WO2023066249A1 - 电子设备 - Google Patents

电子设备 Download PDF

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Publication number
WO2023066249A1
WO2023066249A1 PCT/CN2022/125923 CN2022125923W WO2023066249A1 WO 2023066249 A1 WO2023066249 A1 WO 2023066249A1 CN 2022125923 W CN2022125923 W CN 2022125923W WO 2023066249 A1 WO2023066249 A1 WO 2023066249A1
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WO
WIPO (PCT)
Prior art keywords
metal layer
metal
resonant cavity
electronic device
antenna
Prior art date
Application number
PCT/CN2022/125923
Other languages
English (en)
French (fr)
Inventor
王君翊
Original Assignee
维沃移动通信有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 维沃移动通信有限公司 filed Critical 维沃移动通信有限公司
Publication of WO2023066249A1 publication Critical patent/WO2023066249A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/50—Structural association of antennas with earthing switches, lead-in devices or lightning protectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q13/00—Waveguide horns or mouths; Slot antennas; Leaky-waveguide antennas; Equivalent structures causing radiation along the transmission path of a guided wave
    • H01Q13/10—Resonant slot antennas
    • H01Q13/18—Resonant slot antennas the slot being backed by, or formed in boundary wall of, a resonant cavity ; Open cavity antennas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings

Definitions

  • the present application belongs to the technical field of terminals, and specifically relates to an electronic device.
  • the number of antennas and antenna frequency bands on the fifth generation mobile communication (5th Generation, 5G) mobile terminals are increasing. It is already too crowded to arrange the antennas around, and there are many isolation-related problems between the antennas. The problem directly affects the performance of the antenna. Therefore, it is particularly important to make full use of the space when the space of the whole machine remains unchanged.
  • the shielding case is only used as a separate shielding structure, and the space above the shielding case cannot be used, so that the space of the whole machine cannot be fully utilized.
  • the purpose of the embodiments of the present application is to provide an electronic device to solve the problem that the space above the shielding cover cannot be fully utilized by the antenna.
  • An embodiment of the present application provides an electronic device, including:
  • the second metal layer is arranged at intervals from the first metal layer, the second metal layer has slots, and the second metal layer is arranged outside the shield;
  • a metal piece is arranged between the first metal layer and the second metal layer, and the metal piece surrounds a resonant cavity, and the metal piece is respectively connected with the first metal layer and the The second metal layer is electrically connected, and the first metal layer and the second metal layer form a first resonant cavity antenna;
  • a feed structure the feed structure is used to feed the resonant cavity.
  • the metal piece extends along the circumference of the second metal layer; or
  • the multiple metal pieces are arranged at intervals along the circumferential direction of the second metal layer.
  • the metal parts include:
  • the first metal piece is electrically connected to the first metal layer and the second metal layer respectively, and the first metal piece is arranged along the circumference of the second metal layer and surrounds the second metal layer. a resonant cavity;
  • the second metal piece is electrically connected to the first metal layer and the second metal layer respectively, and the second metal piece is arranged along the circumference of the second metal layer and surrounds the second metal layer. Two resonant cavities, the second resonant cavity is located in the first resonant cavity.
  • the second metal parts are respectively distributed on both sides of the slot.
  • a dielectric layer is filled between the first metal layer and the second metal layer.
  • the multiple slots are distributed at intervals; and/or
  • the slot is elongated, arc-shaped, circular or L-shaped; and/or
  • said slot is located at an edge region of said second metal layer;
  • the resonant cavity is cylindrical, elliptical cylindrical or polygonal.
  • the length of the slot is half of the working wavelength of the radio frequency signal in the medium in the slot.
  • the slots are strip-shaped, and the ratio of the length of the slots to the width of the slots is greater than or equal to 10.
  • the slot extends inward from one side edge of the second metal layer and passes out from the other side edge of the second metal layer.
  • a third metal layer is disposed between the first metal layer and the second metal layer and is located in the resonant cavity, the third metal layer is respectively connected to the first metal layer Spaced apart from the second metal layer, an edge of the third metal layer is electrically connected to the metal piece.
  • the metal piece extends along the circumference of the second metal layer, the third metal layer is rectangular, and two adjacent edges of the third metal layer are electrically connected to the metal piece. connect.
  • each shield there are multiple shields, and there are multiple second metal layers, and the first metal layer of each shield and the corresponding second metal layer form a first resonant cavity antenna .
  • the first metal layers on the multiple shielding covers are arranged corresponding to the second metal layer to form a first resonant cavity antenna.
  • a plurality of resonant cavities are formed between the first metal layer and the second metal layer, and the positions corresponding to the resonant cavities on the second metal layer are respectively provided with the slots .
  • it further includes: a feed structure, the feed structure is used to feed the resonant cavity.
  • it further includes: a tuning element, and the feeding structure feeds the resonant cavity through the tuning element.
  • it further includes: a main board, on which the shielding cover is arranged.
  • it further includes: a first antenna, where the first antenna is disposed on the second metal layer.
  • it further includes: a second antenna, the second antenna being disposed on an edge area of the electronic device.
  • it further includes: a battery and a back cover, the battery and the back cover are arranged at intervals along the thickness direction of the battery, and a second resonant cavity antenna is arranged between the battery and the back cover.
  • it further includes: a display screen and a frame body, the display screen is arranged on the frame body, and a third resonant cavity antenna is arranged between the display screen and the frame body.
  • the electronic device in the embodiment of the present application includes: a shielding case, the shielding case has a first metal layer; a second metal layer, the second metal layer is spaced apart from the first metal layer, and the second metal layer There is a slot on the layer, the second metal layer is arranged outside the shield; a metal piece, the metal piece is arranged between the first metal layer and the second metal layer, and the metal piece Enclosing a resonant cavity, the metal parts are respectively electrically connected to the first metal layer and the second metal layer, and the first metal layer and the second metal layer constitute a first resonant cavity antenna; a feeding structure , the feeding structure is used to feed the resonant cavity.
  • a metal piece is provided between the first metal layer and the second metal layer of the shielding case, the metal piece surrounds a resonant cavity, and a slot is provided on the second metal layer,
  • the first metal layer and the second metal layer form the first resonant cavity antenna, it is possible to set an antenna with high radiation efficiency above the shield, and use the space above the shield to make an additional high-performance antenna, fully Utilizing the space above the shield, the first metal layer in the shield serves as a part of the first resonant cavity antenna, the shield and the resonant cavity antenna are integrated, and the structure consistency is very good, the upper side of the second metal layer in the resonant cavity antenna
  • the area can be used as a support for other antennas, such as Near Field Communication (NFC), Ultra Wide Band (UWB) or millimeter wave antennas, and the space is fully utilized.
