WO2023085177A1 - Multilayer board - Google Patents

Multilayer board Download PDF

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Publication number
WO2023085177A1
WO2023085177A1 PCT/JP2022/040905 JP2022040905W WO2023085177A1 WO 2023085177 A1 WO2023085177 A1 WO 2023085177A1 JP 2022040905 W JP2022040905 W JP 2022040905W WO 2023085177 A1 WO2023085177 A1 WO 2023085177A1
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WO
WIPO (PCT)
Prior art keywords
conductors
linear conductors
multilayer substrate
linear
vertical direction
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PCT/JP2022/040905
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French (fr)
Japanese (ja)
Inventor
恒亮 西尾
邦明 用水
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株式会社村田製作所
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Publication of WO2023085177A1 publication Critical patent/WO2023085177A1/en

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01PWAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00Waveguides; Transmission lines of the waveguide type
    • H01P3/02Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details

Definitions

  • the present invention relates to a multilayer substrate with signal conductors.
  • the device described in Patent Document 1 is known as an invention related to conventional multilayer substrates.
  • the device includes a plurality of conductors, a plurality of first slotted stationary strips and a plurality of second slotted stationary strips.
  • the multiple conducting wires extend in the front-rear direction.
  • a plurality of first slotted stationary strips are positioned above the plurality of conductors.
  • a plurality of first slotted stationary strips extend in the left-right direction.
  • a plurality of second slotted stationary strips are positioned below the plurality of conductors.
  • a plurality of second slotted stationary strips extend in the left-right direction.
  • the plurality of second slot type immovable strips overlap the plurality of first slot type immovable strips when viewed in the vertical direction.
  • an object of the present invention is to provide a multilayer substrate capable of suppressing variations in characteristic impedance occurring in signal lines.
  • a multilayer substrate comprises A multilayer substrate, a laminate having a structure in which a plurality of insulator layers are stacked vertically; a signal conductor provided in the laminate and having a linear shape; a plurality of first linear conductors provided in the laminate, positioned above the signal conductor, and crossing the signal conductor when viewed in the vertical direction; a plurality of second linear conductors provided in the laminate, positioned below the signal conductor, and crossing the signal conductor when viewed in the vertical direction; and The plurality of second linear conductors extend along the plurality of first linear conductors when viewed in the vertical direction, Any one of the plurality of second linear conductors is provided in each of the plurality of first regions positioned between the two adjacent first linear conductors when viewed in the vertical direction.
  • any one of the plurality of first linear conductors is provided in each of the plurality of second regions positioned between the two adjacent second linear conductors when viewed in the vertical direction. at least a portion of the conductors overlap, and It has the structure (A) or (B).
  • the multilayer substrate is one or more external electrodes provided on the laminate and electrically connected to an external circuit; one or more ground conductors; It is also equipped with The plurality of first linear conductors and the plurality of second linear conductors are not DC-coupled to any of the one or more external electrodes, A section in which the signal conductor crosses the plurality of first linear conductors or the plurality of second linear conductors is defined as an intersection section, the signal conductor does not overlap the one or more ground conductors in the cross section; each of the plurality of first linear conductors overlaps a part of the one or more ground conductors when viewed in the vertical direction; Each of the plurality of second linear conductors overlaps a part of the one or more ground conductors when viewed in the vertical direction.
  • the plurality of first linear conductors and the plurality of second linear conductors are connected to a ground potential.
  • the multilayer substrate of the present invention it is possible to suppress fluctuations in characteristic impedance that occur in signal lines.
  • FIG. 1 is an exploded perspective view of a multilayer substrate 10.
  • FIG. FIG. 2 is a cross-sectional view of the multilayer substrate 10.
  • FIG. 3 is a rear view of the multilayer substrate 10 in a bent state.
  • FIG. 4 is a cross-sectional view of the multilayer substrate 10a.
  • FIG. 5 is a cross-sectional view of the multilayer substrate 10b.
  • FIG. 6 is a cross-sectional view of the multilayer substrate 10c.
  • FIG. 7 is a cross-sectional view of the multilayer substrate 10d.
  • FIG. 8 is a cross-sectional view of the multilayer substrate 10e.
  • FIG. 9 is a cross-sectional view of the multilayer substrate 10f.
  • FIG. 10 is an exploded perspective view of the multilayer substrate 10g.
  • FIG. 11 is an exploded perspective view of the multilayer substrate 10h.
  • FIG. 12 is an exploded perspective view of the multilayer substrate 10i.
  • FIG. 13 is an exploded perspective view of the multilayer substrate 10j.
  • FIG. 14 is an exploded perspective view of the multilayer substrate 10k.
  • FIG. 15 is an exploded perspective view of the multilayer substrate 10l.
  • FIG. 16 is an exploded perspective view of the multilayer substrate 10m.
  • FIG. 1 is an exploded perspective view of a multilayer substrate 10.
  • FIG. FIG. 2 is a cross-sectional view of the multilayer substrate 10. As shown in FIG. In FIGS. 1 and 2, only representative first linear conductors 26 and representative second linear conductors 28 among the plurality of first linear conductors 26 and the plurality of second linear conductors 28 are denoted by reference numerals. attached.
  • FIG. 3 is a rear view of the multilayer substrate 10 in a bent state.
  • the stacking direction of the laminate 12 of the multilayer substrate 10 is the vertical direction. Further, the direction in which the signal conductors 20 of the multilayer substrate 10 extend is the left-right direction. Further, the line width direction of the signal conductors 20 of the multilayer substrate 10 is the front-rear direction. In this specification, the line width direction is a direction orthogonal to the direction in which the conductor extends when viewed in the vertical direction. The up-down direction, the front-rear direction, and the left-right direction are orthogonal to each other. The vertical direction, the front-rear direction, and the left-right direction in this specification do not have to correspond to the vertical direction, the front-rear direction, and the left-right direction when the multilayer substrate 10 is actually used.
  • X to Z are members or parts that constitute the multilayer substrate 10 .
  • X and Y are electrically connected means that electricity can be conducted between X and Y. Therefore, X and Y may be in contact, or X and Y may not be in contact. If X and Y are not in contact, a conductive Z is placed between X and Y.
  • X and Y are connected means that X and Y are connected while being in contact with each other.
  • X is a part or member of the multilayer substrate 10.
  • each part of X is defined as follows.
  • front of X is meant the front half of X.
  • Back of X means the back half of X.
  • the left part of X means the left half of X.
  • the right part of X means the right half of X.
  • Top of X means the top half of X.
  • the lower part of X means the lower half of X.
  • the leading edge of X means the leading edge of X.
  • the trailing end of X means the trailing end of X.
  • the left end of X means the end of X in the left direction.
  • the right end of X means the end of X in the right direction.
  • the upper end of X means the end of X in the upward direction.
  • the lower end of X means the lower end of X.
  • the front end of X means the front end of X and its vicinity.
  • the rear end of X means the rear end of X and its vicinity.
  • the left end of X means the left end of X and its vicinity.
  • the right end of X means the right end of X and its vicinity.
  • the upper end of X means the upper end of X and its vicinity.
  • the lower end of X means the lower end of X and its vicinity.
  • the state that X extends along Y includes the state in which X is parallel to Y and the state in which X is slightly inclined with respect to Y.
  • the state that X extends in the left-right direction includes the state in which X is parallel to the left-right direction and the state in which X is slightly inclined with respect to the left-right direction.
  • “Slightly tilted” means that X is tilted within a range of ⁇ 10 degrees with respect to the Y axis or the horizontal direction. The same applies to directions other than the left-right direction.
  • the multilayer substrate 10 transmits high frequency signals.
  • a multilayer substrate 10 is used to electrically connect two circuits in an electronic device such as a smart phone.
  • the multilayer substrate 10 has a strip shape extending in the left-right direction.
  • the multilayer substrate 10 includes a laminate 12, a signal conductor 20, first ground conductors 22a and 22b, ground conductors 24a, 24b, 25a and 25b, a plurality of first linear conductors 26, and a plurality of second ground conductors 22a and 22b. It has two linear conductors 28, external electrodes 30a, 30b, 32a, 32b, 34a, 34b and interlayer connection conductors v1 to v6.
  • the laminate 12 has a plate shape, as shown in FIG. Therefore, the laminated body 12 has an upper principal surface and a lower principal surface which are aligned in the vertical direction. Moreover, as shown in FIG. 1, the laminated body 12 has a structure in which a protective layer 16 and insulating layers 14a to 14e are laminated vertically. The protective layer 16 and the insulator layers 14a to 14e are arranged in this order from top to bottom. The insulator layers 14a to 14e have the same strip shape as the laminate 12 when viewed in the vertical direction. The insulator layers 14a-14e are flexible dielectric sheets. The material of the insulator layers 14a to 14e is resin. In this embodiment, the material of the insulator layers 14a to 14e is thermoplastic resin.
  • thermoplastic resin is, for example, liquid crystal polymer, PTFE (polytetrafluoroethylene), or the like.
  • the material of the insulator layers 14a to 14e may be polyimide. Thereby, the laminated body 12 has flexibility.
  • the signal conductor 20 is provided on the laminate 12 as shown in FIG. More specifically, signal conductor 20 is located on the upper major surface of insulator layer 14c.
  • the signal conductor 20 has a linear shape.
  • the signal conductor 20 extends in the left-right direction.
  • the external electrodes 30a, 30b, 32a, 32b, 34a, 34b are electrically connected to an external circuit (not shown).
  • the external circuit is an electric circuit provided outside the multilayer substrate 10 .
  • the external electrodes 30 a , 30 b , 32 a , 32 b , 34 a and 34 b are provided on the laminate 12 . More specifically, the external electrodes 30a, 32a, 34a are located near the left end of the upper main surface of the insulator layer 14a.
  • the external electrodes 32a, 30a, 34a are arranged in this order from front to back.
  • the external electrodes 30b, 32b, 34b are located near the right end of the upper main surface of the insulator layer 14a.
  • the external electrodes 32b, 30b, 34b are arranged in this order from front to back.
  • the external electrodes 30a, 30b, 32a, 32b, 34a, 34b have a rectangular shape when viewed in the vertical direction.
  • Connectors (not shown) are soldered to the external electrodes 30a, 30b, 32a, 32b, 34a, and 34b. This connector is connected to a connector on a circuit board (not shown). Thereby, the multilayer board 10 and the circuit board (not shown) are electrically connected. Note that the multilayer board 10 may be connected to the circuit board by surface mounting without using a connector.
  • the interlayer connection conductor v1 penetrates the insulator layers 14a and 14b in the vertical direction.
  • the interlayer connection conductor v 1 electrically connects the external electrode 30 a and the left end of the signal conductor 20 .
  • the interlayer connection conductor v2 penetrates the insulator layers 14a and 14b in the vertical direction.
  • the interlayer connection conductor v2 electrically connects the external electrode 30b and the right end of the signal conductor 20 .
  • the plurality of first linear conductors 26 are provided on the laminate 12 as shown in FIG. More specifically, the plurality of first linear conductors 26 are positioned above the signal conductors 20 . The plurality of first linear conductors 26 are provided at the same position in the vertical direction. In this embodiment, the plurality of first linear conductors 26 are located on the upper main surface of the insulator layer 14b. The multiple first linear conductors 26 have a linear shape. The plurality of first linear conductors 26 intersect the signal conductors 20 when viewed in the vertical direction. In this embodiment, the plurality of first linear conductors 26 extend in the front-rear direction. Therefore, the plurality of first linear conductors 26 are orthogonal to the signal conductors 20 when viewed in the vertical direction. The plurality of first linear conductors 26 as described above are arranged in the direction in which the signal conductors 20 extend.
  • the plurality of second linear conductors 28 are provided on the laminate 12 as shown in FIG. More specifically, the plurality of second linear conductors 28 are positioned below the signal conductors 20 . The plurality of second linear conductors 28 are provided at the same position in the vertical direction. In this embodiment, the plurality of second linear conductors 28 are located on the upper main surface of the insulator layer 14d. The plurality of second linear conductors 28 have a linear shape. The plurality of second linear conductors 28 intersect the signal conductors 20 when viewed in the vertical direction. In this embodiment, the plurality of second linear conductors 28 extend in the front-rear direction.
  • the plurality of second linear conductors 28 are perpendicular to the signal conductors 20 when viewed in the vertical direction. Also, the plurality of second linear conductors 28 extend along the plurality of first linear conductors 26 when viewed in the vertical direction. In this embodiment, the plurality of second linear conductors 28 are parallel to the plurality of first linear conductors 26 when viewed in the vertical direction. The plurality of second linear conductors 28 as described above are arranged in the direction in which the signal conductors 20 extend.
  • the plurality of first linear conductors 26 and the plurality of second linear conductors 28 are floating conductors.
  • the potential of the floating conductor is the floating potential.
  • the floating conductor is not connected to ground potential and power supply potential. Therefore, the plurality of first linear conductors 26 and the plurality of second linear conductors 28 are DC-coupled to none of the external electrodes 30a, 30b, 32a, 32b, 34a, 34b. More precisely, the plurality of first linear conductors 26 and the plurality of second linear conductors 28 are not DC-coupled to any external electrodes provided on the multilayer substrate 10 .
  • Two conductors are not galvanically coupled means that no direct current can flow between the two conductors.
  • High-frequency signals are input to and output from the external electrodes 30a and 30b as described above.
  • the external electrodes 32a, 32b, 34a, 34b are connected to ground potential.
  • a plurality of regions located between two adjacent first linear conductors 26 are defined as a plurality of first regions A1.
  • a plurality of regions located between two adjacent second linear conductors 28 are defined as a plurality of second regions A2.
  • Each of the plurality of first regions A1 and the plurality of second regions A2 has a rectangular shape.
  • the plurality of first regions A1, the plurality of second regions A2, the plurality of first linear conductors 26, and the plurality of second linear conductors 28 have the same shape when viewed in the vertical direction.
  • the line width W1 of the plurality of first linear conductors 26 is half the period T1 of the arrangement of the plurality of first linear conductors 26.
  • the line width W2 of the plurality of second linear conductors 28 is half the period T2 of the arrangement of the plurality of second linear conductors 28 .
  • the line width W1 is equal to the line width W2.
  • Period T1 is equal to period T2.
  • At least a portion of one of the plurality of second linear conductors 28 overlaps with each of the plurality of first regions A1 when viewed in the vertical direction.
  • at least a portion of any one of the plurality of first linear conductors 26 overlaps with each of the plurality of second regions A2.
  • the plurality of first linear conductors 26 and the plurality of second linear conductors 28 are arranged alternately in the direction in which the signal conductors 20 extend when viewed in the vertical direction.
  • the centers C1 in the line width direction of the plurality of first linear conductors 26 do not overlap the centers C2 in the line width direction of the plurality of second linear conductors 28, respectively.
  • the horizontal direction is the line width direction of the first linear conductor 26 or the line width direction of the second linear conductor 28 .
  • the center C1 in the line width direction of the plurality of first linear conductors 26 overlaps the center C12 in the line width direction of the plurality of second regions A2.
  • Each of the centers C2 in the line width direction of the plurality of second linear conductors 28 overlaps the centers C11 in the line width direction of the plurality of first regions A1.
  • the plurality of first linear conductors 26 are adjacent to each other so as to be in contact with the second linear conductors 28 located on the left and the second linear conductors 28 located on the right.
  • the plurality of second linear conductors 28 are adjacent to each other so as to be in contact with the first linear conductor 26 located on the left and the first linear conductor 26 located on the right.
  • the multiple first linear conductors 26 do not overlap the multiple second linear conductors 28 when viewed in the vertical direction.
  • the plurality of first linear conductors 26 and the plurality of second linear conductors 28 are provided at different positions in the vertical direction. Therefore, the plurality of first linear conductors 26 and the plurality of second linear conductors 28 are not actually in contact with each other.
  • the section where the signal conductor 20 intersects the plurality of first linear conductors 26 or the plurality of second linear conductors 28 is defined as an intersection section A22.
  • sections in which the signal conductor 20 does not cross the plurality of first linear conductors 26 and the plurality of second linear conductors 28 are defined as non-crossing sections A21 and A23.
  • the non-crossing section A21, the crossing section A22, and the non-crossing section A23 are arranged in this order from left to right.
  • the line width w2 of the signal conductor 20 in the crossing section A22 is thicker than the line width w1 of the signal conductor 20 in the non-crossing section A21 and the line width w3 of the signal conductor 20 in the non-crossing section A23.
  • the ground conductor 24a is provided on the laminate 12 as shown in FIG. More specifically, the ground conductor 24a is provided near the left end of the upper main surface of the insulator layer 14a. Therefore, the ground conductor 24a is located in the non-intersecting section A21.
  • the ground conductor 24a has a rectangular shape when viewed in the vertical direction by being combined with the external electrodes 32a and 34a.
  • the ground conductor 24 a is positioned above the signal conductor 20 .
  • the ground conductor 24a overlaps the signal conductor 20 in the non-intersecting section A21 when viewed in the vertical direction. However, the ground conductor 24a does not overlap the plurality of first linear conductors 26 and the plurality of second linear conductors 28 when viewed in the vertical direction.
  • the ground conductor 24b is provided on the laminate 12 as shown in FIG. More specifically, the ground conductor 24b is provided near the right end of the upper main surface of the insulator layer 14a. Therefore, the ground conductor 24b is located in the non-intersecting section A23.
  • the ground conductor 24b is combined with the external electrodes 32b, 34b to have a rectangular shape when viewed in the vertical direction.
  • the ground conductor 24b is located above the signal conductor 20. As shown in FIG.
  • the ground conductor 24b overlaps the signal conductor 20 in the non-crossing section A23 when viewed in the vertical direction. However, the ground conductor 24b does not overlap the plurality of first linear conductors 26 and the plurality of second linear conductors 28 when viewed in the vertical direction.
  • the ground conductor 25a is provided on the laminate 12 as shown in FIG. More specifically, the ground conductor 25a is provided near the left end of the upper main surface of the insulator layer 14e. Therefore, the ground conductor 25a is located in the non-intersecting section A21.
  • the ground conductor 25a has a rectangular shape when viewed in the vertical direction.
  • the ground conductor 25 a is positioned below the signal conductor 20 .
  • the ground conductor 25a overlaps the signal conductor 20 in the non-intersecting section A21 when viewed in the vertical direction. However, the ground conductor 25a does not overlap the plurality of first linear conductors 26 and the plurality of second linear conductors 28 when viewed in the vertical direction.
  • the ground conductor 25b is provided on the laminate 12 as shown in FIG. More specifically, the ground conductor 25b is provided near the right end of the upper main surface of the insulator layer 14e. Therefore, the ground conductor 25b is located in the non-intersecting section A23.
  • the ground conductor 25b has a rectangular shape when viewed in the vertical direction.
  • the ground conductor 25b is positioned below the signal conductor 20 .
  • the ground conductor 25b overlaps the signal conductor 20 in the non-intersecting section A23 when viewed in the vertical direction.
  • the ground conductor 25b does not overlap the plurality of first linear conductors 26 and the plurality of second linear conductors 28 when viewed in the vertical direction.
  • the signal conductor 20 and the ground conductors 24a and 25a as described above have a stripline structure.
  • the signal conductor 20 and the ground conductors 24b and 25b have a stripline structure.
  • the first ground conductors 22a and 22b are provided on the laminate 12 as shown in FIG. More specifically, the first ground conductors 22a and 22b are provided at the same position as the signal conductor 20 in the vertical direction. In this embodiment, the first ground conductors 22a and 22b are located on the upper main surface of the insulator layer 14c. Therefore, the first ground conductors 22a and 22b do not overlap the signal conductor 20 when viewed in the vertical direction.
  • the first ground conductors 22a, 22b have a linear shape.
  • the first ground conductors 22a, 22b extend in the left-right direction. Therefore, the first ground conductors 22a and 22b extend along the signal conductor 20 when viewed in the vertical direction.
  • first ground conductors 22a and 22b are parallel to the signal conductor 20 when viewed in the vertical direction.
  • the first ground conductor 22 a is positioned in front of the signal conductor 20 .
  • a first ground conductor 22b is positioned after the signal conductor 20 .
  • the signal conductor 20 is arranged in the intersecting section A22 such that the first ground conductors 22a, 22b, the ground conductors 24a, 24b, 25a, 25b (one or more ground conductors) do not overlap. That is, the signal conductor 20 does not overlap any of the ground conductors provided in the multilayer substrate 10 in the intersection section A22.
  • each of the plurality of first linear conductors 26 overlaps the first ground conductors 22a and 22b (a part of the one or more ground conductors) when viewed in the vertical direction. More specifically, each of the front portions of the plurality of first linear conductors 26 overlaps the first ground conductor 22a when viewed in the vertical direction. Each rear portion of the plurality of first linear conductors 26 overlaps the first ground conductor 22b when viewed in the vertical direction.
  • Each of the plurality of second linear conductors 28 overlaps the first ground conductors 22a and 22b (partial ground conductors among one or more ground conductors) when viewed in the vertical direction. More specifically, each of the front portions of the plurality of second linear conductors 28 overlaps the first ground conductor 22a when viewed in the vertical direction. Each rear portion of the plurality of second linear conductors 28 overlaps the first ground conductor 22b when viewed in the vertical direction.
