WO2023191282A1

WO2023191282A1 - Housing comprising rigidity-reinforcing structure and electronic device comprising same

Info

Publication number: WO2023191282A1
Application number: PCT/KR2023/001079
Authority: WO
Inventors: 임준엽; 김명곤; 김서현; 송태현; 황한규
Original assignee: 삼성전자 주식회사
Priority date: 2022-03-29
Filing date: 2023-01-20
Publication date: 2023-10-05

Abstract

A housing of an electronic device, according to one embodiment, comprises: a first surface; a second surface facing the first surface; and a side surface disposed between the first surface and the second surface. The housing comprises: a cover plate comprising a first region formed into a flat surface corresponding to the second surface, and a second region formed into a curved surface extending from one portion of the first region and surrounding the side surface; a substrate layer disposed on the cover plate; a print layer disposed on the substrate layer; and a protection layer disposed on the print layer, wherein the housing comprises a structure in which the total thickness of the substrate layer, the print layer, and the protection layer is constant, and the thickness of the print layer disposed on the first region is thinner than the thickness of the print layer disposed on the second region.

Description

Housing including a structure to reinforce rigidity and electronic device including the same

Embodiments to be described later relate to a housing including a structure for reinforcing rigidity and an electronic device including the same.

Electronic devices are strengthening design elements to improve users' aesthetic sense. In order to provide a differentiated design, the electronic device may include housings of various appearances, such as providing a housing including a curved surface. Electronic devices can provide a variety of colors through a printed layer on the housing.

To improve design, a plurality of layers stacked on a housing including a curved area may cause wrinkles in the curved area. If wrinkles in the curved area are visible to the naked eye, the overall aesthetics of the product may be reduced. In the curved area of the housing, a method is needed to improve the wrinkles of multiple layers.

The technical problem to be achieved in this document is not limited to the technical problem mentioned above, and other technical problems not mentioned can be clearly understood by those skilled in the art from the description below. There will be.

According to one embodiment, an electronic device includes at least one electronic component and a first surface, a second surface facing the first surface, and a side disposed between the first surface and the second surface, It may include a housing surrounded by the first surface, the second surface, and the side surface, and providing an internal space in which at least a portion of the at least one electronic component is disposed. According to one embodiment, the housing may be formed of a first area formed as a plane corresponding to the second surface and a curved surface extending from a portion of the first area. An electronic device according to an embodiment may include a cover plate including a second area surrounding the side surface, a base layer disposed on the cover plate, and a printing layer disposed on the base layer. The electronic device according to one embodiment may further include a protective layer disposed on the printed layer. According to one embodiment, the overall thickness of the base layer, printing layer, and protective layer may be constant. According to one embodiment, the thickness of the first portion of the printed layer disposed on the first area may be thinner than the thickness of the second portion of the printed layer disposed on the second area.

According to one embodiment, the housing may be formed of a first region formed as a plane and a second region formed as a curved surface extending from a portion of the first region. The housing according to one embodiment may include a cover plate including the first area and the second area, a base layer disposed on the cover plate, and a printing layer disposed on the base layer. The housing according to one embodiment may further include a protective layer disposed on the printing layer. According to one embodiment, the overall thickness of the base layer, printing layer, and protective layer may be constant. According to one embodiment, the thickness of some of the printed layers disposed on the first area may be thinner than the thickness of the remaining printed layers disposed on the second area.

According to one embodiment, the electronic device includes a first side, a second side facing the first side, and a side disposed between the first side and the second side, and the first side and the second side are disposed between the first side and the second side. It may include a housing providing two sides and an inner space surrounded by the sides, and at least one electronic component disposed at least partially in the inner space and exposed through an opening formed on the second side. According to one embodiment, the housing may include a first area formed as a plane corresponding to the second surface and a second area formed as a curved surface extending from the opening in a direction toward which the second surface faces. An electronic device according to an embodiment may include a cover plate including the first area and the second area, a base layer disposed on the cover plate, and a printing layer disposed on the base layer. The electronic device according to one embodiment may further include a protective layer disposed on the printed layer. According to one embodiment, the overall thickness of the base layer, printing layer, and protective layer may be constant. According to one embodiment, the thickness of the first portion of the printed layer disposed on the first area may be thinner than the thickness of the second portion of the printed layer disposed on the second area.

The electronic device according to one embodiment can reduce the buckling phenomenon that occurs in the film structure attached to the housing due to compressive stress that occurs when the film is attached to the curved area of the housing.

An electronic device according to an embodiment can provide a structure that prevents bubble defects by reducing the tensile strength required when a film is attached to a housing in a flat area.

The electronic device according to one embodiment may provide a structure that increases the adhesion of the film structure by flattening the step area of the film structure attached between the curved area and the flat area of the housing.

The effects that can be obtained from the present disclosure are not limited to the effects mentioned above, and other effects not mentioned can be clearly understood by those skilled in the art from the description below. will be.

1 is a block diagram of an electronic device in a network environment according to various embodiments.

FIG. 2 is a diagram illustrating an electronic device according to an embodiment.

3 is a perspective view of the housing, according to one embodiment.

FIG. 4 is a cross-sectional view showing an example in which the housing is cut along line A-A' of FIG. 3, according to one embodiment.

Figure 5 is a cross-sectional view showing a pattern formed within the film structure.

Fig. 6A is a diagram showing a part of the housing.

Figure 6b is a graph showing the relationship with compression strain when applying values related to curvature to the compression strain formula.

FIG. 7A is a partial cross sectional view showing an example in which the housing is cut along line B-B' of FIG. 3, according to one embodiment.

FIGS. 7B and 7C are partial cross-sectional views illustrating an example in which the housing is cut along line C-C' of FIG. 3, according to an embodiment.

FIG. 7D is a partial cross-sectional view showing an example of a housing in which the thickness of the base layer is increased in the curved area, according to one embodiment.

FIG. 8A is a diagram illustrating a process of laminating a protective layer on a printed layer in which steps are formed.

FIGS. 8B and 8C are diagrams showing the formation of a concave-convex structure on the protective layer area including the area where the step is formed.

Figure 9 is a cross-sectional view showing a pattern imprinted within the film structure.

Figure 10 is a flowchart showing the film structure lamination process.

1 is a block diagram of an electronic device 101 in a network environment 100, according to various embodiments. Referring to FIG. 1, in the network environment 100, the electronic device 101 communicates with the electronic device 102 through a first network 198 (e.g., a short-range wireless communication network) or a second network 199. It is possible to communicate with the electronic device 104 or the server 108 through (e.g., a long-distance wireless communication network). According to one embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108. According to one embodiment, the electronic device 101 includes a processor 120, a memory 130, an input module 150, an audio output module 155, a display module 160, an audio module 170, and a sensor module ( 176), interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196 , or may include an antenna module 197. In some embodiments, at least one of these components (eg, the connection terminal 178) may be omitted or one or more other components may be added to the electronic device 101. In some embodiments, some of these components (e.g., sensor module 176, camera module 180, or antenna module 197) are integrated into one component (e.g., display module 160). It can be.

The processor 120, for example, executes software (e.g., program 140) to operate at least one other component (e.g., hardware or software component) of the electronic device 101 connected to the processor 120. It can be controlled and various data processing or calculations can be performed. According to one embodiment, as at least part of data processing or computation, the processor 120 stores commands or data received from another component (e.g., sensor module 176 or communication module 190) in volatile memory 132. The commands or data stored in the volatile memory 132 can be processed, and the resulting data can be stored in the non-volatile memory 134. According to one embodiment, the processor 120 includes a main processor 121 (e.g., a central processing unit or an application processor) or an auxiliary processor 123 that can operate independently or together (e.g., a graphics processing unit, a neural network processing unit ( It may include a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor). For example, if the electronic device 101 includes a main processor 121 and a secondary processor 123, the secondary processor 123 may be set to use lower power than the main processor 121 or be specialized for a designated function. You can. The auxiliary processor 123 may be implemented separately from the main processor 121 or as part of it.

The auxiliary processor 123 may, for example, act on behalf of the main processor 121 while the main processor 121 is in an inactive (e.g., sleep) state, or while the main processor 121 is in an active (e.g., application execution) state. ), together with the main processor 121, at least one of the components of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190) At least some of the functions or states related to can be controlled. According to one embodiment, co-processor 123 (e.g., image signal processor or communication processor) may be implemented as part of another functionally related component (e.g., camera module 180 or communication module 190). there is. According to one embodiment, the auxiliary processor 123 (eg, neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. Artificial intelligence models can be created through machine learning. For example, such learning may be performed in the electronic device 101 itself, where artificial intelligence is performed, or may be performed through a separate server (e.g., server 108). Learning algorithms may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but It is not limited. An artificial intelligence model may include multiple artificial neural network layers. Artificial neural networks include deep neural network (DNN), convolutional neural network (CNN), recurrent neural network (RNN), restricted boltzmann machine (RBM), belief deep network (DBN), bidirectional recurrent deep neural network (BRDNN), It may be one of deep Q-networks or a combination of two or more of the above, but is not limited to the examples described above. In addition to hardware structures, artificial intelligence models may additionally or alternatively include software structures.

The memory 130 may store various data used by at least one component (eg, the processor 120 or the sensor module 176) of the electronic device 101. Data may include, for example, input data or output data for software (e.g., program 140) and instructions related thereto. Memory 130 may include volatile memory 132 or non-volatile memory 134.

The program 140 may be stored as software in the memory 130 and may include, for example, an operating system 142, middleware 144, or application 146.

The input module 150 may receive commands or data to be used in a component of the electronic device 101 (e.g., the processor 120) from outside the electronic device 101 (e.g., a user). The input module 150 may include, for example, a microphone, mouse, keyboard, keys (eg, buttons), or digital pen (eg, stylus pen).

The sound output module 155 may output sound signals to the outside of the electronic device 101. The sound output module 155 may include, for example, a speaker or a receiver. Speakers can be used for general purposes such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part of it.

The display module 160 can visually provide information to the outside of the electronic device 101 (eg, a user). The display module 160 may include, for example, a display, a hologram device, or a projector, and a control circuit for controlling the device. According to one embodiment, the display module 160 may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of force generated by the touch.

The audio module 170 can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module 170 acquires sound through the input module 150, the sound output module 155, or an external electronic device (e.g., directly or wirelessly connected to the electronic device 101). Sound may be output through the electronic device 102 (e.g., speaker or headphone).

The sensor module 176 detects the operating state (e.g., power or temperature) of the electronic device 101 or the external environmental state (e.g., user state) and generates an electrical signal or data value corresponding to the detected state. can do. According to one embodiment, the sensor module 176 includes, for example, a gesture sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, It may include a temperature sensor, humidity sensor, or light sensor.

The interface 177 may support one or more designated protocols that can be used to connect the electronic device 101 directly or wirelessly with an external electronic device (eg, the electronic device 102). According to one embodiment, the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

The connection terminal 178 may include a connector through which the electronic device 101 can be physically connected to an external electronic device (eg, the electronic device 102). According to one embodiment, the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).

The haptic module 179 can convert electrical signals into mechanical stimulation (e.g., vibration or movement) or electrical stimulation that the user can perceive through tactile or kinesthetic senses. According to one embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

The camera module 180 can capture still images and moving images. According to one embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.

The power management module 188 can manage power supplied to the electronic device 101. According to one embodiment, the power management module 188 may be implemented as at least a part of, for example, a power management integrated circuit (PMIC).