  • NFC Near Field Communication
  • UWB Ultra Wide Band
  • Figure 1a is a schematic structural diagram of an electronic device in an embodiment of the present application.
  • Figure 1b is a side view of the electronic device in the embodiment of the present application.
  • Fig. 1c is another schematic structural diagram of the electronic device in the embodiment of the present application.
  • Figure 1d is another side view of the electronic device in the embodiment of the present application.
  • Figure 2a is a schematic diagram of the shape of a resonant cavity
  • Figure 2b is another schematic diagram of the shape of the resonant cavity
  • Fig. 2c is another schematic diagram of the shape of the resonant cavity
  • FIG. 3 is another schematic structural diagram of the electronic device in the embodiment of the present application.
  • Fig. 4 is a schematic diagram of filling medium layer
  • Figure 5a is a schematic diagram of setting the third metal layer
  • Fig. 5b is another schematic diagram of setting the third metal layer
  • Fig. 6a is a schematic diagram when the metal part is not closed
  • Figure 6b is a schematic diagram when the slot passes through
  • Fig. 7a is a kind of arrangement schematic diagram of slot
  • Figure 7b is a schematic diagram of another arrangement of slots
  • Fig. 7c is a schematic diagram of another arrangement of slots
  • Fig. 8 is a schematic diagram of the connection between the tuning element and the feed structure
  • Figure 9a is a schematic diagram of multiple shielding covers
  • Fig. 9b is another schematic diagram when there are multiple shielding covers.
  • Fig. 9c is another schematic diagram when there are multiple shielding covers.
  • Fig. 9d is another schematic diagram when there are multiple shielding covers.
  • FIG. 10 is another schematic structural diagram of the electronic device in the embodiment of the present application.
  • shielding case 10 first metal layer 11; dielectric layer 12;
  • metal part 30 second metal part 32; third metal layer 33;
  • Tuning element 50 motherboard 60; radio frequency module 61;
  • the electronic device in the embodiment of the present application includes: a shielding case 10, a second metal layer 20, a metal piece 30 and a feed structure 40, wherein the shielding case 10 has a first metal layer 11 , the first metal layer 11 may include at least one surface of the shielding case 10, the shielding case 10 may be welded on the main ground layer of the main board, and may perform electromagnetic shielding on the chip modules or discrete power amplifier devices on the main board, and has the effect of shielding .
  • the first metal layer 11 may be located on the top of the shield 10 , that is, on the side away from the main board.
  • the second metal layer 20 and the first metal layer 11 may be arranged at intervals, the second metal layer 20 and the first metal layer 11 may be arranged in parallel, and the thickness of the second metal layer 20 may be 0.5mm-2mm.
  • the second metal layer 20 is arranged outside the shielding case 10, and the second metal layer 20 may have a slot 21, the number of the slot 21 may be one or more, and the number, shape and position of the slot 21 may be selected according to the actual situation .
  • the metal piece 30 can be arranged between the first metal layer 11 and the second metal layer 20, the metal piece 30 can surround a resonant cavity, the slot 21 can be set on the second metal layer 20 at a position corresponding to the resonant cavity, and the metal piece 30 can extend along the circumference of the second metal layer 20, the metal piece 30 can extend along the edge area of the second metal layer 20, the metal piece 30 can be circular or arc-shaped, and the metal piece 30 can be respectively and the first metal
  • the layer 11 is electrically connected to the second metal layer 20, the first metal layer 11 and the second metal layer 20 can form a first resonant cavity antenna, the feeding structure 40 can be used to feed the resonant cavity, and the feeding structure 40 can be used for
  • the resonant cavity is fed with signals, and the radio frequency signal can be radiated from the slot 21 after being resonated by the resonant cavity, and an antenna with high radiation efficiency can be realized above the shielding case 10 .
  • the metal piece 30 is arranged between the first metal layer 11 and the second metal layer 20 of the shielding case 10, the metal piece 30 can surround a resonant cavity, and the metal piece 30 is arranged on the second metal layer 20
  • the slot 21 allows the first metal layer 11 and the second metal layer 20 to form the first resonant cavity antenna, which can realize the installation of an antenna with high radiation efficiency above the shield 10, and use the space above the shield 10 to make additional high performance.
  • the antenna makes full use of the space above the shielding case 10, the first metal layer 11 in the shielding case 10 is used as a part of the first resonant cavity antenna, the shielding case 10 and the resonant cavity antenna are integrated, the structure consistency is very good, and the resonant cavity antenna
  • the upper area of the second metal layer 20 can be used as a support for other antennas, such as a near field communication (NFC) antenna, an ultra wideband communication (UWB) antenna or a millimeter wave antenna, and the space is fully utilized.
  • NFC near field communication
  • UWB ultra wideband communication
  • millimeter wave antenna a millimeter wave antenna
  • the metal piece 30 may extend along the circumference of the second metal layer 20, and the metal piece 30 may be located at the edge region between the first metal layer 11 and the second metal layer 20.
  • the metal piece 30 It can be in the shape of a ring or an arc, and the resonant cavity can be surrounded by the metal piece 30 between the first metal layer 11 and the second metal layer 20, and the resonant cavity can be in the shape of a cylinder, a cuboid or a cube.
  • the metal pieces 30 can be columnar or arc-shaped, and a plurality of metal pieces 30 can be arranged at intervals along the circumferential direction of the second metal layer 20, and can be evenly spaced.
  • Member 30 may enclose a resonant cavity.
  • the metal piece 30 may be a non-closed annular metal sheet, as shown by the dotted line a in FIG. 6 a , and may have openings on a part of its surface, so as to realize mode regulation of the antenna.
  • the first metal layer 11, the second metal layer 20 and the metal part 30 may not be integrally formed, the metal part 30 may be a metal spring pin or a screw post, and the first metal layer 11 and the second metal layer 20 may be two separate parts.
  • Structural parts can flexibly adjust the position of the spring pin according to the actual debugging situation, control the resonant frequency of the resonant cavity antenna, the debugging cycle is short and efficient, and avoid the inconvenience of debugging caused by the integration of the antenna structure. When changing, it needs to be replaced as a whole and the proofing cycle is long. The problem.
  • the metal part 30 may include: a first metal part and a second metal part 32, and the first metal part may be electrically connected to the first metal layer 11 and the second metal layer 20 respectively.
  • the first metal piece may be arranged along the circumference of the second metal layer 20 and surround the first resonant cavity.
