WO2023080441A1

WO2023080441A1 - Housing comprising plurality of layers and electronic device comprising same

Info

Publication number: WO2023080441A1
Application number: PCT/KR2022/014125
Authority: WO
Inventors: 황한규; 프런비르 싱라토르; 이진수; 김봉준; 정현정; 김효인; 조성호
Original assignee: 삼성전자 주식회사
Priority date: 2021-11-04
Filing date: 2022-09-21
Publication date: 2023-05-11

Abstract

A housing including a polymer material comprises: a first layer which is disposed on at least a portion of an outer surface of the housing and includes a flame retardant and a dimethylsiloxane-based material; and a second layer which is disposed on the first layer and includes an acrylate-based material. The flame retardant includes a first material including at least one from among phosphorus-based materials and at least one from among fluorine-based materials, or a second material including at least one from among inorganic flame retardant materials.

Description

A housing including a plurality of layers and an electronic device including the same

Various embodiments of the present disclosure relate to a housing including a plurality of layers and an electronic device including the same.

An electronic device may include a battery for power supply. For example, a mobile device may include a housing forming an exterior and a rechargeable secondary battery disposed in the housing.

When a battery receives a strong impact or is exposed to a high-temperature environment, heat generation may occur. Alternatively, when the battery is overcharged to exceed its charging capacity, heat may be generated. Excessive heating of the battery may cause the battery to ignite. A housing of the electronic device may include a flame retardant material to reduce combustion of the electronic device due to ignition of the battery. For example, a flame retardant paint may be applied to one side of the housing facing the battery, or a flame retardant sheet may be attached.

When an electronic device comes in contact with a hard material, scratches may occur on the housing. The housing of the electronic device may include a material with high hardness on one surface facing the outside in order to reduce scratches.

One surface facing the outside of the electronic device may be easily scratched. When a surface of the electronic device is scratched, it may cause inconvenience in using the electronic device. One side facing the outside of the electronic device is required to include a material with high hardness.

One surface facing the inside of the electronic device may be adjacent to a battery disposed therein. Since one side of the electronic device may burn when a battery is ignited, it is required to include a flame retardant material.

Various embodiments of the present disclosure may provide a housing of an electronic device including a structure in which a layer including a flame retardant material and a layer including a material having high hardness are stacked.

The technical problem to be achieved in this document is not limited to the technical problem mentioned above, and other technical problems not mentioned can be clearly understood by those skilled in the art from the description below. There will be.

According to one embodiment, a housing including a polymer material is disposed on at least a portion of an outer surface of the housing, and a first layer including a flame retardant and a dimethylsiloxane-based material is disposed on the first layer, and acrylate A second layer including a second layer including a phosphorus-based material, wherein the flame retardant may include a first material including at least one of a phosphorus-based material and at least one of a fluorine-based material or a second material including at least one of an inorganic flame retardant material. there is.

According to an embodiment, an electronic device includes a housing including a front surface on which a display is disposed, a rear surface facing in an opposite direction to the front surface, and a side surface disposed between the front surface and the rear surface to form an internal space, and a housing disposed in the internal space. , a battery, wherein the housing includes a first layer disposed on at least a portion of the rear surface and comprising a flame retardant and a dimethylsiloxane-based material, and a first layer disposed on the first layer and comprising an acrylate-based material. It may include two layers, and the flame retardant may include a first material including at least one of a phosphorus-based material and at least one of a fluorine-based material or a second material including at least one of an inorganic flame retardant material.

A housing including a plurality of layers and an electronic device including the same can reduce scratches by including a material with high hardness on one surface facing the outside, and include a flame retardant material on one surface facing the inside, It can reduce the combustion of the housing when the battery fires. Since the plurality of layers are integrally formed, the housing according to the embodiments can suppress combustion by reducing a phenomenon in which the layer containing the flame retardant is folded or wrinkled. The layer including the flame retardant material may secure high strength by including a dimethylsiloxane-based material for mixing the polymer, which is a base material of the housing, and the flame retardant.

Effects obtainable in the present disclosure are not limited to the effects mentioned above, and other effects not mentioned may be clearly understood by those skilled in the art from the description below. will be.

1 is a block diagram of an electronic device in a network environment according to various embodiments.

2 is a diagram illustrating an electronic device according to an exemplary embodiment.

3 is an exploded perspective view of an electronic device according to an exemplary embodiment.

4 is a schematic diagram of a layer structure of a housing and a battery, according to one embodiment.

5A shows the result of FT-IR spectroscopy measurement of polycarbonate.

5B shows a result of FT-IR spectroscopy measurement of a housing, according to an embodiment.

6 shows the results of a drop test on the housing according to Comparative Example 1.

7 shows results of a drop test of a housing according to an embodiment.

8 is a schematic diagram of a layer structure of a housing and a battery, according to one embodiment.

9 shows the results of a drop test on the housing according to Comparative Example 2.

10 shows results of a drop test of a housing according to an embodiment.

1 is a block diagram of an electronic device 101 within a network environment 100, according to various embodiments.

Referring to FIG. 1 , in a network environment 100, an electronic device 101 communicates with an electronic device 102 through a first network 198 (eg, a short-range wireless communication network) or through a second network 199. It is possible to communicate with at least one of the electronic device 104 or the server 108 through (eg, a long-distance wireless communication network). According to one embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108 . According to an embodiment, the electronic device 101 includes a processor 120, a memory 130, an input module 150, an audio output module 155, a display module 160, an audio module 170, a sensor module ( 176), interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196 , or the antenna module 197 may be included. In some embodiments, in the electronic device 101, at least one of these components (eg, the connection terminal 178) may be omitted or one or more other components may be added. In some embodiments, some of these components (eg, sensor module 176, camera module 180, or antenna module 197) are integrated into a single component (eg, display module 160). It can be.

The processor 120, for example, executes software (eg, the program 140) to cause at least one other component (eg, hardware or software component) of the electronic device 101 connected to the processor 120. It can control and perform various data processing or calculations. According to one embodiment, as at least part of data processing or operation, the processor 120 transfers instructions or data received from other components (e.g., sensor module 176 or communication module 190) to volatile memory 132. , processing commands or data stored in the volatile memory 132 , and storing resultant data in the non-volatile memory 134 . According to one embodiment, the processor 120 may include a main processor 121 (eg, a central processing unit or an application processor) or a secondary processor 123 (eg, a graphic processing unit, a neural network processing unit ( NPU: neural processing unit (NPU), image signal processor, sensor hub processor, or communication processor). For example, when the electronic device 101 includes the main processor 121 and the auxiliary processor 123, the auxiliary processor 123 may use less power than the main processor 121 or be set to be specialized for a designated function. can The secondary processor 123 may be implemented separately from or as part of the main processor 121 .

The secondary processor 123 may, for example, take the place of the main processor 121 while the main processor 121 is in an inactive (eg, sleep) state, or the main processor 121 is active (eg, running an application). ) state, together with the main processor 121, at least one of the components of the electronic device 101 (eg, the display module 160, the sensor module 176, or the communication module 190) It is possible to control at least some of the related functions or states. According to one embodiment, the auxiliary processor 123 (eg, image signal processor or communication processor) may be implemented as part of other functionally related components (eg, camera module 180 or communication module 190). there is. According to an embodiment, the auxiliary processor 123 (eg, a neural network processing device) may include a hardware structure specialized for processing an artificial intelligence model. AI models can be created through machine learning. Such learning may be performed, for example, in the electronic device 101 itself where the artificial intelligence model is performed, or may be performed through a separate server (eg, the server 108). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning or reinforcement learning, but in the above example Not limited. The artificial intelligence model may include a plurality of artificial neural network layers. Artificial neural networks include deep neural networks (DNNs), convolutional neural networks (CNNs), recurrent neural networks (RNNs), restricted boltzmann machines (RBMs), deep belief networks (DBNs), bidirectional recurrent deep neural networks (BRDNNs), It may be one of deep Q-networks or a combination of two or more of the foregoing, but is not limited to the foregoing examples. The artificial intelligence model may include, in addition or alternatively, software structures in addition to hardware structures.

The memory 130 may store various data used by at least one component (eg, the processor 120 or the sensor module 176) of the electronic device 101 . The data may include, for example, input data or output data for software (eg, program 140) and commands related thereto. The memory 130 may include volatile memory 132 or non-volatile memory 134 .

The program 140 may be stored as software in the memory 130 and may include, for example, an operating system 142 , middleware 144 , or an application 146 .

The input module 150 may receive a command or data to be used by a component (eg, the processor 120) of the electronic device 101 from the outside of the electronic device 101 (eg, a user). The input module 150 may include, for example, a microphone, a mouse, a keyboard, a key (eg, a button), or a digital pen (eg, a stylus pen).

The sound output module 155 may output sound signals to the outside of the electronic device 101 . The sound output module 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as multimedia playback or recording playback. A receiver may be used to receive an incoming call. According to one embodiment, the receiver may be implemented separately from the speaker or as part of it.

