • One end of the second structure part 332 is sealingly connected to the first structure part 331 , and the other end extends toward the opening 21 away from the rear cover 1 .
  • connection between the prism 32 and the first structural part 331 may also be located at the edge of the opening 21, and the first structural part 331 is arranged obliquely relative to the main board 2, and moves away from the rear cover 1 toward the opening 21.
  • the angle A between the first structure part 331 and the main board 2 is 0° ⁇ A ⁇ 90°, so that the other end of the second structure part 332 is located in the opening 21 of the main board 2 .
  • the end of the second structural part 332 away from the first structural part 331 may partly or completely pass through the opening 21 of the main board 2 .
  • the distance that the second structure part 332 extends along the bending direction can be set according to the size of the opening 21 on the main board 2 and the actual needs without affecting the light transmission. The distance is limited.
  • the technical solution provided by the embodiment of the present application is conducive to reducing the thickness of the electronic device. Specifically, if the distance between the highest point and the lowest point of the tangent plane where the top of the second structure part is located is defined as S1 in the direction perpendicular to the horizontal plane, then S1 That is, the thickness that can be reduced by the electronic device (that is, the distance that the casing can sink).
  • the thickness S1 that can be reduced by the above-mentioned electronic device is the limit distance, which can be realized by adjusting the angle of A in practical applications.
  • the photosensitive element 34 is arranged at the end of the second structural part 332 away from the first structural part 331 , the lens assembly 36 is vertically arranged in the lens barrel 33 , and is located between the prism 32 and the photosensitive element. 34 , the module substrate 37 is disposed on the side of the photosensitive element 34 away from the lens assembly 36 .
  • the lens assembly 36 can be lens elements such as a fixed-focus lens, a telephoto lens, and a wide-angle lens. In specific applications, it can also be configured with optical lenses such as optical filters.
  • the lens assembly 36 can be designed with reference to the prior art. , this application will not go into details.
  • the side of the photosensitive element 34 facing the first light-transmitting surface 321 includes a plurality of photosensitive pixel blocks, and each photosensitive pixel block corresponds to three photosensitive units of red, green and blue. After the light signal passing through the lens assembly 36 reaches the photosensitive element, it further enters the The corresponding photosensitive unit, which is essentially a photodiode, can convert light signals of different intensities into electrical signals of different intensities, and use the module substrate 37 to transmit the converted electrical signals to other components.
  • the imaging assembly 51 further includes a support frame 53, the support frame 53 is arranged on the main board 2, and is in contact with the prism 32, and the size of the support frame 53 matches the size of the prism 32, so as to Ensure that the support frame 53 can stably carry the prism 32.
  • the support frame 53 can carry the prism and at the same time move the prism by matching with magnets, balls, etc., so as to realize the change of the reflection position of the optical path, optical anti-shake, etc. function, in a specific application, the support frame can be designed with reference to the prior art, which will not be repeated in this application.
  • light L2 enters the lens protection sheet 31 from the first side 311, passes through the lens protection sheet 31 from the second side 312, enters through the second light-transmitting surface 322 of the prism 32, and is reflected after reaching the reflecting surface 323.
  • the propagating direction of the light changes, and passes through the first light-transmitting surface 321, and reaches the photosensitive element 34 through the lens assembly 36.
  • the photosensitive element 34 can realize the conversion of the optical signal to the electrical signal, and the photosensitive element 34 can convert the converted electrical signal
  • the signal is transmitted to the module substrate 37, and the module substrate 37 transmits the electrical signal to the signal transmission component 52 through the flexible circuit board 38, and then the signal transmission component 52 transmits the electrical signal to the main board, and the main board can process the received electrical signal , to generate an electronic image.
  • the included angle between the reflecting surface 323 and the first light-transmitting surface 321 is C
  • the included angle between the reflecting surface 323 and the second light-transmitting surface 322 is B
  • the size of the angle between B and C needs to be determined according to The selected refractive index of the prism 32, after the light reaches the reflective surface 323 and is reflected, is expected to be set at the angle at which the light is deflected relative to the horizontal plane.
  • Figure 7 is a schematic diagram of the internal assembly structure of the electronic device provided by some embodiments of the present application
  • Figure 8 is a schematic structural diagram of the second structural part provided by some embodiments of the present application, in one implementation, as shown in Figure 7 and Figure 8
  • the second structural part 332 also includes a first surface 333
  • the first surface 333 is the bottom plane of the second structural part 332 away from the lens protection sheet 31
  • the first surface 333 is parallel to the main board 2, so as to reduce the second
  • the distance S2 from the first surface 333 of the structure part 332 to the top cut surface of the second structure part 332 further reduces the thickness of the electronic device.
  • FIG. 9 is a schematic diagram of an internal assembly structure of an electronic device provided by some embodiments of the present application
  • FIG. 10 is a schematic structural diagram of a decorative part provided by some embodiments of the present application.
  • the decorative part 6 further includes a second surface 63 , the second surface 63 is that the decorative part 6 faces the second structural part 332 and has the same arc as the second structural part 332 In order to further reduce the thickness of the electronic device by reducing the distance between the lens protection sheet 31 and the prism 32 .
  • FIG. 11 is a schematic diagram of an internal assembly structure of an electronic device provided in some embodiments of the present application