The battery 189 may supply power to at least one component of the electronic device 101. According to one embodiment, the battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

Communication module 190 is configured to provide a direct (e.g., wired) communication channel or wireless communication channel between electronic device 101 and an external electronic device (e.g., electronic device 102, electronic device 104, or server 108). It can support establishment and communication through established communication channels. Communication module 190 operates independently of processor 120 (e.g., an application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module 190 is a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., : LAN (local area network) communication module, or power line communication module) may be included. Among these communication modules, the corresponding communication module is a first network 198 (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network 199 (e.g., legacy It may communicate with an external electronic device 104 through a telecommunication network such as a cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., LAN or WAN). These various types of communication modules may be integrated into one component (e.g., a single chip) or may be implemented as a plurality of separate components (e.g., multiple chips). The wireless communication module 192 uses subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 within a communication network such as the first network 198 or the second network 199. The electronic device 101 can be confirmed or authenticated.

The wireless communication module 192 may support 5G networks after 4G networks and next-generation communication technologies, for example, NR access technology (new radio access technology). NR access technology provides high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and access to multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low latency). -latency communications)) can be supported. The wireless communication module 192 may support high frequency bands (eg, mmWave bands), for example, to achieve high data rates. The wireless communication module 192 uses various technologies to secure performance in high frequency bands, for example, beamforming, massive array multiple-input and multiple-output (MIMO), and full-dimensional multiplexing. It can support technologies such as input/output (FD-MIMO: full dimensional MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module 192 may support various requirements specified in the electronic device 101, an external electronic device (e.g., electronic device 104), or a network system (e.g., second network 199). According to one embodiment, the wireless communication module 192 supports Peak data rate (e.g., 20 Gbps or more) for realizing eMBB, loss coverage (e.g., 164 dB or less) for realizing mmTC, or U-plane latency (e.g., 164 dB or less) for realizing URLLC. Example: Downlink (DL) and uplink (UL) each of 0.5 ms or less, or round trip 1 ms or less) can be supported.

The antenna module 197 may transmit or receive signals or power to or from the outside (eg, an external electronic device). According to one embodiment, the antenna module 197 may include an antenna including a radiator made of a conductor or a conductive pattern formed on a substrate (eg, PCB). According to one embodiment, the antenna module 197 may include a plurality of antennas (eg, an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 198 or the second network 199 is connected to the plurality of antennas by, for example, the communication module 190. can be selected Signals or power may be transmitted or received between the communication module 190 and an external electronic device through the at least one selected antenna. According to some embodiments, in addition to the radiator, other components (eg, radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module 197.

According to various embodiments, the antenna module 197 may form a mmWave antenna module. According to one embodiment, a mmWave antenna module includes: a printed circuit board, an RFIC disposed on or adjacent to a first side (e.g., bottom side) of the printed circuit board and capable of supporting a designated high frequency band (e.g., mmWave band); And a plurality of antennas (e.g., array antennas) disposed on or adjacent to the second side (e.g., top or side) of the printed circuit board and capable of transmitting or receiving signals in the designated high frequency band. can do.

At least some of the components are connected to each other through a communication method between peripheral devices (e.g., bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)) and signal ( (e.g. commands or data) can be exchanged with each other.

According to one embodiment, commands or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199. Each of the external

electronic devices

102 or 104 may be of the same or different type as the electronic device 101. According to one embodiment, all or part of the operations performed in the electronic device 101 may be executed in one or more of the external

electronic devices

102, 104, or 108. For example, when the electronic device 101 needs to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device 101 may perform the function or service instead of executing the function or service on its own. Alternatively, or additionally, one or more external electronic devices may be requested to perform at least part of the function or service. One or more external electronic devices that have received the request may execute at least part of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device 101. The electronic device 101 may process the result as is or additionally and provide it as at least part of a response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology can be used. The electronic device 101 may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device 104 may include an Internet of Things (IoT) device. Server 108 may be an intelligent server using machine learning and/or neural networks. According to one embodiment, the external electronic device 104 or server 108 may be included in the second network 199. The electronic device 101 may be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

Referring to FIG. 2 , the electronic device 200 according to one embodiment may include a housing 210 that forms the exterior of the electronic device 200. For example, housing 210 may include a first side 200A, a second side 200B, and a side 200C surrounding the space between the first side 200A and the second side 200B. there is. In one embodiment, the housing 210 may refer to a structure that forms at least a portion of the first surface 200A, the second surface 200B, and/or the side surfaces 200C.

The electronic device 200 according to one embodiment may include a substantially transparent front plate 202. In one embodiment, the front plate 202 may form at least a portion of the first surface 200A. In one embodiment, the front plate 202 may include, but is not limited to, a glass plate including various coating layers, or a polymer plate.

The electronic device 200 according to one embodiment may include a substantially opaque rear plate 211. In one embodiment, the rear plate 211 may form at least a portion of the second surface 200B. In one embodiment, back plate 211 may be formed by coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials. You can.

The electronic device 200 according to one embodiment may include a side bezel structure (or side member) 218. In one embodiment, the side bezel structure 218 may be combined with the front plate 202 and/or the back plate 211 to form at least a portion of the side 200C of the electronic device 200. For example, the side bezel structure 218 may form an entire side 200C of the electronic device 200, and in other examples, the side bezel structure 218 may form the front plate 202 and/or the back plate. Together with 211, it may form the side 200C of the electronic device 200.

Unlike the illustrated embodiment, when the side 200C of the electronic device 200 is partially formed by the front plate 202 and/or the rear plate 211, the front plate 202 and/or the rear plate ( 211 may include a region that is curved from its edge toward the rear plate 211 and/or the front plate 202 and extends seamlessly. The extended area of the front plate 202 and/or the rear plate 211 may be, for example, located at both ends of a long edge of the electronic device 200, but according to the above-described example, It is not limited.

In one embodiment, side bezel structure 218 may include metal and/or polymer. In one embodiment, the rear plate 211 and the side bezel structure 218 may be formed integrally and may include the same material (eg, a metal material such as aluminum), but are not limited thereto. For example, the back plate 211 and the side bezel structures 218 may be formed of separate construction and/or may include different materials.

In one embodiment, the electronic device 200 includes a display 201, an

audio module

203, 204, and 207, a sensor module (not shown), a

camera module

205, 212, and 213, a key input device 217, It may include at least one of a light emitting device (not shown) and/or a connector hole 208. In another embodiment, the electronic device 200 may omit at least one of the above components (e.g., key input device 217 or a light emitting device (not shown)) or may additionally include other components.

In one embodiment, display 201 may be visually exposed through a significant portion of front plate 202 . For example, at least a portion of display 201 may be visible through front plate 202 forming first side 200A. In one embodiment, the display 201 may be disposed on the back of the front plate 202.

In one embodiment, the outer shape of the display 201 may be substantially the same as the outer shape of the front plate 202 adjacent to the display 201. In one embodiment, in order to expand the area to which the display 201 is visually exposed, the distance between the outer edge of the display 201 and the outer edge of the front plate 202 may be formed to be substantially the same.

In one embodiment, the display 201 (or the first side 200A of the electronic device 200) may include a screen display area 201A. In one embodiment, the display 201 may provide visual information to the user through the screen display area 201A. In the illustrated embodiment, when the first side 200A is viewed from the front, the screen display area 201A is shown to be located inside the first side 200A and spaced apart from the outer edge of the first side 200A. However, it is not limited to this. In another embodiment, when the first side 200A is viewed head on, at least a portion of an edge of the screen display area 201A substantially coincides with an edge of the first side 200A (or the front plate 202). It could be.

In one embodiment, the screen display area 201A may include a sensing area 201B configured to obtain biometric information of the user. Here, the meaning of “the screen display area 201A includes the sensing area 201B” can be understood as at least a portion of the sensing area 201B being overlapped with the screen display area 201A. there is. For example, the sensing area 201B, like other areas of the screen display area 201A, can display visual information by the display 201 and can additionally acquire the user's biometric information (e.g., fingerprint). It can mean area. In another embodiment, the sensing area 201B may be formed in the key input device 217.

In one embodiment, the display 201 may include an area where the first camera 205 is located. In one embodiment, an opening is formed in the area of the display 201, and a first camera 205 (e.g., a punch hole camera) may be disposed at least partially within the opening to face the first side 200A. there is. In this case, the screen display area 201A may surround at least a portion of the edge of the opening. In another embodiment, the first camera 205 (eg, an under display camera (UDC)) may be placed below the display 201 to overlap the area of the display 201. In this case, the display 201 can provide visual information to the user through the area, and additionally, the first camera 205 corresponds to the direction toward the first side 200A through the area of the display 201. An image can be obtained.

In one embodiment, the display 201 is combined with or disposed adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of touch, and/or a digitizer that detects a magnetic field-type stylus pen. .

In one embodiment, the

audio modules

203, 204, and 207 may include microphone holes 203 and 204 and speaker holes 207.

In one embodiment, the microphone holes 203 and 204 include a first microphone hole 203 formed in a portion of the side 200C and a second microphone hole 204 formed in a portion of the second side 200B. can do. Microphones (not shown) may be placed inside the microphone holes 203 and 204 to acquire external sounds. The microphone may include a plurality of microphones to detect the direction of sound.

In one embodiment, the second microphone hole 204 formed in a partial area of the second surface 200B may be disposed adjacent to the

camera modules

205, 212, and 213. For example, the second microphone hole 204 may acquire sound according to the operation of the

camera modules

205, 212, and 213. However, it is not limited to this.

In one embodiment, the speaker hole 207 may include an external speaker hole 207 and a receiver hole (not shown) for a call. The external speaker hole 207 may be formed on a portion of the side 200C of the electronic device 200. In another embodiment, the external speaker hole 207 and the microphone hole 203 may be implemented as one hole. Although not shown, a receiver hole (not shown) for a call may be formed in another part of the side 200C. For example, the receiver hole for a call may be formed on the side opposite to the external speaker hole 207 on the side 200C. For example, based on the illustration in FIG. 2, the external speaker hole 207 is formed on the side 200C corresponding to the lower part of the electronic device 200, and the receiver hole for calls is formed on the upper part of the electronic device 200. It may be formed on the corresponding side (200C). However, it is not limited to this, and in another embodiment, the call receiver hole may be formed in a location other than the side 200C. For example, a receiver hole for a call may be formed by a spaced space between the front plate 202 (or display 201) and the side bezel structure 218.

In one embodiment, the electronic device 200 includes at least one speaker (not shown) configured to output sound to the outside of the housing through the external speaker hole 207 and/or the call receiver hole (not shown). can do.

In one embodiment, a sensor module (not shown) may generate an electrical signal or data value corresponding to an internal operating state of the electronic device 200 or an external environmental state. For example, the sensor module may include a proximity sensor, HRM sensor, fingerprint sensor, gesture sensor, gyro sensor, barometric pressure sensor, magnetic sensor, acceleration sensor, grip sensor, color sensor, IR (infrared) sensor, biometric sensor, temperature sensor, It may include at least one of a humidity sensor or an illuminance sensor.

In one embodiment, the

camera modules

205, 212, and 213 include a first camera 205 arranged to face the first side 200A of the electronic device 200, and a first camera 205 arranged to face the second side 200B. It may include a second camera 212 and a flash 213.

In one embodiment, the second camera 212 may include a plurality of cameras (eg, a dual camera, a triple camera, or a quad camera). However, the second camera 212 is not necessarily limited to including a plurality of cameras and may include one camera.

In one embodiment, the first camera 205 and the second camera 212 may include one or more lenses, an image sensor, and/or an image signal processor.

In one embodiment, the flash 213 may include, for example, a light emitting diode or a xenon lamp. In another embodiment, two or more lenses (an infrared camera, a wide-angle lens, and a telephoto lens) and image sensors may be placed on one side of the electronic device 200.