  • the first ground conductors 22a and 22b are positioned between the plurality of first linear conductors 26 and the plurality of second linear conductors 28 in the vertical direction.
  • the first ground conductors 22a, 22b and the plurality of first linear conductors 26 among the first ground conductors 22a, 22b and the ground conductors 24a, 24b, 25a, 25b one or more ground conductors
  • a ground conductor that overlaps the plurality of second linear conductors 28 are positioned between the plurality of first linear conductors 26 and the plurality of second linear conductors 28 in the vertical direction.
  • the interlayer connection conductor v3 penetrates the insulator layers 14a to 14d in the vertical direction.
  • the interlayer connection conductor v3 electrically connects the external electrode 32a, the left end of the first ground conductor 22a, and the ground conductors 24a and 25a.
  • the interlayer connection conductor v4 penetrates the insulator layers 14a to 14d in the vertical direction.
  • the interlayer connection conductor v4 electrically connects the external electrode 34a, the left end of the first ground conductor 22b, and the ground conductors 24a and 25a.
  • the interlayer connection conductor v5 penetrates the insulator layers 14a to 14d in the vertical direction.
  • the interlayer connection conductor v5 electrically connects the external electrode 32b, the right end portion of the first ground conductor 22a, and the ground conductors 24b and 25b.
  • the interlayer connection conductor v6 penetrates the insulator layers 14a to 14d in the vertical direction.
  • the interlayer connection conductor v6 electrically connects the external electrode 34b, the right end of the first ground conductor 22b, and the ground conductors 24a and 25a.
  • the protective layer 16 is an insulator layer provided on the upper main surface of the insulator layer 14a.
  • the protective layer 16 covers substantially the entire surface of the insulator layer 14a and substantially the entire surfaces of the ground conductors 24a and 24b. However, openings ha to hf are provided in protective layer 16 .
  • Each of the external electrodes 30a, 32a, 34a, 30b, 32b, 34b is exposed to the outside of the multilayer substrate 10 through openings ha to hf.
  • the protective layer 16 is a resist applied to the upper main surface of the insulator layer 14a. However, the protective layer 16 may be a coverlay applied over the insulator layer 14a.
  • a signal conductor 20, first ground conductors 22a, 22b, ground conductors 24a, 24b, 25a, 25b, a plurality of first linear conductors 26, a plurality of second linear conductors 28, and external electrodes 30a, 30b, 32a, 32b, 34a and 34b are conductor layers formed by patterning a metal foil attached to the main surface of the insulator layer.
  • the metal foil is, for example, copper foil.
  • the interlayer connection conductors v1 to v6 are formed by filling conductive paste into through-holes penetrating the insulator layers and solidifying the conductive paste by heating.
  • the multilayer substrate 10 can be used by being bent. Bending the multilayer substrate 10 means deforming the multilayer substrate 10 by applying an external force to the multilayer substrate 10 .
  • the deformation may be elastic deformation, plastic deformation, or both elastic deformation and plastic deformation.
  • the multilayer substrate 10 has a first section A11, a second section A12, and a third section A13, as shown in FIG.
  • the first section A11 and the third section A13 are sections in which the multilayer substrate 10 is not bent.
  • the second section A12 is a section where the multilayer substrate 10 is bent. Therefore, the second section A12 is bent in the Z-axis direction with respect to the first section A11 so that the radius of curvature of the second section A12 is smaller than the radius of curvature of the first section A11 and the radius of curvature of the third section A13.
  • the Z-axis direction is the vertical direction in the first section A11.
  • the positive direction of the Z-axis is the upward direction in the first section A11.
  • the negative direction of the Z-axis is the downward direction in the first section A11.
  • the second section A12 is bent in the positive direction of the Z-axis with respect to the first section A11.
  • the intersection section A22 is located in the second section A12. The intersection section A22 does not protrude from the second section A12. In this embodiment, the intersection section A22 coincides with the second section A12.
  • the plurality of first linear conductors 26 and the plurality of second linear conductors 28 cross the signal conductors 20 when viewed vertically, and extend along each other when viewed vertically. there is Each of the plurality of first linear conductors 26 overlaps the first ground conductors 22a and 22b when viewed in the vertical direction. Moreover, each of the plurality of second linear conductors 28 overlaps the first ground conductors 22a and 22b when viewed in the vertical direction. Thereby, the signal conductor 20 is coupled to the ground conductor via the plurality of first linear conductors 26 and the plurality of second linear conductors 28 .
  • the characteristic impedance generated in the section of the signal conductor 20 overlapping with the plurality of first linear conductors 26 and the characteristic impedance generated in the section of the signal conductor 20 overlapping with the plurality of second linear conductors 28 are , approaches a given characteristic impedance (eg, 50 ⁇ ).
  • the section of the signal conductor 20 overlapping the plurality of first linear conductors 26 and the section overlapping the plurality of second linear conductors 28 of the signal conductor 20 are far apart in the horizontal direction. , the section in which the signal conductor 20 is not coupled to the ground conductor increases.
  • the characteristic impedance of the section where the signal conductor 20 is not coupled with the ground conductor tends to be higher than the characteristic impedance of the section where the signal conductor 20 is coupled with the ground conductor.
  • the characteristic impedance generated in the signal conductor 20 tends to fluctuate.
  • each of the plurality of first regions A1 located between the two adjacent first linear conductors 26 has one of the plurality of second linear conductors 28. At least a portion of any one second linear conductor 28 overlaps. Further, when viewed in the vertical direction, any one of the plurality of first linear conductors 26 is placed in each of the plurality of second regions A2 positioned between the two adjacent second linear conductors 28. At least a portion of the first linear conductor 26 overlaps. This reduces the sections in which the signal conductor 20 is not coupled to the ground conductor. As a result, according to the multilayer substrate 10, fluctuations in the characteristic impedance occurring in the signal conductor 20 can be suppressed.
  • the multilayer substrate 10 can be easily bent.
  • a comparative example is a multilayer substrate in which two ground conductors exist above and below the signal conductor so as to overlap substantially the entire signal conductor.
  • the ground conductor located on the outer peripheral side of the signal conductor expands greatly, and the ground conductor located on the inner peripheral side of the signal conductor contracts greatly. Therefore, the two ground conductors prevent the multilayer substrate from being bent.
  • the plurality of second linear conductors 28 located inside the signal conductor 20 are contracted.
  • elongation occurs in the plurality of first linear conductors 26 located on the outer peripheral side of the signal conductor 20 .
  • any one of the plurality of second linear conductors 28 is placed in each of the plurality of first regions A1 positioned between the two adjacent first linear conductors 26. At least a portion of the second linear conductor 28 overlaps.
  • any one of the plurality of first linear conductors 26 is placed in each of the plurality of second regions A2 positioned between the two adjacent second linear conductors 28. At least a portion of the first linear conductor 26 overlaps. Thus, the plurality of first linear conductors 26 are not continuous on the signal conductor 20 . Similarly, the plurality of second linear conductors 28 are not continuous under the signal conductors 20 . This makes it difficult for the plurality of first linear conductors 26 and the plurality of second linear conductors 28 to prevent the multilayer substrate 10 from being bent. As described above, according to the multilayer substrate 10, the multilayer substrate 10 can be easily bent.
  • the multilayer substrate 10 can be easily bent for the following reasons. More specifically, if a hard substance such as a conductor is provided at a position spaced from the signal conductor 20 toward the inner or outer circumference, the bending of the multilayer substrate 10 is hindered by the hard substance. Therefore, in the multilayer substrate 10, the first ground conductors 22a and 22b are positioned between the plurality of first linear conductors 26 and the plurality of second linear conductors 28 in the vertical direction. As a result, the first ground conductors 22a and 22b are no longer provided at positions spaced from the signal conductor 20 toward the inner or outer circumference. As a result, the multilayer substrate 10 can be easily bent. In particular, the first ground conductors 22a and 22b are provided at the same position as the signal conductor 20 in the vertical direction. Therefore, the multilayer substrate 10 can be folded more easily.
  • a hard substance such as a conductor
  • the multilayer substrate 10 can be easily bent for the following reasons. More specifically, the multiple first linear conductors 26 do not overlap the multiple second linear conductors 28 when viewed in the vertical direction. As a result, a section in which the first linear conductor 26 and the second linear conductor 28 are arranged in the vertical direction does not occur in the multilayer substrate 10 . Therefore, in the multilayer substrate 10, a section in which the multilayer substrate 10 is difficult to bend is less likely to occur. As a result, the multilayer substrate 10 can be easily bent.
  • the vertical thickness of the multilayer substrate 10 is reduced. More specifically, when the first ground conductors 22a and 22b are positioned above or below the plurality of first linear conductors 26, the first ground conductors 22a and 22b are positioned above or below the plurality of first linear conductors 26. An insulator layer is required to provide the In this case, since the number of insulating layers of the multilayer substrate 10 is increased, the thickness of the multilayer substrate 10 in the vertical direction is increased. Therefore, in the multilayer substrate 10, the first ground conductors 22a and 22b are positioned between the plurality of first linear conductors 26 and the plurality of second linear conductors 28 in the vertical direction.
  • ground conductors 24a, 25a, 24b, and 25b are provided in the non-intersecting sections A21 and A23, respectively.
  • a plurality of first linear conductors 26 and a plurality of second linear conductors 28 are provided in the intersection section A22.
  • a first region A ⁇ b>1 exists between the plurality of first linear conductors 26 .
  • a second region A ⁇ b>2 exists between the plurality of second linear conductors 28 .
  • the capacitance generated in the signal conductor 20 per unit length in the non-crossing sections A21 and A23 tends to be larger than the capacitance generated in the signal conductor 20 per unit length in the crossing section A22. Therefore, as shown in FIG. 1, the line width w2 of the signal conductor 20 in the crossing section A22 is thicker than the line width w1 of the signal conductor 20 in the non-crossing section A21 and the line width w3 of the signal conductor 20 in the non-crossing section A23. As a result, the capacitance generated in the signal conductor 20 per unit length in the cross section A22 approaches the capacitance generated in the signal conductor 20 per unit length in the non-cross sections A21 and A23. As a result, according to the multilayer substrate 10, fluctuations in the characteristic impedance occurring in the signal conductor 20 can be suppressed.
  • FIG. 4 is a cross-sectional view of the multilayer substrate 10a.
  • the multilayer board 10a differs from the multilayer board 10 in that each of the plurality of first linear conductors 26 overlaps with the plurality of second linear conductors 28 when viewed in the vertical direction. More specifically, the left portions of the plurality of first linear conductors 26 each overlap the right portions of the plurality of second linear conductors 28 when viewed in the vertical direction.
  • the rest of the structure of the multilayer substrate 10a is the same as that of the multilayer substrate 10, so the description is omitted.
  • the multilayer substrate 10a has the effects (a) to (c), (e) and (f).
  • FIG. 5 is a cross-sectional view of the multilayer substrate 10b.
  • the multilayer substrate 10b differs from the multilayer substrate 10 in that the line width W1 of the plurality of first linear conductors 26 is thinner than the line width W2 of the plurality of second linear conductors 28 when viewed in the vertical direction.
  • the second section A12 is bent in the positive direction of the Z-axis with respect to the first section A11.
  • the rest of the structure of the multilayer substrate 10b is the same as that of the multilayer substrate 10, so the description is omitted.
  • the multilayer substrate 10b has the effects (a) to (f).
  • the multilayer substrate 10b when the second section A12 is bent in the positive direction of the Z-axis with respect to the first section A11, fluctuations in the characteristic impedance generated in the signal conductor 20 in the second section A12 are suppressed. be. More specifically, in the multilayer substrate 10b, the line width W1 of the plurality of first linear conductors 26 is narrower than the line width W2 of the plurality of second linear conductors . Therefore, the lateral width of the first area A1 is greater than the lateral width of the second area A2. When the second section A12 bends in the positive direction of the Z-axis with respect to the first section A11, the plurality of first linear conductors 26 are located inside the plurality of second linear conductors 28. As shown in FIG.
  • the width of the first area A1 in the left-right direction is reduced.
  • the lateral width of the second area A2 increases. Therefore, the width in the horizontal direction of the first area A1 approaches the width in the horizontal direction of the second area A2.
  • a characteristic impedance generated in a section (first region A1) of the signal conductor 20 that does not overlap the plurality of first linear conductors 26 and a section (second region A1) that does not overlap the plurality of second linear conductors 28 in the signal conductor 20 becomes small. As a result, fluctuations in the characteristic impedance occurring in the signal conductor 20 can be suppressed.
  • FIG. 6 is a cross-sectional view of the multilayer substrate 10c.
  • the multilayer board 10c differs from the multilayer board 10 in that each of the plurality of first linear conductors 26 overlaps the two second linear conductors 28 located on the left and right when viewed in the vertical direction. More specifically, the left portions of the plurality of first linear conductors 26 each overlap the right portions of the plurality of second linear conductors 28 when viewed in the vertical direction. Each of the right portions of the plurality of first linear conductors 26 overlaps the left portions of the plurality of second linear conductors 28 when viewed in the vertical direction. Thereby, each of the plurality of first regions A1 overlaps the plurality of second linear conductors 28 when viewed in the vertical direction.
  • Each of the plurality of second regions A2 overlaps the plurality of first linear conductors 26 when viewed in the vertical direction.
  • the rest of the structure of the multilayer substrate 10c is the same as that of the multilayer substrate 10, so description thereof will be omitted.
  • the multilayer substrate 10c has the effects (a) to (c), (e) and (f).
  • the characteristic impedance generated in the signal conductor 20 is suppressed from fluctuating due to lamination displacement of the insulator layers 14a to 14e. More specifically, each of the plurality of first linear conductors 26 overlaps two second linear conductors 28 located on the left and right. As a result, even if the insulating layers 14a to 14e are not stacked, the plurality of first regions A1 as a whole overlaps with the plurality of second linear conductors 28 when viewed in the vertical direction. Each of the plurality of second regions A2 as a whole overlaps with the plurality of first linear conductors 26 when viewed in the vertical direction.
  • the characteristic impedance generated in the signal conductor 20 in the first region A1 are suppressed.
  • fluctuations in the characteristic impedance generated in the signal conductor 20 in the second area A2 are suppressed.
  • the characteristic impedance generated in the signal conductor 20 is suppressed from fluctuating due to lamination displacement of the insulator layers 14a to 14e.
  • FIG. 7 is a cross-sectional view of the multilayer substrate 10d.
  • the vertical thickness D12 of the laminate 12 in the intersecting section A22 is obtained from the vertical thickness D11 of the laminate 12 in the non-intersecting section A21 and the vertical thickness D13 of the laminate 12 in the non-intersecting section A23. It differs from the multilayer substrate 10 in a small point.
  • the insulator layer 14f is laminated on the insulator layer 14a.
  • the intersection section A22 the insulator layer 14f is not stacked on the insulator layer 14a.
  • the rest of the structure of the multilayer substrate 10d is the same as that of the multilayer substrate 10, so the description is omitted.
  • the multilayer substrate 10d has the effects (a) to (f).
  • the multilayer substrate 10d it becomes easy to use the non-intersection sections A21 and A23 as rigid areas and the intersection section A22 as a non-rigid area. Rigid regions are less likely to bend in the Z-axis direction than non-rigid regions.
  • FIG. 8 is a cross-sectional view of the multilayer substrate 10e.
  • the multilayer substrate 10 e differs from the multilayer substrate 10 in that it further includes a plurality of fifth linear conductors 60 and a plurality of sixth linear conductors 62 .
  • the plurality of fifth linear conductors 60 and the plurality of sixth linear conductors 62 cross the signal conductor 20 and the first ground conductors 22a and 22b when viewed in the vertical direction.
  • the plurality of fifth linear conductors 60 are positioned above the plurality of first linear conductors 26 .
  • Each of the plurality of fifth linear conductors 60 overlaps with one of the plurality of first regions A1.
  • the line width W5 of the plurality of fifth linear conductors 60 is the same as the width in the horizontal direction of the plurality of first regions A1.
  • the multiple sixth linear conductors 62 are positioned below the multiple second linear conductors 28 .
  • Each of the plurality of sixth linear conductors 62 overlaps with one of the plurality of second regions A2.
  • the line width W6 of the plurality of sixth linear conductors 62 is the same as the width in the horizontal direction of the plurality of second regions A2.
  • the plurality of fifth linear conductors 60 and the plurality of sixth linear conductors 62 as described above are not DC-coupled to any of the external electrodes.
  • the rest of the structure of the multilayer substrate 10e is the same as that of the multilayer substrate 10, so the description is omitted.
  • the multilayer substrate 10e has the effects (a) to (c), (e) and (f).
  • the line width W5 of the plurality of fifth linear conductors 60 is the same as the width in the horizontal direction of the plurality of first regions A1. Therefore, the first linear conductor 26 or the fifth linear conductor 60 exists above the signal conductor 20 in the intersection section A22. Therefore, in the intersection section A22, the entire signal conductor 20 is covered with the first linear conductor 26 and the fifth linear conductor 60 when viewed downward.
  • the line width W6 of the plurality of sixth linear conductors 62 is the same as the width in the horizontal direction of the plurality of second regions A2. Therefore, the second linear conductor 28 or the sixth linear conductor 62 exists under the signal conductor 20 in the cross section A22.
  • the entire signal conductor 20 is covered with the second linear conductor 28 and the sixth linear conductor 62 when viewed upward.
  • fluctuations in the characteristic impedance generated in the signal conductor 20 are suppressed, and the shielding performance of the signal conductor 20 is improved.
  • FIG. 9 is a cross-sectional view of the multilayer substrate 10f.
  • the line width W5 of the plurality of fifth linear conductors 60 is narrower than the width of the plurality of first regions A1 in the horizontal direction, and the line width W6 of the plurality of sixth linear conductors 62 is greater than the width of the plurality of first regions A1. It differs from the multilayer substrate 10e in that it is narrower than the width of the two regions A2 in the horizontal direction. In this way, in the intersection section A22, there may be a section where the signal conductor 20 is not covered with the first linear conductor 26 and the fifth linear conductor 60 when viewed downward.
  • intersection section A22 there may be a section where the signal conductor 20 is not covered with the second linear conductor 28 and the sixth linear conductor 62 when viewed upward.
  • the rest of the structure of the multilayer substrate 10f is the same as that of the multilayer substrate 10e, so the description is omitted.
  • the multilayer substrate 10f has the effects of (a) to (c), (e) and (f).
  • FIG. 10 is an exploded perspective view of the multilayer substrate 10g.
  • the multilayer substrate 10g differs from the multilayer substrate 10 in that the plurality of first linear conductors 26 and the plurality of second linear conductors 28 are not perpendicular to the signal conductors 20 when viewed in the vertical direction.
  • the plurality of first linear conductors 26 and the plurality of second linear conductors 28 of the multilayer substrate 10g rotate counterclockwise with respect to the plurality of first linear conductors 26 and the plurality of second linear conductors 28 of the multilayer substrate 10. It has a structure rotated by 45°.
  • the rest of the structure of the multilayer substrate 10g is the same as that of the multilayer substrate 10, so the description is omitted.
  • the multilayer substrate 10g has the effects (a) to (f).
  • FIG. 11 is an exploded perspective view of the multilayer substrate 10h.
  • the multilayer substrate 10h differs from the multilayer substrate 10g in that it further includes a plurality of third linear conductors 50 and a plurality of fourth linear conductors 52.
  • the plurality of first linear conductors 26 and the plurality of third linear conductors 50 form a mesh structure.
  • the plurality of second linear conductors 28 and the plurality of fourth linear conductors 52 form a mesh structure.
  • the multiple third linear conductors 50 are provided on the laminate 12 .
  • the plurality of third linear conductors 50 are located on the upper main surface of the insulator layer 14b. Thereby, the plurality of third linear conductors 50 are positioned above the signal conductors 20 .
  • the plurality of third linear conductors 50 are arranged in the direction in which the signal conductors 20 extend. The plurality of third linear conductors 50 intersect the signal conductors 20 when viewed in the vertical direction.
  • Such a plurality of third linear conductors 50 extend along each other when viewed in the vertical direction.
  • the plurality of third linear conductors 50 are parallel to each other when viewed in the vertical direction.
  • the plurality of third linear conductors 50 are not parallel to the plurality of first linear conductors 26 when viewed in the vertical direction.
  • the multiple third linear conductors 50 are orthogonal to the multiple first linear conductors 26 .
  • the plurality of third linear conductors 50 need not be orthogonal to the plurality of first linear conductors 26 .
  • a plurality of fourth linear conductors 52 are provided on the laminate 12 .
  • the plurality of fourth linear conductors 52 are located on the upper main surface of the insulator layer 14d. Thereby, the plurality of fourth linear conductors 52 are positioned below the signal conductors 20 .
  • the plurality of fourth linear conductors 52 are arranged in the direction in which the signal conductors 20 extend. The plurality of fourth linear conductors 52 intersect the signal conductors 20 when viewed in the vertical direction.
  • Such a plurality of fourth linear conductors 52 extend along each other when viewed in the vertical direction.
  • the plurality of fourth linear conductors 52 are parallel to each other when viewed in the vertical direction.
  • the multiple fourth linear conductors 52 are not parallel to the multiple second linear conductors 28 when viewed in the vertical direction.