  • the first metal piece can extend along the circumferential direction of the second metal layer 20, the first metal piece can be located at the edge area between the first metal layer 11 and the second metal layer 20, the first metal piece can be in the shape of a ring or an arc, through
  • the first metal piece between the first metal layer 11 and the second metal layer 20 can enclose a first resonant cavity, and the first resonant cavity can be in the shape of a cylinder, a cuboid or a cube.
  • the first resonant cavity can be surrounded.
  • the second metal piece 32 is electrically connected with the first metal layer 11 and the second metal layer 20 respectively, and the second metal piece 32 is arranged along the circumferential direction of the second metal layer 20 and surrounds a second resonant cavity, and the second resonant cavity Located in the first resonant cavity.
  • the second metal piece 32 can extend along the circumferential direction of the second metal layer 20 , and the second metal piece 32 can be circular or arc-shaped, passing through the second metal piece 32 between the first metal layer 11 and the second metal layer 20
  • a second resonant cavity may be enclosed, and the second resonant cavity may be in the shape of a cylinder, a cuboid or a cube.
  • the second metal pieces 32 may be columnar or arc-shaped.
  • a plurality of second metal pieces 32 may be arranged at intervals along the circumferential direction of the second metal layer 20, and may be evenly spaced.
  • the two metal parts 32 can form a second resonant cavity, and multiple high-order modes can be excited through the first resonant cavity and the second resonant cavity, thereby expanding the frequency band covered by the antenna.
  • the second metal pieces 32 there may be multiple second metal pieces 32 , and the second metal pieces 32 may be respectively distributed on both sides of the slot 21 .
  • the second metal part 32 can be a shrapnel or a metal cylinder, and the second metal part 32 connects the first metal layer 11 and the second metal layer 20 to realize antenna mode control and broadband coverage.
  • the second metal parts 32 are distributed on both sides of the slot 21, which can make the antenna excite multiple high-order modes and broaden the frequency band covered by the antenna.
  • a dielectric layer 12 is filled between the first metal layer 11 and the second metal layer 20 .
  • the dielectric layer 12 can be filled or partially filled inside the resonant cavity to reduce the resonant frequency of the antenna and reduce the required length and width of the cavity.
  • the loss tangent factor of the dielectric layer 12 may be less than 0.005.
  • the slots 21 can be strip-shaped, arc-shaped, circular or L-shaped, and a plurality of slots 21 can intersect to form a cross-shaped slot, for example, as shown in Figure 7a As shown, two elongated slots 21 intersect to form a cross shape, which can be selected according to actual conditions.
  • the slot 21 serves as the radiation aperture of the antenna, and the shape of the slot 21 is not limited to the above-mentioned shapes.
  • the slot 21 can be located in the edge area of the second metal layer 20 to facilitate the radiation of the antenna, and the middle area of the second metal layer 20 is convenient for setting other antennas, for example, the middle area can be reserved for UWB or millimeter wave antennas, The layout is more reasonable.
  • the resonant cavity can be cylindrical, elliptical cylindrical or polygonal, and the resonant cavity can also be a cavity of other shapes formed by arcs and straight lines.
  • the resonant cavity can be The cuboid shape or the cube shape can be selected according to the actual situation, and corresponding design adjustments can be made according to the needs of the actual antenna mode and bandwidth.
  • the length of the slot 21 may be half the operating wavelength of the radio frequency signal in the medium within the slot 21 .
  • the slot 21 is in the shape of a strip, and the ratio of the length of the slot 21 to the width of the slot 21 may be greater than or equal to 10.
  • the slot 21 may extend inward from one side edge of the second metal layer 20 and pass out from the other side edge of the second metal layer 20 .
  • the grooved part of the second metal layer 20 can extend to the edge, and the second metal layer 20 can be divided into two parts, so that the resonant cavity is divided into two half cavities, the size of these two half cavities can be equal or different, and can be Realize multi-frequency resonance, which can play the role of antenna impedance tuning.
  • the electronic device may further include: a third metal layer 33, and the third metal layer 33 may be disposed between the first metal layer 11 and the second metal layer 20, and The third metal layer 33 is located in the resonant cavity, the third metal layer 33 can be spaced apart from the first metal layer 11 and the second metal layer 20 respectively, the third metal layer 33 can be respectively connected to the first metal layer 11 and the second metal layer 20 in parallel, the edge of the third metal layer 33 can be electrically connected to the metal piece 30 .
  • the metal piece 30 may extend along the circumferential direction of the second metal layer 20, the third metal layer 33 may be rectangular, and the first metal layer 11, the second metal layer 20 and the third metal layer 33 may all be rectangular,
  • the resonant cavity may be in the shape of a cuboid, and two adjacent edges of the third metal layer 33 may be electrically connected to the metal piece 30, and the other two adjacent edges of the third metal layer 33 are not electrically connected to the metal piece 30, Can be separated by a certain distance.
  • the third metal layer 33 is parallel to the first metal layer 11 and the second metal layer 20, and the third metal layer 33 can be connected to the two facades of the resonant cavity, but not connected to the other two facades, forming an L-shaped cavity part.
  • a third metal layer 33 can be added inside the resonant cavity to realize a folded resonant cavity, which is used to reduce the resonant frequency of the antenna and reduce the required length and width of the cavity.
  • each shielding case 10 there may be multiple shielding cases 10 and multiple second metal layers 20, and the first metal layer 11 of each shielding case 10 is respectively connected to a corresponding second metal layer. 20 constitutes the first cavity antenna.
  • a metal piece 30 is arranged between the first metal layer 11 of each shielding case 10 and the corresponding second metal layer 20, the metal piece 30 can surround a resonant cavity, and a slot 21 is set on the second metal layer 20, so that each The first metal layer 11 and the second metal layer 20 of each shielding case 10 respectively form a first resonant cavity antenna, and an antenna with high radiation efficiency can be arranged above the shielding case 10 .
  • Resonant cavity antennas are integrally designed above each shielding cover 10, and multiple shielding covers 10 can correspond to multiple resonant cavity antennas, and these resonant cavity antennas can work in the same frequency band to realize multiple input multiple output (Multiple Input Multiple Output, MIMO) antenna functions , or work in different frequency bands to achieve diversity or MIMO antenna functions with other types of antennas.
  • MIMO Multiple Input Multiple Output
  • the shielding case 10 may have multiple, such as four, and the second metal layer 20 may have one, and the first metal layers on the multiple shielding cases 10 are all connected with each other.
  • the second metal layer 20 is arranged correspondingly to form the first resonant cavity antenna.
  • the second metal layer 20 can be rectangular, and the four shielding cases 10 can be respectively located at the corners of the second metal layer 20.
