WO2023068568A1

WO2023068568A1 - Electronic device comprising housing, and method for manufacturing same

Info

Publication number: WO2023068568A1
Application number: PCT/KR2022/014098
Authority: WO
Inventors: 김창수; 황한규; 공영환; 나상식; 정현정
Original assignee: 삼성전자 주식회사
Priority date: 2021-10-18
Filing date: 2022-09-21
Publication date: 2023-04-27
Also published as: KR20230055199A

Abstract

An electronic device according to an embodiment may include a housing including an uncoated surface forming the exterior of the electronic device, wherein the uncoated surface may include a pattern region formed of a plurality of convex portions including a smooth surface, and the pattern region may have a surface roughness value equal to or less than a certain threshold value. Various other embodiments identified through the specification are possible.

Description

Electronic device including housing and manufacturing method thereof

Various embodiments disclosed in this document relate to an electronic device including a housing including a non-painted surface, and a manufacturing method thereof.

The electronic device may include a housing that forms at least a part of an external appearance of the electronic device to provide a sense of aesthetics to the user or to protect the electronic device. When the housing includes an unpainted surface, the housing may include a pattern area to improve scratch resistance of the unpainted surface. The housing including the pattern area may be injection molded using a mold in which the pattern area is processed.

The mold is a method of etching (eg, a method of chemically or electrically corroding) at least a part of the mold, or a CNC machining method (eg, a method of cutting using a tool, or a method of processing a plurality of concave-convex shape patterns). can be used to form a pattern area. A plurality of concavo-convex pattern processing methods may include a process of machining a mold by rotating a ball-shaped tool several times to scrape a surface.

When processing a pattern area on a mold using a method of etching at least one surface of the mold, a rough surface (for example, an atypical anchor structure) is formed on the pattern area of the mold processed by chemical or physical erosion. ) may be formed. When machining a pattern region on a mold using a CNC machining method, a rough surface (eg, including a burr, tool mark, or concavo-convex structure) may be formed on the pattern region of the mold. there is. Contaminants adsorbed on the rough surface may contaminate the surface of the housing.

An electronic device according to various embodiments of the present disclosure includes a housing including an unpainted surface forming an exterior of the electronic device, and the unpainted surface includes a pattern area formed of a plurality of convex portions including a smooth surface. Including, the pattern area may have a surface roughness value less than or equal to a predetermined threshold value.

In a method of manufacturing a housing of an electronic device according to various embodiments of the present disclosure, at least one protrusion presses at least a portion of at least one surface of a mold using a tool including at least one protrusion having a convex shape in a first direction. A step of processing the mold with a tool so that at least one surface of the mold is formed with a plurality of concave portions including a smooth surface by performing linear locomotion one or more times; A process of injecting the housing including the second pattern area inverted to the area may be included.

Various embodiments disclosed in this document provide a housing of an electronic device capable of preventing contamination or scratches (eg, scratches) from occurring on the housing by forming a pattern including an unpainted surface and a manufacturing method thereof. can

Various embodiments disclosed in this document may provide a housing of an electronic device and a manufacturing method thereof capable of preventing surface contamination due to low surface roughness while forming a pattern on the surface.

In addition to this, various effects identified directly or indirectly through this document may be provided.

1 is a perspective view illustrating a housing of an electronic device according to an exemplary embodiment.

2 is a flowchart illustrating a method of manufacturing a housing of an electronic device according to an exemplary embodiment.

3 is a plan view illustrating a tool according to an exemplary embodiment.

4 is a cross-sectional view illustrating a process of processing a mold with a tool according to an embodiment.

5 is a perspective view illustrating a process of processing a mold with a tool according to an embodiment.

6 is a graph showing the surface of a machined mold according to an embodiment.

7 is a perspective view illustrating a machined mold according to various embodiments.

8 is a perspective view illustrating a process of processing a mold according to another embodiment.

9 is a perspective view illustrating a process of processing a mold according to another embodiment.

10 is a perspective view illustrating a pattern area of a machined mold according to various embodiments.

11 is a perspective view illustrating a process of polishing an edge portion of a processed mold according to an embodiment.

12 is a flowchart illustrating a method of manufacturing a housing of an electronic device according to another embodiment.

13 is a front perspective view of a mobile electronic device according to an embodiment.

14 is a perspective view of the back of the electronic device of FIG. 13;

15 is an exploded perspective view of the electronic device of FIG. 13;

In connection with the description of the drawings, the same or similar reference numerals may be used for the same or similar elements.

Hereinafter, various embodiments of the present disclosure will be described with reference to the accompanying drawings. However, it should be understood that this disclosure is not intended to limit the present disclosure to specific embodiments, and includes various modifications, equivalents, and/or alternatives of the embodiments of the present disclosure.

An electronic device according to various embodiments of the present document may include, for example, a smartphone, a tablet personal computer (PC), a mobile phone, a video phone, an e-book reader, Desktop personal computer, laptop personal computer, netbook computer, workstation, server, personal digital assistant (PDA), portable multimedia player (PMP), MP3 player, mobile medical It may include at least one of a device, a camera, or a wearable device. According to various embodiments, the wearable device may be an accessory (eg, watch, ring, bracelet, anklet, necklace, glasses, contact lens, or head-mounted-device (HMD)), fabric or clothing integrated ( For example, it may include at least one of an electronic clothing), a body attachment type (eg, a skin pad or tattoo), or a living body implantable type (eg, an implantable circuit).