  • FIG. 12 is a schematic structural diagram of a second structural part provided in some embodiments of the present application.
  • the second structural part 332 further includes a second groove 334
  • the second groove 334 is located at the contact position between the second structural part 332 and the decorative part 6, so that The decorative part 6 is partially embedded in the second groove 334 , and by reducing the distance between the lens protection sheet 31 and the prism 32 , the thickness of the electronic device is further reduced.
  • the present application does not impose specific restrictions on the position, shape and size of the second groove 334, as long as the shape and size of the second groove 334 are consistent with the shape and size of the contact point between the decorative part 6 and the second structural part 332. It only needs to be matched so that the decorative part 6 can be partially embedded in the groove, which will not be repeated in this application.
  • Fig. 13 is a three-dimensional schematic cross-sectional view of a decorative part provided by some embodiments of the present application.
  • the connecting platform 61 surrounds the decorative part 6 for connecting the decorative part 6 Connected with the rear cover 1
  • the storage table 62 can be distributed on the inner wall of the decoration part in a stepped manner, and is used for placing the lens protection sheet 31 .
  • a sealing ring 7 is also provided between the prism 32 and the lens protection sheet 31 .
  • the sealing ring 7 is a hollow ring structure, and the cross-sectional shape of the sealing ring 7 matches the shape of the second light-transmitting surface 322 of the prism 32 .
  • the second light-transmitting surface 322 can be rectangular, and the sealing ring 7 can be a cube or a cuboid, forming a hollow cavity inside, and the cross-section of the sealing ring 7 is the same rectangle as the second light-transmitting surface 322 .
  • the second light-transmitting surface 322 may be triangular
  • the sealing ring 7 may be a triangular prism forming a hollow cavity inside.
  • the section of the sealing ring 7 is the same triangle as the second light-transmitting surface 322 .
  • the sealing ring 7 can be made of materials such as foam, rubber, silica gel, etc., and is used to protect the prism 32 and prevent external water vapor or dust from adhering to the surface of the prism 32 and affecting the light transmission and reflection capabilities of the prism 32.
  • the sealing ring 7 surrounds the edge of the second light-transmitting surface 322 of the prism 32 and is in close contact with the prism 32 and the lens protection sheet 31 . Specifically, the sealing ring 7 can be bonded between the prism 32 and the lens protection sheet 31 .
  • FIG. 15 is a schematic diagram of the internal assembly structure of the electronic device provided by some embodiments of the present application.
  • the storage table 62 can extend toward the center of the decoration 6 until it reaches the second light-transmitting surface 322 edge side.
  • a sealing ring 7 can be arranged between the prism 32 and the object table 62.
  • the sealing ring 7 is a hollow annular structure, and the shape of the sealing ring 7 matches the shape of the second light-transmitting surface 322 .
  • the second light-transmitting surface 322 can be rectangular, and the sealing ring 7 can be a cube or a cuboid, forming a hollow cavity inside, and the cross-section of the sealing ring 7 is the same rectangle as the second light-transmitting surface 322 .
  • the second light-transmitting surface 322 may be triangular, and the sealing ring 7 may be a triangular prism forming a hollow cavity inside.
  • the section of the sealing ring 7 is the same triangle as the second light-transmitting surface 322 .
  • the sealing ring 7 is distributed on the edge of the second light-transmitting surface 322 and is in close contact with the prism 32 and the object table 62 . Specifically, the sealing ring 7 can be bonded between the prism 32 and the object table 62 .
  • Figure 16 is a schematic diagram of the assembly structure inside the electronic device provided by some embodiments of the present application
  • Figure 17 is a schematic diagram of the three-dimensional assembly structure inside the electronic device provided by some embodiments of the present application, as shown in Figure 16 and Figure 17, in one implementation
  • the electronic device may also include a fixing frame 8, which is wrapped around the prism 32 and the supporting frame 53, and is fixedly connected to the main board to limit the positions of the prism 32 and the supporting frame 53.
  • the fixing frame 8 may It is fixedly connected to the main board 2 by means of bonding, welding, clamping or the like.
  • FIG. 18 is a schematic diagram of an internal assembly structure of an electronic device provided by some embodiments of the present application
  • FIG. 19 is a schematic diagram of a three-dimensional assembly structure of an internal electronic device provided by some embodiments of the present application.
  • the fixing frame 8 may further include a first connecting body 81 and a second connecting body 82, and the first connecting body 81 and the second connecting body 82 may be an integral structure.
  • the first connecting body 81 is located on the main board, and the prism 32 and the supporting frame 53 may be partially or completely embedded in the first connecting body 81 .
  • the second connecting body 82 can be a cube structure, the length of each side of which is less than or equal to the length of the base of one side of the outer surface of the first connecting body 81 in contact with it, and the second connecting body 82 is located between the first connecting body 81-
  • the bottom of the side outer surface is fixedly connected with the first connecting body 81, the second connecting body 82 is in contact with the main board 2, and the second connecting body 82 and the main board 2 are provided with coaxial perforations, and the positioning bolt 9 is arranged in the perforating holes, and
  • the outer diameter of the positioning bolt 9 is the same as the inner diameter of the perforation, which is used to increase the stability of the connection between the second connecting body 82 and the main board 2, and avoid relative sliding between the camera module 5 and the main board 2, so as to limit the camera module 5 s position.
  • FIG. 20 is a schematic diagram of a three-dimensional assembly structure inside an electronic device provided by some embodiments of the present application.
  • the first connecting body 81 in order to further limit the position of the camera module 5, can be fixedly connected with two second connecting bodies 82 respectively to form an integrated structure, the second connecting body 82 is in contact with the main board 2.
