WO2023081479A2 - Methods and systems of tib2 products with directing features - Google Patents

Methods and systems of tib2 products with directing features Download PDF

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Publication number
WO2023081479A2
WO2023081479A2 PCT/US2022/049159 US2022049159W WO2023081479A2 WO 2023081479 A2 WO2023081479 A2 WO 2023081479A2 US 2022049159 W US2022049159 W US 2022049159W WO 2023081479 A2 WO2023081479 A2 WO 2023081479A2
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WO
WIPO (PCT)
Prior art keywords
product
tieh
substrate
aluminum metal
solid aluminum
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2022/049159
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English (en)
French (fr)
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WO2023081479A3 (en
Inventor
Xinghua Liu
Benjamin D. Mosser
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alcoa USA Corp
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Alcoa USA Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2024526619A priority Critical patent/JP2024541277A/ja
Priority to MX2024005548A priority patent/MX2024005548A/es
Priority to CA3237365A priority patent/CA3237365A1/en
Priority to EP22890892.7A priority patent/EP4430232A4/en
Priority to CN202280080593.XA priority patent/CN118382726A/zh
Priority to AU2022382853A priority patent/AU2022382853A1/en
Application filed by Alcoa USA Corp filed Critical Alcoa USA Corp
Publication of WO2023081479A2 publication Critical patent/WO2023081479A2/en
Publication of WO2023081479A3 publication Critical patent/WO2023081479A3/en
Priority to US18/657,321 priority patent/US20240286966A1/en
Anticipated expiration legal-status Critical
Priority to DKPA202430270A priority patent/DK202430270A1/en
Ceased legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
    • C04B41/81—Coating or impregnation
    • C04B41/85—Coating or impregnation with inorganic materials
    • C04B41/88—Metals
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/515—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
    • C04B35/58—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides
    • C04B35/5805—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides based on borides
    • C04B35/58064—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides based on borides based on refractory borides
    • C04B35/58071—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides based on borides based on refractory borides based on titanium borides
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/64—Burning or sintering processes
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B38/00—Porous mortars, concrete, artificial stone or ceramic ware; Preparation thereof
    • C04B38/06—Porous mortars, concrete, artificial stone or ceramic ware; Preparation thereof by burning-out added substances by burning natural expanding materials or by sublimating or melting out added substances
    • C04B38/0615—Porous mortars, concrete, artificial stone or ceramic ware; Preparation thereof by burning-out added substances by burning natural expanding materials or by sublimating or melting out added substances the burned-out substance being a monolitic element having approximately the same dimensions as the final article, e.g. a porous polyurethane sheet or a prepreg obtained by bonding together resin particles
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/009—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone characterised by the material treated
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
    • C04B41/50—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with inorganic materials
    • C04B41/51—Metallising, e.g. infiltration of sintered ceramic preforms with molten metal
    • C04B41/515—Other specific metals
    • C04B41/5155—Aluminium
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25C—PROCESSES FOR THE ELECTROLYTIC PRODUCTION, RECOVERY OR REFINING OF METALS; APPARATUS THEREFOR
    • C25C3/00—Electrolytic production, recovery or refining of metals by electrolysis of melts
    • C25C3/06—Electrolytic production, recovery or refining of metals by electrolysis of melts of aluminium
    • C25C3/08—Cell construction, e.g. bottoms, walls, cathodes
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25C—PROCESSES FOR THE ELECTROLYTIC PRODUCTION, RECOVERY OR REFINING OF METALS; APPARATUS THEREFOR
    • C25C3/00—Electrolytic production, recovery or refining of metals by electrolysis of melts
    • C25C3/06—Electrolytic production, recovery or refining of metals by electrolysis of melts of aluminium
    • C25C3/24—Refining
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25C—PROCESSES FOR THE ELECTROLYTIC PRODUCTION, RECOVERY OR REFINING OF METALS; APPARATUS THEREFOR
    • C25C7/00—Constructional parts, or assemblies thereof, of cells; Servicing or operating of cells
    • C25C7/02—Electrodes; Connections thereof
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    • C04B2111/00—Mortars, concrete or artificial stone or mixtures to prepare them, characterised by specific function, property or use
    • C04B2111/00474—Uses not provided for elsewhere in C04B2111/00
    • C04B2111/0087—Uses not provided for elsewhere in C04B2111/00 for metallurgical applications
    • C04B2111/00879—Non-ferrous metallurgy
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30—Constituents and secondary phases not being of a fibrous nature
    • C04B2235/38—Non-oxide ceramic constituents or additives
    • C04B2235/3804—Borides
    • C04B2235/3813—Refractory metal borides
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/60—Aspects relating to the preparation, properties or mechanical treatment of green bodies or pre-forms
    • C04B2235/602—Making the green bodies or pre-forms by moulding
    • C04B2235/6028—Shaping around a core which is removed later
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/70—Aspects relating to sintered or melt-casted ceramic products
    • C04B2235/74—Physical characteristics
    • C04B2235/77—Density
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
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    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/70—Aspects relating to sintered or melt-casted ceramic products
    • C04B2235/94—Products characterised by their shape
    • C04B2235/945—Products containing grooves, cuts, recesses or protusions

Definitions

  • Aluminum has been traditionally made from alumina (A12O3) that has been originated from bauxite ore.
  • the conversion of alumina (A12O3) to aluminum has been typically carried out via a smelting method that entails dissolving the alumina (A12O3) in cryolite, a molten solvent, and then passing an electric current through the mixture, causing carbon from a carbon anode to attach to the oxygen component in the dissolved alumina (A12O3), yielding aluminum and carbon dioxide as a by-product.
  • Various efforts have been made to purify aluminum including the “Hoopes process” (see U.S. Patent No. 1,534,315) as well as those methods described in commonly owned international patent application WO2016/130823.
  • the present disclosure relates to methods and products involving a titanium diboride (TiB 2 ) substrate or a structure directing a TiB 2 wettable material in a predetermined direction using a directing feature.
  • the TiB 2 substrate structure can be covered with a solid aluminum metal before contacting the TiB 2 wettable material.
  • the directing feature directs the TiB 2 wettable material in a predetermined direction.
  • the directing feature can take many shapes and sizes.
  • the directing feature can be slots, grooves, pores, or combinations thereof.
  • the TiB 2 substrate with the at least one directing feature can be used in a variety of applications including moving fluid in a product.
  • the TiB 2 wettable material may be any suitable metal for transfer via the TiB 2 substrates.
  • the TiB 2 wettable material is aluminum, such as aluminum alloy, metallic aluminum, and combinations thereof.
  • the present disclosure includes a product with a TiB 2 substrate that includes a directing feature, wherein the directing feature is configured to direct TiB 2 wettable material in a predetermined direction.
  • the TiB 2 wettable material includes aluminum.
  • the aluminum is selected from the group consisting of an aluminum alloy, metallic aluminum, and combinations thereof.
  • a surface of the TiEh substrate is at least partially covered in solid aluminum metal.
  • the directing feature is selected from the group consisting of slots, grooves, pores, and combinations thereof on the structure, e.g., the TiEh substrate.
  • the TiEh substrate has a solid geometric form.
  • the solid geometric form has at least one three-dimensional form of rectangle-shaped, square-shaped, triangle-shaped, oval-shaped, or oblong-shaped, among others.
  • the TiEh substrate has a non-symmetrical form.
  • the TiEh substrate is in the form of a plate.
  • the TiEh substrate is configured for use in an aluminum purification cell. In some embodiments, the TiEh substrate is configured for use in an aluminum electrolysis cell. In some embodiments, the directing feature directs the TiEh wettable material via capillary action. In some embodiments, the directing feature includes pores. In some embodiments, the directing feature includes a porosity of the TiEh substrate. In some embodiments, the porosity ranges from about 1 to about 200 pores per inch (PPI). In some embodiments, the porosity is at least about 5 pores per inch (PPI), or at least about 10 pores per inch (PPI), or at least about 15 pores per inch (PPI), or at least about 20 pores per inch (PPI).
  • the porosity is not greater than about 175 pores per inch (PPI), or not greater than about 150 pores per inch (PPI), or not greater than about 125 pores per inch (PPI), or not greater than about 100 pores per inch (PPI), or not greater than about 80 pores per inch (PPI), or not greater than about 60 pores per inch (PPI), or not greater than about 50 pores per inch (PPI).
  • the directing feature includes at least one slot that is open or closed, wherein the at least one slot extends through a thickness of the Ti Eh substrate. In some embodiments, dimensions of the at least one slot are predetermined.
  • the TiEh substrate includes a first prong and a second prong, and wherein the directing feature includes a slot defined between an inner surface of the first prong and an inner surface of the second prong.
  • the slot extends an entire length (1) of the first prong and an entire length (1) of the second prong. In some embodiments, the entire length (1) of the first prong and the entire length (1) of the second prong range from about 0.01 meters to about 1 meter.