In one embodiment, the key input device 217 may be placed on the side 200C of the electronic device 200. In other embodiments, the electronic device 200 may not include some or all of the key input devices 217, and the key input devices 217 that are not included may be in other forms, such as soft keys, on the display 201. It can be implemented as:

In one embodiment, the connector hole 208 may be formed on the side 200C of the electronic device 200 to accommodate a connector of an external device. A connection terminal electrically connected to a connector of an external device may be disposed within the connector hole 208. The electronic device 200 according to one embodiment may include an interface module for processing electrical signals transmitted and received through the connection terminal.

In one embodiment, the electronic device 200 may include a light emitting device (not shown). For example, the light emitting device (not shown) may be disposed on the first side 200A of the housing. The light emitting device (not shown) may provide status information of the electronic device 200 in the form of light. In another embodiment, the light emitting device (not shown) may provide a light source linked to the operation of the first camera 205. For example, the light emitting device (not shown) may include an LED, an IR LED, and/or a xenon lamp.

3 is a perspective view of the housing, according to one embodiment.

Referring to FIG. 3, the housing 210 may form the exterior of the electronic device 200 (eg, the electronic device 200 of FIG. 2). For example, the electronic device 200 may include electronic components (eg, the first camera 205, the second camera 212, or the display 201 of FIG. 2) and a housing 210.

According to one embodiment, the electronic component may be at least one of the components of the electronic device 200 mounted within the housing 210 of the electronic device 200. At least a portion of the electronic component may be disposed within the housing 210 , and the remaining portion of the electronic component may be exposed to the outside of the housing 210 . For example, a portion of the camera may be placed inside the housing 210, and other electronic components within the housing 210 may be electrically connected to the printed circuit board. The remaining part of the camera may be exposed to the outside through the opening 309 formed in the housing 210. For another example, one side of the display 201 may be mounted inside the housing 210, and the other side facing the one side may be exposed to the outside of the housing 210.

According to one embodiment, housing 210 may include a film structure 300. The film structure 300 may form the exterior of the electronic device 200. According to one embodiment, the film structure 300 may be attached to at least a portion of the housing 210 of the electronic device 200. For example, the film structure 300 may comprise at least a portion of the first region 301a comprising a planar portion of the housing 210 and/or a portion of the second region 301b comprising a curved portion of the housing 210. It can be attached to at least part of it. For another example, the film structure 300 includes an opening 309 that exposes the electronic components of the housing 210 of the electronic device 200 to the outside, and a first region 301a of the housing 210 from the opening 309. ) may be attached to a portion of the third region 301c including a curved portion of the opening extending toward. The first area 301a corresponds to the first surface 200A or the second surface 200B of FIG. 2 . The second area 301b may correspond to the side 200C of FIG. 2 .

According to one embodiment, the film structure 300 forming the outer surface of the housing 210 may be visible from the outside of the electronic device 200. The film structure 300 may include a layer with a colorant to have a translucent or opaque color. The film structure 300 may be attached to the inner surface of the housing 210 facing the inside of the electronic device 200. Film structure 300 may be disposed on back plate 211 . For example, the film structure 300 may be attached to a portion of the first region 301a and the second region 301b of the inner surface of the housing 210 (eg, the inner surface of the rear plate 211). A portion of the housing 210 to which the film structure 300 containing the colorant layer is attached may have a transparent or translucent color. For another example, the film structure 300 containing the colorant may be attached to the outer surface of the housing 210 (eg, the outer surface of the back plate 211) facing the outside of the electronic device 200. The film structure 300 may be attached to a portion of the first area 301a and the second area 301b of the outer surface of the housing 210 to provide a visual effect. The film structure 300 containing colorants is not limited to the above-described embodiments. For example, the film structure 300 including the colorant extends from the opening 309 and the opening 309 toward the first region 301a of the housing 210 of the electronic device 200. It may be attached to a portion of the third area 301c of the opening. The film structure 300 has been described as being disposed in the first area 301a and the second area 301b of the rear plate 211, but is not limited thereto. For example, film structure 300 may be disposed on a window of a display (e.g., display 201 in FIG. 2) or on a side bezel structure (e.g., side bezel structure 218 in FIG. 2). You can.

According to one embodiment, the back plate 211 may form one side of the electronic device 200. The rear plate 211 may form a part of the housing 210 that has a shape corresponding to the exterior of the electronic device 200. For example, the rear plate 211 may form a second surface facing the display 201 (eg, the second surface 200B in FIG. 2). The rear plate 211 may be arranged to face the display 201.

According to one embodiment, the housing 210 may further include an opening 309. The opening 309 may expose at least one electronic component to the outside. The opening 309 may be formed in the rear plate 211 of the housing 210. The opening is not limited to being disposed in the rear plate 211, and may be formed in the side bezel structure 218 where a part partially exposed to the outside (eg, key button 217 in FIG. 2) is disposed.

According to one embodiment, the opening 309 formed in the housing 210 is located at a position corresponding to the camera of the electronic device 200 (e.g., the first camera 205 and the second camera 212 of FIG. 2). formed, the camera 230 can be exposed to the outside of the electronic device 200. For example, the opening 309 formed in the rear plate 211 may be formed at a position corresponding to the second camera of the electronic device 200 (eg, the second camera 213 in FIG. 2).

According to the above-described embodiment, the film structure 300 attached to the housing 210 or the back plate 211 can provide a visual effect.

Referring to FIG. 4 , the housing 210 of the electronic device 200 according to one embodiment may include a cover plate 400 and a film structure 300. The film structure 300 included in the housing 210 of the electronic device 200 may include a plurality of layers.

The cover plate 400 may be exposed to the outside. The cover plate 400 may form a part that is contacted by the user. The cover plate 400 is disposed on the outermost side of the electronic device 200 and can protect the electronic device 200 or at least one electronic component disposed inside the electronic device 200 from damage, and the housing 210 The structure can be maintained and protected. For example, the cover plate 400 forms at least a portion of the housing 210 of the electronic device 200 that is exposed to the user, and the film structure 300 is formed in a direction (+z) toward the outside of the electronic device 200. ) can be placed on the outermost side of the. According to one embodiment, when the cover plate 400 is disposed on the outermost side of the film structure 300 in the direction (+z) facing the outside of the electronic device 200, printing that may be included in the film structure 300 The cover plate 400 may be made of a transparent or translucent material so that the visual effect of the print layer 320 can be seen. For example, the cover plate 400 may include at least one of tempered glass and reinforced plastic.

The support member 500 may be disposed on the other side of the film structure 300 facing the attachment surface of the housing 210. The film structure 300 may be disposed between the housing 210 and the support member 500 of the electronic device 200. For example, one side of the film structure 300 may be in contact with the attachment surface of the housing 210, and the other side of the film structure 300 facing the one side may be in contact with the support member 500. The shape of the other surface of the film structure 300 may have a shape corresponding to the shape of the surface of the support member 500 facing the film structure 300. The film structure 300, which has a shape corresponding to the shape of the support member 500, may be coupled to the support member 500.

The film structure 300 may include at least one of a base layer 310, a printing layer 320, and a protecting layer 330. The film structure 300 including the base layer, the printing layer, and the protective layer can form the exterior of the electronic device 200. According to one embodiment, each layer constituting the plurality of layers included in the film structure 300 may have different characteristics as the constituent materials or ratios of constituent materials vary. For example, the rigidity of some of the plurality of layers included in the film structure may be different from the rigidity of the remaining layers.

The base layer 310 may provide a surface on which a printing material capable of forming a pattern is printed or may support the entire film structure 300. According to one embodiment, the base layer 310 may be disposed on one side of the printing layer 320. According to one embodiment, the base layer 310 may include a polymer material to support the entire film structure 300. The polymer material may form another layered structure of a certain thickness within the base layer 310 to provide a surface on which the printing material is printed. According to one embodiment, the base layer 310 may be disposed on one side of the printing layer 320 in a direction (+z) facing the outside of the electronic device 200. The base layer 310 may include a transparent or translucent polymer material so that the visual effect of the printing layer 320 can be displayed. For example, the base layer 310 is a polymer material made of transparent or translucent poly ethylenetere phthalate, poly methyl methacrylate, poly carbonate, and thermoplastic polyurethane. polyurethane). According to one embodiment, the base layer 310 may include an adhesive material to increase the adhesion of the base layer 310. The adhesive material may form another layered structure within the base layer 310 and may further include an adhesive layer. When the base layer 310 is disposed on the inner surface of the cover plate 400, the adhesive layer included in the base layer has a shape corresponding to the cover plate 400 and attaches the base layer 310 to the cover plate 400. It can be attached. The adhesive layer may include a transparent or translucent material so that the visual effect of the printing layer 320 can be displayed. For example, the adhesive layer may be made of OCA (optically clear adhesive), which is an adhesive material with a transparent or translucent layered structure.

The printing layer 320 may be included in the film structure 300 to provide a visual effect to the electronic device 200. According to one embodiment, the printing layer 320 may include a colorant to have a translucent or opaque color to provide a visual effect to the housing 210 of the electronic device 200. For example, at least one part of the printing layer 320 is transparent, and the remaining part except for one part has a translucent or opaque color, so that the printing layer 320 can provide a visual effect. For another example, a visual effect may be provided by removing a portion of the surface of the printed layer 320 to form a pattern (e.g., a pattern using laser engraving). As another example, the thickness of at least one part of the printing layer 320 having a translucent or opaque color is different from the thickness of the remaining part except for one part, or by adding a different amount of printing material to change the shade of color. A visual effect can be created due to differences in light and shade. According to one embodiment, a visual effect can be provided through vapor deposition coating on one side of the printing layer 320. For example, the deposited coating material on print layer 320 may have a different reflectivity than the cured print material included in print layer 320. Since the reflectance of the coating material and the printing material are different, the refraction angle of the light reflected on one side of the coating material and the refraction angle of the light reflected on one side of the printing layer 320 in contact with the coating material may be different. . Due to the difference in refraction angle, the vapor deposition coating deposited on the printed layer 320 can provide various visual effects. For another example, the deposition coating may include a plurality of deposition layers. Since the reflectance of each of the plurality of deposition layers is different, the refraction angle of each light reflected on one surface of each of the plurality of deposition layers may be different. Due to the difference in refraction angle, the plurality of deposited layers can provide various visual effects to a user looking at the film.

According to one embodiment, the printed layer 320 may form a part of the housing 210 facing the inside of the electronic device 200. In this case, so that the housing 210 including the film structure 300 can be easily coupled to the support member 500, one side of the printed layer 320 facing the support member 500 has the housing 210. It may have a shape corresponding to the shape of one surface of the support member 500 to which it is coupled. According to one embodiment, the print layer 320 may be cured through UV curing (ultraviolet-ray curing) or heat curing. According to one embodiment, the printing material is applied to a pad or roller and transferred to the base layer 310, and the printing material is naturally dried, or a designated pattern or pattern is printed on the base layer 310 using a printing device. Layer 320 may be formed.

