WO2023074130A1

WO2023074130A1 - Electronic circuit and electronic device

Info

Publication number: WO2023074130A1
Application number: PCT/JP2022/033531
Authority: WO
Inventors: 丈瑠熊王; 政紀西尾
Original assignee: ソニーグループ株式会社
Priority date: 2021-10-25
Filing date: 2022-09-07
Publication date: 2023-05-04
Also published as: CN118176834A

Abstract

An electronic circuit according to one embodiment of the present technology comprises a mounting board and one or more screw receptor parts. The mounting board has a first surface and a second surface that is the opposite the first surface. The one or more screw receptor parts each has a penetration part that penetrates the mounting board, to allow the head of a fixation screw to pass through; and a plate member that is fixed to the second face so as to cover the penetration part, that allows the passage of the thread of the fixation screw and that receives the head of the fixation screw.

Description

Electronic circuits and electronic equipment

This technology relates to an electronic circuit fixed by screwing and an electronic device equipped with the electronic circuit.

2. Description of the Related Art A method of screwing a board of an electronic circuit to a housing or the like is known.
Patent Literature 1 describes a method of screwing two layers of rigid substrates connected via a flexible wiring board. In this method, one rigid substrate of the two layers of rigid substrates is partially protruded from the outer edge of the other rigid substrate, and a fixing portion for screwing is provided. Further, the fixing portion is provided with an insertion hole through which a fixing screw is inserted. As a result, it becomes possible to store the heads of the fixing screws and the like on the side where the other rigid board is provided, and the size of the device can be reduced. [0059] [0093] FIGS. 14, 15, etc.).

JP-A-2007-67243

When fixing the board using screws, it is conceivable that the arrangement and size of other parts may be restricted depending on the arrangement of the fixing screws. Therefore, there is a demand for a technology capable of suppressing interference between the fixing screw and other parts.

In view of the circumstances described above, the purpose of this technology is to provide an electronic circuit and an electronic device capable of suppressing interference between fixing screws and other parts.

To achieve the above object, an electronic circuit according to one aspect of the present technology includes a mounting substrate and at least one screw receiving portion.
The mounting board has a first surface and a second surface opposite to the first surface.
Each of the at least one screw receiving portion includes a through portion that penetrates the mounting board and allows the head of a fixing screw to pass therethrough, and a screw portion of the fixing screw that is fixed to the second surface so as to cover the through portion. a plate member through which the head of the fixing screw is received;

In this electronic circuit, the mounting board is provided with a penetrating part through which the head of the fixing screw passes. A plate member is fixed to the second surface of the mounting substrate so as to cover the through portion. The plate member is configured to receive the head through the threaded portion of the fixing screw. As a result, since the position of the head of the fixing screw is lowered by the thickness of the mounting board, it is possible to suppress interference between the fixing screw and other components.

The plate member may receive the head of the fixing screw so that the head of the fixing screw does not protrude from the first surface.

The thickness of the mounting board may be set larger than the thickness of the head of the fixing screw.

The through portion may be at least one of a notch provided in the mounting board and a through hole provided in the mounting board.

The mounting substrate may have a mounting area set on the second surface at the periphery of the through portion configured as the notch or the through hole. In this case, the plate member may be fixed to the mounting area by soldering.

The through-hole may be a through-hole provided in the mounting board. In this case, the mounting area may be set so as to surround the entire circumference of the through hole.

The through portion may be a notch narrowed on the outer edge side of the mounting substrate. In this case, the mounting area may be set so as to overlap the narrowed portion of the notch.

The plate member may have a screw through hole through which the screw portion of the fixing screw is passed, and a screw receiving area provided around the screw through hole for receiving the fixing screw.

The plate member may have a connection area provided outside the screw receiving area and connected to the mounting area of the second surface. In this case, the screw receiving area may be an area whose height is adjusted with respect to the connection area so that the head of the fixing screw does not protrude from the first surface.

The screw receiving area may be formed by drawing.

The plate member is an annular region surrounding the screw receiving region, and may have a suppression region in which wettability to molten solder is set lower than that of other portions.

The suppression area may be an annular groove area.

The planar size of the mounting board may be substantially the same size as the planar size of the accommodation area of the frame to which the mounting board is fixed by the fixing screws via the screw receiving portion.

A predetermined functional component may be arranged on the first surface side of the mounting substrate so as to overlap with the screw receiving portion.

The predetermined functional component may be adhered to the first surface of the mounting substrate. In this case, the screw receiving portion may be provided on the outer edge of the mounting substrate.

An electronic device according to one embodiment of the present technology includes an electronic circuit, a frame, and a functional component.
The electronic circuit includes a mounting substrate having a first surface and a second surface opposite to the first surface, and penetrating portions each penetrating the mounting substrate and allowing the heads of fixing screws to pass therethrough. and a plate member that is fixed to the second surface so as to cover the through portion and receives the fixing screw so that the head of the fixing screw does not protrude from the first surface. and
The frame is arranged on the second surface side of the mounting substrate, and the mounting substrate is fixed by the fixing screws via the screw receiving portions.
The functional component is arranged on the first surface side of the mounting substrate so as to overlap the screw receiving portion.

1 is a schematic diagram illustrating a configuration example of an electronic device according to an embodiment of the present technology; FIG. It is a schematic diagram which shows the structural example of a screw receiving part. 1 is a perspective view showing a configuration example of an electronic circuit provided with a screw receiving portion; FIG. It is a perspective view which shows the structural example of the screw receiving part provided in the mounting board. FIG. 3 is a cross-sectional view showing a configuration example of a screw receiving portion provided on a mounting substrate; FIG. 4 is a plan view showing a configuration example of a screw receiving portion provided on a mounting substrate; It is a schematic diagram which shows the screwing structure mentioned as a comparative example. It is a schematic diagram which shows the example of arrangement|positioning of the components of the electronic device mentioned as a comparative example. It is a schematic diagram which shows the example of arrangement|positioning of the components of the electronic device mentioned as a comparative example.

Hereinafter, embodiments according to the present technology will be described with reference to the drawings.

[Structure of electronic device/electronic circuit]
FIG. 1 is a schematic diagram showing a configuration example of an electronic device according to an embodiment of the present technology. FIG. 1A is a plan view showing an internal configuration example of the electronic device 100. FIG. FIG. 1(b) is a cross-sectional view of the electronic device 100 taken along line AA shown in (a).
An electronic device 100 illustrated in FIG. 1 is, for example, a mobile terminal such as a smartphone. The electronic device 100 is configured as a plate-shaped device as a whole having a rectangular planar shape. Hereinafter, in the planar shape of the electronic device 100, the direction along the short side is described as the X direction, and the direction along the long side is described as the Y direction. Also, the thickness direction of the electronic device 100 orthogonal to the X direction and the Y direction is referred to as the Z direction.