The display module 160 may visually provide information to the outside of the electronic device 101 (eg, a user). The display module 160 may include, for example, a display, a hologram device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module 160 may include a touch sensor set to detect a touch or a pressure sensor set to measure the intensity of force generated by the touch.

The audio module 170 may convert sound into an electrical signal or vice versa. According to one embodiment, the audio module 170 acquires sound through the input module 150, the sound output module 155, or an external electronic device connected directly or wirelessly to the electronic device 101 (eg: Sound may be output through the electronic device 102 (eg, a speaker or a headphone).

The sensor module 176 detects an operating state (eg, power or temperature) of the electronic device 101 or an external environmental state (eg, a user state), and generates an electrical signal or data value corresponding to the detected state. can do. According to one embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a bio sensor, It may include a temperature sensor, humidity sensor, or light sensor.

The interface 177 may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device 101 to an external electronic device (eg, the electronic device 102). According to one embodiment, the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

The connection terminal 178 may include a connector through which the electronic device 101 may be physically connected to an external electronic device (eg, the electronic device 102). According to one embodiment, the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).

The haptic module 179 may convert electrical signals into mechanical stimuli (eg, vibration or motion) or electrical stimuli that a user may perceive through tactile or kinesthetic senses. According to one embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

The camera module 180 may capture still images and moving images. According to one embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.

The power management module 188 may manage power supplied to the electronic device 101 . According to one embodiment, the power management module 188 may be implemented as at least part of a power management integrated circuit (PMIC), for example.

The battery 189 may supply power to at least one component of the electronic device 101 . According to one embodiment, the battery 189 may include, for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell.

The communication module 190 is a direct (eg, wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (eg, the electronic device 102, the electronic device 104, or the server 108). Establishment and communication through the established communication channel may be supported. The communication module 190 may include one or more communication processors that operate independently of the processor 120 (eg, an application processor) and support direct (eg, wired) communication or wireless communication. According to one embodiment, the communication module 190 is a wireless communication module 192 (eg, a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (eg, : a local area network (LAN) communication module or a power line communication module). Among these communication modules, a corresponding communication module is a first network 198 (eg, a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network 199 (eg, legacy It may communicate with the external electronic device 104 through a cellular network, a 5G network, a next-generation communication network, the Internet, or a telecommunications network such as a computer network (eg, a LAN or a WAN). These various types of communication modules may be integrated as one component (eg, a single chip) or implemented as a plurality of separate components (eg, multiple chips). The wireless communication module 192 uses subscriber information (eg, International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 within a communication network such as the first network 198 or the second network 199. The electronic device 101 may be identified or authenticated.

The wireless communication module 192 may support a 5G network after a 4G network and a next-generation communication technology, for example, NR access technology (new radio access technology). NR access technologies include high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and access of multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency (ultra-reliable and low latency (URLLC)). -latency communications)) can be supported. The wireless communication module 192 may support a high frequency band (eg, mmWave band) to achieve a high data rate, for example. The wireless communication module 192 uses various technologies for securing performance in a high frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), and full-dimensional multiplexing. Technologies such as input/output (FD-MIMO: full dimensional MIMO), array antenna, analog beam-forming, or large scale antenna may be supported. The wireless communication module 192 may support various requirements defined for the electronic device 101, an external electronic device (eg, the electronic device 104), or a network system (eg, the second network 199). According to one embodiment, the wireless communication module 192 is a peak data rate for eMBB realization (eg, 20 Gbps or more), a loss coverage for mMTC realization (eg, 164 dB or less), or a U-plane latency for URLLC realization (eg, Example: downlink (DL) and uplink (UL) each of 0.5 ms or less, or round trip 1 ms or less) may be supported.

The antenna module 197 may transmit or receive signals or power to the outside (eg, an external electronic device). According to one embodiment, the antenna module 197 may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (eg, PCB). According to one embodiment, the antenna module 197 may include a plurality of antennas (eg, an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 198 or the second network 199 is selected from the plurality of antennas by the communication module 190, for example. can be chosen A signal or power may be transmitted or received between the communication module 190 and an external electronic device through the selected at least one antenna. According to some embodiments, other components (eg, a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module 197 in addition to the radiator.

According to various embodiments, the antenna module 197 may form a mmWave antenna module. According to one embodiment, the mmWave antenna module includes a printed circuit board, an RFIC disposed on or adjacent to a first surface (eg, a lower surface) of the printed circuit board and capable of supporting a designated high frequency band (eg, mmWave band); and a plurality of antennas (eg, array antennas) disposed on or adjacent to a second surface (eg, a top surface or a side surface) of the printed circuit board and capable of transmitting or receiving signals of the designated high frequency band. can do.

At least some of the components are connected to each other through a communication method between peripheral devices (eg, a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)) and signal ( e.g. commands or data) can be exchanged with each other.

According to an embodiment, commands or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199 . Each of the external

electronic devices

102 or 104 may be the same as or different from the electronic device 101 . According to an embodiment, all or part of operations executed in the electronic device 101 may be executed in one or more external electronic devices among the external

electronic devices

102 , 104 , or 108 . For example, when the electronic device 101 needs to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device 101 instead of executing the function or service by itself. Alternatively or additionally, one or more external electronic devices may be requested to perform the function or at least part of the service. One or more external electronic devices receiving the request may execute at least a part of the requested function or service or an additional function or service related to the request, and deliver the execution result to the electronic device 101 . The electronic device 101 may provide the result as at least part of a response to the request as it is or additionally processed. To this end, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device 101 may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device 104 may include an internet of things (IoT) device. Server 108 may be an intelligent server using machine learning and/or neural networks. According to one embodiment, the external electronic device 104 or server 108 may be included in the second network 199 . The electronic device 101 may be applied to intelligent services (eg, smart home, smart city, smart car, or health care) based on 5G communication technology and IoT-related technology.

2 is a diagram illustrating an electronic device according to an exemplary embodiment. 3 is an exploded perspective view of an electronic device according to an exemplary embodiment.

Referring to FIG. 2 , an electronic device 200 according to an embodiment may include a housing 230 forming an external appearance of the electronic device 200 . For example, the housing 230 encloses a first face (or front face) 200A, a second face (or rear face) 200C, and a space between the first face 200A and the second face 200C. may include a third surface (or side surface) 200B. In one embodiment, the housing 230 has a structure forming at least a portion of the first surface 200A, the second surface 200C and/or the third surface 200B (eg, the frame structure of FIG. 3 ( 240)).

The electronic device 200 according to an embodiment may include a substantially transparent front plate 202 . In one embodiment, the front plate 202 may form at least a portion of the first surface 200A. In one embodiment, the front plate 202 may include, but is not limited to, a glass plate including, for example, various coating layers, or a polymer plate.

The electronic device 200 according to an embodiment may include a substantially opaque back plate 211 . In one embodiment, the rear plate 211 may form at least a portion of the second surface 200C. In one embodiment, back plate 211 may be formed of coated or tinted glass, ceramic, polymer, metal (eg, aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing. can

The electronic device 200 according to an embodiment may include a side bezel structure (or side member) 218 (eg, the side wall 241 of the frame structure 240 of FIG. 3 ). In an embodiment, the side bezel structure 218 may be combined with the front plate 202 and/or the back plate 211 to form at least a portion of the third surface 200B of the electronic device 200 . For example, the side bezel structure 218 may entirely form the third surface 200B of the electronic device 200, and for another example, the side bezel structure 218 may form the front plate 202 and/or The third surface 200B of the electronic device 200 may be formed together with the rear plate 211 .

Unlike the illustrated embodiment, when the third side 200B of the electronic device 200 is partially formed by the front plate 202 and/or the back plate 211, the front plate 202 and/or the back side The plate 211 may include a region that is bent toward the rear plate 211 and/or the front plate 202 at its edge and extends seamlessly. The extended area of the front plate 202 and/or the rear plate 211 may be located at both ends of a long edge of the electronic device 200, for example, but by the above-described example It is not limited.

In one embodiment, side bezel structure 218 may include metal and/or polymer. In one embodiment, the back plate 211 and the side bezel structure 218 may be integrally formed and may include the same material (eg, a metal material such as aluminum), but is not limited thereto. For example, the back plate 211 and the side bezel structure 218 may be formed as separate components and/or may include materials different from each other.

In one embodiment, the electronic device 200 includes a display 201, an

audio module

203, 204, and 207, a sensor module (not shown), a

camera module

205, 212, and 213, a key input device 217, At least one of a light emitting element (not shown) and/or a connector hole 208 may be included. In another embodiment, the electronic device 200 may omit at least one of the above components (eg, a key input device 217 or a light emitting device (not shown)) or may additionally include other components.

