WO2023088097A1 - 阻燃环氧树脂组合物 - Google Patents
阻燃环氧树脂组合物 Download PDFInfo
- Publication number
- WO2023088097A1 WO2023088097A1 PCT/CN2022/129216 CN2022129216W WO2023088097A1 WO 2023088097 A1 WO2023088097 A1 WO 2023088097A1 CN 2022129216 W CN2022129216 W CN 2022129216W WO 2023088097 A1 WO2023088097 A1 WO 2023088097A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- epoxy resin
- flame retardant
- resin composition
- bisphenol
- brominated
- Prior art date
Links
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 157
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 153
- 239000000203 mixture Substances 0.000 title claims abstract description 78
- 239000003063 flame retardant Substances 0.000 title claims abstract description 63
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 title claims abstract description 50
- 238000000034 method Methods 0.000 claims abstract description 16
- 238000009755 vacuum infusion Methods 0.000 claims abstract description 14
- 239000002131 composite material Substances 0.000 claims abstract description 6
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 31
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 claims description 30
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 claims description 25
- 239000003795 chemical substances by application Substances 0.000 claims description 23
- 229920005989 resin Polymers 0.000 claims description 19
- 239000011347 resin Substances 0.000 claims description 19
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 15
- 229910052698 phosphorus Inorganic materials 0.000 claims description 15
- 239000011574 phosphorus Substances 0.000 claims description 15
- 239000003085 diluting agent Substances 0.000 claims description 13
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 claims description 10
- DQWPFSLDHJDLRL-UHFFFAOYSA-N triethyl phosphate Chemical compound CCOP(=O)(OCC)OCC DQWPFSLDHJDLRL-UHFFFAOYSA-N 0.000 claims description 10
- 239000004593 Epoxy Substances 0.000 claims description 9
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 claims description 9
- 229910052794 bromium Inorganic materials 0.000 claims description 9
- 239000012779 reinforcing material Substances 0.000 claims description 8
- 239000000654 additive Substances 0.000 claims description 6
- WVLBCYQITXONBZ-UHFFFAOYSA-N trimethyl phosphate Chemical group COP(=O)(OC)OC WVLBCYQITXONBZ-UHFFFAOYSA-N 0.000 claims description 5
- BSWWXRFVMJHFBN-UHFFFAOYSA-N 2,4,6-tribromophenol Chemical compound OC1=C(Br)C=C(Br)C=C1Br BSWWXRFVMJHFBN-UHFFFAOYSA-N 0.000 claims description 4
- 229920000049 Carbon (fiber) Polymers 0.000 claims description 3
- PQYJRMFWJJONBO-UHFFFAOYSA-N Tris(2,3-dibromopropyl) phosphate Chemical compound BrCC(Br)COP(=O)(OCC(Br)CBr)OCC(Br)CBr PQYJRMFWJJONBO-UHFFFAOYSA-N 0.000 claims description 3
- 125000003118 aryl group Chemical group 0.000 claims description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 3
- 239000004917 carbon fiber Substances 0.000 claims description 3
- 239000003365 glass fiber Substances 0.000 claims description 3
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 3
- 229910052760 oxygen Inorganic materials 0.000 claims description 3
- 239000001301 oxygen Substances 0.000 claims description 3
- ASLWPAWFJZFCKF-UHFFFAOYSA-N tris(1,3-dichloropropan-2-yl) phosphate Chemical compound ClCC(CCl)OP(=O)(OC(CCl)CCl)OC(CCl)CCl ASLWPAWFJZFCKF-UHFFFAOYSA-N 0.000 claims description 3
- JZZBTMVTLBHJHL-UHFFFAOYSA-N tris(2,3-dichloropropyl) phosphate Chemical compound ClCC(Cl)COP(=O)(OCC(Cl)CCl)OCC(Cl)CCl JZZBTMVTLBHJHL-UHFFFAOYSA-N 0.000 claims description 3
- HQUQLFOMPYWACS-UHFFFAOYSA-N tris(2-chloroethyl) phosphate Chemical compound ClCCOP(=O)(OCCCl)OCCCl HQUQLFOMPYWACS-UHFFFAOYSA-N 0.000 claims description 3
- 229920000271 Kevlar® Polymers 0.000 claims description 2
- 239000000835 fiber Substances 0.000 claims description 2
- 239000004761 kevlar Substances 0.000 claims description 2
- 239000012783 reinforcing fiber Substances 0.000 claims description 2
- VLYCFCQJBSEXCE-UHFFFAOYSA-N [1,2,6,7-tetrabromo-4-(2,2-dichloroethyl)heptan-4-yl] dihydrogen phosphate Chemical compound C(C(CBr)Br)C(CC(CBr)Br)(CC(Cl)Cl)OP(=O)(O)O VLYCFCQJBSEXCE-UHFFFAOYSA-N 0.000 claims 1
- XUCHXOAWJMEFLF-UHFFFAOYSA-N bisphenol F diglycidyl ether Chemical compound C1OC1COC(C=C1)=CC=C1CC(C=C1)=CC=C1OCC1CO1 XUCHXOAWJMEFLF-UHFFFAOYSA-N 0.000 claims 1
- 125000003700 epoxy group Chemical group 0.000 abstract description 7
- OUCSIUCEQVCDEL-UHFFFAOYSA-N 2,3,4-tribromophenol Chemical group OC1=CC=C(Br)C(Br)=C1Br OUCSIUCEQVCDEL-UHFFFAOYSA-N 0.000 abstract description 3
- -1 hexyl Diol Chemical class 0.000 description 14
- 229920000768 polyamine Polymers 0.000 description 12
- 239000000047 product Substances 0.000 description 12
- 150000004985 diamines Chemical class 0.000 description 9
- 239000007787 solid Substances 0.000 description 9
- VEORPZCZECFIRK-UHFFFAOYSA-N 3,3',5,5'-tetrabromobisphenol A Chemical compound C=1C(Br)=C(O)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(O)C(Br)=C1 VEORPZCZECFIRK-UHFFFAOYSA-N 0.000 description 8
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 8
- 150000001412 amines Chemical class 0.000 description 8
- 150000001875 compounds Chemical class 0.000 description 8
- 230000008569 process Effects 0.000 description 8
- 238000012360 testing method Methods 0.000 description 7
- 239000004721 Polyphenylene oxide Substances 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 6
- 229920000570 polyether Polymers 0.000 description 6
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 5
- 229920002873 Polyethylenimine Polymers 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 5
- 229920000642 polymer Polymers 0.000 description 5