The electronic device 100 has an electronic circuit 10 , a frame 11 , a battery 12 , a camera unit 13 , a rear panel 14 and a display 15 .
For example, as shown in FIG. 1B, a rear panel 14 is arranged on the rear surface of the electronic device 100 . A display 15 (not shown) is arranged on the front surface of the electronic device 100 . FIG. 1A is a plan view of the electronic device 100 viewed from the back with the rear panel 14 removed.

The electronic circuit 10 is a circuit module on which various circuits for operating the electronic device 100 are mounted. For example, the electronic circuit 10 is equipped with arithmetic elements such as a CPU and memory elements such as a RAM and a ROM. Further, the electronic circuit 10 is appropriately equipped with a communication element for communicating with other devices, a sensor element such as a 9-axis sensor, and the like.

As shown in FIG. 1 , the electronic circuit 10 has a mounting substrate 20 and a plurality of screw receiving portions 40 . The mounting board 20 is fixed to a frame 11 described later by screwing with a fixing screw 1 (fixing screw) passed through the screw receiving portion 40 .
As the fixing screw 1, for example, a low head Phillips screw having a thin head portion 2a is used. In addition, the type of fixing screw 1 is not limited, and slotted screws, hexagonal screws, star-shaped screws, etc. may be used.

The mounting board 20 is a circuit board provided with various elements that constitute the electronic circuit 10 and wiring that connects the elements. The mounting board 20 is a rigid board made of glass epoxy or the like, and is configured as a PBA (printed board assembly) on which lands for mounting each element and wiring for connecting each element are printed.
In this embodiment, the thickness of the mounting board 20 is set to be greater than the thickness of the head portion 2 a of the fixing screw 1 . As a result, the thickness of the head portion 2a of the fixing screw 1 can be absorbed only by the thickness of the mounting substrate 20 by using the screw receiving portion 40, which will be described later.

As shown in FIG. 1 , the mounting substrate 20 is a plate-shaped member and has a first surface 21 and a second surface 22 opposite to the first surface 21 .
The first surface 21 is a surface facing away from the frame 11 when the mounting substrate 20 is screwed to the frame 11 . The second surface 22 is a surface facing the frame 11 when the mounting board 20 is screwed to the frame 11 . In the example shown in FIG. 1, the main surface of the mounting substrate 20 facing the back side of the electronic device 100 is the first surface 21, and the main surface of the mounting substrate 20 facing the front side of the electronic device 100 is the second surface. 22.
A ground film or the like that serves as the GND of the electronic circuit 10 is formed on the first surface 21 . A computing element, a memory element, and the like are mounted on the second surface 22 . Various elements may be mounted on the first surface 21 .

As shown in FIG. 1A, the mounting board 20 is configured to fit inside the frame 11 with almost no space when viewed from the thickness direction (Z direction) of the electronic device 100 . That is, the planar size of the mounting substrate 20 is substantially the same as the planar size of the housing area 5 of the frame 11 . Therefore, it can be said that the mounting substrate 20 is configured as a single-layer full board.
Here, the accommodation area 5 of the frame 11 means a space configured inside the frame 11 and capable of accommodating each component. The planar size of the accommodation area 5 is the size of the accommodation area 5 (frame 11) in a plan view when viewed from the Z direction.
The planar shape and dimensions of the mounting substrate 20 are set so as to fit within the housing area 5 viewed from the Z direction, and the planar size of the mounting substrate 20 is about the same as the plain size of the housing area (for example, 80% or more). is set to In addition, the planar size of the mounting board 20 is not limited, and for example, the mounting board 20 or the like may be configured such that the planar size is 50% or more of the accommodation area.

Each of the plurality of screw receiving portions 40 functions as a seating surface for receiving the fixing screw 1 for fixing the mounting board 20 . Therefore, each screw receiving portion 40 is not provided with a screw hole 3 (boss) into which the fixing screw 1 (screw) is fastened. A screw hole 3 into which the fixing screw 1 is fastened is provided in the frame 11 .
The plurality of screw receiving portions 40 are configured so that the head portion 2a of the fixing screw 1 does not protrude from the first surface 21 of the mounting board 20 when the fixing screw 1 is tightened. As a result, the fixing screw 1 (head portion 2a) does not protrude from the first surface 21 .

In the example shown in FIG. 1, ten screw receiving portions 40 are provided. The number and positions of the screw receiving portions 40 are not limited. Further, the shape of the fixing screw 1 used in each screw receiving portion 40 may be different. In this case, the screw receiving portions 40 corresponding to the shape of the fixing screw 1 are formed.
The screw receiving portion 40 will be described later in detail.

The frame 11 is a structural member that supports each part of the electronic device 100 .
The frame 11 is arranged on the second surface 22 side of the mounting board 20 . The mounting board 20 described above is fixed to the frame 11 by the fixing screws 1 via the screw receiving portions 40 .
Frame 11 is typically configured as a skeleton of electronic device 100 . Also, the frame 11 may be configured to function as a housing for the electronic device 100 . As a material of the frame 11, for example, metal such as aluminum or stainless steel, or resin material such as plastic is used.

The frame 11 has a frame body 17 and side walls 18 .
The frame main body 17 is a planar member and is arranged along the XY plane. The frame main body 17 is appropriately hollowed out according to the arrangement of other parts, for example. Further, the frame main body 17 is provided with a plurality of screw holes 3 for fastening the fixing screws 1 corresponding to the plurality of screw receiving portions 40 described above.
The side wall portion 18 is formed on the outer edge of the frame body 17 and protrudes toward the rear side to form a side wall surrounding the frame body 17 . A space surrounded by the frame main body 17 and the side wall portion 18 serves as a storage area 5 for the frame 11 .
Besides, the specific configuration of the frame 11 is not limited.

The battery 12 is a secondary battery that supplies power to the electronic device 100 . In this embodiment, the battery 12 is arranged on the first surface 21 side of the mounting substrate 20 so as to overlap the screw receiving portion 40 .
FIG. 1( a ) schematically illustrates a portion of the first surface 21 (screw receiving portion 40 ) that is blocked by the battery 12 as seen through the battery 12 .
Also, as shown in FIG. 1( b ), the battery 12 is adhered to the first surface 21 using an adhesive tape 16 . That is, the battery 12 is adhesively fixed to the mounting board 20 .

In this embodiment, the battery 12 is an example of a functional component arranged so as to overlap with the screw receiving portion. It should be noted that the configuration is not limited to that shown in FIG. may In addition, the components arranged on the first surface 21 side of the mounting board 20 are not limited, and any component constituting the electronic device 100 may be arranged on the first surface 21 side.