  • the two second connectors 82 can be located at the bottom of the outer surfaces on both sides opposite to the first connector 81, or can be located at the bottom of the outer surfaces on both sides adjacent to the first connector 81.
  • each second connecting body 82 and the main board 2 are provided with a coaxial perforation
  • the positioning pin 9 is arranged in the perforation, and the outer diameter of the positioning pin 9 is the same as the inner diameter of the perforating to increase the second connecting body 82 and the main board. 2
  • the position of the second connecting body 82 can be adjusted as required, which is not specifically limited in this application.
  • Figure 21 is a schematic diagram of a three-dimensional assembly structure inside an electronic device provided by some embodiments of the present application.
  • a plurality of second connectors 82 are fixedly connected to form an integrated structure.
  • the plurality of second connectors 82 are all in contact with the main board 2.
  • at least one second connector is provided at the bottom of the outer surface of each side of the first connector 81.
  • each second connecting body 82 and the main board 2 are provided with a coaxial perforation, the positioning pin 9 is arranged in the perforation, and the outer diameter of the positioning pin 9 is the same as the inner diameter of the perforation, so as to increase the second connecting body 82
  • the stability of the connection with the main board 2, in specific implementation, the positions of these second connecting bodies 82 can be adjusted as required, which is not specifically limited in this application.
  • the inner wall of the perforation is provided with a first thread structure
  • the outer wall of the positioning bolt 9 is provided with a second thread structure matching the first thread structure
  • the positioning bolt 9 and the perforation pass through the first thread structure and the second thread structure.
  • the structure is tightly connected, which increases the stability of the connection between the second connecting body 82 and the main board 2 .
  • Figure 22 is a schematic diagram of the internal assembly structure of the electronic device provided by some embodiments of the present application
  • Figure 23 is a schematic diagram of the exploded structure between the support sheet and the main board provided by some embodiments of the present application, as shown in Figures 22 and 23, in a
  • the electronic device further includes a support sheet 11, and the support sheet 11 includes a first support portion 111, a second support portion 112, and a third support portion 113.
  • the second support portion 112 and the third support portion 113 are oppositely disposed on two sides of the first support portion 111 , and are fixedly connected with the first support portion 111 .
  • Embedding grooves 22 are respectively provided on the parts of the main board 2 close to the two sides of the opening 21, and the second supporting part 112 and the third supporting part 113 can be partially embedded in the embedding grooves 22 by bonding, welding, clipping, etc., so that the first supporting part
  • the part 111 is located on the side of the main board 2 away from the back cover 1, and there is a space between the main board 2.
  • the first support part 111 can provide support for the second structural part 332 to balance the gravity on the second structural part 332, thereby fixing the second structural part 332.
  • Second structural part 332 Second structural part 332 .
  • Fig. 24 is a schematic diagram of an exploded structure between a support sheet and a main board provided in some embodiments of the present application.
  • the connection line between the center points of the two embedding grooves 22 is along the long side of the electronic device, or as shown in FIG. 24, the two embedding grooves 22 is along the direction of the width of the electronic device, as long as the second support part 112 and the third support part 113 are embedded in the insertion groove 22, the first support part 111 is located at the bottom of the opening 21, and the opening 21
  • the projected area of the first supporting portion 111 may be less than or equal to the area of the surface of the first supporting portion 111 close to the main board 2 .
  • the supporting sheet 11 can be made of plastic material, and the plastic has good ductility, which is beneficial to shaping and manufacturing the supporting sheet 11 , and further facilitates the mass production of the supporting sheet 11 .
  • the specific material of the support piece 11 can also be set according to different situations.
  • the support piece 11 can also be made of metal materials such as steel, iron, alloy, etc., and metal materials such as steel, iron, alloy, etc. The hardness is better, which is beneficial to provide support for the second structure part 332, and the specific material of the support piece 11 is not limited here.
  • Figure 25 is a schematic structural view of the support sheet provided by some embodiments of the present application
  • Figure 26 is a schematic structural view of the support sheet provided by some embodiments of the present application, see Figure 25 and Figure 26, in one implementation, the support sheet 11 A window 114 is also provided to reduce the weight of the electronic device after adding the supporting sheet 11 .
  • the opening 114 is a plurality of opening structures evenly arranged on the supporting sheet 11, and the shape of the hole can be circular, square, rectangular or any other shape, or the opening 114 is a strip-shaped hollow arranged on the supporting sheet 11 structure, it should be noted that if the window opening 114 is a strip-shaped hollow structure arranged on the support sheet 11, the strip-shaped hollow structure should not be too large, so as to avoid the second structural part 332 being completely exposed from the strip-shaped hollow structure. The ability to support the second structure part 332 is lost.
  • the present application provides an electronic device, including a back cover, a main board and a camera module, the back cover and the main board are arranged oppositely, the main board includes an opening, and the camera module includes an imaging component and a signal transmission component.
  • the first part of the imaging component is arranged on the main board facing the back cover, the second part of the imaging component extends toward the opening, the signal transmission component is set on the main board facing the back cover, and the imaging component and the signal transmission component are connected through a flexible circuit board.
  • the imaging component can partially extend into the opening, so that the internal assembly structure of the electronic device is more reasonable, and the volume of the electronic device is reduced by reducing the thickness of the electronic device.