- 238000003756 stirring Methods 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- VILCJCGEZXAXTO-UHFFFAOYSA-N 2,2,2-tetramine Chemical compound NCCNCCNCCN VILCJCGEZXAXTO-UHFFFAOYSA-N 0.000 description 4
- AOBIOSPNXBMOAT-UHFFFAOYSA-N 2-[2-(oxiran-2-ylmethoxy)ethoxymethyl]oxirane Chemical compound C1OC1COCCOCC1CO1 AOBIOSPNXBMOAT-UHFFFAOYSA-N 0.000 description 4
- RNLHGQLZWXBQNY-UHFFFAOYSA-N 3-(aminomethyl)-3,5,5-trimethylcyclohexan-1-amine Chemical compound CC1(C)CC(N)CC(C)(CN)C1 RNLHGQLZWXBQNY-UHFFFAOYSA-N 0.000 description 4
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical class C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 4
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 4
- 125000001931 aliphatic group Chemical group 0.000 description 4
- 125000004122 cyclic group Chemical group 0.000 description 4
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 229920003986 novolac Polymers 0.000 description 4
- 229920005862 polyol Polymers 0.000 description 4
- 235000013824 polyphenols Nutrition 0.000 description 4
- 229920006395 saturated elastomer Polymers 0.000 description 4
- 125000000467 secondary amino group Chemical group [H]N([*:1])[*:2] 0.000 description 4
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 3
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 description 3
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- 229910019142 PO4 Inorganic materials 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- JVVXZOOGOGPDRZ-SLFFLAALSA-N [(1R,4aS,10aR)-1,4a-dimethyl-7-propan-2-yl-2,3,4,9,10,10a-hexahydrophenanthren-1-yl]methanamine Chemical compound NC[C@]1(C)CCC[C@]2(C)C3=CC=C(C(C)C)C=C3CC[C@H]21 JVVXZOOGOGPDRZ-SLFFLAALSA-N 0.000 description 3
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- 238000011056 performance test Methods 0.000 description 3
- 235000021317 phosphate Nutrition 0.000 description 3
- 229920000962 poly(amidoamine) Polymers 0.000 description 3
- 150000003077 polyols Chemical class 0.000 description 3
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- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 3
- 125000001424 substituent group Chemical group 0.000 description 3
- OWICEWMBIBPFAH-UHFFFAOYSA-N (3-diphenoxyphosphoryloxyphenyl) diphenyl phosphate Chemical compound C=1C=CC=CC=1OP(OC=1C=C(OP(=O)(OC=2C=CC=CC=2)OC=2C=CC=CC=2)C=CC=1)(=O)OC1=CC=CC=C1 OWICEWMBIBPFAH-UHFFFAOYSA-N 0.000 description 2
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 description 2
- HHRACYLRBOUBKM-UHFFFAOYSA-N 2-[(4-tert-butylphenoxy)methyl]oxirane Chemical compound C1=CC(C(C)(C)C)=CC=C1OCC1OC1 HHRACYLRBOUBKM-UHFFFAOYSA-N 0.000 description 2
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- YOOSAIJKYCBPFW-UHFFFAOYSA-N 3-[4-(3-aminopropoxy)butoxy]propan-1-amine Chemical compound NCCCOCCCCOCCCN YOOSAIJKYCBPFW-UHFFFAOYSA-N 0.000 description 2
- UMPGNGRIGSEMTC-UHFFFAOYSA-N 4-[1-(4-hydroxyphenyl)-3,3,5-trimethylcyclohexyl]phenol Chemical compound C1C(C)CC(C)(C)CC1(C=1C=CC(O)=CC=1)C1=CC=C(O)C=C1 UMPGNGRIGSEMTC-UHFFFAOYSA-N 0.000 description 2
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- 125000003277 amino group Chemical group 0.000 description 2
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- YQLZOAVZWJBZSY-UHFFFAOYSA-N decane-1,10-diamine Chemical compound NCCCCCCCCCCN YQLZOAVZWJBZSY-UHFFFAOYSA-N 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 150000001991 dicarboxylic acids Chemical class 0.000 description 1
- UJSSNDKVUQJEGE-UHFFFAOYSA-N dichloro propyl phosphate Chemical compound CCCOP(=O)(OCl)OCl UJSSNDKVUQJEGE-UHFFFAOYSA-N 0.000 description 1
- 239000000539 dimer Substances 0.000 description 1
- 239000001177 diphosphate Substances 0.000 description 1
- XPPKVPWEQAFLFU-UHFFFAOYSA-J diphosphate(4-) Chemical compound [O-]P([O-])(=O)OP([O-])([O-])=O XPPKVPWEQAFLFU-UHFFFAOYSA-J 0.000 description 1
- QFTYSVGGYOXFRQ-UHFFFAOYSA-N dodecane-1,12-diamine Chemical compound NCCCCCCCCCCCCN QFTYSVGGYOXFRQ-UHFFFAOYSA-N 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- 125000001033 ether group Chemical group 0.000 description 1
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 description 1
- IWBOPFCKHIJFMS-UHFFFAOYSA-N ethylene glycol bis(2-aminoethyl) ether Chemical compound NCCOCCOCCN IWBOPFCKHIJFMS-UHFFFAOYSA-N 0.000 description 1
- 150000002222 fluorine compounds Chemical class 0.000 description 1
- 239000004088 foaming agent Substances 0.000 description 1
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 1
- 150000002334 glycols Chemical class 0.000 description 1
- 239000012760 heat stabilizer Substances 0.000 description 1
- PWSKHLMYTZNYKO-UHFFFAOYSA-N heptane-1,7-diamine Chemical compound NCCCCCCCN PWSKHLMYTZNYKO-UHFFFAOYSA-N 0.000 description 1
- 150000002391 heterocyclic compounds Chemical class 0.000 description 1
- 125000000623 heterocyclic group Chemical group 0.000 description 1
- PYGSKMBEVAICCR-UHFFFAOYSA-N hexa-1,5-diene Chemical compound C=CCCC=C PYGSKMBEVAICCR-UHFFFAOYSA-N 0.000 description 1
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 description 1
- PBBGSZCBWVPOOL-UHFFFAOYSA-N hexestrol Chemical compound C=1C=C(O)C=CC=1C(CC)C(CC)C1=CC=C(O)C=C1 PBBGSZCBWVPOOL-UHFFFAOYSA-N 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- WJRBRSLFGCUECM-UHFFFAOYSA-N hydantoin Chemical compound O=C1CNC(=O)N1 WJRBRSLFGCUECM-UHFFFAOYSA-N 0.000 description 1
- 229940091173 hydantoin Drugs 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 239000004611 light stabiliser Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 1
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- GDOPTJXRTPNYNR-UHFFFAOYSA-N methyl-cyclopentane Natural products CC1CCCC1 GDOPTJXRTPNYNR-UHFFFAOYSA-N 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 239000012764 mineral filler Substances 0.000 description 1