The camera unit 13 is a sensor unit equipped with a camera sensor serving as a rear camera of the electronic device 100 . The camera unit 13 shown in FIG. 1 is equipped with three camera sensors of different types.
Each camera sensor is a digital camera including an image sensor such as a CMOS (Complementary Metal Oxide Semiconductor) or a CCD (Charge Coupled Device). Each camera sensor has a different type of lens and a different type of image sensor. For example, three types of lenses are used: a super-wide-angle lens, a wide-angle lens, and a telephoto lens.
In the example shown in FIG. 1, the camera unit 13 is housed in a rectangular opening provided on the upper side of the mounting substrate 20 (electronic circuit 10) in the drawing.

The rear panel 14 is a plate-like member forming the back surface of the electronic device 100 . The rear panel 14 is made of glass, plastic, metal, or the like, for example. In the example shown in FIG. 1, the rear panel 14 is fixed to the side wall portion 18 of the frame 11 .
The display 15 is a display element of the electronic device 100 and is provided on the front surface of the electronic device 100 . The display 15 is typically configured as a touch panel and also functions as an input device that receives various operational inputs from the user. As the display 15, for example, a display element such as an LCD (Liquid Crystal Display) or an organic EL display is used.

[Structure of screw receiving part]
FIG. 2 is a schematic diagram showing a configuration example of a screw receiving portion. FIG. 2 schematically shows an enlarged view of the rough dotted line region shown in FIG. 1(b). FIG. 2A is a cross-sectional view in the YZ plane. 2B and 2C are plan views of the screw receiving portion 40 provided on the electronic circuit 10 (mounting substrate 20) viewed from the rear side (first surface 21 side) and the front side (second surface 22 side). is. Note that the illustration of the adhesive tape 16 is omitted in FIG. 2A. 2B and 2C, illustration of the fixing screw 1 is omitted.
As shown in FIG. 2 , the screw receiving portion 40 has a through portion 41 and a seat plate 42 . In this embodiment, the seat plate 42 corresponds to a plate member.

The penetrating portion 41 is a portion that penetrates the mounting substrate 20 and allows the head portion 2a of the fixing screw 1 to pass therethrough. Therefore, the penetrating portion 41 has a structure in which the head portion 2a of the fixing screw 1 can pass through between the first surface 21 and the second surface 22 of the mounting substrate 20. As shown in FIG. That is, it can be said that the through portion 41 functions as a through hole through which the fixing screw 1 is passed.
In the mounting substrate 20, a through portion 41 is provided at each position where the screw receiving portion 40 is provided (fastening position of the fixing screw 1).

Specifically, the through portion 41 is at least one of a notch 41 a provided in the mounting board 20 and a through hole 41 b provided in the mounting board 20 .
The notch 41a is provided on the outer edge of the mounting substrate 20 and has a structure obtained by cutting out the inside of the substrate. Therefore, in plan view in the Z direction, the area inside the notch 41 a is connected to the area outside the mounting board 20 .
The through hole 41 b is a through hole provided in the mounting board 20 . Therefore, in plan view in the Z direction, the area inside the through-hole 41b is a closed area surrounded by the mounting board 20 .

In the example shown in FIG. 1, both the notch 41a and the through hole 41b are provided as the penetrating portion 41. For example, in FIG. 1A, two cutouts 41a are provided on the left and right outer edges of the mounting substrate 20 in the drawing. The six through-holes 41 other than these four notches 41a are all configured as through-holes 41b. Note that the through portion 41 shown in FIG. 2 is a through hole 41b.

The seat plate 42 is fixed to the second surface 22 so as to cover the penetrating portion 41 , and receives the head portion 2 a of the fixing screw 1 through the screw portion 2 b of the fixing screw 1 . The seat plate 42 is a plate-like member as a whole. Here, a seat plate 42 having a rectangular planar shape is used.
One surface of the seat plate 42 is a surface fixed to the second surface 22 of the mounting board 20 . The other surface of the seat plate 42 is a surface that comes into contact with the frame 11 when the fixing screw 1 is screwed. Hereinafter, the surface of the seat plate 42 facing the mounting substrate 20 is referred to as a third surface 43 , and the surface opposite to the third surface 43 (on the side of the frame 11 ) is referred to as a fourth surface 44 .

The seat plate 42 has a screw through hole 46 and a screw receiving area 47 . Of these, the screw receiving area 47 is provided on the third surface 43 of the seat plate 42 .
The screw through hole 46 is a through hole through which the threaded portion 2b of the fixing screw 1 (a shaft portion provided with a screw thread) is passed. The planar shape of the screw through hole 46 is typically circular. The diameter of the screw through hole 46 is set smaller than the diameter of the head 2a of the fixing screw 1 and larger than the diameter of the screw portion 2b (thread) of the fixing screw 1. As shown in FIG. The shape of the screw through hole 46 is not limited, and for example, the planar shape of the screw through hole 46 may be set to an elliptical shape or a rectangular shape.

The screw receiving area 47 is an area provided around the screw through hole 46 to receive the fixing screw 1 . That is, it can be said that the screw receiving area 47 is an area against which the head 2a of the fixing screw 1 is pressed during screwing. The screw receiving area 47 is typically a circular flat area. The diameter of the screw receiving area 47 is set larger than the diameter of the head 2 a of the fixing screw 1 . The shape of the screw receiving region 47 is not limited, and any region other than a circular shape may be set as long as the shape accommodates the head portion 2a of the fixing screw 1 .
In the example shown in FIG. 2B , a circular area surrounding the screw through hole 46 serves as the screw receiving area 47 .

In this embodiment, the seat plate 42 receives the fixing screw 1 such that the head 2 a of the fixing screw 1 does not protrude from the first surface 21 .
For example, the seat plate 42 is configured such that the height position for receiving the head 2a of the fixing screw 1 (height position of the screw receiving region 47) is equal to or lower than the height position of the second surface 22. FIG. That is, the position where the head 2a of the fixing screw 1 contacts the seat plate 42 (the third surface 43) is at the same depth as the second surface 22 when viewed from the first surface 21, or at a deeper position. . As described above, in the present embodiment, the thickness of the mounting board 20 is set to be greater than the thickness of the head portion 2a of the fixing screw 1 . Therefore, the head 2 a of the fixing screw 1 is housed in the mounting board 20 and does not protrude from the first surface 21 .
The height position of the screw receiving area 47 that receives the head 2a of the fixing screw 1 will be described later in detail with reference to FIG.

As the seat plate 42, for example, a stainless steel plate or the like is used. This makes it possible to realize a highly rigid seating surface. Alternatively, the seat plate 42 may be made of other metal such as copper or aluminum. By using the seat plate 42 made of copper, heat dissipation from the electronic circuit 10 (mounting substrate 20) can be realized through the seat plate 42, for example. Further, by using the seat plate 42 made of aluminum, it is possible to reduce the weight of the electronic device 100 . In addition, the material of the seat plate 42 is not limited, and for example, a composite material such as glass epoxy or a resin material such as plastic may be used.