  • the multiple fourth linear conductors 52 are orthogonal to the multiple second linear conductors 28 .
  • the plurality of third linear conductors 50 and the plurality of fourth linear conductors 52 as described above are arranged alternately in the direction in which the signal conductors 20 extend when viewed in the vertical direction.
  • the rest of the structure of the multilayer substrate 10h is the same as that of the multilayer substrate 10g, so the description is omitted.
  • the multilayer substrate 10h has the effects (a) to (c), (e) and (f).
  • FIG. 12 is an exploded perspective view of the multilayer substrate 10i.
  • the multi-layer board 10i differs from the multi-layer board 10h in that the first ground conductors 22a and 22b are not provided and the ground conductors 27a-27d and 29a-29d are provided.
  • the plurality of first linear conductors 26 and the plurality of third linear conductors 50 are located on the upper major surface of the insulator layer 14a.
  • the plurality of second linear conductors 28 and the plurality of fourth linear conductors 52 are located on the upper major surface of the insulator layer 14e.
  • the ground conductors 27a to 27d are located on the upper main surface of the insulator layer 14b.
  • the ground conductor 27a has the same shape as the ground conductor 25a.
  • the ground conductor 27b has the same shape as the ground conductor 25b.
  • the ground conductor 27c extends in the left-right direction.
  • the ground conductor 27c connects the front end of the right side of the ground conductor 27a and the front end of the left side of the ground conductor 27b.
  • the ground conductor 27d extends in the left-right direction.
  • the ground conductor 27d connects the rear end portion of the right side of the ground conductor 27a and the rear end portion of the left side of the ground conductor 27b.
  • the ground conductors 27c and 27d overlap the plurality of first linear conductors 26, the plurality of second linear conductors 28, the plurality of third linear conductors 50, and the plurality of fourth linear conductors 52 when viewed in the vertical direction. ing.
  • the ground conductors 29a to 29d are located on the upper main surface of the insulator layer 14d.
  • the ground conductor 29a has the same shape as the ground conductor 25a.
  • the ground conductor 29b has the same shape as the ground conductor 25b.
  • the ground conductor 29c extends in the left-right direction.
  • the ground conductor 29c connects the front end of the right side of the ground conductor 29a and the front end of the left side of the ground conductor 29b.
  • the ground conductor 29d extends in the left-right direction.
  • the ground conductor 29d connects the rear end portion of the right side of the ground conductor 29a and the rear end portion of the left side of the ground conductor 29b.
  • the ground conductors 29c and 29d overlap the plurality of first linear conductors 26, the plurality of second linear conductors 28, the plurality of third linear conductors 50, and the plurality of fourth linear conductors 52 when viewed in the vertical direction. ing.
  • the signal conductors 20 are composed of a plurality of first linear conductors 26, a plurality of second linear conductors 28, a plurality of third linear conductors 50 and Capacitive coupling with the ground conductors 27a to 27d and 29a to 29d can be achieved via the plurality of fourth linear conductors 52.
  • FIG. The rest of the structure of the multilayer substrate 10i is the same as that of the multilayer substrate 10h, so the description is omitted.
  • the multilayer substrate 10i has the effects (a) to (c), (e) and (f).
  • FIG. 13 is an exploded perspective view of the multilayer substrate 10j.
  • the multilayer board 10j differs from the multilayer board 10 in that the plurality of first linear conductors 26 and the plurality of second linear conductors 28 are connected to the ground potential. More specifically, the multilayer substrate 10j further includes connection conductors 70a, 70b, 72a, 72b. The connection conductors 70a and 70b are provided on the upper main surface of the insulator layer 14b. The connection conductors 70a and 70b extend in the left-right direction. Front ends of the plurality of first linear conductors 26 are connected to the connection conductor 70a. The rear ends of the plurality of first linear conductors 26 are connected to the connection conductor 70b. The left end of the connection conductor 70a is connected to the interlayer connection conductor v3.
  • connection conductor 70a The right end of the connection conductor 70a is connected to the interlayer connection conductor v5.
  • the left end of the connection conductor 70b is connected to the interlayer connection conductor v4.
  • the right end of the connection conductor 70b is connected to the interlayer connection conductor v6.
  • connection conductors 72a and 72b are provided on the upper main surface of the insulator layer 14d.
  • the connection conductors 72a and 72b extend in the left-right direction. Front ends of the plurality of second linear conductors 28 are connected to the connection conductor 72a. The rear ends of the plurality of second linear conductors 28 are connected to the connection conductor 72b.
  • the left end of the connection conductor 72a is connected to the interlayer connection conductor v3.
  • the right end of the connection conductor 72a is connected to the interlayer connection conductor v5.
  • the left end of the connection conductor 72b is connected to the interlayer connection conductor v4.
  • the right end of the connection conductor 72b is connected to the interlayer connection conductor v6.
  • the multilayer substrate 10j has the effects (a) to (f).
  • FIG. 14 is an exploded perspective view of the multilayer substrate 10k.
  • the plurality of first linear conductors 26, the plurality of second linear conductors 28, the plurality of third linear conductors 50, and the plurality of fourth linear conductors 52 are connected to the ground potential. is different from the multilayer substrate 10i. More specifically, multilayer substrate 10k does not include 14a and 14e.
  • the ground conductors 24a, 24b are located on the upper main surface of the insulator layer 14b.
  • the multiple first linear conductors 26 and the multiple third linear conductors 50 are connected to the ground conductors 24a and 24b.
  • the ground conductors 25a, 25b are located on the upper main surface of the insulator layer 14d.
  • the plurality of second linear conductors 28 and the plurality of fourth linear conductors 52 are connected to ground conductors 25a and 25b. Thereby, the plurality of first linear conductors 26, the plurality of second linear conductors 28, the plurality of third linear conductors 50, and the plurality of fourth linear conductors 52 are connected to the ground potential.
  • the rest of the structure of the multilayer substrate 10k is the same as that of the multilayer substrate 10i, so the description is omitted.
  • the multilayer substrate 10k has the effects (a) to (c), (e) and (f).
  • FIG. 15 is an exploded perspective view of the multilayer substrate 10l.
  • the multilayer substrate 10l differs from the multilayer substrate 10 in that the insulator layers 14a and 14e do not exist.
  • the ground conductors 24a, 24b are located on the upper main surface of the insulator layer 14b.
  • the ground conductors 25a, 25b are located on the upper main surface of the insulator layer 14d.
  • the rest of the structure of the multilayer substrate 10l is the same as that of the multilayer substrate 10, so the description is omitted.
  • the multilayer substrate 10l has the effects (a) to (f).
  • the thickness of the multilayer substrate 10l in the vertical direction is further reduced.
  • FIG. 16 is an exploded perspective view of the multilayer substrate 10m.
  • the multilayer substrate 10m differs from the multilayer substrate 10 in that the line width of the signal conductors 22 is uniform. More specifically, the line width w2 of the signal conductor 20 in the cross section A22 is equal to the line width w1 of the signal conductor 20 in the non-cross section A21 and the line width w3 of the signal conductor 20 in the non-cross section A23.
  • the rest of the structure of the multilayer substrate 10m is the same as that of the multilayer substrate 10, so the description is omitted.
  • the multilayer substrate 10m has the effects (a) to (f).
  • the multilayer substrate according to the present invention is not limited to the multilayer substrates 10, 10a to 10m, and can be modified within the scope of the gist thereof. Also, the structures of the multilayer substrates 10, 10a to 10m may be combined arbitrarily.
  • the multilayer substrates 10, 10a to 10i, 10l, and 10m are equipped with a plurality of ground conductors. However, the multilayer substrates 10, 10a-10i, 10l, 10m only need to have one or more ground conductors.
  • the laminate 12 of the multilayer substrates 10, 10a to 10m does not have to be flexible.
  • the material of the insulator layers 14a to 14f may be resin other than thermoplastic resin. Also, the material of the insulator layers 14a to 14f may be an insulating material other than resin. Examples of insulating materials other than resin include ceramics.
  • the number of the plurality of first linear conductors 26 should be two or more.
  • the number of the plurality of second linear conductors 28 should be two or more.
  • the number of the plurality of third linear conductors 50 should be two or more.
  • the number of fourth linear conductors 52 may be two or more.
  • the multilayer substrates 10, 10a-10m are provided with a plurality of external electrodes. However, the multilayer substrates 10, 10a-10m only need to have one or more external electrodes.
  • the second section A12 is bent in the Z-axis direction with respect to the first section A11 so that the radius of curvature of the second section A12 is smaller than the radius of curvature of the first section A11. All you have to do is therefore, the second section A12 may be bent in the Z-axis direction.
  • first ground conductors 22a and 22b do not have to be positioned between the plurality of first linear conductors 26 and the plurality of second linear conductors 28 in the vertical direction.
  • the plurality of first linear conductors 26 do not have to be provided at the same position in the vertical direction. Therefore, the plurality of first linear conductors 26 may be dispersedly positioned on the main surfaces of the plurality of insulator layers.
  • the plurality of second linear conductors 28 do not have to be provided at the same position in the vertical direction. Therefore, the plurality of second linear conductors 28 may be dispersedly positioned on the main surfaces of the plurality of insulator layers.
  • the second section A12 does not have to match the intersection section A22.
  • the second section A12 may include portions of the non-crossing sections A21 and A23 in addition to the crossing section A22.
  • the line width of the signal conductors 22 of the multilayer substrates 10a to 10l may be uniform, like the line width of the signal conductors 22 of the multilayer substrate 10m.

Abstract

A plurality of first linear conductors are positioned above signal conductors. A plurality of second linear conductors are positioned below the signal conductors. The plurality of first linear conductors and the plurality of second linear conductors cross the signal conductors when viewed in the vertical direction. The plurality of second linear conductors extend along the plurality of first linear conductors when viewed in the vertical direction. When viewed in the vertical direction, at least a portion of any one second linear conductor among the plurality of second linear conductors overlaps with each of a plurality of first regions positioned between two adjacent first linear conductors. When viewed in the vertical direction, at least a portion of any one first linear conductor among the plurality of first linear conductors overlaps with each of a plurality of second regions positioned between two adjacent second linear conductors.

Description

多層基板multilayer board
 本発明は、信号導体を備える多層基板に関する。 The present invention relates to a multilayer substrate with signal conductors.
 従来の多層基板に関する発明としては、例えば、特許文献1に記載のデバイスが知られている。このデバイスは、複数の導線、複数の第1スロット型不動ストリップ及び複数の第2スロット型不動ストリップを備えている。複数の導線は、前後方向に延びている。複数の第1スロット型不動ストリップは、複数の導線より上に位置している。複数の第1スロット型不動ストリップは、左右方向に延びている。複数の第2スロット型不動ストリップは、複数の導線より下に位置している。複数の第2スロット型不動ストリップは、左右方向に延びている。また、複数の第2スロット型不動ストリップは、上下方向に見て、複数の第1スロット型不動ストリップと重なっている。 For example, the device described in Patent Document 1 is known as an invention related to conventional multilayer substrates. The device includes a plurality of conductors, a plurality of first slotted stationary strips and a plurality of second slotted stationary strips. The multiple conducting wires extend in the front-rear direction. A plurality of first slotted stationary strips are positioned above the plurality of conductors. A plurality of first slotted stationary strips extend in the left-right direction. A plurality of second slotted stationary strips are positioned below the plurality of conductors. A plurality of second slotted stationary strips extend in the left-right direction. Also, the plurality of second slot type immovable strips overlap the plurality of first slot type immovable strips when viewed in the vertical direction.
特許第5042327号公報(図12)Japanese Patent No. 5042327 (Fig. 12)
 ところで、特許文献1に記載のデバイスにおいて、複数の導線に発生する特性インピーダンスの変動を抑制したいという要望がある。 By the way, in the device described in Patent Document 1, there is a demand to suppress variations in characteristic impedance that occur in a plurality of conducting wires.
 そこで、本発明の目的は、信号線路に発生する特性インピーダンスの変動を抑制できる多層基板を提供することである。 Accordingly, an object of the present invention is to provide a multilayer substrate capable of suppressing variations in characteristic impedance occurring in signal lines.
 本発明の一形態に係る多層基板は、
 多層基板であって、
 複数の絶縁体層が上下方向に積層された構造を有する積層体と、
 前記積層体に設けられており、かつ、線形状を有する信号導体と、
 前記積層体に設けられており、かつ、前記信号導体より上に位置しており、かつ、上下方向に見て、前記信号導体と交差している複数の第1線状導体と、
 前記積層体に設けられており、かつ、前記信号導体より下に位置しており、かつ、上下方向に見て、前記信号導体と交差している複数の第2線状導体と、
 を備えており、
 前記複数の第2線状導体は、上下方向に見て、前記複数の第1線状導体に沿って延びており、
 上下方向に見て、隣り合う2個の前記第1線状導体の間に位置する複数の第1領域のそれぞれに、前記複数の第2線状導体の内のいずれか1個の第2線状導体の少なくとも一部分が重なっており、
 上下方向に見て、隣り合う2個の前記第2線状導体の間に位置する複数の第2領域のそれぞれに、前記複数の第1線状導体の内のいずれか1個の第1線状導体の少なくとも一部分が重なっており、
 (A)又は(B)の構造を有している。 
(A)
 前記多層基板は、
 前記積層体に設けられており、かつ、外部回路と電気的に接続される1以上の外部電極と、
 1以上のグランド導体を、
 更に備えており、
 前記複数の第1線状導体及び前記複数の第2線状導体は、前記1以上の外部電極のいずれとも直流的に結合しておらず、
 前記信号導体が前記複数の第1線状導体又は前記複数の第2線状導体と交差している区間を交差区間と定義し、
 前記信号導体は、前記交差区間では、前記1以上のグランド導体と重なっておらず、
 前記複数の第1線状導体のそれぞれは、上下方向に見て、前記1以上のグランド導体の内の一部のグランド導体と重なっており、
 前記複数の第2線状導体のそれぞれは、上下方向に見て、前記1以上のグランド導体の内の一部のグランド導体と重なっている。 
(B)
 前記複数の第1線状導体及び前記複数の第2線状導体は、グランド電位に接続されている。
A multilayer substrate according to one aspect of the present invention comprises
A multilayer substrate,
a laminate having a structure in which a plurality of insulator layers are stacked vertically;
a signal conductor provided in the laminate and having a linear shape;
a plurality of first linear conductors provided in the laminate, positioned above the signal conductor, and crossing the signal conductor when viewed in the vertical direction;
a plurality of second linear conductors provided in the laminate, positioned below the signal conductor, and crossing the signal conductor when viewed in the vertical direction;
and
The plurality of second linear conductors extend along the plurality of first linear conductors when viewed in the vertical direction,
Any one of the plurality of second linear conductors is provided in each of the plurality of first regions positioned between the two adjacent first linear conductors when viewed in the vertical direction. at least a portion of the conductors overlap, and
Any one of the plurality of first linear conductors is provided in each of the plurality of second regions positioned between the two adjacent second linear conductors when viewed in the vertical direction. at least a portion of the conductors overlap, and
It has the structure (A) or (B).
(A)
The multilayer substrate is
one or more external electrodes provided on the laminate and electrically connected to an external circuit;
one or more ground conductors;
It is also equipped with
The plurality of first linear conductors and the plurality of second linear conductors are not DC-coupled to any of the one or more external electrodes,
A section in which the signal conductor crosses the plurality of first linear conductors or the plurality of second linear conductors is defined as an intersection section,
the signal conductor does not overlap the one or more ground conductors in the cross section;
each of the plurality of first linear conductors overlaps a part of the one or more ground conductors when viewed in the vertical direction;
Each of the plurality of second linear conductors overlaps a part of the one or more ground conductors when viewed in the vertical direction.
(B)
The plurality of first linear conductors and the plurality of second linear conductors are connected to a ground potential.
 本発明に係る多層基板によれば、信号線路に発生する特性インピーダンスの変動を抑制できる。 According to the multilayer substrate of the present invention, it is possible to suppress fluctuations in characteristic impedance that occur in signal lines.
図1は、多層基板10の分解斜視図である。FIG. 1 is an exploded perspective view of a multilayer substrate 10. FIG. 図2は、多層基板10の断面図である。FIG. 2 is a cross-sectional view of the multilayer substrate 10. As shown in FIG. 図3は、折れ曲がった状態の多層基板10の背面図である。FIG. 3 is a rear view of the multilayer substrate 10 in a bent state. 図4は、多層基板10aの断面図である。FIG. 4 is a cross-sectional view of the multilayer substrate 10a. 図5は、多層基板10bの断面図である。FIG. 5 is a cross-sectional view of the multilayer substrate 10b. 図6は、多層基板10cの断面図である。FIG. 6 is a cross-sectional view of the multilayer substrate 10c. 図7は、多層基板10dの断面図である。FIG. 7 is a cross-sectional view of the multilayer substrate 10d. 図8は、多層基板10eの断面図である。FIG. 8 is a cross-sectional view of the multilayer substrate 10e. 図9は、多層基板10fの断面図である。FIG. 9 is a cross-sectional view of the multilayer substrate 10f. 図10は、多層基板10gの分解斜視図である。FIG. 10 is an exploded perspective view of the multilayer substrate 10g. 図11は、多層基板10hの分解斜視図である。FIG. 11 is an exploded perspective view of the multilayer substrate 10h. 図12は、多層基板10iの分解斜視図である。FIG. 12 is an exploded perspective view of the multilayer substrate 10i. 図13は、多層基板10jの分解斜視図である。FIG. 13 is an exploded perspective view of the multilayer substrate 10j. 図14は、多層基板10kの分解斜視図である。FIG. 14 is an exploded perspective view of the multilayer substrate 10k. 図15は、多層基板10lの分解斜視図である。FIG. 15 is an exploded perspective view of the multilayer substrate 10l. 図16は、多層基板10mの分解斜視図である。FIG. 16 is an exploded perspective view of the multilayer substrate 10m.
(実施形態)
[多層基板10の構造]
 以下に、本発明の実施形態に係る多層基板10の構造について図面を参照しながら説明する。図1は、多層基板10の分解斜視図である。図2は、多層基板10の断面図である。図1及び図2では、複数の第1線状導体26及び複数の第2線状導体28の内の代表的な第1線状導体26及び代表的な第2線状導体28にのみ参照符号を付した。図3は、折れ曲がった状態の多層基板10の背面図である。
(embodiment)
[Structure of multilayer substrate 10]
The structure of the multilayer substrate 10 according to the embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is an exploded perspective view of a multilayer substrate 10. FIG. FIG. 2 is a cross-sectional view of the multilayer substrate 10. As shown in FIG. In FIGS. 1 and 2, only representative first linear conductors 26 and representative second linear conductors 28 among the plurality of first linear conductors 26 and the plurality of second linear conductors 28 are denoted by reference numerals. attached. FIG. 3 is a rear view of the multilayer substrate 10 in a bent state.
 本明細書において、方向を以下のように定義する。多層基板10の積層体12の積層方向が上下方向である。また、多層基板10の信号導体20が延びる方向が左右方向である。また、多層基板10の信号導体20の線幅方向が前後方向である。なお、本明細書において線幅方向とは、上下方向に見て、導体が延びる方向に直交する方向である。上下方向、前後方向及び左右方向は、互いに直交している。なお、本明細書の上下方向、前後方向及び左右方向は、多層基板10の実使用時の上下方向、前後方向及び左右方向と一致していなくてもよい。 In this specification, directions are defined as follows. The stacking direction of the laminate 12 of the multilayer substrate 10 is the vertical direction. Further, the direction in which the signal conductors 20 of the multilayer substrate 10 extend is the left-right direction. Further, the line width direction of the signal conductors 20 of the multilayer substrate 10 is the front-rear direction. In this specification, the line width direction is a direction orthogonal to the direction in which the conductor extends when viewed in the vertical direction. The up-down direction, the front-rear direction, and the left-right direction are orthogonal to each other. The vertical direction, the front-rear direction, and the left-right direction in this specification do not have to correspond to the vertical direction, the front-rear direction, and the left-right direction when the multilayer substrate 10 is actually used.
 以下に、本明細書における用語の定義について説明する。まず、本明細書における部材の位置関係について定義する。XないしZは、多層基板10を構成する部材又は部品である。本明細書において、「XとYとが電気的に接続される」とは、XとYとの間で電気が導通できることを意味する。従って、XとYとが接触していてもよいし、XとYとが接触していなくてもよい。XとYとが接触していない場合には、XとYとの間に導電性を有するZが配置されている。一方、本明細書において、「XとYとが接続される」とは、XとYとが接触した状態で繋がっていることを意味する。 The definitions of terms used in this specification are explained below. First, the positional relationship of the members in this specification will be defined. X to Z are members or parts that constitute the multilayer substrate 10 . In this specification, "X and Y are electrically connected" means that electricity can be conducted between X and Y. Therefore, X and Y may be in contact, or X and Y may not be in contact. If X and Y are not in contact, a conductive Z is placed between X and Y. On the other hand, in this specification, "X and Y are connected" means that X and Y are connected while being in contact with each other.