- BAVYZALUXZFZLV-UHFFFAOYSA-N mono-methylamine Natural products NC BAVYZALUXZFZLV-UHFFFAOYSA-N 0.000 description 1
- 150000002763 monocarboxylic acids Chemical class 0.000 description 1
- GBTLMWXVQMOHRC-UHFFFAOYSA-N n'-(1-aminopentan-3-yl)-2-methylpentane-1,5-diamine Chemical compound NCCC(CC)NCCCC(C)CN GBTLMWXVQMOHRC-UHFFFAOYSA-N 0.000 description 1
- IRYWPHGCDAOHJJ-UHFFFAOYSA-N n'-(3-aminopropyl)-2-methylpentane-1,5-diamine Chemical compound NCC(C)CCCNCCCN IRYWPHGCDAOHJJ-UHFFFAOYSA-N 0.000 description 1
- PHQOGHDTIVQXHL-UHFFFAOYSA-N n'-(3-trimethoxysilylpropyl)ethane-1,2-diamine Chemical compound CO[Si](OC)(OC)CCCNCCN PHQOGHDTIVQXHL-UHFFFAOYSA-N 0.000 description 1
- NHBRUUFBSBSTHM-UHFFFAOYSA-N n'-[2-(3-trimethoxysilylpropylamino)ethyl]ethane-1,2-diamine Chemical compound CO[Si](OC)(OC)CCCNCCNCCN NHBRUUFBSBSTHM-UHFFFAOYSA-N 0.000 description 1
- YRGVKPIUZUOJSJ-UHFFFAOYSA-N n,n'-dibutylethane-1,2-diamine Chemical compound CCCCNCCNCCCC YRGVKPIUZUOJSJ-UHFFFAOYSA-N 0.000 description 1
- LDQWVRMGQLAWMN-UHFFFAOYSA-N n,n'-diethylhexane-1,6-diamine Chemical compound CCNCCCCCCNCC LDQWVRMGQLAWMN-UHFFFAOYSA-N 0.000 description 1
- KGHYGBGIWLNFAV-UHFFFAOYSA-N n,n'-ditert-butylethane-1,2-diamine Chemical compound CC(C)(C)NCCNC(C)(C)C KGHYGBGIWLNFAV-UHFFFAOYSA-N 0.000 description 1
- JAYXSROKFZAHRQ-UHFFFAOYSA-N n,n-bis(oxiran-2-ylmethyl)aniline Chemical compound C1OC1CN(C=1C=CC=CC=1)CC1CO1 JAYXSROKFZAHRQ-UHFFFAOYSA-N 0.000 description 1
- CLCWCGOCHZSFQE-UHFFFAOYSA-N n,n-bis(oxiran-2-ylmethyl)cyclohexanamine Chemical compound C1OC1CN(C1CCCCC1)CC1CO1 CLCWCGOCHZSFQE-UHFFFAOYSA-N 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- SXJVFQLYZSNZBT-UHFFFAOYSA-N nonane-1,9-diamine Chemical compound NCCCCCCCCCN SXJVFQLYZSNZBT-UHFFFAOYSA-N 0.000 description 1
- 239000004843 novolac epoxy resin Substances 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 239000012766 organic filler Substances 0.000 description 1
- 150000001282 organosilanes Chemical class 0.000 description 1
- QQWAKSKPSOFJFF-UHFFFAOYSA-N oxiran-2-ylmethyl 2,2-dimethyloctanoate Chemical compound CCCCCCC(C)(C)C(=O)OCC1CO1 QQWAKSKPSOFJFF-UHFFFAOYSA-N 0.000 description 1
- XRQKARZTFMEBBY-UHFFFAOYSA-N oxiran-2-ylmethyl benzoate Chemical compound C=1C=CC=CC=1C(=O)OCC1CO1 XRQKARZTFMEBBY-UHFFFAOYSA-N 0.000 description 1
- SCHTXWZFMCQMBH-UHFFFAOYSA-N pentane-1,3,5-triamine Chemical compound NCCC(N)CCN SCHTXWZFMCQMBH-UHFFFAOYSA-N 0.000 description 1
- WTSXICLFTPPDTL-UHFFFAOYSA-N pentane-1,3-diamine Chemical compound CCC(N)CCN WTSXICLFTPPDTL-UHFFFAOYSA-N 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- AQSJGOWTSHOLKH-UHFFFAOYSA-N phosphite(3-) Chemical class [O-]P([O-])[O-] AQSJGOWTSHOLKH-UHFFFAOYSA-N 0.000 description 1
- XZTOTRSSGPPNTB-UHFFFAOYSA-N phosphono dihydrogen phosphate;1,3,5-triazine-2,4,6-triamine Chemical compound NC1=NC(N)=NC(N)=N1.OP(O)(=O)OP(O)(O)=O XZTOTRSSGPPNTB-UHFFFAOYSA-N 0.000 description 1
- XRBCRPZXSCBRTK-UHFFFAOYSA-N phosphonous acid Chemical class OPO XRBCRPZXSCBRTK-UHFFFAOYSA-N 0.000 description 1
- XFZRQAZGUOTJCS-UHFFFAOYSA-N phosphoric acid;1,3,5-triazine-2,4,6-triamine Chemical compound OP(O)(O)=O.NC1=NC(N)=NC(N)=N1 XFZRQAZGUOTJCS-UHFFFAOYSA-N 0.000 description 1
- 150000003017 phosphorus Chemical class 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920001228 polyisocyanate Polymers 0.000 description 1
- 239000005056 polyisocyanate Substances 0.000 description 1
- 229920002959 polymer blend Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000003755 preservative agent Substances 0.000 description 1
- 150000003141 primary amines Chemical class 0.000 description 1
- AOHJOMMDDJHIJH-UHFFFAOYSA-N propylenediamine Chemical compound CC(N)CN AOHJOMMDDJHIJH-UHFFFAOYSA-N 0.000 description 1
- 238000000197 pyrolysis Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 150000003335 secondary amines Chemical class 0.000 description 1
- 150000003384 small molecules Chemical class 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000000600 sorbitol Substances 0.000 description 1
- 230000002269 spontaneous effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 125000001302 tertiary amino group Chemical group 0.000 description 1
- FAGUFWYHJQFNRV-UHFFFAOYSA-N tetraethylenepentamine Chemical compound NCCNCCNCCNCCN FAGUFWYHJQFNRV-UHFFFAOYSA-N 0.000 description 1
- 239000013008 thixotropic agent Substances 0.000 description 1
- 150000004992 toluidines Chemical class 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- YUYCVXFAYWRXLS-UHFFFAOYSA-N trimethoxysilane Chemical compound CO[SiH](OC)OC YUYCVXFAYWRXLS-UHFFFAOYSA-N 0.000 description 1
- XFVUECRWXACELC-UHFFFAOYSA-N trimethyl oxiran-2-ylmethyl silicate Chemical compound CO[Si](OC)(OC)OCC1CO1 XFVUECRWXACELC-UHFFFAOYSA-N 0.000 description 1
- QXJQHYBHAIHNGG-UHFFFAOYSA-N trimethylolethane Chemical compound OCC(C)(CO)CO QXJQHYBHAIHNGG-UHFFFAOYSA-N 0.000 description 1
- XZZNDPSIHUTMOC-UHFFFAOYSA-N triphenyl phosphate Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)(=O)OC1=CC=CC=C1 XZZNDPSIHUTMOC-UHFFFAOYSA-N 0.000 description 1
- 239000001226 triphosphate Substances 0.000 description 1
- 235000011178 triphosphate Nutrition 0.000 description 1
- UNXRWKVEANCORM-UHFFFAOYSA-N triphosphoric acid Chemical compound OP(O)(=O)OP(O)(=O)OP(O)(O)=O UNXRWKVEANCORM-UHFFFAOYSA-N 0.000 description 1
- MBYLVOKEDDQJDY-UHFFFAOYSA-N tris(2-aminoethyl)amine Chemical compound NCCN(CCN)CCN MBYLVOKEDDQJDY-UHFFFAOYSA-N 0.000 description 1
- KLNPWTHGTVSSEU-UHFFFAOYSA-N undecane-1,11-diamine Chemical compound NCCCCCCCCCCCN KLNPWTHGTVSSEU-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/02—Flame or fire retardant/resistant
Definitions
- the invention relates to a flame-retardant epoxy resin composition, which is especially suitable for vacuum infusion technology.