By providing the seat plate 42, a convex portion corresponding to the seat plate 42 is formed on the second surface 22 facing the frame 11 side. For example, the frame 11 is configured with a concave portion 19 that accommodates such a convex portion of the seat plate 42 . That is, the frame 11 is provided with the screw hole 3 at a position recessed by the thickness of the seat plate 42 . Further, on the second surface 22 side, elements protruding from the second surface 22 are provided in addition to the seat surface plate 42 . The thickness of the seat plate 42 can also be absorbed by the design considering the thickness of these elements.

Next, a configuration for connecting the mounting board 20 and the seat plate 42 will be described.
A mounting area 23 for mounting the seat plate 42 is provided on the second surface 22 of the mounting substrate 20 . The mounting area 23 is set on the periphery of the through portion 41 configured as a notch 41 a or a through hole 41 b on the second surface 22 . The mounting area 23 is typically an area having a shape similar to the planar shape of the seat plate 42 and is arranged so as to surround the through portion 41 . Thus, by making the mounting region 23 the same shape as the seat plate 42, the seat plate 42 can be fixed with sufficient strength.
In the example shown in FIG. 2, the same rectangular mounting area 23 as the seat plate 42 is provided so as to surround the through hole 41b. For example, on the second surface 22 shown in FIG. 2C, the mounting area 23 is the area between the outer circumference of the seat plate 42 and the through hole 41b.
Note that the mounting area 23 may be configured in an island shape. For example, as shown in FIG. 2C, the mounting area 23 does not need to completely surround the through-hole 41 (through-hole 41b). may

A connection area 48 is also provided on the third surface 43 of the seat plate 42 . The connection area 48 is an area provided outside the screw receiving area 47 and connected to the mounting area 23 of the second surface 22 .
For example, all areas on the seat plate 42 that do not overlap with the through portions 41 (notches 41 a and through holes 41 b ) serve as the connection areas 48 . Thereby, it becomes possible to fix the seat surface plate 42 with sufficient strength.
For example, on the third surface 43 of the seat plate 42 shown in FIG. 2B, the area other than the area overlapping the through hole 41b (the area seen through the through hole 41b) becomes the connection area 48. As shown in FIG.

In this embodiment, the seat plate 42 is fixed to the mounting area 23 of the second surface 22 of the mounting board 20 by soldering. For example, the mounting area 23 of the mounting substrate 20 is formed with a metal film that can be soldered using copper foil or the like. A solder paste or the like is applied to this metal film (mounting region 23), and the seat plate 42 is arranged thereon. At this time, the position of the seat plate 42 is aligned so that the connection area 48 and the mounting area 23 properly overlap. The mounting board 20 on which the seat plate 42 is placed is heated in a reflow furnace, and the seat plate 42 and the mounting board 20 are soldered. In addition, the method of soldering is not limited.
Since the seat plate 42 can be soldered together with other elements, for example, the screw receiving portion 40 can be introduced without increasing the number of steps.

Thus, in the electronic circuit 10 , the seat plate 42 is mounted on the mounting substrate 20 provided with the through portion 41 . As a result, the thickness of the head portion 2a of the fixing screw 1 can be absorbed by the thickness of the mounting board 20, so that the fixing screw 1 does not create a step or protrusion on the first surface 21 of the mounting board 20. FIG. As a result, a wide flat area can be achieved on the first surface 21, and other components (battery 12, etc.) can be mounted regardless of the arrangement of the fixing screws 1. FIG.

[Specific Configuration of Screw Receiving Portion]
FIG. 3 is a perspective view showing a configuration example of the electronic circuit 10 provided with the screw receiving portion 40. As shown in FIG. FIG. 3 is a perspective view of the electronic device 100 as seen from the rear side, and shows a state in which the electronic circuit 10 (mounting board 20) is screwed to the frame 11. FIG. Here, the rear panel 14 and battery 12 have been removed and the first surface 21 of the mounting board 20 is visible.

A non-conducting region 25 and a GND region 26 are provided on the first surface 21 .
The non-conducting region 25 is an exposed region of the base material of the mounting substrate 20 (typically an insulating base material such as glass epoxy that constitutes a printed circuit board). The non-conducting region 25 is a rectangular region formed along the central portion of the first surface 21 from above in the figure.
The GND region 26 is a region in which a metal film that serves as the GND of the electronic circuit 10, for example, is formed. In the range shown in FIG. 3, GND regions 26 are provided on both left and right sides of the first surface 21 so as to surround the non-conducting region 25 from below in the drawing.

Further, the electronic circuit 10 (mounting substrate 20) is provided with a plurality of screw receiving portions 40. As shown in FIG. 3, the screw receiving portion 40 is appropriately provided inside the non-conducting region 25, inside the GND region 26, at the boundary between the non-conducting region 25 and the GND region 26, or the like. Of these, screw receiving portions 40 configured using cutouts 41a are provided on the left and right outer edge portions of the GND area 26 (mounting substrate 20) in the figure.

FIG. 4 is a perspective view showing a configuration example of the screw receiving portion 40 provided on the mounting substrate 20. As shown in FIG. FIG. 5 is a cross-sectional view showing a configuration example of the screw receiving portion 40 provided on the mounting substrate.
FIG. 4 shows a perspective view of the screw receiving portion 40 including the notch 41a surrounded by the dotted line shown in FIG. 3, viewed from the first surface 21 side. 5 shows a cross-sectional view of the screw receiving portion 40 taken along line BB shown in FIG. Note that FIG. 5A is an overall view of the cut surface, and FIG. 5B is an enlarged view of the cut surface.
Below, a more detailed configuration of the screw receiving portion 40 will be described by taking the screw receiving portion 40 including the notch 41a as an example. Note that the description described here can also be applied to the screw receiving portion 40 configured using the through holes 41b.

As shown in FIGS. 4 and 5, the seat plate 42 that constitutes the screw receiving portion 40 is provided with a screw through hole 46 . Further, the third surface 43 of the seat plate 42 is provided with a screw receiving area 47 , an inclined area 49 , a restraining area 50 and a connecting area 48 . Note that the connection area 48 is covered with the mounting board 20 .

[Screw receiving area]
The screw receiving area 47 is an annular flat area configured to surround the screw through hole 46 . Further, the screw receiving area 47 is a surface (recessed surface) recessed from the surface on which the connection area 48 is formed. A recession amount Δ (see FIG. 5B) of the screw receiving area 47 with respect to the connection area 48 is set so that the head 2 a of the fixing screw 1 does not protrude from the first surface 21 .
Thus, the screw receiving area 47 is an area whose height is adjusted with respect to the connection area 48 so that the head 2 a of the fixing screw 1 does not protrude from the first surface 21 .