  • the first metal layer 11 is set corresponding to the second metal layer 20 to form a first resonant cavity antenna.
  • the first metal layer 11 above the multiple shielding covers 10 corresponds to a large second metal layer 20, which is used to deal with the situation when the operating frequency of the antenna needs to be low.
  • the metal piece 30 may be a screw column, and the first metal layer 11 and the second metal layer 20 on the shielding case 10 may be electrically connected by locking screws.
  • a plurality of resonant cavities may be formed between the first metal layer 11 and the second metal layer 20, for example, three resonant cavities, and the second metal layer 20 and the resonant cavity
  • the positions corresponding to the cavities are respectively provided with slots 21, which can realize the flexible layout of multiple antennas.
  • the second metal layer 20 can be rectangular, and the four shielding cases 10 can be respectively located at the corners of the second metal layer 20, by Three resonant cavities are formed between the first metal layer 11 and the second metal layer 20 on the 10, and slots 21 can be provided on the second metal layer 20 corresponding to each resonant cavity to realize flexible layout of multiple antennas.
  • the electronic device may further include: a feeding structure 40 for feeding the resonant cavity.
  • the feed structure 40 can include a coaxial line, through which the resonant cavity can be fed, one end of the coaxial line can be connected to the baseband and the radio frequency module 61, and the inner core of the other end of the coaxial line can be connected to the slot 21 On one side of the slot 21, the outer ground layer can be connected to the other side of the slot 21.
  • the slot 21 of the resonant cavity antenna can be fed through the flexible circuit board 51 for coupling and feeding, and can be fed through the flexible circuit board 51 for the second metal layer 20 to be coupled and fed.
  • the coaxial line in the feed structure 40 can be connected to the flexible circuit board 51, and the end of the flexible circuit board 51 can be electrically connected to one end of the tuning element 50, and the other end of the tuning element 50 is connected to the slot 21.
  • the electronic device may further include: a tuning element 50 , and the feeding structure 40 feeds power to the resonant cavity through the tuning element 50 .
  • the tuning element may include an electronic element, the electronic element may be a capacitor, an inductance or a switching device, and the number of the electronic element is not less than 2.
  • the tuning element can realize multi-frequency tuning and optimize the antenna impedance.
  • the electronic device may further include: a main board 60 , and the shielding case 10 may be disposed on the main board 60 .
  • the shielding cover 10 can be welded on the main ground layer of the main board 60 , and can perform electromagnetic shielding on the chip modules or discrete power amplifier devices on the main board 60 .
  • the first metal layer 11 may be located on the top of the shield 10 , that is, on the side away from the main board.
  • the electronic device may further include: a first antenna 70 , and the first antenna 70 may be disposed on the second metal layer 20 .