 以下では、Xは、多層基板10の部品又は部材である。本明細書において、特に断りのない場合には、Xの各部について以下のように定義する。Xの前部とは、Xの前半分を意味する。Xの後部とは、Xの後半分を意味する。Xの左部とは、Xの左半分を意味する。Xの右部とは、Xの右半分を意味する。Xの上部とは、Xの上半分を意味する。Xの下部とは、Xの下半分を意味する。Xの前端とは、Xの前方向の端を意味する。Xの後端とは、Xの後方向の端を意味する。Xの左端とは、Xの左方向の端を意味する。Xの右端とは、Xの右方向の端を意味する。Xの上端とは、Xの上方向の端を意味する。Xの下端とは、Xの下方向の端を意味する。Xの前端部とは、Xの前端及びその近傍を意味する。Xの後端部とは、Xの後端及びその近傍を意味する。Xの左端部とは、Xの左端及びその近傍を意味する。Xの右端部とは、Xの右端及びその近傍を意味する。Xの上端部とは、Xの上端及びその近傍を意味する。Xの下端部とは、Xの下端及びその近傍を意味する。 In the following, X is a part or member of the multilayer substrate 10. In this specification, unless otherwise specified, each part of X is defined as follows. By front of X is meant the front half of X. Back of X means the back half of X. The left part of X means the left half of X. The right part of X means the right half of X. Top of X means the top half of X. The lower part of X means the lower half of X. The leading edge of X means the leading edge of X. The trailing end of X means the trailing end of X. The left end of X means the end of X in the left direction. The right end of X means the end of X in the right direction. The upper end of X means the end of X in the upward direction. The lower end of X means the lower end of X. The front end of X means the front end of X and its vicinity. The rear end of X means the rear end of X and its vicinity. The left end of X means the left end of X and its vicinity. The right end of X means the right end of X and its vicinity. The upper end of X means the upper end of X and its vicinity. The lower end of X means the lower end of X and its vicinity.
 本明細書において、Xが、Yに沿って延びるとは、XがYに平行である状態、及び、XがYに対して僅かに傾いている状態を含む。また、Xが左右方向に延びるとは、Xが左右方向に平行である状態、及び、Xが左右方向に対して僅かに傾いている状態を含む。僅かに傾くとは、XがY軸又は左右方向に対して±10度の範囲内で傾くことを意味する。左右方向以外の方向についても同様である。 In this specification, the state that X extends along Y includes the state in which X is parallel to Y and the state in which X is slightly inclined with respect to Y. Further, the state that X extends in the left-right direction includes the state in which X is parallel to the left-right direction and the state in which X is slightly inclined with respect to the left-right direction. "Slightly tilted" means that X is tilted within a range of ±10 degrees with respect to the Y axis or the horizontal direction. The same applies to directions other than the left-right direction.
 まず、図1を参照しながら、多層基板10の構造について説明する。多層基板10は、高周波信号を伝送する。多層基板10は、スマートフォン等の電子機器において、2つの回路を電気的に接続するために用いられる。多層基板10は、図1に示すように、左右方向に延びる帯形状を有している。 First, the structure of the multilayer substrate 10 will be described with reference to FIG. The multilayer substrate 10 transmits high frequency signals. A multilayer substrate 10 is used to electrically connect two circuits in an electronic device such as a smart phone. As shown in FIG. 1, the multilayer substrate 10 has a strip shape extending in the left-right direction.
 多層基板10は、図1に示すように、積層体12、信号導体20、第1グランド導体22a,22b、グランド導体24a,24b,25a,25b、複数の第1線状導体26、複数の第2線状導体28、外部電極30a,30b,32a,32b,34a,34b及び層間接続導体v1~v6を備えている。 As shown in FIG. 1, the multilayer substrate 10 includes a laminate 12, a signal conductor 20, first ground conductors 22a and 22b, ground conductors 24a, 24b, 25a and 25b, a plurality of first linear conductors 26, and a plurality of second ground conductors 22a and 22b. It has two linear conductors 28, external electrodes 30a, 30b, 32a, 32b, 34a, 34b and interlayer connection conductors v1 to v6.
 積層体12は、図1に示すように、板形状を有している。従って、積層体12は、上下方向に並ぶ上主面及び下主面を有している。また、積層体12は、図1に示すように、保護層16及び絶縁体層14a~14eが上下方向に積層された構造を有している。保護層16及び絶縁体層14a~14eは、上から下へとこの順に並んでいる。絶縁体層14a~14eは、上下方向に見て、積層体12の形状と同じ帯形状を有している。絶縁体層14a~14eは、可撓性を有する誘電体シートである。絶縁体層14a~14eの材料は、樹脂である。本実施形態では、絶縁体層14a~14eの材料は、熱可塑性樹脂である。熱可塑性樹脂は、例えば、液晶ポリマー、PTFE(ポリテトラフロオロエチレン)等である。また、絶縁体層14a~14eの材料は、ポリイミドであってもよい。これにより、積層体12は、可撓性を有する。 The laminate 12 has a plate shape, as shown in FIG. Therefore, the laminated body 12 has an upper principal surface and a lower principal surface which are aligned in the vertical direction. Moreover, as shown in FIG. 1, the laminated body 12 has a structure in which a protective layer 16 and insulating layers 14a to 14e are laminated vertically. The protective layer 16 and the insulator layers 14a to 14e are arranged in this order from top to bottom. The insulator layers 14a to 14e have the same strip shape as the laminate 12 when viewed in the vertical direction. The insulator layers 14a-14e are flexible dielectric sheets. The material of the insulator layers 14a to 14e is resin. In this embodiment, the material of the insulator layers 14a to 14e is thermoplastic resin. The thermoplastic resin is, for example, liquid crystal polymer, PTFE (polytetrafluoroethylene), or the like. Also, the material of the insulator layers 14a to 14e may be polyimide. Thereby, the laminated body 12 has flexibility.
 信号導体20は、図1に示すように、積層体12に設けられている。より詳細には、信号導体20は、絶縁体層14cの上主面に位置している。信号導体20は、線形状を有している。信号導体20は、左右方向に延びている。 The signal conductor 20 is provided on the laminate 12 as shown in FIG. More specifically, signal conductor 20 is located on the upper major surface of insulator layer 14c. The signal conductor 20 has a linear shape. The signal conductor 20 extends in the left-right direction.
 外部電極30a,30b,32a,32b,34a,34bは、図示しない外部回路と電気的に接続される。外部回路は、多層基板10外に設けられている電気回路である。外部電極30a,30b,32a,32b,34a,34bは、積層体12に設けられている。より詳細には、外部電極30a,32a,34aは、絶縁体層14aの上主面の左端近傍に位置している。外部電極32a,30a,34aは、前から後へとこの順に並んでいる。外部電極30b,32b,34bは、絶縁体層14aの上主面の右端近傍に位置している。外部電極32b,30b,34bは、前から後へとこの順に並んでいる。外部電極30a,30b,32a,32b,34a,34bは、上下方向に見て、長方形状を有している。外部電極30a,30b,32a,32b,34a,34bには図示しないコネクタが半田により実装される。このコネクタは、図示しない回路基板のコネクタに接続される。これにより、多層基板10と図示しない回路基板とが電気的に接続される。なお、多層基板10は、コネクタを介することなく、表面実装により回路基板と接続されてもよい。 The external electrodes 30a, 30b, 32a, 32b, 34a, 34b are electrically connected to an external circuit (not shown). The external circuit is an electric circuit provided outside the multilayer substrate 10 . The external electrodes 30 a , 30 b , 32 a , 32 b , 34 a and 34 b are provided on the laminate 12 . More specifically, the external electrodes 30a, 32a, 34a are located near the left end of the upper main surface of the insulator layer 14a. The external electrodes 32a, 30a, 34a are arranged in this order from front to back. The external electrodes 30b, 32b, 34b are located near the right end of the upper main surface of the insulator layer 14a. The external electrodes 32b, 30b, 34b are arranged in this order from front to back. The external electrodes 30a, 30b, 32a, 32b, 34a, 34b have a rectangular shape when viewed in the vertical direction. Connectors (not shown) are soldered to the external electrodes 30a, 30b, 32a, 32b, 34a, and 34b. This connector is connected to a connector on a circuit board (not shown). Thereby, the multilayer board 10 and the circuit board (not shown) are electrically connected. Note that the multilayer board 10 may be connected to the circuit board by surface mounting without using a connector.
 層間接続導体v1は、絶縁体層14a,14bを上下方向に貫通している。層間接続導体v1は、外部電極30aと信号導体20の左端部とを電気的に接続している。層間接続導体v2は、絶縁体層14a,14bを上下方向に貫通している。層間接続導体v2は、外部電極30bと信号導体20の右端部とを電気的に接続している。 The interlayer connection conductor v1 penetrates the insulator layers 14a and 14b in the vertical direction. The interlayer connection conductor v 1 electrically connects the external electrode 30 a and the left end of the signal conductor 20 . The interlayer connection conductor v2 penetrates the insulator layers 14a and 14b in the vertical direction. The interlayer connection conductor v2 electrically connects the external electrode 30b and the right end of the signal conductor 20 .
 複数の第1線状導体26は、図1に示すように、積層体12に設けられている。より詳細には、複数の第1線状導体26は、信号導体20より上に位置している。複数の第1線状導体26は、上下方向において同じ位置に設けられている。本実施形態では、複数の第1線状導体26は、絶縁体層14bの上主面に位置している。複数の第1線状導体26は、線形状を有している。複数の第1線状導体26は、上下方向に見て、信号導体20と交差している。本実施形態では、複数の第1線状導体26は、前後方向に延びている。従って、複数の第1線状導体26は、上下方向に見て、信号導体20と直交している。以上のような複数の第1線状導体26は、信号導体20が延びる方向に並んでいる。 The plurality of first linear conductors 26 are provided on the laminate 12 as shown in FIG. More specifically, the plurality of first linear conductors 26 are positioned above the signal conductors 20 . The plurality of first linear conductors 26 are provided at the same position in the vertical direction. In this embodiment, the plurality of first linear conductors 26 are located on the upper main surface of the insulator layer 14b. The multiple first linear conductors 26 have a linear shape. The plurality of first linear conductors 26 intersect the signal conductors 20 when viewed in the vertical direction. In this embodiment, the plurality of first linear conductors 26 extend in the front-rear direction. Therefore, the plurality of first linear conductors 26 are orthogonal to the signal conductors 20 when viewed in the vertical direction. The plurality of first linear conductors 26 as described above are arranged in the direction in which the signal conductors 20 extend.
 複数の第2線状導体28は、図1に示すように、積層体12に設けられている。より詳細には、複数の第2線状導体28は、信号導体20より下に位置している。複数の第2線状導体28は、上下方向において同じ位置に設けられている。本実施形態では、複数の第2線状導体28は、絶縁体層14dの上主面に位置している。複数の第2線状導体28は、線形状を有している。複数の第2線状導体28は、上下方向に見て、信号導体20と交差している。本実施形態では、複数の第2線状導体28は、前後方向に延びている。従って、複数の第2線状導体28は、上下方向に見て、信号導体20と直交している。また、複数の第2線状導体28は、上下方向に見て、複数の第1線状導体26に沿って延びている。本実施形態では、複数の第2線状導体28は、上下方向に見て、複数の第1線状導体26と平行である。以上のような複数の第2線状導体28は、信号導体20が延びる方向に並んでいる。 The plurality of second linear conductors 28 are provided on the laminate 12 as shown in FIG. More specifically, the plurality of second linear conductors 28 are positioned below the signal conductors 20 . The plurality of second linear conductors 28 are provided at the same position in the vertical direction. In this embodiment, the plurality of second linear conductors 28 are located on the upper main surface of the insulator layer 14d. The plurality of second linear conductors 28 have a linear shape. The plurality of second linear conductors 28 intersect the signal conductors 20 when viewed in the vertical direction. In this embodiment, the plurality of second linear conductors 28 extend in the front-rear direction. Therefore, the plurality of second linear conductors 28 are perpendicular to the signal conductors 20 when viewed in the vertical direction. Also, the plurality of second linear conductors 28 extend along the plurality of first linear conductors 26 when viewed in the vertical direction. In this embodiment, the plurality of second linear conductors 28 are parallel to the plurality of first linear conductors 26 when viewed in the vertical direction. The plurality of second linear conductors 28 as described above are arranged in the direction in which the signal conductors 20 extend.
 このような複数の第1線状導体26及び複数の第2線状導体28は、浮遊導体である。浮遊導体の電位は、浮遊電位である。浮遊導体は、グランド電位及び電源電位が接続されていない。従って、複数の第1線状導体26及び複数の第2線状導体28は、外部電極30a,30b,32a,32b,34a,34bのいずれとも直流的に結合していない。より正確には、複数の第1線状導体26及び複数の第2線状導体28は、多層基板10に設けられているいずれの外部電極とも直流的に結合していない。2つの導体が直流的に結合していないとは、2つの導体の間を直流電流が流れることができないことを意味する。 The plurality of first linear conductors 26 and the plurality of second linear conductors 28 are floating conductors. The potential of the floating conductor is the floating potential. The floating conductor is not connected to ground potential and power supply potential. Therefore, the plurality of first linear conductors 26 and the plurality of second linear conductors 28 are DC-coupled to none of the external electrodes 30a, 30b, 32a, 32b, 34a, 34b. More precisely, the plurality of first linear conductors 26 and the plurality of second linear conductors 28 are not DC-coupled to any external electrodes provided on the multilayer substrate 10 . Two conductors are not galvanically coupled means that no direct current can flow between the two conductors.
 以上のような外部電極30a,30bには、高周波信号が入出力する。外部電極32a,32b,34a,34bは、グランド電位に接続される。 High-frequency signals are input to and output from the external electrodes 30a and 30b as described above. The external electrodes 32a, 32b, 34a, 34b are connected to ground potential.
 ここで、複数の第1線状導体26と複数の第2線状導体28との位置関係について説明する。図1及び図2に示すように、隣り合う2個の第1線状導体26の間に位置する複数の領域を複数の第1領域A1と定義する。隣り合う2個の第2線状導体28の間に位置する複数の領域を複数の第2領域A2と定義する。複数の第1領域A1及び複数の第2領域A2のそれぞれは、長方形状を有している。本実施形態では、複数の第1領域A1、複数の第2領域A2、複数の第1線状導体26及び複数の第2線状導体28は、上下方向に見て、同じ形状を有している。従って、複数の第1線状導体26の線幅W1は、複数の第1線状導体26の配列の周期T1の半分である。複数の第2線状導体28の線幅W2は、複数の第2線状導体28の配列の周期T2の半分である。そして、線幅W1は、線幅W2と等しい。周期T1は、周期T2と等しい。 Here, the positional relationship between the plurality of first linear conductors 26 and the plurality of second linear conductors 28 will be described. As shown in FIGS. 1 and 2, a plurality of regions located between two adjacent first linear conductors 26 are defined as a plurality of first regions A1. A plurality of regions located between two adjacent second linear conductors 28 are defined as a plurality of second regions A2. Each of the plurality of first regions A1 and the plurality of second regions A2 has a rectangular shape. In the present embodiment, the plurality of first regions A1, the plurality of second regions A2, the plurality of first linear conductors 26, and the plurality of second linear conductors 28 have the same shape when viewed in the vertical direction. there is Accordingly, the line width W1 of the plurality of first linear conductors 26 is half the period T1 of the arrangement of the plurality of first linear conductors 26. As shown in FIG. The line width W2 of the plurality of second linear conductors 28 is half the period T2 of the arrangement of the plurality of second linear conductors 28 . The line width W1 is equal to the line width W2. Period T1 is equal to period T2.
 上下方向に見て、複数の第1領域A1のそれぞれに、複数の第2線状導体28の内のいずれか1個の第2線状導体28の少なくとも一部分が重なっている。また、上下方向に見て、複数の第2領域A2のそれぞれに、複数の第1線状導体26の内のいずれか1個の第1線状導体26の少なくとも一部分が重なっている。これにより、複数の第1線状導体26と複数の第2線状導体28とは、上下方向に見て、信号導体20が延びる方向に交互に並んでいる。本実施形態では、複数の第1線状導体26の線幅方向の中央C1のそれぞれは、複数の第2線状導体28の線幅方向の中央C2と重なっていない。更に、複数の第1領域A1の左右方向の中央C11のそれぞれは、複数の第2領域A2の左右方向の中央C12と重なっていない。左右方向は、第1線状導体26の線幅方向又は第2線状導体28の線幅方向である。 At least a portion of one of the plurality of second linear conductors 28 overlaps with each of the plurality of first regions A1 when viewed in the vertical direction. In addition, when viewed in the vertical direction, at least a portion of any one of the plurality of first linear conductors 26 overlaps with each of the plurality of second regions A2. As a result, the plurality of first linear conductors 26 and the plurality of second linear conductors 28 are arranged alternately in the direction in which the signal conductors 20 extend when viewed in the vertical direction. In the present embodiment, the centers C1 in the line width direction of the plurality of first linear conductors 26 do not overlap the centers C2 in the line width direction of the plurality of second linear conductors 28, respectively. Further, the centers C11 in the left-right direction of the plurality of first regions A1 do not overlap the centers C12 in the left-right direction of the plurality of second regions A2. The horizontal direction is the line width direction of the first linear conductor 26 or the line width direction of the second linear conductor 28 .
 ただし、複数の第1線状導体26の線幅方向の中央C1のそれぞれは、複数の第2領域A2の線幅方向の中央C12と重なっている。複数の第2線状導体28の線幅方向の中央C2のそれぞれは、複数の第1領域A1の線幅方向の中央C11と重なっている。これにより、上下方向に見て、複数の第1線状導体26は、左に位置する第2線状導体28及び右に位置する第2線状導体28と接するように隣り合っている。上下方向に見て、複数の第2線状導体28は、左に位置する第1線状導体26及び右に位置する第1線状導体26と接するように隣り合っている。換言すれば、複数の第1線状導体26は、上下方向に見て、複数の第2線状導体28と重なっていない。そして、上下方向に見て、複数の第1線状導体26と複数の第2線状導体28との間に隙間が存在しない。ただし、複数の第1線状導体26と複数の第2線状導体28とは、上下方向において互いに異なる位置に設けられている。そのため、複数の第1線状導体26と複数の第2線状導体28とは、実際に接しているわけではない。 However, the center C1 in the line width direction of the plurality of first linear conductors 26 overlaps the center C12 in the line width direction of the plurality of second regions A2. Each of the centers C2 in the line width direction of the plurality of second linear conductors 28 overlaps the centers C11 in the line width direction of the plurality of first regions A1. Thus, when viewed in the vertical direction, the plurality of first linear conductors 26 are adjacent to each other so as to be in contact with the second linear conductors 28 located on the left and the second linear conductors 28 located on the right. When viewed in the vertical direction, the plurality of second linear conductors 28 are adjacent to each other so as to be in contact with the first linear conductor 26 located on the left and the first linear conductor 26 located on the right. In other words, the multiple first linear conductors 26 do not overlap the multiple second linear conductors 28 when viewed in the vertical direction. When viewed in the vertical direction, there are no gaps between the plurality of first linear conductors 26 and the plurality of second linear conductors 28 . However, the plurality of first linear conductors 26 and the plurality of second linear conductors 28 are provided at different positions in the vertical direction. Therefore, the plurality of first linear conductors 26 and the plurality of second linear conductors 28 are not actually in contact with each other.
 ここで、図2に示すように、多層基板10において、信号導体20が複数の第1線状導体26又は複数の第2線状導体28と交差している区間を交差区間A22と定義する。多層基板10において、信号導体20が複数の第1線状導体26及び複数の第2線状導体28と交差していない区間を非交差区間A21,A23と定義する。非交差区間A21、交差区間A22及び非交差区間A23は、左から右へとこの順に並んでいる。 Here, as shown in FIG. 2, in the multilayer substrate 10, the section where the signal conductor 20 intersects the plurality of first linear conductors 26 or the plurality of second linear conductors 28 is defined as an intersection section A22. In the multilayer substrate 10, sections in which the signal conductor 20 does not cross the plurality of first linear conductors 26 and the plurality of second linear conductors 28 are defined as non-crossing sections A21 and A23. The non-crossing section A21, the crossing section A22, and the non-crossing section A23 are arranged in this order from left to right.
 図1に示すように、交差区間A22における信号導体20の線幅w2は、非交差区間A21における信号導体20の線幅w1及び非交差区間A23における信号導体20の線幅w3より太い。 As shown in FIG. 1, the line width w2 of the signal conductor 20 in the crossing section A22 is thicker than the line width w1 of the signal conductor 20 in the non-crossing section A21 and the line width w3 of the signal conductor 20 in the non-crossing section A23.
 グランド導体24aは、図1に示すように、積層体12に設けられている。より詳細には、グランド導体24aは、絶縁体層14aの上主面の左端近傍に設けられている。従って、グランド導体24aは、非交差区間A21に位置している。グランド導体24aは、外部電極32a,34aと組み合わさることにより、上下方向に見て、長方形状を有している。グランド導体24aは、信号導体20より上に位置している。グランド導体24aは、上下方向に見て、非交差区間A21において信号導体20と重なっている。ただし、グランド導体24aは、上下方向に見て、複数の第1線状導体26及び複数の第2線状導体28と重なっていない。 The ground conductor 24a is provided on the laminate 12 as shown in FIG. More specifically, the ground conductor 24a is provided near the left end of the upper main surface of the insulator layer 14a. Therefore, the ground conductor 24a is located in the non-intersecting section A21. The ground conductor 24a has a rectangular shape when viewed in the vertical direction by being combined with the external electrodes 32a and 34a. The ground conductor 24 a is positioned above the signal conductor 20 . The ground conductor 24a overlaps the signal conductor 20 in the non-intersecting section A21 when viewed in the vertical direction. However, the ground conductor 24a does not overlap the plurality of first linear conductors 26 and the plurality of second linear conductors 28 when viewed in the vertical direction.
