WO2023084283A1 - Matériaux d'oxyde épitaxial, structures et dispositifs - Google Patents

Matériaux d'oxyde épitaxial, structures et dispositifs Download PDF

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Publication number
WO2023084283A1
WO2023084283A1 PCT/IB2021/060466 IB2021060466W WO2023084283A1 WO 2023084283 A1 WO2023084283 A1 WO 2023084283A1 IB 2021060466 W IB2021060466 W IB 2021060466W WO 2023084283 A1 WO2023084283 A1 WO 2023084283A1
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WIPO (PCT)
Prior art keywords
semiconductor structure
crystal
epitaxial oxide
oxide layer
epitaxial
Prior art date
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PCT/IB2021/060466
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English (en)
Inventor
Petar Atanackovic
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Silanna UV Technologies Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from PCT/IB2021/060413 external-priority patent/WO2023084274A1/fr
Priority claimed from PCT/IB2021/060414 external-priority patent/WO2023084275A1/fr
Application filed by Silanna UV Technologies Pte Ltd filed Critical Silanna UV Technologies Pte Ltd
Priority to US17/652,028 priority Critical patent/US11522103B1/en
Priority to US17/652,019 priority patent/US20230143766A1/en
Priority to US17/652,031 priority patent/US11563093B1/en
Priority to US17/658,510 priority patent/US20230143918A1/en
Priority to US17/658,506 priority patent/US11522087B1/en
Priority to US17/658,501 priority patent/US11489090B1/en
Priority to US17/658,515 priority patent/US11637013B1/en
Priority to US17/664,569 priority patent/US20230142940A1/en
Priority to US17/664,577 priority patent/US20230142457A1/en
Priority to TW111141647A priority patent/TW202327095A/zh
Publication of WO2023084283A1 publication Critical patent/WO2023084283A1/fr
Priority to US18/480,323 priority patent/US20240072205A1/en
Priority to US18/480,334 priority patent/US20240055560A1/en

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    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/10—Inorganic compounds or compositions
    • C30B29/16—Oxides
    • C30B29/22—Complex oxides
    • C30B29/26—Complex oxides with formula BMe2O4, wherein B is Mg, Ni, Co, Al, Zn, or Cd and Me is Fe, Ga, Sc, Cr, Co, or Al
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B23/00—Single-crystal growth by condensing evaporated or sublimed materials
    • C30B23/02—Epitaxial-layer growth
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/60—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape characterised by shape
    • C30B29/68—Crystals with laminate structure, e.g. "superlattices"
    • H—ELECTRICITY
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    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
    • H01L29/24—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only semiconductor materials not provided for in groups H01L29/16, H01L29/18, H01L29/20, H01L29/22
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H01L29/772—Field effect transistors
    • H01L29/778—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface
    • H01L29/7786—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface with direct single heterostructure, i.e. with wide bandgap layer formed on top of active layer, e.g. direct single heterostructure MIS-like HEMT
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/16—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular crystal structure or orientation, e.g. polycrystalline, amorphous or porous
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/26—Materials of the light emitting region
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/08—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
    • H01L29/0843—Source or drain regions of field-effect devices
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    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/08—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
    • H01L29/0895—Tunnel injectors
    • H—ELECTRICITY
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    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/40—Electrodes ; Multistep manufacturing processes therefor
    • H01L29/402—Field plates
    • H—ELECTRICITY
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    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/40—Electrodes ; Multistep manufacturing processes therefor
    • H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
    • H01L29/417—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions carrying the current to be rectified, amplified or switched
    • H01L29/41725—Source or drain electrodes for field effect devices
    • H01L29/41758—Source or drain electrodes for field effect devices for lateral devices with structured layout for source or drain region, i.e. the source or drain region having cellular, interdigitated or ring structure or being curved or angular
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/40—Electrodes ; Multistep manufacturing processes therefor
    • H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
    • H01L29/417—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions carrying the current to be rectified, amplified or switched
    • H01L29/41725—Source or drain electrodes for field effect devices
    • H01L29/41766—Source or drain electrodes for field effect devices with at least part of the source or drain electrode having contact below the semiconductor surface, e.g. the source or drain electrode formed at least partially in a groove or with inclusions of conductor inside the semiconductor
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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/40—Electrodes ; Multistep manufacturing processes therefor
    • H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
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    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007—Multistep manufacturing processes
    • H01L29/66969—Multistep manufacturing processes of devices having semiconductor bodies not comprising group 14 or group 13/15 materials
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H01L29/772—Field effect transistors
    • H01L29/78—Field effect transistors with field effect produced by an insulated gate

Definitions

  • the following publications are referred to in the present application and their contents are hereby incorporated by reference in their entirety: • U.S. Patent No.9,412,911 titled “OPTICAL TUNING OF LIGHT EMITTING SEMICONDUCTOR JUNCTIONS”, issued 9 August 2016, and assigned to the applicant of the present application; • U.S.
  • Patent No.9,691,938 titled “ADVANCED ELECTRONIC DEVICE STRUCTURES USING SEMICONDUCTOR STRUCTURES AND SUPERLATTICES”, issued 27 June 2017, and assigned to the applicant of the present application; • U.S. Patent No.10,475,956 titled “OPTOELECTRONIC DEVICE”, issued 12 November 2019, and assigned to the applicant of the present application; and [0004] The contents of each of the above publications are expressly incorporated by reference in their entirety.
  • Electronic and optoelectronic devices such as diodes, transistors, photodetectors, LEDs and lasers can use epitaxial semiconductor structures to control the transport of free carriers, detect light, or generate light.
  • UV light emitting devices have many applications in medicine, medical diagnostics, water purification, food processing, sterilization, aseptic packaging and deep submicron lithographic processing. Emerging applications in bio-sensing, communications, pharmaceutical process industry and materials manufacturing are also enabled by delivering extremely short wavelength optical sources in a compact and lightweight package having high electrical conversion efficiency such as a UVLED.
  • Electro-optical conversion of electrical energy into discrete optical wavelengths with extremely high efficiency has generally been achieved using a semiconductor having the required properties to achieve the spatial recombination of charge carriers of electrons and holes to emit light of the required wavelength.
  • UVLEDs have been developed using almost exclusively Gallium-Indium-Aluminum-Nitride (GaInAlN) compositions forming wurtzite-type crystal structures.
  • GaInAlN Gallium-Indium-Aluminum-Nitride
  • high power RF switches are used to separate, amplify and filter transmitted and received signals in a transceiver of a wireless communication system. A requirement of transistor devices making up such RF switches are the ability to handle high voltages without being damaged.
  • Typical RF switches use transistor devices employing low bandgap semiconductors (e.g., Si or GaAs) with relatively low breakdown voltages (e.g., below about 3 V), and therefore many transistor devices are connected in series to withstand the required voltages.
  • Low bandgap semiconductors e.g., Si or GaAs
  • Wider bandgap semiconductors e.g., GaN
  • An added benefit of using wider bandgap semiconductors such as GaN in RF switches is the ability to simplify the impedance matching with microwave circuits.
  • a semiconductor structure includes an epitaxial oxide material.
  • a semiconductor structure includes two or more epitaxial oxide materials with different properties, such as compositions, crystal symmetries, or bandgaps.
  • the semiconductor structures can comprise one or more epitaxial oxide layers formed on a compatible substrate with in-plane lattice parameters and atomic positions that provide a suitable template for the growth of the epitaxial oxide materials.
  • one or more of the epitaxial oxide materials is strained.
  • one or more of the epitaxial oxide materials is doped n- or p-type.
  • the semiconductor structure comprises a superlattice with epitaxial oxide materials.
  • the semiconductor structure comprises a chirp layer with epitaxial oxide materials.
  • the semiconductor structures described herein can be a portion of a semiconductor device, such as an optoelectronic device with wavelengths ranging from infra-red to deep-ultraviolet, a light emitting diode, a laser diode, a photodetector, a solar cell, a high- power diode, a high-power transistor, a transducer, or a high electron mobility transistor.
  • the semiconductor device has a high breakdown voltage due to the properties of the epitaxial oxide materials therein.
  • the semiconductor device uses impact ionization mechanisms for carrier multiplication.
  • FIG.1 is process flow diagram for constructing a metal oxide semiconductor- based LED in accordance with an illustrative embodiment of the present disclosure.
  • FIGS.2A and 2B depict schematically two classes of LED devices based on vertical and waveguide optical confinement and emission disposed upon a substrate in accordance with illustrative embodiments of the present disclosure.
  • FIGS.3A-3E are schematic diagrams of different LED device configurations in accordance with illustrative embodiments of the present disclosure comprising a plurality of regions.
  • FIG.4 depicts schematically the injection of oppositely charged carriers from physically separated regions into a recombination region in accordance with an illustrative embodiment of the present disclosure.
  • FIG.5 shows the optical emission directions possible from the emission region of an LED in accordance with an illustrative embodiment of the present disclosure.
  • FIG.6 depicts an aperture through an opaque region to enable light emission from an LED in accordance with an illustrative embodiment of the present disclosure.
  • FIG.7 shows example selection criteria to construct a metal oxide semiconductor structure in accordance with an illustrative embodiment of the present disclosure.
  • FIG.8 is an example process flow diagram for selecting and depositing epitaxially a metal oxide structure in accordance with an illustrative embodiment of the present disclosure.
  • FIG.9 is a summary of technologically relevant semiconductor bandgaps as a function of electron affinity, showing relative band lineups.
  • FIG.10 is an example schematic process flow for depositing a plurality of layers for forming a plurality of regions comprising an LED in accordance with an illustrative embodiment of the present disclosure.
  • FIG.11 is a ternary alloy optical bandgap tuning curve for metal oxide semiconductor ternary compositions based on Gallium-Oxide in accordance with illustrative embodiments of the present disclosure.
  • FIG.12 is a ternary alloy optical bandgap tuning curve for metal oxide semiconductor ternary compositions based on Aluminum-Oxide in accordance with illustrative embodiments of the present disclosure.
  • FIGS.13A and 13B are electron energy-vs.-crystal momentum representations of metal oxide based optoelectronic semiconductors showing a direct bandgap (FIG.13A) and indirect bandgap (FIG.13B) in accordance with illustrative embodiments of the present disclosure.
  • FIGS.14A and 14B depict sequential deposition of a plurality of heterogenous metal oxide semiconductor layers having dissimilar crystal symmetry types to embed an optical emission region in accordance with an illustrative embodiment of the present disclosure.
  • FIG.15 is a schematic representation of an atomic deposition tool for the creation of multi-layered metal oxide semiconductor films comprising a plurality of material compositions in accordance with illustrative embodiments of the present disclosure.
  • FIG.16 is a representation of sequential deposition of layers and regions having similar crystal symmetry types matching the substrate in accordance with an illustrative embodiment of the present disclosure.
  • FIG.17 depicts sequential deposition of regions having a different crystal symmetry to an underlying first surface of a substrate where a surface modification to the substrate is shown in accordance with an illustrative embodiment of the present disclosure.
  • FIG.18 depicts a buffer layer deposited with the same crystal symmetry as an underlying substrate to enable subsequent hetero-symmetry deposition of oxide materials in accordance with an illustrative embodiment of the present disclosure.
  • FIG.19 depicts a structure comprising a plurality of hetero-symmetrical regions sequentially deposited as a function of the growth direction in accordance with an illustrative embodiment of the present disclosure.
  • FIG.20A shows a crystal symmetry transition region linking two deposited crystal symmetry types in accordance with an illustrative embodiment of the present disclosure.
  • FIG.20B shows the variation in a particular crystal surface energy as a function of crystal surface orientation for the cases of corundum-Sapphire and monoclinic Gallia single crystal oxide materials in accordance with an illustrative embodiment of the present disclosure.
  • FIGS.21A-21C depict schematically the change in electronic energy configuration or band structure of a metal oxide semiconductor under the influence of bi-axial strain applied to the crystal unit cell in accordance with an illustrative embodiment of the present disclosure.
  • FIGS.22A and 22B depict schematically the change in band structure of a metal oxide semiconductor under the influence of uniaxial strain applied to the crystal unit cell in accordance with an illustrative embodiment of the present disclosure.
  • FIGS.23A-23C show the effect on the band structure of monoclinic gallium- oxide as a function of applied uniaxial strain to the crystal unit cell in accordance with an illustrative embodiment of the present disclosure.
  • FIGS.24A and 24B depict the E-k electronic configuration of two dissimilar binary metal oxides in accordance with an illustrative embodiment of the present disclosure: one having a wide direct-bandgap material and the other a narrow indirect-bandgap material.
  • FIGS.25A-25C show the effect of valence band mixing of two binary dissimilar metal oxide materials that together form a ternary metal oxide alloy in accordance with an illustrative embodiment of the present disclosure.
  • FIG.26 depicts schematically a portion of the energy-vs-crystal momentum of dominant valence bands sourced from two bulk-like metal oxide semiconductor materials up to the first Brillouin zone in accordance with an illustrative embodiment of the present disclosure.
  • FIGS.27A-27B show an effect of a superlattice (SL) in one dimension on the E-k configuration for a layered structure having a superlattice period equal to approximately twice the bulk lattice constant of the host metal oxide semiconductors, depicting the creation of a superlattice Brillouin-zone that opens an artificial bandgap at a zone center in accordance with an illustrative embodiment of the present disclosure.
  • SL superlattice
  • FIG.27C shows a bi-layered binary superlattice comprising a plurality of thin epitaxial layers of Al 2 O 3 and Ga 2 O 3 repeating with a fixed unit cell period where the digital alloy simulates an equivalent ternary Al x Ga 1-x O 3 bulk alloy depending on the constituent layer thickness ratio of the superlattice period in accordance with an illustrative embodiment of the present disclosure.
  • FIG.27D shows another bi-layered binary superlattice comprising a plurality of thin epitaxial layers of NiO and Ga 2 O 3 repeating with a fixed unit cell period where the digital alloy simulates an equivalent ternary (NiO) x (Ga 2 O 3 ) 1-x bulk alloy depending on the constituent layer thickness ratio of the superlattice period in accordance with an illustrative embodiment of the present disclosure.
  • FIG.27E shows yet another triple material binary superlattice comprising a plurality of thin epitaxial layers of MgO, NiO repeating with a fixed unit cell period where the digital alloy simulates an equivalent ternary bulk alloy (NiO) x (MgO) 1-x depending on the constituent layer thickness ratio of the superlattice period and where the binary metal oxides used for the repeating unit are each selected to vary from between 1 to 10 unit cells in thickness respectively to together comprise the unit cell of the SL in accordance with an illustrative embodiment of the present disclosure.
  • the digital alloy simulates an equivalent ternary bulk alloy (NiO) x (MgO) 1-x depending on the constituent layer thickness ratio of the superlattice period
  • the binary metal oxides used for the repeating unit are each selected to vary from between 1 to 10 unit cells in thickness respectively to together comprise the unit cell of the SL in accordance with an illustrative embodiment of the present disclosure.
  • FIG.27F shows yet another possible four-material binary superlattice comprising plurality of thin epitaxial layers of MgO, NiO and Ga 2 O 3 repeating with a fixed unit cell period where the digital alloy simulates an equivalent quaternary bulk alloy (NiO)x(Ga 2 O 3 )y(MgO)z depending on the constituent layer thickness ratio of the superlattice period where the binary metal oxides used for the repeating unit are each selected to vary from between 1 to 10 unit cells in thickness respectively to comprise the unit cell of the SL in accordance with an illustrative embodiment of the present disclosure.
  • FIG.28 shows a chart of ternary metal oxide combinations that may be adopted in accordance with various illustrative embodiments of the present disclosure in the forming of optoelectronic devices.
  • FIG.29 is an example design flow diagram for tuning and constructing optoelectronic functionality of LED regions in accordance with an illustrative embodiment of the present disclosure.
  • FIG.30 shows a heterojunction band lineup for the binary Al 2 O 3 , ternary alloy (Al,Ga)O 3 and binary Ga 2 O 3 semiconducting oxides in accordance with an illustrative embodiment of the present disclosure.
  • FIG.31 shows a 3-dimensional crystal unit cell of corundum symmetry crystal structure (alpha-phase) Al 2 O 3 used to calculate the E-k band structure in accordance with an illustrative embodiment of the present disclosure.
  • FIG.32A and 32B show a calculated energy-momentum configuration of alpha- Al 2 O 3 in the vicinity of the Brillouin zone center in accordance with an illustrative embodiment of the present disclosure.
  • FIG.33 shows a 3-dimensional crystal unit cell of a monoclinic symmetry crystal structure Al 2 O 3 used to calculate the E-k band structure in accordance with an illustrative embodiment of the present disclosure.
  • FIGS.34A and 34B show calculated energy-momentum configurations of theta- Al 2 O 3 in the vicinity of the Brillouin zone center in accordance with an illustrative embodiment of the present disclosure.
  • FIG.35 shows a 3-dimensional crystal unit cell of a corundum symmetry crystal structure (alpha-phase) Ga 2 O 3 used to calculate the E-k band structure in accordance with an illustrative embodiment of the present disclosure.
  • FIGS.36A and 36B show calculated energy-momentum configurations of corundum alpha-Ga 2 O 3 in the vicinity of the Brillouin zone center in accordance with an illustrative embodiment of the present disclosure.
  • FIG.37 shows a 3-dimensional crystal unit cell of a monoclinic symmetry crystal structure (beta-phase) Ga 2 O 3 used to calculate the E-k band structure in accordance with an illustrative embodiment of the present disclosure.
  • FIGS.38A and 38B show calculated energy-momentum configurations of beta- Ga 2 O 3 in the vicinity of the Brillouin zone center in accordance with an illustrative embodiment of the present disclosure.
  • FIG.39 shows a 3-dimensional crystal unit cell of an orthorhombic symmetry crystal structure of bulk ternary alloy of (Al, Ga)O 3 used to calculate the E-k band structure in accordance with an illustrative embodiment of the present disclosure.
  • FIG.40 shows a calculated energy-momentum configuration of (Al, Ga)O 3 in the vicinity of the Brillouin zone center showing a direct bandgap in accordance with an illustrative embodiment of the present disclosure.
  • FIG.41 is a process flow diagram for forming an optoelectronic semiconductor device in accordance with an illustrative embodiment of the present disclosure.
  • FIG.42 depicts a cross-sectional portion of a (Al,Ga)O 3 ternary structure formed by sequentially depositing Al-O-Ga-O-...-O-Al epilayers along a growth direction in accordance with an illustrative embodiment of the present disclosure.
  • FIG.43A shows in TABLE I a selection of substrate crystals for depositing metal oxide structures in accordance with various illustrative embodiments of the present disclosure.
  • FIG.43B shows in TABLE II unit cell parameters of a selection of metal oxides in accordance with various illustrative embodiments of the present disclosure, showing lattice constant mismatches between Al 2 O 3 and Ga 2 O 3 .
  • FIG.44A depicts a calculated formation energy of Aluminum-Gallium-Oxide ternary alloy as a function of composition and crystal symmetry in accordance with an illustrative embodiment of the present disclosure.
  • FIG.44B shows an experimental high-resolution x-ray diffraction (HRXRD) of two example distinct compositions of high-quality single crystal ternary (Al x Ga 1-x ) 2 O 3 deposited epitaxially on a bulk (010)-oriented Ga 2 O 3 substrate in accordance with an illustrative embodiment of the present disclosure.
  • HRXRD high-resolution x-ray diffraction
  • FIG.44C shows an experimental HRXRD and x-ray grazing incidence reflection (GIXR) of an example superlattice comprising repeating unit cells of bilayers selected from a [(Al x Ga 1-x ) 2 O 3 / Ga 2 O 3 ] elastically strained to a ⁇ -Ga 2 O 3 (010)-oriented substrate in accordance with an illustrative embodiment of the present disclosure.
  • FIG.44D shows an experimental HRXRD and GIXR of two example distinct compositions of high-quality single crystal ternary (AlxGa 1-x ) 2 O 3 layers deposited epitaxially on a bulk (001)-oriented Ga 2 O 3 substrate in accordance with an illustrative embodiment of the present disclosure.
  • FIG.44E shows an experimental HRXRD and GIXR of a superlattice comprising repeating unit cells of bilayers selected from a [(Al x Ga 1-x ) 2 O 3 / Ga 2 O 3 ] elastically strained to a ⁇ - Ga 2 O 3 (001)-oriented substrate in accordance with an illustrative embodiment of the present disclosure.
  • FIG.44F shows an experimental HRXRD and GIXR of a cubic crystal symmetry binary Nickel Oxide (NiO) epilayer elastically strained to a monoclinic crystal symmetry ⁇ - Ga 2 O 3 (001)-oriented substrate in accordance with an illustrative embodiment of the present disclosure.
  • NiO Nickel Oxide
  • FIG.44G shows an experimental HRXRD and GIXR of a monoclinic crystal symmetry Ga 2 O 3 (100)-oriented epilayer elastically strained to a cubic crystal symmetry MgO(100)-oriented substrate in accordance with an illustrative embodiment of the present disclosure.
  • FIG.44H shows an experimental HRXRD and GIXR of a superlattice comprising repeating unit cells of bilayers selected from a [(Al x Er 1-x ) 2 O 3 / Al 2 O 3 ] elastically strained to a corundum crystal symmetry ⁇ -Al 2 O 3 (001)-oriented substrate in accordance with an illustrative embodiment of the present disclosure.
  • E-k strain-free energy-crystal momentum
  • FIG.44J shows an experimental HRXRD and GIXR of a superlattice comprising bilayered unit cells of a monoclinic crystal symmetry Ga 2 O 3 (100)-oriented film coupled to a cubic (spinel) crystal symmetry ternary composition of Magnesium-Gallium-Oxide, Mg x Ga 2(1- x) O 3-2x where the SL is epitaxially deposited upon a monoclinic Ga 2 O 3 (010)-oriented substrate in accordance with an illustrative embodiment of the present disclosure.
  • FIG.44L shows an experimental HRXRD and GIXR of an orthorhombic Ga 2 O 3 epilayer elastically strained to a cubic crystal symmetry Magnesium-Aluminum-Oxide MgAl 2 O 4 (100)-oriented substrate in accordance with an illustrative embodiment of the present disclosure.
  • FIG.44M shows an experimental HRXRD of a ternary Zinc-Gallium-Oxide ZnGa 2 O 4 epilayer elastically strained to a wurtzite Zinc-Oxide ZnO layer deposited upon a monoclinic crystal symmetry Gallium-Oxide (-201)-oriented substrate in accordance with an illustrative embodiment of the present disclosure.
  • FIG.44O shows an epitaxial layer stack deposited along a growth direction for the case of an orthorhombic Ga 2 O 3 crystal symmetry film using an intermediate layer and a prepared substrate surface in accordance with an illustrative embodiment of the present disclosure.
  • FIG.44P shows an experimental HRXRD of two distinctly different crystal symmetry binary Ga 2 O 3 compositions deposited upon a rhombic Sapphire ⁇ -Al 2 O 3 (0001)- oriented substrate controlled via growth conditions in accordance with an illustrative embodiment of the present disclosure.
  • E-k strain-free energy-crystal momentum
  • FIG.44R shows an experimental HRXRD and GIXR of two example distinct compositions of high-quality single crystal corundum symmetry ternary (Al x Ga 1-x ) 2 O 3 deposited epitaxially on a bulk (1-100)-oriented corundum crystal symmetry Al 2 O 3 substrate in accordance with an illustrative embodiment of the present disclosure.
  • FIG.44S shows an experimental HRXRD of a monoclinic topmost active Ga 2 O 3 epilayer deposited upon a ternary Erbium-Gallium-Oxide (Er x Ga 1-x ) 2 O 3 transition layer deposited upon a single crystal Silicon (111)-oriented substrate in accordance with an illustrative embodiment of the present disclosure.
  • FIG.44T shows an experimental HRXRD and GIXR of an example high-quality single crystal corundum symmetry binary Ga 2 O 3 deposited epitaxially on a bulk (11-20)-oriented corundum crystal symmetry Al 2 O 3 substrate where the two thicknesses of Ga 2 O 3 are shown pseudomorphically strained (i.e., elastic deformation of the bulk Ga 2 O 3 unit cell) to the underlying Al 2 O 3 substrate in accordance with an illustrative embodiment of the present disclosure.
  • pseudomorphically strained i.e., elastic deformation of the bulk Ga 2 O 3 unit cell
  • FIG.44U shows an experimental HRXRD and GIXR of an example high-quality single crystal corundum symmetry superlattice comprising bilayers of binary pseudomorphic Ga 2 O 3 and Al 2 O 3 deposited epitaxially on a bulk (11-20)-oriented corundum crystal symmetry Al 2 O 3 substrate where the superlattice [Al 2 O 3 / Ga 2 O 3 ] demonstrates the unique properties of the corundum crystal symmetry in accordance with an illustrative embodiment of the present disclosure.
  • FIG.44V shows an experimental transmission electron micrograph (TEM) of a high-quality single crystal superlattice comprising SL[Al 2 O 3 / Ga 2 O 3 ] deposited upon a corundum Al 2 O 3 substrate depicting the low dislocation defect density in accordance with an illustrative embodiment of the present disclosure.
  • FIG.44W shows an experimental HRXRD of a corundum crystal symmetry topmost active (Al x Ga 1-x ) 2 O 3 epilayer deposited upon a single corundum Al 2 O 3 (1-102)-oriented substrate in accordance with an illustrative embodiment of the present disclosure.
  • FIG.44X shows an experimental HRXRD and GIXR of an example high-quality single crystal corundum symmetry superlattice comprising bilayers of ternary pseudomorphic (Al x Ga 1-x ) 2 O 3 and Al 2 O 3 deposited epitaxially on a bulk (1-102)-oriented corundum crystal symmetry Al 2 O 3 substrate in accordance with an illustrative embodiment of the present disclosure, where the superlattice [Al 2 O 3 / (Al x Ga 1-x ) 2 O 3 ] demonstrates the unique properties of the corundum crystal symmetry.
  • FIG.44Y shows an experimental wide angle HRXRD of a cubic crystal symmetry topmost active Magnesium-Oxide MgO epilayer deposited upon a single crystal cubic (spinel) Magnesium-Aluminum-Oxide MgAl 2 O 4 (100)-oriented substrate in accordance with an illustrative embodiment of the present disclosure.
  • FIG.45 shows schematically a construction of epitaxial regions for a metal oxide UVLED comprising a p-i-n heterojunction diode and multiple quantum wells to tune the optical emission energy in accordance with an illustrative embodiment of the present disclosure.
  • FIG.47 shows a spatial carrier confinement structure of the multiple quantum well (MQW) regions of FIG.46 having quantized electron and hole wavefunctions which spatially recombine in the MQW region to generate a predetermined emitted photon energy determined by the respective quantized states in the conduction and valence bands where the MQW region has a narrow bandgap material comprising Ga 2 O 3 in accordance with an illustrative embodiment of the present disclosure.
  • MQW multiple quantum well
  • FIG.48 shows a calculated optical absorption spectrum for the device structure in FIG.47 where the lowest energy electron-hole recombination is determined by the quantized energy levels within the MQW giving rise to sharp and discrete absorption/emission energy in accordance with an illustrative embodiment of the present disclosure.
  • FIG.49 is an energy band diagram versus growth direction of an epitaxial metal oxide UVLED structure where the MQW region has a narrow bandgap material comprising (Al 0.05 Ga 0.95 ) 2 O 3 in accordance with an illustrative embodiment of the present disclosure.
  • FIG.50 shows a calculated optical absorption spectrum for the device structure in FIG.49 where the lowest energy electron-hole recombination is determined by the quantized energy levels within the MQW giving rise to sharp and discrete absorption/emission energy in accordance with an illustrative embodiment of the present disclosure.
  • FIG.51 is an energy band diagram versus growth direction of an epitaxial metal oxide UVLED structure where the MQW region has a narrow bandgap material comprising (Al 0.1 Ga 0.9 ) 2 O 3 in accordance with an illustrative embodiment of the present disclosure.
  • FIG.52 shows a calculated optical absorption spectrum for the device structure in FIG.49 where the lowest energy electron-hole recombination is determined by the quantized energy levels within the MQW giving rise to sharp and discrete absorption/emission energy in accordance with an illustrative embodiment of the present disclosure.
  • FIG.53 is an energy band diagram versus growth direction of an epitaxial metal oxide UVLED structure where the MQW region has a narrow bandgap material comprising (Al 0.2 Ga 0.8 ) 2 O 3 in accordance with an illustrative embodiment of the present disclosure.
  • FIG.54 shows a calculated optical absorption spectrum for the device structure in FIG.53 where the lowest energy electron-hole recombination is determined by the quantized energy levels within the MQW giving rise to sharp and discrete absorption/emission energy in accordance with an illustrative embodiment of the present disclosure.
  • FIG.55 plots pure metal work-function energy and sorts the metal species from high to low work function for application to p-type and n-type ohmic contacts to metal oxides in accordance with illustrative embodiments of the present disclosure.
  • FIG.56 is a reciprocal lattice map 2-axis x-ray diffraction pattern for pseudomorphic ternary (Al 0.5 Ga 0.5 ) 2 O 3 on an A-plane Al 2 O 3 substrate in accordance with an illustrative embodiment of the present disclosure.
  • FIG.57 is a 2-axis x-ray diffraction pattern of a pseudomorphic 10 period SL[Al 2 O 3 /Ga 2 O 3 ] on an A-plane Al 2 O 3 substrate showing in-plane lattice matching throughout the structure in accordance with an illustrative embodiment of the present disclosure.
  • FIGS.58A and 58B illustrate optical mode structure and threshold gain for a slab of metal-oxide semiconductor material in accordance with an illustrative embodiment of the present disclosure.
  • FIGS.59A and 59B illustrate optical mode structure and threshold gain for a slab of metal-oxide semiconductor material in accordance with another illustrative embodiment of the present disclosure.
  • FIG.60 shows an optical cavity formed using an optical gain medium embedded between two optical reflectors in accordance with an illustrative embodiment of the present disclosure.
  • FIG.61 shows an optical cavity formed using an optical gain medium embedded between two optical reflectors in accordance with an illustrative embodiment of the present disclosure, illustrating that two optical wavelengths can be supported by the gain medium and cavity length.
  • FIG.62 shows an optical cavity formed using an optical gain medium of finite thickness embedded between two optical reflectors and positioned at the peak electric field intensity of a fundamental wavelength mode in accordance with an illustrative embodiment of the present disclosure, showing that only one optical wavelength can be supported by the gain medium and cavity length.
  • FIG.63 shows an optical cavity formed using two optical gain media of finite thickness embedded between two optical reflectors in accordance with an illustrative embodiment that is positioned at the peak electric field intensity of a shorter wavelength mode, illustrating that only one optical wavelength can be supported by the gain medium and cavity length.
  • FIGS.64A and 64B show single quantum well structures comprising metal-oxide ternary materials with quantized electron and holes states in accordance with an illustrative embodiment of the present disclosure depicting two different quantum well thicknesses.
  • FIGS.65A and 65B show single quantum well structures comprising metal-oxide ternary materials with quantized electron and hole states in accordance with an illustrative embodiment of the present disclosure depicting two different quantum well thicknesses.
  • FIG.66 shows spontaneous emission spectra from the quantum well structures disclosed in FIGS.64A, 64B, 65A and 65B.
  • FIGS.67A and FIG.67B show a spatial energy band structure of a metal oxide quantum well and the associated energy-crystal momentum band structure in accordance with an illustrative embodiment of the present disclosure.
  • FIGS.68A and 68B show a population inversion mechanism for the electrons and holes in a quantum well band structure and the resulting gain spectrum for the quantum well.
  • FIGS.69A and 69B show electron and hole energy states for filled conduction and valence bands in the energy-momentum space for the case of a direct and pseudo-direct bandgap metal oxide structure in accordance with an illustrative embodiment of the present disclosure.
  • FIGS.70A and 70B show an impact ionization process for metal oxide injected hot electrons resulting in pair production in accordance with an illustrative embodiment of the present disclosure.
  • FIGS.71A and 71B show an impact ionization process for metal oxide injected hot electrons resulting in pair production in accordance with another illustrative embodiment of the present disclosure.
  • FIGS.72A and 72B show an effect of an electric field applied to metal oxide creating a plurality of impact ionization events in accordance with another illustrative embodiment of the present disclosure.
  • FIG.73 shows a vertical type ultraviolet laser structure in accordance with an illustrative embodiment of the present disclosure where the reflectors form part of the cavity and electrical circuit.
  • FIG.74 shows a vertical type ultraviolet laser structure in accordance with an illustrative embodiment of the present disclosure where the reflectors forming the optical cavity are decoupled from the electrical circuit.
  • FIG.75 shows a waveguide type ultraviolet laser structure in accordance with an illustrative embodiment of the present disclosure where the reflectors forming the optical cavity are decoupled from the electrical circuit and where the optical gain medium embedded within the lateral cavity can have a length optimized for a low threshold gain.
  • FIGS.76A-1 and 76A-2 show a table of crystal symmetries (or space groups), lattice constants (“a,” “b” and “c,” in different crystal directions, in Angstroms), bandgaps (minimum bandgap energies in eV), and the wavelength of light (“ ⁇ _g,” in nm) that corresponds to the bandgap energy for various materials.
  • FIG.76B shows a chart of some epitaxial oxide material bandgaps (minimum bandgap energies in eV) and in some cases crystal symmetry (e.g., ⁇ -, ⁇ -, ⁇ - and ⁇ -Al x Ga 1-x O y ) versus lattice constant (in Angstroms) of the epitaxial oxide material.
  • FIG.76C is the chart shown in FIG.76B further indicating classification of the size of the epitaxial oxide lattice constant.
  • FIG.76D shows a plot of lattice constant “a” versus lattice constant “b” for a selection of epitaxial oxides.
  • FIGS.76E-76H show charts of some calculated epitaxial oxide material bandgaps (minimum bandgap energies in eV).
  • FIG.77 is a flowchart illustrating a process to form the epitaxial materials described in the present disclosure including those in the table in FIGS.76A-1 and 76A-2.
  • FIG.78 is a schematic that illustrates the situation that occurs when an element is added to an epitaxial oxide, using the analogy of a seesaw.
  • FIG.79 is a plot of the shear modulus (in GPa) versus the bulk modulus (in GPa) for some example epitaxial oxide materials.
  • FIG.80 is a plot of the Poisson’s ratio for some example epitaxial oxide materials.
  • FIGS.81A-81I show examples of semiconductor structures comprising epitaxial oxide materials in layers or regions.
  • FIGS.81J-81L show additional examples of semiconductor structures comprising epitaxial oxide materials in layers or regions.
  • FIG.82A is a schematic of an example semiconductor structure comprising epitaxial oxide layers on a suitable substrate.
  • FIGS.82B-82I are plots showing electron energy (on the y-axis) vs. growth direction (on the x-axis) for embodiments of epitaxial oxide heterostructures comprising layers of dissimilar epitaxial oxide materials.
  • FIGS.83A-83C show electron energy versus growth direction for three examples of different digital alloys, and example wavefunctions for the confined electrons and holes in each case.
  • FIG.84 shows a plot of effective bandgap versus an average composition (x) of the digital alloys shown in FIGS.83A-83C.
  • FIG.85 shows a chart of some DFT calculated epitaxial oxide material bandgaps (minimum bandgap energies in eV) and in some cases crystal symmetry versus a lattice constant of the epitaxial oxide material.
  • FIG.86 shows a schematic explaining how an epitaxial oxide material with a monoclinic unit cell can be compatible with an epitaxial oxide material with a cubic unit cell.
  • FIG.87 shows a chart of some DFT calculated epitaxial oxide material bandgaps (minimum bandgap energies in eV) and in some cases crystal symmetry versus a lattice constant of the epitaxial oxide material further indicating groupings where the epitaxial oxide materials within each group are compatible with the other materials in the group.
  • FIG.88A shows a chart of some DFT calculated epitaxial oxide material bandgaps (minimum bandgap energies in eV) versus lattice constant where the epitaxial oxide materials all have cubic crystal symmetry with a Fd3m or Fm3m space group.
  • FIG.88B-1 is a schematic showing how an epitaxial oxide material with cubic crystal symmetry with a relatively small lattice constant (e.g., approximately equal to 4 Angstroms) can lattice match (or have a small lattice mismatch) with an epitaxial oxide material that has a relatively large lattice constant (e.g., approximately equal to 8 Angstroms).
  • FIG.88B-2 shows the crystal structure of NiAl 2 O 4 with an Fd3m space group.
  • FIG.88C shows the chart in FIG.88A, with lines connecting a subset of epitaxial oxide materials having compositions (Ni x Mg y Zn 1-x-y )(Al q Ga 1-q ) 2 O 4 where 0 ⁇ x ⁇ 1, 0 ⁇ y ⁇ 1, 0 ⁇ z ⁇ 1 and 0 ⁇ q ⁇ 1, or (Ni x Mg y Zn 1-x-y )GeO 4 where 0 ⁇ x ⁇ 1, 0 ⁇ y ⁇ 1, and 0 ⁇ z ⁇ 1 and where the shaded area is a convex hull of the connected materials shown on the plot.
  • FIG.88D shows the chart in FIG.88A, with lines connecting a subset of epitaxial oxide materials including MgAl 2 O 4 , ZnAl 2 O 4 , NiAl 2 O 4 , and some alloys thereof.
  • FIG.88E shows the chart in FIG.88A, with lines connecting a subset of epitaxial oxide materials including “2ax MgO,” ⁇ -Ga 2 O 3 , MgAl 2 O 4 , ZnAl 2 O 4 , NiAl 2 O 4 , and some alloys thereof.
  • FIG.88F shows the chart in FIG.88A, with lines connecting a subset of epitaxial oxide materials including MgAl 2 O 4 , MgGa 2 O 4 , ZnGa 2 O 4 , and some alloys thereof.
  • FIG.88G shows the chart in FIG.88A, with lines connecting a subset of epitaxial oxide materials including “2ax NiO” (which is NiO, where the lattice constant plotted is twice the lattice constant of the NiO unit cell), “2ax MgO,” ⁇ -Al 2 O 3 , ⁇ -Ga 2 O 3 , MgAl 2 O 4 , and some alloys thereof.
  • 2ax NiO which is NiO, where the lattice constant plotted is twice the lattice constant of the NiO unit cell
  • FIG.88H shows the chart in FIG.88A, with lines connecting a subset of epitaxial oxide materials including ⁇ -Ga 2 O 3 , MgGa 2 O 4 , Mg 2 GeO 4 , and some alloys thereof.
  • FIG.88I shows the chart in FIG.88A, with lines connecting a subset of epitaxial oxide materials including ⁇ -Ga 2 O 3 , MgGa 2 O 4 , “2ax MgO,” and some alloys thereof.
  • FIG.88J shows the chart in FIG.88A, with lines connecting a subset of epitaxial oxide materials including ⁇ -Ga 2 O 3 , Mg 2 GeO 4 , “2ax MgO,” and some alloys thereof.
  • FIG.88K shows the chart in FIG.88A, with lines connecting a subset of epitaxial oxide materials including Ni 2 GeO 4 , Mg 2 GeO 4 , (Mg 0.5 Zn 0.5 ) 2 GeO 4 , Zn(Al 0.5 Ga 0.5 ) 2 O 4 , Mg(Al 0.5 Ga 0.5 ) 2 O 4 , “2ax MgO,” and some alloys thereof.
  • FIG.88L shows the chart in FIG.88A, with lines connecting a subset of epitaxial oxide materials including ⁇ -Ga 2 O 3 , ⁇ -Al 2 O 3 , MgAl 2 O 4 , ZnAl 2 O 4 , and some alloys thereof.
  • FIG.88M shows the chart in FIG.88A, with lines connecting a subset of epitaxial oxide materials including ⁇ -Ga 2 O 3 , ⁇ -Al 2 O 3 , MgAl 2 O 4 , ZnAl 2 O 4 , “2ax MgO,” and some alloys thereof where the bulk alloy ⁇ -(Al x Ga 1-x ) 2 O 3 is shown along one of the lines.
  • FIG.88N shows the chart in FIG.88A, with lines connecting a subset of epitaxial oxide materials including ⁇ -Ga 2 O 3 , ⁇ -Al 2 O 3 , MgAl 2 O 4 , ZnAl 2 O 4 , “2ax MgO,” and some alloys thereof where the digital alloy compositions comprising layers of (MgO)z((AlxGa 1-x ) 2 O 3 )1-z materials are shown in the shaded region bounded by the lines.
  • FIG.88O shows the chart in FIG.88A, with lines connecting a subset of epitaxial oxide materials including MgGa 2 O 4 , ZnGa 2 O 4 , (Mg 0.5 Zn 0.5 )Ga 2 O 4 , (Mg 0.5 Ni 0.5 )Ga 2 O 4 , (Zn 0.5 Ni 0.5 )Ga 2 O 4 , “2ax NiO,” “2ax MgO,” and some alloys thereof.
  • FIG.89A shows a chart of some DFT calculated epitaxial oxide material bandgaps (minimum bandgap energies in eV) versus lattice constant, with lattice constants from approximately 4.5 Angstroms to 5.3 Angstroms and where the materials have non-cubic crystal symmetries, such as hexagonal and orthorhombic crystal symmetries.
  • FIG.89B shows a table of DFT calculated Li(Al x Ga 1-x )O 2 film properties (space group (“SG”), lattice constants (“a” and “b”) in Angstroms, and percentage lattice mismatch (“% ⁇ a” and “% ⁇ b”) between a LiGaO 2 film and the possible substrates (“sub”) listed.
  • FIG.90A shows a calculated energy-crystal momentum (E-k) dispersion plot in the vicinity of the Brillouin-zone center for LiAlO 2 with a P41212 space group.
  • FIG.90B shows a calculated energy-crystal momentum (E-k) dispersion plot in the vicinity of the Brillouin-zone center for Li(Al 0.5 Ga 0.5 )O 2 with a ⁇ ⁇ ⁇ 21 space group.
  • FIG.90C shows a calculated energy-crystal momentum (E-k) dispersion plot in the vicinity of the Brillouin-zone center for LiGaO 2 with a Pna21 space group.
  • FIG.90D shows a calculated energy-crystal momentum (E-k) dispersion plot in the vicinity of the Brillouin-zone center for ZnAl 2 O 4 with a ⁇ ⁇ 3 ⁇ space group.
  • FIG.90E shows a calculated energy-crystal momentum (E-k) dispersion plot in the vicinity of the Brillouin-zone center for ZnGa 2 O 4 with a Fd3m space group.
  • FIG.90F shows a calculated energy-crystal momentum (E-k) dispersion plot in the vicinity of the Brillouin-zone center for MgGa 2 O 4 with a Fd3m space group.
  • FIG.90G shows a calculated energy-crystal momentum (E-k) dispersion plot in the vicinity of the Brillouin-zone center for GeMg 2 O 4 with a Fd3m space group.
  • FIG.90H shows a calculated energy-crystal momentum (E-k) dispersion plot in the vicinity of the Brillouin-zone center for NiO with a Fm3m space group.
  • FIG.90I shows a calculated energy-crystal momentum (E-k) dispersion plot in the vicinity of the Brillouin-zone center for MgO with a Fm3m space group.
  • FIG.90J shows a calculated energy-crystal momentum (E-k) dispersion plot in the vicinity of the Brillouin-zone center for SiO 2 with a P3221 space group.
  • FIG.90K shows a calculated energy-crystal momentum (E-k) dispersion plot in the vicinity of the Brillouin-zone center for NiAl 2 O 4 with a Imma space group.
  • FIG.90L shows a calculated energy-crystal momentum (E-k) dispersion plot in the vicinity of the Brillouin-zone center for ⁇ Al 2 O 3 with a R3c space group.
  • FIG.90M shows a calculated energy-crystal momentum (E-k) dispersion plot in the vicinity of the Brillouin-zone center for ⁇ (Al 0.75 Ga 0.25 ) 2 O 3 with a R3c space group.
  • FIG.90N shows a calculated energy-crystal momentum (E-k) dispersion plot in the vicinity of the Brillouin-zone center for ⁇ ( Al 0.5 Ga 0.5 ) 2 O 3 with a R3c space group.
  • FIG.90O shows a calculated energy-crystal momentum (E-k) dispersion plot in the vicinity of the Brillouin-zone center for ⁇ ( Al 0.25 Ga 0.75 ) 2 O 3 with a R3c space group.
  • FIG.90P shows a calculated energy-crystal momentum (E-k) dispersion plot in the vicinity of the Brillouin-zone center for ⁇ Ga 2 O 3 with a R3c space group.
  • FIG.90Q shows a calculated energy-crystal momentum (E-k) dispersion plot in the vicinity of the Brillouin-zone center for ⁇ Ga 2 O 3 with a Pna21 space group.
  • FIG.90R shows a calculated energy-crystal momentum (E-k) dispersion plot in the vicinity of the Brillouin-zone center for ⁇ (Al 0.5 Ga 0.5 ) 2 O 3 with a Pna21 space group.
  • FIG.90S shows a calculated energy-crystal momentum (E-k) dispersion plot in the vicinity of the Brillouin-zone center for ⁇ Al 2 O 3 with a Pna21 space group.
  • FIG.90T shows a calculated energy-crystal momentum (E-k) dispersion plot in the vicinity of the Brillouin-zone center for ⁇ Ga 2 O 3 with a Fd3m space group.
  • FIG.90U shows a calculated energy-crystal momentum (E-k) dispersion plot in the vicinity of the Brillouin-zone center for MgAl 2 O 4 with a Fd3m space group.
  • FIG.90V shows a calculated energy-crystal momentum (E-k) dispersion plot in the vicinity of the Brillouin-zone center for NiAl 2 O 4 with a Fd3m space group.
  • FIG.90W shows a calculated energy-crystal momentum (E-k) dispersion plot in the vicinity of the Brillouin-zone center for MgNi 2 O 4 with a Fd3m space group.
  • FIG.90X shows a calculated energy-crystal momentum (E-k) dispersion plot in the vicinity of the Brillouin-zone center for GeNi 2 O 4 with a Fd3m space group.
  • FIG.90Y shows a calculated energy-crystal momentum (E-k) dispersion plot in the vicinity of the Brillouin-zone center for Li 2 O with a Fm3m space group.
  • FIG.90Z shows a calculated energy-crystal momentum (E-k) dispersion plot in the vicinity of the Brillouin-zone center for Al 2 Ge 2 O 7 with a C2c space group.
  • FIG.90AA shows a calculated energy-crystal momentum (E-k) dispersion plot in the vicinity of the Brillouin-zone center for Ga 4 Ge 1 O 8 with a C2m space group.
  • FIG.90BB shows a calculated energy-crystal momentum (E-k) dispersion plot in the vicinity of the Brillouin-zone center for NiGa 2 O 4 with a Fd3m space group.
  • FIG.90CC shows a calculated energy-crystal momentum (E-k) dispersion plot in the vicinity of the Brillouin-zone center for Ga 3 N 1 O 3 with a R3m space group.
  • FIG.90DD shows a calculated energy-crystal momentum (E-k) dispersion plot in the vicinity of the Brillouin-zone center for Ga 3 N 1 O 3 with a C2m space group.
  • FIG.90EE shows a calculated energy-crystal momentum (E-k) dispersion plot in the vicinity of the Brillouin-zone center for MgF 2 with a P42mnm space group.
  • FIG.90FF shows a calculated energy-crystal momentum (E-k) dispersion plot in the vicinity of the Brillouin-zone center for NaCl with a Fm3m space group.
  • FIG.90GG shows a calculated energy-crystal momentum (E-k) dispersion plot in the vicinity of the Brillouin-zone center for Mg 0.75 Zn 0.25 O with a Fd3m space group.
  • FIG.90HH shows a calculated energy-crystal momentum (E-k) dispersion plot in the vicinity of the Brillouin-zone center for ErAlO 3 with a P63mcm space group.
  • FIG.90II shows a calculated energy-crystal momentum (E-k) dispersion plot in the vicinity of the Brillouin-zone center for Zn 2 Ge 1 O 4 with a R3 space group.
  • FIG.90JJ shows a calculated energy-crystal momentum (E-k) dispersion plot in the vicinity of the Brillouin-zone center for LiNi 2 O 4 with a P4332 space group.
  • FIG.90KK shows a calculated energy-crystal momentum (E-k) dispersion plot in the vicinity of the Brillouin-zone center for GeLi 4 O 4 with a Cmcm space group.
  • FIG.90LL shows a calculated energy-crystal momentum (E-k) dispersion plot in the vicinity of the Brillouin-zone center for GeLi 2 O 3 with a Cmc21 space group.
  • FIG.90MM shows a calculated energy-crystal momentum (E-k) dispersion plot in the vicinity of the Brillouin-zone center for Zn(Al 0.5 Ga 0.5 ) 2 O 4 with a Fd3m space group.
  • FIG.90NN shows a calculated energy-crystal momentum (E-k) dispersion plot in the vicinity of the Brillouin-zone center for Mg(Al 0.5 Ga 0.5 ) 2 O 4 with a Fd3m space group.
  • FIG.90OO shows a calculated energy-crystal momentum (E-k) dispersion plot in the vicinity of the Brillouin-zone center for ( Mg 0.5 Zn 0.5 ) Al 2 O 4 with a Fd3m space group.
  • FIG.90PP shows a calculated energy-crystal momentum (E-k) dispersion plot in the vicinity of the Brillouin-zone center for ( Mg 0.5 Ni 0.5 ) Al 2 O 4 with a Fd3m space group.
  • FIG.90QQ shows a calculated energy-crystal momentum (E-k) dispersion plot in the vicinity of the Brillouin-zone center for ⁇ ( Al 0 Ga 1.0 ) 2 O 3 (i.e., ⁇ Ga 2 O 3 ) with a C2m space group.
  • FIG.90RR shows a calculated energy-crystal momentum (E-k) dispersion plot in the vicinity of the Brillouin-zone center for ⁇ (Al 0.125 Ga 0.875 ) 2 O 3 with a C2m space group.
  • FIG.90SS shows a calculated energy-crystal momentum (E-k) dispersion plot in the vicinity of the Brillouin-zone center for ⁇ ( Al 0.25 Ga 0.75 ) 2 O 3 with a C2m space group.
  • FIG.90TT shows a calculated energy-crystal momentum (E-k) dispersion plot in the vicinity of the Brillouin-zone center for ⁇ (Al 0.375 Ga 0.625 ) 2 O 3 with a C2m space group.
  • FIG.90UU shows a calculated energy-crystal momentum (E-k) dispersion plot in the vicinity of the Brillouin-zone center for ⁇ (Al 0.5 Ga 0.5 ) 2 O 3 with a C2m space group.
  • FIG.90VV shows a calculated energy-crystal momentum (E-k) dispersion plot in the vicinity of the Brillouin-zone center for ⁇ (Al 1.0 Ga 0.0 ) 2 O 3 (i.e., ⁇ -Aluminum Oxide) with a C2m space group.
  • FIG.90WW shows a calculated energy-crystal momentum (E-k) dispersion plot in the vicinity of the Brillouin-zone center for GeO 2 with a P42mnm space group.
  • FIG.90XX shows a calculated energy-crystal momentum (E-k) dispersion plot in the vicinity of the Brillouin-zone center for Ge(Mg 0.5 Zn 0.5 ) 2 O 4 with a Fd3m space group.