In some embodiments, the electronic device may be a home appliance. Home appliances include, for example, televisions, digital video disk (DVD) players, audio systems, refrigerators, air conditioners, vacuum cleaners, ovens, microwave ovens, washing machines, air purifiers, set-top boxes, home automation control panels ( It may include at least one of a home automation control panel, a security control panel, a TV box, a game console, an electronic dictionary, an electronic key, a camcorder, or an electronic picture frame.

In another embodiment, the electronic device may include various types of medical devices (e.g., various portable medical measuring devices (blood glucose meter, heart rate monitor, blood pressure monitor, body temperature monitor, etc.), magnetic resonance angiography (MRA), magnetic resonance imaging (MRI), CT (computer tomography), camera, or ultrasonicator, etc.), navigation device, GNSS (global navigation satellite system), EDR (event data recorder), FDR (flight data recorder), automotive infotainment ) devices, marine electronics (e.g. marine navigation systems, gyrocompasses, etc.), avionics, security devices, automotive head units, industrial or home robots, automatic teller's machines (ATMs) of financial institutions , point of sales (POS) in stores, or internet of things devices (e.g. light bulbs, sensors, electric or gas meters, sprinklers, smoke alarms, thermostats, street lights, toasters) , Exercise equipment, hot water tank, heater, boiler, etc.) may include at least one.

According to some embodiments, the electronic device may be a piece of furniture or a building/structure, an electronic board, an electronic signature receiving device, a projector, or various measuring devices (eg, Water, electricity, gas, radio wave measuring devices, etc.) may include at least one. In various embodiments, the electronic device may be one or a combination of more than one of the various devices described above. An electronic device according to some embodiments may be a flexible electronic device. In addition, the electronic device according to the embodiment of this document is not limited to the above-described devices, and may include new electronic devices according to technological development.

A housing according to various embodiments of the present disclosure may be at least a part of the housing of the electronic device described above.

1 is a perspective view illustrating a housing 100 of an electronic device according to an exemplary embodiment.

According to an embodiment, an electronic device may include at least one housing 100 forming at least a part of an exterior of the electronic device. At least one housing 100 according to an embodiment may be injection molded using a mold. However, it is not limited to this. For example, at least one housing 100 may be molded by processing a housing member.

According to one embodiment, the housing 100 may include an unpainted surface. The unpainted surface is not subjected to post-processing (eg, painting, deposition, or plating) on the housing base material (eg, a member that is the material of the housing 100) (eg, post-processing is not required) The housing base material may refer to a surface exposed on the surface of the housing 100 . However, it is not limited thereto. According to one embodiment, the housing 100 including an unpainted surface may include at least one pattern area 110 to improve scratch resistance. For example, the unpainted surface of the housing 100 may include the pattern area 110 .

According to one embodiment, the pattern area 110 may include a pattern. For example, the pattern area 110 may be formed of a plurality of convex portions 120 . The region 121 between the plurality of convex portions 120 of the pattern region 110 may include a curved surface. For example, the pattern area 110 may include a concave portion between one convex portion and another convex portion. The pattern area 110 may be seamlessly formed from a convex portion to a concave portion. For example, the pattern area 110 may include a sine wave pattern. However, it is not limited to this.

According to an embodiment, a curvature value of the pattern of the pattern area 110 may be 0.2 or more. According to an embodiment, the curvature of a curved surface may mean a rate of change representing a degree of curvature of the curved surface. The curvature of the curved surface may be defined as a reciprocal of a radius (eg, RA or RB) of a circle including the curved surface. For example, the curvature (1/RA) value of the plurality of convex portions 120 may be 0.2 or more. According to an embodiment, the curvature (1/RB) value of the curved surface formed in the region 121 between the plurality of convex portions 120 may be 0.2 or more. However, it is not limited to this.

According to one embodiment, the housing 100 may include a smooth surface at least in part. For example, the plurality of convex portions 120 forming the pattern area 110 may include a smooth surface. The curved surface formed in the region 121 between the plurality of convex portions 120 may include a smooth surface. Since the pattern area 110 includes the smooth surface, the smooth surface may prevent contaminants from adsorbing to the pattern area 110 .

According to an embodiment, a surface roughness value of the pattern area 110 may be equal to or less than a predetermined threshold value. For example, the surface roughness of the pattern region 110 may be 5.0 μm or less. However, it is not limited to this.

According to one embodiment, the pattern area 110 may include a polygonal shape. For example, at least one of the plurality of convex portions 120 may have a polygonal shape. For example, referring to FIG. 1 , at least one of the plurality of convex portions 120 may have a rectangular shape. However, it is not limited to this. For example, at least one of the plurality of convex portions 120 may have a triangular or pentagonal shape. According to an embodiment, the polygonal shape of the pattern area 110 may include a curved polygonal shape rather than a planar shape.

According to one embodiment, the housing 100 may include a hard material. For example, the housing 100 may include at least one material of metal or glass. However, it is not limited to this. For example, the housing 100 may include at least one of resin and polymer materials.

According to one embodiment, the housing 100 may include a transparent material. However, it is not limited to this. For example, the housing 100 may include an opaque material.

2 is a flowchart illustrating a method 200 of manufacturing a housing of an electronic device according to an exemplary embodiment.