 グランド導体24bは、図1に示すように、積層体12に設けられている。より詳細には、グランド導体24bは、絶縁体層14aの上主面の右端近傍に設けられている。従って、グランド導体24bは、非交差区間A23に位置している。グランド導体24bは、外部電極32b,34bと組み合わさることにより、上下方向に見て、長方形状を有している。グランド導体24bは、信号導体20より上に位置している。グランド導体24bは、上下方向に見て、非交差区間A23において信号導体20と重なっている。ただし、グランド導体24bは、上下方向に見て、複数の第1線状導体26及び複数の第2線状導体28と重なっていない。 The ground conductor 24b is provided on the laminate 12 as shown in FIG. More specifically, the ground conductor 24b is provided near the right end of the upper main surface of the insulator layer 14a. Therefore, the ground conductor 24b is located in the non-intersecting section A23. The ground conductor 24b is combined with the external electrodes 32b, 34b to have a rectangular shape when viewed in the vertical direction. The ground conductor 24b is located above the signal conductor 20. As shown in FIG. The ground conductor 24b overlaps the signal conductor 20 in the non-crossing section A23 when viewed in the vertical direction. However, the ground conductor 24b does not overlap the plurality of first linear conductors 26 and the plurality of second linear conductors 28 when viewed in the vertical direction.
 グランド導体25aは、図1に示すように、積層体12に設けられている。より詳細には、グランド導体25aは、絶縁体層14eの上主面の左端近傍に設けられている。従って、グランド導体25aは、非交差区間A21に位置している。グランド導体25aは、上下方向に見て、長方形状を有している。グランド導体25aは、信号導体20より下に位置している。グランド導体25aは、上下方向に見て、非交差区間A21において信号導体20と重なっている。ただし、グランド導体25aは、上下方向に見て、複数の第1線状導体26及び複数の第2線状導体28と重なっていない。 The ground conductor 25a is provided on the laminate 12 as shown in FIG. More specifically, the ground conductor 25a is provided near the left end of the upper main surface of the insulator layer 14e. Therefore, the ground conductor 25a is located in the non-intersecting section A21. The ground conductor 25a has a rectangular shape when viewed in the vertical direction. The ground conductor 25 a is positioned below the signal conductor 20 . The ground conductor 25a overlaps the signal conductor 20 in the non-intersecting section A21 when viewed in the vertical direction. However, the ground conductor 25a does not overlap the plurality of first linear conductors 26 and the plurality of second linear conductors 28 when viewed in the vertical direction.
 グランド導体25bは、図1に示すように、積層体12に設けられている。より詳細には、グランド導体25bは、絶縁体層14eの上主面の右端近傍に設けられている。従って、グランド導体25bは、非交差区間A23に位置している。グランド導体25bは、上下方向に見て、長方形状を有している。グランド導体25bは、信号導体20より下に位置している。グランド導体25bは、上下方向に見て、非交差区間A23において信号導体20と重なっている。ただし、グランド導体25bは、上下方向に見て、複数の第1線状導体26及び複数の第2線状導体28と重なっていない。以上のような信号導体20とグランド導体24a,25aとは、ストリップライン構造を有している。また、信号導体20とグランド導体24b,25bとは、ストリップライン構造を有している。 The ground conductor 25b is provided on the laminate 12 as shown in FIG. More specifically, the ground conductor 25b is provided near the right end of the upper main surface of the insulator layer 14e. Therefore, the ground conductor 25b is located in the non-intersecting section A23. The ground conductor 25b has a rectangular shape when viewed in the vertical direction. The ground conductor 25b is positioned below the signal conductor 20 . The ground conductor 25b overlaps the signal conductor 20 in the non-intersecting section A23 when viewed in the vertical direction. However, the ground conductor 25b does not overlap the plurality of first linear conductors 26 and the plurality of second linear conductors 28 when viewed in the vertical direction. The signal conductor 20 and the ground conductors 24a and 25a as described above have a stripline structure. Moreover, the signal conductor 20 and the ground conductors 24b and 25b have a stripline structure.
 第1グランド導体22a,22bは、図1に示すように、積層体12に設けられている。より詳細には、第1グランド導体22a,22bは、上下方向において信号導体20と同じ位置に設けられている。本実施形態では、第1グランド導体22a,22bは、絶縁体層14cの上主面に位置している。従って、第1グランド導体22a,22bは、上下方向に見て、信号導体20と重なっていない。第1グランド導体22a,22bは、線形状を有している。第1グランド導体22a,22bは、左右方向に延びている。そのため、第1グランド導体22a,22bは、上下方向に見て、信号導体20に沿って延びている。本実施形態では、第1グランド導体22a,22bは、上下方向に見て、信号導体20と平行である。第1グランド導体22aは、信号導体20の前に位置している。第1グランド導体22bは、信号導体20の後に位置している。 The first ground conductors 22a and 22b are provided on the laminate 12 as shown in FIG. More specifically, the first ground conductors 22a and 22b are provided at the same position as the signal conductor 20 in the vertical direction. In this embodiment, the first ground conductors 22a and 22b are located on the upper main surface of the insulator layer 14c. Therefore, the first ground conductors 22a and 22b do not overlap the signal conductor 20 when viewed in the vertical direction. The first ground conductors 22a, 22b have a linear shape. The first ground conductors 22a, 22b extend in the left-right direction. Therefore, the first ground conductors 22a and 22b extend along the signal conductor 20 when viewed in the vertical direction. In this embodiment, the first ground conductors 22a and 22b are parallel to the signal conductor 20 when viewed in the vertical direction. The first ground conductor 22 a is positioned in front of the signal conductor 20 . A first ground conductor 22b is positioned after the signal conductor 20 .
 第1グランド導体22a,22b及びグランド導体24a,24b,25a,25bが以上の構造を有することにより、信号導体20は、交差区間A22では、第1グランド導体22a,22b及びグランド導体24a,24b,25a,25b(1以上のグランド導体)と重なっていない。すなわち、信号導体20は、交差区間A22では、多層基板10が備えるいずれのグランド導体とも重なっていない。 Since the first ground conductors 22a, 22b and the ground conductors 24a, 24b, 25a, 25b have the structures described above, the signal conductor 20 is arranged in the intersecting section A22 such that the first ground conductors 22a, 22b, the ground conductors 24a, 24b, 25a, 25b (one or more ground conductors) do not overlap. That is, the signal conductor 20 does not overlap any of the ground conductors provided in the multilayer substrate 10 in the intersection section A22.
 また、複数の第1線状導体26のそれぞれは、上下方向に見て、第1グランド導体22a,22b(1以上のグランド導体の内の一部のグランド導体)と重なっている。より詳細には、複数の第1線状導体26の前部のそれぞれは、上下方向に見て、第1グランド導体22aと重なっている。複数の第1線状導体26の後部のそれぞれは、上下方向に見て、第1グランド導体22bと重なっている。 In addition, each of the plurality of first linear conductors 26 overlaps the first ground conductors 22a and 22b (a part of the one or more ground conductors) when viewed in the vertical direction. More specifically, each of the front portions of the plurality of first linear conductors 26 overlaps the first ground conductor 22a when viewed in the vertical direction. Each rear portion of the plurality of first linear conductors 26 overlaps the first ground conductor 22b when viewed in the vertical direction.
 複数の第2線状導体28のそれぞれは、上下方向に見て、第1グランド導体22a,22b(1以上のグランド導体の内の一部のグランド導体)と重なっている。より詳細には、複数の第2線状導体28の前部のそれぞれは、上下方向に見て、第1グランド導体22aと重なっている。複数の第2線状導体28の後部のそれぞれは、上下方向に見て、第1グランド導体22bと重なっている。 Each of the plurality of second linear conductors 28 overlaps the first ground conductors 22a and 22b (partial ground conductors among one or more ground conductors) when viewed in the vertical direction. More specifically, each of the front portions of the plurality of second linear conductors 28 overlaps the first ground conductor 22a when viewed in the vertical direction. Each rear portion of the plurality of second linear conductors 28 overlaps the first ground conductor 22b when viewed in the vertical direction.
 以上のように、第1グランド導体22a,22bは、上下方向において複数の第1線状導体26と複数の第2線状導体28との間に位置している。第1グランド導体22a,22bは、上下方向に見て、第1グランド導体22a,22b及びグランド導体24a,24b,25a,25b(1以上のグランド導体)の内の複数の第1線状導体26及び/又は複数の第2線状導体28と重なっているグランド導体である。 As described above, the first ground conductors 22a and 22b are positioned between the plurality of first linear conductors 26 and the plurality of second linear conductors 28 in the vertical direction. When viewed in the vertical direction, the first ground conductors 22a, 22b and the plurality of first linear conductors 26 among the first ground conductors 22a, 22b and the ground conductors 24a, 24b, 25a, 25b (one or more ground conductors) and/or a ground conductor that overlaps the plurality of second linear conductors 28 .
 層間接続導体v3は、絶縁体層14a~14dを上下方向に貫通している。層間接続導体v3は、外部電極32aと第1グランド導体22aの左端部とグランド導体24a,25aとを電気的に接続している。層間接続導体v4は、絶縁体層14a~14dを上下方向に貫通している。層間接続導体v4は、外部電極34aと第1グランド導体22bの左端部とグランド導体24a,25aとを電気的に接続している。 The interlayer connection conductor v3 penetrates the insulator layers 14a to 14d in the vertical direction. The interlayer connection conductor v3 electrically connects the external electrode 32a, the left end of the first ground conductor 22a, and the ground conductors 24a and 25a. The interlayer connection conductor v4 penetrates the insulator layers 14a to 14d in the vertical direction. The interlayer connection conductor v4 electrically connects the external electrode 34a, the left end of the first ground conductor 22b, and the ground conductors 24a and 25a.
 層間接続導体v5は、絶縁体層14a~14dを上下方向に貫通している。層間接続導体v5は、外部電極32bと第1グランド導体22aの右端部とグランド導体24b,25bとを電気的に接続している。層間接続導体v6は、絶縁体層14a~14dを上下方向に貫通している。層間接続導体v6は、外部電極34bと第1グランド導体22bの右端部とグランド導体24a,25aとを電気的に接続している。 The interlayer connection conductor v5 penetrates the insulator layers 14a to 14d in the vertical direction. The interlayer connection conductor v5 electrically connects the external electrode 32b, the right end portion of the first ground conductor 22a, and the ground conductors 24b and 25b. The interlayer connection conductor v6 penetrates the insulator layers 14a to 14d in the vertical direction. The interlayer connection conductor v6 electrically connects the external electrode 34b, the right end of the first ground conductor 22b, and the ground conductors 24a and 25a.
 保護層16は、絶縁体層14aの上主面に設けられている絶縁体層である。保護層16は、絶縁体層14aの略全面及びグランド導体24a,24bの略全面を覆っている。ただし、開口ha~hfが保護層16に設けられている。外部電極30a,32a,34a,30b,32b,34bのそれぞれは、開口ha~hfを介して多層基板10の外部に露出している。保護層16は、絶縁体層14aの上主面に塗布されるレジストである。ただし、保護層16は、絶縁体層14aの上に貼り付けられるカバーレイであってもよい。 The protective layer 16 is an insulator layer provided on the upper main surface of the insulator layer 14a. The protective layer 16 covers substantially the entire surface of the insulator layer 14a and substantially the entire surfaces of the ground conductors 24a and 24b. However, openings ha to hf are provided in protective layer 16 . Each of the external electrodes 30a, 32a, 34a, 30b, 32b, 34b is exposed to the outside of the multilayer substrate 10 through openings ha to hf. The protective layer 16 is a resist applied to the upper main surface of the insulator layer 14a. However, the protective layer 16 may be a coverlay applied over the insulator layer 14a.
 信号導体20、第1グランド導体22a,22b、グランド導体24a,24b,25a,25b、複数の第1線状導体26、複数の第2線状導体28及び外部電極30a,30b,32a,32b,34a,34bは、絶縁体層の主面に張り付けられた金属箔にパターニングが施されることにより形成された導体層である。金属箔は、例えば、銅箔である。層間接続導体v1~v6は、絶縁体層を貫通する貫通孔に導電性ペーストが充填され、加熱により導電性ペーストが固化することにより形成される。 A signal conductor 20, first ground conductors 22a, 22b, ground conductors 24a, 24b, 25a, 25b, a plurality of first linear conductors 26, a plurality of second linear conductors 28, and external electrodes 30a, 30b, 32a, 32b, 34a and 34b are conductor layers formed by patterning a metal foil attached to the main surface of the insulator layer. The metal foil is, for example, copper foil. The interlayer connection conductors v1 to v6 are formed by filling conductive paste into through-holes penetrating the insulator layers and solidifying the conductive paste by heating.
 ところで、図3に示すように、多層基板10を折り曲げて使用することができる。多層基板10を折り曲げるとは、多層基板10に外力を加えることにより、多層基板10を変形させることを意味する。変形は、弾性変形でもよいし、塑性変形でもよいし、弾性変形及び塑性変形でもよい。 By the way, as shown in FIG. 3, the multilayer substrate 10 can be used by being bent. Bending the multilayer substrate 10 means deforming the multilayer substrate 10 by applying an external force to the multilayer substrate 10 . The deformation may be elastic deformation, plastic deformation, or both elastic deformation and plastic deformation.
 多層基板10は、図3に示すように、第1区間A11と第2区間A12と第3区間A13とを有している。第1区間A11及び第3区間A13は、多層基板10が折れ曲がらない区間である。第2区間A12は、多層基板10が折れ曲がる区間である。従って、第2区間A12の曲率半径が第1区間A11の曲率半径及び第3区間A13の曲率半径より小さくなるように、第2区間A12が第1区間A11に対してZ軸方向に折れ曲がっている。Z軸方向は、第1区間A11における上下方向である。Z軸の正方向は、第1区間A11における上方向である。Z軸の負方向は、第1区間A11における下方向である。本実施形態では、第2区間A12は、第1区間A11に対してZ軸の正方向に折れ曲がっている。そして、交差区間A22は、第2区間A12に位置している。交差区間A22は、第2区間A12からはみ出していない。本実施形態では、交差区間A22は、第2区間A12と一致している。 The multilayer substrate 10 has a first section A11, a second section A12, and a third section A13, as shown in FIG. The first section A11 and the third section A13 are sections in which the multilayer substrate 10 is not bent. The second section A12 is a section where the multilayer substrate 10 is bent. Therefore, the second section A12 is bent in the Z-axis direction with respect to the first section A11 so that the radius of curvature of the second section A12 is smaller than the radius of curvature of the first section A11 and the radius of curvature of the third section A13. . The Z-axis direction is the vertical direction in the first section A11. The positive direction of the Z-axis is the upward direction in the first section A11. The negative direction of the Z-axis is the downward direction in the first section A11. In this embodiment, the second section A12 is bent in the positive direction of the Z-axis with respect to the first section A11. The intersection section A22 is located in the second section A12. The intersection section A22 does not protrude from the second section A12. In this embodiment, the intersection section A22 coincides with the second section A12.
[効果]
 (a)多層基板10によれば、信号導体20に発生する特性インピーダンスの変動を抑制できる。より詳細には、複数の第1線状導体26及び複数の第2線状導体28は、上下方向に見て、信号導体20と交差しており、上下方向に見て、互いに沿って延びている。そして、複数の第1線状導体26のそれぞれは、上下方向に見て、第1グランド導体22a,22bと重なっている。また、複数の第2線状導体28のそれぞれは、上下方向に見て、第1グランド導体22a,22bと重なっている。これにより、信号導体20は、複数の第1線状導体26及び複数の第2線状導体28を介してグランド導体と結合している。すなわち、信号導体20において複数の第1線状導体26と重なっている区間に発生する特性インピーダンス、及び、信号導体20において複数の第2線状導体28と重なっている区間に発生する特性インピーダンスは、所定の特性インピーダンス(例えば、50Ω)に近づく。
[effect]
(a) According to the multilayer substrate 10, fluctuations in characteristic impedance occurring in the signal conductor 20 can be suppressed. More specifically, the plurality of first linear conductors 26 and the plurality of second linear conductors 28 cross the signal conductors 20 when viewed vertically, and extend along each other when viewed vertically. there is Each of the plurality of first linear conductors 26 overlaps the first ground conductors 22a and 22b when viewed in the vertical direction. Moreover, each of the plurality of second linear conductors 28 overlaps the first ground conductors 22a and 22b when viewed in the vertical direction. Thereby, the signal conductor 20 is coupled to the ground conductor via the plurality of first linear conductors 26 and the plurality of second linear conductors 28 . That is, the characteristic impedance generated in the section of the signal conductor 20 overlapping with the plurality of first linear conductors 26 and the characteristic impedance generated in the section of the signal conductor 20 overlapping with the plurality of second linear conductors 28 are , approaches a given characteristic impedance (eg, 50Ω).
 ここで、信号導体20において複数の第1線状導体26と重なっている区間と、信号導体20において複数の第2線状導体28と重なっている区間とが、左右方向に大きく離れていると、信号導体20がグランド導体と結合していない区間が多くなる。信号導体20がグランド導体と結合していない区間の特性インピーダンスは、信号導体20がグランド導体と結合している区間の特性インピーダンスより高くなりやすい。その結果、信号導体20に発生すれる特性インピーダンスが変動しやすくなる。 Here, if the section of the signal conductor 20 overlapping the plurality of first linear conductors 26 and the section overlapping the plurality of second linear conductors 28 of the signal conductor 20 are far apart in the horizontal direction. , the section in which the signal conductor 20 is not coupled to the ground conductor increases. The characteristic impedance of the section where the signal conductor 20 is not coupled with the ground conductor tends to be higher than the characteristic impedance of the section where the signal conductor 20 is coupled with the ground conductor. As a result, the characteristic impedance generated in the signal conductor 20 tends to fluctuate.
 そこで、多層基板10では、上下方向に見て、隣り合う2個の第1線状導体26の間に位置する複数の第1領域A1のそれぞれに、複数の第2線状導体28の内のいずれか1個の第2線状導体28の少なくとも一部分が重なっている。また、上下方向に見て、隣り合う2個の第2線状導体28の間に位置する複数の第2領域A2のそれぞれに、複数の第1線状導体26の内のいずれか1個の第1線状導体26の少なくとも一部分が重なっている。これにより、信号導体20がグランド導体と結合していない区間が少なくなる。その結果、多層基板10によれば、信号導体20に発生する特性インピーダンスの変動を抑制できる。 Therefore, in the multilayer substrate 10, when viewed in the vertical direction, each of the plurality of first regions A1 located between the two adjacent first linear conductors 26 has one of the plurality of second linear conductors 28. At least a portion of any one second linear conductor 28 overlaps. Further, when viewed in the vertical direction, any one of the plurality of first linear conductors 26 is placed in each of the plurality of second regions A2 positioned between the two adjacent second linear conductors 28. At least a portion of the first linear conductor 26 overlaps. This reduces the sections in which the signal conductor 20 is not coupled to the ground conductor. As a result, according to the multilayer substrate 10, fluctuations in the characteristic impedance occurring in the signal conductor 20 can be suppressed.
 (b)多層基板10によれば、多層基板10を容易に折り曲げることができる。信号導体の上及び下のそれぞれに信号導体の略全体と重なるように2つのグランド導体が存在する多層基板を比較例に挙げる。このような多層基板では、多層基板を折り曲げようとすると、信号導体より外周側に位置するグランド導体では大きな伸びが発生し、信号導体より内周側に位置するグランド導体では大きな縮みが発生する。そのため、2つのグランド導体は、多層基板が折り曲げられることを妨げる。 (b) According to the multilayer substrate 10, the multilayer substrate 10 can be easily bent. A comparative example is a multilayer substrate in which two ground conductors exist above and below the signal conductor so as to overlap substantially the entire signal conductor. In such a multi-layer board, when the multi-layer board is bent, the ground conductor located on the outer peripheral side of the signal conductor expands greatly, and the ground conductor located on the inner peripheral side of the signal conductor contracts greatly. Therefore, the two ground conductors prevent the multilayer substrate from being bent.
