WO2023058049A1

WO2023058049A1 - Instrument cluster

Info

Publication number: WO2023058049A1
Application number: PCT/IN2022/050862
Authority: WO
Inventors: Vaishnavee S; Senthilnathan SUBBIAH; Samraj Jabez Dhinagar
Original assignee: Tvs Motor Company Limited
Priority date: 2021-10-06
Filing date: 2022-09-27
Publication date: 2023-04-13

Abstract

The present invention relates to an instrument cluster (100) for a motor vehicle. The instrument cluster (100) comprises an electronic component module (102) having a first surface (114) and a second surface (116), and a processing element (104) secured to the second surface (116) of the electronic component module (102) and protruding therefrom. The instrument cluster (100) further comprises an electronic component module housing (302) that accommodates the electronic component module (102). The instrument cluster (100) also comprises a sheet-metal assembly (118) to mount the electronic component module (102) to the electronic component module housing (302). The sheet-metal assembly (118) of the present invention, therefore, acts as a common part that may be utilized for absorbing vibration in an instrument cluster as well as heat management therein.

Description

INSTRUMENT CLUSTER

BACKGROUND

[0001] A motor vehicle may be provided with a front-mounted instrument cluster including multiple dials. The instrument cluster may display, by using for example a thin-film-transistor (TFT) display, necessary information that may be useful for an operator to know while driving the vehicle. The displayed information may be operational information, such as fuel level, vehicle speed, and engine revolution per minute. Instrument clusters are usually mounted in between the steering handle of the vehicle so that the display of the instrument cluster is in the field of view of the vehicle operator, and it is convenient for the vehicle operator to view the information on the instrument cluster.

BRIEF DESCRIPTION OF DRAWINGS

[0002] The following detailed description references the drawings, wherein: [0003] Figure 1 illustrates an exploded perspective view of an instrument cluster, in accordance with an example implementation of the present subject matter;

[0004] Figure 2 illustrates a perspective view of a metal plate of the instrument cluster, in accordance with an example implementation of the present subject matter; and

[0005] Figure 3 illustrates a cross-sectional top view of the instrument cluster, in accordance with an example implementation of the present subject matter;

[0006] Throughout the drawings, identical reference numbers designate similar, but not necessarily identical, elements. The figures are not necessarily to scale, and the size of some parts may be exaggerated to more clearly illustrate the example shown. Moreover, the drawings provide examples and/or implementations consistent with the description; however, the description is not limited to the examples and/or implementations provided in the drawings.

DETAILED DESCRIPTION

[0007] The present invention relates generally to a motor vehicle, and more particularly, to an instrument cluster for the motor vehicle.

[0008] Traditional analog instrument clusters of vehicles are being replaced by electronic instrument clusters which are able to provide more information to an operator and also have the flexibility to change the information that is to be displayed. For example, few instrument clusters may even have communication capability.

[0009] Such instrument clusters, also referred to as smart instrument clusters, apart from displaying the basic details mentioned above, may also display a variety of other information, for example, menus for telephone, telematic services, multi-media applications, etc., and are added with more complex feature gauges, such as turn indicators, gearshift position, low oil pressure, low tire pressure, light controls, automotive navigations system, etc. [0010] Such electronic instrument cluster may form a considerably complex automotive-grade system that may include, but is not limited to, a thin-film- transistor (TFT) display, a cover lens, a touch screen, a backlight, and other electronic components, such as a microcontroller and resistors. These components are generally soldered onto an electronic component module, also known as a printed circuit board (PCB), to both electrically connect and mechanically fasten the other electronic components to the electronic component module. Further, the electronic component module may be responsible for facilitating the display of various vehicle parameters through the TFT display screen by converting various inputs into a digital display. [0011] The electronic component modules used in conventionally available instrument clusters are comparatively lighter in weight, and therefore, are subjected to various vibrations during the operation of the vehicle. The vibrations may originate from an engine, a transmission, or any other part of the vehicle. Furthermore, the vibrations may also result from a surface of the road. For instance, the vibrations may be temperature variations. The temperature vibrations may cause vibration issues, either from the extreme change in temperature between winter or summer seasons, as well as fluctuations in temperature which occur over time. Over time, these various vibrations may bring about noise, vibration, and harshness (NVH) issues, such as a buzz, speak, and/or rattling noises, during the operation of the vehicle. The NVH issues are typically considered undesirable for vehicles. Such rattling may lead to greater wear and tear and, in certain cases, even damage components that are rattling and may lead to high maintenance costs for the vehicle.

[0012] Additionally, components, such as a processing element, which is directly soldered onto the electronic component module may get heated during the operation of the instrument cluster. The heat generated then may be transferred from and to the electronic component module by conduction through component leads i.e. , between components through air by convection or simply by radiation without any medium. High temperatures may alter the structure of the electronic component module and diminish its performance or may cause it to break down. Also, high temperatures do not remain localized, but may spread to other components of the electronic component module and may cause a cascade of malfunctions and damage. In some cases, heating of the electronic component module beyond a certain limit may also lead to soldering failure and subsequent failure of the instrument cluster. [0013] Examples of an instrument cluster of a motor vehicle are described herein that enable absorption of vibration as well as heat dissipation from the instrument cluster.