  • the shielding cover 10 can be located in the middle of the main board 60, which can be the position of the chip shielding cover. Since the radiation aperture (slot) is on the edge of the second metal layer 20, the actual occupied space is very small, and it can be considered that the entire structure is reused.
  • the second metal layer 20 can also be used as a bracket, and the second metal layer 20 can be used as a bracket for the first antenna 70, and the first antenna 70 can include at least one of a UWB antenna, an NFC antenna, and a millimeter wave antenna. In this way, an additional antenna can be provided in the restricted area of the conventional antenna design, thereby improving the space utilization rate.
  • the electronic device may further include: a second antenna 80 , and the second antenna 80 may be disposed at an edge area of the electronic device.
  • the second antenna 80 may include an antenna below the 6GHz frequency band such as a cellular antenna and a WIFI antenna, and is arranged at an edge of the electronic device to facilitate radiation and improve antenna performance.
  • the electronic device may further include a flexible circuit board 81 , for example, the second antenna 80 may be fed with power through the flexible circuit board 81 .
  • the electronic device can further include: a battery 90 and a back cover, the battery 90 and the back cover can be arranged at intervals along the thickness direction of the battery 90, and a second battery can be arranged between the battery 90 and the back cover.
  • the second resonant cavity antenna can use the metal layer on the battery 90 to form the second resonant cavity antenna, which can make full use of the space between the battery 90 and the back cover, improve the space utilization rate, increase the number of antennas at the same time, and enhance the performance of the overall antenna. performance.
  • the electronic device may further include: a display screen and a frame body, the display screen may be arranged on the frame body, a third resonant cavity antenna may be provided between the display screen and the frame body, and the display screen and the frame body may be fully utilized.
  • the space between the frames improves the space utilization rate, increases the number of antennas, and enhances the performance of the overall antenna.

Abstract

本申请公开了一种电子设备，包括：屏蔽罩，屏蔽罩具有第一金属层；第二金属层与第一金属层间隔设置，第二金属层上具有槽缝，第二金属层设置于屏蔽罩外；金属件设置于第一金属层与第二金属层之间，且金属件围成谐振腔，金属件分别和第一金属层与第二金属层电连接，第一金属层与第二金属层构成第一谐振腔天线，馈电结构用于为谐振腔馈电。

Description

电子设备
相关申请的交叉引用
本申请主张在2021年10月20日在中国提交的中国专利申请No.202111220072.3的优先权，其全部内容通过引用包含于此。
技术领域
本申请属于终端技术领域，具体涉及一种电子设备。
背景技术
相关技术中，第五代移动通信(5th Generation，5G)移动终端上的天线数量和天线频段越来越多，将天线布局在四周已经显得过于拥挤，天线之间也产生了很多隔离度相关的问题，直接影响了天线的性能，因此，在整机空间不变的情况下，充分利用空间尤为重要。通常情况下，屏蔽罩只作为单独的屏蔽结构使用，屏蔽罩上方的空间无法利用，使得整机空间不能充分利用。
发明内容
本申请实施例的目的是提供一种电子设备，用以解决屏蔽罩上方的空间不能被天线充分利用的问题。
本申请实施例提供一种电子设备，包括：
屏蔽罩，所述屏蔽罩具有第一金属层；
第二金属层，所述第二金属层与所述第一金属层间隔设置，所述第二金属层上具有槽缝，所述第二金属层设置于所述屏蔽罩外；
金属件，所述金属件设置于所述第一金属层与所述第二金属层之间，且所述金属件围成谐振腔，所述金属件分别和所述第一金属层与所述第二金属层电连接，所述第一金属层与所述第二金属层构成第一谐振腔天线；
馈电结构，所述馈电结构用于为所述谐振腔馈电。
可选地，所述金属件沿所述第二金属层的周向延伸；或者
所述金属件具有多个，多个所述金属件沿所述第二金属层的周向间隔设置。
可选地，所述金属件包括：
第一金属件，所述第一金属件分别和所述第一金属层与所述第二金属层电连接，所述第一金属件沿所述第二金属层的周向设置且围成第一谐振腔；
第二金属件，所述第二金属件分别和所述第一金属层与所述第二金属层电连接，所述第二金属件沿所述第二金属层的周向设置且围成第二谐振腔，所述第二谐振腔位于所述第一谐振腔内。
可选地，所述第二金属件具有多个，所述槽缝的两侧分别分布有所述第二金属件。
可选地，所述第一金属层与所述第二金属层之间填充有介质层。
可选地，所述第二金属层上具有多条所述槽缝，多条所述槽缝间隔分布；和/或
所述槽缝为长条形、弧形、环形或L形；和/或
所述槽缝位于所述第二金属层的边缘区域；和/或
所述谐振腔为圆柱状、椭圆柱状或多边体状。
