WO2023092640A1 - Placement system for wafer loading cassette door body - Google Patents
Placement system for wafer loading cassette door body Download PDFInfo
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- WO2023092640A1 WO2023092640A1 PCT/CN2021/135593 CN2021135593W WO2023092640A1 WO 2023092640 A1 WO2023092640 A1 WO 2023092640A1 CN 2021135593 W CN2021135593 W CN 2021135593W WO 2023092640 A1 WO2023092640 A1 WO 2023092640A1
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- docking
- wafer loading
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- assembly
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- 230000007246 mechanism Effects 0.000 claims abstract description 10
- 238000003032 molecular docking Methods 0.000 claims description 113
- 239000000758 substrate Substances 0.000 claims description 16
- 210000002310 elbow joint Anatomy 0.000 claims description 7
- 238000013519 translation Methods 0.000 claims description 3
- 238000013461 design Methods 0.000 abstract description 4
- 230000000694 effects Effects 0.000 abstract description 3
- 210000001503 joint Anatomy 0.000 abstract 12
- 235000012431 wafers Nutrition 0.000 description 107
- 238000000034 method Methods 0.000 description 13
- 230000008569 process Effects 0.000 description 12
- 238000010586 diagram Methods 0.000 description 6
- 238000012545 processing Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 238000012423 maintenance Methods 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
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- 238000007789 sealing Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67775—Docking arrangements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
Definitions
- the invention relates to the field of semiconductor processing, in particular to a placement system for a wafer loading box door body.
- wafers In the process of semiconductor processing, wafers need to be transported and transferred at different positions in the production line. Usually, a wafer loader (Loadport) is used to load the wafer.
- the basic working principle is that the wafer loader loads the wafer into the cassette. After operation, after reaching the designated position, the door of the wafer loading box is opened, and the wafer is taken out by a robot arm or other equipment to realize the loading of the wafer.
- wafers need to be transported and transferred between different processing stations or wafers need to be re-sorted, usually using wafer front-end transport equipment (EFEM), wafer sorter (Sorter) Realize the above functions.
- EFEM wafer front-end transport equipment
- the wafer loader (Loadport) is usually installed in the above-mentioned equipment. Its main function is to first send the wafer loading box to the docking port, then open the door of the wafer loading box and place it in the designated position, and then pass the wafer The sensor detects the pose of the wafer. After the wafer loader completes the above functions, the manipulator in EFEM, Sorter or other equipment will take the wafer out of the loading box and transfer it to the processing station to complete the loading of the wafer.
- the docking plate and the wafer detection sensor in the current wafer loader move vertically downward together, resulting in an overly compact structure of the wafer loader, which is not conducive to the assembly, debugging and operation of the wafer loader. Maintenance; at the same time, the door of the wafer loading box is always in a vertical position throughout the process. The stability of the door is maintained by the vacuum suction of the front side suction cup of the docking plate of the wafer loader, which is easily affected by air pressure fluctuations.
- the wafer loader (Loadport) in EFEM and Sorter after opening the door of the wafer transfer box, place the door on the bottom of EFEM and Sorter.
- the present application provides a placement system for the door body of a wafer loading box, which aims to reduce the volume of the machine and reduce the production cost.
- the object of the present invention is to provide a placement system for the wafer loading box door.
- the technical solution adopted by the present invention is: a placement system for the door of a wafer loading box, including a wafer loading body, the wafer loading body includes a substrate, a box body and a loading platform, so A docking port is provided on the substrate, the size of the docking port matches the door of the wafer loading box, and a placement mechanism is provided on the side of the substrate facing away from the loading platform, and the placement mechanism includes a swing assembly, a driven assembly, and a docking plate, the swing assembly is arranged above the docking port, the driven assembly is arranged below the docking port, and the swing assembly and the driven assembly are respectively connected to the docking plate, and the The swing assembly can drive the docking plate to place the docking plate above the side of the docking port, and the driven assembly can constrain the rotational freedom of the docking plate and make the front side of the docking plate placed in place face upward.
- the oscillating assembly includes a oscillating rod, a cross bar and a driving member.
- the two first fixed seats on the board are hinged, and the other ends are respectively hinged with the two second fixed seats fixed on the base plate, and the swing bar is provided with bosses, and the two ends of the cross bar are respectively connected with the two swing bars.
- the boss of the rod is fixedly connected, and a driving part is hingedly arranged between the cross bar and the base plate. The purpose is that after the docking plate is opened, it is located above the docking port, and when the driving member is driven, the swing rod swings around the hinge point at the upper end, and drives the docking plate to be positioned above the side of the docking port.
- the driving member is a linear motion cylinder
- the cylinder tail end of the linear motion cylinder is fixedly connected to the cylinder end plate fixed on the base plate, and the cylinder end plate is hinged to the support fixed on the base plate
- the piston rod of the linear motion cylinder is fixedly connected to the double elbow joint
- the middle part of the cross bar is provided with a boss
- the double elbow joint is hinged to the boss of the cross bar.
- the driven assembly includes a connecting rod, a movable rod, a slider and a sliding rail, two of the connecting rods are arranged in parallel and symmetrically arranged on the left and right sides of the docking plate, and one end of the two connecting rods is It is fixed on the rear side of the docking plate, and the other ends are respectively hinged with the movable rod, and at the same time, the movable rod is fixedly connected with the slider through the connecting plate, and the slider is sleeved on the slide rail, and the slide rail is vertically fixed set on the substrate. That is, the driven component realizes the limitation of the rotational freedom of the butt plate.
- the movable rod is in the shape of " ⁇ ", the shape and size of the movable rod match the docking port, and the movable rod and the slider are synchronously moved in linear translation along the direction of the slide rail in a plane parallel to the base plate.
- This setting on the one hand, can realize the control of the movement path of the docking plate, and place it on the side of the docking port, and on the other hand, it will not interfere with the manipulator in EFEM or Sorter to pick and place wafers from the wafer loading box through the docking port .
- the swing rod of the swing assembly is hinged to the first fixed seat through a first rotating shaft
- the first fixed seat is arranged on the rear side of the docking plate
- the swing rod of the swing assembly is hinged to the second fixed seat through a third rotating shaft
- the connecting rod and the movable rod of the driven assembly are hinged through the second rotating shaft.
- the docking plate When the door of the wafer loading box is closed, the docking plate is placed vertically and parallel to the substrate, while the axis of the third rotating shaft and the axis of the second rotating shaft form a vertical plane parallel to the substrate.
- the distance from the axis of the first rotating shaft to the rear side of the docking plate is smaller than the distance from the axis of the second rotating shaft to the rear side of the docking plate. Since the wafer loading box door body is embedded in the wafer loading box, the upper, lower, left and right sides of the door maintain a certain distance from the wafer loading box, which can avoid the upper and lower contact between the door body and the wafer loading box. There is no contact or friction between the lower and left and right inner walls. However, in the process of taking the door out of the loading box, the docking plate does not move the door out of the wafer loading box in parallel, but swings out at a certain angle. During the swinging process, the door body is tilted relative to the wafer loading box.
- the cleanliness of the cassette and even the inside of the EFEM and Sorter will also affect the stability of the wafer loading cassette on the wafer loader, so reducing the relative inclination of the door during the process of taking it out of the wafer loading cassette can be effective Avoid the generation of above-mentioned hidden danger.
- the distance from the first rotating shaft to the rear side of the docking plate is designed to be smaller than the distance from the second rotating shaft to the rear side of the docking plate, so that the initial position of the pendulum relative to the docking plate presents a certain degree of reverse inclination.
- This initial reverse The inclination reduces the relative inclination of the docking plate in the process of taking the door out of the wafer loading box, avoiding the friction or thrust of the door with the inner wall of the wafer loading box when it is taken out of the wafer loading box.
- the docking plate can be closed or opened with the docking port.