  • FIG.90YY shows a calculated energy-crystal momentum (E-k) dispersion plot in the vicinity of the Brillouin-zone center for (Ni 0.5 Zn 0.5 )Al 2 O 4 with a Fd3m space group.
  • FIG.90ZZ shows a calculated energy-crystal momentum (E-k) dispersion plot in the vicinity of the Brillouin-zone center for LiF with a Fm3m space group.
  • FIG.91 shows an atomic crystal structure of a heterojunction between MgGa 2 O 4 and MgAl 2 O 4 epitaxial oxide material.
  • FIG.92A shows a calculated energy-crystal momentum (E-k) dispersion plot in the vicinity of the Brillouin-zone center for a superlattice comprising [MgAl 2 O 4 ] 1
  • FIG.92B shows a calculated energy-crystal momentum (E-k) dispersion plot in the vicinity of the Brillouin-zone center for a superlattice comprising [MgAl 2 O 4 ] 1
  • FIG.92C shows a calculated energy-crystal momentum (E-k) dispersion plot in the vicinity of the Brillouin-zone center for a superlattice comprising [MgAl 2 O 4 ] 1
  • FIG.92D shows a calculated energy-crystal momentum (E-k) dispersion plot in the vicinity of the Brillouin-zone center for a superlattice comprising [MgGa 2 O 4 ] 1
  • FIG.92E shows a calculated energy-crystal momentum (E-k) dispersion plot in the vicinity of the Brillouin-zone center for a superlattice comprising [ ⁇ Al 2 O 3 ] 2
  • FIG.92F shows a calculated energy-crystal momentum (E-k) dispersion plot in the vicinity of the Brillouin-zone center for a superlattice comprising [ ⁇ Al 2 O 3 ] 1
  • FIG.92G shows a calculated energy-crystal momentum (E-k) dispersion plot in the vicinity of the Brillouin-zone center for a superlattice comprising [GeMg 2 O 4 ] 1
  • FIG.93 shows an atomic crystal structure of ⁇ -(Al 0.5 Ga 0.5 ) 2 O 3 with a space group C2m.
  • FIG.94 shows a DFT calculated energy-crystal momentum (E-k) dispersion plot in the vicinity of the Brillouin-zone center for a superlattice with ⁇ -(Al 0.5 Ga 0.5 ) 2 O 3 and ⁇ -Ga 2 O 3
  • FIG.95A shows a schematic of a ⁇ -Ga 2 O 3 (100) film coherently (and pseudomorphically) strained to an MgO(100) substrate depicting the in-plane unit cell alignment (in plan view, along the “b” and “c” direction).
  • FIG.95B shows a schematic of a ⁇ -Ga 2 O 3 (100) film coherently (and pseudomorphically) strained to an MgO(100) substrate depicting the unit cell alignment along the growth direction (“a”) where the lattice of the film is rotated by 45° with respect to that of the substrate.
  • FIG.96 shows a DFT calculated energy-crystal momentum (E-k) dispersion plot in the vicinity of the Brillouin-zone center for ⁇ -Ga 2 O 3 pseudomorphically strained to the lattice of MgO rotated by 45°.
  • E-k energy-crystal momentum
  • FIG.97 shows a schematic of a superlattice formed from alternating layers (with one or more unit cells in each layer) of ⁇ -Ga 2 O 3 and MgO, where the ⁇ -Ga 2 O 3 layers are pseudomorphically strained to the lattice of MgO rotated by 45°.
  • FIG.98A is a table of crystal structure properties of example epitaxial films and substrates that are compatible with Mg 2 GeO 4 .
  • FIG.98B is a table of compatibility of ⁇ -Ga 2 O 3 with various heterostructure materials.
  • FIG.99 is a table describing a selection of possible oxide material compositions comprising constituent elements (Mg, Zn, Al, Ga, O).
  • FIG.100 shows a schematic of an epitaxial layered structure formed from at least two distinct materials further selected from categories of Oxide_type_A and Oxide_type_B shown in FIG.99.
  • FIG.101 shows the single crystal orientation of an ultrawide bandgap cubic oxide composition comprising ZnGa 2 O 4 (ZGO) epitaxially deposited and formed on a smaller bandgap wurtzite type crystal surface of SiC-4H.
  • FIG.102 shows the atomic configuration of the ZnGa 2 O 4 (111) surface represented by the shaded triangular area.
  • FIGS.103A and 103B show the experimental XRD and XRR data of a ZGa 2 O 4 (111)-oriented film to be formed epitaxially on a prepared SiC-4H(0001) surface.
  • FIG.104A shows a schematic diagram of a large lattice constant cubic oxide represented by ZnGa 2 O 4 formed on a smaller cubic lattice constant oxide represented by MgO.
  • FIG.104B shows the crystal structures of the epitaxial growth surfaces presented for the structure of FIG.104A comprising respectively the upper and lower atomic structures of MgO(100) and ZnGa 2 O 4 (100).
  • FIGS.105A and 105B show the experimental XRD data of a high structural quality epilayer of a ZnGa 2 O 4 film deposited on a MgO substrate.
  • FIG.106 shows the experimental XRD data of a high structural quality epilayer of an NiO film deposited on a MgO substrate.
  • FIG.107 shows a schematic diagram of a large lattice constant cubic oxide represented by MgGa 2 O 4 formed on a smaller cubic lattice constant oxide represented by MgO.
  • FIGS.108A and 108B show the experimental XRD data for the formation of an ultrawide bandgap cubic MgGa 2 O 4 (100)-oriented epilayer on a prepared MgO(100) substrate.
  • FIG.109 shows a further epilayer structure comprising two UWBG large lattice constant cubic oxide layers integrated into a dissimilar bandgap oxide structure deposited on a large lattice constant cubic MgAl 2 O 4 (100)-oriented substrate.
  • FIGS.110A and 110B show the experimental XRD data of MgO, ZnAl 2 O 4 and ZnGa 2 O 4 cubic oxide films on a MgAl 2 O 4 (100)-oriented substrate.
  • FIG.111 shows the surface atom configurations of a cubic LiF(111)-oriented surface and a cubic ⁇ Ga 2 O 3 (111)-oriented surface.
  • FIGS.112A and 112B show the experimental XRD data of gallium oxide showing the crystal symmetry group of the epilayer controlled by the underlying substrate or seed surface symmetry.
  • FIG.113 shows the epitaxial structure of Ga 2 O 3 formed on a cubic MgO substrate.
  • FIGS.114A and 114B show respectively the experimental XRD data of low growth temperature (LT) and high growth temperature (HT) Ga 2 O 3 film formation on prepared MgO(100)-oriented substrates.
  • LT low growth temperature
  • HT high growth temperature
  • FIG.115 shows the complex epilayer structure of dissimilar cubic oxide layers integrated into a superlattice or multi-heterojunction structure.
  • FIGS.116A and 116B show the experimental XRD data of SL structures formed using MgGa 2 O 4 and ZnGa 2 O 4 layers deposited on MgO(100) substrate but having different periods.
  • FIGS.117A and 117B show the experimentally determined grazing incidence XRR data evidencing the extremely high crystal structure quality of the SL[MgGa 2 O 4 / ZnGa 2 O 4 ] // MgO(100) structures shown in FIGS.116A and 116B respectively.
  • FIG.118 shows the complex epilayer structure of dissimilar cubic oxide layers integrated into a superlattice or multi-heterojunction structure in another example.
  • FIGS.119A and 119B show the experimental XRD and XRR data of the epitaxial SL structure described in FIG.118 forming a SL[MgAl 2 O 4 / MgO] // MgAl 2 O 4 (100).
  • FIG.120 shows the complex epilayer structure of dissimilar cubic oxide layers integrated into a superlattice or multi-heterojunction structure in a further example.
  • FIG.121 shows the experimental XRD data of a Fd3m crystal structure GeMg 2 O 4 deposited as a high quality bulk layer on a Fm3m MgO(100) substrate and further comprising a MgO cap.
  • FIG.122 shows the experimental XRD data of a Fd3m crystal structure GeMg 2 O 4 when incorporated as a SL structure comprising 20x period SL[GeMg 2 O 4 / MgO] on a Fm3m MgO(100) substrate.
  • FIG.123 shows the complex epilayer structure of dissimilar cubic oxide layers integrated into a superlattice or multi-heterojunction structure in another example.
  • FIG.124 shows a representation of the (100) crystal plane of the Fd3m cubic symmetry unit cells of GeMg 2 O 4 and MgGa 2 O 4 .
  • FIG.125 shows the experimental XRD data of an SL structure comprising a 20x period SL[Mg 2 GeO 4 / MgGa 2 O 4 ] on a MgO(100) substrate.
  • FIG.126 shows the experimental XRD data of an SL structure comprising a 10x period SL[Mg 2 GeO 4 / MgGa 2 O 4 ] on a MgO(100) substrate.
  • FIG.127 shows the complex epilayer structure of dissimilar cubic oxide layers integrated into a superlattice or multi-heterojunction structure in a further example.
  • FIGS.128A and 128B show experimental XRD data for a superlattice structure comprising SL[GeMg 2 O 4 / ⁇ Ga 2 O 3 ] // MgO sub (100).
  • FIG.129 shows the complex epilayer structure of dissimilar cubic oxide layers integrated into a superlattice or multi-heterojunction structure in another example.
  • FIGS.130A and 130B show experimental XRD and XRR data for a heterostructure and superlattice structure comprising SL[ZnGa 2 O 4 / MgO] // MgO sub (100).
  • FIG.131 shows the complex epilayer structure of dissimilar cubic oxide layers integrated into a superlattice or multi-heterojunction structure in another example.
  • FIGS.132A and 132B show experimental XRD data for a superlattice structure comprising SL[MgGa 2 O 4 / MgO] // MgO sub (100).
  • FIG.133 shows the complex epilayer structure of dissimilar cubic oxide layers integrated to form a heterostructure and SL where the SL comprises SL[Ga 2 O 3 / MgO] // MgO sub (100).
  • FIGS.134A and 134B show experimental XRD data for the SL structure of FIG. 133 where the growth temperature is selected to achieve the cubic-phase ⁇ Ga 2 O 3 during the MBE deposition process.
  • FIG.135 shows the complex epilayer structure of dissimilar cubic oxide layers integrated into a superlattice or multi-heterojunction structure in a further example.
  • FIG.136 shows experimental XRD data of a bulk RS-Mg0.9Zn0.1O epilayer pseudomorphically strained to a cubic Fm3m MgO(100)-oriented substrate.
  • FIG.137 shows experimental XRD data of the bulk RS-Mg 0.9 Zn 0.1 O composition referred to FIG.136 incorporated into a digital alloy in the form of SL[RS-Mg 0.9 Zn 0.1 O /MgO] // MgO sub (100).
  • FIG.138A shows a plot of the minimum bandgap energy versus the minor lattice constant of monoclinic ⁇ (Al x Ga 1 ⁇ x ) 2 O 3.
  • FIG.138B shows a plot of the minimum bandgap energy versus the minor lattice constant of hexagonal ⁇ (Al x Ga 1 ⁇ x ) 2 O 3 .
  • FIG.138C shows examples of R3c ⁇ (Al x Ga 1 ⁇ x ) 2 O 3 epitaxial structures that may be formed.
  • FIG.139A shows an epilayer structure implementing a stepped increment tuning of the effective alloy composition of each SL region along the growth direction.
  • FIG.139B shows the experimental XRD data of a step graded SL (SGSL) structure as shown in FIG.139A using a digital alloy comprising bilayers of ⁇ Ga 2 O 3 and ⁇ Al 2 O 3 deposited on (110)-oriented Sapphire (zero miscut).
  • FIG.140 shows another step graded SL structure which in one example may be used to form a pseudo-substrate with a tuned in-plane lattice constant for a subsequent high quality and close lattice matched active layer.
  • FIG.141A shows another step graded SL structure comprising a high complexity digital alloy grading interleaved by a wide bandgap spacer.
  • FIG.141B shows the experimental high-resolution XRD data of the step graded (i.e., chirped) SL structure with interposer shown in FIG.141A.
  • FIG.141C shows the high-resolution XRR data of the step graded (i.e., chirped) SL structure with interposer shown in FIG.141A.
  • FIGS.142A-142C show the electronic band diagram as a function of the growth direction for a chirp layer structure.
  • FIG.142D is the wavelength spectrum of the oscillator strength for electric dipole transitions between the conduction and valence band of the chirp layer modeled in FIGS.142A- 142C.
  • FIG.143A shows an example full E-k band structure of an epitaxial oxide material which can be derived from the atomic structure of the crystal.
  • FIG.143B shows a simplified band structure which is a representation of the minimum bandgap of the material where the x-axis is space (z) rather than wave vectors as in the E-k diagram of FIG.143A.
  • FIG.144A shows a simplified band structure for a homojunction device comprising a p-i-n structure comprising epitaxial oxide layers.
  • FIG.144B shows a simplified band structure for a homojunction device comprising an n-i-n structure comprising epitaxial oxide layers.
  • FIG.145A shows a simplified band structure of a heterojunction p-i-n device comprising epitaxial oxide layers.
  • FIG.145B shows a band structure diagram for a double heterojunction device comprising epitaxial oxide layers.
  • FIG.145C shows a simplified band structure of a multiple heterojunction p-i-n device comprising epitaxial oxide layers.
  • FIG.146 shows a band structure diagram for a metal-insulator-semiconductor (MIS) structure comprising epitaxial oxide layers.
  • FIGS.147A shows a simplified band structure of another example p-i-n structure, with a superlattice in the i-region.
  • MIS metal-insulator-semiconductor
  • FIG.147B shows a single quantum well of the structure shown in FIG.147A.
  • FIG.148 shows a simplified band structure of another example p-i-n structure with a superlattice in the n-, i- and p- layers.
  • FIG.149 shows a simplified band structure of another example p-i-n structure, with a superlattice in the n-, i- and p- layers similar to the structure in FIG.148.
  • FIG.150A shows an example of a semiconductor structure comprising epitaxial oxide layers.
  • FIG.150B shows the structure from FIG.150A with the layers etched such that contact can be made respectively to any layer of the semiconductor structure.
  • FIG.150C shows the structure from FIG.150B with an additional contact region which makes contact to the back side (opposite the epitaxial oxide layers) of the substrate.
  • FIG.151 shows a multilayer structure used to form an electronic device having distinct regions comprising at least one layer of Mg a Ge b O c .
  • FIG.152 is a figurative diagram showing example materials that may be combined with Mg a Ge b O c to form a heterostructure.
  • FIG.153 is a plot of the bandgap energy as a function of lattice constant for example materials that may be used in heterostructures for semiconductor structures.
  • FIG.154 is a figurative sectional view of an in-plane conduction device comprising an insulating substrate and a semiconductor layer region formed on the substrate with the electrical contacts positioned on the top semiconductor layer of the device.
  • FIG.155 is figurative sectional view of a vertical conduction device comprising a conducting substrate and a semiconductor layer region formed on the substrate with the electrical contacts positioned on the top and bottom of the device.
  • FIG.156A is a figurative sectional view of a vertical conduction device for light emission having the electrical contact configuration illustrated in FIG.155, configured as a plane parallel waveguide for the emitted light.
  • FIG.156B is a figurative sectional view of a vertical conduction device for light emission having the electrical contact configuration illustrated in FIG.155, configured as a vertical light emission device.
  • FIG.157A is a figurative sectional view of an in-plane conduction device for photo-detection, having the electrical contact configuration illustrated in FIG.154, and configured to receive light passing through the semiconductor layer region and/or the substrate.
  • FIG.157B is a figurative sectional view of an in-plane conduction device for light emission, having the electrical contact configuration illustrated in FIG.154, and configured to emit light either vertically or in-plane.
  • FIG.158A is a semiconductor structure that can be used as a portion of a light emitting device.
  • FIG.158B is a figurative sectional view of a light emitting device that can be formed using the semiconductor structure of FIG.158A.
  • FIG.159A is a semiconductor structure that can be used as a portion of a light emitting device.
  • FIG.159B is a figurative sectional view of a light emitting device that can be formed using the semiconductor structure of FIG.159A.
  • FIG.160 is a figurative sectional view of an in-plane surface metal-semi- conductor-metal (MSM) conduction device comprising a substrate and a semiconductor layer region comprising multiple semiconductor layers, with a top layer comprising a pair of planar interdigitated electrical contacts.
  • FIG.161A is a top view of an in-plane dual metal MSM conduction device comprising a first electrical contact formed of a first metallic substance interdigitated with a second electrical contact formed of a second metallic substance.
  • FIG.161B is a figurative sectional view of the in-plane dual metal MSM conduction device illustrated FIG.64A formed of a substrate and a semiconductor layer region showing the unit cell arrangement.
  • FIG.162 is a figurative sectional view of a multilayered semiconductor device having a first electrical contact formed on a mesa surface and a second electrical contact spaced both horizontally and vertically from the first electrical contact.
  • FIG.163 is figurative sectional view of an in-plane MSM conduction device comprising multiple unit cells of the mesa structure illustrated in FIG.162 disposed laterally to form the device.
  • FIG.164 is a figurative sectional view of a multi-electrical terminal device having multiple mesa structures.
  • FIG.165A is a figurative sectional view of a planar field effect transistor (FET) comprising source, gate and drain electrical contacts where the source and drain electrical contacts are formed on a semiconductor layer region that is formed on an insulating substrate, and the gate electrical contact is formed on a gate layer formed on the semiconductor layer region.
  • FIG.165B is a top view of the planar FET illustrated FIG.165A showing distances between the source to gate and drain to gate electrical contacts.
  • FET field effect transistor
  • FIG.166A is a figurative sectional view of a planar field effect transistor (FET) of a similar configuration to that illustrated in FIGS.165A and 165B except that the source electrical contact is implanted through the semiconductor layer region into the substrate, and the drain electrical contact is implanted into the semiconductor layer region only, in accordance with some embodiments.
  • FIG.166B is a top view of the planar FET illustrated in FIG.166A.
  • FIG.167 is a top view of a planar FET comprising multiple interconnected unit cells of the planar FET illustrated in FIGS.165A or 166A.
  • FIG.168 is a process flow diagram for forming a conduction device comprising a regrown conformal semiconductor layer region on an exposed etched mesa sidewall.
  • FIG.169A is a chart showing center frequencies of RF operating bands that may be used in different applications.
  • FIG.169B shows a schematic of a general RF-switch.
  • FIG.170A shows a schematic and an equivalent circuit diagram of a FET, with source (“S”), drain (“D”), and gate (“G”) terminals.
  • FIGS.170B-170D show schematics and an equivalent circuit diagram of an RF switch employing multiple FETs in series to achieve high breakdown voltage.
  • FIG.171 shows a chart of calculated specific ON resistances of an RF switch and the calculated breakdown voltage associated with different semiconductors comprising the RF switch.
  • FIG.172A shows a schematic of multiple Si-based FETs connected in series to achieve a high breakdown voltage.
  • FIG.172B shows a schematic of a single Ga 2 O 3 -based FET that can achieve a high breakdown voltage equivalent to that of the series Si-based FET shown in FIG.172A.
  • FIG.173 shows a chart of calculated OFF-state FET capacitance (in F) versus calculated specific ON resistance (R ON ) for Si (a low bandgap material) and an epitaxial oxide material with a high bandgap.
  • FIG.174 shows a chart of fully depleted thickness (t FD ) of a channel in an FET comprising ⁇ -Ga 2 O 3 versus the doping density (N D C H ) of the ⁇ -Ga 2 O 3 in the channel.
  • FIG.175 shows a schematic of an example of a FET comprising epitaxial oxide materials.
  • FIG.176A is an E-k diagram showing a calculated band structure for an epitaxial oxide material that can be used in the FETs and RF switches of the present disclosure showing in this example that ⁇ -Al 2 O 3 can be used as the gate layer or the additional oxide encapsulation.
  • FIG.176B is an E-k diagram showing a calculated band structure for an epitaxial oxide material that can be used in the FETs and RF switches of the present disclosure showing in this example that ⁇ -Ga 2 O 3 can be used as the channel layer.
  • FIG.177 shows a chart of calculated minimum bandgap energy (in eV) versus lattice constant (in Angstroms) for ⁇ - and ⁇ - (Al x Ga 1-x ) 2 O 3 materials that are compatible with sapphire ( ⁇ -Al 2 O 3 ) substrates.
  • FIG.178 shows a schematic of a portion of a FET and a chart of energy versus distance along the channel (in the “x” direction).
  • FIG.179 shows a schematic of a portion of a FET and a chart of energy versus distance along the channel (in the “z” direction) to illustrate the operation of the FET with epitaxial oxide materials.
  • FIG.180 shows a schematic of a portion of a FET and a chart of energy versus distance along the channel (in the “z” direction).
  • FIG.181 shows a schematic of the atomic surface of ⁇ -Al 2 O 3 oriented in the A- plane (i.e., the (110) plane).
  • FIG.182 shows a schematic of an example of a FET comprising epitaxial oxide materials and an integrated phase shifter.
  • FIGS.183A and 183B show schematics of systems including one or more switches with an integrated phase shifter (e.g., containing the FET in FIG.182).
  • FIG.184 shows a schematic of an example of a FET comprising epitaxial oxide materials and an epitaxial oxide buried ground plane.
  • FIGS.185A and 185B are energy band diagrams along the gate stack direction (“z,” as shown in the schematic in FIG.179) of an example of a FET with a structure like that of the FET in FIG.184 where the layers are formed of ⁇ -(Al x Ga 1-x ) 2 O 3 and ⁇ -Al 2 O 3 .
  • FIG.186 shows a structure of some RF-waveguides that can be formed using buried ground planes comprising epitaxial oxide materials.
  • FIG.187 shows a schematic of an example of a FET comprising epitaxial oxide materials and an electric field shield above the gate electrode.
  • FIG.188 shows a schematic of the epitaxial oxide and dielectric materials forming an integrated FET and coplanar (CP) waveguide structure.
  • FIG.189 shows a schematic of an example of a FET comprising epitaxial oxide materials and an integrated phase shifter.
  • FIGS.190A-190C show energy band diagrams along the channel direction (“x,” as shown in FIG.178) of the S and D tunnel junctions described with respect to the FET illustrated in FIG.189
  • FIGS.191A-191G are schematics of an example of a process flow to fabricate a FET comprising epitaxial oxide materials, such as the FET shown in FIG.189.
  • FIG.192 shows the DFT calculated atomic structure of ⁇ -Ga 2 O 3 (i.e., Ga 2 O 3 with a Pna21 space group).
  • FIGS.194A-194C show schematics and calculated band diagrams (conduction and valence band edges) of energy versus growth direction “z,” calculated electron wavefunctions, and calculated electron densities, in ⁇ -(Al x Ga 1-x ) 2 O 3 / ⁇ -Ga 2 O 3 heterostructures.
  • FIG.195 shows a DFT calculated band structure of Li-doped ⁇ -Ga 2 O 3 .
  • FIG.196 shows a chart that summarizes the results from DFT calculated band structures of doped (Al,Ga) x O y using different dopants.
  • FIG.197A shows an example of a p-i-n structure, with multiple quantum wells in the n-, i- and p- layers (similar to the structure shown in FIG.149).
  • FIGS.197B and 197C show calculated band diagrams and confined electron and hole wavefunctions (similar to those in the examples in FIGS.194B and 194C) for a portion of the superlattice in the n-region in a structure like the one in FIG.197A.
  • FIG.198A shows a structure with a crystalline substrate having a particular orientation (h k l) with respect to the growth direction, and an epitaxial layer (“film epilayer”) with an orientation (h’ k’ l’).
  • FIG.198B is a table showing some substrates that are compatible with ⁇ -Al x Ga 1- x O y epitaxial layers, the space group (“SG”) of the substrates, the orientation of the substrate, the orientation of a ⁇ -Al x Ga 1-x O y film grown on the substrate, and the elastic strain energy due to the mismatch.
  • FIG.199 shows an example containing a substrate (C-plane ⁇ -Al 2 O 3 ) and a template (low temperature “LT” grown Al(111)) structure used to match the in-plane lattice constants to ⁇ -Al x Ga 1-x O y (“Pna21 AlGaO”).
  • FIG.200 shows some DFT calculated epitaxial oxide materials with lattice constants from about 4.8 Angstroms to about 5.3 Angstroms which in various examples may be substrates for, and/or form heterostructures with, ⁇ -Al x Ga 1-x O y .
  • FIG.201 shows some additional DFT calculated epitaxial oxide materials with possible in-plane lattice constants from about 4.8 Angstroms to about 5.3 Angstroms which in various examples may be substrates for, and/or or form heterostructures with, ⁇ -Al x Ga 1-x O y .
  • FIG.202A shows the rectangular array of atoms in the unit cells at the (001) surface of ⁇ -Ga 2 O 3 .
  • FIG.202B shows the surface of ⁇ -SiO 2 , with the rectangular unit cell of ⁇ - Ga 2 O 3 (001) overlayed.
  • FIG.202C shows the surface of LiGaO 2 (011), with the rectangular unit cell of ⁇ - Ga 2 O 3 (001) overlayed.
  • FIG.202D shows the surface of Al(111), with the rectangular unit cell of ⁇ - Ga 2 O 3 (001) overlayed.
  • FIG.202E shows the surface of ⁇ -Al 2 O 2 (001) (i.e., C-plane sapphire), with the rectangular unit cell of ⁇ -Ga 2 O 3 (001) overlayed.
  • FIG.203 shows a flowchart of an example method for forming a semiconductor structure comprising ⁇ -Al x Ga 1-x O y .
  • FIG.204A shows two overlayed experimental XRD scans, one of ⁇ -Al 2 O 3 grown on an Al(111) template, and the other of ⁇ -Al 2 O 3 grown on a Ni(111) template.
  • FIG.204B shows two overlayed experimental XRD scans (shifted in the y-axis) of the structures shown, one including a ⁇ -Ga 2 O 3 layer grown on an ⁇ -Al 2 O 3 substrate with an Al(111) template layer, and the other a ⁇ -Ga 2 O 3 layer grown on an ⁇ -Al 2 O 3 substrate without a template layer.
  • FIG.204C shows the two overlayed scans from FIG.204B in high resolution where the fringes due to the high quality of the layers were observed.
  • FIGS.205A and 205B show simplified E-k diagrams in the vicinity of the Brillouin-zone center for an epitaxial oxide material, such as those shown in FIGS.28, 76A-1, 76A-2 and 76B, showing a process of impact ionization.
  • FIG.206A shows a plot of energy versus bandgap of an epitaxial oxide material (including the conduction band edge, E c , and the valence band edge, E v ), where the dotted line shows the approximate threshold energy required by a hot electron to generate an excess electron-hole pair through an impact ionization process.
  • FIG.206B shows an example using ⁇ -Ga 2 O 3 with a bandgap of about 5 eV.
  • FIG.207A shows a schematic of an epitaxial oxide material with two planar contact layers (e.g., metals, or highly doped semiconductor contact materials and metal contacts) coupled to an applied voltage, V a .
  • FIG.207B shows a band diagram of the structure shown in FIG.207A along the growth (“z”) direction of the epitaxial oxide material.
  • FIG.207C shows a band diagram of the structure shown in FIG.207A along the growth (“z”) direction of the epitaxial oxide material where the epitaxial oxide has a gradient in bandgap (i.e., a graded bandgap) in the growth “z” direction, E c (z).
  • FIG.208 shows a schematic of an example of an electroluminescent device including a high work function metal (“metal#1”), an ultra-high bandgap (“UWBG”) layer, a wide bandgap (“WBG”) epitaxial oxide layer, and a second metal contact (“metal#2”).
  • metal#1 high work function metal
  • UWBG ultra-high bandgap
  • WBG wide bandgap
  • metal#2 second metal contact
  • FIGS.209A and 209B show schematics of examples of electroluminescent devices that are p-i-n diodes including a p-type semiconductor layer, an epitaxial oxide layer that is not intentionally doped (NID) and comprises an impact ionization region (IIR), and an n-type semiconductor layer.
  • NID an epitaxial oxide layer that is not intentionally doped
  • IIR impact ionization region
  • n-type semiconductor layer an n-type semiconductor layer.
  • DETAILED DESCRIPTION Disclosed herein are embodiments of epitaxial oxide materials, with structures and electronic devices including the epitaxial oxide materials. Some embodiments disclose an optoelectronic semiconductor light emitting device that may be configured to emit light having a wavelength in the range of from about 150 nm to about 280 nm.
  • the devices comprise a metal oxide substrate having at least one epitaxial semiconductor metal oxide layer disposed thereon.
  • the substrate may comprise Al 2 O 3 , Ga 2 O 3 , MgO, LiF, MgAl 2 O 4 , MgGa 2 O 4 , LiGaO 2 , LiAlO 2 , (Al x Ga 1-x ) 2 O 3 , MgF 2 , LaAlO 3 , TiO 2 or quartz.
  • the one or more of the at least one semiconductor layer comprises at least one of Al 2 O 3 and Ga 2 O 3 .
  • the present disclosure provides an optoelectronic semiconductor light emitting device configured to emit light having a wavelength in the range from about 150 nm to about 280 nm, the device comprising a substrate having at least one epitaxial semiconductor layer disposed thereon, wherein each of the one or more epitaxial semiconductor layers comprises a metal oxide.
  • the metal oxide of each of the one or more semiconductor layers is selected from the group consisting of Al 2 O 3 , Ga 2 O 3, MgO, NiO, Li 2 O, ZnO, SiO 2 , GeO 2 , Er 2 O 3 , Gd 2 O 3 , PdO, Bi 2 O 3 , IrO 2 , and any combination of the aforementioned metal oxides.
  • at least one of the one or more semiconductor layers is a single crystal.
  • the at least one of the one or more semiconductor layers has rhombohedral, hexagonal or monoclinic crystal symmetry.
  • At least one of the one or more semiconductor layers is composed of a binary metal oxide, wherein the metal oxide is selected from Al 2 O 3 and Ga 2 O 3 .
  • at least one of the one or more semiconductor layers is composed of a ternary metal-oxide composition, and the ternary metal oxide composition comprises at least one of Al 2 O 3 and Ga 2 O 3 , and, optionally, a metal oxide selected from MgO, NiO, LiO 2 , ZnO, SiO 2 , GeO 2 , Er 2 O 3 , Gd 2 O 3 , PdO, Bi 2 O 3 , and IrO 2 .
  • the at least one of the one or more semiconductor layers is composed of a ternary metal-oxide composition of (Al x Ga 1-x ) 2 O 3 wherein 0 ⁇ x ⁇ 1.
  • the at least one of the one or more semiconductor layers comprises uniaxially deformed unit cells.
  • the at least one of the one or more semiconductor layers comprises biaxially deformed unit cells.
  • the at least one of the one or more semiconductor layers comprises triaxially deformed unit cells.
  • the at least one of the one or more semiconductor layer is composed of a quaternary metal oxide composition
  • the quaternary metal oxide composition comprises either: (i) Ga 2 O 3 and a metal oxide selected from Al 2 O 3, MgO, NiO, LiO 2 , ZnO, SiO 2 , GeO 2 , Er 2 O 3 , Gd 2 O 3 , PdO, Bi 2 O 3 , and IrO 2 ; or (ii) Al 2 O 3 and a metal oxide selected from Ga 2 O 3 , MgO, NiO, LiO 2 , ZnO, SiO 2 , GeO 2 , Er 2 O 3 , Gd 2 O 3 , PdO, Bi 2 O 3 , and IrO 2 .
  • the at least one of the one or more semiconductor layers is composed of a quaternary metal oxide composition (Ni x Mg 1-x ) y Ga 2(1-y) O 3-2y where 0 ⁇ x ⁇ 1 and 0 ⁇ y ⁇ 1.
  • the surface of the substrate is configured to enable lattice matching of crystal symmetry of the at least one semiconductor layer.
  • the substrate is a single crystal substrate.
  • the substrate is selected from Al 2 O 3 , Ga 2 O 3 , MgO, LiF, MgAl 2 O 4 , MgGa 2 O 4 , LiGaO 2 , LiAlO 2 , MgF 2 , LaAlO 3 , TiO 2 and quartz.
  • the surface of the substrate has crystal symmetry and in-plane lattice constant matching so as to enable homoepitaxy or heteroepitaxy of the at least one semiconductor layer.
  • one or more of the at least one semiconductor layer is of direct bandgap type.
  • the present disclosure provides an optoelectronic semiconductor device for generating light of a predetermined wavelength comprising a substrate; and an optical emission region having an optical emission region band structure configured for generating light of the predetermined wavelength and comprising one or more epitaxial metal oxide layers supported by the substrate.
  • configuring the optical emission region band structure for generating light of the predetermined wavelength comprises selecting the one or more epitaxial metal oxide layers to have an optical emission region band gap energy capable of generating light of the predetermined wavelength.
  • selecting the one or more epitaxial metal oxide layers to have an optical emission region band gap energy capable of generating light of the predetermined wavelength comprises forming the one or more epitaxial metal oxide layers of a binary metal oxide of the form A x O y comprising a metal specie (A) combined with oxygen (O) in the relative proportions x and y.
  • the binary metal oxide is Al 2 O 3 .
  • the binary metal oxide is Ga 2 O 3 .
  • the binary metal oxide is selected from the group consisting of MgO, NiO, LiO 2 , ZnO, SiO 2 , GeO 2 , Er 2 O 3 , Gd 2 O 3 , PdO, Bi 2 O 3 and IrO 2 .
  • selecting the one or more epitaxial metal oxide layers to have an optical emission region band gap energy capable of generating light of the predetermined wavelength comprises forming the one or more epitaxial metal oxide layers of a ternary metal oxide.
  • the ternary metal oxide is a ternary metal oxide bulk alloy of the form A x B y O n comprising a metal species (A) and (B) combined with oxygen (O) in the relative proportions x, y and n.
  • a relative fraction of the metal specie B to the metal specie A ranges from a minority relative fraction to a majority relative fraction.
  • the ternary metal oxide is of the form A x B 1-x O n where 0 ⁇ x ⁇ 1.0.
  • the metal specie A is Al and metal specie B is selected from the group consisting of: Zn, Mg, Ga, Ni, Rare Earth, Ir Bi, and Li.
  • the metal specie A is Ga and metal specie B is selected from the group consisting of: Zn, Mg, Ni, Al, Rare Earth, Ir, Bi and Li.
  • the ternary metal oxide is of the form (Al x Ga 1-x ) 2 O 3 , where 0 ⁇ x ⁇ 1. In other forms, x is about 0.1, or about 0.3, or about 0.5.
  • the ternary metal oxide is a ternary metal oxide ordered alloy structure formed by sequential deposition of unit cells formed along a unit cell direction and comprising alternating layers of metal specie A and metal specie B having intermediate O layers to form a metal oxide ordered alloy of the form A-O-B-O-A-O-B-etc.
  • the metal specie A is Al and the metal specie B is Ga
  • the ternary metal oxide ordered alloy is of the form Al-O-Ga-O-Al-etc.
  • the ternary metal oxide is of the form of a host binary metal oxide crystal with a crystal modification specie.
  • the host binary metal oxide crystal is selected from the group consisting of Ga 2 O 3 , Al 2 O 3 , MgO, NiO, ZnO, Bi 2 O 3 , r-GeO 2 , Ir 2 O 3 , RE 2 O 3 and Li 2 O and the crystal modification specie is selected from the group consisting of Ga, Al, Mg, Ni, Zn, Bi, Ge, Ir, RE and Li.
  • selecting the one or more epitaxial metal oxide layers to have an optical emission region band gap energy capable of generating light of the predetermined wavelength comprises forming the one or more epitaxial metal oxide layers as a superlattice comprising two or more layers of metal oxides forming a unit cell and repeating with a fixed unit cell period along a growth direction.
  • the superlattice is a bi-layered superlattice comprising repeating layers comprising two different metal oxides.
  • the two different metal oxides comprise a first binary metal oxide and a second binary metal oxide.
  • the first binary metal oxide is Al 2 O 3 and the second binary metal oxide is Ga 2 O 3 .
  • the first binary metal oxide is NiO and the second binary metal oxide is Ga 2 O 3 .
  • the first binary metal oxide is MgO and the second binary metal oxide is NiO.
  • the first binary metal oxide is selected from the group consisting of Al 2 O 3 , Ga 2 O 3 , MgO, NiO, LiO 2 , ZnO, SiO 2 , GeO 2 , Er2O 3 , Gd2O 3 , PdO, Bi 2 O 3 and IrO 2 and wherein the second binary metal oxide is selected from the group consisting of Al 2 O 3 , Ga 2 O 3, MgO, NiO, LiO 2 , ZnO, SiO 2 , GeO 2 , Er 2 O 3 , Gd 2 O 3 , PdO, Bi 2 O 3 and IrO 2 absent the first selected binary metal oxide.
  • the two different metal oxides comprise a binary metal oxide and a ternary metal oxide.
  • the binary metal oxide is Ga 2 O 3 and the ternary metal oxide is (Al x Ga 1-x ) 2 O 3 , where 0 ⁇ x ⁇ 1.0.
  • the binary metal oxide is Ga 2 O 3 and the ternary metal oxide is Al x Ga 1-x O 3 , where 0 ⁇ x ⁇ 1.0.
  • the binary metal oxide is Ga 2 O 3 and the ternary metal oxide is Mg x Ga 2(1-x) O 3-2x , where 0 ⁇ x ⁇ 1.0.
  • the binary metal oxide is Al 2 O 3 and the ternary metal oxide is (Al x Ga 1-x ) 2 O 3 , where 0 ⁇ x ⁇ 1.0.
  • the binary metal oxide is Al 2 O 3 and the ternary metal oxide is Al x Ga 1-x O 3 , where 0 ⁇ x ⁇ 1.0.
  • the binary metal oxide is Al 2 O 3 and the ternary metal oxide is (Al x Er 1-x ) 2 O 3 .
  • the ternary metal oxide is selected from the group consisting of (Ga 2x Ni 1-x )O 2x+1 , (Al 2x Ni 1-x )O 2x+1 , (Al 2x Mg 1-x )O 2x+1 , (Ga 2x Mg 1-x )O 2x+1 , (Al 2x Zn 1-x )O 2x+1 , (Ga 2x Zn 1-x )O 2x+1 , (Ga x Bi 1-x ) 2 O 3 , (Al x Bi 1-x ) 2 O 3 , (Al 2x Ge 1-x )O 2+x , (Ga 2x Ge 1-x )O 2+x , (Al x Ir 1-x ) 2 O 3 , (Ga x Ir 1-x ) 2 O 3 , (Ga x RE 1-x )O 3 , (Al x RE 1-x )O 3 , (Al 2x Li 2(1-x)
  • the binary metal oxide is selected from the group consisting of Al 2 O 3 , Ga 2 O 3 , MgO, NiO, LiO 2 , ZnO, SiO 2 , GeO 2 , Er2O 3 , Gd2O 3 , PdO, Bi 2 O 3 and IrO 2 .
  • the two different metal oxides comprise a first ternary metal oxide and a second ternary metal oxide.
  • the first ternary metal oxide is Al x Ga 1-x O and the second ternary metal oxide is (Al x Ga 1-x ) 2 O 3 or Al y Ga 1-y O 3 where 0 ⁇ x ⁇ 1 and 0 ⁇ y ⁇ 1.
  • the first ternary metal oxide is (Al x Ga 1-x )O 3 and the second ternary metal oxide is (Al y Ga 1-y )O 3 , where 0 ⁇ x ⁇ 1 and 0 ⁇ y ⁇ 1.
  • the first ternary metal oxide is selected from the group consisting of (Ga 2x Ni 1-x )O 2x+1 , (Al 2x Ni 1-x )O 2x+1 , (Al 2x Mg 1-x )O 2x+1 , (Ga 2x Mg 1-x )O 2x+1 , (Al 2x Zn 1-x )O 2x+1 , (Ga 2x Zn 1-x )O 2x+1 , (Ga x Bi 1-x ) 2 O 3 , (Al x Bi 1-x ) 2 O 3 , (Al 2x Ge 1-x )O 2+x , (Ga 2x Ge 1-x )O 2+x , (Al x Ir 1-x ) 2 O 3 , (GaxIr 1-x ) 2 O 3 , (GaxRE 1-x )O 3 , (AlxRE 1-x )O 3 , (Al 2 xLi 2 ( 1-x )
  • the superlattice is a tri-layered superlattice comprising repeating layers of three different metal oxides.
  • the three different metal oxides comprise a first binary metal oxide, a second binary metal oxide and a third binary metal oxide.
  • the first binary metal oxide is MgO
  • the second binary metal oxide is NiO
  • the third binary metal oxide Ga 2 O 3 is MgO
  • the first binary metal oxide is selected from the group consisting of Al 2 O 3 , Ga 2 O 3, MgO, NiO, LiO 2 , ZnO, SiO 2 , GeO 2 , Er 2 O 3 , Gd 2 O 3 , PdO, Bi 2 O 3 and IrO 2
  • the second binary metal oxide is selected from the group Al 2 O 3 , Ga 2 O 3 , MgO, NiO, LiO 2 , ZnO, SiO 2 , GeO 2 , Er 2 O 3 , Gd 2 O 3 , PdO, Bi 2 O 3 and IrO 2 absent the first selected binary metal oxide
  • the third binary metal oxide is selected from the group Al 2 O 3 , Ga 2 O 3, MgO, NiO, LiO 2 , ZnO, SiO 2 , GeO 2 , Er 2 O 3 , Gd 2 O 3 , PdO, Bi 2 O 3 and IrO 2 absent the first and second selected binary metal oxides.
  • the three different metal oxides comprise a first binary metal oxide, a second binary metal oxide and a ternary metal oxide.
  • the first binary metal oxide is selected from the group consisting of Al 2 O 3 , Ga 2 O 3, MgO, NiO, LiO 2 , ZnO, SiO 2 , GeO 2 , Er 2 O 3 , Gd 2 O 3 , PdO, Bi 2 O 3 and IrO 2
  • the second binary metal oxide is selected from the group consisting of Al 2 O 3 , Ga 2 O 3, MgO, NiO, LiO 2 , ZnO, SiO 2 , GeO 2 , Er2O 3 , Gd2O 3 , PdO, Bi 2 O 3 and IrO 2 absent the first selected binary metal oxide
  • the ternary metal oxide is selected from the group consisting of (Ga 2x Ni 1-x )O 2x+1 , (Al 2x Ni 1-x )O 2x+1 ,
  • the three different metal oxides comprise a binary metal oxide, a first ternary metal oxide and a second ternary metal oxide.
  • the binary metal oxide is selected from the group consisting of Al 2 O 3 , Ga 2 O 3, MgO, NiO, LiO 2 , ZnO, SiO 2 , GeO 2 , Er 2 O 3 , Gd 2 O 3 , PdO, Bi 2 O 3 and IrO 2
  • the first ternary metal oxide is selected from the group consisting of (Ga 2 xNi 1-x )O 2 x+1, (Al 2x Ni 1-x )O 2x+1 , (Al 2x Mg 1-x )O 2x+1 , (Ga 2x Mg 1-x )O 2x+1 , (Al 2x Zn 1-x )O 2x+1 , (Ga 2x Zn 1-x )O 2x+1 , (Ga x Bi 1- x ) 2 O 3
  • the three different metal oxides comprise a first ternary metal oxide, a second ternary metal oxide and a third ternary metal oxide.
  • the first ternary metal oxide is selected from the group consisting of (Ga 2x Ni 1-x )O 2x+1 , (Al 2x Ni 1-x )O 2x+1 , (Al 2x Mg 1-x )O 2x+1 , (Ga 2x Mg 1-x )O 2x+1 , (Al 2x Zn 1-x )O 2x+1 , (Ga 2x Zn 1-x )O 2x+1 , (Ga x Bi 1-x ) 2 O 3 , (Al x Bi 1-x ) 2 O 3 , (Al 2x Ge 1-x )O 2+x , (Ga 2x Ge 1-x )O 2+x , (Al x Ir 1-x ) 2 O 3 , (GaxIr 1-x ) 2 O
  • the superlattice is a quad-layered superlattice comprising repeating layers of at least three different metal oxides.
  • the superlattice is a quad-layered superlattice comprising repeating layers of three different metal oxides, and a selected metal oxide layer of the three different metal oxides is repeated in the quad-layered superlattice.
  • the three different metal oxides comprise a first binary metal oxide, a second binary metal oxide and a third binary metal oxide.
  • the first binary metal oxide is MgO
  • the second binary metal oxide is NiO
  • the third binary metal oxide is Ga 2 O 3 forming a quad-layer superlattice comprising MgO - Ga 2 O 3 - NiO - Ga 2 O 3 layers.
  • the three different metal oxides are selected from the group of consisting of Al 2 O 3 , Ga 2 O 3, MgO, NiO, LiO 2 , ZnO, SiO 2 , GeO 2 , Er 2 O 3 , Gd 2 O 3 , PdO, Bi 2 O 3 , IrO 2, (Ga 2x Ni 1-x )O 2x+1 , (Al 2x Ni 1-x )O 2x+1 , (Al 2x Mg 1-x )O 2x+1 , (Ga 2x Mg 1-x )O 2x+1 , (Al 2x Zn 1-x )O 2x+1 , (Ga 2x Zn 1-x )O 2x+1 , (Ga x Bi 1-x ) 2 O 3 , (Al x Bi 1-x ) 2 O 3 , (Al x Bi 1-x ) 2 O 3 , (Al 2x Ge 1-x )O 2+x , (Ga 2x Ge 1-x )O 2+x
  • the superlattice is a quad-layered superlattice comprising repeating layers of four different metal oxides.
  • the four different metal oxides are selected from the group of consisting of Al 2 O 3 , Ga 2 O 3, MgO, NiO, LiO 2 , ZnO, SiO 2 , GeO 2 , Er 2 O 3 , Gd 2 O 3 , PdO, Bi 2 O 3 , IrO 2, (Ga 2x Ni 1-x )O 2x+1 , (Al 2x Ni 1-x )O 2x+1 , (Al 2x Mg 1-x )O 2x+1 , (Ga 2x Mg 1-x )O 2x+1 , (Al 2x Zn 1-x )O 2x+1 , (Ga 2x Zn 1-x )O 2x+1 , (Ga x Bi 1-x ) 2 O 3 , (Al x Bi 1-x ) 2 O 3 , (Al 2 x Bi 1-x ) 2 O 3 , (
  • respective individual layers of the two or more metal oxide layers forming the unit cell of the superlattice have a thickness less than or approximately equal to an electron de Broglie wavelength in that respective individual layer.
  • configuring the optical emission region band structure for generating light of the predetermined wavelength comprises modifying an initial optical emission region band structure of the one or more epitaxial metal oxide layers on forming the optoelectronic device.
  • modifying the initial optical emission region band structure of the one or more epitaxial metal oxide layers on forming the optoelectronic device comprises introducing a predetermined strain to the one or more epitaxial metal oxide layers during epitaxial deposition of the one or more epitaxial metal oxide layers.
  • the predetermined strain is introduced to modify the initial optical emission region band structure from an indirect band gap to a direct band gap. [0447] In another form, the predetermined strain is introduced to modify an initial bandgap energy of the initial optical emission region band structure. [0448] In another form, the predetermined strain is introduced to modify an initial valence band structure of the initial optical emission region band structure. [0449] In another form, modifying the initial valence band structure comprises raising or lowering a selected valence band with respect to the Fermi energy level of the optical emission region. [0450] In another form, modifying the initial valence band structure comprises modifying the shape of the valence band structure to change localization characteristics of holes formed in the optical emission region.
  • introducing the predetermined strain to the one or more epitaxial metal oxide layers comprises selecting a to be strained metal oxide layer having a composition and crystal symmetry type which, when epitaxially formed on an underlying layer having a underlying layer composition and crystal symmetry type, will introduce the predetermined strain into the to be strained metal oxide layer.
  • the predetermined strain is a biaxial strain.
  • the underlying layer is a metal oxide having a first crystal symmetry type and the to be strained metal oxide layer also has the first crystal symmetry type but with a different lattice constant to introduce the biaxial strain into the to be strained metal oxide layer.
  • the underlying layer of metal oxide is Ga 2 O 3 and the to be strained metal oxide layer is Al 2 O 3 , and biaxial compression is introduced into the Al 2 O 3 layer.
  • the underlying layer of metal oxide is Al 2 O 3 and the to be strained layer of metal oxide is Ga 2 O 3 , and biaxial tension is introduced into the Ga 2 O 3 layer.
  • the predetermined strain is a uniaxial strain.
  • the underlying layer has a first crystal symmetry type having asymmetric unit cells.
  • the to be strained metal oxide layer is monoclinic Ga 2 O 3, Al x Ga 1- x O or Al 2 O 3 , where x ⁇ 0 ⁇ 1.
  • the underlying layer and the to be strained layer form layers in a superlattice.
  • modifying an initial optical emission region band structure of the one or more epitaxial metal oxide layers on forming the optoelectronic device comprises introducing a predetermined strain to the one or more epitaxial metal oxide layers following epitaxial deposition of the one or more epitaxial metal oxide layers.
  • the optoelectronic device comprises a first conductivity type region comprising one or more epitaxial metal oxide layers having a first conductivity type region band structure configured to operate in combination with the optical emission region to generate light of the predetermined wavelength.
  • configuring the first conductivity type region band structure to operate in combination with the optical emission region to generate light of the predetermined wavelength comprises selecting a first conductivity type region energy band gap greater than the optical emission region energy band gap.
  • configuring the first conductivity type region band structure to operate in combination with the optical emission region to generate light of the predetermined wavelength comprises selecting the first conductivity type region to have an indirect bandgap.
  • configuring the first conductivity type region band structure comprises one or more of: selecting an appropriate metal oxide material or materials in line with the principles and techniques considered in the present disclosure in relation to the optical emission region; forming a superlattice in line with the principles and techniques considered in the present disclosure in relation to the optical emission region; and/or modifying the first conductivity type region band structure by applying strain in line with the principles and techniques considered in the present disclosure in relation to the optical emission region.
  • the first conductivity type region is a n-type region.
  • the optoelectronic device comprises a second conductivity type region comprising one or more epitaxial metal oxide layers having a second conductivity type region band structure configured to operate in combination with the optical emission region and the first conductivity type region to generate light of the predetermined wavelength.
  • configuring the second conductivity type region band structure to operate in combination with the optical emission region to generate light of the predetermined wavelength comprises selecting a second conductivity type region energy band gap greater than the optical emission region energy band gap.
  • configuring the second conductivity type region band structure to operate in combination with the optical emission region to generate light of the predetermined wavelength comprises selecting the second conductivity type region to have an indirect bandgap.
  • configuring the second conductivity type region band structure comprises one or more of: selecting an appropriate metal oxide material or materials in line with the principles and techniques considered in the present disclosure in relation to the optical emission region; forming a superlattice in line with the principles and techniques considered in the present disclosure in relation to the optical emission region; and/or modifying the first conductivity type region band structure by applying strain in line with the principles and techniques considered in the present disclosure in relation to the optical emission region.
  • the second conductivity type region is a p-type region.
  • the substrate is formed from a metal oxide.
  • the metal oxide is selected from the group consisting of Al 2 O 3 , Ga 2 O 3 , MgO, LiF, MgAl 2 O 4 , MgGa 2 O 4 , LiGaO 2 , LiAlO 2 , (Al x Ga 1-x ) 2 O 3 , LaAlO 3 , TiO 2 and quartz.
  • the substrate is formed from a metal fluoride.
