WO2023068428A1 - Metal pcb assembly apparatus for automobile headlamps - Google Patents
Metal pcb assembly apparatus for automobile headlamps Download PDFInfo
- Publication number
- WO2023068428A1 WO2023068428A1 PCT/KR2021/015961 KR2021015961W WO2023068428A1 WO 2023068428 A1 WO2023068428 A1 WO 2023068428A1 KR 2021015961 W KR2021015961 W KR 2021015961W WO 2023068428 A1 WO2023068428 A1 WO 2023068428A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- metal pcb
- unit
- module
- cutting groove
- metal
- Prior art date
Links
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 104
- 239000002184 metal Substances 0.000 title claims abstract description 104
- 238000005520 cutting process Methods 0.000 claims abstract description 56
- 230000008878 coupling Effects 0.000 claims abstract description 32
- 238000010168 coupling process Methods 0.000 claims abstract description 32
- 238000005859 coupling reaction Methods 0.000 claims abstract description 32
- 239000000758 substrate Substances 0.000 claims abstract description 26
- 238000012545 processing Methods 0.000 claims abstract description 15
- 101001045744 Sus scrofa Hepatocyte nuclear factor 1-beta Proteins 0.000 claims abstract 2
- 238000012546 transfer Methods 0.000 claims description 5
- 238000000034 method Methods 0.000 abstract description 4
- 230000032258 transport Effects 0.000 abstract 2
- IYZWUWBAFUBNCH-UHFFFAOYSA-N 2,6-dichlorobiphenyl Chemical compound ClC1=CC=CC(Cl)=C1C1=CC=CC=C1 IYZWUWBAFUBNCH-UHFFFAOYSA-N 0.000 description 21
- 230000000694 effects Effects 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 238000007792 addition Methods 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000003745 diagnosis Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
- F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
- F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
- F21S41/141—Light emitting diodes [LED]
- F21S41/155—Surface emitters, e.g. organic light emitting diodes [OLED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
- H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10128—Display
Definitions
- the present invention relates to an apparatus for assembling a lighting substrate such as a headlamp used in a vehicle, and more particularly, to mount an OLED module on a metal PCB, and to combine lamp module structures by processing cutting grooves on the metal PCB. And it relates to a metal PCB assembly device for an automobile headlamp that is easily deformable.
- PCB printed circuit board
- PCB Photo Solder Resist
- Korea Patent Registration No. 10-1435451 a prior art, discloses a method for manufacturing a metal printed circuit board, but the metal printed circuit board presented in the prior art simply serves as a light guide plate at the same time. As such, it has a disadvantage that it cannot be easily applied to polyhedral and multidirectional structures.
- the present invention has been made to solve the problems of the prior art as described above, and by forming a cutting groove in a metal PCB and combining it with a flexible printed circuit board (FPCB), the bent multi-sided shape and double-sided shape Its purpose is to provide a metal PCB assembly device for automobile headlamps that can be manufactured and can improve the degree of design freedom.
- FPCB flexible printed circuit board
- an object of the present invention is to provide a metal PCB assembly device for an automobile headlamp capable of improving color clarity and luminous efficiency by mounting an OLED module on a metal PCB.
- An apparatus for assembling a metal PCB for an automobile headlamp includes a substrate transfer unit for disposing and fixing a metal PCB at a predetermined first position, and step cutting processing for processing at least one cutting groove on the metal PCB disposed at the first position.
- Module position determining unit module mounting unit for mounting the OLED module at the mounting position determined by the module position determining unit, FPCB coupling unit for coupling the flexible printed circuit board to one end of the metal PCB equipped with the OLDE module, and combined with the flexible printed circuit board and a substrate coupling unit that transfers the metal PCB to a predetermined second position and couples the metal PCB to a backplate disposed at the second position.
- the step cutting processing part leaves only a part of the total thickness of the metal PCB and cuts it to a predetermined depth to form a cutting groove. It is characterized in that it is formed in the form of at least one of the U-shaped cutting grooves to be maintained.
- the module position determination unit recognizes the zero mark formed on the metal PCB to determine the position where the OLED module is mounted, and analyzes the image taken by the substrate photographing unit to determine at least one position within a predetermined range from the position where the OLED module is mounted. It is determined whether there is a cutting groove, and if there is at least one cutting groove within a predetermined range, the location of the cutting groove is reflected on the recognized zero mark to determine whether or not there is at least one cutting groove within a predetermined range at the position where the OLED module is mounted. It is characterized by calculating the corrected second zero point where the cutting groove does not exist.
- the substrate coupling part couples the metal PCB to the back plate disposed in the second position
- the mounting surface of the back plate to which the metal PCB is coupled is provided in the form of a multi-faceted surface having respective inclinations, and the bent portion of the mounting surface and It is characterized in that the metal PCB is bent on the back plate by pressing the metal PCB in a state in which the positions of the cutting grooves formed in the metal PCB are matched, and then coupled to the back plate.
- the board coupling unit couples the metal PCB to the upper surface of the back plate, then couples another metal PCB corresponding to the lower mounting surface, and It is characterized in that it includes a double-sided board coupling part for coupling the other end of the flexible printed circuit board to which one end is coupled and one end of the other metal PCB.
- the metal PCB assembly device for automobile headlamps forms a cutting groove in the metal PCB and combines it with a flexible printed circuit board (FPCB), thereby having an effect of being able to produce a bent multi-sided shape and a double-sided shape. .
- FPCB flexible printed circuit board
- FIG. 1 is a block diagram of a metal PCB assembly device for a vehicle headlamp according to an embodiment of the present invention.
- FIG. 2 is a view for explaining a step cutting processing unit of a metal PCB assembly device for a vehicle headlamp according to an embodiment of the present invention.
- FIG 3 is a view for explaining a substrate coupling part of a metal PCB assembly apparatus for a vehicle headlamp according to an embodiment of the present invention.
- FIG. 4 is a view for explaining a double-sided substrate coupling part of an apparatus for assembling a metal PCB for an automobile headlamp according to an embodiment of the present invention.
- first, second and third are used to describe, but are not limited to, various parts, components, regions, layers and/or sections. These terms are only used to distinguish one part, component, region, layer or section from another part, component, region, layer or section. Accordingly, a first part, component, region, layer or section described below may be referred to as a second part, component, region, layer or section without departing from the scope of the present invention.
- the device may rotate 90 degrees or other angles, and terms denoting relative space are interpreted accordingly.
- FIG. 1 is a block diagram of a metal PCB assembling device for a car headlamp according to an embodiment of the present invention
- FIG. 2 is a step cutting section of the metal PCB assembly device for a car headlamp according to an embodiment of the present invention
- FIG. 3 is a view for explaining a substrate coupling part of a metal PCB assembly device for a car headlamp according to an embodiment of the present invention
- FIG. 4 is a metal PCB for a car headlamp according to an embodiment of the present invention. It is a drawing for explaining the double-sided board coupling part of the assembling device.