- the wafer loading box door on the other side of the docking port is sucked by the suction cup on the front side of the docking board, and then driven by the placement system. , put the door body to the designated position.
- a rear cover is also arranged on the rear side of the docking plate. Since a suction cup for absorbing the door body is provided on the front side of the docking board, the vacuum pipeline for providing suction for the suction cup is arranged on the rear side of the docking plate. In order to avoid interference to the pipeline during movement and Keep the environment around the pipeline clean, so set the back cover to seal the vacuum pipeline.
- a placement system for the door of the wafer loading box which makes full use of the space on the top of the wafer loader, making the structural layout of the wafer loader more reasonable.
- the traditional wafer loading machine can pick and place the wafer loading box When the door body is installed, the door body is always placed vertically, and the door panel is completely attached to the docking plate by vacuum suction.
- vacuum adsorption does not have the function of keeping the air off, and the stability of the adsorption is easily affected by air pressure fluctuations.
- the swing system for the door body of the wafer loading box of the present invention puts the door body at a designated position, and the docking plate is placed close to the level, which can give the door body a supporting force through the docking plate, reducing the dependence on vacuum suction, and realizing
- the modular design of the opening and pick-and-place mechanism for the wafer loading box door on the wafer loader is improved, and the mechanical structure integration of the wafer loader is reduced, which is beneficial to the production, assembly, transportation and maintenance of the wafer loader.
- FIG. 1 is a three-dimensional structural schematic diagram of a placement system for a door body of a wafer loading box.
- Fig. 2 is a partial schematic diagram of the swing assembly.
- Fig. 3 is a schematic diagram of the positions of the swing assembly and the drive assembly.
- Figure 4 is a side view of the closed state.
- Fig. 5 is a schematic perspective view of a closed state.
- Figure 6 is a side view during opening.
- Fig. 7 is a schematic perspective view of the opening process.
- Figure 8 is a side view of the fully opened state.
- Fig. 9 is a schematic perspective view of a fully opened state.
- Figure 10 is a schematic diagram of the cross bar.
- Fig. 11 is a schematic diagram of the tail plate of the cylinder.
- Wafer loading body 2. Docking port, 3. Docking plate, 4. Swing assembly, 5. Driven assembly, 6. First shaft, 7. Second shaft, 8. Wafer loading box door, 9 , rear cover, 10, wafer loading box,
- connecting rod, 502 movable rod, 503, connecting plate, 504, slide block, 505, slide rail.
- a placement system for the door of a wafer loading box in this embodiment includes a wafer loading body 1, and the wafer loading body 1 includes a substrate 101, a box 102, and a loading stage 103, the substrate 101 is provided with a docking port 2, the size of the docking port 2 matches the wafer loading box door 8, and a placement mechanism is provided on the side of the substrate 101 facing away from the loading table 103, and the placement mechanism It includes a swing assembly 4, a driven assembly 5 and a docking plate 3, the swing assembly 4 is arranged above the docking port 2, the driven assembly 5 is arranged below the docking port 2, and the swing assembly 4 and the driven assembly 5 are respectively connected to the docking plate 3 connected, and the swing assembly 4 can drive the docking plate 3 to place the docking plate 3 above the side of the docking port 2, and the driven component 5 can constrain the rotational freedom of the docking plate 3, and make the front side 301 of the docking plate placed in place up.
- the swing assembly 4 includes a swing rod 401, a cross bar 402 and a driver 403.
- the two first fixed seats 404 are hinged through the first rotating shaft 6, and the other ends are respectively hinged with the two second fixed seats 405 fixed on the base plate 101 through the third rotating shaft 409, and the swing bar 401 is provided with a boss, a cross bar
- Two ends of the 402 are respectively fixedly connected to the bosses of the two swing bars 401 , and a driving member 403 is hingedly arranged between the cross bar 402 and the base plate 101 .
- the purpose is to make the docking plate 3 open so that it is positioned above the docking port 2 .
- the swing bar 401 swings around the third rotating shaft 409 and drives the docking plate 3 to be positioned above the docking port 2 .
- the driving part 403 is a linear motion cylinder
- the cylinder tail end of the linear motion cylinder is fixedly connected with the cylinder tail plate 406 fixed on the base plate 101
- the cylinder tail plate 406 is hinged with the support 407 fixed on the base plate 101
- the linear motion cylinder The piston rod is fixedly connected with the double elbow joint 408, the middle part of the cross bar 402 is provided with a boss, and the double elbow joint 408 is hinged with the boss of the cross bar 402.
- the driven assembly 5 includes a connecting rod 501, a movable rod 502, a slide block 504 and a slide rail 505, two connecting rods 501 are arranged in parallel, and are symmetrically arranged on the left and right sides of the docking plate 3, and one end of the two connecting rods 501 is fixed On the rear side 302 of the docking plate, the other ends are respectively hinged with the movable rod 502, while the movable rod 502 is fixedly connected with the slider 504 through the connecting plate 503, and the slider 504 is sleeved on the slide rail 505, and the slide rail 505 is vertically fixed set on the substrate 101.
- the driven assembly 5 can constrain the rotation of the docking plate 3, so that the docking plate 3 rotates counterclockwise relative to the wafer loader 1 ( With reference to accompanying drawing 1), realize that butt plate 3 is changed to the state that the front side faces up gradually from vertical state.
- the movable rod 502 is in the shape of " ⁇ ", the shape and size of the movable rod 502 match the docking port 2, and the movable rod 502 and the slider 504 are synchronously moved in linear translation along the direction of the slide rail 505 in a plane parallel to the base plate 101.
- Such a setting on the one hand, can realize the control of the movement path of the docking plate 3, so that it can be placed on the side of the docking port 2, and on the other hand, it will not interfere with the manipulator in the EFEM or Sorter from the wafer loading cassette through the docking port 2. 10 Pick and place the wafer.
- the docking plate 3 when the door body of the wafer loading box is closed, the docking plate 3 is placed vertically, parallel to the base plate 101, and the axis of the third rotating shaft 409 and the axis of the second rotating shaft 7 are on the same plane.
- the parallel vertical planes of the substrate 101 see dotted lines shown in FIG. 4 ).
- the swing rod 401 of the swing assembly 4 is hinged to the first fixed seat 404 through the first rotating shaft 6, the first fixed seat 404 is arranged on the rear side of the docking plate 3, the connecting rod 501 and the movable rod 502 of the driven assembly 5 pass through the second rotating shaft 7 is hinged, and the distance (d) from the axis of the first rotating shaft 6 to the rear side 302 of the docking plate is smaller than the distance (D) from the axis of the second rotating shaft 7 to the rear side 302 of the docking plate.
- the swing rod 401 is a part of the swing assembly 4, and the swing rod 401 presents a certain degree of reverse inclination toward the docking plate 3 at the initial position, and the initial reverse inclination reduces the effect of the docking plate 3 on moving the door body 8 from
- the relative inclination in the process of taking out the wafer loading box 10 avoids the contact of the door body 8 with the inner wall of the wafer loading box 10 in the process of taking out the wafer loading box 10, thereby preventing the door body 8 from coming out of the wafer loading box 10. Friction or thrust against the inner wall of the wafer loading box 10 during removal.
- the docking plate 3 can be closed or opened with the docking port 2.
- the wafer loading box door 8 on the other side of the docking port 2 is sucked by the suction cup on the front side 301 of the docking board, and then Driven by the placement system, the door body 8 is placed to a designated position (the structure and principle of opening the door by suction are well known in the art, and will not be repeated here).
- Back cover 9 is also set on the butt plate rear side 302, because the suction cup for absorbing the door body 8 is provided on the butt plate front side 301, the vacuum pipeline that provides suction for the suction cup is arranged on the butt plate rear side 302, in order to avoid damage to the door body 8 during the movement. The interference of the pipeline keeps the environment around the pipeline clean, so the back cover 9 is set to seal the vacuum pipeline.