The protective layer 330 may increase the adhesion of the film structure 300 or support the entire film structure 300. The protective layer 330 may be disposed on the outermost portion of the housing 210 in the direction (-z) toward the inside of the electronic device 200 so that the film structure 300 can be easily attached to the support member 500. there is. The shape of one side of the protective layer 330 to which the protective layer 330 is attached to the support member 500 may correspond to the shape of one side of the support member 500 to which the protective layer 330 is attached. According to one embodiment, the protective layer 330 may be disposed on one side of the printing layer 320. The shape of one side of the protective layer 330 that contacts the printing layer 320 may be different from the shape of the other side of the protective layer 330 that faces the one side. For example, a base layer 310 is disposed in the direction (-z) toward the inside of the electronic device 200, a print layer 320 is disposed on the base layer 310, and a print layer 320 is disposed on the print layer 320. When the protective layer 330 is disposed, one part of the printed layer 320 may be thicker than the remaining part. One side of the printed layer 320 facing the base layer 310 may be formed to correspond to the shape of one side of the base layer 310. The other side facing one side of the printed layer 320 may form a step. The other side of the print layer 320 may have a shape different from the one side of the print layer 320. The first part of the protective layer 330 facing a portion of the printed layer 320 is such that the sum of the thicknesses of the base layer 310, the printed layer 320, and the protective layer 330 is constant. It may be thinner than the second portion of the protective layer 330 that faces the remaining portion of the printing layer 320. The shape of one side of the protective layer 330 facing the printed layer 320 may have a step corresponding to the step formed on the printed layer 320. The shape of the other side facing one side of the protective layer 330 may correspond to the shape of the side on which the support member 500 is attached to the housing 210.

Although the protective layer 330 has been described as being disposed on one side of the printed layer 320 in the direction (-z) toward the inside of the electronic device 200, the present invention is not limited thereto. The overall thickness of the film structure 300 including the printing layer 320 and the protective layer 330 may be constant. In some parts of the film structure 300, the ratio of the printing layer 320 may be higher than that of the protective layer 330. Except for the portion of the film structure 300, the ratio of the printing layer 320 may be lower than that of the protective layer 330. The physical properties (e.g., rigidity) of the part and the remaining physical properties excluding the part may differ depending on the ratio of the printing layer 320 and the protective layer 330. For example, the electronic device 200 includes a base layer 310 in an outward direction (+z), a printed layer 320 on the base layer 310, and a protective layer ( 330) can be placed. One part of the printing layer 320 may be thicker than the remaining part. One side of the printed layer 320 facing the base layer 310 may be formed to correspond to the shape of one side of the base layer 310. The other side facing one side of the printed layer 320 may form a step. The other side of the print layer 320 may have a shape different from the one side of the print layer 320. The first part of the protective layer 330 facing a portion of the printed layer 320 is such that the sum of the thicknesses of the base layer 310, the printed layer 320, and the protective layer 330 is constant. It may be thinner than the second portion of the protective layer 330 that faces the remaining portion of the printed layer 320. The shape of one side of the protective layer 330 facing the printed layer 320 may have a step corresponding to the step formed on the printed layer 320. The shape of the other side facing one side of the protective layer 330 may be formed to correspond to the shape of the one side of the printed layer 320 facing the base layer 310.

According to one embodiment, the adhesive layer 331a may form one side of the housing 210 facing the inside of the electronic device 200 so that the housing 210 is attached to the support member 500. According to one embodiment, the film structure 300 may be disposed on the cover plate 400 in a direction (-z) toward the inside of the electronic device 200, and the adhesive layer 331a is coupled to the housing 210. It may be disposed between the support member 500 and the film structure 300. For example, the adhesive layer 331a may be disposed between the protective layer 330 and the support member 500. One side of the protective layer facing the inside of the electronic device 200 supports the film structure 300 to enhance the adhesion of the film structure 300 or the housing 210 including the protective layer 330. A shape corresponding to the shape of one side of the member 500 may be formed. For example, the other side of the protective layer 330 has a step corresponding to the shape of the printed layer 320, but one side of the protective layer 330 has the protective layer 330 and the support member 500. It may have a continuous surface to strengthen the adhesion between surfaces. The second adhesive layer 331a may have a layered structure corresponding to the shape of one side of the protective layer facing the support member 500.

According to the above-described embodiment, the film structure 300 has a surface facing the continuous support member 500 and can maintain adhesive force with the support member 500. The film structure 300 can increase adhesion in curved areas by providing a printing layer 320 and a protective layer 330 with different thicknesses depending on the area.

Referring to FIG. 5, the housing (e.g., housing 210 of FIG. 2) of an electronic device (e.g., electronic device 200 of FIG. 2) includes a cover plate (e.g., cover plate 400 of FIG. 4) and a film. It includes a structure 300, wherein the film structure 300 includes a base layer 310, a printed layer 320 disposed on the base layer 310, and a protective layer 330 disposed on the printed layer 320. ) may include.

According to one embodiment, the film structure 300 includes a molding layer ( molding layer) (323). The pattern may be formed through UV molding after applying the molding layer 323 material on the base layer 310. For example, an ultraviolet curable material may be applied on the base layer 310, and a mold including at least one ridge and a pattern formed by valleys extending from the ridge may be pressed to the ultraviolet curable material. Ultraviolet rays that have passed through the protective layer 330 may be irradiated to the ultraviolet curing material. The ultraviolet curing material may be cured into a shape corresponding to the shape of the mold. For example, a cured molding layer 323 may be formed, including a pattern formed by valleys 320c corresponding to at least one ridge of the mold and ridges 320d corresponding to the valleys of the mold. there is.

According to one embodiment, the film structure 300 may further include a reflective layer 324 disposed between the molding layer 323 and the printing layer 320. The reflective layer 324 may be disposed on one side where the pattern of the molding layer 323 is formed. The reflective layer 324 may have a constant thickness. The reflective layer 324 may include at least one valley 320c corresponding to the pattern of the molding layer 323 and a ridge 320d extending from the valley. The reflective layer 324 can provide various visual effects to the pattern formed on the molding layer 323. For example, one surface on which the pattern of the molding layer 323 is formed may vary the angle of reflection of light entering the film structure 300 from the outside. The reflective layer 324 is disposed on one surface of the molding layer 323 where the pattern is formed, and can provide various directions of light reflected by the pattern. The pattern and the reflective layer 324 may provide visual effects (e.g., holographic color, grain direction pattern) to the user. According to one embodiment, the reflective layer 324 may be omitted.

According to one embodiment, the printing layer 320 has one side facing the molding layer 323 and corresponds to the shape of the pattern formed on the molding layer 323, and one side facing the molding layer 323. The other side facing may be formed to correspond to the shape of one side of the base layer 310 formed at a constant thickness. The other side facing the surface of the molding layer 323 on which the pattern is formed may be formed to correspond to the shape of one side of the base layer 310 formed at a certain thickness. The thickness of the molding layer 323 varies from each of the valleys 320c and ridges formed on one side of the molding layer 323 facing the base layer 310 to the other side in contact with the printing layer 320. It can be assumed to be the RMS (root mean square) value of the thickness up to (320d). The thickness of the molding layer 323 may be expressed as the following equation.

According to one embodiment, Equation 1 is such that the thickness of the first area (e.g., the first area 301a of FIG. 3) is calculated by the thickness of the second area (e.g., the second area of FIG. 3) extending from the first area. It can also be applied to the printed layer 320, which is thinner than the thickness of (301b)) and includes a pattern formed of at least one valley 320c and a ridge 320d extending from the valley 320c. For example, when the printed layer 320 includes at least one valley 320c and a ridge 320d extending from the valley 320c, the thickness of the printed layer 320 in the first region and the The thickness of the printed layer 320 in the second area can be obtained through Equation 1.

Fig. 6A is a diagram showing a part of the housing. Figure 6b is a graph showing the relationship with compression strain when applying values related to curvature to the compression strain formula.

Referring to FIG. 6A, the housing (e.g., housing 210 of FIG. 2) of an electronic device (e.g., electronic device 200 of FIG. 2) has a second side (e.g., first side 200A of FIG. 2 or A first region 300B formed as a plane corresponding to the second surface 200B) and a curved surface extending from a part of the first region, surrounding the side of the housing 210 (e.g., 200C in FIG. 2) It may include a second area 300A. The housing 210 may include a cover plate (eg, cover plate 400 in FIG. 4) and a film structure (eg, film structure 300 in FIG. 4).

According to one embodiment, the film structure 300 may require a predetermined level of compressive strain in order to be bonded or attached to the cover plate 400. The compressive strain may be determined based on the height of the curved area and the minimum radius of curvature of the second area 300A. The height of the curved area may be the longest vertical distance (H) among the vertical distances from the surface of the first area 300B to the second area 300A. The minimum radius of curvature may be the smallest radius of curvature (R) among the radii of curvature of the curved surface forming the surface facing the inside of the electronic device in the second area 300A.

The longest vertical distance on the long side (Sag_l) may be H_l, and the longest vertical distance on the short side (Sag_s) may be H_s. The longest vertical distance in the corner area 300E where curved surfaces meet may be H_c.

The longest vertical distance (H_l) on the long side (Sag_l) may be the longest vertical distance from one side of the first area (300B) to the second area (300A) when cut along the long side. The longest vertical distance (H_s) on the short side (Sag_s) may be the longest vertical distance from one side of the first area (300B) to the second area (300A) in a plane cut along the short side.

According to one embodiment, the film structure 300 connects two sides of the side of the housing (e.g., the side 200C in FIG. 2) and has a convex curved surface in the direction toward the outside of the electronic device 200. It may further include a corner area 300E.

The longest vertical distance (H_c) in the corner area 300E where the curved surfaces meet is the vertical distance from one side of the first area 300B to the second area 300A on the surface where the corner area 300E is cut. It may be the longest distance. The minimum radius of curvature R in the corner area 300E may be the smallest radius of curvature among the radii of curvature of the curved surface forming the surface facing the inside of the electronic device in the corner area 300E.

According to one embodiment, the thickness of the film structure 300 is the same, and any one layer included in the film structure 300 has a thickness of the first portion disposed on the first region 300B. It may be formed to be thinner than the thickness of the second portion of any of the layers disposed on the second area 300A, thereby forming a step. The film structure 300 may further include a step area 300C where the step is formed.

Referring to FIG. 6B, the graph 610 shows the relationship with Equation 2 below. The vertical axis of the graph 610 represents the value calculated when substituting the longest vertical distance (H_l) on the long side (Sag_l) and the longest vertical distance (H_s) on the short side (Sag_s) into Equation 2. The horizontal axis of the graph 610 represents the actual compression strain of the film structure having the values of the longest vertical distance (H_l) on the long side (Sag_l) and the longest vertical distance (H_s) on the short side (Sag_s). The solid line in the graph 610 shows the value calculated according to Equation 2 on the x-axis, and the x-coordinate and y-coordinate may be the same. A solid line may be a straight line with a slope of 1. Among the graphs shown as dotted lines in the graph 610, the graph shown below the solid line shows the 90% value of the compressive strain value calculated based on Equation 2 on the y-axis, and the graph shown as a dotted line in the graph 610 Among them, the graph shown above the solid line shows on the y-axis a value of 110% of the compressive strain value calculated based on Equation 2. The coordinate values of the points shown in the graph 610 may be the actually measured compressive strain (x-coordinate) or the compressive strain (y-coordinate) calculated by a formula.

Equation 2 representing the graph 610 is as follows.

H_s in Equation 2 is the longest vertical distance on the short side (Sag_s), and H_l is the longest vertical distance on the long side (Sag_l). Compression strain is the strain rate depending on the compressive force applied to the film structure when attaching it to the housing. Referring to the graph 610, the compression strain (e.g., y-axis value) calculated by the values of the longest vertical distance (H_s) on the short side (Sag_s) and the longest vertical distance (H_l) on the long side (Sag_l) of the housing. ) is 2.8 (%) or more, the actual compression strain may be 3% (e.g., x-axis value) or more.