 ここで、多層基板10では、第2区間A12が第1区間A11に対してZ軸方向に折れ曲がると、信号導体20より内周側に位置する複数の第2線状導体28では縮みが発生し、信号導体20より外周側に位置する複数の第1線状導体26では伸びが発生する。ただし、下方向に見て、隣り合う2個の第1線状導体26の間に位置する複数の第1領域A1のそれぞれに、複数の第2線状導体28の内のいずれか1個の第2線状導体28の少なくとも一部分が重なっている。また、上下方向に見て、隣り合う2個の第2線状導体28の間に位置する複数の第2領域A2のそれぞれに、複数の第1線状導体26の内のいずれか1個の第1線状導体26の少なくとも一部分が重なっている。このように、複数の第1線状導体26は、信号導体20の上において連続して存在していない。同様に、複数の第2線状導体28は、信号導体20の下において連続して存在していない。これにより、多層基板10が折り曲げられることが、複数の第1線状導体26及び複数の第2線状導体28により妨げられにくくなる。以上より、多層基板10によれば、多層基板10を容易に折り曲げることができる。 Here, in the multilayer substrate 10, when the second section A12 is bent in the Z-axis direction with respect to the first section A11, the plurality of second linear conductors 28 located inside the signal conductor 20 are contracted. , elongation occurs in the plurality of first linear conductors 26 located on the outer peripheral side of the signal conductor 20 . However, when viewed downward, any one of the plurality of second linear conductors 28 is placed in each of the plurality of first regions A1 positioned between the two adjacent first linear conductors 26. At least a portion of the second linear conductor 28 overlaps. Further, when viewed in the vertical direction, any one of the plurality of first linear conductors 26 is placed in each of the plurality of second regions A2 positioned between the two adjacent second linear conductors 28. At least a portion of the first linear conductor 26 overlaps. Thus, the plurality of first linear conductors 26 are not continuous on the signal conductor 20 . Similarly, the plurality of second linear conductors 28 are not continuous under the signal conductors 20 . This makes it difficult for the plurality of first linear conductors 26 and the plurality of second linear conductors 28 to prevent the multilayer substrate 10 from being bent. As described above, according to the multilayer substrate 10, the multilayer substrate 10 can be easily bent.
 (c)多層基板10によれば、以下の理由によっても、多層基板10を容易に折り曲げることができる。より詳細には、導体のような硬い物質が信号導体20から内周側又は外周側に離れた位置に設けられると、多層基板10の折り曲げが硬い物質により阻害される。そこで、多層基板10では、第1グランド導体22a,22bは、上下方向において複数の第1線状導体26と複数の第2線状導体28との間に位置している。これにより、第1グランド導体22a,22bは、信号導体20から内周側又は外周側に離れた位置に設けられなくなる。その結果、多層基板10を容易に折り曲げることができる。特に、第1グランド導体22a,22bは、上下方向において信号導体20と同じ位置に設けられている。そのため、多層基板10をより容易に折り曲げることができる。 (c) According to the multilayer substrate 10, the multilayer substrate 10 can be easily bent for the following reasons. More specifically, if a hard substance such as a conductor is provided at a position spaced from the signal conductor 20 toward the inner or outer circumference, the bending of the multilayer substrate 10 is hindered by the hard substance. Therefore, in the multilayer substrate 10, the first ground conductors 22a and 22b are positioned between the plurality of first linear conductors 26 and the plurality of second linear conductors 28 in the vertical direction. As a result, the first ground conductors 22a and 22b are no longer provided at positions spaced from the signal conductor 20 toward the inner or outer circumference. As a result, the multilayer substrate 10 can be easily bent. In particular, the first ground conductors 22a and 22b are provided at the same position as the signal conductor 20 in the vertical direction. Therefore, the multilayer substrate 10 can be folded more easily.
 (d)多層基板10によれば、以下の理由によっても、多層基板10を容易に折り曲げることができる。より詳細には、複数の第1線状導体26は、上下方向に見て、複数の第2線状導体28と重なっていない。これにより、多層基板10において、上下方向に第1線状導体26と第2線状導体28とが並ぶ区間が発生しなくなる。従って、多層基板10において、多層基板10が折れ曲がりにくい区間が発生しにくくなる。その結果、多層基板10を容易に折り曲げることができる。 (d) According to the multilayer substrate 10, the multilayer substrate 10 can be easily bent for the following reasons. More specifically, the multiple first linear conductors 26 do not overlap the multiple second linear conductors 28 when viewed in the vertical direction. As a result, a section in which the first linear conductor 26 and the second linear conductor 28 are arranged in the vertical direction does not occur in the multilayer substrate 10 . Therefore, in the multilayer substrate 10, a section in which the multilayer substrate 10 is difficult to bend is less likely to occur. As a result, the multilayer substrate 10 can be easily bent.
 (e)多層基板10によれば、多層基板10の上下方向の厚みが小さくなる。より詳細には、複数の第1線状導体26より上又は下に第1グランド導体22a,22bが位置する場合、複数の第1線状導体26より上又は下に第1グランド導体22a,22bを設けるための絶縁体層が必要である。この場合、多層基板10の絶縁体層の数が多くなるので、多層基板10の上下方向の厚みが大きくなる。そこで、多層基板10では、第1グランド導体22a,22bは、上下方向において複数の第1線状導体26と複数の第2線状導体28との間に位置している。これにより、複数の第1線状導体26より上又は下に第1グランド導体22a,22bを設けるための絶縁体層が不要である。以上より、多層基板10によれば、多層基板10の上下方向の厚みが小さくなる。 (e) According to the multilayer substrate 10, the vertical thickness of the multilayer substrate 10 is reduced. More specifically, when the first ground conductors 22a and 22b are positioned above or below the plurality of first linear conductors 26, the first ground conductors 22a and 22b are positioned above or below the plurality of first linear conductors 26. An insulator layer is required to provide the In this case, since the number of insulating layers of the multilayer substrate 10 is increased, the thickness of the multilayer substrate 10 in the vertical direction is increased. Therefore, in the multilayer substrate 10, the first ground conductors 22a and 22b are positioned between the plurality of first linear conductors 26 and the plurality of second linear conductors 28 in the vertical direction. This eliminates the need for an insulator layer for providing the first ground conductors 22 a and 22 b above or below the plurality of first linear conductors 26 . As described above, according to the multilayer substrate 10, the vertical thickness of the multilayer substrate 10 is reduced.
 (f)多層基板10によれば、以下の理由によっても、信号導体20に発生する特性インピーダンスの変動を抑制できる。より詳細には、非交差区間A21,A23のそれぞれにはグランド導体24a,25a,24b,25bが設けられている。交差区間A22には複数の第1線状導体26及び複数の第2線状導体28が設けられている。複数の第1線状導体26の間には第1領域A1が存在する。複数の第2線状導体28の間には第2領域A2が存在する。従って、非交差区間A21,A23において単位長さ当たりの信号導体20に発生する容量は、交差区間A22において単位長さ当たりの信号導体20に発生する容量よりも大きくなりやすい。そこで、図1に示すように、交差区間A22における信号導体20の線幅w2は、非交差区間A21における信号導体20の線幅w1及び非交差区間A23における信号導体20の線幅w3より太い。これにより、交差区間A22において単位長さ当たりの信号導体20に発生する容量は、非交差区間A21,A23において単位長さ当たりの信号導体20に発生する容量に近づく。その結果、多層基板10によれば、信号導体20に発生する特性インピーダンスの変動を抑制できる。 (f) According to the multilayer substrate 10, it is possible to suppress fluctuations in the characteristic impedance occurring in the signal conductor 20 for the following reasons. More specifically, ground conductors 24a, 25a, 24b, and 25b are provided in the non-intersecting sections A21 and A23, respectively. A plurality of first linear conductors 26 and a plurality of second linear conductors 28 are provided in the intersection section A22. A first region A<b>1 exists between the plurality of first linear conductors 26 . A second region A<b>2 exists between the plurality of second linear conductors 28 . Therefore, the capacitance generated in the signal conductor 20 per unit length in the non-crossing sections A21 and A23 tends to be larger than the capacitance generated in the signal conductor 20 per unit length in the crossing section A22. Therefore, as shown in FIG. 1, the line width w2 of the signal conductor 20 in the crossing section A22 is thicker than the line width w1 of the signal conductor 20 in the non-crossing section A21 and the line width w3 of the signal conductor 20 in the non-crossing section A23. As a result, the capacitance generated in the signal conductor 20 per unit length in the cross section A22 approaches the capacitance generated in the signal conductor 20 per unit length in the non-cross sections A21 and A23. As a result, according to the multilayer substrate 10, fluctuations in the characteristic impedance occurring in the signal conductor 20 can be suppressed.
(第1変形例)
 以下に、第1変形例に係る多層基板10aについて図面を参照しながら説明する。図4は、多層基板10aの断面図である。
(First modification)
A multilayer substrate 10a according to a first modified example will be described below with reference to the drawings. FIG. 4 is a cross-sectional view of the multilayer substrate 10a.
 多層基板10aは、上下方向に見て、複数の第1線状導体26のそれぞれが複数の第2線状導体28と重なっている点において、多層基板10と相違する。より詳細には、複数の第1線状導体26の左部のそれぞれは、上下方向に見て、複数の第2線状導体28の右部と重なっている。多層基板10aのその他の構造は、多層基板10と同じであるので説明を省略する。多層基板10aは、(a)~(c)、(e)及び(f)の効果を奏する。 The multilayer board 10a differs from the multilayer board 10 in that each of the plurality of first linear conductors 26 overlaps with the plurality of second linear conductors 28 when viewed in the vertical direction. More specifically, the left portions of the plurality of first linear conductors 26 each overlap the right portions of the plurality of second linear conductors 28 when viewed in the vertical direction. The rest of the structure of the multilayer substrate 10a is the same as that of the multilayer substrate 10, so the description is omitted. The multilayer substrate 10a has the effects (a) to (c), (e) and (f).
(第2変形例)
 以下に、第2変形例に係る多層基板10bについて図面を参照しながら説明する。図5は、多層基板10bの断面図である。
(Second modification)
A multilayer substrate 10b according to a second modified example will be described below with reference to the drawings. FIG. 5 is a cross-sectional view of the multilayer substrate 10b.
 多層基板10bは、上下方向に見て、複数の第1線状導体26の線幅W1は、複数の第2線状導体28の線幅W2より細い点において、多層基板10と相違する。このような多層基板10bでは、図3に示すように、第2区間A12は、第1区間A11に対してZ軸の正方向に折れ曲がっている。多層基板10bのその他の構造は、多層基板10と同じであるので説明を省略する。多層基板10bは、(a)~(f)の効果を奏する。 The multilayer substrate 10b differs from the multilayer substrate 10 in that the line width W1 of the plurality of first linear conductors 26 is thinner than the line width W2 of the plurality of second linear conductors 28 when viewed in the vertical direction. In such a multilayer substrate 10b, as shown in FIG. 3, the second section A12 is bent in the positive direction of the Z-axis with respect to the first section A11. The rest of the structure of the multilayer substrate 10b is the same as that of the multilayer substrate 10, so the description is omitted. The multilayer substrate 10b has the effects (a) to (f).
 多層基板10bによれば、第2区間A12が第1区間A11に対してZ軸の正方向に折れ曲がった場合に、第2区間A12において信号導体20に発生する特性インピーダンスが変動することが抑制される。より詳細には、多層基板10bでは、複数の第1線状導体26の線幅W1は、複数の第2線状導体28の線幅W2より細い。従って、第1領域A1の左右方向の幅は、第2領域A2の左右方向の幅より大きい。第2区間A12が第1区間A11に対してZ軸の正方向に折れ曲がると、複数の第1線状導体26は、複数の第2線状導体28より内周側に位置する。このとき、第1領域A1の左右方向の幅は小さくなる。一方、第2領域A2の左右方向の幅は大きくなる。そのため、第1領域A1の左右方向の幅は、第2領域A2の左右方向の幅に近づく。信号導体20において複数の第1線状導体26と重なっていない区間(第1領域A1)に発生する特性インピーダンスと、信号導体20において複数の第2線状導体28と重なっていない区間(第2領域A2)に発生する特性インピーダンスとの差が小さくなる。その結果、信号導体20に発生する特性インピーダンスの変動を抑制できる。 According to the multilayer substrate 10b, when the second section A12 is bent in the positive direction of the Z-axis with respect to the first section A11, fluctuations in the characteristic impedance generated in the signal conductor 20 in the second section A12 are suppressed. be. More specifically, in the multilayer substrate 10b, the line width W1 of the plurality of first linear conductors 26 is narrower than the line width W2 of the plurality of second linear conductors . Therefore, the lateral width of the first area A1 is greater than the lateral width of the second area A2. When the second section A12 bends in the positive direction of the Z-axis with respect to the first section A11, the plurality of first linear conductors 26 are located inside the plurality of second linear conductors 28. As shown in FIG. At this time, the width of the first area A1 in the left-right direction is reduced. On the other hand, the lateral width of the second area A2 increases. Therefore, the width in the horizontal direction of the first area A1 approaches the width in the horizontal direction of the second area A2. A characteristic impedance generated in a section (first region A1) of the signal conductor 20 that does not overlap the plurality of first linear conductors 26 and a section (second region A1) that does not overlap the plurality of second linear conductors 28 in the signal conductor 20 The difference from the characteristic impedance generated in the region A2) becomes small. As a result, fluctuations in the characteristic impedance occurring in the signal conductor 20 can be suppressed.
(第3変形例)
 以下に、第3変形例に係る多層基板10cについて図面を参照しながら説明する。図6は、多層基板10cの断面図である。
(Third modification)
A multilayer substrate 10c according to a third modified example will be described below with reference to the drawings. FIG. 6 is a cross-sectional view of the multilayer substrate 10c.
 多層基板10cは、上下方向に見て、複数の第1線状導体26のそれぞれが左及び右に位置する2つの第2線状導体28と重なっている点において、多層基板10と相違する。より詳細には、複数の第1線状導体26の左部のそれぞれは、上下方向に見て、複数の第2線状導体28の右部と重なっている。複数の第1線状導体26の右部のそれぞれは、上下方向に見て、複数の第2線状導体28の左部と重なっている。これにより、複数の第1領域A1のそれぞれは、上下方向に見て、複数の第2線状導体28と重なっている。複数の第2領域A2のそれぞれは、上下方向に見て、複数の第1線状導体26と重なっている。多層基板10cのその他の構造は、多層基板10と同じであるので説明を省略する。多層基板10cは、(a)~(c)、(e)及び(f)の効果を奏する。 The multilayer board 10c differs from the multilayer board 10 in that each of the plurality of first linear conductors 26 overlaps the two second linear conductors 28 located on the left and right when viewed in the vertical direction. More specifically, the left portions of the plurality of first linear conductors 26 each overlap the right portions of the plurality of second linear conductors 28 when viewed in the vertical direction. Each of the right portions of the plurality of first linear conductors 26 overlaps the left portions of the plurality of second linear conductors 28 when viewed in the vertical direction. Thereby, each of the plurality of first regions A1 overlaps the plurality of second linear conductors 28 when viewed in the vertical direction. Each of the plurality of second regions A2 overlaps the plurality of first linear conductors 26 when viewed in the vertical direction. The rest of the structure of the multilayer substrate 10c is the same as that of the multilayer substrate 10, so description thereof will be omitted. The multilayer substrate 10c has the effects (a) to (c), (e) and (f).
 また、多層基板10cによれば、信号導体20に発生する特性インピーダンスが、絶縁体層14a~14eの積層ずれによって変動することが抑制される。より詳細には、複数の第1線状導体26のそれぞれは、左及び右に位置する2つの第2線状導体28と重なっている。これにより、絶縁体層14a~14eの積層ずれが発生しても、複数の第1領域A1の全体のそれぞれは、上下方向に見て、複数の第2線状導体28と重なっている。複数の第2領域A2の全体のそれぞれは、上下方向に見て、複数の第1線状導体26と重なっている。その結果、第1領域A1において信号導体20に発生する特性インピーダンスが変動することが抑制される。同様に、第2領域A2において信号導体20に発生する特性インピーダンスが変動することが抑制される。多層基板10cによれば、信号導体20に発生する特性インピーダンスが、絶縁体層14a~14eの積層ずれによって変動することが抑制される。 Further, according to the multilayer substrate 10c, the characteristic impedance generated in the signal conductor 20 is suppressed from fluctuating due to lamination displacement of the insulator layers 14a to 14e. More specifically, each of the plurality of first linear conductors 26 overlaps two second linear conductors 28 located on the left and right. As a result, even if the insulating layers 14a to 14e are not stacked, the plurality of first regions A1 as a whole overlaps with the plurality of second linear conductors 28 when viewed in the vertical direction. Each of the plurality of second regions A2 as a whole overlaps with the plurality of first linear conductors 26 when viewed in the vertical direction. As a result, fluctuations in the characteristic impedance generated in the signal conductor 20 in the first region A1 are suppressed. Similarly, fluctuations in the characteristic impedance generated in the signal conductor 20 in the second area A2 are suppressed. According to the multilayer substrate 10c, the characteristic impedance generated in the signal conductor 20 is suppressed from fluctuating due to lamination displacement of the insulator layers 14a to 14e.
(第4変形例)
 以下に、第4変形例に係る多層基板10dについて図面を参照しながら説明する。図7は、多層基板10dの断面図である。
(Fourth modification)
A multilayer substrate 10d according to a fourth modification will be described below with reference to the drawings. FIG. 7 is a cross-sectional view of the multilayer substrate 10d.
 多層基板10dは、交差区間A22における積層体12の上下方向の厚みD12は、非交差区間A21における積層体12の上下方向の厚みD11及び非交差区間A23における積層体12の上下方向の厚みD13より小さい点において、多層基板10と相違する。非交差区間A21,A23では、絶縁体層14fが絶縁体層14aの上に積層されている。一方、交差区間A22では、絶縁体層14fが絶縁体層14aの上に積層されていない。多層基板10dのその他の構造は、多層基板10と同じであるので説明を省略する。多層基板10dは、(a)~(f)の効果を奏する。 In the multilayer substrate 10d, the vertical thickness D12 of the laminate 12 in the intersecting section A22 is obtained from the vertical thickness D11 of the laminate 12 in the non-intersecting section A21 and the vertical thickness D13 of the laminate 12 in the non-intersecting section A23. It differs from the multilayer substrate 10 in a small point. In the non-intersecting sections A21 and A23, the insulator layer 14f is laminated on the insulator layer 14a. On the other hand, in the intersection section A22, the insulator layer 14f is not stacked on the insulator layer 14a. The rest of the structure of the multilayer substrate 10d is the same as that of the multilayer substrate 10, so the description is omitted. The multilayer substrate 10d has the effects (a) to (f).
 多層基板10dによれば、非交差区間A21,A23をリジッド領域とし、交差区間A22を非リジッド領域として用いることが容易となる。リジッド領域は、非リジッド領域よりZ軸方向に折れ曲がりにくい。 According to the multilayer substrate 10d, it becomes easy to use the non-intersection sections A21 and A23 as rigid areas and the intersection section A22 as a non-rigid area. Rigid regions are less likely to bend in the Z-axis direction than non-rigid regions.
(第5変形例)
 以下に、第5変形例に係る多層基板10eについて図面を参照しながら説明する。図8は、多層基板10eの断面図である。
(Fifth modification)
A multilayer substrate 10e according to a fifth modification will be described below with reference to the drawings. FIG. 8 is a cross-sectional view of the multilayer substrate 10e.
 多層基板10eは、複数の第5線状導体60及び複数の第6線状導体62を更に備えている点において、多層基板10と相違する。複数の第5線状導体60及び複数の第6線状導体62は、上下方向に見て、信号導体20及び第1グランド導体22a,22bと交差している。複数の第5線状導体60は、複数の第1線状導体26より上に位置している。複数の第5線状導体60のそれぞれは、複数の第1領域A1の内のいずれか1個の第1領域A1と重なっている。複数の第5線状導体60の線幅W5は、複数の第1領域A1の左右方向の幅と同じである。複数の第6線状導体62は、複数の第2線状導体28より下に位置している。複数の第6線状導体62のそれぞれは、複数の第2領域A2の内のいずれか1個の第2領域A2と重なっている。複数の第6線状導体62の線幅W6は、複数の第2領域A2の左右方向の幅と同じである。以上のような複数の第5線状導体60及び複数の第6線状導体62は、外部電極のいずれとも直流的に結合していない。多層基板10eのその他の構造は、多層基板10と同じであるので説明を省略する。多層基板10eは、(a)~(c)、(e)及び(f)の効果を奏する。 The multilayer substrate 10 e differs from the multilayer substrate 10 in that it further includes a plurality of fifth linear conductors 60 and a plurality of sixth linear conductors 62 . The plurality of fifth linear conductors 60 and the plurality of sixth linear conductors 62 cross the signal conductor 20 and the first ground conductors 22a and 22b when viewed in the vertical direction. The plurality of fifth linear conductors 60 are positioned above the plurality of first linear conductors 26 . Each of the plurality of fifth linear conductors 60 overlaps with one of the plurality of first regions A1. The line width W5 of the plurality of fifth linear conductors 60 is the same as the width in the horizontal direction of the plurality of first regions A1. The multiple sixth linear conductors 62 are positioned below the multiple second linear conductors 28 . Each of the plurality of sixth linear conductors 62 overlaps with one of the plurality of second regions A2. The line width W6 of the plurality of sixth linear conductors 62 is the same as the width in the horizontal direction of the plurality of second regions A2. The plurality of fifth linear conductors 60 and the plurality of sixth linear conductors 62 as described above are not DC-coupled to any of the external electrodes. The rest of the structure of the multilayer substrate 10e is the same as that of the multilayer substrate 10, so the description is omitted. The multilayer substrate 10e has the effects (a) to (c), (e) and (f).