- the placement system for the door of the wafer loading box makes full use of the space on the top of the wafer loader 1, EFEM and Sorter, making the structural layout of the wafer loader 1, EFEM and Sorter more reasonable.
- a traditional wafer loader when taking and placing the door 8 of the wafer loading box, the door 8 is always placed vertically, and the door 8 is brought close to the docking plate 3 entirely by vacuum suction.
- the wafer loading box of the present invention The swing system of the door body 8 puts the door body 8 to the designated position, and the docking plate 3 is placed close to the horizontal, and the door body 8 can be supported by the docking plate 3, which reduces the dependence on vacuum suction and realizes wafer loading.
- the modular design of the opening and pick-and-place mechanism for the wafer loading box door 8 on the machine reduces the mechanical structure integration of the wafer loading machine, and is more conducive to the production, assembly, transportation and maintenance of the wafer loading machine.
- FIG. 4-9 is a schematic diagram of closed state-opening process-full opening.
- the basic working principle in the initial position, the docking plate 3 is placed in the center relative to the docking port 2, and the docking port 2 is closed.
- the control system placed in the box 102 receives information and sends instructions to control the movement of all the driving parts on the wafer loader 1, and the wafer loading cassette 10 is placed on the loading table 103, and then The loading table 103 pushes the wafer loading box 10 to the docking port 2, and then the suction cup installed on the docking plate 3 sucks the wafer loading box door 8, and the door 8 is attached to the docking plate 3 under the action of the suction force of the suction cup Together, the unlocking load installed on the docking plate 3 opens the wafer loading box door 8, the wafer loading box door 8 and the wafer loading box 10 are unlocked, the placement system starts to work, and the piston rod of the driving part 403 is
- the swing bar 401 drives the butt plate 3 to move, and the butt plate 3 further drives the movable bar 502 together with the slider 504 move vertically upward along the slide rail 505 together, the docking plate 3 rotates counterclockwise around the rotating shaft of the movable rod 502 while moving upward together with the movable rod 502, the docking plate 3 swings synchronously with the wafer loading box door 8, Swing the wafer loading box door body 8 out of the wafer loading box 10, the driving part 403 swings around the support 407 under the reaction of the cross bar 402, the piston rod of the driving part 403 continues to extend and the upper part of the movable rod 502 Moving, the wafer loading box door 8 is gradually swung to the upper side of the docking port 2, and the wafer loading box 10 is fully opened.
- the door body 8 is placed nearly horizontally, relying on the butt plate 3 to provide support, which reduces the dependence on vacuum suction, and the butt plate 3 relies on the driver 403 to provide support.
- the driver 403 passes through the three-position
- the five-way valve can maintain the extended state of the piston rod for a long time, and will not be affected by the fluctuation of external air pressure.
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Abstract
Disclosed in the present invention is a placement system for a wafer loading cassette door body, comprising: a wafer load port body. A butt joint port is provided on the load port body; a placement mechanism is provided on one side surface of the wafer load port body, and comprises a swing assembly, a driven assembly, and a butt joint plate; the swing assembly is provided above the butt joint plate; the driven assembly is provided below the butt joint port; the swing assembly and the driven assembly are respectively connected to the butt joint plate; the swing assembly can drive the butt joint plate and place the butt joint plate above the side of the butt joint port; and the driven assembly can restrain the degree of freedom of the rotation of the butt joint plate such that the inner side surface of the butt joint plate placed in place can face upwards. A space at the top of a wafer load port is used, such that the structural layout of the wafer load port is more reasonable; and after the door body is placed at a designated position, the butt joint plate is placed approximately horizontally, and supporting force can be provided for the door body by means of the butt joint plate, such that dependence on vacuum suction force is reduced, effects caused by air pressure fluctuation are avoided, and the modular design of a mechanism for opening, retrieving, and placing the wafer loading cassette door body is realized.
Description
本发明涉及半导体加工领域,尤其涉及一种用于晶圆装载盒门体的摆放系统。The invention relates to the field of semiconductor processing, in particular to a placement system for a wafer loading box door body.
在半导体加工过程中,晶圆需要在生产线的不同位置进行传输和移转,通常使用晶圆装载机(Loadport)进行晶圆的上料,基本的工作原理为晶圆装载机对晶圆装载盒进行操作,到达指定位置后,晶圆装载盒的门体打开,通过机械手或其他设备将晶圆取出,实现了晶圆的上料。In the process of semiconductor processing, wafers need to be transported and transferred at different positions in the production line. Usually, a wafer loader (Loadport) is used to load the wafer. The basic working principle is that the wafer loader loads the wafer into the cassette. After operation, after reaching the designated position, the door of the wafer loading box is opened, and the wafer is taken out by a robot arm or other equipment to realize the loading of the wafer.
在半导体加工过程中,晶圆需要在不同加工工位之间进行传输和移转或者需要对晶圆进行重新分类整理,通常利用晶圆前端传输设备(EFEM)、晶圆分拣机(Sorter)实现上述功能。晶圆装载机(Loadport)通常装在上述设备中,其主要功能是首先将晶圆装载盒送到对接口,然后将晶圆装载盒的门体打开并摆放到指定位置,接着通过晶圆传感器检测晶圆的位姿。晶圆装载机完成上述功能之后,EFEM、Sorter中的机械手或其他设备将晶圆从装载盒中取出并进一步传送到加工工位,完成晶圆的上料。In the process of semiconductor processing, wafers need to be transported and transferred between different processing stations or wafers need to be re-sorted, usually using wafer front-end transport equipment (EFEM), wafer sorter (Sorter) Realize the above functions. The wafer loader (Loadport) is usually installed in the above-mentioned equipment. Its main function is to first send the wafer loading box to the docking port, then open the door of the wafer loading box and place it in the designated position, and then pass the wafer The sensor detects the pose of the wafer. After the wafer loader completes the above functions, the manipulator in EFEM, Sorter or other equipment will take the wafer out of the loading box and transfer it to the processing station to complete the loading of the wafer.
但是,目前的晶圆装载机(Loadport)中的对接板和晶圆检测传感器是一同竖直向下运动的,导致晶圆装载机的结构过于紧凑,不利于晶圆装载机的组装、调试和维修;同时导致晶圆装载盒的门体在整个过程中,始终处于竖直放置状态,门体的稳定由晶圆装载机的对接板前侧面吸盘的真空吸力保持,易受到气压波动的影响。另外晶圆装载机(Loadport)在EFEM和Sorter中,打开晶圆传送盒门体后,将门体放置到EFEM和Sorter的底部,为了避开装在EFEM和Sorter底部的机械手,需要增加EFEM和Sorter的体积尺寸,而实际上EFEM和Sorter 的顶部有很大的空余空间,晶圆装载机没有充分结合、发挥和使用这部分空余空间,造成浪费,维持半导体加工所需要的洁净环境的成本昂贵,因此机台的设计体积不应有冗余。However, the docking plate and the wafer detection sensor in the current wafer loader (Loadport) move vertically downward together, resulting in an overly compact structure of the wafer loader, which is not conducive to the assembly, debugging and operation of the wafer loader. Maintenance; at the same time, the door of the wafer loading box is always in a vertical position throughout the process. The stability of the door is maintained by the vacuum suction of the front side suction cup of the docking plate of the wafer loader, which is easily affected by air pressure fluctuations. In addition, the wafer loader (Loadport) in EFEM and Sorter, after opening the door of the wafer transfer box, place the door on the bottom of EFEM and Sorter. In order to avoid the manipulator installed at the bottom of EFEM and Sorter, it is necessary to add EFEM and Sorter In fact, there is a lot of free space on the top of EFEM and Sorter, and the wafer loader does not fully combine, play and use this part of the free space, resulting in waste, and the cost of maintaining a clean environment required for semiconductor processing is expensive. Therefore, the design volume of the machine should not be redundant.