In one embodiment, the display 201 (eg, the display module 160 of FIG. 1 ) may be visually exposed through a substantial portion of the front plate 202. For example, at least a portion of the display 201 is It can be seen through the front plate 202 forming the first side 200A. In one embodiment, the display 201 can be disposed on the back side of the front plate 202 .

In one embodiment, the outer shape of the display 201 may be substantially the same as that of the front plate 202 adjacent to the display 201 . In one embodiment, in order to expand the area where the display 201 is visually exposed, the distance between the periphery of the display 201 and the periphery of the front plate 202 may be substantially the same.

In one embodiment, the display 201 (or the first surface 200A of the electronic device 200) may include a screen display area 201A. In one embodiment, the display 201 may provide visual information to the user through the screen display area 201A. In the illustrated embodiment, when the first surface 200A is viewed from the front, the screen display area 201A is spaced apart from the outside of the first surface 200A and is positioned inside the first surface 200A. but is not limited thereto. In another embodiment, when the first surface 200A is viewed from the front, at least a portion of the edge of the screen display area 201A substantially coincides with the edge of the first surface 200A (or the front plate 202). It could be.

In one embodiment, the screen display area 201A may include a sensing area 201B configured to acquire user's biometric information. Here, the meaning of "the screen display area 201A includes the sensing area 201B" can be understood as that at least a part of the sensing area 201B may overlap the screen display area 201A. there is. For example, the sensing area 201B may display visual information through the display 201 like other areas of the screen display area 201A, and may additionally acquire user's biometric information (eg, fingerprint). area can mean. In another embodiment, the sensing region 201B may be formed on the key input device 217 .

In one embodiment, the display 201 may include an area where the first camera module 205 (eg, the camera module 180 of FIG. 1 ) is located. In one embodiment, an opening is formed in the region of the display 201, and a first camera module 205 (eg, a punch hole camera) is disposed at least partially within the opening facing the first surface 200A. can In this case, the screen display area 201A may surround at least a portion of an edge of the opening. In another embodiment, the first camera module 205 (eg, an under display camera (UDC)) may be disposed below the display 201 to overlap the area of the display 201 . In this case, the display 201 may provide visual information to the user through the region, and additionally, the first camera module 205 is directed toward the first surface 200A through the region of the display 201. A corresponding image can be obtained.

In one embodiment, the display 201 may be coupled to or disposed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and/or a digitizer that detects a magnetic stylus pen. .

In one embodiment, the

audio modules

203 , 204 , and 207 (eg, the audio module 170 of FIG. 1 ) may include microphone holes 203 and 204 and speaker holes 207 .

In one embodiment, the microphone holes 203 and 204 include a first microphone hole 203 formed on a portion of the third surface 200B and a second microphone hole 204 formed on a portion of the second surface 200C. can include A microphone (not shown) may be disposed inside the microphone holes 203 and 204 to acquire external sound. The microphone may include a plurality of microphones to detect the direction of sound.

In one embodiment, the second microphone hole 204 formed in a partial region of the second surface 200C may be disposed adjacent to the

camera modules

205 , 212 , and 213 . For example, the second microphone hole 204 may acquire sound according to the operation of the

camera modules

205 , 212 , and 213 . However, it is not limited thereto.

In one embodiment, the speaker hole 207 may include an external speaker hole 207 and a receiver hole for communication (not shown). The external speaker hole 207 may be formed on a part of the third surface 200B of the electronic device 200 . In another embodiment, the external speaker hole 207 may be implemented as one hole with the microphone hole 203. Although not shown, a receiver hole (not shown) for communication may be formed on another part of the third surface 200B. For example, a receiver hole for a call may be formed on the opposite side of the external speaker hole 207 on the third surface 200B. For example, based on the illustration of FIG. 2 , the external speaker hole 207 is formed on the third surface 200B corresponding to the lower end of the electronic device 200, and the receiver hole for communication is the electronic device 200. It may be formed on the third surface 200B corresponding to the upper end. However, it is not limited thereto, and in another embodiment, the receiver hole for communication may be formed at a location other than the third surface 200B. For example, a receiver hole for a call may be formed by a spaced space between the front plate 202 (or the display 201) and the side bezel structure 218.

In one embodiment, the electronic device 200 includes at least one speaker (not shown) configured to output sound to the outside of the housing 230 through an external speaker hole 207 and/or a receiver hole (not shown) for communication. ) may be included.

In one embodiment, a sensor module (not shown) (eg, the sensor module 176 of FIG. 1 ) transmits an electrical signal or data value corresponding to an internal operating state of the electronic device 200 or an external environmental state. can create For example, the sensor module may include a proximity sensor, an HRM sensor, a fingerprint sensor, a gesture sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, It may include at least one of a humidity sensor and an illuminance sensor.

In one embodiment, the

camera modules

205, 212, and 213 (eg, the camera module 180 of FIG. 1) are disposed to face the first surface 200A of the electronic device 200 ( 205), a second camera module 212 disposed to face the second surface 200C, and a flash 213.

In one embodiment, the second camera module 212 may include a plurality of cameras (eg, dual cameras, triple cameras, or quad cameras). However, the second camera module 212 is not necessarily limited to including a plurality of cameras, and may include one camera.

In one embodiment, the first camera module 205 and the second camera module 212 may include one or a plurality of lenses, an image sensor, and/or an image signal processor.

In one embodiment, flash 213 may include, for example, a light emitting diode or xenon lamp. In another embodiment, two or more lenses (infrared camera, wide-angle and telephoto lenses) and image sensors may be disposed on one side of the electronic device 200 .

In one embodiment, the key input device 217 (eg, the input module 150 of FIG. 1 ) may be disposed on the third surface 200B of the electronic device 200 . In other embodiments, the electronic device 200 may not include some or all of the key input devices 217, and the key input devices 217 that are not included may be in other forms such as soft keys on the display 201. can be implemented as

In one embodiment, the connector hole 208 may be formed on the third surface 200B of the electronic device 200 to receive a connector of an external device. A connection terminal electrically connected to a connector of an external device (eg, the connection terminal 178 of FIG. 1 ) may be disposed in the connector hole 208 . The electronic device 200 according to an embodiment may include an interface module (eg, the interface 177 of FIG. 1 ) for processing electrical signals transmitted and received through the connection terminal.

In one embodiment, the electronic device 200 may include a light emitting element (not shown). For example, the light emitting device (not shown) may be disposed on the first surface 200A of the housing 230 . The light emitting element (not shown) may provide state information of the electronic device 200 in the form of light. In another embodiment, the light emitting device (not shown) may provide a light source interlocked with the operation of the first camera module 205 . For example, the light emitting device (not shown) may include an LED, an IR LED, and/or a xenon lamp.

Hereinafter, redundant descriptions of components having the same reference numerals as those described above will be omitted.

Referring to FIG. 3 , an electronic device 200 according to an embodiment includes a frame structure 240, a first printed circuit board 250, a second printed circuit board 252, a cover plate 260, and a battery. (270).

In one embodiment, the frame structure 240 includes a side wall 241 forming an exterior (eg, the third surface 200B of FIG. 2 ) of the electronic device 200 and extending inwardly from the side wall 241 . A support portion 243 may be included. In one embodiment, frame structure 240 may be disposed between display 201 and back plate 211 . In one embodiment, sidewalls 241 of frame structure 240 may surround a space between back plate 211 and front plate 202 (and/or display 201 ), frame structure 240 The support portion 243 of the may extend from the side wall 241 within the space.

In one embodiment, the frame structure 240 may support or accommodate other components included in the electronic device 200 . For example, the display 201 may be disposed on one side of the frame structure 240 facing one direction (eg, +z direction), and the display 201 may be placed on the support portion 243 of the frame structure 240. can be supported by For another example, the first printed circuit board 250, the second printed circuit board 252, and the battery 270 are formed on the other surface of the frame structure 240 facing the direction opposite to the one direction (eg, -z direction). ), and the second camera module 212 may be disposed. The first printed circuit board 250, the second printed circuit board 252, the battery 270 and the second camera module 212 are attached to the sidewall 241 and/or the support portion 243 of the frame structure 240. Each can be seated in a recess defined by

In one embodiment, the first printed circuit board 250 , the second printed circuit board 252 , and the battery 270 may be coupled to the frame structure 240 , respectively. For example, the first printed circuit board 250 and the second printed circuit board 252 may be fixed to the frame structure 240 through a coupling member such as a screw. For example, the battery 270 may be fixedly disposed on the frame structure 240 through an adhesive member (eg, double-sided tape). However, it is not limited by the above examples.

In one embodiment, the cover plate 260 may be disposed between the first printed circuit board 250 and the back plate 211 . In one embodiment, a cover plate 260 may be disposed on the first printed circuit board 250 . For example, the cover plate 260 may be disposed on a surface of the first printed circuit board 250 facing the -z direction.