In this embodiment, the screw receiving area 47 is formed by drawing. This makes it possible to easily adjust the height of the screw receiving area 47 (boss bearing surface) simply by applying a squeeze to the bearing surface plate 42 . Moreover, since the thickness of the seat plate 42 is almost the same, it is possible to ensure sufficient strength.
When the seating surface plate 42 is subjected to a drawing process, the portion corresponding to the screw receiving area 47 is recessed on the third surface 43 side, and an annular inclined area 49 is formed around it. On the fourth surface 44 side, a portion opposite to the screw receiving area 47 protrudes.
A processing method for forming the screw receiving region 47 is not limited. For example, a recess corresponding to the screw receiving region 47 may be processed using cutting or the like. In this case, since the fourth surface 44 side does not swell, it is possible to reduce the thickness of the device, for example.

As described above, the electronic circuit 10 uses the mounting board 20 that is thicker than the head 2a of the fixing screw 1. In this configuration, considering only the thickness of the head 2a of the fixing screw 1 (screw head thickness) with respect to the thickness of the mounting board 20, the head 2a of the fixing screw 1 is sufficiently hidden. On the other hand, when the fixing screw 1 is tightened, burrs may occur on the upper end side of the head 2a of the fixing screw 1 due to tightening. That is, it is conceivable that the upper end side of the fixing screw 1 bulges due to tightening. Depending on the height of the burr generated by tightening, the upper end side of the fixing screw 1 may protrude from the first surface 21 .

In this embodiment, the height of the screw receiving area 47 that receives the head 2a of the fixing screw 1 is adjusted in consideration of the height of such burrs. For example, the maximum value M of the burr height is calculated from statistical data obtained by measuring the height of burrs generated when the fixing screw 1 is tightened with an actual tightening torque. Here, if the thickness of the mounting board 20 is denoted by D, and the thickness of the head portion 2a of the fixing screw 1 is denoted by W, then the recession amount Δ of the screw receiving area 47 is such that Δ>(W+M−D). set.

As a result, the burr generated at the upper end of the fixing screw 1 does not protrude from the first surface 21, and a situation in which parts arranged on the first surface 21 side interfere with the fixing screw 1 is sufficiently prevented. It is possible to avoid. In particular, when the battery 12 is arranged on the first surface 21 side, by adopting this configuration, it is possible to sufficiently avoid electric leakage and breakage of the battery 12, thereby ensuring safety. becomes possible.
In addition, compared to the configuration (see FIG. 7) in which the fixing screw 1 is received by the mounting board 20, the degree of freedom of the height of the screw receiving area 47, which is the boss seating surface, is increased. As a result, it becomes possible to easily deal with specification changes such as the thickness of the head 2a of the fixing screw 1 and the thickness of the mounting substrate 20, for example.

[Suppression area]
The suppression region 50 is provided at the same height position as the connection region 48 soldered to the mounting board 20 and is an annular region configured to surround the inclined region 49 . The suppressing region 50 is provided to prevent the solder protruding from the connection region 48 from wetting and spreading, and is configured to be less wettable with the solder than the other portions of the third surface 43 .
Thus, the suppression area 50 is an annular area surrounding the screw receiving area 47, and is an area in which the wettability with respect to melted solder is set lower than other portions.

In this embodiment, the suppression area 50 is configured as an annular groove area. For example, in the example shown in FIG. 4, an annular narrow groove is provided as the suppression region 50 . Further, as shown in FIG. 5B, the groove has a structure in which a solder-wettable surface (third surface 43) is recessed, for example, so that it is difficult to wet with molten solder. . It can be said that this has the same structure as the scribe line. This makes it possible to prevent the melted solder from leaking beyond the suppression region 50 .

The suppression area 50 is formed, for example, by stamping. For example, a groove-shaped suppression region 50 is formed by pressing a convex stamp against the seat plate 42 . This makes it possible to form the suppression region 50 easily and inexpensively.
In addition, the processing method for forming the suppression region 50 is not limited. For example, on the third surface 43 of the seat plate 42, an Sn layer (tin-plated layer) having high wettability to molten solder and a Ni layer (nickel-plated layer) having low wettability to molten solder are arranged in order from the surface side. Configured. In this case, as the suppression region 50, a Ni barrier may be formed by removing the surface Sn layer using a laser or the like to expose the Ni layer. This Ni barrier makes it possible to prevent the solder from wetting and spreading on a predetermined portion (screw receiving region 47).

In the electronic circuit 10, an area (the mounting area 23 and the connection area 48) for mounting the seating surface plate 42 is arranged in the vicinity of the screw receiving area 47 (boss seating surface) where the head 2a of the fixing screw 1 is tightened. be. For this reason, it is necessary to consider the protrusion of the solder to the screw receiving area 47 .
In this embodiment, by providing the suppression area 50 so as to surround the screw receiving area 47 as described above, solder wetting and spreading to the screw receiving area 47 is prevented, and a flat screw receiving area 47 is realized. As a result, it is possible to fully avoid a situation in which, for example, solder enters the screw receiving area 47 and the boss seating surface becomes higher, causing interference between the component and the fixing screw 1 .

[Mounting area]
FIG. 6 is a plan view showing a configuration example of the screw receiving portion 40 provided on the mounting substrate 20. As shown in FIG.
6A and 6B each show a plan view of the screw receiving portion 40 having the notch 41a and the through hole 41b as the through portion 41, viewed from the side of the first surface 21 of the mounting board 20. FIG. there is A dotted line region in the drawing represents the shape of the seat plate 42 .
6A and 6B, the mounting area 23 (connection area 48) where the mounting substrate 20 and the seat plate 42 are connected in each screw receiving portion 40 is schematically illustrated. The mounting area 23 has a shape obtained by excluding the area of the through portion 41 from the area of the seat plate 42 .
6A and 6B, illustration of the suppression region 50 is omitted.

In the example shown in FIG. 6A , the through portion 41 is a notch 41 a narrowed at the outer edge side of the mounting board 20 . Also, the mounting area 23 is set so as to overlap the narrowed portion (the narrowed portion 55) of the notch 41a.
The notch 41a shown in FIG. 6A has a circular inner region inside the mounting substrate 20, and the outer edge side is narrower than the diameter of the inner region. Here, the mounting area 23 is set so as to overlap with the constricted portions 55 protruding from the upper and lower sides in the drawing, and the mounting area 23 has a C-shape as a whole. That is, the seat plate 42 is covered with a C-shape.