本申请提供一种用于晶圆装载盒门体的摆放系统,旨在减小机台体积,降低生产成本。The present application provides a placement system for the door body of a wafer loading box, which aims to reduce the volume of the machine and reduce the production cost.
发明内容Contents of the invention
为克服上述缺点,本发明的目的在于提供一种用于晶圆装载盒门体的摆放系统。In order to overcome the above disadvantages, the object of the present invention is to provide a placement system for the wafer loading box door.
为了达到以上目的,本发明采用的技术方案是:一种用于晶圆装载盒门体的摆放系统,包括晶圆装载机体,所述晶圆装载机体包括基板、箱体和装载台,所述基板上设置有对接口,所述对接口的大小与晶圆装载盒门体相匹配,在所述基板的背向装载台的一侧面上设置有摆放机构,所述摆放机构包括摆动组件、从动组件和对接板,所述摆动组件设置在对接口的上方,所述从动组件设置在对接口的下方,且所述摆动组件、从动组件分别与对接板连接,且所述摆动组件能驱动对接板将对接板摆放到对接口的侧上方,所述从动组件能约束对接板的转动自由度,并使摆放到位的对接板的前侧面朝上。In order to achieve the above objectives, the technical solution adopted by the present invention is: a placement system for the door of a wafer loading box, including a wafer loading body, the wafer loading body includes a substrate, a box body and a loading platform, so A docking port is provided on the substrate, the size of the docking port matches the door of the wafer loading box, and a placement mechanism is provided on the side of the substrate facing away from the loading platform, and the placement mechanism includes a swing assembly, a driven assembly, and a docking plate, the swing assembly is arranged above the docking port, the driven assembly is arranged below the docking port, and the swing assembly and the driven assembly are respectively connected to the docking plate, and the The swing assembly can drive the docking plate to place the docking plate above the side of the docking port, and the driven assembly can constrain the rotational freedom of the docking plate and make the front side of the docking plate placed in place face upward.
优选地,所述摆动组件包括摆杆、横杆和驱动件,所述摆杆设置两个,对称设置在所述对接板的左右两侧,两个所述摆杆的一端分别与固定在对接板上的两个第一固定座铰接,另一端分别与固定在基板上的两个第二固定座铰接,且所述摆杆上设置有凸台,所述横杆两端分别与两个摆杆的凸台固定连接,在所述横杆和基板之间还铰接设置驱动件。目的是在对接板打开后,使其位于对接口的上方,在驱动件进行驱动时,摆杆绕上端的铰接点摆动,并驱动对接板位于对接口的侧上方。Preferably, the oscillating assembly includes a oscillating rod, a cross bar and a driving member. There are two oscillating rods, which are arranged symmetrically on the left and right sides of the docking plate. The two first fixed seats on the board are hinged, and the other ends are respectively hinged with the two second fixed seats fixed on the base plate, and the swing bar is provided with bosses, and the two ends of the cross bar are respectively connected with the two swing bars. The boss of the rod is fixedly connected, and a driving part is hingedly arranged between the cross bar and the base plate. The purpose is that after the docking plate is opened, it is located above the docking port, and when the driving member is driven, the swing rod swings around the hinge point at the upper end, and drives the docking plate to be positioned above the side of the docking port.
优选地,所述驱动件为直线运动气缸,所述直线运动气缸的缸体尾端与固定在基板的气缸尾接板固定连接,所述气缸尾接板与固定在基板上的支座铰接,所述直线运动气缸的活塞杆与双肘接头固定连接,所述横杆的中部设置有凸台,所述双肘接头与横杆的凸台铰接。Preferably, the driving member is a linear motion cylinder, the cylinder tail end of the linear motion cylinder is fixedly connected to the cylinder end plate fixed on the base plate, and the cylinder end plate is hinged to the support fixed on the base plate, The piston rod of the linear motion cylinder is fixedly connected to the double elbow joint, the middle part of the cross bar is provided with a boss, and the double elbow joint is hinged to the boss of the cross bar.
优选地,所述从动组件包括连接杆、活动杆、滑块和滑轨,所述连接杆平行设置两个,且对称设置在对接板的左右两侧,两个所述连接杆的一端均固定在对接板后侧面上,另一端分别与活动杆铰接,同时所述活动杆通过连接板与滑块固定连接,且所述滑块套设在滑轨上,且所述滑轨竖直固定设置在基板上。即从动组件实现对对接板的转动自由度的限制。Preferably, the driven assembly includes a connecting rod, a movable rod, a slider and a sliding rail, two of the connecting rods are arranged in parallel and symmetrically arranged on the left and right sides of the docking plate, and one end of the two connecting rods is It is fixed on the rear side of the docking plate, and the other ends are respectively hinged with the movable rod, and at the same time, the movable rod is fixedly connected with the slider through the connecting plate, and the slider is sleeved on the slide rail, and the slide rail is vertically fixed set on the substrate. That is, the driven component realizes the limitation of the rotational freedom of the butt plate.
优选地,所述活动杆呈“凵”形状,所述活动杆的形状大小与对接口相匹配,所述活动杆与滑块同步沿滑轨方向在平行于基板的面内做直线平移运动。这样的设置,一方面可以实现对接板运动路径的控制,摆放到对接口的侧上方,另一方面也不会干涉EFEM或Sorter中的机械手通过对接口从晶圆装载盒中取放晶圆。Preferably, the movable rod is in the shape of "凵", the shape and size of the movable rod match the docking port, and the movable rod and the slider are synchronously moved in linear translation along the direction of the slide rail in a plane parallel to the base plate. This setting, on the one hand, can realize the control of the movement path of the docking plate, and place it on the side of the docking port, and on the other hand, it will not interfere with the manipulator in EFEM or Sorter to pick and place wafers from the wafer loading box through the docking port .
优选地,所述摆动组件的摆杆与第一固定座通过第一转轴铰接,第一固定座设置在对接板后侧面,所述摆动组件的摆杆与第二固定座通过第三转轴铰接,所述从动组件的连接杆与活动杆通过第二转轴铰接。在晶圆装载盒门体关闭的状态下,对接板呈竖直摆置,与基板平行,第三转轴的轴线和第二转轴的轴线形成与基板平行的一竖直面。Preferably, the swing rod of the swing assembly is hinged to the first fixed seat through a first rotating shaft, the first fixed seat is arranged on the rear side of the docking plate, the swing rod of the swing assembly is hinged to the second fixed seat through a third rotating shaft, The connecting rod and the movable rod of the driven assembly are hinged through the second rotating shaft. When the door of the wafer loading box is closed, the docking plate is placed vertically and parallel to the substrate, and the axis of the third rotating shaft and the axis of the second rotating shaft form a vertical plane parallel to the substrate.
在晶圆装载盒门体关闭的状态下,对接板呈竖直摆置且与基板平行,同时第三转轴的轴线和第二转轴的轴线形成竖直面,且竖直面与基板平行。When the door of the wafer loading box is closed, the docking plate is placed vertically and parallel to the substrate, while the axis of the third rotating shaft and the axis of the second rotating shaft form a vertical plane parallel to the substrate.