In one embodiment, the cover plate 260 may at least partially overlap the first printed circuit board 250 with respect to the z-axis. In one embodiment, the cover plate 260 may cover at least a portion of the first printed circuit board 250 . Through this, the cover plate 260 protects the first printed circuit board 250 from physical impact, or the connector coupled to the first printed circuit board 250 (eg, the connector 34 of FIG. 3) is separated. can prevent

In one embodiment, the cover plate 260 is fixed to the first printed circuit board 250 through a coupling member (eg, a screw), or together with the first printed circuit board 250 through the coupling member. It may be coupled to frame structure 240 .

In one embodiment, display 201 may be disposed between frame structure 240 and front plate 202 . For example, the front plate 202 may be disposed on one side (eg, +z direction) of the display 201 and the frame structure 240 may be disposed on the other side (eg, -z direction) of the display 201 .

In one embodiment, front plate 202 may be coupled with display 201 . For example, the front plate 202 and the display 201 may be adhered to each other through an optical adhesive member (eg, optically clear adhesive (OCA) or optically clear resin (OCR)) interposed therebetween.

In one embodiment, face plate 202 may be coupled with frame structure 240 . For example, the front plate 202 may include an outer portion extending outside the display 201 when viewed in the z-axis direction, and the outer portion of the front plate 202 and the frame structure 240 ( Example: It may be attached to the frame structure 240 through an adhesive member (eg, double-sided tape) disposed between the side walls 241 . However, it is not limited by the above examples.

In one embodiment, the first printed circuit board 250 and/or the second printed circuit board 252 may include a processor (eg, the processor 120 of FIG. 1 ), a memory (eg, the memory 130 of FIG. 1 ) ), and/or an interface (eg, interface 177 in FIG. 1) may be equipped. The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor. The memory may include, for example, volatile memory or non-volatile memory. The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and/or an audio interface. The interface may electrically or physically connect the electronic device 200 to an external electronic device, and may include a USB connector, an SD card/MMC connector, or an audio connector. In one embodiment, the first printed circuit board 250 and the second printed circuit board 252 may be operatively or electrically connected to each other via a connecting member (eg, a flexible printed circuit board).

In one embodiment, the battery 270 may supply power to at least one component of the electronic device 200 . For example, the battery 270 may include a rechargeable secondary battery or a fuel cell. At least a portion of the battery 270 may be disposed substantially on the same plane as the first printed circuit board 250 and/or the second printed circuit board 252 .

The electronic device 200 according to an embodiment may include an antenna module (not shown) (eg, the antenna module 197 of FIG. 1 ). In one embodiment, the antenna module may be disposed between the rear plate 211 and the battery 270 . The antenna module may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and/or a magnetic secure transmission (MST) antenna. The antenna module may, for example, perform short-range communication with an external device or wirelessly transmit/receive power with an external device.

In one embodiment, the first camera module 205 (eg, the front camera) has a lens covering a portion (eg, the camera area 137) of the front plate 202 (eg, the front surface 200A in FIG. 2 ). It may be disposed on at least a part (eg, the support part 243) of the frame structure 240 so as to receive external light through it.

In one embodiment, the second camera module 212 (eg, a rear camera) may be disposed between the frame structure 240 and the rear plate 211 . In one embodiment, the second camera module 212 may be electrically connected to the first printed circuit board 250 through a connecting member (eg, a connector). In one embodiment, the second camera module 212 may be disposed such that a lens may receive external light through the camera area 284 of the rear plate 211 of the electronic device 200 .

In one embodiment, the camera area 284 may be formed on a surface of the rear plate 211 (eg, the rear surface 200C of FIG. 2 ). In one embodiment, the camera area 284 may be formed to be at least partially transparent so that external light may be incident to the lens of the second camera module 212 . In one embodiment, at least a portion of the camera area 284 may protrude from the surface of the rear plate 211 to a predetermined height. However, it is not limited thereto, and in another embodiment, the camera area 284 may form substantially the same plane as the surface of the back plate 211 .

In one embodiment, the housing 230 of the electronic device 200 may refer to a configuration or structure that forms at least a part of the exterior of the electronic device 200 . In this regard, at least some of the front plate 202, the frame structure 240, and/or the back plate 211 forming the exterior of the electronic device 200 are referred to as the housing 230 of the electronic device 200. It can be.

According to one embodiment, the battery 270 may be disposed in a space formed by the front plate 202 , the rear plate 211 and the side bezel structure 218 . The battery 270 may be disposed between the front plate 202 and the rear plate 211 .

According to an embodiment, when viewing the rear plate 211 of the electronic device 200 in the z-axis direction, the rear plate 211 includes an overlapping region 280 overlapping one surface of the battery 270. can do. The rear plate 211 may cover the battery 270 . In a state where the battery 270 is disposed within the housing 230 , the battery 270 may be disposed closer to the rear plate 211 than the display 201 .

According to one embodiment, the front plate 202 may include an incombustible material, such as tempered glass, to protect the display 201 . The rear plate 211 may include a polymer material. Since the front plate 202 includes an incombustible material, it may not burn when the battery 270 is ignited, but the rear plate 211 may be affected by ignition of the battery 270 . For example, when the battery 270 receives a strong impact or is exposed to a high-temperature environment for a long time, the battery 270 may catch fire. When the battery 270 is ignited, the rear plate 211 closer to the battery 270 than the display 201 may burn. Since the overlapping region 280 directly faces the battery 270 among the entire regions of the back plate 211 , it may be directly affected when the battery 270 is ignited. According to one embodiment, the back plate 211 may include a flame retarding material to reduce combustion. For example, back plate 211 may include a flame retardant, which inhibits combustion.

The electronic device 200 may be scratched on the housing 230 during use. For example, in the case of a mobile device, the housing 230 may be scratched by a hard object while carrying or using the mobile device. If the housing 230 is damaged, it may cause inconvenience in using the electronic device 200 . The housing 230 may include a material with high hardness in order to reduce scratches.

Referring to FIG. 4 , according to an embodiment, a housing 300 of an electronic device (eg, the electronic device 200 of FIG. 2 ) includes a back plate 303 (eg, the electronic device 200 of FIG. 2 ). It may include a back plate 211), a first layer 310 and a second layer 320. For example, a first layer 310 comprising a flame retardant material may be deposited on the back plate 303 . The second layer 320 including a material having high hardness may be stacked on the first layer 310 .

According to an embodiment, the housing 300 may provide a space in which components of an electronic device can be accommodated. According to one embodiment, the housing 300 has a front surface (eg, the first surface 200A in FIG. 2 ) and a rear surface 301 facing the opposite direction of the front surface (eg, the second surface 200C in FIG. 2 ). , and a side surface disposed between the front and rear surfaces 301 to form an internal space (eg, the side surface 200B in FIG. 2 ). A battery 400 may be disposed in the space to supply power to components of the electronic device. For example, the battery 400 may be positioned in a first direction (eg, +z direction) in which the housing 300 faces the inside of the electronic device with respect to the rear plate 303 . The first layer 310 may be stacked on the rear plate 303 in a second direction (eg, -z direction) opposite to the first direction (eg, +z direction). The second layer 320 may be stacked on the first layer 310 in the second direction (eg, -z direction). According to one embodiment, the first layer 310 may be disposed on at least a portion of the rear surface 301 of the housing 300 . For example, the first layer 310 can be disposed on the back plate 303 , which forms the back side 301 of the housing 300 . According to one embodiment, the second layer 320 may be disposed on the first layer 310 . For example, the first layer 310 may be disposed on the rear surface 301 of the rear plate 303 forming the rear surface 301, and the second layer 320 may be the first layer 310 can be placed on top. According to one embodiment, the first layer 310 and the second layer 320 may be substantially included in the back plate. For example, the rear plate 303 on which the first layer 310 and the second layer 320 are stacked may form the rear surface 301 of the electronic device.

According to one embodiment, the first layer 310 and the second layer 320 may be sequentially stacked from the rear plate 303 toward the outside of the housing 300 . For example, the first layer 310 may be disposed closer to the battery 400 than the second layer 320 . The second layer 320 may face the outside of the housing 300 .

According to one embodiment, the first layer 310 may include a flame retardant and a dimethylsiloxane-based material. Since the first layer 310 is closer to the battery 400 than the second layer 320, it may be directly affected by ignition of the battery 400. For example, when the battery 400 is ignited, combustion may start from an overlapping region 302 of the housing 300 directly facing the battery 400 . The first layer 310 including a flame retardant may reduce combustion of the housing 300 when the battery 400 is ignited by covering the rear plate 303 . According to an embodiment, the first layer 310 may cover the entire rear surface 301 including the overlapping region 302 . For example, when looking at the rear surface 301 vertically, the area of the rear surface 301 covered by the first layer 310 includes the area 302 of the rear surface 301 overlapping the battery 400. area can be covered.