The graph 620 shows the relationship with Equation 3 below. The vertical axis of the graph 620 is expressed in Equation 3 as follows: the longest vertical distance (H_c) in the corner area 300E where the curved surfaces meet and the radius of curvature of the curved surface forming the surface facing the inside of the electronic device in the second area 300A. Indicates the value calculated when the smallest radius of curvature (R) is substituted. The horizontal axis of the graph 620 represents the actual compressive strain of the film structure having the values of the longest vertical distance (H_c) and radius of curvature (R) in the corner area (300E). The solid line in the graph 620 shows the value calculated according to Equation 3 on the x-axis, and the x-axis coordinate and y-axis coordinate of the solid line may be the same. A solid line may be a straight line with a slope of 1. Among the graphs shown as dotted lines in the graph 620, the graph shown below the solid line shows 90% of the compressive strain value calculated based on Equation 3 on the y-axis. Among the graphs shown as dotted lines in the graph 620, the graph shown above the solid line shows a value of 110% of the compressive strain value calculated based on Equation 3 on the y-axis. The coordinate values of the points shown in the graph 620 may be the actually measured compressive strain (x-coordinate) or the compressive strain (y-coordinate) calculated using a formula.

Equation 3 on the vertical axis of the graph 620 is as follows.

H_c in Equation 3 is the longest vertical distance in the corner area 300E, and R is the smallest radius of curvature among the radii of curvature of the curved surface forming the surface facing the inside of the electronic device in the second area 300A. Compression strain is the strain rate depending on the compressive force applied to the film structure when attaching it to the housing. Referring to the graph 620, when the compressive strain calculated by Equation 3 based on the values of the longest vertical distance (H_c) and radius of curvature (R) in the corner area 300E is 2.5 (%) or more, The actual compressive strain may be 3% or more.

According to one embodiment, in the second area (e.g., the second area 300A in FIG. 6A) or the corner area 300E, the adhesion between the cover plate 400 and the film structure 300 is maintained or wrinkles are prevented from forming. For this, a compression strain of 3% or more may be required. According to one embodiment, referring to the points of the graph 610 derived according to experimental values, the value according to Equation 2 exceeds 2.8 (%). The film structure 300 having the values of the factors H_l and H_c may have a compression ratio of 3% or more to maintain the adhesion between the cover plate 400 and the film structure 300. , Referring to the points of the graph 620, the film structure 300 having values of the factors (H_c, R) where the value calculated according to Equation 3 exceeds 2.5 (%) is the cover plate 400. It may have a compression ratio of 3% or more to maintain the adhesion of the film structure 300.

According to one embodiment, the values of the design factors (H_l, H_s, H_c, and R) of the housing 210 may be determined based on the above equation so that the compression strain is 3% or more. The second area 300A of the housing 210 may be formed to have a compressive strain of 3% or more based on Equation 2 or Equation 3 above. The first area (eg, first area 300B in FIG. 6A) of the housing 210 may have a lower tensile strength than the second area 300A. For example, the corner area 300E may include a first area 300B and a second area 300A. The printing layer 320 disposed on the first area 300B of the housing 210 may be thinner than the printing layer 320 disposed on the second area 300A included in the corner area 300E. According to one embodiment, a printed layer 320 disposed on the first area 300B included in the corner area 300E and a printed layer disposed on the second area 300A included in the corner area 300E. Due to the difference in thickness of 320, a step area (eg, step area 300C in FIG. 6A) may be formed in the printed layer 320. The step area 300C may be an area where a step is formed between the first area 300B and the second area 300A. The rigidity of the protective layer 330 may be lower than that of the printed layer 320 as the components or ratios of the components vary from those of the printed layer 320. The thickness of a portion of the protective layer 330 disposed on the first area 300B included in the corner area 300E is the thickness of the protective layer 330 disposed on the second area 300A included in the corner area 300E. It may be thicker than the thickness of the rest of the protective layer 330. For example, the shape of one side of the protective layer 330 facing the printed layer 320 may correspond to the shape of the step 320a formed on the printed layer 320. The protective layer 330 may include steps corresponding to the shape of the printing layer 320. The thickness of the printed layer 320 disposed on the first area 300B included in the corner area 300E is the thickness of the printed layer 320 disposed on the second area 300A included in the corner area 300E. Since it is thinner than the thickness of , the overall thickness of the printing layer 320 and the protective layer 330 can be maintained the same.

According to one embodiment, the overall thickness of the base layer 310, the printing layer 320, and the protective layer 330 included in the housing 210 of the electronic device 200 is constant, and the thickness of the housing 210 is constant. The stiffness of the second area 300A included in the corner area 300E may be greater than the stiffness of the first area 300B of the housing 210. In the first area 300B, the ratio of the printing layer 320 to the protective layer 330 is calculated based on the protective layer 330 in the second area 300A included in the corner area 300E. It may be lower than the ratio of layer 320. Since the rigidity of the printed layer 320 is higher than that of the protective layer 330, the rigidity of the housing 210 in the second area 300A included in the corner area 300E where the proportion of the printed layer 320 is high is , may be higher than the first area 300B.

Referring to FIG. 7A, the housing 210 (e.g., the housing 210 in FIG. 3) of the electronic device 200 (e.g., the electronic device 200 in FIG. 3) has a second side (e.g., the second side in FIG. 2). A first area 300B formed as a plane corresponding to the first surface 200A or the second surface 200B) and a curved surface extending from a part of the first area, and a side surface of the housing 210 (e.g., FIG. It may include a second area (300A) surrounding (200C of 2).

According to one embodiment, the housing 210 may include the planar shape of the electronic device 200 in the first area 300B. For example, the first area 300B may include at least one of the display 201 of FIG. 2 and a flat portion of the back plate 211.

According to one embodiment, the second area 300A may be a part of the housing 210 having a curved shape of the electronic device 200. For example, the second area 300A may be a curved portion extending from a portion of a portion including at least one of the flat portions of the display 201 and the back plate 211 of FIG. 2 . As another example, the second area 300A may be a portion of the side bezel structure 218 of FIG. 2 extending from a portion of the curved portion.

According to one embodiment, the housing 210 of the electronic device 200 may include a cover plate 400 and a film structure 300 disposed on the cover plate 400. The film structure 300 may include a base layer 310, a printing layer 320, and a protective layer 330. The overall thickness of the cover plate 400, base layer 310, printing layer 320, and protective layer 330 may be constant.

According to one embodiment, the base layer 310 may be disposed on the cover plate 400 in the direction (-z) toward the inside of the electronic device 200. For example, the base layer 310 may include a layered adhesive layer 311a and a film layer 312 made of a polymer material, and the adhesive layer 311a is the adhesive layer 312 of the cover plate 400 and the base layer 310. It may be placed on one side of the cover plate 400 facing the base layer 310 to improve adhesion. According to one embodiment, the adhesive layer 311a may be made of OCA to improve adhesion between the film layer 312 and the cover plate 400.

According to one embodiment, the printing layer 320 may be disposed on the base layer 310 in the direction (-z) toward the inside of the electronic device 200. A printing material may be cured on one side of the base layer 310 facing the cover plate 400 and on the other side facing the cover plate 400 to form a layered structure. For example, the printed layer 320 may be formed by irradiating ultraviolet rays or applying heat to a precursor containing a UV curable material or a heat curable material. For another example, a printing material may be applied to a pad or roller, transferred to the base layer 310, and the printing material may be naturally dried to form the printing layer 320. For another example, a printed layer 320 having a designated pattern or design may be formed on the base layer 310 using a printing device.

According to one embodiment, the printed layer 320 is disposed on a first printed layer 321 whose one side is in contact with the base layer 310 and on the other side facing the one side of the first printed layer 321. It may include a second printed layer 322. The printed layer 320 has been described as including the first printed layer 321 and the second printed layer 322, but is not limited thereto.

According to one embodiment, the print layer 320 disposed on the first area 300B may be thinner than the print layer 320 disposed on the second area 300A. For example, the thickness d1 of the first portion of the printed layer 320 disposed on the first area 300B is the thickness d1 of the second portion of the printed layer 320 disposed on the second area 300A. It may be thinner than the thickness (d2).

According to one embodiment, the first printed layer 321 and the second printed layer 322 may be formed of the same material or may be formed of different materials. Regardless of the materials of the first printed layer 321 and the second printed layer 322, the thickness d1 of the first portion of the printed layer 320 disposed on the first area 300B is the thickness d1 of the second area 320. It may be thinner than the thickness d2 of the second portion of the printed layer 320 disposed on 300A. For example, the first printed layer 321 disposed on the first area 300B may be thinner than the first printed layer 321 disposed on the second area 300A. The second printed layer 322 disposed on the first area 300B may be thinner than the second printed layer 322 disposed on the second area 300A. For another example, the first printed layer 321 may have the same thickness in the first area 300B and the second area 300A. The second printed layer 322 disposed on the first area 300B may be thinner than the second printed layer 322 disposed on the second area 300A. For another example, the first printed layer 321 disposed on the first area 300B may be thinner than the first printed layer 321 disposed on the second area 300A. The second printed layer 322 may have the same thickness in the first area 300B and the second area 300A.

According to one embodiment, the first printed layer 321 and the second printed layer 322 may be formed of the same material. The thickness d1 of the first portion of the printed layer 320 disposed on the first area 300B is the thickness d2 of the second portion of the printed layer 320 disposed on the second area 300A. It can be thinner. For example, the first printed layer 321 may have the same thickness in the first area 300B and the second area 300A. The second printed layer 322 may be disposed only on the second area 300A with a constant thickness. For another example, the first printed layer 321 may be disposed only on the second area 300A. The second printed layer 322 may have the same thickness in the first area 300B and the second area 300A.

According to one embodiment, due to the difference in thickness between the printed layer 320 disposed on the first area 300B and the printed layer 320 disposed on the second area 300A, the printed layer 320 is, A first step area 300C-1 may be formed. The first step area 300C-1 may be an area where a step 320a is formed between the first area 300B and the second area 300A.

According to one embodiment, the protective layer 330 may be disposed on the printed layer 320 in the direction (-z) toward the inside of the electronic device 200. The protective layer 330 may have different physical properties from the printed layer 320 as the components or ratios of the components vary from those of the printed layer 320.

According to one embodiment, the rigidity of the protective layer 330 may be lower than that of the printing layer 320. For example, the protective layer 330 includes at least one of heat-cured or UV-cured printed material, but may have lower rigidity than the printed layer 320 depending on the components or ratios of the components.

According to one embodiment, the thickness of some of the protective layers 330 disposed on the first area 300B may be thicker than the thickness of the remaining protective layers 330 disposed on the second area 300A. You can. For example, the shape of one side of the protective layer 330 facing the printed layer 320 may correspond to the shape of the step 320a formed on the printed layer 320. The protective layer 330 may include steps corresponding to the shape of the printing layer 320. Since the thickness of the printed layer 320 disposed on the first area 300B is thinner than the thickness of the printed layer 320 disposed on the second area 300A, the printed layer 320 and the protective layer 330 The overall thickness can remain the same.

According to one embodiment, the protective layer 330 has a certain surface energy and can form a contact angle to increase adhesion. For example, a support member (e.g., support member 500 in FIG. 4) supporting the electronic device 200 on one side of the protective layer 330 facing the printed layer 320 and the other side facing the printed layer 320. When attached, the protective layer 330 can increase adhesion by forming a surface energy of 25 dynes to 45 dynes (1 dyne = 1g*cm/s^2) and a contact angle of 90 to 105 degrees. According to one embodiment, the protective layer 330 may have a thickness of 8 μm to 10 μm or more to improve the quality and yield of the film structure 300.