可选地，所述槽缝的长度为射频信号在所述槽缝内的介质中的工作波长的一半。
可选地，所述槽缝为长条状，所述槽缝的长度与所述槽缝的宽度之比大于或等于10。
可选地，所述槽缝由所述第二金属层的一侧边沿向内延伸并从所述第二金属层的另一侧边沿穿出。
可选地，还包括：
第三金属层，所述第三金属层设置于所述第一金属层与所述第二金属层之间且位于所述谐振腔中，所述第三金属层分别和所述第一金属层与所述第二金属层间隔开，所述第三金属层的边沿与所述金属件电连接。
可选地，所述金属件沿所述第二金属层的周向延伸，所述第三金属层为 矩形状，所述第三金属层的相邻的两条边沿均与所述金属件电连接。
可选地，所述屏蔽罩具有多个，所述第二金属层具有多个，每个所述屏蔽罩的第一金属层分别与对应的一个所述第二金属层构成第一谐振腔天线。
可选地，所述屏蔽罩具有多个，所述第二金属层具有一个，多个所述屏蔽罩上的第一金属层均与所述第二金属层对应设置构成第一谐振腔天线。
可选地，所述第一金属层与所述第二金属层之间形成有多个所述谐振腔，所述第二金属层上与所述谐振腔对应的位置分别设有所述槽缝。
可选地，还包括：馈电结构，所述馈电结构用于为所述谐振腔馈电。
可选地，还包括：调谐元件，所述馈电结构通过所述调谐元件为所述谐振腔馈电。
可选地，还包括：主板，所述屏蔽罩设置于所述主板上。
可选地，还包括：第一天线，所述第一天线设置于所述第二金属层上。
可选地，还包括：第二天线，所述第二天线设置于所述电子设备的边缘区域。
可选地，还包括：电池和背盖，所述电池与所述背盖沿所述电池的厚度方向间隔设置，所述电池与所述背盖之间设有第二谐振腔天线。
可选地，还包括：显示屏与框体，所述显示屏设置于所述框体上，所述显示屏与所述框体之间设有第三谐振腔天线。
本申请实施例中的电子设备，包括：屏蔽罩，所述屏蔽罩具有第一金属层；第二金属层，所述第二金属层与所述第一金属层间隔设置，所述第二金属层上具有槽缝，所述第二金属层设置于所述屏蔽罩外；金属件，所述金属件设置于所述第一金属层与所述第二金属层之间，且所述金属件围成谐振腔，所述金属件分别和所述第一金属层与所述第二金属层电连接，所述第一金属层与所述第二金属层构成第一谐振腔天线；馈电结构，所述馈电结构用于为所述谐振腔馈电。在本申请实施例的电子设备中，在屏蔽罩的第一金属层与第二金属层之间设置金属件，所述金属件围成谐振腔，在所述第二金属层上设置槽缝，让所述第一金属层与所述第二金属层构成第一谐振腔天线，可以实现在屏蔽罩的上方设置高辐射效率的天线，利用屏蔽罩上方空间做出额外 的高性能的天线，充分利用屏蔽罩上方的空间，屏蔽罩中的第一金属层作为第一谐振腔天线的一部分，屏蔽罩和谐振腔天线一体化，结构一致性很好，谐振腔天线中的第二金属层的上边区域可以用作其他天线的支架，比如可以作为近场通信(Near Field Communication，NFC)、超宽带(Ultra Wide Band，UWB)或毫米波天线的支架，空间充分利用。
附图说明
图1a为本申请实施例中电子设备的一个结构示意图；
图1b为本申请实施例中电子设备的一个侧视图；
图1c为本申请实施例中电子设备的另一个结构示意图；
图1d为本申请实施例中电子设备的另一个侧视图；
图2a为谐振腔的一个形状示意图；
图2b为谐振腔的另一个形状示意图；
图2c为谐振腔的又一个形状示意图；
图3为本申请实施例中电子设备的又一个结构示意图；
图4为填充介质层的一个示意图；
图5a为设置第三金属层的一个示意图；
图5b为设置第三金属层的另一个示意图；
图6a为金属件非封闭时的一个示意图；
图6b为槽缝穿出时的一个示意图；
图7a为槽缝的一种设置示意图；
图7b为槽缝的另一种设置示意图；
图7c为槽缝的又一种设置示意图；
图8为调谐元件与馈电结构连接的一个示意图；
图9a为多个屏蔽罩时的一个示意图；
图9b为多个屏蔽罩时的另一个示意图；
图9c为多个屏蔽罩时的又一个示意图；
图9d为多个屏蔽罩时的又一个示意图；
图10为本申请实施例中电子设备的又一个结构示意图。
附图标记
屏蔽罩10；第一金属层11；介质层12；
第二金属层20；槽缝21；
金属件30；第二金属件32；第三金属层33；
馈电结构40；柔性电路板51；
调谐元件50；主板60；射频模组61；
第一天线70；第二天线80；柔性电路板81；
电池90。
具体实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
本申请的说明书和权利要求书中的术语“第一”、“第二”等是用于区别类似的对象，而不用于描述特定的顺序或先后次序。应该理解这样使用的数据在适当情况下可以互换，以便本申请的实施例能够以除了在这里图示或描述的那些以外的顺序实施。此外，说明书以及权利要求中“和/或”表示所连接对象的至少其中之一，字符“/”，一般表示前后关联对象是一种“或”的关系。
下面结合附图1a至图10所示，通过具体的实施例及其应用场景对本申请实施例提供的电子设备进行详细地说明。
如图1a至图10所示，本申请实施例中的电子设备，包括：屏蔽罩10、第二金属层20、金属件30和馈电结构40，其中，屏蔽罩10具有第一金属层 11，第一金属层11可以包括屏蔽罩10的至少一个表面，屏蔽罩10可以焊接在主板的主地层上，可以对主板上的芯片模组或离散的功放器件等进行电磁屏蔽，具有屏蔽的作用。第一金属层11可以位于屏蔽罩10的顶部，也即是远离主板的一侧。
第二金属层20与第一金属层11可以间隔设置，第二金属层20与第一金属层11可以平行设置，第二金属层20的厚度可以为0.5mm-2mm。第二金属层20设置于屏蔽罩10外，第二金属层20上可以具有槽缝21，槽缝21的数量可以为一条或多条，槽缝21的数量、形状和位置可以根据实际情况选择。金属件30可以设置于第一金属层11与第二金属层20之间，金属件30可以围成谐振腔，槽缝21可以设置于第二金属层20上与谐振腔对应的位置，金属件30可以沿着第二金属层20的周向延伸，金属件30可以沿着第二金属层20的边缘区域延伸，金属件30可以为圆环状或弧状，金属件30可以分别和第一金属层11与第二金属层20电连接，第一金属层11与第二金属层20可以构成第一谐振腔天线，馈电结构40可以用于为谐振腔馈电，可以通过馈电结构40为谐振腔馈入信号，射频信号可以经过谐振腔的谐振之后从槽缝21辐射，在屏蔽罩10的上方可以实现高辐射效率的天线。
在本申请实施例的电子设备中，在屏蔽罩10的第一金属层11与第二金属层20之间设置金属件30，金属件30可以围成谐振腔，在第二金属层20上设置槽缝21，让第一金属层11与第二金属层20构成第一谐振腔天线，可以实现在屏蔽罩10的上方设置高辐射效率的天线，利用屏蔽罩10上方空间做出额外的高性能的天线，充分利用屏蔽罩10上方的空间，屏蔽罩10中的第一金属层11作为第一谐振腔天线的一部分，屏蔽罩10和谐振腔天线一体化，结构一致性很好，谐振腔天线中的第二金属层20的上边区域可以用作其他天线的支架，比如可以作为近场通信(NFC)天线、超宽带通信(UWB)天线或毫米波天线的支架，空间充分利用。在屏蔽罩10的附近(0净空，低剖面)实现谐振腔天线，可以具有很高的辐射性能，充分利用了整机空间，实现更多的天线。
在一些实施例中，如图1b所示，金属件30可以沿第二金属层20的周向延伸，金属件30可以位于第一金属层11与第二金属层20的边缘区域，金属件30可以为圆环状、弧状，通过第一金属层11与第二金属层20之间的金属件30可以围成谐振腔，谐振腔可以为圆柱状、长方体状或正方体状。如图1d所示，金属件30可以具有多个，金属件30可以为柱状或弧状，多个金属件30可以沿第二金属层20的周向间隔设置，可以均匀间隔设置，通过多个金属件30可以围成谐振腔。金属件30可以是非封闭的环形金属片，如图6a中虚线a所示，可以在部分面上开口，以实现天线的模式调控。
第一金属层11、第二金属层20和金属件30可以不是一体成型的，金属件30可以为金属弹脚或螺钉柱，第一金属层11与第二金属层20可以是两个分立的结构件，可根据实际调试情况灵活调整弹脚的位置，控制谐振腔天线的谐振频率，调试周期短且高效，避免了天线结构一体化造成的调试不便，更改的时候需要整体替换以及打样周期长的问题。