优选的,第一转轴的轴线到对接板后侧面的距离小于第二转轴的轴线到对接板后侧面的距离。由于晶圆装载盒门体内嵌在晶圆装载盒中,门体的上、下 和左、右四侧面相对晶圆装载盒维持一定的距离,可避免门体与晶圆装载盒的上、下和左、右内壁不会产生接触或摩擦。但是对接板在将门体从装载盒中取出的过程中并非将门体从晶圆装载盒中平行运动出来,而是呈一定角度的摆动出来,摆动的过程中门体的相对晶圆装载盒的倾斜程度越大越容易与晶圆装载盒的内壁发生摩擦甚至产生应力作用,这不仅会导致晶圆装载盒的内壁发生磨损,影响密封效果,同时磨损过程中产生的微尘颗粒也影响到晶圆装载盒甚至EFEM和Sorter内部的洁净度,也会影响到晶圆装载盒在晶圆装载机上的固定的稳定性,因此降低门体在从晶圆装载盒中取出过程中的相对倾斜程度,可以有效避免上述隐患的产生。为此,设计使第一转轴到对接板后侧面的距离小于第二转轴到对接板后侧面的距离,可以使摆杆初始位置时相对接板呈现一定程度的反向倾斜,这个初始的反向倾斜减小了对接板在将门体从晶圆装载盒中取出过程中的相对倾斜程度,避免了门体在从晶圆装载盒中取出时与晶圆装载盒内壁的摩擦或产生推力的作用。Preferably, the distance from the axis of the first rotating shaft to the rear side of the docking plate is smaller than the distance from the axis of the second rotating shaft to the rear side of the docking plate. Since the wafer loading box door body is embedded in the wafer loading box, the upper, lower, left and right sides of the door maintain a certain distance from the wafer loading box, which can avoid the upper and lower contact between the door body and the wafer loading box. There is no contact or friction between the lower and left and right inner walls. However, in the process of taking the door out of the loading box, the docking plate does not move the door out of the wafer loading box in parallel, but swings out at a certain angle. During the swinging process, the door body is tilted relative to the wafer loading box. The greater the degree, the easier it is to cause friction or even stress with the inner wall of the wafer loading box, which will not only cause the inner wall of the wafer loading box to wear and affect the sealing effect, but also the fine dust particles generated during the abrasion process will also affect the wafer loading. The cleanliness of the cassette and even the inside of the EFEM and Sorter will also affect the stability of the wafer loading cassette on the wafer loader, so reducing the relative inclination of the door during the process of taking it out of the wafer loading cassette can be effective Avoid the generation of above-mentioned hidden danger. For this reason, the distance from the first rotating shaft to the rear side of the docking plate is designed to be smaller than the distance from the second rotating shaft to the rear side of the docking plate, so that the initial position of the pendulum relative to the docking plate presents a certain degree of reverse inclination. This initial reverse The inclination reduces the relative inclination of the docking plate in the process of taking the door out of the wafer loading box, avoiding the friction or thrust of the door with the inner wall of the wafer loading box when it is taken out of the wafer loading box.
在摆放系统的驱动下,对接板能与对接口闭合或打开,在闭合时,通过对接板前侧面的吸盘将对接口的另一侧的晶圆装载盒门体吸附,再由摆放系统驱动,将门体摆放到指定位置。对接板后侧面上还设置后盖,由于对接板前侧面上设置有用于吸附门体的吸盘,为吸盘提供吸力的真空管路设置在对接板后侧面上,为了避免运动过程中对管路的干扰和保持管路周围环境的清洁,因此设置后盖密封真空管路。Driven by the placement system, the docking plate can be closed or opened with the docking port. When closing, the wafer loading box door on the other side of the docking port is sucked by the suction cup on the front side of the docking board, and then driven by the placement system. , put the door body to the designated position. A rear cover is also arranged on the rear side of the docking plate. Since a suction cup for absorbing the door body is provided on the front side of the docking board, the vacuum pipeline for providing suction for the suction cup is arranged on the rear side of the docking plate. In order to avoid interference to the pipeline during movement and Keep the environment around the pipeline clean, so set the back cover to seal the vacuum pipeline.
一种用于晶圆装载盒门体的摆放系统,充分利用了晶圆装载机顶部的空间,使得晶圆装载机的结构布局更加合理,传统的晶圆装载机,取放晶圆装载盒门体时,门体始终保持竖直放置,完全依靠真空吸力将门板贴近在对接板上,但是真空吸附不具备断气保持功能,吸附的稳固性极容易受到气压波动的影响。 本发明的用于晶圆装载盒门体的摆动系统将门体摆放到指定位置后,对接板是接近水平放置的,能通过对接板给予门体支撑力,降低了对真空吸力的依赖,实现了晶圆装载机上用于晶圆装载盒门体打开及取放机构的模块化设计,降低了晶圆装载机的机械结构集成度,从而有利于晶圆装机的生产、组装、运输及维修。A placement system for the door of the wafer loading box, which makes full use of the space on the top of the wafer loader, making the structural layout of the wafer loader more reasonable. The traditional wafer loading machine can pick and place the wafer loading box When the door body is installed, the door body is always placed vertically, and the door panel is completely attached to the docking plate by vacuum suction. However, vacuum adsorption does not have the function of keeping the air off, and the stability of the adsorption is easily affected by air pressure fluctuations. The swing system for the door body of the wafer loading box of the present invention puts the door body at a designated position, and the docking plate is placed close to the level, which can give the door body a supporting force through the docking plate, reducing the dependence on vacuum suction, and realizing The modular design of the opening and pick-and-place mechanism for the wafer loading box door on the wafer loader is improved, and the mechanical structure integration of the wafer loader is reduced, which is beneficial to the production, assembly, transportation and maintenance of the wafer loader.
图1为用于晶圆装载盒门体的摆放系统的立体结构示意图。FIG. 1 is a three-dimensional structural schematic diagram of a placement system for a door body of a wafer loading box.
图2为摆动组件的局部示意图。Fig. 2 is a partial schematic diagram of the swing assembly.
图3为摆动组件和驱动组件的位置示意图。Fig. 3 is a schematic diagram of the positions of the swing assembly and the drive assembly.
图4为关闭状态的侧视图。Figure 4 is a side view of the closed state.
图5为关闭状态的立体示意图。Fig. 5 is a schematic perspective view of a closed state.
图6为打开过程中的侧视图。Figure 6 is a side view during opening.
图7为打开过程中的立体示意图。Fig. 7 is a schematic perspective view of the opening process.
图8为完全打开状态的侧视图。Figure 8 is a side view of the fully opened state.
图9为完全打开状态的立体示意图。Fig. 9 is a schematic perspective view of a fully opened state.
图10为横杆的示意图。Figure 10 is a schematic diagram of the cross bar.
图11为气缸尾接板的示意图。Fig. 11 is a schematic diagram of the tail plate of the cylinder.
图中:In the picture:
1、晶圆装载机体,2、对接口,3、对接板,4、摆动组件,5、从动组件,6、第一转轴,7、第二转轴,8、晶圆装载盒门体,9、后盖,10、晶圆装载盒,1. Wafer loading body, 2. Docking port, 3. Docking plate, 4. Swing assembly, 5. Driven assembly, 6. First shaft, 7. Second shaft, 8. Wafer loading box door, 9 , rear cover, 10, wafer loading box,
101、基板,102、箱体,103、装载台,101, base plate, 102, box body, 103, loading platform,
301、对接板前侧面,302、对接板后侧面,301, the front side of the butt plate, 302, the rear side of the butt plate,
401、摆杆,402、横杆,403、驱动件,404、第一固定座,405、第二固定 座,406、气缸尾接板,407、支座,408、双肘接头,409、第三转轴,401, pendulum, 402, cross bar, 403, driving member, 404, first fixed seat, 405, second fixed seat, 406, cylinder tail plate, 407, support, 408, double elbow joint, 409, the first three axis,
501、连接杆,502、活动杆,503、连接板,504、滑块,505、滑轨。501, connecting rod, 502, movable rod, 503, connecting plate, 504, slide block, 505, slide rail.
下面结合附图对本发明的较佳实施例进行详细阐述,以使本发明的优点和特征能更易于被本领域技术人员理解,从而对本发明的保护范围做出更为清楚明确的界定。The preferred embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings, so that the advantages and features of the present invention can be more easily understood by those skilled in the art, so as to define the protection scope of the present invention more clearly.