  • the metal fluoride is MgF 2 or LiF.
  • the predetermined wavelength is in the wavelength range of 150 nm to 700 nm.
  • the predetermined wavelength is in the wavelength range of 150 nm to 280 nm.
  • the present disclosure provides a method for forming an optoelectronic semiconductor device configured to emit light having a wavelength in the range from about 150 nm to about 280 nm, the method comprising: providing a metal oxide substrate having an epitaxial growth surface; oxidizing the epitaxial growth surface to form an activated epitaxial growth surface; and exposing the activated epitaxial growth surface to one or more atomic beams each comprising high purity metal atoms and one or more atomic beams comprising oxygen atoms under conditions to deposit two or more epitaxial metal oxide films.
  • the metal oxide substrate comprises an Al or a Ga metal oxide substrate.
  • the one or more atomic beams each comprising high purity metal atoms comprise any one or more of the metals selected from the group consisting of Al, Ga , Mg, Ni, Li, Zn, Si, Ge, Er, Y, La, Pr, Gd, Pd, Bi, Ir , and any combination of the aforementioned metals.
  • the one or more atomic beams each comprising high purity metal atoms comprise any one or more of the metals selected from the group consisting of Al and Ga
  • the epitaxial metal oxide films comprise (Al x Ga 1-x ) 2 O 3 , wherein 0 ⁇ x ⁇ 1.
  • the conditions to deposit two or more epitaxial metal oxide films comprise exposing the activated epitaxial growth surface to atomic beams comprising high purity metal atoms and atomic beams comprising oxygen atoms at an oxygen:total metal flux ratio of >1.
  • at least one of the two or more epitaxial metal oxide films provides a first conductivity type region comprising one or more epitaxial metal oxide layers, and at least another of the two or more epitaxial metal oxide films provides a second conductivity type region comprising one or more epitaxial metal oxide layers.
  • At least one of the two or more epitaxial (Al x Ga 1-x ) 2 O 3 films provides a first conductivity type region comprising one or more epitaxial (Al x Ga 1-x ) 2 O 3 layers, and at least another of the two or more epitaxial (Al x Ga 1-x ) 2 O 3 films provides a second conductivity type region comprising one or more epitaxial (Al x Ga 1-x ) 2 O 3 layers.
  • the substrate is treated prior to the oxidizing step by high temperature (>800 oC) desorption in an ultrahigh vacuum chamber (less than 5 ⁇ 10 -10 Torr) to form an atomically flat epitaxial growth surface.
  • the method further comprises monitoring the surface in real-time to assess atomic surface quality.
  • the surface is monitored in real-time by reflection high energy electron diffraction (RHEED).
  • oxidizing the epitaxial growth surface comprises exposing the epitaxial growth surface to an oxygen source under conditions to oxidize the epitaxial growth surface.
  • the oxygen source is selected from one or more of the group consisting of an oxygen plasma, ozone and nitrous oxide.
  • the oxygen source is radiofrequency inductively coupled plasma (RF-ICP).
  • the method further comprises monitoring the surface in real-time to assess surface oxygen density.
  • the surface is monitored in real-time by RHEED.
  • the atomic beams comprising high purity Al atoms and/or high purity Ga atoms are each provided by effusion cells comprising inert ceramic crucibles radiatively heated by a filament and controlled by feedback sensing to monitor the metal melt temperature within the crucible.
  • high purity elemental metals of 6N to 7N or higher purity are used.
  • the method further comprises measuring the beam flux of each Al and/or Ga and oxygen atomic beam to determine the relative flux ratio prior to exposing the activated epitaxial growth surface to the atomic beams at the determined relative flux ratio.
  • the method further comprises rotating the substrate as the activated epitaxial growth surface is exposed to the atomic beams so as to accumulate a uniform amount of atomic beam intersecting the substrate surface for a given amount of deposition time.
  • the method further comprises heating the substrate as the activated epitaxial growth surface is exposed to the atomic beams.
  • the substrate is heated radiatively from behind using a blackbody emissivity matched to the below bandgap absorption of the metal oxide substrate.
  • the activated epitaxial growth surface is exposed to the atomic beams in a vacuum of from about 1 ⁇ 10 -6 Torr to about 1 ⁇ 10 -5 Torr.
  • Al and Ga atomic beam fluxes at the substrate surface are from about 1 ⁇ 10 -8 Torr to about 1 ⁇ 10 -6 Torr.
  • oxygen atomic beam fluxes at the substrate surface are from about 1 ⁇ 10 -7 Torr to about 1 ⁇ 10 -5 Torr.
  • the Al or Ga metal oxide substrate is A-plane sapphire.
  • the Al or Ga metal oxide substrate is monoclinic Ga 2 O 3 .
  • the two or more epitaxial (AlxGa 1-x ) 2 O 3 films comprise corundum type AlGaO 3.
  • the present disclosure provides a method for forming a multilayer semiconducting device comprising: forming a first layer having a first crystal symmetry type and a first composition; and depositing in a non-equilibrium environment a metal oxide layer having a second crystal symmetry type and a second composition onto the first layer, wherein depositing the second layer onto the first layer comprises initially matching the second crystal symmetry type to the first crystal symmetry type.
  • initially matching the second crystal symmetry type to the first crystal symmetry type comprises matching a first lattice configuration of the first crystal symmetry type with a second lattice configuration of the second crystal symmetry at a horizontal planar growing interface.
  • matching the first and second crystal symmetry types comprise substantially matching respective end plane lattice constants of the first and second lattice configurations.
  • the first layer is corundum Al 2 O 3 (sapphire) and the metal oxide layer is corundum Ga 2 O 3.
  • the first layer is monoclinic Al 2 O 3 and the metal oxide layer is monoclinic Ga 2 O 3.
  • the first layer is R-plane corundum Al 2 O 3 (sapphire) prepared under O-rich growth conditions and the metal oxide layer is corundum AlGaO 3 selectively grown at low temperatures ( ⁇ 550 °C) .
  • the first layer is M-plane corundum Al 2 O 3 (sapphire) and the metal oxide layer is corundum AlGaO 3.
  • the first layer is A-plane corundum Al 2 O 3 (sapphire) and the metal oxide layer is corundum AlGaO 3.
  • the first layer is corundum Ga 2 O 3 and the metal oxide layer is . corundum Al 2 O 3 (sapphire).
  • the first layer is monoclinic Ga 2 O 3 and the metal oxide layer is . monoclinic Al 2 O 3 (sapphire).
  • the first layer is (-201)-oriented monoclinic Ga 2 O 3 and the metal oxide layer is . (-201)-oriented monoclinic AlGaO 3 .
  • the first layer is (010)-oriented monoclinic Ga 2 O 3 and the metal oxide layer is . (010)-oriented monoclinic AlGaO 3 .
  • the first layer is (001)-oriented monoclinic Ga 2 O 3 and the metal oxide layer is . (001)-oriented monoclinic AlGaO 3 .
  • the first and second crystal symmetry types are different, and matching the first and second lattice configuration comprises reorienting the metal oxide layer to substantially matching the in-plane atomic arrangement at the horizontal planar growing interface.
  • the first layer is C-plane corundum Al 2 O 3 (sapphire) and wherein the metal oxide layer is any one of monoclinic, triclinic or hexagonal AlGaO 3 .
  • the C-plane corundum Al 2 O 3 (sapphire) is prepared under O-rich growth conditions to selectively grow hexagonal AlGaO 3 at lower growth temperatures ( ⁇ 650 °C).
  • the C-plane corundum Al 2 O 3 (sapphire) is prepared under O-rich growth conditions to selectively grow monoclinic AlGaO 3 at higher growth temperatures (>650 °C) with Al% limited to approximately 45-50%.
  • the R-plane corundum Al 2 O 3 (sapphire) is prepared under O-rich growth conditions to selectively grow monoclinic AlGaO 3 at higher growth temperatures (>700 °C) with Al% ⁇ 50%.
  • the first layer is A-plane corundum Al 2 O 3 (sapphire) and wherein the metal oxide layer is (110)-oriented monoclinic Ga 2 O 3 .
  • the first layer is (110)-oriented monoclinic Ga 2 O 3 and wherein the metal oxide layer is corundum AlGaO 3 .
  • the first layer is (010)-oriented monoclinic Ga 2 O 3 and the metal oxide layer is . (111)-oriented cubic MgGa 2 O 4 .
  • the first layer is (100)-oriented cubic MgO and wherein the metal oxide layer is (100)-oriented monoclinic AlGaO 3 .
  • the first layer is (100)-oriented cubic NiO and the metal oxide layer is (100)-oriented monoclinic AlGaO 3
  • initially matching the second crystal symmetry type to the first crystal symmetry type comprises depositing, in a non-equilibrium environment, a buffer layer between the first layer and the metal oxide layer wherein a buffer layer crystal symmetry type is the same as the first crystal symmetry type to provide atomically flat layers for seeding the metal oxide layer having the second crystal symmetry type.
  • the buffer layer comprises an O-terminated template for seeding the metal oxide layer.
  • the buffer layer comprises a metal terminated template for seeding the metal oxide layer.
  • the first and second crystal symmetry types are selected from the group consisting of cubic, hexagonal, orthorhombic, trigonal, rhombic and monoclinic.
  • the first crystal symmetry type and first composition of the first layer and the second crystal symmetry type and second composition of the second layer are selected to introduce a predetermined strain into the second layer.
  • the first layer is a metal oxide layer.
  • the first and second layers form a unit cell that is repeated with a fixed unit cell period to form a superlattice.
  • the first and second layers are configured to have substantially equal but opposite strain to facilitate forming of the superlattice without defects.
  • the method comprises depositing, in a non-equilibrium environment, an additional metal oxide layer having a third crystal symmetry type and a third composition onto the metal oxide layer.
  • the third crystal type is selected from the group consisting of cubic, hexagonal, orthorhombic, trigonal, rhombic and monoclinic.
  • the multilayer semiconductor device is an optoelectronic semiconductor device for generating light of a predetermined wavelength.
  • the predetermined wavelength is in the wavelength range of 150 nm to 700 nm.
  • the predetermined wavelength is in the wavelength range of 150 nm to 280 nm.
  • the present disclosure provides a method for forming an optoelectronic semiconductor device for generating light of a predetermined wavelength, the method comprising: introducing a substrate; depositing in a non-equilibrium environment a first conductivity type region comprising one or more epitaxial layers of metal oxide; depositing in a non-equilibrium environment an optical emission region comprising one or more epitaxial layers of metal oxide and comprising an optical emission region band structure configured for generating light of the predetermined wavelength; and depositing in a non-equilibrium environment a second conductivity type region comprising one or more epitaxial layers of metal oxide [0542]
  • the predetermined wavelength is in the wavelength range of about 150 nm to about 700 nm.
  • the predetermined wavelength is in the wavelength range of about 150 nm to about 425 nm.
  • bismuth oxide can be used to produce wavelengths up to approximately 425 nm.
  • the predetermined wavelength is in the wavelength range of about 150 nm to about 280 nm.
  • the optical emission efficacy is controlled by the selection of the crystal symmetry type of the optically emissive region. The optical selection rule for electric- dipole emission is governed by the symmetry properties of the conduction band and valence band states as well as the crystal symmetry type.
  • FIG.1 is a process flow diagram for constructing an optoelectronic semiconductor optoelectronic device in accordance with an illustrative embodiment.
  • the optoelectronic semiconductor device is a UVLED and in a further example, the UVLED is configured to generate a predetermined wavelength in the wavelength region of about 150 nm to about 280 nm.
  • the construction process comprises selecting initially (i) the operating wavelength desired (e.g., a UVC wavelength or lower wavelength) in step 10 and (ii) the optical configuration of the devices in step 60 (e.g., a vertically emissive device 70 where the light output vector or direction is substantially perpendicular to the plane of the epi-layers, or a waveguide device 75 where the light output vector is substantially parallel to the plane of the epi-layers).
  • the optical emission characteristics of the device is implemented in part by selection of semiconductor materials 20 and optical materials 30.
  • the optoelectronic semiconductor device constructed in accordance with the process illustrated in FIG.1 will comprise an optical emission region based on the selected optical emission region material 35 wherein a photon is created by the advantageous spatial recombination of an electron in the conduction band and a hole in the valence band.
  • the optical emission region comprises one or more metal oxide layers.
  • the optical emission region may be a direct bandgap type band structure configuration. This can be an intrinsic property of the materials(s) selected or can be tuned using one or more of the techniques of the present disclosure.
  • the optical recombination or optical emission region may be clad by electron and hole reservoirs comprising n-type and p-type conductivity regions.
  • the n-type and p-type conductivity regions are selected from electron and hole injection materials 45 that may have larger bandgaps relative to the optical emission region material 35, or can comprise an indirect bandgap structure that limits the optical absorption at the operating wavelength.
  • the n-type and p-type conductivity regions are formed of one or more metal oxide layers.
  • Impurities suitable for n-type doping are Si, Ge, Sn and rare-earths (e.g., Erbium (Er) and Gadolinium (Gd)).
  • the use of Ge-fluxes for co-deposition doping control is particularly suitable.
  • Ga-sites can be substituted via Magnesium (Mg 2+ ), Zinc (Zn 2+ ) and atomic-Nitrogen (N 3- substitution for O- sites). Further improvements can also be obtained using Iridium (Ir), Bismuth (Bi), Nickel (Ni) and Palladium (Pd).
  • Digital alloys using NiO, Bi 2 O 3 , Ir 2 O 3 and PdO may also be used in some embodiments to advantageously aid p-type formation in Ga 2 O 3 -based materials. While p-type doping for AlGaO 3 is possible, alternative doping strategies are also possible using cubic crystal symmetry metal oxides (e.g. Li-doped NiO or Ni vacancy NiO x>1 ) and wurtzite p-type Mg:GaN.
  • FIGS.2A and 2B show schematically a vertical emission device 110 and waveguide emissive device 140 in accordance with illustrative embodiments.
  • Device 110 has a substrate 105 and emission structure 135.
  • device 140 has a substrate 155 and emission structure 145.
  • metal oxide semiconductors have extremely large bandgap energy, they have a substantially lower refractive index compared to III-N materials. Therefore, the use of metal oxide materials provides an improved light escape cone and therefore higher optical output coupling efficiency compared to conventional emission devices.
  • Waveguide devices having single mode and multimode operation are also possible.
  • Broad area stripe waveguides can also be constructed further utilizing elemental metals Al- or Mg- metal to directly form ultraviolet plasmon guiding at the semiconductor-metal interface. This is an efficient method for forming waveguide structures.
  • FIG.3A depicts functional regions of the epitaxial structure of an optoelectronic semiconductor device 160 for generating light of a predetermined wavelength according to an illustrative embodiment.
  • a substrate 170 is provided with advantageous crystal symmetry and in-plane lattice constant matching at the surface to enable homoepitaxy or heteroepitaxy of a first conductivity type region 175 with a subsequent non-absorbing spacer region 180, an optical emission region 185, an optional second spacer region 190 and a second conductivity type region 195.
  • the in-plane lattice constant and the lattice geometry/arrangement are matched to modify (i.e., reduce) lattice defects.
  • Electrical excitation is provided by a source 200 that is connected to the electron and hole injection regions of the first and second conductivity type regions 175 and 195.
  • ohmic metal contacts and low-bandgap or semi-metallic zero-bandgap oxide semiconductors are shown in FIG.3B as regions 196, 197, 198 in another illustrative embodiment.
  • First and second conductivity type regions 175 and 195 are formed in one example using metal oxides having wide bandgap and are electrically contacted using ohmic contact regions 197, 198 and 196 as described herein.
  • the electrical contact configuration is via ohmic contact region 198 and first conductivity type region 175 for one electrical conductivity type (viz., electron or holes) and the other using ohmic contact region 196 and second conductivity type region 195.
  • Ohmic contact region 198 may optionally be made to an exposed portion of first conductivity type region 175.
  • the insulating substrate 170 may further be transparent or opaque to the operating wavelength, for the case of a transparent substrate the lower ohmic contact region 197 may be utilized as an optical reflector as part of an optical resonator in another embodiment.
  • the substrate 170 is electrically conducting and maybe either be transparent or opaque to the operating wavelength.
  • FIG.3C illustrates schematically further possible electrical arrangements for the electrical contact regions 196 and 198 showing a mesa etched portion to expose lower conductivity type regions 175 and 198.
  • the ohmic contact region 196 may further be patterned to expose a portion of the device for light extraction.
  • FIG.3D shows yet a further electrical configuration wherein the insulating substrate 170 is used such that the first conductivity type region 175 is exposed and an electrical contact formed on a partially exposed portion of first conductivity type region 175.
  • FIG.3E yet further shows a possible arrangement of an optical aperture 199 etched partially or fully into an optically opaque substrate 170 for the optical coupling of light generated from optical emission region 185.
  • the optical aperture may be utilized with the previous embodiments of FIGS.3A-3D as well.
  • FIG.4 shows schematically operation of optoelectronic semiconductor device 160 wherein an example configuration comprises an electron injection region 180 and a hole injection region 190 with electrical bias 200 to transport and direct mobile electrons 230 and holes 225 into the recombination region 220.
  • E G Extremely large energy bandgap
  • E G >4eV metal oxide semiconductors
  • the region in the vicinity of the hole injection region 190 and recombination region 220 may then become advantageous for recombination process.
  • the hole injection region 190 itself may be the preferred region for injecting electrons such that recombination region 220 is located within a portion of hole injection region 190.
  • light or optical emission is generated within the device 160 by selective spatial recombination of electrons and holes to create high energy photons 240, 245 and 250 of a predetermined wavelength dictated by the configuration of the band structure of the metal oxide layer or layers forming the optical emission region 185 as will be described below.
  • the electrons and holes are both instantaneously annihilated to create a photon that is a property of the band structure of the metal oxide selected.
  • the light generated within optical emission region 185 can propagate within the device according to the crystal symmetry of the metal oxide host regions.
  • the crystal symmetry group of the host metal oxide semiconductor has definite energy and crystal momentum dispersion known as the E-k configuration that characterizes the band structure of various regions including the optical emission region 185.
  • the non-trivial E-k dispersions are fundamentally dictated by the underlying physical atomic arrangements of definite crystal symmetry of the host medium.
  • the possible optical polarizations, optical energy emitted and optical emission oscillator strengths are directly related to the valence band dispersion of the host crystal.
  • embodiments advantageously configure the band structure including the valence band dispersion of selected metal oxide semiconductors for application to optoelectronic semiconductor devices, such as for, in one example, UVLEDs.
  • Light 240 and 245 generated vertically requires optical selection rules of the underlying band structure to be fulfilled. Similarly, there are optical selection rules for generation of lateral light 250. These optical selection rules can be achieved by advantageous arrangement of the crystal symmetry types and physical spatial orientation of the crystal for each of the regions within the UVLED. Advantageous orientation of the constituent metal oxide crystals as a function of the growth direction is beneficial for optimal operation of the UVLEDs of the present disclosure. Furthermore, selection of the optical properties 30 in the process flow diagram illustrated in FIG.1 such as the refractive index forming the waveguide type device is indicated for optical confinement and low loss.
  • FIG.6 further shows for completeness, another embodiment comprising an optical aperture 260 disposed within optoelectronic semiconductor device 160 to enable the use of materials 195 which are opaque to the operating wavelength to provide optical out coupling from optical emission region 185.
  • FIG.7 shows by way of overview, selection criteria 270 for one or more metal oxide crystal compositions in accordance with illustrative embodiments.
  • semiconductor materials 275 are selected.
  • the semiconductor materials 275 may include metal-oxide semiconductors 280, which may be one or more of binary oxides, ternary oxides or quaternary oxides.
  • the recombination region 220 forming the optical emission region 185 of optoelectronic semiconductor device 160 is selected to exhibit efficient electron-hole recombination whereas the conductivity type regions are selected for their ability to provide sources of electrons and holes.
  • Metal oxide semiconductors can also be created selectively from a plurality of possible crystal symmetry types even with the same species of constituent metals. Binary metal oxides of the form AxOy comprising one metal species may be used, wherein the metal specie (A) is combined with oxygen (O) in the relative proportions x and y. Even with the same relative proportions x and y, a plurality of crystal structure configurations are possible having vastly different crystal symmetry groups.
  • compositions Ga 2 O 3 and Al 2 O 3 exhibit several advantageous and distinct crystal symmetries (e.g., monoclinic, rhombohedral, triclinic and hexagonal) but require careful attention to the utility of incorporating them and constructing a UVLED.
  • Other advantageous metal oxide compositions such as MgO and NiO, exhibit less variation in practically attainable crystal structures, namely cubic crystals.
  • Addition of advantageous second dissimilar metal species (B) can also augment a host binary metal oxide crystal structure to create a ternary metal oxide of the form AxByOn. Ternary metal oxides range from dilute addition of B-species up to a majority relative fraction.
  • ternary metal oxides may be adopted for the advantageous formation of direct bandgap optically emissive structures in various embodiments.
  • further materials can be engineered comprising three dissimilar cation-atom species coupled to oxygen forming a quaternary composition A x B y C z O n .
  • a larger number (>4) of dissimilar metal atoms can theoretically be incorporated to form complex oxide materials - they are seldom capable of producing high crystallographic quality with exceptionally distinct crystal symmetry structures.
  • Such complex oxides are in general polycrystalline or amorphous and therefore lack optimal utility for the applications to an optoelectronic device.
  • the present disclosure seeks in various examples substantially single crystal and low defect density configurations in order to exploit the band structure to form UVLED epitaxial formed devices. Some embodiments also include achieving desirable E-k configurations by the addition of another dissimilar metal specie.
  • Selection of desired bandgap structures for each of the UVLED regions of optoelectronic semiconductor device 160 may also involve integration of dissimilar crystal symmetry types. For example, a monoclinic crystal symmetry host region and a cubic crystal symmetry host region comprising a portion of the UVLED may be utilized.
  • the epitaxial formation relationships then involve attention toward the formation of low defect layer formation.
  • the type of layer formation steps are then classed 285 as homo-symmetry and hetero- symmetry formation.
  • band structure modifiers 290 can be utilized such as biaxial strain, uniaxial strain and digital alloys such as superlattice formation.
  • the epitaxy process 295 is then defined by the types and sequence of material composition required for deposition. The present disclosure describes new processes and compositions for achieving this goal.
  • FIG.8 shows the epitaxy process 300 formation steps.
  • a film formation substrate for supporting the optical emission region is selected with desirable properties of crystal symmetry type, and optical and electrical characteristics.
  • the substrate is selected to be optically transparent to the operating wavelength and a crystal symmetry compatible with the epitaxial crystal symmetry types required.
  • the substrate surface has a definite 2-dimensional crystal arrangement of terminated surface atoms. In vacuum, on a prepared surface this discontinuity of definite crystal structure results in a minimization of surface energy of the dangling bonds of the terminated atoms.
  • a metal oxide surface can be prepared as an oxygen terminated surface or in another embodiment as a metal-terminated surface.
  • Metal oxide semiconductors can have complex crystal symmetry, and pure specie termination may require careful attention.
  • both Ga 2 O 3 and Al 2 O 3 can be O-terminated by high temperature anneal in vacuum followed by sustained exposure to atomic or molecular oxygen at high temperature.
  • the crystal surface orientation 320 of the substrate can also be selected to achieve selective film formation crystal symmetry type of the epitaxial metal oxide.
  • A- plane sapphire can be used to advantageously select (110)-oriented alpha-phase formation high quality epitaxial Ga 2 O 3 , AlGaO 3 and Al 2 O 3 ; whereas for C-plane sapphire hexagonal and monoclinic Ga 2 O 3 and AlGaO 3 films are generated.
  • Ga 2 O 3 oriented surfaces are also used selectively for film formation selection of AlGaO 3 crystal symmetry.
  • the growth conditions 325 are then optimized for the relative proportions of elemental metal and activated oxygen required to achieve the desired material properties.
  • the growth temperature also plays an important role in determining the crystal structure symmetry types possible.
  • the judicious selection of the substrate surface energy via appropriate crystal surface orientation also dictates the temperature process window for the epitaxial process during which the epitaxial structure 330 is deposited.
  • a materials selection database 350 for the application toward UVLED based optoelectronic devices is disclosed in FIG.9.
  • Metal oxide materials 380 are plotted as a function of their electron affinity energy 375 relative to vacuum.
  • LiF lithium fluoride
  • bandgap 370 represented as the box for each material
  • the absolute energy positions represented by conduction band minimum 360 and valence band maximum 365 are plotted with respect to the vacuum energy.
  • narrow bandgap material such as rare-earth nitride (RE-N), germanium (Ge), palladium-oxide (PdO) and silicon (Si) do not offer suitable host properties for the optical emission region, they can be used advantageously for electrical contact formation.
  • Desirable materials combinations for use as a substrate are bismuth-oxide (Bi 2 O 3 ), nickel-oxide (NiO), germanium-oxide (GeO x ⁇ 2 ), gallium-oxide (Ga 2 O 3 ), lithium-oxide (Li 2 O), magnesium-oxide (MgO), aluminum-oxide (Al 2 O 3 ), single crystal quartz SiO 2 , and ultimately lithium-fluoride 355 (LiF).
  • Al 2 O 3 (sapphire), Ga 2 O 3 , MgO and LiF are available as large high-quality single crystal substrates and may be used as substrates for UVLED type optoelectronic devices in some embodiments.
  • Additional embodiments for substrates for UVLED applications also include single crystal cubic symmetry magnesium aluminate (MgAl 2 O 4 ) and magnesium gallate (MgGa 2 O 4 ).
  • the ternary form of AlGaO 3 may be deployed as a bulk substrate in monoclinic (high Ga%) and corundum (high Al%) crystal symmetry types using large area formation methods such as Czochralski (CZ) and edge-fed growth (EFG).
  • alloying and/or doping via elements selected from database 350 are advantageous for film formation properties.
  • elements selected from Silicon (Si), Germanium (Ge), Er (Erbium), Gd (Gadolinium), Pd (Palladium), Bi (Bismuth), Ir (Iridium), Zn (Zinc), Ni (Nickel), Li (Lithium), Magnesium (Mg) are desirable crystal modification specie to form ternary crystal structures or dilute additions to the Al 2 O 3 , AlGaO 3 or Ga 2 O 3 host crystals (see semiconductors 280 of FIG.7).
  • Further embodiments include selection of the group of crystal modifiers selected from the group of Bi, Ir, Ni, Mg, Li.
  • group of crystal modifiers selected from the group of Bi, Ir, Ni, Mg, Li.
  • Bi and Ir can be added to enable p-type impurity doping.
  • Ni and Mg cations can also enable p-type impurity substitutional doping at Ga or Al crystal sites.
  • Lithium may be used as a crystal modifier capable of increasing the bandgap and modifying the crystal symmetry possible, ultimately toward orthorhombic crystal symmetry lithium gallate (LiGaO 2 ) and tetragonal crystal symmetry aluminum-gallate (LiAlO 2 ).
  • FIG.10 depicts a sequential epitaxial layer formation process flow 400 utilized to epitaxially integrate the material regions as defined in optoelectronic semiconductor device 160 according to an illustrative embodiment.
  • a substrate 405 is prepared with surface 410 configured to accept a first conductivity type crystal structure layer(s) 415 which may comprise a plurality of epitaxial layers.
  • Next first spacer region composition layer(s) 420 which may comprise a plurality of epitaxial layers is formed on layer 415.
  • An optical emission region 425 is then formed on layer 420, in which region 425 may comprise a plurality of epitaxial layers.
  • region 425 may comprise a plurality of epitaxial layers.
  • a second spacer region 430 which may comprise a plurality of epitaxial layers is then deposited on region 425.
  • a second conductivity type cap region 435 which may comprise a plurality of epitaxial layers then completes a majority of the UVLED epitaxial structure.
  • Other layers may be added to complete the optoelectronic semiconductor device, such as ohmic metal layers and passive optical layers, such as for optical confinement or antireflection.
  • a possible selection of ternary metal oxide semiconductors 450 is shown for the cases of Gallium-Oxide-based (GaOx-based) compositions 485.
  • Optical bandgap 480 for various values of x in ternary oxide alloys A x B 1-x O are graphed.
  • metal oxides may exhibit several stable forms of crystal symmetry structure which is further complicated by the addition of another specie to form a ternary.
  • the example general trend can be found by selectively incorporating or alloying Aluminum, group-II cations ⁇ Mg, Ni, Zn ⁇ , Iridium, Erbium and Gadolinium atoms, as well as Lithium atoms advantageously with Ga-Oxide.
  • Ni and Ir typically form deep d-bands but for high Ga% can form useful optical structures.
  • Ir is capable of multiple valence states, where in some embodiments the Ir 2 O 3 form is utilized.
  • FIG.12 also shows the energy gap 502 of the alpha-phase aluminum oxide (Al 2 O 3 ) having rhombohedral crystal symmetry.
  • FIG.12 can therefore be understood with application to forming the optically emissive and conductivity type regions in accordance with the present disclosure.
  • Shown in FIG.28 is a chart 2800 of potential ternary oxide combinations for (0 ⁇ x ⁇ 1) that may be adopted in accordance with the present disclosure.
  • Chart 2800 shows the crystal growth modifier down the left-hand column and the host crystal across the top of the chart.
  • FIGS.13A and 13B are electron energy-vs-crystal momentum representations of possible metal oxide based semiconductors showing a direct bandgap (FIG.13A) and indirect bandgap (FIG.13B) and are illustrative of concepts related to the formation of optoelectronic devices in accordance with the present disclosure. It is known by workers in the field of quantum mechanics and crystal structure design that symmetry directly dictates the electronic configuration or band structure of a single crystal structure. [0592] In general, for application to optically emissive crystal structures, there exists two classes of electronic band structure as shown in FIGS.13A and 13B.
  • the fundamental process utilized in optoelectronic devices of the present disclosure is the recombination of physical (massive) electron and hole particle-like charge carriers which are manifestations of the allowed energy and crystal momentum.
  • the recombination process can occur conserving crystal momentum of the incident carriers from their initial state to the final state.
  • To achieve a final state, wherein the electron and hole annihilate to form a massless photon (i.e., momentum K ⁇ of final state massless photon K ⁇ 0), requires a special E- k band structure which is shown in FIG.13A.
  • a metal oxide semiconductor structure having pure crystal symmetry can be calculated using various computational techniques.
  • FIG.13A represents the reciprocal space energy-versus-crystal momentum or band structure 520 for a crystal structure.
  • the lowest lying conduction band 525 having energy dispersion with respect to crystal momentum vector describes the allowed configuration space for electrons.
  • the highest lying valence band 535 having energy dispersion also describes the allowed energy states for holes (positively charged crystal particles).
  • the dispersions 525 and 535 are plotted with respect to the electron energy (increasing direction 530, decreasing direction 585) in units of electron volts and the crystal momentum in units of reciprocal space (positive K BZ 545 and negative K BZ 540 representing distinct crystal wavevectors from the Brillouin zone center).
  • the bandgap is defined by the energy difference between the minima and maxima of 525 and 535, respectively. An electron propagating through the crystal will minimize energy and relax to the conduction band minimum 565, similarly a hole will relax to the lowest energy state 580.
  • the minimum bandgap energy 600 is still defined as the energy difference between the conduction band minimum and the valence band maximum which do occur at the same wavevector, and is known as the indirect bandgap energy 600.
  • Optical emission processes are clearly not favorable as crystal momentum cannot be conserved for the recombination event and requires secondary particles to conserve crystal momentum, such as crystal vibrational quanta phonons.
  • the longitudinal optical phonon energy scales with bandgap and are in comparison very large to those found in for example, GaAs, Si and the like.
  • FIGS.13C-13E each show three valence bands E vi (k) 621, 622 and 623.
  • FIG.13C the optically allowed electric dipole transition are shown for an electron 566 and a hole 624 being allowed for optical polarization vectors within the a-axis and c-axis of the monoclinic unit cell.
  • E-k this corresponds to wave vector 627 in the ⁇ -Y branches.
  • electric-dipole transition between electron 566 and hole 625 in FIG.13D are allowed for polarizations along the c-axis 628 of the crystal unit cell.
  • higher energy transitions between electron 566 and hole 626 in FIG.13E are allowed for optical polarization fields along the b-axis 629 of the unit cell corresponding to the E-k ( ⁇ -X) branch.
  • FIGS.14A and 14B show the representations of complex E-k materials by single blocks 633 defined by the layer thickness 655, 660 and 665 and the fundamental bandgap energy 640, 645 and 650, respectively. The relative alignments of the conduction and valence band edges are shown in blocks 633.
  • FIG.14B represents the electron energy 670versus a spatial growth direction 635 for three distinct materials having bandgap energies 640, 645 and 650.
  • a first region deposited along a growth direction 635 using an indirect type crystal but otherwise having a final surface lattice constant geometry capable of providing mechanical elastic deformation of the subsequent crystal 645 is possible. For example, this can occur for the growth of AlGaO 3 directly on Ga 2 O 3 .
  • Epitaxial Fabrication Methods are known in the prior art and are called Atomic and Molecular Beam Epitaxy, Chemical Vapor Epitaxy or Physical Vapor Epitaxy. Atomic and Molecular Beam Epitaxy utilizes atomic beams of constituents directed toward a growth surface spatially separate as shown FIG.15.
  • molecular beams are also used it is the combination of molecular and atomic beams which may be used in accordance with the present disclosure.
  • One guiding principle is the use of pure constituent sources that can be multiplexed at a growth surface through favorable condensation and kinematically favored growth conditions to physically build a crystal atomic layer by layer. While the growth crystal can be substantially self-assembled, the control of the present methods can also intervene at the atomic level and deposit single specie atomic thick epilayers. Unlike equilibrium growth techniques which rely on the thermodynamic chemical potentials for bulk crystal formation, the present techniques can deposit extraordinarily thin atomic layers at growth parameters far from the equilibrium growth temperature for a bulk crystal.
  • Al 2 O 3 films are formed at film formation temperature in the range of 300-800 oC, whereas the conventional bulk equilibrium growth of Al 2 O 3 (Sapphire) is produced well in excess of 1500 oC requiring a molten reservoir containing Al and O liquid which can be configured to position a solid seed crystal in close proximity to the molten surface. Careful positioning of a seed crystal orientation is placed in contact to the melt which forms a recrystallized portion in the vicinity of the melt. Pulling the seed and partially solidified recrystallized portion away from the melt forms a continuous crystal boule. [0608] Such equilibrium growth methods for metal oxides limit the possible combinations of metals and the complexity of discontinuous regions possible for heteroepitaxial formation of complex structures.
  • the non-equilibrium growth techniques in accordance with the present disclosure can operate at growth parameters well away from the melting point of the target metal oxide and can even modulate the atomic specie present in a single atomic layer of a unit cell of crystal along a preselected growth direction.
  • Such non-equilibrium growth methods are not bound by equilibrium phase diagrams.
  • the present methods utilize evaporated source materials comprising the beams impinging upon the growth surface to be ultrapure and substantially charge neutral. Charged ions are in some cases created but these should be minimized as best possible.
  • the constituent source beams can be altered in a known way for their relative ratio.
  • oxygen-rich and metal-rich growth conditions can be attained by control of the relative beam flux measured at the growth surface. While nearly all metal oxides grow optimally for oxygen-rich growth conditions, analogous to arsenic-rich growth of gallium arsenide GaAs, some materials are different. For example, GaN and AlN require metal rich growth conditions with extremely narrow growth window, which are one of the most limiting reasons for high volume production. [0610] While metal oxides favor oxygen-rich growth with wide growth windows - there are opportunities to intervene and create intentional metal-deficient growth conditions. For example, both Ga 2 O 3 and NiO favor cation vacancies for the production of active hole conductivity type. A physical cation vacancy can produce an electronic carrier type hole and thus favor p-type conduction.
  • the optoelectronic semiconductor device is configured to emit light in the wavelength of about 150 nm to about 280 nm.
  • a metal oxide substrate is provided having an epitaxial growth surface.
  • the epitaxial growth surface is oxidized to form an activated epitaxial growth surface.
  • the activated epitaxial growth surface is exposed to one or more atomic beams each comprising high purity metal atoms and one or more atomic beams comprising oxygen atoms under conditions to deposit two or more epitaxial metal oxide films or layers.
  • an epitaxial deposition system 680 for providing Atomic and Molecular Beam Epitaxy in accordance with, in one example, method 4100 referred to in FIG.41.
  • a substrate 685 rotates about an axis AX and is heated radiatively by a heater 684 with emissivity designed to match the absorption of a metal oxide substrate.
  • the high vacuum chamber 682 has a plurality of elemental sources 688, 689, 690, 691, 692 capable of producing atomic or molecular species as beams of a pure constituent of atoms. Also shown are plasma source or gas source 693, and gas feed 694 which is a connection to gas source 693.
  • sources 689-692 may comprise effusion type sources of liquid Ga and Al and Ge or precursor based gases.
  • the active oxygen sources 687 and 688 may be provided via plasma excited molecular oxygen (forming atomic-O and O 2 *), ozone (O 3 ), nitrous oxide (N 2 O) and the like.
  • plasma activated oxygen is used as a controllable source of atomic oxygen.
  • a plurality of gases can be injected via sources 695, 696, 697 to provide a mixture of different species for growth.
  • gases For example, atomic and excited molecular nitrogen enable n-type, p-type and semi-insulating conductivity type films to be created in GaOxide-based materials.
  • the vacuum pump 681 maintains vacuum, and mechanical shutters intersecting the atomic beams 686 modulate the respective beam fluxes providing line of sight to the substrate deposition surface.
  • This method of deposition is found to have particular utility for enabling flexibility toward incorporating elemental species into Ga-Oxide based and Al-Oxide based materials.
  • FIG.16 shows an embodiment of an epitaxial process 700 for constructing UVLEDs as a function of the growth direction 705.
  • Homo-symmetry type layers 735 can be formed using a native substrate 710.
  • the substrate 710 and crystal structure epitaxy layers 735 are homo-symmetrical, being labeled here as Type-1.
  • a corundum type sapphire substrate can be used to deposit corundum crystal symmetry type layers 715, 720, 725, 730.
  • a monoclinic substrate crystal symmetry to form monoclinic type crystal symmetry layers 715-730. This is readily possible using native substrates for growth of the target materials disclosed herein (e.g., see Table I of FIG.43A).
  • epitaxial layer formations such as corundum AlGaO 3 having a plurality of compositions of layers 715-730.
  • a monoclinic Ga 2 O 3 substrate 710 can be used to form a plurality of monoclinic AlGaO 3 compositions of layers 715-730.
  • a further epitaxial process 740 is illustrated that uses a substrate 710 with crystal symmetry that is inherently dissimilar to the target epitaxial metal oxide epilayer crystal types of layers 745, 750, 755, 760. That is, the substrate 710 is of crystal symmetry Type-1 which is hetero-symmetrical to the crystal structure epitaxy 765 that is made of layers 745, 750, 755, 760 that are all Type-2.
  • C-plane corundum sapphire can be used as a substrate to deposit at least one of a monoclinic, triclinic or hexagonal AlGaO 3 structure.
  • a monoclinic, triclinic or hexagonal AlGaO 3 structure can be used as a substrate to deposit at least one of a monoclinic, triclinic or hexagonal AlGaO 3 structure.
  • Another example is the use of (110)-oriented monoclinic Ga 2 O 3 substrate to epitaxially deposit corundum AlGaO 3 structure.
  • a MgO (100) oriented cubic symmetry substrate to epitaxially deposit (100)-oriented monoclinic AlGaO 3 films.
  • Process 740 can also be used to create corundum Ga 2 O 3 modified surface 742 by selectively diffusing Ga-atoms into the surface structure provided by the Al 2 O 3 substrate.
  • Ga-adatoms attach selectively to O-sites and form a volatile sub-oxide Ga 2 O, and further excess Ga diffuses Ga-adatoms into the Al 2 O 3 surface.
  • a corundum Ga 2 O 3 surface structure results enabling lattice matching of Ga-rich AlGaO 3 corundum constructions or thicker layers can result in monoclinic AlGaO 3 crystal symmetry.
  • FIG.18 describes yet another embodiment of a process 770 wherein a buffer layer 775 is deposited on the substrate 710, the buffer layer 775 having the same crystal symmetry type as substrate 710 (Type-1), thereby enabling atomically flat layers to seed alternate crystal symmetry types of layers 780, 785, 790 (Type 2, 3...N).
  • a monoclinic buffer 775 is deposited upon a monoclinic bulk Ga 2 O 3 substrate 710. Then cubic MgO and NiO layers 780- 790 are formed.
  • the hetero-symmetrical crystal structure epitaxy with the homo- symmetrical buffer layer is labeled as structure 800.
  • FIG.19 depicts yet a further embodiment of a process 805 showing sequential variation along a growth direction 705 of a plurality of crystal symmetry types.
  • a corundum Al 2 O 3 substrate 710 (Type-1) creates an O-terminated template 810 which then seeds a corundum AlGaO 3 layer 815 of Type-2 crystal symmetry.
  • a hexagonal AlGaO 3 layer 820 of Type-3 crystal symmetry can then be formed followed by cubic crystal symmetry type (Type-N) such as a MgO or NiO layer 830.
  • the layers 815, 820, 825 and 830 are collectively labeled in this figure as hetero-symmetrical crystal structure epitaxy 835.
  • FIG.20A Yet another embodiment is shown in FIG.20A where the substrate 710 of Type-1 crystal symmetry has a prepared surface (template 810) seeding a first crystal symmetry type 815 (Type-2) which then can be engineered to transition to another symmetry type 845 (Transition Type 2-3) over a given layer thickness.
  • An optional layer 850 can then be grown with yet another crystal symmetry type (Type-N).
  • C-plane sapphire substrate 710 forms a corundum Ga 2 O 3 layer 815 which then relaxes to a hexagonal Ga 2 O 3 crystal symmetry type or a monoclinic crystal symmetry type. Further growth of layer 850 then can be used to form a high quality relaxed layer of high crystal structure quality.
  • the layers 815, 845 and 850 are collectively labeled in this figure as hetero-symmetrical crystal structure epitaxy 855.
  • FIG.20B there is shown a chart 860 of the variation in a particular crystal surface energy 865 as a function of crystal surface orientation 870 for the cases of corundum-Sapphire 880 and monoclinic Gallia single crystal oxide materials 875.
  • the crystal surface energy for technologically relevant corundum Al 2 O 3 880 and monoclinic substrates can be used to selectively form AlGaO 3 crystal symmetry types.
  • Sapphire C-plane can be prepared under O-rich growth conditions to selectively grow hexagonal AlGaO 3 at lower growth temperature ( ⁇ 650 oC) and monoclinic AlGaO 3 at higher temperatures (>650 oC).
  • Monoclinic AlGaO 3 is limited to Al% of approximately 45-50% owing to the monoclinic crystal symmetry having approximately 50% tetrahedrally coordinated bonds (TCB) and 50% octahedrally coordinated bonds (OCB).
  • R-plane sapphire can accommodate corundum AlGaO 3 compositions with Al% ranging 0-100% grown at low temperatures of less than about 550 oC under O-rich conditions and monoclinic AlGaO 3 with Al ⁇ 50% at elevated temperatures >700 oC.
  • the Al% for (-201)-oriented films is significantly lower owing to the TCB presented by the growing crystal surface. This does not favor large Al fractions but can be used to form extremely shallow MQWs of AlGaO 3 / Ga 2 O 3 .
  • the (010)- and (001)-oriented surface of monoclinic Ga 2 O 3 can accommodate monoclinic AlGaO 3 structures of exceedingly high crystal quality.
  • the main limitation for AlGaO 3 Al% is the accumulation of biaxial strain. Careful strain management in accordance with the present disclosure using AlGaO 3 / Ga 2 O 3 superlattices also finds a limiting Al% ⁇ 40%, with higher quality films achieved using (001)-oriented Ga 2 O 3 substrate.
  • VBS valence band structure
  • the band structures for both corundum and monoclinic Al 2 O 3 are direct.
  • Al 2 O 3 , Ga 2 O 3 or AlGaO 3 thin films onto a suitable surface which can elastically strain the in-plane lattice constant of the film may be achieved and engineered in accordance with the present disclosure.
  • the lattice constant mismatches between Al 2 O 3 and Ga 2 O 3 are shown in Table II of FIG.43B.
  • the ternary alloys can be roughly interpolated between the end point binaries for the same crystal symmetry type.
  • an Al 2 O 3 film deposited on a Ga 2 O 3 substrate conserving crystal orientations will create the Al 2 O 3 film in biaxial tension, whereas a Ga 2 O 3 film deposited on an Al 2 O 3 substrate having the same crystal orientation will be in a state of compression.
  • FIGS.21A-21B The monoclinic and corundum crystals have non-trivial geometric structures with relatively complex strain tensors compared to conventional cubic, zinc-blende or even wurtzite crystals.
  • FIGS.21A-21B The general trend observed on E-k dispersion in vicinity of the BZ center is shown in FIGS.21A-21B.
  • Biaxial compression of the unit cell 899 in diagram 895 of FIG.21B changes the dispersion by hydrostatically lifting the conduction band, e.g., see conduction band 896 and warping the E-k curvature of the valence band 897.
  • the compressively strained ( ⁇ 0) bandgap 898 is generally increased .
  • biaxial tension applied to the unit cell 904 has the effect of reducing the bandgap 903 lowering the conduction band 901 and flattening the valence band curvature 902.
  • valence band curvature is directly related to the hole effective mass, a larger curvature decreases the effective hole mass, whereas smaller curvature (i.e., flatter E-k bands) increase the hole effective mass (note: a totally flat valence band dispersion potentially creates immobile holes). Therefore, it is possible to improve the Ga 2 O 3 valence band dispersion by judicious choice of biaxial strain via the epitaxy on a suitable crystal surface symmetry and in-plane lattice structure.
  • FIG.22B shows the advantageous deformation of the valence band structure for the case of a direct bandgap.
  • the valence band dispersion can be tuned from an indirect to a direct band gap as shown in FIGS.23A or 23B transitioning to FIG.23C.
  • the strain- free band structure 915 of FIG.23B having conduction band 916, valence band 917, bandgap 918 and valence band maximum 919.
  • compressive structure 910 of FIG.23A shows conduction band 911, valence band 912, bandgap 913 and valence band maximum 914.
  • Tensile structure 920 of FIG.23C shows conduction band 921, valence band 922, bandgap 923 and valence band maximum 924.
  • Detailed calculations and experimental angle resolved photoelectron spectroscopy (ARPES) can show that compressive and tensile strain applied to thin films of Ga 2 O 3 can warp the valence band as shown in structures 910 and 920 for the cases of compressive (valence band 912) and tensile (valence band 922) uniaxial strain applied along the b-axis or c-axis of the monoclinic Ga 2 O 3 unit cell. [0646] As shown by these figures, strain plays an important role which typically will require management for complex epitaxy structure.
  • Band structure 925 comprises metal oxide A-O with crystal structure material 930 built from metal atoms 928 and oxygen atoms 929 having conduction band 926, valence band dispersion 927 and direct bandgap 931.
  • Another binary metal oxide B-O has a crystal structure material 940 built from a different metal cation 938 of type B and oxygen atoms 939 and has an indirect band structure 935 with conduction band 936, bandgap 941 and valence band dispersion 937.
  • the common anion is oxygen
  • both A-O and B-O have the same underlying crystal symmetry type.
  • a ternary alloy may be formed by mixing cation sites with metal atoms A and B within an otherwise similar oxygen matrix to form (A-O) x (B-O) 1-x this will result in an A x B 1-x O composition with the same underlying crystal symmetry.
  • FIG.25B Note: FIGS.25A and 25C reproduce FIGS.24A and 24B.
  • the direct valence band dispersion 927 of A-O crystal structure material 930 alloyed with B-O crystal structure material 940 having indirect valence band dispersion 937 can produce a ternary material 948 that exhibits improved valence band dispersion 947, and having conduction band 946 and bandgap 949. That is, atomic species A of material 930 incorporated into B-sites of material 940 can augment the valence band dispersion.
  • Atomistic Density Functional Theory calculations can be used to simulate this concept which will fully account for the pseudopotentials of the constituent atoms, strain energy and crystal symmetry.
  • alloying corundum Al 2 O 3 and Ga 2 O 3 can result in a direct bandgap for the band structure of the ternary metal oxide alloy and can also improve the valence band curvature of monoclinic crystal symmetry compositions.
  • Configuration of the Band Structure by Selection of Digital Alloy Fabrication While ternary alloy compositions such as AlGaO 3 are desirable, an equivalent method for creating a ternary alloy is by the use of digital alloy formation employing superlattices (SLs) built from periodic repetitions of at least two dissimilar materials.
  • SLs superlattices
  • the superlattice periodicity forms a ‘mini-Brillouin zone’ within the crystal band structure as shown in FIG.27A.
  • a new periodicity is superimposed over the inherent crystal structure by the formation of the predetermined SL structure.
  • the SL periodicity is typically in the one-dimension of the epitaxial film formation growth direction.
  • Region 958 is a forbidden energy gap ( ⁇ E) between the energy band states 953 and 954, which are the bulk-like energy bands of materials 955 and 956.
  • This type of SL structure in FIG.27B can be created using bi-layered pairs comprising in different examples: AlxGa 1-x O/Ga 2 O 3 , AlxGa 1-x O 3 /Al 2 O 3 , Al 2 O 3 /Ga 2 O 3 and Al x Ga 1-x O 3 /Al y Ga 1-y O 3 .
  • the general use of SLs to configure an optoelectronic device is disclosed in US Patent No.10,475,956.
  • FIG.27C shows the SL structure for the case of a digital binary metal oxide comprising Al 2 O 3 layers 983 and Ga 2 O 3 layers 984.
  • the structure is shown in terms of electron energy 981 as a function of epitaxial growth direction 982.
  • the period of the SL forming the repeating unit cell 980 is repeated in integer or half-integer repetitions. For example, the number of repetitions can vary from 3 or more periods and even up to 100 or 1000 or more.
  • FIGS.27D-27F Yet further examples of SL structures possible are shown in FIGS.27D-27F.
  • the digital alloy concept can be expanded to other dissimilar crystal symmetry types, for example cubic NiO 987 and monoclinic Ga 2 O 3 986 as shown in FIG.27D where the digital alloy 985 simulates an equivalent ternary (NiO) x (Ga 2 O 3 ) 1-x bulk alloy.
  • FIG.27D where the digital alloy 985 simulates an equivalent ternary (NiO) x (Ga 2 O 3 ) 1-x bulk alloy.
  • Yet a further example is shown in digital alloy 990 of FIG.27E using cubic MgO layers 991 and cubic NiO layers 992 comprising the SL.
  • MgO and NiO have a very close lattice match, unlike Al 2 O 3 and Ga 2 O 3 which are high lattice mismatched.
  • a four layer period SL996 is shown in the digital alloy 995 of FIG.27F where cubic MgO and NiO with oriented growth along (100) can coincidence lattice match for (100)- oriented monoclinic Ga 2 O 3 .
  • Such a SL would have an effective quaternary composition of Ga x Ni y Mg z O n .
  • Al-Ga-Oxide Band Structures [0664] The UVLED component regions can be selected using binary or ternary Al x Ga 1- x O 3 compositions either bulk-like or via digital alloy formation. Advantageous valence band tuning using bi-axial or uniaxial strain is also possible as described above.