- the present invention also relates to the use of this flame-retardant epoxy resin composition and articles made therefrom.
- Vacuum infusion is a suitable process for manufacturing composite materials.
- reinforcement materials such as glass fiber, carbon fiber, etc.
- a vacuum application device such as a vacuum bag or a vacuum guide net on it to draw out the air in the system to form a negative pressure
- resin For example, epoxy resin is introduced into the mold to infiltrate the reinforcing material and solidify in it.
- epoxy resin used in this vacuum infusion process it is generally expected that it has a low viscosity, and its products have excellent mechanical properties, transparency and flame retardancy.
- a two-component flame retardant epoxy resin composition suitable for vacuum infusion wherein the A component includes bisphenol A resin, bromine-containing epoxy flame retardant and organic phosphorus flame retardant.
- the brominated epoxy flame retardants used here refer to bromine-containing compounds with flame retardancy, including additive brominated flame retardants such as tetrabromoxylene, pentabromodiphenyl ether, octabromodiphenyl ether, and 2 , 3-dibromopropanol, tetrabromobisphenol S, tetrabromobisphenol A and other reactive bromine-containing flame retardants, the reactive group is hydroxyl or phenolic hydroxyl, and this type of reactive group will reduce the epoxy resin. Mechanical properties, such as flexural strength, tensile strength, etc.
- the brominated epoxy flame retardants mentioned in this patent are all small molecules or monomeric compounds that are not epoxy resins.
- the first aspect of the present invention is to provide a flame retardant epoxy resin composition, which is especially suitable for vacuum infusion process.
- the epoxy resin composition not only can maintain excellent flame retardancy, processability and mechanical properties, but also has lower viscosity and better adhesiveness than the epoxy resin products in the prior art.
- the inventors of the present invention have found that the above objects can be achieved using a flame retardant epoxy resin composition as described hereinafter in the specification.
- the present invention also relates to the use of the flame-retardant epoxy resin composition in a vacuum infusion process and articles made from the flame-retardant epoxy resin composition.
- a first aspect of the present invention relates to a flame retardant epoxy resin composition, comprising
- poly(poly) in the names of substances such as “polyol”, “polyisocyanate”, “polyether” or “polyamine” in this context indicates that the corresponding substance formally contains more than one compound present in its name per molecule. functional groups.
- molecular weight is understood to mean the molar mass (in g/mol) of a molecule.
- Molecular weight average is understood to mean the number average molecular weight Mn of an oligomer or polymer mixture of molecules, which is usually determined by GPC relative to polystyrene as a standard.
- room temperature means a temperature of 23°C.
- epoxy resin refers to an epoxy resin or epoxy polymer having an average of more than one, such as two or more, epoxy groups per molecule, which is preferably a liquid epoxy resin or a solid epoxy resin.
- epoxy resin Epoxy resins can be prepared, for example, in a known manner by oxidation of the corresponding alkenes or by reaction of epichlorohydrin with the corresponding polyols or polyphenols.
- solid epoxy resin is well known to those skilled in the art of epoxy resins and is used in contrast to "liquid epoxy resin”. The glass transition temperature of the solid resin is above room temperature, which means it can be pulverized at room temperature to give a free-flowing powder.
- Suitable epoxy resins are especially aromatic epoxy resins, especially the glycidylation products of:
- bisphenols or polyphenols such as bis(4-hydroxy-3-methylphenyl)methane, 2,2-bis(4-hydroxy-3-methylphenyl)propane (bisphenol C), bis( 3,5-Dimethyl-4-hydroxyphenyl)methane, 2,2-bis(3,5-dimethyl-4-hydroxyphenyl)propane, 2,2-bis(3,5-dibromo -4-hydroxyphenyl) propane, 2,2-bis(4-hydroxy-3-tert-butylphenyl)propane, 2,2-bis(4-hydroxyphenyl)butane (bisphenol B), 3 ,3-bis(4-hydroxyphenyl)pentane, 3,4-bis(4-hydroxyphenyl)hexane, 4,4-bis(4-hydroxyphenyl)heptane, 2,4-bis( 4-hydroxyphenyl)-2-methylbutane, 2,4-bis(3,5-dimethyl-4-hydroxyphenyl)-2-methylbutane, 1,1-bis(bis(4
- Aromatic amines such as aniline, toluidine, 4-aminophenol, 4,4'-methylenediphenyldiamine, 4,4'-methylenediphenylbis(N-methyl)amine, 4,4'-[1,4-phenylenebis(1-methylethylene)]bisaniline (bisaniline P) or 4,4'-[1,3-phenylenebis(1-methyl Ethylene)] bis-aniline (bis-aniline M).