参见附图1-11所示,本实施例中的一种用于晶圆装载盒门体的摆放系统,包括晶圆装载机体1,晶圆装载机体1包括基板101、箱体102和装载台103,基板101上设置有对接口2,对接口2的大小与晶圆装载盒门体8相匹配,在基板101的背向装载台103的一侧面上设置有摆放机构,摆放机构包括摆动组件4、从动组件5和对接板3,摆动组件4设置在对接口2的上方,从动组件5设置在对接口2的下方,且摆动组件4、从动组件5分别与对接板3连接,且摆动组件4能驱动对接板3将对接板3摆放到对接口2的侧上方,从动组件5能约束对接板3的转动自由度,并使摆放到位的对接板前侧面301向上。Referring to Figures 1-11, a placement system for the door of a wafer loading box in this embodiment includes a wafer loading body 1, and the wafer loading body 1 includes a substrate 101, a box 102, and a loading stage 103, the substrate 101 is provided with a docking port 2, the size of the docking port 2 matches the wafer loading box door 8, and a placement mechanism is provided on the side of the substrate 101 facing away from the loading table 103, and the placement mechanism It includes a swing assembly 4, a driven assembly 5 and a docking plate 3, the swing assembly 4 is arranged above the docking port 2, the driven assembly 5 is arranged below the docking port 2, and the swing assembly 4 and the driven assembly 5 are respectively connected to the docking plate 3 connected, and the swing assembly 4 can drive the docking plate 3 to place the docking plate 3 above the side of the docking port 2, and the driven component 5 can constrain the rotational freedom of the docking plate 3, and make the front side 301 of the docking plate placed in place up.
摆动组件4包括摆杆401、横杆402和驱动件403,摆杆401设置两个,对称设置在对接板3的左右两侧,两个摆杆401的一端分别与固定在对接板3上的两个第一固定座404通过第一转轴6铰接,另一端分别与固定在基板101上的两个第二固定座405通过第三转轴409铰接,且摆杆401上设置有凸台,横杆402两端分别与两个摆杆401的凸台固定连接,在横杆402和基板101之间还铰接设置驱动件403。目的是使对接板3打开后,使其位于对接口2的侧上方,在驱动件403进行驱动时,摆杆401绕第三转轴409摆动,并驱动对接板3位于对接口2的上方。The swing assembly 4 includes a swing rod 401, a cross bar 402 and a driver 403. There are two swing rods 401 arranged symmetrically on the left and right sides of the butt plate 3. The two first fixed seats 404 are hinged through the first rotating shaft 6, and the other ends are respectively hinged with the two second fixed seats 405 fixed on the base plate 101 through the third rotating shaft 409, and the swing bar 401 is provided with a boss, a cross bar Two ends of the 402 are respectively fixedly connected to the bosses of the two swing bars 401 , and a driving member 403 is hingedly arranged between the cross bar 402 and the base plate 101 . The purpose is to make the docking plate 3 open so that it is positioned above the docking port 2 . When the driver 403 is driven, the swing bar 401 swings around the third rotating shaft 409 and drives the docking plate 3 to be positioned above the docking port 2 .
驱动件403为直线运动气缸,直线运动气缸的缸体尾端与固定在基板101 的气缸尾接板406固定连接,气缸尾接板406与固定在基板101上的支座407铰接,直线运动气缸的活塞杆与双肘接头408固定连接,横杆402的中部设置有凸台,双肘接头408与横杆402的凸台铰接。The driving part 403 is a linear motion cylinder, the cylinder tail end of the linear motion cylinder is fixedly connected with the cylinder tail plate 406 fixed on the base plate 101, the cylinder tail plate 406 is hinged with the support 407 fixed on the base plate 101, and the linear motion cylinder The piston rod is fixedly connected with the double elbow joint 408, the middle part of the cross bar 402 is provided with a boss, and the double elbow joint 408 is hinged with the boss of the cross bar 402.
从动组件5包括连接杆501、活动杆502、滑块504和滑轨505,连接杆501平行设置两个,且对称设置在对接板3的左右两侧,两个连接杆501的一端均固定在对接板后侧面302,另一端分别与活动杆502铰接,同时活动杆502通过连接板503与滑块504固定连接,且滑块504套设在滑轨505上,且滑轨505竖直固定设置在基板101上。在驱动件403通过摆动组件4带动对接板3向对接口2侧上方运动的过程中,从动组件5可以约束对接板3的转动,使对接板3相对晶圆装载机1逆时针方向转动(参考附图1),实现将对接板3由竖直状态逐步转为前侧面朝上的状态。The driven assembly 5 includes a connecting rod 501, a movable rod 502, a slide block 504 and a slide rail 505, two connecting rods 501 are arranged in parallel, and are symmetrically arranged on the left and right sides of the docking plate 3, and one end of the two connecting rods 501 is fixed On the rear side 302 of the docking plate, the other ends are respectively hinged with the movable rod 502, while the movable rod 502 is fixedly connected with the slider 504 through the connecting plate 503, and the slider 504 is sleeved on the slide rail 505, and the slide rail 505 is vertically fixed set on the substrate 101. During the process in which the driving member 403 drives the docking plate 3 to move upward on the side of the docking port 2 through the swing assembly 4, the driven assembly 5 can constrain the rotation of the docking plate 3, so that the docking plate 3 rotates counterclockwise relative to the wafer loader 1 ( With reference to accompanying drawing 1), realize that butt plate 3 is changed to the state that the front side faces up gradually from vertical state.
活动杆502呈“凵”形状,活动杆502的形状大小与对接口2相匹配,活动杆502与滑块504同步沿滑轨505方向在平行于基板101的面内做直线平移运动。这样的设置,一方面可以实现对接板3运动路径的控制,使其摆放到对接口2的侧上方,另一方面也不会干涉EFEM或Sorter中的机械手通过对接口2从晶圆装载盒10中取放晶圆。The movable rod 502 is in the shape of "凵", the shape and size of the movable rod 502 match the docking port 2, and the movable rod 502 and the slider 504 are synchronously moved in linear translation along the direction of the slide rail 505 in a plane parallel to the base plate 101. Such a setting, on the one hand, can realize the control of the movement path of the docking plate 3, so that it can be placed on the side of the docking port 2, and on the other hand, it will not interfere with the manipulator in the EFEM or Sorter from the wafer loading cassette through the docking port 2. 10 Pick and place the wafer.
参见附图3-4,在晶圆装载盒门体关闭的状态下,对接板3呈竖直摆置,与基板101平行,第三转轴409的轴线和第二转轴7的轴线在同一个与基板101平行的竖直面上(参见附图4所示的虚线)。摆动组件4的摆杆401与第一固定座404通过第一转轴6铰接,第一固定座404设置在对接板3的后侧面,从动组件5的连接杆501与活动杆502通过第二转轴7铰接,且第一转轴6的轴线到对接板后侧面302的距离(d)小于第二转轴7的轴线到对接板后侧面302的距离(D)。参见附图3,摆杆401是摆动组件4的部分,摆杆401在初始位置 时向对接板3呈现一定程度的反向倾斜,该初始反向倾斜减小了对接板3在将门体8从晶圆装载盒10中取出过程中的相对倾斜程度,避免门体8从晶圆装载盒10中取出过程中与晶圆装载盒10内壁的接触,从而避免了门体8从晶圆装载盒10中取出时与晶圆装载盒10内壁的摩擦或产生推力。Referring to accompanying drawings 3-4, when the door body of the wafer loading box is closed, the docking plate 3 is placed vertically, parallel to the base plate 101, and the axis of the third rotating shaft 409 and the axis of the second rotating shaft 7 are on the same plane. The parallel vertical planes of the substrate 101 (see dotted lines shown in FIG. 4 ). The swing rod 401 of the swing assembly 4 is hinged to the first fixed seat 404 through the first rotating shaft 6, the first fixed seat 404 is arranged on the rear side of the docking plate 3, the connecting rod 501 and the movable rod 502 of the driven assembly 5 pass through the second rotating shaft 7 is hinged, and the distance (d) from the axis of the first rotating shaft 6 to the rear side 302 of the docking plate is smaller than the distance (D) from the axis of the second rotating shaft 7 to the rear side 302 of the docking plate. Referring to accompanying drawing 3, the swing rod 401 is a part of the swing assembly 4, and the swing rod 401 presents a certain degree of reverse inclination toward the docking plate 3 at the initial position, and the initial reverse inclination reduces the effect of the docking plate 3 on moving the door body 8 from The relative inclination in the process of taking out the wafer loading box 10 avoids the contact of the door body 8 with the inner wall of the wafer loading box 10 in the process of taking out the wafer loading box 10, thereby preventing the door body 8 from coming out of the wafer loading box 10. Friction or thrust against the inner wall of the wafer loading box 10 during removal.