- an apparatus 100 for assembling a metal PCB for an automobile headlamp includes a substrate transfer unit 110 for disposing and fixing the metal PCB 10 at a predetermined first position, the first A stepped cutting processing unit 120 for processing at least one cutting groove on the metal PCB 10 disposed at 1 position, a state in which the metal PCB 10 is disposed at the first position and on the metal PCB 10 Module position for determining the mounting position of the OLED module 20 based on the state of the metal PCB 10 photographed by the substrate photographing unit 130 for photographing the position of the cutting groove formed in the substrate photographing unit 130
- the FPCB coupling part 160 for coupling the flexible printed circuit board 30 to and the metal PCB 10 coupled to the flexible printed circuit board 30 are transferred to a second predetermined position, and the second
- the step cutting processing unit 120 cuts only a portion of the total thickness of the metal PCB 10 to a predetermined depth to form the cutting groove, but the cutting groove is It may be formed in the form of at least one of a cone-shaped V-shaped cutting groove 210, the width of which narrows toward the bottom, and a U-shaped cutting groove 220 maintaining the same width toward the bottom.
- the stepped cutting processing unit 120 processes the metal PCB 10 in addition to the first blade forming the V-shaped cutting groove 210 and the second blade forming the U-shaped cutting groove 220
- the cutting groove can be formed using a blade that can be used.
- the module location determiner 140 may determine a location where the OLED module 20 is mounted by recognizing a zero mark formed on the metal PCB 10 .
- At least one cutting groove exists within a predetermined range at the position where the OLED module 20 is mounted, and if at least one cutting groove exists within the predetermined range, cutting is performed at the recognized zero mark.
- a corrected second zero point in which at least one cutting groove does not exist within a predetermined range at a position where the OLED module 20 is mounted can be calculated by reflecting the position of the groove.
- the board photographing unit 130 may determine whether or not the processing of the step is defective by analyzing an image of a processed state of the cutting groove.
- the board coupling part 170 couples the metal PCB 10 to the back plate 40 disposed at the second position, and the back plate to which the metal PCB 10 is coupled.
- the mounting surface of the plate 40 may be provided in the form of multi-faceted surfaces having respective inclinations.
- the metal PCB 10 is pressed onto the back plate 40 in a state in which the bent portion of the mounting surface and the cutting groove formed in the metal PCB 10 are aligned, so that the metal PCB 10 can be processed into a bent shape.
- the metal PCB 10 and the back plate 40 may be coupled so that the metal PCB 10 may stably maintain a bent shape.
- the substrate coupling part 170 attaches the metal PCB to the upper surface of the back plate 40 .
- the substrate coupling part 170 attaches the metal PCB to the upper surface of the back plate 40 .
- another metal PCB (10b) corresponding to the lower mounting surface is coupled, and the other end of the flexible printed circuit board (FPCB) 30 having one end coupled to the metal PCB (10a) and the other metal PCB (10b) )
- FPCB flexible printed circuit board
- the metal PCB assembly plant for automobile headlamps can be manufactured in a bent multi-sided shape and double-sided shape by forming a cutting groove in the metal PCB and combining it with a flexible printed circuit board (FPCB). Accordingly, a metal PCB assembly device for an automobile headlamp capable of improving design freedom may be provided.
- a metal PCB assembly device for an automobile headlamp capable of improving color clarity and luminous efficiency can be provided.
- control method of an apparatus for assembling an OLED module for a vehicle headlamp may be recorded in a computer readable medium including program instructions for performing various computer-implemented operations.
- the computer readable medium may include program instructions, data files, data structures, etc. alone or in combination.
- the medium may include program instructions specially designed and configured for the present invention, or may be known and usable to those skilled in computer software.
- Examples of computer-readable recording media include magnetic media such as hard disks, floppy disks and magnetic tapes, optical media such as CD-ROMs and DVDs, and magnetic media such as floptical disks.
- - includes hardware devices specially configured to store and execute program instructions, such as magneto-optical media, and ROM, RAM, flash memory, and the like.
- Examples of program instructions include high-level language codes that can be executed by a computer using an interpreter, as well as machine language codes such as those produced by a compiler.
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Manufacturing & Machinery (AREA)
- General Engineering & Computer Science (AREA)
- Operations Research (AREA)
- Lighting Device Outwards From Vehicle And Optical Signal (AREA)
Abstract
Disclosed is a PCB assembly apparatus for automobile headlamps. A metal PCB assembly apparatus for automobile headlamps, according to an embodiment of the present invention, comprises: a substrate transport unit which places and fixes a metal PCB at a preset first position; a step difference cutting processing unit which processes at least one cutting groove on the metal PCB arranged at the first position; a substrate photographing unit which photographs a state in which the metal PCB is arranged at the first position and a position of the cutting groove formed on the metal PCB; a module position determining unit which determines a mounting position of an OLED module on the basis of the state of the metal PCB photographed by the substrate photographing unit; a module mounting unit which mounts the OLED module at the mounting position determined by the module position determining unit; an FPCB coupling unit which couples a flexible printed circuit board to both ends of the metal PCB on which the OLED module is mounted; and a substrate coupling unit which transports the metal PCB coupled to the flexible printed circuit board, to a preset second position, and couples the metal PCB to a back plate arranged at the second position.
Description
본 발명은 자동차에 사용되는 헤드램프 등의 조명 기판을 조립하는 장치에 관한 것으로, 보다 상세하게는 메탈피비시에 OLED 모듈을 실장하되, 메탈피비시 상에 컷팅홈을 가공하여 램프모듈 구조의 결합 및 변형이 용이한 자동차 헤드램프용 메탈피시비 조립 장치에 관한 것이다. The present invention relates to an apparatus for assembling a lighting substrate such as a headlamp used in a vehicle, and more particularly, to mount an OLED module on a metal PCB, and to combine lamp module structures by processing cutting grooves on the metal PCB. And it relates to a metal PCB assembly device for an automobile headlamp that is easily deformable.
인쇄회로기판(Printed Circuit Board : PCB)은 전자부품을 탑재하여 부품간 또는 신호선 간을 전기적으로 접속해 주는 배선기판을 말한다.A printed circuit board (PCB) refers to a wiring board on which electronic components are mounted and electrically connected between components or between signal lines.
그리고 상기 PCB는 페놀수지 및 에폭시 수지 등의 절연판 한쪽 면 또는 양쪽 면에 동박(Cooper foil)을 압착시킨 후에 회로에 다른 도전 패턴을 형성하고, 불필요한 부분은 부식시켜 동박을 제거하여 회로를 구성하고, 이러한 PCB 전자부품을 연결하기 위한 구멍(Via)를 뚫어 도금을 하고, 윗면과 아랫면을 Photo Solder Resist(PSR) 잉크로 도포함으로써 PCB가 완성된다.In the PCB, another conductive pattern is formed on the circuit after pressing copper foil on one or both sides of an insulating plate such as phenolic resin or epoxy resin, and corroding unnecessary parts to form a circuit by removing the copper foil, The PCB is completed by plating vias to connect these PCB electronic components, and coating the upper and lower surfaces with Photo Solder Resist (PSR) ink.