- epoxy resins are especially aliphatic or cycloaliphatic polyepoxides, especially
- N-glycidyl derivatives of amides or heterocyclic nitrogen bases such as triglycidyl cyanurate or triglycidyl isocyanurate, or reaction products of epichlorohydrin with hydantoin.
- olefins such as especially vinylcyclohexene, dicyclopentadiene, cyclohexadiene, cyclododecadiene, cyclododecatriene, isoprene, 1, 5-Hexadiene, butadiene, polybutadiene or divinylbenzene.
- the epoxy resin has the formula (II)
- substituents R' and R" are each independently H or CH 3 .
- the index s has values >1.5, especially 2-12.
- Such solid epoxy resins are commercially available, for example, from Dow or Huntsman or Hexion.
- the index s has a value less than 1.
- s has a value less than 0.2.
- the epoxy resin is a liquid epoxy resin of formula (II), more preferably an epoxy resin based on bisphenol A, bisphenol F and/or bisphenol A/F, such as bisphenol A, bisphenol Diglycidyl ether products of F and bisphenol A/F.
- liquid resins can be used, for example, as GY 250, PY 304, Available as GY 282 (Huntsman) or DER TM 331 or DER TM 330 (Dow) or Epikote 828 (Hexion).
- so-called epoxy-novolac resin (Novolac Epoxy Resin) can be used in a small amount, for example, its addition is 0-10% by weight based on the total weight of the composition, such as 1- 6% by weight.
- the proportion of epoxy resin is preferably 30-62% by weight, for example 35-59% by weight, based on the total weight of the epoxy resin composition.
- the epoxy resin composition should in particular comprise a brominated epoxy resin B) having a capping group selected from epoxy groups and tribromophenol groups.
- the bromine content in the brominated epoxy resin refers to the mass percentage of bromine element based on the average molecular weight of the brominated epoxy resin.
- the "brominated epoxy resin” refers to a product in which bromine atoms are substituted on the epoxy resin molecule in terms of molecular structure.
- the brominated epoxy resins can be considered to be brominated products of epoxy resins.
- the substitution position of the bromine atom is not particularly limited, and it may be located in the main chain or side chain or terminal of the epoxy resin.
- the "brominated epoxy resin" according to the present invention should have a capping group selected from epoxy groups and tribromophenol groups.
- the tribromophenol can react with the epoxy group at the end of the epoxy resin to form a capping group in the form of an ether oxygen linked tribromophenoxy group.
- the epoxy resin A) and the brominated epoxy resin B) can have the same or different epoxy resin matrix. Accordingly, those epoxy resins described above and their preferred forms also apply to the epoxy resins on which the brominated epoxy resins are based, for example having the matrix structure of formula (II) above.
- the brominated epoxy resin according to the invention is a brominated epoxy resin based on bisphenol A, bisphenol F and/or bisphenol A/F epoxy resins as described above.
- brominated epoxy resins meeting the definition of the present invention include, for example:
- n is greater than or equal to 0, such as >0.2, >1, >1.5 or such as 2-12.
- Brominated epoxy resins suitable for the present invention are commercially available, such as ICL F2000 series brominated epoxy polymers (F-2016, F-2100, F-2400, etc.) or Dow D.E.R 542 or NPEB 400, etc.
- brominated epoxy resins can not only provide good flame retardancy in the flame retardant epoxy resin composition according to the present invention
- Epoxy resins have better compatibility and can also maintain or improve the mechanical properties of cured epoxy resins.
- the brominated epoxy resin of the present invention has better compatibility, and there is no thinning out or delamination problem;
- the brominated epoxy resin of the present invention can lead to better mechanical properties of the epoxy resin after curing, and maintain the glass transition temperature of the epoxy resin.
- the epoxy resin composition according to the present invention may comprise less than 1% by weight, such as 0.5% by weight or even no brominated epoxy resin, based on the total weight of the composition.
- Other brominated compounds especially those commonly used as flame retardants or flame retardant substances.
- the bromine content of the brominated epoxy resin is greater than or equal to 48%, such as in the range of 48-60%. If the bromine content is too low, less than 48%, the desired flame retardant properties may not be obtained, and in order to meet the flame retardant properties, the brominated epoxy resin content in the formulation may have to be increased too high.
- the bromine content is defined as the proportion of elemental bromine to the total weight of the brominated epoxy resin.
- the content of brominated epoxy resin should be 16-30% by weight, preferably 18-28% by weight, for example 20-25% by weight. If the content of brominated epoxy resin is too low, the expected qualified flame retardant properties cannot be obtained, although it is possible to compensate for the flame retardant properties by increasing the amount of organophosphorus flame retardants, but this will lead to a significant decrease in mechanical properties. If the level of brominated epoxy resin is too high, it may cause excessive viscosity and affect workability.
- the epoxy resin of the present invention must also contain an organic phosphorus flame retardant.
- Organophosphorus flame retardants are known per se, which, when heated, promote the generation of a more structurally stable crosslinked solid mass or carbonized layer, thereby inhibiting combustion and further pyrolysis of the polymer.
- Organophosphorus flame retardants usually include various phosphates, phosphites, pyrophosphates, phosphonates, phosphonites, organic phosphorus salts, phosphorus-containing heterocyclic compounds, and poly(poly)phosphates or phosphonates, etc. .
- organophosphorous flame retardants include ammonium phosphate ((NH 4 ) 3 PO 4 ), ammonium polyphosphate, melamine phosphate, melamine pyrophosphate, triphenyl phosphate, diphenyl cresyl phosphate, tricresyl phosphate , trimethyl phosphate, triethyl phosphate, tris(2-ethylhexyl) phosphate, trioctyl phosphate, dimethyl methyl phosphate, diethyl ethyl phosphate, mono-, di- and tri-phosphate -(isopropylphenyl) ester, resorcinol-bis-(diphenyl phosphate), resorcinol diphosphate oligomer, tetraphenyl-resorcinol diphosphate, ethylene diphosphate Amine diphosphate, bisphenol A-bis-(diphenyl phosphate), tris(2-chloroethyl)
- the organic phosphorus flame retardant is selected from trimethyl phosphate, triethyl phosphate, tris (2-chloroethyl) phosphate, tris (2,3-dichloropropyl) phosphoric acid ester, tris(1,3-dichloro-2-propanyl)phosphate, tris(2,3-dibromopropyl)phosphate, and/or bis(2,3-dibromopropyl)dichloropropane base phosphate.
- the content of the organic phosphorus flame retardant is important in the epoxy resin composition of the present invention. If the content of the organic phosphorus flame retardant exceeds 25% by weight, the mechanical properties of the epoxy resin composition will be greatly reduced, and at the same time at long-term ambient temperature, it will also easily cause the slow migration of the organic phosphorus; and if the content of the organic phosphorus flame retardant Below 10%, it may weaken the flame retardant performance of the system. In one embodiment, the content of the organophosphorus flame retardant may be 12-20% by weight.