  • a thickness (t) of the first prong and a thickness (t) of the second prong range from about 1 mm to about 20 mm.
  • the slot extends a distance (d) between the inner surface of the first prong and the inner surface of the second prong. In some embodiments, the distance (d) ranges from about 20 pm to about 20 mm. In some embodiments, a width (w) of the first prong and a width (w) of the second prong range from about 1 mm to about 20 mm.
  • the slot is fully closed.
  • the directing feature becomes a fully enclosed channel.
  • the at least one slot is partially closed, i.e., a partially closed slot.
  • a partially closed slot comprises a closed lateral width opening.
  • the lateral width opening of the at least one slot can be fully closed and extend continuously for a portion of a length of the slot.
  • the lateral width opening of the at least one slot can be partially closed for a whole length of the slot.
  • an amount of closure of the lateral width opening of the at least one slot can vary along the length of the slot.
  • the substrate may include at least one channel.
  • the channel can be any length, width, size, or shape.
  • the channel extends substantially parallel to a longitudinal axis of the substrate.
  • the channel extends at an angle to a longitudinal axis of the substrate.
  • more than one channel can converge to a single channel.
  • a single channel can split into more than one channel.
  • a cross-section of the channel can be any shape or size.
  • the cross-section is substantially constant across a length of the channel.
  • the cross-section is variable across a length of the channel.
  • the crosssection can increase and/or decrease along a length of the channel.
  • the directing feature includes a structure having at least one groove.
  • the at least one groove extends partially into the TiEh substrate.
  • the dimensions of the at least one groove are predetermined.
  • a size and/or a shape of the at least one groove are predetermined.
  • a width (w) of the at least one groove ranges from about 10 pm to about 20 mm.
  • a groove depth (gd) of the at least one groove ranges from about 1 mm to about 10 mm.
  • a length (1) of the at least one groove ranges from about 1 cm to about 1 m.
  • a thickness (t) of the TiEh substrate ranges from about 5 mm to about 30 mm.
  • the directing feature includes at least two grooves in the TiEh substrate.
  • an edge-to-edge distance (d) between the at least two grooves ranges from about 1 mm to about 20 mm.
  • the present disclosure includes a product having (a) a TiEh substrate including at least one directing feature and (b) solid aluminum metal at least partially covering surfaces of the TiEh substrate.
  • the solid aluminum metal is at least partially contained within the at least one directing feature.
  • the TiB2 substrate includes a structure having a surface area, wherein a first portion of the surface area includes the at least one directing feature, and wherein a second portion of the surface area is absent of any directing feature.
  • the first portion of the surface area is at least partially covered by the solid aluminum metal.
  • the first portion of the surface area is at least 1% covered by the solid aluminum metal.
  • the second portion of the surface area is at least partially covered by the solid aluminum metal.
  • the second portion of the surface area is at least 1% covered by the solid aluminum metal.
  • the solid aluminum metal covering the second portion of the surface area is in the form of a film.
  • the film includes a thickness of from 1 pm to 500 pm.
  • the second portion of the surface area is absent of the solid aluminum metal.
  • At least one directing feature includes a void volume, and wherein at least 1% of the void volume contains the solid aluminum metal.
  • the at least one directing feature is a structure having a slot, and wherein the solid aluminum metal is at least partially contained within the slot.
  • the at least one slot includes a slot volume, and wherein the solid aluminum metal occupies at least 1% of the slot volume.
  • the at least one directing feature is a groove, and wherein the solid aluminum metal is at least partially contained within the groove.
  • the at least one groove includes a groove volume, and wherein the solid aluminum metal occupies at least 1% of the groove volume.
  • the directing feature is in or on the substrate (e.g., the TiEh substrate or the ceramic substrate).
  • the present disclosure includes a product with (a) a web of TiEh and (b) solid aluminum metal at least partially covering surfaces of the web of TiEh.
  • the web of TiEh defines a porosity of the web of Ti Eh.
  • the solid aluminum metal includes porosity.
  • the porosity of the web of TiB2 defines a porous volume of the TiB2, and wherein the solid aluminum metal occupies at least 1% of the porous volume.
  • the present disclosure includes a method including producing a TiB2 product with at least one directing feature and directing a TiB2 wettable material in a predetermined direction via the at least one directing feature.
  • the producing step includes creating the TiEh product having a plurality of pores.
  • the producing step includes creating a geometric feature.
  • the producing step includes machining the TiEh product or a TiEh product precursor to create the at least one directing feature.
  • the producing step includes extruding a TiB2 feedstock into a TiEh product precursor wherein the TiEh product precursor includes the at least on directing feature therein.
  • the TiEh product precursor is a green TiEh material.
  • the method includes exposing the green TiEh material to an elevated temperature, thereby creating the TiEh product.
  • the at least one directing feature in the TiEh substrate may include grooves, slots, channels, or combinations thereof.
  • the present disclosure includes an aluminum purification cell or an aluminum electrolysis cell having any of the TiEh substrates described herein.
  • at least one of the TiEh substrates is an electrode.
  • at least one of the TiEh substrates is a directing apparatus, wherein the directing apparatus is configured to direct liquid aluminum metal (e.g., molten aluminum metal) in a predetermined direction in an absence of an applied electrical current.
  • any ceramic and/or cermet substrate having a directing feature can be used with any wettable metal.
  • any wettable metal can be any suitable metal for transfer via the ceramic and/or cermet substrates.
  • the suitable metal may be aluminum, such as aluminum alloy, metallic aluminum, and combinations thereof.
  • the suitable metal may be copper, such as a copper alloy, metallic copper, and combinations thereof.
  • the wettable material consists essentially of aluminum, magnesium, copper, and combinations thereof. In some embodiments, the wettable material is predominantly aluminum.
  • the present disclosure relates to a product with a ceramic substrate or a cermet substrate having a directing feature, wherein the directing feature is configured to direct ceramic wettable material or cermet wettable material in a predetermined direction.
  • the substrate is a ceramic substrate.
  • the ceramic substrate is one of a TiEh substrate, a ZrEh substrate, or a ElfEh substrate.
  • the ceramic wettable material is aluminum, such as aluminum alloy, metallic aluminum, and combinations thereof.
  • the substrate can be a carbon-based (carbonaceous) material.
  • the carbon-based material can be an inorganic, carbon-based material. Suitable carbon-based materials may include, for instance, amorphous and crystalline forms of carbon.
  • a carbon-based material comprises graphite.
  • the substate comprises a pre-baked carbon electrode material.
  • Carbon-based substrates may include a plated material to facilitate wetting of the suitable metal, e.g., of the aluminum.
  • the substrate can be a non-carbonaceous material.
  • Non- carbonaceous materials are any materials that are not carbon-based.
  • Non-carbonaceous materials include, for instance, ceramic materials and cermet materials.
  • the substrate can be ceramic or cermet.
  • Ceramic materials include inorganic, non-metallic materials.
  • Inorganic, non- metallic materials can include boride, oxide, nitride, or carbide materials.
  • ceramic materials include titanium.
  • ceramic materials include metal borides (e.g., metal diborides).
  • metal diboride materials include TiEh, ZrEh, HfEh, or SrEh.
  • Cermet materials are a material of ceramic and metal materials. Cermet materials can include a ceramic matrix bonded by a metallic binder. In some embodiments, the cermet material includes copper (Cu), nickel (Ni), chromium (Cr), tungsten (W), molybdenum (Mo), iron (Fe), cobalt (Co), or an alloy or combinations thereof. In some embodiments, cermet materials include nickel-titanium carbide or nickel-titanium diboride.
  • the substrate comprises, consists essentially of, or consists of the stated material. In one embodiment, the substrate consists essentially of or consists of a ceramic. In one embodiment, the substrate consists essentially of or consists of a cermet. In one embodiment, the substrate consists essentially of or consists of a carbon-based material.
  • the substrate is a plated material that facilitates wetting.
  • the plated material is a ceramic and/or a cermet such as any of the ceramic or cermet materials described herein.
  • the substrate is carbon-based material plated with a ceramic, e.g., TiEh.
  • FIG. 1A illustrates one embodiment of a method for directing a TiEh wettable material in a predetermined direction using a directing feature.
  • FIG. IB illustrates another embodiment of a method for directing a Ti Eh wettable material in a predetermined direction using a directing feature.
  • FIG. 2A is a perspective view of an embodiment of a product with a TiEh substrate having a plurality of slots as directing features.
  • FIG. 2B is a first side view of the embodiment shown in FIG. 2A.
  • FIG. 2C is an enlarged partial section view of the embodiment shown in FIG. 2A indicated by the circle of dashed lines in FIG. 2A.
  • FIG. 3A is a front view of an embodiment of a product with a Ti Eh substrate having a slot as a directing feature.
  • FIG. 3B is a section view of a cross-section taken along the dashed line 3B shown in FIG. 3A.