在另一些实施例中，如图3所示，金属件30可以包括：第一金属件和第二金属件32，第一金属件可以分别和第一金属层11与第二金属层20电连接，第一金属件可以沿第二金属层20的周向设置且围成第一谐振腔。第一金属件可以沿第二金属层20的周向延伸，第一金属件可以位于第一金属层11与第二金属层20的边缘区域，第一金属件可以为圆环状、弧状，通过第一金属层11与第二金属层20之间的第一金属件可以围成第一谐振腔，第一谐振腔可以为圆柱状、长方体状或正方体状。第一金属件可以具有多个，第一金属件可以为柱状或弧状，多个第一金属件可以沿第二金属层20的周向间隔设置，可以均匀间隔设置，通过多个第一金属件可以围成第一谐振腔。
第二金属件32分别和第一金属层11与第二金属层20电连接，第二金属件32沿第二金属层20的周向设置且围成第二谐振腔，所述第二谐振腔位于所述第一谐振腔内。第二金属件32可以沿第二金属层20的周向延伸，第二金属件32可以为圆环状、弧状，通过第一金属层11与第二金属层20之间的第二金属件32可以围成第二谐振腔，第二谐振腔可以为圆柱状、长方体状或 正方体状。第二金属件32可以具有多个，第二金属件32可以为柱状或弧状，多个第二金属件32可以沿第二金属层20的周向间隔设置，可以均匀间隔设置，通过多个第二金属件32可以围成第二谐振腔，通过第一谐振腔与第二谐振腔可以激励起多种高次模式，扩宽天线覆盖的频段。
在本申请的实施例中，第二金属件32可以具有多个，槽缝21的两侧可以分别分布有第二金属件32。第二金属件32可以为弹片或者金属柱体，第二金属件32连接第一金属层11与第二金属层20，可以实现天线模式控制，实现宽频覆盖。第二金属件32分布于槽缝21的两侧，可以使天线激励起多种高次模式，扩宽天线覆盖的频段。
在一些实施例中，如图4所示，第一金属层11与第二金属层20之间填充有介质层12。可以在谐振腔内部填充或局部填充介质层12，用以降低天线谐振频率，减小腔体所需长宽尺寸。可选地，介质层12的损耗正切因子可以小于0.005。
在本申请的实施例中，如图9d所示，第二金属层20上可以具有多条槽缝21，多条槽缝21可以间隔分布，具体间隔距离可以根据实际选择。
可选地，如图7a至图7c所示，槽缝21可以为长条形、弧形、环形或L形，可以多条槽缝21交叉形成交叉状的槽缝，比如，如图7a所示，两条长条形的槽缝21交叉形成十字交叉状，具体可以根据实际情况选择。槽缝21作为天线的辐射口径，槽缝21的形状也不限于上述形状。
可选地，槽缝21可以位于第二金属层20的边缘区域，便于天线的辐射，第二金属层20的中部区域便于设置其他天线，比如可以留出中部区域给UWB或毫米波天线使用，布局更为合理。
可选地，如图2a至图2c所示，谐振腔可以为圆柱状、椭圆柱状或多边体状，谐振腔还可以为弧线和直线构成的其他形状的腔体，比如，谐振腔可以为长方体状或正方体状，具体的可以根据实际情况选择，可以依据实际天线模式、带宽等需要进行相应设计调整。
在一些实施例中，槽缝21的长度可以为射频信号在槽缝21内的介质中 的工作波长的一半。
可选地，槽缝21为长条状，槽缝21的长度与槽缝21的宽度之比可以大于或等于10。
可选地，如图6b所示，槽缝21可以由第二金属层20的一侧边沿向内延伸并从第二金属层20的另一侧边沿穿出。第二金属层20的开槽部分可以延伸到边沿，可以把第二金属层20分开成两部分，使得谐振腔分为两个半腔，这两个半腔的尺寸可以相等或不等，可以实现多频谐振，可以起到天线阻抗调谐作用。
在一些实施例中，如图5a至图5b所示，电子设备还可以包括：第三金属层33，第三金属层33可以设置于第一金属层11与第二金属层20之间，且第三金属层33位于谐振腔中，第三金属层33可以分别和第一金属层11与第二金属层20间隔开，第三金属层33可以分别和第一金属层11与第二金属层20平行，第三金属层33的边沿可以与金属件30电连接。其中，金属件30可以沿第二金属层20的周向延伸，第三金属层33可以为矩形状，第一金属层11、第二金属层20与第三金属层33可以均为矩形状，谐振腔可以为长方体状，第三金属层33的相邻的两条边沿可以均与金属件30电连接，第三金属层33的相邻的另外两条边沿均不与金属件30电连接，可以间隔开一定的间距。第三金属层33平行于第一金属层11、第二金属层20，且第三金属层33可以与谐振腔的两个立面连接，与另两个立面不连接，形成L形空腔部分。可以在谐振腔的内部增加一层第三金属层33，以实现折叠谐振腔，用以降低天线谐振频率，减小腔体所需长宽尺寸。
在一些实施例中，如图9c所示，屏蔽罩10可以具有多个，第二金属层20可以具有多个，每个屏蔽罩10的第一金属层11分别与对应的一个第二金属层20构成第一谐振腔天线。比如，屏蔽罩10可以具有四个，第二金属层20可以具有四个，每个屏蔽罩10的第一金属层11分别与对应的一个第二金属层20构成第一谐振腔天线，也即是构成四个第一谐振腔天线。在每个屏蔽罩10的第一金属层11与对应的第二金属层20之间设置金属件30，金属件 30可以围成谐振腔，在第二金属层20上设置槽缝21，让每个屏蔽罩10的第一金属层11与第二金属层20分别构成第一谐振腔天线，可以实现在屏蔽罩10的上方设置高辐射效率的天线。每个屏蔽罩10上方一体设计谐振腔天线，多个屏蔽罩10可以对应多个谐振腔天线，这些谐振腔天线可以工作在相同频段以实现多进多出(Multiple Input Multiple Output，MIMO)天线功能，或工作在不同频段以实现和其他类型天线构成分集或MIMO天线功能。
在另一些实施例中，如图9a和图9b所示，屏蔽罩10可以具有多个，比如四个，第二金属层20可以具有一个，多个屏蔽罩10上的第一金属层均与第二金属层20对应设置构成第一谐振腔天线。比如，屏蔽罩10具有四个，第二金属层20具有一个，第二金属层20可以为矩形状，四个屏蔽罩10可以分别位于第二金属层20的角部，四个屏蔽罩10上的第一金属层11均与第二金属层20对应设置构成第一谐振腔天线。
如图9a和图9b所示，多个屏蔽罩10上方的第一金属层11共同对应有一个大的第二金属层20，用以应对天线工作频率需要较低时候的情况。多个屏蔽罩10上方可以有金属件30，比如金属弹脚，通过金属件30可以与第二金属层20电连接构成一个第一谐振腔天线，用以应对天线工作频率需要较低时候的情况，这种实施方式调试相对更为灵活。金属件30可以为螺钉柱，可以通过锁螺钉方式使得屏蔽罩10上的第一金属层11和第二金属层20电连接。
在本申请的实施例中，如图9d所示，第一金属层11与第二金属层20之间可以形成有多个谐振腔，比如，三个谐振腔，第二金属层20上与谐振腔对应的位置分别设有槽缝21，可以实现多个天线灵活布局。多个屏蔽罩10上方可以有金属件30，金属件30可以为金属弹脚，通过弹脚的合理布局，使得第一金属层11与第二金属层20电连接，并分割构成不同的谐振腔，可以在第二金属层20上开3个槽缝21以分别对应谐振腔的天线辐射口径，实现多个天线灵活布局。比如，屏蔽罩10具有四个，第二金属层20具有一个，第二金属层20可以为矩形状，四个屏蔽罩10可以分别位于第二金属层20的角部，通过在四个屏蔽罩10上的第一金属层11与第二金属层20之间形成三 个谐振腔，第二金属层20上与每个谐振腔对应的位置可以设置槽缝21，实现多个天线灵活布局。
在一些实施例中，如图1a至图1d所示，电子设备还可以包括：馈电结构40，馈电结构40用于为所述谐振腔馈电。馈电结构40可以包括同轴线，通过一条同轴线可以给谐振腔馈电，同轴线的一端可以连接基带和射频模组61，同轴线的另一端的内芯可以连接槽缝21的一侧，外层接地层可以连接槽缝21的另一侧。
谐振腔天线的槽缝21可以通过柔性电路板51耦合馈入的方式进行馈电，可以通过柔性电路板51给第二金属层20耦合馈电的方式馈电。如图8所示，馈电结构40中的同轴线可以连接到柔性电路板51上，柔性电路板51的末端可以电连接在调谐元件50的一端，调谐元件50的另一端与槽缝21的一边相连，能多一个天线调控自由度，通过修改柔性电路板51的形状和电子元件的器件值，可以实现多频调谐，优化天线阻抗，调试更为灵活。