- flame retardants such as nitrogen-based flame retardants or phosphorus-nitrogen flame retardants are also possible, it is preferred that no other types of flame retardants, especially inorganic flame retardants, be included in the composition of the present invention. agent. From the point of view of the vacuum infusion process, the absence of inorganic flame retardants is beneficial as they are detrimental to incorporation into the web and detrimental to the low viscosity requirement of the process due to their high tendency to settle.
- the epoxy resin composition can additionally comprise at least one reactive diluent for the epoxy resin.
- This reactive diluent is used to control and reduce the viscosity of the epoxy resin curing system, and those skilled in the art know how to select a suitable reactive diluent for the selected epoxy resin.
- Alcohol glycidyl ethers such as butanol glycidyl ether, hexanol glycidyl ether, 2-ethyl alcohol Hexyl alcohol glycidyl ether, allyl glycidyl ether, tetrahydrofurfuryl and furfuryl glycidyl ether, trimethoxysilyl glycidyl ether, etc.;
- glycidyl ethers of difunctional saturated or unsaturated, branched or linear, cyclic or open-chain aliphatic C2 - C30 alcohols, such as ethylene glycol glycidyl ether, butanediol glycidyl ether, hexyl Glycol glycidyl ether, caprylyl glycol glycidyl ether, cyclohexanedimethanol diglycidyl ether, neopentyl glycol diglycidyl ether, etc.;
- - glycidyl ethers of trifunctional or polyfunctional, saturated or unsaturated, branched or unbranched, cyclic or open-chain alcohols such as epoxidized castor oil, epoxidized trimethylolpropane, epoxidized Polyglycidyl ethers of pentaerythritol or aliphatic polyols such as sorbitol, glycerin, trimethylolpropane, etc.;
- - glycidyl ethers of phenolic and aniline compounds such as phenyl glycidyl ether, cresol glycidyl ether, resorcinol diglycidyl ether, p-tert-butylphenyl glycidyl ether, nonylphenol glycidyl ether, 3-pentadecenyl glycidyl ether (from cashew nut shell oil), N,N-diglycidyl aniline, etc.;
- -epoxidized amines such as N,N-diglycidylcyclohexylamine, etc.
- Epoxidized mono- or dicarboxylic acids such as glycidyl neodecanoate, glycidyl methacrylate, glycidyl benzoate, diglycidyl phthalate, diglycidyl tetrahydrophthalate Glycerides and diglycidyl hexahydrophthalate, diglycidyl esters of dimer fatty acids, etc.;
- hexanediol diglycidyl ether cresol glycidyl ether, p-tert-butylphenyl glycidyl ether, polypropylene glycol diglycidyl ether and polyethylene glycol diglycidyl ether.
- the total proportion of reactive diluents for the epoxy resin may advantageously be >0-30%, such as 1-30% or 5-25%, based on the total weight of the epoxy resin composition.
- compositions according to the invention also preferably contain at least one curing agent for epoxy resins.
- curing agent for epoxy resins.
- Common and known compounds that react with epoxy groups can be used as curing agents.
- the curing agent is preferably a basic curing agent, especially an amine compound or an amide.
- the curing agent contains at least two primary or secondary amino groups per molecule.
- Amine compounds having two or more amino groups per molecule are hereinafter referred to as "polyamines". If the polyamines are polymers, they contain on average at least two amino groups per molecule.
- mixtures of different curing agents may be used, for example mixtures of two, three or more different curing agents.
- the curing agent contains at least one polyamine, preferably selected from aliphatic, cycloaliphatic or araliphatic primary diamines, triamines and tetraamines, having more than 4 polyamines per molecule Amino-based polyamines, secondary amino-containing polyamines, amine/polyepoxide adducts, poly(ethyleneimine), polyamidoamines, polyetheramines and amino-terminated butadiene/acrylonitrile copolymers thing.
- polyamine preferably selected from aliphatic, cycloaliphatic or araliphatic primary diamines, triamines and tetraamines, having more than 4 polyamines per molecule Amino-based polyamines, secondary amino-containing polyamines, amine/polyepoxide adducts, poly(ethyleneimine), polyamidoamines, polyetheramines and amino-terminated butadiene/acrylonitrile copolymers thing.
- Polyamines are also polyoxyalkylene diamines with molecular weights below 500 g/mol ( D-230, Jeffamine D400, EDR-148), 4,7,10-trioxatridecane-1-13-diamine, 4,9-dioxadodecane-1,12-diamine, ethylenediamine and/or 3 (4),8(9)-bis-(aminomethyl)-tricyclo[5.2.1.02,6]decane (TCD manufactured by Celanese Chemicals).
- polyamines suitable as curing agents are, for example:
- aliphatic, cycloaliphatic or araliphatic primary diamines such as ethylenediamine, 1,2-propylenediamine, 1,3-propylenediamine, 2-methyl-1,2-propylenediamine, 2,2-Dimethyl-1,3-propanediamine, 1,3-butanediamine, 1,4-butanediamine, 1,3-pentanediamine (DAMP), 1,5-pentanediamine , 1,5-diamino-2-methylpentane (MPMD), 2-butyl-2-ethyl-1,5-pentanediamine (C11-new diamine), 1,6-hexanediamine, 2,5-Dimethyl-1,6-hexanediamine, 2,2,4- and 2,4,4-trimethylhexamethylenediamine (TMD), 1,7-heptanediamine , 1,8-octanediamine, 1,9-nonanediamine, 1,10-decanediamine, 1,11-undecanediamine, 1,12-
- ether groups e.g. bis-(2-aminoethyl)-ether, 3,6-dioxaoctane-1,8-diamine, 4,7-dioxadecane -1,10-diamine, 4,7-dioxadecane-2,9-diamine, 4,9-dioxadodecane-1,12-diamine, 5,8-dioxa Dodecane-3,10-diamine, 4,7,10-trioxatridecane-1,13-diamine and higher oligomers of these diamines, bis-(3-aminopropyl)- Polytetrahydrofuran and other polytetrahydrofuran diamines and polyoxyalkylene diamines having a molecular weight of, for example, 350-2000.
- polyoxyalkylene glycols are generally products from the amination of polyoxyalkylene glycols and can be named, for example (Huntsman), under the name polyether amine (from BASF) or under the name PC (from Nitroil).