  • FIG. 3C is a first side view of the embodiment shown in FIG. 3A.
  • FIG. 4A is a front view of an embodiment of a product with a Ti Eh substrate having a plurality of grooves as directing features.
  • FIG. 4B is a first side view of the embodiment shown in FIG. 4A.
  • FIG. 4C is an enlarged partial section view of the embodiment shown in FIG. 4A indicated by the circle of dashed lines in FIG. 4A.
  • FIG. 4D is an alternative configuration of the plurality of grooves of the embodiment shown in FIG. 4C.
  • FIG. 5A is a side view of another embodiment of a product with a TiEh substrate having a plurality of pores as directing features.
  • FIG. 5B is a close-up view of a portion of the embodiment shown in FIG. 5A indicated by dashed lines in FIG. 5A.
  • FIG. 6A is a perspective view of an embodiment of a product with a TiEh substrate having a plurality of slots as directing features and a solid aluminum metal covering the TiEh substrate.
  • FIG. 6B is a first side view of a cross-section taken along the arrows 6B shown in FIG. 6A.
  • FIG. 6C is an enlarged partial section view of the embodiment shown in FIG. 6A indicated by the circle of dashed lines in FIG. 6A.
  • FIG. 6D is a cross-sectional side view of an embodiment of a product with a TiEh substrate having a plurality of slots as directing features and a solid aluminum metal covering an upper portion of the TiEh substrate.
  • FIG. 6E is a partial cross-section taken along the dashed line 6E shown in FIG. 6D where only one of the slots of the plurality of slots is shown.
  • the cross-section is along the upper portion of the TiEh substrate where there is solid aluminum metal.
  • FIG. 6F is a partial cross-section taken along the dashed line 6F shown in FIG. 6D where only one of the slots of the plurality of slots is shown.
  • the cross-section is along the lower portion of the TiEh substrate where there is no solid aluminum metal.
  • FIG. 6G is a cross-sectional side view of an embodiment of a Ti Eh substrate having a plurality of slots as directing features and a solid aluminum metal covering half of the TiEh substrate, the front portion.
  • FIG. 6H is a partial cross-section taken along the dashed line 6H as shown in FIG. 6G where only one of the slots of the plurality of slots is shown.
  • FIG. 61 is a side view of an embodiment of a TiEh substrate having a plurality of slots as directing features and a solid aluminum metal in the plurality of slots.
  • FIG. 6J is a partial cross-section taken along the dashed line 6J as shown in FIG. 61 where only one of the slots of the plurality of slots is shown.
  • FIG. 6K is a front view of an embodiment of a TiEh substrate having a plurality of slots as directing features and a solid aluminum metal covering some or none of the slots.
  • FIG. 6L is a first side view of the embodiment shown in FIG. 6K.
  • FIG. 6M is a front view of an embodiment of a TiEh substrate with a surface area having a first portion of the surface area with a plurality of slots as directing features and a second portion of the surface area being absent of any directing feature.
  • FIG. 6N is a first side view of the embodiment shown in FIG. 6M with the second portion of the surface area being absent of any directing feature.
  • FIG. 7A is a front view of an embodiment of a product with a Ti Eh substrate having a slot as a directing feature and a solid aluminum metal covering the TiEh substrate.
  • FIG. 7B is a cross-section taken along the dashed line 7B shown in FIG. 7 A.
  • FIG. 7C is a first side view of a cross-section taken along the line 7C shown in FIG.
  • FIG. 7D is a front view of an embodiment of a product of a TiEh substrate having a slot as a directing feature and a solid aluminum metal covering a portion of the slot.
  • FIG. 7E is a cross-section taken along the dashed line 7E shown in FIG. 7D.
  • FIG. 7F is a first side view of the embodiment shown in FIG. 7F.
  • FIG. 8A is a front view of an embodiment of a product with a TiEh substrate having a plurality of grooves as directing features and a solid aluminum metal covering the TiEh substrate.
  • FIG. 8B is a first side view of a cross-section taken along line 8B shown in FIG. 8A.
  • FIG. 8C is an enlarged partial section view of the embodiment shown in FIG. 8A indicated by the circle of dashed lines in FIG. 8A.
  • FIG. 8D is a rear view of an embodiment of a product of a TiB2 substrate having a plurality of grooves as directing features and a solid aluminum metal covering the front half of the TiB2 substrate.
  • FIG. 8E is a first side view of a cross-section taken along line 8E shown in FIG. 8D.
  • FIG. 8F is an enlarged partial section view of the embodiment shown in FIG. 8D indicated by the circle of dashed lines in FIG. 8F.
  • FIG. 9 is a close-up view of a portion of an embodiment with pores and solid aluminum metal, in accordance with some embodiments.
  • FIG. 10 is a frontal view of a TiB2 foam sintered end product that was used in labscale testing.
  • FIG. 11 is a frontal view of four TiB2 foam samples that were used in lab-scale testing, the samples having porosities of about 10, 20, 30, and 45 pores per inch (“PPI”).
  • FIG. 12 is a schematic cut-away side view of three crucibles that were used in labscale testing, each including four TiB2 foam samples submerged (partially or completely) in molten aluminum for 48 hours.
  • FIG. 13A is a frontal view of a TiB2 foam sample from a crucible that was used in lab-scale testing after it was fully submerged for about 48 hours in molten aluminum.
  • FIG. 13B is a frontal view of a TiEh foam sample from a crucible that was used in lab-scale testing after it was partially submerged for about 48 hours in molten aluminum.
  • the term “or” is an inclusive “or” operator, and is equivalent to the term “and/or,” unless the context clearly dictates otherwise.
  • the term “based on” is not exclusive and allows for being based on additional factors not described, unless the context clearly dictates otherwise.
  • the meaning of “a,” “an,” and “the” include plural references.
  • the meaning of “in” includes “in” and “on.
  • aluminum-wettable means having a contact angle with molten aluminum of not greater than 90 degrees.
  • TiEh wetable material means having a contact angle with TiEh of not greater than 90 degrees.
  • slot means a geometric feature that extends through a thickness of a TiEh substrate
  • groove means a geometric feature that extends partially through, but not all the way through, through a thickness of a TiEh substrate
  • geometric feature means a predetermined shape created in a TiEh substrate. Examples include slots and grooves of any shape or size.
  • TiEh substrate means a substrate made of TiEh that is capable of including at least one directing feature.
  • TiEh substrates include blocks, plates, rod, wires, and wools, among others, made of TiEh.
  • a TiEh substrate consists essentially of TiEh.
  • aluminum covered TiEh substrate means a TiEh substrate at least partially covered by aluminum metal, wherein the aluminum metal is metallic aluminum and/or an aluminum alloy.
  • the aluminum metal is at least partially contained in at least one directing feature of a TiEh substrate.
  • the aluminum metal at least partially covers outer surfaces of a TiEh substrate.
  • the aluminum metal covers at least 5% of the surface area of a TiEh substrate.
  • the aluminum metal covers at least 10% of the surface area of a TiEh substrate.
  • the aluminum metal covers at least 15% of the surface area of a TiEh substrate.
  • the aluminum metal covers at least 20% of the surface area of a TiEh substrate.
  • the aluminum metal covers at least 25% of the surface area of a TiEh substrate. In one embodiment, the aluminum metal covers at least 30% of the surface area of a TiEh substrate. In one embodiment, the aluminum metal covers at least 35% of the surface area of a TiEh substrate. In one embodiment, the aluminum metal covers at least 40% of the surface area of a TiEh substrate. In one embodiment, the aluminum metal covers at least 45% of the surface area of a TiEh substrate. In one embodiment, the aluminum metal covers at least 50% of the surface area of a TiEh substrate. In one embodiment, the aluminum metal covers at least 55% of the surface area of a TiEh substrate. In one embodiment, the aluminum metal covers at least 60% of the surface area of a TiEh substrate.
  • the aluminum metal covers at least 65% of the surface area of a TiEh substrate. In one embodiment, the aluminum metal covers at least 70% of the surface area of a TiEh substrate. In one embodiment, the aluminum metal covers at least 75% of the surface area of a TiEh substrate. In one embodiment, the aluminum metal covers at least 80% of the surface area of a TiEh substrate. In one embodiment, the aluminum metal covers at least 85% of the surface area of a TiEh substrate. In one embodiment, the aluminum metal covers at least 90% of the surface area of a TiEh substrate. In one embodiment, the aluminum metal covers at least 91% of the surface area of a TiB2 substrate. In one embodiment, the aluminum metal covers at least 92% of the surface area of a TiB2 substrate.