According to one embodiment, the overall thickness of the base layer 310, the printing layer 320, and the protective layer 330 included in the housing 210 of the electronic device 200 is constant, and the thickness of the housing 210 is constant. The rigidity of the second area 300A may be greater than the rigidity of the first area 300B of the housing 210. In the first area 300B, the ratio of the printed layer 320 with respect to the protective layer 330 is lower than the ratio of the printed layer 320 with respect to the protective layer 330 in the second area 300A. You can. Since the rigidity of the printed layer 320 is higher than that of the protective layer 330, the rigidity of the housing 210 in the second area 300A, where the proportion of the printed layer 320 is high, is higher than that in the second area 300B. It can be high. Based on thickness, the thickness d2 of the printed layer 320 in the second area 300A is thicker than the thickness d1 of the printed layer 320 in the first area 300B, so the second area 300A ), the rigidity of the housing 210 may be higher than that of the first region 300B.

According to the above-described embodiment, the electronic device 200 can reduce wrinkles when attached to the cover plate 400 by having the film structure 300 have high rigidity in the second area 300A. Because the film structure 300 has low rigidity in the first region 300B, the tensile force required when the film structure 300 is attached to the cover plate 400 can be reduced. For example, if the tensile force required for the film structure 300 is large when the film structure 300 is attached to the cover plate 400, the film structure 300 may require attachment of the flat portion of the cover plate 400. It may be difficult to extend to cover the entire area (eg, the area of the cover plate 400 corresponding to the first area 300B). The film structure 300, which requires a small tensile force when attached to the cover plate 400 in the first area 300B, may be extended and attached to the area where attachment of the cover plate 400 is required. The film structure 300 having sufficient tensile force attached to the cover plate 400 can prevent peeling from the cover plate 400 after attachment.

FIGS. 7B and 7C are partial cross-sectional views showing an example in which the housing is cut along line C-C' of FIG. 3, according to one embodiment.

Referring to FIG. 7B, at least a portion of the electronic components mounted within the housing (e.g., the housing 210 of FIG. 2) of the electronic device (e.g., the electronic device 200 of FIG. 2) may be disposed within the housing 210. And some of the remaining electronic components may be exposed to the outside of the housing 210. For example, a portion of the camera (e.g., the first camera 205 and the second camera 212 in FIG. 2) is disposed inside the housing 210, and other electronic components within the housing 210 are printed circuit boards. can be electrically connected to. The remaining part of the camera may be exposed to the outside through the opening 309 formed in the housing 210.

According to one embodiment, the housing 210 includes a first region 300B formed as a plane corresponding to a second surface (e.g., the first surface 200A or the second surface 200B in FIG. 2) and the first region 300B. It is formed as a curved surface extending from a part of area 1 and may include a second area 300A surrounding the side of the housing 210 (eg, 200C in FIG. 2). The housing 210 may further include an opening 309 that exposes the electronic component to the outside, and a third region 300D formed as a curved surface extending from the opening 309 toward the outside. For example, the rear plate forming the housing 210 (e.g., the rear plate 211 in FIG. 2) has an opening 309 formed on the first area 300B and a third area 300D. Through this, a part of the camera (eg, the second camera 212 in FIG. 2) may be exposed to the outside of the housing 210, and the remainder of the second camera 212 may be placed inside the housing 210.

According to one embodiment, the housing 210 of the electronic device 200 includes the first area 300B, the second area 300A, and the third area 300D, and defines the interior of the electronic device 200. A cover plate 400 in the direction (-z), a base layer 310 disposed on the cover plate 400, a print layer 320 disposed on the base layer 310, and the print layer 320. ) may include a protective layer 330 disposed on the.

According to one embodiment, the print layer 320 disposed on the first area 300B may be thinner than the print layer 320 disposed on the third area 300D. For example, the thickness d1 of the first portion of the printed layer 320 disposed on the first area 300B is the thickness d1 of the third portion of the printed layer 320 disposed on the third area 300D. It may be thinner than the thickness (d2).

According to one embodiment, the first printed layer 321 and the second printed layer 322 may be formed of the same material or may be formed of different materials. Regardless of the materials of the first printed layer 321 and the second printed layer 322, the thickness d1 of the first portion of the printed layer 320 disposed on the first area 300B is the thickness d1 of the third area It may be thinner than the thickness d2 of the third portion of the printed layer 320 disposed on (300D). For example, the first printed layer 321 disposed on the first area 300B may be thinner than the first printed layer 321 disposed on the third area 300D. The second printed layer 322 disposed on the first area 300B may be thinner than the second printed layer 322 disposed on the third area 300D. For another example, the first printed layer 321 may have the same thickness in the first area 300B and the third area 300D. The second printed layer 322 disposed on the first area 300B may be thinner than the second printed layer 322 disposed on the third area 300D. For another example, the first printed layer 321 disposed on the first area 300B may be thinner than the first printed layer 321 disposed on the third area 300D. The second printed layer 322 may have the same thickness in the first area 300B and the third area 300D.

According to one embodiment, the first printed layer 321 and the second printed layer 322 may be formed of the same material. The thickness d1 of the first portion of the printed layer 320 disposed on the first area 300B is the thickness d2 of the third portion of the printed layer 320 disposed on the third area 300D. It can be thinner. For example, the first printed layer 321 may have the same thickness in the first area 300B and the third area 300D. The second printed layer 322 may be disposed only on the third area 300D with a constant thickness. For another example, the first printed layer 321 may be disposed only on the third area 300D. The second printed layer 322 may have the same thickness in the first area 300B and the third area 300D.

According to one embodiment, due to the difference in thickness between the printed layer 320 disposed on the first area 300B and the printed layer 320 disposed on the third area 300A, the printed layer 320 is, A second step area 300C-2 may be formed. The second step area 300C-2 may be an area where a step (eg, step 320a in FIG. 7A) is formed between the first area 300B and the third area 300D.

According to one embodiment, the thickness of some of the protective layers 330 disposed on the first area 300B may be thicker than the thickness of the remaining protective layers 330 disposed on the third area 300D. You can. For example, the shape of one side of the protective layer 330 facing the printed layer 320 may correspond to the shape of the step 320a formed on the printed layer 320. The protective layer 330 may include steps corresponding to the shape of the printing layer 320. Since the thickness of the printed layer 320 disposed on the first area 300B is thinner than the thickness of the printed layer 320 disposed on the third area 300D, the printed layer 320 and the protective layer 330 The overall thickness can remain the same.

According to one embodiment, the overall thickness of the base layer 310, the printing layer 320, and the protective layer 330 included in the housing 210 of the electronic device 200 is constant, and the thickness of the housing 210 is constant. The rigidity of the third region 300D may be greater than the rigidity of the first region 300B of the housing 210. In the first area 300B, the ratio of the printed layer 320 with respect to the protective layer 330 is lower than the ratio of the printed layer 320 with respect to the protective layer 330 in the third area 300D. You can. Since the rigidity of the printed layer 320 is higher than that of the protective layer 330, the rigidity of the housing 210 in the third area 300D, where the proportion of the printed layer 320 is high, is higher than that in the second area 300B. It can be high.

Referring to FIG. 7C, the housing (e.g., housing 210 of FIG. 2) of an electronic device (e.g., electronic device 200 of FIG. 2) has a second side (e.g., first side 200A of FIG. 2 or A first region 300B formed as a plane corresponding to the second surface 200B) and a curved surface extending from a part of the first region, surrounding the side of the housing 210 (e.g., 200C in FIG. 2) It may include a second area 300A. The housing 210 may further include an opening 309 that exposes the electronic component to the outside, and a third region 300D formed as a curved surface extending from the opening 309 toward the outside.

According to one embodiment, the structure of the housing 210 disposed in the opening 309 and the third area 300D formed as a curved surface extending outward from the opening 309 may be different from that of FIG. 7B. . For example, in FIG. 7B, the film structure 300 and the cover plate 400 disposed in the third region 300D are bent toward the inside (-z direction) of the electronic device 200, but in FIG. 7C, the first The film structure 300 and the cover plate 400 disposed in area 3 300D may be bent outward (+z direction) of the electronic device 200.

According to one embodiment, the housing 210 of the electronic device 200 has an opening 309 and a curved surface extending from the opening 309 and extending in a direction (+z) toward the outside of the electronic device 200. It may include a third area 300D formed of . The housing 210 may include a first area 300B, a second area 300A, and a third area 300D. The housing 210 includes a cover plate 400, a base layer 310, a printed layer 320, and a protective layer 330 sequentially arranged in the direction (-z) toward the inside of the electronic device 200. It can be included. For example, the cover plate 400 may form the outer surface of the housing 210. The base layer 310 may be disposed on the cover plate 400 . The printing layer 320 may be disposed on the base layer 310. The protective layer 330 may be disposed on the printing layer 320.

According to one embodiment, the overall thickness of the base layer 310, the printing layer 320, and the protective layer 330 included in the housing 210 of the electronic device 200 is constant, and the thickness of the housing 210 is constant. The rigidity of the third region 300D may be greater than the rigidity of the first region 300B of the housing 210. In the first area 300B, the thickness d1 of the printing layer 320 with respect to the protective layer 330 is equal to the thickness d1 of the printing layer 320 with respect to the protective layer 330 in the third area 300D. It may be thinner than the thickness (d2). Since the rigidity of the printed layer 320 is higher than that of the protective layer 330, the rigidity of the housing 210 in the third area 300D, where the proportion of the printed layer 320 is high, is higher than that in the second area 300B. It can be high.

According to the above-described embodiment, the electronic device 200 can reduce wrinkles when attached to the cover plate 400 by having the film structure 300 have high rigidity in the third region 300D. Since the overall thickness of the film structure 300 is the same, peeling of the film structure 300 attached to the housing 210 can be reduced when an impact is applied to the electronic device exposed through the opening 309.

Referring to FIG. 7D, the housing (e.g., housing 210 of FIG. 2) of an electronic device (e.g., electronic device 200 of FIG. 2) has a second side (e.g., first side 200A of FIG. 2 or A first region 300B formed as a plane corresponding to the second surface 200B) and a curved surface extending from a part of the first region, surrounding the side of the housing 210 (e.g., 200C in FIG. 2) It may include a second area 300A. The housing 210 includes a cover plate 400, a base layer 310 disposed on the cover plate 400, and a top of the base layer 310 in the direction (-z) toward the inside of the electronic device 200. It may include a printed layer 320 disposed on and a protective layer 330 disposed on the printed layer 320.

According to one embodiment, the base layer 310 disposed on the first area 300B may be thinner than the base layer 310 disposed on the second area 300A. For example, the thickness d3 of the first portion of the base layer 310 disposed on the first area 300B is the thickness d3 of the second portion of the base layer 310 disposed on the second area 300A. It may be thinner than the thickness (d4).

According to one embodiment, the first printed layer 321 and the second printed layer 322 may be formed of the same material or may be formed of different materials. Regardless of the materials of the first printed layer 321 and the second printed layer 322, the thickness of the printed layer 320 may be the same. Since the thickness d3 of the first portion of the base layer 310 is thinner than the thickness d4 of the second portion of the base layer 310, the base layer 310 disposed on the first region 300B A first step area 300C-1 may be formed in the printed layer 320 due to a difference in thickness between the base layer 310 disposed on the and second area 300A. The first step area 300C-1 may be an area where a step 320a is formed between the first area 300B and the second area 300A.

According to one embodiment, the protective layer 330 may be disposed on the printed layer 320 in the direction (-z) toward the inside of the electronic device 200. The protective layer 330 may have different physical properties from the base layer 310 as the components or ratios of the components vary from those of the base layer 310. The rigidity of the protective layer 330 may be lower than that of the base layer 310.