- Particularly suitable polyoxyalkylene diamines are D-230, D-400, D-2000, XTJ-511, ED-600, ED-900, ED-2003, XTJ-568, XTJ-569, XTJ-523, XTJ-536, XTJ-542, XTJ-559, EDR-104, EDR-148, EDR-176; polyether amine D 230, polyether amine D 400 and polyether amine D 2000, PC DA 250, PC DA 400, PC DA 650 and PC DA 2000;
- polyamines containing secondary amino groups for example, diethylenetriamine (DETA), N,N-bis-(2-aminoethyl)-ethylenediamine, dipropylenetriamine (DPTA), Bis-hexamethylenetriamine (BHMT), 3-(2-aminoethyl)-aminopropylamine, triethylenetetramine, tetraethylenepentamine, N3-(3-aminopentyl)- 1,3-pentanediamine, N5-(3-aminopropyl)-2-methyl-1,5-pentanediamine, N5-(3-amino-1-ethylpropyl)-2-methyl -1,5-pentanediamine, N,N'-dibutylethylenediamine;N,N'-di-tert-butylethylenediamine,N,N'-diethyl-1,6 -Hexanediamine, 1-(1-methylethylamino)-3-(1-(1
- - amine/polyepoxide adducts in particular adducts of the aforementioned polyamines to diepoxides in a molar ratio of at least 2/1, in particular in a molar ratio of 2/1 to 10/1;
- polyamidoamines which are reaction products of mono- or polycarboxylic acids or their esters or anhydrides, especially dimerized fatty acids, with aliphatic, cycloaliphatic or aromatic polyamines used in stoichiometric excess, especially poly Alkyleneamines such as DETA or triethylenetetramine (TETA), especially commercially available polyamidoamines 100, 125, 140 and 150 (from Cognis), 125, 140, 223, 250 and 848 (from Huntsman), 3607, 530 (from Huntsman), EH 651, EH 654, EH 655, EH 661 and EH 663 (from Cytec);
- PEI Polyethyleneimine
- Suitable polyethyleneimines generally have an average molecular weight of 250 to 25 000 g/mol and contain tertiary, secondary and primary amino groups.
- Polyethyleneimine for example available under the trade name (from BASF), e.g. WF, FG, G20 and PR 8515 obtained.
- Acidic curing agents can also be used as curing agents, especially acid anhydrides.
- Catalytically active curing agents such as fluorides, eg boron trifluoride, may also be used.
- the ratio of the curing agent component to the epoxy resin component can be determined according to the equivalent weight and stoichiometric ratio of their reactive groups participating in the curing reaction.
- the epoxy resin composition is formulated such that the content of the curing agent is 0.5-15 wt%, preferably 1-10 wt%, based on the total weight of the epoxy resin composition.
- the epoxy resin composition according to the invention may comprise one or more other additives, especially catalysts, stabilizers, especially heat and/or light stabilizers, thixotropic agents, plasticizers, solvents, mineral or organic fillers, Foaming agents, dyes and pigments, preservatives, surfactants, defoamers and adhesion promoters.
- additives especially catalysts, stabilizers, especially heat and/or light stabilizers, thixotropic agents, plasticizers, solvents, mineral or organic fillers, Foaming agents, dyes and pigments, preservatives, surfactants, defoamers and adhesion promoters.
- Suitable as plasticizers are especially phenol alkylsulfonates or benzenesulfonic acid-N-butylamide, as available from Bayer as or those commercially available from Dellatol BBS.
- Suitable as stabilizers are especially optionally substituted phenols such as BHT or T (Elikem), sterically hindered amines or N-oxyl compounds such as TEMPO (Evonik).
- adhesion promoters suitable are for example organoalkoxysilanes such as 3-glycidoxypropyltrimethoxysilane, 3-aminopropyl-trimethoxysilane, N-(2-aminoethyl)-3 -Aminopropyl-trimethoxysilane, N-(2-aminoethyl)-N'-[3-(trimethoxysilyl)-propyl]-ethylenediamine, 3-ureidopropyltrimethyl oxysilane, 3-chloropropyltrimethoxysilane, vinyltrimethoxysilane, or the corresponding organosilanes with ethoxy or (poly)etheroxy groups instead of methoxy groups.
- organoalkoxysilanes such as 3-glycidoxypropyltrimethoxysilane, 3-aminopropyl-trimethoxysilane, N-(2-aminoethyl)-3 -Amin
- the epoxy resin compositions according to the invention can be provided as two-component systems.
- the composition comprises two separate components.
- the components are stored separately in separate containers such as cartridges, buckets, cartridges, sachets or bags to avoid spontaneous reactions.
- the components are combined with each other.
- the curing reaction begins, allowing the composition to be processed within the open time after mixing the components.
- the epoxy resin compositions are often supplied to users as two-component systems.
- the epoxy resin and the curing agent are often contained in different components, so that the curing reaction can only take place when the user mixes the components.
- the epoxy resin composition according to the invention is two-component, wherein the first component comprises at least said epoxy resin, brominated epoxy resin and at least a part of the organophosphorus flame retardant and optionally other additives such as reactive diluents, and the second component comprises curing agent, the remainder organophosphorus flame retardant and optional other additives.
- Another aspect of the present invention relates to the method for preparing composite material by vacuum infusion, comprising:
- the reinforcing material may be a reinforcing fiber selected from glass fiber, carbon fiber, and Kevlar fiber.
- these reinforcing materials can be laid in a mold in a certain direction, can be laid flat, or can be laid flat by rotation at a certain angle. Then, a mechanism for assisting in forming a vacuum is provided on the mold, such as a vacuum bag and a deflector net, and sealing strips are laid around it. Next, after confirming that the airtightness of the laminate is correct, a vacuum is applied by a vacuum device to introduce the epoxy resin composition of the present invention into the reinforcing material.
- the individual components of the one-component or multi-component epoxy resin composition according to the invention are homogeneously mixed, and the resin mixture can then be catheterized into the reinforcing material by means of a vacuum. Finally, the composition is cured and shaped under suitable conditions to obtain a vacuum infusion product.
- the invention also relates to products obtained from epoxy resin compositions as described above, in particular products obtained by vacuum infusion processes, such as parts in vehicles such as automobiles, trains, ships and aircraft, as well as engineering buildings or parts of household appliances.
- each prepared epoxy resin composition was tested according to the performance test method described below, and the measured results were listed in the following table.
- test spline reaches the V0 level. If it reaches the V0 level, it will be recorded as "Pass”, otherwise it will be recorded as "Fail”.
- the test of flexural strength and flexural modulus is carried out with reference to ISO 178:1993.
- the unit of flexural strength and modulus in the following table is MPa.