在一些实施例中，如图8所示，电子设备还可以包括：调谐元件50，馈电结构40通过调谐元件50为所述谐振腔馈电。调谐元件可以包括电子元件，电子元件可以为电容或电感或开关器件，电子元件的个数不小于2个，通过调谐元件可以实现多频调谐，优化天线阻抗。
可选地，如图1a、图1c和图10所示，电子设备还可以包括：主板60，屏蔽罩10可以设置于主板60上。屏蔽罩10可以焊接在主板60的主地层上，可以对主板60上的芯片模组或离散的功放器件等进行电磁屏蔽。第一金属层11可以位于屏蔽罩10的顶部，也即是远离主板的一侧。
在一些实施例中，如图10所示，电子设备还可以包括：第一天线70，第一天线70可以设置于第二金属层20上。屏蔽罩10可以位于主板60的中部，可以是芯片屏蔽罩所在位置，由于辐射口径(槽缝处)在第二金属层20的边缘，实际占用空间很小，可以认为复用了整个结构，同时，第二金属层20还可以作为支架使用，第二金属层20可以作为第一天线70的支架使用，第一天线70可以包括UWB天线、NFC天线以及毫米波天线中的至少一种。 如此，在常规天线设计的禁区可以额外设置了天线，提高了空间利用率。
在另一些实施例中，如图10所示，电子设备还可以包括：第二天线80，第二天线80可以设置于电子设备的边缘区域。第二天线80可以包括蜂窝(cellular)天线和WIFI天线等6GHz频段以下的天线，布局在电子设备的边缘位置便于辐射，提高天线性能。电子设备还可以包括柔性电路板81，比如，通过柔性电路板81可以为第二天线80进行馈电。
在一些实施例中，如图10所示，电子设备还可以包括：电池90和背盖，电池90与背盖可以沿电池90的厚度方向间隔设置，电池90与背盖之间可以设有第二谐振腔天线，可以利用电池90上的金属层来构成第二谐振腔天线，可以充分利用电池90和背盖之间的空间，提高了空间利用率，同时增加天线的数量，增强整体天线的性能。
在另一些实施例中，电子设备还可以包括：显示屏与框体，显示屏可以设置于框体上，显示屏与框体之间可以设有第三谐振腔天线，可以充分利用显示屏与框体之间的空间，提高了空间利用率，可以增加天线的数量，增强整体天线的性能。
上面结合附图对本申请的实施例进行了描述，但是本申请并不局限于上述的具体实施方式，上述的具体实施方式仅仅是示意性的，而不是限制性的，本领域的普通技术人员在本申请的启示下，在不脱离本申请宗旨和权利要求所保护的范围情况下，还可做出很多形式，均属于本申请的保护之内。

Claims (14)

  1. 一种电子设备，包括：
    屏蔽罩，所述屏蔽罩具有第一金属层；
    第二金属层，所述第二金属层与所述第一金属层间隔设置，所述第二金属层上具有槽缝，所述第二金属层设置于所述屏蔽罩外；
    金属件，所述金属件设置于所述第一金属层与所述第二金属层之间，且所述金属件围成谐振腔，所述金属件分别和所述第一金属层与所述第二金属层电连接，所述第一金属层与所述第二金属层构成第一谐振腔天线；
    馈电结构，所述馈电结构用于为所述谐振腔馈电。
  2. 根据权利要求1所述的电子设备，其中，所述金属件沿所述第二金属层的周向延伸；或者
    所述金属件具有多个，多个所述金属件沿所述第二金属层的周向间隔设置。
  3. 根据权利要求1所述的电子设备，其中，所述金属件包括：
    第一金属件，所述第一金属件分别和所述第一金属层与所述第二金属层电连接，所述第一金属件沿所述第二金属层的周向设置且围成第一谐振腔；
    第二金属件，所述第二金属件分别和所述第一金属层与所述第二金属层电连接，所述第二金属件沿所述第二金属层的周向设置且围成第二谐振腔，所述第二谐振腔位于所述第一谐振腔内。
  4. 根据权利要求3所述的电子设备，其中，所述第二金属件具有多个，所述槽缝的两侧分别分布有所述第二金属件。
  5. 根据权利要求1所述的电子设备，其中，所述第一金属层与所述第二金属层之间填充有介质层。
  6. 根据权利要求1所述的电子设备，其中，所述槽缝为长条状，所述槽缝的长度与所述槽缝的宽度之比大于或等于10。
  7. 根据权利要求1所述的电子设备，还包括：
    第三金属层，所述第三金属层设置于所述第一金属层与所述第二金属层之间且位于所述谐振腔中，所述第三金属层分别和所述第一金属层与所述第二金属层间隔开，所述第三金属层的边沿与所述金属件电连接。
  8. 根据权利要求7所述的电子设备，其中，所述金属件沿所述第二金属层的周向延伸，所述第三金属层为矩形状，所述第三金属层的相邻的两条边沿均与所述金属件电连接。
  9. 根据权利要求1所述的电子设备，其中，所述屏蔽罩具有多个，所述第二金属层具有多个，每个所述屏蔽罩的第一金属层分别与对应的一个所述第二金属层构成第一谐振腔天线。
  10. 根据权利要求1所述的电子设备，其中，所述屏蔽罩具有多个，所述第二金属层具有一个，多个所述屏蔽罩上的第一金属层均与所述第二金属层对应设置构成第一谐振腔天线。
  11. 根据权利要求1或10所述的电子设备，其中，所述第一金属层与所述第二金属层之间形成有多个所述谐振腔，所述第二金属层上与所述谐振腔对应的位置分别设有所述槽缝。
  12. 根据权利要求1所述的电子设备，还包括：
    调谐元件，所述馈电结构通过所述调谐元件为所述谐振腔馈电。
  13. 根据权利要求1所述的电子设备，还包括：
    主板，所述屏蔽罩设置于所述主板上。
  14. 根据权利要求1所述的电子设备，还包括：
    第一天线，所述第一天线设置于所述第二金属层上。
PCT/CN2022/125923 2021-10-20 2022-10-18 电子设备 WO2023066249A1 (zh)

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140125528A1 (en) * 2012-11-08 2014-05-08 Htc Corporation Mobile device and antenna structure
CN105449355A (zh) * 2015-12-26 2016-03-30 昆山联滔电子有限公司 天线装置
CN110544822A (zh) * 2018-11-16 2019-12-06 西安电子科技大学 基于SIW结构的Ka波段小型化滤波天线
CN112993579A (zh) * 2021-02-08 2021-06-18 Oppo广东移动通信有限公司 天线装置及电子设备
CN113054425A (zh) * 2021-03-17 2021-06-29 东南大学 一种毫米波双频双极化滤波天线
CN113964483A (zh) * 2021-10-20 2022-01-21 维沃移动通信有限公司 电子设备

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140125528A1 (en) * 2012-11-08 2014-05-08 Htc Corporation Mobile device and antenna structure
CN105449355A (zh) * 2015-12-26 2016-03-30 昆山联滔电子有限公司 天线装置
CN110544822A (zh) * 2018-11-16 2019-12-06 西安电子科技大学 基于SIW结构的Ka波段小型化滤波天线
CN112993579A (zh) * 2021-02-08 2021-06-18 Oppo广东移动通信有限公司 天线装置及电子设备
CN113054425A (zh) * 2021-03-17 2021-06-29 东南大学 一种毫米波双频双极化滤波天线
CN113964483A (zh) * 2021-10-20 2022-01-21 维沃移动通信有限公司 电子设备

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