在摆放系统的驱动下,对接板3能与对接口2闭合或打开,在闭合时,通过对接板前侧面301的吸盘将对接口2的另一侧的晶圆装载盒门体8吸附,再由摆放系统驱动,将门体8摆放到指定位置(吸附开门的结构与原理为本领域公知,在此不再赘述)。对接板后侧面302上还设置后盖9,由于对接板前侧面301上设置有用于吸附门体8的吸盘,为吸盘提供吸力的真空管路设置在对接板后侧面302上,为了避免运动过程中对管路的干扰,保持管路周围环境的清洁,因此设置后盖9密封真空管路。Driven by the placement system, the docking plate 3 can be closed or opened with the docking port 2. When closing, the wafer loading box door 8 on the other side of the docking port 2 is sucked by the suction cup on the front side 301 of the docking board, and then Driven by the placement system, the door body 8 is placed to a designated position (the structure and principle of opening the door by suction are well known in the art, and will not be repeated here). Back cover 9 is also set on the butt plate rear side 302, because the suction cup for absorbing the door body 8 is provided on the butt plate front side 301, the vacuum pipeline that provides suction for the suction cup is arranged on the butt plate rear side 302, in order to avoid damage to the door body 8 during the movement. The interference of the pipeline keeps the environment around the pipeline clean, so the back cover 9 is set to seal the vacuum pipeline.
用于晶圆装载盒门体的摆放系统,充分利用了晶圆装载机1以及EFEM和Sorter顶部的空间,使得晶圆装载机1以及EFEM和Sorter的结构布局更加合理。传统的晶圆装载机,取放晶圆装载盒门体8时,门体8始终保持竖直放置,完全依靠真空吸力将门体8贴近在对接板3上,本发明的用于晶圆装载盒门体8的摆动系统将门体8摆放到指定位置后,对接板3是接近水平放置的,可通过对接板3给予门体8支撑力,降低了对真空吸力的依赖,实现了晶圆装载机上用于晶圆装载盒门体8打开及取放机构的模块化设计,降低了晶圆装载机的机械结构集成度,更有利于晶圆装机的生产、组装、运输及维修。The placement system for the door of the wafer loading box makes full use of the space on the top of the wafer loader 1, EFEM and Sorter, making the structural layout of the wafer loader 1, EFEM and Sorter more reasonable. In a traditional wafer loader, when taking and placing the door 8 of the wafer loading box, the door 8 is always placed vertically, and the door 8 is brought close to the docking plate 3 entirely by vacuum suction. The wafer loading box of the present invention The swing system of the door body 8 puts the door body 8 to the designated position, and the docking plate 3 is placed close to the horizontal, and the door body 8 can be supported by the docking plate 3, which reduces the dependence on vacuum suction and realizes wafer loading. The modular design of the opening and pick-and-place mechanism for the wafer loading box door 8 on the machine reduces the mechanical structure integration of the wafer loading machine, and is more conducive to the production, assembly, transportation and maintenance of the wafer loading machine.
具体参见图4-9,为关闭状态-打开过程-完全打开的示意图,基本的工作原理:在初始位置时,对接板3相对对接口2居中放置,对接口2呈关闭状态,当Loadport晶圆装载机1开始工作时,由放置在箱体102内的控制系统接受信息和发送指令操控晶圆装载机1上的所有驱动件的运动,晶圆装载盒10被放置 在装载台103上,之后装载台103将晶圆装载盒10推送到对接口2,然后安装在对接板3上的吸盘吸住晶圆装载盒门体8,在吸盘吸力的作用下,门体8与对接板3贴合在一起,安装在对接板3上的开锁装载将晶圆装载盒门体8打开,晶圆装载盒门体8与晶圆装载盒10解锁,摆放系统开始工作,驱动件403的活塞杆伸出,推动横杆402运动,进而带动摆杆401绕第一固定座404顺时针摆动(从图示视角),摆杆401带动对接板3运动,对接板3进一步带动活动杆502连同滑块504一起沿着滑轨505竖直向上运动,对接板3在和活动杆502一起向上运动的同时绕着活动杆502的转轴逆时针转动,对接板3带着晶圆装载盒门体8同步摆动,将晶圆装载盒门体8从晶圆装载盒10中摆出,驱动件403在横杆402的反作用下绕着支座407摆动,驱动件403的活塞杆持续伸出以及活动杆502的上移,晶圆装载盒门体8逐步被摆动到对接口2的侧上方,晶圆装载盒10完全打开。此时,门体8接近水平放置,依靠对接板3提供支撑力,降低了对真空吸力的依赖,对接板3依靠驱动件403提供支撑力,在压缩空气的作用下,驱动件403通过三位五通阀可较长时间保持活塞杆的伸出状态,不会受到外界气压波动的影响。Refer to Figure 4-9 for details, which is a schematic diagram of closed state-opening process-full opening. The basic working principle: in the initial position, the docking plate 3 is placed in the center relative to the docking port 2, and the docking port 2 is closed. When the Loadport wafer When the loader 1 starts to work, the control system placed in the box 102 receives information and sends instructions to control the movement of all the driving parts on the wafer loader 1, and the wafer loading cassette 10 is placed on the loading table 103, and then The loading table 103 pushes the wafer loading box 10 to the docking port 2, and then the suction cup installed on the docking plate 3 sucks the wafer loading box door 8, and the door 8 is attached to the docking plate 3 under the action of the suction force of the suction cup Together, the unlocking load installed on the docking plate 3 opens the wafer loading box door 8, the wafer loading box door 8 and the wafer loading box 10 are unlocked, the placement system starts to work, and the piston rod of the driving part 403 is extended. Push the cross bar 402 to move, and then drive the swing bar 401 to swing clockwise around the first fixed seat 404 (from the perspective of the figure), the swing bar 401 drives the butt plate 3 to move, and the butt plate 3 further drives the movable bar 502 together with the slider 504 move vertically upward along the slide rail 505 together, the docking plate 3 rotates counterclockwise around the rotating shaft of the movable rod 502 while moving upward together with the movable rod 502, the docking plate 3 swings synchronously with the wafer loading box door 8, Swing the wafer loading box door body 8 out of the wafer loading box 10, the driving part 403 swings around the support 407 under the reaction of the cross bar 402, the piston rod of the driving part 403 continues to extend and the upper part of the movable rod 502 Moving, the wafer loading box door 8 is gradually swung to the upper side of the docking port 2, and the wafer loading box 10 is fully opened. At this time, the door body 8 is placed nearly horizontally, relying on the butt plate 3 to provide support, which reduces the dependence on vacuum suction, and the butt plate 3 relies on the driver 403 to provide support. Under the action of compressed air, the driver 403 passes through the three-position The five-way valve can maintain the extended state of the piston rod for a long time, and will not be affected by the fluctuation of external air pressure.