[0014] In one embodiment, the instrument cluster includes an electronic component module. The electronic component module has a first surface and a second surface. The electronic component module also has a processing element that may be mounted towards the second surface of the electronic component module and may protrude therefrom. The instrument cluster may further include an electronic component module housing that may enclose the electronic component module. The instrument cluster may also have a sheetmetal assembly that may mount the electronic component module to the electronic component module housing, for absorbing impact to the electronic component module and improving heat dissipation.

[0015] In one embodiment, the sheet-metal assembly may include a metal plate having a heat transfer region and that is substantially of the same size as the processing element. In an assembled state, the heat transfer region of the metal plate abuts to the processing element. The sheet-metal assembly may also include a conductive sheet that may be sandwiched between the processing element and the heat transfer region of the metal plate. The sheetmetal assembly may be disposed between the electronic component module and the electronic component module housing.

[0016] Thus, the conductive sheet which may be introduced between the processing element and the metal plate, may ensure proper contact amongst them and may act as a damper to withstand vibration. Furthermore, as the processing element may generate heat over a period of its operation, the conductive sheet may transfer the heat from the heat-generating surface of the processing element to the metal plate. The metal plate may be provided with a plurality of pocketed fins which may increase its surface area, thereby improving the heat dissipation over the surface of the entire metal plate.

[0017] Accordingly, proper heat dissipation through the metal plate may prevent any failure of the electronic component module from vibration and heat. The sheet-metal assembly of the present invention, therefore, acts as a common part that may be utilized for absorbing vibration in an instrument cluster as well as for heat management therein.

[0018] The above-described instrument cluster is further described with reference to Figures 1 to 3. It should be noted that the description and figures merely illustrate the principles of the present subject matter along with examples described herein and should not be construed as a limitation to the present subject matter. It is thus noted that various arrangements may be devised that, although not explicitly described or shown herein, describe the principles of the present subject matter. Moreover, all statements herein reciting principles, aspects, and examples of the present subject matter, as well as specific examples thereof, are intended to encompass equivalents thereof. [0019] Figure 1 illustrates an exploded perspective view of an instrument cluster 100, in accordance with an implementation of the present subject matter. The instrument cluster 100 may be implemented in different types of motor vehicles, such as cars, trucks, vans, sport utility vehicles, all-terrain vehicles, snowmobiles, two-wheelers, buses, semi-trucks, and the like.

[0020] The instrument cluster 100 may have an electronic component module 102 that may have a first surface 114 and a second surface 116. The instrument cluster 100 may further include a processing element 104 that may be mounted on the second surface 116 of the electronic component module 102 and may protrude therefrom.

[0021] As may be understood, the electronic component module 102 may include other electronic components as well, such as a thin-film-transistor (TFT) display for displaying a plurality of vehicle parameters like vehicle status, mobile (communication device) status, and navigation instructions, etc; tell-tale indicators such as turn-signal indications; high beam indication, driving mode indication, etc., which may be electrically connected to the electronic component module 102. In an example embodiment of the present subject matter, the processing element 104 may govern the function of the instrument cluster 100. The processing element 104 may also decide on the alerts and notifications to be displayed on the TFT display of the instrument cluster 100.

[0022] The instrument cluster 100 also includes an electronic component module housing (not shown) that may accommodate the electronic component module 102. The electronic component module housing may have a front cover 110 and a back cover 112. In an example, both the front cover 110 and the back cover 112 of the electronic component module housing may be interconnected by at least one of a strut, a pin, a rivet, a clamp, or a threaded fastener.

[0023] Furthermore, the instrument cluster 100 may be provided with a sheetmetal assembly 118 that may be positioned to abut against the plurality of heatgenerating electronic elements and may be advantageous in absorbing impact to the electronic component module 102 and managing heat that may be generated by the electronic components mounted on the second surface 116 of the electronic component module 102. As shown in Figure 1 , the sheet-metal assembly 118 has a thin metal plate 106 and a conductive sheet 108. The sheet-metal assembly 118 may be disposed between the electronic component module 102 and the back cover 112 of the electronic component module housing. The front cover 110 and the back cover 112 of the electronic component module housing may hold the electronic component module 102 and the metal plate 106 therebetween. In an example, the conductive sheet 108 may be pasted on a heatgenerating portion 120 of the processing element 104 through an adhesive that may be a thermally conductive paste or liquid. [0024] Figure 2 illustrates a perspective view of the metal plate 106 of the instrument cluster 100, in accordance with an implementation of the present subject matter. As shown in Figure 2, the metal plate 106 has a heat transfer region 202 that is substantially the same size as the processing element 104. In an example embodiment, the conductive sheet 108, which is interposed between the processing element 104 and heat transfer region 202 of the metal plate 106, may also be the same as the processing element 104.