최근 발광다이오드(LED)뿐 아니라 다양한 부품에 사용되는 PCB가 방열 효과가 낮다는 지적이 제기되자, 이를 해결하기 위해 알루미늄이나 동합금 등의 메탈 소재를 채용한 메탈 인쇄회로기판이 시장에 각광받고 있다.Recently, as it has been pointed out that the heat dissipation effect of PCBs used in various components as well as LEDs has been low, metal printed circuit boards using metal materials such as aluminum or copper alloys are attracting attention in the market to solve this problem.
이러한 기술과 관련되어 종래기술인 한국등록특허공보 제10-1435451호에서는 메탈 인쇄회로기판의 제조방법에 대하여 개시하고 있으나, 종래기술에서 제시하는 메탈 인쇄회로기판은 단순히 도광판의 역할을 동시에 수행토록 하는 구성으로 다면체 및 다방향의 구조물에 용이하게 적용할 수 없다는 단점이 있다.Regarding this technology, Korea Patent Registration No. 10-1435451, a prior art, discloses a method for manufacturing a metal printed circuit board, but the metal printed circuit board presented in the prior art simply serves as a light guide plate at the same time. As such, it has a disadvantage that it cannot be easily applied to polyhedral and multidirectional structures.
따라서, 메탈 인쇄회로기판의 방열 효과를 극대화하면서 다면체 및 다방향 구조물에 적용이 용이한 자동차 헤드램프용 메탈피시비 조립 장치에 관한 연구가 필요하다.Therefore, it is necessary to study a metal PCB assembly device for automobile headlamps that can be easily applied to polyhedral and multidirectional structures while maximizing the heat dissipation effect of the metal printed circuit board.
본 발명은 상술한 바와 같은 종래 기술의 문제점을 해결하기 위하여 안출된 것으로, 메탈피시비에 컷팅홈을 형성하고 연성인쇄회로기판(Flexible Printed Circuit Board : FPCB)과 결합함으로써 절곡된 다면 형상 및 양면 형상으로 제작할 수 있어 설계 자유도를 향상시킬 수 있는 자동차 헤드램프용 메탈피시비 조립 장치를 제공하는 데 그 목적이 있다.The present invention has been made to solve the problems of the prior art as described above, and by forming a cutting groove in a metal PCB and combining it with a flexible printed circuit board (FPCB), the bent multi-sided shape and double-sided shape Its purpose is to provide a metal PCB assembly device for automobile headlamps that can be manufactured and can improve the degree of design freedom.
또한, 메탈피시비 상에 OLED 모듈을 장착함으로써, 색 선명도 및 발광 효율을 향상시킬 수 있는 자동차 헤드램프용 메탈피시비 조립 장치를 제공하는 데 그 목적이 있다.In addition, an object of the present invention is to provide a metal PCB assembly device for an automobile headlamp capable of improving color clarity and luminous efficiency by mounting an OLED module on a metal PCB.
본 발명이 해결하고자 하는 과제들은 이상에서 언급한 과제로 제한되지 않으며, 여기에 언급되지 않은 본 발명이 해결하려는 또 다른 과제들은 아래의 기재로부터 본 발명이 속하는 기술 분야에서 통상의 지식을 가진 자에게 명확하게 이해될 수 있을 것이다. The problems to be solved by the present invention are not limited to the problems mentioned above, and other problems to be solved by the present invention that are not mentioned here are to those of ordinary skill in the art to which the present invention belongs from the description below. will be clearly understood.
본 발명에 따른 자동차 헤드램프용 메탈피시비 조립 장치는 메탈피시비를 기설정된 제1 위치에 배치하고 고정시키는 기판 이송부, 제1 위치에 배치된 메탈피시비 상에 적어도 하나의 컷팅홈을 가공하는 단차 컷팅 가공부, 메탈피시비가 제1 위치에 배치된 상태 및 메탈피시비 상에 형성된 컷팅홈의 위치를 촬영하는 기판 촬영부, 기판 촬영부에서 촬영된 메탈피시비의 상태에 기초하여 OLED 모듈의 실장 위치를 결정하는 모듈위치 결정부, 모듈위치 결정부에서 결정된 실장 위치에 OLED 모듈을 장착시키는 모듈 장착부, OLDE 모듈이 장착된 메탈피시비의 일단에 연성인쇄회로기판을 결합시키는 FPCB 결합부 및 연성인쇄회로기판과 결합된 메탈피비시를 기설정된 제2 위치로 이송하고, 제2 위치에 배치된 백플레이트에 메탈피시비를 결합시키는 기판 결합부를 포함한다.An apparatus for assembling a metal PCB for an automobile headlamp according to the present invention includes a substrate transfer unit for disposing and fixing a metal PCB at a predetermined first position, and step cutting processing for processing at least one cutting groove on the metal PCB disposed at the first position. A board photographing unit for photographing the state in which the metal PCB is disposed at the first position and the position of the cutting groove formed on the metal PCB, and a substrate photographing unit for determining the mounting position of the OLED module based on the state of the metal PCB photographed by the substrate photographing unit. Module position determining unit, module mounting unit for mounting the OLED module at the mounting position determined by the module position determining unit, FPCB coupling unit for coupling the flexible printed circuit board to one end of the metal PCB equipped with the OLDE module, and combined with the flexible printed circuit board and a substrate coupling unit that transfers the metal PCB to a predetermined second position and couples the metal PCB to a backplate disposed at the second position.
또한, 단차 컷팅 가공부는 메탈피시비의 전체 두께 중 일부만 남기고 기설정된 깊이만큼 컷팅하여 컷팅홈을 형성하되, 컷팅홈은 하부로 갈수록 폭이 좁아지는 콘 형상의 V자 컷팅홈 및 하부로 갈수록 동일한 폭을 유지하는 U자 컷팅홈 중 적어도 어느 하나의 형태로 형성되는 것을 특징으로 한다.In addition, the step cutting processing part leaves only a part of the total thickness of the metal PCB and cuts it to a predetermined depth to form a cutting groove. It is characterized in that it is formed in the form of at least one of the U-shaped cutting grooves to be maintained.
또한, 모듈위치 결정부는 메탈피시비 상에 형성된 영점 마크를 인식하여 OLED 모듈이 실장되는 위치를 결정하되, 기판 촬영부에 촬영된 이미지를 분석하여 OLED 모듈이 실장되는 위치에서 기지정된 범위 내에 적어도 하나의 컷팅홈이 존재하는지 여부를 판단하고, 기지정된 범위 내에 적어도 하나의 컷팅홈이 존재하는 경우, 인식된 영점 마크에 컷팅홈의 위치를 반영하여 OLED 모듈이 실장되는 위치에서 기지정된 범위 내에 적어도 하나의 컷팅홈이 존재하지 않는 보정된 제2 영점을 산출하는 것을 특징으로 한다. In addition, the module position determination unit recognizes the zero mark formed on the metal PCB to determine the position where the OLED module is mounted, and analyzes the image taken by the substrate photographing unit to determine at least one position within a predetermined range from the position where the OLED module is mounted. It is determined whether there is a cutting groove, and if there is at least one cutting groove within a predetermined range, the location of the cutting groove is reflected on the recognized zero mark to determine whether or not there is at least one cutting groove within a predetermined range at the position where the OLED module is mounted. It is characterized by calculating the corrected second zero point where the cutting groove does not exist.