  • An example process flow 1000 is shown in FIG.29 describing the possible selection criteria for selecting at least one of the crystal modification methods to form the bandgap regions of the UVLED.
  • the configuration of the band structure is selected including, but not limited to, band structure characteristics such as whether the band gap is direct or indirect, band gap energy, E fermi , carrier mobility, and doping and polarization.
  • a binary oxide is not suitable, then it is determined whether a ternary oxide may be suitable at step 1025 and further whether the band structure of the ternary oxide may be modified at step 1030 to meet requirements. If the ternary oxide meets requirements then this material is selected for the relevant layer at step 1045. [0666] If a ternary oxide is not suitable, then it is determined whether a digital alloy may be suitable at step 1035 and further whether the band structure of the digital alloy may be modified at step 1040 to meet requirements. If the digital alloy meets requirements then this material is selected for the relevant layer at step 1045. Following determination of the layers by this method, then the optoelectronic device stack is fabricated at step 1048.
  • FIG.30 An embodiment of an energy band lineup for Al 2 O 3 and Ga 2 O 3 with respect to the ternary alloy Al x Ga 1-x O 3 is shown in diagram 1050 of FIG.30 and varies in conduction and valence band offsets for corundum and monoclinic crystal symmetry.
  • the y-axis is electron energy 1051 and the x-axis is different material types 1053 (Al 2 O 3 1054, (Ga 1 Al 1 )O 3 1055 and Ga 2 O 3 1056).
  • Corundum and monoclinic heterojunctions both appear to have type-I and type-II offsets whereas FIG.30 simply plots the band alignment using existing values for the electron affinity of each material.
  • a detailed picture of the valence band in FIG.32B shows a complex dispersion for the two uppermost valence bands.
  • the topmost valence band determines the optical emission character if electrons and holes are indeed capable of being injected simultaneously into the Al 2 O 3 band structure.
  • (b) Monoclinic Symmetry Al 2 O 3 [0675]
  • the crystal structure 1070 of monoclinic Al 2 O 3 is shown in FIG.33.
  • the larger spheres represent Al-atoms 1064 and the smaller spheres are oxygen 1063.
  • the unit cell 1072 has crystal axes 1071.
  • This crystal structure has a computed band structure 1075 as shown in FIGS.34A-34B, where FIG.34B is a detailed picture of the valence band.
  • FIG.34A also shows conduction band 1076.
  • the monoclinic crystal structure 1070 is relatively more complex than the trigonal crystal symmetry and has lower density and smaller bandgap than the corundum Sapphire 1060 form illustrated in FIG.31.
  • the monoclinic Al 2 O 3 form also has a direct bandgap with clear split-off highest valence band 1077 which has lower curvature with respect to the E-k dispersion along the G-X and G-N wave vectors.
  • the monoclinic bandgap is ⁇ 1.4eV smaller than the corundum form.
  • the second highest valence band 1078 is symmetry split from the upper most valence band.
  • Single Crystal Gallium-Oxide [0679] (a) Corundum Symmetry Ga 2 O 3 [0680]
  • the crystal structure of trigonal Ga 2 O 3 (corundum) 1080 is shown in FIG.35.
  • the larger spheres represent Ga-atoms 1084 and the smaller spheres are oxygen 1083.
  • the unit cell 1082 has crystal axes 1081.
  • the corundum (trigonal crystal symmetry type) is also known as the alpha-phase.
  • the crystal structure is identical to Sapphire 1060 of FIG.31 with lattice constants defining the unit cell 1082 shown in Table II of FIG.43B.
  • the Ga 2 O 3 unit cell 1082 is larger than Al 2 O 3 .
  • the corundum crystal has octahedrally bonded Ga-atoms.
  • Conduction band 1086 is also shown in FIG. 36A.
  • Biaxial and uniaxial strain when applied to corundum Ga 2 O 3 using the methods described above may then be used to modify the band structure and valence band into a direct bandgap. Indeed it is possible to use tensile strain applied along the b- and/or c-axes crystal to shift the valence band maximum to the zone center. It is estimated that ⁇ 5% tensile strain can be accommodated within a thin Ga 2 O 3 layer comprising an Al 2 O 3 /Ga 2 O 3 SL.
  • (b) Monoclinic Symmetry Ga 2 O 3 [0684] The crystal structure of monoclinic Ga 2 O 3 (corundum) 1090 is shown in FIG.37.
  • the larger spheres represent Ga-atoms 1084 and the smaller spheres are oxygen 1083.
  • the unit cell 1092 has crystal axes 1091.
  • This crystal structure has a computed band structure 1095 as shown in FIGS.38A-38B.
  • Conduction band 1096 is also shown in FIG.38A.
  • Monoclinic Ga 2 O 3 has an uppermost valence 1097 with a relatively flat E-k dispersion. Close inspection reveals a few eV (less than the thermal energy kBT ⁇ 25 meV) variation in the actual maximum position of the valence band.
  • the Ga atoms 1084 and Al atoms 1064 are disposed within the crystal as shown with oxygen atoms 1083.
  • oxygen atoms 1083 Of particular interest is the layered structure of Al and Ga atom planes. This type of structure can also be built using atomic layer techniques to form an ordered alloy as described throughout this disclosure.
  • the calculated band structure of 1105 is shown in FIG.40.
  • the conduction band minimum 1106 and valence band maximum 1107 exhibits a direct bandgap.
  • Ordered Ternary AlGaO 3 Alloy [0691] Using atomic layer epitaxy methods further enables new types of crystal symmetry structures to be formed.
  • some embodiments include ultrathin epilayers comprising alternate sequences along a growth direction of the form of [Al-O-Ga-O-Al-....].
  • Structure 1110 of FIG.42 shows one possible extreme case of creating ordered ternary alloys using alternate sequences 1115 and 1120. It has been demonstrated in relation to the present disclosure that growth conditions can be created where self-ordering of Al and Ga can occur. This condition can occur even under coincident Al and Ga fluxes simultaneously applied to the growing surface resulting in a self-assembled ordered alloy. Alternatively, a predetermined modulation of the Al and Ga fluxes arriving at the epilayer surface can also create an ordered alloys structure.
  • Substrate Selection for AlGaO-based UVLEDs The selection of a native metal oxide substrate is one advantage of the present disclosure applied to the epitaxy of the (Al x Ga 1-x ) 2 O 3 material systems using strained layer epitaxy on Al 2 O 3 or Ga 2 O 3 substrates.
  • Example substrates are listed in Table I in FIG.43A.
  • intermediate AlGaO 3 bulk substrates may also be utilized and are advantageous for application to UVLEDs.
  • a beneficial utility for monoclinic Ga 2 O 3 bulk substrates is the ability to form monoclinic (Al x Ga 1-x ) 2 O 3 structures having high Ga% (e.g., approximately 30-40%), limited by strain accumulation.
  • M-O metal oxide
  • the cation specie crystal modifiers into M-O defined above may be selected from at least one of the following: [0702] Germanium (Ge) [0703] Ge is beneficially supplied as pure elemental species to incorporate via co- deposition of M-O species during non-equilibrium crystal formation process.
  • elemental pure ballistic beams of atomic Ga and Ge are co-deposited along with an active Oxygen beam impinging upon the growth surface.
  • the lattice deformation by introducing Ge increases the monoclinic unit cell preferentially along the b-axis and c-axis while retaining the a-axis lattice constant in comparison to strain-free monoclinic Ga 2 O 3 .
  • GexGa 2 (1- x) O 3-x is epitaxially deposited upon a bulk-like monoclinic Ga 2 O 3 surface oriented along the b- and c-axis (that is, deposited along the a-axis), then a thin film of Ge x Ga 2(1-x) O 3-x can be elastically deformed to induce biaxial compression, and therefore warp the valence band E-k dispersion advantageously, as discussed herein.
  • x>1/3 the higher Ge% transforms the crystal structure to cubic, for example, GeGa 2 O 5 .
  • incorporation of Ge into Al 2 O 3 and (Al x Ga 1-x ) 2 O 3 are also possible.
  • a direct bandgap Ge x Al 2(1-x) O 3-x ternary can also be epitaxially formed by co-deposition of elemental Al and Ge and active Oxygen so as to form a thin film of monoclinic crystal symmetry.
  • the monoclinic structure is stabilized for Ge% x ⁇ 0.6 creating a free-standing lattice that has a large relative expansion along the a-axis and along the c-axis, while moderate decrease along the b- axis when compared to monoclinic Al 2 O 3 .
  • elemental pure ballistic beams of atomic Ga and Si are co-deposited along with an active Oxygen beam impinging upon the growth surface.
  • the lattice deformation by introducing Si increases the monoclinic unit cell preferentially along the b-axis and c-axis while retaining the a-axis lattice constant in comparison to strain-free monoclinic Ga 2 O 3 .
  • incorporation of Mg into (Al x Ga 1-x ) 2 O 3 up to and including the formation of a quaternary Mg x (Al,Ga) y O z may also be utilized.
  • Particular useful compositions of Mg x Ga 2(1-x) O 3- 2x , wherein x ⁇ 0.1, enable the electronic structure of the Ga 2 O 3 and (Al x Ga 1-x ) 2 O 3 host to be made p-type conductivity type by substituting Ga 3+ cation sites by Mg 2+ cations.
  • the MgxGa 2 ( 1-x )O 3 -2x and MgxAl 2 ( 1-x )O 3 -2x compositions are epitaxially compatible with cubic MgO and monoclinic, corundum and hexagonal crystal symmetry forms of Ga 2 O 3 .
  • the cubic Mg x Ga 2(1-x) O 3-2x form can orient as a thin film having (100)- and (111)-oriented films on monoclinic Ga 2 O 3 (100) and Ga 2 O 3 (001) substrates.
  • MgxGa2( 1-x )O 3 -2x thin epitaxial films can be deposited upon MgO substrates.
  • Mg x Ga 2(1-x) O 3-2x 0 ⁇ x ⁇ 1 films can be deposited directly onto MgAl 2 O 4 (100) spinel crystal symmetry substrates.
  • both Mg x Al 2(1-x) O 3-2x and Mg x Ga 2(1-x) O 3-2x high quality (i.e., low defect density) epitaxial films can be deposited directly onto Lithium Fluoride (LiF) substrates.
  • Zinc (Zn) [0728] Some embodiments include incorporation of Zn elemental species into Ga 2 O 3 and Al 2 O 3 host crystals, where Zn is another preferred group-II metal specie. Furthermore, incorporation of Zn into (Al x Ga 1-x ) 2 O 3 up to and including the formation of a quaternary Zn x (Al,Ga) y O z may also be utilized.
  • compositions advantageous for tuning the direct bandgap structure are the compounds of the most general form: (MgxZn 1-x )z(AlyGa1-y) 2 (1-z)O 3 -2z , where 0 ⁇ x, y, z ⁇ 1.
  • the cubic crystal symmetry composition forms of z ⁇ 0.5 can be used advantageously for a given fixed y composition between Al and Ga.
  • the direct bandgap can be tuned from about 4eV ⁇ E G (x) ⁇ 7eV.
  • an excess of atomic oxygen is desired with respect to the total impinging metal flux. Control of the Al:Ga flux ratio and Mg:Zn ratio arriving at the growth surface can then be used to preselect the composition desired for bandgap tuning the UVLED regions.
  • Zinc-Oxide is generally a wurtzite hexagonal crystal symmetry structure
  • cubic and spinel crystal symmetry forms are readily possible using non-equilibrium growth methods described herein.
  • the bandgap character at the Brillouin-zone center can be tuned by alloy composition (x, y, z) ranging from indirect to direct character. This is advantageous for application to substantially non-absorbing electrical injection regions and optical emissive regions, respectively.
  • Ni elemental species into Ga 2 O 3 and Al 2 O 3 host crystals is yet another preferred group-II metal specie.
  • incorporation of Ni into (AlxGa 1-x ) 2 O 3 up to and including the formation of a quaternary Ni x (Al,Ga) y O z may be utilized.
  • compositions advantageous for tuning the direct bandgap structure are the compounds of the most general form: (Mg x Ni 1-x ) z (Al y Ga 1-y ) 2(1-z) O 3-2z , where 0 ⁇ x, y, z ⁇ 1.
  • the cubic crystal symmetry composition forms of z ⁇ 0.5 can be used advantageously for a given fixed y composition between Al and Ga.
  • the direct bandgap can be tuned from about 4.9eV ⁇ E G (x) ⁇ 7eV.
  • the general cubic crystal symmetry form (Mg x Ni 1-x ) z (Al y Ga 1-y ) 2(1-z) O 3-2z are possible using non-equilibrium growth methods described herein.
  • Both Ni z Ga 2(1-z) O 3-2z and Ni z Al 2(1-z) O 3-2z are advantageous for application to UVLED formation.
  • Dilute composition of z ⁇ 0.1 was found in accordance with the present disclosure to be advantageous for p-type conductivity creation, and for z ⁇ 0.5 the ternary cubic crystal symmetry compounds also exhibit direct bandgap at the Brillouin-zone center.
  • Lanthanides [0739] There exists a large selection of the Lanthanide-metal atomic species available which can be incorporated into the binary Ga 2 O 3 , ternary (Al x Ga 1-x ) 2 O 3 and binary Al 2 O 3 .
  • Bismuth (Bi) [0743] Bismuth is a known specie which acts as a surfactant for GaN non-equilibrium epitaxy of thin Gallium-Nitride GaN films. Surfactants lower the surface energy for an epitaxial film formation but in general are not incorporated within the growing film. Incorporation of Bi even in Gallium Arsenide is low. Bismuth is a volatile specie having high vapor pressure at low growth temperatures and would appear to be a poor adatom for incorporation into a growing epitaxial film.
  • Palladium Oxide PdO can be used as an in-situ deposited semi-metallic ohmic contact for n-type wide bandgap metal oxide owing to the intrinsically low work function of the compound (refer to FIG.9).
  • Iridium (Ir) [0750] Iridium is a preferred Platinum-group metal for incorporation into Ga 2 O 3 , (Ga, Al)O 3 and Al 2 O 3. It was found in accordance with the present disclosure that Ir may bond in a large variety of valence states. In general, the rutile crystal symmetry form of IrO 2 composition is known and exhibits a semi-metallic character.
  • the triply charged Ir 3+ valence state is possible using non-equilibrium growth methods and is a preferred state for application to incorporation with Ga 2 O 3 and in particular corundum crystal symmetry.
  • Iridium has one of the highest melting points and lowest vapor pressures when heated.
  • the present disclosure utilizes electron-beam evaporation to form an elemental pure beam of Ir specie impinging upon a growth surface. If activated oxygen is supplied in coincidence and a corundum Ga 2 O 3 surface presented for epitaxy, corundum crystal symmetry form of Ir 2 O 3 composition can be realized.
  • the present disclosure in contradistinction, seeks to rigidly incorporate Li- atoms within a host crystal matrix comprising at least one of Ga 2 O 3 , (Ga, Al)O 3 and Al 2 O 3 .
  • dilute Li concentrations can be incorporated onto substitutional metal sites of Ga 2 O 3 , (Ga, Al)O 3 and Al 2 O 3 .
  • orthorhombic and trigonal quaternary compositions such as Li(Al x Ga 1-x )O 2 may also be utiliized thereby enabling UVLED operation for the optical emissive region.
  • Li impurity incorporation within even cubic NiO can enable improved p-type conduction and can serve as a possible electrical injector region for holes applied to the UVLED.
  • Yet a further composition in some embodiments is ternary comprising Lithium- Nickel-Oxide Li x Ni y O z . Theoretical calculations provide insight toward the possible higher valence states of Ni 2+ and Li 2+ .
  • selected anion crystal modifiers to the disclosed metal oxide compositions may be selected from at least one of a nitrogen (N) and fluorine (F) specie.
  • N nitrogen
  • F fluorine
  • N nitrogen
  • F fluorine
  • an activated Nitrogen atom e.g., neutral atomic nitrogen species in some embodiments.
  • dilute nitrogen incorporation within a Ga 2 O 3 host was surprisingly been found to stabilize monoclinic Ga 2 O 3 compositions during epitaxy. Prolonged exposure of Ga 2 O 3 during growth to a combination of elemental Ga and neutral atomic fluxes of simultaneous oxygen and nitrogen was found to form competing GaN-like precipitates. [0761] It was also found in accordance with the present disclosure that periodically modulating the Ga 2 O 3 growth by interrupting the Ga and O fluxes periodically and preferentially exposing the terminated surface exclusively with activated atomic neutral nitrogen enables a portion of the surface to incorporate N on otherwise available O-sites within the Ga 2 O 3 growth.
  • the present disclosure uniquely utilizes the sublimation of Lithium-Fluoride LiF bulk crystal within a Knudsen cell to provide a compositional constituent of both Li and F which is co-deposited during elemental Ga and Al beams under an activated oxygen environment supplying the growth surface.
  • Such a technique enables the incorporation of Li and F atoms within an epitaxially formed Ga 2 O 3 or LiGaO 2 host.
  • Examples of crystal symmetry structures formed using example compositions are now described and referred to in FIGS.44A-44Z. The compositions shown are not intended to be limiting as discussed in the previous section using the crystal modifiers.
  • FIG.44A An example of crystal symmetry groups 5000 that are possible for the ternary composition of (Al x Ga 1-x ) 2 O 3 is shown in FIG.44A.
  • the calculated equilibrium crystal formation probability 5005 is a measure of the probability the structure will form for a given crystal symmetry type.
  • the space group nomenclature 5010 used in FIG.44A is understood by those skilled in the art.
  • the non-equilibrium growth methods described herein can potentially select crystal symmetry types that are otherwise not accessible using equilibrium growth methods (such as CZ).
  • the general crystal classes of cubic 5015, tetragonal, trigonal (rhombohedral/hexagonal) 5020, monoclinic 5025, and triclinic 5030 are shown in the inset of FIG.44A.
  • monoclinic, trigonal and orthorhombic crystal symmetry types can be made energetically favorable by providing the kinematic growth conditions favoring exclusively a particular space group to be epitaxially formed.
  • the surface energy of a substrate can be selected by judicious preselection of the surface orientation presented for epitaxy.
  • FIG.44B shows an example high-resolution x-ray Bragg diffraction (HRXRD) curves of a high quality, coherently strained, elastically deformed unit cell (i.e., the epilayer is termed pseudomorphic with respect to the underlying substrate) strained ternary (Al x Ga 1-x ) 2 O 3 epilayer 5080 formed on a monoclinic Ga 2 O 3 (010)-oriented surface 5045.
  • the graph shows intensity 5035 as a function of ⁇ -2 ⁇ 5040.
  • the substrate is initially prepared by high temperature (>800 oC) desorption in an ultrahigh vacuum chamber (less than 5 ⁇ 10 -10 Torr) of surface impurities.
  • the surface is monitored in real-time by reflection high energy electron diffraction (RHEED) to assess atomic surface quality. Once a bright and streaky RHEED pattern indicative of an atomically flat surface of predetermined surface reconstruction of the discontinuous surface atom dangling bond is apparent, the activated Oxygen source comprising a radiofrequency inductively coupled plasma (RF-ICP) is ignited to produce a stream of substantially neutral atomic-Oxygen (O*) species and excited molecular neutral oxygen (O 2 *) directed toward the heated surface of the substrate.
  • RF-ICP radiofrequency inductively coupled plasma
  • the RHEED is monitored to show an oxygen-terminated surface.
  • the source of elemental and pure Ga and Al atoms are provided by effusion cells comprising inert ceramic crucibles radiatively heated by a filament and controlled by feedback sensing of a thermocouple advantageously positioned relative to the crucible to monitor the metal melt temperature within the crucible.
  • High purity elemental metals are used, such as 6N to 7N or higher purity.
  • Each source beam flux is measured by a dedicated nude ion gauge that can be spatially positioned in the vicinity of the center of the substrate to sample the beam flux at the substrate surface. The beam flux is measured for each elemental specie so the relative flux ratio can be predetermined.
  • a mechanical shutter is positioned between the substrate and the beam flux measurement. Mechanical shutters also intersect the atomic beams emanating from each crucible containing each elemental specie selected to comprise epitaxial film.
  • the substrate is rotated so as to accumulate a uniform amount of atomic beam intersecting the substrate surface for a given amount of deposition time.
  • the substrate is heated radiatively from behind by an electrically heated filament, in preference for oxide growth is the advantageous use of a Silicon-Carbide (SiC) heater.
  • SiC heater has the unique advantage over refractory metal filament heaters in that a broad near-to-mid infrared emissivity is possible.
  • the deposition chamber is preferentially actively and continuously pumped to achieve and maintain vacuum in vicinity of 1e-6 to 1e-5 Torr during growth of epitaxial films. Operating in this vacuum range, the evaporating metals particles from the surface of each effusion crucible acquire a velocity that is essentially non-interacting and ballistic.
  • the atomic beam flux from effusion type heated sources is determined by the Arrhenius behavior of the particular elemental specie placed in the crucible.
  • Al and Ga fluxes in the range of 1 ⁇ 10 -6 Torr are measured at the substrate surface.
  • the oxygen plasma is controlled by the RF power coupled to the plasma and the flow rate of the feedstock gas.
  • RF plasma discharges typically operate from 10 milliTorr to 1 Torr. These RF plasma pressures are not compatible with atomic layer deposition process reported herein.
  • a sealed fused quartz bulb with laser drilled apertures of the order of 100 microns in diameter are disposed across a circular end-face of the sealed cylindrical bulb.
  • the said bulb is coupled to a helical wound copper tube and water-cooled RF antenna driven by an impedance matching network and a high power 100 W-1 kW RF oscillator operating at, for example, 2 MHz to 13.6 MHz or even 20 MHz.
  • the plasma is monitored using optical emission from the plasma discharge which provides accurate telemetry of actual species generated within the bulb.
  • the size and number of the apertures on the bulb end face are the interface of the plasma to the UHV chamber and can be predetermined to achieve compatible beam fluxes so as to maintain ballistic transport conditions for long mean free path in excess of the source to substrate distance.
  • Other in-situ diagnostics enabling accurate control and repeatability of film composition and uniformity include the use of ultraviolet polarized optical reflectometry and ellipsometry as well as a residual gas analyzer to monitor the desorption of species from the substrate surface.
  • Other forms of activated oxygen include the use of oxidizers such as Ozone (O 3 ) and nitrous oxide (N 2 O).
  • RF plasma may be used in certain embodiments owing to the simplicity of point of use activation.
  • RF-plasma does potentially create very energetic charged ion species which can affect the material background conductivity type. This is mitigated by removing the apertures directly in the vicinity of the center of the plasma end plate coupled to the UHV chamber.
  • the RF induced oscillating magnetic field at the center of the solenoid of the cylindrical discharge tube will be maximal along the center axis. Therefore, removing the apertures providing line of sight from the plasma interior toward the growth surface removes the charged ions specie ballistically delivered to the epilayer.
  • the monoclinic Ga 2 O 3 (010)-oriented substrate 5045 is cleaned in-situ via high temperature in UHV conditions, such as at ⁇ 800 oC for 30 mins.
  • the cleaned surface is then terminated with activated oxygen adatoms forming a surface reconstruction comprising oxygen atoms.
  • An optional homoepitaxial Ga 2 O 3 buffer layer 5075 is deposited and monitored for crystallographic surface improvement by in-situ RHEED.
  • Ga 2 O 3 growth conditions using elemental Ga and activated oxygen requires a flux ratio of ⁇ (Ga): ⁇ (O*) ⁇ 1, that is atomic oxygen rich conditions.
  • the thickness can be monitored by in-situ ultraviolet laser reflectometry and the pseudomorphic strain state monitored by RHEED.
  • the free-standing in- plane lattice constant of monoclinic crystal symmetry (Al x Ga 1-x ) 2 O 3 is smaller than the underlying Ga 2 O 3 lattice, the (Al x Ga 1-x ) 2 O 3 is grown under tensile strain during elastic deformation.
  • the thickness 5085 of epilayer 5080 at which the elastic energy can be matched or reduced by inclusion of misfit dislocation within the growth plane is called the critical layer thickness (CLT), beyond this point the film can begin to grow as a partially or fully relaxed bulk- like film.
  • CLT critical layer thickness
  • the curves 5050 and 5065 are for the case of coherently strained (Al x Ga 1-x ) 2 O 3 films with thickness below the CLT.
  • the thickness oscillations 5070 are also known as Pendellosung interference fringes and are indicative of highly coherent and atomically flat epitaxial film. [0785] In experiments performed in relation to the present disclosure, growth of pure monoclinic Al 2 O 3 epitaxial films directly on monoclinic Ga 2 O 3 (010) surface achieved CLT ⁇ 1 nm.
  • SLs Superlattices
  • monoclinic (Al x Ga 1-x ) 2 O 3 ternary alloy experiences an asymmetric in-plane biaxial tensile strain when epitaxial deposited upon monoclinic Ga 2 O 3 .
  • This tensile strain can be managed by ensuring the thickness of ternary is kept below the CLT within each layer comprising the SL.
  • the strain can be balanced by tuning the thickness of both Ga 2 O 3 and ternary layer to manage the built-in strain energy of the bilayer pair.
  • Yet a further embodiment of the present disclosure is the creation of a ternary alloy as bulk-like or SL grown sufficiently thick so as to exceed the CLT and form an essentially free-standing material that is strain-free.
  • FIG.44C show an example SL 5115 formed directly on a Ga 2 O 3 (010)-oriented substrate 5100.
  • the HRXRD 5090 shows the symmetric Bragg diffraction
  • the GIXR 5105 shows the grazing incidence reflectivity of the SL.
  • Ten periods are shown with extremely high crystal quality indicative of the (Al x Ga 1-x ) 2 O 3 having thickness ⁇ CLT.
  • the plurality of narrow SL diffraction peaks 5095 and 5110 is indicative of coherently strained films registered with in-plane lattice constant matching the monoclinic Ga 2 O 3 (010)-oriented bulk substrate 5100.
  • the monoclinic crystal structure (refer to FIG.37) having growth surface exposed of (010) exhibits a complex array of Ga and O atoms.
  • the starting substrate surface is prepared by O-terminations as described previously.
  • the average Al% alloy content of the SL represents a pseudo-bulk-like ternary alloy which can be thought of as an order atomic plane ternary alloy.
  • the SL comprising bilayers of [(Al xB Ga 1-xB ) 2 O 3 / Ga 2 O 3 ] has an equivalent Al% defined as: where L B is the thickness of the wider bandgap (Al xB Ga 1-xB ) 2 O 3 layer.
  • FIG.44D shows yet further flexibility toward depositing ternary monoclinic 5130 alloy (Al x Ga 1-x ) 2 O 3 directly upon yet another crystal orientation of monoclinic Ga 2 O 3 (001) substrate 5120.
  • the growth recipe in some embodiments utilizes in-situ activated oxygen polish at high temperatures (e.g., 700-800 oC) using a radiatively heated substrate via a high power and oxygen resistant radiatively coupled heater.
  • the SiC heater possesses the unique property of having high near-to-far infrared emissivity
  • the SiC heater emissivity closely matches the intrinsic Ga 2 O 3 absorption features and thus couples well to the radiative blackbody emission spectrum presented by the SiC heater.
  • Region 5125 represents the O-termination process and the homoepitaxial growth of a high quality Ga 2 O 3 buffer layer.
  • the SL is then deposited showing two separate growths with different ternary alloy compositions.
  • Shown in FIG.44D are coherently strained epilayers of (Al x Ga 1-x ) 2 O 3 having thickness ⁇ CLT and achieving x ⁇ 15% (5135) and x ⁇ 30% (5140), relative to the (002) substrate peak 5122. Again, the high quality films are indicated by the presence of thickness interference fringes.
  • HRXRD 5145 and GIXR 5158 demonstrate a high quality coherently deposited SL. Peak 5156 is the substrate peak.
  • FIG.44F Two dissimilar crystal symmetry type structures are epitaxially formed along a growth direction as defined by FIG.18.
  • a substrate 5170 (peak 5172) comprising monoclinic Ga 2 O 3 (001)-oriented surface is presented for homoepitaxy of a monoclinic Ga 2 O 3 5175.
  • a cubic crystal symmetry NiO epilayer 5180 is deposited.
  • the HRXRD 5165 and GIXR 5190 show the topmost NiO film peak 5185 of thickness 50 nm has excellent atomic flatness and thickness fringes 5195.
  • mixing-and-matching crystal symmetry types can be favorable to a given material composition that is advantageous for a given function comprising the UVLED (refer FIG.1) thereby increasing the flexibility for optimizing the UVLED design.
  • Ni x O (0.5 ⁇ x ⁇ 1 representing metal vacancy structures are possible)
  • Li x Ni y O n , Mg x Ni 1-x O and Li x Mg y Ni z O n are compositions that may be utilized favorably for integration with AlGaO 3 materials comprising the UVLED.
  • NiO and MgO share very close cubic crystal symmetry and lattice constants, they are advantageous for bandgap tuning application from about 3.8 to 7.8 eV.
  • the d-states of Ni influence the optical and conductivity type of the MgNiO alloy and can be tailored for application to UVLED type devices.
  • FIG.44G A cubic crystal symmetry MgO (100)-oriented surface of a substrate 5205 (corresponding to peak 5206) is presented for direct epitaxy of Ga 2 O 3 .
  • the surface of MgO can be selectively modified to create a cubic crystal symmetry form of Ga 2 O 3 epilayer 5210 (peaks 5212 for gamma Ga 2 O 3 ) that acts as an intermediate transition layer for subsequent epitaxy of monoclinic Ga 2 O 3 (100) 5215 (peaks 5214 and 5217).
  • a cubic crystal symmetry form of Ga 2 O 3 epilayer 5210 peaks 5212 for gamma Ga 2 O 3
  • Such a structure is represented by the growth process shown in FIG.20A.
  • First a prepared clean MgO (100) surface is presented for MgO homoepitaxy.
  • the magnesium source is a valved effusion source comprising 7N purity Mg with a beam flux of ⁇ 1 ⁇ 10 -10 Torr in the presence of active-oxygen supplied with ⁇ (Mg): ⁇ (O*) ⁇ 1 and substrate surface growth temperature from 500-650 oC.
  • the RHEED is monitored to show improved and high quality surface reconstruction of MgO surface of the epitaxial film. After about 10-50 nm of MgO homoepitaxy the Mg source is closed and the substrate elevated to a growth temperature of about 700 oC while under a protective flux of O*. Then the Ga source is exposed to the growth surface and the RHEED is observed to instantaneous change surface reconstruction toward a cubic crystal symmetry Ga 2 O 3 epilayer 5210.
  • FIG.44H Yet another example of a complex ternary metal oxide structure applied for UVLED is disclosed in FIG.44H.
  • the HRXRD 5225 and GIXR 5245 show experimental realization of a superlattice comprising a lanthanide-aluminum-oxide ternary integrated with corundum Al 2 O 3 epilayers.
  • the SL comprises corundum crystal symmetry (Al x Er 1-x ) 2 O 3 ternary composition with the lanthanide selected from Erbium grown pseudomorphically with corundum Al 2 O 3 . Erbium is presented to the non-equilibrium growth via a sublimating 5N purity Erbium source using an effusion cell.
  • FIG.44I discloses the E-K band structure 5250 of corundum (Al x Er 1-x ) 2 O 3 is indeed a direct bandgap material having E G ⁇ 6eV.
  • the electron energy 1066 is plotted as a function of the crystal wave vectors 1067.
  • FIG.44J Next in FIG.44J is demonstrated yet a further ternary magnesium-gallium-oxide cubic crystal symmetry Mg x Ga 2(1-x) O 3-2x material composition integrable with Ga 2 O 3 .
  • the diffraction satellite peaks 5280 and 5295 report slight diffusion of Mg across the SL interfaces which can be alleviated by growing at a lower temperature.
  • the ability for the monoclinic Ga 2 O 3 crystal symmetry to integrate with cubic MgAl 2 O 4 crystal symmetry substrates is presented in FIG.44L.
  • a high quality single crystal substrate 5320 comprising MgAl 2 O 4 spinel is cleaved and polished to expose the (100)-oriented crystal surface.
  • the substrate is prepared and polished using active oxygen at elevated temperature ( ⁇ 700 oC) under UHV conditions ( ⁇ 1e-9 Torr). Keeping the substrate at growth temperature of 700 oC the MgGa 2 O 4 film 5330 is initiated showing excellent registration to the substrate. After about 10-20 nm the Mg is shuttered and only Ga 2 O 3 is deposited as the topmost film 5325.
  • the GIXR film flatness is excellent showing thickness fringes 5340 indicating a >150 nm film.
  • the HRXRD shows transition material MgGa 2 O 4 corresponding to peaks 5332 and Ga 2 O 3 (100)-oriented epilayer of peaks 5327 indicative of monoclinic crystal symmetry.
  • hexagonal Ga 2 O 3 can also be deposited epitaxially.
  • the monoclinic Ga 2 O 3 (-201)-oriented crystal plane features unique attributes of a hexagonal oxygen surface matrix with in-plane lattice spacing acceptable for registering wurtzite-type hexagonal crystal symmetry materials.
  • wurtzite ZnO 5360 (peak 5367) is deposited on an oxygen terminated Ga 2 O 3 (-201)- oriented surface of a substrate Zn x Ga 2(1-x) O 3-2x 5350 (peak 5352).
  • the Zn is supplied by sublimation of 7N purity Zn contained within an effusion cell.
  • the growth temperature is selected from 450-650 oC for ZnO and exhibits extremely bright and sharp narrow RHEED streaks indicative high crystal quality.
  • Peak 5362 represents (Al x Ga 1-x ) 2 O 3 .
  • Peak 5355 represents a transition layer.
  • a ternary zinc-gallium-oxide epilayer Zn x Ga 2(1-x) O 3-2x 5365 is deposited by co-deposition of Ga and Zn and active oxygen at 500 oC.
  • the flux ratio of [ ⁇ (Zn)+ ⁇ (Ga)]: ⁇ (O*) ⁇ 1 and the metal beam flux ratio ⁇ (Zn): ⁇ (Ga) is chosen to achieve x ⁇ 0.5.
  • Zn desorbs at much lower surface temperatures than Ga and is controlled in part by absorption limited process depending on surface temperature dictated by the Arrhenius behavior of Zn adatoms.
  • Zn is a group metal and substitutes advantageously on available Ga-sites of the host crystal.
  • Zn can be used to alter the conductivity type of the host for dilute x ⁇ 0.1 concentrations of incorporated Zn.
  • the peak 5365 labelled Zn x Ga 2(1-x) O 3-2x shows the transition layer formed on the substrate showing low Ga% formation of Zn x Ga 2(1-x) O 3-2x . This suggests strongly a high miscibility of Ga and Zn in the ternary offering non-equilibrium growth of full range of alloys 0 ⁇ x ⁇ 1.
  • the indirect bandgap shown by band extrema 5375 and 5380 can be shaped using SL band engineering as shown in FIG.27.
  • the valence band dispersion 5385 showing maxima at k ⁇ 0 can be used to create a SL period that can advantageously map the maxima back to an equivalent energy at zone center thereby creating a pseudo-direct bandgap structure.
  • Such a method is claimed in its entirety for application to the formation of optoelectronic devices such as UVLEDs as referred to in the present disclosure.
  • FIG.44O shows a specific application of the more general method disclosed in FIG.19.
  • a prepared and clean surface of corundum crystal symmetry type of sapphire C- plane substrate 5400 is presented for epitaxy.
  • the substrate surface is polished via active oxygen at elevated temperature >750 oC and such as ⁇ 800-850 oC. This creates an oxygen terminated surface 5405.
  • a Ga and active oxygen flux is directed toward the epi-surface and the surface reconstruction of bare Al 2 O 3 is modified to either a corundum Ga 2 O 3 thin template layer 5396 or a low Al% corundum (Al x Ga 1-x ) 2 O 3 x ⁇ 0.5 is formed by an additional co-deposited Al flux. After about 10 nm of the template layer 5396 the Al flux is closed and Ga 2 O 3 is deposited. Maintaining a high growth temperature and a low Al% template 0 ⁇ x ⁇ 0.1 favors exclusive film formation of monoclinic crystal structure epilayer 5397.
  • the Ga 2 O 3 favors exclusively the growth of a new type of crystal symmetry structure having hexagonal symmetry.
  • the hexagonal phase of Ga 2 O 3 is also favored by x>0.1 template layer.
  • the unique properties of the hexagonal crystal symmetry Ga 2 O 3 5420 composition is discussed later.
  • the experimental evidence for the disclosed process of growing the epitaxial structure 5395 is provided in FIG.44P, showing the HRXRD 5421 for two distinct growth process outcomes of phase pure monoclinic Ga 2 O 3 and hexagonal crystal symmetry Ga 2 O 3 .
  • the HRXRD scan shows the C-plane Al 2 O 3 (0001)-oriented substrate Bragg diffraction peaks of corundum Al 2 O 3 (0006) 5465 and Al 2 O 3 (0012) 5470.
  • the diffraction peaks indicated by 5445, 5450, 5455, and 5460 represent sharp single crystal monoclinic Ga 2 O 3 (-201), Ga 2 O 3 (-204), Ga 2 O 3 (-306) and Ga 2 O 3 (-408).
  • the orthorhombic crystal symmetry can further exhibit an advantageous property of possessing a non-inversion symmetry. This is particularly advantageous for allowing electric dipole transition between the conduction and valence band edges of the band structure at zone- center.
  • wurtzite ZnO and GaN both exhibit crystal symmetry having non- inversion symmetry.
  • orthorhombic namely the space group 33 Pna21 crystal symmetry
  • the peaks 5425, 5430, 5435 and 5440 represent sharp single crystal hexagonal crystal symmetry Ga 2 O 3 (002), Ga 2 O 3 (004), Ga 2 O 3 (006), and Ga 2 O 3 (008).
  • the importance of achieving hexagonal crystal symmetry Ga 2 O 3 and also hexagonal (Al x Ga 1-x ) 2 O 3 is shown in FIG.44Q.
  • the energy band structure 5475 shows the conduction band 5480 and valence band 5490 extrema are both located at the Brillouin-zone center 5485 and is therefore advantageous for application to UVLED.
  • Single crystal sapphire is one of the most mature crystalline oxide substrates.
  • Yet another form of Sapphire is the corundum M-plane surface which can be used advantageously to form Ga 2 O 3 and AlGaO 3 and other metal oxides discussed herein.
  • the surface energy of Sapphire exhibited by specific crystal planes presented for epitaxy can be used to preselect the type of crystal symmetry of Ga 2 O 3 that is epitaxially formed thereon.
  • FIG.44R disclosing the utility of an M-plane corundum Al 2 O 3 substrate 5500.
  • the M-plane is the (1-100) oriented surface and can be prepared as discussed previously and atomically polished in-situ at elevated growth temperature of 800 oC while exposed to an activated oxygen flux.
  • the oxygen terminated surface is then cooled to 500-700 oC, such as 500 oC in one embodiment, and a Ga 2 O 3 film is epitaxially deposited.
  • embodiments include developing functional electronic Ga 2 O 3 films directly on Silicon. To this end a process has been developed specifically for this application.
  • FIG.44S there are shown the results of one experimentally developed process for depositing monoclinic Ga 2 O 3 films on large area Silicon substrates.
  • a single crystal high quality monoclinic Ga 2 O 3 epilayer 5565 is formed on a cubic transition layer 5570 comprising ternary (Ga 1-x Er x ) 2 O 3 .
  • the transition layer is deposited using a compositional grading which can be abrupt or continuous.
  • the transition layer can also be a digital layer comprising a SL of layers of [(Ga 1-x Er x ) 2 O 3 /(Ga 1-y Er y ) 2 O 3 ] wherein x and y are selected from 0 ⁇ x, y ⁇ 1.
  • the transition layer is deposited optionally on a binary bixbyite crystal symmetry Er 2 O 3 (111)-oriented template layer 5560 deposited on a Si(111)-oriented substrate 5555. Initially the Si(111) is heated in UHV to 900 oC or more but less than 1300 oC to desorb the native SiO 2 oxide and remove impurities.
  • a clear temperature dependent surface reconstruction change is observed and can be used to in-situ calibrate the surface growth temperature which occurs at 830 oC and is only observable for a pristine Si surface devoid of surface SiO 2 . Then the temperature of the Si substrate is reduced to 500-700 oC to deposit the (Ga 1-y Er y ) 2 O 3 film(s) and then increased slightly to favor epitaxial growth of monoclinic Ga 2 O 3 (-201)-oriented active layer film. If Er2O 3 binary is used, then activated oxygen is not necessary and pure molecular oxygen can be used to co- deposit with pure Er beam flux. As soon as Ga is introduced the activated oxygen flux is necessary.
  • the HRXRD 5550 shows the cubic (Ga 1-y Er y ) 2 O 3 peak 5572 along with the bixbyite Er 2 O 3 (111) and (222) peaks 5562.
  • the monoclinic Ga 2 O 3 (-201), (-201), (-402) peaks are also observed as peaks 5567, and the Si(111) substrate as peaks 5557.
  • One application of the present disclosure is the use of cubic crystal symmetry metal oxides for the use of transition layers between Si(001)-oriented substrate surfaces to form Ga 2 O 3 (001) and (Al,Ga) 2 O 3 (001)-oriented active layer films. This is particularly advantageous for high volume manufacture.
  • FIG.44T discloses high quality single crystal epitaxy of corundum Ga 2 O 3 (110)- oriented film on Al 2 O 3 (11-20)-oriented substrate (i.e., A-plane Sapphire).
  • the surface energy of the A-plane Al 2 O 3 surface can be used to grow exceptionally high quality corundum Ga 2 O 3 and ternary films of corundum (Al x Ga 1-x ) 2 O 3 where 0 ⁇ x ⁇ 1 for the entire alloy range.
  • Ga 2 O 3 can be growth up to a CLT of about 45-80 nm and the CLT increases dramatically with the introduction of Al to form the ternary (Al x Ga 1-x ) 2 O 3 .
  • Corundum AlGaO 3 can be grown from room temperature up to about 750 oC. All growths, however, require an activated oxygen (viz., atomic oxygen) flux to be well in excess of the total metal flux, that is, oxygen rich growth conditions.
  • Corundum crystal symmetry Ga 2 O 3 films are shown in the HRXRD 5575 and GIXR 5605 scan of two separate growths for different thickness films on A-plane Al 2 O 3 substrates.
  • the substrate 5590 surface (corresponding to peak 5592) is oriented in the (11-20) plane and O-polished at elevated temperature at about 800 oC.
  • the Ga flux can be presented along with the activated oxygen and a high temperature phenomenon can occur. It was found in accordance with the present disclosure that Ga effectively diffuses into the topmost surface of the Al 2 O 3 substrate forming an extremely high quality corundum (Al x Ga 1-x ) 2 O 3 template layer with 0 ⁇ x ⁇ 1.
  • the growth can either be interrupted or continued while the substrate temperature is reduced to about 500 oC.
  • the template layer then acts as an in-plane lattice matching layer that is closer to Ga 2 O 3 and thus a thicker CLT is found for the epitaxial film.
  • FIG.44U shows unique attributes of binary Ga 2 O 3 and binary Al 2 O 3 epilayers used to form a SL structure on an A-plane Al 2 O 3 substrate 5625 (corresponding to peak 5627).
  • Image 5660 in FIG.44V demonstrates the crystal quality observed for an example [Al 2 O 3 /Ga 2 O 3 ] SL 5645 deposited on A-plane sapphire 5625. Clearly evident is the contrast in Ga and Al specie showing the abrupt interfaces between the nanometer scale films 5650 and 5655 comprising the SL period. [0846] Closer inspection of image 5660 shows the region labelled 5635 which is due to the high temperature Ga intermixing process described above. The Al 2 O 3 buffer layer 5640 imparts a small strain to the SL stack. Careful attention is paid to maintaining the Ga 2 O 3 film thickness to well below the CLT to create high quality SL.
  • strain accumulation can result and other structures such as growing the SL structure on a relaxed buffer composition midway between the composition endpoints of the materials comprising the SL is possible in some embodiments.
  • This enables strain symmetrization to be engineered wherein the layer pairs forming the period of the superlattice can have equal and opposite in-plane strain. Each layer is deposited below the CLT and experiences biaxial elastic strain (thereby inhibiting dislocation formation at the interfaces). Therefore some embodiments include engineering a SL disposed on a relaxed buffer layer that enables the SL to accumulate zero strain and thus can be grown effectively strain-free with theoretically infinite thickness.
  • FIG.44W shows the ability to epitaxially deposit thick ternary corundum (Al x Ga 1-x ) 2 O 3 films on R-plane corundum Al 2 O 3 .
  • the HRXRD 5665 shows an R-plane Al 2 O 3 substrate 5675 that is prepared using a high temperature O-polish and co-deposition of Al and Ga while reducing the growth temperature from 750 to 500 °C forming region 5680.
  • Region 5680 is an optional surface layer modification to the sapphire substrate surface, such as an oxygen- terminated surface.
  • the film thickness for this case is about 115 nm.
  • FIG.44X shows an example of a high quality superlattice structure possible for R-plane Al 2 O 3 (1-102) oriented substrates.
  • the HRXRD 5690 and GIXR 5710 are shown for an example SL epitaxially formed on R-plane Al 2 O 3 (1-102) substrate 5705 (corresponding to peak 5707).
  • the SL period ⁇ SL 20 nm.
  • the plurality of SL Bragg diffraction peaks 5695 and reflectivity peaks 5715 indicate coherently grown pseudomorphic structure.
  • Such highly coherent and largely dissimilar bandgap materials used to create epitaxial SL with abrupt discontinuities at the interfaces may be employed for the formation of quantum confined structures as disclosed herein for application to optoelectronic devices such as UVLEDs.
  • the conduction and valence band energy discontinuity available at the Al 2 O 3 / Ga 2 O 3 heterointerface for corundum crystal symmetry (R3c) is: [0856]
  • the band offsets are: [0857]
  • Some embodiments also include creating a potential energy discontinuity by creation of Ga 2 O 3 layers having an abrupt change in crystal symmetry.
  • corundum crystal symmetry Ga 2 O 3 can be directly epitaxially deposited on monoclinic Ga 2 O 3 (110)-oriented surfaces. Such a heterointerface produces band offsets given by: [0859] These band offsets are sufficient to create quantum confined structures as will be described below.
  • FIG.44Y As yet another example of embodiments of complex metal oxide heterostructures, refer to FIG.44Y wherein a cubic MgO epilayer 5730 is formed directly on a spinel MgAl 2 O 4 (100) oriented substrate 5725.
  • the lattice constant of MgO is almost exactly twice the lattice constant of MgAl 2 O 4 and thus creates unique epitaxial coincidence for in-plane lattice registration at the heterointerface.
  • Graph 5740 of FIG.44Z shows the energy band structure for Mg x Al 2(1-x) O 3-2x x ⁇ 0.5 showing a direct bandgap 5745 formed between the conduction band 5750 and valence band 5755 extrema.
  • Some embodiments also include growing directly Ga 2 O 3 on Lanthanum- Aluminum-Oxide LaAlO 3 (001) substrates.
  • the example structures disclosed in FIGS.44A-44Z are for the purpose of demonstrating some of the possible configurations applicable for use in at least a portion of a UVLED structure.
  • the wide variety of compatible mixed symmetry type heterostructures is a further attribute of the present disclosure.
  • FIG.45 shows an example light emitting device structure 1200 in accordance with the present disclosure.
  • Light emitting device 1200 is designed to operate such that optically generated light can be out-coupled vertically through the device.
  • Device 1200 comprises a substrate 1205, a first conductivity n-type doped AlGaO 3 region 1210, followed by a not-intentionally doped (NID) intrinsic AlGaO 3 spacer region 1215, followed by a multiple quantum well (MQW) or superlattice 1240 formed using periodic repetitions of (Al x Ga 1-x )O 3 / (Al y Ga 1-y )O 3 wherein the barrier layer comprises the larger bandgap composition 1220 and the well layer comprises the narrower bandgap composition 1225.
  • the total thickness of the MQW or SL 1240 is selected to achieve the desired emission intensity.
  • the layer thicknesses comprising the unit cell of the MQW or SL 1240 are configured to produce a predetermined operating wavelength based on the quantum confinement effect.
  • an optional AlGaO 3 spacer layer 1230 separates the MQW/SL from the p-type AlGaO 3 layer 1235.
  • the MQW or SL 1240 is tuned by keeping the thickness of both the well and barrier layers the same in each design 1250 (FIGS.46, 47), 1350 (FIG.49), 1390 (FIG. 51) and 1450 (FIG.53).
  • the thickness of the well layer is selected from at least 0.5xa w to 10xa w the unit cell (a w lattice constant) of the host composition. For the present case, one unit cell is chosen.
  • the periodic unit cell thickness can be relatively large as the corundum and monoclinic unit cells are relatively large. However, sub-unit-cell assemblies may be utilized in some embodiments.
  • MQW region 1275 in FIG.47 is configured for intrinsic or non- intentionally doped layer combination comprising Ga 2 O 3 / (Al 0.4 Ga 0.6 ) 2 O 3 .
  • MQW region 1360 in FIG.49 is configured for intrinsic or non-intentionally doped layer combination comprising (Al 0.05 Ga 0.95 ) 2 O 3 / (Al 0.4 Ga 0.6 ) 2 O 3 .
  • MQW region 1400 in FIG.51 is configured for intrinsic or non-intentionally doped layer combination comprising (Al 0.1 Ga 0.9 ) 2 O 3 / (Al 0.4 Ga 0.6 ) 2 O 3 .
  • MQW region 1460 in FIG.53 is configured for intrinsic or non-intentionally doped layer combination comprising (Al 0.2 Ga 0.8 ) 2 O 3 / (Al 0.4 Ga 0.6 ) 2 O 3 .
  • ohmic contact metals 1260 and 1280 are shown.
  • the conduction band edge E C (z) 1265 and the valence band edges E V (z) 1270 and the MQW region 1400 shows the modulation in bandgap energy with respect to the spatially modulated composition. This is yet another particular advantage of atomic layer epitaxy deposition techniques which make such structures possible.
  • FIG.47 shows schematically the confined electron 1285 and hole 1290 wavefunctions within the MQW region 1275.
  • the electric-dipole transition due to spatial recombination of electron 1285 and hole 1290 creates photon 1295.
  • the emission spectrum can be calculated and is shown in FIG.48, plotted in graph 1300 as the emission wavelength 1310 and the oscillator absorption strength 1305 due to the wavefunction overlap integrals for the spatially dependent quantized electron and holes states (also indicative of the emission strength).
  • a plurality of peaks 1320, 1325 and 1330 are generated due to recombination of quantized energy states with the MQW.
  • the lowest energy electron-hole recombination peak 1320 is the most probable and occurs at ⁇ 245 nm.
  • Region 1315 shows that below the energy gap of the MQW there is no absorption or optical emission.
  • the MQW configurations 1275, 1360, 1400 and 1460 result in light emission energy peaks 1320 (FIG.48), 1370 (FIG.50), 1420 (FIG.52) and 1470 (FIG.54) having peak operating wavelengths of 245 nm, 237 nm, 230 nm and 215 nm, respectively.
  • Graph 1365 of FIG.50 also shows peaks 1375 and 1380 along with region 1385.
  • Graph 1410 of FIG.52 also shows peaks 1425 and 1430 along with region 1435.
  • Graph 1465 of FIG.54 also shows peak 1475 along with region 1480.