In the housing manufacturing method 200 of FIG. 2 , the housing may be referred to by the housing 100 of FIG. 1 . The same reference numerals are used for the same or substantially the same components as those described above, and redundant descriptions are omitted.

Referring to FIG. 2 , a method 200 of manufacturing a housing of an electronic device according to an embodiment may include a process 203 of processing a mold with a tool and a process 207 of injection molding the housing with the processed mold. there is. However, the method 200 for manufacturing a housing of an electronic device is not limited thereto. For example, the method 200 for manufacturing a housing of an electronic device may omit at least one of the above processes or may further include at least one other process. For example, the method 200 of manufacturing a housing of an electronic device may further include at least one process of manufacturing a tool (201) or polishing an edge portion (205).

According to an embodiment, the process of manufacturing a tool 201 may include a process of manufacturing a tool for processing a mold used for injection molding of a housing. According to an embodiment, the tool manufactured in step 201 may include a structure for processing the surface of the mold without rotating the tool. A detailed description of the tool will be described later with reference to FIG. 3 .

According to one embodiment, in step 203 of machining a mold with a tool, the tool may be used to machine the mold. For example, a tool may be used to form the first pattern area in the mold. In step 203, the tool may make at least one linear locomotion in one direction while pressing at least a portion of the mold. In step 203, the tool may linearly move without rotation. Details of the process of processing the mold will be described later with reference to FIGS. 4 to 9 .

According to one embodiment, in step 205 of polishing the edge portion, the processed edge portion of the mold may be polished. Polishing in the present disclosure may mean smoothing by rubbing the edge or surface of an object. Details of the process of polishing the edge portion will be described later with reference to FIGS. 10 and 11 .

According to one embodiment, the process 207 of injection molding the housing with the machined mold is a process of injection molding the housing including the second pattern area reversed to the first pattern area with the mold including the first pattern area. can include For example, when the first pattern region of the mold includes a plurality of concave portions, a housing injection-molded by the mold may include a second pattern region including a plurality of convex portions inverted to the plurality of concave portions. .

3 is a plan view illustrating a tool 300 according to an exemplary embodiment. 4 is a cross-sectional view illustrating a process of processing a mold with a tool according to an embodiment.

Referring to FIG. 3 , the tool 300 may include at least one machining part. For example, the tool 300 may include at least one protrusion 310 . At least one protrusion 310 may include a convex shape protruding in one direction (eg, -y axis direction). According to one embodiment, at least one protrusion 310 may include a curved surface. For example, the outer surface of at least one protrusion 310 may include a hemisphere shape. However, it is not limited to this. For example, at least one protrusion 310 may include an arch shape.

According to one embodiment, the processing unit of the tool 300 may include a smooth surface. For example, at least a portion of the at least one protrusion 310 may include a smooth surface. Since at least one protrusion 310 includes a smooth surface, adsorption of contaminants to an irregular structure (eg, an anchor structure) generated in the mold when the mold is processed with a tool can be prevented.

Referring to FIG. 4 , a tool 300 may be used to process a mold 400 used in a process of manufacturing a housing. According to one embodiment, at least one protrusion 310 of the tool 300 may press (eg, in the -y-axis direction) at least a portion of the mold 400 . When the at least one protrusion 310 moves in a state of pressing at least a portion of the mold 400 , a pattern region may be formed in the mold 400 . For example, a plurality of concave portions 410 may be formed in the mold 400 . Referring to FIG. 4 , the plurality of concave portions 410 may include a first concave portion 411 and a second concave portion 412 .

According to an embodiment, the width W of at least one protrusion 310 of the tool 300 may be substantially equal to the width of at least one pattern of the pattern area. For example, the width W of the at least one protrusion 310 is the width of at least one concave portion (eg, the first concave portion 411 or the second concave portion 412) among the plurality of concave portions 410. It may be substantially equal to the width. However, it is not limited to this.

According to an embodiment, the width of at least one protrusion 310 of the tool 300 may be substantially the same as the width of at least one concave portion among the plurality of concave portions 410 . Accordingly, in the process of processing the mold 400 using the tool, vibration (or shaking) of the tool can be minimized.

According to an embodiment, the thickness D of at least one protrusion 310 of the tool 300 may be substantially equal to the depth of at least one pattern in the pattern area. For example, the thickness D of the at least one protrusion 310 is the thickness of at least one concave portion among the plurality of concave portions 410 (eg, the first concave portion 411 or the second concave portion 412). It may be substantially equal to the depth. However, it is not limited to this.

5 is a perspective view illustrating a process of processing a mold with a tool according to an embodiment. 6 is a graph showing the surface of a machined mold according to an embodiment.

Tool 300 and mold 400 may be referred to by tool 300 and mold 400 of FIGS. 2 to 5 , respectively. The same reference numerals are used for the same or substantially the same components as those described above, and redundant information is omitted.

According to one embodiment, the tool 300 may process the mold so that at least a portion of the mold 400 includes a pattern area. For example, the tool 300 may linearly move in one direction while pressing at least a portion of the mold 400 . As the tool 300 moves while pressing at least a portion of the mold 400 , a pattern region may be formed on at least a portion of the mold 400 . In another example, the tool 300 may linearly move in at least two or more directions that intersect. The arrangement of patterns in the pattern area may be directed in the same direction as the moving path of the tool 300 .