또한, 기판 결합부는 메탈피시비를 제2 위치에 배치된 백플레이트와 결합시키되, 메탈피시비가 결합되는 백플레이트의 장착면은 각각의 경사를 갖는 다면으로 이루어진 형태로 마련되고, 장착면의 절곡부위와 메탈피시비에 형성된 컷팅홈의 위치를 일치시킨 상태에서 메탈피시비를 백플레이트 상에 가압하여 메탈피시비를 절곡시킨 후 백플레이트에 결합시키는 것을 특징으로 하는 한다.In addition, the substrate coupling part couples the metal PCB to the back plate disposed in the second position, and the mounting surface of the back plate to which the metal PCB is coupled is provided in the form of a multi-faceted surface having respective inclinations, and the bent portion of the mounting surface and It is characterized in that the metal PCB is bent on the back plate by pressing the metal PCB in a state in which the positions of the cutting grooves formed in the metal PCB are matched, and then coupled to the back plate.
또한, 기판 결합부는 백플레이트의 장착면이 상부 장착면과 하부 장착면을 포함하는 경우, 백플레이트의 상면에 메탈피시비를 결합시킨 후 하부 장착면에 대응되는 타 메탈피시비를 결합시키고, 메탈피시비와 일단이 결합된 연성회로기판의 타단과 타 메탈피시비의 일단을 결합시키는 양면기판 결합부를 포함하는 것을 특징으로 한다.In addition, when the mounting surface of the back plate includes an upper mounting surface and a lower mounting surface, the board coupling unit couples the metal PCB to the upper surface of the back plate, then couples another metal PCB corresponding to the lower mounting surface, and It is characterized in that it includes a double-sided board coupling part for coupling the other end of the flexible printed circuit board to which one end is coupled and one end of the other metal PCB.
본 발명에 따른 자동차 헤드램프용 메탈피시비 조립 장치는 메탈피시비에 컷팅홈을 형성하고 연성인쇄회로기판(Flexible Printed Circuit Board : FPCB)과 결합함으로써 절곡된 다면 형상 및 양면 형상으로 제작할 수 있는 효과를 가진다. The metal PCB assembly device for automobile headlamps according to the present invention forms a cutting groove in the metal PCB and combines it with a flexible printed circuit board (FPCB), thereby having an effect of being able to produce a bent multi-sided shape and a double-sided shape. .
또한, 메탈피시비 상에 OLED 모듈을 장착함으로써, 색 선명도 및 발광 효율을 향상시킬 수 있는 효과가 있다. In addition, by mounting the OLED module on the metal PCB, there is an effect of improving color sharpness and luminous efficiency.
도 1은 본 발명의 일실시례에 따른 자동차 헤드램프용 메탈피시비 조립 장치의 구성도이다.1 is a block diagram of a metal PCB assembly device for a vehicle headlamp according to an embodiment of the present invention.
도 2는 본 발명의 일실시례에 따른 자동차 헤드램프용 메탈피시비 조립 장치의 단차 컷팅 가공부를 설명하기 위한 도면이다.2 is a view for explaining a step cutting processing unit of a metal PCB assembly device for a vehicle headlamp according to an embodiment of the present invention.
도 3은 본 발명의 일실시례에 따른 자동차 헤드램프용 메탈피시비 조립 장치의 기판 결합부를 설명하기 위한 도면이다.3 is a view for explaining a substrate coupling part of a metal PCB assembly apparatus for a vehicle headlamp according to an embodiment of the present invention.
도 4는 본 발명의 일실시례에 따른 자동차 헤드램프용 메탈피시비 조립 장치의 양면기판 결합부를 설명하기 위한 도면이다.4 is a view for explaining a double-sided substrate coupling part of an apparatus for assembling a metal PCB for an automobile headlamp according to an embodiment of the present invention.
이하, 첨부한 도면을 참고로 하여 본 발명의 실시례에 대하여 본 발명이 속하는 기술 분야에서 통상의 지식을 가진 자가 용이하게 실시할 수 있도록 상세히 설명한다. 본 발명은 여러 가지 상이한 형태로 구현될 수 있으며 여기에서 설명하는 실시 예에 한정되지 않는다.Hereinafter, with reference to the accompanying drawings, embodiments of the present invention will be described in detail so that those skilled in the art can easily carry out the present invention. The present invention may be embodied in many different forms and is not limited to the embodiments described herein.
본 발명을 명확하게 설명하기 위해서 설명과 관계없는 부분은 생략하였으며, 명세서 전체를 통하여 동일 또는 유사한 구성요소에 대해서는 동일한 참조 부호를 붙이도록 한다.In order to clearly describe the present invention, parts irrelevant to the description are omitted, and the same reference numerals are assigned to the same or similar components throughout the specification.
명세서 전체에서, 어떤 부분이 다른 부분과 "연결"되어 있다고 할 때, 이는 "직접적으로 연결"되어 있는 경우뿐 아니라, 그 중간에 다른 소자를 사이에 두고 "전기적으로 연결"되어 있는 경우도 포함한다. 또한 어떤 부분이 어떤 구성요소를 "포함"한다고 할 때, 이는 특별히 반대되는 기재가 없는 한 다른 구성요소를 제외하는 것이 아니라 다른 구성요소를 더 포함할 수 있는 것을 의미한다.Throughout the specification, when a part is said to be "connected" to another part, this includes not only the case where it is "directly connected" but also the case where it is "electrically connected" with another element interposed therebetween. . In addition, when a certain component is said to "include", this means that it may further include other components without excluding other components unless otherwise stated.
어느 부분이 다른 부분의 "위에" 있다고 언급하는 경우, 이는 바로 다른 부분의 위에 있을 수 있거나 그 사이에 다른 부분이 수반될 수 있다. 대조적으로 어느 부분이 다른 부분의 "바로 위에" 있다고 언급하는 경우, 그 사이에 다른 부분이 수반되지 않는다.When a part is referred to as being “on” another part, it may be directly on top of the other part or may have other parts in between. In contrast, when a part is said to be “directly on” another part, there are no other parts in between.