  • the aluminum metal covers at least 93% of the surface area of a TiB2 substrate. In one embodiment, the aluminum metal covers at least 94% of the surface area of a TiB2 substrate. In one embodiment, the aluminum metal covers at least 95% of the surface area of a TiB2 substrate. In one embodiment, the aluminum metal covers at least 96% of the surface area of a TiB2 substrate. In one embodiment, the aluminum metal covers at least 97% of the surface area of a TiB2 substrate. In one embodiment, the aluminum metal covers at least 98% of the surface area of a TiB2 substrate. In one embodiment, the aluminum metal covers at least 99% of the surface area of a TiB2 substrate. In one embodiment, the aluminum metal covers at least 100% of the surface area of a TiB2 substrate.
  • plated material and the like means a film, coating, or other thin covering in contact with at least a portion of an outer surface of a substrate, and irrespective how the plated material was produced on the substrate, i.e., plating includes all manners of applying a film, coating, or thin covering to a substrate.
  • FIG. 1A illustrates one embodiment of a method 100 for directing a TiB2 wettable material in a predetermined direction using a directing feature.
  • Step 102 is an optional step as indicated by the dashed lines of the box in FIG. 1A.
  • the step 102 includes covering a TiB2 substrate with solid aluminum metal. Varying amount of the TiB2 substrate can be covered with solid aluminum metal. In some embodiments, all of the TiB2 substrate can be covered. Some portions of the TiB2 substrate can be covered with solid aluminum metal while other portions of the TiB2 substrate are absent solid aluminum. The solid aluminum metal coverage can vary depending on the application of the TiB2 substrate.
  • Step 104 includes contacting the TiB2 substrate with a TiB2 wettable material.
  • Step 106 includes directing the TiB2 wettable material in a desired direction.
  • FIG. IB illustrates another embodiment of a method 110 for directing a TiB2 wettable material in a predetermined direction using a directing feature.
  • the producing step 112 includes producing a TiB2 product with at least one directing feature.
  • the producing step 112 can include creating a TiB2 product structure having a plurality of pores.
  • the producing step 112 can include creating a geometric feature.
  • the producing step 112 can include machining a TiEh product or a TiEh product precursor structure to create at least one directing feature.
  • the directing feature found in or on the product or product precursor structure can be slots, grooves, pores, and combinations thereof.
  • the directing features can include a void volume. In some embodiments, at least 1% of the void volume contains the solid aluminum metal.
  • the directing feature can direct the TiEh wettable material via capillary action.
  • the producing step 112 can include extruding a TiEh feedstock into a TiEh product precursor wherein the TiEh product precursor includes at least on directing feature therein.
  • the TiEh product precursor is a green TiEh material.
  • the producing step 112 can include exposing the green TiEh material to an elevated temperature, thereby creating the TiB2 product.
  • the directing step 114 includes directing a TiEh wettable material in a predetermined direction via the at least one directing feature.
  • FIG. 2A is a perspective view of an embodiment of a product 200 with a TiEh substrate 202 having a plurality of slots 206 as directing features.
  • the slots 206 are defined between prongs 204.
  • the TiEh substrate 202 also includes a base 208 and a tip 210.
  • the slots 206 are configured to direct TiEh wettable material in a predetermined direction.
  • the TiEh wettable material can include aluminum, such as an aluminum alloy, metallic aluminum, and combinations thereof.
  • FIG. 2B is a first side view of the embodiment shown in FIG. 2A.
  • FIG. 2B shows a side view of the product 200 showing the prongs 204.
  • the prongs 204 include a length (1) that extends from the top of the base 208 to the end of the tip 210.
  • the tip 210 can have any of a variety of geometries including a point, a rounded curvature, or a jagged edge, among others.
  • FIG. 2C is an enlarged partial section view of the embodiment shown in FIG. 2A indicated by the circle of dashed lines in FIG. 2A.
  • the partial top view only shows two of the prongs 204. That is, FIG. 2C shows a first prong 204A and a second prong 204B defining a first slot 206A.
  • the first slot 206A is defined by an inner surface of the first prong 204A and an inner surface of the second prong 204B.
  • FIG. 3A is a front view of an embodiment of a product 300 with a TiB2 substrate 302 having a slot 306 as a directing feature.
  • the slot 306 is defined by a first prong 304A and a second prong 304B (collectively, prongs 304).
  • the TiB2 substrate 302 also includes a base 308 and a tip 310.
  • the slots 306 are configured to direct TiB2 wettable material in a predetermined direction. A width (w) of one of the prongs is also shown.
  • FIG. 3B is a section view of a cross-section taken along the dashed line 3B shown in FIG. 3A.
  • FIG. 3B shows a thickness (t) of the prongs 304 and a distance (d) the slot 306 extends between the inner surface of the first prong 304A and the inner surface of the second prong 304B.
  • FIG. 3C is a first side view of the embodiment (e.g., the product 300) shown in FIG. 3A.
  • FIG. 3C displays a length (1) of the prongs 304.
  • FIGs. 2A-2C and FIGs. 3A-3C will be described together, as they are similar.
  • the embodiment of FIGs. 2A-2C differs from the embodiment of FIGs. 3A-3C in the number of prongs 204/304, the number of slots 206/306, and thickness (t) of the prongs 204/304.
  • the dimensions of the slots 206/306 are predetermined.
  • the slot 206A/306 extends an entire length (1) of the first prong 206A/306A and an entire length (1) of the second prong 206B/306B.
  • the entire length (1) of the first prong 206A/306A and the entire length (1) of the second prong 204B/304B can range from about 0.01 meters to about 1 meter.
  • a thickness (t) of the first prong 204A/304A and a thickness (t) of the second prong 204B/304B can range from about 1 mm to about 20 mm.
  • the slot 206A/306 extends a distance (d) between the inner surface of the first prong 204A/304A and the inner surface of the second prong 204B/304B.
  • the distance (d) ranges from about 20 pm to about 20 mm.
  • a width (w) of the prongs 204/304 e.g., first prong 204A/304A and the second prong 204B/304B
  • the prongs 204/304 can vary in dimension from one another.
  • the prongs 204/304 can vary in length (1), thickness (t), and width (w) from one another.
  • the distance (d) of the slot 206/306 can vary from one another.
  • the first prong 204A/304A in comparison to the second prong 204B/304B, can have a larger length (1) and width (w) and a smaller thickness (t).
  • the slots 206/306 extend through a thickness of the TiB2 substrate 202/302.
  • the number of slots can vary. In some embodiments, there can be one slot as shown in the examples of FIG. 3A, FIG. 3B, and FIG. 3C. There can also be two or more slots. The number of slots can vary depend on the intended application of the TiB2 substrate 202/302. In the example shown in FIG. 2A, FIG. 2B, and FIG. 2C, there are six slots.
  • the TiB2 substrate 202/302 can be at least partially covered in solid aluminum metal.
  • the slots 206/306 are the directing feature for the TiB2 substrate 202/302.
  • Other directing features, such as grooves, pores, and combinations thereof, can be included with the TiB2 substrate 202.
  • the TiB2 substrate 202/302 can have any suitable structure, size, or shape depending on application.
  • the TiB2 substrate 202/302 can have a solid geometric form.
  • the geometric form surface can include at least one of rectangle-shaped, square-shaped, triangle- shaped, oval-shaped, or oblong-shaped surfaces, among others.
  • the TiEh substrate 202/302 can also be a non-symmetrical form.
  • the TiEh substrate 202/302 can also be in the form of a plate.
  • the TiB2 substrate 202/302 can use the slots 206/306, the directing feature, to direct TiEh wettable material via capillary action.
  • the TiEh substrate 202/302 can be used in a variety of applications.
  • the TiEh substrate 202/302 can be configured for use in an aluminum purification cell or for use in an aluminum electrolysis cell.
  • the cathode is at the top of the cell, the anode is at the bottom of the cell, and the purified aluminum moves to the top of cell.
  • an aluminum purification cell can be found in commonly owned US Patent No. 10,407,786, entitled Systems and Methods for Purifying Aluminum, and filed on February 11, 2016.
  • the cathode is at the bottom of the cell, the anode is at the top of the cell, and the produced aluminum moves to the bottom of the cell.
  • One example of an aluminum electrolysis cell can be found in commonly owned US Patent Publication No. 2017/0283968, entitled Apparatuses and Systems for Vertical Electrolysis Cells, and filed on March 30, 2017.
  • FIG. 4A is a front view of an embodiment of a product 400 with a TiEh substrate 402 having a plurality of grooves 406 as directing features.
  • FIG. 4B is a first side of the embodiment shown in FIG. 4A.
  • FIG. 4C is an enlarged partial section view of the embodiment shown in FIG. 4A indicated by the circle of dashed lines in FIG. 4A.
  • FIG. 4D is an alternative configuration of the plurality of grooves of the embodiment as shown in FIG. 4C.
  • the product 400 is similar to the product 200/300. Differences are described herein.
  • the directing feature of the product 200/300 is slots 206/306; in contrast, the directing feature of the product 400 is at least one groove 406.
  • the grooves 406 extend partially into the TiB2 substrate 402.
  • the dimensions of the grooves 406 are predetermined. In some embodiments, a size and/or a shape of the grooves 406 are predetermined.