Referring to FIG. 5 , at least one protrusion 310 of the tool 300 may linearly move at least once in the first direction A while pressing at least a portion of at least one surface of the mold 400 . For example, the at least one protrusion 310 of the tool 300 extends from one end to the other end of the mold 400 (in the first direction A), or from the other end of the mold 400 to one end (in the first direction). in the opposite direction of (A)) at least once. Accordingly, a plurality of linear patterns may be formed on at least a part of the mold 400 .

According to one embodiment, the tool 300 may move without rotation when processing the mold 400 . For example, at least one protrusion 310 of the tool 300 may linearly move without rotation. Since the at least one protrusion 310 linearly moves without rotation, the at least one protrusion 310 can prevent scratches (eg, burrs or tool marks) on the mold due to the rotation of the tool. .

According to an embodiment, the pattern of the pattern region may include a concave shape by pressing at least a portion of at least one surface of the mold 400 with at least one protrusion 310 . For example, the pattern area may include a first concave portion 411 and a second concave portion 412 disposed parallel to the first concave portion 411 . According to an embodiment, the region 413 between the first concave portion 411 and the second concave portion 412 may include a curved surface. For example, a convex portion may be formed between the first concave portion 411 and the second concave portion 412 .

Referring to FIG. 6, the

graphs

501 and 502 of (a) of FIG. 6 are graphs showing the surface of a mold processed using a conventional technique (eg, a method of etching at least a portion of the mold or a CNC machining method). can

Graphs

503 and 504 in (b) of FIG. 6 may be graphs showing surfaces of a mold (400 in FIG. 5) processed using a tool (eg, 300 in FIG. 5) according to an embodiment.

The graph 503 in (b) of FIG. 6 may be a graph showing the surface of the cross section of the mold 400 cut along line A-A' in FIG. 5 . The graph 504 in (b) of FIG. 6 may be a graph showing the surface of the cross section of the mold 400 cut along line BB' in FIG. 5 .

The x-axis of the graphs shown in (a) and (b) of FIG. 6 may be a position of a pattern formed by processing the mold 400 with the tool 300 . The y-axis of the graph may be the height of the pattern from the reference plane (0).

When comparing the

graphs

501 and 502 in (a) of FIG. 6 with the

graphs

503 and 504 in (b) of FIG. 6, the surface of the mold in the graph (a) is the surface of the mold in the graph (b). Compared to ginning, it may contain more. For example, the surface roughness of the molds of the

graphs

501 and 502 of (a) may be rougher than the roughness of the surfaces of the molds of the

graphs

503 and 504 of (b). Therefore, the surface of the mold in the graph (a) is more likely to adsorb contaminants than the surface in the graph (b).

Referring to the graphs 504 of FIGS. 5 and 6 , the pattern area of the mold may include a curved surface in which the area 413 between the plurality of concave portions is curved. For example, the pattern area of the mold may include a sine wave shape. However, it is not limited to this.

According to an embodiment, a surface roughness value of the pattern region of the mold may be equal to or less than a predetermined threshold value. For example, the surface roughness value of the pattern area of the mold may be 0.5 μm or less. However, it is not limited to this.

According to an embodiment, a curvature value of the plurality of concave portions of the pattern area of the mold may be 0.2 or more. According to an embodiment, the curvature value of the curved surface of the region 413 between the plurality of concave portions may be 0.2 or more. However, it is not limited to this.

Molds 600a to 600c may be referred to by mold 400 of FIGS. 2 to 5 . For the same or substantially the same content as the above, redundant description will be omitted.

According to one embodiment, the mold may include a pattern area including a pattern. For example, the pattern area of the mold may include a plurality of linear patterns directed in one direction. However, it is not limited to this. For example, the pattern area of the mold may include at least one non-linear pattern.

According to one embodiment, the pattern area of the mold may include a plurality of linear patterns directed in one direction. Straight patterns may include concave shapes. Referring to (a) of FIG. 7 , the pattern area 610a of the mold 600a may include a plurality of linear patterns directed in the first direction (A). In another example, referring to (b) of FIG. 7 , the pattern area 610b of the mold 600b may include a plurality of linear patterns directed in a second direction B, which is different from the first direction A. may be

According to one embodiment, the pattern area of the mold may include a plurality of curved patterns. The curved pattern may include a concave shape. Referring to (c) of FIG. 7 , the pattern area 610c of the mold 600c may include a plurality of curved patterns directed in the third direction (C). However, it is not limited to this. In another embodiment, the pattern area of the mold may include a spiral pattern.

8 is a perspective view illustrating a process of processing a mold according to an embodiment.

Referring to (a) of FIG. 8 , in the process of processing a mold according to an embodiment, at least one protrusion (eg, the protrusion 310 of FIG. 3 ) of a tool (eg, the tool 300 of FIG. 3 ) A process of linearly moving at least one time in the first direction A while pressing at least a portion of at least one surface of the mold 700 may be included. In the process (a) of FIG. 8 , a pattern area including a linear pattern directed in the first direction A may be formed in the mold 700 .

Referring to (b) of FIG. 8 , in the process of machining a mold according to an embodiment, at least one protrusion of a tool presses at least a portion of the pattern region of the mold 700 processed in the process of (a) of FIG. 8 It may further include a process of linearly moving at least once in the second direction (B) while doing so. Therefore, referring to FIG. 8(c), the pattern area of the mold 700 processed in the process of FIG. 8(b) may form a plurality of concave portions 710 having a polygonal shape. For example, the pattern area may form a plurality of concave portions 710 having a rectangular shape. However, it is not limited to this.