 多層基板10eによれば、複数の第5線状導体60の線幅W5は、複数の第1領域A1の左右方向の幅と同じである。従って、交差区間A22では、信号導体20の上には第1線状導体26又は第5線状導体60が存在する。そのため、交差区間A22では、下方向に見たときに、信号導体20の全体は、第1線状導体26及び第5線状導体60に覆われる。同様に、複数の第6線状導体62の線幅W6は、複数の第2領域A2の左右方向の幅と同じである。従って、交差区間A22では、信号導体20の下には第2線状導体28又は第6線状導体62が存在する。そのため、交差区間A22では、上向に見たときに、信号導体20の全体は、第2線状導体28及び第6線状導体62に覆われる。これにより、信号導体20に発生する特性インピーダンスが変動することが抑制されると共に、信号導体20のシールド性が向上する。 According to the multilayer substrate 10e, the line width W5 of the plurality of fifth linear conductors 60 is the same as the width in the horizontal direction of the plurality of first regions A1. Therefore, the first linear conductor 26 or the fifth linear conductor 60 exists above the signal conductor 20 in the intersection section A22. Therefore, in the intersection section A22, the entire signal conductor 20 is covered with the first linear conductor 26 and the fifth linear conductor 60 when viewed downward. Similarly, the line width W6 of the plurality of sixth linear conductors 62 is the same as the width in the horizontal direction of the plurality of second regions A2. Therefore, the second linear conductor 28 or the sixth linear conductor 62 exists under the signal conductor 20 in the cross section A22. Therefore, in the intersection section A22, the entire signal conductor 20 is covered with the second linear conductor 28 and the sixth linear conductor 62 when viewed upward. As a result, fluctuations in the characteristic impedance generated in the signal conductor 20 are suppressed, and the shielding performance of the signal conductor 20 is improved.
(第6変形例)
 以下に、第6変形例に係る多層基板10fについて図面を参照しながら説明する。図9は、多層基板10fの断面図である。
(Sixth modification)
A multilayer substrate 10f according to a sixth modification will be described below with reference to the drawings. FIG. 9 is a cross-sectional view of the multilayer substrate 10f.
 多層基板10fは、複数の第5線状導体60の線幅W5が複数の第1領域A1の左右方向の幅より細く、かつ、複数の第6線状導体62の線幅W6が複数の第2領域A2の左右方向の幅より細い点において、多層基板10eと相違する。このように、交差区間A22では、下方向に見たときに、第1線状導体26及び第5線状導体60に信号導体20が覆われない区間が存在してもよい。交差区間A22では、上方向に見たときに、第2線状導体28及び第6線状導体62に信号導体20が覆われない区間が存在してもよい。多層基板10fのその他の構造は、多層基板10eと同じであるので説明を省略する。多層基板10fは、(a)~(c)、(e)及び(f)の効果を奏する。 In the multilayer substrate 10f, the line width W5 of the plurality of fifth linear conductors 60 is narrower than the width of the plurality of first regions A1 in the horizontal direction, and the line width W6 of the plurality of sixth linear conductors 62 is greater than the width of the plurality of first regions A1. It differs from the multilayer substrate 10e in that it is narrower than the width of the two regions A2 in the horizontal direction. In this way, in the intersection section A22, there may be a section where the signal conductor 20 is not covered with the first linear conductor 26 and the fifth linear conductor 60 when viewed downward. In the intersection section A22, there may be a section where the signal conductor 20 is not covered with the second linear conductor 28 and the sixth linear conductor 62 when viewed upward. The rest of the structure of the multilayer substrate 10f is the same as that of the multilayer substrate 10e, so the description is omitted. The multilayer substrate 10f has the effects of (a) to (c), (e) and (f).
(第7変形例)
 以下に、第7変形例に係る多層基板10gについて図面を参照しながら説明する。図10は、多層基板10gの分解斜視図である。
(Seventh modification)
A multilayer substrate 10g according to a seventh modification will be described below with reference to the drawings. FIG. 10 is an exploded perspective view of the multilayer substrate 10g.
 多層基板10gは、上下方向に見て、複数の第1線状導体26及び複数の第2線状導体28が信号導体20と直交していない点において、多層基板10と相違する。多層基板10gの複数の第1線状導体26及び複数の第2線状導体28は、多層基板10の複数の第1線状導体26及び複数の第2線状導体28に対して反時計回りに45°回転した構造を有している。多層基板10gのその他の構造は、多層基板10と同じであるので説明を省略する。多層基板10gは、(a)~(f)の効果を奏する。 The multilayer substrate 10g differs from the multilayer substrate 10 in that the plurality of first linear conductors 26 and the plurality of second linear conductors 28 are not perpendicular to the signal conductors 20 when viewed in the vertical direction. The plurality of first linear conductors 26 and the plurality of second linear conductors 28 of the multilayer substrate 10g rotate counterclockwise with respect to the plurality of first linear conductors 26 and the plurality of second linear conductors 28 of the multilayer substrate 10. It has a structure rotated by 45°. The rest of the structure of the multilayer substrate 10g is the same as that of the multilayer substrate 10, so the description is omitted. The multilayer substrate 10g has the effects (a) to (f).
(第8変形例)
 以下に、第8形例に係る多層基板10hについて図面を参照しながら説明する。図11は、多層基板10hの分解斜視図である。
(Eighth modification)
A multilayer substrate 10h according to the eighth example will be described below with reference to the drawings. FIG. 11 is an exploded perspective view of the multilayer substrate 10h.
 多層基板10hは、複数の第3線状導体50及び複数の第4線状導体52を更に備えている点において、多層基板10gと相違する。複数の第1線状導体26と複数の第3線状導体50とは、メッシュ構造を形成している。複数の第2線状導体28と複数の第4線状導体52とは、メッシュ構造を形成している。 The multilayer substrate 10h differs from the multilayer substrate 10g in that it further includes a plurality of third linear conductors 50 and a plurality of fourth linear conductors 52. The plurality of first linear conductors 26 and the plurality of third linear conductors 50 form a mesh structure. The plurality of second linear conductors 28 and the plurality of fourth linear conductors 52 form a mesh structure.
 より詳細には、複数の第3線状導体50は、積層体12に設けられている。本実施形態では、複数の第3線状導体50は、絶縁体層14bの上主面に位置している。これにより、複数の第3線状導体50は、信号導体20より上に位置している。そして、複数の第3線状導体50は、信号導体20が延びる方向に並んでいる。複数の第3線状導体50は、上下方向に見て、信号導体20と交差している。 More specifically, the multiple third linear conductors 50 are provided on the laminate 12 . In this embodiment, the plurality of third linear conductors 50 are located on the upper main surface of the insulator layer 14b. Thereby, the plurality of third linear conductors 50 are positioned above the signal conductors 20 . The plurality of third linear conductors 50 are arranged in the direction in which the signal conductors 20 extend. The plurality of third linear conductors 50 intersect the signal conductors 20 when viewed in the vertical direction.
 このような複数の第3線状導体50は、上下方向に見て、互いに沿って延びている。本実施形態では、複数の第3線状導体50は、上下方向に見て、互いに平行である。ただし、複数の第3線状導体50は、上下方向に見て、複数の第1線状導体26と平行ではない。複数の第3線状導体50は、複数の第1線状導体26と直交している。ただし、複数の第3線状導体50は、複数の第1線状導体26と直交していなくてもよい。 Such a plurality of third linear conductors 50 extend along each other when viewed in the vertical direction. In this embodiment, the plurality of third linear conductors 50 are parallel to each other when viewed in the vertical direction. However, the plurality of third linear conductors 50 are not parallel to the plurality of first linear conductors 26 when viewed in the vertical direction. The multiple third linear conductors 50 are orthogonal to the multiple first linear conductors 26 . However, the plurality of third linear conductors 50 need not be orthogonal to the plurality of first linear conductors 26 .
 複数の第4線状導体52は、積層体12に設けられている。本実施形態では、複数の第4線状導体52は、絶縁体層14dの上主面に位置している。これにより、複数の第4線状導体52は、信号導体20より下に位置している。そして、複数の第4線状導体52は、信号導体20が延びる方向に並んでいる。複数の第4線状導体52は、上下方向に見て、信号導体20と交差している。 A plurality of fourth linear conductors 52 are provided on the laminate 12 . In this embodiment, the plurality of fourth linear conductors 52 are located on the upper main surface of the insulator layer 14d. Thereby, the plurality of fourth linear conductors 52 are positioned below the signal conductors 20 . The plurality of fourth linear conductors 52 are arranged in the direction in which the signal conductors 20 extend. The plurality of fourth linear conductors 52 intersect the signal conductors 20 when viewed in the vertical direction.
 このような複数の第4線状導体52は、上下方向に見て、互いに沿って延びている。本実施形態では、複数の第4線状導体52は、上下方向に見て、互いに平行である。ただし、複数の第4線状導体52は、上下方向に見て、複数の第2線状導体28と平行ではない。複数の第4線状導体52は、複数の第2線状導体28と直交している。 Such a plurality of fourth linear conductors 52 extend along each other when viewed in the vertical direction. In this embodiment, the plurality of fourth linear conductors 52 are parallel to each other when viewed in the vertical direction. However, the multiple fourth linear conductors 52 are not parallel to the multiple second linear conductors 28 when viewed in the vertical direction. The multiple fourth linear conductors 52 are orthogonal to the multiple second linear conductors 28 .
 以上のような複数の第3線状導体50と複数の第4線状導体52とは、上下方向に見て、信号導体20が延びる方向に交互に並んでいる。多層基板10hのその他の構造は、多層基板10gと同じであるので説明を省略する。多層基板10hは、(a)~(c)、(e)及び(f)の効果を奏する。 The plurality of third linear conductors 50 and the plurality of fourth linear conductors 52 as described above are arranged alternately in the direction in which the signal conductors 20 extend when viewed in the vertical direction. The rest of the structure of the multilayer substrate 10h is the same as that of the multilayer substrate 10g, so the description is omitted. The multilayer substrate 10h has the effects (a) to (c), (e) and (f).
(第9変形例)
 以下に、第9形例に係る多層基板10iについて図面を参照しながら説明する。図12は、多層基板10iの分解斜視図である。
(Ninth modification)
A multilayer substrate 10i according to the ninth example will be described below with reference to the drawings. FIG. 12 is an exploded perspective view of the multilayer substrate 10i.
 多層基板10iは、第1グランド導体22a,22bを備えていない点、グランド導体27a~27d,29a~29dを備えている点において、多層基板10hと相違する。複数の第1線状導体26及び複数の第3線状導体50は、絶縁体層14aの上主面に位置している。複数の第2線状導体28及び複数の第4線状導体52は、絶縁体層14eの上主面に位置している。 The multi-layer board 10i differs from the multi-layer board 10h in that the first ground conductors 22a and 22b are not provided and the ground conductors 27a-27d and 29a-29d are provided. The plurality of first linear conductors 26 and the plurality of third linear conductors 50 are located on the upper major surface of the insulator layer 14a. The plurality of second linear conductors 28 and the plurality of fourth linear conductors 52 are located on the upper major surface of the insulator layer 14e.
 グランド導体27a~27dは、絶縁体層14bの上主面に位置している。グランド導体27aは、グランド導体25aと同じ形状である。グランド導体27bは、グランド導体25bと同じ形状である。グランド導体27cは、左右方向に延びている。グランド導体27cは、グランド導体27aの右辺の前端部とグランド導体27bの左辺の前端部とを接続している。グランド導体27dは、左右方向に延びている。グランド導体27dは、グランド導体27aの右辺の後端部とグランド導体27bの左辺の後端部とを接続している。グランド導体27c,27dは、上下方向に見て、複数の第1線状導体26、複数の第2線状導体28、複数の第3線状導体50及び複数の第4線状導体52と重なっている。 The ground conductors 27a to 27d are located on the upper main surface of the insulator layer 14b. The ground conductor 27a has the same shape as the ground conductor 25a. The ground conductor 27b has the same shape as the ground conductor 25b. The ground conductor 27c extends in the left-right direction. The ground conductor 27c connects the front end of the right side of the ground conductor 27a and the front end of the left side of the ground conductor 27b. The ground conductor 27d extends in the left-right direction. The ground conductor 27d connects the rear end portion of the right side of the ground conductor 27a and the rear end portion of the left side of the ground conductor 27b. The ground conductors 27c and 27d overlap the plurality of first linear conductors 26, the plurality of second linear conductors 28, the plurality of third linear conductors 50, and the plurality of fourth linear conductors 52 when viewed in the vertical direction. ing.
 グランド導体29a~29dは、絶縁体層14dの上主面に位置している。グランド導体29aは、グランド導体25aと同じ形状である。グランド導体29bは、グランド導体25bと同じ形状である。グランド導体29cは、左右方向に延びている。グランド導体29cは、グランド導体29aの右辺の前端部とグランド導体29bの左辺の前端部とを接続している。グランド導体29dは、左右方向に延びている。グランド導体29dは、グランド導体29aの右辺の後端部とグランド導体29bの左辺の後端部とを接続している。グランド導体29c,29dは、上下方向に見て、複数の第1線状導体26、複数の第2線状導体28、複数の第3線状導体50及び複数の第4線状導体52と重なっている。 The ground conductors 29a to 29d are located on the upper main surface of the insulator layer 14d. The ground conductor 29a has the same shape as the ground conductor 25a. The ground conductor 29b has the same shape as the ground conductor 25b. The ground conductor 29c extends in the left-right direction. The ground conductor 29c connects the front end of the right side of the ground conductor 29a and the front end of the left side of the ground conductor 29b. The ground conductor 29d extends in the left-right direction. The ground conductor 29d connects the rear end portion of the right side of the ground conductor 29a and the rear end portion of the left side of the ground conductor 29b. The ground conductors 29c and 29d overlap the plurality of first linear conductors 26, the plurality of second linear conductors 28, the plurality of third linear conductors 50, and the plurality of fourth linear conductors 52 when viewed in the vertical direction. ing.
 多層基板10iが第1グランド導体22a,22bを備えていなくても、信号導体20は、複数の第1線状導体26、複数の第2線状導体28、複数の第3線状導体50及び複数の第4線状導体52を介して、グランド導体27a~27d,29a~29dと容量結合できる。多層基板10iのその他の構造は、多層基板10hと同じであるので説明を省略する。多層基板10iは、(a)~(c)、(e)及び(f)の効果を奏する。 Even if the multilayer substrate 10i does not include the first ground conductors 22a and 22b, the signal conductors 20 are composed of a plurality of first linear conductors 26, a plurality of second linear conductors 28, a plurality of third linear conductors 50 and Capacitive coupling with the ground conductors 27a to 27d and 29a to 29d can be achieved via the plurality of fourth linear conductors 52. FIG. The rest of the structure of the multilayer substrate 10i is the same as that of the multilayer substrate 10h, so the description is omitted. The multilayer substrate 10i has the effects (a) to (c), (e) and (f).
(第10変形例)
 以下に、第10形例に係る多層基板10jについて図面を参照しながら説明する。図13は、多層基板10jの分解斜視図である。
(Tenth Modification)
The multilayer substrate 10j according to the tenth example will be described below with reference to the drawings. FIG. 13 is an exploded perspective view of the multilayer substrate 10j.
 多層基板10jは、複数の第1線状導体26及び複数の第2線状導体28は、グランド電位に接続されている点において、多層基板10と相違する。より詳細には、多層基板10jは、接続導体70a,70b,72a,72bを更に備えている。接続導体70a,70bは、絶縁体層14bの上主面に設けられている。接続導体70a,70bは、左右方向に延びている。複数の第1線状導体26の前端は、接続導体70aに接続されている。複数の第1線状導体26の後端は、接続導体70bに接続されている。また、接続導体70aの左端は、層間接続導体v3に接続されている。接続導体70aの右端は、層間接続導体v5に接続されている。接続導体70bの左端は、層間接続導体v4に接続されている。接続導体70bの右端は、層間接続導体v6に接続されている。これにより、複数の第1線状導体26及び接続導体70a,70bは、グランド電位に接続されている。 The multilayer board 10j differs from the multilayer board 10 in that the plurality of first linear conductors 26 and the plurality of second linear conductors 28 are connected to the ground potential. More specifically, the multilayer substrate 10j further includes connection conductors 70a, 70b, 72a, 72b. The connection conductors 70a and 70b are provided on the upper main surface of the insulator layer 14b. The connection conductors 70a and 70b extend in the left-right direction. Front ends of the plurality of first linear conductors 26 are connected to the connection conductor 70a. The rear ends of the plurality of first linear conductors 26 are connected to the connection conductor 70b. The left end of the connection conductor 70a is connected to the interlayer connection conductor v3. The right end of the connection conductor 70a is connected to the interlayer connection conductor v5. The left end of the connection conductor 70b is connected to the interlayer connection conductor v4. The right end of the connection conductor 70b is connected to the interlayer connection conductor v6. Thereby, the plurality of first linear conductors 26 and the connection conductors 70a and 70b are connected to the ground potential.
 接続導体72a,72bは、絶縁体層14dの上主面に設けられている。接続導体72a,72bは、左右方向に延びている。複数の第2線状導体28の前端は、接続導体72aに接続されている。複数の第2線状導体28の後端は、接続導体72bに接続されている。また、接続導体72aの左端は、層間接続導体v3に接続されている。接続導体72aの右端は、層間接続導体v5に接続されている。接続導体72bの左端は、層間接続導体v4に接続されている。接続導体72bの右端は、層間接続導体v6に接続されている。これにより、複数の第2線状導体28及び接続導体72a,72bは、グランド電位に接続されている。多層基板10jのその他の構造は、多層基板10と同じであるので説明を省略する。多層基板10jは、(a)~(f)の効果を奏する。 The connection conductors 72a and 72b are provided on the upper main surface of the insulator layer 14d. The connection conductors 72a and 72b extend in the left-right direction. Front ends of the plurality of second linear conductors 28 are connected to the connection conductor 72a. The rear ends of the plurality of second linear conductors 28 are connected to the connection conductor 72b. The left end of the connection conductor 72a is connected to the interlayer connection conductor v3. The right end of the connection conductor 72a is connected to the interlayer connection conductor v5. The left end of the connection conductor 72b is connected to the interlayer connection conductor v4. The right end of the connection conductor 72b is connected to the interlayer connection conductor v6. Thereby, the plurality of second linear conductors 28 and the connection conductors 72a and 72b are connected to the ground potential. Other structures of the multilayer substrate 10j are the same as those of the multilayer substrate 10, so description thereof is omitted. The multilayer substrate 10j has the effects (a) to (f).
(第11変形例)
 以下に、第11形例に係る多層基板10kについて図面を参照しながら説明する。図14は、多層基板10kの分解斜視図である。
(11th modification)
The multilayer substrate 10k according to the eleventh example will be described below with reference to the drawings. FIG. 14 is an exploded perspective view of the multilayer substrate 10k.
 多層基板10kは、複数の第1線状導体26、複数の第2線状導体28、複数の第3線状導体50及び複数の第4線状導体52が、グランド電位に接続されている点において、多層基板10iと相違する。より詳細には、多層基板10kは、14a,14eを備えていない。グランド導体24a,24bは、絶縁体層14bの上主面に位置している。複数の第1線状導体26及び複数の第3線状導体50は、グランド導体24a,24bに接続されている。グランド導体25a,25bは、絶縁体層14dの上主面に位置している。複数の第2線状導体28及び複数の第4線状導体52は、グランド導体25a,25bに接続されている。これにより、複数の第1線状導体26、複数の第2線状導体28、複数の第3線状導体50及び複数の第4線状導体52は、グランド電位に接続されている。多層基板10kのその他の構造は、多層基板10iと同じであるので説明を省略する。多層基板10kは、(a)~(c)、(e)及び(f)の効果を奏する。 In the multilayer substrate 10k, the plurality of first linear conductors 26, the plurality of second linear conductors 28, the plurality of third linear conductors 50, and the plurality of fourth linear conductors 52 are connected to the ground potential. is different from the multilayer substrate 10i. More specifically, multilayer substrate 10k does not include 14a and 14e. The ground conductors 24a, 24b are located on the upper main surface of the insulator layer 14b. The multiple first linear conductors 26 and the multiple third linear conductors 50 are connected to the ground conductors 24a and 24b. The ground conductors 25a, 25b are located on the upper main surface of the insulator layer 14d. The plurality of second linear conductors 28 and the plurality of fourth linear conductors 52 are connected to ground conductors 25a and 25b. Thereby, the plurality of first linear conductors 26, the plurality of second linear conductors 28, the plurality of third linear conductors 50, and the plurality of fourth linear conductors 52 are connected to the ground potential. The rest of the structure of the multilayer substrate 10k is the same as that of the multilayer substrate 10i, so the description is omitted. The multilayer substrate 10k has the effects (a) to (c), (e) and (f).
(第12変形例)
 以下に、第12形例に係る多層基板10lについて図面を参照しながら説明する。図15は、多層基板10lの分解斜視図である。
(Twelfth modification)
A multilayer substrate 10l according to the twelfth example will be described below with reference to the drawings. FIG. 15 is an exploded perspective view of the multilayer substrate 10l.