By setting the mounting area 23 so as to overlap with the constricted portion 55 in this way, it is possible to expand the area of the mounting area 23 in the notch 41 a that cannot be connected so as to surround the entire circumference of the seat plate 42 . Become. As a result, it is possible to reduce locations where the connection between the seat plate 42 and the mounting substrate 20 is weak (peeling points, etc.) even in locations where the entire periphery cannot be surrounded structurally.
In addition, the width of the constricted portion 55 (opening width of the C shape) is set as narrow as possible in terms of structure. This makes it possible to increase the connection strength of the seat plate 42 even when the notch 41a is used.

In the example shown in FIG. 6B , the through portion 41 is a through hole 41 b provided in the mounting board 20 . Moreover, the mounting area 23 is set so as to surround the entire circumference of the through hole 41b.
A through-hole 41b shown in FIG. 6B is a circular through-hole, and a substantially square mounting area 23 (seat plate 42) is set so that the through-hole 41b is accommodated therein. The lower left projecting portion is provided to indicate the orientation of the seat plate 42 . Thus, the seat plate 42 is covered all around.
As a result, the seat plate 42 and the mounting board 20 are connected over the entire circumference, so that the connection strength of the seat plate 42 can be sufficiently increased.

[Arrangement of screw receiving part]
Below, with reference to FIG. 1, the positions at which the plurality of screw receiving portions 40 are provided will be described.
As described above, in the electronic circuit 10, by providing the screw receiving portion 40, the head 2a of the fixing screw 1 is housed inside the mounting substrate 20 (first surface 21) so as not to protrude. be. Therefore, various functional components can be arranged at arbitrary positions on the first surface 21 side without worrying about interference with the head portion 2a of the fixing screw 1 . From another point of view, it can be said that the screw receiving portion 40 can be arranged regardless of the shape, size, etc. of the functional component arranged on the first surface 21 side.

As described with reference to FIG. 1 , in this embodiment, the battery 12 is arranged on the first surface 21 side of the mounting substrate 20 so as to overlap the screw receiving portion 40 .
In each screw receiving portion 40, the head 2a of the fixing screw 1 does not protrude. Therefore, for example, it is not necessary to float the battery 12 to avoid interference with the fixing screw 1 , and the battery 12 can be directly arranged on the first surface 21 . This makes it possible to avoid a situation in which the thickness of electronic device 100 increases unnecessarily.
Moreover, since the battery 12 can be configured so as to overlap the fixing screw 1, the size of the battery 12 can be increased. For example, in the electronic device 100 shown in FIG. 1, the vertical size (Y direction) of the battery 12 is limited by other components such as the camera unit 13 . On the other hand, the size of the battery 12 in the lateral direction (X direction) is not limited by the arrangement of the fixing screws 1, etc., and can be maximized within the range of the lateral width of the frame 11 (accommodating area 5), for example. .

Also, in this embodiment, the battery 12 is adhered to the first surface 21 of the mounting board 20 . In this case, the screw receiving portion 40 is provided on the outer edge portion of the mounting board 20 .
In the example shown in FIG. 1 , the battery 12 is arranged so as to cover substantially the entire surface of the first surface 21 of the mounting board 20 below the camera unit 13 . This battery 12 is adhesively fixed to the mounting substrate 20 using an adhesive tape 16 . Therefore, the mounting board 20 functions as a supporting member that supports the battery 12 .
In addition, in the area where the battery 12 is provided, two screw receiving portions 40 configured using notches 41a are provided on each of the left and right outer edge portions of the mounting substrate 20 in the drawing. Two screw receiving portions 40 configured using through holes 41b are provided in the central portion of the mounting substrate 20 overlapping the battery 12. As shown in FIG.

Since the battery 12 is fixed to the mounting board 20 in this way, for example, when the electronic device 100 is subjected to an impact, the inertial force acting on the battery 12 also acts on the mounting board 20. . For this reason, for example, if the mounting board 20 is not sufficiently fixed, it is conceivable that each part of the mounting board 20 may be displaced or deformed together with the battery 12 due to the impact, and the rear panel 14 may be damaged. .

Therefore, in this embodiment, a screw receiving portion 40 is provided on the outer edge of the mounting board 20 to which the battery 12 is fixed. As a result, the mounting board 20 can be firmly fixed to the frame 11, and displacement, deformation, etc. of the outer edge of the mounting board 20 can be sufficiently suppressed. As a result, it is possible to sufficiently prevent the battery 12 from going wild together with the mounting board 20 when an impact is applied, and it is possible to greatly reduce the risk of damage to the rear panel 14 and the like.

For example, as shown in FIG. 1, in an electronic device 100 using a full board type mounting board 20 that occupies most of the inner side of the frame 11, the mounting board 20 and the battery 12 need to be fixed. In this case, the movement of the battery 12 depends on the rigidity of the mounting board 20 . Even with such a configuration, it is possible to suppress the movement of the battery 12 by providing the screw receiving portion 40 on the outer edge of the mounting board 20 and screwing the portion with the fixing screw 1 .
In this way, even when a full-board type mounting board 20 is used, by applying the present technology, the size (battery capacity) of the battery 12 can be increased, and the rear panel 14 and the like can be secured even when receiving an impact. It is possible to realize the electronic device 100 that is less likely to be damaged.

As described above, in the electronic circuit 10 according to the present embodiment, the mounting substrate 20 is provided with the through portion 41 through which the head portion 2a of the fixing screw 1 is passed. A seat plate 42 is fixed to the second surface 22 of the mounting board 20 so as to cover the through portion 41 . The seat plate 42 is configured to receive the head portion 2a through the screw portion 2b of the fixing screw 1. As shown in FIG. As a result, the position of the head portion 2a of the fixing screw 1 is lowered by the thickness of the mounting board 20, so interference between the fixing screw 1 and other components can be suppressed.

FIG. 7 is a schematic diagram showing a screwing structure given as a comparative example. In this screwing structure, a mounting substrate 71 is provided with through holes 74 for screwing. The size of this through-hole 74 is designed so that the screw portion 2b of the fixing screw 1 can pass therethrough and the head portion 2a of the fixing screw 1 cannot pass therethrough. The screw portion 2b of the fixing screw 1 is fastened to a screw hole provided in the frame 72, and the head portion 2a of the fixing screw 1 protrudes from the upper surface of the mounting board 71 in the drawing. In this way, in a structure in which the mounting board 71 is screwed directly, when another component 75 is arranged on the surface of the mounting board 71 , the head 2 a of the fixing screw 1 interferes with the other component 75 . As a result, the thickness of the device may increase unnecessarily, and the placement and size of other components 75 may be restricted.