9 is a perspective view illustrating a process of processing a mold according to an embodiment.

Referring to (a) of FIG. 9 , in the process of processing a mold according to an embodiment, at least one protrusion (eg, the protrusion 310 of FIG. 3 ) of a tool (eg, the tool 300 of FIG. 3 ) A process of linearly moving at least one or more times in the first direction A while pressing at least a portion of at least one surface of the mold 800 may be included. In the process (a) of FIG. 9 , a pattern region including a linear pattern directed in the first direction A may be formed in the mold 800 .

Referring to (b) of FIG. 9 , in the process of machining a mold according to an embodiment, at least one protrusion of a tool presses at least a portion of the pattern area of the mold 800 processed in the process of (a) of FIG. 9 It may further include a process of linearly moving at least once in the second direction (B) while doing so. The pattern area of the mold 800 processed in the step (b) of FIG. 9 may include a polygonal shape formed by crossing the first direction (A) and the second direction (B). For example, the plurality of concave portions may have a polygonal shape.

Referring to (c) of FIG. 9 , in the process of machining a mold according to an embodiment, at least one protrusion of a tool presses at least a portion of the pattern region of the mold 800 processed in the process of (b) of FIG. 9 It may further include a process of linearly moving at least once in a third direction (C) different from the first direction (A) and the second direction (B) while doing so. Referring to (d) of FIG. 9, the pattern area of the mold 800 processed in the process of (c) of FIG. 9 intersects the first direction (A), the second direction (B), and the third direction (C). It may include a polygonal shape formed by being. For example, the plurality of concave portions 810 may have a polygonal shape.

The mold 900a of FIG. 10 (a) may be referred to as the mold 400 of FIGS. 4 to 6 . The mold 900b of FIG. 10(b) may be referred to as the mold 700 of FIG. 8 or the mold 800 of FIG. 9 . Redundant descriptions of components that are the same as or substantially the same as those described above are omitted.

According to an embodiment, when a tool (eg, the tool 300 of FIG. 3 ) moves while pressing at least a portion of at least one surface of the mold 900, an edge portion may be formed at a portion where the patterns of the pattern area intersect. . For example, the edge portion may be formed at a portion where the concave portion of the pattern area intersects.

According to one embodiment, the edge portion may include a protruding shape. For example, the edge portion may include a protruding horn shape. However, it is not limited to this.

Referring to (a) of FIG. 10 , the mold 900a may include a pattern area 910a. The pattern area 910b may include a plurality of concave portions. For example, the pattern area 910a may include a first concave portion 911a and a second concave portion 912a.

According to an embodiment, the pattern area 910a may include a plurality of edge portions. The edge portion may be a corner (or edge) formed between a plurality of concave portions as the tool linearly moves in the first direction A at least once in the process of FIG. 8 (a). For example, the pattern area 910a may include an edge portion 920a formed between the first concave portion 911a and the second concave portion 912a.

Referring to (b) of FIG. 10 , the mold 900b may include a pattern area 910b. The pattern area 910b may include a plurality of concave portions. For example, the pattern area 910b includes a first concave portion 911b, a second concave portion 912b adjacent to the first concave portion 911b, and a second concave portion adjacent to the first concave portion 911b. A third concave portion 913b facing 912b, and a fourth concave portion 914b adjacent to the second concave portion 912b and the third concave portion 913b and facing the first concave portion 911b can include

According to an embodiment, the pattern area 910b may include a plurality of edge portions. For example, the pattern area 910b may include an edge portion 920b formed between the first concave portion 911b to the fourth concave portion 914b. According to an embodiment, in the step (b) of FIG. 8 , the edges (or edges) formed between the plurality of concave portions as the tool linearly moves in the second direction (B) intersecting the first direction (A). ) can be. In another example, the edge portion 920b may include a plurality of edges as the tool linearly moves in the third direction C while intersecting the first direction A and the second direction B in the process of FIG. 9 (c). It may be a corner (or edge) formed between the concave portions.

11 is a perspective view illustrating a process of polishing an edge portion 1020 of a machined mold according to an embodiment.

According to one embodiment, in the process of polishing the edge portion 1020 of the machined mold 1000, the edge portion 1020 formed between the plurality of concave portions 1010 may be polished. For example, in the above process, the edge portion 1020 may be polished so that a region between the plurality of concave portions 1010 includes a curved surface. In another example, the edge portion may be polished such that a region between the plurality of concave portions 1010 includes a convex portion.

Referring to FIG. 11 , in the process of polishing the edge portion 1020 of the machined mold 1000, the edge portion 1020 formed between the first concave portion 1011 to the fourth concave portion 1014 is to be polished. can According to an embodiment, in the above process, the plurality of edge portions 1020 form a curved surface in which a region between the plurality of concave portions (eg, the first concave portion 1011 to the fourth concave portion 1014) is curved. can be polished to

According to an embodiment, in the process of polishing the edge portion 1020, the plurality of edge portions 1020 may be polished using a brush 1200. However, it is not limited to this. For example, the plurality of edge portions 1020 may be polished using a polishing process.

According to an embodiment, the process of polishing the edge portion 1020 may include a brush 1200 or a polishing process. By the brush 1200 or the polishing process, the roughness of the pattern area 1000 may be reduced or appearance defects of the pattern area 1000 may be prevented.