According to one embodiment, the first layer 310 can include a flame retardant, which can reduce burning. Since the polymer included in the housing 300 is mostly an organic material composed of carbon, hydrogen, and oxygen, it may have a property of being easily combustible. The first layer 310 may suppress combustion of the housing 300 formed of a polymer material by including a flame retardant. A flame retardant that is easy to mix with raw materials, does not affect the mechanical properties of the housing 300, and suppresses the generation of low smoke and toxic gases during combustion is required.

According to one embodiment, the first layer 310 may include a first material or a second material as a flame retardant. The first material may include at least one of phosphorus-based materials and at least one of fluorine-based materials. The second material may include at least one of inorganic flame retardant materials.

According to one embodiment, the housing 300 may have flame retardant properties due to the flame retardant of the first layer 310 . According to an embodiment, the housing 300 is not combusted when the battery 400 is ignited, thereby reducing combustion of the electronic device. For example, even if the battery 400 is ignited, the housing 300 can reduce combustion of the electronic device by suppressing combustion by the flame retardant.

According to one embodiment, the phosphorus-based material included in the first material may include a phosphate compound. Upon thermal decomposition of phosphorus-based materials, polymetaphosphoric acid may be produced. Polymetaphosphoric acid can reduce combustion by forming a protective layer. When producing polymethane, a carbon film may be formed by dehydration, and the carbon film blocks oxygen, thereby reducing combustion. Phosphorus-based materials have excellent flame retardant effects in solids and can be excellent at reducing combustion of polymers containing a large amount of oxygen.

According to one embodiment, the phosphorus material is red phosphorus, ammonium phosphate (ammonium phosphate), trimethyl phosphate (TMP, trimethyl phosphate), ammonium polyphosphate (APP, ammonium polyphosphate), triaryl phosphate (TAP, triallyl phosphate ), triphenyl phosphate (TPP), diphenyl phosphate (DPHP), dimethyl methylphosphonate (DMMP), trioctyl phosphate (TOP), phosphazene , At least one of melamine polyphosphate, tricresyl phosphate (TCP), trixylenyl phosphate (TXP) and phosphorus bis (1,3-dichloropropyl) phosphate (BDCPP) can include

According to one embodiment, the fluorine-based material included in the first material may have flame retardancy due to the strong binding force of the carbon-to-carbon bond (-CF ₂ -). Since the fluorine-based material does not contain bromine or chlorine compounds, generation of harmful gases and environmental pollution that may occur during combustion can be reduced. The fluorine-based material may be easily prepared as an optically transparent material, and may have flame retardancy even when added at a low concentration (eg, about 0.06 wt% to 0.10 wt%).

According to an embodiment, the first layer 310 may include a first material including at least one of phosphorus-based materials and at least one of fluorine-based materials. A phosphorus substance can form a carbon film and block oxygen required for combustion. The fluorine-based substance can suppress the spread of ignition by reducing sparking. The first material may reduce combustion and suppress ignition by including at least one of phosphorus-based materials and at least one of fluorine-based materials.

According to one embodiment, the fluorine-based material may include polytetrafluoroethylene (PTFE). In addition to this, the fluorine-based material may include various flame retardants including fluorine in the molecule.

According to one embodiment, the inorganic flame retardant material included in the second material may include at least one of an aluminum hydroxide-based material, a magnesium hydroxide-based material, and an antimony-based material. For example, the first layer 310 may include aluminum hydroxide (Al(OH) ₃ ) and/or magnesium hydroxide (Mg(OH) ₂ ) as the second material. Aluminum hydroxide and magnesium hydroxide can delay ignition and prevent combustion by generating water molecules through an endothermic reaction (dehydration reaction). For another example, the first layer 310 may include antimony-based materials such as antimony trioxide (Sb ₂ O ₃ ) and antimony pentoxide (Sb ₂ O ₅ ) as the second material. Antimony-based substances can suppress combustion by absorbing radicals participating in combustion reactions.

According to one embodiment, the flame retardant included in the first layer 310 may include the first material or the second material. Since the first layer 310 including the flame retardant is close to the battery 400 among the layers forming the housing 300, combustion of the housing 300 can be suppressed when the battery 400 is ignited. According to one embodiment, the first layer 310 may include a first material or a second material as a flame retardant in a polymer as a base material. For example, in the first layer 310, a first material or a second material may be added to polycarbonate (PC) as a base material.

When adding a flame retardant to a polymer, mixing may not be performed well due to physical and chemical differences between the polymer and the flame retardant. When the addition amount of the flame retardant is excessively large, the moldability of the polymer and the dispersibility of the flame retardant are deteriorated, thereby reducing the mechanical strength of the housing 300 . For example, when a flame retardant is added to a polymer molten resin, the polymer molecules and the flame retardant molecules do not mix with each other, and each molecule can be aggregated with each other. If the flame retardant is not properly mixed into the polymer, the strength of the entire area of the housing 300 may not be uniform. For example, the region of the housing 300 where the flame retardant is aggregated may be easily broken by an external impact due to weakening of the physical properties of the polymer. If the strength of the housing 300 is low, the housing 300 may be easily damaged when an external impact occurs. For example, the housing 300 in which the polymer and the flame retardant are not properly mixed may crack due to breakage even when subjected to a small impact. When the flame retardant is not mixed with the polymer and is distributed in a large amount in one area, flame retardant performance in another area where the flame retardant is less distributed may be deteriorated.

According to one embodiment, the first layer 310 may include a dimethylsiloxane-based material for mixing the first material or the second material and the polymer. A dimethylsiloxane-based material can improve the physical properties of a polymer to which a flame retardant is added. The dimethylsiloxane-based material may improve softness of the first layer 310 by increasing an elongation rate of the first layer 310 . The dimethylsiloxane-based material may reduce damage to the first layer 310 that may occur from external impact by improving softness of the first layer 310 . The dimethylsiloxane-based material may mean a material that can be represented by the chemical formula [-Si(CH ₃ ) ₂ O-] _n . Dimethylsiloxane-based materials have a very low glass transition temperature, heat resistance, and shear stability due to the Si-O bond of the main chain. A dimethylsiloxane-based material may be suitable for addition to a polymer due to the above characteristics. The dimethylsiloxane-based material is at least one of polydimethylsiloxane (PDMS), silicone rubber, dimethyl silicone, simethicone, methyl silicone, and dimethicone. can include For example, PDMS, when added to a polymer, can evenly mix the polymer and flame retardant. For example, the housing 300 may be fabricated by adding a PDMS-containing copolymer (eg, PDMS-tetraethyl orthosilicate (TEOS), PDMS-TES (tetrasilane)), and/or a block polymer to polycarbonate to which a flame retardant is added. In this case, the strength of the housing 300 may be improved by evenly mixing the flame retardant and the polycarbonate. PDMS, as a transparent material, may be suitable as a material for the housing 300 .

If the amount of the first material and the second material, which are flame retardants, are too large, the strength of the housing 300 may be reduced, and if the amount of the dimethylsiloxane-based material is too large, haze due to a difference in refractive index may increase. In order to secure design aesthetics while securing strength and flame retardancy of the first layer 310, the first layer 310 is required to include an appropriate weight ratio of a polymer, a flame retardant, and a dimethylsiloxane-based material.

According to one embodiment, the first layer 310 may include a dimethyl siloxane-based material of about 5 wt% or less based on the total weight of the first layer 310 . For example, the first layer 310 may include about 0.1 wt% to about 5.0 wt% or less of a dimethylsiloxane-based material based on the total weight of the first layer 310 .

When the weight ratio of the first material exceeds about 1.0 wt% or the weight ratio of the second material exceeds about 5.0 wt%, the strength of the first layer 310 is reduced and cracks may easily occur. When the weight ratio of the dimethylsiloxane-based material exceeds about 5.0 wt%, the appearance of the housing 300 may be damaged due to haze. For example, according to one embodiment, the first layer 310 includes 0.1 wt% to 1.0 wt% of the first material, 0.1 wt% to 5.0 wt% of the dimethylsiloxane-based material, and 94.0 wt% to 99.8 wt%. % of polycarbonate. For another example, according to an embodiment, the first layer 310 includes 0.1 wt% to 5.0 wt% of the second material, 0.1 wt% to 5.0 wt% of the dimethylsiloxane-based material, and 90.0 wt% to 99.8 wt%. wt % of polycarbonate.

According to one embodiment, the second layer 320 may be disposed on the first layer 310 . Since the second layer 320 is disposed on the surface of the housing 300 facing the outside, it may include a material having high hardness in order to reduce the occurrence of scratches. According to one embodiment, the second layer 320 may include an acrylate-based material. For example, the second layer 320 may include polymethyl methacrylate (PMMA). For another example, the second layer 320 may include a PC/PMMA blend. PMMA, as a transparent material, has excellent optical properties and high hardness, so that the occurrence of scratches on the housing 300 can be reduced. The hardness of the second layer 320 including the acrylate-based material may be higher than that of the first layer 310 . The second layer 320 may have a thickness capable of providing sufficient hardness.