  • a width (w) of the grooves 406 ranges from about 10 pm to about 20 mm.
  • a groove depth (gd) of the grooves 406 ranges from about 1 mm to about 10 mm.
  • a length (1) of the grooves 406 ranges from about 1 cm to about 1 m.
  • a thickness (t) of the TiB2 substrate 402 ranges from about 5 mm to about 30 mm.
  • An edge-to-edge distance (d) between the grooves 406 ranges from about 1 mm to about 20 mm.
  • the directing feature includes at least two grooves 406 in the TiB2 substrate 402. Specifically, the directing feature includes three grooves 406.
  • FIG. 4C shows a first groove 406A, a second groove 406B, a third groove 406C (collectively, grooves 406).
  • the grooves 406 can be arranged in any pattern.
  • the grooves 406 can also have the same dimensions as one another or have different dimensions from one another.
  • the grooves 406 can also be located on the sides of the TiEh substrate 402, not only on the front side and back side as shown in FIG. 4C.
  • FIG. 4D shows a first groove 406A’, a second groove 406B’, a third groove 406C’ (collectively, grooves 406’).
  • FIG. 4D shows alternative dimensions and arrangement of the grooves 406’ as compared to the grooves 406 of FIG. 4C.
  • FIG. 4C shows the grooves having the same dimensions as one another and arranged in a pattern where the grooves 406 are positioned in an alternating pattern between a front side and back side of the TiB2 substrate 402.
  • FIG. 4D shows that the grooves 406’ can have different dimensions.
  • the second groove 406B’ is the largest groove with a groove depth that extends further than halfway through the TiB2 substrate 402.
  • the third groove 406C’ is the smallest groove and extends less than halfway through the TiB2 substrate 402’.
  • FIG. 5 A is a side view of another embodiment of a product 500 with a TiB2 substrate 502 having a plurality of pores as directing features.
  • FIG. 5B is a close-up view of a portion of the embodiment shown in FIG. 5A indicated by dashed lines in FIG. 5A.
  • the TiB2 substrate is a web, e.g., a sponge-like structure, of TiB2.
  • the pores 504 are defined by the TiB2 substrate 502, the web of TiB2.
  • the directing features of the product 500 can be a porosity of the TiB2 substrate 502.
  • the porosity of the TiB2 substrate 502 can range from about 1 pore to about 200 pores per square inch (PPI).
  • the porosity is at least about 5 pores per inch (PPI), or at least about 10 pores per inch (PPI), or at least about 15 pores per inch (PPI), or at least about 20 pores per inch (PPI). In some embodiments, the porosity is not greater than about 175 pores per inch (PPI), or not greater than about 150 pores per inch (PPI), or not greater than about 125 pores per inch (PPI), or not greater than about 100 pores per inch (PPI), or not greater than about 80 pores per inch (PPI), or not greater than about 60 pores per inch (PPI), or not greater than about 50 pores per inch (PPI).
  • the porosity of the TiB2 substrate 502 can have any suitable porous structure.
  • the porosity of the TiB2 substrate 502 can be an interconnected porous structure, wherein at least some of the pores are in fluid communication with one another and facilitate movement of the wettable material from a first location to a second location (e.g., from a first predetermined location to a second predetermined location). Accordingly, the interconnected porous structure may be considered an open pore structure.
  • the porosity of the TiB2 substrate 502 has a random porous structure.
  • the porosity of the TiEh substrate 502 can be an oriented porous structure.
  • the porosity of the oriented porous structure of the TiEh substrate 502 can have a porosity gradient.
  • the porosity gradient of the oriented porous structure of the TiEh substrate 502 can change along a three-dimensional gradient (i. e. , the porosity gradient can change along the X-axis, Y-axis, and Z-axis of the TiEh substrate 502).
  • the porosity gradient of the oriented porous structure of the Ti B2 substrate 502 increases or decreases toward the center of the TiEh substrate 502.
  • the porosity gradient of the oriented porous structure of the TiEh substrate 502 can increase and/or decrease through the TiEh substrate 502. For instance, the porosity gradient of the oriented porous structure of the TiEh substrate 502 can increase, decrease, and then increase from one end of the TiEh substrate 502 to another end of the TiEh substrate 502.
  • FIG. 6A is a perspective view of an embodiment of a product 600 with a TiEh substrate 602 having a plurality of slots 606 as directing features and a solid aluminum metal 612 covering the TiEh substrate 602. A portion of the solid aluminum metal 612 is shown around or transparent in FIG. 6A to reveal the surface structure of the substrate 602.
  • the product 600 includes prongs 604, a base 608, and a tip 610.
  • FIG. 6B is a first side view of a cross-section taken along the arrows 6B shown in FIG. 6A.
  • FIG. 6C is an enlarged partial section view of the embodiment shown in FIG. 6A indicated by the circle of dashed lines in FIG. 6A. The embodiments shown in FIGs.
  • FIG. 2A, 2B, and 2C is the same or similar as the embodiment of FIGs. 6 A, 6B, and 6C except for the differences described herein.
  • the embodiment shown in FIGs. 6A, 6B, and 6C includes solid aluminum metal 612 covering the TiB2 substrate structures shown in FIGs. 2A, 2B, and 2C (e.g., the TiB2 substrate 202).
  • FIGs. 6A, 6B, and 6C similar features of FIGs. 2A, 2B, and 2C will not be repeated.
  • FIG. 6A and FIG. 6B show the solid aluminum metal 612 completely covering the TiB2 substrate 602.
  • FIG. 6C shows the solid aluminum metal 612 completely occupying the slot 606 A between a first prong 604 A and a second prong 604B.
  • the solid aluminum metal 612 at least partially covers the surface of the TiB2 substrate 602 and/or the solid aluminum metal 612 is at least partially contained within the slot 606. In some embodiments, the solid aluminum metal 612 covers at least 1% of the surface of the TiB2 substrate 602. In some embodiments, the solid aluminum metal 612 covers at least 5% of the surface of the TiB2 substrate 602. In some embodiments, the solid aluminum metal 612 covers at least 10% of the surface of the TiB2 substrate 602. In some embodiments, the solid aluminum metal 612 covers at least 15% of the surface of the TiB2 substrate 602. In some embodiments, the solid aluminum metal 612 covers at least 20% of the surface of the TiEh substrate 602.
  • the solid aluminum metal 612 covers at least 25% of the surface of the TiEh substrate 602. In some embodiments, the solid aluminum metal 612 covers at least 30% of the surface of the TiEh substrate 602. In some embodiments, the solid aluminum metal 612 covers at least 35% of the surface of the TiEh substrate 602. In some embodiments, the solid aluminum metal 612 covers at least 40% of the surface of the TiEh substrate 602. In some embodiments, the solid aluminum metal 612 covers at least 45% of the surface of the TiEh substrate 602. In some embodiments, the solid aluminum metal 612 covers at least 50% of the surface of the TiEh substrate 602. In some embodiments, the solid aluminum metal 612 covers at least 55% of the surface of the TiEh substrate 602.
  • the solid aluminum metal 612 covers at least 60% of the surface of the TiEh substrate 602. In some embodiments, the solid aluminum metal 612 covers at least 65% of the surface of the TiEh substrate 602. In some embodiments, the solid aluminum metal 612 covers at least 70% of the surface of the TiEh substrate 602. In some embodiments, the solid aluminum metal 612 covers at least 75% of the surface of the TiEh substrate 602. In some embodiments, the solid aluminum metal 612 covers at least 80% of the surface of the TiEh substrate 602. In some embodiments, the solid aluminum metal 612 covers at least 85% of the surface of the TiEh substrate 602. In some embodiments, the solid aluminum metal 612 covers at least 90% of the surface of the Ti Eh substrate 602. In some embodiments, the solid aluminum metal 612 covers at least 95% of the surface of the TiEh substrate 602. In some embodiments, the solid aluminum metal 612 covers at least 100% of the surface of the TiEh substrate 602.
  • the solid aluminum metal 612 is at least partially contained within the slot 606. In some embodiments, where the slot 606 has a slot volume, the solid aluminum metal 612 occupies at least 1% of the slot volume. In some embodiments, the solid aluminum metal 612 occupies at least 5% of the slot volume. In some embodiments, the solid aluminum metal 612 occupies at least 10% of the slot volume. In some embodiments, the solid aluminum metal 612 occupies at least 15% of the slot volume. In some embodiments, the solid aluminum metal 612 occupies at least 20% of the slot volume. In some embodiments, the solid aluminum metal 612 occupies at least 25% of the slot volume. In some embodiments, the solid aluminum metal 612 occupies at least 30% of the slot volume.