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  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Studio Devices (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)

Abstract

La présente invention concerne un dispositif électronique. Le dispositif électronique comprend un couvercle arrière, une carte principale et un module de caméra, dans lequel le couvercle arrière et la carte principale sont disposés en face l'un de l'autre, la carte principale comprend une ouverture, et le module de caméra comprend un ensemble d'imagerie et un ensemble de transmission de signal. Une première partie de l'ensemble d'imagerie fait face au couvercle arrière et est disposée sur la carte principale, une deuxième partie de l'ensemble d'imagerie s'étend vers l'ouverture, l'ensemble de transmission de signaux fait face au couvercle arrière et est disposé sur la carte principale, et l'ensemble d'imagerie est connecté à l'ensemble de transmission de signaux au moyen d'une carte de circuits imprimés flexible. Dans le dispositif électronique fourni par la présente invention, la carte mère est pourvue d'une ouverture, et l'ensemble d'imagerie peut s'étendre partiellement dans l'ouverture, de sorte qu'une structure d'assemblage dans le dispositif électronique est plus raisonnable, et la taille du dispositif électronique est réduite au moyen de la réduction de l'épaisseur du dispositif électronique.
PCT/CN2022/115813 2021-11-25 2022-08-30 Dispositif électronique WO2023093178A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202111412812.3 2021-11-25
CN202111412812.3A CN116193220A (zh) 2021-11-25 2021-11-25 一种电子设备

Publications (1)

Publication Number Publication Date
WO2023093178A1 true WO2023093178A1 (fr) 2023-06-01

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CN (1) CN116193220A (fr)
WO (1) WO2023093178A1 (fr)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110365885A (zh) * 2019-07-29 2019-10-22 Oppo广东移动通信有限公司 摄像头组件及电子设备
CN209805871U (zh) * 2019-03-19 2019-12-17 Oppo广东移动通信有限公司 电子设备
CN111917955A (zh) * 2020-08-05 2020-11-10 东莞市亚登电子有限公司 摄像模组和具有其的摄像设备
CN214591630U (zh) * 2021-04-21 2021-11-02 重庆传音通讯技术有限公司 潜望摄像模组及移动终端

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN209805871U (zh) * 2019-03-19 2019-12-17 Oppo广东移动通信有限公司 电子设备
CN110365885A (zh) * 2019-07-29 2019-10-22 Oppo广东移动通信有限公司 摄像头组件及电子设备
CN111917955A (zh) * 2020-08-05 2020-11-10 东莞市亚登电子有限公司 摄像模组和具有其的摄像设备
CN214591630U (zh) * 2021-04-21 2021-11-02 重庆传音通讯技术有限公司 潜望摄像模组及移动终端

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