  • Regions 1385, 1435 and 1480 show that there is no optical absorption or emission for photon energy/wavelengths below the energy gap of the MQW.
  • Yet a further feature of extremely wide bandgap metal oxide semiconductors is the configuration of ohmic contacts to n-type and p-type regions.
  • the example diode structures 1255 comprise high work-function metal 1280 and low work-function metal 1260 (ohmic contact metals). This is because of the relative electron affinity of the metal-oxides with respect to vacuum (refer to FIG.9).
  • FIGS.48, 50, 52 and 54 show the optical absorption spectrum for the MQW regions contained within the diode structures 1255.
  • the MQW comprises two layers of a narrower bandgap material and a wider bandgap material.
  • the thickness of the layers, and in particular the narrow bandgap layer, are selected such that they are small enough to exhibit quantization effects along the growth direction within the conduction and valence potentials wells that are formed.
  • the absorption spectrum represents the creation of an electron and hole in the quantized state of the MQW upon resonant absorption of an incident photon. [0876]
  • the reversible process of photon creation is where the electron and hole are spatially localized in their respective quantum energy levels of the MQW and recombine by virtue of the direct bandgap.
  • FIG.55 shows a plot 1500 of the known pure metal work-function energy 1510 and sorts the metal species (elemental metal contact 1505) from high 1525 to low 1515 work function for application to p-type and n-type ohmic contacts and provides selection criteria for the metal contacts for each of the conductivity type regions required by the UVLED.
  • Line 1520 represents the mid-point work function energy with respect to the high 1525 and low 1515 limits depicted in FIG.55.
  • Ni, Os, Se, Pt, Pd, Ir, Au, W and alloys thereof are used for the p-type regions, and low work-function metals selected from Ba, Na, Cs, Nd and alloys thereof can be used.
  • Other selections are also possible.
  • Al, Ti, Ti- Al alloys, and titanium nitride (TiN) being common metals can also be used as contacts to an n- type epitaxial oxide layer.
  • Intermediary contact materials such as semi-metallic palladium oxide PdO, degenerately doped Si or Ge and rare-earth nitrides can be used.
  • ohmic contacts are formed in-situ to the deposition process for at least a portion of the contact materials to preserve the [metal contact /metal oxide] interface quality.
  • single crystal metal deposition is possible for some metal oxide configurations.
  • X-ray diffraction (XRD) is one of the most powerful tools available to crystal growth analysis to directly ascertain crystallographic quality and crystal symmetry type. FIGS.
  • FIG.56 there is shown a reciprocal lattice map 2-axis x-ray diffraction pattern 1600 for a 201 nm thick epitaxial ternary (Al 0.5 Ga 0.5 ) 2 O 3 on an A-plane Al 2 O 3 substrate.
  • ternary AlGaO 3 binary Al 2 O 3 /Ga 2 O 3 superlattice.
  • Both structures are deposited pseudomorphically on corundum crystal symmetry substrates having an A-plane oriented surface.
  • FIG.56 there is shown a reciprocal lattice map 2-axis x-ray diffraction pattern 1600 for a 201 nm thick epitaxial ternary (Al 0.5 Ga 0.5 ) 2 O 3 on an A-plane Al 2 O 3 substrate.
  • the in-plane and perpendicular mismatch of the ternary film is well matched to the underlying substrate.
  • the in-plane mismatch parallel to the plane of growth is ⁇ 4088 ppm, and the perpendicular lattice mismatch of the film is ⁇ 23440 ppm.
  • the relatively vertical displacement of the ternary layer peak (AlxGa 1-x ) 2 O 3 with respect to the substrate (SUB) shows excellent film growth compatibility and is directly advantageous for UVLED application.
  • an optoelectronic semiconductor device in accordance with the present disclosure may be implemented as an ultraviolet laser device (UVLAS) based upon metal oxide semiconducting materials.
  • UVLAS ultraviolet laser device
  • the metal oxide compositions having bandgap energy commensurate with operation in the UVC (150-280 nm) and far/vacuum UV wavelengths (120-200 nm) have the general distinguishing feature of having intrinsically small optical refractive index far from the fundamental band edge absorption.
  • FIGS.58A-58B show a section of a metal-oxide semiconductor material 1820 having optical length 1850 along a one-dimensional optical axis in accordance with an illustrative embodiment of the present disclosure.
  • An incident light vector 1805 enters the material 1820 from air having refractive index n MOx .
  • the light within the material 1820 is transmitted and reflected (beams 1810) at the refractive index discontinuities at each surface with a transmitted optical beam 1815.
  • the material slab of length 1850 can support a number of optical longitudinal modes 1825 as shown in FIG.58A.
  • the transmission 1815 as a function of the optical wavelength incident upon the slab shows a Fabry-Perot mode structure having modes 1825.
  • For a photon trapped within the optical cavity defined by the one-dimensional slab it is possible in accordance with the present disclosure to determine the roundtrip losses of the slab and the required minimum optical gain required to overcome these losses and enable a net gain.
  • the threshold gain is calculated in FIG.58B showing the transmission factor ⁇ as a function of optical gain within the slab for the forward 1830 and reverse 1835 propagating light beams 1810.
  • n MOx 2.5 of slab length
  • Some embodiments implement semiconductor cavities contained with a vertical- type structure 110 (e.g., see FIG.2A) with sub-micron length scales. This is because of the desire to localize the electron and hole recombination into a narrow region. Confining the physical thickness of the slab, where the carrier recombination occurs and light emission is generated, aids in reducing the threshold current density required to achieve lasing. It is therefore instructive to understand the required threshold gain by reducing the gain slab length.
  • the smaller cavity length 1860 compared to length 1850 results in fewer allowed optical modes 1870.
  • the required threshold gain required to overcome cavity losses is increased to 1865 compared to the gain 1845 of FIG.58A, referring to the peaks 1877 calculated for forward and reverse propagating modes 1880 and 1885, respectively, shown in FIG.59B.
  • the increase in required threshold gain for a slab of metal oxide material can be reduced dramatically by increasing the slab length of the optical gain medium – in this case the metal-oxide semiconducting region responsible for the optical emission process.
  • some embodiments utilize planar waveguide structures where the optical mode overlaps an optical gain layer along the plane parallel length. That is, even though the gain material is still a thin slab the optical propagation vector is substantially parallel to the plane of the gain slab.
  • This is shown schematically for structure 140 FIG.2B and structure 2360 in FIG. 74. Waveguide structures having optical gain region layer thicknesses well below 500 nm are possible and can even be as thin as 1 nanometer supporting a quantum well (refer to FIGS.64 to 68).
  • the longitudinal length of the waveguide can then be of the order of several microns to even a few millimeters or even a centimeter. This is an advantage of the waveguide structure.
  • An added requirement is the ability to confine and guide optical modes along the major axis length of the waveguide, which can be achieved by use of suitable refractive index discontinuities.
  • Optical modes prefer to be guided in a higher refractive index medium compared to the surrounding non-absorptive cladding regions. This can be achieved using metal-oxide compositions as set out in the present disclosure which can be preselected to exhibit advantageous E-k band structure.
  • a UVLAS requires, in the most fundamental configuration, at least one optical gain medium and an optical cavity for recycling generated photons.
  • FIG.60 shows schematically an embodiment of an optical cavity having HR 1900, gain medium 1905 substantially filling the cavity of length 1935, and an OC 1915 having physical thickness 1910.
  • the standing waves 1925 and 1930 show two distinct optical wavelength optical fields that are matched to the cavity length.
  • the outcoupled light 1920 is due to the OC leaking a portion of the trapped energy within the cavity gain medium 1905.
  • FIG.61 shows output wavelengths 1960 and 1965 from the cavity with energy flow 1970.
  • the cavity length 1935 is the same as in FIG.60.
  • FIG.61 shows that the cavity length 1935 can support two optical modes forming standing waves 1930 and 1925 of two different wavelengths.
  • FIG.61 shows the emission or outcoupling of both wavelength modes (standing waves 1930 and 1925) as wavelengths 1965 and 1960, respectively. That is, both modes propagate.
  • Optical gain medium 1905 substantially fills the optical cavity length 1935. Only the peak optical field intensity nodes 1940, 1945 and 1950 couples to the spatial portions of the gain medium 1905. It is therefore possible in accordance with the present disclosure to configure the gain medium within the optical cavity as shown in FIG.62.
  • FIG.62 shows a spatially selective gain medium 1980 which is contracted in length compared to optical gain medium 1905 of FIGS.60-61 and is positioned advantageously within cavity length 1935 to amplify only the mode 1925. That is, optical gain medium 1980 favors the outcoupling of wavelength 1960 as the optical mode. The cavity thus preferentially provides gain to the fundamental mode 1925 with output energy selected as wavelength 1960.
  • FIG.63 shows two spatially selective gain media 1990 and 1995 positioned advantageously to amplify only the mode of standing wave 1930.
  • the cavity preferentially provides gain to the mode of standing wave 1930 with output energy selected as 1965.
  • This method involving spatially positioning the gain regions within the optical cavity is one example embodiment of the present disclosure. This can be achieved by predetermining the functional regions as a function of the growth direction during film formation process as described herein.
  • a spacer layer between the gain sections can comprise substantially non-absorbing metal-oxide compositions and otherwise provide electronic carrier transport functions, and aid in the optical cavity tuning design.
  • Attention is now directed towards the optical gain medium design for application to UVLAS using metal-oxide compositions set out in the present disclosure.
  • FIGS.64A-64B and 65A-65B disclose bandgap engineered quantum confinement structures of a single quantum well (QW). It is to be understood a plurality of QWs is possible, as is a superlattice.
  • the wide bandgap electronic barrier cladding layers are selected from metal- oxide material composition A x B y O z and the potential well material is selected as C p D q O r .
  • Metal cations A, B, C and D are selected from the compositions set out in the present disclosure (0 ⁇ x, y, z, p, q, r ⁇ 1). [0901] Predetermined selection of materials can achieve the conduction and valence band offsets as shown in FIGS.64A and 64B.
  • the lowest lying quantized electron state 2055 and highest quantized valence state 2060 participate in the spatial recombination process to create a photon of energy equal to 2065.
  • Reducing the QW thickness yet further results in the spatial band structures of FIGS.65A and 65B.
  • the lowest lying quantized electron state 2075 and highest quantized valence state 2080 participate in the spatial recombination process to create a photon of energy equal to 2085.
  • the QW can only support a single quantized electron state 2095 which participates with the highest quantized valence state 2100 in the spatial recombination process to create a photon of energy equal to 2105.
  • the spontaneous emission due to the spatial recombination of the quantized electron and hole states for the QW structures of FIGS.64A, 64B, 65A and 65B are shown in FIG.66.
  • FIGS.67A and 67B show again a QW configured using metal-oxide layers to form an example QW structure as described previously.
  • the QW thickness 2160 is tuned to achieve recombination energy 2145.
  • the schematic E-k diagram is critical for describing the population inversion mechanism for creating excess electrons and holes in the conduction and valence band necessary for providing optical gain.
  • the band structure shown in FIG.68A describes the electronic energy configuration states when the conduction band quasi-Fermi energy level 2230 is positioned such that it is above the electronic quantized energy state 2235.
  • Valence band level 2240 is the valence band edge of the bulk material used in the narrow bandgap region of the MQW. When the narrow bandgap material is confined in the MQW, the energy states are quantized, creating the band structure dispersion for conduction band 2195 and valence band 2205. Valence band level 2240 is then the valence band maximum of the MQW region.
  • Valence band level 2245 represents the Fermi energy level of the valence band when configured as a p-type material. This makes excess hole density 2225 region filled with holes that can participate in optical gain.
  • Calculation of the integrated gain spectrum for the representative band structure of FIG.68A is shown in FIG.68B.
  • Curves 2275 to 2280 show an increase in the electron concentration N e where 0 ⁇ N e ⁇ 5x10 24 m -3 .
  • Net positive gain 2250 is achievable under high electron concentrations with threshold N e ⁇ 4x10 24 m -3 .
  • These parameters are of the order achievable by other technologically mature semiconductors such as GaAs and GaN.
  • the metal oxide semiconductor by virtue of having an intrinsically high bandgap will also be less susceptible to gain reduction with operating temperature. This is evidenced by conventional optically pumped high power solid-state Ti-doped Al 2 O 3 laser crystals.
  • FIG.68B shows the net gain 2265 and net absorption 2270 as a function of N e .
  • the range of crystal wave vectors which can contribute to vertical transitions determines the width of the net gain region 2250. This is fundamentally determined by the achievable excess electron 2220 and hole 2225 states possible by manipulating the quasi-Fermi energies.
  • the region 2255 is below the fundamental bandgaps of the host QW and is therefore non absorbing. Optical modulators are therefore also possible using metal-oxide semiconductor QWs. Of note is the point of induced transparency 2260 where the QW achieves zero loss.
  • Manipulating the quasi-Fermi energy is not the only method available for creating excess electron and hole pairs in the vicinity of the zone-center band structure enabling optical emission.
  • FIGS.69A and 69B showing the E-k band structures for the case of direct bandgap materials (FIG.69A) and pseudo-direct bandgap materials, for example, metal-oxide SL with period selected to create valence maxima as shown in curves 2241 with hole states 2246 of FIG.69B.
  • FIGS.69A and 69B show the E-k band structures for the case of direct bandgap materials (FIG.69A) and pseudo-direct bandgap materials, for example, metal-oxide SL with period selected to create valence maxima as shown in curves 2241 with hole states 2246 of FIG.69B.
  • FIGS.70A and 70B show an impact ionization process with a metal-oxide semiconductor having a direct bandgap. While impact ionization is a known phenomenon and process in semiconductors, not so well known is the advantageous properties of extremely wide energy bandgap metal oxides. One of the most promising properties that has been found in accordance with the present disclosure is the exceedingly high dielectric breakdown strength of metal-oxides.
  • FIG.70A shows a metal oxide direct bandgap of 2266 with a ‘hot’ (high energy) electron injected into the conduction band at electron state 2251 with excess kinetic energy 2261 with respect to the conduction band 2256 edge.
  • Metal-oxides can easily withstand excessively high electrical fields placed across thin films (V br >1 to 10 MV/cm).
  • V br >1 to 10 MV/cm Operating with a metal oxide slab biased at below and close to the breakdown voltage enables an impact ionization event as shown in FIG.70B.
  • the energetic electron 2251 interacts with the crystal symmetry of the host and can produce a lower energy state by coupling to the available thermalizing with lattice vibration quanta called phonons and pair production. That is, the impact ionization event comprising a hot electron 2251 is converted into two lower energy electron states 2276 and 2281 near the conduction band minimum as well as a new hole state 2286 created at the top of the valence band 2271.
  • the electron-hole pair produced 2291 is a potential recombination pair to create a photon of energy 2266.
  • impact ionization pair production is possible for excess electron energy 2261 of about half the bandgap energy 2266.
  • E G 5eV 2266
  • hot electrons with respect to the conduction band edge of ⁇ 2.5eV can initiate pair production process as described.
  • This is achievable for Al 2 O 3 /Ga 2 O 3 heterostructures wherein an electron from Al 2 O 3 is injected into the Ga 2 O 3 across the heterojunction.
  • Impact ionization is a stochastic process and requires a minimum interaction length to create a finite energy distribution of electron-hole pairs.
  • FIGS.71A and 71B show that impact ionization is also possible in pseudo-direct and indirect band structure metal oxides.
  • FIG.71A recites the case previously for direct bandgap
  • FIG.71B shows the same process for an indirect bandgap valence band 2294 wherein the electron-hole pair production 2292 requires a k ⁇ 0 hole state 2296 to be created, necessitating a phonon for momentum conservation.
  • FIG.71B demonstrates that an optical gain medium is also possible in pseudo-direct band structures such as 2294.
  • FIGS.72A and 72B disclose further detail of the disclosure using impact ionization processes for optical gain medium by selecting advantageous properties of the band structure.
  • FIG.72A describes the band structure of FIGS 68A-68B, 69A-69B, 70A-70B and 71A-71B for in-plane crystal wave vectors ⁇
  • FIG.72B is plotted along the growth direction, the resulting spatial-energy band diagram is shown in FIG.72B.
  • the hot electron 2251a is injected into the conduction band producing impact ionization process and pair production 2290.
  • the band structure has a potential energy along z that is linearly decreasing.
  • An impact ionization event producing electron 2276 and hole 2286 pair quasi-particle production 2290 can undergo recombination and produce a bandgap energy photon.
  • the remaining electron 2276 can be accelerated by the applied electric field to create another hot electron 2252.
  • the hot electron 2252 can then impact ionize and repeat the process.
  • FIG.73 shows a semiconductor optoelectronic device in the form of a vertical emission type UVLAS 2300 comprising an optical gain region 2330 of thickness 2331; an electron injector 2310 region 2325; a hole injector 2315 region 2335.
  • Regions 2325 and 2335 may be n-type and p-type metal oxide semiconductors and substantially transparent to the operating wavelength emitted from the device along axis 2305.
  • the electrical excitation source 200 is operably connected to the device via conductive layers 2340 and 2320 which are also operable as a high reflector and output coupler, respectively.
  • the optical cavity between the reflectors is formed by the sum of the stack of layers 2325, 2330 and 2335. [0931] A portion of the thickness of the reflectors is also included as the cavity thickness if they are partially absorbing and of multilayer dielectric type. For the case of pure and ideal metal reflectors, the mirror thickness can be neglected.
  • the optical cavity thickness is governed by the layers 2325, 2330 and 2335, of which the optical gain region 2330 is advantageously positioned with respect to the cavity modes as described in FIGS.61, 62 and 63.
  • the photon recycling 2350 is shown by the optical reflection from the mirrors/reflectors 2340 and 2320.
  • Yet another option for creating a UVLAS structure as shown in FIG.73 is an embodiment in which the reflectors 2320 and 2340 form part of the electrical circuit and therefore must be conducting and must also be operable as reflectors forming the optical cavity. This can be achieved by using elemental Aluminum layers to act as at least one of the HR or OC.
  • An alternative UVLAS configuration decouples the optical cavity from the electrical portion for the structure.
  • FIG.74 discloses a UVLAS 2360 having an optical cavity formed comprising HR 2340 and OC 2320 that are not part of the electrical circuit.
  • the optical gain region 2330 is positioned with the cavity enabling photon recycling 2350.
  • the optical axis is directed along axis 2305.
  • Insulating spacer layer metal oxide regions may be provided within the cavity to tailor the position of the gain region 2330 between the reflectors 2340 and 2320.
  • the electron 2325 and hole injectors and 2335 provide laterally transported carriers into the gain region 2330.
  • Such as structure can be achieved for a vertical emitting UVLAS by creating p- type and n-type regions laterally disposed to connect only a portion of the gain region.
  • the reflectors may be positioned also on a portion of the optical gain region to create the cavity photon recycling 2350.
  • FIG.75 shows the waveguide structure 2370 having a major axis 2305 with epitaxial regions formed sequentially along the growth direction z comprising of electron injector 2325, optical gain region 2330 and hole injector region 2335.
  • Single-mode or multi- mode waveguide structures having refractive indices are selected to create confined optical radiation of forward and reverse propagating modes 2375 and 2380.
  • the cavity length 2385 is terminated at each end with reflectors 2340 and 2320.
  • High reflector 2340 can be metallic or distributed feedback type comprising etched grating or multilayer dielectric conformally coated to a ridge.
  • the OC 2320 can be a metallic semi-transparent film of dielectric coating or even a cleaved facet of the semiconductor slab.
  • optical gain regions may be formed using metal-oxide semiconductors in accordance with the present disclosure that are electrically stimulated and/or optically pumped/stimulated where the optical cavity may be formed in both vertical and waveguide structures as required.
  • the present disclosure teaches new materials and processes for realizing optoelectronic light emitting devices based on metal oxides capable of generating light deep into the UVC and far/vacuum UV wavelength bands.
  • These processes include tuning or configuring the band structure of different regions of the device using a number of different methods including, but not limited to, composition selection to achieve desired band structure including forming effective compositions by the use of superlattices comprising different layers of repeating metal oxides.
  • the present disclosure also teaches the use of biaxial strain or uniaxial strain to modify band structures of relevant regions of the semiconductor device as well as strain matching between layers, e.g., in a superlattice, to reduce crystal defects during the formation of the optoelectronic device.
  • metal oxide based materials are commonly known in the prior-art for their insulating properties.
  • Metal oxide single crystal compositions such as Sapphire (corundum-Al 2 O 3 ) are available with extremely high crystal quality and are readily grown in large diameter wafers using bulk crystal growth methods, such as Czochralski (CZ), Edge-fed growth (EFG) and Float-zone (FZ) growth.
  • CZ Czochralski
  • EFG Edge-fed growth
  • FZ Float-zone
  • Semiconducting gallium-oxide having monoclinic crystal symmetry has been realized using essentially the same growth methods as Sapphire.
  • the melting point of Ga 2 O 3 is lower than Sapphire so the energy required for the CZ, EFG and FZ methods is slightly lower and may help reduce the large scale cost per wafer.
  • Bulk alloys of AlGaO 3 bulk substrates have not yet been attempted using CZ or EFG.
  • metal oxide layers of the optoelectronic devices may be based on these metal oxide substrates in accordance with examples of the present disclosure.
  • the two binary metal oxide materials Ga 2 O 3 and Al 2 O 3 exist in several technologically relevant crystal symmetry forms.
  • the alpha-phase (rhombohedral) and beta-phase (monoclinic) are possible for both Al 2 O 3 and Ga 2 O 3 .
  • Ga 2 O 3 energetically favors the monoclinic structure whereas Al 2 O 3 favors the rhombohedral for bulk crystal growth.
  • atomic beam epitaxy may be employed using constituent high purity metals and atomic oxygen.
  • Two example classes of device structures that are particularly suitable to UVLED include: high Al-content AlxGa 1-x O 3 deposited on Al 2 O 3 substrates and high Ga-content AlGaO 3 on bulk Ga 2 O 3 substrates.
  • the use of digital alloys and superlattices further extends the possible designs for application to UVLEDs.
  • the selection of various Ga 2 O 3 and Al 2 O 3 surface orientations when presented for AlGaO 3 epitaxy can be used in conjunction with growth conditions such as temperature and metal-to-atomic-oxygen ratio and relative metal ratio of Al to Ga in order to predetermine the crystal symmetry type of the epitaxial films which may be exploited to determine the band structure of the optical emission or conductivity type regions.
  • growth conditions such as temperature and metal-to-atomic-oxygen ratio and relative metal ratio of Al to Ga in order to predetermine the crystal symmetry type of the epitaxial films which may be exploited to determine the band structure of the optical emission or conductivity type regions.
  • the epitaxial oxide materials described herein can be any of those shown in the table in FIG.28 and in FIGS.76A-1, 76A-2 and 76B.
  • Some examples of epitaxial oxide materials are (Al x Ga 1-x ) 2 O 3 where 0 ⁇ x ⁇ 1; (Al x Ga 1-x ) y O z where 0 ⁇ x ⁇ 1, 1 ⁇ y ⁇ 3, and 2 ⁇ z ⁇ 4; NiO; (Mg x Zn 1-x ) z (Al y Ga 1-y ) 2(1-z) O 3-2z where 0 ⁇ x ⁇ 1, 0 ⁇ y ⁇ 1 and 0 ⁇ z ⁇ 1; (Mg x Ni 1-x ) z (Al y Ga 1-y ) 2(1-z) O 3-2z where 0 ⁇ x ⁇ 1, 0 ⁇ y ⁇ 1 and 0 ⁇ z ⁇ 1; MgAl 2 O 4 ; ZnGa 2 O 4 ; (Mg x Zn y Ni 1-y-x )(Al
  • An “epitaxial oxide” material described herein is a material comprising oxygen and other elements (e.g., metals or non-metals) having an ordered crystalline structure configured to be formed on a single crystal substrate, or on one or more layers formed on the single crystal substrate.
  • Epitaxial oxide materials have defined crystal symmetries and crystal orientations with respect to the substrate.
  • Epitaxial oxide materials can form layers that are coherent with the single crystal substrate and/or with the one or more layers formed on the single crystal substrate.
  • Epitaxial oxide materials can be in layers of a semiconductor structure that are strained, wherein the crystal of the epitaxial oxide material is deformed compared to a relaxed state.
  • Epitaxial oxide materials can also be in layers of a semiconductor structure that are unstrained or relaxed.
  • the epitaxial oxide materials described herein are polar and piezoelectric, such that the epitaxial oxide materials can have spontaneous or induced piezoelectric polarization.
  • induced piezoelectric polarization is caused by a strain (or strain gradient) within the multilayer structure of the chirp layer.
  • spontaneous piezoelectric polarization is caused by a compositional gradient within the multilayer structure of the chirp layer. For example, (Al x Ga 1-x ) y O z , where 0 ⁇ x ⁇ 1, 1 ⁇ y ⁇ 3, and 2 ⁇ z ⁇ 4, and with a Pna21 space group is a polar and piezoelectric material.
  • Some other epitaxial oxide materials that are polar and piezoelectric are Li(Al x Ga 1-x )O 2 where 0 ⁇ x ⁇ 1, with a Pna21 or a P421212 space group.
  • the crystal symmetry of an epitaxial oxide layer e.g., comprising materials shown in the table in FIG.28 and in FIGS.76A-1, 76A-2 and 76B
  • the crystal symmetry of an epitaxial oxide layer can be changed when the layer is in a strained state. In some cases, such an asymmetry in the crystal symmetry caused by strain can change the space group of an epitaxial oxide material.
  • an epitaxial oxide layer (e.g., comprising materials shown in the table in FIG.28 and in FIGS.76A-1, 76A-2 and 76B) can become polar and piezoelectric, when the layer is in a strained state.
  • the epitaxial oxide materials described herein can each have a cubic, tetrahedral, rhombohedral, hexagonal, and/or monoclinic crystal symmetry.
  • the epitaxial oxide materials in the semiconductor structures described herein comprise (Al x Ga 1-x ) 2 O 3 with a space group that is R3c, Pna21, C2m, Fd3m, and/or Ia3.
  • the epitaxial oxide materials described herein can have different space groups in different embodiments.
  • the space group notation used herein is representative of various space groups, in some embodiments.
  • More information regarding full lists of space groups for the different space groups written as “R3c,” “Pna21,” “C2m,” “Fd3m,” and “Ia3” herein can be found in “The mathematical theory of symmetry in solids : representation theory for point groups and space groups,” Oxford New York: Clarendon Press., ISBN 978-0-19- 958258-7.
  • the epitaxial oxide materials with cubic crystal symmetry described herein can have any cubic space group.
  • the full list of cubic space groups (SG) assigned to their respective space group numbers (#SG) as SG(#SG) is: P23(195), F23(196), I23(197), P210(198), I213(199), Pm3(200), Pn3(201), Fm3(202), Fd3(203), Im3(204), Pa3(205), Ia3(206), P432(207), P4232(208), F432(209), F4132(210), I432(211), P4332(212), P4132(213), I4132(214), P43m(215), F43m(216), I43m(217), P43n(218), F43c(219), I43d(220), Pm3m(221), Pn3n(222), Pm3n(223), Pn3m(224), Fm3m(225), Fm3
  • strain can change the crystal symmetry and therefore the space group of an epitaxial material within a layer that is in a strained state.
  • a strain-free cubic crystal lattice can be pseudo-morphically grown as an epitaxial layer on a surface or substrate having a different lattice constant.
  • the lattice mismatch can be accommodated via elastic deformation of the epitaxial layer unit cell resulting in a tetragonal distortion. Therefore, the cubic space group of the material forming the epitaxial layer can undergo biaxial or uniaxial crystal deformation into a tetragonal space group.
  • the in-plane lattice mismatch at the MgGa 2 O 4 (001) / MgO(001) heterointerface can be defined with reference to the rigid bulk MgO substrate as: [0953] Representing an in-plane biaxial tensile strain on the MgGa 2 O 4 film with resulting deformation of the Fd3m space group via tetragonal deformation into a space group of symmetry I41/amd (SG#141).
  • the present disclosure assigns space groups to the materials utilized in heterojunctions or superlattices to their native strain free assignment.
  • the epitaxial oxide materials with tetragonal crystal symmetry described herein can have any tetragonal space group.
  • the epitaxial oxide materials described herein can be formed using an epitaxial growth technique such as molecular beam epitaxy (MBE), metal organic chemical vapor deposition (MOCVD), atomic layer deposition (ALD), and other physical vapor deposition (PVD) and chemical vapor deposition (CVD) techniques.
  • MBE molecular beam epitaxy
  • MOCVD metal organic chemical vapor deposition
  • ALD atomic layer deposition
  • PVD physical vapor deposition
  • CVD chemical vapor deposition
  • the semiconductor structures comprising epitaxial oxide materials described herein can be a single layer on a substrate or multiple layers on a substrate.
  • Semiconductor structures with multiple layers can include a single quantum well, multiple quantum wells, a superlattice, multiple superlattices, a compositionally varied (or graded) layer, a compositionally varied (or graded) multilayer structure (or region), a doped layer (or region), and/or multiple doped layers (or regions).
  • Such semiconductor structures with one or more doped layers (or regions) can include layers (or regions) that are doped p-n, p-i-n, n-i-n, p-i-p, n-p-n, p-n-p, p- metal (to form a Schottky junction), and/or n-metal (to form a Schottky junction).
  • the semiconductor structures described herein can include similar or dissimilar epitaxial oxide materials. In some cases, the crystal symmetry of the substrate and the epitaxial layers in the semiconductor structure will all have the same crystal symmetry. In other cases, the crystal symmetry can vary between the substrate and the epitaxial layers in the semiconductor structure.
  • the epitaxial oxide layers in the semiconductor structures described herein can be i-type (i.e., intrinsic, or not intentionally doped), n-type, or p-type.
  • the epitaxial oxide layers that are n-type or p-type can contain impurities that act as extrinsic dopants.
  • the n-type or p-type layers can contain a polar epitaxial oxide material (e.g., (Al x Ga 1-x ) y O z , where 0 ⁇ x ⁇ 1, 1 ⁇ y ⁇ 3, and 2 ⁇ z ⁇ 4, and with a Pna21 space group), and the n-type or p-type conductivity can be formed via polarization doping (e.g., due to a strain or composition gradient within the layer(s)).
  • polar epitaxial oxide material e.g., (Al x Ga 1-x ) y O z , where 0 ⁇ x ⁇ 1, 1 ⁇ y ⁇ 3, and 2 ⁇ z ⁇ 4, and with a Pna21 space group
  • the n-type or p-type conductivity can be formed via polarization doping (e.g., due to a strain or composition gradient within the layer(
  • a dopant impurity e.g., an acceptor impurity, or a donor impurity
  • the epitaxial oxide material can be co-deposited with the epitaxial oxide material to form a layer such that the dopant impurity is incorporated into the crystalline layer (e.g., substituted in the lattice, or in an interstitial position) and forms active acceptors or donors to provide the material p-type or n-type conductivity.
  • a dopant impurity layer can be deposited adjacent to a layer comprising an epitaxial oxide material such that the dopant impurity layer includes active acceptors or donors that provide the epitaxial oxide material p-type or n-type conductivity.
  • a plurality of alternating dopant impurity layers and layers comprising epitaxial oxide materials form a doped superlattice, where the dopant impurity layers provide p-type or n-type conductivity to the doped superlattice.
  • Suitable substrates for the formation of the semiconductor structures comprising epitaxial oxide materials described herein include those that have crystal symmetries and lattice parameters that are compatible with the epitaxial oxide materials deposited thereon.
  • suitable substrates include Al 2 O 3 (any crystal symmetry, and C-plane, R-plane, A- plane or M-plane oriented), Ga 2 O 3 (any crystal symmetry), MgO, LiF, MgAl 2 O 4 , MgGa 2 O 4 , LiGaO 2 , LiAlO 2 , (Al x Ga 1-x ) 2 O 3 (any crystal symmetry), MgF 2 , LaAlO 3 , TiO 2 , or quartz.
  • the crystal symmetry of the substrate and the epitaxial oxide material can be compatible if they have the same type of crystal symmetry and the in-plane (i.e., parallel with the surface of the substrate) lattice parameters and atomic positions at the surface of the substrate provide a suitable template for the growth of the subsequent epitaxial oxide materials.
  • a substrate and an epitaxial oxide material can be compatible if the in-plane lattice constant mismatch between the substrate and the epitaxial oxide material are less than 0.5%, 1%, 1.5%, 2%, 5% or 10%.
  • the crystal structure of the substrate material has a lattice mismatch of less than or equal to 10% with the epitaxial layer.
  • the crystal symmetry of the substrate and the epitaxial oxide material can be compatible if they have a different type crystal symmetry but the in-plane (i.e., parallel with the surface of the substrate) lattice parameters and atomic positions at the surface of the substrate provide a suitable template for the growth of the subsequent epitaxial oxide materials.
  • multiple (e.g., 2, 4 or other integer) unit cells of a substrate surface atomic arrangement can provide a suitable surface for the growth of an epitaxial oxide material with a larger unit cell than that of the substrate.
  • the epitaxial oxide layer can have a smaller lattice constant (e.g., approximately half) than the substrate.
  • the unit cells of the epitaxial oxide layer may be rotated (e.g., by 45 degrees) compared to the unit cells of the substrate.
  • the lattice constants in all three directions of the crystal are the same, and the orthogonal in-plane lattice constants will be also be the same.
  • the lattice constants in both orthogonal directions need to be within a certain percentage mismatch (e.g., within 0.5%, 1%, 1.5%, 2%, 5% or 10%) of the lattice constants in both orthogonal directions of another material with which it is compatible.
  • the epitaxial oxide materials of the semiconductor structures described herein and the substrate material upon which the semiconductor structures described herein are grown are selected such that the layers of the semiconductor structure have a predetermined strain, or strain gradient.
  • the epitaxial oxide materials and the substrate material are selected such that the layers of the semiconductor structure have in-plane (i.e., parallel with the surface of the substrate) lattice constants (or crystal plane spacings) that are within 0.5%, 1%, 1.5%, 2%, 5% or 10% of an in-plane lattice constant (or crystal plane spacing) of the substrate.
  • a buffer layer including a graded layer or region can be used to reset the lattice constant (or crystal plane spacing) of the substrate, and the layers of the semiconductor structure have in-plane lattice constants (or crystal plane spacings) that are within 0.5%, 1%, 1.5%, 2%, 5% or 10% of the final (or topmost) lattice constant (or crystal plane spacing) of the buffer layer.
  • the materials in the semiconductor structure may have lattice constants and/or crystal symmetries that are different from those of the substrate.
  • the devices comprising the semiconductor structures comprising the epitaxial oxide materials described herein can include electronic and optoelectronic devices.
  • the devices described herein can be resistors, capacitors, inductors, diodes, transistors, amplifiers, photodetectors, LEDs or lasers.
  • the devices comprising the semiconductor structures comprising the epitaxial oxide materials described herein are optoelectronic devices, such as photodetectors, LEDs and lasers, that detect or emit UV light (e.g., with a wavelength from 150 nm to 280 nm).
  • the device comprises an active region wherein the detection or emission of light occurs, and the active region comprises an epitaxial oxide material with a bandgap selected to detect or emit UV light (e.g., with a wavelength from 150 nm to 280 nm).
  • the devices comprising the semiconductor structures comprising the epitaxial oxide materials described herein utilize carrier multiplication, for example from impact ionization mechanisms.
  • the bandgaps of the epitaxial oxide materials are wide (e.g., from about 2.5 eV to about 10 eV, or from about 3 eV to about 9 eV).
  • the wide bandgaps provide high dielectric breakdown strengths due to the epitaxial oxide materials described herein.
  • Devices including wide bandgap epitaxial oxide materials can have large internal fields and/or be biased at high voltages without damaging the materials of the device due to the high dielectric breakdown strengths of the constituent epitaxial oxide materials.
  • the large electric fields present in such devices can lead to carrier multiplication through impact ionization, which can improve the characteristics of the device.
  • an avalanche photodetector can be made to detect low intensity signals, or an LED or laser can be made with high electrical power to optical power conversion efficiency.
  • DFT Density functional theory
  • the crystal structure symmetry of the atomic positions and species imposes a fundamental structure effective potential for the interacting electrons.
  • the effective potential for the many-body electron interactions in three- dimensional spatial coordinates can be implemented by the utility of functionals of the electron density.
  • This effective potential includes exchange and correlation interactions, representing interacting and non-interacting electrons.
  • XCF exchange functionals
  • inner electrons can be ignored in a large number of cases, thereby reducing the atoms comprising the crystal to an ionic core that interacts with the valence electrons. This effective interaction is called a pseudopotential and approximates the potential felt by the valence electrons.
  • One notable exception of the effect of inner core electrons is in the case of Lanthanide oxides, wherein partially filled Lanthanide atomic 4f-orbitals are surrounded by closed electron orbitals.
  • the present DFT band structures disclosed herein account for this effect. There exist many improvements for XCF to attain higher accuracy of band structures applied to oxides.
  • improvements over historical XCFs of the known local density approximation (LDA), generalized gradient approximation (GGA) hybrid exchange include the use of the Tran-Blaha modified Becke-Johnson (TBmBJ) exchange functional, and further modifications, such as the KTBmBJ, JTBSm, and GLLBsc forms.
  • LDA local density approximation
  • GGA generalized gradient approximation
  • HSE Heyd-Scuseria- Ernzerhof
  • PBE Perdew-Burke-Ernzerhof
  • BLYP Becke, Lee, Yang, Parr
  • the TBmBJ exchange potential can predict the electron energy-momentum (E-k) band structure, bandgaps, lattice constants, and some mechanical properties of epitaxial oxide materials.
  • E-k electron energy-momentum
  • a further benefit of the TBmBJ is the lower computational cost compared to HSE when applied to a large number of atoms in large supercells which are used to simulate smaller perturbations to an idealized crystal structure, such as impurity incorporation. It is expected that further improvements over TBmBJ applied specifically to the present oxide systems can also be achieved.
  • DTF calculations are used extensively in the present disclosure to provide ab-initio insights into the electronic and physical properties of the epitaxial oxide materials described herein, such as the bandgap and whether the bandgap is direct or indirect in character.
  • the electronic and physical properties of the epitaxial oxide materials can be used to design semiconductor structures and devices utilizing the epitaxial oxide materials. In some cases, experimental data has also been used to verify the properties of the epitaxial oxide materials and structures described herein.
  • Calculated E-k band diagrams of epitaxial oxide materials derived using DFT calculations are described herein. There are several features of the E-k diagrams that can be used to provide insight into the electronic and physical properties of the epitaxial oxide materials.
  • the energies and k-vectors of valence band and conduction band extrema indicate the approximate energy width of the bandgap and whether the bandgap has a direct or an indirect character.
  • the curvature of the branches of the valence band and conduction band near the extrema are related to the hole and electron effective masses, which relates to the carrier mobilities in the material. DFT calculations using the TBmBJ exchange functional more accurately shows the magnitude of the bandgap of the material compared to previous exchange functionals, as verified by experimental data.
  • the calculated band diagrams of epitaxial materials in this disclosure may differ from the actual band diagrams of the epitaxial materials in some ways.
  • FIGS.76A-1 through 76H show charts and tables of DFT calculated minimum bandgap energies and lattice parameters for some examples of epitaxial oxide materials.
  • FIGS.76A-1 and 76A-2 show a table of crystal symmetries (or space groups), lattice constants (“a,” “b” and “c,” in different crystal directions, in Angstroms), bandgaps (minimum bandgap energies in eV), and the wavelength of light (“ ⁇ _g,” in nm) that corresponds to the bandgap energy of various materials.
  • FIGS.76B and 76C show charts of some epitaxial oxide material bandgaps (minimum bandgap energies in eV) and in some cases crystal symmetry (e.g., ⁇ -, ⁇ -, ⁇ - and ⁇ -Al x Ga 1-x O y ) versus lattice constant (in Angstroms) of the epitaxial oxide material.
  • FIG.76C includes “small,” “mid,” and “large” lattice constant sets of epitaxial oxide materials. Epitaxial oxide materials within each of these sets (or in some cases between the sets) may be compatible with one another, as described further herein.
  • S6-1D shows a chart of lattice constant, b, in Angstroms, versus lattice constant, a, in Angstroms, of some epitaxial oxide materials.
  • Bandgaps of the materials shown in FIGS.76A-1 through 76C were obtained using computer modeling. The computer models used DFT and the TBMBJ exchange potential.
  • the charts and tables in FIGS.76A-1 through 76C show that the composition and the crystal symmetry (or space group) can each affect the bandgap of an epitaxial oxide material.
  • ⁇ -Ga 2 O 3 i.e., Ga 2 O 3 with a C2/m space group
  • ⁇ -(Al 0.5 Ga 0.5 ) 2 O 3 i.e., Ga 2 O 3 with a C2/m space group
  • changing the Al content of (AlxGa 1-x ) 2 O 3 e.g., adding Al to Ga 2 O 3 to form (Al 0.5 Ga 0.5 ) 2 O 3
  • ⁇ -Ga 2 O 3 i.e., Ga 2 O 3 with a C2/m space group
  • ⁇ -Ga 2 O 3 i.e., Ga 2 O 3 with a Pna21 space group
  • the character of the band structure can also be affected by the composition and the crystal symmetry (or space group) of epitaxial oxide materials, as well as by a tensile or compressive strain state of the material.
  • the composition and crystal symmetry (or space group) of an epitaxial oxide material can determine if the minimum bandgap energy corresponds to a direct bandgap transition or an indirect bandgap transition.
  • the strain state of an epitaxial oxide material can also affect the minimum bandgap energy, and whether the minimum bandgap energy corresponds to a direct bandgap transition or an indirect bandgap transition.
  • Other materials properties e.g., the electron and hole effective masses
  • Such epitaxial oxide materials can have a cubic crystal symmetry (or an Fd3m space group), for example ⁇ -Ga 2 O 3 (i.e., Ga 2 O 3 with an Fd3m space group), or ⁇ -(Al x Ga 1-x ) 2 O 3 .
  • Such epitaxial oxide materials can also have a hexagonal crystal symmetry (or an R3c space group), for example ⁇ -Ga 2 O 3 (i.e., Ga 2 O 3 with an R3c space group), or ⁇ -(Al x Ga 1-x ) 2 O 3 .
  • the charts and table in FIGS. 76A-1 through 76D also illustrate that some epitaxial oxide materials have crystal symmetries such that the lattice constants in the a and b directions are different. Some of the lattice constants shown in the chart in FIG.76D lie off of the diagonal (i.e., where lattice constant, a does not equal lattice constant, b).
  • Such epitaxial oxide materials can have a monoclinic crystal symmetry (or an C2/m space group), for example ⁇ -Ga 2 O 3 (i.e., Ga 2 O 3 with a C2/m space group), or ⁇ -(Al x Ga 1-x ) 2 O 3 .
  • Such epitaxial oxide materials can also have an orthorhombic crystal symmetry (or a Pna21space group), for example ⁇ -Ga 2 O 3 (i.e., Ga 2 O 3 with a Pna21 space group), or ⁇ -(Al x Ga 1-x ) 2 O 3 .
  • Such epitaxial oxide materials can have different in-plane lattice constants in different directions (e.g., a and b), all of which can be matched (or close to matched) to the in-plane lattice constants of a compatible substrate.
  • the charts and table in FIGS.76A-1 through 76D also illustrate that epitaxial oxide materials have wide minimum bandgaps, with most having a bandgap from about 3 eV to about 9 eV.
  • the wide bandgaps have several advantages.
  • the wide bandgaps of epitaxial oxide materials provide them with high dielectric breakdown voltages, and therefore can be used in electronic devices that require large biases (e.g., high voltage switches, and impact ionization devices).
  • the bandgaps of epitaxial oxide materials are also well suited for use in optoelectronic devices that emit or detect light in the UV range, where materials with bandgaps from about 4.5 eV to about 8 eV can be used to emit or detect UV light with wavelengths from about 150 nm to 280 nm.
  • Semiconductor heterostructures can also be formed with wide bandgap materials as the emitter or absorber layers, and materials that have wider bandgaps than the emitter or absorber layers can be used in other layers of the structure to be transparent to the wavelength being emitted or absorbed.
  • the chart in FIG.76B can also serve as a guide to design semiconductor structures comprising epitaxial oxide materials.
  • the lattice constants and crystal symmetries provide information regarding which materials can be epitaxially formed (or grown) in a semiconductor structure, for example, with high crystal quality and/or with layers of the semiconductor structure having desired strain states.
  • a strain state for an epitaxial oxide material can beneficially alter the properties of the material.
  • an epitaxial oxide material can have a direct minimum bandgap energy in a strained state, but have an indirect bandgap in a relaxed (not strained) state.
  • the epitaxial oxide materials and the substrate material of a semiconductor structure are selected such that the layers of the semiconductor structure have in-plane (i.e., parallel with the surface of the substrate) lattice constants (or crystal plane spacings) that are within 0.5%, 1%, 1.5%, 2%, 5% or 10% of an in-plane lattice constant (or crystal plane spacing) of the substrate. Therefore, points on the chart in FIG.76B that are vertically aligned within an acceptable amount of mismatch, and that have compatible crystal symmetries, can be combined into a semiconductor structure with different types of epitaxial oxide materials (or epitaxial oxide heterostructures).
  • the bandgaps of such compatible materials can then be chosen for desired properties of the semiconductor structure and/or of a device that incorporates the semiconductor structure.
  • the semiconductor structure can be used in a UV-LED with doped layers (or regions) forming a p-i-n doping profile.
  • the i-layer can include an epitaxial oxide material with an appropriate bandgap (corresponding to the desired emission wavelength of the UV-LED) chosen from an epitaxial material in FIG.76B, which can be chosen from the set of compatible materials described above.
  • the n- and p-type layers can be chosen, from the set of compatible materials in FIG.76B, to be transparent to the emission wavelength, for example, by having bandgaps above the bandgap of the epitaxial oxide material emitting the light.
  • the n- and p- layers can be chosen, from the set of compatible materials in FIG.76B, to have indirect bandgaps so that they have low absorption coefficients for the wavelength of the emitted light.
  • FIG.76C shows that there is a group of epitaxial oxide materials with “small” lattice constants from about 2.5 Angstroms to about 4 Angstroms, some or all of which could be compatible materials with each other if their lattice constants are sufficiently matched, and their crystal symmetries are compatible.
  • the figure also shows that there is a group of epitaxial oxide materials with “mid” lattice constants from about 4 Angstroms to about 6.5 Angstroms, some or all of which could be compatible materials with each other if their lattice constants are sufficiently matched, and their crystal symmetries are compatible.
  • FIG.76C also shows that some fluoride materials (e.g., LiF or MgF 2 ) can be compatible with some epitaxial oxide materials, and can be used in the semiconductor structures described herein.
  • fluoride materials e.g., LiF or MgF 2
  • 2 ⁇ 2 ⁇ LiF has a lattice constant of approximately 11.5 Angstroms and can be compatible with the group of epitaxial oxide materials having lattice constants from about 11 to about 13 Angstroms.
  • FIGS.76E-76H show charts of some calculated epitaxial oxide material bandgaps (minimum bandgap energies in eV), and their crystal symmetries (space groups).
  • FIGS.76G-76H show charts of some calculated epitaxial oxide material bandgaps where the epitaxial oxide materials all have cubic crystal symmetry with a Fd3m space group.
  • the chart in FIG.76G includes binary and ternary materials, while the chart in FIG.76H also includes ternary and quaternary epitaxial oxide alloy materials formed by mixing some of the endpoint materials in the chart in FIG.76G.
  • These materials in the charts in FIGS.76G-76H can be grown on MgO or LiF substrates, for example, because they have compatible crystal symmetries and lattice constants.
  • MgO and LiF have lattice constants compatible with the epitaxial oxides in the charts in FIGS.76G-76H when 4 unit cells (in a 2x2 arrangement) of the MgO or LiF substrate are aligned with one unit cell of the epitaxial oxides in the charts.
  • materials in the charts in FIGS.76G-76H can be grown on MgAl 2 O 4 , which has compatible lattice constants and crystal symmetry.
  • Some of the materials shown in the chart in FIG.76H, for example, are alloys with mixed elements showing compounds formed by alloying or mixing two endpoint epitaxial oxide compounds.
  • “(Mg 0.5 Zn 0.5 )Ga 2 O 4 ” represents a material of type AB 2 O 4 with half the available A- sites mixed with an equal molar ratio of Mg and Zn species.
  • Such alloyed, or mixed, compounds typically have bandgaps between the endpoint compositions, in the previous example, between those of ZnGa 2 O 4 and MgGa 2 O 4 .
  • FIG.77 is a flowchart 7700 illustrating a process to form the epitaxial materials described herein (e.g., those in the table in FIGS.76A-1 and 76A-2).
  • the epitaxial oxides described herein can be grown, for example, using MBE with a select set of elemental sources. A wide variety of epitaxial oxide materials can be grown using a limited number of elemental sources.
  • an MBE tool including Mg, Zn, Ni, Al, Ga, Ge, Li and Si (e.g., as a dopant source) solid sources, and O and N plasma sources, can form most of the epitaxial oxide materials shown in the table in FIGS.76A-1 and 76A-2.
  • a smaller number of sources e.g., 4 or 5 or 6
  • the MBE sources needed to form them can be determined from the constituent elements of the epitaxial oxide materials in the set.
  • the MBE sources and growth parameters are chosen, then an epitaxial single crystal layered semiconductor structure is formed.
  • FIG.78 is a schematic 7800 that illustrates the situation that occurs when an element is added to an epitaxial oxide, using the analogy of a seesaw.
  • the binary Ga 2 O 3 with an ⁇ - or ⁇ - crystal symmetry is contemplated.
  • an additional element e.g., Mg, Ni, Zn or Li
  • the crystal symmetry remains unchanged and the crystal quality remains high (e.g., the concentration of point defects and dislocations remains low, and the smoothness of interfaces remains high).
  • FIGS.79 and 80 show plots 7900, 8000 of DFT calculated mechanical properties of some epitaxial oxides.
  • the epitaxial oxides described herein are strained.
  • the mechanical properties of the epitaxial oxide materials can affect some parameters of a semiconductor structure including strained layers, for example the critical layer thickness and/or the amount of lattice constant mismatch that an epitaxial oxide material can tolerate before relaxing (and/or being low quality, and/or having large concentrations of defects).
  • the mechanical properties in FIGS.79 and 80 were obtained using computer modeling. The computer models used DFT and the TBMBJ exchange potential. [0989]
  • FIG.79 is a plot 7900 of the shear modulus (in GPa) versus the bulk modulus (in GPa) for some example epitaxial oxide materials.
  • the shear modulus and the bulk modulus are related to the Poisson’s ratio, which is shown in plot 8000 in FIG.80 for some example epitaxial oxide materials.
  • Materials with lower values of Poisson’s ratio will deform less in the growth direction when strained in one or more directions perpendicular to the growth direction.
  • These softer materials e.g., with Poisson’s ratio less than 0.35, or less than 0.3, or less than 0.25
  • can have relatively large critical layer thicknesses even with a large amount of strain e.g., 0.5%, 1%, 1.5%, 2%, 5% or 10%.
  • FIGS.81A-81I show examples of semiconductor structures 6201-6209 comprising epitaxial oxide materials in layers or regions.
  • Each of the semiconductor structures 6201-6209 comprises a substrate 6200a-i and a buffer layer on the substrate 6210a-i.