8 and 9 are schematic diagrams showing examples of arrangement of components of an electronic device given as a comparative example.
An electronic device 80 shown in FIG. 8 uses a half-board type mounting substrate 81 . The figure on the left side of FIG. 8 is a plan view of the electronic device 80, and the figure on the right side is a cross-sectional view taken along line CC.
The planar size of the half-board type mounting substrate 81 is about half the planar size of the accommodation area of the frame 82 or smaller. When a half-board type mounting board 81 is used, it is not necessary to fix the battery 85 to the mounting board 81. For example, the battery 85 can be directly attached to the frame 82 using an adhesive tape 83 or the like in an area where the mounting board 81 is not provided. Fixed.
The half-board type mounting board 81 secures an effective circuit area by forming it as a multi-layer board, for example. On the other hand, when it is necessary to mount a relatively large component, it may not be possible to ensure the effective area of the circuit only by multilayering. In the electronic device 80, for example, when the size of the camera unit 86 or the like is increased, it is conceivable that the multi-layered mounting substrate 81 may not be able to cope with it.

The electronic device 90 shown in FIG. 9 uses a full-board type mounting board 91, but is not provided with the above-described screw receiving portion 40, and is configured such that the fixing screw 1 is directly screwed to the mounting board 91. there is In this case, the battery 95 is fixed to the mounting board 91 , and the mounting board 91 is screwed to the frame 92 using the fixing screws 1 . The electronic device 90 is also provided with a trinocular camera unit 96 .
When the fixing screw 1 is directly screwed to the mounting board 91 , it is difficult to arrange the battery 95 directly above the fixing screw 1 because the head 2 a of the fixing screw 1 protrudes from the mounting board 91 . Therefore, as shown in FIG. 9, it is necessary to arrange the fixing screw 1 so as to avoid the battery 95 .
In addition, if the board fixing structure (fixing screw 1) is arranged next to the battery 95 in the battery 95 arrangement area required for the full board type mounting board 91, the board fixing structure also needs space, so the battery capacity is expanded. difficult to do

In this embodiment, the mounting board 20 is provided with the through portion 41 , and the screw receiving portion 40 is configured by disposing the seat plate 42 so as to cover the through portion 41 . By mounting the seat plate 42 on the mounting board 20 in this manner, the thickness of the head 2a of the fixing screw 1, that is, the thickness of the screw head can be absorbed by the thickness of the mounting board 20. FIG.
As a result, unlike the structure in which the mounting board 20 is directly fixed by the fixing screw 1 (see FIG. 7), the components can be laid out above the fixing screw 1 without worrying about interference with the fixing screw 1. It becomes possible. Further, on the first surface 21 side of the mounting substrate 20, there is no need to leave a space to avoid the head portion 2a of the fixing screw 1. FIG. This makes it possible to make the device thinner than when the mounting substrate 20 is directly screwed without providing the screw receiving portion 40 .

Further, when a half-board type mounting board 81 is used as shown in FIG. Therefore, it is not necessary to fix the battery 85 on the substrate, and in that respect, it is not necessary to use a configuration such as the screw receiving portion 40 .
On the other hand, in a configuration using relatively large components, such as the camera unit 13 equipped with a trinocular camera shown in FIG. 1, it may be difficult to use a half board. In such a case, for example, a full board type mounting substrate 20 or the like is adopted in order to secure the effective area of the circuit.

The present technology can provide a very effective screw fastening structure in a configuration using such a full-board type mounting board 20 . A wide flat area can be realized on the first surface 21 of the mounting board 20 , and the arrangement of the battery 12 is not restricted by the fixing screw 1 . Conversely, the arrangement of fixing screw 1 is not restricted by battery 12 .
As a result, it is possible to adopt a layout in which the fixing screw 1 is arranged so as to overlap the battery 12 as shown in FIG. The fixing screw 1 (screw receiving portion 40 ) is arranged on the outer edge of the mounting board 20 . This makes it possible to sufficiently fix the mounting board 20 to which the battery 12 is fixed while suppressing the set thickness of the electronic device 100 .
Furthermore, since the head 2a of the fixing screw 1 does not protrude to the side of the battery 12 or the like, the size of the battery 12 in the lateral direction (X direction) can be easily increased. As a result, the capacity of the battery 12 can be easily maximized.

In the above description, the configuration in which the battery 12 is arranged on the side of the first surface 21 of the mounting substrate 20 has been described. be. For example, when it is desired to efficiently use the space above the fixing screw 1, by using the above-described screw receiving portion 40, the space above the fixing screw 1 can be used without worrying about interference with the head 2a of the fixing screw 1. Arbitrary parts can be arranged.

<Other embodiments>
The present technology is not limited to the embodiments described above, and various other embodiments can be implemented.

In the above embodiment, the configuration in which the seat plate is soldered to the mounting board has been described. The method of fixing the seat plate to the mounting substrate (second surface) is not limited. For example, the seat plate and the mounting substrate may be fixed using an adhesive. Alternatively, the seat plate 42 may be fitted into the mounting board using a predetermined mating hole or the like.

In the above embodiment, the screw receiving portion is configured so that the head of the fixing screw does not protrude from the first surface of the mounting substrate. In this configuration, by providing a seat plate on the second surface of the mounting substrate to receive the fixing screw, the thickness of the fixing screw head is absorbed by the thickness of the mounting substrate, and the fixing screw from the first surface It is configured to suppress the protrusion of the head of the. At this time, the head of the fixing screw does not necessarily have to be recessed with respect to the first surface. good too.
For example, in the case where parts are arranged with a cushioning material such as a sponge or gel member having a certain thickness in between, the head of the fixing screw may be allowed to protrude. In this case, it is not necessary to completely absorb the thickness of the head of the fixing screw, but the amount of projection of the fixing screw can be easily reduced by using the screw receiving portion. This makes it possible to suppress interference between the fixing screw and other parts, and to improve the degree of freedom in layout.

It is also possible to combine at least two characteristic portions among the characteristic portions according to the present technology described above. That is, various characteristic portions described in each embodiment may be combined arbitrarily without distinguishing between each embodiment. Moreover, the various effects described above are only examples and are not limited, and other effects may be exhibited.

In the present disclosure, "same", "equal", "orthogonal", etc. are concepts including "substantially the same", "substantially equal", "substantially orthogonal", and the like. For example, states included in a predetermined range (for example, a range of ±10%) based on "exactly the same", "exactly equal", "perfectly orthogonal", etc. are also included.