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- Chemical Kinetics & Catalysis (AREA)
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- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
名称/牌号 | 组成或说明 |
D.E.R.331或D.E.R.383 | 双酚A环氧树脂 |
ERISYS GE21 | 1,4-丁二醇二缩水甘油醚,反应性稀释剂 |
TBBPA | 四溴双酚A |
ICL F2016或NPEB 400 | 溴化环氧树脂 |
DEEP | 乙基磷酸二乙酯 |
TEP | 磷酸三乙酯 |
TMP | 磷酸三甲酯 |
KH570 | 偶联剂(γ-缩水甘油醚氧丙基三甲氧基硅烷) |
判断条件 | V0 |
单个样条余焰时间t1或t2 | ≤10s |
五组样条余焰时间总和 | ≤50s |
第二次施加火焰后余焰和余燃时间之和 | ≤30s |
残留样条是否仍置于紧固件 | 否 |
滴落物是否引燃棉花 | 否 |
Ex1 | Ex2 | Ex3 | Ex4 | Ref1 | Ref3 | Ref4 | Ref7 | Ref8 | Ref9 | |
混合粘度 | 300cP | 200cP | 290cP | 290cP | 1300cP | 660cP | 600cP | 285cP | 350cP | 1500cP |
UL94V0 | Pass | Pass | Pass | Pass | Fail | Fail | Fail | Pass | Fail | Pass |
弯曲强度 | 未测 | 未测 | 100 | 88 | 未测 | 未测 | 29 | 70 | 未测 | 未测 |
弯曲模量 | 未测 | 未测 | 2810 | 2760 | 未测 | 未测 | 750 | 2500 | 未测 | 未测 |
Claims (12)
- 一种阻燃环氧树脂组合物,基于组合物总重量计包含A)25~65重量%的环氧树脂,B)16~30重量%的溴化环氧树脂,所述溴化环氧树脂具有选自环氧基和三溴苯酚基的封端基团,和C)10~25重量%的有机磷阻燃剂。
- 根据权利要求1所述的阻燃环氧树脂组合物,其特征在于,所述组合物包含30-62重量%,例如35-59重量%的环氧树脂。
- 根据前述权利要求任一项所述的阻燃环氧树脂组合物,其特征在于,所述环氧树脂是芳族环氧树脂,优选是基于双酚A、双酚F和/或双酚A/F的环氧树脂,如双酚A、双酚F和双酚A/F的二缩水甘油醚。
- 根据前述权利要求任一项所述的阻燃环氧树脂组合物,其特征在于,所述溴化环氧树脂是基于双酚A、双酚F和/或双酚A/F的溴化环氧树脂。
- 根据前述权利要求任一项所述的阻燃环氧树脂组合物,其特征在于,所述溴化环氧树脂的溴含量≥48%。
- 根据前述权利要求任一项所述的阻燃环氧树脂组合物,其特征在于,所述溴化环氧树脂的含量为18-28重量%、例如20-25重量%。
- 根据前述权利要求任一项所述的阻燃环氧树脂组合物,其特征在于,所述有机磷阻燃剂选自磷酸三甲酯、磷酸三乙酯、三(2-氯乙基)磷酸酯、三(2,3-二氯丙基)磷酸酯、三(1,3-二氯-2-丙烷基)磷酸酯、 三(2,3-二溴丙基)磷酸酯、和/或双(2,3-二溴丙基)二氯丙基磷酸酯。
- 根据前述权利要求任一项所述的阻燃环氧树脂组合物,其特征在于,所述环氧树脂组合物是双组分的,其中第一组分包含至少所述环氧树脂、溴化环氧树脂和至少一部分的有机磷阻燃剂和任选的其他添加剂如反应性稀释剂,和第二组分包含固化剂、剩余部分的有机磷阻燃剂和任选的其他添加剂。
- 根据前述权利要求任一项所述的阻燃环氧树脂组合物,其特征在于,所述环氧树脂组合物还包含反应性稀释剂,其总比例为1-30%,如5-25%,基于环氧树脂组合物的总重量计。
- 一种真空灌注制备复合材料的方法,包括:a)将增强材料置于模具中;b)在模具上施加真空以形成负压;c)将根据权利要求1至9任一项的环氧树脂组合物导入模具中。
- 根据权利要求10的方法,其中所述增强材料可以是选自玻璃纤维、碳纤维、凯夫拉芳纶纤维的增强纤维。
- 根据权利要求10所述的方法制得的制品。
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EP0754728A1 (de) * | 1995-07-14 | 1997-01-22 | Hoechst Aktiengesellschaft | Flammwidrige Epoxidharz-Formmassen |
CN103627142A (zh) | 2013-11-28 | 2014-03-12 | 惠柏新材料科技(上海)有限公司 | 一种适用于真空导流的阻燃环氧树脂及其制备方法 |
US20200123309A1 (en) * | 2016-12-14 | 2020-04-23 | Bromine Compounds Ltd. | Antimony free flame-retarded epoxy compositions |
WO2020252681A1 (en) * | 2019-06-19 | 2020-12-24 | Dow Global Technologies Llc | Flame retardant composition |
CN114752183A (zh) * | 2021-11-16 | 2022-07-15 | Sika技术股份公司 | 阻燃环氧树脂组合物 |
Family Cites Families (2)
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JPH10147696A (ja) * | 1996-11-20 | 1998-06-02 | Chisso Corp | 難燃性エポキシ樹脂組成物 |
WO2021212314A1 (zh) * | 2020-04-21 | 2021-10-28 | 穗晔实业股份有限公司 | 热固性树脂组成物 |
-
2021
- 2021-11-16 CN CN202111352415.1A patent/CN114752183A/zh active Pending
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2022
- 2022-11-02 WO PCT/CN2022/129216 patent/WO2023088097A1/zh active Application Filing
- 2022-11-02 EP EP22894634.9A patent/EP4435049A1/en active Pending
- 2022-11-02 CN CN202280068304.4A patent/CN118119659A/zh active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
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EP0754728A1 (de) * | 1995-07-14 | 1997-01-22 | Hoechst Aktiengesellschaft | Flammwidrige Epoxidharz-Formmassen |
CN103627142A (zh) | 2013-11-28 | 2014-03-12 | 惠柏新材料科技(上海)有限公司 | 一种适用于真空导流的阻燃环氧树脂及其制备方法 |
US20200123309A1 (en) * | 2016-12-14 | 2020-04-23 | Bromine Compounds Ltd. | Antimony free flame-retarded epoxy compositions |
WO2020252681A1 (en) * | 2019-06-19 | 2020-12-24 | Dow Global Technologies Llc | Flame retardant composition |
CN114752183A (zh) * | 2021-11-16 | 2022-07-15 | Sika技术股份公司 | 阻燃环氧树脂组合物 |
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