According to one embodiment, the thickness of some of the protective layers 330 disposed on the first area 300B may be thicker than the thickness of the remaining protective layers 330 disposed on the second area 300A. You can. For example, the shape of one side of the protective layer 330 facing the printed layer 320 may correspond to the shape of the step 320a formed on the printed layer 320. The protective layer 330 may include steps corresponding to the shape of the printing layer 320. The thickness of the base layer 310 disposed on the first area 300B is thinner than the thickness of the base layer 310 disposed on the second area 300A, and the thickness of the print layer 320 is the same, so printing The overall thickness of layer 320 and protective layer 330 may remain the same.

According to one embodiment, the overall thickness of the base layer 310, the printing layer 320, and the protective layer 330 included in the housing 210 of the electronic device 200 is constant, and the thickness of the housing 210 is constant. The rigidity of the second area 300A may be greater than the rigidity of the first area 300B of the housing 210. In the first area 300B, the ratio of the base layer 310 with respect to the protective layer 330 is different from the ratio of the base layer 310 with respect to the protective layer 330 in the second area 300A. You can. Since the rigidity of the base layer 310 is higher than that of the protective layer 330, the rigidity of the housing 210 in the second area 300A, where the ratio of the base layer 310 is high, is higher than that in the first area 300B. It can be high. Based on thickness, the thickness d4 of the base layer 310 in the second area 300A is thicker than the thickness d3 of the base layer 310 in the first area 300B, so the second area 300A ), the rigidity of the housing 210 may be higher than that of the first region 300B.

In the above-described embodiment, the rigidity of the base layer 310 is described as being higher than that of the protective layer 330, but the present invention is not limited thereto. For example, the rigidity of the base layer 310 may be lower than the rigidity of the protective layer 330. The ratio of the base layer 310 in the first area 300B is formed to be low relative to the protective layer 330 in the second area 300A, so that the ratio of the protective layer 330 is high. The rigidity of the housing 210 in the second area 300A may be higher than that in the first area 300B. Based on thickness, the thickness d4 of the base layer 310 in the second area 300A may be thinner than the thickness d3 of the base layer 310 in the first area 300B. Since the thickness d4 of the base layer 310 in the second area 300A is thinner than the thickness d3 of the base layer 310 in the first area 300B, in the second area 300A The rigidity of the housing 210 may be higher than that of the first region 300B.

According to one embodiment, the overall thickness of the cover plate 400, the base layer 310, the printing layer 320, and the protective layer 330 included in the housing 210 of the electronic device 200 may be constant. You can. For example, the cover plate 400 may not include a pattern and may maintain a constant thickness. The thickness of the film structure 300 including the base layer 310, the printing layer 320, and the protective layer 330 may be constant. By attaching the film structure 300 to the cover plate 400, the overall thickness of the housing 210 including the film structure 300 may be constant.

According to one embodiment, the overall thickness of the cover plate 400, the base layer 310, the printing layer 320, and the protective layer 330 may vary depending on the thickness of the cover plate 400. For example, when the cover plate 400 includes an uneven pattern, the actual thickness of the cover plate 400 may be different. The thickness of the film structure 300 including the base layer 310, the printing layer 320, and the protective layer 330 is formed to be substantially the same, and the thickness of the housing 210 can be formed to vary depending on the region. there is.

According to the above-described embodiment, the electronic device 200 can reduce wrinkles when attached to the cover plate 400 by having the film structure 300 have high rigidity in the second area 300A. Because the film structure 300 has low rigidity in the first region 300B, the tensile force required when the film structure 300 is attached to the cover plate 400 can be reduced.

Referring to FIG. 8A , in the first process 801, the print layer 320 may be laminated on the base layer 310. The printed layer 320 may have a step area (eg, the first step area 300C-1 in FIG. 7A or the second step area 300C-2 in FIG. 7B). To form the step area of the printed layer 320, the printed layer 320 may be printed twice. For example, a basic print layer may be printed on the base layer 310 at a specified thickness. On the basic print layer, additional print layers can be printed. The additional printing layer may be formed by masking all areas except for the printing area, applying the printing material to the entire area, and then removing the masking.

In the second process 803, the basic protective layer 330-1 may be formed in the first area (eg, the first area 300B in FIG. 7A). The basic protective layer 330-1 may be formed as high as the step 320a formed in the printing layer 320. The basic protective layer 330-1 can be formed by masking except for the printing area, applying the protective layer to the entire area to a specified thickness, and then removing the masking.

In the third process 805, an additional protective layer 330-2 may be formed over the entire area. The protective layer 330 may be formed by applying an additional protective layer 330-2 to a specified thickness over the entire area from which the masking has been removed. Through the above process, a film structure 300 in which the base layer 310, the printing layer 320, and the protective layer 330 have constant thicknesses can be provided.

According to one embodiment, the manufacturing process of the printing layer 320 and the manufacturing process of the protective layer 330 may be substantially the same.

Referring to FIGS. 8B and 8C, the film structure 300 that may be included in the housing (e.g., the housing 210 of FIG. 2) of an electronic device (e.g., the electronic device 200 of FIG. 2) includes a base layer ( 310), a printed layer 320 disposed on the base layer 310, and a protective layer 330 disposed on the printed layer 320. The thickness of the first part 320-1 of the printing layer 320 may be thinner than the thickness of the second part 320-2, thereby forming a step 320a on the printing layer 320. By stacking the protective layer 330 on the printed layer 320, the sum of the thicknesses of the base layer 310, the printed layer 320, and the protective layer 330 may be constant.

Referring to FIG. 8B, a groove 330a may be formed on one side of the protective layer 330 facing the printing layer 320 and the other side facing the step 320a. For example, the basic protective layer 330-1 may be laminated on the printing layer 320. While the basic protective layer 330-1 laminated on the printing layer 320 is cured, a region having a step 320a (e.g., the first step region in FIG. 7A) due to a difference in shrinkage rate of the protective layer 330 (300C-1)), grooves may be formed. If an additional protective layer 330-2 of a certain thickness is laminated on the basic protective layer 300-1 and the printed layer 320 in which the groove is formed, the groove can be maintained. For another example, on one side of the printed layer 320 where the step 320a is formed, masking is formed on the remaining portion except the first portion, and the basic protective layer 330-1 is formed on the printed layer ( In the process of applying the height of the step 320a formed in 320, a smaller amount of the basic protective layer 330-1 may be applied than the volume of the groove 330a. Due to the step 320a structure, while the basic protective layer 330-1 is cured, a groove may be formed in the area having the step 320a, corresponding to the small amount of applied volume. If an additional protective layer 330-2 of a certain thickness is laminated on the basic protective layer 300-1 and the printed layer 320 in which the groove is formed, the groove can be maintained.

Referring to FIG. 8C, on the other side facing one side of the protective layer 330 facing the printing layer 320, a protrusion 330b can be formed in the opposite direction to the direction facing the step 320a. there is. For example, the basic protective layer 330-1 may be laminated on the printing layer 320. While the basic protective layer 330-1 laminated on the printed layer 320 is cured, protrusions may be formed in the area having the step 320a due to a difference in shrinkage rate of the protective layer 330. When an additional protective layer 330-2 of a certain thickness is laminated on the basic protective layer 330-1 and the printed layer 320 in which the groove is formed, the protrusion can be maintained. For another example, on one side of the printed layer 320 where the step 320a is formed, masking is formed on the remaining portion except the first portion, and the basic protective layer 330-1 is formed on the printed layer ( In the process of applying the height of the step 320a formed in 320, more basic protective layer 330-1 may be applied as much as the volume of the protrusion 330b. Due to the step 320a structure, while the basic protective layer 330-1 is cured, protrusions may be formed in the area having the step 320a, as much as the volume applied. When an additional protective layer 330-2 of a certain thickness is laminated on the basic protective layer 300-1 and the printed layer 320 in which the groove is formed, the protrusion can be maintained.

Referring to FIG. 9, the housing (e.g., housing 210 of FIG. 2) of an electronic device (e.g., electronic device 200 of FIG. 2) includes a cover plate (e.g., cover plate 400 of FIG. 4) and a film. It may include structure 300. The film structure 300 may include a base layer 310, a printed layer 320 disposed on the base layer 310, and a protective layer 330 disposed on the printed layer 320. The thickness of the first part 320-1 of the printing layer 320 may be thinner than the thickness of the second part 320-2, thereby forming a step 320a on the printing layer 320. The sum of the thicknesses of the base layer 310, the printing layer 320, and the protective layer 330 included in the film structure 300 may be constant.

According to one embodiment, the printed layer 320 may include a pattern 320b on one side facing the base layer 310. For example, the pattern 320b on one side of the printed layer 320 facing the base layer 310 is irradiated with a laser from the outside of the cover plate 400 to penetrate the base layer 310. And by removing a portion of the printing layer 320 in contact with the base layer 310, it can be formed to be visually recognized.

Due to differences in the thickness of the printed layer 320, the intended pattern 320b may not be visible from the outside, or a visibility deviation may be created in the pattern 320b. For example, since the thickness of the first part 320-1 and the second part 320-2 of the printing layer 320 are different, the first part 320-1 and the second part 320-2 ) may have different reflectance or transmittance. A pattern formed by the pattern 320b present in the first portion 320-1 of the printed layer 320 and the pattern 320b present in the second portion 320-2 of the printed layer 320. Patterns by can be perceived differently. In order to reduce the visibility deviation of the pattern 320b in the first part 320-1 and the second part 320-2, the pattern 320b may be formed in the printing layer 320 having a constant thickness. For example, the pattern 320b may be formed in the first portion 320-1 of the printed layer 320.

Figure 10 is a flowchart showing the film structure lamination process.

Referring to FIG. 10, a film structure (e.g., film structure 300 of FIG. 4) included in a housing (e.g., housing 210 of FIG. 2) of an electronic device (e.g., electronic device 200 of FIG. 2). The process of stacking may be performed in multiple steps.

According to one embodiment, in step 1010, a base layer (e.g., base layer 310 of FIG. 4) disposed on a cover plate (e.g., cover plate 400 of FIG. 4) forming a portion of the housing. )) can be molded.

According to one embodiment, in step 1010, the base layer 310 may be formed to have different thicknesses. For example, the thickness of the first portion of the base layer 310 may be formed to be thinner than the thickness of the second portion of the base layer 310 through laser cutting. For another example, the base layer 310 may be formed through an injection process. The mold may be configured to provide substrate layers of different thicknesses.

According to one embodiment, in step 1010, the base layer 310 may be formed to have the same thickness. The base layer 310 may be molded to have a curved surface. The base layer 310 including a curved surface may be formed by molding the flat base layer 310.

According to one embodiment, in step 1020, a printed layer (eg, printed layer 320 of FIG. 4) disposed on the molded base layer 310 may be formed.

According to one embodiment, step 1020 may include forming a thickness of the first portion of the print layer 320 to be thinner than a thickness of the second portion of the print layer 320. For example, a print layer 320 may be printed with a specified thickness on the printed surface, and an additional print layer may be printed on the print layer 320. The additional printing layer may include masking except for the printing area, applying the printing material to the entire area, and then removing the masking. In another example, a mold of a certain shape is disposed, including a first region having a constant thickness on the printed surface and a second region having a constant thickness extending from the first region to form a step and being thicker than the thickness of the first region. Then, it may include the step of printing and curing the printing material in the mold to form a printing layer.

According to one embodiment, in step 1030, a protective layer (eg, protective layer 330 of FIG. 4) disposed on the printing layer 320 may be laminated. In step 1030, the thickness of the first portion of the protective layer 330 is formed to be thicker than the thickness of the second portion of the protective layer 330, and the base layer 310, the printing layer 320, and the protective layer 330 are formed. ) may include ensuring that the thickness is constant. For example, the protective layer 330 formed in the first portion may be formed as high as the step 320a formed in the printed layer 320. The protective layer 330 can be formed by masking except for the printing area, applying the protective layer 330 material to the entire area to a specified thickness, and then removing the masking. An additional protective layer may be formed on the protective layer 330. An additional protective layer may be formed by applying the protective layer 330 to a specified thickness over the entire area from which the masking has been removed.