Note that the present technology can also adopt the following configuration.
(1) a mounting substrate having a first surface and a second surface opposite to the first surface;
Each of them has a penetrating part that penetrates the mounting board and allows the head of a fixing screw to pass therethrough, and is fixed to the second surface so as to cover the penetrating part and allows the screw part of the fixing screw to pass through the head of the fixing screw. at least one screw receiver having a receiving plate member.
(2) The electronic circuit according to (1),
The plate member receives the head of the fixing screw so that the head of the fixing screw does not protrude from the first surface.
(3) The electronic circuit according to (1) or (2),
The electronic circuit, wherein the thickness of the mounting substrate is set to be greater than the thickness of the head of the fixing screw.
(4) The electronic circuit according to any one of (1) to (3),
The electronic circuit, wherein the penetrating portion is at least one of a notch provided in the mounting substrate and a through hole provided in the mounting substrate.
(5) The electronic circuit according to (4),
The mounting substrate has a mounting area set on a peripheral edge of the through portion configured as the notch or the through hole on the second surface,
The electronic circuit, wherein the plate member is fixed to the mounting area by soldering.
(6) The electronic circuit according to (5),
The through portion is a through hole provided in the mounting substrate,
The electronic circuit, wherein the mounting area is set to surround the entire periphery of the through hole.
(7) The electronic circuit according to (5),
The through portion is a notch narrowed on the outer edge side of the mounting substrate,
The electronic circuit, wherein the mounting area is set so as to overlap with the narrowed portion of the notch.
(8) The electronic circuit according to any one of (5) to (7),
The plate member has a screw through hole through which the screw portion of the fixing screw is passed, and a screw receiving area provided around the screw through hole to receive the fixing screw.
(9) The electronic circuit according to (8),
the plate member has a connection area provided outside the screw receiving area and connected to the mounting area of the second surface;
The screw receiving area is an area whose height is adjusted with respect to the connection area so that the head of the fixing screw does not protrude from the first surface.
(10) The electronic circuit according to (8) or (9),
The electronic circuit, wherein the screw receiving area is formed by drawing.
(11) The electronic circuit according to any one of (8) to (10),
The electronic circuit, wherein the plate member is an annular region surrounding the screw receiving region and has a suppression region in which wettability to molten solder is set lower than that of other portions.
(12) The electronic circuit according to (11),
The suppression region is an annular groove region Electronic circuit.
(13) The electronic circuit according to any one of (1) to (12),
The electronic circuit, wherein the planar size of the mounting board is substantially the same as the planar size of an accommodation area of a frame in which the mounting board is fixed by the fixing screws via the screw receiving portions.
(14) The electronic circuit according to (13),
An electronic circuit, wherein a predetermined functional component is arranged on the first surface side of the mounting substrate so as to overlap with the screw receiving portion.
(15) The electronic circuit according to (14),
the predetermined functional component is adhered to the first surface of the mounting board;
The electronic circuit, wherein the screw receiving portion is provided on an outer edge portion of the mounting board.
(16) a mounting substrate having a first surface and a second surface opposite to the first surface;
Each of them has a penetrating part that penetrates the mounting board and allows the head of a fixing screw to pass therethrough, and is fixed to the second surface so as to cover the penetrating part so that the head of the fixing screw does not protrude from the first surface. at least one screw receiving portion having a plate member for receiving the fixing screw as;
a frame disposed on the second surface side of the mounting board, and fixing the mounting board with the fixing screws via the screw receiving portion;
and a functional component arranged on the first surface side of the mounting substrate so as to overlap with the screw receiving portion.

REFERENCE SIGNS LIST 1 Fixing screw 2a Head 2b Screw part 5 Accommodating area 10 Electronic circuit 11 Frame 12 Battery 20 Mounting board 21 First surface 22 Second surface 23 Mounting area 40 Screw receiver Part 41 Penetrating part 41a Notch 41b Through hole 42 Seat plate 46 Screw through hole 47 Screw receiving area 48 Connection area 50 Suppression area 100 Electronic device

Claims

a mounting substrate having a first surface and a second surface opposite to the first surface;
Each of them has a penetrating part that penetrates the mounting board and allows the head of a fixing screw to pass therethrough, and is fixed to the second surface so as to cover the penetrating part and allows the screw part of the fixing screw to pass through the head of the fixing screw. at least one screw receiver having a receiving plate member.
The electronic circuit of claim 1,
The plate member receives the head of the fixing screw so that the head of the fixing screw does not protrude from the first surface.
The electronic circuit of claim 1,
The electronic circuit, wherein the thickness of the mounting substrate is set to be greater than the thickness of the head of the fixing screw.
The electronic circuit of claim 1,
The electronic circuit, wherein the penetrating portion is at least one of a notch provided in the mounting substrate and a through hole provided in the mounting substrate.
5. The electronic circuit of claim 4,
The mounting substrate has a mounting area set on a peripheral edge of the through portion configured as the notch or the through hole on the second surface,
The electronic circuit, wherein the plate member is fixed to the mounting area by soldering.
6. The electronic circuit of claim 5,
The through portion is a through hole provided in the mounting substrate,
The electronic circuit, wherein the mounting area is set to surround the entire periphery of the through hole.
6. The electronic circuit of claim 5,
The through portion is a notch narrowed on the outer edge side of the mounting substrate,
The electronic circuit, wherein the mounting area is set so as to overlap with the narrowed portion of the notch.
6. The electronic circuit of claim 5,
The plate member has a screw through hole through which the screw portion of the fixing screw is passed, and a screw receiving area provided around the screw through hole to receive the fixing screw.
9. The electronic circuit of claim 8,
the plate member has a connection area provided outside the screw receiving area and connected to the mounting area of the second surface;
The screw receiving area is an area whose height is adjusted with respect to the connection area so that the head of the fixing screw does not protrude from the first surface.
9. The electronic circuit of claim 8,
The electronic circuit, wherein the screw receiving area is formed by drawing.
9. The electronic circuit of claim 8,
The electronic circuit, wherein the plate member is an annular region surrounding the screw receiving region and has a suppression region in which wettability to molten solder is set lower than that of other portions.
12. The electronic circuit of claim 11, comprising:
The suppression region is an annular groove region Electronic circuit.
The electronic circuit of claim 1,
The electronic circuit, wherein the planar size of the mounting board is substantially the same as the planar size of an accommodation area of a frame in which the mounting board is fixed by the fixing screws via the screw receiving portions.
14. The electronic circuit of claim 13, comprising:
An electronic circuit, wherein a predetermined functional component is arranged on the first surface side of the mounting substrate so as to overlap with the screw receiving portion.
15. The electronic circuit of claim 14,
the predetermined functional component is adhered to the first surface of the mounting board;
The electronic circuit, wherein the screw receiving portion is provided on an outer edge portion of the mounting board.
a mounting substrate having a first surface and a second surface opposite to the first surface;
Each of them has a penetrating part that penetrates the mounting board and allows the head of a fixing screw to pass therethrough, and is fixed to the second surface so as to cover the penetrating part so that the head of the fixing screw does not protrude from the first surface. at least one screw receiving portion having a plate member for receiving the fixing screw as;
a frame disposed on the second surface side of the mounting board, and fixing the mounting board with the fixing screws via the screw receiving portion;
and a functional component arranged on the first surface side of the mounting substrate so as to overlap with the screw receiving portion.