  • the semiconductor structures 6201-6209 also comprise epitaxial oxide layer 6220a-i formed on buffer layers 6210a-i.
  • layers 6230b, 6230c, 6230d, etc. are the same as, or similar to, each other.
  • the epitaxial oxide layers of semiconductor structures 6201-6209 can comprise any epitaxial oxide materials described herein, such as any of those with compositions and crystal symmetries shown in FIGS.76A-1 through 76D.
  • Substrate 6200a-i can be any crystalline material compatible with an epitaxial oxide material described herein.
  • substrate 6200a-i can be Al 2 O 3 (any crystal symmetry, and C-plane, R-plane, A-plane or M-plane oriented), Ga 2 O 3 (any crystal symmetry), MgO, LiF, MgAl 2 O 4 , MgGa 2 O 4 , LiGaO 2 , LiAlO 2 , (AlxGa 1-x ) 2 O 3 (any crystal symmetry), MgF2, LaAlO 3 , TiO 2 , or quartz.
  • Buffer layer 6210a-i can be any epitaxial oxide material described herein.
  • buffer 6210a-i can be a material that is the same as the material of the substrate, or the same as a material of a layer to be grown subsequently (e.g., layer 6220a-i).
  • buffer layer 6210a-i comprises multiple layers, a superlattice, and/or a gradient in composition.
  • Superlattices and/or compositional gradients can in some cases be used to reduce the concentration of defects (e.g., dislocations or point defects) in the layer(s) of the semiconductor structure above the buffer layer (i.e., in a direction away from the substrate).
  • a buffer layer 6200a-i with a gradient in composition can be used to reset the lattice constant upon which the subsequent epitaxial oxide layers are formed.
  • a substrate 6200a-i can have a first in-plane lattice constant
  • a buffer layer 6210a-i can have a gradient in composition such that it starts with the first in-plane lattice constant of the substrate and ends with a second in-plane lattice constant
  • a subsequent epitaxial oxide layer 6220a-i (formed on the buffer layer) can have the second in-plane lattice constant.
  • Epitaxial oxide layer 6220a-i can, in some cases, be doped and have an n-type or p-type conductivity.
  • the dopant can be incorporated through co-deposition of an impurity dopant, or an impurity layer can be formed adjacent to epitaxial oxide layer 6220a-i.
  • epitaxial oxide layer 6220a-i is a polar piezoelectric material and is doped n-type or p-type via spontaneous or induced polarization doping.
  • Structure 6201 in FIG.81A can have a subsequent epitaxial oxide layer, fluoride layer, nitride layer, and/or a metal layer formed on top (i.e., away from the substrate 6200a-i) of layer 6220a.
  • a metal layer can be formed on epitaxial oxide layer 6220a to form a Schottky barrier between epitaxial oxide layer 6220a and the metal (e.g., see FIG.55 where the extrema for creating p-type and n-type electrical contacts are shown).
  • Some examples of medium work function metals that can be used to form a Schottky barrier include Al, Ti, Ti-Al alloys, and titanium nitride (TiN).
  • the metal can form an ohmic (or low resistance) contact to epitaxial oxide layer 6220a.
  • high work function metals that can be used in ohmic (or low resistance) contacts to a p-type epitaxial oxide layer (e.g., 6220a) are Ni, Os, Se, Pt, Pd, Ir, Au, W and alloys thereof.
  • low work function materials that can be used in ohmic (or low resistance) contacts to an n-type epitaxial oxide layer 6220a are Ba, Na, Cs, Nd and alloys thereof.
  • Structures 6202-6208 in FIGS.81B-81H further include epitaxial oxide layer 6230b-h. In some cases, epitaxial oxide layer 6230b-h is not intentionally doped.
  • epitaxial oxide layer 6230b-h is doped and has an n-type or p-type conductivity (e.g., as described for layer 6220a-i). In some cases, epitaxial oxide layer 6230b-h is doped and has an opposite conductivity type as epitaxial oxide layer 6220b-h to form a p-n junction. For example, epitaxial oxide layer 6220b-h can have n-type conductivity and epitaxial oxide layer 6230b-h can have p-type conductivity. Alternatively, epitaxial oxide layer 6220b-h can have p-type conductivity and epitaxial oxide layer 6230b-h can have n-type conductivity.
  • a metal layer can be formed on epitaxial oxide layer 6220a to form an ohmic (or low resistance) contact to epitaxial oxide layer 6230b.
  • Some examples of high work function metals that can be used in ohmic (or low resistance) contacts to a p-type epitaxial oxide layer 6230b are Ni, Os, Se, Pt, Pd, Ir, Au, W and alloys thereof.
  • Some examples of low work function materials that can be used in ohmic (or low resistance) contacts to an n-type epitaxial oxide layer 6230b are Ba, Na, Cs, Nd and alloys thereof.
  • Al, Ti, Ti-Al alloys, and titanium nitride (TiN) being common metals can also be used as contacts to an n-type epitaxial oxide layer (e.g., 6220a).
  • the metal contact layer can contain 2 or more layers of metals with different compositions (e.g., a Ti layer and an Al layer).
  • substrate 6200b is MgO or ⁇ -Ga 2 O 3 (i.e., Ga 2 O 3 with an Fd3m space group), or ⁇ -Al 2 O 3 (i.e., Al 2 O 3 with an Fd3m space group).
  • Epitaxial oxide layer 6220b is ⁇ -(Al x Ga 1-x ) 2 O 3 with an Fd3m space group, where 0 ⁇ x ⁇ 1, and has n-type conductivity.
  • Epitaxial oxide layer 6230b is ⁇ -(Al y Ga 1-y ) 2 O 3 with an Fd3m space group, where 0 ⁇ y ⁇ 1, and has p-type conductivity.
  • x and y are the same and the p-n junction is a homojunction, and in other cases x and y are different and the p-n junction is a heterojunction.
  • a metal contact layer e.g., Al, Os or Pt
  • a second contact layer (e.g., containing Ti and/or Al, and or layers of Ti and Al) can be formed making contact to the substrate 6200b and/or epitaxial oxide layer 6220b.
  • a semiconductor structure with metal contacts can be used as a diode in an optoelectronic device, such as an LED, laser or photodetector.
  • one or both of the metal contacts formed can be patterned (e.g., to form one or more exit apertures) to allow light to escape the semiconductor structure.
  • Structure 6203 further includes epitaxial oxide layer 6240c.
  • epitaxial oxide layer 6240c is doped and has an n-type or p-type conductivity (e.g., as described for layer 6220a-i).
  • epitaxial oxide layer 6230c is not intentionally doped, and epitaxial oxide layer 6240c is doped and has an opposite conductivity type as epitaxial oxide layer 6220c to form a p-i-n junction.
  • a metal layer can be formed on epitaxial oxide layer 6240c to form an ohmic (or low resistance) contact to epitaxial oxide layer 6240c and on the substrate 6200c (and/or epitaxial oxide layer 6220c) using appropriate high or low work function metals (as described above).
  • epitaxial oxide layer 6220d has a gradient in composition (as indicated by the double arrow), wherein the composition can change monotonically in either direction, or in both directions, or non-monotonically.
  • epitaxial oxide layer 6220d is doped and has an n-type or p-type conductivity (e.g., as described for layer 6220a-i).
  • epitaxial oxide layer 6230d is doped and has an opposite conductivity type as epitaxial oxide layer 6220d to form a p-n junction.
  • a metal layer can be formed on epitaxial oxide layer 6230d to form an ohmic (or low resistance) contact to epitaxial oxide layer 6230d and on the substrate 6200d (and/or epitaxial oxide layer 6220d) using appropriate high or low work function metals (as described above).
  • epitaxial oxide layer 6230e has a gradient in composition, wherein the composition can change monotonically in either direction, or in both directions (as indicated by the double arrow), or non-monotonically.
  • epitaxial oxide layer 6230e is not intentionally doped, epitaxial oxide layer 6220e has n-type or p-type conductivity, and epitaxial oxide layer 6240e has an opposite conductivity to epitaxial oxide layer 6220e to form a p-i-n junction with a graded i-layer.
  • a metal layer can be formed on epitaxial oxide layer 6240e to form an ohmic (or low resistance) contact to epitaxial oxide layer 6240e and on the substrate 6200e (and/or epitaxial oxide layer 6220e) using appropriate high or low work function metals (as described above).
  • epitaxial oxide layer 6250f has a gradient in composition (as indicated by the double arrow), wherein the composition can change monotonically in either direction, or in both directions, or non-monotonically.
  • epitaxial oxide layer 6250f is doped and has n-type or p-type conductivity
  • epitaxial oxide layer 6240f is doped and has the same conductivity type as epitaxial oxide layer 6250f
  • epitaxial oxide layer 6230f is not intentionally doped
  • epitaxial oxide layer 6240f has an opposite conductivity to epitaxial oxide layer 6220f to form a p-i-n junction with epitaxial oxide layer 6250f acting as a graded contact layer.
  • a metal layer can be formed on epitaxial oxide layer 6250f to form an ohmic (or low resistance) contact to epitaxial oxide layer 6250f and on the substrate 6200f (and/or epitaxial oxide layer 6220f) using appropriate high or low work function metals (as described above).
  • epitaxial oxide layer 6250f comprises a polar and piezoelectric material, and the graded composition of epitaxial oxide layer 6250f improves the properties (e.g., lowers the resistance) of the contact.
  • epitaxial oxide layer 6230g has a quantum well or a superlattice (as indicated by the quantum well schematic in epitaxial oxide layer 6230g), or a multilayer structure with at least one narrower bandgap material layer that is sandwiched between two adjacent wider bandgap layers.
  • epitaxial oxide layer 6230g is not intentionally doped
  • epitaxial oxide layer 6220g has n-type or p-type conductivity
  • epitaxial oxide layer 6240g has an opposite conductivity to epitaxial oxide layer 6220e to form a p-i-n junction with a graded i-layer.
  • the epitaxial oxide layer 6230g can include a superlattice or (a chirp layer with a graded multilayer structure), comprising alternating layers of Al xa Ga 1-xa O y and Al xb Ga 1-xb O y , where xa ⁇ xb, 0 ⁇ xa ⁇ 1 and 0 ⁇ xb ⁇ 1.
  • a metal layer can be formed on epitaxial oxide layer 6240g to form an ohmic (or low resistance) contact to epitaxial oxide layer 6240g and on the substrate 6200g (and/or epitaxial oxide layer 6220g) using appropriate high or low work function metals (as described above).
  • epitaxial oxide layer 6250h has a quantum well or a superlattice, or a multilayer structure with at least one narrower bandgap material layer that is sandwiched between two adjacent wider bandgap layers.
  • epitaxial oxide layer 6250h is a chirp layer with a multilayer structure with alternating narrower bandgap material layers and wider bandgap material layers and a composition variation (e.g., formed by varying the period of the narrower and wider bandgap layers).
  • epitaxial oxide layer 6250h is doped and has n-type or p-type conductivity
  • epitaxial oxide layer 6240h is doped and has the same conductivity type as epitaxial oxide layer 6250h
  • epitaxial oxide layer 6230h is not intentionally doped
  • epitaxial oxide layer 6240h has an opposite conductivity to epitaxial oxide layer 6220h to form a p-i-n junction with epitaxial oxide layer 6250h acting as a graded contact layer.
  • the epitaxial oxide layer 6250h can include a superlattice or (a chirp layer with a graded multilayer structure), comprising alternating layers of Al xa Ga 1-xa O y and Al xb Ga 1-xb O y , where xa ⁇ xb, 0 ⁇ xa ⁇ 1 and 0 ⁇ xb ⁇ 1.
  • a metal layer can be formed on epitaxial oxide layer 6250h to form an ohmic (or low resistance) contact to epitaxial oxide layer 6250h and on the substrate 6200h (and/or epitaxial oxide layer 6220h) using appropriate high or low work function metals (as described above).
  • epitaxial oxide layer 6250h comprises a polar and piezoelectric material, and the graded composition of epitaxial oxide layer 6250h improves the properties (e.g., lowers the resistance) of the contact.
  • epitaxial oxide layer 6220i has a quantum well or a superlattice, or a multilayer structure with at least one narrower bandgap material layer that is sandwiched between two adjacent wider bandgap layers.
  • epitaxial oxide layer 6220i can comprise a digital alloy with alternating layers of epitaxial materials with different properties.
  • Such an epitaxial oxide layer 6220i can have optical and/or electrical properties that would otherwise not be compatible with a given substrate, for example.
  • the epitaxial oxide layer 6220i can include a superlattice or (a chirp layer with a graded multilayer structure), comprising alternating layers of Al xa Ga 1-xa O y and Al xb Ga 1-xb O y , where xa ⁇ xb, 0 ⁇ xa ⁇ 1 and 0 ⁇ xb ⁇ 1.
  • FIGS.81J-81L show examples of semiconductor structures 6201b-6203b comprising epitaxial oxide materials in layers or regions.
  • numbered layers in structures 6201b-6203b are the same as, or similar to, layers in structures 6201-6209.
  • Semiconductor structure 6201b shows an example where there are three adjacent superlattices and/or chirp layers 6220j, 6230j, and 6240j (which are similar to layers 6220i, 6230g and 6250h, respectively, in FIGS.81G-81I) comprising epitaxial oxide materials and forming different possible doping profiles, such as p-i-n, p-n-p, or n-p-n.
  • epitaxial oxide layer(s) 6220j, 6230j and/or 6250j can comprise digital alloy(s) with alternating layers of epitaxial materials with different properties.
  • Such epitaxial oxide layer(s) 6220j, 6230j and/or 6250j comprising digital alloys can have optical and/or electrical properties that would otherwise not be compatible with a given substrate.
  • Semiconductor structure 6202b shows an example where there are two adjacent superlattices and/or chirp layers 6220k and 6230k (which are similar to layers 6220i and 6230g, respectively, in FIGS.81I and 81G) and a layer 6240k all comprising epitaxial oxide materials and forming different possible doping profiles, such as p-i-n, p-n-p, or n-p-n.
  • epitaxial oxide layer(s) 6220k and/or 6230k can comprise digital alloy(s) with alternating layers of epitaxial materials with different properties.
  • Semiconductor structure 6203b shows an example where there are two superlattices and/or chirp layers 6230l and 6240l (which are similar to layers 6230g and 6250h, respectively, in FIGS.81G-81H) and a layer 6220l all comprising epitaxial oxide materials and forming different possible doping profiles, such as p-i-n, p-n-p, or n-p-n.
  • epitaxial oxide layer(s) 6230l and/or 6240l can comprise digital alloy(s) with alternating layers of epitaxial materials with different properties.
  • the buffer layer 6210j-l can comprise a superlattice or chirp layer, and also be adjacent to the other superlattices in some of the structures.
  • any of structures 6201-6209 in FIGS.81A-S81I and structures 6201b-6203b in FIGS.81J-81L can have a subsequent epitaxial oxide layer, fluoride layer, nitride layer, and/or a metal layer formed on top (i.e., away from the substrate 6200a-l) of the topmost layer in the structure (e.g., layer 6230b for structure 6202).
  • any of structures 6201-6209 in FIGS.81A-81I and structures 6201b-6203b in FIGS.81J-81L can further include one or more reflectors that are configured to reflect wavelengths of light that are generated by the semiconductor structure.
  • a reflector can be positioned between the buffer layer and the epitaxial oxide layer(s).
  • a reflector can be a distributed Bragg reflector, formed using the same epitaxial growth technique as the other epitaxial oxide layers in the semiconductor structure.
  • a reflector can be formed on top of the semiconductor structure, opposite the substrate.
  • a reflective metal e.g., Al or Ti/Al
  • FIG.82A is a schematic of an example semiconductor structure 8210 comprising epitaxial oxide layers on a suitable substrate. Alternating layers of epitaxial oxide semiconductors A and B are shown on the substrate.
  • the semiconductor structure in this example has a different epitaxial oxide layer C substituted for an epitaxial oxide layer A.
  • the A layer could comprise Mg(Al,Ga) 2 O 4
  • the B layer could comprise MgO
  • the C layer would be Mg 2 GeO 4 where the substrate could be MgO or MgAl 2 O 4 .
  • FIGS.82B-82I show electron energy (on the y-axis) vs. growth direction (on the x-axis) for embodiments of epitaxial oxide heterostructures comprising layers of dissimilar epitaxial oxide materials.
  • FIG.82B shows an example of an epitaxial oxide heterostructure 8220.
  • the wider bandgap (WBG) material and the narrower bandgap (NBG) material in this example align such that there are heterojunction conduction band and valence band discontinuities, as shown.
  • the band alignment in this example is a type I band alignment, but type II or type III band alignments are possible in other cases.
  • the structure shown in FIG.82C is an example of an epitaxial oxide superlattice 8230 formed by repeating the structure of FIG.82B four times along the growth direction “z.”
  • Other superlattices can contain fewer or more than 4 unit cells, for example, from 2 to 1000, from 10 to 1000, from 2 to 100, or from 10 to 100 unit cells.
  • FIG.82B is the unit cell of the epitaxial oxide superlattice shown in FIG.82C.
  • a short period superlattice (or SPSL) can be formed if the layers of the unit cell of the superlattice are sufficiently thin (e.g., thinner than 10 nm, or 5 nm, or 1 nm).
  • FIG.82D shows an example of an epitaxial oxide double heterostructure 8240 with layers of a WBG material surrounding an NBG material, with type I band alignments. If the NBG material layer in this example were made sufficiently thin (e.g., below 10 nm, or below 5 nm, or below 1 nm) then the structure in FIG.82D would comprise a single quantum well.
  • FIG.82E shows an example of an epitaxial oxide heterostructure 8250 with three different materials, an NBG material and two wider bandgap materials WBG_1 and WBG_2.
  • the epitaxial oxide layers align in a type I band alignment.
  • FIG.82F shows an example semiconductor structure 8260 of a WBG material WBG_2 and an NBG material coupled with a graded layer.
  • the graded layer in this example has a changing bandgap Eg(z) formed by a changing average composition throughout the graded layer.
  • FIG.82G shows an example semiconductor structure 8270 of an NBG material and a WBG material WBG_2 coupled with a graded layer that is similar to the example shown in FIG.82G except that the NBG material occurs before the WBG material (i.e., closer to the substrate) along the growth direction.
  • FIG.82H shows an example semiconductor structure 8280 of a WBG material WBG_2 and an NBG material coupled with a chirp layer.
  • the chirp layer in this example comprises a multilayer structure of epitaxial oxide materials with alternating layers of a WBG epitaxial oxide material layer and an NBG epitaxial oxide material layer, where the thicknesses of the NBG layers and the WBG layers change throughout the chirp layer.
  • the WBG layers could have changing thicknesses and the NBG layers could have the same thickness, or the NBG layers could have changing thicknesses and the WBG layers could have the same thickness throughout the chirp layer.
  • FIG.82I shows an example semiconductor structure 8290 of a WBG material WBG_2 and an NBG material coupled with a chirp layer, where the chirp layer comprises a multilayer structure of epitaxial oxide materials where the NBG layers have changing thicknesses and the WBG layers have the same thickness throughout the chirp layer.
  • Chirp layers like those shown in FIGS.82H-82I can be used to change the average composition of a region of a semiconductor structure while only depositing two different materials compositions. This can be useful, for example, to grade the composition between a pair of materials that prefer particular stoichiometries (e.g., when the materials can be formed with higher quality at certain stoichiometric phases).
  • Digital alloys are multilayer structures that comprise alternating layers of at least two epitaxial materials (e.g., the structure 8230 in FIG.82C). Digital alloys can advantageously be a used to form a layer with properties that are a blend of the properties of the constituent epitaxial materials layers. This can be particularly useful to form a composition of a pair of materials that prefer particular stoichiometries (e.g., when the materials can be formed with higher quality at certain stoichiometric phases).
  • FIGS.83A-83C show plots 8310, 8320, 8330 of electron energy versus growth direction (distance, z) for three examples of different digital alloys, and example wavefunctions for the confined electrons and holes in each.
  • the three digital alloys are made from alternating layers of the same two materials (an NBG material and a WBG material), but with different thicknesses of the NBG layers.
  • the “Thick NBG layer >20 nm” digital alloy of plot 8310 has thick NBG layers (i.e., greater than about 20 nm in thickness) and the least confinement, which leads to a smallest effective bandgap E g SL1 for the digital alloy.
  • the “Thin NBG layer ⁇ 5 nm” digital alloy of plot 8330 has thin NBG layers (i.e., less than about 5 nm in thickness) and the most confinement, which leads to a largest effective bandgap E g SL3 for the digital alloy.
  • the “Mid NBG layer ⁇ 5-20 nm” digital alloy of plot 8320 has NBG layers with intermediate thicknesses (i.e., from about 5 nm to about 20 nm in thickness) and an intermediate amount of confinement, which leads to an effective bandgap E g SL2 for the digital alloy that is between that of E g SL1 and E g SL3 .
  • FIG.84 shows a plot 8400 of effective bandgap versus an average composition (x) of the digital alloys shown in FIGS.83A-83C.
  • the two epitaxial oxide constituent layers of the digital alloy in this example are AO and B 2 O 3 , where A and B are metals (or non-metallic elements) and O is oxygen.
  • material AO corresponds to the NBG material and B 2 O 3 corresponds to the WBG material in the charts shown in FIGS.83A-83C.
  • a digital alloy with alternating layers of AO and B 2 O 3 can have properties (e.g., bandgap, and optical absorption coefficients) that are between those of the constituent materials AO and B 2 O 3 .
  • one or both layers of a digital alloy can be strained, which can further alter the properties of the materials and provide a different set of materials properties for incorporation into the semiconductor structures described herein.
  • AO and B 2 O 3 combinations for digital alloys are MgO/ ⁇ -(AlGaO 3 ) and MgO/ ⁇ - (AlGaO 3 ).
  • Other combinations of epitaxial oxides materials can also be used in digital alloys, such as MgO/Mg 2 GeO 4 , MgGa 2 O 4 /Mg 2 GeO 4 .
  • An example of not being able to form a continuous alloy composition would be a bulk random alloy comprising Mg x Ga 2(1-x) O (3-2x) where 0 ⁇ x ⁇ 1 but an equivalent pseudo-alloy using a SL[MgO/Ga 2 O 3 ] or SL[MgO/MgGa 2 O 4 ] or SL[MgGa 2 O 4 /Ga 2 O 3 ] digital superlattice.
  • Plot 8400 in FIG.84 shows how the effective bandgap will change in the three scenarios, which correspond to the digital alloys with different thicknesses of quantum wells shown in FIGS.83A-83C.
  • the layers of the NBG and WBG materials in the digital alloy are sufficiently thin to cause quantum confinement of carriers, which adjusts (increases) the effective bandgap of the material, as described above.
  • Such a plot illustrates that a digital alloy can be designed with a desired effective bandgap by choosing appropriate thickness of certain epitaxial oxide constituent layers.
  • the bandgaps and lattice constants of the materials shown in FIGS.85-89B were obtained using computer modeling. Geometrical structures were configured into point and space groups with various constituent elements and the structure was energy minimized. Where possible, crystal structures were based on available experimental data. The computer models used DFT and the TBMBJ exchange potential.
  • FIG.85 shows a chart 8500 of some DFT calculated epitaxial oxide material bandgaps (minimum bandgap energies in eV) and in some cases crystal symmetry versus a lattice constant of the epitaxial oxide material.
  • Each of the epitaxial oxide materials shown in chart 8500 is compatible with the other materials in the chart.
  • the lattice constants of the materials in chart 8500 vary from about 2.9 Angstroms to about 3.15 Angstroms, and therefore have less than a 10% lattice constant mismatch with each other.
  • Some materials in the chart 8500 such as ⁇ -(Al 0.3 Ga 0.7 ) 2 O 3 and Ga 4 GeO 8 , have lattice constant mismatch of less than 1%.
  • Ga 4 GeO 8 can be advantageously used in active regions of optoelectronic devices (e.g., as an absorber or emitter material), since it has a direct bandgap.
  • Another example of a set of compatible materials from chart 8500 are wz-AlN (i.e., AlN with a wurtzite crystal symmetry), ⁇ -(Al x Ga 1-x ) 2 O 3 , and ⁇ -Ga 2 O 3 .
  • a heterostructure comprising wz-AlN (i.e., AlN with a wurtzite crystal symmetry) and ⁇ -(Al x Ga 1- x ) 2 O 3 could be formed on a ⁇ -Ga 2 O 3 substrate.
  • a structure could comprise a superlattice of alternating layers of wider bandgap wz-AlN and narrower bandgap ⁇ -(Al x Ga 1- x) 2 O 3 (e.g., with a low Al content of x less than about 0.3, or less than about 0.5).
  • Such superlattices could be beneficial because the wz-AlN would be in compressive strain (compared to the ⁇ -Ga 2 O 3 substrate) and the ⁇ -(Al x Ga 1-x ) 2 O 3 layer would be in tensile strain, and therefore the superlattice could be designed to be strain balanced.
  • some epitaxial oxide materials that are not shown in the chart 8500 are compatible with some of the materials shown in in FIG.85. In other words, the chart 8500 only shows an example subset of compatible materials. For example, MgO(100) (i.e., MgO oriented in the (100) direction) is compatible with ⁇ -(Al x Ga 1-x ) 2 O 3 .
  • FIG.86 shows a schematic 8600 explaining how an epitaxial oxide material 8620 with a monoclinic unit cell can be compatible with an epitaxial oxide material 8610 with a cubic unit cell.
  • MgO(100) is the material 8610 with the cubic crystal symmetry
  • ⁇ -Ga 2 O 3 (100) is the material 8620 with the monoclinic crystal symmetry.
  • Two adjacent unit cells of ⁇ -Ga 2 O 3 (100) have in-plane lattice constants that are approximately square, and approximately match the in-plane lattice constants of MgO(100) when there is a 45° rotation between the two materials.
  • FIG.87 shows a chart 8700 of some DFT calculated epitaxial oxide material bandgaps (minimum bandgap energies in eV) and in some cases crystal symmetry versus a lattice constant of the epitaxial oxide material.
  • some materials in the chart 8700 that can be used as substrates and/or epitaxial oxide layers in semiconductor structures include MgO, LiAlO 2 , LiGaO 2 , Al 2 O 3 (C-, A-, R-, or M-plane oriented), and ⁇ -Ga 2 O 3 (100), ⁇ -Ga 2 O 3 (-201).
  • Chart 8700 also shows that epitaxial LiF has a lattice constant that is compatible with those of different epitaxial oxide materials in the chart.
  • Another example of materials in chart 8700 that are compatible is ⁇ -(Al x Ga 1-x ) 2 O 3 with 0 ⁇ x ⁇ 1 and LiGaO 2 substrates.
  • FIG.88A shows a chart 8805 of some DFT calculated epitaxial oxide material bandgaps (minimum bandgap energies in eV) versus a lattice constant where the epitaxial oxide materials all have cubic crystal symmetry with a Fd3m or Fm3m space group.
  • Each of the epitaxial oxide materials shown in the chart in FIG.88A is compatible with the other materials in the chart.
  • the lattice constants of the materials in the chart vary from about 7.9 Angstroms to about 8.5 Angstroms, and therefore have less than an 8% lattice constant mismatch with each other.
  • the cubic epitaxial oxide materials shown in the chart in FIG.88A have large unit cells (e.g., with lattice constants about 8.2+/-0.3 Angstroms, as shown in the figure) and have the peculiar attribute of being able to accommodate large amounts of elastic strain, such as less than or equal to about 10%, or less than or equal to about 8%, or less than or equal to 5%.
  • some of the epitaxial oxide materials shown in FIG.88A are (Mg x Zn 1-x )(Al y Ga 1-y ) 2 O 4 where 0 ⁇ x ⁇ 1 and 0 ⁇ y ⁇ 1.
  • Examples of epitaxial layers comprising large lattice mismatches while still attaining coherent growth include the digital alloy shown in FIG.139B comprising ⁇ -Ga 2 O 3 and ⁇ -Al 2 O 3 .
  • FIGS.134A and 134B Another example is shown in FIGS.134A and 134B where a superlattice comprising ⁇ - Ga 2 O 3 and MgO is disclosed.
  • Semiconductor structures can be grown with any combination of epitaxial oxide materials in the chart 8805 shown in FIG.88A.
  • two (or more) of these compounds can be combined to form ternary, quaternary, quinary, or compounds with six or more elements, with lattice constants, bandgaps and atomic compositions between those of the compounds shown in the chart.
  • digital alloys can be formed (as described herein) using two or more of the materials shown in the chart to form layers with effective lattice constants, effective bandgaps and effective (or average) compositions between those of the compounds shown in the chart.
  • a semiconductor structure comprising one or more of the epitaxial oxide materials in chart 8805 of FIG.88A can be formed on a substrate such as MgO, MgAl 2 O 4 , MgGa 2 O 4 , LiF and ⁇ -Ga 2 O 3 (100).
  • a substrate such as MgO, MgAl 2 O 4 , MgGa 2 O 4 , LiF and ⁇ -Ga 2 O 3 (100).
  • Any of the semiconductor structures described herein, such as structures 6201-6209 in FIGS.81A-81I and structures 6201b-6203b in FIGS.81J-81L, can be formed from the epitaxial oxide material in chart 8805 shown in FIG.88A.
  • the semiconductor structures with a combination of epitaxial oxide materials in chart 8805 can be incorporated into an optoelectronic device (e.g., a photodetector, an LED or a laser) configured to detect or emit UV light.
  • an optoelectronic device e.g., a photodetector, an LED or a laser
  • Some of the materials in the chart have bandgaps from about 4.5 eV to about 8 eV, which corresponds to a wavelength range of UV light from about 150 nm to about 280 nm, and therefore materials with bandgaps in that range can be used as absorber or emitter materials in UV optoelectronic devices.
  • Example direct band gap bulk oxide materials include LiAlO 2 , Li(Al 0.5 Ga 0.5 )O 2 , LiGaO 2 , ZnAl 2 O 4 , MgGa 2 O 4 , GeMg 2 O 4 , MgO, NiAl 2 O 4 , ⁇ Al 2 O 3 , ⁇ Ga 2 O 3 , ⁇ (Al 0.5 Ga 0.5 ) 2 O 3 , ⁇ Al 2 O 3 , NiAl 2 O 4 , MgNi 2 O 4 , GeNi 2 O 4 , Li 2 O, Al 2 Ge 2 O 7 , Ga 4 Ge 1 O 8 , NiGa 2 O 4 , Ga 3 N 1 O 3 , Ga 3 N 1 O 3 , MgF 2 , NaCl, ErAlO 3 , Zn 2 Ge 1 O 4 , GeLi 4 O 4 , Zn(Al 0.5 Ga 0.5 ) 2 O 4 , Mg(Al 0.5 Ga 0.5 ) 2 O 4
  • Example superlattice structures exhibiting direct band gap transitions include SL[MgAl 2 O 4
  • FIGS.88C-88O include charts with the same DFT calculated data points shown in the chart 8805 in FIG.88A, and additionally with different sets of materials connected using lines bounding a shaded area that are a convex hull of a set of the materials shown on the plot.
  • the sets of materials connected using lines or in the shaded region enclosed by the lines are all compatible with one another. Additionally, two (or more) of the compounds connected using lines or in the shaded region enclosed by the lines can be combined to form other alloy compositions with lattice constants and bandgaps approximately on the lines (or in the region bounded by the lines) shown in each chart, either using a blended alloy, or using a digital alloy (as described herein).
  • the materials in the charts in FIGS.88C-88O that are compatible with one another can be used to form a semiconductor structure which can then be incorporated into a device, such as an optoelectronic device (e.g., a photodetector, LED or laser) detecting or emitting UV light.
  • a semiconductor structure comprising the epitaxial oxide materials connected by lines or in the shaded region enclosed by the lines in the charts in FIGS.88C-88O can be formed on a substrate such as MgO, MgAl 2 O 4 , and MgGa 2 O 4 . In other embodiments, they can be formed on LiF or ⁇ -Ga 2 O 3 (100) substrates.
  • Any of the semiconductor structures described herein, such as structures 6201-6209 in FIGS.81A-81I and structures 6201b-6203b in FIGS.81J-81L, can be formed from the epitaxial oxide materials in the sets of connected lines in the charts in FIGS.88C-88O.
  • the sets of materials connected by lines or in the shaded region enclosed by the lines in the charts in FIGS.88C-88O can be grown using any epitaxial growth technique. In some cases, they are grown using MBE with elemental sources. In some cases, the FIGS.88C- 88O also include a list of elemental MBE sources that can be used to grow structures comprising the sets of materials connected by lines or in the shaded region enclosed by the lines.
  • FIG.88B-1 is a schematic 8810 showing how an epitaxial oxide material with cubic crystal symmetry with a relatively small lattice constant (e.g., approximately equal to 4 Angstroms) can lattice match (or have a small lattice mismatch) with an epitaxial oxide material that has a relatively large lattice constant (e.g., approximately equal to 8 Angstroms).
  • the epitaxial oxide material with a relatively large lattice constant in the example shown in FIG.88B-1 is a spinel material with a composition AB 2 O 4 , where A and B are metals (e.g., Ni, Mg, Zn, Al, and Ga) or semiconductors (e.g., Ge) with a lattice constant about “2a.” Therefore, at the interface between MgO and AB 2 O 4 , four unit cells of MgO and one unit cell of AB 2 O 4 can lattice match (or have a small lattice mismatch) with one another.
  • a and B are metals (e.g., Ni, Mg, Zn, Al, and Ga) or semiconductors (e.g., Ge) with a lattice constant about “2a.” Therefore, at the interface between MgO and AB 2 O 4 , four unit cells of MgO and one unit cell of AB 2 O 4 can lattice match (or have a small lattice mismatch)
  • FIG.88B-2 shows the crystal structure of NiAl 2 O 4 with an Fd3m space group, which is an example of an AB2O 4 material.
  • NiAl 2 O 4 with an Fd3m space group is compatible with the materials shown in the chart in FIG.88A, such as MgO (with four unit cells of MgO as shown in FIG.88B-1).
  • NiAl 2 O 4 with an Fd3m space group can be used as a p-type epitaxial oxide material in a semiconductor structure.
  • FIG.88C shows the chart 8805 in FIG.88A, with lines connecting a sub-set of epitaxial oxide materials, where the shaded area 8811 is a convex hull of the materials shown on the plot.
  • the chart shows epitaxial oxide films having compositions (Ni x Mg y Zn 1-x- y )(Al q Ga 1-q ) 2 O 4 where 0 ⁇ x ⁇ 1, 0 ⁇ y ⁇ 1, 0 ⁇ z ⁇ 1 and 0 ⁇ q ⁇ 1, or (Ni x Mg y Zn 1-x-y )GeO 4 where 0 ⁇ x ⁇ 1, 0 ⁇ y ⁇ 1, and 0 ⁇ z ⁇ 1 connected by lines.
  • MgAl 2 O 4 , Ni 2 GeO 4 , ⁇ -Al 2 O 3 , “2ax NiO” (which is NiO, where the lattice constant plotted is twice the lattice constant of the NiO unit cell), and “2ax MgO” (which is MgO, where the lattice constant plotted is twice the lattice constant of the MgO unit cell), are shown in the chart connected by lines.
  • Other alloys and digital alloys can be formed that are compatible with one another and comprise the elements of the alloys shown in the figure, as described above.
  • the set of MBE sources that can be used to grow the subset of materials bounded by the lines in this figure are those that provide elemental beams of the set of materials ⁇ Al, Ga, Mg, Zn, Ni, Ge and O* ⁇ , where, Al, Ga, Mg, Zn, Ni, and Ge can be provided by solid effusion sources (e.g., from Knudsen cells) and “O*” represents oxygen from an oxygen plasma source.
  • FIG.88D shows the chart 8805 in FIG.88A, with lines connecting a subset of epitaxial oxide materials including MgAl 2 O 4 , ZnAl 2 O 4 , NiAl 2 O 4 , and some alloys thereof.
  • FIG.88E shows the chart 8805 in FIG.88A, with lines connecting a sub-set of epitaxial oxide materials including “2ax MgO,” ⁇ -Ga 2 O 3 , MgAl 2 O 4 , ZnAl 2 O 4 , NiAl 2 O 4 , and some alloys thereof.
  • FIG.88F shows the chart 8805 in FIG.88A, with lines connecting a subset of epitaxial oxide materials including MgAl 2 O 4 , MgGa 2 O 4 , ZnGa 2 O 4 , and some alloys thereof.
  • FIG.88G shows the chart 8805 in FIG.88A, with lines connecting a subset of epitaxial oxide materials including “2ax NiO,” “2ax MgO,” ⁇ -Al 2 O 3 , ⁇ -Ga 2 O 3 , MgAl 2 O 4 , and some alloys thereof.
  • FIG.88H shows the chart 8805 in FIG.88A, with lines connecting a subset of epitaxial oxide materials including ⁇ -Ga 2 O 3 , MgGa 2 O 4 , Mg 2 GeO 4 , and some alloys thereof.
  • FIG.88I shows the chart 8805 in FIG.88A, with lines connecting a subset of epitaxial oxide materials including ⁇ -Ga 2 O 3 , MgGa 2 O 4 , “2ax MgO,” and some alloys thereof.
  • FIG.88J shows the chart 8805 in FIG.88A, with lines connecting a subset of epitaxial oxide materials including ⁇ -Ga 2 O 3 , Mg 2 GeO 4 , “2ax MgO,” and some alloys thereof.
  • alloys and digital alloys can be formed that are compatible with one another and comprise the elements of the alloys shown in the figure, as described above.
  • the set of MBE sources that can be used to grow the subset of materials bounded by the lines and forming the shaded area 8845 in this figure are those that provide elemental beams of the set of materials ⁇ Ga, Mg, Ge and O ⁇ .
  • FIG.88K shows the chart 8805 in FIG.88A, with lines connecting a subset of epitaxial oxide materials including Ni 2 GeO 4 , Mg2GeO 4 , (Mg 0.5 Zn 0.5 ) 2 GeO 4 , Zn(Al 0.5 Ga 0.5 ) 2 O 4 , Mg(Al 0.5 Ga 0.5 ) 2 O 4 , “2ax MgO,” and some alloys thereof.
  • Other alloys and digital alloys can be formed that are compatible with one another and comprise the elements of the alloys shown in the figure, as described above.
  • FIG.88L shows the chart 8805 in FIG.88A, with lines connecting a subset of epitaxial oxide materials including ⁇ -Ga 2 O 3 , ⁇ -Al 2 O 3 , MgAl 2 O 4 , ZnAl 2 O 4 , and some alloys thereof.
  • Other alloys and digital alloys can be formed that are compatible with one another and comprise the elements of the alloys shown in the figure, as described above.
  • FIGS.88M and 88N show the chart 8805 in FIG.88A, with lines connecting a subset of epitaxial oxide materials including ⁇ -Ga 2 O 3 , ⁇ -Al 2 O 3 , MgAl 2 O 4 , ZnAl 2 O 4 , “2ax MgO,” and some alloys thereof.
  • the bulk alloy ⁇ -(Al x Ga 1-x ) 2 O 3 is shown along one of the lines in FIG. 88M.
  • the digital alloy compositions comprising layers of (MgO) z ((Al x Ga 1-x ) 2 O 3 ) 1-z materials is shown in the shaded area 8860 bounded by the lines in FIG.88N.
  • Other alloys and digital alloys can be formed that are compatible with one another and comprise the elements of the alloys shown in the figure, as described above.
  • the set of MBE sources that can be used to grow the subset of materials bounded by the lines in this figure are those that provide elemental beams of the set of materials ⁇ Ga, Al, Mg, Zn and O ⁇ .
  • FIG.88O shows the chart 8805 in FIG.88A, with lines connecting a subset of epitaxial oxide materials including MgGa 2 O 4 , ZnGa 2 O 4 , (Mg 0.5 Zn 0.5 )Ga 2 O 4 , (Mg 0.5 Ni 0.5 )Ga 2 O 4 , (Zn 0.5 Ni 0.5 )Ga 2 O 4 , “2ax NiO,” “2ax MgO,” and some alloys thereof.
  • Other alloys and digital alloys can be formed that are compatible with one another and comprise the elements of the alloys shown in the figure, as described above.
  • FIG.89A shows a chart 8900 of some DFT calculated epitaxial oxide material bandgaps (minimum bandgap energies in eV) versus lattice constant, with lattice constants from approximately 4.5 Angstroms to 5.3 Angstroms.
  • the epitaxial oxide materials in the chart have non-cubic crystal symmetries, such as hexagonal and orthorhombic crystal symmetries.
  • the epitaxial oxide materials in the chart in FIG.89A include ⁇ -(AlxGa 1-x ) 2 O 3 where 0 ⁇ x ⁇ 1; and ⁇ -(Al x Ga 1-x ) 2 O 3 where 0 ⁇ x ⁇ 1, Li 2 O, and Li(Al x Ga 1-x )O 2 .
  • Each epitaxial oxide material in the chart on FIG.89A is compatible with one another.
  • the set of materials connected with lines in FIG.89A is compatible with one another, and includes LiAlO 2 and LiGaO 2 , and Li(Al x Ga 1-x )O 2 with Pna21 space groups.
  • two (or more) of these compounds can be combined to form ternary, quaternary, or quinary compounds, or compounds with six or more elements, having lattice constants, bandgaps and atomic compositions between those of the compounds shown in the chart.
  • digital alloys can be formed (as described herein) using two or more of the materials shown in the chart to form layers with in-plane lattice constants, effective bandgaps and effective (or average) compositions between those of the compounds shown in the chart.
  • a semiconductor structure comprising epitaxial oxide materials shown in FIG.89A can be formed on a substrate such as LiGaO 2 (001), LiAlO 2 (001), AlN(110), SiO 2 (100) and crystalline metallic Al(111).
  • FIG.89B shows a table 8950 of DFT calculated Li(Al x Ga 1-x )O 2 film properties (space group (“SG”), lattice constants (“a” and “b”) in Angstroms, and percentage lattice mismatch (“% ⁇ a” and “% ⁇ b”) between a LiGaO 2 film and the possible substrates (“sub”) listed.
  • LiAlO 2 has a tetragonal crystal symmetry (and a P42121 space group), while LiGaO 2 has an orthorhombic crystal symmetry (and a Pna21 space group).
  • an alloy Li(Al x Ga 1-x )O 2 can also be formed that has a direct bandgap. Such an alloy has a phase change from a P42121 to a Pna21 space group at Al fraction x above about 0.5. This phase change can lead to less desirable mixed crystal growth when x is about 0.5.
  • LiGaO 2 bandgap of 6.2 eV corresponds to a wavelength of light of about 200 nm, which is in the UVC band, and the wider bandgap of LiAlO 2 can have a low absorption coefficient for light with a wavelength of about 200 nm. Therefore, LiGaO 2 , LiAlO 2 , and/or some compositions of Li(Al x Ga 1-x )O 2 can be used to form optoelectronic devices that absorb or emit UV light, as described herein. [1070] Li(Al x Ga 1-x )O 2 epitaxial oxide films can be formed by an epitaxial growth technique such as molecular beam epitaxy, where a solid source of Li 2 O is sublimed.
  • the Ga and Al sources can be solid elemental sources and the O source can be a plasma source using gaseous oxygen, as described herein.
  • LiGaO 2 (with a Pna21 space group) and low Al content Li(Al x Ga 1- x )O 2 can be doped via polarization doping and can be used in chirp layers adjacent to metal contacts.
  • FIGS.90A-90ZZ show DFT calculated energy-crystal momentum (E-k) dispersion plots in the vicinity of the Brillouin-zone center for some of the epitaxial oxide materials described herein, e.g., those shown in the bandgap energy versus lattice constant charts in FIGS.88A and 88C-88N.
  • the plots in FIGS.90A-90ZZ were created using DFT modeling with a TBMBJ exchange potential.
  • the name, composition, and space group (“SG”) of the oxide material that was modeled is shown in each of the FIGS.90A-90ZZ.
  • the minimum bandgap is also shown.
  • FIG.90A shows a calculated energy-crystal momentum (E-k) dispersion plots in the vicinity of the Brillouin-zone center for LiAlO 2 with a P41212 space group.
  • FIG.90B shows a calculated energy-crystal momentum (E-k) dispersion plots in the vicinity of the Brillouin-zone center for Li(Al 0.5 Ga 0.5 )O 2 with a Pna21 space group.
  • FIG.90C shows a calculated energy-crystal momentum (E-k) dispersion plots in the vicinity of the Brillouin-zone center for LiGaO 2 with a Pna21 space group.
  • FIG.90D shows a calculated energy-crystal momentum (E-k) dispersion plots in the vicinity of the Brillouin-zone center for ZnAl 2 O 4 with a Fd3m space group.
  • FIG.90E shows a calculated energy-crystal momentum (E-k) dispersion plots in the vicinity of the Brillouin-zone center for ZnGa 2 O 4 with a Fd3m space group.
  • FIG.90F shows a calculated energy-crystal momentum (E-k) dispersion plots in the vicinity of the Brillouin-zone center for MgGa 2 O 4 with a Fd3m space group.
  • FIG.90G shows a calculated energy-crystal momentum (E-k) dispersion plots in the vicinity of the Brillouin-zone center for GeMg 2 O 4 with a Fd3m space group.
  • FIG.90H shows a calculated energy-crystal momentum (E-k) dispersion plots in the vicinity of the Brillouin-zone center for NiO with a Fm3m space group.
  • FIG.90I shows a calculated energy-crystal momentum (E-k) dispersion plots in the vicinity of the Brillouin-zone center for MgO with a Fm3m space group.
  • FIG.90J shows a calculated energy-crystal momentum (E-k) dispersion plots in the vicinity of the Brillouin-zone center for SiO 2 with a P3221 space group.
  • FIG.90K shows a calculated energy-crystal momentum (E-k) dispersion plots in the vicinity of the Brillouin-zone center for NiAl 2 O 4 with a Imma space group.
  • FIG.90L shows a calculated energy-crystal momentum (E-k) dispersion plots in the vicinity of the Brillouin-zone center for ⁇ Al 2 O 3 with a R3c space group.
  • FIG.90M shows a calculated energy-crystal momentum (E-k) dispersion plots in the vicinity of the Brillouin-zone center for ⁇ ( Al 0.75 Ga 0.25 ) 2 O 3 with a R3c space group.
  • FIG.90N shows a calculated energy-crystal momentum (E-k) dispersion plots in the vicinity of the Brillouin-zone center for ⁇ (Al 0.5 Ga 0.5 ) 2 O 3 with a R3c space group.
  • FIG.90O shows a calculated energy-crystal momentum (E-k) dispersion plots in the vicinity of the Brillouin-zone center for ⁇ (Al 0.25 Ga 0.75 ) 2 O 3 with a R3c space group.
  • FIG.90P shows a calculated energy-crystal momentum (E-k) dispersion plots in the vicinity of the Brillouin-zone center for ⁇ Ga 2 O 3 with a R3c space group.
  • FIG.90Q shows a calculated energy-crystal momentum (E-k) dispersion plots in the vicinity of the Brillouin-zone center for ⁇ Ga 2 O 3 with a Pna21 space group.
  • FIG.90R shows a calculated energy-crystal momentum (E-k) dispersion plots in the vicinity of the Brillouin-zone center for ⁇ ( Al 0.5 Ga 0.5 ) 2 O 3 with a Pna21 space group.
  • FIG.90S shows a calculated energy-crystal momentum (E-k) dispersion plots in the vicinity of the Brillouin-zone center for ⁇ Al 2 O 3 with a Pna21 space group.
  • FIG.90T shows a calculated energy-crystal momentum (E-k) dispersion plots in the vicinity of the Brillouin-zone center for ⁇ Ga 2 O 3 with a Fd3m space group.
  • FIG.90U shows a calculated energy-crystal momentum (E-k) dispersion plots in the vicinity of the Brillouin-zone center for MgAl 2 O 4 with a Fd3m space group.
  • FIG.90V shows a calculated energy-crystal momentum (E-k) dispersion plots in the vicinity of the Brillouin-zone center for NiAl 2 O 4 with a Fd3m space group.
  • FIG.90W shows a calculated energy-crystal momentum (E-k) dispersion plots in the vicinity of the Brillouin-zone center for MgNi 2 O 4 with a Fd3m space group.
  • FIG.90X shows a calculated energy-crystal momentum (E-k) dispersion plot in the vicinity of the Brillouin-zone center for GeNi 2 O 4 with a Fd3m space group.
  • FIG.90Y shows a calculated energy-crystal momentum (E-k) dispersion plot in the vicinity of the Brillouin-zone center for Li 2 O with a Fm3m space group.
  • FIG.90Z shows a calculated energy-crystal momentum (E-k) dispersion plot in the vicinity of the Brillouin-zone center for Al 2 Ge 2 O 7 with a C2c space group.
  • FIG.90AA shows a calculated energy-crystal momentum (E-k) dispersion plot in the vicinity of the Brillouin-zone center for Ga 4 Ge 1 O 8 with a C2m space group.
  • FIG.90BB shows a calculated energy-crystal momentum (E-k) dispersion plot in the vicinity of the Brillouin-zone center for NiGa 2 O 4 with a Fd3m space group.
  • FIG.90CC shows a calculated energy-crystal momentum (E-k) dispersion plot in the vicinity of the Brillouin-zone center for Ga 3 N 1 O 3 with a R3m space group.
  • FIG.90DD shows a calculated energy-crystal momentum (E-k) dispersion plot in the vicinity of the Brillouin-zone center for Ga 3 N 1 O 3 with a C2m space group.
  • FIG.90EE shows a calculated energy-crystal momentum (E-k) dispersion plot in the vicinity of the Brillouin-zone center for MgF 2 with a P42mnm space group.
  • FIG.90FF shows a calculated energy-crystal momentum (E-k) dispersion plot in the vicinity of the Brillouin-zone center for NaCl with a Fm3m space group.
  • FIG.90GG shows a calculated energy-crystal momentum (E-k) dispersion plot in the vicinity of the Brillouin-zone center for Mg 0.75 Zn 0.25 O with a Fd3m space group.
  • FIG.90HH shows a calculated energy-crystal momentum (E-k) dispersion plot in the vicinity of the Brillouin-zone center for ErAlO 3 with a P63mcm space group.
  • FIG.90II shows a calculated energy-crystal momentum (E-k) dispersion plot in the vicinity of the Brillouin-zone center for Zn 2 Ge 1 O 4 with a R3 space group.
  • FIG.90JJ shows a calculated energy-crystal momentum (E-k) dispersion plot in the vicinity of the Brillouin-zone center for LiNi 2 O 4 with a P4332 space group.
  • FIG.90KK shows a calculated energy-crystal momentum (E-k) dispersion plot in the vicinity of the Brillouin-zone center for GeLi 4 O 4 with a Cmcm space group.
  • FIG.90LL shows a calculated energy-crystal momentum (E-k) dispersion plot in the vicinity of the Brillouin-zone center for GeLi 2 O 3 with a Cmc21 space group.
  • FIG.90MM shows a calculated energy-crystal momentum (E-k) dispersion plot in the vicinity of the Brillouin-zone center for Zn ( Al 0.5 Ga 0.5 ) 2 O 4 with a Fd3m space group.
  • FIG.90NN shows a calculated energy-crystal momentum (E-k) dispersion plot in the vicinity of the Brillouin-zone center for Mg ( Al 0.5 Ga 0.5 ) 2 O 4 with a Fd3m space group.