12 is a flowchart illustrating a method 1100 of manufacturing a housing of an electronic device according to another embodiment.

According to an embodiment, a method 1100 of manufacturing a housing of an electronic device may include a process 1103 of processing a housing member with a tool. However, it is not limited to this. The method 1100 of manufacturing a housing of an electronic device may further include at least one other process. For example, the method 1100 of manufacturing a housing of an electronic device may further include at least one process of manufacturing a tool ( 1101 ) or polishing an edge portion ( 1105 ).

The tool may be referenced by tool 300 in FIG. 3 . Process 1101 for manufacturing a tool may be referenced by process 201 for manufacturing a tool in FIG. 2 . For the same or substantially the same content as the above, redundant description will be omitted.

According to one embodiment, in the process of machining the housing member with a tool, the tool may be used to machine the housing member such that at least a portion of the housing member includes the pattern region. For example, in the above process, a tool may be used to machine the housing member such that the pattern area includes a plurality of convex portions.

According to one embodiment, the process of polishing the edge portion may include a process of polishing the edge portion formed in the pattern region of the housing member machined with a tool. According to one embodiment, in the process, the edge portion may be polished using at least one process of a brush or a polishing process. However, it is not limited to this.

According to one embodiment, the housing member may include a hard material. For example, the housing member may include at least one material of metal or glass. However, it is not limited to this. For example, the housing member may include at least one of resin and polymer materials.

According to one embodiment, the housing member may include a transparent material. However, it is not limited to this. For example, the housing member may include an opaque material.

13 and 14, an electronic device 1300 according to an embodiment includes a first side (or front side) 1310A, a second side (or back side) 1310B, and a first side 1310A and It may include a housing 1310 including a side surface 1310C surrounding a space between the second surface 1310B. In another embodiment (not shown), the housing may refer to a structure that forms part of the first face 1310A, the second face 1310B, and the side face 1310C of FIG. 13 . According to one embodiment, the first surface 1310A may be formed by a front plate 1302 (eg, a glass plate including various coating layers, or a polymer plate) that is at least partially transparent. The second side 1310B may be formed by a substantially opaque back plate 1311 . The back plate 1311 is formed, for example, of coated or tinted glass, ceramic, polymer, metal (eg, aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials. It can be. The side surface 1310C may be formed by a side bezel structure (or "side member") 1318 coupled to the front plate 1302 and the rear plate 1311 and including metal and/or polymer. In some embodiments, the back plate 1311 and the side bezel structure 1318 may be integrally formed and include the same material (eg, a metal material such as aluminum).

In the illustrated embodiment, the front plate 1302 includes two first regions 1310D curved from the first surface 1310A toward the rear plate 1311 and extending seamlessly, the front plate 1310D. 1302 on both ends of the long edge. In the illustrated embodiment (see FIG. 14 ), the rear plate 1311 includes two second regions 1310E that are curved and seamlessly extended from the second surface 1310B toward the front plate 1302 at a long edge. Can be included at both ends. In some embodiments, the front plate 1302 (or the rear plate 1311) may include only one of the first regions 1310D (or the second regions 1310E). In another embodiment, some of the first regions 1310D or the second regions 1310E may not be included. In the above embodiments, when viewed from the side of the electronic device 1300, the side bezel structure 1318 has the first and second regions 1310D and 1310E. 1 thickness (or width), and may have a second thickness thinner than the first thickness at a side surface including the first regions 1310D or the second regions 1310E.

According to an embodiment, the electronic device 1300 includes a display 1301,

audio modules

1303, 1307, and 1314,

sensor modules

1304, 1316, and 1319,

camera modules

1305, 1312, and 1313, and key input. At least one of the device 1317, the light emitting element 1306, and the connector holes 1308 and 1309 may be included. In some embodiments, the electronic device 1300 may omit at least one of the components (eg, the key input device 1317 or the light emitting device 1306) or may additionally include other components.

The display 1301 may be exposed through a substantial portion of the front plate 1302, for example. In some embodiments, at least a portion of the display 1301 may be exposed through the front plate 1302 forming the first area 1310D of the first surface 1310A and the side surface 1310C. In some embodiments, a corner of the display 1301 may be substantially identical to an adjacent outer shape of the front plate 1302 . In another embodiment (not shown), in order to expand an exposed area of the display 1301, the distance between the outer edge of the display 1301 and the outer edge of the front plate 1302 may be substantially the same.

In another embodiment (not shown), a recess or an opening is formed in a part of the screen display area of the display 1301, and the audio module 1314, the sensor aligned with the recess or the opening At least one of the module 1304 , the camera module 1305 , and the light emitting element 1306 may be included. In another embodiment (not shown), on the back of the screen display area of the display 1301, an audio module 1314, a sensor module 1304, a camera module 1305, a fingerprint sensor 1316, and a light emitting element 1306 ) may include at least one of them. In another embodiment (not shown), the display 1301 is coupled to or adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and/or a digitizer that detects a magnetic stylus pen. can be placed. In some embodiments, at least a portion of the

sensor modules

1304 and 1319 and/or at least a portion of the key input device 1317 may be located in the first regions 1310D and/or the second region 1310E. can be placed in the field.