  • the solid aluminum metal 612 occupies at least 35% of the slot volume. In some embodiments, the solid aluminum metal 612 occupies at least 40% of the slot volume. In some embodiments, the solid aluminum metal 612 occupies at least 45% of the slot volume. In some embodiments, the solid aluminum metal 612 occupies at least 50% of the slot volume. In some embodiments, the solid aluminum metal 612 occupies at least 55% of the slot volume. In some embodiments, the solid aluminum metal 612 occupies at least 60% of the slot volume. In some embodiments, the solid aluminum metal 612 occupies at least 65% of the slot volume. In some embodiments, the solid aluminum metal 612 occupies at least 70% of the slot volume.
  • the solid aluminum metal 612 occupies at least 75% of the slot volume. In some embodiments, the solid aluminum metal 612 occupies at least 80% of the slot volume. In some embodiments, the solid aluminum metal 612 occupies at least 85% of the slot volume. In some embodiments, the solid aluminum metal 612 occupies at least 90% of the slot volume. In some embodiments, the solid aluminum metal 612 occupies at least 95% of the slot volume. In some embodiments, the solid aluminum metal 612 occupies at least 100% of the slot volume.
  • Varying amounts of the solid aluminum metal 612 are shown occupying the slots 606 and the TiEh substrate 602 in the embodiments shown in FIGs. 6A-6N.
  • FIG. 6D is a cross-sectional side view of an embodiment of a product 600’ with a TiB2 substrate 602’ having a plurality of slots 606A’ as directing features and a solid aluminum metal 612’ covering an upper portion of the TiEh substrate 602’.
  • FIG. 6E is a partial crosssection taken along the dashed line 6E as shown in FIG. 6D where only one of the slots 606A’ of the plurality of slots 606A’ is shown. The cross-section is along the upper portion of the TiEh substrate 602’ where there is solid aluminum metal 612’.
  • FIG. 6F is a partial cross-section taken along the dashed line 6F shown in FIG. 6D where only one of the slots 606A’ of the plurality of slots 606A’ is shown. The cross-section is along the lower portion of the TiEh substrate 602’ where there is no solid aluminum metal 612’.
  • FIG. 6G is a cross-sectional side view of an embodiment of a TiEh substrate 602” having a plurality of slots 606A”as directing features and a solid aluminum metal 612” covering half of the TiEh substrate 602”, the front portion.
  • the solid aluminum metal 612 covers the front half of the base 608” and the tip 610”.
  • FIG. 6H is a partial cross-section taken along the dashed line 6H as shown in FIG. 6G where only one of the slots 606A” of the plurality of slots 606A” is shown.
  • the solid aluminum metal 612” covers the front half of the slot 606 A”.
  • FIG. 61 is a side view of an embodiment of a TiEh substrate 602’” with a base 608’” and tip 610’” having a plurality of slots 606A’” as directing features and a solid aluminum metal 612’” in the plurality of slots 606A’”.
  • FIG. 6J is a partial cross-section taken along the dashed line 6J as shown in FIG. 61 where only one of the slots 606A’ ’ ’ of the plurality of slots 606A’” is shown.
  • the solid aluminum metal 612’” completely fills the slot volume of the slot 606A’”.
  • FIG. 6K is a front view of an embodiment of a TiEh substrate 602”” having a plurality of slots 606 A, 606B, and 606B (collectively, slots 606””) as directing features and a solid aluminum metal 612”” covering some or none of the slots 606.
  • FIG. 6L is a first side view of the embodiment shown in FIG. 6K.
  • FIG. 6K shows the TiB2 substrate 602”” with a base 608”” and atip 610””.
  • the slots 606” have varying lengths, thicknesses, and amounts of the solid aluminum metal 612””.
  • slot 606A the slot length does not extend to the tip 610”” of the TiB2 substrate 602””.
  • the top portion of the slot 606A does not contain the solid aluminum metal 612””.
  • the bottom portion of the slot 606A contains the solid aluminum metal 612””.
  • slot 606B the slot length extends from the top of the base 608”” to the tip 610””.
  • the slot 606B does not contain the solid aluminum metal 612””.
  • Slot 606C does not start from the same place as slots 606A and 606B. The beginning of slot 606C starts further up the TiB2 substrate 602””.
  • Slot 606C has solid aluminum metal 612”” at the bottom and top, but not in the middle of the slot 606C.
  • FIG. 6M is a front view of an embodiment of a TiB2 substrate 602’”” with a surface area 620” ’ ’ ’ having a first portion 622” ” ’ of the surface area 620’ ” ” with a plurality of slots 606’”” as directing features and a second portion 624’”” of the surface area 620’”” being absent of any directing feature.
  • Prongs 604’” define the plurality of slots 606’””.
  • FIG. 6N is a first side view of the embodiment shown in FIG. 6M with the second portion 624’”” of the surface area 620’”” being absent of any directing feature.
  • the TiB2 substrate 602’” includes a surface area 620’””, wherein a first portion 622’” of the surface area 620’”” includes the at least one directing feature, and wherein a second portion 624’”” of the surface area 620’”” is absent of any directing feature.
  • the first portion 622’”” of the surface area 620’” is at least partially covered by solid aluminum metal. In some embodiments, the first portion 622’”” of the surface area 620’”” is at least 1% covered by solid aluminum metal. In some embodiments, the first portion 622’”” of the surface area 620’”” is at least 5% covered by solid aluminum metal. In some embodiments, the first portion 622’”” of the surface area 620’”” is at least 10% covered by solid aluminum metal. In some embodiments, the first portion 622’”” of the surface area 620’”” is at least 15% covered by solid aluminum metal.
  • the first portion 622’”” of the surface area 620’” is at least 20% covered by solid aluminum metal. In some embodiments, the first portion 622””’ of the surface area 620””’ is at least 25% covered by solid aluminum metal. In some embodiments, the first portion 622’”” of the surface area 620’”” is at least 30% covered by solid aluminum metal. In some embodiments, the first portion 622’”” of the surface area 620’”” is at least 35% covered by solid aluminum metal. In some embodiments, the first portion 622’”” of the surface area 620’”” is at least 40% covered by solid aluminum metal.
  • the first portion 622’”” of the surface area 620’” is at least 45% covered by solid aluminum metal. In some embodiments, the first portion 622’”” of the surface area 620’”” is at least 50% covered by solid aluminum metal. In some embodiments, the first portion 622’”” of the surface area 620’”” is at least 55% covered by solid aluminum metal. In some embodiments, the first portion 622’”” of the surface area 620’”” is at least 60% covered by solid aluminum metal. In some embodiments, the first portion 622’”” of the surface area 620’”” is at least 65% covered by solid aluminum metal.
  • the first portion 622’”” of the surface area 620’” is at least 70% covered by solid aluminum metal. In some embodiments, the first portion 622’”” of the surface area 620’”” is at least 75% covered by solid aluminum metal. In some embodiments, the first portion 622’”” of the surface area 620’”” is at least 80% covered by solid aluminum metal. In some embodiments, the first portion 622’”” of the surface area 620’”” is at least 85% covered by solid aluminum metal. In some embodiments, the first portion 622’”” of the surface area 620’”” is at least 90% covered by solid aluminum metal.
  • the first portion 622’”” of the surface area 620’” is at least 95% covered by solid aluminum metal. In some embodiments, the first portion 622’”” of the surface area 620’”” is at least 100% covered by solid aluminum metal.
  • the second portion 624’”” of the surface area 620’” is at least partially covered by solid aluminum metal. In some embodiments, the second portion 624’”” of the surface area 620’”” is at least 1% covered by solid aluminum metal. In some embodiments, the second portion 624’ ” ” of the surface area 620” ” ’ is at least 5% covered by solid aluminum metal. In some embodiments, the second portion 624’”” of the surface area 620’”” is at least 10% covered by solid aluminum metal. In some embodiments, the second portion 624’”” of the surface area 620’”” is at least 15% covered by solid aluminum metal.
  • the second portion 624’”” of the surface area 620’” is at least 20% covered by solid aluminum metal. In some embodiments, the second portion 624’”” of the surface area 620’”” is at least 25% covered by solid aluminum metal. In some embodiments, the second portion 624’”” of the surface area 620’”” is at least 30% covered by solid aluminum metal. In some embodiments, the second portion 624’ ” ” of the surface area 620’ ” ” is at least 35% covered by solid aluminum metal. In some embodiments, the second portion 624””’ of the surface area 620””’ is at least 40% covered by solid aluminum metal.
  • the second portion 624’”” of the surface area 620’” is at least 45% covered by solid aluminum metal. In some embodiments, the second portion 624’ ” ” of the surface area 620’”” is at least 50% covered by solid aluminum metal. In some embodiments, the second portion 624’”” of the surface area 620’”” is at least 55% covered by solid aluminum metal. In some embodiments, the second portion 624’”” of the surface area 620’”” is at least 60% covered by solid aluminum metal. In some embodiments, the second portion 624’”” of the surface area 620’”” is at least 65% covered by solid aluminum metal.