제1, 제2 및 제3 등의 용어들은 다양한 부분, 성분, 영역, 층 및/또는 섹션들을 설명하기 위해 사용되나 이들에 한정되지 않는다. 이들 용어들은 어느 부분, 성분, 영역, 층 또는 섹션을 다른 부분, 성분, 영역, 층 또는 섹션과 구별하기 위해서만 사용된다. 따라서, 이하에서 서술하는 제1 부분, 성분, 영역, 층 또는 섹션은 본 발명의 범위를 벗어나지 않는 범위 내에서 제2 부분, 성분, 영역, 층 또는 섹션으로 언급될 수 있다.Terms such as first, second and third are used to describe, but are not limited to, various parts, components, regions, layers and/or sections. These terms are only used to distinguish one part, component, region, layer or section from another part, component, region, layer or section. Accordingly, a first part, component, region, layer or section described below may be referred to as a second part, component, region, layer or section without departing from the scope of the present invention.
여기서 사용되는 전문 용어는 단지 특정 실시례를 언급하기 위한 것이며, 본 발명을 한정하는 것을 의도하지 않는다. 여기서 사용되는 단수 형태들은 문구들이 이와 명백히 반대의 의미를 나타내지 않는 한 복수 형태들도 포함한다.The terminology used herein is only for referring to specific embodiments and is not intended to limit the present invention. As used herein, the singular forms also include the plural forms unless the phrases clearly indicate the opposite.
명세서에서 사용되는 "포함하는"의 의미는 특정 특성, 영역, 정수, 단계, 동작, 요소 및/또는 성분을 구체화하며, 다른 특성, 영역, 정수, 단계, 동작, 요소 및/또는 성분의 존재나 부가를 제외시키는 것은 아니다.The meaning of "comprising" as used herein specifies particular characteristics, regions, integers, steps, operations, elements and/or components, and the presence or absence of other characteristics, regions, integers, steps, operations, elements and/or components. Additions are not excluded.
"아래", "위" 등의 상대적인 공간을 나타내는 용어는 도면에서 도시된 한 부분의 다른 부분에 대한 관계를 보다 쉽게 설명하기 위해 사용될 수 있다. Terms indicating relative space, such as “below” and “above,” may be used to more easily describe the relationship of one part to another shown in the drawings.
이러한 용어들은 도면에서 의도한 의미와 함께 사용 중인 장치의 다른 의미나 동작을 포함하도록 의도된다. 예를 들면, 도면 중의 장치를 뒤집으면, 다른 부분들의 "아래"에 있는 것으로 설명된 어느 부분들은 다른 부분들의 "위"에 있는 것으로 설명된다. 따라서 "아래"라는 예시적인 용어는 위와 아래 방향을 전부 포함한다.These terms are intended to include other meanings or operations of the device in use with the meaning intended in the drawings. For example, if the device in the figures is turned over, certain parts described as being “below” other parts will be described as being “above” the other parts. Thus, the exemplary term "below" includes both directions above and below.
장치는 90˚ 회전 또는 다른 각도로 회전할 수 있고, 상대적인 공간을 나타내는 용어도 이에 따라서 해석된다.The device may rotate 90 degrees or other angles, and terms denoting relative space are interpreted accordingly.
다르게 정의하지는 않았지만, 여기에 사용되는 기술용어 및 과학용어를 포함하는 모든 용어들은 본 발명이 속하는 기술분야에서 통상의 지식을 가진 자가 일반적으로 이해하는 의미와 동일한 의미를 가진다. 보통 사용되는 사전에 정의된 용어들은 관련 기술문헌과 현재 개시된 내용에 부합하는 의미를 가지는 것으로 추가 해석되고, 정의되지 않는 한 이상적이거나 매우 공식적인 의미로 해석되지 않는다.Although not defined differently, all terms including technical terms and scientific terms used herein have the same meaning as commonly understood by those of ordinary skill in the art to which the present invention belongs. Terms defined in commonly used dictionaries are additionally interpreted as having meanings consistent with related technical literature and currently disclosed content, and are not interpreted in ideal or very formal meanings unless defined.
이하에서, 본 발명의 실시례에 대하여 첨부한 도면을 참조하여 상세히 설명한다.Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
도 1은 본 발명의 일실시례에 따른 자동차 헤드램프용 메탈피시비 조립 장치의 구성도이고, 도 2는 본 발명의 일실시례에 따른 자동차 헤드램프용 메탈피시비 조립 장치의 단차 컷팅 가공부를 설명하기 위한 도면이고, 도 3은 본 발명의 일실시례에 따른 자동차 헤드램프용 메탈피시비 조립 장치의 기판 결합부를 설명하기 위한 도면이고, 도 4는 본 발명의 일실시례에 따른 자동차 헤드램프용 메탈피시비 조립 장치의 양면기판 결합부를 설명하기 위한 도면이다. 1 is a block diagram of a metal PCB assembling device for a car headlamp according to an embodiment of the present invention, and FIG. 2 is a step cutting section of the metal PCB assembly device for a car headlamp according to an embodiment of the present invention. FIG. 3 is a view for explaining a substrate coupling part of a metal PCB assembly device for a car headlamp according to an embodiment of the present invention, and FIG. 4 is a metal PCB for a car headlamp according to an embodiment of the present invention. It is a drawing for explaining the double-sided board coupling part of the assembling device.
도 1을 참고하면, 본 발명의 일실시례에 따른 자동차 헤드램프용 메탈피시비 조립 장치(100)는 메탈피시비(10)를 기설정된 제1 위치에 배치하고 고정시키는 기판 이송부(110), 상기 제1 위치에 배치된 메탈피시비(10) 상에 적어도 하나의 컷팅홈을 가공하는 단차 컷팅 가공부(120), 상기 메탈피시비(10)가 제1 위치에 배치된 상태 및 상기 메탈피시비(10) 상에 형성된 컷팅홈의 위치를 촬영하는 기판 촬영부(130), 상기 기판 촬영부(130)에서 촬영된 상기 메탈피시비(10)의 상태에 기초하여 OLED 모듈(20)의 실장 위치를 결정하는 모듈위치 결정부(140), 상기 모듈위치 결정부(140)에서 결정된 실장 위치에 상기 OLED 모듈(20)을 장착시키는 모듈 장착부(150), 상기 OLDE 모듈(20)이 장착된 메탈피시비(10)의 일단에 연성인쇄회로기판(30)을 결합시키는 FPCB 결합부(160) 및 상기 연성인쇄회로기판(30)과 결합된 상기 메탈피비시(10)를 기설정된 제2 위치로 이송하고, 상기 제2 위치에 배치된 백플레이트(40)에 상기 메탈피시비(10)를 결합시키는 기판 결합부(170)를 포함할 수 있다.Referring to FIG. 1 , an apparatus 100 for assembling a metal PCB for an automobile headlamp according to an embodiment of the present invention includes a substrate transfer unit 110 for disposing and fixing the metal PCB 10 at a predetermined first position, the first A stepped cutting processing unit 120 for processing at least one cutting groove on the metal PCB 10 disposed at 1 position, a state in which the metal PCB 10 is disposed at the first position and on the metal PCB 10 Module position for determining the mounting position of the OLED module 20 based on the state of the metal PCB 10 photographed by the substrate photographing unit 130 for photographing the position of the cutting groove formed in the substrate photographing unit 130 The determining unit 140, the module mounting unit 150 for mounting the OLED module 20 to the mounting position determined by the module location determining unit 140, and one end of the metal PCB 10 to which the OLDE module 20 is mounted The FPCB coupling part 160 for coupling the flexible printed circuit board 30 to and the metal PCB 10 coupled to the flexible printed circuit board 30 are transferred to a second predetermined position, and the second position A substrate coupling part 170 coupling the metal PCB 10 to the back plate 40 disposed thereon may be included.