  • FIG.90OO shows a calculated energy-crystal momentum (E-k) dispersion plot in the vicinity of the Brillouin-zone center for (Mg 0.5 Zn 0.5 )Al 2 O 4 with a Fd3m space group.
  • FIG.90PP shows a calculated energy-crystal momentum (E-k) dispersion plot in the vicinity of the Brillouin-zone center for (Mg 0.5 Ni 0.5 )Al 2 O 4 with a Fd3m space group.
  • FIG.90QQ shows a calculated energy-crystal momentum (E-k) dispersion plot in the vicinity of the Brillouin-zone center for ⁇ ( Al 0 Ga 1.0 ) 2 O 3 (i.e., ⁇ Ga 2 O 3 ) with a C2m space group.
  • FIG.90RR shows a calculated energy-crystal momentum (E-k) dispersion plot in the vicinity of the Brillouin-zone center for ⁇ (Al 0.125 Ga 0.875 ) 2 O 3 with a C2m space group.
  • FIG.90SS shows a calculated energy-crystal momentum (E-k) dispersion plot in the vicinity of the Brillouin-zone center for ⁇ (Al 0.25 Ga 0.75 ) 2 O 3 with a C2m space group.
  • FIG.90TT shows a calculated energy-crystal momentum (E-k) dispersion plot in the vicinity of the Brillouin-zone center for ⁇ (Al 0.375 Ga 0.625 ) 2 O 3 with a C2m space group.
  • FIG.90UU shows a calculated energy-crystal momentum (E-k) dispersion plot in the vicinity of the Brillouin-zone center for ⁇ ( Al 0.5 Ga 0.5 ) 2 O 3 with a C2m space group.
  • FIG.90VV shows a calculated energy-crystal momentum (E-k) dispersion plot in the vicinity of the Brillouin-zone center for ⁇ (Al 1.0 Ga 0.0 ) 2 O 3 (i.e., ⁇ -Aluminum Oxide) with a C2m space group.
  • FIG.90WW shows a calculated energy-crystal momentum (E-k) dispersion plot in the vicinity of the Brillouin-zone center for GeO 2 with a P42mnm space group.
  • FIG.90XX shows a calculated energy-crystal momentum (E-k) dispersion plot in the vicinity of the Brillouin-zone center for Ge ( Mg 0.5 Zn 0.5 ) 2 O 4 with a Fd3m space group.
  • FIG.90YY shows a calculated energy-crystal momentum (E-k) dispersion plot in the vicinity of the Brillouin-zone center for ( Ni 0.5 Zn 0.5 ) Al 2 O 4 with a Fd3m space group.
  • FIG.90ZZ shows a calculated energy-crystal momentum (E-k) dispersion plot in the vicinity of the Brillouin-zone center for LiF with a Fm3m space group.
  • FIG.91 shows an atomic crystal structure 9100 of a heterojunction between MgGa 2 O 4 and MgAl 2 O 4 epitaxial oxide material. The interface between the two materials is coherent, and the atoms line up at the interface such that there are no dislocations (i.e., missing planes of atoms) in the crystal structures of the materials on both sides of the interface. The two unit cells shown in the figure can be repeated in the “c” direction to form a superlattice.
  • FIGS.92A-92G show DFT calculated energy-crystal momentum (E-k) dispersion plots in the vicinity of the Brillouin-zone center for superlattice structures. The constituent compounds forming the unit cells of the superlattice are shown on each chart, along with the space group (“SG”), and the minimum effective bandgap of the superlattice.
  • FIG.92A shows a calculated energy-crystal momentum (E-k) dispersion plot in the vicinity of the Brillouin-zone center for a superlattice comprising [MgAl 2 O 4 ] 1
  • FIG.92B shows a calculated energy-crystal momentum (E-k) dispersion plot in the vicinity of the Brillouin-zone center for a superlattice comprising [MgAl 2 O 4 ] 1
  • FIG.92C shows a calculated energy-crystal momentum (E-k) dispersion plot in the vicinity of the Brillouin-zone center for a superlattice comprising [MgAl 2 O 4 ] 1
  • FIG.92D shows a calculated energy-crystal momentum (E-k) dispersion plot in the vicinity of the Brillouin-zone center for a superlattice comprising [MgGa 2 O 4 ] 1
  • FIG.92E shows a calculated energy-crystal momentum (E-k) dispersion plot in the vicinity of the Brillouin-zone center for a superlattice comprising [ ⁇ Al 2 O 3 ] 2
  • FIG.92F shows a calculated energy-crystal momentum (E-k) dispersion plot in the vicinity of the Brillouin-zone center for a superlattice comprising [ ⁇ Al 2 O 3 ] 1
  • FIG.92G shows a calculated energy-crystal momentum (E-k) dispersion plot in the vicinity of the Brillouin-zone center for a superlattice comprising [GeMg 2 O 4 ] 1
  • FIG.93 shows an atomic crystal structure 9300 of ⁇ -(Al 0.5 Ga 0.5 ) 2 O 3 with a space group C2m.
  • the crystal structure can be calculated using DFT modeling with a TBMBJ exchange potential.
  • FIG.94 shows a DFT calculated energy-crystal momentum (E-k) dispersion plot in the vicinity of the Brillouin-zone center for a superlattice with ⁇ -(Al 0.5 Ga 0.5 ) 2 O 3 and of ⁇ - Ga 2 O 3 .
  • the chart shows that the superlattice enables zone folding of k-vectors in the valence band.
  • FIGS.95A and 95B show schematics of a ⁇ -Ga 2 O 3 (100) film coherently (and pseudomorphically) strained to an MgO(100) substrate.
  • FIG.95A shows the in-plane unit cell alignment (in plan view, along the “b” and “c” direction), and
  • FIG.95B shows the unit cell alignment along the growth direction (“a”). The lattice of the film is rotated by 45° with respect to that of the substrate.
  • FIG.96 shows a DFT calculated energy-crystal momentum (E-k) dispersion plot in the vicinity of the Brillouin-zone center for ⁇ -Ga 2 O 3 pseudomorphically strained to the lattice of MgO rotated by 45°.
  • E-k energy-crystal momentum
  • FIG.97 shows a schematic of a superlattice 9700 formed from alternating layers (with one or more unit cells in each layer) of ⁇ -Ga 2 O 3 and MgO, where the ⁇ -Ga 2 O 3 layers are pseudomorphically strained to the lattice of MgO rotated by 45°.
  • FIG.98A shows a table 9805 of crystal structure properties of example epitaxial film materials 4610 and substrates that are compatible with Mg 2 GeO 4 .
  • FIG.98B is a table of compatibility of ⁇ -Ga 2 O 3 with various heterostructure materials, including degree of mismatch between in-plane lattice parameters.
  • FIG.99 is a table 9900 describing a selection of possible oxide material compositions comprising constituent elements (Mg, Zn, Al, Ga, O).
  • the oxide materials can be formed into cubic crystal symmetry structures.
  • the cubic crystal symmetry structures can be formed via epitaxial growth processes to form layered single crystal structures that are advantageously structurally matched enabling low defect density formation at the interfaces.
  • FIG.100 shows a schematic of an epitaxial layered structure 10000 formed from at least two distinct materials further selected from categories of Oxide_type_A and Oxide_type_B from table 9900 shown in FIG.99.
  • Multilayered structures that are substantially lattice matched or coincidence lattice matched enable heterojunction and superlattice bandgap engineered structure to be formed on a substrate.
  • a plurality of oxide material combinations can be formed.
  • the epitaxial structure can be used for application to an electronic or optoelectronic device with reference to the energy band structure specific to each material composition or combination thereof.
  • FIG.101 shows the single crystal orientation of an ultrawide bandgap cubic oxide composition 10100 comprising ZnGa 2 O 4 (ZGO) epitaxially deposited and formed on a smaller bandgap wurtzite type crystal surface of SiC-4H.
  • the ZnGa 2 O 4 (111) film is formed along a growth direction with preferred crystal orientation with respect to the initial growth surface presented by a prepared silicon-face or carbon-face of SiC-4H single crystal substrate.
  • the ZnGa 2 O 4 (111)/SiC(0001) structure demonstrates the ability of a large lattice constant cubic oxide to achieve a stable epilayer on a hexagonal lattice template presented by the Si or C atom sublattice of SiC-4H.
  • the thickness of the ZGO layer can vary from several nanometers to about a micron.
  • This structure represents a heterostructure with a bandgap discontinuity of about SiC(3.2eV) / ZGO(5.77eV) which is advantageous for electronic carrier confinement or dielectric layer formation in electronic switch applications.
  • FIG.102 shows the atomic configuration of the ZnGa 2 O 4 (111) surface 10200 represented by the shaded triangular area.
  • the exposed Zn atoms in the selected (111) plane present a Zn-Zn two-dimensional interatomic lattice that is represented by the dashed triangle.
  • FIGS.103A and 103B show the experimental XRD and XRF data of a ZGO(111)-oriented film to be formed epitaxially on a prepared SiC-4H(0001) surface.
  • the narrow FWHM of the oriented ZGO peaks in the plot of FIG.103A show high structural quality phase pure cubic ZGO film.
  • FIG 103B shows the grazing incidence of the ZGO film having high uniformity thickness attained by the single crystal ZGO structure.
  • FIG.104A shows a schematic diagram of a large lattice constant cubic oxide 10400 represented by ZnGa 2 O 4 formed on a smaller cubic lattice constant oxide represented by MgO.
  • a ZnGa 2 O 4 (100) oriented epitaxial film can be formed along a growth direction on a MgO(100) surface or epilayer. In practice it was found to be advantageous to prepare and terminate an oxide substrate surface with oxygen atoms forming a preferred first bonding lattice comprising O-atoms (O-terminated surface).
  • FIG.104B shows the crystal structures 10500 of the epitaxial growth surfaces presented for the structure of FIG.104A comprising the upper and lower atomic structures of MgO(100) and ZnGa 2 O 4 (100), respectively.
  • the upper crystal structure in the figure shows the atomic arrangement of Mg and O atoms comprising the Fm3m crystal of MgO.
  • the lower crystal structure in the figure represents the atomic arrangement of the Zn, Ga and O atoms forming a Fd3m crystal symmetry group.
  • a property of the ultrawide bandgap (UWBG) cubic oxides, represented by ZnGa 2 O 4 is the ability for the unit cell a ZGO to match closely to twice the MgO lattice. That is, This example shows the general observation that large lattice constant cubic oxides can match to smaller cubic oxides and vice versa.
  • FIGS.105A and 105B show the experimental XRD data of a high structural quality epilayer of ZnGa 2 O 4 film deposited on a MgO substrate.
  • FIG.105A shows the distinct and small FWHM peaks that represent the substrate and ZGO film. The cube-on-cube epitaxy is clearly evident and shows phase pure film formation.
  • the XRD plot in FIG.105B shows a higher resolution scan of the substrate and ZGO(004) diffracted peak along with high frequency thickness oscillations indicative of coherent and low defect density growth.
  • FIG.106 shows the experimental XRD data of a high structural quality epilayer of an NiO film deposited on a MgO substrate.
  • NiAl 2 O 4 with a Fd3m space group (shown in FIG.88B-2) is compatible with NiO and MgO substrates, and can form heterostructures with these materials as well.
  • NiAl 2 O 4 with an Fd3m space group can be used as a p-type epitaxial oxide material in a semiconductor structure.
  • FIG.107 shows a schematic diagram of a large lattice constant cubic oxide 10700 represented by MgGa 2 O 4 formed on a smaller cubic lattice constant oxide represented by MgO.
  • a MgGa 2 O 4 (100) oriented epitaxial film can be formed along a growth direction on a MgO(100) surface or epilayer.
  • the MgGa 2 O 4 film thickness can range from 0 ⁇ L MgGaO ⁇ 1000 nm due to the advantageous lattice matching.
  • the incident sticking coefficient for Mg is substantially higher than Zn, however, the Mg Arrhenius behavior limits the adsorbed surface concentration of Mg and is primarily governed by the growth temperature.
  • the surface adsorption of Ga is governed by both surface kinematics and suboxide formation. It was also found that the presence of Mg dramatically reduces suboxide formation and stabilizes a new crystal structure form, namely, MgGa 2 O 4 (refer the formation energy ‘see-saw’ diagram).
  • FIGS.108A and 108B show the experimental XRD data for the formation of an ultrawide bandgap cubic MgGa 2 O 4 (100)-oriented epilayer on a prepared MgO(100) substrate.
  • FIG.108A shows the high-resolution diffraction reflexes of the cubic substrate and the MgGaO film.
  • the film thickness was L MgGaO ⁇ 50 nm and the growth conditions where such that an incident Mg:Ga flux ratio in excess of 1:3 was used at a growth temperature of T g ⁇ 450 °C. The growth condition may be improved further.
  • FIG.109 shows a further epilayer structure 10900 comprising two UWBG large lattice constant cubic oxide layers integrated into a dissimilar bandgap oxide structure deposited on a large lattice constant cubic MgAl 2 O 4 (100)-oriented substrate.
  • the ZnAl 2 O 4 and ZnGa 2 O 4 epilayers are formed sequentially by switching incident fluxes of elemental Al and Ga in the presence of Zn and active oxygen.
  • FIGS.110A and 110B show the experimental XRD data of MgO, ZnAl 2 O 4 and ZnGa 2 O 4 cubic oxide films on a MgAl 2 O 4 (100)-oriented substrate.
  • FIG.109 shows the epitaxial structure of FIG.109 comprising the epilayer sequence of ZnAl 2 O 4 and ZnGa 2 O 4 on the MgAl 2 O 4 (100) substrate.
  • the crystal quality of the substrate is presently limited and possesses slightly misoriented mosaic regions within the bulk.
  • the XRD plot of FIG.110B shows a thick epitaxial MgO(100) film representing the ability of small cubic oxide to register with a large cubic oxide space group. Small thickness oscillations superimposed upon the MgAl 2 O 4 peak indicate a coherently strained thin interface film of MgO, followed by a relaxed MgO film which exceeds the elastic critical layer thickness of ⁇ 100nm.
  • FIG.111 shows the surface atom configurations 11100 of a cubic LiF(111)- oriented surface and a cubic ⁇ Ga 2 O 3 (111)-oriented surface. Both LiF and ⁇ Ga 2 O 3 possess cubic space groups of Fm3m and a defective Fd3m, respectively.
  • LiF(100) oriented substrates are ideal and preferable, LiF(111)-oriented substrates are commercially available and can be used to demonstrate the utility of integrating LiF with UWBG oxides.
  • the lattice constants in the respective (111)-planes show excellent matching conditions such that ⁇ ⁇ ⁇ ⁇ 2 ⁇ 3 ( 111 ) ⁇ 2 ⁇ a LiF (111).
  • a similar matching condition for is also possible and can be applicable to the UWBG materials disclosed herein.
  • LiF is a unique electron affinity material and can be further epitaxially deposited as a functional layer and utilized to modify the surface potential and electron affinity of UWBG interfaces.
  • FIGS.112A and 112B show the experimental XRD data of gallium oxide showing the crystal symmetry group of the epilayer controlled by the underlying substrate or seed surface symmetry.
  • the XRD plot of FIG.112A shows a cubic ⁇ Ga 2 O 3 epilayer formed on a LiF(111) surface
  • the XRD plot of FIG.112B shows a ⁇ Ga 2 O 3 epilayer that is preferentially formed on a LiAlO 2 (100)-oriented surface.
  • the deposition temperature and substrate surface symmetry and lattice constant play a fundamental role in selecting the lowest energy formation type and orientation of cubic oxides.
  • FIG.113 shows the epitaxial structure 11300 of Ga 2 O 3 formed on cubic MgO substrate. The advantageous lattice matching of cubic ⁇ Ga 2 O 3 to the MgO(100) is found to occur for a critical layer thickness L ⁇ GaO ⁇ 10-50 nm.
  • FIGS.114A and 114B show respectively the experimental XRD data of low growth temperature (LT) and high growth temperature (HT) Ga 2 O 3 film formation on prepared MgO(100)-oriented substrates.
  • FIG.114A shows selective growth of cubic ⁇ Ga 2 O 3 at low temperature ( ⁇ 600 °C) and the XRD plot of FIG.114B shows growth ⁇ Ga 2 O 3 at high temperature (600-700 °C).
  • the excellent epilayer FWHM and film thickness fringes are indicative of high structural quality. This attribute is used to form complex heterostructures disclosed herein.
  • FIG.115 shows the complex epilayer structure 11500 of dissimilar cubic oxide layers integrated into a superlattice or multi-heterojunction structure. Shown are MgGa 2 O 4 and ZnGa 2 O 4 layers forming a superlattice having a repeating period ⁇ with N repetitions, grown along a growth direction.
  • a MgO(100)-oriented substrate enables the lattice matching as described in FIGS 105A, 105B and 108A, 108B.
  • the layers comprising the SL are thin such that each of L MgGaO and L ZnGaO are less that 10-20x unit cells in thickness (e.g., less than about 150 nm)
  • the electronic bandgap of the SL pseudoalloy can be governed by the quantized energy levels within the lower bandgap material, namely ZnGa 2 O 4 . It is further disclosed that such SL structures can transform the indirect bandgap of bulk ZnGa 2 O 4 into a SL having direct bandgap E-k response. This is advantageous for optically emissive device active regions.
  • FIGS.116A and 116B show the experimental XRD data of SL structures formed using MgGa 2 O 4 and ZnGa 2 O 4 layers deposited on MgO(100) substrate but having different periods.
  • the extremely sharp FWHM SL peaks SL i demonstrate the high structural quality.
  • FIG.116B shows the same structure as FIG.116A but with a period twice as large, as evidenced by the smaller satellite peak spacing. In both cases the structural quality is exceptionally good as shown by the Pendellosung thickness fringes and narrow FWHM for higher order satellite peaks.
  • FIGS.117A and 117B show the experimentally determined grazing incidence XRR data evidencing the extremely high crystal structure quality of the SL[MgGa 2 O 4 / ZnGa 2 O 4 ] // MgO(100) structures shown in FIGS.116A and 116B, respectively. The large number of satellite peaks SL i , thickness fringes, and the narrow FWHM are clearly shown.
  • FIG.118 shows the complex epilayer structure 11800 of dissimilar cubic oxide layers integrated into a superlattice or multi-heterojunction structure in another example. Shown are large lattice constant cubic MgAl 2 O 4 and small lattice constant MgO layers forming a superlattice having a repeating period ⁇ with N repetitions, grown along a growth direction.
  • a MgAl 2 O 4 (100)-oriented substrate enables the lattice matching to MgAl 2 O 4 and ‘2x’ lattice matching for MgO.
  • a digital pseudo-alloy can be formed having an effective composition
  • the electronic bandgap of the pseudoalloy can be governed by the quantized energy levels within the lower bandgap material, namely MgO. It is further disclosed that such SL structures can engineer direct quantized energy transitions between the conduction and valence band ranging from about 7.69 eV to 8.61 eV.
  • FIGS.119A and 119B show the experimental XRD and XRR data of the epitaxial SL structure described in FIG.118 forming a SL[MgAl 2 O 4 / MgO ] // MgAl 2 O 4 (100).
  • the XRD plot of FIG.119A shows the well resolved superlattice peaks indicative of relatively good crystal structure achieved. Improvement in the crystal quality can be refined by optimized growth conditions.
  • the lower grazing incidence XRR data of FIG.119B shows well resolved satellite peaks indicative of high-quality single crystal films.
  • FIG.120 shows the complex epilayer structure 12000 of dissimilar cubic oxide layers integrated into a superlattice or multi-heterojunction structure in a further example. Shown are large lattice constant cubic GeMg 2 O 4 and small lattice constant MgO layers forming a superlattice having a repeating period ⁇ with N repetitions, grown along a growth direction.
  • a MgO(100)-oriented substrate enables the lattice ‘2x’ cube-on-cube matching to GeMg 2 O 4 .
  • the direct bandgap E-k of both materials enables unique electronic band structure tuning using quantized energy levels pre-selected from specific layer thicknesses comprising the SL period.
  • FIG.121 shows the experimental XRD data of a Fd3m crystal structure GeMg 2 O 4 deposited as a high quality bulk layer on a Fm3m MgO(100) substrate and further comprising a MgO cap.
  • FIG.122 shows the experimental XRD data of a Fd3m crystal structure GeMg 2 O 4 when incorporated as a SL structure comprising 20x period SL[GeMg 2 O 4 / MgO] on a Fm3m MgO(100) substrate.
  • the extraordinarily high quality GeMg 2 O 4 is evidenced by the small FWHM epilayer (400) diffraction peak and the high frequency thickness oscillations generated by the X-ray Fabry-Perot effect of the parallel atomic planes of the film and MgO cap layer, which are strained and coherent with the underlying substrate crystal.
  • FIG. 120 shows the extraordinarily high quality GeMg 2 O 4 as shown in FIG.121, the extraordinarily high quality GeMg 2 O 4 is evidenced by the small FWHM epilayer (400) diffraction peak and the high frequency thickness oscillations generated by the X-ray Fabry-Perot effect of the parallel atomic planes of the film and MgO cap layer, which are strained and
  • FIG.122 shows such a SL comprising 20x period SL[GeMg 2 O 4 / MgO] //MgO sub (100). Again, the large number of sharp SL satellite peaks SL i is evidence of a coherently strained structure.
  • Both GeMg 2 O 4 and MgO constituent materials are direct bandgap with [1173] For a thin layer of smaller bandgap material ⁇ 1-5 crystal unit cells in thickness, the conduction band minimum and valence band maximum can be quantum confined when sandwiched between a larger bandgap material such as MgO.
  • FIG.123 shows the complex epilayer structure 12300 of dissimilar cubic oxide layers integrated into a superlattice or multi-heterojunction structure in another example.
  • a MgO(100)-oriented substrate enables the lattice ‘2x’ cube-on-cube matching.
  • the direct bandgap E-k of both materials enables unique electronic band structure tuning using quantized energy levels pre-selected from specific layer thicknesses comprising the SL period.
  • FIG.124 shows a representation of the (100) crystal plane of the Fd3m cubic symmetry unit cells 12400 of GeMg 2 O 4 and MgGa 2 O 4 .
  • the constituent atomic species are labeled, showing the unique character of Mg atoms in each oxide.
  • the Ga atoms occupy the octahedral bonding sites surrounded by O atoms, whereas the Mg occupies the tetrahedral bonding sites.
  • the Mg atoms occupy tetrahedral bonding sites and the Ge atoms occupy the octahedral sites.
  • FIG.126 shows that once again the structural quality is high with the SL satellite peak spacing reduced.
  • FIG.127 shows the complex epilayer structure 12700 of dissimilar cubic oxide layers integrated into a superlattice or multi-heterojunction structure in a further example. Shown in this example are two large lattice constant cubic materials, namely, GeMg 2 O 4 and ⁇ Ga 2 O 3 layers forming a superlattice having a repeating period ⁇ with N repetitions, grown along a growth direction.
  • a MgO(100)-oriented substrate enables the lattice ‘2x’ cube-on-cube matching.
  • each of L GeMgO and L ⁇ GaO are less than approximately 10-20x their respective unit cells in thickness, e.g., less than about 150 nm
  • a digital pseudo-alloy can be formed having an effective composition demonstrated in FIGS.114A and 114B the formation energy of ⁇ Ga 2 O 3 layers requires a lower growth temperature to stabilize it with respect to forming other non-cubic space group phases.
  • the crystal structure of ⁇ Ga 2 O 3 is a defective Ga-site Fd3m space group and enables further impurity type doping to occur (for example Li can be used as a substitutional species on the defect site).
  • FIGS.128A and 128B show experimental XRD data for a superlattice structure comprising SL[GeMg 2 O 4 / ⁇ Ga 2 O 3 ] // MgO sub (100).
  • FIG.128A shows a phase-pure cubic structure for the substrate and SL (200) and (400) diffraction orders and a peak labelled P indicating the ⁇ Ga 2 O 3 replica diffraction.
  • FIG.129 shows the complex epilayer structure 12900 of dissimilar cubic oxide layers integrated into a superlattice or multi-heterojunction structure in another example. Shown are large lattice constant cubic ZnGa 2 O 4 and small lattice constant MgO layers forming a superlattice having a repeating period ⁇ with N repetitions, grown along a growth direction. A MgO(100)-oriented substrate enables the lattice ‘2x’ cube-on-cube matching to ZnGa 2 O 4 .
  • the band structure E-k of both materials enables unique electronic structure tuning using specific layer thicknesses comprising the SL period. If the layers comprising the SL are thin, such that, each of L ZnGaO and L MgO are less than approximately 10-20x their respective unit cells in thickness, e.g., less than about 150 nm, then a digital pseudo-alloy can be formed having an effective composition An optional MgO cap layer is shown that can be used to protect the final surface of the structure and balance the strain with the substrate.
  • FIGS.130A and 130B show experimental XRD and XRR data for a heterostructure and superlattice structure comprising SL[ZnGa 2 O 4 / MgO] // MgO sub (100).
  • FIG. 130A shows a high resolution XRD for the superlattice.
  • the XRR plot shown in FIG.130B also confirms the exceptionally high atomic heterointerfaces within the SL with near perfect thickness oscillations between satellite reflection orders.
  • FIG.131 shows the complex epilayer structure 13100 of dissimilar cubic oxide layers integrated into a superlattice or multi-heterojunction structure in another example.
  • a MgO(100)-oriented substrate enables the lattice ‘2x’ cube-on-cube matching to MgGa 2 O 4 .
  • the band structure E-k of both materials enables unique electronic structure tuning using specific layer thicknesses comprising the SL period.
  • each of L MgGaO and L MgO are less than approximately 10-20x their respective unit cells in thickness, e.g., less than about 150 nm
  • a digital pseudo-alloy can be formed having an effective composition
  • An optional MgO cap layer is shown that can be used to protect the final surface of the structure and balance the strain with the substrate.
  • the lattice mismatch between Fd3m MgGa 2 O 4 (100) and Fm3m MgO(100) is +2.19% and can be accommodated elastically by tetrahedral deformation of the MgGa 2 O 4 unit cell when biaxially strained to the rigid MgO lattice representing the substrate.
  • FIGS.132A and 132B show experimental XRD data for a superlattice structure comprising SL[MgGa 2 O 4 / MgO] // MgO sub (100).
  • the wide angle scan plot shown in FIG.132A reveals a phase pure cubic structure showing the (200) and (400) diffracted order from both the MgO substrate and the SL.
  • the peak labelled P is a low order replica diffraction order from the Ga-sublattice formed by the SL.
  • FIG.133 shows the complex epilayer structure 13300 of dissimilar cubic oxide layers integrated to form a heterostructure and SL where the SL comprises SL[Ga 2 O 3 / MgO] // MgO sub (100).
  • the phase of the Ga 2 O 3 layer is controlled by the growth temperature, and the thickness and can be preselected from ⁇ Ga 2 O 3 or ⁇ Ga 2 O 3 . Other phases are also possible.
  • FIGS.134A and 134B show experimental XRD data for the SL structure of FIG.
  • FIGS.134A and 134B show respectively the high resolution XRD scans in the vicinity of the MgO(200) and MgO(400) diffracted orders of the as-grown epitaxial structure.
  • FIG.134B shows the complex epilayer structure 13500 of dissimilar cubic oxide layers integrated into a superlattice or multi-heterojunction structure in a further example.
  • Mg x Zn 1-x O Shown are two small lattice constant cubic Mg x Zn 1-x O and MgO layers forming a superlattice having a repeating period ⁇ with N repetitions, grown along a growth direction.
  • the cubic phase of Mg x Zn 1-x O requires precise control of the Zn% such that the rocksalt (RS) form can be stabilized for x>0.7.
  • RS-MgZnO can be formed into SL with any one of the other oxide materials disclosed herein and furthermore the substrate selection further dictates the strain imparted to the structure.
  • FIG.136 shows experimental XRD data of a bulk RS-Mg 0.9 Zn 0.1 O epilayer pseudomorphically strained to a cubic Fm3m MgO(100)-oriented substrate. The sticking coefficient of Zn is almost 10x lower than Mg using MBE growth process.
  • FIG.137 shows experimental XRD data of the bulk RS-Mg 0.9 Zn 0.1 O composition referred to in FIG.136, incorporated into a digital alloy in the form of SL[RS-Mg 0.9 Zn 0.1 O /MgO] // MgO sub (100). Sharp well resolved satellite peaks provide evidence for the high crystalline quality of the structure.
  • GRADED CHIRP EXAMPLE [1194]
  • FIG.138A shows a plot 13800 of the minimum bandgap energy versus the minor lattice constant of monoclinic ⁇ ( Al x Ga 1 ⁇ x ) 2 O 3 .
  • the lattice constants for all 3 independent crystal axes become smaller as the Al mole fraction x increases.
  • the monoclinic C2m space group has a unit cell comprising 4 distinct octahedral bonding sites and 4 distinct tetrahedral bonding sites.
  • Theoretically the full mole fraction 0 ⁇ x ⁇ 1 range is possible, however, it was found experimentally that Al atoms prefer exclusively octahedral bonding sites whereas Ga atoms can occupy both symmetry sites. This limits the attainable alloy range to 0 ⁇ x ⁇ 0.5 and the available minimum bandgap to ⁇ 6 eV.
  • FIG.138B shows a plot 13850 of the minimum bandgap energy versus the minor lattice constant of hexagonal ⁇ ( Al x Ga 1 ⁇ x ) 2 O 3 .
  • the lattice constants for the two independent crystal axes (a, c) become smaller as the Al mole fraction x increases.
  • the hexagonal R3c space group has a unit cell comprising 12 distinct octahedral bonding sites. Theoretically the full mole fraction 0 ⁇ x ⁇ 1 range is possible and was confirmed experimentally 0 ⁇ x ⁇ 1.0.
  • the Al and Ga atoms comprising the alloy can in general randomly select any of the 12 distinct bonding sites.
  • Intentional small angle misoriented surfaces away from A-, R-, C- and M-planes are also possible for optimizing growth conditions of epitaxial R3c ⁇ ( Al x Ga 1 ⁇ x ) 2 O 3 . It was found experimentally that R3c ⁇ ( Al x Ga 1 ⁇ x ) 2 O 3 can be epitaxially formed on A-, R-, and M-plane sapphire. In particular, the A-plane shows exceptionally high crystal quality epilayer growth.
  • Substrates for deposition of ⁇ ( Al x Ga 1 ⁇ x ) 2 O 3 include tetrahedral LiGaO 2 and others such as metallic surfaces of Ni(111) and Al(111).
  • FIG.138C shows examples of R3c ⁇ ( Al x Ga 1 ⁇ x ) 2 O 3 epitaxial structures 13860, 13870, and 13880 that may be formed.
  • the crystal structures shown describe the atomic positions within a repeating unit cell comprising a bilayer pair of ⁇ Ga 2 O 3 and ⁇ Al 2 O 3 .
  • the digital superlattice formation can be utilized to form an equivalent ordered ternary alloy of composition ⁇ ( Al x Ga 1 ⁇ x ) 2 O 3 wherein the equivalent mole fraction of Al is given by: [1200]
  • the layer thicknesses are selected to be sufficiently thin (e.g., less than about 10 unit cells of the respective bulk material) then quantization effects along the growth axis occurs and electronic properties will be determined by the quantized energy states in the conduction and valence bands of ⁇ Ga 2 O 3 .
  • the wider bandgap material ⁇ Ga 2 O 3 is also sufficiently thin (namely, less than about 5 unit cells) then quantum mechanical tunnelling of electrons and holes can occur along the quantization axis (in general parallel to the layer formation direction).
  • a monolayer (ML) is defined as the unit cell thickness along the given crystal axis.
  • ML monolayer
  • 1ML ⁇ Al 2 O 3 4.161 ⁇
  • 1ML ⁇ Ga 2 O 3 4.382 ⁇ .
  • FIG.138C shows three example cases of a digital SL intentionally formed along the [110] growth axis or deposited on the A-plane of ⁇ ( Al x Ga 1 ⁇ x ) 2 O 3 .
  • the SL comprises for this example a repeating SL period of 4ML in thickness, however, thicker or thinner periods can be selected.
  • the cross-section of the crystal is equivalent to viewing the C-axis in plan view, and is to be understood that the structure is periodic in the horizontal directions representing an epitaxial film.
  • the structure represents bulk ⁇ Al 2 O 3 as shown on the left-hand diagram of the figure.
  • An example case of a Ga atom substitution is shown in the middle diagram, with an SL structure comprising 3 ML ⁇ Al 2 O 3 /1 ML ⁇ Ga 2 O 3 being the equivalent bulk ternary alloy of ( Al 0.75 Ga 0.25 ) 2 O 3 .
  • FIG.139A shows an epilayer structure 13900 implementing a stepped increment tuning of the effective alloy composition of each SL region along the growth direction.
  • each SL region is shown with varying equivalent mole fractions of Al, – x1, x2, x3 and x4.
  • the period of each SL can be kept constant, such as shown in FIG.138C, but the bilayer thicknesses can be varied, as shown in FIG.139.
  • the number of periods can also be kept the same or varied between SLs along the growth direction.
  • the example shows the SL changing from high Al% near the substrate to a higher Ga% near the top. This method of grading the average alloy content as a function of the growth direction is advantageous for managing the misfit strain at the heterojunction interfaces, for example, determined by the lattice constants shown in FIG.138B.
  • FIG.139B shows the experimental XRD data of a step graded SL (SGSL) structure as shown in FIG.139A using a digital alloy comprising bilayers of ⁇ Ga 2 O 3 and ⁇ Al 2 O 3 deposited on (110)-oriented sapphire (zero miscut).
  • the SGSL had a period of 7.6 nm and each SL had 10 periods.
  • the bilayer pair thickness was varied along the growth direction from low average Ga% to high average Ga%.
  • FIG.140 shows another example and possible application of a step graded SL structure 14000 which in one example may be used to form a pseudo-substrate with a tuned in- plane lattice constant for a subsequent high quality and close lattice matched active layer such as the “bulk” (meaning a single layer rather than an SL) ⁇ ( Al x5 Ga 1x5 ) 2 O 3 .
  • the active layer can, for example, be used for the high mobility region of a transistor.
  • FIG.141A shows another step graded SL structure 14100 comprising a high complexity digital alloy grading interleaved by a wide bandgap spacer, in this case a ⁇ Al 2 O 3 interposer layer.
  • the SL regions are varied by the narrow bandgap (NBG) and wide bandgap (WBG) layer thickness L m and number of periods N pm .
  • NBG narrow bandgap
  • WBG wide bandgap
  • FIG.141B shows the experimental high-resolution XRD data of the step graded (i.e., chirped) SL structure with interposer shown in FIG.141A.
  • FIG.141C shows the X-ray reflection (XRR) data of the step graded (i.e., chirped) SL structure with interposer shown in FIG.141A.
  • FIGS.142A and 142B show the electronic band diagram as a function of the growth direction for a chirp layer structure like those of FIGS.140 and 141A, at zero bias conditions and under a bias “V Bias .”
  • FIG.142C shows the lowest energy quantized energy wavefunction confined within the ⁇ Ga 2 O 3 layers of the chirp layer.
  • the SL regions have an effective bandgap determined by the quantized energy levels confined within the NBG ⁇ Ga 2 O 3 .
  • FIG.142D is the wavelength spectrum of the oscillator strength for electric dipole transitions between the conduction and valence band of the chirp layer modeled in FIGS.142A-142C. It is calculated from the spatial overlap integrals between the conduction and valence band quantized wavefunctions. This curve is related to either the absorption coefficient or the emission spectrum of electrons and holes recombining in the structure.
  • FIG.143A shows a full E-k band structure of an epitaxial oxide material, which can be derived from the atomic structure of the crystal.
  • FIG.143B shows a simplified band structure, which is a representation of the minimum bandgap of the material, and wherein the x- axis is space (z) rather than wavevectors (as in the E-k diagrams).
  • FIG.144A shows a simplified band structure diagram 14400 of bandgap energy (eV) as a function of growth direction Z, representing a homojunction device comprising a p-i-n structure comprising epitaxial oxide layers.
  • the structure is formed along a growth direction Z, using spatial control of the doping regions. Moving from left to right along the growth direction, first an n-type region is formed, followed by a not-intentionally doped region (intrinsic “i” region), and then a p-type region.
  • eV bandgap energy
  • the doping transition between the n-, i-, and p-regions may be abrupt or graded over a distance.
  • the height of the bandgaps for each region is the same, showing that the bandgap energies E g for the n-, i-, and p-regions are equal.
  • the p- and n-regions form a diode. An electric field between the p- and n-regions is applied across the central intrinsic region along the Z-axis, causing electrons and holes to be injected into the i-region.
  • FIG.144B is a simplified band structure diagram 14450 representing a homojunction device, such as a diode, with an n-i-n structure comprising epitaxial oxide layers.
  • the n-i-n structure is formed along a growth direction Z, using spatial control of the doping regions.
  • the n-i local junctions can be abrupt or graded in doping concentration across a predetermined distance.
  • FIG.145A shows a simplified band structure diagram 14500 of a heterojunction p-i-n device comprising epitaxial oxide layers. The structure is sequentially formed along the growth direction Z, using spatial control of the composition and doping of the distinct regions. In various embodiments, the composition and doping can be abrupt or graded across a predetermined distance.
  • the bandgap energies E gp and E gn of the p- and n-regions do not have to be the same, where in this example the bandgap of the n-region is larger than that of the p- region.
  • Heterojunction conduction band offset ⁇ E c and valence band offset ⁇ E v provide energy barriers for controlling carrier flow/confinement.
  • the p-i-n- structure forms a diode, and the built-in electric field applies an electric field along the direction Z across the i-region, as shown.
  • the heterojunction structure is useful for light emitting devices, as light generated from the center region will not absorbed by the p- and n-regions and therefore will escape.
  • FIG.145A is a simplified band structure diagram 14520 representing a double heterojunction device, such as a quantum well, comprising epitaxial oxide layers.
  • the structure is sequentially formed along a growth direction Z, using spatial control of the composition.
  • the structure comprises a wide bandgap E g1 layer composition and a narrow bandgap region/layerE g2 , such thatE g2 ⁇ E g1 .
  • FIG.145C shows a simplified band structure 14540 of a multiple heterojunction device, such as a diode, with a p-i-n structure and a single quantum well QW and comprising epitaxial oxide layers.
  • the bandgaps of the n- and p-regions are greater than that of the barriers (bandgap E gi,B ) and quantum well ( E gi,W ) of the QW region, where E gi,B > E gi,W . Electrons and holes are injected into the intrinsic region from their respective reservoir regions. Heterojunction conduction band offset ⁇ E c and valence band offset ⁇ E v provide energy barriers for controlling carrier flow/confinement.
  • the heterojunction structure is useful for light emitting devices, as light generated from the center region will not absorbed by the p- and n-regions and therefore will escape; that is, the wider bandgap n- and p- regions have low absorption coefficients of light emitted from the quantum well in the narrower bandgap i-layer.
  • the quantum well, with bandgap E gi,W is designed such that the thickness L QW can tune the quantized energy levels in the conduction and valence bands confined between the barriers, with bandgaps E gi,B .
  • the structure can have more than one, or multiple quantum wells in the intrinsic region.
  • FIG.146 shows a band structure diagram 14600 for a metal-insulator- semiconductor (MIS) structure comprising epitaxial oxide layers.
  • the semiconductor region has a bandgap E g1
  • the insulator region has a bandgap E g2 .
  • an epitaxial oxide layer as disclosed herein may be used as either the insulator or semiconductor.
  • FIG.147A shows a simplified band structure 14700 of another example p-i-n structure with a superlattice (SL) in the i-region.
  • the p-i-n structure has multiple quantum wells, where the barrier layers of the multiple quantum well structure in the i-region have larger bandgaps than the bandgap of the n- and p- layers. In other cases, the bandgaps of the barrier layers in the multiple quantum wells can be narrower than those of the n- and p- layers.
  • FIG. 147B shows a single quantum well of the multiple quantum well structure in 147A.
  • the thickness L QB of the barrier layers can be made thin enough that electrons and holes can tunnel through them (e.g., within the i-region, and/or when being transferred between the n- and/or p- layers into and/or out of the i-region).
  • Such a multiple quantum well structure can behave as a digital alloy, whose properties are dependent on the materials comprising the barriers and the wells, and with the thicknesses of the barriers and the wells.
  • FIG.148 shows a simplified band structure 14800 of another example p-i-n structure, with a superlattice in the p-, i-, and n-regions.
  • the p-, i-, and n- regions may be the same or different compositions.
  • the n- region comprises N n SL pairs of wells (thickness L 1 and bandgap E gW1 ) and barriers (thickness L 2 and bandgap EgB1).
  • the i-region comprises Ni SL pairs of wells (thickness L3 and bandgap EgW2) and barriers (thickness L 4 and bandgap E gB2 ).
  • the p-region comprises N p SL pairs of wells (thickness L 5 and bandgap E gW3 ) and barriers (thickness L 6 and bandgap E gB3 ).
  • the bandgaps of the barriers and wells in the i-region are narrower than those of the barriers and wells in both the n- and p- layers in this example. In other cases of structures with multiple quantum wells, the bandgaps of the barrier layers can be wider than those of the n- and p- layers.
  • the thicknesses and/or bandgaps of the barriers and/or wells in the n-, i- and/or p- region can change throughout an individual region (e.g., to form a graded structure, or a chirp layer).
  • the thicknesses L 2 , L 4 , and/or L 6 of the barrier layers can be made thin enough that electrons and holes can tunnel through them (e.g., within the i-region, and/or when being transferred between the n- and/or p-layers into and/or out of the i-region).
  • Each region in the structure shown in FIG.148 can behave as a digital alloy, whose properties are dependent on the materials comprising the barriers and the wells, and with the thicknesses of the barriers and the wells.
  • the materials and layer thicknesses can be chosen such that the n- and p- regions have wider bandgaps and are therefore transparent (or have a low absorption coefficient) to the wavelength of light emitted from the i-region superlattice. Any of the compatible materials sets described herein can be incorporated into in such structures.
  • FIG.149 shows a simplified band structure 14900 of another example p-i-n structure, similar to the structure in FIG.148.
  • the bandgap and the thicknesses of the barriers and well in the n-, i- and p- regions are defined the same as in FIG.148.
  • the superlattices in the n-, i- and p- regions in this example have the same alternating pairs of materials with different well (or well and barrier) thicknesses in the i- region tuning the optical properties.
  • the structure shown in this figure has a material A and a material B, where the barriers of the superlattice in the n- region comprise material A and the wells in the superlattice in the n- region comprise material B.
  • the barriers of the i- and p- regions also comprise material A and the wells in the i- and p- regions also comprise material B.
  • FIG.150A shows an example of a semiconductor structure 15000 comprising epitaxial oxide layers 3010, 3020, and 3030.
  • the three epitaxial oxide layers 3010, 3020, and 3030 are formed on a buffer layer (“Buffer”), which is formed on a substrate (“SUB”).
  • a contact region (“Contact region #1”) (e.g., a metal) is also shown contacting the topmost epitaxial oxide layer in the semiconductor structure.
  • the epitaxial oxide layers 3010, 3020, and 3030 can be many different combinations of compatible sets of materials described herein. For example, the bandgap of layer 3020 can be narrower than that of layers 3010 and/or 3030.
  • the layers 3010, 3020, and 3030 can also be superlattices or graded multilayer structures, in some embodiments. [1225]
  • FIG.150A includes an active region comprising the layers 3010, 3020, and 3030.
  • the active region can comprise more than three layers.
  • the layers 3010, 3020, and 3030 of the active region can be doped and/or not intentionally doped to form p-i-n, n-i-n, p- n-p, n-p-n, and other doping profiles.
  • the compositions of the layers x1, x2 and x3 can be chosen depending on the substrate and buffer layer upon which they are formed, for example, according to the selection criteria for compatible combinations of epitaxial oxide layers and substrates described herein.
  • the structure 15000 shown in FIG.150A is incorporated into an optoelectronic device that emits or detects light.
  • the structure shown in FIG.150A can be an LED or laser or photodetector configured to emit or detect UV light.
  • layer 3020 can emit light, and the substrate can be opaque to the emitted light. In such devices, the light can primarily be emitted (or detected) through the top of the device or an edge of the device, and the layer 3030 above the emission layer 3020 can have a higher bandgap and not strongly absorb the emitted light (or light to be detected).
  • layer 3020 can emit light, and the substrate and buffer layer are transparent to (or absorb a fraction of) the emitted light.
  • the light can primarily be emitted (or detected) through the top of the device or an edge of the device, and the layer 3030 above the emission layer 3020 can have higher bandgaps and not strongly absorb the emitted light (or light to be detected).
  • one or more of the layers 3010, 3020 and/or 3030 in the structure shown in FIG.150A can include a superlattice or graded layer or multilayer structure, as described herein, comprising different compositions epitaxial oxide materials.
  • the substrate of the structure shown in FIG.150A can be any single crystal material that is compatible with the layers 3010, 3020 and/or 3030.
  • the buffer layer of the structure shown in FIG.150A can be a material compatible with the substrate and the layers 3010, 3020 and/or 3030.
  • the buffer layer of the structure 15000 shown in FIG.150A can include a graded layer or multilayer structure, as described herein.
  • the buffer layer can be a lattice constant matching layer that couples the active region to the substrate.
  • the buffer can include a graded or chirp layer comprising different compositions of epitaxial oxide materials.
  • the buffer layer can include a superlattice or a chirp layer (with a graded multilayer structure), comprising alternating layers of different epitaxial oxide materials.
  • the in-plane (approximately perpendicular to the growth direction) lattice constant of the graded or chirp layer adjacent to the substrate can be approximately equal to (or within 1%, 2%, 3%, 5%, or 10% of) the in-plane lattice constant at a surface of the substrate.
  • the final in-plane (approximately perpendicular to the growth direction) lattice constant of the graded or chirp layer can be approximately equal to (or within 1%, 2%, 3%, 5%, or 10% of) the in-plane lattice constant of layer 3010.
  • FIG.150B shows a modified structure 15010 compared to the structure 1500 from FIG.150A where the layers are etched such that contact can be made to any layer of the semiconductor structure using “Contact region #2,” “Contact region #3,” and “Contact region #4.”
  • the metals for the contact regions can be chosen to be high work function metals or low work functions metals for contacting to different conductivity type (n- type or p-type) epitaxial oxide materials, as described herein.
  • the contact regions can all be patterned to achieve desired electrical resistances and to allow light to enter and/or escape from the semiconductor structures, in some cases.
  • FIG.150C shows a modified structure 15020 compared to structure 15010 from FIG.150B having an additional “Contact region #5,” which makes contact to the back side (opposite the epitaxial oxide layers) of the substrate (“SUB”).
  • a contact region can be used when the substrate has a sufficient electrical conductivity.
  • the metals for the contact region to the backside of the substrate (“SUB”) can be chosen to be high work function metals or low work functions metals for contacting to different conductivity type epitaxial oxide materials, as described herein.
  • FIG.151 shows a multilayer structure 15100 used to form an electronic device having distinct regions comprising at least one layer of Mg a Ge b O c , such as Mg 2 GeO 4 .
  • a substrate “SUB” has epitaxial layers Epi n (e.g., films or regions) deposited along a growth direction Z.
  • the layers Epi n comprising the device are selected from at least one Mg a Ge b O c form and may be integrated with, for example, compositions of the type selected from (see FIG.152): Zn x Ge y O z , Zn x Ga y O z , Al x Ge y O z , Al x Zn y O z , Al x Mg y O z , Mg x Ga y O z , Mg x Zn y O z , and Ga x O z , where x, y, z represent relative mole fractions.
  • FIG.152 is a figurative diagram showing example compositions that may be combined with Mg a Ge b O c to form a heterostructure.
  • the combination is schematically drawn, illustrating Mg a Ge b O c plus a heterostructure material where in this example the heterostructure material compositions comprise Mg x Ge y O z , Zn x Ge y O z , Zn x Ga y O z , Al x Ge y O z , Al x Zn y O z , Al x Mg y O z , Mg x Ga y O z , Mg x Zn y O z and Ga x O z .
  • FIG.153 is a plot 15300 of minimum energy gap (eV) versus lattice constant (c, in Angstroms) for Mg 2 GeO 4 and other materials that may be used in heterostructures for semiconductor structures of the present disclosure. The plot may be used to determine compatible crystal structure lattice matching for materials combinations.
  • Embodiments include semiconductor structures and devices (and methods for making the structures and devices) in which an epitaxial layer of MgxGe 1-x O 2 -x is on a substrate, with x having a value of 0 ⁇ x ⁇ 1, and a second epitaxial layer forms a heterostructure with the epitaxial layer of Mg x Ge 1-x O 2-x .
  • the second epitaxial layer may comprise Zn x Ge y O z , Zn x Ga y O z , Al x Ge y O z , Al x Zn y O z , Al x Mg y O z , Mg x Ga y O z , Mg x Zn y O z , or Ga x O z , where x, y and z are mole fractions.
  • FIG.154 shows an in-plane conduction device comprising in this example an insulating substrate and a semiconductor layer region formed on the substrate, with electrical contacts positioned on the top semiconductor layer of the device.
  • FIG.155 shows a vertical conduction device comprising in this example a conducting substrate and a semiconductor layer region formed on the substrate, with the electrical contacts positioned on the top and bottom of the device.
  • a first electrical contact (Contact1) of the electrical contacts is located on the top of the semiconductor layer region (either embedded in or on the top surface).
  • a second electrical contact (Contact2) is located on the underside of the substrate, vertically spaced from first electrical contact to cause vertical current flow as indicated by the large arrow.
  • FIG.156A shows a figurative sectional view of a vertical conduction device for light emission (e.g., a light emitting diode) having the electrical contact configuration illustrated in FIG.155 configured as a plane parallel waveguide for the emitted light.
  • the device comprises a substrate, a first semiconductor layer (Semi1) having a first conductivity type, a second semiconductor layer having a second conductivity type (Semi 2 ), and a third semiconductor layer having a second conductivity type (Semi3).
  • the first, second and third conductivity types may be, n-, i-, and p- as described throughout in this disclosure.
  • FIG.156B shows a figurative sectional view of a vertical conduction device for light emission (e.g., a light emitting diode) having the electrical contact configuration illustrated in FIG.155, configured as a vertical light emission device.
  • a vertical conduction device for light emission e.g., a light emitting diode
  • the device comprises a substrate, a first semiconductor layer (Semi1) having a first conductivity type, a second semiconductor layer having a second conductivity type (Semi 2 ), and a third semiconductor layer having a second conductivity type (Semi3).
  • the first, second and third conductivity types may be, n-, i-, and p- as described throughout in this disclosure.
  • a first electrical contact (Contact1) is on a top surface of the device, and a second electrical contact (Contact2) is on the bottom surface. Electrons and holes are injected into the central semiconductor layer.
  • FIG.157A shows a figurative sectional view of an in-plane conduction device for photo-detection (e.g., a photodetector) having the electrical contact configuration illustrated in FIG.154, and configured to receive light passing through the semiconductor layer region and/or the substrate.
  • the device includes a substrate and a semiconductor layer region formed on the substrate, with electrical contacts positioned on the top semiconductor layer of the device.
  • FIG.157B shows a figurative sectional view of an in-plane conduction device for light emission (e.g., a light emitting diode), having the electrical contact configuration illustrated in FIG.154, and configured to emit light either vertically or in-plane.