When a flame retardant paint is applied to one surface of the housing 300 of the electronic device, a peeling phenomenon due to a decrease in adhesion of the paint and a manufacturing process due to the addition of a painting process may be added. When the flame retardant sheet is attached to one surface of the housing 300 of the electronic device, a separate adhesive layer is required for attachment or the flame retardant sheet is folded or creased in the housing 300 having a curved edge. can happen When the flame retardant sheet is folded or creased, crevices may be formed. When the battery 400 is ignited, combustion of the housing 300 may occur through the gap.

According to an embodiment, in order to reduce breakage due to high brittleness of the second layer 320, the first layer 310 and the second layer 320 may be integrally formed. The housing 300 of the electronic device may include a first layer 310 and a second layer 320 integrally formed. For example, co-extrusion in which the material constituting the first layer 310 and the material constituting the second layer 320 are melted in different extruders, the melted resin is laminated, and then cast. As a result, the housing 300 may be integrally formed. According to an embodiment, the housing 300 of the electronic device may include layers of different materials. In the housing 300 of the electronic device according to an embodiment, since the first layer 310 and the second layer 320 are integrally formed, the first layer 310 having high hardness and the second layer having flame retardancy are integrally formed. Deterioration of adhesion of the layer 320 may not occur, and an adhesive layer may not be required. According to an embodiment, since the housing 300 of the electronic device does not include a separate flame retardant sheet, even if the edge of the housing 300 includes a curved surface, the second layer 320 having flame retardancy may not be folded. . For example, the first layer 310 and the second layer 320 of the housing 300 may be disposed on the rear surface 301 and the side surface. Since the first layer 310 having flame retardancy is disposed on the rear surface 301 and the side surface, it is possible to reduce a phenomenon in which the second layer 320 is folded or wrinkled.

Referring to FIG. 4 , according to one embodiment, the housing 300 may further include an incombustible sheet 500 disposed between the rear surface 301 and the battery 400 . The incombustible sheet 500 may be disposed between the first layer 310 and the battery 400 . One side of the incombustible sheet 500 may face the first layer 310, and the other side facing the one side may face the rear surface 301. The incombustible sheet 500 may have a thin thickness in order not to significantly affect the total weight of the electronic device. For example, the incombustible sheet 500 may have a thickness of about 0.1 mm to about 10.0 mm, but is not limited thereto. The incombustible sheet 500 may include an incombustible material that does not burn. For example, the incombustible sheet 500 may be a sheet made of stainless steel. The incombustible sheet 500, when the battery 400 is ignited, by the characteristics of not burning, can reduce the combustion of the housing 300.

According to one embodiment, the first layer 310 may have a thickness greater than that of the second layer 320 . Since the second layer 320 includes an acrylate-based material having high hardness, brittleness may be high. If the thickness of the second layer 320 is too thick, the brittleness of the housing 300 is excessively high, so that the housing 300 can be easily damaged even when subjected to a small impact. In one embodiment, the thickness t1 of the first layer 310 may be greater than the thickness t2 of the second layer 320 . For example, the thickness t1 of the first layer 310 may be about 0.8t, and the thickness t2 of the second layer 320 may be about 0.2t.

According to one embodiment, the first layer 310 and the second layer 320 may have different flame retardancy. According to one embodiment, the first layer 310 may have better flame retardancy than the second layer 320 . In order to confirm the flame retardancy of the first layer 310 and the second layer 320, a UL 94 combustion test was performed. Hereinafter, flame retardancy of the first layer 310 and the second layer 320 of the housing 300 of the electronic device according to an embodiment will be described in detail through test results. However, the embodiment related to the test is only for exemplifying the housing 300 according to one embodiment, and the scope of the housing 300 according to one embodiment is not limited to the embodiments.

Manufacture of specimens for measuring flame retardant properties

For the flame retardancy test, a first specimen for the first layer 310 and a second specimen for the second layer 320 were prepared. The first specimen was prepared to be composed of 5.0 wt% of aluminum hydroxide, 5.0 wt% of PDMS, and 90.0 wt% of polycarbonate, and the second specimen was prepared to be composed of 100.0 wt% of PMMA. Specimens 1 and 2 were left at 23° C. and 50% relative humidity for 48 hours prior to testing.

UL 94 V test (vertical burning test)

(1) After applying a 20 mm flame to the first and second specimens for 10 seconds, the burning time (t1) of the first and second specimens is measured.

(2) After applying a 20 mm flame for 10 seconds again, the burning time (t2) and sparking time (t3) of the first and second specimens are measured.

(3) Calculate the grade based on t1, t2, t3 and the combustion pattern (whether cotton wool is ignited, whether or not it burns up to the clamp, etc.).

Test result

The UL 94 test of the first specimen and the second specimen is described in [Table 1] below.

기준 standard		제1 시편Psalm 1	제2 시편Psalm 2
개별 연소 시간(t1 또는 t2)Individual burning time (t1 or t2)	7.5초7.5 seconds	30초 초과greater than 30 seconds
2차 연소 후 연소 및 불똥이 맺힌 시간(t2+t3)Combustion and spark formation time after secondary combustion (t2+t3)	20초20 seconds	60초 초과greater than 60 seconds
불똥에 의한 탈지면 발화Ignition of cotton wool by sparks	발생하지 않음does not occur	발생generation
난연 등급flame retardant rating	V-0V-0	HBHB

Referring to [Table 1], the first specimen has a V-0 grade in flame retardancy measured in accordance with UL 94, and the second specimen has an HB grade in flame retardancy measured in accordance with UL 94 can It can be confirmed that the second layer 320 including an acrylate-based material has good burning properties, and the first layer 310 including a flame retardant has excellent flame retardancy. In one embodiment, the first layer 310, the flame retardancy measured in accordance with UL 94, may have a V-1 or V-0 rating, the second layer 320, measured in accordance with UL 94 One flame retardancy may have an HB rating. 5A shows the result of FT-IR spectroscopy measurement of polycarbonate. 5B shows a result of FT-IR spectroscopy measurement of a housing, according to an embodiment.

Referring to FIG. 5A , the FT-IR peak of polycarbonate may appear at a wavenumber related to the functional group of the carbonate. Since polycarbonate has carbonyl, ether, and phenyl functional groups, polycarbonate may form FT-IR peaks at wave numbers associated with each functional group.

FIG. 5B shows FT-IR peaks observable in a housing of an electronic device (eg, the housing 300 of FIG. 4 ) containing PDMS as a dimethylsiloxane-based material. Referring to FIG. 5B , since the housing of the electronic device includes a dimethylsiloxane-based material, an FT-IR peak different from that of polycarbonate may be exhibited. Referring to Figure 5b, the FT-IR peak of the housing according to one embodiment, the peak of Si-O-Si, which did not appear in the FT-IR peak of the polycarbonate that does not contain PDMS, is about 1000 cm ^-1 to about 1100 cm It may appear in the ^-1 range, and the peaks of Si-CH ₃ may appear in the ranges of about 1200 cm ^-1 to about 1300 cm ^-1 and about 800 cm ^-1 to about 900 cm ^-1 , respectively.

6 shows results of a drop test on the housing 300' according to Comparative Example 1. 7 shows results of a drop test of the housing 300 according to an embodiment. The embodiment related to the test is only for illustrating the housing 300 according to one embodiment, and the scope of the housing according to one embodiment is not limited to the embodiments.

6 and 7 show results of a drop test for comparing physical properties of the housing 300' according to Comparative Example 1 and the housing 300 according to one embodiment.

Comparative Example 1

According to Comparative Example 1, the housing 300' includes about 5.0 wt% of aluminum hydroxide and about 95 wt% of polycarbonate.

one embodiment

According to one embodiment, the housing 300 includes about 5.0 wt% of aluminum hydroxide, about 5.0 wt% of PDMS, and about 90.0 wt% of polycarbonate.

fall test

According to one embodiment, the housing 300 was placed on a horizontal surface, and a weight of 500 g was freely dropped from a height of 50 cm from the horizontal surface. After the housing 300 according to one embodiment was removed from the horizontal surface, the housing according to Comparative Example 1 was placed on the horizontal surface, and a weight of 500 g was freely dropped from a height of 50 cm from the horizontal surface.

Referring to FIG. 6 , from the results of the dropping test of the housing 300' according to Comparative Example 1, it can be confirmed that a crack C is generated. It can be confirmed that the housing 300 ′ including the polymer and the flame retardant has low strength because the polymer molecules and the flame retardant molecules are not evenly mixed.

Referring to FIG. 7 , it can be confirmed that cracks do not occur from the result of the dropping test of the housing 300 according to an embodiment. In the housing 300 ′ according to Comparative Example 1, cracks may be confirmed as a result of the drop test, and in the housing 300 according to an embodiment, cracks may not occur as a result of the drop test. It can be confirmed that the housing 300 including a polymer, a flame retardant, and a dimethylsiloxane-based material (eg, PDMS) has high strength because molecules are evenly mixed.