The

audio modules

1303 , 1307 , and 1314 may include a microphone hole 1303 and

speaker holes

1307 and 1314 . A microphone for acquiring external sound may be disposed inside the microphone hole 1303, and in some embodiments, a plurality of microphones may be disposed to detect the direction of sound. The speaker holes 1307 and 1314 may include an external speaker hole 1307 and a receiver hole 1314 for communication. In some embodiments, the speaker holes 1307 and 1314 and the microphone hole 1303 may be implemented as one hole, or a speaker may be included without the speaker holes 1307 and 1314 (eg, a piezo speaker).

The

sensor modules

1304 , 1316 , and 1319 may generate electrical signals or data values corresponding to an internal operating state of the electronic device 1300 or an external environmental state. The

sensor modules

1304, 1316, and 1319 may include, for example, a first sensor module 1304 (eg, a proximity sensor) and/or a second sensor module disposed on the first surface 1310A of the housing 1310 ( (not shown) (eg, a fingerprint sensor), and/or a third sensor module 1319 (eg, an HRM sensor) and/or a fourth sensor module 1316 disposed on the second side 1310B of the housing 1310. ) (eg, a fingerprint sensor). The fingerprint sensor may be disposed on the first surface 1310A (eg, the display 1301 as well as the second surface 1310B) of the housing 1310. The electronic device 1300 may include a sensor module, eg, not shown. For example, at least one of a gesture sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a bio sensor, a temperature sensor, a humidity sensor, or an illuminance sensor 1304 may be further selected. can include

The

camera modules

1305, 1312, and 1313 include a first camera device 1305 disposed on a first surface 1310A of the electronic device 1300 and a second camera device 1312 disposed on a second surface 1310B. ), and/or flash 1313. The

camera devices

1305 and 1312 may include one or a plurality of lenses, an image sensor, and/or an image signal processor. The flash 1313 may include, for example, a light emitting diode or a xenon lamp. In some embodiments, two or more lenses (infrared camera, wide-angle and telephoto lenses) and image sensors may be disposed on one side of the electronic device 1300 .

The key input device 1317 may be disposed on the side surface 1310C of the housing 1310. In another embodiment, the electronic device 1300 may not include some or all of the above-mentioned key input devices 1317, and the key input devices 1317 that are not included may include other key input devices such as soft keys on the display 1301. can be implemented in the form In some embodiments, the key input device may include a sensor module 1316 disposed on the second side 1310B of the housing 1310.

The light emitting device 1306 may be disposed on the first surface 1310A of the housing 1310, for example. The light emitting element 1306 may provide, for example, state information of the electronic device 1300 in the form of light. In another embodiment, the light emitting device 1306 may provide, for example, a light source interlocked with the operation of the camera module 1305 . The light emitting element 1306 may include, for example, an LED, an IR LED, and a xenon lamp.

The connector holes 1308 and 1309 include a first connector hole 1308 capable of receiving a connector (eg, a USB connector) for transmitting and receiving power and/or data to and from an external electronic device, and/or an external electronic device. and a second connector hole (eg, an earphone jack) 1309 capable of accommodating a connector for transmitting and receiving an audio signal.

Referring to FIG. 15 , the electronic device 1400 includes a side bezel structure 1410, a first support member 1411 (eg, a bracket), a front plate 1420, a display 1430, and a printed circuit board 1440. , a battery 1450, a second support member 1460 (eg, a rear case), an antenna 1470, and a rear plate 1480. In some embodiments, the electronic device 1400 may omit at least one of the components (eg, the first support member 1411 or the second support member 1460) or may additionally include other components. . At least one of the components of the electronic device 1400 may be the same as or similar to at least one of the components of the electronic device 1300 of FIG. 13 or 14, and duplicate descriptions are omitted below.

The first support member 1411 may be disposed inside the electronic device 1400 and connected to the side bezel structure 1410 or integrally formed with the side bezel structure 1410 . The first support member 1411 may be formed of, for example, a metal material and/or a non-metal (eg, polymer) material. The display 1430 may be coupled to one surface of the first support member 1411 and the printed circuit board 1440 may be coupled to the other surface. A processor, memory, and/or interface may be mounted on the printed circuit board 1440 . The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor.

Memory may include, for example, volatile memory or non-volatile memory.

The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and/or an audio interface. The interface may electrically or physically connect the electronic device 1400 to an external electronic device, and may include a USB connector, an SD card/MMC connector, or an audio connector.

The battery 1450 is a device for supplying power to at least one component of the electronic device 1400, and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. . At least a portion of the battery 1450 may be disposed on a substantially coplanar surface with the printed circuit board 1440 , for example. The battery 1450 may be integrally disposed inside the electronic device 1400 or may be disposed detachably from the electronic device 1400 .

The antenna 1470 may be disposed between the back plate 1480 and the battery 1450 . The antenna 1470 may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and/or a magnetic secure transmission (MST) antenna. The antenna 1470 may, for example, perform short-range communication with an external device or wirelessly transmit/receive power required for charging. In another embodiment, an antenna structure may be formed by a part of the side bezel structure 1410 and/or the first support member 1411 or a combination thereof.

According to an embodiment, at least one housing of the aforementioned electronic device (eg, the electronic device 1300 of FIGS. 13 and 14 or the electronic device 1400 of FIG. 15 ) is the housing of the present disclosure (eg, , the housing 100 of FIG. 1).