보다 상세하게는, 도 2를 참고하면, 상기 단차 컷팅 가공부(120)는 상기 메탈피시비(10)의 전체 두께 중 일부만 남기고 기설정된 깊이만큼 컷팅하여 상기 컷팅홈을 형성하되, 상기 컷팅홈은 하부로 갈수록 폭이 좁아지는 콘 형상의 V자 컷팅홈(210) 및 하부로 갈수록 동일한 폭을 유지하는 U자 컷팅홈(220) 중 적어도 어느 하나의 형태로 형성될 수 있다.More specifically, referring to FIG. 2 , the step cutting processing unit 120 cuts only a portion of the total thickness of the metal PCB 10 to a predetermined depth to form the cutting groove, but the cutting groove is It may be formed in the form of at least one of a cone-shaped V-shaped cutting groove 210, the width of which narrows toward the bottom, and a U-shaped cutting groove 220 maintaining the same width toward the bottom.
일례로, 상기 단차 컷팅 가공부(120)는 상기 V자 컷팅홈(210)을 형성하는 제1 칼날, 상기 U자 컷팅홈(220)을 형성하는 제2 칼날 외에 상기 메탈피시비(10)를 가공할 수 있는 칼날을 이용하여 상기 컷팅홈을 형성할 수 있다.For example, the stepped cutting processing unit 120 processes the metal PCB 10 in addition to the first blade forming the V-shaped cutting groove 210 and the second blade forming the U-shaped cutting groove 220 The cutting groove can be formed using a blade that can be used.
한편, 상기 모듈위치 결정부(140)는 상기 메탈피시비(10) 상에 형성된 영점 마크를 인식하여 상기 OLED 모듈(20)이 실장되는 위치를 결정할 수 있다.Meanwhile, the module location determiner 140 may determine a location where the OLED module 20 is mounted by recognizing a zero mark formed on the metal PCB 10 .
이때, 상기 기판 촬영부(130)에 촬영된 이미지를 분석하여 상기 메탈피시비(10)가 상기 제1 위치에 정확하게 고정되었는지, 상기 제1 위치에 정확하게 고정된 상태에서 상기 컷팅홈이 가공되었는지 등을 판단할 수 있다.At this time, by analyzing the image photographed by the substrate photographing unit 130, it is determined whether the metal PCB 10 is accurately fixed to the first position, whether the cutting groove is processed while it is accurately fixed to the first position, and the like. can judge
따라서, 상기 OLED 모듈(20)이 실장되는 위치에서 기지정된 범위 내에 적어도 하나의 컷팅홈이 존재하는지 여부를 판단하고, 기지정된 범위 내에 적어도 하나의 컷팅홈이 존재하는 경우, 인식된 영점 마크에 컷팅홈의 위치를 반영하여 상기 OLED 모듈(20)이 실장되는 위치에서 기지정된 범위 내에 적어도 하나의 컷팅홈이 존재하지 않는 보정된 제2 영점을 산출할 수 있다.Therefore, it is determined whether or not at least one cutting groove exists within a predetermined range at the position where the OLED module 20 is mounted, and if at least one cutting groove exists within the predetermined range, cutting is performed at the recognized zero mark. A corrected second zero point in which at least one cutting groove does not exist within a predetermined range at a position where the OLED module 20 is mounted can be calculated by reflecting the position of the groove.
이때, 상기 모듈위치 결정부(140)에서 상기 제2 영점이 산출되지 않는 경우, 상기 메탈피시비(10)의 상기 컷팅홈 가공이 불량인 것으로 판단하여, 상기 메탈피시비(10)의 진단 및 회수를 요청하는 알람신호를 생성할 수도 있다.At this time, when the second zero point is not calculated by the module location determiner 140, it is determined that the cutting groove processing of the metal PCB 10 is defective, and diagnosis and recovery of the metal PCB 10 are performed. It is also possible to generate a requested alarm signal.
일례로, 상기 기판 촬영부(130)는 상기 컷팅홈이 가공된 상태 이미지를 분석하여, 단차 가공의 불량 여부를 판단할 수도 있다.For example, the board photographing unit 130 may determine whether or not the processing of the step is defective by analyzing an image of a processed state of the cutting groove.
한편, 도 3을 참고하면, 상기 기판 결합부(170)는 상기 메탈피시비(10)를 제2 위치에 배치된 상기 백플레이트(40)와 결합시키되, 상기 메탈피시비(10)가 결합되는 상기 백플레이트(40)의 장착면은 각각의 경사를 갖는 다면으로 이루어진 형태로 마련될 수 있다.Meanwhile, referring to FIG. 3 , the board coupling part 170 couples the metal PCB 10 to the back plate 40 disposed at the second position, and the back plate to which the metal PCB 10 is coupled. The mounting surface of the plate 40 may be provided in the form of multi-faceted surfaces having respective inclinations.
또한, 상기 장착면의 절곡부위와 상기 메탈피시비(10)에 형성된 상기 컷팅홈의 위치를 일치시킨 상태에서 상기 메탈피시비(10)를 상기 백플레이트(40) 상에 가압하여 상기 메탈피시비(10)를 절곡된 형상으로 가공할 수 있다.In addition, the metal PCB 10 is pressed onto the back plate 40 in a state in which the bent portion of the mounting surface and the cutting groove formed in the metal PCB 10 are aligned, so that the metal PCB 10 can be processed into a bent shape.
또한, 상기 메탈피시비(10)가 절곡된 형상을 안정적으로 유지할 수 있도록 상기 메탈피시비(10)와 상기 백플레이트(40)를 결합시킬 수 있다.In addition, the metal PCB 10 and the back plate 40 may be coupled so that the metal PCB 10 may stably maintain a bent shape.
또한, 도 4를 참고하면, 상기 기판 결합부(170)는 상기 백플레이트(40)의 장착면이 상부 장착면과 하부 장착면을 포함하는 경우, 상기 백플레이트(40)의 상면에 상기 메탈피시비(10a)를 결합시킨 후 상기 하부 장착면에 대응되는 타 메탈피시비(10b)를 결합시키고, 상기 메탈피시비(10a)와 일단이 결합된 연성회로기판(30)의 타단과 상기 타 메탈피시비(10b)의 일단을 결합시키는 양면기판 결합부(미도시)를 포함하는 것을 특징으로 한다.In addition, referring to FIG. 4 , when the mounting surface of the back plate 40 includes an upper mounting surface and a lower mounting surface, the substrate coupling part 170 attaches the metal PCB to the upper surface of the back plate 40 . After coupling (10a), another metal PCB (10b) corresponding to the lower mounting surface is coupled, and the other end of the flexible printed circuit board (FPCB) 30 having one end coupled to the metal PCB (10a) and the other metal PCB (10b) ) It is characterized in that it comprises a double-sided board coupling part (not shown) for coupling one end of.