As a result of the drop test, it can be confirmed that the strength of the housing 300 including polycarbonate, a flame retardant, and a dimethylsiloxane-based material (eg, PDMS) is higher than that of the housing 300' including polycarbonate and a flame retardant. The housing 300 including a polymer, a flame retardant, and a dimethylsiloxane-based material may have strong durability from impact. It can be seen that the physical properties of the housing 300 are improved by evenly mixing the polycarbonate and the flame retardant with the dimethylsiloxane-based material. According to an embodiment, the housing 300 of the electronic device includes a first layer 310 having flame retardancy and a second layer 320 having high hardness, thereby reducing the occurrence of scratches, and the battery ( 400) may not burn from ignition. According to an embodiment, the housing 300 of the electronic device may have high strength by including a dimethylsiloxane-based material in the first layer 310 including a flame retardant.

Referring to FIG. 8 , a housing 300 of an electronic device (eg, the electronic device 200 of FIG. 2 ) according to an embodiment includes a first layer 310, a second layer 320, a shielding layer ( 330) and a color printing layer 340 may be further included.

According to one embodiment, the first layer 310 may be disposed on at least a portion of the rear surface 301 of the housing 300, and the second layer 320 may be disposed on the first layer 310. can The first layer 310 may be disposed closer to the battery 400 than the second layer 320 . The second layer 320 may face the outside of the housing 300 .

According to one embodiment, the first layer 310 may include a flame retardant and a dimethylsiloxane-based material. The first layer 310 may reduce combustion of the housing 300 when the battery 400 is ignited by having flame retardant properties using a flame retardant.

According to one embodiment, the second layer 320 may include an acrylate-based material. The second layer 320 may reduce damage to the housing 300 by having high hardness.

According to one embodiment, the shielding layer 330 may be disposed between the rear surface 301 and the first layer 310 . The shielding layer 330 may include a substantially opaque material or may be formed to have an opaque color. The shielding layer 330 may reduce a light leakage phenomenon in which the inside of an electronic device (eg, the electronic device 200 of FIG. 2 ) is visually recognized to the outside. The color printed layer 340 may be deposited on the shielding layer 330 , and a primer layer may be disposed between the shielding layer 330 and the color printed layer 340 . For example, the shielding layer 330 may have a thickness of about 3um to about 20um.

According to one embodiment, the color printed layer 340 may be disposed between the shielding layer 330 and the first layer 310 . For example, the battery 400 may be positioned in a first direction D1 in which the housing 300 faces the inside of the electronic device with respect to the rear plate 303 . On the back plate 303, in a second direction (eg, -z direction) opposite to the first direction (eg, +z direction), the shielding layer 330, the color printing layer 340, and the first layer 310 and the second layer 320 may be sequentially stacked.

The color printing layer 340 may include TiSiCn and/or CrSiC. The color printing layer 340 may provide a sense of color, texture, and/or a three-dimensional effect to the housing 300 of the electronic device. The color printing layer 340 may have various colors. For example, the color printed layer 340 containing TiSiCN may exhibit black, gray, brown, or gold, and the color printed layer 340 containing CrSiC may exhibit silver. The color printed layer 340 may have a pattern for decorating the housing 300 . For example, the color printing layer 340 may have a gradation pattern. For another example, the color printing layer 340 may have colors with different brightness and saturation depending on regions. The color printed layer 340 may have a thickness of about 3 um to about 10 um. The shielding layer 330 may be a dark color so that the color of the color printing layer 340 can be clearly recognized. For example, the shielding layer 330 may include a resin of a dark color so that the inside of the housing 300 is not visible. The shielding layer 330 may protect the color printed layer 340 by overlapping with the color printed layer 340 .

According to one embodiment, the first layer 310 may include a colorant forming a translucent or opaque outer surface of the housing 300 . Colorant may refer to a material added to change the color of the outer surface of the housing 300 . For example, the first layer 310 may include dyes, pigments, pigments, fluorescent materials, and/or eye light materials. The first layer 310 may be formed translucent or opaque by colorant, and the housing 300 together with the shielding layer 330 and the color printing layer 340 disposed on the first layer 310 A variety of translucent or opaque colors can be implemented.

9 shows results of a drop test on the housing 300' according to Comparative Example 2. 10 shows results of a drop test of the housing 300 according to an embodiment.

9 and 10 show the results of a drop test for comparing physical properties of the housing 300' according to Comparative Example 2 and the housing 300 according to one embodiment. The embodiment related to the test is only for illustrating the housing 300 according to one embodiment, and the scope of the housing according to one embodiment is not limited to the embodiments.

Comparative Example 2

The housing 300' according to Comparative Example 2 includes a first layer including about 5.0 wt% of aluminum hydroxide and about 95 wt% of polycarbonate, a shielding layer (eg, the shielding layer 330 of FIG. 8 ), and a color and a printed layer (eg, the color printed layer 340 of FIG. 8 ).

one embodiment

According to one embodiment, the housing 300 includes a first layer (eg, the first layer 310 of FIG. 4 ) including about 5.0 wt % of aluminum hydroxide, about 5.0 wt % of PDMS, and about 90.0 wt % of polycarbonate. ), a shielding layer, and a color printed layer (eg, the color printed layer 340 of FIG. 8).

fall test

According to one embodiment, the housing 300 was placed on a horizontal surface, and a weight of 500 g was freely dropped from a height of 50 cm from the horizontal surface. After the housing 300 according to one embodiment was removed from the horizontal surface, the housing according to Comparative Example 2 was placed on the horizontal surface, and a weight of 500 g was freely dropped from a height of 50 cm from the horizontal surface.

Referring to FIG. 9 , from the results of the drop test of the housing 300' according to Comparative Example 2, it can be confirmed that a crack C is generated. It can be confirmed that the housing 300 'including the first layer including the polymer and the flame retardant, the color printed layer, the shielding layer, and the color printed layer has low strength because the polymer molecules and the flame retardant molecules are not evenly mixed. .

Referring to FIG. 10 , as a result of a dropping test of the housing 300 according to an embodiment, it can be confirmed that no cracks occur. It can be confirmed that the housing 300 including the first layer including a polymer, a flame retardant, and a dimethylsiloxane-based material (eg PDMS), a shielding layer, and a color printing layer has high strength because molecules are evenly mixed. there is.

As a result of the drop test, the strength of the housing 300' including the first layer, the shielding layer, and the color printing layer including polycarbonate and the flame retardant is higher than the strength of the polycarbonate, the flame retardant, and the dimethylsiloxane-based material (eg, PDMS). It can be seen that the strength of the housing 300 including the first layer, the color printing layer, and the shielding layer is high. It can be confirmed that the physical properties are improved by uniformly mixing the polycarbonate and the flame retardant by the dimethylsiloxane-based material.

According to an embodiment, a housing including a polymer material (eg, the housing 300 of FIG. 4 ) is disposed on at least a portion of an outer surface of the housing, and includes a flame retardant and a dimethylsiloxane-based material. Example: A first layer 310 of FIG. 4) and a second layer disposed on the first layer and including an acrylate-based material (eg, second layer 320 of FIG. 4), wherein the The flame retardant may include a first material including at least one of a phosphorus-based material and at least one of a fluorine-based material or a second material including at least one of an inorganic flame retardant material.

According to one embodiment, the dimethylsiloxane-based material is polydimethylsiloxane (PDMS, polydimethylsiloxane), silicone rubber, dimethyl silicone, simethicone, methyl silicone, dimethicone, It may contain at least one of dimethicone.

According to one embodiment, the phosphorus material is red phosphorus, ammonium phosphate (ammonium phosphate), trimethyl phosphate (TMP, trimethyl phosphate), ammonium polyphosphate (APP, ammonium polyphosphate), triaryl phosphate (TAP, triallylphosphate ), triphenyl phosphate (TPP), diphenyl phosphate (DPHP), dimethyl methylphosphonate (DMMP), trioctyl phosphate (TOP), phosphazene , At least one of melamine polyphosphate, tricresyl phosphate (TCP), trixylenyl phosphate (TXP) and phosphorus bis (1,3-dichloropropyl) phosphate (BDCPP) can include

According to one embodiment, the fluorine-based material may include polytetrafluoroethylene (PTFE).

According to one embodiment, the inorganic flame retardant material may include at least one of an aluminum hydroxide-based material, a magnesium hydroxide-based material, and an antimony-based material.

According to one embodiment, the first layer may include 5 wt% or less of the dimethylsiloxane-based material based on the total weight of the first layer.

According to one embodiment, the first layer may include polymethyl methacrylate (PMMA), and the second layer may include polycarbonate (PC).

According to one embodiment, the first layer may include a colorant so that the housing has a translucent or opaque color.