[0025] In an assembled state of the instrument cluster 100, the heat transfer region 202 of the metal plate 106 abuts to the processing element 104 with the conductive sheet 108 interposed therebetween. As shown in Figure 2, the heat transfer region 202 of the metal plate 106 is provided with a protruding portion having a plurality of pocketed fins 204. The pocketed fins 204, in an example, may be in a straight or square type arrangement that runs the length of the metal plate 106 which faces the heat generating portion 120 of the processing element 104. In another example, the pocketed fins 204 may be of other shapes as well and run through the entire length of the metal plate 106. The plurality of pocketed fins 204 may increase the surface area of the metal plate 106, thereby improving the heat dissipation over the surface of the entire metal plate 106.

[0026] In an embodiment, the metal plate 106 may be made of metals of different compositions such as, for instance, the metal plate 106 may be made up of silver-plated copper plate, including lamination of a copper plate, and an aluminum plate, or the like. In another embodiment, the conductive sheet 108 may have high thermal conductivity in the direction perpendicular to the sheet plane and may be suitable for transferring heat generated from the processing element 104 to the metal plate 106. The metal plate 106 may carry away the heat generated by the processing element 104 on the heat generating portion 120 and may discharge the heat from its surface by utilizing the temperature difference with outside air, thereby protecting the processing element 104 and in turn, the electronic component module 102 from overheating.

[0027] A person skilled in the art would understand that the conductive sheet 108 may be manufactured by any of the known manufacturing methods. For example, the conductive sheet 108 may be manufactured by coating moulding and wound into a roll even with the use of an inexpensive aspherical heat conductive filler, and has high heat conductivity, low thermal contact resistance, and high insulating properties.

[0028] Figure 3 illustrates a cross-sectional top view of the instrument cluster 100, in accordance with an implementation of the present subject matter. The instrument cluster 100 may be provided with an electronic component module housing 302 that may act as a protection cover to enclose the electronic component module 102 and its components from environmental effects like dust and water, in accordance with one implementation of the present subject matter. The electronic component module housing 302 is similar to the electronic component module housing discussed above in reference to Figures 1 and 2. [0029] In an example, the metal plate 106 may be secured to the back cover 112 of the electronic component module housing 302 via fasteners. For example, M 2.5 type of fasteners may be used for mounting the metal plate 106 on the back cover 112. Further, the electronic component module 102 may be secured to the front cover 110 of the electronic component module housing 302 by the combination of multiple factors. For example, high tolerance mounting holes may be used for mounting the electronic component module 102 to the front cover 110 to make sure the electronic component module 102 is not mounted with an offset. The back cover 112 of the electronic component module housing 302 may have a recessed cavity 300 to allow a vehicle connector (not shown), that may be mounted to the electronic component module 102, to pass through it. The vehicle connector may be configured for connecting to a power source for the operation of the instrument cluster 100.

[0030] Although examples for the present disclosure have been described in language specific to structural features and/or methods, it should be understood that the appended claims are not necessarily limited to the specific features or methods described. Rather, the specific features and methods are disclosed and explained as examples of the present disclosure.

Claims

l/We Claim:

1 . An instrument cluster (100) comprising: an electronic component module (102) comprising a first surface (114) and a second surface (116), and a processing element (104) secured to the second surface (116) of the electronic component module (102) and protruding therefrom; an electronic component module housing (302) to accommodate the electronic component module (102); and a sheet-metal assembly (118) to mount the electronic component module (102) to the electronic component module housing (302), the sheet-metal assembly (118) comprising: a metal plate (106) having a heat transfer region (202) being substantially of the same size as the processing element (104) to abut thereto in an assembled state; and a conductive sheet (108) interposed between the processing element (104) and heat transfer region (202) of the metal plate (106), wherein the sheet-metal assembly (118) is disposed between the electronic component module (102) and the electronic component module housing (302).

2. The instrument cluster (100) as claimed in claim 1 , wherein the electronic component module housing (302) comprises: a front cover (110); and a back cover (112) to couple to the front cover (110), io wherein the front cover (110) and the back cover (112) are to hold the electronic component module (102) and the metal plate (106) therebetween.

3. The instrument cluster (100) as claimed in claim 2, wherein the sheetmetal assembly (118) is sandwiched between the second surface (116) of the electronic component module (102) and the back cover (112) of the electronic component module housing (302).

4. The instrument cluster (100) as claimed in claim 1 , wherein the heat transfer region (202) of the metal plate (106) is formed as a protruded portion having a plurality of pocketed fins (204).

5. The instrument cluster (100) as claimed in the claim 1 , wherein the second surface (116) of the electronic component module (102) bears a plurality of heat-generating electronic elements, the sheet-metal assembly (118) being positioned to abut against the plurality of heat-generating electronic elements.