As described above, an electronic device according to an embodiment includes a housing including a non-painted surface forming an exterior of the electronic device, and the non-painted surface has a smooth surface. and a pattern area formed of a plurality of convex portions including a surface roughness value of the pattern area may be equal to or less than a predetermined threshold value.

According to an embodiment, the pattern area may include a curved surface in which an area between the plurality of convex portions is curved.

According to one embodiment, the curvature value of the curved surface may be 0.2 or more.

According to an embodiment, in the pattern area, at least one of the plurality of convex portions may have a polygonal shape.

According to one embodiment, the pattern area may have a surface roughness value of 5.0 μm or less.

According to one embodiment, the housing may include at least one material of metal, glass, resin, or polymer.

As described above, in the method of manufacturing a housing of an electronic device according to an embodiment, while pressing at least a portion of at least one surface of a mold using a tool including at least one protrusion having a convex shape, the first protrusion processing the mold with the tool so that at least one surface of the mold forms a first pattern region formed of a plurality of concave portions including a smooth surface by linear locomotion at least once in a direction; and the processed mold The method may include a step of injecting a housing including at least a portion of a second pattern region inverted from the first pattern region.

According to an embodiment, the manufacturing method of the housing of the electronic device may further include a step of polishing an edge portion formed between the plurality of concave portions of the first pattern area.

According to an embodiment, in the process of polishing the edge part, the edge part may be polished using at least one process of a brush or a polishing process.

According to an embodiment, the process of machining the mold with the tool is linear at least once in a second direction different from the first direction while the at least one protrusion of the tool presses at least a portion of at least one surface of the mold. A moving process may be further included.

According to an embodiment, in the process of machining the mold with the tool, the at least one protrusion of the tool presses at least a portion of at least one surface of the mold in a third direction different from the first direction and the second direction. It may further include a process of linear movement at least once.

According to an embodiment, in a process of processing the mold with the tool, the at least one protrusion of the tool may linearly move without rotation to process the mold.

According to an embodiment, the first pattern area may include a curved surface in which an area between the plurality of concave portions is curved.

According to an embodiment, the curvature value of the curved surface may be 0.2 or more.

According to an embodiment, in the first pattern area, a curvature value of the plurality of concave portions may be 0.2 or more.

According to an embodiment, in the first pattern area, at least one of the plurality of concave portions may have a polygonal shape.

According to an embodiment, the housing may include an unpainted surface forming an exterior of the electronic device, and the unpainted surface may include the second pattern area formed of a plurality of convex portions including a smooth surface.

According to an embodiment, a surface roughness value of at least one of the first pattern area and the second pattern area may be 5.0 μm or less.

Claims

In electronic devices,

A housing including a non-painted surface forming an appearance of the electronic device;

The uncoated surface includes a pattern area formed of a plurality of convex portions including a smooth surface,

The pattern area has a surface roughness value below a certain threshold value,

electronic device.
The method of claim 1,

The pattern area includes a curved surface in which a region between the plurality of convex portions is formed to be curved.

electronic device.
The method of claim 2,

The curvature value of the curved surface is 0.2 or more,

electronic device.
The method of claim 1,

In the pattern area, at least one of the plurality of convex portions includes a polygonal shape,

electronic device.
The method of claim 1,

In the pattern area, the curvature value of the plurality of convex portions is 0.2 or more,

electronic device.
The method of claim 1,

The surface roughness value of the pattern area is 5.0 μm or less,

electronic device.
The method of claim 1,

The housing includes at least one material of metal, glass, resin or polymer material,

electronic device.
A method for manufacturing a housing of an electronic device,

Using a tool including at least one protrusion having a convex shape, the at least one protrusion presses at least a portion of at least one surface of the mold and performs linear locomotion at least once in a first direction, so that at least one surface of the mold is pressed. processing the mold with the tool to form a first pattern region formed of a plurality of concave portions including the smooth surface; and

Including a step of injecting a housing including a second pattern region inverted to the first pattern region at least in part with the machined mold,

A method for manufacturing a housing of an electronic device.
The method of claim 8,

Further comprising a step of polishing an edge portion formed between the plurality of concave portions of the first pattern area.

A method for manufacturing a housing of an electronic device.
The method of claim 8,

The process of processing the mold with the tool,

Further comprising the step of linearly moving the at least one protrusion of the tool at least once in a second direction different from the first direction while pressing at least a portion of at least one surface of the mold,

A method for manufacturing a housing of an electronic device.
The method of claim 10,

The process of processing the mold with the tool,

Further comprising the step of linearly moving the at least one protrusion of the tool at least once in a third direction different from the first direction and the second direction while pressing at least a part of at least one surface of the mold,

A method for manufacturing a housing of an electronic device.
The method of claim 8,

In the process of processing the mold with the tool, the at least one protrusion of the tool moves linearly without rotation to process the mold.

A method for manufacturing a housing of an electronic device.
The method of claim 8,

The first pattern region includes a curved surface in which a region between the plurality of concave portions is formed to be curved.

A method for manufacturing a housing of an electronic device.
The method of claim 8,

In the first pattern area, at least one of the plurality of concave portions has a polygonal shape,

A method for manufacturing a housing of an electronic device.
The method of claim 8,

The housing includes an unpainted surface forming an exterior of the electronic device,

The unpainted surface includes the second pattern area formed of a plurality of convex portions including a smooth surface,

A method for manufacturing a housing of an electronic device.