  • the second portion 624’”” of the surface area 620’” is at least 70% covered by solid aluminum metal. In some embodiments, the second portion 624’ ” ” of the surface area 620’ ” ” is at least 75% covered by solid aluminum metal. In some embodiments, the second portion 624’”” of the surface area 620’”” is at least 80% covered by solid aluminum metal. In some embodiments, the second portion 624’”” of the surface area 620’”” is at least 85% covered by solid aluminum metal. In some embodiments, the second portion 624’”” of the surface area 620’”” is at least 90% covered by solid aluminum metal.
  • the second portion 624’”” of the surface area 620’” is at least 95% covered by solid aluminum metal. In some embodiments, the second portion 624’”” of the surface area 620’”” is at least 100% covered by solid aluminum metal.
  • the solid aluminum metal covering the first portion 622’ ” ” and/or the second portion 624’”” of the surface area 620’”” is in the form of a film.
  • the film includes a thickness of from 1 pm to 500 pm.
  • the first portion 622’ ” ” and/or the second portion 624” ” ’ of the surface area 620” ” ’ is absent of the solid aluminum metal.
  • FIG. 7A is a front view of an embodiment of a product 700 with a TiEh substrate 702 having a slot 706 as a directing feature and a solid aluminum metal 712 covering the TiEh substrate 702.
  • a portion of the solid aluminum metal 712 is shown around or transparent in FIG. 7A to reveal the surface structure of the substrate 702.
  • a first prong 704A and a second prong 704B define the slot 706 extending upward from the base 708.
  • FIG. 7B is a cross-section taken along the dashed line 7B shown in FIG. 7A.
  • FIG. 7C is a first side view of a cross-section taken along the 7C shown in FIG. 7 A.
  • FIG. 7D is a front view of an embodiment of a product 700’ of a TiB2 substrate 702’ having a slot 706’ as a directing feature and a solid aluminum metal 712’ covering a portion of the slot 706’.
  • a first prong 704A’ and a second prong 704B’ extend upwards from a base 708’, thereby defining the slot 706’.
  • FIG. 7E is a cross-section taken along the dashed line 7E shown in FIG. 7D. As shown in FIG. 7E, a middle portion 714’ of the slot 706’ is absent the solid aluminum metal 712’. A front portion and a back portion of the slot 706’ are shown as having the solid aluminum metal 712’.
  • FIG. 7F is a first side view of the embodiment shown in FIG. 7D.
  • FIGs. 7D, 7E, and 7F and the embodiment shown in FIGs. 7A, 7B, and 7C are the same or similar except for differences discussed herein.
  • the amount of solid aluminum metal 712/712’ covering the TiB2 substrate 702/702’ differs between the embodiments.
  • the solid aluminum metal 712 covers almost the entirety of the TiB2 substrate 702. Only a portion of the base 708 is covered with solid aluminum metal 712.
  • the slot 706 is fully contained with solid aluminum metal 712.
  • the embodiment of FIGs. 7D, 7E, and 7F have no solid aluminum metal 712’ on the exterior of the TiB2 substrate 702’. Only a portion of the slot 706’ is filled with solid aluminum metal 712’.
  • FIGs. 7A, 7B, 7C, 7D, 7E, and 7F are the same or similar as the embodiment of FIGs. 3 A, 3B, and 3C.
  • FIGs. 3A, 3B, and 3C are not shown with solid aluminum metal on the TiB2 substrate surfaces or covering at least portions thereof.
  • the description of the solid aluminum metal from the embodiments of FIGs. 6A-6N also applies to the solid aluminum metal of FIGs. 7A-7F.
  • FIG. 8A is a front view of an embodiment of a product 800 with a TiB2 substrate 802 having a plurality of grooves 806 as directing features and a solid aluminum metal 812 covering the TiB2 substrate 802. A portion of the solid aluminum metal 812 is shown around or transparent in FIG. 8A to reveal the surface structure of the substrate 802.
  • FIG. 8B is a first side view of a cross-section taken along line 8B shown in FIG. 8A.
  • FIG. 8C is an enlarged partial section view of the embodiment shown in FIG. 8A as indicated by the dashed lines in FIG. 8A.
  • FIG. 8C includes a view of a first groove 806A, a second groove 806B, and a third groove 806C.
  • FIG. 8D is a rear view of an embodiment of a product 800’ of a TiB2 substrate 802’ having a plurality of grooves 806’ as directing features and a solid aluminum metal 812’ covering the front half of the TiB2 substrate 802’.
  • FIG. 8E is a first side view of a cross-section taken along the line 8E shown in FIG. 8D.
  • FIG. 8F is an enlarged partial section view of the embodiment shown in FIG. 8D indicated by the circle of dashed lines in FIG. 8F.
  • the embodiment shown in FIGs. 8D, 8E, and 8F and the embodiment shown in FIGs. 8A, 8B, and 8C are the same or similar except for differences discussed herein.
  • the amount of solid aluminum metal 812/812’ covering the TiEh substrate 802/802’ differs between the embodiments.
  • the solid aluminum metal 812 is completely covering the TiB2 substrate 802.
  • the solid aluminum metal 812’ in FIGs. 8D, 8E, and 8F only covers the front half of the TiB2 substrate 802’.
  • FIGs. 8A, 8B, 8C, 8D, 8E, and 8F are the same or similar as the embodiment of FIGs. 4A, 4B, 4C and 4D.
  • FIGs. 4A, 4B, 4C, and 4D are not shown with solid aluminum metal on the TiB2 substrate.
  • FIGs. 8A, 8B, 8C, 8D, 8E, and 8F are shown with solid aluminum metal 812/812’ on the TiB2 substrate.
  • the description of the solid aluminum metal 612/712 from the embodiments of FIGs. 6A-6N and 7A-7F also applies to the solid aluminum metal 812/812’ of FIGs. 8A-8F.
  • the at least one directing feature is a groove 806/806’
  • the solid aluminum metal 812/812’ is at least partially contained within the groove 806/806’.
  • the at least one groove 806/806’ includes a groove volume.
  • the solid aluminum metal 812/812’ occupies at least 1% of the groove volume.
  • the solid aluminum metal 812/812’ occupies at least 5% of the groove volume.
  • the solid aluminum metal 812/812’ occupies at least 10% of the groove volume.
  • the solid aluminum metal 812/812’ occupies at least 15% of the groove volume.
  • the solid aluminum metal 812/812’ occupies at least 20% of the groove volume.
  • the solid aluminum metal 812/812’ occupies at least 25% of the groove volume. In some embodiments, the solid aluminum metal 812/812’ occupies at least 30% of the groove volume. In some embodiments, the solid aluminum metal 812/812’ occupies at least 35% of the groove volume. In some embodiments, the solid aluminum metal 812/812’ occupies at least 40% of the groove volume. In some embodiments, the solid aluminum metal 812/812’ occupies at least 45% of the groove volume. In some embodiments, the solid aluminum metal 812/812’ occupies at least 50% of the groove volume. In some embodiments, the solid aluminum metal 812/812’ occupies at least 55% of the groove volume.
  • the solid aluminum metal 812/812’ occupies at least 60% of the groove volume. In some embodiments, the solid aluminum metal 812/812’ occupies at least 65% of the groove volume. In some embodiments, the solid aluminum metal 812/812’ occupies at least 70% of the groove volume. In some embodiments, the solid aluminum metal 812/812’ occupies at least 75% of the groove volume. In some embodiments, the solid aluminum metal 812/812’ occupies at least 80% of the groove volume. In some embodiments, the solid aluminum metal 812/812’ occupies at least 85% of the groove volume. In some embodiments, the solid aluminum metal 812/812’ occupies at least 90% of the groove volume.
  • FIG. 9 is a close-up view of a portion of an embodiment of a product 900 of a TiEh substrate 902 with pores 904 and solid aluminum metal 906, in accordance with some embodiments.
  • the TiEh substrate 902 is a web, e.g., a sponge-like structure, of TiEh.
  • the product 900 includes a TiEh substrate 902 of a web of TiB2 and solid aluminum metal 906 at least partially covering surfaces of the web of TiEh substrate 902.
  • the web of the TiEh substrate 902 defines pores 904 within the web of TiEh.
  • the solid aluminum metal 906 has a porosity.
  • the solid aluminum metal 906 may be at an elevated temperature when the solid aluminum metal 906 is filled in the pores 904. When the solid aluminum metal 906 cools, there may be space (e.g., pores or voids) between the solid aluminum metal 906 and the pores of the TiEh substrate 902.
  • the pores 904 have a porosity of the Ti Eh substrate 902 web defining a porous volume of the TiEh substrate 902.
  • the solid aluminum metal 906 occupies at least 1% of the porous volume. In some embodiments the solid aluminum metal 906 occupies at least 5% of the porous volume. In some embodiments the solid aluminum metal 906 occupies at least 10% of the porous volume.