상기와 같은 본 발명의 효과에 따르면, 자동차 헤드램프용 메탈피시비 조립장는 메탈피시비에 컷팅홈을 형성하고 연성인쇄회로기판(Flexible Printed Circuit Board : FPCB)과 결합함으로써 절곡된 다면 형상 및 양면 형상으로 제작할 수 있어 설계 자유도를 향상시킬 수 있는 자동차 헤드램프용 메탈피시비 조립 장치가 제공될 수 있다.According to the effects of the present invention as described above, the metal PCB assembly plant for automobile headlamps can be manufactured in a bent multi-sided shape and double-sided shape by forming a cutting groove in the metal PCB and combining it with a flexible printed circuit board (FPCB). Accordingly, a metal PCB assembly device for an automobile headlamp capable of improving design freedom may be provided.
또한, 메탈피시비 상에 OLED 모듈을 장착함으로써, 색 선명도 및 발광 효율을 향상시킬 수 있는 자동차 헤드램프용 메탈피시비 조립 장치가 제공될 수 있다.In addition, by mounting the OLED module on the metal PCB, a metal PCB assembly device for an automobile headlamp capable of improving color clarity and luminous efficiency can be provided.
또한, 본 발명의 일실시례에 따른, 자동차 헤드램프용 OLED 모듈 조립 장치의 제어 방법은 다양한 컴퓨터로 구현되는 동작을 수행하기 위한 프로그램 명령을 포함하는 컴퓨터 판독 가능 매체에 기록될 수 있다. 상기 컴퓨터 판독 가능 매체는 프로그램 명령, 데이터 파일, 데이터 구조 등을 단독으로 또는 조합하여 포함할 수 있다. 상기 매체는 프로그램 명령은 본 발명을 위하여 특별히 설계되고 구성된 것들이거나 컴퓨터 소프트웨어 당업자에게 공지되어 사용 가능한 것일 수도 있다. 컴퓨터 판독 가능 기록 매체의 예에는 하드 디스크, 플로피 디스크 및 자기 테이프와 같은 자기 매체(magnetic media), CD-ROM, DVD와 같은 광기록 매체(optical media), 플롭티컬 디스크(floptical disk)와 같은 자기-광 매체(magneto-optical media), 및 롬(ROM), 램(RAM), 플래시 메모리 등과 같은 프로그램 명령을 저장하고 수행하도록 특별히 구성된 하드웨어 장치가 포함된다. 프로그램 명령의 예에는 컴파일러에 의해 만들어지는 것과 같은 기계어 코드뿐만 아니라 인터프리터 등을 사용해서 컴퓨터에 의해서 실행될 수 있는 고급 언어 코드를 포함한다.In addition, the control method of an apparatus for assembling an OLED module for a vehicle headlamp according to an embodiment of the present invention may be recorded in a computer readable medium including program instructions for performing various computer-implemented operations. The computer readable medium may include program instructions, data files, data structures, etc. alone or in combination. The medium may include program instructions specially designed and configured for the present invention, or may be known and usable to those skilled in computer software. Examples of computer-readable recording media include magnetic media such as hard disks, floppy disks and magnetic tapes, optical media such as CD-ROMs and DVDs, and magnetic media such as floptical disks. - includes hardware devices specially configured to store and execute program instructions, such as magneto-optical media, and ROM, RAM, flash memory, and the like. Examples of program instructions include high-level language codes that can be executed by a computer using an interpreter, as well as machine language codes such as those produced by a compiler.
이상과 같이 본 발명의 일실시례는 비록 한정된 실시례와 도면에 의해 설명되었으나, 본 발명의 일실시례는 상기 설명된 실시례에 한정되는 것은 아니며, 이는 본 발명이 속하는 분야에서 통상의 지식을 가진 자라면 이러한 기재로부터 다양한 수정 및 변형이 가능하다. 따라서 본 발명의 일실시례는 아래에 기재된 특허청구범위에 의해서만 파악되어야 하고, 이의 균등 또는 등가적 변형 모두는 본 발명 사상의 범주에 속한다고 할 것이다.As described above, although one embodiment of the present invention has been described by means of limited embodiments and drawings, one embodiment of the present invention is not limited to the above-described embodiments, which is based on common knowledge in the field to which the present invention belongs. Those who have it can make various modifications and variations from these materials. Therefore, one embodiment of the present invention should be grasped only by the claims described below, and all equivalent or equivalent modifications thereof will be said to belong to the scope of the present invention.
10 : 메탈피시비10: Metal PCB
20 : OLED 모듈20: OLED module
30 : 연성인쇄회로기판 30: flexible printed circuit board
40 : 백플레이트40: back plate
110 : 기판 이송부110: substrate transfer unit
120 : 단차 컷팅 가공부120: step cutting processing unit
130 : 기판 촬영부130: board photographing unit
140 : 모듈위치 결정부140: module location determining unit
150 : 모듈 장착부150: module mounting part
160 : FPCB 결합부160: FPCB coupling part
170 : 기판 결합부170: board coupling part
Claims (5)
- 메탈피시비를 기설정된 제1 위치에 배치하고 고정시키는 기판 이송부;a substrate transfer unit for arranging and fixing the metal PCB at a predetermined first position;상기 제1 위치에 배치된 메탈피시비 상에 적어도 하나의 컷팅홈을 가공하는 단차 컷팅 가공부;a stepped cutting unit for processing at least one cutting groove on the metal PCB disposed at the first position;상기 메탈피시비가 상기 제1 위치에 배치된 상태 및 상기 메탈피시비 상에 형성된 상기 컷팅홈의 위치를 촬영하는 기판 촬영부;a substrate photographing unit for photographing a state in which the metal PCB is disposed at the first position and a position of the cutting groove formed on the metal PCB;상기 기판 촬영부에서 촬영된 상기 메탈피시비의 상태에 기초하여 OLED 모듈의 실장 위치를 결정하는 모듈위치 결정부;a module position determining unit for determining a mounting position of an OLED module based on the state of the metal PCB photographed by the board photographing unit;상기 모듈위치 결정부에서 결정된 실장 위치에 상기 OLED 모듈을 장착시키는 모듈 장착부;a module mounting unit for mounting the OLED module at the mounting position determined by the module position determining unit;상기 OLDE 모듈이 장착된 상기 메탈피시비의 일단에 연성인쇄회로기판을 결합시키는 FPCB 결합부; 및an FPCB coupling unit coupling a flexible printed circuit board to one end of the metal PCB on which the OLDE module is mounted; and상기 연성인쇄회로기판과 결합된 상기 메탈피비시를 기설정된 제2 위치로 이송하고, 상기 제2 위치에 배치된 백플레이트에 상기 메탈피시비를 결합시키는 기판 결합부;를 포함하는 자동차 헤드램프용 메탈피시비 조립 장치.A metal PCB for automobile headlamps comprising: a board coupling unit transferring the metal PCB coupled to the flexible printed circuit board to a predetermined second position and coupling the metal PCB to a backplate disposed at the second position. PCB assembly device.