  • the device includes a substrate and a semiconductor layer region formed on the substrate, with electrical contacts positioned on the top semiconductor layer of the device.
  • FIG.158A is a semiconductor structure that can be used as a portion of a light emitting device.
  • the semiconductor structure in FIG.158A is a p-down p-i-n structure with LiF substrate, and a p-type Li: Mg (Al x Ga 1 ⁇ x ) 2 O 4 (i.e., Li doped Mg (Al x Ga 1 ⁇ x ) 2 O 4 ) or a superlattice (SL) of [ NiAl 2 O 4 /MgO] layer formed on the substrate.
  • the intrinsic (or not intentionally doped) layer comprises multiple quantum wells (MQW) or a superlattice (SL) of [GeMg 2 O 4 ⁇ MgO ] or [ GeMg 2 O 4 ⁇ MgGa 2 O 4 ] .
  • the n-type layer comprises ( Si,Ge) : SL [ MgGa 2 O 4 ⁇ MgO ] (i.e., a Si and/or Ge doped superlattice of [ MgGa 2 O 4 ⁇ MgO ]) or ( Si,Ge) : Mg (Al x Ga 1 ⁇ x ) 2 O 4 .
  • FIG.158B is a figurative sectional view of a light emitting device (e.g., an LED emitting a wavelength ⁇ ) that can be formed using the semiconductor structure of FIG.158A, including low work function (LWF) and high work function (HWF) metal contacts.
  • LWF low work function
  • HWF high work function
  • FIG.159A is a semiconductor structure that can be used as a portion of a light emitting device.
  • the semiconductor structure in FIG.159A is an n-down p-i-n structure with an MgO or MgAl2O4 substrate.
  • the n-type layer comprises ( Si,Ge) : SL [ MgGa 2 O 4 ⁇ MgO ] or ( Si,Ge) : Mg (Al x Ga 1 ⁇ x ) 2 O 4 .
  • the intrinsic (or not intentionally doped) layer comprises multiple quantum wells or a superlattice of [ GeMg 2 O 4 ⁇ MgO ] or [GeMg 2 O 4 ⁇ MgGa 2 O 4 ].
  • FIG.159B is a figurative sectional view of a light emitting device (e.g., an LED emitting a wavelength ⁇ ) that can be formed using the semiconductor structure of FIG.159A, including low work function (LWF) and high work function (HWF) metal contacts.
  • LWF low work function
  • HWF high work function
  • FIG.160 shows a figurative sectional view of an in-plane surface MSM conduction device comprising a substrate and a semiconductor layer region comprising multiple semiconductor layers (Semi1, Semi 2 , Semi3).
  • the top layer of metal comprises a pair of planar interdigitated electrical contacts (Contact1, Contact2), spaced apart by a distance “a.”
  • the width of the repeating portion of the device is shown as ⁇ cell .
  • the in-plane MSM conduction device comprises an optional third electrical contact (Contact3) located on the bottom surface of the substrate.
  • Contact3 can act as a vertical conduction collector or drain.
  • Contact3 may act as a back gate of a field effect device.
  • FIG.161A shows a top view of an in-plane dual metal MSM conduction device comprising a first electrical contact (Contact1) formed of a first metallic substance interdigitated with a second electrical contact (Contact2) formed of a second metallic substance.
  • the first electrical contact has a finger width of w 1
  • second electrical contact has a finger width of w 2 with a spacing of g between the contacts.
  • the lateral gap, g, between the respective electrodes governs the in-plane electric field strength.
  • Contact1 and Contact2 may be formed from dissimilar metals, for example a high- and low-work function metal may be used.
  • FIG.161B shows a figurative sectional view of the in-plane dual metal MSM conduction device illustrated FIG.161A formed of a substrate and a semiconductor layer region epitaxially formed on the substrate, showing the electrical contact unit cell arrangement.
  • FIG.162 shows a figurative sectional view of a multilayered semiconductor device having a first electrical contact (Contact1) formed on a mesa surface and a second electrical contact (Contact2) spaced both horizontally and vertically from the first electrical contact.
  • the device includes a substrate and semiconductor layers (Semi1, Semi 2 , Semi3, Semi4).
  • the first electrical contact is formed on an initial top surface of the semiconductor layer region which is etched to expose a sublayer for locating the second electrical contact.
  • the multilayered semiconductor device further comprises a third electrical contact (Contact3) located on the underside of substrate.
  • the 3- Terminal device comprising Contact1, Contact2 and Contact3 may act as a vertical heterojunction bipolar transistor or a vertical conduction FET switch.
  • FIG.163 shows a figurative sectional view of an in-plane MSM conduction device comprising multiple unit cells ⁇ cell of the mesa structured device illustrated in FIG.162.
  • the unit cells ⁇ cell are disposed adjacent to each other in a lateral direction.
  • the cells may form elongated fingers in the plane of the figure.
  • FIG.164 shows a figurative sectional view of a multi-electrical terminal device having multiple semiconductor layers (Semi1, Semi 2 , Semi3, Semi4).
  • the device has a first electrical contact (Contact1) formed on a first mesa structure (Mesa1).
  • a second electrical contact (Contact2) is spaced both horizontally and vertically from the first electrical contact and is formed on second mesa structure (Mesa2).
  • a third electrical contact (Contact3) is spaced both horizontally and vertically from the second electrical contact.
  • the first electrical contact is formed on an initial top surface of the semiconductor layer region (Semi4) which is etched to expose a first sublayer (Semi3) for locating the second electrical contact.
  • FIG.165A shows a figurative sectional view of a planar field effect transistor (FET) comprising source (S), gate (G) and drain (D) electrical contacts.
  • FET planar field effect transistor
  • the source and drain electrical contacts are formed on a semiconductor layer region (Semi1) that is formed on an insulating substrate.
  • the gate electrical contact is formed on a gate layer formed on the semiconductor layer region.
  • the epitaxial oxide material layer may be used in two different ways.
  • the epitaxial oxide layer is to be the active conduction channel region Semi1 with a wider bandgap material used to form the Gate layer.
  • the Gate layer may be itself epitaxially formed on Semi1 (e.g., cubic gamma-Al 2 O 3 , MgO or MgAl 2 O 4 ), or may be substantially amorphous (e.g., amorphous Al 2 O 3 ).
  • the composition of the epitaxial oxide material may alternatively be used as the Gate layer, wherein for example, the active channel Semi1 is a smaller bandgap material.
  • the metals forming S and D contacts are ideally ohmic and the gate metal can be selected to control the threshold voltage of the FET.
  • FIG.165B shows a top view of the planar FET illustrated in FIG.165A, depicting the distance D1 between the source to gate electrical contacts and the distance D2 between the drain to gate electrical contacts. Section B-B indicates the cross-section according to FIG.165A. Distance D2 > D1 can be utilized to control the breakdown voltage along the channel Semi1 between the G and D regions.
  • FIG.166A shows a figurative sectional view of a planar FET of a similar configuration to that illustrated in FIGS.165A and 165B.
  • the source electrical contact (S) is implanted (Implant1) through the semiconductor layer region (Semi1) into the substrate, and the drain electrical contact is implanted (Implant2) into the semiconductor layer region only.
  • the use of selective area ion-implantation to spatially alter the electrical conductivity of specific regions, such as the S and D regions, is advantageous to provide improved lateral contact to the channel layer Semi1. It is expected that selection of ion implant species such as Ga, Al, Li and Ge may be used to impart p-type and n-type conductivity regions. Implantation of O may also be used to create locally insulating compositions.
  • FIG.166B shows a top view of the planar FET illustrated in FIG.166A. Section B-B indicates the cross-section according to FIG.166A.
  • FIG.167 shows a top view of a planar FET comprising multiple interconnected unit cells of the planar FET illustrated in FIGS.165A or 166A.
  • FIG.168 shows a process flow diagram for forming a conduction device comprising a regrown conformal semiconductor layer region on an exposed etched mesa sidewall.
  • a semiconductor device is formed having a substrate (SUB) and an epitaxially formed semiconductor layer region (EPI). This semiconductor layer region is then etched to leave a remaining mesa structured semiconductor layer region.
  • An additional conformal semiconductor layer region (Semi 2 ) is then grown on the mesa structure which may then be optionally planarized in a subsequent planarization step.
  • the conformal coating Semi1 can be another oxide deposited via atomic layer deposition.
  • FIGS.169A and 169B show a chart showing center frequencies of RF operating bands that can be used in different applications and a schematic of an RF-switch.
  • An RF switch can be used to route high-frequency signals through transmission paths, for example in wireless communication systems (e.g., using 5G and 6G standards for broadband cellular networks).
  • the schematic in FIG.169B shows that an RF switch (“Tx/Rx switch”) is coupled between an antenna and RF-filters.
  • the RF switch (“Tx/Rx switch”) can be opened and closed as shown to allow signals to be received and/or transmitted by the antenna.
  • a low noise amplifier (“LNA”) can be used to amplify a low-power signal received by the antenna to produce a received amplified signal (“RF in ”), and an amplifier (“Gain”) can be used to amplify a signal (“RF out ”) to be transmitted by the antenna.
  • the RF switch (“Tx/Rx switch”) can comprise one or more field- effect transistors (FETs), and the opening and closing of the switches can be controlled by gate signals to FETs.
  • a transceiver module comprising the RF switch (“Tx/Rx switch”) can withstand high voltages (e.g., more than 50 V, or more than 100 V), in some cases, and therefore the breakdown voltage of the RF switch (“Tx/Rx switch”) is also high (e.g., more than 50 V, or more than 100 V), in some cases.
  • FIG.170A shows a schematic and an equivalent circuit diagram of a FET, with source (“S”), drain (“D”), and gate (“G”) terminals. “R on ” is the channel resistance when the FET is in the on state, and “C off ” is the capacitance between the source and drain terminals when the FET is in the off state.
  • FIGS.170B-170D show schematics and an equivalent circuit diagram of an RF switch employing multiple FETs in series to achieve high breakdown voltage.
  • a Si-based FET has a breakdown voltage less than 10 V, and more than ten Si-based FETs connected in series are required to form an RF switch with a breakdown voltage greater than 100 V.
  • the channel resistance “R on ” and capacitance “C off ” are increased and limit the performance (e.g., the maximum operating frequency) of the RF switch.
  • the dotted elements indicate that there may be more than 4 FETs connected in series, such as more than 10, or more than 20, or, in other cases there can be from 2 to 100 FETs connected in series.
  • FIG.171 shows a chart of calculated specific ON resistances of an RF switch and the calculated breakdown voltage associated with different semiconductors comprising the RF switch.
  • the breakdown voltage increases with the bandgap of the semiconductor used in the FETs making up the RF switch. Therefore, RF switches with high breakdown voltages comprising a high bandgap material such as ⁇ - and ⁇ - Ga 2 O 3 can achieve lower specific ON resistances than those with a low bandgap material such as Si.
  • an RF switch comprising an epitaxial oxide material e.g., ⁇ - and ⁇ -Ga 2 O 3
  • FIG.172A shows a schematic of multiple (e.g., more than 10) Si- based FETs connected in series to achieve a high breakdown voltage (e.g., greater than 100 V).
  • FIG.172B shows a schematic of a single Ga 2 O 3 -based FET that can achieve a high breakdown voltage (e.g., greater than 100 V).
  • FIGS.172A and 172B illustrate that the planar gate area (A oxide ) of the single Ga 2 O 3 -based FET is smaller than the effective planar gate area (“A Si ”) of the RF switch comprising multiple Si-based FETs.
  • FIG.173 shows a chart of calculated OFF-state FET capacitance (in F) versus calculated specific ON resistance (R ON ) for Si (a low bandgap material) and an epitaxial oxide material with a high bandgap.
  • the chart shows that for a particular OFF-state FET capacitance (which is mainly determined by the planar gate area) the specific ON resistance is about 3 orders of magnitude lower for the epitaxial oxide FET than for the Si-based FET.
  • the switching time is inversely proportional to the product of the specific ON resistance and the OFF-state FET capacitance, and therefore the chart shows that the switching time for the epitaxial oxide FET is 3 orders of magnitude faster (shorter) than that of the Si-based FET.
  • FIG.174 shows a chart of fully depleted thickness (t FD ) of a channel in an FET comprising ⁇ -Ga 2 O 3 versus the doping density (N D C H ) of the ⁇ -Ga 2 O 3 in the channel.
  • t FD fully depleted thickness
  • N D C H doping density
  • FIG.175 shows a schematic of an example of a FET 3101 comprising epitaxial oxide materials.
  • a channel layer 3120 comprising an epitaxial oxide material is formed on a compatible substrate 3110, and a gate layer 3130 comprising an epitaxial oxide material is formed on the channel layer 3120.
  • the channel layer 3120 can be ⁇ -(Al x Ga 1-x ) 2 O 3 which can be formed on a sapphire substrate 3110 (oriented in the A-, M- or R- plane), and the gate layer 3130 can be ⁇ -Al 2 O 3 . Examples of experimentally grown ⁇ -(Al x Ga 1-x ) 2 O 3 layers on sapphire substrates are described herein. Sapphire is a good substrate for RF switches because it is a low loss RF material.
  • FET 3101 optionally includes a buffer layer, not shown, between the substrate and the channel layer 3120.
  • the channel layer 3120 and gate layer 3130 can be formed by any epitaxial growth technique, such as MBE or CVD.
  • a fabrication process can include patterning a gate contact 3145, etching the channel layer 3120 and gate layer 3130 into a mesa, and forming source and drain contacts 3140 to the channel layer 3120.
  • gate contact 3145 can include an epitaxial oxide layer that is doped n- or p- type to form a low resistance contact to a metal electrode.
  • the source and drain contacts 3140 can be metals or regrown epitaxial oxide with high doping (e.g., n+ Ga 2 O 3 ).
  • the metal electrodes 3140 and 3145 can be high or low work function metals to make contact to the epitaxial oxide semiconductors, as described herein.
  • the FET 3101 can also be encapsulated with an additional oxide (e.g., ⁇ - Al 2 O 3 ), in some cases.
  • the gate-drain distance (L G-D ) influences the breakdown voltage of the FET 3101.
  • the thickness (t CH ) and doping density of the channel can be tailored to provide a fully-depleted or partially depleted channel.
  • Gate layer 3130 thickness (tGOX) is chosen to provide an OFF-state capacitance of the FET meeting the desired requirements.
  • FIGS.176A and 176B are E-k diagrams showing calculated band structures for epitaxial oxide materials that can be used in the FETs and RF switches described herein.
  • ⁇ - Al 2 O 3 can be used as the gate layer or the additional oxide encapsulation.
  • ⁇ -Ga 2 O 3 can be used as the channel layer.
  • ⁇ -Ga 2 O 3 and ⁇ -Al 2 O 3 can be doped n-type or p-type (e.g., using Li or N) in some cases, as described herein.
  • ⁇ -Ga 2 O 3 is an indirect bandgap material, which is suitable for a channel layer in a FET.
  • FIG.177 shows a chart of calculated minimum bandgap energy (in eV) versus lattice constant (in Angstroms) for ⁇ - and ⁇ - (Al x Ga 1-x ) 2 O 3 materials that are compatible with sapphire ( ⁇ -Al 2 O 3 ) substrates.
  • ⁇ -(AlxGa 1-x ) 2 O 3 layers are compatible with sapphire ( ⁇ -Al 2 O 3 ) substrates oriented in the A-, M- or R- plane.
  • ⁇ -(Al x Ga 1-x ) 2 O 3 layers are compatible with sapphire ( ⁇ -Al 2 O 3 ) substrates oriented in the C- plane.
  • FIG.178 shows a schematic of a portion of a FET 3201 and a chart of energy versus distance along the channel (in the “x” direction).
  • the FET 3201 is a heterojunction n-i-n device with an ⁇ -Ga 2 O 3 layer formed on a substrate a buffer layer, where the ⁇ -Ga 2 O 3 layer has n+ doped ⁇ -Ga 2 O 3 regions on either side of an ⁇ -Ga 2 O 3 channel region with a length L CH .
  • the energy versus distance chart shows two cases, a short channel band diagram 3210 and a long channel band diagram 3220. The chart shows that the long channel band diagram 3220 becomes fully depleted and builds up a larger potential barrier than the short channel band diagram 3210.
  • FIG.179 shows a schematic of a portion of a FET and a chart of energy versus distance along the channel (in the “z” direction) to illustrate the operation of the FET with epitaxial oxide materials.
  • a gate layer is formed on the ⁇ -Ga 2 O 3 channel layer, and a gate contact is formed on the gate layer.
  • the chart shows the energy band diagrams in the “z” direction for different biases applied to the gate contact. When a zero bias is applied to the gate contact, the FET has the band diagram 3230, and when a negative bias is applied the FET has the band diagram 3240.
  • FIG.180 shows a schematic of a portion of a FET and a chart of energy versus distance along the channel (in the “z” direction).
  • the substrate is ⁇ -Al 2 O 3
  • a superlattice (“SL”) of ⁇ -Al 2 O 3 / ⁇ -(Al x Ga 1-x ) 2 O 3 is formed on the substrate, and an ⁇ -(Al x Ga 1- x ) 2 O 3 layer is formed on the superlattice.
  • the superlattice can form the channel region, or the superlattice can be a buffer layer and the ⁇ -(Al x Ga 1-x ) 2 O 3 layer on the superlattice can form the channel layer. In some cases, the superlattice can also form a buried ground plane, as described herein. Such structures have been formed experimentally, as described herein.
  • FIG.181 shows a schematic of the atomic surface of ⁇ -Al 2 O 3 oriented in the A- plane (i.e., the (110) plane). This surface is the most favorable ⁇ -Al 2 O 3 surface for the epitaxial growth of ⁇ -(Al x Ga 1-x ) 2 O 3 and stabilizes the ⁇ -phase, as described herein.
  • FIG.182 shows a schematic of an example of a FET 3102 comprising epitaxial oxide materials and an integrated phase shifter.
  • the FET 3102 is similar to the FET 3101 shown in FIG.175.
  • FET 3102 optionally includes a buffer layer, not shown, between the substrate and the channel layer 3120.
  • the FET 3102 in this example has a split gate (i.e., there are two gate electrodes “G” and “V ⁇ ”) offset spatially along the length (L G-D ) of the channel.
  • the split gate allows for independent control of the phase of a signal routed by the switch.
  • the low ON-state resistance of the channel enables such FETs with phase control.
  • FIGS.183A and 183B show schematics of systems including one or more switches with an integrated phase shifter (e.g., containing the FET 3102 in FIG.182).
  • FIG. 183A shows that switches with an integrated phase shifter can be used in a phase controlled transceiver coupled to an antenna through an RF waveguide.
  • FIG.183B shows that multiple switches, each with an integrated phase shifter, can be coupled to a phased array antenna.
  • the switches with integrated phase shifters would act as phased array driver modules, to produce a dynamically steered spatial RF beam transmitted from an antenna.
  • Such a system can be useful, for example, to reduce the power required for wireless communication systems.
  • FIG.184 shows a schematic of an example of a FET 3103 comprising epitaxial oxide materials and an epitaxial oxide buried ground plane 3150.
  • the FET 3103 is similar to the FET 3101 shown in FIG.175.
  • the FET 3103 in this example has additional layers formed between the channel layer 3120 and the substrate 3110.
  • a buried ground plane 3150 with thickness t GP is formed on the substrate (optionally including a buffer layer, not shown, between the substrate and the buried ground plane 3150) comprising an epitaxial oxide material (e.g., ⁇ - (Al x Ga 1-x ) 2 O 3 ).
  • the buried ground plane 3150 can be highly doped (e.g., doping density greater than 10 17 cm -3 , or greater than 10 18 cm -3 , or greater than 10 19 cm -3 ) to have high electrical conductivity.
  • a buried oxide layer 3160 comprising an epitaxial oxide material e.g., ⁇ -Al 2 O 3
  • t ins which is thick enough to act as an effective insulating layer.
  • Such structures with buried ground planes can be used for confining RF waves in RF planar circuits (e.g., comprising FET 3103).
  • FIGS.185A and 185B are energy band diagrams along the gate stack direction (“z,” as shown in the schematic in FIG.179) of an example of a FET with a structure like that of FET 3103 in FIG.184 where the layers are formed of ⁇ -(Al x Ga 1-x ) 2 O 3 and ⁇ -Al 2 O 3 .
  • the diagram in FIG.185A shows the conduction and valence band edges
  • the diagram in FIG. 185B shows the band bending in the conduction band edge.
  • FIG.186 shows a structure 3104 of some RF-waveguides that can be formed using buried ground planes comprising epitaxial oxide materials. The layers in structure 3104 are the same as those described in FET 3103 in FIG.184.
  • Structure 3104 includes two waveguides, one waveguide comprises the single-stripline signal conductor 3182 and the buried ground plane, and the other waveguide comprises a dual coplanar stripline metal signal conductor 3184 and the buried ground plane.
  • a dielectric encapsulant 3170 is also shown in the structure 3104.
  • Such RF-waveguides can connect portions (e.g., antennas, FETs, and amplifiers) of RF circuits to one another.
  • the sheet resistivity of the buried ground plane (BGP) is determined by the doping density of the layer (e.g., Ga 2 O 3 ) layer and the thickness t BGP .
  • the coplanar waveguide frequency dependence is determined by the insulator thickness t ins .
  • FIG.187 shows a schematic of an example of a FET 3105 comprising epitaxial oxide materials and an electric field shield above the gate electrode 3145.
  • the FET 3102 is similar to the FET 3103 shown in FIG.184.
  • FET 3105 optionally includes a buffer layer, not shown, between the substrate and the buried ground plane 3150.
  • the FET 3102 in this example has an electric field shield (e.g., comprising a metal) embedded in a cladding (or encapsulant).
  • an electric field shield e.g., comprising a metal
  • FIG.188 shows a schematic of the epitaxial oxide and dielectric materials forming an integrated FET and coplanar (CP) waveguide structure 3106.
  • the dielectric constants of the regions will also be low.
  • the lower dielectric constant epitaxial oxide materials of the structure 3106 e.g., the buried oxide 3160, channel 3120 and substrate 3110) compared to conventional materials dramatically reduces crosstalk between planar components (e.g., between the FET and the waveguide), which leads to improved RF performance.
  • FIG.189 shows a schematic of an example of a FET 3107 comprising epitaxial oxide materials and an integrated phase shifter.
  • the FET 3102 is similar to the FET 3101 shown in FIG.175.
  • FET 3102 optionally includes a buffer layer, not shown, between the substrate and the channel layer 3120.
  • the FET 3102 in this example has a different structure forming source “S” and drain “D” contacts to the channel, which includes tunnel barrier layer 3135 forming tunnel barrier junctions between the source and drain contacts and the gate layer 3130.
  • the metal-tunnel barrier-epitaxial oxide channel then functions by direct tunneling through the thin tunnel barrier.
  • the tunnel barrier layer 3135 can be formed by first passivating the exposed surfaces and then growing an epitaxial oxide (e.g., Al 2 O 3 ), after a mesa etch to expose the S and D faces.
  • an epitaxial oxide e.g., Al 2 O 3
  • FIGS.190A-190C show energy band diagrams along the channel direction (“x,” as shown in FIG.178) of the S and D tunnel junctions described with respect to FET 3107 in FIG.189.
  • FIG.190A has no source-to-drain (S-D) bias applied
  • FIG.190B has a moderate S-D bias applied
  • FIG.190C has a high S-D bias applied.
  • the arrows indicate that more electrons can tunnel through the tunnel barrier layers when a high bias is applied.
  • the tunnel barriers “TB_S” and “TB_D” serve to control the tunneling current threshold voltage, which improves the low voltage leakage and is beneficial for low noise operation.
  • FIGS.191A-191G are schematics of an example of a process flow to fabricate a FET comprising epitaxial oxide materials, such as the FET 3107 in FIG.189.
  • the other FETs described herein can be fabricated using similar processes.
  • FIGS.191A- 191G uses AlGaO x as an example, however, FETs comprising other epitaxial oxide materials can be formed using the same processes.
  • FIG.191A an in-situ deposited FET stack is formed.
  • the substrate is prepared, an optional surface layer (i.e., buffer layer) is formed, and the channel, gate layer, and gate contact layer comprising epitaxial oxide materials are formed using an epitaxial growth technique such as MBE.
  • the full epitaxial stack comprising the buffer, buried ground plane, buried oxide layer, channel layer and gate layer, as well as the gate contact layer, can be grown sequentially in-situ via a single epitaxial growth deposition process (e.g., MBE or CVD).
  • MBE epitaxial growth deposition
  • This enables improved interface quality between the heterostructure regions, and improved channel mobility and reduces the concentration of trapped charges (scattering centers).
  • a bilayer of photoresist is deposited and exposed.
  • PR (+/-) indicates Positive or Negative tone photoresist
  • LOR indicates a Lift-off resist
  • PR(+/-) combined with LOR is the bilayer.
  • Such a bilayer photoresist method enables optimized undercut profile when developed, and high aspect ratio features.
  • the photoresist is patterned, and a metallic gate contact is formed (e.g., using an evaporation method such as e-beam deposition).
  • the lift-off is performed to remove the photoresist, and the surface of the gate metal is cleaned.
  • a hard photoresist layer is formed and patterned. Then an etch (e.g., a reactive ion plasma etch) is used to form the mesa structure comprising the epitaxial stack.
  • the mesa also includes a portion of the substrate.
  • the mesa does not include a portion of the substrate.
  • the hard photoresist is removed, and a conformal passivation layer is formed on the exposed surfaces, including the exposed sidewalls of the etched mesa. Then another photoresist layer is formed and patterned, and blanket metal contacts are deposited, as shown.
  • another lift-off is performed to form the patterned metal source and drain contacts. Then an optional conformal encapsulation layer is formed (e.g., of a low dielectric constant material). Then the formed FET can be tested and measured.
  • FIG.192 shows the DFT calculated atomic structure of ⁇ -Ga 2 O 3 (i.e., Ga 2 O 3 with a Pna21 space group).
  • the geometric optimization of the crystal structure of a unit cell of ⁇ -Ga 2 O 3 was performed using DFT where the exchange functional was the generalized gradient approximation (GGA) variation GGA- PBEsol.
  • GGA generalized gradient approximation
  • ⁇ -(Al x Ga 1-x ) y O z can be grown on quartz, LiGaO 2 and Al(111) substrates.
  • ⁇ -(Al x Ga 1-x ) y O z can be doped p- type using Li as a dopant.
  • alloys can be formed such as Li(Al x Ga 1-x )O 2 , where x is from 0 to 1, which can be native p-type oxides, and have compatible spaces groups such as Pna21 and P421212.
  • a high electron mobility transistor can be formed using ⁇ -(Al x Ga 1-x ) 2 O 3 , where x is from 0 to 1 (e.g., in a ⁇ -(Al x Ga 1-x ) 2 O 3 / ⁇ -(Al y Ga 1-y ) 2 O 3 heterostructure or superlattice, where x ⁇ y).
  • the estimated polarization charges derived from the calculated band structures can be used to design FET and HEMT devices.
  • ⁇ -(Al x Ga 1-x ) 2 O 3 where x is from 0 to 1, also has a direct bandgap and can therefore be used in optoelectronic devices such as sensors, LEDs and lasers.
  • the heterostructure has a metal contact adjacent to the ⁇ -(Al 0.5 Ga 0.5 ) 2 O 3 layer, and the epitaxial oxide layers in this example are growth cation-polar, as shown in the schematic in FIG.194A.
  • the plots in these figures show that high electron densities between 5e20 cm -3 and 3.5e21 cm -3 are possible with these heterostructures comprising polar epitaxial oxide materials.
  • FIG.195 shows a DFT calculated band structure of Li-doped ⁇ -Ga 2 O 3 . The structure had one Ga atom replaced with a Li atom in each unit cell.
  • FIG.196 shows a chart that summarizes the results from DFT calculated band structures of doped (Al,Ga) x O y using different dopants.
  • the dopants listed can substitute for the cation (i.e., Al and/or Ga) or the anion (i.e., O), or the dopant can be a vacancy in the crystal, as noted in the figure.
  • the relative efficacy is also shown, which indicates how strongly the dopant will affect the conductivity of the ⁇ -Ga 2 O 3 .
  • FIG.197A shows an example of a p-i-n structure, with multiple quantum wells in the n-, i- and p- layers (similar to the structure in FIG.149).
  • the bandgap and the thicknesses of the barriers and well in the n-, i- and p- regions are defined the same as in FIG.148.
  • FIGS.197B and 197C show calculated band diagrams and confined electron and hole wavefunctions (similar to those in the examples in FIGS.194B and 194C) for a portion of the superlattice in the n-region in a structure like the one in FIG.197A.
  • FIG.198A shows a structure with a crystalline substrate having a particular orientation (h k l) with respect to the growth direction, and an epitaxial layer (“film epilayer”) with an orientation (h’ k’ l’).
  • FIG.198B is a table showing some substrates that are compatible with ⁇ -Al x Ga 1-x O y epitaxial layers, the space group (“SG”) of the substrates, the orientation of the substrate, the orientation of a ⁇ -Al x Ga 1-x O y film grown on the substrate, and the elastic strain energy due to the mismatch.
  • FIG.199 shows an example containing a substrate (C-plane ⁇ - Al 2 O 3 ) and a template (low temperature “LT” grown Al(111)) structure used to match the in- plane lattice constants to ⁇ -Al x Ga 1-x O y (“Pna21 AlGaO”).
  • FIG.200 shows some DFT calculated epitaxial oxide materials with lattice constants from about 4.8 Angstroms to about 5.3 Angstroms, that can be substrates for, and/or form heterostructures with, ⁇ -Al x Ga 1-x O y , such as LiAlO 2 and Li 2 GeO 3 .
  • FIG.201 shows some additional DFT calculated epitaxial oxide materials with lattice constants from about 4.8 Angstroms to about 5.3 Angstroms, that can be substrates for, and/or or form heterostructures with, ⁇ -Al x Ga 1-x O y , including ⁇ -SiO 2 , Al(111) 2x3 (i.e., six unit cells of Al(111) in a 2x3 array have an acceptable lattice mismatch with one unit cell of ⁇ - Al x Ga 1-x O y ), and AlN(100) 1x4 .
  • FIGS.202A-202E show atomic structures at surfaces of ⁇ -Ga 2 O 3 and some compatible substrates.
  • FIG.202A shows the rectangular array of atoms in the unit cells at the (001) surface of ⁇ -Ga 2 O 3 .
  • FIG.202B shows the surface of ⁇ -SiO 2 , with the rectangular unit cell of ⁇ -Ga 2 O 3 (001) overlayed.
  • FIG.202C shows the surface of LiGaO 2 (011), with the rectangular unit cell of ⁇ -Ga 2 O 3 (001) overlayed.
  • FIG.202D shows the surface of Al(111), with the rectangular unit cell of ⁇ -Ga 2 O 3 (001) overlayed.
  • FIG.202E shows the surface of ⁇ -Al 2 O 2 (001) (i.e., C-plane sapphire), with the rectangular unit cell of ⁇ -Ga 2 O 3 (001) overlayed.
  • FIG.203 shows a flowchart 20300 of an example method for forming a semiconductor structure comprising ⁇ -Al x Ga 1-x O y .
  • the substrate is prepared, the surface is terminated in Al (at a temperature above 800 °C), then the temperature is dropped to below 30 °C in an ultra-high vacuum (UHV) environment, and a thin (e.g., 10 nm to 50 nm) layer of Al(111) is formed.
  • UHV ultra-high vacuum
  • FIGS.204A-204C are plots of XRD intensity versus angle (in an ⁇ -2 ⁇ scan) for experimental structures.
  • FIG.204A shows two overlayed experimental XRD scans, one of ⁇ - Al 2 O 3 grown on an Al(111) template, and the other of ⁇ -Al 2 O 3 grown on a Ni(111) template.
  • FIG.204B shows two overlayed experimental XRD scans (shifted in the y-axis) of the structures shown, one including a ⁇ -Ga 2 O 3 layer grown on an ⁇ -Al 2 O 3 substrate with an Al(111) template layer, and the other a ⁇ -Ga 2 O 3 layer grown on an ⁇ -Al 2 O 3 substrate without a template layer.
  • FIG.204C shows the two overlayed scans from FIG.204B in high resolution where the fringes due to the high quality and flatness of the layers were observed.
  • FIGS.205A and 205B show simplified E-k diagrams in the vicinity of the Brillouin-zone center for an epitaxial oxide material, such as those shown in FIGS.28, 76A-1, 76A-2 and 76B, showing a process of impact ionization.
  • the band structure represents the allowed energy states for electrons in a crystal.
  • a hot electron can be injected into an epitaxial oxide material, as shown in FIG.205A. If the hot electron has an energy above about half the bandgap of the epitaxial oxide material, then it can relax and form a pair of electrons with energy at the conduction band minimum. As shown in FIG.205B, the excess energy of the hot electron is transferred to a generated electron hole pair in the epitaxial oxide material.
  • FIG.206A shows a plot of energy versus bandgap of an epitaxial oxide material (including the conduction band edge, E c , and the valence band edge, E v ), where the dotted line shows the approximate threshold energy required by a hot electron to generate an excess electron-hole pair through an impact ionization process.
  • FIG.206B shows an example using ⁇ - Ga 2 O 3 with a bandgap of about 5 eV. In this example, the hot electron needs to have an excess energy of about 2.5 eV above the conduction band edge of the ⁇ -Ga 2 O 3 .
  • FIG.207A shows a schematic of an epitaxial oxide material with two planar contact layers (e.g., metals, or highly doped semiconductor contact materials and metal contacts) coupled to an applied voltage, V a .
  • FIG.207B shows a band diagram of the structure shown in FIG.207A along the growth (“z”) direction of the epitaxial oxide material.
  • the applied bias V a forms an electric field in the epitaxial oxide material, which can accelerate electrons injected into the epitaxial oxide material, thereby increasing their energy.
  • L II is minimum distance the hot electron must propagate before an impact ionization event probability becomes high, and an excess electron-hole pair is formed (i.e., carrier multiplication occurs).
  • the thickness of the epitaxial oxide material in the growth (“z”) direction needs to be thick enough, and the applied bias needs to be high enough to facilitate impact ionization.
  • the oxide material thickness can be about 1 ⁇ m, or from 500 nm to 5 ⁇ m, or more than 5 ⁇ m.
  • the applied bias can also be very high to form a large electric field, such as greater than 10 V, greater than 20 V, greater than 50 V, or greater than 100 V, or from 10 V to 50 V, or from 10 V to 100 V, or from 10 V to 200 V.
  • the high breakdown voltages achievable by epitaxial oxide materials is therefore also beneficial.
  • FIG.207C shows a band diagram of the structure shown in FIG.207A along the growth (“z”) direction of the epitaxial oxide material.
  • the epitaxial oxide has a gradient in bandgap (i.e., a graded bandgap) in the growth “z” direction, E c (z).
  • the graded bandgap can be formed, for example by a gradient in composition in the growth “z” direction, as described herein.
  • the epitaxial oxide layer can comprise (Al x Ga 1-x ) 2 O 3 where x is varies in the growth “z” direction.
  • the graded bandgap further increases the electric field, which further facilitates impact ionization.
  • the excess energy of the electrons increases as a function of propagation distance “z.” Pair production probability therefore also increases as a function of propagation distance “z.”
  • avalanche diodes e.g., for sensors, or LEDs.
  • FIG.207C also shows that the excess electron-hole pairs generated via impact ionization in epitaxial oxide layers can recombine radiatively to emit photons (with wavelength ⁇ g related to the bandgap of the material).
  • FIGS.207A-207C show a schematic of an example of an electroluminescent device including a high work function metal (“metal#1”), an ultra-high bandgap (“UWBG”) layer, a wide bandgap (“WBG”) epitaxial oxide layer, and a second metal contact (“metal#2”).
  • metal#1 high work function metal
  • UWBG ultra-high bandgap
  • WBG wide bandgap
  • metal#2 second metal contact
  • the bandgap of the WBG epitaxial oxide layer is selected for the desired optical emission wavelength, and is a direct bandgap.
  • the UWBG layer can also be an epitaxial oxide layer.
  • the UWBG layer is thin (e.g., the thickness (z b -z 1 ) is below 10 nm, or below 1 nm) and acts as a tunnel barrier for the injection of hot electrons into the WBG epitaxial oxide layer.
  • the work function of the metal, and the band edges of the UWBG and WBG epitaxial oxide layer are chosen such that the hot electrons have enough excess energy to generate an additional electron- hole pair via impact ionization. The injected and generated electron-hole pairs can then recombine to emit light of the desired wavelength.
  • FIGS.209A and 209B show schematics of examples of electroluminescent devices that are p-i-n diodes including a p-type semiconductor layer, an epitaxial oxide layer that is not intentionally doped (NID) and comprises an impact ionization region (IIR), and an n-type semiconductor layer.
  • the p-type and n-type semiconductor layers can be epitaxial oxide layers.
  • the p-type and n-type semiconductor layers can have wider bandgaps than the epitaxial oxide layer, to form heterostructures as shown in the figures.
  • the p-type and n-type semiconductor layers can be coupled to a high work function metal, and a second metal contact, respectively, such that bias can be applied to the structures.
  • the bandgap of the p-type semiconductor layer is E gp
  • the bandgap of the epitaxial oxide layer that is not intentionally doped (NID) and comprises an impact ionization region (IIR) is Eg IIR
  • the bandgap of the n-type semiconductor layer is E gn .
  • the NID epitaxial oxide layer has a graded bandgap, and the bandgaps of the n-type and p-type layers are different from one another, such that E gp > E gIIR at the interface between the p-type semiconductor layer and the NID epitaxial oxide layer, and E gn > E gIIR at the interface between the n-type semiconductor layer and the NID epitaxial oxide layer.
  • E gp > E gIIR at the interface between the p-type semiconductor layer and the NID epitaxial oxide layer and E gn > E gIIR at the interface between the n-type semiconductor layer and the NID epitaxial oxide layer.
  • Both of these examples can operate as LEDs, where injected electrons gain excess energy through the NID epitaxial oxide region, generate excess electron-hole pairs via impact ionization, and the generated electron-hole pairs can then recombine to emit photons.
  • the present disclosure provides a semiconductor structure, comprising an epitaxial oxide heterostructure, comprising: a substrate; a first epitaxial oxide layer comprising (Ni x1 Mg y1 Zn 1-x1-y1 )(Al q1 Ga 1-q1 ) 2 O 4 wherein 0 ⁇ x1 ⁇ 1, 0 ⁇ y1 ⁇ 1 and 0 ⁇ q1 ⁇ 1; and a second epitaxial oxide layer comprising (Ni x2 Mg y2 Zn 1-x2-y2 )(Al q2 Ga 1-q2 ) 2 O 4 wherein 0 ⁇ x2 ⁇ 1, 0 ⁇ y2 ⁇ 1 and 0 ⁇ q2 ⁇ 1, wherein at least one condition selected from x1 ⁇ x2, y1 ⁇ y2, and q
  • the substrate comprises MgO, LiF, or MgAl 2 O 4 .
  • the first epitaxial oxide layer comprises MgAl 2 O 4 .
  • the second epitaxial oxide layer comprises NiAl 2 O 4 .
  • the [1317] first epitaxial oxide layer comprises (Mg y1 Zn 1-y1 )Al 2 O 4 and the second epitaxial oxide layer comprises (Ni x1 Zn 1-x1 )Al 2 O 4 .
  • at least one of the first and the second epitaxial oxide layer has a cubic crystal symmetry.
  • first and the second epitaxial oxide layer is strained.
  • at least one of the first and the second epitaxial oxide layer is doped n-type or p-type.
  • the first and the second epitaxial oxide layer are layers of a unit cell of a superlattice.
  • the first and the second epitaxial oxide layer are layers of a chirp layer comprising alternating layers with layer thicknesses that change throughout the chirp layer.
  • a light emitting diode (LED) that emits light with a wavelength from 150 nm to 280 nm comprises the semiconductor structure.
  • a laser that emits light with a wavelength from 150 nm to 280 nm comprises the semiconductor structure.
  • a radiofrequency (RF) switch comprises the semiconductor structure.
  • a high electron mobility transistor (HEMT) comprises the semiconductor structure.
  • the substrate comprises MgO, LiF, or MgAl 2 O 4 .
  • the first epitaxial oxide layer comprises Ni 2 GeO 4 .
  • the second epitaxial oxide layer comprises Mg 2 GeO 4 .
  • the first epitaxial oxide layer comprises (Ni x1 Mg y1 ) 2 GeO 4 and the second epitaxial oxide layer comprises (Mg y1 Zn 1-x1-y1 ) 2 GeO 4 .
  • at least one of the first and the second epitaxial oxide layer has a cubic crystal symmetry.
  • first and the second epitaxial oxide layer is strained.
  • at least one of the first and the second epitaxial oxide layer is doped n-type or p-type.
  • first and the second epitaxial oxide layer are layers of a unit cell of a superlattice.
  • first and the second epitaxial oxide layer are layers of a chirp layer comprising alternating layers with layer thicknesses that change throughout the chirp layer.
  • a light emitting diode (LED) that emits light with a wavelength from 150 nm to 280 nm comprises the semiconductor structure.
  • a laser that emits light with a wavelength from 150 nm to 280 nm comprises the semiconductor structure.
  • a radiofrequency (RF) switch comprises the semiconductor structure.
  • a high electron mobility transistor (HEMT) comprising the semiconductor structure.
  • the present disclosure provides a semiconductor structure, comprising an epitaxial oxide heterostructure, comprising: a substrate; a first epitaxial oxide layer comprising (Mg x1 Zn 1-x1 )(Al y1 Ga 1-y1 ) 2 O 4 wherein 0 ⁇ x1 ⁇ 1 and 0 ⁇ y1 ⁇ 1; and a second epitaxial oxide layer comprising (Ni x2 Mg y2 Zn 1-x2-y2 ) 2 GeO 4 wherein 0 ⁇ x2 ⁇ 1 and 0 ⁇ y2 ⁇ 1.
  • the substrate comprises MgO, LiF, or MgAl 2 O 4 .
  • the first epitaxial oxide layer comprises MgGa 2 O 4 or MgAl 2 O 4 .
  • the second epitaxial oxide layer comprises Ni 2 GeO 4 or Mg 2 GeO 4 .
  • the first epitaxial oxide layer comprises (Mg x1 )(Al y1 Ga 1-y1 ) 2 O 4 and the second epitaxial oxide layer comprises (Ni x2 Mg y2 ) 2 GeO 4 .
  • at least one of the first and the second epitaxial oxide layer has a cubic crystal symmetry.
  • at least one of the first and the second epitaxial oxide layer is strained.
  • first and the second epitaxial oxide layer is doped n-type or p-type.
  • first and the second epitaxial oxide layer are layers of a unit cell of a superlattice.
  • first and the second epitaxial oxide layer are layers of a chirp layer comprising alternating layers with layer thicknesses that change throughout the chirp layer.
  • a light emitting diode (LED) that emits light with a wavelength from 150 nm to 280 nm comprises the semiconductor structure.
  • a laser that emits light with a wavelength from 150 nm to 280 nm comprises the semiconductor structure.
  • a radiofrequency (RF) switch comprises the semiconductor structure.
  • a high electron mobility transistor (HEMT) comprises the semiconductor structure.
  • the present disclosure provides a semiconductor structure, comprising an epitaxial oxide heterostructure, comprising: a substrate; a first epitaxial oxide layer comprising MgO; and a second epitaxial oxide layer comprising (Nix1Mgy1Zn 1-x 1- y1 )(Al q1 Ga 1-q1 ) 2 O 4 wherein 0 ⁇ x1 ⁇ 1, 0 ⁇ y1 ⁇ 1 and 0 ⁇ q1 ⁇ 1.
  • the substrate comprises MgO, LiF, or MgAl 2 O 4 .
  • the second epitaxial oxide layer comprises MgNi 2 O 4 or NiAl 2 O 4 .
  • the second epitaxial oxide layer comprises (Ni x1 Mg y1 )(Al q1 Ga 1- q1 ) 2 O 4 .
  • at least one of the first and the second epitaxial oxide layer has a cubic crystal symmetry.
  • at least one of the first and the second epitaxial oxide layer is strained.
  • at least one of the first and the second epitaxial oxide layer is doped n-type or p-type.
  • the first and the second epitaxial oxide layer are layers of a unit cell of a superlattice.
  • the first and the second epitaxial oxide layer are layers of a chirp layer comprising alternating layers with layer thicknesses that change throughout the chirp layer.
  • a light emitting diode (LED) that emits light with a wavelength from 150 nm to 280 nm comprising the semiconductor structure.
  • a laser that emits light with a wavelength from 150 nm to 280 nm comprises the semiconductor structure.
  • a radiofrequency (RF) switch comprises the semiconductor structure.
  • a high electron mobility transistor comprises the semiconductor structure.
  • the present disclosure provides a semiconductor structure, comprising an epitaxial oxide heterostructure, comprising: a substrate; a first epitaxial oxide layer comprising MgO; and a second epitaxial oxide layer comprising (Ni x2 Mg y2 Zn 1-x2-y2 ) 2 GeO 4 wherein 0 ⁇ x2 ⁇ 1 and 0 ⁇ y2 ⁇ 1.
  • the substrate comprises MgO, LiF, or MgAl 2 O 4 .
  • the second epitaxial oxide layer comprises Ni 2 GeO 4 or Mg 2 GeO 4 .
  • the second epitaxial oxide layer comprises (Ni x2 Mg y2 ) 2 GeO 4 .
  • at least one of the first and the second epitaxial oxide layer has a cubic crystal symmetry.
  • at least one of the first and the second epitaxial oxide layer is strained.
  • at least one of the first and the second epitaxial oxide layer is doped n-type or p-type.
  • the first and the second epitaxial oxide layer are layers of a unit cell of a superlattice.
  • the first and the second epitaxial oxide layer are layers of a chirp layer comprising alternating layers with layer thicknesses that change throughout the chirp layer.
  • a light emitting diode (LED) that emits light with a wavelength from 150 nm to 280 nm comprises the semiconductor structure.
  • a laser that emits light with a wavelength from 150 nm to 280 nm comprises the semiconductor structure.
  • RF radiofrequency
  • a high electron mobility transistor (HEMT) comprises the semiconductor structure.
  • the present disclosure provides a semiconductor structure, comprising an epitaxial oxide heterostructure, comprising: a substrate; a first epitaxial oxide layer comprising Li(Al x1 Ga 1-x1 )O 2 wherein 0 ⁇ x1 ⁇ 1; and a second epitaxial oxide layer comprising (Al x2 Ga 1-x2 ) 2 O 3 wherein 0 ⁇ x2 ⁇ 1.
  • the substrate comprises LiGaO 2 (001), LiAlO 2 (001), AlN(110), or SiO 2 (100).
  • the substrate comprises a crystalline material and a template layer of Al(111).
  • the first epitaxial oxide layer comprises LiGaO 2 .
  • the second epitaxial oxide layer comprises LiAlO 2 .
  • at least one of the first and the second epitaxial oxide layer has a cubic crystal symmetry.
  • at least one of the first and the second epitaxial oxide layer is strained.
  • at least one of the first and the second epitaxial oxide layer is doped n-type or p-type.
  • the first and the second epitaxial oxide layer are layers of a unit cell of a superlattice.
  • the first and the second epitaxial oxide layer are layers of a chirp layer comprising alternating layers with layer thicknesses that change throughout the chirp layer.
  • a light emitting diode (LED) that emits light with a wavelength from 150 nm to 280 nm comprises the semiconductor structure.
  • a laser that emits light with a wavelength from 150 nm to 280 nm comprises the semiconductor structure.
  • RF radiofrequency
  • HEMT high electron mobility transistor
  • a metal oxide refers to one or more than one metal oxide.

Abstract

L'invention concerne une structure semi-conductrice pouvant comprendre deux matériaux d'oxyde épitaxial ou plus présentant des propriétés différentes, telles que des compositions, des symétries cristallines ou des bandes interdites. Les structures semi-conductrices peuvent comprendre une ou plusieurs couches d'oxyde épitaxial formées sur un substrat compatible avec des paramètres de réseau dans le plan et des positions atomiques qui fournissent un gabarit approprié pour la croissance des matériaux d'oxyde épitaxial. Un ou plusieurs des matériaux d'oxyde épitaxial peuvent être contraints. Un ou plusieurs des matériaux d'oxyde épitaxial peuvent être de type n ou p dopé. La structure semi-conductrice peut comprendre un super-réseau avec des matériaux d'oxyde épitaxial. La structure semi-conductrice peut comprendre une couche de fluctuation de longueur d'onde avec des matériaux d'oxyde épitaxial. Les structures semi-conductrices peuvent être une partie d'un dispositif semi-conducteur, tel qu'un dispositif optoélectronique, une diode électroluminescente, une diode laser, un photodétecteur, une cellule solaire, une diode haute puissance, un transistor haute puissance, un transducteur ou un transistor à haute mobilité d'électrons.
PCT/IB2021/060466 2021-11-10 2021-11-11 Matériaux d'oxyde épitaxial, structures et dispositifs WO2023084283A1 (fr)

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US17/652,028 US11522103B1 (en) 2021-11-10 2022-02-22 Epitaxial oxide materials, structures, and devices
US17/652,019 US20230143766A1 (en) 2021-11-10 2022-02-22 Epitaxial oxide materials, structures, and devices
US17/652,031 US11563093B1 (en) 2021-11-10 2022-02-22 Epitaxial oxide materials, structures, and devices
US17/658,510 US20230143918A1 (en) 2021-11-10 2022-04-08 Epitaxial oxide high electron mobility transistor
US17/658,506 US11522087B1 (en) 2021-11-10 2022-04-08 Epitaxial oxide integrated circuit
US17/658,501 US11489090B1 (en) 2021-11-10 2022-04-08 Epitaxial oxide field effect transistor
US17/658,515 US11637013B1 (en) 2021-11-10 2022-04-08 Epitaxial oxide high electron mobility transistor
US17/664,569 US20230142940A1 (en) 2021-11-10 2022-05-23 Epitaxial oxide device with impact ionization
US17/664,577 US20230142457A1 (en) 2021-11-10 2022-05-23 Method and epitaxial oxide device with impact ionization
TW111141647A TW202327095A (zh) 2021-11-10 2022-11-01 磊晶氧化物材料、結構及裝置
US18/480,323 US20240072205A1 (en) 2021-11-10 2023-10-03 Epitaxial oxide materials, structures, and devices
US18/480,334 US20240055560A1 (en) 2021-11-10 2023-10-03 Epitaxial oxide materials, structures, and devices

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IBPCT/IB2021/060427 2021-11-10
PCT/IB2021/060414 WO2023084275A1 (fr) 2021-11-10 2021-11-10 Dispositifs semi-conducteurs à bande interdite ultra-large comprenant des oxydes de magnésium-germanium
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US17/652,028 Continuation US11522103B1 (en) 2021-11-10 2022-02-22 Epitaxial oxide materials, structures, and devices
US17/658,501 Continuation US11489090B1 (en) 2021-11-10 2022-04-08 Epitaxial oxide field effect transistor
US17/658,506 Continuation US11522087B1 (en) 2021-11-10 2022-04-08 Epitaxial oxide integrated circuit
US17/658,515 Continuation US11637013B1 (en) 2021-11-10 2022-04-08 Epitaxial oxide high electron mobility transistor
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