  • the solid aluminum metal 906 occupies at least 15% of the porous volume. In some embodiments the solid aluminum metal 906 occupies at least 20% of the porous volume. In some embodiments the solid aluminum metal 906 occupies at least 25% of the porous volume. In some embodiments the solid aluminum metal 906 occupies at least 30% of the porous volume. In some embodiments the solid aluminum metal 906 occupies at least 35% of the porous volume. In some embodiments the solid aluminum metal 906 occupies at least 40% of the porous volume. In some embodiments the solid aluminum metal 906 occupies at least 45% of the porous volume. In some embodiments the solid aluminum metal 906 occupies at least 50% of the porous volume. In some embodiments the solid aluminum metal 906 occupies at least 55% of the porous volume.
  • the solid aluminum metal 906 occupies at least 60% of the porous volume. In some embodiments the solid aluminum metal 906 occupies at least 65% of the porous volume. In some embodiments the solid aluminum metal 906 occupies at least 70% of the porous volume. In some embodiments the solid aluminum metal 906 occupies at least 75% of the porous volume. In some embodiments the solid aluminum metal 906 occupies at least 80% of the porous volume. In some embodiments the solid aluminum metal 906 occupies at least 85% of the porous volume. In some embodiments the solid aluminum metal 906 occupies at least 90% of the porous volume.
  • the porosity of the TiEh substrate 902 can have any suitable porous structure.
  • the porosity of the TiEh substrate 902 can be an interconnected porous structure, wherein at least some of the pores are in fluid communication with one another and facilitate movement of the wettable material from a first location to a second location (e.g., from a first predetermined location to a second predetermined location). Accordingly, the interconnected porous structure may be considered an open pore structure.
  • the porosity of the TiEh substrate 902 has a random porous structure.
  • the porosity of the TiEh substrate 902 can be an oriented porous structure.
  • the porosity of the oriented porous structure of the TiEh substrate 902 can be a porosity gradient.
  • the porosity gradient of the oriented porous structure of the TiEh substrate 902 can change along a three-dimensional gradient (i. e. , the porosity gradient can change along the X-axis, Y-axis, and Z-axis of the TiEh substrate 902).
  • the porosity gradient of the oriented porous structure of the TiEh substrate 902 increases or decreases toward the center of the TiEh substrate 902.
  • the porosity gradient of the oriented porous structure of the TiEh substrate 902 can increase and/or decrease through the TiEh substrate 902. For instance, the porosity gradient of the oriented porous structure of the TiEh substrate 902 can increase, decrease, and then increase from one end of the TiEh substrate 902 to another end of the TiEh substrate 902.
  • An aluminum purification cell or an aluminum electrolysis cell can include any of the TiEh substrates described herein.
  • at least one of the TiEh substrates is an electrode for the aluminum purification cell or the aluminum electrolysis cell.
  • at least one of the TiEh substrates is a directing apparatus, where the directing apparatus is configured to direct liquid aluminum metal in a predetermined direction in an absence of an applied electrical current.
  • a product can include a TiEh substrate, as described herein, with at least one directing feature and solid aluminum metal at least partially covering surfaces of the TiEh substrate.
  • the solid aluminum metal can be at least partially contained within the at least one directing feature.
  • at least one directing feature incudes a void volume.
  • at least 1% of the void volume contains the solid aluminum metal.
  • at least 5% of the void volume contains the solid aluminum metal.
  • at least 10% of the void volume contains the solid aluminum metal.
  • at least 15% of the void volume contains the solid aluminum metal.
  • at least 20% of the void volume contains the solid aluminum metal.
  • At least 25% of the void volume contains the solid aluminum metal. In some embodiments, at least 30% of the void volume contains the solid aluminum metal. In some embodiments, at least 35% of the void volume contains the solid aluminum metal. In some embodiments, at least 40% of the void volume contains the solid aluminum metal. In some embodiments, at least 45% of the void volume contains the solid aluminum metal. In some embodiments, at least 50% of the void volume contains the solid aluminum metal. In some embodiments, at least 55% of the void volume contains the solid aluminum metal. In some embodiments, at least 60% of the void volume contains the solid aluminum metal. In some embodiments, at least 65% of the void volume contains the solid aluminum metal.
  • At least 70% of the void volume contains the solid aluminum metal. In some embodiments, at least 75% of the void volume contains the solid aluminum metal. In some embodiments, at least 80% of the void volume contains the solid aluminum metal. In some embodiments, at least 85% of the void volume contains the solid aluminum metal. In some embodiments, at least 90% of the void volume contains the solid aluminum metal. In some embodiments, at least 95% of the void volume contains the solid aluminum metal. In some embodiments, at least 100% of the void volume contains the solid aluminum metal.
  • TiEh foam samples each of dimension of about 3-inch (H) by 2-inch (W) by 0.5 inch (D), were manufactured to have a porosity of about 10, 20, 30 and 45 PPI, respectively.
  • the TiEh foam samples were manufactured by immersing polyurethane foams of different pore sizes in an aqueous slurry that had TiEh particles therein.
  • the TiEh coated foams were then rolled between a set of parallel rollers with a defined gap thickness, which compressed the infiltrated foam and expelled unwanted slurry.
  • the rolled TiEh foams were then hung in a drying oven. In some cases, the process was repeated, wherein the coated foams were re-immersed in the aqueous slurry and then air dried.
  • FIG. 10 shows an example of a sintered end product.
  • the sintered end products had continuous inter-connected pores with pore sizes of about 10, 20, 30, and 45 PPI corresponding to the respective polyurethane foam pore sizes.
  • the pore structure is an open pore structure allowing fluids to travel from one predetermined location to another predetermined location.
  • each of the four TiEh foam samples (of about 10, 20, 30, and 45 PPI) was wrapped in two pieces of tissue paper, one piece of tissue paper at the top of the sample and one piece of tissue paper at the middle of the sample.
  • the bottoms of the TiEh samples were then placed in 0.25 inch of water, well below the middle part of the samples, to test the samples’ abilities to promote water mass transfer through capillary action.
  • the samples were evaluated. None of the tissues in the about 10 PPI sample were damp or wet, indicating that no capillary action had occurred.
  • the middle tissue was damp and the top issue was dry, indicating that some capillary action had occurred.
  • the middle and top tissues were wet, indicating that substantial capillary action had occurred.
  • TiEh foam samples each of dimension of about 16-inch (H) by 2- inch (W) by 0.5 inch (D), were manufactured by the process for the foam samples from Example 1.
  • the sintered end product of the two TiEL foam samples had continuous interconnected pores with pore sizes of about 20 and 30 PPI corresponding to the respective polyurethane foam pore sizes.
  • Two untreated TiB2 foam samples were placed into about 2-inches deep slots of a graphite carrier of a crucible. Prior to being placed in the graphite carrier, a purified molten aluminum composition (pure aluminum pellets) and a molten bath composition (cryolite based and included NaF, AlFs, and CaF2 constituents) was added to each crucible, then each crucible was then installed in a furnace and heated in argon to 900°C. After heating, each of the two TiB2 foam samples was then placed in a crucible. Each crucible, having a TiB2 foam sample, molten aluminum and cryolite, was then held at 900°C.
  • the two TiB2 foam samples were then pulled from the crucibles and molten aluminum was detected at the top of the samples. Similar to Example 1, no corrosion was observed for either of the two TiB2 foam samples, indicating that the samples had been wetted by molten aluminum about 14 inches via capillary action facilitated by the pores of the foams.
  • the molten aluminum protects TiB2 from being corroded by cryolite.

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PCT/US2022/049159 2021-11-08 2022-11-07 Methods and systems of tib2 products with directing features Ceased WO2023081479A2 (en)

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MX2024005548A MX2024005548A (es) 2021-11-08 2022-11-07 Metodos y sistemas de productos tib2 con caracteristicas de direccion.
CA3237365A CA3237365A1 (en) 2021-11-08 2022-11-07 Methods and systems of tib2 products with directing features
EP22890892.7A EP4430232A4 (en) 2021-11-08 2022-11-07 <SUP2/>? <SUB2/>?2?TIB PRODUCT PROCESSES AND SYSTEMS WITH GUIDING ELEMENTS
CN202280080593.XA CN118382726A (zh) 2021-11-08 2022-11-07 具有引导特征的TiB2产品的方法和系统
AU2022382853A AU2022382853A1 (en) 2021-11-08 2022-11-07 Methods and systems of tib2 products with directing features
JP2024526619A JP2024541277A (ja) 2021-11-08 2022-11-07 誘導機構を有するＴｉＢ２製品の方法およびシステム
US18/657,321 US20240286966A1 (en) 2021-11-08 2024-05-07 Titanium diboride products with directing features
DKPA202430270A DK202430270A1 (en) 2021-11-08 2024-05-27 Methods and systems of TIB2 products with directing features

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US20020125125A1 (en) * 2001-03-06 2002-09-12 Rapp Robert A. Cathode for aluminum production and electrolytic cell
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