- 제1항에 있어서,According to claim 1,상기 단차 컷팅 가공부는,The step cutting processing unit,상기 메탈피시비의 전체 두께 중 일부만 남기고 기설정된 깊이만큼 컷팅하여 상기 컷팅홈을 형성하되, Forming the cutting groove by cutting to a predetermined depth leaving only a part of the total thickness of the metal PCB,상기 컷팅홈은, The cutting groove,하부로 갈수록 폭이 좁아지는 콘 형상의 V자 컷팅홈; 및 A cone-shaped V-shaped cutting groove that becomes narrower toward the bottom; and하부로 갈수록 동일한 폭을 유지하는 U자 컷팅홈; 중 적어도 어느 하나의 형태로 형성되는 것을 특징으로 하는 자동차 헤드램프용 메탈피시비 조립 장치.U-shaped cutting grooves maintaining the same width toward the bottom; Metal PCB assembly device for automobile headlamps, characterized in that formed in the form of at least one of.
- 제1항에 있어서,According to claim 1,상기 모듈위치 결정부는,The module location determination unit,상기 메탈피시비 상에 형성된 영점 마크를 인식하여 상기 OLED 모듈이 실장되는 위치를 결정하되, Recognizing the zero mark formed on the metal PCB to determine the mounting position of the OLED module,상기 기판 촬영부에 촬영된 이미지를 분석하여 상기 OLED 모듈이 실장되는 위치에서 기지정된 범위 내에 적어도 하나의 상기 컷팅홈이 존재하는지 여부를 판단하고, 상기 기지정된 범위 내에 적어도 하나의 상기 컷팅홈이 존재하는 경우, 상기 인식된 영점 마크에 상기 컷팅홈의 위치를 반영하여 상기 OLED 모듈이 실장되는 위치에서 상기 기지정된 범위 내에 적어도 하나의 상기 컷팅홈이 존재하지 않는 보정된 제2 영점을 산출하는 것을 특징으로 하는 자동차 헤드램프용 메탈피시비 조립 장치.By analyzing the image captured by the substrate photographing unit, it is determined whether or not at least one cutting groove exists within a predetermined range from a position where the OLED module is mounted, and the at least one cutting groove exists within the predetermined range. In this case, the position of the cutting groove is reflected on the recognized zero mark to calculate a corrected second zero point where at least one cutting groove does not exist within the predetermined range at a position where the OLED module is mounted. A metal PCB assembly device for automotive headlamps.
- 제1항에 있어서,According to claim 1,상기 기판 결합부는,The substrate coupling part,상기 메탈피시비를 상기 제2 위치에 배치된 상기 백플레이트와 결합시키되,The metal PCB is coupled to the back plate disposed at the second position,상기 메탈피시비가 결합되는 상기 백플레이트의 장착면은 각각의 경사를 갖는 다면으로 이루어진 형태로 마련되고, The mounting surface of the back plate to which the metal PC ratio is coupled is provided in the form of multi-faceted surfaces having respective inclinations,상기 장착면의 절곡부위와 상기 메탈피시비에 형성된 상기 컷팅홈의 위치를 일치시킨 상태에서 상기 메탈피시비를 상기 백플레이트 상에 가압하여 상기 메탈피시비를 절곡시킨 후 상기 백플레이트에 결합시키는 것을 특징으로 하는 자동차 헤드램프용 메탈피시비 조립 장치.In a state in which the bent portion of the mounting surface coincides with the position of the cutting groove formed in the metal PCB, the metal PCB is pressed on the back plate to bend the metal PCB and then coupled to the back plate. Metal PCB assembly device for automotive headlamps.
- 제4항에 있어서,According to claim 4,상기 기판 결합부는,The substrate coupling part,상기 백플레이트의 상기 장착면이 상부 장착면과 하부 장착면을 포함하는 경우, 상기 백플레이트의 상면에 상기 메탈피시비를 결합시킨 후 상기 하부 장착면에 대응되는 타 메탈피시비를 결합시키고, 상기 메탈피시비와 일단이 결합된 상기 연성인쇄회로기판의 타단과 상기 타 메탈피시비의 일단을 결합시키는 양면기판 결합부를 포함하는 것을 특징으로 하는 자동차 헤드램프용 메탈피시비 조립 장치.When the mounting surface of the back plate includes an upper mounting surface and a lower mounting surface, the metal PCB is coupled to the upper surface of the back plate, and another metal PCB corresponding to the lower mounting surface is coupled to the metal PCB. and a double-sided board coupling part for coupling the other end of the flexible printed circuit board to which one end is coupled and one end of the other metal PCB.
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KR10-2021-0140005 | 2021-10-20 | ||
KR1020210140005A KR20230056221A (en) | 2021-10-20 | 2021-10-20 | Metal pcb assembly apparatus for automobile headlamps |
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Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
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KR20040002750A (en) * | 2002-06-27 | 2004-01-07 | 이스트맨 코닥 캄파니 | Depositing an emissive layer for use in an organic light-emitting display device (oled) |
KR100875724B1 (en) * | 2008-06-30 | 2008-12-26 | 공배 | The led-illumination ramp pcb where the many-sidedness degree angle embodiment is easy |
KR101542945B1 (en) * | 2014-10-17 | 2015-09-25 | 유트로닉스주식회사 | Manufacture method of LED array for vehicle head lamp |
KR20160049780A (en) * | 2014-10-28 | 2016-05-10 | 성재덕 | Light module assembly for vehilce |
KR101652963B1 (en) * | 2015-12-31 | 2016-09-01 | 에코캡 주식회사 | assembly method for metal pcb with multilatera |
-
2021
- 2021-10-20 KR KR1020210140005A patent/KR20230056221A/en not_active Application Discontinuation
- 2021-11-05 WO PCT/KR2021/015961 patent/WO2023068428A1/en active Application Filing
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
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KR20040002750A (en) * | 2002-06-27 | 2004-01-07 | 이스트맨 코닥 캄파니 | Depositing an emissive layer for use in an organic light-emitting display device (oled) |
KR100875724B1 (en) * | 2008-06-30 | 2008-12-26 | 공배 | The led-illumination ramp pcb where the many-sidedness degree angle embodiment is easy |
KR101542945B1 (en) * | 2014-10-17 | 2015-09-25 | 유트로닉스주식회사 | Manufacture method of LED array for vehicle head lamp |
KR20160049780A (en) * | 2014-10-28 | 2016-05-10 | 성재덕 | Light module assembly for vehilce |
KR101652963B1 (en) * | 2015-12-31 | 2016-09-01 | 에코캡 주식회사 | assembly method for metal pcb with multilatera |
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