According to one embodiment, the housing includes a front surface (eg, the front surface 200A of FIG. 2 ) on which a display (eg, the display 201 of FIG. 2 ) is disposed, and a rear surface facing the opposite direction of the front surface (eg, the front surface 200A of FIG. 2 ). 2) and a side surface disposed between the front surface and the rear surface to form an inner space (e.g., the side surface 200B in FIG. 2), disposed between the rear surface and the first layer, A shielding layer (eg, the shielding layer 330 of FIG. 9 ) including an opaque material may be further included.

According to an embodiment, a color printed layer (eg, the color printed layer 340 of FIG. 9 ) disposed between the shielding layer and the first layer may be further included.

According to one embodiment, the first layer has a V-1 or V-0 grade in flame retardancy measured in accordance with UL 94, and the second layer has an HB grade in flame retardancy measured in accordance with UL 94. can have

According to one embodiment, the first layer may have a thickness greater than that of the second layer.

According to one embodiment, the hardness of the second layer may be higher than that of the first layer.

According to one embodiment, the housing includes a front surface on which a display is disposed, a rear surface facing the opposite direction of the front surface, and a side surface disposed between the front surface and the rear surface to form an internal space, and the first layer, It may be disposed on the rear and side surfaces.

According to an embodiment, an electronic device (eg, the electronic device 200 of FIG. 2 ) includes a front surface (eg, the front surface 200A of FIG. 2 ) on which a display (eg, the display 201 of FIG. 2 ) is disposed; A housing including a rear surface facing the opposite direction of the front surface (eg, rear surface 200C in FIG. 2 ) and a side surface disposed between the front surface and the rear surface to form an internal space (eg, side surface 200B in FIG. 2 ) (Example: housing 300 in FIG. 4) and a battery (eg, battery 400 in FIG. 4) disposed in the inner space, the housing disposed on at least a portion of the rear surface, and a flame retardant and a first layer including a dimethylsiloxane-based material (eg, the first layer 310 of FIG. 4 ) and a second layer disposed on the first layer and including an acrylate-based material (eg, the first layer 310 of FIG. 4 ). The second layer 320), and the flame retardant may include a first material including at least one of a phosphorus-based material and at least one of a fluorine-based material or a second material including at least one of an inorganic flame retardant material. .

According to one embodiment, when looking at the rear surface vertically, the area of the rear surface covered by the first layer overlaps the battery (eg, the overlapping area 302 of FIG. 4 ) of the rear surface. can include

According to one embodiment, the dimethylsiloxane-based material may include polydimethylsiloxane (PDMS).

According to one embodiment, the first layer may have a V-1 or V-0 grade in flame retardancy measured according to UL94, and the second layer may have a HB grade in flame retardancy measured according to UL94 there is.

Electronic devices according to various embodiments disclosed in this document may be devices of various types. The electronic device may include, for example, a portable communication device (eg, a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance. An electronic device according to an embodiment of the present document is not limited to the aforementioned devices.

Various embodiments of this document and terms used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, like reference numbers may be used for like or related elements. The singular form of a noun corresponding to an item may include one item or a plurality of items, unless the relevant context clearly dictates otherwise. In this document, "A or B", "at least one of A and B", "at least one of A or B", "A, B or C", "at least one of A, B and C", and "A Each of the phrases such as "at least one of , B, or C" may include any one of the items listed together in that phrase, or all possible combinations thereof. Terms such as "first", "second", or "first" or "secondary" may simply be used to distinguish that component from other corresponding components, and may refer to that component in other respects (eg, importance or order) is not limited. A (eg, first) component is said to be "coupled" or "connected" to another (eg, second) component, with or without the terms "functionally" or "communicatively." When mentioned, it means that the certain component may be connected to the other component directly (eg by wire), wirelessly, or through a third component.

The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and is interchangeable with terms such as, for example, logic, logical blocks, parts, or circuits. can be used as A module may be an integrally constructed component or a minimal unit of components or a portion thereof that performs one or more functions. For example, according to one embodiment, the module may be implemented in the form of an application-specific integrated circuit (ASIC).

Various embodiments of this document provide one or more instructions stored in a storage medium (eg, internal memory 136 or external memory 138) readable by a machine (eg, electronic device 101). It may be implemented as software (eg, the program 140) including them. For example, a processor (eg, the processor 120 ) of a device (eg, the electronic device 101 ) may call at least one command among one or more instructions stored from a storage medium and execute it. This enables the device to be operated to perform at least one function according to the at least one command invoked. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The device-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-temporary' only means that the storage medium is a tangible device and does not contain a signal (e.g. electromagnetic wave), and this term refers to the case where data is stored semi-permanently in the storage medium. It does not discriminate when it is temporarily stored.

According to one embodiment, the method according to various embodiments disclosed in this document may be included and provided in a computer program product. Computer program products may be traded between sellers and buyers as commodities. Computer program products are distributed in the form of machine-readable storage media (e.g. CD-ROM (compact disc read only memory)) or through application stores (e.g. Play Store).

) or directly between two user devices (eg smart phones), online distribution (eg download or upload). In the case of online distribution, at least part of the computer program product may be temporarily stored or temporarily created in a storage medium readable by a device such as a manufacturer's server, an application store server, or a relay server's memory.

According to various embodiments, each component (eg, module or program) of the above-described components may include a single object or a plurality of entities, and some of the plurality of entities may be separately disposed in other components. there is. According to various embodiments, one or more components or operations among the aforementioned corresponding components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (eg modules or programs) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by a corresponding component of the plurality of components prior to the integration. . According to various embodiments, the actions performed by a module, program, or other component are executed sequentially, in parallel, iteratively, or heuristically, or one or more of the actions are executed in a different order, or omitted. or one or more other actions may be added.

Claims

In the housing containing a polymer material,

a first layer disposed on at least a portion of an outer surface of the housing and including a flame retardant and a dimethylsiloxane-based material; and

a second layer disposed on the first layer and including an acrylate-based material; including,

The flame retardant,

A first material comprising at least one of phosphorus-based materials and at least one of fluorine-based materials or a second material comprising at least one of inorganic flame retardant materials,

housing.
According to claim 1,

The dimethylsiloxane-based material,

At least one of polydimethylsiloxane (PDMS), silicone rubber, dimethyl silicone, simethicone, methyl silicone, and dimethicone,

housing.
According to claim 1,

The takeover material,

red phosphorus, ammonium phosphate, trimethyl phosphate (TMP), ammonium polyphosphate (APP), triallylphosphate (TAP), triphenyl phosphate (TPP) , diphenyl phosphate (DPHP), dimethyl methylphosphonate (DMMP), trioctyl phosphate (TOP), phosphazene, melamine polyphosphate, tricre At least one of tricresyl phosphate (TCP), trixylenyl phosphate (TXP) and phosphorus bis (1,3-dichloropropyl) phosphate (BDCPP),

housing.
According to claim 1,

The fluorine-based material,

Containing polytetrafluoroethylene (PTFE, polytetrafluoroethylene),

housing.
According to claim 1,

The inorganic flame retardant material,

Including at least one of an aluminum hydroxide-based material, a magnesium hydroxide-based material, and an antimony-based material,

housing.
According to claim 1,

The first layer,

Containing 5 wt% or less of the dimethylsiloxane-based material based on the total weight of the first layer,

housing.
According to claim 1,

The first layer,

Contains polymethyl methacrylate (PMMA),

The second layer,

Including polycarbonate (PC, poly carbonate),

housing.
According to claim 1,

The first layer,

Including a colorant so that the housing has a translucent or opaque color,

housing.
According to claim 1,

the housing,

A front surface on which a display is disposed, a rear surface facing the opposite direction of the front surface, and a side surface disposed between the front surface and the rear surface to form an internal space,

a shielding layer disposed between the rear surface and the first layer and including an opaque material; Including more,

housing.
According to claim 9,

a color printing layer disposed between the shielding layer and the first layer; Including more,

housing.
According to claim 1,

The first layer has a flame retardant rating of V-1 or V-0 measured according to UL 94,

The second layer has an HB grade in flame retardancy measured in accordance with UL 94,

housing.
According to claim 1,

The first layer,

Having a thickness greater than the thickness of the second layer,

housing.
According to claim 1,

The hardness of the second layer,

higher than the hardness of the first layer,

housing.
According to claim 1,

the housing,

A front surface on which a display is disposed, a rear surface facing the opposite direction of the front surface, and a side surface disposed between the front surface and the rear surface to form an internal space,

The first layer,

Disposed on the rear and side surfaces,

housing.
In electronic devices,

a housing including a front surface on which a display is disposed, a rear surface facing the opposite direction of the front surface, and a side surface disposed between the front surface and the rear surface to form an internal space; and

a battery disposed in the inner space; including,

the housing,

a first layer disposed on at least a portion of the rear surface and including a flame retardant and a dimethylsiloxane-based material; and

a second layer disposed on the first layer and including an acrylate-based material; including,

The flame retardant,

A first material comprising at least one of phosphorus-based materials and at least one of fluorine-based materials or a second material comprising at least one of inorganic flame retardant materials,

electronic device.