 多層基板10lは、絶縁体層14a,14eが存在しない点において、多層基板10と相違する。グランド導体24a,24bは、絶縁体層14bの上主面に位置している。グランド導体25a,25bは、絶縁体層14dの上主面に位置している。多層基板10lのその他の構造は、多層基板10と同じであるので説明を省略する。多層基板10lは、(a)~(f)の効果を奏する。 The multilayer substrate 10l differs from the multilayer substrate 10 in that the insulator layers 14a and 14e do not exist. The ground conductors 24a, 24b are located on the upper main surface of the insulator layer 14b. The ground conductors 25a, 25b are located on the upper main surface of the insulator layer 14d. The rest of the structure of the multilayer substrate 10l is the same as that of the multilayer substrate 10, so the description is omitted. The multilayer substrate 10l has the effects (a) to (f).
 また、多層基板10lによれば、絶縁体層14a,14eが存在しないので、多層基板10lの上下方向の厚みが更に小さくなる。 Also, according to the multilayer substrate 10l, since the insulator layers 14a and 14e do not exist, the thickness of the multilayer substrate 10l in the vertical direction is further reduced.
(第13変形例)
 以下に、第13形例に係る多層基板10mについて図面を参照しながら説明する。図16は、多層基板10mの分解斜視図である。
(13th modification)
The multilayer substrate 10m according to the thirteenth example will be described below with reference to the drawings. FIG. 16 is an exploded perspective view of the multilayer substrate 10m.
 多層基板10mは、信号導体22の線幅が均一である点において、多層基板10と相違する。より詳細には、交差区間A22における信号導体20の線幅w2は、非交差区間A21における信号導体20の線幅w1及び非交差区間A23における信号導体20の線幅w3と等しい。多層基板10mのその他の構造は、多層基板10と同じであるので説明を省略する。多層基板10mは、(a)~(f)の効果を奏する。 The multilayer substrate 10m differs from the multilayer substrate 10 in that the line width of the signal conductors 22 is uniform. More specifically, the line width w2 of the signal conductor 20 in the cross section A22 is equal to the line width w1 of the signal conductor 20 in the non-cross section A21 and the line width w3 of the signal conductor 20 in the non-cross section A23. The rest of the structure of the multilayer substrate 10m is the same as that of the multilayer substrate 10, so the description is omitted. The multilayer substrate 10m has the effects (a) to (f).
(その他の実施形態)
 本発明に係る多層基板は、多層基板10,10a~10mに限らず、その要旨の範囲内において変更可能である。また、多層基板10,10a~10mの構造を任意に組み合わせてもよい。
(Other embodiments)
The multilayer substrate according to the present invention is not limited to the multilayer substrates 10, 10a to 10m, and can be modified within the scope of the gist thereof. Also, the structures of the multilayer substrates 10, 10a to 10m may be combined arbitrarily.
 なお、多層基板10,10a~10i,10l,10mは、複数のグランド導体を備えている。しかしながら、多層基板10,10a~10i,10l,10mは、1以上のグランド導体を備えていればよい。 The multilayer substrates 10, 10a to 10i, 10l, and 10m are equipped with a plurality of ground conductors. However, the multilayer substrates 10, 10a-10i, 10l, 10m only need to have one or more ground conductors.
 なお、多層基板10,10a~10mの積層体12は、可撓性を有していなくてもよい。 Note that the laminate 12 of the multilayer substrates 10, 10a to 10m does not have to be flexible.
 なお、絶縁体層14a~14fの材料は、熱可塑性樹脂以外の樹脂であってもよい。また、絶縁体層14a~14fの材料は、樹脂以外の絶縁材料であってもよい。樹脂以外の絶縁材料は、例えば、セラミックスが挙げられる。 The material of the insulator layers 14a to 14f may be resin other than thermoplastic resin. Also, the material of the insulator layers 14a to 14f may be an insulating material other than resin. Examples of insulating materials other than resin include ceramics.
 なお、複数の第1線状導体26の数は、2以上であればよい。複数の第2線状導体28の数は、2以上であればよい。複数の第3線状導体50の数は、2以上であればよい。複数の第4線状導体52の数は、2以上であればよい。 It should be noted that the number of the plurality of first linear conductors 26 should be two or more. The number of the plurality of second linear conductors 28 should be two or more. The number of the plurality of third linear conductors 50 should be two or more. The number of fourth linear conductors 52 may be two or more.
 なお、多層基板10,10a~10mは、複数の外部電極を備えている。しかしながら、多層基板10,10a~10mは、1以上の外部電極を備えていればよい。 The multilayer substrates 10, 10a-10m are provided with a plurality of external electrodes. However, the multilayer substrates 10, 10a-10m only need to have one or more external electrodes.
 なお、多層基板10,10a~10mでは、第2区間A12の曲率半径が第1区間A11の曲率半径より小さくなるように、第2区間A12が第1区間A11に対してZ軸方向に折れ曲がっていればよい。従って、第2区間A12は、Z軸方向に折れ曲がっていてもよい。 In the multilayer substrates 10, 10a to 10m, the second section A12 is bent in the Z-axis direction with respect to the first section A11 so that the radius of curvature of the second section A12 is smaller than the radius of curvature of the first section A11. All you have to do is Therefore, the second section A12 may be bent in the Z-axis direction.
 なお、第1グランド導体22a,22bは、上下方向において複数の第1線状導体26と複数の第2線状導体28との間に位置していなくてもよい。 Note that the first ground conductors 22a and 22b do not have to be positioned between the plurality of first linear conductors 26 and the plurality of second linear conductors 28 in the vertical direction.
 なお、複数の第1線状導体26は、上下方向において同じ位置に設けられていなくてもよい。従って、複数の第1線状導体26は、複数の絶縁体層の主面に分散して位置していてもよい。 Note that the plurality of first linear conductors 26 do not have to be provided at the same position in the vertical direction. Therefore, the plurality of first linear conductors 26 may be dispersedly positioned on the main surfaces of the plurality of insulator layers.
 なお、複数の第2線状導体28は、上下方向において同じ位置に設けられていなくてもよい。従って、複数の第2線状導体28は、複数の絶縁体層の主面に分散して位置していてもよい。 Note that the plurality of second linear conductors 28 do not have to be provided at the same position in the vertical direction. Therefore, the plurality of second linear conductors 28 may be dispersedly positioned on the main surfaces of the plurality of insulator layers.
 なお、第2区間A12は、交差区間A22と一致していなくてもよい。例えば、第2区間A12は、交差区間A22に加えて、非交差区間A21,A23の一部分を含んでいてもよい。 It should be noted that the second section A12 does not have to match the intersection section A22. For example, the second section A12 may include portions of the non-crossing sections A21 and A23 in addition to the crossing section A22.
 なお、多層基板10a~10lの信号導体22の線幅は、多層基板10mの信号導体22の線幅と同様に、均一であってもよい。 The line width of the signal conductors 22 of the multilayer substrates 10a to 10l may be uniform, like the line width of the signal conductors 22 of the multilayer substrate 10m.
10,10a~10m:多層基板
12:積層体
14a~14f:絶縁体層
16:保護層
20:信号導体
22a,22b:第1グランド導体
24a,24b,25a,25b:グランド導体
26:第1線状導体
28:第2線状導体
30a,30b,32a,32b,34a,34b:外部電極
50:第3線状導体
52:第4線状導体
60:第5線状導体
62:第6線状導体
70a,70b,72a,72b:接続導体
A1:第1領域
A11:第1区間
A12:第2区間
A13:第3区間
A2:第2領域
A21,A23:非交差区間
A22:交差区間
C1,C2,C11,C12:中央
v1~v6:層間接続導体
10, 10a to 10m: multilayer substrate 12: laminates 14a to 14f: insulator layer 16: protective layer 20: signal conductors 22a, 22b: first ground conductors 24a, 24b, 25a, 25b: ground conductors 26: first line Conductor 28: Second linear conductors 30a, 30b, 32a, 32b, 34a, 34b: External electrode 50: Third linear conductor 52: Fourth linear conductor 60: Fifth linear conductor 62: Sixth linear Conductors 70a, 70b, 72a, 72b: Connection conductor A1: First area A11: First section A12: Second section A13: Third section A2: Second area A21, A23: Non-intersecting section A22: Intersecting section C1, C2 , C11, C12: center v1 to v6: interlayer connection conductor

Claims (17)

  1.  多層基板であって、
     複数の絶縁体層が上下方向に積層された構造を有する積層体と、
     前記積層体に設けられており、かつ、線形状を有する信号導体と、
     前記積層体に設けられており、かつ、前記信号導体より上に位置しており、かつ、上下方向に見て、前記信号導体と交差している複数の第1線状導体と、
     前記積層体に設けられており、かつ、前記信号導体より下に位置しており、かつ、上下方向に見て、前記信号導体と交差している複数の第2線状導体と、
     を備えており、
     前記複数の第2線状導体は、上下方向に見て、前記複数の第1線状導体に沿って延びており、
     上下方向に見て、隣り合う2個の前記第1線状導体の間に位置する複数の第1領域のそれぞれに、前記複数の第2線状導体の内のいずれか1個の第2線状導体の少なくとも一部分が重なっており、
     上下方向に見て、隣り合う2個の前記第2線状導体の間に位置する複数の第2領域のそれぞれに、前記複数の第1線状導体の内のいずれか1個の第1線状導体の少なくとも一部分が重なっており、
     (A)又は(B)の構造を有している、
     多層基板。
    (A)
     前記多層基板は、
     前記積層体に設けられており、かつ、外部回路と電気的に接続される1以上の外部電極と、
     1以上のグランド導体を、
     更に備えており、
     前記複数の第1線状導体及び前記複数の第2線状導体は、前記1以上の外部電極のいずれとも直流的に結合しておらず、
     前記信号導体が前記複数の第1線状導体又は前記複数の第2線状導体と交差している区間を交差区間と定義し、
     前記信号導体は、前記交差区間では、前記1以上のグランド導体と重なっておらず、
     前記複数の第1線状導体のそれぞれは、上下方向に見て、前記1以上のグランド導体の内の一部のグランド導体と重なっており、
     前記複数の第2線状導体のそれぞれは、上下方向に見て、前記1以上のグランド導体の内の一部のグランド導体と重なっている。
    (B)
     前記複数の第1線状導体及び前記複数の第2線状導体は、グランド電位に接続されている。
    A multilayer substrate,
    a laminate having a structure in which a plurality of insulator layers are stacked vertically;
    a signal conductor provided in the laminate and having a linear shape;
    a plurality of first linear conductors provided in the laminate, positioned above the signal conductor, and crossing the signal conductor when viewed in the vertical direction;
    a plurality of second linear conductors provided in the laminate, positioned below the signal conductor, and crossing the signal conductor when viewed in the vertical direction;
    and
    The plurality of second linear conductors extend along the plurality of first linear conductors when viewed in the vertical direction,
    Any one of the plurality of second linear conductors is provided in each of the plurality of first regions positioned between the two adjacent first linear conductors when viewed in the vertical direction. at least a portion of the conductors overlap, and
    Any one of the plurality of first linear conductors is provided in each of the plurality of second regions positioned between the two adjacent second linear conductors when viewed in the vertical direction. at least a portion of the conductors overlap, and
    having the structure of (A) or (B),
    multilayer board.
    (A)
    The multilayer substrate is
    one or more external electrodes provided on the laminate and electrically connected to an external circuit;
    one or more ground conductors;
    It is also equipped with
    The plurality of first linear conductors and the plurality of second linear conductors are not DC-coupled to any of the one or more external electrodes,
    A section in which the signal conductor crosses the plurality of first linear conductors or the plurality of second linear conductors is defined as an intersection section,
    the signal conductor does not overlap the one or more ground conductors in the cross section;
    each of the plurality of first linear conductors overlaps a part of the one or more ground conductors when viewed in the vertical direction;
    Each of the plurality of second linear conductors overlaps a part of the one or more ground conductors when viewed in the vertical direction.
    (B)
    The plurality of first linear conductors and the plurality of second linear conductors are connected to a ground potential.
  2.  前記多層基板は、第1区間と第2区間とを有しており、
     前記第2区間の曲率半径が前記第1区間の曲率半径より小さくなるように、前記第2区間が前記第1区間に対して前記第1区間における上下方向に折れ曲がっており、
     前記交差区間は、前記第2区間に位置している、
     請求項1に記載の多層基板。
    The multilayer substrate has a first section and a second section,
    The second section is bent in the vertical direction of the first section with respect to the first section such that the radius of curvature of the second section is smaller than the radius of curvature of the first section,
    The intersection section is located in the second section,
    The multilayer substrate according to claim 1.
  3.  前記第2区間は、前記第1区間に対して前記第1区間における上方向に折れ曲がっており、
     前記複数の第1線状導体の線幅は、前記複数の第2線状導体の線幅より細い、
     請求項2に記載の多層基板。
    The second section is bent upward in the first section with respect to the first section,
    The line width of the plurality of first linear conductors is thinner than the line width of the plurality of second linear conductors,
    The multilayer substrate according to claim 2.
  4.  前記信号導体が前記複数の第1線状導体及び前記複数の第2線状導体と交差していない区間を非交差区間と定義し、
     前記交差区間における前記積層体の上下方向の厚みは、前記非交差区間における前記積層体の上下方向の厚みより小さい、
     請求項1ないし請求項3のいずれかに記載の多層基板。
    A section in which the signal conductor does not intersect the plurality of first linear conductors and the plurality of second linear conductors is defined as a non-intersecting section,
    The vertical thickness of the laminate in the intersecting section is smaller than the vertical thickness of the laminate in the non-intersecting section,
    4. The multilayer substrate according to any one of claims 1 to 3.
  5.  前記複数の第1線状導体は、上下方向に見て、前記信号導体と直交している、
     請求項1ないし請求項4のいずれかに記載の多層基板。
    The plurality of first linear conductors are orthogonal to the signal conductors when viewed in the vertical direction.
    The multilayer substrate according to any one of claims 1 to 4.
  6.  前記多層基板は、
     前記積層体に設けられており、かつ、前記信号導体より上に位置しており、かつ、前記信号導体が延びる方向に並んでいる複数の第3線状導体を、
     更に備えており、
     前記複数の第3線状導体は、上下方向に見て、互いに沿って延びており、かつ、上下方向に見て、前記複数の第1線状導体と平行ではなく、かつ、上下方向に見て、前記信号導体と交差している、
     請求項1ないし請求項4のいずれかに記載の多層基板。
    The multilayer substrate is
    a plurality of third linear conductors provided in the laminate, positioned above the signal conductors, and aligned in a direction in which the signal conductors extend;
    It is also equipped with
    The plurality of third linear conductors extend along each other when viewed in the vertical direction, and are not parallel to the plurality of first linear conductors when viewed in the vertical direction. crosses the signal conductors;
    The multilayer substrate according to any one of claims 1 to 4.
  7.  前記多層基板は、
     前記積層体に設けられており、かつ、前記信号導体より下に位置しており、かつ、前記信号導体が延びる方向に並んでいる複数の第4線状導体を、
     更に備えており、
     前記複数の第4線状導体は、上下方向に見て、互いに沿って延びており、かつ、上下方向に見て、前記複数の第2線状導体と平行ではなく、かつ、上下方向に見て、前記信号導体と交差しており、
     前記複数の第3線状導体と前記複数の第4線状導体とは、上下方向に見て、前記信号導体が延びる方向に交互に並んでいる、
     請求項6に記載の多層基板。
    The multilayer substrate is
    a plurality of fourth linear conductors provided in the laminate, positioned below the signal conductors, and aligned in the direction in which the signal conductors extend;
    It is also equipped with
    The plurality of fourth linear conductors extend along each other when viewed in the vertical direction, and are not parallel to the plurality of second linear conductors when viewed in the vertical direction. and intersect the signal conductors,
    The plurality of third linear conductors and the plurality of fourth linear conductors are arranged alternately in the direction in which the signal conductors extend when viewed in the vertical direction.
    The multilayer substrate according to claim 6.
  8.  上下方向に見て、前記1以上のグランド導体の内の前記複数の第1線状導体及び/又は前記複数の第2線状導体と重なっている第1グランド導体は、上下方向において前記複数の第1線状導体と前記複数の第2線状導体との間に位置している、
     請求項1ないし請求項7のいずれかに記載の多層基板。
    When viewed in the vertical direction, the first ground conductor overlapping the plurality of first linear conductors and/or the plurality of second linear conductors among the one or more ground conductors positioned between the first linear conductor and the plurality of second linear conductors;
    A multilayer substrate according to any one of claims 1 to 7.
  9.  前記第1グランド導体は、上下方向において前記信号導体と同じ位置に設けられており、
     前記第1グランド導体は、上下方向に見て、前記信号導体に沿って延びている、
     請求項8に記載の多層基板。
    The first ground conductor is provided at the same position as the signal conductor in the vertical direction,
    The first ground conductor extends along the signal conductor when viewed in the vertical direction.
    The multilayer substrate according to claim 8.
  10.  前記複数の第1線状導体の線幅は、前記複数の第1線状導体の配列の周期の半分である、
     請求項1ないし請求項9のいずれかに記載の多層基板。
    The line width of the plurality of first linear conductors is half the period of the arrangement of the plurality of first linear conductors.
    10. The multilayer substrate according to any one of claims 1 to 9.
  11.  前記多層基板は、
     前記積層体に設けられており、かつ、前記複数の第1線状導体より上に位置しており、かつ、上下方向に見て、前記信号導体と交差している複数の第5線状導体と、
     前記積層体に設けられており、かつ、前記複数の第2線状導体より下に位置しており、かつ、上下方向に見て、前記信号導体と交差している複数の第6線状導体と、
     前記複数の第5線状導体のそれぞれは、前記複数の第1領域の内のいずれか1個の第1領域と重なっており、
     前記複数の第6線状導体のそれぞれは、前記複数の第2領域の内のいずれか1個の第2領域と重なっている、
     請求項1ないし請求項10のいずれかに記載の多層基板。
    The multilayer substrate is
    A plurality of fifth linear conductors provided in the laminate, positioned above the plurality of first linear conductors, and crossing the signal conductors when viewed in the vertical direction. and,
    A plurality of sixth linear conductors provided in the laminate, positioned below the plurality of second linear conductors, and crossing the signal conductors when viewed in the vertical direction. and,
    each of the plurality of fifth linear conductors overlaps with one of the plurality of first regions,
    Each of the plurality of sixth linear conductors overlaps any one of the plurality of second regions,
    A multilayer substrate according to any one of claims 1 to 10.
  12.  前記複数の絶縁体層の材料は、樹脂である、
     請求項1ないし請求項11のいずれかに記載の多層基板。
    The material of the plurality of insulator layers is resin,
    A multilayer substrate according to any one of claims 1 to 11.
  13.  前記複数の絶縁体層の材料は、熱可塑性樹脂である、
     請求項12に記載の多層基板。
    The material of the plurality of insulator layers is a thermoplastic resin,
    The multilayer substrate according to claim 12.
  14.  前記複数の第1線状導体の線幅方向の中央のそれぞれは、前記複数の第2線状導体の線幅方向の中央と重なっていない、
     請求項1ないし請求項13のいずれかに記載の多層基板。
    Centers in the line width direction of the plurality of first linear conductors do not overlap centers in the line width direction of the plurality of second linear conductors,
    A multilayer substrate according to any one of claims 1 to 13.
  15.  前記複数の第1領域の線幅方向の中央のそれぞれは、前記複数の第2領域の線幅方向の中央と重なっていない、
     請求項1ないし請求項14のいずれかに記載の多層基板。
    Each of the centers in the line width direction of the plurality of first regions does not overlap the centers in the line width direction of the plurality of second regions,
    A multilayer substrate according to any one of claims 1 to 14.
  16.  前記複数の第1線状導体は、上下方向に見て、前記複数の第2線状導体と重なっていない、
     請求項1ないし請求項15のいずれかに記載の多層基板。
    The plurality of first linear conductors do not overlap the plurality of second linear conductors when viewed in the vertical direction,
    16. A multilayer substrate according to any one of claims 1 to 15.
  17.  前記複数の第1線状導体は、上下方向において同じ位置に設けられている、
     請求項1ないし請求項16のいずれかに記載の多層基板。
    The plurality of first linear conductors are provided at the same position in the vertical direction,
    17. A multilayer substrate according to any one of claims 1 to 16.
PCT/JP2022/040905 2021-11-15 2022-11-01 Multilayer board WO2023085177A1 (en)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060071739A1 (en) * 2004-10-04 2006-04-06 Jimmy Hsu Signal transmission structure
WO2011007660A1 (en) * 2009-07-13 2011-01-20 株式会社村田製作所 Signal line and circuit board
US20150055307A1 (en) * 2013-08-23 2015-02-26 Seagate Technology Llc Windowed Reference Planes for Embedded Conductors

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060071739A1 (en) * 2004-10-04 2006-04-06 Jimmy Hsu Signal transmission structure
WO2011007660A1 (en) * 2009-07-13 2011-01-20 株式会社村田製作所 Signal line and circuit board
US20150055307A1 (en) * 2013-08-23 2015-02-26 Seagate Technology Llc Windowed Reference Planes for Embedded Conductors

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