According to one embodiment, in step 1040, the formed film structure (e.g., film structure 300 of FIG. 4) may be assembled on the cover plate 400. The adhesive surface of the film structure 300 may correspond to the surface of the cover plate 400. The adhesive surface of the film structure 300 may be adhered to the one surface of the cover plate 400. The adhesive member disposed between the adhesive surface of the film structure 300 and the one surface of the cover plate 400 may attach the film structure 300 to the cover plate 400.

The electronic device (e.g., electronic device 200 of FIG. 2) according to the above-described embodiment includes at least one electronic component, a first surface (e.g., first surface 200A of FIG. 2), and the first surface. It includes a second side facing (e.g., the second side 200B in FIG. 2) and a side disposed between the first side and the second side (e.g., the side 200C in FIG. 2), It may include a housing (e.g., housing 210 in FIG. 2) that is surrounded by the first surface, the second surface, and the side surface, and provides an internal space in which at least a portion of the at least one electronic component is disposed. . According to one embodiment, the housing has a first region (e.g., first region 301a in FIG. 3) having a plane corresponding to the second surface and a curved surface extending from a portion of the first region, A cover plate (e.g., cover plate 400 in FIG. 4) including a second area (e.g., second area 301b in FIG. 3) surrounding the side surface, and a base layer (e.g., A base layer 310 in FIG. 4), a printed layer disposed on the base layer (e.g., the print layer 320 in FIG. 4), and a protective layer disposed on the print layer (e.g., the protective layer in FIG. 4). (330)). According to one embodiment, the thickness of the housing including the base layer, the print layer, and the protective layer is constant, and the print layer disposed on the first area is greater than the print layer disposed on the second area. It can be thin.

According to one embodiment, the at least one electronic component may include a camera (eg, the second camera 212 of FIG. 2) disposed on the second surface. The housing has an opening that exposes the camera to the outside (e.g., opening 309 in FIG. 3) and a third region (e.g., the opening 309 in FIG. 3) formed as a curved surface extending from the opening toward the outside. It may further include a third area 301c. The printed layer disposed on the first area may be thinner than the printed layer disposed on the third area.

According to one embodiment, the protective layer disposed on the first area may be thicker than the protective layer disposed on the second area.

According to one embodiment, the rigidity of the protective layer may be lower than that of the printed layer.

According to one embodiment, the rigidity of the second region of the housing may be greater than the rigidity of the first region of the housing.

According to one embodiment, the base layer includes a polymer material, and is disposed on one side of the film layer facing the film layer (e.g., film layer 312 in FIG. 7A) and the cover plate including a transparent portion. It may include a first adhesive layer (eg, the adhesive layer 311a of FIG. 7A).

According to one embodiment, the film layer is made of polyethylene terephthalate (PET, poly ethylenetere phthalate), poly methyl methacrylate (PDMA), poly carbonate (PC, poly crbonate), and thermoplastic polyurethane ( It may contain at least one of TPU (thermoplastic polyurethane).

According to one embodiment, one side of the protective layer facing the printed layer has a step (e.g., step 320a in FIG. 7A) at the boundary between the first region and the second region, The shape of the other side of the protective layer facing the one side of the protective layer may have a shape corresponding to the side of the cover plate.

According to one embodiment, the electronic device supports the electronic component, a support member disposed within the housing (e.g., support member 500 in FIG. 4), and a second disposed between the protective layer and the support member. It may further include an adhesive layer (eg, the adhesive layer 331a of FIG. 4).

According to one embodiment, the printed layer includes a step formed between the first area and the second area, and the protective layer includes a groove disposed at a position corresponding to the step (e.g., in FIG. 8B). It may further include a groove 330a).

According to one embodiment, the base layer disposed on the first area may be thinner than the base layer disposed on the second area.

According to one embodiment, the printed layer may include at least one pattern formed on one side of the printed layer, within the first area, facing the base layer.

According to one embodiment, the protective layer may be formed with a surface energy of 25 to 45 Dyne and a contact angle of 90 to 105 degrees.

According to one embodiment, the protective layer may be formed to have a thickness of 8 um or more and 10 um or less.

According to one embodiment, the cover plate may include at least one of tempered glass and reinforced plastic.

A housing according to an embodiment (e.g., housing 210 in FIG. 2) has a first area having a flat surface (e.g., a first area 301a in FIG. 3 and a curved surface extending from a portion of the first area). A cover plate (e.g., cover plate 400 in FIG. 4) including a second area (e.g., the second area 301b in FIG. 3), a base layer disposed on the cover plate (e.g., the base layer in FIG. 4) (310)), including a printed layer disposed on the base layer (e.g., printed layer 320 in FIG. 4) and a protective layer (e.g., protective layer 330 in FIG. 4) disposed on the printed layer. According to one embodiment, the thickness of the housing including the base layer, the printing layer, and the protective layer is constant, and the printing layer disposed on the first area is disposed on the second area. It may be thinner than the rest of the printed layers.

According to one embodiment, the rigidity of the protective layer may be lower than that of the printed layer, and the rigidity of the second region of the housing may be greater than the rigidity of the first region of the housing.

According to one embodiment, one side of the protective layer facing the printed layer has a step at a boundary between the first region and the second region, and the one side of the protective layer facing the one side of the protective layer has a step. The shape of the other surface may have a shape corresponding to the surface of the cover plate.

An electronic device (e.g., the electronic device 200 of FIG. 2) according to an embodiment has a first side (e.g., the first side 200A of FIG. 2) and a second side (e.g., the first side 200A of FIG. 2) facing the first side. It includes a second side 200B in FIG. 2) and a side (e.g., side 200C in FIG. 2) disposed between the first side and the second side, and the first side, the second side, and A housing (e.g., housing 210 in FIG. 2) providing an internal space surrounded by the side surface, and at least one electron disposed at least partially in the internal space and exposed through an opening formed on the second side. May contain parts. According to one embodiment, the housing has a first area (e.g., first area 301a in FIG. 3) having a plane corresponding to the second surface and extending from the opening in the direction toward which the second surface faces. A cover plate (e.g., cover plate 400 in FIG. 4) including a second area having a curved surface (e.g., second area 301b in FIG. 3), a base layer disposed on the cover plate (e.g., FIG. a base layer 310 in 4), a printed layer disposed on the base layer (e.g., the print layer 320 in FIG. 4), and a protective layer disposed on the print layer (e.g., the protective layer in FIG. 4) 330)) may be included. According to one embodiment, the thickness of the housing including the base layer, the print layer, and the protective layer is constant, and the print layer disposed on the first area is greater than the print layer disposed on the second area. It can be thin.

Electronic devices according to various embodiments disclosed in this document may be of various types. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, electronic devices, or home appliances. Electronic devices according to embodiments of this document are not limited to the above-described devices.

The various embodiments of this document and the terms used herein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various changes, equivalents, or replacements of the embodiments. In connection with the description of the drawings, similar reference numbers may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the above items, unless the relevant context clearly indicates otherwise. As used herein, “A or B”, “at least one of A and B”, “at least one of A or B”, “A, B or C”, “at least one of A, B and C”, and “A Each of phrases such as “at least one of , B, or C” may include any one of the items listed together in the corresponding phrase, or any possible combination thereof. Terms such as "first", "second", or "first" or "second" may be used simply to distinguish one component from another, and to refer to that component in other respects (e.g., importance or order) is not limited. One (e.g., first) component is said to be “coupled” or “connected” to another (e.g., second) component, with or without the terms “functionally” or “communicatively.” When mentioned, it means that any of the components can be connected to the other components directly (e.g. wired), wirelessly, or through a third component.

According to various embodiments, each component (e.g., module or program) of the above-described components may include a single or plural entity, and some of the plurality of entities may be separately placed in other components. there is. According to various embodiments, one or more of the components or operations described above may be omitted, or one or more other components or operations may be added. Alternatively or additionally, multiple components (eg, modules or programs) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each component of the plurality of components in the same or similar manner as those performed by the corresponding component of the plurality of components prior to the integration. . According to various embodiments, operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, or omitted. Alternatively, one or more other operations may be added.

Claims

In electronic devices,

At least one electronic component; and

It includes a first side, a second side facing the first side, and a side disposed between the first side and the second side, and is surrounded by the first side, the second side, and the side, a housing providing an internal space in which at least a portion of the at least one electronic component is disposed; Including,

The housing is,

a cover plate including a first area formed as a plane corresponding to the second surface and a second area formed as a curved surface extending from a portion of the first area and surrounding the side surface;

a base layer disposed on the cover plate;

A printing layer disposed on the base layer; and

a protective layer disposed on the printing layer; Including,

The overall thickness of the base layer, printing layer, and protective layer is constant,

The thickness of the first portion of the printed layer disposed on the first area is,

Thinner than the thickness of the second portion of the printed layer disposed on the second area,

Electronic devices.
According to paragraph 1,

The at least one electronic component is,

a camera disposed on the second surface; Including,

The housing is,

It further includes an opening exposing the camera to the outside and a third area formed as a curved surface extending from the opening toward the outside,

The thickness of the first portion of the printed layer disposed on the first area is,

Thinner than the thickness of the third portion of the printed layer disposed on the third area,

Electronic devices.
According to paragraph 1,

The thickness of some of the protective layers disposed on the first area is,

Thicker than the remaining thickness of the protective layer disposed on the second region,

Electronic devices.
According to paragraph 3,

The rigidity of the protective layer is,

lower than the rigidity of the printed layer,

Electronic devices.
According to paragraph 1,

The rigidity of the second region of the housing is:

greater than the rigidity of the first region of the housing,

Electronic devices.
According to paragraph 1,

The base layer includes a film layer including a polymer material and a transparent portion; and

a first adhesive layer disposed on one side of the film layer facing the cover plate; Including,

Electronic devices.
According to clause 6,

The film layer is,

Containing at least one of polyethylene terephthalate (PET, poly ethylenetere phthalate), poly methyl methacrylate (PDMA), polycarbonate (PC, poly crbonate), and thermoplastic polyurethane (TPU, thermoplastic polyurethane) ,

Electronic devices.
According to paragraph 1,

One side of the protective layer facing the printed layer,

Having a step at the boundary between the first area and the second area,

The shape of the other side of the protective layer facing the one side of the protective layer is,

Having a shape corresponding to the surface of the cover plate,

Electronic devices.
According to paragraph 1,

a support member supporting the electronic component and disposed within the housing; and a second adhesive layer disposed between the protective layer and the support member; Containing more,

Electronic devices.
According to paragraph 1,

The printing layer is,

Includes a step formed between the first part and the second part,

The protective layer is,

Further comprising a groove disposed at a position corresponding to the step,

Electronic devices.
According to paragraph 1,

The thickness of some of the base layers disposed on the first region is,

Thinner than the thickness of the rest of the base layer disposed on the second region,

Electronic devices.
According to paragraph 1,

The printing layer is,

Within the first region, comprising at least one pattern formed on one side of the printed layer facing the base layer,

Electronic devices.
According to paragraph 1,

The protective layer is,

Dyne is formed with a surface energy of 25 to 45 and a contact angle of 90 to 105 degrees,

Electronic devices.
According to paragraph 1,

The protective layer is,

Formed with a thickness of 8 um or more and 10 um or less,

Electronic devices.
According to paragraph 1,

The cover plate is,

Containing at least one of tempered glass and reinforced plastic,

Electronic devices.