以上实施方式只为说明本发明的技术构思及特点,其目的在于让熟悉此项技术的人了解本发明的内容并加以实施,并不能以此限制本发明的保护范围,凡根据本发明精神实质所做的等效变化或修饰,都应涵盖在本发明的保护范围内。The above embodiments are only to illustrate the technical concept and characteristics of the present invention. All equivalent changes or modifications shall fall within the protection scope of the present invention.
Claims (8)
- 一种用于晶圆装载盒门体的摆放系统,包括晶圆装载机体,其特征在于:所述晶圆装载机体包括基板、箱体和装载台,所述基板上设置有对接口,所述对接口的大小与晶圆装载盒门体相匹配,在所述基板的背向装载台的一侧面上设置有摆放机构,所述摆放机构包括摆动组件、从动组件和对接板,所述摆动组件设置在对接口的上方,所述从动组件设置在对接口的下方,且所述摆动组件、从动组件分别与对接板连接,且所述摆动组件能驱动对接板将对接板摆放到对接口的侧上方,所述从动组件能约束对接板的转动自由度,并使摆放到位的对接板前侧面朝上。A placement system for the door of a wafer loading box, comprising a wafer loading body, characterized in that: the wafer loading body includes a base plate, a box body, and a loading platform, and the base plate is provided with a docking port, so that The size of the docking port matches the wafer loading box door, and a placement mechanism is provided on the side of the substrate facing away from the loading platform, and the placement mechanism includes a swing assembly, a driven assembly, and a docking plate. The swing assembly is arranged above the docking port, the driven assembly is arranged below the docking port, and the swing assembly and the driven assembly are respectively connected to the docking plate, and the swing assembly can drive the docking plate to connect the docking plate Placed above the side of the docking port, the driven assembly can constrain the degree of freedom of rotation of the docking plate, and make the front side of the docking board placed in place face upward.
- 根据权利要求1所述的一种用于晶圆装载盒门体的摆放系统,其特征在于:所述摆动组件包括摆杆、横杆和驱动件,所述摆杆设置两个,对称设置在所述对接板的左右两侧,两个所述摆杆的一端分别与固定在对接板上的两个第一固定座铰接,另一端分别与固定在基板上的两个第二固定座铰接,且所述摆杆上设置有凸台,所述横杆两端分别与两个摆杆的凸台固定连接,在所述横杆和基板之间还铰接设置驱动件。A placement system for a wafer loading box door according to claim 1, wherein the swing assembly includes a swing bar, a cross bar and a driving member, and two swing bars are arranged symmetrically On the left and right sides of the butt plate, one ends of the two swing rods are respectively hinged to the two first fixed seats fixed on the butted plate, and the other ends are respectively hinged to the two second fixed seats fixed on the base plate , and the swing bar is provided with a boss, the two ends of the cross bar are respectively fixedly connected with the bosses of the two swing bars, and a driving member is hingedly arranged between the cross bar and the base plate.
- 根据权利要求2所述的一种用于晶圆装载盒门体的摆放系统,其特征在于:所述驱动件为直线运动气缸,所述直线运动气缸的缸体尾端与固定在基板上的气缸尾接板固定连接,所述气缸尾接板与固定在基板上的支座铰接,所述直线运动气缸的活塞杆与双肘接头固定连接,所述横杆的中部设置有凸台,所述双肘接头与横杆的凸台铰接。The system for placing the door body of a wafer loading box according to claim 2, wherein the driving part is a linear motion cylinder, and the tail end of the cylinder body of the linear motion cylinder is fixed on the substrate The tail joint plate of the cylinder is fixedly connected, the tail joint plate of the cylinder is hinged with the support fixed on the base plate, the piston rod of the linear motion cylinder is fixedly connected with the double elbow joint, and the middle part of the cross bar is provided with a boss, The double elbow joint is hinged with the boss of the cross bar.
- 根据权利要求1所述的一种用于晶圆装载盒门体的摆放系统,其特征在于:所述从动组件包括连接杆、活动杆、滑块和滑轨,所述连接杆平行设置两个,且对称设置在对接板的左右两侧,两个所述连接杆的一端均固定在对接板后侧面上,另一端分别与活动杆铰接,同时所述活动杆通过连接板与滑块固定 连接,且所述滑块套设在滑轨上,且所述滑轨竖直固定设置在基板上。A placement system for a wafer loading box door according to claim 1, wherein the driven assembly includes a connecting rod, a movable rod, a slider and a sliding rail, and the connecting rods are arranged in parallel Two, and symmetrically arranged on the left and right sides of the docking plate, one end of the two connecting rods is fixed on the rear side of the docking plate, and the other ends are respectively hinged with the movable rod, and the movable rod is connected to the slider through the connecting plate It is fixedly connected, and the slider is sleeved on the slide rail, and the slide rail is vertically and fixedly arranged on the base plate.
- 根据权利要求4所述的一种用于晶圆装载盒门体的摆放系统,其特征在于:所述活动杆呈“凵”形状,所述活动杆的形状大小与对接口相匹配,所述活动杆与滑块同步沿滑轨方向在平行于基板的面内做直线平移运动。The system for placing the door body of a wafer loading box according to claim 4, wherein the movable rod is in the shape of "凵", and the shape and size of the movable rod match the docking port, so that The movable rod and the slide block are synchronously moved along the direction of the slide rail in a plane parallel to the base plate in a linear translation motion.
- 根据权利要求2所述的一种用于晶圆装载盒门体的摆放系统,其特征在于:所述摆动组件的摆杆与第一固定座通过第一转轴铰接,第一固定座设置在对接板后侧面,所述摆动组件的摆杆与第二固定座通过第三转轴铰接,所述从动组件的连接杆与活动杆通过第二转轴铰接。A placement system for the door of a wafer loading box according to claim 2, characterized in that: the swing bar of the swing assembly is hinged to the first fixed seat through a first rotating shaft, and the first fixed seat is arranged at On the rear side of the docking plate, the swing rod of the swing assembly is hinged with the second fixed seat through the third rotating shaft, and the connecting rod and the movable rod of the driven assembly are hinged through the second rotating shaft.
- 根据权利要求6所述的一种用于晶圆装载盒门体的摆放系统,其特征在于:在晶圆装载盒门体关闭的状态下,对接板呈竖直摆置且与基板平行,同时第三转轴的轴线和第二转轴的轴线形成竖直面,且竖直面与基板平行。A placement system for the wafer loading pod door according to claim 6, characterized in that: when the wafer loading pod door is closed, the docking plate is placed vertically and parallel to the substrate, At the same time, the axis of the third rotating shaft and the axis of the second rotating shaft form a vertical plane, and the vertical plane is parallel to the base plate.
- 根据权利要求7所述的一种用于晶圆装载盒门体的摆放系统,其特征在于:第一转轴的轴线到对接板后侧面的距离小于第二转轴的轴线到对接板后侧面的距离。A placement system for a wafer loading box door according to claim 7, wherein the distance from the axis of the first rotating shaft to the rear side of the docking plate is smaller than the distance from the axis of the second rotating shaft to the rear side of the docking plate distance.
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CN117524957A (en) * | 2024-01-08 | 2024-02-06 | 上海大族富创得科技股份有限公司 | Loading and opening mechanism for wafer cassettes |
CN117524957B (en) * | 2024-01-08 | 2024-03-19 | 上海大族富创得科技股份有限公司 | Loading and opening mechanism for wafer cassettes |
CN117747517A (en) * | 2024-02-19 | 2024-03-22 | 中国科学院长春光学精密机械与物理研究所 | Semiconductor machine with feeding function |
CN117747517B (en) * | 2024-02-19 | 2024-05-28 | 中国科学院长春光学精密机械与物理研究所 | Semiconductor machine with feeding function |
Also Published As
Publication number | Publication date |
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CN114121745B (en) | 2022-10-11 |
JP2023079172A (en) | 2023-06-07 |
JP7256574B1 (en) | 2023-04-12 |
CN114121745A (en) | 2022-03-01 |
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